Bodo's News

Read through my personal pick of news around people, our industry, important events and interesting product releases. Or click on a filter and pick your area of interest!

 

EPE'22 ECCE Europe: 5 – 9 September 2022, Hannover, Germany
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Learn more:
epe2022.com
  • Event News
  • 2021-11-11

The European Power Electronics and Drives Association, EPE-Association in short, in collaboration with its co-sponsor IEEE-PELS, is proud to announce that EPE'22 ECCE Europe will take place in the Hannover Congress Center from 5 to 9 September 2022. In addition to the regular topics for paper submission, EPE'22 ECCE Europe at Hannover will highlight the following Focus Topics, not only in dedicated lecture and dialogue sessions, but also in keynotes, the exhibition, panel discussions, tutorials and technical visits. Paper submissions in line with these Focus Topics are highly encouraged.
Technology Focus Topics: New Power Electronic Devices / Integration and Adverse Effects of WBG Devices / Batteries in Power Electronics
Application Focus Topics: Electrification of On- and Off-Road Vehicles / Electrification of Aircraft / Electricity and Hydrogen based Energy Systems

The final synopsis submission deadline will be: 8 December 2021

eGaN FETs for eBikes, eMotion, Drones, and Robots
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Learn more:
epc-co.com
  • Product Release
  • 2021-11-09

The EPC9145 demonstration board is a 3-phase BLDC motor drive inverter board featuring the 2.2 mO maximum RDS(on), 80 V maximum device voltage EPC2206 eGaN FET. This board is tailored to ebikes, eMotion, drones, and robot motor applications. With 48 V bus voltage, it can deliver 15 ARMS steady state at 50°C temperature rise in natural air convection and can reach 20 ARMS (28 APEAK) with a heatsink attached. The EPC9145 has been tested up to 100 kHz, 60 V input, and 50 APEAK. The EPC9145 contains all the necessary critical function circuits to support a complete motor drive inverter and the dimensions of the board are only 130 mm x 100 mm (including connector). The EPC9145 also features the ST Microelectronics, STDRIVEG600, smart motor drive GaN half-bridge driver. GaN FETs switch fast with zero reverse recovery. This feature enables higher switching frequency in the 100 kHz range to eliminate the need for electrolytic capacitors and to reduce the motor losses. Additionally, the deadtime can be reduced to approximately 20 ns to allow higher torque per ampere. Overall, GaN devices improve inverter and motor system efficiency and reduce size and weight by integrating the inverter inside the motor.

Consortium to Create European Supply Chain for Silicon Carbide Semiconductors
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Learn more:
bosch-presse.de
  • Industry News
  • 2021-11-09

Many of today's key projects focus on the same objective: to improve energy efficiency and thereby protect the environment. These projects are typically in areas such as electromobility, renewable energy, and edge and cloud computing – including the requisite data centers. Experts agree that silicon carbide (SiC) semiconductors and the electronic components containing them will ensure the most efficient use of the electricity at our disposal. The object of the publicly funded "Transform" project (trusted European SiC value chain for a greener economy) is to establish a resilient European supply chain for this technology, ranging from wafers and other basic materials right up to finished SiC power semiconductor devices and power electronic applications. In a consortium led by Bosch, a total of 34 companies, universities, and research institutes from seven European countries have joined forces to work toward this goal. "The aim of the Transform project is to secure a leading role for Europe in new technologies based on silicon carbide," says Jens Fabrowsky, who holds the position of executive vice-president in the Bosch Automotive Electronics division. Scheduled to run until 2024, the publicly funded project is focusing on five use cases in the automotive, industry, renewable energy, and agriculture sectors.

Expanding Wide Bandgap Semiconductor Offering
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Learn more:
nexperia.com
  • Industry News
  • 2021-11-08

Nexperia announced its entry into the high-power Silicon Carbide (SiC) diodes market with the introduction of 650 V, 10 A SiC Schottky diodes. This is a strategic move for Nexperia, already a trusted supplier of efficient power Gallium Nitride (GaN) FETs, to expand its high-voltage wide bandgap semiconductor device offering. In an increasingly energy-conscious world, there is a burgeoning demand for high power applications with superior efficiency and power-density. In this regard, Silicon is fast approaching its physical limits. According to Mark Roeloffzen, General Manager of the Bipolar Discretes Group at Nexperia "Wide bandgap semiconductors like Gallium Nitride and Silicon Carbide are now well placed to meet the stringent needs of high-volume applications, bringing the promise of higher efficiency, greater power density, lower system cost and reduced operating costs for original equipment manufacturers. Nexperia's diverse portfolio of SiC diodes will bring greater choice and availability to this market." Nexperia's first SiC Schottky diode is an industrial-grade device with 650 V repetitive peak reverse voltage (VRRM) and 10 A continuous forward current (IF), designed to combine ultra-high performance and high efficiency with low energy loss in power conversion applications. Providing the added benefit of a high-voltage compliant real 2-pin (R2P) package with higher creepage distance, it is available in a choice of surface mount (DPAK R2P and D2PAK R2P) or through-hole (TO-220-2, TO-247-2) devices.

Real-Time Autonomous Sensing and Protection
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Learn more:
navitassemi.com
  • Product Release
  • 2021-11-05

Navitas Semiconductor has announced the launch of GaNFast power ICs with GaNSense technology. GaNSense technology integrates critical, real-time, autonomous sensing and protection circuits which further improves Navitas' industry-leading reliability and robustness, while increasing the energy savings and fast-charging benefits of Navitas' GaN IC technology. Gallium nitride (GaN) is a next-generation semiconductor technology that runs up to 20x faster than legacy silicon and enables up to 3x more power and 3x faster charging in half the size and weight. Navitas' GaNFast power ICs integrate GaN power and drive plus protection and control to deliver simple, small, fast and efficient performance. GaNSense technology integrates real-time, accurate and fast sensing of system parameters including current and temperature. This technology enables a patent-pending loss-less current-sensing capability, which improves energy savings by up to an additional 10% compared to prior generations, as well as further reducing external component count and shrinking system footprints. In addition, if the GaN IC identifies a potentially dangerous system condition, the IC is designed to transition rapidly to a cycle-by-cycle sleep-state, protecting both the device and the surrounding system. GaNSense also integrates an autonomous standby-power feature which automatically reduces standby power consumption when the GaN IC is in idle-mode, helping to further reduce power consumptions, which is especially important to the growing list of customers aggressively pursuing their own environmental initiatives.

NFC Type 2 Tag IC with Privacy Features
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Learn more:
st.com
  • Product Release
  • 2021-11-04

STMicroelectronics' ST25TN512 and ST25TN01K NFC Forum Type 2 tag ICs deliver a new balance of cost and performance for high-volume use cases like consumer engagement, product information, and brand protection. Also suitable for smart-city applications and access control, the ST25TN512/01K NFC tag ICs support multiple user-protection and privacy mechanisms including a 7-bit unique chip-identifier code, TruST25 digital signature, NFC Forum T2T permanent write locks at block level, and a configurable kill mode that permanently deactivates the tag. Certified to NFC Forum Type 2 specifications, the ST25TN512 and ST25TN01K leverage ISO 14443 standards and can be used with NFC-compatible mobiles or a dedicated short-range reader. The embedded device memory includes up to 208 bytes (1664 bits) dedicated to user content. Support for messages in NFC Data Exchange Format (NDEF) allows triggering native actions on a smartphone without needing a dedicated app, such as launching a web browser or starting Bluetooth pairing. Augmented NDEF (ANDEF) additionally enables reading dynamic information such as custom messages and unique tap codes without explicitly updating the EEPROM.

Oscilloscopes with Analog Bandwidth Options from 200 MHz to 1 GHz
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Learn more:
teledynelecroy.com
  • Product Release
  • 2021-11-04

Teledyne Test Tools T3DSO3000 Oscilloscopes feature four channel models with analog bandwidth options from 200 MHz to 1 GHz. Each model offers a maximum sample rate of 5 GSa/s, and a maximum memory depth of 250 Mpts in half channel mode. All models incorporate two 5 GSa/s ADCs and two 250 Mpts memory modules. The T3DSO3000 series employs a new generation of high speed display technology that provides excellent Signal clarity, fidelity and performance. It comes with a minimum vertical input range of 500 µV/div, an innovative digital trigger system with high sensitivity, low jitter, and a waveform capture rate of 500,000 waveforms/sec (sequence mode). The T3DSO3000 also employs a 256-level intensity grading display function and a color temperature display mode which complement the high speed update rate. Teledyne Test Tools latest oscilloscope offering supports multiple powerful triggering modes as standard including serial bus triggering of I2C, SPI, UART, CAN, LIN, CAN FD, I2S, FlexRay, MIL-STD-1553B and SENT. Manchester protocol is also supported as standard in decode mode only and uses standard edge triggering. Also featuring as part of our launch promotion is the MSO Probe which ships as standard with each bandwidth model thus providing 16 digital channel Mixed Signal capability.

48 V Open Rack Power Shelf
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Learn more:
artesyn.com
  • Product Release
  • 2021-11-04

Advanced Energy introduced a high-density, high-efficiency 48 V, 30 kW dual-feed Open Rack version 3 (ORv3) power shelf that minimizes the power consumption and improves the reliability of compute and storage applications in hyperscale and enterprise data centers. Featuring power supplies with demonstrated efficiency of 97%, Advanced Energy's Artesyn 2U shelf incorporates a hot swappable controller and can accommodate up to twelve 48 V, 3 kW open rack rectifiers with power up to 30 kW. These rectifiers include an embedded automatic transfer switch (ATS) capability that switches input to a secondary AC source on detection of primary AC power loss without any interruption to output voltage. "Minimizing power consumption and driving down costs are key challenges for data center operators as they look to meet the increased power demands of the latest high-performance processors," said Harry Soin, senior director of technical marketing for hyperscale data centers at Advanced Energy. "Evolving rack power from 12 V to 48 V architectures reduces conduction losses by a factor of 16, while open systems compliance ensures interoperability and reduced total system costs. Advanced Energy's Open Rack power shelf and rectifiers directly address these requirements while adding ATS technology to ensure optimal availability."

ACF-Based GaN Reference Design
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Learn more:
powerdensity.com
  • Product Release
  • 2021-11-03

Silanna Semiconductor has launched an Active Clamp Flyback (ACF)-based reference design that will simplify and speed the development of 65W 1C fast charger applications. Built around Silanna's SZ1131 ACF controller and incorporating Transphorm's Super GaN FET, the RD-29 is a production-ready 65W 1C USB-PD reference design for travel adapters and battery chargers. The reference design delivers industry-leading peak efficiencies of 94.5% and flat efficiency across universal (90 – 265Vac) input voltages and loads. No-load power is just 23mW @ 230Vac and the design measures only 34.5mm x 34mm x 30.5mm, giving it an uncased power density of 30W/inch3. "The RD-29 is a production-ready design that incorporates everything a designer needs to develop a charger and that already exceeds conducted and radiated EMI requirements by more than 6 dB," says Ahsan Zaman, director of product marketing at Silanna Semiconductor. "Benchmarked against the best-in-class commercially available 65W charging products this reference design provides an impressive 1% higher efficiency and reduces vampire power by as much as 44%. Combined with the industry-leading integration of our SZ1131 ACF controller, this has allowed us to create a solution that engineers can use to quickly develop compact and lightweight 65W chargers that operate with the least possible power consumption."

Electrification Solutions for Megawatt Charging of Heavy-Duty Electric Vehicles
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Learn more:
sensata.com
  • Product Release
  • 2021-11-03

Sensata Technologies announced its High Voltage Junction Box solutions provide safe and reliable protection and power distribution for high power charging of commercial electric vehicles. The solutions include DC Charging Boxes that support megawatt charging of medium and heavy-duty electric trucks up to 850 Volts and 1300 Amps. Combining Sensata's proven contactor, fuse, and controller technologies into a compact package, the High Voltage Junction Boxes are custom-designed for specific vehicle requirements. Driven by the need for fast charging, electric vehicle manufacturers require systems that can handle higher charging power levels. "We have successfully optimized our contactor and fuse design to meet the increased thermal performance that megawatt charging requires while keeping within tight space constraints," said Brian Wilkie, Vice President, Heavy Vehicle & Off-Road at Sensata Technologies. According to Mr. Wilkie, "Sensata's unique capability to design all the safety-critical components of the solution (like contactors, fuses, control boards and software) in-house was instrumental in securing new strategic agreements with industry leaders for our custom power management and protection solutions, which help simplify our customers' production processes." To meet current carry and temperature requirements, Sensata's cooling and temperature control technology directly interfaces to the busbars and provides exceptional cooling efficiency within tight space restraints. For additional safety, Sensata's isolation monitoring design ensures isolation of the high voltage from the chassis. The solutions' software and controllers are built on the AUTOSAR platform.

Qorvo Acquires United Silicon Carbide (UnitedSiC)
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Learn more:
qorvo.com
  • Industry News
  • 2021-11-03

The acquisition of United Silicon Carbide expands Qorvo's reach into the fast-growing markets for electric vehicles (EVs), industrial power, circuit protection, renewables and data center power. United Silicon Carbide will become part of Qorvo's Infrastructure & Defense Products (IDP) business and will be led by Dr. Chris Dries, who was formerly United Silicon Carbide's president and CEO and is now general manager of Qorvo's Power Device Solutions. Philip Chesley, president of Qorvo IDP, said, "The addition of United Silicon Carbide to our IDP business significantly expands our market opportunities in high-power applications. This acquisition enables Qorvo to deliver high-value, best-in-class intelligent power solutions covering power conversion, motion control and circuit protection applications." Dr. Dries said, "Our team is thrilled to expand our SiC portfolio as part of Qorvo and continue to build the business with speed and scale, working to accelerate SiC adoption with the industry's highest performance devices. Our SiC technology, together with Qorvo's complementary Programmable Power Management products and world-class supply chain capabilities, enable us to deliver superior levels of power efficiency in advanced applications." United Silicon Carbide's product portfolio now spans more than 80 SiC FETs, JFETs and Schottky diode devices. Based on a unique cascode configuration, the recently announced Generation 4 SiC FETs are specified at an industry-leading 750V at 5.9 milliohm RDS(on), enabling new levels of SiC efficiency and performance critical for EV chargers, DC-DC converters and traction drives, as well as telecom/server power supplies, variable speed motor drives and solar photovoltaic (PV) inverters.

Collaboration to Improve Performance of EV Inverter Assemblies
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Learn more:
macdermidalpha.com
  • Industry News
  • 2021-11-02

MacDermid Alpha Electronics Solutions has announced a cooperation with STMicroelectronics on a key sinter technology for Electric Vehicle inverter assemblies, designed to significantly increase vehicle efficiency and range, and lower production costs. Sinter technology is changing EV inverter assembly with pressure sintering providing a significantly lower thermal resistance, superior power cycling and mechanical reliability over conventional techniques. ST is offering its STPAK package for automotive traction inverters for assembly directly onto the heatsinks through sintering using ALPHA Argomax silver sinter paste. The ALPHA Argomax sinter paste, formulated using highly engineered silver particles, has been specially developed for low-pressure sinter die and package attachment. The paste creates a strong attachment through silver metallic bonds, offering physical strength, unsurpassed electrical conductivity and optimal thermal properties resulting in long-term reliability improvement. "The collaboration between ST and MacDermid Alpha to develop and refine advanced sintering technology has been extremely effective in producing the perfect combination – STPAK package sintered with ALPHA Argomax", said Edoardo Merli, Power Transistor Macro-Division General Manager and Group Vice President of STMicroelectronics Automotive and Discrete Group. "This unique attach process provides an unparalleled level of flexibility, reducing the overall number of power discretes needed and enabling significant cost savings ", said Julien Joguet, Director of Marketing – Power Electronics at MacDermid Alpha. "ALPHA Argomax sinter package and die attach technology, which has already been deployed in more than 2 million electric vehicles, enables manufacturers to produce efficient and reliable electric vehicle powertrains, a key factor in the wider adoption of electric vehicles ".

Compact High Efficiency SBDs for Automotive Applications
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Learn more:
rohm.com
  • Product Release
  • 2021-11-02

ROHM has recently expanded its portfolio of Schottky barrier diodes by 24 new compact high efficiency models (12 RBR series and 12 RBQ series). These devices – 178 in total – are ideal for protection and rectification circuits in automotive, industrial equipment, and consumer applications. Diodes are commonly used in a variety of circuits for rectification and protection. Moreover, as lower power consumption is required in most applications, the adoption of SBDs – which are more efficient than other diodes – is on the rise. However, if VF is lowered to improve efficiency, IR which is inversely related to VF will become higher. This increases the risk of thermal runaway, so it is important to balance both VF and IR when selecting SBDs for circuit design. In response, ROHM strengthened its lineup of SBDs that balances small size with low VF and IR– characteristics demanded by the automotive sector. The market-proven RBR and RBQ series have been further expanded to include a lineup of compact high current, high voltage products that enable rectification and protection in a wider range of applications. Introducing a new process allows ROHM to improve the chip performance of both series by 25% (VF of RBR series in particular) over ROHM's conventional products. Furthermore, the RBR series features excellent low VF characteristics – key to improving efficiency and reducing loss. This makes them ideal for automotive applications as well as consumer electronics such as laptops where high efficiency is required. In fact, 12 of the products adopt a compact package (PMDE package) that reduces mounting area by 42% compared to existing products (PMDU package).

1200V 80mO Silicon Carbide MOSFET
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Learn more:
semiq.com
  • Product Release
  • 2021-11-01

SemiQ announced the launch of its 2nd Generation Silicon Carbide power switch, a 1200V 80mO SiC MOSFET, expanding its portfolio of SiC power devices. This MOSFET complements the company's existing SiC rectifiers at 650V, 1200V and 1700V. SemiQ has engineered this MOSFET to provide the best trade-off of conduction and switching losses to benefit the widest possible range of applications. SiC MOSFETs bring high efficiency to high-performance applications including electric vehicles, power supplies and data centers and are specifically designed and tested to operate reliably in extreme environments. Compared to legacy Silicon IGBTs, SemiQ's MOSFETs switch faster with lower losses, enabling system-level benefits through reduced size, weight and cooling requirements. Michael Robinson, President and General Manager at SemiQ said "Thanks to those employees, associates, supporters and vendors who have worked tirelessly to build and qualify our initial Gen2 SiC Power MOSFET which demonstrates the high-quality, optimized performance, and robust reliability that will be characteristic of a SemiQ MOSFET portfolio that is on the way."

Pump/Fan Driver ICs
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Learn more:
melexis.com
  • Product Release
  • 2021-10-28

In order to address more challenging customer deployments, Melexis has expanded its MLX90412 product offering. The latest version of this 2.2A automotive-qualified pump/fan driver IC is optimized to deal with high ambient temperature levels and supports prolonged operational lifespans. Melexis introduces the MLX90412GLW single-coil pump/fan IC with integrated driver stage. It is intended for applications with high ambient temperature such as automotive water pumps. The MLX90412GLW drives pumps up to 15W in Internal Combustion Engines (ICE). This typically implies a maximum ambient operating temperature up to 135?. While water pumps up to 20W can be driven within the maximum ambient temperature of 85? of electric vehicles (EV). The MLX90412GLW is qualified to meet the increasing operating lifetime demand. This goes up to 15,000 hours of EV applications such as battery cooling. The MLX90412GLW, a dedicated automotive 1-coil motor driver, includes all state of the art protections. Hall-sensor based 1-coil water pumps are well known for their robust start-up performance. With the MLX90412GLW, pump manufacturers can offer a complete portfolio of water pump solutions. It can be configured in a range of BLDC commutation options from sinewave mode, offering the lowest noise performance ideal for EVs over a high torque mode, up to a low EMI mode, for ON/OFF applications requiring minimum external EMI filter components.

High-Tech Manufacturing in Southeast Asia
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Learn more:
ats.net
  • Industry News
  • 2021-10-28

AT&S announced detailed project information on the company's planned investment in a factory for IC substrates at the Kulim Hi-Tech Park, Kedah. CEO Andreas Gerstenmayer and COO Ingolf Schroeder gave insights into the planned investment, the project scope, technology details, as well as the planned activities to hire approx. 6,000 highly qualified employees. AT&S' new campus for the production of IC substrates in Kulim Hi-Tech Park, Kedah, involves a proposed total investment for phase 1 of RM 8.5 billion (€1.7 billion). The construction of the facility is going to start with an official groundbreaking ceremony on October 30, 2021, with commercial operations targeted to come on stream in 2024. "I want to thank the Malaysian government as well as the MIDA (the government's principal promotion agency under the Ministry of International Trade and Industry) for the great support throughout the entire process, from the start of our location scouting until today," says AT&S CEO Andreas Gerstenmayer. "Already today, Malaysia is an important hub for the chip supply chain. We are convinced that Malaysia can further strengthen its position as a technology country and will develop its position in the region as a high-tech manufacturing hub in Asia," Gerstenmayer says.

DC DC Converter for H2 Fuel Cell Applications
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Learn more:
brightloop.fr
  • Product Release
  • 2021-10-27

BrightLoop Converters launches a standard HV<->HV DC DC converter to interface with fuel cells of all levels of power: the DCHV320. Like its existing product ranges, BrightLoop Converters offers the DCHV320 as an ultra size and weight optimized converter with an extreme level of versatility. It is fully reversible, operates in buck or boost mode, and multiple converters can be paralleled to meet the needs of higher power fuel cells. The DCHV320 is the first member of a new product line that will be including higher and lower current ratings, buck-boost configurations for overlapping input and output voltages ranges, and galvanic isolation option. Other versions will be released from Q2 2022. Florent Liffran, CEO of BrightLoop Converters commented: "We have found that it was hard for both fuel cell and for vehicle manufacturers to find DC DC converter options on the market which would meet their power and/or weight constraints. The DCHV320 is extremely lightweight for a converter of this power, which allows it to be (almost) forgotten in the system, compared to the current state of the art converters. We are therefore thrilled to contribute to the development of fuel cell adoption in electric mobility with this launch."

Full Bridge LLC Transformer and Resonant Choke
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Learn more:
grupopremo.com
  • Product Release
  • 2021-10-27

PREMO releases the 11kW 3DPowerTM solution, a Full Bridge LLC Transformer 150 µH + Resonant Choke 25 µH merged in 1 single unit. This innovation provides up to 40-50% reduction in volume compared with current discrete industrial solutions for the same power management. Most of the Power Converters (resonant topologies) in the market have a Transformer, Resonant Choke, and Output choke. Every component has its own design, core, winding, and thermal dissipation solution. 3DPowerTM is the first product to integrate two magnetics components, LLC Transformer and Resonant Choke, that share the same core and feature two orthogonal magnetic fields at all points within the core. The 3DP-11KWHVHV is available with Aluminum heatsink that acts as a direct thermal interface to the cold plate. 3DPowerTM cost-saving solution is also available with 7kW and the company is developing the 22kW solution. Designs can be fully customized according to customer requirements. The Series meets the AEC-Q200 (specific automotive quality standard) and other more restrictive customer automotive supplier standards. This greener solution has been fully tested in Premo Laboratory under real operational conditions.

eGaN FET for High Power Density Telecom, Netcom, and Computing Solutions
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Learn more:
epc-co.com
  • Product Release
  • 2021-10-27

Efficient Power Conversion expands the selection of low voltage, off-the-shelf gallium nitride transistors with the introduction of the EPC2067 (1.3 m? typical, 40 V) eGaN FET. The EPC2067 is ideal for applications with demanding requirements for high power density performance including 48 V – 54 V input servers. Lower gate charges and zero reverse recovery losses enable high frequency operation of 1 MHz, and beyond, at high efficiency in a tiny 9.3 mm2 footprint for state-of-the-art power density. According to Alex Lidow, EPC's co-founder and CEO, "The EPC2067 makes the ideal switch for the secondary side of the LLC DC-DC converter from 40 V – 60 V to 12 V. This 40-volt device offers improved performance and cost compared with previous-generation 40 V GaN FETs allowing designers to economically improve efficiency and power density." The EPC90138 development board is a 40 V maximum device voltage, 40 A maximum output current, half bridge with onboard gate drives, featuring the EPC2067 eGaN FETs. This 2" x 2" (50.8 mm x 50.8 mm) board is designed for optimal switching performance and contains all critical components for easy evaluation of the EPC2067.  

Expansion to Support Demand Growth for Specialty Silicones
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Learn more:
elkem.com
  • Industry News
  • 2021-10-27

Elkem announces a strategic investment plan to unlock new specialty silicones supply for customers in Europe, the Middle East and Africa (EMEA) and the Americas. The company will invest around €36 million (NOK 350 million) to upgrade and debottleneck its silicone upstream plant in Roussillon, France. The board of directors has approved a 20,000 metric tons capacity expansion, bringing the effective silicone intermediates capacity from Elkem's upstream plant in Roussillon, France to 100,000 metric tons per annum, while delivering productivity, cost, sustainability and climate protection improvements. "At a time when silicones and their raw materials are in shortage, the expansion is cornerstone to meeting the future needs of our specialty silicones customers in EMEA and the Americas, where the market is expected to grow by around 6% per year between 2020 and 2025," said Frédéric Jacquin, Senior Vice President in charge of Elkem's Silicones Division. "This investment complements the ongoing capacity expansion at our Xinghuo site in China, which primarily serves growth in the Asia-Pacific region and further strengthens our cost position as well as environmental performance." Specialty silicones bring unique properties and performances to a wide panel of cutting-edge and sustainability-aligned markets – from electric and hybrid vehicles, to semi-conductors, decarbonized energies, 3D printing, healthcare & medical devices, aerospace, defense, or sustainable buildings. The investment plan includes installing new equipment and major technology upgrades in key parts of the plant to improve Elkem Roussillon's cost position and environmental performance, through higher materials efficiency, more energy efficient processes, reduced waste, and state-of-the-art water effluents treatment.

IWIPP 2022 Update and Call for Papers
  • Event News
  • 2021-10-27

The International Workshop on Integrated Power Packaging (IWIPP) is a workshop focused on Power Packaging Technology which will be held August 24-26th, on the campus of Aalborg University, in Aalborg, Denmark. The contents of IWIPP 2022 will include 6 keynote addresses from leading power technology experts and a broad range of technical sessions, all of which are included in the registration fee. Packaging and related technologies are the key to creating high-density power sources. Attendance at this important workshop can keep you and your colleagues on the cutting edge of power packaging technology. If you have technology advancements or research accomplishments to present to the community, Technical Chairman Nick Baker, Assistant Professor, Aalborg University, invites you to submit a digest for review by the technical committee. The call for papers is available at now, the submission portal of the website is open and accepting submissions.

400 W Rugged Doherty RF Power Transistor
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Learn more:
ampleon.com
  • Product Release
  • 2021-10-27

Ampleon announced the introduction of the BLC10G27XS-400AVT 400-Watt asymmetric Doherty RF power transistor. Designed for use in base station multi-carrier applications operating in the 2.496 GHz to 2.690 GHz frequency range, the -400AVT uses Ampleon's industry-respected 9th generation 28 V LDMOS process technology. Fabricated in an air cavity plastic (ACP) earless SOT-1258-4 package, the Doherty transistor typically delivers a drain efficiency of 45%. The BLC10G27XS-400AVT offers excellent rugged characteristics, up to a VSWR of 10:1, considered essential for base station applications where high-power extreme mismatch conditions can often occur. The transistor has integrated ESD protection, has a low output capacitance that improves Doherty performance, and includes internal input and output impedance transformation, enabling user-friendly PCB matching to 50-ohm. The power gain specification of the BLC10G27XS-400AVT is typically 13.3 dB based on quoted test conditions. Additionally, the -400AVT has low thermal resistance attributes that yield excellent thermal stability for demanding base station applications. Design support resources for the BLC10G27XS-400AVT include a recommended driver, the BLM9D2327S-50PB, an LDMOS 2-stage integrated Doherty MMIC and the PCB layout for a Doherty production test circuit. The Ampleon website hosts the BLC10G27XS-400AVT data sheet, application notes, simulation models, and an RF power transistor lifetime calculator.

Startups Focusing on Future Mobility and Digitalization
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Learn more:
infineon.com
  • Industry News
  • 2021-10-27

Semiconductors are at the core of emerging technologies that enable digital transformation. To amplify startup engagement Infineon Technologies has signed a memorandum of understanding with Hyundai Motor Group (Hyundai). Under this agreement, Infineon will support startups with product level technical expertise to enhance their success-rate and offer them the opportunity for closer collaboration within Infineon's Co-Innovation Space in Singapore. The focus is mainly on innovations that are addressing future mobility, smart cities and smart factory applications. "In an environment of rapid electrification and digitalization, creativity and innovation require collaboration across multiple knowledge domains. Co-innovation is critical to business success," said Dr Helmut Gassel, CMO and member of the Infineon Management Board on the occasion of Oktobertech Asia Pacific 2021. "We are thrilled to work together with Hyundai, a global enabler in future technologies. By bringing in our system expertise and industrial background as well as easy-to-integrate semiconductor solutions, we will foster the startup ecosystem and help startups ride the megatrends for growth." This win-win partnership leverages Infineon's easy to integrate hardware solutions including sensors, microcontrollers, actuators, and security, and Hyundai's world class portfolio of startups focusing on over the horizon technologies e.g. robotics, urban air mobility and Artificial Intelligence. In first phase, the joint activities will be undertaken by Infineon Technologies Asia Pacific and Hyundai CRADLE offices in Seoul and Singapore. In the second phase, the collaboration will be further deepened and extended globally, where Hyundai CRADLE and Infineon have established presence.

Global Expansion and Development of Next-Generation Semiconductors
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Learn more:
empowersemi.com
  • Industry News
  • 2021-10-26

Empower Semiconductor has closed a $45 million equity financing led by Mesh Ventures and including existing investors Samsung Catalyst Fund, Hallador and Regal I. The financing will further accelerate the global expansion of its sales force and operational footprint as well as the fund development of its next generation integrated voltage regulator (Empower IVR) semiconductor technology. Empower recently released its first generation IVR into mass production after nearly six years in development. By moving voltages and currents up to 1,000x faster than any competitor, Empower's technology offers dramatic energy savings to data centers that previously would not have been possible. In fact, it is estimated that adoption of Empower's technology by the world's data centers will enable annual electricity savings of up to 285 TWh by 2025 ($32 billion), or 150 million tons of carbon dioxide every year. Tim Phillips, Empower's CEO states: "Meeting the performance demands of data-intensive systems while keeping energy use to a minimum demands radical new power management solutions. Empower was founded to deliver those solutions and this latest funding will help us meet growing demand for our technologies by accelerating our product roadmap and production plans with key partners and customers.  We have set a path to make a major impact in a $10 billion segment of the high-performance power management market and we will leverage this investment to execute it."

HV Breakout Modules with PowerLok Connector System
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Learn more:
csm.de
  • Product Release
  • 2021-10-26

CSM GmbH presents "C" ("Connector") variants of the High-voltage Breakout Modules (HV BM) for measuring current, voltage and power. The "C" variants have a simple and safe connection system which facilitates handling. The time required for measurement setup is significantly reduced. In addition, the HV Breakout Modules "C" can be easily unplugged for calibration. The HV Breakout Module 1.2C is easily connected to the HV power cables via a PL500 connector system and allows single-phase measurements on separate HV+ and HV- cables. Similarly, but with a PL300 connector system, the HV Breakout Module 3.3C is connected to the HV cables, e.g. between inverters and electric motors. The HV BM 3.3C measures voltages U12, U23, U31 and internal conductor currents of L1, L2, and L3 with a measurement data rate of up to 2 MHz per measured variable. The measurement data is transferred to the measuring computer via CAN and EtherCAT (HV BM 1.2C) or XCP-on-Ethernet (HV BM 3.3C). The PowerLok connectors are designed for operating currents up to 800 A. They include a quick-lock lever with connection position aid and a socket housing with integrated high-voltage locking for high vibrations. When mated, the connectors provide IP67 protection. Due to the robust design, the connectors are also suitable for a high number of mating cycles.

International Electric Drives Production Conference (E|DPC)
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Learn more:
edpc.eu
  • Event News
  • 2021-10-26

The full program for the event December 7th – 9th is now released and available for download on the website. Keynote speakers this year are:
- Dr. Ralf Effenberger, Managing Director, INTIS - Integrated Infrastructure Solutions GmbH
- Alex Gruzen, CEO, WiTricity Corporation
- Dr. Stefan Loth, Chairman of the Board and Managing Director Technology and Logistics, Volkswagen Sachsen GmbH
- Dr. Andreas Wendt, Regional Director, ElectReon Germany GmbH

Get in touch with the newest trends and developments regarding electric drives at the E|DPC 2021.

3-Phase Gate Driver for EV and Hybrid Cars
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Learn more:
allegromicro.com
  • Product Release
  • 2021-10-26

Allegro MicroSystems is expanding its QuietMotion product line with the introduction of the A89307 automotive-qualified gate driver integrated circuit (IC). Designed for battery cooling fans and HVAC systems in electric (EV) and hybrid vehicles, the A89307 offers low noise and vibration by using a Field Oriented Control (FOC) algorithm to drive continuous sinusoidal current to the load, helping automakers reduce noise and improve battery life, offering more miles per charge and lowering vehicle carbon footprints. "By design, EV and hybrid vehicles are quieter than traditional models with internal combustion engines-especially when they're stopped-and drivers are becoming increasingly sensitive to noise created by components such as cooling fans," said Steve Lutz, Product Line Director for Motor Drivers at Allegro. "The A89307's hardware-based algorithm makes it easier for designers to reduce fan noise while improving cooling performance and increasing miles per charge. That's good for drivers, and good for the environment." The A89307 includes a hardware-based algorithm, which requires no external sensors or software development; the user simply selects parameters using a simple GUI interface and loads them into the IC's on-chip E2EPROM. With only five external components, the A89307 helps designers lower material costs by reducing BOM components and facilitating very small system footprints for in-motor PCBs. Its fully integrated algorithm can even eliminate the need for a separate microprocessor.

Integrated USB Type-C Charger Unification
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Learn more:
infineon.com
  • Product Release
  • 2021-10-25

Infineon's EZ-PD BCR (Barrel Connector Replacement) is a highly integrated USB-C controller, together with the USB-C connector, it replaces barrel connectors, custom connectors or legacy USB connectors in electronic devices. The EZ-PD BCR solution supports the USB Power Delivery (PD) standard that interoperates with all USB-C power adapters without the need of firmware development. It minimizes BOM (bill of material) cost for the USB-C power-sink system and it guarantees USB-C specification compliance and interoperability through USB-IF certification. At the power-source, in the charger, the latest CoolGaN Integrated Power Stage (IPS) 600 V leverages the markets most reliable GaN and driver technologies, uniting ultimate efficiency and reliability with ease-of-use. GaN technology allows for higher switching frequency and more output power in the same size or smaller charger with the same power level. An integration results in very high power density making this device the first choice for fast charger designs. CoolGaN has an advanced breakdown field of ten times and an electron mobility of two times higher compared to silicon devices. The key for the high frequency operation capability of CoolGaN lies in a ten times lower output and gate charge, compared to silicon-based devices and a reverse recovery charge of virtually zero.

Medical and Industrial Power Supply Series Augmented with 500W Models
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Learn more:
lambda.tdk.com
  • Product Release
  • 2021-10-22

TDK Corporation announces the introduction of the TDK-Lambda brand CUS500M1 AC-DC power supplies. The series is rated at 500W and is packaged in a 3 x 5” footprint. It provides an alternative for the 600W CUS600M models and an easy cost reduction for lower power, more cost sensitive applications. The CUS500M1 is suitable for use in a wide range of Class I or Class II (double insulated) applications, including home healthcare, medical, dental, test and measurement, broadcast and industrial equipment. The CUS500M1 series accepts an 85 to 264Vac input and has a choice of seven output voltages: 12V, 19V, 24V, 28V, 32V, 36V and 48V. An integral fan option with cover is also available. The open frame models measure 76.2 x 127 x 37mm (WxLxH), or 85 x 157 x 42.5mm with the cover/fan assembly fitted. Convection cooled the CUS500M1 can deliver 300W (500W peak) in -20°C to +40°C ambient temperatures, derating linearly to 150W load at +70°C. With forced air cooling or the integral fan fitted, the series provides up to 500W in a +60°C ambient, derating to 400W at +70°C. The efficiency of the series is up to 96%, reducing internal power losses.

Innovation Award and the Young Engineer Award 
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Learn more:
ecpe.org
  • Industry News
  • 2021-10-22

The SEMIKRON Innovation Award and the Young Engineer Award which have been initiated and are donated by the SEMIKRON Foundation are given for outstanding innovations in projects, prototypes, services or novel concepts in the field of power electronics in Europe, combined with notable societal benefits in form of supporting environmental protection and sustainability by improving energy efficiency and conservation of resources. SEMIKRON Foundation is awarding the prizes in cooperation with the European ECPE Network. With the awards the SEMIKRON Foundation wants to motivate people of all ages and organisations of any legal status to deal with innovations in power electronics, a key technology of the 21th century, in order to improve environmental protection and sustainability by energy efficiency and conservation of resources. The SEMIKRON Innovation and Young Engineer Prizes will be awarded in the frame of the ECPE Annual Event in March 2022. A single person or a team of researchers can be awarded.

Annual Distributor Awards
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Learn more:
fiveyearsout.com
  • Industry News
  • 2021-10-22

Arrow Electronics has been recognized both for team and individual performances by Bourns in its annual distribution partner awards. The awards honor exceptional sales support provided by distributors that have contributed to Bourns' business growth in EMEA (Europe, Middle East and Africa). In Arrow's Neu-Isenburg branch office at the end of September, Bourns named Arrow as the highest performing distributor, as volume partner EMEA, based on the company's overall performance. Arrow was particularly successful in the automotive sector and with products in the standard and custom magnetics, multifuse and fixed resistors categories. Benjamin Hofmann, product group manager at Arrow, was named Most Valuable Person in recognition of his engagement both in business development and customer support activities, especially in the area of magnetics.

Addition to Open Parts Library for Faster Electronics Production
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Learn more:
snapeda.com
  • Industry News
  • 2021-10-21

Seeed is adding SnapEDA computer-aided design (CAD) models to the Seeed and ShenZhen Open Parts Libraries (OPLs), to help electronics designers move from idea to fabrication with ease. The OPLs are a collection of commonly used components, designed to be used with the Seeed Fusion PCB Assembly (PCBA) service, that are widely available in the supply chain, cost effective, and design-for-manufacturing (DFM) friendly. Today it contains a wide selection of over 150,000 commonly used parts, from integrated circuits (ICs) to passives, to cut costs and reduce the turnaround times for turnkey PCB assembly. During the parts selection stage, the OPLs save engineers time and reduce delays, since the parts are carefully selected to ensure they are widely available in the local supply chain, eliminating the need to import parts and undergo lengthy and costly customs clearance processes. This is especially helpful given the current global component shortage affecting the electronics industry. In addition to preventing delays, engineers also save money since the components in these libraries are sourced from Seeed's affiliated partners network and/or are purchased in bulk.

Meeting Increased Industry Needs for Accurate Current Sense Transducers
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Learn more:
danisense.com
  • Industry News
  • 2021-10-21

Currently the electronics industry worldwide is still facing component shortages resulting in long lead-times and in some cases, dramatic increases in prices. However, Danisense is still able to supply customers within normal lead times, thanks to the company's in-house manufacturing, well-established supply chains and long experience. This is having a positive effect on Danisense's business, and the company is on track to grow revenues by over 50% in 2021. Comments Loic Moreau, Sales & Marketing Director at Danisense: "One of our key markets is EVs, so we were well aware of the fast move to electrification and what that would mean both for the need for increased testing and also the likelihood of component shortages. Therefore, we anticipated the current challenging situation and increased our inventory well in advance, so now we can now still supply our customers within normal lead times. We have seen similar cycles before, such as in 2008/2009 when there was a big collapse followed by a string recovery, so we were well-prepared." Danisense continues to invest, developing all aspects of its business to be able to respond to the needs of its diverse customer base. Headcount has more than doubled in the last two years, especially in R&D, and the factory has been completely re-organised to streamline manufacturing.

LED Driver with 4.5-75V Input Designed for Auto/Industrial/Med Apps
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Learn more:
taiwansemi.com
  • Product Release
  • 2021-10-21

Taiwan Semiconductor announces the introduction of the TS19503 single channel, continuous conduction, hysteretic mode converter for driving single or multiple LEDs. Featuring 4.5-75V input and 2A output, the TS19503 offers up to 97% efficiency and 2% accuracy over a wide range of external conditions. AEC-Q100 qualification assures high reliability while the hysteretic (bang-bang) control technique provides high accuracy and reduced external parts count. Target automotive applications include high and low beam headlights; daytime running lights; turn indicators; position indicator lights; fog lights; ATV and four-wheel drive high-brightness lamps. The TS19503 is also well suited for DC input industrial and medical applications where SELV and line isolation considerations are a concern. "The TS19503's constant current mode hysteretic control results in a very low parts count," reported Sam Wang, Vice President, TSC Products. "And our design calculator tool makes short work of implementing a working solution."

Bidirectional ESD Protection Device for USB4 Standard Interfaces
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Learn more:
nexperia.com
  • Product Release
  • 2021-10-21

Nexperia announced two PESD5V0R1BxSF extremely low clamping and capacitance bidirectional Electrostatic Discharge (ESD) protection diodes. Based on Nexperia's TrEOS technology with active silicon-controlled rectification, the devices ensure optimal signal integrity for USB4TM (up to 2 x 20 Gbps) data lines on laptops and peripherals, smartphones and other portable electronic equipment. "Since there are tight budgets on insertion loss and return loss for the USB4TM Super Speed lines, Nexperia supports design engineers by offering devices that minimize the impact of ESD protection on the total budget," says Stefan Seider, senior product manager at Nexperia. "By providing these two device options, engineers can balance between ESD voltage clamping (that is protection level) and RF performance." The PESD5V0R1BDSF is optimized for low clamping and offers extremely low insertion loss figures of -0.28 dB at 10 GHz and similarly low return loss figures of -19 dB at 10 GHz. The PESD5V0R1BCSF, on the other hand, is optimized for RF performance with insertion loss data of -0.25 dB and return loss data of -19.4 dB at 10 GHz each. This makes it ideal for applications with further limited budgets for insertion loss and return loss.

Joint Venture in SiC Power Module Business
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Learn more:
rohm.com
  • Industry News
  • 2021-10-21

Zhenghai Group and ROHM have signed a joint venture agreement to establish a new company in the power module business. The company, "HAIMOSIC (SHANGHAI) CO.,LTD." is scheduled to be established in China in December 2021, and will be owned 80% by Shanghai Zhenghai Semiconductor Technology Co., Ltd. (Zhenghai Semiconductor) of Zhenghai Group and 20% by ROHM. The company will engage in the joint venture business of development, design, manufacturing and sales of power modules using silicon carbide (SiC) power devices, with the aim of developing a power module business that is ideal for traction inverters and other applications in new energy vehicles. The agreement enables to develop highly efficient power modules by combining the inverter technology of the Zhenghai Group companies, the module technology of both companies, and ROHM's cutting-edge SiC chips. The module products to be developed through the new company are already scheduled to be used in electric vehicles, and mass production will begin from 2022. The Zhenghai Group and ROHM will work closely with this new company to contribute to further technological innovation through the development and widespread use of SiC power modules. Isao Matsumoto, President and CEO of ROHM: "We are very pleased to establish a joint venture with the Zhenghai Group, which has a wide range of businesses in China. As a leading company in SiC power devices, ROHM has been developing the world's most advanced devices and providing power solutions together with peripheral components. The development of power modules in the new company will encourage the use of SiC power devices in new energy vehicles, which are gaining momentum in China, as well as play an important role in other application research. Through the business of the new company with Zhenghai Group, we will aim for the further development and evolution of both companies."

100W and 300W DC/DCs in Eighth-Brick Format
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Learn more:
recom-power.com
  • Product Release
  • 2021-10-20

RECOM has introduced two DC/DC products with outputs of 100W and 300W in a DOSA-compatible low-profile, through-hole eighth-brick format (58.4mm x 23mm). The RPA100E-W 100W part has a wide 4:1 input range of 16-72V for nominal 24V, 28V and 48V supplies, and fully regulated 5V and 12V trimmable outputs are available. Full power is available to 50°C ambient in natural convection and to +85°C with forced air. Isolation is 1.5kVDC/1 min, basic grade. The RPA300E 300W part has an input range of 36-75V for nominal 48V supplies and features an output trimmable over a wide range of 16-35V. Isolation of this part is 2.25kVDC/1 min, basic grade. The RPA300E has an integrated heat spreader that allows direct screw-fixing to a heatsink or cold wall. Full-load operation of this part without heatsinking is to 60°C with forced air and to 85°C with load derating. Both product ranges have high power density with a typical efficiency of 94.8% (RPA300E) and 92% (RPA100E). High efficiency >90% is also maintained down to light loads, to suit applications with low standby loss requirements. The ranges include comprehensive protection against input under-voltage, short circuit, output over-current, over-voltage and over-temperature. Control features included are on/off control and remote sensing.

Winners of 2021 GaN-IC Technology Design Contest
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Learn more:
imeciclink.com
  • Industry News
  • 2021-10-19

Imec and EUROPRACTICE announced the winners of their 2021 GaN-IC design contest. The contest aims to encourage innovation in power electronics applications using imec's Gallium Nitride technology for monolithic integration of power electronics circuits. The prizewinning project entitled "High voltage half-bridge with integrated drivers and control circuits – all Gallium Nitride" was submitted by a team of researchers from the Chair of Integrated Analog Circuits and RF Systems of RWTH - Aachen University. Proposals submitted by ESAT-MICAS from KU Leuven and Leibniz University Hannover came second and third, respectively. The winning designs will be prototyped in imec's upcoming 650V GaN-IC Multi-Project Wafer (MPW) run, starting late October 2021. The team from RWTH Aachen University proposed a circuit based on a high-voltage half-bridge output stage, featuring integrated drivers and a level-shifter. Potential applications include non-isolated buck converters supporting automotive electronics in lower voltage systems for conventional or hybrid vehicles, or high voltage circuits for fully electric vehicles. Although multichip solutions combining GaN half-bridge ICs with integrated drivers and level-shifting are available from a limited number of suppliers, fully integrated GaN converters are not. The design proposed by the Aachen team features a very high level of integration for all GaN-ICs, integrating power- and control-circuitry, which eliminates the need for external controllers or drivers. The design proposed by the KU Leuven team features an all-GaN direct AC/DC power converter IC, targeting large volume products such as mobile appliance chargers and adapters, as well as integrated power converter regulators for automotive and consumer electronics. 

DC-DC Converters Help Reduce Race Car Weight
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Learn more:
vicorpower.com
  • Industry News
  • 2021-10-19

Dynamis PRC, the Formula Student team of Politecnico di Milano, has over 100 students and the team designs and manufactures a racing car prototype every year, for racing in the international Formula SAE championship. After 15 years in the combustion category, Dynamis PRC has reached fourth position, and first in Italy, in the Formula Student Combustion world ranking. The team is now in the process of changing from a combustion engine to electric power, allowing it to make many improvements to the car's design and performance. Chief among these was weight reduction, going from over 20kg for the original engine, to four 3.5kg electric motors, one mounted on each wheel. Each motor is independently controlled to optimize both traction and braking performance. One of the major new components was the accumulator, which comprised 660 Sony VTC6 cells to deliver up to around 550V. To supply the vehicle's 12V low voltage power, a LiFePO4 battery was also included in the electrical system. However, this was found to have very low autonomy. To solve this challenge, Dynamis decided to use the existing 12V circuit, powered by the low voltage battery, to supply the on-board PCBs, sensors, and telemetry equipment. Dynamis would then step down the voltage from the high voltage accumulator and extract 12V, using two DC-DC converter modules. This method would be used to meet the more demanding part of the low-voltage load, sourcing 600W – 50A at 12V – to supply the cooling fans and cooling water pump. The DC-DC converter system had to be reliable, as a fault would cause the cooling system to stop, leading to an uncontrolled rise in motor and inverter temperatures. Weight and size were also key concerns. After an extended search for suitable DC-DC products, Dynamis settled on Vicor's DCM4623 module, as it satisfied all their system requirements. The Vicor DC-DC converter module can operate in array mode, accommodating an input supply from the accumulator that ranged from 550V down to 330V as the batteries discharged during a race.

15 Years ZS-Handling
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Learn more:
zs-handling.com
  • Industry News
  • 2021-10-15

ZS-Handling is celebrating its 15th anniversary this year. Founded in 2006, the company develops and produces systems and handling technology for a wide range of applications. With its 25 highly qualified employees, the Regensburg site manufactures innovative and customized solutions for world market leaders in the fields of semiconductor and solar technology, glass production and medical technology. ZS-Handling GmbH also offers solutions for optimizing production processes in the field of e-mobility. The heart of the system is the patented ultrasonic bearing, which enables contactless gripping and transport of sensitive components. The so-called sonotrode of the ultrasonic bearing is made to vibrate and thus generates an air film that causes the component to float in a controlled manner. In combination with negative pressure, components can also be gripped and moved from above without surface contact. This gentle handling prevents even the smallest damage such as micro-scratches or cracks on the highly sensitive components. This technology can also be used in the clean room and needs significantly lower energy consumption compared to conventional non-contact handling technologies, as no compressed air is required. Application areas include films, glass, wafers & chips, lenses as well as battery and fuel cell foils. In recent years, projects have been successfully implemented in-country and abroad with leading manufacturers. The success in the semiconductor industry was followed by entry into the solar industry. The competence of ZS-Handling GmbH in non-contact handling has quickly got around. In the meantime, projects in the glass manufacturing and automotive industry have also been successfully carried out.

Engineering Expertise, Vertical Range of Manufacture and Availability of Passive Components
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Learn more:
smp.de
  • Industry News
  • 2021-10-14

On its new website, SMP Sintermetalle Prometheus GmbH & Co KG (SMP) showcases its wide range of innovative products, high level of engineering expertise, smart vertical range of manufacture, availability and wide-ranging applications of its inductive components. At its headquarters in Germany, SMP develops and produces chokes, EMC filters, transformers and soft magnetic mouldings. The soft magnetic powder composites used in the passive components are specially developed for each application and manufactured in-house to ensure high availability. The extremely low-loss components are designed for currents of up to 3000 amperes and frequencies of up to 5 gigahertz. They are available in sizes from 19 mm to 300 mm diameter, with weights ranging from 0.05 kg to 130 kg. SMP components are used in applications in the fields of power electronics, drives, automation, signal processing, medical technology, E-mobility, marine, railway, environmental technology, energy transformation, renewable energies and aerospace. The products are sold worldwide with an export quota exceeding 50 percent. Founded in 1982, the family-run business has since become a major global supplier of soft magnetic components for industrial applications.

'EMEA Fastest Growing Distributor of the Year' Award
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Learn more:
ttieurope.com
  • Industry News
  • 2021-10-14

TTI has received the 'EMEA Fastest Growing Distributor 2020' award from Japan Aviation Electronics Industry, Ltd (JAE), the Japanese manufacturer of connectors and cable assemblies. The prestigious distribution award recognises TTI's 2020 outstanding performance across EMEA with successful design-in activities, culminating in exceptional growth for JAE. "We appreciate the professional collaboration TTI and JAE have developed over the years," said [Erik Troeger, Senior Distribution Manager at JAE Europe ]. "The 'EMEA Fastest Growing Distributor 2020' award recognises TTI's important contribution last year. A productive and trusting relationship in combination with the effective implementation of joint activities is essential for us to meet our long-term goals for success." Ronald Velda, Director Supplier Marketing Europe Connectors at TTI added: "We are delighted to receive this prestigious award and want to thank JAE for this honour. Helping our partners grow is what our team at TTI does best. This award recognises the dedication and effort of our TTI team, and I would like to thank JAE for its never-ending support. We look forward to continuing on this growth path with JAE for the coming years."

Dual MOSFETs Deliver Low ON Resistance
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Learn more:
rohm.com
  • Product Release
  • 2021-10-13

ROHM developed dual-MOSFET products (Nch+Pch) featuring ±40V/±60V withstand voltages, QH8Mx5/SH8Mx5 series. The devices are ideal for driving motors in base stations (cooling fans) and industrial applications such as factory automation equipment requiring 24V input. In recent years, MOSFETs are increasingly required to ensure sufficient margin against voltage fluctuations by providing 40V and 60V withstand voltages to support 24V input required for motors used in industrial equipment and base stations. Furthermore, MOSFETs are expected to deliver higher speed switching together with lower ON resistance to further improve the efficiency and miniaturization of motors. In response, ROHM developed its 6th generation 40V/60V MOSFETs utilizing the latest precision processes for the Nch MOSFETs, following the release of the latest generation Pch MOSFETs announced at the end of last year. This combination allows ROHM to provide class-leading dual Nch+Pch MOSFETs that deliver the ±40V/±60V withstand voltage required for 24V input. Moreover, the company developed also the +40V/+60V QH8Kxx/SH8Kxx (Nch+Nch) series to support a wider range of needs. (12 models in total of Nch+Pch and Nch+Nch). The QH8Mx5/SH8Mx5 series utilizes original latest processes to achieve class-leading lower ON resistance, 61% lower than the Pch MOSFETs in dual MOSFETs products in the ±40V class. This contributes to significantly lower power consumption in a variety of applications. Furthermore, integrating 2 devices into a single package contributes to miniaturize applications by reducing mounting area and decrease the workload required for component selection (combining Nch and Pch).

SOIC-16 DC/DC Range Added
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Learn more:
recom-power.com
  • Product Release
  • 2021-10-13

RECOM has extended its range of DC/DC converters in a SOIC-16 package. The parts feature 5V (4.5-5.5V) inputs and a semi-regulated 5V output rated at either 0.5W (R05C05TE05S) or 1W (R05CTE05S). Line and load regulation figures are specified across the full temperature range, and there is no minimum load requirement, making the parts ideal for applications that have light-load operation modes. Both parts have a 3kVDC/1 min (basic) insulation rating with greater than 8mm input/output creepage and clearance, and operate from -40°C to 125°C with derating. Isolation capacitance is just 7pF. Protection features include short-circuit, over-current, over temperature, and input undervoltage, making the parts highly suitable for applications that demand a high level of reliability and robustness. EMI levels are also particularly low compared with more expensive competing products. The SOIC-16 package is just 10.35mm x 7.5mm footprint and 2.5mm profile, perfect for space-constrained designs. The two parts are pin compatible, allowing future upgrades from 0.5W to 1W if necessary. The DC/DCs are also partially pin compatible with the higher specification RECOM R05CT05S, which includes features such as remote on/off and reinforced isolation. Applications for the two ranges include isolated COM port power supplies, gate drive power, current sensing/smart metering, medical devices, industrial PLC (I/O), and sensors for IoT/IIoT.

Hitachi Energy Goes Live
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Learn more:
hitachienergy.com
  • Industry News
  • 2021-10-13

Speaking from its global headquarters in Zurich, Switzerland, Claudio Facchin, CEO of Hitachi Energy, commented, "At Hitachi Energy, we are championing the urgency of a clean energy transition, through innovation and collaboration. There are many pathways towards a carbon-neutral future – to tackle this global challenge, we nurture diverse global teams bringing authentic passion and enduring ownership." He continued, "By 2050, global electrification will near-double in demand and electricity will be the backbone of the entire energy system. At Hitachi Energy we have pioneered many of the technologies needed for advancing a sustainable energy future for all – and we are committed to continue pushing the boundaries of innovation. Delivering on the promise of a carbon-neutral future will take passion, trust and innovation – and the benefits will be for our generations and those to come. With our new name – Hitachi Energy – we are broadening our commitment to creating real impact for our customers and partners, our people and society." Hitachi Energy is fostering collaboration with customers and partners to find global solutions to solve the global challenge of an inclusive and equitable carbon-neutral future. Earlier this year, the business launched EconiQ – its eco-efficient portfolio which delivers a superior environmental performance compared to conventional solutions. Its EconiQ high-voltage offering is proven to significantly reduce the carbon footprint throughout the total life-cycle. The business also recently launched a portfolio of transformer products for offshore floating applications, designed to overcome the challenging offshore environment and efficiently harvest and integrate wind into the global energy system, directly supporting the transition to a sustainable energy future. 

Power Device Division Opens Power Electronics Research Laboratory
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Learn more:
pdd.hitachi.eu
  • Industry News
  • 2021-10-13

Hitachi's Power Device Division has opened a testing laboratory based in Bracknell, UK. The company relocated its testing laboratory to larger premises, to expand its research and testing capabilities. The launch of the laboratory is an exciting time for the company as it can now supply a range of testing, offering a comprehensive suite of services for semiconductors; which can be used to investigate anything from power module fault analysis to customer application specific conditions. The facility will enable Hitachi to assist its customers with designing in and problem-solving for the full range of its power modules (750 V to 6.5 kV), through various tests including Double Pulse testing, Short circuit conditions, Paralleled power modules testing, and Gate Driver Performance. Hitachi is flexible in implementing any test requirements for its customers to support them in their design-in phase. Aligned with its test facility, the company has also launched an online power simulation tool. This simulation tool is designed to help assist engineers to choose the right Hitachi semiconductor suited to their particular application needs. The online simulation tool and further details of the laboratory can be found on the company's website.

Textbook "GaN Power Devices and Applications"
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Learn more:
epc-co.com
  • Product Release
  • 2021-10-12

Efficient Power Conversion announces the publication of a valuable learning resource for professional engineers, systems designers, and electrical engineering students seeking the latest information on gallium nitride technology and applications. Since the 2019 release of the 3rd edition textbook, "GaN Transistors for Efficient Power Conversion", published by J. Wiley, there has been rapid adoption of GaN transistors and integrated circuits into a wide range of end-use applications such as robots, drones, Artificial Intelligence (AI) computers, AC adapters, autonomous vehicles, and even vacuum cleaners.  This book, "GaN Power Devices and Applications", provides an update on gallium nitride technology and applications by leading experts. With contributions from nearly thirty industry and academic experts, and edited by Alex Lidow, this book starts with two years of new information on technology developments, design techniques, and reliability beginning right after the publication of the 3rd edition textbook. In a practical sense, this book includes detailed discussion and analysis of the latest examples of actual GaN usage in power supplies, lidar, motor drives, and low-cost satellite applications. According to Alex Lidow, EPC's co-founder and CEO, "The information contained in this new textbook will help users fully understand, by examples, the incredible contribution that GaN devices can make to innovative power systems. In addition, QR codes have been inserted at the beginning of each chapter of the book for so that readers can link to the very latest information on GaN as new it emerges."

3D Hall-Effect Position Sensor for Faster Real-Time Control
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Learn more:
ti.com
  • Product Release
  • 2021-10-12

With Texas Instruments' 3D Hall-effect position sensor, the TMAG5170, engineers can achieve uncalibrated ultra-high precision at speeds up to 20 kSPS for faster and more accurate real-time control in factory automation and motor-drive applications. The sensor also provides integrated functions and diagnostics to maximize design flexibility and system safety, while using at least 70% less power than comparable devices. The TMAG5170 is the first device in a new family of 3D Hall-effect position sensors that will meet a wide range of industrial needs – from ultra-high performance to general purpose. "Smart factories have an increasing number of highly automated systems that must operate in a more integrated manufacturing flow while simultaneously collecting data to control processes," said Noman Akhtar, senior research analyst, Omdia. "3D position-sensing technology that delivers higher accuracy, speed and power efficiency is essential for automated equipment to quickly deliver precise real-time control for increased system efficiency and performance while reducing downtime." The TMAG5170 is the industry's first 3D Hall-effect position sensor to provide a low 2.6% full-scale total error at room temperature. It also features best-in-class drift of 3% total error – 30% lower than the next closest competitor – along with at least 35% lower error than comparable devices in the presence of a cross-axis field. Together, these features enable the TMAG5170 to deliver higher accuracy than any other 3D Hall-effect position sensor, eliminating the need for end-of-line calibration and off-chip error compensation, and simplifying system design and manufacturing. To achieve faster, more accurate real-time control, the sensor supports measurements as high as 20 kSPS for low-latency throughput of high-speed mechanical motion.

PSMA White Paper - Energy Harvesting for a Green Internet of Things
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Learn more:
psma.com
  • Industry News
  • 2021-10-12

PSMA has announced the availability of a White Paper entitled "Energy Harvesting for a Green Internet of Things." This seminal work is the result of a multi-month effort by a dedicated team of 28 international experts from a variety of backgrounds in academia and industry, led by Dr. Michalis Kiziroglou from Imperial College London and Dr. Thomas Becker of Thobecore Germany. The PSMA Energy Harvesting Technical Committee supported this work and is responsible for making the White Paper available. The ubiquitous nature of energy autonomous microsystems, which are easy to install and simple to connect to a network, make them attractive in the rapidly growing Internet of Things (IoT) ecosystem. The growing energy consumption of the IoT infrastructure is becoming more and more visible and impactful. Energy harvesting describes the conversion of ambient energy into electricity, enabling green power supply of IoT key components such as autonomous sensor nodes. Energy harvesting could lead to a lower CO2 footprint of future IoT devices by adapting environmentally-friendly materials and reducing cabling and primary battery usage. The paper is available at no cost on the PSMA website Energy Harvesting Technical Forum at https://www.psma.com/technical-forums/energy-harvesting/whitepaper.

Small Signal Schottky and Switching Diodes
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Learn more:
vishay.com
  • Product Release
  • 2021-10-11

Vishay Intertechnolog introduced surface-mount small signal diodes in the compact DFN1006-2A plastic package with wettable flanks. Designed to save space and improve thermal performance in automotive and industrial applications, the 40 V BAS40L Schottky and 100 V BAS16L switching diodes are each available in AEC-Q101 qualified versions. Measuring only 1 mm by 0.6 mm by 0.45 mm, the diodes released today occupy 90 % less board space than devices in traditional SOD/T packages, while offering a 50 % lower profile and better power dissipation. For protection again excessive voltage, such as electrostatic discharges, the BAS40L features a PN junction guard ring. The BAS40L and BAS16L offer a moisture sensitivity level (MSL) of 1 in accordance with J-STD-020 and a UL 94 V-0 flammability rating. RoHS-compliant, halogen-free, and Vishay Green, the diodes support automated optical inspection (AOI) for automotive systems. Soldering can be checked by standard vision inspection; no X-ray is required.

AC Harmonic Filter Capacitors
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Learn more:
cde.com
  • Product Release
  • 2021-10-10

Cornell Dubilier announces its patented PCD series of high current, AC harmonic filter capacitors offering dual, built-in, fail-safe protection systems, one at each end of the capacitor. Similar capacitors in this category have one open-circuit pressure device located under the top cover that requires the capacitor to be mounted from its bottom stud. With the addition of a bottom pressure device, the PCD's terminals can be fixed to a rigid busbar allowing for activation of the bottom safety device when proper clearance is provided at the bottom. When activated, the bottom pressure device expands outward like a bellows. While these fail-safe devices are designed to prevent case rupture at end-of-life, PCD series capacitors are designed to be exceptionally reliable with a service life of over 60,000 hours at rated voltage and temperature. Self-healing, metalized dielectric construction adds to their reliability. The PCD series is offered with capacitance ratings ranging from 20 µF to 125 µF at voltage ratings from 240 Vac to 600 Vac 50/60Hz. Case diameters vary from 63.5 to up to 116mm. Custom capacitance and voltage ratings, sizes, and performance characteristics are also available. Specific application conditions, especially harmonic content profiles, are needed to properly size the capacitors for peak performance. Standard terminations are M6x1 threaded, tin-plated brass. Other termination types are available.

High-Precision Voltage Reference IC Provides Very-Low Drift
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Learn more:
microchip.com
  • Product Release
  • 2021-10-07

Extended-temperature-range voltage reference ICs for automotive and industrial applications require low drift, high reliability and high performance. Microchip Technology announced today the release of a high-precision voltage reference (Vref) IC that meets these needs at a cost-effective price. The MCP1502 is an AEC-Q100 Grade 1 (-40°C to +125°C operating temperature range) automotive-qualified Vref with a maximum temperature coefficient of 7ppm/°C. "Microchip looked at the top four aspects that customers were requesting in a Vref and made a product that combines high reliability, small package size and high performance at a very cost-effective price," said Fanie Duvenhage, vice president of Microchip's mixed-signal and linear devices business unit. "This combination of features at this price is unmatched by competitors, especially when you add our experience in serving customers in the automotive and aerospace industries who require robust products for harsh environments." The MCP1502 is based on the already-proven MCP1501 Vref architecture, which has been in the market for more than five years. Packaged in a small six-lead SOT-23, the MCP1502 is an ideal choice for a wide variety of industrial, automotive and aerospace applications that require a high level of reliability. Microchip's MCP150x (MCP1501 and MCP1502) devices are perfect companions to Microchip's families of microcontrollers, ADCs and DACs, offering multiple voltage options for creating total system solutions that are suitable for a wide variety of applications that require stable, accurate and repeatable data conversion.

Low Phase Noise GaAs MMIC Amplifier
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Learn more:
richardsonrfpd.com
  • Product Release
  • 2021-10-06

Richardson RFPD announced the availability and full design support capabilities for a gallium arsenide MMIC amplifier from Analog Devices. The ADL8150 is a self-biased GaAs MMIC, heterojunction bipolar transistor, low phase noise amplifier that operates from 6 GHz to 14 GHz. The amplifier has low phase noise of -172 dBc/Hz at 10 kHz offset and provides 12 dB of typical signal gain and +30 dBm typical output third-order intercept. The amplifier requires 74 mA from a 5 V collector supply voltage. The ADL8150 also features inputs and outputs that are internally matched to 50 ?, facilitating integration into multichip modules. The ADL8150 is versatile for a range of applications, including military and space, test instrumentation, and communications.

Energy Sharing Among Neighbors with Demand-Oriented Distribution for Solar Energy
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Learn more:
infineon.com
  • Industry News
  • 2021-10-05

In order to meet Europe's (EU) ambitious climate targets, greenhouse gas emissions must be drastically reduced by 2030. To achieve this, around 28 million multi-family houses with over 80 million households must be equipped with photovoltaics. Despite the support of the EU, there are still enormous technical and regulatory obstacles, specifically with the power supply for small multi-family houses from renewable energy sources. In a cooperation with Infineon Technologies, Munich based start-up PIONIERKRAFT has overcome these hurdles with an innovative hardware and service solution coined PIONIERKRAFTwerk (German only). This technology enables self-produced solar energy to be distributed physically and by demand between different households. With Infineon's support, renewable energy can then be shared with neighbors in a decentralized manner and without intermediate storage – economically and without bureaucratic obstacles. The hardware of the participating parties is connected to the platform provided by PIONIERKRAFT using the Internet. This determines the power surplus of the generator as well as the current demand of neighbors to autonomously control the distribution process. Thus, households without a photovoltaic system can use solar power. The solution also regulates the power flows without using the public grid. Several Infineon components make this possible, including the discrete CoolSiC MOSFET IMBG120R030M1H in the surface-mount D2PAK-7L package and the EiceDRIVER Compact Gate Driver 1ED3122MU12H. By working together, the PIONIERKRAFTwerk performs efficient and bidirectional power transfer. Therefore, energy with a power of up to 2000 W can be transferred between households.

1200V Silicon Carbide Half Bridge Power Module
  • Product Release
  • 2021-10-04

Solitron has developed the SD11900 series, a 1200V, 50A power module platform to maximize the benefits of SiC, with a unique robust, simple, and cost-effective module format. The 37mm x 25mm outline is a fraction of the size and weight of standard 62mm modules. The SD11900 series maximizes power density while minimizing loop inductance with a pin configuration to allow simple power bussing. The SD11902/3/4/5 are half bridge configurations with two 1200V 32mO SiC MOSFETs. The SD11902 and SD11904 feature freewheeling 1200V SiC Schottky diodes in parallel with the MOSFETs inside the module. Two pinout configurations provide flexible power bussing options. Continuous drain current is specified at 50A. The SD11900 series is designed for demanding applications such as avionics based electromechanical actuators and power converters. With operating temperatures of -55°C to 175°C, construction includes copper baseplates and Alumina Nitride insulators ensuring TCE matching and high thermal transfer. Isolated integrated temperature sensing enables high level temperature protection. Silicon Carbide provides excellent switching performance versus the best-in-class silicon MOSFETs and IGBTs with minimal variation versus temperature. Higher efficiency levels than silicon due to significantly lower energy loss and reverse charge results in more switching power and less energy required in the switch-on and switch-off phase. Combined with high switching frequencies this translates to smaller magnetics significantly reducing system weight and size.

Successful Transition to Global Semiconductor Powerhouse
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Learn more:
wolfspeed.com
  • Industry News
  • 2021-10-04

Following a massive four-year transformation, involving the divestiture of two-thirds of the business and a repositioning of the company's overall core strategy, October 4th marks the creation of Wolfspeed. The company, formerly known as Cree, officially launches under its new name with the support of a comprehensive, multi-channel, integrated marketing campaign. Wolfspeed has served as the brand for the company's Silicon Carbide materials and semiconductor devices business unit for the past six years. Built on a 30-year heritage of domain expertise, the name Wolfspeed conveys both the noble traits of the wolf – leadership, intelligence and endurance – and speed, characterized by the pace at which the company innovates and operates, both unmatched in the industry. "Today officially marks a transformative milestone for Wolfspeed as we are now a pure-play global semiconductor powerhouse," said Gregg Lowe, CEO at Wolfspeed. "The next generation in power semiconductors will be driven by Silicon Carbide technology, with superior performance that unleashes new possibilities and positive changes to the way we live. As the original champion of this technology, we couldn't be more excited for what lies ahead." Lowe joined the company in September 2017 with a vision and commitment to a more collaborative culture built on ingenuity and a mission to pursue a more efficient future. Now, with multi-year, long-term materials agreements totaling more than $1.3 billion across several industries, a device pipeline that totals more than $15 billion, and an increased production capacity 30X larger than previous facility plans, Wolfspeed is driving multiple industries through a monumental shift from silicon to Silicon Carbide.

Webpage-Launched Simulator Available
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Learn more:
vincotech.com
  • Product Release
  • 2021-10-01

The latest in a long line of Vincotech simulation environments, VINcoSIM is the first simulator to launch from a webpage. It features topology modeling and an accurate, proven loss and temperature calculation engine. Users can even define custom heatsink builds in a one-step configuration. A click or two is all it takes to quickly assess the options and choose the best fit. "This tool is a great leap forward," says Vincotech CEO Eckart Seitter. "As a reliable partner, we aim to bring speed and flexibility to our business relationships. Part of that is helping customers make fast but well-informed decisions. We have always gone to great lengths to provide accurate, reliable simulation tools. And VINcoSIM is our most powerful and convenient power module selection tool yet." The company's first ISE simulation tool debuted 20 years ago, setting a benchmark for customer support in the power module business. Drawing on two decades' experience advancing the state of the art in simulation tools, the company has now created an easy-to-use environment to rapidly test and evaluate any of its power modules, regardless of sub-topology or components. No compromises in functions or features is demanded. Designed to fast-track simulations, VINcoSIM configures automatically when the user selects a product on the website. It is the only tool of its kind to simulate any type of topology, even the most advanced. VINcoSIM runs on substantiated data from measurements taken in high-tech labs. It is reliable; its results are accurate.

Facilities with 200kW Dyno and 250 kW DC Power Supply
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Learn more:
pre-switch.com
  • Industry News
  • 2021-09-30

Pre-Switch has expanded into a new facility. The premises will support the next phase of the company's growth and accelerate the application of the Pre-Switch technology which extends the range of e-mobility applications including EVs, electric aircraft and electric boats and other watercraft. The technology has been licensed and delivered via the CleanWave inverter reference design to leading e-mobility innovators around the world. Pre-Switch's new facility, in San Jose, California, has been outfitted with a 200kW dynamometer, a 250kW DC power supply and high precision efficiency test stations that have been custom-built to precisely measure inverter efficiencies above 99%.  This new and valuable resource will enable customers to experience the gains that can be achieved by running their inverters at 100kHz with virtually zero switching losses, and measure the motor efficiencies that result from the higher quality sine wave generated by the faster switching frequencies. Bruce Renouard, Pre-Switch CEO explains: "Inverter efficiency is vital, but in many applications, motor efficiency, especially at low torque where the motor mainly operates, is even more important. Only our soft-switching technology can deliver both, unlike hard-switching techniques which cannot get close to matching our system efficiency levels."

Josef Vissing Named President
  • People
  • 2021-09-30

TDK Corporation announced that effective October 1, 2021, Josef Vissing  (57) has been named President of TDK Europe GmbH, the company's European sales organization for passive components. He thus succeeds Ludger Trockel (57), who will take over the role as Head of Sales & Marketing Group of TDK Corporation's Electronic Components Business Company in Japan, Tokyo. TDK Europe's management team also includes Oliver Huettner (49). Huettner, Executive Vice President, will serve as the TDK Europe Head of Business Administration. The two are in full agreement: "TDK Europe's established set-up enables us to offer the best support for our European customers with a unique product portfolio centered on TDK's three key markets, Automotive, Industrial & Home Appliance and Communications. We aim to continue to grow the business together with our customers and support the growth strategies of TDK Corporation related to digital transformation and energy transformation of our society." Josef Vissing has held a number of sales positions at TDK Europe and EPCOS AG, since he joined the company in 1991 with a Diploma degree in industrial engineering. Since then, Vissing has acquired many years of business experience, among others as Head of Product Marketing for Ferrites, Head of Business Unit Transfomers and as CEO and President of EPCOS (Zhuhai) Co. in China. In 2012 he was named Head of Sales GNS (Germany, Netherlands, Switzerland) for EPCOS AG and in this capacity has been responsible for one of the company's most important sales regions.

Wireless Charging Transmitter Solutions
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Learn more:
aosmd.com/pdf
  • Product Release
  • 2021-09-30

Alpha and Omega Semiconductor announced a family of Coil Drivers. The initial product, AOZ32033AQI, offers 30V, 11mOhm in a QFN3x3 package. AOZ32033AQI is an integrated half-bridge gate driver capable of driving high-side and low-side N-channel MOSFETs. It features SRC (Slew Rate Control) to adjust sink/source current and provide the ideal trade-off between efficiency and EMI optimization in the design of Wireless Charging Transmitter (TX) circuits. The device is ideally suited to the design of Wireless Charging TX circuits used in cordless power tools, vacuum cleaners, drones, and other consumers' electronic equipment composed of full-bridge topology with a resonant tank circuit to get the best power conversion efficiency. With a highly integrated package, the AOZ32033AQI offers a part count reduction of up to 40% compared to traditional approaches. The device enables PCB space savings and higher performance in wireless transmitter circuits with high wattage of up to 30W. Moreover, the AOZ32033AQI has multiple protection functions such as high side and low side UVLO and over-temperature protection (OTP) to make the design more robust. The device can be used for a wide range of input voltages from 4V to 28V. "Wireless charging is offered at increasingly higher power levels as the benefits of eliminating physical connectors and cables are being realized by more end applications. AOS's Coil Driver products provide an efficient, power-dense, and cost-effective solution for wireless charging TX circuits. The integrated approach offers protection features not possible by using a discrete approach while reducing engineering design cycles and complexities," said Colin Huang, Power IC Marketing Manager at AOS.

Charger Delivers 100km of Range in Less Than Three Minutes
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Learn more:
abb.com
  • Product Release
  • 2021-09-30

ABB is launching an all-in-one Electric Vehicle (EV) charger, which provides the fastest charging experience on the market. ABB's Terra 360 is a modular charger which can simultaneously charge up to four vehicles with dynamic power distribution. This means that drivers will not have to wait if somebody else is already charging ahead of them. They simply pull up to another plug. The charger has a maximum output of 360 kW and is capable of fully charging any electric car in 15 minutes or less, meeting the needs of a variety of EV users, whether they need a fast charge or to top their battery up while grocery shopping. "With governments around the world writing public policy that favors electric vehicles and charging networks to combat climate change, the demand for EV charging infrastructure, especially charging stations that are fast, convenient and easy to operate is higher than ever," said Frank Muehlon, President of ABB's E-mobility Division. "The Terra 360, with charging options that fit a variety of needs, is the key to fulfilling that demand and accelerating e-mobility adoption globally." "It's an exciting day for ABB, who as the global leader in electric vehicle fast charging, is playing a key role in enabling a low carbon society," said Theodor Swedjemark, Chief Communications and Sustainability Officer at ABB.

Power Integrity Solution for Analog, Digital and Mixed-Signal IC Designs
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Learn more:
siemens.com
  • Product Release
  • 2021-09-28

Siemens Digital Industries Software introduced mPower power integrity software for analog, digital and mixed signal IC designs. The software is an IC power integrity verification solution to provide virtually unlimited scalability for analog, digital, and mixed signal ICs, enabling comprehensive power, electromigration (EM) and voltage drop (IR) analysis for even the largest IC designs. The mPower power integrity solution completes Siemens' overall electro-physical signoff suite addressing power, performance, and reliability analysis. Other offerings in this suite include Calibre PERC software, PowerPro software, HyperLynx software, and the Analog FastSPICE platforms. With this comprehensive signoff suite, designers can now use an all-Siemens power integrity design flow. "Design companies must run both block and full-chip EM/IR analysis to confirm that the power grid delivers the necessary current to the devices, and that wires will not fail prematurely," said Joe Sawicki, executive vice president for Siemens' IC EDA Segment. "With our innovative mPower solution, companies now have a fast, scalable dynamic analysis option for analog, digital and mixed signal layouts of any size, as well as silicon-proven accuracy and fast turns for even the largest digital chips."

Semiconductor R&D and Test Open Laboratory
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Learn more:
keysight.com
  • Industry News
  • 2021-09-27

Keysight Technologies and National Central University Optical Sciences Center (NCUOSC) announced a collaboration to improve the design and test validation efficiency of gallium nitride (GaN) and silicon carbide (SiC) applications, accelerating the pace of 5G and electric vehicle (EV) innovation. Wide band gap (WBG) materials, such as GaN and SiC, offer rapid switching speeds, low loss and withstand high temperature and voltage characteristics. As a result, these materials are leveraged in consumer power products, fast charging, electric vehicles and rail transit, as well as 5G infrastructures and data center servers. However, these advantages increase the complexity of design and testing. NCUOSC successfully used Keysight's PD1500A Dynamic Power Device Analyzer/Double Pulse Tester (DPT) platform to establish a third generation WBG semiconductor open laboratory to improve developing and testing efficiency. As the JEDEC, a global leader in developing open standards and publications for the microelectronics industry, continues to define the dynamic testing of WBG devices, standardized tests are starting to emerge. The Keysight PD1500A DPT determines the key performance parameters, which match all standards, such as turn-on/off and switching characteristics, dynamic on-resistance, dynamic current and voltage, as well as reverse recovery, gate charge and device output characteristics. "Keysight is happy to work with NCUOSC to help engineering teams characterize, understand, integrate, deploy and drive innovations for next-generation semiconductor technologies," said Thomas Goetzl, vice president and general manager of Keysight's Automotive and Energy Solutions business unit.

Entire Capacitor Portfolio on One Website
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Learn more:
cde.com
  • Industry News
  • 2021-09-27

Cornell Dubilier has brought its Illinois Capacitor brand capacitors to cde.com. Now engineers can view the entire portfolio of CDE and IC capacitors for power electronics applications on one site. This includes such specialized products as IC's supercapacitors, conduction-cooled (high density resonant) capacitors, rechargeable coin cell batteries, and other new additions. CDE's updated parametric search tools simplify the capacitor selection process as never before. As Illinoiscapacitor.com has now been shut down, links to that site will be automatically redirected to cde.com. In addition to combining product data, the site's Tech Center has been expanded to include additional engineering resources, such as application guides, capacitor formulas, tutorials, and a detailed glossary of terms. CDE will continue to support all IC branded products, which are available from major distributors and the company's representative network.

3kW AC/DC PSU for Power Supply Applications
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Learn more:
gan-systems.com
  • Product Release
  • 2021-09-23

GaN Systems introduced a high efficiency, highest power density 3kW Bridgeless Totem Pole (BTP) PFC + LLC Resonant Converter Power Supply Unit (PSU) that exceeds the 80 PLUS Titanium standard. The combined GaN BTP-PFC with GaN LLC resonant converter enables designers to create lower-cost power supplies that meet demands to deliver more power in a smaller footprint and new energy efficiency requirements, including European Union's "Lot 9" 2023. "With the expanding volume of data, game-changing solutions are needed to reduce energy consumption and contribute to a more sustainable future in our data centers, and these PFC and LLC reference designs take PSUs to the next level," says Paul Wiener, VP of Strategic Marketing at GaN Systems. New efficiency mandates, increasing power and data demands, and the shift to "Dollar per Density," where density is a measure of size and power of the power supply, spur the immediate need to change data center economics with smaller, more efficient, and reliable power supply design. GaN brings higher efficiency, higher power density, lower cost, and increased sustainability to the data center ecosystem. GaN Systems concluded that significant energy and cost savings are achieved by switching from silicon-based PSUs to GaN-based PSUs. Since data centers vary in size, the savings are based on a 10-Rack unit of measure. From a sustainability perspective, each set of 10 racks reduces CO2 emissions by 100 metric tons per year, and financially, GaN-based PSUs increase data center profits by $3 million per year.    

300mm, High-Temp Single-Wafer SPM
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Learn more:
acmrcsh.com
  • Industry News
  • 2021-09-23

ACM Research announced it has shipped its first 300mm single-wafer Sulfuric Peroxide Mixture systems (Single-Wafer SPM tool) for wet clean and etch processes in advanced logic, DRAM and 3D-NAND integrated circuit manufacturing. ACM's Single-Wafer SPM tool targets high ion dose doped photoresist (PR) wet strip processes, with support for metal etch or strip processes. This tool extends ACM's SPM product offering to include higher temperature SPM steps that are emerging for more advanced production nodes at 10nm and beyond. "ACM's Single-Wafer SPM tool builds on the proven performance of our Ultra C Tahoe, which addresses most SPM process steps that operate at regular temperatures," said Dr. David Wang, Chief Executive Officer and President of ACM Research. "We have leveraged Tahoe's proven capabilities to develop the Single-Wafer SPM tool, strengthening our wet cleaning portfolio with the addition of high-temperature SPM. Together, the Tahoe and Single-Wafer SPM tools address virtually all SPM processes currently deployed in advanced semiconductor manufacturing.   We continue to develop new process capabilities, including advanced hot isopropyl alcohol (IPA) drying and super critical CO2 dry technologies, with the goal of becoming a major global cleaning solution provider."

AEC-Q200 Qualified Thick Film Chip Resistor
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Learn more:
vishay.com
  • Product Release
  • 2021-09-22

Vishay Intertechnology announced that it has enhanced the Vishay Draloric RCC1206 e3 thick film chip resistor in the 1206 case size with a higher power rating of 0.5 W. Offering twice the power of standard thick film chip resistors in this size, the RCC1206 e3 can be used in place of two parallel 1206 devices or a single device in the larger 1210 case size. This allows designers to save board space in automotive, industrial, telecommunications, and medical applications, while lowering component counts and reducing placement costs. AEC-Q200 qualified, the RCC1206 e3 features a resistance range from 1 O to 1 MO -and 0 O jumper - with tolerances of ± 1 % and ± 5 % and TCR of ± 100 ppm/K and ± 200 ppm/K. The resistor offers an operating voltage of 200 V and an operating temperature range of -55 °C to +155 °C. RoHS-compliant and halogen-free, the device is suitable for processing on automatic assembly systems, and wave, reflow, or vapor phase soldering per IEC 61760-1.

Wireless BMS in Lotus Electric Vehicles
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Learn more:
analog.com
  • Industry News
  • 2021-09-22

Analog Devices announced that renowned British performance brand Lotus Cars is planning to incorporate ADI's wireless battery management system (wBMS) in its next-generation electric vehicle (EV) architecture. ADI's wBMS was selected for its increased design flexibility, battery repairability and lighter weight. The engineering collaboration will enable Lotus to safely propel its future EV fleet and continue pushing the limits of design and technology. ADI's wBMS technology eliminates the traditional wired harness, leading to a reduction of up to 90% in the wiring and 15% of the volume in the battery pack. It also improves design flexibility and manufacturability, without compromising range and state of charge accuracy over the life of the battery. ADI's wBMS enables simplified assembly and disassembly of battery packs to ensure faulty battery cells can be removed and repaired quickly and efficiently. "We worked closely with Analog Devices to integrate wBMS into our new Lightweight Electric Vehicle Architecture (LEVA), which will be the basis for all future Lotus EVs," said Richard Lively, Director, Propulsion and Chassis Engineering, Lotus Cars. "The removal of the wire harness for wBMS ensures that Lotus can offer a lightweight solution that optimizes performance and is consistent with our brand of delivering powerful performance cars with exceptional handling."

Joint Venture to Manufacture and Sell Lithium-ion Dry-Process Battery Separators
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Learn more:
polypore.com
  • Industry News
  • 2021-09-22

Polypore International and Shanghai Energy New Materials Technology reached agreement in January 2021, through their respective subsidiaries, to establish a joint venture (JV) in China for dry-process membrane separator for lithium-ion batteries (LIBs). The necessary regulatory approvals are complete, and the JV has been established as Jiangxi Enpo New Materials in Gaoan City, Jiangxi Province, People's Republic of China. Based on a license from Polypore's subsidiary Celgard, LLC (Celgard) for technology and intellectual property related to dry-process polypropylene (PP) separator, the JV will manufacture and sell quality, high-performance dry-process separator in China for LIBs used in energy storage systems (ESS) and electric-drive vehicles (EDVs). Production is scheduled to start in 2022 with PP membrane capacity of 100 million m2/year. In the joint venture, PPO Energy Storage Materials HK Ltd. will have 49 percent of the equity contribution and SEMCORP will have 51 percent. "By joining Celgard's specialized knowledge in technology, processing, and material science together with SEMCORP's operational expertise in China, the joint venture will not only provide a wide range of solutions to customers but also stimulate further development of the LIB industry overall," said Celgard president, Lie Shi. "I am thrilled to begin this partnership with SEMCORP. The combination of our two companies' strengths will provide new solutions for the world's challenges related to the environment and energy."

APEC 2022 Sponsors Continue Student Attendance Support Program
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Learn more:
apec-conf.org
  • Event News
  • 2021-09-22

The joint sponsors of the Applied Power Electronics Conference (APEC) have announced the continuation of the popular Student Attendance Support Program for APEC 2022, scheduled to take place in Houston, March 20-24. Chosen recipients of the program will receive reimbursement to cover qualified expenses for attending APEC 2022. Those eligible to apply for the program are power electronics students, undergraduate or graduate, who have been accepted to present papers at the upcoming conference in March (notification of paper acceptance is by Oct. 27, 2021.) Once accepted, student presenters must apply for the Student Attendance Support Program by November 7, 2021. In its 17th year, this popular program was initiated by the Power Sources Manufacturers Association (PSMA). It is now jointly underwritten by PSMA and the other co-sponsors of the APEC conference: the IEEE Power Electronics Society (PELS) and the IEEE Industry Applications Society (IAS). The recipients of the Student Attendance Support Program will be chosen by the APEC 2022 Student Attendance Support Committee.

Funding Round to Revolutionize Magnetics with AI Technology
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Learn more:
frenetic.ai
  • Industry News
  • 2021-09-22

The Madrid-based company Frenetic announced its closing of a €4.5 million funding round from Bonsai Partners (Spain) and Join Capital (Germany), which boosts existing support from 42Cap (Germany), Big Sur Ventures (Spain) and Bankinter (Spain) from 2019. Frenetic's AI technology has been trained to accurately design both magnetic and electronic components essential for the development of electric vehicles. In addition, through its unique technology and stock search, Frenetic tackles issues involving scarcity of chip supplies and magnetic components. The company plans to utilize this funding round to continue expansion in the US and Germany. Frenetic was founded with the goal of making magnetics simple and accessible. It is now revolutionizing the world of magnetics through AI, aiming to entirely replace outdated engineering models used in a wide range of cases - from electric chargers to space travel. Frenetic validated its technology through participation in the 2020 'Accelerator Pilot' – a program from the European Commission dedicated to the empowerment of European companies, and in which only 0.1% of applications receive community support. Chema Molina, Frenetic's CEO, who founded the company in 2018, says of the round: "This latest funding from Join and Bonsai will allow us to expand in the US and German markets with local subsidiaries, and ultimately be closer to customers. Likewise, we will be able to strengthen our relationships with manufacturers."

Wide-Input DC to DC Converter Line
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Learn more:
acopian.com
  • Product Release
  • 2021-09-21

Acopian launched their encapsulated wide input DC to DC Converter line of power supplies rated up to 60W. Wide-range DC inputs are set at 9-18 VDC, with output voltages ranging from 3.3 VDC to 48 VDC and up to 8A. Threaded mounting holes permit them to be mounted to a chassis, cabinet wall or bracket, they can be DIN RAIL mounted or they may be used on a test bench or tabletop. Touch safe terminal blocks provide easy connection without the need for sockets or soldering. Input/Output isolation prevents ground loops, and permits the use of inputs of either polarity; outputs of single output models may be used in either polarity and floated up to 500 volts above the input. Standard features include OVP internal protection, Input/Output isolation, short circuit protection and ability to operate in series. Optional output indicator (DC ON LED) and voltage adjust potentiometer are also available. Thermal protection and rugged encapsulated construction assure years of reliable service. These DC to DC converters are suitable for use in a broad range of applications including automotive, ATE, OEM, military and industrial/manufacturing applications.

Technologists Recognized with Industry Honors for Advancements in Semiconductor Materials
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Learn more:
dupont.com
  • People
  • 2021-09-21

DuPont Electronics & Industrial announced that three of its scientists in its Semiconductor Technologies business group have recently been honored with industry recognitions for their work in developing materials for advanced semiconductor fabrication. In July 2021, Emad Aqad, Ph.D., was recognized with the 2020-2021 Asian American Most Promising Engineer of the Year Award. The Asian American Engineer of the Year Award (AAEOY) program is a recognition established to honor the most distinguished US-based professionals for their leadership, technical achievements and public service. In August 2021, Alaaeddin Alsbaiee, Ph.D., was named to the 2021 Chemical & Engineering News' (C&EN) Talented 12.? The C&EN Talented 12 program recognizes early career scientists who are making their mark on industry and global challenges. Most recently, Jae Hwan Sim, Ph.D., was named an International Fellow of the Industrial & Engineering Chemistry (I&EC) Division of the American Chemical Society (ACS). The I&EC Division of ACS has a focus on helping individuals convert science into commercially relevant products. "These prestigious third-party recognitions are a true testament to the caliber of our talent globally and their wide-reaching industry impact," said Cathie Markham, vice president of R&D, DuPont Electronics & Industrial. "We are incredibly proud of the achievements of all three of these individuals, and the passionate spirit that they bring to our teams in driving the development of novel materials and continued enhancements for semiconductor fabrication."

Tiny Power Management IC for Wearables and Hearables
  • Product Release
  • 2021-09-21

The MAX77659 single-inductor multiple output (SIMO) power management IC (PMIC) with integrated switch-mode buck-boost charger from Analog Devices charges wearables, hearables and Internet of Things (IoT) devices faster and in less space than any other PMIC available today. The MAX77659 SIMO PMIC delivers over four hours of play time after a short, ten-minute charge, and uses a single inductor to power multiple rails, reducing the bill of materials (BOM) by 60 percent and shrinking total solution size by 50 percent. The MAX77659 SIMO PMIC integrates a switch-mode buck-boost charger and three independently programmable buck-boost regulators, all sharing a single inductor to minimize total solution size. The regulators extend battery life by operating at 91 percent efficiency during moderate to heavy load conditions while consuming only 5µA of quiescent current during light load conditions. The MAX77659 SIMO PMIC supports autonomous headroom control, which reduces heat dissipation by minimizing the voltage drop while providing enough headroom to regulate the charging current. "Analog Devices' SIMO product technology shrinks size and boosts performance in the smallest of hearable and wearable devices," said Roger Yeung, Executive Business Manager for the Battery Power Solutions Business Unit at Maxim Integrated, now part of Analog Devices. "The MAX77659 brings the 'on-the-go' lifestyle to the next level by minimizing plug-in time and maximizing play time. The MAX77659 PMIC frees up board real estate to pack in additional features such as expanded memory storage, location tracking and vital sensing demanded by today's portable consumer and medical devices."

eGaN FET for Telecom, Netcom, and Computing Solutions
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Learn more:
epc-co.com
  • Product Release
  • 2021-09-21

Efficient Power Conversion Corporation advances the performance capability of low voltage, off-the-shelf gallium nitride transistors with the introduction of the EPC2069 (1.6 m? typical, 40 V) eGaN FET. The EPC2069 is ideal for applications with demanding requirements for high power density performance including 48 V – 54 V input servers. Lower gate charges and zero reverse recovery losses enable high frequency operation of 1 MHz, and beyond, at high efficiency in a tiny 10.6 mm2 footprint for state-of-the-art power density. The EPC2069 can support 48V – 12V DC-DC solutions ranging from 500 W to 2 kW and exceed 98% efficiency. The use of eGaN devices in both the primary side and the secondary side are required to achieve maximum power density > 4000 W/in3. According to Alex Lidow, EPC's co-founder and CEO, "The EPC2069 is perfectly designed for the secondary side of the LLC DC-DC converter from 40 V – 60 V to 12 V, which is becoming very common for the new 48 V – 54 V input servers required for high density computing applications such as artificial intelligence and gaming. This 40-volt device offers both smaller size and reduced parasitics compared with previous-generation 40 V GaN FETs and at lower cost."

GaN Technology in Server Power Supplies for Data Centers
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Learn more:
ti.com
  • Industry News
  • 2021-09-20

Texas Instruments announced its gallium nitride (GaN) technology and C2000 real-time microcontrollers (MCUs) are being combined with Delta Electronics' power electronics expertise in the design of an enterprise server power-supply unit (PSU) featuring an 80% improvement in power density with 1% better efficiency - up to 99.2% - for data center applications, compared to enterprise server power supplies using a traditional architecture. A 1% improvement equals 1-megawatt (or 800 households) total cost of ownership savings per data center, according to Energy Innovation. Delta Electronics chose TI due to its decade-long investment in GaN technology as well as its real-time control solution with C2000 MCUs. TI uses innovative semiconductor manufacturing processes to manufacture GaN-on-silicon technology and integrated circuits (ICs) to help companies such as Delta Electronics create differentiated applications to more efficiently power data centers around the world. "Our passion at TI is to create a better world by making electronics more affordable through semiconductors, and our GaN technology enables a whole new world of higher efficiency and smaller, more reliable solutions," said Steve Lambouses, vice president for High Voltage Power at TI. "In addition to technology investments, TI's investments in internal manufacturing will allow new technologies like GaN to scale quickly and support customers like Delta."  

Metal Enclosed AC/DC Power Supplies
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Learn more:
tracopower.com
  • Product Release
  • 2021-09-20

The Traco TXLN line comprises a series of metal enclosed AC/DC power supplies ranging from 18 to 960 Watt (split into 12 different power levels) and is designed for a wide range of industrial applications. The TXLN is an active replacement of the older TXL line and is built on the same design principals to make the transition to the TXLN series as easy as possible. The model selection includes single, dual as well as triple output solutions to cover different applications requirements. With a low-profile metal case and screw terminal block connection, they are easy to install in any equipment. Up to the 200 Watt models the TXLN power supplies are completely convection cooled and from 320 Watt and above they come with an internal fan. Above 100 Watt an active PFC (>0.95) function is added to the standard feature pool. All models in the TXLN line have universal input and comply with the latest industrial standard IEC/EN/UL 62368-1, European EMC standards and the Low Voltage Directive (LVD).

Silicone-Free Liquid Thermal Gap Filler for High Voltage Applications
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Learn more:
henkel.com
  • Product Release
  • 2021-09-20

Henkel announced the commercial launch of Bergquist Gap Filler TGF 3000SF, the latest in the company's line of silicone-free thermal interface materials (TIMs). With significantly higher thermal conductivity than any previous silicone-free liquid formulation in its portfolio and delivering impressive dielectric strength, Henkel's material extends wider market opportunities and production flexibility to manufacturing operations that require avoidance of silicone outgassing. A liquid, two-part, 3.0 W/m-K silicone-free TIM, Bergquist Gap Filler TGF 3000SF offers high-reliability performance for a variety of applications where silicone sensitivity is a concern. These include industrial automation systems; power conversion technologies such as motor drives and power supplies; automotive infrastructure EV charging devices; and, computers and peripherals, to name a few. With high dielectric strength at >10 kV/mm and good volume resistivity, Bergquist Gap Filler TGF 3000SF is suitable for higher voltage applications, while also providing high-reliability thermal performance at operating temperatures ranging from -40° C to 100° C. Exhibiting extremely low assembly stress, the liquid TIM is ideal for use with sensitive components and/or printed circuit boards with intricate architectures. Productivity is also a central attribute of Bergquist Gap Filler TGF 3000SF. The silicone-free liquid TIM is conducive to mass production environments where fast dispensing is necessary to achieve high UPH objectives; it dispenses at a rate of 1.5 cc/sec. With a 1:1 mixing ratio, the material can be stored at room temperature and is easily processed.

Configurable Digital Gate Driver for Silicon Carbide MOSFETs
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Learn more:
microchip.com
  • Product Release
  • 2021-09-20

To complement its broad portfolio of silicon carbide MOSFET discrete and module products, Microchip Technology announced a 1200V production-ready digital gate driver, providing system developers with multiple levels of control and protection for safe, reliable operation and qualified to stringent transportation requirements. For designers of silicon carbide-based power conversion equipment, Microchip's AgileSwitch 2ASC-12A2HP 1200V dual-channel digital gate driver with its Augmented Switching  technology is production qualified and fully configurable. To ensure reliable, safe operation, the 2ASC-12A2HP gate driver provides multiple levels of control and a higher level of protection for silicon carbide MOSFET-based power systems. When compared to conventional gate drivers, key performance attributes of the AgileSwitch gate driver products include the ability to dampen drain-source voltage (Vds) overshoots by up to 80% and slash switching losses by as much as 50%. The 2ASC-12A2HP digital gate driver can source/sink up to 10A of peak current and includes an isolated DC/DC converter with low capacitance isolation barrier for pulse width modulation signals and fault feedback. Microchip's 2ASC-12A2HP gate driver is compatible with the company's latest release of the Intelligent Configuration Tool (ICT). This interface allows users to configure gate driver parameters including the gate switching profiles, system critical monitors and controller interface settings. The result is a gate driver that is tailored to their applications without having to change hardware, helping to speed development time from evaluation through production and enabling designers to change control parameters during the design process. The ICT, which is a free-of-charge download, can save designers approximately three to six months of development time on new designs.                                                     

MEMS Capacitive Accelerometer Chips
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Learn more:
silicodesigns.com
  • Product Release
  • 2021-09-19

Silicon Designs Model 1521 Series industrial-grade, high-stability OEM surface mount accelerometer chips is offered in eight standard ranges from ±2 g to ±400 g. Each features a ±4V differential output and is offered with a choice of either a 20-pin LCC or J-lead surface mount package, both of which are Nitrogen gas-damped, hermetically sealed and RoHS compliant. The distinguishing feature of the Model 1521 Series is its integration of a MEMS capacitive sense element, together with both an amplifier and internal temperature sensor. The MEMS capacitive sense element of the Model 1521 Series provides long-term measurement stability (+5 VDC, 5 mA power typical), reliable operation, durability, 5,000 g shock survivability and zero signal degradation. The Series is designed for zero-to-medium frequency testing and instrumentation applications requiring extremely low noise (with 7 µg/vHz typical for 2 g full-scale versions) and long-term stability. As such, they can respond to frequencies from zero (DC) to 2000+ Hz and can reliably perform over a standard operating temperature range of -55°C to +125°C.

PCIM Asia 2021: Successful Conclusion in Shenzhen
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Learn more:
pcimasia-expo.cn
  • Event News
  • 2021-09-17

PCIM Asia was held successfully from 9 – 11 September at the Shenzhen World Exhibition & Convention Center, the change in venue and location marking a new chapter in the fair's history. Born from the highly successful PCIM Europe trade fair first held in 1979, over the course of 20 years the fair has grown to become the leading event for power electronics in Asia. Now in its new home in Shenzhen, the oft-dubbed 'Silicon Valley' of China, benefiting from its location in the Greater Bay Area, proximity to international markets serviced by Hong Kong and the wealth of technical expertise and talent present within the city, PCIM Asia looks well placed to drive the industry forward in the decades to come. Once again PCIM Asia featured a range of thematic zones that explored key areas of the development of power electronics, covering power semiconductor components and modules, electrical devices, passive components and thermal management to test and measurement among other areas. These zones were, namely, the E-mobility Pavilion, Energy Storage Pavilion, Poster Session Area and the University Zone.

Opening of Chip Factory for Power Electronics on 300-Millimeter Thin Wafers
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Learn more:
infineon.com
  • Industry News
  • 2021-09-17

Infineon Technologies officially opened its high-tech chip factory for power electronics on 300-millimeter thin wafers at its Villach site in Austria under the motto "Ready for Mission Future." At 1.6 billion euros, the investment made by the semiconductor group represents one of the largest such projects in the microelectronics sector in Europe. The Villach site is one of the world's most modern fabs and was opened by Infineon CEO Reinhard Ploss, Infineon Austria CEO Sabine Herlitschka along with EU Commissioner Thierry Breton and Austrian Chancellor Sebastian Kurz. Infineon set the stage for long-term, profitable growth based on energy efficiency and CO 2 reduction at an early stage and announced the construction of the chip factory for power electronics ("energy-saving chips") in 2018. "The new fab is a milestone for Infineon, and its opening is very good news for our customers," Ploss said. "The timing to create new capacity in Europe could not be better, given the growing global demand for power semiconductors. The last few months have clearly shown how essential microelectronics are in virtually every area of life. Given the accelerated pace of digitalization and electrification, we expect demand for power semiconductors to continue to grow in the coming years. The additional capacities will help us serve our customers worldwide even better, including long term."

High-Temperature, Automotive-Grade Polymer Chip Capacitors
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Learn more:
kyocera-avx.com
  • Product Release
  • 2021-09-16

AVX Corporation released the TCO Series high-temperature, automotive-grade polymer chip capacitors, which are rated for operating temperatures up to 150°C at category voltage and meet AEC-Q200 Stress Test Qualification for Passive Components requirements, which ensure stable performance at 85°C, 85% relative humidity, and rated voltage for up to 1,000 hours. Based on AVX's field-proven TCQ Series automotive polymer capacitors, the new TCO Series chip capacitors are manufactured in an IATF-16949-certified facility and feature robust J-lead constructions comprised of tantalum anodes, tantalum pentoxide (Ta2O5) dielectrics, and conductive polymer electrodes that exhibit a benign failure mode under recommended use conditions. The series also exhibits low DCL (0.1CV) and basic reliability of 1% per 1,000 hours at 85°C and rated voltage with 0.1O/V series impedance and 60% confidence, and is ideally suited for use in high-temperature, low- and medium-power automotive, industrial, and telecommunications applications. TCO Series capacitors are currently available as D-case (EIA Metric 7343-31) components rated MSL 3 per J-STD-020 and for 10µF ±20% tolerance, 50VDC at 105°C, a maximum of 50µA DCL, 150mO maximum ESR at 100kHz, and operating temperatures extending from -55°C to +150°C, but several other codes are actively in development.

Inductor Series for Medical Imaging and Other Magnetic-Sensitive Applications
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Learn more:
gowanda.com
  • Product Release
  • 2021-09-16

Gowanda Electronics announces the introduction of a non-magnetic RF thru-hole (leaded) inductor series – 28MG. This series is ideal for use in medical imaging equipment and other applications where magnetic materials must be avoided. The series was designed to address the market need for non-magnetic inductors that could achieve inductance values of up to 18 µH for use in Magnetic Resonance Imaging (MRI) equipment, specific types of X-ray equipment and other applications where the presence of magnetic materials could compromise system performance. This includes applications in telecommunications, security systems, instrumentation, laboratory analysis equipment, aviation equipment, navigation equipment and electronic test equipment. The performance range provided by the 60 discrete parts within the 28MG series includes Inductance from 1.2 µH to 18 µH, DCR Ohms from 0.079 to 4.15 and Current Rating mA DC from 315 to 2400. All of Gowanda's non-magnetic surface mount and thru-hole inductors, including this new 28MG series, provide relative permeability of = 1.00003. The operating temperature range for the 28MG series is -55°C to +125°C. The 28MG inductors are epoxy encapsulated for environmental protection and superior strength to withstand all types of reflow soldering. Standard terminations are SnPb; RoHS-compliant terminations are provided when "LF" is specified.

Switched Capacitor Intermediate Bus Converter for 48 V Data Center Applications
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Learn more:
infineon.com
  • Product Release
  • 2021-09-16

Flex Power Modules introduces the BMR310, a non-isolated switched capacitor intermediate bus converter (IBC) which provides high power density for data centers, thus improving board space utilization and freeing space for other components. Built on the proprietary Zero voltage switching Switched capacitor Converter (ZSC) technology of Infineon Technologies, the BMR310 achieves efficiency of over 98 percent at half load and can deliver power up to 875 W continuous in a compact package. It operates over an input voltage range of 40 V to 60 V, and delivers an unregulated output voltage of 10 V to 15 V. For data centers and high-performance computing (HPC) applications, there is a growing trend to move away from 12 V and adopt 48 V power distribution to reduce distribution currents and power losses. To meet this increasing demand, the Infineon ZSC delivers the highest efficiency and power density for applications using 48 V to generate an intermediate bus voltage. This is achieved through capacitive energy transfer with soft switching of the power MOSFETs, and therefore enables an easy and low-risk migration path for legacy 12 V systems to a 48 V infrastructure at significantly reduced total cost of ownership (TCO). The BMR310 is mounted horizontally with a height profile of 10.3 mm, making it suitable for systems with limited space due to large heatsinks or cold plates. It measures 58.4 mm x 25.0 mm x 10.3 mm (2.3 x 0.98 x 0.41 in). The current mounting option is base-plated but an open frame will be available with future models. To maximize operating lifespan, the BMR310 includes over-voltage, under-voltage, over-current and over-temperature protection function.

ICs for Automotive Satellite Camera Modules
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Learn more:
rohm.com
  • Product Release
  • 2021-09-15

ROHM developed SerDes ICs (BU18xMxx-C series) and a PMIC (BD86852MUF-C) ideal for vehicle satellite camera modules for Advanced Driver Assistance Systems (ADAS). The products not only solve issues concerning the miniaturization and low power consumption of modules, but also provide features such as low electromagnetic noise (EMI) that reduces development time. Both products utilize a spread spectrum function to reduce EMI. This also simplifies EMI countermeasures, which often require significant man-hours during the design of automotive applications. The BU18xMxx-C SerDes IC optimizes the transmission rate based on video resolution, making it possible to reduce power consumption by 27% over general products. At the same time, the built-in spread spectrum function reduces the EMI peak by 20dB, while an integrated video sticking detection function improves the reliability of the entire ADAS system by detecting frozen images. The BD86852MUF-C PMIC (Power Management IC) for cameras is designed to optimally manage the power supply systems of CMOS image sensors from all major manufacturers. This allows voltage settings and sequence control to be performed with a single IC, reducing mounting area by 41% and contributing to the miniaturization of vehicle camera modules. In addition, a camera PMIC heat concentration distribution circuit can be configured to lower power consumption by achieving a high conversion efficiency of 78.6% that suppresses heat generation.

Isolation Transformer Series Provides Isolation from High Voltage Hazards
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Learn more:
bourns.com
  • Product Release
  • 2021-09-15

Bourns introduced its Model PAD00x-T764 Isolation Transformer Series. These transformers feature functional isolation and a low 0.4 mm profile form factor to simplify isolated power and serial communication signal integrity in CAN, RS-485, RS-422, RS-232, SPI, I2C, and lower power LAN-based applications. The Model PAD00x-T763 Series is ideal for industrial automation, embedded solutions, AC motor drives, system integration, communication PHYs, smart metering, and many other applications requiring low DC power. Bourns Model PAD00x-T764 series was developed for ease of use in maintaining proper communication and necessary isolation between systems. The 3.1 kVAC withstanding voltage provides an isolation barrier from high voltage hazards, such as high voltage batteries. Design details include construction with a ferrite toroid core to help ensure a high coupling factor and heightened efficiency. EMI performance is enhanced in the winding of the transformer, enabling reduced emissions. The PAD00x-T764 series is compatible with Texas Instruments SN6501 and SN6506B, Maxim MAX253 and MAX845, Analog Devices ADM2485, and similar transformer drivers. The series offers 3.3 to 5 V input, industry standard 3.3 to 10 V output, and up to 250 mA output with various turns ratios. The Bourns Magnetics product line can also support most modification and customization requests for this push-pull transformer series.

Power Modules Replace Linear Regulators
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Learn more:
we-online.com
  • Product Release
  • 2021-09-15

Würth Elektronik extends its MagI³C-FDSM-36-V family with a 12 V output voltage version. The range of MagI³C-FDSM power modules with 36 V input voltage has been expanded to include a version with 12 V output voltage. The power module in a SIP-3 package represents a cost-effective solution to meet the requirements for the real-world voltage transients of a 24 V industrial power architecture. The module operates from 16 to 36 VIN and generates a fixed output voltage of 12 V with current up to 1 A. The FDSM series MagI³C power modules are fully integrated DC/DC voltage converters with a fixed output voltage. The modules incorporate all of the components needed, like the controller, inductor and input/output capacitors, with the added benefit of thermal overload and short circuit protection. Since there are no external components required for operation, there is essentially no circuit design needed. This reduces development costs and makes it possible to get to market quickly with new applications. This power module has around 95% efficiency while the linear regulator will have an efficiency of 50%. The standard THT housing for easy mounting is pin-compatible with L78x linear controllers. Pre-compliance testing has shown both the radiated and conducted emissions on an evaluation board are below the limits of EMC standards EN55032/CISPR32 Class B.

Automotive Semiconductor Industry: The Wind of Change
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Learn more:
yole.fr
  • Industry News
  • 2021-09-15

"The value of semiconductors, at the chip level, in cars will grow from US$34.4 billion in 2020 to US$78.5 billion in 2026, a 14.75% CAGR." asserts Eric Mounier, PhD, Director of Market Research at Yole Développement (Yole). He adds: "The largest growth will be in EVs due to the major shift to electrification." The market research and strategy consulting company investigates disruptive semiconductor technologies for the automotive sector in depth. Its aim is to point out the latest innovations and underline the business opportunities. These investigations have been developed with Yole's partner, System Plus Consulting. According to Wilfried Théron, Electronic System, Department Director & Quality Manager at System Plus Consulting: "System Plus Consulting's Teardowns uncover innovative design features and new semiconductor components to guide enterprises toward more streamlined solutions in future designs". They provide clients unmatched intelligence into 4 automotive tracks (ADAS, Electrification, Infotainment and Telematics). In addition, Yole released, the 'Automotive Semiconductor Trends 2021' report to provide an in-depth understanding of the changing automotive industry ecosystem and supply chain players. Including market trends and forecasts, take away and outlook, this study proposes key technical insights and analyses about future technology trends and challenges. 

PCNS: The Next Decade on Passive Components will be about Reliability, Sustainability & Materials
  • Event News
  • 2021-09-15

Attendees of the 3rd PCNS Passive Components Networking Symposium that took place on 7-10th September 2021 in Milano, Italy discussed the latest news and trends in passive components. The main theme of the conference was RELIABILITY & SUSTAINABILITY of PASSIVE COMPONENTS that also covered MATERIALS development and PROCESSES. 3rd PCNS was attended by 50 live attendees and 25 virtual attendees from 16 countries including 12 European Countries, Israel, USA and Korea. Theme of the conference "Reliability and Sustainability of Passive Components" was elaborated in workshop on life cycle assessment and addressed by keynotes, invited papers and hot panel discussion. Twenty four full technical papers were presented during two and half PCNS event days covering wide range of passive components including capacitors, resistors, inductors, integrated passives or passive sensors.

Halogen-Free Flame-Retardant Polyamide
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Learn more:
asahikasei.group
  • Product Release
  • 2021-09-14

Asahi Kasei is introducing the halogen and red-phos-phorous free flame retardant Polyamide 66 LEONA SN to the European market. This semi-aromatic material combines high levels of safety, surface quality and laser printability. The LEONA SN grades are certified with the V-0 flame retardancy at wall thicknesses of 0.75mm according to the UL standard, and achieve 600V, the highest value on the Comparative Tracking Index (CTI). In addition to the flame-retardant and creep-resistant properties, the material features a superior surface quality. This is achieved without additional treatment and coating and even with a glass-fiber content of up to 50%. Another characteristic of this material is its high retention rate of physical properties in a conditioned state. While comparable halogen-free PA66 materials show a significant decline in properties, LEONA SN maintains a high level of tensile strength and flexural modulus also after moisture absorption. This opens up new possibilities for applications in environments, where the use of standard FR PA66 can become an issue. Furthermore, LEONA SN provides an excellent laser printability and allows for a clearer surface marking than general materials with red phosphorus in high speed machining of 1000 mm/sec, con-tributing to an increased speed in production.

EMC Community Meets Again
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Learn more:
emv.mesago.com
  • Event News
  • 2021-09-14

From 15 – 17 March 2022, the EMC community will have the opportunity to experience the premiere originally planned for 2020 at the new location in Cologne. "The feedback on Mesago Messe Frankfurt's digital offerings for the EMV was very positive, nevertheless the anticipation for the next face-to-face event and the desire for chance meetings and personal exchange is immense," commented Anthula Parashoudi, Vice President, Mesago Messe Frankfurt. With still six months before the event, the EMV team at Mesago Messe Frankfurt has already been able to allocate 60 percent of the booth space. Around 50 exhibitors have already confirmed their participation in the event in Cologne, including well-known representatives of the EMC industry such as Rohde & Schwarz, Frankonia, and AR Europe. Interested representatives in the EMC industry can still register as an exhibitor at the trade fair in Cologne. More information, such as the exhibitor list and exhibitor registration, is available at e-emc.com.

Semiconductor Capacity Agreement
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Learn more:
gan-systems.com
  • Industry News
  • 2021-09-14

GaN Systems announced the signing of a comprehensive Capacity Agreement with BMW Group for GaN Systems' high-performance, automotive-grade GaN power transistors, which increase the efficiency and power density of critical applications in electric vehicles. GaN power semiconductors are a key ingredient to achieve the small size, lightweight, and high efficiency required in the next generation of high-performance electric vehicles. Under the terms of the agreement, GaN Systems will provide capacity for multiple applications in series production. The guaranteed volumes by GaN Systems are a key building block for reliability in the supply chain for automotive players like BMW. "Electric vehicles represent the future of transportation, and we are delighted to continue to support BMW with our design and production capacity," stated Jim Witham, CEO of GaN Systems. "This multi-$100M agreement demonstrates BMW's commitment to innovation and sustainability." BMW's relationship with GaN Systems began more than four years ago when BMW's engineers found that small size, lightweight, low-cost onboard chargers, DC/DC converters, and traction inverters were enabled by GaN. This led to investment from BMW's venture capital firm, BMW I Ventures, to support and accelerate the automotive qualification of the GaN technology. "The close collaboration among GaN Systems and BMW's engineers has helped to solidify the technology for automotive series production, resulting in the most advanced GaN power transistors in the marketplace today," said Kasper Sage, managing partner BMW i Ventures. "As electric vehicles become more prominent, the demand for critical semiconductor components is only going to increase, thereby making strategic partnerships with suppliers like GaN Systems even more important." 

Sensing and Control Solutions Make Energy Systems Safer
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Learn more:
sensata.com
  • Product Release
  • 2021-09-09

Sensata Technologies introduces an i-BMS Battery Management System for Electrified Applications up to 60V. The brain behind the battery for a diverse range of electric vehicles, the BMS is the intelligent component that monitors and manages lithium-ion battery packs. The i-BMS Battery Management System from Lithium Balance, acquired by Sensata earlier in the year, is a cell chemistry agnostic, compact, integrated BMS developed for the cost-optimized mass-production of applications up to 60V, such as 2-, and 3-wheelers, automated guided vehicles (AGVs), and robotics. The i-BMS is a long-term solution for customers who require the highest levels of safety, performance and measurement accuracy. The solution features key components that are ASIL C Safety rated and self-test capability for safety critical measurement circuits. While measuring only 65 x 200 mm, the i-BMS is equipped with everything required to manage and maintain a battery system without the need for any external components. This includes a built-in pre-charge circuit, on-board current measurement, MOSFET power switches for battery disconnect, and a DC/DC power supply. The i-BMS' software design features parallel pack and hot swap capability, while advanced SoX algorithms ensure high precision. Using the BMS Creator configuration software, the i-BMS allows the battery designer to create a unique battery by defining application-specific BMS parameters and safety strategies, optimizing battery performance and life.

Single Plug-and-Play Gate Drivers for "New Dual" Modules
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Learn more:
power.com
  • Product Release
  • 2021-09-08

Power Integrations announced SCALE-iFlex Single gate-drivers for the popular "New Dual" 100 mm x 140 mm IGBT modules. The compact drivers support modules up to 3.3 kV and are available now for design-in. The SCALE-iFlex Single gate-drivers are ideal for light-rail, renewable energy generation and other high-reliability applications that demand compact, rugged driver solutions. Thorsten Schmidt, product marketing manager at Power Integrations commented: "SCALE-iFlex Single gate-drivers fit the outline of the latest standard IGBT power modules including the Mitsubishi LV100/HV100, Infineon xHP2 and xHP3, ABB LinPak, Hitachi nHPD² and other similar products." SCALE-iFlex Single gate-drivers use Power Integrations' SCALE-2 ASIC technology which dramatically reduces component count compared to conventional products. The ASIC also provides Advanced Active Clamping (AAC) over-voltage protection during normal operation, a substantial improvement over simple soft shut down, which adds extra protection in case of short-circuit during turn-on. Devices are conformally coated and feature reinforced isolation. Isolated housings ensure isolation between modules when they are mounted side-by-side. Devices are pre-qualified according to railway standards IEC 61373 – Class 1B (shock & vibration) and IEC 61000-4-x (EMC tests) and IEC 60068-2-x (serial environmental tests). Burn-in is optionally available.

Plug-and-Play Gate Driver Improves IGBT Module Performance
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Learn more:
power.com
  • Product Release
  • 2021-09-08

Power Integrations announced its plug-and-play SCALE-iFlex LT dual gate-drivers. The drivers improve the performance of multiple parallel EconoDUAL modules by 20%, allowing users to eliminate one of every six modules from power inverters and converter stacks. In addition to saving the cost of the driver and module, this reduces control complexity and costs related to modules, wiring, hardware, and heatsinking. SCALE-iFlex LT targets multiple applications in renewable energy generation and storage, and is particularly applicable to offshore wind turbines in the 3 to 5 MW range. Thorsten Schmidt, product marketing manager at Power Integrations commented: "Dynamic and static current sharing is critical for robust operation of modules arranged in parallel. For the same power output, systems using SCALE-iFlex LT require just five parallel modules whereas competitive approaches need six. This substantial saving of cost and complexity is achieved by guaranteeing less than 20 ns of variance in turn-on and turn-off commands between modules and less than 20 A of variance between modules when conducting the rated 600 A. This allows the modules to operate reliably without current derating, which is obligatory with less advanced driver solutions." Up to six EconoDUAL 3, or equivalent, power modules can be paralleled from the same Isolated Master Control (IMC) unit which has a more compact outline than conventional products. The Module Adapted Gate drivers (MAGs), which fit the footprint of the EconoDUAL module, each featuring two SCALE-2 ASICs – one per channel – to optimize symmetrical paralleling, efficiency and protection.

BLDC Motor Drivers with Code-Free, Sensorless FOC and Trapezoidal Control
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Learn more:
ti.com
  • Product Release
  • 2021-09-08

Texas Instruments introduced 70-W brushless DC (BLDC) motor drivers to provide code-free, sensorless trapezoidal and field-oriented control (FOC). The devices enable engineers to spin a BLDC motor in less than 10 minutes – eliminating months of design time for engineers designing a wide variety of industrial systems such as major and small home appliances, and medical applications such as ventilators and continuous positive airway pressure (CPAP) machines. With integrated real-time control and up to 18 discrete components – including power metal-oxide semiconductor field-effect transistors (MOSFETs) – the devices also speed system response time while reducing board space by as much as 70%, all while providing best-in-class acoustic performance. The MCF8316A and MCT8316A BLDC motor drivers include a set of commutation control algorithms that eliminate the need to develop, maintain and qualify motor-control software, which eliminates months of design time. The algorithms, along with a high level of integration, enable these motor drivers to manage critical functions such as motor fault detection, while implementing protection mechanisms to increase system reliability. Because these motor drivers integrate sensorless technology to determine rotor position, they eliminate the need for external Hall sensors, which reduces system cost and increases reliability. Additionally, the MCF8316A sensorless FOC motor driver intelligently extracts motor parameters, enabling designers to quickly tune a motor while delivering consistent system performance regardless of motor manufacturing variations. The MCT8316A sensorless trapezoidal control motor driver enables designers to tune a motor using only five hardware pins, simplifying systems by eliminating the need for a microcontroller interface.

Awarded for Global Sustainability for Reducing Battery Use and E-Waste
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Learn more:
powercastco.com
  • Industry News
  • 2021-09-07

The Business Intelligence Group awarded Powercast with its Sustainability Initiative of the Year in the 2021 Sustainability Awards program. These awards honor those people, teams and organizations who have made sustainability an integral part of their business practice or overall mission. Powercast aims to make one-time-use batteries obsolete by working with electronic manufacturers to recharge batteries or replace them altogether with its over-the-air RF (radio frequency) wireless power technology. Many of today's small electronic devices can be designed so they're environmentally friendly, either with rechargeable batteries that can accept an RF wireless charge, or with no batteries that can be directly powered by RF power. A Powerharvester chip is embedded in devices to receive RF energy sent over the air from either a dedicated Powercast transmitter, or from industry-standard RFID readers. The Powerharvester then converts the RF to direct current (DC) to top off the battery or power the device. Powercast's technology touches millions of users across 15+ industries, including automotive, consumer electronics, IoT, entertainment, retail, RFID, and sensors. The company's collaborative approach and expertise in all aspects of product design, from vision through prototyping and commercialization, has resulted in dozens of applications and millions of units shipped. "We're already partnering with many manufacturers to create wirelessly rechargeable devices that keep batteries out of landfills," said Charles Goetz, CEO of Powercast. "But, we strive for the day where all devices will charge in the background when consumers enter their home, office or car, where they'll never have to throw batteries away."

High-Volume Micro-Transfer Printing Capabilities
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Learn more:
xfab.com
  • Industry News
  • 2021-09-07

X-FAB Silicon Foundries is now able to support volume heterogeneous integration via Micro-Transfer Printing (MTP), thanks to a licensing agreement that has just been secured with X-Celeprint. This will mean that a diverse range of semiconductor technologies may be combined together, each being optimized for particular functional requirements. These will include SOI, GaN, GaAs and InP, as well as MEMS. In order to become the first foundry to provide customers with MTP-based heterogeneous integration, X-FAB has made substantial investments over the last two years. It has also established new optimized workflows and cleanroom protocols. This will allow customers to work with the foundry on heterogeneous design projects - benefitting from a low-risk and fully scalable business model that offers a clear migration to volume production. X-Celeprint's proprietary massively-parallel pick-and-place MTP technology stacks and fans-out ultra-thin dies based on different process nodes, technologies, and wafer sizes. It results in the formation of virtually monolithic 3D stacked ICs, which have enhanced performance, greater power efficiency, and take up less space. Furthermore, all this can be achieved at an accelerated rate, thereby significantly shortening time-to-market. "By licensing X-Celeprint's disruptive MTP technology, we are uniquely positioned in our ability to facilitate the incorporation of numerous different semiconductor technologies. X-FAB customers will be able to utilize a technology that no other foundry is offering, and existing X-Celeprint customers may now tap into capacity levels that will easily meet their future demands," Volker Herbig, VP of X-FAB's MEMS business unit, explains.

Strategic Partnership Focused on SiC Power Devices
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Learn more:
rohm.com
  • Industry News
  • 2021-09-07

The global semiconductor manufacturer ROHM, together with Geely Automobile Group have entered into a strategic partnership to develop advanced technologies in the automotive field. Both companies have been collaborating on a variety of automotive applications since 2018, when they first agreed to carry out technical exchange. This partnership is expected to further promote cooperation and accelerate innovation for automotive applications. Geely is working to extend the cruising range of electric vehicles while reducing battery costs and shortening charge times by developing high efficiency traction inverters and onboard charging systems that adopt ROHM's advanced power solutions centered on SiC power devices. At the same time, Geely is committed to improving user experience through the development of high performance ADAS and intelligent cockpit systems using a wide range of products and solutions, including communication ICs and discrete devices. As a first step, traction inverters equipped with ROHM's SiC power devices are being integrated in electric vehicle platforms currently being developed by Geely. Through this partnership, ROHM and Geely will contribute to sustainability by promoting the development of low carbon technologies in the automotive industry and offering solutions for achieving greater safety and security in our increasingly mobility society.


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EPE'22 ECCE Europe: 5 – 9 September 2022, Hannover, GermanyThe European Power Electronics and Drives Associat...9554Event NewsEPE'22 ECCE Europe: 5 – 9 September 2022, Hannover, GermanyThe European Power Electronics and Drives Association, EPE-Association in short, in collaboration with its co-sponsor IEEE-PELS, is proud to announce that EPE'22 ECCE Europe will take place in the Hannover Congress Center from 5 to 9 September 2022. In addition to the regular topics for paper submission, EPE'22 ECCE Europe at Hannover will highlight the following Focus Topics, not only in dedicated lecture and dialogue sessions, but also in keynotes, the exhibition, panel discussions, tutorials and technical visits. Paper submissions in line with these Focus Topics are highly encouraged.<br>Technology Focus Topics: New Power Electronic Devices / Integration and Adverse Effects of WBG Devices / Batteries in Power Electronics<br>Application Focus Topics: Electrification of On- and Off-Road Vehicles / Electrification of Aircraft / Electricity and Hydrogen based Energy Systems<br><br>The final synopsis submission deadline will be: 8 December 202111.11.2021 11:11:00Novnews_2021-11-15_25.png\images\news_2021-11-15_25.pnghttp://www.epe2022.com/epe2022.com
eGaN FETs for eBikes, eMotion, Drones, and RobotsThe EPC9145 demonstration board is a 3-phase BLDC ...9555Product ReleaseeGaN FETs for eBikes, eMotion, Drones, and RobotsThe EPC9145 demonstration board is a 3-phase BLDC motor drive inverter board featuring the 2.2 mO maximum RDS(on), 80 V maximum device voltage EPC2206 eGaN FET. This board is tailored to ebikes, eMotion, drones, and robot motor applications. With 48 V bus voltage, it can deliver 15 ARMS steady state at 50°C temperature rise in natural air convection and can reach 20 ARMS (28 APEAK) with a heatsink attached. The EPC9145 has been tested up to 100 kHz, 60 V input, and 50 APEAK. The EPC9145 contains all the necessary critical function circuits to support a complete motor drive inverter and the dimensions of the board are only 130 mm x 100 mm (including connector). The EPC9145 also features the ST Microelectronics, STDRIVEG600, smart motor drive GaN half-bridge driver. GaN FETs switch fast with zero reverse recovery. This feature enables higher switching frequency in the 100 kHz range to eliminate the need for electrolytic capacitors and to reduce the motor losses. Additionally, the deadtime can be reduced to approximately 20 ns to allow higher torque per ampere. Overall, GaN devices improve inverter and motor system efficiency and reduce size and weight by integrating the inverter inside the motor.09.11.2021 09:30:00Novnews_2021-11-15_15.jpg\images\news_2021-11-15_15.jpghttps://epc-co.com/epc/EventsandNews/News/ArtMID/1627/ArticleID/3016/Low-Cost-Motors-Match-Premium-Motor-Drive-Performance-with-eGaN-FETs-for-eBikes-eMotion-Drones-and-Robots-.aspxepc-co.com
Consortium to Create European Supply Chain for Silicon Carbide SemiconductorsMany of today's key projects focus on the same obj...9535Industry NewsConsortium to Create European Supply Chain for Silicon Carbide SemiconductorsMany of today's key projects focus on the same objective: to improve energy efficiency and thereby protect the environment. These projects are typically in areas such as electromobility, renewable energy, and edge and cloud computing – including the requisite data centers. Experts agree that silicon carbide (SiC) semiconductors and the electronic components containing them will ensure the most efficient use of the electricity at our disposal. The object of the publicly funded "Transform" project (trusted European SiC value chain for a greener economy) is to establish a resilient European supply chain for this technology, ranging from wafers and other basic materials right up to finished SiC power semiconductor devices and power electronic applications. In a consortium led by Bosch, a total of 34 companies, universities, and research institutes from seven European countries have joined forces to work toward this goal. "The aim of the Transform project is to secure a leading role for Europe in new technologies based on silicon carbide," says Jens Fabrowsky, who holds the position of executive vice-president in the Bosch Automotive Electronics division. Scheduled to run until 2024, the publicly funded project is focusing on five use cases in the automotive, industry, renewable energy, and agriculture sectors.09.11.2021 08:00:00Novnews_2021-11-15_3.jpg\images\news_2021-11-15_3.jpghttps://www.bosch-presse.de/pressportal/de/en/from-wafers-to-power-electronic-applications-new-consortium-to-create-european-supply-chain-for-silicon-carbide-semiconductors-234624.htmlbosch-presse.de
Expanding Wide Bandgap Semiconductor OfferingNexperia announced its entry into the high-power S...9534Industry NewsExpanding Wide Bandgap Semiconductor OfferingNexperia announced its entry into the high-power Silicon Carbide (SiC) diodes market with the introduction of 650 V, 10 A SiC Schottky diodes. This is a strategic move for Nexperia, already a trusted supplier of efficient power Gallium Nitride (GaN) FETs, to expand its high-voltage wide bandgap semiconductor device offering. In an increasingly energy-conscious world, there is a burgeoning demand for high power applications with superior efficiency and power-density. In this regard, Silicon is fast approaching its physical limits. According to Mark Roeloffzen, General Manager of the Bipolar Discretes Group at Nexperia "Wide bandgap semiconductors like Gallium Nitride and Silicon Carbide are now well placed to meet the stringent needs of high-volume applications, bringing the promise of higher efficiency, greater power density, lower system cost and reduced operating costs for original equipment manufacturers. Nexperia's diverse portfolio of SiC diodes will bring greater choice and availability to this market." Nexperia's first SiC Schottky diode is an industrial-grade device with 650 V repetitive peak reverse voltage (VRRM) and 10 A continuous forward current (IF), designed to combine ultra-high performance and high efficiency with low energy loss in power conversion applications. Providing the added benefit of a high-voltage compliant real 2-pin (R2P) package with higher creepage distance, it is available in a choice of surface mount (DPAK R2P and D2PAK R2P) or through-hole (TO-220-2, TO-247-2) devices.08.11.2021 07:00:00Novnews_2021-11-15_2.jpg\images\news_2021-11-15_2.jpghttps://www.nexperia.com/about/news-events/press-releases/nexperia-expands-its-wide-bandgap-semiconductor-offering-with-new-family-of-high-performance-silicon-carbide-sic-diodes.htmlnexperia.com
Real-Time Autonomous Sensing and ProtectionNavitas Semiconductor has announced the launch of ...9543Product ReleaseReal-Time Autonomous Sensing and ProtectionNavitas Semiconductor has announced the launch of GaNFast power ICs with GaNSense technology. GaNSense technology integrates critical, real-time, autonomous sensing and protection circuits which further improves Navitas' industry-leading reliability and robustness, while increasing the energy savings and fast-charging benefits of Navitas' GaN IC technology. Gallium nitride (GaN) is a next-generation semiconductor technology that runs up to 20x faster than legacy silicon and enables up to 3x more power and 3x faster charging in half the size and weight. Navitas' GaNFast power ICs integrate GaN power and drive plus protection and control to deliver simple, small, fast and efficient performance. GaNSense technology integrates real-time, accurate and fast sensing of system parameters including current and temperature. This technology enables a patent-pending loss-less current-sensing capability, which improves energy savings by up to an additional 10% compared to prior generations, as well as further reducing external component count and shrinking system footprints. In addition, if the GaN IC identifies a potentially dangerous system condition, the IC is designed to transition rapidly to a cycle-by-cycle sleep-state, protecting both the device and the surrounding system. GaNSense also integrates an autonomous standby-power feature which automatically reduces standby power consumption when the GaN IC is in idle-mode, helping to further reduce power consumptions, which is especially important to the growing list of customers aggressively pursuing their own environmental initiatives.05.11.2021 06:30:00Novnews_2021-11-15_12.jpg\images\news_2021-11-15_12.jpghttps://navitassemi.com/navitas-introduces-third-generation-gan-power-ic-with-gansense-technology/navitassemi.com
NFC Type 2 Tag IC with Privacy FeaturesSTMicroelectronics' ST25TN512 and ST25TN01K NFC Fo...9552Product ReleaseNFC Type 2 Tag IC with Privacy FeaturesSTMicroelectronics' ST25TN512 and ST25TN01K NFC Forum Type 2 tag ICs deliver a new balance of cost and performance for high-volume use cases like consumer engagement, product information, and brand protection. Also suitable for smart-city applications and access control, the ST25TN512/01K NFC tag ICs support multiple user-protection and privacy mechanisms including a 7-bit unique chip-identifier code, TruST25 digital signature, NFC Forum T2T permanent write locks at block level, and a configurable kill mode that permanently deactivates the tag. Certified to NFC Forum Type 2 specifications, the ST25TN512 and ST25TN01K leverage ISO 14443 standards and can be used with NFC-compatible mobiles or a dedicated short-range reader. The embedded device memory includes up to 208 bytes (1664 bits) dedicated to user content. Support for messages in NFC Data Exchange Format (NDEF) allows triggering native actions on a smartphone without needing a dedicated app, such as launching a web browser or starting Bluetooth pairing. Augmented NDEF (ANDEF) additionally enables reading dynamic information such as custom messages and unique tap codes without explicitly updating the EEPROM.04.11.2021 17:30:00Novnews_2021-11-15_23.jpg\images\news_2021-11-15_23.jpghttps://newsroom.st.com/media-center/press-item.html/n4405.htmlst.com
Oscilloscopes with Analog Bandwidth Options from 200 MHz to 1 GHzTeledyne Test Tools T3DSO3000 Oscilloscopes featur...9545Product ReleaseOscilloscopes with Analog Bandwidth Options from 200 MHz to 1 GHzTeledyne Test Tools T3DSO3000 Oscilloscopes feature four channel models with analog bandwidth options from 200 MHz to 1 GHz. Each model offers a maximum sample rate of 5 GSa/s, and a maximum memory depth of 250 Mpts in half channel mode. All models incorporate two 5 GSa/s ADCs and two 250 Mpts memory modules. The T3DSO3000 series employs a new generation of high speed display technology that provides excellent Signal clarity, fidelity and performance. It comes with a minimum vertical input range of 500 µV/div, an innovative digital trigger system with high sensitivity, low jitter, and a waveform capture rate of 500,000 waveforms/sec (sequence mode). The T3DSO3000 also employs a 256-level intensity grading display function and a color temperature display mode which complement the high speed update rate. Teledyne Test Tools latest oscilloscope offering supports multiple powerful triggering modes as standard including serial bus triggering of I2C, SPI, UART, CAN, LIN, CAN FD, I2S, FlexRay, MIL-STD-1553B and SENT. Manchester protocol is also supported as standard in decode mode only and uses standard edge triggering. Also featuring as part of our launch promotion is the MSO Probe which ships as standard with each bandwidth model thus providing 16 digital channel Mixed Signal capability.04.11.2021 08:30:00Novnews_2021-11-15_14.png\images\news_2021-11-15_14.pnghttps://teledynelecroy.com/oscilloscope/t3dso3000-series-oscilloscopesteledynelecroy.com
48 V Open Rack Power ShelfAdvanced Energy introduced a high-density, high-ef...9544Product Release48 V Open Rack Power ShelfAdvanced Energy introduced a high-density, high-efficiency 48 V, 30 kW dual-feed Open Rack version 3 (ORv3) power shelf that minimizes the power consumption and improves the reliability of compute and storage applications in hyperscale and enterprise data centers. Featuring power supplies with demonstrated efficiency of 97%, Advanced Energy's Artesyn 2U shelf incorporates a hot swappable controller and can accommodate up to twelve 48 V, 3 kW open rack rectifiers with power up to 30 kW. These rectifiers include an embedded automatic transfer switch (ATS) capability that switches input to a secondary AC source on detection of primary AC power loss without any interruption to output voltage. "Minimizing power consumption and driving down costs are key challenges for data center operators as they look to meet the increased power demands of the latest high-performance processors," said Harry Soin, senior director of technical marketing for hyperscale data centers at Advanced Energy. "Evolving rack power from 12 V to 48 V architectures reduces conduction losses by a factor of 16, while open systems compliance ensures interoperability and reduced total system costs. Advanced Energy's Open Rack power shelf and rectifiers directly address these requirements while adding ATS technology to ensure optimal availability."04.11.2021 07:30:00Novnews_2021-11-15_13.jpg\images\news_2021-11-15_13.jpghttps://www.artesyn.com/latest-news/release/187/advanced-energy%E2%80%99s-48-v-open-rackartesyn.com
ACF-Based GaN Reference DesignSilanna Semiconductor has launched an Active Clamp...9553Product ReleaseACF-Based GaN Reference DesignSilanna Semiconductor has launched an Active Clamp Flyback (ACF)-based reference design that will simplify and speed the development of 65W 1C fast charger applications. Built around Silanna's SZ1131 ACF controller and incorporating Transphorm's Super GaN FET, the RD-29 is a production-ready 65W 1C USB-PD reference design for travel adapters and battery chargers. The reference design delivers industry-leading peak efficiencies of 94.5% and flat efficiency across universal (90 – 265Vac) input voltages and loads. No-load power is just 23mW @ 230Vac and the design measures only 34.5mm x 34mm x 30.5mm, giving it an uncased power density of 30W/inch3. "The RD-29 is a production-ready design that incorporates everything a designer needs to develop a charger and that already exceeds conducted and radiated EMI requirements by more than 6 dB," says Ahsan Zaman, director of product marketing at Silanna Semiconductor. "Benchmarked against the best-in-class commercially available 65W charging products this reference design provides an impressive 1% higher efficiency and reduces vampire power by as much as 44%. Combined with the industry-leading integration of our SZ1131 ACF controller, this has allowed us to create a solution that engineers can use to quickly develop compact and lightweight 65W chargers that operate with the least possible power consumption."03.11.2021 18:30:00Novnews_2021-11-15_24.jpg\images\news_2021-11-15_24.jpghttps://powerdensity.com/2021/11/03/silanna-semiconductors-acf-based-gan-reference-design-sets-new-benchmark-for-65w-1c-fast-charger-power-density-efficiency-and-no-load-power/powerdensity.com
Electrification Solutions for Megawatt Charging of Heavy-Duty Electric VehiclesSensata Technologies announced its High Voltage Ju...9546Product ReleaseElectrification Solutions for Megawatt Charging of Heavy-Duty Electric VehiclesSensata Technologies announced its High Voltage Junction Box solutions provide safe and reliable protection and power distribution for high power charging of commercial electric vehicles. The solutions include DC Charging Boxes that support megawatt charging of medium and heavy-duty electric trucks up to 850 Volts and 1300 Amps. Combining Sensata's proven contactor, fuse, and controller technologies into a compact package, the High Voltage Junction Boxes are custom-designed for specific vehicle requirements. Driven by the need for fast charging, electric vehicle manufacturers require systems that can handle higher charging power levels. "We have successfully optimized our contactor and fuse design to meet the increased thermal performance that megawatt charging requires while keeping within tight space constraints," said Brian Wilkie, Vice President, Heavy Vehicle & Off-Road at Sensata Technologies. According to Mr. Wilkie, "Sensata's unique capability to design all the safety-critical components of the solution (like contactors, fuses, control boards and software) in-house was instrumental in securing new strategic agreements with industry leaders for our custom power management and protection solutions, which help simplify our customers' production processes." To meet current carry and temperature requirements, Sensata's cooling and temperature control technology directly interfaces to the busbars and provides exceptional cooling efficiency within tight space restraints. For additional safety, Sensata's isolation monitoring design ensures isolation of the high voltage from the chassis. The solutions' software and controllers are built on the AUTOSAR platform.03.11.2021 10:30:00Novnews_2021-11-15_16.jpg\images\news_2021-11-15_16.jpghttps://www.sensata.com/contact/newsroom/sensata-announces-new-electrification-solutions-megawatt-charging-heavy-dutysensata.com
Qorvo Acquires United Silicon Carbide (UnitedSiC)The acquisition of United Silicon Carbide expands ...9533Industry NewsQorvo Acquires United Silicon Carbide (UnitedSiC)The acquisition of United Silicon Carbide expands Qorvo's reach into the fast-growing markets for electric vehicles (EVs), industrial power, circuit protection, renewables and data center power. United Silicon Carbide will become part of Qorvo's Infrastructure & Defense Products (IDP) business and will be led by Dr. Chris Dries, who was formerly United Silicon Carbide's president and CEO and is now general manager of Qorvo's Power Device Solutions. Philip Chesley, president of Qorvo IDP, said, "The addition of United Silicon Carbide to our IDP business significantly expands our market opportunities in high-power applications. This acquisition enables Qorvo to deliver high-value, best-in-class intelligent power solutions covering power conversion, motion control and circuit protection applications." Dr. Dries said, "Our team is thrilled to expand our SiC portfolio as part of Qorvo and continue to build the business with speed and scale, working to accelerate SiC adoption with the industry's highest performance devices. Our SiC technology, together with Qorvo's complementary Programmable Power Management products and world-class supply chain capabilities, enable us to deliver superior levels of power efficiency in advanced applications." United Silicon Carbide's product portfolio now spans more than 80 SiC FETs, JFETs and Schottky diode devices. Based on a unique cascode configuration, the recently announced Generation 4 SiC FETs are specified at an industry-leading 750V at 5.9 milliohm RDS(on), enabling new levels of SiC efficiency and performance critical for EV chargers, DC-DC converters and traction drives, as well as telecom/server power supplies, variable speed motor drives and solar photovoltaic (PV) inverters.03.11.2021 06:00:00Novnews_2021-11-15_1.png\images\news_2021-11-15_1.pnghttps://www.qorvo.com/newsroom/news/2021/qorvo-acquires-unitedsic-leading-provider-of-silicon-carbide-power-semiconductorsqorvo.com
Collaboration to Improve Performance of EV Inverter AssembliesMacDermid Alpha Electronics Solutions has announce...9540Industry NewsCollaboration to Improve Performance of EV Inverter AssembliesMacDermid Alpha Electronics Solutions has announced a cooperation with STMicroelectronics on a key sinter technology for Electric Vehicle inverter assemblies, designed to significantly increase vehicle efficiency and range, and lower production costs. Sinter technology is changing EV inverter assembly with pressure sintering providing a significantly lower thermal resistance, superior power cycling and mechanical reliability over conventional techniques. ST is offering its STPAK package for automotive traction inverters for assembly directly onto the heatsinks through sintering using ALPHA Argomax silver sinter paste. The ALPHA Argomax sinter paste, formulated using highly engineered silver particles, has been specially developed for low-pressure sinter die and package attachment. The paste creates a strong attachment through silver metallic bonds, offering physical strength, unsurpassed electrical conductivity and optimal thermal properties resulting in long-term reliability improvement. "The collaboration between ST and MacDermid Alpha to develop and refine advanced sintering technology has been extremely effective in producing the perfect combination – STPAK package sintered with ALPHA Argomax", said Edoardo Merli, Power Transistor Macro-Division General Manager and Group Vice President of STMicroelectronics Automotive and Discrete Group. "This unique attach process provides an unparalleled level of flexibility, reducing the overall number of power discretes needed and enabling significant cost savings ", said Julien Joguet, Director of Marketing – Power Electronics at MacDermid Alpha. "ALPHA Argomax sinter package and die attach technology, which has already been deployed in more than 2 million electric vehicles, enables manufacturers to produce efficient and reliable electric vehicle powertrains, a key factor in the wider adoption of electric vehicles ".02.11.2021 14:00:00Novnews_2021-11-15_9.png\images\news_2021-11-15_9.pnghttps://www.macdermidalpha.com/macdermidalpha.com
Compact High Efficiency SBDs for Automotive ApplicationsROHM has recently expanded its portfolio of Schott...9547Product ReleaseCompact High Efficiency SBDs for Automotive ApplicationsROHM has recently expanded its portfolio of Schottky barrier diodes by 24 new compact high efficiency models (12 RBR series and 12 RBQ series). These devices – 178 in total – are ideal for protection and rectification circuits in automotive, industrial equipment, and consumer applications. Diodes are commonly used in a variety of circuits for rectification and protection. Moreover, as lower power consumption is required in most applications, the adoption of SBDs – which are more efficient than other diodes – is on the rise. However, if VF is lowered to improve efficiency, IR which is inversely related to VF will become higher. This increases the risk of thermal runaway, so it is important to balance both VF and IR when selecting SBDs for circuit design. In response, ROHM strengthened its lineup of SBDs that balances small size with low VF and IR– characteristics demanded by the automotive sector. The market-proven RBR and RBQ series have been further expanded to include a lineup of compact high current, high voltage products that enable rectification and protection in a wider range of applications. Introducing a new process allows ROHM to improve the chip performance of both series by 25% (VF of RBR series in particular) over ROHM's conventional products. Furthermore, the RBR series features excellent low VF characteristics – key to improving efficiency and reducing loss. This makes them ideal for automotive applications as well as consumer electronics such as laptops where high efficiency is required. In fact, 12 of the products adopt a compact package (PMDE package) that reduces mounting area by 42% compared to existing products (PMDU package).02.11.2021 11:30:00Novnews_2021-11-15_17.png\images\news_2021-11-15_17.pnghttps://www.rohm.com/news-detail?news-title=rohm-expands-its-lineup-of-compact-market-proven-high-efficiency-schottky-barrier-diodes&defaultGroupId=falserohm.com
1200V 80mO Silicon Carbide MOSFETSemiQ announced the launch of its 2nd Generation S...9549Product Release1200V 80mO Silicon Carbide MOSFETSemiQ announced the launch of its 2nd Generation Silicon Carbide power switch, a 1200V 80mO SiC MOSFET, expanding its portfolio of SiC power devices. This MOSFET complements the company's existing SiC rectifiers at 650V, 1200V and 1700V. SemiQ has engineered this MOSFET to provide the best trade-off of conduction and switching losses to benefit the widest possible range of applications. SiC MOSFETs bring high efficiency to high-performance applications including electric vehicles, power supplies and data centers and are specifically designed and tested to operate reliably in extreme environments. Compared to legacy Silicon IGBTs, SemiQ's MOSFETs switch faster with lower losses, enabling system-level benefits through reduced size, weight and cooling requirements. Michael Robinson, President and General Manager at SemiQ said "Thanks to those employees, associates, supporters and vendors who have worked tirelessly to build and qualify our initial Gen2 SiC Power MOSFET which demonstrates the high-quality, optimized performance, and robust reliability that will be characteristic of a SemiQ MOSFET portfolio that is on the way."01.11.2021 13:30:00Novnews_2021-11-15_19.jpg\images\news_2021-11-15_19.jpghttps://semiq.com/en-us/?option=com_sellacious&view=product&p=P277V0S656semiq.com
Pump/Fan Driver ICsIn order to address more challenging customer depl...9551Product ReleasePump/Fan Driver ICsIn order to address more challenging customer deployments, Melexis has expanded its MLX90412 product offering. The latest version of this 2.2A automotive-qualified pump/fan driver IC is optimized to deal with high ambient temperature levels and supports prolonged operational lifespans. Melexis introduces the MLX90412GLW single-coil pump/fan IC with integrated driver stage. It is intended for applications with high ambient temperature such as automotive water pumps. The MLX90412GLW drives pumps up to 15W in Internal Combustion Engines (ICE). This typically implies a maximum ambient operating temperature up to 135?. While water pumps up to 20W can be driven within the maximum ambient temperature of 85? of electric vehicles (EV). The MLX90412GLW is qualified to meet the increasing operating lifetime demand. This goes up to 15,000 hours of EV applications such as battery cooling. The MLX90412GLW, a dedicated automotive 1-coil motor driver, includes all state of the art protections. Hall-sensor based 1-coil water pumps are well known for their robust start-up performance. With the MLX90412GLW, pump manufacturers can offer a complete portfolio of water pump solutions. It can be configured in a range of BLDC commutation options from sinewave mode, offering the lowest noise performance ideal for EVs over a high torque mode, up to a low EMI mode, for ON/OFF applications requiring minimum external EMI filter components.28.10.2021 15:30:00Octnews_2021-11-15_21.jpg\images\news_2021-11-15_21.jpghttps://www.melexis.com/en/news/2021/28oct2021-new-version-of-melexis-pump-fan-driver-ics-pushes-lifetime-boundaries-to-next-levelmelexis.com
High-Tech Manufacturing in Southeast AsiaAT&S announced detailed project information on the...9536Industry NewsHigh-Tech Manufacturing in Southeast AsiaAT&S announced detailed project information on the company's planned investment in a factory for IC substrates at the Kulim Hi-Tech Park, Kedah. CEO Andreas Gerstenmayer and COO Ingolf Schroeder gave insights into the planned investment, the project scope, technology details, as well as the planned activities to hire approx. 6,000 highly qualified employees. AT&S' new campus for the production of IC substrates in Kulim Hi-Tech Park, Kedah, involves a proposed total investment for phase 1 of RM 8.5 billion (€1.7 billion). The construction of the facility is going to start with an official groundbreaking ceremony on October 30, 2021, with commercial operations targeted to come on stream in 2024. "I want to thank the Malaysian government as well as the MIDA (the government's principal promotion agency under the Ministry of International Trade and Industry) for the great support throughout the entire process, from the start of our location scouting until today," says AT&S CEO Andreas Gerstenmayer. "Already today, Malaysia is an important hub for the chip supply chain. We are convinced that Malaysia can further strengthen its position as a technology country and will develop its position in the region as a high-tech manufacturing hub in Asia," Gerstenmayer says.28.10.2021 09:00:00Octnews_2021-11-15_4.jpg\images\news_2021-11-15_4.jpghttps://ats.net/blog/2021/10/28/ats-initiates-the-start-of-construction-for-the-companys-first-high-tech-manufacturing-in-southeast-asia/ats.net
DC DC Converter for H2 Fuel Cell ApplicationsBrightLoop Converters launches a standard HV<->HV ...9509Product ReleaseDC DC Converter for H2 Fuel Cell ApplicationsBrightLoop Converters launches a standard HV<->HV DC DC converter to interface with fuel cells of all levels of power: the DCHV320. Like its existing product ranges, BrightLoop Converters offers the DCHV320 as an ultra size and weight optimized converter with an extreme level of versatility. It is fully reversible, operates in buck or boost mode, and multiple converters can be paralleled to meet the needs of higher power fuel cells. The DCHV320 is the first member of a new product line that will be including higher and lower current ratings, buck-boost configurations for overlapping input and output voltages ranges, and galvanic isolation option. Other versions will be released from Q2 2022. Florent Liffran, CEO of BrightLoop Converters commented: "We have found that it was hard for both fuel cell and for vehicle manufacturers to find DC DC converter options on the market which would meet their power and/or weight constraints. The DCHV320 is extremely lightweight for a converter of this power, which allows it to be (almost) forgotten in the system, compared to the current state of the art converters. We are therefore thrilled to contribute to the development of fuel cell adoption in electric mobility with this launch."27.10.2021 16:30:00Octnews_2021-11-01_24.jpg\images\news_2021-11-01_24.jpghttps://www.brightloop.fr/en/dchv320brightloop.fr
Full Bridge LLC Transformer and Resonant ChokePREMO releases the 11kW 3DPowerTM solution, a Full...9506Product ReleaseFull Bridge LLC Transformer and Resonant ChokePREMO releases the 11kW 3DPowerTM solution, a Full Bridge LLC Transformer 150 µH + Resonant Choke 25 µH merged in 1 single unit. This innovation provides up to 40-50% reduction in volume compared with current discrete industrial solutions for the same power management. Most of the Power Converters (resonant topologies) in the market have a Transformer, Resonant Choke, and Output choke. Every component has its own design, core, winding, and thermal dissipation solution. 3DPowerTM is the first product to integrate two magnetics components, LLC Transformer and Resonant Choke, that share the same core and feature two orthogonal magnetic fields at all points within the core. The 3DP-11KWHVHV is available with Aluminum heatsink that acts as a direct thermal interface to the cold plate. 3DPowerTM cost-saving solution is also available with 7kW and the company is developing the 22kW solution. Designs can be fully customized according to customer requirements. The Series meets the AEC-Q200 (specific automotive quality standard) and other more restrictive customer automotive supplier standards. This greener solution has been fully tested in Premo Laboratory under real operational conditions.27.10.2021 13:30:00Octnews_2021-11-01_21.png\images\news_2021-11-01_21.pnghttps://www.grupopremo.com/content/327-new-3dpower-full-bridge-llc-transformer-and-resonant-chokegrupopremo.com
eGaN FET for High Power Density Telecom, Netcom, and Computing SolutionsEfficient Power Conversion expands the selection o...9505Product ReleaseeGaN FET for High Power Density Telecom, Netcom, and Computing SolutionsEfficient Power Conversion expands the selection of low voltage, off-the-shelf gallium nitride transistors with the introduction of the EPC2067 (1.3 m? typical, 40 V) eGaN FET. The EPC2067 is ideal for applications with demanding requirements for high power density performance including 48 V – 54 V input servers. Lower gate charges and zero reverse recovery losses enable high frequency operation of 1 MHz, and beyond, at high efficiency in a tiny 9.3 mm2 footprint for state-of-the-art power density. According to Alex Lidow, EPC's co-founder and CEO, "The EPC2067 makes the ideal switch for the secondary side of the LLC DC-DC converter from 40 V – 60 V to 12 V. This 40-volt device offers improved performance and cost compared with previous-generation 40 V GaN FETs allowing designers to economically improve efficiency and power density." The EPC90138 development board is a 40 V maximum device voltage, 40 A maximum output current, half bridge with onboard gate drives, featuring the EPC2067 eGaN FETs. This 2" x 2" (50.8 mm x 50.8 mm) board is designed for optimal switching performance and contains all critical components for easy evaluation of the EPC2067.  27.10.2021 12:45:00Octnews_2021-11-01_20.jpg\images\news_2021-11-01_20.jpghttps://epc-co.com/epc/EventsandNews/News/ArtMID/1627/ArticleID/3012/40-V-eGaN-FET-Ideal-for-High-Power-Density-Telecom-Netcom-and-Computing-Solutions-Now-Available-from-EPC.aspxepc-co.com
Expansion to Support Demand Growth for Specialty SiliconesElkem announces a strategic investment plan to unl...9492Industry NewsExpansion to Support Demand Growth for Specialty SiliconesElkem announces a strategic investment plan to unlock new specialty silicones supply for customers in Europe, the Middle East and Africa (EMEA) and the Americas. The company will invest around €36 million (NOK 350 million) to upgrade and debottleneck its silicone upstream plant in Roussillon, France. The board of directors has approved a 20,000 metric tons capacity expansion, bringing the effective silicone intermediates capacity from Elkem's upstream plant in Roussillon, France to 100,000 metric tons per annum, while delivering productivity, cost, sustainability and climate protection improvements. "At a time when silicones and their raw materials are in shortage, the expansion is cornerstone to meeting the future needs of our specialty silicones customers in EMEA and the Americas, where the market is expected to grow by around 6% per year between 2020 and 2025," said Frédéric Jacquin, Senior Vice President in charge of Elkem's Silicones Division. "This investment complements the ongoing capacity expansion at our Xinghuo site in China, which primarily serves growth in the Asia-Pacific region and further strengthens our cost position as well as environmental performance." Specialty silicones bring unique properties and performances to a wide panel of cutting-edge and sustainability-aligned markets – from electric and hybrid vehicles, to semi-conductors, decarbonized energies, 3D printing, healthcare & medical devices, aerospace, defense, or sustainable buildings. The investment plan includes installing new equipment and major technology upgrades in key parts of the plant to improve Elkem Roussillon's cost position and environmental performance, through higher materials efficiency, more energy efficient processes, reduced waste, and state-of-the-art water effluents treatment.27.10.2021 12:00:00Octnews_2021-11-01_7.jpg\images\news_2021-11-01_7.jpghttps://www.elkem.com/elkem.com
IWIPP 2022 Update and Call for PapersThe International Workshop on Integrated Power Pac...9538Event NewsIWIPP 2022 Update and Call for PapersThe International Workshop on Integrated Power Packaging (IWIPP) is a workshop focused on Power Packaging Technology which will be held August 24-26th, on the campus of Aalborg University, in Aalborg, Denmark. The contents of IWIPP 2022 will include 6 keynote addresses from leading power technology experts and a broad range of technical sessions, all of which are included in the registration fee. Packaging and related technologies are the key to creating high-density power sources. Attendance at this important workshop can keep you and your colleagues on the cutting edge of power packaging technology. If you have technology advancements or research accomplishments to present to the community, Technical Chairman Nick Baker, Assistant Professor, Aalborg University, invites you to submit a digest for review by the technical committee. The call for papers is available at now, the submission portal of the website is open and accepting submissions.27.10.2021 11:00:00Octnews_2021-11-15_6.png\images\news_2021-11-15_6.pnghttp://iwipp.org/call-for-papers/iwipp.org/call-for-papers
400 W Rugged Doherty RF Power TransistorAmpleon announced the introduction of the BLC10G27...9501Product Release400 W Rugged Doherty RF Power TransistorAmpleon announced the introduction of the BLC10G27XS-400AVT 400-Watt asymmetric Doherty RF power transistor. Designed for use in base station multi-carrier applications operating in the 2.496 GHz to 2.690 GHz frequency range, the -400AVT uses Ampleon's industry-respected 9th generation 28 V LDMOS process technology. Fabricated in an air cavity plastic (ACP) earless SOT-1258-4 package, the Doherty transistor typically delivers a drain efficiency of 45%. The BLC10G27XS-400AVT offers excellent rugged characteristics, up to a VSWR of 10:1, considered essential for base station applications where high-power extreme mismatch conditions can often occur. The transistor has integrated ESD protection, has a low output capacitance that improves Doherty performance, and includes internal input and output impedance transformation, enabling user-friendly PCB matching to 50-ohm. The power gain specification of the BLC10G27XS-400AVT is typically 13.3 dB based on quoted test conditions. Additionally, the -400AVT has low thermal resistance attributes that yield excellent thermal stability for demanding base station applications. Design support resources for the BLC10G27XS-400AVT include a recommended driver, the BLM9D2327S-50PB, an LDMOS 2-stage integrated Doherty MMIC and the PCB layout for a Doherty production test circuit. The Ampleon website hosts the BLC10G27XS-400AVT data sheet, application notes, simulation models, and an RF power transistor lifetime calculator.27.10.2021 09:30:00Octnews_2021-11-01_16.jpg\images\news_2021-11-01_16.jpghttps://www.ampleon.com/news/press-releases/ampleon-extends-ldmos-base-station-and-multi-carrier-line-up-with-the-introduction-of-400-w-rugged-doherty-rf-power-transistor.htmlampleon.com
Startups Focusing on Future Mobility and DigitalizationSemiconductors are at the core of emerging technol...9489Industry NewsStartups Focusing on Future Mobility and DigitalizationSemiconductors are at the core of emerging technologies that enable digital transformation. To amplify startup engagement Infineon Technologies has signed a memorandum of understanding with Hyundai Motor Group (Hyundai). Under this agreement, Infineon will support startups with product level technical expertise to enhance their success-rate and offer them the opportunity for closer collaboration within Infineon's Co-Innovation Space in Singapore. The focus is mainly on innovations that are addressing future mobility, smart cities and smart factory applications. "In an environment of rapid electrification and digitalization, creativity and innovation require collaboration across multiple knowledge domains. Co-innovation is critical to business success," said Dr Helmut Gassel, CMO and member of the Infineon Management Board on the occasion of Oktobertech Asia Pacific 2021. "We are thrilled to work together with Hyundai, a global enabler in future technologies. By bringing in our system expertise and industrial background as well as easy-to-integrate semiconductor solutions, we will foster the startup ecosystem and help startups ride the megatrends for growth." This win-win partnership leverages Infineon's easy to integrate hardware solutions including sensors, microcontrollers, actuators, and security, and Hyundai's world class portfolio of startups focusing on over the horizon technologies e.g. robotics, urban air mobility and Artificial Intelligence. In first phase, the joint activities will be undertaken by Infineon Technologies Asia Pacific and Hyundai CRADLE offices in Seoul and Singapore. In the second phase, the collaboration will be further deepened and extended globally, where Hyundai CRADLE and Infineon have established presence.27.10.2021 09:00:00Octnews_2021-11-01_4.jpg\images\news_2021-11-01_4.jpghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2021/INFXX202110-010.htmlinfineon.com
Global Expansion and Development of Next-Generation SemiconductorsEmpower Semiconductor has closed a $45 million equ...9497Industry NewsGlobal Expansion and Development of Next-Generation SemiconductorsEmpower Semiconductor has closed a $45 million equity financing led by Mesh Ventures and including existing investors Samsung Catalyst Fund, Hallador and Regal I. The financing will further accelerate the global expansion of its sales force and operational footprint as well as the fund development of its next generation integrated voltage regulator (Empower IVR) semiconductor technology. Empower recently released its first generation IVR into mass production after nearly six years in development. By moving voltages and currents up to 1,000x faster than any competitor, Empower's technology offers dramatic energy savings to data centers that previously would not have been possible. In fact, it is estimated that adoption of Empower's technology by the world's data centers will enable annual electricity savings of up to 285 TWh by 2025 ($32 billion), or 150 million tons of carbon dioxide every year. Tim Phillips, Empower's CEO states: "Meeting the performance demands of data-intensive systems while keeping energy use to a minimum demands radical new power management solutions. Empower was founded to deliver those solutions and this latest funding will help us meet growing demand for our technologies by accelerating our product roadmap and production plans with key partners and customers.  We have set a path to make a major impact in a $10 billion segment of the high-performance power management market and we will leverage this investment to execute it."26.10.2021 17:00:00Octnews_2021-11-01_12.jpg\images\news_2021-11-01_12.jpghttps://www.empowersemi.com/empower-announces-a-45-million-series-c1-financing-to-fund-global-expansion-and-development-of-next-generation-semiconductors/empowersemi.com
HV Breakout Modules with PowerLok Connector SystemCSM GmbH presents "C" ("Connector") variants of th...9507Product ReleaseHV Breakout Modules with PowerLok Connector SystemCSM GmbH presents "C" ("Connector") variants of the High-voltage Breakout Modules (HV BM) for measuring current, voltage and power. The "C" variants have a simple and safe connection system which facilitates handling. The time required for measurement setup is significantly reduced. In addition, the HV Breakout Modules "C" can be easily unplugged for calibration. The HV Breakout Module 1.2C is easily connected to the HV power cables via a PL500 connector system and allows single-phase measurements on separate HV+ and HV- cables. Similarly, but with a PL300 connector system, the HV Breakout Module 3.3C is connected to the HV cables, e.g. between inverters and electric motors. The HV BM 3.3C measures voltages U12, U23, U31 and internal conductor currents of L1, L2, and L3 with a measurement data rate of up to 2 MHz per measured variable. The measurement data is transferred to the measuring computer via CAN and EtherCAT (HV BM 1.2C) or XCP-on-Ethernet (HV BM 3.3C). The PowerLok connectors are designed for operating currents up to 800 A. They include a quick-lock lever with connection position aid and a socket housing with integrated high-voltage locking for high vibrations. When mated, the connectors provide IP67 protection. Due to the robust design, the connectors are also suitable for a high number of mating cycles.26.10.2021 14:30:00Octnews_2021-11-01_22.jpg\images\news_2021-11-01_22.jpghttps://www.csm.de/en/news/press/1351-hv-breakout-module-c-variantscsm.de
International Electric Drives Production Conference (E|DPC)The full program for the event December 7th – 9th ...9493Event NewsInternational Electric Drives Production Conference (E|DPC)The full program for the event December 7th – 9th is now released and available for download on the website. Keynote speakers this year are:<br>- Dr. Ralf Effenberger, Managing Director, INTIS - Integrated Infrastructure Solutions GmbH<br>- Alex Gruzen, CEO, WiTricity Corporation<br>- Dr. Stefan Loth, Chairman of the Board and Managing Director Technology and Logistics, Volkswagen Sachsen GmbH<br>- Dr. Andreas Wendt, Regional Director, ElectReon Germany GmbH<br><br>Get in touch with the newest trends and developments regarding electric drives at the E|DPC 2021.26.10.2021 13:00:00Octnews_2021-11-01_8.jpg\images\news_2021-11-01_8.jpghttps://www.edpc.eu/discover/edpc.eu
3-Phase Gate Driver for EV and Hybrid CarsAllegro MicroSystems is expanding its QuietMotion ...9499Product Release3-Phase Gate Driver for EV and Hybrid CarsAllegro MicroSystems is expanding its QuietMotion product line with the introduction of the A89307 automotive-qualified gate driver integrated circuit (IC). Designed for battery cooling fans and HVAC systems in electric (EV) and hybrid vehicles, the A89307 offers low noise and vibration by using a Field Oriented Control (FOC) algorithm to drive continuous sinusoidal current to the load, helping automakers reduce noise and improve battery life, offering more miles per charge and lowering vehicle carbon footprints. "By design, EV and hybrid vehicles are quieter than traditional models with internal combustion engines-especially when they're stopped-and drivers are becoming increasingly sensitive to noise created by components such as cooling fans," said Steve Lutz, Product Line Director for Motor Drivers at Allegro. "The A89307's hardware-based algorithm makes it easier for designers to reduce fan noise while improving cooling performance and increasing miles per charge. That's good for drivers, and good for the environment." The A89307 includes a hardware-based algorithm, which requires no external sensors or software development; the user simply selects parameters using a simple GUI interface and loads them into the IC's on-chip E2EPROM. With only five external components, the A89307 helps designers lower material costs by reducing BOM components and facilitating very small system footprints for in-motor PCBs. Its fully integrated algorithm can even eliminate the need for a separate microprocessor.26.10.2021 07:30:00Octnews_2021-11-01_14.jpg\images\news_2021-11-01_14.jpghttps://www.allegromicro.com/en/about-allegro/news-room/2021/a89307-prallegromicro.com
Integrated USB Type-C Charger UnificationInfineon's EZ-PD BCR (Barrel Connector Replacement...9498Product ReleaseIntegrated USB Type-C Charger UnificationInfineon's EZ-PD BCR (Barrel Connector Replacement) is a highly integrated USB-C controller, together with the USB-C connector, it replaces barrel connectors, custom connectors or legacy USB connectors in electronic devices. The EZ-PD BCR solution supports the USB Power Delivery (PD) standard that interoperates with all USB-C power adapters without the need of firmware development. It minimizes BOM (bill of material) cost for the USB-C power-sink system and it guarantees USB-C specification compliance and interoperability through USB-IF certification. At the power-source, in the charger, the latest CoolGaN Integrated Power Stage (IPS) 600 V leverages the markets most reliable GaN and driver technologies, uniting ultimate efficiency and reliability with ease-of-use. GaN technology allows for higher switching frequency and more output power in the same size or smaller charger with the same power level. An integration results in very high power density making this device the first choice for fast charger designs. CoolGaN has an advanced breakdown field of ten times and an electron mobility of two times higher compared to silicon devices. The key for the high frequency operation capability of CoolGaN lies in a ten times lower output and gate charge, compared to silicon-based devices and a reverse recovery charge of virtually zero.25.10.2021 06:30:00Octnews_2021-11-01_13.jpg\images\news_2021-11-01_13.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2021/INFPSS202110-011.htmlinfineon.com
Medical and Industrial Power Supply Series Augmented with 500W ModelsTDK Corporation announces the introduction of the ...9556Product ReleaseMedical and Industrial Power Supply Series Augmented with 500W ModelsTDK Corporation announces the introduction of the TDK-Lambda brand CUS500M1 AC-DC power supplies. The series is rated at 500W and is packaged in a 3 x 5” footprint. It provides an alternative for the 600W CUS600M models and an easy cost reduction for lower power, more cost sensitive applications. The CUS500M1 is suitable for use in a wide range of Class I or Class II (double insulated) applications, including home healthcare, medical, dental, test and measurement, broadcast and industrial equipment. The CUS500M1 series accepts an 85 to 264Vac input and has a choice of seven output voltages: 12V, 19V, 24V, 28V, 32V, 36V and 48V. An integral fan option with cover is also available. The open frame models measure 76.2 x 127 x 37mm (WxLxH), or 85 x 157 x 42.5mm with the cover/fan assembly fitted. Convection cooled the CUS500M1 can deliver 300W (500W peak) in -20°C to +40°C ambient temperatures, derating linearly to 150W load at +70°C. With forced air cooling or the integral fan fitted, the series provides up to 500W in a +60°C ambient, derating to 400W at +70°C. The efficiency of the series is up to 96%, reducing internal power losses.22.10.2021 16:30:00Octnews_2021-11-15_22.jpg\images\news_2021-11-15_22.jpghttps://www.us.lambda.tdk.com/news/press-releases/2021000085.htmllambda.tdk.com
Innovation Award and the Young Engineer Award The SEMIKRON Innovation Award and the Young Engine...9542Industry NewsInnovation Award and the Young Engineer Award The SEMIKRON Innovation Award and the Young Engineer Award which have been initiated and are donated by the SEMIKRON Foundation are given for outstanding innovations in projects, prototypes, services or novel concepts in the field of power electronics in Europe, combined with notable societal benefits in form of supporting environmental protection and sustainability by improving energy efficiency and conservation of resources. SEMIKRON Foundation is awarding the prizes in cooperation with the European ECPE Network. With the awards the SEMIKRON Foundation wants to motivate people of all ages and organisations of any legal status to deal with innovations in power electronics, a key technology of the 21th century, in order to improve environmental protection and sustainability by energy efficiency and conservation of resources. The SEMIKRON Innovation and Young Engineer Prizes will be awarded in the frame of the ECPE Annual Event in March 2022. A single person or a team of researchers can be awarded.22.10.2021 16:00:00Octnews_2021-11-15_11.jpg\images\news_2021-11-15_11.jpghttps://www.ecpe.org/infocentre/awards/semikron/ecpe.org
Annual Distributor AwardsArrow Electronics has been recognized both for tea...9537Industry NewsAnnual Distributor AwardsArrow Electronics has been recognized both for team and individual performances by Bourns in its annual distribution partner awards. The awards honor exceptional sales support provided by distributors that have contributed to Bourns' business growth in EMEA (Europe, Middle East and Africa). In Arrow's Neu-Isenburg branch office at the end of September, Bourns named Arrow as the highest performing distributor, as volume partner EMEA, based on the company's overall performance. Arrow was particularly successful in the automotive sector and with products in the standard and custom magnetics, multifuse and fixed resistors categories. Benjamin Hofmann, product group manager at Arrow, was named Most Valuable Person in recognition of his engagement both in business development and customer support activities, especially in the area of magnetics.22.10.2021 10:00:00Octnews_2021-11-15_5.jpg\images\news_2021-11-15_5.jpghttps://news.fiveyearsout.com/news-releases/news-details/2021/Arrow-Electronics-Recognized-in-Bourns-Annual-Distributor-Awards/default.aspxfiveyearsout.com
Addition to Open Parts Library for Faster Electronics ProductionSeeed is adding SnapEDA computer-aided design (CAD...9496Industry NewsAddition to Open Parts Library for Faster Electronics ProductionSeeed is adding SnapEDA computer-aided design (CAD) models to the Seeed and ShenZhen Open Parts Libraries (OPLs), to help electronics designers move from idea to fabrication with ease. The OPLs are a collection of commonly used components, designed to be used with the Seeed Fusion PCB Assembly (PCBA) service, that are widely available in the supply chain, cost effective, and design-for-manufacturing (DFM) friendly. Today it contains a wide selection of over 150,000 commonly used parts, from integrated circuits (ICs) to passives, to cut costs and reduce the turnaround times for turnkey PCB assembly. During the parts selection stage, the OPLs save engineers time and reduce delays, since the parts are carefully selected to ensure they are widely available in the local supply chain, eliminating the need to import parts and undergo lengthy and costly customs clearance processes. This is especially helpful given the current global component shortage affecting the electronics industry. In addition to preventing delays, engineers also save money since the components in these libraries are sourced from Seeed's affiliated partners network and/or are purchased in bulk.21.10.2021 16:00:00Octnews_2021-11-01_11.png\images\news_2021-11-01_11.pnghttps://insights.snapeda.com/syndicationsnapeda.com
Meeting Increased Industry Needs for Accurate Current Sense TransducersCurrently the electronics industry worldwide is st...9494Industry NewsMeeting Increased Industry Needs for Accurate Current Sense TransducersCurrently the electronics industry worldwide is still facing component shortages resulting in long lead-times and in some cases, dramatic increases in prices. However, Danisense is still able to supply customers within normal lead times, thanks to the company's in-house manufacturing, well-established supply chains and long experience. This is having a positive effect on Danisense's business, and the company is on track to grow revenues by over 50% in 2021. Comments Loic Moreau, Sales & Marketing Director at Danisense: "One of our key markets is EVs, so we were well aware of the fast move to electrification and what that would mean both for the need for increased testing and also the likelihood of component shortages. Therefore, we anticipated the current challenging situation and increased our inventory well in advance, so now we can now still supply our customers within normal lead times. We have seen similar cycles before, such as in 2008/2009 when there was a big collapse followed by a string recovery, so we were well-prepared." Danisense continues to invest, developing all aspects of its business to be able to respond to the needs of its diverse customer base. Headcount has more than doubled in the last two years, especially in R&D, and the factory has been completely re-organised to streamline manufacturing.21.10.2021 14:00:00Octnews_2021-11-01_9.jpg\images\news_2021-11-01_9.jpghttps://www.danisense.com/danisense.com
LED Driver with 4.5-75V Input Designed for Auto/Industrial/Med AppsTaiwan Semiconductor announces the introduction of...9503Product ReleaseLED Driver with 4.5-75V Input Designed for Auto/Industrial/Med AppsTaiwan Semiconductor announces the introduction of the TS19503 single channel, continuous conduction, hysteretic mode converter for driving single or multiple LEDs. Featuring 4.5-75V input and 2A output, the TS19503 offers up to 97% efficiency and 2% accuracy over a wide range of external conditions. AEC-Q100 qualification assures high reliability while the hysteretic (bang-bang) control technique provides high accuracy and reduced external parts count. Target automotive applications include high and low beam headlights; daytime running lights; turn indicators; position indicator lights; fog lights; ATV and four-wheel drive high-brightness lamps. The TS19503 is also well suited for DC input industrial and medical applications where SELV and line isolation considerations are a concern. "The TS19503's constant current mode hysteretic control results in a very low parts count," reported Sam Wang, Vice President, TSC Products. "And our design calculator tool makes short work of implementing a working solution."21.10.2021 11:30:00Octnews_2021-11-01_18.jpg\images\news_2021-11-01_18.jpghttps://www.taiwansemi.com/en/products/details/TS19503CB10Htaiwansemi.com
Bidirectional ESD Protection Device for USB4 Standard InterfacesNexperia announced two PESD5V0R1BxSF extremely low...9502Product ReleaseBidirectional ESD Protection Device for USB4 Standard InterfacesNexperia announced two PESD5V0R1BxSF extremely low clamping and capacitance bidirectional Electrostatic Discharge (ESD) protection diodes. Based on Nexperia's TrEOS technology with active silicon-controlled rectification, the devices ensure optimal signal integrity for USB4TM (up to 2 x 20 Gbps) data lines on laptops and peripherals, smartphones and other portable electronic equipment. "Since there are tight budgets on insertion loss and return loss for the USB4TM Super Speed lines, Nexperia supports design engineers by offering devices that minimize the impact of ESD protection on the total budget," says Stefan Seider, senior product manager at Nexperia. "By providing these two device options, engineers can balance between ESD voltage clamping (that is protection level) and RF performance." The PESD5V0R1BDSF is optimized for low clamping and offers extremely low insertion loss figures of -0.28 dB at 10 GHz and similarly low return loss figures of -19 dB at 10 GHz. The PESD5V0R1BCSF, on the other hand, is optimized for RF performance with insertion loss data of -0.25 dB and return loss data of -19.4 dB at 10 GHz each. This makes it ideal for applications with further limited budgets for insertion loss and return loss.21.10.2021 10:30:00Octnews_2021-11-01_17.jpg\images\news_2021-11-01_17.jpghttps://www.nexperia.com/about/news-events/press-releases/nexperia-delivers-extremely-low-clamping-bidirectional-esd-protection-devices-for-usb4-standard-interfaces.htmlnexperia.com
Joint Venture in SiC Power Module BusinessZhenghai Group and ROHM have signed a joint ventur...9486Industry NewsJoint Venture in SiC Power Module BusinessZhenghai Group and ROHM have signed a joint venture agreement to establish a new company in the power module business. The company, "HAIMOSIC (SHANGHAI) CO.,LTD." is scheduled to be established in China in December 2021, and will be owned 80% by Shanghai Zhenghai Semiconductor Technology Co., Ltd. (Zhenghai Semiconductor) of Zhenghai Group and 20% by ROHM. The company will engage in the joint venture business of development, design, manufacturing and sales of power modules using silicon carbide (SiC) power devices, with the aim of developing a power module business that is ideal for traction inverters and other applications in new energy vehicles. The agreement enables to develop highly efficient power modules by combining the inverter technology of the Zhenghai Group companies, the module technology of both companies, and ROHM's cutting-edge SiC chips. The module products to be developed through the new company are already scheduled to be used in electric vehicles, and mass production will begin from 2022. The Zhenghai Group and ROHM will work closely with this new company to contribute to further technological innovation through the development and widespread use of SiC power modules. Isao Matsumoto, President and CEO of ROHM: "We are very pleased to establish a joint venture with the Zhenghai Group, which has a wide range of businesses in China. As a leading company in SiC power devices, ROHM has been developing the world's most advanced devices and providing power solutions together with peripheral components. The development of power modules in the new company will encourage the use of SiC power devices in new energy vehicles, which are gaining momentum in China, as well as play an important role in other application research. Through the business of the new company with Zhenghai Group, we will aim for the further development and evolution of both companies."21.10.2021 06:00:00Octnews_2021-11-01_1.jpg\images\news_2021-11-01_1.jpghttps://www.rohm.com/news-detail?news-title=2021-10-21_news_company&defaultGroupId=falserohm.com
100W and 300W DC/DCs in Eighth-Brick FormatRECOM has introduced two DC/DC products with outpu...9550Product Release100W and 300W DC/DCs in Eighth-Brick FormatRECOM has introduced two DC/DC products with outputs of 100W and 300W in a DOSA-compatible low-profile, through-hole eighth-brick format (58.4mm x 23mm). The RPA100E-W 100W part has a wide 4:1 input range of 16-72V for nominal 24V, 28V and 48V supplies, and fully regulated 5V and 12V trimmable outputs are available. Full power is available to 50°C ambient in natural convection and to +85°C with forced air. Isolation is 1.5kVDC/1 min, basic grade. The RPA300E 300W part has an input range of 36-75V for nominal 48V supplies and features an output trimmable over a wide range of 16-35V. Isolation of this part is 2.25kVDC/1 min, basic grade. The RPA300E has an integrated heat spreader that allows direct screw-fixing to a heatsink or cold wall. Full-load operation of this part without heatsinking is to 60°C with forced air and to 85°C with load derating. Both product ranges have high power density with a typical efficiency of 94.8% (RPA300E) and 92% (RPA100E). High efficiency >90% is also maintained down to light loads, to suit applications with low standby loss requirements. The ranges include comprehensive protection against input under-voltage, short circuit, output over-current, over-voltage and over-temperature. Control features included are on/off control and remote sensing.20.10.2021 14:30:00Octnews_2021-11-15_20.jpg\images\news_2021-11-15_20.jpghttps://recom-power.com/en/company/newsroom/news/rec-n-eighth-brick-dc!sdcs-have-high-efficiency-180.html?2recom-power.com
Winners of 2021 GaN-IC Technology Design ContestImec and EUROPRACTICE announced the winners of the...9495Industry NewsWinners of 2021 GaN-IC Technology Design ContestImec and EUROPRACTICE announced the winners of their 2021 GaN-IC design contest. The contest aims to encourage innovation in power electronics applications using imec's Gallium Nitride technology for monolithic integration of power electronics circuits. The prizewinning project entitled "High voltage half-bridge with integrated drivers and control circuits – all Gallium Nitride" was submitted by a team of researchers from the Chair of Integrated Analog Circuits and RF Systems of RWTH - Aachen University. Proposals submitted by ESAT-MICAS from KU Leuven and Leibniz University Hannover came second and third, respectively. The winning designs will be prototyped in imec's upcoming 650V GaN-IC Multi-Project Wafer (MPW) run, starting late October 2021. The team from RWTH Aachen University proposed a circuit based on a high-voltage half-bridge output stage, featuring integrated drivers and a level-shifter. Potential applications include non-isolated buck converters supporting automotive electronics in lower voltage systems for conventional or hybrid vehicles, or high voltage circuits for fully electric vehicles. Although multichip solutions combining GaN half-bridge ICs with integrated drivers and level-shifting are available from a limited number of suppliers, fully integrated GaN converters are not. The design proposed by the Aachen team features a very high level of integration for all GaN-ICs, integrating power- and control-circuitry, which eliminates the need for external controllers or drivers. The design proposed by the KU Leuven team features an all-GaN direct AC/DC power converter IC, targeting large volume products such as mobile appliance chargers and adapters, as well as integrated power converter regulators for automotive and consumer electronics. 19.10.2021 15:00:00Octnews_2021-11-01_10.jpg\images\news_2021-11-01_10.jpghttps://www.imeciclink.com/en/press/imec-and-europractice-announce-winners-2021-gan-ic-technology-design-contestimeciclink.com
DC-DC Converters Help Reduce Race Car WeightDynamis PRC, the Formula Student team of Politecni...9539Industry NewsDC-DC Converters Help Reduce Race Car WeightDynamis PRC, the Formula Student team of Politecnico di Milano, has over 100 students and the team designs and manufactures a racing car prototype every year, for racing in the international Formula SAE championship. After 15 years in the combustion category, Dynamis PRC has reached fourth position, and first in Italy, in the Formula Student Combustion world ranking. The team is now in the process of changing from a combustion engine to electric power, allowing it to make many improvements to the car's design and performance. Chief among these was weight reduction, going from over 20kg for the original engine, to four 3.5kg electric motors, one mounted on each wheel. Each motor is independently controlled to optimize both traction and braking performance. One of the major new components was the accumulator, which comprised 660 Sony VTC6 cells to deliver up to around 550V. To supply the vehicle's 12V low voltage power, a LiFePO4 battery was also included in the electrical system. However, this was found to have very low autonomy. To solve this challenge, Dynamis decided to use the existing 12V circuit, powered by the low voltage battery, to supply the on-board PCBs, sensors, and telemetry equipment. Dynamis would then step down the voltage from the high voltage accumulator and extract 12V, using two DC-DC converter modules. This method would be used to meet the more demanding part of the low-voltage load, sourcing 600W – 50A at 12V – to supply the cooling fans and cooling water pump. The DC-DC converter system had to be reliable, as a fault would cause the cooling system to stop, leading to an uncontrolled rise in motor and inverter temperatures. Weight and size were also key concerns. After an extended search for suitable DC-DC products, Dynamis settled on Vicor's DCM4623 module, as it satisfied all their system requirements. The Vicor DC-DC converter module can operate in array mode, accommodating an input supply from the accumulator that ranged from 550V down to 330V as the batteries discharged during a race.19.10.2021 13:00:00Octnews_2021-11-15_8.jpg\images\news_2021-11-15_8.jpghttps://www.vicorpower.com/press-room/dynamis-prcvicorpower.com
15 Years ZS-HandlingZS-Handling is celebrating its 15th anniversary th...9490Industry News15 Years ZS-HandlingZS-Handling is celebrating its 15th anniversary this year. Founded in 2006, the company develops and produces systems and handling technology for a wide range of applications. With its 25 highly qualified employees, the Regensburg site manufactures innovative and customized solutions for world market leaders in the fields of semiconductor and solar technology, glass production and medical technology. ZS-Handling GmbH also offers solutions for optimizing production processes in the field of e-mobility. The heart of the system is the patented ultrasonic bearing, which enables contactless gripping and transport of sensitive components. The so-called sonotrode of the ultrasonic bearing is made to vibrate and thus generates an air film that causes the component to float in a controlled manner. In combination with negative pressure, components can also be gripped and moved from above without surface contact. This gentle handling prevents even the smallest damage such as micro-scratches or cracks on the highly sensitive components. This technology can also be used in the clean room and needs significantly lower energy consumption compared to conventional non-contact handling technologies, as no compressed air is required. Application areas include films, glass, wafers & chips, lenses as well as battery and fuel cell foils. In recent years, projects have been successfully implemented in-country and abroad with leading manufacturers. The success in the semiconductor industry was followed by entry into the solar industry. The competence of ZS-Handling GmbH in non-contact handling has quickly got around. In the meantime, projects in the glass manufacturing and automotive industry have also been successfully carried out.15.10.2021 10:00:00Octnews_2021-11-01_5.jpg\images\news_2021-11-01_5.jpghttps://zs-handling.com/en/zs-handling.com
Engineering Expertise, Vertical Range of Manufacture and Availability of Passive ComponentsOn its new website, SMP Sintermetalle Prometheus G...9541Industry NewsEngineering Expertise, Vertical Range of Manufacture and Availability of Passive ComponentsOn its new website, SMP Sintermetalle Prometheus GmbH & Co KG (SMP) showcases its wide range of innovative products, high level of engineering expertise, smart vertical range of manufacture, availability and wide-ranging applications of its inductive components. At its headquarters in Germany, SMP develops and produces chokes, EMC filters, transformers and soft magnetic mouldings. The soft magnetic powder composites used in the passive components are specially developed for each application and manufactured in-house to ensure high availability. The extremely low-loss components are designed for currents of up to 3000 amperes and frequencies of up to 5 gigahertz. They are available in sizes from 19 mm to 300 mm diameter, with weights ranging from 0.05 kg to 130 kg. SMP components are used in applications in the fields of power electronics, drives, automation, signal processing, medical technology, E-mobility, marine, railway, environmental technology, energy transformation, renewable energies and aerospace. The products are sold worldwide with an export quota exceeding 50 percent. Founded in 1982, the family-run business has since become a major global supplier of soft magnetic components for industrial applications.14.10.2021 15:00:00Octnews_2021-11-15_10.jpg\images\news_2021-11-15_10.jpghttps://smp.de/en/smp.de
'EMEA Fastest Growing Distributor of the Year' AwardTTI has received the 'EMEA Fastest Growing Distrib...9491Industry News'EMEA Fastest Growing Distributor of the Year' AwardTTI has received the 'EMEA Fastest Growing Distributor 2020' award from Japan Aviation Electronics Industry, Ltd (JAE), the Japanese manufacturer of connectors and cable assemblies. The prestigious distribution award recognises TTI's 2020 outstanding performance across EMEA with successful design-in activities, culminating in exceptional growth for JAE. "We appreciate the professional collaboration TTI and JAE have developed over the years," said [Erik Troeger, Senior Distribution Manager at JAE Europe ]. "The 'EMEA Fastest Growing Distributor 2020' award recognises TTI's important contribution last year. A productive and trusting relationship in combination with the effective implementation of joint activities is essential for us to meet our long-term goals for success." Ronald Velda, Director Supplier Marketing Europe Connectors at TTI added: "We are delighted to receive this prestigious award and want to thank JAE for this honour. Helping our partners grow is what our team at TTI does best. This award recognises the dedication and effort of our TTI team, and I would like to thank JAE for its never-ending support. We look forward to continuing on this growth path with JAE for the coming years."14.10.2021 11:00:00Octnews_2021-11-01_6.jpg\images\news_2021-11-01_6.jpghttps://www.ttieurope.com/content/ttieurope/en/about-tti/news-center/corporate-news/press-releases/2021/october/pr-10142021-jae-award-tti-fastest-growing-distributor.htmlttieurope.com
Dual MOSFETs Deliver Low ON ResistanceROHM developed dual-MOSFET products (Nch+Pch) feat...9510Product ReleaseDual MOSFETs Deliver Low ON ResistanceROHM developed dual-MOSFET products (Nch+Pch) featuring ±40V/±60V withstand voltages, QH8Mx5/SH8Mx5 series. The devices are ideal for driving motors in base stations (cooling fans) and industrial applications such as factory automation equipment requiring 24V input. In recent years, MOSFETs are increasingly required to ensure sufficient margin against voltage fluctuations by providing 40V and 60V withstand voltages to support 24V input required for motors used in industrial equipment and base stations. Furthermore, MOSFETs are expected to deliver higher speed switching together with lower ON resistance to further improve the efficiency and miniaturization of motors. In response, ROHM developed its 6th generation 40V/60V MOSFETs utilizing the latest precision processes for the Nch MOSFETs, following the release of the latest generation Pch MOSFETs announced at the end of last year. This combination allows ROHM to provide class-leading dual Nch+Pch MOSFETs that deliver the ±40V/±60V withstand voltage required for 24V input. Moreover, the company developed also the +40V/+60V QH8Kxx/SH8Kxx (Nch+Nch) series to support a wider range of needs. (12 models in total of Nch+Pch and Nch+Nch). The QH8Mx5/SH8Mx5 series utilizes original latest processes to achieve class-leading lower ON resistance, 61% lower than the Pch MOSFETs in dual MOSFETs products in the ±40V class. This contributes to significantly lower power consumption in a variety of applications. Furthermore, integrating 2 devices into a single package contributes to miniaturize applications by reducing mounting area and decrease the workload required for component selection (combining Nch and Pch).13.10.2021 17:30:00Octnews_2021-11-01_25.jpg\images\news_2021-11-01_25.jpghttps://www.rohm.com/news-detail?news-title=latest-generation-of-dual-mosfets&defaultGroupId=falserohm.com
SOIC-16 DC/DC Range AddedRECOM has extended its range of DC/DC converters i...9504Product ReleaseSOIC-16 DC/DC Range AddedRECOM has extended its range of DC/DC converters in a SOIC-16 package. The parts feature 5V (4.5-5.5V) inputs and a semi-regulated 5V output rated at either 0.5W (R05C05TE05S) or 1W (R05CTE05S). Line and load regulation figures are specified across the full temperature range, and there is no minimum load requirement, making the parts ideal for applications that have light-load operation modes. Both parts have a 3kVDC/1 min (basic) insulation rating with greater than 8mm input/output creepage and clearance, and operate from -40°C to 125°C with derating. Isolation capacitance is just 7pF. Protection features include short-circuit, over-current, over temperature, and input undervoltage, making the parts highly suitable for applications that demand a high level of reliability and robustness. EMI levels are also particularly low compared with more expensive competing products. The SOIC-16 package is just 10.35mm x 7.5mm footprint and 2.5mm profile, perfect for space-constrained designs. The two parts are pin compatible, allowing future upgrades from 0.5W to 1W if necessary. The DC/DCs are also partially pin compatible with the higher specification RECOM R05CT05S, which includes features such as remote on/off and reinforced isolation. Applications for the two ranges include isolated COM port power supplies, gate drive power, current sensing/smart metering, medical devices, industrial PLC (I/O), and sensors for IoT/IIoT.13.10.2021 12:30:00Octnews_2021-11-01_19.jpg\images\news_2021-11-01_19.jpghttps://recom-power.com/en/company/newsroom/news/rec-n-cost-efficient-soic-16-dc!sdc-range-added-178.html?3recom-power.com
Hitachi Energy Goes LiveSpeaking from its global headquarters in Zurich, S...9487Industry NewsHitachi Energy Goes LiveSpeaking from its global headquarters in Zurich, Switzerland, Claudio Facchin, CEO of Hitachi Energy, commented, "At Hitachi Energy, we are championing the urgency of a clean energy transition, through innovation and collaboration. There are many pathways towards a carbon-neutral future – to tackle this global challenge, we nurture diverse global teams bringing authentic passion and enduring ownership." He continued, "By 2050, global electrification will near-double in demand and electricity will be the backbone of the entire energy system. At Hitachi Energy we have pioneered many of the technologies needed for advancing a sustainable energy future for all – and we are committed to continue pushing the boundaries of innovation. Delivering on the promise of a carbon-neutral future will take passion, trust and innovation – and the benefits will be for our generations and those to come. With our new name – Hitachi Energy – we are broadening our commitment to creating real impact for our customers and partners, our people and society." Hitachi Energy is fostering collaboration with customers and partners to find global solutions to solve the global challenge of an inclusive and equitable carbon-neutral future. Earlier this year, the business launched EconiQ – its eco-efficient portfolio which delivers a superior environmental performance compared to conventional solutions. Its EconiQ high-voltage offering is proven to significantly reduce the carbon footprint throughout the total life-cycle. The business also recently launched a portfolio of transformer products for offshore floating applications, designed to overcome the challenging offshore environment and efficiently harvest and integrate wind into the global energy system, directly supporting the transition to a sustainable energy future. 13.10.2021 07:00:00Octnews_2021-11-01_2.jpg\images\news_2021-11-01_2.jpghttps://www.hitachienergy.com/news/press-releases/2021/10/hitachi-energy-goes-livehitachienergy.com
Power Device Division Opens Power Electronics Research LaboratoryHitachi's Power Device Division has opened a testi...9461Industry NewsPower Device Division Opens Power Electronics Research LaboratoryHitachi's Power Device Division has opened a testing laboratory based in Bracknell, UK. The company relocated its testing laboratory to larger premises, to expand its research and testing capabilities. The launch of the laboratory is an exciting time for the company as it can now supply a range of testing, offering a comprehensive suite of services for semiconductors; which can be used to investigate anything from power module fault analysis to customer application specific conditions. The facility will enable Hitachi to assist its customers with designing in and problem-solving for the full range of its power modules (750 V to 6.5 kV), through various tests including Double Pulse testing, Short circuit conditions, Paralleled power modules testing, and Gate Driver Performance. Hitachi is flexible in implementing any test requirements for its customers to support them in their design-in phase. Aligned with its test facility, the company has also launched an online power simulation tool. This simulation tool is designed to help assist engineers to choose the right Hitachi semiconductor suited to their particular application needs. The online simulation tool and further details of the laboratory can be found on the company's website.13.10.2021 06:00:00Octnews_2021-10-15_1.png\images\news_2021-10-15_1.pnghttps://pdd.hitachi.eu/pdd.hitachi.eu
Textbook "GaN Power Devices and Applications"Efficient Power Conversion announces the publicati...9484Product ReleaseTextbook "GaN Power Devices and Applications"Efficient Power Conversion announces the publication of a valuable learning resource for professional engineers, systems designers, and electrical engineering students seeking the latest information on gallium nitride technology and applications. Since the 2019 release of the 3rd edition textbook, "GaN Transistors for Efficient Power Conversion", published by J. Wiley, there has been rapid adoption of GaN transistors and integrated circuits into a wide range of end-use applications such as robots, drones, Artificial Intelligence (AI) computers, AC adapters, autonomous vehicles, and even vacuum cleaners.  This book, "GaN Power Devices and Applications", provides an update on gallium nitride technology and applications by leading experts. With contributions from nearly thirty industry and academic experts, and edited by Alex Lidow, this book starts with two years of new information on technology developments, design techniques, and reliability beginning right after the publication of the 3rd edition textbook. In a practical sense, this book includes detailed discussion and analysis of the latest examples of actual GaN usage in power supplies, lidar, motor drives, and low-cost satellite applications. According to Alex Lidow, EPC's co-founder and CEO, "The information contained in this new textbook will help users fully understand, by examples, the incredible contribution that GaN devices can make to innovative power systems. In addition, QR codes have been inserted at the beginning of each chapter of the book for so that readers can link to the very latest information on GaN as new it emerges."12.10.2021 17:30:00Octnews_2021-10-15_25.jpg\images\news_2021-10-15_25.jpghttps://epc-co.com/epc/EventsandNews/News/ArtMID/1627/ArticleID/3008/New-Textbook-GaN-Power-Devices-and-Applications-from-Efficient-Power-Conversion-EPC-Now-Available-.aspxepc-co.com
3D Hall-Effect Position Sensor for Faster Real-Time ControlWith Texas Instruments' 3D Hall-effect position se...9508Product Release3D Hall-Effect Position Sensor for Faster Real-Time ControlWith Texas Instruments' 3D Hall-effect position sensor, the TMAG5170, engineers can achieve uncalibrated ultra-high precision at speeds up to 20 kSPS for faster and more accurate real-time control in factory automation and motor-drive applications. The sensor also provides integrated functions and diagnostics to maximize design flexibility and system safety, while using at least 70% less power than comparable devices. The TMAG5170 is the first device in a new family of 3D Hall-effect position sensors that will meet a wide range of industrial needs – from ultra-high performance to general purpose. "Smart factories have an increasing number of highly automated systems that must operate in a more integrated manufacturing flow while simultaneously collecting data to control processes," said Noman Akhtar, senior research analyst, Omdia. "3D position-sensing technology that delivers higher accuracy, speed and power efficiency is essential for automated equipment to quickly deliver precise real-time control for increased system efficiency and performance while reducing downtime." The TMAG5170 is the industry's first 3D Hall-effect position sensor to provide a low 2.6% full-scale total error at room temperature. It also features best-in-class drift of 3% total error – 30% lower than the next closest competitor – along with at least 35% lower error than comparable devices in the presence of a cross-axis field. Together, these features enable the TMAG5170 to deliver higher accuracy than any other 3D Hall-effect position sensor, eliminating the need for end-of-line calibration and off-chip error compensation, and simplifying system design and manufacturing. To achieve faster, more accurate real-time control, the sensor supports measurements as high as 20 kSPS for low-latency throughput of high-speed mechanical motion.12.10.2021 15:30:00Octnews_2021-11-01_23.jpg\images\news_2021-11-01_23.jpghttps://news.ti.com/industrys-most-accurate-3d-hall-effect-position-sensor-provides-speed-and-precision-for-faster-real-time-controlti.com
PSMA White Paper - Energy Harvesting for a Green Internet of ThingsPSMA has announced the availability of a White Pap...9488Industry NewsPSMA White Paper - Energy Harvesting for a Green Internet of ThingsPSMA has announced the availability of a White Paper entitled "Energy Harvesting for a Green Internet of Things." This seminal work is the result of a multi-month effort by a dedicated team of 28 international experts from a variety of backgrounds in academia and industry, led by Dr. Michalis Kiziroglou from Imperial College London and Dr. Thomas Becker of Thobecore Germany. The PSMA Energy Harvesting Technical Committee supported this work and is responsible for making the White Paper available. The ubiquitous nature of energy autonomous microsystems, which are easy to install and simple to connect to a network, make them attractive in the rapidly growing Internet of Things (IoT) ecosystem. The growing energy consumption of the IoT infrastructure is becoming more and more visible and impactful. Energy harvesting describes the conversion of ambient energy into electricity, enabling green power supply of IoT key components such as autonomous sensor nodes. Energy harvesting could lead to a lower CO2 footprint of future IoT devices by adapting environmentally-friendly materials and reducing cabling and primary battery usage. The paper is available at no cost on the PSMA website Energy Harvesting Technical Forum at https://www.psma.com/technical-forums/energy-harvesting/whitepaper.12.10.2021 08:00:00Octnews_2021-11-01_3.png\images\news_2021-11-01_3.pnghttps://www.psma.com/technical-forums/energy-harvesting/whitepaperpsma.com
Small Signal Schottky and Switching DiodesVishay Intertechnolog introduced surface-mount sma...9500Product ReleaseSmall Signal Schottky and Switching DiodesVishay Intertechnolog introduced surface-mount small signal diodes in the compact DFN1006-2A plastic package with wettable flanks. Designed to save space and improve thermal performance in automotive and industrial applications, the 40 V BAS40L Schottky and 100 V BAS16L switching diodes are each available in AEC-Q101 qualified versions. Measuring only 1 mm by 0.6 mm by 0.45 mm, the diodes released today occupy 90 % less board space than devices in traditional SOD/T packages, while offering a 50 % lower profile and better power dissipation. For protection again excessive voltage, such as electrostatic discharges, the BAS40L features a PN junction guard ring. The BAS40L and BAS16L offer a moisture sensitivity level (MSL) of 1 in accordance with J-STD-020 and a UL 94 V-0 flammability rating. RoHS-compliant, halogen-free, and Vishay Green, the diodes support automated optical inspection (AOI) for automotive systems. Soldering can be checked by standard vision inspection; no X-ray is required.11.10.2021 08:30:00Octnews_2021-11-01_15.jpg\images\news_2021-11-01_15.jpghttps://www.vishay.com/company/press/releases/2021/BAS40L/vishay.com
AC Harmonic Filter CapacitorsCornell Dubilier announces its patented PCD series...9548Product ReleaseAC Harmonic Filter CapacitorsCornell Dubilier announces its patented PCD series of high current, AC harmonic filter capacitors offering dual, built-in, fail-safe protection systems, one at each end of the capacitor. Similar capacitors in this category have one open-circuit pressure device located under the top cover that requires the capacitor to be mounted from its bottom stud. With the addition of a bottom pressure device, the PCD's terminals can be fixed to a rigid busbar allowing for activation of the bottom safety device when proper clearance is provided at the bottom. When activated, the bottom pressure device expands outward like a bellows. While these fail-safe devices are designed to prevent case rupture at end-of-life, PCD series capacitors are designed to be exceptionally reliable with a service life of over 60,000 hours at rated voltage and temperature. Self-healing, metalized dielectric construction adds to their reliability. The PCD series is offered with capacitance ratings ranging from 20 µF to 125 µF at voltage ratings from 240 Vac to 600 Vac 50/60Hz. Case diameters vary from 63.5 to up to 116mm. Custom capacitance and voltage ratings, sizes, and performance characteristics are also available. Specific application conditions, especially harmonic content profiles, are needed to properly size the capacitors for peak performance. Standard terminations are M6x1 threaded, tin-plated brass. Other termination types are available.10.10.2021 12:30:00Octnews_2021-11-15_18.jpg\images\news_2021-11-15_18.jpghttps://www.cde.com/news/2021/10/type-pcdcde.com
High-Precision Voltage Reference IC Provides Very-Low DriftExtended-temperature-range voltage reference ICs f...9478Product ReleaseHigh-Precision Voltage Reference IC Provides Very-Low DriftExtended-temperature-range voltage reference ICs for automotive and industrial applications require low drift, high reliability and high performance. Microchip Technology announced today the release of a high-precision voltage reference (Vref) IC that meets these needs at a cost-effective price. The MCP1502 is an AEC-Q100 Grade 1 (-40°C to +125°C operating temperature range) automotive-qualified Vref with a maximum temperature coefficient of 7ppm/°C. "Microchip looked at the top four aspects that customers were requesting in a Vref and made a product that combines high reliability, small package size and high performance at a very cost-effective price," said Fanie Duvenhage, vice president of Microchip's mixed-signal and linear devices business unit. "This combination of features at this price is unmatched by competitors, especially when you add our experience in serving customers in the automotive and aerospace industries who require robust products for harsh environments." The MCP1502 is based on the already-proven MCP1501 Vref architecture, which has been in the market for more than five years. Packaged in a small six-lead SOT-23, the MCP1502 is an ideal choice for a wide variety of industrial, automotive and aerospace applications that require a high level of reliability. Microchip's MCP150x (MCP1501 and MCP1502) devices are perfect companions to Microchip's families of microcontrollers, ADCs and DACs, offering multiple voltage options for creating total system solutions that are suitable for a wide variety of applications that require stable, accurate and repeatable data conversion.07.10.2021 11:30:00Octnews_2021-10-15_19.jpg\images\news_2021-10-15_19.jpghttps://www.microchip.com/en-us/about/news-releases/products/high-precision-voltage-reference-ic-provides-very-low-drift-for-extended-temperature-automotive-applications#microchip.com
Low Phase Noise GaAs MMIC AmplifierRichardson RFPD announced the availability and ful...9476Product ReleaseLow Phase Noise GaAs MMIC AmplifierRichardson RFPD announced the availability and full design support capabilities for a gallium arsenide MMIC amplifier from Analog Devices. The ADL8150 is a self-biased GaAs MMIC, heterojunction bipolar transistor, low phase noise amplifier that operates from 6 GHz to 14 GHz. The amplifier has low phase noise of -172 dBc/Hz at 10 kHz offset and provides 12 dB of typical signal gain and +30 dBm typical output third-order intercept. The amplifier requires 74 mA from a 5 V collector supply voltage. The ADL8150 also features inputs and outputs that are internally matched to 50 ?, facilitating integration into multichip modules. The ADL8150 is versatile for a range of applications, including military and space, test instrumentation, and communications.06.10.2021 09:30:00Octnews_2021-10-15_17.jpg\images\news_2021-10-15_17.jpghttps://www.richardsonrfpd.com/docs/rfpd/Richardson_RFPD_Announces_Analog_Devices_ADL8150.pdfrichardsonrfpd.com
Energy Sharing Among Neighbors with Demand-Oriented Distribution for Solar EnergyIn order to meet Europe's (EU) ambitious climate t...9470Industry NewsEnergy Sharing Among Neighbors with Demand-Oriented Distribution for Solar EnergyIn order to meet Europe's (EU) ambitious climate targets, greenhouse gas emissions must be drastically reduced by 2030. To achieve this, around 28 million multi-family houses with over 80 million households must be equipped with photovoltaics. Despite the support of the EU, there are still enormous technical and regulatory obstacles, specifically with the power supply for small multi-family houses from renewable energy sources. In a cooperation with Infineon Technologies, Munich based start-up PIONIERKRAFT has overcome these hurdles with an innovative hardware and service solution coined PIONIERKRAFTwerk (German only). This technology enables self-produced solar energy to be distributed physically and by demand between different households. With Infineon's support, renewable energy can then be shared with neighbors in a decentralized manner and without intermediate storage – economically and without bureaucratic obstacles. The hardware of the participating parties is connected to the platform provided by PIONIERKRAFT using the Internet. This determines the power surplus of the generator as well as the current demand of neighbors to autonomously control the distribution process. Thus, households without a photovoltaic system can use solar power. The solution also regulates the power flows without using the public grid. Several Infineon components make this possible, including the discrete CoolSiC MOSFET IMBG120R030M1H in the surface-mount D2PAK-7L package and the EiceDRIVER Compact Gate Driver 1ED3122MU12H. By working together, the PIONIERKRAFTwerk performs efficient and bidirectional power transfer. Therefore, energy with a power of up to 2000 W can be transferred between households.05.10.2021 15:00:00Octnews_2021-10-15_10.jpg\images\news_2021-10-15_10.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2021/INFIPC202110-003.htmlinfineon.com
1200V Silicon Carbide Half Bridge Power ModuleSolitron has developed the SD11900 series, a 1200V...9475Product Release1200V Silicon Carbide Half Bridge Power ModuleSolitron has developed the SD11900 series, a 1200V, 50A power module platform to maximize the benefits of SiC, with a unique robust, simple, and cost-effective module format. The 37mm x 25mm outline is a fraction of the size and weight of standard 62mm modules. The SD11900 series maximizes power density while minimizing loop inductance with a pin configuration to allow simple power bussing. The SD11902/3/4/5 are half bridge configurations with two 1200V 32mO SiC MOSFETs. The SD11902 and SD11904 feature freewheeling 1200V SiC Schottky diodes in parallel with the MOSFETs inside the module. Two pinout configurations provide flexible power bussing options. Continuous drain current is specified at 50A. The SD11900 series is designed for demanding applications such as avionics based electromechanical actuators and power converters. With operating temperatures of -55°C to 175°C, construction includes copper baseplates and Alumina Nitride insulators ensuring TCE matching and high thermal transfer. Isolated integrated temperature sensing enables high level temperature protection. Silicon Carbide provides excellent switching performance versus the best-in-class silicon MOSFETs and IGBTs with minimal variation versus temperature. Higher efficiency levels than silicon due to significantly lower energy loss and reverse charge results in more switching power and less energy required in the switch-on and switch-off phase. Combined with high switching frequencies this translates to smaller magnetics significantly reducing system weight and size.04.10.2021 08:30:00Octnews_2021-10-15_16.jpg\images\news_2021-10-15_16.jpghttps://solitrondevices.com/solitron-devices-announces-1200v-silicon-carbide-half-bridge-power-module/solitrondevices.com
Successful Transition to Global Semiconductor PowerhouseFollowing a massive four-year transformation, invo...9463Industry NewsSuccessful Transition to Global Semiconductor PowerhouseFollowing a massive four-year transformation, involving the divestiture of two-thirds of the business and a repositioning of the company's overall core strategy, October 4th marks the creation of Wolfspeed. The company, formerly known as Cree, officially launches under its new name with the support of a comprehensive, multi-channel, integrated marketing campaign. Wolfspeed has served as the brand for the company's Silicon Carbide materials and semiconductor devices business unit for the past six years. Built on a 30-year heritage of domain expertise, the name Wolfspeed conveys both the noble traits of the wolf – leadership, intelligence and endurance – and speed, characterized by the pace at which the company innovates and operates, both unmatched in the industry. "Today officially marks a transformative milestone for Wolfspeed as we are now a pure-play global semiconductor powerhouse," said Gregg Lowe, CEO at Wolfspeed. "The next generation in power semiconductors will be driven by Silicon Carbide technology, with superior performance that unleashes new possibilities and positive changes to the way we live. As the original champion of this technology, we couldn't be more excited for what lies ahead." Lowe joined the company in September 2017 with a vision and commitment to a more collaborative culture built on ingenuity and a mission to pursue a more efficient future. Now, with multi-year, long-term materials agreements totaling more than $1.3 billion across several industries, a device pipeline that totals more than $15 billion, and an increased production capacity 30X larger than previous facility plans, Wolfspeed is driving multiple industries through a monumental shift from silicon to Silicon Carbide.04.10.2021 08:00:00Octnews_2021-10-15_3.jpg\images\news_2021-10-15_3.jpghttps://www.wolfspeed.com/company/news-events/news/cree-inc-officially-changes-company-name-to-wolfspeed-inc-marking-successful-transition-to-global-semiconductor-powerhousewolfspeed.com
Webpage-Launched Simulator AvailableThe latest in a long line of Vincotech simulation ...9480Product ReleaseWebpage-Launched Simulator AvailableThe latest in a long line of Vincotech simulation environments, VINcoSIM is the first simulator to launch from a webpage. It features topology modeling and an accurate, proven loss and temperature calculation engine. Users can even define custom heatsink builds in a one-step configuration. A click or two is all it takes to quickly assess the options and choose the best fit. "This tool is a great leap forward," says Vincotech CEO Eckart Seitter. "As a reliable partner, we aim to bring speed and flexibility to our business relationships. Part of that is helping customers make fast but well-informed decisions. We have always gone to great lengths to provide accurate, reliable simulation tools. And VINcoSIM is our most powerful and convenient power module selection tool yet." The company's first ISE simulation tool debuted 20 years ago, setting a benchmark for customer support in the power module business. Drawing on two decades' experience advancing the state of the art in simulation tools, the company has now created an easy-to-use environment to rapidly test and evaluate any of its power modules, regardless of sub-topology or components. No compromises in functions or features is demanded. Designed to fast-track simulations, VINcoSIM configures automatically when the user selects a product on the website. It is the only tool of its kind to simulate any type of topology, even the most advanced. VINcoSIM runs on substantiated data from measurements taken in high-tech labs. It is reliable; its results are accurate.01.10.2021 13:30:00Octnews_2021-10-15_21.jpg\images\news_2021-10-15_21.jpghttps://www.vincotech.com/news/company-news/article/vincotech-rolls-out-new-online-simulation-tool.htmlvincotech.com
Facilities with 200kW Dyno and 250 kW DC Power SupplyPre-Switch has expanded into a new facility. The p...9472Industry NewsFacilities with 200kW Dyno and 250 kW DC Power SupplyPre-Switch has expanded into a new facility. The premises will support the next phase of the company's growth and accelerate the application of the Pre-Switch technology which extends the range of e-mobility applications including EVs, electric aircraft and electric boats and other watercraft. The technology has been licensed and delivered via the CleanWave inverter reference design to leading e-mobility innovators around the world. Pre-Switch's new facility, in San Jose, California, has been outfitted with a 200kW dynamometer, a 250kW DC power supply and high precision efficiency test stations that have been custom-built to precisely measure inverter efficiencies above 99%.  This new and valuable resource will enable customers to experience the gains that can be achieved by running their inverters at 100kHz with virtually zero switching losses, and measure the motor efficiencies that result from the higher quality sine wave generated by the faster switching frequencies. Bruce Renouard, Pre-Switch CEO explains: "Inverter efficiency is vital, but in many applications, motor efficiency, especially at low torque where the motor mainly operates, is even more important. Only our soft-switching technology can deliver both, unlike hard-switching techniques which cannot get close to matching our system efficiency levels."30.09.2021 18:00:00Sepnews_2021-10-15_13.jpg\images\news_2021-10-15_13.jpghttps://www.pre-switch.com/pre-switch.com
Josef Vissing Named PresidentTDK Corporation announced that effective October 1...9471PeopleJosef Vissing Named PresidentTDK Corporation announced that effective October 1, 2021, Josef Vissing  (57) has been named President of TDK Europe GmbH, the company's European sales organization for passive components. He thus succeeds Ludger Trockel (57), who will take over the role as Head of Sales & Marketing Group of TDK Corporation's Electronic Components Business Company in Japan, Tokyo. TDK Europe's management team also includes Oliver Huettner (49). Huettner, Executive Vice President, will serve as the TDK Europe Head of Business Administration. The two are in full agreement: "TDK Europe's established set-up enables us to offer the best support for our European customers with a unique product portfolio centered on TDK's three key markets, Automotive, Industrial & Home Appliance and Communications. We aim to continue to grow the business together with our customers and support the growth strategies of TDK Corporation related to digital transformation and energy transformation of our society." Josef Vissing has held a number of sales positions at TDK Europe and EPCOS AG, since he joined the company in 1991 with a Diploma degree in industrial engineering. Since then, Vissing has acquired many years of business experience, among others as Head of Product Marketing for Ferrites, Head of Business Unit Transfomers and as CEO and President of EPCOS (Zhuhai) Co. in China. In 2012 he was named Head of Sales GNS (Germany, Netherlands, Switzerland) for EPCOS AG and in this capacity has been responsible for one of the company's most important sales regions.30.09.2021 17:00:00Sepnews_2021-10-15_12.jpg\images\news_2021-10-15_12.jpghttps://www.tdk-electronics.tdk.com/en/373388/company/press-center/press-releases/press-releases/josef-vissing-new-president-of-tdk-europe/3025452tdk-electronics.tdk.com
Wireless Charging Transmitter SolutionsAlpha and Omega Semiconductor announced a family o...9474Product ReleaseWireless Charging Transmitter SolutionsAlpha and Omega Semiconductor announced a family of Coil Drivers. The initial product, AOZ32033AQI, offers 30V, 11mOhm in a QFN3x3 package. AOZ32033AQI is an integrated half-bridge gate driver capable of driving high-side and low-side N-channel MOSFETs. It features SRC (Slew Rate Control) to adjust sink/source current and provide the ideal trade-off between efficiency and EMI optimization in the design of Wireless Charging Transmitter (TX) circuits. The device is ideally suited to the design of Wireless Charging TX circuits used in cordless power tools, vacuum cleaners, drones, and other consumers' electronic equipment composed of full-bridge topology with a resonant tank circuit to get the best power conversion efficiency. With a highly integrated package, the AOZ32033AQI offers a part count reduction of up to 40% compared to traditional approaches. The device enables PCB space savings and higher performance in wireless transmitter circuits with high wattage of up to 30W. Moreover, the AOZ32033AQI has multiple protection functions such as high side and low side UVLO and over-temperature protection (OTP) to make the design more robust. The device can be used for a wide range of input voltages from 4V to 28V. "Wireless charging is offered at increasingly higher power levels as the benefits of eliminating physical connectors and cables are being realized by more end applications. AOS's Coil Driver products provide an efficient, power-dense, and cost-effective solution for wireless charging TX circuits. The integrated approach offers protection features not possible by using a discrete approach while reducing engineering design cycles and complexities," said Colin Huang, Power IC Marketing Manager at AOS.30.09.2021 07:30:00Sepnews_2021-10-15_15.jpg\images\news_2021-10-15_15.jpghttp://www.aosmd.com/res/news/news-article-1633015195422/AOZ32033AQI_PR.pdfaosmd.com/pdf
Charger Delivers 100km of Range in Less Than Three MinutesABB is launching an all-in-one Electric Vehicle (E...9473Product ReleaseCharger Delivers 100km of Range in Less Than Three MinutesABB is launching an all-in-one Electric Vehicle (EV) charger, which provides the fastest charging experience on the market. ABB's Terra 360 is a modular charger which can simultaneously charge up to four vehicles with dynamic power distribution. This means that drivers will not have to wait if somebody else is already charging ahead of them. They simply pull up to another plug. The charger has a maximum output of 360 kW and is capable of fully charging any electric car in 15 minutes or less, meeting the needs of a variety of EV users, whether they need a fast charge or to top their battery up while grocery shopping. "With governments around the world writing public policy that favors electric vehicles and charging networks to combat climate change, the demand for EV charging infrastructure, especially charging stations that are fast, convenient and easy to operate is higher than ever," said Frank Muehlon, President of ABB's E-mobility Division. "The Terra 360, with charging options that fit a variety of needs, is the key to fulfilling that demand and accelerating e-mobility adoption globally." "It's an exciting day for ABB, who as the global leader in electric vehicle fast charging, is playing a key role in enabling a low carbon society," said Theodor Swedjemark, Chief Communications and Sustainability Officer at ABB.30.09.2021 06:30:00Sepnews_2021-10-15_14.jpg\images\news_2021-10-15_14.jpghttps://new.abb.com/news/detail/82941/abb-launches-the-worlds-fastest-electric-car-chargerabb.com
Power Integrity Solution for Analog, Digital and Mixed-Signal IC DesignsSiemens Digital Industries Software introduced mPo...9449Product ReleasePower Integrity Solution for Analog, Digital and Mixed-Signal IC DesignsSiemens Digital Industries Software introduced mPower power integrity software for analog, digital and mixed signal IC designs. The software is an IC power integrity verification solution to provide virtually unlimited scalability for analog, digital, and mixed signal ICs, enabling comprehensive power, electromigration (EM) and voltage drop (IR) analysis for even the largest IC designs. The mPower power integrity solution completes Siemens' overall electro-physical signoff suite addressing power, performance, and reliability analysis. Other offerings in this suite include Calibre PERC software, PowerPro software, HyperLynx software, and the Analog FastSPICE platforms. With this comprehensive signoff suite, designers can now use an all-Siemens power integrity design flow. "Design companies must run both block and full-chip EM/IR analysis to confirm that the power grid delivers the necessary current to the devices, and that wires will not fail prematurely," said Joe Sawicki, executive vice president for Siemens' IC EDA Segment. "With our innovative mPower solution, companies now have a fast, scalable dynamic analysis option for analog, digital and mixed signal layouts of any size, as well as silicon-proven accuracy and fast turns for even the largest digital chips."28.09.2021 08:30:00Sepnews_2021-10-01_13.jpg\images\news_2021-10-01_13.jpghttps://www.plm.automation.siemens.com/global/en/our-story/newsroom/siemens-mpower-power-integrity-analysis/101904siemens.com
Semiconductor R&D and Test Open LaboratoryKeysight Technologies and National Central Univers...9445Industry NewsSemiconductor R&D and Test Open LaboratoryKeysight Technologies and National Central University Optical Sciences Center (NCUOSC) announced a collaboration to improve the design and test validation efficiency of gallium nitride (GaN) and silicon carbide (SiC) applications, accelerating the pace of 5G and electric vehicle (EV) innovation. Wide band gap (WBG) materials, such as GaN and SiC, offer rapid switching speeds, low loss and withstand high temperature and voltage characteristics. As a result, these materials are leveraged in consumer power products, fast charging, electric vehicles and rail transit, as well as 5G infrastructures and data center servers. However, these advantages increase the complexity of design and testing. NCUOSC successfully used Keysight's PD1500A Dynamic Power Device Analyzer/Double Pulse Tester (DPT) platform to establish a third generation WBG semiconductor open laboratory to improve developing and testing efficiency. As the JEDEC, a global leader in developing open standards and publications for the microelectronics industry, continues to define the dynamic testing of WBG devices, standardized tests are starting to emerge. The Keysight PD1500A DPT determines the key performance parameters, which match all standards, such as turn-on/off and switching characteristics, dynamic on-resistance, dynamic current and voltage, as well as reverse recovery, gate charge and device output characteristics. "Keysight is happy to work with NCUOSC to help engineering teams characterize, understand, integrate, deploy and drive innovations for next-generation semiconductor technologies," said Thomas Goetzl, vice president and general manager of Keysight's Automotive and Energy Solutions business unit.27.09.2021 14:00:00Sepnews_2021-10-01_9.png\images\news_2021-10-01_9.pnghttps://www.keysight.com/de/de/about/newsroom/news-releases/2021/0927-nr21131-keysight-technologies--national-central-university-.htmlkeysight.com
Entire Capacitor Portfolio on One WebsiteCornell Dubilier has brought its Illinois Capacito...9469Industry NewsEntire Capacitor Portfolio on One WebsiteCornell Dubilier has brought its Illinois Capacitor brand capacitors to cde.com. Now engineers can view the entire portfolio of CDE and IC capacitors for power electronics applications on one site. This includes such specialized products as IC's supercapacitors, conduction-cooled (high density resonant) capacitors, rechargeable coin cell batteries, and other new additions. CDE's updated parametric search tools simplify the capacitor selection process as never before. As Illinoiscapacitor.com has now been shut down, links to that site will be automatically redirected to cde.com. In addition to combining product data, the site's Tech Center has been expanded to include additional engineering resources, such as application guides, capacitor formulas, tutorials, and a detailed glossary of terms. CDE will continue to support all IC branded products, which are available from major distributors and the company's representative network.27.09.2021 14:00:00Sepnews_2021-10-15_9.jpg\images\news_2021-10-15_9.jpghttps://www.cde.com/cde.com
3kW AC/DC PSU for Power Supply ApplicationsGaN Systems introduced a high efficiency, highest ...9483Product Release3kW AC/DC PSU for Power Supply ApplicationsGaN Systems introduced a high efficiency, highest power density 3kW Bridgeless Totem Pole (BTP) PFC + LLC Resonant Converter Power Supply Unit (PSU) that exceeds the 80 PLUS Titanium standard. The combined GaN BTP-PFC with GaN LLC resonant converter enables designers to create lower-cost power supplies that meet demands to deliver more power in a smaller footprint and new energy efficiency requirements, including European Union's "Lot 9" 2023. "With the expanding volume of data, game-changing solutions are needed to reduce energy consumption and contribute to a more sustainable future in our data centers, and these PFC and LLC reference designs take PSUs to the next level," says Paul Wiener, VP of Strategic Marketing at GaN Systems. New efficiency mandates, increasing power and data demands, and the shift to "Dollar per Density," where density is a measure of size and power of the power supply, spur the immediate need to change data center economics with smaller, more efficient, and reliable power supply design. GaN brings higher efficiency, higher power density, lower cost, and increased sustainability to the data center ecosystem. GaN Systems concluded that significant energy and cost savings are achieved by switching from silicon-based PSUs to GaN-based PSUs. Since data centers vary in size, the savings are based on a 10-Rack unit of measure. From a sustainability perspective, each set of 10 racks reduces CO2 emissions by 100 metric tons per year, and financially, GaN-based PSUs increase data center profits by $3 million per year.    23.09.2021 16:30:00Sepnews_2021-10-15_24.png\images\news_2021-10-15_24.pnghttps://gan-systems.reportablenews.com/pr/3kw-ac-dc-psu-from-gan-systems-shatters-size-and-cost-barriers-for-power-supply-applicationsgan-systems.com
300mm, High-Temp Single-Wafer SPMACM Research announced it has shipped its first 30...9440Industry News300mm, High-Temp Single-Wafer SPMACM Research announced it has shipped its first 300mm single-wafer Sulfuric Peroxide Mixture systems (Single-Wafer SPM tool) for wet clean and etch processes in advanced logic, DRAM and 3D-NAND integrated circuit manufacturing. ACM's Single-Wafer SPM tool targets high ion dose doped photoresist (PR) wet strip processes, with support for metal etch or strip processes. This tool extends ACM's SPM product offering to include higher temperature SPM steps that are emerging for more advanced production nodes at 10nm and beyond. "ACM's Single-Wafer SPM tool builds on the proven performance of our Ultra C Tahoe, which addresses most SPM process steps that operate at regular temperatures," said Dr. David Wang, Chief Executive Officer and President of ACM Research. "We have leveraged Tahoe's proven capabilities to develop the Single-Wafer SPM tool, strengthening our wet cleaning portfolio with the addition of high-temperature SPM. Together, the Tahoe and Single-Wafer SPM tools address virtually all SPM processes currently deployed in advanced semiconductor manufacturing.   We continue to develop new process capabilities, including advanced hot isopropyl alcohol (IPA) drying and super critical CO2 dry technologies, with the goal of becoming a major global cleaning solution provider."23.09.2021 09:00:00Sepnews_2021-10-01_4.png\images\news_2021-10-01_4.pnghttps://ir.acmrcsh.com/news-releases/news-release-details/acm-research-ships-its-first-300mm-high-temp-single-wafer-spmacmrcsh.com
AEC-Q200 Qualified Thick Film Chip ResistorVishay Intertechnology announced that it has enhan...9460Product ReleaseAEC-Q200 Qualified Thick Film Chip ResistorVishay Intertechnology announced that it has enhanced the Vishay Draloric RCC1206 e3 thick film chip resistor in the 1206 case size with a higher power rating of 0.5 W. Offering twice the power of standard thick film chip resistors in this size, the RCC1206 e3 can be used in place of two parallel 1206 devices or a single device in the larger 1210 case size. This allows designers to save board space in automotive, industrial, telecommunications, and medical applications, while lowering component counts and reducing placement costs. AEC-Q200 qualified, the RCC1206 e3 features a resistance range from 1 O to 1 MO -and 0 O jumper - with tolerances of ± 1 % and ± 5 % and TCR of ± 100 ppm/K and ± 200 ppm/K. The resistor offers an operating voltage of 200 V and an operating temperature range of -55 °C to +155 °C. RoHS-compliant and halogen-free, the device is suitable for processing on automatic assembly systems, and wave, reflow, or vapor phase soldering per IEC 61760-1.22.09.2021 19:30:00Sepnews_2021-10-01_24.jpg\images\news_2021-10-01_24.jpghttps://www.vishay.com/company/press/releases/2021/RCC1206e3/vishay.com
Wireless BMS in Lotus Electric VehiclesAnalog Devices announced that renowned British per...9444Industry NewsWireless BMS in Lotus Electric VehiclesAnalog Devices announced that renowned British performance brand Lotus Cars is planning to incorporate ADI's wireless battery management system (wBMS) in its next-generation electric vehicle (EV) architecture. ADI's wBMS was selected for its increased design flexibility, battery repairability and lighter weight. The engineering collaboration will enable Lotus to safely propel its future EV fleet and continue pushing the limits of design and technology. ADI's wBMS technology eliminates the traditional wired harness, leading to a reduction of up to 90% in the wiring and 15% of the volume in the battery pack. It also improves design flexibility and manufacturability, without compromising range and state of charge accuracy over the life of the battery. ADI's wBMS enables simplified assembly and disassembly of battery packs to ensure faulty battery cells can be removed and repaired quickly and efficiently. "We worked closely with Analog Devices to integrate wBMS into our new Lightweight Electric Vehicle Architecture (LEVA), which will be the basis for all future Lotus EVs," said Richard Lively, Director, Propulsion and Chassis Engineering, Lotus Cars. "The removal of the wire harness for wBMS ensures that Lotus can offer a lightweight solution that optimizes performance and is consistent with our brand of delivering powerful performance cars with exceptional handling."22.09.2021 13:00:00Sepnews_2021-10-01_8.jpg\images\news_2021-10-01_8.jpghttps://www.analog.com/en/about-adi/news-room/press-releases/2021/9-22-2021-adi-wireless-bms-helps-lotus-cars-redefine-mobility.htmlanalog.com
Joint Venture to Manufacture and Sell Lithium-ion Dry-Process Battery SeparatorsPolypore International and Shanghai Energy New Mat...9443Industry NewsJoint Venture to Manufacture and Sell Lithium-ion Dry-Process Battery SeparatorsPolypore International and Shanghai Energy New Materials Technology reached agreement in January 2021, through their respective subsidiaries, to establish a joint venture (JV) in China for dry-process membrane separator for lithium-ion batteries (LIBs). The necessary regulatory approvals are complete, and the JV has been established as Jiangxi Enpo New Materials in Gaoan City, Jiangxi Province, People's Republic of China. Based on a license from Polypore's subsidiary Celgard, LLC (Celgard) for technology and intellectual property related to dry-process polypropylene (PP) separator, the JV will manufacture and sell quality, high-performance dry-process separator in China for LIBs used in energy storage systems (ESS) and electric-drive vehicles (EDVs). Production is scheduled to start in 2022 with PP membrane capacity of 100 million m2/year. In the joint venture, PPO Energy Storage Materials HK Ltd. will have 49 percent of the equity contribution and SEMCORP will have 51 percent. "By joining Celgard's specialized knowledge in technology, processing, and material science together with SEMCORP's operational expertise in China, the joint venture will not only provide a wide range of solutions to customers but also stimulate further development of the LIB industry overall," said Celgard president, Lie Shi. "I am thrilled to begin this partnership with SEMCORP. The combination of our two companies' strengths will provide new solutions for the world's challenges related to the environment and energy."22.09.2021 12:00:00Sepnews_2021-10-01_7.jpg\images\news_2021-10-01_7.jpghttps://polypore.com/news/press-releases/polypore-establishes-joint-venture-to-manufacture-and-sell-lithium-ion-dry-process-battery-separators-in-china/polypore.com
APEC 2022 Sponsors Continue Student Attendance Support ProgramThe joint sponsors of the Applied Power Electronic...9467Event NewsAPEC 2022 Sponsors Continue Student Attendance Support ProgramThe joint sponsors of the Applied Power Electronics Conference (APEC) have announced the continuation of the popular Student Attendance Support Program for APEC 2022, scheduled to take place in Houston, March 20-24. Chosen recipients of the program will receive reimbursement to cover qualified expenses for attending APEC 2022. Those eligible to apply for the program are power electronics students, undergraduate or graduate, who have been accepted to present papers at the upcoming conference in March (notification of paper acceptance is by Oct. 27, 2021.) Once accepted, student presenters must apply for the Student Attendance Support Program by November 7, 2021. In its 17th year, this popular program was initiated by the Power Sources Manufacturers Association (PSMA). It is now jointly underwritten by PSMA and the other co-sponsors of the APEC conference: the IEEE Power Electronics Society (PELS) and the IEEE Industry Applications Society (IAS). The recipients of the Student Attendance Support Program will be chosen by the APEC 2022 Student Attendance Support Committee.22.09.2021 12:00:00Sepnews_2021-10-15_7.jpg\images\news_2021-10-15_7.jpghttp://apec-conf.org/news/apec-2022-sponsors-continue-student-attendance-support-program/apec-conf.org
Funding Round to Revolutionize Magnetics with AI TechnologyThe Madrid-based company Frenetic announced its cl...9462Industry NewsFunding Round to Revolutionize Magnetics with AI TechnologyThe Madrid-based company Frenetic announced its closing of a €4.5 million funding round from Bonsai Partners (Spain) and Join Capital (Germany), which boosts existing support from 42Cap (Germany), Big Sur Ventures (Spain) and Bankinter (Spain) from 2019. Frenetic's AI technology has been trained to accurately design both magnetic and electronic components essential for the development of electric vehicles. In addition, through its unique technology and stock search, Frenetic tackles issues involving scarcity of chip supplies and magnetic components. The company plans to utilize this funding round to continue expansion in the US and Germany. Frenetic was founded with the goal of making magnetics simple and accessible. It is now revolutionizing the world of magnetics through AI, aiming to entirely replace outdated engineering models used in a wide range of cases - from electric chargers to space travel. Frenetic validated its technology through participation in the 2020 'Accelerator Pilot' – a program from the European Commission dedicated to the empowerment of European companies, and in which only 0.1% of applications receive community support. Chema Molina, Frenetic's CEO, who founded the company in 2018, says of the round: "This latest funding from Join and Bonsai will allow us to expand in the US and German markets with local subsidiaries, and ultimately be closer to customers. Likewise, we will be able to strengthen our relationships with manufacturers."22.09.2021 07:00:00Sepnews_2021-10-15_2.jpg\images\news_2021-10-15_2.jpghttps://frenetic.ai/frenetic.ai
Wide-Input DC to DC Converter LineAcopian launched their encapsulated wide input DC ...9454Product ReleaseWide-Input DC to DC Converter LineAcopian launched their encapsulated wide input DC to DC Converter line of power supplies rated up to 60W. Wide-range DC inputs are set at 9-18 VDC, with output voltages ranging from 3.3 VDC to 48 VDC and up to 8A. Threaded mounting holes permit them to be mounted to a chassis, cabinet wall or bracket, they can be DIN RAIL mounted or they may be used on a test bench or tabletop. Touch safe terminal blocks provide easy connection without the need for sockets or soldering. Input/Output isolation prevents ground loops, and permits the use of inputs of either polarity; outputs of single output models may be used in either polarity and floated up to 500 volts above the input. Standard features include OVP internal protection, Input/Output isolation, short circuit protection and ability to operate in series. Optional output indicator (DC ON LED) and voltage adjust potentiometer are also available. Thermal protection and rugged encapsulated construction assure years of reliable service. These DC to DC converters are suitable for use in a broad range of applications including automotive, ATE, OEM, military and industrial/manufacturing applications.21.09.2021 13:30:00Sepnews_2021-10-01_18.jpg\images\news_2021-10-01_18.jpghttps://www.acopian.com/dcdc-termblock-m.htmlacopian.com
Technologists Recognized with Industry Honors for Advancements in Semiconductor MaterialsDuPont Electronics & Industrial announced that thr...9468PeopleTechnologists Recognized with Industry Honors for Advancements in Semiconductor MaterialsDuPont Electronics & Industrial announced that three of its scientists in its Semiconductor Technologies business group have recently been honored with industry recognitions for their work in developing materials for advanced semiconductor fabrication. In July 2021, Emad Aqad, Ph.D., was recognized with the 2020-2021 Asian American Most Promising Engineer of the Year Award. The Asian American Engineer of the Year Award (AAEOY) program is a recognition established to honor the most distinguished US-based professionals for their leadership, technical achievements and public service. In August 2021, Alaaeddin Alsbaiee, Ph.D., was named to the 2021 Chemical & Engineering News' (C&EN) Talented 12.? The C&EN Talented 12 program recognizes early career scientists who are making their mark on industry and global challenges. Most recently, Jae Hwan Sim, Ph.D., was named an International Fellow of the Industrial & Engineering Chemistry (I&EC) Division of the American Chemical Society (ACS). The I&EC Division of ACS has a focus on helping individuals convert science into commercially relevant products. "These prestigious third-party recognitions are a true testament to the caliber of our talent globally and their wide-reaching industry impact," said Cathie Markham, vice president of R&D, DuPont Electronics & Industrial. "We are incredibly proud of the achievements of all three of these individuals, and the passionate spirit that they bring to our teams in driving the development of novel materials and continued enhancements for semiconductor fabrication."21.09.2021 13:00:00Sepnews_2021-10-15_8.png\images\news_2021-10-15_8.pnghttps://www.dupont.com/electronic-materials/news/2021/press-releases/20210921-three-dupont-technologists-recognized-with-industry-honors.htmldupont.com
Tiny Power Management IC for Wearables and HearablesThe MAX77659 single-inductor multiple output (SIMO...9451Product ReleaseTiny Power Management IC for Wearables and HearablesThe MAX77659 single-inductor multiple output (SIMO) power management IC (PMIC) with integrated switch-mode buck-boost charger from Analog Devices charges wearables, hearables and Internet of Things (IoT) devices faster and in less space than any other PMIC available today. The MAX77659 SIMO PMIC delivers over four hours of play time after a short, ten-minute charge, and uses a single inductor to power multiple rails, reducing the bill of materials (BOM) by 60 percent and shrinking total solution size by 50 percent. The MAX77659 SIMO PMIC integrates a switch-mode buck-boost charger and three independently programmable buck-boost regulators, all sharing a single inductor to minimize total solution size. The regulators extend battery life by operating at 91 percent efficiency during moderate to heavy load conditions while consuming only 5µA of quiescent current during light load conditions. The MAX77659 SIMO PMIC supports autonomous headroom control, which reduces heat dissipation by minimizing the voltage drop while providing enough headroom to regulate the charging current. "Analog Devices' SIMO product technology shrinks size and boosts performance in the smallest of hearable and wearable devices," said Roger Yeung, Executive Business Manager for the Battery Power Solutions Business Unit at Maxim Integrated, now part of Analog Devices. "The MAX77659 brings the 'on-the-go' lifestyle to the next level by minimizing plug-in time and maximizing play time. The MAX77659 PMIC frees up board real estate to pack in additional features such as expanded memory storage, location tracking and vital sensing demanded by today's portable consumer and medical devices."21.09.2021 10:30:00Sepnews_2021-10-01_15.jpg\images\news_2021-10-01_15.jpghttps://www.maximintegrated.com/en/aboutus/newsroom.html/pr_123487000maximintegrated.com
eGaN FET for Telecom, Netcom, and Computing SolutionsEfficient Power Conversion Corporation advances th...9448Product ReleaseeGaN FET for Telecom, Netcom, and Computing SolutionsEfficient Power Conversion Corporation advances the performance capability of low voltage, off-the-shelf gallium nitride transistors with the introduction of the EPC2069 (1.6 m? typical, 40 V) eGaN FET. The EPC2069 is ideal for applications with demanding requirements for high power density performance including 48 V – 54 V input servers. Lower gate charges and zero reverse recovery losses enable high frequency operation of 1 MHz, and beyond, at high efficiency in a tiny 10.6 mm2 footprint for state-of-the-art power density. The EPC2069 can support 48V – 12V DC-DC solutions ranging from 500 W to 2 kW and exceed 98% efficiency. The use of eGaN devices in both the primary side and the secondary side are required to achieve maximum power density > 4000 W/in3. According to Alex Lidow, EPC's co-founder and CEO, "The EPC2069 is perfectly designed for the secondary side of the LLC DC-DC converter from 40 V – 60 V to 12 V, which is becoming very common for the new 48 V – 54 V input servers required for high density computing applications such as artificial intelligence and gaming. This 40-volt device offers both smaller size and reduced parasitics compared with previous-generation 40 V GaN FETs and at lower cost."21.09.2021 07:30:00Sepnews_2021-10-01_12.jpg\images\news_2021-10-01_12.jpghttps://epc-co.com/epc/EventsandNews/News/ArtMID/1627/ArticleID/3001/Efficient-Power-Conversion-EPC-Expands-40-V-eGaN-FET-Product-Line-with-Device-Ideal-for-High-Power-Density-Telecom-Netcom-and-Computing-Solutions.aspxepc-co.com
GaN Technology in Server Power Supplies for Data CentersTexas Instruments announced its gallium nitride (G...9446Industry NewsGaN Technology in Server Power Supplies for Data CentersTexas Instruments announced its gallium nitride (GaN) technology and C2000 real-time microcontrollers (MCUs) are being combined with Delta Electronics' power electronics expertise in the design of an enterprise server power-supply unit (PSU) featuring an 80% improvement in power density with 1% better efficiency - up to 99.2% - for data center applications, compared to enterprise server power supplies using a traditional architecture. A 1% improvement equals 1-megawatt (or 800 households) total cost of ownership savings per data center, according to Energy Innovation. Delta Electronics chose TI due to its decade-long investment in GaN technology as well as its real-time control solution with C2000 MCUs. TI uses innovative semiconductor manufacturing processes to manufacture GaN-on-silicon technology and integrated circuits (ICs) to help companies such as Delta Electronics create differentiated applications to more efficiently power data centers around the world. "Our passion at TI is to create a better world by making electronics more affordable through semiconductors, and our GaN technology enables a whole new world of higher efficiency and smaller, more reliable solutions," said Steve Lambouses, vice president for High Voltage Power at TI. "In addition to technology investments, TI's investments in internal manufacturing will allow new technologies like GaN to scale quickly and support customers like Delta."  20.09.2021 15:00:00Sepnews_2021-10-01_10.jpg\images\news_2021-10-01_10.jpghttps://news.ti.com/ti-brings-power-gan-technology-to-delta-electronics-energy-efficient-server-power-supplies-for-data-centersti.com
Metal Enclosed AC/DC Power SuppliesThe Traco TXLN line comprises a series of metal en...9481Product ReleaseMetal Enclosed AC/DC Power SuppliesThe Traco TXLN line comprises a series of metal enclosed AC/DC power supplies ranging from 18 to 960 Watt (split into 12 different power levels) and is designed for a wide range of industrial applications. The TXLN is an active replacement of the older TXL line and is built on the same design principals to make the transition to the TXLN series as easy as possible. The model selection includes single, dual as well as triple output solutions to cover different applications requirements. With a low-profile metal case and screw terminal block connection, they are easy to install in any equipment. Up to the 200 Watt models the TXLN power supplies are completely convection cooled and from 320 Watt and above they come with an internal fan. Above 100 Watt an active PFC (>0.95) function is added to the standard feature pool. All models in the TXLN line have universal input and comply with the latest industrial standard IEC/EN/UL 62368-1, European EMC standards and the Low Voltage Directive (LVD).20.09.2021 14:30:00Sepnews_2021-10-15_22.jpg\images\news_2021-10-15_22.jpghttps://www.tracopower.com/de/txln-series-metal-enclosed-acdc-power-supplies-18-960-watttracopower.com
Silicone-Free Liquid Thermal Gap Filler for High Voltage ApplicationsHenkel announced the commercial launch of Bergquis...9479Product ReleaseSilicone-Free Liquid Thermal Gap Filler for High Voltage ApplicationsHenkel announced the commercial launch of Bergquist Gap Filler TGF 3000SF, the latest in the company's line of silicone-free thermal interface materials (TIMs). With significantly higher thermal conductivity than any previous silicone-free liquid formulation in its portfolio and delivering impressive dielectric strength, Henkel's material extends wider market opportunities and production flexibility to manufacturing operations that require avoidance of silicone outgassing. A liquid, two-part, 3.0 W/m-K silicone-free TIM, Bergquist Gap Filler TGF 3000SF offers high-reliability performance for a variety of applications where silicone sensitivity is a concern. These include industrial automation systems; power conversion technologies such as motor drives and power supplies; automotive infrastructure EV charging devices; and, computers and peripherals, to name a few. With high dielectric strength at >10 kV/mm and good volume resistivity, Bergquist Gap Filler TGF 3000SF is suitable for higher voltage applications, while also providing high-reliability thermal performance at operating temperatures ranging from -40° C to 100° C. Exhibiting extremely low assembly stress, the liquid TIM is ideal for use with sensitive components and/or printed circuit boards with intricate architectures. Productivity is also a central attribute of Bergquist Gap Filler TGF 3000SF. The silicone-free liquid TIM is conducive to mass production environments where fast dispensing is necessary to achieve high UPH objectives; it dispenses at a rate of 1.5 cc/sec. With a 1:1 mixing ratio, the material can be stored at room temperature and is easily processed.20.09.2021 12:30:00Sepnews_2021-10-15_20.png\images\news_2021-10-15_20.pnghttps://www.henkel.com/press-and-media/press-releases-and-kits/2021-09-20-henkel-develops-silicone-free-liquid-thermal-gap-filler-with-excellent-dielectric-strength-ideal-for-high-voltage-applications-1326548henkel.com
Configurable Digital Gate Driver for Silicon Carbide MOSFETsTo complement its broad portfolio of silicon carbi...9447Product ReleaseConfigurable Digital Gate Driver for Silicon Carbide MOSFETsTo complement its broad portfolio of silicon carbide MOSFET discrete and module products, Microchip Technology announced a 1200V production-ready digital gate driver, providing system developers with multiple levels of control and protection for safe, reliable operation and qualified to stringent transportation requirements. For designers of silicon carbide-based power conversion equipment, Microchip's AgileSwitch 2ASC-12A2HP 1200V dual-channel digital gate driver with its Augmented Switching  technology is production qualified and fully configurable. To ensure reliable, safe operation, the 2ASC-12A2HP gate driver provides multiple levels of control and a higher level of protection for silicon carbide MOSFET-based power systems. When compared to conventional gate drivers, key performance attributes of the AgileSwitch gate driver products include the ability to dampen drain-source voltage (Vds) overshoots by up to 80% and slash switching losses by as much as 50%. The 2ASC-12A2HP digital gate driver can source/sink up to 10A of peak current and includes an isolated DC/DC converter with low capacitance isolation barrier for pulse width modulation signals and fault feedback. Microchip's 2ASC-12A2HP gate driver is compatible with the company's latest release of the Intelligent Configuration Tool (ICT). This interface allows users to configure gate driver parameters including the gate switching profiles, system critical monitors and controller interface settings. The result is a gate driver that is tailored to their applications without having to change hardware, helping to speed development time from evaluation through production and enabling designers to change control parameters during the design process. The ICT, which is a free-of-charge download, can save designers approximately three to six months of development time on new designs.                                                     20.09.2021 06:30:00Sepnews_2021-10-01_11.jpg\images\news_2021-10-01_11.jpghttps://www.microchip.com/en-us/about/news-releases/products/reduce-switching-losses-up-to-50--while-accelerating-time-to-marmicrochip.com
MEMS Capacitive Accelerometer ChipsSilicon Designs Model 1521 Series industrial-grade...9457Product ReleaseMEMS Capacitive Accelerometer ChipsSilicon Designs Model 1521 Series industrial-grade, high-stability OEM surface mount accelerometer chips is offered in eight standard ranges from ±2 g to ±400 g. Each features a ±4V differential output and is offered with a choice of either a 20-pin LCC or J-lead surface mount package, both of which are Nitrogen gas-damped, hermetically sealed and RoHS compliant. The distinguishing feature of the Model 1521 Series is its integration of a MEMS capacitive sense element, together with both an amplifier and internal temperature sensor. The MEMS capacitive sense element of the Model 1521 Series provides long-term measurement stability (+5 VDC, 5 mA power typical), reliable operation, durability, 5,000 g shock survivability and zero signal degradation. The Series is designed for zero-to-medium frequency testing and instrumentation applications requiring extremely low noise (with 7 µg/vHz typical for 2 g full-scale versions) and long-term stability. As such, they can respond to frequencies from zero (DC) to 2000+ Hz and can reliably perform over a standard operating temperature range of -55°C to +125°C.19.09.2021 16:30:00Sepnews_2021-10-01_21.jpg\images\news_2021-10-01_21.jpghttps://www.silicodesigns.com/single-post/silicon-designs-announces-immediate-availability-of-mems-capacitive-accelerometer-chipssilicodesigns.com
PCIM Asia 2021: Successful Conclusion in ShenzhenPCIM Asia was held successfully from 9 – 11 Septem...9441Event NewsPCIM Asia 2021: Successful Conclusion in ShenzhenPCIM Asia was held successfully from 9 – 11 September at the Shenzhen World Exhibition & Convention Center, the change in venue and location marking a new chapter in the fair's history. Born from the highly successful PCIM Europe trade fair first held in 1979, over the course of 20 years the fair has grown to become the leading event for power electronics in Asia. Now in its new home in Shenzhen, the oft-dubbed 'Silicon Valley' of China, benefiting from its location in the Greater Bay Area, proximity to international markets serviced by Hong Kong and the wealth of technical expertise and talent present within the city, PCIM Asia looks well placed to drive the industry forward in the decades to come. Once again PCIM Asia featured a range of thematic zones that explored key areas of the development of power electronics, covering power semiconductor components and modules, electrical devices, passive components and thermal management to test and measurement among other areas. These zones were, namely, the E-mobility Pavilion, Energy Storage Pavilion, Poster Session Area and the University Zone.17.09.2021 10:00:00Sepnews_2021-10-01_5.jpg\images\news_2021-10-01_5.jpghttps://pcimasia-expo.cn.messefrankfurt.com/shanghai/en/press/press-releases/2021/PCIM21_FR.htmlpcimasia-expo.cn
Opening of Chip Factory for Power Electronics on 300-Millimeter Thin WafersInfineon Technologies officially opened its high-t...9437Industry NewsOpening of Chip Factory for Power Electronics on 300-Millimeter Thin WafersInfineon Technologies officially opened its high-tech chip factory for power electronics on 300-millimeter thin wafers at its Villach site in Austria under the motto "Ready for Mission Future." At 1.6 billion euros, the investment made by the semiconductor group represents one of the largest such projects in the microelectronics sector in Europe. The Villach site is one of the world's most modern fabs and was opened by Infineon CEO Reinhard Ploss, Infineon Austria CEO Sabine Herlitschka along with EU Commissioner Thierry Breton and Austrian Chancellor Sebastian Kurz. Infineon set the stage for long-term, profitable growth based on energy efficiency and CO 2 reduction at an early stage and announced the construction of the chip factory for power electronics ("energy-saving chips") in 2018. "The new fab is a milestone for Infineon, and its opening is very good news for our customers," Ploss said. "The timing to create new capacity in Europe could not be better, given the growing global demand for power semiconductors. The last few months have clearly shown how essential microelectronics are in virtually every area of life. Given the accelerated pace of digitalization and electrification, we expect demand for power semiconductors to continue to grow in the coming years. The additional capacities will help us serve our customers worldwide even better, including long term."17.09.2021 06:00:00Sepnews_2021-10-01_1.jpg\images\news_2021-10-01_1.jpghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2021/INFXX202109-098.htmlinfineon.com
High-Temperature, Automotive-Grade Polymer Chip CapacitorsAVX Corporation released the TCO Series high-tempe...9485Product ReleaseHigh-Temperature, Automotive-Grade Polymer Chip CapacitorsAVX Corporation released the TCO Series high-temperature, automotive-grade polymer chip capacitors, which are rated for operating temperatures up to 150°C at category voltage and meet AEC-Q200 Stress Test Qualification for Passive Components requirements, which ensure stable performance at 85°C, 85% relative humidity, and rated voltage for up to 1,000 hours. Based on AVX's field-proven TCQ Series automotive polymer capacitors, the new TCO Series chip capacitors are manufactured in an IATF-16949-certified facility and feature robust J-lead constructions comprised of tantalum anodes, tantalum pentoxide (Ta2O5) dielectrics, and conductive polymer electrodes that exhibit a benign failure mode under recommended use conditions. The series also exhibits low DCL (0.1CV) and basic reliability of 1% per 1,000 hours at 85°C and rated voltage with 0.1O/V series impedance and 60% confidence, and is ideally suited for use in high-temperature, low- and medium-power automotive, industrial, and telecommunications applications. TCO Series capacitors are currently available as D-case (EIA Metric 7343-31) components rated MSL 3 per J-STD-020 and for 10µF ±20% tolerance, 50VDC at 105°C, a maximum of 50µA DCL, 150mO maximum ESR at 100kHz, and operating temperatures extending from -55°C to +150°C, but several other codes are actively in development.16.09.2021 18:30:00Sepnews_2021-10-15_26.jpg\images\news_2021-10-15_26.jpghttps://www.kyocera-avx.com/news/tco-series-high-temperature-automotive-grade-polymer-chip-capacitors/kyocera-avx.com
Inductor Series for Medical Imaging and Other Magnetic-Sensitive ApplicationsGowanda Electronics announces the introduction of ...9458Product ReleaseInductor Series for Medical Imaging and Other Magnetic-Sensitive ApplicationsGowanda Electronics announces the introduction of a non-magnetic RF thru-hole (leaded) inductor series – 28MG. This series is ideal for use in medical imaging equipment and other applications where magnetic materials must be avoided. The series was designed to address the market need for non-magnetic inductors that could achieve inductance values of up to 18 µH for use in Magnetic Resonance Imaging (MRI) equipment, specific types of X-ray equipment and other applications where the presence of magnetic materials could compromise system performance. This includes applications in telecommunications, security systems, instrumentation, laboratory analysis equipment, aviation equipment, navigation equipment and electronic test equipment. The performance range provided by the 60 discrete parts within the 28MG series includes Inductance from 1.2 µH to 18 µH, DCR Ohms from 0.079 to 4.15 and Current Rating mA DC from 315 to 2400. All of Gowanda's non-magnetic surface mount and thru-hole inductors, including this new 28MG series, provide relative permeability of = 1.00003. The operating temperature range for the 28MG series is -55°C to +125°C. The 28MG inductors are epoxy encapsulated for environmental protection and superior strength to withstand all types of reflow soldering. Standard terminations are SnPb; RoHS-compliant terminations are provided when "LF" is specified.16.09.2021 17:30:00Sepnews_2021-10-01_22.jpg\images\news_2021-10-01_22.jpghttps://www.gowanda.com/news-release/gowanda-electronics-launches-new-non-magnetic-rf-inductor-series-28mg/gowanda.com
Switched Capacitor Intermediate Bus Converter for 48 V Data Center ApplicationsFlex Power Modules introduces the BMR310, a non-is...9477Product ReleaseSwitched Capacitor Intermediate Bus Converter for 48 V Data Center ApplicationsFlex Power Modules introduces the BMR310, a non-isolated switched capacitor intermediate bus converter (IBC) which provides high power density for data centers, thus improving board space utilization and freeing space for other components. Built on the proprietary Zero voltage switching Switched capacitor Converter (ZSC) technology of Infineon Technologies, the BMR310 achieves efficiency of over 98 percent at half load and can deliver power up to 875 W continuous in a compact package. It operates over an input voltage range of 40 V to 60 V, and delivers an unregulated output voltage of 10 V to 15 V. For data centers and high-performance computing (HPC) applications, there is a growing trend to move away from 12 V and adopt 48 V power distribution to reduce distribution currents and power losses. To meet this increasing demand, the Infineon ZSC delivers the highest efficiency and power density for applications using 48 V to generate an intermediate bus voltage. This is achieved through capacitive energy transfer with soft switching of the power MOSFETs, and therefore enables an easy and low-risk migration path for legacy 12 V systems to a 48 V infrastructure at significantly reduced total cost of ownership (TCO). The BMR310 is mounted horizontally with a height profile of 10.3 mm, making it suitable for systems with limited space due to large heatsinks or cold plates. It measures 58.4 mm x 25.0 mm x 10.3 mm (2.3 x 0.98 x 0.41 in). The current mounting option is base-plated but an open frame will be available with future models. To maximize operating lifespan, the BMR310 includes over-voltage, under-voltage, over-current and over-temperature protection function.16.09.2021 10:30:00Sepnews_2021-10-15_18.jpg\images\news_2021-10-15_18.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2021/INFPSS202109-097.htmlinfineon.com
ICs for Automotive Satellite Camera ModulesROHM developed SerDes ICs (BU18xMxx-C series) and ...9459Product ReleaseICs for Automotive Satellite Camera ModulesROHM developed SerDes ICs (BU18xMxx-C series) and a PMIC (BD86852MUF-C) ideal for vehicle satellite camera modules for Advanced Driver Assistance Systems (ADAS). The products not only solve issues concerning the miniaturization and low power consumption of modules, but also provide features such as low electromagnetic noise (EMI) that reduces development time. Both products utilize a spread spectrum function to reduce EMI. This also simplifies EMI countermeasures, which often require significant man-hours during the design of automotive applications. The BU18xMxx-C SerDes IC optimizes the transmission rate based on video resolution, making it possible to reduce power consumption by 27% over general products. At the same time, the built-in spread spectrum function reduces the EMI peak by 20dB, while an integrated video sticking detection function improves the reliability of the entire ADAS system by detecting frozen images. The BD86852MUF-C PMIC (Power Management IC) for cameras is designed to optimally manage the power supply systems of CMOS image sensors from all major manufacturers. This allows voltage settings and sequence control to be performed with a single IC, reducing mounting area by 41% and contributing to the miniaturization of vehicle camera modules. In addition, a camera PMIC heat concentration distribution circuit can be configured to lower power consumption by achieving a high conversion efficiency of 78.6% that suppresses heat generation.15.09.2021 18:30:00Sepnews_2021-10-01_23.jpg\images\news_2021-10-01_23.jpghttps://www.rohm.com/news-detail?news-title=serdes-ics-and-pmic-optimized-for-automotive-satellite-camera-modules&defaultGroupId=falserohm.com
Isolation Transformer Series Provides Isolation from High Voltage HazardsBourns introduced its Model PAD00x-T764 Isolation ...9456Product ReleaseIsolation Transformer Series Provides Isolation from High Voltage HazardsBourns introduced its Model PAD00x-T764 Isolation Transformer Series. These transformers feature functional isolation and a low 0.4 mm profile form factor to simplify isolated power and serial communication signal integrity in CAN, RS-485, RS-422, RS-232, SPI, I2C, and lower power LAN-based applications. The Model PAD00x-T763 Series is ideal for industrial automation, embedded solutions, AC motor drives, system integration, communication PHYs, smart metering, and many other applications requiring low DC power. Bourns Model PAD00x-T764 series was developed for ease of use in maintaining proper communication and necessary isolation between systems. The 3.1 kVAC withstanding voltage provides an isolation barrier from high voltage hazards, such as high voltage batteries. Design details include construction with a ferrite toroid core to help ensure a high coupling factor and heightened efficiency. EMI performance is enhanced in the winding of the transformer, enabling reduced emissions. The PAD00x-T764 series is compatible with Texas Instruments SN6501 and SN6506B, Maxim MAX253 and MAX845, Analog Devices ADM2485, and similar transformer drivers. The series offers 3.3 to 5 V input, industry standard 3.3 to 10 V output, and up to 250 mA output with various turns ratios. The Bourns Magnetics product line can also support most modification and customization requests for this push-pull transformer series.15.09.2021 15:30:00Sepnews_2021-10-01_20.jpg\images\news_2021-10-01_20.jpghttps://bourns.com/news/press-releases/pr/2021/09/15/bourns-expands-push-pull-transformer-line-with-new-series-that-delivers-excellent-isolated-power-performance-for-serial-communicationsbourns.com
Power Modules Replace Linear RegulatorsWürth Elektronik extends its MagI³C-FDSM-36-V fami...9455Product ReleasePower Modules Replace Linear RegulatorsWürth Elektronik extends its MagI³C-FDSM-36-V family with a 12 V output voltage version. The range of MagI³C-FDSM power modules with 36 V input voltage has been expanded to include a version with 12 V output voltage. The power module in a SIP-3 package represents a cost-effective solution to meet the requirements for the real-world voltage transients of a 24 V industrial power architecture. The module operates from 16 to 36 VIN and generates a fixed output voltage of 12 V with current up to 1 A. The FDSM series MagI³C power modules are fully integrated DC/DC voltage converters with a fixed output voltage. The modules incorporate all of the components needed, like the controller, inductor and input/output capacitors, with the added benefit of thermal overload and short circuit protection. Since there are no external components required for operation, there is essentially no circuit design needed. This reduces development costs and makes it possible to get to market quickly with new applications. This power module has around 95% efficiency while the linear regulator will have an efficiency of 50%. The standard THT housing for easy mounting is pin-compatible with L78x linear controllers. Pre-compliance testing has shown both the radiated and conducted emissions on an evaluation board are below the limits of EMC standards EN55032/CISPR32 Class B.15.09.2021 14:30:00Sepnews_2021-10-01_19.jpg\images\news_2021-10-01_19.jpghttps://www.we-online.com/web/en/wuerth_elektronik/news_weg/News_Detail_WE_Gruppe_127294.phpwe-online.com
Automotive Semiconductor Industry: The Wind of Change"The value of semiconductors, at the chip level, i...9466Industry NewsAutomotive Semiconductor Industry: The Wind of Change"The value of semiconductors, at the chip level, in cars will grow from US$34.4 billion in 2020 to US$78.5 billion in 2026, a 14.75% CAGR." asserts Eric Mounier, PhD, Director of Market Research at Yole Développement (Yole). He adds: "The largest growth will be in EVs due to the major shift to electrification." The market research and strategy consulting company investigates disruptive semiconductor technologies for the automotive sector in depth. Its aim is to point out the latest innovations and underline the business opportunities. These investigations have been developed with Yole's partner, System Plus Consulting. According to Wilfried Théron, Electronic System, Department Director & Quality Manager at System Plus Consulting: "System Plus Consulting's Teardowns uncover innovative design features and new semiconductor components to guide enterprises toward more streamlined solutions in future designs". They provide clients unmatched intelligence into 4 automotive tracks (ADAS, Electrification, Infotainment and Telematics). In addition, Yole released, the 'Automotive Semiconductor Trends 2021' report to provide an in-depth understanding of the changing automotive industry ecosystem and supply chain players. Including market trends and forecasts, take away and outlook, this study proposes key technical insights and analyses about future technology trends and challenges. 15.09.2021 11:00:00Sepnews_2021-10-15_6.jpg\images\news_2021-10-15_6.jpghttp://www.yole.fr/Automotive_Semiconductor_Trends_Automotive_Tracks_2021.aspxyole.fr
PCNS: The Next Decade on Passive Components will be about Reliability, Sustainability & MaterialsAttendees of the 3rd PCNS Passive Components Netwo...9465Event NewsPCNS: The Next Decade on Passive Components will be about Reliability, Sustainability & MaterialsAttendees of the 3rd PCNS Passive Components Networking Symposium that took place on 7-10th September 2021 in Milano, Italy discussed the latest news and trends in passive components. The main theme of the conference was RELIABILITY & SUSTAINABILITY of PASSIVE COMPONENTS that also covered MATERIALS development and PROCESSES. 3rd PCNS was attended by 50 live attendees and 25 virtual attendees from 16 countries including 12 European Countries, Israel, USA and Korea. Theme of the conference "Reliability and Sustainability of Passive Components" was elaborated in workshop on life cycle assessment and addressed by keynotes, invited papers and hot panel discussion. Twenty four full technical papers were presented during two and half PCNS event days covering wide range of passive components including capacitors, resistors, inductors, integrated passives or passive sensors.15.09.2021 10:00:00Sepnews_2021-10-15_5.jpg\images\news_2021-10-15_5.jpghttps://passive--components-eu.cdn.ampproject.org/c/s/passive-components.eu/pcns-the-next-decade-on-passive-components-will-be-about-reliability-sustainability-materials/amp/passive--components-eu
Halogen-Free Flame-Retardant PolyamideAsahi Kasei is introducing the halogen and red-pho...9482Product ReleaseHalogen-Free Flame-Retardant PolyamideAsahi Kasei is introducing the halogen and red-phos-phorous free flame retardant Polyamide 66 LEONA SN to the European market. This semi-aromatic material combines high levels of safety, surface quality and laser printability. The LEONA SN grades are certified with the V-0 flame retardancy at wall thicknesses of 0.75mm according to the UL standard, and achieve 600V, the highest value on the Comparative Tracking Index (CTI). In addition to the flame-retardant and creep-resistant properties, the material features a superior surface quality. This is achieved without additional treatment and coating and even with a glass-fiber content of up to 50%. Another characteristic of this material is its high retention rate of physical properties in a conditioned state. While comparable halogen-free PA66 materials show a significant decline in properties, LEONA SN maintains a high level of tensile strength and flexural modulus also after moisture absorption. This opens up new possibilities for applications in environments, where the use of standard FR PA66 can become an issue. Furthermore, LEONA SN provides an excellent laser printability and allows for a clearer surface marking than general materials with red phosphorus in high speed machining of 1000 mm/sec, con-tributing to an increased speed in production.14.09.2021 15:30:00Sepnews_2021-10-15_23.jpg\images\news_2021-10-15_23.jpghttps://asahikasei.group/eu/leona-sn/asahikasei.group
EMC Community Meets AgainFrom 15 – 17 March 2022, the EMC community will ha...9442Event NewsEMC Community Meets AgainFrom 15 – 17 March 2022, the EMC community will have the opportunity to experience the premiere originally planned for 2020 at the new location in Cologne. "The feedback on Mesago Messe Frankfurt's digital offerings for the EMV was very positive, nevertheless the anticipation for the next face-to-face event and the desire for chance meetings and personal exchange is immense," commented Anthula Parashoudi, Vice President, Mesago Messe Frankfurt. With still six months before the event, the EMV team at Mesago Messe Frankfurt has already been able to allocate 60 percent of the booth space. Around 50 exhibitors have already confirmed their participation in the event in Cologne, including well-known representatives of the EMC industry such as Rohde & Schwarz, Frankonia, and AR Europe. Interested representatives in the EMC industry can still register as an exhibitor at the trade fair in Cologne. More information, such as the exhibitor list and exhibitor registration, is available at e-emc.com.14.09.2021 11:00:00Sepnews_2021-10-01_6.jpg\images\news_2021-10-01_6.jpghttps://emv.mesago.com/stuttgart/en/press/press-releases/emv-press-releases/emv2022_feedback_positive.htmlemv.mesago.com
Semiconductor Capacity AgreementGaN Systems announced the signing of a comprehensi...9438Industry NewsSemiconductor Capacity AgreementGaN Systems announced the signing of a comprehensive Capacity Agreement with BMW Group for GaN Systems' high-performance, automotive-grade GaN power transistors, which increase the efficiency and power density of critical applications in electric vehicles. GaN power semiconductors are a key ingredient to achieve the small size, lightweight, and high efficiency required in the next generation of high-performance electric vehicles. Under the terms of the agreement, GaN Systems will provide capacity for multiple applications in series production. The guaranteed volumes by GaN Systems are a key building block for reliability in the supply chain for automotive players like BMW. "Electric vehicles represent the future of transportation, and we are delighted to continue to support BMW with our design and production capacity," stated Jim Witham, CEO of GaN Systems. "This multi-$100M agreement demonstrates BMW's commitment to innovation and sustainability." BMW's relationship with GaN Systems began more than four years ago when BMW's engineers found that small size, lightweight, low-cost onboard chargers, DC/DC converters, and traction inverters were enabled by GaN. This led to investment from BMW's venture capital firm, BMW I Ventures, to support and accelerate the automotive qualification of the GaN technology. "The close collaboration among GaN Systems and BMW's engineers has helped to solidify the technology for automotive series production, resulting in the most advanced GaN power transistors in the marketplace today," said Kasper Sage, managing partner BMW i Ventures. "As electric vehicles become more prominent, the demand for critical semiconductor components is only going to increase, thereby making strategic partnerships with suppliers like GaN Systems even more important." 14.09.2021 07:00:00Sepnews_2021-10-01_2.jpg\images\news_2021-10-01_2.jpghttps://gan-systems.reportablenews.com/pr/gan-systems-signs-semiconductor-capacity-agreement-with-bmwgan-systems.com
Sensing and Control Solutions Make Energy Systems SaferSensata Technologies introduces an i-BMS Battery M...9450Product ReleaseSensing and Control Solutions Make Energy Systems SaferSensata Technologies introduces an i-BMS Battery Management System for Electrified Applications up to 60V. The brain behind the battery for a diverse range of electric vehicles, the BMS is the intelligent component that monitors and manages lithium-ion battery packs. The i-BMS Battery Management System from Lithium Balance, acquired by Sensata earlier in the year, is a cell chemistry agnostic, compact, integrated BMS developed for the cost-optimized mass-production of applications up to 60V, such as 2-, and 3-wheelers, automated guided vehicles (AGVs), and robotics. The i-BMS is a long-term solution for customers who require the highest levels of safety, performance and measurement accuracy. The solution features key components that are ASIL C Safety rated and self-test capability for safety critical measurement circuits. While measuring only 65 x 200 mm, the i-BMS is equipped with everything required to manage and maintain a battery system without the need for any external components. This includes a built-in pre-charge circuit, on-board current measurement, MOSFET power switches for battery disconnect, and a DC/DC power supply. The i-BMS' software design features parallel pack and hot swap capability, while advanced SoX algorithms ensure high precision. Using the BMS Creator configuration software, the i-BMS allows the battery designer to create a unique battery by defining application-specific BMS parameters and safety strategies, optimizing battery performance and life.09.09.2021 09:30:00Sepnews_2021-10-01_14.jpg\images\news_2021-10-01_14.jpghttps://www.sensata.com/contact/newsroom/st-debut-new-battery-management-systems-battery-show-north-americasensata.com
Single Plug-and-Play Gate Drivers for "New Dual" ModulesPower Integrations announced SCALE-iFlex Single ga...9431Product ReleaseSingle Plug-and-Play Gate Drivers for "New Dual" ModulesPower Integrations announced SCALE-iFlex Single gate-drivers for the popular "New Dual" 100 mm x 140 mm IGBT modules. The compact drivers support modules up to 3.3 kV and are available now for design-in. The SCALE-iFlex Single gate-drivers are ideal for light-rail, renewable energy generation and other high-reliability applications that demand compact, rugged driver solutions. Thorsten Schmidt, product marketing manager at Power Integrations commented: "SCALE-iFlex Single gate-drivers fit the outline of the latest standard IGBT power modules including the Mitsubishi LV100/HV100, Infineon xHP2 and xHP3, ABB LinPak, Hitachi nHPD² and other similar products." SCALE-iFlex Single gate-drivers use Power Integrations' SCALE-2 ASIC technology which dramatically reduces component count compared to conventional products. The ASIC also provides Advanced Active Clamping (AAC) over-voltage protection during normal operation, a substantial improvement over simple soft shut down, which adds extra protection in case of short-circuit during turn-on. Devices are conformally coated and feature reinforced isolation. Isolated housings ensure isolation between modules when they are mounted side-by-side. Devices are pre-qualified according to railway standards IEC 61373 – Class 1B (shock & vibration) and IEC 61000-4-x (EMC tests) and IEC 60068-2-x (serial environmental tests). Burn-in is optionally available.08.09.2021 15:30:00Sepnews_2021-09-15_22.jpg\images\news_2021-09-15_22.jpghttps://investors.power.com/news/news-details/2021/Power-Integrations-Introduces-SCALE-iFlex-Single-Plug-and-Play-Gate-Drivers-for-New-Dual-Modules/default.aspxpower.com
Plug-and-Play Gate Driver Improves IGBT Module PerformancePower Integrations announced its plug-and-play SCA...9453Product ReleasePlug-and-Play Gate Driver Improves IGBT Module PerformancePower Integrations announced its plug-and-play SCALE-iFlex LT dual gate-drivers. The drivers improve the performance of multiple parallel EconoDUAL modules by 20%, allowing users to eliminate one of every six modules from power inverters and converter stacks. In addition to saving the cost of the driver and module, this reduces control complexity and costs related to modules, wiring, hardware, and heatsinking. SCALE-iFlex LT targets multiple applications in renewable energy generation and storage, and is particularly applicable to offshore wind turbines in the 3 to 5 MW range. Thorsten Schmidt, product marketing manager at Power Integrations commented: "Dynamic and static current sharing is critical for robust operation of modules arranged in parallel. For the same power output, systems using SCALE-iFlex LT require just five parallel modules whereas competitive approaches need six. This substantial saving of cost and complexity is achieved by guaranteeing less than 20 ns of variance in turn-on and turn-off commands between modules and less than 20 A of variance between modules when conducting the rated 600 A. This allows the modules to operate reliably without current derating, which is obligatory with less advanced driver solutions." Up to six EconoDUAL 3, or equivalent, power modules can be paralleled from the same Isolated Master Control (IMC) unit which has a more compact outline than conventional products. The Module Adapted Gate drivers (MAGs), which fit the footprint of the EconoDUAL module, each featuring two SCALE-2 ASICs – one per channel – to optimize symmetrical paralleling, efficiency and protection.08.09.2021 12:30:00Sepnews_2021-10-01_17.jpg\images\news_2021-10-01_17.jpghttps://investors.power.com/news/news-details/2021/Power-Integrations-New-SCALE-iFlex-LT-Plug-and-Play-Gate-Driver-Improves-EconoDUAL-IGBT-Module-Performance-by-20/default.aspxpower.com
BLDC Motor Drivers with Code-Free, Sensorless FOC and Trapezoidal ControlTexas Instruments introduced 70-W brushless DC (BL...9425Product ReleaseBLDC Motor Drivers with Code-Free, Sensorless FOC and Trapezoidal ControlTexas Instruments introduced 70-W brushless DC (BLDC) motor drivers to provide code-free, sensorless trapezoidal and field-oriented control (FOC). The devices enable engineers to spin a BLDC motor in less than 10 minutes – eliminating months of design time for engineers designing a wide variety of industrial systems such as major and small home appliances, and medical applications such as ventilators and continuous positive airway pressure (CPAP) machines. With integrated real-time control and up to 18 discrete components – including power metal-oxide semiconductor field-effect transistors (MOSFETs) – the devices also speed system response time while reducing board space by as much as 70%, all while providing best-in-class acoustic performance. The MCF8316A and MCT8316A BLDC motor drivers include a set of commutation control algorithms that eliminate the need to develop, maintain and qualify motor-control software, which eliminates months of design time. The algorithms, along with a high level of integration, enable these motor drivers to manage critical functions such as motor fault detection, while implementing protection mechanisms to increase system reliability. Because these motor drivers integrate sensorless technology to determine rotor position, they eliminate the need for external Hall sensors, which reduces system cost and increases reliability. Additionally, the MCF8316A sensorless FOC motor driver intelligently extracts motor parameters, enabling designers to quickly tune a motor while delivering consistent system performance regardless of motor manufacturing variations. The MCT8316A sensorless trapezoidal control motor driver enables designers to tune a motor using only five hardware pins, simplifying systems by eliminating the need for a microcontroller interface.08.09.2021 09:30:00Sepnews_2021-09-15_16.png\images\news_2021-09-15_16.pnghttps://news.ti.com/70-w-bldc-motor-drivers-from-texas-instruments-eliminate-months-design-time-with-code-free-sensorless-foc-and-trapezoidal-controlti.com
Awarded for Global Sustainability for Reducing Battery Use and E-WasteThe Business Intelligence Group awarded Powercast ...9421Industry NewsAwarded for Global Sustainability for Reducing Battery Use and E-WasteThe Business Intelligence Group awarded Powercast with its Sustainability Initiative of the Year in the 2021 Sustainability Awards program. These awards honor those people, teams and organizations who have made sustainability an integral part of their business practice or overall mission. Powercast aims to make one-time-use batteries obsolete by working with electronic manufacturers to recharge batteries or replace them altogether with its over-the-air RF (radio frequency) wireless power technology. Many of today's small electronic devices can be designed so they're environmentally friendly, either with rechargeable batteries that can accept an RF wireless charge, or with no batteries that can be directly powered by RF power. A Powerharvester chip is embedded in devices to receive RF energy sent over the air from either a dedicated Powercast transmitter, or from industry-standard RFID readers. The Powerharvester then converts the RF to direct current (DC) to top off the battery or power the device. Powercast's technology touches millions of users across 15+ industries, including automotive, consumer electronics, IoT, entertainment, retail, RFID, and sensors. The company's collaborative approach and expertise in all aspects of product design, from vision through prototyping and commercialization, has resulted in dozens of applications and millions of units shipped. "We're already partnering with many manufacturers to create wirelessly rechargeable devices that keep batteries out of landfills," said Charles Goetz, CEO of Powercast. "But, we strive for the day where all devices will charge in the background when consumers enter their home, office or car, where they'll never have to throw batteries away."07.09.2021 17:00:00Sepnews_2021-09-15_12.png\images\news_2021-09-15_12.pnghttps://www.powercastco.com/powercasts-rf-wireless-power-technology-awarded-for-global-sustainability-for-reducing-battery-use-and-e-waste/powercastco.com
High-Volume Micro-Transfer Printing CapabilitiesX-FAB Silicon Foundries is now able to support vol...9419Industry NewsHigh-Volume Micro-Transfer Printing CapabilitiesX-FAB Silicon Foundries is now able to support volume heterogeneous integration via Micro-Transfer Printing (MTP), thanks to a licensing agreement that has just been secured with X-Celeprint. This will mean that a diverse range of semiconductor technologies may be combined together, each being optimized for particular functional requirements. These will include SOI, GaN, GaAs and InP, as well as MEMS. In order to become the first foundry to provide customers with MTP-based heterogeneous integration, X-FAB has made substantial investments over the last two years. It has also established new optimized workflows and cleanroom protocols. This will allow customers to work with the foundry on heterogeneous design projects - benefitting from a low-risk and fully scalable business model that offers a clear migration to volume production. X-Celeprint's proprietary massively-parallel pick-and-place MTP technology stacks and fans-out ultra-thin dies based on different process nodes, technologies, and wafer sizes. It results in the formation of virtually monolithic 3D stacked ICs, which have enhanced performance, greater power efficiency, and take up less space. Furthermore, all this can be achieved at an accelerated rate, thereby significantly shortening time-to-market. "By licensing X-Celeprint's disruptive MTP technology, we are uniquely positioned in our ability to facilitate the incorporation of numerous different semiconductor technologies. X-FAB customers will be able to utilize a technology that no other foundry is offering, and existing X-Celeprint customers may now tap into capacity levels that will easily meet their future demands," Volker Herbig, VP of X-FAB's MEMS business unit, explains.07.09.2021 15:00:00Sepnews_2021-09-15_10.jpg\images\news_2021-09-15_10.jpghttps://www.xfab.com/news/details/article/x-fab-becomes-first-foundry-to-offer-high-volume-micro-transfer-printing-capabilities-following-licensing-agreement-with-x-celeprintxfab.com
Strategic Partnership Focused on SiC Power DevicesThe global semiconductor manufacturer ROHM, togeth...9418Industry NewsStrategic Partnership Focused on SiC Power DevicesThe global semiconductor manufacturer ROHM, together with Geely Automobile Group have entered into a strategic partnership to develop advanced technologies in the automotive field. Both companies have been collaborating on a variety of automotive applications since 2018, when they first agreed to carry out technical exchange. This partnership is expected to further promote cooperation and accelerate innovation for automotive applications. Geely is working to extend the cruising range of electric vehicles while reducing battery costs and shortening charge times by developing high efficiency traction inverters and onboard charging systems that adopt ROHM's advanced power solutions centered on SiC power devices. At the same time, Geely is committed to improving user experience through the development of high performance ADAS and intelligent cockpit systems using a wide range of products and solutions, including communication ICs and discrete devices. As a first step, traction inverters equipped with ROHM's SiC power devices are being integrated in electric vehicle platforms currently being developed by Geely. Through this partnership, ROHM and Geely will contribute to sustainability by promoting the development of low carbon technologies in the automotive industry and offering solutions for achieving greater safety and security in our increasingly mobility society.07.09.2021 14:00:00Sepnews_2021-09-15_9.jpg\images\news_2021-09-15_9.jpghttps://www.rohm.com/news-detail?news-title=rohm-and-geely-form-a-strategic-partnership&defaultGroupId=falserohm.com