Dear Friends,

We are heading south all the way to Munich today. The WBG Event will kick off tomorrow at 4 PM with an opening roundtable. Bodo and Alfred will moderate this session, where top experts will answer questions from the audience live. It'll be exciting to see, from which field there are going to be more submissions. Either way, our panelists will have the answers. Once all the questions have been addressed, we will have an informal get-together with fine food, drinks, and networking opportunities - the hidden star of the event.

On Wednesday, the entire day is dedicated to the main conference. A total of 40 presentations will provide the ultimate update on SiC and GaN technologies, accompanied by a tabletop exhibition in the foyer of the scenic Hilton Munich Airport.

If you're planning a last-minute attendance, email me at holger@bodospower.com, and we'll get your ticket ready.

Find all magazines from 2006 on in the free archive on my website. Do not miss our Chinese version bodospowerchina.com. There is no better way to communicate. As a publisher I serve the world: one magazine, on time, every time.

Kind Regards,

Holger
holger@bodospower.com

Cooperation for Development of Sensor ICs with Functional Safety
Novosense Microelectronics and Continental Automotive Technologies have signed a memorandum to enhance strategic cooperation in the development of sensor ICs with functional safety, as well as for the global integration of Novosense's products within Continental's worldwide platforms.
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Chief Operating Officer started in Office
Effective November 1, 2024, Markus Fischer, the former Executive Vice President Operations, has been appointed to the Rohde & Schwarz Executive Board. As Chief Operating Officer (COO), he will collaborate with Christian Leicher (CEO) and Andreas Pauly (CTO) to continue to keep the company on course for growth in these challenging times.
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Semiconductor Product Distribution Center opened in Germany
Texas Instruments has opened its product distribution center in Dreieich, Germany, close to Frankfurt, Germany. This distribution center includes 9,000 square meters of space and specific automation features. It has the capacity to quickly ship up to 7,500 orders per day.
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Collaboration to Advance Plug & Charge
Vector and Hubject now collaborate to further advance the Plug & Charge (PnC) technology. The aim is to simplify the electric vehicle (EV) charging process. With more than 2.6 million PnC-ready vehicles already on the market and more EVs on the horizon, the partnership helps to accelerate the adoption and implementation of PnC technology.
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GaN Design and Development Center in Ottawa, Canada
The French company Wise-integration, which is active in digital control of gallium nitride (GaN) and GaN ICs for power conversion, has opened its North American Design & Development Center in Ottawa, Ontario, Canada. Led by Christian Cojocaru and staffed by experts in analog and digital technology design, the center will drive the development of the company's design portfolio for the next generations of WiseGan®.
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A very short Look back at electronica 2024
From November 12 to 15,2024 a total of 3,480 exhibitors presented their innovations across the entire spectrum of electronics to about 80,000 visitors at the electronica trade fair in Munich, Germany. In addition to sustainability, key topics such as artificial intelligence, the future of mobility, and the development of young talent sparked discussions at the exhibition stands and at the supporting program.
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Tool-in Ceremony for Semiconductor Fab
Samsung Electronics held a tool-in ceremony for its semiconductor research and development complex (NRD-K) at its Giheung campus. About 100 guests, including those from suppliers and customers, were in attendance to celebrate the milestone. NRD-K broke ground in 2022 and is set to become a key research base for Samsung's memory, system LSI and foundry semiconductor R&D.
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The Magnetic Show Europe, Amsterdam, Netherlands, December 3-4 magnetics-eu.com

Bodo's WBG Event, Munich, Germany, December 3-4 bodoswbg.com

Thermal Management Expo Europe, Stuttgart, Germany, December 3-5 thermalmanagementexpo-europe.com

IEEE IEDM, San Francisco, CA, USA, December 7-11 ieee-iedm.org

SEMICON Japan, Tokyo, Japan, December 11-13 semiconjapan.org

CES, Las Vegas, NV, USA, January 7-10 ces.tech

NEPCON, Tokyo, Japan, January 22-24 nepconjapan.jp

DesignCon, Santa Clara, CA, USA, January 28-30 designcon.com

IGBTs in several different Packages for up to 1700 V
Microchip Technology now offers its IGBT 7 devices in different packages, multiple topologies, as well as current and voltage ranges. The components are available in standard D3 and D4 62 mm packages, as well as SP6C, SP1F and SP6LI packages; they are intended for power applications in solar inverters, hydrogen ecosystems, commercial and agricultural vehicles and More Electric Aircraft (MEA).
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800 V GaN Inverter with 30 kW/l Power Density
Cambridge GaN Devices (CGD) and IFP Energies nouvelles (IFPEN), a French public research and training organization in the fields of energy, transport and the environment, have developed a demo which confirms the suitability of CGD's ICeGaN®650 V GaN ICs in a multi-level, 800 V_DC inverter.
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600 W Open Frame Power Supply for Medical and Industrial Applications
Murata Manufacturing has introduced the PQC600 open-frame AC to DC power supply, which caters to the needs of the latest medical and industrial applications, such as hospital beds, dentist chairs, medical equipment, and industrial process machinery. It offers 600 W of power within a package that is less than 1U in height and is certified to the IEC 60601-1 Edition 3 medical safety standard.
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120 V/4 A Half-Bridge Gate Driver for Automotive Applications
Nexperia introduced a series of high-performance gate driver ICs designed for driving both high-side and low-side N-channel MOSFETs in a synchronous buck or half-bridge configuration. The automotive-qualified NGD4300-Q100 is suited for electronic power steering and power converters, while the NGD4300 has been designed for use with DC/DC converters in consumer devices, servers and telecommunications equipment as well as for micro-inverters used in various industrial applications.
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Motor Suite for simplified Motor Control Development
Infineon Technologies launched its Motor Suite dubbed ModusToolbox™, which is a solution of software, tools and resources for developing, configuring and monitoring motor control applications. With its ability to support different motor types, the solution intends to enable developers to bring high-performance motor control applications to market quickly and efficiently.
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SiC Schottky Barrier Diodes for High-Voltage xEV Systems
ROHM Semiconductor announced surface mount SiC Schottky barrier diodes (SBDs) that improve insulation resistance by increasing the creepage distance between terminals. The initial lineup includes eight models (SCS2xxxNHR; AEC-Q101 qualified) for automotive applications such as onboard chargers (OBCs), which will soon be supplemented by eight additional models (SCS2xxxN) for industrial equipment such as FA devices and PV inverters.
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Automotive grade residual Current Monitoring Sensor
LEM has designed an automotive grade residual current monitoring (RCM) type B sensor for bi-directional OBCs with ASIL B capabilities according to ISO26262 for transformer-less on-board chargers (OBCs). This sensor, called CDT, complies with all the relevant safety standards. The RCM type B sensor enables designers to react to the new ISO5474 Part 2 standard for AC power transfer.
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Programmable Mixed-Signal ICs, Including Low-Power Device with 14-Bit SAR ADC
Renesas announced AnalogPAK ICs, including lower power and automotive-qualified devices along with the industry's first programmable 14-bit SAR ADC (Successive-Approximation Register Analog-Digital Converter).  AnalogPAK devices are part of Renesas' GreenPAK Family of Programmable Mixed-Signal Matrix products: NVM programmable devices integrating many system functions while minimizing component count, board space, and power consumption.
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1200 V SiC MOSFETs in Bare Die Format
Toshiba has developed the X5M007E120, a 1200 V SiC MOSFETs with an low on-resistance of 7.2 mO, which is particularly suited to applications within automotive traction inverters. The device has a V_DSS of 1200 V and is rated for a drain current (I_D) of 229 A continuously, with 458 A for pulsed operation (I_{D Pulse}).
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AC Programmable Power
TDK introduced the TDK-Lambda brand GENESYS™ AC (GAC) and GENESYS AC PRO (GAC-PRO) series of 2 kVA and 3 kVA rated programmable AC power sources. With a 1U chassis height, the GAC and GAC-PRO offer a higher level of DC functionality than other members of this family – with the ability to allow AC, DC, or combined AC+DC operation.
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