Dear Friends,

How can this approach to packaging help your design increase power density and thermal performance? Find out is a webinar on December 10th!

Find all my magazines from 2006 on in our free archive on bodospower.com. There is no better way to communicate. We all share one world. As a publisher I serve the world: one magazine, on time, every time.

Kind regards,
Bodo Arlt

Achieve highest power density with a new industry-standard footprint

Join us for an exclusive webinar to discover the revolutionary OptiMOS™ Source-Down package concept, a game-changing innovation in silicon MOSFET technology that enables the highest power density and improved thermal performance.

Learn how this new industry standard footprint can help you overcome design challenges and achieve unprecedented levels of efficiency in applications like drives, solar, SMPS, telecom, and servers.

Key takeaways:

• Learn how the Source-Down package concept can help you achieve higher power density and improved thermal performance
• Understand how to overcome design challenges in applications like drives, solar, SMPS, telecom, and servers
• Discover the benefits of the OptiMOS™ power MOSFET Source-Down family, including industry-leading RDS(on), best FOMs, and superior thermal performance
• Get insights into the future of power electronics and how to stay ahead of the curve