Dear Friends,

PCIM opens its doors tomorrow, make sure to get your update on these modules first hand at booth 409 in hall 7!

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Kind regards,
Bodo Arlt

Driving the green transformation forward requires many partners along the energy flow –developers and manufacturers for applications in the increasing generation of renewable energy and its transmission to efficient usage. Power semiconductors are key components along this entire energy flow.

With accumulated track record of over 29 million xEVs driven by its highly reliable power devices since 1997, Mitsubishi Electric presents its next generation of automotive power modules family: the J3-Series.

Combining latest packaging and power device production technologies, the J3-Series addresses the ongoing trend towards high power-density, scalable solutions for eMobility. A key factor in the J3 success lies in the fine coordination of in-house developed efficient semiconductor devices and compact high-reliability transfer mold packaging (T-PM). The core-module, J3-T-PM is a compact half-bridge that can be fitted with either 1300V SiC MOSFET or 750V Si RC-IGBT enabling solutions for both 800V and 400V battery classes under the same module footprint with various built-in features. The J3-T-PM is solderable, in a modular way (J3-HEXA-S/L), to pinfin baseplate or directly to the cooling-structure of the inverter covering a wide power range from 80kW to over 250kW~.

Find out more about this year’s highlights on our booth in hall 7, booth 409, our contributions at the conference and lectures at the PCIM Europe public forums here.