Dear Friends! PCIM Europe has just closed the doors of its now 4 halls. It was so nice to meet the industry again in Nuremberg. A big thank you goes to my team who looked after the booth for 3 days and also helped me host my panel. We had 3 very interesting and entertaining sessions on wide bandgap and how it will shape the future of power conversion. Also, a big thank you to all the speakers, I really appreciate you being there. I am still looking for that picture of my surfboard, I really liked the comparison between our industry and the waves on a beach!

Find all magazines from 2006 on in the free archive on my website. Do not miss our Chinese version bodospowerchina.com. There is no better way to communicate. As a publisher I serve the world: one magazine, on time, every time. Kind Regards, Bodo Arlt
Please add our address newsletter@bodospower.de to your approved sender list to ensure inbox delivery. View online version
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Dear Friends,

PCIM Europe has just closed the doors of its now 4 halls. It was so nice to meet the industry again in Nuremberg. A big thank you goes to my team who looked after the booth for 3 days and also helped me host my panel. We had 3 very interesting and entertaining sessions on wide bandgap and how it will shape the future of power conversion. Also, a big thank you to all the speakers, I really appreciate you being there. I am still looking for that picture of my surfboard, I really liked the comparison between our industry and the waves on a beach!

Find all magazines from 2006 on in the free archive on my website. Do not miss our Chinese version bodospowerchina.com. There is no better way to communicate. As a publisher I serve the world: one magazine, on time, every time.

Kind Regards,

Bodo Arlt editor@bodospower.com

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e-Newsletter Content - just click and get to your topic:
The News
- The first fully integrated SiC Facility in Italy
- Collaboration on SiC-Based Traction Inverters for Electric Vehicle Powertrains
- MoU for GaN Semiconductors
- IEDM: Call for Papers
- Building Permit for final Construction Phase of Smart Power Fab in Dresden
- New Director Strategic Market Development EMEA
- Online Custom Magnetics Design House launches global Production Service
- Renewal of Cooperation Agreement for Packaging Technology
- Strategic Current Sensor Chip Supplier
Preview of Content in the July Issue
- Viewpoint
- Product of the Month
- Cover Story
- Thermal Management
- Measurement
- Wide Bandgap
- Design and Simulation
- Technology
Events
New Products
- Coreless High Current Sensors
- Rugged 500 W AC/DC Power Supplies utilizing Conduction Cooling for harsh Environments
- CoolGaN™ bidirectional Switch and CoolGaN Smart Sense
- Evaluation Modules with Integrated Buck Converters
- LQ Relay for high inrush Currents and PiP Reflow Processing
- Gain Pre-Driver for 5G mMIMO
- LDO for ultra-miniature Applications
- Expanded Range of Power Inductors
- Monolithic Automotive asynchronous Buck Converters

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The News

The first fully integrated SiC Facility in Italy
STMicroelectronics intends to build a high-volume 200mm silicon carbide manufacturing facility for power devices and modules, as well as test and packaging, to be built in Catania, Italy. Combined with the SiC substrate manufacturing facility being readied on the same site, these facilities will form ST's Silicon Carbide Campus.
Read more ...

Collaboration on SiC-Based Traction Inverters for Electric Vehicle Powertrains
NXP Semiconductors announced a collaboration with automotive tier-1 ZF Friedrichshafen on SiC-based traction inverter solutions for electric vehicles. Using NXP's GD316x high-voltage (HV) isolated gate drivers, the solutions are designed to accelerate the adoption of 800-V and SiC power devices.
Read more ...

MoU for GaN Semiconductors
The fabless semiconductor company Cambridge GaN Devices (CGD) has signed a Memorandum of Understanding (MoU) with Industrial Technology Research Institute (ITRI) of Taiwan to solidify a partnership in developing high performance GaN solutions for USB-PD adaptors.
Read more ...

IEDM: Call for Papers
Under the theme "Shaping Tomorrow's Semiconductor Technology," the 70th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development. The 2024 IEEE IEDM will take place December 7-11, 2024 at the Hilton San Francisco Union Square hotel.
Read more ...

Building Permit for final Construction Phase of Smart Power Fab in Dresden
Infineon Technologies is on schedule with the construction of the Smart Power Fab in Dresden and is initiating the final construction phase. During a visit, the Prime Minister of the Free State of Saxony, Michael Kretschmer, officially handed over the last outstanding building permit for the new fab issued by the State Directorate of Saxony.
Read more ...

New Director Strategic Market Development EMEA
Schurter welcomed Natalie Bird to its team. Natalie Bird took up the newly created position of Director Strategic Market Development EMEA. She will play a pivotal role in advancing the market strategies across the region.
Read more ...

Online Custom Magnetics Design House launches global Production Service
Frenetic Electronics announced Frenetic Factory, a worldwide magnetics production facility with plants in the USA, Mexico, Europe, India, and China. Frenetic Factory can deliver samples quickly with no MOQs. It currently has a production capacity of 8.75M units annually, that can be scaled to even higher volumes fast.
Read more ...

Renewal of Cooperation Agreement for Packaging Technology
Vincotech has renewed its cooperation agreement with Semikron Danfoss. The two enterprise's alliance, which dates back to 2003, has been extended to further strengthen MiniSKiiP® package technology.
Read more ...

Strategic Current Sensor Chip Supplier
EV manufacturer NIO selected Melexis' current sensor chips for their traction inverter systems. Melexis' chips will power all of NIO's battery electric vehicles (BEVs). Through this collaboration, NIO will use from Melexis' current sensor technology, enhancing the efficiency and reliability of their traction inverter systems.
Read more ...

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Preview of Content in the July Issue

Viewpoint
The Significance of Power

Product of the Month
GaN Power Transistors Addressing a Broad Range of Applications

Cover Story
Revolutionizing Circuit Protection with SiC JFETs

The mid-20th century was a time of significant innovation in residential and industrial electrical systems. One of the most impactful advancements was the transition from traditional replaceable fuses to miniature circuit breakers (MCBs). While fuses provided basic protection, they had to be replaced after they blew. Circuit breakers, on the other hand, could be easily reset after tripping. This convenience led to building codes and electrical standards favoring circuit breakers over fuses in new construction.
By Jonathan Dodge, P.E., Principal Applications Engineer, and Andy Wilson, Senior Business Development, Qorvo

Thermal Management
The Impact of Direct Liquid Cooling on Building Power Semiconductors

The challenge in power electronics is to achieve higher power throughput in smaller at reduced cost. These often contradicting targets lead to compromises. Higher currents lead to higher thermal stress in a given device, reducing the lifetime.
By Dr. Ing. Martin Schulz, Global Principal, Application Engineering, Littelfuse

Measurement
Finding Irregular Effects in Control Loop Designs without Compromise

Stable operation in all circumstances is essential for power converters. Different working conditions, such as load steps, startup/shutdown sequences and input voltage variation, apply to most converter types. In addition to the standard feedback control loop, integrated pulse width modulation (PWM) controllers provide extended functions, such as line feed-forward loop control and soft-start control.
By Marcus Sonst, Senior Application Engineer focusing on Power Electronic applications within the Product Management for Oscilloscopes, Rohde & Schwarz

Wide Bandgap
Accelerating Development of SiC-Based Power Converters, Such As EV Chargers

As the era of the internal combustion engine as the vehicle's primary power source fades, it is the electric motor that the automotive industry favours as the alternative. In turn, the automotive OEMs look to the semiconductor industry for the electronics innovations needed to deliver this electrified future. Battery electric vehicles (BEV) are currently the preferred approach, and everyone is looking to lead in the knowledge necessary to make them as appealing as possible. Although many get over-excited about the gadgets and features inside the car, vehicle range and charging remain the key concerns for consumers.
By Dr. Ing. Matthias Ortmann, Chief Engineer, Toshiba Electronics Europe

Design and Simulation
Unleashing the Power of AI to Transform PCB Design

AI-assisted PCB design offers a transformative approach that combines the power of automation, optimization, and decision support to streamline the design process, enhance design outcomes, and drive innovation in the field of electronic design.
By Steve Roberts, Innovation Manager, RECOM Power, and Tobias Pohl, co-founder and CEO of CELUS

Technology
Unleashing the Power of Diamond as a Semiconductor

Diamond has long been considered as the ultimate semiconductor for power electronics. In a global economy yearning for technology as a solution for climate change, power electronics is one of the enabling keys for the electrification, and therefore the decarbonation of our society. AI & data centers, mobility electrification, industrial electrification, renewable energy integration, energy storage, and green hydrogen production need suitable power electronics. Each application has its own constraints both technical, environmental, and economical.
By Gauthier Chicot, CEO, and Ivan Llaurado, CRO & Director of Partnerships, DIAMFAB

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Events

VLSI, Honolulu, HI, USA, June 16-20 vlsisymposium.org

EV Tech Expo Europe, Stuttgart, Germany, June 18-20 evtechexpo.eu

The Battery Show Europe, Stuttgart, Germany, June 18-20 thebatteryshow.eu

SIA Powertrain, Lille, France, June 19-20 sia.fr

The Smarter E, Munich, Germany, June 19-21 thesmartere.de

ees Europe, Munich, Germany, June 19-21 ees-europe.com

Intersolar Europe, Munich, Germany, June 19-21 intersolar.de

iTEC, Rosemont, IL, USA, June 19-21 itec-conf.com

Power2Drive, Munich, Germany, June 19-21 powertodrive.de

Speedam, Ischia, Italy, June 19-21 speedam.org

DAC, San Francisco, CA, USA, June 23-27 dac.com

CPE-PowerENG, Gdynia, Poland, June 24-26 cpe-powereng2024

EU PSES, Porto, Portugal, June 25-26 ises-power.com

CWIEME Shanghai, Shanghai, China, June 26-28 coilwindingexpo.cn

EnerHarv, Perugia, Italy, June 26-28 enerharv.com

electronica China, Shanghai, China, July 8-10 electronica-china.com

SEMICON West, San Francisco, CA, USA, July 9-11 semiconwest.org

ICDCM, Columbia, SC, USA, August 5-8 attend.ieee.org/icdcm-2024

EMC+SIPI, Phoenix, AZ, USA, August 5-9 emc2024.org

World Battery Expo, Guangzhou, China, August 8-10 battery-expo.com

Asia-Pacific Power Product & Technology Exhibition, Guangzhou, China, August 8-10 bspexpo.com

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New Products

Coreless High Current Sensors
Capable of measuring high DC currents from 2 kA up to 42 kA without surge current limitations, the Open Loop Coreless Integral (OLCI) sensors from LEM feature a large aperture for accurate measuring of high currents on large busbars, with up to 1 MHz bandwidth for high frequency applications.
Read more ...

Rugged 500 W AC/DC Power Supplies utilizing Conduction Cooling for harsh Environments
P-DUKE has launched its XTBF500 AC/DC power supply series, available in open frame or enclosed form. The XTBF500 integrates the TBF500 full brick 500 W AC/DC power supply and its peripheral circuits, such as EMC filters, start-up current limiters, large capacity capacitors, and aluminum substrates, to achieve the concept of "easy to use."
Read more ...

CoolGaN™ bidirectional Switch and CoolGaN Smart Sense
Infineon Technologies announced two CoolGaN™ product technologies, CoolGaN bidirectional switch (BDS) and CoolGaN Smart Sense. CoolGaN BDS is said to provide "exceptional soft- and hard-switching behavior", with bidirectional switches available at 40 V, 650 V and 850 V.
Read more ...

Evaluation Modules with Integrated Buck Converters
Evaluation of Recom's range of integrated buck regulators is now made easier with the new EVMs. Suiting models in the Recom RPL, RPH, and RPZ range with current ratings from 0.5 A to 20 A, the evaluation modules provide a way to characterize the converter performance in a realistic environment, both thermally and electrically.
Read more ...

LQ Relay for high inrush Currents and PiP Reflow Processing
Panasonic Industry's LQ Series of electromechanical Power Relays are designed for a vast field of applications. With a profile of 10 mm (W) x 20 mm (L) x 16 mm (H) these relays offer flexibility in mounting orientations. So far, the LQ Series shows a high switching capacity of up to 10 A and is available in six nominal coil voltages ranging from 5 V to 24 V, featuring 1 Form A or 1 Form C contact arrangements.
Read more ...

Gain Pre-Driver for 5G mMIMO
Qorvo announced "the industry's highest gain pre-driver providing 39 dB gain at 3.5 GHz and achieving a peak power of +29 dBm". This MIMO (mMIMO) pre-driver dubbed QPA9822 is a wideband, high gain, high linearity driver amplifier, engineered specifically for 32-node mMIMO systems.
Read more ...

LDO for ultra-miniature Applications
Toshiba Electronics has released of a series of low-dropout (LDO) voltage regulators in their ultra-miniature DFN4D package type. Specifically aimed at miniature applications powered by small-scale batteries, the family of devices reduces power consumption, thereby elongating the usable lifetime.
Read more ...

Expanded Range of Power Inductors
In addition to Würth Elektronik's five existing package sizes of WE-XHMI SMT power inductors there are now eight more packages. These compact yet very efficient inductors feature a current capacity up to 56 A saturation current and the ability to handle high transient current spikes.
Read more ...

Monolithic Automotive asynchronous Buck Converters
STMicroelectronics has introduced automotive-qualified step-down synchronous DC/DC converters that save space and ease integration in applications including body electronics, audio systems, and inverter gate drivers. The A6983 converter series comprises of six non-isolated step-down converters in low-consumption and low-noise configurations and the A6983I isolated buck converter.
Read more ...

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