Bodo's News

Read through my personal pick of news around people, our industry, important events and interesting product releases. Or click on a filter and pick your area of interest!

 

Power Supply Delivers up to 800W with BF-Ready Isolation
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Learn more:
lambda.tdk.com
  • Product Release
  • 2022-11-22

TDK Corporation announces the introduction of the TDK-Lambda brand 1U high MU4 series of AC-DC modular power supplies. The product’s very low acoustic noise is strongly desired in test and medical applications where audible disturbances need to be kept to a minimum. The modular MU4 can provide up to five isolated and regulated outputs and deliver up to 800W. All models in the MU4 series feature full MOPPs (Means of Patient Protection) isolation, including output to earth, to simplify implementation into BF-rated medical applications. Other target applications include dental, test and measurement, broadcast, professional audio, and industrial equipment. With intelligent fan control, the MU4 fan rotation speed is reduced, producing audible noise as low as 36dBA*. Its microcontroller algorithm monitors the temperature of the primary converter and each output module, allowing the fan speed to be adjusted for optimum cooling. The low profile, 1U high, MU4 measures just 89 x 41 x 257.5mm (W x H x D), allowing a smaller system enclosure. Initially, nine modules are available, offering a continuous range of voltages from 3.3V to 104V with ratings from 150W to 480W. Options include a 5V / 2A standby voltage, fan fail signal, inhibit and enable (for individual or all outputs), DC good, PMBus™ communication, and current share for parallel configurations.

Joint Agreement to Develop Inverters for e-Axle Using SiC Power Modules
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Learn more:
rohm.com
  • Industry News
  • 2022-11-22

ROHM has signed a joint development agreement with Mazda Motor and Imasen Electric Industrial for inverters and SiC power modules to be used in the electric drive units of electric vehicles, including e-Axle. As the ‘heart of the EV’, e-Axle integrates a motor, reduction gearbox, and inverter into a single unit that plays a large part in determining the driving performance and power conversion efficiency of electric vehicles. SiC MOSFETs in particular are expected to improve efficiency even further. ROHM will carry out joint inverter development for e-Axle by participating in a ‘cooperative framework for the electric drive units development and production’ with companies such as Imasen and led by Mazda. At the same time, ROHM will contribute to the creation of compact, high efficiency electrical units by developing and supplying advanced SiC power modules that provide improved performance. Through this collaboration, ROHM will develop even more competitive SiC MOSFETs and modules by working backwards from the finished vehicle to understand the performance and optimal drive method required of power semiconductors. Besides creating value through mutual understanding between car and device manufacturers, the three companies also support technical innovation in the automotive field and contribute to a sustainable society by leveraging extensive knowledge, technologies, and products garnered on a global basis.

electronica 2022 Confirms its Status
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Learn more:
electronica.de
  • Event News
  • 2022-11-18

An excellent mood in 14 halls and intensive discussions at full trade fair booths: The international electronics industry met again in person from November 15 to 18 at electronica 2022 in Munich. 2,144 exhibitors, 64 percent of whom came from countries outside of Germany, showcased innovations that covered the entire spectrum of electronics to about 70,000 visitors at this world leading trade fair. SEMICON Europa was held in parallel spread over just under one and a half halls. A highly informative supporting program consisting of conferences, forums and special events such as the CEO Roundtable explored the focus topics of the trade fair. The program also served as an opportunity for discussions about current global challenges, including the energy transition, supply chain bottlenecks, the scarcity of raw materials and shortages of skilled workers. “electronica 2022 impressively confirmed its status as world leading trade fair and demonstrated once again that Munich is THE trade fair location for the international electronics industry,” summarizes Dr. Reinhard Pfeiffer, CEO of Messe München. “We are delighted that the number of visitors was only around 14 percent below the record result of 2018, and that the share of international visitors at around 54 percent was even higher than at the previous events—an outstanding result in these times. What’s more, according to the trade fair survey, our exhibitors and visitors were more satisfied with electronica this year than ever before.” The next electronica will take place in Munich from November 12-15, 2024.

Radiation-Hardened ICs Lift Off Onboard Artemis 1 Mission to the Moon
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Learn more:
renesas.com
  • Industry News
  • 2022-11-17

Renesas Electronics announced that hundreds of its radiation-hardened (rad-hard) integrated circuits (ICs), including over 50 different part numbers, are onboard the Artemis 1 launch that blasted off on November 16. Intersil-brand rad-hard ICs are part of the battery management systems, RS-25 engine control electronics and the launch abort system on the Space Launch System that propelled the mission into space, the most powerful rocket ever built. On the Orion Capsule that will circle the moon, Renesas provided critical components for controller boards, the main flight computer, the docking camera system, the power distribution system and display and panel electronics. The Intersil-brand ICs perform multiple functions, including power management and precision signal processing. Artemis is the ambitious NASA program that will take humankind back to the moon for the first time in more than 50 years. Artemis 1 is sending the test-mannequin populated Orion capsule to orbit the moon and deploy cubesats and other space experiments on a 42-day mission to test all the critical systems. Artemis 2 (2024) will have a crew that will orbit the moon paving the way for Artemis 3 (2025), which will land the first woman and the first person of color on the moon. The plan is for Artemis to continue to build a space station in lunar orbit and a base on the lunar South Pole. This infrastructure will allow for the awe-inspiring goal of a crewed mission to Mars in the 2040s.

Industrial Series 60 KW DC Power Supplies and Loads
  • Product Release
  • 2022-11-15

EA Elektro-Automatik introduces its 60 kW and 30 kW, EA-PU 10000 Programmable DC Power Supplies, EA-PUB 10000 Programmable Bidirectional DC Power Supplies and EA-PUL DC Programmable Regenerative Electronic Loads. Typical applications include electric vehicle battery pack testing, powering furnaces in semiconductor wafer fabrication facilities, electrochemical electrolysis processing, and solar inverter testing. The products, without manual front panel displays, are intended for use in production ATE systems and automated process control systems requiring high power.The 60 kW models output maximum voltages of 360 V to 2000 V and maximum currents of 480 A to 80 A; the 30 kW models output maximum voltages of 60 V to 2000 V and maximum currents of 1000 A to 40 A. Overall, the 60 kW series includes 21 models, and the 30 kW series consists of 29 models allowing engineers to select a model that addresses their specific applications. The increased power capability enables engineers to reduce the number of power instruments needed for a high-power system, saving critical rack space and providing more power in a smaller footprint.

650V GaN HEMTs
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Learn more:
innoscience.com
  • Product Release
  • 2022-11-15

Innoscience announced a low RDS(on) 650V E-mode GaN HEMT devices. INN650D080BS power transistors have an on-resistance of 80m? (60m? typical) in a standard 8x8 DFN package, enabling higher power applications, for example in totem pole LLC architectures or fast battery-chargers. Explains Yi Sun, Sr VP of product development at Innoscience: “We are now able to address high density, high efficiency power conversion applications. Like all our other 650V HEMTs, these new parts are qualified to JEDEC standards for chip and package, and they have also passed DHSOL (Dynamic High Temperature Operating Life) reliability testing according to JEP180 and accelerated life tests up to 1000V give lifetime calculations of 36 years (520V; 150°C; 0.01% failure rate).” Thanks to Innoscience’s innovative strain enhancement layer, InnoGaN devices features low specific RDS(ON) as well as very low dynamic RDS(ON) and excellent reliability. The new 80m? RDS(on) parts also feature very good drain source voltage transient (VDS, transient) and pulsed (VDS, pulsed) characteristics – 800V and 750V respectively. Moreover, similarly to the other 650V products, the 80m? RDS(on) devices feature a strong ESD protection circuit embedded in the die to ease mass production assembly of these device in package and easy handling. In this case, however, the ESD circuit has been modified to allow a larger negative gate voltage swing down to -6V. The low RDS(on) INN650D080BS power transistors, which are available in industry-standard 8x8 DFN packages, join previously-announced 140m?,190m?, 240m?, 350 m?, 500m? and 600 m? RDS(on) parts, creating a significant portfolio of available devices, which is continuously expanding towards lower RDS(on) values.

GaN Technology for High Power Density Applications
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Learn more:
epc-co.com
  • Product Release
  • 2022-11-15

EPC launches the 80 V, 4 mOhm EPC2619. This is the lead product for a generation of eGaN devices that have double the power density compared to EPC’s prior-generation products. The EPC2619 has an RDS(on) of just 4 mOhms in a tiny, 1.5 mm x 2.5 mm, footprint. The maximum RDS(on) x Area of the EPC2619 is 15 m?*mm2 – five times smaller than 80 V silicon MOSFETs. This product is designed for a range of motor drive applications. For example: 28 V – 48 V conversion for eBikes, eScooters and power tools; high density DC-DC converters; solar optimizers; and synchronous rectification converting 12 V – 20 V for chargers, adaptors, and TV power supplies. The typical RDS(on) x QGD, which is indicative of power losses in hard-switching applications, is 10 times better than 80 V silicon MOSFETs. This enables switching frequencies that are 10 times higher than silicon MOSFETs and without an efficiency penalty, thus producing the highest power density.  This makes the EPC2619 ideal for high frequency hard-switching 24 V – 48 V applications, such as used in buck, buck-boost, and boost converters. The typical RDS(on) x QOSS, which is indicative of power losses in soft-switching applications, is 87 mOhm*nC, two times better than 80 V silicon MOSFETs. This makes the EPC2619 ideal for soft-switching applications, such as the primary rectification full bridge for LLC-based DCX DC-DC converters.

Advanced Smart Electrical Outlet and Connector
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Learn more:
menlomicro.com
  • Industry News
  • 2022-11-15

VoltSafe announced a strategic partnership with Menlo Microsystems to co-develop an advanced electrical plug technology. Both companies are strong proponents of advancing how the world connects to electricity, and the combination of Menlo Micro’s Ideal Switch technology with VoltSafe’s smart electrical outlet and connector will enable the future of smart power connectivity. Seeing deficiencies in existing relays and switches that caused the products they operated to be bigger, slower, less capable, or more expensive, Menlo Micro set out to create a better solution and developed Ideal Switch. The Ideal Switch is a device that delivers all the benefits of a mechanical relay and a semiconductor switch, with no compromises. The Ideal Switch is tiny, fast, reliable, withstands extreme temperatures, is ultra-low loss and can handle 1,000s of watts. Menlo Micro in March announced its $150 million USD Series C, bringing Menlo Micro’s total cumulative funding to over $225 million USD. Vertical Venture Partners and Tony Fadell’s Future Shape led the round. Menlo’s Micro’s confidence in VoltSafe’s disruptive technology powering the future of how the world connects to electricity, paved the way for this early collaboration. 

Zero-Voltage-Switching Power-Supply ICs
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Learn more:
power.com
  • Product Release
  • 2022-11-15

Power Integrations announced the InnoSwitch™4-Pro family of digitally controllable, off-line CV/CC Zero Voltage Switching (ZVS) flyback ICs, which substantially reduce the size of power adapters. Incorporating a robust PowiGaN gallium-nitride primary switch and steady-state switching frequency of up to 140 kHz, the highly integrated devices reduce the component count and PCB area required for ultra-compact adapters for cellphone, notebook, tablet and multi-port accessories. “InnoSwitch4-Pro ICs interface seamlessly with Power Integrations’ ClampZero™ family of active clamp ICs to achieve ZVS in both continuous conduction mode (CCM) and discontinuous conduction mode (DCM),” stated Aditya Kulkarni, product marketing manager at Power Integrations. “ZVS, combined with our PowiGaN™ technology, virtually eliminates switching losses. Efficiency exceeds 95 percent, which enables designers to eliminate the heat sinks, spreaders and potting materials typically required for thermal management." Further size reduction of the adapter can be achieved by the use of a MinE-CAP™ device in combination with InnoSwitch4-Pro and ClampZero ICs. Based also on PowiGaN technology, MinE-CAP ICs enable input capacitance size reduction of approximately 40 percent. Capable of delivering up to 220 W, InnoSwitch4-Pro ICs combine a 750 V PowiGaN primary switch, controller, FluxLink™ reinforced isolation feedback link for secondary-side control, I2C interface, active clamp drive and synchronous rectification in a compact InSOP™-28 package.

Funding Enables Mass Production of GaN Transistor Family
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Learn more:
camgandevices.com
  • Industry News
  • 2022-11-15

Cambridge GaN Devices (CGD) has raised $19m in Series B funding. The investment was led by Parkwalk Advisors and BGF, with participation from IQ Capital, CIC, Foresight Williams Technology and Martlet Capital. The investment will enable CGD to begin mass production of its range of GaN transistors for power applications. CGD has already made remarkable progress, developing intellectual property and bringing to market its ICeGaN™ Gallium Nitride transistor family which addresses a $50bn global power semiconductor market. The company is positioned to disrupt multiple industries such as consumer and industrial power supplies, lighting, data centres and automotive HEV/EV. CGD’s technology provides efficient, sustainable, and more cost-effective power solutions for electronic equipment. As a result, CGD has gained global traction and attention at international conferences and in respected press. CGD is currently leading a $10m European-funded project developing GaN-based modules for low and high-power applications (GaNext); is participating in a UK supply chain initiative for PCB-embedded power systems with GaN devices (P3EP) and recently launched a project to develop highly reliable GaN power transistors and ICs to cut data centre emissions (ICeData). CGD is also focused on key partnerships with their customers focused at the datacom and automotive solutions. The company has completed its brand development, moved to new offices, and now employs over 40 staff worldwide, with more planned to support the up scaling.

MOSFETs with Top-Cool Packaging
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Learn more:
onsemi.com
  • Product Release
  • 2022-11-15

onsemi announced a series of MOSFET devices that feature top-side cooling to assist designers in challenging automotive applications, especially within motor control and DC/DC conversion. Housed in a TCPAK57 package measuring just 5mm x 7mm, the Top Cool devices feature a 16.5mm2 thermal pad on the top side. This allows heat to be dissipated directly into a heatsink rather than via a typical printed circuit board (PCB). By enabling the use of both sides of the PCB and decreasing the amount of heat going into it, the TCPAK57 provides increased power density. Improved reliability of the new design adds to an overall extended system lifetime. “Cooling is one of the greatest challenges in high power design and successfully addressing it is the key enabler to reducing size and weight, which is critical in modern automotive design,” said Fabio Necco, vice president and general manager, Automotive Power Solutions at onsemi. “With excellent electrical efficiency and having eliminated the PCB from the thermal path, the design is significantly simplified while reducing size and cost.” The devices deliver the electrical efficiency required in high power applications with RDS(ON) values as low as 1m?. Additionally, the gate charge (Qg) is low (65 nC), reducing losses in high-speed switching applications.

GaN ICs Fast-Charge from 1-50% in Only 7 Minutes
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Learn more:
navitassemi.com
  • Industry News
  • 2022-11-14

Navitas Semiconductor has announced its GaNFast power ICs have been selected for the ‘in-box’ 125 W charger of Motorola’s latest ?agship smartphone, the X30 Pro. A charge from 1% – 50% in just 7 minutes brings an ultra-fast charging experience to Motorola users. Jin CHEN, General Manager of Smartphone BU, Lenovo China commented on the launch of X30 Pro: “We hope to deliver a more comprehensive user experience in the ?agship X30 Pro. By working hand-in-hand with Navitas and Aohai Technology, we are able to utilize GaN and speed up the charging capability of Motorola’s smartphones to a new level. We look forward to collaborating further with Navitas and Aohai Technology, to break more records in charging speed, and offer a convenient and ultra-fast charging experience to our users.” “We are excited that GaNFast technology empowers Motorola to achieve a more powerful charger. This time, Motorola, Navitas and Aohai Technology’s collaboration reached a benchmark 125 W fast-charging solution on the new X30 Pro.” said Charles (Yingjie) ZHA, VP and GM of Navitas China: “We are dedicated to offer an eco-friendly and ultra-fast charging experience for consumers. This tiny but powerful 125 W GaN charger demonstrates our continued effort to ‘Electrify Our World™’. Navitas will continue to push the innovation of GaN technology to empower Motorola’s charging roadmap.”

Simulation Software Technology for PCB Design Solutions
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Learn more:
keysight.com
  • Industry News
  • 2022-11-14

Keysight Technologies announced that Altium LLC recently licensed Keysight's advanced electromagnetic simulation technology to develop power analysis solutions for PCB designers. Keysight and Altium are partnering to address the needs of hardware engineers who are not power integrity experts. Reliable power distribution is a pervasive problem facing PCB designers. As integrated circuit (IC) components trend toward lower supply voltages for increased power efficiency, it becomes difficult to design a PCB power plane within shrinking tolerance limits. Designers typically build several iterations of prototypes or submit their designs to power integrity specialists. Both are sub-optimal approaches that hinder rapid design turnaround. By empowering PCB designers to find and fix problems before first prototype, they can achieve higher productivity, faster time-to-market, and greater predictability in the design process. Power Analyzer is the first offering to result from the strategic partnership between Altium and Keysight, providing interactive analysis of power integrity issues. Altium integrated Keysight's EM simulation technology with its modern graphical user interface to make power analysis fast, accurate, and easy to run. PCB designers using Power Analyzer gain insight into their power plane performance through analysis of voltage drop and current density from within their PCB layout environment.

Hot-Swap Controller with Programmable Digital SOA Control
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Learn more:
infineon.com
  • Product Release
  • 2022-11-14

Infineon Technologies introduces the XDP™ XDP710 digital controller, the first member of its intelligent hot-swap controller and protection IC family. The hot-swap and system monitoring controller IC has a 5.5 V to 80 V input voltage range with transients up to 100 V for 500 ms. It consists of three functional blocks. The first is the high-precision telemetry and digital safe operating area (SOA) control block, optimized to meet Infineon’s power MOSFETs characteristics. The second is the system resources and management block, and the third is the integrated gate driver and charge pump block for n-channel power MOSFETs such as OptiMOS™ and StrongIRFET™ families. “Infineon Technologies’ XDP710 Digital hot-swap controller met HGX Platform product requirement well. Like its unique features such as option of external FET selection using resistor strapping and boost mode. It helps that XDP710 come in small package, easy to design in” said Abhijit Datta, Sr. Power Architect and Subject Matter Expert at NVIDIA. “The XDP710 hot-swap controller is a feature-rich device with high-precision analog-front-end along with comprehensive health monitoring, telemetry, programmability, and pre-set MOSFET SOA. It addresses the challenges associated with the current design of pluggable AI server solutions,” said Shahram Mehraban, Vice President Power Management ICs at Infineon’s Power & Sensor Systems Division.

DC/DC Converters for E-Mobility
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Learn more:
tracopower.com
  • Product Release
  • 2022-11-14

It is safe to say we are all feeling the wave of demand for electric vehicles, charging stations, and the required support infrastructure which are becoming ever more powerful, faster, and more compact. Consequently, more power in a smaller space is required for the operation of the electronics. Compact, highly efficient, reliable and, above all, robust DC/DC converters are required to meet these high demands of e-mobility applications. These converters must be able to withstand extreme and fluctuating temperatures and function reliably in harsh environments for years. With more than two decades of experience in railroad technology, Traco Power has set the goal of bringing robust DC/DC converters with high efficiency and power density to the market, especially suited for applications in electromobility. The range of Traco Power DC/DC converters for e-mobility includes models from 1- 300 Watts. These models are available in various mechanical types such as DIN-Rail, Chassis mount and PCB mountable DIP, SIP and SMD packages and are ideal for e-mobility applications. Traco Power products are carefully designed and fully compliant with the latest Railway, Industrial and Information Technology standards.

Product Distribution Center in Frankfurt
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Learn more:
ti.com
  • Industry News
  • 2022-11-14

Texas Instruments announced plans to open a product distribution center (PDC) in Frankfurt, Germany, by the end of 2024. The PDC will expand the company’s European footprint and enable faster deliveries to TI’s growing customer base there. “We are excited to expand our European presence in Frankfurt, as it offers a centralized location with proximity to key customers and our company’s European headquarters in Freising, Germany,” said Stefan Bruder, president of Texas Instruments Europe. “Frankfurt’s key role as a logistics hub will mean faster deliveries to our European customers who are moving quickly to bring leading-edge products to the market.” This Frankfurt location, near many of TI’s industrial and automotive customers, will enable same-day delivery in central Germany and next-day delivery capabilities to most European-based customers. The Frankfurt site will pack and ship a broad range of TI technologies to support customers across Europe. “Expanding in Frankfurt is a logical extension of TI’s presence in Europe and an important investment in our customers, providing them with even better service and support for decades to come,” Bruder said.

Collaboration to Expand Market for GaN Power ICs
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Learn more:
navitassemi.com
  • Industry News
  • 2022-11-11

Navitas Semiconductor and Avnet Silica announced close cooperation between the two companies to grow the market in Europe for Navitas' GaNFast power ICs with GaNSense technology. The two companies will work closely together to deliver their combined complementary knowhow to bring a high level of support and expertise to customers across the EMEA region. "Navitas' unique GaN technology and its world-renowned monolithically integrated gate driver and feature set will significantly expand our 'SILICA' wide-band-gap semiconductor portfolio," said Gilles Beltran, President Avnet Silica. "Navitas has a depth of expertise in power semiconductors that is unrivalled across the industry for this kind of advanced technology. We envisage this cooperation will bring huge benefits for customers operating at the cutting edge of power system architectures in a wide selection of applications." "We chose to work with Avnet Silica as one of the premier experts in semiconductor distribution in Europe," said David Carroll, Senior Vice President of Worldwide Sales at Navitas. "The combination of our highly differentiated solutions together with Avnet Silica's expertise in technology markets will further support designers and engineers to meet ever more stringent efficiency and size requirements and regulations. With our highly experienced technical team and our European applications lab, together, we can support customers with the best possible solutions and fastest time-to-market."

Investment Boosts Existing Power Management Expertise
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Learn more:
nexperia.com
  • Industry News
  • 2022-11-11

Nexperia announced a broadening to its portfolio of power management products to include energy harvesting solutions. Energy can be harvested from light, vibrations, radio waves or temperature gradients and can therefore be used to replace batteries in low-power applications like smart wearables and autonomous wireless sensor nodes. The expansion of Nexperia’s expertise comes through the acquisition of Netherlands-based Nowi, founded in 2016. Nowi’s PMICs combine small PCB footprint with low BOM cost and the best average harvesting performance. The manufacturing capacity and capability of Nexperia as well as its global infrastructure will ensure that together, Nowi will be able to speed the production of these solutions enabling higher volume production and shipping by the end of 2022 and early 2023. “Nowi represents a strategically important investment because energy harvesting is the perfect complement to Nexperia’s existing power management capabilities,” says Dan Jensen, General Manager Business Group Analog & Logic ICs at Nexperia. “This decision means Nexperia can now offer customers a sustainable alternative to battery power for their products, that will be available in the market quickly. The team at Nowi has built a strong foundation on which we are only looking to build and facilitate the ability to scale – both from the production side, but also the business and the team. We are excited to be bringing the Nowi team into the Nexperia family.”

650V and 750V SiC MOSFETs for Industrial and Electric Vehicle Applications
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Learn more:
aosmd.com
  • Product Release
  • 2022-11-10

Alpha and Omega Semiconductor announced its 650V and 750V SiC MOSFET platform for both industrial and automotive applications. The 650V SiC MOSFETs are ideal switching solutions for industrial applications such as solar inverters, motor drives, industrial power supplies, and new energy storage systems, while the AEC-Q101 qualified 750V SiC MOSFET line is targeted for the high-reliability needs in electric vehicle (EV) systems such as the on-board charger (OBC) and the main traction inverter. The AOM015V75X2Q 750V aSiC MOSFET expands on the existing second-generation 1200V aSiC MOSFET and diode products with an RDS(ON) down to 15mW in a standard TO-247-4L package while maintaining a recommended +15V gate drive voltage to ensure the broadest compatibility with existing gate driver solutions. Due to the minimized internal gate resistance and optimized cell design, AOS designed these devices to exhibit ultra-fast switching speeds that are fully controllable with an external gate resistor. This benefit is also noticeable in standard switching figures-of-merit (FoM) such as RON x QGD and RON x QRR that are improved compared to existing 750V SiC MOSFET solutions.

Isolated Power Module in a MicroModule Package
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Learn more:
we-online.com
  • Product Release
  • 2022-11-09

Würth Elektronik has extended the product families of its MagI³C power modules with the MagI³C-FIMM Fixed Isolated MicroModule. It combines the features of an isolated power module with those of a MicroModule in an LGA-7 package and measures just 9 mm x 7 mm x 3.1 mm. The isolation capacitance between the primary and secondary windings is typically just 8pF. The 1 W output power is maintained up to an ambient temperature of 100°C without derating. It represents one of the best modules in the portfolio of fully isolated modules-with an efficiency up to 91%. MagI³C Power Modules are fully integrated DC/DC converters with switching power stage, controller, inductor as well as input/output capacitors. It requires no external circuitry-all components, including CIN and COUT, are integrated, allowing quick and easy circuit design without transformer expertise. MagI³C-FIMM boasts a small size and high efficiency, as well as an extended operating ambient temperature range up to 125°C. The module offers continuous short-circuit protection and overvoltage protection up to 3000 V. MagI³C-FIMM is suitable for applications in data acquisition, test and measurement technology, for supplying interfaces and microcontrollers, and other requirements in industrial electronics, to name but a few. It provides functional isolation for overvoltage protection and minimizes ground loops and ground shifts as well as noise in the signal path or sensor systems. According to the manufacturer's measurements, the low radiated EMI with tested filter combination is below the EN55032 Class B / CISPR-32 limits. The MicroModule is certified according to the current UL standard UL62368-1.

GaN Devices Solve the Challenge of Solar Power Installation
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Learn more:
epc-co.com
  • Product Release
  • 2022-11-09

Solarnative uses GaN devices in its microinverter to achieve high power density. The Power Stick is the smallest inverter in the world, with dimensions of 23.9 by 23,2 by 404 millimeters. With an AC output power of 350 W, the volume of 0.19 liters corresponds to a power density of 1.6 kW per liter. By comparison, the IQ 7A microinverter from a market leading supplier delivers 349 watts with a volume of 1.12 liters, corresponding to 0.31 kW per liter – not even one-fifth of the Solarnative device. Despite the extreme size reduction, the efficiencies are quite comparable, at 96.0 percent for the Power Stick and 96.5 percent for the IQ 7A. This reduction in construction volume was necessary because Solarnative wants to offer its inverter not only as an external device (Power Stick 350-a) but also as a version for module manufacturers (Power Stick 350-i) for integration into the module frame. The Power Stick is recommended for modules between 330 and 440 W. "Solar applications are putting higher demands on power devices for thermal, reliability, and power density, and silicon-based power conversion is not keeping pace," said Alex Lidow, CEO of EPC. "We are delighted to work with Solarnative to implement GaN as 3rd generation of semiconductors into their microinverters, allowing customers to simplify installation for easier microinverters and green energy adoptions."

Small Cell Repeater Power Solution
  • Product Release
  • 2022-11-09

ABB Power Conversion is helping to energize the rollout of 5G repeaters with solutions like its RP450 power system. The all-in-one solution meets the power density, footprint, and availability needs of 5G repeaters, helping to extend network coverage. The pole-mounted RP450 power system is specifically designed for 5G repeater applications. It consists of an integrated CLP-series rectifier, six-position DC distribution, surge protection, and an AC input breaker within an IP65-rated, 6.2-inch wide by 5-inch deep by 18.5-inch tall NEMA 3R enclosure. The power system features an AC service-rated 240-volt (V) AC input and -48 VDC output and can provide peak efficiencies of over 90%. It can be configured in a variety of ways, including with single or redundant rectifier options and with fuse and breaker distribution options. There is also a connection for an additional battery to be added in the future, should a user's power needs change. The built-in AC service entrance in the RP450 helps eliminate the need for a separate AC service entrance breaker box to be mounted on the pole to serve the repeaters. Previously, this separate equipment would need to be installed on a power pole, which could result in added lease fees.

Partners Foster Sustainable Mobility
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Learn more:
infineon.com
  • Industry News
  • 2022-11-08

Disruptive technologies are driving the mobility transformation: to accelerate green and smart mobility, Infineon Technologies is collaborating with REE Automotive. The automotive technology company developed the REE modular Electric Vehicle platform which serves as a foundation for a wide variety of electric vehicles types, from robotaxis and commercial vans all the way to electric passenger shuttles. REEcorner packs critical vehicle components into a compact module positioned between the chassis and the wheel, enabling REE to build fully flat EV platforms. REE's flagship P7 EV platform is based on four REEcorners with REE's x-by-wire technology. The ultra-modular P7 EV platform offers greatest interior space for passengers, cargo and batteries as compared to vehicles with an internal combustion engine (ICE) or EVs of similar size. REE's design and technology affords auto manufacturers, delivery and logistic companies and new technology players vast design freedom allowing them to build vehicles tailored to their exact needs. "Infineon is an important forerunner in the mobility transformation. The REEcorner technology demonstrates the breadth and flexibility of our high-quality semiconductor technologies and system expertise," said Peter Schiefer, President of the Automotive Division of Infineon. "Innovative and modular EV platform designs add new options for both established and emerging industry players to further accelerate electromobility."

3D Magnetic Sensor for Vehicle Safety and ADAS Applications
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Learn more:
allegromicro.com
  • Product Release
  • 2022-11-08

Allegro MicroSystems announced the A31316 3D Hall-effect position sensor, the latest addition to the company's 3DMAG line of 3D sensors. Offered in an 4 × 4 mm body PCB-less package, this sensor is ideal for automotive safety and advanced driver assistance systems (ADAS) applications that require high levels of flexibility and reliable performance in harsh conditions such as powertrain and chassis applications, as well as industrial applications that require linear or rotary sensing. The A31316 3D Hall sensor eliminates the need for a PCB or other external components. This sensor integrates the die and capacitors in a single package to address the need for high-performance, compact position sensors that are robust to these environments. For vibration-robust designs, the A31316 pins can be welded or soldered directly to connector leadframes and can be overmolded or potted for a tight seal. These integration options reduce the ability for contaminants and vibration to affect performance and can bring new design flexibility to spaces where mechanical vibration and contamination are potential issues. Designed for both rotary and long-stroke linear applications, the A31316 maintains high angle accuracy across the full Grade 0 temperature range (–40°C to 150°C). Its flexible calibration table (33 fixed points or 22 freely placed points) enables options that can reduce the time and complexity of end-of-line calibration and minimize errors due to mechanical misalignment. The A31316 contains advanced on-chip diagnostic features to ensure reliable, safe operation.

Industrial Automation Company with Complete Motion Solution Package
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Learn more:
inovance.eu
  • Product Release
  • 2022-11-08

Inovance offers a complete motion solution package that includes motion controllers, servo drives with EtherCAT and servo motors, HMIs, and LV and MV AC drives. At SPS 2022, Inovance launched four products: the Easy Series PLC, the GL20 I/O modules, the AC703 IPC motion controller, and the SV670 servo drive. The Easy Series is a high performance, compact, EtherCAT-enabled PLC. The highly compact GL20 I/O modules are 2/3 smaller than Inovance’s previous generation product, and offer a minimum cycle time of 125 microseconds. The AC703 IPC motion controller offers a CODESYS (IEC 61131-3) programming environment, up to 32 axes control, a Webvisu server, EoE support, IIoT capability and safe shut-down (without the need for an additional UPS). Finally, the SV670 single-axis pulse servo drive offers high performance, enhanced functionality, and true flexibility. Meanwhile, alongside the product launches, Inovance offered a preview of the SV680 servo drive with advanced functional safety functions - including FSoE - and extremely high performance, and also presented the MD800 AC multidrive at SPS for the first time. While MD800 was launched late last year, it has never been seen at SPS until now due to last year’s cancellation of the show. MD800 is a compact AC multidrive that is designed to answer the call of European OEMs for reduced installation costs and smaller machine cabinets.

Responding to the Needs of Level 3 EV Charger Designers
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Learn more:
cde.com
  • Industry News
  • 2022-11-07

In response to the rapidly growing demand for higher-performance DC link capacitors for EV chargers, Cornell Dubilier Electronics (CDE) has expanded its standard-product offerings and brought to light its advanced custom capacitor capabilities. While the inverter circuitry at the heart of EV charging stations may seem familiar to design engineers, there are operational, environmental, and mechanical demands that make Level 3 EV charging stations unique. The latest designs are pushing voltages and current handling to higher levels to shorten recharge times. According to Bob Kropiewnicki, Director of Applications Engineering of CDE, "We've found that design engineers engaged in Level 3 charger projects are faced with a balancing act to mitigate significant circuit harmonics that cause heating problems. Adequate input and output filtering, strategic current paths, and reducing inductance and ESR are all concerns." Kropiewnicki continued, "All too often, the DC link capacitor is an afterthought which forces those problems to be dealt with in ways that are more complex than necessary. A better solution is to focus on the requirements of the DC link as early as possible in the design process. We are able to predict performance by using our advanced capacitor modeling based on project application conditions."

Winners of the 2022 Innovation Challenge
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Learn more:
keysight.com
  • Industry News
  • 2022-11-04

Keysight Technologies announced the winners of the 'Keysight Innovation Challenge 2022'. The six finalist teams presented their innovations to a panel of esteemed judges in Santa Rosa, Calif. "It was fascinating to see the wide range of innovative solutions each student team created when posed the same challenge: to design an IoT device that will help the world reach net zero," said Jeff Harris, Vice President of Portfolio and Corporate Marketing at Keysight, who also served as a judge and co-sponsor of the Keysight Innovation Challenge. "Each team looked at the question from a different angle and formed a unique solution. I'm excited for the future when we see this level of innovation and enthusiasm from our next generation of engineers." "We added another layer of criteria to this year's challenge, requiring that all teams were woman-led and had at least equal representation of women to men," said Renee Morad, Innovation Challenge program lead. "It was inspiring to see such diversity on the stage and to shine a spotlight on today's women in STEM who are leading their teams and leading the way for future generations of innovators."

Portable Signal Simulator/Calibrator Wins Silver in LEAP Award's "Test & Measurement" Category
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Learn more:
mtiinstruments.com
  • Industry News
  • 2022-11-03

MTI Instruments by Vitrek announces that its 1520 Signal Simulator and Calibrator is a LEAP Award winner. The 1520 – offering WiFi operation, ergonomic design, visualization and 10-hour (max) battery life – won silver in the "test & measurement" category. According to the award organizer, the LEAP (Leadership in Engineering Achievement Program) Awards "celebrate the most innovative and forward-thinking products serving the design engineering space." The prestigious award used an independent judging panel comprising OEM design engineers and academics to select stand-out products in 14 engineering categories. "We are quite pleased to win the LEAP Award in the test and measurement category," said Moshe Binyamin, President of MTI Instruments. "The 1520 combines ease of use with remote operation that technicians have been waiting for in a high precision portable signal simulator. Rugged, portable and versatile, it's also ideal for use in avionics applications where it brings laboratory-grade signal accuracy directly onto the flightline and to the test-cell." The 1520 Portable Signal Simulator/Calibrator is NIST-traceable signal source providing laboratory-grade precision for testing and calibrating sensor-driven systems in the field. It features a glove-friendly, two-handed controller and a color touchscreen for generating and viewing high-precision graphical waveforms. Capable of remote control via a WiFi-connected smartphone or tablet, one technician can use the 1520 to conduct tests that would otherwise require two techs to perform.

Software and Hardware Ecosystem for Motor Control
  • Product Release
  • 2022-11-03

Toshiba Electronics Europe has introduced MCU Motor Studio, bringing together PC-based design tools, microcontroller firmware, and low-cost evaluation hardware to accelerate time to market for motor-control applications hosted on Toshiba TXZ+™4A microcontrollers (MCUs). The MCU Motor Studio firmware suite supports all common energy-efficient motor control strategies including sinewave commutation and field-oriented (vector) control (FOC), sensorless or with precise-position sensing. There is a choice of single-shunt and three-shunt current detection, and support for PWM frequencies up to 156kHz. The firmware caters for all popular motor types, including brushless DC (BLDC) and permanent-magnet synchronous motors (PMSM). Switched reluctance motors (SRM) and asynchronous AC motors are also supported. Users can control up to three independent motor channels with a single MCU, depending on the variant selected. The TXZ+™4A Series, based on the Arm® Cortex®-M4 core, comprises the M4K and M4M Groups, which enable motor control even with low-cost 64-pin MCUs. Dedicated motor-control features provided on-chip include a hardware vector engine, high-resolution advanced encoder for servo motors, and self-diagnostics that simplify meeting functional-safety standards such as IEC 60730 class B. The firmware suite provides selectable functionality that lets users quickly configure controls such as zero-current-point detection, initial motor-position detection, and commonly used stop controls including rapid braking. Further functions include magnetic-field stall recovery, load-dependent speed reduction, advanced rotor control with sensorless precise positioning, and linear motion control with sensor-based precise positioning.

Wide-Bandgap Power at Silicon Cost – YESvGaN Project
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Learn more:
iisb.fraunhofer.de
  • Industry News
  • 2022-11-03

Can we contribute to the worldwide energy challenge by maximizing the efficiency in power conversion at a low cost? The answer is: YESvGaN! So, the goal of the YESvGaN consortium is to create a new class of vertical power transistors based on gallium nitride (GaN), so-called vertical GaN membrane transistors. These power devices combine the efficiency of wide-bandgap (WBG) semiconductors with the lower cost of the established silicon semiconductor technology. Within YESvGaN, the development of the required new technology, all the way from wafer to application, is covered. Since the project launched on May 1, 2021, impressive developments have been made by the project consortium, consisting of 23 European partners. Vertical device demonstrators with FinFET architectures and Schottky diodes – being important building blocks for a novel vertical membrane transistor technology – have been created successfully. Also, vertical layer stacks have been grown on silicon and sapphire with a diode breakdown voltage exceeding 500 V. This is a major step to reach the overall project goal of 1200 V blocking voltage on low-cost silicon or sapphire substrates. As a result, the market for future high-performance applications, e.g., in the automotive industry, could be accessible for the GaN semiconductor material.

15 Watt DC/DC Converters (DIP-16)
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Learn more:
tracopower.com
  • Product Release
  • 2022-11-02

The Traco TEL 15N & TEL 15WIN are two series of isolated 15 Watt converters which come in an compact DIP-16 metal package. The design purpose of these series was to miniaturized low power DC/DC converters to the maximum without sacrificing high efficiency. They solidify the new standard for power density with 4.51 W/cm3 and effectively double the power density compared to 15 Watt converters in DIP-24 packages. The TEL 15N and TEL 15WIN offer wide 2:1 or 4:1 input voltage ranges respectively and feature a high efficiency of up to 88% which enables an operation temperature of up to +55°C at full load and up to 85°C with 50% load. For extended temperature requirements, a version with a fully integrated heatsink casing is available allowing the converter to operate up to +70°C without derating. The converters also have an internal input filter to comply with conducted emission standard EN 55032 class A. Overall they feature an economical solution for space critical and cost sensitive applications in instrumentation, IT and industrial electronics.

Long-Term Silicon Carbide (SiC) Supply Agreement
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Learn more:
qorvo.com
  • Industry News
  • 2022-11-02

Qorvo and SK Siltron CSS, a semiconductor wafer manufacturer, announced they have finalized a multi-year supply agreement for silicon carbide (SiC) bare and epitaxial wafers. This agreement will promote domestic semiconductor supply chain resilience and a greater ability to support the rapidly rising demand for advanced silicon carbide solutions, specifically in the automotive market. This agreement will also provide end-user customers a level of protection and confidence as customers adopt Qorvo's industry leading Gen 4 SiC FET solutions. SiC devices are more efficient at handling high powers and conducting heat than traditional silicon. When used in electric vehicle (EV) system components, this allows for a more efficient transfer of electricity from the battery to the motor, increasing the driving range of an EV by 5% to 10%.

Henrik Tölander Appointed as COO
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Learn more:
swegan.se
  • People
  • 2022-11-01

SweGaN AB announces it has added a role to its executive team. Newly appointed Chief Operating Officer, Henrik Tölander, joined SweGaN on October 31st. The management role supports the company's ambitious growth strategy to serve explosive global market demand and follows the company's recently completed Series A financing round. "Bringing extensive experience from the manufacturing industry, including nearly a decade at  Fortune 500 company Siemens, Henrik will bring valuable competence for cultivating and executing the next phases of SweGaN's manufacturing road map and expansion plans," says Jr-Tai Chen, "Ted", CEO at SweGaN. "In Henrik I believe we have secured the industry and leadership experience needed to scale SweGaN manufacturing to the next level. On behalf of the SweGaN team, I am pleased to welcome him on board." Henrik Tölander, COO at SweGaN, "Joining SweGaN at this key juncture is an exciting opportunity as SweGaN growth plans target new production facilities and team expansion to deliver large quantities of epi-wafers annually to supply a demanding and sophisticated semiconductor market. "I am inspired by what CEO and co-founder Ted Chen and the skilled team at SweGaN have achieved in developing world-class materials and a high-profile international investor portfolio. I look forward to working together in establishing SweGaN as a major global player – an industry leader in pole position to take a major share of the semiconductor materials market.

High-Surge-Rating SMD TVS Diodes
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Learn more:
littelfuse.com
  • Product Release
  • 2022-11-01

Littelfuse announced the SMTOAK2 TVS Diode Series. Many of today's high-power, high-surge-rating TVS diodes are only available in axial leaded packages. The compact, 2 kA 8/20 µs rated, surface-mount package SMTOAK2 TVS Diode Series allows electronics designers to achieve a more robust transient voltage, overvoltage protection, and lightning protection system while using less printed circuit board (PCB) space. "Global trends and regulatory requirements for higher efficiency power supplies, high-current and high-speed MOSFET/IGBT designs are increasingly in demand," said Ben Huang, Senior Product Marketing Manager, at Littelfuse. "These fast-switching designs need protection against inductive kickback. By using the high-power SMTOAK2 TVS Diode Series, designers can achieve high reliability and robustness while reducing the required board space and assembly time."

Silicon Carbide Semiconductor Technology Supply for Electric Vehicles
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Learn more:
wolfspeed.com
  • Industry News
  • 2022-10-31

Jaguar Land Rover and Wolfspeed announced a strategic partnership to supply Silicon Carbide semiconductors for next generation electric vehicles, delivering increased powertrain efficiency and extended driving range. Under its 'Reimagine' strategy, Jaguar Land Rover is transforming to an electric-first business, to become carbon net zero across its supply chain, products, services, and operations by 2039. Wolfspeed's Silicon Carbide technology will be used specifically in the vehicles' inverter, managing the transfer of power from the battery to the electric motors. The first Range Rover vehicles with this advanced technology will be available from 2024, and the new all-electric Jaguar brand the following year. The partnership builds on Wolfspeed's existing relationship with the race-winning Jaguar TCS Racing team competing in the ABB FIA Formula E World Championship, where its advanced Silicon Carbide technology has been used to accelerate on-track efficiency and performance. The agreement is the latest in Jaguar Land Rover's programme of establishing strategic partnerships for its future modern luxury vehicles: in February 2022, Jaguar Land Rover announced a partnership with NVIDIA focused on software-defined, advanced automated driving systems for next-generation vehicles starting in 2025. Wolfspeed President and CEO, Gregg Lowe, said: "Wolfspeed is proud to partner with Jaguar Land Rover, supporting its bold commitment to electrify its iconic brands by using Silicon Carbide's superior performance, efficiency and range. The energy efficiency of Silicon Carbide will play an essential role as Jaguar Land Rover pursues its own zero carbon goals, and as the world transitions to an all-electric transportation future."

MOSFET Family with an Integrated Fast Body Diode
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Learn more:
infineon.com
  • Product Release
  • 2022-10-27

To address contemporary market needs for improved form factors and energy-efficient products, Infineon Technologies has developed a CoolMOS PFD7 high-voltage MOSFET family, setting a new benchmark in 950 V superjunction (SJ) technology. The 950 V series combines performance with ease of use and features an integrated fast body diode ensuring a robust device and in turn reduced bill-of-material (BOM). Tailored to ultrahigh-power density as well as the highest efficiency designs, the products are primarily addressing lighting systems, as well as consumer and industrial SMPS applications. The products are suitable for flyback, PFC, and LLC/LCC designs, including half- or full-bridge configurations making commutation robust and reliable. By integrating an ultra-fast body diode with ultra-low reverse recovery charge (Q rr), they offer hard commutation ruggedness and reliability. This makes it the most robust SJ MOSFET in this voltage class, enabling usage across all topologies in the targeted applications. In addition, significantly reduced switching losses (E OSS, Q OSS, and Q g) improve efficiency in hard- and soft-switching applications and result in up to 4°K lower MOSFET temperature compared to 900 V CoolMOS C3 SJ MOSFET. The products improve light- and full-load PFC efficiency by more than 0.2 percent while matching the performance with regards to LLC efficiency, contributing to a greener world.

AC/DC Power Supply Series Provides up to 130W Output
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Learn more:
recom-power.com
  • Product Release
  • 2022-10-27

Expanding their AC/DC range, the RECOM RACM130E-K series in a 2"x4" footprint is now available with 130W peak output power from a wide 85-264Vac input. Tightly regulated single outputs available are 12V, 15V, 24V, 36V and 48VDC. Safety certifications include 2MOPP/250Vac medical for 'B' or 'BF' applications to IEC/EN/ANSI/AAMI ES 60601-1, as well as IEC/EN 62368-1, IEC/EN 60335-1 and IEC/EN 61558-1 for industrial, test and measurement, IT and household use, all to 4000m altitude. On-board dual input fusing is included. EN 55032/35 'Class B' EMC emissions limits are met with a good margin and the parts are suitable for installation in surge Class 3 and Over-Voltage Category OVC III environments. Efficiency is particularly high at 90% typical, depending on variant and is maintained down to low loads for ErP compliance, while no-load losses are less than 200mW at 230Vac. Operating temperature range is -40°C to +90°C with derating. The RACM130E-K series is available as an open card with 2"x4" footprint and with an optional metallic enclosure and will suit a wide variety of cost-sensitive applications, where a high specification is also required.

Shielded Transformers for Ultrasonic Applications
  • Product Release
  • 2022-10-27

TDK Corporation presents the B78302A* series of compact EPCOS transformers with E5 cores for ultrasonic applications. It comprises three types with transformation ratios between 1:1:10.8 and 1:1:15.3. Depending on the type, the transformers in SMD design offer inductance values between 2 mH and 4 mH and are suitable for frequencies from 50 kHz to 300 kHz. The AEC-Q200 qualified components have very compact dimensions of only 8.1 x 7.0 x 7.0 mm and are shielded by a counter-winding for better interference suppression. The permissible temperature range is between -40 °C and +125 °C. The transformers are used in ultrasonic applications for optimum impedance matching between the driver IC and the ultrasonic transmitter or receiver. Typical applications include parking aids, industrial robots, drones and logistics robots, Automated Guided Vehicles (AGV) and systems for level measurement.

Next-Generation GaN E-Mobility Technology
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Learn more:
visic-tech.com
  • Industry News
  • 2022-10-26

VisIC Technologies and KYOCERA AVX Salzburg announce the expansion of their collaboration. The partners are combining their strengths in packaging, assembly, and GaN wafer technologies with the aim of providing high current components for high-voltage applications such as charging and e-drivetrain. The collaboration expansion aims to fulfill the automotive industry demands for reliable and highly efficient power solutions that will save on EV costs. With its thermal resistance, discrete GaN devices and half-bridge modules will be essential for future On-Board-Chargers (OBC) and traction inverters, thus optimizing weight, size, costs, and driving range. Based on VisIC's 2nd generation, lowest RDS (on) D3GaN (Direct Drive D-Mode) switches, the power module, which will provide power density and performance, has already been adopted for the next generation inverter sample of a major 1st tier automotive manufacturer. In addition to these collaboration developments, the companies have also achieved an approach to high-voltage battery disconnection, based on GaN power switches, through effective cooperation in a very short timeframe. With the fastest switching time, the current and, therefore, thermal stress of the battery and board net, can be limited. This design will be available for lead projects this year.

Support for Planar Magnetics in Power Supply Design Tool
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Learn more:
power.com
  • Product Release
  • 2022-10-25

PI Expert now features a planar magnetics builder that generates an application-specific planar transformer design complete with printed circuit board (PCB) manufacturer-ready documentation and Gerber files. The latest version of PI Expert now also includes support for Power Integrations' entire InnoSwitch3 flyback switcher IC family. Trevor Hiatt, director of channel marketing at Power Integrations said: "Planar transformers facilitate low-profile flyback power supplies. With our new planar magnetics builder, designers can incorporate a sophisticated low-profile transformer in minutes. No other design tool can do this." The magnetics designer function in PI Expert provides full planar transformer information including stack specification, vertical and horizontal PCB construction, trace parameters, current density information and layer resistance. The tool automatically incorporates user-specified creepage and clearance distances necessary to meet safety isolation standards. An intuitive GUI provides vertical and horizontal stack construction and a bird's eye view for all layers. The tool also outputs detailed manufacturing information of the planar solution, enabling users to go directly from design to fabrication. The tool provides a comprehensive database of planar cores and components to simplify design and can also accept custom core geometries. PI Expert automatically optimizes the planar transformer design to match the power supply specification, incorporating additional winding layers and adjusting trace geometries as appropriate.

Global Distributor of the Year
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Learn more:
mouser.com
  • Industry News
  • 2022-10-24

Mouser Electronics is very pleased to announce it has received the 2022 Global Distributor of the Year - Pinnacle Award from Qorvo. Chosen by Qorvo's executive sales team, the award recognizes Mouser for its role in strengthening Qorvo's leadership in cellular and broadband networking, the Internet of Things, and defense and aerospace applications. "We are pleased to congratulate Mouser Electronics and express our gratitude for their hard work in supporting Qorvo's growth throughout the world," said Rodney Hsing, Sr. Sales Director of Major Defense Accounts and IDP Global Distribution at Qorvo. "This award recognizes the important role Mouser has played as our lead internet channel partner, helping us to grow market share in key technology areas, ensuring that all engineers have access to our exceptional connectivity and power devices." "We are truly grateful for our ongoing partnership with Qorvo, and we are honored to receive the Global Distributor of the Year award for the second time," said Jeff Newell, Senior Vice President of Products at Mouser Electronics. "This award reflects the committed efforts of our team in efficiently promoting and distributing Qorvo's solutions to our global customer base." Mouser was previously named Global Distributor of the Year by Qorvo in 2018. Together, Mouser and Qorvo deliver a range of solutions for next-generation applications, including 5G, Wi-Fi, ultra-wideband technology, and power management.

Bob Feng Appointed VP & GM of China
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Learn more:
empowersemi.com
  • People
  • 2022-10-24

Empower Semiconductor is pleased to announce the appointment of Mr. Bob Feng as Vice President & General Manager of China to support the growing demand for Empower's IVR and advanced E-CAP silicon capacitor products in the Greater China region. Mr. Feng has over sixteen years of experience in semiconductor sales, with a strong emphasis on power management and customer service in China and the Asia Pacific market. His background and network of relationships will prove to be invaluable as Empower continues its aggressive growth goals in the region. "Mr. Feng will be joining the company at a time of great growth and expansion, as we begin to further expand our product portfolio, including the recently announced IVR and E-CAP technology families," said Steve Shultis, Senior Vice President WW Sales and Marketing at Empower Semiconductor. "Bob's experience building high-performing teams of executives, along with his expertise in growing technology companies and developing next-generation products will be a vital asset to Empower as we expand our growth in the region." Prior to joining Empower, Mr. Feng was senior director of sales and country manager at Power Integrations.  His earlier experience includes senior sales roles focusing on the China region at Samsung Electronics and STS Microelectronics.  He earned a bachelor's degree in automation from Xidian University and currently working on the completion of an EMBA at Xi'An Jiaotong University.

Ranbir Singh Inducted into Engineering Hall of Fame
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Learn more:
navitassemi.com
  • People
  • 2022-10-24

Navitas Semiconductor announced that Dr. Ranbir Singh, EVP of the company's GeneSiC business unit, has been inducted into the North Carolina State University's Department of Electrical and Computer Engineering (ECE) Alumni Hall of Fame. The NCSU ECE Alumni Hall of Fame celebrates the accomplishments of outstanding graduates who have used their education to excel in a profession, career, or service. Dr. Singh's induction for this prestigious accolade was based on his pioneering career in high-performance, high-reliability silicon carbide (SiC) semiconductors for high-power, high-voltage applications. This includes several innovation and R&D awards, plus the 2004 founding of GeneSiC Semiconductor, a company that went on to become an industry leader in SiC technology, acquired by Navitas in August 2022. During the induction ceremony on 21st October, Dr. Singh commented: "It is both an honor and a privilege to be inducted into the Hall of Fame. I look back fondly on my time at the University and within the ECE Department, which formed a solid foundation for my work in power electronics and the development of the advanced technologies on which the success of GeneSiC was built." Dr. Singh holds a Bachelor of Technology, Electrical Engineering from the Indian Institute of Technology, Delhi, and both a master's and PhD in Electrical Engineering – Power Semiconductors, from NCSU. He also holds over 40 US patents and has presented and published over 200 journal and conference papers.

Packaged GaN Family for Flexible Design of High-Power Density Applications
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Learn more:
epc-co.com
  • Product Release
  • 2022-10-20

EPC expands the selection of off-the-shelf GaN FETs in thermally enhanced QFN packages with the introduction of the 150 V EPC2308 designed for motor drive in power tools and robots, high density DC-DC from/to 80 V-100 V for industrial applications, synchronous rectification to 28 V – 54 V for chargers, adaptors and power supplies, smartphones USB fast chargers, and in solar optimizers and microinverters. The EPC2308 GaN FET offers a super small RDS(on), of just 4.9 mOhm typical, together with very small QG, QGD, and QOSS parameters for low conduction and switching losses. The device features a thermally enhanced QFN package with footprint of just 3 mm x 5 mm, offering an extremely small solution size for the highest power density applications. The package offers wettable flanks to simplify assembly and inspection and exposed top and ultra-low thermal resistances to optimize thermal dissipation through heatsink for cooler operations. The EPC2308 is footprint compatible with the previously released 100 V, 1.8 mOhm EPC2302 and the 100 V, 3.8 mOhm EPC2306. "The EPC2308 combines the advantages of 150 V GaN with an easy to assemble and thermally enhanced QFN package," said Alex Lidow, CEO and co-founder of EPC. "Designers can use our family of packaged GaN FETs to make smaller and lighter weight battery-operated BLDC motor drives for robotics and power tools, higher efficiency 80 V input DC-DC converters, and higher efficiency USB chargers and power supply".

All-in-One LIN Driver Propels Relay Window Lifters
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Learn more:
melexis.com
  • Product Release
  • 2022-10-20

Melexis' LIN pre-driver IC for relay DC motors offers a combination of high power, compactness, and attractive pricing. The MLX81160 is the latest addition to the company's Gen3 family of compatible embedded motor drivers. Its 48 KB of memory (16 KB ROM for the included LIN protocol and 32 KB Flash for the application software) is suitable for applications like window regulators. Melexis has just introduced the MLX81160. By leveraging high-voltage silicon-on-isolator (SOI) technology, this LIN-based pre-driver exhibits operational robustness for 12 and 24 V applications. This device is the successor to the company's MLX81150 LIN slave device for relay and DC motor control. The key uses are window lifters and sunroof regulators with relay DC motors, as well as small DC motor applications with external PN-MOSFET power regulation. AEC-Q100 qualified, the MLX81160 incorporates all the essential functional elements for motor driving within a single chip. These include a LIN interface, an embedded microcontroller unit, 6x PWM drivers, 3x high-voltage I/Os, and more. Extra I/Os allow connecting a dedicated 4-wire latch for motor indexing. Melexis will soon launch a new 4-wire latch: the innovative features of the MLX92352 will provide the ultimate flexibility. Together with the MLX81160 it is a full Sense & Drive solution. The MLX81160 is embedded into a compact 4 mm x 4 mm QFN24 package.

Multipurpose Series Provides Either DC/DC Converter or AC/DC Power Supply
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Learn more:
greenwattpower.com
  • Product Release
  • 2022-10-20

Powerland's "Caesar" series 360W AC/DC module is featured with high-power density, high efficiency, and high reliability. This series has a very low-profile design at only 25.5mm. The "Caesar" series supports natural cooling without a fan and 1+1 redundancy with dual current-sharing modes integrated analog and digital current-sharing. It is best suitable for system applications need high reliability, high-power density, and high efficiency, such as industrial, LED displays, robotic, electric power, and railway applications. With a power density of 27W/inch3, the Caesar Series have two different configurations for customers to choose from: 93 x 98 x 27.5 mm or 182 x 48.6 x 27.5 mm.

Smart Motor Module Designed Meets Reduced PCB Layout Requirements
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Learn more:
aosmd.com
  • Product Release
  • 2022-10-19

Alpha and Omega Semiconductor introduced an extension to its compact Smart Motor Module (SMM) family. Available in an ultra-compact, thermally enhanced 3mm x 3mm QFN-18L package, the integrated AOZ9530QV SMM is a half-bridge power stage with a slew of features and protections that simplify motor drive designs. The AOZ9530QV SMM is suitable for use in a large number of BLDC fan applications ranging from PC and server fans, seat cooling and home appliances. The device features multiple advanced protection functions that include short circuit protection, over temperature protection, Vcc UVLO and bootstrap UVLO. With an input voltage up to 28 V and supporting high current up to 7 A, the AOZ9530QV has a wide operating (-40°C to +125°C) ambient temperature range and offers 100 percent pulse-width modulation (PWM) duty operation support. It also provides adjustable gate drive sink and source current control that gives designers the ability to minimize EMI while maximizing power efficiency. These features and others make the AOZ9530QV an optimal power stage solution for Brushless DC (BLDC) motor drives. A single module would be used for single phase applications, two AOZ9530QV SMMs would be used for a H-Bridge motor drive, and three SMMs are needed for 3-Phase designs.

Cooperation on Wireless Charging Solutions
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Learn more:
rohm.com
  • Industry News
  • 2022-10-19

ROHM Group company LAPIS Technology, together with Global Antenna manufacturer Shanghai Amphenol Airwave (subsidiary of Amphenol Corporation), have established a cooperative framework. The purpose: providing wireless charging solutions for hearable and wearable devices that are trending towards greater compactness and sophistication. Advanced antenna customization technology allows Amphenol to provide compact antennas that meet the needs for smaller, thinner housings in the hearable and wearable device markets. At the same time, LAPIS Technology provides compact high performance wireless power supply ICs that leverage wireless digital and analog circuit technologies cultivated over many years through LSI development. This time, with technical support provided by LAPIS Technology, Shanghai Amphenol Airwave Communication Electronics, an operation within Amphenol Corporation, will provide a wireless charging solution that solves design constraints regarding housing along with issues such as increased development workforce. This reference design – that matches power transmission and reception centered on the antenna and wireless charger IC – contributes to rapid device development by providing one-stop support to global customers for achieving wireless charging functionality. Going forward, both companies will continue to combine their technologies to add value to compact wireless charging solutions – including the use of NFC communication and other functions required by the market.

650V E-Mode GaN HEMT Product Family
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Learn more:
innoscience.com
  • Product Release
  • 2022-10-19

Innoscience Technology announced a full range of 650V E-mode GaN HEMT devices. 190m?, 350m? and 600m? RDS(on) devices in industry-standard 8x8 and 5x6 DFN packages join previously-announced 140m?, 240m? and 500m? RDS(on) parts, creating a significant portfolio of available devices. Importantly, the 650V HEMTs are all qualified to JEDEC standards for chip and package. More, the Innoscience devices have also passed Dynamic High Temperature operating life test (DHTOL) reliability testing according to JEP180, which is the newly-released JEDEC's guidelines dedicated to GaN technology. In addition, Innoscience's 650V HEMT (InnoGaN) have undergone accelerated life tests beyond 1000V that give lifetime calculations of 36 years at 80% of the rated voltage (520V; 150°C; 0.01% failure rate). The devices also feature very good drain source voltage transient (VDS, transient) of 800V for non-repetitive events with an extended pulse time up to 200µs and a pulsed (VDS, pulsed) characteristics for repetitive pulse up to 100ns of 750V for the 190m? RDS(on) parts. These are best-in-class characteristics. Moreover, similarly to the 650V products, the 190m?, 350m? and 600m? RDS(on) devices all feature a strong ESD protection circuit embedded in the die to ease mass production assembly of these device in package and easy handling.

Noise Analyzer Adopted by Samsung Foundry
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Learn more:
keysight.com
  • Industry News
  • 2022-10-18

Keysight Technologies announced that Samsung Foundry has adopted the Keysight E4727B Advanced Low-Frequency Noise Analyzer (A-LFNA) for measurement and analysis of flicker noise (1/f noise) and random telegraph noise (RTN) in semiconductor devices. Samsung Foundry customers targeting the silicon manufacturer's most advanced technologies will have access to process design kits (PDK) that include the most accurate simulation models, based on A-LFNA data, for design and verification of radio frequency (RF) and analog circuits. "Accurate low-frequency noise measurement and modeling are increasingly important in development of PDKs, especially for the advanced technology nodes at 5, 4, and 3 nanometers," said Charles Plott, Director of Product Management for PathWave Software Solutions at Keysight. "Samsung Foundry's use of our A-LFNA enables design engineers with the highest quality PDKs for circuit design to achieve first-pass success and reduce time-to-market." Keysight E4727B A-LFNA is a turn-key solution that measures the low-frequency noise of semiconductor devices. The PathWave A-LFNA Measurement and Programming software is built on top of the PathWave WaferPro (WaferPro Express) measurement platform. Engineers manage and automate the full wafer-level device characterization workflow in a measurement system that is both flexible and expandable. Next, engineers import the measurement data from the system into Keysight's PathWave Device Modeling (IC-CAP) and PathWave Model Builder (MBP) software to extract device models for PDK development, which ensures highly accurate RF and analog low-noise circuit design and simulation.

Power Components for Bloom Energy's Electrolyzer and Energy Server
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Learn more:
infineon.com
  • Industry News
  • 2022-10-18

California-based Bloom Energy has chosen CoolSiC MOSFETs and CoolSiC diodes from Infineon Technologies to process electrical power in Bloom's Energy Server, the company's fuel cell offering, and the Bloom Electrolyzer. Bloom Energy's fuel cells and electrolyzers address climate change and offer multiple pathways to zero carbon emission. They enable a combustion-free method for generating resilient, sustainable and predictable energy. The individual solid oxide fuel cells (SOFC) of the energy platform run on natural gas, biogas, or hydrogen. With high electrical efficiency, the system provides a continuous power supply that is robust to grid failures and weather conditions from -20°C to 45°C. "The global reduction of CO 2 emissions and a successful energy transition are two of the greatest challenges to stop climate change on our planet," said Dr. Peter Wawer, President of Infineon's Industrial Power Control Division. "At Infineon, we are convinced that hydrogen is an excellent alternative to CO 2-emitting energy sources, making it an important tool in the decarbonization of the energy industry and the automotive industry. We are therefore very pleased to seeing our CoolSiC devices make a major contribution to the optimization and further development of hydrogen technologies."

AC-DC Power Supply Thermal Management Patent
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Learn more:
lambda.tdk.com
  • Product Release
  • 2022-10-18

TDK Corporation is pleased to announce that TDK-Lambda UK's Power Supply Apparatus patent application has been approved for grant by the UK Intellectual Property Office. The thermal strategy covered by the patent leads to power supplies that are flexible in their cooling requirements, keep audible noise to a minimum, and are easy for customers to integrate into their systems. There are two established techniques for overcoming the thermal management challenge. One method is to increase unit dimensions to allow for better airflow. Driving up efficiency is another technique, thereby minimising internal heat dissipation. Increasing unit size is often unacceptable, as units are seen as uncompetitive and excessively large, making them difficult to integrate into systems. Also, as power supply efficiencies increase, the law of diminishing returns applies, and incremental improvements become excessively expensive. Above all, both techniques come with an increased bill-of-material cost. The thermal management strategy used in manufacturing the CUS400M series of AC-DC power supplies, covered by the patent, overcomes these issues by utilising existing system metalwork for cooling. Through careful PCB design and the use of thermally conductive plastics, the heat generated by the electronic components is spread and transferred into the system chassis. This means that good thermal performance can be achieved with substantially lower airflow, resulting in reduced audible noise from the slower fan.

Synchronous Buck Controller Handles Extreme Step-Down Ratios
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Learn more:
st.com
  • Product Release
  • 2022-10-18

With compact dimensions and an input-voltage range from 6V to 75V, STMicroelectronics' L3751 synchronous buck controller serves different applications from industrial equipment to battery powered light electric vehicles. The 3.5mm x 4.5mm controller is also suited to use in telecom and networking equipment that feature commonly used 24V and 48V buses. Having minimum on-time duration of 40ns, the L3751 can support an extremely low duty cycle thereby permitting a large step-down ratio. This allows powering low-voltage devices directly without intermediate conversion, which helps simplify circuit design and lower bill-of-materials (BOM) costs. The device integrates a 7.5V supply for the gate drivers. In addition to having a wide supply-voltage range, the L3751 has 100V-tolerant inputs that allow operation in harsh electrical environments. The switching frequency is adjustable from 100kHz to 1MHz, giving designers flexibility to optimize circuit size, performance, and cost, through selection of the external MOSFETs and passive components. To enhance efficiency and minimize ripple, the L3751 operates in diode-emulation mode and with pulse skipping at light loads. The L3751 provides extensive protection functions, including thermal protection, input under-voltage lockout, constant current protection with hiccup mode, and programmable current sensing. There is also an external Enable pin and open-collector power-good indicator.

Polymer Hybrid Capacitors Suitable for Increasing Capacitance Requirements
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Learn more:
rutronik24.com
  • Product Release
  • 2022-10-17

SAMWHA Electronic's YM and YL series include two conductive polymer hybrid aluminum electrolytic capacitors, expanding the portfolio. The products feature higher capacitance at operating temperatures of up to +125 °C, making them suitable for a wide range of industrial applications. With the addition of the YM version to the surface-mountable YH series and the radial YL series, SAMWHA is meeting the increased demand for higher value ranges of ripple current and capacitance. The capacitors have a voltage range of 25 V to 63 V and a capacitance of 47 µF to 680 µF. The tolerance here is ±20 % at 120 HZ (20 °C). In addition, the service life of the component is 4,000 hours and can be used without problems over a wide temperature range from -55 °C to +125 °C.

European Business Group awarded by Siemens Mobility with Supplier Award "Moving Beyond"
  • Industry News
  • 2022-10-17

Mitsubishi Electric's Semiconductor European Business Group has been awarded by Siemens Mobility with the supplier award in the prestigious category "Moving Beyond". The decisive factor for winning this award was the development of a 3300 V Silicon Carbide Power Module to enable sustainable railway vehicle solutions for Siemens Mobility. Michael Peter, CEO of Siemens Mobility GmbH, explained during the award ceremony that the implementation of Mitsubishi Electric's 3300 V Silicon Carbide Power Semiconductor Module reduces the overall energy consumption of a train by 10%. "Mitsubishi Electric is setting new benchmarks with its Silicon Carbide technology and making an important contribution to the decarbonization of Siemens Mobility's rail vehicles", Michael Peter added. The award ceremony took place during the Innotrans trade fair on September 23, 2022 in Berlin. Power semiconductors based on Silicon technology are used in railway vehicles from trams to high-speed trains for a long time. Silicon Carbide is continuously replacing conventional silicon power semiconductors in medium- and high-power applications. Silicon Carbide is a technology which enables manufacturers already today to develop highly efficient traction inverters, that are required for Hydrogen and battery driven trains, which replace old Diesel locomotives on not electrified railway lines. The regional train Mireo Plus B of Siemens Mobility is already contributing to this in the Baden-Württemberg town of Ortenau. Our society faces the crucial task of accelerating decarbonization worldwide in all areas of transportation with urgency. With its Green Deal, the European Union has committed to becoming the first climate-neutral continent by 2050 with intermediate targets by 2030. This requires a high degree of electrification and the substitute of fossil fuels. This continuous transition must already take place today. Strong partnerships of manufacturers and suppliers along the entire supply chain are needed to realize this transition. As a supplier of power semiconductors as key components, it is Mitsubishi Electric Semiconductor´s utmost objective to enable customers to bring efficient and sustainable solutions and products to market.

Call for Proposals: SEMIKRON Innovation Award and Young Engineer Award 2023
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Learn more:
ecpe.org
  • Industry News
  • 2022-10-14

The 'SEMIKRON Innovation Award' and the 'SEMIKRON Young Engineer Award' is given for outstanding innovations in projects, prototypes, services or novel concepts in the field of power electronics in Europe, combined with notable societal benefits in form of supporting environmental protection and sustainability by improving energy efficiency and conservation of resources. Both prizes have been initiated and are donated by the SEMIKRON Foundation which is awarding the prizes in cooperation with the European ECPE Network. With the award the SEMIKRON Foundation wants to motivate people of all ages and organizations of any legal status to deal with innovations in power electronics, a key technology of the 21th century, in order to improve environmental protection and sustainability by energy efficiency and conservation of resources. The SEMIKRON Innovation and Young Engineer Prizes 2023 will be awarded in the frame of the ECPE Annual Event in March 2023 in Erding/Munich, Germany. A single person or a team of researchers can be awarded. The selection procedure for the prize winners is organized in cooperation with ECPE European Center for Power Electronics e.V.. The submitted proposals will be passed to an independent and neutral evaluation committee of experts for discussion and assessment. The expert reviewers are appointed by the SEMIKRON Foundation in agreement with the ECPE Board of Directors. The number of experts should be at least five. The evaluation committee decides on the submitted proposals by majority vote. Selection and awarding of the prize winners is done with exclusion of the jurisdiction. 

Wireless Charging Unit for EVs
  • Industry News
  • 2022-10-12

Imagine if you could charge your electric vehicle wirelessly, like the way you might use a charging pad to power up your mobile phone. Just by driving the car over a wireless charging pad and parking, your battery could be topped up as you shop or work, while you are underway or at home. Wireless charging pads are closer to reality than you might think. At K 2022, DuPont Mobility & Materials will display just such an innovative system. It is the result of a successful collaboration with VMAX New Energy, a Tier One supplier to Greater China's largest wireless charging infrastructure providers. The VMAX wireless charging system is an 11KW wireless charger for EVs, and it consists of two parts: a vehicle pad that attaches to the car's chassis, called a receiver, and a pad mounted on the ground, called a transmission plate, that is connected to a power source. A flame retardant Zytel HTN housing for the transmission plate protects the inner wireless charging system, preventing damage from drops, wheel compression, chemicals, oils, and UV rays. The 30% glass filled PPA material is designated as HTNFR53G30NH. Collaborating with VMAX, the automotive electrification team at DuPont Mobility & Materials has developed this Zytel HTN grade for high gloss and durability.

Podcast Shares Insights and Expert Opinions
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Learn more:
vicorpower.com
  • Industry News
  • 2022-10-12

Vicor launched the 'Powering Innovation' podcast, which showcases pioneering technologies by customers who developed products through visionary leadership and engineering. The podcasts explore the role power electronics plays in unlocking break-through solutions to real-world problems. The podcast features interviews with individuals from companies that are innovators in their fields. Whether the listener is an electronics design engineer, development and system engineer, the 'Powering Innovation' podcast will highlight technical solutions developed by rapidly growing companies that push the limits of conventional thinking. "Many of our customers are doing exciting things that can have a real impact on the world. From providing humanitarian relief missions, to combatting coastal erosion, to striving for low emissions electric aviation, our guests on the podcast discuss significant innovations," said Robert Gendron, Corporate Vice President, Product Development, Vicor. Powering Innovation launched in October 2022 with new episodes released monthly. Future episodes will highlight the impact power electronics is having on aerial technologies, electrification, unmanned systems, as well as supply chain issues, real-life challenges and more.

Filling the Gap Between Supercapacitors and Batteries
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Learn more:
skeletontech.com
  • Industry News
  • 2022-10-12

Skeleton Technologies is delighted to officially launch its SuperBattery, and to unveil Shell as partner. SuperBattery is an innovative technology combining the characteristics of supercapacitors and batteries. It has been developed to serve the needs of several sectors and is currently being used and/or tested in hybrid and fuel cell EVs, buses, trucks, and charging infrastructure. SuperBattery fills the technology gap in the energy storage market, delivering peak power and fast charging, and is best suited for applications below 30 minutes because of lower cost and footprint. Skeleton is joining a Shell-led consortium to offer electrification solutions for mining sites. The nine-member consortium, including Skeleton and Shell, has come together to introduce Shell's Mining Electrification Solutions for Off-Road Vehicles – announced in May 2022 as one of the 8 winners of the mining industry's 'Charge On Innovation Challenge', from over 350 entries. The solution is an end-to-end and interoperable electrification system that reduces emissions without compromising on efficiency or safety, whilst aiming to be cost competitive versus diesel-powered operations. The pilot offering combines ultra-fast charging with Skeleton's new SuperBattery, in-vehicle energy storage, and power provisioning and microgrids.

2022 Create the Future Design Contest
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Learn more:
mouser.de
  • Industry News
  • 2022-10-12

Mouser Electronics congratulates the winners of the 2022 'Create the Future Design Contest'. Intel and Analog Devices teamed with Mouser in sponsoring the 20th annual contest, produced by SAE Media Group, an SAE International Company. "Congratulations to this amazing group of winners and to all who entered this year's contest," said Kevin Hess, Mouser Senior Vice President of Marketing. "Part of Mouser's mission is fostering technical innovation, and we're proud to support this global design contest that celebrates incredible creativity and insight into the future of technology." Together with COMSOL and SAE Media Group, Mouser will award the $25,000 grand prize to a team from the Massachusetts Institute of Technology (MIT) Media Lab for their entry, FlowIO Platform, a fully integrated, miniature pneumatic development platform designed to make prototyping, innovation, and research with soft robotics quick and easy. The Create the Future Design Contest brings attention to product designs that enhance quality of life, improve the efficiency and quality of healthcare or help to reduce dependence on nonrenewable energy sources. The contest was created in 2002 by the publishers of 'Tech Briefs' magazine to help stimulate and reward engineering innovation.

SVP of Product Dieter Liesabeths
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Learn more:
visic-tech.com
  • People
  • 2022-10-11

VisIC Technologies is happy to announce that Dipl.-Ing. (TH) Dieter Liesabeths is joining the company as a Senior Vice President of Product. With over 30 years of experience in the semiconductor industry, Dieter will drive the adaptation of GaN power devices in the automotive and industrial fields. In the last 12 years, Dieter was a front-row leader in Europe to drive the conversion from Silicon to WBG, and in his new position he will lead the next generation semiconductors revolution with VisIC's D3GaN (Direct-Drive D-Mode) technology. "With his long-term experience in wide band gap power semiconductors combined with his excellent knowledge of the automotive market, Dieter is the ideal candidate to extend our management team, expand our footprint in the automotive industry, and lead the transition from Silicon to GaN for the next generation of the electrical drive train and on-board chargers," says Tamara Baksht, CEO of VisIC Technologies Inc. "I'm happy to join VisIC Technologies LTD. as SVP of Product, as VisIC's D3GaN will leverage the development of the next generation of power devices, which will make electrical drive trains more affordable while providing longer range and lower power consumption compared with other wide band gap materials like SiC", says Dieter Liesabeths, SVP Product at VisIC Technologies.

High Power Shunt Resistors with Metal Sensing Pins
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Learn more:
bourns.com
  • Product Release
  • 2022-10-10

Bourns announced an extension to its Model CSM2F Series power shunt resistor portfolio with 12 series. These series feature riveted through-hole metal sensing pins meeting the growing need for accurate positioning of voltage sense points in high current applications. These latest additions to the Bourns Model CSM2F Series shunt resistor family are engineered using the Company's electron beam-welded resistive technology that supports high power designs up to 50 watts with continuous current up to 1414 amps. In addition, these new series are constructed with a metal alloy resistive element that delivers a thermal EMF as low as 0.25 µV/K. Available in two or three tin-plated copper pin options, the new Model CSM2F Series with additional sensing pins offers a third pin option that is connected to the ground side of the circuit. The three-pin design helps reduce sensing errors by carrying the ground current on a separate path from the sensing circuit for higher measurement accuracy. The new Bourns Model CSM2F Series shunt resistor family extension also features a wide resistance range from 25 µO up to 200 µO, and a low ±50 PPM/°C TCR in the 20 °C to 60 °C temperature range. Giving designers additional flexibility, the new series are offered in three different surface finishes to match various customer environmental and soldering needs, and are available in four package sizes: 6918, 8518, 7036 and 8536 (metric).

Automotive-Grade Low-Dropout Linear Regulators
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Learn more:
taiwansemi.com
  • Product Release
  • 2022-10-10

Taiwan Semiconductor announces the availability of the TQL8xx Family of automotive-grade, low-dropout (LDO) regulators. These AEC-Q101 qualified LDOs offer manufacturers a reliable alternative source for the critically important linear regulators utilized in numerous battery-driven automotive functions, including dashboard, cluster, climate control, fuel pump and advanced driver-assistance systems (ADAS). They are also well suited for secondary supply applications where a regulated output is essential during very low-cranking voltage conditions. Designed for stability in automotive battery-connect applications, TQL8xx LDOs maintain 2% accuracy over a wide range of input voltages and a full operating temperature range of -40 to +125C. They are offered in models with fixed outputs of 3.3V or 5.V and feature typical dropout voltages of 70-80 mV @ IO=100 mA.

Merger Creates Stronger Business Partner for Customers
  • Industry News
  • 2022-10-10

Panasonic Industry Europe is announcing that Panasonic Industry Europe (PIEU) and Panasonic Electric Works Europe (PEWEU) have successfully merged as of 1st October 2022. Comments Johannes Spatz, President Panasonic Industry Europe: "Historically PEWEU and PIEU have had different roots and successful business models. Now we are bringing the two companies together to create one combined and even more successful, more resilient and more powerful company. The new Panasonic Industry Europe is ready to tackle the future challenges of new workstyle, new business and new market developments." The strategic corporate re-organisation will strengthen the position of Pansonic Industry Europe in the market and will create an even stronger business partner for its customers. All customers will benefit from the combined experience and high-quality capabilities as well as from the unified portfolios of products and services. With the concluded merger entry into the commercial register, all commercial agreements and similar legal relationships of PEWEU are fully and automatically transferred to PIEU in accordance with the applicable provisions of the German Reorganisation of Companies Act (Umwandlungsgesetz). Therefore, neither an amendment nor a novation of existing agreements is necessary for customers.

AEC-Q100 Qualified IC Load Switches for Automotive
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Learn more:
glfipower.com
  • Product Release
  • 2022-10-06

GLF Integrated Power is pleased to introduce two Automotive grade AEC-Q100 IQSmart load switch ICs. The AEC-Q100 qualified GLF1111Q and GLF1200Q are rated for a wide temperature range (Grade 1 -40°C to +125°C). The GLF1200Q features a true reverse-current blocking, which prevents a backup power source from being discharged when an input node is shorted. The GLF1200Q works all of the time regardless of on or off state. Applications for the GLF1111Q and GLF1200Q include infotainment and cluster display systems, diagnostic systems, passive entry/start systems (PEPS), customer premise equipment (CPE), face recognition systems and intelligent cockpit and autonomous driving applications. Both the GLF1111Q and GLF1200Q IQSmart devices, packaged in a SOT-23-5L, offer easy visual inspection of solder joints. Both feature integrated slew-rate control that limit inrush upon turn on, therefore minimizing the effects of voltage droop. Each load switch IC supports a wide-input voltage range (1.5V to 5.5V), meaning a single device can be used in a variety of voltage rail applications, which helps to simplify inventory management. And both are offered with an optional output discharge switch. "We have added two new devices to our IQSmart family to offer high performance in more applications," said Eileen Sun, President, and CEO at GLF Integrated Power. "The GLF1111Q and GLF1200Q address the ever-expanding, evolving range of automotive electronic systems that require a high-performance load switch with a wide-ambient operating temperature range to assure reliable, long-term operations."

Range of CFP Power Diodes
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Learn more:
nexperia.com
  • Product Release
  • 2022-10-06

Nexperia announced the latest additions to its portfolio of Clip-bonded FlatPower (CFP) packaged diodes for industrial and automotive applications. The latest additions include 32 planar Schottky diodes and eight hyperfast recovery rectifiers housed in the CFP15B package. They are available as standard and Q-types that meet AEC-Q101 automotive qualification standards. By bringing multiple versions of these devices to the market Nexperia underscores its commitment to expanded manufacturing capacity and accelerated transition to smaller, thermally optimized packages. The operating range for these planar Schottky diodes is between 30-100 V and 3-15 A. Versions optimized for low forward voltage (VF) (including the PMEG100V080ELPE/-Q) deliver low conduction losses and high efficiency for cost-efficient DC-DC converters and in reverse polarity protection applications. These diodes are also available in low leakage variants with ultra-low reverse current and best-in-class operating temperature capability, providing exceptional robustness against thermal runaway. The eight 200 V single-type recovery rectifier devices (PNE200xxEPE/-Q series) have an average forward current (IF) between 4-10 A and complement existing dual type recovery rectifiers also available from Nexperia. Using the smaller, high-power density CFP15B instead of DPAK or SMB/C packages can save up to 60% of board space, while maintaining the same level of electrical performance. This rugged package design enables longer operating times and better board-level reliability. Its optimized lead form ensures uniform solder joints for improved automated optical inspection (AOI). A solution that particularly benefits modern ADAS, EV, LED lighting or ECU applications relying on advanced high-density designs.

Site for the Production of High-power Semiconductor Modules
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Learn more:
infineon.com
  • Industry News
  • 2022-10-06

nfineon Technologies has opened a factory in Cegléd, Hungary. The factory is dedicated to the assembly and testing of high-power semiconductor modules to drive the electrification of vehicles, which is key in the improvement of the world's CO 2 balance. In addition, Infineon has invested in further production capacities for high-power modules that enable green energy, from wind turbines and solar modules to energy-efficient drives. "Infineon is pursuing a long-term growth path. Decarbonization and digitalization are driving demand for our semiconductor solutions," said Infineon's COO Rutger Wijburg. "Cegléd already has a strong track record in enabling green energy. The new manufacturing capacities will help Infineon accommodate the growing demand for electromobility applications. At Infineon, we have been investing in the future growth of electromobility from the earliest stage. Today our company is the key semiconductor enabler of the transition to green energy." The growth of electromobility is undisputed. Cars with fully or partially electrified drivetrains will account for more than 50 percent of cars produced by 2027, as per analyst forecasts. Since its founding, Infineon has shown continuous commitment in Hungary and has now invested an additional 100 million EUR in the new fab, complemented by support from the Hungarian government. Tamás Szabó, Managing Director of Infineon Technologies Cegléd Kft. said, "Infineon has been present in Hungary for more than 25 years as a manufacturer of innovative semiconductor products, building on a highly reliable regional industrial infrastructure. Over the years, Infineon has gained a strong reputation in power modules, serving customers all over the world."

Protection ICs Series provide Protection, Sensing, and Control Features in a Single
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Learn more:
littelfuse.com
  • Product Release
  • 2022-10-05

Littelfuse announced the eFuse Protection ICs product line, a series of four versatile circuit protection devices. The eFuse Protection ICs utilize an innovative design that provides a wide range of power input (3.3V to 28V) and integrated protection. In addition to overvoltage protection, these electronic fuses protect against overcurrent, short circuit, inrush current, reverse current, and overtemperature events with real-time diagnostics-all in one chip. "The eFuse Protection ICs provide today's electronics designers with significant flexibility by integrating robust circuit protection, sensing, and control in a single chip," said Bernie Hsieh, Assistant Product Manager of the Protection Semiconductor Business team at Littelfuse. "Providing a low power consumption, high accuracy current limiting circuit with quick response time makes them a win-win-win for many portable electronics and datacom applications." The eFuse Protection ICs are available in tape and reel format in quantities of 3,000 (LS0504EVT23, LS0505EVD22) or 5,000 (LS1205ExD33, LS2406ERQ23).

Silicon Carbide Substrate Manufacturing Facility in Italy
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Learn more:
st.com
  • Industry News
  • 2022-10-05

STMicroelectronics will build an integrated Silicon Carbide (SiC) substrate manufacturing facility in Italy to support the increasing demand from ST's customers for SiC devices across automotive and industrial applications as they transition to electrification and seek higher efficiency. Production is expected to start in 2023, enabling a balanced supply of SiC substrate between internal and merchant supply. The SiC substrate manufacturing facility, built at ST's Catania site in Italy alongside the existing SiC device manufacturing facility, will be a first of a kind in Europe for the production in volume of 150mm SiC epitaxial substrates, integrating all steps in the production flow. ST is committed to develop 200mm wafers in the next future. This project is a key step in advancing ST's vertical integration strategy for its SiC business. The investment of €730 million over five years will be supported financially by the State of Italy in the framework of the National Recovery and Resilience Plan and it will create around 700 direct additional jobs at full build-out. "ST is transforming its global manufacturing operations, with additional capacity in 300mm manufacturing and a strong focus on wide bandgap semiconductors to support its $20+B revenue ambition. We are expanding our operations in Catania, the center of our power semiconductor expertise and where we already have integrated research, development and manufacturing of SiC with strong collaboration with Italian research entities, universities and suppliers" said Jean-Marc Chery, President and Chief Executive Officer of STMicroelectronics. 

Reliable DC-link Film Capacitors in PV Inverters
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Learn more:
cre-elec.com
  • Product Release
  • 2022-10-05

The inverter is one of the core components of the PV system in a solar power generator set, which needs to meet different functional requirements, not only to ensure DC/AC conversion but also to guarantee the quality of the output power. Because modules are typically used in outdoor and require long-term operation with reduced maintenance, end users and designers have extremely demanding quality and reliability requirements for the components used in these equipment. As the carrier and support in the energy conversion process, film capacitors play a vital role in in every link of PV inverters, and improper selection will have a fatal impact on the stability and operating life of the equipment. Wuxi CRE New Energy Technology Co., Ltd. has been focusing on the application of film capacitors in power electronics. According to the harsh application conditions of photovoltaic inverters, the company has designed and developed a series of film capacitors with high temperature and humidity resistance, low ESR(reduce heat), high reliability and long life.

Swedish Maker of GaN-on-SiC Epitaxial Wafers to Boost Capacity
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Learn more:
swegan.se
  • Industry News
  • 2022-10-04

SweGaN has completed a Series A financing round totaling €12m. The financing was co-led by Intertech Ventures, Mount Wilson Ventures and leading European investor Atlantic Bridge, with participation by STOAF of Sweden and global fabless semiconductor leader MediaTek, forming a powerful global network from the US, Taiwan, and Europe. SweGaN's GaN semiconductor epitaxy process enables high performance and opens new applications in the multi-billion-dollar GaN-based RF and power markets. The company says that it's QuanFINE buffer-free GaN-on-SiC epitaxial wafers allow customers to reach new levels of device performance and reliability. The company has over 30 paying customers and is in qualification for a wide range of applications in Europe, the US and Asia. The investment allows SweGaN to significantly increase production capacity to meet market demand from major suppliers of 5G base stations, defence radars, low-orbit satellite communications and on-board chargers in electric vehicles. Additionally, the financing funds empower the company's plans to expand its executive team and to boost engineering, sales, and production staff. In conjunction with the investment, SweGaN also announced the appointment of Jr-Tai 'Ted' Chen as CEO. Ted co-founded SweGaN in 2014 and invented the company's proprietary QuanFINE technology as its CTO.

2023 Symposium on VLSI Technology & Circuits Announces Call for Papers
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Learn more:
vlsisymposium.org
  • Event News
  • 2022-09-29

The 2023 Symposium on VLSI Technology & Circuits will deliver a convergence of technology and circuits for the microelectronics industry as a fully merged event to maximize the synergy across both domains. The 43rd Symposium on VLSI Technology & Circuits has announced a call for papers around the theme: "Rebooting Technology & Circuits for a Sustainable Future." The six-day conference program will be held at the Rihga Royal Hotel in Kyoto, Japan, from June 11-16, 2023. The Symposium will feature advanced VLSI technology developments, innovative circuit design, and the applications they enable, such as artificial intelligence, machine learning, IoT, wearable/implantable biomedical applications, big data, cloud / edge computing, virtual reality (VR) / augmented reality (AR), robotics, and autonomous vehicles. The deadline for paper submissions to the Symposium is February 1, 2023 at 23:59 JST. Best Student Paper Award for the Symposium is selected based on the quality of the papers and presentations. The recipient will receive a monetary award, travel cost support, and a certificate. For a paper to be reviewed for this award, the lead author and presenter of the paper must be enrolled as a full-time student at the time of submission, and must indicate on the web submission form that the paper is a student paper.

Syndication Network Spanning Over 30 Distribution Partners
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Learn more:
snapeda.com
  • Product Release
  • 2022-09-28

SnapEDA is launching the SnapEDA Syndication Network. This ecosystem of over 30 distribution partners, includes electronic component distributors, printed circuit board (PCB) tool makers, and engineering media sites. The SnapEDA Syndication Network connects the electronic designers and engineers who are at the heart of the electronic industry with design content for millions of electronic components. This content helps engineers design faster, grows revenue and loyalty for distributors, and allows chip and component manufacturers to get valuable design wins. Over 80% of engineers that download SnapEDA’s design content purchase the product. This creates a competitive advantage for electronic component distributors and manufacturers that are a part of SnapEDA’s network, enabling them to win sales earlier in the design process. Global spending on digital transformation is expected to reach an all-time high of $6.8 trillion in 2023. As a result of the global pandemic and a heightened demand for self-serve component selection tools, component manufacturers are increasingly investing in digital demand generation technologies. In addition to helping engineers find the parts they need, SnapEDA uniquely translates this demand into seamless design-ins, securing the win for component manufacturers.

Oscilloscopes for Accelerated Insight
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Learn more:
rohde-schwarz.com
  • Product Release
  • 2022-09-28

Rohde & Schwarz is adding the R&S MXO 4 series oscilloscopes to its portfolio, which features a real-time update rate of over 4.5 million acquisitions per second. The 12-bit ADC in the R&S MXO 4 series has 16 times the resolution of traditional 8-bit oscilloscopes at all sample rates without any tradeoffs for more precise measurements. The oscilloscopes come in four-channel models with bandwidths of 200 MHz, 350 MHz, 500 MHz, 1 GHz, and 1.5 GHz. The R&S MXO 4 series incorporates a 12-bit ADC that operates across all the instrument sample rates with an 18-bit vertical resolution architecture for greater resolution precision. The R&S MXO 4 series also has the lowest noise and largest offset range (+/- 5V with a 500uV/div scaling) in its class. Users can see DC and other signals with more precision than with any other oscilloscope on the market. In addition to bandwidth and sample rate, memory depth is an important factor and determines whether an oscilloscope can handle a large range of troubleshooting tasks. More acquisition memory enables oscilloscopes to capture more time and retain rated bandwidth information for shorter time base settings. With a simultaneous standard acquisition memory of 400 Mpts on all four channels, the R&S MXO 4 series has up to 100 times the standard memory of its primary competition. The additional memory also provides extra measurement capability when needed.

Joining American Semiconductor Innovation Coalition
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Learn more:
menlomicro.com
  • Industry News
  • 2022-09-27

Menlo Microsystems announced that it has joined the American Semiconductor Innovation Coalition (ASIC) in its effort to ensure that the funding provided through the historic CHIPS and Science Act will be effectively employed to advance U.S. semiconductor R&D leadership and improve the pathway from research to manufacturing. As a member of ASIC, Menlo Micro will look to build on existing partnerships with ASIC members Purdue University and SUNY Polytechnic Institute to strengthen America's STEM workforce and ensure top tech talent remains in the U.S. Menlo Micro's leadership in creating next-generation electrical components will be invaluable as the country seeks to invest more heavily in transformative technologies and bolster domestic chip manufacturing and supply chains. Leveraging advances in materials science and MEMS technology, Menlo Micro's Ideal Switch delivers unprecedented power, efficiency, and speed at a fraction of the size and weight of traditional switching technologies. "Menlo Micro is proud to join ASIC and its members in the pursuit of strengthening U.S. tech leadership," said Russ Garcia, CEO of Menlo Micro. "ASIC's work to create tech hubs and bolster U.S. supply chains for our future economic prosperity and national security perfectly aligns with our goal to onshore manufacturing of Menlo Micro's Ideal Switch technology to help strengthen America's tech supply chains and facilitate the electrification of everything."

Patented Switching Technique for Power Electronics Design
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Learn more:
pulsiv.co.uk
  • Industry News
  • 2022-09-27

Pulsiv OSMIUM uses a patented method for converting AC to DC that involves charging/discharging a small storage capacitor without the need for a PFC inductor. This solution delivers high power factor, consistently high efficiency and an compact system design. Pulsiv OSMIUM technology can be used to improve overall system efficiency, optimize cost and contribute towards reducing global energy consumption. The microcontroller family and supporting components can be combined with commodity flyback DC-DC converters to displace higher-cost LLC solutions. Pulsiv has demonstrated a universal input, single switch 150W flyback power supply design that delivers 97.5% average (99.5% peak) front-end efficiency while maintaining 90% at just 2W. A 240W interleaved flyback is currently being developed and work is underway to showcase reference designs with even higher power capability. Pulsiv OSMIUM microcontrollers (PSV-AD-150 and PSV-AD-250 sampling now) do not directly determine output power and can be used as a platform for any application requiring 1W to 10kW, by adjusting only three system components and connecting a suitable DC/DC converter. Critical components in a Pulsiv OSMIUM circuit operate at low temperatures to extend their expected operating life, even under convection cooling. By regulating the flow of mains through a charging capacitor, Pulsiv has completely eliminated inrush current, meaning that manufacturers of industrial power supplies and LED lighting products can simplify their designs and reduce the cost of system installation. Finally, the technology supports Active Bridge Control, Configurable Hold-Up, X-Cap Discharge, HVDC Output Selection, a Power Consumption Indicator and Grid Failure Detection. These optional features can be selected as required to meet the needs of different end applications.

Offline AC-DC Primary-Side PWM Controllers for Flyback Converters
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Learn more:
elevation-semi.com
  • Product Release
  • 2022-09-27

Elevation Semiconductor announced the release of its two power ICs with smaller footprints for fast-charging solutions. The HL9510 and HL9512 are flyback PWM controller ICs that operate in a quasi-resonant (QR) mode to enhance the system efficiency and power density. Both ICs offer constant output voltage regulation through the optocoupler feedback controller or shunt regulator and integrate high-voltage startup. The HL9510 and HL9512 protection include VDD over-voltage protection (VDD-OVP), Brown-out protection, DMAG over-voltage protection (DMAG-OVP), DMAG under-voltage protection (DMAG-UVP), IC internal over-temperature protection (OTP), and IC external thermal shut-down (SD). The brown-in voltage is programmed by an external DMAG pin resistor and has a wide VDD operating range to cover variable output mode applications, such as USB-PD/PPS or conventional DP/DN protocol communication. Its protection is also implemented with auto-restart mode. The VDD-OVP, DMAG-OVP, and external SD protection can be configured with auto-restart or latch mode, and the DMAG-UVP can be configured with auto-restart or long auto-restart mode. The HL9510 is designed to integrate an internal HV startup circuit, whereas the HL9512 can be done by the external MOS combined IC’s AUX and ST pins. The HL9510 is available in a 10-lead SOIC package ideal for USB PD/QC portable device battery chargers, high-efficiency AC-DC power adapters, and a power supply with fixed or variable output voltage. The HL9512 also comes in the same package and is ideal for smartphones, tablet PC battery chargers, portable device adapters, and flyback power suppliers with low and/or variable output voltage.

DC/DC Converter IC for Advanced Driver Assistance Systems
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Learn more:
rohm.com
  • Product Release
  • 2022-09-27

ROHM developed the buck DC/DC converter IC with built-in MOSFET (Switching regulator), BD9S402MUF-C, for automotive applications such as infotainment and ADAS (Advanced Driver Assistance Systems) incorporating onboard sensors and cameras that are becoming more advanced. The BD9S402MUF-C supports output voltages down to 0.6V and 4A output current at switching frequencies higher than 2MHz in a compact size demanded by increasingly sophisticated secondary power supply applications for high performance MCUs and SoCs. What’s more, it is incorporating proprietary QuiCur™ high-speed load response technology and enables stable operation at an industry-leading 30mV (measurement conditions: 5V input voltage, 1.2V output voltage, 44µF output capacitance, load current variation 0 to 2A/2µs). This translates to a 25% reduction in output voltage fluctuation over class-leading standard products with equivalent functionality, making it ideal for use in the latest ADAS with severe power supply conditions requiring stable operation within 5% even with low voltage output. The BD9S402MUF-C is also equipped with a load response performance selection function that allows users to easily switch priority between ‘voltage fluctuation’ (for stable operation), and ‘capacitance reduction’ (to ensure stable operation at 22µF) via terminal setting. The result is that users can reduce the resources required for power circuit design, as stable operation can be achieved not only at the initial design, but also during specification or model changes.

GaN-SiC HEMT Transistor for Long Pulse Radar Applications
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Learn more:
ampleon.com
  • Product Release
  • 2022-09-26

Ampleon introduces the CLL3H0914L-700 GaN-SiC HEMT for wireless infrastructure, avionics/defence, non-cellular communication, cooking/ defrosting, and ISM-related applications. This rugged GaN transistor is optimised for radar implementations where long pulse width and high-duty cycles are required. The transistor was engineered to achieve over 700W of peak output power from a single transistor while operating at a voltage of 50V with efficiency of over 70% as well as designed thermally for long pulse applications, such as pulse widths (~2 milliseconds) and 20% duty cycles. This high-power density and low-thermal resistance HEMT is now in full volume production. Units are available directly from Ampleon or authorised distribution partners, RFMW and Digi-Key. Large signal models in ADS and MWO can be sourced via the Ampleon website.   

PCIM Asia Postponed to 2023 While PCIM Asia Conference to Keep Its Schedule This October
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Learn more:
pcimasia-expo.cn
  • Event News
  • 2022-09-26

PCIM Asia will now be held from 29 – 31 August 2023 at Shanghai New International Expo Centre in view of current circumstances relating to the pandemic in China. Although the PCIM Asia exhibition will be moved to next year, the PCIM Asia Conference 2022 will keep its schedule this autumn from 26 – 27 October in Shanghai. “To actively support the government’s efforts towards pandemic mitigation, we have decided to move the fair to next summer after meticulously examining the ongoing situation in China,” explains Mr Louis Leung, Deputy General Manager of Guangzhou Guangya Messe Frankfurt Co Ltd. “We would like to express our gratitude to those in the industry for their understanding and support, and look forward to welcoming key players back next year to reconnect and establish stronger business cooperation within the power electronics industry.” Despite the postponement, industry players will continue to keep abreast of the latest trends and developments this year. “Within the preventive guidance set by the local government, we are able to move forward with PCIM Asia Conference in the original dates this October in Shanghai. While details of the new venue will be announced shortly, we trust the hybrid conference will satisfy the power electronics community’s enthusiasm towards the event and meet the demand for in-person business encounters.”

PLECS Conference 2022 – Insights Into Real-Time Simulation
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Learn more:
plexim.com
  • Event News
  • 2022-09-26

At the PLECS conference in Zurich, leading industrial companies presented their various implementations of real-time simulation with PLECS and the RT Box. The speakers showed how PLECS was successfully used to automatically generate models and controls in their rapid prototyping process. The speed of the simulations was well appreciated. In addition, the RT Box proved to be very versatile: ALSTOM's Dr. Ing. Roberto Aceiton used the compact RT Box in a home-office environment during the pandemic, while Schindler integrated the RT Box into highly automated systems running overnight simulations of various elevator failure modes. Between the presentations, there were lively discussions on the various features of real-time simulation. The conference ended with a look into the future of PLECS: Wolfgang Hammer from Plexim presented future features, such as the "comment out" function to disable components for a simulation run and a difference viewer to compare two models. One question remained for the participants: When will the next PLECS conference take place? Orhan Toker, Vice President of Plexim, says “There will be for sure another PLECS conference in 1-2 years.”.

electronica Impresses with its Supporting Program
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Learn more:
electronica.de
  • Event News
  • 2022-09-22

electronica 2022, which will take place from November 15 to 18 on the exhibition grounds in Munich, and the co-located event SEMICON Europa, will show the role of the electronics industry as a trailblazer for societal future topics. While the exhibitors will present their specific products and solutions in 14 exhibition halls, the comprehensive supporting program of conferences, forums and special events will focus on knowledge transfer and personal exchange with experts. The motto “Driving sustainable progress” will be a common thread through all of the areas. electronica has traditionally been the platform for top-class conferences. This year things will be kicked off by the electronica Automotive Conference on November 14, which will deal with the transition of cars toward becoming intelligent IoT devices with electronic drives over the course of around 18 presentations. Among others, the key issues at the event include new EE architectures, intelligent interiors, challenges for supply chains, CO2 neutrality and efficient drive trains. On November 16, the electronica Embedded Platforms Conference, which will also last one day, will discuss the challenges and solutions for the embedded systems of the future: In around 35 presentations on three parallel tracks, experts will report on key topics such as power electronics and supply, AI and sensors, and communication and software.

GaN HEMT Device Performance 
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Learn more:
oxinst.com
  • Industry News
  • 2022-09-22

Oxford Instruments alongside its research partner Industrial Technology Research Institute (ITRI) can share technology developments that will benefit key hyper-growth electric vehicle, datacentre and 5G markets. The technology developments allow critical transistor components to operate at higher voltages which increases performance and reliability, while also achieving a safer and more energy efficient (normally off 'E-mode') operation compared to existing devices. The GaN (gallium nitride) HEMT device architecture is defined by a recessed and insulated gate junction into the AlGaN layer, and this device is referred to as GaN MISHEMT. In September 2021, Oxford Instruments Plasma Technology and ITRI announced a cooperative research program for next-gen compound semiconductors. This latest breakthrough is an example of that collaboration delivering on its goal of accelerating technology to benefit the partners, their regions and wider global markets. Since that announcement, Oxford Instruments has also unveiled an exclusive supply deal with Laytec, who's endpoint technology is used to control the GaN MISHEMT recess gate depth. Recess depth accuracy and repeatability is critical to tune the device performance characteristics, and LayTec's technology is designed specifically for this application achieves target depth accuracy of ±0.5nm. ITRI provides pilot production and value-added services, including process verification and product development. ITRI's integration services, especially this GaN development project, have proved incredibly beneficial, which quickly proved out the higher performance of GaN MISHEMT and provided a lower risk and faster route to market for the device.

Collaboration to Develop Software for Automotive Battery Management Systems
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Learn more:
nxp.com
  • Industry News
  • 2022-09-22

NXP® Semiconductors has joined forces with Elektrobit to co-develop the software platform that supports NXP’s high-voltage battery management system (HVBMS) reference design. Using Elektrobit’s Classic AUTOSAR tooling and software, the software platform of the HVBMS reference design eases the development of HVBMS architectures for electric vehicles (EVs) by abstracting the communication and controlling interactions between the BMS microcontroller and the battery cell controllers. As demand for battery-powered cars (EVs) continues to increase, so does the demand for improved performance, faster charging time, increased range and battery life, and improved safety. These demands drive rapid technological advancements in EV battery designs, especially for high voltages like 400V or 800V. As these batteries become more powerful and complex, more sophisticated BMS architectures are needed to ensure the safety and reliability of EVs. NXP’s HVBMS RD is a scalable ASIL D architecture composed of three modules: battery management unit (BMU), cell monitoring unit (CMU) and battery junction box (BJB). NXP’s wide portfolio of battery cell controllers, battery junction box devices, and devices for its electrical transport protocol link (ETPL), along with production grade software drivers for these silicon devices, makes it easier for OEMs and Tier 1 customers to enter the growing market of HVBMS and enables them to focus effort on their unique application features. Elektrobit has been collaborating with NXP for more than ten years. Utilizing Elektrobit’s EB tresos (AutoCore, AutoCore OS, and RTE), NXP’s reference application software and Complex Device Drivers (CDDs) are designed and integrated into NXP’s HVBMS RD.

Single-stage Flyback Controller for Battery Charging Applications
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Learn more:
infineon.com
  • Product Release
  • 2022-09-22

Infineon Technologies extends its offering of AC-DC controller ICs by introducing the ICC80QSG single-stage PWM controller for flyback topologies. The IC is tailored for battery charger applications offering scalable power designs of up to 130 W – when optimized using CoolMOS™ P7 Superjunction (SJ) MOSFETs. It is also suitable for adapter, printer, PC, TV, monitor, set-top box, and audio amplifier applications. The ICC80QSG battery charging IC offers a quasi-resonant mode, switching in valley n (QRMn). Its QRM operation comes with continuous conduction mode (CCM) prevention and valley switching discontinuous conduction mode (DCM) in mid to light load. By pairing ICC80QSG with CoolMOS™ P7 MOSFET devices, high efficiency and low electromagnetic interference (EMI) can be achieved to enable savings on the overall BOM: fewer heatsinks and coils may be needed in flyback designs. In addition, the integrated burst mode function for very light loads allows designs with very low power consumption during standby mode. Additionally, the ICC80QSG features a reduced gate driver output voltage during burst mode, making it ideally suited for very low standby requirements under light load or no load conditions with a remarkable standby performance over the whole operating range. The ICC80QSG implements a secondary-side regulation (SSR) method, which is ideal for current control during battery charging. For higher design flexibility, it accommodates adjustable on-time mapping at the valley changing position for the desired maximum operating switching frequency, as well as adjustable maximum on-time that limits input power and current, allowing safe operation under low line conditions.

Laminate to Aid Reliable Performance of EV Power Modules
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Learn more:
dupont.com
  • Industry News
  • 2022-09-22

DuPont Interconnect Solutions announced a multiyear contract with European power module manufacturer Semikron-Danfoss who will integrate DuPont™ Pyralux® AP all-polyimide double-sided copper clad laminate into its eMPack® power modules to further enhance the capabilities of next-gen electric vehicles. Integrating Pyralux AP copper clad laminate into eMPack traction inverter designs will help EV automotive engineers address key requirements related to signal integrity and power transmission. "Pyralux AP emerged as our best-fit solution after extensive testing and because the product has demonstrated three decades of stable, reliable performance in a variety of industries where operating conditions, like ours, are severe,” said Karl-Heinz Gaubatz, CTO of Semikron. “eMPack is a perfect fit to SiC MOSFET power modules. We look forward to working with DuPont and their Pyralux technology to help eMPack become a global leader in EV power modules.” Earlier this year, Semikron-Danfoss, headquartered in Nuremburg, Germany, won a billion-Euro contract beginning in 2025 to furnish patented eMPack power modules to a major German automotive manufacturer. Within silicon-carbide MOSFET or full silicon-carbide technology-based modules, traction inverters can be created which are extremely compact, scalable, and reliable because of a Semikron double side sintered assembly and connection technology called Direct Pressed Die (DPD). “We are excited how this EV power module application of Pyralux AP copper clad laminate supports a sustainable and electrified future to help preserve our planet for generations to come,” said Andy Kannurpatti, Global Business Director, Films & Laminates, DuPont Interconnect Solutions. “The eMPack power module is expected to enable millions of next-gen electric vehicles by 2032. We look forward to contributing significantly to the much-anticipated success of eMPack and appreciate the collaboration with Semikron-Danfoss.”

PowerPros Live Video Application-Engineering Support
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Learn more:
power.com
  • Industry News
  • 2022-09-20

Power Integrations launched PowerPros?, a live online video tech support service that enables power-supply designers to talk directly with members of Power Integrations’ applications engineering team 24 hours a day, six days a week, anywhere in the world. Designers worldwide can share a video call with an expert power electronics engineer to discuss real engineering challenges – including full project design and debug – sharing bench-top test results. Initially piloted during the pandemic to support Power Integrations’ customers, the program has been expanded with new facilities, additional team members, extended hours and live video. Trevor Hiatt, director of channel marketing at Power Integrations, said: "This is a technical solutions service where anyone can speak directly with an experienced application engineer any time of the day or night. The program has been very popular with customers, who rated the program 4.4 stars out of 5 with 93 percent of queries resolved within 72 hours. Some questions are simply a matter of pointing the enquirer to the right part of the datasheet, but many issues go much deeper. PowerPros staff advise on device and topology selection, review schematics and PCBs, help with transformer design, and do live design debugging.” Users of PowerPros can collaborate live with Power Integrations engineers to solve their design challenges in real-time using comprehensive bench instrumentation and design tools. Support is available for any of Power Integrations’ extensive portfolio of power supply and driver products and a wide range of applications including industrial, appliance, home and building automation, metering, chargers and adapters, power tools, eMobility, motor drives and LED lighting.

3-Phase Filters for Machine Applications
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Learn more:
schurter.com
  • Product Release
  • 2022-09-20

SCHURTER is expanding the FMAC NEO and FMAD NEO 3-phase filter families with variants for machine applications. The filters meet the requirements of machine safety according to IEC 60204-1. They are suitable for 3-phase or 3-phase-with-neutral conductor applications at rated currents from 16 to 230 A. The FMAC NEO and FMAD NEO single-stage block filters have a particularly compact design with a small footprint and high performance at the same time. They are suitable for industrial or energy applications such as EV fast charging stations or battery storage. The filter versions meet the requirements of this standard IEC 60204-1. The filters have a short discharge time of the capacitors, so that they have a touchable residual voltage of <60 V in 1 or max. 2 seconds after disconnecting the voltage. Further, the insulation value between phases and ground is at least 1 MO thanks to larger resistors. The filters are designed for currents from 16 to 230 A at an ambient temperature of 50 °C. All family members have ENEC and cURus approvals and are recommended for applications up to 520 VAC. The standard variants are designed for industrial applications with leakage currents <13 mA. Special variants with leakage currents <3 mA are available for particularly leakage-critical applications.

Programmable Dynamic Voltage Scaling Buck Converters
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Learn more:
halomicro.com
  • Product Release
  • 2022-09-20

Halo Microelectronics announced the release of its HL7593 and HL7594 devices, a series of synchronous buck converters optimized to supply different subsystems of portable applications. The HL7593/HL7594 series output voltage ranges from 0.600V to 1.394V in 6.25mV steps or 0.27V to 0.6272V in 2.8125mV steps programmed through an I2C interface. Their output voltages can be adjusted on the fly to provide a dynamic voltage scaling (DVS) function with a programmable slew rate. Furthermore, a wide range of output capacitors can be used to optimize VOUT stability during load transients, and inductors from 0.33µH to 0.47µH may be used without affecting loop stability. At moderate to light loads, pulse frequency modulation (PFM) is used to maintain conversion efficiency with a typical non-switching quiescent current of 48µA. Even with such a low quiescent current, the HL759x maintains excellent load and line transient responses. At higher loads, the system automatically switches to fixed-frequency pulse width modulation (PWM) operation at 2.4MHz for minimum VOUT ripple and optimal load transient response. In shutdown mode, the supply current drops below 1µA, reducing power consumption. Additionally, the PFM Mode can be disabled if needed through the I2C registers. The HL7593/HL7594 ICs are available in a 15-bump, 0.4mm pitch, 2.01mm x 1.21mm WLCSP and are ideal for application processors, memory, HDD, SDD, and mobile devices.

Higher Voltage Biasing High Voltage Power Supplies
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Learn more:
deantechnology.com
  • Product Release
  • 2022-09-20

Dean Technology announced the introduction of a series of high voltage power supplies designed specifically for higher voltage applications needing a biasing module. The UMR-A-10000 series, which is another extension of the existing UMR Collection of power supplies, offers output voltages up to 10kV, input voltages at 12 or 24V, and power at up to 30W. In addition, this line of power supplies offers a high voltage flying lead. UMR-A-10000 modules, like the UMR-A and UMR-AA before them, offer low ripple and highly stable outputs. All models come standard with voltage and current monitoring; the ability to upgrade each unit to include buffered monitors and current regulation will be available in the coming months. "This UMR-A-10000 series finally gets our UMR-A family above the 6kV threshold, which has been a consistent demand from our customers since the UMR's inception," said Scott Wilson, Sales and Product Development Manager for Dean Technology. "As always, we are a customer driven organization, and as such will continue to evolve our UMR product line to offer more options for our customer's high voltage applications. We look forward to releasing even higher voltages in the future." The UMR Collection of power supplies are form-fit-function replacements for industry standard units and is comprised of six product lines – the UMR-A, UMR-AA, UMR-C, UMR-HPC, UMR-BPC, and the new UMR-A-10000.

3D Power Design and Manufacturing Symposium
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Learn more:
3d-peim.org
  • Event News
  • 2022-09-15

The PSMA Packaging and Manufacturing Committee announces the Fourth Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-2023) February 1-3, 2023 at Florida International University in Maimi, Florida. This Symposium provides the opportunity to receive an update on the latest technology and future trends focused on increasing the density and the performance of power solutions. Discover advances in the integration, design, packaging and manufacturing of 3D power sources. The Symposium is desgined for any engineer or manager that is involved in the design and manufacturing of high density power sources using 3D technology. Each day will lead off with 2 Plenary Speakers and each Technical Session will lead off with a keynote speaker. Plenary speakers include Professor Fred Lee of Virgina Tech presenting “PCB based Integrated Magnetic” and Dr. Brandon Passmore of Wolfspeed presenting “Finite-Element Predictive Modeling for Power Modules.” Technical Sessions include modeling, active and passive components, substrates, packaging and how to integrate them with 3D manufacturing technologies to create state of the art power sources. The Symposium will include exhibits and ample opportunities to network with attendees, speakers and exhibitors. The General Chair is Dr. Markondeyaraj Pulugurtha of the Florida International University (FIU). Technical Program Co-Chairs are Dr. John Bultitude of Kemet, a Yageo Company, and Dr. Vanessa Smet from Georgia Tech.

Low Contact Resistance Coating For Heightened Fuel Cell Efficiency
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Learn more:
interplex.com
  • Product Release
  • 2022-09-15

Fabricated from corrosion-resistant SUS316L stainless steel, the Interplex bipolar plate (BPP) solutions for hydrogen fuel cells support an extensive operational lifespan of over 8,000 hours. They have thicknesses down to 0.8mm. Their low contact resistance (< 2mO·cm² at 1Ma pressure levels) helps to significantly boost the efficiency levels of the fuel cell stacks they are used in and enables power densities to be raised. Thanks to the precision stamping techniques employed, Interplex BPPs exhibit only =8% variation in the evenness with tight tolerances of flow channel thickness (across their active area), as well as offering enhanced plate flatness. These BPPs thereby deliver assured leak-tight operation and even power distribution across the entire surface of their plates. Likewise, advanced laser welding results in exceptional weld quality. The high-speed stamping and coating procedures that Interplex has developed are key factors too. Via these, the company is able to reach high productivity figures – with physical vapor deposition (PVD) coating of plates being done in a fifth of the time compared to other suppliers. In addition, proprietary over-molding technology for attaching the silicone rubber gaskets to the BPP is done to elevated degrees of accuracy. It allows assembly problems to be minimized when stacking the BPP with a membrane electrode assembly (MEA).

800 V and 950 V AC-DC Integrated Power Stages
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Learn more:
infineon.com
  • Product Release
  • 2022-09-14

Optimized performance, efficiency, and reliability in high-voltage power supplies need to be combined with reduced bill-of-material (BOM) count and cost, as well as lower design efforts. With its 5 th generation fixed-frequency (FF) CoolSET portfolio, Infineon Technologies offers the right components to meet these needs and effectively manage the critical design trade-offs. The 800 V and 950 V AC-DC integrated power stages (IPS) are housed in a DIP-7 package and address applications such as auxiliary power supplies for home appliances, AC-DC converters, battery chargers, solar energy systems, and motor control and drives. The FF CoolSET solution combines a PWM controller IC with the latest high voltage CoolMOS P7 superjunction (SJ) MOSFETs in a single package. The extended portfolio now includes the first device on the market that uses an avalanche-rugged SJ MOSFET with a breakdown voltage of 950 V to allow for a wider input voltage. The new devices enable both isolated and non-isolated topologies such as flyback or buck and operate at switching frequencies of 100 kHz as well as 65 kHz. Accommodating both the cost-efficient buck topology and flyback in one single device simplifies the supply chain for customers. An integrated error amplifier supports direct feedback from the primary output, which is typical for non-isolated topologies. Moreover, this further minimizes the number of components and design complexity.

Accreditation for Calibration of DC Current Transducers
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Learn more:
danisense.com
  • Industry News
  • 2022-09-14

Danisense announced its accreditation to ISO/IEC 17025:2017, the quality management system and main standard for testing and calibration laboratories. This means that the company can now offer ISO 17025 accredited DC calibration of DCCTs up to 21kA. The ISO 17025 accreditation was awarded to Danisense by the Danish national accreditation body, DANAK. ISO 17025 accreditation means that the laboratory has met the Management Requirements and Technical Requirements of the internationally-recognized ISO 17025 standard, and is deemed technically competent to produce calibration and testing results. Now Danisense can ship new current sense transducers with the ISO 17025 calibration authority, saving customers a long and painful process and much administrative time and effort. Explains Loic Moreau, Sales & Marketing Director at Danisense: "The Danisense laboratory was first built in 2017. We have since gained knowledge in the field of metrology, particularly high accuracy DCCT calibration. We have continuedly improved our methods and equipment, and  the laboratory has been used to support the development of high-end DCCTs for particle accelerators, MRI scanners, green energy applications like windmills, electric vehicles and many other applications." ISO 17025 accreditation means that the laboratory has met the Management Requirements and Technical Requirements of the internationally-recognized ISO 17025 standard, and is deemed technically competent to produce calibration and testing results. Now Danisense can ship new current sense transducers with the ISO 17025 calibration authority, saving customers a long and painful process and much administrative time and effort.

1200 Volt Rating on Vertical GaN Power Devices
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odysseysemi.com
  • Industry News
  • 2022-09-14

Odyssey Semiconductor announced it reached the stated goal of 1200 volt rating on vertical GaN power field-effect transistors (FETs). The Company is now applying this validated technology to fabricate product samples in Q4 2022 for internal and customer evaluations, planned through Q1 2023. "The importance of Odyssey achieving this milestone of 1200 Volt vertical GaN power devices cannot be over-emphasized," said Mark Davidson, Odyssey's Chief Executive Officer. "We are emerging from process and materials R&D to delivering products at voltages that lateral GaN can't practically reach with economics unattainable by silicon and silicon carbide. Our vertical GaN products will deliver high power conversion efficiency at almost 10x smaller than a silicon carbide transistor for the same application." "We are not just fabricating test structures. We're building product samples that customers need. Odyssey continues to close new commitments for product samples as customers gain a full understanding of the capabilities of Odyssey's power devices. The Company is uniquely positioned with the expertise and the IP portfolio to protect it. And with our own foundry in Ithaca, New York, we can innovate quickly and control our ability to supply products to customers," concluded Davidson.

Motor Drive Center of Excellence Opened in Turin
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epc-co.com
  • Industry News
  • 2022-09-14

EPC has opened a design application center near Turin, Italy, to focus on growing motor drive applications based on GaN technology in the e-mobility, robotics, drones, and industrial automation markets. The specialist team will support customers in accelerating their design cycles and define future Integrated Circuits for power management with state-of-the art equipment to test applications from 400 W to 10’s of kW. Strategically located, Turin has a historical tradition in electric motors and motor drives enabling the company to draw on the wealth of local technical talent. EPC’s engineers are helping customers reduce their design cycle times and adopt GaN for more efficient, smaller, lower-cost systems. Moreover, the center is exploring ways to exploit the potential of EPC’s GaN technology in motor drive applications to enable a substantial increase in the efficiency of the motor, leading to higher power density designs than what has been possible with historically MOSFET-based designs. Turin also features the Power Electronics Innovation Centre, a cross-department entity in the Politecnico di Torino - one of the most important technical Universities in Europe - and EPC is collaborating closely with PEIC by investing in shared research and development. The facility is headed by Marco Palma, EPC’s Director of Motor Systems and Applications. Commenting on the opening he said, “Our new facility combines a comprehensive GaN product portfolio and design expertise offering customers a center of excellence that is unrivalled for motor drive applications. Its location is key too, as Europe is driving the green revolution in the e-mobility market, by using the Euro 7 standard in the short term and by banning internal combustion engines by 2035. This is definitely the right time to invest in higher power density motor solutions that avoid un-necessary energy waste.”

ASIL C Certified Battery Management System for High Voltage Applications
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sensata.com
  • Product Release
  • 2022-09-13

Sensata Technologies announced a Battery Management System (BMS), the Lithium Balance n3-BMS, for high voltage applications. It is ideal for applications with power up to 1000 volts/2000 amps, especially for battery makers and manufacturers of electric trucks, buses, and other heavy commercial vehicles. The demand for ISO 26262 certified components is on the rise as battery packers and electric commercial vehicle OEMs prioritize functional safety in their platforms while striving for faster time-to-market. However, the ISO 26262 certification process is complex, costly and can take years to complete. An off-the-shelf, Automotive Safety Integrity Level (ASIL C) certified solution like the Lithium Balance n3-BMS can reduce the development time and associated costs. The layered software structure of the n3-BMS provides customers with the option to customize the battery management system with their own code and algorithms without impacting the ASIL C certification. The BMS software architecture consists of a “Base Software Layer” (BSW) and an “External Software Layer” (ESW) which are connected by an open API link layer. Since all the safety-critical functionalities of the BMS are in the BSW layer of the software, developers are free to implement their own software code and algorithms in the ESW without any risk to the ISO 26262 certification of the system.

Ruggedised 250W Non-isolated DC-DC Converters
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Learn more:
lambda.tdk.com
  • Product Release
  • 2022-09-13

TDK Corporation announces the introduction of the 250W rated TDK-Lambda RGA series of ruggedised non-isolated DC-DC converters. Capable of operating from an input voltage of 9 to 40V or 9 to 53V, the non-isolated step-down converters deliver output voltages that can be adjustable from 3.3 to 15V, 3.3 to 24V or 3.3 to 40V with output currents of up to 20A. The series is designed to be used in harsh environment applications including robotics, AGVs (Automated Guided Vehicles), communications, COTS, industrial and portable battery-powered equipment. In a 1/16th brick form factor, measuring 35.6 x 25.6 x 13mm, the converters are encapsulated to provide a higher resistance to shock and vibration. The five-sided aluminum die cast housing with mounting tabs reduces radiated EMI and enables conduction cooling to a cold-plate for fan-less operation. The RGA models comprise of three voltage and current combinations to support operation from 12V, 18V, 24V, 36V and 48V power sources. The wide input ranges can assist with inventory reduction programs with one part number covering multiple nominal voltages. With efficiencies of up to 98%, power losses are minimised allowing the products to operate in harsh environments of -40°C to +110°C case temperature. The need for external output capacitance is reduced due to an optimised dynamic voltage response, thus reducing board space requirements.

DIN Rail AC/DC Power Supplies
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Learn more:
coseleurope.eu
  • Product Release
  • 2022-09-12

COSEL announced the launch of three DIN Rail AC/DC power supplies for industrial applications. Available in three power levels, 30W, 60W and 90W, combining a low profile design, a wide input voltage range of 85V – 264V, and high performance levels, the WDA series is suitable for a large range of applications. The three models, WDA30F, WDA60F and WDA90F are designed for DIN-Rail attachment and are compatible with the DIN EN60715TH 35 standard (35×7.5mm or 35×15mm), the top hat shaped DIN rail. Designed for international applications, the versatile WDA series boasts a wide input voltage range of 85 to 264VAC, and features overvoltage protection with latching and overcurrent protection with automatic recovery. The WDA30F is available in four different output voltages, 5V, 12V, 24V and 48V within a power level of 30W and a typical efficiency of 88%. Three output voltages are proposed for the WDA60F and WDA90F of 12V, 24V and 48V within an output power of 60W and 90W respectively, and a typical efficiency level of up to 90%. All models include a potentiometer making possible to finely trim the output voltage when installed. A DC OK LED visually confirms the output status. Optimized for convection cooling, the WDA series can be operated within an ambient temperature range of -20 to +70 degrees centigrade. Depending on the assembly method and ventilation used in the final equipment, a derating may apply as specified in the technical documentation.

Agreement Leads to 130 nm SiGe BiCMOS Platform
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Learn more:
xfab.com
  • Industry News
  • 2022-09-12

X-FAB Silicon Foundries has announced a further expansion of its longstanding partnership with the Leibniz Institute for High Performance Microelectronics (IHP). As part of a new agreement, X-FAB will now license IHP’s SiGe technology. It will mean the performance benefits of this technology can be brought to high-volume customers. Significantly strengthening the X-FAB technology portfolio, the newly created 130 nm platform provides a solution attaining the elevated performance parameters needed to address next generation communication requirements. Examples of areas benefiting from this technology include Wi-Fi 6 (and future Wi-Fi 7) access points, plus next generation cellular infrastructure (in particular 5G mmW and emerging 6G standards) and vehicle-to-vehicle (V2V) communication. This technology will also be pivotal in the development of +100 GHz radar systems, for use in both automotive and consumer applications. This license agreement follows on from the collaborative work that began in 2021, where X-FAB’s copper backend was added to IHP’s SG13S and SG13G2 frontend technologies to boost the bandwidth figures that could be supported. In relation to this innovative SiGe platform, X-FAB is set to start engaging with selected early adopters on prototyping projects during Q4 2022. An early-access PDK is available enabling Prototyping, while volume manufacturing will happen at X-FAB France, the company’s facility near Paris. 


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Power Supply Delivers up to 800W with BF-Ready Isolation TDK Corporation announces the introduction of the ...11086Product ReleasePower Supply Delivers up to 800W with BF-Ready Isolation TDK Corporation announces the introduction of the TDK-Lambda brand 1U high MU4 series of AC-DC modular power supplies. The product’s very low acoustic noise is strongly desired in test and medical applications where audible disturbances need to be kept to a minimum. The modular MU4 can provide up to five isolated and regulated outputs and deliver up to 800W. All models in the MU4 series feature full MOPPs (Means of Patient Protection) isolation, including output to earth, to simplify implementation into BF-rated medical applications. Other target applications include dental, test and measurement, broadcast, professional audio, and industrial equipment. With intelligent fan control, the MU4 fan rotation speed is reduced, producing audible noise as low as 36dBA*. Its microcontroller algorithm monitors the temperature of the primary converter and each output module, allowing the fan speed to be adjusted for optimum cooling. The low profile, 1U high, MU4 measures just 89 x 41 x 257.5mm (W x H x D), allowing a smaller system enclosure. Initially, nine modules are available, offering a continuous range of voltages from 3.3V to 104V with ratings from 150W to 480W. Options include a 5V / 2A standby voltage, fan fail signal, inhibit and enable (for individual or all outputs), DC good, PMBus™ communication, and current share for parallel configurations.22.11.2022 13:30:00Novnews_2022-12-01_17.png\images\news_2022-12-01_17.pnghttps://www.emea.lambda.tdk.com/uk/news/article/18939lambda.tdk.com
Joint Agreement to Develop Inverters for e-Axle Using SiC Power ModulesROHM has signed a joint development agreement with...11072Industry NewsJoint Agreement to Develop Inverters for e-Axle Using SiC Power ModulesROHM has signed a joint development agreement with Mazda Motor and Imasen Electric Industrial for inverters and SiC power modules to be used in the electric drive units of electric vehicles, including e-Axle. As the ‘heart of the EV’, e-Axle integrates a motor, reduction gearbox, and inverter into a single unit that plays a large part in determining the driving performance and power conversion efficiency of electric vehicles. SiC MOSFETs in particular are expected to improve efficiency even further. ROHM will carry out joint inverter development for e-Axle by participating in a ‘cooperative framework for the electric drive units development and production’ with companies such as Imasen and led by Mazda. At the same time, ROHM will contribute to the creation of compact, high efficiency electrical units by developing and supplying advanced SiC power modules that provide improved performance. Through this collaboration, ROHM will develop even more competitive SiC MOSFETs and modules by working backwards from the finished vehicle to understand the performance and optimal drive method required of power semiconductors. Besides creating value through mutual understanding between car and device manufacturers, the three companies also support technical innovation in the automotive field and contribute to a sustainable society by leveraging extensive knowledge, technologies, and products garnered on a global basis.22.11.2022 08:00:00Novnews_2022-12-01_3.jpg\images\news_2022-12-01_3.jpghttps://www.rohm.com/news-detail?news-title=2022_news_e-axle&defaultGroupId=falserohm.com
electronica 2022 Confirms its Status An excellent mood in 14 halls and intensive discus...11076Event Newselectronica 2022 Confirms its Status An excellent mood in 14 halls and intensive discussions at full trade fair booths: The international electronics industry met again in person from November 15 to 18 at electronica 2022 in Munich. 2,144 exhibitors, 64 percent of whom came from countries outside of Germany, showcased innovations that covered the entire spectrum of electronics to about 70,000 visitors at this world leading trade fair. SEMICON Europa was held in parallel spread over just under one and a half halls. A highly informative supporting program consisting of conferences, forums and special events such as the CEO Roundtable explored the focus topics of the trade fair. The program also served as an opportunity for discussions about current global challenges, including the energy transition, supply chain bottlenecks, the scarcity of raw materials and shortages of skilled workers. “electronica 2022 impressively confirmed its status as world leading trade fair and demonstrated once again that Munich is THE trade fair location for the international electronics industry,” summarizes Dr. Reinhard Pfeiffer, CEO of Messe München. “We are delighted that the number of visitors was only around 14 percent below the record result of 2018, and that the share of international visitors at around 54 percent was even higher than at the previous events—an outstanding result in these times. What’s more, according to the trade fair survey, our exhibitors and visitors were more satisfied with electronica this year than ever before.” The next electronica will take place in Munich from November 12-15, 2024.18.11.2022 12:00:00Novnews_2022-12-01_7.jpg\images\news_2022-12-01_7.jpghttps://electronica.de/en/newsroom/press-material/press-releases/detail/electronica-2022-impressively-confirms-its-status-as-the-worlds-leading-trade-fair-for-electronics.htmlelectronica.de
Radiation-Hardened ICs Lift Off Onboard Artemis 1 Mission to the MoonRenesas Electronics announced that hundreds of its...11071Industry NewsRadiation-Hardened ICs Lift Off Onboard Artemis 1 Mission to the MoonRenesas Electronics announced that hundreds of its radiation-hardened (rad-hard) integrated circuits (ICs), including over 50 different part numbers, are onboard the Artemis 1 launch that blasted off on November 16. Intersil-brand rad-hard ICs are part of the battery management systems, RS-25 engine control electronics and the launch abort system on the Space Launch System that propelled the mission into space, the most powerful rocket ever built. On the Orion Capsule that will circle the moon, Renesas provided critical components for controller boards, the main flight computer, the docking camera system, the power distribution system and display and panel electronics. The Intersil-brand ICs perform multiple functions, including power management and precision signal processing. Artemis is the ambitious NASA program that will take humankind back to the moon for the first time in more than 50 years. Artemis 1 is sending the test-mannequin populated Orion capsule to orbit the moon and deploy cubesats and other space experiments on a 42-day mission to test all the critical systems. Artemis 2 (2024) will have a crew that will orbit the moon paving the way for Artemis 3 (2025), which will land the first woman and the first person of color on the moon. The plan is for Artemis to continue to build a space station in lunar orbit and a base on the lunar South Pole. This infrastructure will allow for the awe-inspiring goal of a crewed mission to Mars in the 2040s.17.11.2022 07:00:00Novnews_2022-12-01_2.jpg\images\news_2022-12-01_2.jpghttps://www.renesas.com/eu/en/about/press-room/hundreds-renesas-intersil-brand-radiation-hardened-ics-lift-onboard-artemis-1-mission-moonrenesas.com
Industrial Series 60 KW DC Power Supplies and LoadsEA Elektro-Automatik introduces its 60 kW and 30 k...11087Product ReleaseIndustrial Series 60 KW DC Power Supplies and LoadsEA Elektro-Automatik introduces its 60 kW and 30 kW, EA-PU 10000 Programmable DC Power Supplies, EA-PUB 10000 Programmable Bidirectional DC Power Supplies and EA-PUL DC Programmable Regenerative Electronic Loads. Typical applications include electric vehicle battery pack testing, powering furnaces in semiconductor wafer fabrication facilities, electrochemical electrolysis processing, and solar inverter testing. The products, without manual front panel displays, are intended for use in production ATE systems and automated process control systems requiring high power.The 60 kW models output maximum voltages of 360 V to 2000 V and maximum currents of 480 A to 80 A; the 30 kW models output maximum voltages of 60 V to 2000 V and maximum currents of 1000 A to 40 A. Overall, the 60 kW series includes 21 models, and the 30 kW series consists of 29 models allowing engineers to select a model that addresses their specific applications. The increased power capability enables engineers to reduce the number of power instruments needed for a high-power system, saving critical rack space and providing more power in a smaller footprint.15.11.2022 14:30:00Novnews_2022-12-01_18.jpg\images\news_2022-12-01_18.jpghttps://elektroautomatik.com/en/latest-news/ea-elektro-automatik-announces-a-power-density-breakthrough-with-its-new-industrial-series-60-kw-dc-power-supplies-and-loads/elektroautomatik.com
650V GaN HEMTsInnoscience announced a low RDS(on) 650V E-mode Ga...11085Product Release650V GaN HEMTsInnoscience announced a low RDS(on) 650V E-mode GaN HEMT devices. INN650D080BS power transistors have an on-resistance of 80m? (60m? typical) in a standard 8x8 DFN package, enabling higher power applications, for example in totem pole LLC architectures or fast battery-chargers. Explains Yi Sun, Sr VP of product development at Innoscience: “We are now able to address high density, high efficiency power conversion applications. Like all our other 650V HEMTs, these new parts are qualified to JEDEC standards for chip and package, and they have also passed DHSOL (Dynamic High Temperature Operating Life) reliability testing according to JEP180 and accelerated life tests up to 1000V give lifetime calculations of 36 years (520V; 150°C; 0.01% failure rate).” Thanks to Innoscience’s innovative strain enhancement layer, InnoGaN devices features low specific RDS(ON) as well as very low dynamic RDS(ON) and excellent reliability. The new 80m? RDS(on) parts also feature very good drain source voltage transient (VDS, transient) and pulsed (VDS, pulsed) characteristics – 800V and 750V respectively. Moreover, similarly to the other 650V products, the 80m? RDS(on) devices feature a strong ESD protection circuit embedded in the die to ease mass production assembly of these device in package and easy handling. In this case, however, the ESD circuit has been modified to allow a larger negative gate voltage swing down to -6V. The low RDS(on) INN650D080BS power transistors, which are available in industry-standard 8x8 DFN packages, join previously-announced 140m?,190m?, 240m?, 350 m?, 500m? and 600 m? RDS(on) parts, creating a significant portfolio of available devices, which is continuously expanding towards lower RDS(on) values.15.11.2022 12:30:00Novnews_2022-12-01_16.jpg\images\news_2022-12-01_16.jpghttps://www.innoscience.com/innoscience.com
GaN Technology for High Power Density ApplicationsEPC launches the 80 V, 4 mOhm EPC2619. This is the...11084Product ReleaseGaN Technology for High Power Density ApplicationsEPC launches the 80 V, 4 mOhm EPC2619. This is the lead product for a generation of eGaN devices that have double the power density compared to EPC’s prior-generation products. The EPC2619 has an RDS(on) of just 4 mOhms in a tiny, 1.5 mm x 2.5 mm, footprint. The maximum RDS(on) x Area of the EPC2619 is 15 m?*mm2 – five times smaller than 80 V silicon MOSFETs. This product is designed for a range of motor drive applications. For example: 28 V – 48 V conversion for eBikes, eScooters and power tools; high density DC-DC converters; solar optimizers; and synchronous rectification converting 12 V – 20 V for chargers, adaptors, and TV power supplies. The typical RDS(on) x QGD, which is indicative of power losses in hard-switching applications, is 10 times better than 80 V silicon MOSFETs. This enables switching frequencies that are 10 times higher than silicon MOSFETs and without an efficiency penalty, thus producing the highest power density.  This makes the EPC2619 ideal for high frequency hard-switching 24 V – 48 V applications, such as used in buck, buck-boost, and boost converters. The typical RDS(on) x QOSS, which is indicative of power losses in soft-switching applications, is 87 mOhm*nC, two times better than 80 V silicon MOSFETs. This makes the EPC2619 ideal for soft-switching applications, such as the primary rectification full bridge for LLC-based DCX DC-DC converters.15.11.2022 11:30:00Novnews_2022-12-01_15.jpg\images\news_2022-12-01_15.jpghttps://epc-co.com/epc/events-and-news/news/artmid/1627/articleid/3087/epc-launches-a-new-generation-of-egan-technology-that-doubles-performanceepc-co.com
Advanced Smart Electrical Outlet and ConnectorVoltSafe announced a strategic partnership with Me...11075Industry NewsAdvanced Smart Electrical Outlet and ConnectorVoltSafe announced a strategic partnership with Menlo Microsystems to co-develop an advanced electrical plug technology. Both companies are strong proponents of advancing how the world connects to electricity, and the combination of Menlo Micro’s Ideal Switch technology with VoltSafe’s smart electrical outlet and connector will enable the future of smart power connectivity. Seeing deficiencies in existing relays and switches that caused the products they operated to be bigger, slower, less capable, or more expensive, Menlo Micro set out to create a better solution and developed Ideal Switch. The Ideal Switch is a device that delivers all the benefits of a mechanical relay and a semiconductor switch, with no compromises. The Ideal Switch is tiny, fast, reliable, withstands extreme temperatures, is ultra-low loss and can handle 1,000s of watts. Menlo Micro in March announced its $150 million USD Series C, bringing Menlo Micro’s total cumulative funding to over $225 million USD. Vertical Venture Partners and Tony Fadell’s Future Shape led the round. Menlo’s Micro’s confidence in VoltSafe’s disruptive technology powering the future of how the world connects to electricity, paved the way for this early collaboration. 15.11.2022 11:00:00Novnews_2022-12-01_6.jpg\images\news_2022-12-01_6.jpghttps://menlomicro.com/newsroom/voltsafe-inc-collaborates-with-menlo-micro-to-develop-the-most-advanced-smart-electrical-outlet-and-connectormenlomicro.com
Zero-Voltage-Switching Power-Supply ICsPower Integrations announced the InnoSwitch™4-Pro ...11083Product ReleaseZero-Voltage-Switching Power-Supply ICsPower Integrations announced the InnoSwitch™4-Pro family of digitally controllable, off-line CV/CC Zero Voltage Switching (ZVS) flyback ICs, which substantially reduce the size of power adapters. Incorporating a robust PowiGaN gallium-nitride primary switch and steady-state switching frequency of up to 140 kHz, the highly integrated devices reduce the component count and PCB area required for ultra-compact adapters for cellphone, notebook, tablet and multi-port accessories. “InnoSwitch4-Pro ICs interface seamlessly with Power Integrations’ ClampZero™ family of active clamp ICs to achieve ZVS in both continuous conduction mode (CCM) and discontinuous conduction mode (DCM),” stated Aditya Kulkarni, product marketing manager at Power Integrations. “ZVS, combined with our PowiGaN™ technology, virtually eliminates switching losses. Efficiency exceeds 95 percent, which enables designers to eliminate the heat sinks, spreaders and potting materials typically required for thermal management." Further size reduction of the adapter can be achieved by the use of a MinE-CAP™ device in combination with InnoSwitch4-Pro and ClampZero ICs. Based also on PowiGaN technology, MinE-CAP ICs enable input capacitance size reduction of approximately 40 percent. Capable of delivering up to 220 W, InnoSwitch4-Pro ICs combine a 750 V PowiGaN primary switch, controller, FluxLink™ reinforced isolation feedback link for secondary-side control, I2C interface, active clamp drive and synchronous rectification in a compact InSOP™-28 package. 15.11.2022 10:30:00Novnews_2022-12-01_14.jpg\images\news_2022-12-01_14.jpghttps://investors.power.com/news/news-details/2022/Power-Integrations-Combines-Programmability-High-Efficiency-and-Small-Form-Factor-in-New-Zero-Voltage-Switching-Power-Supply-ICs/default.aspxpower.com
Funding Enables Mass Production of GaN Transistor FamilyCambridge GaN Devices (CGD) has raised $19m in Ser...11073Industry NewsFunding Enables Mass Production of GaN Transistor FamilyCambridge GaN Devices (CGD) has raised $19m in Series B funding. The investment was led by Parkwalk Advisors and BGF, with participation from IQ Capital, CIC, Foresight Williams Technology and Martlet Capital. The investment will enable CGD to begin mass production of its range of GaN transistors for power applications. CGD has already made remarkable progress, developing intellectual property and bringing to market its ICeGaN™ Gallium Nitride transistor family which addresses a $50bn global power semiconductor market. The company is positioned to disrupt multiple industries such as consumer and industrial power supplies, lighting, data centres and automotive HEV/EV. CGD’s technology provides efficient, sustainable, and more cost-effective power solutions for electronic equipment. As a result, CGD has gained global traction and attention at international conferences and in respected press. CGD is currently leading a $10m European-funded project developing GaN-based modules for low and high-power applications (GaNext); is participating in a UK supply chain initiative for PCB-embedded power systems with GaN devices (P3EP) and recently launched a project to develop highly reliable GaN power transistors and ICs to cut data centre emissions (ICeData). CGD is also focused on key partnerships with their customers focused at the datacom and automotive solutions. The company has completed its brand development, moved to new offices, and now employs over 40 staff worldwide, with more planned to support the up scaling.15.11.2022 09:00:00Novnews_2022-12-01_4.jpg\images\news_2022-12-01_4.jpghttps://camgandevices.com/en/p/cambridge-gan-devices-secures-19m-pounds-to-scale-up-for-50bn-pounds-power-semiconductor-device-market/camgandevices.com
MOSFETs with Top-Cool Packagingonsemi announced a series of MOSFET devices that f...11080Product ReleaseMOSFETs with Top-Cool Packagingonsemi announced a series of MOSFET devices that feature top-side cooling to assist designers in challenging automotive applications, especially within motor control and DC/DC conversion. Housed in a TCPAK57 package measuring just 5mm x 7mm, the Top Cool devices feature a 16.5mm2 thermal pad on the top side. This allows heat to be dissipated directly into a heatsink rather than via a typical printed circuit board (PCB). By enabling the use of both sides of the PCB and decreasing the amount of heat going into it, the TCPAK57 provides increased power density. Improved reliability of the new design adds to an overall extended system lifetime. “Cooling is one of the greatest challenges in high power design and successfully addressing it is the key enabler to reducing size and weight, which is critical in modern automotive design,” said Fabio Necco, vice president and general manager, Automotive Power Solutions at onsemi. “With excellent electrical efficiency and having eliminated the PCB from the thermal path, the design is significantly simplified while reducing size and cost.” The devices deliver the electrical efficiency required in high power applications with RDS(ON) values as low as 1m?. Additionally, the gate charge (Qg) is low (65 nC), reducing losses in high-speed switching applications.15.11.2022 07:30:00Novnews_2022-12-01_11.jpg\images\news_2022-12-01_11.jpghttps://www.onsemi.com/company/news-media/press-announcements/en/onsemi-launches-mosfets-with-innovative-top-cool-packagingonsemi.com
GaN ICs Fast-Charge from 1-50% in Only 7 MinutesNavitas Semiconductor has announced its GaNFast po...11078Industry NewsGaN ICs Fast-Charge from 1-50% in Only 7 MinutesNavitas Semiconductor has announced its GaNFast power ICs have been selected for the ‘in-box’ 125 W charger of Motorola’s latest ?agship smartphone, the X30 Pro. A charge from 1% – 50% in just 7 minutes brings an ultra-fast charging experience to Motorola users. Jin CHEN, General Manager of Smartphone BU, Lenovo China commented on the launch of X30 Pro: “We hope to deliver a more comprehensive user experience in the ?agship X30 Pro. By working hand-in-hand with Navitas and Aohai Technology, we are able to utilize GaN and speed up the charging capability of Motorola’s smartphones to a new level. We look forward to collaborating further with Navitas and Aohai Technology, to break more records in charging speed, and offer a convenient and ultra-fast charging experience to our users.” “We are excited that GaNFast technology empowers Motorola to achieve a more powerful charger. This time, Motorola, Navitas and Aohai Technology’s collaboration reached a benchmark 125 W fast-charging solution on the new X30 Pro.” said Charles (Yingjie) ZHA, VP and GM of Navitas China: “We are dedicated to offer an eco-friendly and ultra-fast charging experience for consumers. This tiny but powerful 125 W GaN charger demonstrates our continued effort to ‘Electrify Our World™’. Navitas will continue to push the innovation of GaN technology to empower Motorola’s charging roadmap.”14.11.2022 14:00:00Novnews_2022-12-01_9.jpg\images\news_2022-12-01_9.jpghttps://navitassemi.com/navitas-powers-motorola-x30-pro-with-new-125-w-ganfast-ultra-fast-charger/navitassemi.com
Simulation Software Technology for PCB Design SolutionsKeysight Technologies announced that Altium LLC re...11077Industry NewsSimulation Software Technology for PCB Design SolutionsKeysight Technologies announced that Altium LLC recently licensed Keysight's advanced electromagnetic simulation technology to develop power analysis solutions for PCB designers. Keysight and Altium are partnering to address the needs of hardware engineers who are not power integrity experts. Reliable power distribution is a pervasive problem facing PCB designers. As integrated circuit (IC) components trend toward lower supply voltages for increased power efficiency, it becomes difficult to design a PCB power plane within shrinking tolerance limits. Designers typically build several iterations of prototypes or submit their designs to power integrity specialists. Both are sub-optimal approaches that hinder rapid design turnaround. By empowering PCB designers to find and fix problems before first prototype, they can achieve higher productivity, faster time-to-market, and greater predictability in the design process. Power Analyzer is the first offering to result from the strategic partnership between Altium and Keysight, providing interactive analysis of power integrity issues. Altium integrated Keysight's EM simulation technology with its modern graphical user interface to make power analysis fast, accurate, and easy to run. PCB designers using Power Analyzer gain insight into their power plane performance through analysis of voltage drop and current density from within their PCB layout environment.14.11.2022 13:00:00Novnews_2022-12-01_8.png\images\news_2022-12-01_8.pnghttps://www.keysight.com/us/en/about/newsroom/news-releases/2022/1114-nr22131-keysight-licenses-simulation-software-technology-to.htmlkeysight.com
Hot-Swap Controller with Programmable Digital SOA ControlInfineon Technologies introduces the XDP™ XDP710 d...11082Product ReleaseHot-Swap Controller with Programmable Digital SOA ControlInfineon Technologies introduces the XDP™ XDP710 digital controller, the first member of its intelligent hot-swap controller and protection IC family. The hot-swap and system monitoring controller IC has a 5.5 V to 80 V input voltage range with transients up to 100 V for 500 ms. It consists of three functional blocks. The first is the high-precision telemetry and digital safe operating area (SOA) control block, optimized to meet Infineon’s power MOSFETs characteristics. The second is the system resources and management block, and the third is the integrated gate driver and charge pump block for n-channel power MOSFETs such as OptiMOS™ and StrongIRFET™ families. “Infineon Technologies’ XDP710 Digital hot-swap controller met HGX Platform product requirement well. Like its unique features such as option of external FET selection using resistor strapping and boost mode. It helps that XDP710 come in small package, easy to design in” said Abhijit Datta, Sr. Power Architect and Subject Matter Expert at NVIDIA. “The XDP710 hot-swap controller is a feature-rich device with high-precision analog-front-end along with comprehensive health monitoring, telemetry, programmability, and pre-set MOSFET SOA. It addresses the challenges associated with the current design of pluggable AI server solutions,” said Shahram Mehraban, Vice President Power Management ICs at Infineon’s Power & Sensor Systems Division.14.11.2022 09:30:00Novnews_2022-12-01_13.jpg\images\news_2022-12-01_13.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2022/INFPSS202211-023.htmlinfineon.com
DC/DC Converters for E-MobilityIt is safe to say we are all feeling the wave of d...11081Product ReleaseDC/DC Converters for E-MobilityIt is safe to say we are all feeling the wave of demand for electric vehicles, charging stations, and the required support infrastructure which are becoming ever more powerful, faster, and more compact. Consequently, more power in a smaller space is required for the operation of the electronics. Compact, highly efficient, reliable and, above all, robust DC/DC converters are required to meet these high demands of e-mobility applications. These converters must be able to withstand extreme and fluctuating temperatures and function reliably in harsh environments for years. With more than two decades of experience in railroad technology, Traco Power has set the goal of bringing robust DC/DC converters with high efficiency and power density to the market, especially suited for applications in electromobility. The range of Traco Power DC/DC converters for e-mobility includes models from 1- 300 Watts. These models are available in various mechanical types such as DIN-Rail, Chassis mount and PCB mountable DIP, SIP and SMD packages and are ideal for e-mobility applications. Traco Power products are carefully designed and fully compliant with the latest Railway, Industrial and Information Technology standards.14.11.2022 08:30:00Novnews_2022-12-01_12.jpg\images\news_2022-12-01_12.jpghttps://www.tracopower.com/de/traco-powers-dcdc-converters-e-mobilitytracopower.com
Product Distribution Center in FrankfurtTexas Instruments announced plans to open a produc...11070Industry NewsProduct Distribution Center in FrankfurtTexas Instruments announced plans to open a product distribution center (PDC) in Frankfurt, Germany, by the end of 2024. The PDC will expand the company’s European footprint and enable faster deliveries to TI’s growing customer base there. “We are excited to expand our European presence in Frankfurt, as it offers a centralized location with proximity to key customers and our company’s European headquarters in Freising, Germany,” said Stefan Bruder, president of Texas Instruments Europe. “Frankfurt’s key role as a logistics hub will mean faster deliveries to our European customers who are moving quickly to bring leading-edge products to the market.” This Frankfurt location, near many of TI’s industrial and automotive customers, will enable same-day delivery in central Germany and next-day delivery capabilities to most European-based customers. The Frankfurt site will pack and ship a broad range of TI technologies to support customers across Europe. “Expanding in Frankfurt is a logical extension of TI’s presence in Europe and an important investment in our customers, providing them with even better service and support for decades to come,” Bruder said.14.11.2022 06:00:00Novnews_2022-12-01_1.jpg\images\news_2022-12-01_1.jpghttps://www.ti.com/ti.com
Collaboration to Expand Market for GaN Power ICsNavitas Semiconductor and Avnet Silica announced c...10082Industry NewsCollaboration to Expand Market for GaN Power ICsNavitas Semiconductor and Avnet Silica announced close cooperation between the two companies to grow the market in Europe for Navitas' GaNFast power ICs with GaNSense technology. The two companies will work closely together to deliver their combined complementary knowhow to bring a high level of support and expertise to customers across the EMEA region. "Navitas' unique GaN technology and its world-renowned monolithically integrated gate driver and feature set will significantly expand our 'SILICA' wide-band-gap semiconductor portfolio," said Gilles Beltran, President Avnet Silica. "Navitas has a depth of expertise in power semiconductors that is unrivalled across the industry for this kind of advanced technology. We envisage this cooperation will bring huge benefits for customers operating at the cutting edge of power system architectures in a wide selection of applications." "We chose to work with Avnet Silica as one of the premier experts in semiconductor distribution in Europe," said David Carroll, Senior Vice President of Worldwide Sales at Navitas. "The combination of our highly differentiated solutions together with Avnet Silica's expertise in technology markets will further support designers and engineers to meet ever more stringent efficiency and size requirements and regulations. With our highly experienced technical team and our European applications lab, together, we can support customers with the best possible solutions and fastest time-to-market."11.11.2022 18:00:00Novnews_2022-11-15_13.jpg\images\news_2022-11-15_13.jpghttps://navitassemi.com/navitas-semiconductor-and-avnet-silica-announce-agreement-for-close-collaboration-to-expand-market-for-advanced-gan-power-ics/navitassemi.com
Investment Boosts Existing Power Management ExpertiseNexperia announced a broadening to its portfolio o...11074Industry NewsInvestment Boosts Existing Power Management ExpertiseNexperia announced a broadening to its portfolio of power management products to include energy harvesting solutions. Energy can be harvested from light, vibrations, radio waves or temperature gradients and can therefore be used to replace batteries in low-power applications like smart wearables and autonomous wireless sensor nodes. The expansion of Nexperia’s expertise comes through the acquisition of Netherlands-based Nowi, founded in 2016. Nowi’s PMICs combine small PCB footprint with low BOM cost and the best average harvesting performance. The manufacturing capacity and capability of Nexperia as well as its global infrastructure will ensure that together, Nowi will be able to speed the production of these solutions enabling higher volume production and shipping by the end of 2022 and early 2023. “Nowi represents a strategically important investment because energy harvesting is the perfect complement to Nexperia’s existing power management capabilities,” says Dan Jensen, General Manager Business Group Analog & Logic ICs at Nexperia. “This decision means Nexperia can now offer customers a sustainable alternative to battery power for their products, that will be available in the market quickly. The team at Nowi has built a strong foundation on which we are only looking to build and facilitate the ability to scale – both from the production side, but also the business and the team. We are excited to be bringing the Nowi team into the Nexperia family.”11.11.2022 10:00:00Novnews_2022-12-01_5.jpg\images\news_2022-12-01_5.jpghttps://www.nexperia.com/about/news-events/press-releases/Nexperia-invests-in-sustainable-alternatives-to-batteries.htmlnexperia.com
650V and 750V SiC MOSFETs for Industrial and Electric Vehicle ApplicationsAlpha and Omega Semiconductor announced its 650V a...10089Product Release650V and 750V SiC MOSFETs for Industrial and Electric Vehicle ApplicationsAlpha and Omega Semiconductor announced its 650V and 750V SiC MOSFET platform for both industrial and automotive applications. The 650V SiC MOSFETs are ideal switching solutions for industrial applications such as solar inverters, motor drives, industrial power supplies, and new energy storage systems, while the AEC-Q101 qualified 750V SiC MOSFET line is targeted for the high-reliability needs in electric vehicle (EV) systems such as the on-board charger (OBC) and the main traction inverter. The AOM015V75X2Q 750V aSiC MOSFET expands on the existing second-generation 1200V aSiC MOSFET and diode products with an RDS(ON) down to 15mW in a standard TO-247-4L package while maintaining a recommended +15V gate drive voltage to ensure the broadest compatibility with existing gate driver solutions. Due to the minimized internal gate resistance and optimized cell design, AOS designed these devices to exhibit ultra-fast switching speeds that are fully controllable with an external gate resistor. This benefit is also noticeable in standard switching figures-of-merit (FoM) such as RON x QGD and RON x QRR that are improved compared to existing 750V SiC MOSFET solutions.10.11.2022 12:30:00Novnews_2022-11-15_20.png\images\news_2022-11-15_20.pnghttp://www.aosmd.com/res/news/news-article-1668098674781/AOS%20SiC_MOSFET%20AOM015V75X2Q.pdfaosmd.com
Isolated Power Module in a MicroModule PackageWürth Elektronik has extended the product families...10091Product ReleaseIsolated Power Module in a MicroModule PackageWürth Elektronik has extended the product families of its MagI³C power modules with the MagI³C-FIMM Fixed Isolated MicroModule. It combines the features of an isolated power module with those of a MicroModule in an LGA-7 package and measures just 9 mm x 7 mm x 3.1 mm. The isolation capacitance between the primary and secondary windings is typically just 8pF. The 1 W output power is maintained up to an ambient temperature of 100°C without derating. It represents one of the best modules in the portfolio of fully isolated modules-with an efficiency up to 91%. MagI³C Power Modules are fully integrated DC/DC converters with switching power stage, controller, inductor as well as input/output capacitors. It requires no external circuitry-all components, including CIN and COUT, are integrated, allowing quick and easy circuit design without transformer expertise. MagI³C-FIMM boasts a small size and high efficiency, as well as an extended operating ambient temperature range up to 125°C. The module offers continuous short-circuit protection and overvoltage protection up to 3000 V. MagI³C-FIMM is suitable for applications in data acquisition, test and measurement technology, for supplying interfaces and microcontrollers, and other requirements in industrial electronics, to name but a few. It provides functional isolation for overvoltage protection and minimizes ground loops and ground shifts as well as noise in the signal path or sensor systems. According to the manufacturer's measurements, the low radiated EMI with tested filter combination is below the EN55032 Class B / CISPR-32 limits. The MicroModule is certified according to the current UL standard UL62368-1.09.11.2022 14:30:00Novnews_2022-11-15_22.jpg\images\news_2022-11-15_22.jpghttps://www.we-online.com/web/en/wuerth_elektronik/news_weg/News_Detail_WE_Gruppe_138302.phpwe-online.com
GaN Devices Solve the Challenge of Solar Power InstallationSolarnative uses GaN devices in its microinverter ...10086Product ReleaseGaN Devices Solve the Challenge of Solar Power InstallationSolarnative uses GaN devices in its microinverter to achieve high power density. The Power Stick is the smallest inverter in the world, with dimensions of 23.9 by 23,2 by 404 millimeters. With an AC output power of 350 W, the volume of 0.19 liters corresponds to a power density of 1.6 kW per liter. By comparison, the IQ 7A microinverter from a market leading supplier delivers 349 watts with a volume of 1.12 liters, corresponding to 0.31 kW per liter – not even one-fifth of the Solarnative device. Despite the extreme size reduction, the efficiencies are quite comparable, at 96.0 percent for the Power Stick and 96.5 percent for the IQ 7A. This reduction in construction volume was necessary because Solarnative wants to offer its inverter not only as an external device (Power Stick 350-a) but also as a version for module manufacturers (Power Stick 350-i) for integration into the module frame. The Power Stick is recommended for modules between 330 and 440 W. "Solar applications are putting higher demands on power devices for thermal, reliability, and power density, and silicon-based power conversion is not keeping pace," said Alex Lidow, CEO of EPC. "We are delighted to work with Solarnative to implement GaN as 3rd generation of semiconductors into their microinverters, allowing customers to simplify installation for easier microinverters and green energy adoptions."09.11.2022 09:30:00Novnews_2022-11-15_17.png\images\news_2022-11-15_17.pnghttps://epc-co.com/epc/events-and-news/news/artmid/1627/articleid/3083/solarnative-uses-gan-devices-to-solve-the-challenge-of-solar-power-installation-with-its-new-microinverter-that-integrates-into-the-module-frameepc-co.com
Small Cell Repeater Power SolutionABB Power Conversion is helping to energize the ro...10084Product ReleaseSmall Cell Repeater Power SolutionABB Power Conversion is helping to energize the rollout of 5G repeaters with solutions like its RP450 power system. The all-in-one solution meets the power density, footprint, and availability needs of 5G repeaters, helping to extend network coverage. The pole-mounted RP450 power system is specifically designed for 5G repeater applications. It consists of an integrated CLP-series rectifier, six-position DC distribution, surge protection, and an AC input breaker within an IP65-rated, 6.2-inch wide by 5-inch deep by 18.5-inch tall NEMA 3R enclosure. The power system features an AC service-rated 240-volt (V) AC input and -48 VDC output and can provide peak efficiencies of over 90%. It can be configured in a variety of ways, including with single or redundant rectifier options and with fuse and breaker distribution options. There is also a connection for an additional battery to be added in the future, should a user's power needs change. The built-in AC service entrance in the RP450 helps eliminate the need for a separate AC service entrance breaker box to be mounted on the pole to serve the repeaters. Previously, this separate equipment would need to be installed on a power pole, which could result in added lease fees.09.11.2022 07:30:00Novnews_2022-11-15_15.jpg\images\news_2022-11-15_15.jpghttps://www.abbpowerconversion.com/about/news/press-releases/abb-helps-energize-5g-rollout-with-small-cell-repeater-power-solutionabbpowerconversion.com
Partners Foster Sustainable MobilityDisruptive technologies are driving the mobility t...10079Industry NewsPartners Foster Sustainable MobilityDisruptive technologies are driving the mobility transformation: to accelerate green and smart mobility, Infineon Technologies is collaborating with REE Automotive. The automotive technology company developed the REE modular Electric Vehicle platform which serves as a foundation for a wide variety of electric vehicles types, from robotaxis and commercial vans all the way to electric passenger shuttles. REEcorner packs critical vehicle components into a compact module positioned between the chassis and the wheel, enabling REE to build fully flat EV platforms. REE's flagship P7 EV platform is based on four REEcorners with REE's x-by-wire technology. The ultra-modular P7 EV platform offers greatest interior space for passengers, cargo and batteries as compared to vehicles with an internal combustion engine (ICE) or EVs of similar size. REE's design and technology affords auto manufacturers, delivery and logistic companies and new technology players vast design freedom allowing them to build vehicles tailored to their exact needs. "Infineon is an important forerunner in the mobility transformation. The REEcorner technology demonstrates the breadth and flexibility of our high-quality semiconductor technologies and system expertise," said Peter Schiefer, President of the Automotive Division of Infineon. "Innovative and modular EV platform designs add new options for both established and emerging industry players to further accelerate electromobility."08.11.2022 15:00:00Novnews_2022-11-15_10.jpg\images\news_2022-11-15_10.jpghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2022/INFXX202211-020.htmlinfineon.com
3D Magnetic Sensor for Vehicle Safety and ADAS ApplicationsAllegro MicroSystems announced the A31316 3D Hall-...10090Product Release3D Magnetic Sensor for Vehicle Safety and ADAS ApplicationsAllegro MicroSystems announced the A31316 3D Hall-effect position sensor, the latest addition to the company's 3DMAG line of 3D sensors. Offered in an 4 × 4 mm body PCB-less package, this sensor is ideal for automotive safety and advanced driver assistance systems (ADAS) applications that require high levels of flexibility and reliable performance in harsh conditions such as powertrain and chassis applications, as well as industrial applications that require linear or rotary sensing. The A31316 3D Hall sensor eliminates the need for a PCB or other external components. This sensor integrates the die and capacitors in a single package to address the need for high-performance, compact position sensors that are robust to these environments. For vibration-robust designs, the A31316 pins can be welded or soldered directly to connector leadframes and can be overmolded or potted for a tight seal. These integration options reduce the ability for contaminants and vibration to affect performance and can bring new design flexibility to spaces where mechanical vibration and contamination are potential issues. Designed for both rotary and long-stroke linear applications, the A31316 maintains high angle accuracy across the full Grade 0 temperature range (–40°C to 150°C). Its flexible calibration table (33 fixed points or 22 freely placed points) enables options that can reduce the time and complexity of end-of-line calibration and minimize errors due to mechanical misalignment. The A31316 contains advanced on-chip diagnostic features to ensure reliable, safe operation.08.11.2022 13:30:00Novnews_2022-11-15_21.jpg\images\news_2022-11-15_21.jpghttps://www.allegromicro.com/en/about-allegro/news-room/2022/a31316-prallegromicro.com
Industrial Automation Company with Complete Motion Solution PackageInovance offers a complete motion solution package...11079Product ReleaseIndustrial Automation Company with Complete Motion Solution PackageInovance offers a complete motion solution package that includes motion controllers, servo drives with EtherCAT and servo motors, HMIs, and LV and MV AC drives. At SPS 2022, Inovance launched four products: the Easy Series PLC, the GL20 I/O modules, the AC703 IPC motion controller, and the SV670 servo drive. The Easy Series is a high performance, compact, EtherCAT-enabled PLC. The highly compact GL20 I/O modules are 2/3 smaller than Inovance’s previous generation product, and offer a minimum cycle time of 125 microseconds. The AC703 IPC motion controller offers a CODESYS (IEC 61131-3) programming environment, up to 32 axes control, a Webvisu server, EoE support, IIoT capability and safe shut-down (without the need for an additional UPS). Finally, the SV670 single-axis pulse servo drive offers high performance, enhanced functionality, and true flexibility. Meanwhile, alongside the product launches, Inovance offered a preview of the SV680 servo drive with advanced functional safety functions - including FSoE - and extremely high performance, and also presented the MD800 AC multidrive at SPS for the first time. While MD800 was launched late last year, it has never been seen at SPS until now due to last year’s cancellation of the show. MD800 is a compact AC multidrive that is designed to answer the call of European OEMs for reduced installation costs and smaller machine cabinets.08.11.2022 06:30:00Novnews_2022-12-01_10.png\images\news_2022-12-01_10.pnghttps://www.inovance.eu/news/details/inovance-launches-plc-servo-at-nurembergs-sps-show-166inovance.eu
Responding to the Needs of Level 3 EV Charger DesignersIn response to the rapidly growing demand for high...10078Industry NewsResponding to the Needs of Level 3 EV Charger DesignersIn response to the rapidly growing demand for higher-performance DC link capacitors for EV chargers, Cornell Dubilier Electronics (CDE) has expanded its standard-product offerings and brought to light its advanced custom capacitor capabilities. While the inverter circuitry at the heart of EV charging stations may seem familiar to design engineers, there are operational, environmental, and mechanical demands that make Level 3 EV charging stations unique. The latest designs are pushing voltages and current handling to higher levels to shorten recharge times. According to Bob Kropiewnicki, Director of Applications Engineering of CDE, "We've found that design engineers engaged in Level 3 charger projects are faced with a balancing act to mitigate significant circuit harmonics that cause heating problems. Adequate input and output filtering, strategic current paths, and reducing inductance and ESR are all concerns." Kropiewnicki continued, "All too often, the DC link capacitor is an afterthought which forces those problems to be dealt with in ways that are more complex than necessary. A better solution is to focus on the requirements of the DC link as early as possible in the design process. We are able to predict performance by using our advanced capacitor modeling based on project application conditions."07.11.2022 14:00:00Novnews_2022-11-15_9.jpg\images\news_2022-11-15_9.jpghttps://www.cde.com/new-product/ev-charging/cde.com
Winners of the 2022 Innovation ChallengeKeysight Technologies announced the winners of the...10080Industry NewsWinners of the 2022 Innovation ChallengeKeysight Technologies announced the winners of the 'Keysight Innovation Challenge 2022'. The six finalist teams presented their innovations to a panel of esteemed judges in Santa Rosa, Calif. "It was fascinating to see the wide range of innovative solutions each student team created when posed the same challenge: to design an IoT device that will help the world reach net zero," said Jeff Harris, Vice President of Portfolio and Corporate Marketing at Keysight, who also served as a judge and co-sponsor of the Keysight Innovation Challenge. "Each team looked at the question from a different angle and formed a unique solution. I'm excited for the future when we see this level of innovation and enthusiasm from our next generation of engineers." "We added another layer of criteria to this year's challenge, requiring that all teams were woman-led and had at least equal representation of women to men," said Renee Morad, Innovation Challenge program lead. "It was inspiring to see such diversity on the stage and to shine a spotlight on today's women in STEM who are leading their teams and leading the way for future generations of innovators."04.11.2022 16:00:00Novnews_2022-11-15_11.png\images\news_2022-11-15_11.pnghttps://www.keysight.com/us/en/about/newsroom/news-releases/2022/1104-nr22123-keysight-announces-winners-of-the-2022-innovation-c.htmlkeysight.com
Portable Signal Simulator/Calibrator Wins Silver in LEAP Award's "Test & Measurement" CategoryMTI Instruments by Vitrek announces that its 1520 ...10081Industry NewsPortable Signal Simulator/Calibrator Wins Silver in LEAP Award's "Test & Measurement" CategoryMTI Instruments by Vitrek announces that its 1520 Signal Simulator and Calibrator is a LEAP Award winner. The 1520 – offering WiFi operation, ergonomic design, visualization and 10-hour (max) battery life – won silver in the "test & measurement" category. According to the award organizer, the LEAP (Leadership in Engineering Achievement Program) Awards "celebrate the most innovative and forward-thinking products serving the design engineering space." The prestigious award used an independent judging panel comprising OEM design engineers and academics to select stand-out products in 14 engineering categories. "We are quite pleased to win the LEAP Award in the test and measurement category," said Moshe Binyamin, President of MTI Instruments. "The 1520 combines ease of use with remote operation that technicians have been waiting for in a high precision portable signal simulator. Rugged, portable and versatile, it's also ideal for use in avionics applications where it brings laboratory-grade signal accuracy directly onto the flightline and to the test-cell." The 1520 Portable Signal Simulator/Calibrator is NIST-traceable signal source providing laboratory-grade precision for testing and calibrating sensor-driven systems in the field. It features a glove-friendly, two-handed controller and a color touchscreen for generating and viewing high-precision graphical waveforms. Capable of remote control via a WiFi-connected smartphone or tablet, one technician can use the 1520 to conduct tests that would otherwise require two techs to perform.03.11.2022 17:00:00Novnews_2022-11-15_12.jpg\images\news_2022-11-15_12.jpghttps://mtiinstruments.com/products/signal-generator/1520-portable-signal-simulator/mtiinstruments.com
Software and Hardware Ecosystem for Motor ControlToshiba Electronics Europe has introduced MCU Moto...11088Product ReleaseSoftware and Hardware Ecosystem for Motor ControlToshiba Electronics Europe has introduced MCU Motor Studio, bringing together PC-based design tools, microcontroller firmware, and low-cost evaluation hardware to accelerate time to market for motor-control applications hosted on Toshiba TXZ+™4A microcontrollers (MCUs). The MCU Motor Studio firmware suite supports all common energy-efficient motor control strategies including sinewave commutation and field-oriented (vector) control (FOC), sensorless or with precise-position sensing. There is a choice of single-shunt and three-shunt current detection, and support for PWM frequencies up to 156kHz. The firmware caters for all popular motor types, including brushless DC (BLDC) and permanent-magnet synchronous motors (PMSM). Switched reluctance motors (SRM) and asynchronous AC motors are also supported. Users can control up to three independent motor channels with a single MCU, depending on the variant selected. The TXZ+™4A Series, based on the Arm® Cortex®-M4 core, comprises the M4K and M4M Groups, which enable motor control even with low-cost 64-pin MCUs. Dedicated motor-control features provided on-chip include a hardware vector engine, high-resolution advanced encoder for servo motors, and self-diagnostics that simplify meeting functional-safety standards such as IEC 60730 class B. The firmware suite provides selectable functionality that lets users quickly configure controls such as zero-current-point detection, initial motor-position detection, and commonly used stop controls including rapid braking. Further functions include magnetic-field stall recovery, load-dependent speed reduction, advanced rotor control with sensorless precise positioning, and linear motion control with sensor-based precise positioning.03.11.2022 15:30:00Novnews_2022-12-01_19.jpg\images\news_2022-12-01_19.jpghttps://toshiba.semicon-storage.com/eu/company/news/2022/11/micro-20221103-1.htmltoshiba.semicon-storage.com
Wide-Bandgap Power at Silicon Cost – YESvGaN ProjectCan we contribute to the worldwide energy challeng...10073Industry NewsWide-Bandgap Power at Silicon Cost – YESvGaN ProjectCan we contribute to the worldwide energy challenge by maximizing the efficiency in power conversion at a low cost? The answer is: YESvGaN! So, the goal of the YESvGaN consortium is to create a new class of vertical power transistors based on gallium nitride (GaN), so-called vertical GaN membrane transistors. These power devices combine the efficiency of wide-bandgap (WBG) semiconductors with the lower cost of the established silicon semiconductor technology. Within YESvGaN, the development of the required new technology, all the way from wafer to application, is covered. Since the project launched on May 1, 2021, impressive developments have been made by the project consortium, consisting of 23 European partners. Vertical device demonstrators with FinFET architectures and Schottky diodes – being important building blocks for a novel vertical membrane transistor technology – have been created successfully. Also, vertical layer stacks have been grown on silicon and sapphire with a diode breakdown voltage exceeding 500 V. This is a major step to reach the overall project goal of 1200 V blocking voltage on low-cost silicon or sapphire substrates. As a result, the market for future high-performance applications, e.g., in the automotive industry, could be accessible for the GaN semiconductor material.03.11.2022 09:00:00Novnews_2022-11-15_4.jpg\images\news_2022-11-15_4.jpghttps://www.iisb.fraunhofer.de/en/press_media/press_releases/pressearchiv/archiv_2022/YESvGaN.htmliisb.fraunhofer.de
15 Watt DC/DC Converters (DIP-16)The Traco TEL 15N & TEL 15WIN are two series of is...10093Product Release15 Watt DC/DC Converters (DIP-16)The Traco TEL 15N & TEL 15WIN are two series of isolated 15 Watt converters which come in an compact DIP-16 metal package. The design purpose of these series was to miniaturized low power DC/DC converters to the maximum without sacrificing high efficiency. They solidify the new standard for power density with 4.51 W/cm3 and effectively double the power density compared to 15 Watt converters in DIP-24 packages. The TEL 15N and TEL 15WIN offer wide 2:1 or 4:1 input voltage ranges respectively and feature a high efficiency of up to 88% which enables an operation temperature of up to +55°C at full load and up to 85°C with 50% load. For extended temperature requirements, a version with a fully integrated heatsink casing is available allowing the converter to operate up to +70°C without derating. The converters also have an internal input filter to comply with conducted emission standard EN 55032 class A. Overall they feature an economical solution for space critical and cost sensitive applications in instrumentation, IT and industrial electronics.02.11.2022 16:30:00Novnews_2022-11-15_24.jpg\images\news_2022-11-15_24.jpghttps://www.tracopower.com/de/tel-15win-and-tel15win-hs-series-15-watt-dcdc-converter-dip-16-packagetracopower.com
Long-Term Silicon Carbide (SiC) Supply AgreementQorvo and SK Siltron CSS, a semiconductor wafer ma...10070Industry NewsLong-Term Silicon Carbide (SiC) Supply AgreementQorvo and SK Siltron CSS, a semiconductor wafer manufacturer, announced they have finalized a multi-year supply agreement for silicon carbide (SiC) bare and epitaxial wafers. This agreement will promote domestic semiconductor supply chain resilience and a greater ability to support the rapidly rising demand for advanced silicon carbide solutions, specifically in the automotive market. This agreement will also provide end-user customers a level of protection and confidence as customers adopt Qorvo's industry leading Gen 4 SiC FET solutions. SiC devices are more efficient at handling high powers and conducting heat than traditional silicon. When used in electric vehicle (EV) system components, this allows for a more efficient transfer of electricity from the battery to the motor, increasing the driving range of an EV by 5% to 10%.02.11.2022 06:00:00Novnews_2022-11-15_1.jpg\images\news_2022-11-15_1.jpghttps://www.qorvo.com/newsroom/news/2022/qorvo-and-sk-siltron-css-announce-long-term-silicon-carbide-sic-supply-agreementqorvo.com
Henrik Tölander Appointed as COOSweGaN AB announces it has added a role to its exe...10077PeopleHenrik Tölander Appointed as COOSweGaN AB announces it has added a role to its executive team. Newly appointed Chief Operating Officer, Henrik Tölander, joined SweGaN on October 31st. The management role supports the company's ambitious growth strategy to serve explosive global market demand and follows the company's recently completed Series A financing round. "Bringing extensive experience from the manufacturing industry, including nearly a decade at  Fortune 500 company Siemens, Henrik will bring valuable competence for cultivating and executing the next phases of SweGaN's manufacturing road map and expansion plans," says Jr-Tai Chen, "Ted", CEO at SweGaN. "In Henrik I believe we have secured the industry and leadership experience needed to scale SweGaN manufacturing to the next level. On behalf of the SweGaN team, I am pleased to welcome him on board." Henrik Tölander, COO at SweGaN, "Joining SweGaN at this key juncture is an exciting opportunity as SweGaN growth plans target new production facilities and team expansion to deliver large quantities of epi-wafers annually to supply a demanding and sophisticated semiconductor market. "I am inspired by what CEO and co-founder Ted Chen and the skilled team at SweGaN have achieved in developing world-class materials and a high-profile international investor portfolio. I look forward to working together in establishing SweGaN as a major global player – an industry leader in pole position to take a major share of the semiconductor materials market.01.11.2022 13:00:00Novnews_2022-11-15_8.jpg\images\news_2022-11-15_8.jpghttps://swegan.se/2668/swegan.se
High-Surge-Rating SMD TVS DiodesLittelfuse announced the SMTOAK2 TVS Diode Series....10085Product ReleaseHigh-Surge-Rating SMD TVS DiodesLittelfuse announced the SMTOAK2 TVS Diode Series. Many of today's high-power, high-surge-rating TVS diodes are only available in axial leaded packages. The compact, 2 kA 8/20 µs rated, surface-mount package SMTOAK2 TVS Diode Series allows electronics designers to achieve a more robust transient voltage, overvoltage protection, and lightning protection system while using less printed circuit board (PCB) space. "Global trends and regulatory requirements for higher efficiency power supplies, high-current and high-speed MOSFET/IGBT designs are increasingly in demand," said Ben Huang, Senior Product Marketing Manager, at Littelfuse. "These fast-switching designs need protection against inductive kickback. By using the high-power SMTOAK2 TVS Diode Series, designers can achieve high reliability and robustness while reducing the required board space and assembly time."01.11.2022 08:30:00Novnews_2022-11-15_16.jpg\images\news_2022-11-15_16.jpghttps://www.littelfuse.com/about-us/news/news-releases/2022/new-littelfuse-high-surge-rating-smd-tvs-diodes-50-percent-smaller-than-other-surface-mounted-solutions.aspxlittelfuse.com
Silicon Carbide Semiconductor Technology Supply for Electric VehiclesJaguar Land Rover and Wolfspeed announced a strate...10075Industry NewsSilicon Carbide Semiconductor Technology Supply for Electric VehiclesJaguar Land Rover and Wolfspeed announced a strategic partnership to supply Silicon Carbide semiconductors for next generation electric vehicles, delivering increased powertrain efficiency and extended driving range. Under its 'Reimagine' strategy, Jaguar Land Rover is transforming to an electric-first business, to become carbon net zero across its supply chain, products, services, and operations by 2039. Wolfspeed's Silicon Carbide technology will be used specifically in the vehicles' inverter, managing the transfer of power from the battery to the electric motors. The first Range Rover vehicles with this advanced technology will be available from 2024, and the new all-electric Jaguar brand the following year. The partnership builds on Wolfspeed's existing relationship with the race-winning Jaguar TCS Racing team competing in the ABB FIA Formula E World Championship, where its advanced Silicon Carbide technology has been used to accelerate on-track efficiency and performance. The agreement is the latest in Jaguar Land Rover's programme of establishing strategic partnerships for its future modern luxury vehicles: in February 2022, Jaguar Land Rover announced a partnership with NVIDIA focused on software-defined, advanced automated driving systems for next-generation vehicles starting in 2025. Wolfspeed President and CEO, Gregg Lowe, said: "Wolfspeed is proud to partner with Jaguar Land Rover, supporting its bold commitment to electrify its iconic brands by using Silicon Carbide's superior performance, efficiency and range. The energy efficiency of Silicon Carbide will play an essential role as Jaguar Land Rover pursues its own zero carbon goals, and as the world transitions to an all-electric transportation future."31.10.2022 11:00:00Octnews_2022-11-15_6.jpg\images\news_2022-11-15_6.jpghttps://www.wolfspeed.com/company/news-events/news/jaguar-land-rover-partners-with-wolfspeed/wolfspeed.com
MOSFET Family with an Integrated Fast Body DiodeTo address contemporary market needs for improved ...10092Product ReleaseMOSFET Family with an Integrated Fast Body DiodeTo address contemporary market needs for improved form factors and energy-efficient products, Infineon Technologies has developed a CoolMOS PFD7 high-voltage MOSFET family, setting a new benchmark in 950 V superjunction (SJ) technology. The 950 V series combines performance with ease of use and features an integrated fast body diode ensuring a robust device and in turn reduced bill-of-material (BOM). Tailored to ultrahigh-power density as well as the highest efficiency designs, the products are primarily addressing lighting systems, as well as consumer and industrial SMPS applications. The products are suitable for flyback, PFC, and LLC/LCC designs, including half- or full-bridge configurations making commutation robust and reliable. By integrating an ultra-fast body diode with ultra-low reverse recovery charge (Q rr), they offer hard commutation ruggedness and reliability. This makes it the most robust SJ MOSFET in this voltage class, enabling usage across all topologies in the targeted applications. In addition, significantly reduced switching losses (E OSS, Q OSS, and Q g) improve efficiency in hard- and soft-switching applications and result in up to 4°K lower MOSFET temperature compared to 900 V CoolMOS C3 SJ MOSFET. The products improve light- and full-load PFC efficiency by more than 0.2 percent while matching the performance with regards to LLC efficiency, contributing to a greener world.27.10.2022 15:30:00Octnews_2022-11-15_23.jpg\images\news_2022-11-15_23.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2022/INFPSS202210-013.htmlinfineon.com
AC/DC Power Supply Series Provides up to 130W OutputExpanding their AC/DC range, the RECOM RACM130E-K ...10088Product ReleaseAC/DC Power Supply Series Provides up to 130W OutputExpanding their AC/DC range, the RECOM RACM130E-K series in a 2"x4" footprint is now available with 130W peak output power from a wide 85-264Vac input. Tightly regulated single outputs available are 12V, 15V, 24V, 36V and 48VDC. Safety certifications include 2MOPP/250Vac medical for 'B' or 'BF' applications to IEC/EN/ANSI/AAMI ES 60601-1, as well as IEC/EN 62368-1, IEC/EN 60335-1 and IEC/EN 61558-1 for industrial, test and measurement, IT and household use, all to 4000m altitude. On-board dual input fusing is included. EN 55032/35 'Class B' EMC emissions limits are met with a good margin and the parts are suitable for installation in surge Class 3 and Over-Voltage Category OVC III environments. Efficiency is particularly high at 90% typical, depending on variant and is maintained down to low loads for ErP compliance, while no-load losses are less than 200mW at 230Vac. Operating temperature range is -40°C to +90°C with derating. The RACM130E-K series is available as an open card with 2"x4" footprint and with an optional metallic enclosure and will suit a wide variety of cost-sensitive applications, where a high specification is also required.27.10.2022 11:30:00Octnews_2022-11-15_19.jpg\images\news_2022-11-15_19.jpghttps://recom-power.com/en/company/newsroom/news/rec-n-racm130e-k-ac!sdc-provides-130w-230.html?3recom-power.com
Shielded Transformers for Ultrasonic ApplicationsTDK Corporation presents the B78302A* series of co...10087Product ReleaseShielded Transformers for Ultrasonic ApplicationsTDK Corporation presents the B78302A* series of compact EPCOS transformers with E5 cores for ultrasonic applications. It comprises three types with transformation ratios between 1:1:10.8 and 1:1:15.3. Depending on the type, the transformers in SMD design offer inductance values between 2 mH and 4 mH and are suitable for frequencies from 50 kHz to 300 kHz. The AEC-Q200 qualified components have very compact dimensions of only 8.1 x 7.0 x 7.0 mm and are shielded by a counter-winding for better interference suppression. The permissible temperature range is between -40 °C and +125 °C. The transformers are used in ultrasonic applications for optimum impedance matching between the driver IC and the ultrasonic transmitter or receiver. Typical applications include parking aids, industrial robots, drones and logistics robots, Automated Guided Vehicles (AGV) and systems for level measurement.27.10.2022 10:30:00Octnews_2022-11-15_18.jpg\images\news_2022-11-15_18.jpghttps://www.tdk-electronics.tdk.com/en/373388/company/press-center/press-releases/press-releases/tdk-offers-compact-shielded-transformers-for-ultrasonic-applications/3113196tdk-electronics.tdk.com
Next-Generation GaN E-Mobility TechnologyVisIC Technologies and KYOCERA AVX Salzburg announ...10072Industry NewsNext-Generation GaN E-Mobility TechnologyVisIC Technologies and KYOCERA AVX Salzburg announce the expansion of their collaboration. The partners are combining their strengths in packaging, assembly, and GaN wafer technologies with the aim of providing high current components for high-voltage applications such as charging and e-drivetrain. The collaboration expansion aims to fulfill the automotive industry demands for reliable and highly efficient power solutions that will save on EV costs. With its thermal resistance, discrete GaN devices and half-bridge modules will be essential for future On-Board-Chargers (OBC) and traction inverters, thus optimizing weight, size, costs, and driving range. Based on VisIC's 2nd generation, lowest RDS (on) D3GaN (Direct Drive D-Mode) switches, the power module, which will provide power density and performance, has already been adopted for the next generation inverter sample of a major 1st tier automotive manufacturer. In addition to these collaboration developments, the companies have also achieved an approach to high-voltage battery disconnection, based on GaN power switches, through effective cooperation in a very short timeframe. With the fastest switching time, the current and, therefore, thermal stress of the battery and board net, can be limited. This design will be available for lead projects this year.26.10.2022 08:00:00Octnews_2022-11-15_3.jpg\images\news_2022-11-15_3.jpghttps://visic-tech.com/next-generation-gan-e-mobility-technology-kyocera-avx-salzburg-and-visic-technologies-expand-their-collaboration/visic-tech.com
Support for Planar Magnetics in Power Supply Design ToolPI Expert now features a planar magnetics builder ...10083Product ReleaseSupport for Planar Magnetics in Power Supply Design ToolPI Expert now features a planar magnetics builder that generates an application-specific planar transformer design complete with printed circuit board (PCB) manufacturer-ready documentation and Gerber files. The latest version of PI Expert now also includes support for Power Integrations' entire InnoSwitch3 flyback switcher IC family. Trevor Hiatt, director of channel marketing at Power Integrations said: "Planar transformers facilitate low-profile flyback power supplies. With our new planar magnetics builder, designers can incorporate a sophisticated low-profile transformer in minutes. No other design tool can do this." The magnetics designer function in PI Expert provides full planar transformer information including stack specification, vertical and horizontal PCB construction, trace parameters, current density information and layer resistance. The tool automatically incorporates user-specified creepage and clearance distances necessary to meet safety isolation standards. An intuitive GUI provides vertical and horizontal stack construction and a bird's eye view for all layers. The tool also outputs detailed manufacturing information of the planar solution, enabling users to go directly from design to fabrication. The tool provides a comprehensive database of planar cores and components to simplify design and can also accept custom core geometries. PI Expert automatically optimizes the planar transformer design to match the power supply specification, incorporating additional winding layers and adjusting trace geometries as appropriate.25.10.2022 06:30:00Octnews_2022-11-15_14.jpg\images\news_2022-11-15_14.jpghttps://investors.power.com/news/news-details/2022/Power-Integrations-Debuts-Support-for-Planar-Magnetics-in-PI-Expert-Power-Supply-Design-Tool/default.aspxpower.com
Global Distributor of the YearMouser Electronics is very pleased to announce it ...10076Industry NewsGlobal Distributor of the YearMouser Electronics is very pleased to announce it has received the 2022 Global Distributor of the Year - Pinnacle Award from Qorvo. Chosen by Qorvo's executive sales team, the award recognizes Mouser for its role in strengthening Qorvo's leadership in cellular and broadband networking, the Internet of Things, and defense and aerospace applications. "We are pleased to congratulate Mouser Electronics and express our gratitude for their hard work in supporting Qorvo's growth throughout the world," said Rodney Hsing, Sr. Sales Director of Major Defense Accounts and IDP Global Distribution at Qorvo. "This award recognizes the important role Mouser has played as our lead internet channel partner, helping us to grow market share in key technology areas, ensuring that all engineers have access to our exceptional connectivity and power devices." "We are truly grateful for our ongoing partnership with Qorvo, and we are honored to receive the Global Distributor of the Year award for the second time," said Jeff Newell, Senior Vice President of Products at Mouser Electronics. "This award reflects the committed efforts of our team in efficiently promoting and distributing Qorvo's solutions to our global customer base." Mouser was previously named Global Distributor of the Year by Qorvo in 2018. Together, Mouser and Qorvo deliver a range of solutions for next-generation applications, including 5G, Wi-Fi, ultra-wideband technology, and power management.24.10.2022 12:00:00Octnews_2022-11-15_7.jpg\images\news_2022-11-15_7.jpghttps://eu.mouser.com/newsroom/publicrelations-qorvo-distributor-year-award-2022final/mouser.com
Bob Feng Appointed VP & GM of ChinaEmpower Semiconductor is pleased to announce the a...10074PeopleBob Feng Appointed VP & GM of ChinaEmpower Semiconductor is pleased to announce the appointment of Mr. Bob Feng as Vice President & General Manager of China to support the growing demand for Empower's IVR and advanced E-CAP silicon capacitor products in the Greater China region. Mr. Feng has over sixteen years of experience in semiconductor sales, with a strong emphasis on power management and customer service in China and the Asia Pacific market. His background and network of relationships will prove to be invaluable as Empower continues its aggressive growth goals in the region. "Mr. Feng will be joining the company at a time of great growth and expansion, as we begin to further expand our product portfolio, including the recently announced IVR and E-CAP technology families," said Steve Shultis, Senior Vice President WW Sales and Marketing at Empower Semiconductor. "Bob's experience building high-performing teams of executives, along with his expertise in growing technology companies and developing next-generation products will be a vital asset to Empower as we expand our growth in the region." Prior to joining Empower, Mr. Feng was senior director of sales and country manager at Power Integrations.  His earlier experience includes senior sales roles focusing on the China region at Samsung Electronics and STS Microelectronics.  He earned a bachelor's degree in automation from Xidian University and currently working on the completion of an EMBA at Xi'An Jiaotong University.24.10.2022 10:00:00Octnews_2022-11-15_5.jpg\images\news_2022-11-15_5.jpghttps://www.empowersemi.com/empower-semiconductor-appoints-new-vp-gm-of-china/empowersemi.com
Ranbir Singh Inducted into Engineering Hall of FameNavitas Semiconductor announced that Dr. Ranbir Si...10071PeopleRanbir Singh Inducted into Engineering Hall of FameNavitas Semiconductor announced that Dr. Ranbir Singh, EVP of the company's GeneSiC business unit, has been inducted into the North Carolina State University's Department of Electrical and Computer Engineering (ECE) Alumni Hall of Fame. The NCSU ECE Alumni Hall of Fame celebrates the accomplishments of outstanding graduates who have used their education to excel in a profession, career, or service. Dr. Singh's induction for this prestigious accolade was based on his pioneering career in high-performance, high-reliability silicon carbide (SiC) semiconductors for high-power, high-voltage applications. This includes several innovation and R&D awards, plus the 2004 founding of GeneSiC Semiconductor, a company that went on to become an industry leader in SiC technology, acquired by Navitas in August 2022. During the induction ceremony on 21st October, Dr. Singh commented: "It is both an honor and a privilege to be inducted into the Hall of Fame. I look back fondly on my time at the University and within the ECE Department, which formed a solid foundation for my work in power electronics and the development of the advanced technologies on which the success of GeneSiC was built." Dr. Singh holds a Bachelor of Technology, Electrical Engineering from the Indian Institute of Technology, Delhi, and both a master's and PhD in Electrical Engineering – Power Semiconductors, from NCSU. He also holds over 40 US patents and has presented and published over 200 journal and conference papers.24.10.2022 07:00:00Octnews_2022-11-15_2.jpg\images\news_2022-11-15_2.jpghttps://navitassemi.com/navitas-evp-ranbir-singh-silicon-carbide-pioneer-inducted-into-engineering-hall-of-fame/navitassemi.com
Packaged GaN Family for Flexible Design of High-Power Density ApplicationsEPC expands the selection of off-the-shelf GaN FET...10069Product ReleasePackaged GaN Family for Flexible Design of High-Power Density ApplicationsEPC expands the selection of off-the-shelf GaN FETs in thermally enhanced QFN packages with the introduction of the 150 V EPC2308 designed for motor drive in power tools and robots, high density DC-DC from/to 80 V-100 V for industrial applications, synchronous rectification to 28 V – 54 V for chargers, adaptors and power supplies, smartphones USB fast chargers, and in solar optimizers and microinverters. The EPC2308 GaN FET offers a super small RDS(on), of just 4.9 mOhm typical, together with very small QG, QGD, and QOSS parameters for low conduction and switching losses. The device features a thermally enhanced QFN package with footprint of just 3 mm x 5 mm, offering an extremely small solution size for the highest power density applications. The package offers wettable flanks to simplify assembly and inspection and exposed top and ultra-low thermal resistances to optimize thermal dissipation through heatsink for cooler operations. The EPC2308 is footprint compatible with the previously released 100 V, 1.8 mOhm EPC2302 and the 100 V, 3.8 mOhm EPC2306. "The EPC2308 combines the advantages of 150 V GaN with an easy to assemble and thermally enhanced QFN package," said Alex Lidow, CEO and co-founder of EPC. "Designers can use our family of packaged GaN FETs to make smaller and lighter weight battery-operated BLDC motor drives for robotics and power tools, higher efficiency 80 V input DC-DC converters, and higher efficiency USB chargers and power supply".20.10.2022 13:30:00Octnews_2022-11-01_17.jpg\images\news_2022-11-01_17.jpghttps://epc-co.com/epc/events-and-news/news/artmid/1627/articleid/3080/footprint-compatible-packaged-gan-family-expands-to-150-v-for-flexible-design-of-high-power-density-applicationsepc-co.com
All-in-One LIN Driver Propels Relay Window LiftersMelexis' LIN pre-driver IC for relay DC motors off...10067Product ReleaseAll-in-One LIN Driver Propels Relay Window LiftersMelexis' LIN pre-driver IC for relay DC motors offers a combination of high power, compactness, and attractive pricing. The MLX81160 is the latest addition to the company's Gen3 family of compatible embedded motor drivers. Its 48 KB of memory (16 KB ROM for the included LIN protocol and 32 KB Flash for the application software) is suitable for applications like window regulators. Melexis has just introduced the MLX81160. By leveraging high-voltage silicon-on-isolator (SOI) technology, this LIN-based pre-driver exhibits operational robustness for 12 and 24 V applications. This device is the successor to the company's MLX81150 LIN slave device for relay and DC motor control. The key uses are window lifters and sunroof regulators with relay DC motors, as well as small DC motor applications with external PN-MOSFET power regulation. AEC-Q100 qualified, the MLX81160 incorporates all the essential functional elements for motor driving within a single chip. These include a LIN interface, an embedded microcontroller unit, 6x PWM drivers, 3x high-voltage I/Os, and more. Extra I/Os allow connecting a dedicated 4-wire latch for motor indexing. Melexis will soon launch a new 4-wire latch: the innovative features of the MLX92352 will provide the ultimate flexibility. Together with the MLX81160 it is a full Sense & Drive solution. The MLX81160 is embedded into a compact 4 mm x 4 mm QFN24 package.20.10.2022 11:30:00Octnews_2022-11-01_15.jpg\images\news_2022-11-01_15.jpghttps://www.melexis.com/en/news/2022/20oct2022-melexis-smallest-all-in-one-lin-driver-propels-relay-window-liftersmelexis.com
Multipurpose Series Provides Either DC/DC Converter or AC/DC Power SupplyPowerland's "Caesar" series 360W AC/DC module is f...10066Product ReleaseMultipurpose Series Provides Either DC/DC Converter or AC/DC Power SupplyPowerland's "Caesar" series 360W AC/DC module is featured with high-power density, high efficiency, and high reliability. This series has a very low-profile design at only 25.5mm. The "Caesar" series supports natural cooling without a fan and 1+1 redundancy with dual current-sharing modes integrated analog and digital current-sharing. It is best suitable for system applications need high reliability, high-power density, and high efficiency, such as industrial, LED displays, robotic, electric power, and railway applications. With a power density of 27W/inch3, the Caesar Series have two different configurations for customers to choose from: 93 x 98 x 27.5 mm or 182 x 48.6 x 27.5 mm.20.10.2022 10:30:00Octnews_2022-11-01_14.png\images\news_2022-11-01_14.pnghttps://greenwattpower.com/wp-content/uploads/Datasheet-EVD-360.pdfgreenwattpower.com
Smart Motor Module Designed Meets Reduced PCB Layout RequirementsAlpha and Omega Semiconductor introduced an extens...10064Product ReleaseSmart Motor Module Designed Meets Reduced PCB Layout RequirementsAlpha and Omega Semiconductor introduced an extension to its compact Smart Motor Module (SMM) family. Available in an ultra-compact, thermally enhanced 3mm x 3mm QFN-18L package, the integrated AOZ9530QV SMM is a half-bridge power stage with a slew of features and protections that simplify motor drive designs. The AOZ9530QV SMM is suitable for use in a large number of BLDC fan applications ranging from PC and server fans, seat cooling and home appliances. The device features multiple advanced protection functions that include short circuit protection, over temperature protection, Vcc UVLO and bootstrap UVLO. With an input voltage up to 28 V and supporting high current up to 7 A, the AOZ9530QV has a wide operating (-40°C to +125°C) ambient temperature range and offers 100 percent pulse-width modulation (PWM) duty operation support. It also provides adjustable gate drive sink and source current control that gives designers the ability to minimize EMI while maximizing power efficiency. These features and others make the AOZ9530QV an optimal power stage solution for Brushless DC (BLDC) motor drives. A single module would be used for single phase applications, two AOZ9530QV SMMs would be used for a H-Bridge motor drive, and three SMMs are needed for 3-Phase designs.19.10.2022 08:30:00Octnews_2022-11-01_12.jpg\images\news_2022-11-01_12.jpghttp://www.aosmd.com/res/news/news-article-1666192123971/AOZ9530QV%20PR.pdfaosmd.com
Cooperation on Wireless Charging SolutionsROHM Group company LAPIS Technology, together with...10055Industry NewsCooperation on Wireless Charging SolutionsROHM Group company LAPIS Technology, together with Global Antenna manufacturer Shanghai Amphenol Airwave (subsidiary of Amphenol Corporation), have established a cooperative framework. The purpose: providing wireless charging solutions for hearable and wearable devices that are trending towards greater compactness and sophistication. Advanced antenna customization technology allows Amphenol to provide compact antennas that meet the needs for smaller, thinner housings in the hearable and wearable device markets. At the same time, LAPIS Technology provides compact high performance wireless power supply ICs that leverage wireless digital and analog circuit technologies cultivated over many years through LSI development. This time, with technical support provided by LAPIS Technology, Shanghai Amphenol Airwave Communication Electronics, an operation within Amphenol Corporation, will provide a wireless charging solution that solves design constraints regarding housing along with issues such as increased development workforce. This reference design – that matches power transmission and reception centered on the antenna and wireless charger IC – contributes to rapid device development by providing one-stop support to global customers for achieving wireless charging functionality. Going forward, both companies will continue to combine their technologies to add value to compact wireless charging solutions – including the use of NFC communication and other functions required by the market.19.10.2022 08:00:00Octnews_2022-11-01_3.jpg\images\news_2022-11-01_3.jpghttps://www.rohm.com/news-detail?news-title=2022-10-19_news_amphenol&defaultGroupId=falserohm.com
650V E-Mode GaN HEMT Product FamilyInnoscience Technology announced a full range of 6...10062Product Release650V E-Mode GaN HEMT Product FamilyInnoscience Technology announced a full range of 650V E-mode GaN HEMT devices. 190m?, 350m? and 600m? RDS(on) devices in industry-standard 8x8 and 5x6 DFN packages join previously-announced 140m?, 240m? and 500m? RDS(on) parts, creating a significant portfolio of available devices. Importantly, the 650V HEMTs are all qualified to JEDEC standards for chip and package. More, the Innoscience devices have also passed Dynamic High Temperature operating life test (DHTOL) reliability testing according to JEP180, which is the newly-released JEDEC's guidelines dedicated to GaN technology. In addition, Innoscience's 650V HEMT (InnoGaN) have undergone accelerated life tests beyond 1000V that give lifetime calculations of 36 years at 80% of the rated voltage (520V; 150°C; 0.01% failure rate). The devices also feature very good drain source voltage transient (VDS, transient) of 800V for non-repetitive events with an extended pulse time up to 200µs and a pulsed (VDS, pulsed) characteristics for repetitive pulse up to 100ns of 750V for the 190m? RDS(on) parts. These are best-in-class characteristics. Moreover, similarly to the 650V products, the 190m?, 350m? and 600m? RDS(on) devices all feature a strong ESD protection circuit embedded in the die to ease mass production assembly of these device in package and easy handling.19.10.2022 06:30:00Octnews_2022-11-01_10.jpg\images\news_2022-11-01_10.jpghttps://www.innoscience.com/innoscience.com
Noise Analyzer Adopted by Samsung FoundryKeysight Technologies announced that Samsung Found...10059Industry NewsNoise Analyzer Adopted by Samsung FoundryKeysight Technologies announced that Samsung Foundry has adopted the Keysight E4727B Advanced Low-Frequency Noise Analyzer (A-LFNA) for measurement and analysis of flicker noise (1/f noise) and random telegraph noise (RTN) in semiconductor devices. Samsung Foundry customers targeting the silicon manufacturer's most advanced technologies will have access to process design kits (PDK) that include the most accurate simulation models, based on A-LFNA data, for design and verification of radio frequency (RF) and analog circuits. "Accurate low-frequency noise measurement and modeling are increasingly important in development of PDKs, especially for the advanced technology nodes at 5, 4, and 3 nanometers," said Charles Plott, Director of Product Management for PathWave Software Solutions at Keysight. "Samsung Foundry's use of our A-LFNA enables design engineers with the highest quality PDKs for circuit design to achieve first-pass success and reduce time-to-market." Keysight E4727B A-LFNA is a turn-key solution that measures the low-frequency noise of semiconductor devices. The PathWave A-LFNA Measurement and Programming software is built on top of the PathWave WaferPro (WaferPro Express) measurement platform. Engineers manage and automate the full wafer-level device characterization workflow in a measurement system that is both flexible and expandable. Next, engineers import the measurement data from the system into Keysight's PathWave Device Modeling (IC-CAP) and PathWave Model Builder (MBP) software to extract device models for PDK development, which ensures highly accurate RF and analog low-noise circuit design and simulation.18.10.2022 12:00:00Octnews_2022-11-01_7.png\images\news_2022-11-01_7.pnghttps://www.keysight.com/us/en/about/newsroom/news-releases/2022/1018-nr22118-keysight-noise-analyzer-adopted-by-samsung-foundry-.htmlkeysight.com
Power Components for Bloom Energy's Electrolyzer and Energy ServerCalifornia-based Bloom Energy has chosen CoolSiC M...10058Industry NewsPower Components for Bloom Energy's Electrolyzer and Energy ServerCalifornia-based Bloom Energy has chosen CoolSiC MOSFETs and CoolSiC diodes from Infineon Technologies to process electrical power in Bloom's Energy Server, the company's fuel cell offering, and the Bloom Electrolyzer. Bloom Energy's fuel cells and electrolyzers address climate change and offer multiple pathways to zero carbon emission. They enable a combustion-free method for generating resilient, sustainable and predictable energy. The individual solid oxide fuel cells (SOFC) of the energy platform run on natural gas, biogas, or hydrogen. With high electrical efficiency, the system provides a continuous power supply that is robust to grid failures and weather conditions from -20°C to 45°C. "The global reduction of CO 2 emissions and a successful energy transition are two of the greatest challenges to stop climate change on our planet," said Dr. Peter Wawer, President of Infineon's Industrial Power Control Division. "At Infineon, we are convinced that hydrogen is an excellent alternative to CO 2-emitting energy sources, making it an important tool in the decarbonization of the energy industry and the automotive industry. We are therefore very pleased to seeing our CoolSiC devices make a major contribution to the optimization and further development of hydrogen technologies."18.10.2022 11:00:00Octnews_2022-11-01_6.jpg\images\news_2022-11-01_6.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2022/INFIPC202210-007.htmlinfineon.com
AC-DC Power Supply Thermal Management PatentTDK Corporation is pleased to announce that TDK-La...10065Product ReleaseAC-DC Power Supply Thermal Management PatentTDK Corporation is pleased to announce that TDK-Lambda UK's Power Supply Apparatus patent application has been approved for grant by the UK Intellectual Property Office. The thermal strategy covered by the patent leads to power supplies that are flexible in their cooling requirements, keep audible noise to a minimum, and are easy for customers to integrate into their systems. There are two established techniques for overcoming the thermal management challenge. One method is to increase unit dimensions to allow for better airflow. Driving up efficiency is another technique, thereby minimising internal heat dissipation. Increasing unit size is often unacceptable, as units are seen as uncompetitive and excessively large, making them difficult to integrate into systems. Also, as power supply efficiencies increase, the law of diminishing returns applies, and incremental improvements become excessively expensive. Above all, both techniques come with an increased bill-of-material cost. The thermal management strategy used in manufacturing the CUS400M series of AC-DC power supplies, covered by the patent, overcomes these issues by utilising existing system metalwork for cooling. Through careful PCB design and the use of thermally conductive plastics, the heat generated by the electronic components is spread and transferred into the system chassis. This means that good thermal performance can be achieved with substantially lower airflow, resulting in reduced audible noise from the slower fan.18.10.2022 09:30:00Octnews_2022-11-01_13.jpg\images\news_2022-11-01_13.jpghttps://www.emea.lambda.tdk.com/uk/products/cus400mlambda.tdk.com
Synchronous Buck Controller Handles Extreme Step-Down RatiosWith compact dimensions and an input-voltage range...10063Product ReleaseSynchronous Buck Controller Handles Extreme Step-Down RatiosWith compact dimensions and an input-voltage range from 6V to 75V, STMicroelectronics' L3751 synchronous buck controller serves different applications from industrial equipment to battery powered light electric vehicles. The 3.5mm x 4.5mm controller is also suited to use in telecom and networking equipment that feature commonly used 24V and 48V buses. Having minimum on-time duration of 40ns, the L3751 can support an extremely low duty cycle thereby permitting a large step-down ratio. This allows powering low-voltage devices directly without intermediate conversion, which helps simplify circuit design and lower bill-of-materials (BOM) costs. The device integrates a 7.5V supply for the gate drivers. In addition to having a wide supply-voltage range, the L3751 has 100V-tolerant inputs that allow operation in harsh electrical environments. The switching frequency is adjustable from 100kHz to 1MHz, giving designers flexibility to optimize circuit size, performance, and cost, through selection of the external MOSFETs and passive components. To enhance efficiency and minimize ripple, the L3751 operates in diode-emulation mode and with pulse skipping at light loads. The L3751 provides extensive protection functions, including thermal protection, input under-voltage lockout, constant current protection with hiccup mode, and programmable current sensing. There is also an external Enable pin and open-collector power-good indicator.18.10.2022 07:30:00Octnews_2022-11-01_11.jpg\images\news_2022-11-01_11.jpghttps://newsroom.st.com/media-center/press-item.html/n4490.htmlst.com
Polymer Hybrid Capacitors Suitable for Increasing Capacitance RequirementsSAMWHA Electronic's YM and YL series include two c...10068Product ReleasePolymer Hybrid Capacitors Suitable for Increasing Capacitance RequirementsSAMWHA Electronic's YM and YL series include two conductive polymer hybrid aluminum electrolytic capacitors, expanding the portfolio. The products feature higher capacitance at operating temperatures of up to +125 °C, making them suitable for a wide range of industrial applications. With the addition of the YM version to the surface-mountable YH series and the radial YL series, SAMWHA is meeting the increased demand for higher value ranges of ripple current and capacitance. The capacitors have a voltage range of 25 V to 63 V and a capacitance of 47 µF to 680 µF. The tolerance here is ±20 % at 120 HZ (20 °C). In addition, the service life of the component is 4,000 hours and can be used without problems over a wide temperature range from -55 °C to +125 °C.17.10.2022 12:30:00Octnews_2022-11-01_16.png\images\news_2022-11-01_16.pnghttps://www.rutronik24.com/samwha.htmlrutronik24.com
European Business Group awarded by Siemens Mobility with Supplier Award "Moving Beyond"Mitsubishi Electric's Semiconductor European Busin...10053Industry NewsEuropean Business Group awarded by Siemens Mobility with Supplier Award "Moving Beyond"Mitsubishi Electric's Semiconductor European Business Group has been awarded by Siemens Mobility with the supplier award in the prestigious category "Moving Beyond". The decisive factor for winning this award was the development of a 3300 V Silicon Carbide Power Module to enable sustainable railway vehicle solutions for Siemens Mobility. Michael Peter, CEO of Siemens Mobility GmbH, explained during the award ceremony that the implementation of Mitsubishi Electric's 3300 V Silicon Carbide Power Semiconductor Module reduces the overall energy consumption of a train by 10%. "Mitsubishi Electric is setting new benchmarks with its Silicon Carbide technology and making an important contribution to the decarbonization of Siemens Mobility's rail vehicles", Michael Peter added. The award ceremony took place during the Innotrans trade fair on September 23, 2022 in Berlin. Power semiconductors based on Silicon technology are used in railway vehicles from trams to high-speed trains for a long time. Silicon Carbide is continuously replacing conventional silicon power semiconductors in medium- and high-power applications. Silicon Carbide is a technology which enables manufacturers already today to develop highly efficient traction inverters, that are required for Hydrogen and battery driven trains, which replace old Diesel locomotives on not electrified railway lines. The regional train Mireo Plus B of Siemens Mobility is already contributing to this in the Baden-Württemberg town of Ortenau. Our society faces the crucial task of accelerating decarbonization worldwide in all areas of transportation with urgency. With its Green Deal, the European Union has committed to becoming the first climate-neutral continent by 2050 with intermediate targets by 2030. This requires a high degree of electrification and the substitute of fossil fuels. This continuous transition must already take place today. Strong partnerships of manufacturers and suppliers along the entire supply chain are needed to realize this transition. As a supplier of power semiconductors as key components, it is Mitsubishi Electric Semiconductor´s utmost objective to enable customers to bring efficient and sustainable solutions and products to market.17.10.2022 06:00:00Octnews_2022-11-01_1.jpg\images\news_2022-11-01_1.jpghttps://www.linkedin.com/posts/mitsubishi-electric-europe---semiconductor_innotrans-siliconcarbide-siliconcarbide-activity-6979036887445295104-ryz4linkedin.com/mitsubishi-electric-europe
Call for Proposals: SEMIKRON Innovation Award and Young Engineer Award 2023The 'SEMIKRON Innovation Award' and the 'SEMIKRON ...10060Industry NewsCall for Proposals: SEMIKRON Innovation Award and Young Engineer Award 2023The 'SEMIKRON Innovation Award' and the 'SEMIKRON Young Engineer Award' is given for outstanding innovations in projects, prototypes, services or novel concepts in the field of power electronics in Europe, combined with notable societal benefits in form of supporting environmental protection and sustainability by improving energy efficiency and conservation of resources. Both prizes have been initiated and are donated by the SEMIKRON Foundation which is awarding the prizes in cooperation with the European ECPE Network. With the award the SEMIKRON Foundation wants to motivate people of all ages and organizations of any legal status to deal with innovations in power electronics, a key technology of the 21th century, in order to improve environmental protection and sustainability by energy efficiency and conservation of resources. The SEMIKRON Innovation and Young Engineer Prizes 2023 will be awarded in the frame of the ECPE Annual Event in March 2023 in Erding/Munich, Germany. A single person or a team of researchers can be awarded. The selection procedure for the prize winners is organized in cooperation with ECPE European Center for Power Electronics e.V.. The submitted proposals will be passed to an independent and neutral evaluation committee of experts for discussion and assessment. The expert reviewers are appointed by the SEMIKRON Foundation in agreement with the ECPE Board of Directors. The number of experts should be at least five. The evaluation committee decides on the submitted proposals by majority vote. Selection and awarding of the prize winners is done with exclusion of the jurisdiction. 14.10.2022 13:00:00Octnews_2022-11-01_8.png\images\news_2022-11-01_8.pnghttps://www.ecpe.org/infocentre/awards/semikron/ecpe.org
Wireless Charging Unit for EVsImagine if you could charge your electric vehicle ...10040Industry NewsWireless Charging Unit for EVsImagine if you could charge your electric vehicle wirelessly, like the way you might use a charging pad to power up your mobile phone. Just by driving the car over a wireless charging pad and parking, your battery could be topped up as you shop or work, while you are underway or at home. Wireless charging pads are closer to reality than you might think. At K 2022, DuPont Mobility & Materials will display just such an innovative system. It is the result of a successful collaboration with VMAX New Energy, a Tier One supplier to Greater China's largest wireless charging infrastructure providers. The VMAX wireless charging system is an 11KW wireless charger for EVs, and it consists of two parts: a vehicle pad that attaches to the car's chassis, called a receiver, and a pad mounted on the ground, called a transmission plate, that is connected to a power source. A flame retardant Zytel HTN housing for the transmission plate protects the inner wireless charging system, preventing damage from drops, wheel compression, chemicals, oils, and UV rays. The 30% glass filled PPA material is designated as HTNFR53G30NH. Collaborating with VMAX, the automotive electrification team at DuPont Mobility & Materials has developed this Zytel HTN grade for high gloss and durability.12.10.2022 15:00:00Octnews_2022-10-15_10.png\images\news_2022-10-15_10.pnghttps://www.mobility-materials.com/news/wireless-charging-unit-for-EVs-made-possible-with-Zytel-and-Zytel-HTN-solutions.htmlmobility-materials.com
Podcast Shares Insights and Expert OpinionsVicor launched the 'Powering Innovation' podcast, ...10061Industry NewsPodcast Shares Insights and Expert OpinionsVicor launched the 'Powering Innovation' podcast, which showcases pioneering technologies by customers who developed products through visionary leadership and engineering. The podcasts explore the role power electronics plays in unlocking break-through solutions to real-world problems. The podcast features interviews with individuals from companies that are innovators in their fields. Whether the listener is an electronics design engineer, development and system engineer, the 'Powering Innovation' podcast will highlight technical solutions developed by rapidly growing companies that push the limits of conventional thinking. "Many of our customers are doing exciting things that can have a real impact on the world. From providing humanitarian relief missions, to combatting coastal erosion, to striving for low emissions electric aviation, our guests on the podcast discuss significant innovations," said Robert Gendron, Corporate Vice President, Product Development, Vicor. Powering Innovation launched in October 2022 with new episodes released monthly. Future episodes will highlight the impact power electronics is having on aerial technologies, electrification, unmanned systems, as well as supply chain issues, real-life challenges and more.12.10.2022 14:00:00Octnews_2022-11-01_9.png\images\news_2022-11-01_9.pnghttps://www.vicorpower.com/press-room/powering-innovation-podcastsvicorpower.com
Filling the Gap Between Supercapacitors and BatteriesSkeleton Technologies is delighted to officially l...10057Industry NewsFilling the Gap Between Supercapacitors and BatteriesSkeleton Technologies is delighted to officially launch its SuperBattery, and to unveil Shell as partner. SuperBattery is an innovative technology combining the characteristics of supercapacitors and batteries. It has been developed to serve the needs of several sectors and is currently being used and/or tested in hybrid and fuel cell EVs, buses, trucks, and charging infrastructure. SuperBattery fills the technology gap in the energy storage market, delivering peak power and fast charging, and is best suited for applications below 30 minutes because of lower cost and footprint. Skeleton is joining a Shell-led consortium to offer electrification solutions for mining sites. The nine-member consortium, including Skeleton and Shell, has come together to introduce Shell's Mining Electrification Solutions for Off-Road Vehicles – announced in May 2022 as one of the 8 winners of the mining industry's 'Charge On Innovation Challenge', from over 350 entries. The solution is an end-to-end and interoperable electrification system that reduces emissions without compromising on efficiency or safety, whilst aiming to be cost competitive versus diesel-powered operations. The pilot offering combines ultra-fast charging with Skeleton's new SuperBattery, in-vehicle energy storage, and power provisioning and microgrids.12.10.2022 10:00:00Octnews_2022-11-01_5.jpg\images\news_2022-11-01_5.jpghttps://www.skeletontech.com/news/skeleton-launches-its-superbattery-and-unveils-shell-as-partnerskeletontech.com
2022 Create the Future Design ContestMouser Electronics congratulates the winners of th...10056Industry News2022 Create the Future Design ContestMouser Electronics congratulates the winners of the 2022 'Create the Future Design Contest'. Intel and Analog Devices teamed with Mouser in sponsoring the 20th annual contest, produced by SAE Media Group, an SAE International Company. "Congratulations to this amazing group of winners and to all who entered this year's contest," said Kevin Hess, Mouser Senior Vice President of Marketing. "Part of Mouser's mission is fostering technical innovation, and we're proud to support this global design contest that celebrates incredible creativity and insight into the future of technology." Together with COMSOL and SAE Media Group, Mouser will award the $25,000 grand prize to a team from the Massachusetts Institute of Technology (MIT) Media Lab for their entry, FlowIO Platform, a fully integrated, miniature pneumatic development platform designed to make prototyping, innovation, and research with soft robotics quick and easy. The Create the Future Design Contest brings attention to product designs that enhance quality of life, improve the efficiency and quality of healthcare or help to reduce dependence on nonrenewable energy sources. The contest was created in 2002 by the publishers of 'Tech Briefs' magazine to help stimulate and reward engineering innovation.12.10.2022 09:00:00Octnews_2022-11-01_4.jpg\images\news_2022-11-01_4.jpghttps://www.mouser.de/newsroom/publicrelations-create-the-future-winners-2022final/mouser.de
SVP of Product Dieter LiesabethsVisIC Technologies is happy to announce that Dipl....10041PeopleSVP of Product Dieter LiesabethsVisIC Technologies is happy to announce that Dipl.-Ing. (TH) Dieter Liesabeths is joining the company as a Senior Vice President of Product. With over 30 years of experience in the semiconductor industry, Dieter will drive the adaptation of GaN power devices in the automotive and industrial fields. In the last 12 years, Dieter was a front-row leader in Europe to drive the conversion from Silicon to WBG, and in his new position he will lead the next generation semiconductors revolution with VisIC's D3GaN (Direct-Drive D-Mode) technology. "With his long-term experience in wide band gap power semiconductors combined with his excellent knowledge of the automotive market, Dieter is the ideal candidate to extend our management team, expand our footprint in the automotive industry, and lead the transition from Silicon to GaN for the next generation of the electrical drive train and on-board chargers," says Tamara Baksht, CEO of VisIC Technologies Inc. "I'm happy to join VisIC Technologies LTD. as SVP of Product, as VisIC's D3GaN will leverage the development of the next generation of power devices, which will make electrical drive trains more affordable while providing longer range and lower power consumption compared with other wide band gap materials like SiC", says Dieter Liesabeths, SVP Product at VisIC Technologies.11.10.2022 16:00:00Octnews_2022-10-15_11.jpg\images\news_2022-10-15_11.jpghttps://visic-tech.com/visic-tech.com
High Power Shunt Resistors with Metal Sensing PinsBourns announced an extension to its Model CSM2F S...10046Product ReleaseHigh Power Shunt Resistors with Metal Sensing PinsBourns announced an extension to its Model CSM2F Series power shunt resistor portfolio with 12 series. These series feature riveted through-hole metal sensing pins meeting the growing need for accurate positioning of voltage sense points in high current applications. These latest additions to the Bourns Model CSM2F Series shunt resistor family are engineered using the Company's electron beam-welded resistive technology that supports high power designs up to 50 watts with continuous current up to 1414 amps. In addition, these new series are constructed with a metal alloy resistive element that delivers a thermal EMF as low as 0.25 µV/K. Available in two or three tin-plated copper pin options, the new Model CSM2F Series with additional sensing pins offers a third pin option that is connected to the ground side of the circuit. The three-pin design helps reduce sensing errors by carrying the ground current on a separate path from the sensing circuit for higher measurement accuracy. The new Bourns Model CSM2F Series shunt resistor family extension also features a wide resistance range from 25 µO up to 200 µO, and a low ±50 PPM/°C TCR in the 20 °C to 60 °C temperature range. Giving designers additional flexibility, the new series are offered in three different surface finishes to match various customer environmental and soldering needs, and are available in four package sizes: 6918, 8518, 7036 and 8536 (metric).10.10.2022 10:30:00Octnews_2022-10-15_17.jpg\images\news_2022-10-15_17.jpghttps://www.bourns.com/news/press-releases/pr/2022/10/10/bourns-announces-high-power-shunt-resistors-with-metal-sensing-pins-for-accurate-measurement-in-high-current-applicationsbourns.com
Automotive-Grade Low-Dropout Linear RegulatorsTaiwan Semiconductor announces the availability of...10045Product ReleaseAutomotive-Grade Low-Dropout Linear RegulatorsTaiwan Semiconductor announces the availability of the TQL8xx Family of automotive-grade, low-dropout (LDO) regulators. These AEC-Q101 qualified LDOs offer manufacturers a reliable alternative source for the critically important linear regulators utilized in numerous battery-driven automotive functions, including dashboard, cluster, climate control, fuel pump and advanced driver-assistance systems (ADAS). They are also well suited for secondary supply applications where a regulated output is essential during very low-cranking voltage conditions. Designed for stability in automotive battery-connect applications, TQL8xx LDOs maintain 2% accuracy over a wide range of input voltages and a full operating temperature range of -40 to +125C. They are offered in models with fixed outputs of 3.3V or 5.V and feature typical dropout voltages of 70-80 mV @ IO=100 mA.10.10.2022 09:30:00Octnews_2022-10-15_16.jpg\images\news_2022-10-15_16.jpghttps://www.taiwansemi.com/search_detail/product?q=LOW-DROPOUTtaiwansemi.com
Merger Creates Stronger Business Partner for CustomersPanasonic Industry Europe is announcing that Panas...10054Industry NewsMerger Creates Stronger Business Partner for CustomersPanasonic Industry Europe is announcing that Panasonic Industry Europe (PIEU) and Panasonic Electric Works Europe (PEWEU) have successfully merged as of 1st October 2022. Comments Johannes Spatz, President Panasonic Industry Europe: "Historically PEWEU and PIEU have had different roots and successful business models. Now we are bringing the two companies together to create one combined and even more successful, more resilient and more powerful company. The new Panasonic Industry Europe is ready to tackle the future challenges of new workstyle, new business and new market developments." The strategic corporate re-organisation will strengthen the position of Pansonic Industry Europe in the market and will create an even stronger business partner for its customers. All customers will benefit from the combined experience and high-quality capabilities as well as from the unified portfolios of products and services. With the concluded merger entry into the commercial register, all commercial agreements and similar legal relationships of PEWEU are fully and automatically transferred to PIEU in accordance with the applicable provisions of the German Reorganisation of Companies Act (Umwandlungsgesetz). Therefore, neither an amendment nor a novation of existing agreements is necessary for customers.10.10.2022 07:00:00Octnews_2022-11-01_2.jpg\images\news_2022-11-01_2.jpghttps://industry.panasonic.eu/panasonic-industry-news/panasonic-industry-europe-and-panasonic-electric-works-europe-have-merged-create-stronger-businessindustry.panasonic.eu
AEC-Q100 Qualified IC Load Switches for AutomotiveGLF Integrated Power is pleased to introduce two A...10051Product ReleaseAEC-Q100 Qualified IC Load Switches for AutomotiveGLF Integrated Power is pleased to introduce two Automotive grade AEC-Q100 IQSmart load switch ICs. The AEC-Q100 qualified GLF1111Q and GLF1200Q are rated for a wide temperature range (Grade 1 -40°C to +125°C). The GLF1200Q features a true reverse-current blocking, which prevents a backup power source from being discharged when an input node is shorted. The GLF1200Q works all of the time regardless of on or off state. Applications for the GLF1111Q and GLF1200Q include infotainment and cluster display systems, diagnostic systems, passive entry/start systems (PEPS), customer premise equipment (CPE), face recognition systems and intelligent cockpit and autonomous driving applications. Both the GLF1111Q and GLF1200Q IQSmart devices, packaged in a SOT-23-5L, offer easy visual inspection of solder joints. Both feature integrated slew-rate control that limit inrush upon turn on, therefore minimizing the effects of voltage droop. Each load switch IC supports a wide-input voltage range (1.5V to 5.5V), meaning a single device can be used in a variety of voltage rail applications, which helps to simplify inventory management. And both are offered with an optional output discharge switch. "We have added two new devices to our IQSmart family to offer high performance in more applications," said Eileen Sun, President, and CEO at GLF Integrated Power. "The GLF1111Q and GLF1200Q address the ever-expanding, evolving range of automotive electronic systems that require a high-performance load switch with a wide-ambient operating temperature range to assure reliable, long-term operations."06.10.2022 15:30:00Octnews_2022-10-15_22.jpg\images\news_2022-10-15_22.jpghttps://glfipower.com/news/our-latest-iqsmart-aec-q100-qualified-ic-load-switches-for-automotive-and-commercial-grade-systemsglfipower.com
Range of CFP Power DiodesNexperia announced the latest additions to its por...10044Product ReleaseRange of CFP Power DiodesNexperia announced the latest additions to its portfolio of Clip-bonded FlatPower (CFP) packaged diodes for industrial and automotive applications. The latest additions include 32 planar Schottky diodes and eight hyperfast recovery rectifiers housed in the CFP15B package. They are available as standard and Q-types that meet AEC-Q101 automotive qualification standards. By bringing multiple versions of these devices to the market Nexperia underscores its commitment to expanded manufacturing capacity and accelerated transition to smaller, thermally optimized packages. The operating range for these planar Schottky diodes is between 30-100 V and 3-15 A. Versions optimized for low forward voltage (VF) (including the PMEG100V080ELPE/-Q) deliver low conduction losses and high efficiency for cost-efficient DC-DC converters and in reverse polarity protection applications. These diodes are also available in low leakage variants with ultra-low reverse current and best-in-class operating temperature capability, providing exceptional robustness against thermal runaway. The eight 200 V single-type recovery rectifier devices (PNE200xxEPE/-Q series) have an average forward current (IF) between 4-10 A and complement existing dual type recovery rectifiers also available from Nexperia. Using the smaller, high-power density CFP15B instead of DPAK or SMB/C packages can save up to 60% of board space, while maintaining the same level of electrical performance. This rugged package design enables longer operating times and better board-level reliability. Its optimized lead form ensures uniform solder joints for improved automated optical inspection (AOI). A solution that particularly benefits modern ADAS, EV, LED lighting or ECU applications relying on advanced high-density designs.06.10.2022 08:30:00Octnews_2022-10-15_15.jpg\images\news_2022-10-15_15.jpghttps://www.nexperia.com/about/news-events/press-releases/Nexperia-Bolsters-its-Range-of-CFP-Power-Diodes.htmlnexperia.com
Site for the Production of High-power Semiconductor Modulesnfineon Technologies has opened a factory in Ceglé...10032Industry NewsSite for the Production of High-power Semiconductor Modulesnfineon Technologies has opened a factory in Cegléd, Hungary. The factory is dedicated to the assembly and testing of high-power semiconductor modules to drive the electrification of vehicles, which is key in the improvement of the world's CO 2 balance. In addition, Infineon has invested in further production capacities for high-power modules that enable green energy, from wind turbines and solar modules to energy-efficient drives. "Infineon is pursuing a long-term growth path. Decarbonization and digitalization are driving demand for our semiconductor solutions," said Infineon's COO Rutger Wijburg. "Cegléd already has a strong track record in enabling green energy. The new manufacturing capacities will help Infineon accommodate the growing demand for electromobility applications. At Infineon, we have been investing in the future growth of electromobility from the earliest stage. Today our company is the key semiconductor enabler of the transition to green energy." The growth of electromobility is undisputed. Cars with fully or partially electrified drivetrains will account for more than 50 percent of cars produced by 2027, as per analyst forecasts. Since its founding, Infineon has shown continuous commitment in Hungary and has now invested an additional 100 million EUR in the new fab, complemented by support from the Hungarian government. Tamás Szabó, Managing Director of Infineon Technologies Cegléd Kft. said, "Infineon has been present in Hungary for more than 25 years as a manufacturer of innovative semiconductor products, building on a highly reliable regional industrial infrastructure. Over the years, Infineon has gained a strong reputation in power modules, serving customers all over the world."06.10.2022 07:00:00Octnews_2022-10-15_2.jpg\images\news_2022-10-15_2.jpghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2022/INFXX202210-004.htmlinfineon.com
Protection ICs Series provide Protection, Sensing, and Control Features in a SingleLittelfuse announced the eFuse Protection ICs prod...10048Product ReleaseProtection ICs Series provide Protection, Sensing, and Control Features in a SingleLittelfuse announced the eFuse Protection ICs product line, a series of four versatile circuit protection devices. The eFuse Protection ICs utilize an innovative design that provides a wide range of power input (3.3V to 28V) and integrated protection. In addition to overvoltage protection, these electronic fuses protect against overcurrent, short circuit, inrush current, reverse current, and overtemperature events with real-time diagnostics-all in one chip. "The eFuse Protection ICs provide today's electronics designers with significant flexibility by integrating robust circuit protection, sensing, and control in a single chip," said Bernie Hsieh, Assistant Product Manager of the Protection Semiconductor Business team at Littelfuse. "Providing a low power consumption, high accuracy current limiting circuit with quick response time makes them a win-win-win for many portable electronics and datacom applications." The eFuse Protection ICs are available in tape and reel format in quantities of 3,000 (LS0504EVT23, LS0505EVD22) or 5,000 (LS1205ExD33, LS2406ERQ23).05.10.2022 12:30:00Octnews_2022-10-15_19.jpg\images\news_2022-10-15_19.jpghttps://www.littelfuse.com/about-us/news/news-releases/2022/littelfuse-announces-efuse-protection-ics-series.aspxlittelfuse.com
Silicon Carbide Substrate Manufacturing Facility in ItalySTMicroelectronics will build an integrated Silico...10033Industry NewsSilicon Carbide Substrate Manufacturing Facility in ItalySTMicroelectronics will build an integrated Silicon Carbide (SiC) substrate manufacturing facility in Italy to support the increasing demand from ST's customers for SiC devices across automotive and industrial applications as they transition to electrification and seek higher efficiency. Production is expected to start in 2023, enabling a balanced supply of SiC substrate between internal and merchant supply. The SiC substrate manufacturing facility, built at ST's Catania site in Italy alongside the existing SiC device manufacturing facility, will be a first of a kind in Europe for the production in volume of 150mm SiC epitaxial substrates, integrating all steps in the production flow. ST is committed to develop 200mm wafers in the next future. This project is a key step in advancing ST's vertical integration strategy for its SiC business. The investment of €730 million over five years will be supported financially by the State of Italy in the framework of the National Recovery and Resilience Plan and it will create around 700 direct additional jobs at full build-out. "ST is transforming its global manufacturing operations, with additional capacity in 300mm manufacturing and a strong focus on wide bandgap semiconductors to support its $20+B revenue ambition. We are expanding our operations in Catania, the center of our power semiconductor expertise and where we already have integrated research, development and manufacturing of SiC with strong collaboration with Italian research entities, universities and suppliers" said Jean-Marc Chery, President and Chief Executive Officer of STMicroelectronics. 05.10.2022 08:00:00Octnews_2022-10-15_3.png\images\news_2022-10-15_3.pnghttps://newsroom.st.com/media-center/press-item.html/c3124.htmlst.com
Reliable DC-link Film Capacitors in PV InvertersThe inverter is one of the core components of the ...10042Product ReleaseReliable DC-link Film Capacitors in PV InvertersThe inverter is one of the core components of the PV system in a solar power generator set, which needs to meet different functional requirements, not only to ensure DC/AC conversion but also to guarantee the quality of the output power. Because modules are typically used in outdoor and require long-term operation with reduced maintenance, end users and designers have extremely demanding quality and reliability requirements for the components used in these equipment. As the carrier and support in the energy conversion process, film capacitors play a vital role in in every link of PV inverters, and improper selection will have a fatal impact on the stability and operating life of the equipment. Wuxi CRE New Energy Technology Co., Ltd. has been focusing on the application of film capacitors in power electronics. According to the harsh application conditions of photovoltaic inverters, the company has designed and developed a series of film capacitors with high temperature and humidity resistance, low ESR(reduce heat), high reliability and long life.05.10.2022 06:30:00Octnews_2022-10-15_13_2.jpg\images\news_2022-10-15_13_2.jpghttps://www.cre-elec.com/film-capacitor/cre-elec.com
Swedish Maker of GaN-on-SiC Epitaxial Wafers to Boost CapacitySweGaN has completed a Series A financing round to...10036Industry NewsSwedish Maker of GaN-on-SiC Epitaxial Wafers to Boost CapacitySweGaN has completed a Series A financing round totaling €12m. The financing was co-led by Intertech Ventures, Mount Wilson Ventures and leading European investor Atlantic Bridge, with participation by STOAF of Sweden and global fabless semiconductor leader MediaTek, forming a powerful global network from the US, Taiwan, and Europe. SweGaN's GaN semiconductor epitaxy process enables high performance and opens new applications in the multi-billion-dollar GaN-based RF and power markets. The company says that it's QuanFINE buffer-free GaN-on-SiC epitaxial wafers allow customers to reach new levels of device performance and reliability. The company has over 30 paying customers and is in qualification for a wide range of applications in Europe, the US and Asia. The investment allows SweGaN to significantly increase production capacity to meet market demand from major suppliers of 5G base stations, defence radars, low-orbit satellite communications and on-board chargers in electric vehicles. Additionally, the financing funds empower the company's plans to expand its executive team and to boost engineering, sales, and production staff. In conjunction with the investment, SweGaN also announced the appointment of Jr-Tai 'Ted' Chen as CEO. Ted co-founded SweGaN in 2014 and invented the company's proprietary QuanFINE technology as its CTO.04.10.2022 11:00:00Octnews_2022-10-15_6.jpg\images\news_2022-10-15_6.jpghttps://swegan.se/2654/swegan.se
2023 Symposium on VLSI Technology & Circuits Announces Call for PapersThe 2023 Symposium on VLSI Technology & Circuits w...10038Event News2023 Symposium on VLSI Technology & Circuits Announces Call for PapersThe 2023 Symposium on VLSI Technology & Circuits will deliver a convergence of technology and circuits for the microelectronics industry as a fully merged event to maximize the synergy across both domains. The 43rd Symposium on VLSI Technology & Circuits has announced a call for papers around the theme: "Rebooting Technology & Circuits for a Sustainable Future." The six-day conference program will be held at the Rihga Royal Hotel in Kyoto, Japan, from June 11-16, 2023. The Symposium will feature advanced VLSI technology developments, innovative circuit design, and the applications they enable, such as artificial intelligence, machine learning, IoT, wearable/implantable biomedical applications, big data, cloud / edge computing, virtual reality (VR) / augmented reality (AR), robotics, and autonomous vehicles. The deadline for paper submissions to the Symposium is February 1, 2023 at 23:59 JST. Best Student Paper Award for the Symposium is selected based on the quality of the papers and presentations. The recipient will receive a monetary award, travel cost support, and a certificate. For a paper to be reviewed for this award, the lead author and presenter of the paper must be enrolled as a full-time student at the time of submission, and must indicate on the web submission form that the paper is a student paper.29.09.2022 13:00:00Sepnews_2022-10-15_8.jpg\images\news_2022-10-15_8.jpghttps://www.vlsisymposium.org/vlsisymposium.org
Syndication Network Spanning Over 30 Distribution PartnersSnapEDA is launching the SnapEDA Syndication Netwo...10026Product ReleaseSyndication Network Spanning Over 30 Distribution PartnersSnapEDA is launching the SnapEDA Syndication Network. This ecosystem of over 30 distribution partners, includes electronic component distributors, printed circuit board (PCB) tool makers, and engineering media sites. The SnapEDA Syndication Network connects the electronic designers and engineers who are at the heart of the electronic industry with design content for millions of electronic components. This content helps engineers design faster, grows revenue and loyalty for distributors, and allows chip and component manufacturers to get valuable design wins. Over 80% of engineers that download SnapEDA’s design content purchase the product. This creates a competitive advantage for electronic component distributors and manufacturers that are a part of SnapEDA’s network, enabling them to win sales earlier in the design process. Global spending on digital transformation is expected to reach an all-time high of $6.8 trillion in 2023. As a result of the global pandemic and a heightened demand for self-serve component selection tools, component manufacturers are increasingly investing in digital demand generation technologies. In addition to helping engineers find the parts they need, SnapEDA uniquely translates this demand into seamless design-ins, securing the win for component manufacturers.28.09.2022 13:30:00Sepnews_2022-10-01_18.png\images\news_2022-10-01_18.pnghttps://insights.snapeda.com/syndicationsnapeda.com
Oscilloscopes for Accelerated InsightRohde & Schwarz is adding the R&S MXO 4 series osc...10025Product ReleaseOscilloscopes for Accelerated InsightRohde & Schwarz is adding the R&S MXO 4 series oscilloscopes to its portfolio, which features a real-time update rate of over 4.5 million acquisitions per second. The 12-bit ADC in the R&S MXO 4 series has 16 times the resolution of traditional 8-bit oscilloscopes at all sample rates without any tradeoffs for more precise measurements. The oscilloscopes come in four-channel models with bandwidths of 200 MHz, 350 MHz, 500 MHz, 1 GHz, and 1.5 GHz. The R&S MXO 4 series incorporates a 12-bit ADC that operates across all the instrument sample rates with an 18-bit vertical resolution architecture for greater resolution precision. The R&S MXO 4 series also has the lowest noise and largest offset range (+/- 5V with a 500uV/div scaling) in its class. Users can see DC and other signals with more precision than with any other oscilloscope on the market. In addition to bandwidth and sample rate, memory depth is an important factor and determines whether an oscilloscope can handle a large range of troubleshooting tasks. More acquisition memory enables oscilloscopes to capture more time and retain rated bandwidth information for shorter time base settings. With a simultaneous standard acquisition memory of 400 Mpts on all four channels, the R&S MXO 4 series has up to 100 times the standard memory of its primary competition. The additional memory also provides extra measurement capability when needed.28.09.2022 12:30:00Sepnews_2022-10-01_17.jpg\images\news_2022-10-01_17.jpghttps://www.rohde-schwarz.com/uk/about/news-press/all-news/rohde-schwarz-introduces-the-r-s-mxo-4-series-the-next-generation-oscilloscopes-for-accelerated-insight-press-release-detailpage_229356-1274183.htmlrohde-schwarz.com
Joining American Semiconductor Innovation CoalitionMenlo Microsystems announced that it has joined th...10037Industry NewsJoining American Semiconductor Innovation CoalitionMenlo Microsystems announced that it has joined the American Semiconductor Innovation Coalition (ASIC) in its effort to ensure that the funding provided through the historic CHIPS and Science Act will be effectively employed to advance U.S. semiconductor R&D leadership and improve the pathway from research to manufacturing. As a member of ASIC, Menlo Micro will look to build on existing partnerships with ASIC members Purdue University and SUNY Polytechnic Institute to strengthen America's STEM workforce and ensure top tech talent remains in the U.S. Menlo Micro's leadership in creating next-generation electrical components will be invaluable as the country seeks to invest more heavily in transformative technologies and bolster domestic chip manufacturing and supply chains. Leveraging advances in materials science and MEMS technology, Menlo Micro's Ideal Switch delivers unprecedented power, efficiency, and speed at a fraction of the size and weight of traditional switching technologies. "Menlo Micro is proud to join ASIC and its members in the pursuit of strengthening U.S. tech leadership," said Russ Garcia, CEO of Menlo Micro. "ASIC's work to create tech hubs and bolster U.S. supply chains for our future economic prosperity and national security perfectly aligns with our goal to onshore manufacturing of Menlo Micro's Ideal Switch technology to help strengthen America's tech supply chains and facilitate the electrification of everything."27.09.2022 12:00:00Sepnews_2022-10-15_7.jpg\images\news_2022-10-15_7.jpghttps://menlomicro.com/newsroom/menlo-micro-joins-with-mitre-engenuitys-semiconductor-alliancemenlomicro.com
Patented Switching Technique for Power Electronics DesignPulsiv OSMIUM uses a patented method for convertin...10014Industry NewsPatented Switching Technique for Power Electronics DesignPulsiv OSMIUM uses a patented method for converting AC to DC that involves charging/discharging a small storage capacitor without the need for a PFC inductor. This solution delivers high power factor, consistently high efficiency and an compact system design. Pulsiv OSMIUM technology can be used to improve overall system efficiency, optimize cost and contribute towards reducing global energy consumption. The microcontroller family and supporting components can be combined with commodity flyback DC-DC converters to displace higher-cost LLC solutions. Pulsiv has demonstrated a universal input, single switch 150W flyback power supply design that delivers 97.5% average (99.5% peak) front-end efficiency while maintaining 90% at just 2W. A 240W interleaved flyback is currently being developed and work is underway to showcase reference designs with even higher power capability. Pulsiv OSMIUM microcontrollers (PSV-AD-150 and PSV-AD-250 sampling now) do not directly determine output power and can be used as a platform for any application requiring 1W to 10kW, by adjusting only three system components and connecting a suitable DC/DC converter. Critical components in a Pulsiv OSMIUM circuit operate at low temperatures to extend their expected operating life, even under convection cooling. By regulating the flow of mains through a charging capacitor, Pulsiv has completely eliminated inrush current, meaning that manufacturers of industrial power supplies and LED lighting products can simplify their designs and reduce the cost of system installation. Finally, the technology supports Active Bridge Control, Configurable Hold-Up, X-Cap Discharge, HVDC Output Selection, a Power Consumption Indicator and Grid Failure Detection. These optional features can be selected as required to meet the needs of different end applications.27.09.2022 11:00:00Sepnews_2022-10-01_6.jpg\images\news_2022-10-01_6.jpghttps://pulsiv.co.uk/news/pulsiv-unveils-world-leading-power-electronics-technology/pulsiv.co.uk
Offline AC-DC Primary-Side PWM Controllers for Flyback ConvertersElevation Semiconductor announced the release of i...10023Product ReleaseOffline AC-DC Primary-Side PWM Controllers for Flyback ConvertersElevation Semiconductor announced the release of its two power ICs with smaller footprints for fast-charging solutions. The HL9510 and HL9512 are flyback PWM controller ICs that operate in a quasi-resonant (QR) mode to enhance the system efficiency and power density. Both ICs offer constant output voltage regulation through the optocoupler feedback controller or shunt regulator and integrate high-voltage startup. The HL9510 and HL9512 protection include VDD over-voltage protection (VDD-OVP), Brown-out protection, DMAG over-voltage protection (DMAG-OVP), DMAG under-voltage protection (DMAG-UVP), IC internal over-temperature protection (OTP), and IC external thermal shut-down (SD). The brown-in voltage is programmed by an external DMAG pin resistor and has a wide VDD operating range to cover variable output mode applications, such as USB-PD/PPS or conventional DP/DN protocol communication. Its protection is also implemented with auto-restart mode. The VDD-OVP, DMAG-OVP, and external SD protection can be configured with auto-restart or latch mode, and the DMAG-UVP can be configured with auto-restart or long auto-restart mode. The HL9510 is designed to integrate an internal HV startup circuit, whereas the HL9512 can be done by the external MOS combined IC’s AUX and ST pins. The HL9510 is available in a 10-lead SOIC package ideal for USB PD/QC portable device battery chargers, high-efficiency AC-DC power adapters, and a power supply with fixed or variable output voltage. The HL9512 also comes in the same package and is ideal for smartphones, tablet PC battery chargers, portable device adapters, and flyback power suppliers with low and/or variable output voltage.27.09.2022 10:30:00Sepnews_2022-10-01_15.jpg\images\news_2022-10-01_15.jpghttps://elevation-semi.com/elevation-semiconductor-introduces-two-new-offline-ac-dc-primary-side-pwm-controllers-for-flyback-converters/elevation-semi.com
DC/DC Converter IC for Advanced Driver Assistance Systems ROHM developed the buck DC/DC converter IC with bu...10020Product ReleaseDC/DC Converter IC for Advanced Driver Assistance Systems ROHM developed the buck DC/DC converter IC with built-in MOSFET (Switching regulator), BD9S402MUF-C, for automotive applications such as infotainment and ADAS (Advanced Driver Assistance Systems) incorporating onboard sensors and cameras that are becoming more advanced. The BD9S402MUF-C supports output voltages down to 0.6V and 4A output current at switching frequencies higher than 2MHz in a compact size demanded by increasingly sophisticated secondary power supply applications for high performance MCUs and SoCs. What’s more, it is incorporating proprietary QuiCur™ high-speed load response technology and enables stable operation at an industry-leading 30mV (measurement conditions: 5V input voltage, 1.2V output voltage, 44µF output capacitance, load current variation 0 to 2A/2µs). This translates to a 25% reduction in output voltage fluctuation over class-leading standard products with equivalent functionality, making it ideal for use in the latest ADAS with severe power supply conditions requiring stable operation within 5% even with low voltage output. The BD9S402MUF-C is also equipped with a load response performance selection function that allows users to easily switch priority between ‘voltage fluctuation’ (for stable operation), and ‘capacitance reduction’ (to ensure stable operation at 22µF) via terminal setting. The result is that users can reduce the resources required for power circuit design, as stable operation can be achieved not only at the initial design, but also during specification or model changes.27.09.2022 07:30:00Sepnews_2022-10-01_12.jpg\images\news_2022-10-01_12.jpghttps://www.rohm.com/news-detail?news-title=2022-09-27_news_dcdc&defaultGroupId=falserohm.com
GaN-SiC HEMT Transistor for Long Pulse Radar ApplicationsAmpleon introduces the CLL3H0914L-700 GaN-SiC HEMT...10029Product ReleaseGaN-SiC HEMT Transistor for Long Pulse Radar ApplicationsAmpleon introduces the CLL3H0914L-700 GaN-SiC HEMT for wireless infrastructure, avionics/defence, non-cellular communication, cooking/ defrosting, and ISM-related applications. This rugged GaN transistor is optimised for radar implementations where long pulse width and high-duty cycles are required. The transistor was engineered to achieve over 700W of peak output power from a single transistor while operating at a voltage of 50V with efficiency of over 70% as well as designed thermally for long pulse applications, such as pulse widths (~2 milliseconds) and 20% duty cycles. This high-power density and low-thermal resistance HEMT is now in full volume production. Units are available directly from Ampleon or authorised distribution partners, RFMW and Digi-Key. Large signal models in ADS and MWO can be sourced via the Ampleon website.   26.09.2022 16:30:00Sepnews_2022-10-01_21.jpg\images\news_2022-10-01_21.jpghttps://www.ampleon.com/news/press-releases/ampleons-new-standard-for-l-band-gan-sic-hemt.htmlampleon.com
PCIM Asia Postponed to 2023 While PCIM Asia Conference to Keep Its Schedule This October PCIM Asia will now be held from 29 – 31 August 202...10013Event NewsPCIM Asia Postponed to 2023 While PCIM Asia Conference to Keep Its Schedule This October PCIM Asia will now be held from 29 – 31 August 2023 at Shanghai New International Expo Centre in view of current circumstances relating to the pandemic in China. Although the PCIM Asia exhibition will be moved to next year, the PCIM Asia Conference 2022 will keep its schedule this autumn from 26 – 27 October in Shanghai. “To actively support the government’s efforts towards pandemic mitigation, we have decided to move the fair to next summer after meticulously examining the ongoing situation in China,” explains Mr Louis Leung, Deputy General Manager of Guangzhou Guangya Messe Frankfurt Co Ltd. “We would like to express our gratitude to those in the industry for their understanding and support, and look forward to welcoming key players back next year to reconnect and establish stronger business cooperation within the power electronics industry.” Despite the postponement, industry players will continue to keep abreast of the latest trends and developments this year. “Within the preventive guidance set by the local government, we are able to move forward with PCIM Asia Conference in the original dates this October in Shanghai. While details of the new venue will be announced shortly, we trust the hybrid conference will satisfy the power electronics community’s enthusiasm towards the event and meet the demand for in-person business encounters.” 26.09.2022 10:00:00Sepnews_2022-10-01_5.jfif\images\news_2022-10-01_5.jfifhttps://pcimasia-expo.cn.messefrankfurt.com/shanghai/en/press/press-releases/2022/PCIM22_secondpostponement.htmlpcimasia-expo.cn
PLECS Conference 2022 – Insights Into Real-Time SimulationAt the PLECS conference in Zurich, leading industr...10012Event NewsPLECS Conference 2022 – Insights Into Real-Time SimulationAt the PLECS conference in Zurich, leading industrial companies presented their various implementations of real-time simulation with PLECS and the RT Box. The speakers showed how PLECS was successfully used to automatically generate models and controls in their rapid prototyping process. The speed of the simulations was well appreciated. In addition, the RT Box proved to be very versatile: ALSTOM's Dr. Ing. Roberto Aceiton used the compact RT Box in a home-office environment during the pandemic, while Schindler integrated the RT Box into highly automated systems running overnight simulations of various elevator failure modes. Between the presentations, there were lively discussions on the various features of real-time simulation. The conference ended with a look into the future of PLECS: Wolfgang Hammer from Plexim presented future features, such as the "comment out" function to disable components for a simulation run and a difference viewer to compare two models. One question remained for the participants: When will the next PLECS conference take place? Orhan Toker, Vice President of Plexim, says “There will be for sure another PLECS conference in 1-2 years.”.26.09.2022 09:00:00Sepnews_2022-10-01_4.jpg\images\news_2022-10-01_4.jpghttps://www.plexim.com/homeplexim.com
electronica Impresses with its Supporting Programelectronica 2022, which will take place from Novem...10018Event Newselectronica Impresses with its Supporting Programelectronica 2022, which will take place from November 15 to 18 on the exhibition grounds in Munich, and the co-located event SEMICON Europa, will show the role of the electronics industry as a trailblazer for societal future topics. While the exhibitors will present their specific products and solutions in 14 exhibition halls, the comprehensive supporting program of conferences, forums and special events will focus on knowledge transfer and personal exchange with experts. The motto “Driving sustainable progress” will be a common thread through all of the areas. electronica has traditionally been the platform for top-class conferences. This year things will be kicked off by the electronica Automotive Conference on November 14, which will deal with the transition of cars toward becoming intelligent IoT devices with electronic drives over the course of around 18 presentations. Among others, the key issues at the event include new EE architectures, intelligent interiors, challenges for supply chains, CO2 neutrality and efficient drive trains. On November 16, the electronica Embedded Platforms Conference, which will also last one day, will discuss the challenges and solutions for the embedded systems of the future: In around 35 presentations on three parallel tracks, experts will report on key topics such as power electronics and supply, AI and sensors, and communication and software. 22.09.2022 15:00:00Sepnews_2022-10-01_10.jpg\images\news_2022-10-01_10.jpghttps://electronica.de/en/newsroom/press-material/press-releases/detail/electronica-impresses-with-its-strong-supporting-program.htmlelectronica.de
GaN HEMT Device Performance Oxford Instruments alongside its research partner ...10039Industry NewsGaN HEMT Device Performance Oxford Instruments alongside its research partner Industrial Technology Research Institute (ITRI) can share technology developments that will benefit key hyper-growth electric vehicle, datacentre and 5G markets. The technology developments allow critical transistor components to operate at higher voltages which increases performance and reliability, while also achieving a safer and more energy efficient (normally off 'E-mode') operation compared to existing devices. The GaN (gallium nitride) HEMT device architecture is defined by a recessed and insulated gate junction into the AlGaN layer, and this device is referred to as GaN MISHEMT. In September 2021, Oxford Instruments Plasma Technology and ITRI announced a cooperative research program for next-gen compound semiconductors. This latest breakthrough is an example of that collaboration delivering on its goal of accelerating technology to benefit the partners, their regions and wider global markets. Since that announcement, Oxford Instruments has also unveiled an exclusive supply deal with Laytec, who's endpoint technology is used to control the GaN MISHEMT recess gate depth. Recess depth accuracy and repeatability is critical to tune the device performance characteristics, and LayTec's technology is designed specifically for this application achieves target depth accuracy of ±0.5nm. ITRI provides pilot production and value-added services, including process verification and product development. ITRI's integration services, especially this GaN development project, have proved incredibly beneficial, which quickly proved out the higher performance of GaN MISHEMT and provided a lower risk and faster route to market for the device.22.09.2022 14:00:00Sepnews_2022-10-15_9.png\images\news_2022-10-15_9.pnghttps://www.oxinst.com/news/gan-hemt-device-performance/oxinst.com
Collaboration to Develop Software for Automotive Battery Management SystemsNXP® Semiconductors has joined forces with Elektro...10015Industry NewsCollaboration to Develop Software for Automotive Battery Management SystemsNXP® Semiconductors has joined forces with Elektrobit to co-develop the software platform that supports NXP’s high-voltage battery management system (HVBMS) reference design. Using Elektrobit’s Classic AUTOSAR tooling and software, the software platform of the HVBMS reference design eases the development of HVBMS architectures for electric vehicles (EVs) by abstracting the communication and controlling interactions between the BMS microcontroller and the battery cell controllers. As demand for battery-powered cars (EVs) continues to increase, so does the demand for improved performance, faster charging time, increased range and battery life, and improved safety. These demands drive rapid technological advancements in EV battery designs, especially for high voltages like 400V or 800V. As these batteries become more powerful and complex, more sophisticated BMS architectures are needed to ensure the safety and reliability of EVs. NXP’s HVBMS RD is a scalable ASIL D architecture composed of three modules: battery management unit (BMU), cell monitoring unit (CMU) and battery junction box (BJB). NXP’s wide portfolio of battery cell controllers, battery junction box devices, and devices for its electrical transport protocol link (ETPL), along with production grade software drivers for these silicon devices, makes it easier for OEMs and Tier 1 customers to enter the growing market of HVBMS and enables them to focus effort on their unique application features. Elektrobit has been collaborating with NXP for more than ten years. Utilizing Elektrobit’s EB tresos (AutoCore, AutoCore OS, and RTE), NXP’s reference application software and Complex Device Drivers (CDDs) are designed and integrated into NXP’s HVBMS RD.22.09.2022 12:00:00Sepnews_2022-10-01_7.jpg\images\news_2022-10-01_7.jpghttps://www.nxp.com/company/about-nxp/nxp-collaborates-with-elektrobit-to-develop-software-for-next-generation-automotive-battery-management-systems:NW-NXP-COLLABORATES-WITH-ELEKTROBITnxp.com
Single-stage Flyback Controller for Battery Charging ApplicationsInfineon Technologies extends its offering of AC-D...10021Product ReleaseSingle-stage Flyback Controller for Battery Charging ApplicationsInfineon Technologies extends its offering of AC-DC controller ICs by introducing the ICC80QSG single-stage PWM controller for flyback topologies. The IC is tailored for battery charger applications offering scalable power designs of up to 130 W – when optimized using CoolMOS™ P7 Superjunction (SJ) MOSFETs. It is also suitable for adapter, printer, PC, TV, monitor, set-top box, and audio amplifier applications. The ICC80QSG battery charging IC offers a quasi-resonant mode, switching in valley n (QRMn). Its QRM operation comes with continuous conduction mode (CCM) prevention and valley switching discontinuous conduction mode (DCM) in mid to light load. By pairing ICC80QSG with CoolMOS™ P7 MOSFET devices, high efficiency and low electromagnetic interference (EMI) can be achieved to enable savings on the overall BOM: fewer heatsinks and coils may be needed in flyback designs. In addition, the integrated burst mode function for very light loads allows designs with very low power consumption during standby mode. Additionally, the ICC80QSG features a reduced gate driver output voltage during burst mode, making it ideally suited for very low standby requirements under light load or no load conditions with a remarkable standby performance over the whole operating range. The ICC80QSG implements a secondary-side regulation (SSR) method, which is ideal for current control during battery charging. For higher design flexibility, it accommodates adjustable on-time mapping at the valley changing position for the desired maximum operating switching frequency, as well as adjustable maximum on-time that limits input power and current, allowing safe operation under low line conditions. 22.09.2022 08:30:00Sepnews_2022-10-01_13.jpg\images\news_2022-10-01_13.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2022/INFPSS202209-118.htmlinfineon.com
Laminate to Aid Reliable Performance of EV Power Modules DuPont Interconnect Solutions announced a multiyea...10011Industry NewsLaminate to Aid Reliable Performance of EV Power Modules DuPont Interconnect Solutions announced a multiyear contract with European power module manufacturer Semikron-Danfoss who will integrate DuPont™ Pyralux® AP all-polyimide double-sided copper clad laminate into its eMPack® power modules to further enhance the capabilities of next-gen electric vehicles. Integrating Pyralux AP copper clad laminate into eMPack traction inverter designs will help EV automotive engineers address key requirements related to signal integrity and power transmission. "Pyralux AP emerged as our best-fit solution after extensive testing and because the product has demonstrated three decades of stable, reliable performance in a variety of industries where operating conditions, like ours, are severe,” said Karl-Heinz Gaubatz, CTO of Semikron. “eMPack is a perfect fit to SiC MOSFET power modules. We look forward to working with DuPont and their Pyralux technology to help eMPack become a global leader in EV power modules.” Earlier this year, Semikron-Danfoss, headquartered in Nuremburg, Germany, won a billion-Euro contract beginning in 2025 to furnish patented eMPack power modules to a major German automotive manufacturer. Within silicon-carbide MOSFET or full silicon-carbide technology-based modules, traction inverters can be created which are extremely compact, scalable, and reliable because of a Semikron double side sintered assembly and connection technology called Direct Pressed Die (DPD). “We are excited how this EV power module application of Pyralux AP copper clad laminate supports a sustainable and electrified future to help preserve our planet for generations to come,” said Andy Kannurpatti, Global Business Director, Films & Laminates, DuPont Interconnect Solutions. “The eMPack power module is expected to enable millions of next-gen electric vehicles by 2032. We look forward to contributing significantly to the much-anticipated success of eMPack and appreciate the collaboration with Semikron-Danfoss.”22.09.2022 08:00:00Sepnews_2022-10-01_3.jpg\images\news_2022-10-01_3.jpghttps://www.dupont.com/electronic-materials/all-polyimide-solutions.htmldupont.com
PowerPros Live Video Application-Engineering SupportPower Integrations launched PowerPros?, a live onl...10017Industry NewsPowerPros Live Video Application-Engineering SupportPower Integrations launched PowerPros?, a live online video tech support service that enables power-supply designers to talk directly with members of Power Integrations’ applications engineering team 24 hours a day, six days a week, anywhere in the world. Designers worldwide can share a video call with an expert power electronics engineer to discuss real engineering challenges – including full project design and debug – sharing bench-top test results. Initially piloted during the pandemic to support Power Integrations’ customers, the program has been expanded with new facilities, additional team members, extended hours and live video. Trevor Hiatt, director of channel marketing at Power Integrations, said: "This is a technical solutions service where anyone can speak directly with an experienced application engineer any time of the day or night. The program has been very popular with customers, who rated the program 4.4 stars out of 5 with 93 percent of queries resolved within 72 hours. Some questions are simply a matter of pointing the enquirer to the right part of the datasheet, but many issues go much deeper. PowerPros staff advise on device and topology selection, review schematics and PCBs, help with transformer design, and do live design debugging.” Users of PowerPros can collaborate live with Power Integrations engineers to solve their design challenges in real-time using comprehensive bench instrumentation and design tools. Support is available for any of Power Integrations’ extensive portfolio of power supply and driver products and a wide range of applications including industrial, appliance, home and building automation, metering, chargers and adapters, power tools, eMobility, motor drives and LED lighting.20.09.2022 14:00:00Sepnews_2022-10-01_9.jpg\images\news_2022-10-01_9.jpghttps://investors.power.com/news/news-details/2022/Power-Integrations-Launches-PowerPros-Live-Video-Application-Engineering-Support/default.aspxpower.com
3-Phase Filters for Machine ApplicationsSCHURTER is expanding the FMAC NEO and FMAD NEO 3-...10049Product Release3-Phase Filters for Machine ApplicationsSCHURTER is expanding the FMAC NEO and FMAD NEO 3-phase filter families with variants for machine applications. The filters meet the requirements of machine safety according to IEC 60204-1. They are suitable for 3-phase or 3-phase-with-neutral conductor applications at rated currents from 16 to 230 A. The FMAC NEO and FMAD NEO single-stage block filters have a particularly compact design with a small footprint and high performance at the same time. They are suitable for industrial or energy applications such as EV fast charging stations or battery storage. The filter versions meet the requirements of this standard IEC 60204-1. The filters have a short discharge time of the capacitors, so that they have a touchable residual voltage of <60 V in 1 or max. 2 seconds after disconnecting the voltage. Further, the insulation value between phases and ground is at least 1 MO thanks to larger resistors. The filters are designed for currents from 16 to 230 A at an ambient temperature of 50 °C. All family members have ENEC and cURus approvals and are recommended for applications up to 520 VAC. The standard variants are designed for industrial applications with leakage currents <13 mA. Special variants with leakage currents <3 mA are available for particularly leakage-critical applications.20.09.2022 13:30:00Sepnews_2022-10-15_20.jpg\images\news_2022-10-15_20.jpghttps://www.schurter.com/en/news/machine-safety-fmac-neo-and-fmad-neoschurter.com
Programmable Dynamic Voltage Scaling Buck ConvertersHalo Microelectronics announced the release of its...10047Product ReleaseProgrammable Dynamic Voltage Scaling Buck ConvertersHalo Microelectronics announced the release of its HL7593 and HL7594 devices, a series of synchronous buck converters optimized to supply different subsystems of portable applications. The HL7593/HL7594 series output voltage ranges from 0.600V to 1.394V in 6.25mV steps or 0.27V to 0.6272V in 2.8125mV steps programmed through an I2C interface. Their output voltages can be adjusted on the fly to provide a dynamic voltage scaling (DVS) function with a programmable slew rate. Furthermore, a wide range of output capacitors can be used to optimize VOUT stability during load transients, and inductors from 0.33µH to 0.47µH may be used without affecting loop stability. At moderate to light loads, pulse frequency modulation (PFM) is used to maintain conversion efficiency with a typical non-switching quiescent current of 48µA. Even with such a low quiescent current, the HL759x maintains excellent load and line transient responses. At higher loads, the system automatically switches to fixed-frequency pulse width modulation (PWM) operation at 2.4MHz for minimum VOUT ripple and optimal load transient response. In shutdown mode, the supply current drops below 1µA, reducing power consumption. Additionally, the PFM Mode can be disabled if needed through the I2C registers. The HL7593/HL7594 ICs are available in a 15-bump, 0.4mm pitch, 2.01mm x 1.21mm WLCSP and are ideal for application processors, memory, HDD, SDD, and mobile devices.20.09.2022 11:30:00Sepnews_2022-10-15_18.jpg\images\news_2022-10-15_18.jpghttps://halomicro.com/i2c-programmable-3a-dynamic-voltage-scaling-dvs-buck-converters/halomicro.com
Higher Voltage Biasing High Voltage Power SuppliesDean Technology announced the introduction of a se...10043Product ReleaseHigher Voltage Biasing High Voltage Power SuppliesDean Technology announced the introduction of a series of high voltage power supplies designed specifically for higher voltage applications needing a biasing module. The UMR-A-10000 series, which is another extension of the existing UMR Collection of power supplies, offers output voltages up to 10kV, input voltages at 12 or 24V, and power at up to 30W. In addition, this line of power supplies offers a high voltage flying lead. UMR-A-10000 modules, like the UMR-A and UMR-AA before them, offer low ripple and highly stable outputs. All models come standard with voltage and current monitoring; the ability to upgrade each unit to include buffered monitors and current regulation will be available in the coming months. "This UMR-A-10000 series finally gets our UMR-A family above the 6kV threshold, which has been a consistent demand from our customers since the UMR's inception," said Scott Wilson, Sales and Product Development Manager for Dean Technology. "As always, we are a customer driven organization, and as such will continue to evolve our UMR product line to offer more options for our customer's high voltage applications. We look forward to releasing even higher voltages in the future." The UMR Collection of power supplies are form-fit-function replacements for industry standard units and is comprised of six product lines – the UMR-A, UMR-AA, UMR-C, UMR-HPC, UMR-BPC, and the new UMR-A-10000.20.09.2022 07:30:00Sepnews_2022-10-15_14.png\images\news_2022-10-15_14.pnghttps://www.deantechnology.com/news/higher-voltage-biasing-high-voltage-power-suppliesdeantechnology.com
3D Power Design and Manufacturing SymposiumThe PSMA Packaging and Manufacturing Committee ann...10010Event News3D Power Design and Manufacturing SymposiumThe PSMA Packaging and Manufacturing Committee announces the Fourth Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-2023) February 1-3, 2023 at Florida International University in Maimi, Florida. This Symposium provides the opportunity to receive an update on the latest technology and future trends focused on increasing the density and the performance of power solutions. Discover advances in the integration, design, packaging and manufacturing of 3D power sources. The Symposium is desgined for any engineer or manager that is involved in the design and manufacturing of high density power sources using 3D technology. Each day will lead off with 2 Plenary Speakers and each Technical Session will lead off with a keynote speaker. Plenary speakers include Professor Fred Lee of Virgina Tech presenting “PCB based Integrated Magnetic” and Dr. Brandon Passmore of Wolfspeed presenting “Finite-Element Predictive Modeling for Power Modules.” Technical Sessions include modeling, active and passive components, substrates, packaging and how to integrate them with 3D manufacturing technologies to create state of the art power sources. The Symposium will include exhibits and ample opportunities to network with attendees, speakers and exhibitors. The General Chair is Dr. Markondeyaraj Pulugurtha of the Florida International University (FIU). Technical Program Co-Chairs are Dr. John Bultitude of Kemet, a Yageo Company, and Dr. Vanessa Smet from Georgia Tech.15.09.2022 07:00:00Sepnews_2022-10-01_2.jpg\images\news_2022-10-01_2.jpghttp://www.3d-peim.org/3d-peim.org
Low Contact Resistance Coating For Heightened Fuel Cell EfficiencyFabricated from corrosion-resistant SUS316L stainl...10019Product ReleaseLow Contact Resistance Coating For Heightened Fuel Cell EfficiencyFabricated from corrosion-resistant SUS316L stainless steel, the Interplex bipolar plate (BPP) solutions for hydrogen fuel cells support an extensive operational lifespan of over 8,000 hours. They have thicknesses down to 0.8mm. Their low contact resistance (< 2mO·cm² at 1Ma pressure levels) helps to significantly boost the efficiency levels of the fuel cell stacks they are used in and enables power densities to be raised. Thanks to the precision stamping techniques employed, Interplex BPPs exhibit only =8% variation in the evenness with tight tolerances of flow channel thickness (across their active area), as well as offering enhanced plate flatness. These BPPs thereby deliver assured leak-tight operation and even power distribution across the entire surface of their plates. Likewise, advanced laser welding results in exceptional weld quality. The high-speed stamping and coating procedures that Interplex has developed are key factors too. Via these, the company is able to reach high productivity figures – with physical vapor deposition (PVD) coating of plates being done in a fifth of the time compared to other suppliers. In addition, proprietary over-molding technology for attaching the silicone rubber gaskets to the BPP is done to elevated degrees of accuracy. It allows assembly problems to be minimized when stacking the BPP with a membrane electrode assembly (MEA).15.09.2022 06:30:00Sepnews_2022-10-01_11.jpg\images\news_2022-10-01_11.jpghttps://interplex.com/newsroom/latest-interplex-bipolar-plates-feature-innovative-ultra-low-contact-resistance-coating/interplex.com
800 V and 950 V AC-DC Integrated Power StagesOptimized performance, efficiency, and reliability...10050Product Release800 V and 950 V AC-DC Integrated Power StagesOptimized performance, efficiency, and reliability in high-voltage power supplies need to be combined with reduced bill-of-material (BOM) count and cost, as well as lower design efforts. With its 5 th generation fixed-frequency (FF) CoolSET portfolio, Infineon Technologies offers the right components to meet these needs and effectively manage the critical design trade-offs. The 800 V and 950 V AC-DC integrated power stages (IPS) are housed in a DIP-7 package and address applications such as auxiliary power supplies for home appliances, AC-DC converters, battery chargers, solar energy systems, and motor control and drives. The FF CoolSET solution combines a PWM controller IC with the latest high voltage CoolMOS P7 superjunction (SJ) MOSFETs in a single package. The extended portfolio now includes the first device on the market that uses an avalanche-rugged SJ MOSFET with a breakdown voltage of 950 V to allow for a wider input voltage. The new devices enable both isolated and non-isolated topologies such as flyback or buck and operate at switching frequencies of 100 kHz as well as 65 kHz. Accommodating both the cost-efficient buck topology and flyback in one single device simplifies the supply chain for customers. An integrated error amplifier supports direct feedback from the primary output, which is typical for non-isolated topologies. Moreover, this further minimizes the number of components and design complexity.14.09.2022 14:30:00Sepnews_2022-10-15_21.jpg\images\news_2022-10-15_21.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2022/INFPSS202209-119.htmlinfineon.com
Accreditation for Calibration of DC Current TransducersDanisense announced its accreditation to ISO/IEC 1...10035Industry NewsAccreditation for Calibration of DC Current TransducersDanisense announced its accreditation to ISO/IEC 17025:2017, the quality management system and main standard for testing and calibration laboratories. This means that the company can now offer ISO 17025 accredited DC calibration of DCCTs up to 21kA. The ISO 17025 accreditation was awarded to Danisense by the Danish national accreditation body, DANAK. ISO 17025 accreditation means that the laboratory has met the Management Requirements and Technical Requirements of the internationally-recognized ISO 17025 standard, and is deemed technically competent to produce calibration and testing results. Now Danisense can ship new current sense transducers with the ISO 17025 calibration authority, saving customers a long and painful process and much administrative time and effort. Explains Loic Moreau, Sales & Marketing Director at Danisense: "The Danisense laboratory was first built in 2017. We have since gained knowledge in the field of metrology, particularly high accuracy DCCT calibration. We have continuedly improved our methods and equipment, and  the laboratory has been used to support the development of high-end DCCTs for particle accelerators, MRI scanners, green energy applications like windmills, electric vehicles and many other applications." ISO 17025 accreditation means that the laboratory has met the Management Requirements and Technical Requirements of the internationally-recognized ISO 17025 standard, and is deemed technically competent to produce calibration and testing results. Now Danisense can ship new current sense transducers with the ISO 17025 calibration authority, saving customers a long and painful process and much administrative time and effort.14.09.2022 10:00:00Sepnews_2022-10-15_5.png\images\news_2022-10-15_5.pnghttps://danisense.com/news/danisense-signs-global-distribution-agreement-with-farnell-2/danisense.com
1200 Volt Rating on Vertical GaN Power DevicesOdyssey Semiconductor announced it reached the sta...10034Industry News1200 Volt Rating on Vertical GaN Power DevicesOdyssey Semiconductor announced it reached the stated goal of 1200 volt rating on vertical GaN power field-effect transistors (FETs). The Company is now applying this validated technology to fabricate product samples in Q4 2022 for internal and customer evaluations, planned through Q1 2023. "The importance of Odyssey achieving this milestone of 1200 Volt vertical GaN power devices cannot be over-emphasized," said Mark Davidson, Odyssey's Chief Executive Officer. "We are emerging from process and materials R&D to delivering products at voltages that lateral GaN can't practically reach with economics unattainable by silicon and silicon carbide. Our vertical GaN products will deliver high power conversion efficiency at almost 10x smaller than a silicon carbide transistor for the same application." "We are not just fabricating test structures. We're building product samples that customers need. Odyssey continues to close new commitments for product samples as customers gain a full understanding of the capabilities of Odyssey's power devices. The Company is uniquely positioned with the expertise and the IP portfolio to protect it. And with our own foundry in Ithaca, New York, we can innovate quickly and control our ability to supply products to customers," concluded Davidson.14.09.2022 09:00:00Sepnews_2022-10-15_4.png\images\news_2022-10-15_4.pnghttps://www.odysseysemi.com/news-media/press-releases/detail/37/odyssey-semiconductor-achieves-1200-volt-rating-on-verticalodysseysemi.com
Motor Drive Center of Excellence Opened in TurinEPC has opened a design application center near Tu...10009Industry NewsMotor Drive Center of Excellence Opened in TurinEPC has opened a design application center near Turin, Italy, to focus on growing motor drive applications based on GaN technology in the e-mobility, robotics, drones, and industrial automation markets. The specialist team will support customers in accelerating their design cycles and define future Integrated Circuits for power management with state-of-the art equipment to test applications from 400 W to 10’s of kW. Strategically located, Turin has a historical tradition in electric motors and motor drives enabling the company to draw on the wealth of local technical talent. EPC’s engineers are helping customers reduce their design cycle times and adopt GaN for more efficient, smaller, lower-cost systems. Moreover, the center is exploring ways to exploit the potential of EPC’s GaN technology in motor drive applications to enable a substantial increase in the efficiency of the motor, leading to higher power density designs than what has been possible with historically MOSFET-based designs. Turin also features the Power Electronics Innovation Centre, a cross-department entity in the Politecnico di Torino - one of the most important technical Universities in Europe - and EPC is collaborating closely with PEIC by investing in shared research and development. The facility is headed by Marco Palma, EPC’s Director of Motor Systems and Applications. Commenting on the opening he said, “Our new facility combines a comprehensive GaN product portfolio and design expertise offering customers a center of excellence that is unrivalled for motor drive applications. Its location is key too, as Europe is driving the green revolution in the e-mobility market, by using the Euro 7 standard in the short term and by banning internal combustion engines by 2035. This is definitely the right time to invest in higher power density motor solutions that avoid un-necessary energy waste.”14.09.2022 06:00:00Sepnews_2022-10-01_1.jpg\images\news_2022-10-01_1.jpghttps://epc-co.com/epc/events-and-news/news/artmid/1627/articleid/3071/epc-opens-new-motor-drive-center-of-excellenceepc-co.com
ASIL C Certified Battery Management System for High Voltage Applications Sensata Technologies announced a Battery Managemen...10027Product ReleaseASIL C Certified Battery Management System for High Voltage Applications Sensata Technologies announced a Battery Management System (BMS), the Lithium Balance n3-BMS, for high voltage applications. It is ideal for applications with power up to 1000 volts/2000 amps, especially for battery makers and manufacturers of electric trucks, buses, and other heavy commercial vehicles. The demand for ISO 26262 certified components is on the rise as battery packers and electric commercial vehicle OEMs prioritize functional safety in their platforms while striving for faster time-to-market. However, the ISO 26262 certification process is complex, costly and can take years to complete. An off-the-shelf, Automotive Safety Integrity Level (ASIL C) certified solution like the Lithium Balance n3-BMS can reduce the development time and associated costs. The layered software structure of the n3-BMS provides customers with the option to customize the battery management system with their own code and algorithms without impacting the ASIL C certification. The BMS software architecture consists of a “Base Software Layer” (BSW) and an “External Software Layer” (ESW) which are connected by an open API link layer. Since all the safety-critical functionalities of the BMS are in the BSW layer of the software, developers are free to implement their own software code and algorithms in the ESW without any risk to the ISO 26262 certification of the system.13.09.2022 14:30:00Sepnews_2022-10-01_19.jpg\images\news_2022-10-01_19.jpghttps://www.sensata.com/contact/newsroom/sensata-technologies-lithium-balance-debuts-asil-c-certified-battery-managementsensata.com
Ruggedised 250W Non-isolated DC-DC ConvertersTDK Corporation announces the introduction of the ...10024Product ReleaseRuggedised 250W Non-isolated DC-DC ConvertersTDK Corporation announces the introduction of the 250W rated TDK-Lambda RGA series of ruggedised non-isolated DC-DC converters. Capable of operating from an input voltage of 9 to 40V or 9 to 53V, the non-isolated step-down converters deliver output voltages that can be adjustable from 3.3 to 15V, 3.3 to 24V or 3.3 to 40V with output currents of up to 20A. The series is designed to be used in harsh environment applications including robotics, AGVs (Automated Guided Vehicles), communications, COTS, industrial and portable battery-powered equipment. In a 1/16th brick form factor, measuring 35.6 x 25.6 x 13mm, the converters are encapsulated to provide a higher resistance to shock and vibration. The five-sided aluminum die cast housing with mounting tabs reduces radiated EMI and enables conduction cooling to a cold-plate for fan-less operation. The RGA models comprise of three voltage and current combinations to support operation from 12V, 18V, 24V, 36V and 48V power sources. The wide input ranges can assist with inventory reduction programs with one part number covering multiple nominal voltages. With efficiencies of up to 98%, power losses are minimised allowing the products to operate in harsh environments of -40°C to +110°C case temperature. The need for external output capacitance is reduced due to an optimised dynamic voltage response, thus reducing board space requirements.13.09.2022 11:30:00Sepnews_2022-10-01_16.jpg\images\news_2022-10-01_16.jpghttps://www.emea.lambda.tdk.com/uk/news/article/18766lambda.tdk.com
DIN Rail AC/DC Power SuppliesCOSEL announced the launch of three DIN Rail AC/DC...10028Product ReleaseDIN Rail AC/DC Power SuppliesCOSEL announced the launch of three DIN Rail AC/DC power supplies for industrial applications. Available in three power levels, 30W, 60W and 90W, combining a low profile design, a wide input voltage range of 85V – 264V, and high performance levels, the WDA series is suitable for a large range of applications. The three models, WDA30F, WDA60F and WDA90F are designed for DIN-Rail attachment and are compatible with the DIN EN60715TH 35 standard (35×7.5mm or 35×15mm), the top hat shaped DIN rail. Designed for international applications, the versatile WDA series boasts a wide input voltage range of 85 to 264VAC, and features overvoltage protection with latching and overcurrent protection with automatic recovery. The WDA30F is available in four different output voltages, 5V, 12V, 24V and 48V within a power level of 30W and a typical efficiency of 88%. Three output voltages are proposed for the WDA60F and WDA90F of 12V, 24V and 48V within an output power of 60W and 90W respectively, and a typical efficiency level of up to 90%. All models include a potentiometer making possible to finely trim the output voltage when installed. A DC OK LED visually confirms the output status. Optimized for convection cooling, the WDA series can be operated within an ambient temperature range of -20 to +70 degrees centigrade. Depending on the assembly method and ventilation used in the final equipment, a derating may apply as specified in the technical documentation.12.09.2022 15:30:00Sepnews_2022-10-01_20.jpg\images\news_2022-10-01_20.jpghttps://www.coseleurope.eu/news-item-1496-cosel-releases-new-family-of-din-rail-power-ac-dc-wdacoseleurope.eu
Agreement Leads to 130 nm SiGe BiCMOS PlatformX-FAB Silicon Foundries has announced a further ex...10016Industry NewsAgreement Leads to 130 nm SiGe BiCMOS PlatformX-FAB Silicon Foundries has announced a further expansion of its longstanding partnership with the Leibniz Institute for High Performance Microelectronics (IHP). As part of a new agreement, X-FAB will now license IHP’s SiGe technology. It will mean the performance benefits of this technology can be brought to high-volume customers. Significantly strengthening the X-FAB technology portfolio, the newly created 130 nm platform provides a solution attaining the elevated performance parameters needed to address next generation communication requirements. Examples of areas benefiting from this technology include Wi-Fi 6 (and future Wi-Fi 7) access points, plus next generation cellular infrastructure (in particular 5G mmW and emerging 6G standards) and vehicle-to-vehicle (V2V) communication. This technology will also be pivotal in the development of +100 GHz radar systems, for use in both automotive and consumer applications. This license agreement follows on from the collaborative work that began in 2021, where X-FAB’s copper backend was added to IHP’s SG13S and SG13G2 frontend technologies to boost the bandwidth figures that could be supported. In relation to this innovative SiGe platform, X-FAB is set to start engaging with selected early adopters on prototyping projects during Q4 2022. An early-access PDK is available enabling Prototyping, while volume manufacturing will happen at X-FAB France, the company’s facility near Paris. 12.09.2022 13:00:00Sepnews_2022-10-01_8.png\images\news_2022-10-01_8.pnghttps://www.xfab.com/news/details/article/licensing-agreement-between-x-fab-and-ihp-leibniz-institute-leads-to-innovative-130-nm-sige-bicmos-platformxfab.com