Bodo's News

Read through my personal pick of news around people, our industry, important events and interesting product releases. Or click on a filter and pick your area of interest!

 

105 ºC Prismatic Aluminum Electrolytic Capacitor Series
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Learn more:
cde.com
  • Product Release
  • 2023-01-23

Cornell Dubilier has released a series of Flatpack, low-profile aluminum electrolytic capacitors, tested and rated for 10,000 hours at 105 °C. Type MLPS offers high capacitance density in a flat configuration, with voltage ratings up to 450 Vdc and a temperature range from -55 °C to 105 °C. Their rugged construction provides extraordinary life and reliability for the most robust, commercial, and military-grade power supplies. LPS capacitors are available in 4 sizes. All cases have a thickness (height profile above the board) of 0.6 inches and a width of 1.8 inches. Case lengths are available from 1.5 to 3.0 inches, with capacitance values ranging from 120 to 51,000 µF and voltage ratings spanning 7.5 Vdc to 450 Vdc. The larger case sizes are typically rated for several amps (RMS). Ripple current ratings can be significantly enhanced by adding one or more heat sinks to their flat sides. Unlike conventional electrolytics that have a rolled cover, MLPS covers are laser-welded, providing near-hermetic seals that resist electrolyte dry-out. They can be put into service at high altitudes of up to 80,000 feet and have excellent capacitance retention at low temperatures. Various lead types and mounting options are available. 

GaN FET for Automotive-Grade Lidar, 48 V – 12 V DC-DC Conversion, and Low Inductance Motor Drives
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Learn more:
epc-co.com
  • Product Release
  • 2023-01-23

Efficient Power Conversion expands the selection of automotive, off-the-shelf gallium nitride transistors with the introduction of the 80 V, 11 mΩ EPC2252 that delivers 75 A pulsed current in a 1.5 mm x 1.5 mm footprint. The EPC2252 offers power system designers smaller and more efficient devices than silicon MOSFETs for automotive-grade lidar found in autonomous driving and other ADAS applications, 48 V – 12 V DC-DC conversion, and low inductance motor drives. Lower switching losses, lower conduction losses, zero reverse recovery losses, and lower drive power enable high frequency designs at high efficiency. Combined with a tiny footprint, these factors enable state-of-the-art power density. The fast-switching speed of GaN, with sub-nanosecond transitions and the capability to generate high-current pulses in less than 3 ns, results in longer range and higher resolution in lidar for autonomous driving, parking, and collision avoidance. "The EPC2252 makes an ideal switch for automotive lidar, low inductance motors, and 48 V DC-DC conversions," according to Alex Lidow, EPC's co-founder and CEO. "EPC is committed to the automotive market with a growing family of devices that enable highly efficient, low-cost vehicle electrification and autonomous driving."

Pre-APEC Power Magnetics at High-Frequency Workshop
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Learn more:
psma.com
  • Event News
  • 2023-01-19

The PSMA Magnetics Committee and IEEE PELS are jointly sponsoring the eighth high-frequency magnetics workshop, "Power Magnetics @ High Frequency," on Saturday, March 18, 2023, which is the day before and at the same venue as APEC 2023 in Orlando, FL. This day-long event will continue the focus on identifying the latest improvements in magnetic materials, coil (winding) design, construction and fabrication, evaluation and characterization techniques and modelling and simulation tools to satisfy the technical expectations and requirements of higher application frequencies. The target audiences for this workshop include anyone working to achieve higher power densities, low profile aspect ratio, higher efficiencies and improved thermal performance. The theme of the 2023 Power Magnetics @ High Frequency Workshop will be magnetic component design across applications ranging from milliwatts to megawatts. The workshop will address applications areas such as IoT, servers, integrated voltage regulators (IVR), transportation electrification, wireless charging for mobile and electric vehicles and solid-state transformers. The workshop will also include presentations and demonstrations to address specific technical issues relative to high voltage and high current design such as corona, insulation, encapsulation, etc., that were identified in the 2022 workshop survey.

SPS Expands to the USA
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Learn more:
sps.mesago.com
  • Event News
  • 2023-01-19

With an annual sales volume of more than 50 billion euros, industrial automation is one of the most important economic sectors in Germany. The world's central trade fair platform for the industry is the SPS - Smart Production Solutions, organized by Mesago Messe Frankfurt. In view of its international success, the organizer will now also gain a foothold in the US market with this trade event. The SPS brand will be premiering in the region as the "Automation Sector powered by SPS" as part of IMTS 2024, before a stand-alone trade show is held in Atlanta in 2025. As a supplement to the trade show in Nuremberg and its associated events in Italy and China, the formats will further accelerate and facilitate the exchange of knowledge in the field of industrial automation between the economic regions of the USA and Europe. This is particularly relevant against the backdrop of the current challenges in the areas of supply chains, logistics, staff shortages and cost pressure, as this is also accompanied by an increased need for automation. Since industrial automation had become increasingly important for the leading American trade fair for manufacturing technology, IMTS, in recent years, this subject will now be spotlighted in the "Automation Sector powered by SPS - Smart Production Solutions" as part of the event from 9 -14 September 2024 in Chicago. With its expertise, Mesago Messe Frankfurt is supporting the organizer AMT (Association For Manufacturing Technology) in the realization of this special showcase, which is intended to illustrate smart and digital automation solutions for industrial manufacturing.

EPE'23 ECCE Europe: 4 – 8 September 2023, Aalborg, Denmark
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Learn more:
epe2023.com
  • Event News
  • 2023-01-19

The European Power Electronics and Drives Association, EPE-Association in short, in collaboration with its co-sponsor IEEE-PELS, is proud to announce that EPE'23 ECCE Europe will take place in the AKKC – the Aalborg Congress and Culture Center from 4 to 8 September 2023. In addition to the regular topics for paper submission, EPE'23 ECCE Europe at Aalborg will highlight the following Focus Topics, not only in dedicated lecture and dialogue sessions, but also in keynotes, the exhibition, panel discussions, tutorials and technical visits. Paper submissions in line with these Focus Topics are highly encouraged. Energy Islands: 1. Renewable Energy systems and Power-to-X 2. Energy Islands; Energy Storage: 3. Energy-storage technologies 4. Electric Vehicles; Digital world in Energy: 5. Cyber Security in Power Electronics 6. Reliability and Artificial Intelligence in Power Electronics. The (only) Provisional Full Paper deadline is 2 March 2023

All-in-One Hybrid Power Drive Module Solution Designed for Electric Aviation Applications
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Learn more:
microchip.com
  • Product Release
  • 2023-01-19

Microchip Technology announces a comprehensive hybrid power drive module, the first variant introduced in a product line of power devices that will be available in 12 different variants with either silicon carbide (SiC) MOSFETs or insulated-gate bipolar transistors (IGBTs). These hybrid power drive modules are highly integrated power semiconductor devices that reduce the number of components and simplify the overall system design. The configurable power devices include a three-bridge topology that are available in SiC or Si semiconductor technologies. Offering a compact design and low weight and profile, these high-reliability power devices help reduce the size and weight of MEAs. Other key capabilities of these hybrid power drive modules include numerous auxiliary power devices that facilitate an inrush current limit function. Optional add-on capabilities include soft start, solenoid interface drive, regenerative brake switch and thermal sensors for external monitoring circuitry usage. The power modules also facilitate high-switching frequency power generation, which enables smaller and more efficient systems. The standard voltage of the power modules ranges from 650V to 1200V, with the option to customize up to 1700V on request. The device is designed for low inductances for high-power density with power and signal connectors that are solderable directly on the user's printed circuit board.

Agreement on Acquisition of Silicon Control IC Company
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Learn more:
navitassemi.com
  • Industry News
  • 2023-01-19

Navitas Semiconductor announced an agreement to acquire the remaining minority interest in its silicon control IC joint venture from Halo Microelectronics for a purchase price of $20 million in Navitas stock. In 2021, Navitas and Halo created a joint venture to develop application-specific silicon controllers that are optimized to work in combination with Navitas GaN ICs to set new standards for efficiency, density, cost and integration for a wide range of applications. The first family of products have been developed and released to production which address AC-DC power supply applications across mobile, consumer, home appliance and auxiliary power supplies in enterprise, renewables, EV and other related markets.  The silicon controller and GaN ICs combine either as a 'chip-set' or are co-packaged, to target 20 W to 500 W applications and have already been adopted by dozens of customers set to introduce their next-generation products later this year. As Navitas was already the majority shareholder, financial results from the joint venture have already been reflected in Navitas' historical financial statements and guidance. The transaction is expected to close in February. The addressable market potential for this additional silicon controller capability is estimated at over $1B per year by 2026. "This is another strategic acquisition for Navitas as we integrate critical silicon controller capabilities with our leading-edge GaN and SiC technologies," said Navitas CEO and co-founder Gene Sheridan. "Silicon controllers are needed in all power systems and largely define the architecture of those systems. By combining silicon controllers with GaN and SiC, Navitas is uniquely positioned to influence customer architecture decisions to maximize the system benefits and Navitas' value when using GaN or SiC in next-generation power electronics."

Gate Driver IC Integrates Power Management Unit, Current Sense Amplifier, and Overcurrent Protection
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Learn more:
infineon.com
  • Product Release
  • 2023-01-18

To further expand its family for automotive and industrial motor control applications, Infineon introduces the MOTIX 3-phase gate driver IC 6ED2742S01Q. The 160 V silicon-on-insulator (SOI) gate driver features an integrated power management unit (PMU) and is available in a QFN-32 package with a thermally efficient exposed power pad. This makes the easy-to-integrate device ideal for battery-powered industrial BLDC motor control drives including cordless power tools, robotics, drones, and light electric vehicles (LEVs). The 6ED2742S01Q has integrated bootstrap diodes that power three external high-side bootstrap capacitors. Through a trickle charge pump, they support 100 percent duty cycle operation. Protection features include under-voltage lock-out, overcurrent protection with configurable threshold, fault communication, and automatic fault recovery. The output drivers integrate a high-pulse current buffer stage designed for minimal driver cross-conduction. In addition, a current sense amplifier (CSA) with selectable gain between the low-side supply voltage (V SS) and the low-side power ground return (COM) is integrated. The MOTIX gate driver provides a 1 A source and 2 A sink current with independent under-voltage lock-out (UVLO) for both high-side and low-side gate drives. The device offers a propagation delay of 100 ns and a minimum dead time of 100 ns with built-in delay matching. As a result, the driver enables high switching frequencies with reduced level shift losses.

Air Core Inductors Feature Miniature Size and Low Inductance
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Learn more:
richardsonrfpd.com
  • Product Release
  • 2023-01-18

Richardson RFPD announced today the availability and full design support capabilities for AL Series and AS Series of air core RF inductors from KYOCERA AVX. Part of KYOCERA AVX's wound air core inductor family, these devices feature SRF, high Q, high current, miniature size and low inductance. They are ideal for RF circuits, broadband I/O filtering, frequency selection and impedance matching. The AS Series features a square cross section that provides better performance and offers manufacturing advantages over toroidal coils.

Non-Coupling Dual Inductors
  • Product Release
  • 2023-01-18

ITG Electronics has introduced an updated version of its non-coupling dual inductors. The enhanced component is part of the company's L101353A Series of ferrite-based flat wire inductors, whose members range from 1.0-10.0uH. ITG Electronics' non-coupling dual inductor is designed for power conversion applications with current ratings from 14-170Amp at 25C and 20% inductance drop. The component has a low DC resistance (DCR) of 1.06mOhm, and IRMS up to 50Amp. The box-style surface mount device (SMD) inductors provide lower core loss and high current output – ideal for settings involving high density and limited board space. The non-coupling dual inductors are designed for 48-volt direct power conversion, offering high performance and premium efficiency in demanding data center environments. At a maximum height of 24mm, the component offers a low profile; it is also not particularly wide or deep, with a footprint of just 24.5 x 26mm.

Solution Enables Accurate Billing for Electric Vehicle Charging
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Learn more:
lem.com
  • Industry News
  • 2023-01-17

A major step forward in supporting the deployment of fast electric vehicle (EV) chargers in North America, the bi-directional DCBM will enable makers of electric vehicle charging stations (EVCSs) to accelerate their certification for DC metering requirements following Certified Test and Evaluation Professional/National Type Evaluation Program (CTEP/NTEP) certification. The DCBM will simplify the process of the manufacturers having to qualify their own charging stations for UL listed certification and, for extra peace of mind, will undergo a fresh audit every quarter. Capable of monitoring current, voltage, temperature and energy, the meter has been designed with data security, e-mobility, digitization and flexibility in mind and is a UL recognized component for the United States and Canada. The DCBM 400/600 complies with the standards UL 61010 and UL 810 with its certification in the FTRZ category for EV applications. To achieve this certification, the meter had to pass reinforced insulation tests, temperature testing of all its components and sub-assemblies, testing for protection against electric chock, durability of markings tests, equipment temperature limit tests and resistance to heat/fire risk tests. Says Claude Champion, General Manager at LEM USA Inc.: "The US and Canadian markets for EVs are continually expanding but this growth could be held back by insufficient access to rapid DC charging stations. LEM understands exactly what the sector needs and has worked closely with EVCS manufacturers and installers when developing solutions like the DCBM 400/600. We are ready to help make a zero-carbon future possible for North America."

Insulation Test System up to 30kV
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Learn more:
emc-partner.com
  • Product Release
  • 2023-01-15

EMC Partner is offering an impulse insulation tester 1.2/50 µs from 500V to 30kV with integrated breakdown detection directly on generator or remote on the test object. Colour touch panel control with data collection and reporting are included. Optional impedances up to 5kΩ. The INS-1250 family of impulse insulation testers is designed for material insulation, components and electrical equipment safety in both development and production environments. The device features high accuracy internal or external measurement systems, programmable to detect breakdown with pass/fail criteria based on voltage and current impulse integral. Personnel safety is ensured through an emergency stop, warning lamp and test cabinet, disabling high voltage circuits when activated.

Battery Experts Forum Announces Date and Location
  • Event News
  • 2023-01-13

The Battery Experts Forum will take place in 2023 from 07th – 09th November at the Wissenschafts- und Kongresszentrum Darmstadt (also known as Darmstadtium). As part of the networking event, the Who's Who of the international battery industry will meet for the 18th time this year. True to its motto "Charge up your knowledge", the event will focus on an exchange at the highest scientific level within the framework of the associated three-day conference. Anticipation of inspiring impulses, in the form of keynotes, tutorials and specialist presentations, will be aroused by topics such as recycling, current trends/world market, e-mobility, storage technologies and charging. In addition, various companies along the entire value chain of a battery - from cell manufacturers to OEMs - will present themselves on the modern and attractive exhibition area of the congress center and showcase materials, components, product innovations, test procedures, recycling processes and designs. As a must-have event for the industry, the Battery Experts Forum offers a combination of insider news with the highest scientific standards in the conference, latest trends in the exhibition and the chance to meet the experts of the industry up close, not only in the presentations but also during the networking events.

Powerful Filter Simulation with SPICE
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Learn more:
schurter.com
  • Product Release
  • 2023-01-12

Today, a successful circuit design is almost always preceded by a simulation. However, a simulation is only as good as the data available. SCHURTER offers sophisticated simulation models for several of its single- and three-phase common-mode chokes. With these advanced simulation models, it is possible to precisely determine the effect the choke has in solving noise problems in an electrical circuit. With detailed SPICE simulation models, SCHURTER offers reliable support for the safe and cost-efficient development of electronic circuits using current compensated or linear chokes. The respective damping curves, SPICE models, and mechanical CAD models are available. Circuital simulation is a key element for electronics design and is supported by various computer-based tools. A proven, fast processing tool for this is SPICE (Simulation Program with Integrated Circuit Emphasis), which was first presented in 1973 at the University of California, Berkeley. This program has been further developed over the last decades, and it is now a widely used program that calculates algorithmic approximated solutions for analog, digital and mixed electrical circuits.

Multi-Year Agreement for Delivery of Silicon Carbide Materials
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Learn more:
infineon.com
  • Industry News
  • 2023-01-12

Infineon is extending its cooperation with silicon carbide (SiC) suppliers. The German-based semiconductor manufacturer has signed a multi-year-supply and cooperation agreement with Resonac Corporation (formerly Showa Denko K.K.), complementing and expanding the announcement of 2021. The set of contracts will deepen the long-term partnership on SiC material. According to the agreement, Resonac will supply Infineon with SiC materials for the production of SiC semiconductors, covering a double-digit share of the forecasted demand for the next decade. While the initial phase focuses on 6" SiC material supply, Resonac will also support Infineon's transition to 8" wafer-diameter during the later years of the agreement. As part of the cooperation, Infineon will provide Resonac with intellectual property relating to SiC material technologies. The Infineon - Resonac partnership contributes to supply chain stability and will support the rapid growth of the emerging semiconductor material SiC. "The business opportunities in the area of renewable energy generation and storage, electromobility and infrastructure are enormous for the years to come. Infineon is doubling down on its investments into SiC technology and product portfolio, to proliferate the most comprehensive product offering to its customers. We are very happy that our partnership with Resonac will strongly support our market-leading position," said Peter Wawer, President of Infineon's Industrial Power Control division.

Aly Mashaly Appointed Director Application and Technical Solution Center in Europe
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Learn more:
rohm.com
  • People
  • 2023-01-12

As of January 1st, Aly Mashaly has succeeded Günter Richard as Director of ROHM's European Application and Technical Solution Center (ATSC). Günter Richard has retired after 32 years working for ROHM. Before having joined ROHM in 2015, Aly Mashaly has gained more than 20 years of experience in the electronics industry. He is an expert in power electronics, especially in the field of automotive applications. Also, he has worked as a development engineer and project manager in the fields of e-mobility and aerospace applications for several years. Mashaly is also a regular speaker at various conferences, including PCIM, ECPE, EPE and CS International. He holds degrees from the Ain Shams University Cairo and Leibniz University Hanover where he has studied electrical engineering. For his new role at ROHM, he has set himself ambitious goals: "With our highly skilled team, technical services and high quality products we strive for excellence to be a competent partner to our customers. On top, we want to be a supplier and partner for innovative solutions to help our society to overcome some pressing challenges of our time," states Mashaly. "I would also like to express my gratitude to my predecessor Günter Richard who has established the Application and Technical Solution Center back in 2019 and who has made the transition very easy to me," adds Mashaly. Aly Mashaly is now directly reporting to Wolfram Harnack, President of ROHM Semiconductor Europe: "Based on his huge amount of proven technical experience as well as his demonstrated leadership skills and commitment towards ROHM, I'm convinced that Mr. Mashaly will bring the ATSC and the technical customer service involved to the next level," concludes Wolfram Harnack.

Chae Lee Appointed Chief Executive Officer
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Learn more:
tagoretech.com
  • People
  • 2023-01-11

Tagore Technology announced the appointment of Chae Lee as Chief Executive Officer. Chae Lee brings more than 35 years of experience to Tagore Technology. Prior to joining Tagore, Mr. Lee was President and CEO of Insyte Systems. Before that, Mr. Lee was Senior Vice President and General Manager of NXP's Secure Interface and Power Solutions Business Unit where he grew the business unit's revenue to $1B. Prior to NXP, Mr. Lee spent 16 years at Maxim Integrated Products where he developed multiple new product lines at Maxim and as Senior Vice President and General Manager of the Mobility Group, grew its revenue from $350M to $1B. Mr. Lee graduated from the University of Missouri-Rolla with a Bachelor of Science degree in Electrical Engineering. "I am pleased to welcome Chae to Tagore," said Oleg Khaykin, Tagore Technology's Chairman. "Chae is an accomplished technology leader with an impressive track record." Mr. Khaykin added, "The Board feels Chae is an excellent choice to leverage our recent progress and lead the company to achieve our aggressive growth strategy and expanded profitability." CEO and co-founder of Tagore Technology, Amitava Das added: "As co-founders of Tagore, Manish Shah and I are delighted to welcome Chae to the Tagore family as we take the company to the next level in its growth trajectory."

70W and 160W External AC-DC Power Adapters
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Learn more:
lambda.tdk.com
  • Product Release
  • 2023-01-10

TDK announces the addition of the TDK-Lambda brand DTM70 and DTM160 series to the DTM family of compact medical and industrial AC-DC power adapters that are available in various power classes from 36W to 300W. Both series are available in Class I versions with a protective earth terminal on the input and Class II versions with double insulation protection. The adapters are housed in a robust plastic case with dimensions of only 120 x 52 x 31mm (DTM70) and 150 x 70 x 38mm (DTM160). The DTM70 is available with 12V, 15V, 18V, 24V, 36V and 48V output voltages and the DTM160 with 12V, 24V, 36V and 48V. The DTM70 and DTM160 series are suitable for 2MOPP medical applications and general industrial use. Both adapter series are certified to the IEC/EN/UL 60601-1 medical safety standard for clinical applications. In addition, IEC 60601-1-11 certification is available for all Class II versions, allowing these adapters to be used in home healthcare applications. For all versions, EMC is tested according to IEC 60601-1-2 Ed 4, which simplifies use with medical equipment. For industrial and ICT (Information and Communication Technology) applications, all models are tested according to IEC/BS/EN 62368-1 and are certified for installation altitudes up to 5000m. One special feature is the standard locking DIN output connector, which prevents unintentional disconnection of the output voltage of the adapter. Other connector versions and cable assemblies are available on request.

SiC MOSFETs to be Used in Inverters for Electric Vehicles
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Learn more:
rohm.com
  • Industry News
  • 2023-01-10

ROHM has recently announced the adoption of its 4th Generation SiC MOSFETs and gate driver ICs in electric vehicle inverters from Hitachi Astemo a Japanese automotive parts manufacturer. Especially for EVs, the inverter, which plays a central role in the drive system, needs to be made more efficient to extend the cruising range and reduce the size of the onboard battery, increasing the expectations for SiC power devices. ROHM's latest 4th Generation SiC MOSFETs deliver improved short-circuit withstand time along with the low ON-resistance, making it possible to extend the cruising range of electric vehicles by reducing power consumption 6% vs IGBTs (as calculated by the international standard WLTC fuel efficiency test) when installed in the main inverter. At the same time, Hitachi Astemo, which has been developing advanced technologies for vehicle motors and inverters for a number of years, already enjoys a considerable track record in the increasingly popular EV market. However, this marks the first time SiC devices will be adopted for the main inverter circuit to further improve performance. The inverters are slated to be supplied to automakers from 2025, starting in Japan then expanding overseas. Going forward, as a leading supplier of SiC power devices, ROHM will continue to strengthen its lineup and provide power solutions that contribute to technical innovation in vehicles by combining peripheral device technologies such as control ICs designed to maximize performance.

Christopher Bohn Named President
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Learn more:
tek.com
  • People
  • 2023-01-10

Tektronix has promoted Christopher Bohn to President of the global test and measurement company. Bohn most recently served as the Vice President Global Sales & Operations, where he was responsible for delivering global revenue growth and working cross-functionally to drive integration and customer focus between all revenue related functions. Bohn brings to the role a breadth of commercial, strategic, and continuous improvement experience and expertise that he gained over 15 years in global roles of increasing responsibility across Fortive's two largest operating companies, Fluke and Tektronix. "I'm extremely excited to continue the growth momentum at Tektronix by bringing outstanding solutions and services to our customers that help them accelerate technology advancements in the world," says Bohn. "For over 75 years, Tektronix has been at the forefront of helping customers bring new technologies to market and I'm happy to lead an organization with such a rich tradition of technology leadership." "As an engineer, veteran, and business leader, I'm drawn not only to technological innovation, but also to the culture and processes that have supported successful companies," says Bohn. "That culture - and the business processes that enable growth in both revenue and innovation - are what truly set an organization apart. I'm proud that Tektronix continues to invest in the best people, products, performance, and quality for our customers."

Acquisition of British Manufacturer of Wound Magnetic Components
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Learn more:
kamicgroup.com
  • Industry News
  • 2023-01-09

KAMIC Group has acquired, through its subsidiary ETAL (UK), all the shares in Avon Magnetics Ltd. The sellers are John and Lynn Anderson. Avon Magnetics is a British manufacturer of wound magnetic components such as transformers, inductors and coils, with associated designs. Most components are developed specifically for customer-unique applications. Operations are based in Christchurch, Dorset on the English south coast, where the company has its own production facility. Avon Magnetics' history goes back to the 1960s but the company has operated under its present name since 1992. Over the years the company has built up expertise and is certified according to AS9100 revision D and ISO9001:2015, which is reflected in the company's strong position as a supplier to industries such as aerospace, defence and medical technology. Avon Magnetics has some 50 employees and annual sales of approximately GBP 2.5 million. Following the acquisition, Avon Magnetics is part of KAMIC Group's Magnetics business area led by Dan Phelan. "Avon Magnetics is a highly reputed player with strong skills in the design, development and production of wound magnetic components for use in customer-unique and safety critical applications. Avon Magnetics will therefore be a valuable addition to our current operations in the Magnetics business area," says Fredrik Celsing, President and CEO of KAMIC Group.

Automotive-Grade Devices Run Cooler in Surface-Mount SMIT Package
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Learn more:
st.com
  • Product Release
  • 2023-01-09

STMicroelectronics has introduced five power-semiconductor bridges in popular configurations, housed in ST's ACEPACK SMIT package that eases assembly and enhances power density over conventional TO-style packages. Engineers can choose from two STPOWER 650V MOSFET half bridges, a 600V ultrafast diode bridge, a 1200V half-controlled full-wave rectifier, and a 1200V thyristor-controlled bridge leg. All devices meet automotive-industry requirements and are suitable for electric vehicle on-board chargers (OBC) and DC/DC converters, as well as industrial power conversion. ST's ACEPACK SMIT surface mounted package delivers the easy handling of an insulated package with the thermal efficiency of an exposed drain. It allows direct-bonded copper (DBC) die attachment for efficient top-side cooling. The 4.6 cm2 exposed metal topside of the ACEPACK SMIT permits easy attachment of a planar heatsink. This creates a space-saving low profile that maximizes thermal dissipation for greater reliability at high power. The module and heatsink can be placed using automated inline equipment, which saves manual processes and boosts productivity. While minimizing the stack height and enhancing power density, the topside cooling design and 32.7mm x 22.5mm package footprint allow 6.6mm lead-to-lead creepage distance. The tab-to-lead insulation is 4500Vrms. The package also has low parasitic inductance and capacitance. The SH68N65DM6AG and SH32N65DM6AG 650V-MDmesh DM6 MOSFET half bridges now available in ACEPACK SMIT are AQG-324 qualified. Their Rds(on) (max) of 41m? in the SH68N65DM6AG and 97m? in the SH32N65DM6AG ensures high electrical efficiency and low thermal dissipation. They can be used in DC/DC converters for both OBC and high voltage to low voltage section. Their multi-role flexibility helps streamline inventory and simplify procurement.

Vertical GaN Sample Shipments to Customers Commencing in Q1 2023
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Learn more:
odysseysemi.com
  • Industry News
  • 2023-01-09

Odyssey Semiconductor announces product sample fabrication is complete with shipments to customers commencing in Q1 2023. "Our backlog of customers has been eagerly waiting for these vertical GaN product samples. I'm proud to report that fabrication was completed as planned in Q4 2022 and now the samples are being prepared for shipment to customers later this quarter," said Mark Davidson, Odyssey's Chief Executive Officer. "We will work closely with these initial customers to gain valuable feedback on their product features. We expect to secure product development agreements with customers by the end of Q2 2023." Odyssey's approach to vertical GaN will offer even greater commercial advantages over silicon than silicon carbide or lateral GaN. Vertical GaN offers a 10x advantage over silicon carbide (SiC) at performance and cost levels unattainable by the competing technologies. The market the Company is pursuing is large and fast growing. The 650 volt segment is the larger market today, expected to grow at a 20% compound annual growth rate. The 1200 volt product market segment is expected to grow faster at 63% CAGR and will become the larger market in the second half of this decade. Together, the 650 and 1200 volt power device market is expected to exceed $5 billion in 2027, a 40% combined CAGR according to Yole Group, a French market research firm.

Power Adapter Reference Design with TO-220 GaN FETs
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Learn more:
transphormusa.com
  • Product Release
  • 2023-01-05

Transphorm announced availability of its 240W Power Adapter Reference Design. The TDAIO-TPH-ON-240W-RD deploys a CCM Boost PFC + Half-Bridge LLC topology to deliver a peak power efficiency of over 96 percent with a power density up to 30 W/in3. Transphorm's design uses three SuperGaN FETs (TP65H150G4PS) each with an on-resistance of 150 milliohms. The GaN FET comes as a 3-lead TO-220, a well-known and long-trusted transistor package that offers superior thermals at lowline for higher current power systems running PFC configurations. The reference design is intended to simplify and quicken power system development for applications such as high-power density AC-to-DC power supplies, fast chargers, IoT devices, laptops, medical power supplies, and power tools. The TDAIO-TPH-ON-240W-RD is a 240W 24V 10A AC-to-DC power adapter reference design. It pairs the TP65H150G4PS GaN FETs with onsemi's off-the-shelf NCP1654 CCM PFC controller and NCP1399 LLC controller. The design uses a 25 millimeter heatsink that produces a power density of over 24 W/in3. The power density can increase by approximately 25 percent to 30 W/in3 depending on the heatsink design. This high power density and efficiency range is primarily due to the FET's packaging as Transphorm offers the only high voltage GaN devices in a TO-220 today. Power adapters, along with all universal AC-to-DC power supplies, require high current at lowline (i.e., 90 Vac) which can require paralleling two PQFN packages (as typically seen with e-mode GaN) to achieve the desired power output. This method reduces a power supply's power density while requiring 2x part count. Transphorm's TO-220 packages mitigate this, thus providing unparalleled power density at a lower cost - a result not currently possible with e-mode GaN.

Medical and Industrial Power Conversion Platforms
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Learn more:
advancedenergy.com
  • Product Release
  • 2023-01-05

Advanced Energy Industries introduced two ranges of AC-DC power supplies for critical medical and industrial equipment. The SL Power NGB800 800 W and NGB1200 1200 W families are optimized to address the performance, power, size, reliability and compliance requirements of medical and industrial applications. The power supplies combine compact form factors and typical efficiencies above 90%. With full medical and industrial safety and EMC approvals, they comply with IEC 60601-1-2 4th edition covering medical equipment and applications operating in heavy industrial areas. "Medical and industrial OEMs want to reduce the size, improve the performance and extend the operating life of their equipment while minimizing time-to-market," said Conor Duffy, vice president of marketing, medical power products at Advanced Energy. "With their high efficiencies, small form factors, compliance with all relevant standards and long operating lives, the NGB family of power supplies enable equipment designers to address these challenging requirements. Deep engineering and integration support from Advanced Energy's technical teams further speed development cycles." Designed to meet the lifetime reliability requirements of equipment ranging from medical imaging and patient monitoring to industrial automation, the NGB families offer an MTBF in excess of 500,000 hours and come with a three-year warranty. Long-term reliability is further supported by the specification of high-quality electrolytic capacitors with operating lives over seven years. These power supplies can accommodate a wide 85 – 264 VAC input range and offer output voltages from 12 Vdc to 48 Vdc. Power supplies in the NGB800 family are convection cooled, while the NGB1200 units feature an integrated, low-noise fan.

SiC Technology Enhances Performance of DC Optimizers
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Learn more:
onsemi.com
  • Industry News
  • 2023-01-05

onsemi and Ampt LLC announced their collaboration to meet the high demand for DC string optimizers. Ampt uses onsemi's N-Channel SiC MOSFET, part of the EliteSiC family of silicon carbide (SiC) technologies, in its DC string optimizers for critical power switching applications. Ampt string optimizers are used in large-scale PV power plants, enabling lower-cost and higher performing solar and DC-coupled energy storage systems that are collocated within the solar power plant. The string optimizers deliver power from the PV array at a high and fixed voltage for system voltages ranging from 600 to 1500 VDC, reducing the overall current requirements and cost of the power plant. Ampt optimizers enable higher round-trip – charging and discharging – efficiency in the energy storage system and solar power plant by leveraging onsemi's latest SiC MOSEFT technology with lowest ON resistance and switching loses. "Incorporating onsemi's EliteSiC technology into our DC optimizers helps utility scale solar developers and owners improve their project economics," said Levent Gun, CEO of Ampt. "Clearly, the product performance was a critical decision point for us, but onsemi's technical support during the design phase and their ongoing supply assurance to support Ampt's rapid scaling are the hallmarks of a strong partner."

Full Brick Power Factor Correction AC-DC Module
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Learn more:
lambda.tdk.com
  • Product Release
  • 2023-01-05

TDK Corporation announces the introduction of the TDK-Lambda brand PF1500B-360 full brick power module. Rated at 1512W with an input of 170 to 265V or 1008W from 85 to 265V, the module delivers a non-isolated, regulated 360Vdc output with a 0.98 power factor. The PF1500B-360 is ideally suitable for high voltage power systems using isolated DC-DC converters in a distributed power architecture configuration, or for loads requiring a high voltage source. Other applications include LED lighting, semiconductor fabrication and custom power supplies using power module-based solutions. The PF1500B-360 is packaged in the industry standard full brick footprint, measuring 116.8mm in length, 61mm wide and 12.7mm high (4.6 x 2.4 x 0.5 inches) enabling low profile designs. The module can operate reliably with baseplate temperatures of 100°C and in ambient temperatures of -40 to 85°C due to efficiencies of up to 96.5%. Standard features include a 10 - 16V 10mA auxiliary voltage, remote on/off, inverter good and a signal indicating the output voltage is more than 350V to enable isolated DC-DC converters to begin operating. Up to three modules may be connected in parallel with current sharing to provide additional power. The input and output to ground isolation is 2,500Vac. Safety certification is to the IEC/EN/CSA/UL 62368-1 standard and has CE / UKCA marks to the Low Voltage and RoHS Directives. With external circuitry the PF1500B-360 will meet radiated and conducted emissions and comply with the IEC 61000-4 immunity standards.

Formula E Team Kicks Off Season 9 in Mexico City
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Learn more:
mouser.com
  • Industry News
  • 2023-01-04

Mouser Electronics cheers on the DS PENSKE Formula E team as they kick off Season 9 at the Autodromo Hermanos Rodriguez track in Mexico City on January 14, 2023. With a race-ready surface and long corners, Mexico City is one of the fastest tracks on the calendar, featuring a mix of long and fast straights and a technical infield section through Foro Sol stadium. Mouser is partnering with the DS PENSKE team throughout the 2022–23 ABB FIA Formula E World Championship racing season in collaboration with TTI, Inc. and valued manufacturers Molex and KYOCERA AVX. The DS PENSKE team will be racing the new third-generation Formula E DS E-TENSE FE23, which combines high-performance, efficiency, and stability. The Gen3 cars feature a top speed of 280 kph, are 60 kg lighter than the Gen2 cars, and offer double the regen capacity - meaning more than 40% of the energy used in-race is via regeneration under braking. The team benefits from two past Formula E Champions driving its cars, the reigning World Champion Stoffel Vandoorne and the two-time Formula E Champion, Jean-Éric Vergne.

Battery Cell and Pack Monitors
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Learn more:
ti.com
  • Product Release
  • 2023-01-04

Texas Instruments introduced automotive battery cell and pack monitors, maximizing electric vehicle (EV) drive time and enabling safer operation. As EVs grow in popularity, advanced battery management systems (BMS) are helping overcome critical barriers to widespread adoption. With a focus on solving complex system design challenges, TI provides a comprehensive portfolio of BMS devices, enabling automakers to create a safer, more reliable driving experience and accelerate EV adoption. The BQ79731-Q1 battery cell monitor and BQ79718-Q1 battery pack monitor provide an accuracy and precision in measuring battery voltage, current and temperature to effectively determine the true range of a vehicle and increase the overall life and safety of the battery pack. "Automakers aim to get the most range possible out of their EVs, and accurate state-of-charge estimations are vital to achieve this," said Sam Wong, general manager for BMS at TI. "Our new devices bring substantially higher precision to voltage and current measurement, giving automakers confidence to accurately measure an EV's true range."

Part of Energy Industries Division to be Acquired
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Learn more:
tuv.com
  • Industry News
  • 2023-01-04

TÜV Rheinland signs an agreement to acquire ABB's UK technical engineering consultancy, part of ABB's Energy Industries division. TÜV Rheinland will integrate this part into its Industrial Services & Cybersecurity business in the UK. The transaction is expected to close in Q2 2023. ABB's UK technical engineering consultancy including a network of subcontractors and associates has around 160 people operating from two main sites in the northeast and the northwest of England. A specialist team of technical experts helps global energy customers improve process safety, equipment and asset integrity as well as technical design for new and existing industrial plants. The combined business will create a scalable, broad-based technical engineering provider delivering a full-service offer to the high hazard industries, supporting customers in the energy transition and energy security. "We look forward to creating growth, stability and opportunity at a time where we are seeing increased demand for sustainability, decarbonization and business continuity," said Gareth Book, Managing Director TÜV Rheinland UK. "ABB's UK technical engineering consultancy will complement the existing risk, safety and integrity management services provided by TÜV Rheinland. Our aim is to build upon the long-standing customer relationships and trust that ABB and TÜV Rheinland have established in the UK over the last two decades."

Space Level SMD Inductor
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Learn more:
delevan.com
  • Product Release
  • 2023-01-04

Ideal for space and aerospace applications, the S0603 inductor offers excellent temperature stability, High Q and Ultra High SRF values, Low Outgassing Properties and an Operating Temperature Range of -55 to +125 C degrees (higher operating temperatures available) - all in a super small rugged package. Our environmental testing lab conducts load life, thermal shock, powdered burn-in, short time overload, real time x-ray, and extreme temperature testing to guarantee the S0603's reliability in challenging environments. It's manufactured in our cleanroom and rigorously tested to MIL-STD-981 for the high performance criteria demanded in space flight.

Silicon Carbide Devices Power Future Electric Vehicle Platforms
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Learn more:
wolfspeed.com
  • Industry News
  • 2023-01-04

Wolfspeed announced the company will be supplying Silicon Carbide devices to power future Mercedes-Benz Electric Vehicle (EV) platforms, enabling greater efficiency in the powertrain. Wolfspeed's semiconductors will be incorporated into next generation powertrain systems for several Mercedes-Benz vehicle lines. "Coming from a long-term technical collaboration history between our companies, we have now chosen Wolfspeed as one of our key partners for future Silicon Carbide devices, thus securing preferred long-term supply, technology and quality of this decisive semiconductor component for our electrification offensive," said Dr. Gunnar Güthenke, Head of Procurement and Supplier Quality for Mercedes-Benz. By leveraging Wolfspeed's expertise and Silicon Carbide devices to improve vehicle range and power, Mercedes-Benz plans to have some of the most efficient EVs on the road. "We are pleased to be supporting Mercedes-Benz, an organization with a long, successful history of providing world-class performance and luxury vehicles, as they introduce next-generation EVs to the market with highly efficient power systems," said Gregg Lowe, CEO of Wolfspeed. "We are continuing to invest in our manufacturing capacity to support a steepening demand curve for Silicon Carbide devices that will not only improve EV performance and drive greater consumer adoption, but also support the sustainability efforts of global automotive leaders like Mercedes-Benz."  

MOSFET for Light Electric Vehicles
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Learn more:
magnachip.com
  • Product Release
  • 2022-12-30

Magnachip Semiconductor Corporation ("Magnachip") announced that the company has launched its eighth-generation 150V MXT Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) optimized for Light Electric Vehicle (LEV) motor controllers and battery management systems (BMSs). This MOSFET (MDT15N054PTRH) features Magnachip's eighth-generation trench MOSFET technology to lower RDS(on) by 28%, as compared to the previous generation. Based on the enhanced design of the core cell and termination, a high figure of merit can be achieved and an increase in the total gate charge can be avoided. MDT15N054PTRH is available in a surface mount device TO-Leadless (TOLL) package to reduce product size and improve heat dissipation. The energy efficiency is also significantly enhanced by fast switching, while enabling high power density. In addition, a guaranteed operating junction temperature from -55°C up to 175°C and a high level of avalanche ruggedness help the new MXT MOSFET to exceed the performance requirements of LEV motor controllers and BMSs. "Beginning in 2008 we have released more than 40 MOSFET products for motor controllers and battery management systems and, since 2017, most of them have been made for LEV applications," said YJ Kim, CEO of Magnachip. "As a provider of high-performance MOSFETs, Magnachip will continue to deliver innovative solutions that meet the sophisticated requirements of the market."

Dr. Richard McDonough Assumes Role as Material Research Scientist
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Learn more:
indium.com
  • People
  • 2022-12-27

Indium Corporation is pleased to announce that Dr. Richard McDonough has been named Material Research Scientist. In his new role, Dr. McDonough is responsible for developing new thermal materials and products, and providing solutions for customer challenges and applications. He also develops new testing methods to evaluate power and thermal products, and gathers data on new and existing products for marketing presentations. Dr. McDonough joined Indium Corporation in August 2018 as a Product Specialist, most recently supporting the Semiconductor product line as a Senior Product Specialist. He has aided in the development of new products and the improvement of existing processes during his time with the company. Most notably, he assisted with the development of PicoShot and Indium12.8HF solder pastes for dispensing and jetting applications; helped to progress the development of sintering materials; and served as a dispensing expert for Indium Corporation. Prior to joining Indium Corporation, Dr. McDonough worked as an Analytical Chemist for Bristol Myers Squibb and as a Nuclear Engineering Officer in the U.S. Navy. He earned his bachelor's degree in chemistry from West Virginia University; his master's degree in physical chemistry from Syracuse University; and his Ph.D. in physical chemistry/biochemistry from Syracuse University.

Hightech Innovation Center in Munich
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Learn more:
we-online.com
  • Industry News
  • 2022-12-21

Moving into the future: The HIC is the innovation center of the Würth Elektronik Group of Companies. The location in Freiham offers the best conditions for driving forward research and development for trend-setting solutions. Würth Elektronik is relocating its Munich site from Garching to Freiham. With the Hightech Innovation Center Munich (HIC), a state-of-the-art building with a working and test field landscape, has been created in the west side of the metropolis. The facility offers the latest new-work approaches and space for 250 employees in the first construction phase. True to the company's motto "more than you expect," the HIC is not only an investment in the future of the company, but also in Munich as a location. With the facilities, there will be no limits to the engineers and scientists working on exciting topics such as wireless connectivity, sensor technology, power modules, IoT, cloud & software services, and Big Data. Within the next few years, an additional building with another 250 workstations will be built. This will provide sufficient space for growth and development. At the Garching site, the focus was largely on research and product development. In addition, valuable partnerships had been established due to the close proximity to various semiconductor manufacturers and universities. However, despite several expansions, the premises were still too small for the tech company. The HIC opens up completely new possibilities for the now 140-strong team to drive forward its own innovations "Made in Germany". A special highlight is the large test field, including two EMC test chambers, in which electromagnetic compatibility is tested. The test field accounts for around a quarter of the total area.

Boeing Launches O3b-mPOWER Satellite
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Learn more:
vicorpower.com
  • Industry News
  • 2022-12-21

The December 16 launch of Boeing's O3b mPOWER communication satellite marks a milestone for Vicor Corporation, whose high-performance, radiation-tolerant modules support Boeing's satellite mission. Boeing's O3b satellite will help deliver broadband internet access to the "other 3 billion" (O3b) people around the globe where access is limited or nonexistent. Drawing on an extensive heritage, Vicor power modules are ideally suited for powering advanced communications ASICs and FPGAs that require a very low-noise operating environment enabled by Vicor's soft-switching, high-frequency ZCS/ZVS power stages. The thermally adept modules in an SM-ChiP package provide superior density and efficiency. The complete source-to-point-of-load solution comprises four SM-ChiP modules powering advanced ASICs and FPGAs from a 100V bus: the BCM3423, a 100V input, 300W, K = 1/3 bus converter; the PRM2919, a 33V input 200W regulator; a VTM2919 150A current multiplier with an output of 0.8V; and a VTM2919 50A current multiplier with an output of 3.3V. The modules, which are manufactured in Andover, MA, (USA) are available in high-density SM-ChiP BGA packages. ChiPs are rated for operation from –40 to 125°C.

Pioneering 420 kV SF6-Free Gas-Insulated Switchgear Technology
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Learn more:
linxon.com
  • Industry News
  • 2022-12-21

Hitachi Energy and Linxon are collaborating to strengthen London Power Tunnel (LPT), a key power infrastructure project that will ensure reliable, clean electricity supply for England's capital city. To support National Grid in accelerating its net zero targets, Hitachi Energy will deliver EconiQ 420-kilovolt (kV) gas-insulated switchgear (GIS) and gas-insulated lines (GIL) containing no sulfur hexafluoride (SF6). As one of the world's largest investor-owned transmission and distribution utilities, National Grid has the ambition to remove all SF6 from its fleet by 2050. In 2020, it embarked on LPT project that will replace ageing high-voltage electricity cables and expand network capacity to meet the increasing electricity demand. Considered to be one of the city's largest engineering projects since the 1960s, the LPT will span 32.5 kilometers via underground tunnels in South London. Linxon is building Bengeworth Road substation for National Grid to develop the LPT  infrastructure. To support National Grid in its transition to SF6-free solutions, Hitachi Energy will deliver 7 bays of its EconiQ 420 kV GIS to enable the transmission of electricity over long distances while eliminating SF6, in addition to EconiQ 420 kV GIL. The EconiQ high-voltage portfolio is 100 percent as reliable as the conventional solutions based on SF6. The installation is expected to commence by 2023.

Sales Achievements Recognised
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Learn more:
distrelec.biz
  • Industry News
  • 2022-12-20

Distrelec announced the company has received the Award for Best Sales and Accounts Growth from Keysight Technologies, as part of its 2022 Partner Executive Forum which took place in Athens (Greece). Distrelec was selected by Keysight to receive the prize based on a solid 65% year-on-year growth in sales. The distributor's customer base for Keysight products has increased by 15%. Distrelec colleagues Darren Baxendale, Senior Supplier Business Manager, and Charlotte Kennedy, Head Of Category Management collected the prize together in the Greek capital earlier this month. Charlotte Kennedy stated: "We were delighted to attend Keysight Technologies' Partner Executive Forum where Distrelec was recognised as the 2022 Best Sales and Account Growth Partner. It is a result of our mutual collaboration and our dedication to supplying advanced measurement solutions at the leading edge of technology. We are thrilled with this achievement and we pride ourselves on delivering a portfolio and service offering aligned to customer requirements. Great team effort from everyone!"

MOSFETs Ideal for Small, Thin Devices
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Learn more:
rohm.com
  • Product Release
  • 2022-12-19

ROHM has developed a compact, high efficiency 20V Nch MOSFET, RA1C030LD, optimized for switching in small, thin devices, including smartphones and wearables such as wireless earbuds and other hearable equipment. The development of MOSFETs in wafer-level chip-size packages (WLCSP) that contribute to greater miniaturization while maintaining the necessary characteristics is becoming mainstream in the industry. ROHM leverages its strengths as an IC manufacturer to significantly reduce wiring resistance (which has increased with conventional discrete processes). The result is a compact power MOSFET that delivers low power loss. The RA1C030LD is offered in the DSN1006-3 wafer-level, chip-size package (1.0mm × 0.6mm) that takes advantage of ROHM's proprietary IC process to achieve low power dissipation together with greater miniaturization. In terms of the figure of merit that expresses the relationship between conduction and switching losses (ON-resistance × Qgd), a value has been achieved that is 20% lower than standard package products in the same package (1.0mm × 0.6mm or smaller), contributing to a smaller board area along with higher efficiency in a variety of compact devices. At the same time, ROHM's package structure provides insulated protection for the side walls (unlike standard products in the same package with no protection). This reduces the risk of shorts due to contact between components in compact devices that must resort to high density mounting due to space constraints, contributing to safer operation.

EMC Filters Offer Attenuation and Simple Grounding
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Learn more:
powell.com
  • Product Release
  • 2022-12-19

Powell Electronics is stocking Quell's EESeal+ EMI filter inserts with improved attenuation and frequency mitigation. The inserts are easily and quickly inserted into standard connectors in seconds without the need for any special tooling or soldering, forming an effective EMI filter and maintaining the environmental seal. Customized samples are available at very short lead times. The products benefit from Quell's patented EESeal+ technology which uses EMC filter components embedded into a silicone rubber insert that matches the size, shape and pin configuration of the connector to be filtered. Transient suppressors can also be included. Users can specify which filter elements are required for each pin, allowing for the creation of a completely custom filter insert with widely varying capacitor values, shorts and opens as desired. The EESeal+ technology benefits from lower contact resistance and lower inductance than standard EESeals due to the improved ground plane. Peak attenuation is around 45-50dB and customers have seen frequency mitigation as high as 100GHz. In addition to EMI filters the EESeal+ filters make it easy to ground pins to the shell such as the coaxial shields in Combo D-Sub connectors as well as ARINC and coaxial circular connections.

Hybrid Supercapacitors Available with Capacitances of 10 F, 25 F and 150 F
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Learn more:
rutronik24.com
  • Product Release
  • 2022-12-16

EATON offers energy storage devices with particularly high capacity for reliable use in emergency power supply, pulse power and hybrid energy systems with the HS / HSL hybrid supercapacitors, available at Rutronik24. Their flexibility is particularly impressive: they can be used as a stand-alone energy storage device or in combination with batteries to optimize costs, service life and operating time. System requirements can range from a few microwatts to hundreds of watts. Their operating voltage of 3.8 V provides high energy, while the low ESR ensures high power density. Low self-discharge makes them ideal for use in combination with batteries. Low temperatures down to -25 °C are part of the application range of the HSL supercapacitors. On the other hand, the HS variant has an extended temperature range of up to +85 °C.  The capacitors are also lead-free, halogen-free and RoHS-compliant. Further fields of application include industrial backup / ride-through, backup for IT server, smart water and gas meters, IoT energy storage, medical emergency power supply / alarm systems and truck / container asset tracking.

Three-Level Configurable Slew-Rate Controlled Power Switch
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Learn more:
diodes.com
  • Product Release
  • 2022-12-16

Diodes has introduced a versatile single-channel high-side power switch. The DIODES AP22980 features three different selectable slew rates, so that wider capacitance loads can be handled while keeping inrush currents down, ensuring system stability. This power switch is targeted at the solid-state data storage systems used in portable electronic equipment, computer hardware, and edge-based data center deployments. The N-channel MOSFET, with a built-in charge pump inside the AP22980, has an extremely low Rds(ON) of 5.1m? enabling loads reaching 6A while minimizing voltage drops and power losses in high current loading applications. By having a separate VBIAS pin, the minimum input voltage that it is capable of supporting is significantly lower, resulting in a wider input voltage range that can be covered - from 0.285V to 5.5V - enabling greater application flexibility. With 60µA (typical) quiescent supply current, the AP22980 is highly optimized for situations where keeping standby power consumption down is a priority. This device has an operational temperature range of -40°C to 105°C. If the junction temperature exceeds 150°C, an overtemperature protection mechanism is triggered. The AP22980 three-level selectable slew rate power switches are supplied in the compact W-QFN1520 package that takes up little board space and eases integration.

Elections for Infineon Supervisory Board
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Learn more:
infineon.com
  • People
  • 2022-12-16

In preparation for the Annual General Meeting on 16 February 2023, the Infineon Technologies Supervisory Board has proposed changes in its own composition to accompany the recent strategic decisions. In this context, Dr. Wolfgang Eder (70), Chairman of the Supervisory Board since 2019, and Hans-Ulrich Holdenried (71) have decided to support the renewal of the Supervisory Board and will resign from the Board at the next Annual General Meeting. Dr. Herbert Diess (64) and Klaus Helmrich (64) are the current candidates to succeed them. Subject to a confirming vote by the Annual General Meeting, Dr. Diess is expected to assume the role of Chairman of the Supervisory Board. "Now is the right time for changes to the Supervisory Board," says Dr. Eder, Chairman of the Infineon Supervisory Board. "First of all Cypress, Infineon's largest-ever acquisition with its approximately 10 billion USD purchase price, has now been successfully integrated. Second, the new Management Board team, led by Jochen Hanebeck, is doing excellent work. In the context of the most successful fiscal year in company history, we have jointly made extensive strategic decisions and updated the Target Operating Model, plotting a long-term future course for Infineon. I am pleased to have been able to contribute to Infineon's success during such a decisive phase. In the interest of an age-independent realignment of the Supervisory Board with a longer-term impact, I will not seek reelection. Given the highly challenging environment in which Infineon is active, I am pleased to welcome Dr. Herbert Diess as the ideal candidate to become my successor. He has excellent knowledge of the company and of the industry landscape."

Addition to Source-Down Power MOSFET Family
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Learn more:
infineon.com
  • Product Release
  • 2022-12-15

Infineon Technologies launches a Source-Down 3.3 x 3.3 mm² PQFN product family in the 25-150 V classes with Bottom-Side (BSC) and Dual-Side Cooling (DSC) variants. The product family provides significant enhancements on the component level to offer attractive solutions in DC-DC power conversion, opening up new possibilities for system innovation in server, telecom, OR-ing, battery protection, power tools, and charger applications. In the Source-Down (SD) concept, the MOSFET die source contact is flipped toward the footprint side of the package, which is then soldered to the PCB. In addition, the concept comprises an improved clip design on top of the chip for the drain contact and market-leading chip-to-package area ratio. As system form factors continuously shrink, two key aspects are essential: reduction of power losses and optimal thermal management. Compared to best-in-class PQFN 3.3 x 3.3 m² Drain-Down devices, the family improves the on-resistance (R DS(on)) by up to 35 percent. Infineon's OptiMOS Source-Down PQFN with Dual-Side Cooling provides an enhanced thermal interface to redirect power losses from the switch towards the heatsink. Dual-Side Cooling variants offer the most direct way to connect a power switch to a heatsink, increasing power dissipation capability by a factor of up to three compared to the corresponding Bottom-Side Cooled Source-Down variant.

Silicon Carbide Wafer Supply Agreement with Global Semiconductor Company
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Learn more:
wolfspeed.com
  • Industry News
  • 2022-12-15

Wolfspeed announced the expansion of an existing multi-year, long-term Silicon Carbide wafer supply agreement, now worth approximately $225 million. The expanded agreement calls for Wolfspeed to supply the company with 150 mm Silicon Carbide bare and epitaxial wafers, reinforcing the company's vision for an industry-wide transition from silicon to Silicon Carbide semiconductor power devices. "Wolfspeed has an unmatched level of experience with Silicon Carbide and, as a result, is a key player in supplying the rapidly growing demand for Silicon Carbide," said Dr. Cengiz Balkas, SVP and GM of Materials for Wolfspeed. "This agreement further strengthens our long-time cooperation with a best-in-class power semiconductor manufacturer.  This well-established partnership, paired with our most recent announcement of a multi-billion-dollar materials expansion in North Carolina, is a huge step forward in our mission of transitioning the industry from silicon to Silicon Carbide." The supply agreement enables Silicon Carbide applications in broad markets such as renewable energy and storage, electric vehicles, charging infrastructure, industrial power supplies, traction and variable speed drives.

Point of Load DC/DCs with High-Efficiency Suit Distributed Power
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Learn more:
recom-power.com
  • Product Release
  • 2022-12-15

RECOM Power announces two ranges of cost-effective switching regulators - the RPMGQ-20 and RPMGS-20 open-frame, through-hole, non-isolated DC/DC buck converters with 20A output rating. The RPMGQ-20 is in an industry-standard quarter-brick format while the RPMGS-20 is in the emerging standard package size of 36.83 x 34.04mm with a standard sixteenth brick pin-out. Both products have a maximum height of 15mm from their mounting surface. The parts operate from an 18V-75V input and optional nominal outputs are 5V or 12V, trimmable over a wide range, 3.3V to 8V and 8V to 24V respectively. The efficiency of the RPMGQ-20 and RPMGS-20 parts is very high, peaking at 98% for the 12V output versions and 94% for 5V output, with a nearly-flat efficiency curve down to around 10% load. Due to the low losses and advanced thermal design, full load is available with air-flow to an ambient temperature of more than 90°C for all variants with derating to 120°C. The products feature comprehensive protection against input undervoltage, output over-current, short circuits, and over-temperature. Remote sense and control input is also provided.

Partnership to Develop Emerging Technologies
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Learn more:
j-ames.com
  • Industry News
  • 2022-12-15

J.A.M.E.S (Jetted Additively Manufactured Electronics Sources) announced a partnership with heliguyTM Lab. The goal of this partnership is to join a global network to foster Additively Manufactured Electronics (AME) technology and redefine the electronics industry. J.A.M.E.S was founded to drive AME development through a collaborative space that delivers technical knowledge, design enablement and real-time communication, within a diverse global community, and at all levels of expertise. Throughout the J.A.M.E.S community, professionals and enthusiasts from different fields are able to collaborate, bringing together a rich array of experience and knowledge that is gathered from a variety of manufacturing processes, design methods, and materials across multiple industries to form a comprehensive initiative. This enables the J.A.M.E.S community to explore new possibilities in 3D printed electronics, leave behind conventional electronics manufacturing, and be part of visionary projects to advance the AME sector and increase accessibility. Andreas Müller, CEO of J.A.M.E.S said, "We aim to identify and advance the possibilities that exist for the future of AME. Sharing our knowledge and bringing this technology to the next level is one of our goals. Partnering with heliguy Lab will make a huge positive impact on merging technologies and discovering new paths in electrification processes. We are confident this collaboration will play a key role in shaping the future of AME technology."

Portfolio of High-Speed Inductive Resolvers
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Learn more:
melexis.com
  • Product Release
  • 2022-12-15

Melexis is adding the MLX90517 to its range of inductive resolver ICs. Through an external compensation algorithm, the MLX90517 ensures accuracy of better than ±0.36° at up to 660,000 e-rpm without the need of any IC programming. The MLX90517 works in combination with a set of PCB based coils. Arrangements can be easily adapted in line with the number of pole-pairs of the motor. Support for both on-axis (end-of-shaft) and off-axis (side-of-shaft or through-shaft) sensing provides engineers with options to implement coils for reliable and accurate sensing within acute mechanical constraints. The 3-phase based coil design enhances linearity via harmonic filtering that would not be possible in 2-coil systems. "The MLX90510 and MLX90517 bring engineers the freedom to choose between on-chip and off-chip compensation," states Lorenzo Lugani, Product Manager Inductive Sensors at Melexis. The MLX90517 has been developed as an ASIL C SEooC (Safety Element out of Context) in accordance with ISO 26262. It supports up to ASIL D system integration. Built-in overvoltage and reverse-polarity protection (±24 V on the supply and ±18 V on the outputs) allow it to withstand the most challenging of electrical environments. It is AEC-Q100 qualified, and has a -40°C to +160°C operational temperature range. This device is supplied in a TSSOP-16 package.

Supporting the Transmission of Renewable Power
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Learn more:
hitachi.com
  • Industry News
  • 2022-12-15

Hitachi Energy announced that it has been selected by Hydro-Québec for its high-voltage direct current (HVDC) technology for the transmission of electricity, which will ensure the sustainability of the energy exchange between the Quebec network, in eastern Canada, and New York State in the northeastern United States. Hydro-Québec, the largest hydroelectricity producer in Canada and one of the largest hydroelectricity producers in the world, is a public company that generates, transmits, and distributes reliable, clean and renewable electricity in Québec. Thanks to its surplus energy, it supplies the Canadian provinces and the northeastern United States. The Châteauguay HVDC system will enable the transmission of up to 1,500 megawatts of electricity between the electrical networks of Quebec and the state of New York which will contribute to maintaining a low carbon footprint in the region. This system will replace existing equipment which has been in operation since 1984, increasing the efficiency and controllability, plus raising the power conversion capacity of the Châteauguay HVDC system by 50 percent. Hitachi Energy is supplying a "back-to-back" converter station, which converts AC power to DC then reconverts it to AC from DC enabling the interconnection of the 735 kilovolt Canadian and 765 kilovolt New York grids which are "out of phase" and cannot be connected directly via traditional AC systems.

Award Reflects Support and Collaboration Spanning Over a Decade
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Learn more:
ttelectronics.com
  • Industry News
  • 2022-12-14

TT Electronics has earned a Supplier Excellence Award from Applied Materials, which recognizes the company's top performing suppliers for outstanding technical and operational achievements in areas including quality, service, lead time, delivery, cost, and responsiveness. TT Electronics received the award for Best in Class Performance. "Applied Materials congratulates our Supplier Excellence Award recipients for achieving outstanding performance over the past year," said Dr. Paul Chhabra, Corporate Vice President of Global Supply Chain at Applied Materials. "Having strategic relationships throughout the supply chain is more important than ever, and we thank our suppliers for their strong support and collaboration." "This prestigious award from Applied Materials illustrates the solid relationships we have with leaders in high-growth markets where we consistently deliver world-class customer service and proactive supply chain expertise," said Michael Leahan, Chief Operating Officer, TT Electronics. "TT Electronics has provided global manufacturing and agile supply chain solutions to Applied for over 12 years. This award reinforces TT's reputation as a solid, trusted partner with industry relationships spanning decades and multiple geographies."

GaN FETs for DC-DC Conversion, AC/DC SMPS and Chargers
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Learn more:
epc-co.com
  • Product Release
  • 2022-12-14

EPC introduces the 150 V, 3 m? EPC2305 and the 200 V, 5 m? EPC2304 GaN FETs in a thermally enhanced QFN package with exposed top and tiny 3 mm x 5 mm footprint. These devices are the lowest on-resistance (RDS(on)) FETs in the market at 150 V and 200 V in a size that is fifteen times smaller than alternative Si MOSFETs. In addition to offering devices with half the on-resistance and fifteen times smaller, QG, QGD, QOSS are more than three times smaller than Si MOSFETs and the reverse recovery charge (QRR), is zero. These characteristics result in switching losses that are six times smaller in both hard switching and soft switching applications. The driver losses are three times less than silicon solutions and ringing and overshoot are both significantly reduced. For sinusoidal BLDC motor drives, these devices enable < 20 ns deadtime and higher frequency to reduce noise, minimize size to allow for integration with the motor, reduce the input filter and eliminate the electrolytic capacitors, and increase motor + driver efficiency more than 8% by eliminating vibrations and distortions. This makes them ideal for forklift, escooter, eMobility, robots, and power tool motor drives.

Collaboration on Laptop Power Adapter Design with Integrated GaN
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Learn more:
chiconypower.com
  • Industry News
  • 2022-12-14

Chicony Power announced its collaboration with Texas Instruments (TI) to roll out Chicony Power's latest 65W laptop power adapter, Le Petit, featuring TI's GaN technology. Leveraging TI's half-bridge GaN FET with integrated gate driver, LMG2610, Chicony Power reduced the size of its 65W power adapter by 50% and increased up to 94% power efficiency compared to other 65W adaptors in the market, raising the bar for the laptop power industry. Chicony Power's long-term focus is on smart energy-saving solutions and improving power conversion efficiency in electronic power supply design. Chicony Power has worked closely with international IC companies and consistently provides market's and technical requirements, discusses the new design, and assists IC companies with the feasibility assessment, verification and debugging to help develop solutions in new designs. Chicony Power teamed up with TI for its expertise in high-voltage design and its integrated GaN technology. TI's LMG2610 is designed to be paired with the UCC28780/ UCC28782 active clamp flyback (ACF) controllers to create an easy-to-use, high-efficiency and high power-density solution for AC/DC designs under 75 W. Chicony Power leverages TI's integrated GaN technology with active clamp flyback (ACF) controller to enable a whole new world of power supply through this collaboration.

Top Supplier of Passive Components in the French Market
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Learn more:
bourns.com
  • Industry News
  • 2022-12-13

Bourns announced it has received a Best Supplier of 2022 Award from Syndicat Professionnel de la Distribution en Electronique Industrielle (SPDEI), the French association of electronic components distributors. The award was given to Bourns as one of the five top suppliers of passive components supporting the French market. The SPDEI award acknowledges suppliers based on five key criteria that include partnership with distributors, technology and service innovation, profitability for distributors, allocating resources and providing protection and traceability of design. "Bourns has made significant investments in the development of innovative passive components designed to meet strict standards and application requirements. It is an honor to receive this award that recognizes Bourns' commitment to engineering high-quality, breakthrough products and our culture of responsive customer service," said James Harrington, Senior Vice President Worldwide Sales at Bourns. "I'd like to congratulate the Bourns France team for receiving this prestigious award based on their outstanding support and performance."

Battery Protector Series to Include 60 A Rating to Prevent Battery Pack Damage
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Learn more:
littelfuse.com
  • Product Release
  • 2022-12-13

Littelfuse announced the extension of its ITV9550 surface-mountable Li-ion battery protector series. These fuses safeguard battery packs against overcurrent and overcharging (overvoltage) conditions. The latest ITV9550 addition provides a 60 amp, three-terminal fuse in a 9.5 x 5.0 mm footprint. The innovative design incorporates an embedded fuse and heater elements that provide fast response and reliable performance to interrupt the battery pack's charging or discharging circuit before an overcharge or overheating condition occurs. "These new released parts are 60-amp rated devices, which extend our ITV line of li-ion battery pack protection fuses to provide more options for electronics designers," said Stephen Li, Global Product Manager at Littelfuse. "Expanding our portfolio of surface-mountable, three-terminal battery pack protectors enables us to provide this innovative solution to an even broader range of consumer and industry applications."

Power Semiconductor Module Will Help to Simplify and Downsize Inverter Systems
  • Product Release
  • 2022-12-13

Mitsubishi Electric Corporation announced that its SLIMDIP-Z power semiconductor module, featuring an extra-high 30A rated current for use in inverter systems of home appliances, will be released in February 2023. The compact module will enable the SLIMDIPTM series to meet a wider range of power and size needs for inverter units, specifically by simplifying and downsizing systems for multifunctional and sophisticated products such as air conditioners, washing machines and refrigerators. The demand is growing for power semiconductors capable of efficiently converting electric power to help realize a low-carbon world. In 1997, Mitsubishi Electric commercialized its first DIPIPMTM as a high-performance intelligent power module with a transfer-mold structure incorporating a switching device and a control IC to drive and protect the switching element. Since then, DIPIPMs have been widely adapted for use in large appliances and inverters for industrial motors, contributing to the downsizing and energy-efficiency of inverter boards.

EMV 2023: Impulses for the EMC Industry
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Learn more:
emv.mesago.com
  • Event News
  • 2022-12-13

Parallel to the trade fair for electromagnetic compatibility from 28. – 30.03.2023 in Stuttgart, the industry can look forward to a total of 36 practice-oriented workshops on current EMC topics. Registrations for these are now possible online. The workshop topics were selected in advance by a 19-member committee of experts. "A large number of participants from industry and science will meet at the EMV 2023 in Stuttgart for expert exchange," explains committee chairman Dipl.-Phys. Detlef Hoffmann from Webasto Roof & Components SE. "The workshop program offers a wide range of topics and allows newcomers, senior experts and decision-makers to find detailed opportunities to deepen their knowledge and expand their experience." In 2023, the EMC workshops will cover the key topics of measurement and immunity, measurement and emitted interference, interference protection/exposure, and approval and safety. In addition, the program includes specialized topics on aerospace and medical technology, as well as proven fundamentals. The well-timed enables attendees to attend several workshops that build on, or complement each other in terms of content. Six of the workshops will be held in English. Of these, three will be held by Frank Leferink, University of Twente and two by Dr. Diethard Hansen, EURO EMC SERVICE (EES) Dr. Hansen Consulting. For the first time, the speaker Arturo Mediano from the University of Zaragoza will participate with the topic "EMI/EMC debugging using oscilloscopes with time frequency conversion".

PCIM Europe 2023: A Positive Outlook
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Learn more:
pcim.mesago.com
  • Event News
  • 2022-12-12

From 9 - 11 May 2023, the PCIM Europe will once again be inviting the power electronics industry to Nuremberg, Germany. Participants can enjoy personal exchange complemented by a wide range of highlights for experts in the field. Just over five months prior to the start of the event, the exhibition for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management reports around 350 registered exhibitors; more than half of them from abroad. With their products and services, these companies represent the entire spectrum of the industry. Numerous key players in the field of power electronics have already confirmed their participation, including Fuji Electric Europe, Infineon, Mitsubishi Electric Europe, Semikron Danfoss, Wolfspeed, Nexperia, Rohm Semiconductor and Hitachi Europe. In addition, the event will again welcome various new exhibitors, thereby further enriching the offering at the PCIM Europe. These include companies such as Texas Instruments Incorporated, Robert Bosch GmbH, Volkswagen AG, Renesas Electronics Europe GmbH and Melexis Technologies NV. The international conference, which will be held in parallel, registered a record with more than 400 submissions upon closure of the application deadline for speakers. This outstanding response promises a high-quality and varied conference program with presentations from research and development of leading companies and universities from all areas of power electronics. The program will be published in January 2023.

Polymer Chip Capacitor Series Offers Voltage Ratings up to 35 VDC
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Learn more:
cde.com
  • Product Release
  • 2022-12-12

Cornell Dubilier's XMPL polymer chip capacitor series has been expanded to match applications with higher voltage and capacitance requirements. Their capacitance and voltage stability with temperature and frequency make these conductive polymer capacitors ideal for applications where bulk storage and high ripple current filtering are needed. Possessing much lower ESR and a shorter height profile than SMT aluminum electrolytics, XMPLs offer designers the opportunity to reduce the size and cost of their high-frequency/high-ripple applications by using fewer components. Standard capacitance values now range from 6.8µF to 470µF, with a maximum working voltage of 35VDC in a molded package measuring 7.3x4.3x1.9 mm. The operating temperature is -55°C to 105°C with a load life of 2,000 hours at 105°C with rated voltage applied. XMPLs are halogen-free and RoHS-compliant. Applications include high-frequency compact power supplies, DC-to-DC converters, LED lighting, industrial instrumentation, and automation.

Automotive Qualified GaN FETs for Vehicle Electronics and Advanced Autonomy
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Learn more:
epc-co.com
  • Product Release
  • 2022-12-08

Efficient Power Conversion expands the selection of automotive, off-the-shelf gallium nitride transistors with the introduction of 80 V, 6 mΩ EPC2204A that delivers 125 A pulsed current in a 2.5 mm x 1.5 mm footprint and the 80 V, 3.2 mΩ EPC2218A that delivers 231 A pulsed current is a 3.5 mm x 1.95 mm footprint, offering designers significantly smaller and more efficient devices than silicon MOSFETs for automotive DC-DC for 48V-12V conversion, infotainment, and lidar for autonomous driving. The EPC2204A and EPC2218A are ideal for applications with demanding requirements for high power density including 48 V – 12 V bidirectional converters for mild hybrid cars, 24 V – 48 V DC-DC in cars and trucks, and for infotainment, lighting, and ADAS applications. Lower gate charges (QGD), and zero reverse recovery losses allow high-frequency operation of 1 MHz and beyond. Combined with high efficiency in a super tiny footprint, these factors enable state-of-the-art power density. As an example, for 2 kW – 4 kW 48 V-12 V converters, GaN devices allow five times the frequency of silicon MOSFET solutions.  Also, with a quarter of the inductance, inductor size and losses are reduced allowing 40% higher current per phase and up to half of the phases for lower system cost and half of the size. Despite the smaller size, efficiency increases up to 98%, greater than 2% higher than MOSFET solutions.

Power Shunt Resistors Contribute to Greater Miniaturization
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Learn more:
rohm.com
  • Product Release
  • 2022-12-08

ROHM has recently developed wide terminal shunt resistors, LTR10L. They are optimized for a variety of applications in the automotive, industrial, and consumer sectors, while also strengthening its lineup with two general-purpose MCR series shunt resistors (MCR10L and MCR18L). In recent years, high efficiency operation is required from the viewpoint of energy conservation – not only in battery-driven applications such as mobile devices and EVs, but in consumer and industrial equipment as well powered by electrical outlets. For high efficiency, it is important to accurately detect parameters such as current and voltage in order to operate devices optimally. This requires shunt resistors that combine high accuracy with high reliability current detection. At the same time, manufacturers of applications utilizing higher board densities are demanding even smaller shunt resistors. To meet these needs, the LTR10L series delivers highest rated power and good temperature coefficient of resistance (TCR) in a compact 0508-size (0.5inch × 0.8inch) / 1220-size (1.25mm × 2.0mm) that contributes to both high reliability and greater miniaturization. Improving the resistive element material and applying terminal temperature derating method allowed LTR10L to deliver an industry-leading 1W rated power in the 0508-size - 88% smaller than existing products. In addition, high-accuracy ±0.5% resistance tolerance has been achieved, together with best-in-class TCR and anti-sulfuration characteristics.

Automotive-Qualified High Frequency Inductors with Tight Tolerances
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Learn more:
we-online.com
  • Product Release
  • 2022-12-08

Würth Elektronik now offers WE-MCI—a series of high-frequency inductors boasting a wide range of values: The 0402 package covers inductance values from 1 to 270 nH, while the WE-MCIs in a 0603 package range from 1 to 470 nH. A special feature of these automotive-approved components is their unusually tight tolerances of ±5% or ±0.3 nH for those models below 5.6 nH. AEC-Q200 qualified, with an operating temperature range -55 to +125°C, the SMT mountable components are suitable for applications in infotainment, keyless access systems, Bluetooth and filter circuits, to name but a few. The WE-MCIs are provided with polarity markings on both sides for improved production control. Design kits are available for both inductor package types, so components with the right values are always at hand. Würth Elektronik will always replenish these design kits free of charge.

Modules for Silicon-Carbide Inverter Development
  • Industry News
  • 2022-12-08

Semikron Danfoss announced a long-term agreement with Dana, a major Tier 1 manufacturer of propulsion solutions to power vehicles and mobile machines. The agreement is for the supply of silicon-carbide semiconductors for use in the company’s Dana TM4 silicon-carbide inverters. The eMPack® platform from Semikron Danfoss is optimized for silicon carbide (SiC) technology, and the fully sintered “Direct Pressed Die“ (DPD) technology, which allows for extremely compact, scalable and reliable inverters, was one of the crucial factors that clinched the deal between Dana and Semikron Danfoss. “Semikron Danfoss is proud to be selected by Dana to deliver high performance SiC-based eMPack® traction modules for their future inverter platforms. Our modular design, capable of utilizing SiC devices from multiple chip sources, is the ideal module platform for Dana’s broad inverter portfolio”, said Siegbert Haumann, Senior Vice President, Semikron Danfoss Automotive Division. Targeted for use across the light-vehicle, commercial-vehicle, and off-highway mobility markets, Dana’s silicon-carbide inverter designs will enable higher system efficiency and power density in a compact package for medium- and high-voltage inverter applications, resulting in the potential for increased range. “This long-term supply agreement with Semikron Danfoss gives us a strong strategic advantage as we expand the use of silicon-carbide technology and support our customers with innovative, efficient, and powerful solutions,” said Christophe Dominiak, chief technology officer, Dana Incorporated.

ees Europe and InterBattery Cooperate: South Korea to Present in Munich
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Learn more:
ees-europe.com
  • Event News
  • 2022-12-07

For the first time, ees Europe 2023 is cooperating with the Korea Battery Industry Association (KBIA), South Korea's largest exhibition and convention organizer Coex, and the state-run Korea Trade-Investment Promotion Agency (KOTRA). As part of the "InterBattery Showcase", companies from the South Korean battery industry will present themselves in a special exhibition area at ees Europe at Messe München. Within the Showcase, InterBattery will also organize its own conference, The Battery Day Europe, from June 14-15, which will discuss the latest technologies, insights and forecasts of the global battery industry and analyze market policies between Europe and Korea. The Battery Day Europe will perfectly complement the ees Europe Conference (June 13–14). The ees Europe, whose focus is on battery and energy storage systems, is strengthening its offering in the battery up-stream sector through this cooperation. With InterBattery, which takes place in conjunction with ees Europe, the organizers are creating Europe‘s largest industry event covering the entire spectrum of the battery market. "The 'Interbattery Showcase' adds value for our exhibitors and trade visitors from the battery industry ", says Markus Elsässer, CEO of Solar Promotion GmbH. "At Europe's largest energy industry platform, The smarter E Europe, exhibitors and trade visitors can make important contacts with South Korean equipment suppliers and battery industry suppliers," Elsässer adds. "The Interbattery Showcase and The Battery Day Europe are especially targeted at battery industry professionals, including cell manufacturers, engineers, product developers, policy makers, as well as professionals from related industries, such as automotive, EV and energy," adds Dong Ki Lee, CEO of Coex.

Hyundai Motor Company has Chosen Power Modules for Multiple Models
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Learn more:
st.com
  • Industry News
  • 2022-12-07

STMicroelectronics’s silicon-carbide (SiC) power modules have been selected for Hyundai’s E-GMP electric-vehicle platform shared by KIA EV6 and several models. Five SiC-MOSFET based power modules provide flexible choices for vehicle makers, covering a selection of power ratings and support for operating voltages commonly used in electric vehicle (EV) traction applications. Housed in ST’s ACEPACK DRIVE package optimized for traction applications, the power modules are reliable thanks to sintering technology, robust, and easy for manufacturers to integrate in EV drives. Internally, the main power semiconductors are ST’s third-generation (Gen3) STPOWER SiC MOSFETs, which combine figure of merit (RDS(ON) x die area) with very low switching energy and super performance in synchronous rectification. “ST’s SiC-MOSFET based power modules are the right choice for our traction inverters, enabling longer range. The cooperation between our two companies has realized a significant step towards more sustainable electric vehicles, leveraging ST’s continuous technological investment to be the leading semiconductor actor in the electrification revolution,” said Mr. Sang-Cheol Shin, Inverter Engineering Design Team at Hyundai Motor Group.

Programmable DC Power Supply Series Extended
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Learn more:
lambda.tdk.com
  • Product Release
  • 2022-12-06

TDK Corporation announces the introduction of six models to the 7.5kW TDK-Lambda GENESYS+™ series of high power density programmable DC power supplies. This expansion now provides incremental and seamless choices in output voltage and current ranging from 0-20V/375A to 0-1500V/5A. Target applications for the 7.5kW power supplies are automotive testing - including electric and hybrid cars, general test or research, measurement, semiconductor fabrication, battery manufacturing, and renewable energy. The six voltage models offer 0-30V/250A, 0-60V/125A, 0-80V/94A, 0-200V/37.5A, 0-300V/25A and 0-1000V/7.5A. The units can operate in constant current, constant voltage, or constant power limit modes and in addition offer internal resistance simulation. The units can be specified to accept three-phase 170 to 265Vac or wide range 342 to 528Vac inputs, with active Power Factor Correction. Operating efficiencies are up to 92%. The 7.5kW output power enables system configurators to avoid the need to parallel lower wattage power supplies, reducing the rack or cabinet size. The series benefits from DSP (Digital Signal Processing) technology and the latest generation components, including ferrite materials, to obtain efficiencies of 91 to 92%. Less internal waste heat ensures a higher power rating without compromising reliability.

Tactile Switch for Wearable Consumer Electronics
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Learn more:
littelfuse.com
  • Product Release
  • 2022-12-06

Littelfuse announced the C&K Switches NanoT product line, a series of miniature, surface-mounted, very low profile, waterproof tactile switches. Smart wearables, health monitoring devices, and other battery-powered IoT devices are driving the need for a higher density of active components integration, seamless rounded screens, and additional functions in increasingly smaller spaces. The result is a demand for the switch interface to be smaller and smaller. The NanoT switch series is the smallest tactile solution on the market. It gives product designers room to build additional functionality into their design or reduce their printed circuit board (PCB) size. The NanoT is ideal for use in a wide range of wearable and portable consumer electronics, including hearing aids, health-monitoring devices, smartwatches, portable IoT devices, and headsets. “We are excited to release the NanoT switches, the world's smallest tactile solution currently available for high-end portable, wearable consumer and medical applications," said Daisy Liu, Global Product Manager at C&K Switches, now part of Littelfuse. "They provide the smallest size, IP67 waterproof tact switch available. They use the surface-mount technology (SMT) reflow process for the top version and Pin-in-Paste (PIP) reflow process for the side version. As a result, this product addresses the market's demand for smaller components while providing our customers with the ability to deliver high quality and high performance in their latest designs."

Power Management System for BHP’s Jansen Potash Project
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Learn more:
abb.com
  • Industry News
  • 2022-12-06

ABB has been selected by BHP to deliver a power management system for the Jansen Potash Project in Canada, which will provide nutrient-rich potash fertilizer to enable more sustainable farming globally. The global resource company is progressing the US $5.7 billion Jansen Stage 1 Potash Project which is expected to achieve first production in late 2026. The order includes ABB Ability™ System 800xA Power Control Library, a digital application to monitor industrial electrical systems. It will help BHP on its journey towards an automated, electrified and digitalized site where engineers can monitor and quickly troubleshoot disturbances. The system will cover the electrical substation equipment remotely, reducing the time taken for fault diagnosis and problem solving. BHP’s 100 percent-owned Jansen Potash Project in Saskatchewan, Canada, is planned to be the largest potash producing mine in the world with an initial Jansen Stage 1 capacity of 4.5 million tons per annum (Mtpa) and potential for 16 to 17 Mtpa through future development. Potash, a potassium-rich salt used as a fertilizer to improve the quality and yield of agricultural crops, is an essential plant nutrient and is increasingly vital due to land scarcity and a growing world population. ABB will ensure high levels of availability and efficiency of the energy supply to the process. BHP will also have access to data for the electrical substation and electrical assets and the bank of information available will build over time, allowing trends to be identified and actions taken.

Collaboration on 8-Inch Gallium Nitride Power Semiconductor Manufacturing
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Learn more:
epc-co.com
  • Industry News
  • 2022-12-06

EPC and Vanguard International Semiconductor Corporation (VIS) jointly announced a multi-year production agreement to produce gallium nitride-based power semiconductors. EPC will utilize VIS’ 8-inch (200 mm) wafer fabrication capabilities, significantly increasing manufacturing capacities for EPC’s GaN transistors and integrated circuits. Manufacturing will commence in early 2023. The products manufactured at VIS, an Automotive IATF 16949 certified foundry, will meet the growing demand for GaN power devices in data centers, electric vehicles, solar inverters, robotics, and space systems. “EPC’s GaN devices have superior performance, are easy to use, are extremely small, highly reliable, and very affordable. We are excited to partner with VIS to take advantage of their advanced, highly reliable, GaN platform to expand our capacity and meet our growing customers’ demands,” said Alex Lidow, CEO and co-founder of EPC. “VIS’ leading specialty IC manufacturing expertise, combined with EPC’s product design capability and outstanding figure of merit (FOM) of GaN, will deliver greater energy efficiency for more eco-friendly high-performance computing and electric vehicle applications,” said John Wei, COO of VIS. “We are thrilled to partner with EPC to bring this new-generation power device to new markets and applications, making contributions to environmental sustainability.”

Efficient Alternatives to Conventional AC/DC and Wireless Power
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Learn more:
eggtronic.com
  • Industry News
  • 2022-12-03

At CES 2023, Eggtronic will be showcasing power conversion and wireless power controllers that address demands for more sustainable energy use and higher performance from products with ever-smaller form factors. In line with the company’s theme of ‘Revolutionary Power Electronics for a Better Planet’, Eggtronic’s demonstration area at The Venetian (Suite 29-310) will feature mixed signal controllers that dramatically reduce component count while improving the power density and efficiency of AC/DC converters and wireless power designs. These include architectures with superior no-load to full-load efficiency, complete solutions with fewer conversion stages, and wireless charging technologies that extend power transfer range while operating with the same efficiency as wired applications. Among the technologies on show will be QuarEgg® and SmartEgg® zero voltage switching (ZVS) designs that provide more efficient, higher power density alternatives to quasi-resonant (QR), active clamp flyback (ACF) and boost PFC+LLC technologies in non-PFC and PFC applications with power ratings from 20W to >500W. Wireless charging innovations on display include state-of-the-art Qi and E2Watt®, an AC wireless power hybrid technology that provides similar performance to wired solutions and offers the potential to extend wireless powering and charging to laptops, AV equipment, home appliances and even electric vehicles.

LED Paste for Mini/MicroLED Applications
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Learn more:
indium.com
  • Product Release
  • 2022-12-02

Indium Corporation® has expanded its portfolio of proven pastes with a no-clean, halogen-free solder paste designed for advanced LED applications, including COB, COG, SMT, and other LED varieties. LEDPaste NC38HF combines wetting performance with stencil print transfer efficiency to satisfy the broadest range of process requirements for miniLED applications. It offers printability down to 60-micron apertures. MiniLEDs typically feature a length of less than 240 microns on the component edge; this material offers excellent compatibility with the current size of miniLEDs and as future die continue to miniaturize.

Cooperation on SiC Substrate Manufacturing Technology
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Learn more:
soitec.com
  • Industry News
  • 2022-12-01

STMicroelectronics and Soitec announce the next stage of their cooperation on Silicon Carbide (SiC) substrates, with the qualification of Soitec’s SiC substrate technology by ST planned over the next 18 months. The goal of this cooperation is the adoption by ST of Soitec’s SmartSiC™ technology for its future 200mm substrate manufacturing, feeding its devices and modules manufacturing business, with volume production expected in the midterm. “The transition to 200mm SiC wafers will bring substantial advantages to our automotive and industrial customers as they accelerate the transition toward electrification of their systems and products. It is important in driving economies of scale as product volumes ramp,” said Marco Monti, President Automotive and Discrete Group, STMicroelectronics. “We have chosen a vertically integrated model to maximize our know-how across the full manufacturing chain, from high-quality substrates to large-scale front- and back-end production. The goal of the technology cooperation with Soitec is to continue to improve our manufacturing yields and quality.” “The automotive industry is facing major disruption with the advent of electric vehicles. Our cutting-edge SmartSiC™ technology, which adapts our unique SmartCut™ process to silicon carbide semiconductors, will play a key role in accelerating their adoption,” said Bernard Aspar, Chief Operating Officer of Soitec. “The combination of Soitec’s SmartSiC™ substrates with STMicroelectronics’ industry-leading silicon carbide technology and expertise is a game- changer for automotive chip manufacturing that will set new standards.”

Toroidal Common Mode Chokes Against EMC Interference
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Learn more:
rutronik24.com
  • Product Release
  • 2022-12-01

Toroidal common mode chokes in THT from knitter-inductive complement the existing product portfolio to meet the requirements of the e-mobility market, among others. The main area of application is the suppression of EMC disturbances in 1- and 3-phase applications at nominal voltages of 230 V and 400 VAC. Because these interferences can occur in different frequency ranges, knitter-inductive offers individualized solutions in addition to the standard versions. Exact selection is crucial for the reliable performance of the components. The latter is also convincing due to its significantly smaller size with the same current rating and its compatibility of very high ambient temperatures. For realizing even more customization, toroidal common-mode chokes allow horizontal as well as vertical mounting plate attachment of the core. Higher dielectric strength is achieved by adding a separator. Another plus is the possible choice of the PCB layout according to customer requirements.

SiC & GaN User Forum: Potential of Wide Bandgap Semiconductors in Power Electronic Applications
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Learn more:
ecpe.org
  • Event News
  • 2022-12-01

The hybrid ‘SiC & GaN User Forum: Potential of Wide Bandgap Semiconductors in Power Electronic Applications’ from the ECPE will be held on March 28-29, 2023, in Erding/Munich, Germany. The technical chair is Prof. Andreas Lindemann, Otto-von-Guericke-University, Magdeburg, Dr. Peter Friedrichs, Infineon Technologies, and Prof. Leo Lorenz and Thomas Harder, ECPE. The programme will start with an overview on the status and trends in WBG Power Electronics. Then, the 1st day is dedicated to the use of GaN HEMTs in different systems and applications. Recent developments e.g. on bidirectional HEMTs, multi-channel tri-gate devices and vertical GaN devices will also be presented and discussed. The 2nd workshop day will concentrate on SiC device applications. Further, an outlook on promising ultra wide bandgap (UWBG) materials and devices will be given. The workshop will be closed with a panel discussion addressing the topics of WBG device maturity, robustness and reliability. International renowned experts are being invited to give an overview and to in depth explain their research and development work in technical presentations. Besides, the ECPE Wide Bandgap User Forum offers a platform for all participants to share experience and ideas. Registration Deadline is the 22nd of March.

Partnership Contributes to the Technical Innovation of New Energy Vehicles
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Learn more:
rohm.com
  • Industry News
  • 2022-12-01

Shenzhen BASiC Semiconductor and ROHM have entered into a strategic partnership agreement on SiC power devices for automotive applications. A signing ceremony was held at ROHM’s headquarters in Kyoto to commemorate the occasion. The signing ceremony was concluded by Weiwei He (right), General Manager of Shenzhen BASiC Semiconductor Ltd. and Isao Matsumoto (left), President and CEO of ROHM Co., Ltd. Under this agreement, the two companies will leverage their respective strengths to innovate and improve the performance of SiC power devices and develop higher performing, more efficient and reliable SiC solutions for new energy vehicles. The first step involves supplying onboard power modules that leverage the combined technologies to several major automakers for use in electric vehicle powertrains. And going forward, both ROHM and BASiC Semiconductor will contribute to technological innovation in the automotive sector by accelerating the development of innovative power solutions centered on SiC.

Distributor Supports Customers from Design with GaN devices
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Learn more:
innoscience.com
  • Industry News
  • 2022-11-30

Innoscience Technology has signed a global distribution agreement with Richardson RFPD, an Arrow Electronics company. “This is a great decision for Innoscience” comments Denis Marcon General Manager, Europe, at Innoscience. “Richardson RFPD is well-recognized as a leader in new business generation and design-in with very qualified and experienced technical support teams. The combination is perfect for Innoscience and our customers, as they begin their journey with GaN and then ramp up.” Richardson RFPD will offer full design support and product availability for Innoscience’s wide power device portfolio covering both Low Voltage (30V-150V) as well as High Voltage (650V) GaN power devices.

Tobias Hübner Appointed Head of Sales for EMEA
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Learn more:
lambda.tdk.com
  • People
  • 2022-11-29

TDK Corporation announces Tobias Hübner as Head of Sales at TDK-Lambda EMEA, following Pascal Cozzolino, who will soon retire after more than 20 years of solid service for the company. Tobias joins TDK-Lambda EMEA with more than 20 years of experience in the competitive and innovative semiconductor industry, where he held various management positions in sales, applications and product management. Previous to TDK-Lambda, he spent 11 years with electronic device manufacturer Maxim Integrated, which is now part of Analog Devices. “We are extremely pleased to welcome Tobias,” says Matt Cotton, Managing Director, TDK-Lambda EMEA. “We are confident that his extensive experience will enable us to continue driving the company forward and growing our market position.” In his new position, Tobias will continue implementing improvements in the sales organisation and contribute to and drive the future growth plans of TDK-Lambda EMEA. “I’m very fortunate to join a worldwide leader in the power supply market and look forward to transferring my knowledge and experience gained from the semiconductor industry to benefit and grow TDK-Lambda EMEA in this fast-changing environment,” says Tobias.

Series of Resonant Inductors
  • Product Release
  • 2022-11-28

ITG Electronics has introduced a series of resonant inductors. Suitable for DC/DC power conversions of up to 3 kilowatts, the company’s L101374SP Series of Resonant Inductors comprises 13 distinct high-performance products. They are ideal for power conversion application in data centers, electric vehicles and industrial settings. The L101374SP Series of Resonant Inductors was initially developed for a specific customer application, and is now available to the wider market. ITG Electronics was selected by an industry leader in DC/DC power conversion to design and produce a portfolio of resonant inductors with elevated efficiency and power density. These features – high power and heightened efficiency – align with those called for in GaN Systems Inc.’s design reference parameters, and is now included in the organization’s Technical Manual of P/N GS-EVB-LLC-3KW-GS. The L101374SP Series of Resonant Inductors can accommodate up to 650 volts, and up to 71.0 amperes with approximately 30% roll off. According to Martin Kuo, Managing Director of ITG Electronics: “The new L101374SP Series of Resonant inductors and LLC transformer P/N T301373SP-04 work well with GAN P/N GS-EVB-LLC-3KW-GS, which are empowering our customers to implement full-bridge LLC resonant converters that exceed the 80+ Titanium standard for power supply units, achieving high-power density (PFC+DC/DC) above 100W/in3 and efficiencies greater than 96%.”

3-Phase Block Filters for Machine Applications
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Learn more:
schurter.com
  • Product Release
  • 2022-11-25

SCHURTER is expanding the FMBC EP and FMBD EP 3-phase filter families with variants for machine applications. The filters meet the requirements of machine safety according to IEC 60204-1. They are suitable for 3-phase or 3-phase-with-neutral conductor applications at rated currents from 16 to 230 A. The FMBC EP and FMBD EP dual-stage block filters have a particularly compact design with a small footprint and high performance at the same time. They are suitable for industrial or energy applications such as EV fast charging stations or battery storage. Any machine or equipment that is to be brought onto the market in the EU and associated countries must bear a CE marking issued by the manufacturer himself. With this marking, the manufacturer guarantees that his product complies to all applicable legal and technical requirements. Minimum standards with regard to safety and occupational health requirements are defined in Europe by the Machinery Directive 2006/42/EC and the Low Voltage Directive 2014/35/EU. The details for implementation are defined in separate specifications, known as harmonizing standards. One of these harmonizing standards is IEC 60204-1, which applies to electrical, electronic and programmable electronic equipment as well as to groups of networked machines, including control cabinet construction. The filter versions meet the requirements of this standard IEC 60204-1.

Partners to Automate and Speed Up EMC Tests
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Learn more:
rohde-schwarz.com
  • Industry News
  • 2022-11-24

Electric vehicles contain many electronic components that emit radio-frequency interference which may have a negative impact on the vehicle performance and driving experience. To ease and speed up the development process, AVL and Rohde & Schwarz present an solution for automated electromagnetic compatibility (EMC) data analysis of an electric drivetrain under real driving conditions. The electrification of vehicles leads to new EMC challenges because of higher switching frequencies of semi-conductors and higher emissions due to high voltages and currents. EMS (Electromagnetic Susceptibility) and EMI (Electromagnetic Interference) testing of components and vehicles addresses these challenges. To meet time to market requirements, test automation is key. Additionally, the tests must be as realistic as possible, so there is a trend from static EMC testing of vehicles to dynamic testing where the drivetrain is active, varying in speed as well as torque during the execution of the EMC test. “Many customers have been wanting for years to see Rohde & Schwarz EMC analyzers connected to the AVL EMC test automation system. Together, we have finally accomplished this, and are pleased to offer this new solution, improving and accelerating EMC validation of e-drives and vehicles,” states Alban Hemery, Department Manager for E-Motor Test Systems and EMC Applications at AVL List GmbH. “As market leader in EMC instrumentation, Rohde & Schwarz has a long and productive history of collaboration with AVL to develop leading-edge test systems for the automotive industry. The enhancement of R&S ELEKTRA to be compatible with AVL’s PUMA 2 is another significant step speeding up EMC test times under real driving conditions, particularly for electric drivetrains,” adds Juergen Meyer, Vice President Market Segment Automotive at Rohde & Schwarz.

Power Supply Delivers up to 800W with BF-Ready Isolation
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Learn more:
lambda.tdk.com
  • Product Release
  • 2022-11-22

TDK Corporation announces the introduction of the TDK-Lambda brand 1U high MU4 series of AC-DC modular power supplies. The product’s very low acoustic noise is strongly desired in test and medical applications where audible disturbances need to be kept to a minimum. The modular MU4 can provide up to five isolated and regulated outputs and deliver up to 800W. All models in the MU4 series feature full MOPPs (Means of Patient Protection) isolation, including output to earth, to simplify implementation into BF-rated medical applications. Other target applications include dental, test and measurement, broadcast, professional audio, and industrial equipment. With intelligent fan control, the MU4 fan rotation speed is reduced, producing audible noise as low as 36dBA*. Its microcontroller algorithm monitors the temperature of the primary converter and each output module, allowing the fan speed to be adjusted for optimum cooling. The low profile, 1U high, MU4 measures just 89 x 41 x 257.5mm (W x H x D), allowing a smaller system enclosure. Initially, nine modules are available, offering a continuous range of voltages from 3.3V to 104V with ratings from 150W to 480W. Options include a 5V / 2A standby voltage, fan fail signal, inhibit and enable (for individual or all outputs), DC good, PMBus™ communication, and current share for parallel configurations.

Joint Agreement to Develop Inverters for e-Axle Using SiC Power Modules
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Learn more:
rohm.com
  • Industry News
  • 2022-11-22

ROHM has signed a joint development agreement with Mazda Motor and Imasen Electric Industrial for inverters and SiC power modules to be used in the electric drive units of electric vehicles, including e-Axle. As the ‘heart of the EV’, e-Axle integrates a motor, reduction gearbox, and inverter into a single unit that plays a large part in determining the driving performance and power conversion efficiency of electric vehicles. SiC MOSFETs in particular are expected to improve efficiency even further. ROHM will carry out joint inverter development for e-Axle by participating in a ‘cooperative framework for the electric drive units development and production’ with companies such as Imasen and led by Mazda. At the same time, ROHM will contribute to the creation of compact, high efficiency electrical units by developing and supplying advanced SiC power modules that provide improved performance. Through this collaboration, ROHM will develop even more competitive SiC MOSFETs and modules by working backwards from the finished vehicle to understand the performance and optimal drive method required of power semiconductors. Besides creating value through mutual understanding between car and device manufacturers, the three companies also support technical innovation in the automotive field and contribute to a sustainable society by leveraging extensive knowledge, technologies, and products garnered on a global basis.

electronica 2022 Confirms its Status
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Learn more:
electronica.de
  • Event News
  • 2022-11-18

An excellent mood in 14 halls and intensive discussions at full trade fair booths: The international electronics industry met again in person from November 15 to 18 at electronica 2022 in Munich. 2,144 exhibitors, 64 percent of whom came from countries outside of Germany, showcased innovations that covered the entire spectrum of electronics to about 70,000 visitors at this world leading trade fair. SEMICON Europa was held in parallel spread over just under one and a half halls. A highly informative supporting program consisting of conferences, forums and special events such as the CEO Roundtable explored the focus topics of the trade fair. The program also served as an opportunity for discussions about current global challenges, including the energy transition, supply chain bottlenecks, the scarcity of raw materials and shortages of skilled workers. “electronica 2022 impressively confirmed its status as world leading trade fair and demonstrated once again that Munich is THE trade fair location for the international electronics industry,” summarizes Dr. Reinhard Pfeiffer, CEO of Messe München. “We are delighted that the number of visitors was only around 14 percent below the record result of 2018, and that the share of international visitors at around 54 percent was even higher than at the previous events—an outstanding result in these times. What’s more, according to the trade fair survey, our exhibitors and visitors were more satisfied with electronica this year than ever before.” The next electronica will take place in Munich from November 12-15, 2024.

Hotswap Application Specific MOSFETs Manage In-Rush Currents
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Learn more:
nexperia.com
  • Product Release
  • 2022-11-18

Nexperia extends its ‘ASFETs for Hotswap and Soft Start’ portfolio with the introduction of ten 25 V and 30 V fully optimized devices, combining enhanced safe operating area (SOA) performance with low RDS(on), making them ideal for use in 12 V hotswap applications including data center servers and communications equipment. For several years, Nexperia has been combining proven MOSFET expertise and broad application understanding to develop ASFETs, devices in which critical MOSFET performance characteristics are enhanced to meet the requirements of particular applications. Since the launch of ASFETs, success has been seen with products optimized for battery isolation, DC motor control, Power-over-Ethernet, automotive airbag applications and more. In-rush currents can present a reliability challenge in hotswap applications. Nexperia, the original pioneer of enhanced SOA MOSFETs, have addressed this concern by designing a portfolio of ‘ASFETs for Hotswap and Soft Start with enhanced SOA’ that are fully optimized for such applications. The PSMNR67-30YLE ASFET delivers 2.2x stronger SOA (12 V @100 mS) than previous technologies while having an RDS(on) (max) as low as 0.7 mO. The Spirito effect (represented by the steeper downward slope found on SOA curves at higher voltages) has been eliminated, while exceptional performance is maintained across the full voltage and temperature range (compared to unoptimized devices).

Radiation-Hardened ICs Lift Off Onboard Artemis 1 Mission to the Moon
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Learn more:
renesas.com
  • Industry News
  • 2022-11-17

Renesas Electronics announced that hundreds of its radiation-hardened (rad-hard) integrated circuits (ICs), including over 50 different part numbers, are onboard the Artemis 1 launch that blasted off on November 16. Intersil-brand rad-hard ICs are part of the battery management systems, RS-25 engine control electronics and the launch abort system on the Space Launch System that propelled the mission into space, the most powerful rocket ever built. On the Orion Capsule that will circle the moon, Renesas provided critical components for controller boards, the main flight computer, the docking camera system, the power distribution system and display and panel electronics. The Intersil-brand ICs perform multiple functions, including power management and precision signal processing. Artemis is the ambitious NASA program that will take humankind back to the moon for the first time in more than 50 years. Artemis 1 is sending the test-mannequin populated Orion capsule to orbit the moon and deploy cubesats and other space experiments on a 42-day mission to test all the critical systems. Artemis 2 (2024) will have a crew that will orbit the moon paving the way for Artemis 3 (2025), which will land the first woman and the first person of color on the moon. The plan is for Artemis to continue to build a space station in lunar orbit and a base on the lunar South Pole. This infrastructure will allow for the awe-inspiring goal of a crewed mission to Mars in the 2040s.

Long-Reach, Single-Pair Power over Ethernet Solutions
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Learn more:
analog.com
  • Product Release
  • 2022-11-16

Analog Devices announced a Single-pair Power over Ethernet (SPoE) Power Sourcing Equipment (PSE) and Power Device (PD) solutions to help customers drive greater levels of intelligence into smart buildings, factory automation, and other applications at the edge of traditional networks. The offerings facilitate powered, last-mile connectivity for factory and building automation through real-time power management, telemetry, extremely low standby power consumption, and ease of installation. Analog Devices’ SPoE solutions, LTC4296-1 and LTC9111, address the challenges of providing power and data to devices, even in remote, difficult to access endpoint locations. Analog Devices’ solutions aim to help new families of endpoint applications to be seamlessly powered and accessed across the network and used to assess local factors such as asset health, environmental conditions, security metrics, and more. The localized awareness and control they offer are the building blocks of the digital buildings of tomorrow. Analog Devices’ SPoE solutions reduce reliance on localized power and batteries by using a single twisted pair of Ethernet cables to provide efficient, reliable, easily installed power at reduced size and weight. Combined with ADI Chronous™ ADIN1100 and ADIN1110 10BASE-T1L, Industrial Ethernet solutions, customers can reliably transfer both power and data over one kilometer – a significant increase from previous Ethernet standards.

Industrial Series 60 KW DC Power Supplies and Loads
  • Product Release
  • 2022-11-15

EA Elektro-Automatik introduces its 60 kW and 30 kW, EA-PU 10000 Programmable DC Power Supplies, EA-PUB 10000 Programmable Bidirectional DC Power Supplies and EA-PUL DC Programmable Regenerative Electronic Loads. Typical applications include electric vehicle battery pack testing, powering furnaces in semiconductor wafer fabrication facilities, electrochemical electrolysis processing, and solar inverter testing. The products, without manual front panel displays, are intended for use in production ATE systems and automated process control systems requiring high power.The 60 kW models output maximum voltages of 360 V to 2000 V and maximum currents of 480 A to 80 A; the 30 kW models output maximum voltages of 60 V to 2000 V and maximum currents of 1000 A to 40 A. Overall, the 60 kW series includes 21 models, and the 30 kW series consists of 29 models allowing engineers to select a model that addresses their specific applications. The increased power capability enables engineers to reduce the number of power instruments needed for a high-power system, saving critical rack space and providing more power in a smaller footprint.

650V GaN HEMTs
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Learn more:
innoscience.com
  • Product Release
  • 2022-11-15

Innoscience announced a low RDS(on) 650V E-mode GaN HEMT devices. INN650D080BS power transistors have an on-resistance of 80mΩ (60mΩ typical) in a standard 8x8 DFN package, enabling higher power applications, for example in totem pole LLC architectures or fast battery-chargers. Explains Yi Sun, Sr VP of product development at Innoscience: “We are now able to address high density, high efficiency power conversion applications. Like all our other 650V HEMTs, these new parts are qualified to JEDEC standards for chip and package, and they have also passed DHSOL (Dynamic High Temperature Operating Life) reliability testing according to JEP180 and accelerated life tests up to 1000V give lifetime calculations of 36 years (520V; 150°C; 0.01% failure rate).” Thanks to Innoscience’s innovative strain enhancement layer, InnoGaN devices features low specific RDS(ON) as well as very low dynamic RDS(ON) and excellent reliability. The new 80mΩ RDS(on) parts also feature very good drain source voltage transient (VDS, transient) and pulsed (VDS, pulsed) characteristics – 800V and 750V respectively. Moreover, similarly to the other 650V products, the 80mΩ RDS(on) devices feature a strong ESD protection circuit embedded in the die to ease mass production assembly of these device in package and easy handling. In this case, however, the ESD circuit has been modified to allow a larger negative gate voltage swing down to -6V. The low RDS(on) INN650D080BS power transistors, which are available in industry-standard 8x8 DFN packages, join previously-announced 140mΩ,190mΩ, 240mΩ, 350 mΩ, 500mΩ and 600 mΩ RDS(on) parts, creating a significant portfolio of available devices, which is continuously expanding towards lower RDS(on) values.

GaN Technology for High Power Density Applications
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Learn more:
epc-co.com
  • Product Release
  • 2022-11-15

EPC launches the 80 V, 4 mOhm EPC2619. This is the lead product for a generation of eGaN devices that have double the power density compared to EPC’s prior-generation products. The EPC2619 has an RDS(on) of just 4 mOhms in a tiny, 1.5 mm x 2.5 mm, footprint. The maximum RDS(on) x Area of the EPC2619 is 15 m?*mm2 – five times smaller than 80 V silicon MOSFETs. This product is designed for a range of motor drive applications. For example: 28 V – 48 V conversion for eBikes, eScooters and power tools; high density DC-DC converters; solar optimizers; and synchronous rectification converting 12 V – 20 V for chargers, adaptors, and TV power supplies. The typical RDS(on) x QGD, which is indicative of power losses in hard-switching applications, is 10 times better than 80 V silicon MOSFETs. This enables switching frequencies that are 10 times higher than silicon MOSFETs and without an efficiency penalty, thus producing the highest power density.  This makes the EPC2619 ideal for high frequency hard-switching 24 V – 48 V applications, such as used in buck, buck-boost, and boost converters. The typical RDS(on) x QOSS, which is indicative of power losses in soft-switching applications, is 87 mOhm*nC, two times better than 80 V silicon MOSFETs. This makes the EPC2619 ideal for soft-switching applications, such as the primary rectification full bridge for LLC-based DCX DC-DC converters.

Advanced Smart Electrical Outlet and Connector
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Learn more:
menlomicro.com
  • Industry News
  • 2022-11-15

VoltSafe announced a strategic partnership with Menlo Microsystems to co-develop an advanced electrical plug technology. Both companies are strong proponents of advancing how the world connects to electricity, and the combination of Menlo Micro’s Ideal Switch technology with VoltSafe’s smart electrical outlet and connector will enable the future of smart power connectivity. Seeing deficiencies in existing relays and switches that caused the products they operated to be bigger, slower, less capable, or more expensive, Menlo Micro set out to create a better solution and developed Ideal Switch. The Ideal Switch is a device that delivers all the benefits of a mechanical relay and a semiconductor switch, with no compromises. The Ideal Switch is tiny, fast, reliable, withstands extreme temperatures, is ultra-low loss and can handle 1,000s of watts. Menlo Micro in March announced its $150 million USD Series C, bringing Menlo Micro’s total cumulative funding to over $225 million USD. Vertical Venture Partners and Tony Fadell’s Future Shape led the round. Menlo’s Micro’s confidence in VoltSafe’s disruptive technology powering the future of how the world connects to electricity, paved the way for this early collaboration. 

Zero-Voltage-Switching Power-Supply ICs
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Learn more:
power.com
  • Product Release
  • 2022-11-15

Power Integrations announced the InnoSwitch™4-Pro family of digitally controllable, off-line CV/CC Zero Voltage Switching (ZVS) flyback ICs, which substantially reduce the size of power adapters. Incorporating a robust PowiGaN gallium-nitride primary switch and steady-state switching frequency of up to 140 kHz, the highly integrated devices reduce the component count and PCB area required for ultra-compact adapters for cellphone, notebook, tablet and multi-port accessories. “InnoSwitch4-Pro ICs interface seamlessly with Power Integrations’ ClampZero™ family of active clamp ICs to achieve ZVS in both continuous conduction mode (CCM) and discontinuous conduction mode (DCM),” stated Aditya Kulkarni, product marketing manager at Power Integrations. “ZVS, combined with our PowiGaN™ technology, virtually eliminates switching losses. Efficiency exceeds 95 percent, which enables designers to eliminate the heat sinks, spreaders and potting materials typically required for thermal management." Further size reduction of the adapter can be achieved by the use of a MinE-CAP™ device in combination with InnoSwitch4-Pro and ClampZero ICs. Based also on PowiGaN technology, MinE-CAP ICs enable input capacitance size reduction of approximately 40 percent. Capable of delivering up to 220 W, InnoSwitch4-Pro ICs combine a 750 V PowiGaN primary switch, controller, FluxLink™ reinforced isolation feedback link for secondary-side control, I2C interface, active clamp drive and synchronous rectification in a compact InSOP™-28 package.

Funding Enables Mass Production of GaN Transistor Family
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Learn more:
camgandevices.com
  • Industry News
  • 2022-11-15

Cambridge GaN Devices (CGD) has raised $19m in Series B funding. The investment was led by Parkwalk Advisors and BGF, with participation from IQ Capital, CIC, Foresight Williams Technology and Martlet Capital. The investment will enable CGD to begin mass production of its range of GaN transistors for power applications. CGD has already made remarkable progress, developing intellectual property and bringing to market its ICeGaN™ Gallium Nitride transistor family which addresses a $50bn global power semiconductor market. The company is positioned to disrupt multiple industries such as consumer and industrial power supplies, lighting, data centres and automotive HEV/EV. CGD’s technology provides efficient, sustainable, and more cost-effective power solutions for electronic equipment. As a result, CGD has gained global traction and attention at international conferences and in respected press. CGD is currently leading a $10m European-funded project developing GaN-based modules for low and high-power applications (GaNext); is participating in a UK supply chain initiative for PCB-embedded power systems with GaN devices (P3EP) and recently launched a project to develop highly reliable GaN power transistors and ICs to cut data centre emissions (ICeData). CGD is also focused on key partnerships with their customers focused at the datacom and automotive solutions. The company has completed its brand development, moved to new offices, and now employs over 40 staff worldwide, with more planned to support the up scaling.

MOSFETs with Top-Cool Packaging
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Learn more:
onsemi.com
  • Product Release
  • 2022-11-15

onsemi announced a series of MOSFET devices that feature top-side cooling to assist designers in challenging automotive applications, especially within motor control and DC/DC conversion. Housed in a TCPAK57 package measuring just 5mm x 7mm, the Top Cool devices feature a 16.5mm2 thermal pad on the top side. This allows heat to be dissipated directly into a heatsink rather than via a typical printed circuit board (PCB). By enabling the use of both sides of the PCB and decreasing the amount of heat going into it, the TCPAK57 provides increased power density. Improved reliability of the new design adds to an overall extended system lifetime. “Cooling is one of the greatest challenges in high power design and successfully addressing it is the key enabler to reducing size and weight, which is critical in modern automotive design,” said Fabio Necco, vice president and general manager, Automotive Power Solutions at onsemi. “With excellent electrical efficiency and having eliminated the PCB from the thermal path, the design is significantly simplified while reducing size and cost.” The devices deliver the electrical efficiency required in high power applications with RDS(ON) values as low as 1m?. Additionally, the gate charge (Qg) is low (65 nC), reducing losses in high-speed switching applications.

PFC and Hybrid Flyback Combo IC for GaN-based USB-C Adapters and Chargers
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Learn more:
infineon.com
  • Product Release
  • 2022-11-15

Infineon Technologies introduces the XDP™ digital power XDPS2221, a highly-integrated combo controller IC for USB-PD supports high power designs in wide input and output voltage applications of up to 28 V output voltage. The device integrates an AC-DC power factor correction (PFC) controller with a DC-DC hybrid flyback controller (HFB), also known as asymmetrical half-bridge (AHB), in one single package. Through the harmonized operation of the two stages, regulatory requirements can easily be met. In addition, the further integration of all gate drivers and a 600 V high voltage start-up cell for the initial IC voltage supply and the certified active X-capacitor discharge enable a low external bill of material (BOM) and component count. Based on a novel zero-voltage switching (ZVS) HFB topology in conjunction with GaN-based devices, it brings class-leading efficiency across various line/load conditions. Thanks to these features and inherent topology advantages, such as zero voltage switching and resonant energy transfer for transformer size reduction, system designs using XDPS2221 can achieve very high power densities. Moreover, the combo IC features a synchronous PFC and HFB burst mode operation for the lowest possible no-load input standby power performance. The quasi-resonant multimode PFC stage is enhanced with automatic PFC enable/disable functionality and adaptive PFC bus voltage control to maximize average and light load efficiency. Optionally, the integrated PFC function can also be disabled, to support the use case with any kind of external PFC Controller.

GaN ICs Fast-Charge from 1-50% in Only 7 Minutes
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Learn more:
navitassemi.com
  • Industry News
  • 2022-11-14

Navitas Semiconductor has announced its GaNFast power ICs have been selected for the ‘in-box’ 125 W charger of Motorola’s latest ?agship smartphone, the X30 Pro. A charge from 1% – 50% in just 7 minutes brings an ultra-fast charging experience to Motorola users. Jin CHEN, General Manager of Smartphone BU, Lenovo China commented on the launch of X30 Pro: “We hope to deliver a more comprehensive user experience in the ?agship X30 Pro. By working hand-in-hand with Navitas and Aohai Technology, we are able to utilize GaN and speed up the charging capability of Motorola’s smartphones to a new level. We look forward to collaborating further with Navitas and Aohai Technology, to break more records in charging speed, and offer a convenient and ultra-fast charging experience to our users.” “We are excited that GaNFast technology empowers Motorola to achieve a more powerful charger. This time, Motorola, Navitas and Aohai Technology’s collaboration reached a benchmark 125 W fast-charging solution on the new X30 Pro.” said Charles (Yingjie) ZHA, VP and GM of Navitas China: “We are dedicated to offer an eco-friendly and ultra-fast charging experience for consumers. This tiny but powerful 125 W GaN charger demonstrates our continued effort to ‘Electrify Our World™’. Navitas will continue to push the innovation of GaN technology to empower Motorola’s charging roadmap.”

Simulation Software Technology for PCB Design Solutions
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keysight.com
  • Industry News
  • 2022-11-14

Keysight Technologies announced that Altium LLC recently licensed Keysight's advanced electromagnetic simulation technology to develop power analysis solutions for PCB designers. Keysight and Altium are partnering to address the needs of hardware engineers who are not power integrity experts. Reliable power distribution is a pervasive problem facing PCB designers. As integrated circuit (IC) components trend toward lower supply voltages for increased power efficiency, it becomes difficult to design a PCB power plane within shrinking tolerance limits. Designers typically build several iterations of prototypes or submit their designs to power integrity specialists. Both are sub-optimal approaches that hinder rapid design turnaround. By empowering PCB designers to find and fix problems before first prototype, they can achieve higher productivity, faster time-to-market, and greater predictability in the design process. Power Analyzer is the first offering to result from the strategic partnership between Altium and Keysight, providing interactive analysis of power integrity issues. Altium integrated Keysight's EM simulation technology with its modern graphical user interface to make power analysis fast, accurate, and easy to run. PCB designers using Power Analyzer gain insight into their power plane performance through analysis of voltage drop and current density from within their PCB layout environment.

Memorandum of Understanding on Multi-Year Delivery of Silicon Carbide Chips
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infineon.com
  • Industry News
  • 2022-11-14

Infineon Technologies and the automaker Stellantis have signed a non-binding Memorandum of Understanding as a first step towards a potential multi-year supply cooperation for silicon carbide (SiC) semiconductors. Infineon would reserve manufacturing capacity and supply CoolSiC™ “bare die” chips in the second half of the decade to the direct Tier 1 suppliers of Stellantis. The potential sourcing volume and capacity reservation have a value of significantly more than €1 billion. “We firmly believe in electromobility and are excited to develop partnerships with leading automotive companies like Stellantis that make it a part of people’s everyday life,” said Peter Schiefer, Division President Automotive of Infineon. “Compared to traditional power technologies, silicon carbide increases the range, efficiency and performance of electric vehicles. With our leading CoolSiC™ technology and continuous investments in our manufacturing capacities, we are well positioned to meet the growing demand for power electronics in electromobility.” Infineon and Stellantis are in talks about delivering the CoolSiC Gen2p 1200 V and CoolSiC Gen2p 750 V chips for electric vehicles under Stellantis brands. The unmatched performance, reliability, and quality of CoolSiC technology would allow Stellantis to build vehicles with longer ranges and lower consumption for the best user experience – and support the company in its efforts to standardize, simplify and modernize platforms.

Hot-Swap Controller with Programmable Digital SOA Control
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Learn more:
infineon.com
  • Product Release
  • 2022-11-14

Infineon Technologies introduces the XDP™ XDP710 digital controller, the first member of its intelligent hot-swap controller and protection IC family. The hot-swap and system monitoring controller IC has a 5.5 V to 80 V input voltage range with transients up to 100 V for 500 ms. It consists of three functional blocks. The first is the high-precision telemetry and digital safe operating area (SOA) control block, optimized to meet Infineon’s power MOSFETs characteristics. The second is the system resources and management block, and the third is the integrated gate driver and charge pump block for n-channel power MOSFETs such as OptiMOS™ and StrongIRFET™ families. “Infineon Technologies’ XDP710 Digital hot-swap controller met HGX Platform product requirement well. Like its unique features such as option of external FET selection using resistor strapping and boost mode. It helps that XDP710 come in small package, easy to design in” said Abhijit Datta, Sr. Power Architect and Subject Matter Expert at NVIDIA. “The XDP710 hot-swap controller is a feature-rich device with high-precision analog-front-end along with comprehensive health monitoring, telemetry, programmability, and pre-set MOSFET SOA. It addresses the challenges associated with the current design of pluggable AI server solutions,” said Shahram Mehraban, Vice President Power Management ICs at Infineon’s Power & Sensor Systems Division.

DC/DC Converters for E-Mobility
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Learn more:
tracopower.com
  • Product Release
  • 2022-11-14

It is safe to say we are all feeling the wave of demand for electric vehicles, charging stations, and the required support infrastructure which are becoming ever more powerful, faster, and more compact. Consequently, more power in a smaller space is required for the operation of the electronics. Compact, highly efficient, reliable and, above all, robust DC/DC converters are required to meet these high demands of e-mobility applications. These converters must be able to withstand extreme and fluctuating temperatures and function reliably in harsh environments for years. With more than two decades of experience in railroad technology, Traco Power has set the goal of bringing robust DC/DC converters with high efficiency and power density to the market, especially suited for applications in electromobility. The range of Traco Power DC/DC converters for e-mobility includes models from 1- 300 Watts. These models are available in various mechanical types such as DIN-Rail, Chassis mount and PCB mountable DIP, SIP and SMD packages and are ideal for e-mobility applications. Traco Power products are carefully designed and fully compliant with the latest Railway, Industrial and Information Technology standards.

Product Distribution Center in Frankfurt
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ti.com
  • Industry News
  • 2022-11-14

Texas Instruments announced plans to open a product distribution center (PDC) in Frankfurt, Germany, by the end of 2024. The PDC will expand the company’s European footprint and enable faster deliveries to TI’s growing customer base there. “We are excited to expand our European presence in Frankfurt, as it offers a centralized location with proximity to key customers and our company’s European headquarters in Freising, Germany,” said Stefan Bruder, president of Texas Instruments Europe. “Frankfurt’s key role as a logistics hub will mean faster deliveries to our European customers who are moving quickly to bring leading-edge products to the market.” This Frankfurt location, near many of TI’s industrial and automotive customers, will enable same-day delivery in central Germany and next-day delivery capabilities to most European-based customers. The Frankfurt site will pack and ship a broad range of TI technologies to support customers across Europe. “Expanding in Frankfurt is a logical extension of TI’s presence in Europe and an important investment in our customers, providing them with even better service and support for decades to come,” Bruder said.

Collaboration to Expand Market for GaN Power ICs
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Learn more:
navitassemi.com
  • Industry News
  • 2022-11-11

Navitas Semiconductor and Avnet Silica announced close cooperation between the two companies to grow the market in Europe for Navitas' GaNFast power ICs with GaNSense technology. The two companies will work closely together to deliver their combined complementary knowhow to bring a high level of support and expertise to customers across the EMEA region. "Navitas' unique GaN technology and its world-renowned monolithically integrated gate driver and feature set will significantly expand our 'SILICA' wide-band-gap semiconductor portfolio," said Gilles Beltran, President Avnet Silica. "Navitas has a depth of expertise in power semiconductors that is unrivalled across the industry for this kind of advanced technology. We envisage this cooperation will bring huge benefits for customers operating at the cutting edge of power system architectures in a wide selection of applications." "We chose to work with Avnet Silica as one of the premier experts in semiconductor distribution in Europe," said David Carroll, Senior Vice President of Worldwide Sales at Navitas. "The combination of our highly differentiated solutions together with Avnet Silica's expertise in technology markets will further support designers and engineers to meet ever more stringent efficiency and size requirements and regulations. With our highly experienced technical team and our European applications lab, together, we can support customers with the best possible solutions and fastest time-to-market."


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105 ºC Prismatic Aluminum Electrolytic Capacitor SeriesCornell Dubilier has released a series of Flatpack...11191Product Release105 ºC Prismatic Aluminum Electrolytic Capacitor SeriesCornell Dubilier has released a series of Flatpack, low-profile aluminum electrolytic capacitors, tested and rated for 10,000 hours at 105 °C. Type MLPS offers high capacitance density in a flat configuration, with voltage ratings up to 450 Vdc and a temperature range from -55 °C to 105 °C. Their rugged construction provides extraordinary life and reliability for the most robust, commercial, and military-grade power supplies. LPS capacitors are available in 4 sizes. All cases have a thickness (height profile above the board) of 0.6 inches and a width of 1.8 inches. Case lengths are available from 1.5 to 3.0 inches, with capacitance values ranging from 120 to 51,000 µF and voltage ratings spanning 7.5 Vdc to 450 Vdc. The larger case sizes are typically rated for several amps (RMS). Ripple current ratings can be significantly enhanced by adding one or more heat sinks to their flat sides. Unlike conventional electrolytics that have a rolled cover, MLPS covers are laser-welded, providing near-hermetic seals that resist electrolyte dry-out. They can be put into service at high altitudes of up to 80,000 feet and have excellent capacitance retention at low temperatures. Various lead types and mounting options are available. 23.01.2023 14:30:00Jannews_2023-02-01_22.jpg\images\news_2023-02-01_22.jpghttps://www.cde.com/news/2023/1/mlps/cde.com
GaN FET for Automotive-Grade Lidar, 48 V – 12 V DC-DC Conversion, and Low Inductance Motor DrivesEfficient Power Conversion expands the selection o...11183Product ReleaseGaN FET for Automotive-Grade Lidar, 48 V – 12 V DC-DC Conversion, and Low Inductance Motor DrivesEfficient Power Conversion expands the selection of automotive, off-the-shelf gallium nitride transistors with the introduction of the 80 V, 11 m&#8486; EPC2252 that delivers 75 A pulsed current in a 1.5 mm x 1.5 mm footprint. The EPC2252 offers power system designers smaller and more efficient devices than silicon MOSFETs for automotive-grade lidar found in autonomous driving and other ADAS applications, 48 V – 12 V DC-DC conversion, and low inductance motor drives. Lower switching losses, lower conduction losses, zero reverse recovery losses, and lower drive power enable high frequency designs at high efficiency. Combined with a tiny footprint, these factors enable state-of-the-art power density. The fast-switching speed of GaN, with sub-nanosecond transitions and the capability to generate high-current pulses in less than 3 ns, results in longer range and higher resolution in lidar for autonomous driving, parking, and collision avoidance. "The EPC2252 makes an ideal switch for automotive lidar, low inductance motors, and 48 V DC-DC conversions," according to Alex Lidow, EPC's co-founder and CEO. "EPC is committed to the automotive market with a growing family of devices that enable highly efficient, low-cost vehicle electrification and autonomous driving."23.01.2023 07:30:00Jannews_2023-02-01_14.png\images\news_2023-02-01_14.pnghttps://epc-co.com/epc/events-and-news/news/artmid/1627/articleid/3102/design-higher-resolution-lidar-systems-with-new-automotive-qualified-gan-fet-for-advanced-autonomy-from-epcepc-co.com
Pre-APEC Power Magnetics at High-Frequency WorkshopThe PSMA Magnetics Committee and IEEE PELS are joi...11180Event NewsPre-APEC Power Magnetics at High-Frequency WorkshopThe PSMA Magnetics Committee and IEEE PELS are jointly sponsoring the eighth high-frequency magnetics workshop, "Power Magnetics @ High Frequency," on Saturday, March 18, 2023, which is the day before and at the same venue as APEC 2023 in Orlando, FL. This day-long event will continue the focus on identifying the latest improvements in magnetic materials, coil (winding) design, construction and fabrication, evaluation and characterization techniques and modelling and simulation tools to satisfy the technical expectations and requirements of higher application frequencies. The target audiences for this workshop include anyone working to achieve higher power densities, low profile aspect ratio, higher efficiencies and improved thermal performance. The theme of the 2023 Power Magnetics @ High Frequency Workshop will be magnetic component design across applications ranging from milliwatts to megawatts. The workshop will address applications areas such as IoT, servers, integrated voltage regulators (IVR), transportation electrification, wireless charging for mobile and electric vehicles and solid-state transformers. The workshop will also include presentations and demonstrations to address specific technical issues relative to high voltage and high current design such as corona, insulation, encapsulation, etc., that were identified in the 2022 workshop survey.19.01.2023 17:00:00Jannews_2023-02-01_11.jpg\images\news_2023-02-01_11.jpghttps://www.psma.com/2023_Power_Magnetics_at_High_Frequency_Agendapsma.com
SPS Expands to the USAWith an annual sales volume of more than 50 billio...11178Event NewsSPS Expands to the USAWith an annual sales volume of more than 50 billion euros, industrial automation is one of the most important economic sectors in Germany. The world's central trade fair platform for the industry is the SPS - Smart Production Solutions, organized by Mesago Messe Frankfurt. In view of its international success, the organizer will now also gain a foothold in the US market with this trade event. The SPS brand will be premiering in the region as the "Automation Sector powered by SPS" as part of IMTS 2024, before a stand-alone trade show is held in Atlanta in 2025. As a supplement to the trade show in Nuremberg and its associated events in Italy and China, the formats will further accelerate and facilitate the exchange of knowledge in the field of industrial automation between the economic regions of the USA and Europe. This is particularly relevant against the backdrop of the current challenges in the areas of supply chains, logistics, staff shortages and cost pressure, as this is also accompanied by an increased need for automation. Since industrial automation had become increasingly important for the leading American trade fair for manufacturing technology, IMTS, in recent years, this subject will now be spotlighted in the "Automation Sector powered by SPS - Smart Production Solutions" as part of the event from 9 -14 September 2024 in Chicago. With its expertise, Mesago Messe Frankfurt is supporting the organizer AMT (Association For Manufacturing Technology) in the realization of this special showcase, which is intended to illustrate smart and digital automation solutions for industrial manufacturing.19.01.2023 15:00:00Jannews_2023-02-01_9.jpg\images\news_2023-02-01_9.jpghttps://sps.mesago.com/nuernberg/en/press/press-releases/sps-press-releases/sps_expands_to_the_usa.htmlsps.mesago.com
EPE'23 ECCE Europe: 4 – 8 September 2023, Aalborg, DenmarkThe European Power Electronics and Drives Associat...11174Event NewsEPE'23 ECCE Europe: 4 – 8 September 2023, Aalborg, DenmarkThe European Power Electronics and Drives Association, EPE-Association in short, in collaboration with its co-sponsor IEEE-PELS, is proud to announce that EPE'23 ECCE Europe will take place in the AKKC – the Aalborg Congress and Culture Center from 4 to 8 September 2023. In addition to the regular topics for paper submission, EPE'23 ECCE Europe at Aalborg will highlight the following Focus Topics, not only in dedicated lecture and dialogue sessions, but also in keynotes, the exhibition, panel discussions, tutorials and technical visits. Paper submissions in line with these Focus Topics are highly encouraged. Energy Islands: 1. Renewable Energy systems and Power-to-X 2. Energy Islands; Energy Storage: 3. Energy-storage technologies 4. Electric Vehicles; Digital world in Energy: 5. Cyber Security in Power Electronics 6. Reliability and Artificial Intelligence in Power Electronics. The (only) Provisional Full Paper deadline is 2 March 202319.01.2023 11:00:00Jannews_2023-02-01_5.png\images\news_2023-02-01_5.pnghttps://epe2023.com/epe2023.com
All-in-One Hybrid Power Drive Module Solution Designed for Electric Aviation ApplicationsMicrochip Technology announces a comprehensive hyb...11184Product ReleaseAll-in-One Hybrid Power Drive Module Solution Designed for Electric Aviation ApplicationsMicrochip Technology announces a comprehensive hybrid power drive module, the first variant introduced in a product line of power devices that will be available in 12 different variants with either silicon carbide (SiC) MOSFETs or insulated-gate bipolar transistors (IGBTs). These hybrid power drive modules are highly integrated power semiconductor devices that reduce the number of components and simplify the overall system design. The configurable power devices include a three-bridge topology that are available in SiC or Si semiconductor technologies. Offering a compact design and low weight and profile, these high-reliability power devices help reduce the size and weight of MEAs. Other key capabilities of these hybrid power drive modules include numerous auxiliary power devices that facilitate an inrush current limit function. Optional add-on capabilities include soft start, solenoid interface drive, regenerative brake switch and thermal sensors for external monitoring circuitry usage. The power modules also facilitate high-switching frequency power generation, which enables smaller and more efficient systems. The standard voltage of the power modules ranges from 650V to 1200V, with the option to customize up to 1700V on request. The device is designed for low inductances for high-power density with power and signal connectors that are solderable directly on the user's printed circuit board.19.01.2023 08:30:00Jannews_2023-02-01_15.jpg\images\news_2023-02-01_15.jpghttps://www.microchip.com/en-us/about/news-releases/products/new-all-in-one-hybrid-power-drive-module-solution-from-microchipmicrochip.com
Agreement on Acquisition of Silicon Control IC CompanyNavitas Semiconductor announced an agreement to ac...11171Industry NewsAgreement on Acquisition of Silicon Control IC CompanyNavitas Semiconductor announced an agreement to acquire the remaining minority interest in its silicon control IC joint venture from Halo Microelectronics for a purchase price of $20 million in Navitas stock. In 2021, Navitas and Halo created a joint venture to develop application-specific silicon controllers that are optimized to work in combination with Navitas GaN ICs to set new standards for efficiency, density, cost and integration for a wide range of applications. The first family of products have been developed and released to production which address AC-DC power supply applications across mobile, consumer, home appliance and auxiliary power supplies in enterprise, renewables, EV and other related markets.  The silicon controller and GaN ICs combine either as a 'chip-set' or are co-packaged, to target 20 W to 500 W applications and have already been adopted by dozens of customers set to introduce their next-generation products later this year. As Navitas was already the majority shareholder, financial results from the joint venture have already been reflected in Navitas' historical financial statements and guidance. The transaction is expected to close in February. The addressable market potential for this additional silicon controller capability is estimated at over $1B per year by 2026. "This is another strategic acquisition for Navitas as we integrate critical silicon controller capabilities with our leading-edge GaN and SiC technologies," said Navitas CEO and co-founder Gene Sheridan. "Silicon controllers are needed in all power systems and largely define the architecture of those systems. By combining silicon controllers with GaN and SiC, Navitas is uniquely positioned to influence customer architecture decisions to maximize the system benefits and Navitas' value when using GaN or SiC in next-generation power electronics."19.01.2023 08:00:00Jannews_2023-02-01_2.png\images\news_2023-02-01_2.pnghttps://navitassemi.com/navitas-to-acquire-silicon-control-ic-company/navitassemi.com
Gate Driver IC Integrates Power Management Unit, Current Sense Amplifier, and Overcurrent ProtectionTo further expand its family for automotive and in...11187Product ReleaseGate Driver IC Integrates Power Management Unit, Current Sense Amplifier, and Overcurrent ProtectionTo further expand its family for automotive and industrial motor control applications, Infineon introduces the MOTIX 3-phase gate driver IC 6ED2742S01Q. The 160 V silicon-on-insulator (SOI) gate driver features an integrated power management unit (PMU) and is available in a QFN-32 package with a thermally efficient exposed power pad. This makes the easy-to-integrate device ideal for battery-powered industrial BLDC motor control drives including cordless power tools, robotics, drones, and light electric vehicles (LEVs). The 6ED2742S01Q has integrated bootstrap diodes that power three external high-side bootstrap capacitors. Through a trickle charge pump, they support 100 percent duty cycle operation. Protection features include under-voltage lock-out, overcurrent protection with configurable threshold, fault communication, and automatic fault recovery. The output drivers integrate a high-pulse current buffer stage designed for minimal driver cross-conduction. In addition, a current sense amplifier (CSA) with selectable gain between the low-side supply voltage (V SS) and the low-side power ground return (COM) is integrated. The MOTIX gate driver provides a 1 A source and 2 A sink current with independent under-voltage lock-out (UVLO) for both high-side and low-side gate drives. The device offers a propagation delay of 100 ns and a minimum dead time of 100 ns with built-in delay matching. As a result, the driver enables high switching frequencies with reduced level shift losses.18.01.2023 11:30:00Jannews_2023-02-01_18.jpg\images\news_2023-02-01_18.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2023/INFIPC202301-052.htmlinfineon.com
Air Core Inductors Feature Miniature Size and Low InductanceRichardson RFPD announced today the availability a...11185Product ReleaseAir Core Inductors Feature Miniature Size and Low InductanceRichardson RFPD announced today the availability and full design support capabilities for AL Series and AS Series of air core RF inductors from KYOCERA AVX. Part of KYOCERA AVX's wound air core inductor family, these devices feature SRF, high Q, high current, miniature size and low inductance. They are ideal for RF circuits, broadband I/O filtering, frequency selection and impedance matching. The AS Series features a square cross section that provides better performance and offers manufacturing advantages over toroidal coils.18.01.2023 09:30:00Jannews_2023-02-01_16.jpg\images\news_2023-02-01_16.jpghttps://www.richardsonrfpd.com/press-room/richardson-rfpd-introduces-kyocera-avx-al-series-and-as-series-air-core-inductors/richardsonrfpd.com
Non-Coupling Dual InductorsITG Electronics has introduced an updated version ...11182Product ReleaseNon-Coupling Dual InductorsITG Electronics has introduced an updated version of its non-coupling dual inductors. The enhanced component is part of the company's L101353A Series of ferrite-based flat wire inductors, whose members range from 1.0-10.0uH. ITG Electronics' non-coupling dual inductor is designed for power conversion applications with current ratings from 14-170Amp at 25C and 20% inductance drop. The component has a low DC resistance (DCR) of 1.06mOhm, and IRMS up to 50Amp. The box-style surface mount device (SMD) inductors provide lower core loss and high current output – ideal for settings involving high density and limited board space. The non-coupling dual inductors are designed for 48-volt direct power conversion, offering high performance and premium efficiency in demanding data center environments. At a maximum height of 24mm, the component offers a low profile; it is also not particularly wide or deep, with a footprint of just 24.5 x 26mm.18.01.2023 06:30:00Jannews_2023-02-01_13.jpg\images\news_2023-02-01_13.jpghttps://itg-electronics.com/series/869itg-electronics.com
Solution Enables Accurate Billing for Electric Vehicle ChargingA major step forward in supporting the deployment ...11173Industry NewsSolution Enables Accurate Billing for Electric Vehicle ChargingA major step forward in supporting the deployment of fast electric vehicle (EV) chargers in North America, the bi-directional DCBM will enable makers of electric vehicle charging stations (EVCSs) to accelerate their certification for DC metering requirements following Certified Test and Evaluation Professional/National Type Evaluation Program (CTEP/NTEP) certification. The DCBM will simplify the process of the manufacturers having to qualify their own charging stations for UL listed certification and, for extra peace of mind, will undergo a fresh audit every quarter. Capable of monitoring current, voltage, temperature and energy, the meter has been designed with data security, e-mobility, digitization and flexibility in mind and is a UL recognized component for the United States and Canada. The DCBM 400/600 complies with the standards UL 61010 and UL 810 with its certification in the FTRZ category for EV applications. To achieve this certification, the meter had to pass reinforced insulation tests, temperature testing of all its components and sub-assemblies, testing for protection against electric chock, durability of markings tests, equipment temperature limit tests and resistance to heat/fire risk tests. Says Claude Champion, General Manager at LEM USA Inc.: "The US and Canadian markets for EVs are continually expanding but this growth could be held back by insufficient access to rapid DC charging stations. LEM understands exactly what the sector needs and has worked closely with EVCS manufacturers and installers when developing solutions like the DCBM 400/600. We are ready to help make a zero-carbon future possible for North America."17.01.2023 10:00:00Jannews_2023-02-01_4.jpg\images\news_2023-02-01_4.jpghttps://www.lem.com/en/ev-chargerslem.com
Insulation Test System up to 30kVEMC Partner is offering an impulse insulation test...11186Product ReleaseInsulation Test System up to 30kVEMC Partner is offering an impulse insulation tester 1.2/50 µs from 500V to 30kV with integrated breakdown detection directly on generator or remote on the test object. Colour touch panel control with data collection and reporting are included. Optional impedances up to 5k&#8486;. The INS-1250 family of impulse insulation testers is designed for material insulation, components and electrical equipment safety in both development and production environments. The device features high accuracy internal or external measurement systems, programmable to detect breakdown with pass/fail criteria based on voltage and current impulse integral. Personnel safety is ensured through an emergency stop, warning lamp and test cabinet, disabling high voltage circuits when activated.15.01.2023 10:30:00Jannews_2023-02-01_17.jpg\images\news_2023-02-01_17.jpghttps://www.emc-partner.com/ins-seriesemc-partner.com
Battery Experts Forum Announces Date and LocationThe Battery Experts Forum will take place in 2023 ...11181Event NewsBattery Experts Forum Announces Date and LocationThe Battery Experts Forum will take place in 2023 from 07th – 09th November at the Wissenschafts- und Kongresszentrum Darmstadt (also known as Darmstadtium). As part of the networking event, the Who's Who of the international battery industry will meet for the 18th time this year. True to its motto "Charge up your knowledge", the event will focus on an exchange at the highest scientific level within the framework of the associated three-day conference. Anticipation of inspiring impulses, in the form of keynotes, tutorials and specialist presentations, will be aroused by topics such as recycling, current trends/world market, e-mobility, storage technologies and charging. In addition, various companies along the entire value chain of a battery - from cell manufacturers to OEMs - will present themselves on the modern and attractive exhibition area of the congress center and showcase materials, components, product innovations, test procedures, recycling processes and designs. As a must-have event for the industry, the Battery Experts Forum offers a combination of insider news with the highest scientific standards in the conference, latest trends in the exhibition and the chance to meet the experts of the industry up close, not only in the presentations but also during the networking events.13.01.2023 18:00:00Jannews_2023-02-01_12.jpg\images\news_2023-02-01_12.jpghttps://www.battery-experts-forum.com/index.php/en/battery-experts-forum.com
Powerful Filter Simulation with SPICEToday, a successful circuit design is almost alway...11189Product ReleasePowerful Filter Simulation with SPICEToday, a successful circuit design is almost always preceded by a simulation. However, a simulation is only as good as the data available. SCHURTER offers sophisticated simulation models for several of its single- and three-phase common-mode chokes. With these advanced simulation models, it is possible to precisely determine the effect the choke has in solving noise problems in an electrical circuit. With detailed SPICE simulation models, SCHURTER offers reliable support for the safe and cost-efficient development of electronic circuits using current compensated or linear chokes. The respective damping curves, SPICE models, and mechanical CAD models are available. Circuital simulation is a key element for electronics design and is supported by various computer-based tools. A proven, fast processing tool for this is SPICE (Simulation Program with Integrated Circuit Emphasis), which was first presented in 1973 at the University of California, Berkeley. This program has been further developed over the last decades, and it is now a widely used program that calculates algorithmic approximated solutions for analog, digital and mixed electrical circuits.12.01.2023 12:30:00Jannews_2023-02-01_20.jpg\images\news_2023-02-01_20.jpghttps://www.schurter.com/en/products-and-solutions/components/emc-products/common-mode-chokes/spice-libraryschurter.com
Multi-Year Agreement for Delivery of Silicon Carbide MaterialsInfineon is extending its cooperation with silicon...11175Industry NewsMulti-Year Agreement for Delivery of Silicon Carbide MaterialsInfineon is extending its cooperation with silicon carbide (SiC) suppliers. The German-based semiconductor manufacturer has signed a multi-year-supply and cooperation agreement with Resonac Corporation (formerly Showa Denko K.K.), complementing and expanding the announcement of 2021. The set of contracts will deepen the long-term partnership on SiC material. According to the agreement, Resonac will supply Infineon with SiC materials for the production of SiC semiconductors, covering a double-digit share of the forecasted demand for the next decade. While the initial phase focuses on 6" SiC material supply, Resonac will also support Infineon's transition to 8" wafer-diameter during the later years of the agreement. As part of the cooperation, Infineon will provide Resonac with intellectual property relating to SiC material technologies. The Infineon - Resonac partnership contributes to supply chain stability and will support the rapid growth of the emerging semiconductor material SiC. "The business opportunities in the area of renewable energy generation and storage, electromobility and infrastructure are enormous for the years to come. Infineon is doubling down on its investments into SiC technology and product portfolio, to proliferate the most comprehensive product offering to its customers. We are very happy that our partnership with Resonac will strongly support our market-leading position," said Peter Wawer, President of Infineon's Industrial Power Control division.12.01.2023 12:00:00Jannews_2023-02-01_6.jpg\images\news_2023-02-01_6.jpghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2023/INFXX202301-050.htmlinfineon.com
Aly Mashaly Appointed Director Application and Technical Solution Center in EuropeAs of January 1st, Aly Mashaly has succeeded Günte...11170PeopleAly Mashaly Appointed Director Application and Technical Solution Center in EuropeAs of January 1st, Aly Mashaly has succeeded Günter Richard as Director of ROHM's European Application and Technical Solution Center (ATSC). Günter Richard has retired after 32 years working for ROHM. Before having joined ROHM in 2015, Aly Mashaly has gained more than 20 years of experience in the electronics industry. He is an expert in power electronics, especially in the field of automotive applications. Also, he has worked as a development engineer and project manager in the fields of e-mobility and aerospace applications for several years. Mashaly is also a regular speaker at various conferences, including PCIM, ECPE, EPE and CS International. He holds degrees from the Ain Shams University Cairo and Leibniz University Hanover where he has studied electrical engineering. For his new role at ROHM, he has set himself ambitious goals: "With our highly skilled team, technical services and high quality products we strive for excellence to be a competent partner to our customers. On top, we want to be a supplier and partner for innovative solutions to help our society to overcome some pressing challenges of our time," states Mashaly. "I would also like to express my gratitude to my predecessor Günter Richard who has established the Application and Technical Solution Center back in 2019 and who has made the transition very easy to me," adds Mashaly. Aly Mashaly is now directly reporting to Wolfram Harnack, President of ROHM Semiconductor Europe: "Based on his huge amount of proven technical experience as well as his demonstrated leadership skills and commitment towards ROHM, I'm convinced that Mr. Mashaly will bring the ATSC and the technical customer service involved to the next level," concludes Wolfram Harnack.12.01.2023 07:00:00Jannews_2023-02-01_1.jpg\images\news_2023-02-01_1.jpghttps://www.rohm.com/news-detail?news-title=rohm-appoints-aly-mashaly-as-new-director-application-and-technical-solution-center-in-europe&defaultGroupId=falserohm.com
Chae Lee Appointed Chief Executive OfficerTagore Technology announced the appointment of Cha...11176PeopleChae Lee Appointed Chief Executive OfficerTagore Technology announced the appointment of Chae Lee as Chief Executive Officer. Chae Lee brings more than 35 years of experience to Tagore Technology. Prior to joining Tagore, Mr. Lee was President and CEO of Insyte Systems. Before that, Mr. Lee was Senior Vice President and General Manager of NXP's Secure Interface and Power Solutions Business Unit where he grew the business unit's revenue to $1B. Prior to NXP, Mr. Lee spent 16 years at Maxim Integrated Products where he developed multiple new product lines at Maxim and as Senior Vice President and General Manager of the Mobility Group, grew its revenue from $350M to $1B. Mr. Lee graduated from the University of Missouri-Rolla with a Bachelor of Science degree in Electrical Engineering. "I am pleased to welcome Chae to Tagore," said Oleg Khaykin, Tagore Technology's Chairman. "Chae is an accomplished technology leader with an impressive track record." Mr. Khaykin added, "The Board feels Chae is an excellent choice to leverage our recent progress and lead the company to achieve our aggressive growth strategy and expanded profitability." CEO and co-founder of Tagore Technology, Amitava Das added: "As co-founders of Tagore, Manish Shah and I are delighted to welcome Chae to the Tagore family as we take the company to the next level in its growth trajectory."11.01.2023 13:00:00Jannews_2023-02-01_7.jpg\images\news_2023-02-01_7.jpghttps://tagoretech.com/page.php?page-id=25tagoretech.com
70W and 160W External AC-DC Power AdaptersTDK announces the addition of the TDK-Lambda brand...11190Product Release70W and 160W External AC-DC Power AdaptersTDK announces the addition of the TDK-Lambda brand DTM70 and DTM160 series to the DTM family of compact medical and industrial AC-DC power adapters that are available in various power classes from 36W to 300W. Both series are available in Class I versions with a protective earth terminal on the input and Class II versions with double insulation protection. The adapters are housed in a robust plastic case with dimensions of only 120 x 52 x 31mm (DTM70) and 150 x 70 x 38mm (DTM160). The DTM70 is available with 12V, 15V, 18V, 24V, 36V and 48V output voltages and the DTM160 with 12V, 24V, 36V and 48V. The DTM70 and DTM160 series are suitable for 2MOPP medical applications and general industrial use. Both adapter series are certified to the IEC/EN/UL 60601-1 medical safety standard for clinical applications. In addition, IEC 60601-1-11 certification is available for all Class II versions, allowing these adapters to be used in home healthcare applications. For all versions, EMC is tested according to IEC 60601-1-2 Ed 4, which simplifies use with medical equipment. For industrial and ICT (Information and Communication Technology) applications, all models are tested according to IEC/BS/EN 62368-1 and are certified for installation altitudes up to 5000m. One special feature is the standard locking DIN output connector, which prevents unintentional disconnection of the output voltage of the adapter. Other connector versions and cable assemblies are available on request.10.01.2023 13:30:00Jannews_2023-02-01_21.png\images\news_2023-02-01_21.pnghttps://www.emea.lambda.tdk.com/uk/news/article/19181lambda.tdk.com
SiC MOSFETs to be Used in Inverters for Electric VehiclesROHM has recently announced the adoption of its 4t...11165Industry NewsSiC MOSFETs to be Used in Inverters for Electric VehiclesROHM has recently announced the adoption of its 4th Generation SiC MOSFETs and gate driver ICs in electric vehicle inverters from Hitachi Astemo a Japanese automotive parts manufacturer. Especially for EVs, the inverter, which plays a central role in the drive system, needs to be made more efficient to extend the cruising range and reduce the size of the onboard battery, increasing the expectations for SiC power devices. ROHM's latest 4th Generation SiC MOSFETs deliver improved short-circuit withstand time along with the low ON-resistance, making it possible to extend the cruising range of electric vehicles by reducing power consumption 6% vs IGBTs (as calculated by the international standard WLTC fuel efficiency test) when installed in the main inverter. At the same time, Hitachi Astemo, which has been developing advanced technologies for vehicle motors and inverters for a number of years, already enjoys a considerable track record in the increasingly popular EV market. However, this marks the first time SiC devices will be adopted for the main inverter circuit to further improve performance. The inverters are slated to be supplied to automakers from 2025, starting in Japan then expanding overseas. Going forward, as a leading supplier of SiC power devices, ROHM will continue to strengthen its lineup and provide power solutions that contribute to technical innovation in vehicles by combining peripheral device technologies such as control ICs designed to maximize performance.10.01.2023 10:30:00Jannews_2023-01-15_14.jpg\images\news_2023-01-15_14.jpghttps://www.rohm.com/news-detail?news-title=2023-01-10_news_astemo&defaultGroupId=falserohm.com
Christopher Bohn Named PresidentTektronix has promoted Christopher Bohn to Preside...11172PeopleChristopher Bohn Named PresidentTektronix has promoted Christopher Bohn to President of the global test and measurement company. Bohn most recently served as the Vice President Global Sales & Operations, where he was responsible for delivering global revenue growth and working cross-functionally to drive integration and customer focus between all revenue related functions. Bohn brings to the role a breadth of commercial, strategic, and continuous improvement experience and expertise that he gained over 15 years in global roles of increasing responsibility across Fortive's two largest operating companies, Fluke and Tektronix. "I'm extremely excited to continue the growth momentum at Tektronix by bringing outstanding solutions and services to our customers that help them accelerate technology advancements in the world," says Bohn. "For over 75 years, Tektronix has been at the forefront of helping customers bring new technologies to market and I'm happy to lead an organization with such a rich tradition of technology leadership." "As an engineer, veteran, and business leader, I'm drawn not only to technological innovation, but also to the culture and processes that have supported successful companies," says Bohn. "That culture - and the business processes that enable growth in both revenue and innovation - are what truly set an organization apart. I'm proud that Tektronix continues to invest in the best people, products, performance, and quality for our customers."10.01.2023 09:00:00Jannews_2023-02-01_3.jpg\images\news_2023-02-01_3.jpghttps://www.tek.com/en/news/tektronix-names-christopher-bohn-president_jan_10_2023tek.com
Acquisition of British Manufacturer of Wound Magnetic ComponentsKAMIC Group has acquired, through its subsidiary E...11179Industry NewsAcquisition of British Manufacturer of Wound Magnetic ComponentsKAMIC Group has acquired, through its subsidiary ETAL (UK), all the shares in Avon Magnetics Ltd. The sellers are John and Lynn Anderson. Avon Magnetics is a British manufacturer of wound magnetic components such as transformers, inductors and coils, with associated designs. Most components are developed specifically for customer-unique applications. Operations are based in Christchurch, Dorset on the English south coast, where the company has its own production facility. Avon Magnetics' history goes back to the 1960s but the company has operated under its present name since 1992. Over the years the company has built up expertise and is certified according to AS9100 revision D and ISO9001:2015, which is reflected in the company's strong position as a supplier to industries such as aerospace, defence and medical technology. Avon Magnetics has some 50 employees and annual sales of approximately GBP 2.5 million. Following the acquisition, Avon Magnetics is part of KAMIC Group's Magnetics business area led by Dan Phelan. "Avon Magnetics is a highly reputed player with strong skills in the design, development and production of wound magnetic components for use in customer-unique and safety critical applications. Avon Magnetics will therefore be a valuable addition to our current operations in the Magnetics business area," says Fredrik Celsing, President and CEO of KAMIC Group.09.01.2023 16:00:00Jannews_2023-02-01_10.jpg\images\news_2023-02-01_10.jpghttps://kamicgroup.com/index.php/en/2023/01/09/acquisition-of-avon-magnetics/kamicgroup.com
Automotive-Grade Devices Run Cooler in Surface-Mount SMIT PackageSTMicroelectronics has introduced five power-semic...11169Product ReleaseAutomotive-Grade Devices Run Cooler in Surface-Mount SMIT PackageSTMicroelectronics has introduced five power-semiconductor bridges in popular configurations, housed in ST's ACEPACK SMIT package that eases assembly and enhances power density over conventional TO-style packages. Engineers can choose from two STPOWER 650V MOSFET half bridges, a 600V ultrafast diode bridge, a 1200V half-controlled full-wave rectifier, and a 1200V thyristor-controlled bridge leg. All devices meet automotive-industry requirements and are suitable for electric vehicle on-board chargers (OBC) and DC/DC converters, as well as industrial power conversion. ST's ACEPACK SMIT surface mounted package delivers the easy handling of an insulated package with the thermal efficiency of an exposed drain. It allows direct-bonded copper (DBC) die attachment for efficient top-side cooling. The 4.6 cm2 exposed metal topside of the ACEPACK SMIT permits easy attachment of a planar heatsink. This creates a space-saving low profile that maximizes thermal dissipation for greater reliability at high power. The module and heatsink can be placed using automated inline equipment, which saves manual processes and boosts productivity. While minimizing the stack height and enhancing power density, the topside cooling design and 32.7mm x 22.5mm package footprint allow 6.6mm lead-to-lead creepage distance. The tab-to-lead insulation is 4500Vrms. The package also has low parasitic inductance and capacitance. The SH68N65DM6AG and SH32N65DM6AG 650V-MDmesh DM6 MOSFET half bridges now available in ACEPACK SMIT are AQG-324 qualified. Their Rds(on) (max) of 41m? in the SH68N65DM6AG and 97m? in the SH32N65DM6AG ensures high electrical efficiency and low thermal dissipation. They can be used in DC/DC converters for both OBC and high voltage to low voltage section. Their multi-role flexibility helps streamline inventory and simplify procurement.09.01.2023 14:30:00Jannews_2023-01-15_18.jpg\images\news_2023-01-15_18.jpghttps://newsroom.st.com/media-center/press-item.html/n4508.htmlst.com
Vertical GaN Sample Shipments to Customers Commencing in Q1 2023Odyssey Semiconductor announces product sample fab...11177Industry NewsVertical GaN Sample Shipments to Customers Commencing in Q1 2023Odyssey Semiconductor announces product sample fabrication is complete with shipments to customers commencing in Q1 2023. "Our backlog of customers has been eagerly waiting for these vertical GaN product samples. I'm proud to report that fabrication was completed as planned in Q4 2022 and now the samples are being prepared for shipment to customers later this quarter," said Mark Davidson, Odyssey's Chief Executive Officer. "We will work closely with these initial customers to gain valuable feedback on their product features. We expect to secure product development agreements with customers by the end of Q2 2023." Odyssey's approach to vertical GaN will offer even greater commercial advantages over silicon than silicon carbide or lateral GaN. Vertical GaN offers a 10x advantage over silicon carbide (SiC) at performance and cost levels unattainable by the competing technologies. The market the Company is pursuing is large and fast growing. The 650 volt segment is the larger market today, expected to grow at a 20% compound annual growth rate. The 1200 volt product market segment is expected to grow faster at 63% CAGR and will become the larger market in the second half of this decade. Together, the 650 and 1200 volt power device market is expected to exceed $5 billion in 2027, a 40% combined CAGR according to Yole Group, a French market research firm.09.01.2023 14:00:00Jannews_2023-02-01_8.png\images\news_2023-02-01_8.pnghttps://www.odysseysemi.com/news-media/press-releases/detail/43/odyssey-semiconductor-announces-vertical-gan-sampleodysseysemi.com
Power Adapter Reference Design with TO-220 GaN FETsTransphorm announced availability of its 240W Powe...11188Product ReleasePower Adapter Reference Design with TO-220 GaN FETsTransphorm announced availability of its 240W Power Adapter Reference Design. The TDAIO-TPH-ON-240W-RD deploys a CCM Boost PFC + Half-Bridge LLC topology to deliver a peak power efficiency of over 96 percent with a power density up to 30 W/in3. Transphorm's design uses three SuperGaN FETs (TP65H150G4PS) each with an on-resistance of 150 milliohms. The GaN FET comes as a 3-lead TO-220, a well-known and long-trusted transistor package that offers superior thermals at lowline for higher current power systems running PFC configurations. The reference design is intended to simplify and quicken power system development for applications such as high-power density AC-to-DC power supplies, fast chargers, IoT devices, laptops, medical power supplies, and power tools. The TDAIO-TPH-ON-240W-RD is a 240W 24V 10A AC-to-DC power adapter reference design. It pairs the TP65H150G4PS GaN FETs with onsemi's off-the-shelf NCP1654 CCM PFC controller and NCP1399 LLC controller. The design uses a 25 millimeter heatsink that produces a power density of over 24 W/in3. The power density can increase by approximately 25 percent to 30 W/in3 depending on the heatsink design. This high power density and efficiency range is primarily due to the FET's packaging as Transphorm offers the only high voltage GaN devices in a TO-220 today. Power adapters, along with all universal AC-to-DC power supplies, require high current at lowline (i.e., 90 Vac) which can require paralleling two PQFN packages (as typically seen with e-mode GaN) to achieve the desired power output. This method reduces a power supply's power density while requiring 2x part count. Transphorm's TO-220 packages mitigate this, thus providing unparalleled power density at a lower cost - a result not currently possible with e-mode GaN.05.01.2023 12:30:00Jannews_2023-02-01_19.jpg\images\news_2023-02-01_19.jpghttps://www.transphormusa.com/en/news/240w_power_adapter_refdesign/transphormusa.com
Medical and Industrial Power Conversion PlatformsAdvanced Energy Industries introduced two ranges o...11167Product ReleaseMedical and Industrial Power Conversion PlatformsAdvanced Energy Industries introduced two ranges of AC-DC power supplies for critical medical and industrial equipment. The SL Power NGB800 800 W and NGB1200 1200 W families are optimized to address the performance, power, size, reliability and compliance requirements of medical and industrial applications. The power supplies combine compact form factors and typical efficiencies above 90%. With full medical and industrial safety and EMC approvals, they comply with IEC 60601-1-2 4th edition covering medical equipment and applications operating in heavy industrial areas. "Medical and industrial OEMs want to reduce the size, improve the performance and extend the operating life of their equipment while minimizing time-to-market," said Conor Duffy, vice president of marketing, medical power products at Advanced Energy. "With their high efficiencies, small form factors, compliance with all relevant standards and long operating lives, the NGB family of power supplies enable equipment designers to address these challenging requirements. Deep engineering and integration support from Advanced Energy's technical teams further speed development cycles." Designed to meet the lifetime reliability requirements of equipment ranging from medical imaging and patient monitoring to industrial automation, the NGB families offer an MTBF in excess of 500,000 hours and come with a three-year warranty. Long-term reliability is further supported by the specification of high-quality electrolytic capacitors with operating lives over seven years. These power supplies can accommodate a wide 85 – 264 VAC input range and offer output voltages from 12 Vdc to 48 Vdc. Power supplies in the NGB800 family are convection cooled, while the NGB1200 units feature an integrated, low-noise fan.05.01.2023 12:30:00Jannews_2023-01-15_16.jpg\images\news_2023-01-15_16.jpghttps://ir.advancedenergy.com/news/advanced-energy-launches-medical-and-industrial-power-conversion-platforms-with-leading-power-density/da163d3b-4eb2-48ef-9538-e7e9c188615e/advancedenergy.com
SiC Technology Enhances Performance of DC Optimizersonsemi and Ampt LLC announced their collaboration ...11157Industry NewsSiC Technology Enhances Performance of DC Optimizersonsemi and Ampt LLC announced their collaboration to meet the high demand for DC string optimizers. Ampt uses onsemi's N-Channel SiC MOSFET, part of the EliteSiC family of silicon carbide (SiC) technologies, in its DC string optimizers for critical power switching applications. Ampt string optimizers are used in large-scale PV power plants, enabling lower-cost and higher performing solar and DC-coupled energy storage systems that are collocated within the solar power plant. The string optimizers deliver power from the PV array at a high and fixed voltage for system voltages ranging from 600 to 1500 VDC, reducing the overall current requirements and cost of the power plant. Ampt optimizers enable higher round-trip – charging and discharging – efficiency in the energy storage system and solar power plant by leveraging onsemi's latest SiC MOSEFT technology with lowest ON resistance and switching loses. "Incorporating onsemi's EliteSiC technology into our DC optimizers helps utility scale solar developers and owners improve their project economics," said Levent Gun, CEO of Ampt. "Clearly, the product performance was a critical decision point for us, but onsemi's technical support during the design phase and their ongoing supply assurance to support Ampt's rapid scaling are the hallmarks of a strong partner."05.01.2023 11:00:00Jannews_2023-01-15_6.png\images\news_2023-01-15_6.pnghttps://www.onsemi.com/company/news-media/press-announcements/en/onsemi-and-ampt-collaboration-increases-efficiency-for-utility-solar-providersonsemi.com
Full Brick Power Factor Correction AC-DC ModuleTDK Corporation announces the introduction of the ...11164Product ReleaseFull Brick Power Factor Correction AC-DC ModuleTDK Corporation announces the introduction of the TDK-Lambda brand PF1500B-360 full brick power module. Rated at 1512W with an input of 170 to 265V or 1008W from 85 to 265V, the module delivers a non-isolated, regulated 360Vdc output with a 0.98 power factor. The PF1500B-360 is ideally suitable for high voltage power systems using isolated DC-DC converters in a distributed power architecture configuration, or for loads requiring a high voltage source. Other applications include LED lighting, semiconductor fabrication and custom power supplies using power module-based solutions. The PF1500B-360 is packaged in the industry standard full brick footprint, measuring 116.8mm in length, 61mm wide and 12.7mm high (4.6 x 2.4 x 0.5 inches) enabling low profile designs. The module can operate reliably with baseplate temperatures of 100°C and in ambient temperatures of -40 to 85°C due to efficiencies of up to 96.5%. Standard features include a 10 - 16V 10mA auxiliary voltage, remote on/off, inverter good and a signal indicating the output voltage is more than 350V to enable isolated DC-DC converters to begin operating. Up to three modules may be connected in parallel with current sharing to provide additional power. The input and output to ground isolation is 2,500Vac. Safety certification is to the IEC/EN/CSA/UL 62368-1 standard and has CE / UKCA marks to the Low Voltage and RoHS Directives. With external circuitry the PF1500B-360 will meet radiated and conducted emissions and comply with the IEC 61000-4 immunity standards.05.01.2023 09:30:00Jannews_2023-01-15_13.jpg\images\news_2023-01-15_13.jpghttps://www.us.lambda.tdk.com/news/press-releases/20230105.htmllambda.tdk.com
Formula E Team Kicks Off Season 9 in Mexico CityMouser Electronics cheers on the DS PENSKE Formula...11155Industry NewsFormula E Team Kicks Off Season 9 in Mexico CityMouser Electronics cheers on the DS PENSKE Formula E team as they kick off Season 9 at the Autodromo Hermanos Rodriguez track in Mexico City on January 14, 2023. With a race-ready surface and long corners, Mexico City is one of the fastest tracks on the calendar, featuring a mix of long and fast straights and a technical infield section through Foro Sol stadium. Mouser is partnering with the DS PENSKE team throughout the 2022–23 ABB FIA Formula E World Championship racing season in collaboration with TTI, Inc. and valued manufacturers Molex and KYOCERA AVX. The DS PENSKE team will be racing the new third-generation Formula E DS E-TENSE FE23, which combines high-performance, efficiency, and stability. The Gen3 cars feature a top speed of 280 kph, are 60 kg lighter than the Gen2 cars, and offer double the regen capacity - meaning more than 40% of the energy used in-race is via regeneration under braking. The team benefits from two past Formula E Champions driving its cars, the reigning World Champion Stoffel Vandoorne and the two-time Formula E Champion, Jean-Éric Vergne.04.01.2023 09:00:00Jannews_2023-01-15_4.png\images\news_2023-01-15_4.pnghttps://eu.mouser.com/newsroom/publicrelations-formula-e-mexico-city-2023final/mouser.com
Battery Cell and Pack MonitorsTexas Instruments introduced automotive battery ce...11163Product ReleaseBattery Cell and Pack MonitorsTexas Instruments introduced automotive battery cell and pack monitors, maximizing electric vehicle (EV) drive time and enabling safer operation. As EVs grow in popularity, advanced battery management systems (BMS) are helping overcome critical barriers to widespread adoption. With a focus on solving complex system design challenges, TI provides a comprehensive portfolio of BMS devices, enabling automakers to create a safer, more reliable driving experience and accelerate EV adoption. The BQ79731-Q1 battery cell monitor and BQ79718-Q1 battery pack monitor provide an accuracy and precision in measuring battery voltage, current and temperature to effectively determine the true range of a vehicle and increase the overall life and safety of the battery pack. "Automakers aim to get the most range possible out of their EVs, and accurate state-of-charge estimations are vital to achieve this," said Sam Wong, general manager for BMS at TI. "Our new devices bring substantially higher precision to voltage and current measurement, giving automakers confidence to accurately measure an EV's true range."04.01.2023 08:30:00Jannews_2023-01-15_12.jpg\images\news_2023-01-15_12.jpghttps://news.ti.com/ti-enables-automakers-to-take-full-advantage-ev-range-with-industrys-most-accurate-battery-cell-and-pack-monitorsti.com
Part of Energy Industries Division to be AcquiredTÜV Rheinland signs an agreement to acquire ABB's ...11154Industry NewsPart of Energy Industries Division to be AcquiredTÜV Rheinland signs an agreement to acquire ABB's UK technical engineering consultancy, part of ABB's Energy Industries division. TÜV Rheinland will integrate this part into its Industrial Services & Cybersecurity business in the UK. The transaction is expected to close in Q2 2023. ABB's UK technical engineering consultancy including a network of subcontractors and associates has around 160 people operating from two main sites in the northeast and the northwest of England. A specialist team of technical experts helps global energy customers improve process safety, equipment and asset integrity as well as technical design for new and existing industrial plants. The combined business will create a scalable, broad-based technical engineering provider delivering a full-service offer to the high hazard industries, supporting customers in the energy transition and energy security. "We look forward to creating growth, stability and opportunity at a time where we are seeing increased demand for sustainability, decarbonization and business continuity," said Gareth Book, Managing Director TÜV Rheinland UK. "ABB's UK technical engineering consultancy will complement the existing risk, safety and integrity management services provided by TÜV Rheinland. Our aim is to build upon the long-standing customer relationships and trust that ABB and TÜV Rheinland have established in the UK over the last two decades."04.01.2023 08:00:00Jannews_2023-01-15_3.jpg\images\news_2023-01-15_3.jpghttps://www.tuv.com/press/en/press-releases/acquisition-abb.htmltuv.com
Space Level SMD InductorIdeal for space and aerospace applications, the S0...11162Product ReleaseSpace Level SMD InductorIdeal for space and aerospace applications, the S0603 inductor offers excellent temperature stability, High Q and Ultra High SRF values, Low Outgassing Properties and an Operating Temperature Range of -55 to +125 C degrees (higher operating temperatures available) - all in a super small rugged package. Our environmental testing lab conducts load life, thermal shock, powdered burn-in, short time overload, real time x-ray, and extreme temperature testing to guarantee the S0603's reliability in challenging environments. It's manufactured in our cleanroom and rigorously tested to MIL-STD-981 for the high performance criteria demanded in space flight.04.01.2023 07:30:00Jannews_2023-01-15_11.jpg\images\news_2023-01-15_11.jpghttps://delevan.com/web/index2.htmldelevan.com
Silicon Carbide Devices Power Future Electric Vehicle PlatformsWolfspeed announced the company will be supplying ...11152Industry NewsSilicon Carbide Devices Power Future Electric Vehicle PlatformsWolfspeed announced the company will be supplying Silicon Carbide devices to power future Mercedes-Benz Electric Vehicle (EV) platforms, enabling greater efficiency in the powertrain. Wolfspeed's semiconductors will be incorporated into next generation powertrain systems for several Mercedes-Benz vehicle lines. "Coming from a long-term technical collaboration history between our companies, we have now chosen Wolfspeed as one of our key partners for future Silicon Carbide devices, thus securing preferred long-term supply, technology and quality of this decisive semiconductor component for our electrification offensive," said Dr. Gunnar Güthenke, Head of Procurement and Supplier Quality for Mercedes-Benz. By leveraging Wolfspeed's expertise and Silicon Carbide devices to improve vehicle range and power, Mercedes-Benz plans to have some of the most efficient EVs on the road. "We are pleased to be supporting Mercedes-Benz, an organization with a long, successful history of providing world-class performance and luxury vehicles, as they introduce next-generation EVs to the market with highly efficient power systems," said Gregg Lowe, CEO of Wolfspeed. "We are continuing to invest in our manufacturing capacity to support a steepening demand curve for Silicon Carbide devices that will not only improve EV performance and drive greater consumer adoption, but also support the sustainability efforts of global automotive leaders like Mercedes-Benz."  04.01.2023 06:00:00Jannews_2023-01-15_1.jpg\images\news_2023-01-15_1.jpghttps://www.wolfspeed.com/company/news-events/news/wolfspeed-silicon-carbide-devices-power-future-mercedes-benz-electric-vehicle-platforms/wolfspeed.com
MOSFET for Light Electric VehiclesMagnachip Semiconductor Corporation ("Magnachip") ...11145Product ReleaseMOSFET for Light Electric VehiclesMagnachip Semiconductor Corporation ("Magnachip") announced that the company has launched its eighth-generation 150V MXT Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) optimized for Light Electric Vehicle (LEV) motor controllers and battery management systems (BMSs). This MOSFET (MDT15N054PTRH) features Magnachip's eighth-generation trench MOSFET technology to lower RDS(on) by 28%, as compared to the previous generation. Based on the enhanced design of the core cell and termination, a high figure of merit can be achieved and an increase in the total gate charge can be avoided. MDT15N054PTRH is available in a surface mount device TO-Leadless (TOLL) package to reduce product size and improve heat dissipation. The energy efficiency is also significantly enhanced by fast switching, while enabling high power density. In addition, a guaranteed operating junction temperature from -55°C up to 175°C and a high level of avalanche ruggedness help the new MXT MOSFET to exceed the performance requirements of LEV motor controllers and BMSs. "Beginning in 2008 we have released more than 40 MOSFET products for motor controllers and battery management systems and, since 2017, most of them have been made for LEV applications," said YJ Kim, CEO of Magnachip. "As a provider of high-performance MOSFETs, Magnachip will continue to deliver innovative solutions that meet the sophisticated requirements of the market."30.12.2022 08:30:00Decnews_2023-01-01_12.jpg\images\news_2023-01-01_12.jpghttps://www.magnachip.com/magnachip-introduces-8th-gen-150v-mxt-mosfet-for-light-electric-vehicles/magnachip.com
Dr. Richard McDonough Assumes Role as Material Research ScientistIndium Corporation is pleased to announce that Dr....11159PeopleDr. Richard McDonough Assumes Role as Material Research ScientistIndium Corporation is pleased to announce that Dr. Richard McDonough has been named Material Research Scientist. In his new role, Dr. McDonough is responsible for developing new thermal materials and products, and providing solutions for customer challenges and applications. He also develops new testing methods to evaluate power and thermal products, and gathers data on new and existing products for marketing presentations. Dr. McDonough joined Indium Corporation in August 2018 as a Product Specialist, most recently supporting the Semiconductor product line as a Senior Product Specialist. He has aided in the development of new products and the improvement of existing processes during his time with the company. Most notably, he assisted with the development of PicoShot and Indium12.8HF solder pastes for dispensing and jetting applications; helped to progress the development of sintering materials; and served as a dispensing expert for Indium Corporation. Prior to joining Indium Corporation, Dr. McDonough worked as an Analytical Chemist for Bristol Myers Squibb and as a Nuclear Engineering Officer in the U.S. Navy. He earned his bachelor's degree in chemistry from West Virginia University; his master's degree in physical chemistry from Syracuse University; and his Ph.D. in physical chemistry/biochemistry from Syracuse University.27.12.2022 13:00:00Decnews_2023-01-15_8.jpg\images\news_2023-01-15_8.jpghttps://www.indium.com/corporate/media-center/news/indium-corporations-dr-richard-mcdDonough-assumes-role-as-material-research-scientist/indium.com
Hightech Innovation Center in MunichMoving into the future: The HIC is the innovation ...11141Industry NewsHightech Innovation Center in MunichMoving into the future: The HIC is the innovation center of the Würth Elektronik Group of Companies. The location in Freiham offers the best conditions for driving forward research and development for trend-setting solutions. Würth Elektronik is relocating its Munich site from Garching to Freiham. With the Hightech Innovation Center Munich (HIC), a state-of-the-art building with a working and test field landscape, has been created in the west side of the metropolis. The facility offers the latest new-work approaches and space for 250 employees in the first construction phase. True to the company's motto "more than you expect," the HIC is not only an investment in the future of the company, but also in Munich as a location. With the facilities, there will be no limits to the engineers and scientists working on exciting topics such as wireless connectivity, sensor technology, power modules, IoT, cloud & software services, and Big Data. Within the next few years, an additional building with another 250 workstations will be built. This will provide sufficient space for growth and development. At the Garching site, the focus was largely on research and product development. In addition, valuable partnerships had been established due to the close proximity to various semiconductor manufacturers and universities. However, despite several expansions, the premises were still too small for the tech company. The HIC opens up completely new possibilities for the now 140-strong team to drive forward its own innovations "Made in Germany". A special highlight is the large test field, including two EMC test chambers, in which electromagnetic compatibility is tested. The test field accounts for around a quarter of the total area.21.12.2022 13:00:00Decnews_2023-01-01_8.jpg\images\news_2023-01-01_8.jpghttps://www.we-online.com/en/news-center/press?d=move-to-hic-freihamwe-online.com
Boeing Launches O3b-mPOWER SatelliteThe December 16 launch of Boeing's O3b mPOWER comm...11139Industry NewsBoeing Launches O3b-mPOWER SatelliteThe December 16 launch of Boeing's O3b mPOWER communication satellite marks a milestone for Vicor Corporation, whose high-performance, radiation-tolerant modules support Boeing's satellite mission. Boeing's O3b satellite will help deliver broadband internet access to the "other 3 billion" (O3b) people around the globe where access is limited or nonexistent. Drawing on an extensive heritage, Vicor power modules are ideally suited for powering advanced communications ASICs and FPGAs that require a very low-noise operating environment enabled by Vicor's soft-switching, high-frequency ZCS/ZVS power stages. The thermally adept modules in an SM-ChiP package provide superior density and efficiency. The complete source-to-point-of-load solution comprises four SM-ChiP modules powering advanced ASICs and FPGAs from a 100V bus: the BCM3423, a 100V input, 300W, K = 1/3 bus converter; the PRM2919, a 33V input 200W regulator; a VTM2919 150A current multiplier with an output of 0.8V; and a VTM2919 50A current multiplier with an output of 3.3V. The modules, which are manufactured in Andover, MA, (USA) are available in high-density SM-ChiP BGA packages. ChiPs are rated for operation from –40 to 125°C.21.12.2022 11:00:00Decnews_2023-01-01_6.png\images\news_2023-01-01_6.pnghttps://www.vicorpower.com/press-room/boeing-launches-o3b-mpower-satelvicorpower.com
Pioneering 420 kV SF6-Free Gas-Insulated Switchgear TechnologyHitachi Energy and Linxon are collaborating to str...11138Industry NewsPioneering 420 kV SF6-Free Gas-Insulated Switchgear TechnologyHitachi Energy and Linxon are collaborating to strengthen London Power Tunnel (LPT), a key power infrastructure project that will ensure reliable, clean electricity supply for England's capital city. To support National Grid in accelerating its net zero targets, Hitachi Energy will deliver EconiQ 420-kilovolt (kV) gas-insulated switchgear (GIS) and gas-insulated lines (GIL) containing no sulfur hexafluoride (SF6). As one of the world's largest investor-owned transmission and distribution utilities, National Grid has the ambition to remove all SF6 from its fleet by 2050. In 2020, it embarked on LPT project that will replace ageing high-voltage electricity cables and expand network capacity to meet the increasing electricity demand. Considered to be one of the city's largest engineering projects since the 1960s, the LPT will span 32.5 kilometers via underground tunnels in South London. Linxon is building Bengeworth Road substation for National Grid to develop the LPT  infrastructure. To support National Grid in its transition to SF6-free solutions, Hitachi Energy will deliver 7 bays of its EconiQ 420 kV GIS to enable the transmission of electricity over long distances while eliminating SF6, in addition to EconiQ 420 kV GIL. The EconiQ high-voltage portfolio is 100 percent as reliable as the conventional solutions based on SF6. The installation is expected to commence by 2023.21.12.2022 10:00:00Decnews_2023-01-01_5.jpg\images\news_2023-01-01_5.jpghttps://linxon.com/news/press-release-hitachi-energy-and-linxon-support-national-grid-in-achieving-sustainability-targets-through-pioneering-420-kv-sf6-free-gas-insulated-switchgear-technology/linxon.com
Sales Achievements RecognisedDistrelec announced the company has received the A...11158Industry NewsSales Achievements RecognisedDistrelec announced the company has received the Award for Best Sales and Accounts Growth from Keysight Technologies, as part of its 2022 Partner Executive Forum which took place in Athens (Greece). Distrelec was selected by Keysight to receive the prize based on a solid 65% year-on-year growth in sales. The distributor's customer base for Keysight products has increased by 15%. Distrelec colleagues Darren Baxendale, Senior Supplier Business Manager, and Charlotte Kennedy, Head Of Category Management collected the prize together in the Greek capital earlier this month. Charlotte Kennedy stated: "We were delighted to attend Keysight Technologies' Partner Executive Forum where Distrelec was recognised as the 2022 Best Sales and Account Growth Partner. It is a result of our mutual collaboration and our dedication to supplying advanced measurement solutions at the leading edge of technology. We are thrilled with this achievement and we pride ourselves on delivering a portfolio and service offering aligned to customer requirements. Great team effort from everyone!"20.12.2022 12:00:00Decnews_2023-01-15_7.jpg\images\news_2023-01-15_7.jpghttps://www.distrelec.biz/distrelec.biz
MOSFETs Ideal for Small, Thin DevicesROHM has developed a compact, high efficiency 20V ...11151Product ReleaseMOSFETs Ideal for Small, Thin DevicesROHM has developed a compact, high efficiency 20V Nch MOSFET, RA1C030LD, optimized for switching in small, thin devices, including smartphones and wearables such as wireless earbuds and other hearable equipment. The development of MOSFETs in wafer-level chip-size packages (WLCSP) that contribute to greater miniaturization while maintaining the necessary characteristics is becoming mainstream in the industry. ROHM leverages its strengths as an IC manufacturer to significantly reduce wiring resistance (which has increased with conventional discrete processes). The result is a compact power MOSFET that delivers low power loss. The RA1C030LD is offered in the DSN1006-3 wafer-level, chip-size package (1.0mm × 0.6mm) that takes advantage of ROHM's proprietary IC process to achieve low power dissipation together with greater miniaturization. In terms of the figure of merit that expresses the relationship between conduction and switching losses (ON-resistance × Qgd), a value has been achieved that is 20% lower than standard package products in the same package (1.0mm × 0.6mm or smaller), contributing to a smaller board area along with higher efficiency in a variety of compact devices. At the same time, ROHM's package structure provides insulated protection for the side walls (unlike standard products in the same package with no protection). This reduces the risk of shorts due to contact between components in compact devices that must resort to high density mounting due to space constraints, contributing to safer operation.19.12.2022 14:30:00Decnews_2023-01-01_18.jpg\images\news_2023-01-01_18.jpghttps://www.rohm.com/news-detail?news-title=2022-12-19_news_mosfet&defaultGroupId=falserohm.com
EMC Filters Offer Attenuation and Simple GroundingPowell Electronics is stocking Quell's EESeal+ EMI...11149Product ReleaseEMC Filters Offer Attenuation and Simple GroundingPowell Electronics is stocking Quell's EESeal+ EMI filter inserts with improved attenuation and frequency mitigation. The inserts are easily and quickly inserted into standard connectors in seconds without the need for any special tooling or soldering, forming an effective EMI filter and maintaining the environmental seal. Customized samples are available at very short lead times. The products benefit from Quell's patented EESeal+ technology which uses EMC filter components embedded into a silicone rubber insert that matches the size, shape and pin configuration of the connector to be filtered. Transient suppressors can also be included. Users can specify which filter elements are required for each pin, allowing for the creation of a completely custom filter insert with widely varying capacitor values, shorts and opens as desired. The EESeal+ technology benefits from lower contact resistance and lower inductance than standard EESeals due to the improved ground plane. Peak attenuation is around 45-50dB and customers have seen frequency mitigation as high as 100GHz. In addition to EMI filters the EESeal+ filters make it easy to ground pins to the shell such as the coaxial shields in Combo D-Sub connectors as well as ARINC and coaxial circular connections.19.12.2022 12:30:00Decnews_2023-01-01_16.jpg\images\news_2023-01-01_16.jpghttps://www.powell.com/content/Quell-3100042410powell.com
Hybrid Supercapacitors Available with Capacitances of 10 F, 25 F and 150 FEATON offers energy storage devices with particula...11168Product ReleaseHybrid Supercapacitors Available with Capacitances of 10 F, 25 F and 150 FEATON offers energy storage devices with particularly high capacity for reliable use in emergency power supply, pulse power and hybrid energy systems with the HS / HSL hybrid supercapacitors, available at Rutronik24. Their flexibility is particularly impressive: they can be used as a stand-alone energy storage device or in combination with batteries to optimize costs, service life and operating time. System requirements can range from a few microwatts to hundreds of watts. Their operating voltage of 3.8 V provides high energy, while the low ESR ensures high power density. Low self-discharge makes them ideal for use in combination with batteries. Low temperatures down to -25 °C are part of the application range of the HSL supercapacitors. On the other hand, the HS variant has an extended temperature range of up to +85 °C.  The capacitors are also lead-free, halogen-free and RoHS-compliant. Further fields of application include industrial backup / ride-through, backup for IT server, smart water and gas meters, IoT energy storage, medical emergency power supply / alarm systems and truck / container asset tracking.16.12.2022 13:30:00Decnews_2023-01-15_17.png\images\news_2023-01-15_17.pnghttps://www.rutronik24.com/eaton.htmlrutronik24.com
Three-Level Configurable Slew-Rate Controlled Power SwitchDiodes has introduced a versatile single-channel h...11166Product ReleaseThree-Level Configurable Slew-Rate Controlled Power SwitchDiodes has introduced a versatile single-channel high-side power switch. The DIODES AP22980 features three different selectable slew rates, so that wider capacitance loads can be handled while keeping inrush currents down, ensuring system stability. This power switch is targeted at the solid-state data storage systems used in portable electronic equipment, computer hardware, and edge-based data center deployments. The N-channel MOSFET, with a built-in charge pump inside the AP22980, has an extremely low Rds(ON) of 5.1m? enabling loads reaching 6A while minimizing voltage drops and power losses in high current loading applications. By having a separate VBIAS pin, the minimum input voltage that it is capable of supporting is significantly lower, resulting in a wider input voltage range that can be covered - from 0.285V to 5.5V - enabling greater application flexibility. With 60µA (typical) quiescent supply current, the AP22980 is highly optimized for situations where keeping standby power consumption down is a priority. This device has an operational temperature range of -40°C to 105°C. If the junction temperature exceeds 150°C, an overtemperature protection mechanism is triggered. The AP22980 three-level selectable slew rate power switches are supplied in the compact W-QFN1520 package that takes up little board space and eases integration.16.12.2022 11:30:00Decnews_2023-01-15_15.jpg\images\news_2023-01-15_15.jpghttps://www.diodes.com/about/news/press-releases/three-level-configurable-slew-rate-controlled-power-switch-from-diodes-incorporated-simplifies-and-enhances-power-rail-management-in-solid-state-drives/diodes.com
Elections for Infineon Supervisory BoardIn preparation for the Annual General Meeting on 1...11136PeopleElections for Infineon Supervisory BoardIn preparation for the Annual General Meeting on 16 February 2023, the Infineon Technologies Supervisory Board has proposed changes in its own composition to accompany the recent strategic decisions. In this context, Dr. Wolfgang Eder (70), Chairman of the Supervisory Board since 2019, and Hans-Ulrich Holdenried (71) have decided to support the renewal of the Supervisory Board and will resign from the Board at the next Annual General Meeting. Dr. Herbert Diess (64) and Klaus Helmrich (64) are the current candidates to succeed them. Subject to a confirming vote by the Annual General Meeting, Dr. Diess is expected to assume the role of Chairman of the Supervisory Board. "Now is the right time for changes to the Supervisory Board," says Dr. Eder, Chairman of the Infineon Supervisory Board. "First of all Cypress, Infineon's largest-ever acquisition with its approximately 10 billion USD purchase price, has now been successfully integrated. Second, the new Management Board team, led by Jochen Hanebeck, is doing excellent work. In the context of the most successful fiscal year in company history, we have jointly made extensive strategic decisions and updated the Target Operating Model, plotting a long-term future course for Infineon. I am pleased to have been able to contribute to Infineon's success during such a decisive phase. In the interest of an age-independent realignment of the Supervisory Board with a longer-term impact, I will not seek reelection. Given the highly challenging environment in which Infineon is active, I am pleased to welcome Dr. Herbert Diess as the ideal candidate to become my successor. He has excellent knowledge of the company and of the industry landscape."16.12.2022 08:00:00Decnews_2023-01-01_3.png\images\news_2023-01-01_3.pnghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2022/INFXX202212-040.htmlinfineon.com
Addition to Source-Down Power MOSFET FamilyInfineon Technologies launches a Source-Down 3.3 x...11150Product ReleaseAddition to Source-Down Power MOSFET FamilyInfineon Technologies launches a Source-Down 3.3 x 3.3 mm² PQFN product family in the 25-150 V classes with Bottom-Side (BSC) and Dual-Side Cooling (DSC) variants. The product family provides significant enhancements on the component level to offer attractive solutions in DC-DC power conversion, opening up new possibilities for system innovation in server, telecom, OR-ing, battery protection, power tools, and charger applications. In the Source-Down (SD) concept, the MOSFET die source contact is flipped toward the footprint side of the package, which is then soldered to the PCB. In addition, the concept comprises an improved clip design on top of the chip for the drain contact and market-leading chip-to-package area ratio. As system form factors continuously shrink, two key aspects are essential: reduction of power losses and optimal thermal management. Compared to best-in-class PQFN 3.3 x 3.3 m² Drain-Down devices, the family improves the on-resistance (R DS(on)) by up to 35 percent. Infineon's OptiMOS Source-Down PQFN with Dual-Side Cooling provides an enhanced thermal interface to redirect power losses from the switch towards the heatsink. Dual-Side Cooling variants offer the most direct way to connect a power switch to a heatsink, increasing power dissipation capability by a factor of up to three compared to the corresponding Bottom-Side Cooled Source-Down variant.15.12.2022 13:30:00Decnews_2023-01-01_17.jpg\images\news_2023-01-01_17.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2022/INFPSS202212-039.htmlinfineon.com
Silicon Carbide Wafer Supply Agreement with Global Semiconductor CompanyWolfspeed announced the expansion of an existing m...11140Industry NewsSilicon Carbide Wafer Supply Agreement with Global Semiconductor CompanyWolfspeed announced the expansion of an existing multi-year, long-term Silicon Carbide wafer supply agreement, now worth approximately $225 million. The expanded agreement calls for Wolfspeed to supply the company with 150 mm Silicon Carbide bare and epitaxial wafers, reinforcing the company's vision for an industry-wide transition from silicon to Silicon Carbide semiconductor power devices. "Wolfspeed has an unmatched level of experience with Silicon Carbide and, as a result, is a key player in supplying the rapidly growing demand for Silicon Carbide," said Dr. Cengiz Balkas, SVP and GM of Materials for Wolfspeed. "This agreement further strengthens our long-time cooperation with a best-in-class power semiconductor manufacturer.  This well-established partnership, paired with our most recent announcement of a multi-billion-dollar materials expansion in North Carolina, is a huge step forward in our mission of transitioning the industry from silicon to Silicon Carbide." The supply agreement enables Silicon Carbide applications in broad markets such as renewable energy and storage, electric vehicles, charging infrastructure, industrial power supplies, traction and variable speed drives.15.12.2022 12:00:00Decnews_2023-01-01_7.jpg\images\news_2023-01-01_7.jpghttps://www.wolfspeed.com/company/news-events/news/wolfspeed-expands-and-extends-silicon-carbide-wafer-supply-agreement-with-a-leading-global-semiconductor-company/wolfspeed.com
Point of Load DC/DCs with High-Efficiency Suit Distributed PowerRECOM Power announces two ranges of cost-effective...11148Product ReleasePoint of Load DC/DCs with High-Efficiency Suit Distributed PowerRECOM Power announces two ranges of cost-effective switching regulators - the RPMGQ-20 and RPMGS-20 open-frame, through-hole, non-isolated DC/DC buck converters with 20A output rating. The RPMGQ-20 is in an industry-standard quarter-brick format while the RPMGS-20 is in the emerging standard package size of 36.83 x 34.04mm with a standard sixteenth brick pin-out. Both products have a maximum height of 15mm from their mounting surface. The parts operate from an 18V-75V input and optional nominal outputs are 5V or 12V, trimmable over a wide range, 3.3V to 8V and 8V to 24V respectively. The efficiency of the RPMGQ-20 and RPMGS-20 parts is very high, peaking at 98% for the 12V output versions and 94% for 5V output, with a nearly-flat efficiency curve down to around 10% load. Due to the low losses and advanced thermal design, full load is available with air-flow to an ambient temperature of more than 90°C for all variants with derating to 120°C. The products feature comprehensive protection against input undervoltage, output over-current, short circuits, and over-temperature. Remote sense and control input is also provided.15.12.2022 11:30:00Decnews_2023-01-01_15.jpg\images\news_2023-01-01_15.jpghttps://recom-power.com/en/company/newsroom/news/rec-n-point-of-load-dc!sdcs-with-high-efficiency-suit-distributed-power-241.html?2recom-power.com
Partnership to Develop Emerging TechnologiesJ.A.M.E.S (Jetted Additively Manufactured Electron...11156Industry NewsPartnership to Develop Emerging TechnologiesJ.A.M.E.S (Jetted Additively Manufactured Electronics Sources) announced a partnership with heliguyTM Lab. The goal of this partnership is to join a global network to foster Additively Manufactured Electronics (AME) technology and redefine the electronics industry. J.A.M.E.S was founded to drive AME development through a collaborative space that delivers technical knowledge, design enablement and real-time communication, within a diverse global community, and at all levels of expertise. Throughout the J.A.M.E.S community, professionals and enthusiasts from different fields are able to collaborate, bringing together a rich array of experience and knowledge that is gathered from a variety of manufacturing processes, design methods, and materials across multiple industries to form a comprehensive initiative. This enables the J.A.M.E.S community to explore new possibilities in 3D printed electronics, leave behind conventional electronics manufacturing, and be part of visionary projects to advance the AME sector and increase accessibility. Andreas Müller, CEO of J.A.M.E.S said, "We aim to identify and advance the possibilities that exist for the future of AME. Sharing our knowledge and bringing this technology to the next level is one of our goals. Partnering with heliguy Lab will make a huge positive impact on merging technologies and discovering new paths in electrification processes. We are confident this collaboration will play a key role in shaping the future of AME technology."15.12.2022 10:00:00Decnews_2023-01-15_5.png\images\news_2023-01-15_5.pnghttps://j-ames.com/j-ames.com
Portfolio of High-Speed Inductive ResolversMelexis is adding the MLX90517 to its range of ind...11146Product ReleasePortfolio of High-Speed Inductive ResolversMelexis is adding the MLX90517 to its range of inductive resolver ICs. Through an external compensation algorithm, the MLX90517 ensures accuracy of better than ±0.36° at up to 660,000 e-rpm without the need of any IC programming. The MLX90517 works in combination with a set of PCB based coils. Arrangements can be easily adapted in line with the number of pole-pairs of the motor. Support for both on-axis (end-of-shaft) and off-axis (side-of-shaft or through-shaft) sensing provides engineers with options to implement coils for reliable and accurate sensing within acute mechanical constraints. The 3-phase based coil design enhances linearity via harmonic filtering that would not be possible in 2-coil systems. "The MLX90510 and MLX90517 bring engineers the freedom to choose between on-chip and off-chip compensation," states Lorenzo Lugani, Product Manager Inductive Sensors at Melexis. The MLX90517 has been developed as an ASIL C SEooC (Safety Element out of Context) in accordance with ISO 26262. It supports up to ASIL D system integration. Built-in overvoltage and reverse-polarity protection (±24 V on the supply and ±18 V on the outputs) allow it to withstand the most challenging of electrical environments. It is AEC-Q100 qualified, and has a -40°C to +160°C operational temperature range. This device is supplied in a TSSOP-16 package.15.12.2022 09:30:00Decnews_2023-01-01_13.jpg\images\news_2023-01-01_13.jpghttps://www.melexis.com/en/news/2022/15dec2022-melexis-expands-its-portfolio-of-high-speed-inductive-resolver-icsmelexis.com
Supporting the Transmission of Renewable PowerHitachi Energy announced that it has been selected...11153Industry NewsSupporting the Transmission of Renewable PowerHitachi Energy announced that it has been selected by Hydro-Québec for its high-voltage direct current (HVDC) technology for the transmission of electricity, which will ensure the sustainability of the energy exchange between the Quebec network, in eastern Canada, and New York State in the northeastern United States. Hydro-Québec, the largest hydroelectricity producer in Canada and one of the largest hydroelectricity producers in the world, is a public company that generates, transmits, and distributes reliable, clean and renewable electricity in Québec. Thanks to its surplus energy, it supplies the Canadian provinces and the northeastern United States. The Châteauguay HVDC system will enable the transmission of up to 1,500 megawatts of electricity between the electrical networks of Quebec and the state of New York which will contribute to maintaining a low carbon footprint in the region. This system will replace existing equipment which has been in operation since 1984, increasing the efficiency and controllability, plus raising the power conversion capacity of the Châteauguay HVDC system by 50 percent. Hitachi Energy is supplying a "back-to-back" converter station, which converts AC power to DC then reconverts it to AC from DC enabling the interconnection of the 735 kilovolt Canadian and 765 kilovolt New York grids which are "out of phase" and cannot be connected directly via traditional AC systems.15.12.2022 07:00:00Decnews_2023-01-15_2.png\images\news_2023-01-15_2.pnghttps://www.hitachi.com/New/cnews/month/2022/12/221216a.htmlhitachi.com
Award Reflects Support and Collaboration Spanning Over a DecadeTT Electronics has earned a Supplier Excellence Aw...11160Industry NewsAward Reflects Support and Collaboration Spanning Over a DecadeTT Electronics has earned a Supplier Excellence Award from Applied Materials, which recognizes the company's top performing suppliers for outstanding technical and operational achievements in areas including quality, service, lead time, delivery, cost, and responsiveness. TT Electronics received the award for Best in Class Performance. "Applied Materials congratulates our Supplier Excellence Award recipients for achieving outstanding performance over the past year," said Dr. Paul Chhabra, Corporate Vice President of Global Supply Chain at Applied Materials. "Having strategic relationships throughout the supply chain is more important than ever, and we thank our suppliers for their strong support and collaboration." "This prestigious award from Applied Materials illustrates the solid relationships we have with leaders in high-growth markets where we consistently deliver world-class customer service and proactive supply chain expertise," said Michael Leahan, Chief Operating Officer, TT Electronics. "TT Electronics has provided global manufacturing and agile supply chain solutions to Applied for over 12 years. This award reinforces TT's reputation as a solid, trusted partner with industry relationships spanning decades and multiple geographies."14.12.2022 14:00:00Decnews_2023-01-15_9.jpg\images\news_2023-01-15_9.jpghttps://www.ttelectronics.com/news/tt-electronics-receives-supplier-excellence-award/ttelectronics.com
GaN FETs for DC-DC Conversion, AC/DC SMPS and ChargersEPC introduces the 150 V, 3 m? EPC2305 and the 200...11144Product ReleaseGaN FETs for DC-DC Conversion, AC/DC SMPS and ChargersEPC introduces the 150 V, 3 m? EPC2305 and the 200 V, 5 m? EPC2304 GaN FETs in a thermally enhanced QFN package with exposed top and tiny 3 mm x 5 mm footprint. These devices are the lowest on-resistance (RDS(on)) FETs in the market at 150 V and 200 V in a size that is fifteen times smaller than alternative Si MOSFETs. In addition to offering devices with half the on-resistance and fifteen times smaller, QG, QGD, QOSS are more than three times smaller than Si MOSFETs and the reverse recovery charge (QRR), is zero. These characteristics result in switching losses that are six times smaller in both hard switching and soft switching applications. The driver losses are three times less than silicon solutions and ringing and overshoot are both significantly reduced. For sinusoidal BLDC motor drives, these devices enable < 20 ns deadtime and higher frequency to reduce noise, minimize size to allow for integration with the motor, reduce the input filter and eliminate the electrolytic capacitors, and increase motor + driver efficiency more than 8% by eliminating vibrations and distortions. This makes them ideal for forklift, escooter, eMobility, robots, and power tool motor drives.14.12.2022 07:30:00Decnews_2023-01-01_11.png\images\news_2023-01-01_11.pnghttps://epc-co.com/epc/events-and-news/news/artmid/1627/articleid/3097/lowest-on-resistance-150-v-and-200-v-transistors-on-the-market-now-shipping-from-gan-leader-epcepc-co.com
Collaboration on Laptop Power Adapter Design with Integrated GaNChicony Power announced its collaboration with Tex...11135Industry NewsCollaboration on Laptop Power Adapter Design with Integrated GaNChicony Power announced its collaboration with Texas Instruments (TI) to roll out Chicony Power's latest 65W laptop power adapter, Le Petit, featuring TI's GaN technology. Leveraging TI's half-bridge GaN FET with integrated gate driver, LMG2610, Chicony Power reduced the size of its 65W power adapter by 50% and increased up to 94% power efficiency compared to other 65W adaptors in the market, raising the bar for the laptop power industry. Chicony Power's long-term focus is on smart energy-saving solutions and improving power conversion efficiency in electronic power supply design. Chicony Power has worked closely with international IC companies and consistently provides market's and technical requirements, discusses the new design, and assists IC companies with the feasibility assessment, verification and debugging to help develop solutions in new designs. Chicony Power teamed up with TI for its expertise in high-voltage design and its integrated GaN technology. TI's LMG2610 is designed to be paired with the UCC28780/ UCC28782 active clamp flyback (ACF) controllers to create an easy-to-use, high-efficiency and high power-density solution for AC/DC designs under 75 W. Chicony Power leverages TI's integrated GaN technology with active clamp flyback (ACF) controller to enable a whole new world of power supply through this collaboration.14.12.2022 07:00:00Decnews_2023-01-01_2.jpg\images\news_2023-01-01_2.jpghttps://www.chiconypower.com/en/post/view?post_id=68chiconypower.com
Top Supplier of Passive Components in the French MarketBourns announced it has received a Best Supplier o...11142Industry NewsTop Supplier of Passive Components in the French MarketBourns announced it has received a Best Supplier of 2022 Award from Syndicat Professionnel de la Distribution en Electronique Industrielle (SPDEI), the French association of electronic components distributors. The award was given to Bourns as one of the five top suppliers of passive components supporting the French market. The SPDEI award acknowledges suppliers based on five key criteria that include partnership with distributors, technology and service innovation, profitability for distributors, allocating resources and providing protection and traceability of design. "Bourns has made significant investments in the development of innovative passive components designed to meet strict standards and application requirements. It is an honor to receive this award that recognizes Bourns' commitment to engineering high-quality, breakthrough products and our culture of responsive customer service," said James Harrington, Senior Vice President Worldwide Sales at Bourns. "I'd like to congratulate the Bourns France team for receiving this prestigious award based on their outstanding support and performance."13.12.2022 14:00:00Decnews_2023-01-01_9.jpg\images\news_2023-01-01_9.jpghttps://www.bourns.com/news/press-releases/pr/2022/12/13/bourns-receives-a-2022-best-supplier-award-from-spdei-the-french-association-of-electronic-components-distributorsbourns.com
Battery Protector Series to Include 60 A Rating to Prevent Battery Pack DamageLittelfuse announced the extension of its ITV9550 ...11147Product ReleaseBattery Protector Series to Include 60 A Rating to Prevent Battery Pack DamageLittelfuse announced the extension of its ITV9550 surface-mountable Li-ion battery protector series. These fuses safeguard battery packs against overcurrent and overcharging (overvoltage) conditions. The latest ITV9550 addition provides a 60 amp, three-terminal fuse in a 9.5 x 5.0 mm footprint. The innovative design incorporates an embedded fuse and heater elements that provide fast response and reliable performance to interrupt the battery pack's charging or discharging circuit before an overcharge or overheating condition occurs. "These new released parts are 60-amp rated devices, which extend our ITV line of li-ion battery pack protection fuses to provide more options for electronics designers," said Stephen Li, Global Product Manager at Littelfuse. "Expanding our portfolio of surface-mountable, three-terminal battery pack protectors enables us to provide this innovative solution to an even broader range of consumer and industry applications."13.12.2022 10:30:00Decnews_2023-01-01_14.jpg\images\news_2023-01-01_14.jpghttps://www.littelfuse.com/about-us/news/news-releases/2022/itv9550-battery-protector-series-expanded.aspxlittelfuse.com
Power Semiconductor Module Will Help to Simplify and Downsize Inverter SystemsMitsubishi Electric Corporation announced that its...11161Product ReleasePower Semiconductor Module Will Help to Simplify and Downsize Inverter SystemsMitsubishi Electric Corporation announced that its SLIMDIP-Z power semiconductor module, featuring an extra-high 30A rated current for use in inverter systems of home appliances, will be released in February 2023. The compact module will enable the SLIMDIPTM series to meet a wider range of power and size needs for inverter units, specifically by simplifying and downsizing systems for multifunctional and sophisticated products such as air conditioners, washing machines and refrigerators. The demand is growing for power semiconductors capable of efficiently converting electric power to help realize a low-carbon world. In 1997, Mitsubishi Electric commercialized its first DIPIPMTM as a high-performance intelligent power module with a transfer-mold structure incorporating a switching device and a control IC to drive and protect the switching element. Since then, DIPIPMs have been widely adapted for use in large appliances and inverters for industrial motors, contributing to the downsizing and energy-efficiency of inverter boards.13.12.2022 06:30:00Decnews_2023-01-15_10.png\images\news_2023-01-15_10.pnghttps://www.mitsubishielectric.com/news/2022/1213.htmlmitsubishielectric.com
EMV 2023: Impulses for the EMC IndustryParallel to the trade fair for electromagnetic com...11134Event NewsEMV 2023: Impulses for the EMC IndustryParallel to the trade fair for electromagnetic compatibility from 28. – 30.03.2023 in Stuttgart, the industry can look forward to a total of 36 practice-oriented workshops on current EMC topics. Registrations for these are now possible online. The workshop topics were selected in advance by a 19-member committee of experts. "A large number of participants from industry and science will meet at the EMV 2023 in Stuttgart for expert exchange," explains committee chairman Dipl.-Phys. Detlef Hoffmann from Webasto Roof & Components SE. "The workshop program offers a wide range of topics and allows newcomers, senior experts and decision-makers to find detailed opportunities to deepen their knowledge and expand their experience." In 2023, the EMC workshops will cover the key topics of measurement and immunity, measurement and emitted interference, interference protection/exposure, and approval and safety. In addition, the program includes specialized topics on aerospace and medical technology, as well as proven fundamentals. The well-timed enables attendees to attend several workshops that build on, or complement each other in terms of content. Six of the workshops will be held in English. Of these, three will be held by Frank Leferink, University of Twente and two by Dr. Diethard Hansen, EURO EMC SERVICE (EES) Dr. Hansen Consulting. For the first time, the speaker Arturo Mediano from the University of Zaragoza will participate with the topic "EMI/EMC debugging using oscilloscopes with time frequency conversion".13.12.2022 06:00:00Decnews_2023-01-01_1.jpg\images\news_2023-01-01_1.jpghttps://emv.mesago.com/stuttgart/en/press/press-releases/emv-press-releases/EMV-workshops.htmlemv.mesago.com
PCIM Europe 2023: A Positive OutlookFrom 9 - 11 May 2023, the PCIM Europe will once ag...11137Event NewsPCIM Europe 2023: A Positive OutlookFrom 9 - 11 May 2023, the PCIM Europe will once again be inviting the power electronics industry to Nuremberg, Germany. Participants can enjoy personal exchange complemented by a wide range of highlights for experts in the field. Just over five months prior to the start of the event, the exhibition for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management reports around 350 registered exhibitors; more than half of them from abroad. With their products and services, these companies represent the entire spectrum of the industry. Numerous key players in the field of power electronics have already confirmed their participation, including Fuji Electric Europe, Infineon, Mitsubishi Electric Europe, Semikron Danfoss, Wolfspeed, Nexperia, Rohm Semiconductor and Hitachi Europe. In addition, the event will again welcome various new exhibitors, thereby further enriching the offering at the PCIM Europe. These include companies such as Texas Instruments Incorporated, Robert Bosch GmbH, Volkswagen AG, Renesas Electronics Europe GmbH and Melexis Technologies NV. The international conference, which will be held in parallel, registered a record with more than 400 submissions upon closure of the application deadline for speakers. This outstanding response promises a high-quality and varied conference program with presentations from research and development of leading companies and universities from all areas of power electronics. The program will be published in January 2023.12.12.2022 09:00:00Decnews_2023-01-01_4.jpg\images\news_2023-01-01_4.jpghttps://pcim.mesago.com/nuernberg/en/press/press-releases/pcim-press-releases/e-mobility.htmlpcim.mesago.com
Polymer Chip Capacitor Series Offers Voltage Ratings up to 35 VDCCornell Dubilier's XMPL polymer chip capacitor ser...11143Product ReleasePolymer Chip Capacitor Series Offers Voltage Ratings up to 35 VDCCornell Dubilier's XMPL polymer chip capacitor series has been expanded to match applications with higher voltage and capacitance requirements. Their capacitance and voltage stability with temperature and frequency make these conductive polymer capacitors ideal for applications where bulk storage and high ripple current filtering are needed. Possessing much lower ESR and a shorter height profile than SMT aluminum electrolytics, XMPLs offer designers the opportunity to reduce the size and cost of their high-frequency/high-ripple applications by using fewer components. Standard capacitance values now range from 6.8µF to 470µF, with a maximum working voltage of 35VDC in a molded package measuring 7.3x4.3x1.9 mm. The operating temperature is -55°C to 105°C with a load life of 2,000 hours at 105°C with rated voltage applied. XMPLs are halogen-free and RoHS-compliant. Applications include high-frequency compact power supplies, DC-to-DC converters, LED lighting, industrial instrumentation, and automation.12.12.2022 06:30:00Decnews_2023-01-01_10.jpg\images\news_2023-01-01_10.jpghttps://www.cde.com/news/2022/12/xmpl/cde.com
Automotive Qualified GaN FETs for Vehicle Electronics and Advanced Autonomy Efficient Power Conversion expands the selection o...11132Product ReleaseAutomotive Qualified GaN FETs for Vehicle Electronics and Advanced Autonomy Efficient Power Conversion expands the selection of automotive, off-the-shelf gallium nitride transistors with the introduction of 80 V, 6 m&#8486; EPC2204A that delivers 125 A pulsed current in a 2.5 mm x 1.5 mm footprint and the 80 V, 3.2 m&#8486; EPC2218A that delivers 231 A pulsed current is a 3.5 mm x 1.95 mm footprint, offering designers significantly smaller and more efficient devices than silicon MOSFETs for automotive DC-DC for 48V-12V conversion, infotainment, and lidar for autonomous driving. The EPC2204A and EPC2218A are ideal for applications with demanding requirements for high power density including 48 V – 12 V bidirectional converters for mild hybrid cars, 24 V – 48 V DC-DC in cars and trucks, and for infotainment, lighting, and ADAS applications. Lower gate charges (QGD), and zero reverse recovery losses allow high-frequency operation of 1 MHz and beyond. Combined with high efficiency in a super tiny footprint, these factors enable state-of-the-art power density. As an example, for 2 kW – 4 kW 48 V-12 V converters, GaN devices allow five times the frequency of silicon MOSFET solutions.  Also, with a quarter of the inductance, inductor size and losses are reduced allowing 40% higher current per phase and up to half of the phases for lower system cost and half of the size. Despite the smaller size, efficiency increases up to 98%, greater than 2% higher than MOSFET solutions.08.12.2022 17:30:00Decnews_2022-12-15_25.png\images\news_2022-12-15_25.pnghttps://epc-co.com/epc/events-and-news/news/artmid/1627/articleid/3094/new-automotive-qualified-gan-fets-for-vehicle-electronics-and-advanced-autonomy-from-epcepc-co.com
Power Shunt Resistors Contribute to Greater MiniaturizationROHM has recently developed wide terminal shunt re...11126Product ReleasePower Shunt Resistors Contribute to Greater MiniaturizationROHM has recently developed wide terminal shunt resistors, LTR10L. They are optimized for a variety of applications in the automotive, industrial, and consumer sectors, while also strengthening its lineup with two general-purpose MCR series shunt resistors (MCR10L and MCR18L). In recent years, high efficiency operation is required from the viewpoint of energy conservation – not only in battery-driven applications such as mobile devices and EVs, but in consumer and industrial equipment as well powered by electrical outlets. For high efficiency, it is important to accurately detect parameters such as current and voltage in order to operate devices optimally. This requires shunt resistors that combine high accuracy with high reliability current detection. At the same time, manufacturers of applications utilizing higher board densities are demanding even smaller shunt resistors. To meet these needs, the LTR10L series delivers highest rated power and good temperature coefficient of resistance (TCR) in a compact 0508-size (0.5inch × 0.8inch) / 1220-size (1.25mm × 2.0mm) that contributes to both high reliability and greater miniaturization. Improving the resistive element material and applying terminal temperature derating method allowed LTR10L to deliver an industry-leading 1W rated power in the 0508-size - 88% smaller than existing products. In addition, high-accuracy ±0.5% resistance tolerance has been achieved, together with best-in-class TCR and anti-sulfuration characteristics. 08.12.2022 11:30:00Decnews_2022-12-15_19.jpg\images\news_2022-12-15_19.jpghttps://www.rohm.com/news-detail?news-title=2022-12-08_news_resistor&defaultGroupId=falserohm.com
Automotive-Qualified High Frequency Inductors with Tight TolerancesWürth Elektronik now offers WE-MCI—a series of hig...11125Product ReleaseAutomotive-Qualified High Frequency Inductors with Tight TolerancesWürth Elektronik now offers WE-MCI—a series of high-frequency inductors boasting a wide range of values: The 0402 package covers inductance values from 1 to 270 nH, while the WE-MCIs in a 0603 package range from 1 to 470 nH. A special feature of these automotive-approved components is their unusually tight tolerances of ±5% or ±0.3 nH for those models below 5.6 nH. AEC-Q200 qualified, with an operating temperature range -55 to +125°C, the SMT mountable components are suitable for applications in infotainment, keyless access systems, Bluetooth and filter circuits, to name but a few. The WE-MCIs are provided with polarity markings on both sides for improved production control. Design kits are available for both inductor package types, so components with the right values are always at hand. Würth Elektronik will always replenish these design kits free of charge.08.12.2022 10:30:00Decnews_2022-12-15_18.jpg\images\news_2022-12-15_18.jpghttps://www.we-online.com/en/news-center/press?d=wemci-ceramic-inductorswe-online.com
Modules for Silicon-Carbide Inverter DevelopmentSemikron Danfoss announced a long-term agreement w...11111Industry NewsModules for Silicon-Carbide Inverter DevelopmentSemikron Danfoss announced a long-term agreement with Dana, a major Tier 1 manufacturer of propulsion solutions to power vehicles and mobile machines. The agreement is for the supply of silicon-carbide semiconductors for use in the company’s Dana TM4 silicon-carbide inverters. The eMPack® platform from Semikron Danfoss is optimized for silicon carbide (SiC) technology, and the fully sintered “Direct Pressed Die“ (DPD) technology, which allows for extremely compact, scalable and reliable inverters, was one of the crucial factors that clinched the deal between Dana and Semikron Danfoss. “Semikron Danfoss is proud to be selected by Dana to deliver high performance SiC-based eMPack® traction modules for their future inverter platforms. Our modular design, capable of utilizing SiC devices from multiple chip sources, is the ideal module platform for Dana’s broad inverter portfolio”, said Siegbert Haumann, Senior Vice President, Semikron Danfoss Automotive Division. Targeted for use across the light-vehicle, commercial-vehicle, and off-highway mobility markets, Dana’s silicon-carbide inverter designs will enable higher system efficiency and power density in a compact package for medium- and high-voltage inverter applications, resulting in the potential for increased range. “This long-term supply agreement with Semikron Danfoss gives us a strong strategic advantage as we expand the use of silicon-carbide technology and support our customers with innovative, efficient, and powerful solutions,” said Christophe Dominiak, chief technology officer, Dana Incorporated.08.12.2022 09:00:00Decnews_2022-12-15_4.png\images\news_2022-12-15_4.pnghttps://www.semikron-danfoss.com/about-semikron/news-press/detail/semikron-danfoss-empackr-chosen-for-danas-silicon-carbide-inverter-development.htmlsemikron-danfoss.com
ees Europe and InterBattery Cooperate: South Korea to Present in MunichFor the first time, ees Europe 2023 is cooperating...11119Event Newsees Europe and InterBattery Cooperate: South Korea to Present in MunichFor the first time, ees Europe 2023 is cooperating with the Korea Battery Industry Association (KBIA), South Korea's largest exhibition and convention organizer Coex, and the state-run Korea Trade-Investment Promotion Agency (KOTRA). As part of the "InterBattery Showcase", companies from the South Korean battery industry will present themselves in a special exhibition area at ees Europe at Messe München. Within the Showcase, InterBattery will also organize its own conference, The Battery Day Europe, from June 14-15, which will discuss the latest technologies, insights and forecasts of the global battery industry and analyze market policies between Europe and Korea. The Battery Day Europe will perfectly complement the ees Europe Conference (June 13–14). The ees Europe, whose focus is on battery and energy storage systems, is strengthening its offering in the battery up-stream sector through this cooperation. With InterBattery, which takes place in conjunction with ees Europe, the organizers are creating Europe‘s largest industry event covering the entire spectrum of the battery market. "The 'Interbattery Showcase' adds value for our exhibitors and trade visitors from the battery industry ", says Markus Elsässer, CEO of Solar Promotion GmbH. "At Europe's largest energy industry platform, The smarter E Europe, exhibitors and trade visitors can make important contacts with South Korean equipment suppliers and battery industry suppliers," Elsässer adds. "The Interbattery Showcase and The Battery Day Europe are especially targeted at battery industry professionals, including cell manufacturers, engineers, product developers, policy makers, as well as professionals from related industries, such as automotive, EV and energy," adds Dong Ki Lee, CEO of Coex.07.12.2022 17:00:00Decnews_2022-12-15_12.jpg\images\news_2022-12-15_12.jpghttps://www.ees-europe.com/news/ees-europe-and-interbattery-cooperate-south-korea-to-present-in-munichees-europe.com
Hyundai Motor Company has Chosen Power Modules for Multiple ModelsSTMicroelectronics’s silicon-carbide (SiC) power m...11117Industry NewsHyundai Motor Company has Chosen Power Modules for Multiple ModelsSTMicroelectronics’s silicon-carbide (SiC) power modules have been selected for Hyundai’s E-GMP electric-vehicle platform shared by KIA EV6 and several models. Five SiC-MOSFET based power modules provide flexible choices for vehicle makers, covering a selection of power ratings and support for operating voltages commonly used in electric vehicle (EV) traction applications. Housed in ST’s ACEPACK DRIVE package optimized for traction applications, the power modules are reliable thanks to sintering technology, robust, and easy for manufacturers to integrate in EV drives. Internally, the main power semiconductors are ST’s third-generation (Gen3) STPOWER SiC MOSFETs, which combine figure of merit (RDS(ON) x die area) with very low switching energy and super performance in synchronous rectification. “ST’s SiC-MOSFET based power modules are the right choice for our traction inverters, enabling longer range. The cooperation between our two companies has realized a significant step towards more sustainable electric vehicles, leveraging ST’s continuous technological investment to be the leading semiconductor actor in the electrification revolution,” said Mr. Sang-Cheol Shin, Inverter Engineering Design Team at Hyundai Motor Group.07.12.2022 15:00:00Decnews_2022-12-15_10.jpg\images\news_2022-12-15_10.jpghttps://newsroom.st.com/media-center/press-item.html/t4502.htmlst.com
Programmable DC Power Supply Series Extended TDK Corporation announces the introduction of six ...11133Product ReleaseProgrammable DC Power Supply Series Extended TDK Corporation announces the introduction of six models to the 7.5kW TDK-Lambda GENESYS+™ series of high power density programmable DC power supplies. This expansion now provides incremental and seamless choices in output voltage and current ranging from 0-20V/375A to 0-1500V/5A. Target applications for the 7.5kW power supplies are automotive testing - including electric and hybrid cars, general test or research, measurement, semiconductor fabrication, battery manufacturing, and renewable energy. The six voltage models offer 0-30V/250A, 0-60V/125A, 0-80V/94A, 0-200V/37.5A, 0-300V/25A and 0-1000V/7.5A. The units can operate in constant current, constant voltage, or constant power limit modes and in addition offer internal resistance simulation. The units can be specified to accept three-phase 170 to 265Vac or wide range 342 to 528Vac inputs, with active Power Factor Correction. Operating efficiencies are up to 92%. The 7.5kW output power enables system configurators to avoid the need to parallel lower wattage power supplies, reducing the rack or cabinet size. The series benefits from DSP (Digital Signal Processing) technology and the latest generation components, including ferrite materials, to obtain efficiencies of 91 to 92%. Less internal waste heat ensures a higher power rating without compromising reliability.06.12.2022 18:30:00Decnews_2022-12-15_26.png\images\news_2022-12-15_26.pnghttps://www.emea.lambda.tdk.com/uk/news/article/19135lambda.tdk.com
Tactile Switch for Wearable Consumer ElectronicsLittelfuse announced the C&K Switches NanoT produc...11127Product ReleaseTactile Switch for Wearable Consumer ElectronicsLittelfuse announced the C&K Switches NanoT product line, a series of miniature, surface-mounted, very low profile, waterproof tactile switches. Smart wearables, health monitoring devices, and other battery-powered IoT devices are driving the need for a higher density of active components integration, seamless rounded screens, and additional functions in increasingly smaller spaces. The result is a demand for the switch interface to be smaller and smaller. The NanoT switch series is the smallest tactile solution on the market. It gives product designers room to build additional functionality into their design or reduce their printed circuit board (PCB) size. The NanoT is ideal for use in a wide range of wearable and portable consumer electronics, including hearing aids, health-monitoring devices, smartwatches, portable IoT devices, and headsets. “We are excited to release the NanoT switches, the world's smallest tactile solution currently available for high-end portable, wearable consumer and medical applications," said Daisy Liu, Global Product Manager at C&K Switches, now part of Littelfuse. "They provide the smallest size, IP67 waterproof tact switch available. They use the surface-mount technology (SMT) reflow process for the top version and Pin-in-Paste (PIP) reflow process for the side version. As a result, this product addresses the market's demand for smaller components while providing our customers with the ability to deliver high quality and high performance in their latest designs."06.12.2022 12:30:00Decnews_2022-12-15_20.jpg\images\news_2022-12-15_20.jpghttps://www.littelfuse.com/about-us/news/news-releases/2022/littelfuse-announces-smallest-ip67-rated-tactile-switch-available.aspxlittelfuse.com
Power Management System for BHP’s Jansen Potash ProjectABB has been selected by BHP to deliver a power ma...11110Industry NewsPower Management System for BHP’s Jansen Potash ProjectABB has been selected by BHP to deliver a power management system for the Jansen Potash Project in Canada, which will provide nutrient-rich potash fertilizer to enable more sustainable farming globally. The global resource company is progressing the US $5.7 billion Jansen Stage 1 Potash Project which is expected to achieve first production in late 2026. The order includes ABB Ability™ System 800xA Power Control Library, a digital application to monitor industrial electrical systems. It will help BHP on its journey towards an automated, electrified and digitalized site where engineers can monitor and quickly troubleshoot disturbances. The system will cover the electrical substation equipment remotely, reducing the time taken for fault diagnosis and problem solving. BHP’s 100 percent-owned Jansen Potash Project in Saskatchewan, Canada, is planned to be the largest potash producing mine in the world with an initial Jansen Stage 1 capacity of 4.5 million tons per annum (Mtpa) and potential for 16 to 17 Mtpa through future development. Potash, a potassium-rich salt used as a fertilizer to improve the quality and yield of agricultural crops, is an essential plant nutrient and is increasingly vital due to land scarcity and a growing world population. ABB will ensure high levels of availability and efficiency of the energy supply to the process. BHP will also have access to data for the electrical substation and electrical assets and the bank of information available will build over time, allowing trends to be identified and actions taken.06.12.2022 08:00:00Decnews_2022-12-15_3.jpg\images\news_2022-12-15_3.jpghttps://new.abb.com/news/detail/97691/abb-provides-power-management-system-for-bhps-jansen-potash-project-in-canadaabb.com
Collaboration on 8-Inch Gallium Nitride Power Semiconductor ManufacturingEPC and Vanguard International Semiconductor Corpo...11108Industry NewsCollaboration on 8-Inch Gallium Nitride Power Semiconductor ManufacturingEPC and Vanguard International Semiconductor Corporation (VIS) jointly announced a multi-year production agreement to produce gallium nitride-based power semiconductors. EPC will utilize VIS’ 8-inch (200 mm) wafer fabrication capabilities, significantly increasing manufacturing capacities for EPC’s GaN transistors and integrated circuits. Manufacturing will commence in early 2023. The products manufactured at VIS, an Automotive IATF 16949 certified foundry, will meet the growing demand for GaN power devices in data centers, electric vehicles, solar inverters, robotics, and space systems. “EPC’s GaN devices have superior performance, are easy to use, are extremely small, highly reliable, and very affordable. We are excited to partner with VIS to take advantage of their advanced, highly reliable, GaN platform to expand our capacity and meet our growing customers’ demands,” said Alex Lidow, CEO and co-founder of EPC. “VIS’ leading specialty IC manufacturing expertise, combined with EPC’s product design capability and outstanding figure of merit (FOM) of GaN, will deliver greater energy efficiency for more eco-friendly high-performance computing and electric vehicle applications,” said John Wei, COO of VIS. “We are thrilled to partner with EPC to bring this new-generation power device to new markets and applications, making contributions to environmental sustainability.”06.12.2022 06:00:00Decnews_2022-12-15_1.png\images\news_2022-12-15_1.pnghttps://epc-co.com/epc/events-and-news/news/artmid/1627/articleid/3093/epc-and-vis-announce-joint-collaboration-on-8-inch-gallium-nitride-power-semiconductor-manufacturingepc-co.com
Efficient Alternatives to Conventional AC/DC and Wireless PowerAt CES 2023, Eggtronic will be showcasing power co...11120Industry NewsEfficient Alternatives to Conventional AC/DC and Wireless PowerAt CES 2023, Eggtronic will be showcasing power conversion and wireless power controllers that address demands for more sustainable energy use and higher performance from products with ever-smaller form factors. In line with the company’s theme of ‘Revolutionary Power Electronics for a Better Planet’, Eggtronic’s demonstration area at The Venetian (Suite 29-310) will feature mixed signal controllers that dramatically reduce component count while improving the power density and efficiency of AC/DC converters and wireless power designs. These include architectures with superior no-load to full-load efficiency, complete solutions with fewer conversion stages, and wireless charging technologies that extend power transfer range while operating with the same efficiency as wired applications. Among the technologies on show will be QuarEgg® and SmartEgg® zero voltage switching (ZVS) designs that provide more efficient, higher power density alternatives to quasi-resonant (QR), active clamp flyback (ACF) and boost PFC+LLC technologies in non-PFC and PFC applications with power ratings from 20W to >500W. Wireless charging innovations on display include state-of-the-art Qi and E2Watt®, an AC wireless power hybrid technology that provides similar performance to wired solutions and offers the potential to extend wireless powering and charging to laptops, AV equipment, home appliances and even electric vehicles.03.12.2022 18:00:00Decnews_2022-12-15_13.jpg\images\news_2022-12-15_13.jpghttps://www.eggtronic.com/newsroom/eggtronic-showcases-the-future-of-sustainable-power-at-ces-2023/eggtronic.com
LED Paste for Mini/MicroLED ApplicationsIndium Corporation® has expanded its portfolio of ...11131Product ReleaseLED Paste for Mini/MicroLED ApplicationsIndium Corporation® has expanded its portfolio of proven pastes with a no-clean, halogen-free solder paste designed for advanced LED applications, including COB, COG, SMT, and other LED varieties. LEDPaste NC38HF combines wetting performance with stencil print transfer efficiency to satisfy the broadest range of process requirements for miniLED applications. It offers printability down to 60-micron apertures. MiniLEDs typically feature a length of less than 240 microns on the component edge; this material offers excellent compatibility with the current size of miniLEDs and as future die continue to miniaturize.02.12.2022 16:30:00Decnews_2022-12-15_24.jpg\images\news_2022-12-15_24.jpghttps://www.indium.com/corporate/media-center/news/indium-corporation-introduces-led-paste-for-advance-mini-microled-applications/indium.com
Cooperation on SiC Substrate Manufacturing TechnologySTMicroelectronics and Soitec announce the next st...11118Industry NewsCooperation on SiC Substrate Manufacturing TechnologySTMicroelectronics and Soitec announce the next stage of their cooperation on Silicon Carbide (SiC) substrates, with the qualification of Soitec’s SiC substrate technology by ST planned over the next 18 months. The goal of this cooperation is the adoption by ST of Soitec’s SmartSiC™ technology for its future 200mm substrate manufacturing, feeding its devices and modules manufacturing business, with volume production expected in the midterm. “The transition to 200mm SiC wafers will bring substantial advantages to our automotive and industrial customers as they accelerate the transition toward electrification of their systems and products. It is important in driving economies of scale as product volumes ramp,” said Marco Monti, President Automotive and Discrete Group, STMicroelectronics. “We have chosen a vertically integrated model to maximize our know-how across the full manufacturing chain, from high-quality substrates to large-scale front- and back-end production. The goal of the technology cooperation with Soitec is to continue to improve our manufacturing yields and quality.” “The automotive industry is facing major disruption with the advent of electric vehicles. Our cutting-edge SmartSiC™ technology, which adapts our unique SmartCut™ process to silicon carbide semiconductors, will play a key role in accelerating their adoption,” said Bernard Aspar, Chief Operating Officer of Soitec. “The combination of Soitec’s SmartSiC™ substrates with STMicroelectronics’ industry-leading silicon carbide technology and expertise is a game- changer for automotive chip manufacturing that will set new standards.”01.12.2022 16:00:00Decnews_2022-12-15_11.png\images\news_2022-12-15_11.pnghttps://www.soitec.com/en/press-releases/temp-qeoebfvqhxxovyfdeiohpayqollgdgsjlorpsoitec.com
Toroidal Common Mode Chokes Against EMC Interference Toroidal common mode chokes in THT from knitter-in...11130Product ReleaseToroidal Common Mode Chokes Against EMC Interference Toroidal common mode chokes in THT from knitter-inductive complement the existing product portfolio to meet the requirements of the e-mobility market, among others. The main area of application is the suppression of EMC disturbances in 1- and 3-phase applications at nominal voltages of 230 V and 400 VAC. Because these interferences can occur in different frequency ranges, knitter-inductive offers individualized solutions in addition to the standard versions. Exact selection is crucial for the reliable performance of the components. The latter is also convincing due to its significantly smaller size with the same current rating and its compatibility of very high ambient temperatures. For realizing even more customization, toroidal common-mode chokes allow horizontal as well as vertical mounting plate attachment of the core. Higher dielectric strength is achieved by adding a separator. Another plus is the possible choice of the PCB layout according to customer requirements.01.12.2022 15:30:00Decnews_2022-12-15_23.png\images\news_2022-12-15_23.pnghttps://www.rutronik24.com/knitter.htmlrutronik24.com
SiC & GaN User Forum: Potential of Wide Bandgap Semiconductors in Power Electronic ApplicationsThe hybrid ‘SiC & GaN User Forum: Potential of Wid...11114Event NewsSiC & GaN User Forum: Potential of Wide Bandgap Semiconductors in Power Electronic ApplicationsThe hybrid ‘SiC & GaN User Forum: Potential of Wide Bandgap Semiconductors in Power Electronic Applications’ from the ECPE will be held on March 28-29, 2023, in Erding/Munich, Germany. The technical chair is Prof. Andreas Lindemann, Otto-von-Guericke-University, Magdeburg, Dr. Peter Friedrichs, Infineon Technologies, and Prof. Leo Lorenz and Thomas Harder, ECPE. The programme will start with an overview on the status and trends in WBG Power Electronics. Then, the 1st day is dedicated to the use of GaN HEMTs in different systems and applications. Recent developments e.g. on bidirectional HEMTs, multi-channel tri-gate devices and vertical GaN devices will also be presented and discussed. The 2nd workshop day will concentrate on SiC device applications. Further, an outlook on promising ultra wide bandgap (UWBG) materials and devices will be given. The workshop will be closed with a panel discussion addressing the topics of WBG device maturity, robustness and reliability. International renowned experts are being invited to give an overview and to in depth explain their research and development work in technical presentations. Besides, the ECPE Wide Bandgap User Forum offers a platform for all participants to share experience and ideas. Registration Deadline is the 22nd of March.01.12.2022 12:00:00Decnews_2022-12-15_7.png\images\news_2022-12-15_7.pnghttps://www.ecpe.org/events/workshops-tutorials/all/details/evt/mdl/ed/0/442/rid/bid/ldid/eyJtZWRpYUZpbHRlciI6eyJtZWRpYUxpc3RVcmkiOiJ8fHx8fHx8In0sImV2ZW50RmlsdGVyIjp7ImV2ZW50TGlzdFVyaSI6IjF8bHVmZWRpdG1lZGlhbGlicmFyeXxNZWRpYUxpYnJhcnl8TWVkaWFMaWJyYXJ5fGV2ZW50TGlzdHwyODd8MjAzN3wiLCJlbnRlcmVkUGVyaW9kQ3VycmVudCI6dHJ1ZX0sInJvYWRtYXBGaWx0ZXIiOnsicm9hZG1hcExpc3RVcmkiOiJ8fHx8fHx8In0sImJyb2NodXJlRmlsdGVyIjp7ImJyb2NodXJlTGlzdFVyaSI6Inx8fHx8fHwifSwibGVnYWxEb2N1bWVudEZpbHRlciI6eyJsZWdhbERvY3VtZW50TGlzdFVyaSI6Inx8fHx8fHwifX0%3D/ecpe.org
Partnership Contributes to the Technical Innovation of New Energy Vehicles Shenzhen BASiC Semiconductor and ROHM have entered...11112Industry NewsPartnership Contributes to the Technical Innovation of New Energy Vehicles Shenzhen BASiC Semiconductor and ROHM have entered into a strategic partnership agreement on SiC power devices for automotive applications. A signing ceremony was held at ROHM’s headquarters in Kyoto to commemorate the occasion. The signing ceremony was concluded by Weiwei He (right), General Manager of Shenzhen BASiC Semiconductor Ltd. and Isao Matsumoto (left), President and CEO of ROHM Co., Ltd. Under this agreement, the two companies will leverage their respective strengths to innovate and improve the performance of SiC power devices and develop higher performing, more efficient and reliable SiC solutions for new energy vehicles. The first step involves supplying onboard power modules that leverage the combined technologies to several major automakers for use in electric vehicle powertrains. And going forward, both ROHM and BASiC Semiconductor will contribute to technological innovation in the automotive sector by accelerating the development of innovative power solutions centered on SiC.01.12.2022 10:00:00Decnews_2022-12-15_5.jpg\images\news_2022-12-15_5.jpghttps://www.rohm.com/news-detail?news-title=2022-12-01_news&defaultGroupId=falserohm.com
Distributor Supports Customers from Design with GaN devicesInnoscience Technology has signed a global distrib...11116Industry NewsDistributor Supports Customers from Design with GaN devicesInnoscience Technology has signed a global distribution agreement with Richardson RFPD, an Arrow Electronics company. “This is a great decision for Innoscience” comments Denis Marcon General Manager, Europe, at Innoscience. “Richardson RFPD is well-recognized as a leader in new business generation and design-in with very qualified and experienced technical support teams. The combination is perfect for Innoscience and our customers, as they begin their journey with GaN and then ramp up.” Richardson RFPD will offer full design support and product availability for Innoscience’s wide power device portfolio covering both Low Voltage (30V-150V) as well as High Voltage (650V) GaN power devices.30.11.2022 14:00:00Novnews_2022-12-15_9.png\images\news_2022-12-15_9.pnghttps://www.innoscience.com/innoscience.com
Tobias Hübner Appointed Head of Sales for EMEATDK Corporation announces Tobias Hübner as Head of...11113PeopleTobias Hübner Appointed Head of Sales for EMEATDK Corporation announces Tobias Hübner as Head of Sales at TDK-Lambda EMEA, following Pascal Cozzolino, who will soon retire after more than 20 years of solid service for the company. Tobias joins TDK-Lambda EMEA with more than 20 years of experience in the competitive and innovative semiconductor industry, where he held various management positions in sales, applications and product management. Previous to TDK-Lambda, he spent 11 years with electronic device manufacturer Maxim Integrated, which is now part of Analog Devices. “We are extremely pleased to welcome Tobias,” says Matt Cotton, Managing Director, TDK-Lambda EMEA. “We are confident that his extensive experience will enable us to continue driving the company forward and growing our market position.” In his new position, Tobias will continue implementing improvements in the sales organisation and contribute to and drive the future growth plans of TDK-Lambda EMEA. “I’m very fortunate to join a worldwide leader in the power supply market and look forward to transferring my knowledge and experience gained from the semiconductor industry to benefit and grow TDK-Lambda EMEA in this fast-changing environment,” says Tobias.29.11.2022 11:00:00Novnews_2022-12-15_6.jpg\images\news_2022-12-15_6.jpghttps://www.emea.lambda.tdk.com/uk/news/article/18973lambda.tdk.com
Series of Resonant Inductors ITG Electronics has introduced a series of resonan...11124Product ReleaseSeries of Resonant Inductors ITG Electronics has introduced a series of resonant inductors. Suitable for DC/DC power conversions of up to 3 kilowatts, the company’s L101374SP Series of Resonant Inductors comprises 13 distinct high-performance products. They are ideal for power conversion application in data centers, electric vehicles and industrial settings. The L101374SP Series of Resonant Inductors was initially developed for a specific customer application, and is now available to the wider market. ITG Electronics was selected by an industry leader in DC/DC power conversion to design and produce a portfolio of resonant inductors with elevated efficiency and power density. These features – high power and heightened efficiency – align with those called for in GaN Systems Inc.’s design reference parameters, and is now included in the organization’s Technical Manual of P/N GS-EVB-LLC-3KW-GS. The L101374SP Series of Resonant Inductors can accommodate up to 650 volts, and up to 71.0 amperes with approximately 30% roll off. According to Martin Kuo, Managing Director of ITG Electronics: “The new L101374SP Series of Resonant inductors and LLC transformer P/N T301373SP-04 work well with GAN P/N GS-EVB-LLC-3KW-GS, which are empowering our customers to implement full-bridge LLC resonant converters that exceed the 80+ Titanium standard for power supply units, achieving high-power density (PFC+DC/DC) above 100W/in3 and efficiencies greater than 96%.”28.11.2022 09:30:00Novnews_2022-12-15_17.jpg\images\news_2022-12-15_17.jpghttps://www.itg-electronics.com/index.phpitg-electronics.com
3-Phase Block Filters for Machine ApplicationsSCHURTER is expanding the FMBC EP and FMBD EP 3-ph...11129Product Release3-Phase Block Filters for Machine ApplicationsSCHURTER is expanding the FMBC EP and FMBD EP 3-phase filter families with variants for machine applications. The filters meet the requirements of machine safety according to IEC 60204-1. They are suitable for 3-phase or 3-phase-with-neutral conductor applications at rated currents from 16 to 230 A. The FMBC EP and FMBD EP dual-stage block filters have a particularly compact design with a small footprint and high performance at the same time. They are suitable for industrial or energy applications such as EV fast charging stations or battery storage. Any machine or equipment that is to be brought onto the market in the EU and associated countries must bear a CE marking issued by the manufacturer himself. With this marking, the manufacturer guarantees that his product complies to all applicable legal and technical requirements. Minimum standards with regard to safety and occupational health requirements are defined in Europe by the Machinery Directive 2006/42/EC and the Low Voltage Directive 2014/35/EU. The details for implementation are defined in separate specifications, known as harmonizing standards. One of these harmonizing standards is IEC 60204-1, which applies to electrical, electronic and programmable electronic equipment as well as to groups of networked machines, including control cabinet construction. The filter versions meet the requirements of this standard IEC 60204-1. 25.11.2022 14:30:00Novnews_2022-12-15_22.jpg\images\news_2022-12-15_22.jpghttps://www.schurter.com/en/news/3-phase-block-filters-for-machine-applicationsschurter.com
Partners to Automate and Speed Up EMC TestsElectric vehicles contain many electronic componen...11109Industry NewsPartners to Automate and Speed Up EMC TestsElectric vehicles contain many electronic components that emit radio-frequency interference which may have a negative impact on the vehicle performance and driving experience. To ease and speed up the development process, AVL and Rohde & Schwarz present an solution for automated electromagnetic compatibility (EMC) data analysis of an electric drivetrain under real driving conditions. The electrification of vehicles leads to new EMC challenges because of higher switching frequencies of semi-conductors and higher emissions due to high voltages and currents. EMS (Electromagnetic Susceptibility) and EMI (Electromagnetic Interference) testing of components and vehicles addresses these challenges. To meet time to market requirements, test automation is key. Additionally, the tests must be as realistic as possible, so there is a trend from static EMC testing of vehicles to dynamic testing where the drivetrain is active, varying in speed as well as torque during the execution of the EMC test. “Many customers have been wanting for years to see Rohde & Schwarz EMC analyzers connected to the AVL EMC test automation system. Together, we have finally accomplished this, and are pleased to offer this new solution, improving and accelerating EMC validation of e-drives and vehicles,” states Alban Hemery, Department Manager for E-Motor Test Systems and EMC Applications at AVL List GmbH. “As market leader in EMC instrumentation, Rohde & Schwarz has a long and productive history of collaboration with AVL to develop leading-edge test systems for the automotive industry. The enhancement of R&S ELEKTRA to be compatible with AVL’s PUMA 2 is another significant step speeding up EMC test times under real driving conditions, particularly for electric drivetrains,” adds Juergen Meyer, Vice President Market Segment Automotive at Rohde & Schwarz.24.11.2022 07:00:00Novnews_2022-12-15_2.jpg\images\news_2022-12-15_2.jpghttps://www.rohde-schwarz.com/about/news-press/all-news/avl-and-rohde-schwarz-collaborate-to-automate-and-speed-up-emc-tests-under-real-driving-conditions-press-release-detailpage_229356-1300992.htmlrohde-schwarz.com
Power Supply Delivers up to 800W with BF-Ready Isolation TDK Corporation announces the introduction of the ...11086Product ReleasePower Supply Delivers up to 800W with BF-Ready Isolation TDK Corporation announces the introduction of the TDK-Lambda brand 1U high MU4 series of AC-DC modular power supplies. The product’s very low acoustic noise is strongly desired in test and medical applications where audible disturbances need to be kept to a minimum. The modular MU4 can provide up to five isolated and regulated outputs and deliver up to 800W. All models in the MU4 series feature full MOPPs (Means of Patient Protection) isolation, including output to earth, to simplify implementation into BF-rated medical applications. Other target applications include dental, test and measurement, broadcast, professional audio, and industrial equipment. With intelligent fan control, the MU4 fan rotation speed is reduced, producing audible noise as low as 36dBA*. Its microcontroller algorithm monitors the temperature of the primary converter and each output module, allowing the fan speed to be adjusted for optimum cooling. The low profile, 1U high, MU4 measures just 89 x 41 x 257.5mm (W x H x D), allowing a smaller system enclosure. Initially, nine modules are available, offering a continuous range of voltages from 3.3V to 104V with ratings from 150W to 480W. Options include a 5V / 2A standby voltage, fan fail signal, inhibit and enable (for individual or all outputs), DC good, PMBus™ communication, and current share for parallel configurations.22.11.2022 13:30:00Novnews_2022-12-01_17.png\images\news_2022-12-01_17.pnghttps://www.emea.lambda.tdk.com/uk/news/article/18939lambda.tdk.com
Joint Agreement to Develop Inverters for e-Axle Using SiC Power ModulesROHM has signed a joint development agreement with...11072Industry NewsJoint Agreement to Develop Inverters for e-Axle Using SiC Power ModulesROHM has signed a joint development agreement with Mazda Motor and Imasen Electric Industrial for inverters and SiC power modules to be used in the electric drive units of electric vehicles, including e-Axle. As the ‘heart of the EV’, e-Axle integrates a motor, reduction gearbox, and inverter into a single unit that plays a large part in determining the driving performance and power conversion efficiency of electric vehicles. SiC MOSFETs in particular are expected to improve efficiency even further. ROHM will carry out joint inverter development for e-Axle by participating in a ‘cooperative framework for the electric drive units development and production’ with companies such as Imasen and led by Mazda. At the same time, ROHM will contribute to the creation of compact, high efficiency electrical units by developing and supplying advanced SiC power modules that provide improved performance. Through this collaboration, ROHM will develop even more competitive SiC MOSFETs and modules by working backwards from the finished vehicle to understand the performance and optimal drive method required of power semiconductors. Besides creating value through mutual understanding between car and device manufacturers, the three companies also support technical innovation in the automotive field and contribute to a sustainable society by leveraging extensive knowledge, technologies, and products garnered on a global basis.22.11.2022 08:00:00Novnews_2022-12-01_3.jpg\images\news_2022-12-01_3.jpghttps://www.rohm.com/news-detail?news-title=2022_news_e-axle&defaultGroupId=falserohm.com
electronica 2022 Confirms its Status An excellent mood in 14 halls and intensive discus...11076Event Newselectronica 2022 Confirms its Status An excellent mood in 14 halls and intensive discussions at full trade fair booths: The international electronics industry met again in person from November 15 to 18 at electronica 2022 in Munich. 2,144 exhibitors, 64 percent of whom came from countries outside of Germany, showcased innovations that covered the entire spectrum of electronics to about 70,000 visitors at this world leading trade fair. SEMICON Europa was held in parallel spread over just under one and a half halls. A highly informative supporting program consisting of conferences, forums and special events such as the CEO Roundtable explored the focus topics of the trade fair. The program also served as an opportunity for discussions about current global challenges, including the energy transition, supply chain bottlenecks, the scarcity of raw materials and shortages of skilled workers. “electronica 2022 impressively confirmed its status as world leading trade fair and demonstrated once again that Munich is THE trade fair location for the international electronics industry,” summarizes Dr. Reinhard Pfeiffer, CEO of Messe München. “We are delighted that the number of visitors was only around 14 percent below the record result of 2018, and that the share of international visitors at around 54 percent was even higher than at the previous events—an outstanding result in these times. What’s more, according to the trade fair survey, our exhibitors and visitors were more satisfied with electronica this year than ever before.” The next electronica will take place in Munich from November 12-15, 2024.18.11.2022 12:00:00Novnews_2022-12-01_7.jpg\images\news_2022-12-01_7.jpghttps://electronica.de/en/newsroom/press-material/press-releases/detail/electronica-2022-impressively-confirms-its-status-as-the-worlds-leading-trade-fair-for-electronics.htmlelectronica.de
Hotswap Application Specific MOSFETs Manage In-Rush Currents Nexperia extends its ‘ASFETs for Hotswap and Soft ...11123Product ReleaseHotswap Application Specific MOSFETs Manage In-Rush Currents Nexperia extends its ‘ASFETs for Hotswap and Soft Start’ portfolio with the introduction of ten 25 V and 30 V fully optimized devices, combining enhanced safe operating area (SOA) performance with low RDS(on), making them ideal for use in 12 V hotswap applications including data center servers and communications equipment. For several years, Nexperia has been combining proven MOSFET expertise and broad application understanding to develop ASFETs, devices in which critical MOSFET performance characteristics are enhanced to meet the requirements of particular applications. Since the launch of ASFETs, success has been seen with products optimized for battery isolation, DC motor control, Power-over-Ethernet, automotive airbag applications and more. In-rush currents can present a reliability challenge in hotswap applications. Nexperia, the original pioneer of enhanced SOA MOSFETs, have addressed this concern by designing a portfolio of ‘ASFETs for Hotswap and Soft Start with enhanced SOA’ that are fully optimized for such applications. The PSMNR67-30YLE ASFET delivers 2.2x stronger SOA (12 V @100 mS) than previous technologies while having an RDS(on) (max) as low as 0.7 mO. The Spirito effect (represented by the steeper downward slope found on SOA curves at higher voltages) has been eliminated, while exceptional performance is maintained across the full voltage and temperature range (compared to unoptimized devices).18.11.2022 08:30:00Novnews_2022-12-15_16.jpg\images\news_2022-12-15_16.jpghttps://www.nexperia.com/about/news-events/press-releases/Nexperia-launches-new-hotswap-Application-Specific-MOSFETs--ASFETs--with-double-the-improvement-in-SOA.htmlnexperia.com
Radiation-Hardened ICs Lift Off Onboard Artemis 1 Mission to the MoonRenesas Electronics announced that hundreds of its...11071Industry NewsRadiation-Hardened ICs Lift Off Onboard Artemis 1 Mission to the MoonRenesas Electronics announced that hundreds of its radiation-hardened (rad-hard) integrated circuits (ICs), including over 50 different part numbers, are onboard the Artemis 1 launch that blasted off on November 16. Intersil-brand rad-hard ICs are part of the battery management systems, RS-25 engine control electronics and the launch abort system on the Space Launch System that propelled the mission into space, the most powerful rocket ever built. On the Orion Capsule that will circle the moon, Renesas provided critical components for controller boards, the main flight computer, the docking camera system, the power distribution system and display and panel electronics. The Intersil-brand ICs perform multiple functions, including power management and precision signal processing. Artemis is the ambitious NASA program that will take humankind back to the moon for the first time in more than 50 years. Artemis 1 is sending the test-mannequin populated Orion capsule to orbit the moon and deploy cubesats and other space experiments on a 42-day mission to test all the critical systems. Artemis 2 (2024) will have a crew that will orbit the moon paving the way for Artemis 3 (2025), which will land the first woman and the first person of color on the moon. The plan is for Artemis to continue to build a space station in lunar orbit and a base on the lunar South Pole. This infrastructure will allow for the awe-inspiring goal of a crewed mission to Mars in the 2040s.17.11.2022 07:00:00Novnews_2022-12-01_2.jpg\images\news_2022-12-01_2.jpghttps://www.renesas.com/eu/en/about/press-room/hundreds-renesas-intersil-brand-radiation-hardened-ics-lift-onboard-artemis-1-mission-moonrenesas.com
Long-Reach, Single-Pair Power over Ethernet Solutions Analog Devices announced a Single-pair Power over ...11128Product ReleaseLong-Reach, Single-Pair Power over Ethernet Solutions Analog Devices announced a Single-pair Power over Ethernet (SPoE) Power Sourcing Equipment (PSE) and Power Device (PD) solutions to help customers drive greater levels of intelligence into smart buildings, factory automation, and other applications at the edge of traditional networks. The offerings facilitate powered, last-mile connectivity for factory and building automation through real-time power management, telemetry, extremely low standby power consumption, and ease of installation. Analog Devices’ SPoE solutions, LTC4296-1 and LTC9111, address the challenges of providing power and data to devices, even in remote, difficult to access endpoint locations. Analog Devices’ solutions aim to help new families of endpoint applications to be seamlessly powered and accessed across the network and used to assess local factors such as asset health, environmental conditions, security metrics, and more. The localized awareness and control they offer are the building blocks of the digital buildings of tomorrow. Analog Devices’ SPoE solutions reduce reliance on localized power and batteries by using a single twisted pair of Ethernet cables to provide efficient, reliable, easily installed power at reduced size and weight. Combined with ADI Chronous™ ADIN1100 and ADIN1110 10BASE-T1L, Industrial Ethernet solutions, customers can reliably transfer both power and data over one kilometer – a significant increase from previous Ethernet standards.16.11.2022 13:30:00Novnews_2022-12-15_21.jpg\images\news_2022-12-15_21.jpghttps://www.analog.com/en/about-adi/news-room/press-releases/2022/11-16-2022-adi-announces-worlds-first-long-reach-single-pair-poe-solutions.htmlanalog.com
Industrial Series 60 KW DC Power Supplies and LoadsEA Elektro-Automatik introduces its 60 kW and 30 k...11087Product ReleaseIndustrial Series 60 KW DC Power Supplies and LoadsEA Elektro-Automatik introduces its 60 kW and 30 kW, EA-PU 10000 Programmable DC Power Supplies, EA-PUB 10000 Programmable Bidirectional DC Power Supplies and EA-PUL DC Programmable Regenerative Electronic Loads. Typical applications include electric vehicle battery pack testing, powering furnaces in semiconductor wafer fabrication facilities, electrochemical electrolysis processing, and solar inverter testing. The products, without manual front panel displays, are intended for use in production ATE systems and automated process control systems requiring high power.The 60 kW models output maximum voltages of 360 V to 2000 V and maximum currents of 480 A to 80 A; the 30 kW models output maximum voltages of 60 V to 2000 V and maximum currents of 1000 A to 40 A. Overall, the 60 kW series includes 21 models, and the 30 kW series consists of 29 models allowing engineers to select a model that addresses their specific applications. The increased power capability enables engineers to reduce the number of power instruments needed for a high-power system, saving critical rack space and providing more power in a smaller footprint.15.11.2022 14:30:00Novnews_2022-12-01_18.jpg\images\news_2022-12-01_18.jpghttps://elektroautomatik.com/en/latest-news/ea-elektro-automatik-announces-a-power-density-breakthrough-with-its-new-industrial-series-60-kw-dc-power-supplies-and-loads/elektroautomatik.com
650V GaN HEMTsInnoscience announced a low RDS(on) 650V E-mode Ga...11085Product Release650V GaN HEMTsInnoscience announced a low RDS(on) 650V E-mode GaN HEMT devices. INN650D080BS power transistors have an on-resistance of 80m&#8486; (60m&#8486; typical) in a standard 8x8 DFN package, enabling higher power applications, for example in totem pole LLC architectures or fast battery-chargers. Explains Yi Sun, Sr VP of product development at Innoscience: “We are now able to address high density, high efficiency power conversion applications. Like all our other 650V HEMTs, these new parts are qualified to JEDEC standards for chip and package, and they have also passed DHSOL (Dynamic High Temperature Operating Life) reliability testing according to JEP180 and accelerated life tests up to 1000V give lifetime calculations of 36 years (520V; 150°C; 0.01% failure rate).” Thanks to Innoscience’s innovative strain enhancement layer, InnoGaN devices features low specific RDS(ON) as well as very low dynamic RDS(ON) and excellent reliability. The new 80m&#8486; RDS(on) parts also feature very good drain source voltage transient (VDS, transient) and pulsed (VDS, pulsed) characteristics – 800V and 750V respectively. Moreover, similarly to the other 650V products, the 80m&#8486; RDS(on) devices feature a strong ESD protection circuit embedded in the die to ease mass production assembly of these device in package and easy handling. In this case, however, the ESD circuit has been modified to allow a larger negative gate voltage swing down to -6V. The low RDS(on) INN650D080BS power transistors, which are available in industry-standard 8x8 DFN packages, join previously-announced 140m&#8486;,190m&#8486;, 240m&#8486;, 350 m&#8486;, 500m&#8486; and 600 m&#8486; RDS(on) parts, creating a significant portfolio of available devices, which is continuously expanding towards lower RDS(on) values.15.11.2022 12:30:00Novnews_2022-12-01_16.jpg\images\news_2022-12-01_16.jpghttps://www.innoscience.com/innoscience.com
GaN Technology for High Power Density ApplicationsEPC launches the 80 V, 4 mOhm EPC2619. This is the...11084Product ReleaseGaN Technology for High Power Density ApplicationsEPC launches the 80 V, 4 mOhm EPC2619. This is the lead product for a generation of eGaN devices that have double the power density compared to EPC’s prior-generation products. The EPC2619 has an RDS(on) of just 4 mOhms in a tiny, 1.5 mm x 2.5 mm, footprint. The maximum RDS(on) x Area of the EPC2619 is 15 m?*mm2 – five times smaller than 80 V silicon MOSFETs. This product is designed for a range of motor drive applications. For example: 28 V – 48 V conversion for eBikes, eScooters and power tools; high density DC-DC converters; solar optimizers; and synchronous rectification converting 12 V – 20 V for chargers, adaptors, and TV power supplies. The typical RDS(on) x QGD, which is indicative of power losses in hard-switching applications, is 10 times better than 80 V silicon MOSFETs. This enables switching frequencies that are 10 times higher than silicon MOSFETs and without an efficiency penalty, thus producing the highest power density.  This makes the EPC2619 ideal for high frequency hard-switching 24 V – 48 V applications, such as used in buck, buck-boost, and boost converters. The typical RDS(on) x QOSS, which is indicative of power losses in soft-switching applications, is 87 mOhm*nC, two times better than 80 V silicon MOSFETs. This makes the EPC2619 ideal for soft-switching applications, such as the primary rectification full bridge for LLC-based DCX DC-DC converters.15.11.2022 11:30:00Novnews_2022-12-01_15.jpg\images\news_2022-12-01_15.jpghttps://epc-co.com/epc/events-and-news/news/artmid/1627/articleid/3087/epc-launches-a-new-generation-of-egan-technology-that-doubles-performanceepc-co.com
Advanced Smart Electrical Outlet and ConnectorVoltSafe announced a strategic partnership with Me...11075Industry NewsAdvanced Smart Electrical Outlet and ConnectorVoltSafe announced a strategic partnership with Menlo Microsystems to co-develop an advanced electrical plug technology. Both companies are strong proponents of advancing how the world connects to electricity, and the combination of Menlo Micro’s Ideal Switch technology with VoltSafe’s smart electrical outlet and connector will enable the future of smart power connectivity. Seeing deficiencies in existing relays and switches that caused the products they operated to be bigger, slower, less capable, or more expensive, Menlo Micro set out to create a better solution and developed Ideal Switch. The Ideal Switch is a device that delivers all the benefits of a mechanical relay and a semiconductor switch, with no compromises. The Ideal Switch is tiny, fast, reliable, withstands extreme temperatures, is ultra-low loss and can handle 1,000s of watts. Menlo Micro in March announced its $150 million USD Series C, bringing Menlo Micro’s total cumulative funding to over $225 million USD. Vertical Venture Partners and Tony Fadell’s Future Shape led the round. Menlo’s Micro’s confidence in VoltSafe’s disruptive technology powering the future of how the world connects to electricity, paved the way for this early collaboration. 15.11.2022 11:00:00Novnews_2022-12-01_6.jpg\images\news_2022-12-01_6.jpghttps://menlomicro.com/newsroom/voltsafe-inc-collaborates-with-menlo-micro-to-develop-the-most-advanced-smart-electrical-outlet-and-connectormenlomicro.com
Zero-Voltage-Switching Power-Supply ICsPower Integrations announced the InnoSwitch™4-Pro ...11083Product ReleaseZero-Voltage-Switching Power-Supply ICsPower Integrations announced the InnoSwitch™4-Pro family of digitally controllable, off-line CV/CC Zero Voltage Switching (ZVS) flyback ICs, which substantially reduce the size of power adapters. Incorporating a robust PowiGaN gallium-nitride primary switch and steady-state switching frequency of up to 140 kHz, the highly integrated devices reduce the component count and PCB area required for ultra-compact adapters for cellphone, notebook, tablet and multi-port accessories. “InnoSwitch4-Pro ICs interface seamlessly with Power Integrations’ ClampZero™ family of active clamp ICs to achieve ZVS in both continuous conduction mode (CCM) and discontinuous conduction mode (DCM),” stated Aditya Kulkarni, product marketing manager at Power Integrations. “ZVS, combined with our PowiGaN™ technology, virtually eliminates switching losses. Efficiency exceeds 95 percent, which enables designers to eliminate the heat sinks, spreaders and potting materials typically required for thermal management." Further size reduction of the adapter can be achieved by the use of a MinE-CAP™ device in combination with InnoSwitch4-Pro and ClampZero ICs. Based also on PowiGaN technology, MinE-CAP ICs enable input capacitance size reduction of approximately 40 percent. Capable of delivering up to 220 W, InnoSwitch4-Pro ICs combine a 750 V PowiGaN primary switch, controller, FluxLink™ reinforced isolation feedback link for secondary-side control, I2C interface, active clamp drive and synchronous rectification in a compact InSOP™-28 package. 15.11.2022 10:30:00Novnews_2022-12-01_14.jpg\images\news_2022-12-01_14.jpghttps://investors.power.com/news/news-details/2022/Power-Integrations-Combines-Programmability-High-Efficiency-and-Small-Form-Factor-in-New-Zero-Voltage-Switching-Power-Supply-ICs/default.aspxpower.com
Funding Enables Mass Production of GaN Transistor FamilyCambridge GaN Devices (CGD) has raised $19m in Ser...11073Industry NewsFunding Enables Mass Production of GaN Transistor FamilyCambridge GaN Devices (CGD) has raised $19m in Series B funding. The investment was led by Parkwalk Advisors and BGF, with participation from IQ Capital, CIC, Foresight Williams Technology and Martlet Capital. The investment will enable CGD to begin mass production of its range of GaN transistors for power applications. CGD has already made remarkable progress, developing intellectual property and bringing to market its ICeGaN™ Gallium Nitride transistor family which addresses a $50bn global power semiconductor market. The company is positioned to disrupt multiple industries such as consumer and industrial power supplies, lighting, data centres and automotive HEV/EV. CGD’s technology provides efficient, sustainable, and more cost-effective power solutions for electronic equipment. As a result, CGD has gained global traction and attention at international conferences and in respected press. CGD is currently leading a $10m European-funded project developing GaN-based modules for low and high-power applications (GaNext); is participating in a UK supply chain initiative for PCB-embedded power systems with GaN devices (P3EP) and recently launched a project to develop highly reliable GaN power transistors and ICs to cut data centre emissions (ICeData). CGD is also focused on key partnerships with their customers focused at the datacom and automotive solutions. The company has completed its brand development, moved to new offices, and now employs over 40 staff worldwide, with more planned to support the up scaling.15.11.2022 09:00:00Novnews_2022-12-01_4.jpg\images\news_2022-12-01_4.jpghttps://camgandevices.com/en/p/cambridge-gan-devices-secures-19m-pounds-to-scale-up-for-50bn-pounds-power-semiconductor-device-market/camgandevices.com
MOSFETs with Top-Cool Packagingonsemi announced a series of MOSFET devices that f...11080Product ReleaseMOSFETs with Top-Cool Packagingonsemi announced a series of MOSFET devices that feature top-side cooling to assist designers in challenging automotive applications, especially within motor control and DC/DC conversion. Housed in a TCPAK57 package measuring just 5mm x 7mm, the Top Cool devices feature a 16.5mm2 thermal pad on the top side. This allows heat to be dissipated directly into a heatsink rather than via a typical printed circuit board (PCB). By enabling the use of both sides of the PCB and decreasing the amount of heat going into it, the TCPAK57 provides increased power density. Improved reliability of the new design adds to an overall extended system lifetime. “Cooling is one of the greatest challenges in high power design and successfully addressing it is the key enabler to reducing size and weight, which is critical in modern automotive design,” said Fabio Necco, vice president and general manager, Automotive Power Solutions at onsemi. “With excellent electrical efficiency and having eliminated the PCB from the thermal path, the design is significantly simplified while reducing size and cost.” The devices deliver the electrical efficiency required in high power applications with RDS(ON) values as low as 1m?. Additionally, the gate charge (Qg) is low (65 nC), reducing losses in high-speed switching applications.15.11.2022 07:30:00Novnews_2022-12-01_11.jpg\images\news_2022-12-01_11.jpghttps://www.onsemi.com/company/news-media/press-announcements/en/onsemi-launches-mosfets-with-innovative-top-cool-packagingonsemi.com
PFC and Hybrid Flyback Combo IC for GaN-based USB-C Adapters and ChargersInfineon Technologies introduces the XDP™ digital ...11122Product ReleasePFC and Hybrid Flyback Combo IC for GaN-based USB-C Adapters and ChargersInfineon Technologies introduces the XDP™ digital power XDPS2221, a highly-integrated combo controller IC for USB-PD supports high power designs in wide input and output voltage applications of up to 28 V output voltage. The device integrates an AC-DC power factor correction (PFC) controller with a DC-DC hybrid flyback controller (HFB), also known as asymmetrical half-bridge (AHB), in one single package. Through the harmonized operation of the two stages, regulatory requirements can easily be met. In addition, the further integration of all gate drivers and a 600 V high voltage start-up cell for the initial IC voltage supply and the certified active X-capacitor discharge enable a low external bill of material (BOM) and component count. Based on a novel zero-voltage switching (ZVS) HFB topology in conjunction with GaN-based devices, it brings class-leading efficiency across various line/load conditions. Thanks to these features and inherent topology advantages, such as zero voltage switching and resonant energy transfer for transformer size reduction, system designs using XDPS2221 can achieve very high power densities. Moreover, the combo IC features a synchronous PFC and HFB burst mode operation for the lowest possible no-load input standby power performance. The quasi-resonant multimode PFC stage is enhanced with automatic PFC enable/disable functionality and adaptive PFC bus voltage control to maximize average and light load efficiency. Optionally, the integrated PFC function can also be disabled, to support the use case with any kind of external PFC Controller.15.11.2022 07:30:00Novnews_2022-12-15_15.jpg\images\news_2022-12-15_15.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2022/INFPSS202211-026.htmlinfineon.com
GaN ICs Fast-Charge from 1-50% in Only 7 MinutesNavitas Semiconductor has announced its GaNFast po...11078Industry NewsGaN ICs Fast-Charge from 1-50% in Only 7 MinutesNavitas Semiconductor has announced its GaNFast power ICs have been selected for the ‘in-box’ 125 W charger of Motorola’s latest ?agship smartphone, the X30 Pro. A charge from 1% – 50% in just 7 minutes brings an ultra-fast charging experience to Motorola users. Jin CHEN, General Manager of Smartphone BU, Lenovo China commented on the launch of X30 Pro: “We hope to deliver a more comprehensive user experience in the ?agship X30 Pro. By working hand-in-hand with Navitas and Aohai Technology, we are able to utilize GaN and speed up the charging capability of Motorola’s smartphones to a new level. We look forward to collaborating further with Navitas and Aohai Technology, to break more records in charging speed, and offer a convenient and ultra-fast charging experience to our users.” “We are excited that GaNFast technology empowers Motorola to achieve a more powerful charger. This time, Motorola, Navitas and Aohai Technology’s collaboration reached a benchmark 125 W fast-charging solution on the new X30 Pro.” said Charles (Yingjie) ZHA, VP and GM of Navitas China: “We are dedicated to offer an eco-friendly and ultra-fast charging experience for consumers. This tiny but powerful 125 W GaN charger demonstrates our continued effort to ‘Electrify Our World™’. Navitas will continue to push the innovation of GaN technology to empower Motorola’s charging roadmap.”14.11.2022 14:00:00Novnews_2022-12-01_9.jpg\images\news_2022-12-01_9.jpghttps://navitassemi.com/navitas-powers-motorola-x30-pro-with-new-125-w-ganfast-ultra-fast-charger/navitassemi.com
Simulation Software Technology for PCB Design SolutionsKeysight Technologies announced that Altium LLC re...11077Industry NewsSimulation Software Technology for PCB Design SolutionsKeysight Technologies announced that Altium LLC recently licensed Keysight's advanced electromagnetic simulation technology to develop power analysis solutions for PCB designers. Keysight and Altium are partnering to address the needs of hardware engineers who are not power integrity experts. Reliable power distribution is a pervasive problem facing PCB designers. As integrated circuit (IC) components trend toward lower supply voltages for increased power efficiency, it becomes difficult to design a PCB power plane within shrinking tolerance limits. Designers typically build several iterations of prototypes or submit their designs to power integrity specialists. Both are sub-optimal approaches that hinder rapid design turnaround. By empowering PCB designers to find and fix problems before first prototype, they can achieve higher productivity, faster time-to-market, and greater predictability in the design process. Power Analyzer is the first offering to result from the strategic partnership between Altium and Keysight, providing interactive analysis of power integrity issues. Altium integrated Keysight's EM simulation technology with its modern graphical user interface to make power analysis fast, accurate, and easy to run. PCB designers using Power Analyzer gain insight into their power plane performance through analysis of voltage drop and current density from within their PCB layout environment.14.11.2022 13:00:00Novnews_2022-12-01_8.png\images\news_2022-12-01_8.pnghttps://www.keysight.com/us/en/about/newsroom/news-releases/2022/1114-nr22131-keysight-licenses-simulation-software-technology-to.htmlkeysight.com
Memorandum of Understanding on Multi-Year Delivery of Silicon Carbide ChipsInfineon Technologies and the automaker Stellantis...11115Industry NewsMemorandum of Understanding on Multi-Year Delivery of Silicon Carbide ChipsInfineon Technologies and the automaker Stellantis have signed a non-binding Memorandum of Understanding as a first step towards a potential multi-year supply cooperation for silicon carbide (SiC) semiconductors. Infineon would reserve manufacturing capacity and supply CoolSiC™ “bare die” chips in the second half of the decade to the direct Tier 1 suppliers of Stellantis. The potential sourcing volume and capacity reservation have a value of significantly more than €1 billion. “We firmly believe in electromobility and are excited to develop partnerships with leading automotive companies like Stellantis that make it a part of people’s everyday life,” said Peter Schiefer, Division President Automotive of Infineon. “Compared to traditional power technologies, silicon carbide increases the range, efficiency and performance of electric vehicles. With our leading CoolSiC™ technology and continuous investments in our manufacturing capacities, we are well positioned to meet the growing demand for power electronics in electromobility.” Infineon and Stellantis are in talks about delivering the CoolSiC Gen2p 1200 V and CoolSiC Gen2p 750 V chips for electric vehicles under Stellantis brands. The unmatched performance, reliability, and quality of CoolSiC technology would allow Stellantis to build vehicles with longer ranges and lower consumption for the best user experience – and support the company in its efforts to standardize, simplify and modernize platforms.14.11.2022 13:00:00Novnews_2022-12-15_8.jpg\images\news_2022-12-15_8.jpghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2022/INFXX202211-024.htmlinfineon.com
Hot-Swap Controller with Programmable Digital SOA ControlInfineon Technologies introduces the XDP™ XDP710 d...11082Product ReleaseHot-Swap Controller with Programmable Digital SOA ControlInfineon Technologies introduces the XDP™ XDP710 digital controller, the first member of its intelligent hot-swap controller and protection IC family. The hot-swap and system monitoring controller IC has a 5.5 V to 80 V input voltage range with transients up to 100 V for 500 ms. It consists of three functional blocks. The first is the high-precision telemetry and digital safe operating area (SOA) control block, optimized to meet Infineon’s power MOSFETs characteristics. The second is the system resources and management block, and the third is the integrated gate driver and charge pump block for n-channel power MOSFETs such as OptiMOS™ and StrongIRFET™ families. “Infineon Technologies’ XDP710 Digital hot-swap controller met HGX Platform product requirement well. Like its unique features such as option of external FET selection using resistor strapping and boost mode. It helps that XDP710 come in small package, easy to design in” said Abhijit Datta, Sr. Power Architect and Subject Matter Expert at NVIDIA. “The XDP710 hot-swap controller is a feature-rich device with high-precision analog-front-end along with comprehensive health monitoring, telemetry, programmability, and pre-set MOSFET SOA. It addresses the challenges associated with the current design of pluggable AI server solutions,” said Shahram Mehraban, Vice President Power Management ICs at Infineon’s Power & Sensor Systems Division.14.11.2022 09:30:00Novnews_2022-12-01_13.jpg\images\news_2022-12-01_13.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2022/INFPSS202211-023.htmlinfineon.com
DC/DC Converters for E-MobilityIt is safe to say we are all feeling the wave of d...11081Product ReleaseDC/DC Converters for E-MobilityIt is safe to say we are all feeling the wave of demand for electric vehicles, charging stations, and the required support infrastructure which are becoming ever more powerful, faster, and more compact. Consequently, more power in a smaller space is required for the operation of the electronics. Compact, highly efficient, reliable and, above all, robust DC/DC converters are required to meet these high demands of e-mobility applications. These converters must be able to withstand extreme and fluctuating temperatures and function reliably in harsh environments for years. With more than two decades of experience in railroad technology, Traco Power has set the goal of bringing robust DC/DC converters with high efficiency and power density to the market, especially suited for applications in electromobility. The range of Traco Power DC/DC converters for e-mobility includes models from 1- 300 Watts. These models are available in various mechanical types such as DIN-Rail, Chassis mount and PCB mountable DIP, SIP and SMD packages and are ideal for e-mobility applications. Traco Power products are carefully designed and fully compliant with the latest Railway, Industrial and Information Technology standards.14.11.2022 08:30:00Novnews_2022-12-01_12.jpg\images\news_2022-12-01_12.jpghttps://www.tracopower.com/de/traco-powers-dcdc-converters-e-mobilitytracopower.com
Product Distribution Center in FrankfurtTexas Instruments announced plans to open a produc...11070Industry NewsProduct Distribution Center in FrankfurtTexas Instruments announced plans to open a product distribution center (PDC) in Frankfurt, Germany, by the end of 2024. The PDC will expand the company’s European footprint and enable faster deliveries to TI’s growing customer base there. “We are excited to expand our European presence in Frankfurt, as it offers a centralized location with proximity to key customers and our company’s European headquarters in Freising, Germany,” said Stefan Bruder, president of Texas Instruments Europe. “Frankfurt’s key role as a logistics hub will mean faster deliveries to our European customers who are moving quickly to bring leading-edge products to the market.” This Frankfurt location, near many of TI’s industrial and automotive customers, will enable same-day delivery in central Germany and next-day delivery capabilities to most European-based customers. The Frankfurt site will pack and ship a broad range of TI technologies to support customers across Europe. “Expanding in Frankfurt is a logical extension of TI’s presence in Europe and an important investment in our customers, providing them with even better service and support for decades to come,” Bruder said.14.11.2022 06:00:00Novnews_2022-12-01_1.jpg\images\news_2022-12-01_1.jpghttps://www.ti.com/ti.com
Collaboration to Expand Market for GaN Power ICsNavitas Semiconductor and Avnet Silica announced c...10082Industry NewsCollaboration to Expand Market for GaN Power ICsNavitas Semiconductor and Avnet Silica announced close cooperation between the two companies to grow the market in Europe for Navitas' GaNFast power ICs with GaNSense technology. The two companies will work closely together to deliver their combined complementary knowhow to bring a high level of support and expertise to customers across the EMEA region. "Navitas' unique GaN technology and its world-renowned monolithically integrated gate driver and feature set will significantly expand our 'SILICA' wide-band-gap semiconductor portfolio," said Gilles Beltran, President Avnet Silica. "Navitas has a depth of expertise in power semiconductors that is unrivalled across the industry for this kind of advanced technology. We envisage this cooperation will bring huge benefits for customers operating at the cutting edge of power system architectures in a wide selection of applications." "We chose to work with Avnet Silica as one of the premier experts in semiconductor distribution in Europe," said David Carroll, Senior Vice President of Worldwide Sales at Navitas. "The combination of our highly differentiated solutions together with Avnet Silica's expertise in technology markets will further support designers and engineers to meet ever more stringent efficiency and size requirements and regulations. With our highly experienced technical team and our European applications lab, together, we can support customers with the best possible solutions and fastest time-to-market."11.11.2022 18:00:00Novnews_2022-11-15_13.jpg\images\news_2022-11-15_13.jpghttps://navitassemi.com/navitas-semiconductor-and-avnet-silica-announce-agreement-for-close-collaboration-to-expand-market-for-advanced-gan-power-ics/navitassemi.com