Bodo's News

Read through my personal pick of news around people, our industry, important events and interesting product releases. Or click on a filter and pick your area of interest!

 

Syndication Network Spanning Over 30 Distribution Partners
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Learn more:
snapeda.com
  • Product Release
  • 2022-09-28

SnapEDA is launching the SnapEDA Syndication Network. This ecosystem of over 30 distribution partners, includes electronic component distributors, printed circuit board (PCB) tool makers, and engineering media sites. The SnapEDA Syndication Network connects the electronic designers and engineers who are at the heart of the electronic industry with design content for millions of electronic components. This content helps engineers design faster, grows revenue and loyalty for distributors, and allows chip and component manufacturers to get valuable design wins. Over 80% of engineers that download SnapEDA’s design content purchase the product. This creates a competitive advantage for electronic component distributors and manufacturers that are a part of SnapEDA’s network, enabling them to win sales earlier in the design process. Global spending on digital transformation is expected to reach an all-time high of $6.8 trillion in 2023. As a result of the global pandemic and a heightened demand for self-serve component selection tools, component manufacturers are increasingly investing in digital demand generation technologies. In addition to helping engineers find the parts they need, SnapEDA uniquely translates this demand into seamless design-ins, securing the win for component manufacturers.

Oscilloscopes for Accelerated Insight
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Learn more:
rohde-schwarz.com
  • Product Release
  • 2022-09-28

Rohde & Schwarz is adding the R&S MXO 4 series oscilloscopes to its portfolio, which features a real-time update rate of over 4.5 million acquisitions per second. The 12-bit ADC in the R&S MXO 4 series has 16 times the resolution of traditional 8-bit oscilloscopes at all sample rates without any tradeoffs for more precise measurements. The oscilloscopes come in four-channel models with bandwidths of 200 MHz, 350 MHz, 500 MHz, 1 GHz, and 1.5 GHz. The R&S MXO 4 series incorporates a 12-bit ADC that operates across all the instrument sample rates with an 18-bit vertical resolution architecture for greater resolution precision. The R&S MXO 4 series also has the lowest noise and largest offset range (+/- 5V with a 500uV/div scaling) in its class. Users can see DC and other signals with more precision than with any other oscilloscope on the market. In addition to bandwidth and sample rate, memory depth is an important factor and determines whether an oscilloscope can handle a large range of troubleshooting tasks. More acquisition memory enables oscilloscopes to capture more time and retain rated bandwidth information for shorter time base settings. With a simultaneous standard acquisition memory of 400 Mpts on all four channels, the R&S MXO 4 series has up to 100 times the standard memory of its primary competition. The additional memory also provides extra measurement capability when needed.

Patented Switching Technique for Power Electronics Design
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Learn more:
pulsiv.co.uk
  • Industry News
  • 2022-09-27

Pulsiv OSMIUM uses a patented method for converting AC to DC that involves charging/discharging a small storage capacitor without the need for a PFC inductor. This solution delivers high power factor, consistently high efficiency and an compact system design. Pulsiv OSMIUM technology can be used to improve overall system efficiency, optimize cost and contribute towards reducing global energy consumption. The microcontroller family and supporting components can be combined with commodity flyback DC-DC converters to displace higher-cost LLC solutions. Pulsiv has demonstrated a universal input, single switch 150W flyback power supply design that delivers 97.5% average (99.5% peak) front-end efficiency while maintaining 90% at just 2W. A 240W interleaved flyback is currently being developed and work is underway to showcase reference designs with even higher power capability. Pulsiv OSMIUM microcontrollers (PSV-AD-150 and PSV-AD-250 sampling now) do not directly determine output power and can be used as a platform for any application requiring 1W to 10kW, by adjusting only three system components and connecting a suitable DC/DC converter. Critical components in a Pulsiv OSMIUM circuit operate at low temperatures to extend their expected operating life, even under convection cooling. By regulating the flow of mains through a charging capacitor, Pulsiv has completely eliminated inrush current, meaning that manufacturers of industrial power supplies and LED lighting products can simplify their designs and reduce the cost of system installation. Finally, the technology supports Active Bridge Control, Configurable Hold-Up, X-Cap Discharge, HVDC Output Selection, a Power Consumption Indicator and Grid Failure Detection. These optional features can be selected as required to meet the needs of different end applications.

Offline AC-DC Primary-Side PWM Controllers for Flyback Converters
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Learn more:
elevation-semi.com
  • Product Release
  • 2022-09-27

Elevation Semiconductor announced the release of its two power ICs with smaller footprints for fast-charging solutions. The HL9510 and HL9512 are flyback PWM controller ICs that operate in a quasi-resonant (QR) mode to enhance the system efficiency and power density. Both ICs offer constant output voltage regulation through the optocoupler feedback controller or shunt regulator and integrate high-voltage startup. The HL9510 and HL9512 protection include VDD over-voltage protection (VDD-OVP), Brown-out protection, DMAG over-voltage protection (DMAG-OVP), DMAG under-voltage protection (DMAG-UVP), IC internal over-temperature protection (OTP), and IC external thermal shut-down (SD). The brown-in voltage is programmed by an external DMAG pin resistor and has a wide VDD operating range to cover variable output mode applications, such as USB-PD/PPS or conventional DP/DN protocol communication. Its protection is also implemented with auto-restart mode. The VDD-OVP, DMAG-OVP, and external SD protection can be configured with auto-restart or latch mode, and the DMAG-UVP can be configured with auto-restart or long auto-restart mode. The HL9510 is designed to integrate an internal HV startup circuit, whereas the HL9512 can be done by the external MOS combined IC’s AUX and ST pins. The HL9510 is available in a 10-lead SOIC package ideal for USB PD/QC portable device battery chargers, high-efficiency AC-DC power adapters, and a power supply with fixed or variable output voltage. The HL9512 also comes in the same package and is ideal for smartphones, tablet PC battery chargers, portable device adapters, and flyback power suppliers with low and/or variable output voltage.

DC/DC Converter IC for Advanced Driver Assistance Systems
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Learn more:
rohm.com
  • Product Release
  • 2022-09-27

ROHM developed the buck DC/DC converter IC with built-in MOSFET (Switching regulator), BD9S402MUF-C, for automotive applications such as infotainment and ADAS (Advanced Driver Assistance Systems) incorporating onboard sensors and cameras that are becoming more advanced. The BD9S402MUF-C supports output voltages down to 0.6V and 4A output current at switching frequencies higher than 2MHz in a compact size demanded by increasingly sophisticated secondary power supply applications for high performance MCUs and SoCs. What’s more, it is incorporating proprietary QuiCur™ high-speed load response technology and enables stable operation at an industry-leading 30mV (measurement conditions: 5V input voltage, 1.2V output voltage, 44µF output capacitance, load current variation 0 to 2A/2µs). This translates to a 25% reduction in output voltage fluctuation over class-leading standard products with equivalent functionality, making it ideal for use in the latest ADAS with severe power supply conditions requiring stable operation within 5% even with low voltage output. The BD9S402MUF-C is also equipped with a load response performance selection function that allows users to easily switch priority between ‘voltage fluctuation’ (for stable operation), and ‘capacitance reduction’ (to ensure stable operation at 22µF) via terminal setting. The result is that users can reduce the resources required for power circuit design, as stable operation can be achieved not only at the initial design, but also during specification or model changes.

GaN-SiC HEMT Transistor for Long Pulse Radar Applications
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Learn more:
ampleon.com
  • Product Release
  • 2022-09-26

Ampleon introduces the CLL3H0914L-700 GaN-SiC HEMT for wireless infrastructure, avionics/defence, non-cellular communication, cooking/ defrosting, and ISM-related applications. This rugged GaN transistor is optimised for radar implementations where long pulse width and high-duty cycles are required. The transistor was engineered to achieve over 700W of peak output power from a single transistor while operating at a voltage of 50V with efficiency of over 70% as well as designed thermally for long pulse applications, such as pulse widths (~2 milliseconds) and 20% duty cycles. This high-power density and low-thermal resistance HEMT is now in full volume production. Units are available directly from Ampleon or authorised distribution partners, RFMW and Digi-Key. Large signal models in ADS and MWO can be sourced via the Ampleon website.   

PCIM Asia Postponed to 2023 While PCIM Asia Conference to Keep Its Schedule This October
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Learn more:
pcimasia-expo.cn
  • Event News
  • 2022-09-26

PCIM Asia will now be held from 29 – 31 August 2023 at Shanghai New International Expo Centre in view of current circumstances relating to the pandemic in China. Although the PCIM Asia exhibition will be moved to next year, the PCIM Asia Conference 2022 will keep its schedule this autumn from 26 – 27 October in Shanghai. “To actively support the government’s efforts towards pandemic mitigation, we have decided to move the fair to next summer after meticulously examining the ongoing situation in China,” explains Mr Louis Leung, Deputy General Manager of Guangzhou Guangya Messe Frankfurt Co Ltd. “We would like to express our gratitude to those in the industry for their understanding and support, and look forward to welcoming key players back next year to reconnect and establish stronger business cooperation within the power electronics industry.” Despite the postponement, industry players will continue to keep abreast of the latest trends and developments this year. “Within the preventive guidance set by the local government, we are able to move forward with PCIM Asia Conference in the original dates this October in Shanghai. While details of the new venue will be announced shortly, we trust the hybrid conference will satisfy the power electronics community’s enthusiasm towards the event and meet the demand for in-person business encounters.”

PLECS Conference 2022 – Insights Into Real-Time Simulation
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Learn more:
plexim.com
  • Event News
  • 2022-09-26

At the PLECS conference in Zurich, leading industrial companies presented their various implementations of real-time simulation with PLECS and the RT Box. The speakers showed how PLECS was successfully used to automatically generate models and controls in their rapid prototyping process. The speed of the simulations was well appreciated. In addition, the RT Box proved to be very versatile: ALSTOM's Dr. Ing. Roberto Aceiton used the compact RT Box in a home-office environment during the pandemic, while Schindler integrated the RT Box into highly automated systems running overnight simulations of various elevator failure modes. Between the presentations, there were lively discussions on the various features of real-time simulation. The conference ended with a look into the future of PLECS: Wolfgang Hammer from Plexim presented future features, such as the "comment out" function to disable components for a simulation run and a difference viewer to compare two models. One question remained for the participants: When will the next PLECS conference take place? Orhan Toker, Vice President of Plexim, says “There will be for sure another PLECS conference in 1-2 years.”.

electronica Impresses with its Supporting Program
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Learn more:
electronica.de
  • Event News
  • 2022-09-22

electronica 2022, which will take place from November 15 to 18 on the exhibition grounds in Munich, and the co-located event SEMICON Europa, will show the role of the electronics industry as a trailblazer for societal future topics. While the exhibitors will present their specific products and solutions in 14 exhibition halls, the comprehensive supporting program of conferences, forums and special events will focus on knowledge transfer and personal exchange with experts. The motto “Driving sustainable progress” will be a common thread through all of the areas. electronica has traditionally been the platform for top-class conferences. This year things will be kicked off by the electronica Automotive Conference on November 14, which will deal with the transition of cars toward becoming intelligent IoT devices with electronic drives over the course of around 18 presentations. Among others, the key issues at the event include new EE architectures, intelligent interiors, challenges for supply chains, CO2 neutrality and efficient drive trains. On November 16, the electronica Embedded Platforms Conference, which will also last one day, will discuss the challenges and solutions for the embedded systems of the future: In around 35 presentations on three parallel tracks, experts will report on key topics such as power electronics and supply, AI and sensors, and communication and software.

Collaboration to Develop Software for Automotive Battery Management Systems
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Learn more:
nxp.com
  • Industry News
  • 2022-09-22

NXP® Semiconductors has joined forces with Elektrobit to co-develop the software platform that supports NXP’s high-voltage battery management system (HVBMS) reference design. Using Elektrobit’s Classic AUTOSAR tooling and software, the software platform of the HVBMS reference design eases the development of HVBMS architectures for electric vehicles (EVs) by abstracting the communication and controlling interactions between the BMS microcontroller and the battery cell controllers. As demand for battery-powered cars (EVs) continues to increase, so does the demand for improved performance, faster charging time, increased range and battery life, and improved safety. These demands drive rapid technological advancements in EV battery designs, especially for high voltages like 400V or 800V. As these batteries become more powerful and complex, more sophisticated BMS architectures are needed to ensure the safety and reliability of EVs. NXP’s HVBMS RD is a scalable ASIL D architecture composed of three modules: battery management unit (BMU), cell monitoring unit (CMU) and battery junction box (BJB). NXP’s wide portfolio of battery cell controllers, battery junction box devices, and devices for its electrical transport protocol link (ETPL), along with production grade software drivers for these silicon devices, makes it easier for OEMs and Tier 1 customers to enter the growing market of HVBMS and enables them to focus effort on their unique application features. Elektrobit has been collaborating with NXP for more than ten years. Utilizing Elektrobit’s EB tresos (AutoCore, AutoCore OS, and RTE), NXP’s reference application software and Complex Device Drivers (CDDs) are designed and integrated into NXP’s HVBMS RD.

Single-stage Flyback Controller for Battery Charging Applications
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Learn more:
infineon.com
  • Product Release
  • 2022-09-22

Infineon Technologies extends its offering of AC-DC controller ICs by introducing the ICC80QSG single-stage PWM controller for flyback topologies. The IC is tailored for battery charger applications offering scalable power designs of up to 130 W – when optimized using CoolMOS™ P7 Superjunction (SJ) MOSFETs. It is also suitable for adapter, printer, PC, TV, monitor, set-top box, and audio amplifier applications. The ICC80QSG battery charging IC offers a quasi-resonant mode, switching in valley n (QRMn). Its QRM operation comes with continuous conduction mode (CCM) prevention and valley switching discontinuous conduction mode (DCM) in mid to light load. By pairing ICC80QSG with CoolMOS™ P7 MOSFET devices, high efficiency and low electromagnetic interference (EMI) can be achieved to enable savings on the overall BOM: fewer heatsinks and coils may be needed in flyback designs. In addition, the integrated burst mode function for very light loads allows designs with very low power consumption during standby mode. Additionally, the ICC80QSG features a reduced gate driver output voltage during burst mode, making it ideally suited for very low standby requirements under light load or no load conditions with a remarkable standby performance over the whole operating range. The ICC80QSG implements a secondary-side regulation (SSR) method, which is ideal for current control during battery charging. For higher design flexibility, it accommodates adjustable on-time mapping at the valley changing position for the desired maximum operating switching frequency, as well as adjustable maximum on-time that limits input power and current, allowing safe operation under low line conditions.

Laminate to Aid Reliable Performance of EV Power Modules
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Learn more:
dupont.com
  • Industry News
  • 2022-09-22

DuPont Interconnect Solutions announced a multiyear contract with European power module manufacturer Semikron-Danfoss who will integrate DuPont™ Pyralux® AP all-polyimide double-sided copper clad laminate into its eMPack® power modules to further enhance the capabilities of next-gen electric vehicles. Integrating Pyralux AP copper clad laminate into eMPack traction inverter designs will help EV automotive engineers address key requirements related to signal integrity and power transmission. "Pyralux AP emerged as our best-fit solution after extensive testing and because the product has demonstrated three decades of stable, reliable performance in a variety of industries where operating conditions, like ours, are severe,” said Karl-Heinz Gaubatz, CTO of Semikron. “eMPack is a perfect fit to SiC MOSFET power modules. We look forward to working with DuPont and their Pyralux technology to help eMPack become a global leader in EV power modules.” Earlier this year, Semikron-Danfoss, headquartered in Nuremburg, Germany, won a billion-Euro contract beginning in 2025 to furnish patented eMPack power modules to a major German automotive manufacturer. Within silicon-carbide MOSFET or full silicon-carbide technology-based modules, traction inverters can be created which are extremely compact, scalable, and reliable because of a Semikron double side sintered assembly and connection technology called Direct Pressed Die (DPD). “We are excited how this EV power module application of Pyralux AP copper clad laminate supports a sustainable and electrified future to help preserve our planet for generations to come,” said Andy Kannurpatti, Global Business Director, Films & Laminates, DuPont Interconnect Solutions. “The eMPack power module is expected to enable millions of next-gen electric vehicles by 2032. We look forward to contributing significantly to the much-anticipated success of eMPack and appreciate the collaboration with Semikron-Danfoss.”

PowerPros Live Video Application-Engineering Support
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Learn more:
power.com
  • Industry News
  • 2022-09-20

Power Integrations launched PowerPros?, a live online video tech support service that enables power-supply designers to talk directly with members of Power Integrations’ applications engineering team 24 hours a day, six days a week, anywhere in the world. Designers worldwide can share a video call with an expert power electronics engineer to discuss real engineering challenges – including full project design and debug – sharing bench-top test results. Initially piloted during the pandemic to support Power Integrations’ customers, the program has been expanded with new facilities, additional team members, extended hours and live video. Trevor Hiatt, director of channel marketing at Power Integrations, said: "This is a technical solutions service where anyone can speak directly with an experienced application engineer any time of the day or night. The program has been very popular with customers, who rated the program 4.4 stars out of 5 with 93 percent of queries resolved within 72 hours. Some questions are simply a matter of pointing the enquirer to the right part of the datasheet, but many issues go much deeper. PowerPros staff advise on device and topology selection, review schematics and PCBs, help with transformer design, and do live design debugging.” Users of PowerPros can collaborate live with Power Integrations engineers to solve their design challenges in real-time using comprehensive bench instrumentation and design tools. Support is available for any of Power Integrations’ extensive portfolio of power supply and driver products and a wide range of applications including industrial, appliance, home and building automation, metering, chargers and adapters, power tools, eMobility, motor drives and LED lighting.

3D Power Design and Manufacturing Symposium
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Learn more:
3d-peim.org
  • Event News
  • 2022-09-15

The PSMA Packaging and Manufacturing Committee announces the Fourth Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-2023) February 1-3, 2023 at Florida International University in Maimi, Florida. This Symposium provides the opportunity to receive an update on the latest technology and future trends focused on increasing the density and the performance of power solutions. Discover advances in the integration, design, packaging and manufacturing of 3D power sources. The Symposium is desgined for any engineer or manager that is involved in the design and manufacturing of high density power sources using 3D technology. Each day will lead off with 2 Plenary Speakers and each Technical Session will lead off with a keynote speaker. Plenary speakers include Professor Fred Lee of Virgina Tech presenting “PCB based Integrated Magnetic” and Dr. Brandon Passmore of Wolfspeed presenting “Finite-Element Predictive Modeling for Power Modules.” Technical Sessions include modeling, active and passive components, substrates, packaging and how to integrate them with 3D manufacturing technologies to create state of the art power sources. The Symposium will include exhibits and ample opportunities to network with attendees, speakers and exhibitors. The General Chair is Dr. Markondeyaraj Pulugurtha of the Florida International University (FIU). Technical Program Co-Chairs are Dr. John Bultitude of Kemet, a Yageo Company, and Dr. Vanessa Smet from Georgia Tech.

Low Contact Resistance Coating For Heightened Fuel Cell Efficiency
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Learn more:
interplex.com
  • Product Release
  • 2022-09-15

Fabricated from corrosion-resistant SUS316L stainless steel, the Interplex bipolar plate (BPP) solutions for hydrogen fuel cells support an extensive operational lifespan of over 8,000 hours. They have thicknesses down to 0.8mm. Their low contact resistance (< 2mO·cm² at 1Ma pressure levels) helps to significantly boost the efficiency levels of the fuel cell stacks they are used in and enables power densities to be raised. Thanks to the precision stamping techniques employed, Interplex BPPs exhibit only =8% variation in the evenness with tight tolerances of flow channel thickness (across their active area), as well as offering enhanced plate flatness. These BPPs thereby deliver assured leak-tight operation and even power distribution across the entire surface of their plates. Likewise, advanced laser welding results in exceptional weld quality. The high-speed stamping and coating procedures that Interplex has developed are key factors too. Via these, the company is able to reach high productivity figures – with physical vapor deposition (PVD) coating of plates being done in a fifth of the time compared to other suppliers. In addition, proprietary over-molding technology for attaching the silicone rubber gaskets to the BPP is done to elevated degrees of accuracy. It allows assembly problems to be minimized when stacking the BPP with a membrane electrode assembly (MEA).

Motor Drive Center of Excellence Opened in Turin
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Learn more:
epc-co.com
  • Industry News
  • 2022-09-14

EPC has opened a design application center near Turin, Italy, to focus on growing motor drive applications based on GaN technology in the e-mobility, robotics, drones, and industrial automation markets. The specialist team will support customers in accelerating their design cycles and define future Integrated Circuits for power management with state-of-the art equipment to test applications from 400 W to 10’s of kW. Strategically located, Turin has a historical tradition in electric motors and motor drives enabling the company to draw on the wealth of local technical talent. EPC’s engineers are helping customers reduce their design cycle times and adopt GaN for more efficient, smaller, lower-cost systems. Moreover, the center is exploring ways to exploit the potential of EPC’s GaN technology in motor drive applications to enable a substantial increase in the efficiency of the motor, leading to higher power density designs than what has been possible with historically MOSFET-based designs. Turin also features the Power Electronics Innovation Centre, a cross-department entity in the Politecnico di Torino - one of the most important technical Universities in Europe - and EPC is collaborating closely with PEIC by investing in shared research and development. The facility is headed by Marco Palma, EPC’s Director of Motor Systems and Applications. Commenting on the opening he said, “Our new facility combines a comprehensive GaN product portfolio and design expertise offering customers a center of excellence that is unrivalled for motor drive applications. Its location is key too, as Europe is driving the green revolution in the e-mobility market, by using the Euro 7 standard in the short term and by banning internal combustion engines by 2035. This is definitely the right time to invest in higher power density motor solutions that avoid un-necessary energy waste.”

ASIL C Certified Battery Management System for High Voltage Applications
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Learn more:
sensata.com
  • Product Release
  • 2022-09-13

Sensata Technologies announced a Battery Management System (BMS), the Lithium Balance n3-BMS, for high voltage applications. It is ideal for applications with power up to 1000 volts/2000 amps, especially for battery makers and manufacturers of electric trucks, buses, and other heavy commercial vehicles. The demand for ISO 26262 certified components is on the rise as battery packers and electric commercial vehicle OEMs prioritize functional safety in their platforms while striving for faster time-to-market. However, the ISO 26262 certification process is complex, costly and can take years to complete. An off-the-shelf, Automotive Safety Integrity Level (ASIL C) certified solution like the Lithium Balance n3-BMS can reduce the development time and associated costs. The layered software structure of the n3-BMS provides customers with the option to customize the battery management system with their own code and algorithms without impacting the ASIL C certification. The BMS software architecture consists of a “Base Software Layer” (BSW) and an “External Software Layer” (ESW) which are connected by an open API link layer. Since all the safety-critical functionalities of the BMS are in the BSW layer of the software, developers are free to implement their own software code and algorithms in the ESW without any risk to the ISO 26262 certification of the system.

Ruggedised 250W Non-isolated DC-DC Converters
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Learn more:
lambda.tdk.com
  • Product Release
  • 2022-09-13

TDK Corporation announces the introduction of the 250W rated TDK-Lambda RGA series of ruggedised non-isolated DC-DC converters. Capable of operating from an input voltage of 9 to 40V or 9 to 53V, the non-isolated step-down converters deliver output voltages that can be adjustable from 3.3 to 15V, 3.3 to 24V or 3.3 to 40V with output currents of up to 20A. The series is designed to be used in harsh environment applications including robotics, AGVs (Automated Guided Vehicles), communications, COTS, industrial and portable battery-powered equipment. In a 1/16th brick form factor, measuring 35.6 x 25.6 x 13mm, the converters are encapsulated to provide a higher resistance to shock and vibration. The five-sided aluminum die cast housing with mounting tabs reduces radiated EMI and enables conduction cooling to a cold-plate for fan-less operation. The RGA models comprise of three voltage and current combinations to support operation from 12V, 18V, 24V, 36V and 48V power sources. The wide input ranges can assist with inventory reduction programs with one part number covering multiple nominal voltages. With efficiencies of up to 98%, power losses are minimised allowing the products to operate in harsh environments of -40°C to +110°C case temperature. The need for external output capacitance is reduced due to an optimised dynamic voltage response, thus reducing board space requirements.

DIN Rail AC/DC Power Supplies
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Learn more:
coseleurope.eu
  • Product Release
  • 2022-09-12

COSEL announced the launch of three DIN Rail AC/DC power supplies for industrial applications. Available in three power levels, 30W, 60W and 90W, combining a low profile design, a wide input voltage range of 85V – 264V, and high performance levels, the WDA series is suitable for a large range of applications. The three models, WDA30F, WDA60F and WDA90F are designed for DIN-Rail attachment and are compatible with the DIN EN60715TH 35 standard (35×7.5mm or 35×15mm), the top hat shaped DIN rail. Designed for international applications, the versatile WDA series boasts a wide input voltage range of 85 to 264VAC, and features overvoltage protection with latching and overcurrent protection with automatic recovery. The WDA30F is available in four different output voltages, 5V, 12V, 24V and 48V within a power level of 30W and a typical efficiency of 88%. Three output voltages are proposed for the WDA60F and WDA90F of 12V, 24V and 48V within an output power of 60W and 90W respectively, and a typical efficiency level of up to 90%. All models include a potentiometer making possible to finely trim the output voltage when installed. A DC OK LED visually confirms the output status. Optimized for convection cooling, the WDA series can be operated within an ambient temperature range of -20 to +70 degrees centigrade. Depending on the assembly method and ventilation used in the final equipment, a derating may apply as specified in the technical documentation.

Agreement Leads to 130 nm SiGe BiCMOS Platform
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Learn more:
xfab.com
  • Industry News
  • 2022-09-12

X-FAB Silicon Foundries has announced a further expansion of its longstanding partnership with the Leibniz Institute for High Performance Microelectronics (IHP). As part of a new agreement, X-FAB will now license IHP’s SiGe technology. It will mean the performance benefits of this technology can be brought to high-volume customers. Significantly strengthening the X-FAB technology portfolio, the newly created 130 nm platform provides a solution attaining the elevated performance parameters needed to address next generation communication requirements. Examples of areas benefiting from this technology include Wi-Fi 6 (and future Wi-Fi 7) access points, plus next generation cellular infrastructure (in particular 5G mmW and emerging 6G standards) and vehicle-to-vehicle (V2V) communication. This technology will also be pivotal in the development of +100 GHz radar systems, for use in both automotive and consumer applications. This license agreement follows on from the collaborative work that began in 2021, where X-FAB’s copper backend was added to IHP’s SG13S and SG13G2 frontend technologies to boost the bandwidth figures that could be supported. In relation to this innovative SiGe platform, X-FAB is set to start engaging with selected early adopters on prototyping projects during Q4 2022. An early-access PDK is available enabling Prototyping, while volume manufacturing will happen at X-FAB France, the company’s facility near Paris. 

Silicon Carbide Materials Facility in North Carolina
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Learn more:
wolfspeed.com
  • Industry News
  • 2022-09-09

Wolfspeed announced it will build a state-of-the-art, multi-billion-dollar Materials manufacturing facility in Chatham County, North Carolina. The investment is targeted to generate a more than 10 fold increase from Wolfspeed's current Silicon Carbide production capacity on its Durham campus, supporting the company's long-term growth strategy, accelerating the adoption of Silicon Carbide semiconductors across a wide array of end-markets and unlocking a new era of energy efficiency. The facility will primarily produce 200mm Silicon Carbide wafers, which are 1.7x larger than 150mm wafers, translating into more chips per wafer and ultimately, lower device costs. These wafers will be used to supply Wolfspeed's Mohawk Valley Fab, which opened earlier this year as the world's first, largest and only fully automated 200mm Silicon Carbide fabrication facility. Phase one construction is anticipated to be completed in 2024 and cost approximately $1.3 billion. Between 2024 and the end of the decade, the company will add additional capacity as needed, eventually occupying more than one million square feet on the 445-acre site. "Wolfspeed is the industry leader in supplying the materials required to meet the accelerating demand for next generation semiconductors and creating a more sustainable future for all. Demand for our products continues to grow at a rapid pace, and the industry continues to be supply constrained. Expanding our Materials production will further our market leadership and allow us to better serve the growing needs of our customers," said Gregg Lowe, President and CEO of Wolfspeed.

Family of Packaged GaN FETs Offers Footprint Compatible Solutions
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Learn more:
epc-co.com
  • Product Release
  • 2022-09-08

EPC expands the selection of off-the-shelf GaN FETs in thermally enhanced QFN packages with the introduction of the 100 V EPC2306 designed for 48 V DC-DC conversion used in high-density computing applications, in 48 V BLDC motor drives for e-mobility and robotics, and in solar optimizers and microinverters, and Class D Audio. The EPC2306 GaN FET offers a super small RDS(on), of just 3.8 mOhm, together with very small QG, QGD, and QOSS parameters for low conduction and switching losses. The device features a thermally enhanced QFN package with exposed top and footprint of just 3 mm x 5 mm, offering an extremely small solution size for the highest power density applications. The EPC2306 is footprint compatible with the previously released 100 V, 1.8 mOhm EPC2302. The two footprint compatible devices allow designers to trade off RDS(on) vs. price to optimize solutions for efficiency or cost by dropping in a different part number in the same PCB footprint. "The EPC2306 combines the advantages of 100 V GaN with an easy to assemble QFN package without sacrificing performance," said Alex Lidow, CEO and co-founder of EPC. "Designers can use our family of packaged GaN FETs to make lighter weight battery-operated BLDC motor drives for eMobility and drones, higher efficiency 48 V input DC-DC converters for data center, datacom, artificial intelligence, and other industrial and consumer applications."

Partner on Electric Van Production
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Learn more:
mercedes-benz.com
  • Industry News
  • 2022-09-08

Mercedes-Benz Vans and electric vehicle manufacturer Rivian, have announced the signing of a Memorandum of Understanding to initiate a strategic partnership. The partnership will enable the companies to cooperate on the production of electric vans. Subject to the parties entering into final binding agreements and to obtaining the relevant regulatory clearances, the companies intend to establish a joint venture manufacturing company with the purpose of investing in, and operating, a factory in Europe to produce large electric vans for both Mercedes-Benz Vans and Rivian, starting in a few years. The target is to build an all-new electric-only production facility leveraging an existing Mercedes-Benz site in Central/Eastern Europe. The companies envisage production-optimised vehicle designs for efficient manufacturing on common assembly lines. They will aim to produce two large vans, one based on VAN.EA (MB Vans Electric Architecture), the electric-only platform of Mercedes-Benz Vans, and the other based on the second generation electric-van, Rivian Light Van (RLV) platform. Further options for increased synergies from the joint venture will also be explored. The joint venture mirrors the common objectives of Mercedes-Benz Vans and Rivian: both companies plan to rapidly scale the production of electric vans to help the world transition to cleaner transportation. By working together, they will be able to leverage operations synergies and substantially increase cost efficiency to help make the vans more affordable for commercial customers driven by total cost of ownership.

DC-DC Regulators with Fast COT Engine
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Learn more:
infineon.com
  • Product Release
  • 2022-09-08

Infineon Technologies introduced a family of OptiMOS 5 IPOL buck regulators with VR14-compliant SVID standard and I²C/PMBus digital interfaces for Intel/AMD server CPUs and network ASICs/FPGAs. Housed in a 5 x 6 mm² PQFN package, these devices are a fully integrated, and efficient solution for next-generation server, storage, telecom, and datacom applications, as well as distributed power systems. The OptiMOS IPOL single-voltage synchronous buck regulator TDA38640 supports up to 40 A output current. The device comes with Intel SVID and I²C/PMBus digital interfaces and can be used for Intel VR12, VR12.5, VR13, VR14, IMPVP8 designs, and DDR memory without significant changes to the bill of materials (BOM). Infineon's TDA38740 and TDA38725 digital IPOL buck regulators support up to 40 A and 25 A output current, respectively and come with a PMBus interface. All three new devices use Infineon's proprietary fast constant on time (COT) PWM engine to deliver industry-leading transient performance while simplifying the design development. The onboard PWM controller and OptiMOS FETs with integrated bootstrap diode make these new devices a small footprint solution with highly-efficient power delivery. In addition, they provide the required versatility by operating in a broad input and output voltage range while offering programmable switching frequencies from 400 kHz to 2 MHz. A multiple time programming (MTP) memory allows customization during design and high-volume manufacturing, significantly reducing design cycles and time-to-market. They also offer a digitally programmable load line that can be set via configuration registers without external components, resulting in a simplified BOM. The device configuration can be easily defined using Infineon's XDP Designer GUI and is stored in the on-chip memory.

APEC 2023 Student Attendance Support Program Registration is Now Open
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Learn more:
apec-conf.org
  • Event News
  • 2022-09-08

The joint sponsors of the Applied Power Electronics Conference (APEC) have announced the continuation of the popular Student Attendance Support Program for APEC 2023, scheduled to take place in Orlando, March 19-23. Chosen recipients of the program will receive reimbursement to cover qualified expenses for attending APEC 2023. Those eligible to apply for the program are power electronics students, undergraduate or graduate, who have been accepted to present papers at the upcoming conference in March. Once accepted, student presenters must apply for the Student Attendance Support Program by October 26, 2022. In its 18th year, this popular program was initiated by the Power Sources Manufacturers Association (PSMA). It is now jointly underwritten by PSMA and the other co-sponsors of the APEC conference: the IEEE Power Electronics Society (PELS) and the IEEE Industry Applications Society (IAS). The recipients of the Student Attendance Support Program will be chosen by the APEC 2023 Student Attendance Support Committee. As part of the application process, students must provide information about their educational institution, degree program, the name of their faculty advisor, as well as a brief description of their career interest and reasons for attending APEC. The application also requires the title and ID number of their accepted APEC paper, including the name(s) of the co-author(s), if applicable.

Third-Generation 200V MV MOSFETs
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Learn more:
magnachip.com
  • Product Release
  • 2022-09-07

Magnachip Semiconductor introduced its third- generation 200V Medium Voltage (MV) Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs) for Light Electric Vehicles (LEV) motor controllers and industrial power supplies. To maximize energy efficiency in power devices, Magnachip's 200V MOSFETs incorporate third-generation trench MOSFET technology. The capacitance was reduced by 50% compared to the previous generation 100V MV MOSFET and the enhanced design of the core cell and termination helps lower RDS(on) and total gate charge to achieve a high figure of merit. In addition, these third-generation MOSFETs are available in surface mount device TO-Leadless Package (TOLL), M2PAK and TO-220 of a through-hole type respectively to reduce product size and enhance heat dissipation. Furthermore, the energy efficiency of these MOSFETs is increased by fast switching and high power density. Coupled with a guaranteed operating junction temperature from -55°C up to 175°C and a high level of avalanche ruggedness, these MOSFETs are well-suited for LEV motor controllers and industrial power supplies requiring high efficiency and stable power supply. "The development of advanced applications in the automotive and industrial sectors is driving the need for high-performance MV MOSFETs," said YJ Kim, CEO of Magnachip. "Magnachip will continue to upgrade its MV MOSFET product line, ranging from 40V to 200V, which will enable our customers to strengthen their product competitiveness."

Gallium Nitride Half-Bridge Power ICs
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Learn more:
navitassemi.com
  • Product Release
  • 2022-09-07

Navitas Semiconductor announced GaNSense half-bridge power ICs. These half-bridge ICs enable a new level of MHz switching frequencies while reducing the system cost and complexity compared to existing discrete solutions. GaNSense half-bridge power ICs integrate two GaN FETs with drive, control, sensing, autonomous protection, and level-shift isolation, to create a fundamental power-stage building block for power electronics. This single-package solution reduces component count and footprint by over 60% compared to existing discretes, which cuts system cost, size, weight, and complexity. The integrated GaNSense technology enables autonomous protection for increased reliability and robustness, combined with loss-less current sensing for higher levels of efficiency and energy savings. The high integration levels also eliminate circuit parasitics and delays, making MHz-frequency operation a reality for a broad range of AC-DC-power topologies including LLC resonant, asymmetric half-bridge (AHB), and active-clamp flyback (ACF). The GaNSense half-bridge ICs are also a perfect fit for totem-pole PFC, as well as motor-drive applications. GaNSense half-bridge ICs are anticipated to have a significant impact in all Navitas target markets including mobile fast chargers, consumer power adapters, data center power supplies, solar inverters, energy storage, and EV applications.

Driving SiC MOSFETs in a Proper Way
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Learn more:
microchip.com
  • Industry News
  • 2022-09-06

The silicon carbide (SiC) market continues to grow as the semiconductor power source is a great solution for many applications across various industries. Earlier this year, Microchip Technology announced the expansion of its SiC portfolio with the release of the industry's lowest on-resistance 3.3 kV SiC MOSFETs and highest current-rated SiC SBDs available in the market, enabling designers to take advantage of ruggedness, reliability and performance.  The recently published "SiC MOSFET Application Note AN4616" provides design guidance for properly selecting gate-source voltages for Microchip's SiC MOSFET products, along with related device performance, behavior and design considerations for making the most effective gate driver circuit. 

Sensor and Measurement Science International 2023: Call for Papers online
  • Event News
  • 2022-09-06

The AMA Association for Sensors and Measurement opens the call for papers for the international congress: Sensor and Measurement Science International (SMSI) 2023. The congress will be held in Nuremberg, Germany, May 8-11, 2023, in parallel with the SENSOR+TEST 2023 trade fair. The submission deadline for presentations and posters is November 15, 2022. SMSI 2023 under the scientific leadership of Ulrich Schmid (TU Vienna), Michael Heizmann (KIT) and Klaus-Dieter Sommer (TU Ilmenau), networks representatives from research, science and industry. The conference builds on three thematic pillars: sensor technology, measurement technology and metrology. The Sensor Technology congress pillar focuses on sensor principles, sensor materials and process technologies, electronic sensor interfaces, a wide variety of application areas and integrates the IRS² 2023 satellite conference in the field of infrared sensor technology. The Measurement congress pillar focuses on IoT-relevant and networked measurement systems, advanced measurement approaches, AI approaches in measurement, and the science of measurement and its applications. The Metrology section will address, among other topics, the revised SI (international system of units), metrology in the digital age, advanced calibration approaches and testing methods, and metrology in regulation and standards. The parallel leading trade fair of the industry SENSOR+TEST 2023, as platform for sensor, measurement and testing technology, promotes the extended innovation dialogue of the SMSI 2023 conference participants.

Partnership to Develop Automotive Solutions
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Learn more:
rohm.com
  • Industry News
  • 2022-09-06

ROHM and SemiDrive Technology have signed an advanced technology development partnership for the automotive field. The companies have been engaged in technology exchange since 2019, mainly on the development of applications for vehicle cockpits. As the first fruits of this effort, SemiDrive's automotive SoC (X9 series) solution board equipped with ROHM's PMIC is now available as a solution. SemiDrive's latest automotive SoCs (X9 series) have already been adopted by a number of automakers to provide advanced functionality for cockpits and other vehicle applications. At the same time, ROHM's SerDes IC achieves low power consumption by optimizing the video transmission rate, while ROHM's PMICs not only integrate the power supply system and functions required for SoC, but a high-speed response function as well that improves power conversion efficiency and reduces component count. Kazuhide Ino, Managing Executive Officer, CSO, ROHM Co., Ltd. said "We are delighted to partner with SemiDrive, a company with extensive experience in automotive SoCs. As ADAS evolves and cockpits become more multifunctional, the performance of vehicle cameras and video transmission technology must improve, increasing the role of semiconductors such as SerDes ICs. To this end, we will continue to deepen exchanges with SemiDrive and accelerate the development of a wide range of products utilizing ROHM's cutting-edge technologies that can contribute to the further evolution of electric vehicles by providing solutions that combine peripheral components."

SPS 2022: A Look Into the Future of Automation
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Learn more:
sps.mesago.com
  • Event News
  • 2022-09-06

The 31st edition of SPS is expected to attract 1,100 exhibitors from across the globe. The event will take place from 8 to 10 November 2022 in Nuremberg and will showcase the latest products, solutions and pioneering future technologies in the field of industrial automation. This year once again, visitors will be treated to a dazzling array of products and services from national and international suppliers of automation and digitalisation solutions. They will also have the chance to get a comprehensive overview of the market via the complementary digital event platform "SPS on air", which will be available before, during and after the three-day physical event in Nuremberg. In the week before the event starts, SPS ticket holders have an opportunity to participate in a digital "pre-heat event" with numerous technical presentations and product previews on the "SPS on air" platform. During the exhibition itself, the supplementary program will run at the VDMA/ZVEI Forum in Hall 3 on the exhibition grounds and from the SPS Live Studio in Nuremberg on the digital supplement "SPS on air".

Flexible Power Modules Simplify SiC Inverter Designs
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Learn more:
st.com
  • Product Release
  • 2022-09-05

STMicroelectronics has released two STPOWER modules that contain 1200V silicon-carbide (SiC) MOSFETs in popular configurations. Each uses ST's ACEPACK 2 package technology to ensure high power density and simplified assembly. The A2F12M12W2-F1, is a four-pack module that provides a convenient and compact full-bridge solution for circuits such as DC/DC converters. Another module, the A2U12M12W2-F2, employs a three-level T-type topology to combine high conduction and switching efficiency with consistent output-voltage quality. The MOSFETs in these modules leverage ST's second-generation SiC technology, which has an outstanding RDS(on) x die-area figure of merit to ensure high current-handling capability with minimal losses. With 13m? typical RDS(on) per die, both full-bridge and T-type topologies tackle high-power applications and ensure excellent energy efficiency with simplified thermal management due to low dissipation. The ACEPACK 2 package has compact dimensions and ensures high power density, with an efficient alumina substrate and direct bonded copper (DBC) die attachment. The external connections are press fit pins that simplify assembly in potentially harsh-environment equipment such as electric vehicles (EVs) and power conversion for charging stations, energy storage, and solar energy. The package provides 2.5kVrms insulation and contains an integrated NTC temperature sensor that can be used for system protection and diagnostics.

Power Chip Cooler with a Thermal Resistance of Merely 1.4 K/W
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Learn more:
sepa-europe.com
  • Product Release
  • 2022-09-02

SEPA EUROPE introduces the HZB50B, a chip which, cooler with its low thermal resistance of only 1.4 K/W, is suitable for both, powerful processors and FPGAs. It is noticeable at first glance that the HZB50B has a very light and compact construction. It measures merely 50 x 50 x 11.5 mm and weighs only 39 g which renders it suitable for low installation heights. The heat sink was produced from pure aluminum by modern impact extrusion which means that large quantities can be manufactured cost-effectively. Thanks to its robust ball bearing system, it has a service life of 350.000 h (at 40°C) and is thus particularly suitable for failsafe cooling. The brass push pins ensure easy attachment. The PCB only requires preparing with the corresponding holes and reinforcements. The compression springs provide an ideal thermal transfer from the semiconductor to the heat sink. The chip cooler HZB50B is available with 5 and 12 V and can also be supplied on request with pre-assembled adhesive pads.

Cell Phones with Inbuilt GaN Charging Protection
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Learn more:
innoscience.com
  • Industry News
  • 2022-09-01

Innoscience Technology announced the Bi-GaN series of bi-directional GaN HEMT devices that save space and facilitate fast charging without suffering from reliability-limiting and potentially dangerous rises in temperature that can sometimes be seen in traditional silicon devices. Innoscience has also revealed that OPPO is using the BiGaN devices inside its phone handset to control the battery's charging and discharging currents. This is the first time that such protection, based on GaN technology, has been included in the phone itself – previously the circuitry had to be incorporated inside the charger. Until recently, silicon MOSFETs have been used as power switches in cell phones. However, these traditional devices not only occupy significant space on a cell phone's main PCB where every millimeter counts, they may also result in considerable temperature rises and power loss when fast-charging. InnoGaN has advantageous characteristics such as high frequency, high efficiency and low resistance, which are vital for efficient charging. Thanks to InnoGaN's low RDS(on), the fact that it does not have parasitic diodes, and the unique bidirectional feature of Innoscience's BiGaN technology, one BiGaN HEMT can be used to replace back-to-back connected NMOS MOSFETs in a common-source configuration to achieve bi-directional switching of the battery's charging and discharging currents

PCIM Asia 2022: New Date
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Learn more:
pcimasia-expo.cn
  • Event News
  • 2022-09-01

In light of recent developments concerning the pandemic in Shanghai, PCIM Asia will now be held from 26 – 28 October 2022 in Hall E1 at the Shanghai New International Expo Centre. The show will continue to provide a platform for exchanging ideas, showcasing technologies and expanding business networks. This will be achieved through gathering the latest power electronics suppliers at the fairground and by exploring the latest trends through the fair's concurrent programme. On behalf of the organisers, Mr Louis Leung, Deputy General Manager of Guangzhou Guangya Messe Frankfurt Co Ltd expressed: "We are pleased to have confirmed suitable dates for the rescheduling of the fair, which meet the needs of our stakeholders. Meanwhile, we are in contact with our local and international exhibitors and supporters to provide them with the necessary support to facilitate their participation. We are also prepared to put the necessary measures in place to ensure the wellbeing of all fairgoers during the course of the October fair."

Acquisition Completed
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Learn more:
allegromicro.com
  • Industry News
  • 2022-09-01

Allegro MicroSystems announced the completion of its previously-announced acquisition of Heyday Integrated Circuits (Heyday). Heyday is a privately held company specializing in compact, fully integrated isolated gate drivers that enable energy conversion in high-voltage gallium nitride (GaN) and silicon carbide (SiC) wide-bandgap (WBG) semiconductor designs. This acquisition brings together Heyday's isolated gate drivers and Allegro's isolated current sensors to enable some of the smallest high-voltage and high-efficiency power systems available on the market today. Additionally, this acquisition is expected to increase Allegro's addressable market for electric vehicles (xEV), solar inverters, datacenter and 5G power supplies, and broad-market industrial applications. "The demand for simplified power management is increasing across the board, and high-voltage isolated gate drivers are fundamental for enabling technology for the future of high-efficiency power system designs" said Joe Duigan, Senior Director, Engineering and Business Development. "Together with Allegro's market leading current sensors and Heyday's isolated gate drivers we will be able to power the increasingly popular GaN and SiC MOSFET driven systems." "We're thrilled to welcome Heyday to the Allegro family," said Vijay Mangtani, Vice President of Power ICs at Allegro. "This acquisition will greatly accelerate our efforts to deliver a market leading energy efficient technology platform for high-voltage designs in advanced mobility, clean energy, and motion control solutions."

Managing Director for European Operations
  • People
  • 2022-08-31

Palomar Technologies announced the appointment of Mr. Thorsten Scheidler as the new managing director for its European operations effective October 1, 2022. Mr. Scheidler replaces Mr. Josef Schmidl who is retiring after more than 30 years with Palomar Technologies. "It's with sad hearts that we announce the retirement of our long-time colleague, Mr. Josef Schmidl, yet welcome Mr. Scheidler to his new position as managing director for Palomar Europe," said Bruce Hueners, President and CEO for Palomar Technologies, Inc. "We wish Mr. Schmidl a long, healthy and happy retirement and wish Mr. Scheidler great success in his new role and look forward to working with him." Over his 30+ years with Palomar Technologies, Mr. Schmidl was instrumental in opening up the European market to Palomar semiconductor packaging equipment and building the market. He joined Hughes Aircraft in 1986 as a service and applications engineer. In 1995, Mr. Schmidl moved to sales and two years later, he established Palomar GmbH in Erlangen, Germany, a wholly-owned subsidiary of Palomar Technologies. Since then, Mr. Schmidl has grown Palomar GmbH into an organization that provides sales and service support to customers in Europe, Russia, the Middle East, and Africa. Mr. Thorsten Scheidler, Sales Director Europe for SST Vacuum Reflow Systems has over 15 years of sales and technical support experience within the power electronics and semiconductor industries in Europe.  He has been instrumental in implementing sales strategies for Palomar's wholly owned subsidiary, SST Vacuum Reflow Systems in the EMEA market.

Si IGBTs for Electric Vehicle Inverters
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Learn more:
renesas.com
  • Product Release
  • 2022-08-30

Renesas Electronics announced the development of a generation of Si-IGBTs (Silicon Insulated Gate Bipolar Transistors) which will be offered in a small footprint while providing low power losses. Aimed at next generation electric vehicle (EVs) inverters, AE5-generation IGBTs will be mass produced starting in the first half of 2023 on Renesas’ 200- and 300-mm wafer lines at the company’s factory in Naka, Japan. Additionally, Renesas will ramp up production starting in the first half of 2024 at its power semiconductor 300-mm wafer fab in Kofu, Japan to meet the growing demand for power semiconductor products. The silicon based AE5 process for IGBTs achieve a 10% reduction in power losses compared to the current-generation AE4 products, a power savings that will help EV developers save battery power and increase driving range. In addition, the products are approximately 10% smaller while maintaining high robustness. The Renesas devices achieve a high level of performance for IGBTs by optimally balancing low power loss and robustness trade offs. Moreover, the IGBTs improve performance and safety as modules by minimizing parameter variations among the IGBTs and providing stability when operating IGBTs in parallel. These features provide engineers greater flexibility to design smaller inverters that achieve high performance.

Discrete SiC MOSFETs for High-voltage Industrial Applications
  • Product Release
  • 2022-08-30

Toshiba Electronics Europe has launched five 1200V silicon-carbide (SiC) MOSFETs that leverage the Company's third generation SiC technology to boost the energy efficiency of high-voltage industrial applications. They are used in equipment such as EV charging stations, photovoltaic inverters, industrial power supplies, uninterruptible power supplies (UPS), and bidirectional or half-bridge DC-DC converters. By improving the on-resistance x gate-drain charge (RDS(on) x QGD) figure of merit by more than 80%, Toshiba's latest SiC technology elevates both conduction and switching performance in power-conversion topologies. In addition, the devices contain the innovative embedded Schottky barrier diode (SBD), proven in the previous generation. The embedded SBD enhances the reliability of SiC MOSFETs by overcoming internal parasitic effects to maintain a stable device RDS(on). Furthermore, the products have a generous maximum gate-source voltage range, from -10V to 25V, which enhances flexibility to operate in various circuit designs and application conditions. The gate-threshold voltage (VGS(th)) range from 3.0V to 5.0V, ensures predictable switching performance with minimal drift and permits a simple gate-driver design. The third generation SiC MOSFETs available now comprise the TW015N120C, TW030N120C, TW045N120C, TW060N120C, and TW140N120C. The devices have RDS(on) values from 15m? to 140m? (typical, at VGS = 18V) and drain-current ratings from 20A to 100A (DC at TC=25°C). All the devices are in full production and ready to order from distributors, in the standard TO-247 power package.

Compact Single-stage Filter Family
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Learn more:
schurter.com
  • Product Release
  • 2022-08-30

SCHURTER expands the FMAB NEO single-phase filter family with variants for protection class II applications. The filter series without protective ground connection is available as a medical M5 version for a rated current range from 1 A to 20 A with plug-in terminals. Protection class II, also known as protective insulation, means protection by double or reinforced insulation. All clearances and creepage distances must be doubled, and inside the filter double or reinforced insulation is mandatory. The FMAB NEO filter series Protection Class II meets all these requirements: reinforced insulation inside the filter and the plug-in terminals have a large plastic collar. The filters are tested with 4 kVAC between L or N against the metal housing. Protection class II applications do not have a protective ground wire. To ensure effective personal protection even without a protective ground conductor, protection class II devices feature additional insulation. Typical applications include power tools, audio and video equipment and many medical devices. Protection class II is even mandatory for a variety of medical applications. For example, medical devices for use at home must be of protection class II according to IEC 60601-1-11. The single-stage FMAB NEO filter family has a particularly compact design combined with high performance. It is suitable for applications in the temperature range from -40 °C to 100 °C and has ENEC and cURus approvals. In addition to the standard version, SCHURTER also offers variants with optimized attenuation. These variants have particularly high-quality core materials.

Compact Industrial AC/DC Power Supplies
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Learn more:
pduke.com
  • Product Release
  • 2022-08-30

P-DUKE has added the TAD50 series to its open frame power supplies portfolio from 15W to 450W. It has a compact 3"x1.5" footprint and delivers 50W continuous output power. In addition, a peak power function is available that enables the power supply to deliver up to 140% of rated output power for 5 seconds. This series is designed with a high conversion efficiency of 90.5% to 92.5%, enabling full-power operation from -40? to +55? ambient temperature without derating or forced air cooling. With forced air cooling or with output power derating the TAD50 series can perform up to +85?. The universal input voltage range is 85-264Vac (120-370Vdc) and outputs are available from 5, 7.5, 9, 12, 15, 18, 24, 36, 48 and 53Vdc with output adjustability of -10% to +10% or -20% to +10%, depending on output voltage. The TAD50 series features full protection against output short-circuit (continuous, automatic recovery), over-load (hiccup mode, automatic recovery) and output over-voltage (latch mode). The TAD50 series allows operating altitudes of up to 5000m and has a 3kVac/ 1 minute reinforced I/O-insulation and over voltage category OVC III. The integrated EMC filter complies with EN 55032, class B for conducted and radiated emission.

High-Power Fuse Series for EV/HEV Application Accessory Circuit Protection
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Learn more:
bourns.com
  • Product Release
  • 2022-08-29

Bourns announced a POWrFuse High-Power Fuse model series. Bourns specifically designed the POWrFuse Model PF-K Series to meet ISO 8820-8 standards for the protection of high-voltage accessory circuits in electric vehicles (EVs) and hybrid electric vehicles (HEVs). These circuits are found in a variety of EV/HEV applications including electrical energy storage (ESS), battery disconnect units (BDUs) and battery management systems (BMS). These high-voltage EV fuses support operation up to 500 VDC and feature a 20 kA at 500 VDC interrupting rating and an extended temperature range of -55 to +125 °C. Individual models within the PF-K Series have current ratings from 15 to 50 A and are available in bolt and PCB mounting options. In addition, the latest POWrFuse EV fuses have been tested to Bourns' internal automotive quality standards for environmental reliability, transient current cycling and device electrical and fusing characteristics. The Bourns POWrFuse Model PF-K Series models are available now and are RoHS compliant and halogen free.

Automotive Grade IHSR High Temperature Inductor
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Learn more:
vishay.com
  • Product Release
  • 2022-08-29

Vishay introduced the first AEC-Q200 qualified IHSR high temperature inductor with current ratings to 155 A in the 19.0 mm by 17.1 mm by 7.0 mm 6767 case size. Designed for multi-phase, high current power supplies and input / output filters in automotive under the hood and ADAS applications, the Vishay Dale IHSR-6767GZ-5A offers a 50 % reduction in DCR over typical power inductors and a smaller size than similar ferrite-based solutions. The Automotive Grade inductor is optimized for energy storage in DC/DC converters up to 5 MHz and high current filtering applications. With its high operating temperature up to +155 °C, the device is also suitable for filtering and DC/DC conversion in ADAS and LIDAR microprocessors, 12 V / 48 V vacuum-less braking systems, OBCs, and brushless DC electric motors up to 140 A. For these applications, the IHSR-6767GZ-5A's low typical DCR of 0.24 mO and inductance of 0.22 µH allow for higher current density than competing technologies, with no hard saturation and more stable inductance and saturation over the entire operating temperature range. Packaged in a 100 % lead (Pb)-free shielded, composite construction that reduces buzz noise to ultra low levels, the inductor offers high resistance to thermal shock, moisture, and mechanical shock, and handles high transient current spikes without saturation. The device is RoHS-compliant, halogen-free, and Vishay Green.

Device Modeling Software Enables One-Stop Workflow
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Learn more:
keysight.com
  • Product Release
  • 2022-08-25

Keysight Technologies announced a model generator (MG) environment that increases productivity for semiconductor device modeling engineers with improved automation across the entire workflow. Semiconductor device modeling engineers require automated tools to create accurate simulation models and process design kits (PDK) for baseband and radio frequency (RF) integrated circuit (IC) designs that leverage both silicon (CMOS) and compound III-V technologies. "Keysight's device modeling 2023 software suite addresses the needs of customers who generate high-quality SPICE models in limited time," said Ma Long, manager of device modeling and characterization at Keysight Technologies. "This new solution offers workflow and speed improvements and represents a significant advancement toward delivering a flexible and open environment that integrates all Keysight modeling technologies." 

Reliable Battery Management
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Learn more:
we-online.com
  • Product Release
  • 2022-08-25

With WE-BMS, Würth Elektronik presents signal transformers for battery management systems which, thanks to their galvanic isolation of 4300 VDC/1 min and high operating voltage of up to 1000 VDC, are ideal for use in energy storage systems, E-bikes or E-scooters. Besides the transformers, the WE-BMS series components also include at least one common-mode choke to filter common-mode interference. Würth Elektronik's design offers far longer physical creepage than comparable products on the market yet is very compact. Low-profile component variants of 3.45 mm height are also available. As the product code WE-BMS spells out, the transformers are absolutely optimized for battery management systems. They are primarily used to ensure reliable operation and provide information about the charging status. The individual cells of a battery pack are connected in series, as are the downstream BMS controllers. Voltage differences and electromagnetic interference may occur between series-connected components or boards. The WE-BMS transformer serves to isolate components from each other and suppress EMI. Applications include storage systems for solar installations or uninterrupted power supplies (UPS). As the WE-BMS series is AEC-Q200 qualified, it is also very well suited for E-mobility applications. WE-BMS supports serial daisy chain, isoSPI and SPI.

Dual-Channel Input with Integrated Boost SoC Li-Ion Battery Switching Charger
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Learn more:
halomicro.com
  • Product Release
  • 2022-08-23

Halo Microelectronics announced the release of its HL7090, a fully automatic and highly integrated lithium battery charging management IC with one switching charger, two linear chargers, and full-range programmable charge parameters through an I2C compatible interface. The HL7090 is a compact, flexible, and high-efficiency switching-mode charge management IC for single-cell Li-ion and Li-polymer batteries used in various IoT and wearable applications, including ear pods. The HL7090 integrates load switches to accommodate USB and wireless charging sources. Its integrated buck switching charger can operate in boost mode, which powers the linear chargers to charge two accessories simultaneously, ideal for earbud applications. The charge parameters can be programmed through the I2C interface (HL7090FN03 version). The IC integrates a synchronous PWM controller, power MOSFET, input current sensing, high-accuracy current, voltage regulation, and charge termination function into a tiny 3mm x 3mm QFN package. The HL7090 provides fully automatic three-phase battery charging control, including trickle charge, constant-current charge (CC), and constant voltage charge (CV) until the battery reaches the charge termination voltage. The input current is automatically limited to the value set by the host, and the charging is terminated based on the battery voltage and a user-selectable minimum current level. A safety timer with reset control provides a safety backup for the I2C interface.

High-Voltage Power Film Capacitor for DC Filtering Applications
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Learn more:
kyocera-avx.com
  • Product Release
  • 2022-08-23

KYOCERA AVX is celebrating the release of its 1,000th TRAFIM Series high-voltage power film capacitor for DC filtering applications up to 6,000VDC. TRAFIM Series capacitors are widely renowned for their high energy density and controlled self-healing technology, which ensures proven-safe, high-reliability performance over 100,000-hour lifetimes at rated voltage and 80°C hot spot temperature - and up to 240,000 hours with appropriate derating - in a wide range of high-voltage industrial, military, research, traction, power transmission, and renewable energy applications. TRAFIM Series capacitors feature large, rectangular, hermetically sealed, unpainted, and nonmagnetic stainless steel cases with volumes up to 46L and are currently available as 1,000 unique part numbers - including the newest model, TRAFIMA00, released in September 2021 - with 12 standard voltage ratings spanning 1,950VDC to 6,000VDC, capacitance values extending from 110µF to 10,600µF ±10% tolerance (standard), or ±5% or ±2% on request), and operating temperatures spanning -55°C to +95°C. The series also delivers high specific energy, up to 495J/L, and long-lifetime performance extending up to 100,000 hours at rated voltage and 80°C hot spot temperature with a 2% end-of-life capacitance reduction (?C/C) and up to 240,000 hours with appropriate derating. Its two standard case sizes measure 340mm x 117mm and 340mm x 165mm (L ´ W), are available with heights spanning 215mm to 815mm, and feature an integrated grounding nut. They are also available with two or four M8 or M17 female or M12 or M30 male terminals and with optional mounting brackets.

GaN FETs Alleviate Space Limitations to Achieve Higher Frequency and Power Rating
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Learn more:
epc-co.com
  • Industry News
  • 2022-08-23

Designing-in Efficient Power Conversion's 100 V FETs into BRC Solar's power optimizer has enabled a higher current density due to the low power dissipation and the small size of the GaN FET making the critical load circuit more compact. The small parasitic capacitance and inductance of the GaN FETs creates a clean switching performance which allows good EMI behavior in the field. Another benefit of the GaN FETs is the zero reverse recovery losses. BRC's previous range, the M400/12, handled currents up to 12 Amps and a maximum power operation at 400 watts. By changing from Si FETs to GaN FETs the company achieved an increase of output current to 14 Amps with a power rating of 500 watts – while keeping the same board size. Also, the switching frequency in the M500/14 is twice as high than the previous generation allowing for passive components, such as capacitors and inductors, to be decreased in value or even completely removed. Winona Kremb from BRC Solar Gmbh, commented, "EPC's eGaN FETs open a new horizon in the development of high-density power electronics. We will watch the further applications and products from EPC and are excited to be part of the journey." "Working with BRC has been an exciting design-in opportunity and, together with our distribution partner Finepower, we have been able to achieve great results moving the company from silicon to GaN. Designers using GaN can now take advantage of devices that are higher performance, smaller, more thermally efficient, and at a comparable cost," added Stefan Werkstetter, VP of Sales, EMEA at EPC.

Buck Switcher IC for Low-Part-Count Automotive PSUs
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Learn more:
power.com
  • Product Release
  • 2022-08-23

Power Integrations announced a high-current member of its LinkSwitch-TN2Q automotive switcher IC family which provides up to 850 mA of output current without the need for metal heatsinking. The integrated ICs support a wide input voltage of 30 to 550 VDC, enabling the devices to start up and operate below the required Safety Extra Low Voltage (SELV) threshold in functional safety EV applications. Edward Ong, senior product marketing manager at Power Integrations, said: "As electronics in electric vehicles grow more sophisticated, automotive customers need higher supply currents to drive them. The 850-mA rating for this new IC represents an increase of 230 percent in available output current compared with other members of the LinkSwitch-TN2Q family. LinkSwitch-TN2Q ICs reduce part-count by including control, driver, protection circuitry and a 750 V power MOSFET in an SMD package." LinkSwitch-TN2Q ICs are AEC-Q100 qualified and support buck, buck-boost and non-isolated flyback converter topologies. Each device incorporates a 750 V power MOSFET, oscillator, on/off control, a high-voltage switched current source for self-biasing, frequency jittering, fast (cycle-by-cycle) current sensing and current limit, hysteretic thermal shutdown, and output over-voltage protection circuitry in a monolithic IC. LinkSwitch-TN2Q ICs consume very little current in standby, resulting in power supply designs that easily meet less than 50 mW no-load at 400 VDC input. Comprehensive protection features enable safe and reliable power supplies, including protection against input and output overvoltage, device over-temperature, lost regulation, and power supply output overload or short-circuit faults.

Supplier Base for Silicon Carbide Wafers
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Learn more:
infineon.com
  • Industry News
  • 2022-08-23

Infineon Technologies and II-VI Incorporated have signed a multi-year supply agreement for silicon carbide (SiC) wafers. The German-based semiconductor manufacturer is thus securing further access to this strategic semiconductor material to meet the strong increase in customer demand in this area. The agreement also supports Infineon's multi-sourcing strategy and increases its supply chain resilience. The first deliveries have already taken place. As strategic partners, II-VI and Infineon are also collaborating in the transition to 200mm SiC diameter wafers. "SiC compound semiconductors set new standards in power density and efficiency. We are leveraging them to deliver on our strategy of decarbonization and digitalization," said Angelique van der Burg, Chief Procurement Officer at Infineon. "Infineon is increasing investments in its SiC manufacturing capacity to meet the rapidly growing demand from our customers. We are pleased to add II-VI to our strategic supplier base and grow our business together." Infineon expects its SiC semiconductor sales to grow by more than 60 percent on average per year, reaching approximately $1 billion by mid-decade. For the second half of the decade, Infineon expects on-going growth momentum, for which it invests in its recently announced additional manufacturing block in Kulim, Malaysia.

600 V Ultrafast Rectifiers in TO-244 Package
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Learn more:
vishay.com
  • Product Release
  • 2022-08-22

Vishay introduced four FRED Pt Gen 5 600 V Ultrafast rectifiers in the TO-244 package. The 240 A, 300 A, 480 A, and 600 A Vishay Semiconductors rectifiers are designed to increase the efficiency of medium frequency power converters and of hard- and soft-switched or resonant designs. Compared to competing FRED Pt Ultrafast solutions in the TO-244 package, the devices offer lower conduction, while maintaining low reverse recovery losses. The result is improved efficiency for industrial applications, such as high frequency welding and ballast water management systems. Delivering high speed, high temperature operation for these applications, the VS-VS5HD240CW60, VS-VS5HD300CW60, VS-VS5HD480CW60, and VS-VS5HD600CW60 offer low Qrr down to 260 nC typical, fast recovery time down to 52 ns, and an operating temperature range up to +175 °C.

Green Light for Joined Company
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Learn more:
semikron.com
  • Industry News
  • 2022-08-22

SEMIKRON and Danfoss Silicon Power are joining forces to establish the ultimate partner in power electronics. On August 22, less than five months after it was first announced, Semikron Danfoss started doing business. With an existing workforce of more than 3,500 dedicated power electronic specialists, Semikron Danfoss will provide technology expertise to its loyal customer base. The merger comes with a strong growth plan and a firm commitment to future investments, paving the way for green growth and a more sustainable, energy efficient, and decarbonized future. The newly formed Semikron Danfoss joint business will be owned by the current owner-families of SEMIKRON and the Danfoss Group, with Danfoss being the majority owner. Semikron Danfoss will retain the two main locations in Germany, Nuremberg and Flensburg. All global subsidiaries, production sites, as well as distribution channels will continue. Claus A. Petersen, has been appointed CEO of Semikron Danfoss. "Semikron Danfoss will inspire the future. The timing of the new company is perfect. With strong growth in our key markets – automotive, industry and renewables – the merger is a great opportunity for customers, partners, and our employees. Also, with the emerging technology transition from Silicon to Silicon Carbide, we are set to become the strongest partner of our customers."

GaAs Power Semiconductors Ready for Volume Production
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Learn more:
3-5pe.com
  • Industry News
  • 2022-08-20

In the past few months, 3-5 Power Electronics GmbH has fulfilled the prerequisites for the market launch of new types of power semiconductors. For the diodes made of gallium arsenide (GaAs), high efficiency of both product properties and manufacturability have been demonstrated in extensive tests. The electronic components are ideally suited for applications in the fields of renewable energy and electromobility. 3-5 Power Electronics has established its development and production site in the Dresden Technology Center. The company deals with novel semiconductors for power electronics. The development team, which has now grown to ten highly specialized engineers, has succeeded in conditioning the widely used semiconductor material gallium arsenide (GaAs) so that it can be used to build diodes for switching high voltages and currents. Electrical characteristics evaluations confirm higher efficiency compared to commonly used silicon diodes. An additional positive aspect results from a significantly more cost-effective manufacturing technology compared to silicon carbide diodes. The currently available devices are the result of a joint project with Saxon companies and research institutes funded by the German Federal Ministry of Economics. "The most important motivation for locating our company in Dresden is the very compressed research and service landscape in the field of semiconductor technology" says Dr. Volker Dudek, the managing director responsible for R&D processes.

SiC Epitaxy Substrate Prep Solution
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Learn more:
oxinst.com
  • Industry News
  • 2022-08-19

Oxford Instruments Plasma Technology announce an alternative method of preparing SiC substrates for epitaxy. Plasma polishing for SiC substrates has been demonstrated as a HVM compatible alternative to Chemical Mechanical Planarization (CMP), while alleviating significant technical, environmental and supply-chain issues associated with CMP. The Oxford Instruments' Plasma Polish Dry Etch (PPDE) process is a direct plug and play replacement for CMP and easily integrates into existing process flows. CMP has been the process of record for SiC substrate preparation for many years, but suffers from undesirable operational issues and the industry as a whole is struggling to meet increasing demand for SiC substrates. Operating CMP in SiC substrate fabs has a large environmental footprint due to the semi-toxic slurry biproduct, and the heavy water usage that the process demands is wasteful. In addition, the polishing pads and speciality chemicals bring significant consumable cost in a challenging supply chain environment. Furthermore, the CMP process is inherently unstable as slurry chemicals and polishing pads are consumed, introducing drift into the process line. PPDE is a stable non-contact process, which reduces handling loss and allows for the processing of thinner wafers, producing more wafers per boule and enabling the progression to 200mm SiC substrates. 

Fuseholder for Through-Hole Reflow
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Learn more:
schurter.com
  • Product Release
  • 2022-08-18

The SCHURTER OGN fuseholder is a product that has proven itself over decades and has been continuously improved and expanded with new variants. It started with a THT version (Through-Hole Technology), followed by one for SMT (Surface-Mounting Technology). Now SCHURTER is introducing a third option, which closes the last gap: THR (Through-Hole Reflow). Highly integrated electronic circuits are almost exclusively assembled with SMT components and soldered in a reflow oven. However, it is sometimes necessary to include THT components on the circuit board. This has a decisive disadvantage: THT components need to be soldered differently, a second soldering process is necessary. In fact, THR components are through-hole components. They are specially designed for automated assembly and high thermal stress in the reflow oven. During the assembly process, a paste is first printed into the vias for the THT pins, and then the component is pushed through the solder paste. As the paste melts in the reflow oven, the liquid solder retracts into the vias due to wetting and capillary forces and forms the solder joint. The open fuseholder OGN is designed for 5x20 fuses of various types. It naturally complies with the tightened rules of glow wire resistance according to IEC 60335-1. If desired, it can be converted into a closed fuse holder by means of an optionally available cover.

Flux-Cored Wire for Robotic and Manual Soldering
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Learn more:
indium.com
  • Product Release
  • 2022-08-17

Indium Corporation announces that it is now offering CW-818, a no-clean, high-reliability flux-cored wire designed to minimize cycle times in manual and robotic soldering processes while delivering top tier soldering speed and spread. Designed to meet the requirements of manual and robotic soldering processes, Indium Corporation's halide-free CW-818 combines superior soldering speed and spread with improved overall cleanliness (with clear/light-colored residue, charring resistance, and spatter control technology) to deliver a flux-cored wire with enhanced cleanliness, even at higher soldering iron tip temperatures. CW-818 excels in manual and robotic soldering applications where the J-STD-004C high-reliability category is desired or required; or applications where extra wetting power is needed to achieve a higher throughput. 

Advanced-industries Distributor Appoints David Nash as Sales Director
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Learn more:
princeps.co.uk
  • People
  • 2022-08-17

Princeps has appointed David Nash as Sales Director. Nash will spearhead the company's sales growth as demand surges across its whole customer base in the aerospace, defence, medical, energy, oil & gas, and transportation sectors. Against continued shortages of electronic, e-mech and electrical components, Princeps specialises in supplying hard-to-source, fully-traceable, guaranteed parts and takes full responsibility for counterfeit mitigation. Nash has a 23-year background in the electronics industry, having worked for two independent distributors in the sector and most recently for franchised distributor Powell, where he successfully drove sales of its EMech commodity ranges throughout the EMEA market. Nash comments: "Princeps' reputation and commitment to growth, aligned with its ethos of unparalleled customer service, were the driving factors behind my decision to join the company. I am looking forward to opening up additional revenue streams by bringing in new manufacturers and forging new distribution agreements which will strengthen and diversify our line card. Our market presence and profile will be heightened over the coming months, principally by capitalizing on our capabilities across all sectors, with a special focus on helping mil aero customers by utilizing our Assure and Assure + service." 

Ribbon Cutting of Product Distribution Center Expansion
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Learn more:
digikey.com
  • Industry News
  • 2022-08-17

Digi-Key Electronics celebrated the ribbon cutting of its Product Distribution Center expansion (PDCe), expanding the company's headquarters' footprint by 2.2 million square feet for a combined total of more than 3 million square feet. The facility allows Digi-Key to pick, pack and ship nearly three times the previous daily average of 27,000 packages to customers in more than 180 countries around the world. Digi-Key celebrated the opening event with an official cutting of tape from a Digi-Reel and ceremonial first package handoffs to each of the company's four carrier partners: DHL, FedEx, UPS and USPS. Remarks were given by Digi-Key President Dave Doherty, Minnesota Department of Employment and Economic Development (DEED) Commissioner Steve Grove, Thief River Falls Mayor Brian Holmer and several other Digi-Key executives, as well as video messages from U.S. Senator Amy Klobuchar and Minnesota Governor Tim Walz. "This is a significant milestone for all Digi-Key employees and our community," said Dave Doherty, president of Digi-Key. "Our new product distribution center expansion will help us continue to deliver excellence to our customers for many years to come. As exciting as this expansion is for us, our hope is that our customers truly don't notice a difference – the transition for them should be seamless, and if anything, result in an even better customer service experience than they are already accustomed to. For us, it's deeper roots in Thief River Falls and a commitment to continue investing in this community and the state of Minnesota."

Inductive Tablet System Solution for CT Scanners
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Learn more:
etatronix.de
  • Industry News
  • 2022-08-15

etatronix developed the inductive charging solution for the mobile workflow tablet of the Somatom X.cite computer tomography line for Siemens Healthineers. Both the electronics and the required plastic enclosure were developed by etatronix. The input is fed from 24VDC. At the output there is a USB Type-C connection with a variable output voltage (5V-20V) and a power of up to 60W. There is also a 15W version available. The power is transmitted without contact over a distance of up to 12.5mm. The efficiency reaches values ??of up to 92%. Customer-specific interfaces (e.g. CAN) and parallel data transmission are also available. Particularly high demands were placed on the magnetic field limit values. As an example, common systems measure the magnetic field at a defined distance of 20cm. Due to the fact that the user touches the tablet, the magnetic field has been reduced to such an extent that it stays below common limits also at the surface of the tablet-screen. Another requirement for this turnkey task was global module approval, which provides Siemens Healthineers the advantage of a facilitate market introduction when used in several devices. The system complies with radio approvals such as e.g. CE (RED), FCC and ICED to name a few. In this project, etatronix supplies everything from a single source. From development to prototypes, global product approvals, series production and after-sales service.

Smart Gate Driver Photocoupler for IGBT and MOSFET Control
  • Product Release
  • 2022-08-11

Toshiba Electronics Europe has launched a ±2.5A output smart gate driver photocoupler able to control IGBTs and MOSFETs, reliably protecting power devices from over-current. The device is suited to a wide range of applications including inverters, AC servo drives, photovoltaic (PV) inverters and uninterruptible power supplies (UPSs). The TLP5212 features a new totem pole output with two N-channel MOSFETs, to ensure compatibility with specifications widely used in applications such as industrial equipment. In addition, the new photocoupler incorporates protection functions such as desaturation detection, active Miller clamp, UVLO and FAULT output, eliminating the need for several external circuits. This reduces system costs for fault detection and protection as well as saving space and design effort. Moreover, by incorporating Toshiba's own reliable and powerful infrared LED, it can be used in severe thermal environments. The TLP5212 can sink or source up to ±2.5A via its totem pole output. With its propagation delay of just 250ns (max.) and propagation delay skew of ±150ns, the device is suited to use in high-speed applications. The operating temperature range (Ta) is -40°C to +110°C, ensuring suitability for industrial and renewable energy use. Housed in a small SO16L package, the photocoupler measures just 10.3mm x 10.0mm x 2.3mm, allowing it to be used where space is tight. Even with this compact package, it features a minimum creepage distance of 8mm, allowing it to be used for applications requiring high levels of safety isolation and insulation (BVs = 5000Vrms).

Expansion of Silicon Carbide Production Facility in New Hampshire
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Learn more:
onsemi.com
  • Industry News
  • 2022-08-11

onsemi celebrated the inauguration of its silicon carbide (SiC) facility in Hudson, New Hampshire with a ribbon cutting ceremony. Signifying the importance of this event and manufacturing of semiconductors in the U.S. were the attendance of multiple guests of honor led by U.S. Secretary of Commerce Gina Raimondo. The site will increase the company's SiC boule production capacity by five times year-over-year and almost quadruple the number of its employees in Hudson by the end of 2022. The expansion gives onsemi full control of its silicon carbide manufacturing supply chain, starting with the sourcing of silicon carbide powder and graphite raw material to the delivery of fully packaged SiC devices. This allows onsemi to provide its customers with the assurance of supply required to meet rapidly growing demand for SiC-based solutions. SiC is critical for enabling efficiency in electric vehicles (EVs), EV charging, and energy infrastructure and is an important contributor on the path to decarbonization. The SiC total addressable market is projected to grow from $2B in 2021 to $6.5B in 2026, at a compound annual growth rate of 33%. "In addition to market-leading efficiency of our products, our end-to-end vertically integrated solution in a supply-constrained environment is a compelling and differentiated competitive advantage," said Simon Keeton, executive vice president and general manager Power Solutions Group at onsemi.

PCIM Asia 2022 to be Postponed
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Learn more:
pcimasia-expo.cn
  • Event News
  • 2022-08-11

The organisers of PCIM Asia made the decision to defer the fair in view of current circumstances regarding the pandemic in Shanghai. Originally scheduled to open from 31 August – 2 September at the Shanghai New International Expo Centre, new dates for the exhibition and conference will be announced in due course. Mr Louis Leung, Deputy General Manager of Guangzhou Guangya Messe Frankfurt Co Ltd, outlined the rationale behind the postponement: "With the evolving situation of the pandemic and the well-being of our exhibitors and participants in mind, we have chosen to postpone PCIM Asia. Our co-organisers and supporters of the fair and conference, as well as our exhibitors are all on-board with this decision. They believe, as do we, that it is better to host the event at a later date in order to give all parties concerned the confidence that it will go ahead with minimal disruption. Finally, I'd like to express our gratitude to all participants for their understanding and support."

40V-Rated Automotive-Compliant Synchronous Buck Converter
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Learn more:
diodes.com
  • Product Release
  • 2022-08-10

Diodes Incorporated has announced a further addition to its family of automotive-compliant DC-DC converters. The DIODESAP64060Q is a 600mA synchronous buck converter device with an input voltage range that covers 4.5V to 40V. It incorporates a 600mO high-side power MOSFET plus a 300mO low-side power MOSFET so that high-efficiency step-down conversion (reaching 90%) can be delivered, and with minimal PCB board space. The AP64060Q is targeted for use in automotive powertrains, infotainment systems, and instrumentation clusters, as well as vehicles' exterior lighting. The AP64060Q has a very low quiescent current (IQ), typically only 90µA, which translates into enhanced light load efficiency. Thanks to the fast switching frequencies this device supports (2MHz), smaller accompanying inductors and capacitors can be selected. Its synchronous rectification eliminates the need for an external Schottky diode, while use of a peak current mode control and built-in loop compensation network further reduces the overall component count. The proprietary gate driver scheme employed in the AP64060Q alleviates switching node ringing without impacting on MOSFET turn-on and turn-off times. This mitigates high frequency radiated electromagnetic interference (EMI) noise caused by MOSFET switching. The AP64060Q has an operating ambient temperature range of -40°C to +125°C. Protection features include overvoltage protection (OVP), undervoltage lockout (UVLO), and thermal shutdown. This device is supplied in a compact TSOT26 package.

Integrated Drive Modules for Hyundai Motor Company
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Learn more:
borgwarner.com
  • Industry News
  • 2022-08-10

BorgWarner's integrated drive module (iDM) has been selected by Hyundai Motor Company (HMC) to power an additional A-Segment electric vehicle platform, scheduled to start production in the third quarter of 2024. This business was awarded based on BorgWarner's advanced iDM technology, its prior iDM win with HMC on another A-segment electric vehicle, and the longstanding relationship between the two companies. "Our partnership with the Hyundai Motor Company spans two decades, and we're delighted to continue our relationship by supplying our latest technology for the company's newest electrification project," said Dr. Stefan Demmerle, President and General Manager, BorgWarner PowerDrive Systems. "Our iDM proved an ideal fit for the customers' electric propulsion system during our first EV collaboration, and we look forward to contributing industry-leading electrification solutions to assist the company in meeting its future sustainability goals."  BorgWarner's iDM146 is comprised of an interior permanent magnet (IPM) electric motor of 146mm stator outer diameter equipped with high voltage hairpin (HVH) technology for high power density and efficiency as well as a BorgWarner inverter with a Viper power module, both integrated with a quiet and efficient reduction gearset. Designed for 400V systems, the unit typically produces a peak power output of 135kW, although its modular design allows power and torque output to be scaled specifically to customer requirements.

35 A GaN Stage IC Boosts Power Density and Simplifies Design
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Learn more:
epc-co.com
  • Product Release
  • 2022-08-10

EPC announces the introduction of a 100 V, 35 A integrated circuit designed for 48 V DC-DC conversion used in high-density computing applications and in 48 V BLDC motor drives for e-mobility, robotics, and drones. The EPC23102 eGaN IC is capable of a maximum withstand voltage of 100 V, delivering up to 35 A load current, while capable of switching speeds greater than 1 MHz. Key features of the EPC23102 integrated circuit using EPC's proprietary GaN IC technology include integrated input logic interface, level shifting, bootstrap charging and gate drive buffer circuits controlling 6.6 mOhm RDS(on) high side and low side FETs configured as a half-bridge power stage. The EPC23102 features a thermally enhanced QFN package with a footprint of just 3.5 mm x 5 mm, offering an extremely small solution size for the highest power density applications. When operated in a 48 V to 12 V buck converter, the EPC23102 delivers greater than 96% peak efficiency at 1 MHz switching frequency and around 8 – 17 A of continuous load current with a rated current of 35 A. "The ePower family of products makes it easy for designers to take advantage of the significant performance improvements made possible with GaN technology," said Alex Lidow, CEO and co-founder of EPC." Integrated devices are easier to design, easier to layout, easier to assemble, save space on the PCB, and increase efficiency. Designers can use these devices to make lighter weight and more precise BLDC motor drives, higher efficiency 48 V input DC-DC converters, higher fidelity class-d audio systems, and other industrial and consumer applications."

CHIPS and Science Act Will Lower Costs, Create Jobs, and Strengthen Supply Chains
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Learn more:
whitehouse.gov
  • Industry News
  • 2022-08-09

US-President Biden signed into law the bipartisan CHIPS and Science Act of 2022, making historic investments that will poise U.S. workers, communities, and businesses to win the race for the 21st century. It will strengthen American manufacturing, supply chains, and national security, and invest in research and development, science and technology, and the workforce of the future, including nanotechnology, clean energy, quantum computing, and artificial intelligence. Spurred by the passage of the CHIPS and Science Act of 2022, companies have announced nearly $50 billion in additional investments in American semiconductor manufacturing. The CHIPS and Science Act aims to boost American semiconductor research, development, and production, ensuring U.S. leadership in the technology that forms the foundation of everything from automobiles to household appliances to defense systems. The law will also ensure the United States maintains and advances its scientific and technological edge. In the mid-1960s, at the peak of the race to the moon, the federal government invested 2 percent of GDP in research and development. By 2020, that number had fallen to less than 1 percent. Economic growth and prosperity over the last 40 years has clustered in a few regions on the coasts, leaving far too many communities behind. The CHIPS and Science Act will ensure the future is made in all of America, and unlock opportunities in science and technology for those who have been historically left out.

GaN ICs Save First 100,000 Tons of CO2 Emissions
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Learn more:
navitassemi.com
  • Industry News
  • 2022-08-04

Navitas Semiconductor has announced the first saving of 100,000 tons of CO2 emissions as GaN replaces legacy silicon chips to "Electrify Our World". GaN uses up to 10x-lower CO2 footprint to manufacture and ship compared to silicon, while reducing the end-application CO2 footprint up to 30%. Each GaN power IC shipped saves net 4 kg CO2 in comparison, and GaN offers the potential to address a reduction of 2.6 Gtons CO2/yr by 2050 – equivalent to the CO2 generated by over 650 coal-fired power stations, over six billion barrels of oil, over 560 million ICE passenger cars – or the annual electricity use of over 470 million homes. 100,000 tons is a conservative estimate of cumulative customer savings in CO2 emissions, based on Navitas' unit shipments, and third-party life-cycle assessment (LCA) of a 65W USB-C charger example. This also considers a six-month delay, accounting for shipping inventory and customer assembly. Navitas completed a comprehensive analysis working together with EarthShift Global and completed an ISO14040/14044-compliant comparative LCA report quantifying the benefits of Si power semiconductor components vs GaN power ICs and USB-C chargers using GaN power IC products. "The analysis shows that GaN power ICs provide a step-function improvement in environmental impacts over the incumbent Si solutions. As Navitas converts the world from Si to GaN over the next 5-10 years, the sustainability benefits will become significant in achieving global customer and nation net-zero goals", states Anthony Schiro, VP Quality and Sustainability at Navitas. 

Demonstration Platform Accelerates the Design of Economical Micro-power Management
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Learn more:
trameto.com
  • Product Release
  • 2022-08-04

Trameto announces a demonstration platform that enables engineers to quickly evaluate how micro-energy harvesting can reduce or eliminate the use of batteries in IoT devices such as sensors and the wireless modules to which they may be connected. It is based on Trameto's OptiJoule technology and uses an engineering sample of the TM2040, a four-input, smart EH PMIC from the product family. Up to four harvesters of the same or mixed types can be connected to any of its inputs without additional interface components, providing the simplest, most effective, and most economical way to cut battery dependency in wireless IoT applications. The demonstration platform includes two photovoltaic harvesters, a piezoelectric harvester with a DC motor to generate vibration for it, two thermoelectric generators, and a heater and heatsinks to provide a stimulus for the thermoelectric generators. Each harvester produces microjoules to millijoules of energy and easily connects to the main platform using plugin daughterboards. Uniquely, each of the TM2040's inputs will adapt autonomously to the type of harvester connected to it. The chip then optimizes each harvester's output using patented circuits that also dynamically combine the maximum available energy from all the connected harvesters. The optimized output delivers a controlled charge to an energy-storage component which is then automatically switched via the EH PMIC to power an IoT device with a 1.8V DC, regulated supply at up to 15mA.

500W DC/DCs for E-Mobility Applications
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Learn more:
recom-power.com
  • Product Release
  • 2022-08-03

RECOM Power announces the release of a range of DC/DC converters for E-mobility applications. With the push for zero-emission transport, electric propulsion is the ideal solution for off-highway vehicles and they invariably require DC/DC converters to generate isolated auxiliary power rails from the traction battery. The compact and cost-effective RMOD500-W range introduced is perfect for the application as the products are IP67-rated, fully sealed against moisture and dust including connectors and can therefore be fitted in any unprotected area of the vehicle. The RMOD500-W is rated at 500W with an input range covering 32-96V for nominal 48V, 60V, 72V and 80V batteries. Outputs available are: 13.7V, 13V, 12.4V, 11.7V, 24.5V and 23.5V and parallel operation is possible for higher power applications. Certified isolation is provided, at 2.25kVDC and ambient operating temperature range is from -40°C to 90°C. The RMOD500-W is designed for easy plug-and-play chassis-mounting installation with standard connectors and is sized 198 x 113 x 45mm including connectors. Protection features make the parts rugged in the application and include input reverse polarity and under-voltage, over-temperature, output over-current/short circuit and output over-voltage. The range has been qualified to standards for EMC, radiation, shock/vibration, thermal shock/temperature cycling, salt mist, water/dust ingress and safety.

Awarded '2021 Best Performing Distributor in EMEA'
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Learn more:
avnet.com
  • Industry News
  • 2022-08-01

EBV Elektronik has been recognised by STMicroelectronics as the "2021 Best Performing Distributor in EMEA". Since 2017, EBV has been consistently awarded ST's leading demand creation distributor in EMEA and in 2021 also took over the top spot for POS, resulting in the accolade for Best Performing Distributor in EMEA. "This is a very nice success story for both companies," said Frank Wolinski, VP Channel Sales EMEA at ST. "I am absolutely convinced that the trusted cooperation between our companies is the biggest differentiator and the main reason for this success. Thanks to the entire EBV team for their continuous efforts and especially for their never-ending willingness to win and grow with ST." "We are immensely proud to not only have held the leading position as ST's demand creation distributor for four years running but also to take this position in POS as well," said Thomas Staudinger, President at EBV Elektronik. "It is a clear demonstration of our reputation, technical ability, and collaborative approach that has led to us being awarded the 2021 Best Performing Distributor in EMEA. We are confident to continue this successful relationship in the upcoming years." EBV is a franchised distribution partner of ST, a semiconductor specialist serving customers across the spectrum of electronics applications, since 2006.

Preamplifier 10 MHz up to 22 GHz
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Learn more:
langer-emv.de
  • Product Release
  • 2022-07-27

The PA 2522 preamplifier from Langer EMV-Technik provides meaningful measurement results, even with low input signals. Obtaining informative results from an EMC measurement often fails because the measurement levels are too low or because the measurement tools used are not sensitive enough. Support is now offered by the PA 2522 preamplifier with its amplification of 25 dB. The PA 2522 amplifies low measurement signals over an extremely wide frequency range from 10 MHz to 22 GHz - with very low noise and a constantly high dynamic range. This means that sources of interference with very low levels can now be clearly detected on measuring equipment. The signal amplifier, which is handcrafted in Germany, is a consistent further development for EMC applications. In combination with a matching near-field probe, e.g. from Langer EMV-Technik, it is possible to perform harmonic measurements of high-frequency signals up to 22 GHz. With its compact design, the PA 2522 can be integrated into development environments in a versatile way. Directly connected to the 50 O input of a spectrum analyzer or oscilloscope the preamplifier simultaneously protects sensitive measuring equipment from overvoltage. The PA 2522 is powered by the supplied plug-in power supply.

Innovation Award for Jetting, Microdispensing Paste
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Learn more:
indium.com
  • Industry News
  • 2022-07-27

Indium Corporation earned Electronics Manufacturing (EM) World's Innovation Award for Indium12.8HF, a versatile solder paste engineered to deliver exceptional jetting and microdispensing performance on a variety of systems. The EM Innovation Award program recognizes and celebrates excellence in the electronics industry, encouraging companies to achieve the highest standards and push the industry forward. "We are honored to have Indium12.8HF recognized by EM World," said Evan Griffith, product specialist. "As miniaturization continues its spread throughout all corners of the industry, more applications must adapt to finer pitches and smaller packages with paste deposits which may be unachievable by stencil printing. It's critical to Indium Corporation that we produce innovative, proven products that provide solutions to the current and emerging challenges."

Current Transducer for High Frequency Applications
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Learn more:
danisense.com
  • Product Release
  • 2022-07-26

Danisense is introducing its DW series of closed-loop compensated zero-flux current transducer measuring up to 500A and offering excellent accuracy with 10ppm linearity and low offset at 15 ppm. To meet the increased requirements in terms of high frequency coming from the latest power conversion products based on wide bandgap semiconductor technologies such as gallium nitride (GaN) and silicon carbide (SiC), Danisense has revised its winding processes and now achieves an exceptionally wide bandwidth of up to 10MHz with its latest DW500UB-2V product. DW series devices benefit from a full aluminium body for superior EMI shielding and a wide operating temperature range from -45°C up to +40°C. A very high power measurement accuracy, low noise and an industry standard BNC connection are further features. The main target application is power measurement in laboratories for the design optimization of power converters – typically for e-mobility applications. DW series current transducers can also be used for power measurement and power analysis for stable power supplies, MPS for particles accelerators, gradient amplifiers for MRI devices, precision drives, battery testing and evaluation systems and current calibration purposes.

SiC Devices Support Bi-directional Inverter to Let EV's Become Backup Power
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Learn more:
infineon.com
  • Product Release
  • 2022-07-26

CoolSiC products from Infineon Technologies are adopted by Delta Electronics to allow for a big step towards energy transition and carbon neutrality with green power. With the successful development of bi-directional inverters, a hybrid three-in-one system that integrates solar, energy storage and charging of electric vehicles (EV), Delta is enabling EVs to become an household emergency backup power. The bi-directional inverter can be used to supply power to charge electric vehicles (EVs) and home batteries, while acting as a backup power for unexpected outages and a green energy control core. Products from Infineon include the 1200 V M1H CoolSiC EasyPACK 1B modules and 1200 V CoolSiC D²PAK 7-pin, a surface mount device. The integration of three applications is also a milestone. This three-in-one system was realized in a compact package of just 425 x 865 x 160 mm 3. With an output power of about 10 kW, the system allows a maximum continuous current of 34 A and achieves peak efficiencies of more than 97.5 percent. One of the essential elements for creating the three-in-one system includes the1200 V M1H CoolSiC EasyPACK 1B module with integrated NTC temperature sensor and PressFIT contact technology. The module offers maximum flexibility and high-current density. With package technology combined with CoolSiC MOSFETs, the module features a low-inductive design with minimal switching and conduction losses. Furthermore, high-switching frequency operation is enabled on the customer side, which allows for smaller system designs.

Wafer-level MOSFETs Save Power and Simplify Thermal Management
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Learn more:
nexperia.com
  • Product Release
  • 2022-07-26

Nexperia has introduced the PMCB60XN and PMCB60XNE 30V N-channel small-signal trench MOSFETs in the ultra-compact wafer-level DSN1006 package, to make energy go further where space is tight and battery runtime is critical. Ideal for highly miniaturized electronics like smartphones, smart watches, hearing aids, and earphones, the MOSFETs support the trend towards greater intelligence and richer functionality that raise system power demand. With RDS(on) up to 25% better than competing devices, they minimize energy losses and increase efficiency in load switching and battery management. Their performance also reduces self heating thereby enhancing user comfort in wearable devices. Specifically, the PMCB60XN and PMCB60XNE have maximum RDS(on) of 50mO and 55mO respectively, at VGS = 4.5V. This gives them the lowest on-resistance per die area among similar 30V MOSFETs in the market. In addition, the PMCB60XNE comes with ESD protection rated to 2kV (human body model – HBM) integrated in the tiny 1.0mm × 0.6mm × 0.2mm DSN1006 outline. Both MOSFETs are rated for drain current up to 4A. In addition to these two MOSFETs in DSN1006, Nexperia has also introduced the PMCA14UN, a 12V, N-channel trench MOSFET in a DSN1010 package. With max RDS(on) of 16mO at VGS = 4.5 V, the PMCA14UN delivers efficiency in the 0.96mm × 0.96mm × 0.24mm (SOT8007) outline.

750V SiC FET Portfolio for Power Designs
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Learn more:
unitedsic.com
  • Product Release
  • 2022-07-26

Qorvo announced seven 750V silicon carbide (SiC) FETs in the surface mount D2PAK-7L package. With this package option, Qorvo's SiC FETs are tailored for the rapidly growing applications of onboard chargers, soft-switched DC/DC converters, battery charging (fast DC and industrial) and IT/server power supplies. They deliver an optimal solution for high-power applications that require maximum efficiency, low conduction losses and excellent cost effectiveness in a thermally enhanced package. Highlighted by an RDS(on) of 9 milliohms (mohms) at 650/750V, the Gen 4 UJ4C/SC series is rated at 9, 11, 18, 23, 33, 44 and 60 mohms. This wide selection provides engineers with more device options, enabling greater flexibility to achieve an optimum cost/efficiency balance while maintaining generous design margins and circuit robustness. Leveraging a unique cascode SiC FET technology in which a normally-on SiC JFET is co-packaged with a Si MOSFET to produce a normally-off SiC FET, these devices deliver a best-in-class RDS x A figure of merit, resulting in the lowest conduction losses in a small die. Anup Bhalla, chief engineer at UnitedSiC (now Qorvo), said, "The D2PAK-7L package reduces inductance from compact internal connection loops which - along with the included Kelvin source connection - results in low switching loss, enabling higher frequency operation and improved system power density. These devices also feature silver-sinter die attach, resulting in very low thermal resistance for maximum heat extraction on standard PCBs as well as IMS substrates with liquid cooling."

Mode Choke Solution with Nanocrystalline Metal Core
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Learn more:
kemet.com
  • Product Release
  • 2022-07-26

KEMET announces its SCF-XV series of AEC-Q200 qualified common mode chokes. This series fulfills the growing need for high voltage automotive and harsh environment industrial EMI filtering applications. The SCF-XV series offers up to 1,000 V AC/DC, the highest rated voltage. The nanocrystalline metal core results in a reduced footprint, rated current range from 5 to 35 A, DCR from 0.65 to 40.3 mO, an operating temperature from -40°C to +150°C, two different layouts (vertical/horizontal), and three different outer core diameters (19/25/29 mm). The toroidal coils are designed with nanocrystalline metal cores and are useful in various noise countermeasure fields. These features position SCF-XV as an exceptional EMI suppression solution. This series addresses design engineers' needs with a wide variety of characteristics for automotive and harsh environment industrial applications (robotics, high voltage power supplies, high reliability) and completes KEMET's already existing automotive-grade common mode chokes portfolio including SCR-XV and SCT-XV. Many solutions comparable to the SCF-XV use ferrite coils, are not always AEC-Q200 qualified, have a maximum 750 V AC/DC, and have a larger footprint. With a rated 1,000 V AC/DC and AEC-Q200 qualified, this series, together with SCR-XV and SCT-XV, is ideal for use in the EV automotive market. This series supports the industry's trend to increase the vehicle-installed Lithium-ion battery pack voltage to limit drive train currents. With its space-saving and high characteristics, this series also addresses the trend of miniaturization and operation in harsh environmental conditions. Applications include onboard chargers for EV/PHEV, E-compressors, wireless charging systems with 85 kHz, medium power drives for power steering, air conditioning, and mild hybrid 48 V systems.

Hybrid Flyback Controller Combined with GaN IPS in Charger Designs
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Learn more:
infineon.com
  • Product Release
  • 2022-07-25

Infineon Technologies combines the hybrid flyback (HFB) controller XDP digital power controller XDPS2201 and the CoolGaN integrated power stage (IPS) 600 V (IGI60F1414A1L) for high-efficiency and high-power density charger and adapter designs. Anker has chosen Infineon's HFB controller and the CoolGaN IPS for fast chargers above 100 W. "By combining Infineon's hybrid flyback controller with an integrated CoolGaN device in Anker's new charging lineup, we achieved an outstanding system-level efficiency beyond 95 percent," said Adam White, Division President of Infineon's Power and Sensor Systems Division. "This architecture reduces energy loss by 21 percent compared to other charging solutions. It is the first time that Infineon's HFB controller and CoolGaN IPS devices are combined and applied commercially in the consumer electronics market." "GaN has completely changed the way we charge our electronics by delivering superior power transfer efficiency, faster-charging speeds and improved portability to our chargers," said Steven Yang, CEO of Anker Innovations.

Portfolio of Trans-Inductor Voltage Regulators
  • Product Release
  • 2022-07-25

ITG Electronics has introduced a line of Trans-inductor Voltage Regulators (TLVRs). The solutions include the company's AHA series of TLVT coupling inductors, as well as its L10142 Series and SLA2843B series compensation inductor in the LC circuit of TLVR application. ITG Electronics' AHA series of coupling inductors offers a broad range of options. For example, the AHA3740A is a ferrite-based TLVR inductor with low core loss and an inductance range of 70-150nH, with customized values possible. The product offers high current output chokes up to 125 amperes with approximately 20% roll off. The compact component has a maximum height of just 10mm, and measures only 9.6 x 6.4mm. Narrowed body version TLVR inductor such as AHA40475A and AHA47475A Series are developed for future 4x6mm powerstages application. ITG Electronics' selection of compensated inductor for TLVR is equally diverse. For instance, the SLA2843B is a ferrite-based SMD inductor with low core loss ideal for LC power rails in TLVR circuit designs. The component's inductance range is 60nH-420nH, with customization possible. Offering high current output chokes up to 165 amperes with approximately 20% roll off, the SLA2843B has a maximum height of 11mm and measures just 7 x 6.7mm foot print. With more data centers employing powerful application-specific integrated circuits (ASICs) that consume significant amounts of rapidly fluctuating current, conventional multi-phase voltage regulators may approach their performance limits. To overcome this challenge, TLVRs employ phases with output inductors amounting to the secondary winding of a transformer, whose primary windings are connected in a series loop.

Charge Pump Direct Charger IC Powers Smartphones
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Learn more:
halomicro.com
  • Product Release
  • 2022-07-21

Halo Microelectronics announced that its HL7132, a 2:1 Charge Pump Direct Charger IC is used on Samsung's Galaxy A23 smartphones. The HL7132 is a low-voltage 2:1 fast direct charger IC for 1-cell Li-ion and Li-polymer batteries that enable the charge current to be doubled by doubling the input current from a power delivery (PD) adapter. For example, the 3A output PD adapter can charge the current up to 6A, thereby, reducing the battery charge time by 50% and offering less waiting time for A23 smartphone users. The switched capacitor converter architecture and the integrated FETs in the HL7132 are optimized to enable a 50% duty cycle operation under charge pump mode. The 2:1 charge pump mode allows the output voltage, VOUT to be around half of the input voltage, VIN, and the output current to double the input current, reducing the losses over the input power cable as well as limiting the temperature rise in the application. According to Insight Analytical Labs' teardown of the Galaxy A23 smartphone, they discovered Halo Microelectronics' WQN10 (HL7132) switched capacitor direct charger on the main board. It also showed the Qualcomm SM6225 Snapdragon 680 4G 8-core processor is used on the smartphone.

Power Transformer with Updated Winding
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Learn more:
rutronik24.com
  • Product Release
  • 2022-07-21

Pulse is expanding its EFD15 portfolio, known for its versatility in DC/DC converter applications, with the PGT646xNL series. The series uses the current first-in-class 5 + 5 pin SMD platform design. The innovative coil design extends the creepage distance between pin and core to at least 5.1 mm. At the same time, the component retains its dimensions of 22.0 mm x 16.5 mm x 11 mm and does not require more space. Wire selection and design allow for automated winding that provides exceptional reliability for high-performance applications like in industrial and automotive environments, as well as data communications.

Single-output Power Supply with Dual Certification for Medical and Industrial Applications
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Learn more:
slpower.com
  • Product Release
  • 2022-07-21

Advanced Energy Industries expanded its SL Power SLB series with a 300 W power supply. Designed for ease of integration into critical medical and industrial equipment, the SLB300 offers stable power through power fluctuations and features long operational life by integrating high-quality electrolytic capacitors. The SLB300 is a single-output power supply offering a 300 W (200 W convection cooled) output power in a compact 3" x 5" x 1.4" package that fits 1U rack mount applications. It features an 80-264 VAC universal input and a wide -10°C to +70°C operating temperature range. Output voltage is available from 12 – 48 V. Dual certified for the latest medical and industrial standards, the SLB300 is certified to EN/CSA/IEC/UL62368-1 and EN/CSA/IEC/UL60601-1-1 3rd Edition, as well as IECIEC60601-1 Type BF. The model comes with a three-year warranty. "The SLB300 is a versatile power supply that can be used to provide reliable, long-term operation in a wide variety of critical end systems," said Paul Kingsepp, Medical Product Line Manager at Advanced Energy. "We continue to expand our range of high performance, cost-effective power supplies including the SLB series. Our customers benefit from its dual certification, which eases adoption into their medical and industrial applications."

2 Watt High Isolation DC/DC Converter
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Learn more:
tracopower.com
  • Product Release
  • 2022-07-20

The TRV 2M is a series of 2 Watt DC/DC converters in a compact SIP-9 package with reinforced isolation of 5000 VAC for medical and industrial applications. The series offers a 1.5:1 input voltage range with a nominal input ranging between 5 and 24 VDC. With a continuous short circuit protection and a low leakage current of less than 2µA, this converter series is especially suited to protect any connected interfaces or applied parts to patients. Featuring almost fully regulated outputs this series provides a great level of regulation without affecting the cost efficiency. It is an ideal solution for applications where an unregulated DC/DC converter would not meet you regulation requirements but cost still is a critical factor. Together with an operating temperature range from -40 to +80C° without derating and certifications according to IEC/EN/ES 60601-1 3rd ed. for 2xMOPP and IEC/EN/UL 62368-1 this series is suitable for many different applications where a medical isolation system and short circuit protection is needed.

Supercapacitors - The Rapid Energy Boost
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Learn more:
we-online.com
  • Product Release
  • 2022-07-20

Würth Elektronik introduces an EDLC supercapacitors (Electrical Double Layer Capacitor) with snap-in terminals. WCAP-SISC – available with capacitance values of 100 F and 350 F – is a solution for applications with high power and high energy requirements such as UPS or energy storage solutions. They can be used in smart metering devices, network components or energy harvesting applications to name but a few. WCAP-SISC attains a rated current of up to 75 A. The far higher energy density compared with conventional capacitors has made double-layer capacitors such as WCAP-SISC an environmentally friendly alternative to batteries. Compared to Li-ion batteries, the Supercapacitor with activated carbon technology offers numerous benefits: fast charging, very long service life with 500,000 cycles, and lower fire hazard. The capacitance tolerance is 10 / +30 percent, the rated voltage is 2.7 V. WCAP-SISC can be used at an operating temperature of -40°C to +65°C. The 100 F and 350 F Supercapacitors are now available from stock without a minimum order quantity, and free samples can be ordered online or through a sales representative.

GaN-on-Si Device Maker Partners with German Power Electronics Innovation Hub
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Learn more:
innoscience.com
  • Industry News
  • 2022-07-19

Innoscience Technology has signed a distribution agreement with Finepower, focused on power electronic applications with operations in Germany and China. The agreement covers Europe, China and worldwide for specified customers. Dr Denis Marcon, General Manager, Innoscience Europe comments: "Finepower brands itself as the 'Innovation Hub' for power semiconductors and offers both engineering and distribution services. Therefore we are sure that they will be an excellent partner for Innoscience, both in educating the market about the leading performance and reliability offered by our InnoGaN solutions and in ensuring a secure supply chain for customers." Adds Reiko Winkler, General Manager of Finepower: "Finepower is already very experienced in working on customers' applications using GaN. And we are excited to extend our portfolio with High Voltage GaN devices by adding Innoscience – the world's largest 8-inch GaN-on-Si device manufacturer – to our line-up. With a capacity of 10,000 8-inch wafers per month (WPM), which will grow to 70,000 WPM by 2025, Innoscience is ensuring that the world can begin designing with GaN now, with no delay. That is hugely empowering for all markets."

Half-brick DC-DC Converters Feature a 12:1 Ultra-wide Input Range
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Learn more:
lambda.tdk.com
  • Product Release
  • 2022-07-19

TDK Corporation announces the introduction of the 200W TDK-Lambda brand PYH200 series of DC-DC converters. Featuring a 12:1 ultra-wide input range of 14 to 160Vdc, these board mount products are packaged in the industry-standard half-brick format measuring 61.0 x 57.9 x 12.7mm (L x W x H). The housing is silicon potted to provide a high level of resistance to shock and vibration. This is beneficial for applications compliant to EN 50155, the standard for electronic equipment used on railway rolling stock. The PYH200 is available with 12V, 15V, 24V and 48V nominal outputs, adjustable over a -20% to +15% range for non-standard voltages. All models have overcurrent, output-overvoltage and overtemperature protection. Standard functions include remote sense, remote on/off, frequency synchronisation to an external clock, and the ability to extend the hold-up time by connecting an electrolytic capacitor to the BUS terminal. The power modules have efficiencies of up to 90% and can operate with a base plate temperature of -40 to +100°C. Optional heatsinks facilitate convection cooling, forced air cooling or the modules can be conduction-cooled. Input to output and input to baseplate isolation is 3,000Vac with an output to baseplate isolation of 500Vac. Certification is to the IEC/UL/CSA/EN 62368-1 safety standards with the CE and UKCA marks for the Low Voltage and RoHS Directives. The PYH200 in combination with a typical test setup has been tested to meet the EN 50155, EN 45545-2, EN 61373 and EN 50121-3-2 railway standards.

220 M EUR Invest to Build Supercapacitor Factory
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Learn more:
skeletontech.com
  • Industry News
  • 2022-07-19

Skeleton Technologies and Siemens are announcing a far-reaching technology partnership for the development, planning and implementation of a fully automated, digitalized manufacturing plant to produce supercapacitors in Germany. The production line is to be used in a new Skeleton factory in Markranstädt, Leipzig – Skeleton's second manufacturing site in Saxony. The economies of scale provided using Siemens' cutting-edge technology, combined with the use of Skeleton's patented "curved graphene" material, are expected to lower the production costs by almost 90% after the completion of this 5 years project. The collaboration aims to achieve the digitization of Skeleton's entire value chain – from supercapacitor cell design to production and services – and scale up the production of next-generation supercapacitors. Siemens supports this with its comprehensive Digital Enterprise portfolio as well as domain know-how in industrial battery cell production. Furthermore, it is planned to further expand the business relations between the two companies. Skeleton's supercapacitors are used in transport, grid, industrial, and automotive applications and allow to reduce CO2 emissions and save energy. With the use of patented "curved graphene" material, Skeleton's supercapacitors offer the highest power and energy density on the market, almost instant charging and discharging, high reliability, and very long lifetimes. They contribute to improving power quality and protecting equipment and infrastructure by lowering the power fluctuation, and to powering electrification.

Distribution Partnership to Serve a Wider Range of Customers
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Learn more:
allegromicro.com
  • Industry News
  • 2022-07-19

Allegro MicroSystems announced that it has entered into a distribution partnership with global semiconductor and electrical component distributor Mouser Electronics. The partnership extends Allegro's global distribution footprint, and gives customers new options for purchasing product samples, evaluation boards, and production inventory. Many of Allegro's products are now available for purchase on the Mouser website, including the company's current sensors, position and speed sensors, and power management and motor control ICs. "This partnership greatly enhances our commitment to creating and supporting a vibrant and diverse customer base," said Max Glover, Senior Vice President of Sales at Allegro. "Mouser offers unmatched global logistics, giving engineers and designers access to our innovative ICs in a one-stop-shopping experience – leaving them more time to design and build new, exciting products." "Mouser customers demand efficient, reliable products, and Allegro MicroSystems meets and exceeds these expectations," said Kristin Schuetter, Mouser Electronics' Vice President of Supplier Management. "This agreement gives design engineers an excellent avenue for developing energy-efficient solutions across a broad range of industries and applications."

Acquisition of C&K Switches
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Learn more:
littelfuse.com
  • Industry News
  • 2022-07-19

Littelfuse announced the completion of its acquisition of C&K Switches ("C&K"). C&K is a designer and manufacturer of electromechanical switches and interconnect solutions with a strong global presence across a broad range of end markets, including industrial, transportation, aerospace, and datacom. "The combination of our companies significantly expands our technologies and capabilities, enabling us to deliver a comprehensive solutions offering to our broad customer base, across a wide range of vertical end markets," said Deepak Nayar, Senior Vice President and General Manager, Littelfuse Electronics Business. "Our businesses are highly complementary and enable us to leverage our collective go-to-market models and global footprints. It is a pleasure to welcome the C&K employees to the Littelfuse team, and we look forward to their contributions, as we continue to execute on our long-term growth strategy." C&K has annualized sales of over $200 million and will be reported within the company's Electronics reporting segment.

Combiners Make 5G, Fiber Broadband, and Security More Accessible
  • Product Release
  • 2022-07-19

Since the line's introduction, ABB Power Conversion's Power Express combiners have helped provide safe and effective remote powering for indoor loads that exceed the capabilities of a single Class 2 circuit. Initially introduced with eight circuits to power up to 600W, ABB has announced the addition of two- and four-circuit combiners to its Power Express product family, offering flexible options to meet users' unique needs while complying with NEC requirements. In addition, ABB has developed a 1-rack-unit (RU)-high SPS Power Express shelf to address systems that use a commercial AC power input but do not have the space or desire for a separate DC power shelf. These latest additions to the Power Express family enable ABB to provide a comprehensive set of solutions to meet the Class 2 power needs of customers' unique applications. "These more compact, flexible combiners will help companies with lower budgets or smaller spaces reap the safety and compliance benefits of combined Class 2 circuitry when creating infrastructure to support 5G and Wi-Fi hotspots, fiber applications, distributed antenna systems (DAS), and security cameras," said Raj Radjassamy, 5G and wireless segment leader for ABB Power Conversion.

Reference Designs for Compressor Motor Drives
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Learn more:
st.com
  • Product Release
  • 2022-07-18

STMicroelectronics has released two reference designs that simplify building complete industrial or home-appliance motor drives for compressors with the STSPIN32 motor-control system-in-package (SiP). Each integrates the motor controller with a three-phase inverter to power the motor, and an offline converter and auxiliary circuitry. A production-ready PCB design and motor-control firmware are also included. The STEVAL-CTM011V1 targets general industrial compressors up to 250W, while the STEVAL-CTM012V1 meets the stringent eco-design regulations for use in home appliances. The plug-and-play reference designs combine easily with a host system to start driving a motor and allow customers to fine-tune settings for optimal performance. Both ensure average efficiency greater than 96.5%. At the heart of each design, ST's STSPIN32F0601Q motor-control SiP contains an STM32F031 Arm Cortex-M0 microcontroller to customize the motor control to specific end application needs   and a very rugged 600V three-phase gate driver for the inverter. The firmware provided includes high-efficiency sensorless field-oriented control (FOC). The SiP is a compact and thermally efficient quad flat no-lead (QFN) device that meets high creepage requirements for safety and reliability. The offline AC/DC converter is a VIPER122 analog converter that integrates control logic with an 800V avalanche-rugged power section. Frequency jittering prevents interference with other equipment, while inherently low power consumption and support for burst-mode operation at light load help comply with energy-saving regulations.

2022 Design Methodologies Conference
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Learn more:
ieee.org/dmc-2022
  • Event News
  • 2022-07-17

The IEEE Power Electronics Society is hosting the 2022 Design Methodologies Conference bringing together Design Automation, Artificial Intelligence, Machine Learning, and Cyber-Physical Security methodologies for power electronics applications. The PELS has witnessed a significant and growing interest in advanced Design Methodologies for Power Electronics in recent years, culminating in the launch of this conference in 2021. With the 2022 DMC hosted by the historic city of Bath on September 1st and 2nd, 2022, and virtual attendance powered by the online Whova platform, you can join us to participate in keynotes, discussions, presentations, and more!

EMV 2022 Summer Edition: Community Celebrates Gathering in Cologne
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Learn more:
emv.mesago.com
  • Event News
  • 2022-07-14

The EMV invited attendees to network, train and much more at the Cologne event site from 12 – 14 July 2022. Around 2,500 qualified visitors took advantage of the versatile offering at the trade fair, the scientific conference and the workshops. In line with the motto "Creating a compatible future", 91 exhibiting companies and partners presented product innovations, services and solution approaches for the EMC technology of tomorrow. In addition, the conference, which was accompanied by workshops, made an excellent contribution to further education and offered participants insightful approaches to solutions and answers to current industry topics. On the last day of the event, the award winners were announced and honored by the committee of the EMV Cologne. In the category "Best Paper", Henrik Brech (Leibniz Universität Hannover) won the race with an excellent performance. "After three successful days at the congress of the EMV 2022, the four best contributions were awarded today. The participation of many young candidates was particularly pleasing. This makes the event the optimal platform for young engineers in particular to present their expertise and network with experts," reports Prof. Dr.-Ing. Heyno Garbe, Committee Chair of the EMV Cologne. The next edition of the EMV will be held in Stuttgart, Germany from 28 – 30 March 2023.

Silicon RF High-power MOSFET Module for Commercial Two-way Radio
  • Product Release
  • 2022-07-14

Mitsubishi Electric announced that it will launch a 50W silicon radio-frequency (RF) high-power metal-oxide semiconductor field-effect transistor (MOSFET) module for use in high-frequency power amplifiers of commercial two-way radios. The model, which offers a 50W power output in the 763MHz to 870MHz band and high total efficiency of 40%, is expected to help expand radio communication range and reduce power consumption. The 150MHz and 400MHz frequency bands used for various wireless systems have become congested in North America and other markets, so in response, the 700MHz band, formerly used for analog TV broadcasting, has been reallocated for commercial two-way radio, increasing the demand for radios that support this band. Conventional power amplifiers, however, experience large power loss, so there is a need for RF high-power MOSFET modules offering built-in input/output impedance-matching circuit and guaranteed output-power performance. The silicon RF high-power MOSFET (RA50H7687M1), which achieves unmatched power output and high total efficiency for commercial radios compatible with the 700MHz band, is expected to expand the communication range and lower the power consumption of such radios.

Silicon Carbide Cooperation
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Learn more:
rohm.com
  • Industry News
  • 2022-07-14

SEMIKRON and ROHM Semiconductor have been collaborating for more than ten years with regards to the implementation of silicon carbide (SiC) inside power modules. Recently, ROHM's latest 4th generation of SiC MOSFETs has been fully qualified in SEMIKRON's eMPack modules for automotive use. Hence, both companies serve worldwide customers' needs. SEMIKRON announced it had secured a billion-Euro contract to supply their innovative eMPack power modules to a major German car maker, beginning in 2025. The company developed a fully sintered assembly and connection technology 'Direct Pressed Die' (DPD). This enables extremely compact, scalable and reliable traction inverters. The eMPack module technology has been specially designed for SiC-based converters of medium and high power in order to fully exploit the properties of the new semiconductor material. In addition, SEMIKRON provides evaluation boards for eMPack that incorporate ROHM's gate driver ICs, helping customers shorten the time required for evaluation and adoption. In the future, SEMIKRON also plans to use ROHM's IGBTs in modules for industrial applications. ROHM's latest 4th generation of SiC MOSFETs, which has been adopted by SEMIKRON, provides industry-leading low ON resistance with improved short-circuit withstand time. These characteristics contribute significantly to extend the driving length and miniaturize the batteries of EVs when they are used in traction inverters. Thus, the company develops advanced, energy-saving SiC devices that reduce environmental impact. Both companies will continue to contribute to automotive technology innovations by providing optimal power solutions that meet market needs through the fusion of ROHM's device/control technologies and SEMIKRON's module technologies that can optimally combine them.

40V MOSFETs Deliver SMPS Performance
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Learn more:
taiwansemi.com
  • Product Release
  • 2022-07-14

Taiwan Semiconductor introduces the PerFET Series of single- and dual-channel 40V power MOSFETS. Built on proprietary device structures and processes that enable exceptionally low on-state resistance and switching FOM (figure-of-merit), the PerFET device achieves 50% RDS(ON) and 40% FOM reduction. The 40V N-channel PerFET platform includes options for both standard (10V) and logic level (5V) gate-drive requirements while preserving rugged safe-operating area margin when switching voltage transients and avalanche occurs in switching applications. The NH Series PerFET devices are housed in PDFN56U and is compatible with conventional SOP8 packages. Its wettable flank leads to improved solder joint reliability, lower DC resistance and automated optical inspection (AOI) during PCB assembly. Their reliability and performance are well suited to SMPS, server, DC-DC converter, telecom, motor driver and multicopter designs. Manufactured to meet AEC-Q performance standards, the PerFET family features 175 °C operating junction temperature, 100% UIS and Rg tested and are RoHS compliant. The 12 single-channel and two dual-channel models in the NH Series are rated for 40V operation with operating currents of 34A (dual channel versions) and ranging from 54A to 100A (single channel versions).

Chip Development Centers Under Construction
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Learn more:
bosch-presse.de
  • Industry News
  • 2022-07-13

By 2026, Bosch plans to invest another 3 billion euros in its semiconductor division as part of the IPCEI funding program on microelectronics and communications technology. "Microelectronics is the future and is vital to the success of all areas of Bosch business. With it, we hold a master key to tomorrow's mobility, the internet of things, and to what we at Bosch call technology that is 'Invented for life'," says Dr. Stefan Hartung, chairman of the Bosch board of management, at the Bosch Tech Day 2022 in Dresden. One of the projects Bosch plans to fund with this investment is the construction of two new development centers – in Reutlingen and Dresden – at a combined cost of over 170 million euros. In addition, the company will spend 250 million euros over the coming year on the creation of an extra 3,000 square meters of clean-room space at its wafer fab in Dresden. "We're gearing up for continued growth in demand for semiconductors – also for the benefit of our customers," Hartung said. "For us, these miniature components mean big business." At its Reutlingen plant Bosch has been mass-producing silicon carbide (SiC) chips since the end of 2021. These are used in the power electronics required for electric and hybrid vehicles, where they have already helped boost operating ranges by up to 6 percent.

Fast Recovery Diodes for Air Conditioners and EV Charging Stations
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Learn more:
rohm.com
  • Product Release
  • 2022-07-12

ROHM has developed its 4th Generation 650V fast recovery diodes (FRDs), the RFL/RFS series, featuring low forward voltage (VF), fast reverse recovery time (trr) respectively, as well as ultra-low noise characteristics. The devices are ideal for industrial and consumer equipment that handle large amounts of power, such as air conditioners and EV charging stations. In recent years, more effective use of electricity is necessary to cope with the rise in global power consumption. This is especially true for white goods and industrial equipment that handle large amounts of power such as EV charging stations. These require not only high electrical efficiency but also reducing workload for noise countermeasures in circuit design. In response, ROHM developed diodes that combine low VF for more efficient operation with fast trr characteristics that provide less loss and ultra-low noise during switching OFF. Optimizing the device structure and materials allows the RFL/RFS series to achieve the optimum balance of VF and trr, which are important characteristics for FRDs but are in a trade-off relationship. The low VF RFL series reduces VF by approx. 3.2% and trr by about 8.3% over the conventional RFN series, while the high-speed RFS series decreases VF by approx. 17.9% vs the conventional RFUH series. Both products contribute to higher power supply efficiency through optimal design based on circuit requirements. Furthermore, ultra-low noise diode recovery characteristics are achieved, they help to reduce both workload and components for noise.

Creator of Isolation Technology Acquired
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Learn more:
navitassemi.com
  • Industry News
  • 2022-07-12

Navitas Semiconductor has announced the acquisition of VDD Tech, creator of digital-isolators for next-generation power conversion, which are essential to deliver size, weight, and system-cost improvements in high-power markets such as consumer, motor drive, solar, data center, and EV. VDD Tech's proprietary modulation-technique enables stable, reliable, efficient power conversion at MHz+ switching speeds. Proprietary dV/dt sensing, blanking, and refresh technologies enable an unprecedented combination of very-high-voltage-isolation capability with the highest frequency of operation requiring 5-10x higher dV/dt immunity than legacy Silicon. Low isolation-capacitance (<0.5pF) and innovative, robust modulation deliver low-jitter digital-communication for isolated-driver control and analog-sensing feedback. A minimum 200 V/ns Common-Mode Transient Immunity (CMTI) is uniquely guaranteed across all temperature and operating conditions. VDD Tech was founded in Mont-Saint-Guibert, Belgium, by Vincent Dessard, quickly joined by Aimad Saib, each of them holding a doctorate and 15+ years' experience in analog / mixed-mode IC research and development. Dessard and Saib have taken leading roles in Navitas' advanced R&D teams. "VDD Tech's isolation technology is a key part of our growing power-and-control integration strategy, creating an additional $1B/yr market opportunity," said Gene Sheridan, Navitas CEO and co-founder. "We continue to research and review new technologies that we could add to Navitas' core strengths, and deliver significant CO2 emission-reduction benefits as we continue our mission to 'Electrify Our World'."

EMI Test Receiver Bandwidth Extended to 1 GHz
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Learn more:
rohde-schwarz.com
  • Product Release
  • 2022-07-12

To help EMC engineers meet the increasing demand for higher measurement speeds, Rohde & Schwarz introduces a wideband solution which is able to measure up to 970 MHz in real time, while keeping a high dynamic range and measurement accuracy. In order to speed up measurement time and to provide a more careful analysis of interfering signals, the R&SESW EMI test receiver offers the possibility to increase its FFT (Fast Fourier Transform) bandwidth to 350 MHz with the  R&S ESW-B350 option, and to 970 MHz with the R&S ESW-B1000 option. This makes the R&S ESW not only an instrument of highest performance in RF, functionality, versatility and hardware quality, but also in high-speed testing especially for pretests and general EMI analysis. With the R&S ESW-B1000 offering 970 MHz of FFT bandwidth, the R&S ESW can process the CISPR Bands C and D in one shot – even with quasi peak and CISPR average detectors working in parallel – offering a significant gain in measurement speed. The 970 MHz wide spectrum is measured in real time; users benefit from a truly gapless spectrogram. Infrequent emissions can be observed over a significantly longer time and are detected with a much higher probability. Emissions from equipment under test going through a duty cycle are recorded over a broad spectrum of 970 MHz without missing the shortest pulse.


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Syndication Network Spanning Over 30 Distribution PartnersSnapEDA is launching the SnapEDA Syndication Netwo...10026Product ReleaseSyndication Network Spanning Over 30 Distribution PartnersSnapEDA is launching the SnapEDA Syndication Network. This ecosystem of over 30 distribution partners, includes electronic component distributors, printed circuit board (PCB) tool makers, and engineering media sites. The SnapEDA Syndication Network connects the electronic designers and engineers who are at the heart of the electronic industry with design content for millions of electronic components. This content helps engineers design faster, grows revenue and loyalty for distributors, and allows chip and component manufacturers to get valuable design wins. Over 80% of engineers that download SnapEDA’s design content purchase the product. This creates a competitive advantage for electronic component distributors and manufacturers that are a part of SnapEDA’s network, enabling them to win sales earlier in the design process. Global spending on digital transformation is expected to reach an all-time high of $6.8 trillion in 2023. As a result of the global pandemic and a heightened demand for self-serve component selection tools, component manufacturers are increasingly investing in digital demand generation technologies. In addition to helping engineers find the parts they need, SnapEDA uniquely translates this demand into seamless design-ins, securing the win for component manufacturers.28.09.2022 13:30:00Sepnews_2022-10-01_18.png\images\news_2022-10-01_18.pnghttps://insights.snapeda.com/syndicationsnapeda.com
Oscilloscopes for Accelerated InsightRohde & Schwarz is adding the R&S MXO 4 series osc...10025Product ReleaseOscilloscopes for Accelerated InsightRohde & Schwarz is adding the R&S MXO 4 series oscilloscopes to its portfolio, which features a real-time update rate of over 4.5 million acquisitions per second. The 12-bit ADC in the R&S MXO 4 series has 16 times the resolution of traditional 8-bit oscilloscopes at all sample rates without any tradeoffs for more precise measurements. The oscilloscopes come in four-channel models with bandwidths of 200 MHz, 350 MHz, 500 MHz, 1 GHz, and 1.5 GHz. The R&S MXO 4 series incorporates a 12-bit ADC that operates across all the instrument sample rates with an 18-bit vertical resolution architecture for greater resolution precision. The R&S MXO 4 series also has the lowest noise and largest offset range (+/- 5V with a 500uV/div scaling) in its class. Users can see DC and other signals with more precision than with any other oscilloscope on the market. In addition to bandwidth and sample rate, memory depth is an important factor and determines whether an oscilloscope can handle a large range of troubleshooting tasks. More acquisition memory enables oscilloscopes to capture more time and retain rated bandwidth information for shorter time base settings. With a simultaneous standard acquisition memory of 400 Mpts on all four channels, the R&S MXO 4 series has up to 100 times the standard memory of its primary competition. The additional memory also provides extra measurement capability when needed.28.09.2022 12:30:00Sepnews_2022-10-01_17.jpg\images\news_2022-10-01_17.jpghttps://www.rohde-schwarz.com/uk/about/news-press/all-news/rohde-schwarz-introduces-the-r-s-mxo-4-series-the-next-generation-oscilloscopes-for-accelerated-insight-press-release-detailpage_229356-1274183.htmlrohde-schwarz.com
Patented Switching Technique for Power Electronics DesignPulsiv OSMIUM uses a patented method for convertin...10014Industry NewsPatented Switching Technique for Power Electronics DesignPulsiv OSMIUM uses a patented method for converting AC to DC that involves charging/discharging a small storage capacitor without the need for a PFC inductor. This solution delivers high power factor, consistently high efficiency and an compact system design. Pulsiv OSMIUM technology can be used to improve overall system efficiency, optimize cost and contribute towards reducing global energy consumption. The microcontroller family and supporting components can be combined with commodity flyback DC-DC converters to displace higher-cost LLC solutions. Pulsiv has demonstrated a universal input, single switch 150W flyback power supply design that delivers 97.5% average (99.5% peak) front-end efficiency while maintaining 90% at just 2W. A 240W interleaved flyback is currently being developed and work is underway to showcase reference designs with even higher power capability. Pulsiv OSMIUM microcontrollers (PSV-AD-150 and PSV-AD-250 sampling now) do not directly determine output power and can be used as a platform for any application requiring 1W to 10kW, by adjusting only three system components and connecting a suitable DC/DC converter. Critical components in a Pulsiv OSMIUM circuit operate at low temperatures to extend their expected operating life, even under convection cooling. By regulating the flow of mains through a charging capacitor, Pulsiv has completely eliminated inrush current, meaning that manufacturers of industrial power supplies and LED lighting products can simplify their designs and reduce the cost of system installation. Finally, the technology supports Active Bridge Control, Configurable Hold-Up, X-Cap Discharge, HVDC Output Selection, a Power Consumption Indicator and Grid Failure Detection. These optional features can be selected as required to meet the needs of different end applications.27.09.2022 11:00:00Sepnews_2022-10-01_6.jpg\images\news_2022-10-01_6.jpghttps://pulsiv.co.uk/news/pulsiv-unveils-world-leading-power-electronics-technology/pulsiv.co.uk
Offline AC-DC Primary-Side PWM Controllers for Flyback ConvertersElevation Semiconductor announced the release of i...10023Product ReleaseOffline AC-DC Primary-Side PWM Controllers for Flyback ConvertersElevation Semiconductor announced the release of its two power ICs with smaller footprints for fast-charging solutions. The HL9510 and HL9512 are flyback PWM controller ICs that operate in a quasi-resonant (QR) mode to enhance the system efficiency and power density. Both ICs offer constant output voltage regulation through the optocoupler feedback controller or shunt regulator and integrate high-voltage startup. The HL9510 and HL9512 protection include VDD over-voltage protection (VDD-OVP), Brown-out protection, DMAG over-voltage protection (DMAG-OVP), DMAG under-voltage protection (DMAG-UVP), IC internal over-temperature protection (OTP), and IC external thermal shut-down (SD). The brown-in voltage is programmed by an external DMAG pin resistor and has a wide VDD operating range to cover variable output mode applications, such as USB-PD/PPS or conventional DP/DN protocol communication. Its protection is also implemented with auto-restart mode. The VDD-OVP, DMAG-OVP, and external SD protection can be configured with auto-restart or latch mode, and the DMAG-UVP can be configured with auto-restart or long auto-restart mode. The HL9510 is designed to integrate an internal HV startup circuit, whereas the HL9512 can be done by the external MOS combined IC’s AUX and ST pins. The HL9510 is available in a 10-lead SOIC package ideal for USB PD/QC portable device battery chargers, high-efficiency AC-DC power adapters, and a power supply with fixed or variable output voltage. The HL9512 also comes in the same package and is ideal for smartphones, tablet PC battery chargers, portable device adapters, and flyback power suppliers with low and/or variable output voltage.27.09.2022 10:30:00Sepnews_2022-10-01_15.jpg\images\news_2022-10-01_15.jpghttps://elevation-semi.com/elevation-semiconductor-introduces-two-new-offline-ac-dc-primary-side-pwm-controllers-for-flyback-converters/elevation-semi.com
DC/DC Converter IC for Advanced Driver Assistance Systems ROHM developed the buck DC/DC converter IC with bu...10020Product ReleaseDC/DC Converter IC for Advanced Driver Assistance Systems ROHM developed the buck DC/DC converter IC with built-in MOSFET (Switching regulator), BD9S402MUF-C, for automotive applications such as infotainment and ADAS (Advanced Driver Assistance Systems) incorporating onboard sensors and cameras that are becoming more advanced. The BD9S402MUF-C supports output voltages down to 0.6V and 4A output current at switching frequencies higher than 2MHz in a compact size demanded by increasingly sophisticated secondary power supply applications for high performance MCUs and SoCs. What’s more, it is incorporating proprietary QuiCur™ high-speed load response technology and enables stable operation at an industry-leading 30mV (measurement conditions: 5V input voltage, 1.2V output voltage, 44µF output capacitance, load current variation 0 to 2A/2µs). This translates to a 25% reduction in output voltage fluctuation over class-leading standard products with equivalent functionality, making it ideal for use in the latest ADAS with severe power supply conditions requiring stable operation within 5% even with low voltage output. The BD9S402MUF-C is also equipped with a load response performance selection function that allows users to easily switch priority between ‘voltage fluctuation’ (for stable operation), and ‘capacitance reduction’ (to ensure stable operation at 22µF) via terminal setting. The result is that users can reduce the resources required for power circuit design, as stable operation can be achieved not only at the initial design, but also during specification or model changes.27.09.2022 07:30:00Sepnews_2022-10-01_12.jpg\images\news_2022-10-01_12.jpghttps://www.rohm.com/news-detail?news-title=2022-09-27_news_dcdc&defaultGroupId=falserohm.com
GaN-SiC HEMT Transistor for Long Pulse Radar ApplicationsAmpleon introduces the CLL3H0914L-700 GaN-SiC HEMT...10029Product ReleaseGaN-SiC HEMT Transistor for Long Pulse Radar ApplicationsAmpleon introduces the CLL3H0914L-700 GaN-SiC HEMT for wireless infrastructure, avionics/defence, non-cellular communication, cooking/ defrosting, and ISM-related applications. This rugged GaN transistor is optimised for radar implementations where long pulse width and high-duty cycles are required. The transistor was engineered to achieve over 700W of peak output power from a single transistor while operating at a voltage of 50V with efficiency of over 70% as well as designed thermally for long pulse applications, such as pulse widths (~2 milliseconds) and 20% duty cycles. This high-power density and low-thermal resistance HEMT is now in full volume production. Units are available directly from Ampleon or authorised distribution partners, RFMW and Digi-Key. Large signal models in ADS and MWO can be sourced via the Ampleon website.   26.09.2022 16:30:00Sepnews_2022-10-01_21.jpg\images\news_2022-10-01_21.jpghttps://www.ampleon.com/news/press-releases/ampleons-new-standard-for-l-band-gan-sic-hemt.htmlampleon.com
PCIM Asia Postponed to 2023 While PCIM Asia Conference to Keep Its Schedule This October PCIM Asia will now be held from 29 – 31 August 202...10013Event NewsPCIM Asia Postponed to 2023 While PCIM Asia Conference to Keep Its Schedule This October PCIM Asia will now be held from 29 – 31 August 2023 at Shanghai New International Expo Centre in view of current circumstances relating to the pandemic in China. Although the PCIM Asia exhibition will be moved to next year, the PCIM Asia Conference 2022 will keep its schedule this autumn from 26 – 27 October in Shanghai. “To actively support the government’s efforts towards pandemic mitigation, we have decided to move the fair to next summer after meticulously examining the ongoing situation in China,” explains Mr Louis Leung, Deputy General Manager of Guangzhou Guangya Messe Frankfurt Co Ltd. “We would like to express our gratitude to those in the industry for their understanding and support, and look forward to welcoming key players back next year to reconnect and establish stronger business cooperation within the power electronics industry.” Despite the postponement, industry players will continue to keep abreast of the latest trends and developments this year. “Within the preventive guidance set by the local government, we are able to move forward with PCIM Asia Conference in the original dates this October in Shanghai. While details of the new venue will be announced shortly, we trust the hybrid conference will satisfy the power electronics community’s enthusiasm towards the event and meet the demand for in-person business encounters.” 26.09.2022 10:00:00Sepnews_2022-10-01_5.jfif\images\news_2022-10-01_5.jfifhttps://pcimasia-expo.cn.messefrankfurt.com/shanghai/en/press/press-releases/2022/PCIM22_secondpostponement.htmlpcimasia-expo.cn
PLECS Conference 2022 – Insights Into Real-Time SimulationAt the PLECS conference in Zurich, leading industr...10012Event NewsPLECS Conference 2022 – Insights Into Real-Time SimulationAt the PLECS conference in Zurich, leading industrial companies presented their various implementations of real-time simulation with PLECS and the RT Box. The speakers showed how PLECS was successfully used to automatically generate models and controls in their rapid prototyping process. The speed of the simulations was well appreciated. In addition, the RT Box proved to be very versatile: ALSTOM's Dr. Ing. Roberto Aceiton used the compact RT Box in a home-office environment during the pandemic, while Schindler integrated the RT Box into highly automated systems running overnight simulations of various elevator failure modes. Between the presentations, there were lively discussions on the various features of real-time simulation. The conference ended with a look into the future of PLECS: Wolfgang Hammer from Plexim presented future features, such as the "comment out" function to disable components for a simulation run and a difference viewer to compare two models. One question remained for the participants: When will the next PLECS conference take place? Orhan Toker, Vice President of Plexim, says “There will be for sure another PLECS conference in 1-2 years.”.26.09.2022 09:00:00Sepnews_2022-10-01_4.jpg\images\news_2022-10-01_4.jpghttps://www.plexim.com/homeplexim.com
electronica Impresses with its Supporting Programelectronica 2022, which will take place from Novem...10018Event Newselectronica Impresses with its Supporting Programelectronica 2022, which will take place from November 15 to 18 on the exhibition grounds in Munich, and the co-located event SEMICON Europa, will show the role of the electronics industry as a trailblazer for societal future topics. While the exhibitors will present their specific products and solutions in 14 exhibition halls, the comprehensive supporting program of conferences, forums and special events will focus on knowledge transfer and personal exchange with experts. The motto “Driving sustainable progress” will be a common thread through all of the areas. electronica has traditionally been the platform for top-class conferences. This year things will be kicked off by the electronica Automotive Conference on November 14, which will deal with the transition of cars toward becoming intelligent IoT devices with electronic drives over the course of around 18 presentations. Among others, the key issues at the event include new EE architectures, intelligent interiors, challenges for supply chains, CO2 neutrality and efficient drive trains. On November 16, the electronica Embedded Platforms Conference, which will also last one day, will discuss the challenges and solutions for the embedded systems of the future: In around 35 presentations on three parallel tracks, experts will report on key topics such as power electronics and supply, AI and sensors, and communication and software. 22.09.2022 15:00:00Sepnews_2022-10-01_10.jpg\images\news_2022-10-01_10.jpghttps://electronica.de/en/newsroom/press-material/press-releases/detail/electronica-impresses-with-its-strong-supporting-program.htmlelectronica.de
Collaboration to Develop Software for Automotive Battery Management SystemsNXP® Semiconductors has joined forces with Elektro...10015Industry NewsCollaboration to Develop Software for Automotive Battery Management SystemsNXP® Semiconductors has joined forces with Elektrobit to co-develop the software platform that supports NXP’s high-voltage battery management system (HVBMS) reference design. Using Elektrobit’s Classic AUTOSAR tooling and software, the software platform of the HVBMS reference design eases the development of HVBMS architectures for electric vehicles (EVs) by abstracting the communication and controlling interactions between the BMS microcontroller and the battery cell controllers. As demand for battery-powered cars (EVs) continues to increase, so does the demand for improved performance, faster charging time, increased range and battery life, and improved safety. These demands drive rapid technological advancements in EV battery designs, especially for high voltages like 400V or 800V. As these batteries become more powerful and complex, more sophisticated BMS architectures are needed to ensure the safety and reliability of EVs. NXP’s HVBMS RD is a scalable ASIL D architecture composed of three modules: battery management unit (BMU), cell monitoring unit (CMU) and battery junction box (BJB). NXP’s wide portfolio of battery cell controllers, battery junction box devices, and devices for its electrical transport protocol link (ETPL), along with production grade software drivers for these silicon devices, makes it easier for OEMs and Tier 1 customers to enter the growing market of HVBMS and enables them to focus effort on their unique application features. Elektrobit has been collaborating with NXP for more than ten years. Utilizing Elektrobit’s EB tresos (AutoCore, AutoCore OS, and RTE), NXP’s reference application software and Complex Device Drivers (CDDs) are designed and integrated into NXP’s HVBMS RD.22.09.2022 12:00:00Sepnews_2022-10-01_7.jpg\images\news_2022-10-01_7.jpghttps://www.nxp.com/company/about-nxp/nxp-collaborates-with-elektrobit-to-develop-software-for-next-generation-automotive-battery-management-systems:NW-NXP-COLLABORATES-WITH-ELEKTROBITnxp.com
Single-stage Flyback Controller for Battery Charging ApplicationsInfineon Technologies extends its offering of AC-D...10021Product ReleaseSingle-stage Flyback Controller for Battery Charging ApplicationsInfineon Technologies extends its offering of AC-DC controller ICs by introducing the ICC80QSG single-stage PWM controller for flyback topologies. The IC is tailored for battery charger applications offering scalable power designs of up to 130 W – when optimized using CoolMOS™ P7 Superjunction (SJ) MOSFETs. It is also suitable for adapter, printer, PC, TV, monitor, set-top box, and audio amplifier applications. The ICC80QSG battery charging IC offers a quasi-resonant mode, switching in valley n (QRMn). Its QRM operation comes with continuous conduction mode (CCM) prevention and valley switching discontinuous conduction mode (DCM) in mid to light load. By pairing ICC80QSG with CoolMOS™ P7 MOSFET devices, high efficiency and low electromagnetic interference (EMI) can be achieved to enable savings on the overall BOM: fewer heatsinks and coils may be needed in flyback designs. In addition, the integrated burst mode function for very light loads allows designs with very low power consumption during standby mode. Additionally, the ICC80QSG features a reduced gate driver output voltage during burst mode, making it ideally suited for very low standby requirements under light load or no load conditions with a remarkable standby performance over the whole operating range. The ICC80QSG implements a secondary-side regulation (SSR) method, which is ideal for current control during battery charging. For higher design flexibility, it accommodates adjustable on-time mapping at the valley changing position for the desired maximum operating switching frequency, as well as adjustable maximum on-time that limits input power and current, allowing safe operation under low line conditions. 22.09.2022 08:30:00Sepnews_2022-10-01_13.jpg\images\news_2022-10-01_13.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2022/INFPSS202209-118.htmlinfineon.com
Laminate to Aid Reliable Performance of EV Power Modules DuPont Interconnect Solutions announced a multiyea...10011Industry NewsLaminate to Aid Reliable Performance of EV Power Modules DuPont Interconnect Solutions announced a multiyear contract with European power module manufacturer Semikron-Danfoss who will integrate DuPont™ Pyralux® AP all-polyimide double-sided copper clad laminate into its eMPack® power modules to further enhance the capabilities of next-gen electric vehicles. Integrating Pyralux AP copper clad laminate into eMPack traction inverter designs will help EV automotive engineers address key requirements related to signal integrity and power transmission. "Pyralux AP emerged as our best-fit solution after extensive testing and because the product has demonstrated three decades of stable, reliable performance in a variety of industries where operating conditions, like ours, are severe,” said Karl-Heinz Gaubatz, CTO of Semikron. “eMPack is a perfect fit to SiC MOSFET power modules. We look forward to working with DuPont and their Pyralux technology to help eMPack become a global leader in EV power modules.” Earlier this year, Semikron-Danfoss, headquartered in Nuremburg, Germany, won a billion-Euro contract beginning in 2025 to furnish patented eMPack power modules to a major German automotive manufacturer. Within silicon-carbide MOSFET or full silicon-carbide technology-based modules, traction inverters can be created which are extremely compact, scalable, and reliable because of a Semikron double side sintered assembly and connection technology called Direct Pressed Die (DPD). “We are excited how this EV power module application of Pyralux AP copper clad laminate supports a sustainable and electrified future to help preserve our planet for generations to come,” said Andy Kannurpatti, Global Business Director, Films & Laminates, DuPont Interconnect Solutions. “The eMPack power module is expected to enable millions of next-gen electric vehicles by 2032. We look forward to contributing significantly to the much-anticipated success of eMPack and appreciate the collaboration with Semikron-Danfoss.”22.09.2022 08:00:00Sepnews_2022-10-01_3.jpg\images\news_2022-10-01_3.jpghttps://www.dupont.com/electronic-materials/all-polyimide-solutions.htmldupont.com
PowerPros Live Video Application-Engineering SupportPower Integrations launched PowerPros?, a live onl...10017Industry NewsPowerPros Live Video Application-Engineering SupportPower Integrations launched PowerPros?, a live online video tech support service that enables power-supply designers to talk directly with members of Power Integrations’ applications engineering team 24 hours a day, six days a week, anywhere in the world. Designers worldwide can share a video call with an expert power electronics engineer to discuss real engineering challenges – including full project design and debug – sharing bench-top test results. Initially piloted during the pandemic to support Power Integrations’ customers, the program has been expanded with new facilities, additional team members, extended hours and live video. Trevor Hiatt, director of channel marketing at Power Integrations, said: "This is a technical solutions service where anyone can speak directly with an experienced application engineer any time of the day or night. The program has been very popular with customers, who rated the program 4.4 stars out of 5 with 93 percent of queries resolved within 72 hours. Some questions are simply a matter of pointing the enquirer to the right part of the datasheet, but many issues go much deeper. PowerPros staff advise on device and topology selection, review schematics and PCBs, help with transformer design, and do live design debugging.” Users of PowerPros can collaborate live with Power Integrations engineers to solve their design challenges in real-time using comprehensive bench instrumentation and design tools. Support is available for any of Power Integrations’ extensive portfolio of power supply and driver products and a wide range of applications including industrial, appliance, home and building automation, metering, chargers and adapters, power tools, eMobility, motor drives and LED lighting.20.09.2022 14:00:00Sepnews_2022-10-01_9.jpg\images\news_2022-10-01_9.jpghttps://investors.power.com/news/news-details/2022/Power-Integrations-Launches-PowerPros-Live-Video-Application-Engineering-Support/default.aspxpower.com
3D Power Design and Manufacturing SymposiumThe PSMA Packaging and Manufacturing Committee ann...10010Event News3D Power Design and Manufacturing SymposiumThe PSMA Packaging and Manufacturing Committee announces the Fourth Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-2023) February 1-3, 2023 at Florida International University in Maimi, Florida. This Symposium provides the opportunity to receive an update on the latest technology and future trends focused on increasing the density and the performance of power solutions. Discover advances in the integration, design, packaging and manufacturing of 3D power sources. The Symposium is desgined for any engineer or manager that is involved in the design and manufacturing of high density power sources using 3D technology. Each day will lead off with 2 Plenary Speakers and each Technical Session will lead off with a keynote speaker. Plenary speakers include Professor Fred Lee of Virgina Tech presenting “PCB based Integrated Magnetic” and Dr. Brandon Passmore of Wolfspeed presenting “Finite-Element Predictive Modeling for Power Modules.” Technical Sessions include modeling, active and passive components, substrates, packaging and how to integrate them with 3D manufacturing technologies to create state of the art power sources. The Symposium will include exhibits and ample opportunities to network with attendees, speakers and exhibitors. The General Chair is Dr. Markondeyaraj Pulugurtha of the Florida International University (FIU). Technical Program Co-Chairs are Dr. John Bultitude of Kemet, a Yageo Company, and Dr. Vanessa Smet from Georgia Tech.15.09.2022 07:00:00Sepnews_2022-10-01_2.jpg\images\news_2022-10-01_2.jpghttp://www.3d-peim.org/3d-peim.org
Low Contact Resistance Coating For Heightened Fuel Cell EfficiencyFabricated from corrosion-resistant SUS316L stainl...10019Product ReleaseLow Contact Resistance Coating For Heightened Fuel Cell EfficiencyFabricated from corrosion-resistant SUS316L stainless steel, the Interplex bipolar plate (BPP) solutions for hydrogen fuel cells support an extensive operational lifespan of over 8,000 hours. They have thicknesses down to 0.8mm. Their low contact resistance (< 2mO·cm² at 1Ma pressure levels) helps to significantly boost the efficiency levels of the fuel cell stacks they are used in and enables power densities to be raised. Thanks to the precision stamping techniques employed, Interplex BPPs exhibit only =8% variation in the evenness with tight tolerances of flow channel thickness (across their active area), as well as offering enhanced plate flatness. These BPPs thereby deliver assured leak-tight operation and even power distribution across the entire surface of their plates. Likewise, advanced laser welding results in exceptional weld quality. The high-speed stamping and coating procedures that Interplex has developed are key factors too. Via these, the company is able to reach high productivity figures – with physical vapor deposition (PVD) coating of plates being done in a fifth of the time compared to other suppliers. In addition, proprietary over-molding technology for attaching the silicone rubber gaskets to the BPP is done to elevated degrees of accuracy. It allows assembly problems to be minimized when stacking the BPP with a membrane electrode assembly (MEA).15.09.2022 06:30:00Sepnews_2022-10-01_11.jpg\images\news_2022-10-01_11.jpghttps://interplex.com/newsroom/latest-interplex-bipolar-plates-feature-innovative-ultra-low-contact-resistance-coating/interplex.com
Motor Drive Center of Excellence Opened in TurinEPC has opened a design application center near Tu...10009Industry NewsMotor Drive Center of Excellence Opened in TurinEPC has opened a design application center near Turin, Italy, to focus on growing motor drive applications based on GaN technology in the e-mobility, robotics, drones, and industrial automation markets. The specialist team will support customers in accelerating their design cycles and define future Integrated Circuits for power management with state-of-the art equipment to test applications from 400 W to 10’s of kW. Strategically located, Turin has a historical tradition in electric motors and motor drives enabling the company to draw on the wealth of local technical talent. EPC’s engineers are helping customers reduce their design cycle times and adopt GaN for more efficient, smaller, lower-cost systems. Moreover, the center is exploring ways to exploit the potential of EPC’s GaN technology in motor drive applications to enable a substantial increase in the efficiency of the motor, leading to higher power density designs than what has been possible with historically MOSFET-based designs. Turin also features the Power Electronics Innovation Centre, a cross-department entity in the Politecnico di Torino - one of the most important technical Universities in Europe - and EPC is collaborating closely with PEIC by investing in shared research and development. The facility is headed by Marco Palma, EPC’s Director of Motor Systems and Applications. Commenting on the opening he said, “Our new facility combines a comprehensive GaN product portfolio and design expertise offering customers a center of excellence that is unrivalled for motor drive applications. Its location is key too, as Europe is driving the green revolution in the e-mobility market, by using the Euro 7 standard in the short term and by banning internal combustion engines by 2035. This is definitely the right time to invest in higher power density motor solutions that avoid un-necessary energy waste.”14.09.2022 06:00:00Sepnews_2022-10-01_1.jpg\images\news_2022-10-01_1.jpghttps://epc-co.com/epc/events-and-news/news/artmid/1627/articleid/3071/epc-opens-new-motor-drive-center-of-excellenceepc-co.com
ASIL C Certified Battery Management System for High Voltage Applications Sensata Technologies announced a Battery Managemen...10027Product ReleaseASIL C Certified Battery Management System for High Voltage Applications Sensata Technologies announced a Battery Management System (BMS), the Lithium Balance n3-BMS, for high voltage applications. It is ideal for applications with power up to 1000 volts/2000 amps, especially for battery makers and manufacturers of electric trucks, buses, and other heavy commercial vehicles. The demand for ISO 26262 certified components is on the rise as battery packers and electric commercial vehicle OEMs prioritize functional safety in their platforms while striving for faster time-to-market. However, the ISO 26262 certification process is complex, costly and can take years to complete. An off-the-shelf, Automotive Safety Integrity Level (ASIL C) certified solution like the Lithium Balance n3-BMS can reduce the development time and associated costs. The layered software structure of the n3-BMS provides customers with the option to customize the battery management system with their own code and algorithms without impacting the ASIL C certification. The BMS software architecture consists of a “Base Software Layer” (BSW) and an “External Software Layer” (ESW) which are connected by an open API link layer. Since all the safety-critical functionalities of the BMS are in the BSW layer of the software, developers are free to implement their own software code and algorithms in the ESW without any risk to the ISO 26262 certification of the system.13.09.2022 14:30:00Sepnews_2022-10-01_19.jpg\images\news_2022-10-01_19.jpghttps://www.sensata.com/contact/newsroom/sensata-technologies-lithium-balance-debuts-asil-c-certified-battery-managementsensata.com
Ruggedised 250W Non-isolated DC-DC ConvertersTDK Corporation announces the introduction of the ...10024Product ReleaseRuggedised 250W Non-isolated DC-DC ConvertersTDK Corporation announces the introduction of the 250W rated TDK-Lambda RGA series of ruggedised non-isolated DC-DC converters. Capable of operating from an input voltage of 9 to 40V or 9 to 53V, the non-isolated step-down converters deliver output voltages that can be adjustable from 3.3 to 15V, 3.3 to 24V or 3.3 to 40V with output currents of up to 20A. The series is designed to be used in harsh environment applications including robotics, AGVs (Automated Guided Vehicles), communications, COTS, industrial and portable battery-powered equipment. In a 1/16th brick form factor, measuring 35.6 x 25.6 x 13mm, the converters are encapsulated to provide a higher resistance to shock and vibration. The five-sided aluminum die cast housing with mounting tabs reduces radiated EMI and enables conduction cooling to a cold-plate for fan-less operation. The RGA models comprise of three voltage and current combinations to support operation from 12V, 18V, 24V, 36V and 48V power sources. The wide input ranges can assist with inventory reduction programs with one part number covering multiple nominal voltages. With efficiencies of up to 98%, power losses are minimised allowing the products to operate in harsh environments of -40°C to +110°C case temperature. The need for external output capacitance is reduced due to an optimised dynamic voltage response, thus reducing board space requirements.13.09.2022 11:30:00Sepnews_2022-10-01_16.jpg\images\news_2022-10-01_16.jpghttps://www.emea.lambda.tdk.com/uk/news/article/18766lambda.tdk.com
DIN Rail AC/DC Power SuppliesCOSEL announced the launch of three DIN Rail AC/DC...10028Product ReleaseDIN Rail AC/DC Power SuppliesCOSEL announced the launch of three DIN Rail AC/DC power supplies for industrial applications. Available in three power levels, 30W, 60W and 90W, combining a low profile design, a wide input voltage range of 85V – 264V, and high performance levels, the WDA series is suitable for a large range of applications. The three models, WDA30F, WDA60F and WDA90F are designed for DIN-Rail attachment and are compatible with the DIN EN60715TH 35 standard (35×7.5mm or 35×15mm), the top hat shaped DIN rail. Designed for international applications, the versatile WDA series boasts a wide input voltage range of 85 to 264VAC, and features overvoltage protection with latching and overcurrent protection with automatic recovery. The WDA30F is available in four different output voltages, 5V, 12V, 24V and 48V within a power level of 30W and a typical efficiency of 88%. Three output voltages are proposed for the WDA60F and WDA90F of 12V, 24V and 48V within an output power of 60W and 90W respectively, and a typical efficiency level of up to 90%. All models include a potentiometer making possible to finely trim the output voltage when installed. A DC OK LED visually confirms the output status. Optimized for convection cooling, the WDA series can be operated within an ambient temperature range of -20 to +70 degrees centigrade. Depending on the assembly method and ventilation used in the final equipment, a derating may apply as specified in the technical documentation.12.09.2022 15:30:00Sepnews_2022-10-01_20.jpg\images\news_2022-10-01_20.jpghttps://www.coseleurope.eu/news-item-1496-cosel-releases-new-family-of-din-rail-power-ac-dc-wdacoseleurope.eu
Agreement Leads to 130 nm SiGe BiCMOS PlatformX-FAB Silicon Foundries has announced a further ex...10016Industry NewsAgreement Leads to 130 nm SiGe BiCMOS PlatformX-FAB Silicon Foundries has announced a further expansion of its longstanding partnership with the Leibniz Institute for High Performance Microelectronics (IHP). As part of a new agreement, X-FAB will now license IHP’s SiGe technology. It will mean the performance benefits of this technology can be brought to high-volume customers. Significantly strengthening the X-FAB technology portfolio, the newly created 130 nm platform provides a solution attaining the elevated performance parameters needed to address next generation communication requirements. Examples of areas benefiting from this technology include Wi-Fi 6 (and future Wi-Fi 7) access points, plus next generation cellular infrastructure (in particular 5G mmW and emerging 6G standards) and vehicle-to-vehicle (V2V) communication. This technology will also be pivotal in the development of +100 GHz radar systems, for use in both automotive and consumer applications. This license agreement follows on from the collaborative work that began in 2021, where X-FAB’s copper backend was added to IHP’s SG13S and SG13G2 frontend technologies to boost the bandwidth figures that could be supported. In relation to this innovative SiGe platform, X-FAB is set to start engaging with selected early adopters on prototyping projects during Q4 2022. An early-access PDK is available enabling Prototyping, while volume manufacturing will happen at X-FAB France, the company’s facility near Paris. 12.09.2022 13:00:00Sepnews_2022-10-01_8.png\images\news_2022-10-01_8.pnghttps://www.xfab.com/news/details/article/licensing-agreement-between-x-fab-and-ihp-leibniz-institute-leads-to-innovative-130-nm-sige-bicmos-platformxfab.com
Silicon Carbide Materials Facility in North CarolinaWolfspeed announced it will build a state-of-the-a...9997Industry NewsSilicon Carbide Materials Facility in North CarolinaWolfspeed announced it will build a state-of-the-art, multi-billion-dollar Materials manufacturing facility in Chatham County, North Carolina. The investment is targeted to generate a more than 10 fold increase from Wolfspeed's current Silicon Carbide production capacity on its Durham campus, supporting the company's long-term growth strategy, accelerating the adoption of Silicon Carbide semiconductors across a wide array of end-markets and unlocking a new era of energy efficiency. The facility will primarily produce 200mm Silicon Carbide wafers, which are 1.7x larger than 150mm wafers, translating into more chips per wafer and ultimately, lower device costs. These wafers will be used to supply Wolfspeed's Mohawk Valley Fab, which opened earlier this year as the world's first, largest and only fully automated 200mm Silicon Carbide fabrication facility. Phase one construction is anticipated to be completed in 2024 and cost approximately $1.3 billion. Between 2024 and the end of the decade, the company will add additional capacity as needed, eventually occupying more than one million square feet on the 445-acre site. "Wolfspeed is the industry leader in supplying the materials required to meet the accelerating demand for next generation semiconductors and creating a more sustainable future for all. Demand for our products continues to grow at a rapid pace, and the industry continues to be supply constrained. Expanding our Materials production will further our market leadership and allow us to better serve the growing needs of our customers," said Gregg Lowe, President and CEO of Wolfspeed.09.09.2022 16:00:00Sepnews_2022-09-15_11.jpg\images\news_2022-09-15_11.jpghttps://www.wolfspeed.com/company/news-events/news/wolfspeed-selects-north-carolina-for-worlds-largest-silicon-carbide-materials-facility/wolfspeed.com
Family of Packaged GaN FETs Offers Footprint Compatible SolutionsEPC expands the selection of off-the-shelf GaN FET...10006Product ReleaseFamily of Packaged GaN FETs Offers Footprint Compatible SolutionsEPC expands the selection of off-the-shelf GaN FETs in thermally enhanced QFN packages with the introduction of the 100 V EPC2306 designed for 48 V DC-DC conversion used in high-density computing applications, in 48 V BLDC motor drives for e-mobility and robotics, and in solar optimizers and microinverters, and Class D Audio. The EPC2306 GaN FET offers a super small RDS(on), of just 3.8 mOhm, together with very small QG, QGD, and QOSS parameters for low conduction and switching losses. The device features a thermally enhanced QFN package with exposed top and footprint of just 3 mm x 5 mm, offering an extremely small solution size for the highest power density applications. The EPC2306 is footprint compatible with the previously released 100 V, 1.8 mOhm EPC2302. The two footprint compatible devices allow designers to trade off RDS(on) vs. price to optimize solutions for efficiency or cost by dropping in a different part number in the same PCB footprint. "The EPC2306 combines the advantages of 100 V GaN with an easy to assemble QFN package without sacrificing performance," said Alex Lidow, CEO and co-founder of EPC. "Designers can use our family of packaged GaN FETs to make lighter weight battery-operated BLDC motor drives for eMobility and drones, higher efficiency 48 V input DC-DC converters for data center, datacom, artificial intelligence, and other industrial and consumer applications."08.09.2022 14:30:00Sepnews_2022-09-15_20.jpg\images\news_2022-09-15_20.jpghttps://epc-co.com/epc/EventsandNews/News/ArtMID/1627/ArticleID/3069/Expanded-Family-of-Packaged-GaN-FETs-Offers-Footprint-Compatible-Solutions-to-Optimize-Performance-vs-Cost-While-Increasing-Power-Density-and-Improving-Thermal-Performance.aspxepc-co.com
Partner on Electric Van ProductionMercedes-Benz Vans and electric vehicle manufactur...9995Industry NewsPartner on Electric Van ProductionMercedes-Benz Vans and electric vehicle manufacturer Rivian, have announced the signing of a Memorandum of Understanding to initiate a strategic partnership. The partnership will enable the companies to cooperate on the production of electric vans. Subject to the parties entering into final binding agreements and to obtaining the relevant regulatory clearances, the companies intend to establish a joint venture manufacturing company with the purpose of investing in, and operating, a factory in Europe to produce large electric vans for both Mercedes-Benz Vans and Rivian, starting in a few years. The target is to build an all-new electric-only production facility leveraging an existing Mercedes-Benz site in Central/Eastern Europe. The companies envisage production-optimised vehicle designs for efficient manufacturing on common assembly lines. They will aim to produce two large vans, one based on VAN.EA (MB Vans Electric Architecture), the electric-only platform of Mercedes-Benz Vans, and the other based on the second generation electric-van, Rivian Light Van (RLV) platform. Further options for increased synergies from the joint venture will also be explored. The joint venture mirrors the common objectives of Mercedes-Benz Vans and Rivian: both companies plan to rapidly scale the production of electric vans to help the world transition to cleaner transportation. By working together, they will be able to leverage operations synergies and substantially increase cost efficiency to help make the vans more affordable for commercial customers driven by total cost of ownership.08.09.2022 14:00:00Sepnews_2022-09-15_9.jpg\images\news_2022-09-15_9.jpghttps://media.mercedes-benz.com/article/677a158b-be7d-4069-9580-402b4a6231c7mercedes-benz.com
DC-DC Regulators with Fast COT EngineInfineon Technologies introduced a family of OptiM...10005Product ReleaseDC-DC Regulators with Fast COT EngineInfineon Technologies introduced a family of OptiMOS 5 IPOL buck regulators with VR14-compliant SVID standard and I²C/PMBus digital interfaces for Intel/AMD server CPUs and network ASICs/FPGAs. Housed in a 5 x 6 mm² PQFN package, these devices are a fully integrated, and efficient solution for next-generation server, storage, telecom, and datacom applications, as well as distributed power systems. The OptiMOS IPOL single-voltage synchronous buck regulator TDA38640 supports up to 40 A output current. The device comes with Intel SVID and I²C/PMBus digital interfaces and can be used for Intel VR12, VR12.5, VR13, VR14, IMPVP8 designs, and DDR memory without significant changes to the bill of materials (BOM). Infineon's TDA38740 and TDA38725 digital IPOL buck regulators support up to 40 A and 25 A output current, respectively and come with a PMBus interface. All three new devices use Infineon's proprietary fast constant on time (COT) PWM engine to deliver industry-leading transient performance while simplifying the design development. The onboard PWM controller and OptiMOS FETs with integrated bootstrap diode make these new devices a small footprint solution with highly-efficient power delivery. In addition, they provide the required versatility by operating in a broad input and output voltage range while offering programmable switching frequencies from 400 kHz to 2 MHz. A multiple time programming (MTP) memory allows customization during design and high-volume manufacturing, significantly reducing design cycles and time-to-market. They also offer a digitally programmable load line that can be set via configuration registers without external components, resulting in a simplified BOM. The device configuration can be easily defined using Infineon's XDP Designer GUI and is stored in the on-chip memory.08.09.2022 13:30:00Sepnews_2022-09-15_19.jpg\images\news_2022-09-15_19.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2022/INFPSS202209-115.htmlinfineon.com
APEC 2023 Student Attendance Support Program Registration is Now OpenThe joint sponsors of the Applied Power Electronic...9991Event NewsAPEC 2023 Student Attendance Support Program Registration is Now OpenThe joint sponsors of the Applied Power Electronics Conference (APEC) have announced the continuation of the popular Student Attendance Support Program for APEC 2023, scheduled to take place in Orlando, March 19-23. Chosen recipients of the program will receive reimbursement to cover qualified expenses for attending APEC 2023. Those eligible to apply for the program are power electronics students, undergraduate or graduate, who have been accepted to present papers at the upcoming conference in March. Once accepted, student presenters must apply for the Student Attendance Support Program by October 26, 2022. In its 18th year, this popular program was initiated by the Power Sources Manufacturers Association (PSMA). It is now jointly underwritten by PSMA and the other co-sponsors of the APEC conference: the IEEE Power Electronics Society (PELS) and the IEEE Industry Applications Society (IAS). The recipients of the Student Attendance Support Program will be chosen by the APEC 2023 Student Attendance Support Committee. As part of the application process, students must provide information about their educational institution, degree program, the name of their faculty advisor, as well as a brief description of their career interest and reasons for attending APEC. The application also requires the title and ID number of their accepted APEC paper, including the name(s) of the co-author(s), if applicable.08.09.2022 10:00:00Sepnews_2022-09-15_5.jfif\images\news_2022-09-15_5.jfifhttp://apec-conf.org/news/apec-2023-student-attendance-support-program-registration-is-now-open/apec-conf.org
Third-Generation 200V MV MOSFETsMagnachip Semiconductor introduced its third- gene...10004Product ReleaseThird-Generation 200V MV MOSFETsMagnachip Semiconductor introduced its third- generation 200V Medium Voltage (MV) Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs) for Light Electric Vehicles (LEV) motor controllers and industrial power supplies. To maximize energy efficiency in power devices, Magnachip's 200V MOSFETs incorporate third-generation trench MOSFET technology. The capacitance was reduced by 50% compared to the previous generation 100V MV MOSFET and the enhanced design of the core cell and termination helps lower RDS(on) and total gate charge to achieve a high figure of merit. In addition, these third-generation MOSFETs are available in surface mount device TO-Leadless Package (TOLL), M2PAK and TO-220 of a through-hole type respectively to reduce product size and enhance heat dissipation. Furthermore, the energy efficiency of these MOSFETs is increased by fast switching and high power density. Coupled with a guaranteed operating junction temperature from -55°C up to 175°C and a high level of avalanche ruggedness, these MOSFETs are well-suited for LEV motor controllers and industrial power supplies requiring high efficiency and stable power supply. "The development of advanced applications in the automotive and industrial sectors is driving the need for high-performance MV MOSFETs," said YJ Kim, CEO of Magnachip. "Magnachip will continue to upgrade its MV MOSFET product line, ranging from 40V to 200V, which will enable our customers to strengthen their product competitiveness."07.09.2022 12:30:00Sepnews_2022-09-15_18.jpg\images\news_2022-09-15_18.jpghttps://www.magnachip.com/magnachip-unveils-third-generation-200v-mv-mosfets/magnachip.com
Gallium Nitride Half-Bridge Power ICsNavitas Semiconductor announced GaNSense half-brid...10002Product ReleaseGallium Nitride Half-Bridge Power ICsNavitas Semiconductor announced GaNSense half-bridge power ICs. These half-bridge ICs enable a new level of MHz switching frequencies while reducing the system cost and complexity compared to existing discrete solutions. GaNSense half-bridge power ICs integrate two GaN FETs with drive, control, sensing, autonomous protection, and level-shift isolation, to create a fundamental power-stage building block for power electronics. This single-package solution reduces component count and footprint by over 60% compared to existing discretes, which cuts system cost, size, weight, and complexity. The integrated GaNSense technology enables autonomous protection for increased reliability and robustness, combined with loss-less current sensing for higher levels of efficiency and energy savings. The high integration levels also eliminate circuit parasitics and delays, making MHz-frequency operation a reality for a broad range of AC-DC-power topologies including LLC resonant, asymmetric half-bridge (AHB), and active-clamp flyback (ACF). The GaNSense half-bridge ICs are also a perfect fit for totem-pole PFC, as well as motor-drive applications. GaNSense half-bridge ICs are anticipated to have a significant impact in all Navitas target markets including mobile fast chargers, consumer power adapters, data center power supplies, solar inverters, energy storage, and EV applications.07.09.2022 10:30:00Sepnews_2022-09-15_16.jpg\images\news_2022-09-15_16.jpghttps://navitassemi.com/navitas-gansense-half-bridge-power-ics-the-next-stage-in-the-high-frequency-power-electronics-revolution/navitassemi.com
Driving SiC MOSFETs in a Proper WayThe silicon carbide (SiC) market continues to grow...9996Industry NewsDriving SiC MOSFETs in a Proper WayThe silicon carbide (SiC) market continues to grow as the semiconductor power source is a great solution for many applications across various industries. Earlier this year, Microchip Technology announced the expansion of its SiC portfolio with the release of the industry's lowest on-resistance 3.3 kV SiC MOSFETs and highest current-rated SiC SBDs available in the market, enabling designers to take advantage of ruggedness, reliability and performance.  The recently published "SiC MOSFET Application Note AN4616" provides design guidance for properly selecting gate-source voltages for Microchip's SiC MOSFET products, along with related device performance, behavior and design considerations for making the most effective gate driver circuit. 06.09.2022 15:00:00Sepnews_2022-09-15_10.jpg\images\news_2022-09-15_10.jpghttps://ww1.microchip.com/downloads/aemDocuments/documents/APID/ApplicationNotes/ApplicationNotes/00004616A-AN4616-Driving-Microchip-SiC-MOSFETs.pdfmicrochip.com
Sensor and Measurement Science International 2023: Call for Papers onlineThe AMA Association for Sensors and Measurement op...9993Event NewsSensor and Measurement Science International 2023: Call for Papers onlineThe AMA Association for Sensors and Measurement opens the call for papers for the international congress: Sensor and Measurement Science International (SMSI) 2023. The congress will be held in Nuremberg, Germany, May 8-11, 2023, in parallel with the SENSOR+TEST 2023 trade fair. The submission deadline for presentations and posters is November 15, 2022. SMSI 2023 under the scientific leadership of Ulrich Schmid (TU Vienna), Michael Heizmann (KIT) and Klaus-Dieter Sommer (TU Ilmenau), networks representatives from research, science and industry. The conference builds on three thematic pillars: sensor technology, measurement technology and metrology. The Sensor Technology congress pillar focuses on sensor principles, sensor materials and process technologies, electronic sensor interfaces, a wide variety of application areas and integrates the IRS² 2023 satellite conference in the field of infrared sensor technology. The Measurement congress pillar focuses on IoT-relevant and networked measurement systems, advanced measurement approaches, AI approaches in measurement, and the science of measurement and its applications. The Metrology section will address, among other topics, the revised SI (international system of units), metrology in the digital age, advanced calibration approaches and testing methods, and metrology in regulation and standards. The parallel leading trade fair of the industry SENSOR+TEST 2023, as platform for sensor, measurement and testing technology, promotes the extended innovation dialogue of the SMSI 2023 conference participants.06.09.2022 12:00:00Sepnews_2022-09-15_7.jpg\images\news_2022-09-15_7.jpghttps://www.smsi-conference.com/smsi-conference.com
Partnership to Develop Automotive SolutionsROHM and SemiDrive Technology have signed an advan...9992Industry NewsPartnership to Develop Automotive SolutionsROHM and SemiDrive Technology have signed an advanced technology development partnership for the automotive field. The companies have been engaged in technology exchange since 2019, mainly on the development of applications for vehicle cockpits. As the first fruits of this effort, SemiDrive's automotive SoC (X9 series) solution board equipped with ROHM's PMIC is now available as a solution. SemiDrive's latest automotive SoCs (X9 series) have already been adopted by a number of automakers to provide advanced functionality for cockpits and other vehicle applications. At the same time, ROHM's SerDes IC achieves low power consumption by optimizing the video transmission rate, while ROHM's PMICs not only integrate the power supply system and functions required for SoC, but a high-speed response function as well that improves power conversion efficiency and reduces component count. Kazuhide Ino, Managing Executive Officer, CSO, ROHM Co., Ltd. said "We are delighted to partner with SemiDrive, a company with extensive experience in automotive SoCs. As ADAS evolves and cockpits become more multifunctional, the performance of vehicle cameras and video transmission technology must improve, increasing the role of semiconductors such as SerDes ICs. To this end, we will continue to deepen exchanges with SemiDrive and accelerate the development of a wide range of products utilizing ROHM's cutting-edge technologies that can contribute to the further evolution of electric vehicles by providing solutions that combine peripheral components."06.09.2022 11:00:00Sepnews_2022-09-15_6.jpg\images\news_2022-09-15_6.jpghttps://www.rohm.com/news-detail?news-title=2022-09-06_news_semidrive&defaultGroupId=falserohm.com
SPS 2022: A Look Into the Future of AutomationThe 31st edition of SPS is expected to attract 1,1...9988Event NewsSPS 2022: A Look Into the Future of AutomationThe 31st edition of SPS is expected to attract 1,100 exhibitors from across the globe. The event will take place from 8 to 10 November 2022 in Nuremberg and will showcase the latest products, solutions and pioneering future technologies in the field of industrial automation. This year once again, visitors will be treated to a dazzling array of products and services from national and international suppliers of automation and digitalisation solutions. They will also have the chance to get a comprehensive overview of the market via the complementary digital event platform "SPS on air", which will be available before, during and after the three-day physical event in Nuremberg. In the week before the event starts, SPS ticket holders have an opportunity to participate in a digital "pre-heat event" with numerous technical presentations and product previews on the "SPS on air" platform. During the exhibition itself, the supplementary program will run at the VDMA/ZVEI Forum in Hall 3 on the exhibition grounds and from the SPS Live Studio in Nuremberg on the digital supplement "SPS on air".06.09.2022 07:00:00Sepnews_2022-09-15_2.jpg\images\news_2022-09-15_2.jpghttps://sps.mesago.com/nuernberg/en/press/press-releases/sps-press-releases/A-look-into-the-future.htmlsps.mesago.com
Flexible Power Modules Simplify SiC Inverter DesignsSTMicroelectronics has released two STPOWER module...10000Product ReleaseFlexible Power Modules Simplify SiC Inverter DesignsSTMicroelectronics has released two STPOWER modules that contain 1200V silicon-carbide (SiC) MOSFETs in popular configurations. Each uses ST's ACEPACK 2 package technology to ensure high power density and simplified assembly. The A2F12M12W2-F1, is a four-pack module that provides a convenient and compact full-bridge solution for circuits such as DC/DC converters. Another module, the A2U12M12W2-F2, employs a three-level T-type topology to combine high conduction and switching efficiency with consistent output-voltage quality. The MOSFETs in these modules leverage ST's second-generation SiC technology, which has an outstanding RDS(on) x die-area figure of merit to ensure high current-handling capability with minimal losses. With 13m? typical RDS(on) per die, both full-bridge and T-type topologies tackle high-power applications and ensure excellent energy efficiency with simplified thermal management due to low dissipation. The ACEPACK 2 package has compact dimensions and ensures high power density, with an efficient alumina substrate and direct bonded copper (DBC) die attachment. The external connections are press fit pins that simplify assembly in potentially harsh-environment equipment such as electric vehicles (EVs) and power conversion for charging stations, energy storage, and solar energy. The package provides 2.5kVrms insulation and contains an integrated NTC temperature sensor that can be used for system protection and diagnostics.05.09.2022 08:30:00Sepnews_2022-09-15_14.jpg\images\news_2022-09-15_14.jpghttps://newsroom.st.com/media-center/press-item.html/n4478.htmlst.com
Power Chip Cooler with a Thermal Resistance of Merely 1.4 K/WSEPA EUROPE introduces the HZB50B, a chip which, c...10022Product ReleasePower Chip Cooler with a Thermal Resistance of Merely 1.4 K/WSEPA EUROPE introduces the HZB50B, a chip which, cooler with its low thermal resistance of only 1.4 K/W, is suitable for both, powerful processors and FPGAs. It is noticeable at first glance that the HZB50B has a very light and compact construction. It measures merely 50 x 50 x 11.5 mm and weighs only 39 g which renders it suitable for low installation heights. The heat sink was produced from pure aluminum by modern impact extrusion which means that large quantities can be manufactured cost-effectively. Thanks to its robust ball bearing system, it has a service life of 350.000 h (at 40°C) and is thus particularly suitable for failsafe cooling. The brass push pins ensure easy attachment. The PCB only requires preparing with the corresponding holes and reinforcements. The compression springs provide an ideal thermal transfer from the semiconductor to the heat sink. The chip cooler HZB50B is available with 5 and 12 V and can also be supplied on request with pre-assembled adhesive pads.02.09.2022 09:30:00Sepnews_2022-10-01_14.jpg\images\news_2022-10-01_14.jpghttps://www.sepa-europe.com/en/2022/09/02/power-chip-cooler-hzb50b12a-with-a-thermal-resistance-of-merely-1-4-k-w/sepa-europe.com
Cell Phones with Inbuilt GaN Charging ProtectionInnoscience Technology announced the Bi-GaN series...9994Industry NewsCell Phones with Inbuilt GaN Charging ProtectionInnoscience Technology announced the Bi-GaN series of bi-directional GaN HEMT devices that save space and facilitate fast charging without suffering from reliability-limiting and potentially dangerous rises in temperature that can sometimes be seen in traditional silicon devices. Innoscience has also revealed that OPPO is using the BiGaN devices inside its phone handset to control the battery's charging and discharging currents. This is the first time that such protection, based on GaN technology, has been included in the phone itself – previously the circuitry had to be incorporated inside the charger. Until recently, silicon MOSFETs have been used as power switches in cell phones. However, these traditional devices not only occupy significant space on a cell phone's main PCB where every millimeter counts, they may also result in considerable temperature rises and power loss when fast-charging. InnoGaN has advantageous characteristics such as high frequency, high efficiency and low resistance, which are vital for efficient charging. Thanks to InnoGaN's low RDS(on), the fact that it does not have parasitic diodes, and the unique bidirectional feature of Innoscience's BiGaN technology, one BiGaN HEMT can be used to replace back-to-back connected NMOS MOSFETs in a common-source configuration to achieve bi-directional switching of the battery's charging and discharging currents01.09.2022 13:00:00Sepnews_2022-09-15_8.jpg\images\news_2022-09-15_8.jpghttps://www.innoscience.com/site/details/440?el=mdnavinnoscience.com
PCIM Asia 2022: New DateIn light of recent developments concerning the pan...9990Event NewsPCIM Asia 2022: New DateIn light of recent developments concerning the pandemic in Shanghai, PCIM Asia will now be held from 26 – 28 October 2022 in Hall E1 at the Shanghai New International Expo Centre. The show will continue to provide a platform for exchanging ideas, showcasing technologies and expanding business networks. This will be achieved through gathering the latest power electronics suppliers at the fairground and by exploring the latest trends through the fair's concurrent programme. On behalf of the organisers, Mr Louis Leung, Deputy General Manager of Guangzhou Guangya Messe Frankfurt Co Ltd expressed: "We are pleased to have confirmed suitable dates for the rescheduling of the fair, which meet the needs of our stakeholders. Meanwhile, we are in contact with our local and international exhibitors and supporters to provide them with the necessary support to facilitate their participation. We are also prepared to put the necessary measures in place to ensure the wellbeing of all fairgoers during the course of the October fair."01.09.2022 09:00:00Sepnews_2022-09-15_4.jfif\images\news_2022-09-15_4.jfifhttps://pcimasia-expo.cn.messefrankfurt.com/shanghai/en/press/press-releases/2022/PCIM22_new_date.htmlpcimasia-expo.cn
Acquisition CompletedAllegro MicroSystems announced the completion of i...9987Industry NewsAcquisition CompletedAllegro MicroSystems announced the completion of its previously-announced acquisition of Heyday Integrated Circuits (Heyday). Heyday is a privately held company specializing in compact, fully integrated isolated gate drivers that enable energy conversion in high-voltage gallium nitride (GaN) and silicon carbide (SiC) wide-bandgap (WBG) semiconductor designs. This acquisition brings together Heyday's isolated gate drivers and Allegro's isolated current sensors to enable some of the smallest high-voltage and high-efficiency power systems available on the market today. Additionally, this acquisition is expected to increase Allegro's addressable market for electric vehicles (xEV), solar inverters, datacenter and 5G power supplies, and broad-market industrial applications. "The demand for simplified power management is increasing across the board, and high-voltage isolated gate drivers are fundamental for enabling technology for the future of high-efficiency power system designs" said Joe Duigan, Senior Director, Engineering and Business Development. "Together with Allegro's market leading current sensors and Heyday's isolated gate drivers we will be able to power the increasingly popular GaN and SiC MOSFET driven systems." "We're thrilled to welcome Heyday to the Allegro family," said Vijay Mangtani, Vice President of Power ICs at Allegro. "This acquisition will greatly accelerate our efforts to deliver a market leading energy efficient technology platform for high-voltage designs in advanced mobility, clean energy, and motion control solutions."01.09.2022 06:00:00Sepnews_2022-09-15_1.png\images\news_2022-09-15_1.pnghttps://www.allegromicro.com/en/about-allegro/news-room/2022/heyday-acquisitionallegromicro.com
Managing Director for European OperationsPalomar Technologies announced the appointment of ...9989PeopleManaging Director for European OperationsPalomar Technologies announced the appointment of Mr. Thorsten Scheidler as the new managing director for its European operations effective October 1, 2022. Mr. Scheidler replaces Mr. Josef Schmidl who is retiring after more than 30 years with Palomar Technologies. "It's with sad hearts that we announce the retirement of our long-time colleague, Mr. Josef Schmidl, yet welcome Mr. Scheidler to his new position as managing director for Palomar Europe," said Bruce Hueners, President and CEO for Palomar Technologies, Inc. "We wish Mr. Schmidl a long, healthy and happy retirement and wish Mr. Scheidler great success in his new role and look forward to working with him." Over his 30+ years with Palomar Technologies, Mr. Schmidl was instrumental in opening up the European market to Palomar semiconductor packaging equipment and building the market. He joined Hughes Aircraft in 1986 as a service and applications engineer. In 1995, Mr. Schmidl moved to sales and two years later, he established Palomar GmbH in Erlangen, Germany, a wholly-owned subsidiary of Palomar Technologies. Since then, Mr. Schmidl has grown Palomar GmbH into an organization that provides sales and service support to customers in Europe, Russia, the Middle East, and Africa. Mr. Thorsten Scheidler, Sales Director Europe for SST Vacuum Reflow Systems has over 15 years of sales and technical support experience within the power electronics and semiconductor industries in Europe.  He has been instrumental in implementing sales strategies for Palomar's wholly owned subsidiary, SST Vacuum Reflow Systems in the EMEA market.31.08.2022 08:00:00Augnews_2022-09-15_3.jpg\images\news_2022-09-15_3.jpghttps://www.palomartechnologies.com/news-room/press-releases/palomar-technologies-appoints-new-managing-director-for-its-european-operationspalomartechnologies.com
Si IGBTs for Electric Vehicle InvertersRenesas Electronics announced the development of a...10030Product ReleaseSi IGBTs for Electric Vehicle InvertersRenesas Electronics announced the development of a generation of Si-IGBTs (Silicon Insulated Gate Bipolar Transistors) which will be offered in a small footprint while providing low power losses. Aimed at next generation electric vehicle (EVs) inverters, AE5-generation IGBTs will be mass produced starting in the first half of 2023 on Renesas’ 200- and 300-mm wafer lines at the company’s factory in Naka, Japan. Additionally, Renesas will ramp up production starting in the first half of 2024 at its power semiconductor 300-mm wafer fab in Kofu, Japan to meet the growing demand for power semiconductor products. The silicon based AE5 process for IGBTs achieve a 10% reduction in power losses compared to the current-generation AE4 products, a power savings that will help EV developers save battery power and increase driving range. In addition, the products are approximately 10% smaller while maintaining high robustness. The Renesas devices achieve a high level of performance for IGBTs by optimally balancing low power loss and robustness trade offs. Moreover, the IGBTs improve performance and safety as modules by minimizing parameter variations among the IGBTs and providing stability when operating IGBTs in parallel. These features provide engineers greater flexibility to design smaller inverters that achieve high performance.30.08.2022 17:30:00Augnews_2022-10-01_22.jpg\images\news_2022-10-01_22.jpghttps://www.renesas.com/eu/en/about/press-room/renesas-unveils-new-generation-si-igbts-electric-vehicle-invertersrenesas.com
Discrete SiC MOSFETs for High-voltage Industrial ApplicationsToshiba Electronics Europe has launched five 1200V...10007Product ReleaseDiscrete SiC MOSFETs for High-voltage Industrial ApplicationsToshiba Electronics Europe has launched five 1200V silicon-carbide (SiC) MOSFETs that leverage the Company's third generation SiC technology to boost the energy efficiency of high-voltage industrial applications. They are used in equipment such as EV charging stations, photovoltaic inverters, industrial power supplies, uninterruptible power supplies (UPS), and bidirectional or half-bridge DC-DC converters. By improving the on-resistance x gate-drain charge (RDS(on) x QGD) figure of merit by more than 80%, Toshiba's latest SiC technology elevates both conduction and switching performance in power-conversion topologies. In addition, the devices contain the innovative embedded Schottky barrier diode (SBD), proven in the previous generation. The embedded SBD enhances the reliability of SiC MOSFETs by overcoming internal parasitic effects to maintain a stable device RDS(on). Furthermore, the products have a generous maximum gate-source voltage range, from -10V to 25V, which enhances flexibility to operate in various circuit designs and application conditions. The gate-threshold voltage (VGS(th)) range from 3.0V to 5.0V, ensures predictable switching performance with minimal drift and permits a simple gate-driver design. The third generation SiC MOSFETs available now comprise the TW015N120C, TW030N120C, TW045N120C, TW060N120C, and TW140N120C. The devices have RDS(on) values from 15m? to 140m? (typical, at VGS = 18V) and drain-current ratings from 20A to 100A (DC at TC=25°C). All the devices are in full production and ready to order from distributors, in the standard TO-247 power package.30.08.2022 15:30:00Augnews_2022-09-15_21.jpg\images\news_2022-09-15_21.jpghttps://toshiba.semicon-storage.com/eu/company/news/2022/08/sic-power-devices-20220830-2.htmltoshiba.semicon-storage.com
Compact Single-stage Filter FamilySCHURTER expands the FMAB NEO single-phase filter ...10001Product ReleaseCompact Single-stage Filter FamilySCHURTER expands the FMAB NEO single-phase filter family with variants for protection class II applications. The filter series without protective ground connection is available as a medical M5 version for a rated current range from 1 A to 20 A with plug-in terminals. Protection class II, also known as protective insulation, means protection by double or reinforced insulation. All clearances and creepage distances must be doubled, and inside the filter double or reinforced insulation is mandatory. The FMAB NEO filter series Protection Class II meets all these requirements: reinforced insulation inside the filter and the plug-in terminals have a large plastic collar. The filters are tested with 4 kVAC between L or N against the metal housing. Protection class II applications do not have a protective ground wire. To ensure effective personal protection even without a protective ground conductor, protection class II devices feature additional insulation. Typical applications include power tools, audio and video equipment and many medical devices. Protection class II is even mandatory for a variety of medical applications. For example, medical devices for use at home must be of protection class II according to IEC 60601-1-11. The single-stage FMAB NEO filter family has a particularly compact design combined with high performance. It is suitable for applications in the temperature range from -40 °C to 100 °C and has ENEC and cURus approvals. In addition to the standard version, SCHURTER also offers variants with optimized attenuation. These variants have particularly high-quality core materials.30.08.2022 09:30:00Augnews_2022-09-15_15.jpg\images\news_2022-09-15_15.jpghttps://www.schurter.com/en/news/fmab-neo-protection-class-iischurter.com
Compact Industrial AC/DC Power SuppliesP-DUKE has added the TAD50 series to its open fram...9998Product ReleaseCompact Industrial AC/DC Power SuppliesP-DUKE has added the TAD50 series to its open frame power supplies portfolio from 15W to 450W. It has a compact 3"x1.5" footprint and delivers 50W continuous output power. In addition, a peak power function is available that enables the power supply to deliver up to 140% of rated output power for 5 seconds. This series is designed with a high conversion efficiency of 90.5% to 92.5%, enabling full-power operation from -40? to +55? ambient temperature without derating or forced air cooling. With forced air cooling or with output power derating the TAD50 series can perform up to +85?. The universal input voltage range is 85-264Vac (120-370Vdc) and outputs are available from 5, 7.5, 9, 12, 15, 18, 24, 36, 48 and 53Vdc with output adjustability of -10% to +10% or -20% to +10%, depending on output voltage. The TAD50 series features full protection against output short-circuit (continuous, automatic recovery), over-load (hiccup mode, automatic recovery) and output over-voltage (latch mode). The TAD50 series allows operating altitudes of up to 5000m and has a 3kVac/ 1 minute reinforced I/O-insulation and over voltage category OVC III. The integrated EMC filter complies with EN 55032, class B for conducted and radiated emission.30.08.2022 06:30:00Augnews_2022-09-15_12.png\images\news_2022-09-15_12.pnghttps://www.pduke.com/news_detail.php?type=1&NewsNo=105pduke.com
High-Power Fuse Series for EV/HEV Application Accessory Circuit ProtectionBourns announced a POWrFuse High-Power Fuse model ...10003Product ReleaseHigh-Power Fuse Series for EV/HEV Application Accessory Circuit ProtectionBourns announced a POWrFuse High-Power Fuse model series. Bourns specifically designed the POWrFuse Model PF-K Series to meet ISO 8820-8 standards for the protection of high-voltage accessory circuits in electric vehicles (EVs) and hybrid electric vehicles (HEVs). These circuits are found in a variety of EV/HEV applications including electrical energy storage (ESS), battery disconnect units (BDUs) and battery management systems (BMS). These high-voltage EV fuses support operation up to 500 VDC and feature a 20 kA at 500 VDC interrupting rating and an extended temperature range of -55 to +125 °C. Individual models within the PF-K Series have current ratings from 15 to 50 A and are available in bolt and PCB mounting options. In addition, the latest POWrFuse EV fuses have been tested to Bourns' internal automotive quality standards for environmental reliability, transient current cycling and device electrical and fusing characteristics. The Bourns POWrFuse Model PF-K Series models are available now and are RoHS compliant and halogen free.29.08.2022 11:30:00Augnews_2022-09-15_17.jpg\images\news_2022-09-15_17.jpghttps://www.bourns.com/news/press-releases/pr/2022/08/29/bourns-announces-powrfuse-trade-high-power-fuse-series-optimized-for-high-voltage-ev-hev-application-accessory-circuit-protectionbourns.com
Automotive Grade IHSR High Temperature InductorVishay introduced the first AEC-Q200 qualified IHS...9999Product ReleaseAutomotive Grade IHSR High Temperature InductorVishay introduced the first AEC-Q200 qualified IHSR high temperature inductor with current ratings to 155 A in the 19.0 mm by 17.1 mm by 7.0 mm 6767 case size. Designed for multi-phase, high current power supplies and input / output filters in automotive under the hood and ADAS applications, the Vishay Dale IHSR-6767GZ-5A offers a 50 % reduction in DCR over typical power inductors and a smaller size than similar ferrite-based solutions. The Automotive Grade inductor is optimized for energy storage in DC/DC converters up to 5 MHz and high current filtering applications. With its high operating temperature up to +155 °C, the device is also suitable for filtering and DC/DC conversion in ADAS and LIDAR microprocessors, 12 V / 48 V vacuum-less braking systems, OBCs, and brushless DC electric motors up to 140 A. For these applications, the IHSR-6767GZ-5A's low typical DCR of 0.24 mO and inductance of 0.22 µH allow for higher current density than competing technologies, with no hard saturation and more stable inductance and saturation over the entire operating temperature range. Packaged in a 100 % lead (Pb)-free shielded, composite construction that reduces buzz noise to ultra low levels, the inductor offers high resistance to thermal shock, moisture, and mechanical shock, and handles high transient current spikes without saturation. The device is RoHS-compliant, halogen-free, and Vishay Green.29.08.2022 07:30:00Augnews_2022-09-15_13.jpg\images\news_2022-09-15_13.jpghttps://www.vishay.com/en/company/press/releases/2022/IHSR-6767GZ-5A/vishay.com
Device Modeling Software Enables One-Stop WorkflowKeysight Technologies announced a model generator ...9986Product ReleaseDevice Modeling Software Enables One-Stop WorkflowKeysight Technologies announced a model generator (MG) environment that increases productivity for semiconductor device modeling engineers with improved automation across the entire workflow. Semiconductor device modeling engineers require automated tools to create accurate simulation models and process design kits (PDK) for baseband and radio frequency (RF) integrated circuit (IC) designs that leverage both silicon (CMOS) and compound III-V technologies. "Keysight's device modeling 2023 software suite addresses the needs of customers who generate high-quality SPICE models in limited time," said Ma Long, manager of device modeling and characterization at Keysight Technologies. "This new solution offers workflow and speed improvements and represents a significant advancement toward delivering a flexible and open environment that integrates all Keysight modeling technologies." 25.08.2022 15:30:00Augnews_2022-09-01_21.jpg\images\news_2022-09-01_21.jpghttps://www.keysight.com/us/en/about/newsroom/news-releases/2022/0825-nr22097-keysight-announces-new-device-modeling-software--to.htmlkeysight.com
Reliable Battery ManagementWith WE-BMS, Würth Elektronik presents signal tran...9977Product ReleaseReliable Battery ManagementWith WE-BMS, Würth Elektronik presents signal transformers for battery management systems which, thanks to their galvanic isolation of 4300 VDC/1 min and high operating voltage of up to 1000 VDC, are ideal for use in energy storage systems, E-bikes or E-scooters. Besides the transformers, the WE-BMS series components also include at least one common-mode choke to filter common-mode interference. Würth Elektronik's design offers far longer physical creepage than comparable products on the market yet is very compact. Low-profile component variants of 3.45 mm height are also available. As the product code WE-BMS spells out, the transformers are absolutely optimized for battery management systems. They are primarily used to ensure reliable operation and provide information about the charging status. The individual cells of a battery pack are connected in series, as are the downstream BMS controllers. Voltage differences and electromagnetic interference may occur between series-connected components or boards. The WE-BMS transformer serves to isolate components from each other and suppress EMI. Applications include storage systems for solar installations or uninterrupted power supplies (UPS). As the WE-BMS series is AEC-Q200 qualified, it is also very well suited for E-mobility applications. WE-BMS supports serial daisy chain, isoSPI and SPI.25.08.2022 06:30:00Augnews_2022-09-01_12.jpg\images\news_2022-09-01_12.jpghttps://www.we-online.com/web/en/wuerth_elektronik/news_weg/News_Detail_WE_Gruppe_136830.phpwe-online.com
Dual-Channel Input with Integrated Boost SoC Li-Ion Battery Switching ChargerHalo Microelectronics announced the release of its...9983Product ReleaseDual-Channel Input with Integrated Boost SoC Li-Ion Battery Switching ChargerHalo Microelectronics announced the release of its HL7090, a fully automatic and highly integrated lithium battery charging management IC with one switching charger, two linear chargers, and full-range programmable charge parameters through an I2C compatible interface. The HL7090 is a compact, flexible, and high-efficiency switching-mode charge management IC for single-cell Li-ion and Li-polymer batteries used in various IoT and wearable applications, including ear pods. The HL7090 integrates load switches to accommodate USB and wireless charging sources. Its integrated buck switching charger can operate in boost mode, which powers the linear chargers to charge two accessories simultaneously, ideal for earbud applications. The charge parameters can be programmed through the I2C interface (HL7090FN03 version). The IC integrates a synchronous PWM controller, power MOSFET, input current sensing, high-accuracy current, voltage regulation, and charge termination function into a tiny 3mm x 3mm QFN package. The HL7090 provides fully automatic three-phase battery charging control, including trickle charge, constant-current charge (CC), and constant voltage charge (CV) until the battery reaches the charge termination voltage. The input current is automatically limited to the value set by the host, and the charging is terminated based on the battery voltage and a user-selectable minimum current level. A safety timer with reset control provides a safety backup for the I2C interface.23.08.2022 12:30:00Augnews_2022-09-01_18.jpg\images\news_2022-09-01_18.jpghttps://halomicro.com/900ma-dual-channel-input-with-integrated-boost-soc-li-ion-battery-switching-charger/halomicro.com
High-Voltage Power Film Capacitor for DC Filtering ApplicationsKYOCERA AVX is celebrating the release of its 1,00...9980Product ReleaseHigh-Voltage Power Film Capacitor for DC Filtering ApplicationsKYOCERA AVX is celebrating the release of its 1,000th TRAFIM Series high-voltage power film capacitor for DC filtering applications up to 6,000VDC. TRAFIM Series capacitors are widely renowned for their high energy density and controlled self-healing technology, which ensures proven-safe, high-reliability performance over 100,000-hour lifetimes at rated voltage and 80°C hot spot temperature - and up to 240,000 hours with appropriate derating - in a wide range of high-voltage industrial, military, research, traction, power transmission, and renewable energy applications. TRAFIM Series capacitors feature large, rectangular, hermetically sealed, unpainted, and nonmagnetic stainless steel cases with volumes up to 46L and are currently available as 1,000 unique part numbers - including the newest model, TRAFIMA00, released in September 2021 - with 12 standard voltage ratings spanning 1,950VDC to 6,000VDC, capacitance values extending from 110µF to 10,600µF ±10% tolerance (standard), or ±5% or ±2% on request), and operating temperatures spanning -55°C to +95°C. The series also delivers high specific energy, up to 495J/L, and long-lifetime performance extending up to 100,000 hours at rated voltage and 80°C hot spot temperature with a 2% end-of-life capacitance reduction (?C/C) and up to 240,000 hours with appropriate derating. Its two standard case sizes measure 340mm x 117mm and 340mm x 165mm (L ´ W), are available with heights spanning 215mm to 815mm, and feature an integrated grounding nut. They are also available with two or four M8 or M17 female or M12 or M30 male terminals and with optional mounting brackets.23.08.2022 09:30:00Augnews_2022-09-01_15.jpg\images\news_2022-09-01_15.jpghttps://www.kyocera-avx.com/news/trafim-1000th-release/kyocera-avx.com
GaN FETs Alleviate Space Limitations to Achieve Higher Frequency and Power RatingDesigning-in Efficient Power Conversion's 100 V FE...9970Industry NewsGaN FETs Alleviate Space Limitations to Achieve Higher Frequency and Power RatingDesigning-in Efficient Power Conversion's 100 V FETs into BRC Solar's power optimizer has enabled a higher current density due to the low power dissipation and the small size of the GaN FET making the critical load circuit more compact. The small parasitic capacitance and inductance of the GaN FETs creates a clean switching performance which allows good EMI behavior in the field. Another benefit of the GaN FETs is the zero reverse recovery losses. BRC's previous range, the M400/12, handled currents up to 12 Amps and a maximum power operation at 400 watts. By changing from Si FETs to GaN FETs the company achieved an increase of output current to 14 Amps with a power rating of 500 watts – while keeping the same board size. Also, the switching frequency in the M500/14 is twice as high than the previous generation allowing for passive components, such as capacitors and inductors, to be decreased in value or even completely removed. Winona Kremb from BRC Solar Gmbh, commented, "EPC's eGaN FETs open a new horizon in the development of high-density power electronics. We will watch the further applications and products from EPC and are excited to be part of the journey." "Working with BRC has been an exciting design-in opportunity and, together with our distribution partner Finepower, we have been able to achieve great results moving the company from silicon to GaN. Designers using GaN can now take advantage of devices that are higher performance, smaller, more thermally efficient, and at a comparable cost," added Stefan Werkstetter, VP of Sales, EMEA at EPC.23.08.2022 09:00:00Augnews_2022-09-01_5.jpg\images\news_2022-09-01_5.jpghttps://epc-co.com/epc/EventsandNews/News/ArtMID/1627/ArticleID/3068/BRC-Solar-Selects-EPC-100-V-eGaN-FETs-for-Next-Generation-Solar-Optimizer.aspxepc-co.com
Buck Switcher IC for Low-Part-Count Automotive PSUsPower Integrations announced a high-current member...9978Product ReleaseBuck Switcher IC for Low-Part-Count Automotive PSUsPower Integrations announced a high-current member of its LinkSwitch-TN2Q automotive switcher IC family which provides up to 850 mA of output current without the need for metal heatsinking. The integrated ICs support a wide input voltage of 30 to 550 VDC, enabling the devices to start up and operate below the required Safety Extra Low Voltage (SELV) threshold in functional safety EV applications. Edward Ong, senior product marketing manager at Power Integrations, said: "As electronics in electric vehicles grow more sophisticated, automotive customers need higher supply currents to drive them. The 850-mA rating for this new IC represents an increase of 230 percent in available output current compared with other members of the LinkSwitch-TN2Q family. LinkSwitch-TN2Q ICs reduce part-count by including control, driver, protection circuitry and a 750 V power MOSFET in an SMD package." LinkSwitch-TN2Q ICs are AEC-Q100 qualified and support buck, buck-boost and non-isolated flyback converter topologies. Each device incorporates a 750 V power MOSFET, oscillator, on/off control, a high-voltage switched current source for self-biasing, frequency jittering, fast (cycle-by-cycle) current sensing and current limit, hysteretic thermal shutdown, and output over-voltage protection circuitry in a monolithic IC. LinkSwitch-TN2Q ICs consume very little current in standby, resulting in power supply designs that easily meet less than 50 mW no-load at 400 VDC input. Comprehensive protection features enable safe and reliable power supplies, including protection against input and output overvoltage, device over-temperature, lost regulation, and power supply output overload or short-circuit faults.23.08.2022 07:30:00Augnews_2022-09-01_13.jpg\images\news_2022-09-01_13.jpghttps://investors.power.com/news/news-details/2022/Power-Integrations-Delivers-AEC-Qualified-Buck-Switcher-IC-with-850-mA-Output-for-Low-Part-Count-Automotive-PSUs/default.aspxpower.com
Supplier Base for Silicon Carbide WafersInfineon Technologies and II-VI Incorporated have ...9968Industry NewsSupplier Base for Silicon Carbide WafersInfineon Technologies and II-VI Incorporated have signed a multi-year supply agreement for silicon carbide (SiC) wafers. The German-based semiconductor manufacturer is thus securing further access to this strategic semiconductor material to meet the strong increase in customer demand in this area. The agreement also supports Infineon's multi-sourcing strategy and increases its supply chain resilience. The first deliveries have already taken place. As strategic partners, II-VI and Infineon are also collaborating in the transition to 200mm SiC diameter wafers. "SiC compound semiconductors set new standards in power density and efficiency. We are leveraging them to deliver on our strategy of decarbonization and digitalization," said Angelique van der Burg, Chief Procurement Officer at Infineon. "Infineon is increasing investments in its SiC manufacturing capacity to meet the rapidly growing demand from our customers. We are pleased to add II-VI to our strategic supplier base and grow our business together." Infineon expects its SiC semiconductor sales to grow by more than 60 percent on average per year, reaching approximately $1 billion by mid-decade. For the second half of the decade, Infineon expects on-going growth momentum, for which it invests in its recently announced additional manufacturing block in Kulim, Malaysia.23.08.2022 07:00:00Augnews_2022-09-01_3.jpg\images\news_2022-09-01_3.jpghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2022/INFXX202208-114.htmlinfineon.com
600 V Ultrafast Rectifiers in TO-244 PackageVishay introduced four FRED Pt Gen 5 600 V Ultrafa...9982Product Release600 V Ultrafast Rectifiers in TO-244 PackageVishay introduced four FRED Pt Gen 5 600 V Ultrafast rectifiers in the TO-244 package. The 240 A, 300 A, 480 A, and 600 A Vishay Semiconductors rectifiers are designed to increase the efficiency of medium frequency power converters and of hard- and soft-switched or resonant designs. Compared to competing FRED Pt Ultrafast solutions in the TO-244 package, the devices offer lower conduction, while maintaining low reverse recovery losses. The result is improved efficiency for industrial applications, such as high frequency welding and ballast water management systems. Delivering high speed, high temperature operation for these applications, the VS-VS5HD240CW60, VS-VS5HD300CW60, VS-VS5HD480CW60, and VS-VS5HD600CW60 offer low Qrr down to 260 nC typical, fast recovery time down to 52 ns, and an operating temperature range up to +175 °C.22.08.2022 11:30:00Augnews_2022-09-01_17.jpg\images\news_2022-09-01_17.jpghttps://www.vishay.com/en/company/press/releases/2022/VS-VS5HDxx0CW60/vishay.com
Green Light for Joined CompanySEMIKRON and Danfoss Silicon Power are joining for...9967Industry NewsGreen Light for Joined CompanySEMIKRON and Danfoss Silicon Power are joining forces to establish the ultimate partner in power electronics. On August 22, less than five months after it was first announced, Semikron Danfoss started doing business. With an existing workforce of more than 3,500 dedicated power electronic specialists, Semikron Danfoss will provide technology expertise to its loyal customer base. The merger comes with a strong growth plan and a firm commitment to future investments, paving the way for green growth and a more sustainable, energy efficient, and decarbonized future. The newly formed Semikron Danfoss joint business will be owned by the current owner-families of SEMIKRON and the Danfoss Group, with Danfoss being the majority owner. Semikron Danfoss will retain the two main locations in Germany, Nuremberg and Flensburg. All global subsidiaries, production sites, as well as distribution channels will continue. Claus A. Petersen, has been appointed CEO of Semikron Danfoss. "Semikron Danfoss will inspire the future. The timing of the new company is perfect. With strong growth in our key markets – automotive, industry and renewables – the merger is a great opportunity for customers, partners, and our employees. Also, with the emerging technology transition from Silicon to Silicon Carbide, we are set to become the strongest partner of our customers."22.08.2022 06:00:00Augnews_2022-09-01_2.jpg\images\news_2022-09-01_2.jpghttps://www.semikron.com/about-semikron/news-press/detail/approved-green-light-for-joined-company-semikron-danfoss.htmlsemikron.com
GaAs Power Semiconductors Ready for Volume ProductionIn the past few months, 3-5 Power Electronics GmbH...9976Industry NewsGaAs Power Semiconductors Ready for Volume ProductionIn the past few months, 3-5 Power Electronics GmbH has fulfilled the prerequisites for the market launch of new types of power semiconductors. For the diodes made of gallium arsenide (GaAs), high efficiency of both product properties and manufacturability have been demonstrated in extensive tests. The electronic components are ideally suited for applications in the fields of renewable energy and electromobility. 3-5 Power Electronics has established its development and production site in the Dresden Technology Center. The company deals with novel semiconductors for power electronics. The development team, which has now grown to ten highly specialized engineers, has succeeded in conditioning the widely used semiconductor material gallium arsenide (GaAs) so that it can be used to build diodes for switching high voltages and currents. Electrical characteristics evaluations confirm higher efficiency compared to commonly used silicon diodes. An additional positive aspect results from a significantly more cost-effective manufacturing technology compared to silicon carbide diodes. The currently available devices are the result of a joint project with Saxon companies and research institutes funded by the German Federal Ministry of Economics. "The most important motivation for locating our company in Dresden is the very compressed research and service landscape in the field of semiconductor technology" says Dr. Volker Dudek, the managing director responsible for R&D processes.20.08.2022 15:00:00Augnews_2022-09-01_11.jpg\images\news_2022-09-01_11.jpghttp://3-5pe.com/en/3-5pe.com
SiC Epitaxy Substrate Prep SolutionOxford Instruments Plasma Technology announce an a...9969Industry NewsSiC Epitaxy Substrate Prep SolutionOxford Instruments Plasma Technology announce an alternative method of preparing SiC substrates for epitaxy. Plasma polishing for SiC substrates has been demonstrated as a HVM compatible alternative to Chemical Mechanical Planarization (CMP), while alleviating significant technical, environmental and supply-chain issues associated with CMP. The Oxford Instruments' Plasma Polish Dry Etch (PPDE) process is a direct plug and play replacement for CMP and easily integrates into existing process flows. CMP has been the process of record for SiC substrate preparation for many years, but suffers from undesirable operational issues and the industry as a whole is struggling to meet increasing demand for SiC substrates. Operating CMP in SiC substrate fabs has a large environmental footprint due to the semi-toxic slurry biproduct, and the heavy water usage that the process demands is wasteful. In addition, the polishing pads and speciality chemicals bring significant consumable cost in a challenging supply chain environment. Furthermore, the CMP process is inherently unstable as slurry chemicals and polishing pads are consumed, introducing drift into the process line. PPDE is a stable non-contact process, which reduces handling loss and allows for the processing of thinner wafers, producing more wafers per boule and enabling the progression to 200mm SiC substrates. 19.08.2022 08:00:00Augnews_2022-09-01_4.jpg\images\news_2022-09-01_4.jpghttps://www.oxinst.com/news/new-sic-epitaxy-substrate-prep-solution/?sbms=plasma-technologyoxinst.com
Fuseholder for Through-Hole ReflowThe SCHURTER OGN fuseholder is a product that has ...9981Product ReleaseFuseholder for Through-Hole ReflowThe SCHURTER OGN fuseholder is a product that has proven itself over decades and has been continuously improved and expanded with new variants. It started with a THT version (Through-Hole Technology), followed by one for SMT (Surface-Mounting Technology). Now SCHURTER is introducing a third option, which closes the last gap: THR (Through-Hole Reflow). Highly integrated electronic circuits are almost exclusively assembled with SMT components and soldered in a reflow oven. However, it is sometimes necessary to include THT components on the circuit board. This has a decisive disadvantage: THT components need to be soldered differently, a second soldering process is necessary. In fact, THR components are through-hole components. They are specially designed for automated assembly and high thermal stress in the reflow oven. During the assembly process, a paste is first printed into the vias for the THT pins, and then the component is pushed through the solder paste. As the paste melts in the reflow oven, the liquid solder retracts into the vias due to wetting and capillary forces and forms the solder joint. The open fuseholder OGN is designed for 5x20 fuses of various types. It naturally complies with the tightened rules of glow wire resistance according to IEC 60335-1. If desired, it can be converted into a closed fuse holder by means of an optionally available cover.18.08.2022 10:30:00Augnews_2022-09-01_16.jpg\images\news_2022-09-01_16.jpghttps://www.schurter.com/en/news/ogn-for-thrschurter.com
Flux-Cored Wire for Robotic and Manual SolderingIndium Corporation announces that it is now offeri...9985Product ReleaseFlux-Cored Wire for Robotic and Manual SolderingIndium Corporation announces that it is now offering CW-818, a no-clean, high-reliability flux-cored wire designed to minimize cycle times in manual and robotic soldering processes while delivering top tier soldering speed and spread. Designed to meet the requirements of manual and robotic soldering processes, Indium Corporation's halide-free CW-818 combines superior soldering speed and spread with improved overall cleanliness (with clear/light-colored residue, charring resistance, and spatter control technology) to deliver a flux-cored wire with enhanced cleanliness, even at higher soldering iron tip temperatures. CW-818 excels in manual and robotic soldering applications where the J-STD-004C high-reliability category is desired or required; or applications where extra wetting power is needed to achieve a higher throughput. 17.08.2022 14:30:00Augnews_2022-09-01_20.jpg\images\news_2022-09-01_20.jpghttps://www.indium.com/corporate/media-center/news/indium-corporation-introduces-new-fast-wetting-no-clean-flux-cored-wire-for-robotic-and-manual-soldering/indium.com
Advanced-industries Distributor Appoints David Nash as Sales DirectorPrinceps has appointed David Nash as Sales Directo...9973PeopleAdvanced-industries Distributor Appoints David Nash as Sales DirectorPrinceps has appointed David Nash as Sales Director. Nash will spearhead the company's sales growth as demand surges across its whole customer base in the aerospace, defence, medical, energy, oil & gas, and transportation sectors. Against continued shortages of electronic, e-mech and electrical components, Princeps specialises in supplying hard-to-source, fully-traceable, guaranteed parts and takes full responsibility for counterfeit mitigation. Nash has a 23-year background in the electronics industry, having worked for two independent distributors in the sector and most recently for franchised distributor Powell, where he successfully drove sales of its EMech commodity ranges throughout the EMEA market. Nash comments: "Princeps' reputation and commitment to growth, aligned with its ethos of unparalleled customer service, were the driving factors behind my decision to join the company. I am looking forward to opening up additional revenue streams by bringing in new manufacturers and forging new distribution agreements which will strengthen and diversify our line card. Our market presence and profile will be heightened over the coming months, principally by capitalizing on our capabilities across all sectors, with a special focus on helping mil aero customers by utilizing our Assure and Assure + service." 17.08.2022 12:00:00Augnews_2022-09-01_8.jpg\images\news_2022-09-01_8.jpghttps://princeps.co.uk/princeps.co.uk
Ribbon Cutting of Product Distribution Center ExpansionDigi-Key Electronics celebrated the ribbon cutting...9971Industry NewsRibbon Cutting of Product Distribution Center ExpansionDigi-Key Electronics celebrated the ribbon cutting of its Product Distribution Center expansion (PDCe), expanding the company's headquarters' footprint by 2.2 million square feet for a combined total of more than 3 million square feet. The facility allows Digi-Key to pick, pack and ship nearly three times the previous daily average of 27,000 packages to customers in more than 180 countries around the world. Digi-Key celebrated the opening event with an official cutting of tape from a Digi-Reel and ceremonial first package handoffs to each of the company's four carrier partners: DHL, FedEx, UPS and USPS. Remarks were given by Digi-Key President Dave Doherty, Minnesota Department of Employment and Economic Development (DEED) Commissioner Steve Grove, Thief River Falls Mayor Brian Holmer and several other Digi-Key executives, as well as video messages from U.S. Senator Amy Klobuchar and Minnesota Governor Tim Walz. "This is a significant milestone for all Digi-Key employees and our community," said Dave Doherty, president of Digi-Key. "Our new product distribution center expansion will help us continue to deliver excellence to our customers for many years to come. As exciting as this expansion is for us, our hope is that our customers truly don't notice a difference – the transition for them should be seamless, and if anything, result in an even better customer service experience than they are already accustomed to. For us, it's deeper roots in Thief River Falls and a commitment to continue investing in this community and the state of Minnesota."17.08.2022 10:00:00Augnews_2022-09-01_6.jpg\images\news_2022-09-01_6.jpghttps://www.digikey.com/en/news/press-releases/2022/august/digi-key-celebrates-ribbon-cutting-of-product-distribution-center-expansiondigikey.com
Inductive Tablet System Solution for CT Scannersetatronix developed the inductive charging solutio...9972Industry NewsInductive Tablet System Solution for CT Scannersetatronix developed the inductive charging solution for the mobile workflow tablet of the Somatom X.cite computer tomography line for Siemens Healthineers. Both the electronics and the required plastic enclosure were developed by etatronix. The input is fed from 24VDC. At the output there is a USB Type-C connection with a variable output voltage (5V-20V) and a power of up to 60W. There is also a 15W version available. The power is transmitted without contact over a distance of up to 12.5mm. The efficiency reaches values ??of up to 92%. Customer-specific interfaces (e.g. CAN) and parallel data transmission are also available. Particularly high demands were placed on the magnetic field limit values. As an example, common systems measure the magnetic field at a defined distance of 20cm. Due to the fact that the user touches the tablet, the magnetic field has been reduced to such an extent that it stays below common limits also at the surface of the tablet-screen. Another requirement for this turnkey task was global module approval, which provides Siemens Healthineers the advantage of a facilitate market introduction when used in several devices. The system complies with radio approvals such as e.g. CE (RED), FCC and ICED to name a few. In this project, etatronix supplies everything from a single source. From development to prototypes, global product approvals, series production and after-sales service.15.08.2022 11:00:00Augnews_2022-09-01_7.jpg\images\news_2022-09-01_7.jpghttps://www.etatronix.de/en/press-release-q3-2022/etatronix.de
Smart Gate Driver Photocoupler for IGBT and MOSFET ControlToshiba Electronics Europe has launched a ±2.5A ou...9984Product ReleaseSmart Gate Driver Photocoupler for IGBT and MOSFET ControlToshiba Electronics Europe has launched a ±2.5A output smart gate driver photocoupler able to control IGBTs and MOSFETs, reliably protecting power devices from over-current. The device is suited to a wide range of applications including inverters, AC servo drives, photovoltaic (PV) inverters and uninterruptible power supplies (UPSs). The TLP5212 features a new totem pole output with two N-channel MOSFETs, to ensure compatibility with specifications widely used in applications such as industrial equipment. In addition, the new photocoupler incorporates protection functions such as desaturation detection, active Miller clamp, UVLO and FAULT output, eliminating the need for several external circuits. This reduces system costs for fault detection and protection as well as saving space and design effort. Moreover, by incorporating Toshiba's own reliable and powerful infrared LED, it can be used in severe thermal environments. The TLP5212 can sink or source up to ±2.5A via its totem pole output. With its propagation delay of just 250ns (max.) and propagation delay skew of ±150ns, the device is suited to use in high-speed applications. The operating temperature range (Ta) is -40°C to +110°C, ensuring suitability for industrial and renewable energy use. Housed in a small SO16L package, the photocoupler measures just 10.3mm x 10.0mm x 2.3mm, allowing it to be used where space is tight. Even with this compact package, it features a minimum creepage distance of 8mm, allowing it to be used for applications requiring high levels of safety isolation and insulation (BVs = 5000Vrms).11.08.2022 13:30:00Augnews_2022-09-01_19.jpg\images\news_2022-09-01_19.jpghttps://toshiba.semicon-storage.com/eu/company/news/2022/08/opto-20220810-1.htmltoshiba.semicon-storage.com
Expansion of Silicon Carbide Production Facility in New Hampshireonsemi celebrated the inauguration of its silicon ...9974Industry NewsExpansion of Silicon Carbide Production Facility in New Hampshireonsemi celebrated the inauguration of its silicon carbide (SiC) facility in Hudson, New Hampshire with a ribbon cutting ceremony. Signifying the importance of this event and manufacturing of semiconductors in the U.S. were the attendance of multiple guests of honor led by U.S. Secretary of Commerce Gina Raimondo. The site will increase the company's SiC boule production capacity by five times year-over-year and almost quadruple the number of its employees in Hudson by the end of 2022. The expansion gives onsemi full control of its silicon carbide manufacturing supply chain, starting with the sourcing of silicon carbide powder and graphite raw material to the delivery of fully packaged SiC devices. This allows onsemi to provide its customers with the assurance of supply required to meet rapidly growing demand for SiC-based solutions. SiC is critical for enabling efficiency in electric vehicles (EVs), EV charging, and energy infrastructure and is an important contributor on the path to decarbonization. The SiC total addressable market is projected to grow from $2B in 2021 to $6.5B in 2026, at a compound annual growth rate of 33%. "In addition to market-leading efficiency of our products, our end-to-end vertically integrated solution in a supply-constrained environment is a compelling and differentiated competitive advantage," said Simon Keeton, executive vice president and general manager Power Solutions Group at onsemi.11.08.2022 13:00:00Augnews_2022-09-01_9.jpg\images\news_2022-09-01_9.jpghttps://investor.onsemi.com/news-releases/news-release-details/onsemi-celebrates-expansion-silicon-carbide-production-facilityonsemi.com
PCIM Asia 2022 to be PostponedThe organisers of PCIM Asia made the decision to d...9948Event NewsPCIM Asia 2022 to be PostponedThe organisers of PCIM Asia made the decision to defer the fair in view of current circumstances regarding the pandemic in Shanghai. Originally scheduled to open from 31 August – 2 September at the Shanghai New International Expo Centre, new dates for the exhibition and conference will be announced in due course. Mr Louis Leung, Deputy General Manager of Guangzhou Guangya Messe Frankfurt Co Ltd, outlined the rationale behind the postponement: "With the evolving situation of the pandemic and the well-being of our exhibitors and participants in mind, we have chosen to postpone PCIM Asia. Our co-organisers and supporters of the fair and conference, as well as our exhibitors are all on-board with this decision. They believe, as do we, that it is better to host the event at a later date in order to give all parties concerned the confidence that it will go ahead with minimal disruption. Finally, I'd like to express our gratitude to all participants for their understanding and support."11.08.2022 06:00:00Augnews_2022-08-15_1.jpg\images\news_2022-08-15_1.jpghttps://pcimasia-expo.cn.messefrankfurt.com/shanghai/en/press/press-releases/2022/PCIM22_postponement.htmlpcimasia-expo.cn
40V-Rated Automotive-Compliant Synchronous Buck ConverterDiodes Incorporated has announced a further additi...9966Product Release40V-Rated Automotive-Compliant Synchronous Buck ConverterDiodes Incorporated has announced a further addition to its family of automotive-compliant DC-DC converters. The DIODESAP64060Q is a 600mA synchronous buck converter device with an input voltage range that covers 4.5V to 40V. It incorporates a 600mO high-side power MOSFET plus a 300mO low-side power MOSFET so that high-efficiency step-down conversion (reaching 90%) can be delivered, and with minimal PCB board space. The AP64060Q is targeted for use in automotive powertrains, infotainment systems, and instrumentation clusters, as well as vehicles' exterior lighting. The AP64060Q has a very low quiescent current (IQ), typically only 90µA, which translates into enhanced light load efficiency. Thanks to the fast switching frequencies this device supports (2MHz), smaller accompanying inductors and capacitors can be selected. Its synchronous rectification eliminates the need for an external Schottky diode, while use of a peak current mode control and built-in loop compensation network further reduces the overall component count. The proprietary gate driver scheme employed in the AP64060Q alleviates switching node ringing without impacting on MOSFET turn-on and turn-off times. This mitigates high frequency radiated electromagnetic interference (EMI) noise caused by MOSFET switching. The AP64060Q has an operating ambient temperature range of -40°C to +125°C. Protection features include overvoltage protection (OVP), undervoltage lockout (UVLO), and thermal shutdown. This device is supplied in a compact TSOT26 package.10.08.2022 15:30:00Augnews_2022-08-15_19.jpg\images\news_2022-08-15_19.jpghttps://www.diodes.com/about/news/press-releases/40v-rated-automotive-compliant-synchronous-buck-converter-from-diodes-incorporated-supports-high-efficiency-operation-and-reduces-emi/diodes.com
Integrated Drive Modules for Hyundai Motor CompanyBorgWarner's integrated drive module (iDM) has bee...9975Industry NewsIntegrated Drive Modules for Hyundai Motor CompanyBorgWarner's integrated drive module (iDM) has been selected by Hyundai Motor Company (HMC) to power an additional A-Segment electric vehicle platform, scheduled to start production in the third quarter of 2024. This business was awarded based on BorgWarner's advanced iDM technology, its prior iDM win with HMC on another A-segment electric vehicle, and the longstanding relationship between the two companies. "Our partnership with the Hyundai Motor Company spans two decades, and we're delighted to continue our relationship by supplying our latest technology for the company's newest electrification project," said Dr. Stefan Demmerle, President and General Manager, BorgWarner PowerDrive Systems. "Our iDM proved an ideal fit for the customers' electric propulsion system during our first EV collaboration, and we look forward to contributing industry-leading electrification solutions to assist the company in meeting its future sustainability goals."  BorgWarner's iDM146 is comprised of an interior permanent magnet (IPM) electric motor of 146mm stator outer diameter equipped with high voltage hairpin (HVH) technology for high power density and efficiency as well as a BorgWarner inverter with a Viper power module, both integrated with a quiet and efficient reduction gearset. Designed for 400V systems, the unit typically produces a peak power output of 135kW, although its modular design allows power and torque output to be scaled specifically to customer requirements.10.08.2022 14:00:00Augnews_2022-09-01_10.jpg\images\news_2022-09-01_10.jpghttps://www.borgwarner.com/newsroom/press-releases/2022/08/10/borgwarner-secures-second-integrated-drive-module-award-with-hyundai-motor-companyborgwarner.com
35 A GaN Stage IC Boosts Power Density and Simplifies DesignEPC announces the introduction of a 100 V, 35 A in...9957Product Release35 A GaN Stage IC Boosts Power Density and Simplifies DesignEPC announces the introduction of a 100 V, 35 A integrated circuit designed for 48 V DC-DC conversion used in high-density computing applications and in 48 V BLDC motor drives for e-mobility, robotics, and drones. The EPC23102 eGaN IC is capable of a maximum withstand voltage of 100 V, delivering up to 35 A load current, while capable of switching speeds greater than 1 MHz. Key features of the EPC23102 integrated circuit using EPC's proprietary GaN IC technology include integrated input logic interface, level shifting, bootstrap charging and gate drive buffer circuits controlling 6.6 mOhm RDS(on) high side and low side FETs configured as a half-bridge power stage. The EPC23102 features a thermally enhanced QFN package with a footprint of just 3.5 mm x 5 mm, offering an extremely small solution size for the highest power density applications. When operated in a 48 V to 12 V buck converter, the EPC23102 delivers greater than 96% peak efficiency at 1 MHz switching frequency and around 8 – 17 A of continuous load current with a rated current of 35 A. "The ePower family of products makes it easy for designers to take advantage of the significant performance improvements made possible with GaN technology," said Alex Lidow, CEO and co-founder of EPC." Integrated devices are easier to design, easier to layout, easier to assemble, save space on the PCB, and increase efficiency. Designers can use these devices to make lighter weight and more precise BLDC motor drives, higher efficiency 48 V input DC-DC converters, higher fidelity class-d audio systems, and other industrial and consumer applications."10.08.2022 06:30:00Augnews_2022-08-15_10.jpg\images\news_2022-08-15_10.jpghttps://epc-co.com/epc/EventsandNews/News/ArtMID/1627/ArticleID/3067/35-A-GaN-ePower-Stage-IC-Boosts-Power-Density-and-Simplifies-Design.aspxepc-co.com
CHIPS and Science Act Will Lower Costs, Create Jobs, and Strengthen Supply ChainsUS-President Biden signed into law the bipartisan ...9956Industry NewsCHIPS and Science Act Will Lower Costs, Create Jobs, and Strengthen Supply ChainsUS-President Biden signed into law the bipartisan CHIPS and Science Act of 2022, making historic investments that will poise U.S. workers, communities, and businesses to win the race for the 21st century. It will strengthen American manufacturing, supply chains, and national security, and invest in research and development, science and technology, and the workforce of the future, including nanotechnology, clean energy, quantum computing, and artificial intelligence. Spurred by the passage of the CHIPS and Science Act of 2022, companies have announced nearly $50 billion in additional investments in American semiconductor manufacturing. The CHIPS and Science Act aims to boost American semiconductor research, development, and production, ensuring U.S. leadership in the technology that forms the foundation of everything from automobiles to household appliances to defense systems. The law will also ensure the United States maintains and advances its scientific and technological edge. In the mid-1960s, at the peak of the race to the moon, the federal government invested 2 percent of GDP in research and development. By 2020, that number had fallen to less than 1 percent. Economic growth and prosperity over the last 40 years has clustered in a few regions on the coasts, leaving far too many communities behind. The CHIPS and Science Act will ensure the future is made in all of America, and unlock opportunities in science and technology for those who have been historically left out.09.08.2022 14:00:00Augnews_2022-08-15_9.jpg\images\news_2022-08-15_9.jpghttps://www.whitehouse.gov/briefing-room/statements-releases/2022/08/09/fact-sheet-chips-and-science-act-will-lower-costs-create-jobs-strengthen-supply-chains-and-counter-china/whitehouse.gov
GaN ICs Save First 100,000 Tons of CO2 EmissionsNavitas Semiconductor has announced the first savi...9954Industry NewsGaN ICs Save First 100,000 Tons of CO2 EmissionsNavitas Semiconductor has announced the first saving of 100,000 tons of CO2 emissions as GaN replaces legacy silicon chips to "Electrify Our World". GaN uses up to 10x-lower CO2 footprint to manufacture and ship compared to silicon, while reducing the end-application CO2 footprint up to 30%. Each GaN power IC shipped saves net 4 kg CO2 in comparison, and GaN offers the potential to address a reduction of 2.6 Gtons CO2/yr by 2050 – equivalent to the CO2 generated by over 650 coal-fired power stations, over six billion barrels of oil, over 560 million ICE passenger cars – or the annual electricity use of over 470 million homes. 100,000 tons is a conservative estimate of cumulative customer savings in CO2 emissions, based on Navitas' unit shipments, and third-party life-cycle assessment (LCA) of a 65W USB-C charger example. This also considers a six-month delay, accounting for shipping inventory and customer assembly. Navitas completed a comprehensive analysis working together with EarthShift Global and completed an ISO14040/14044-compliant comparative LCA report quantifying the benefits of Si power semiconductor components vs GaN power ICs and USB-C chargers using GaN power IC products. "The analysis shows that GaN power ICs provide a step-function improvement in environmental impacts over the incumbent Si solutions. As Navitas converts the world from Si to GaN over the next 5-10 years, the sustainability benefits will become significant in achieving global customer and nation net-zero goals", states Anthony Schiro, VP Quality and Sustainability at Navitas. 04.08.2022 12:00:00Augnews_2022-08-15_7.jpg\images\news_2022-08-15_7.jpghttps://navitassemi.com/navitas-gan-ics-save-first-100000-tons-of-co2-emissions/navitassemi.com
Demonstration Platform Accelerates the Design of Economical Micro-power ManagementTrameto announces a demonstration platform that en...9962Product ReleaseDemonstration Platform Accelerates the Design of Economical Micro-power ManagementTrameto announces a demonstration platform that enables engineers to quickly evaluate how micro-energy harvesting can reduce or eliminate the use of batteries in IoT devices such as sensors and the wireless modules to which they may be connected. It is based on Trameto's OptiJoule technology and uses an engineering sample of the TM2040, a four-input, smart EH PMIC from the product family. Up to four harvesters of the same or mixed types can be connected to any of its inputs without additional interface components, providing the simplest, most effective, and most economical way to cut battery dependency in wireless IoT applications. The demonstration platform includes two photovoltaic harvesters, a piezoelectric harvester with a DC motor to generate vibration for it, two thermoelectric generators, and a heater and heatsinks to provide a stimulus for the thermoelectric generators. Each harvester produces microjoules to millijoules of energy and easily connects to the main platform using plugin daughterboards. Uniquely, each of the TM2040's inputs will adapt autonomously to the type of harvester connected to it. The chip then optimizes each harvester's output using patented circuits that also dynamically combine the maximum available energy from all the connected harvesters. The optimized output delivers a controlled charge to an energy-storage component which is then automatically switched via the EH PMIC to power an IoT device with a 1.8V DC, regulated supply at up to 15mA.04.08.2022 11:30:00Augnews_2022-08-15_15.jpg\images\news_2022-08-15_15.jpghttps://trameto.com/resources/trameto.com
500W DC/DCs for E-Mobility ApplicationsRECOM Power announces the release of a range of DC...9959Product Release500W DC/DCs for E-Mobility ApplicationsRECOM Power announces the release of a range of DC/DC converters for E-mobility applications. With the push for zero-emission transport, electric propulsion is the ideal solution for off-highway vehicles and they invariably require DC/DC converters to generate isolated auxiliary power rails from the traction battery. The compact and cost-effective RMOD500-W range introduced is perfect for the application as the products are IP67-rated, fully sealed against moisture and dust including connectors and can therefore be fitted in any unprotected area of the vehicle. The RMOD500-W is rated at 500W with an input range covering 32-96V for nominal 48V, 60V, 72V and 80V batteries. Outputs available are: 13.7V, 13V, 12.4V, 11.7V, 24.5V and 23.5V and parallel operation is possible for higher power applications. Certified isolation is provided, at 2.25kVDC and ambient operating temperature range is from -40°C to 90°C. The RMOD500-W is designed for easy plug-and-play chassis-mounting installation with standard connectors and is sized 198 x 113 x 45mm including connectors. Protection features make the parts rugged in the application and include input reverse polarity and under-voltage, over-temperature, output over-current/short circuit and output over-voltage. The range has been qualified to standards for EMC, radiation, shock/vibration, thermal shock/temperature cycling, salt mist, water/dust ingress and safety.03.08.2022 08:30:00Augnews_2022-08-15_12.jpg\images\news_2022-08-15_12.jpghttps://recom-power.com/en/company/newsroom/news/rec-n-500w-dc!sdcs-for-e-mobility-applications-217.html?3recom-power.com
Awarded '2021 Best Performing Distributor in EMEA'EBV Elektronik has been recognised by STMicroelect...9955Industry NewsAwarded '2021 Best Performing Distributor in EMEA'EBV Elektronik has been recognised by STMicroelectronics as the "2021 Best Performing Distributor in EMEA". Since 2017, EBV has been consistently awarded ST's leading demand creation distributor in EMEA and in 2021 also took over the top spot for POS, resulting in the accolade for Best Performing Distributor in EMEA. "This is a very nice success story for both companies," said Frank Wolinski, VP Channel Sales EMEA at ST. "I am absolutely convinced that the trusted cooperation between our companies is the biggest differentiator and the main reason for this success. Thanks to the entire EBV team for their continuous efforts and especially for their never-ending willingness to win and grow with ST." "We are immensely proud to not only have held the leading position as ST's demand creation distributor for four years running but also to take this position in POS as well," said Thomas Staudinger, President at EBV Elektronik. "It is a clear demonstration of our reputation, technical ability, and collaborative approach that has led to us being awarded the 2021 Best Performing Distributor in EMEA. We are confident to continue this successful relationship in the upcoming years." EBV is a franchised distribution partner of ST, a semiconductor specialist serving customers across the spectrum of electronics applications, since 2006.01.08.2022 13:00:00Augnews_2022-08-15_8.jpg\images\news_2022-08-15_8.jpghttps://www.avnet.com/wps/portal/ebv/about-us/about-ebv-elektronik/newsroom/press-releases/!ut/p/z1/jY_NDoIwEAafhSfoFgThuJSG8lNDpSD2YjiZJooejM-vQY5a2dsmM18yxJCBmGl82vP4sLdpvLz_o4lOAlhEMYYdtJICplIxzTMNGyCHGciTsKCMgYx15YOqNBW8SAO93xKzxv8O1LJd6cOPQ_jvGweS9QldAFeiY-HTMAM1Jlwg-HWuFAcMZCjKpirjJloAR8X92nUD2MKi570AGk8IQQ!!/dz/d5/L2dBISEvZ0FBIS9nQSEh/avnet.com
Preamplifier 10 MHz up to 22 GHzThe PA 2522 preamplifier from Langer EMV-Technik p...9964Product ReleasePreamplifier 10 MHz up to 22 GHzThe PA 2522 preamplifier from Langer EMV-Technik provides meaningful measurement results, even with low input signals. Obtaining informative results from an EMC measurement often fails because the measurement levels are too low or because the measurement tools used are not sensitive enough. Support is now offered by the PA 2522 preamplifier with its amplification of 25 dB. The PA 2522 amplifies low measurement signals over an extremely wide frequency range from 10 MHz to 22 GHz - with very low noise and a constantly high dynamic range. This means that sources of interference with very low levels can now be clearly detected on measuring equipment. The signal amplifier, which is handcrafted in Germany, is a consistent further development for EMC applications. In combination with a matching near-field probe, e.g. from Langer EMV-Technik, it is possible to perform harmonic measurements of high-frequency signals up to 22 GHz. With its compact design, the PA 2522 can be integrated into development environments in a versatile way. Directly connected to the 50 O input of a spectrum analyzer or oscilloscope the preamplifier simultaneously protects sensitive measuring equipment from overvoltage. The PA 2522 is powered by the supplied plug-in power supply.27.07.2022 13:30:00Julnews_2022-08-15_17.jpg\images\news_2022-08-15_17.jpghttps://www.langer-emv.de/en/product/vorverstaerker/37/pa-2522-set-vorverstaerker-10-mhz-bis-22-ghz/1367langer-emv.de
Innovation Award for Jetting, Microdispensing PasteIndium Corporation earned Electronics Manufacturin...9952Industry NewsInnovation Award for Jetting, Microdispensing PasteIndium Corporation earned Electronics Manufacturing (EM) World's Innovation Award for Indium12.8HF, a versatile solder paste engineered to deliver exceptional jetting and microdispensing performance on a variety of systems. The EM Innovation Award program recognizes and celebrates excellence in the electronics industry, encouraging companies to achieve the highest standards and push the industry forward. "We are honored to have Indium12.8HF recognized by EM World," said Evan Griffith, product specialist. "As miniaturization continues its spread throughout all corners of the industry, more applications must adapt to finer pitches and smaller packages with paste deposits which may be unachievable by stencil printing. It's critical to Indium Corporation that we produce innovative, proven products that provide solutions to the current and emerging challenges."27.07.2022 10:00:00Julnews_2022-08-15_5.jpg\images\news_2022-08-15_5.jpghttps://www.indium.com/corporate/media-center/news/indium-corporation-receives-em-worlds-innovation-award-for-jetting-microdispensing-paste/indium.com
Current Transducer for High Frequency ApplicationsDanisense is introducing its DW series of closed-l...9946Product ReleaseCurrent Transducer for High Frequency ApplicationsDanisense is introducing its DW series of closed-loop compensated zero-flux current transducer measuring up to 500A and offering excellent accuracy with 10ppm linearity and low offset at 15 ppm. To meet the increased requirements in terms of high frequency coming from the latest power conversion products based on wide bandgap semiconductor technologies such as gallium nitride (GaN) and silicon carbide (SiC), Danisense has revised its winding processes and now achieves an exceptionally wide bandwidth of up to 10MHz with its latest DW500UB-2V product. DW series devices benefit from a full aluminium body for superior EMI shielding and a wide operating temperature range from -45°C up to +40°C. A very high power measurement accuracy, low noise and an industry standard BNC connection are further features. The main target application is power measurement in laboratories for the design optimization of power converters – typically for e-mobility applications. DW series current transducers can also be used for power measurement and power analysis for stable power supplies, MPS for particles accelerators, gradient amplifiers for MRI devices, precision drives, battery testing and evaluation systems and current calibration purposes.26.07.2022 18:30:00Julnews_2022-08-01_25.jpg\images\news_2022-08-01_25.jpghttps://danisense.com/news/new-current-transducer-from-danisense-offers-extra-large-bandwidth-for-high-frequency-applications-strong/danisense.com
SiC Devices Support Bi-directional Inverter to Let EV's Become Backup PowerCoolSiC products from Infineon Technologies are ad...9942Product ReleaseSiC Devices Support Bi-directional Inverter to Let EV's Become Backup PowerCoolSiC products from Infineon Technologies are adopted by Delta Electronics to allow for a big step towards energy transition and carbon neutrality with green power. With the successful development of bi-directional inverters, a hybrid three-in-one system that integrates solar, energy storage and charging of electric vehicles (EV), Delta is enabling EVs to become an household emergency backup power. The bi-directional inverter can be used to supply power to charge electric vehicles (EVs) and home batteries, while acting as a backup power for unexpected outages and a green energy control core. Products from Infineon include the 1200 V M1H CoolSiC EasyPACK 1B modules and 1200 V CoolSiC D²PAK 7-pin, a surface mount device. The integration of three applications is also a milestone. This three-in-one system was realized in a compact package of just 425 x 865 x 160 mm 3. With an output power of about 10 kW, the system allows a maximum continuous current of 34 A and achieves peak efficiencies of more than 97.5 percent. One of the essential elements for creating the three-in-one system includes the1200 V M1H CoolSiC EasyPACK 1B module with integrated NTC temperature sensor and PressFIT contact technology. The module offers maximum flexibility and high-current density. With package technology combined with CoolSiC MOSFETs, the module features a low-inductive design with minimal switching and conduction losses. Furthermore, high-switching frequency operation is enabled on the customer side, which allows for smaller system designs.26.07.2022 14:30:00Julnews_2022-08-01_21.jpg\images\news_2022-08-01_21.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2022/INFIPC202207-104.htmlinfineon.com
Wafer-level MOSFETs Save Power and Simplify Thermal ManagementNexperia has introduced the PMCB60XN and PMCB60XNE...9961Product ReleaseWafer-level MOSFETs Save Power and Simplify Thermal ManagementNexperia has introduced the PMCB60XN and PMCB60XNE 30V N-channel small-signal trench MOSFETs in the ultra-compact wafer-level DSN1006 package, to make energy go further where space is tight and battery runtime is critical. Ideal for highly miniaturized electronics like smartphones, smart watches, hearing aids, and earphones, the MOSFETs support the trend towards greater intelligence and richer functionality that raise system power demand. With RDS(on) up to 25% better than competing devices, they minimize energy losses and increase efficiency in load switching and battery management. Their performance also reduces self heating thereby enhancing user comfort in wearable devices. Specifically, the PMCB60XN and PMCB60XNE have maximum RDS(on) of 50mO and 55mO respectively, at VGS = 4.5V. This gives them the lowest on-resistance per die area among similar 30V MOSFETs in the market. In addition, the PMCB60XNE comes with ESD protection rated to 2kV (human body model – HBM) integrated in the tiny 1.0mm × 0.6mm × 0.2mm DSN1006 outline. Both MOSFETs are rated for drain current up to 4A. In addition to these two MOSFETs in DSN1006, Nexperia has also introduced the PMCA14UN, a 12V, N-channel trench MOSFET in a DSN1010 package. With max RDS(on) of 16mO at VGS = 4.5 V, the PMCA14UN delivers efficiency in the 0.96mm × 0.96mm × 0.24mm (SOT8007) outline.26.07.2022 10:30:00Julnews_2022-08-15_14.jpg\images\news_2022-08-15_14.jpghttps://www.nexperia.com/about/news-events/press-releases/Nexperia-reveals-wafer-level-12---30V-MOSFETs-with-market-leading-efficiency.htmlnexperia.com
750V SiC FET Portfolio for Power DesignsQorvo announced seven 750V silicon carbide (SiC) F...9936Product Release750V SiC FET Portfolio for Power DesignsQorvo announced seven 750V silicon carbide (SiC) FETs in the surface mount D2PAK-7L package. With this package option, Qorvo's SiC FETs are tailored for the rapidly growing applications of onboard chargers, soft-switched DC/DC converters, battery charging (fast DC and industrial) and IT/server power supplies. They deliver an optimal solution for high-power applications that require maximum efficiency, low conduction losses and excellent cost effectiveness in a thermally enhanced package. Highlighted by an RDS(on) of 9 milliohms (mohms) at 650/750V, the Gen 4 UJ4C/SC series is rated at 9, 11, 18, 23, 33, 44 and 60 mohms. This wide selection provides engineers with more device options, enabling greater flexibility to achieve an optimum cost/efficiency balance while maintaining generous design margins and circuit robustness. Leveraging a unique cascode SiC FET technology in which a normally-on SiC JFET is co-packaged with a Si MOSFET to produce a normally-off SiC FET, these devices deliver a best-in-class RDS x A figure of merit, resulting in the lowest conduction losses in a small die. Anup Bhalla, chief engineer at UnitedSiC (now Qorvo), said, "The D2PAK-7L package reduces inductance from compact internal connection loops which - along with the included Kelvin source connection - results in low switching loss, enabling higher frequency operation and improved system power density. These devices also feature silver-sinter die attach, resulting in very low thermal resistance for maximum heat extraction on standard PCBs as well as IMS substrates with liquid cooling."26.07.2022 08:30:00Julnews_2022-08-01_15.jpg\images\news_2022-08-01_15.jpghttps://unitedsic.com/news/unitedsic-now-qorvo-extends-highest-performance-most-efficient-750v-sic-fet-portfolio-for-power-designs/unitedsic.com
Mode Choke Solution with Nanocrystalline Metal CoreKEMET announces its SCF-XV series of AEC-Q200 qual...9934Product ReleaseMode Choke Solution with Nanocrystalline Metal CoreKEMET announces its SCF-XV series of AEC-Q200 qualified common mode chokes. This series fulfills the growing need for high voltage automotive and harsh environment industrial EMI filtering applications. The SCF-XV series offers up to 1,000 V AC/DC, the highest rated voltage. The nanocrystalline metal core results in a reduced footprint, rated current range from 5 to 35 A, DCR from 0.65 to 40.3 mO, an operating temperature from -40°C to +150°C, two different layouts (vertical/horizontal), and three different outer core diameters (19/25/29 mm). The toroidal coils are designed with nanocrystalline metal cores and are useful in various noise countermeasure fields. These features position SCF-XV as an exceptional EMI suppression solution. This series addresses design engineers' needs with a wide variety of characteristics for automotive and harsh environment industrial applications (robotics, high voltage power supplies, high reliability) and completes KEMET's already existing automotive-grade common mode chokes portfolio including SCR-XV and SCT-XV. Many solutions comparable to the SCF-XV use ferrite coils, are not always AEC-Q200 qualified, have a maximum 750 V AC/DC, and have a larger footprint. With a rated 1,000 V AC/DC and AEC-Q200 qualified, this series, together with SCR-XV and SCT-XV, is ideal for use in the EV automotive market. This series supports the industry's trend to increase the vehicle-installed Lithium-ion battery pack voltage to limit drive train currents. With its space-saving and high characteristics, this series also addresses the trend of miniaturization and operation in harsh environmental conditions. Applications include onboard chargers for EV/PHEV, E-compressors, wireless charging systems with 85 kHz, medium power drives for power steering, air conditioning, and mild hybrid 48 V systems.26.07.2022 06:30:00Julnews_2022-08-01_13.png\images\news_2022-08-01_13.pnghttps://www.kemet.com/en/us/new-products/gtx-metal-box-three-phase-filter.htmlkemet.com
Hybrid Flyback Controller Combined with GaN IPS in Charger DesignsInfineon Technologies combines the hybrid flyback ...9963Product ReleaseHybrid Flyback Controller Combined with GaN IPS in Charger DesignsInfineon Technologies combines the hybrid flyback (HFB) controller XDP digital power controller XDPS2201 and the CoolGaN integrated power stage (IPS) 600 V (IGI60F1414A1L) for high-efficiency and high-power density charger and adapter designs. Anker has chosen Infineon's HFB controller and the CoolGaN IPS for fast chargers above 100 W. "By combining Infineon's hybrid flyback controller with an integrated CoolGaN device in Anker's new charging lineup, we achieved an outstanding system-level efficiency beyond 95 percent," said Adam White, Division President of Infineon's Power and Sensor Systems Division. "This architecture reduces energy loss by 21 percent compared to other charging solutions. It is the first time that Infineon's HFB controller and CoolGaN IPS devices are combined and applied commercially in the consumer electronics market." "GaN has completely changed the way we charge our electronics by delivering superior power transfer efficiency, faster-charging speeds and improved portability to our chargers," said Steven Yang, CEO of Anker Innovations.25.07.2022 12:30:00Julnews_2022-08-15_16.jpg\images\news_2022-08-15_16.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2022/INFPSS202207-102.htmlinfineon.com
Portfolio of Trans-Inductor Voltage RegulatorsITG Electronics has introduced a line of Trans-ind...9939Product ReleasePortfolio of Trans-Inductor Voltage RegulatorsITG Electronics has introduced a line of Trans-inductor Voltage Regulators (TLVRs). The solutions include the company's AHA series of TLVT coupling inductors, as well as its L10142 Series and SLA2843B series compensation inductor in the LC circuit of TLVR application. ITG Electronics' AHA series of coupling inductors offers a broad range of options. For example, the AHA3740A is a ferrite-based TLVR inductor with low core loss and an inductance range of 70-150nH, with customized values possible. The product offers high current output chokes up to 125 amperes with approximately 20% roll off. The compact component has a maximum height of just 10mm, and measures only 9.6 x 6.4mm. Narrowed body version TLVR inductor such as AHA40475A and AHA47475A Series are developed for future 4x6mm powerstages application. ITG Electronics' selection of compensated inductor for TLVR is equally diverse. For instance, the SLA2843B is a ferrite-based SMD inductor with low core loss ideal for LC power rails in TLVR circuit designs. The component's inductance range is 60nH-420nH, with customization possible. Offering high current output chokes up to 165 amperes with approximately 20% roll off, the SLA2843B has a maximum height of 11mm and measures just 7 x 6.7mm foot print. With more data centers employing powerful application-specific integrated circuits (ASICs) that consume significant amounts of rapidly fluctuating current, conventional multi-phase voltage regulators may approach their performance limits. To overcome this challenge, TLVRs employ phases with output inductors amounting to the secondary winding of a transformer, whose primary windings are connected in a series loop.25.07.2022 11:30:00Julnews_2022-08-01_18.jpg\images\news_2022-08-01_18.jpghttps://itg-electronics.com/results?keyword=TLVR&search_type=partitg-electronics.com
Charge Pump Direct Charger IC Powers SmartphonesHalo Microelectronics announced that its HL7132, a...9945Product ReleaseCharge Pump Direct Charger IC Powers SmartphonesHalo Microelectronics announced that its HL7132, a 2:1 Charge Pump Direct Charger IC is used on Samsung's Galaxy A23 smartphones. The HL7132 is a low-voltage 2:1 fast direct charger IC for 1-cell Li-ion and Li-polymer batteries that enable the charge current to be doubled by doubling the input current from a power delivery (PD) adapter. For example, the 3A output PD adapter can charge the current up to 6A, thereby, reducing the battery charge time by 50% and offering less waiting time for A23 smartphone users. The switched capacitor converter architecture and the integrated FETs in the HL7132 are optimized to enable a 50% duty cycle operation under charge pump mode. The 2:1 charge pump mode allows the output voltage, VOUT to be around half of the input voltage, VIN, and the output current to double the input current, reducing the losses over the input power cable as well as limiting the temperature rise in the application. According to Insight Analytical Labs' teardown of the Galaxy A23 smartphone, they discovered Halo Microelectronics' WQN10 (HL7132) switched capacitor direct charger on the main board. It also showed the Qualcomm SM6225 Snapdragon 680 4G 8-core processor is used on the smartphone.21.07.2022 17:30:00Julnews_2022-08-01_24.jpg\images\news_2022-08-01_24.jpghttps://halomicro.com/halo-microelectronics-21-charge-pump-direct-charger-ic-powers-samsungs-galaxy-a23-smartphones/halomicro.com
Power Transformer with Updated WindingPulse is expanding its EFD15 portfolio, known for ...9940Product ReleasePower Transformer with Updated WindingPulse is expanding its EFD15 portfolio, known for its versatility in DC/DC converter applications, with the PGT646xNL series. The series uses the current first-in-class 5 + 5 pin SMD platform design. The innovative coil design extends the creepage distance between pin and core to at least 5.1 mm. At the same time, the component retains its dimensions of 22.0 mm x 16.5 mm x 11 mm and does not require more space. Wire selection and design allow for automated winding that provides exceptional reliability for high-performance applications like in industrial and automotive environments, as well as data communications.21.07.2022 12:30:00Julnews_2022-08-01_19.jpg\images\news_2022-08-01_19.jpghttps://www.rutronik24.com/search-result/qs:pgt6/reset:0rutronik24.com
Single-output Power Supply with Dual Certification for Medical and Industrial ApplicationsAdvanced Energy Industries expanded its SL Power S...9960Product ReleaseSingle-output Power Supply with Dual Certification for Medical and Industrial ApplicationsAdvanced Energy Industries expanded its SL Power SLB series with a 300 W power supply. Designed for ease of integration into critical medical and industrial equipment, the SLB300 offers stable power through power fluctuations and features long operational life by integrating high-quality electrolytic capacitors. The SLB300 is a single-output power supply offering a 300 W (200 W convection cooled) output power in a compact 3" x 5" x 1.4" package that fits 1U rack mount applications. It features an 80-264 VAC universal input and a wide -10°C to +70°C operating temperature range. Output voltage is available from 12 – 48 V. Dual certified for the latest medical and industrial standards, the SLB300 is certified to EN/CSA/IEC/UL62368-1 and EN/CSA/IEC/UL60601-1-1 3rd Edition, as well as IECIEC60601-1 Type BF. The model comes with a three-year warranty. "The SLB300 is a versatile power supply that can be used to provide reliable, long-term operation in a wide variety of critical end systems," said Paul Kingsepp, Medical Product Line Manager at Advanced Energy. "We continue to expand our range of high performance, cost-effective power supplies including the SLB series. Our customers benefit from its dual certification, which eases adoption into their medical and industrial applications."21.07.2022 09:30:00Julnews_2022-08-15_13.jpg\images\news_2022-08-15_13.jpghttps://slpower.com/product-detail?IdProduct=397slpower.com
2 Watt High Isolation DC/DC ConverterThe TRV 2M is a series of 2 Watt DC/DC converters ...9979Product Release2 Watt High Isolation DC/DC ConverterThe TRV 2M is a series of 2 Watt DC/DC converters in a compact SIP-9 package with reinforced isolation of 5000 VAC for medical and industrial applications. The series offers a 1.5:1 input voltage range with a nominal input ranging between 5 and 24 VDC. With a continuous short circuit protection and a low leakage current of less than 2µA, this converter series is especially suited to protect any connected interfaces or applied parts to patients. Featuring almost fully regulated outputs this series provides a great level of regulation without affecting the cost efficiency. It is an ideal solution for applications where an unregulated DC/DC converter would not meet you regulation requirements but cost still is a critical factor. Together with an operating temperature range from -40 to +80C° without derating and certifications according to IEC/EN/ES 60601-1 3rd ed. for 2xMOPP and IEC/EN/UL 62368-1 this series is suitable for many different applications where a medical isolation system and short circuit protection is needed.20.07.2022 08:30:00Julnews_2022-09-01_14.jpg\images\news_2022-09-01_14.jpghttps://www.tracopower.com/de/trv-2m-series-new-2-watt-low-power-medicalindustrial-dcdc-convertertracopower.com
Supercapacitors - The Rapid Energy BoostWürth Elektronik introduces an EDLC supercapacitor...9958Product ReleaseSupercapacitors - The Rapid Energy BoostWürth Elektronik introduces an EDLC supercapacitors (Electrical Double Layer Capacitor) with snap-in terminals. WCAP-SISC – available with capacitance values of 100 F and 350 F – is a solution for applications with high power and high energy requirements such as UPS or energy storage solutions. They can be used in smart metering devices, network components or energy harvesting applications to name but a few. WCAP-SISC attains a rated current of up to 75 A. The far higher energy density compared with conventional capacitors has made double-layer capacitors such as WCAP-SISC an environmentally friendly alternative to batteries. Compared to Li-ion batteries, the Supercapacitor with activated carbon technology offers numerous benefits: fast charging, very long service life with 500,000 cycles, and lower fire hazard. The capacitance tolerance is 10 / +30 percent, the rated voltage is 2.7 V. WCAP-SISC can be used at an operating temperature of -40°C to +65°C. The 100 F and 350 F Supercapacitors are now available from stock without a minimum order quantity, and free samples can be ordered online or through a sales representative.20.07.2022 07:30:00Julnews_2022-08-15_11.jpg\images\news_2022-08-15_11.jpghttps://www.we-online.com/web/en/wuerth_elektronik/news_weg/News_Detail_WE_Gruppe_136254.phpwe-online.com
GaN-on-Si Device Maker Partners with German Power Electronics Innovation HubInnoscience Technology has signed a distribution a...9930Industry NewsGaN-on-Si Device Maker Partners with German Power Electronics Innovation HubInnoscience Technology has signed a distribution agreement with Finepower, focused on power electronic applications with operations in Germany and China. The agreement covers Europe, China and worldwide for specified customers. Dr Denis Marcon, General Manager, Innoscience Europe comments: "Finepower brands itself as the 'Innovation Hub' for power semiconductors and offers both engineering and distribution services. Therefore we are sure that they will be an excellent partner for Innoscience, both in educating the market about the leading performance and reliability offered by our InnoGaN solutions and in ensuring a secure supply chain for customers." Adds Reiko Winkler, General Manager of Finepower: "Finepower is already very experienced in working on customers' applications using GaN. And we are excited to extend our portfolio with High Voltage GaN devices by adding Innoscience – the world's largest 8-inch GaN-on-Si device manufacturer – to our line-up. With a capacity of 10,000 8-inch wafers per month (WPM), which will grow to 70,000 WPM by 2025, Innoscience is ensuring that the world can begin designing with GaN now, with no delay. That is hugely empowering for all markets."19.07.2022 16:00:00Julnews_2022-08-01_9.jpg\images\news_2022-08-01_9.jpghttps://www.innoscience.com/site/aboutus?el=a5innoscience.com
Half-brick DC-DC Converters Feature a 12:1 Ultra-wide Input RangeTDK Corporation announces the introduction of the ...9943Product ReleaseHalf-brick DC-DC Converters Feature a 12:1 Ultra-wide Input RangeTDK Corporation announces the introduction of the 200W TDK-Lambda brand PYH200 series of DC-DC converters. Featuring a 12:1 ultra-wide input range of 14 to 160Vdc, these board mount products are packaged in the industry-standard half-brick format measuring 61.0 x 57.9 x 12.7mm (L x W x H). The housing is silicon potted to provide a high level of resistance to shock and vibration. This is beneficial for applications compliant to EN 50155, the standard for electronic equipment used on railway rolling stock. The PYH200 is available with 12V, 15V, 24V and 48V nominal outputs, adjustable over a -20% to +15% range for non-standard voltages. All models have overcurrent, output-overvoltage and overtemperature protection. Standard functions include remote sense, remote on/off, frequency synchronisation to an external clock, and the ability to extend the hold-up time by connecting an electrolytic capacitor to the BUS terminal. The power modules have efficiencies of up to 90% and can operate with a base plate temperature of -40 to +100°C. Optional heatsinks facilitate convection cooling, forced air cooling or the modules can be conduction-cooled. Input to output and input to baseplate isolation is 3,000Vac with an output to baseplate isolation of 500Vac. Certification is to the IEC/UL/CSA/EN 62368-1 safety standards with the CE and UKCA marks for the Low Voltage and RoHS Directives. The PYH200 in combination with a typical test setup has been tested to meet the EN 50155, EN 45545-2, EN 61373 and EN 50121-3-2 railway standards.19.07.2022 15:30:00Julnews_2022-08-01_22.jpg\images\news_2022-08-01_22.jpghttps://www.emea.lambda.tdk.com/uk/news/article/18650lambda.tdk.com
220 M EUR Invest to Build Supercapacitor FactorySkeleton Technologies and Siemens are announcing a...9925Industry News220 M EUR Invest to Build Supercapacitor FactorySkeleton Technologies and Siemens are announcing a far-reaching technology partnership for the development, planning and implementation of a fully automated, digitalized manufacturing plant to produce supercapacitors in Germany. The production line is to be used in a new Skeleton factory in Markranstädt, Leipzig – Skeleton's second manufacturing site in Saxony. The economies of scale provided using Siemens' cutting-edge technology, combined with the use of Skeleton's patented "curved graphene" material, are expected to lower the production costs by almost 90% after the completion of this 5 years project. The collaboration aims to achieve the digitization of Skeleton's entire value chain – from supercapacitor cell design to production and services – and scale up the production of next-generation supercapacitors. Siemens supports this with its comprehensive Digital Enterprise portfolio as well as domain know-how in industrial battery cell production. Furthermore, it is planned to further expand the business relations between the two companies. Skeleton's supercapacitors are used in transport, grid, industrial, and automotive applications and allow to reduce CO2 emissions and save energy. With the use of patented "curved graphene" material, Skeleton's supercapacitors offer the highest power and energy density on the market, almost instant charging and discharging, high reliability, and very long lifetimes. They contribute to improving power quality and protecting equipment and infrastructure by lowering the power fluctuation, and to powering electrification.19.07.2022 11:00:00Julnews_2022-08-01_4.jpg\images\news_2022-08-01_4.jpghttps://www.skeletontech.com/news/skeleton-invests-220-m-eur-in-leipzig-area-to-build-the-worlds-largest-supercapacitor-factory-in-partnership-with-siemensskeletontech.com
Distribution Partnership to Serve a Wider Range of CustomersAllegro MicroSystems announced that it has entered...9950Industry NewsDistribution Partnership to Serve a Wider Range of CustomersAllegro MicroSystems announced that it has entered into a distribution partnership with global semiconductor and electrical component distributor Mouser Electronics. The partnership extends Allegro's global distribution footprint, and gives customers new options for purchasing product samples, evaluation boards, and production inventory. Many of Allegro's products are now available for purchase on the Mouser website, including the company's current sensors, position and speed sensors, and power management and motor control ICs. "This partnership greatly enhances our commitment to creating and supporting a vibrant and diverse customer base," said Max Glover, Senior Vice President of Sales at Allegro. "Mouser offers unmatched global logistics, giving engineers and designers access to our innovative ICs in a one-stop-shopping experience – leaving them more time to design and build new, exciting products." "Mouser customers demand efficient, reliable products, and Allegro MicroSystems meets and exceeds these expectations," said Kristin Schuetter, Mouser Electronics' Vice President of Supplier Management. "This agreement gives design engineers an excellent avenue for developing energy-efficient solutions across a broad range of industries and applications."19.07.2022 08:00:00Julnews_2022-08-15_3.jpg\images\news_2022-08-15_3.jpghttps://www.allegromicro.com/en/about-allegro/news-room/2022/mouser-partnership-prallegromicro.com
Acquisition of C&K SwitchesLittelfuse announced the completion of its acquisi...9922Industry NewsAcquisition of C&K SwitchesLittelfuse announced the completion of its acquisition of C&K Switches ("C&K"). C&K is a designer and manufacturer of electromechanical switches and interconnect solutions with a strong global presence across a broad range of end markets, including industrial, transportation, aerospace, and datacom. "The combination of our companies significantly expands our technologies and capabilities, enabling us to deliver a comprehensive solutions offering to our broad customer base, across a wide range of vertical end markets," said Deepak Nayar, Senior Vice President and General Manager, Littelfuse Electronics Business. "Our businesses are highly complementary and enable us to leverage our collective go-to-market models and global footprints. It is a pleasure to welcome the C&K employees to the Littelfuse team, and we look forward to their contributions, as we continue to execute on our long-term growth strategy." C&K has annualized sales of over $200 million and will be reported within the company's Electronics reporting segment.19.07.2022 08:00:00Julnews_2022-08-01_1.png\images\news_2022-08-01_1.pnghttps://www.littelfuse.com/about-us/news/news-releases/2022/littelfuse-completes-acquisition-of-c-and-k-switches.aspxlittelfuse.com
Combiners Make 5G, Fiber Broadband, and Security More AccessibleSince the line's introduction, ABB Power Conversio...9935Product ReleaseCombiners Make 5G, Fiber Broadband, and Security More AccessibleSince the line's introduction, ABB Power Conversion's Power Express combiners have helped provide safe and effective remote powering for indoor loads that exceed the capabilities of a single Class 2 circuit. Initially introduced with eight circuits to power up to 600W, ABB has announced the addition of two- and four-circuit combiners to its Power Express product family, offering flexible options to meet users' unique needs while complying with NEC requirements. In addition, ABB has developed a 1-rack-unit (RU)-high SPS Power Express shelf to address systems that use a commercial AC power input but do not have the space or desire for a separate DC power shelf. These latest additions to the Power Express family enable ABB to provide a comprehensive set of solutions to meet the Class 2 power needs of customers' unique applications. "These more compact, flexible combiners will help companies with lower budgets or smaller spaces reap the safety and compliance benefits of combined Class 2 circuitry when creating infrastructure to support 5G and Wi-Fi hotspots, fiber applications, distributed antenna systems (DAS), and security cameras," said Raj Radjassamy, 5G and wireless segment leader for ABB Power Conversion.19.07.2022 07:30:00Julnews_2022-08-01_14.jpg\images\news_2022-08-01_14.jpghttps://www.abbpowerconversion.com/about/news/in-the-news/smaller-class-2-combiners-make-5g-fiber-broadband-and-security-more-accessibleabbpowerconversion.com
Reference Designs for Compressor Motor DrivesSTMicroelectronics has released two reference desi...9965Product ReleaseReference Designs for Compressor Motor DrivesSTMicroelectronics has released two reference designs that simplify building complete industrial or home-appliance motor drives for compressors with the STSPIN32 motor-control system-in-package (SiP). Each integrates the motor controller with a three-phase inverter to power the motor, and an offline converter and auxiliary circuitry. A production-ready PCB design and motor-control firmware are also included. The STEVAL-CTM011V1 targets general industrial compressors up to 250W, while the STEVAL-CTM012V1 meets the stringent eco-design regulations for use in home appliances. The plug-and-play reference designs combine easily with a host system to start driving a motor and allow customers to fine-tune settings for optimal performance. Both ensure average efficiency greater than 96.5%. At the heart of each design, ST's STSPIN32F0601Q motor-control SiP contains an STM32F031 Arm Cortex-M0 microcontroller to customize the motor control to specific end application needs   and a very rugged 600V three-phase gate driver for the inverter. The firmware provided includes high-efficiency sensorless field-oriented control (FOC). The SiP is a compact and thermally efficient quad flat no-lead (QFN) device that meets high creepage requirements for safety and reliability. The offline AC/DC converter is a VIPER122 analog converter that integrates control logic with an 800V avalanche-rugged power section. Frequency jittering prevents interference with other equipment, while inherently low power consumption and support for burst-mode operation at light load help comply with energy-saving regulations.18.07.2022 14:30:00Julnews_2022-08-15_18.jpg\images\news_2022-08-15_18.jpghttps://newsroom.st.com/media-center/press-item.html/n4467.htmlst.com
2022 Design Methodologies ConferenceThe IEEE Power Electronics Society is hosting the ...9933Event News2022 Design Methodologies ConferenceThe IEEE Power Electronics Society is hosting the 2022 Design Methodologies Conference bringing together Design Automation, Artificial Intelligence, Machine Learning, and Cyber-Physical Security methodologies for power electronics applications. The PELS has witnessed a significant and growing interest in advanced Design Methodologies for Power Electronics in recent years, culminating in the launch of this conference in 2021. With the 2022 DMC hosted by the historic city of Bath on September 1st and 2nd, 2022, and virtual attendance powered by the online Whova platform, you can join us to participate in keynotes, discussions, presentations, and more!17.07.2022 19:00:00Julnews_2022-08-01_12.png\images\news_2022-08-01_12.pnghttps://attend.ieee.org/dmc-2022/ieee.org/dmc-2022
EMV 2022 Summer Edition: Community Celebrates Gathering in CologneThe EMV invited attendees to network, train and mu...9929Event NewsEMV 2022 Summer Edition: Community Celebrates Gathering in CologneThe EMV invited attendees to network, train and much more at the Cologne event site from 12 – 14 July 2022. Around 2,500 qualified visitors took advantage of the versatile offering at the trade fair, the scientific conference and the workshops. In line with the motto "Creating a compatible future", 91 exhibiting companies and partners presented product innovations, services and solution approaches for the EMC technology of tomorrow. In addition, the conference, which was accompanied by workshops, made an excellent contribution to further education and offered participants insightful approaches to solutions and answers to current industry topics. On the last day of the event, the award winners were announced and honored by the committee of the EMV Cologne. In the category "Best Paper", Henrik Brech (Leibniz Universität Hannover) won the race with an excellent performance. "After three successful days at the congress of the EMV 2022, the four best contributions were awarded today. The participation of many young candidates was particularly pleasing. This makes the event the optimal platform for young engineers in particular to present their expertise and network with experts," reports Prof. Dr.-Ing. Heyno Garbe, Committee Chair of the EMV Cologne. The next edition of the EMV will be held in Stuttgart, Germany from 28 – 30 March 2023.14.07.2022 15:00:00Julnews_2022-08-01_8.jpg\images\news_2022-08-01_8.jpghttps://emv.mesago.com/stuttgart/en/press/press-releases/emv-press-releases/EMV2022_final_report.htmlemv.mesago.com
Silicon RF High-power MOSFET Module for Commercial Two-way RadioMitsubishi Electric announced that it will launch ...9941Product ReleaseSilicon RF High-power MOSFET Module for Commercial Two-way RadioMitsubishi Electric announced that it will launch a 50W silicon radio-frequency (RF) high-power metal-oxide semiconductor field-effect transistor (MOSFET) module for use in high-frequency power amplifiers of commercial two-way radios. The model, which offers a 50W power output in the 763MHz to 870MHz band and high total efficiency of 40%, is expected to help expand radio communication range and reduce power consumption. The 150MHz and 400MHz frequency bands used for various wireless systems have become congested in North America and other markets, so in response, the 700MHz band, formerly used for analog TV broadcasting, has been reallocated for commercial two-way radio, increasing the demand for radios that support this band. Conventional power amplifiers, however, experience large power loss, so there is a need for RF high-power MOSFET modules offering built-in input/output impedance-matching circuit and guaranteed output-power performance. The silicon RF high-power MOSFET (RA50H7687M1), which achieves unmatched power output and high total efficiency for commercial radios compatible with the 700MHz band, is expected to expand the communication range and lower the power consumption of such radios.14.07.2022 13:30:00Julnews_2022-08-01_20.jpg\images\news_2022-08-01_20.jpghttps://www.mitsubishielectric.com/news/2022/0714.htmlmitsubishielectric.com
Silicon Carbide CooperationSEMIKRON and ROHM Semiconductor have been collabor...9924Industry NewsSilicon Carbide CooperationSEMIKRON and ROHM Semiconductor have been collaborating for more than ten years with regards to the implementation of silicon carbide (SiC) inside power modules. Recently, ROHM's latest 4th generation of SiC MOSFETs has been fully qualified in SEMIKRON's eMPack modules for automotive use. Hence, both companies serve worldwide customers' needs. SEMIKRON announced it had secured a billion-Euro contract to supply their innovative eMPack power modules to a major German car maker, beginning in 2025. The company developed a fully sintered assembly and connection technology 'Direct Pressed Die' (DPD). This enables extremely compact, scalable and reliable traction inverters. The eMPack module technology has been specially designed for SiC-based converters of medium and high power in order to fully exploit the properties of the new semiconductor material. In addition, SEMIKRON provides evaluation boards for eMPack that incorporate ROHM's gate driver ICs, helping customers shorten the time required for evaluation and adoption. In the future, SEMIKRON also plans to use ROHM's IGBTs in modules for industrial applications. ROHM's latest 4th generation of SiC MOSFETs, which has been adopted by SEMIKRON, provides industry-leading low ON resistance with improved short-circuit withstand time. These characteristics contribute significantly to extend the driving length and miniaturize the batteries of EVs when they are used in traction inverters. Thus, the company develops advanced, energy-saving SiC devices that reduce environmental impact. Both companies will continue to contribute to automotive technology innovations by providing optimal power solutions that meet market needs through the fusion of ROHM's device/control technologies and SEMIKRON's module technologies that can optimally combine them.14.07.2022 10:00:00Julnews_2022-08-01_3.jpg\images\news_2022-08-01_3.jpghttps://www.rohm.com/news-detail?news-title=2022_news_sic&defaultGroupId=falserohm.com
40V MOSFETs Deliver SMPS PerformanceTaiwan Semiconductor introduces the PerFET Series ...9937Product Release40V MOSFETs Deliver SMPS PerformanceTaiwan Semiconductor introduces the PerFET Series of single- and dual-channel 40V power MOSFETS. Built on proprietary device structures and processes that enable exceptionally low on-state resistance and switching FOM (figure-of-merit), the PerFET device achieves 50% RDS(ON) and 40% FOM reduction. The 40V N-channel PerFET platform includes options for both standard (10V) and logic level (5V) gate-drive requirements while preserving rugged safe-operating area margin when switching voltage transients and avalanche occurs in switching applications. The NH Series PerFET devices are housed in PDFN56U and is compatible with conventional SOP8 packages. Its wettable flank leads to improved solder joint reliability, lower DC resistance and automated optical inspection (AOI) during PCB assembly. Their reliability and performance are well suited to SMPS, server, DC-DC converter, telecom, motor driver and multicopter designs. Manufactured to meet AEC-Q performance standards, the PerFET family features 175 °C operating junction temperature, 100% UIS and Rg tested and are RoHS compliant. The 12 single-channel and two dual-channel models in the NH Series are rated for 40V operation with operating currents of 34A (dual channel versions) and ranging from 54A to 100A (single channel versions).14.07.2022 09:30:00Julnews_2022-08-01_16.jpg\images\news_2022-08-01_16.jpghttps://www.taiwansemi.com/en/newsletter/perfet-trade--power-mosfet-40v-pdfn33taiwansemi.com
Chip Development Centers Under ConstructionBy 2026, Bosch plans to invest another 3 billion e...9928Industry NewsChip Development Centers Under ConstructionBy 2026, Bosch plans to invest another 3 billion euros in its semiconductor division as part of the IPCEI funding program on microelectronics and communications technology. "Microelectronics is the future and is vital to the success of all areas of Bosch business. With it, we hold a master key to tomorrow's mobility, the internet of things, and to what we at Bosch call technology that is 'Invented for life'," says Dr. Stefan Hartung, chairman of the Bosch board of management, at the Bosch Tech Day 2022 in Dresden. One of the projects Bosch plans to fund with this investment is the construction of two new development centers – in Reutlingen and Dresden – at a combined cost of over 170 million euros. In addition, the company will spend 250 million euros over the coming year on the creation of an extra 3,000 square meters of clean-room space at its wafer fab in Dresden. "We're gearing up for continued growth in demand for semiconductors – also for the benefit of our customers," Hartung said. "For us, these miniature components mean big business." At its Reutlingen plant Bosch has been mass-producing silicon carbide (SiC) chips since the end of 2021. These are used in the power electronics required for electric and hybrid vehicles, where they have already helped boost operating ranges by up to 6 percent.13.07.2022 14:00:00Julnews_2022-08-01_7.jpg\images\news_2022-08-01_7.jpghttps://www.bosch-presse.de/pressportal/de/en/invented-for-life-with-semiconductors-bosch-invests-further-billions-in-chip-business-243715.htmlbosch-presse.de
Fast Recovery Diodes for Air Conditioners and EV Charging StationsROHM has developed its 4th Generation 650V fast re...9947Product ReleaseFast Recovery Diodes for Air Conditioners and EV Charging StationsROHM has developed its 4th Generation 650V fast recovery diodes (FRDs), the RFL/RFS series, featuring low forward voltage (VF), fast reverse recovery time (trr) respectively, as well as ultra-low noise characteristics. The devices are ideal for industrial and consumer equipment that handle large amounts of power, such as air conditioners and EV charging stations. In recent years, more effective use of electricity is necessary to cope with the rise in global power consumption. This is especially true for white goods and industrial equipment that handle large amounts of power such as EV charging stations. These require not only high electrical efficiency but also reducing workload for noise countermeasures in circuit design. In response, ROHM developed diodes that combine low VF for more efficient operation with fast trr characteristics that provide less loss and ultra-low noise during switching OFF. Optimizing the device structure and materials allows the RFL/RFS series to achieve the optimum balance of VF and trr, which are important characteristics for FRDs but are in a trade-off relationship. The low VF RFL series reduces VF by approx. 3.2% and trr by about 8.3% over the conventional RFN series, while the high-speed RFS series decreases VF by approx. 17.9% vs the conventional RFUH series. Both products contribute to higher power supply efficiency through optimal design based on circuit requirements. Furthermore, ultra-low noise diode recovery characteristics are achieved, they help to reduce both workload and components for noise.12.07.2022 19:30:00Julnews_2022-08-01_26.jpg\images\news_2022-08-01_26.jpghttps://www.rohm.com/news-detail?news-title=2022-07-12_news_frd&defaultGroupId=falserohm.com
Creator of Isolation Technology AcquiredNavitas Semiconductor has announced the acquisitio...9931Industry NewsCreator of Isolation Technology AcquiredNavitas Semiconductor has announced the acquisition of VDD Tech, creator of digital-isolators for next-generation power conversion, which are essential to deliver size, weight, and system-cost improvements in high-power markets such as consumer, motor drive, solar, data center, and EV. VDD Tech's proprietary modulation-technique enables stable, reliable, efficient power conversion at MHz+ switching speeds. Proprietary dV/dt sensing, blanking, and refresh technologies enable an unprecedented combination of very-high-voltage-isolation capability with the highest frequency of operation requiring 5-10x higher dV/dt immunity than legacy Silicon. Low isolation-capacitance (<0.5pF) and innovative, robust modulation deliver low-jitter digital-communication for isolated-driver control and analog-sensing feedback. A minimum 200 V/ns Common-Mode Transient Immunity (CMTI) is uniquely guaranteed across all temperature and operating conditions. VDD Tech was founded in Mont-Saint-Guibert, Belgium, by Vincent Dessard, quickly joined by Aimad Saib, each of them holding a doctorate and 15+ years' experience in analog / mixed-mode IC research and development. Dessard and Saib have taken leading roles in Navitas' advanced R&D teams. "VDD Tech's isolation technology is a key part of our growing power-and-control integration strategy, creating an additional $1B/yr market opportunity," said Gene Sheridan, Navitas CEO and co-founder. "We continue to research and review new technologies that we could add to Navitas' core strengths, and deliver significant CO2 emission-reduction benefits as we continue our mission to 'Electrify Our World'."12.07.2022 17:00:00Julnews_2022-08-01_10.jpg\images\news_2022-08-01_10.jpghttps://navitassemi.com/navitas-acquires-vdd-tech-to-expand-high-power-next-gen-semiconductor-capabilities/navitassemi.com
EMI Test Receiver Bandwidth Extended to 1 GHzTo help EMC engineers meet the increasing demand f...9944Product ReleaseEMI Test Receiver Bandwidth Extended to 1 GHzTo help EMC engineers meet the increasing demand for higher measurement speeds, Rohde & Schwarz introduces a wideband solution which is able to measure up to 970 MHz in real time, while keeping a high dynamic range and measurement accuracy. In order to speed up measurement time and to provide a more careful analysis of interfering signals, the R&SESW EMI test receiver offers the possibility to increase its FFT (Fast Fourier Transform) bandwidth to 350 MHz with the  R&S ESW-B350 option, and to 970 MHz with the R&S ESW-B1000 option. This makes the R&S ESW not only an instrument of highest performance in RF, functionality, versatility and hardware quality, but also in high-speed testing especially for pretests and general EMI analysis. With the R&S ESW-B1000 offering 970 MHz of FFT bandwidth, the R&S ESW can process the CISPR Bands C and D in one shot – even with quasi peak and CISPR average detectors working in parallel – offering a significant gain in measurement speed. The 970 MHz wide spectrum is measured in real time; users benefit from a truly gapless spectrogram. Infrequent emissions can be observed over a significantly longer time and are detected with a much higher probability. Emissions from equipment under test going through a duty cycle are recorded over a broad spectrum of 970 MHz without missing the shortest pulse.12.07.2022 16:30:00Julnews_2022-08-01_23.jpg\images\news_2022-08-01_23.jpghttps://www.rohde-schwarz.com/about/news-press/all-news/rohde-schwarz-extends-r-s-esw-emi-test-receiver-bandwidth-to-1-ghz-press-release-detailpage_229356-1239168.htmlrohde-schwarz.com