Dear Friends,

It is great to see wind power and solar on Hawaii. There must be active IEEE members working on the subject. In our field, Wide Band Gap semiconductors will make their contribution in system designs.
Do not miss the WBG Conference 5th of Dec 2017 at Munich Airport: www.power-conference.com
Do not miss our Chinese version www.bodospowerchina.com.
There is no better way to communicate. We all share one world.
As a publisher I serve the world: one magazine, on time, every time.

Best Regards,

Bodo Arlt editor@bodospower.com

Wide Band Gap Conference 5th of Dec 2017 Munich-Airport
Wide Band Gap semiconductors have become mature during the last decade. We are facing a change of semiconductor power switches away from Silicon to SiC and GaN. It is important that systems design engineers get involved in the advanced design work using wide band gap devices for their next project. The experts from the semiconductor manufactures and the early users are important to teach the field their experience and take the barrier down using new technology.
http://www.Power-Conference.com

Void Reduction & Low Temperature Solutions at SMTA in Guadalajara, Mexico
Alpha Assembly Solutions will be exhibiting and giving a featured presentation at the 2017 SMTA Mexico Conference and Exhibition on October 18 – 19 at the Hotel Riu Plaza, Guadalajara, Mexico.
Alpha will feature its latest void reduction and low temperature assembly process technology solutions. Two products to be highlighted ALPHA AccuFlux BTC-578 Preform System and a new low temperature solder paste, ALPHA OM-550.
http://www.AlphaAssembly.com

Featuring Stable, Low-Voiding Indium8.9HF Solder Paste Series at productronica 2017
Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste Series to help customers Avoid the Void at Productronica, November 14-17, in Munich, Germany. The Indium8.9HF Series delivers no-clean, halogen-free solder paste solutions designed to produce low-voiding–plus improved stability–during the printing process. See Indium Corporation in hall A4 at booth 214.
http://www.indium.com/avoidthevoid

Dialog Semiconductor to Acquire Silego Technology
Dialog Semiconductor, a provider of highly integrated power management, AC/DC power conversion, charging, and low power connectivity technology, announced that it has signed a definitive agreement to acquire privately-held Silego Technology Inc., the leading provider of Configurable Mixed-signal ICs, for a cash payment of $276 million with additional contingent consideration of up to $30.4 million.
http://www.dialog-semiconductor.com
http://www.silego.com

Global Leaders Collaborate on GaN Technology
The world is challenged with unsustainable increases in power consumption, combating climate change, implementing cleantech technologies and meeting green, CO2 reduction initiatives. To meet these challenges, GaN Systems and Taiwan's Ministry of Economic Affairs (MOEA) have entered into a Letter of Intent to collaborate on expanding the economic and technical benefits of GaN technology to Taiwan's electronics companies.
http://www.gansystems.com

ECPE Tutorials and Workshops
ECPE Workshop 'Current Measurement for PE Applications in Lap Scale'
17 - 18 October 2017, Hamburg, Germany
Chairmen: Prof. N. Kaminski (University of Bremen), Prof. M. Bakran (University of Bayreuth)

ECPE Tutorial 'Power Circuits for Clean Switching and Low Losses'
9 November 2017, Aalborg, Denmark
Chairman: Dr. R. Bayerer (Infineon)

ECPE Workshop 'Reliability Engineering - 10 Years Robustness Validation'
24 - 25 January 2018, Stuttgart, Germany (programme will be published soon)
Chairmen: Prof. E. Wolfgang (ECPE), Dr. J. Breibach (Robert Bosch)

CIPS 2018 - International Conference on Integrated Power Electronics
20 - 22 March 2018, Stuttgart, Germany
in conjunction with the ECPE Annual Event 2018
http://www.ecpe.org

Online Workshop on "Design of Inductors & Transformers"
Designing magnetics is the single most challenging aspect of the design of a power supply. Reference materials are hard to come by and tend to leave out a lot of practical information necessary to design your own, or even to be able to check that your vendor has done a good job of designing it for you. In this workshop we will help you through this process by focusing on practical aspects of the design of inductors, transformers and flyback transformers.

Date: Thursday, October 26, 2017

Time: 8AM - 2PM PST

Location: Online
https://www.learnersplace.com/inductorstransformers

Viewpoint
The Show Must Go On

Blue Product of the Month
High Density Power Amplifier IC Delivers New Levels of Performance

Green Product of the Month
94% Efficient: New Flyback Switcher ICs

Guest Editorial

Cover Story
Module Solutions for 1500V Solar Inverters

By increasing the maximum DC Voltage of a solar inverter from 1000V to 1500V PV
power plants become more cost effective. However, this voltage jump requires careful
consideration when selecting power modules and converter topologies.
By Kevork Haddad, Semikron Inc. and Bernhard Eichler, Semikron Elektronik GmbH & Co. KG

IGBT
The Importance of the Ignition System in Reaching Greener Mobility

Next Challenges for the Electronic Ignition System
By José Padilla, Dr. Hugo Guzman, Stefan Edenharter, Littelfuse

IGBT
New Gen 3 650V IGBT: A Soft and Efficient Switch for Industrial Applications

Recent development in trench stop IGBTs has led to very performant devices. However, high performance comes together with some challenges, related to the sometimes snappy behavior of the devices. The new Gen 3 IGBTs from Rohm Semiconductor offer an optimal compromise between performance and ease of use.
By Masaharu Nakanishi & Vladimir Scarpa, Rohm Semiconductor

Mosfet
A New Approach to Superjunction MOSFETs

D3 Semiconductor has entered the market with the intention of changing the DNA of superjunction MOFETs. The company used a novel technique of adding configurability – at the wafer level – when developing its new +FET product line. This approach is already yielding design flexibility options never seen before.
By Tom Harrington, CTO, and Scott Carson, VP-Sales & Marketing, D3 Semiconductor

EMC
Substrate with Integrated ESD Protection

The printed circuit board has long since become more than just a carrier material and redistribution layer for components. A growing number of functions are now being embedded directly into the circuit board. With CeraPad, TDK has now succeeded in developing an ultra-thin ceramic substrate with integral ESD protection, specifically for LEDs.
By Dr. Dieter Vogel, Product Marketing Multilayer Piezo and Protection Devices, TDK

Measurement
Effectiveness of Phase Correction When Evaluating High-Efficiency Motor Drive

Against the backdrop of international efforts to prevent global warming, the increasingly efficient motor drive systems used in electric vehicles and industrial applications have been attracting attention in recent years. Essential in evaluating the efficiency and loss of motor drive systems, the ability to measure power accurately demands a range of expertise.
By Hideharu Kondo, Chiaki Yamaura, Yukiya Saito and Hiroki Kobayashi; HIOKI E.E. Corporation

IGBT
Modeling Thermal Behavior of IGBT Modules in Conversion Equipment

In recent years designers of power electronics turned to increasingly wider usage of integrated system solutions (power assemblies) from manufacturers of power semiconductors. In some industries such stand-alone units optimized for specific applications are preferable to discrete power modules.
By Timofei Fedorov, New Products Engineer, Candidate of Technical Sciences, Assistant Professor, Proton Electrotex

Mosfet
Advanced Synchronous Reverse Blocking

Energy efficiency plays a crucial role when developing cost-effective, high-power electronic systems. It stands to reason that reducing power loss also lowers costs because cooling expenditures can be reduced and more compact passive components can be integrated – as long as the switching frequency can be increased.
By Dr Ralf Hauschild, Principal Engineer, European LSI Design and Engineering Centre, Toshiba Electronics Europe

Power Modules
System-Simulation for Virtual Power Modules

Designing, dimensioning and optimization of power modules and its management is a complex task. Electronic designers of power modules are focused today on targets like: cost reduction, increase of power density, increase of product reliability and reduction of parasitic elements.
By Roberto Gandía, FlowCAD EDA-Software Vertriebs GmbH

Intelec, Gold Coast, Australia, October 22-26 http://www.intelec.org

Power Electronics Moscow, Moscow, Russia, October 24-26 http://www.powerelectronics.ru/?lang=en-GB

CWIEME Istanbul, Istanbul, Turkey, November 2-4 http://www.coilwindingexpo.com/istanbul

SEMICON Europa, Munich, Germany, November 14-17 http://www.semiconeuropa.org

Productronica, Munich, Germany, November 14-17 http://www.productronica.com

SPS / IPC / DRIVES, Nuremberg, Germany, November 28-30 http://www.mesago.de/en/SPS/home.htm

Power Electronics Conference, Munich, Germany, December 5 http://www.power-conference.com

Forum LED, Lyon, France, December 13-14 http://www.forumled.com

SEMICON Japan, Tokyo, Japan, December 13-15 http://www.semiconjapan.org

EMC, Dusseldorf, Germany, February 20-22 http://www.mesago.de/en/EMV/home.htm

APEX, San Diego, USA, February 24 - March 1 http://www.ipcapexexpo.org

Embedded World, Nuremberg, Germany, February 27 - March 1 http://www.embedded-world.de

Battery Experts Forum, Aschaffenburg, Germany, February 27 - March 1 http://www.battery-experts-forum.com

Satellite 2018, Washington, D.C., USA, March 12-15 http://www.satshow.com

Trench 9 MOSFETs in Robust Packages Save Space
Nexperia, the former Standard Products division of NXP, announces a series of Trench 9 power MOSFETs, targeted primarily at the automotive industry, which combine the company's low voltage superjunction technology with its advanced packaging capability to deliver high performance and ruggedness. LFPAK56E is the latest innovation in the family of automotive LFPAK packages.
http://www.nexperia.com/automotivetrench9

Compare Cleaning Machines – Manufacturer Neutral
For companies looking into a new cleaning process, ZESTRON offers a unique service in the industry. Interested customers can answer five questions at www.compare-machines.com, and ZESTRON quickly reduces the wide market selection of over 60 cleaning machines down to just a few relevant cleaning systems based on the individual requirements of the customers.
http://www.zestron.com

SiC MOSFET Provides Ultra-Fast Switching in Power Electronics
Littelfuse, Inc. introduced its first series of silicon carbide (SiC) MOSFETs, the latest addition to the company's growing power semiconductor line. In March, Littelfuse took another incremental step towards establishing industry leadership in the power semiconductor industry through a majority investment in the well-respected SiC technology development company, Monolith Semiconductor Inc.
http://www.littelfuse.com

Radiation-Tolerant Plastic ICs to Power Small Satellite Mega-Constellations
Intersil, a subsidiary of Renesas Electronics Corporation announced the first three members of its family of radiation-tolerant plastic-package ICs designed to support the emerging field of small satellites that will provide solutions such as high-speed Internet connections to hundreds of millions of users in communities, governments, and businesses worldwide.
http://www.intersil.com

High-Voltage Multi-Channel Solenoid and Unipolar Motor Driver IC
Toshiba Electronics Europe (TEE) announced the launch of a multi-channel solenoid and unipolar motor driver IC (TB67S111PG) that delivers high-voltage and low ON resistance drive.
TB67S111PG incorporates four channels each consisting of one low-side MOSFET and a free-wheeling diode connected to drain. This enables it to control each channel independently.
http://www.toshiba.semicon-storage.com.

Silicon Carbide Power Device
Ascatron provides next generation Silicon Carbide (SiC) power semiconductors using its proprietary 3DSiC technology with a quality and performance unattainable through current methods. SiC radically reduce losses in electrical power converters and lowers system costs, making it key for electric vehicles and renewable energy. The global impact will thus be large.
http://www.ascatron.com

DC/DC Converter Combines True Fixed Frequency and Ultra-Fast Transient Response
Texas Instruments introduced the industry's first 16-V input, 40-A synchronous DC/DC buck converter with an internally compensated advanced-current-mode (ACM) control topology supporting frequency synchronization. TI's TPS543C20 SWIFT converter provides enhanced efficiency by integrating its latest generation of low resistance MOSFETs into a thermally efficient small-footprint package.
http://www.ti.com

This eMail was sent to: {EMAIL}.
We are committed to protecting the privacy of our subscribers and other users of our online services. Please see our Privacy Statement for details.
Please visit www.bodospower.com/login.aspx to log into my website and manage your preferences.
To end your subscription to this newsletter, click here: Unsubscribe.

Content provider in terms of the german Telemediengesetz (TMG): Bodo's Power Systems
Responsible according to § 6 TMG: Bodo Arlt - editor@bodospower.com
Address: Katzbek 17a - D-24235 Laboe Germany
Phone: +49 4343 421790
Fax: +49 4343 421789