Dear Friends,

Efficient design starts with choosing the right active and passive components. Sintering technology is approved for the most demanding applications. To increase efficiency new semiconductors are on the move to become standards for switching devices. We are looking forward to usage of sintering technology.

Best regards,

Bodo Arlt

Argomax(TM) Newsletter #10

As you know, our Singapore manufacturing plant, a new state-of-the-art facility, is up and running to produce the entire line of Argomax products, from paste in jars and syringes to film in sheets or rolls.

The entire facility was designed to ensure high volume capability, with adherence to world class quality standards and rapid response to your production requirements.

"The Alpha Product Quality Planning (APQP) Model was integrated from the inception of Argomax(TM) through the development of the complete line of Argomax products. As part of the APQP, the Plan-Do-Check-Act cycle was a critical tool used during the entire process," said Dr. Nicholas M. Banis, VP Global Quality Assurance.

With direct input from the voice of the customer, the Design Failure Mode and Effects Analysis (DFMEA) allowed us to develop processes and controls to ensure that you receive the most advanced sintering technology each time.

Our customers, the major electronics manufacturers throughout the world, know the high level of quality we engineer into each Argomax(TM) product ensuring consistent performance every time. As a result, ALPHA Argomax(TM) sintering technology is approved for the most demanding applications such as automotive. Indeed, automotive companies have already recognized the value of Argomax(TM) for high performance and high yield as presented at CESA Automotive Electronics Congress in December of this year in Paris. More details will come in the January Bodo's release.

Argomax(TM) offers: sintering in seconds for increased throughput, low pressure to protect your valuable components, high reliability for your power devices and high temperature bonds for your SiC and GaN products.

Our team of sales and applications engineers stands ready to work with you on your demanding packaging requirements. Contact us for a lab or on-site demonstration at alphadieattach@cooksonelectronics.com