Bodo's News

Read through my personal pick of news around people, our industry, important events and interesting product releases. Or click on a filter and pick your area of interest!

 

Bipolar Capacitor Charging High Voltage Power Supplies
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Learn more:
deantechnology.com
  • Product Release
  • 2022-06-14

Dean Technology announced the introduction of the UMR-BPC Series, a line of bipolar (±) high voltage power supplies designed for applications requiring dual output capacitor charging modules with higher voltage and higher power. UMR-BPC models offer output voltages up to 6kV at an output power of either 120W or 250W. "We are thrilled to be able to release a high power high voltage power supply that offers our customers bipolar capabilities," said Scott Wilson, Sales and Product Development Manager for Dean Technology. "UMR-BPC series modules are a packaging and integration convenience as they enclose two units of opposite polarity in a single case. This feature will help customers with their inventory, cable management, and installation time." UMR-BPC modules, an extension of the existing UMR Collection, are form-fit-function replacements for industry standard units. They offer low overshoot and fast rise time while maintaining high efficiency. All models come standard with voltage and current monitoring and can be upgraded to include buffered monitors and current regulation.

Combining Expertise to Become Yole Group
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Learn more:
yolegroup.com
  • Industry News
  • 2022-06-10

Yole Développement (Yole) and System Plus Consulting announced the creation of Yole Group and its entities, Yole Intelligence and Yole SystemPlus. For more than a year, both partners have been considering a common and unique evolution of the two companies. This stems from the development of the semiconductor industry and its growth, questions and requests from manufacturers and other leading players, and the need to clarify what each company offers. This evolution illustrates a shared commitment to growing by comprising multidisciplinary experts and developing business with the sole aim of responding to requests from the industry. The clearly identified distribution of product and consulting services offered by Yole Intelligence and Yole SystemPlus will be presented on a new and dynamic internet platform, www.yolegroup.com, that will enable easy navigation and quick access to information and products. In addition to the company's description, product information, and library, Yole Group's website covers the latest news from the semiconductor industry as well as interviews with leading companies and unique editorial content created by Yole Group's analysts. These noteworthy stories will be part of a new dynamic section, Industry Insight (formerly i-Micronews).

Miniature MOSFET Gate Driver Family for Portable Applications
  • Product Release
  • 2022-06-09

Toshiba Electronics Europe has added five MOSFET gate-driver ICs in the TCK42xG series, suitable for a wide range of applications including battery powered, consumer and industrial equipment. The devices in this series control the applied gate voltage independent of the input voltage and feature an over-voltage lockout function to protect the circuit. The products are now joining the TCK421G, announced earlier this year. Products in the series can be selected for a gate-source voltage of 10V or 5.6V, allowing use with a wide variety of MOSFETs. A choice of detection voltages for the input over-voltage lockout allows them to operate from power lines from 5V to 24V. The drivers available are the TCK420G for 24V power lines, TCK422G and TCK423G for 12V, TCK424G for 9V, and TCK425G for 5V. Each new driver in the series features a built-in charge pump that ensures a stable gate-source voltage at the external MOSFET while the input can vary from 2.7V to 28V. This allows large currents to be switched. In addition, when used to control two N-channel MOSFETs connected back-to-back, they are suitable for configuring load-switch or power-multiplexer circuits with reverse-current blocking. To further assist customers' projects, Toshiba has developed the Power Multiplexer Circuit Reference Design, which provides a design example for power multiplexers that utilize the functions of TCK42xG.

AuSn Pastes for High-Power LEDs
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Learn more:
indium.com
  • Product Release
  • 2022-06-09

Indium Corporation has expanded its portfolio of proven pastes with two AuSn pastes designed for the higher processing temperatures and assembly needs required for use in high-power LED module array applications, such as automotive, infrastructure, and horticulture. Indium Corporation produces a wide range of solder paste products to meet the current and evolving needs of the industry. High-power LEDs have the ability to provide much higher levels of light output than traditional LEDs while also providing higher levels of performance, leading to a longer lifetime of the device. Due to the large amount of heat generated-in such a localized area-a high-melting and high-reliability solder is required for assembly. It is also critical to the LED assembly process that the solder interface between the diode and its substrate is void-free in order to generate a stable transmission of light and allow for the transfer of the tremendous heat generated by the diodes to maintain the temperature stability of the device. AuLTRA 3.2 and AuLTRA 5.1 are AuSn solder pastes specifically formulated to accommodate higher processing temperatures while providing high reliability. Both pastes are offered in a variety of AuSn alloys and powder sizes. In addition to being ideal for use in high-power LED module array applications, AuLTRA 3.2 and AuLTRA 5.1 are applicable for all AuSn paste applications as their performance has been, and continues to be, proven in the field. 

CAT III 1500 V True-RMS Solar Clamp Meter
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Learn more:
fluke.com
  • Product Release
  • 2022-06-07

Fluke has announced the top three electrical hazards to avoid when installing and maintaining PV solar installations to keep technicians safe. The demand for highly accurate hand-held devices capable of carrying out safe and reliable measurements in these applications has now been met with the introduction of a CAT III 1500 V true-RMS solar clamp meter – the Fluke 393 FC. All test results are logged and reported via the Fluke Connect software that comes with the Fluke 393 FC true-RMS Solar Clamp Meter. Using just a phone, engineers can make and save measurements quickly, with the phone recording for 10 minutes and reporting readings to colleagues. Capable of measuring and recording up to two weeks, this safe, reliable and rugged meter also comes with an 18-inch iFlex flexible current probe for extended AC current measurements up to 2500 amps. Test leads are also rated to CAT III 1500 V DC. Hans-Dieter Schuessele, Application and Technology Expert EMEA, Fluke said: "Safety is essential when commissioning and installing PV systems. The future of power needs tools that are able to keep you safe in harsh environments – risk is not an option and you literally have to trust your meter with your life. That's why the world's first CAT III 1500 V true-RMS clamp meter has been designed to deliver enhanced protection for users in challenging CAT III environments. It's very important that there's a solid meter with multiple functions capable of operating at that rating – the solar industry desperately needs a solution like the Fluke 393 FC."

DOCSIS-Compliant Switch Delivers High Linearity
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Learn more:
richardsonrfpd.com
  • Product Release
  • 2022-06-07

Richardson RFPD announced the availability and full design support capabilities for an UltraCMOS SPDT RF switch from pSemi Corporation. The PE42726 is a HaRP technology-enhanced reflective SPDT RF switch designed for use in cable applications, including DOCSIS 3.0/1 cable modem, set-top box and residential gateway. It delivers high linearity, excellent harmonics performance and high surge immunity in the 5–1794 MHz band. It also features low insertion loss and high isolation performance, making the PE42726 ideal for DOCSIS 3.1 applications. The PE42726 is manufactured on pSemi's UltraCMOS process, a patented variation of silicon-on-insulator (SOI) technology on a sapphire substrate, offering the performance of GaAs with the economy and integration of conventional CMOS.

Opening of Joint Research Center for 300 mm Microelectronics
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Learn more:
fraunhofer.de
  • Industry News
  • 2022-06-07

A flagship of semiconductor research with international reach is emerging in Dresden. Fraunhofer IPMS and Fraunhofer IZM-ASSID are bundling their competences and establishing the Center for Advanced CMOS & Heterointegration Saxony. The center will offer the complete value chain in 300 mm microelectronics, a prerequisite for high-tech research for future technologies. With Fraunhofer IZM-ASSID and Fraunhofer IPMS' Center Nanoelectronic Technologies CNT, two unique research facilities in Germany in the field of microelectronics are located in Saxony. Today, they are the only two German research centers for applied microelectronics research based on 300 mm wafer industry standard equipment. With the bundling of competences and the foundation of the Center for Advanced CMOS & Heterointegration Saxony, excellent perspectives arise to attract semiconductor companies and system users as well as material and equipment manufacturers worldwide. In addition to excellent personnel and know-how, equipment with a modern equipment and plant park is crucial for industrial and research contracts. With an investment volume of about €140 million in clean room facilities, Fraunhofer IPMS is uniquely positioned in Germany in the field of applied research on the modern 300 mm wafer industry standard in the front end of CMOS manufacturing. Fraunhofer IZM-ASSID complements this expertise with innovative packaging and system integration technologies. In the future, the center will be headed by Dr. Wenke Weinreich, division manager at CNT and deputy institute director of Fraunhofer IPMS, and Dr. Manuela Junghähnel, site manager at IZM-ASSID.

Passive Near Field Probe
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Learn more:
langer-emv.de
  • Product Release
  • 2022-06-02

Langer EMV-Technik GmbH presents a passive near-field probe with a measuring range of up to 40 gigahertz. The HR-E 40-1 probe is designed for measurements of high-frequency, electrical near fields in the frequency range up to 40 gigahertz on conductors, ICs, metallic housings and RF structures. The HR-E 40-1 near-field probe is suitable for measurements on high-frequency structures during development, such as analyses of the harmonics of 5G assemblies, for example. It allows you to specifically record the electric near fields and derive a detailed field image of the structure to be measured. The probe tip is decoupled from the probe shaft by special damping systems. In addition, the probe contains a sheath current attenuation. The newly developed probe head ensures a defined distance of 0.5 mm even for hand-held measurements. The HR-E 40-1 allows a spatial resolution of 0.2 mm and transmits the measured signals to the measuring device. The transmission behavior of the near-field probe is almost constant in the frequency range from 8 to 40 gigahertz and thus enables reproducible measurement results, for example to verify and refine simulation models. For spatially reproducible measurements, the probe can be used in an automatic positioning system, for example in a Langer scanner. The probe is to be used with the SH 01 probe holder in the scanner. The HR-E 40-1 near-field probe can be calibrated using the Langer Stripline CPL 40-01 38. The passive near-field probe is supplied in a set consisting of the operating manual, the HR-E 40-1 probe and the USB stick with the probe characteristics.

Die-to-Wafer Self-Assembly Breakthrough
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Learn more:
leti-cea.com
  • Industry News
  • 2022-06-02

CEA-Leti and Intel have optimized a hybrid direct-bonding, self-assembly process that has the potential to increase the alignment accuracy as well as fabrication throughput by several thousand dies per hour. The approach uses capillary forces of a water droplet to align dies on a target wafer. The results were presented in a paper, "Collective Die-to-Wafer Self-Assembly for High Alignment Accuracy and High Throughput 3D Integration", at the 2022 Electronic Components and Technology Conference (ECTC). While leading microelectronics companies see the D2W hybrid bonding process as being essential for the success of future memory, HPC and photonic devices, it is much more complex than wafer-to-wafer bonding, with lower alignment accuracy and lower die-assembly throughput. CEA-Leti has been developing a self-assembly method for several years, with the goal of substantially increasing throughput and placement accuracy. "Commercial scale throughput with D2W self-assembly presents two main challenges related to die handling," said Emilie Bourjot, CEA-Leti's 3D integration project manager. "If the self-assembly process is combined with a pick-and-place tool, the throughput can be increased by reducing the time of alignment, since the fine alignment is performed by the droplet. When self-assembly is combined with a collective die-handing solution, the throughput is increased by the fact that all dies are bonded together at the same time without any high precision placement at any time along the process flow." Process optimization is also an important part of this work for increasing process maturity and targeting industrial requirements.

E-training: Design and Control of Power Factor Correction (PFC) Converters
  • Event News
  • 2022-06-01

The main objective of this course June 27 to 29 is to study theoretical aspects and practical aspects of the design of power factor correction (PFC) converters. This type of AC/DC rectifiers have to comply with strict specifications regarding the current harmonics injected to the grid, and more recently with some other Grid-Codes requirements. The course is designed to provide fundamental knowledge about the design of the power stage (semiconductors, inductors, EMI filters and capacitors selection) and the control system (analog and digital). Regarding the control system, it will be covered from basic analog IC controllers (CCM and BCM) to sophisticated System on Chip (SoC-FPGA) implementation.

Discrete IGBT Devices Adopted by Inverter Supplier
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Learn more:
infineon.com
  • Industry News
  • 2022-06-01

Zhuhai ENPOWER Electric, a China based supplier of inverters for the automotive industry, is the first to integrate the latest 750 V automotive-grade IGBTs AIKQ120N75CP2 and AIKQ200N75CP2 from Infineon Technologies. The discrete IGBT EDT2 devices in TO-247PLUS package enable performance boosts and system cost savings in main inverter applications and DC link discharge switches of electric vehicles. Additionally, they offer greater design freedom for achieving system integration targets. "ENPOWER firmly follows the technology route of designing motor control units (MCUs) with discrete components, and continuously develops products that are both good and cost-advantageous, therefore to always maintain the competitive advantage of our MCUs in the market," said Liu Hongxin, ENPOWER's R&D director of MCU. "Infineon's discrete IGBTs are compatible with the last generation in terms of packaging. Together with the high current density, ultra-low saturation voltage drop and very good parallel performance, power density of our products has increased by more than 20 percent, further improving competitiveness of our products." "We are very happy about this close and successful collaboration with ENPOWER. This project further highlights our strong position in the inverter application," said Dr. Robert Hermann, Product Line Head for Automotive High Power Discretes and Chips at Infineon. "Leveraging our technology expertise and system understanding allows us to bring innovative solutions to the market perfectly matching customers' needs."

75 Years of Innovation
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Learn more:
avnet.com
  • Industry News
  • 2022-06-01

Avnet Abacus congratulated Bourns on its 75th anniversary in business. The company was set up in Altadena, California in 1947 – coincidentally the same year as the invention of the first working point-contact transistor by Bardeen, Brattain and Shockley at Bell Labs, which arguably represents the birth of the modern electronics industry. In addition to the 75th anniversary of Bourns, this year also marks a milestone for the relationship between Bourns and Avnet Abacus, as the two companies are celebrating more than 21 years working together, since March 2001. "We are delighted to share our 75th anniversary with Avnet Abacus and all our strategic partners," said Ferdinand Leicher, Vice President Sales EMEA at Bourns. "Building upon this celebration, this year also represents another milestone for our relationship with Avnet Abacus, which has been a key and highly valued distribution partner for us across Europe over the past two decades. Long may our success together continue." "All of us here at Avnet Abacus are honoured to have been a long-term strategic partner for Bourns," said Hagen Goetze, Senior Director Marketing at Avnet Abacus. "We look forward to continuing our relationship over many more years. We also pay tribute to the major technology innovations that Bourns has achieved in the electronics industry over the past 75 years from the onset of modern electronics to the global and dynamic industry of today."

LIN Motor Pre-driver Assists High Power Mechatronic Miniaturization
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Learn more:
melexis.com
  • Product Release
  • 2022-06-01

Melexis has introduced the MLX81346, a single chip LIN pre-driver for high power up to 2000 W. The MLX81346 enables motor control miniaturization and efficient silent drive with field-oriented control (FOC). It addresses automotive mechatronic applications - including oil pumps, engine cooling fans, and BLDC positioning actuators. The device is also used in robotic systems and e-bikes/e-scooters. As well as being able to support operation up to 1000 W from a 12 V supply, the MLX81346 is also uniquely positioned to reach 2000 W from a 48 V supply. Its high-voltage capabilities come from the silicon-on-insulator (SOI) technology it relies on. The MLX81346 features a 16-bit embedded microcontroller unit (MCU), a 64 KB flash memory, plus a LIN software stack and LIN interface (for connecting to in-vehicle networking infrastructure). It has 12 GPIOs including 3x high-voltage I/Os, 2 UARTs, SPI and I2C. Rapid end-of-line programming via the LIN pin can be carried out by the customers with the support of Melexis' recommended third parties. The MLX81346 takes up minimal board space. It can be supplied in either a 32-pin QFN (5 mm x 5 mm) or a 48-pin TQFP48 (7 mm x 7 mm) packages. This compact pre-driver was developed as a SEooC (Safety Element out of Context) with ASIL B capability. An operational temperature range of -40°C to 150°C is supported. All essential circuit protection functions are also incorporated.

Order to Deliver Powerful Converter Station
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Learn more:
hitachienergy.com
  • Industry News
  • 2022-05-31

Hitachi Energy announced that it has won an order from Deutsche Bahn to provide a 120 megawatt (MW) converter station which enables DB Energie to secure power supply for the Greater Berlin rail network. The network serves a metropolitan population of around 3.5 million people and is the hub for multiple high-speed train services to cities throughout Germany and neighboring countries. The Thyrow converter station, south of Berlin, will enable Deutsche Bahn to convert electricity from the public three-phase power distribution grid, which operates at a frequency of 50 hertz (Hz) to 16.7 Hz, and feed it into the rail power grid used to power trains and rail infrastructure. The order follows one awarded last year by Deutsche Bahn to Hitachi Energy for the 160 MW Delitz converter station in the greater Halle/Leipzig area, which will be one of the most powerful converter stations for rail power worldwide. The Hitachi Energy solution for the Thyrow converter station comprises three compact 40 MW static frequency converter modules, which use Hitachi Energy's advanced power semiconductors to provide a steady and reliable power supply at maximum availability and with minimal electrical losses. The solution includes a 30-year service contract and a digitalization package to provide Deutsche Bahn with condition-based and reactive maintenance and data insights into the system status of the converter station over the life cycle.

Acquisition Expands Served Addressable Market
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Learn more:
allegromicro.com
  • Industry News
  • 2022-05-31

Allegro MicroSystems announced the entry into an agreement to acquire Heyday Integrated Circuits. Heyday is a privately-held company specializing in compact, fully-integrated isolated gate drivers that enable energy conversion in high-voltage gallium nitride (GaN) and silicon carbide (SiC) wide-bandgap (WBG) semiconductor designs. The Heyday acquisition will complement Allegro's existing solutions for energy efficiency, including its current sensor solutions. Additionally, it is expected to significantly expand Allegro's addressable market for electric vehicles (xEV), solar inverters, datacenter and 5G power supplies, and broad-market industrial applications. Heyday's expertise in gate drive solutions provide system designers with innovative ways to fully leverage the potential of high-efficiency WBG switches. According to industry analysts and internal estimates, these advanced gate drive solutions give Allegro new access to an estimated $2.7 billion high-growth serviceable available market, increasing Allegro's content opportunity in green energy applications such as xEV on-board chargers and solar and traction inverters. "With high-powered GaN and SiC wide bandgap systems expected to grow significantly over the next decade, our customers are facing an exponential demand for simplified power management solutions," said Michael Doogue, Senior Vice President of Technology and Products at Allegro. "High-voltage isolated gate drivers are a fundamental enabling technology for the future of high-efficiency power system designs. Coupled with our market-leading integrated current sensors, Heyday's Power-ThruTM technology will allow our customers to build some of the smallest high-voltage and high efficiency power systems available today."

Expanding Integrated Switcher Family to 220 W
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Learn more:
power.com
  • Product Release
  • 2022-05-25

Power Integrations announced an expanded offering of the InnoSwitch4-CZ family of high-frequency, zero-voltage switching (ZVS) flyback controller ICs. When paired with Power Integrations' ClampZero active-clamp IC and, optionally, the recently announced HiperPFS-5 GaN-based power-factor corrector, the ICs easily address the latest USB PD 3.1 specification for adapters and chargers up to 220 W. "Road warriors demand light, compact, powerful adapters capable of rapidly charging all their mission-critical devices. The expanded power range of the new InnoSwitch4-CZ and ClampZero ICs allows charger/adapter designers to easily exceed 23 W per cubic inch for single- and multiple-output USB PD 3.1 certified designs," explained Edward Ong, senior product marketing manager at Power Integrations. "Even at 220 W of output power, the family's high efficiency minimizes waste heat; bulky heatsinks are not required on any of the active devices. The maximum switching frequency of up to 140 kHz minimizes transformer size, and the high level of integration approximately halves the number of passive components, MOSFETs and diodes that make safety-compliant PCB layout a challenge." InnoSwitch4-CZ ICs include a robust 750 V PowiGaN primary switch, active clamp drive and synchronous rectification in a compact InSOP-24D package. Secondary-side sensing – achieved using Power Integrations' FluxLink high-speed communications technology – provides exceptional CV/CC accuracy. Adds Ong: "The use of a non-complementary-mode active clamp enables designs that work in both continuous (CCM) and discontinuous (DCM) modes. By operating across modes, it is much easier to support the wide load/range conditions often encountered in USB PD applications."

WIPP 2022 Addresses High-Density/High-Efficiency Power Converter Packaging
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Learn more:
cvent.com
  • Event News
  • 2022-05-25

The International Workshop on Integrated Power Packaging announces IWIPP 2022, to be held in Grenoble, France, August 24-26, 2022, and hosted by G2E Labs. IWIPP, utilizing focused technical tutorials and a series of in-depth technical sessions, aims to foster and facilitate disruptive change in the development of power packaging technologies required to help increase reliability and manufacturability while targeting improved performance with reduced size and cost. IWIPP 2022 will feature keynote addresses from leading experts, a broad range of technical sessions, as well as a complement of partner exhibits, all of which are included in the registration fee. Under the leadership of General Chairman Dr. Francesco Iannuzzo of Aalborg University, IWIPP brings together industry, academic and government researchers in the field of power electronics components, electrical insulating materials, and packaging technologies to facilitate and promote the development and commercialization of high-density and high-efficiency power converters. Invited presentations and contributed papers will address a variety of timely topics, including power module design, magnetic and dielectric materials technology, component performance, and application-level impacts of packaging technology.

40 V, 1.1 mΩ FET Space-constrained Applications
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Learn more:
epc-co.com
  • Product Release
  • 2022-05-25

Efficient Power Conversion expands the selection of low voltage, off-the-shelf gallium nitride transistors with the introduction of the EPC2066 (0.8 mΩ typical, 40 V) GaN FET. The low losses and small size of the EPC2066 makes it the ideal switch for the secondary side of high power density 40 V – 60 V to 12 V DC-DC converters for the latest servers and artificial intelligence. It is also ideal for the secondary side synchronous rectification to 12V in power supply and silver box data center servers, and for high density motor drive applications from 24V – 32V. The high frequency operation, high efficiency, and an ultra-small 13.9 mm2 footprint of the GaN FET combine for state-of-the-art power density. The EPC2066 is footprint compatible with EPC's prior Generation 4 product, the EPC2024. The Generation 5 improvement in Area x RDS(on) gives the EPC2066 a 27% reduction in on-resistance in the same area. "The EPC2066 is significantly smaller than any other FET in the market at this on resistance", commented Alex Lidow, EPC's co-founder and CEO. "This part is the perfect compliment to the recently released EPC2071 for LLC DC-DC for high power density computing applications."

Trio of Performance T&M Instruments
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Learn more:
telonic.co.uk
  • Product Release
  • 2022-05-25

Telonic extends its instrumentation range with three instruments from Siglent Technologies' A-Line family: the SNA500A vector network analyser (VNA), the SDS6000A oscilloscope and the SDG7000A arbitrary function generator. Siglent's first two- or four-port vector network analyser, the SNA5000A, meets the demand for high-performance measurement in radio and cellular networks and is ideal for the measurement of passive or active components, verification of two-port networks or adaptation of antennas. The SDS6000A oscilloscope features eye diagrams and jitter analysis and an acquisition memory up to 500 Mpts over one, two or four channels. The waveform capture rate can reach up to 750,000 waveforms / s in sequence mode. Other features are digital and zone triggers, history function, mask test, Bode plot and a I2C, SPI, UART, CAN, LIN as standard. The SDS6000A can optionally be expanded by 16 digital channels and an external function generator (25 MHz). Additional serial bus decoders (CAN-FD, FlexRay, MIL1553, I2S, SENT, Manchester) are also available. The most recent addition to the A-Line series is the SDG7000A two-channel arbitrary function generator. Offered in 350 MHz, 500 MHz and 1 GHz bandwidths, it features two independent channels which can be combined via menu control to simulate interference on the main signal or to generate complex modulated signals. All of Siglent's new performance line of instruments include a web control interface that provides remote instrument control without additional software.

Collaborate to Accelerate Power System Design
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Learn more:
synopsys.com
  • Industry News
  • 2022-05-24

Synopsys and Analog Devices announced their collaboration to provide model libraries for DC/DC ICs and µModule (micromodule) regulators with Synopsys' simulation tool, Saber, part of Synopsys' virtual prototyping solution. With this library in the Saber system-level simulation system, powertrain designers for products such as electric vehicles, avionic machines, instrumentation equipment and supercomputers can perform accurate multi-domain simulations with precision and speed, accelerating the design process and time-to-market. "With robust and reliable Saber modeling for our power ICs and µModule devices, system designers can confidently rely on our services, focusing their attention on the rest of their complex designs involving field-programmable gate arrays (FPGAs), processors, memory, sensors, and data converters," said Afshin Odabaee, business development director for µModule Power Products at Analog Devices. "Collaborating with Synopsys enables us to deliver a powerful simulation solution based on Saber's integrated environment for simulation and modeling, allowing our customers to accelerate their time-to-market." From developing an electric vehicle's powertrain or charging system, to designing reliable aerospace systems, accurate models and powerful simulation are key to meeting competitive design targets. The availability of Analog Devices' library of comprehensive component models in Saber enables design teams to perform simulations at various levels of abstraction, with multi-domain physical modeling and unmatched analysis capabilities to explore, measure, and optimize system performance.

Electromagnetic Simulation Supports Designs Targeted at Communication and Automotive Markets
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Learn more:
xfab.com
  • Industry News
  • 2022-05-24

X-FAB Silicon Foundries announced a collaboration with the computational software vendor, Cadence Design Systems, in relation to electromagnetic (EM) simulation. As a result, the Cadence EMX Planar 3D Solver is now successfully integrated into the X-FAB RFIC workflow, thereby benefitting X-FAB's current and future RF platforms. The validation activities carried out via the EMX Solver on X-FAB RF reference designs for low-noise amplifiers, RF switches, filters and passives elements all delivered high-accuracy results within very short timeframes. By leveraging Cadence's EMX Solver, X-FAB design engineers can efficiently develop next-generation RF technology for the latest communication standards (including sub-6GHz 5G, mmWave, UWB, etc.), which are enabling technologies for electric vehicle (EV) wireless applications. Seamlessly incorporated within the Cadence Virtuoso RF solution, the intuitive EMX Solver quickly provides foundry models to a high degree of accuracy. These help to streamline product development processes and enable the most stringent design specifications to be met. Access to this ultra-fast EM simulator means that X-FAB customers will be able to get their design projects completed earlier, allowing them to gain significant time-to-market advantages. As part of its 130 nm RF SOI PDK, X-FAB now plans to supply reference designs that have been characterized using the EMX Solver. These will be distributed to customers in both the communication and automotive sectors. Furthermore, the PDK will include a wide array of inductor models which have all been pre-characterized by the EMX Solver.

800 V Power Inductors
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Learn more:
coilcraft.com
  • Product Release
  • 2022-05-23

Coilcraft RFC0807BV Series power inductors are a high-voltage version of our RFC0807B Series. Their operating voltage is rated at 800 V, which is significantly higher than comparable products in the market. They offer a cost-effective solution for high-voltage, universal off-line (non-isolated) AC/DC power supplies in a variety of industrial and automotive applications. These applications include grid infrastructure, smart meters or power monitors, residential circuit breakers, building automation, home appliances, and others. The RFC0807BV also features low DCR and high current capability, making it an ideal power inductor for high-current and high-voltage battery management systems. Their high voltage rating of 800 V make them ideal for high-voltage / high-current battery management systems, as well as universal off-line (non-isolated) AC/DC power supplies for industrial and automotive applications. They are also AEC-Q200 Grade 3 (-40° to +85°C) qualified.

IEEE International Electron Devices Meeting Announces 2022 Call for Papers
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Learn more:
ieee-iedm.org
  • Event News
  • 2022-05-20

Under the theme, "The 75th anniversary of the Transistor and the Next Transformative Devices to Address Global Challenges," the 68th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking original work in all areas of microelectronics research and development. The 2022 IEDM is being planned as an in-person conference December 3-7, 2022 at the Hilton San Francisco Union Square hotel, with on-demand access to recorded presentations after the event for those unable to travel due to COVID-19 restrictions. The paper submission deadline is Friday, July 14, 2022. Authors are asked to submit four-page camera-ready papers. Accepted papers will be published as-is in the proceedings. A few late-news papers also will be accepted, covering only the most recent and noteworthy developments. The late-news submission deadline is August 22, 2022. The IEEE IEDM is the premier forum for technological breakthroughs in semiconductor and related device technology, manufacturing, design, physics and modeling. Each year technologists gather to participate in a technical program of more than 220 presentations, panels, focus sessions, tutorials, Short Courses, supplier exhibits, IEEE/EDS award presentations and other events highlighting the industry's best work.

Dr. Werner Lohwasser Appointed CEO
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Learn more:
tdk.com
  • People
  • 2022-05-19

TDK Corporation announces that Dr. Werner Lohwasser (55) will become the new Chairman of the Management Board and Chief Executive Officer (CEO) of TDK Electronics effective July 1, 2022. This was decided by the Supervisory Board of TDK Electronics. Lohwasser has been a member of the Management Board since 2018 and will retain his previous duties as Chief Operations Officer (COO) of TDK Electronics and as COO of the TDK Electronic Components Business Company in his new role. He succeeds Joachim Zichlarz, who has led the company as CEO for eight years. "We are very pleased to have won Dr. Werner Lohwasser, an outstanding expert in both the passive components industry and TDK Electronics, for the position of CEO," said Dr. Werner Faber, Chairman of the Supervisory Board of TDK Electronics. "In recent years, Dr. Lohwasser has helped to shape the company's successful development within the TDK Group, and in the very challenging times ahead he will continue to contribute his decades of experience gained since 1996 at TDK Electronics and its predecessor companies, as well as at the U.S. based capacitor manufacturer Kemet."

Partnership for Gallium Nitride Automotive Power Modules
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nexperia.com
  • Industry News
  • 2022-05-19

Nexperia has announced a partnership covering gallium nitride (GaN) automotive power modules with KYOCERA AVX Components (Salzburg). This partnership agreement is the next step in the long-lasting close relationship between both companies and will focus on power components with the aim of jointly developing GaN applications for electric vehicles (EV). Thomas Rinschede, Deputy Vice President Sensing and Control Division at KYOCERA AVX, states: "We are very pleased to finally turn our successful and long-lasting relationship into a real partnership to strengthen KYOCERA AVX's strategy to provide high-quality automotive compliant modules. Nexperia is a trusted and reliable partner who can deliver high-performance GaN and has shown a strong record in producing devices for the automotive market." Carlos Castro, Vice President and General Manager GaN Nexperia, comments: "GaN devices bring many benefits to EV applications including increased power density, improved efficiency and lower overall system cost. However, optimized packaging technology is required in order to more fully realize the benefits of GaN devices, especially in high power systems. Nexperia recognizes the advanced technology offering and leading position which KYOCERA AVX holds in the automotive industry and believes that this joint collaboration in the development of GaN automotive power modules will enable both companies to deliver superior EV power systems solutions to our customers."

Metal Ceramic Substrates for Power Electronic Modules
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Learn more:
heraeus.com
  • Product Release
  • 2022-05-18

Heraeus Electronics announced the launch of its Condura.ultra Ag free AMB Substrate. An Ag free AMB substrate that enables bonding silicon-nitride-based ceramics with copper foils, Condura.ultra was developed using a special technique enabling high-performance Si3N4 substrates by using Ag free active metal brazing (AMB) bonding technology. ?In an effort to better support its customers, Heraeus Electronics has introduced Condura.ultra which is designed to offer reliability and processing (e.g., sintering, bonding, soldering). The Si3N4 Ag free AMB substrate is available with standard and thick Cu layers and thermal conductivity of =60 W/m.K and =80 W/m.K. With a comprehensive portfolio of metal ceramic substrates, Heraeus Electronics addresses the diverse needs of the Power Electronics segment, ranging from low-power applications up to the most demanding industries. The Condura portfolio consists of Condura.classic (DCB-Al2O3), Condura.extra (DCB-ZTA), Condura.prime (AMB-Si3N4), and the all new Condura.ultra (Si3N4 Ag free AMB). Heraeus Electronics' metal ceramic substrates are recommended for power electronic modules (e.g., current drivetrain inverters) using MOSFETs or IGBT semiconductor devices and diodes for widespread applications in the fields of automotive, electric motor drives, UPS, power supplies, industrial automation and testing.

Low-voltage Regulator for Energy-conscious Applications
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Learn more:
st.com
  • Product Release
  • 2022-05-17

STMicroelectronics' LD56020 200mA low-dropout voltage regulator operates with a supply from 1.1V to 5.5V and has low output noise for applications that demand excellent stability and long battery runtime. Ideal for mobiles, vision sensors, and wireless modules, the LD56020 has low dropout voltage of just 190mV (max. at full load) and maximum quiescent current of 25µA at light load. An external enable pin permits control logic to put the regulator into standby mode, which reduces current below 0.1µA. With supply-voltage rejection (SVRIN) of 90dB (1kHz, 20mA) and output noise of just 8.8µVRMS (10Hz to 100kHz), the LD56020 provides a clean power rail for low-voltage digital circuitry. The circuit is stabilized with only one small ceramic capacitor at each of the input and output terminals. In addition to minimizing the bill of materials, the low overall component count combines with the regulator's tiny chip-scale package (CSP) outline of 0.65mm x 0.65mm to ensure a compact circuit footprint with low impact on PCB size. The regulator integrates protection features including short-circuit current foldback and under-voltage lockout to prevent excessive dissipation in the event of a system fault. There is also over-temperature protection and an internal discharge path.

Jointly Targeting Net-zero Emissions for Chip Manufacturing
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Learn more:
imec-int.com
  • Industry News
  • 2022-05-17

imec announced that its Sustainable Semiconductor Technologies and Systems (SSTS) research program succeeded in bringing together stakeholders of the semiconductor value chain, from large system companies such as Apple and Microsoft, to suppliers, including ASM, ASML, KURITA, SCREEN and Tokyo Electron. The program was set up last year as part of imec's sustainability efforts to support the semiconductor industry reducing its carbon footprint. The addition of these new partners enables a holistic approach, which leverages imec's expertise and knowledge to cut the industry's environmental impact. The semiconductor industry is booming with a never-seen demand. As integral parts of our smart portable devices, IoT systems and compute infrastructure, chips are embedded in our everyday life. Semiconductor manufacturing, however, comes at a price. It requires large amounts of energy and water and creates hazardous waste. To tackle this problem, the entire supply chain needs to commit, and an ecosystem approach will be key. While system and fabless companies are already investing in decarbonizing their supply chain and products, committing to be carbon neutral by 2030 or 2040, they typically lack accurate insight into the contribution of chip manufacturing of future technologies as there is limited life cycle analysis data available.

Dual-output DC/DC Converter for Electric Vehicles
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Learn more:
greenwattpower.com
  • Product Release
  • 2022-05-17

Green Watt Power announces the EVD125 Series of dual-output ruggedized DC/DC converters for Electric Vehicle applications. The fully encapsulated, EVD200 has a very wide input range from 36Vdc to 100Vdc with output voltages of 12Vdc and 5Vdc to power auxiliary EV functions such as lights, instruments, accessories, etc., or to act as a distribution voltage for subsystems. With a combined output current of 12A (peak) the EVD 125 is protected by Over Voltage Protection, Short Circuit Protection, and Over Temperature Protection. The IP65 rated product provides protection against water intrusion and offers a very cost-effective solution for low-power requirements with an optional enable function and are ROHS compliant. Efficiencies for the EVD125 run as high as 89.5% and the unit features a metal baseplate for excellent heat transfer to a metal mounting surface. The working ambient temperature range of the EVD125 is -20 to +400C. The case size is only 89.5x69x38.9mm with a weight of less than 200g.

Boosting Power Semiconductor Production Capacity
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renesas.com
  • Industry News
  • 2022-05-17

Renesas Electronics announced that it will conduct a 90-billion-yen worth investment in its Kofu Factory, located in Kai City, Yamanashi Prefecture, Japan. While the Factory was closed in October 2014, Renesas intends to reopen the fab in 2024 as a 300-mm wafer fab capable of manufacturing power semiconductors. The Kofu Factory of Renesas Semiconductor Manufacturing Co., Ltd., a wholly-owned subsidiary of Renesas, previously operated both 150mm and 200mm wafer fabrication lines. To boost its production capacity, Renesas decided to utilize a remaining building of the factory and revive it as a 300mm wafer fab dedicated to power semiconductors. "Sustainability is at our heart and with 'To Make Our Lives Easier' as our Purpose, we want to build a sustainable future where our semiconductor technology and solutions help make our lives easier," said Hidetoshi Shibata, President and CEO of Renesas. "This investment enables us to have our largest wafer fabrication line dedicated to power semiconductors, which are key to realizing decarbonization. We will continue to conduct necessary investments to enhance our in-house production capability while further strengthening ties with outsource partners. To address the mid to longer term demand growth, Renesas remains committed to ensuring security of supply in order to provide our customers with the best possible support."

Trusted Silicon Photonics Verification
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siemens.com
  • Industry News
  • 2022-05-17

Siemens Digital Industries Software announced that its Calibre nmPlatform now enables designers to leverage the GlobalFoundries (GF) silicon photonics platform. GF's monolithic platform, GF Fotonix  combines its differentiated 300mm photonics and RF-CMOS features on a silicon wafer. The GF Fotonix process design kits (PDKs) include Siemens' Calibre nmDRC software for design rule checking (DRC) and Calibre nmLVS software for layout vs. schematic (LVS) verification. Both Calibre tools are fully certified by GF, so mutual customers designing for the new GF Fotonix platform can continue to use the trusted Calibre nmPlatform for silicon photonic devices as they have used for previous offerings. Silicon photonics enables companies to bring fiber optics directly into integrated circuits. However, silicon photonic devices contain curved layouts, rather than the linear Manhattan grid features found in traditional CMOS designs. Applying traditional CMOS DRC to silicon photonic layouts yields numerous false positive errors that design teams must often spend weeks tracking down. To address this challenge, GF leverages Siemens' Calibre eqDRC software, which allows rule checks to use equations in place of, or in addition to, linear measurements. This helps enable more accurate results, leading to significantly fewer errors, so design teams can spend far less time and fewer resources debugging their designs. 

DC-DC Converter Design for More Electric Aircraft
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gaia-converter.com
  • Industry News
  • 2022-05-16

GAIA Converter in collaboration with Universidad Politecnica de Madrid has developed an optimal DC-DC converter design for More Electric Aircraft (MEA) with over 96% efficiency. The design meets stringent MEA specifications while providing a wide input voltage and output power range, high power-density and narrow frequency variations. DC-DC converters are critical to the ongoing transition toward More Electric Aircraft (MEA). The replacement of hydraulic and pneumatic systems with electric solutions requires Size, Weight and Power (SWaP)-optimized converters that also ensure high levels of isolation. GAIA Converter's R&D team worked closely with Universidad Politecnica de Madrid to develop and implement a new automated design tool, based on an optimization algorithm. The team was able to meet stringent MEA specifications, including mechanical dimensions, thermal conditions, and EMI standards, while taking design optimization to the next level. The project led to the creation of an optimized high-frequency (1MHz) resonant LLC converter prototype. The converter has an input voltage range from 220 V to 320 V and delivers 1.5KW output power at 28V output voltage. This converter achieves an efficiency over 96% at full power with a power-density of 32 kW/dm3, (half-brick package) and a narrow frequency variation range (15%).

High Voltage Circuit Breaker with Arc Interruption Method
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pfiffner-group.com
  • Product Release
  • 2022-05-16

PFIFFNER Group has announced a high voltage air-insulated switchgear (AIS) circuit breaker for substations which uses an SF6-free and F-gas free as its insulation media for the safe and sustainable operation of electrical grids. The circuit breaker will complement the company's portfolio of high voltage solutions while helping customers to reduce their carbon footprint in a cost-effective way. Sulfur hexafluoride, commonly known as SF6, is a man-made gas utilized primarily as an electrical insulator and arc suppressant. While extremely effective in circuit breaker applications, it is also one of the most harmful greenhouse gases in existence. As such, component manufacturers in the electrical grid sector have been seeking solutions in recent years to limit its usage. PFIFFNER's solution instead uses an eco-compatible gas that eliminates the use of SF6 and F-gases entirely. Circuit breakers are one of the most critical components in an AIS switchyard. Reliability is crucial, as the product has to work under all conditions, and may spend many years or decades at a time dormant before being required to spring into action. When closed, the circuit breaker must behave like an ideal conductor with no resistance, and when open it must be a perfect insulator, conducting nothing. When the contacts separate upon activation, the interrupter must move instantly to extinguish any arcing and prevent damage to downstream line components. When activated this process will typically occur within 20 to 30 milliseconds, involving the high-speed movement of mechanical masses up to 20-30 kg. 

High Power Density Gaming Laptop Power Supply
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Learn more:
gansystems.com
  • Product Release
  • 2022-05-11

GaN Systems and Phihong Technology (Phihong) announced the debut of Phihong's 280W GaN gaming power supply in a compact size of 160 x 69 x 25 mm case and a 700g lightweight design. At 16W/in3 power density, Phihong's 280W GaN charger breaks through design limits and challenges long held in the industry. The 280W GaN charger is highly efficient, with a 95% full load conversion efficiency and < 0.2W no-load standby loss. This charger brings R&D and innovation to the power supply industry and laptop gaming market, merging Phihong's power solutions design and development expertise and GaN Systems' leading GaN power semiconductors. Phihong's 280W GaN gaming power supply combines a high-efficiency topology structure, zero voltage and zero current soft switching technology, digital control, and features GaN Systems' power semiconductors. The GaN Systems power semiconductors enable power supply manufacturers to deliver smaller, lighter weight, cost-effective, reliable solutions. The advantages of GaN allow more efficient and unrivaled power density to power supplies while providing the higher power and faster charging times that are important to consumers today. "In this very mobile world, users want thin, sleek mobile devices and seek the same requirements for the chargers that go along with them. With GaN, gone are the days of the "brick" power supply," said Jim Witham, CEO of GaN Systems, "It's great to see Phihong design in GaN Systems in their AC adapters to achieve the small size and high power demanded by laptop users."

Low Voltage Buck Converter Targets High Power Density Automotive Designs
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diodes.com
  • Product Release
  • 2022-05-11

Diodes Incorporated has introduced the automotive-compliant DIODES AP61300Q and DIODES AP61302Q synchronous buck converters. These 3A-rated devices have a wide input voltage range of 2.4V to 5.5V, and address the need for automotive point-of-loads (POLs) that are more streamlined and exhibit increased efficiency levels. They are optimized for use in vehicles' telematics, ADAS, power and infotainment systems, as well as instrumentation clusters. Incorporated into each of these buck converters is a 70mO high-side power MOSFET and a 50mO low-side power MOSFET which together deliver high-efficiency step-down DC-DC conversion. With fast switching speeds supported, much smaller accompanying passives can be specified, thereby reducing the overall bill-of-materials (BOM) and saving space. Depending on the load conditions, the AP61300Q and AP61302Q can be configured to pulse frequency modulation (PFM) or pulse width modulation (PWM) operating modes (using the enable pin). Their quiescent current (IQ) of 19µA, when in PFM mode, allows them to maintain elevated efficiencies even in light load situations. Furthermore, their low drop-out (LDO) mode permits output voltage regulation to be maintained when the input voltage comes close to the VOUT voltage. Due to the constant on-time (COT) control functionality that the AP61300Q and AP61302Q both feature, rapid transient response, easy loop stabilization, and low output voltage ripple are all attained, with only minimal external components needed. As a result, much less PCB area needs to be allocated and overall production costs are reduced.

SiC FETs for 800V Architectures
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Learn more:
unitedsic.com
  • Product Release
  • 2022-05-11

Qorvo announced a series of 1200V Silicon Carbide (SiC) Field Effect Transistors (FETs). The UF4C/SC series of 1200V Gen 4 SiC FETs are ideally suited for mainstream 800V bus architectures in onboard chargers for electric vehicles, industrial battery chargers, industrial power supplies, DC/DC solar inverters, as well as welding machines, uninterruptible power supplies, and induction heating applications. Anup Bhalla, Chief Engineer – Power Devices, UnitedSiC/Qorvo, said: "Expanding our 1200V range with higher performance Gen4 options allows us to better serve the engineers who are moving their bus designs to 800V. In electric vehicles, this move to higher voltages is inevitable and these new devices, with four different RDS(on) classes, help designers select the best possible SiC choice for every design." All RDS(on) options (23, 30, 53 and 70 milliohm) are offered in the industry standard 4-lead kelvin source TO-247 package, providing cleaner switching at higher performance levels. The 53 and 70 milliohm devices are also available in the TO-247 3-lead package. This series of parts have excellent reliability, based on the well-managed thermal performance, which is a result of an advanced silver-sinter die attach and advanced wafer-thinning process. All 1200V SiC FETs are included in FET-Jet Calculator, a free online design tool that allows for instant evaluation of efficiency, component losses, and junction temperature rise of devices used in a wide variety of AC/DC and isolated/non-isolated DC/DC converter topologies. Single and paralleled devices may be compared under user-specified heat-sinking conditions to enable optimum solutions.

Clip-bonded FlatPower Packaged Diodes
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nexperia.com
  • Product Release
  • 2022-05-11

Nexperia announced the release of 14 rectifiers for power applications in its CFP2-HP (Clip-Bonded FlatPower) packaging. Available in standard and AEC-Q101 versions, these include 45 V, 60 V and 100 V Trench Schottky rectifiers (with 1 and 2 A options) including the PMEG100T20ELXD-Q, a 100 V, 2 A Trench Schottky barrier rectifier. For applications requiring hyperfast recovery Nexperia has also added the 200 V, 1 A PNE20010EXD-Q rectifier to the portfolio. The vertical thermal design on multilayer PCBs enables designers to save up to 75% of board space with CFP2-HP compared to using a device in a SMA package, while still maintaining the same level of electrical performance. This rugged package design enables longer operating times and better board level reliability, while the new lead shape improves automatic optical inspection (AOI). "With the switch to smaller packages like CFP being now well underway, Nexperia is aiming to be the driving force that further accelerates this transition" according to Frank Matschullat, Product Group Manager Power Bipolar Discretes at Nexperia. "Nexperia has invested heavily to expand its capacity to serve the growing demand for CFP-packaged products stays well ahead of market projections for the next three years. These diodes are the latest additions to over 240 CFP-packaged products which Nexperia currently offers." Today, CFP packaging is used by different power diode technologies such as Nexperia's Schottky, silicon germanium and recovery rectifiers but can also be extended to bipolar transistors. It offers significant product diversity, covering single/dual configuration and currents between 1-20 A, simplifying board design.

65 W Active Clamp Flyback Reference Design with 30 W/in3 Power Density
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Learn more:
innoscience.com
  • Product Release
  • 2022-05-11

Innoscience and Silanna Semiconductor demo'd a 65 W Active Clamp Flyback (AFC) reference design with 30 W/in3 uncased power density. The design achieves efficiency levels of greater than 94% @ 230 Vac and has a no-load power consumption of less than 25 mW. The design combines the performance of Innoscience's INN650D240A 650V GaN-on-silicon enhancement-mode power transistor with Silanna's SZ1131 Fully Integrated Active Clamp Flyback (ACF) controller. The GaN HEMT enables ultra-high switching frequency, has no reverse-recovery charge and low gate charge and low output charge. RDS(on),max is 240 m?. Silanna's CO2 Smart Power SZ1131 combines high integration and operational efficiency (95%) with no-load power consumption of under 20mW. The 65 W reference design on a PCBA measuring just 34 x 34.5 x30.5mm. It has an input voltage range of 90-265 VAC and offers USB-PD output voltages and current configurations of 5 V/3 A, 9 V/3 A, 15 V/3 A and 20 V/3.25 A. Innoscience and Silanna Semiconductor are also collaborating on higher power multi-port reference designs and will introduce them to the market soon. SZ1131, the latest addition to Silanna's family of CO2 Smart Power technologies, addresses the power management challenge facing engineers by simplifying design and improving performance while meeting environmental sustainability goals through more efficient energy use.

Battery Experts Forum's Conference Programm Finalized
  • Event News
  • 2022-05-11

The Battery Experts Forum is pleased to announce the release of its three-day conference program from July 12 - 14, 2022 (Frankfurt am Main/Exhibition Center). The Battery Experts Forum will feature high-profile speakers from key players in the battery industry and will address the current challenges facing the industry. Including speakers like Shmuel De-Leon, a globally networking battery expert from Israel, and Sven Bauer, a world-renowned pioneer in lithium-ion battery manufacturing who already believed in the great potential of electrification in the 1990s, the organizers of the world's largest battery trade fair, the Battery Experts Forum, can present a top-class league of speakers at their conference for the 17th time. Inspiring impulses, by keynotes, tutorials and technical presentations, are granted by topics such as fast charging, battery management systems, battery safety, recycling, standardization, procurement security and the world market situation. Experts from key players and consultants in the battery industry, such as Honda R&D Co. Ltd, Roland Berger, Williams Advanced Engineering, McKinsey & Company Inc, Farasis Energy Europe GmbH, Freyr, Exyte Management GmbH and Robert Bosch GmbH, as well as from institutes such as ZSW Ulm, RWTH Aachen, KIT Karlsruhe, Fraunhofer and the European Commission - Joint Research Centre, have been engaged for the presentations.

SiC Power Device with Industry Standard Package Dual Device
  • Product Release
  • 2022-05-11

Mitsubishi Electric US launched a Silicon Carbide (SiC) power module FMF400DY-24B. The 400A, 1200V Dual SiC MOSFET module includes an anti-parallel, low Vf, zero recovery loss, SiC SBD (Schottky Barrier Diode). The module packages new designs into a current industry standard footprint (62mm x 108mm) for medical power supplies and general industrial applications. Designed for Vgs(on)=15V, the module is compatible with standard IGBT gate drivers and can be seamlessly incorporated into existing mechanical layouts for easy upgrades from Si IGBT technologies. The module uses Mitsubishi Electric second generation SiC MOSFET chip technologies that are ideal for applications requiring high switching frequencies. The SiC module reduces power loss by approximately 70% compared with an equivalently rated Si IGBT. "This new module is in a classic package footprint, with the latest technology inside for superior function and flexibility," said Adam Falcsik, senior product manager of Mitsubishi Electric US's Power Device group. "The FMF400DY-24B adds to Mitsubishi Electric's growing lineup of SiC products." In addition to higher efficiency, the module is compliant with the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS) directive 2011/65/EU and (EU) 2015/863 to meet critical environmental regulations. The module furthers Mitsubishi Electric's core technology vision by contributing to a smarter and more sustainable society.

100 V, 2 mΩ GaN FET for Space-constrained Applications
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Learn more:
epc-co.com
  • Product Release
  • 2022-05-10

Efficient Power Conversion Corporation expands the selection of low voltage, off-the-shelf gallium nitride transistors with the introduction of the EPC2071 (1.7 mΩ typical, 100 V) GaN FET. The EPC2071 is ideal for applications with demanding requirements for high power density performance including 48 V – 54 V input DC-DC for new servers and artificial intelligence. Lower gate charges, QGD, and zero reverse recovery losses enable high-frequency operations of 1 MHz and beyond and high efficiency in a tiny 10.2 mm2 footprint for state-of-the-art power density. The EPC2071 is ideal for BLDC motor drives, including e-bikes, e-scooter, robots, drones, and power tools. The EPC2071 is 1/3rd the size of a silicon MOSFET with the same RDS(on), QG is 1/4th that of the MOSFET, and the dead time can be reduced from 500 ns to 20 ns to optimize motor plus inverter efficiency and reduce acoustic noise. The EPC2071 is footprint compatible with EPC's prior Generation 4 family of products: EPC2021, EPC2022, EPC2206. The Generation 5 improvement in Area x RDS(on) gives the EPC2071 the same on-resistance as the prior generation with a 26% smaller size. "The EPC2071 makes the ideal switch for the primary side of the LLC DC-DC converter from 40 V – 60 V to 12 V- 5V. This 100-volt device offers improved performance and cost compared with previous-generation 100 V GaN FETs allowing designers to economically improve efficiency and power density", according to Alex Lidow, EPC's co-founder and CEO. "These parts are also suitable for telecom and server power supplies, and solar applications."

Memorandum of Understanding to Cooperate in the Field of SiC Power Module Technology
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Learn more:
mitsubishichips.eu
  • Industry News
  • 2022-05-10

Siemens Mobility and Mitsubishi Electric Europe B.V. have signed a Memorandum of Understanding (MoU) to cooperate in the field of SiC power module technology with the aim of enabling efficient and sustainable transportation and electrical energy savings in the transportation sector. With creation of the "European Green Deal", the EU has committed itself to being the first continent to achieve climate neutrality by 2050, meaning no net emissions of greenhouse gases by 2050. At an intermediate stage, emissions are already to be reduced by 55 % by 2030 compared with 1990. The European Green Deal will result in binding directives for individual sectors regarding CO2 emissions. Mitsubishi Electric's SiC devices have proven long-term reliability in the most demanding of applications such as traction inverters in trains. The potential for energy savings through the use of Mitsubishi Electric's wide range of SiC power devices in railway technology exists particularly in the area of traction drives. In particular the full SiC 3300 V power modules contribute to energy saving and the downsizing of traction inverters. Siemens has always been a pioneer in the construction of electrically powered trains. Their 140 years of experience forms the basis for the new Mireo Plus regional train platform, which enables operators to run their operations efficiently and economically without local CO2 emissions. Using the innovative technology of the battery powered Mireo Plus, Siemens Mobility enables electrification of railway lines even without a continuous overhead contact line.

IGBT/SiC Module Driver Family Targets Bus, Truck and Con-Ag EVs
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Learn more:
power.com
  • Product Release
  • 2022-05-10

Power Integrations announced the SCALETM EV family of gate-driver boards for Infineon EconoDUALTM modules. Suitable for original, clone and new SiC variants, the driver targets high-power automotive and traction inverters for EV, hybrid and fuel-cell vehicles including buses and trucks as well as construction, mining and agricultural equipment. SCALE EV board-level gate drivers incorporate two reinforced gate-drive channels, associated power supplies and monitoring telemetry. The boards are automotive-qualified and ASIL B certified, enabling implementation of ASIL C traction inverter designs. The first SCALE EV family member to be released is the 2SP0215F2Q0C, designed for the EconoDUAL 900 A 1200-volt IGBT half-bridge module. The high level of integration provided by innovative driver ICs enables the entire driver board, including gate power, to fit onto the outline of the power module, while still providing the spacing necessary for reinforced isolation according to the IEC 60664 standard. The ASIC package provides 11.4 mm of creepage and clearance, specifically designed to meet the requirements for 800-volt vehicle system voltages. Input and output lines to the system microcontroller are connected via two independent on-board connectors to meet functional safety requirements. A single 5 V supply per channel is required, with other isolated voltages being generated on the board itself. The SCALE EV gate-driver family is rated at 1200 V for 400-volt and 800-volt systems and supports both silicon carbide (SiC) MOSFETs and silicon IGBTs.

TOLL-packaged 650 V Silicon Carbide MOSFET
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Learn more:
onsemi.com
  • Product Release
  • 2022-05-10

onsemi announced a TO-Leadless (TOLL) packaged sillicon carbide (SiC) MOSFET. The transistor addresses the rapidly growing need for high-performance switching devices that are suitable for designs with high levels of power density. Until recently, SiC devices had been supplied in D2PAK 7-lead packages which required significantly more space. With a footprint of just 9.90 mm x 11.68 mm, the TOLL package offers 30% savings in PCB area over a D2PAK package. And at a profile of just 2.30 mm, it occupies 60% less volume than a D2PAK package. In addition to its smaller size, the TOLL package offers better thermal performance and lower package inductance (2 nH) than a D2PAK 7-lead. Its Kelvin source configuration ensures lower gate noise and lower switching losses – including a 60% reduction in turn-on loss (EON) when compared to a device without a Kelvin configuration, ensuring significant improvements in efficiency and power density in challenging power designs as well as improved EMI and easier PCB design. The first SiC MOSFET to be offered in the TOLL package is the NTBL045N065SC1 which is intended for demanding applications including switch-mode power supplies (SMPS), server and telecommunication power supplies, solar inverters, uninterruptible power supplies (UPS) and energy storage. The device is suitable for designs that are required to meet the most challenging efficiency standards including ErP and 80 PLUS Titanium. The NTBL045N065SC1 has a VDSS rating of 650 V with a typical RDS(on) of just 33 m? and a maximum drain current (ID) of 73 A. Based upon wide bandgap (WBG) SiC technology, the device has a maximum operating temperature of 175°C and ultra-low gate charge (QG(tot) = 105 nC) that significantly reduces switching losses.

Device Analyzer / Double-Pulse Tester for Discrete Devices and Power Modules
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Learn more:
keysight.com
  • Product Release
  • 2022-05-10

Keysight Technologies announced the PD1550A Advanced Dynamic Power Device Analyzer, a Double-Pulse Tester (DPT) with enhanced capabilities that enable customers to test entire power modules fast and easy. Power modules are used in various applications such as electric vehicles (EV), solar power inverters, trains, home appliances and aircraft due to ease of design, high energy density and reliability. New, wide-bandgap (WBG) device-based power modules are now used by designers to take advantage of the device's fast-switching operation, reducing the size of the power electronic module, and ensuring efficiency. However, WBG power modules also introduce test challenges that require new solutions to properly characterize these devices while eliminating failed prototypes and reducing design cycles. Introduced in 2019, Keysight's PD1500A Power Device Dynamic Analyzer / Double-Pulse Tester was the first complete solution for discrete WBG power device characterization and is now used by power converter designers and power semiconductor manufacturers around the world. Now, the new PD1550A expands beyond the PD1500A's capabilities to offer the first complete integrated solution that tests entire power modules (up to 1360 V, up to 1000 A). As a result, automotive original equipment manufacturers (OEMs), Tier 1 suppliers and power converter designers can test faster and gain more insights into power module characteristics, enhancing the safety and reliability of power circuits for automotive applications.

Solid-state Relays Can Help Make EVs Safer
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Learn more:
ti.com
  • Product Release
  • 2022-05-10

Texas Instruments introduced a portfolio of solid-state relays, including automotive-qualified isolated drivers and switches, that deliver reliability to help make electric vehicles (EVs) safer. The isolated solid-state relays also provide small solution size while reducing the bill-of-materials (BOM) cost of powertrain and 800-V battery-management systems. The TPSI3050-Q1 isolated switch driver with an integrated 10-V gate supply and the TPSI2140-Q1 1,400-V, 50-mA isolated switch both integrate power and signal isolation across a single barrier using a unique approach that improves reliability, while significantly reducing solution size and cost compared to existing electromechanical relays and solid-state photorelays. The devices are the first in a new solid-state relays portfolio that will also include ICs designed for high-voltage industrial applications. The solid-state relays can disconnect and connect loads through a single isolation barrier in microseconds – compared to milliseconds for electromechanical relays – to enable safer operation of high-voltage automotive systems. The TPSI3050-Q1, which offers reinforced isolation up to 5 kVRMS, also provides an operating lifetime that's 10 times higher than electromechanical relays, which can degrade over time. Additionally, the TPSI2140-Q1 offers basic isolation up to 3.75 kVRMS, enabling it to achieve more than four times higher time-dependent dielectric breakdown reliability than solid-state photorelays.

8-inch GaN-on-Si Device Maker now Represented by Semiconductor Distributor
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Learn more:
innoscience.com
  • Industry News
  • 2022-05-10

Innoscience Technology has signed a global distribution agreement with WPG Holdings (WPG), giving customers in all parts of the world access to Innoscience's high and low voltage normally-off (enhancement mode) GaN HEMTs. Dr Denis Marcon, General Manager, Innoscience Europe comments: "Our aim is to ensure that every power electronics designer – no matter where they are based – can benefit from the efficiency, power and size advantages that GaN technology brings. That is why we have invested in huge capacity. Distribution is also a big part of our plans, and we are excited and honoured to announce WPG as our first global supply chain partner." Adds Nigel Watts, VP, WPG EMEA: "GaN is set for explosive growth as all markets – consumer, communications, automotive, industrial – experience the leap forward in end-product performance they can achieve by switching from traditional silicon-based power devices to GaN. Innoscience is the world's largest 8-inch GaN-on-Si device manufacturer with a capacity of 10,000 8-inch wafers per month (WPM) – which is set to grow to 70,000 WPM by 2025. Therefore it is fitting that Innoscience have signed a global franchise deal with WPG. Product is available NOW and lead-times are far better than the traditional Silicon alternatives. Design now and manufacture sooner."

High Isolation 6W DC/DC Converters
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Learn more:
coseleurope.eu
  • Product Release
  • 2022-05-10

COSEL announced the addition of a series of high isolation 6W DC/DC converters for medical, industrial and ICT applications. Packaged in a Single In Line (SIP) type 8, the COSEL MH6 series has a reinforce isolation of 3kVAC, 4.2kVDC, complies with medical isolation standard (2MOOP (250VAC working voltage)) and ruggedized for industrial applications that might implies differential IN/OUT voltage. Three input voltages (4.5V-18V ; 9V – 36V and 18V -76V) and a large variety of single (MHFS6) and dual output (MHFW6) cover a large range of applications. Designed for performances, the MH6 has only 20pF max insulation capacitance reducing noise transfer. For medical applications, the MH6 series complies with the 2xMOOP (250VAC) (Means Of Operator Protection) isolation requirement, as specified in the IEC60601-1 3rd edition standard. To reduce inventory but as well making their equipment easy to install and maintain, system's designers require DC/DC converter able to accept a large range of input voltages. The COSEL MH6 series is available in three wide-input range voltage: 4.5V to 18V covering 12V battery applications, 9V to 36V combining 12V and 24V battery systems and 18V to 76V addressing 24V and 48V systems.

Isolated DC and AC Current Measurement up to 200Arms
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danisense.com
  • Product Release
  • 2022-05-10

Danisense is launching its DT series of fluxgate technology current transducers for isolated DC and AC current measurement up to 200Arms. Benefiting from a considerable reduced size with 60% less volume compared with the previous product generation, the devices feature a large frequency bandwidth of up to 2MHz and a primary current of ranging from 50A up to 200A. DT series current transducers use Danisense's Fluxgate, closed loop compensated technology with fixed excitation frequency and second harmonic zero flux detection for best in class accuracy and stability. Excellent linearity (better than 2 ppm), an industry standard DSUB 9-pin connection, a green diode for normal operation indication and a large aperture with a diameter of 20.7mm for cables and bus bars are further features of the components. DT series current transducers are Ideal for applications such as high precision power supplies for laboratories, accelerators and medical equipment where size is a key factor as designs for such power supplies are getting smaller and smaller to increase power density and reduce costs. Size is also very important for the embedded power measurement application for cars where placing the transducers in a compact motor and inverters environment is always a challenge. The large frequency bandwidth of the DT series is another advantage for such power measurement applications.

Platform for Developing GaN-Based Zero Voltage Switching Chargers
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Learn more:
eggtronic.com
  • Product Release
  • 2022-05-10

Eggtronic and Navitas have announced a QuarEgg evaluation board that will speed the development and implementation of fast-chargers and power adapters. QuarEgg is an proprietary Zero Voltage Switching power architecture that has been designed to improve the efficiency and reduce the size of AC/DC converters. The architecture maximizes the performance, minimizes the form factor and improves the reliability of AC/DC power schemes in applications ranging from USB-C Power Delivery fast chargers and adapters for mobile devices and laptops to power supplies for loudspeakers and smart home assistants. The 35W AC/DC evaluation board brings together the QuarEgg ZVS architecture integrated in an Eggtronic EPIC101AFQE01 secondary side mixed-signal controller embedding USB Power Delivery 3.1, Synchronous Rectification, no-opto control of primary side FET, and Navitas' GaN technology. Compared to conventional silicon-based designs built using active clamp flyback (ACF) or quasi-resonant (QR) topologies, this combination offers improved AC/DC conversion performance and efficiency and much smaller product form factors. In addition, when compared to the silicon counterpart based on the same QuarEgg controller, GaN offers a further 8% energy savings. The AC/DC development board measures just 38.3 x 38.3 x 18.55 mm and incorporates all of the components needed for a USB-PD or fixed-output converter Peak efficiency is in excess of 94.1%, while a very flat efficiency curve ensures maximum efficiency and minimum power losses across the widest possible range of loads. This includes a 91% efficiency when in light load conditions (10% of maximum load), which is fundamental for devices that are always plugged in and draining power from the mains.

2 kV Silicon Carbide MOSFETs for 1500 VDC Applications
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Learn more:
infineon.com
  • Product Release
  • 2022-05-10

Infineon Technologies introduced its expanded CoolSiC portfolio with high-voltage solutions to provide the foundation for next-generation photovoltaic, EV charging and energy storage systems. The extended CoolSiC portfolio offers 2 kV silicon carbide (SiC) MOSFETs, along with a 2kV SiC diode for applications up to 1500 V DC. The SiC MOSFET combines both low-switching losses and high-blocking voltage in one device that can optimally meet the requirements of 1500 V DC systems. The 2 kV CoolSiC technology offers a low drain-source on resistance (R DS(on)) value. In addition, the rugged body diode is suitable for hard switching. The technology enables sufficient overvoltage margin and offers ten times lower FIT rate caused by cosmic ray, compared to 1700 V SiC MOSFETs. Furthermore, the extended gate voltage operating range makes the devices easy to use. This SiC MOSFET chip is based on Infineon's SiC MOSFET technology named M1H which has recently been introduced. The latest advancements enable a significantly larger gate voltage window that improves the on-resistance for a given die size. Simultaneously, the larger gate voltage window provides a high robustness against driver- and layout-related voltage peaks at the gate, without any restrictions even at high switching frequencies. Infineon offers a range of EiceDRIVER gate drivers with functional isolation of up to 2.3 kV to support the 2 kV SiC MOSFETs.

Cooperation on Silicon-carbide Technology for Electric-vehicle Drives
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Learn more:
st.com
  • Industry News
  • 2022-05-10

STMicroelectronics has revealed it is supplying silicon carbide (SiC) technology for the eMPack electric-vehicle (EV) power modules from Semikron. This is the result of a four-year technical collaboration between the two companies to design-in ST's advanced SiC power semiconductors for efficiency and performance in more compact systems. SiC is quickly becoming the automotive industry's preferred power technology for EV traction drives, contributing to greater driving range and reliability. Semikron recently announced it had secured a billion-Euro contract to supply their innovative eMPack power modules to a major German car maker, beginning in 2025. "ST's SiC device-manufacturing capabilities and in-depth expertise with the technology enabled us to integrate these semiconductors with our advanced manufacturing processes, which enhance reliability, power density, and scalability to meet the needs of the automotive industry," said Karl-Heinz Gaubatz, Semikron Chief Executive Officer (CEO) and Chief Technical Officer (CTO). "As we now move towards volume-production, our collaboration with ST brings the assurance of a robust supply chain that gives control over quality and delivery performance." "Leveraging our SiC technology, Semikron's advanced scalable eMPack family of power modules is ready to make a major contribution towards zero-emission motoring," said Edoardo Merli, Power Transistor Sub-Group General Manager and Executive Vice President of STMicroelectronics. "In addition to its transformative effect in e-mobility, our SiC technology, now in its third generation, is driving increased efficiency, performance, and reliability in sustainable energy and industrial power-control applications."

Solutions for Motion Control, Renewable and Power Supply Applications
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Learn more:
vincotech.com
  • Product Release
  • 2022-05-09

Vincotech returned to the PCIM with a showcase of solutions, like the company's latest technologies and innovations, such as VINcoPress. "We have a host of highlights to show customers and prospects. Solutions in Power Factor Correction topologies, VINcoPress techology and the new flow E3 housings benefit the industry in so many ways," said Edoardo Guiotto, VP Sales and Marketing. New Current Synthesizing PFC (CSPFC) topology provides highest efficiency at lowest total system costs through reduced number of SiC devices, and reduced number and size of the PFC inductors. It is an attractive candidate for three-phase PFC applications, where a balanced load is a given, such as motion control, EV-charging, renewable energy and UPS systems for data centers. VINcoPress is a direct-pressed substrate technology engineered for superior thermal performance. It distributes pressure and Rth uniformly, increases modules' power capability and power density, and provides a rugged, reliable heat sink assembly. New housings are here to enhance Vincotech's line of baseplate-less, 12-mm, low-inductive power modules. Bringing the benefits of industry-standard flow E housings to the higher power range, the new flow E3 modules enable engineers to boost legacy designs' power with just minor mechanical adjustments. Both flow S3 and flow E3 lines now also feature VINcoPress alongside Vincotech's pre-applied phase-change thermal interface material (PC-TIM), advanced die-attach technology and an optional AlN DCB.

Low Insertion Impedance Method of Measuring Alternating Currents
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Learn more:
pemuk.com
  • Product Release
  • 2022-05-09

PEM's CWT 'HF' family of Rogowski current probes meet the challenges of measuring current in renewable and power electronic applications with attenuate interference from fast local voltage transients and retain a small size. They also feature optimised high frequency (HF) performance to measure rapidly changing AC currents. The CWTMini50HF is available with a coil size of just 100mm, 3.5mm thick with a rise-time capability of 12.5ns, ideal for the challenging environment of converters utilising power SiC semiconductor switches. At the other end of the scale, the CWTHF with coils from 300mm to 1000mm, or even longer, enable measurement in applications as diverse as high frequency bearing current in machine shafts, lightning strikes and pulsed power applications and power measurement in large motor drives. 

PLECS Conference 2022
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Learn more:
plexim.com
  • Event News
  • 2022-05-06

The PLECS Conference on "Real-Time Simulation of Power Electronics" will take place in Zurich, Switzerland on Tuesday and Wednesday, September 20 and 21. The PLECS Conference offers participants from industry and academia the opportunity to exchange ideas with other PLECS and RT Box users. Practical use cases will be presented by a wide range of companies and universities, including ABB, Bosch, Daimler, Huawei, Schindler, EPFL, ETH, Hochschule Darmstadt and Hochschule München. In addition to the presentations, the PLECS Conference will provide opportunities to network during meals and breaks. Tabletop exhibits by the presenting groups will demonstrate their work and applications. For more information and to register, visit https://plexim.com/events/seminars/2101

Three Billion Motor Driver Integrated Circuits Shipped
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Learn more:
allegromicro.com
  • Industry News
  • 2022-05-04

Allegro MicroSystems announced that it has shipped its three billionth motor driver integrated circuit (IC), underpinning the strength of its motion control business. The company's motor drivers have helped customers around the world innovate safer, more robust motor-drive solutions with increased reliability. They can be found across automotive, industrial, and consumer applications in products ranging from electric vehicles to data center servers to cordless power tools. "We add value by helping our customers improve time to market and reduce development cycles; we win when they win, and that motivates us to continue developing new motor driver products," says Steve Lutz, Business Line Director for Motors (Automotive) at Allegro. "We continue to innovate with new products that reduce energy consumption, improve battery life, and minimize carbon footprints." The Allegro team has increased investments in motor driver R&D in recent years, yielding further advancements in its deep portfolio of embedded motion control IP. Introduced in 2019, the company's QuietMotionTM motor drivers include first-to-market field-oriented control (FOC) brushless DC (BLDC) electric motor controllers that are customer code-free. These devices are designed to provide reliable and efficient low-audible-noise performance while reducing design cycle times via simple parameter settings, which users can access using intuitive graphical user interfaces. "Many of our customers-especially ones in emerging growth markets-lack software development resources specifically for motor drivers, and often rely on freelancers and contractor programmers," says Andy Wang, Product Line Director for Motors (Industrial) at Allegro. "We're helping those customers significantly reduce development overhead by embedding code directly into the IC, which helps them get to market faster."

Active Heat Sink for Power Semiconductor Cooling
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Learn more:
sepa-europe.com
  • Product Release
  • 2022-05-04

Developing engineers are faced with a challenge when it comes to the choice of a suitable cooling concept for power electronics. This is in particular the case with flat housings where corresponding know-how is required. Thought should be given to this issue already during the concept phase as it may prove difficult to solve this problem if there is very little space for dissipating heat. SEPA EUROPE has developed a smart solution for such requirements, namely the HZ210 - an in-house development that is available in different dimensions. SEPA EUROPE has developed the active heat sink HZ210 using the powerful LY60B radial fan. The case study achieved an impressively low thermal resistance of 0.5K/W during laboratory testing. With an overall height of a mere 25 mm this opens up new possibilities for developers to enable the cooling of power components in flat housings. In the event that a temperature increase of 40K is allowed, 80W power loss can be reliably dissipated. The cooling system comprising SEPA blower, extruded heat sink and cover plate keeps the noise at a comfortably low level. The microphone recorded no more than 34dB(A) in the anechoic chamber. The fan is available in 5V and 12V versions and has a service life of 210000 h (MTBF) at 40°C thanks to its reliable MagFix© sleeve bearing.

Drive Module for HVAC Motors
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Learn more:
q-p-t.com
  • Product Release
  • 2022-05-03

Quantum Power Transformation (QPT) announced the launch of its qGaNDrive Module to unleash the full performance potential of Gallium Nitride (GaN) power transistors in motor drives for HVAC heating, ventilation, and air conditioning systems. Commenting on the news, QPT Founder Rob Gwynne said, "GaN transistors have always promised the best performance and efficiency over Silicon MOSFETs and Silicon Carbide, but they are notoriously difficult to drive at speed. We have developed an entirely new and unique topology for driving GaN transistors allowing them to switch at speeds of up to 20MHz, delivering major benefits in power consumption and efficiency." Business Development Manager Richard Ord went on to add: "Electric motor driven systems (EMDS) consume 45% of the world's energy, and yet their efficiency at typical operating speeds can be as low as 50%. Our solution tackles performance across the range of operating speeds and could improve efficiency by up to 35%." The challenge of driving Gallium Nitride transistors has so far restricted broader adoption and compromised performance: QPT's solution fixes that problem and will accelerate GaN market share. The qGaNDrive Module from QPT integrates their core topology with GaN transistors in a fully EMC-screened turn-key power module. The company estimates that a typical 15kW domestic heat pump could deliver a return in energy savings in one hundred days or less.

Material Solutions for e-Mobility
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Learn more:
indium.com
  • Product Release
  • 2022-05-03

Indium Corporation is announcing a line of material solutions for e-Mobility. The Rel-ion suite of electrical, mechanical, and thermal solutions are designed to be reliable, scalable, and proven materials, reducing electric vehicle (EV) manufacturers' time to market. "We at Indium Corporation have created a suite of products under the Rel-ion banner that must meet three very important criteria," said Brian O'Leary, global head of e-Mobility and infrastructure. "First-they're reliable. They are designed to meet the higher quality standards that meet the higher demands of automotive electrification. Second-they're scalable. They are readily available and capable of meeting supply chain expectations. Finally-they're proven. Most of Indium Corporation's Rel-ion products have more than a decade of running inside of EVs. Our customers have confidence that the product will work, confidence that they can get enough of it to meet demand, and the peace of mind that comes with using proven material solutions." Indium Corporation has also expanded its free InSIDER Series of webinars to include the "Driving e-Mobility: Rel-ion Technical Webinars". This series features global industry technical experts in advanced materials and the automotive market with all sessions moderated by O'Leary. This series of webinars is intended specifically for those involved in the field of e-Mobility, whether new to the industry or with several years of experience as the EV industry undergoes rapid growth and evolution.

Enhancing Its Digital Training Offerings Through Acquisition
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Learn more:
rohde-schwarz.com
  • Industry News
  • 2022-05-03

Rohde & Schwarz announces that it has acquired UK-based 'The Technology Academy', provider of online training courses in the fields of RF, wireless and microwave engineering technology. The Technology Academy is an ideal partner to expand the existing training offerings of Rohde & Schwarz and will play a significant role in increasing the company's future professional services. The Rohde & Schwarz Technology Academy combines the expertise and industry insights of the trusted T&M manufacturer – currently providing live and virtual trainings from their in-house training center as well as on-site trainings for existing customers – with the web training expertise of The Technology Academy. A holistic portfolio of on-demand courses is available 24/7 to technology professionals with different experience levels. They will have easy, immediate access to a range of certified trainings, which offer in-depth expert knowledge and industry insights. Content is delivered in a practical and application-oriented way, with a focus on clear explanations. Certificates are available for completed courses. The main objective of the training offerings is to support technical staff in managing new challenges as well as staying up-to-date with the latest technologies. The web-based training format also allows both flexible and scalable learning paths. This combination of high-quality training with insights from industry experts and simple access makes it easy for companies to find the right training options for staff while simultaneously addressing time and budget constraints.

Integrated Current Sensor with Sigma Delta Bitstream Output
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Learn more:
lem.com
  • Product Release
  • 2022-05-03

LEM announced the launch of HMSR DA, an Integrated Current Sensor to offer a Sigma Delta bitstream output which provides significant benefits when used in applications that are prone to noise, distortion and interference. It has been designed to provide a solution to industries requiring clean signals and facing significant problems in case of vibrations, electric noise and electromagnetic noise, for example. Specific advantages of an Integrated Current Sensor with digital output include superior signal share and reduced noise as well as lower cost and a smaller mechanical footprint. HMSR DA will replace much more complex and costly alternative systems that would traditionally include a shunt resistor, a digital insulator and a power supply circuit. Having all these features incorporated into a single unit makes the HMSR DA a far more attractive option for applications where space is at a premium and minimal cost is essential. Typical applications for the digital output unit include standalone servo drives, robotics, sewing machines, automated guided vehicles (AGVs), CNC machine tools and a range of other applications that demand high resolution output. The HMSR DA sensor, which offers resolution of 11 to 13 bits and features a 10MHz clock, is LEM's first step toward building a digital Integrated Current Sensor roadmap. The company is already working on the next generation of digital Integrated Circuit Sensors which will offer a resolution of 14 to 16 bits and a clock operating above 20MHz.

Air Velocity Sensor for Space-constrained Applications
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Learn more:
flussoltd.com
  • Product Release
  • 2022-05-03

Flusso's FLS122 air velocity sensor has been specifically developed to enable board-mounted air velocity measurements for thermal management and filter monitoring in some of the most space-constrained and challenging environments. It has a footprint of just 3.5 by 3.5 mm and will help the company to further extend its flow sensing offer, to address even more applications within high-volume industrial, medical and consumer markets. Target applications include data centres and gaming PCs that rely on efficient air cooling to maximise performance and energy-efficiency, and consumer appliances such as HVAC, air purifiers and vacuum cleaners. The FLS122 has been designed to support bidirectional flow sensing and to provide real-time temperature and air speed measurement of up to 20 metres per second. The sensor has been designed for easy and low-cost integration, and uses a CMOS MEMS die derived from the one used within Flusso's FLS110 mass flow sensor. FLS122 uses the same novel integration concept as the FLS110 that allows manufacturers to decide how and where to integrate it, and to balance system performance versus cost depending on their requirements. The sensor will be supplied with a full package of support material including an evaluation kit, hardware design guides, sensor firmware and a software development kit, as well as application engineering support.

Andreas Urschitz Appointed as Chief Marketing Officer
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Learn more:
infineon.com
  • People
  • 2022-05-02

Andreas Urschitz, currently President of the Power & Sensor Systems (PSS) Division, has been appointed as Helmut Gassels successor as Chief Marketing Officer of Infineon. Adam White, currently CMO of the PSS Division, is the designated President of the Division. "As a longtime companion, Helmut Gassel has played a decisive role in Infineon's great success. As CMO, he has driven forward the digitalization of marketing and sales and thus the alignment with the future. I view with great respect the fact that he wants to make a personal change and therefore leave Infineon. I welcome the Supervisory Board's decision in favor of Andreas Urschitz as the future CMO. He has achieved great success as Division President and has demonstrated a keen sense of market developments and our customers' needs," said CEO Jochen Hanebeck. "Together with our customers, Infineon employees are driving the decarbonization and digitalization of everyday life. I am very much looking forward to helping shape the path to a livable future now as part of the Management Board team," said Andreas Urschitz, President of the PSS Division and designated CMO of Infineon. Andreas Urschitz has been President of the Power & Sensor Systems (PSS) Division since 2012, which serves the market with a wide range of power semiconductor, radio frequency and sensor technologies. Prior to the role as head of the PSS Division, Mr. Urschitz held various management positions in production, marketing, development and sales. He began his career at Infineon (until 1999 Siemens AG) in Villach, Austria, after studying business economics and subsequently teaching at the Vienna University of Economics and Business Administration.

Positive Outlook for the SPS 2022
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Learn more:
sps.mesago.com
  • Event News
  • 2022-04-28

With almost 700 exhibitors registered by the early booking deadline, the booking figures for the SPS 2022 are extremely positive. This is testament to the high level of interest in attending the exhibition for electric automation technology, which will take place in Nuremberg from 08 - 10 November 2022. In addition to the three-day event in Nuremberg, this year's automation exhibition concept also includes an online component. "The in-person event will certainly be the main focus of the SPS 2022. However, the last two years have shown the value of digital offerings both in the run-up and follow-up to an exhibition: to give a general overview of the industry, for initial discussions, for arranging appointments on site, sharing knowledge, or even finding out about current industry topics," summarizes Martin Roschkowski, President of Mesago Messe Frankfurt. The organizer thus wants to leverage the advantages of both the real and digital worlds to offer participants the best possible exhibition experience. It also means that those who may not be able or allowed to travel also have an opportunity to connect and interact with the SPS community online.

Power Module Suitable for 48 V Industrial Voltage Network
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Learn more:
we-online.com
  • Product Release
  • 2022-04-28

Würth Elektronik extends its MagI³C-FDSM power module product range: The fixed step-down regulator modules now cover all bus voltages from 12 V up to 48 V. The modules facilitate development for applications with direct connection to bus voltages of 12 V, 24 V or 48 V. The wide input voltage range up to 74.5 V makes the FDSM module robust against voltage transients on the 48 V bus. The new power modules are implemented in a cost-effective SIP-3 package and provide fixed output voltages of 3.3 V, 5.0 V as well as 12 V, with an output current up to 0.5 A. The MagI³C-FDSM series are fully integrated DC/DC voltage converters with fixed output voltage. Besides the power stage, the modules consist of a regulator, inductor as well as input and output capacitors. The power modules are protected against short circuit and thermal overload. MagI³C-FDSM reduces the workload involved in circuit design to a minimum, as no external components are required for operation-this reduces development costs and time. For simple assembly, the MagI³C-FDSM family has been realized in a standard THT housing. Pre-compliance testing of our evaluation board has shown the conducted and radiated EMI is below limits established by relevant standards.

Automotive Power Inductors Series
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Learn more:
yuden.co.jp
  • Product Release
  • 2022-04-28

TAIYO YUDEN has announced the launch of the AEC-Q200 (reliability qualification test standard for automotive passive components) qualified wire-wound ferrite power inductors LCXH series, which consists of 64 items in 6 sizes including LCXHF3030QK. These power inductors are designed for use as choke coils or noise filters in power supply circuits for automotive body systems and information systems such as infotainment ECUs. The LCXH series has the same sleeveless structure as the LCXP and LCXN series (former product name: NR series S-type), which have been used in consumer and automotive products markets. The materials technology and structural design have both been further sophisticated, and the electrodes are structured such that improved flatness can be achieved when mounted and automated optical inspection (AOI) can be carried out during manufacturing processes. Production of the products commenced at the overseas subsidiary company, TAIYO YUDEN (PHILIPPINES, Lapulapu City, Cebu, the Philippines), from March 2022.

Partnership on Developing Power Devices for Power Supply Systems
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Learn more:
rohm.com
  • Industry News
  • 2022-04-28

ROHM and Delta Electronics have entered into a strategic partnership to develop and mass produce next-generation GaN (gallium nitride) power devices. Combining Delta's power supply device development technology with ROHM's power development and manufacturing expertise will make it possible to develop 600V breakdown voltage GaN power devices optimized for a wide range of power supply systems. ROHM has already established a mass production system for 150V GaN HEMTs featuring an 8V gate withstand voltage in March 2022. This will allow ROHM to expand its lineup of EcoGaNTM for power circuits in IoT communication and industrial equipment (i.e. base stations, data centers) while further improving device performance. Kazuhide Ino, Managing Executive Officer, CSO, ROHM: "ROHM is extremely pleased to enter into a strategic partnership for GaN power devices with Delta. As power semiconductors – a key area of focus for ROHM – play an increasingly important role in achieving a decarbonized society, ROHM will continue to develop advanced devices in a range of fields utilizing Si, SiC, and GaN, along with solutions that combine peripheral components such as control ICs that maximize their performance. Through this partnership, ROHM will mass produce GaN power devices that can contribute to the configuration of more efficient power supply systems as well as develop GaN IPMs that integrate analog ICs (one of ROHM's strengths) at an early stage, further expanding our lineup of easy-to-use products."

Battery Management ICs Enable Optimized Battery Lifetime
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Learn more:
infineon.com
  • Product Release
  • 2022-04-26

Infineon Technologies introduces a family of battery management ICs, including TLE9012DQU and TLE9015DQU. The ICs enable an optimized solution for battery cell monitoring and balancing. Combining measurement performance with robustness, the battery management ICs are a competitive system-level solution for battery modules, cell-to-pack and cell-to-car battery topologies. The devices are suitable for a wide range of industrial, consumer and automotive applications such as mild hybrid electric vehicles (MHEV), hybrid electric vehicles (HEV), plug-in hybrid electric vehicles (PHEV) and battery-powered electric vehicles (BEV). Additional applications include energy storage systems and battery management systems for electric two- and three-wheelers. "With the TLE9012DQU and TLE9015DQU, Infineon achieves an important milestone and completes its battery management system offering", says Finn Felsberg, Senior Vice President and General Manager Automotive Power Integration and Supply at Infineon. "Customers benefit from the interoperability of Infineon's components as well as from the broad software offering. As a result, development efforts can be minimized and time to market can be reduced." The battery management ICs can be used in safety relevant applications: the automotive BMS solutions meet safety requirements up to ASIL-D and are ISO26262 compliant. Furthermore, these products are optimized to work together with the AURIX family of microcontrollers and functional safety capable power management ICs thanks to the Complex Device Driver. This provides a full solution for voltage and temperature sensing, as well as balancing and communication across a variety of battery solutions.

Cooperation on Transforming PCB Order Processes
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Learn more:
we-online.com
  • Industry News
  • 2022-04-26

Würth Elektronik Circuit Board Technology and Luminovo are connecting their products to enable their customers to adapt a much simpler, faster and more accurate PCB prototype costing and quoting process. Using the Würth Elektronik API (application programming interface), Würth Elektronik's PCB online shop gets directly connected to LumiQuote, Luminovo's RfQ software. LumiQuote automatically extracts all relevant technical parameters of required PCBs using the modern PCB engine. The technical information is now sent directly to the PCB online shop via the interface and prices as well as delivery times are sent back to the users in real time. "This is a crucial value-add for users, as they can continue their quoting and ordering process without interruptions", explains Thomas Beck, managing director of Würth Elektronik Circuit Board Technology. "At Luminovo, we are rethinking the electronics value chain. The partnership with Würth Elektronik enables us to finally bring PCB procurement into the age of automated and connected processes", states Sebastian Schaal, founder of Luminovo. He adds, "In LumiQuote, our customers not only receive a price directly, but a plausibility check also tells them immediately whether or not the requested specifications are supported by Würth Elektronik". Luminovo is working on a software suite that aims to transform processes within and between the different companies in the electronics value chain in a modern way. In addition to Stackrate, Luminovo's software solution for PCB manufacturers, LumiQuote focuses on connecting, digitising and automating quoting and procurement processes for EMS, including material and manufacturing calculations.

Snap-in Aluminum Electrolytic Capacitor
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Learn more:
cde.com
  • Product Release
  • 2022-04-25

Cornell Dubilier Electronics announced that it has expanded its signature series of 380LX and 381LX aluminum electrolytic capacitors to include voltages up to 600 Vdc. The ratings are designed to serve the company's industrial electronics customers who continue to push the application boundaries for these components into higher voltages. The 380LX and 381LX snap-in series are among the industry's top performers with a published load life of 3,000 hrs. when tested at rated voltage and ripple current at rated temperature. The 380LX series is designed for 85 °C operation, while the 381LX series meets the same load life at 105 °C. These components demonstrate exceptional life in real-life applications where conditions are typically lower than the capacitor's maximum specified ratings. Newly added capacitance values in the range of 150 µF to 330 µF are offered at 550 and 600 Vdc in the 380 LX series and 140 µF to 340 µF at 500, 550, and 600 Vdc in the 381LX series. Developed at CDE's technology center in Liberty, SC, these new ratings are offered with enhanced ripple current capability, up to 3.7A at full-rated conditions. The company's latest advances in electrolyte development, materials, and processing technology make their higher voltage ratings and excellent performance possible. The company expects these higher voltage snap-in capacitors to be used in the latest inverter circuits for renewable energy, UPS systems, battery chargers, motor drives, welders, and other applications that require the highest performance components to improve system reliability.

Acquisition of SL Power Expands Addressable Market
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Learn more:
advancedenergy.com
  • Industry News
  • 2022-04-25

Advanced Energy Industries announced that it completed the previously announced acquisition of SL Power Electronics Corporation from Steel Partners Holdings L.P. The acquisition adds complementary products to Advanced Energy's medical power offerings and extends its presence in several advanced industrial markets. "The addition of SL Power expands our offerings for industrial and medical applications," said Steve Kelley, president and CEO of Advanced Energy. "I believe SL Power's strong customer base, complementary product portfolio, and highly skilled team make it an ideal fit for Advanced Energy." The acquisition of SL Power Electronics is expected to be accretive to 2022 earnings on a non-GAAP basis and to generate over $4 million of annualized cost synergies. Management intends to provide more detail on the forward-looking benefits of this acquisition when it announces the first quarter financial results.

New York-based 200mm Silicon Carbide Fab
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Learn more:
wolfspeed.com
  • Industry News
  • 2022-04-25

Wolfspeed opened its Mohawk Valley Silicon Carbide fabrication facility in Marcy, N.Y. with a ribbon cutting ceremony with Federal and State Officials. The 200mm wafer fab will help lead the industry-wide transition from silicon to Silicon Carbide-based semiconductors. New York Governor Kathy Hochul was on site to officially welcome Wolfspeed to Mohawk Valley, in addition to Eric Bach, Senior Vice President of Product and Chief Engineer at Lucid Motors. As a key partner, Lucid Motors had the honor of "cutting the ribbon" with its Lucid Air, named the 2022 MotorTrend Car of the Year. Wolfspeed recently announced a multi-year agreement with Lucid to supply Silicon Carbide devices. "We are honored to be joined by these government, community, and industry leaders to celebrate Wolfspeed's Mohawk Valley Fab, New York State's economic competitiveness and American chip manufacturing," said Gregg Lowe, president and CEO of Wolfspeed. "I am incredibly proud of the team, and all of our partners, who brought this monumental fab to life in such a short time. This fab will not only supply customers in 2022 but also support long-term American competitiveness." The automated Mohawk Valley facility is the world's first and largest 200mm Silicon Carbide fab providing uncompromised wafer quality and higher yield. The devices developed in Mohawk Valley will be critical in feeding Wolfspeed's $20B+ pipeline and the global semiconductor industry. More than 600 high-tech Mohawk Valley jobs will be created by 2029.

The 2022 IEEE VLSI Symposium on Technology & Circuits
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Learn more:
vlsisymposium.org
  • Event News
  • 2022-04-22

Now in its 42nd year of delivering convergence of technology and circuits for the microelectronics industry, the "Symposia on VLSI Technology & Circuits" will be merged into one Symposium to maximize the synergy across both domains. The newly merged 2022 IEEE VLSI Symposium on Technology & Circuits is organized around the theme: "Technology & Circuits for the Critical Infrastructure of the Future." The five-day hybrid event, combining both live sessions onsite at the Hilton Hawaiian Village, as well as on-demand access to selected presentations, is scheduled from June 12 – 17, 2022 in Honolulu, HI. The Symposium will feature advanced VLSI technology developments, innovative circuit design, and the applications they enable, such as artificial intelligence, machine learning, IoT, wearable/implantable biomedical applications, big data, cloud / edge computing, virtual reality (VR) / augmented reality (AR), robotics, and autonomous vehicles. The weeklong Symposium will continue its reputation as the microelectronics industry's premiere international conference integrating technology, circuits, and systems with a range and scope unlike any other conference. In addition to the technical presentations, the Symposium program will feature a demonstration session, evening panel discussions, joint focus sessions, short courses, workshops, and a special forum session that provides a focused discussion on a specific topic relevant to the Symposium theme.

Metal Power Inductors for In-Vehicle Applications
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Learn more:
murata.com
  • Product Release
  • 2022-04-21

Murata announces the availability of the DFE32CAH_R0 series of metal power inductors for high-temperature applications of up to 150 °C. Intended for use in DC/DC converters and power management circuitry for automotive applications, these components are supplied in 1210 inch size (3.2 mm × 2.5 mm) metal cores. Covering a wide inductance value range, the components are suitable for in-vehicle applications beyond infotainment systems to the powertrain and advanced driver assistance systems (ADAS). Meeting demands for high currents and the downsizing of system designs, the DFE32CAH_R0 delivers a DC superimposed current rating (Isat) of 8.7 A in the world's best for a 1210 inch size product with an inductance of 0.47 µH. "These new products support large currents by optimizing the internal coil structure design and utilizing original metal materials," explains Tomohiro Yao, General Manager of Marketing & Promotion for the EMI Division at Murata. "Thanks to these technological advances, we have succeeded in delivering a series of small metal power inductors that have a highly reliable design for a more diverse range of automotive applications, including the powertrain and ADAS, that require support for temperatures up to 150 °C and demand large current flows."

IGBT Module Will Reduce Size and Power Consumption of DC1500V Converters
  • Product Release
  • 2022-04-21

Mitsubishi Electric Corporation announced that it will begin shipping samples of its LV100-type T-series 2.0kV insulated-gate bipolar transistor (IGBT) Module for industrial use. The power-semiconductor product is expected to downsize and reduce the power consumption of power-conversion equipment for use with renewable-energy sources. Power semiconductors for efficiently converting electric power are being increasingly utilized as key devices that can help to lower the carbon footprint of global society. At the same time, efficient power conversion through the deployment of increasingly higher system-operating voltages is being demanded for power grids that use renewable-energy power sources, which has led to the development of power converters rated at DC1500V, the upper limit of the EU's Low Voltage Directive. Module samples that Mitsubishi Electric will start shipping soon have a blocking-voltage capability of 2.0kV, which is suitable for DC1500V power conversion equipment used mainly for large-capacity systems of several hundred kW to several MW, including renewable-energy power sources. Adopting 2.0kV withstand voltage semiconductors will enable customers to simplify the design of their DC1500V power-conversion equipment. Also, the latest 7th-generation IGBT and Relaxed Field of Cathode (RFC) diode will help to downsize and reduce the power consumption of power-conversion equipment for renewable-energy power supply. In addition, the module's industrial LV100-type package, which is suitable for large-capacity systems due to its easy-paralleling configuration, will help to simplify large-capacity system designs.

AEC Qualified Lidar Integrated Circuit
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Learn more:
epc-co.com
  • Product Release
  • 2022-04-20

EPC announces the introduction of the EPC2221, a common source dual gallium nitride FET rated at 100 V, 58 mO, and 20 A pulsed current.  The EPC2221 can be used in lidar systems for robots, surveillance systems, drones, autonomous cars, and vacuum cleaners. The low inductance and capacitance of the EPC2221 allows fast switching (100 MHz) and narrow pulse widths (2 ns) for high resolution and high efficiency. Additionally, the ultra-small size of 1.35 mm x 1.35 mm reduces PCB cost and total solution size. The EPC2221 is the latest addition to a growing family of GaN transistors and integrated circuits designed to meet the performance and reliability standards of demanding automotive applications. The EPC2221 has completed rigorous automotive AEC Q101 qualification testing including humidity testing with bias (H3TRB), high temperature reverse bias (HTRB), high temperature gate bias (HTGB), and temperature cycling (TC), as well as several other tests. In addition to lidar in demanding automotive applications, the EPC2221 is perfectly suited for high-frequency DC-DC conversion, wireless power applications, and synchronous rectification. "This AEC certified product is the latest addition to a growing family of EPC gallium nitride-based transistors and integrated circuits designed to enable autonomous driving and improve safety," said Alex Lidow, CEO, and co-founder of EPC. "This integrated circuit improves the performance while reducing size and cost for time-of-flight lidar systems."

PEMD 2022: Power Electronics, Machines and Drives
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Learn more:
pemd.theiet.org
  • Event News
  • 2022-04-20

We're pleased to be a media partner of PEMD 2022 – the IET's Power Electronics, Machines and Drives conference. Bodo's Power readers can register at the IET member rate, saving you up to £200. You can book your ticket at the website: http://ow.ly/tOJE30rOobn

Fast Charging Solutions Using a Dual-Phase Switched-Capacitor Architecture
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Learn more:
halomicro.com
  • Product Release
  • 2022-04-19

Halo Microelectronics announced the release of their HL7138 and HL7139, fast charging solution ICs using a dual-phase switched capacitor architecture for single-cell battery applications. The HL7138 and HL7139 offer charging efficiencies, which enable faster and cooler battery charging operations in a small total PCB solution size that allows for more system-level design flexibility. They offer charging efficiencies, which enable faster and cooler battery charging operations in a small total PCB solution size that allows for more system-level design flexibility. The faster-charging solution saves consumers time, and cooler charging means less energy is wasted in the form of heat, which is environmentally friendly. Furthermore, the smaller solution size gives device designers more leeway to choose between thinner and lighter form factors, larger batteries for longer battery life, more features, or lower BOM costs. "As the smartphone market becomes more saturated, product differentiation has become increasingly important to gaining market share. Fast charging is one of the few features that consumers can directly relate to and understand its benefits. Halo Microelectronics has seen switched capacitor-based fast-charging architectures quickly extend from high-end to mid-level smartphones. Therefore, we will continue to develop, innovate, and lead the ecosystem to stay ahead," stated David Nam, CEO of Halo Microelectronics.

Driving the Adoption of Wide Bandgap Technologies
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Learn more:
navitassemi.com
  • Industry News
  • 2022-04-19

Navitas Semiconductor has announced its membership of PowerAmerica, the consortium working to accelerate the adoption of next generation GaN and silicon carbide (SiC) power electronics. As a member of PowerAmerica, Navitas will provide input into initiatives to help companies that use power semiconductors to upgrade beyond legacy silicon, and access resources and relationships contributing to business growth. "The upgrade from legacy silicon to WBG semiconductors is critical to supporting environmental goals by dramatically reducing power consumption and accelerating the adoption of sustainable technologies," said Dan Kinzer, Navitas' COO/CTO and co-founder. "The consortium's membership network of entrepreneurs, technologists and academic partners is helping to drive this revolution and we are excited to be part of this increasingly-important eco-system." Navitas Sr Director of Marketing, Llew Vaughan-Edmunds, is currently the chairman of PowerAmerica and will lead the MAC meeting during the PowerAmerica 2022 Summer Workshop on NC State Campus in Raleigh, NC on August 2nd. Navitas will host a technology seminar at the workshop to introduce leading-edge GaNFast power ICs with GaNSense technology, and stress high-quality, high-capacity manufacturing with over 40,000,000 units shipped and zero reported GaN-related field failures.

2W Medical Grade DC/DC Converter
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Learn more:
pduke.com
  • Product Release
  • 2022-04-19

For the ever increasing demand for medical home care and medical equipment P-DUKE has extended its medical power conversion portfolio with a MPL02 board-mount DC/DC converter series. The MPL02 series is designed especially for compact medical applications and comes in a tiny SIP-8 industrial standard package (footprint only 9.9 x 21.8 mm) which saves space on the PCB. It offers 5000Vac isolation voltage, reinforced insulation of 2xMOPP (patient protection) / 250Vac working voltage with 8 mm clearance and creepage distance between input and output. The series delivers up to 2W output power and offers regulated single and dual outputs with a wide 2:1 input range of 4.5-13.2, 9-18 and 18-36V. It provides full-protection functions such as: over-current, short-circuit, under-voltage lockout as well as low 2µA leakage current. These are the main factors which assure a safe environment for operators and patients. The series also comes with a 5-year product warranty. The MPL02 series has been certificated to IEC/EN/ANSI/AAMI ES60601-1, IEC/EN/UL 62368-1 and MIL-STD 810F standards. With its compact casing, low 2µA leakage current and all the safety certifications makes this series the perfect choice for a variety of medical equipment such as; oxygen and heart rate monitors, brainwave monitors and oral caring equipment.

Global High Service Distributor of the Year
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Learn more:
mouser.com
  • Industry News
  • 2022-04-18

Mouser Electronics has been named the 2021 Global High Service Distributor by onsemi. This is the third year that Mouser has received this award. onsemi cited Mouser's high service distribution sales growth, market share growth, and high scores on overall process excellence. "The support of our worldwide distribution partners is essential to the success of our company as we continue to increase revenue, profit margins and market penetration," said Jeff Thomson, Senior Vice President of Global Channel Sales for onsemi. "Mouser grew product sales, generated significant new business, and effectively supported customer needs while demonstrating our company initiative of operational excellence. We thank them for their contributions in 2021." "We are honored to receive this recognition from onsemi, one of our valued partners and a leader in the industry," said Kristin Schuetter, Mouser Electronics' Vice President of Supplier Management, Semiconductors. "Mouser works to provide exceptional service to customers as well as our manufacturer partners, and it is gratifying to be acknowledged for our efforts." Mouser offers onsemi's broad portfolio of energy-efficient power management, analog, sensors, logic, timing, connectivity, discrete, system-on-chip (SoC), and custom devices to help customers efficiently solve their design challenges in automotive, communications, computing, consumer, industrial, medical, aerospace, and defense applications.

Embedded Control Module for Electric Power Grid Automation   
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Learn more:
siliconpower.com
  • Product Release
  • 2022-04-18

With complex requirements and typically low quantity manufacturing, rack-and-stack approaches have long dominated controls designs for high power electronics. While custom designs might be technically superior, allowing tailored features and compact integration, they often come with prohibitive engineering and manufacturing costs and schedules. Now it is possible to design controls electronics using sophisticated system-on-chip (SOC) and system-in-package (SIP) components to achieve custom results within a manageable design project. The Innova SCM21001 system-on-module (SOM) from Silicon Power Corporation was developed as an embedded computing platform specifically for electric grid automation applications. A dual core DSP SOC and directly connected FPGA are assembled as an independent real time processor subsystem. On the same module, an Octavo Systems embedded Linux computer SIP supports management of the real time processor and provides modern communication protocols for connection to external systems, all using readily available open-source software. The SOM serves as a control system component, allowing tight integration with application specific components such as power, analog sensor conversion, and actuator drives. A conduction cooled form factor supports deeply embedded, high reliability applications. The design was fully functional with the first prototype, so system development proceeded with no controls design delays. As a component or as a reference design, the SOM demonstrates that custom controls design is once again a viable option for power electronics. 

Celebrating 25 Years of High-tech from Nuremberg
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Learn more:
rohm.com
  • Industry News
  • 2022-04-14

SiCrystal is celebrating its 25th anniversary. Over the last two and a half decades, the company – which today employs over 200 people – has expanded its sphere of activity to an international level: a small but important piece of technology made in Franconia can be found in electric vehicles all over the world, for example. After all, it is often the little things that make big things happen. Based at Nordostpark industrial park in the north east of Nuremberg, Germany, the manufacturing company is one of the current global market leaders for single crystalline silicon carbide semiconductor wafers (SiC wafers). "25 years of company history really is something to celebrate," says CEO Robert Eckstein, looking back on the beginnings of SiCrystal. The company has been producing SiC wafers since April 1997. The wafers form the basis for modern electronic components and resemble "a CD without a hole". They are almost as hard as a diamond and very heat resistant. Without these discs – which are less than 1 millimeter thick – electric mobility and the digital world would be unthinkable. Research carried out at the University of Erlangen in the early 1990s laid the foundation for the company and, in 1997, SiCrystal AG was founded. Back then, it all began with the development and sampling of the first SiC wafers in Eschenfelden, Upper Palatinate. The semiconductor manufacturer then moved back to Erlangen in the early 2000s and was taken over by the Japanese ROHM Group – manufacturer of electronic components – in 2009.

Expanding Its Portfolio of Precision Measurement Solutions
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Learn more:
vitrek.com
  • Industry News
  • 2022-04-13

Vitrek announces the acquisition of MTI Instruments, a U.S.-based manufacturer of sophisticated test and measurement equipment. MTI Instruments' precision tools, systems and solutions are utilized in non-contact metrology, position, displacement and vibration applications within the design, QA/QC, manufacturing, production, test and research markets. MTI Instruments' products benefit a variety of industries and applications. For example, commercial aviation companies and the U.S. Military rely on vibration analysis and engine trim balance test solutions to identify any jet engine problems quickly, ensuring safety while saving both time and maintenance costs. Their custom capacitor sensors are designed to measure displacement and gap with non-contact force in applications including lens focusing, Piezo positioning, sheet metal thickness, gap measurement as well as flatness and alignment. "The acquisition of MTI Instruments represents a significant expansion of the range of precision instrumentation products Vitrek offers to our vital industries," said Don Millstein, Vitrek's president. "We welcome MTI Instrument's sales, engineering and manufacturing teams to the Vitrek family - as we continue providing both Vitrek and MTI customers with top level sales , technical support and product innovation." Moshe Binyamin, President and CEO of MTI Instruments, said: "Vitrek is a well-respected test and measurement company with products and a market focus that is perfectly in line with ours. We look forward to combining forces so we can further accelerate our collective growth objectives."

40 Years in the USA
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Learn more:
schurter.com
  • Industry News
  • 2022-04-13

In 1982, Bruno Schurter, grandson of the company's founder Heinrich Schurter, launched the distribution company SCHURTER Inc in California. He was a mere 30 years old at the time. Bruno Schurter had the chance to live the "American Dream", as he himself says today. He was in the right place at the right time. Silicon Valley, the southern part of the San Francisco Bay Area, was in full bloom. In the 1960s and 1970s, the first high-tech companies settled in the immediate neighborhood of Stanford University. Primarily test and measurement equipment as well as computer technology. Computers large and small fascinated Bruno. During his brief engagement with Wersen, the latter handed him an Apple II and told him to somehow put the thing into operation and see if anything could be done with it. Schurter knuckled down, got the "thing" working and calculating. The world was about to be computerized. And Bruno was right at the epicenter. Read the full success story at https://www.schurter.com/en/Info-Center/News/Timeline/40-years-of-SCHURTER-in-the-USA.

Integrating Renewables and Stabilizing the Grid
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Learn more:
abb.com
  • Industry News
  • 2022-04-13

With more intermittent renewable energy generation on the world's power networks, and fossil fuel supplies experiencing major disruptions, distributed power reserves are becoming increasingly important to maintain grid stability and keep the power on 24/7. To support this transition, ABB is launching PowerExchanger, an innovative feature for its UPS products, which allows battery reserves to provide ancillary services to the grid, reducing costly downtime and cutting energy and operating costs. UPS equipment is used to provide back-up power in the case of a grid supply failure, and it can also eliminate brownouts, over-voltages, and electrical noise. The UPS' back-up power is drawn from its energy storage capacity, which often goes unused. With PowerExchanger fitted to new or existing ABB UPS systems, these batteries can be used to help the grid respond quickly to unexpected imbalances between power generation and demand, to reduce costly outages. By using PowerExchanger to join markets for grid ancillary services, for example Fast Frequency Response (FFR), operators can now generate a new revenue stream, which lowers the cost of operating this capital-intensive equipment. Ideal for Low and Medium Voltage data centers, PowerExchanger ensures a minimum energy reserve is retained by the UPS battery, so in the event of a complete grid outage, the critical load will always be protected. PowerExchanger can also deliver additional financial and performance benefits, thanks to peak shaving. When peak-time energy comes at a premium, PowerExchanger enables on-site UPS energy reserves to cover consumption peaks and keep costs low.

Measurement System for GaN and SiC Semiconductor Analysis
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Learn more:
teledynelecroy.com
  • Product Release
  • 2022-04-12

Teledyne LeCroy announced the launch of their DL-ISO High Voltage Optically Isolated 1 GHz Probe and Power-Device test software, which when combined with their High Definition Oscilloscopes (HDO) offer accurate electrical characterization of gallium nitride (GaN) and silicon carbide (SiC) power semiconductor devices. The DL-ISO High Voltage Optically Isolated Probe provides design engineers with the highest-confidence GaN and SiC power semiconductor device measurements. The probe has the best signal fidelity, lowest overshoot and best accuracy - 1.5% when combined with Teledyne LeCroy's 12-bit resolution HDOs. The 1 GHz bandwidth meets requirements to measure GaN device 1 ns rise times. HDOs also provide up to 20 GS/s sample rate at 12-bit resolution for the most faithful capture and display of high-speed GaN and SiC device signals. This combination of best signal fidelity, low overshoot, high accuracy, high bandwidth and high sample rate is critically important for successfully implementing GaN and SiC technologies in new designs. Teledyne LeCroy's Power-Device software package additionally simplifies the analysis of GaN and SiC devices with automated JEDEC switching loss and other measurements, and color-coded overlays to highlight the relevant, measured areas.

Expanding Backend Operations in Indonesia
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Learn more:
infineon.com
  • Industry News
  • 2022-04-12

Infineon Technologies expands its existing backend operations in Indonesia: PT Infineon Technologies Batam to purchase real estate from PT Unisem, a member of Unisem Group. The premises close to Infineon's existing backend manufacturing site include manufacturing buildings that will double Infineon's production area in Batam when fully operational. In the course of this expansion, Infineon's Batam site will increase its focus on the assembly and test of automotive products. "Infineon is making another step in strengthening its global operations network. We are committed to investing into continued structural growth and to strengthen the resilience of our supply chain," said Alexander Gorski, Executive Vice President and responsible for Infineon's global Backend Operations. Dr. Thomas Kaufmann, Executive Vice President and COO of Infineon's Automotive Division, said: "In view of increasing demand for automotive semiconductors and to the benefit of our customers, this purchase is allowing us to add backend capacities faster than with the greenfield construction of a new site". Production is expected to start in 2024. The expansion in Batam is part of Infineon's long-term investment strategy, which foresees investments of approximately €2.4 billion for the 2022 fiscal year. PT Infineon Technologies Batam is a backend manufacturing site and employs over 2,000 employees. It is located within the Batamindo Industrial Park and part of the Indonesia-Singapore-Malaysia growth triangle.

Global Magnetics Powerhouse
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Learn more:
kamicgroup.com
  • Industry News
  • 2022-04-12

KAMIC Magnetics Group will present its magnetics portfolio at PCIM, and for the first time brings its three specialist magnetics components businesses, ETAL, SIGA Electronics and Talema together on one stand (6-349). This follows the Group's acquisition of Talema to ETAL in 2021. Each business in the KAMIC Group Magnetics business unit has its own strength, and together they form a global magnetics powerhouse with 1,100 employees, manufacturing in five countries and direct representation in the world's most significant economies. The Group is offering customers a comprehensive portfolio which supports them in designing exceptional, efficient power architectures for applications from portable electronics through mains powered systems to renewable energy sources and electric vehicles. Visitors to PCIM will be able to see examples from Talema's range of current transformers and toroidal components. These will include its in-house developed magnetic components such as transformers and inductors, which are used in AC/DC converters, DC/DC converters and signal applications. Most components are custom designed for specific applications, and the business unit also offers a range of standard components. ETAL's established range of magnetic components will also be fully represented at PCIM. These include chokes, air coils, coils, current transformers, power transformers and signal transformers. The company specialises in custom products and in optimising designs but also offers a range of standard components. Its' particular strength is high-end and reliable planar products such as custom designed transformers and inductors that combine superior performance with overall low cost. SIGA IEC conformant current transformer (CT) products will also be on show at PCIM. SIGA manufactures circular or rectangular type CTs, full block or split core, using a UL recognised semi rigid cast resin compound or an IP rated plastic box finish. Other finishes are available.

350 V Gallium Nitride (GaN) Power Transistor
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Learn more:
epc-co.com
  • Product Release
  • 2022-04-07

EPC announces the production release of the EPC2050, a 350 V GaN transistor with a maximum RDS(on) of 80 m? and a 26 A pulsed output current. The EPC2050 measures just 1.95 mm x 1.95 mm. This tiny size enables power solutions that occupy ten times less area than comparable silicon solutions. Applications benefiting from the fast-switching speed and tiny size of the EPC2050 include DC-DC conversion from/to 120 V-160 V such as in aerospace applications, 120 V-150 V motor control for medical motors, DC-AC inverters, multi-level converters such as Totem Pole PFC and DC-DC solutions converting 400 V input to 12 V, 20 V or 48 V outputs. Additional applications include fast chargers, battery management systems, electric vehicle charging, solar power inverters, high power lidar for autonomous cars and delivery vehicles, LED lighting, RF switches, and consumer & industrial wirings like wall-mounted sockets and Class D Audio. The EPC2050 is also suitable for 120 VAC-only applications. A typical power supply bus voltage is between 170 V and 250 V. This includes applications specific to the Americas market, such as power tools and in-wall powered devices, seat-back airline 120 V inverters, and commercial LED lighting. "With the EPC2050, designers no longer have to choose between size and performance – they can have both and lower cost!" said Alex Lidow, EPC's CEO.

Partnership to Service Global R&D Engineers
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Learn more:
codaca.com
  • Industry News
  • 2022-04-07

CODACA has established a partnership with Digi-Key Electronics, expanding the channel for CODACA's high-current power inductor products. Available through Digi-Key's online Marketplace, CODACA now offers convenient stocking and immediate shipping options worldwide for its molding power choke CSAB series, high current power inductor CSBX series and CSCF series, and Class D amplifier inductor CPD and CSD series. Digi-Key Electronics provides R&D engineers access to unlimited adjacent products and technologies through its online Marketplace. The company offers more than 13 million components from over 2,200 quality name-brand manufacturers to support R&D activities globally. CODACA has been developing and manufacturing high quality power inductors for more than 20 years. With certifications including ISO 9001, ISO 14001, TÜV (GER), IATF 16949 and CNAS, CODACA products are developed and tested to provide applications with low DC resistance, high-current ratings, and low power consumptions.

GaN Power HEMT ICs for Chargers and Power
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Learn more:
tagoretech.com
  • Product Release
  • 2022-04-05

At APEC 2022, Tagore highlighted how its GaN FETs are well suited for realizing a bridgeless totem-pole PFC where one half-bridge is composed of GaN FETs and the other half-bridge is composed of MOSFETs. The GaN FETs with drivers are ideally suited for DC/DC converter applications such as LLC or Phase Shifted Full Bridge (PSFB) topologies and for secondary side Synchronous Rectification when the output voltage is high, for example, in Electric Vehicle (EV) battery chargers. Tagore also showcased a live demonstration of the 65W Active Clamp Flyback (ACF) demo board; 65W Quasi-Resonant Flyback (QRF) demo board; 240W Totem POLE PFC + LLC demo board; Half-Bridge GaN Evolution Board (Multi-topology), and Phase shifted Full-Bridge Reference Design (800 W). Moreover, at an Industry Session (Session IS07) on March 22, 2021, Manish Shah, Co-Founder and Vice President of Engineering Tagore Technology, United States, Chief Engineer, Rajesh Ghosh and Asif Iqbal, Manager Design, presented "Monolithically Integrated Protection Circuits in 650V Power GaN". The presentation discussed the benefits of a monolithically integrated HEMT-based GaN IC that delivers efficient and reliable operation in power supplies that lead to even higher power density in chargers and power supplies.

SiC Power Modules at PCIM Europe
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Learn more:
leapers-power.com
  • Product Release
  • 2022-04-05

Wuxi Leapers Semiconductor (Leapers Semiconductor) will present full silicon carbide (SiC) power module portfolio during PCIM Europe 2022 in Nuremberg, Germany. On May 10-12, 2022, the representatives of the company will join the event to showcase their latest SiC power module portfolio designed for applications like new energy vehicles, smart grid, solar and wind power generation, motor drives, medical equipment, traction, etc. By using innovative advanced packaging material and processing technology, Leapers Semiconductor provides comprehensive module application solutions for miniaturization, efficiency and light weighting of electrical drive systems and inverters of new energy vehicles. Besides SiC product line Leapers Semiconductor will present IGBT modules portfolio in the industry recognized footprint designed for high power switching applications. All participants and visitors are invited to stop by Leapers Semiconductor booth 520 in Hall 7 to learn more about company, SiC and IGBT module portfolio, and future products under development. This year PCIM Europe will return to face-to-face format and welcome the visitors from around the world in the halls 6, 7 and 9 on the Messe Nürnberg event grounds. The international power electronics industry will meet again after nearly two years of predominantly digital exchange. As in previous years, visitors of the leading exhibition and conference for power electronics can expect product innovations and a top-class lecture program.

Dr. HongWen Zhang to Present InSIDER Series Webinar
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Learn more:
indium.com
  • Event News
  • 2022-04-05

Indium Corporation's Alloy Group R&D Manager Dr. HongWen Zhang will deliver a presentation on the company's award-winning Durafuse(TM) mixed-alloy technology as part of its popular InSIDER Series of webinars. The presentation, titled "Solder Challenges and Product Development with Durafuse Technology", will be given on Wednesday, April 27 at 8 a.m. San Francisco/11 a.m. New York/4 p.m. London/5 p.m. Germany. Dr. Zhang's presentation will focus on the shortcomings of traditional solder materials and examine the ability of Indium Corporation's Durafuse technology to provide a solution to these challenges. He will highlight the benefits of Durafuse LT, a patented, innovative, low-temperature, mixed-alloy technology that offers enhanced reliability with drop shock performance two orders of magnitude better than Bi-containing solders. He will also discuss Durafuse HT, a new patent-pending product designed as a drop-in solution to replace and outperform the traditional high-lead solders in die-attach and clip-bond applications.

Digital Capacitor Catalog
  • Industry News
  • 2022-04-04

The expanded CDE.com website features a Custom Catalog Generator that allows engineers to create their personalized PDF capacitor catalogs. A catalog can include just the product lines of interest, a product category, or even by application. Once the selection is made, it takes just seconds to build the catalog. The catalog is saved to a drive and can be printed by the user. The Catalog Generator is a convenient way to jump-start building detailed bill of materials documentation for a new project. Capacitors include a wide variety of aluminum electrolytic, film, aluminum polymer, supercapacitor, and mica types. Unlike traditional annually printed catalogs, the custom-built catalogs are kept up-to-date on an ongoing basis. Each catalog contains front and back cover pages, a table of contents, and live links to learn more. On most manufacturer websites, it is a tedious chore to select and print out a series of datasheets for multiple products. The CDE Catalog Generator makes it easy. No registration is required to access the Custom Catalog Generator or the website.

Honored for Supply Competence and Strategic Cooperation
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Learn more:
infineon.com
  • Industry News
  • 2022-04-04

Hyundai Motor Group (HMG) has honored Infineon Technologies as "Partner of the Year 2021" with the "Special Award for Supply Competence." The global automaker recognized Infineon's efforts to stabilize uncertain supply chains despite the challenges posed by COVID-19 and the global semiconductor shortage. In particular, Infineon was honored for its excellent risk management working with HMG. Infineon Korea and Infineon Headquarters have provided flexible and strategic cooperation to manage the difficult situation in the market. For example, by providing the silicon carbide (SiC) based power module HybridPACK CoolSiC Drive, Infineon demonstrated product quality and its ability to respond to new requirements. "Infineon is a reliable partner. We are honored that our efforts to maintain our delivery capabilities in a very challenging environment are valued and appreciated by our customers," said Peter Schiefer, President of the Automotive Division at Infineon. "With the rapid momentum towards green mobility, semiconductor solutions are in high demand. We are driving the transformation toward electromobility with high-quality products, leading technology and system expertise, along with a global production network." HMG has been awarding the "Partner of the Year" award since 2002. In early 2019, Infineon was the first semiconductor manufacturer to receive this award. It was awarded in recognition of outstanding achievements in just-in-time supply and contribution to strengthening the overall competitiveness of the Hyundai Motor Group.

Tatsuo Bizen Appointed CEO
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Learn more:
psemi.com
  • People
  • 2022-03-31

pSemi Corporation announced the appointment of Tatsuo Bizen as CEO effective April 1, 2022. Succeeding interim CEO Takaki Murata, Bizen joins pSemi from parent company Murata, where for more than 30 years he has served in a variety of global leadership roles in the United States, Japan and Europe. He brings an extensive background in RF and power management, and a passion for driving innovation. A Murata employee since 1985, Bizen served as vice president of the power module division. From 2012 to 2015, he was president and CEO of the Murata Power Solutions subsidiary headquartered in Massachusetts. Bizen spent the three years prior as head of Murata's global corporate marketing. From 2007 to 2009, he was president and CEO of SyChip, Inc., a Texas-based Murata subsidiary that provided RF chip-scale modules. His earlier experience includes involvement in the development of RF modules such as electronic TV tuners and circuit modules for wireless communication, and product management for RF components and modules in Germany, the Netherlands and Sweden. "I am honored and eager to lead pSemi to new heights as CEO. Since the Murata acquisition in 2014, I have worked closely with pSemi employees, who have always impressed me with their hard work, can-do attitudes and inventive ideas. I look forward to working together with my pSemi colleagues to create innovative semiconductor solutions for the connected world." Tatsuo Bizen said. 

SiC Market, a Multi-Bllion-Dollar Prospect
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Learn more:
yole.fr
  • Industry News
  • 2022-03-31

Yole's compound semiconductor team released its technology and market study, "Power SiC 2022". The study analyzes the challenges and opportunities of this industry in detail. Yole's analysts provide a detailed overview of the technologies as well as accurate market data. The company also offers a valuable understanding of the value chain, the infrastructure, and the competitive landscape, including an analysis of the leading SiC companies' strategies. Poshun CHIU from Yole asserts: "Strongly driven by automotive applications, especially in the EV main inverter, there were multiple newly released EVs and announcements in 2020 and 2021, following Tesla's adoption of SiC. Moreover, Tesla's record shipments helped SiC devices to reach the order of US$1 billion in 2021. To fulfill the demand for a long driving range, an 800V EV is the solution to empower fast DC charging. This is where the 1200V SiC devices play crucial roles." As of 2022, BYD's Han-EV and Hyundai's Ioniq-5 have enjoyed good sales by offering fast charging. More OEMs - such as Nio, XPeng, etc. - plan to bring SiC EVs to the market in 2022. Apart from automotive, industrial and energy applications represent the markets with a higher than 20% growth rate in our forecast period. For example, the deployment of high-power charging infrastructure with SiC modules, and the growing installation of photovoltaics. In this context, the SiC device market is expected to grow beyond US$6 billion by 2027 – from a US$1 billion business in 2021 – in Yole's latest forecast. This multi-billion-dollar business is also appealing for players to grow their revenue.

700 Volt Threshold Vertical GaN Device Demonstrated
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Learn more:
odysseysemi.com
  • Industry News
  • 2022-03-30

Odyssey Semiconductor Technologies announced it has reached a technology milestone in its development of vertical GaN power field-effect transistors (FETs). Odyssey was founded to commercialize vertical GaN FETs. FETs that can provide the conversion efficiency of GaN with the higher voltage rating of SiC. The approach will lead to breakthrough performance for the most demanding applications. Odyssey has now validated its approach at a 700 V rating while also providing industry-leading efficiency with and remarkably low on-resistance approaching 1mOhm-cm2. These devices also exhibit very low gate leakage and can be operated in a mode where they are normally "off". Technology validation can begin on these 700 V devices while an extension of the same architecture to the next milestone of a 1200 V rating or better is completed. Odyssey, with global headquarters in Ithaca, New York is developing this technology in their own manufacturing facility. As the U.S. needs to strengthen domestic semiconductor manufacturing, Odyssey is showing its commitment with its own wafer fabrication facility. This also streamlines the technology and product development processes with close collaboration between R&D and the fab. The Company is also announcing today that the United States Patent and Trademark Office recently approved U.S. Patent 11,251,295, which issued February 15th, 2022, with respect to key aspects of Odyssey's vertical GaN technology. The Patent is entitled "Vertical field effect transistor device and method of fabrication" and relates to a method of fabricating a high voltage switching device using GaN layers and materials.

Joining Forces
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Learn more:
danfoss.com
  • Industry News
  • 2022-03-29

SEMIKRON and Danfoss Silicon Power announced a merger to create a joint business specialized in Power Electronics focusing on power semiconductor modules. With an existing workforce of more than 3,500 dedicated power electronic specialists, the new SEMIKRON-Danfoss will provide technology expertise as the leading partner in Power Electronics. The merger comes with a firm commitment to future investments, paving the way for green growth and a more sustainable, energy efficient and decarbonized future. SEMIKRON-Danfoss will be a central enabler of this transition. The newly formed SEMIKRON-Danfoss joint business will be owned by the current owner-families of SEMIKRON and the Danfoss Group, with Danfoss being the majority owner. The joint business SEMIKRON-Danfoss will be managed by one common leadership team. It will be operated in the accustomed manner, retaining existing production facilities, customer and supplier relationships and distribution channels. SEMIKRON-Danfoss will retain the two main locations in Germany, Nuremberg and Flensburg. The current factories and sales offices of Semikron and Danfoss Silicon Power will continue operations as usual. Danfoss President & CEO Kim Fausing, said: "The new SEMIKRON-Danfoss builds on a strong long-term partnership and more than 90 years of combined technology leadership in Power Module packaging, innovation, and customer application expertise. With electrification driving the green transition, SEMIKRON-Danfoss aims to become the preferred decarbonizing partner for customers. We have the passion, competences and technologies to more than double our business in five years." SEMIKRON CEO Karl-Heinz Gaubatz added: "This really is an exciting moment. Based on close, trusting conversations over the last months we have identified that SEMIKRON and Danfoss are a unique fit with complementing assets, a strong team and shared values. By combining SEMIKRON's expertise as a pioneer for semiconductor technology with more than 70 years of experience in the development of top-class power modules and systems and the strength, innovativeness and fast-paced operations of Danfoss Silicon Power and the Danfoss Group we are positioned ideally to become one of the strongest players in power electronics."


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Bipolar Capacitor Charging High Voltage Power SuppliesDean Technology announced the introduction of the ...9877Product ReleaseBipolar Capacitor Charging High Voltage Power SuppliesDean Technology announced the introduction of the UMR-BPC Series, a line of bipolar (±) high voltage power supplies designed for applications requiring dual output capacitor charging modules with higher voltage and higher power. UMR-BPC models offer output voltages up to 6kV at an output power of either 120W or 250W. "We are thrilled to be able to release a high power high voltage power supply that offers our customers bipolar capabilities," said Scott Wilson, Sales and Product Development Manager for Dean Technology. "UMR-BPC series modules are a packaging and integration convenience as they enclose two units of opposite polarity in a single case. This feature will help customers with their inventory, cable management, and installation time." UMR-BPC modules, an extension of the existing UMR Collection, are form-fit-function replacements for industry standard units. They offer low overshoot and fast rise time while maintaining high efficiency. All models come standard with voltage and current monitoring and can be upgraded to include buffered monitors and current regulation.14.06.2022 19:30:00Junnews_2022-06-15_26.png\images\news_2022-06-15_26.pnghttps://www.deantechnology.com/news/bipolar-capacitor-charging-high-voltage-power-suppliesdeantechnology.com
Combining Expertise to Become Yole GroupYole Développement (Yole) and System Plus Consulti...9857Industry NewsCombining Expertise to Become Yole GroupYole Développement (Yole) and System Plus Consulting announced the creation of Yole Group and its entities, Yole Intelligence and Yole SystemPlus. For more than a year, both partners have been considering a common and unique evolution of the two companies. This stems from the development of the semiconductor industry and its growth, questions and requests from manufacturers and other leading players, and the need to clarify what each company offers. This evolution illustrates a shared commitment to growing by comprising multidisciplinary experts and developing business with the sole aim of responding to requests from the industry. The clearly identified distribution of product and consulting services offered by Yole Intelligence and Yole SystemPlus will be presented on a new and dynamic internet platform, www.yolegroup.com, that will enable easy navigation and quick access to information and products. In addition to the company's description, product information, and library, Yole Group's website covers the latest news from the semiconductor industry as well as interviews with leading companies and unique editorial content created by Yole Group's analysts. These noteworthy stories will be part of a new dynamic section, Industry Insight (formerly i-Micronews).10.06.2022 11:00:00Junnews_2022-06-15_6.jfif\images\news_2022-06-15_6.jfifhttps://www.yolegroup.com/press-release/yole-developpement-and-system-plus-consulting-combine-their-expertise-to-become-yole-group/yolegroup.com
Miniature MOSFET Gate Driver Family for Portable ApplicationsToshiba Electronics Europe has added five MOSFET g...9875Product ReleaseMiniature MOSFET Gate Driver Family for Portable ApplicationsToshiba Electronics Europe has added five MOSFET gate-driver ICs in the TCK42xG series, suitable for a wide range of applications including battery powered, consumer and industrial equipment. The devices in this series control the applied gate voltage independent of the input voltage and feature an over-voltage lockout function to protect the circuit. The products are now joining the TCK421G, announced earlier this year. Products in the series can be selected for a gate-source voltage of 10V or 5.6V, allowing use with a wide variety of MOSFETs. A choice of detection voltages for the input over-voltage lockout allows them to operate from power lines from 5V to 24V. The drivers available are the TCK420G for 24V power lines, TCK422G and TCK423G for 12V, TCK424G for 9V, and TCK425G for 5V. Each new driver in the series features a built-in charge pump that ensures a stable gate-source voltage at the external MOSFET while the input can vary from 2.7V to 28V. This allows large currents to be switched. In addition, when used to control two N-channel MOSFETs connected back-to-back, they are suitable for configuring load-switch or power-multiplexer circuits with reverse-current blocking. To further assist customers' projects, Toshiba has developed the Power Multiplexer Circuit Reference Design, which provides a design example for power multiplexers that utilize the functions of TCK42xG.09.06.2022 17:30:00Junnews_2022-06-15_24.jpg\images\news_2022-06-15_24.jpghttps://toshiba.semicon-storage.com/eu/company/news/2022/06/power-management-ics_20220609-1.htmltoshiba.semicon-storage.com
AuSn Pastes for High-Power LEDsIndium Corporation has expanded its portfolio of p...9872Product ReleaseAuSn Pastes for High-Power LEDsIndium Corporation has expanded its portfolio of proven pastes with two AuSn pastes designed for the higher processing temperatures and assembly needs required for use in high-power LED module array applications, such as automotive, infrastructure, and horticulture. Indium Corporation produces a wide range of solder paste products to meet the current and evolving needs of the industry. High-power LEDs have the ability to provide much higher levels of light output than traditional LEDs while also providing higher levels of performance, leading to a longer lifetime of the device. Due to the large amount of heat generated-in such a localized area-a high-melting and high-reliability solder is required for assembly. It is also critical to the LED assembly process that the solder interface between the diode and its substrate is void-free in order to generate a stable transmission of light and allow for the transfer of the tremendous heat generated by the diodes to maintain the temperature stability of the device. AuLTRA 3.2 and AuLTRA 5.1 are AuSn solder pastes specifically formulated to accommodate higher processing temperatures while providing high reliability. Both pastes are offered in a variety of AuSn alloys and powder sizes. In addition to being ideal for use in high-power LED module array applications, AuLTRA 3.2 and AuLTRA 5.1 are applicable for all AuSn paste applications as their performance has been, and continues to be, proven in the field. 09.06.2022 14:30:00Junnews_2022-06-15_21.jpg\images\news_2022-06-15_21.jpghttps://www.indium.com/corporate/media-center/news/indium-corporation-introduces-ausn-pastes-for-high-power-leds/indium.com
CAT III 1500 V True-RMS Solar Clamp MeterFluke has announced the top three electrical hazar...9868Product ReleaseCAT III 1500 V True-RMS Solar Clamp MeterFluke has announced the top three electrical hazards to avoid when installing and maintaining PV solar installations to keep technicians safe. The demand for highly accurate hand-held devices capable of carrying out safe and reliable measurements in these applications has now been met with the introduction of a CAT III 1500 V true-RMS solar clamp meter – the Fluke 393 FC. All test results are logged and reported via the Fluke Connect software that comes with the Fluke 393 FC true-RMS Solar Clamp Meter. Using just a phone, engineers can make and save measurements quickly, with the phone recording for 10 minutes and reporting readings to colleagues. Capable of measuring and recording up to two weeks, this safe, reliable and rugged meter also comes with an 18-inch iFlex flexible current probe for extended AC current measurements up to 2500 amps. Test leads are also rated to CAT III 1500 V DC. Hans-Dieter Schuessele, Application and Technology Expert EMEA, Fluke said: "Safety is essential when commissioning and installing PV systems. The future of power needs tools that are able to keep you safe in harsh environments – risk is not an option and you literally have to trust your meter with your life. That's why the world's first CAT III 1500 V true-RMS clamp meter has been designed to deliver enhanced protection for users in challenging CAT III environments. It's very important that there's a solid meter with multiple functions capable of operating at that rating – the solar industry desperately needs a solution like the Fluke 393 FC."07.06.2022 10:30:00Junnews_2022-06-15_17.jpg\images\news_2022-06-15_17.jpghttps://www.fluke.com/en-gb/product/electrical-testing/clamp-meters/fluke-393-fc-cat-iii-1500-v-true-rms-clamp-meterfluke.com
DOCSIS-Compliant Switch Delivers High LinearityRichardson RFPD announced the availability and ful...9867Product ReleaseDOCSIS-Compliant Switch Delivers High LinearityRichardson RFPD announced the availability and full design support capabilities for an UltraCMOS SPDT RF switch from pSemi Corporation. The PE42726 is a HaRP technology-enhanced reflective SPDT RF switch designed for use in cable applications, including DOCSIS 3.0/1 cable modem, set-top box and residential gateway. It delivers high linearity, excellent harmonics performance and high surge immunity in the 5–1794 MHz band. It also features low insertion loss and high isolation performance, making the PE42726 ideal for DOCSIS 3.1 applications. The PE42726 is manufactured on pSemi's UltraCMOS process, a patented variation of silicon-on-insulator (SOI) technology on a sapphire substrate, offering the performance of GaAs with the economy and integration of conventional CMOS.07.06.2022 09:30:00Junnews_2022-06-15_16.jpg\images\news_2022-06-15_16.jpghttps://www.richardsonrfpd.com/docs/rfpd/Richardson_RFPD_Product_Release_pSemi_PE42726%20.pdfrichardsonrfpd.com
Opening of Joint Research Center for 300 mm MicroelectronicsA flagship of semiconductor research with internat...9854Industry NewsOpening of Joint Research Center for 300 mm MicroelectronicsA flagship of semiconductor research with international reach is emerging in Dresden. Fraunhofer IPMS and Fraunhofer IZM-ASSID are bundling their competences and establishing the Center for Advanced CMOS & Heterointegration Saxony. The center will offer the complete value chain in 300 mm microelectronics, a prerequisite for high-tech research for future technologies. With Fraunhofer IZM-ASSID and Fraunhofer IPMS' Center Nanoelectronic Technologies CNT, two unique research facilities in Germany in the field of microelectronics are located in Saxony. Today, they are the only two German research centers for applied microelectronics research based on 300 mm wafer industry standard equipment. With the bundling of competences and the foundation of the Center for Advanced CMOS & Heterointegration Saxony, excellent perspectives arise to attract semiconductor companies and system users as well as material and equipment manufacturers worldwide. In addition to excellent personnel and know-how, equipment with a modern equipment and plant park is crucial for industrial and research contracts. With an investment volume of about €140 million in clean room facilities, Fraunhofer IPMS is uniquely positioned in Germany in the field of applied research on the modern 300 mm wafer industry standard in the front end of CMOS manufacturing. Fraunhofer IZM-ASSID complements this expertise with innovative packaging and system integration technologies. In the future, the center will be headed by Dr. Wenke Weinreich, division manager at CNT and deputy institute director of Fraunhofer IPMS, and Dr. Manuela Junghähnel, site manager at IZM-ASSID.07.06.2022 08:00:00Junnews_2022-06-15_3.jpg\images\news_2022-06-15_3.jpghttps://www.izm.fraunhofer.de/en/news_events/tech_news/new-center-for-semiconductor-research-opened-in-dresden.htmlfraunhofer.de
Passive Near Field ProbeLanger EMV-Technik GmbH presents a passive near-fi...9874Product ReleasePassive Near Field ProbeLanger EMV-Technik GmbH presents a passive near-field probe with a measuring range of up to 40 gigahertz. The HR-E 40-1 probe is designed for measurements of high-frequency, electrical near fields in the frequency range up to 40 gigahertz on conductors, ICs, metallic housings and RF structures. The HR-E 40-1 near-field probe is suitable for measurements on high-frequency structures during development, such as analyses of the harmonics of 5G assemblies, for example. It allows you to specifically record the electric near fields and derive a detailed field image of the structure to be measured. The probe tip is decoupled from the probe shaft by special damping systems. In addition, the probe contains a sheath current attenuation. The newly developed probe head ensures a defined distance of 0.5 mm even for hand-held measurements. The HR-E 40-1 allows a spatial resolution of 0.2 mm and transmits the measured signals to the measuring device. The transmission behavior of the near-field probe is almost constant in the frequency range from 8 to 40 gigahertz and thus enables reproducible measurement results, for example to verify and refine simulation models. For spatially reproducible measurements, the probe can be used in an automatic positioning system, for example in a Langer scanner. The probe is to be used with the SH 01 probe holder in the scanner. The HR-E 40-1 near-field probe can be calibrated using the Langer Stripline CPL 40-01 38. The passive near-field probe is supplied in a set consisting of the operating manual, the HR-E 40-1 probe and the USB stick with the probe characteristics.02.06.2022 16:30:00Junnews_2022-06-15_23.jpg\images\news_2022-06-15_23.jpghttps://www.langer-emv.de/en/product/hr-passive-up-to-40-ghz/107/hr-e-40-1-set-near-field-probe-set-up-to-40-ghz/1318langer-emv.de
Die-to-Wafer Self-Assembly BreakthroughCEA-Leti and Intel have optimized a hybrid direct-...9858Industry NewsDie-to-Wafer Self-Assembly BreakthroughCEA-Leti and Intel have optimized a hybrid direct-bonding, self-assembly process that has the potential to increase the alignment accuracy as well as fabrication throughput by several thousand dies per hour. The approach uses capillary forces of a water droplet to align dies on a target wafer. The results were presented in a paper, "Collective Die-to-Wafer Self-Assembly for High Alignment Accuracy and High Throughput 3D Integration", at the 2022 Electronic Components and Technology Conference (ECTC). While leading microelectronics companies see the D2W hybrid bonding process as being essential for the success of future memory, HPC and photonic devices, it is much more complex than wafer-to-wafer bonding, with lower alignment accuracy and lower die-assembly throughput. CEA-Leti has been developing a self-assembly method for several years, with the goal of substantially increasing throughput and placement accuracy. "Commercial scale throughput with D2W self-assembly presents two main challenges related to die handling," said Emilie Bourjot, CEA-Leti's 3D integration project manager. "If the self-assembly process is combined with a pick-and-place tool, the throughput can be increased by reducing the time of alignment, since the fine alignment is performed by the droplet. When self-assembly is combined with a collective die-handing solution, the throughput is increased by the fact that all dies are bonded together at the same time without any high precision placement at any time along the process flow." Process optimization is also an important part of this work for increasing process maturity and targeting industrial requirements.02.06.2022 12:00:00Junnews_2022-06-15_7.jpg\images\news_2022-06-15_7.jpghttps://www.leti-cea.com/cea-tech/leti/english/Pages/What's-On/Press%20release/CEA-Leti-Intel-Report-Die-to-Wafer-Self-Assembly-Breakthrough-Targeting-High-Alignment-Accuracy-and-Throughput.aspxleti-cea.com
E-training: Design and Control of Power Factor Correction (PFC) ConvertersThe main objective of this course June 27 to 29 is...9862Event NewsE-training: Design and Control of Power Factor Correction (PFC) ConvertersThe main objective of this course June 27 to 29 is to study theoretical aspects and practical aspects of the design of power factor correction (PFC) converters. This type of AC/DC rectifiers have to comply with strict specifications regarding the current harmonics injected to the grid, and more recently with some other Grid-Codes requirements. The course is designed to provide fundamental knowledge about the design of the power stage (semiconductors, inductors, EMI filters and capacitors selection) and the control system (analog and digital). Regarding the control system, it will be covered from basic analog IC controllers (CCM and BCM) to sophisticated System on Chip (SoC-FPGA) implementation.01.06.2022 16:00:00Junnews_2022-06-15_11.png\images\news_2022-06-15_11.pnghttps://powersys-solutions.com/design-and-control-of-power-factor-correction-pfc-converters-june-2022/powersys-solutions.com
Discrete IGBT Devices Adopted by Inverter SupplierZhuhai ENPOWER Electric, a China based supplier of...9861Industry NewsDiscrete IGBT Devices Adopted by Inverter SupplierZhuhai ENPOWER Electric, a China based supplier of inverters for the automotive industry, is the first to integrate the latest 750 V automotive-grade IGBTs AIKQ120N75CP2 and AIKQ200N75CP2 from Infineon Technologies. The discrete IGBT EDT2 devices in TO-247PLUS package enable performance boosts and system cost savings in main inverter applications and DC link discharge switches of electric vehicles. Additionally, they offer greater design freedom for achieving system integration targets. "ENPOWER firmly follows the technology route of designing motor control units (MCUs) with discrete components, and continuously develops products that are both good and cost-advantageous, therefore to always maintain the competitive advantage of our MCUs in the market," said Liu Hongxin, ENPOWER's R&D director of MCU. "Infineon's discrete IGBTs are compatible with the last generation in terms of packaging. Together with the high current density, ultra-low saturation voltage drop and very good parallel performance, power density of our products has increased by more than 20 percent, further improving competitiveness of our products." "We are very happy about this close and successful collaboration with ENPOWER. This project further highlights our strong position in the inverter application," said Dr. Robert Hermann, Product Line Head for Automotive High Power Discretes and Chips at Infineon. "Leveraging our technology expertise and system understanding allows us to bring innovative solutions to the market perfectly matching customers' needs."01.06.2022 15:00:00Junnews_2022-06-15_10.jpg\images\news_2022-06-15_10.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2022/INFATV202206-088.htmlinfineon.com
75 Years of InnovationAvnet Abacus congratulated Bourns on its 75th anni...9855Industry News75 Years of InnovationAvnet Abacus congratulated Bourns on its 75th anniversary in business. The company was set up in Altadena, California in 1947 – coincidentally the same year as the invention of the first working point-contact transistor by Bardeen, Brattain and Shockley at Bell Labs, which arguably represents the birth of the modern electronics industry. In addition to the 75th anniversary of Bourns, this year also marks a milestone for the relationship between Bourns and Avnet Abacus, as the two companies are celebrating more than 21 years working together, since March 2001. "We are delighted to share our 75th anniversary with Avnet Abacus and all our strategic partners," said Ferdinand Leicher, Vice President Sales EMEA at Bourns. "Building upon this celebration, this year also represents another milestone for our relationship with Avnet Abacus, which has been a key and highly valued distribution partner for us across Europe over the past two decades. Long may our success together continue." "All of us here at Avnet Abacus are honoured to have been a long-term strategic partner for Bourns," said Hagen Goetze, Senior Director Marketing at Avnet Abacus. "We look forward to continuing our relationship over many more years. We also pay tribute to the major technology innovations that Bourns has achieved in the electronics industry over the past 75 years from the onset of modern electronics to the global and dynamic industry of today."01.06.2022 09:00:00Junnews_2022-06-15_4.jpg\images\news_2022-06-15_4.jpghttps://www.avnet.com/shop/us/m/bourns/avnet.com
LIN Motor Pre-driver Assists High Power Mechatronic MiniaturizationMelexis has introduced the MLX81346, a single chip...9866Product ReleaseLIN Motor Pre-driver Assists High Power Mechatronic MiniaturizationMelexis has introduced the MLX81346, a single chip LIN pre-driver for high power up to 2000 W. The MLX81346 enables motor control miniaturization and efficient silent drive with field-oriented control (FOC). It addresses automotive mechatronic applications - including oil pumps, engine cooling fans, and BLDC positioning actuators. The device is also used in robotic systems and e-bikes/e-scooters. As well as being able to support operation up to 1000 W from a 12 V supply, the MLX81346 is also uniquely positioned to reach 2000 W from a 48 V supply. Its high-voltage capabilities come from the silicon-on-insulator (SOI) technology it relies on. The MLX81346 features a 16-bit embedded microcontroller unit (MCU), a 64 KB flash memory, plus a LIN software stack and LIN interface (for connecting to in-vehicle networking infrastructure). It has 12 GPIOs including 3x high-voltage I/Os, 2 UARTs, SPI and I2C. Rapid end-of-line programming via the LIN pin can be carried out by the customers with the support of Melexis' recommended third parties. The MLX81346 takes up minimal board space. It can be supplied in either a 32-pin QFN (5 mm x 5 mm) or a 48-pin TQFP48 (7 mm x 7 mm) packages. This compact pre-driver was developed as a SEooC (Safety Element out of Context) with ASIL B capability. An operational temperature range of -40°C to 150°C is supported. All essential circuit protection functions are also incorporated.01.06.2022 08:30:00Junnews_2022-06-15_15.jpg\images\news_2022-06-15_15.jpghttps://www.melexis.com/en/news/2022/1jun2022-smart-lin-motor-pre-driver-assists-high-power-mechatronic-miniaturizationmelexis.com
Order to Deliver Powerful Converter StationHitachi Energy announced that it has won an order ...9856Industry NewsOrder to Deliver Powerful Converter StationHitachi Energy announced that it has won an order from Deutsche Bahn to provide a 120 megawatt (MW) converter station which enables DB Energie to secure power supply for the Greater Berlin rail network. The network serves a metropolitan population of around 3.5 million people and is the hub for multiple high-speed train services to cities throughout Germany and neighboring countries. The Thyrow converter station, south of Berlin, will enable Deutsche Bahn to convert electricity from the public three-phase power distribution grid, which operates at a frequency of 50 hertz (Hz) to 16.7 Hz, and feed it into the rail power grid used to power trains and rail infrastructure. The order follows one awarded last year by Deutsche Bahn to Hitachi Energy for the 160 MW Delitz converter station in the greater Halle/Leipzig area, which will be one of the most powerful converter stations for rail power worldwide. The Hitachi Energy solution for the Thyrow converter station comprises three compact 40 MW static frequency converter modules, which use Hitachi Energy's advanced power semiconductors to provide a steady and reliable power supply at maximum availability and with minimal electrical losses. The solution includes a 30-year service contract and a digitalization package to provide Deutsche Bahn with condition-based and reactive maintenance and data insights into the system status of the converter station over the life cycle.31.05.2022 10:00:00Maynews_2022-06-15_5.jpg\images\news_2022-06-15_5.jpghttps://www.hitachienergy.com/news/press-releases/2022/05/hitachi-energy-wins-order-from-deutsche-bahn-to-deliver-one-of-the-most-powerful-converter-stations-in-the-worldhitachienergy.com
Acquisition Expands Served Addressable MarketAllegro MicroSystems announced the entry into an a...9852Industry NewsAcquisition Expands Served Addressable MarketAllegro MicroSystems announced the entry into an agreement to acquire Heyday Integrated Circuits. Heyday is a privately-held company specializing in compact, fully-integrated isolated gate drivers that enable energy conversion in high-voltage gallium nitride (GaN) and silicon carbide (SiC) wide-bandgap (WBG) semiconductor designs. The Heyday acquisition will complement Allegro's existing solutions for energy efficiency, including its current sensor solutions. Additionally, it is expected to significantly expand Allegro's addressable market for electric vehicles (xEV), solar inverters, datacenter and 5G power supplies, and broad-market industrial applications. Heyday's expertise in gate drive solutions provide system designers with innovative ways to fully leverage the potential of high-efficiency WBG switches. According to industry analysts and internal estimates, these advanced gate drive solutions give Allegro new access to an estimated $2.7 billion high-growth serviceable available market, increasing Allegro's content opportunity in green energy applications such as xEV on-board chargers and solar and traction inverters. "With high-powered GaN and SiC wide bandgap systems expected to grow significantly over the next decade, our customers are facing an exponential demand for simplified power management solutions," said Michael Doogue, Senior Vice President of Technology and Products at Allegro. "High-voltage isolated gate drivers are a fundamental enabling technology for the future of high-efficiency power system designs. Coupled with our market-leading integrated current sensors, Heyday's Power-ThruTM technology will allow our customers to build some of the smallest high-voltage and high efficiency power systems available today."31.05.2022 06:00:00Maynews_2022-06-15_1.jpg\images\news_2022-06-15_1.jpghttps://www.allegromicro.com/en/about-allegro/news-room/2022/heyday-agreement-prallegromicro.com
Expanding Integrated Switcher Family to 220 WPower Integrations announced an expanded offering ...9876Product ReleaseExpanding Integrated Switcher Family to 220 WPower Integrations announced an expanded offering of the InnoSwitch4-CZ family of high-frequency, zero-voltage switching (ZVS) flyback controller ICs. When paired with Power Integrations' ClampZero active-clamp IC and, optionally, the recently announced HiperPFS-5 GaN-based power-factor corrector, the ICs easily address the latest USB PD 3.1 specification for adapters and chargers up to 220 W. "Road warriors demand light, compact, powerful adapters capable of rapidly charging all their mission-critical devices. The expanded power range of the new InnoSwitch4-CZ and ClampZero ICs allows charger/adapter designers to easily exceed 23 W per cubic inch for single- and multiple-output USB PD 3.1 certified designs," explained Edward Ong, senior product marketing manager at Power Integrations. "Even at 220 W of output power, the family's high efficiency minimizes waste heat; bulky heatsinks are not required on any of the active devices. The maximum switching frequency of up to 140 kHz minimizes transformer size, and the high level of integration approximately halves the number of passive components, MOSFETs and diodes that make safety-compliant PCB layout a challenge." InnoSwitch4-CZ ICs include a robust 750 V PowiGaN primary switch, active clamp drive and synchronous rectification in a compact InSOP-24D package. Secondary-side sensing – achieved using Power Integrations' FluxLink high-speed communications technology – provides exceptional CV/CC accuracy. Adds Ong: "The use of a non-complementary-mode active clamp enables designs that work in both continuous (CCM) and discontinuous (DCM) modes. By operating across modes, it is much easier to support the wide load/range conditions often encountered in USB PD applications."25.05.2022 18:30:00Maynews_2022-06-15_25.gif\images\news_2022-06-15_25.gifhttps://investors.power.com/news/news-details/2022/Power-Integrations-Expands-InnoSwitch4-CZ-Integrated-Switcher-Family-to-220-W/default.aspxpower.com
WIPP 2022 Addresses High-Density/High-Efficiency Power Converter PackagingThe International Workshop on Integrated Power Pac...9863Event NewsWIPP 2022 Addresses High-Density/High-Efficiency Power Converter PackagingThe International Workshop on Integrated Power Packaging announces IWIPP 2022, to be held in Grenoble, France, August 24-26, 2022, and hosted by G2E Labs. IWIPP, utilizing focused technical tutorials and a series of in-depth technical sessions, aims to foster and facilitate disruptive change in the development of power packaging technologies required to help increase reliability and manufacturability while targeting improved performance with reduced size and cost. IWIPP 2022 will feature keynote addresses from leading experts, a broad range of technical sessions, as well as a complement of partner exhibits, all of which are included in the registration fee. Under the leadership of General Chairman Dr. Francesco Iannuzzo of Aalborg University, IWIPP brings together industry, academic and government researchers in the field of power electronics components, electrical insulating materials, and packaging technologies to facilitate and promote the development and commercialization of high-density and high-efficiency power converters. Invited presentations and contributed papers will address a variety of timely topics, including power module design, magnetic and dielectric materials technology, component performance, and application-level impacts of packaging technology.25.05.2022 17:00:00Maynews_2022-06-15_12.jpg\images\news_2022-06-15_12.jpghttps://web.cvent.com/event/a0cdbbe0-3df1-40ee-94df-074752c7c229/summarycvent.com
40 V, 1.1 mΩ FET Space-constrained ApplicationsEfficient Power Conversion expands the selection o...9865Product Release40 V, 1.1 m&#8486; FET Space-constrained ApplicationsEfficient Power Conversion expands the selection of low voltage, off-the-shelf gallium nitride transistors with the introduction of the EPC2066 (0.8 m&#8486; typical, 40 V) GaN FET. The low losses and small size of the EPC2066 makes it the ideal switch for the secondary side of high power density 40 V – 60 V to 12 V DC-DC converters for the latest servers and artificial intelligence. It is also ideal for the secondary side synchronous rectification to 12V in power supply and silver box data center servers, and for high density motor drive applications from 24V – 32V. The high frequency operation, high efficiency, and an ultra-small 13.9 mm2 footprint of the GaN FET combine for state-of-the-art power density. The EPC2066 is footprint compatible with EPC's prior Generation 4 product, the EPC2024. The Generation 5 improvement in Area x RDS(on) gives the EPC2066 a 27% reduction in on-resistance in the same area. "The EPC2066 is significantly smaller than any other FET in the market at this on resistance", commented Alex Lidow, EPC's co-founder and CEO. "This part is the perfect compliment to the recently released EPC2071 for LLC DC-DC for high power density computing applications."25.05.2022 07:30:00Maynews_2022-06-15_14.jpg\images\news_2022-06-15_14.jpghttps://epc-co.com/epc/EventsandNews/News/ArtMID/1627/ArticleID/3059/The-Smallest-40-V-11-m%e2%84%a6-FET-in-the-World-from-EPC-Enables-State-of-the-Art-Power-Density.aspxepc-co.com
Trio of Performance T&M InstrumentsTelonic extends its instrumentation range with thr...9864Product ReleaseTrio of Performance T&M InstrumentsTelonic extends its instrumentation range with three instruments from Siglent Technologies' A-Line family: the SNA500A vector network analyser (VNA), the SDS6000A oscilloscope and the SDG7000A arbitrary function generator. Siglent's first two- or four-port vector network analyser, the SNA5000A, meets the demand for high-performance measurement in radio and cellular networks and is ideal for the measurement of passive or active components, verification of two-port networks or adaptation of antennas. The SDS6000A oscilloscope features eye diagrams and jitter analysis and an acquisition memory up to 500 Mpts over one, two or four channels. The waveform capture rate can reach up to 750,000 waveforms / s in sequence mode. Other features are digital and zone triggers, history function, mask test, Bode plot and a I2C, SPI, UART, CAN, LIN as standard. The SDS6000A can optionally be expanded by 16 digital channels and an external function generator (25 MHz). Additional serial bus decoders (CAN-FD, FlexRay, MIL1553, I2S, SENT, Manchester) are also available. The most recent addition to the A-Line series is the SDG7000A two-channel arbitrary function generator. Offered in 350 MHz, 500 MHz and 1 GHz bandwidths, it features two independent channels which can be combined via menu control to simulate interference on the main signal or to generate complex modulated signals. All of Siglent's new performance line of instruments include a web control interface that provides remote instrument control without additional software.25.05.2022 06:30:00Maynews_2022-06-15_13.jpg\images\news_2022-06-15_13.jpghttps://telonic.co.uk/siglent-brings-its-a-game-with-a-trio-of-performance-tm-instruments/telonic.co.uk
Collaborate to Accelerate Power System DesignSynopsys and Analog Devices announced their collab...9860Industry NewsCollaborate to Accelerate Power System DesignSynopsys and Analog Devices announced their collaboration to provide model libraries for DC/DC ICs and µModule (micromodule) regulators with Synopsys' simulation tool, Saber, part of Synopsys' virtual prototyping solution. With this library in the Saber system-level simulation system, powertrain designers for products such as electric vehicles, avionic machines, instrumentation equipment and supercomputers can perform accurate multi-domain simulations with precision and speed, accelerating the design process and time-to-market. "With robust and reliable Saber modeling for our power ICs and µModule devices, system designers can confidently rely on our services, focusing their attention on the rest of their complex designs involving field-programmable gate arrays (FPGAs), processors, memory, sensors, and data converters," said Afshin Odabaee, business development director for µModule Power Products at Analog Devices. "Collaborating with Synopsys enables us to deliver a powerful simulation solution based on Saber's integrated environment for simulation and modeling, allowing our customers to accelerate their time-to-market." From developing an electric vehicle's powertrain or charging system, to designing reliable aerospace systems, accurate models and powerful simulation are key to meeting competitive design targets. The availability of Analog Devices' library of comprehensive component models in Saber enables design teams to perform simulations at various levels of abstraction, with multi-domain physical modeling and unmatched analysis capabilities to explore, measure, and optimize system performance.24.05.2022 14:00:00Maynews_2022-06-15_9.png\images\news_2022-06-15_9.pnghttps://www.synopsys.com/verification/virtual-prototyping/saber/saber-rd.htmlsynopsys.com
Electromagnetic Simulation Supports Designs Targeted at Communication and Automotive MarketsX-FAB Silicon Foundries announced a collaboration ...9853Industry NewsElectromagnetic Simulation Supports Designs Targeted at Communication and Automotive MarketsX-FAB Silicon Foundries announced a collaboration with the computational software vendor, Cadence Design Systems, in relation to electromagnetic (EM) simulation. As a result, the Cadence EMX Planar 3D Solver is now successfully integrated into the X-FAB RFIC workflow, thereby benefitting X-FAB's current and future RF platforms. The validation activities carried out via the EMX Solver on X-FAB RF reference designs for low-noise amplifiers, RF switches, filters and passives elements all delivered high-accuracy results within very short timeframes. By leveraging Cadence's EMX Solver, X-FAB design engineers can efficiently develop next-generation RF technology for the latest communication standards (including sub-6GHz 5G, mmWave, UWB, etc.), which are enabling technologies for electric vehicle (EV) wireless applications. Seamlessly incorporated within the Cadence Virtuoso RF solution, the intuitive EMX Solver quickly provides foundry models to a high degree of accuracy. These help to streamline product development processes and enable the most stringent design specifications to be met. Access to this ultra-fast EM simulator means that X-FAB customers will be able to get their design projects completed earlier, allowing them to gain significant time-to-market advantages. As part of its 130 nm RF SOI PDK, X-FAB now plans to supply reference designs that have been characterized using the EMX Solver. These will be distributed to customers in both the communication and automotive sectors. Furthermore, the PDK will include a wide array of inductor models which have all been pre-characterized by the EMX Solver.24.05.2022 07:00:00Maynews_2022-06-15_2.jpg\images\news_2022-06-15_2.jpghttps://www.xfab.com/news/details/article/x-fab-adopts-cadence-emx-solvers-electromagnetic-simulation-technology-to-support-innovative-rf-designs-targeted-at-communication-and-automotive-marketsxfab.com
800 V Power InductorsCoilcraft RFC0807BV Series power inductors are a h...9871Product Release800 V Power InductorsCoilcraft RFC0807BV Series power inductors are a high-voltage version of our RFC0807B Series. Their operating voltage is rated at 800 V, which is significantly higher than comparable products in the market. They offer a cost-effective solution for high-voltage, universal off-line (non-isolated) AC/DC power supplies in a variety of industrial and automotive applications. These applications include grid infrastructure, smart meters or power monitors, residential circuit breakers, building automation, home appliances, and others. The RFC0807BV also features low DCR and high current capability, making it an ideal power inductor for high-current and high-voltage battery management systems. Their high voltage rating of 800 V make them ideal for high-voltage / high-current battery management systems, as well as universal off-line (non-isolated) AC/DC power supplies for industrial and automotive applications. They are also AEC-Q200 Grade 3 (-40° to +85°C) qualified.23.05.2022 13:30:00Maynews_2022-06-15_20.jpg\images\news_2022-06-15_20.jpghttps://www.coilcraft.com/en-us/products/power/unshielded-inductors/radial-lead/rfc-rfb/rfc0807bv/coilcraft.com
IEEE International Electron Devices Meeting Announces 2022 Call for PapersUnder the theme, "The 75th anniversary of the Tran...9840Event NewsIEEE International Electron Devices Meeting Announces 2022 Call for PapersUnder the theme, "The 75th anniversary of the Transistor and the Next Transformative Devices to Address Global Challenges," the 68th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking original work in all areas of microelectronics research and development. The 2022 IEDM is being planned as an in-person conference December 3-7, 2022 at the Hilton San Francisco Union Square hotel, with on-demand access to recorded presentations after the event for those unable to travel due to COVID-19 restrictions. The paper submission deadline is Friday, July 14, 2022. Authors are asked to submit four-page camera-ready papers. Accepted papers will be published as-is in the proceedings. A few late-news papers also will be accepted, covering only the most recent and noteworthy developments. The late-news submission deadline is August 22, 2022. The IEEE IEDM is the premier forum for technological breakthroughs in semiconductor and related device technology, manufacturing, design, physics and modeling. Each year technologists gather to participate in a technical program of more than 220 presentations, panels, focus sessions, tutorials, Short Courses, supplier exhibits, IEEE/EDS award presentations and other events highlighting the industry's best work.20.05.2022 14:00:00Maynews_2022-06-01_9.jpg\images\news_2022-06-01_9.jpghttps://www.ieee-iedm.org/topics-of-interestieee-iedm.org
Dr. Werner Lohwasser Appointed CEOTDK Corporation announces that Dr. Werner Lohwasse...9836PeopleDr. Werner Lohwasser Appointed CEOTDK Corporation announces that Dr. Werner Lohwasser (55) will become the new Chairman of the Management Board and Chief Executive Officer (CEO) of TDK Electronics effective July 1, 2022. This was decided by the Supervisory Board of TDK Electronics. Lohwasser has been a member of the Management Board since 2018 and will retain his previous duties as Chief Operations Officer (COO) of TDK Electronics and as COO of the TDK Electronic Components Business Company in his new role. He succeeds Joachim Zichlarz, who has led the company as CEO for eight years. "We are very pleased to have won Dr. Werner Lohwasser, an outstanding expert in both the passive components industry and TDK Electronics, for the position of CEO," said Dr. Werner Faber, Chairman of the Supervisory Board of TDK Electronics. "In recent years, Dr. Lohwasser has helped to shape the company's successful development within the TDK Group, and in the very challenging times ahead he will continue to contribute his decades of experience gained since 1996 at TDK Electronics and its predecessor companies, as well as at the U.S. based capacitor manufacturer Kemet."19.05.2022 10:00:00Maynews_2022-06-01_5.jpg\images\news_2022-06-01_5.jpghttps://www.tdk-electronics.tdk.com/en/373388/company/press-center/press-releases/press-releases/dr-werner-lohwasser-to-succeed-joachim-zichlarz-as-ceo-of-tdk-electronics/3093936tdk.com
Partnership for Gallium Nitride Automotive Power ModulesNexperia has announced a partnership covering gall...9835Industry NewsPartnership for Gallium Nitride Automotive Power ModulesNexperia has announced a partnership covering gallium nitride (GaN) automotive power modules with KYOCERA AVX Components (Salzburg). This partnership agreement is the next step in the long-lasting close relationship between both companies and will focus on power components with the aim of jointly developing GaN applications for electric vehicles (EV). Thomas Rinschede, Deputy Vice President Sensing and Control Division at KYOCERA AVX, states: "We are very pleased to finally turn our successful and long-lasting relationship into a real partnership to strengthen KYOCERA AVX's strategy to provide high-quality automotive compliant modules. Nexperia is a trusted and reliable partner who can deliver high-performance GaN and has shown a strong record in producing devices for the automotive market." Carlos Castro, Vice President and General Manager GaN Nexperia, comments: "GaN devices bring many benefits to EV applications including increased power density, improved efficiency and lower overall system cost. However, optimized packaging technology is required in order to more fully realize the benefits of GaN devices, especially in high power systems. Nexperia recognizes the advanced technology offering and leading position which KYOCERA AVX holds in the automotive industry and believes that this joint collaboration in the development of GaN automotive power modules will enable both companies to deliver superior EV power systems solutions to our customers."19.05.2022 09:00:00Maynews_2022-06-01_4.jpg\images\news_2022-06-01_4.jpghttps://www.nexperia.com/about/news-events/press-releases/Nexperia-and-KYOCERA-AVX-Components-Salzburg-agree-Partnership-for-Gallium-Nitride-Automotive-Power-Modules.htmlnexperia.com
Metal Ceramic Substrates for Power Electronic ModulesHeraeus Electronics announced the launch of its Co...9850Product ReleaseMetal Ceramic Substrates for Power Electronic ModulesHeraeus Electronics announced the launch of its Condura.ultra Ag free AMB Substrate. An Ag free AMB substrate that enables bonding silicon-nitride-based ceramics with copper foils, Condura.ultra was developed using a special technique enabling high-performance Si3N4 substrates by using Ag free active metal brazing (AMB) bonding technology. ?In an effort to better support its customers, Heraeus Electronics has introduced Condura.ultra which is designed to offer reliability and processing (e.g., sintering, bonding, soldering). The Si3N4 Ag free AMB substrate is available with standard and thick Cu layers and thermal conductivity of =60 W/m.K and =80 W/m.K. With a comprehensive portfolio of metal ceramic substrates, Heraeus Electronics addresses the diverse needs of the Power Electronics segment, ranging from low-power applications up to the most demanding industries. The Condura portfolio consists of Condura.classic (DCB-Al2O3), Condura.extra (DCB-ZTA), Condura.prime (AMB-Si3N4), and the all new Condura.ultra (Si3N4 Ag free AMB). Heraeus Electronics' metal ceramic substrates are recommended for power electronic modules (e.g., current drivetrain inverters) using MOSFETs or IGBT semiconductor devices and diodes for widespread applications in the fields of automotive, electric motor drives, UPS, power supplies, industrial automation and testing.18.05.2022 15:30:00Maynews_2022-06-01_19.jpg\images\news_2022-06-01_19.jpghttps://www.heraeus.com/en/het/home_electronics/home_electronics.htmlheraeus.com
Low-voltage Regulator for Energy-conscious ApplicationsSTMicroelectronics' LD56020 200mA low-dropout volt...9848Product ReleaseLow-voltage Regulator for Energy-conscious ApplicationsSTMicroelectronics' LD56020 200mA low-dropout voltage regulator operates with a supply from 1.1V to 5.5V and has low output noise for applications that demand excellent stability and long battery runtime. Ideal for mobiles, vision sensors, and wireless modules, the LD56020 has low dropout voltage of just 190mV (max. at full load) and maximum quiescent current of 25µA at light load. An external enable pin permits control logic to put the regulator into standby mode, which reduces current below 0.1µA. With supply-voltage rejection (SVRIN) of 90dB (1kHz, 20mA) and output noise of just 8.8µVRMS (10Hz to 100kHz), the LD56020 provides a clean power rail for low-voltage digital circuitry. The circuit is stabilized with only one small ceramic capacitor at each of the input and output terminals. In addition to minimizing the bill of materials, the low overall component count combines with the regulator's tiny chip-scale package (CSP) outline of 0.65mm x 0.65mm to ensure a compact circuit footprint with low impact on PCB size. The regulator integrates protection features including short-circuit current foldback and under-voltage lockout to prevent excessive dissipation in the event of a system fault. There is also over-temperature protection and an internal discharge path.17.05.2022 13:30:00Maynews_2022-06-01_17.jpg\images\news_2022-06-01_17.jpghttps://newsroom.st.com/media-center/press-item.html/n4447.htmlst.com
Jointly Targeting Net-zero Emissions for Chip Manufacturingimec announced that its Sustainable Semiconductor ...9839Industry NewsJointly Targeting Net-zero Emissions for Chip Manufacturingimec announced that its Sustainable Semiconductor Technologies and Systems (SSTS) research program succeeded in bringing together stakeholders of the semiconductor value chain, from large system companies such as Apple and Microsoft, to suppliers, including ASM, ASML, KURITA, SCREEN and Tokyo Electron. The program was set up last year as part of imec's sustainability efforts to support the semiconductor industry reducing its carbon footprint. The addition of these new partners enables a holistic approach, which leverages imec's expertise and knowledge to cut the industry's environmental impact. The semiconductor industry is booming with a never-seen demand. As integral parts of our smart portable devices, IoT systems and compute infrastructure, chips are embedded in our everyday life. Semiconductor manufacturing, however, comes at a price. It requires large amounts of energy and water and creates hazardous waste. To tackle this problem, the entire supply chain needs to commit, and an ecosystem approach will be key. While system and fabless companies are already investing in decarbonizing their supply chain and products, committing to be carbon neutral by 2030 or 2040, they typically lack accurate insight into the contribution of chip manufacturing of future technologies as there is limited life cycle analysis data available.17.05.2022 13:00:00Maynews_2022-06-01_8.jpg\images\news_2022-06-01_8.jpghttps://www.imec-int.com/en/press/imec-unites-partners-semiconductor-value-chain-jointly-target-net-zero-emissions-chipimec-int.com
Dual-output DC/DC Converter for Electric VehiclesGreen Watt Power announces the EVD125 Series of du...9869Product ReleaseDual-output DC/DC Converter for Electric VehiclesGreen Watt Power announces the EVD125 Series of dual-output ruggedized DC/DC converters for Electric Vehicle applications. The fully encapsulated, EVD200 has a very wide input range from 36Vdc to 100Vdc with output voltages of 12Vdc and 5Vdc to power auxiliary EV functions such as lights, instruments, accessories, etc., or to act as a distribution voltage for subsystems. With a combined output current of 12A (peak) the EVD 125 is protected by Over Voltage Protection, Short Circuit Protection, and Over Temperature Protection. The IP65 rated product provides protection against water intrusion and offers a very cost-effective solution for low-power requirements with an optional enable function and are ROHS compliant. Efficiencies for the EVD125 run as high as 89.5% and the unit features a metal baseplate for excellent heat transfer to a metal mounting surface. The working ambient temperature range of the EVD125 is -20 to +400C. The case size is only 89.5x69x38.9mm with a weight of less than 200g.17.05.2022 11:30:00Maynews_2022-06-15_18.jpg\images\news_2022-06-15_18.jpghttps://greenwattpower.com/press-releases/125-watt-dual-output-dc-dc-converter-for-electric-vehicles/greenwattpower.com
Boosting Power Semiconductor Production CapacityRenesas Electronics announced that it will conduct...9834Industry NewsBoosting Power Semiconductor Production CapacityRenesas Electronics announced that it will conduct a 90-billion-yen worth investment in its Kofu Factory, located in Kai City, Yamanashi Prefecture, Japan. While the Factory was closed in October 2014, Renesas intends to reopen the fab in 2024 as a 300-mm wafer fab capable of manufacturing power semiconductors. The Kofu Factory of Renesas Semiconductor Manufacturing Co., Ltd., a wholly-owned subsidiary of Renesas, previously operated both 150mm and 200mm wafer fabrication lines. To boost its production capacity, Renesas decided to utilize a remaining building of the factory and revive it as a 300mm wafer fab dedicated to power semiconductors. "Sustainability is at our heart and with 'To Make Our Lives Easier' as our Purpose, we want to build a sustainable future where our semiconductor technology and solutions help make our lives easier," said Hidetoshi Shibata, President and CEO of Renesas. "This investment enables us to have our largest wafer fabrication line dedicated to power semiconductors, which are key to realizing decarbonization. We will continue to conduct necessary investments to enhance our in-house production capability while further strengthening ties with outsource partners. To address the mid to longer term demand growth, Renesas remains committed to ensuring security of supply in order to provide our customers with the best possible support."17.05.2022 08:00:00Maynews_2022-06-01_3.jpg\images\news_2022-06-01_3.jpghttps://www.renesas.com/eu/en/about/press-room/renesas-invest-and-restart-operation-kofu-factory-300mm-wafer-fab-dedicated-power-semiconductorsrenesas.com
Trusted Silicon Photonics VerificationSiemens Digital Industries Software announced that...9833Industry NewsTrusted Silicon Photonics VerificationSiemens Digital Industries Software announced that its Calibre nmPlatform now enables designers to leverage the GlobalFoundries (GF) silicon photonics platform. GF's monolithic platform, GF Fotonix  combines its differentiated 300mm photonics and RF-CMOS features on a silicon wafer. The GF Fotonix process design kits (PDKs) include Siemens' Calibre nmDRC software for design rule checking (DRC) and Calibre nmLVS software for layout vs. schematic (LVS) verification. Both Calibre tools are fully certified by GF, so mutual customers designing for the new GF Fotonix platform can continue to use the trusted Calibre nmPlatform for silicon photonic devices as they have used for previous offerings. Silicon photonics enables companies to bring fiber optics directly into integrated circuits. However, silicon photonic devices contain curved layouts, rather than the linear Manhattan grid features found in traditional CMOS designs. Applying traditional CMOS DRC to silicon photonic layouts yields numerous false positive errors that design teams must often spend weeks tracking down. To address this challenge, GF leverages Siemens' Calibre eqDRC software, which allows rule checks to use equations in place of, or in addition to, linear measurements. This helps enable more accurate results, leading to significantly fewer errors, so design teams can spend far less time and fewer resources debugging their designs. 17.05.2022 07:00:00Maynews_2022-06-01_2.jpg\images\news_2022-06-01_2.jpghttps://www.plm.automation.siemens.com/global/de/our-story/newsroom/siemens-globalfoundries-calibre-fotonix/107639siemens.com
DC-DC Converter Design for More Electric AircraftGAIA Converter in collaboration with Universidad P...9859Industry NewsDC-DC Converter Design for More Electric AircraftGAIA Converter in collaboration with Universidad Politecnica de Madrid has developed an optimal DC-DC converter design for More Electric Aircraft (MEA) with over 96% efficiency. The design meets stringent MEA specifications while providing a wide input voltage and output power range, high power-density and narrow frequency variations. DC-DC converters are critical to the ongoing transition toward More Electric Aircraft (MEA). The replacement of hydraulic and pneumatic systems with electric solutions requires Size, Weight and Power (SWaP)-optimized converters that also ensure high levels of isolation. GAIA Converter's R&D team worked closely with Universidad Politecnica de Madrid to develop and implement a new automated design tool, based on an optimization algorithm. The team was able to meet stringent MEA specifications, including mechanical dimensions, thermal conditions, and EMI standards, while taking design optimization to the next level. The project led to the creation of an optimized high-frequency (1MHz) resonant LLC converter prototype. The converter has an input voltage range from 220 V to 320 V and delivers 1.5KW output power at 28V output voltage. This converter achieves an efficiency over 96% at full power with a power-density of 32 kW/dm3, (half-brick package) and a narrow frequency variation range (15%).16.05.2022 13:00:00Maynews_2022-06-15_8.png\images\news_2022-06-15_8.pnghttps://gaia-converter.com/gaia-converter.com
High Voltage Circuit Breaker with Arc Interruption MethodPFIFFNER Group has announced a high voltage air-in...9843Product ReleaseHigh Voltage Circuit Breaker with Arc Interruption MethodPFIFFNER Group has announced a high voltage air-insulated switchgear (AIS) circuit breaker for substations which uses an SF6-free and F-gas free as its insulation media for the safe and sustainable operation of electrical grids. The circuit breaker will complement the company's portfolio of high voltage solutions while helping customers to reduce their carbon footprint in a cost-effective way. Sulfur hexafluoride, commonly known as SF6, is a man-made gas utilized primarily as an electrical insulator and arc suppressant. While extremely effective in circuit breaker applications, it is also one of the most harmful greenhouse gases in existence. As such, component manufacturers in the electrical grid sector have been seeking solutions in recent years to limit its usage. PFIFFNER's solution instead uses an eco-compatible gas that eliminates the use of SF6 and F-gases entirely. Circuit breakers are one of the most critical components in an AIS switchyard. Reliability is crucial, as the product has to work under all conditions, and may spend many years or decades at a time dormant before being required to spring into action. When closed, the circuit breaker must behave like an ideal conductor with no resistance, and when open it must be a perfect insulator, conducting nothing. When the contacts separate upon activation, the interrupter must move instantly to extinguish any arcing and prevent damage to downstream line components. When activated this process will typically occur within 20 to 30 milliseconds, involving the high-speed movement of mechanical masses up to 20-30 kg. 16.05.2022 08:30:00Maynews_2022-06-01_12.jpg\images\news_2022-06-01_12.jpghttps://www.pfiffner-group.com/pfiffner-group-to-launch-high-voltage-circuit-breakerpfiffner-group.com
High Power Density Gaming Laptop Power SupplyGaN Systems and Phihong Technology (Phihong) annou...9851Product ReleaseHigh Power Density Gaming Laptop Power SupplyGaN Systems and Phihong Technology (Phihong) announced the debut of Phihong's 280W GaN gaming power supply in a compact size of 160 x 69 x 25 mm case and a 700g lightweight design. At 16W/in3 power density, Phihong's 280W GaN charger breaks through design limits and challenges long held in the industry. The 280W GaN charger is highly efficient, with a 95% full load conversion efficiency and < 0.2W no-load standby loss. This charger brings R&D and innovation to the power supply industry and laptop gaming market, merging Phihong's power solutions design and development expertise and GaN Systems' leading GaN power semiconductors. Phihong's 280W GaN gaming power supply combines a high-efficiency topology structure, zero voltage and zero current soft switching technology, digital control, and features GaN Systems' power semiconductors. The GaN Systems power semiconductors enable power supply manufacturers to deliver smaller, lighter weight, cost-effective, reliable solutions. The advantages of GaN allow more efficient and unrivaled power density to power supplies while providing the higher power and faster charging times that are important to consumers today. "In this very mobile world, users want thin, sleek mobile devices and seek the same requirements for the chargers that go along with them. With GaN, gone are the days of the "brick" power supply," said Jim Witham, CEO of GaN Systems, "It's great to see Phihong design in GaN Systems in their AC adapters to achieve the small size and high power demanded by laptop users."11.05.2022 16:30:00Maynews_2022-06-01_20.jpg\images\news_2022-06-01_20.jpghttps://gansystems.com/newsroom/highest-power-density-gaming-laptop-power-supply/gansystems.com
Low Voltage Buck Converter Targets High Power Density Automotive DesignsDiodes Incorporated has introduced the automotive-...9873Product ReleaseLow Voltage Buck Converter Targets High Power Density Automotive DesignsDiodes Incorporated has introduced the automotive-compliant DIODES AP61300Q and DIODES AP61302Q synchronous buck converters. These 3A-rated devices have a wide input voltage range of 2.4V to 5.5V, and address the need for automotive point-of-loads (POLs) that are more streamlined and exhibit increased efficiency levels. They are optimized for use in vehicles' telematics, ADAS, power and infotainment systems, as well as instrumentation clusters. Incorporated into each of these buck converters is a 70mO high-side power MOSFET and a 50mO low-side power MOSFET which together deliver high-efficiency step-down DC-DC conversion. With fast switching speeds supported, much smaller accompanying passives can be specified, thereby reducing the overall bill-of-materials (BOM) and saving space. Depending on the load conditions, the AP61300Q and AP61302Q can be configured to pulse frequency modulation (PFM) or pulse width modulation (PWM) operating modes (using the enable pin). Their quiescent current (IQ) of 19µA, when in PFM mode, allows them to maintain elevated efficiencies even in light load situations. Furthermore, their low drop-out (LDO) mode permits output voltage regulation to be maintained when the input voltage comes close to the VOUT voltage. Due to the constant on-time (COT) control functionality that the AP61300Q and AP61302Q both feature, rapid transient response, easy loop stabilization, and low output voltage ripple are all attained, with only minimal external components needed. As a result, much less PCB area needs to be allocated and overall production costs are reduced.11.05.2022 15:30:00Maynews_2022-06-15_22.jpg\images\news_2022-06-15_22.jpghttps://www.diodes.com/about/news/press-releases/high-efficiency-low-voltage-3a-buck-converter-from-diodes-incorporated-targets-high-power-density-automotive-designs/diodes.com
SiC FETs for 800V ArchitecturesQorvo announced a series of 1200V Silicon Carbide ...9826Product ReleaseSiC FETs for 800V ArchitecturesQorvo announced a series of 1200V Silicon Carbide (SiC) Field Effect Transistors (FETs). The UF4C/SC series of 1200V Gen 4 SiC FETs are ideally suited for mainstream 800V bus architectures in onboard chargers for electric vehicles, industrial battery chargers, industrial power supplies, DC/DC solar inverters, as well as welding machines, uninterruptible power supplies, and induction heating applications. Anup Bhalla, Chief Engineer – Power Devices, UnitedSiC/Qorvo, said: "Expanding our 1200V range with higher performance Gen4 options allows us to better serve the engineers who are moving their bus designs to 800V. In electric vehicles, this move to higher voltages is inevitable and these new devices, with four different RDS(on) classes, help designers select the best possible SiC choice for every design." All RDS(on) options (23, 30, 53 and 70 milliohm) are offered in the industry standard 4-lead kelvin source TO-247 package, providing cleaner switching at higher performance levels. The 53 and 70 milliohm devices are also available in the TO-247 3-lead package. This series of parts have excellent reliability, based on the well-managed thermal performance, which is a result of an advanced silver-sinter die attach and advanced wafer-thinning process. All 1200V SiC FETs are included in FET-Jet Calculator, a free online design tool that allows for instant evaluation of efficiency, component losses, and junction temperature rise of devices used in a wide variety of AC/DC and isolated/non-isolated DC/DC converter topologies. Single and paralleled devices may be compared under user-specified heat-sinking conditions to enable optimum solutions.11.05.2022 14:30:00Maynews_2022-05-15_21.jpg\images\news_2022-05-15_21.jpghttps://unitedsic.com/news/unitedsic-now-qorvo-announces-1200v-gen-4-sic-fets-with-industry-best-figures-of-merit/unitedsic.com
Clip-bonded FlatPower Packaged DiodesNexperia announced the release of 14 rectifiers fo...9825Product ReleaseClip-bonded FlatPower Packaged DiodesNexperia announced the release of 14 rectifiers for power applications in its CFP2-HP (Clip-Bonded FlatPower) packaging. Available in standard and AEC-Q101 versions, these include 45 V, 60 V and 100 V Trench Schottky rectifiers (with 1 and 2 A options) including the PMEG100T20ELXD-Q, a 100 V, 2 A Trench Schottky barrier rectifier. For applications requiring hyperfast recovery Nexperia has also added the 200 V, 1 A PNE20010EXD-Q rectifier to the portfolio. The vertical thermal design on multilayer PCBs enables designers to save up to 75% of board space with CFP2-HP compared to using a device in a SMA package, while still maintaining the same level of electrical performance. This rugged package design enables longer operating times and better board level reliability, while the new lead shape improves automatic optical inspection (AOI). "With the switch to smaller packages like CFP being now well underway, Nexperia is aiming to be the driving force that further accelerates this transition" according to Frank Matschullat, Product Group Manager Power Bipolar Discretes at Nexperia. "Nexperia has invested heavily to expand its capacity to serve the growing demand for CFP-packaged products stays well ahead of market projections for the next three years. These diodes are the latest additions to over 240 CFP-packaged products which Nexperia currently offers." Today, CFP packaging is used by different power diode technologies such as Nexperia's Schottky, silicon germanium and recovery rectifiers but can also be extended to bipolar transistors. It offers significant product diversity, covering single/dual configuration and currents between 1-20 A, simplifying board design.11.05.2022 13:30:00Maynews_2022-05-15_20.png\images\news_2022-05-15_20.pnghttps://www.nexperia.com/products/diodes/nexperia.com
65 W Active Clamp Flyback Reference Design with 30 W/in3 Power DensityInnoscience and Silanna Semiconductor demo'd a 65 ...9823Product Release65 W Active Clamp Flyback Reference Design with 30 W/in3 Power DensityInnoscience and Silanna Semiconductor demo'd a 65 W Active Clamp Flyback (AFC) reference design with 30 W/in3 uncased power density. The design achieves efficiency levels of greater than 94% @ 230 Vac and has a no-load power consumption of less than 25 mW. The design combines the performance of Innoscience's INN650D240A 650V GaN-on-silicon enhancement-mode power transistor with Silanna's SZ1131 Fully Integrated Active Clamp Flyback (ACF) controller. The GaN HEMT enables ultra-high switching frequency, has no reverse-recovery charge and low gate charge and low output charge. RDS(on),max is 240 m?. Silanna's CO2 Smart Power SZ1131 combines high integration and operational efficiency (95%) with no-load power consumption of under 20mW. The 65 W reference design on a PCBA measuring just 34 x 34.5 x30.5mm. It has an input voltage range of 90-265 VAC and offers USB-PD output voltages and current configurations of 5 V/3 A, 9 V/3 A, 15 V/3 A and 20 V/3.25 A. Innoscience and Silanna Semiconductor are also collaborating on higher power multi-port reference designs and will introduce them to the market soon. SZ1131, the latest addition to Silanna's family of CO2 Smart Power technologies, addresses the power management challenge facing engineers by simplifying design and improving performance while meeting environmental sustainability goals through more efficient energy use.11.05.2022 11:30:00Maynews_2022-05-15_18.jpg\images\news_2022-05-15_18.jpghttp://innoscience.com/innoscience.com
Battery Experts Forum's Conference Programm FinalizedThe Battery Experts Forum is pleased to announce t...9837Event NewsBattery Experts Forum's Conference Programm FinalizedThe Battery Experts Forum is pleased to announce the release of its three-day conference program from July 12 - 14, 2022 (Frankfurt am Main/Exhibition Center). The Battery Experts Forum will feature high-profile speakers from key players in the battery industry and will address the current challenges facing the industry. Including speakers like Shmuel De-Leon, a globally networking battery expert from Israel, and Sven Bauer, a world-renowned pioneer in lithium-ion battery manufacturing who already believed in the great potential of electrification in the 1990s, the organizers of the world's largest battery trade fair, the Battery Experts Forum, can present a top-class league of speakers at their conference for the 17th time. Inspiring impulses, by keynotes, tutorials and technical presentations, are granted by topics such as fast charging, battery management systems, battery safety, recycling, standardization, procurement security and the world market situation. Experts from key players and consultants in the battery industry, such as Honda R&D Co. Ltd, Roland Berger, Williams Advanced Engineering, McKinsey & Company Inc, Farasis Energy Europe GmbH, Freyr, Exyte Management GmbH and Robert Bosch GmbH, as well as from institutes such as ZSW Ulm, RWTH Aachen, KIT Karlsruhe, Fraunhofer and the European Commission - Joint Research Centre, have been engaged for the presentations.11.05.2022 11:00:00Maynews_2022-06-01_6.jpg\images\news_2022-06-01_6.jpghttps://www.battery-experts-forum.com/index.php/en/program-en/battery-conference-programbattery-experts-forum.com
SiC Power Device with Industry Standard Package Dual DeviceMitsubishi Electric US launched a Silicon Carbide ...9844Product ReleaseSiC Power Device with Industry Standard Package Dual DeviceMitsubishi Electric US launched a Silicon Carbide (SiC) power module FMF400DY-24B. The 400A, 1200V Dual SiC MOSFET module includes an anti-parallel, low Vf, zero recovery loss, SiC SBD (Schottky Barrier Diode). The module packages new designs into a current industry standard footprint (62mm x 108mm) for medical power supplies and general industrial applications. Designed for Vgs(on)=15V, the module is compatible with standard IGBT gate drivers and can be seamlessly incorporated into existing mechanical layouts for easy upgrades from Si IGBT technologies. The module uses Mitsubishi Electric second generation SiC MOSFET chip technologies that are ideal for applications requiring high switching frequencies. The SiC module reduces power loss by approximately 70% compared with an equivalently rated Si IGBT. "This new module is in a classic package footprint, with the latest technology inside for superior function and flexibility," said Adam Falcsik, senior product manager of Mitsubishi Electric US's Power Device group. "The FMF400DY-24B adds to Mitsubishi Electric's growing lineup of SiC products." In addition to higher efficiency, the module is compliant with the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS) directive 2011/65/EU and (EU) 2015/863 to meet critical environmental regulations. The module furthers Mitsubishi Electric's core technology vision by contributing to a smarter and more sustainable society.11.05.2022 09:30:00Maynews_2022-06-01_13.jpg\images\news_2022-06-01_13.jpghttps://meus-semiconductors.com/news-events/mitsubishi-electric-expands-silicon-carbide-power-device-lineup-with-industry-standard-package-dual-devicemeus-semiconductors.com
100 V, 2 mΩ GaN FET for Space-constrained ApplicationsEfficient Power Conversion Corporation expands the...9830Product Release100 V, 2 m&#8486; GaN FET for Space-constrained ApplicationsEfficient Power Conversion Corporation expands the selection of low voltage, off-the-shelf gallium nitride transistors with the introduction of the EPC2071 (1.7 m&#8486; typical, 100 V) GaN FET. The EPC2071 is ideal for applications with demanding requirements for high power density performance including 48 V – 54 V input DC-DC for new servers and artificial intelligence. Lower gate charges, QGD, and zero reverse recovery losses enable high-frequency operations of 1 MHz and beyond and high efficiency in a tiny 10.2 mm2 footprint for state-of-the-art power density. The EPC2071 is ideal for BLDC motor drives, including e-bikes, e-scooter, robots, drones, and power tools. The EPC2071 is 1/3rd the size of a silicon MOSFET with the same RDS(on), QG is 1/4th that of the MOSFET, and the dead time can be reduced from 500 ns to 20 ns to optimize motor plus inverter efficiency and reduce acoustic noise. The EPC2071 is footprint compatible with EPC's prior Generation 4 family of products: EPC2021, EPC2022, EPC2206. The Generation 5 improvement in Area x RDS(on) gives the EPC2071 the same on-resistance as the prior generation with a 26% smaller size. "The EPC2071 makes the ideal switch for the primary side of the LLC DC-DC converter from 40 V – 60 V to 12 V- 5V. This 100-volt device offers improved performance and cost compared with previous-generation 100 V GaN FETs allowing designers to economically improve efficiency and power density", according to Alex Lidow, EPC's co-founder and CEO. "These parts are also suitable for telecom and server power supplies, and solar applications."10.05.2022 18:30:00Maynews_2022-05-15_25.jpg\images\news_2022-05-15_25.jpghttps://epc-co.com/epc/EventsandNews/News/ArtMID/1627/ArticleID/3056/The-Smallest-100-V-2-m%e2%84%a6-GaN-FET-in-the-World-is-Now-Shipping-from-Efficient-Power-Conversion.aspxepc-co.com
Memorandum of Understanding to Cooperate in the Field of SiC Power Module TechnologySiemens Mobility and Mitsubishi Electric Europe B....9817Industry NewsMemorandum of Understanding to Cooperate in the Field of SiC Power Module TechnologySiemens Mobility and Mitsubishi Electric Europe B.V. have signed a Memorandum of Understanding (MoU) to cooperate in the field of SiC power module technology with the aim of enabling efficient and sustainable transportation and electrical energy savings in the transportation sector. With creation of the "European Green Deal", the EU has committed itself to being the first continent to achieve climate neutrality by 2050, meaning no net emissions of greenhouse gases by 2050. At an intermediate stage, emissions are already to be reduced by 55 % by 2030 compared with 1990. The European Green Deal will result in binding directives for individual sectors regarding CO2 emissions. Mitsubishi Electric's SiC devices have proven long-term reliability in the most demanding of applications such as traction inverters in trains. The potential for energy savings through the use of Mitsubishi Electric's wide range of SiC power devices in railway technology exists particularly in the area of traction drives. In particular the full SiC 3300 V power modules contribute to energy saving and the downsizing of traction inverters. Siemens has always been a pioneer in the construction of electrically powered trains. Their 140 years of experience forms the basis for the new Mireo Plus regional train platform, which enables operators to run their operations efficiently and economically without local CO2 emissions. Using the innovative technology of the battery powered Mireo Plus, Siemens Mobility enables electrification of railway lines even without a continuous overhead contact line.10.05.2022 17:00:00Maynews_2022-05-15_12.jpg\images\news_2022-05-15_12.jpghttps://www.mitsubishichips.eu/wp-content/uploads/2022/05/Joint-Press-Release_Siemens-Mobility_Mitsubishi-Electric-Europe_2022-1.pdfmitsubishichips.eu
IGBT/SiC Module Driver Family Targets Bus, Truck and Con-Ag EVsPower Integrations announced the SCALETM EV family...9828Product ReleaseIGBT/SiC Module Driver Family Targets Bus, Truck and Con-Ag EVsPower Integrations announced the SCALETM EV family of gate-driver boards for Infineon EconoDUALTM modules. Suitable for original, clone and new SiC variants, the driver targets high-power automotive and traction inverters for EV, hybrid and fuel-cell vehicles including buses and trucks as well as construction, mining and agricultural equipment. SCALE EV board-level gate drivers incorporate two reinforced gate-drive channels, associated power supplies and monitoring telemetry. The boards are automotive-qualified and ASIL B certified, enabling implementation of ASIL C traction inverter designs. The first SCALE EV family member to be released is the 2SP0215F2Q0C, designed for the EconoDUAL 900 A 1200-volt IGBT half-bridge module. The high level of integration provided by innovative driver ICs enables the entire driver board, including gate power, to fit onto the outline of the power module, while still providing the spacing necessary for reinforced isolation according to the IEC 60664 standard. The ASIC package provides 11.4 mm of creepage and clearance, specifically designed to meet the requirements for 800-volt vehicle system voltages. Input and output lines to the system microcontroller are connected via two independent on-board connectors to meet functional safety requirements. A single 5 V supply per channel is required, with other isolated voltages being generated on the board itself. The SCALE EV gate-driver family is rated at 1200 V for 400-volt and 800-volt systems and supports both silicon carbide (SiC) MOSFETs and silicon IGBTs.10.05.2022 16:30:00Maynews_2022-05-15_23.jpg\images\news_2022-05-15_23.jpghttps://investors.power.com/news/news-details/2022/Power-Integrations-Launches-SCALE-EV-Automotive-Qualified-IGBTSiC-Module-Driver-Family-Targets-Bus-Truck-and-Con-Ag-EVs/default.aspxpower.com
TOLL-packaged 650 V Silicon Carbide MOSFETonsemi announced a TO-Leadless (TOLL) packaged sil...9827Product ReleaseTOLL-packaged 650 V Silicon Carbide MOSFETonsemi announced a TO-Leadless (TOLL) packaged sillicon carbide (SiC) MOSFET. The transistor addresses the rapidly growing need for high-performance switching devices that are suitable for designs with high levels of power density. Until recently, SiC devices had been supplied in D2PAK 7-lead packages which required significantly more space. With a footprint of just 9.90 mm x 11.68 mm, the TOLL package offers 30% savings in PCB area over a D2PAK package. And at a profile of just 2.30 mm, it occupies 60% less volume than a D2PAK package. In addition to its smaller size, the TOLL package offers better thermal performance and lower package inductance (2 nH) than a D2PAK 7-lead. Its Kelvin source configuration ensures lower gate noise and lower switching losses – including a 60% reduction in turn-on loss (EON) when compared to a device without a Kelvin configuration, ensuring significant improvements in efficiency and power density in challenging power designs as well as improved EMI and easier PCB design. The first SiC MOSFET to be offered in the TOLL package is the NTBL045N065SC1 which is intended for demanding applications including switch-mode power supplies (SMPS), server and telecommunication power supplies, solar inverters, uninterruptible power supplies (UPS) and energy storage. The device is suitable for designs that are required to meet the most challenging efficiency standards including ErP and 80 PLUS Titanium. The NTBL045N065SC1 has a VDSS rating of 650 V with a typical RDS(on) of just 33 m? and a maximum drain current (ID) of 73 A. Based upon wide bandgap (WBG) SiC technology, the device has a maximum operating temperature of 175°C and ultra-low gate charge (QG(tot) = 105 nC) that significantly reduces switching losses.10.05.2022 15:30:00Maynews_2022-05-15_22.jpg\images\news_2022-05-15_22.jpghttps://www.onsemi.com/products/discrete-power-modules/silicon-carbide-sic/silicon-carbide-sic-mosfets/ntbl045n065sc1onsemi.com
Device Analyzer / Double-Pulse Tester for Discrete Devices and Power ModulesKeysight Technologies announced the PD1550A Advanc...9849Product ReleaseDevice Analyzer / Double-Pulse Tester for Discrete Devices and Power ModulesKeysight Technologies announced the PD1550A Advanced Dynamic Power Device Analyzer, a Double-Pulse Tester (DPT) with enhanced capabilities that enable customers to test entire power modules fast and easy. Power modules are used in various applications such as electric vehicles (EV), solar power inverters, trains, home appliances and aircraft due to ease of design, high energy density and reliability. New, wide-bandgap (WBG) device-based power modules are now used by designers to take advantage of the device's fast-switching operation, reducing the size of the power electronic module, and ensuring efficiency. However, WBG power modules also introduce test challenges that require new solutions to properly characterize these devices while eliminating failed prototypes and reducing design cycles. Introduced in 2019, Keysight's PD1500A Power Device Dynamic Analyzer / Double-Pulse Tester was the first complete solution for discrete WBG power device characterization and is now used by power converter designers and power semiconductor manufacturers around the world. Now, the new PD1550A expands beyond the PD1500A's capabilities to offer the first complete integrated solution that tests entire power modules (up to 1360 V, up to 1000 A). As a result, automotive original equipment manufacturers (OEMs), Tier 1 suppliers and power converter designers can test faster and gain more insights into power module characteristics, enhancing the safety and reliability of power circuits for automotive applications.10.05.2022 14:30:00Maynews_2022-06-01_18.png\images\news_2022-06-01_18.pnghttps://www.keysight.com/de/de/about/newsroom/news-releases/2022/0510-nr22063-keysight-technologies-delivers-next-generation-powe.htmlkeysight.com
Solid-state Relays Can Help Make EVs SaferTexas Instruments introduced a portfolio of solid-...9847Product ReleaseSolid-state Relays Can Help Make EVs SaferTexas Instruments introduced a portfolio of solid-state relays, including automotive-qualified isolated drivers and switches, that deliver reliability to help make electric vehicles (EVs) safer. The isolated solid-state relays also provide small solution size while reducing the bill-of-materials (BOM) cost of powertrain and 800-V battery-management systems. The TPSI3050-Q1 isolated switch driver with an integrated 10-V gate supply and the TPSI2140-Q1 1,400-V, 50-mA isolated switch both integrate power and signal isolation across a single barrier using a unique approach that improves reliability, while significantly reducing solution size and cost compared to existing electromechanical relays and solid-state photorelays. The devices are the first in a new solid-state relays portfolio that will also include ICs designed for high-voltage industrial applications. The solid-state relays can disconnect and connect loads through a single isolation barrier in microseconds – compared to milliseconds for electromechanical relays – to enable safer operation of high-voltage automotive systems. The TPSI3050-Q1, which offers reinforced isolation up to 5 kVRMS, also provides an operating lifetime that's 10 times higher than electromechanical relays, which can degrade over time. Additionally, the TPSI2140-Q1 offers basic isolation up to 3.75 kVRMS, enabling it to achieve more than four times higher time-dependent dielectric breakdown reliability than solid-state photorelays.10.05.2022 12:30:00Maynews_2022-06-01_16.jpg\images\news_2022-06-01_16.jpghttps://news.ti.com/ti-drives-isolation-technology-forward-with-new-solid-state-relays-that-provide-industry-leading-reliabilityti.com
8-inch GaN-on-Si Device Maker now Represented by Semiconductor DistributorInnoscience Technology has signed a global distrib...9838Industry News8-inch GaN-on-Si Device Maker now Represented by Semiconductor DistributorInnoscience Technology has signed a global distribution agreement with WPG Holdings (WPG), giving customers in all parts of the world access to Innoscience's high and low voltage normally-off (enhancement mode) GaN HEMTs. Dr Denis Marcon, General Manager, Innoscience Europe comments: "Our aim is to ensure that every power electronics designer – no matter where they are based – can benefit from the efficiency, power and size advantages that GaN technology brings. That is why we have invested in huge capacity. Distribution is also a big part of our plans, and we are excited and honoured to announce WPG as our first global supply chain partner." Adds Nigel Watts, VP, WPG EMEA: "GaN is set for explosive growth as all markets – consumer, communications, automotive, industrial – experience the leap forward in end-product performance they can achieve by switching from traditional silicon-based power devices to GaN. Innoscience is the world's largest 8-inch GaN-on-Si device manufacturer with a capacity of 10,000 8-inch wafers per month (WPM) – which is set to grow to 70,000 WPM by 2025. Therefore it is fitting that Innoscience have signed a global franchise deal with WPG. Product is available NOW and lead-times are far better than the traditional Silicon alternatives. Design now and manufacture sooner."10.05.2022 12:00:00Maynews_2022-06-01_7.jpg\images\news_2022-06-01_7.jpghttps://www.innoscience.com/site/details/388?el=mdnavinnoscience.com
High Isolation 6W DC/DC ConvertersCOSEL announced the addition of a series of high i...9846Product ReleaseHigh Isolation 6W DC/DC ConvertersCOSEL announced the addition of a series of high isolation 6W DC/DC converters for medical, industrial and ICT applications. Packaged in a Single In Line (SIP) type 8, the COSEL MH6 series has a reinforce isolation of 3kVAC, 4.2kVDC, complies with medical isolation standard (2MOOP (250VAC working voltage)) and ruggedized for industrial applications that might implies differential IN/OUT voltage. Three input voltages (4.5V-18V ; 9V – 36V and 18V -76V) and a large variety of single (MHFS6) and dual output (MHFW6) cover a large range of applications. Designed for performances, the MH6 has only 20pF max insulation capacitance reducing noise transfer. For medical applications, the MH6 series complies with the 2xMOOP (250VAC) (Means Of Operator Protection) isolation requirement, as specified in the IEC60601-1 3rd edition standard. To reduce inventory but as well making their equipment easy to install and maintain, system's designers require DC/DC converter able to accept a large range of input voltages. The COSEL MH6 series is available in three wide-input range voltage: 4.5V to 18V covering 12V battery applications, 9V to 36V combining 12V and 24V battery systems and 18V to 76V addressing 24V and 48V systems.10.05.2022 11:30:00Maynews_2022-06-01_15.jpg\images\news_2022-06-01_15.jpghttps://www.coseleurope.eu/news-item-1473-mhfs-mhfw-series-expands-with-addition-ofcoseleurope.eu
Isolated DC and AC Current Measurement up to 200ArmsDanisense is launching its DT series of fluxgate t...9821Product ReleaseIsolated DC and AC Current Measurement up to 200ArmsDanisense is launching its DT series of fluxgate technology current transducers for isolated DC and AC current measurement up to 200Arms. Benefiting from a considerable reduced size with 60% less volume compared with the previous product generation, the devices feature a large frequency bandwidth of up to 2MHz and a primary current of ranging from 50A up to 200A. DT series current transducers use Danisense's Fluxgate, closed loop compensated technology with fixed excitation frequency and second harmonic zero flux detection for best in class accuracy and stability. Excellent linearity (better than 2 ppm), an industry standard DSUB 9-pin connection, a green diode for normal operation indication and a large aperture with a diameter of 20.7mm for cables and bus bars are further features of the components. DT series current transducers are Ideal for applications such as high precision power supplies for laboratories, accelerators and medical equipment where size is a key factor as designs for such power supplies are getting smaller and smaller to increase power density and reduce costs. Size is also very important for the embedded power measurement application for cars where placing the transducers in a compact motor and inverters environment is always a challenge. The large frequency bandwidth of the DT series is another advantage for such power measurement applications.10.05.2022 09:30:00Maynews_2022-05-15_16.png\images\news_2022-05-15_16.pnghttps://danisense.com/danisense.com
Platform for Developing GaN-Based Zero Voltage Switching ChargersEggtronic and Navitas have announced a QuarEgg eva...9819Product ReleasePlatform for Developing GaN-Based Zero Voltage Switching ChargersEggtronic and Navitas have announced a QuarEgg evaluation board that will speed the development and implementation of fast-chargers and power adapters. QuarEgg is an proprietary Zero Voltage Switching power architecture that has been designed to improve the efficiency and reduce the size of AC/DC converters. The architecture maximizes the performance, minimizes the form factor and improves the reliability of AC/DC power schemes in applications ranging from USB-C Power Delivery fast chargers and adapters for mobile devices and laptops to power supplies for loudspeakers and smart home assistants. The 35W AC/DC evaluation board brings together the QuarEgg ZVS architecture integrated in an Eggtronic EPIC101AFQE01 secondary side mixed-signal controller embedding USB Power Delivery 3.1, Synchronous Rectification, no-opto control of primary side FET, and Navitas' GaN technology. Compared to conventional silicon-based designs built using active clamp flyback (ACF) or quasi-resonant (QR) topologies, this combination offers improved AC/DC conversion performance and efficiency and much smaller product form factors. In addition, when compared to the silicon counterpart based on the same QuarEgg controller, GaN offers a further 8% energy savings. The AC/DC development board measures just 38.3 x 38.3 x 18.55 mm and incorporates all of the components needed for a USB-PD or fixed-output converter Peak efficiency is in excess of 94.1%, while a very flat efficiency curve ensures maximum efficiency and minimum power losses across the widest possible range of loads. This includes a 91% efficiency when in light load conditions (10% of maximum load), which is fundamental for devices that are always plugged in and draining power from the mains.10.05.2022 07:30:00Maynews_2022-05-15_14.jpg\images\news_2022-05-15_14.jpghttps://www.eggtronic.com/safe_v2/wp-content/uploads/2022/05/Eggtronic_Navitas_35w.pdfeggtronic.com
2 kV Silicon Carbide MOSFETs for 1500 VDC ApplicationsInfineon Technologies introduced its expanded Cool...9818Product Release2 kV Silicon Carbide MOSFETs for 1500 VDC ApplicationsInfineon Technologies introduced its expanded CoolSiC portfolio with high-voltage solutions to provide the foundation for next-generation photovoltaic, EV charging and energy storage systems. The extended CoolSiC portfolio offers 2 kV silicon carbide (SiC) MOSFETs, along with a 2kV SiC diode for applications up to 1500 V DC. The SiC MOSFET combines both low-switching losses and high-blocking voltage in one device that can optimally meet the requirements of 1500 V DC systems. The 2 kV CoolSiC technology offers a low drain-source on resistance (R DS(on)) value. In addition, the rugged body diode is suitable for hard switching. The technology enables sufficient overvoltage margin and offers ten times lower FIT rate caused by cosmic ray, compared to 1700 V SiC MOSFETs. Furthermore, the extended gate voltage operating range makes the devices easy to use. This SiC MOSFET chip is based on Infineon's SiC MOSFET technology named M1H which has recently been introduced. The latest advancements enable a significantly larger gate voltage window that improves the on-resistance for a given die size. Simultaneously, the larger gate voltage window provides a high robustness against driver- and layout-related voltage peaks at the gate, without any restrictions even at high switching frequencies. Infineon offers a range of EiceDRIVER gate drivers with functional isolation of up to 2.3 kV to support the 2 kV SiC MOSFETs.10.05.2022 06:30:00Maynews_2022-05-15_13.jpg\images\news_2022-05-15_13.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2022/INFIPC202205-079.htmlinfineon.com
Cooperation on Silicon-carbide Technology for Electric-vehicle DrivesSTMicroelectronics has revealed it is supplying si...9832Industry NewsCooperation on Silicon-carbide Technology for Electric-vehicle DrivesSTMicroelectronics has revealed it is supplying silicon carbide (SiC) technology for the eMPack electric-vehicle (EV) power modules from Semikron. This is the result of a four-year technical collaboration between the two companies to design-in ST's advanced SiC power semiconductors for efficiency and performance in more compact systems. SiC is quickly becoming the automotive industry's preferred power technology for EV traction drives, contributing to greater driving range and reliability. Semikron recently announced it had secured a billion-Euro contract to supply their innovative eMPack power modules to a major German car maker, beginning in 2025. "ST's SiC device-manufacturing capabilities and in-depth expertise with the technology enabled us to integrate these semiconductors with our advanced manufacturing processes, which enhance reliability, power density, and scalability to meet the needs of the automotive industry," said Karl-Heinz Gaubatz, Semikron Chief Executive Officer (CEO) and Chief Technical Officer (CTO). "As we now move towards volume-production, our collaboration with ST brings the assurance of a robust supply chain that gives control over quality and delivery performance." "Leveraging our SiC technology, Semikron's advanced scalable eMPack family of power modules is ready to make a major contribution towards zero-emission motoring," said Edoardo Merli, Power Transistor Sub-Group General Manager and Executive Vice President of STMicroelectronics. "In addition to its transformative effect in e-mobility, our SiC technology, now in its third generation, is driving increased efficiency, performance, and reliability in sustainable energy and industrial power-control applications."10.05.2022 06:00:00Maynews_2022-06-01_1.jpg\images\news_2022-06-01_1.jpghttps://newsroom.st.com/media-center/press-item.html/t4444.htmlst.com
Solutions for Motion Control, Renewable and Power Supply ApplicationsVincotech returned to the PCIM with a showcase of ...9870Product ReleaseSolutions for Motion Control, Renewable and Power Supply ApplicationsVincotech returned to the PCIM with a showcase of solutions, like the company's latest technologies and innovations, such as VINcoPress. "We have a host of highlights to show customers and prospects. Solutions in Power Factor Correction topologies, VINcoPress techology and the new flow E3 housings benefit the industry in so many ways," said Edoardo Guiotto, VP Sales and Marketing. New Current Synthesizing PFC (CSPFC) topology provides highest efficiency at lowest total system costs through reduced number of SiC devices, and reduced number and size of the PFC inductors. It is an attractive candidate for three-phase PFC applications, where a balanced load is a given, such as motion control, EV-charging, renewable energy and UPS systems for data centers. VINcoPress is a direct-pressed substrate technology engineered for superior thermal performance. It distributes pressure and Rth uniformly, increases modules' power capability and power density, and provides a rugged, reliable heat sink assembly. New housings are here to enhance Vincotech's line of baseplate-less, 12-mm, low-inductive power modules. Bringing the benefits of industry-standard flow E housings to the higher power range, the new flow E3 modules enable engineers to boost legacy designs' power with just minor mechanical adjustments. Both flow S3 and flow E3 lines now also feature VINcoPress alongside Vincotech's pre-applied phase-change thermal interface material (PC-TIM), advanced die-attach technology and an optional AlN DCB.09.05.2022 12:30:00Maynews_2022-06-15_19.jpg\images\news_2022-06-15_19.jpghttps://www.vincotech.net/pcim/vincotech.com
Low Insertion Impedance Method of Measuring Alternating CurrentsPEM's CWT 'HF' family of Rogowski current probes m...9822Product ReleaseLow Insertion Impedance Method of Measuring Alternating CurrentsPEM's CWT 'HF' family of Rogowski current probes meet the challenges of measuring current in renewable and power electronic applications with attenuate interference from fast local voltage transients and retain a small size. They also feature optimised high frequency (HF) performance to measure rapidly changing AC currents. The CWTMini50HF is available with a coil size of just 100mm, 3.5mm thick with a rise-time capability of 12.5ns, ideal for the challenging environment of converters utilising power SiC semiconductor switches. At the other end of the scale, the CWTHF with coils from 300mm to 1000mm, or even longer, enable measurement in applications as diverse as high frequency bearing current in machine shafts, lightning strikes and pulsed power applications and power measurement in large motor drives. 09.05.2022 10:30:00Maynews_2022-05-15_17.jpg\images\news_2022-05-15_17.jpghttp://www.pemuk.com/pemuk.com
PLECS Conference 2022The PLECS Conference on "Real-Time Simulation of P...9816Event NewsPLECS Conference 2022The PLECS Conference on "Real-Time Simulation of Power Electronics" will take place in Zurich, Switzerland on Tuesday and Wednesday, September 20 and 21. The PLECS Conference offers participants from industry and academia the opportunity to exchange ideas with other PLECS and RT Box users. Practical use cases will be presented by a wide range of companies and universities, including ABB, Bosch, Daimler, Huawei, Schindler, EPFL, ETH, Hochschule Darmstadt and Hochschule München. In addition to the presentations, the PLECS Conference will provide opportunities to network during meals and breaks. Tabletop exhibits by the presenting groups will demonstrate their work and applications. For more information and to register, visit https://plexim.com/events/seminars/210106.05.2022 16:00:00Maynews_2022-05-15_11.jpg\images\news_2022-05-15_11.jpghttps://plexim.com/events/seminars/2101plexim.com
Three Billion Motor Driver Integrated Circuits ShippedAllegro MicroSystems announced that it has shipped...9810Industry NewsThree Billion Motor Driver Integrated Circuits ShippedAllegro MicroSystems announced that it has shipped its three billionth motor driver integrated circuit (IC), underpinning the strength of its motion control business. The company's motor drivers have helped customers around the world innovate safer, more robust motor-drive solutions with increased reliability. They can be found across automotive, industrial, and consumer applications in products ranging from electric vehicles to data center servers to cordless power tools. "We add value by helping our customers improve time to market and reduce development cycles; we win when they win, and that motivates us to continue developing new motor driver products," says Steve Lutz, Business Line Director for Motors (Automotive) at Allegro. "We continue to innovate with new products that reduce energy consumption, improve battery life, and minimize carbon footprints." The Allegro team has increased investments in motor driver R&D in recent years, yielding further advancements in its deep portfolio of embedded motion control IP. Introduced in 2019, the company's QuietMotionTM motor drivers include first-to-market field-oriented control (FOC) brushless DC (BLDC) electric motor controllers that are customer code-free. These devices are designed to provide reliable and efficient low-audible-noise performance while reducing design cycle times via simple parameter settings, which users can access using intuitive graphical user interfaces. "Many of our customers-especially ones in emerging growth markets-lack software development resources specifically for motor drivers, and often rely on freelancers and contractor programmers," says Andy Wang, Product Line Director for Motors (Industrial) at Allegro. "We're helping those customers significantly reduce development overhead by embedding code directly into the IC, which helps them get to market faster."04.05.2022 10:00:00Maynews_2022-05-15_5.jpg\images\news_2022-05-15_5.jpghttps://www.allegromicro.com/en/about-allegro/news-room/2022/three-billion-motor-drivers-prallegromicro.com
Active Heat Sink for Power Semiconductor CoolingDeveloping engineers are faced with a challenge wh...9841Product ReleaseActive Heat Sink for Power Semiconductor CoolingDeveloping engineers are faced with a challenge when it comes to the choice of a suitable cooling concept for power electronics. This is in particular the case with flat housings where corresponding know-how is required. Thought should be given to this issue already during the concept phase as it may prove difficult to solve this problem if there is very little space for dissipating heat. SEPA EUROPE has developed a smart solution for such requirements, namely the HZ210 - an in-house development that is available in different dimensions. SEPA EUROPE has developed the active heat sink HZ210 using the powerful LY60B radial fan. The case study achieved an impressively low thermal resistance of 0.5K/W during laboratory testing. With an overall height of a mere 25 mm this opens up new possibilities for developers to enable the cooling of power components in flat housings. In the event that a temperature increase of 40K is allowed, 80W power loss can be reliably dissipated. The cooling system comprising SEPA blower, extruded heat sink and cover plate keeps the noise at a comfortably low level. The microphone recorded no more than 34dB(A) in the anechoic chamber. The fan is available in 5V and 12V versions and has a service life of 210000 h (MTBF) at 40°C thanks to its reliable MagFix© sleeve bearing.04.05.2022 06:30:00Maynews_2022-06-01_10.jpg\images\news_2022-06-01_10.jpghttps://www.sepa-europe.com/en/chip-cooler/sepa-europe.com
Drive Module for HVAC MotorsQuantum Power Transformation (QPT) announced the l...9831Product ReleaseDrive Module for HVAC MotorsQuantum Power Transformation (QPT) announced the launch of its qGaNDrive Module to unleash the full performance potential of Gallium Nitride (GaN) power transistors in motor drives for HVAC heating, ventilation, and air conditioning systems. Commenting on the news, QPT Founder Rob Gwynne said, "GaN transistors have always promised the best performance and efficiency over Silicon MOSFETs and Silicon Carbide, but they are notoriously difficult to drive at speed. We have developed an entirely new and unique topology for driving GaN transistors allowing them to switch at speeds of up to 20MHz, delivering major benefits in power consumption and efficiency." Business Development Manager Richard Ord went on to add: "Electric motor driven systems (EMDS) consume 45% of the world's energy, and yet their efficiency at typical operating speeds can be as low as 50%. Our solution tackles performance across the range of operating speeds and could improve efficiency by up to 35%." The challenge of driving Gallium Nitride transistors has so far restricted broader adoption and compromised performance: QPT's solution fixes that problem and will accelerate GaN market share. The qGaNDrive Module from QPT integrates their core topology with GaN transistors in a fully EMC-screened turn-key power module. The company estimates that a typical 15kW domestic heat pump could deliver a return in energy savings in one hundred days or less.03.05.2022 19:30:00Maynews_2022-05-15_26.png\images\news_2022-05-15_26.pnghttps://www.q-p-t.com/news/qgandrive-boosts-hvac-motor-drive-efficiency-with-100-day-pay-backq-p-t.com
Material Solutions for e-MobilityIndium Corporation is announcing a line of materia...9829Product ReleaseMaterial Solutions for e-MobilityIndium Corporation is announcing a line of material solutions for e-Mobility. The Rel-ion suite of electrical, mechanical, and thermal solutions are designed to be reliable, scalable, and proven materials, reducing electric vehicle (EV) manufacturers' time to market. "We at Indium Corporation have created a suite of products under the Rel-ion banner that must meet three very important criteria," said Brian O'Leary, global head of e-Mobility and infrastructure. "First-they're reliable. They are designed to meet the higher quality standards that meet the higher demands of automotive electrification. Second-they're scalable. They are readily available and capable of meeting supply chain expectations. Finally-they're proven. Most of Indium Corporation's Rel-ion products have more than a decade of running inside of EVs. Our customers have confidence that the product will work, confidence that they can get enough of it to meet demand, and the peace of mind that comes with using proven material solutions." Indium Corporation has also expanded its free InSIDER Series of webinars to include the "Driving e-Mobility: Rel-ion Technical Webinars". This series features global industry technical experts in advanced materials and the automotive market with all sessions moderated by O'Leary. This series of webinars is intended specifically for those involved in the field of e-Mobility, whether new to the industry or with several years of experience as the EV industry undergoes rapid growth and evolution.03.05.2022 17:30:00Maynews_2022-05-15_24.jpg\images\news_2022-05-15_24.jpghttps://www.indium.com/corporate/media-center/news/indium-corporation-launches-relion-technology-for-e-mobility/indium.com
Enhancing Its Digital Training Offerings Through AcquisitionRohde & Schwarz announces that it has acquired UK-...9809Industry NewsEnhancing Its Digital Training Offerings Through AcquisitionRohde & Schwarz announces that it has acquired UK-based 'The Technology Academy', provider of online training courses in the fields of RF, wireless and microwave engineering technology. The Technology Academy is an ideal partner to expand the existing training offerings of Rohde & Schwarz and will play a significant role in increasing the company's future professional services. The Rohde & Schwarz Technology Academy combines the expertise and industry insights of the trusted T&M manufacturer – currently providing live and virtual trainings from their in-house training center as well as on-site trainings for existing customers – with the web training expertise of The Technology Academy. A holistic portfolio of on-demand courses is available 24/7 to technology professionals with different experience levels. They will have easy, immediate access to a range of certified trainings, which offer in-depth expert knowledge and industry insights. Content is delivered in a practical and application-oriented way, with a focus on clear explanations. Certificates are available for completed courses. The main objective of the training offerings is to support technical staff in managing new challenges as well as staying up-to-date with the latest technologies. The web-based training format also allows both flexible and scalable learning paths. This combination of high-quality training with insights from industry experts and simple access makes it easy for companies to find the right training options for staff while simultaneously addressing time and budget constraints.03.05.2022 09:00:00Maynews_2022-05-15_4.jpg\images\news_2022-05-15_4.jpghttps://www.rohde-schwarz.com/about/news-press/all-news/rohde-schwarz-enhances-its-digital-training-offerings-through-acquisition-of-the-technology-academy-press-release-detailpage_229356-1211840.html?change_c=truerohde-schwarz.com
Integrated Current Sensor with Sigma Delta Bitstream OutputLEM announced the launch of HMSR DA, an Integrated...9820Product ReleaseIntegrated Current Sensor with Sigma Delta Bitstream OutputLEM announced the launch of HMSR DA, an Integrated Current Sensor to offer a Sigma Delta bitstream output which provides significant benefits when used in applications that are prone to noise, distortion and interference. It has been designed to provide a solution to industries requiring clean signals and facing significant problems in case of vibrations, electric noise and electromagnetic noise, for example. Specific advantages of an Integrated Current Sensor with digital output include superior signal share and reduced noise as well as lower cost and a smaller mechanical footprint. HMSR DA will replace much more complex and costly alternative systems that would traditionally include a shunt resistor, a digital insulator and a power supply circuit. Having all these features incorporated into a single unit makes the HMSR DA a far more attractive option for applications where space is at a premium and minimal cost is essential. Typical applications for the digital output unit include standalone servo drives, robotics, sewing machines, automated guided vehicles (AGVs), CNC machine tools and a range of other applications that demand high resolution output. The HMSR DA sensor, which offers resolution of 11 to 13 bits and features a 10MHz clock, is LEM's first step toward building a digital Integrated Current Sensor roadmap. The company is already working on the next generation of digital Integrated Circuit Sensors which will offer a resolution of 14 to 16 bits and a clock operating above 20MHz.03.05.2022 08:30:00Maynews_2022-05-15_15.jpg\images\news_2022-05-15_15.jpghttps://www.lem.com/en/hmsr-serieslem.com
Air Velocity Sensor for Space-constrained ApplicationsFlusso's FLS122 air velocity sensor has been speci...9842Product ReleaseAir Velocity Sensor for Space-constrained ApplicationsFlusso's FLS122 air velocity sensor has been specifically developed to enable board-mounted air velocity measurements for thermal management and filter monitoring in some of the most space-constrained and challenging environments. It has a footprint of just 3.5 by 3.5 mm and will help the company to further extend its flow sensing offer, to address even more applications within high-volume industrial, medical and consumer markets. Target applications include data centres and gaming PCs that rely on efficient air cooling to maximise performance and energy-efficiency, and consumer appliances such as HVAC, air purifiers and vacuum cleaners. The FLS122 has been designed to support bidirectional flow sensing and to provide real-time temperature and air speed measurement of up to 20 metres per second. The sensor has been designed for easy and low-cost integration, and uses a CMOS MEMS die derived from the one used within Flusso's FLS110 mass flow sensor. FLS122 uses the same novel integration concept as the FLS110 that allows manufacturers to decide how and where to integrate it, and to balance system performance versus cost depending on their requirements. The sensor will be supplied with a full package of support material including an evaluation kit, hardware design guides, sensor firmware and a software development kit, as well as application engineering support.03.05.2022 07:30:00Maynews_2022-06-01_11.jpg\images\news_2022-06-01_11.jpghttps://flussoltd.com/news-and-events/flusso-launches-fls122-air-velocity-sensorflussoltd.com
Andreas Urschitz Appointed as Chief Marketing OfficerAndreas Urschitz, currently President of the Power...9806PeopleAndreas Urschitz Appointed as Chief Marketing OfficerAndreas Urschitz, currently President of the Power & Sensor Systems (PSS) Division, has been appointed as Helmut Gassels successor as Chief Marketing Officer of Infineon. Adam White, currently CMO of the PSS Division, is the designated President of the Division. "As a longtime companion, Helmut Gassel has played a decisive role in Infineon's great success. As CMO, he has driven forward the digitalization of marketing and sales and thus the alignment with the future. I view with great respect the fact that he wants to make a personal change and therefore leave Infineon. I welcome the Supervisory Board's decision in favor of Andreas Urschitz as the future CMO. He has achieved great success as Division President and has demonstrated a keen sense of market developments and our customers' needs," said CEO Jochen Hanebeck. "Together with our customers, Infineon employees are driving the decarbonization and digitalization of everyday life. I am very much looking forward to helping shape the path to a livable future now as part of the Management Board team," said Andreas Urschitz, President of the PSS Division and designated CMO of Infineon. Andreas Urschitz has been President of the Power & Sensor Systems (PSS) Division since 2012, which serves the market with a wide range of power semiconductor, radio frequency and sensor technologies. Prior to the role as head of the PSS Division, Mr. Urschitz held various management positions in production, marketing, development and sales. He began his career at Infineon (until 1999 Siemens AG) in Villach, Austria, after studying business economics and subsequently teaching at the Vienna University of Economics and Business Administration.02.05.2022 06:00:00Maynews_2022-05-15_1.jpg\images\news_2022-05-15_1.jpghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2022/INFXX202205-074.htmlinfineon.com
Positive Outlook for the SPS 2022With almost 700 exhibitors registered by the early...9814Event NewsPositive Outlook for the SPS 2022With almost 700 exhibitors registered by the early booking deadline, the booking figures for the SPS 2022 are extremely positive. This is testament to the high level of interest in attending the exhibition for electric automation technology, which will take place in Nuremberg from 08 - 10 November 2022. In addition to the three-day event in Nuremberg, this year's automation exhibition concept also includes an online component. "The in-person event will certainly be the main focus of the SPS 2022. However, the last two years have shown the value of digital offerings both in the run-up and follow-up to an exhibition: to give a general overview of the industry, for initial discussions, for arranging appointments on site, sharing knowledge, or even finding out about current industry topics," summarizes Martin Roschkowski, President of Mesago Messe Frankfurt. The organizer thus wants to leverage the advantages of both the real and digital worlds to offer participants the best possible exhibition experience. It also means that those who may not be able or allowed to travel also have an opportunity to connect and interact with the SPS community online.28.04.2022 14:00:00Aprnews_2022-05-15_9.jfif\images\news_2022-05-15_9.jfifhttps://sps.mesago.com/nuernberg/en/press/press-releases/sps-press-releases/update.htmlsps.mesago.com
Power Module Suitable for 48 V Industrial Voltage NetworkWürth Elektronik extends its MagI³C-FDSM power mod...9824Product ReleasePower Module Suitable for 48 V Industrial Voltage NetworkWürth Elektronik extends its MagI³C-FDSM power module product range: The fixed step-down regulator modules now cover all bus voltages from 12 V up to 48 V. The modules facilitate development for applications with direct connection to bus voltages of 12 V, 24 V or 48 V. The wide input voltage range up to 74.5 V makes the FDSM module robust against voltage transients on the 48 V bus. The new power modules are implemented in a cost-effective SIP-3 package and provide fixed output voltages of 3.3 V, 5.0 V as well as 12 V, with an output current up to 0.5 A. The MagI³C-FDSM series are fully integrated DC/DC voltage converters with fixed output voltage. Besides the power stage, the modules consist of a regulator, inductor as well as input and output capacitors. The power modules are protected against short circuit and thermal overload. MagI³C-FDSM reduces the workload involved in circuit design to a minimum, as no external components are required for operation-this reduces development costs and time. For simple assembly, the MagI³C-FDSM family has been realized in a standard THT housing. Pre-compliance testing of our evaluation board has shown the conducted and radiated EMI is below limits established by relevant standards.28.04.2022 12:30:00Aprnews_2022-05-15_19.jpg\images\news_2022-05-15_19.jpghttps://www.we-online.com/web/en/wuerth_elektronik/news_weg/News_Detail_WE_Gruppe_133951.phpwe-online.com
Automotive Power Inductors SeriesTAIYO YUDEN has announced the launch of the AEC-Q2...9845Product ReleaseAutomotive Power Inductors SeriesTAIYO YUDEN has announced the launch of the AEC-Q200 (reliability qualification test standard for automotive passive components) qualified wire-wound ferrite power inductors LCXH series, which consists of 64 items in 6 sizes including LCXHF3030QK. These power inductors are designed for use as choke coils or noise filters in power supply circuits for automotive body systems and information systems such as infotainment ECUs. The LCXH series has the same sleeveless structure as the LCXP and LCXN series (former product name: NR series S-type), which have been used in consumer and automotive products markets. The materials technology and structural design have both been further sophisticated, and the electrodes are structured such that improved flatness can be achieved when mounted and automated optical inspection (AOI) can be carried out during manufacturing processes. Production of the products commenced at the overseas subsidiary company, TAIYO YUDEN (PHILIPPINES, Lapulapu City, Cebu, the Philippines), from March 2022.28.04.2022 10:30:00Aprnews_2022-06-01_14.jpg\images\news_2022-06-01_14.jpghttps://www.yuden.co.jp/cms/wp-content/uploads/2022/05/220428TAIYO-YUDEN-Launches-the-Automotive-Power-Inductors-LCXH-Series_eu.pdfyuden.co.jp
Partnership on Developing Power Devices for Power Supply SystemsROHM and Delta Electronics have entered into a str...9808Industry NewsPartnership on Developing Power Devices for Power Supply SystemsROHM and Delta Electronics have entered into a strategic partnership to develop and mass produce next-generation GaN (gallium nitride) power devices. Combining Delta's power supply device development technology with ROHM's power development and manufacturing expertise will make it possible to develop 600V breakdown voltage GaN power devices optimized for a wide range of power supply systems. ROHM has already established a mass production system for 150V GaN HEMTs featuring an 8V gate withstand voltage in March 2022. This will allow ROHM to expand its lineup of EcoGaNTM for power circuits in IoT communication and industrial equipment (i.e. base stations, data centers) while further improving device performance. Kazuhide Ino, Managing Executive Officer, CSO, ROHM: "ROHM is extremely pleased to enter into a strategic partnership for GaN power devices with Delta. As power semiconductors – a key area of focus for ROHM – play an increasingly important role in achieving a decarbonized society, ROHM will continue to develop advanced devices in a range of fields utilizing Si, SiC, and GaN, along with solutions that combine peripheral components such as control ICs that maximize their performance. Through this partnership, ROHM will mass produce GaN power devices that can contribute to the configuration of more efficient power supply systems as well as develop GaN IPMs that integrate analog ICs (one of ROHM's strengths) at an early stage, further expanding our lineup of easy-to-use products."28.04.2022 08:00:00Aprnews_2022-05-15_3.jpg\images\news_2022-05-15_3.jpghttps://www.rohm.com/news-detail?news-title=2022-04-28_news_ecogan&defaultGroupId=falserohm.com
Battery Management ICs Enable Optimized Battery LifetimeInfineon Technologies introduces a family of batte...9803Product ReleaseBattery Management ICs Enable Optimized Battery LifetimeInfineon Technologies introduces a family of battery management ICs, including TLE9012DQU and TLE9015DQU. The ICs enable an optimized solution for battery cell monitoring and balancing. Combining measurement performance with robustness, the battery management ICs are a competitive system-level solution for battery modules, cell-to-pack and cell-to-car battery topologies. The devices are suitable for a wide range of industrial, consumer and automotive applications such as mild hybrid electric vehicles (MHEV), hybrid electric vehicles (HEV), plug-in hybrid electric vehicles (PHEV) and battery-powered electric vehicles (BEV). Additional applications include energy storage systems and battery management systems for electric two- and three-wheelers. "With the TLE9012DQU and TLE9015DQU, Infineon achieves an important milestone and completes its battery management system offering", says Finn Felsberg, Senior Vice President and General Manager Automotive Power Integration and Supply at Infineon. "Customers benefit from the interoperability of Infineon's components as well as from the broad software offering. As a result, development efforts can be minimized and time to market can be reduced." The battery management ICs can be used in safety relevant applications: the automotive BMS solutions meet safety requirements up to ASIL-D and are ISO26262 compliant. Furthermore, these products are optimized to work together with the AURIX family of microcontrollers and functional safety capable power management ICs thanks to the Complex Device Driver. This provides a full solution for voltage and temperature sensing, as well as balancing and communication across a variety of battery solutions.26.04.2022 15:30:00Aprnews_2022-05-01_20.jpg\images\news_2022-05-01_20.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2022/INFATV202204-072.htmlinfineon.com
Cooperation on Transforming PCB Order ProcessesWürth Elektronik Circuit Board Technology and Lumi...9815Industry NewsCooperation on Transforming PCB Order ProcessesWürth Elektronik Circuit Board Technology and Luminovo are connecting their products to enable their customers to adapt a much simpler, faster and more accurate PCB prototype costing and quoting process. Using the Würth Elektronik API (application programming interface), Würth Elektronik's PCB online shop gets directly connected to LumiQuote, Luminovo's RfQ software. LumiQuote automatically extracts all relevant technical parameters of required PCBs using the modern PCB engine. The technical information is now sent directly to the PCB online shop via the interface and prices as well as delivery times are sent back to the users in real time. "This is a crucial value-add for users, as they can continue their quoting and ordering process without interruptions", explains Thomas Beck, managing director of Würth Elektronik Circuit Board Technology. "At Luminovo, we are rethinking the electronics value chain. The partnership with Würth Elektronik enables us to finally bring PCB procurement into the age of automated and connected processes", states Sebastian Schaal, founder of Luminovo. He adds, "In LumiQuote, our customers not only receive a price directly, but a plausibility check also tells them immediately whether or not the requested specifications are supported by Würth Elektronik". Luminovo is working on a software suite that aims to transform processes within and between the different companies in the electronics value chain in a modern way. In addition to Stackrate, Luminovo's software solution for PCB manufacturers, LumiQuote focuses on connecting, digitising and automating quoting and procurement processes for EMS, including material and manufacturing calculations.26.04.2022 15:00:00Aprnews_2022-05-15_10.png\images\news_2022-05-15_10.pnghttps://www.we-online.com/web/en/leiterplatten/news_leiterplatte/News_Detail_Leiterplatte_133758.phpwe-online.com
Snap-in Aluminum Electrolytic CapacitorCornell Dubilier Electronics announced that it has...9801Product ReleaseSnap-in Aluminum Electrolytic CapacitorCornell Dubilier Electronics announced that it has expanded its signature series of 380LX and 381LX aluminum electrolytic capacitors to include voltages up to 600 Vdc. The ratings are designed to serve the company's industrial electronics customers who continue to push the application boundaries for these components into higher voltages. The 380LX and 381LX snap-in series are among the industry's top performers with a published load life of 3,000 hrs. when tested at rated voltage and ripple current at rated temperature. The 380LX series is designed for 85 °C operation, while the 381LX series meets the same load life at 105 °C. These components demonstrate exceptional life in real-life applications where conditions are typically lower than the capacitor's maximum specified ratings. Newly added capacitance values in the range of 150 µF to 330 µF are offered at 550 and 600 Vdc in the 380 LX series and 140 µF to 340 µF at 500, 550, and 600 Vdc in the 381LX series. Developed at CDE's technology center in Liberty, SC, these new ratings are offered with enhanced ripple current capability, up to 3.7A at full-rated conditions. The company's latest advances in electrolyte development, materials, and processing technology make their higher voltage ratings and excellent performance possible. The company expects these higher voltage snap-in capacitors to be used in the latest inverter circuits for renewable energy, UPS systems, battery chargers, motor drives, welders, and other applications that require the highest performance components to improve system reliability.25.04.2022 13:30:00Aprnews_2022-05-01_18.jpg\images\news_2022-05-01_18.jpghttps://www.cde.com/news/2022/4/380-381lxcde.com
Acquisition of SL Power Expands Addressable MarketAdvanced Energy Industries announced that it compl...9811Industry NewsAcquisition of SL Power Expands Addressable MarketAdvanced Energy Industries announced that it completed the previously announced acquisition of SL Power Electronics Corporation from Steel Partners Holdings L.P. The acquisition adds complementary products to Advanced Energy's medical power offerings and extends its presence in several advanced industrial markets. "The addition of SL Power expands our offerings for industrial and medical applications," said Steve Kelley, president and CEO of Advanced Energy. "I believe SL Power's strong customer base, complementary product portfolio, and highly skilled team make it an ideal fit for Advanced Energy." The acquisition of SL Power Electronics is expected to be accretive to 2022 earnings on a non-GAAP basis and to generate over $4 million of annualized cost synergies. Management intends to provide more detail on the forward-looking benefits of this acquisition when it announces the first quarter financial results.25.04.2022 11:00:00Aprnews_2022-05-15_6.jpg\images\news_2022-05-15_6.jpghttps://ir.advancedenergy.com/news/advanced-energy-completes-the-acquisition-of-sl-power/3e26fee6-b539-46f0-8a0d-27d3e392d09f/advancedenergy.com
New York-based 200mm Silicon Carbide FabWolfspeed opened its Mohawk Valley Silicon Carbide...9807Industry NewsNew York-based 200mm Silicon Carbide FabWolfspeed opened its Mohawk Valley Silicon Carbide fabrication facility in Marcy, N.Y. with a ribbon cutting ceremony with Federal and State Officials. The 200mm wafer fab will help lead the industry-wide transition from silicon to Silicon Carbide-based semiconductors. New York Governor Kathy Hochul was on site to officially welcome Wolfspeed to Mohawk Valley, in addition to Eric Bach, Senior Vice President of Product and Chief Engineer at Lucid Motors. As a key partner, Lucid Motors had the honor of "cutting the ribbon" with its Lucid Air, named the 2022 MotorTrend Car of the Year. Wolfspeed recently announced a multi-year agreement with Lucid to supply Silicon Carbide devices. "We are honored to be joined by these government, community, and industry leaders to celebrate Wolfspeed's Mohawk Valley Fab, New York State's economic competitiveness and American chip manufacturing," said Gregg Lowe, president and CEO of Wolfspeed. "I am incredibly proud of the team, and all of our partners, who brought this monumental fab to life in such a short time. This fab will not only supply customers in 2022 but also support long-term American competitiveness." The automated Mohawk Valley facility is the world's first and largest 200mm Silicon Carbide fab providing uncompromised wafer quality and higher yield. The devices developed in Mohawk Valley will be critical in feeding Wolfspeed's $20B+ pipeline and the global semiconductor industry. More than 600 high-tech Mohawk Valley jobs will be created by 2029.25.04.2022 07:00:00Aprnews_2022-05-15_2.jpg\images\news_2022-05-15_2.jpghttps://www.wolfspeed.com/company/news-events/news/wolfspeed-opens-the-worlds-largest-200mm-silicon-carbide-fab-enabling-highly-anticipated-device-production/wolfspeed.com
The 2022 IEEE VLSI Symposium on Technology & CircuitsNow in its 42nd year of delivering convergence of ...9791Event NewsThe 2022 IEEE VLSI Symposium on Technology & CircuitsNow in its 42nd year of delivering convergence of technology and circuits for the microelectronics industry, the "Symposia on VLSI Technology & Circuits" will be merged into one Symposium to maximize the synergy across both domains. The newly merged 2022 IEEE VLSI Symposium on Technology & Circuits is organized around the theme: "Technology & Circuits for the Critical Infrastructure of the Future." The five-day hybrid event, combining both live sessions onsite at the Hilton Hawaiian Village, as well as on-demand access to selected presentations, is scheduled from June 12 – 17, 2022 in Honolulu, HI. The Symposium will feature advanced VLSI technology developments, innovative circuit design, and the applications they enable, such as artificial intelligence, machine learning, IoT, wearable/implantable biomedical applications, big data, cloud / edge computing, virtual reality (VR) / augmented reality (AR), robotics, and autonomous vehicles. The weeklong Symposium will continue its reputation as the microelectronics industry's premiere international conference integrating technology, circuits, and systems with a range and scope unlike any other conference. In addition to the technical presentations, the Symposium program will feature a demonstration session, evening panel discussions, joint focus sessions, short courses, workshops, and a special forum session that provides a focused discussion on a specific topic relevant to the Symposium theme.22.04.2022 13:00:00Aprnews_2022-05-01_8.jpg\images\news_2022-05-01_8.jpghttps://www.vlsisymposium.org/vlsisymposium.org
Metal Power Inductors for In-Vehicle ApplicationsMurata announces the availability of the DFE32CAH_...9800Product ReleaseMetal Power Inductors for In-Vehicle ApplicationsMurata announces the availability of the DFE32CAH_R0 series of metal power inductors for high-temperature applications of up to 150 °C. Intended for use in DC/DC converters and power management circuitry for automotive applications, these components are supplied in 1210 inch size (3.2 mm × 2.5 mm) metal cores. Covering a wide inductance value range, the components are suitable for in-vehicle applications beyond infotainment systems to the powertrain and advanced driver assistance systems (ADAS). Meeting demands for high currents and the downsizing of system designs, the DFE32CAH_R0 delivers a DC superimposed current rating (Isat) of 8.7 A in the world's best for a 1210 inch size product with an inductance of 0.47 µH. "These new products support large currents by optimizing the internal coil structure design and utilizing original metal materials," explains Tomohiro Yao, General Manager of Marketing & Promotion for the EMI Division at Murata. "Thanks to these technological advances, we have succeeded in delivering a series of small metal power inductors that have a highly reliable design for a more diverse range of automotive applications, including the powertrain and ADAS, that require support for temperatures up to 150 °C and demand large current flows."21.04.2022 12:30:00Aprnews_2022-05-01_17.jpg\images\news_2022-05-01_17.jpghttps://www.murata.com/en-eu/news/inductor/power/2022/0421murata.com
IGBT Module Will Reduce Size and Power Consumption of DC1500V ConvertersMitsubishi Electric Corporation announced that it ...9796Product ReleaseIGBT Module Will Reduce Size and Power Consumption of DC1500V ConvertersMitsubishi Electric Corporation announced that it will begin shipping samples of its LV100-type T-series 2.0kV insulated-gate bipolar transistor (IGBT) Module for industrial use. The power-semiconductor product is expected to downsize and reduce the power consumption of power-conversion equipment for use with renewable-energy sources. Power semiconductors for efficiently converting electric power are being increasingly utilized as key devices that can help to lower the carbon footprint of global society. At the same time, efficient power conversion through the deployment of increasingly higher system-operating voltages is being demanded for power grids that use renewable-energy power sources, which has led to the development of power converters rated at DC1500V, the upper limit of the EU's Low Voltage Directive. Module samples that Mitsubishi Electric will start shipping soon have a blocking-voltage capability of 2.0kV, which is suitable for DC1500V power conversion equipment used mainly for large-capacity systems of several hundred kW to several MW, including renewable-energy power sources. Adopting 2.0kV withstand voltage semiconductors will enable customers to simplify the design of their DC1500V power-conversion equipment. Also, the latest 7th-generation IGBT and Relaxed Field of Cathode (RFC) diode will help to downsize and reduce the power consumption of power-conversion equipment for renewable-energy power supply. In addition, the module's industrial LV100-type package, which is suitable for large-capacity systems due to its easy-paralleling configuration, will help to simplify large-capacity system designs.21.04.2022 08:30:00Aprnews_2022-05-01_13.jpg\images\news_2022-05-01_13.jpghttps://www.mitsubishielectric.com/news/2022/0421.htmlmitsubishielectric.com
AEC Qualified Lidar Integrated CircuitEPC announces the introduction of the EPC2221, a c...9804Product ReleaseAEC Qualified Lidar Integrated CircuitEPC announces the introduction of the EPC2221, a common source dual gallium nitride FET rated at 100 V, 58 mO, and 20 A pulsed current.  The EPC2221 can be used in lidar systems for robots, surveillance systems, drones, autonomous cars, and vacuum cleaners. The low inductance and capacitance of the EPC2221 allows fast switching (100 MHz) and narrow pulse widths (2 ns) for high resolution and high efficiency. Additionally, the ultra-small size of 1.35 mm x 1.35 mm reduces PCB cost and total solution size. The EPC2221 is the latest addition to a growing family of GaN transistors and integrated circuits designed to meet the performance and reliability standards of demanding automotive applications. The EPC2221 has completed rigorous automotive AEC Q101 qualification testing including humidity testing with bias (H3TRB), high temperature reverse bias (HTRB), high temperature gate bias (HTGB), and temperature cycling (TC), as well as several other tests. In addition to lidar in demanding automotive applications, the EPC2221 is perfectly suited for high-frequency DC-DC conversion, wireless power applications, and synchronous rectification. "This AEC certified product is the latest addition to a growing family of EPC gallium nitride-based transistors and integrated circuits designed to enable autonomous driving and improve safety," said Alex Lidow, CEO, and co-founder of EPC. "This integrated circuit improves the performance while reducing size and cost for time-of-flight lidar systems."20.04.2022 16:30:00Aprnews_2022-05-01_21.png\images\news_2022-05-01_21.pnghttps://epc-co.com/epc/EventsandNews/News/ArtMID/1627/ArticleID/3049/New-AEC-Qualified-Lidar-Integrated-Circuit-from-Efficient-Power-Conversion.aspxepc-co.com
PEMD 2022: Power Electronics, Machines and DrivesWe're pleased to be a media partner of PEMD 2022 –...9785Event NewsPEMD 2022: Power Electronics, Machines and DrivesWe're pleased to be a media partner of PEMD 2022 – the IET's Power Electronics, Machines and Drives conference. Bodo's Power readers can register at the IET member rate, saving you up to £200. You can book your ticket at the website: http://ow.ly/tOJE30rOobn20.04.2022 07:00:00Aprnews_2022-05-01_2.jpg\images\news_2022-05-01_2.jpghttps://pemd.theiet.org/?utm_source=cross_promo&utm_medium=web&utm_campaign=pemd&utm_content=bodos_powerpemd.theiet.org
Fast Charging Solutions Using a Dual-Phase Switched-Capacitor ArchitectureHalo Microelectronics announced the release of the...9805Product ReleaseFast Charging Solutions Using a Dual-Phase Switched-Capacitor ArchitectureHalo Microelectronics announced the release of their HL7138 and HL7139, fast charging solution ICs using a dual-phase switched capacitor architecture for single-cell battery applications. The HL7138 and HL7139 offer charging efficiencies, which enable faster and cooler battery charging operations in a small total PCB solution size that allows for more system-level design flexibility. They offer charging efficiencies, which enable faster and cooler battery charging operations in a small total PCB solution size that allows for more system-level design flexibility. The faster-charging solution saves consumers time, and cooler charging means less energy is wasted in the form of heat, which is environmentally friendly. Furthermore, the smaller solution size gives device designers more leeway to choose between thinner and lighter form factors, larger batteries for longer battery life, more features, or lower BOM costs. "As the smartphone market becomes more saturated, product differentiation has become increasingly important to gaining market share. Fast charging is one of the few features that consumers can directly relate to and understand its benefits. Halo Microelectronics has seen switched capacitor-based fast-charging architectures quickly extend from high-end to mid-level smartphones. Therefore, we will continue to develop, innovate, and lead the ecosystem to stay ahead," stated David Nam, CEO of Halo Microelectronics.19.04.2022 17:30:00Aprnews_2022-05-01_22.jfif\images\news_2022-05-01_22.jfifhttps://halomicro.com/halo-microelectronics-introduces-two-new-fast-charging-solutions-using-a-dual-phase-switched-capacitor-architecture-for-single-cell-battery-applications/halomicro.com
Driving the Adoption of Wide Bandgap TechnologiesNavitas Semiconductor has announced its membership...9793Industry NewsDriving the Adoption of Wide Bandgap TechnologiesNavitas Semiconductor has announced its membership of PowerAmerica, the consortium working to accelerate the adoption of next generation GaN and silicon carbide (SiC) power electronics. As a member of PowerAmerica, Navitas will provide input into initiatives to help companies that use power semiconductors to upgrade beyond legacy silicon, and access resources and relationships contributing to business growth. "The upgrade from legacy silicon to WBG semiconductors is critical to supporting environmental goals by dramatically reducing power consumption and accelerating the adoption of sustainable technologies," said Dan Kinzer, Navitas' COO/CTO and co-founder. "The consortium's membership network of entrepreneurs, technologists and academic partners is helping to drive this revolution and we are excited to be part of this increasingly-important eco-system." Navitas Sr Director of Marketing, Llew Vaughan-Edmunds, is currently the chairman of PowerAmerica and will lead the MAC meeting during the PowerAmerica 2022 Summer Workshop on NC State Campus in Raleigh, NC on August 2nd. Navitas will host a technology seminar at the workshop to introduce leading-edge GaNFast power ICs with GaNSense technology, and stress high-quality, high-capacity manufacturing with over 40,000,000 units shipped and zero reported GaN-related field failures.19.04.2022 15:00:00Aprnews_2022-05-01_10.jpg\images\news_2022-05-01_10.jpghttps://navitassemi.com/navitas-and-poweramerica-accelerate-next-gen-semiconductors-to-electrify-our-world/navitassemi.com
2W Medical Grade DC/DC ConverterFor the ever increasing demand for medical home ca...9795Product Release2W Medical Grade DC/DC ConverterFor the ever increasing demand for medical home care and medical equipment P-DUKE has extended its medical power conversion portfolio with a MPL02 board-mount DC/DC converter series. The MPL02 series is designed especially for compact medical applications and comes in a tiny SIP-8 industrial standard package (footprint only 9.9 x 21.8 mm) which saves space on the PCB. It offers 5000Vac isolation voltage, reinforced insulation of 2xMOPP (patient protection) / 250Vac working voltage with 8 mm clearance and creepage distance between input and output. The series delivers up to 2W output power and offers regulated single and dual outputs with a wide 2:1 input range of 4.5-13.2, 9-18 and 18-36V. It provides full-protection functions such as: over-current, short-circuit, under-voltage lockout as well as low 2µA leakage current. These are the main factors which assure a safe environment for operators and patients. The series also comes with a 5-year product warranty. The MPL02 series has been certificated to IEC/EN/ANSI/AAMI ES60601-1, IEC/EN/UL 62368-1 and MIL-STD 810F standards. With its compact casing, low 2µA leakage current and all the safety certifications makes this series the perfect choice for a variety of medical equipment such as; oxygen and heart rate monitors, brainwave monitors and oral caring equipment.19.04.2022 07:30:00Aprnews_2022-05-01_12.png\images\news_2022-05-01_12.pnghttps://www.pduke.com/news_detail.php?type=1&NewsNo=93pduke.com
Global High Service Distributor of the YearMouser Electronics has been named the 2021 Global ...9813Industry NewsGlobal High Service Distributor of the YearMouser Electronics has been named the 2021 Global High Service Distributor by onsemi. This is the third year that Mouser has received this award. onsemi cited Mouser's high service distribution sales growth, market share growth, and high scores on overall process excellence. "The support of our worldwide distribution partners is essential to the success of our company as we continue to increase revenue, profit margins and market penetration," said Jeff Thomson, Senior Vice President of Global Channel Sales for onsemi. "Mouser grew product sales, generated significant new business, and effectively supported customer needs while demonstrating our company initiative of operational excellence. We thank them for their contributions in 2021." "We are honored to receive this recognition from onsemi, one of our valued partners and a leader in the industry," said Kristin Schuetter, Mouser Electronics' Vice President of Supplier Management, Semiconductors. "Mouser works to provide exceptional service to customers as well as our manufacturer partners, and it is gratifying to be acknowledged for our efforts." Mouser offers onsemi's broad portfolio of energy-efficient power management, analog, sensors, logic, timing, connectivity, discrete, system-on-chip (SoC), and custom devices to help customers efficiently solve their design challenges in automotive, communications, computing, consumer, industrial, medical, aerospace, and defense applications.18.04.2022 13:00:00Aprnews_2022-05-15_8.jpg\images\news_2022-05-15_8.jpghttps://eu.mouser.com/newsroom/publicrelations-onsemi-distyaward-2022final/mouser.com
Embedded Control Module for Electric Power Grid Automation   With complex requirements and typically low quanti...9797Product ReleaseEmbedded Control Module for Electric Power Grid Automation   With complex requirements and typically low quantity manufacturing, rack-and-stack approaches have long dominated controls designs for high power electronics. While custom designs might be technically superior, allowing tailored features and compact integration, they often come with prohibitive engineering and manufacturing costs and schedules. Now it is possible to design controls electronics using sophisticated system-on-chip (SOC) and system-in-package (SIP) components to achieve custom results within a manageable design project. The Innova SCM21001 system-on-module (SOM) from Silicon Power Corporation was developed as an embedded computing platform specifically for electric grid automation applications. A dual core DSP SOC and directly connected FPGA are assembled as an independent real time processor subsystem. On the same module, an Octavo Systems embedded Linux computer SIP supports management of the real time processor and provides modern communication protocols for connection to external systems, all using readily available open-source software. The SOM serves as a control system component, allowing tight integration with application specific components such as power, analog sensor conversion, and actuator drives. A conduction cooled form factor supports deeply embedded, high reliability applications. The design was fully functional with the first prototype, so system development proceeded with no controls design delays. As a component or as a reference design, the SOM demonstrates that custom controls design is once again a viable option for power electronics. 18.04.2022 09:30:00Aprnews_2022-05-01_14.jpg\images\news_2022-05-01_14.jpghttps://siliconpower.com/siliconpower.com
Celebrating 25 Years of High-tech from NurembergSiCrystal is celebrating its 25th anniversary. Ove...9787Industry NewsCelebrating 25 Years of High-tech from NurembergSiCrystal is celebrating its 25th anniversary. Over the last two and a half decades, the company – which today employs over 200 people – has expanded its sphere of activity to an international level: a small but important piece of technology made in Franconia can be found in electric vehicles all over the world, for example. After all, it is often the little things that make big things happen. Based at Nordostpark industrial park in the north east of Nuremberg, Germany, the manufacturing company is one of the current global market leaders for single crystalline silicon carbide semiconductor wafers (SiC wafers). "25 years of company history really is something to celebrate," says CEO Robert Eckstein, looking back on the beginnings of SiCrystal. The company has been producing SiC wafers since April 1997. The wafers form the basis for modern electronic components and resemble "a CD without a hole". They are almost as hard as a diamond and very heat resistant. Without these discs – which are less than 1 millimeter thick – electric mobility and the digital world would be unthinkable. Research carried out at the University of Erlangen in the early 1990s laid the foundation for the company and, in 1997, SiCrystal AG was founded. Back then, it all began with the development and sampling of the first SiC wafers in Eschenfelden, Upper Palatinate. The semiconductor manufacturer then moved back to Erlangen in the early 2000s and was taken over by the Japanese ROHM Group – manufacturer of electronic components – in 2009.14.04.2022 09:00:00Aprnews_2022-05-01_4.jpg\images\news_2022-05-01_4.jpghttps://www.rohm.com/news-detail?news-title=2022-04-14_news_sicrystal25&defaultGroupId=falserohm.com
Expanding Its Portfolio of Precision Measurement SolutionsVitrek announces the acquisition of MTI Instrument...9792Industry NewsExpanding Its Portfolio of Precision Measurement SolutionsVitrek announces the acquisition of MTI Instruments, a U.S.-based manufacturer of sophisticated test and measurement equipment. MTI Instruments' precision tools, systems and solutions are utilized in non-contact metrology, position, displacement and vibration applications within the design, QA/QC, manufacturing, production, test and research markets. MTI Instruments' products benefit a variety of industries and applications. For example, commercial aviation companies and the U.S. Military rely on vibration analysis and engine trim balance test solutions to identify any jet engine problems quickly, ensuring safety while saving both time and maintenance costs. Their custom capacitor sensors are designed to measure displacement and gap with non-contact force in applications including lens focusing, Piezo positioning, sheet metal thickness, gap measurement as well as flatness and alignment. "The acquisition of MTI Instruments represents a significant expansion of the range of precision instrumentation products Vitrek offers to our vital industries," said Don Millstein, Vitrek's president. "We welcome MTI Instrument's sales, engineering and manufacturing teams to the Vitrek family - as we continue providing both Vitrek and MTI customers with top level sales , technical support and product innovation." Moshe Binyamin, President and CEO of MTI Instruments, said: "Vitrek is a well-respected test and measurement company with products and a market focus that is perfectly in line with ours. We look forward to combining forces so we can further accelerate our collective growth objectives."13.04.2022 14:00:00Aprnews_2022-05-01_9.jpg\images\news_2022-05-01_9.jpghttps://vitrek.com/press-release-vitrek-acquires-mti-instruments-expanding-its-portfolio-of-precision-measurement-products/vitrek.com
40 Years in the USAIn 1982, Bruno Schurter, grandson of the company's...9790Industry News40 Years in the USAIn 1982, Bruno Schurter, grandson of the company's founder Heinrich Schurter, launched the distribution company SCHURTER Inc in California. He was a mere 30 years old at the time. Bruno Schurter had the chance to live the "American Dream", as he himself says today. He was in the right place at the right time. Silicon Valley, the southern part of the San Francisco Bay Area, was in full bloom. In the 1960s and 1970s, the first high-tech companies settled in the immediate neighborhood of Stanford University. Primarily test and measurement equipment as well as computer technology. Computers large and small fascinated Bruno. During his brief engagement with Wersen, the latter handed him an Apple II and told him to somehow put the thing into operation and see if anything could be done with it. Schurter knuckled down, got the "thing" working and calculating. The world was about to be computerized. And Bruno was right at the epicenter. Read the full success story at https://www.schurter.com/en/Info-Center/News/Timeline/40-years-of-SCHURTER-in-the-USA.13.04.2022 12:00:00Aprnews_2022-05-01_7.jpg\images\news_2022-05-01_7.jpghttps://www.schurter.com/en/Info-Center/News/Timeline/40-years-of-SCHURTER-in-the-USAschurter.com
Integrating Renewables and Stabilizing the GridWith more intermittent renewable energy generation...9788Industry NewsIntegrating Renewables and Stabilizing the GridWith more intermittent renewable energy generation on the world's power networks, and fossil fuel supplies experiencing major disruptions, distributed power reserves are becoming increasingly important to maintain grid stability and keep the power on 24/7. To support this transition, ABB is launching PowerExchanger, an innovative feature for its UPS products, which allows battery reserves to provide ancillary services to the grid, reducing costly downtime and cutting energy and operating costs. UPS equipment is used to provide back-up power in the case of a grid supply failure, and it can also eliminate brownouts, over-voltages, and electrical noise. The UPS' back-up power is drawn from its energy storage capacity, which often goes unused. With PowerExchanger fitted to new or existing ABB UPS systems, these batteries can be used to help the grid respond quickly to unexpected imbalances between power generation and demand, to reduce costly outages. By using PowerExchanger to join markets for grid ancillary services, for example Fast Frequency Response (FFR), operators can now generate a new revenue stream, which lowers the cost of operating this capital-intensive equipment. Ideal for Low and Medium Voltage data centers, PowerExchanger ensures a minimum energy reserve is retained by the UPS battery, so in the event of a complete grid outage, the critical load will always be protected. PowerExchanger can also deliver additional financial and performance benefits, thanks to peak shaving. When peak-time energy comes at a premium, PowerExchanger enables on-site UPS energy reserves to cover consumption peaks and keep costs low.13.04.2022 10:00:00Aprnews_2022-05-01_5.jpg\images\news_2022-05-01_5.jpghttps://new.abb.com/news/detail/89857/powerexchanger-integrates-renewables-and-stabilizes-the-grid-to-keep-the-power-on-247abb.com
Measurement System for GaN and SiC Semiconductor AnalysisTeledyne LeCroy announced the launch of their DL-I...9799Product ReleaseMeasurement System for GaN and SiC Semiconductor AnalysisTeledyne LeCroy announced the launch of their DL-ISO High Voltage Optically Isolated 1 GHz Probe and Power-Device test software, which when combined with their High Definition Oscilloscopes (HDO) offer accurate electrical characterization of gallium nitride (GaN) and silicon carbide (SiC) power semiconductor devices. The DL-ISO High Voltage Optically Isolated Probe provides design engineers with the highest-confidence GaN and SiC power semiconductor device measurements. The probe has the best signal fidelity, lowest overshoot and best accuracy - 1.5% when combined with Teledyne LeCroy's 12-bit resolution HDOs. The 1 GHz bandwidth meets requirements to measure GaN device 1 ns rise times. HDOs also provide up to 20 GS/s sample rate at 12-bit resolution for the most faithful capture and display of high-speed GaN and SiC device signals. This combination of best signal fidelity, low overshoot, high accuracy, high bandwidth and high sample rate is critically important for successfully implementing GaN and SiC technologies in new designs. Teledyne LeCroy's Power-Device software package additionally simplifies the analysis of GaN and SiC devices with automated JEDEC switching loss and other measurements, and color-coded overlays to highlight the relevant, measured areas.12.04.2022 11:30:00Aprnews_2022-05-01_16.png\images\news_2022-05-01_16.pnghttps://teledynelecroy.com/pressreleases/document.aspx?news_id=2153&capid=107&mid=554teledynelecroy.com
Expanding Backend Operations in IndonesiaInfineon Technologies expands its existing backend...9786Industry NewsExpanding Backend Operations in IndonesiaInfineon Technologies expands its existing backend operations in Indonesia: PT Infineon Technologies Batam to purchase real estate from PT Unisem, a member of Unisem Group. The premises close to Infineon's existing backend manufacturing site include manufacturing buildings that will double Infineon's production area in Batam when fully operational. In the course of this expansion, Infineon's Batam site will increase its focus on the assembly and test of automotive products. "Infineon is making another step in strengthening its global operations network. We are committed to investing into continued structural growth and to strengthen the resilience of our supply chain," said Alexander Gorski, Executive Vice President and responsible for Infineon's global Backend Operations. Dr. Thomas Kaufmann, Executive Vice President and COO of Infineon's Automotive Division, said: "In view of increasing demand for automotive semiconductors and to the benefit of our customers, this purchase is allowing us to add backend capacities faster than with the greenfield construction of a new site". Production is expected to start in 2024. The expansion in Batam is part of Infineon's long-term investment strategy, which foresees investments of approximately €2.4 billion for the 2022 fiscal year. PT Infineon Technologies Batam is a backend manufacturing site and employs over 2,000 employees. It is located within the Batamindo Industrial Park and part of the Indonesia-Singapore-Malaysia growth triangle.12.04.2022 08:00:00Aprnews_2022-05-01_3.jpg\images\news_2022-05-01_3.jpghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2022/INFXX202204-068.htmlinfineon.com
Global Magnetics PowerhouseKAMIC Magnetics Group will present its magnetics p...9784Industry NewsGlobal Magnetics PowerhouseKAMIC Magnetics Group will present its magnetics portfolio at PCIM, and for the first time brings its three specialist magnetics components businesses, ETAL, SIGA Electronics and Talema together on one stand (6-349). This follows the Group's acquisition of Talema to ETAL in 2021. Each business in the KAMIC Group Magnetics business unit has its own strength, and together they form a global magnetics powerhouse with 1,100 employees, manufacturing in five countries and direct representation in the world's most significant economies. The Group is offering customers a comprehensive portfolio which supports them in designing exceptional, efficient power architectures for applications from portable electronics through mains powered systems to renewable energy sources and electric vehicles. Visitors to PCIM will be able to see examples from Talema's range of current transformers and toroidal components. These will include its in-house developed magnetic components such as transformers and inductors, which are used in AC/DC converters, DC/DC converters and signal applications. Most components are custom designed for specific applications, and the business unit also offers a range of standard components. ETAL's established range of magnetic components will also be fully represented at PCIM. These include chokes, air coils, coils, current transformers, power transformers and signal transformers. The company specialises in custom products and in optimising designs but also offers a range of standard components. Its' particular strength is high-end and reliable planar products such as custom designed transformers and inductors that combine superior performance with overall low cost. SIGA IEC conformant current transformer (CT) products will also be on show at PCIM. SIGA manufactures circular or rectangular type CTs, full block or split core, using a UL recognised semi rigid cast resin compound or an IP rated plastic box finish. Other finishes are available.12.04.2022 06:00:00Aprnews_2022-05-01_1.jpg\images\news_2022-05-01_1.jpghttps://kamicgroup.com/index.php/en/frontpage/kamicgroup.com
350 V Gallium Nitride (GaN) Power TransistorEPC announces the production release of the EPC205...9775Product Release350 V Gallium Nitride (GaN) Power TransistorEPC announces the production release of the EPC2050, a 350 V GaN transistor with a maximum RDS(on) of 80 m? and a 26 A pulsed output current. The EPC2050 measures just 1.95 mm x 1.95 mm. This tiny size enables power solutions that occupy ten times less area than comparable silicon solutions. Applications benefiting from the fast-switching speed and tiny size of the EPC2050 include DC-DC conversion from/to 120 V-160 V such as in aerospace applications, 120 V-150 V motor control for medical motors, DC-AC inverters, multi-level converters such as Totem Pole PFC and DC-DC solutions converting 400 V input to 12 V, 20 V or 48 V outputs. Additional applications include fast chargers, battery management systems, electric vehicle charging, solar power inverters, high power lidar for autonomous cars and delivery vehicles, LED lighting, RF switches, and consumer & industrial wirings like wall-mounted sockets and Class D Audio. The EPC2050 is also suitable for 120 VAC-only applications. A typical power supply bus voltage is between 170 V and 250 V. This includes applications specific to the Americas market, such as power tools and in-wall powered devices, seat-back airline 120 V inverters, and commercial LED lighting. "With the EPC2050, designers no longer have to choose between size and performance – they can have both and lower cost!" said Alex Lidow, EPC's CEO.07.04.2022 08:30:00Aprnews_2022-04-15_16.png\images\news_2022-04-15_16.pnghttps://epc-co.com/epc/EventsandNews/News/ArtMID/1627/ArticleID/3047/EPC-Introduces-350-V-Gallium-Nitride-GaN-Power-Transistor-%e2%88%92-20-Times-Smaller-Than-Comparable-Silicon-and-Lower-Cost.aspxepc-co.com
Partnership to Service Global R&D EngineersCODACA has established a partnership with Digi-Key...9760Industry NewsPartnership to Service Global R&D EngineersCODACA has established a partnership with Digi-Key Electronics, expanding the channel for CODACA's high-current power inductor products. Available through Digi-Key's online Marketplace, CODACA now offers convenient stocking and immediate shipping options worldwide for its molding power choke CSAB series, high current power inductor CSBX series and CSCF series, and Class D amplifier inductor CPD and CSD series. Digi-Key Electronics provides R&D engineers access to unlimited adjacent products and technologies through its online Marketplace. The company offers more than 13 million components from over 2,200 quality name-brand manufacturers to support R&D activities globally. CODACA has been developing and manufacturing high quality power inductors for more than 20 years. With certifications including ISO 9001, ISO 14001, TÜV (GER), IATF 16949 and CNAS, CODACA products are developed and tested to provide applications with low DC resistance, high-current ratings, and low power consumptions.07.04.2022 06:00:00Aprnews_2022-04-15_1.png\images\news_2022-04-15_1.pnghttps://codaca.com/en/DesignTool/codaca.com
GaN Power HEMT ICs for Chargers and PowerAt APEC 2022, Tagore highlighted how its GaN FETs ...9781Product ReleaseGaN Power HEMT ICs for Chargers and PowerAt APEC 2022, Tagore highlighted how its GaN FETs are well suited for realizing a bridgeless totem-pole PFC where one half-bridge is composed of GaN FETs and the other half-bridge is composed of MOSFETs. The GaN FETs with drivers are ideally suited for DC/DC converter applications such as LLC or Phase Shifted Full Bridge (PSFB) topologies and for secondary side Synchronous Rectification when the output voltage is high, for example, in Electric Vehicle (EV) battery chargers. Tagore also showcased a live demonstration of the 65W Active Clamp Flyback (ACF) demo board; 65W Quasi-Resonant Flyback (QRF) demo board; 240W Totem POLE PFC + LLC demo board; Half-Bridge GaN Evolution Board (Multi-topology), and Phase shifted Full-Bridge Reference Design (800 W). Moreover, at an Industry Session (Session IS07) on March 22, 2021, Manish Shah, Co-Founder and Vice President of Engineering Tagore Technology, United States, Chief Engineer, Rajesh Ghosh and Asif Iqbal, Manager Design, presented "Monolithically Integrated Protection Circuits in 650V Power GaN". The presentation discussed the benefits of a monolithically integrated HEMT-based GaN IC that delivers efficient and reliable operation in power supplies that lead to even higher power density in chargers and power supplies.05.04.2022 13:30:00Aprnews_2022-04-15_22.jpg\images\news_2022-04-15_22.jpghttp://www.tagoretech.com/tagoretech.com
SiC Power Modules at PCIM EuropeWuxi Leapers Semiconductor (Leapers Semiconductor)...9780Product ReleaseSiC Power Modules at PCIM EuropeWuxi Leapers Semiconductor (Leapers Semiconductor) will present full silicon carbide (SiC) power module portfolio during PCIM Europe 2022 in Nuremberg, Germany. On May 10-12, 2022, the representatives of the company will join the event to showcase their latest SiC power module portfolio designed for applications like new energy vehicles, smart grid, solar and wind power generation, motor drives, medical equipment, traction, etc. By using innovative advanced packaging material and processing technology, Leapers Semiconductor provides comprehensive module application solutions for miniaturization, efficiency and light weighting of electrical drive systems and inverters of new energy vehicles. Besides SiC product line Leapers Semiconductor will present IGBT modules portfolio in the industry recognized footprint designed for high power switching applications. All participants and visitors are invited to stop by Leapers Semiconductor booth 520 in Hall 7 to learn more about company, SiC and IGBT module portfolio, and future products under development. This year PCIM Europe will return to face-to-face format and welcome the visitors from around the world in the halls 6, 7 and 9 on the Messe Nürnberg event grounds. The international power electronics industry will meet again after nearly two years of predominantly digital exchange. As in previous years, visitors of the leading exhibition and conference for power electronics can expect product innovations and a top-class lecture program.05.04.2022 12:30:00Aprnews_2022-04-15_21.png\images\news_2022-04-15_21.pnghttp://www.leapers-power.com/en/leapers-power.com
Dr. HongWen Zhang to Present InSIDER Series WebinarIndium Corporation's Alloy Group R&D Manager Dr. H...9762Event NewsDr. HongWen Zhang to Present InSIDER Series WebinarIndium Corporation's Alloy Group R&D Manager Dr. HongWen Zhang will deliver a presentation on the company's award-winning Durafuse(TM) mixed-alloy technology as part of its popular InSIDER Series of webinars. The presentation, titled "Solder Challenges and Product Development with Durafuse Technology", will be given on Wednesday, April 27 at 8 a.m. San Francisco/11 a.m. New York/4 p.m. London/5 p.m. Germany. Dr. Zhang's presentation will focus on the shortcomings of traditional solder materials and examine the ability of Indium Corporation's Durafuse technology to provide a solution to these challenges. He will highlight the benefits of Durafuse LT, a patented, innovative, low-temperature, mixed-alloy technology that offers enhanced reliability with drop shock performance two orders of magnitude better than Bi-containing solders. He will also discuss Durafuse HT, a new patent-pending product designed as a drop-in solution to replace and outperform the traditional high-lead solders in die-attach and clip-bond applications.05.04.2022 08:00:00Aprnews_2022-04-15_3.png\images\news_2022-04-15_3.pnghttps://www.indium.com/corporate/media-center/news/indium-corporations-dr-hongwen-zhang-to-present-insider-series-webinar/indium.com
Digital Capacitor CatalogThe expanded CDE.com website features a Custom Cat...9768Industry NewsDigital Capacitor CatalogThe expanded CDE.com website features a Custom Catalog Generator that allows engineers to create their personalized PDF capacitor catalogs. A catalog can include just the product lines of interest, a product category, or even by application. Once the selection is made, it takes just seconds to build the catalog. The catalog is saved to a drive and can be printed by the user. The Catalog Generator is a convenient way to jump-start building detailed bill of materials documentation for a new project. Capacitors include a wide variety of aluminum electrolytic, film, aluminum polymer, supercapacitor, and mica types. Unlike traditional annually printed catalogs, the custom-built catalogs are kept up-to-date on an ongoing basis. Each catalog contains front and back cover pages, a table of contents, and live links to learn more. On most manufacturer websites, it is a tedious chore to select and print out a series of datasheets for multiple products. The CDE Catalog Generator makes it easy. No registration is required to access the Custom Catalog Generator or the website.04.04.2022 14:00:00Aprnews_2022-04-15_9.jpg\images\news_2022-04-15_9.jpghttps://www.capacitorcatalog.com/cornell-dubilier/capacitorcatalog.com
Honored for Supply Competence and Strategic CooperationHyundai Motor Group (HMG) has honored Infineon Tec...9763Industry NewsHonored for Supply Competence and Strategic CooperationHyundai Motor Group (HMG) has honored Infineon Technologies as "Partner of the Year 2021" with the "Special Award for Supply Competence." The global automaker recognized Infineon's efforts to stabilize uncertain supply chains despite the challenges posed by COVID-19 and the global semiconductor shortage. In particular, Infineon was honored for its excellent risk management working with HMG. Infineon Korea and Infineon Headquarters have provided flexible and strategic cooperation to manage the difficult situation in the market. For example, by providing the silicon carbide (SiC) based power module HybridPACK CoolSiC Drive, Infineon demonstrated product quality and its ability to respond to new requirements. "Infineon is a reliable partner. We are honored that our efforts to maintain our delivery capabilities in a very challenging environment are valued and appreciated by our customers," said Peter Schiefer, President of the Automotive Division at Infineon. "With the rapid momentum towards green mobility, semiconductor solutions are in high demand. We are driving the transformation toward electromobility with high-quality products, leading technology and system expertise, along with a global production network." HMG has been awarding the "Partner of the Year" award since 2002. In early 2019, Infineon was the first semiconductor manufacturer to receive this award. It was awarded in recognition of outstanding achievements in just-in-time supply and contribution to strengthening the overall competitiveness of the Hyundai Motor Group.04.04.2022 09:00:00Aprnews_2022-04-15_4.jpg\images\news_2022-04-15_4.jpghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2022/INFATV202204-067.htmlinfineon.com
Tatsuo Bizen Appointed CEOpSemi Corporation announced the appointment of Tat...9765PeopleTatsuo Bizen Appointed CEOpSemi Corporation announced the appointment of Tatsuo Bizen as CEO effective April 1, 2022. Succeeding interim CEO Takaki Murata, Bizen joins pSemi from parent company Murata, where for more than 30 years he has served in a variety of global leadership roles in the United States, Japan and Europe. He brings an extensive background in RF and power management, and a passion for driving innovation. A Murata employee since 1985, Bizen served as vice president of the power module division. From 2012 to 2015, he was president and CEO of the Murata Power Solutions subsidiary headquartered in Massachusetts. Bizen spent the three years prior as head of Murata's global corporate marketing. From 2007 to 2009, he was president and CEO of SyChip, Inc., a Texas-based Murata subsidiary that provided RF chip-scale modules. His earlier experience includes involvement in the development of RF modules such as electronic TV tuners and circuit modules for wireless communication, and product management for RF components and modules in Germany, the Netherlands and Sweden. "I am honored and eager to lead pSemi to new heights as CEO. Since the Murata acquisition in 2014, I have worked closely with pSemi employees, who have always impressed me with their hard work, can-do attitudes and inventive ideas. I look forward to working together with my pSemi colleagues to create innovative semiconductor solutions for the connected world." Tatsuo Bizen said. 31.03.2022 11:00:00Marnews_2022-04-15_6.jpg\images\news_2022-04-15_6.jpghttps://www.psemi.com/newsroom/press-releases/psemi-welcomes-new-ceo-tatsuo-bizenpsemi.com
SiC Market, a Multi-Bllion-Dollar ProspectYole's compound semiconductor team released its te...9789Industry NewsSiC Market, a Multi-Bllion-Dollar ProspectYole's compound semiconductor team released its technology and market study, "Power SiC 2022". The study analyzes the challenges and opportunities of this industry in detail. Yole's analysts provide a detailed overview of the technologies as well as accurate market data. The company also offers a valuable understanding of the value chain, the infrastructure, and the competitive landscape, including an analysis of the leading SiC companies' strategies. Poshun CHIU from Yole asserts: "Strongly driven by automotive applications, especially in the EV main inverter, there were multiple newly released EVs and announcements in 2020 and 2021, following Tesla's adoption of SiC. Moreover, Tesla's record shipments helped SiC devices to reach the order of US$1 billion in 2021. To fulfill the demand for a long driving range, an 800V EV is the solution to empower fast DC charging. This is where the 1200V SiC devices play crucial roles." As of 2022, BYD's Han-EV and Hyundai's Ioniq-5 have enjoyed good sales by offering fast charging. More OEMs - such as Nio, XPeng, etc. - plan to bring SiC EVs to the market in 2022. Apart from automotive, industrial and energy applications represent the markets with a higher than 20% growth rate in our forecast period. For example, the deployment of high-power charging infrastructure with SiC modules, and the growing installation of photovoltaics. In this context, the SiC device market is expected to grow beyond US$6 billion by 2027 – from a US$1 billion business in 2021 – in Yole's latest forecast. This multi-billion-dollar business is also appealing for players to grow their revenue.31.03.2022 11:00:00Marnews_2022-05-01_6.jpg\images\news_2022-05-01_6.jpghttp://www.yole.fr/Power_SiC_March2022.aspxyole.fr
700 Volt Threshold Vertical GaN Device DemonstratedOdyssey Semiconductor Technologies announced it ha...9767Industry News700 Volt Threshold Vertical GaN Device DemonstratedOdyssey Semiconductor Technologies announced it has reached a technology milestone in its development of vertical GaN power field-effect transistors (FETs). Odyssey was founded to commercialize vertical GaN FETs. FETs that can provide the conversion efficiency of GaN with the higher voltage rating of SiC. The approach will lead to breakthrough performance for the most demanding applications. Odyssey has now validated its approach at a 700 V rating while also providing industry-leading efficiency with and remarkably low on-resistance approaching 1mOhm-cm2. These devices also exhibit very low gate leakage and can be operated in a mode where they are normally "off". Technology validation can begin on these 700 V devices while an extension of the same architecture to the next milestone of a 1200 V rating or better is completed. Odyssey, with global headquarters in Ithaca, New York is developing this technology in their own manufacturing facility. As the U.S. needs to strengthen domestic semiconductor manufacturing, Odyssey is showing its commitment with its own wafer fabrication facility. This also streamlines the technology and product development processes with close collaboration between R&D and the fab. The Company is also announcing today that the United States Patent and Trademark Office recently approved U.S. Patent 11,251,295, which issued February 15th, 2022, with respect to key aspects of Odyssey's vertical GaN technology. The Patent is entitled "Vertical field effect transistor device and method of fabrication" and relates to a method of fabricating a high voltage switching device using GaN layers and materials.30.03.2022 13:00:00Marnews_2022-04-15_8.jpg\images\news_2022-04-15_8.jpghttps://www.odysseysemi.com/news-media/press-releases/detail/29/odyssey-semiconductor-announces-technology-developmentodysseysemi.com
Joining ForcesSEMIKRON and Danfoss Silicon Power announced a mer...9736Industry NewsJoining ForcesSEMIKRON and Danfoss Silicon Power announced a merger to create a joint business specialized in Power Electronics focusing on power semiconductor modules. With an existing workforce of more than 3,500 dedicated power electronic specialists, the new SEMIKRON-Danfoss will provide technology expertise as the leading partner in Power Electronics. The merger comes with a firm commitment to future investments, paving the way for green growth and a more sustainable, energy efficient and decarbonized future. SEMIKRON-Danfoss will be a central enabler of this transition. The newly formed SEMIKRON-Danfoss joint business will be owned by the current owner-families of SEMIKRON and the Danfoss Group, with Danfoss being the majority owner. The joint business SEMIKRON-Danfoss will be managed by one common leadership team. It will be operated in the accustomed manner, retaining existing production facilities, customer and supplier relationships and distribution channels. SEMIKRON-Danfoss will retain the two main locations in Germany, Nuremberg and Flensburg. The current factories and sales offices of Semikron and Danfoss Silicon Power will continue operations as usual. Danfoss President & CEO Kim Fausing, said: "The new SEMIKRON-Danfoss builds on a strong long-term partnership and more than 90 years of combined technology leadership in Power Module packaging, innovation, and customer application expertise. With electrification driving the green transition, SEMIKRON-Danfoss aims to become the preferred decarbonizing partner for customers. We have the passion, competences and technologies to more than double our business in five years." SEMIKRON CEO Karl-Heinz Gaubatz added: "This really is an exciting moment. Based on close, trusting conversations over the last months we have identified that SEMIKRON and Danfoss are a unique fit with complementing assets, a strong team and shared values. By combining SEMIKRON's expertise as a pioneer for semiconductor technology with more than 70 years of experience in the development of top-class power modules and systems and the strength, innovativeness and fast-paced operations of Danfoss Silicon Power and the Danfoss Group we are positioned ideally to become one of the strongest players in power electronics."29.03.2022 20:00:00Marnews_2022-04-01_24.jpg\images\news_2022-04-01_24.jpghttps://www.danfoss.com/en/about-danfoss/news/cf/semikron-and-danfoss-silicon-power-join-forces/danfoss.com