Dear Friends,

Keep your thermal management in mind when designing power conversion systems. Heat is the enemy of all electronics, and you want to keep it as far away from the important components as possible.

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Best regards,
Bodo Arlt

Are you troubled by the thermal stress in SiC devices for automotive?

A.L.M.T. Corp.'s heatspreaders with high thermal conductivity and low thermal expansion can solve your problems!

As for automotive modules, recently double side cooling method has become a trend.

However, if Cu is used as a spacer between the SiC device and the lead frame, thermal stress increases due to the high temperature operation of SiC, and peeling and cracking may occur in the solder layer.

Our CPC™ has a three layered structure of Cu/CuMo/Cu, and is a highly functional heatspreader that has thermal conductivity close to that of Cu, while taking advantage of the low thermal expansion of Mo. It relieves thermal stress and improves the reliability of power module.

CPC™ (Copper/CopperMolybdenum/Copper)

• High thermal conductivity.
• Coefficient of thermal expansion is adjustable and can be matched with surrounding materials.
• Laminated material, consisting of CuMo (CopperMolybdenum) sandwiched between copper layers.
• Cu layer on the surface enhances the initial heat dissipation.
• High mass-productivity by rolling and pressing process.

Moreover, we have other heatspreaders for your power devices.

Ag-Diamond (Silver-Diamond)

• High thermal conductivity, 600 W/(m･K).
• The thermal expansion is close to semiconductor chips and ceramic materials.
• A composite material made from silver, which features the highest thermal conductivity of all metals,
• and diamond, the highest thermal conductive material in the natural world.

MAGSIC™ (Magnesium-Silicon Carbide)

• Higher thermal conductivity than Al-SiC.
• Coefficient of thermal expansion close to Al-SiC.
• Strong structural stability helps preserve quality contact with thermal sources over long periods.
• Lightweight.

Need any detailed information?
Click the banner below for technical data!

A.L.M.T. Corp.   Inquiry-hs@allied-material.co.jp