Dear Friends,

Summer is here and it's time to recover from busy PCIM. Let me take this opportunity to thank everyone involved in my panel at the show in Nuremberg: all the speakers for their interesting contributions on GaN, SiC and surfing! To the audience for attending my presentations and for joining these experts and appreciating their time. And my team for the smooth organization and for the support so that I could focus on my guests. The next highlight will be my WBG event at the Hilton Munich Airport on December 3rd and 4th. If you presented last year, chances are very good that we will be contacting you soon. If not, but you are interested, please feel free to contact us. Invitations will be going out shortly and tickets will go on sale this fall exclusively at bodoswbg.com. Stay tuned!

Find all magazines from 2006 on in the free archive on my website. Do not miss our Chinese version bodospowerchina.com. There is no better way to communicate. As a publisher I serve the world: one magazine, on time, every time.

Kind Regards,

Bodo Arlt editor@bodospower.com

APEC 2025 Announces Call for Technical Program Paper Digest Submissions
APEC 2025, to be held in Atlanta, Georgia, from March 16-20, 2025, continues the long-standing tradition of addressing issues of immediate and long-term interest to the practicing power electronics engineer. APEC is now accepting paper digest submissions for the Technical Program. Interested authors wishing to present a paper must submit a digest for consideration by August 2, 2024. Instructions for submissions are available at: https://apec-conf.org/speakers/ts-author-info/
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High-density Power Modules for Deep-Sea ROVs
Historically, commercial divers have taken great risks to inspect oil and gas pipelines, high-voltage electrical cables, wind turbines and other critical infrastructure deep undersea. Saab has eliminated that risk bringing deep-sea exploration expertise to commercial underwater applications.
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SiC Manufacturing Facility planned to be built in Czech Republic
onsemi announced plans to establish a state-of-the-art, vertically integrated silicon carbide (SiC) manufacturing facility in the Czech Republic. The site would produce the company's intelligent power semiconductors that are essential for improving the energy efficiency of applications in electric vehicles, renewable energy and AI data centers.
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Power Tradeshow in Shenzhen, China
PCIM Asia, the exhibition and conference for power electronics, intelligent motion, renewable energy and energy management, will return to the Shenzhen World Exhibition and Convention Center from 28 – 30 August 2024.
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Collaboration between Semiconductor Manufacturer and Power Supply Provider
Texas Instruments (TI) announced a long-term collaboration with Delta Electronics, a global power and energy management manufacturer, to create next-generation electric vehicle (EV) onboard charging and power solutions. This work will leverage both companies' research and development capabilities in power management and power delivery in a joint innovation laboratory in Pingzhen, Taiwan.
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Distributor receives ISO 27001 Certification
DigiKey has added ISO 27001 certification to its data security program. With this certification, the company builds upon its commitment and ability to manage information securely and safely for its customers, suppliers and partners.
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Acquisition of GaN Manufacturer completed
Renesas Electronics has completed the acquisition of Transphorm, a company which concentrates its activities on GaN power semiconductors, as of June 20, 2024. With the closing of the acquisition now completed, Renesas will immediately start offering GaN-based power products and related reference designs to meet the rising demand for wide bandgap semiconductor products.
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Partnering in EMC Solutions for Aerospace, Defense and Medical Electronics
Anritsu Company has partnered with Y.I.C. Technologies to develop tools that support companies performing EMC pre-compliance measurements. Anritsu's Field Master spectrum analyzers compliment the Y.I.C EMScanners and EMViewer application software to provide a fully integrated solution.
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Solving Design Challenges with Collaborative eBooks
Mouser Electronics has recently released several eBooks in collaboration with manufacturing partner Analog Devices (ADI). The eBooks focus on a wide range of topics, such as how production facilities can achieve greater productivity through a flexible manufacturing approach, the technologies being used to support sustainable manufacturing practices, embedded security concepts, and the technological advances in digital factories.
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Automotive OEM and Semiconductor Manufacturer: Long-Term SiC Supply Agreement and Joint Lab
STMicroelectronics (ST) and Geely Auto have signed a long-term Silicon Carbide supply agreement to accelerate their existing cooperation on SiC devices. Under the terms of this multi-year contract, ST will provide multiple Geely Auto brands with SiC power devices for mid-to-high-end battery electric vehicles (BEVs).
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Charity Benefit from PCIM Booth for Education in Ecuador
Vincotech staged a charity benefit at the PCIM Europe trade fair to raise funds for the NGO Plan International Germany. Visitors rose to this virtual reality (VR) challenge. Vincotech and its partners rewarded their efforts by donating €15,000 to a project to support young Ecuadorians.
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electronica China, Shanghai, China, July 8-10 electronica-china.com

SEMICON West, San Francisco, CA, USA, July 9-11 semiconwest.org

ICDCM, Columbia, SC, USA, August 5-8 attend.ieee.org/icdcm-2024

EMC+SIPI, Phoenix, AZ, USA, August 5-9 emc2024.org

World Battery Expo, Guangzhou, China, August 8-10 battery-expo.com

Asia-Pacific Power Product & Technology Exhibition, Guangzhou, China, August 8-10 bspexpo.com

EDI CON Online, Virtual Conference, August 21 edicononline.com

PELSS Power Electronics Student Summit, Kassel, Germany, August 21-23 iee.fraunhofer.de

CIGRE, Paris, France, August 25-30 cigre.org

The smarter E South America, Sao Paulo, Brazil, August 27-29 thesmartere.com.br

PCIM Asia, Shenzhen, China, August 28-30 pcimasia-expo.com

Expanded SMT and Module Package Options for 1200 V SiC MOSFETs
Alpha and Omega Semiconductor (AOS) announced the expansion of their package portfolio options available for their second generation 650 V to 1200 V αSiC MOSFETs. Applicable to many critical applications such as xEV charging, solar inverters, and industrial power supplies, the package selections give designers the added flexibility of multiple system optimization options to further maximize system efficiency.
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Design Kit for Power over Ethernet
Bourns has introduced the POE-LAB1 Design Kit, created to help streamline both the designing of power/data delivery and protection in Power over Ethernet (PoE) applications. The kit includes components from Bourns' portfolio of semiconductor and magnetic products that are particularly suited to support high-speed Ethernet lines (up to 10 GbE) with PoE++ (Type 4) capabilities.
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Isolated probing system for precise measurements of fast switching signals
Rohde & Schwarz has developed the R&S RT-ZISO isolated probing system. The R&S RT-ZISO enables accurate measurements of fast switching signals, especially in environments with high common-mode voltages and currents. Also new is the R&S RT-ZPMMCX passive probe with MMCX connector, which complements the isolated probe system perfectly for certain measurement tasks.
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1700V SiC Schottky Discretes and Dual Diode Modules
Semiq has announced the addition of 1700 V SiC Schottky discrete diodes and dual diode packs to its QSiC™ product line. The GP3D050B170X (bare die) and GP3D050B170B (TO-247-2L package) discrete diode is rated for respective maximum forward currents of 110 A and 151 A.
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Redundant analog TMR angle Sensor for safety-relevant Applications
TDK launched the tunnel-magnetoresistance (TMR) angle sensor TAS8240 sensor for automotive and industrial applications. It is available in both compact QFN16 (3 x 3 mm²) and TSSOP16 (5 x 6.4 mm²) packages, offering four redundant analog single-ended SIN/COS outputs.
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Combination of Silicon Trench and SiC MOSFETs
As data centers become increasingly power-hungry to support the tremendous processing requirements of AI workloads, the need for boosting energy efficiency is paramount. The combination of onsemi's latest generation T10® PowerTrench family and EliteSiC 650V MOSFETs create a solution that offers high efficiency and high thermal performance in a smaller footprint for data center applications.
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"Industry's first GaN IPM"
Texas Instruments introduced "the industry's first 650 V three-phase GaN IPM for 250 W motor drive applications". The GaN IPM addresses many of the design and performance compromises engineers typically face when designing major home appliances and heating, ventilation and air-conditioning (HVAC) systems.
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2-in-1 SiC Molded Module
Rohm Semiconductor introduced four models as part of the TRCDRIVE pack™ series with 2-in-1 SiC molded modules (two 750V-rated, BSTxxxD08P4A1x4; two 1200V-rated,  BSTxxxD12P4A1x1) optimized for electric vehicle traction inverters.
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BLDC Motor Hardware-Software Combo
Power Integrations complemented its hardware-software bundle for brushless DC motors (BLDC) with BridgeSwitch™-2, a high-voltage integrated half-bridge (IHB) motor-driver IC family targeting applications up to 1 HP (746 W). The ICs, which feature high- and low-side drivers and advanced FREDFETs with integrated lossless current sensing, deliver inverter efficiency of up to 99 percent.
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