Dear Friends, the offered document in this update compares the performance of a surface mounted power device versus standard discrete packaging. It highlights the advantages of the SMPD in combination with Silicon Carbide MOSFET.
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Dear Friends,
The offered document in this update compares the performance of a surface mounted power device versus standard discrete packaging. It highlights the advantages of the SMPD in combination with Silicon Carbide MOSFET.
Find all my magazines from 2006 on in our free archive on bodospower.com. There is no better way to communicate. We all share one world. As a publisher I serve the world: one magazine, on time, every time.
Kind regards,
Bodo Arlt
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Special Announcement:
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ISOPLUS – SMPD: An Advanced Isolated Packaging to Fully Exploit the Advantages of SiC MOSFETs
Littelfuse offers an advanced isolated package of power semiconductors, the Surface Mount Power Device (SMPD), delivering the performance of a power module with the design and mounting flexibility of a discrete.
This ISOPLUS – SMPD: An Advanced Isolated Packaging to Fully Exploit the Advantages of SiC MOSFETs Whitepaper compares the dynamic performance of the SMPD versus standard discrete packaging.
This whitepaper is intended for power electronics engineers and design enthusiasts.
Power your designs with Littelfuse by downloading the ISOPLUS – SMPD: An Advanced Isolated Packaging to Fully Exploit the Advantages of SiC MOSFETs Whitepaper.
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Content provider in terms of the german Telemediengesetz (TMG): Bodo's Power Systems
Responsible according to § 6 TMG: Bodo Arlt - editor@bodospower.com
Address: Katzbek 17a - D-24235 Laboe Germany
Phone: +49 4343 421790 | Fax: +49 4343 421789
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