Bodo's News

Read through my personal pick of news around people, our industry, important events and interesting product releases. Or click on a filter and pick your area of interest!

 

Power Device Division Opens Power Electronics Research Laboratory
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Learn more:
pdd.hitachi.eu
  • Industry News
  • 2021-10-13

Hitachi's Power Device Division has opened a testing laboratory based in Bracknell, UK. The company relocated its testing laboratory to larger premises, to expand its research and testing capabilities. The launch of the laboratory is an exciting time for the company as it can now supply a range of testing, offering a comprehensive suite of services for semiconductors; which can be used to investigate anything from power module fault analysis to customer application specific conditions. The facility will enable Hitachi to assist its customers with designing in and problem-solving for the full range of its power modules (750 V to 6.5 kV), through various tests including Double Pulse testing, Short circuit conditions, Paralleled power modules testing, and Gate Driver Performance. Hitachi is flexible in implementing any test requirements for its customers to support them in their design-in phase. Aligned with its test facility, the company has also launched an online power simulation tool. This simulation tool is designed to help assist engineers to choose the right Hitachi semiconductor suited to their particular application needs. The online simulation tool and further details of the laboratory can be found on the company's website.

Textbook "GaN Power Devices and Applications"
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Learn more:
epc-co.com
  • Product Release
  • 2021-10-12

Efficient Power Conversion announces the publication of a valuable learning resource for professional engineers, systems designers, and electrical engineering students seeking the latest information on gallium nitride technology and applications. Since the 2019 release of the 3rd edition textbook, "GaN Transistors for Efficient Power Conversion", published by J. Wiley, there has been rapid adoption of GaN transistors and integrated circuits into a wide range of end-use applications such as robots, drones, Artificial Intelligence (AI) computers, AC adapters, autonomous vehicles, and even vacuum cleaners.  This book, "GaN Power Devices and Applications", provides an update on gallium nitride technology and applications by leading experts. With contributions from nearly thirty industry and academic experts, and edited by Alex Lidow, this book starts with two years of new information on technology developments, design techniques, and reliability beginning right after the publication of the 3rd edition textbook. In a practical sense, this book includes detailed discussion and analysis of the latest examples of actual GaN usage in power supplies, lidar, motor drives, and low-cost satellite applications. According to Alex Lidow, EPC's co-founder and CEO, "The information contained in this new textbook will help users fully understand, by examples, the incredible contribution that GaN devices can make to innovative power systems. In addition, QR codes have been inserted at the beginning of each chapter of the book for so that readers can link to the very latest information on GaN as new it emerges."

High-Precision Voltage Reference IC Provides Very-Low Drift
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Learn more:
microchip.com
  • Product Release
  • 2021-10-07

Extended-temperature-range voltage reference ICs for automotive and industrial applications require low drift, high reliability and high performance. Microchip Technology announced today the release of a high-precision voltage reference (Vref) IC that meets these needs at a cost-effective price. The MCP1502 is an AEC-Q100 Grade 1 (-40°C to +125°C operating temperature range) automotive-qualified Vref with a maximum temperature coefficient of 7ppm/°C. "Microchip looked at the top four aspects that customers were requesting in a Vref and made a product that combines high reliability, small package size and high performance at a very cost-effective price," said Fanie Duvenhage, vice president of Microchip's mixed-signal and linear devices business unit. "This combination of features at this price is unmatched by competitors, especially when you add our experience in serving customers in the automotive and aerospace industries who require robust products for harsh environments." The MCP1502 is based on the already-proven MCP1501 Vref architecture, which has been in the market for more than five years. Packaged in a small six-lead SOT-23, the MCP1502 is an ideal choice for a wide variety of industrial, automotive and aerospace applications that require a high level of reliability. Microchip's MCP150x (MCP1501 and MCP1502) devices are perfect companions to Microchip's families of microcontrollers, ADCs and DACs, offering multiple voltage options for creating total system solutions that are suitable for a wide variety of applications that require stable, accurate and repeatable data conversion.

Low Phase Noise GaAs MMIC Amplifier
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Learn more:
richardsonrfpd.com
  • Product Release
  • 2021-10-06

Richardson RFPD announced the availability and full design support capabilities for a gallium arsenide MMIC amplifier from Analog Devices. The ADL8150 is a self-biased GaAs MMIC, heterojunction bipolar transistor, low phase noise amplifier that operates from 6 GHz to 14 GHz. The amplifier has low phase noise of -172 dBc/Hz at 10 kHz offset and provides 12 dB of typical signal gain and +30 dBm typical output third-order intercept. The amplifier requires 74 mA from a 5 V collector supply voltage. The ADL8150 also features inputs and outputs that are internally matched to 50 ?, facilitating integration into multichip modules. The ADL8150 is versatile for a range of applications, including military and space, test instrumentation, and communications.

Energy Sharing Among Neighbors with Demand-Oriented Distribution for Solar Energy
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Learn more:
infineon.com
  • Industry News
  • 2021-10-05

In order to meet Europe's (EU) ambitious climate targets, greenhouse gas emissions must be drastically reduced by 2030. To achieve this, around 28 million multi-family houses with over 80 million households must be equipped with photovoltaics. Despite the support of the EU, there are still enormous technical and regulatory obstacles, specifically with the power supply for small multi-family houses from renewable energy sources. In a cooperation with Infineon Technologies, Munich based start-up PIONIERKRAFT has overcome these hurdles with an innovative hardware and service solution coined PIONIERKRAFTwerk (German only). This technology enables self-produced solar energy to be distributed physically and by demand between different households. With Infineon's support, renewable energy can then be shared with neighbors in a decentralized manner and without intermediate storage – economically and without bureaucratic obstacles. The hardware of the participating parties is connected to the platform provided by PIONIERKRAFT using the Internet. This determines the power surplus of the generator as well as the current demand of neighbors to autonomously control the distribution process. Thus, households without a photovoltaic system can use solar power. The solution also regulates the power flows without using the public grid. Several Infineon components make this possible, including the discrete CoolSiC MOSFET IMBG120R030M1H in the surface-mount D2PAK-7L package and the EiceDRIVER Compact Gate Driver 1ED3122MU12H. By working together, the PIONIERKRAFTwerk performs efficient and bidirectional power transfer. Therefore, energy with a power of up to 2000 W can be transferred between households.

1200V Silicon Carbide Half Bridge Power Module
  • Product Release
  • 2021-10-04

Solitron has developed the SD11900 series, a 1200V, 50A power module platform to maximize the benefits of SiC, with a unique robust, simple, and cost-effective module format. The 37mm x 25mm outline is a fraction of the size and weight of standard 62mm modules. The SD11900 series maximizes power density while minimizing loop inductance with a pin configuration to allow simple power bussing. The SD11902/3/4/5 are half bridge configurations with two 1200V 32mO SiC MOSFETs. The SD11902 and SD11904 feature freewheeling 1200V SiC Schottky diodes in parallel with the MOSFETs inside the module. Two pinout configurations provide flexible power bussing options. Continuous drain current is specified at 50A. The SD11900 series is designed for demanding applications such as avionics based electromechanical actuators and power converters. With operating temperatures of -55°C to 175°C, construction includes copper baseplates and Alumina Nitride insulators ensuring TCE matching and high thermal transfer. Isolated integrated temperature sensing enables high level temperature protection. Silicon Carbide provides excellent switching performance versus the best-in-class silicon MOSFETs and IGBTs with minimal variation versus temperature. Higher efficiency levels than silicon due to significantly lower energy loss and reverse charge results in more switching power and less energy required in the switch-on and switch-off phase. Combined with high switching frequencies this translates to smaller magnetics significantly reducing system weight and size.

Successful Transition to Global Semiconductor Powerhouse
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Learn more:
wolfspeed.com
  • Industry News
  • 2021-10-04

Following a massive four-year transformation, involving the divestiture of two-thirds of the business and a repositioning of the company's overall core strategy, October 4th marks the creation of Wolfspeed. The company, formerly known as Cree, officially launches under its new name with the support of a comprehensive, multi-channel, integrated marketing campaign. Wolfspeed has served as the brand for the company's Silicon Carbide materials and semiconductor devices business unit for the past six years. Built on a 30-year heritage of domain expertise, the name Wolfspeed conveys both the noble traits of the wolf – leadership, intelligence and endurance – and speed, characterized by the pace at which the company innovates and operates, both unmatched in the industry. "Today officially marks a transformative milestone for Wolfspeed as we are now a pure-play global semiconductor powerhouse," said Gregg Lowe, CEO at Wolfspeed. "The next generation in power semiconductors will be driven by Silicon Carbide technology, with superior performance that unleashes new possibilities and positive changes to the way we live. As the original champion of this technology, we couldn't be more excited for what lies ahead." Lowe joined the company in September 2017 with a vision and commitment to a more collaborative culture built on ingenuity and a mission to pursue a more efficient future. Now, with multi-year, long-term materials agreements totaling more than $1.3 billion across several industries, a device pipeline that totals more than $15 billion, and an increased production capacity 30X larger than previous facility plans, Wolfspeed is driving multiple industries through a monumental shift from silicon to Silicon Carbide.

Webpage-Launched Simulator Available
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Learn more:
vincotech.com
  • Product Release
  • 2021-10-01

The latest in a long line of Vincotech simulation environments, VINcoSIM is the first simulator to launch from a webpage. It features topology modeling and an accurate, proven loss and temperature calculation engine. Users can even define custom heatsink builds in a one-step configuration. A click or two is all it takes to quickly assess the options and choose the best fit. "This tool is a great leap forward," says Vincotech CEO Eckart Seitter. "As a reliable partner, we aim to bring speed and flexibility to our business relationships. Part of that is helping customers make fast but well-informed decisions. We have always gone to great lengths to provide accurate, reliable simulation tools. And VINcoSIM is our most powerful and convenient power module selection tool yet." The company's first ISE simulation tool debuted 20 years ago, setting a benchmark for customer support in the power module business. Drawing on two decades' experience advancing the state of the art in simulation tools, the company has now created an easy-to-use environment to rapidly test and evaluate any of its power modules, regardless of sub-topology or components. No compromises in functions or features is demanded. Designed to fast-track simulations, VINcoSIM configures automatically when the user selects a product on the website. It is the only tool of its kind to simulate any type of topology, even the most advanced. VINcoSIM runs on substantiated data from measurements taken in high-tech labs. It is reliable; its results are accurate.

Facilities with 200kW Dyno and 250 kW DC Power Supply
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Learn more:
pre-switch.com
  • Industry News
  • 2021-09-30

Pre-Switch has expanded into a new facility. The premises will support the next phase of the company's growth and accelerate the application of the Pre-Switch technology which extends the range of e-mobility applications including EVs, electric aircraft and electric boats and other watercraft. The technology has been licensed and delivered via the CleanWave inverter reference design to leading e-mobility innovators around the world. Pre-Switch's new facility, in San Jose, California, has been outfitted with a 200kW dynamometer, a 250kW DC power supply and high precision efficiency test stations that have been custom-built to precisely measure inverter efficiencies above 99%.  This new and valuable resource will enable customers to experience the gains that can be achieved by running their inverters at 100kHz with virtually zero switching losses, and measure the motor efficiencies that result from the higher quality sine wave generated by the faster switching frequencies. Bruce Renouard, Pre-Switch CEO explains: "Inverter efficiency is vital, but in many applications, motor efficiency, especially at low torque where the motor mainly operates, is even more important. Only our soft-switching technology can deliver both, unlike hard-switching techniques which cannot get close to matching our system efficiency levels."

Josef Vissing Named President
  • People
  • 2021-09-30

TDK Corporation announced that effective October 1, 2021, Josef Vissing  (57) has been named President of TDK Europe GmbH, the company's European sales organization for passive components. He thus succeeds Ludger Trockel (57), who will take over the role as Head of Sales & Marketing Group of TDK Corporation's Electronic Components Business Company in Japan, Tokyo. TDK Europe's management team also includes Oliver Huettner (49). Huettner, Executive Vice President, will serve as the TDK Europe Head of Business Administration. The two are in full agreement: "TDK Europe's established set-up enables us to offer the best support for our European customers with a unique product portfolio centered on TDK's three key markets, Automotive, Industrial & Home Appliance and Communications. We aim to continue to grow the business together with our customers and support the growth strategies of TDK Corporation related to digital transformation and energy transformation of our society." Josef Vissing has held a number of sales positions at TDK Europe and EPCOS AG, since he joined the company in 1991 with a Diploma degree in industrial engineering. Since then, Vissing has acquired many years of business experience, among others as Head of Product Marketing for Ferrites, Head of Business Unit Transfomers and as CEO and President of EPCOS (Zhuhai) Co. in China. In 2012 he was named Head of Sales GNS (Germany, Netherlands, Switzerland) for EPCOS AG and in this capacity has been responsible for one of the company's most important sales regions.

Wireless Charging Transmitter Solutions
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Learn more:
aosmd.com/pdf
  • Product Release
  • 2021-09-30

Alpha and Omega Semiconductor announced a family of Coil Drivers. The initial product, AOZ32033AQI, offers 30V, 11mOhm in a QFN3x3 package. AOZ32033AQI is an integrated half-bridge gate driver capable of driving high-side and low-side N-channel MOSFETs. It features SRC (Slew Rate Control) to adjust sink/source current and provide the ideal trade-off between efficiency and EMI optimization in the design of Wireless Charging Transmitter (TX) circuits. The device is ideally suited to the design of Wireless Charging TX circuits used in cordless power tools, vacuum cleaners, drones, and other consumers' electronic equipment composed of full-bridge topology with a resonant tank circuit to get the best power conversion efficiency. With a highly integrated package, the AOZ32033AQI offers a part count reduction of up to 40% compared to traditional approaches. The device enables PCB space savings and higher performance in wireless transmitter circuits with high wattage of up to 30W. Moreover, the AOZ32033AQI has multiple protection functions such as high side and low side UVLO and over-temperature protection (OTP) to make the design more robust. The device can be used for a wide range of input voltages from 4V to 28V. "Wireless charging is offered at increasingly higher power levels as the benefits of eliminating physical connectors and cables are being realized by more end applications. AOS's Coil Driver products provide an efficient, power-dense, and cost-effective solution for wireless charging TX circuits. The integrated approach offers protection features not possible by using a discrete approach while reducing engineering design cycles and complexities," said Colin Huang, Power IC Marketing Manager at AOS.

Charger Delivers 100km of Range in Less Than Three Minutes
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Learn more:
abb.com
  • Product Release
  • 2021-09-30

ABB is launching an all-in-one Electric Vehicle (EV) charger, which provides the fastest charging experience on the market. ABB's Terra 360 is a modular charger which can simultaneously charge up to four vehicles with dynamic power distribution. This means that drivers will not have to wait if somebody else is already charging ahead of them. They simply pull up to another plug. The charger has a maximum output of 360 kW and is capable of fully charging any electric car in 15 minutes or less, meeting the needs of a variety of EV users, whether they need a fast charge or to top their battery up while grocery shopping. "With governments around the world writing public policy that favors electric vehicles and charging networks to combat climate change, the demand for EV charging infrastructure, especially charging stations that are fast, convenient and easy to operate is higher than ever," said Frank Muehlon, President of ABB's E-mobility Division. "The Terra 360, with charging options that fit a variety of needs, is the key to fulfilling that demand and accelerating e-mobility adoption globally." "It's an exciting day for ABB, who as the global leader in electric vehicle fast charging, is playing a key role in enabling a low carbon society," said Theodor Swedjemark, Chief Communications and Sustainability Officer at ABB.

Power Integrity Solution for Analog, Digital and Mixed-Signal IC Designs
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Learn more:
siemens.com
  • Product Release
  • 2021-09-28

Siemens Digital Industries Software introduced mPower power integrity software for analog, digital and mixed signal IC designs. The software is an IC power integrity verification solution to provide virtually unlimited scalability for analog, digital, and mixed signal ICs, enabling comprehensive power, electromigration (EM) and voltage drop (IR) analysis for even the largest IC designs. The mPower power integrity solution completes Siemens' overall electro-physical signoff suite addressing power, performance, and reliability analysis. Other offerings in this suite include Calibre PERC software, PowerPro software, HyperLynx software, and the Analog FastSPICE platforms. With this comprehensive signoff suite, designers can now use an all-Siemens power integrity design flow. "Design companies must run both block and full-chip EM/IR analysis to confirm that the power grid delivers the necessary current to the devices, and that wires will not fail prematurely," said Joe Sawicki, executive vice president for Siemens' IC EDA Segment. "With our innovative mPower solution, companies now have a fast, scalable dynamic analysis option for analog, digital and mixed signal layouts of any size, as well as silicon-proven accuracy and fast turns for even the largest digital chips."

Semiconductor R&D and Test Open Laboratory
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Learn more:
keysight.com
  • Industry News
  • 2021-09-27

Keysight Technologies and National Central University Optical Sciences Center (NCUOSC) announced a collaboration to improve the design and test validation efficiency of gallium nitride (GaN) and silicon carbide (SiC) applications, accelerating the pace of 5G and electric vehicle (EV) innovation. Wide band gap (WBG) materials, such as GaN and SiC, offer rapid switching speeds, low loss and withstand high temperature and voltage characteristics. As a result, these materials are leveraged in consumer power products, fast charging, electric vehicles and rail transit, as well as 5G infrastructures and data center servers. However, these advantages increase the complexity of design and testing. NCUOSC successfully used Keysight's PD1500A Dynamic Power Device Analyzer/Double Pulse Tester (DPT) platform to establish a third generation WBG semiconductor open laboratory to improve developing and testing efficiency. As the JEDEC, a global leader in developing open standards and publications for the microelectronics industry, continues to define the dynamic testing of WBG devices, standardized tests are starting to emerge. The Keysight PD1500A DPT determines the key performance parameters, which match all standards, such as turn-on/off and switching characteristics, dynamic on-resistance, dynamic current and voltage, as well as reverse recovery, gate charge and device output characteristics. "Keysight is happy to work with NCUOSC to help engineering teams characterize, understand, integrate, deploy and drive innovations for next-generation semiconductor technologies," said Thomas Goetzl, vice president and general manager of Keysight's Automotive and Energy Solutions business unit.

Entire Capacitor Portfolio on One Website
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Learn more:
cde.com
  • Industry News
  • 2021-09-27

Cornell Dubilier has brought its Illinois Capacitor brand capacitors to cde.com. Now engineers can view the entire portfolio of CDE and IC capacitors for power electronics applications on one site. This includes such specialized products as IC's supercapacitors, conduction-cooled (high density resonant) capacitors, rechargeable coin cell batteries, and other new additions. CDE's updated parametric search tools simplify the capacitor selection process as never before. As Illinoiscapacitor.com has now been shut down, links to that site will be automatically redirected to cde.com. In addition to combining product data, the site's Tech Center has been expanded to include additional engineering resources, such as application guides, capacitor formulas, tutorials, and a detailed glossary of terms. CDE will continue to support all IC branded products, which are available from major distributors and the company's representative network.

3kW AC/DC PSU for Power Supply Applications
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Learn more:
gan-systems.com
  • Product Release
  • 2021-09-23

GaN Systems introduced a high efficiency, highest power density 3kW Bridgeless Totem Pole (BTP) PFC + LLC Resonant Converter Power Supply Unit (PSU) that exceeds the 80 PLUS Titanium standard. The combined GaN BTP-PFC with GaN LLC resonant converter enables designers to create lower-cost power supplies that meet demands to deliver more power in a smaller footprint and new energy efficiency requirements, including European Union's "Lot 9" 2023. "With the expanding volume of data, game-changing solutions are needed to reduce energy consumption and contribute to a more sustainable future in our data centers, and these PFC and LLC reference designs take PSUs to the next level," says Paul Wiener, VP of Strategic Marketing at GaN Systems. New efficiency mandates, increasing power and data demands, and the shift to "Dollar per Density," where density is a measure of size and power of the power supply, spur the immediate need to change data center economics with smaller, more efficient, and reliable power supply design. GaN brings higher efficiency, higher power density, lower cost, and increased sustainability to the data center ecosystem. GaN Systems concluded that significant energy and cost savings are achieved by switching from silicon-based PSUs to GaN-based PSUs. Since data centers vary in size, the savings are based on a 10-Rack unit of measure. From a sustainability perspective, each set of 10 racks reduces CO2 emissions by 100 metric tons per year, and financially, GaN-based PSUs increase data center profits by $3 million per year.    

300mm, High-Temp Single-Wafer SPM
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Learn more:
acmrcsh.com
  • Industry News
  • 2021-09-23

ACM Research announced it has shipped its first 300mm single-wafer Sulfuric Peroxide Mixture systems (Single-Wafer SPM tool) for wet clean and etch processes in advanced logic, DRAM and 3D-NAND integrated circuit manufacturing. ACM's Single-Wafer SPM tool targets high ion dose doped photoresist (PR) wet strip processes, with support for metal etch or strip processes. This tool extends ACM's SPM product offering to include higher temperature SPM steps that are emerging for more advanced production nodes at 10nm and beyond. "ACM's Single-Wafer SPM tool builds on the proven performance of our Ultra C Tahoe, which addresses most SPM process steps that operate at regular temperatures," said Dr. David Wang, Chief Executive Officer and President of ACM Research. "We have leveraged Tahoe's proven capabilities to develop the Single-Wafer SPM tool, strengthening our wet cleaning portfolio with the addition of high-temperature SPM. Together, the Tahoe and Single-Wafer SPM tools address virtually all SPM processes currently deployed in advanced semiconductor manufacturing.   We continue to develop new process capabilities, including advanced hot isopropyl alcohol (IPA) drying and super critical CO2 dry technologies, with the goal of becoming a major global cleaning solution provider."

AEC-Q200 Qualified Thick Film Chip Resistor
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Learn more:
vishay.com
  • Product Release
  • 2021-09-22

Vishay Intertechnology announced that it has enhanced the Vishay Draloric RCC1206 e3 thick film chip resistor in the 1206 case size with a higher power rating of 0.5 W. Offering twice the power of standard thick film chip resistors in this size, the RCC1206 e3 can be used in place of two parallel 1206 devices or a single device in the larger 1210 case size. This allows designers to save board space in automotive, industrial, telecommunications, and medical applications, while lowering component counts and reducing placement costs. AEC-Q200 qualified, the RCC1206 e3 features a resistance range from 1 O to 1 MO -and 0 O jumper - with tolerances of ± 1 % and ± 5 % and TCR of ± 100 ppm/K and ± 200 ppm/K. The resistor offers an operating voltage of 200 V and an operating temperature range of -55 °C to +155 °C. RoHS-compliant and halogen-free, the device is suitable for processing on automatic assembly systems, and wave, reflow, or vapor phase soldering per IEC 61760-1.

Wireless BMS in Lotus Electric Vehicles
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Learn more:
analog.com
  • Industry News
  • 2021-09-22

Analog Devices announced that renowned British performance brand Lotus Cars is planning to incorporate ADI's wireless battery management system (wBMS) in its next-generation electric vehicle (EV) architecture. ADI's wBMS was selected for its increased design flexibility, battery repairability and lighter weight. The engineering collaboration will enable Lotus to safely propel its future EV fleet and continue pushing the limits of design and technology. ADI's wBMS technology eliminates the traditional wired harness, leading to a reduction of up to 90% in the wiring and 15% of the volume in the battery pack. It also improves design flexibility and manufacturability, without compromising range and state of charge accuracy over the life of the battery. ADI's wBMS enables simplified assembly and disassembly of battery packs to ensure faulty battery cells can be removed and repaired quickly and efficiently. "We worked closely with Analog Devices to integrate wBMS into our new Lightweight Electric Vehicle Architecture (LEVA), which will be the basis for all future Lotus EVs," said Richard Lively, Director, Propulsion and Chassis Engineering, Lotus Cars. "The removal of the wire harness for wBMS ensures that Lotus can offer a lightweight solution that optimizes performance and is consistent with our brand of delivering powerful performance cars with exceptional handling."

Joint Venture to Manufacture and Sell Lithium-ion Dry-Process Battery Separators
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Learn more:
polypore.com
  • Industry News
  • 2021-09-22

Polypore International and Shanghai Energy New Materials Technology reached agreement in January 2021, through their respective subsidiaries, to establish a joint venture (JV) in China for dry-process membrane separator for lithium-ion batteries (LIBs). The necessary regulatory approvals are complete, and the JV has been established as Jiangxi Enpo New Materials in Gaoan City, Jiangxi Province, People's Republic of China. Based on a license from Polypore's subsidiary Celgard, LLC (Celgard) for technology and intellectual property related to dry-process polypropylene (PP) separator, the JV will manufacture and sell quality, high-performance dry-process separator in China for LIBs used in energy storage systems (ESS) and electric-drive vehicles (EDVs). Production is scheduled to start in 2022 with PP membrane capacity of 100 million m2/year. In the joint venture, PPO Energy Storage Materials HK Ltd. will have 49 percent of the equity contribution and SEMCORP will have 51 percent. "By joining Celgard's specialized knowledge in technology, processing, and material science together with SEMCORP's operational expertise in China, the joint venture will not only provide a wide range of solutions to customers but also stimulate further development of the LIB industry overall," said Celgard president, Lie Shi. "I am thrilled to begin this partnership with SEMCORP. The combination of our two companies' strengths will provide new solutions for the world's challenges related to the environment and energy."

APEC 2022 Sponsors Continue Student Attendance Support Program
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Learn more:
apec-conf.org
  • Event News
  • 2021-09-22

The joint sponsors of the Applied Power Electronics Conference (APEC) have announced the continuation of the popular Student Attendance Support Program for APEC 2022, scheduled to take place in Houston, March 20-24. Chosen recipients of the program will receive reimbursement to cover qualified expenses for attending APEC 2022. Those eligible to apply for the program are power electronics students, undergraduate or graduate, who have been accepted to present papers at the upcoming conference in March (notification of paper acceptance is by Oct. 27, 2021.) Once accepted, student presenters must apply for the Student Attendance Support Program by November 7, 2021. In its 17th year, this popular program was initiated by the Power Sources Manufacturers Association (PSMA). It is now jointly underwritten by PSMA and the other co-sponsors of the APEC conference: the IEEE Power Electronics Society (PELS) and the IEEE Industry Applications Society (IAS). The recipients of the Student Attendance Support Program will be chosen by the APEC 2022 Student Attendance Support Committee.

Funding Round to Revolutionize Magnetics with AI Technology
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Learn more:
frenetic.ai
  • Industry News
  • 2021-09-22

The Madrid-based company Frenetic announced its closing of a €4.5 million funding round from Bonsai Partners (Spain) and Join Capital (Germany), which boosts existing support from 42Cap (Germany), Big Sur Ventures (Spain) and Bankinter (Spain) from 2019. Frenetic's AI technology has been trained to accurately design both magnetic and electronic components essential for the development of electric vehicles. In addition, through its unique technology and stock search, Frenetic tackles issues involving scarcity of chip supplies and magnetic components. The company plans to utilize this funding round to continue expansion in the US and Germany. Frenetic was founded with the goal of making magnetics simple and accessible. It is now revolutionizing the world of magnetics through AI, aiming to entirely replace outdated engineering models used in a wide range of cases - from electric chargers to space travel. Frenetic validated its technology through participation in the 2020 'Accelerator Pilot' – a program from the European Commission dedicated to the empowerment of European companies, and in which only 0.1% of applications receive community support. Chema Molina, Frenetic's CEO, who founded the company in 2018, says of the round: "This latest funding from Join and Bonsai will allow us to expand in the US and German markets with local subsidiaries, and ultimately be closer to customers. Likewise, we will be able to strengthen our relationships with manufacturers."

Wide-Input DC to DC Converter Line
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Learn more:
acopian.com
  • Product Release
  • 2021-09-21

Acopian launched their encapsulated wide input DC to DC Converter line of power supplies rated up to 60W. Wide-range DC inputs are set at 9-18 VDC, with output voltages ranging from 3.3 VDC to 48 VDC and up to 8A. Threaded mounting holes permit them to be mounted to a chassis, cabinet wall or bracket, they can be DIN RAIL mounted or they may be used on a test bench or tabletop. Touch safe terminal blocks provide easy connection without the need for sockets or soldering. Input/Output isolation prevents ground loops, and permits the use of inputs of either polarity; outputs of single output models may be used in either polarity and floated up to 500 volts above the input. Standard features include OVP internal protection, Input/Output isolation, short circuit protection and ability to operate in series. Optional output indicator (DC ON LED) and voltage adjust potentiometer are also available. Thermal protection and rugged encapsulated construction assure years of reliable service. These DC to DC converters are suitable for use in a broad range of applications including automotive, ATE, OEM, military and industrial/manufacturing applications.

Technologists Recognized with Industry Honors for Advancements in Semiconductor Materials
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Learn more:
dupont.com
  • People
  • 2021-09-21

DuPont Electronics & Industrial announced that three of its scientists in its Semiconductor Technologies business group have recently been honored with industry recognitions for their work in developing materials for advanced semiconductor fabrication. In July 2021, Emad Aqad, Ph.D., was recognized with the 2020-2021 Asian American Most Promising Engineer of the Year Award. The Asian American Engineer of the Year Award (AAEOY) program is a recognition established to honor the most distinguished US-based professionals for their leadership, technical achievements and public service. In August 2021, Alaaeddin Alsbaiee, Ph.D., was named to the 2021 Chemical & Engineering News' (C&EN) Talented 12.? The C&EN Talented 12 program recognizes early career scientists who are making their mark on industry and global challenges. Most recently, Jae Hwan Sim, Ph.D., was named an International Fellow of the Industrial & Engineering Chemistry (I&EC) Division of the American Chemical Society (ACS). The I&EC Division of ACS has a focus on helping individuals convert science into commercially relevant products. "These prestigious third-party recognitions are a true testament to the caliber of our talent globally and their wide-reaching industry impact," said Cathie Markham, vice president of R&D, DuPont Electronics & Industrial. "We are incredibly proud of the achievements of all three of these individuals, and the passionate spirit that they bring to our teams in driving the development of novel materials and continued enhancements for semiconductor fabrication."

Tiny Power Management IC for Wearables and Hearables
  • Product Release
  • 2021-09-21

The MAX77659 single-inductor multiple output (SIMO) power management IC (PMIC) with integrated switch-mode buck-boost charger from Analog Devices charges wearables, hearables and Internet of Things (IoT) devices faster and in less space than any other PMIC available today. The MAX77659 SIMO PMIC delivers over four hours of play time after a short, ten-minute charge, and uses a single inductor to power multiple rails, reducing the bill of materials (BOM) by 60 percent and shrinking total solution size by 50 percent. The MAX77659 SIMO PMIC integrates a switch-mode buck-boost charger and three independently programmable buck-boost regulators, all sharing a single inductor to minimize total solution size. The regulators extend battery life by operating at 91 percent efficiency during moderate to heavy load conditions while consuming only 5µA of quiescent current during light load conditions. The MAX77659 SIMO PMIC supports autonomous headroom control, which reduces heat dissipation by minimizing the voltage drop while providing enough headroom to regulate the charging current. "Analog Devices' SIMO product technology shrinks size and boosts performance in the smallest of hearable and wearable devices," said Roger Yeung, Executive Business Manager for the Battery Power Solutions Business Unit at Maxim Integrated, now part of Analog Devices. "The MAX77659 brings the 'on-the-go' lifestyle to the next level by minimizing plug-in time and maximizing play time. The MAX77659 PMIC frees up board real estate to pack in additional features such as expanded memory storage, location tracking and vital sensing demanded by today's portable consumer and medical devices."

eGaN FET for Telecom, Netcom, and Computing Solutions
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Learn more:
epc-co.com
  • Product Release
  • 2021-09-21

Efficient Power Conversion Corporation advances the performance capability of low voltage, off-the-shelf gallium nitride transistors with the introduction of the EPC2069 (1.6 m? typical, 40 V) eGaN FET. The EPC2069 is ideal for applications with demanding requirements for high power density performance including 48 V – 54 V input servers. Lower gate charges and zero reverse recovery losses enable high frequency operation of 1 MHz, and beyond, at high efficiency in a tiny 10.6 mm2 footprint for state-of-the-art power density. The EPC2069 can support 48V – 12V DC-DC solutions ranging from 500 W to 2 kW and exceed 98% efficiency. The use of eGaN devices in both the primary side and the secondary side are required to achieve maximum power density > 4000 W/in3. According to Alex Lidow, EPC's co-founder and CEO, "The EPC2069 is perfectly designed for the secondary side of the LLC DC-DC converter from 40 V – 60 V to 12 V, which is becoming very common for the new 48 V – 54 V input servers required for high density computing applications such as artificial intelligence and gaming. This 40-volt device offers both smaller size and reduced parasitics compared with previous-generation 40 V GaN FETs and at lower cost."

GaN Technology in Server Power Supplies for Data Centers
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Learn more:
ti.com
  • Industry News
  • 2021-09-20

Texas Instruments announced its gallium nitride (GaN) technology and C2000 real-time microcontrollers (MCUs) are being combined with Delta Electronics' power electronics expertise in the design of an enterprise server power-supply unit (PSU) featuring an 80% improvement in power density with 1% better efficiency - up to 99.2% - for data center applications, compared to enterprise server power supplies using a traditional architecture. A 1% improvement equals 1-megawatt (or 800 households) total cost of ownership savings per data center, according to Energy Innovation. Delta Electronics chose TI due to its decade-long investment in GaN technology as well as its real-time control solution with C2000 MCUs. TI uses innovative semiconductor manufacturing processes to manufacture GaN-on-silicon technology and integrated circuits (ICs) to help companies such as Delta Electronics create differentiated applications to more efficiently power data centers around the world. "Our passion at TI is to create a better world by making electronics more affordable through semiconductors, and our GaN technology enables a whole new world of higher efficiency and smaller, more reliable solutions," said Steve Lambouses, vice president for High Voltage Power at TI. "In addition to technology investments, TI's investments in internal manufacturing will allow new technologies like GaN to scale quickly and support customers like Delta."  

Metal Enclosed AC/DC Power Supplies
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Learn more:
tracopower.com
  • Product Release
  • 2021-09-20

The Traco TXLN line comprises a series of metal enclosed AC/DC power supplies ranging from 18 to 960 Watt (split into 12 different power levels) and is designed for a wide range of industrial applications. The TXLN is an active replacement of the older TXL line and is built on the same design principals to make the transition to the TXLN series as easy as possible. The model selection includes single, dual as well as triple output solutions to cover different applications requirements. With a low-profile metal case and screw terminal block connection, they are easy to install in any equipment. Up to the 200 Watt models the TXLN power supplies are completely convection cooled and from 320 Watt and above they come with an internal fan. Above 100 Watt an active PFC (>0.95) function is added to the standard feature pool. All models in the TXLN line have universal input and comply with the latest industrial standard IEC/EN/UL 62368-1, European EMC standards and the Low Voltage Directive (LVD).

Silicone-Free Liquid Thermal Gap Filler for High Voltage Applications
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Learn more:
henkel.com
  • Product Release
  • 2021-09-20

Henkel announced the commercial launch of Bergquist Gap Filler TGF 3000SF, the latest in the company's line of silicone-free thermal interface materials (TIMs). With significantly higher thermal conductivity than any previous silicone-free liquid formulation in its portfolio and delivering impressive dielectric strength, Henkel's material extends wider market opportunities and production flexibility to manufacturing operations that require avoidance of silicone outgassing. A liquid, two-part, 3.0 W/m-K silicone-free TIM, Bergquist Gap Filler TGF 3000SF offers high-reliability performance for a variety of applications where silicone sensitivity is a concern. These include industrial automation systems; power conversion technologies such as motor drives and power supplies; automotive infrastructure EV charging devices; and, computers and peripherals, to name a few. With high dielectric strength at >10 kV/mm and good volume resistivity, Bergquist Gap Filler TGF 3000SF is suitable for higher voltage applications, while also providing high-reliability thermal performance at operating temperatures ranging from -40° C to 100° C. Exhibiting extremely low assembly stress, the liquid TIM is ideal for use with sensitive components and/or printed circuit boards with intricate architectures. Productivity is also a central attribute of Bergquist Gap Filler TGF 3000SF. The silicone-free liquid TIM is conducive to mass production environments where fast dispensing is necessary to achieve high UPH objectives; it dispenses at a rate of 1.5 cc/sec. With a 1:1 mixing ratio, the material can be stored at room temperature and is easily processed.

Configurable Digital Gate Driver for Silicon Carbide MOSFETs
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Learn more:
microchip.com
  • Product Release
  • 2021-09-20

To complement its broad portfolio of silicon carbide MOSFET discrete and module products, Microchip Technology announced a 1200V production-ready digital gate driver, providing system developers with multiple levels of control and protection for safe, reliable operation and qualified to stringent transportation requirements. For designers of silicon carbide-based power conversion equipment, Microchip's AgileSwitch 2ASC-12A2HP 1200V dual-channel digital gate driver with its Augmented Switching  technology is production qualified and fully configurable. To ensure reliable, safe operation, the 2ASC-12A2HP gate driver provides multiple levels of control and a higher level of protection for silicon carbide MOSFET-based power systems. When compared to conventional gate drivers, key performance attributes of the AgileSwitch gate driver products include the ability to dampen drain-source voltage (Vds) overshoots by up to 80% and slash switching losses by as much as 50%. The 2ASC-12A2HP digital gate driver can source/sink up to 10A of peak current and includes an isolated DC/DC converter with low capacitance isolation barrier for pulse width modulation signals and fault feedback. Microchip's 2ASC-12A2HP gate driver is compatible with the company's latest release of the Intelligent Configuration Tool (ICT). This interface allows users to configure gate driver parameters including the gate switching profiles, system critical monitors and controller interface settings. The result is a gate driver that is tailored to their applications without having to change hardware, helping to speed development time from evaluation through production and enabling designers to change control parameters during the design process. The ICT, which is a free-of-charge download, can save designers approximately three to six months of development time on new designs.                                                     

MEMS Capacitive Accelerometer Chips
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Learn more:
silicodesigns.com
  • Product Release
  • 2021-09-19

Silicon Designs Model 1521 Series industrial-grade, high-stability OEM surface mount accelerometer chips is offered in eight standard ranges from ±2 g to ±400 g. Each features a ±4V differential output and is offered with a choice of either a 20-pin LCC or J-lead surface mount package, both of which are Nitrogen gas-damped, hermetically sealed and RoHS compliant. The distinguishing feature of the Model 1521 Series is its integration of a MEMS capacitive sense element, together with both an amplifier and internal temperature sensor. The MEMS capacitive sense element of the Model 1521 Series provides long-term measurement stability (+5 VDC, 5 mA power typical), reliable operation, durability, 5,000 g shock survivability and zero signal degradation. The Series is designed for zero-to-medium frequency testing and instrumentation applications requiring extremely low noise (with 7 µg/vHz typical for 2 g full-scale versions) and long-term stability. As such, they can respond to frequencies from zero (DC) to 2000+ Hz and can reliably perform over a standard operating temperature range of -55°C to +125°C.

PCIM Asia 2021: Successful Conclusion in Shenzhen
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Learn more:
pcimasia-expo.cn
  • Event News
  • 2021-09-17

PCIM Asia was held successfully from 9 – 11 September at the Shenzhen World Exhibition & Convention Center, the change in venue and location marking a new chapter in the fair's history. Born from the highly successful PCIM Europe trade fair first held in 1979, over the course of 20 years the fair has grown to become the leading event for power electronics in Asia. Now in its new home in Shenzhen, the oft-dubbed 'Silicon Valley' of China, benefiting from its location in the Greater Bay Area, proximity to international markets serviced by Hong Kong and the wealth of technical expertise and talent present within the city, PCIM Asia looks well placed to drive the industry forward in the decades to come. Once again PCIM Asia featured a range of thematic zones that explored key areas of the development of power electronics, covering power semiconductor components and modules, electrical devices, passive components and thermal management to test and measurement among other areas. These zones were, namely, the E-mobility Pavilion, Energy Storage Pavilion, Poster Session Area and the University Zone.

Opening of Chip Factory for Power Electronics on 300-Millimeter Thin Wafers
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Learn more:
infineon.com
  • Industry News
  • 2021-09-17

Infineon Technologies officially opened its high-tech chip factory for power electronics on 300-millimeter thin wafers at its Villach site in Austria under the motto "Ready for Mission Future." At 1.6 billion euros, the investment made by the semiconductor group represents one of the largest such projects in the microelectronics sector in Europe. The Villach site is one of the world's most modern fabs and was opened by Infineon CEO Reinhard Ploss, Infineon Austria CEO Sabine Herlitschka along with EU Commissioner Thierry Breton and Austrian Chancellor Sebastian Kurz. Infineon set the stage for long-term, profitable growth based on energy efficiency and CO 2 reduction at an early stage and announced the construction of the chip factory for power electronics ("energy-saving chips") in 2018. "The new fab is a milestone for Infineon, and its opening is very good news for our customers," Ploss said. "The timing to create new capacity in Europe could not be better, given the growing global demand for power semiconductors. The last few months have clearly shown how essential microelectronics are in virtually every area of life. Given the accelerated pace of digitalization and electrification, we expect demand for power semiconductors to continue to grow in the coming years. The additional capacities will help us serve our customers worldwide even better, including long term."

High-Temperature, Automotive-Grade Polymer Chip Capacitors
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Learn more:
kyocera-avx.com
  • Product Release
  • 2021-09-16

AVX Corporation released the TCO Series high-temperature, automotive-grade polymer chip capacitors, which are rated for operating temperatures up to 150°C at category voltage and meet AEC-Q200 Stress Test Qualification for Passive Components requirements, which ensure stable performance at 85°C, 85% relative humidity, and rated voltage for up to 1,000 hours. Based on AVX's field-proven TCQ Series automotive polymer capacitors, the new TCO Series chip capacitors are manufactured in an IATF-16949-certified facility and feature robust J-lead constructions comprised of tantalum anodes, tantalum pentoxide (Ta2O5) dielectrics, and conductive polymer electrodes that exhibit a benign failure mode under recommended use conditions. The series also exhibits low DCL (0.1CV) and basic reliability of 1% per 1,000 hours at 85°C and rated voltage with 0.1O/V series impedance and 60% confidence, and is ideally suited for use in high-temperature, low- and medium-power automotive, industrial, and telecommunications applications. TCO Series capacitors are currently available as D-case (EIA Metric 7343-31) components rated MSL 3 per J-STD-020 and for 10µF ±20% tolerance, 50VDC at 105°C, a maximum of 50µA DCL, 150mO maximum ESR at 100kHz, and operating temperatures extending from -55°C to +150°C, but several other codes are actively in development.

Inductor Series for Medical Imaging and Other Magnetic-Sensitive Applications
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Learn more:
gowanda.com
  • Product Release
  • 2021-09-16

Gowanda Electronics announces the introduction of a non-magnetic RF thru-hole (leaded) inductor series – 28MG. This series is ideal for use in medical imaging equipment and other applications where magnetic materials must be avoided. The series was designed to address the market need for non-magnetic inductors that could achieve inductance values of up to 18 µH for use in Magnetic Resonance Imaging (MRI) equipment, specific types of X-ray equipment and other applications where the presence of magnetic materials could compromise system performance. This includes applications in telecommunications, security systems, instrumentation, laboratory analysis equipment, aviation equipment, navigation equipment and electronic test equipment. The performance range provided by the 60 discrete parts within the 28MG series includes Inductance from 1.2 µH to 18 µH, DCR Ohms from 0.079 to 4.15 and Current Rating mA DC from 315 to 2400. All of Gowanda's non-magnetic surface mount and thru-hole inductors, including this new 28MG series, provide relative permeability of = 1.00003. The operating temperature range for the 28MG series is -55°C to +125°C. The 28MG inductors are epoxy encapsulated for environmental protection and superior strength to withstand all types of reflow soldering. Standard terminations are SnPb; RoHS-compliant terminations are provided when "LF" is specified.

Switched Capacitor Intermediate Bus Converter for 48 V Data Center Applications
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Learn more:
infineon.com
  • Product Release
  • 2021-09-16

Flex Power Modules introduces the BMR310, a non-isolated switched capacitor intermediate bus converter (IBC) which provides high power density for data centers, thus improving board space utilization and freeing space for other components. Built on the proprietary Zero voltage switching Switched capacitor Converter (ZSC) technology of Infineon Technologies, the BMR310 achieves efficiency of over 98 percent at half load and can deliver power up to 875 W continuous in a compact package. It operates over an input voltage range of 40 V to 60 V, and delivers an unregulated output voltage of 10 V to 15 V. For data centers and high-performance computing (HPC) applications, there is a growing trend to move away from 12 V and adopt 48 V power distribution to reduce distribution currents and power losses. To meet this increasing demand, the Infineon ZSC delivers the highest efficiency and power density for applications using 48 V to generate an intermediate bus voltage. This is achieved through capacitive energy transfer with soft switching of the power MOSFETs, and therefore enables an easy and low-risk migration path for legacy 12 V systems to a 48 V infrastructure at significantly reduced total cost of ownership (TCO). The BMR310 is mounted horizontally with a height profile of 10.3 mm, making it suitable for systems with limited space due to large heatsinks or cold plates. It measures 58.4 mm x 25.0 mm x 10.3 mm (2.3 x 0.98 x 0.41 in). The current mounting option is base-plated but an open frame will be available with future models. To maximize operating lifespan, the BMR310 includes over-voltage, under-voltage, over-current and over-temperature protection function.

ICs for Automotive Satellite Camera Modules
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Learn more:
rohm.com
  • Product Release
  • 2021-09-15

ROHM developed SerDes ICs (BU18xMxx-C series) and a PMIC (BD86852MUF-C) ideal for vehicle satellite camera modules for Advanced Driver Assistance Systems (ADAS). The products not only solve issues concerning the miniaturization and low power consumption of modules, but also provide features such as low electromagnetic noise (EMI) that reduces development time. Both products utilize a spread spectrum function to reduce EMI. This also simplifies EMI countermeasures, which often require significant man-hours during the design of automotive applications. The BU18xMxx-C SerDes IC optimizes the transmission rate based on video resolution, making it possible to reduce power consumption by 27% over general products. At the same time, the built-in spread spectrum function reduces the EMI peak by 20dB, while an integrated video sticking detection function improves the reliability of the entire ADAS system by detecting frozen images. The BD86852MUF-C PMIC (Power Management IC) for cameras is designed to optimally manage the power supply systems of CMOS image sensors from all major manufacturers. This allows voltage settings and sequence control to be performed with a single IC, reducing mounting area by 41% and contributing to the miniaturization of vehicle camera modules. In addition, a camera PMIC heat concentration distribution circuit can be configured to lower power consumption by achieving a high conversion efficiency of 78.6% that suppresses heat generation.

Isolation Transformer Series Provides Isolation from High Voltage Hazards
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Learn more:
bourns.com
  • Product Release
  • 2021-09-15

Bourns introduced its Model PAD00x-T764 Isolation Transformer Series. These transformers feature functional isolation and a low 0.4 mm profile form factor to simplify isolated power and serial communication signal integrity in CAN, RS-485, RS-422, RS-232, SPI, I2C, and lower power LAN-based applications. The Model PAD00x-T763 Series is ideal for industrial automation, embedded solutions, AC motor drives, system integration, communication PHYs, smart metering, and many other applications requiring low DC power. Bourns Model PAD00x-T764 series was developed for ease of use in maintaining proper communication and necessary isolation between systems. The 3.1 kVAC withstanding voltage provides an isolation barrier from high voltage hazards, such as high voltage batteries. Design details include construction with a ferrite toroid core to help ensure a high coupling factor and heightened efficiency. EMI performance is enhanced in the winding of the transformer, enabling reduced emissions. The PAD00x-T764 series is compatible with Texas Instruments SN6501 and SN6506B, Maxim MAX253 and MAX845, Analog Devices ADM2485, and similar transformer drivers. The series offers 3.3 to 5 V input, industry standard 3.3 to 10 V output, and up to 250 mA output with various turns ratios. The Bourns Magnetics product line can also support most modification and customization requests for this push-pull transformer series.

Power Modules Replace Linear Regulators
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Learn more:
we-online.com
  • Product Release
  • 2021-09-15

Würth Elektronik extends its MagI³C-FDSM-36-V family with a 12 V output voltage version. The range of MagI³C-FDSM power modules with 36 V input voltage has been expanded to include a version with 12 V output voltage. The power module in a SIP-3 package represents a cost-effective solution to meet the requirements for the real-world voltage transients of a 24 V industrial power architecture. The module operates from 16 to 36 VIN and generates a fixed output voltage of 12 V with current up to 1 A. The FDSM series MagI³C power modules are fully integrated DC/DC voltage converters with a fixed output voltage. The modules incorporate all of the components needed, like the controller, inductor and input/output capacitors, with the added benefit of thermal overload and short circuit protection. Since there are no external components required for operation, there is essentially no circuit design needed. This reduces development costs and makes it possible to get to market quickly with new applications. This power module has around 95% efficiency while the linear regulator will have an efficiency of 50%. The standard THT housing for easy mounting is pin-compatible with L78x linear controllers. Pre-compliance testing has shown both the radiated and conducted emissions on an evaluation board are below the limits of EMC standards EN55032/CISPR32 Class B.

Automotive Semiconductor Industry: The Wind of Change
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Learn more:
yole.fr
  • Industry News
  • 2021-09-15

"The value of semiconductors, at the chip level, in cars will grow from US$34.4 billion in 2020 to US$78.5 billion in 2026, a 14.75% CAGR." asserts Eric Mounier, PhD, Director of Market Research at Yole Développement (Yole). He adds: "The largest growth will be in EVs due to the major shift to electrification." The market research and strategy consulting company investigates disruptive semiconductor technologies for the automotive sector in depth. Its aim is to point out the latest innovations and underline the business opportunities. These investigations have been developed with Yole's partner, System Plus Consulting. According to Wilfried Théron, Electronic System, Department Director & Quality Manager at System Plus Consulting: "System Plus Consulting's Teardowns uncover innovative design features and new semiconductor components to guide enterprises toward more streamlined solutions in future designs". They provide clients unmatched intelligence into 4 automotive tracks (ADAS, Electrification, Infotainment and Telematics). In addition, Yole released, the 'Automotive Semiconductor Trends 2021' report to provide an in-depth understanding of the changing automotive industry ecosystem and supply chain players. Including market trends and forecasts, take away and outlook, this study proposes key technical insights and analyses about future technology trends and challenges. 

PCNS: The Next Decade on Passive Components will be about Reliability, Sustainability & Materials
  • Event News
  • 2021-09-15

Attendees of the 3rd PCNS Passive Components Networking Symposium that took place on 7-10th September 2021 in Milano, Italy discussed the latest news and trends in passive components. The main theme of the conference was RELIABILITY & SUSTAINABILITY of PASSIVE COMPONENTS that also covered MATERIALS development and PROCESSES. 3rd PCNS was attended by 50 live attendees and 25 virtual attendees from 16 countries including 12 European Countries, Israel, USA and Korea. Theme of the conference "Reliability and Sustainability of Passive Components" was elaborated in workshop on life cycle assessment and addressed by keynotes, invited papers and hot panel discussion. Twenty four full technical papers were presented during two and half PCNS event days covering wide range of passive components including capacitors, resistors, inductors, integrated passives or passive sensors.

Halogen-Free Flame-Retardant Polyamide
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Learn more:
asahikasei.group
  • Product Release
  • 2021-09-14

Asahi Kasei is introducing the halogen and red-phos-phorous free flame retardant Polyamide 66 LEONA SN to the European market. This semi-aromatic material combines high levels of safety, surface quality and laser printability. The LEONA SN grades are certified with the V-0 flame retardancy at wall thicknesses of 0.75mm according to the UL standard, and achieve 600V, the highest value on the Comparative Tracking Index (CTI). In addition to the flame-retardant and creep-resistant properties, the material features a superior surface quality. This is achieved without additional treatment and coating and even with a glass-fiber content of up to 50%. Another characteristic of this material is its high retention rate of physical properties in a conditioned state. While comparable halogen-free PA66 materials show a significant decline in properties, LEONA SN maintains a high level of tensile strength and flexural modulus also after moisture absorption. This opens up new possibilities for applications in environments, where the use of standard FR PA66 can become an issue. Furthermore, LEONA SN provides an excellent laser printability and allows for a clearer surface marking than general materials with red phosphorus in high speed machining of 1000 mm/sec, con-tributing to an increased speed in production.

EMC Community Meets Again
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Learn more:
emv.mesago.com
  • Event News
  • 2021-09-14

From 15 – 17 March 2022, the EMC community will have the opportunity to experience the premiere originally planned for 2020 at the new location in Cologne. "The feedback on Mesago Messe Frankfurt's digital offerings for the EMV was very positive, nevertheless the anticipation for the next face-to-face event and the desire for chance meetings and personal exchange is immense," commented Anthula Parashoudi, Vice President, Mesago Messe Frankfurt. With still six months before the event, the EMV team at Mesago Messe Frankfurt has already been able to allocate 60 percent of the booth space. Around 50 exhibitors have already confirmed their participation in the event in Cologne, including well-known representatives of the EMC industry such as Rohde & Schwarz, Frankonia, and AR Europe. Interested representatives in the EMC industry can still register as an exhibitor at the trade fair in Cologne. More information, such as the exhibitor list and exhibitor registration, is available at e-emc.com.

Semiconductor Capacity Agreement
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Learn more:
gan-systems.com
  • Industry News
  • 2021-09-14

GaN Systems announced the signing of a comprehensive Capacity Agreement with BMW Group for GaN Systems' high-performance, automotive-grade GaN power transistors, which increase the efficiency and power density of critical applications in electric vehicles. GaN power semiconductors are a key ingredient to achieve the small size, lightweight, and high efficiency required in the next generation of high-performance electric vehicles. Under the terms of the agreement, GaN Systems will provide capacity for multiple applications in series production. The guaranteed volumes by GaN Systems are a key building block for reliability in the supply chain for automotive players like BMW. "Electric vehicles represent the future of transportation, and we are delighted to continue to support BMW with our design and production capacity," stated Jim Witham, CEO of GaN Systems. "This multi-$100M agreement demonstrates BMW's commitment to innovation and sustainability." BMW's relationship with GaN Systems began more than four years ago when BMW's engineers found that small size, lightweight, low-cost onboard chargers, DC/DC converters, and traction inverters were enabled by GaN. This led to investment from BMW's venture capital firm, BMW I Ventures, to support and accelerate the automotive qualification of the GaN technology. "The close collaboration among GaN Systems and BMW's engineers has helped to solidify the technology for automotive series production, resulting in the most advanced GaN power transistors in the marketplace today," said Kasper Sage, managing partner BMW i Ventures. "As electric vehicles become more prominent, the demand for critical semiconductor components is only going to increase, thereby making strategic partnerships with suppliers like GaN Systems even more important." 

Sensing and Control Solutions Make Energy Systems Safer
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Learn more:
sensata.com
  • Product Release
  • 2021-09-09

Sensata Technologies introduces an i-BMS Battery Management System for Electrified Applications up to 60V. The brain behind the battery for a diverse range of electric vehicles, the BMS is the intelligent component that monitors and manages lithium-ion battery packs. The i-BMS Battery Management System from Lithium Balance, acquired by Sensata earlier in the year, is a cell chemistry agnostic, compact, integrated BMS developed for the cost-optimized mass-production of applications up to 60V, such as 2-, and 3-wheelers, automated guided vehicles (AGVs), and robotics. The i-BMS is a long-term solution for customers who require the highest levels of safety, performance and measurement accuracy. The solution features key components that are ASIL C Safety rated and self-test capability for safety critical measurement circuits. While measuring only 65 x 200 mm, the i-BMS is equipped with everything required to manage and maintain a battery system without the need for any external components. This includes a built-in pre-charge circuit, on-board current measurement, MOSFET power switches for battery disconnect, and a DC/DC power supply. The i-BMS' software design features parallel pack and hot swap capability, while advanced SoX algorithms ensure high precision. Using the BMS Creator configuration software, the i-BMS allows the battery designer to create a unique battery by defining application-specific BMS parameters and safety strategies, optimizing battery performance and life.

Single Plug-and-Play Gate Drivers for "New Dual" Modules
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Learn more:
power.com
  • Product Release
  • 2021-09-08

Power Integrations announced SCALE-iFlex Single gate-drivers for the popular "New Dual" 100 mm x 140 mm IGBT modules. The compact drivers support modules up to 3.3 kV and are available now for design-in. The SCALE-iFlex Single gate-drivers are ideal for light-rail, renewable energy generation and other high-reliability applications that demand compact, rugged driver solutions. Thorsten Schmidt, product marketing manager at Power Integrations commented: "SCALE-iFlex Single gate-drivers fit the outline of the latest standard IGBT power modules including the Mitsubishi LV100/HV100, Infineon xHP2 and xHP3, ABB LinPak, Hitachi nHPD² and other similar products." SCALE-iFlex Single gate-drivers use Power Integrations' SCALE-2 ASIC technology which dramatically reduces component count compared to conventional products. The ASIC also provides Advanced Active Clamping (AAC) over-voltage protection during normal operation, a substantial improvement over simple soft shut down, which adds extra protection in case of short-circuit during turn-on. Devices are conformally coated and feature reinforced isolation. Isolated housings ensure isolation between modules when they are mounted side-by-side. Devices are pre-qualified according to railway standards IEC 61373 – Class 1B (shock & vibration) and IEC 61000-4-x (EMC tests) and IEC 60068-2-x (serial environmental tests). Burn-in is optionally available.

Plug-and-Play Gate Driver Improves IGBT Module Performance
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Learn more:
power.com
  • Product Release
  • 2021-09-08

Power Integrations announced its plug-and-play SCALE-iFlex LT dual gate-drivers. The drivers improve the performance of multiple parallel EconoDUAL modules by 20%, allowing users to eliminate one of every six modules from power inverters and converter stacks. In addition to saving the cost of the driver and module, this reduces control complexity and costs related to modules, wiring, hardware, and heatsinking. SCALE-iFlex LT targets multiple applications in renewable energy generation and storage, and is particularly applicable to offshore wind turbines in the 3 to 5 MW range. Thorsten Schmidt, product marketing manager at Power Integrations commented: "Dynamic and static current sharing is critical for robust operation of modules arranged in parallel. For the same power output, systems using SCALE-iFlex LT require just five parallel modules whereas competitive approaches need six. This substantial saving of cost and complexity is achieved by guaranteeing less than 20 ns of variance in turn-on and turn-off commands between modules and less than 20 A of variance between modules when conducting the rated 600 A. This allows the modules to operate reliably without current derating, which is obligatory with less advanced driver solutions." Up to six EconoDUAL 3, or equivalent, power modules can be paralleled from the same Isolated Master Control (IMC) unit which has a more compact outline than conventional products. The Module Adapted Gate drivers (MAGs), which fit the footprint of the EconoDUAL module, each featuring two SCALE-2 ASICs – one per channel – to optimize symmetrical paralleling, efficiency and protection.

BLDC Motor Drivers with Code-Free, Sensorless FOC and Trapezoidal Control
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Learn more:
ti.com
  • Product Release
  • 2021-09-08

Texas Instruments introduced 70-W brushless DC (BLDC) motor drivers to provide code-free, sensorless trapezoidal and field-oriented control (FOC). The devices enable engineers to spin a BLDC motor in less than 10 minutes – eliminating months of design time for engineers designing a wide variety of industrial systems such as major and small home appliances, and medical applications such as ventilators and continuous positive airway pressure (CPAP) machines. With integrated real-time control and up to 18 discrete components – including power metal-oxide semiconductor field-effect transistors (MOSFETs) – the devices also speed system response time while reducing board space by as much as 70%, all while providing best-in-class acoustic performance. The MCF8316A and MCT8316A BLDC motor drivers include a set of commutation control algorithms that eliminate the need to develop, maintain and qualify motor-control software, which eliminates months of design time. The algorithms, along with a high level of integration, enable these motor drivers to manage critical functions such as motor fault detection, while implementing protection mechanisms to increase system reliability. Because these motor drivers integrate sensorless technology to determine rotor position, they eliminate the need for external Hall sensors, which reduces system cost and increases reliability. Additionally, the MCF8316A sensorless FOC motor driver intelligently extracts motor parameters, enabling designers to quickly tune a motor while delivering consistent system performance regardless of motor manufacturing variations. The MCT8316A sensorless trapezoidal control motor driver enables designers to tune a motor using only five hardware pins, simplifying systems by eliminating the need for a microcontroller interface.

Awarded for Global Sustainability for Reducing Battery Use and E-Waste
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Learn more:
powercastco.com
  • Industry News
  • 2021-09-07

The Business Intelligence Group awarded Powercast with its Sustainability Initiative of the Year in the 2021 Sustainability Awards program. These awards honor those people, teams and organizations who have made sustainability an integral part of their business practice or overall mission. Powercast aims to make one-time-use batteries obsolete by working with electronic manufacturers to recharge batteries or replace them altogether with its over-the-air RF (radio frequency) wireless power technology. Many of today's small electronic devices can be designed so they're environmentally friendly, either with rechargeable batteries that can accept an RF wireless charge, or with no batteries that can be directly powered by RF power. A Powerharvester chip is embedded in devices to receive RF energy sent over the air from either a dedicated Powercast transmitter, or from industry-standard RFID readers. The Powerharvester then converts the RF to direct current (DC) to top off the battery or power the device. Powercast's technology touches millions of users across 15+ industries, including automotive, consumer electronics, IoT, entertainment, retail, RFID, and sensors. The company's collaborative approach and expertise in all aspects of product design, from vision through prototyping and commercialization, has resulted in dozens of applications and millions of units shipped. "We're already partnering with many manufacturers to create wirelessly rechargeable devices that keep batteries out of landfills," said Charles Goetz, CEO of Powercast. "But, we strive for the day where all devices will charge in the background when consumers enter their home, office or car, where they'll never have to throw batteries away."

High-Volume Micro-Transfer Printing Capabilities
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Learn more:
xfab.com
  • Industry News
  • 2021-09-07

X-FAB Silicon Foundries is now able to support volume heterogeneous integration via Micro-Transfer Printing (MTP), thanks to a licensing agreement that has just been secured with X-Celeprint. This will mean that a diverse range of semiconductor technologies may be combined together, each being optimized for particular functional requirements. These will include SOI, GaN, GaAs and InP, as well as MEMS. In order to become the first foundry to provide customers with MTP-based heterogeneous integration, X-FAB has made substantial investments over the last two years. It has also established new optimized workflows and cleanroom protocols. This will allow customers to work with the foundry on heterogeneous design projects - benefitting from a low-risk and fully scalable business model that offers a clear migration to volume production. X-Celeprint's proprietary massively-parallel pick-and-place MTP technology stacks and fans-out ultra-thin dies based on different process nodes, technologies, and wafer sizes. It results in the formation of virtually monolithic 3D stacked ICs, which have enhanced performance, greater power efficiency, and take up less space. Furthermore, all this can be achieved at an accelerated rate, thereby significantly shortening time-to-market. "By licensing X-Celeprint's disruptive MTP technology, we are uniquely positioned in our ability to facilitate the incorporation of numerous different semiconductor technologies. X-FAB customers will be able to utilize a technology that no other foundry is offering, and existing X-Celeprint customers may now tap into capacity levels that will easily meet their future demands," Volker Herbig, VP of X-FAB's MEMS business unit, explains.

Strategic Partnership Focused on SiC Power Devices
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Learn more:
rohm.com
  • Industry News
  • 2021-09-07

The global semiconductor manufacturer ROHM, together with Geely Automobile Group have entered into a strategic partnership to develop advanced technologies in the automotive field. Both companies have been collaborating on a variety of automotive applications since 2018, when they first agreed to carry out technical exchange. This partnership is expected to further promote cooperation and accelerate innovation for automotive applications. Geely is working to extend the cruising range of electric vehicles while reducing battery costs and shortening charge times by developing high efficiency traction inverters and onboard charging systems that adopt ROHM's advanced power solutions centered on SiC power devices. At the same time, Geely is committed to improving user experience through the development of high performance ADAS and intelligent cockpit systems using a wide range of products and solutions, including communication ICs and discrete devices. As a first step, traction inverters equipped with ROHM's SiC power devices are being integrated in electric vehicle platforms currently being developed by Geely. Through this partnership, ROHM and Geely will contribute to sustainability by promoting the development of low carbon technologies in the automotive industry and offering solutions for achieving greater safety and security in our increasingly mobility society.

Optically Isolated Load-Biased Gate Driver
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Learn more:
  • Product Release
  • 2021-09-07

Littelfuse announced an optically-isolated MOSFET gate driver that requires no external power supply, yet can provide fast load turn-on speeds in the order of tens of microseconds. "The CPC1596 570V Load-Biased Opto-Gate Driver addresses a critical market need," said Steve Andrezyk, Senior Product Marketing Manager at Littelfuse. "Universal AC power line applications now have a custom, higher power optically isolated solid-state relay (SSR) solution without the cost of an auxiliary power supply or additional discrete devices to meet fast start-up speed requirements."
The problem: Standard Photovoltaic (PV) Gate Drivers simplify SSR-design by eliminating the need for auxiliary power supplies. Due to output currents in the µA-range, they get slower with larger gate charges of external MOSFETs, making it difficult to fulfill demanding fast turn-on application requirements.
The solution: The CPC1596 provides fast turn-on switch speed (typically 40µs) enabling designers to create a custom, higher power, optically isolated, DC-only or AC/DC solid-state relay (SSR) with external MOSFET(s). To increase the switching speed, simply utilize the product's unique load-biasing, on-board circuit. The use of load-biasing eliminates the need for an opto-gate driver auxiliary power supply. An internal regulator circuit regulates the voltage drawn from the load supply (up to 570V) down to 12.2V for internal use. An external storage capacitor is added to enable constant voltage control for properly driving the MOSFET.

Development of an Image Diagnosis Technology Utilizing a High-Sensitivity Magnetic Sensor
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Learn more:
tdk.com
  • Industry News
  • 2021-09-06

Yokohama National University and TDK Corporation have developed a prototype image diagnosis technology utilizing a high-sensitivity magnetic sensor. The developed prototype technology is related to the magnetic particle imaging method which is intended to detect and create images of magnetic particles accumulated in a tumor or blood vessel. The principle of the magnetic particle imaging is to detect the magnetic signals generated by magnetic particles accumulated in a tumor or blood vessel from outside of the body. When intended for use in medical imaging, it is important for devices to be highly sensitive to enable the detection of small amounts of magnetic particles. Though magnetic particle imaging technologies primarily use a method that measures electromotive force electromagnetically induced through detection coils, the new technology developed by YNU utilizes a prototype high-sensitivity magnetic sensor to achieve this. The prototype high-sensitivity magnetic sensor was developed by TDK for use in the detection weak magnetic fields at room temperature. Although still under development, the prototype sensor has been shown in a prior feasibility study to measure magnetic field distribution in a heart. Through this development, the sensor has successfully reduced the strength of the alternate current magnetic fields applied from outside of the body to one tenth lower than conventional levels. This reduced strength of the applied field is achieved by the non-linear response characteristics of the sensor to the measured magnetic field strength.

Foundation of an International Sales Company
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Learn more:
we-online.com
  • Industry News
  • 2021-09-03

The establishment of "Würth Elektronik CBT International GmbH" marks another milestone in the internationalisation of the Circuit Board Technology division of Würth Elektronik. The European sales teams will be consolidated and expanded under the umbrella of this limited liability company. The international customers are thus moving even more into focus. In 2021, the Würth Elektronik Group celebrates its 50th anniversary. Since its beginnings, internationalisation has been an important strategic aspect for the Printed Circuit Board division. Over the past five decades, Würth Elektronik has built up three PCB plants in Germany as well as various cooperations with qualified partners in Asia. As Europe's leading PCB manufacturer, Würth Elektronik continuously develops and optimises production processes and is also heavily involved in the research and development of pioneering technologies, manufacturing processes and materials. Today, the company serves more than 4,000 customers from 50 countries in all areas of the electronics industry. In order to always be close to the customers, the sales teams in Europe are continuously being expanded and successively integrated into Würth Elektronik CBT International GmbH. "Our goal is to further expand our strong position in Europe and become the largest supplier of printed circuit boards in Europe," says Thomas Beck, Managing Director of Würth Elektronik CBT International GmbH. This process is being started with Poland. Since the beginning of the year, a local PCB specialist has been on hand to provide customers with personal advice on site. "We are looking forward to further expanding and improving the relationships with our Polish customers through our new Area Sales Manager Tomasz Renkiel," Beck continues.

Accelerating GaN technology Development for 650 V GaN Power Devices
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Learn more:
infineon.com
  • Product Release
  • 2021-09-02

Infineon Technologies and Panasonic Corporation have signed an agreement for the joint development and production of the second generation (Gen2) of their proven gallium nitride (GaN) technology. The performance and reliability combined with the capability of 8-inch GaN-on-Si wafer production mark Infineon's strategic outreach to the growing demand for GaN power semiconductors. In accordance with market requirements, Gen2 will be developed as 650 V GaN HEMT. The devices will allow for ease of use and provide an improved price-performance ratio, targeting, amongst others, high- and low-power SMPS applications, renewables, motor drive applications. For many designs, gallium nitride (GaN) offers fundamental advantages over silicon. "In addition to the same high reliability standards as for Gen 1, with the next generation customers will benefit from even easier control of the transistor as well as a significantly improved cost position, thanks to moving to an 8-inch wafer manufacturing," says Andreas Urschitz, President of Infineon's Power and Sensor Systems Division. Like the jointly developed Gen 1 devices, known as Infineon's CoolGaN and Panasonic's X-GaN, the second generation will be based on the normally-off GaN-on-silicon transistor structure. This, in combination with the unmatched robustness of the hybrid-drain-embedded gate injection transistor (HD-GIT) structure, makes these components the product of choice and one of the most long-term reliable solutions in the market.

40A Printed HE-R Relay for 3 Phase Systems
  • Product Release
  • 2021-09-01

Panasonic Industry's HE-R relay is a PCB based relay that can be used as the main switching element in 3 phase systems. Being remarkably compact, it contributes to considerable space and cost savings. Each of the 4 NO contacts is able to switch 40A up to an ambient temperature of +85°C - also a result of the sophisticated thermal design and an unique low coil holding power. An optional NC contact as feedback contact can handle low level loads down to 10mA / 5VDC. "Because of its outstanding ratio of size, power and robustness, the IEC62955 compliant HE-R re-lay is the perfect choice for contemporary and demanding AC/DC wall box designs", claims Panagiotis Venardos from Panasonic Industry Europe. "The advanced technology inside the HE-R ena-bles our customers now to control 3 phase systems directly on the PCB – that might not only be highly interesting for domestic wall boxes, but also for AC or DC charging stations and other fields of application, such as industrial automation or energy harvesting."

DC/DC Converters with 3000 VAC Isolation Voltage
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Learn more:
tracopower.com
  • Product Release
  • 2021-09-01

TRACO's THR line comprises four series of DC/DC converters between 3 and 40 Watt with reinforced isolation (3000 VAC). These regulated DC/DC converters come in either a DIP-24 or 2"x1" package and also feature increased resistance against shock and vibration according to EN 61373. The THR 3WI, THR 10WI and THR 20WI also have an internal input filter to comply with EN 55032 class A. High efficiencies up to 90% allow safe operation from –40°C to +80°C (with derating). All models have a wide 4:1 input voltage range and precisely regulated, isolated output voltages. With the latest IT safety certifications (IEC/EN/UL 62368-1) the THR line is the perfect choice for many demanding applications in the industrial, transportation and instrumentation sectors.

Single-chip GaN Gate Driver for Industrial and Home Automation
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Learn more:
st.com
  • Product Release
  • 2021-08-31

STMicroelectronics' STDRIVEG600 half-bridge gate driver has high current output and 45ns propagation delay, closely matched between high-side and low-side outputs, to handle high-frequency switching of GaN enhancement-mode FETs. Also suitable for driving N-channel silicon MOSFETs at up to 20V, the STDRIVEG600 allows the flexibility to apply up to 6V gate-source voltage (VGS) on GaN devices to ensure low Rds(on). In addition, there is an integrated bootstrap circuit that helps minimize the bill of materials and simplify board layout. This circuit uses a synchronous MOSFET that lets the bootstrap voltage reach the logic supply voltage, VCC, allowing the driver to operate from a single supply without a low-dropout regulator (LDO). With dV/dt immunity of ±200V/ns, the STDRIVEG600 ensures dependable gate control in challenging electrical environments. The logic inputs are CMOS/TTL compatible down to 3.3V for easy interfacing with a host microcontroller or DSP. The high-side section withstands up to 600V, allowing use in applications with a high-voltage bus up to 500V. The outputs have 5.5A/6A sink/source capability and provide separated turn-on and turn-off pins that let designers choose the optimum way to control the gate. In addition, both the high-side and low-side circuits support Kelvin connection to the power-switch source for enhanced control. Dedicated ground and supply-voltage connections for the low-side driver ensure stable switching with the Kelvin connection and allow a shunt resistor to be used for current sensing without additional isolation or input filtering.

High-Frequency Wirewound Chip Inductor
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Learn more:
coilcraft.com
  • Product Release
  • 2021-08-31

The Coilcraft 016008C Series is a high-frequency-wirewound chip inductor that features a high Q factor, up to 40% higher than the best thin-film counterparts. High Q is required to minimize the insertion loss in RF antenna impedance matching circuits, which makes the 016008C ideal for high-frequency applications such as cell phones, wearable devices, and LTE or 5G IoT networks.

Promoting Female Engineers
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Learn more:
semikron.com
  • Industry News
  • 2021-08-31

The SEMIKRON Bachelor Women Award was presented for the first time at this year's Day of Electrical Engineering, Electronics and Information Technology ("EEI Day") at the Friedrich-Alexander University Erlangen-Nürnberg (FAU). The lucky award winner, student Katharina Stich, received the prize in recognition of the excellent mark awarded for her BA dissertation. Professor Uwe Scheuermann, Simulation & Analysis Director at SEMIKRON, and Anja Oberndörfer, Head of Training at SEMIKRON, handed over the award during a virtual ceremony held on 16 July 2021. At a later meeting in person at SEMIKRON's head office in Nuremberg, the award winner was presented with the award certificate and a cheque for 750 euros. Bernd Enser, Chief Operating Officer (COO) at SEMIKRON, congratulated Ms. Stich on the award while Ms. Oberndörfer spoke of the importance of promoting young women who are on MINT study programmes. SEMIKRON will continue to support Ms. Stich as part of a mentoring programme where, among other things, she will have the opportunity to experience first-hand what a day in the life of a female engineer is like. Another highlight on the EEI Day was the presentation of the SEMIKRON Student Award, which went to eleven students in recognition of their outstanding results. This year's awards went to students of the FAU's Department of Electrical Engineering, Electronics and Information Technology (EEI) for the 13th time and students of the Department of Materials Science for the 11th time.

Analyzer for Optical Communication Components
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Learn more:
tmi.yokogawa.com
  • Product Release
  • 2021-08-31

The Yokogawa AQ6380 has excellent optical wavelength resolution down to 5 picometers (pm), allowing optical signals in close proximity to be clearly separated and accurately measured. With the AQ6380, waveforms that were previously not even visible in a typical OSA, such as modulation side peaks in the laser spectrum, can now be accurately visualized. It also offers a wavelength range of 1200 to 1650 nm, allowing one unit to meet diverse wavelength measurement needs. With the ability to alter the wavelength resolution from 5 pm to 2 nm, a wide range of applications can be supported, from narrowband peak/notch measurements to wideband spectral measurements. A major challenge for optical researchers has been maintaining the accuracy of their instruments, with ambient temperature change, vibrations, and shock all potentially affecting the measurement accuracy of optical spectrum analyzers. To maintain consistently high accuracy, the AQ6380 features on board calibration based on a built-in light source. Wavelength calibration is automatically performed at set intervals by switching the optical path with an internal optical switch.

Reiko Winkler is Appointed General Manager
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Learn more:
finepower.com
  • People
  • 2021-08-27

Effective from 2021/08/01, Reiko Winkler will be General Manager of Finepower GmbH. As member of the management board, he will be responsible for the strategic alignment and the implementation for a sustainable growth strategy. Since its foundation in 2001, Finepower has established itself very successfully in the market of power electronics and has grown from a small team of four founding members to an internationally active distributor and engineering service provider. In addition to the high number of industrial companies, Finepower's customers also include leading Tier 1s and OEMs from the automotive industry, who value the expertise of the power electronics specialists. Reiko Winkler joined Finepower in 2011 as Key Account Manager and, since 2018 as Head of Sales he has contributed significantly to the growth of the distribution business, which today represents the largest share of Finepower's revenue. As an electrical engineering graduate with an MBA and about 20 years of experience in technical sales of electronic components, he is well prepared for this new and challenging position. The new management team will be formed with two other colleagues who have received power of attorney in this context. Please welcome also Stephanie Mahrenholz (Head of Operations and Finance) and Reiner Nowitzki (Head of Engineering) in their new roles.

Fully Virtual IEEE ECCE 2021
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Learn more:
ieee-ecce.org
  • Event News
  • 2021-08-27

The safety and well-being of our participants is our priority. Due to the resurgence of COVID-19, along with complex international travel requirements, the organizing committee has pivoted ECCE 2021 to fully virtual. The conference will be live on October 10-14, 2021, offering many live events such as the plenary session, interactive sessions with the tutorial instructors, industry-oriented special sessions, expo-dedicated live hours and a new technical program format.  Additionally, the conference on-demand content and exhibit will be available for a total of 30 days. The virtual format allows us to come together to learn, idea-share and gain insight into the latest innovations within the energy conversion field, and ensures that the current landscape does not hinder anyone's ability to participate.

Teaming Up to Accelerate Electronics Design
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Learn more:
snapeda.com
  • Industry News
  • 2021-08-26

SnapEDA and Panasonic have collaborated to release a free collection of helpful resources for electronics designers. These resources include computer-aided design (CAD) models for over 75,000 of Panasonic's components. These CAD models allow engineers to make custom products with Panasonic's electronics components quickly and reliably. "Panasonic strives to provide the highest quality products to their customers and these new CAD models are no exception. Our collaboration brings thousands of high quality CAD models to engineers, streamlining their design process and enabling them to move to scale faster and more reliably with Panasonic components" said Natasha Baker, Founder & CEO of SnapEDA. The new models include schematic symbols and PCB footprints for electronics design, as well as 3D mechanical models to ensure proper mechanical clearances and design visualization. In addition to the CAD models themselves, engineers can also see a real-time report generated by SnapEDA's patented verification technology, to gain instant transparency into manufacturability. The models cover Panasonic's radial and surface mount resistors, capacitors and inductors. They are compatible with all major electronics and mechanical design tools.

Acquisition Completed
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Learn more:
analog.com
  • Industry News
  • 2021-08-26

Analog Devices announced the completion of its previously announced acquisition of Maxim Integrated Products. The combination further strengthens ADI's position as a high-performance analog semiconductor company with trailing twelve-month revenue of over $9 billion and free cash flow of over $3 billion1 on a pro forma basis. "Today is a tremendous milestone for ADI and I'm delighted to welcome the Maxim team, who share our passion for solving our customers' most complex technology problems," said Vincent Roche, President and CEO. "With more than 10,000 engineers and the increased breadth and depth of our best-in-class technologies, we are well-positioned to develop even more complete, cutting-edge solutions for our customers. Together, we will drive the next waves of analog semiconductor innovation, while engineering a healthier, safer and more sustainable future for all." Under the terms of the definitive agreement, Maxim stockholders received 0.63 of a share of ADI common stock for each share of Maxim common stock. Maxim common stock will no longer be listed for trading on the NASDAQ stock market. In connection with the closing of the transaction, Tunç Doluca, former President and Chief Executive Officer of Maxim, and Mercedes Johnson, former Founding Executive of Avago Technologies, will join the ADI Board of Directors. Mr. Doluca and Ms. Johnson served on Maxim's Board of Directors until the closing of the transaction.

Current Probe Kit Facilitates Safe 480V Panel Connected Load Studies
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Learn more:
poweretc.com
  • Product Release
  • 2021-08-26

POWERetc Corporation announces the availability of the CCPK-6 Cabinet Current Probe Kit that enables routine panel capacity studies to be performed in 480V panels – without the need to open or power down the panel. The kit includes a 4-phase, 6"-diameter MicroFlex current probe assembly rated at 4000A, a thru-panel cabinet adapter/connector, and an exterior jumper cable to connect the METSyS logger to the cabinet connector plug. By facilitating the setup of the METSyS logger and POWERetc's custom report generator package, the kit makes it easier to conduct Cal OSHPD (PIN 38 for medical facilities) and NEC 220.87 (Exception Method) connected load studies. "Panel-capacity connected load studies that comply with NEC 220.87 or OSHPD studies in California medical facilities are very common – and challenging," said Bruce Lonie, President of POWERetc. "Live panel setup of these tests requires use of PPE and, in many cases, powered-down setup isn't even possible, particularly in hospital environments where critical loads are affected. Our new permanently-installed METSyS adapter kit allows facility personnel to safely and quickly conduct these studies without interrupting power." A single complete portable system along with multiple permanently-installed Current Probe Kits – one for each 480V cabinet – will quickly pay for themselves in reduced service costs and power interruptions.

Diode Protection Switch Suitable for Type-C Power Delivery
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Learn more:
aosmd.com
  • Product Release
  • 2021-08-26

Alpha and Omega Semiconductor announced a Type-C Power Delivery high voltage sink protection switch using ideal diode methodology for reverse current protection. The AOZ13984DI-02 and AOZ13987DI-02 are smart protection switches in a single small thermally enhanced 3mm x 3mm DFN package. The products use AOS's advanced co-packaging technology, combining a high-performance IC with protection features and our latest high SOA Trench MOSFET. They offer low RDS(ON) (20mohm) back-to-back MOSFETs to block any reverse current under fault conditions and are capable of up to 28V absolute maximum voltage. Typically, a USB Type-C port adaptor supplies 5V at plug-in. Once plugged in, the client device negotiates a higher voltage for fast charging. The rise time for VBUS voltage from 5V to the final target value is very slow per the USB standard. Typical Type C protection switch designs that rely on a comparator to detect a voltage drop across the back-to-back power switches do not work with slow rising VBUS voltages and are susceptible to system-level faults. It's for this reason, robust system designs implement an ideal diode approach. Typically, such solutions were implemented discretely and require many external components and lack protection features that are possible with an integrated circuit-based approach.

Celebrating its 50th Anniversary in Europe
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Learn more:
rohm.com
  • Industry News
  • 2021-08-26

Since 1971, ROHM Semiconductor GmbH has established eight locations throughout Europe to support its customers with tailored semiconductor solutions – locally. The company highlights the milestones of its European activities with a special "50th Anniversary" website. Founded in 1958 in Kyoto, Japan, the ROHM group today has become a global player and supplier in the electronics industry. The company produces a wide range of solutions including integrated circuits for power management, SiC MOSFETs, diodes and modules, silicon power transistors and diodes, but also LEDs, resistors and many more electronic components. Being a vertically integrated semiconductor manufacturer, ROHM is largely independent of suppliers and can respond more flexibly to market changes. ROHM Semiconductor Europe, founded in 1971, with Headquarters in Willich near Düsseldorf, Germany, is represented by eight offices in six countries today: Germany, France, UK, Spain, Finland and Italy. Additionally, ROHM's production facility SiCrystal, located in Nuremberg, Germany, supplies the global markets with silicon carbide wafers. The company's European business activities – in line with the ROHM group's Medium-Term Management Plan 'MOVING FORWARD to 2025' ¬– aim to accelerate social contribution. "We focus on power and analog solutions and contribute to our customers' needs for energy saving and downsizing of their products," states Wolfram Harnack, President at ROHM Semiconductor Europe. ROHM's European business both serves the needs of automotive and industrial application areas. "For example, car manufacturers strongly demand our silicon carbide devices for their production of electric cars. In addition, we also see exciting projects in the industrial field and expect a major growth in Europe – particularly in the area of infrastructure for e-mobility and alternative energies," Harnack continues.

Rad Hard Gallium Nitride (GaN) Power Devices
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Learn more:
epc.space
  • Product Release
  • 2021-08-25

EPC Space technology produces devices that are smaller, have lower resistance, and have many times superior switching performance compared to silicon solutions.  Spanning a range of 40 Volts to 300 Volts, and 4 Amperes to 30 Amperes, the discrete power transistor family demonstrates significant performance advantages over competitive silicon-based Rad Hard power MOSFETs. The Drivers and Power Stages product line includes ultra-fast low-side eGaN drivers, ultra-fast dual low-side eGaN drivers, and half bridge drivers with integrated eGaN power switches. Beyond the overall higher performance, these devices offer superior radiation hardness under heavy ions (SEE), gamma radiation (TID), and Neutron Displacement Damage (DD) as compared to Si solution; moreover, SEE immunity is guaranteed by wafer. EPC Space devices are manufactured in the US at an AS9100D certified facility located in the greater Boston area. It is worth noting, that tens of thousands of these devices are already on board of satellites flying in LEO and GEO orbits with mission lives of more than ten years. "With the performance, reliability, and price advantage clearly on the side of EPC Space GaN devices, it is hard to justify continuing to pay two times the price for lower performing, heavier, larger silicon-based power solutions" commented Bel Lazar, CEO.

Acquisition of GT Advanced Technologies
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Learn more:
gtat.com
  • Industry News
  • 2021-08-25

onsemi and GT Advanced Technologies announced that they have entered into a definitive agreement under which onsemi will acquire GTAT for $415 million in cash. Founded in 1994, GTAT has significant experience in crystalline growth, including SiC. SiC is a key material for next-generation semiconductors that provide technical benefits in SiC power switching devices, significantly improving system efficiency in electric vehicles (EVs), EV charging and energy infrastructure. The transaction is expected to better position onsemi to secure and grow supply of SiC and meet rapidly growing customer demand for SiC-based solutions in the sustainable ecosystem, including EVs, EV charging and energy infrastructure. Combining onsemi's manufacturing capabilities with GTAT's technical expertise will accelerate SiC development and position onsemi to better serve customers as the sustainable ecosystem rapidly ramps up over the next decade. This enhanced SiC capability will allow onsemi to assure customers of supply of critical components and to further commercialize intelligent power technologies. "This transaction reflects our confidence and stated commitment to meaningfully invest in silicon carbide solutions to support the creation of intelligent power and sensing technologies to help build a sustainable future," said Hassane El-Khoury, president and chief executive officer of onsemi. "We are focused on deepening our leadership and innovation in game-changing technologies that support the automotive and industrial sectors, and GTAT brings outstanding technical capabilities and expertise in developing wafering-ready silicon carbide, which we intend to accelerate and expand to better empower customers in our high-growth end markets. We look forward to welcoming GTAT's talented employees to the onsemi team and driving innovation together."

45W and 150W GaN Devices for High-Efficiency Power Conversion
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Learn more:
st.com
  • Product Release
  • 2021-08-24

Easing the transition to high-efficiency wide-bandgap technology, STMicroelectronics has released the MasterGaN3 and MasterGaN5 integrated power packages for applications up to 45W and 150W, respectively. Joining the MasterGaN1, MasterGaN2, and MasterGaN4, which target applications from 65W to 400W, the additions give extra flexibility to choose the optimum Gallium Nitride (GaN) device and driver solution when designing switched-mode power supplies, chargers, adapters, high-voltage Power-Factor Correction (PFC), and DC/DC converters. ST's MasterGaN concept simplifies migrating from ordinary silicon MOSFETs to GaN wide-bandgap power technology. The devices integrate two 650V power transistors with optimized high-voltage gate drivers and associated safety and protection circuitry, eliminating gate-driver and circuit-layout design challenges. Combined with the higher switching frequencies possible with GaN transistors, these integrated devices enable power supplies that are up to 80% smaller than silicon-based designs as well as extremely robust and reliable. The GaN power transistors of MasterGaN3 devices have asymmetrical on-resistance (Rds(on)) of 225m? and 450m?, making these devices suited to soft-switching and active-rectification converters. In MasterGaN5 both transistors have 450m? Rds(on) for use in topologies such as LLC-resonant and Active Clamp Flyback. In common with other MasterGaN family members, both devices have inputs compatible with logic signals from 3.3V to 15V, which simplifies connection of a host DSP, FPGA, or microcontroller, and external devices such as Hall sensors. They also integrate protection including low-side and high-side undervoltage lockout (UVLO), gate-driver interlocks, over-temperature protection, and a shutdown pin.

200% Peak Power AC-DC LHP Series
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Learn more:
coseleurope.eu
  • Product Release
  • 2021-08-24

COSEL announced the addition of 150W and 300W free air convection cooled power supplies, the LHP150F and the LHP300F. Designed for industrial applications requiring high levels of safety, they are certified according to EN62477-1 (OVC III). The products work over a wide universal input voltage range of 85 to264VAC and have a high typical efficiency rating of 93%. The LHP150F and LHP300F are available in five different output voltages commonly used in industrial automation and processes, with 200% peak power capability for up to 10 seconds for dynamic loads. The standard product is an open frame PCB type, with a chassis and cover available as an option. Industrial applications require efficient power supplies able to work in various environments with a high level of safety. The LHP150F and LHP300F are certified to the EN62477-1 Over Voltage Category Three (OVC III), meaning that a final equipment powered by the products can be connected directly to the main distribution panel without adding an extra level of isolation. This simplifies the system designer's task, reducing cost and guaranteeing the highest level of efficiency. Designed for world-wide applications, the LHP150F and LHP300F have an input voltage of 85 to 264VAC. Five output voltages are available: 24V, 30V, 36V, 42V and 48V with respective output current of 6.3A, 5.0A, 4.2A, 3.6A and 3.2A for the LHP150F and 12.5A, 10.0A, 8.4A, 7.2A and 6.3A for the LHP300F. The output voltage can be adjusted using a built-in potentiometer.

AEC-Q200 Compliant Fuses with High DC Voltage Rating
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Learn more:
belfuse.com
  • Product Release
  • 2021-08-23

Bel Fuse-Circuit Protection announced the 0ACH Series of fast-acting, high current SMD brick fuses. The series offers high current ratings and high interrupting ratings within a small package size of 4.5 x 4.5 x 12.3 mm. The 0ACH Series is designed for automotive and other applications which require a high current fuse, and where any gain in size, weight and power is beneficial - such as high-power battery systems, routers, and blade servers. The range is supplied as tape & reel for auto-insert SMD processes. The series delivers current ratings of 60A to 100A, DC voltage of 72Vdc with interrupting ratings up to 1000A, meets AEC-Q200 automotive requirements, and is RoHS compliant, halogen free and complies with UL 248-1 and UL 248-14.

DC/DC Converters with 3kVAC Reinforced Isolation
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Learn more:
tracopower.com
  • Product Release
  • 2021-08-23

TRACO POWER announces their THR-WI series of 3 / 10 / 20 / 40 watt DC/DC Converters with double / reinforced insulation providing up to 3,000 VAC Isolation. These products operate over an ultra-wide 4-1 input range with up to 90% efficiencies and operating temperatures from -40°C to 80°C (105°C maximum case temperature). THR 3 (3 Watt) models offer DIP 24 footprints and the THR 10 / 20 / 40 (10 / 20 / 40 Watt) come in 2x1" footprints. Input ranges include 9~36 / 18-75 / 40~160 VDC and provide single & dual outputs ranging 5~24 VDC. Models are fully encapsulated to withstand shock and vibration standards per IEC / EN 61373. Internal input filters enable EN 55032 class A compliance (3 /10 / 20 watts) and overload, overvoltage and short-circuit protection. With the latest IT safety certifications (IEC/EN/UL 62368-1), the THR-WI series is the perfect choice for many demanding applications in the industrial, transportation and instrumentation sectors.

EMC-filter for Machinery and Robotics
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Learn more:
schaffner.com
  • Product Release
  • 2021-08-23

Schaffner has extended its FN3270 series to provide more options for machine builders. Building on the strengths of the FN3270 filter range the FN3271 filter is a compact and lightweight filter design requiring minimum mounting space in installations and cabinets. 15 different filter models are available to meet the specific needs and deployment for most industrial applications. These include industrial viable speed electrical power drive systems, motor drives and systems containing frequency inverters and servo drives. The FN3271 offers an ideal solution for EMC challenges, where the impedance at the connection to the noise source is high (> 100 Ohm). The internal configuration of the FN3271 is optimised for this application. For applications with low impedances at the noise source the existing FN3270 remains the option of choice. These EMC filters provide the attenuation performance required to fulfil EN 61800-3/A11 and the filter performance is guaranteed under full load operating conditions. Solid, touch-safe terminal blocks are fitted to all filter models from 10 to 100 A, offering sufficient contacting cross section according to the EN 60204-1 installation standard. To improve the safely of installations optional transparent protective covers are available for all filters with busbars from 150 to 1000 A. These provide protection to the installer, operator, or inspector by avoiding accidental contact with live conductors. The protective covers can easily be retrofitted even if the filter is already installed and connected.

The End of the Internal Combustion Engine – Many Car Manufacturers are Ready
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Learn more:
powertodrive.de
  • Industry News
  • 2021-08-19

With the EU's "Fit for 55" legislation package, the internal combustion engine is set to disappear: From 2035, all new registered vehicles in Europe are to be zero-emission. Many car manufacturers have already adjusted their strategies to be able to hit this target. The success of e-mobility is an important step towards clean transportation and guarantees the economic position of Europe as a center of commerce and industry thanks to its cross-sector innovation efforts. In this way, electric vehicles promote a new concept of mobility and offer added value to society as a flexible temporary storage system of green energy (vehicle-to-grid). The worlds of new energy and mobility are joining forces, including back on site: The Power2Drive Europe Restart 2021 exhibition will be held from October 6–8 in Munich and showcase charging solutions, battery electric vehicles as well as the intelligent integration of e-mobility in a renewable energy system. By launching the "Fit for 55" legislation package, the European Commission has made the decision to move away from internal combustion engines. Now car manufacturers are required to do the same. According to the European Commission plan, yearly emissions of new vehicles must be 55 percent lower starting in 2030 than in 2021. By 2035, this figure increases to 100 percent in comparison to 2021, meaning that all new registered vehicles from 2035 onwards would be emission free.

VE-VIDES: Joint Research Project for Trustworthy Electronics
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Learn more:
infineon.com
  • Industry News
  • 2021-08-19

Coordinated by Infineon, the research project " Design methods and hardware/software co-verification for the unique identifiability of electronic components" ( VE-VIDES) has begun operations. Twelve partners from the research and academic sectors as well as from electronics and end user industries are working together to develop a holistic security concept for the Internet of Things. The VE-VIDES goal is to already systematically identify potential security gaps in the design phase and to use automatically generated, trustworthy mechanisms to protect electronic systems against attack. The German Federal Ministry of Education and Research is supporting the project as part of its funding measure "Trustworthy Electronics (ZEUS)". "We rely on electronic systems in almost every aspect of our lives and our work. These systems make our lives easier, safer and greener. We need trustworthy electronics if we want to really be able to rely on them," says Infineon's Djones Lettnin, head of the alliance project. "In VE-VIDES our focus is on securing the trustworthiness of system hardware while taking the direct interfaces to trustworthy firmware and software components into account." It is already necessary to plan for and secure the trustworthiness of a system and for all subcomponents during design at the architecture level. VE-VIDES is therefore researching trustworthy development and verification processes which give electronic systems verifiable and, whenever possible, quantifiable protection against attacks. The design methods, tool chains and test suites emerging from this alliance project will give a solid foundation to future development tools for trustworthy electronics and will thus contribute to the technical and technological sovereignty of Germany and Europe.

Digital Multiphase Controller for Telecom and General-Purpose Applications
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Learn more:
aosmd.com
  • Product Release
  • 2021-08-18

Alpha and Omega Semiconductor introduces the first product of the AOS Digital Controller product portfolio. The AOZ97774QE is offered in a QFN 5mm x 5mm package and provides flexible DC/DC controller supporting 5G Wireless, Networking, Optical Communication, and General-Purpose DC/DC applications. The AOZ97774QE provides DC/DC power conversion from the 12V power rail to Point-of-Load voltage for all main subsystems of the 5G wireless network, including CU, DU, and RU platforms. The part can be used for all 12V input applications where multi-phase power is required, and the main output is three phases or less. The Control Unit (CU), Digital Unit (DU), and Radio Unit (RU) are all critical subsystems that require the higher power that is supported with the AOZ97774QE and AOS Power Stages. The AOZ97774 offers up to 15 stored pin-strapped configurations, which is significantly more stored configurations than other solutions on the market. The multiple configurations allow for the one controller to behave as 15 separate power designs minimizing product management, faster system design, and easier logistics control. The controller also has NVM configuration, with 1,000 times read/write capability, which is also provided for maximum flexibility. This is very useful during the system bring-up and debug process, saving time and improving the reliability of results.

2021 IEEE International Electron Devices Meeting
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Learn more:
ieee-iedm.org
  • Event News
  • 2021-08-17

While the comprehensive technical program for the 2021 IEEE International Electron Devices Meeting (IEDM), scheduled for December 11–15, 2021 at the Hilton San Francisco Union Square hotel, will be finalized in fall, the popular IEDM Tutorials and Short Courses are already set. The broad reach, interdisciplinary nature and technical depth of the topics that will be discussed in these educational events can serve as a "crystal ball" of sorts to show where the industry is headed. At IEDM each year, the world's best scientists and engineers in nano/microelectronics gather to participate in a technical program consisting of more than 220 presentations, along with a variety of panels, focus sessions, Tutorials, Short Courses, a supplier exhibit, IEEE/EDS award presentations and other events highlighting leading work in more areas of the field than any other conference. "As the COVID-19 pandemic has demonstrated, the world is becoming increasingly reliant on electronic technologies. The good news is that the IEDM Tutorials and Short Courses will provide attendees with the invaluable knowledge and information needed to advance the state-of-the-art in critical areas of the field," said Meng-Fan (Marvin) Chang, IEDM 2021 Publicity Chair, IEEE Fellow, Distinguished Professor of Electrical Engineering at National Tsing Hua University, and Director of Corporate Research at TSMC. "The opportunity to engage with the world's technical leaders in these highly specialized areas is one of the hallmarks of the IEDM conference."

150mm Silicon Carbide Wafer Supply Agreement
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Learn more:
wolfspeed.com
  • Industry News
  • 2021-08-17

Cree | Wolfspeed and STMicroelectronics announced the expansion of an existing multi-year, long-term silicon carbide wafer supply agreement. The amended agreement, which calls for Cree to supply ST with 150mm silicon carbide bare and epitaxial wafers over the next several years, is now worth more than $800 million. "This latest expansion to our long-term wafer supply agreement with Cree will continue to contribute to the flexibility of our global silicon carbide substrate supply. It will continue to contribute importantly to our global silicon carbide supply, complementing the other external capacity we have secured and the internal capacity we are ramping. The agreement will help meet the high volumes required by our product manufacturing operations in the next years, with a large number of automotive and industrial customer programs in high volumes or ramping up," said Jean-Marc Chery, President and CEO of STMicroelectronics. "We are very pleased that STMicroelectronics will continue to leverage Wolfspeed silicon carbide materials as part of their supply strategy for the next several years," said Cree CEO Gregg Lowe. "Our long-term wafer supply agreements with device manufacturers now total more than $1.3 billion and help support our efforts to drive the industry transition from silicon to silicon carbide. Our partnerships and significant investments in increased production capacity ensure we are well positioned to capitalize on what we believe to be is a multi-decade growth opportunity for silicon carbide-based applications."

Enhanced Customizations Available for Precision Actuators
  • Product Release
  • 2021-08-16

Haydon Kerk Pittman, a business unit of AMETEK's Advanced Motion Solutions Division, is pleased to announce enhancements to its MiniSlide MSA Series of precision linear slides. Originally introduced in 2020, the MiniSlide motorized linear slide system offers customers a compact, low-profile, stable platform with definable, economical costs; a rapid supply; and the ability to conveniently mount, wire, and run. The series provides design flexibility with two motor technology options, nine lead screw options, four lubrication options, a rotary encoder feedback option, and imperial or metric mounting hardware standards. The MiniSlide is ideal for lab equipment and automation applications including sample handling, spectrometers and chromatographers, molecular analyzers, optical microscopes, and inspection devices.

Rail-to-Rail CMOS Operational Amplifier
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Learn more:
rohm.com
  • Product Release
  • 2021-08-16

ROHM developed the BD8758xY series (BD87581YG-C, BD87582YFVM-C) of rail-to-rail input/output high-speed CMOS op amps that feature improved EMI immunity for automotive and industrial equipment applications requiring high-speed sensing in harsh environments, such as vehicle engine control units and anomaly detection systems for factory automation equipment. In recent years, advancements in electrification and mounting density have increased the amount of environmental noise in electric vehicles and cars equipped with ADAS. Generally, however, it is extremely difficult to carry out noise evaluation on individual boards and systems during automotive development since it must be performed after assembly. What's more, some results require improvements such as large-scale EMI countermeasures to lower noise. In response, ROHM released the EMARMOUR series in 2017 that have since been well received in the automotive and industrial markets due to their superior noise immunity that reduces design resources by combining a vertically integrated production system with proprietary analog design technology. The EMARMOUR series is designed to prevent malfunctions due to noise without the need to take special application measures. The latest BD8758xY series in particular has demonstrated superior performance under four international noise evaluation tests. For example, in ISO 11452-2 radio wave emission testing conducted by vehicle manufacturers, the output voltage of standard products fluctuates by more than ±300mV in all frequency bands, while the new BD8758xY series achieves ±10mV or less.

3-Phase MOSFET Gate Driver
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Learn more:
trinamic.com
  • Product Release
  • 2021-08-16

TRINAMIC Motion Control introduces the fully integrated TMC6140-LA 3-phase MOSFET gate driver that simplifies design and maximizes battery life of brushless direct current (DC) motor drives. The TMC6140-LA 3-phase MOSFET gate driver integrates all three bottom shunt amplifiers to provide a complete motor drive solution with improved power efficiency, while simplifying design by reducing component count. The TMC6140-LA is optimized for performance over a wide voltage range, making it well-suited for servo motors, brushless motors and permanent magnet synchronous motors. The three-phase gate driver is equipped with charge pumps for both the gate and low-side drivers, statically stabilizing the gate voltages of external MOSFETs in three-phase motors with up to 100A of coil current. Offered in a 36-pin quad-flat no-leads (QFN) package, the gate driver is a flexible solution for 5V to 30V DC and 0.5A or 1.0A battery-powered applications, such as power tools where voltages can drop below 10V. Integrated current sense and diagnostics features add functional safety while simplifying design.

Tunnel Magneto-Resistance Current Sensor
  • Product Release
  • 2021-08-16

Crocus Technology announces the CT430 and CT431 isolated current sensor with 1MHz bandwidth and 99% of stray fields without the need for external shielding. The Crocus proprietary TMR technology inherently offers very high signal-to-noise ratio (SNR) which allow for high resolution measurements required for precision control or monitoring applications. The linear error and offset performance is intrinsically more accurate permitting the elimination of system level calibration normally done with an external voltage reference, thus freeing up processor time and simplifying system design. "I'm excited to introduce this truly differentiated current sensor product which highlights the benefits the Crocus XtremeSense TMR technology can bring." states Zack Deiri, President and CEO of Crocus Technology. "Our customers have been astounded by the level of performance we are able to deliver in their applications. The combination of high response time and accuracy provides system designers the flexibility they have been eager to achieve without any compromises." Targeting applications in Solar Power Inverters, Power-Factor Correction (PFC), Battery Management Systems (BMS), Smart Appliances, IoT, and Power Supplies applications. These devices are perfect companions to emerging applications utilizing GaN and SiC power devices where the fast response time of the Crocus TMR current sensors will ensure the highest operational efficiency.

Active Clamp Flyback Controller for Power Adapters Up To 100W
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Learn more:
silanna.com
  • Product Release
  • 2021-08-10

Silanna Semiconductor has launched an integrated active clamp flyback (ACF) controller that will reduce the operational and no-load/ stand-by power consumption of high-efficiency chargers and adapters while driving down component count, BOM cost and size. Silanna's ACF controller is targeted at high efficiency and high power density adapters of up to 65W output power with universal input and 100W output power with PFC-support applications, including single-port and multi-port USB-PD fast chargers. Featuring a high level of integration, the SZ1131 incorporates an adaptive digital PWM controller, ultra high-voltage (UHV) active clamp FET, active clamp gate driver and startup regulator. The SZ1131 provides the ease-of-design of a simple flyback controller with all the benefits of an ACF design, including recycling the leakage inductance energy of the flyback transformer and limiting the primary FET drain voltage spike during the turn-off events. Employing Silanna Semiconductor's OptiModeTM digital control architecture, the SZ1131 adjusts the device's mode of operation on a cycle-by-cycle basis to maintain high efficiency, low EMI, fast dynamic load regulation, and other key power supply parameters in response to varying line voltage and load. An all-silicon 65W USB-PD reference design using the SZ1131 demonstrates a 30W/inch3 power density (uncased) with impressive ~93% low line (90Vac) and > 94% high line (230Vac) efficiencies, while using lower cost components. These include a conventional RM8 transformer, 100V SR FET, minimal clamp capacitor, and a single common mode choke in the input filter. Silanna Semiconductor's technology-agnostic approach focuses on the ultimate power management challenges and delivers even higher efficiency and power density when paired with GaN primary FETs.

Rad Hard Gallium Nitride (GaN) Power Devices for Geostationary Satellites
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Learn more:
epc.space
  • Product Release
  • 2021-08-10

EPC Space announces that it has been selected by Astranis to provide Rad Hard gallium nitride-based power devices for use in DC power supplies on the latest satellite build. Astranis announced earlier that it has started to build four new small geostationary communications satellites, three of which are already spoken for signed deals with new, yet-to-be-announced customers. This new build of Astranis satellites is expected to offer 15% greater lifetime and 20% greater throughput the first-generation model, without increasing satellite hardware costs. Astranis is building small, low-cost telecommunications satellites to connect the four billion people who currently do not have access to the internet. Each spacecraft operates from geostationary orbit (GEO) with a next-generation design of only 400 kg. By owning and operating its satellites and offering them to customers as a turnkey solution, Astranis can provide bandwidth-as-a-service and unlock previously unreachable markets. The Rad Hard GaN power devices that EPC Space is providing to Astranis provide high precision, small size, low weight, and can withstand the harsh environment of space. "We are honored that Astranis has selected EPC Space as a trusted vendor to provide Rad Hard GaN for their geostationary satellites" commented Bel Lazar, CEO. "This program will add to the tens of thousands of our units already on board of satellites flying in LEO and GEO orbit with mission lives of more than 10 years."

Ultra-Low Loss Diode for Light Vehicle Generators
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Learn more:
infineon.com
  • Product Release
  • 2021-08-10

Infineon Technologies and Robert Bosch GmbH are launching an ultra-low-loss diode called Active Rectifying Diode for light vehicle generators. It enables an increase in generator efficiency of up to eight percent compared to conventional power conversion methods and facilitates generators to qualify as eco-innovations as defined by the European Union. Deploying the diode can reduce the CO 2 emissions of a car by up to 1.8 g/km. Since it can replace standard devices one-to-one, the Active Rectifying Diode can easily be applied even to generators and cars that are already in series production. The Active Rectifying Diode is based on a new chip technology from Infineon that integrates MOSFETs, capacitors and control logic on a single die, thus avoiding the complex mounting of separate chips. The Infineon chip is then assembled by Bosch into the body of the diode in a pressfit package. The new diode is unique for several reasons including its extremely low diode forward voltage of 0,1 V at 100A I RMS (root mean square current) and lowest leakage current. Additionally, it features a simple assembly process, mechanical robustness as well as high reliability and electromagnetic compatibility.

Strengthening Distributed Energy Resources Management Solutions
  • Industry News
  • 2021-08-10

Mitsubishi Electric Corporation announced, together with its U.S. subsidiary Mitsubishi Electric Power Products, Inc. (MEPPI), that it has entered into an agreement to acquire UK-based Smarter Grid Solutions (SGS). SGS is a leading global provider of distributed energy resources (DER) management software for power distribution utilities and DER operators. "We are very excited to bring SGS into Mitsubishi Electric. They are committed to the mission of decarbonizing electric power production and have spent the last decade developing world-class products and processes. We look forward to marrying their products with our suite of grid control products to help our customers respond to changes and still get the best performance from their electric grids." said Brian Heery, President and CEO of Mitsubishi Electric Power Products, Inc. "SGS offers innovative solutions have helped power utilities in Europe and North America install, manage and optimize renewable energy resources, and we look forward to bringing that DER management core competency to new markets around the globe," said Noriyuki Takazawa, Group President of Energy and Industrial Systems Group, of Mitsubishi Electric Corporation. "The SGS solutions align with the Mitsubishi Electric Environmental Sustainability Vision to realize a decarbonized society by the year 2050 through reduced greenhouse gas emissions." "We are thrilled to join Mitsubishi Electric and expand the reach of our energy management enterprise software to DER customers around the globe and - in turn - assist those customers to better manage DER assets as they strive to decarbonize their operations," said Brent Marshall, CEO of SGS.

Online Power Design Tool Makes Identifying Optimal SiC FET Design Solutions Easy
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Learn more:
unitedsic.com
  • Product Release
  • 2021-08-10

UnitedSiC has launched an upgrade to its FET-Jet Calculator. This version (v2) significantly streamlines the SiC FET and Schottky diode selection process and simplifies the analysis of all power related results. First launched in March, this simple, registration-free online tool facilitates the designer's selection and performance comparison process, in different power applications and 26 unique topologies. With more available topologies, FET-Jet Calculator now supports an even wider range of power applications, making UnitedSiC FETs accessible to anyone looking to work with SiC for the first time or experienced designers seeking the best SiC device to suit their design. Allowing for engineers to identify the optimal UnitedSiC device across AC/DC, DC/DC and DC/DCiso power designs, this upgrade adds instant bar chart results presenting both losses and efficiency data. Optimal gate drive and snubber recommendations are also displayed. Finally, once the preferred SiC solution is defined, all input/output design information can be easily downloaded in pdf form. As with the first version of the calculator, users select their application function and topology, enter their design parameter details, and the tool automatically calculates switch current, efficiency, and losses, categorized by conduction, turn-on, and turn-off contributions. All UnitedSiC FETs and Schottky diodes can be selected from sortable tables including the latest Gen 4 750V devices. The tool also warns if a selection is not suitable, allowing engineers to quickly find the ideal design solution.

Direct Bonded Copper Ceramic Substrate
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Learn more:
rogerscorp.com
  • Product Release
  • 2021-08-10

Rogers Corporation's Advanced Electronics Solutions (AES) group launches curamik Endurance substrates which is a Direct Bonded Copper Ceramic Substrate with enhanced properties. curamik Endurance substrates provide enhanced reliability performance compared to material combinations of the same dimensions. This reliability improvement makes the new substrates well suitable for high power applications, such as in EV/HEV, Vehicle Electrification, Industrial, Renewable and Mass Transit. curamik Endurance extends the field of applications for DBC. Thermal cycle tests show that curamik Endurance substrates have an extraordinary increased lifetime compared to its alternative standard DBC substrates with dimples (AlN, Al2O3, HPS (ZTA)). To achieve the increase in reliability, Rogers adjusted the design of the copper sidewall to gain the perfect stress release. The current available material combinations are all based on a 0.3mm copper thickness. The ceramic types Al2O3, HPS (ZTA) and AlN can be chosen by referencing our curamik Ceramic Substrates - DBC Technology design rules.

Quick Charge Compliant 100 W USB-C PD PPS Charger
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Learn more:
transphormusa.com
  • Product Release
  • 2021-08-10

Transphorm announced a collaboration with power solutions manufacturer Salom to bring to market a Quick Charge 5 compliant 100 watt GaN power adapter that is slated for release in Q4 2021. The USB-C Power Delivery (USB-C PD) charger will pair with Quick Charge 5 technology-capable of charging smartphones from 0 to 50 percent in five minutes. It will be a universal adapter offering the traditional power delivery mode and the USB-C programmable power supply (PPS) mode version 3.0, which enables the charger to easily deliver a sliding range of voltages (between 3.3 V to 21 V) versus the traditional mode's stepped voltage output. With assistance from Qualcomm Technologies, Transphorm developed the adapter's specification and designed the overall functional product, from the universal input through to the USB-C PD/PPS output. Transphorm's GaN is used in the traditional AC-to-DC boost PFC and the DC-to-DC quasi-resonant flyback (QRF) topologies. Salom was responsible for then taking that designed system, fine tuning it, developing its enclosure and completing all the required certifications such as Quick Charge 5, conducted/radiated emissions, touch temperature, and others. "Adapter solutions with Transphorm's GaN enable more with less," said Philip Zuk, SVP of Worldwide Technical Marketing and Business Development, Transphorm. "Compared to other GaN solutions such as e-mode, our normally-off SuperGaN FETs offer ease of design and standard Silicon-like drivability while delivering more power in a considerably smaller footprint without compromise. And we've proven that our production yields can meet high volume requirements." 

Wade Appelman Named President and COO
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Learn more:
aceinna.com
  • People
  • 2021-08-05

Aceinna named Wade Appelman as the company's President & COO, responsible for developing and implementing strategy for the company's worldwide operations. "ACEINNA is part of two exciting market trends, autonomous driving and vehicle electrification. Used in autonomous vehicles to ensure both accuracy and safety, high precision Inertial Measurement Unit Sensors (IMU) complement perception sensors such as imaging, radar and LiDAR," says Mr. Appelman. "Current sensing is another strength for ACEINNA critical to power management and I'm excited to help this talented team continue its amazing growth and technology innovation in both of these segments." According to Dr. Yang Zhao, founder and CEO of ACEINNA, "Wade is an organized and dynamic technology executive who will be able to successfully lead the ACEINNA engineering, marketing and business teams towards our goal of making next generation self- driving and eco-friendly vehicles a reality." Prior to joining ACEINNA, Mr. Appelman was VP and GM of the depth sensing division of ON Semiconductor where he led the team responsible for adoption of low light sensors in LiDAR and successfully secured early customers designs in automotive, medical, and industrial markets for the divisions sensing product portfolio. 

New Brand and Promise of Sustainable Future
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Learn more:
onsemi.com
  • Industry News
  • 2021-08-05

ON Semiconductor revealed its new trade name "onsemi" and refreshed brand as a next step in the company's evolution to establish itself as the leading provider of intelligent power and sensing technologies. With a continued focus on the automotive and industrial end-markets, onsemi has sharpened its strategy to drive disruptive innovation that contributes to a sustainable ecosystem of high-growth megatrends such as vehicle electrification, advanced safety, alternative energy and factory automation. Under the tagline, "Intelligent Technology. Better Future.", onsemi plans to break through traditional thinking and market barriers to create innovative solutions that solve customers' most difficult design challenges, and support their achievement of their own climate initiatives, propelling the sustainable energy revolution. onsemi's value proposition includes a unique combination of deep systems knowledge, technology leadership, and industry-leading manufacturing and packaging proficiency. "We have spent the last several months focusing the strategy, and realigning our product portfolio and investments to deliver market-leading and differentiated technologies to our customers," said Hassane El-Khoury, CEO and president at onsemi. "We are creating intelligent power and sensing technologies to enable our customers' success, drive a better future for next generations and create value for our shareholders, always with an eye on sustainability to make the world a better place for everyone."

Top Manufacturer of Passive Components
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Learn more:
we-online.com
  • Industry News
  • 2021-08-05

As one of the leading manufacturers of electronic components, Würth Elektronik is a valued manufacturer partner of Mouser Electronics. Mouser is enthusiastic not only about the products, but also about the cooperation. For the second year in a row, Joe Haukos, Distribution Manager Americas at Würth Elektronik eiSos, was honored with the Mouser Best-in-Class Award. Each year, the electronics distributor honors individuals in the industry with its Best-in-Class Award, recognizing those who maintain a strategic partnership with the Mouser team, promote product lines and new product introductions, find creative solutions to mutually expand market share, maximize Mouser's value proposition, and champion Mouser within their own companies. The presentation of the award to Joe Haukos by Jeff Newell, Senior Vice President at Mouser Electronics, capped off a thoroughly enjoyable quarterly meeting. "We aspire to provide more than electronic components…we want to provide an experience which fosters loyalty with customers and business partners. Through exceptional collaboration and dedication within the greater Mouser organization, we're able to do just that." Said a pleased Joe Haukos Commented Newell, "We are pleased to present Joe with this award in recognition of his outstanding relationship with Mouser. Joe and the Würth team have proved dedicated to fostering collaboration, increasing annual revenues, and furthering our successful partnership."

Bridgeless Totem Pole PFC Evaluation Board
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Learn more:
gansystems.com
  • Product Release
  • 2021-08-05

GaN Systems and onsemi released a 300W BTP-PFC Bridgeless Totem Pole Power Factor Correction (PFC) evaluation board. The board includes onsemi's NCP1680, a dedicated critical conduction mode (CrM) bridgeless totem pole PFC controller, and GaN Systems' 650V GS66508B GaN transistors. The NCP1680 controller and GS66508B transistors combine to deliver an innovative cost-effective and high-performing solution in a small footprint. The solution enables power engineers to evaluate GaN and capitalize on its benefits in improving power system performance. GaN Systems' GS66508B is a 650V, 30A transistor that provides low-loss, high switching frequency, zero reverse recovery, and very low junction-to-case thermal resistance. The evaluation board allows rapid development of advanced totem pole PFC designs and ideal in various power supply applications for the data center, telecom, industrial, and consumer industries. On the controller side, this Bridgeless Totem Pole PFC solution leverages the NCP1680, which offers unique features for operation under light load conditions, digital voltage loop compensation, and near unity power factor in all operating modes. Altogether, the solution achieves near 99% efficiency, simplifies design, and reduces bill-of-material count and cost. "Leaders like onsemi recognize the importance of GaN and are optimizing controllers and creating complementary tools like the new 300W PFC evaluation board we introduced today. These solutions strengthen the GaN industry ecosystem in the goal to make better performing and more cost-effective power electronics," said Jim Witham, CEO at GaN Systems.

Automotive Grade Semi-Shielded Power Inductor Series
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Learn more:
bourns.com
  • Product Release
  • 2021-08-04

Bourns announced its automotive grade Model SRN6045HA power inductor series. These inductors feature semi-shielded construction to combine the features of non-shielded and shielded inductors, and offer lower magnetic field radiation than non-shielded inductors. The products are a more cost-efficient alternative to fully shielded ferrite-based inductors, yet allow high temperature operation compared to standard semi shielded inductors. In addition, the new inductor series is AEC-Q200 compliant with an operating temperature range of -55 to +125 °C making the Model SRN6045HA series ideal for power management and electromagnetic interference (EMI) filtering solutions in automotive, consumer, industrial and telecom electronics. The newly developed magnetic silicon-based coating used in the inductors enables high working temperatures and extends the operating temperature range by 20 percent on the high end compared to standard Bourns semi-shielded power inductors. The high-temperature magnetic silicon-based coating is applied to the perimeter of the inductor winding to provide effective magnetic shielding. Along with its high operating temperature, compact size and low losses, the Model SRN6045HA series also features high current capacity with saturation current Isat ranging from 1.2 – 18 A and heating current Irms of 0.72 – 7.0 A. The Bourns automotive grade SRN6045HA series is available now with inductance values of 0.55 – 100 µH and is RoHS compliant and halogen free.

Application-Specific MOSFETs (ASFETs) for Hot-Swap
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Learn more:
nexperia.com
  • Product Release
  • 2021-08-04

Nexperia announced 80 V and 100 V ASFETs with enhanced SOA performance, targeting hot-swap & soft-start applications in 5G telecom systems & 48 V server environments and industrial equipment needing e-fuse and battery protection. ASFETs are a new breed of MOSFET optimized for use in particular design scenarios. By focusing on specific parameters critical to an application, sometimes at the expense of others that are less important in the same design, new levels of performance can be achieved. The hot-swap ASFETs use a combination of Nexperia's latest silicon technology and copper-clip package construction to significantly strengthen the Safe Operating Area (SOA) and minimize PCB area. The PSMN4R2-80YSE (80 V, 4.2 m?) and PSMN4R8-100YSE (100 V, 4.8 m?) hot-swap ASFETs are packaged in the Power-SO8 compatible LFPAK56E. The unique internal copper-clip construction of the package improves thermal and electrical performance whilst substantially reducing footprint size.  The new LFPAK56E products are just 5 mm x 6 mm x 1.1 mm, offering reductions of 80 % and 75 % for PCB footprint and device height respectively, compared to the D2PAK of previous generations. The devices also feature a maximum junction temperature of 175 °C, meeting IPC9592 regulations for telecoms and industrial applications.

Stereo Gallium Nitride (GaN) Streaming Hi-Fi Audio Amplifier
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Learn more:
orchardaudio.com
  • Product Release
  • 2021-08-03

The Starkrimson Streamer Ultra combines a DAC, streamer, and amplifier all inside an easy-to-use enclosure that will blend into any décor. The Starkrimson Streamer Ultra represents a new kind of high-end audio system that offers commanding performance in a discreet package. It can perform the same functions that once required a rack full of components. This latest design combines the company's highly reviewed and award-winning PecanPi DAC and Starkrimson Ultra amplifiers, fully exploring the benefits of the latest GaN transistors, such as size and weight reduction and increased power, efficiency, and sound quality, from GaN Systems. The design provides less harshness, cleaner highs, and better overall transparency and detail with inconsequential noise levels. Starkrimson Streamer Ultra is available with either Volumio or Roon end-point software installed. It is available with either black or brushed aluminum faceplates, an optional USB port (Volumio only), and upgraded power rail capacitance. MSRP is $3,499.95 for the base model. Orchard Audio is offering preorder prices where the first 10 customers will save $1,000; the next 10 will save $750; and all other preorder customers will save $500. Units are scheduled to begin shipping in late November 2021.

Group Sustainability Director Emma Darke
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Learn more:
ttelectronics.com
  • People
  • 2021-08-03

TT Electronics announced the appointment of its first-ever Group Sustainability Director. Emma Darke, who has served as TT's Head of Investor Relations since 2016, has stepped away from her IR duties to take on this new and important role for TT Electronics. "This new appointment highlights the importance of sustainability as a critical strategic priority at TT," said Sarah Hamilton-Hanna, Chief People Officer, TT Electronics. "Emma's deep understanding of our business, as well as our environmental, social, and governance initiatives, makes her the ideal individual to accelerate TT's commitment to achieving our sustainability goals." As Group Sustainability Director, Emma is tasked with working in partnership with TT's business leaders and Sustainability Council to develop the company's sustainability roadmap to zero emissions by 2035. "TT Electronics has made great strides on the sustainability front. Now, with an even deeper commitment to the effort, TT is laser focused on improving upon our recent environmental accomplishments which include 20 per cent reduction in CO2 emissions, 88 per cent of company waste diverted from landfills, and zero waste achieved at three of our sites in 2020," added Emma Darke, TT's new Group Sustainability Director. "These accomplishments are certainly impressive and took a concerted effort but there is more to be done. With TT's emphasis on creating positive impacts to society, we are well on our way to achieving even greater results."

Scienlab Battery Pack Test System with High Voltage Silicon Carbide Technology
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Learn more:
keysight.com
  • Product Release
  • 2021-08-03

Keysight Technologies announced the Scienlab SL1700A Series, a battery pack test system for high voltage battery packs - up to 1500 V for automotive and industrial application. Customers need vast labs with multiple test channels to develop batteries, but space and power supplies are limited. Keysight's SL1700A Series utilizes high voltage silicon carbide (SiC) technology to achieve higher efficiency and energy recovery capabilities, which is crucial to reduce overall lab costs. It provides high power in a small footprint and is modular and upgradable to address future power needs. "Our next generation battery pack test systems based on high voltage SiC technology, provide more power and higher voltages in less space, when compared to similar systems," said Michael Schugt, managing technology director of Keysight's Automotive & Energy Solutions group. "When combined with the solutions energy efficiency, it allows our customers to design new batteries in their lab with greater flexibility." A battery pack is a complex system involving high voltages and currents, electrical and mechanical components, cooling system and a battery management system (BMS). All components require thorough testing to draw conclusions about the durability, range, efficiency and heating of the pack.


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Power Device Division Opens Power Electronics Research LaboratoryHitachi's Power Device Division has opened a testi...9461Industry NewsPower Device Division Opens Power Electronics Research LaboratoryHitachi's Power Device Division has opened a testing laboratory based in Bracknell, UK. The company relocated its testing laboratory to larger premises, to expand its research and testing capabilities. The launch of the laboratory is an exciting time for the company as it can now supply a range of testing, offering a comprehensive suite of services for semiconductors; which can be used to investigate anything from power module fault analysis to customer application specific conditions. The facility will enable Hitachi to assist its customers with designing in and problem-solving for the full range of its power modules (750 V to 6.5 kV), through various tests including Double Pulse testing, Short circuit conditions, Paralleled power modules testing, and Gate Driver Performance. Hitachi is flexible in implementing any test requirements for its customers to support them in their design-in phase. Aligned with its test facility, the company has also launched an online power simulation tool. This simulation tool is designed to help assist engineers to choose the right Hitachi semiconductor suited to their particular application needs. The online simulation tool and further details of the laboratory can be found on the company's website.13.10.2021 06:00:00Octnews_2021-10-15_1.png\images\news_2021-10-15_1.pnghttps://pdd.hitachi.eu/pdd.hitachi.eu
Textbook "GaN Power Devices and Applications"Efficient Power Conversion announces the publicati...9484Product ReleaseTextbook "GaN Power Devices and Applications"Efficient Power Conversion announces the publication of a valuable learning resource for professional engineers, systems designers, and electrical engineering students seeking the latest information on gallium nitride technology and applications. Since the 2019 release of the 3rd edition textbook, "GaN Transistors for Efficient Power Conversion", published by J. Wiley, there has been rapid adoption of GaN transistors and integrated circuits into a wide range of end-use applications such as robots, drones, Artificial Intelligence (AI) computers, AC adapters, autonomous vehicles, and even vacuum cleaners.  This book, "GaN Power Devices and Applications", provides an update on gallium nitride technology and applications by leading experts. With contributions from nearly thirty industry and academic experts, and edited by Alex Lidow, this book starts with two years of new information on technology developments, design techniques, and reliability beginning right after the publication of the 3rd edition textbook. In a practical sense, this book includes detailed discussion and analysis of the latest examples of actual GaN usage in power supplies, lidar, motor drives, and low-cost satellite applications. According to Alex Lidow, EPC's co-founder and CEO, "The information contained in this new textbook will help users fully understand, by examples, the incredible contribution that GaN devices can make to innovative power systems. In addition, QR codes have been inserted at the beginning of each chapter of the book for so that readers can link to the very latest information on GaN as new it emerges."12.10.2021 17:30:00Octnews_2021-10-15_25.jpg\images\news_2021-10-15_25.jpghttps://epc-co.com/epc/EventsandNews/News/ArtMID/1627/ArticleID/3008/New-Textbook-GaN-Power-Devices-and-Applications-from-Efficient-Power-Conversion-EPC-Now-Available-.aspxepc-co.com
High-Precision Voltage Reference IC Provides Very-Low DriftExtended-temperature-range voltage reference ICs f...9478Product ReleaseHigh-Precision Voltage Reference IC Provides Very-Low DriftExtended-temperature-range voltage reference ICs for automotive and industrial applications require low drift, high reliability and high performance. Microchip Technology announced today the release of a high-precision voltage reference (Vref) IC that meets these needs at a cost-effective price. The MCP1502 is an AEC-Q100 Grade 1 (-40°C to +125°C operating temperature range) automotive-qualified Vref with a maximum temperature coefficient of 7ppm/°C. "Microchip looked at the top four aspects that customers were requesting in a Vref and made a product that combines high reliability, small package size and high performance at a very cost-effective price," said Fanie Duvenhage, vice president of Microchip's mixed-signal and linear devices business unit. "This combination of features at this price is unmatched by competitors, especially when you add our experience in serving customers in the automotive and aerospace industries who require robust products for harsh environments." The MCP1502 is based on the already-proven MCP1501 Vref architecture, which has been in the market for more than five years. Packaged in a small six-lead SOT-23, the MCP1502 is an ideal choice for a wide variety of industrial, automotive and aerospace applications that require a high level of reliability. Microchip's MCP150x (MCP1501 and MCP1502) devices are perfect companions to Microchip's families of microcontrollers, ADCs and DACs, offering multiple voltage options for creating total system solutions that are suitable for a wide variety of applications that require stable, accurate and repeatable data conversion.07.10.2021 11:30:00Octnews_2021-10-15_19.jpg\images\news_2021-10-15_19.jpghttps://www.microchip.com/en-us/about/news-releases/products/high-precision-voltage-reference-ic-provides-very-low-drift-for-extended-temperature-automotive-applications#microchip.com
Low Phase Noise GaAs MMIC AmplifierRichardson RFPD announced the availability and ful...9476Product ReleaseLow Phase Noise GaAs MMIC AmplifierRichardson RFPD announced the availability and full design support capabilities for a gallium arsenide MMIC amplifier from Analog Devices. The ADL8150 is a self-biased GaAs MMIC, heterojunction bipolar transistor, low phase noise amplifier that operates from 6 GHz to 14 GHz. The amplifier has low phase noise of -172 dBc/Hz at 10 kHz offset and provides 12 dB of typical signal gain and +30 dBm typical output third-order intercept. The amplifier requires 74 mA from a 5 V collector supply voltage. The ADL8150 also features inputs and outputs that are internally matched to 50 ?, facilitating integration into multichip modules. The ADL8150 is versatile for a range of applications, including military and space, test instrumentation, and communications.06.10.2021 09:30:00Octnews_2021-10-15_17.jpg\images\news_2021-10-15_17.jpghttps://www.richardsonrfpd.com/docs/rfpd/Richardson_RFPD_Announces_Analog_Devices_ADL8150.pdfrichardsonrfpd.com
Energy Sharing Among Neighbors with Demand-Oriented Distribution for Solar EnergyIn order to meet Europe's (EU) ambitious climate t...9470Industry NewsEnergy Sharing Among Neighbors with Demand-Oriented Distribution for Solar EnergyIn order to meet Europe's (EU) ambitious climate targets, greenhouse gas emissions must be drastically reduced by 2030. To achieve this, around 28 million multi-family houses with over 80 million households must be equipped with photovoltaics. Despite the support of the EU, there are still enormous technical and regulatory obstacles, specifically with the power supply for small multi-family houses from renewable energy sources. In a cooperation with Infineon Technologies, Munich based start-up PIONIERKRAFT has overcome these hurdles with an innovative hardware and service solution coined PIONIERKRAFTwerk (German only). This technology enables self-produced solar energy to be distributed physically and by demand between different households. With Infineon's support, renewable energy can then be shared with neighbors in a decentralized manner and without intermediate storage – economically and without bureaucratic obstacles. The hardware of the participating parties is connected to the platform provided by PIONIERKRAFT using the Internet. This determines the power surplus of the generator as well as the current demand of neighbors to autonomously control the distribution process. Thus, households without a photovoltaic system can use solar power. The solution also regulates the power flows without using the public grid. Several Infineon components make this possible, including the discrete CoolSiC MOSFET IMBG120R030M1H in the surface-mount D2PAK-7L package and the EiceDRIVER Compact Gate Driver 1ED3122MU12H. By working together, the PIONIERKRAFTwerk performs efficient and bidirectional power transfer. Therefore, energy with a power of up to 2000 W can be transferred between households.05.10.2021 15:00:00Octnews_2021-10-15_10.jpg\images\news_2021-10-15_10.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2021/INFIPC202110-003.htmlinfineon.com
1200V Silicon Carbide Half Bridge Power ModuleSolitron has developed the SD11900 series, a 1200V...9475Product Release1200V Silicon Carbide Half Bridge Power ModuleSolitron has developed the SD11900 series, a 1200V, 50A power module platform to maximize the benefits of SiC, with a unique robust, simple, and cost-effective module format. The 37mm x 25mm outline is a fraction of the size and weight of standard 62mm modules. The SD11900 series maximizes power density while minimizing loop inductance with a pin configuration to allow simple power bussing. The SD11902/3/4/5 are half bridge configurations with two 1200V 32mO SiC MOSFETs. The SD11902 and SD11904 feature freewheeling 1200V SiC Schottky diodes in parallel with the MOSFETs inside the module. Two pinout configurations provide flexible power bussing options. Continuous drain current is specified at 50A. The SD11900 series is designed for demanding applications such as avionics based electromechanical actuators and power converters. With operating temperatures of -55°C to 175°C, construction includes copper baseplates and Alumina Nitride insulators ensuring TCE matching and high thermal transfer. Isolated integrated temperature sensing enables high level temperature protection. Silicon Carbide provides excellent switching performance versus the best-in-class silicon MOSFETs and IGBTs with minimal variation versus temperature. Higher efficiency levels than silicon due to significantly lower energy loss and reverse charge results in more switching power and less energy required in the switch-on and switch-off phase. Combined with high switching frequencies this translates to smaller magnetics significantly reducing system weight and size.04.10.2021 08:30:00Octnews_2021-10-15_16.jpg\images\news_2021-10-15_16.jpghttps://solitrondevices.com/solitron-devices-announces-1200v-silicon-carbide-half-bridge-power-module/solitrondevices.com
Successful Transition to Global Semiconductor PowerhouseFollowing a massive four-year transformation, invo...9463Industry NewsSuccessful Transition to Global Semiconductor PowerhouseFollowing a massive four-year transformation, involving the divestiture of two-thirds of the business and a repositioning of the company's overall core strategy, October 4th marks the creation of Wolfspeed. The company, formerly known as Cree, officially launches under its new name with the support of a comprehensive, multi-channel, integrated marketing campaign. Wolfspeed has served as the brand for the company's Silicon Carbide materials and semiconductor devices business unit for the past six years. Built on a 30-year heritage of domain expertise, the name Wolfspeed conveys both the noble traits of the wolf – leadership, intelligence and endurance – and speed, characterized by the pace at which the company innovates and operates, both unmatched in the industry. "Today officially marks a transformative milestone for Wolfspeed as we are now a pure-play global semiconductor powerhouse," said Gregg Lowe, CEO at Wolfspeed. "The next generation in power semiconductors will be driven by Silicon Carbide technology, with superior performance that unleashes new possibilities and positive changes to the way we live. As the original champion of this technology, we couldn't be more excited for what lies ahead." Lowe joined the company in September 2017 with a vision and commitment to a more collaborative culture built on ingenuity and a mission to pursue a more efficient future. Now, with multi-year, long-term materials agreements totaling more than $1.3 billion across several industries, a device pipeline that totals more than $15 billion, and an increased production capacity 30X larger than previous facility plans, Wolfspeed is driving multiple industries through a monumental shift from silicon to Silicon Carbide.04.10.2021 08:00:00Octnews_2021-10-15_3.jpg\images\news_2021-10-15_3.jpghttps://www.wolfspeed.com/company/news-events/news/cree-inc-officially-changes-company-name-to-wolfspeed-inc-marking-successful-transition-to-global-semiconductor-powerhousewolfspeed.com
Webpage-Launched Simulator AvailableThe latest in a long line of Vincotech simulation ...9480Product ReleaseWebpage-Launched Simulator AvailableThe latest in a long line of Vincotech simulation environments, VINcoSIM is the first simulator to launch from a webpage. It features topology modeling and an accurate, proven loss and temperature calculation engine. Users can even define custom heatsink builds in a one-step configuration. A click or two is all it takes to quickly assess the options and choose the best fit. "This tool is a great leap forward," says Vincotech CEO Eckart Seitter. "As a reliable partner, we aim to bring speed and flexibility to our business relationships. Part of that is helping customers make fast but well-informed decisions. We have always gone to great lengths to provide accurate, reliable simulation tools. And VINcoSIM is our most powerful and convenient power module selection tool yet." The company's first ISE simulation tool debuted 20 years ago, setting a benchmark for customer support in the power module business. Drawing on two decades' experience advancing the state of the art in simulation tools, the company has now created an easy-to-use environment to rapidly test and evaluate any of its power modules, regardless of sub-topology or components. No compromises in functions or features is demanded. Designed to fast-track simulations, VINcoSIM configures automatically when the user selects a product on the website. It is the only tool of its kind to simulate any type of topology, even the most advanced. VINcoSIM runs on substantiated data from measurements taken in high-tech labs. It is reliable; its results are accurate.01.10.2021 13:30:00Octnews_2021-10-15_21.jpg\images\news_2021-10-15_21.jpghttps://www.vincotech.com/news/company-news/article/vincotech-rolls-out-new-online-simulation-tool.htmlvincotech.com
Facilities with 200kW Dyno and 250 kW DC Power SupplyPre-Switch has expanded into a new facility. The p...9472Industry NewsFacilities with 200kW Dyno and 250 kW DC Power SupplyPre-Switch has expanded into a new facility. The premises will support the next phase of the company's growth and accelerate the application of the Pre-Switch technology which extends the range of e-mobility applications including EVs, electric aircraft and electric boats and other watercraft. The technology has been licensed and delivered via the CleanWave inverter reference design to leading e-mobility innovators around the world. Pre-Switch's new facility, in San Jose, California, has been outfitted with a 200kW dynamometer, a 250kW DC power supply and high precision efficiency test stations that have been custom-built to precisely measure inverter efficiencies above 99%.  This new and valuable resource will enable customers to experience the gains that can be achieved by running their inverters at 100kHz with virtually zero switching losses, and measure the motor efficiencies that result from the higher quality sine wave generated by the faster switching frequencies. Bruce Renouard, Pre-Switch CEO explains: "Inverter efficiency is vital, but in many applications, motor efficiency, especially at low torque where the motor mainly operates, is even more important. Only our soft-switching technology can deliver both, unlike hard-switching techniques which cannot get close to matching our system efficiency levels."30.09.2021 18:00:00Sepnews_2021-10-15_13.jpg\images\news_2021-10-15_13.jpghttps://www.pre-switch.com/pre-switch.com
Josef Vissing Named PresidentTDK Corporation announced that effective October 1...9471PeopleJosef Vissing Named PresidentTDK Corporation announced that effective October 1, 2021, Josef Vissing  (57) has been named President of TDK Europe GmbH, the company's European sales organization for passive components. He thus succeeds Ludger Trockel (57), who will take over the role as Head of Sales & Marketing Group of TDK Corporation's Electronic Components Business Company in Japan, Tokyo. TDK Europe's management team also includes Oliver Huettner (49). Huettner, Executive Vice President, will serve as the TDK Europe Head of Business Administration. The two are in full agreement: "TDK Europe's established set-up enables us to offer the best support for our European customers with a unique product portfolio centered on TDK's three key markets, Automotive, Industrial & Home Appliance and Communications. We aim to continue to grow the business together with our customers and support the growth strategies of TDK Corporation related to digital transformation and energy transformation of our society." Josef Vissing has held a number of sales positions at TDK Europe and EPCOS AG, since he joined the company in 1991 with a Diploma degree in industrial engineering. Since then, Vissing has acquired many years of business experience, among others as Head of Product Marketing for Ferrites, Head of Business Unit Transfomers and as CEO and President of EPCOS (Zhuhai) Co. in China. In 2012 he was named Head of Sales GNS (Germany, Netherlands, Switzerland) for EPCOS AG and in this capacity has been responsible for one of the company's most important sales regions.30.09.2021 17:00:00Sepnews_2021-10-15_12.jpg\images\news_2021-10-15_12.jpghttps://www.tdk-electronics.tdk.com/en/373388/company/press-center/press-releases/press-releases/josef-vissing-new-president-of-tdk-europe/3025452tdk-electronics.tdk.com
Wireless Charging Transmitter SolutionsAlpha and Omega Semiconductor announced a family o...9474Product ReleaseWireless Charging Transmitter SolutionsAlpha and Omega Semiconductor announced a family of Coil Drivers. The initial product, AOZ32033AQI, offers 30V, 11mOhm in a QFN3x3 package. AOZ32033AQI is an integrated half-bridge gate driver capable of driving high-side and low-side N-channel MOSFETs. It features SRC (Slew Rate Control) to adjust sink/source current and provide the ideal trade-off between efficiency and EMI optimization in the design of Wireless Charging Transmitter (TX) circuits. The device is ideally suited to the design of Wireless Charging TX circuits used in cordless power tools, vacuum cleaners, drones, and other consumers' electronic equipment composed of full-bridge topology with a resonant tank circuit to get the best power conversion efficiency. With a highly integrated package, the AOZ32033AQI offers a part count reduction of up to 40% compared to traditional approaches. The device enables PCB space savings and higher performance in wireless transmitter circuits with high wattage of up to 30W. Moreover, the AOZ32033AQI has multiple protection functions such as high side and low side UVLO and over-temperature protection (OTP) to make the design more robust. The device can be used for a wide range of input voltages from 4V to 28V. "Wireless charging is offered at increasingly higher power levels as the benefits of eliminating physical connectors and cables are being realized by more end applications. AOS's Coil Driver products provide an efficient, power-dense, and cost-effective solution for wireless charging TX circuits. The integrated approach offers protection features not possible by using a discrete approach while reducing engineering design cycles and complexities," said Colin Huang, Power IC Marketing Manager at AOS.30.09.2021 07:30:00Sepnews_2021-10-15_15.jpg\images\news_2021-10-15_15.jpghttp://www.aosmd.com/res/news/news-article-1633015195422/AOZ32033AQI_PR.pdfaosmd.com/pdf
Charger Delivers 100km of Range in Less Than Three MinutesABB is launching an all-in-one Electric Vehicle (E...9473Product ReleaseCharger Delivers 100km of Range in Less Than Three MinutesABB is launching an all-in-one Electric Vehicle (EV) charger, which provides the fastest charging experience on the market. ABB's Terra 360 is a modular charger which can simultaneously charge up to four vehicles with dynamic power distribution. This means that drivers will not have to wait if somebody else is already charging ahead of them. They simply pull up to another plug. The charger has a maximum output of 360 kW and is capable of fully charging any electric car in 15 minutes or less, meeting the needs of a variety of EV users, whether they need a fast charge or to top their battery up while grocery shopping. "With governments around the world writing public policy that favors electric vehicles and charging networks to combat climate change, the demand for EV charging infrastructure, especially charging stations that are fast, convenient and easy to operate is higher than ever," said Frank Muehlon, President of ABB's E-mobility Division. "The Terra 360, with charging options that fit a variety of needs, is the key to fulfilling that demand and accelerating e-mobility adoption globally." "It's an exciting day for ABB, who as the global leader in electric vehicle fast charging, is playing a key role in enabling a low carbon society," said Theodor Swedjemark, Chief Communications and Sustainability Officer at ABB.30.09.2021 06:30:00Sepnews_2021-10-15_14.jpg\images\news_2021-10-15_14.jpghttps://new.abb.com/news/detail/82941/abb-launches-the-worlds-fastest-electric-car-chargerabb.com
Power Integrity Solution for Analog, Digital and Mixed-Signal IC DesignsSiemens Digital Industries Software introduced mPo...9449Product ReleasePower Integrity Solution for Analog, Digital and Mixed-Signal IC DesignsSiemens Digital Industries Software introduced mPower power integrity software for analog, digital and mixed signal IC designs. The software is an IC power integrity verification solution to provide virtually unlimited scalability for analog, digital, and mixed signal ICs, enabling comprehensive power, electromigration (EM) and voltage drop (IR) analysis for even the largest IC designs. The mPower power integrity solution completes Siemens' overall electro-physical signoff suite addressing power, performance, and reliability analysis. Other offerings in this suite include Calibre PERC software, PowerPro software, HyperLynx software, and the Analog FastSPICE platforms. With this comprehensive signoff suite, designers can now use an all-Siemens power integrity design flow. "Design companies must run both block and full-chip EM/IR analysis to confirm that the power grid delivers the necessary current to the devices, and that wires will not fail prematurely," said Joe Sawicki, executive vice president for Siemens' IC EDA Segment. "With our innovative mPower solution, companies now have a fast, scalable dynamic analysis option for analog, digital and mixed signal layouts of any size, as well as silicon-proven accuracy and fast turns for even the largest digital chips."28.09.2021 08:30:00Sepnews_2021-10-01_13.jpg\images\news_2021-10-01_13.jpghttps://www.plm.automation.siemens.com/global/en/our-story/newsroom/siemens-mpower-power-integrity-analysis/101904siemens.com
Semiconductor R&D and Test Open LaboratoryKeysight Technologies and National Central Univers...9445Industry NewsSemiconductor R&D and Test Open LaboratoryKeysight Technologies and National Central University Optical Sciences Center (NCUOSC) announced a collaboration to improve the design and test validation efficiency of gallium nitride (GaN) and silicon carbide (SiC) applications, accelerating the pace of 5G and electric vehicle (EV) innovation. Wide band gap (WBG) materials, such as GaN and SiC, offer rapid switching speeds, low loss and withstand high temperature and voltage characteristics. As a result, these materials are leveraged in consumer power products, fast charging, electric vehicles and rail transit, as well as 5G infrastructures and data center servers. However, these advantages increase the complexity of design and testing. NCUOSC successfully used Keysight's PD1500A Dynamic Power Device Analyzer/Double Pulse Tester (DPT) platform to establish a third generation WBG semiconductor open laboratory to improve developing and testing efficiency. As the JEDEC, a global leader in developing open standards and publications for the microelectronics industry, continues to define the dynamic testing of WBG devices, standardized tests are starting to emerge. The Keysight PD1500A DPT determines the key performance parameters, which match all standards, such as turn-on/off and switching characteristics, dynamic on-resistance, dynamic current and voltage, as well as reverse recovery, gate charge and device output characteristics. "Keysight is happy to work with NCUOSC to help engineering teams characterize, understand, integrate, deploy and drive innovations for next-generation semiconductor technologies," said Thomas Goetzl, vice president and general manager of Keysight's Automotive and Energy Solutions business unit.27.09.2021 14:00:00Sepnews_2021-10-01_9.png\images\news_2021-10-01_9.pnghttps://www.keysight.com/de/de/about/newsroom/news-releases/2021/0927-nr21131-keysight-technologies--national-central-university-.htmlkeysight.com
Entire Capacitor Portfolio on One WebsiteCornell Dubilier has brought its Illinois Capacito...9469Industry NewsEntire Capacitor Portfolio on One WebsiteCornell Dubilier has brought its Illinois Capacitor brand capacitors to cde.com. Now engineers can view the entire portfolio of CDE and IC capacitors for power electronics applications on one site. This includes such specialized products as IC's supercapacitors, conduction-cooled (high density resonant) capacitors, rechargeable coin cell batteries, and other new additions. CDE's updated parametric search tools simplify the capacitor selection process as never before. As Illinoiscapacitor.com has now been shut down, links to that site will be automatically redirected to cde.com. In addition to combining product data, the site's Tech Center has been expanded to include additional engineering resources, such as application guides, capacitor formulas, tutorials, and a detailed glossary of terms. CDE will continue to support all IC branded products, which are available from major distributors and the company's representative network.27.09.2021 14:00:00Sepnews_2021-10-15_9.jpg\images\news_2021-10-15_9.jpghttps://www.cde.com/cde.com
3kW AC/DC PSU for Power Supply ApplicationsGaN Systems introduced a high efficiency, highest ...9483Product Release3kW AC/DC PSU for Power Supply ApplicationsGaN Systems introduced a high efficiency, highest power density 3kW Bridgeless Totem Pole (BTP) PFC + LLC Resonant Converter Power Supply Unit (PSU) that exceeds the 80 PLUS Titanium standard. The combined GaN BTP-PFC with GaN LLC resonant converter enables designers to create lower-cost power supplies that meet demands to deliver more power in a smaller footprint and new energy efficiency requirements, including European Union's "Lot 9" 2023. "With the expanding volume of data, game-changing solutions are needed to reduce energy consumption and contribute to a more sustainable future in our data centers, and these PFC and LLC reference designs take PSUs to the next level," says Paul Wiener, VP of Strategic Marketing at GaN Systems. New efficiency mandates, increasing power and data demands, and the shift to "Dollar per Density," where density is a measure of size and power of the power supply, spur the immediate need to change data center economics with smaller, more efficient, and reliable power supply design. GaN brings higher efficiency, higher power density, lower cost, and increased sustainability to the data center ecosystem. GaN Systems concluded that significant energy and cost savings are achieved by switching from silicon-based PSUs to GaN-based PSUs. Since data centers vary in size, the savings are based on a 10-Rack unit of measure. From a sustainability perspective, each set of 10 racks reduces CO2 emissions by 100 metric tons per year, and financially, GaN-based PSUs increase data center profits by $3 million per year.    23.09.2021 16:30:00Sepnews_2021-10-15_24.png\images\news_2021-10-15_24.pnghttps://gan-systems.reportablenews.com/pr/3kw-ac-dc-psu-from-gan-systems-shatters-size-and-cost-barriers-for-power-supply-applicationsgan-systems.com
300mm, High-Temp Single-Wafer SPMACM Research announced it has shipped its first 30...9440Industry News300mm, High-Temp Single-Wafer SPMACM Research announced it has shipped its first 300mm single-wafer Sulfuric Peroxide Mixture systems (Single-Wafer SPM tool) for wet clean and etch processes in advanced logic, DRAM and 3D-NAND integrated circuit manufacturing. ACM's Single-Wafer SPM tool targets high ion dose doped photoresist (PR) wet strip processes, with support for metal etch or strip processes. This tool extends ACM's SPM product offering to include higher temperature SPM steps that are emerging for more advanced production nodes at 10nm and beyond. "ACM's Single-Wafer SPM tool builds on the proven performance of our Ultra C Tahoe, which addresses most SPM process steps that operate at regular temperatures," said Dr. David Wang, Chief Executive Officer and President of ACM Research. "We have leveraged Tahoe's proven capabilities to develop the Single-Wafer SPM tool, strengthening our wet cleaning portfolio with the addition of high-temperature SPM. Together, the Tahoe and Single-Wafer SPM tools address virtually all SPM processes currently deployed in advanced semiconductor manufacturing.   We continue to develop new process capabilities, including advanced hot isopropyl alcohol (IPA) drying and super critical CO2 dry technologies, with the goal of becoming a major global cleaning solution provider."23.09.2021 09:00:00Sepnews_2021-10-01_4.png\images\news_2021-10-01_4.pnghttps://ir.acmrcsh.com/news-releases/news-release-details/acm-research-ships-its-first-300mm-high-temp-single-wafer-spmacmrcsh.com
AEC-Q200 Qualified Thick Film Chip ResistorVishay Intertechnology announced that it has enhan...9460Product ReleaseAEC-Q200 Qualified Thick Film Chip ResistorVishay Intertechnology announced that it has enhanced the Vishay Draloric RCC1206 e3 thick film chip resistor in the 1206 case size with a higher power rating of 0.5 W. Offering twice the power of standard thick film chip resistors in this size, the RCC1206 e3 can be used in place of two parallel 1206 devices or a single device in the larger 1210 case size. This allows designers to save board space in automotive, industrial, telecommunications, and medical applications, while lowering component counts and reducing placement costs. AEC-Q200 qualified, the RCC1206 e3 features a resistance range from 1 O to 1 MO -and 0 O jumper - with tolerances of ± 1 % and ± 5 % and TCR of ± 100 ppm/K and ± 200 ppm/K. The resistor offers an operating voltage of 200 V and an operating temperature range of -55 °C to +155 °C. RoHS-compliant and halogen-free, the device is suitable for processing on automatic assembly systems, and wave, reflow, or vapor phase soldering per IEC 61760-1.22.09.2021 19:30:00Sepnews_2021-10-01_24.jpg\images\news_2021-10-01_24.jpghttps://www.vishay.com/company/press/releases/2021/RCC1206e3/vishay.com
Wireless BMS in Lotus Electric VehiclesAnalog Devices announced that renowned British per...9444Industry NewsWireless BMS in Lotus Electric VehiclesAnalog Devices announced that renowned British performance brand Lotus Cars is planning to incorporate ADI's wireless battery management system (wBMS) in its next-generation electric vehicle (EV) architecture. ADI's wBMS was selected for its increased design flexibility, battery repairability and lighter weight. The engineering collaboration will enable Lotus to safely propel its future EV fleet and continue pushing the limits of design and technology. ADI's wBMS technology eliminates the traditional wired harness, leading to a reduction of up to 90% in the wiring and 15% of the volume in the battery pack. It also improves design flexibility and manufacturability, without compromising range and state of charge accuracy over the life of the battery. ADI's wBMS enables simplified assembly and disassembly of battery packs to ensure faulty battery cells can be removed and repaired quickly and efficiently. "We worked closely with Analog Devices to integrate wBMS into our new Lightweight Electric Vehicle Architecture (LEVA), which will be the basis for all future Lotus EVs," said Richard Lively, Director, Propulsion and Chassis Engineering, Lotus Cars. "The removal of the wire harness for wBMS ensures that Lotus can offer a lightweight solution that optimizes performance and is consistent with our brand of delivering powerful performance cars with exceptional handling."22.09.2021 13:00:00Sepnews_2021-10-01_8.jpg\images\news_2021-10-01_8.jpghttps://www.analog.com/en/about-adi/news-room/press-releases/2021/9-22-2021-adi-wireless-bms-helps-lotus-cars-redefine-mobility.htmlanalog.com
Joint Venture to Manufacture and Sell Lithium-ion Dry-Process Battery SeparatorsPolypore International and Shanghai Energy New Mat...9443Industry NewsJoint Venture to Manufacture and Sell Lithium-ion Dry-Process Battery SeparatorsPolypore International and Shanghai Energy New Materials Technology reached agreement in January 2021, through their respective subsidiaries, to establish a joint venture (JV) in China for dry-process membrane separator for lithium-ion batteries (LIBs). The necessary regulatory approvals are complete, and the JV has been established as Jiangxi Enpo New Materials in Gaoan City, Jiangxi Province, People's Republic of China. Based on a license from Polypore's subsidiary Celgard, LLC (Celgard) for technology and intellectual property related to dry-process polypropylene (PP) separator, the JV will manufacture and sell quality, high-performance dry-process separator in China for LIBs used in energy storage systems (ESS) and electric-drive vehicles (EDVs). Production is scheduled to start in 2022 with PP membrane capacity of 100 million m2/year. In the joint venture, PPO Energy Storage Materials HK Ltd. will have 49 percent of the equity contribution and SEMCORP will have 51 percent. "By joining Celgard's specialized knowledge in technology, processing, and material science together with SEMCORP's operational expertise in China, the joint venture will not only provide a wide range of solutions to customers but also stimulate further development of the LIB industry overall," said Celgard president, Lie Shi. "I am thrilled to begin this partnership with SEMCORP. The combination of our two companies' strengths will provide new solutions for the world's challenges related to the environment and energy."22.09.2021 12:00:00Sepnews_2021-10-01_7.jpg\images\news_2021-10-01_7.jpghttps://polypore.com/news/press-releases/polypore-establishes-joint-venture-to-manufacture-and-sell-lithium-ion-dry-process-battery-separators-in-china/polypore.com
APEC 2022 Sponsors Continue Student Attendance Support ProgramThe joint sponsors of the Applied Power Electronic...9467Event NewsAPEC 2022 Sponsors Continue Student Attendance Support ProgramThe joint sponsors of the Applied Power Electronics Conference (APEC) have announced the continuation of the popular Student Attendance Support Program for APEC 2022, scheduled to take place in Houston, March 20-24. Chosen recipients of the program will receive reimbursement to cover qualified expenses for attending APEC 2022. Those eligible to apply for the program are power electronics students, undergraduate or graduate, who have been accepted to present papers at the upcoming conference in March (notification of paper acceptance is by Oct. 27, 2021.) Once accepted, student presenters must apply for the Student Attendance Support Program by November 7, 2021. In its 17th year, this popular program was initiated by the Power Sources Manufacturers Association (PSMA). It is now jointly underwritten by PSMA and the other co-sponsors of the APEC conference: the IEEE Power Electronics Society (PELS) and the IEEE Industry Applications Society (IAS). The recipients of the Student Attendance Support Program will be chosen by the APEC 2022 Student Attendance Support Committee.22.09.2021 12:00:00Sepnews_2021-10-15_7.jpg\images\news_2021-10-15_7.jpghttp://apec-conf.org/news/apec-2022-sponsors-continue-student-attendance-support-program/apec-conf.org
Funding Round to Revolutionize Magnetics with AI TechnologyThe Madrid-based company Frenetic announced its cl...9462Industry NewsFunding Round to Revolutionize Magnetics with AI TechnologyThe Madrid-based company Frenetic announced its closing of a €4.5 million funding round from Bonsai Partners (Spain) and Join Capital (Germany), which boosts existing support from 42Cap (Germany), Big Sur Ventures (Spain) and Bankinter (Spain) from 2019. Frenetic's AI technology has been trained to accurately design both magnetic and electronic components essential for the development of electric vehicles. In addition, through its unique technology and stock search, Frenetic tackles issues involving scarcity of chip supplies and magnetic components. The company plans to utilize this funding round to continue expansion in the US and Germany. Frenetic was founded with the goal of making magnetics simple and accessible. It is now revolutionizing the world of magnetics through AI, aiming to entirely replace outdated engineering models used in a wide range of cases - from electric chargers to space travel. Frenetic validated its technology through participation in the 2020 'Accelerator Pilot' – a program from the European Commission dedicated to the empowerment of European companies, and in which only 0.1% of applications receive community support. Chema Molina, Frenetic's CEO, who founded the company in 2018, says of the round: "This latest funding from Join and Bonsai will allow us to expand in the US and German markets with local subsidiaries, and ultimately be closer to customers. Likewise, we will be able to strengthen our relationships with manufacturers."22.09.2021 07:00:00Sepnews_2021-10-15_2.jpg\images\news_2021-10-15_2.jpghttps://frenetic.ai/frenetic.ai
Wide-Input DC to DC Converter LineAcopian launched their encapsulated wide input DC ...9454Product ReleaseWide-Input DC to DC Converter LineAcopian launched their encapsulated wide input DC to DC Converter line of power supplies rated up to 60W. Wide-range DC inputs are set at 9-18 VDC, with output voltages ranging from 3.3 VDC to 48 VDC and up to 8A. Threaded mounting holes permit them to be mounted to a chassis, cabinet wall or bracket, they can be DIN RAIL mounted or they may be used on a test bench or tabletop. Touch safe terminal blocks provide easy connection without the need for sockets or soldering. Input/Output isolation prevents ground loops, and permits the use of inputs of either polarity; outputs of single output models may be used in either polarity and floated up to 500 volts above the input. Standard features include OVP internal protection, Input/Output isolation, short circuit protection and ability to operate in series. Optional output indicator (DC ON LED) and voltage adjust potentiometer are also available. Thermal protection and rugged encapsulated construction assure years of reliable service. These DC to DC converters are suitable for use in a broad range of applications including automotive, ATE, OEM, military and industrial/manufacturing applications.21.09.2021 13:30:00Sepnews_2021-10-01_18.jpg\images\news_2021-10-01_18.jpghttps://www.acopian.com/dcdc-termblock-m.htmlacopian.com
Technologists Recognized with Industry Honors for Advancements in Semiconductor MaterialsDuPont Electronics & Industrial announced that thr...9468PeopleTechnologists Recognized with Industry Honors for Advancements in Semiconductor MaterialsDuPont Electronics & Industrial announced that three of its scientists in its Semiconductor Technologies business group have recently been honored with industry recognitions for their work in developing materials for advanced semiconductor fabrication. In July 2021, Emad Aqad, Ph.D., was recognized with the 2020-2021 Asian American Most Promising Engineer of the Year Award. The Asian American Engineer of the Year Award (AAEOY) program is a recognition established to honor the most distinguished US-based professionals for their leadership, technical achievements and public service. In August 2021, Alaaeddin Alsbaiee, Ph.D., was named to the 2021 Chemical & Engineering News' (C&EN) Talented 12.? The C&EN Talented 12 program recognizes early career scientists who are making their mark on industry and global challenges. Most recently, Jae Hwan Sim, Ph.D., was named an International Fellow of the Industrial & Engineering Chemistry (I&EC) Division of the American Chemical Society (ACS). The I&EC Division of ACS has a focus on helping individuals convert science into commercially relevant products. "These prestigious third-party recognitions are a true testament to the caliber of our talent globally and their wide-reaching industry impact," said Cathie Markham, vice president of R&D, DuPont Electronics & Industrial. "We are incredibly proud of the achievements of all three of these individuals, and the passionate spirit that they bring to our teams in driving the development of novel materials and continued enhancements for semiconductor fabrication."21.09.2021 13:00:00Sepnews_2021-10-15_8.png\images\news_2021-10-15_8.pnghttps://www.dupont.com/electronic-materials/news/2021/press-releases/20210921-three-dupont-technologists-recognized-with-industry-honors.htmldupont.com
Tiny Power Management IC for Wearables and HearablesThe MAX77659 single-inductor multiple output (SIMO...9451Product ReleaseTiny Power Management IC for Wearables and HearablesThe MAX77659 single-inductor multiple output (SIMO) power management IC (PMIC) with integrated switch-mode buck-boost charger from Analog Devices charges wearables, hearables and Internet of Things (IoT) devices faster and in less space than any other PMIC available today. The MAX77659 SIMO PMIC delivers over four hours of play time after a short, ten-minute charge, and uses a single inductor to power multiple rails, reducing the bill of materials (BOM) by 60 percent and shrinking total solution size by 50 percent. The MAX77659 SIMO PMIC integrates a switch-mode buck-boost charger and three independently programmable buck-boost regulators, all sharing a single inductor to minimize total solution size. The regulators extend battery life by operating at 91 percent efficiency during moderate to heavy load conditions while consuming only 5µA of quiescent current during light load conditions. The MAX77659 SIMO PMIC supports autonomous headroom control, which reduces heat dissipation by minimizing the voltage drop while providing enough headroom to regulate the charging current. "Analog Devices' SIMO product technology shrinks size and boosts performance in the smallest of hearable and wearable devices," said Roger Yeung, Executive Business Manager for the Battery Power Solutions Business Unit at Maxim Integrated, now part of Analog Devices. "The MAX77659 brings the 'on-the-go' lifestyle to the next level by minimizing plug-in time and maximizing play time. The MAX77659 PMIC frees up board real estate to pack in additional features such as expanded memory storage, location tracking and vital sensing demanded by today's portable consumer and medical devices."21.09.2021 10:30:00Sepnews_2021-10-01_15.jpg\images\news_2021-10-01_15.jpghttps://www.maximintegrated.com/en/aboutus/newsroom.html/pr_123487000maximintegrated.com
eGaN FET for Telecom, Netcom, and Computing SolutionsEfficient Power Conversion Corporation advances th...9448Product ReleaseeGaN FET for Telecom, Netcom, and Computing SolutionsEfficient Power Conversion Corporation advances the performance capability of low voltage, off-the-shelf gallium nitride transistors with the introduction of the EPC2069 (1.6 m? typical, 40 V) eGaN FET. The EPC2069 is ideal for applications with demanding requirements for high power density performance including 48 V – 54 V input servers. Lower gate charges and zero reverse recovery losses enable high frequency operation of 1 MHz, and beyond, at high efficiency in a tiny 10.6 mm2 footprint for state-of-the-art power density. The EPC2069 can support 48V – 12V DC-DC solutions ranging from 500 W to 2 kW and exceed 98% efficiency. The use of eGaN devices in both the primary side and the secondary side are required to achieve maximum power density > 4000 W/in3. According to Alex Lidow, EPC's co-founder and CEO, "The EPC2069 is perfectly designed for the secondary side of the LLC DC-DC converter from 40 V – 60 V to 12 V, which is becoming very common for the new 48 V – 54 V input servers required for high density computing applications such as artificial intelligence and gaming. This 40-volt device offers both smaller size and reduced parasitics compared with previous-generation 40 V GaN FETs and at lower cost."21.09.2021 07:30:00Sepnews_2021-10-01_12.jpg\images\news_2021-10-01_12.jpghttps://epc-co.com/epc/EventsandNews/News/ArtMID/1627/ArticleID/3001/Efficient-Power-Conversion-EPC-Expands-40-V-eGaN-FET-Product-Line-with-Device-Ideal-for-High-Power-Density-Telecom-Netcom-and-Computing-Solutions.aspxepc-co.com
GaN Technology in Server Power Supplies for Data CentersTexas Instruments announced its gallium nitride (G...9446Industry NewsGaN Technology in Server Power Supplies for Data CentersTexas Instruments announced its gallium nitride (GaN) technology and C2000 real-time microcontrollers (MCUs) are being combined with Delta Electronics' power electronics expertise in the design of an enterprise server power-supply unit (PSU) featuring an 80% improvement in power density with 1% better efficiency - up to 99.2% - for data center applications, compared to enterprise server power supplies using a traditional architecture. A 1% improvement equals 1-megawatt (or 800 households) total cost of ownership savings per data center, according to Energy Innovation. Delta Electronics chose TI due to its decade-long investment in GaN technology as well as its real-time control solution with C2000 MCUs. TI uses innovative semiconductor manufacturing processes to manufacture GaN-on-silicon technology and integrated circuits (ICs) to help companies such as Delta Electronics create differentiated applications to more efficiently power data centers around the world. "Our passion at TI is to create a better world by making electronics more affordable through semiconductors, and our GaN technology enables a whole new world of higher efficiency and smaller, more reliable solutions," said Steve Lambouses, vice president for High Voltage Power at TI. "In addition to technology investments, TI's investments in internal manufacturing will allow new technologies like GaN to scale quickly and support customers like Delta."  20.09.2021 15:00:00Sepnews_2021-10-01_10.jpg\images\news_2021-10-01_10.jpghttps://news.ti.com/ti-brings-power-gan-technology-to-delta-electronics-energy-efficient-server-power-supplies-for-data-centersti.com
Metal Enclosed AC/DC Power SuppliesThe Traco TXLN line comprises a series of metal en...9481Product ReleaseMetal Enclosed AC/DC Power SuppliesThe Traco TXLN line comprises a series of metal enclosed AC/DC power supplies ranging from 18 to 960 Watt (split into 12 different power levels) and is designed for a wide range of industrial applications. The TXLN is an active replacement of the older TXL line and is built on the same design principals to make the transition to the TXLN series as easy as possible. The model selection includes single, dual as well as triple output solutions to cover different applications requirements. With a low-profile metal case and screw terminal block connection, they are easy to install in any equipment. Up to the 200 Watt models the TXLN power supplies are completely convection cooled and from 320 Watt and above they come with an internal fan. Above 100 Watt an active PFC (>0.95) function is added to the standard feature pool. All models in the TXLN line have universal input and comply with the latest industrial standard IEC/EN/UL 62368-1, European EMC standards and the Low Voltage Directive (LVD).20.09.2021 14:30:00Sepnews_2021-10-15_22.jpg\images\news_2021-10-15_22.jpghttps://www.tracopower.com/de/txln-series-metal-enclosed-acdc-power-supplies-18-960-watttracopower.com
Silicone-Free Liquid Thermal Gap Filler for High Voltage ApplicationsHenkel announced the commercial launch of Bergquis...9479Product ReleaseSilicone-Free Liquid Thermal Gap Filler for High Voltage ApplicationsHenkel announced the commercial launch of Bergquist Gap Filler TGF 3000SF, the latest in the company's line of silicone-free thermal interface materials (TIMs). With significantly higher thermal conductivity than any previous silicone-free liquid formulation in its portfolio and delivering impressive dielectric strength, Henkel's material extends wider market opportunities and production flexibility to manufacturing operations that require avoidance of silicone outgassing. A liquid, two-part, 3.0 W/m-K silicone-free TIM, Bergquist Gap Filler TGF 3000SF offers high-reliability performance for a variety of applications where silicone sensitivity is a concern. These include industrial automation systems; power conversion technologies such as motor drives and power supplies; automotive infrastructure EV charging devices; and, computers and peripherals, to name a few. With high dielectric strength at >10 kV/mm and good volume resistivity, Bergquist Gap Filler TGF 3000SF is suitable for higher voltage applications, while also providing high-reliability thermal performance at operating temperatures ranging from -40° C to 100° C. Exhibiting extremely low assembly stress, the liquid TIM is ideal for use with sensitive components and/or printed circuit boards with intricate architectures. Productivity is also a central attribute of Bergquist Gap Filler TGF 3000SF. The silicone-free liquid TIM is conducive to mass production environments where fast dispensing is necessary to achieve high UPH objectives; it dispenses at a rate of 1.5 cc/sec. With a 1:1 mixing ratio, the material can be stored at room temperature and is easily processed.20.09.2021 12:30:00Sepnews_2021-10-15_20.png\images\news_2021-10-15_20.pnghttps://www.henkel.com/press-and-media/press-releases-and-kits/2021-09-20-henkel-develops-silicone-free-liquid-thermal-gap-filler-with-excellent-dielectric-strength-ideal-for-high-voltage-applications-1326548henkel.com
Configurable Digital Gate Driver for Silicon Carbide MOSFETsTo complement its broad portfolio of silicon carbi...9447Product ReleaseConfigurable Digital Gate Driver for Silicon Carbide MOSFETsTo complement its broad portfolio of silicon carbide MOSFET discrete and module products, Microchip Technology announced a 1200V production-ready digital gate driver, providing system developers with multiple levels of control and protection for safe, reliable operation and qualified to stringent transportation requirements. For designers of silicon carbide-based power conversion equipment, Microchip's AgileSwitch 2ASC-12A2HP 1200V dual-channel digital gate driver with its Augmented Switching  technology is production qualified and fully configurable. To ensure reliable, safe operation, the 2ASC-12A2HP gate driver provides multiple levels of control and a higher level of protection for silicon carbide MOSFET-based power systems. When compared to conventional gate drivers, key performance attributes of the AgileSwitch gate driver products include the ability to dampen drain-source voltage (Vds) overshoots by up to 80% and slash switching losses by as much as 50%. The 2ASC-12A2HP digital gate driver can source/sink up to 10A of peak current and includes an isolated DC/DC converter with low capacitance isolation barrier for pulse width modulation signals and fault feedback. Microchip's 2ASC-12A2HP gate driver is compatible with the company's latest release of the Intelligent Configuration Tool (ICT). This interface allows users to configure gate driver parameters including the gate switching profiles, system critical monitors and controller interface settings. The result is a gate driver that is tailored to their applications without having to change hardware, helping to speed development time from evaluation through production and enabling designers to change control parameters during the design process. The ICT, which is a free-of-charge download, can save designers approximately three to six months of development time on new designs.                                                     20.09.2021 06:30:00Sepnews_2021-10-01_11.jpg\images\news_2021-10-01_11.jpghttps://www.microchip.com/en-us/about/news-releases/products/reduce-switching-losses-up-to-50--while-accelerating-time-to-marmicrochip.com
MEMS Capacitive Accelerometer ChipsSilicon Designs Model 1521 Series industrial-grade...9457Product ReleaseMEMS Capacitive Accelerometer ChipsSilicon Designs Model 1521 Series industrial-grade, high-stability OEM surface mount accelerometer chips is offered in eight standard ranges from ±2 g to ±400 g. Each features a ±4V differential output and is offered with a choice of either a 20-pin LCC or J-lead surface mount package, both of which are Nitrogen gas-damped, hermetically sealed and RoHS compliant. The distinguishing feature of the Model 1521 Series is its integration of a MEMS capacitive sense element, together with both an amplifier and internal temperature sensor. The MEMS capacitive sense element of the Model 1521 Series provides long-term measurement stability (+5 VDC, 5 mA power typical), reliable operation, durability, 5,000 g shock survivability and zero signal degradation. The Series is designed for zero-to-medium frequency testing and instrumentation applications requiring extremely low noise (with 7 µg/vHz typical for 2 g full-scale versions) and long-term stability. As such, they can respond to frequencies from zero (DC) to 2000+ Hz and can reliably perform over a standard operating temperature range of -55°C to +125°C.19.09.2021 16:30:00Sepnews_2021-10-01_21.jpg\images\news_2021-10-01_21.jpghttps://www.silicodesigns.com/single-post/silicon-designs-announces-immediate-availability-of-mems-capacitive-accelerometer-chipssilicodesigns.com
PCIM Asia 2021: Successful Conclusion in ShenzhenPCIM Asia was held successfully from 9 – 11 Septem...9441Event NewsPCIM Asia 2021: Successful Conclusion in ShenzhenPCIM Asia was held successfully from 9 – 11 September at the Shenzhen World Exhibition & Convention Center, the change in venue and location marking a new chapter in the fair's history. Born from the highly successful PCIM Europe trade fair first held in 1979, over the course of 20 years the fair has grown to become the leading event for power electronics in Asia. Now in its new home in Shenzhen, the oft-dubbed 'Silicon Valley' of China, benefiting from its location in the Greater Bay Area, proximity to international markets serviced by Hong Kong and the wealth of technical expertise and talent present within the city, PCIM Asia looks well placed to drive the industry forward in the decades to come. Once again PCIM Asia featured a range of thematic zones that explored key areas of the development of power electronics, covering power semiconductor components and modules, electrical devices, passive components and thermal management to test and measurement among other areas. These zones were, namely, the E-mobility Pavilion, Energy Storage Pavilion, Poster Session Area and the University Zone.17.09.2021 10:00:00Sepnews_2021-10-01_5.jpg\images\news_2021-10-01_5.jpghttps://pcimasia-expo.cn.messefrankfurt.com/shanghai/en/press/press-releases/2021/PCIM21_FR.htmlpcimasia-expo.cn
Opening of Chip Factory for Power Electronics on 300-Millimeter Thin WafersInfineon Technologies officially opened its high-t...9437Industry NewsOpening of Chip Factory for Power Electronics on 300-Millimeter Thin WafersInfineon Technologies officially opened its high-tech chip factory for power electronics on 300-millimeter thin wafers at its Villach site in Austria under the motto "Ready for Mission Future." At 1.6 billion euros, the investment made by the semiconductor group represents one of the largest such projects in the microelectronics sector in Europe. The Villach site is one of the world's most modern fabs and was opened by Infineon CEO Reinhard Ploss, Infineon Austria CEO Sabine Herlitschka along with EU Commissioner Thierry Breton and Austrian Chancellor Sebastian Kurz. Infineon set the stage for long-term, profitable growth based on energy efficiency and CO 2 reduction at an early stage and announced the construction of the chip factory for power electronics ("energy-saving chips") in 2018. "The new fab is a milestone for Infineon, and its opening is very good news for our customers," Ploss said. "The timing to create new capacity in Europe could not be better, given the growing global demand for power semiconductors. The last few months have clearly shown how essential microelectronics are in virtually every area of life. Given the accelerated pace of digitalization and electrification, we expect demand for power semiconductors to continue to grow in the coming years. The additional capacities will help us serve our customers worldwide even better, including long term."17.09.2021 06:00:00Sepnews_2021-10-01_1.jpg\images\news_2021-10-01_1.jpghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2021/INFXX202109-098.htmlinfineon.com
High-Temperature, Automotive-Grade Polymer Chip CapacitorsAVX Corporation released the TCO Series high-tempe...9485Product ReleaseHigh-Temperature, Automotive-Grade Polymer Chip CapacitorsAVX Corporation released the TCO Series high-temperature, automotive-grade polymer chip capacitors, which are rated for operating temperatures up to 150°C at category voltage and meet AEC-Q200 Stress Test Qualification for Passive Components requirements, which ensure stable performance at 85°C, 85% relative humidity, and rated voltage for up to 1,000 hours. Based on AVX's field-proven TCQ Series automotive polymer capacitors, the new TCO Series chip capacitors are manufactured in an IATF-16949-certified facility and feature robust J-lead constructions comprised of tantalum anodes, tantalum pentoxide (Ta2O5) dielectrics, and conductive polymer electrodes that exhibit a benign failure mode under recommended use conditions. The series also exhibits low DCL (0.1CV) and basic reliability of 1% per 1,000 hours at 85°C and rated voltage with 0.1O/V series impedance and 60% confidence, and is ideally suited for use in high-temperature, low- and medium-power automotive, industrial, and telecommunications applications. TCO Series capacitors are currently available as D-case (EIA Metric 7343-31) components rated MSL 3 per J-STD-020 and for 10µF ±20% tolerance, 50VDC at 105°C, a maximum of 50µA DCL, 150mO maximum ESR at 100kHz, and operating temperatures extending from -55°C to +150°C, but several other codes are actively in development.16.09.2021 18:30:00Sepnews_2021-10-15_26.jpg\images\news_2021-10-15_26.jpghttps://www.kyocera-avx.com/news/tco-series-high-temperature-automotive-grade-polymer-chip-capacitors/kyocera-avx.com
Inductor Series for Medical Imaging and Other Magnetic-Sensitive ApplicationsGowanda Electronics announces the introduction of ...9458Product ReleaseInductor Series for Medical Imaging and Other Magnetic-Sensitive ApplicationsGowanda Electronics announces the introduction of a non-magnetic RF thru-hole (leaded) inductor series – 28MG. This series is ideal for use in medical imaging equipment and other applications where magnetic materials must be avoided. The series was designed to address the market need for non-magnetic inductors that could achieve inductance values of up to 18 µH for use in Magnetic Resonance Imaging (MRI) equipment, specific types of X-ray equipment and other applications where the presence of magnetic materials could compromise system performance. This includes applications in telecommunications, security systems, instrumentation, laboratory analysis equipment, aviation equipment, navigation equipment and electronic test equipment. The performance range provided by the 60 discrete parts within the 28MG series includes Inductance from 1.2 µH to 18 µH, DCR Ohms from 0.079 to 4.15 and Current Rating mA DC from 315 to 2400. All of Gowanda's non-magnetic surface mount and thru-hole inductors, including this new 28MG series, provide relative permeability of = 1.00003. The operating temperature range for the 28MG series is -55°C to +125°C. The 28MG inductors are epoxy encapsulated for environmental protection and superior strength to withstand all types of reflow soldering. Standard terminations are SnPb; RoHS-compliant terminations are provided when "LF" is specified.16.09.2021 17:30:00Sepnews_2021-10-01_22.jpg\images\news_2021-10-01_22.jpghttps://www.gowanda.com/news-release/gowanda-electronics-launches-new-non-magnetic-rf-inductor-series-28mg/gowanda.com
Switched Capacitor Intermediate Bus Converter for 48 V Data Center ApplicationsFlex Power Modules introduces the BMR310, a non-is...9477Product ReleaseSwitched Capacitor Intermediate Bus Converter for 48 V Data Center ApplicationsFlex Power Modules introduces the BMR310, a non-isolated switched capacitor intermediate bus converter (IBC) which provides high power density for data centers, thus improving board space utilization and freeing space for other components. Built on the proprietary Zero voltage switching Switched capacitor Converter (ZSC) technology of Infineon Technologies, the BMR310 achieves efficiency of over 98 percent at half load and can deliver power up to 875 W continuous in a compact package. It operates over an input voltage range of 40 V to 60 V, and delivers an unregulated output voltage of 10 V to 15 V. For data centers and high-performance computing (HPC) applications, there is a growing trend to move away from 12 V and adopt 48 V power distribution to reduce distribution currents and power losses. To meet this increasing demand, the Infineon ZSC delivers the highest efficiency and power density for applications using 48 V to generate an intermediate bus voltage. This is achieved through capacitive energy transfer with soft switching of the power MOSFETs, and therefore enables an easy and low-risk migration path for legacy 12 V systems to a 48 V infrastructure at significantly reduced total cost of ownership (TCO). The BMR310 is mounted horizontally with a height profile of 10.3 mm, making it suitable for systems with limited space due to large heatsinks or cold plates. It measures 58.4 mm x 25.0 mm x 10.3 mm (2.3 x 0.98 x 0.41 in). The current mounting option is base-plated but an open frame will be available with future models. To maximize operating lifespan, the BMR310 includes over-voltage, under-voltage, over-current and over-temperature protection function.16.09.2021 10:30:00Sepnews_2021-10-15_18.jpg\images\news_2021-10-15_18.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2021/INFPSS202109-097.htmlinfineon.com
ICs for Automotive Satellite Camera ModulesROHM developed SerDes ICs (BU18xMxx-C series) and ...9459Product ReleaseICs for Automotive Satellite Camera ModulesROHM developed SerDes ICs (BU18xMxx-C series) and a PMIC (BD86852MUF-C) ideal for vehicle satellite camera modules for Advanced Driver Assistance Systems (ADAS). The products not only solve issues concerning the miniaturization and low power consumption of modules, but also provide features such as low electromagnetic noise (EMI) that reduces development time. Both products utilize a spread spectrum function to reduce EMI. This also simplifies EMI countermeasures, which often require significant man-hours during the design of automotive applications. The BU18xMxx-C SerDes IC optimizes the transmission rate based on video resolution, making it possible to reduce power consumption by 27% over general products. At the same time, the built-in spread spectrum function reduces the EMI peak by 20dB, while an integrated video sticking detection function improves the reliability of the entire ADAS system by detecting frozen images. The BD86852MUF-C PMIC (Power Management IC) for cameras is designed to optimally manage the power supply systems of CMOS image sensors from all major manufacturers. This allows voltage settings and sequence control to be performed with a single IC, reducing mounting area by 41% and contributing to the miniaturization of vehicle camera modules. In addition, a camera PMIC heat concentration distribution circuit can be configured to lower power consumption by achieving a high conversion efficiency of 78.6% that suppresses heat generation.15.09.2021 18:30:00Sepnews_2021-10-01_23.jpg\images\news_2021-10-01_23.jpghttps://www.rohm.com/news-detail?news-title=serdes-ics-and-pmic-optimized-for-automotive-satellite-camera-modules&defaultGroupId=falserohm.com
Isolation Transformer Series Provides Isolation from High Voltage HazardsBourns introduced its Model PAD00x-T764 Isolation ...9456Product ReleaseIsolation Transformer Series Provides Isolation from High Voltage HazardsBourns introduced its Model PAD00x-T764 Isolation Transformer Series. These transformers feature functional isolation and a low 0.4 mm profile form factor to simplify isolated power and serial communication signal integrity in CAN, RS-485, RS-422, RS-232, SPI, I2C, and lower power LAN-based applications. The Model PAD00x-T763 Series is ideal for industrial automation, embedded solutions, AC motor drives, system integration, communication PHYs, smart metering, and many other applications requiring low DC power. Bourns Model PAD00x-T764 series was developed for ease of use in maintaining proper communication and necessary isolation between systems. The 3.1 kVAC withstanding voltage provides an isolation barrier from high voltage hazards, such as high voltage batteries. Design details include construction with a ferrite toroid core to help ensure a high coupling factor and heightened efficiency. EMI performance is enhanced in the winding of the transformer, enabling reduced emissions. The PAD00x-T764 series is compatible with Texas Instruments SN6501 and SN6506B, Maxim MAX253 and MAX845, Analog Devices ADM2485, and similar transformer drivers. The series offers 3.3 to 5 V input, industry standard 3.3 to 10 V output, and up to 250 mA output with various turns ratios. The Bourns Magnetics product line can also support most modification and customization requests for this push-pull transformer series.15.09.2021 15:30:00Sepnews_2021-10-01_20.jpg\images\news_2021-10-01_20.jpghttps://bourns.com/news/press-releases/pr/2021/09/15/bourns-expands-push-pull-transformer-line-with-new-series-that-delivers-excellent-isolated-power-performance-for-serial-communicationsbourns.com
Power Modules Replace Linear RegulatorsWürth Elektronik extends its MagI³C-FDSM-36-V fami...9455Product ReleasePower Modules Replace Linear RegulatorsWürth Elektronik extends its MagI³C-FDSM-36-V family with a 12 V output voltage version. The range of MagI³C-FDSM power modules with 36 V input voltage has been expanded to include a version with 12 V output voltage. The power module in a SIP-3 package represents a cost-effective solution to meet the requirements for the real-world voltage transients of a 24 V industrial power architecture. The module operates from 16 to 36 VIN and generates a fixed output voltage of 12 V with current up to 1 A. The FDSM series MagI³C power modules are fully integrated DC/DC voltage converters with a fixed output voltage. The modules incorporate all of the components needed, like the controller, inductor and input/output capacitors, with the added benefit of thermal overload and short circuit protection. Since there are no external components required for operation, there is essentially no circuit design needed. This reduces development costs and makes it possible to get to market quickly with new applications. This power module has around 95% efficiency while the linear regulator will have an efficiency of 50%. The standard THT housing for easy mounting is pin-compatible with L78x linear controllers. Pre-compliance testing has shown both the radiated and conducted emissions on an evaluation board are below the limits of EMC standards EN55032/CISPR32 Class B.15.09.2021 14:30:00Sepnews_2021-10-01_19.jpg\images\news_2021-10-01_19.jpghttps://www.we-online.com/web/en/wuerth_elektronik/news_weg/News_Detail_WE_Gruppe_127294.phpwe-online.com
Automotive Semiconductor Industry: The Wind of Change"The value of semiconductors, at the chip level, i...9466Industry NewsAutomotive Semiconductor Industry: The Wind of Change"The value of semiconductors, at the chip level, in cars will grow from US$34.4 billion in 2020 to US$78.5 billion in 2026, a 14.75% CAGR." asserts Eric Mounier, PhD, Director of Market Research at Yole Développement (Yole). He adds: "The largest growth will be in EVs due to the major shift to electrification." The market research and strategy consulting company investigates disruptive semiconductor technologies for the automotive sector in depth. Its aim is to point out the latest innovations and underline the business opportunities. These investigations have been developed with Yole's partner, System Plus Consulting. According to Wilfried Théron, Electronic System, Department Director & Quality Manager at System Plus Consulting: "System Plus Consulting's Teardowns uncover innovative design features and new semiconductor components to guide enterprises toward more streamlined solutions in future designs". They provide clients unmatched intelligence into 4 automotive tracks (ADAS, Electrification, Infotainment and Telematics). In addition, Yole released, the 'Automotive Semiconductor Trends 2021' report to provide an in-depth understanding of the changing automotive industry ecosystem and supply chain players. Including market trends and forecasts, take away and outlook, this study proposes key technical insights and analyses about future technology trends and challenges. 15.09.2021 11:00:00Sepnews_2021-10-15_6.jpg\images\news_2021-10-15_6.jpghttp://www.yole.fr/Automotive_Semiconductor_Trends_Automotive_Tracks_2021.aspxyole.fr
PCNS: The Next Decade on Passive Components will be about Reliability, Sustainability & MaterialsAttendees of the 3rd PCNS Passive Components Netwo...9465Event NewsPCNS: The Next Decade on Passive Components will be about Reliability, Sustainability & MaterialsAttendees of the 3rd PCNS Passive Components Networking Symposium that took place on 7-10th September 2021 in Milano, Italy discussed the latest news and trends in passive components. The main theme of the conference was RELIABILITY & SUSTAINABILITY of PASSIVE COMPONENTS that also covered MATERIALS development and PROCESSES. 3rd PCNS was attended by 50 live attendees and 25 virtual attendees from 16 countries including 12 European Countries, Israel, USA and Korea. Theme of the conference "Reliability and Sustainability of Passive Components" was elaborated in workshop on life cycle assessment and addressed by keynotes, invited papers and hot panel discussion. Twenty four full technical papers were presented during two and half PCNS event days covering wide range of passive components including capacitors, resistors, inductors, integrated passives or passive sensors.15.09.2021 10:00:00Sepnews_2021-10-15_5.jpg\images\news_2021-10-15_5.jpghttps://passive--components-eu.cdn.ampproject.org/c/s/passive-components.eu/pcns-the-next-decade-on-passive-components-will-be-about-reliability-sustainability-materials/amp/passive--components-eu
Halogen-Free Flame-Retardant PolyamideAsahi Kasei is introducing the halogen and red-pho...9482Product ReleaseHalogen-Free Flame-Retardant PolyamideAsahi Kasei is introducing the halogen and red-phos-phorous free flame retardant Polyamide 66 LEONA SN to the European market. This semi-aromatic material combines high levels of safety, surface quality and laser printability. The LEONA SN grades are certified with the V-0 flame retardancy at wall thicknesses of 0.75mm according to the UL standard, and achieve 600V, the highest value on the Comparative Tracking Index (CTI). In addition to the flame-retardant and creep-resistant properties, the material features a superior surface quality. This is achieved without additional treatment and coating and even with a glass-fiber content of up to 50%. Another characteristic of this material is its high retention rate of physical properties in a conditioned state. While comparable halogen-free PA66 materials show a significant decline in properties, LEONA SN maintains a high level of tensile strength and flexural modulus also after moisture absorption. This opens up new possibilities for applications in environments, where the use of standard FR PA66 can become an issue. Furthermore, LEONA SN provides an excellent laser printability and allows for a clearer surface marking than general materials with red phosphorus in high speed machining of 1000 mm/sec, con-tributing to an increased speed in production.14.09.2021 15:30:00Sepnews_2021-10-15_23.jpg\images\news_2021-10-15_23.jpghttps://asahikasei.group/eu/leona-sn/asahikasei.group
EMC Community Meets AgainFrom 15 – 17 March 2022, the EMC community will ha...9442Event NewsEMC Community Meets AgainFrom 15 – 17 March 2022, the EMC community will have the opportunity to experience the premiere originally planned for 2020 at the new location in Cologne. "The feedback on Mesago Messe Frankfurt's digital offerings for the EMV was very positive, nevertheless the anticipation for the next face-to-face event and the desire for chance meetings and personal exchange is immense," commented Anthula Parashoudi, Vice President, Mesago Messe Frankfurt. With still six months before the event, the EMV team at Mesago Messe Frankfurt has already been able to allocate 60 percent of the booth space. Around 50 exhibitors have already confirmed their participation in the event in Cologne, including well-known representatives of the EMC industry such as Rohde & Schwarz, Frankonia, and AR Europe. Interested representatives in the EMC industry can still register as an exhibitor at the trade fair in Cologne. More information, such as the exhibitor list and exhibitor registration, is available at e-emc.com.14.09.2021 11:00:00Sepnews_2021-10-01_6.jpg\images\news_2021-10-01_6.jpghttps://emv.mesago.com/stuttgart/en/press/press-releases/emv-press-releases/emv2022_feedback_positive.htmlemv.mesago.com
Semiconductor Capacity AgreementGaN Systems announced the signing of a comprehensi...9438Industry NewsSemiconductor Capacity AgreementGaN Systems announced the signing of a comprehensive Capacity Agreement with BMW Group for GaN Systems' high-performance, automotive-grade GaN power transistors, which increase the efficiency and power density of critical applications in electric vehicles. GaN power semiconductors are a key ingredient to achieve the small size, lightweight, and high efficiency required in the next generation of high-performance electric vehicles. Under the terms of the agreement, GaN Systems will provide capacity for multiple applications in series production. The guaranteed volumes by GaN Systems are a key building block for reliability in the supply chain for automotive players like BMW. "Electric vehicles represent the future of transportation, and we are delighted to continue to support BMW with our design and production capacity," stated Jim Witham, CEO of GaN Systems. "This multi-$100M agreement demonstrates BMW's commitment to innovation and sustainability." BMW's relationship with GaN Systems began more than four years ago when BMW's engineers found that small size, lightweight, low-cost onboard chargers, DC/DC converters, and traction inverters were enabled by GaN. This led to investment from BMW's venture capital firm, BMW I Ventures, to support and accelerate the automotive qualification of the GaN technology. "The close collaboration among GaN Systems and BMW's engineers has helped to solidify the technology for automotive series production, resulting in the most advanced GaN power transistors in the marketplace today," said Kasper Sage, managing partner BMW i Ventures. "As electric vehicles become more prominent, the demand for critical semiconductor components is only going to increase, thereby making strategic partnerships with suppliers like GaN Systems even more important." 14.09.2021 07:00:00Sepnews_2021-10-01_2.jpg\images\news_2021-10-01_2.jpghttps://gan-systems.reportablenews.com/pr/gan-systems-signs-semiconductor-capacity-agreement-with-bmwgan-systems.com
Sensing and Control Solutions Make Energy Systems SaferSensata Technologies introduces an i-BMS Battery M...9450Product ReleaseSensing and Control Solutions Make Energy Systems SaferSensata Technologies introduces an i-BMS Battery Management System for Electrified Applications up to 60V. The brain behind the battery for a diverse range of electric vehicles, the BMS is the intelligent component that monitors and manages lithium-ion battery packs. The i-BMS Battery Management System from Lithium Balance, acquired by Sensata earlier in the year, is a cell chemistry agnostic, compact, integrated BMS developed for the cost-optimized mass-production of applications up to 60V, such as 2-, and 3-wheelers, automated guided vehicles (AGVs), and robotics. The i-BMS is a long-term solution for customers who require the highest levels of safety, performance and measurement accuracy. The solution features key components that are ASIL C Safety rated and self-test capability for safety critical measurement circuits. While measuring only 65 x 200 mm, the i-BMS is equipped with everything required to manage and maintain a battery system without the need for any external components. This includes a built-in pre-charge circuit, on-board current measurement, MOSFET power switches for battery disconnect, and a DC/DC power supply. The i-BMS' software design features parallel pack and hot swap capability, while advanced SoX algorithms ensure high precision. Using the BMS Creator configuration software, the i-BMS allows the battery designer to create a unique battery by defining application-specific BMS parameters and safety strategies, optimizing battery performance and life.09.09.2021 09:30:00Sepnews_2021-10-01_14.jpg\images\news_2021-10-01_14.jpghttps://www.sensata.com/contact/newsroom/st-debut-new-battery-management-systems-battery-show-north-americasensata.com
Single Plug-and-Play Gate Drivers for "New Dual" ModulesPower Integrations announced SCALE-iFlex Single ga...9431Product ReleaseSingle Plug-and-Play Gate Drivers for "New Dual" ModulesPower Integrations announced SCALE-iFlex Single gate-drivers for the popular "New Dual" 100 mm x 140 mm IGBT modules. The compact drivers support modules up to 3.3 kV and are available now for design-in. The SCALE-iFlex Single gate-drivers are ideal for light-rail, renewable energy generation and other high-reliability applications that demand compact, rugged driver solutions. Thorsten Schmidt, product marketing manager at Power Integrations commented: "SCALE-iFlex Single gate-drivers fit the outline of the latest standard IGBT power modules including the Mitsubishi LV100/HV100, Infineon xHP2 and xHP3, ABB LinPak, Hitachi nHPD² and other similar products." SCALE-iFlex Single gate-drivers use Power Integrations' SCALE-2 ASIC technology which dramatically reduces component count compared to conventional products. The ASIC also provides Advanced Active Clamping (AAC) over-voltage protection during normal operation, a substantial improvement over simple soft shut down, which adds extra protection in case of short-circuit during turn-on. Devices are conformally coated and feature reinforced isolation. Isolated housings ensure isolation between modules when they are mounted side-by-side. Devices are pre-qualified according to railway standards IEC 61373 – Class 1B (shock & vibration) and IEC 61000-4-x (EMC tests) and IEC 60068-2-x (serial environmental tests). Burn-in is optionally available.08.09.2021 15:30:00Sepnews_2021-09-15_22.jpg\images\news_2021-09-15_22.jpghttps://investors.power.com/news/news-details/2021/Power-Integrations-Introduces-SCALE-iFlex-Single-Plug-and-Play-Gate-Drivers-for-New-Dual-Modules/default.aspxpower.com
Plug-and-Play Gate Driver Improves IGBT Module PerformancePower Integrations announced its plug-and-play SCA...9453Product ReleasePlug-and-Play Gate Driver Improves IGBT Module PerformancePower Integrations announced its plug-and-play SCALE-iFlex LT dual gate-drivers. The drivers improve the performance of multiple parallel EconoDUAL modules by 20%, allowing users to eliminate one of every six modules from power inverters and converter stacks. In addition to saving the cost of the driver and module, this reduces control complexity and costs related to modules, wiring, hardware, and heatsinking. SCALE-iFlex LT targets multiple applications in renewable energy generation and storage, and is particularly applicable to offshore wind turbines in the 3 to 5 MW range. Thorsten Schmidt, product marketing manager at Power Integrations commented: "Dynamic and static current sharing is critical for robust operation of modules arranged in parallel. For the same power output, systems using SCALE-iFlex LT require just five parallel modules whereas competitive approaches need six. This substantial saving of cost and complexity is achieved by guaranteeing less than 20 ns of variance in turn-on and turn-off commands between modules and less than 20 A of variance between modules when conducting the rated 600 A. This allows the modules to operate reliably without current derating, which is obligatory with less advanced driver solutions." Up to six EconoDUAL 3, or equivalent, power modules can be paralleled from the same Isolated Master Control (IMC) unit which has a more compact outline than conventional products. The Module Adapted Gate drivers (MAGs), which fit the footprint of the EconoDUAL module, each featuring two SCALE-2 ASICs – one per channel – to optimize symmetrical paralleling, efficiency and protection.08.09.2021 12:30:00Sepnews_2021-10-01_17.jpg\images\news_2021-10-01_17.jpghttps://investors.power.com/news/news-details/2021/Power-Integrations-New-SCALE-iFlex-LT-Plug-and-Play-Gate-Driver-Improves-EconoDUAL-IGBT-Module-Performance-by-20/default.aspxpower.com
BLDC Motor Drivers with Code-Free, Sensorless FOC and Trapezoidal ControlTexas Instruments introduced 70-W brushless DC (BL...9425Product ReleaseBLDC Motor Drivers with Code-Free, Sensorless FOC and Trapezoidal ControlTexas Instruments introduced 70-W brushless DC (BLDC) motor drivers to provide code-free, sensorless trapezoidal and field-oriented control (FOC). The devices enable engineers to spin a BLDC motor in less than 10 minutes – eliminating months of design time for engineers designing a wide variety of industrial systems such as major and small home appliances, and medical applications such as ventilators and continuous positive airway pressure (CPAP) machines. With integrated real-time control and up to 18 discrete components – including power metal-oxide semiconductor field-effect transistors (MOSFETs) – the devices also speed system response time while reducing board space by as much as 70%, all while providing best-in-class acoustic performance. The MCF8316A and MCT8316A BLDC motor drivers include a set of commutation control algorithms that eliminate the need to develop, maintain and qualify motor-control software, which eliminates months of design time. The algorithms, along with a high level of integration, enable these motor drivers to manage critical functions such as motor fault detection, while implementing protection mechanisms to increase system reliability. Because these motor drivers integrate sensorless technology to determine rotor position, they eliminate the need for external Hall sensors, which reduces system cost and increases reliability. Additionally, the MCF8316A sensorless FOC motor driver intelligently extracts motor parameters, enabling designers to quickly tune a motor while delivering consistent system performance regardless of motor manufacturing variations. The MCT8316A sensorless trapezoidal control motor driver enables designers to tune a motor using only five hardware pins, simplifying systems by eliminating the need for a microcontroller interface.08.09.2021 09:30:00Sepnews_2021-09-15_16.png\images\news_2021-09-15_16.pnghttps://news.ti.com/70-w-bldc-motor-drivers-from-texas-instruments-eliminate-months-design-time-with-code-free-sensorless-foc-and-trapezoidal-controlti.com
Awarded for Global Sustainability for Reducing Battery Use and E-WasteThe Business Intelligence Group awarded Powercast ...9421Industry NewsAwarded for Global Sustainability for Reducing Battery Use and E-WasteThe Business Intelligence Group awarded Powercast with its Sustainability Initiative of the Year in the 2021 Sustainability Awards program. These awards honor those people, teams and organizations who have made sustainability an integral part of their business practice or overall mission. Powercast aims to make one-time-use batteries obsolete by working with electronic manufacturers to recharge batteries or replace them altogether with its over-the-air RF (radio frequency) wireless power technology. Many of today's small electronic devices can be designed so they're environmentally friendly, either with rechargeable batteries that can accept an RF wireless charge, or with no batteries that can be directly powered by RF power. A Powerharvester chip is embedded in devices to receive RF energy sent over the air from either a dedicated Powercast transmitter, or from industry-standard RFID readers. The Powerharvester then converts the RF to direct current (DC) to top off the battery or power the device. Powercast's technology touches millions of users across 15+ industries, including automotive, consumer electronics, IoT, entertainment, retail, RFID, and sensors. The company's collaborative approach and expertise in all aspects of product design, from vision through prototyping and commercialization, has resulted in dozens of applications and millions of units shipped. "We're already partnering with many manufacturers to create wirelessly rechargeable devices that keep batteries out of landfills," said Charles Goetz, CEO of Powercast. "But, we strive for the day where all devices will charge in the background when consumers enter their home, office or car, where they'll never have to throw batteries away."07.09.2021 17:00:00Sepnews_2021-09-15_12.png\images\news_2021-09-15_12.pnghttps://www.powercastco.com/powercasts-rf-wireless-power-technology-awarded-for-global-sustainability-for-reducing-battery-use-and-e-waste/powercastco.com
High-Volume Micro-Transfer Printing CapabilitiesX-FAB Silicon Foundries is now able to support vol...9419Industry NewsHigh-Volume Micro-Transfer Printing CapabilitiesX-FAB Silicon Foundries is now able to support volume heterogeneous integration via Micro-Transfer Printing (MTP), thanks to a licensing agreement that has just been secured with X-Celeprint. This will mean that a diverse range of semiconductor technologies may be combined together, each being optimized for particular functional requirements. These will include SOI, GaN, GaAs and InP, as well as MEMS. In order to become the first foundry to provide customers with MTP-based heterogeneous integration, X-FAB has made substantial investments over the last two years. It has also established new optimized workflows and cleanroom protocols. This will allow customers to work with the foundry on heterogeneous design projects - benefitting from a low-risk and fully scalable business model that offers a clear migration to volume production. X-Celeprint's proprietary massively-parallel pick-and-place MTP technology stacks and fans-out ultra-thin dies based on different process nodes, technologies, and wafer sizes. It results in the formation of virtually monolithic 3D stacked ICs, which have enhanced performance, greater power efficiency, and take up less space. Furthermore, all this can be achieved at an accelerated rate, thereby significantly shortening time-to-market. "By licensing X-Celeprint's disruptive MTP technology, we are uniquely positioned in our ability to facilitate the incorporation of numerous different semiconductor technologies. X-FAB customers will be able to utilize a technology that no other foundry is offering, and existing X-Celeprint customers may now tap into capacity levels that will easily meet their future demands," Volker Herbig, VP of X-FAB's MEMS business unit, explains.07.09.2021 15:00:00Sepnews_2021-09-15_10.jpg\images\news_2021-09-15_10.jpghttps://www.xfab.com/news/details/article/x-fab-becomes-first-foundry-to-offer-high-volume-micro-transfer-printing-capabilities-following-licensing-agreement-with-x-celeprintxfab.com
Strategic Partnership Focused on SiC Power DevicesThe global semiconductor manufacturer ROHM, togeth...9418Industry NewsStrategic Partnership Focused on SiC Power DevicesThe global semiconductor manufacturer ROHM, together with Geely Automobile Group have entered into a strategic partnership to develop advanced technologies in the automotive field. Both companies have been collaborating on a variety of automotive applications since 2018, when they first agreed to carry out technical exchange. This partnership is expected to further promote cooperation and accelerate innovation for automotive applications. Geely is working to extend the cruising range of electric vehicles while reducing battery costs and shortening charge times by developing high efficiency traction inverters and onboard charging systems that adopt ROHM's advanced power solutions centered on SiC power devices. At the same time, Geely is committed to improving user experience through the development of high performance ADAS and intelligent cockpit systems using a wide range of products and solutions, including communication ICs and discrete devices. As a first step, traction inverters equipped with ROHM's SiC power devices are being integrated in electric vehicle platforms currently being developed by Geely. Through this partnership, ROHM and Geely will contribute to sustainability by promoting the development of low carbon technologies in the automotive industry and offering solutions for achieving greater safety and security in our increasingly mobility society.07.09.2021 14:00:00Sepnews_2021-09-15_9.jpg\images\news_2021-09-15_9.jpghttps://www.rohm.com/news-detail?news-title=rohm-and-geely-form-a-strategic-partnership&defaultGroupId=falserohm.com
Optically Isolated Load-Biased Gate DriverLittelfuse announced an optically-isolated MOSFET ...9424Product ReleaseOptically Isolated Load-Biased Gate DriverLittelfuse announced an optically-isolated MOSFET gate driver that requires no external power supply, yet can provide fast load turn-on speeds in the order of tens of microseconds. "The CPC1596 570V Load-Biased Opto-Gate Driver addresses a critical market need," said Steve Andrezyk, Senior Product Marketing Manager at Littelfuse. "Universal AC power line applications now have a custom, higher power optically isolated solid-state relay (SSR) solution without the cost of an auxiliary power supply or additional discrete devices to meet fast start-up speed requirements."<br>The problem: Standard Photovoltaic (PV) Gate Drivers simplify SSR-design by eliminating the need for auxiliary power supplies. Due to output currents in the µA-range, they get slower with larger gate charges of external MOSFETs, making it difficult to fulfill demanding fast turn-on application requirements.<br>The solution: The CPC1596 provides fast turn-on switch speed (typically 40µs) enabling designers to create a custom, higher power, optically isolated, DC-only or AC/DC solid-state relay (SSR) with external MOSFET(s). To increase the switching speed, simply utilize the product's unique load-biasing, on-board circuit. The use of load-biasing eliminates the need for an opto-gate driver auxiliary power supply. An internal regulator circuit regulates the voltage drawn from the load supply (up to 570V) down to 12.2V for internal use. An external storage capacitor is added to enable constant voltage control for properly driving the MOSFET.07.09.2021 08:30:00Sepnews_2021-09-15_15.jpg\images\news_2021-09-15_15.jpglittelfuse.com 
Development of an Image Diagnosis Technology Utilizing a High-Sensitivity Magnetic SensorYokohama National University and TDK Corporation h...9420Industry NewsDevelopment of an Image Diagnosis Technology Utilizing a High-Sensitivity Magnetic SensorYokohama National University and TDK Corporation have developed a prototype image diagnosis technology utilizing a high-sensitivity magnetic sensor. The developed prototype technology is related to the magnetic particle imaging method which is intended to detect and create images of magnetic particles accumulated in a tumor or blood vessel. The principle of the magnetic particle imaging is to detect the magnetic signals generated by magnetic particles accumulated in a tumor or blood vessel from outside of the body. When intended for use in medical imaging, it is important for devices to be highly sensitive to enable the detection of small amounts of magnetic particles. Though magnetic particle imaging technologies primarily use a method that measures electromotive force electromagnetically induced through detection coils, the new technology developed by YNU utilizes a prototype high-sensitivity magnetic sensor to achieve this. The prototype high-sensitivity magnetic sensor was developed by TDK for use in the detection weak magnetic fields at room temperature. Although still under development, the prototype sensor has been shown in a prior feasibility study to measure magnetic field distribution in a heart. Through this development, the sensor has successfully reduced the strength of the alternate current magnetic fields applied from outside of the body to one tenth lower than conventional levels. This reduced strength of the applied field is achieved by the non-linear response characteristics of the sensor to the measured magnetic field strength.06.09.2021 16:00:00Sepnews_2021-09-15_11.png\images\news_2021-09-15_11.pnghttps://www.tdk.com/en/news_center/press/20210906_01.htmltdk.com
Foundation of an International Sales CompanyThe establishment of "Würth Elektronik CBT Interna...9439Industry NewsFoundation of an International Sales CompanyThe establishment of "Würth Elektronik CBT International GmbH" marks another milestone in the internationalisation of the Circuit Board Technology division of Würth Elektronik. The European sales teams will be consolidated and expanded under the umbrella of this limited liability company. The international customers are thus moving even more into focus. In 2021, the Würth Elektronik Group celebrates its 50th anniversary. Since its beginnings, internationalisation has been an important strategic aspect for the Printed Circuit Board division. Over the past five decades, Würth Elektronik has built up three PCB plants in Germany as well as various cooperations with qualified partners in Asia. As Europe's leading PCB manufacturer, Würth Elektronik continuously develops and optimises production processes and is also heavily involved in the research and development of pioneering technologies, manufacturing processes and materials. Today, the company serves more than 4,000 customers from 50 countries in all areas of the electronics industry. In order to always be close to the customers, the sales teams in Europe are continuously being expanded and successively integrated into Würth Elektronik CBT International GmbH. "Our goal is to further expand our strong position in Europe and become the largest supplier of printed circuit boards in Europe," says Thomas Beck, Managing Director of Würth Elektronik CBT International GmbH. This process is being started with Poland. Since the beginning of the year, a local PCB specialist has been on hand to provide customers with personal advice on site. "We are looking forward to further expanding and improving the relationships with our Polish customers through our new Area Sales Manager Tomasz Renkiel," Beck continues.03.09.2021 08:00:00Sepnews_2021-10-01_3.jpg\images\news_2021-10-01_3.jpghttps://www.we-online.com/web/en/leiterplatten/news_leiterplatte/News_Detail_Leiterplatte_126782.phpwe-online.com
Accelerating GaN technology Development for 650 V GaN Power DevicesInfineon Technologies and Panasonic Corporation ha...9423Product ReleaseAccelerating GaN technology Development for 650 V GaN Power DevicesInfineon Technologies and Panasonic Corporation have signed an agreement for the joint development and production of the second generation (Gen2) of their proven gallium nitride (GaN) technology. The performance and reliability combined with the capability of 8-inch GaN-on-Si wafer production mark Infineon's strategic outreach to the growing demand for GaN power semiconductors. In accordance with market requirements, Gen2 will be developed as 650 V GaN HEMT. The devices will allow for ease of use and provide an improved price-performance ratio, targeting, amongst others, high- and low-power SMPS applications, renewables, motor drive applications. For many designs, gallium nitride (GaN) offers fundamental advantages over silicon. "In addition to the same high reliability standards as for Gen 1, with the next generation customers will benefit from even easier control of the transistor as well as a significantly improved cost position, thanks to moving to an 8-inch wafer manufacturing," says Andreas Urschitz, President of Infineon's Power and Sensor Systems Division. Like the jointly developed Gen 1 devices, known as Infineon's CoolGaN and Panasonic's X-GaN, the second generation will be based on the normally-off GaN-on-silicon transistor structure. This, in combination with the unmatched robustness of the hybrid-drain-embedded gate injection transistor (HD-GIT) structure, makes these components the product of choice and one of the most long-term reliable solutions in the market.02.09.2021 07:30:00Sepnews_2021-09-15_14.jpg\images\news_2021-09-15_14.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2021/INFPSS202109-094.htmlinfineon.com
40A Printed HE-R Relay for 3 Phase SystemsPanasonic Industry's HE-R relay is a PCB based rel...9432Product Release40A Printed HE-R Relay for 3 Phase SystemsPanasonic Industry's HE-R relay is a PCB based relay that can be used as the main switching element in 3 phase systems. Being remarkably compact, it contributes to considerable space and cost savings. Each of the 4 NO contacts is able to switch 40A up to an ambient temperature of +85°C - also a result of the sophisticated thermal design and an unique low coil holding power. An optional NC contact as feedback contact can handle low level loads down to 10mA / 5VDC. "Because of its outstanding ratio of size, power and robustness, the IEC62955 compliant HE-R re-lay is the perfect choice for contemporary and demanding AC/DC wall box designs", claims Panagiotis Venardos from Panasonic Industry Europe. "The advanced technology inside the HE-R ena-bles our customers now to control 3 phase systems directly on the PCB – that might not only be highly interesting for domestic wall boxes, but also for AC or DC charging stations and other fields of application, such as industrial automation or energy harvesting."01.09.2021 16:30:00Sepnews_2021-09-15_23.jpg\images\news_2021-09-15_23.jpghttps://industry.panasonic.eu/panasonic-industry-news/small-box-wall-boxindustry.panasonic.eu
DC/DC Converters with 3000 VAC Isolation VoltageTRACO's THR line comprises four series of DC/DC co...9430Product ReleaseDC/DC Converters with 3000 VAC Isolation VoltageTRACO's THR line comprises four series of DC/DC converters between 3 and 40 Watt with reinforced isolation (3000 VAC). These regulated DC/DC converters come in either a DIP-24 or 2"x1" package and also feature increased resistance against shock and vibration according to EN 61373. The THR 3WI, THR 10WI and THR 20WI also have an internal input filter to comply with EN 55032 class A. High efficiencies up to 90% allow safe operation from –40°C to +80°C (with derating). All models have a wide 4:1 input voltage range and precisely regulated, isolated output voltages. With the latest IT safety certifications (IEC/EN/UL 62368-1) the THR line is the perfect choice for many demanding applications in the industrial, transportation and instrumentation sectors.01.09.2021 14:30:00Sepnews_2021-09-15_21.jpg\images\news_2021-09-15_21.jpghttps://www.tracopower.com/de/thr-series-reinforced-isolated-3-40-watt-dcdc-convertertracopower.com
Single-chip GaN Gate Driver for Industrial and Home AutomationSTMicroelectronics' STDRIVEG600 half-bridge gate d...9434Product ReleaseSingle-chip GaN Gate Driver for Industrial and Home AutomationSTMicroelectronics' STDRIVEG600 half-bridge gate driver has high current output and 45ns propagation delay, closely matched between high-side and low-side outputs, to handle high-frequency switching of GaN enhancement-mode FETs. Also suitable for driving N-channel silicon MOSFETs at up to 20V, the STDRIVEG600 allows the flexibility to apply up to 6V gate-source voltage (VGS) on GaN devices to ensure low Rds(on). In addition, there is an integrated bootstrap circuit that helps minimize the bill of materials and simplify board layout. This circuit uses a synchronous MOSFET that lets the bootstrap voltage reach the logic supply voltage, VCC, allowing the driver to operate from a single supply without a low-dropout regulator (LDO). With dV/dt immunity of ±200V/ns, the STDRIVEG600 ensures dependable gate control in challenging electrical environments. The logic inputs are CMOS/TTL compatible down to 3.3V for easy interfacing with a host microcontroller or DSP. The high-side section withstands up to 600V, allowing use in applications with a high-voltage bus up to 500V. The outputs have 5.5A/6A sink/source capability and provide separated turn-on and turn-off pins that let designers choose the optimum way to control the gate. In addition, both the high-side and low-side circuits support Kelvin connection to the power-switch source for enhanced control. Dedicated ground and supply-voltage connections for the low-side driver ensure stable switching with the Kelvin connection and allow a shunt resistor to be used for current sensing without additional isolation or input filtering.31.08.2021 18:30:00Augnews_2021-09-15_25.jpg\images\news_2021-09-15_25.jpghttps://newsroom.st.com/media-center/press-item.html/n4385.htmlst.com
High-Frequency Wirewound Chip InductorThe Coilcraft 016008C Series is a high-frequency-w...9429Product ReleaseHigh-Frequency Wirewound Chip InductorThe Coilcraft 016008C Series is a high-frequency-wirewound chip inductor that features a high Q factor, up to 40% higher than the best thin-film counterparts. High Q is required to minimize the insertion loss in RF antenna impedance matching circuits, which makes the 016008C ideal for high-frequency applications such as cell phones, wearable devices, and LTE or 5G IoT networks.31.08.2021 13:30:00Augnews_2021-09-15_20.jpg\images\news_2021-09-15_20.jpghttps://www.coilcraft.com/en-us/products/rf/ceramic-core-chip-inductors/01005-(0402)/016008c/coilcraft.com
Promoting Female EngineersThe SEMIKRON Bachelor Women Award was presented fo...9416Industry NewsPromoting Female EngineersThe SEMIKRON Bachelor Women Award was presented for the first time at this year's Day of Electrical Engineering, Electronics and Information Technology ("EEI Day") at the Friedrich-Alexander University Erlangen-Nürnberg (FAU). The lucky award winner, student Katharina Stich, received the prize in recognition of the excellent mark awarded for her BA dissertation. Professor Uwe Scheuermann, Simulation & Analysis Director at SEMIKRON, and Anja Oberndörfer, Head of Training at SEMIKRON, handed over the award during a virtual ceremony held on 16 July 2021. At a later meeting in person at SEMIKRON's head office in Nuremberg, the award winner was presented with the award certificate and a cheque for 750 euros. Bernd Enser, Chief Operating Officer (COO) at SEMIKRON, congratulated Ms. Stich on the award while Ms. Oberndörfer spoke of the importance of promoting young women who are on MINT study programmes. SEMIKRON will continue to support Ms. Stich as part of a mentoring programme where, among other things, she will have the opportunity to experience first-hand what a day in the life of a female engineer is like. Another highlight on the EEI Day was the presentation of the SEMIKRON Student Award, which went to eleven students in recognition of their outstanding results. This year's awards went to students of the FAU's Department of Electrical Engineering, Electronics and Information Technology (EEI) for the 13th time and students of the Department of Materials Science for the 11th time.31.08.2021 12:00:00Augnews_2021-09-15_7.jpg\images\news_2021-09-15_7.jpghttps://www.semikron.com/about-semikron/news-press/detail/engineering-student-at-the-university-of-erlangen-nuremberg-receives-semikron-award-for-the-promotion-of-women.htmlsemikron.com
Analyzer for Optical Communication ComponentsThe Yokogawa AQ6380 has excellent optical waveleng...9452Product ReleaseAnalyzer for Optical Communication ComponentsThe Yokogawa AQ6380 has excellent optical wavelength resolution down to 5 picometers (pm), allowing optical signals in close proximity to be clearly separated and accurately measured. With the AQ6380, waveforms that were previously not even visible in a typical OSA, such as modulation side peaks in the laser spectrum, can now be accurately visualized. It also offers a wavelength range of 1200 to 1650 nm, allowing one unit to meet diverse wavelength measurement needs. With the ability to alter the wavelength resolution from 5 pm to 2 nm, a wide range of applications can be supported, from narrowband peak/notch measurements to wideband spectral measurements. A major challenge for optical researchers has been maintaining the accuracy of their instruments, with ambient temperature change, vibrations, and shock all potentially affecting the measurement accuracy of optical spectrum analyzers. To maintain consistently high accuracy, the AQ6380 features on board calibration based on a built-in light source. Wavelength calibration is automatically performed at set intervals by switching the optical path with an internal optical switch.31.08.2021 11:30:00Augnews_2021-10-01_16.jpg\images\news_2021-10-01_16.jpghttps://tmi.yokogawa.com/eu/news/press-releases/2021/yokogawa-test-measurement-releases-aq6380-optical-spectrum-analyzer/tmi.yokogawa.com
Reiko Winkler is Appointed General ManagerEffective from 2021/08/01, Reiko Winkler will be G...9413PeopleReiko Winkler is Appointed General ManagerEffective from 2021/08/01, Reiko Winkler will be General Manager of Finepower GmbH. As member of the management board, he will be responsible for the strategic alignment and the implementation for a sustainable growth strategy. Since its foundation in 2001, Finepower has established itself very successfully in the market of power electronics and has grown from a small team of four founding members to an internationally active distributor and engineering service provider. In addition to the high number of industrial companies, Finepower's customers also include leading Tier 1s and OEMs from the automotive industry, who value the expertise of the power electronics specialists. Reiko Winkler joined Finepower in 2011 as Key Account Manager and, since 2018 as Head of Sales he has contributed significantly to the growth of the distribution business, which today represents the largest share of Finepower's revenue. As an electrical engineering graduate with an MBA and about 20 years of experience in technical sales of electronic components, he is well prepared for this new and challenging position. The new management team will be formed with two other colleagues who have received power of attorney in this context. Please welcome also Stephanie Mahrenholz (Head of Operations and Finance) and Reiner Nowitzki (Head of Engineering) in their new roles.27.08.2021 09:00:00Augnews_2021-09-15_4.jpg\images\news_2021-09-15_4.jpghttps://www.finepower.com/en/finepower.com
Fully Virtual IEEE ECCE 2021The safety and well-being of our participants is o...9412Event NewsFully Virtual IEEE ECCE 2021The safety and well-being of our participants is our priority. Due to the resurgence of COVID-19, along with complex international travel requirements, the organizing committee has pivoted ECCE 2021 to fully virtual. The conference will be live on October 10-14, 2021, offering many live events such as the plenary session, interactive sessions with the tutorial instructors, industry-oriented special sessions, expo-dedicated live hours and a new technical program format.  Additionally, the conference on-demand content and exhibit will be available for a total of 30 days. The virtual format allows us to come together to learn, idea-share and gain insight into the latest innovations within the energy conversion field, and ensures that the current landscape does not hinder anyone's ability to participate.27.08.2021 07:00:00Augnews_2021-09-15_2.jpg\images\news_2021-09-15_2.jpghttps://www.ieee-ecce.org/2021/ieee-ecce.org
Teaming Up to Accelerate Electronics DesignSnapEDA and Panasonic have collaborated to release...9399Industry NewsTeaming Up to Accelerate Electronics DesignSnapEDA and Panasonic have collaborated to release a free collection of helpful resources for electronics designers. These resources include computer-aided design (CAD) models for over 75,000 of Panasonic's components. These CAD models allow engineers to make custom products with Panasonic's electronics components quickly and reliably. "Panasonic strives to provide the highest quality products to their customers and these new CAD models are no exception. Our collaboration brings thousands of high quality CAD models to engineers, streamlining their design process and enabling them to move to scale faster and more reliably with Panasonic components" said Natasha Baker, Founder & CEO of SnapEDA. The new models include schematic symbols and PCB footprints for electronics design, as well as 3D mechanical models to ensure proper mechanical clearances and design visualization. In addition to the CAD models themselves, engineers can also see a real-time report generated by SnapEDA's patented verification technology, to gain instant transparency into manufacturability. The models cover Panasonic's radial and surface mount resistors, capacitors and inductors. They are compatible with all major electronics and mechanical design tools.26.08.2021 15:00:00Augnews_2021-09-01_10.png\images\news_2021-09-01_10.pnghttps://www.snapeda.com/snapeda.com
Acquisition CompletedAnalog Devices announced the completion of its pre...9417Industry NewsAcquisition CompletedAnalog Devices announced the completion of its previously announced acquisition of Maxim Integrated Products. The combination further strengthens ADI's position as a high-performance analog semiconductor company with trailing twelve-month revenue of over $9 billion and free cash flow of over $3 billion1 on a pro forma basis. "Today is a tremendous milestone for ADI and I'm delighted to welcome the Maxim team, who share our passion for solving our customers' most complex technology problems," said Vincent Roche, President and CEO. "With more than 10,000 engineers and the increased breadth and depth of our best-in-class technologies, we are well-positioned to develop even more complete, cutting-edge solutions for our customers. Together, we will drive the next waves of analog semiconductor innovation, while engineering a healthier, safer and more sustainable future for all." Under the terms of the definitive agreement, Maxim stockholders received 0.63 of a share of ADI common stock for each share of Maxim common stock. Maxim common stock will no longer be listed for trading on the NASDAQ stock market. In connection with the closing of the transaction, Tunç Doluca, former President and Chief Executive Officer of Maxim, and Mercedes Johnson, former Founding Executive of Avago Technologies, will join the ADI Board of Directors. Mr. Doluca and Ms. Johnson served on Maxim's Board of Directors until the closing of the transaction.26.08.2021 13:00:00Augnews_2021-09-15_8.jpg\images\news_2021-09-15_8.jpghttps://www.analog.com/en/about-adi/news-room/press-releases/2021/8-26-21-adi-completes-acquisition-of-maxim-integrated.htmlanalog.com
Current Probe Kit Facilitates Safe 480V Panel Connected Load StudiesPOWERetc Corporation announces the availability of...9428Product ReleaseCurrent Probe Kit Facilitates Safe 480V Panel Connected Load StudiesPOWERetc Corporation announces the availability of the CCPK-6 Cabinet Current Probe Kit that enables routine panel capacity studies to be performed in 480V panels – without the need to open or power down the panel. The kit includes a 4-phase, 6"-diameter MicroFlex current probe assembly rated at 4000A, a thru-panel cabinet adapter/connector, and an exterior jumper cable to connect the METSyS logger to the cabinet connector plug. By facilitating the setup of the METSyS logger and POWERetc's custom report generator package, the kit makes it easier to conduct Cal OSHPD (PIN 38 for medical facilities) and NEC 220.87 (Exception Method) connected load studies. "Panel-capacity connected load studies that comply with NEC 220.87 or OSHPD studies in California medical facilities are very common – and challenging," said Bruce Lonie, President of POWERetc. "Live panel setup of these tests requires use of PPE and, in many cases, powered-down setup isn't even possible, particularly in hospital environments where critical loads are affected. Our new permanently-installed METSyS adapter kit allows facility personnel to safely and quickly conduct these studies without interrupting power." A single complete portable system along with multiple permanently-installed Current Probe Kits – one for each 480V cabinet – will quickly pay for themselves in reduced service costs and power interruptions.26.08.2021 12:30:00Augnews_2021-09-15_19.jpg\images\news_2021-09-15_19.jpghttps://poweretc.com/products-2/prosys/metsys-energy-monitorpoweretc.com
Diode Protection Switch Suitable for Type-C Power DeliveryAlpha and Omega Semiconductor announced a Type-C P...9426Product ReleaseDiode Protection Switch Suitable for Type-C Power DeliveryAlpha and Omega Semiconductor announced a Type-C Power Delivery high voltage sink protection switch using ideal diode methodology for reverse current protection. The AOZ13984DI-02 and AOZ13987DI-02 are smart protection switches in a single small thermally enhanced 3mm x 3mm DFN package. The products use AOS's advanced co-packaging technology, combining a high-performance IC with protection features and our latest high SOA Trench MOSFET. They offer low RDS(ON) (20mohm) back-to-back MOSFETs to block any reverse current under fault conditions and are capable of up to 28V absolute maximum voltage. Typically, a USB Type-C port adaptor supplies 5V at plug-in. Once plugged in, the client device negotiates a higher voltage for fast charging. The rise time for VBUS voltage from 5V to the final target value is very slow per the USB standard. Typical Type C protection switch designs that rely on a comparator to detect a voltage drop across the back-to-back power switches do not work with slow rising VBUS voltages and are susceptible to system-level faults. It's for this reason, robust system designs implement an ideal diode approach. Typically, such solutions were implemented discretely and require many external components and lack protection features that are possible with an integrated circuit-based approach.26.08.2021 10:30:00Augnews_2021-09-15_17.jpg\images\news_2021-09-15_17.jpghttp://www.aosmd.com/res/news/news-article-1629990976067/AOZ13984DI_87DI_PR.pdfaosmd.com
Celebrating its 50th Anniversary in EuropeSince 1971, ROHM Semiconductor GmbH has establishe...9414Industry NewsCelebrating its 50th Anniversary in EuropeSince 1971, ROHM Semiconductor GmbH has established eight locations throughout Europe to support its customers with tailored semiconductor solutions – locally. The company highlights the milestones of its European activities with a special "50th Anniversary" website. Founded in 1958 in Kyoto, Japan, the ROHM group today has become a global player and supplier in the electronics industry. The company produces a wide range of solutions including integrated circuits for power management, SiC MOSFETs, diodes and modules, silicon power transistors and diodes, but also LEDs, resistors and many more electronic components. Being a vertically integrated semiconductor manufacturer, ROHM is largely independent of suppliers and can respond more flexibly to market changes. ROHM Semiconductor Europe, founded in 1971, with Headquarters in Willich near Düsseldorf, Germany, is represented by eight offices in six countries today: Germany, France, UK, Spain, Finland and Italy. Additionally, ROHM's production facility SiCrystal, located in Nuremberg, Germany, supplies the global markets with silicon carbide wafers. The company's European business activities – in line with the ROHM group's Medium-Term Management Plan 'MOVING FORWARD to 2025' ¬– aim to accelerate social contribution. "We focus on power and analog solutions and contribute to our customers' needs for energy saving and downsizing of their products," states Wolfram Harnack, President at ROHM Semiconductor Europe. ROHM's European business both serves the needs of automotive and industrial application areas. "For example, car manufacturers strongly demand our silicon carbide devices for their production of electric cars. In addition, we also see exciting projects in the industrial field and expect a major growth in Europe – particularly in the area of infrastructure for e-mobility and alternative energies," Harnack continues.26.08.2021 10:00:00Augnews_2021-09-15_5.jpg\images\news_2021-09-15_5.jpghttps://www.rohm.com/news-detail?news-title=rohm-celebrates-its-50th-anniversary-in-europe-focus-on-power-and-analog-solutions&defaultGroupId=falserohm.com
Rad Hard Gallium Nitride (GaN) Power DevicesEPC Space technology produces devices that are sma...9435Product ReleaseRad Hard Gallium Nitride (GaN) Power DevicesEPC Space technology produces devices that are smaller, have lower resistance, and have many times superior switching performance compared to silicon solutions.  Spanning a range of 40 Volts to 300 Volts, and 4 Amperes to 30 Amperes, the discrete power transistor family demonstrates significant performance advantages over competitive silicon-based Rad Hard power MOSFETs. The Drivers and Power Stages product line includes ultra-fast low-side eGaN drivers, ultra-fast dual low-side eGaN drivers, and half bridge drivers with integrated eGaN power switches. Beyond the overall higher performance, these devices offer superior radiation hardness under heavy ions (SEE), gamma radiation (TID), and Neutron Displacement Damage (DD) as compared to Si solution; moreover, SEE immunity is guaranteed by wafer. EPC Space devices are manufactured in the US at an AS9100D certified facility located in the greater Boston area. It is worth noting, that tens of thousands of these devices are already on board of satellites flying in LEO and GEO orbits with mission lives of more than ten years. "With the performance, reliability, and price advantage clearly on the side of EPC Space GaN devices, it is hard to justify continuing to pay two times the price for lower performing, heavier, larger silicon-based power solutions" commented Bel Lazar, CEO.25.08.2021 19:30:00Augnews_2021-09-15_26.jpg\images\news_2021-09-15_26.jpghttps://epc.space/2021/08/rad-hard-gallium-nitride-gan-power-devices-from-epc-space-offer-improved-performance-shorter-lead-times-and-lower-prices-vs-silicon-rad-hard-mosfets/epc.space
Acquisition of GT Advanced Technologiesonsemi and GT Advanced Technologies announced that...9415Industry NewsAcquisition of GT Advanced Technologiesonsemi and GT Advanced Technologies announced that they have entered into a definitive agreement under which onsemi will acquire GTAT for $415 million in cash. Founded in 1994, GTAT has significant experience in crystalline growth, including SiC. SiC is a key material for next-generation semiconductors that provide technical benefits in SiC power switching devices, significantly improving system efficiency in electric vehicles (EVs), EV charging and energy infrastructure. The transaction is expected to better position onsemi to secure and grow supply of SiC and meet rapidly growing customer demand for SiC-based solutions in the sustainable ecosystem, including EVs, EV charging and energy infrastructure. Combining onsemi's manufacturing capabilities with GTAT's technical expertise will accelerate SiC development and position onsemi to better serve customers as the sustainable ecosystem rapidly ramps up over the next decade. This enhanced SiC capability will allow onsemi to assure customers of supply of critical components and to further commercialize intelligent power technologies. "This transaction reflects our confidence and stated commitment to meaningfully invest in silicon carbide solutions to support the creation of intelligent power and sensing technologies to help build a sustainable future," said Hassane El-Khoury, president and chief executive officer of onsemi. "We are focused on deepening our leadership and innovation in game-changing technologies that support the automotive and industrial sectors, and GTAT brings outstanding technical capabilities and expertise in developing wafering-ready silicon carbide, which we intend to accelerate and expand to better empower customers in our high-growth end markets. We look forward to welcoming GTAT's talented employees to the onsemi team and driving innovation together."25.08.2021 11:00:00Augnews_2021-09-15_6.png\images\news_2021-09-15_6.pnghttps://gtat.com/press-releases/onsemi-to-acquire-gtat/gtat.com
45W and 150W GaN Devices for High-Efficiency Power ConversionEasing the transition to high-efficiency wide-band...9407Product Release45W and 150W GaN Devices for High-Efficiency Power ConversionEasing the transition to high-efficiency wide-bandgap technology, STMicroelectronics has released the MasterGaN3 and MasterGaN5 integrated power packages for applications up to 45W and 150W, respectively. Joining the MasterGaN1, MasterGaN2, and MasterGaN4, which target applications from 65W to 400W, the additions give extra flexibility to choose the optimum Gallium Nitride (GaN) device and driver solution when designing switched-mode power supplies, chargers, adapters, high-voltage Power-Factor Correction (PFC), and DC/DC converters. ST's MasterGaN concept simplifies migrating from ordinary silicon MOSFETs to GaN wide-bandgap power technology. The devices integrate two 650V power transistors with optimized high-voltage gate drivers and associated safety and protection circuitry, eliminating gate-driver and circuit-layout design challenges. Combined with the higher switching frequencies possible with GaN transistors, these integrated devices enable power supplies that are up to 80% smaller than silicon-based designs as well as extremely robust and reliable. The GaN power transistors of MasterGaN3 devices have asymmetrical on-resistance (Rds(on)) of 225m? and 450m?, making these devices suited to soft-switching and active-rectification converters. In MasterGaN5 both transistors have 450m? Rds(on) for use in topologies such as LLC-resonant and Active Clamp Flyback. In common with other MasterGaN family members, both devices have inputs compatible with logic signals from 3.3V to 15V, which simplifies connection of a host DSP, FPGA, or microcontroller, and external devices such as Hall sensors. They also integrate protection including low-side and high-side undervoltage lockout (UVLO), gate-driver interlocks, over-temperature protection, and a shutdown pin.24.08.2021 13:30:00Augnews_2021-09-01_18.jpg\images\news_2021-09-01_18.jpghttps://newsroom.st.com/media-center/press-item.html/n4386.htmlst.com
200% Peak Power AC-DC LHP SeriesCOSEL announced the addition of 150W and 300W free...9401Product Release200% Peak Power AC-DC LHP SeriesCOSEL announced the addition of 150W and 300W free air convection cooled power supplies, the LHP150F and the LHP300F. Designed for industrial applications requiring high levels of safety, they are certified according to EN62477-1 (OVC III). The products work over a wide universal input voltage range of 85 to264VAC and have a high typical efficiency rating of 93%. The LHP150F and LHP300F are available in five different output voltages commonly used in industrial automation and processes, with 200% peak power capability for up to 10 seconds for dynamic loads. The standard product is an open frame PCB type, with a chassis and cover available as an option. Industrial applications require efficient power supplies able to work in various environments with a high level of safety. The LHP150F and LHP300F are certified to the EN62477-1 Over Voltage Category Three (OVC III), meaning that a final equipment powered by the products can be connected directly to the main distribution panel without adding an extra level of isolation. This simplifies the system designer's task, reducing cost and guaranteeing the highest level of efficiency. Designed for world-wide applications, the LHP150F and LHP300F have an input voltage of 85 to 264VAC. Five output voltages are available: 24V, 30V, 36V, 42V and 48V with respective output current of 6.3A, 5.0A, 4.2A, 3.6A and 3.2A for the LHP150F and 12.5A, 10.0A, 8.4A, 7.2A and 6.3A for the LHP300F. The output voltage can be adjusted using a built-in potentiometer.24.08.2021 07:30:00Augnews_2021-09-01_12.jpg\images\news_2021-09-01_12.jpghttps://www.coseleurope.eu/news-item-1414-cosel-releases-new-family-of-200-peak-power-ac-dc-lhpcoseleurope.eu
AEC-Q200 Compliant Fuses with High DC Voltage RatingBel Fuse-Circuit Protection announced the 0ACH Ser...9433Product ReleaseAEC-Q200 Compliant Fuses with High DC Voltage RatingBel Fuse-Circuit Protection announced the 0ACH Series of fast-acting, high current SMD brick fuses. The series offers high current ratings and high interrupting ratings within a small package size of 4.5 x 4.5 x 12.3 mm. The 0ACH Series is designed for automotive and other applications which require a high current fuse, and where any gain in size, weight and power is beneficial - such as high-power battery systems, routers, and blade servers. The range is supplied as tape & reel for auto-insert SMD processes. The series delivers current ratings of 60A to 100A, DC voltage of 72Vdc with interrupting ratings up to 1000A, meets AEC-Q200 automotive requirements, and is RoHS compliant, halogen free and complies with UL 248-1 and UL 248-14.23.08.2021 17:30:00Augnews_2021-09-15_24.png\images\news_2021-09-15_24.pnghttps://belfuse.com/news-detail/new-aec-q200-compliant-fuses-with-high-dc-voltage-ratingbelfuse.com
DC/DC Converters with 3kVAC Reinforced IsolationTRACO POWER announces their THR-WI series of 3 / 1...9410Product ReleaseDC/DC Converters with 3kVAC Reinforced IsolationTRACO POWER announces their THR-WI series of 3 / 10 / 20 / 40 watt DC/DC Converters with double / reinforced insulation providing up to 3,000 VAC Isolation. These products operate over an ultra-wide 4-1 input range with up to 90% efficiencies and operating temperatures from -40°C to 80°C (105°C maximum case temperature). THR 3 (3 Watt) models offer DIP 24 footprints and the THR 10 / 20 / 40 (10 / 20 / 40 Watt) come in 2x1" footprints. Input ranges include 9~36 / 18-75 / 40~160 VDC and provide single & dual outputs ranging 5~24 VDC. Models are fully encapsulated to withstand shock and vibration standards per IEC / EN 61373. Internal input filters enable EN 55032 class A compliance (3 /10 / 20 watts) and overload, overvoltage and short-circuit protection. With the latest IT safety certifications (IEC/EN/UL 62368-1), the THR-WI series is the perfect choice for many demanding applications in the industrial, transportation and instrumentation sectors.23.08.2021 16:30:00Augnews_2021-09-01_21.jpg\images\news_2021-09-01_21.jpghttps://www.tracopower.com/de/thr-series-reinforced-isolated-3-40-watt-dcdc-convertertracopower.com
EMC-filter for Machinery and RoboticsSchaffner has extended its FN3270 series to provid...9404Product ReleaseEMC-filter for Machinery and RoboticsSchaffner has extended its FN3270 series to provide more options for machine builders. Building on the strengths of the FN3270 filter range the FN3271 filter is a compact and lightweight filter design requiring minimum mounting space in installations and cabinets. 15 different filter models are available to meet the specific needs and deployment for most industrial applications. These include industrial viable speed electrical power drive systems, motor drives and systems containing frequency inverters and servo drives. The FN3271 offers an ideal solution for EMC challenges, where the impedance at the connection to the noise source is high (> 100 Ohm). The internal configuration of the FN3271 is optimised for this application. For applications with low impedances at the noise source the existing FN3270 remains the option of choice. These EMC filters provide the attenuation performance required to fulfil EN 61800-3/A11 and the filter performance is guaranteed under full load operating conditions. Solid, touch-safe terminal blocks are fitted to all filter models from 10 to 100 A, offering sufficient contacting cross section according to the EN 60204-1 installation standard. To improve the safely of installations optional transparent protective covers are available for all filters with busbars from 150 to 1000 A. These provide protection to the installer, operator, or inspector by avoiding accidental contact with live conductors. The protective covers can easily be retrofitted even if the filter is already installed and connected.23.08.2021 10:30:00Augnews_2021-09-01_15.jpg\images\news_2021-09-01_15.jpghttps://www.schaffner.com/media/news/details/article/fn3271-emc-filter-for-machinery-and-robotics/schaffner.com
The End of the Internal Combustion Engine – Many Car Manufacturers are ReadyWith the EU's "Fit for 55" legislation package, th...9398Industry NewsThe End of the Internal Combustion Engine – Many Car Manufacturers are ReadyWith the EU's "Fit for 55" legislation package, the internal combustion engine is set to disappear: From 2035, all new registered vehicles in Europe are to be zero-emission. Many car manufacturers have already adjusted their strategies to be able to hit this target. The success of e-mobility is an important step towards clean transportation and guarantees the economic position of Europe as a center of commerce and industry thanks to its cross-sector innovation efforts. In this way, electric vehicles promote a new concept of mobility and offer added value to society as a flexible temporary storage system of green energy (vehicle-to-grid). The worlds of new energy and mobility are joining forces, including back on site: The Power2Drive Europe Restart 2021 exhibition will be held from October 6–8 in Munich and showcase charging solutions, battery electric vehicles as well as the intelligent integration of e-mobility in a renewable energy system. By launching the "Fit for 55" legislation package, the European Commission has made the decision to move away from internal combustion engines. Now car manufacturers are required to do the same. According to the European Commission plan, yearly emissions of new vehicles must be 55 percent lower starting in 2030 than in 2021. By 2035, this figure increases to 100 percent in comparison to 2021, meaning that all new registered vehicles from 2035 onwards would be emission free.19.08.2021 14:00:00Augnews_2021-09-01_9.jpg\images\news_2021-09-01_9.jpghttps://www.powertodrive.de/news/the-end-of-the-internal-combustion-engine-many-car-manufacturers-are-ready?lang=enpowertodrive.de
VE-VIDES: Joint Research Project for Trustworthy ElectronicsCoordinated by Infineon, the research project " De...9395Industry NewsVE-VIDES: Joint Research Project for Trustworthy ElectronicsCoordinated by Infineon, the research project " Design methods and hardware/software co-verification for the unique identifiability of electronic components" ( VE-VIDES) has begun operations. Twelve partners from the research and academic sectors as well as from electronics and end user industries are working together to develop a holistic security concept for the Internet of Things. The VE-VIDES goal is to already systematically identify potential security gaps in the design phase and to use automatically generated, trustworthy mechanisms to protect electronic systems against attack. The German Federal Ministry of Education and Research is supporting the project as part of its funding measure "Trustworthy Electronics (ZEUS)". "We rely on electronic systems in almost every aspect of our lives and our work. These systems make our lives easier, safer and greener. We need trustworthy electronics if we want to really be able to rely on them," says Infineon's Djones Lettnin, head of the alliance project. "In VE-VIDES our focus is on securing the trustworthiness of system hardware while taking the direct interfaces to trustworthy firmware and software components into account." It is already necessary to plan for and secure the trustworthiness of a system and for all subcomponents during design at the architecture level. VE-VIDES is therefore researching trustworthy development and verification processes which give electronic systems verifiable and, whenever possible, quantifiable protection against attacks. The design methods, tool chains and test suites emerging from this alliance project will give a solid foundation to future development tools for trustworthy electronics and will thus contribute to the technical and technological sovereignty of Germany and Europe.19.08.2021 11:00:00Augnews_2021-09-01_6.jpg\images\news_2021-09-01_6.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2021/INFXX202108-092.htmlinfineon.com
Digital Multiphase Controller for Telecom and General-Purpose ApplicationsAlpha and Omega Semiconductor introduces the first...9400Product ReleaseDigital Multiphase Controller for Telecom and General-Purpose ApplicationsAlpha and Omega Semiconductor introduces the first product of the AOS Digital Controller product portfolio. The AOZ97774QE is offered in a QFN 5mm x 5mm package and provides flexible DC/DC controller supporting 5G Wireless, Networking, Optical Communication, and General-Purpose DC/DC applications. The AOZ97774QE provides DC/DC power conversion from the 12V power rail to Point-of-Load voltage for all main subsystems of the 5G wireless network, including CU, DU, and RU platforms. The part can be used for all 12V input applications where multi-phase power is required, and the main output is three phases or less. The Control Unit (CU), Digital Unit (DU), and Radio Unit (RU) are all critical subsystems that require the higher power that is supported with the AOZ97774QE and AOS Power Stages. The AOZ97774 offers up to 15 stored pin-strapped configurations, which is significantly more stored configurations than other solutions on the market. The multiple configurations allow for the one controller to behave as 15 separate power designs minimizing product management, faster system design, and easier logistics control. The controller also has NVM configuration, with 1,000 times read/write capability, which is also provided for maximum flexibility. This is very useful during the system bring-up and debug process, saving time and improving the reliability of results.18.08.2021 06:30:00Augnews_2021-09-01_11.jpg\images\news_2021-09-01_11.jpghttp://www.aosmd.com/res/news/news-article-1629303591411/AOZ97774_PR.pdfaosmd.com
2021 IEEE International Electron Devices MeetingWhile the comprehensive technical program for the ...9396Event News2021 IEEE International Electron Devices MeetingWhile the comprehensive technical program for the 2021 IEEE International Electron Devices Meeting (IEDM), scheduled for December 11–15, 2021 at the Hilton San Francisco Union Square hotel, will be finalized in fall, the popular IEDM Tutorials and Short Courses are already set. The broad reach, interdisciplinary nature and technical depth of the topics that will be discussed in these educational events can serve as a "crystal ball" of sorts to show where the industry is headed. At IEDM each year, the world's best scientists and engineers in nano/microelectronics gather to participate in a technical program consisting of more than 220 presentations, along with a variety of panels, focus sessions, Tutorials, Short Courses, a supplier exhibit, IEEE/EDS award presentations and other events highlighting leading work in more areas of the field than any other conference. "As the COVID-19 pandemic has demonstrated, the world is becoming increasingly reliant on electronic technologies. The good news is that the IEDM Tutorials and Short Courses will provide attendees with the invaluable knowledge and information needed to advance the state-of-the-art in critical areas of the field," said Meng-Fan (Marvin) Chang, IEDM 2021 Publicity Chair, IEEE Fellow, Distinguished Professor of Electrical Engineering at National Tsing Hua University, and Director of Corporate Research at TSMC. "The opportunity to engage with the world's technical leaders in these highly specialized areas is one of the hallmarks of the IEDM conference."17.08.2021 12:00:00Augnews_2021-09-01_7.jpg\images\news_2021-09-01_7.jpghttps://www.ieee-iedm.org/ieee-iedm.org
150mm Silicon Carbide Wafer Supply AgreementCree | Wolfspeed and STMicroelectronics announced ...9391Industry News150mm Silicon Carbide Wafer Supply AgreementCree | Wolfspeed and STMicroelectronics announced the expansion of an existing multi-year, long-term silicon carbide wafer supply agreement. The amended agreement, which calls for Cree to supply ST with 150mm silicon carbide bare and epitaxial wafers over the next several years, is now worth more than $800 million. "This latest expansion to our long-term wafer supply agreement with Cree will continue to contribute to the flexibility of our global silicon carbide substrate supply. It will continue to contribute importantly to our global silicon carbide supply, complementing the other external capacity we have secured and the internal capacity we are ramping. The agreement will help meet the high volumes required by our product manufacturing operations in the next years, with a large number of automotive and industrial customer programs in high volumes or ramping up," said Jean-Marc Chery, President and CEO of STMicroelectronics. "We are very pleased that STMicroelectronics will continue to leverage Wolfspeed silicon carbide materials as part of their supply strategy for the next several years," said Cree CEO Gregg Lowe. "Our long-term wafer supply agreements with device manufacturers now total more than $1.3 billion and help support our efforts to drive the industry transition from silicon to silicon carbide. Our partnerships and significant investments in increased production capacity ensure we are well positioned to capitalize on what we believe to be is a multi-decade growth opportunity for silicon carbide-based applications."17.08.2021 07:00:00Augnews_2021-09-01_2.png\images\news_2021-09-01_2.pnghttps://www.wolfspeed.com/company/news-events/news/cree-wolfspeed-and-stmicroelectronics-expand-existing-150mm-silicon-carbide-wafer-supply-agreementwolfspeed.com
Enhanced Customizations Available for Precision ActuatorsHaydon Kerk Pittman, a business unit of AMETEK's A...9409Product ReleaseEnhanced Customizations Available for Precision ActuatorsHaydon Kerk Pittman, a business unit of AMETEK's Advanced Motion Solutions Division, is pleased to announce enhancements to its MiniSlide MSA Series of precision linear slides. Originally introduced in 2020, the MiniSlide motorized linear slide system offers customers a compact, low-profile, stable platform with definable, economical costs; a rapid supply; and the ability to conveniently mount, wire, and run. The series provides design flexibility with two motor technology options, nine lead screw options, four lubrication options, a rotary encoder feedback option, and imperial or metric mounting hardware standards. The MiniSlide is ideal for lab equipment and automation applications including sample handling, spectrometers and chromatographers, molecular analyzers, optical microscopes, and inspection devices.16.08.2021 15:30:00Augnews_2021-09-01_20.jpg\images\news_2021-09-01_20.jpghttps://www.haydonkerkpittman.com/pressreleases/enhanced-customizations-available-for-minislidehaydonkerkpittman.com
Rail-to-Rail CMOS Operational AmplifierROHM developed the BD8758xY series (BD87581YG-C, B...9406Product ReleaseRail-to-Rail CMOS Operational AmplifierROHM developed the BD8758xY series (BD87581YG-C, BD87582YFVM-C) of rail-to-rail input/output high-speed CMOS op amps that feature improved EMI immunity for automotive and industrial equipment applications requiring high-speed sensing in harsh environments, such as vehicle engine control units and anomaly detection systems for factory automation equipment. In recent years, advancements in electrification and mounting density have increased the amount of environmental noise in electric vehicles and cars equipped with ADAS. Generally, however, it is extremely difficult to carry out noise evaluation on individual boards and systems during automotive development since it must be performed after assembly. What's more, some results require improvements such as large-scale EMI countermeasures to lower noise. In response, ROHM released the EMARMOUR series in 2017 that have since been well received in the automotive and industrial markets due to their superior noise immunity that reduces design resources by combining a vertically integrated production system with proprietary analog design technology. The EMARMOUR series is designed to prevent malfunctions due to noise without the need to take special application measures. The latest BD8758xY series in particular has demonstrated superior performance under four international noise evaluation tests. For example, in ISO 11452-2 radio wave emission testing conducted by vehicle manufacturers, the output voltage of standard products fluctuates by more than ±300mV in all frequency bands, while the new BD8758xY series achieves ±10mV or less.16.08.2021 12:30:00Augnews_2021-09-01_17.jpg\images\news_2021-09-01_17.jpghttps://www.rohm.com/news-detail?news-title=new-emarmour-op-amp-series&defaultGroupId=falserohm.com
3-Phase MOSFET Gate DriverTRINAMIC Motion Control introduces the fully integ...9427Product Release3-Phase MOSFET Gate DriverTRINAMIC Motion Control introduces the fully integrated TMC6140-LA 3-phase MOSFET gate driver that simplifies design and maximizes battery life of brushless direct current (DC) motor drives. The TMC6140-LA 3-phase MOSFET gate driver integrates all three bottom shunt amplifiers to provide a complete motor drive solution with improved power efficiency, while simplifying design by reducing component count. The TMC6140-LA is optimized for performance over a wide voltage range, making it well-suited for servo motors, brushless motors and permanent magnet synchronous motors. The three-phase gate driver is equipped with charge pumps for both the gate and low-side drivers, statically stabilizing the gate voltages of external MOSFETs in three-phase motors with up to 100A of coil current. Offered in a 36-pin quad-flat no-leads (QFN) package, the gate driver is a flexible solution for 5V to 30V DC and 0.5A or 1.0A battery-powered applications, such as power tools where voltages can drop below 10V. Integrated current sense and diagnostics features add functional safety while simplifying design.16.08.2021 11:30:00Augnews_2021-09-15_18.jpg\images\news_2021-09-15_18.jpghttps://www.trinamic.com/company/news/news-detail/trinamics-3-phase-mosfet-gate-driver-maximizes-battery-life/trinamic.com
Tunnel Magneto-Resistance Current SensorCrocus Technology announces the CT430 and CT431 is...9422Product ReleaseTunnel Magneto-Resistance Current SensorCrocus Technology announces the CT430 and CT431 isolated current sensor with 1MHz bandwidth and 99% of stray fields without the need for external shielding. The Crocus proprietary TMR technology inherently offers very high signal-to-noise ratio (SNR) which allow for high resolution measurements required for precision control or monitoring applications. The linear error and offset performance is intrinsically more accurate permitting the elimination of system level calibration normally done with an external voltage reference, thus freeing up processor time and simplifying system design. "I'm excited to introduce this truly differentiated current sensor product which highlights the benefits the Crocus XtremeSense TMR technology can bring." states Zack Deiri, President and CEO of Crocus Technology. "Our customers have been astounded by the level of performance we are able to deliver in their applications. The combination of high response time and accuracy provides system designers the flexibility they have been eager to achieve without any compromises." Targeting applications in Solar Power Inverters, Power-Factor Correction (PFC), Battery Management Systems (BMS), Smart Appliances, IoT, and Power Supplies applications. These devices are perfect companions to emerging applications utilizing GaN and SiC power devices where the fast response time of the Crocus TMR current sensors will ensure the highest operational efficiency.16.08.2021 06:30:00Augnews_2021-09-15_13.gif\images\news_2021-09-15_13.gifhttps://crocus-technology.com/wp-content/uploads/2021/08/Press-Release-CT43x-Product-Announcement.pdfcrocus-technology.com
Active Clamp Flyback Controller for Power Adapters Up To 100WSilanna Semiconductor has launched an integrated a...9436Product ReleaseActive Clamp Flyback Controller for Power Adapters Up To 100WSilanna Semiconductor has launched an integrated active clamp flyback (ACF) controller that will reduce the operational and no-load/ stand-by power consumption of high-efficiency chargers and adapters while driving down component count, BOM cost and size. Silanna's ACF controller is targeted at high efficiency and high power density adapters of up to 65W output power with universal input and 100W output power with PFC-support applications, including single-port and multi-port USB-PD fast chargers. Featuring a high level of integration, the SZ1131 incorporates an adaptive digital PWM controller, ultra high-voltage (UHV) active clamp FET, active clamp gate driver and startup regulator. The SZ1131 provides the ease-of-design of a simple flyback controller with all the benefits of an ACF design, including recycling the leakage inductance energy of the flyback transformer and limiting the primary FET drain voltage spike during the turn-off events. Employing Silanna Semiconductor's OptiModeTM digital control architecture, the SZ1131 adjusts the device's mode of operation on a cycle-by-cycle basis to maintain high efficiency, low EMI, fast dynamic load regulation, and other key power supply parameters in response to varying line voltage and load. An all-silicon 65W USB-PD reference design using the SZ1131 demonstrates a 30W/inch3 power density (uncased) with impressive ~93% low line (90Vac) and > 94% high line (230Vac) efficiencies, while using lower cost components. These include a conventional RM8 transformer, 100V SR FET, minimal clamp capacitor, and a single common mode choke in the input filter. Silanna Semiconductor's technology-agnostic approach focuses on the ultimate power management challenges and delivers even higher efficiency and power density when paired with GaN primary FETs.10.08.2021 20:30:00Augnews_2021-09-15_27.jpg\images\news_2021-09-15_27.jpghttps://silanna.com/2021/08/10/silanna-semiconductors-active-clamp-flyback-acf-controller-for-power-adapters-up-to-100w-combines-industrys-highest-integration-and-operational-efficiency-with-ultra-low-no-load-po/silanna.com
Rad Hard Gallium Nitride (GaN) Power Devices for Geostationary SatellitesEPC Space announces that it has been selected by A...9411Product ReleaseRad Hard Gallium Nitride (GaN) Power Devices for Geostationary SatellitesEPC Space announces that it has been selected by Astranis to provide Rad Hard gallium nitride-based power devices for use in DC power supplies on the latest satellite build. Astranis announced earlier that it has started to build four new small geostationary communications satellites, three of which are already spoken for signed deals with new, yet-to-be-announced customers. This new build of Astranis satellites is expected to offer 15% greater lifetime and 20% greater throughput the first-generation model, without increasing satellite hardware costs. Astranis is building small, low-cost telecommunications satellites to connect the four billion people who currently do not have access to the internet. Each spacecraft operates from geostationary orbit (GEO) with a next-generation design of only 400 kg. By owning and operating its satellites and offering them to customers as a turnkey solution, Astranis can provide bandwidth-as-a-service and unlock previously unreachable markets. The Rad Hard GaN power devices that EPC Space is providing to Astranis provide high precision, small size, low weight, and can withstand the harsh environment of space. "We are honored that Astranis has selected EPC Space as a trusted vendor to provide Rad Hard GaN for their geostationary satellites" commented Bel Lazar, CEO. "This program will add to the tens of thousands of our units already on board of satellites flying in LEO and GEO orbit with mission lives of more than 10 years."10.08.2021 17:30:00Augnews_2021-09-01_22.jpg\images\news_2021-09-01_22.jpghttps://epc.space/2021/08/rad-hard-gallium-nitride-gan-power-devices-from-epc-space-selected-by-astranis-for-geostationary-satellites/epc.space
Ultra-Low Loss Diode for Light Vehicle GeneratorsInfineon Technologies and Robert Bosch GmbH are la...9386Product ReleaseUltra-Low Loss Diode for Light Vehicle GeneratorsInfineon Technologies and Robert Bosch GmbH are launching an ultra-low-loss diode called Active Rectifying Diode for light vehicle generators. It enables an increase in generator efficiency of up to eight percent compared to conventional power conversion methods and facilitates generators to qualify as eco-innovations as defined by the European Union. Deploying the diode can reduce the CO 2 emissions of a car by up to 1.8 g/km. Since it can replace standard devices one-to-one, the Active Rectifying Diode can easily be applied even to generators and cars that are already in series production. The Active Rectifying Diode is based on a new chip technology from Infineon that integrates MOSFETs, capacitors and control logic on a single die, thus avoiding the complex mounting of separate chips. The Infineon chip is then assembled by Bosch into the body of the diode in a pressfit package. The new diode is unique for several reasons including its extremely low diode forward voltage of 0,1 V at 100A I RMS (root mean square current) and lowest leakage current. Additionally, it features a simple assembly process, mechanical robustness as well as high reliability and electromagnetic compatibility.10.08.2021 13:30:00Augnews_2021-08-15_17.jpg\images\news_2021-08-15_17.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2021/INFATV202108-090.htmlinfineon.com
Strengthening Distributed Energy Resources Management SolutionsMitsubishi Electric Corporation announced, togethe...9397Industry NewsStrengthening Distributed Energy Resources Management SolutionsMitsubishi Electric Corporation announced, together with its U.S. subsidiary Mitsubishi Electric Power Products, Inc. (MEPPI), that it has entered into an agreement to acquire UK-based Smarter Grid Solutions (SGS). SGS is a leading global provider of distributed energy resources (DER) management software for power distribution utilities and DER operators. "We are very excited to bring SGS into Mitsubishi Electric. They are committed to the mission of decarbonizing electric power production and have spent the last decade developing world-class products and processes. We look forward to marrying their products with our suite of grid control products to help our customers respond to changes and still get the best performance from their electric grids." said Brian Heery, President and CEO of Mitsubishi Electric Power Products, Inc. "SGS offers innovative solutions have helped power utilities in Europe and North America install, manage and optimize renewable energy resources, and we look forward to bringing that DER management core competency to new markets around the globe," said Noriyuki Takazawa, Group President of Energy and Industrial Systems Group, of Mitsubishi Electric Corporation. "The SGS solutions align with the Mitsubishi Electric Environmental Sustainability Vision to realize a decarbonized society by the year 2050 through reduced greenhouse gas emissions." "We are thrilled to join Mitsubishi Electric and expand the reach of our energy management enterprise software to DER customers around the globe and - in turn - assist those customers to better manage DER assets as they strive to decarbonize their operations," said Brent Marshall, CEO of SGS.10.08.2021 13:00:00Augnews_mitsubishi.jpg\images\news_mitsubishi.jpghttps://de.mitsubishielectric.com/en/news/releases/global/2021/0810-a/index.htmlmitsubishielectric.com
Online Power Design Tool Makes Identifying Optimal SiC FET Design Solutions EasyUnitedSiC has launched an upgrade to its FET-Jet C...9405Product ReleaseOnline Power Design Tool Makes Identifying Optimal SiC FET Design Solutions EasyUnitedSiC has launched an upgrade to its FET-Jet Calculator. This version (v2) significantly streamlines the SiC FET and Schottky diode selection process and simplifies the analysis of all power related results. First launched in March, this simple, registration-free online tool facilitates the designer's selection and performance comparison process, in different power applications and 26 unique topologies. With more available topologies, FET-Jet Calculator now supports an even wider range of power applications, making UnitedSiC FETs accessible to anyone looking to work with SiC for the first time or experienced designers seeking the best SiC device to suit their design. Allowing for engineers to identify the optimal UnitedSiC device across AC/DC, DC/DC and DC/DCiso power designs, this upgrade adds instant bar chart results presenting both losses and efficiency data. Optimal gate drive and snubber recommendations are also displayed. Finally, once the preferred SiC solution is defined, all input/output design information can be easily downloaded in pdf form. As with the first version of the calculator, users select their application function and topology, enter their design parameter details, and the tool automatically calculates switch current, efficiency, and losses, categorized by conduction, turn-on, and turn-off contributions. All UnitedSiC FETs and Schottky diodes can be selected from sortable tables including the latest Gen 4 750V devices. The tool also warns if a selection is not suitable, allowing engineers to quickly find the ideal design solution.10.08.2021 11:30:00Augnews_2021-09-01_16.jpg\images\news_2021-09-01_16.jpghttps://unitedsic.com/news/unitedsic-launches-fet-jet-calculator-v2/unitedsic.com
Direct Bonded Copper Ceramic SubstrateRogers Corporation's Advanced Electronics Solution...9403Product ReleaseDirect Bonded Copper Ceramic SubstrateRogers Corporation's Advanced Electronics Solutions (AES) group launches curamik Endurance substrates which is a Direct Bonded Copper Ceramic Substrate with enhanced properties. curamik Endurance substrates provide enhanced reliability performance compared to material combinations of the same dimensions. This reliability improvement makes the new substrates well suitable for high power applications, such as in EV/HEV, Vehicle Electrification, Industrial, Renewable and Mass Transit. curamik Endurance extends the field of applications for DBC. Thermal cycle tests show that curamik Endurance substrates have an extraordinary increased lifetime compared to its alternative standard DBC substrates with dimples (AlN, Al2O3, HPS (ZTA)). To achieve the increase in reliability, Rogers adjusted the design of the copper sidewall to gain the perfect stress release. The current available material combinations are all based on a 0.3mm copper thickness. The ceramic types Al2O3, HPS (ZTA) and AlN can be chosen by referencing our curamik Ceramic Substrates - DBC Technology design rules.10.08.2021 09:30:00Augnews_2021-09-01_14.jpg\images\news_2021-09-01_14.jpghttps://rogerscorp.com/advanced-electronics-solutions/curamik-ceramic-substrates/curamik-endurancerogerscorp.com
Quick Charge Compliant 100 W USB-C PD PPS ChargerTransphorm announced a collaboration with power so...9402Product ReleaseQuick Charge Compliant 100 W USB-C PD PPS ChargerTransphorm announced a collaboration with power solutions manufacturer Salom to bring to market a Quick Charge 5 compliant 100 watt GaN power adapter that is slated for release in Q4 2021. The USB-C Power Delivery (USB-C PD) charger will pair with Quick Charge 5 technology-capable of charging smartphones from 0 to 50 percent in five minutes. It will be a universal adapter offering the traditional power delivery mode and the USB-C programmable power supply (PPS) mode version 3.0, which enables the charger to easily deliver a sliding range of voltages (between 3.3 V to 21 V) versus the traditional mode's stepped voltage output. With assistance from Qualcomm Technologies, Transphorm developed the adapter's specification and designed the overall functional product, from the universal input through to the USB-C PD/PPS output. Transphorm's GaN is used in the traditional AC-to-DC boost PFC and the DC-to-DC quasi-resonant flyback (QRF) topologies. Salom was responsible for then taking that designed system, fine tuning it, developing its enclosure and completing all the required certifications such as Quick Charge 5, conducted/radiated emissions, touch temperature, and others. "Adapter solutions with Transphorm's GaN enable more with less," said Philip Zuk, SVP of Worldwide Technical Marketing and Business Development, Transphorm. "Compared to other GaN solutions such as e-mode, our normally-off SuperGaN FETs offer ease of design and standard Silicon-like drivability while delivering more power in a considerably smaller footprint without compromise. And we've proven that our production yields can meet high volume requirements." 10.08.2021 08:30:00Augnews_2021-09-01_13.jpg\images\news_2021-09-01_13.jpghttps://www.transphormusa.com/en/gan-technology/transphormusa.com
Wade Appelman Named President and COOAceinna named Wade Appelman as the company's Presi...9372PeopleWade Appelman Named President and COOAceinna named Wade Appelman as the company's President & COO, responsible for developing and implementing strategy for the company's worldwide operations. "ACEINNA is part of two exciting market trends, autonomous driving and vehicle electrification. Used in autonomous vehicles to ensure both accuracy and safety, high precision Inertial Measurement Unit Sensors (IMU) complement perception sensors such as imaging, radar and LiDAR," says Mr. Appelman. "Current sensing is another strength for ACEINNA critical to power management and I'm excited to help this talented team continue its amazing growth and technology innovation in both of these segments." According to Dr. Yang Zhao, founder and CEO of ACEINNA, "Wade is an organized and dynamic technology executive who will be able to successfully lead the ACEINNA engineering, marketing and business teams towards our goal of making next generation self- driving and eco-friendly vehicles a reality." Prior to joining ACEINNA, Mr. Appelman was VP and GM of the depth sensing division of ON Semiconductor where he led the team responsible for adoption of low light sensors in LiDAR and successfully secured early customers designs in automotive, medical, and industrial markets for the divisions sensing product portfolio. 05.08.2021 11:00:00Augnews_2021-08-15_3.jpg\images\news_2021-08-15_3.jpghttps://www.aceinna.com/newsDetail?id=610c090b0afa6a2fe32c96ceaceinna.com
New Brand and Promise of Sustainable FutureON Semiconductor revealed its new trade name "onse...9370Industry NewsNew Brand and Promise of Sustainable FutureON Semiconductor revealed its new trade name "onsemi" and refreshed brand as a next step in the company's evolution to establish itself as the leading provider of intelligent power and sensing technologies. With a continued focus on the automotive and industrial end-markets, onsemi has sharpened its strategy to drive disruptive innovation that contributes to a sustainable ecosystem of high-growth megatrends such as vehicle electrification, advanced safety, alternative energy and factory automation. Under the tagline, "Intelligent Technology. Better Future.", onsemi plans to break through traditional thinking and market barriers to create innovative solutions that solve customers' most difficult design challenges, and support their achievement of their own climate initiatives, propelling the sustainable energy revolution. onsemi's value proposition includes a unique combination of deep systems knowledge, technology leadership, and industry-leading manufacturing and packaging proficiency. "We have spent the last several months focusing the strategy, and realigning our product portfolio and investments to deliver market-leading and differentiated technologies to our customers," said Hassane El-Khoury, CEO and president at onsemi. "We are creating intelligent power and sensing technologies to enable our customers' success, drive a better future for next generations and create value for our shareholders, always with an eye on sustainability to make the world a better place for everyone."05.08.2021 09:00:00Augnews_onsemi.jpg\images\news_onsemi.jpghttps://www.onsemi.com/company/news-media/press-announcements/en/onsemi-new-brand-and-promise-of-sustainable-futureonsemi.com
Top Manufacturer of Passive ComponentsAs one of the leading manufacturers of electronic ...9392Industry NewsTop Manufacturer of Passive ComponentsAs one of the leading manufacturers of electronic components, Würth Elektronik is a valued manufacturer partner of Mouser Electronics. Mouser is enthusiastic not only about the products, but also about the cooperation. For the second year in a row, Joe Haukos, Distribution Manager Americas at Würth Elektronik eiSos, was honored with the Mouser Best-in-Class Award. Each year, the electronics distributor honors individuals in the industry with its Best-in-Class Award, recognizing those who maintain a strategic partnership with the Mouser team, promote product lines and new product introductions, find creative solutions to mutually expand market share, maximize Mouser's value proposition, and champion Mouser within their own companies. The presentation of the award to Joe Haukos by Jeff Newell, Senior Vice President at Mouser Electronics, capped off a thoroughly enjoyable quarterly meeting. "We aspire to provide more than electronic components…we want to provide an experience which fosters loyalty with customers and business partners. Through exceptional collaboration and dedication within the greater Mouser organization, we're able to do just that." Said a pleased Joe Haukos Commented Newell, "We are pleased to present Joe with this award in recognition of his outstanding relationship with Mouser. Joe and the Würth team have proved dedicated to fostering collaboration, increasing annual revenues, and furthering our successful partnership."05.08.2021 08:00:00Augnews_2021-09-01_3.jpg\images\news_2021-09-01_3.jpghttps://www.we-online.com/web/en/wuerth_elektronik/news_weg/News_Detail_WE_Gruppe_126014.phpwe-online.com
Bridgeless Totem Pole PFC Evaluation BoardGaN Systems and onsemi released a 300W BTP-PFC Bri...9376Product ReleaseBridgeless Totem Pole PFC Evaluation BoardGaN Systems and onsemi released a 300W BTP-PFC Bridgeless Totem Pole Power Factor Correction (PFC) evaluation board. The board includes onsemi's NCP1680, a dedicated critical conduction mode (CrM) bridgeless totem pole PFC controller, and GaN Systems' 650V GS66508B GaN transistors. The NCP1680 controller and GS66508B transistors combine to deliver an innovative cost-effective and high-performing solution in a small footprint. The solution enables power engineers to evaluate GaN and capitalize on its benefits in improving power system performance. GaN Systems' GS66508B is a 650V, 30A transistor that provides low-loss, high switching frequency, zero reverse recovery, and very low junction-to-case thermal resistance. The evaluation board allows rapid development of advanced totem pole PFC designs and ideal in various power supply applications for the data center, telecom, industrial, and consumer industries. On the controller side, this Bridgeless Totem Pole PFC solution leverages the NCP1680, which offers unique features for operation under light load conditions, digital voltage loop compensation, and near unity power factor in all operating modes. Altogether, the solution achieves near 99% efficiency, simplifies design, and reduces bill-of-material count and cost. "Leaders like onsemi recognize the importance of GaN and are optimizing controllers and creating complementary tools like the new 300W PFC evaluation board we introduced today. These solutions strengthen the GaN industry ecosystem in the goal to make better performing and more cost-effective power electronics," said Jim Witham, CEO at GaN Systems.05.08.2021 06:30:00Augnews_2021-08-15_10.jpg\images\news_2021-08-15_10.jpghttps://gansystems.com/newsroom/on-semiconductor-bridgeless-totem-evaluation-board/gansystems.com
Automotive Grade Semi-Shielded Power Inductor SeriesBourns announced its automotive grade Model SRN604...9388Product ReleaseAutomotive Grade Semi-Shielded Power Inductor SeriesBourns announced its automotive grade Model SRN6045HA power inductor series. These inductors feature semi-shielded construction to combine the features of non-shielded and shielded inductors, and offer lower magnetic field radiation than non-shielded inductors. The products are a more cost-efficient alternative to fully shielded ferrite-based inductors, yet allow high temperature operation compared to standard semi shielded inductors. In addition, the new inductor series is AEC-Q200 compliant with an operating temperature range of -55 to +125 °C making the Model SRN6045HA series ideal for power management and electromagnetic interference (EMI) filtering solutions in automotive, consumer, industrial and telecom electronics. The newly developed magnetic silicon-based coating used in the inductors enables high working temperatures and extends the operating temperature range by 20 percent on the high end compared to standard Bourns semi-shielded power inductors. The high-temperature magnetic silicon-based coating is applied to the perimeter of the inductor winding to provide effective magnetic shielding. Along with its high operating temperature, compact size and low losses, the Model SRN6045HA series also features high current capacity with saturation current Isat ranging from 1.2 – 18 A and heating current Irms of 0.72 – 7.0 A. The Bourns automotive grade SRN6045HA series is available now with inductance values of 0.55 – 100 µH and is RoHS compliant and halogen free.04.08.2021 15:30:00Augnews_2021-08-15_19.jpg\images\news_2021-08-15_19.jpghttps://www.bourns.com/news/press-releases/pr/2021/08/04/bourns-announces-automotive-grade-semi-shielded-power-inductor-series-with-high-temperature-ratingsbourns.com
Application-Specific MOSFETs (ASFETs) for Hot-SwapNexperia announced 80 V and 100 V ASFETs with enha...9382Product ReleaseApplication-Specific MOSFETs (ASFETs) for Hot-SwapNexperia announced 80 V and 100 V ASFETs with enhanced SOA performance, targeting hot-swap & soft-start applications in 5G telecom systems & 48 V server environments and industrial equipment needing e-fuse and battery protection. ASFETs are a new breed of MOSFET optimized for use in particular design scenarios. By focusing on specific parameters critical to an application, sometimes at the expense of others that are less important in the same design, new levels of performance can be achieved. The hot-swap ASFETs use a combination of Nexperia's latest silicon technology and copper-clip package construction to significantly strengthen the Safe Operating Area (SOA) and minimize PCB area. The PSMN4R2-80YSE (80 V, 4.2 m?) and PSMN4R8-100YSE (100 V, 4.8 m?) hot-swap ASFETs are packaged in the Power-SO8 compatible LFPAK56E. The unique internal copper-clip construction of the package improves thermal and electrical performance whilst substantially reducing footprint size.  The new LFPAK56E products are just 5 mm x 6 mm x 1.1 mm, offering reductions of 80 % and 75 % for PCB footprint and device height respectively, compared to the D2PAK of previous generations. The devices also feature a maximum junction temperature of 175 °C, meeting IPC9592 regulations for telecoms and industrial applications.04.08.2021 09:30:00Augnews_2021-08-15_13.jpg\images\news_2021-08-15_13.jpghttps://www.nexperia.com/about/news-events/press-releases/Nexperia-s-new-Application-Specific-MOSFETs--ASFETs--for-hot-swap-increase-SOA-by-166--and-slash-PCB-footprint-by-80--.htmlnexperia.com
Stereo Gallium Nitride (GaN) Streaming Hi-Fi Audio AmplifierThe Starkrimson Streamer Ultra combines a DAC, str...9408Product ReleaseStereo Gallium Nitride (GaN) Streaming Hi-Fi Audio AmplifierThe Starkrimson Streamer Ultra combines a DAC, streamer, and amplifier all inside an easy-to-use enclosure that will blend into any décor. The Starkrimson Streamer Ultra represents a new kind of high-end audio system that offers commanding performance in a discreet package. It can perform the same functions that once required a rack full of components. This latest design combines the company's highly reviewed and award-winning PecanPi DAC and Starkrimson Ultra amplifiers, fully exploring the benefits of the latest GaN transistors, such as size and weight reduction and increased power, efficiency, and sound quality, from GaN Systems. The design provides less harshness, cleaner highs, and better overall transparency and detail with inconsequential noise levels. Starkrimson Streamer Ultra is available with either Volumio or Roon end-point software installed. It is available with either black or brushed aluminum faceplates, an optional USB port (Volumio only), and upgraded power rail capacitance. MSRP is $3,499.95 for the base model. Orchard Audio is offering preorder prices where the first 10 customers will save $1,000; the next 10 will save $750; and all other preorder customers will save $500. Units are scheduled to begin shipping in late November 2021.03.08.2021 14:30:00Augnews_2021-09-01_19.jpg\images\news_2021-09-01_19.jpghttps://orchardaudio.com/orchardaudio.com
Group Sustainability Director Emma DarkeTT Electronics announced the appointment of its fi...9373PeopleGroup Sustainability Director Emma DarkeTT Electronics announced the appointment of its first-ever Group Sustainability Director. Emma Darke, who has served as TT's Head of Investor Relations since 2016, has stepped away from her IR duties to take on this new and important role for TT Electronics. "This new appointment highlights the importance of sustainability as a critical strategic priority at TT," said Sarah Hamilton-Hanna, Chief People Officer, TT Electronics. "Emma's deep understanding of our business, as well as our environmental, social, and governance initiatives, makes her the ideal individual to accelerate TT's commitment to achieving our sustainability goals." As Group Sustainability Director, Emma is tasked with working in partnership with TT's business leaders and Sustainability Council to develop the company's sustainability roadmap to zero emissions by 2035. "TT Electronics has made great strides on the sustainability front. Now, with an even deeper commitment to the effort, TT is laser focused on improving upon our recent environmental accomplishments which include 20 per cent reduction in CO2 emissions, 88 per cent of company waste diverted from landfills, and zero waste achieved at three of our sites in 2020," added Emma Darke, TT's new Group Sustainability Director. "These accomplishments are certainly impressive and took a concerted effort but there is more to be done. With TT's emphasis on creating positive impacts to society, we are well on our way to achieving even greater results."03.08.2021 12:00:00Augnews_2021-08-15_4.jpg\images\news_2021-08-15_4.jpghttps://www.ttelectronics.com/news-events/news/tt-electronics-appoints-company%E2%80%99s-first-sustainabi/ttelectronics.com
Scienlab Battery Pack Test System with High Voltage Silicon Carbide TechnologyKeysight Technologies announced the Scienlab SL170...9383Product ReleaseScienlab Battery Pack Test System with High Voltage Silicon Carbide TechnologyKeysight Technologies announced the Scienlab SL1700A Series, a battery pack test system for high voltage battery packs - up to 1500 V for automotive and industrial application. Customers need vast labs with multiple test channels to develop batteries, but space and power supplies are limited. Keysight's SL1700A Series utilizes high voltage silicon carbide (SiC) technology to achieve higher efficiency and energy recovery capabilities, which is crucial to reduce overall lab costs. It provides high power in a small footprint and is modular and upgradable to address future power needs. "Our next generation battery pack test systems based on high voltage SiC technology, provide more power and higher voltages in less space, when compared to similar systems," said Michael Schugt, managing technology director of Keysight's Automotive & Energy Solutions group. "When combined with the solutions energy efficiency, it allows our customers to design new batteries in their lab with greater flexibility." A battery pack is a complex system involving high voltages and currents, electrical and mechanical components, cooling system and a battery management system (BMS). All components require thorough testing to draw conclusions about the durability, range, efficiency and heating of the pack.03.08.2021 10:30:00Augnews_2021-08-15_14.png\images\news_2021-08-15_14.pnghttps://www.keysight.com/de/de/about/newsroom/news-releases/2021/0803-nr21105-keysight-launches-scienlab-battery-pack-test-system.htmlkeysight.com