Bodo's News

Read through my personal pick of news around people, our industry, important events and interesting product releases. Or click on a filter and pick your area of interest!

 

Strategic Current Sensor Chip Supplier
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Learn more:
melexis.com
  • Industry News
  • 2024-06-06

EV manufacturer NIO selected Melexis' current sensor chips for their traction inverter systems. Melexis' chips will power all of NIO's battery electric vehicles (BEVs). Through this collaboration, NIO will use from Melexis' current sensor technology, enhancing the efficiency and reliability of their traction inverter systems. Additionally, Melexis provides local support with dedicated engineers to ensure seamless integration and optimization. Dieter Verstreken, VP of China Strategy at Melexis, commented, "We are delighted to collaborate with NIO, a company known for its innovation and leadership. Our current sensor ICs, coupled with the expertise of our dedicated local engineers, will provide NIO with the support they need to achieve success in the electric vehicle market. We look forward to collaborating with NIO on future projects to advance electric vehicle technology."

Renewal of Cooperation Agreement for Packaging Technology
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Learn more:
vincotech.com
  • Industry News
  • 2024-06-06

Vincotech has renewed its cooperation agreement with Semikron Danfoss. The two enterprise's alliance, which dates back to 2003, has been extended to further strengthen MiniSKiiP® package technology. Multiple source options for the package to further mitigate the supply chain risk, and standards-compliant design are just a few of the benefits of this renewed cooperation agreement. Featuring service-friendly spring contacts, MiniSKiiP's unique hardware is in mass production for use in motor drives, servo drives, and power supplies. Vincotech and Semikron Danfoss are now set to take MiniSKiiP's reliability and standardization to the next level. Customers can look forward this tech bringing even greater robustness, versatility, and compatibility for their power electronics solutions.

Online Custom Magnetics Design House launches global Production Service
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Learn more:
frenetic.ai
  • Industry News
  • 2024-06-06

Frenetic Electronics announced Frenetic Factory, a worldwide magnetics production facility with plants in the USA, Mexico, Europe, India, and China. Frenetic Factory can deliver samples quickly with no MOQs. It currently has a production capacity of 8.75M units annually, that can be scaled to even higher volumes fast. Frenetic launched its magnetics design service in 2021. Using an online process and Core Optimizer tool to make the core selection process faster and more efficient, users input their electrical and environmental specifications, and receive an optimized transformer design in minutes by using Frenetic's custom algorithms. The company's web-based platform allows users to compare millions of different magnetics possibilities within seconds. BOMs, 3D models and engineering drawings are automatically generated. Now, users can take that design and have samples and full production quantities made at Frenetic Factory. Frenetic Factory comprises facilities around the world that are both owned by Frenetic Magnetics or a qualified third party. This is the same operational model as much of the rest of the electronic components industry. And Frenetic Factory is fully responsible for the technical support and quality of the components it supplies, no matter which facility they were produced in. Manufacturing quality and product standards adhered to include MIL-STD-461E, MIL-STD-981, ESCC 3201 and Qualified Parts, and AEC-Q200.

CoolGaN™ bidirectional Switch and CoolGaN Smart Sense
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Learn more:
infineon.com
  • Product Release
  • 2024-06-05

Infineon Technologies announced two CoolGaN™ product technologies, CoolGaN bidirectional switch (BDS) and CoolGaN Smart Sense. CoolGaN BDS is said to provide "exceptional soft- and hard-switching behavior", with bidirectional switches available at 40 V, 650 V and 850 V. Target applications of this family include mobile device USB ports, battery management systems, inverters, and rectifiers. The CoolGaN Smart Sense products feature lossless current sensing, simplifying design and further reducing power losses, as well as transistor switch functions integrated into one package. They are ideal for usage in consumer USB-C chargers and adapters. The CoolGaN BDS high voltage feature a true normally-off monolithic bi-directional switch with four modes of operation. Based on the gate injection transistor (GIT) technology, the devices have two separate gates with substrate terminal and independent isolated control. The devices are suited for back-to-back switches in single-phase H4 PFC and HERIC inverters and three-phase Vienna rectifiers as well as for single-stage AC power conversion in AC/DC or DC/AC topologies. The CoolGaN BDS 40 V is a normally-off, monolithic bi-directional switch based on Infineon's in-house Schottky Gate GaN technology. It can block voltages in both directions, and through a single-gate and common-source design, it is optimized to replace back-to-back MOSFETs used as disconnect switches in battery-powered consumer products.

Collaboration on SiC-Based Traction Inverters for Electric Vehicle Powertrains
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Learn more:
nxp.com
  • Industry News
  • 2024-06-04

NXP Semiconductors announced a collaboration with automotive tier-1 ZF Friedrichshafen on SiC-based traction inverter solutions for electric vehicles. Using NXP's GD316x high-voltage (HV) isolated gate drivers, the solutions are designed to accelerate the adoption of 800-V and SiC power devices. Safe, efficient and higher performance traction inverters enabled by the GD316x product family can be designed to extend EV range and reduce the number of charging stops while lowering system level costs for OEMs. As traction inverters now migrate to SiC-based designs, the SiC power devices need to be paired with HV isolated gate drivers to harness the advantages such as higher switching frequency, lower conduction losses, better thermal characteristics and higher robustness at high voltages, compared to previous generation silicon-based IGBT and MOSFET power switches. The GD316x family of functionally safe, isolated, high voltage gate drivers incorporates a number of programmable control, diagnostic, monitoring, and protection features, enhanced to drive the latest SiC power modules for automotive traction inverter applications. Its high level of integration allows a smaller footprint and simplifies the system design. The capabilities reduce Electromagnetic Compatibility (EMC) noise while also reducing switching energy losses for better efficiency.

The first fully integrated SiC Facility in Italy
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Learn more:
st.com
  • Industry News
  • 2024-05-31

STMicroelectronics intends to build a high-volume 200mm silicon carbide manufacturing facility for power devices and modules, as well as test and packaging, to be built in Catania, Italy. Combined with the SiC substrate manufacturing facility being readied on the same site, these facilities will form ST's Silicon Carbide Campus. The Silicon Carbide Campus will serve as the center of ST's global SiC ecosystem, integrating all steps in the production flow, including SiC substrate development, epitaxial growth processes, 200mm front-end wafer fabrication and module back-end assembly, as well as process R&D, product design, advanced R&D labs for dies, power systems and modules, and full packaging capabilities. This will achieve a first of a kind in Europe for the mass production of 200 mm SiC wafers with each step of the process – substrate, epitaxy & front-end, and back-end – using 200 mm technologies for enhanced yields and performances. The facility is targeted to start production in 2026 and to ramp to full capacity by 2033, with up to 15,000 wafers per week at full build-out. The total investment is expected to be around five billion euros, with a support of around two billion euros provided by the State of Italy within the framework of the EU Chips Act.

LDO for ultra-miniature Applications
  • Product Release
  • 2024-05-30

Toshiba Electronics has released of a series of low-dropout (LDO) voltage regulators in their ultra-miniature DFN4D package type. Specifically aimed at miniature applications powered by small-scale batteries, the family of devices reduces power consumption, thereby elongating the usable lifetime. With demand for battery powered IoT equipment/modules, communications modules, wearable devices, and other miniature equipment increasing, the LDO regulators of the TCR3LM series offer a line-up of over thirty devices spanning the voltage range 0.8 V DC to 5.0 V DC with an input voltage in the range 1.4 V DC to 5.5 V DC. Each device is capable of delivering up to 300 mA of output current. The TCR3LM offers a typical dropout voltage of 137mV. As the output voltage can be achieved with a lower input voltage, battery drain is reduced. Additionally, the load transient response has been improved, enhancing the output stability when the load fluctuates. The solution is housed in a DFN4D package measuring 1.0 mm × 1.0 mm × 0.37 mm. Furthermore, as small ceramic capacitors can be used on the input and output, the overall solution size is further reduced.

Building Permit for final Construction Phase of Smart Power Fab in Dresden
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Learn more:
infineon.com
  • Industry News
  • 2024-05-30

Infineon Technologies is on schedule with the construction of the Smart Power Fab in Dresden and is initiating the final construction phase. During a visit, the Prime Minister of the Free State of Saxony, Michael Kretschmer, officially handed over the last outstanding building permit for the new fab issued by the State Directorate of Saxony. The excavation of the building pit has now been completed. The shell and building construction are currently progressing on the concrete foundation, which is up to two meters thick. Infineon officially broke ground for the new plant in Dresden in May 2023. Manufacturing is scheduled to start in 2026. With a total investment of five billion euros, the company is making a significant contribution to the European Commission goal to increase the EU's share of global semiconductor production to 20 percent by 2030. Infineon is aiming for public funding of around one billion euros. On average, construction workers have removed around 8,000 tons of soil every day since the start of work. A total of 450,000 cubic meters of excavated soil has been produced, which corresponds to the volume of 180 Olympic swimming pools.

MoU for GaN Semiconductors
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Learn more:
camgandevices.com
  • Industry News
  • 2024-05-30

The fabless semiconductor company Cambridge GaN Devices (CGD) has signed a Memorandum of Understanding (MoU) with Industrial Technology Research Institute (ITRI) of Taiwan to solidify a partnership in developing high performance GaN solutions for USB-PD adaptors. The MoU also covers the sharing of domestic and international market information, joint visits to potential customers and promotion. CGD's IC-enhanced GaN – ICeGaN – is a novel platform that improves ease-of-use, facilitates smart temperature control and enhances gate reliability. The first commercialized product in the market to adopt GaN devices has been USB-PD adaptors, and it is this market that the first designs from the partnership will address. Specifically, the agreement covers the development of power solutions in the 140-240 W range with power densities exceeding 30 W/in3 for e-mobility, power tools, notebook and cell phone applications.

Gain Pre-Driver for 5G mMIMO
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Learn more:
qorvo.com
  • Product Release
  • 2024-05-29

Qorvo announced "the industry's highest gain pre-driver providing 39 dB gain at 3.5 GHz and achieving a peak power of +29 dBm". This MIMO (mMIMO) pre-driver dubbed QPA9822 is a wideband, high gain, high linearity driver amplifier, engineered specifically for 32-node mMIMO systems. It is designed to enable wideband 5G New Radio (NR) instantaneous signal bandwidths of up to 530 MHz, making it ideally suited for the N77 band critical for 5G deployment and other mMIMO applications.

Evaluation Modules with Integrated Buck Converters
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Learn more:
recom-power.com
  • Product Release
  • 2024-05-29

Evaluation of Recom's range of integrated buck regulators is now made easier with the new EVMs. Suiting models in the Recom RPL, RPH, and RPZ range with current ratings from 0.5 A to 20 A, the evaluation modules provide a way to characterize the converter performance in a realistic environment, both thermally and electrically. Filters are included to demonstrate compliance with EMI 'Class B' levels and all functions available in each converter can be exercised, e. g. output voltage selection and trim, remote sensing, on/off control, switching frequency selection, soft start, input under-voltage lock-out, and Power Good signaling. As the EVMs are designed to provide typical application heatsinking, the buck converters can be operated and evaluated at full load, and behavior is investigated under overload and overtemperature conditions. Alternate component positions are also included to allow experimentation to tailor EMC performance to the application and budget. The RPL, RPH, and RPZ products are a range of cost-effective integrated buck converters in QFN and LGA packages featuring advanced thermal and electrical design. The modules all have integrated inductors and feature a miniature footprint and profile down to 1.6 mm.

Rugged 500 W AC/DC Power Supplies utilizing Conduction Cooling for harsh Environments
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Learn more:
pduke.com
  • Product Release
  • 2024-05-29

P-DUKE has launched its XTBF500 AC/DC power supply series, available in open frame or enclosed form. The XTBF500 integrates the TBF500 full brick 500 W AC/DC power supply and its peripheral circuits, such as EMC filters, start-up current limiters, large capacity capacitors, and aluminum substrates, to achieve the concept of "easy to use." The XTBF500 series features a universal input voltage range of 85-264 VAC. The output voltage is 12, 15, 24, 28, 48, and 54 VDC, adjustable within a range of +10%/-10% via potentiometer. It also features slope current sharing to provide over 500 W of power by paralleling multiple modules, as well as complete protection functions, including overcurrent protection (hiccup mode), short circuit protection (auto-recovery), and output overvoltage protection (latch). XTBF500 has integrated all peripheral devices together to combine the advantages of a full brick module and a complete AC/DC power supply, in compliance with EMC standard EN/IEC 50032 Class B (CE Class B, RE Class A), start-up inrush current limiter function, and OVC III (overvoltage category). By conducting cooling on the system chassis, it can operate at full load up to 40 degrees to cope with harsh applications and demanding environments. The XTBF500 is designed for challenging operating conditions and is suited for various applications such as 5G communication, ESS, defense, robotics, and factory automation.

Coreless High Current Sensors
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Learn more:
lem.com
  • Product Release
  • 2024-05-29

Capable of measuring high DC currents from 2 kA up to 42 kA without surge current limitations, the Open Loop Coreless Integral (OLCI) sensors from LEM feature a large aperture for accurate measuring of high currents on large busbars, with up to 1 MHz bandwidth for high frequency applications. They are also significantly lighter (80%) and more cost effective than open loop or closed loop current transducers operating within the same current measuring range. Two versions of the OLCI high current sensors are available from LEM – the FRS model supporting primary busbar apertures of 104 mm x 22 mm and the FL for apertures up to 300 mm x 100 mm. Because it is a split transducer, the FL can be opened and attached directly anywhere on the busbar without the need to open the busbar, making it easy to install and maintain. With no magnetic core, no secondary copper winding, an integrated Rogowski coil and an array of Hall elements, the FRS sensor slashes raw material costs and reduces power losses. Equally suited to trackside and onboard traction applications in the railway industry as they are for high power wind turbines and hydrogen electrolysers, the sensors can also be used on industrial low-voltage and medium-voltage variable frequency drives, in induction welding applications, and for DC grid monitoring.

Expanded Range of Power Inductors
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Learn more:
we-online.com
  • Product Release
  • 2024-05-28

In addition to Würth Elektronik's five existing package sizes of WE-XHMI SMT power inductors there are now eight more packages. These compact yet very efficient inductors feature a current capacity up to 56 A saturation current and the ability to handle high transient current spikes. This makes them particularly suitable for use as DC/DC converters in power supplies, point-of-load converters and high-current filters, as well as in industrial computers, mainboards and graphics cards. The molded flat wire inductor, previously only available in the Power Magnetics product family, now also comes in 4020, 4030, 4040, 5020, 5030, 5050, 7030 and 7070 package sizes. The series is also available in smaller packages, and the 70xx sizes close a gap in the existing portfolio. The AEC-Q200-qualified WE-XHMI series inductors can be used at operating temperatures from -40 °C to +125 °C and cover an inductance range from 0.15 to 33 µH with currents up to 56 A.

IEDM: Call for Papers
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Learn more:
ieee-iedm.org
  • Event News
  • 2024-05-28

Under the theme "Shaping Tomorrow's Semiconductor Technology," the 70th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development. The 2024 IEEE IEDM will take place December 7-11, 2024 at the Hilton San Francisco Union Square hotel, with on-demand access to recorded presentations after the event. The paper submission deadline is Thursday, July 11, 2024. Authors are asked to submit four-page papers electronically in IEEE Xplore-compatible PDF format. Accepted papers will be published as-is in the proceedings. A few late-news papers also will be accepted, covering only the most recent, most noteworthy developments. The late-news submission deadline is August 19, 2024. The IEEE IEDM is the premier forum for technological breakthroughs in semiconductor and related device technology, manufacturing, design, physics, and modeling. Each year, the world's leading technologists gather to participate in a technical program of more than 220 presentations, panels, focus sessions, tutorials, Short Courses, supplier exhibits, IEEE/EDS award presentations, and other events highlighting the industry's best work. In the power sector IEDM will put special emphasis e. g. on "Emerging Power Electronic Devices and Integration for a Sustainable Society", "Novel materials and innovative applications for next-generation devices" and "Advanced packaging, and package-device level interactions".

Roadmap for Power Supply Units in AI Data Centers
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Learn more:
infineon.com
  • Industry News
  • 2024-05-24

The influence of artificial intelligence (AI) is driving up the energy demand of data centers across the globe. This growing demand underscores the need for efficient and reliable energy supply for servers. Infineon Technologies opens a new chapter in the energy supply domain for AI systems and unveils a roadmap of energy efficient power supply units (PSU) specifically designed to address the current and future energy need of AI data centers. By introducing unprecedented PSU performance classes, Infineon enables cloud data center and AI server operators to reduce their energy consumption for system cooling. The innovative PSUs reduce power consumption and CO 2 emissions, resulting in lower lifetime operating costs. The powerful PSUs are not only used in future data centers but can also replace existing power supply units in servers and increase efficiency. In addition to the current PSUs with an output of 3 kW and 3.3 kW available today, the new 8 kW and 12 kW PSUs will contribute to further increasing energy efficiency in future AI data centers.

Half-Bridge MOSFET for DC-DC Applications
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Learn more:
aosmd.com
  • Product Release
  • 2024-05-23

Alpha and Omega Semiconductor introduced its AONG36322 XSPairFET designed for space-constrained DC-DC applications. The device features two 30V MOSFETs in a half-bridge configuration where the high-side and the low-side MOSFETs are in an asymmetric DFN3.5x5 XSPairFET package. This design allows the AONG36322 to replace an existing DFN5x6 asymmetric half-bridge MOSFET with an approximate 60 percent space-saving solution, thereby reducing the PCB footprint to further streamline the DC-DC architecture, resulting in a more efficient design. These benefits make the AONG36322 ideal for a new generation of smaller DC-DC buck converters in more compact applications such as point-of-load (POL) computing, USB hubs, and power banks. The AONG36322 is an extension to the AOS XSPairFET lineup, designed with the latest bottom-source packaging technology. Its integrated high-side and low-side MOSFETs feature 4.5 mOhms and 1.3 mOhms maximum on-resistance, respectively, where the low-side MOSFET source is connected directly to the exposed pad on the PCB to enhance thermal dissipation. A definite advantage of the state-of-the-art AONG36322 package design is that it delivers lower parasitic inductance, significantly reducing switch node ringing.

Preferred Partner of Semiconductor Manufacturer
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Learn more:
we-online.com
  • Industry News
  • 2024-05-23

Würth Elektronik is now a preferred partner at Renesas. By partnering with Renesas as a preferred partner, Würth Elektronik gains access to a host of resources and support to further enhance its capabilities in delivering innovative solutions, as well as joint solution options shown at tradeshows, webinars, seminars, and blog articles. This partnership also signifies Würth Elektronik's dedication to reducing development risks and accelerating time-to-market for customers by leveraging Renesas' extensive portfolio of products and solutions. Renesas preferred partners are elite system solution providers renowned for their expertise in deploying Renesas products to deliver highly optimized solutions. These partners undergo rigorous training and boast extensive experience, ensuring they can effectively leverage Renesas technologies to meet diverse customer needs. Renesas' preferred partners play a crucial role in bringing value-added solutions to customers, whether in the early stages of prototyping, sample and technical support, or advancing towards productization based on proof of concepts (PoCs) from Renesas or its partners. This collaboration ensures that customers benefit from optimized solutions that meet the relevant standards of quality and performance.

Opening of Manufacturing Plant in Mexico
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Learn more:
littelfuse.com
  • Industry News
  • 2024-05-23

Littelfuse held a ribbon-cutting ceremony to celebrate the opening of a new manufacturing plant in Piedras Negras, Coahuila, Mexico. The newly opened and operational 10,000-square-metre facility, which doubles the current local Littelfuse manufacturing capacity while maintaining room for additional expansion, is located close to three other company operations in the city. The facility's innovative automation systems ensure precision and efficiency, allowing for a high degree of customization to meet specific client needs. The purpose-built facility utilizes water treatment processes resulting in zero water consumption. The smart air compressors, high-efficiency HVAC, safety relays, and use of LED lighting throughout the facility deliver energy effectively and efficiently. The manufacturing operations team of 1,000 employees is being staffed from a combination of current talent from nearby Littelfuse locations and new hires. The facility is fully accessible, convenient to public transportation and daycare, and will bring increased opportunities for career development and community outreach and support.

Tradeshow emphasizes Smart Energy Solutions
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Learn more:
electronica.de
  • Event News
  • 2024-05-23

As electronics is a key factor in the energy transition and development of smart energy solutions, smart energy will be a key topic at electronica 2024, which will take place from November 12 to 15 in Munich, Germany. According to a report by MarketsandMarkets, the global market for smart energy is expected to grow from 170 billion US dollars in 2022 to 283 billion US dollars by 2027, which is equivalent to a compound annual growth rate (CAGR) of 10.6%. The main driver of this growth is the increasing demand for intelligent power grids, known as smart grids. At electronica 2024, which is all about the all-electric society, the topic of smart energy will play a correspondingly important role, whether at the trade fair stands or in the conference and forum program. The Power Electronics Forum in Hall A5, for example, will look at the entire spectrum of power electronics. Here, experts will discuss current trends and developments that are of crucial importance for the energy transition and for implementing the all-electric society. Hall A4 will be all about innovations in transformers, power supplies, power supply units and batteries. In Halls B4, B5, C3, C4 and C5, numerous exhibitors will be presenting their latest products and solutions relating to semiconductors, while embedded systems can be found in Hall B4.

AC/DC Power Supplies for AGV/AMR Battery Charging Stations
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Learn more:
ttieurope.com
  • Product Release
  • 2024-05-22

TTI – Europe is supporting the design and development of charging stations for industrial and service mobile robots with Advanced Energy's Artesyn™ LCM series of single-output AC-DC power supplies. These robust and reliable units are tailored for fast and efficient charging of Automated Guided Vehicles (AGV) and Autonomous Mobile Robots (AMR) batteries in charging stations. Within the LCM series there are five variants, ranging from 300 Watts to 3000 Watts. They offer a typical full-load efficiency of up to 93%, thereby reducing operating costs and improving thermal performance. Many models within this series do not require derating at low-line. The single output front-end units accept operating inputs between 90Vac and 264Vac for global use, and a wider 85Vac to 264Vac input range for the LCM300 & LCM600 series. The LCM series is available with output voltages of 12V, 15V, 24V, 36V and 48V – the LCM1500 series is offered with an additional 28V output, with 18V and 72V for the LCM3000 series. All outputs are adjustable to a percentage of their nominal value, which means that any output voltage between 9.6 and 57.6V is available to accommodate non-standard system voltages. In addition, the ability to share current allows multiple power supplies to be connected in parallel for higher power applications.

Cooperation to offer SmartSiC
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Learn more:
xfab.com
  • Industry News
  • 2024-05-22

X-FAB and Soitec will begin work to offer Soitec's SmartSiC™ wafers for the production of silicon carbide power devices at X-FAB's plant in Lubbock, Texas. This collaboration follows the successful completion of the assessment phase, during which silicon carbide (SiC) power devices were manufactured at X-FAB Texas on 150mm SmartSiC wafers. Soitec will offer X-FAB's customers easy access to the SmartSiC substrate through a joint supply chain consignment model. SmartSiC is a proprietary Soitec technology based on the company's SmartCut™ process, in which a thin layer of a high-quality monocrystalline (mono-SiC) 'donor' wafer is split off and bonded to a low resistivity polycrystalline (poly-SiC) 'handle' wafer. The resulting substrate offers improved device performance and manufacturing yields. The process allows multiple re-uses of a single donor wafer, significantly reducing cost and related CO2 emissions.

Demonstration Board kickstarts dual-motor Designs for Industrial and Consumer Products
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Learn more:
st.com
  • Product Release
  • 2024-05-22

STMicroelectronics' EVSPIN32G4-DUAL demonstration board controls two motors from a single STSPIN32G4 integrated driver, accelerating product development and simplifying the PCB design and bill of materials. The demonstration board leverages an advanced three-phase gate driver integrated in the STSPIN32G4 and an additional STDRIVE101 gate driver to control two three-phase inverters delivering up to 10A with a maximum supply voltage of 74V. Both gate drivers have their own bootstrap circuitry and safety features including drain-source voltage monitoring, cross-conduction prevention, several thermal protection mechanisms, and under-voltage lockout (UVLO). EVSPIN32G4-DUAL also leverages the STSPIN32G4's built-in power-management circuitry, permitting a compact design with a low BOM that is easy to procure and permits rapid assembly in production. The power management includes a programmable buck converter for gate drivers VCC supply, a low-dropout linear regulator, and a special regulator with low quiescent current to supply the MCU during standby.

GaN System-in-Package Targeting Rapid Consumer Device Charging
  • Product Release
  • 2024-05-22

Wise-integration and Leadtrend Technology Corporation announced the release of a GaN system-in-package (SiP) supporting consumer electronics applications. Their collaboration's targeted application is a 65-watt USB PD adapter for high-speed charging of smartphones, laptops and other devices. The LD966LGQALVE High Voltage Multi-Mode PWM Controller of Flyback with GaN integrated includes Leadtrend's silicon die flyback controller and Wise-integration's 650V e-mode gallium-nitride (GaN) transistor die in a SiP. The SiP has passed 1,000 hours of operating life tests (OLT). The LD966L is green-mode PWMIC built-in with brown-in/out functions of a QFN8X8 package. It minimizes the component count, circuit space, and reduces overall material cost for the power applications. It features HV start, green-mode power-saving operation, soft-start functions to minimize power loss and enhance system performance. The LD966LGQALVE Evaluation Board features an overall peak efficiency of 93.02% and a power density of 22.7 W/in3.  

Support for 300mm Smart Power Process
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Learn more:
ipms.fraunhofer.de
  • Industry News
  • 2024-05-21

In a joint development project spanning around one year, important progress was made in the production of "Smart power technologies". Fraunhofer IPMS provided significant support to the semiconductor manufacturer Infineon by supplying selected process modules within the entire CMOS process value chain on 300 mm wafers. The collaboration played a key role in the process development for the factory expansion at Infineon Dresden. Over 2000 wafers were successfully processed as part of this collaboration. The wafers were exchanged several times between Fraunhofer IPMS and Infineon Dresden to ensure optimal use of resources and optimum integration into the production lines. The teams are now well attuned to each other. The cooperation was always focused on achieving results, and the colleagues at Infineon were very accommodating towards Fraunhofer's ideas. With the construction of the new Smart Power Fab, Infineon is making one of the largest single investments in its history. The aim of the semiconductor manufacturer is to increase the speed at which it expands its semiconductor production capacities and to further strengthen Europe as a chip manufacturing location. This is an important contribution to meeting the growing global demand for semiconductors - for example for applications to generate renewable energy, for use in data centers and for electromobility.

1200 V SiC MOSFETs in SMD Packaging
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Learn more:
nexperia.com
  • Product Release
  • 2024-05-21

Nexperia announced that it is now offering its 1200 V silicon carbide (SiC) MOSFETs in D²PAK-7 surface mount device (SMD) packaging, with a choice of 30, 40, 60, and 80 mΩ RDSon values. This announcement follows on from Nexperia's late-2023 release of two discrete SiC MOSFETs in 3 and 4-pin TO-247 packaging and is the latest offering in a series which will see its SiC MOSFET portfolio swiftly expand to include devices with RDSon values of 17, 30, 40, 60 and 80 mΩ in flexible package options. With the release of the NSF0xx120D7A0, Nexperia is addressing the growing market demand for high performance SiC switches in SMD packages like D2PAK-7, which is becoming increasingly popular in various industrial applications including electric vehicle (EV) charging (charge pile, offboard charging), uninterruptible power supplies (UPS) and inverters for solar and energy storage systems (ESS). It is also further testimony to Nexperia's successful strategic partnership with Mitsubishi Electric Corporation (MELCO), which has seen the two companies join forces to push the energy efficiency and electrical performance of SiC wide bandgap semiconductors to the next level, while additionally future-proofing production capacity for this technology in response to ever growing market demand.

Single-Board Plug-and-Play Gate Drivers
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Learn more:
power.com
  • Product Release
  • 2024-05-21

Power Integrations launched the SCALE-iFlex™ XLT family of dual-channel plug-and-play gate drivers for operation of single LV100 (Mitsubishi), XHP™ 2 (Infineon), HPnC (Fuji) and equivalent semiconductor modules up to 2300 V blocking voltage for wind, energy storage and solar renewable energy installations. This single-board driver enables active thermal management of inverter modules for improved system utilization and reduces the bill-of-material count for increased reliability. This compact SCALE-iFlex XLT gate drivers fit inside the outline of the module, allowing the drivers to be mounted on the module, which gives converter system designers a high degree of mechanical design freedom. SCALE-iFlex XLT dual-channel gate drivers feature Negative Temperature Coefficient (NTC) data reporting – an isolated temperature measurement of the power module – which allows accurate thermal management of converter systems. This enables system designers to optimize thermal design and obtain a 25 to 30 percent converter power increase from the same hardware. The isolated NTC readout also reduces hardware complexity, eliminating multiple cables, connectors and additional isolation barrier crossing circuits. The gate drivers employ Power Integrations' SCALE-2 chip set which minimizes component count, enhancing reliability. The gate driver board also protects the power switches in the event of a short-circuit.

Line of Radiation Tolerant Analog Components
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Learn more:
apexanalog.com
  • Product Release
  • 2024-05-21

Apex Microtechnology is announces the launch of its radiation tolerant (RT) product portfolio. After extensive market evaluation and radiation test campaigns, Apex brings a range of military-grade RT devices to serve the space market and applications in radiation environments. The Apex rad tolerant portfolio will initially feature two operational amplifiers, PA07R and PA08R. Engineers designing with analog components for space applications will find these devices to be in-line with SWaP requirements, as well as feature little to no lead times.
The PA08R is a high voltage power operational amplifier designed for output voltage swings up to ±145V with a dual supply, or a 290V single supply. This power amplifier delivers high accuracy via a cascode input circuit configuration. All internal biasing is referenced to a zener diode fed by a FET constant current source. Target applications for this POA include electrostatic transducers, deflection circuits and programmable power supplies. The PA08R is a hybrid product design housed in an electrically isolated, hermetically sealed 8-pin TO-3 metal package. For continuous operation under load, a heatsink of proper rating is recommended.
The PA07 is a high voltage, high output current operational amplifier designed to drive resistive, inductive, and capacitive loads. For optimum linearity, especially at low levels, the output stage is biased for class A/B operation using a thermistor compensated base-emitter voltage multiplier circuit. A thermal shutoff circuit protects against overheating and minimizes heatsink requirements for abnormal operating conditions. The safe operating area (SOA) can be observed for all operating conditions by selection of user programmable current limiting resistors. The amplifier is internally compensated for all gain settings. For continuous operation under load, a heatsink of proper rating is recommended.

Call for Papers
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Learn more:
apec-conf.org
  • Event News
  • 2024-05-20

APEC 2025 will take place March 16-20, 2025 at the Georgia World Congress Center in Atlanta, GA, and the Technical Session digest submissions will be opening in a few weeks for APEC 2025. The organizer assures that APEC 2025 will continue the long-standing tradition of addressing issues of immediate and long-term interest to the practicing power electronics engineering community. Outstanding technical content is promised to be provided at one of the lowest registration costs of any IEEE conference. To be considered as a Technical Session paper for APEC 2025, it is advised that the applicant's digest/paper should address the following: The challenge to be addressed by the paper as well as the major results and how this differs from the most relevant existing literature. Papers presented at APEC must be original material and not have been previously presented or published. The principal criteria in selecting digests will be the usefulness of the work to the practicing power electronic professional. Reviewers value evidence of completed experimental work. Authors should obtain any necessary company and governmental clearance prior to submission of digests.

New strategic Partnership
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Learn more:
finepower.com
  • Industry News
  • 2024-05-17

Finepower and Sanan Semiconductor signed a cooperation contract in May 2024. "We are very pleased that we gained with Finepower a trustworthy partner with an extremely high level of technical understanding," said Michael Sleven, Vice President of Sanan Europe GmbH. "We have one of the biggest vertical inline factories for SiC in the world, covering substrate materials, epitaxial growth, chip manufacturing, packaging, testing and other sections. Also, our GaN products are made on our own SiC substrates. So, we have every process step in our own hands." In China Sanan has been very active for quite a while, and now the company is expanding to Europe. Further details can be found in the VIP interview published in Bodo's Power Systems in April 2024. Sanan combines full-flow manufacturing services for long crystal, substrate, epitaxial, chip, sealing and testing. Sanan is able to control all steps of the production including quality and delivery. The scale of production capacity and technological level are competitive and will strongly guarantee the supply and meet the market demands. "Sanan's portfolio of SiC MOSFETs/diodes, SiC substrates, automotive grade SiC module foundry fits perfectly to our strategy." stated Reiko Winkler, General Manager of Finepower, during the contract signing event. Finepower is an international operating engineering and distribution company with focus on modern power electronic applications.

New Director Strategic Market Development EMEA
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Learn more:
schurter.com
  • People
  • 2024-05-15

Schurter welcomed Natalie Bird to its team. Natalie Bird took up the newly created position of Director Strategic Market Development EMEA. She will play a pivotal role in advancing the market strategies across the region. With nearly two decades of experience at TE Connectivity, where she held various key roles including Key Account and Global Account Management, Natalie Bird's responsibilities will include implementing sales and product strategies to maximize revenue growth, account penetration and enhance customer satisfaction. Most recently, Natalie Bird took positions within Aptiv and Schaltbau.

Series of Ultra-Low Bias Current / High-Efficiency Zener Diodes
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Learn more:
taiwansemi.com
  • Product Release
  • 2024-05-15

Taiwan Semiconductor announces its series of Zener diodes with a selection of devices providing regulated voltages from 1.8VDC to 39VDC, all with ultra-low bias current (IZT) of 50µA and maximum power dissipation (PD) of 500mW. These devices are ideal for applications where exceptionally low bias current is needed (to extend battery life), essential (for energy harvesting), or desirable (in lighting and IIoT) – while still providing uncompromised Zener regulation. The 39 individual Zener diodes in the series with part numbers ranging from MMSZ4668 to MMSZ41716 are all packaged in an industry-standard, low-profile, SOD-123 surface-mount package. With their low IZT, these devices are a straightforward upgrade to existing designs (without the need for PCB modifications), as well as for new designs.

Monolithic Automotive asynchronous Buck Converters
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Learn more:
st.com
  • Product Release
  • 2024-05-14

STMicroelectronics has introduced automotive-qualified step-down synchronous DC/DC converters that save space and ease integration in applications including body electronics, audio systems, and inverter gate drivers. The A6983 converter series comprises of six non-isolated step-down converters in low-consumption and low-noise configurations and the A6983I isolated buck converter. With compensation circuitry on-chip, these monolithic devices need only a few external components including filtering, feedback, and a transformer with the A6983I. The non-isolated A6983 converters can supply up to 3 A load current and achieve 88% typical efficiency at full load. The low-consumption variants (A6983C) are optimized for light-load operation, with high efficiency and low output ripple. The low-noise A6983N variants operate with constant switching frequency and minimize output ripple across the load range for optimum performance in applications such as audio-system power supplies. Both types offer a choice of 3.3 V, 5.0 V, and adjustable output voltage from 0.85 V to VIN. The A6983I is a 10 W iso-buck converter with primary-side regulation that eliminates the need for an optocoupler. Suited for use as an isolated gate driver for IGBTs or silicon-carbide (SiC) MOSFETs in traction inverters and on-board chargers (OBCs), this converter allows accurate adjustment of the primary output voltage. The transformer turns ratio determines the secondary voltage. All isolated and non-isolated variants have a low quiescent operating current of 25 µA and a power-saving shutdown mode that draws less than 2 µA.

LQ Relay for high inrush Currents and PiP Reflow Processing
  • Product Release
  • 2024-05-14

Panasonic Industry's LQ Series of electromechanical Power Relays are designed for a vast field of applications. With a profile of 10 mm (W) x 20 mm (L) x 16 mm (H) these relays offer flexibility in mounting orientations. So far, the LQ Series shows a high switching capacity of up to 10 A and is available in six nominal coil voltages ranging from 5 V to 24 V, featuring 1 Form A or 1 Form C contact arrangements. The sealed construction provides enhanced environmental protection, along with a high surge withstand voltage and dielectric strength, making them well-suited for high voltage applications in ambient temperature usage, up to 85 °C and 105 °C. The ALQ6 is designed to meet the escalating demand for high inrush current capability in automated systems, particularly in motor and LED lighting control applications by handling an inrush current of up to 40 A for 100 µs, making it an suitable for capacitive loads. Now the LQ series is available in a reflow-processable variant.

R&D Manager returns to the Team
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Learn more:
danisense.com
  • People
  • 2024-05-08

Danisense welcomes back Petar Ljushev as R&D Manager. Petar Ljushev had already worked for Danisense for nearly four years previously between 2019 and 2022. He holds a PhD in the field of power electronics from the Technical University of Denmark (DTU), and has many years experience in industrial companies designing power electronics, large power resistors and resistor systems for demanding applications. In his new role at Danisense, he will be focusing on developing and launching new innovative current sense transducer products based on the company's successful and proven closed loop Flux Gate technology.

Low-side Gate Driver for SiC MOSFETs and High-power IGBTs
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Learn more:
littelfuse.com
  • Product Release
  • 2024-05-07

Littelfuse has launched the IX4352NE low-side SiC MOSFET and IGBT gate driver, which is specifically designed to drive SiC MOSFETs and high-power IGBTs in industrial applications. The key differentiator of the IX4352NE lies in its separate 9 A source and sink outputs, which enable tailored turn-on and turn-off timing while minimizing switching losses. An internal negative charge regulator also provides a user-selectable negative gate drive bias for improved dV/dt immunity and faster turn-off. The devices also offer an internal negative charge pump regulator, which eliminates the need for an external auxiliary power supply or DC/DC converter. This feature is particularly valuable for turning off SiC MOSFETs, saving valuable space typically required for external logic level translator circuitry. The logic input's compatibility with standard TTL or CMOS logic levels further enhances space-saving capabilities. The IX4352NE, which operates in the voltage range (VDD - VSS) of up to 35 V, is suited for driving SiC MOSFETs in various industrial applications such as on-board and off-board chargers, PFCs, DC/DC converters, motor controllers, and industrial power inverters. Built-in protection features such as desaturation detection (DESAT) with soft shutdown sink driver, Under Voltage Lockout (UVLO), and thermal shutdown (TSD) ensure the protection of the power device and the gate driver. The integrated open-drain FAULT output signals a fault condition to the MCU, enhancing safety and reliability.

Radiation-tolerant DC/DC Power Converters for new Space Applications
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Learn more:
microchip.com
  • Product Release
  • 2024-05-07

To meet the increased demand for standard space grade solutions that are reliable, cost effective and configurable, Microchip has developed a family of Radiation-Tolerant (RT) LE50-28 isolated DC/DC 50 W power converters available in nine variants with single- and triple-outputs ranging from 3.3 V to 28 V. The off-the-shelf LE50-28 family of power converters are designed to meet MIL-STD-461. The power converters have a companion EMI filter and allow for choosing one or three outputs based on the voltage range needed for the end application. This series provides flexibility to parallel up to four power converters to reach 200 W. The family of LE50-28 devices are designed for applications in new space and LEO environments where components must withstand harsh conditions, and they are available in a variety of electrical connection and mounting options. The LE50 series is manufactured with conventional surface mount and thru-hole components on a printed wiring board. This distinction in the manufacturing process can reduce time to market and risks associated with supply chain disruptions. The LE50-28 family offers space-grade radiation tolerance with 50 Krad Total Ionizing Dose (TID) and Single Event Effects (SEE) latch-up immunity of 37 MeV·cm2/mg linear energy transfer.

Acquisition of Vertical GaN Developer
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Learn more:
power.com
  • Industry News
  • 2024-05-07

Power Integrations announced an agreement to acquire the assets of Odyssey Semiconductor Technologies, a developer of vertical gallium-nitride (GaN) transistor technology. The transaction is expected to close in July 2024, after which all key Odyssey employees are expected to join Power Integrations' technology organization. The acquisition supports the company's ongoing development roadmap for its proprietary PowiGaN technology, which is featured in many of the company's product families including InnoSwitch ICs, HiperPFS-5 power-factor-correction ICs and the recently launched InnoMux-2 family of single-stage, multiple-output ICs. The company introduced 900- and 1250-V versions of PowiGaN technology and products in 2023. Commented Dr. Radu Barsan, Power Integrations' vice president of technology: "We are executing on an ambitious roadmap that includes driving toward cost parity with silicon MOSFETs and expanding the voltage and power capabilities of PowiGaN. Our goal is to commercialize a cost-effective high-current and high-voltage GaN technology to support higher-power applications currently served by silicon carbide (SiC), at a much lower cost and higher performance enabled by the fundamental material advantages of GaN over SiC. The experience of the Odyssey team in high-current vertical GaN will augment and accelerate these efforts."

SiC and more for Chinese EV Manufacturer
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Learn more:
infineon.com
  • Industry News
  • 2024-05-06

Infineon Technologies will provide silicon carbide (SiC) power modules HybridPACK™ Drive G2 CoolSiC™ and bare die products to Xiaomi EV for its recently announced SU7 until 2027. Infineon's CoolSiC-based power modules allow for higher operating temperatures, "resulting in best-in-class performance, driving dynamics and lifetime". Traction inverters based on the technology can, for example, further increase electric vehicle range. The HybridPACK Drive is Infineon's market-leading power module family for electric vehicles, with almost 8.5 million units sold since 2017. Infineon provides two HybridPACK Drive G2 CoolSiC 1200 V modules for the Xiaomi SU7 Max. In addition, Infineon supplies Xiaomi EV with a broad range of products per car, including, for example, EiceDRIVER gate drivers and more than ten microcontrollers in various applications. The two companies also agreed to further cooperate on SiC automotive applications.

High-Capacity Regenerative Electronic Load
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Learn more:
kikusuiamerica.com
  • Product Release
  • 2024-05-06

The PXZ series of efficient, reliable, high-capacity regenerative electronic loads from Kikusui has a rated power of 20 kW in 3U. In addition to the constant-current, constant-resistance, constant-voltage, and constant-power operating modes, this series has an I-V characteristic function that allows the user to set arbitrary I-V characteristics for each CC and CV operating mode. The series is also equipped with various functions, such as sequence, pre-charge, synchronous operation, pulse, sine, and VMCB functions. LAN, USB, and RS232C communication functions are included as standard, allowing direct integration into various evaluation systems. The PXZ series is scalable, and its capacity can be increased up to 200 kW when operating in parallel (up to 10 units).

Semiconductor Processing to Packaging Center to be built in New York State University
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Learn more:
danfoss.com
  • Industry News
  • 2024-05-02

Semikron Danfoss now collaborates with SUNY Polytechnic Institute and other industry partners to build a Semiconductor Processing to Packaging Center that will focus on research, education and training. The facility will be established at the Semikron Danfoss office in Utica, located in the Quad C building on the SUNY Poly campus and will train 100-150 students per year in semiconductor processing, packaging and testing capabilities. The center will be funded in part with the $4 million Empire State Development grant as well as a larger economic development package announced last fall. In addition to supplying space for two classrooms and a 5,000 square-foot clean room, Danfoss will provide multiple pieces of equipment used in the semiconductor manufacturing process. The Center will allow for both silicon device processing as well as SiC, GaN, AlN and their alloys, and Ga2O3 device processing for power electronics, optoelectronics and clean energy applications as well as their unique packaging needs. It is anticipated that the students will be both traditional and non-traditional students, seeking either degrees or certificates. The goal of the Center is to increase graduates across advanced manufacturing disciplines by 10 percent in the next four years. The Center's curriculum will offer several workforce development training and upskilling pathways for industry partners and their employees as well as those seeking to gain entrance into the workforce.

Solid-State High-Voltage Auxiliary E-Fuse Reference Design
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Learn more:
mouser.com
  • Product Release
  • 2024-04-30

Mouser is now stocking the MSDR-EFUSE high-voltage auxiliary E-Fuse reference design from Microchip Technology. Leveraging Microchip's proven 700 V and 1200 V Silicon Carbide mSiC™ products and other company technologies, this high-voltage auxiliary E-fuse solid-state relay demonstrator board offers designers a total system solution (TSS) to diagnose the status of current, temperature and bias supply measurements of automotive and industrial power management applications all in one reference design to avoid sourcing individual parts. The MSDR-EFUSE reference design incorporates an active circuit protection device with an integrated SiC FET and 8-bit MCU. This high-voltage, solid-state relay reference design features over-current protection (programmable in software), a configurable current-limit profile, up to a 30 A continuous output load current, and two modes of short-current detection – edge-triggered and ride-through edge-triggered. Even though the demonstrator board is equipped with only AEC-qualified components designed for automotive and electric vehicle battery-based applications (400 V or 800 V), the board also implements a time-current characteristic (TCC) curve based on thermal characterization that helps migrate to non-automotive applications such as DC solid-state circuit breakers. The MSDR-EFUSE features a 10 µs short-circuit withstand time, up to a 20 kHz switching frequency and a LIN communication interface for configurability and diagnostics. Target applications include (H)EVs, DC smart grids and industrial charging stations.

Interactive Content Series Focused on EV Electrification
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Learn more:
mouser.com
  • Industry News
  • 2024-04-25

Mouser Electronics has set up an interactive content series in collaboration with Littelfuse: Electrifying the Future of eMobility features articles and infographics exploring the challenges of creating different charging solutions for a wide range of use cases. Electrification of small passenger vehicles, scooters, and commercial EVs can vary greatly. Off-road electrified vehicles used in agriculture or construction, such as tractors and bulldozers, also need more robust charging and storage capabilities than passenger vehicles. Circuit protection, battery management, and improving efficiency in electrical systems are discussed, as are the rising expectations for the occupant experience, such as advanced infotainment systems, driver assist, and vehicle autonomy. The content series also showcases many key products from Littelfuse that play important roles in addressing the design challenges of vehicle electrification. For example, Littelfuse's SiC-MOSFETs are key in managing power more efficiently within the vehicle's electrical system, offering various advantages over traditional silicon-based components. The higher efficiency of SiC-MOSFETs results in less power lost through heat. This reduces the need for extensive cooling systems, making them more suitable for the demanding environments of commercial EVs.

Lithium-Ion Battery Separator Plant in Canada
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Learn more:
asahi-kasei.eu
  • Industry News
  • 2024-04-25

Asahi Kasei announced it will construct an integrated plant in Ontario, Canada for the base film manufacturing and coating of HiporeTM wet-process lithium-ion battery (LIB) separator. In relation to this plant, Asahi Kasei has concluded a basic agreement with Honda Motor, and the two parties are currently studying joint investment. Also, with regard to the Canadian plant, it has been agreed that Asahi Kasei Battery Separator Corp., which is scheduled to be established in October 2024, will receive funding from the Development Bank of Japan (DBJ) through the issuance of preferred shares. Furthermore, receipt of financial support from the federal government of Canada and the provincial government of Ontario regarding this investment is expected. The total investment will be slightly higher than 1 billion Euros. Starting 2027 the plant is expected to produce approximately 700 million square meters of coated films.

Integrated GaN System-in-Packages
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Learn more:
weltrend.com
  • Product Release
  • 2024-04-24

Transphorm and Weltrend Semiconductor announced availability of two GaN System-in-Packages (SiPs). When combined with Weltrend's GaN SiP announced last year, the devices establish the first SiP product family based on Transphorm's SuperGaN® platform. The SiPs - WT7162RHUG24B and WT7162RHUG24C - integrate Weltrend's high frequency multi-mode (QR/Valley Switching) Flyback PWM controller with Transphorm's 150 mΩ and 480 mΩ SuperGaN FETs respectively. Like their 240 mΩ predecessor (WT7162RHUG24A), the devices pair with USB PD or programmable power adapter controllers to provide a total adapter solution. Other features include the UHV valley tracking charge mode, adaptive OCP compensation, and adaptive green mode control that allow engineers to design power supplies faster and with fewer components. Some key advantages of Transphorm's normally-off d-mode SuperGaN platform include its robustness (+/- 20 V gate margin with a 4 V noise immunity) and reliability (< 0.05 FIT) with the ability to increase power density by 50% over silicon. Weltrend's SiP designs complements this to create a near plug-and-play solution that speeds design while reducing form factor size.

Spectrum Analyzer Software for Analysis of up to eight simultaneous Signals
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Learn more:
tek.com
  • Product Release
  • 2024-04-23

Tektronix released version 5.4 of its SignalVu Spectrum Analyzer Software for multi-channel modulation analysis of up to eight signals in parallel. Engineers can use this software to turn their existing oscilloscope into a comprehensive wireless system tester, instead of investing in a dedicated tester such as a vector signal analyzer. It is particularly valuable for applications requiring time-domain analysis with RF measurements. The package runs on Tektronix 5 Series MSO, 6 Series MSO or DPO70000 oscilloscopes. It addresses the complex needs of multi-signal, multi-standard, or multi-Device Under Test (DUT) scenarios, proving itself as an indispensable tool for modern RF and wireless research and development. Additionally, the introduction of shared-acquisition multi-signal support enables the simultaneous analysis of signals that are frequency-separated yet input through the same scope channel.

Strategic Partnership to drive Zero-Emission Bus Transport in Europe
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Learn more:
bmz-group.com
  • Industry News
  • 2024-04-23

Daimler Buses and BMZ have entered into a strategic partnership for the development and supply of the next generation of e-bus batteries. Together with Daimler Buses, BMZ will further develop the existing battery technology specifically for the requirements of electrically powered buses. The new battery generation NMC4 – succeeding the current NMC3 technology – will combine high energy density, resulting in a longer range for e-buses, with an ultra-long cycle life. Customers of Daimler Buses will be able to use NMC4 batteries from the middle of the decade. Daimler Buses is pursuing an e-roadmap across all segments: Electrically powered city buses have already been in series production since 2018; intercity e-buses are to follow as of the middle of the decade and electrified coaches by 2030. With this, Daimler Buses aims to offer locally CO2-neutral models based on batteries or hydrogen in every segment by 2030.

Energy-Saving DC/DC Converter ICs in TSOT23 Package
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Learn more:
rohm.com
  • Product Release
  • 2024-04-23

ROHM has developed four compact DC/DC step-down converter ICs suitable for consumer and industrial applications, including refrigerators, washing machines, PLCs, and inverters. ROHM is expanding the lineup which includes the BD9E203FP4-Z, a 2A buck converter with switching frequency of 350kHz. The company has developed products that achieve higher efficiency in an even smaller package than existing SOP-J8 (JEDEC standard: SOIC8 equivalent) products. These converter ICs deliver an output current of 1 A to 3 A in the compact TSOT23 package (2.8 mm × 2.9 mm). This reduces component area by up to 72% compared to the general SOP-J8 package (4.9 mm × 6.0 mm), contributing to the miniaturization of power supply blocks. On top, adopting a flip chip on lead frame TSOT23 package design enables high-efficiency operation by eliminating bond wire resistance. The BD9E105FP4-Z, BD9E202FP4-Z, and BD9E304FP4-LBZ also utilize a COT control mode during light load operation. As a result, efficiency during light load operation is improved over standard products, making them well-suited for applications requiring low standby power consumption. In addition to the ICs, evaluation boards together with various support tools are available that enable immediate evaluation during application design.

High-Temperature Inductors are resistant to Thermal Aging
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Learn more:
we-online.com
  • Product Release
  • 2024-04-23

Würth Elektronik supplements its molded power inductors series with the high-temperature versions WE-MAPI and WE-LHMI. The inductors can be used continuously at high rated currents in a temperature range from -55 °C to +150 °C. The compact components have been tested for thermal aging for over 1000 hours at 200 ºC and are qualified to AEC-Q200. High temperatures in inductors with an iron alloy magnetic core result in thermal aging phenomena. Core losses rise sharply and efficiency drops. Aging can lead to increased self-heating in the component, which in turn exacerbates thermal aging. By expanding its inductor series, Würth Elektronik offers power inductors that are not only unaffected by thermal aging but also do not suffer any performance loss. The SMT power inductors boast low losses, high efficiency, lightweight design, and a low package profile. Their high-current-carrying capacity and capability of handling high transient current peaks can be utilized in applications such as DC/DC converters for high currents in power supplies or for field programmable gate arrays (FPGA), point of load (POL) converters or CPU/RAM power supplies.

Measurement Facility in Bengaluru/India
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Learn more:
rohde-schwarz.com
  • Industry News
  • 2024-04-22

Rohde & Schwarz has inaugurated a facility center in Bengaluru's Manyata Tech Park, housing R&D, system integration as well as calibration and repair services. For Rohde & Schwarz, India is not merely a growth market but a vital component of its global strategy. The R&D team in Bengaluru is involved in developing next generation. The facility houses an ISO 9001 and ISO17025 (NABL) accredited calibration and repair service center, offering precision services to meet the rigorous quality standards of the industry. Furthermore, the facility will also encompass sales, applications, systems integration and a dedicated demo display area showcasing various test and measurement equipment and test solutions.

Silicon Carbide Wafer Supply Agreement
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Learn more:
rohm.com
  • Industry News
  • 2024-04-22

ROHM and STMicroelectronics announced the expansion of the existing multi-year, long-term 150 mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, which is a ROHM group company. The multi-year agreement governs the supply of larger volumes of SiC substrate wafers manufactured in Nuremberg, Germany, for a minimum expected value of $230 million. Geoff West, EVP and Chief Procurement Officer, STMicroelectronics, commented "This expanded agreement with SiCrystal will bring additional volumes of 150mm SiC substrate wafers to support our devices manufacturing capacity ramp-up for automotive and industrial customers worldwide. It helps strengthen our supply chain resilience for future growth, with a balanced mix of in-house and commercial supply across regions". "SiCrystal is a group company of ROHM, a leading company of SiC, and has been manufacturing SiC substrate wafers for many years. We are very pleased to extend this supply agreement with our longstanding customer ST. We will continue to support our partner to expand SiC business by ramping up 150mm SiC substrate wafer quantities continuously and by always providing reliable quality". said Dr. Robert Eckstein, President and CEO of SiCrystal, a ROHM group company.

Power Factor Correction Chokes
  • Product Release
  • 2024-04-21

ITG Electronics has introduced a line of power factor correction (PFC) chokes whose slim design enables engineers to incorporate them into tight spaces. The company's PFC282820B and PFC282822B series of PFC chokes are suitable for 500 - 1000 W continuous conduction mode PFC boost converter applications. ITG Electronics also offers a wider design (27.5 x 28.5 mm3) compatible with power systems up to 2,000 W. These devices are part of ITG Electronics' broader Cubic Design PFC Choke series. Compared with traditional, toroidal-shaped PFC chokes, the new series extension incorporates a flat wire and square core to save space and increase power density. ITG Electronics' range of PFC chokes are appropriate for AC to DC power conversion in industrial equipment and automative components manufacturing environments.

Integration of Power Supply Company completed
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Learn more:
emtron.de
  • Industry News
  • 2024-04-19

With the official change of name, the legal step has been completed: Emtron electronic GmbH is now called FORTEC Power GmbH. Emtron electronic GmbH has already been part of FORTEC Elektronik AG since 1998. In July 2023, a change to a "branded house" was initiated within the FORTEC Group, i.e. holistic corporate brands were designed for the FORTEC group subsidiaries in order to offer the comprehensive product range of Display Technology, Embedded and Power Supplies under one brand and to appear as "FORTEC One" in communication with the market.

Innauguration of Plant in Malaysia
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Learn more:
lem.com
  • Industry News
  • 2024-04-19

LEM chose to make such a substantial investment in the state of Penang/Malaysia by opening a new plant in this region. From employing around 70 people in April 2024, LEM expects to increase the headcount to more than 200 people by March 2025 and eventually more than 500, with sales from the factory expected to reach over € 200 millions. With plans in place already for an extension on the additional 5,000 m2 of land, the new 11,800 m2 factory features a state-of-the-art logistic system including automatic guided vehicles (AGVs) on the shopfloor which transport components from the warehouse to the high-tech production lines. LEM Malaysia is also the pilot for the roll-out of the company's ERP system and will produce a substantial part of its energy through solar panels.

Call for Papers for Power Electronics Conference in 2025
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Learn more:
epe2025-paris.com
  • Event News
  • 2024-04-18

After the EPE editions Grenoble 1987, Toulouse 2003, Lille 2013 and Lyon 2020, the 26th edition of the European Conference on Power Electronics and Applications will take place in Paris, France. The Power Electronics community will gather in Paris, from March 31st to April 4th, 2025, to exchange views on research progress and technological developments. Several tutorials as well as some technical visits will be planned and organized. In addition, the 40 years of EPE conferences will be celebrated. Now the organizer has started the call for papers for "the largest conference in its field, attracting experts from numerous countries to join in the discussions". With the objective to exchange and meet fellow professionals and academics, the EPE conference brings together researchers, engineers, etc. working at the forefront of power electronics technologies. The main topics will be electromobility, smart grids and renewable energy, energy storage systems, digitalization ("the powerful fusion of ai and IoT for sustainability"), sustainable and affordable power electronics as well as energy transition and societal change.

GaN IC enables solar-powered Irrigation Pump
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Learn more:
navitassemi.com
  • Industry News
  • 2024-04-18

Navitas has announced, that Virtual Forest one of India's leading electronics design companies specializing in motor control and human interface technologies for consumer appliances, fluid movement and mobility, has adopted its GaNFast power integrated circuits (IC) technology for a zero-emission, powerful 3 hp (2,250 W) solar-powered irrigation pump. This pump is remotely accessed via quad-band IoT with low power consumption. It can raise 200 l of water per minute to a height of about 30 m, enough to water 3 acres of farmland, and help to produce 10 tonnes of wheat. Further, the IoT enabled solar pump ensures optimal water usage through intelligent analytics, therefore minimizing ground water utilization. Currently, the majority of pumps in this area is powered by polluting and noisy diesel generators or expensive, lossy long-distance electrical cables. The Virtual Forest solar pump with maximum power point tracking (MPPT) operates in conjunction with solar panel and energy storage to provide robust, energy-independent and pollution-free performance at the point of use. In this application two GaN power FETs with GaN drivers, level-shifters, protection features and high-efficiency loss-less current sensing NV6269 half-bridge ICs are used.

Fully integrated 48 W Power Supply Board mount Module
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Learn more:
gaia-converter.com
  • Product Release
  • 2024-04-17

The PSDG-48 series is a fully integrated COTS multi-output 48 W isolated power supply board mount module from Gaia Converter. Dedicated to 24 & 28 VDC military and High Reliability applications, MIL-STD-461, MIL-STD-704, MIL-STD-1275, ABD100 and DO160 power supply requirements are all built into this module. It is equipped with an integrated EMI filter, reverse polarity protection, hold-up function (50 ms transparency timing managed with external capacitor), high & low input voltage transients and inrush current limit and short circuit and over-voltage protected outputs. The module operates from -40 °C to +105 °C (full load case operating temperature range) and is suitable for all rugged applications complying with MIL-STD-202 & 810 for altitude, humidity, temperature shocks & cycles, mechanical vibrations and shocks. The power supplys of the PSDG series use a fixed high frequency switching topology. It is fully encapsulated with thermally conductive resin for optimal power dissipation in harsh environments. The complete power supply efficiency up to 87%. It is integrated in a black anodized machined aluminium case measuring 91 x 54 x 9 mm3.

Automotive linear Regulators
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Learn more:
st.com
  • Product Release
  • 2024-04-17

STMicroelectronics' LDH40 and LDQ40 voltage regulators for automotive and industrial applications start-up from a 3.3V input and operate with up to 40 V applied. The LDH40 delivers up to 200 mA and is available in one version only, having adjustable output voltage from 1.2 V to 22 V. The 250 mA LDQ40 is available with a 1.2 V – 12 V adjustable output and a choice of 1.8 V, 2.5 V, 3.3 V, and 5.0 V fixed output voltages. The quiescent current of 2 µA at zero load and 300nA logic-controlled shutdown mode help preserve battery energy in always-on standby systems. The devices are stabilized with a small ceramic capacitor on the output. The automotive devices are AEC-Q100 qualified and packaged as 2 mm x 2 mm DFN6L devices with wettable flanks that ease PCB design and facilitate automated optical inspection. Their wide input-voltage range allows connection to a vehicle 12 V bus, that can reach up to 40 V transient, to power infotainment systems, instrument clusters, and ADAS. All the LDOs have system protection and management features including internal current limiting, thermal protection, soft-start, and output active discharge. There is an enable pin for shutdown control and a power-good pin for diagnostic monitoring. The LDQ40 devices also have short-circuit protection.

European and Korean Semiconductor Manufacturer cooperate on GaN and SiC 
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Learn more:
swegan.se
  • Industry News
  • 2024-04-15

SweGaN, a European semiconductor manufacturer that develops and produces engineered high-performance Gallium Nitride on Silicon Carbide (GaN-on-SiC) epitaxial wafers, announces it has entered strategic partnership with South Korea based RFHIC Corporation. RFHIC is active in designing and manufacturing GaN RF & microwave semiconductors for communications and defense applications. The agreement encompasses an undisclosed equity investment from RFHIC.  The two companies will focus on joint R&D and product development moving forward. Over the last decade, SweGaN has been developing and producing high-performance GaN-on-SiC epitaxial solutions for RF and power devices that can be used in various applications such 5G telecommunications infrastructure, defense radars, satellite communications, on-board chargers, and data centers. This strategic investment by RFHIC shows the recognition of SweGaN's QuanFINE® epitaxial solutions as a differentiator among GaN-on-SiC materials available on the market. In partnership with RFHIC, SweGaN gains additional resources to expedite market penetration and to achieve its business goals. RFHIC Corporation cites the partnership with SweGaN and investment strategy target strengthening RFHIC's gallium nitride semiconductor supply chain and further fortifying its competitiveness of RF and microwave products within the compound semiconductor arena. In the joint collaboration, SweGaN and RFHIC plan to address the increasing demand for GaN semiconductors and initiate new product developments for a variety of markets.

Expanded Power Portfolio
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Learn more:
tek.com
  • Industry News
  • 2024-04-12

Tektronix has acquired EA Elektro-Automatik (EA), a principal supplier of high-power electronic test solutions for energy storage, mobility, hydrogen, and renewable energy applications. The introduction of EA to the Tektronix team provides the company with expanded solutions, leveraging Tektronix's oscilloscopes and isolated probes, EA's power supplies and electronic loads, and Keithley's source meters and instrumentation. Combined, the Tektronix portfolio offers a set of capabilities for energy storage and power electronics design needs, from ultra-low to ultra-high power. With the addition of EA, Tektronix is well equipped to serve engineers who are electrifying our world. With emphasis on creating solutions for power electronics in the semiconductor, aerospace, and automotive industries, the Tektronix and EA product portfolio addresses issues in energy storage, mobility, and hydrogen fuel.

300 mm Wafer Fab dedicated for Power Semiconductors
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Learn more:
renesas.com
  • Industry News
  • 2024-04-12

Renesas has started operations at its Kofu Factory, located in Kai City, Yamanashi Prefecture, Japan. Renesas aims to boost its production capacity of power semiconductors in anticipation of the growing demand in electric vehicles (EVs). The Kofu Factory previously operated both 150 mm and 200 mm wafer fabrication lines until October 2014. Renesas made the decision to re-open the factory as a 300 mm wafer fab to support the growing demand for power semiconductors. The factory will start mass production of IGBTs and other products in 2025, doubling Renesas' current production capacity for power semiconductors.

Two-Stage EMI Filters
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Learn more:
emisglobal.com
  • Product Release
  • 2024-04-11

EMIS now offers the MF410 series of single phase two stage EMI filters which are especially designed for applications with low impedance loads creating pulsed, continuous or intermittent interference noise and where high levels of mains borne interference may be present. The MF410 series provides high attenuation for both line-to-ground and line-to-line emissions and are available with power ratings from 1 A to 100 A. They are available in a number of termination options including Faston and screw connectors. Typical applications include industrial equipment and factory automation, servo drives and motor controllers, appliances, electronic data processing equipment, power supplies as well as medical equipment. The maximum continuous operating voltage is 250 VAC @ 50/60 Hz and DC while the operating frequency spans from DC – 400 Hz. The temperature range is specified -25 °C to +85 °C.

Tiny Encapsulated Buck Regulators Supply up to 20 A with up to 94% Efficiency
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Learn more:
recom-power.com
  • Product Release
  • 2024-04-11

RECOM now offers a range of four encapsulated buck regulators in ultra-compact, thermally enhanced LGA and QFN packages with output current ratings of 1, 3, 10, and 20 A for cost-sensible markets. The first product, the RPL-1.0, comes in a 3 mm x 3 mm LGA footprint with a "height" of 2 mm and operates over an input range of 3 to 22 V with an adjustable output of 0.6 to 12 V. 1 A output will still be available when the ambient temperature exceeds 80 °C, depending on input/output voltage combinations with operation temperatures up to 125 °C ambient possible, however, with derating. Efficiency is up to 95%. RPH-3.0 is integrated in a 47-pad QFN package measuring 10 mm x 12 mm x 4 mm height, and provides 3 A at the output over an input range of 4.5 to 55 V. Its adjustable output range spreads from 1 to 15 V. Efficiency is up to 91%, and full output current can be delivered even at temperatures beyond 80 °C, for example at 12 Vin and 3.3 Vout. The third device, RPL-10, is rated at 10 A output and offers several additional features. Integrated in an LGA-M package (7 mm x 7 mm x 4.4 mm) the regulator operates with input voltages between 4 and 16 V while the programmable output voltage can be in the range of 0.6 to 5.5 V. Finally, the RPL-20 is claimed to take the "power density to a new level" with its 20 A rating from a programmable output of 0.6 to 5.5 V. Its input range spans from 4 to 16 V, and the maximum efficiency is 94%.

USB Type-C Protection Switch for increased Efficiency and Safety
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Learn more:
aosmd.com
  • Product Release
  • 2024-04-11

Alpha and Omega Semiconductor (AOS) has released the AOZ1377DI Type-C Protection Switch which is designed to enhance USB Type-C efficiency and safety. These protection Type-C switches have a current-limiting switch targeting applications that require comprehensive protections. AOZ1377DI supports up to 7 A with an input voltage of up to 20 V, making it usable for both sink and source applications. The AOZ1377DI offers features that significantly reduce voltage drop and power loss compared to back-to-back p-channel devices typically used in such applications. The device supports an input operating voltage range of 3.4 V to 23 V, with both VIN and VOUT terminals rated at a maximum of 28 V, and is capable of up to 7 A. These devices are suited for high-power applications requiring multi-port Type-C PD 3.0 current source supporting up to 100 W like in high-performance laptops, personal computers, monitors, docking stations, and other Type-C port applications. The AOZ1377DI has a True Reverse Current Blocking (TRCB) protection, which prevents undesired reverse current from VOUT to VIN. It also features an internal current-limiting and short-circuit current limit that protects the source device from large load current. The current limit threshold can be set externally with a resistor. Furthermore, the integrated back-to-back MOSFET is said to deliver "the industry's lowest ON resistance and highest SOA to safely handle high currents and a wide range of output capacitances on VOUT".

Taiwanese Company opens Office in Japan
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Learn more:
panjit.com.tw
  • Industry News
  • 2024-04-11

The Taiwanese MOSFET manufacturer PANJIT has officially opened its Japan branch in Tokyo. This is a significant milestone and it shows PANJIT's dedication to global expansion and its commitment to serving the Japanese market. The Japan branch will serve as a key hub in Asia, enhancing service efficiency and improving communication with Japanese clients. This initiative aims to provide tailored solutions and localized support. At the opening ceremony, Jason Fang, President of the PANJIT Group, highlighted the significance of the Japan office: "The establishment of our Japan branch is central to our global ambitions and our dedication to the Japanese market. We are committed to delivering prompt, tailored service to ensure our Japanese customers feel highly valued and supported."

Wide Bandgap Applications Workshop in Sweden
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Learn more:
scape2024.se
  • Event News
  • 2024-04-10

WBG Power Center and RISE, in collaboration with Yole Group are pleased to announce the international workshop in applications of wide bandgap (WBG) power electronics, SCAPE 2024. The event will cover the latest results and innovations in power electronics applications of wide bandgap materials, such as silicon carbide and gallium nitride. SCAPE 2024 (previously known as ISiCPEAW and IWBGPEAW) is a three-day event, consisting of two workshop days, May 14 - 15, preceded by one tutorial day, May 13. The program is defined by WBG experts and reflects the status of WBG from an industry point of view. Specialists from all over the world will present their views on status, ongoing development and the opportunities of applications in the power electronics area. They will also present the latest products and solutions and will be available for detailed technical discussions.

1 W Isolated and Regulated DC/DC is just 1.18 mm tall
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Learn more:
recom-power.com
  • Product Release
  • 2024-04-09

Recom has introduced fully integrated RxxC1TF isolated DC/DC converters, which offer tightly regulated and selectable outputs at 3.3 V or 5 V in a 12-pad LGA surface mount package, just 5 x 4 x 1.18 mm3. The product is rated for 200 mA output up to 80 °C ambient, with derating to 125 °C, with an input range of 3 to 5.5 VDC. Despite the tiny size of the part, an isolation rating of 3 kVAC is achieved for 1 s along with full line and load regulation, on/off control, selectable outputs, and full protection against input under-voltage, over-temperature, and output overload and short circuits. Isolation capacitance is specified at 5 pF typical. Applications for the RxxC1TF include COM port and sensor isolation in industrial and building automation, datacomms, and IoT.

Power MOSFETs with high-speed Body Diode
  • Product Release
  • 2024-04-09

Toshiba has launched a range of 650 V N-channel power MOSFETs. The TK042N65Z5 and TK095N65Z5 in TO-247 package are the first high-speed diode (HSD) type products in the latest generation DTMOS VI series. This generation has a super junction structure suitable for switching power supplies in demanding applications including data centres and power conditioners for photovoltaic (PV) generators. The two power MOSFETs use intrinsic high-speed diodes to improve the reverse recovery characteristics to enhance bridge and inverter circuit applications. Compared to the standard DTMOS VI products, the TK042N65Z5 and TK095N65Z5 achieve a 65% reduction in reverse recovery time (trr) with values of 160 ns and 115 ns, respectively. Compared with Toshiba standard MOSFETs, the products reduce the reverse recovery charge (Qrr) by 88% and drain cut-off current at high temperatures by up to 90% (TK042N65Z5). Additionally, the key figure of merit (FoM) of "drain-source On-resistance × gate-drain charge" (RDS(ON) * Qgd) has been reduced by approximately 72% compared with Toshiba's existing TK62N60W5. These features reduce power losses of equipment, which helps efficiency. For example, in a 1.5 kW LLC circuit the TK042N65Z5 shows around 0.4% improvement in power supply efficiency over the previous TK62N60W5. TK042N65Z5 and TK095N65Z5 have RDS(ON) values of 42 mΩ and 95 mΩ, respectively. They are capable of delivering drain currents (ID) up to 55 A and 29 A. Both devices are housed in a TO-247 package. Furthermore a reference design is available.

GaN FETs for High-Performance Class-D Audio Amplifiers
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Learn more:
epc-co.com
  • Product Release
  • 2024-04-09

EPC has launched the EPC9192 reference design for efficient Class-D audio amplifiers. The EPC9192 showcases the capabilities of EPC's 200 V, EPC2307, eGaN FETs in a ground-referenced, split dual supply Single-Ended (SE) design, delivering 700 W per channel into a 4 Ω load. The EPC9192 features a modular design that allows for scalability and expandability. The motherboard hosts two PWM modulators and two half bridge power stage daughterboards, implementing a two-channel amplifier with 12 V housekeeping supplies and protections. Users are able to customize the PWM modulator and power stage, facilitating the evaluation and comparison of different devices and modulation techniques. The EPC9192 provides a dual split supply input, unregulated, ±42 V to ±85 V for power stage while its analog inputs may be balanced (XLR) or unbalanced (RCA). It is configurable for two independent SE channels or single channel BTL mode. Undervoltage, Overvoltage, Overcurrent, and Overtemperature protections are included in the device. Its switching frequency is beyond 600 kHz while the noise floor is 40 µV, and the frequency response in the range of 5 Hz - 20 kHz is +/- 0.5 dB, regardless of load.

Power MOSFETs with high-speed Body Diode
  • Product Release
  • 2024-04-09

Toshiba has launched a range of 650 V N-channel power MOSFETs. The TK042N65Z5 and TK095N65Z5 are the first high-speed diode (HSD) type products in the latest generation DTMOS VI series – with a super junction structure suitable for switching power supplies in applications including data centres and power conditioners for photovoltaic generators. The MOSFETs use intrinsic high-speed diodes to improve the reverse recovery characteristics to enhance bridge and inverter circuit applications. Compared to the standard DTMOS VI products, the TK042N65Z5 and TK095N65Z5 achieve a 65% reduction in reverse recovery time (trr) with values of 160 ns and 115 ns, respectively. Compared with Toshiba's standard MOSFETs, the devices reduce the reverse recovery charge (Qrr) by 88% and drain cut-off current at high temperatures by up to 90% (TK042N65Z5). Additionally, the key figure of merit (FoM) of RDS(ON) * Qgd has been reduced by approximately 72% compared with Toshiba's existing TK62N60W5. For example, in a 1.5 kW LLC circuit the TK042N65Z5 shows around 0.4% improvement in power supply efficiency over the previous TK62N60W5. TK042N65Z5 and TK095N65Z5 have RDS(ON) values of 42 mΩ and 95 mΩ, respectively, delivering drain currents up to 55 A and 29 A. Both devices are housed in a TO-247 package.

Replacement for Reed Switches and Hall Effect Sensors
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Learn more:
taiwansemi.com
  • Product Release
  • 2024-04-09

Taiwan Semiconductor has introduced a fully integrated Anisotropic Magneto Resistance (AMR) sensor that replaces reed switches and hall effect sensors in industrial applications. The TSHA2101 is an integrated system-on-chip (SIP) requiring little to no added circuitry. Its omni-polar design automatically detects a horizontal magnetic field of either polarity. When positioned to detect a magnet located on a linear or rotational element, the TSHA2101 acts as a non-contact switch with low power consumption, high sensitivity and high reliability. As a replacement for traditional mechanical reed switches, the TSHA2101 boasts faster response time, superior durability and resistance to wear and degradation over time. Compared to conventional hall effect devices, the AMR sensors' wider magnetic field detection allows designers to use smaller and thinner magnets in their applications. Designed for industrial applications, the TSHA2101 AMR device can be operated with supply voltage range from 2.7 to 30 VDC, in an operating temperature environment ranging from -40 °C to +105 °C. It also features -30 V reverse voltage protection and output overcurrent protection.

Position in Automotive Semiconductor Market improved
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Learn more:
infineon.com
  • Industry News
  • 2024-04-09

Infineon Technologies continued to expand its market position in automotive semiconductors in 2023. According to the latest research by TechInsights, the global automotive semiconductor market grew by 16.5 percent in 2023, reaching a new record size of US$ 69.2 billion. Infineon's overall market share increased by one percentage point, from nearly 13 percent in 2022 to about 14 percent in 2023, solidifying the company's position as a global leader in the automotive semiconductor market. Infineon's semiconductors are used in automotive key applications like driver assist and safety systems, powertrain and battery management, comfort, infotainment and security. According to TechInsights, Infineon has increased its market share in all regions and remained market leader in South Korea and China. In addition, the semiconductor manufacturer has made significant gains in the Japanese automotive semiconductor market. Infineon has strengthened its strong European presence as the second-largest player, as well as its top three position in North America. A major driver of Infineon's performance was strong automotive microcontroller (MCU) sales. For the first time, Infineon has reached the world's number one position in this market.

250 W Medical and Industrial Power Supply Series
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Learn more:
lambda.tdk.com
  • Product Release
  • 2024-04-09

TDK announces additional output voltage models to the 250 W rated TDK-Lambda brand CUS250M series of power supplies in the industry standard 2 inches x 4 inches footprint. The full range now covers 12 V, 15 V, 18 V, 24 V, 28 V, 36 V and 48V and is certified to the IEC 62368-1 and IEC 60601-1 safety standards for industrial and medical applications. This includes both Class I and Class II (no earth ground required) installations. The CUS250M has mechanical configurations that enable convection and/or conduction cooling through the product's baseplate to provide silent cooling. Applications include medical, home healthcare, dental, test, measurement, broadcast, professional audio and industrial equipment. The output can be adjusted to accommodate non-standard voltages, either by the factory or using the on-board potentiometer. The CUS250M operates across an 85 to 264 VAC input and has a earth leakage current of less than 150 µA – including all tolerances. The touch current is <10 µA (Class I) and <70 µA (Class II). In ambient temperatures of -20 °C to +45 °C the CUS250M can deliver up to 250 W conduction cooled without external air. With appropriate derating, operation at up to +80°C is also possible.

Expansion of Partnership with Foundry
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Learn more:
microchip.com
  • Industry News
  • 2024-04-08

Microchip announced it has expanded its partnership with the semiconductor foundry TSMC to enable a specialized 40 nm manufacturing capacity at Japan Advanced Semiconductor Manufacturing (JASM), TSMC's majority-owned manufacturing subsidiary in Kumamoto Prefecture, Japan. This partnership is part of Microchip's ongoing strategy to build resiliency in its supply chain. Other initiatives include investing in additional technology to boost internal manufacturing capabilities and capacity, as well as establishing more geographical diversity and redundancy with wafer fab, foundry, assembly, test and OSAT partners. The TSMC partnership and JASM capacity adds more assurance to the manufacturing landscape, helping reduce Microchip's potential of disrupted supply by offsetting external factors such as frequently changing business conditions and natural disasters.

Maximum Isolation for Battery Management Systems
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Learn more:
we-online.com
  • Product Release
  • 2024-04-08

Würth Elektronik expands its WE-BMS transformer series for battery management systems with versions for an operating voltage of 1500 VDC. The component design features enhanced isolation in line with IEC 62368-1 with triple-insulated wire (primary and secondary side), as well as galvanic isolation and a test voltage of 6400 VDC. All this makes the new models in the series well-suited for use in large stationary energy storage systems from solar and wind farms, in intermediate storage systems in high-power charging stations to balance out peak loads, or for uninterruptible power supplies used in critical infrastructures. Battery management systems ensure safe operation of battery packs and provide information on battery and charge status. The downstream BMS controllers are connected in series, as are the battery cells. As voltage differences and electromagnetic interference can arise between the components connected in series, a BMS transformer helps isolate the components from each other and suppress interference. The latest members of Würth Elektronik's BMS transformer series guarantee this, even in systems with a high operating voltage of up to 1500 VDC. The longevity of the enhanced isolation of the modules as defined in IEC 62368-1 was tested using the partial discharge test in accordance with IEC 60664-1.

Family of Power Analyzers
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Learn more:
rohde-schwarz.com
  • Product Release
  • 2024-04-04

A family of Rohde & Schwarz power analyzers is now available in three models to meet the requirements for measuring voltage, current, power and total harmonic distortion on both DC and AC sources. The R&S NPA101 power meter provides all basic measurements, the R&S NPA501 power analyzer adds enhanced measurement functions and graphical analysis, and the R&S NPA701 compliance tester includes evaluation functions in line with IEC 62301 and EN 50564 for power consumption and EN 61000-3-2 for EMC harmonic emission testing. All models of the R&S NPA family of power analyzers meet the requirements of these stages for power measurements at levels from 50 µW to 12 kW, at potential differences from 1 mV to 600 V and currents from 1 mA to 20 A. The R&S NPA501 and R&S NPA701 include interfaces for external probes or shunts to further extend the range. All three models feature a sampling rate of 500 ksample/s. The 16-bit resolution A/D convertor provides an accuracy of ± 0.05 % for both current and voltage readings. The three instruments of the R&S NPA family include the same 23 standard measurements of power, current, voltage, harmonic distortion and energy.

Opening of Manufacturing and After-Sales Support Facility in Thailand
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Learn more:
recom-power.com
  • Industry News
  • 2024-04-03

Recom has recently established its new manufacturing and after-sales support setup in Bangkok, Thailand. The initiative aims to enhance service quality for the global market and the local customer base, as well as to minimize supply chain risks for international clients. Claimed to set new standards in manufacturing, quality control, and after-sales services, the facility is said to represent "a significant advancement in Recom's operational capabilities". It also houses a logistics center designed to ensure efficient, on-time deliveries to both regional hubs and customers worldwide. Central to the new setup is a commitment to sustainability. Optimizing the supply chain, manufacturing processes, and transportation methods, the facility significantly reduces energy consumption. These efforts mark a major step in Recom's journey towards complete sustainability and achieving zero emissions across the full value chain. In 2024, the focus is on reaching a significant milestone: Recom Thailand is set to ship over 1 million pieces of a wide range of low- and high-power products, from 1 W to 2 kW, catering to the global market.

Rad Hard GaN Gate Driver IC
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Learn more:
epc.space
  • Product Release
  • 2024-04-03

EPC Space announces the launch of EPC7009L16SH, a Radiation Hardened Gallium Nitride gate driver integrated circuit. Built on EPC's proprietary eGaN IC technology, the company claims that the device "delivers the best solution for power management where size, efficiency and simple design are critical". The EPC7009L16SH integrates input logic interface, undervoltage lockout (UVLO) protection, a 10 V-to-5.25 V linear regulator and driver circuit within a hermetically sealed 16-pin SMT package to create a driver that can switch at rates of up to 3.0 MHz. The total ionizing dose is guaranteed to 1000 kRad, and the SEE immunity for LET at 84 MeV/mg/cm2 with the IC's primary supply voltage at 100% of its maximum operating value. Moreover, EPC7009L16SH can drive at least four EPC Space discrete GaN devices. The component is part of a family of space-level Rad Hard ICs that EPC and EPC Space will be launching starting this year. EPC7009L16SH applications include high speed DC-DC conversion, motor drivers, power switches/actuators, and satellite electrical systems.

General Manager & Vice President EMEA appointed
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Learn more:
schurter.com
  • People
  • 2024-04-02

SHURTER welcomes Steffen Lindner to its leadership team. As of April 1, 2024, he has taken over the newly created position of General Manager & Vice President EMEA. In this role, Steffen Lindner will be responsible for all company activities in EMEA, including product management, engineering, sales, and production. After completing his education as a radio and television technician and earning a graduate degree in electrical engineering / communications engineering, Steffen Lindner began his career in sales at Phoenix Contact. After two decades at Phoenix Contact, Steffen Lindner took over sales for Europe, Middle East and Africa at TE Connectivity Industrial. He adapted the sales organization to the changing market conditions and customer needs and introduced a potential-oriented market approach. By strategically focusing on key customers in specific application areas and working in partnership with distributors, Steffen Lindner was able to achieve above-average growth with the new organization. During his almost seven years at TE Connectivity Industrial, he was involved in several company acquisitions and their integration processes.

Power Seminar in German Language
  • Event News
  • 2024-04-02

Targeting Hardware-/Software design engineers, product development, business development and key accounts Mankel Engineering is organizing a hands-on-oriented user symposium about motors and inverters of xEVs. The seminar, which will take place at the end of June 2024 in northwestern Germany, can only be attended with physical presence, and the conference language is German. After an introduction about electrical motors the main focus will be on the components of a power inverter.

CEO of Swiss Company now in charge
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Learn more:
datwyler.com
  • People
  • 2024-04-02

As announced in October 2023, Volker Cwielong took over as CEO of Datwyler on 1 April 2024. Dirk Lambrecht, who had held the position since 2017, stepped down at the end of March 2024 and was elected to the Board of Directors at the Annual General Meeting. Volker Cwielong has been a member of the management team of the globally present Eberspächer Group since 2017. As Co-CEO of the Purem by Eberspächer division, he was responsible for net sales of some EUR 2 billion and for more than 7'000 employees at over 40 locations on three continents. He led the sales, production, technology and innovation units and had full responsibility for the division's results. Before, Volker Cwielong held various global management positions for international industrial groups and automotive suppliers. Volker Cwielong is a mechanical engineer and holds an MBA.

Managing Director of Power Company
  • People
  • 2024-04-02

TDK Corporation announces the appointment of Christopher Haas as Managing Director at TDK-Lambda Germany from 1st April 2024. Christopher has been a member of the Board of Directors since 2012 and will retain his previous duties heading the Quality & Compliance organisation within the EMEA region in his new role. With over 20 years of experience working in the electronics industry, Christopher brings a comprehensive portfolio of technical knowledge, as well as an enterprising skill set, holding an Executive Master's in International Business. Christopher succeeds Gustav Erl, who will retire on 30th June 2024, after 38 years of seniority. In his new role, Christopher intends to lead the organisation with a vision of sustainable and future-oriented growth, building on the company's foundation and values.

Power Conversion Solutions for 48V Zonal Architectures at WCX 2024
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Learn more:
vicorpower.com
  • Event News
  • 2024-04-02

As the automotive industry moves toward 48V zonal architectures, power system design engineers are looking for new high voltage power conversion solutions that have leading power density, weight and scalability attributes. Vicor will be presenting five papers at World Congress Experience 2024 (WCX™) in Detroit on April 16 – 18, detailing its innovative approach to 800V and 48V power conversion using new high-density, scalable power modules with proprietary topologies and innovative packaging.

Semiconductor Manufacturer fully merges its Subsidiary
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Learn more:
rohm.com
  • Industry News
  • 2024-04-01

ROHM announces an absorption-type merger of its fully owned subsidiary LAPIS Technology on April 1, 2024. The merger is intended to integrate the technologies of ROHM and LAPIS Technology. The newly-organized company will work as one to develop products that meet the needs of its customers. ROHM explicitly reassured that the business relationship with its customers as well as the existing products of LAPIS Technology will be continued by ROHM. "Amid dramatic changes in the business environment in the semiconductor industry, it is necessary to build a robust group-wide management structure in order to improve competitiveness", ROHM reports. "LAPIS Technology is a wholly owned subsidiary responsible for the planning and development of IC products. By enhancing the integration density of the technologies that both companies excel in, we will not only cultivate existing products, but also strengthen our development capability for high-value-added products with digital control added to power and analog products."

Global Distribution Agreement with Power Solutions Company
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Learn more:
mouser.com
  • Industry News
  • 2024-03-27

Mouser Electronics announced a global distribution agreement with Vox Power, a manufacturer of AC/DC power supplies and DC/DC converters. As part of this agreement, Mouser Electronics will distribute Vox Power's configurable, and rugged fanless conduction-cooled power supplies. These products have been specifically designed for the medical, industrial, and technology markets, providing high-density solutions that fit into compact spaces for demanding applications that conventional products cannot meet. The NEVO+600 modular configurable power supply, available from Mouser, is said to be the smallest in its class and "the ultimate solution for demanding applications where size, power density and weight matter".

Substrates for Organic Field Effect Transistors (OFETs)
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Learn more:
ipms.fraunhofer.de
  • Industry News
  • 2024-03-27

How efficient are new materials? Does changing the properties lead to better conductivity? The Fraunhofer Institute for Photonic Microsystems IPMS develops and manufactures silicon substrates for this purpose. This enables the fundamental electrical characterization of materials such as a novel graphene emulsion. Customized designs enable the optimal measurement of semiconductors and conductors. Organic semiconductors are key components in organic electronics and photovoltaics. They are used to make flexible electronic devices and printed solar cells. Typical for this class of materials are low temperature processes as well as large area deposition and patterning using various coating and printing techniques. The active semiconductor materials significantly determine the performance of the entire system. Therefore, an easy to handle and reliable electronic characterization of conductivity, carrier mobility, contact resistance and on/off current ratio of these semiconductors is an essential requirement for material and process developers. Fraunhofer IPMS develops and manufactures silicon substrates with single transistor structures in bottom-gate architecture, which are used for the fabrication of organic field-effect transistors (OFETs) or for the characterization of electrical material parameters of conductive materials, e.g. for organic photovoltaics. Substrates for organic field-effect transistors (OFET) for the development of high-tech materials.

Ultrafast Soft Recovery Diode Modules deliver High Reliability
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Learn more:
vishay.com
  • Product Release
  • 2024-03-27

Vishay Intertechnology introduced two FRED Pt 500 A ultrafast soft recovery diode modules in a TO-244 Gen III package. Offering higher reliability than previous-generation solutions, the Vishay Semiconductors VS-VSUD505CW60 and VS-VSUD510CW60 are designed to reduce losses and EMI / RFI in high frequency power conditioning systems. The rugged TO-244 package of the diode modules withstands 46 000 IOL cycles at given conditions, offering an up to 5x improved life expectancy over previous-generation devices. In addition, the industry-standard package is footprint-compatible with competing solutions in the TO-244 to provide a drop-in replacement for existing designs. The VS-VSUD505CW60 and VS-VSUD510CW60 are suited for high frequency welding, high current converters and ballast water management systems (BWMS) in railway equipment, cranes, and ships, UPS and other applications where switching losses comprise a significant portion of the total losses. In these applications, the softness of their recovery eliminates the need for a snubber. Offered in a common cathode configuration, the diode modules provide forward voltage drop down to 0.82 V, thermal resistance - junction to case - of 0.16 °C/W, and an operating temperature range up to +175 °C.

Series of Narrow Body Power Beads
  • Product Release
  • 2024-03-27

ITG Electronics has launched a line of narrow body power beads for high-density applications where component space is at a premium. With a footprint of 5 x 9 mm and a height of 9.5 mm, the company's SLA36385A Series are well-suited for data centers, primary mother boards for servers and storage devices, and other scenarios requiring components to offer high current with low footprint. Featuring more than a dozen items, ITG Electronics SLA36385A Series features inductance values ranging from 35 – 470 nH; the 35 nH component can handle more than 200 A of current, with approximately 20% roll off. Each item in the series offers a DC resistance rate of 0.125 mOhm for high-current functionality. The SLA36385A Series is immersion cooling ready. The SLA36385A Series constitutes ferrite-based SMD inductors. The components feature operating frequencies up to 5.0 MHz, and a temperature range of -55 °C to + 130 °C. Each item in the series is both RoHS & HF compliant. To meet varying current sensing requirements, options for 5% tight tolerance control on DC resistance are also available.

CEO of Soft-Switching Company joins Executive Board of Engineering School
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Learn more:
pre-switch.com
  • People
  • 2024-03-27

Pre-Switch has announced that its CEO Bruce Renouard has accepted an invitation to join the executive board of the Bobby B. Lyle School of Engineering at Southern Methodist University (SMU) in Dallas, Texas/USA. Board members provide advice and counsel on a wide range of subjects, and are also advocates for the facility and involved in fundraising activities. Renouard joined SMU's engineering Co-op program where he worked at Rockwell Collins to gain real world engineering experience prior to graduating from SMU's School of Engineering (Lyle) in 1983 with a BSEE degree. Currently, Pre-Switch, the company he founded in 2015, is bringing its patented, AI-powered soft-switching technology to the automotive and other high voltage markets, resulting in significant improvements in system level efficiency.

Thermal Management Expo Europe Unveils Business Opportunities for High-Tech Industries
  • Event News
  • 2024-03-26

Thermal Management Expo North America is a unique, free-to-attend exhibition and conference that connects senior engineers and key decision-makers with suppliers specializing in thermal systems and materials. No other event provides the opportunity for professionals working across sectors like Automotive, Aerospace & Defense, Electronics, Energy, Telecoms/5G, and Medical to delve into the latest thermal innovations and solutions. Attendees can tap into the advantages of cross-sector networking and in-person engagements with the latest thermal materials, components, and technologies available in the market. Co-located with Ceramics Expo, this event is scheduled for April 29 – May 1, 2024 at Suburban Collection Showplace, Novi, Michigan, USA. Thermal Management Expo promises to showcase the latest systems, materials, and technologies to address thermal management challenges across several high-tech industries. Global market leading suppliers and manufacturers including Alloy Enterprises, Burger Group, Henkel, Huber, Linseis, Parker Hannifin, TCLAD, Thermtest and Stirweld, will be showcasing their innovative solutions. In addition to the exhibition, the free-to-attend conference will feature sessions led by technical experts from prominent companies like Intergalatic, Heraeus, Blueshift, Diabatix, Neural Concept, ZF Group and more. These sessions will provide insights into thermal management systems and design, covering topics such as supply chain optimization, EV thermal management, data center cooling, thermal design and AI, thermal simulation, microelectronics and semiconductors.

100 V Trench Schottky Rectifier Diodes
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Learn more:
st.com
  • Product Release
  • 2024-03-26

STMicroelectronics has introduced 100 V trench Schottky rectifier diodes increasing efficiency in power converters operated at high switching frequencies. ST's trench Schottky diodes are claimed to "significantly reduce the rectifier losses, with superior forward-voltage and reverse-recovery characteristics that enable increased power density with high efficiency." The forward voltage is said to be "50-100 mV better than in comparable planar diodes", depending on current and temperature conditions. Changing to these devices might increase the efficiency by 0.5%. There are 28 variants in the family, with eight current ratings from 1 A to 15 A, multiple surface-mount packages, in industrial and automotive grades. The industrial-grade parts target applications such as miniature switched-mode power supplies and auxiliary power supplies for telecom, server, and smart-metering equipment. In automotive, typical uses include space-constrained applications such as LED lighting, reverse-polarity protection, and low-voltage DC/DC converters. The parts are AEC-Q101 qualified, manufactured in PPAP-capable facilities, and specified from -40 °C to 175 °C. The diodes are 100% avalanche tested in production.

Buck-Boost MOSFET for Higher Power USB PD 3.1 EPR Applications
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Learn more:
aosmd.com
  • Product Release
  • 2024-03-26

Alpha and Omega Semiconductor announced its AONZ66412 XSPairFET MOSFET designed for Buck-Boost converters in USB PD 3.1 Extended Power Range (EPR) applications. The USB PD 3.1 EPR increases the USB-C maximum power up to 240 W. AONZ66412 is defined to support the most commonly addressed power range of up to 140 W at 28 V, with two 40 V N-Channel MOSFETs in a half-bridge configuration in a symmetric XSPairFET 5 mm x 6 mm package. The AONZ66412 can replace two single DFN5x6 MOSFETs. The AONZ66412 is suited for buck-boost converters in Type-C USB 3.1 EPR applications, including notebook, USB hub, and power bank designs. The AONZ66412 is an extension to the AOS XSPairFET lineup. The improved package parasitics make 1 MHz operation achievable, allowing inductor size and height to be reduced. AONZ66412 has been tested to achieve 97% efficiency @1 MHz in typical USB PD 3.1 EPR conditions of 28 V input, 17.6 V output, and 8 A load conditions.

Digital WE Days: Expert Knowledge Online
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Learn more:
we-online.com
  • Event News
  • 2024-03-26

The transfer of expertise is a fundamental element of Würth Elektronik's service concept. This includes in-depth expert presentations in digital format. As part of Digital WE Days, experts from Würth Elektronik and its partner companies will be presenting on important topics like intelligent power and control systems, EMC, electromechanics, wireless power, optoelectronics, and PCBs. "Last year, more than 4,300 participants took advantage of our online service offerings," says Alexander Gerfer, CTO at Würth Elektronik eiSos. "This shows that we are in touch with the times with our Digital WE Days. We are continuing this successful concept this year." From April 22 to 25, 2024, experts from Würth Elektronik, Rohde & Schwarz, onsemi, Infineon, Texas Instruments, Cambridge GaN Devices, Silent Solutions, as well as Wired & Wireless Technologies, will provide for a varied and high-caliber presentation program. A 30-minute presentation is followed by an interactive Q&A session lasting around a quarter of an hour, which further deepens the knowledge imparted in the expert presentation. "We know the current market and technology trends as well as our customers," Gerfer continues. "On this basis, we've once again put together an interesting and contemporary presentation program this year – from practitioners for practitioners." Digital WE Days 2024 is a free service from Würth Elektronik. All presentations can be booked individually. Registration for the virtual conference is now open. 

Land Speed Records with pure Electric Motorcycle
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Learn more:
vicorpower.com
  • Industry News
  • 2024-03-26

The latest episode of the Vicor Powering Innovation podcast explores electrification with Lightning Motorcycles, a company that produces the fastest electric motorcycle on the planet. Lightning Motorcycles (Lightning) not only manufactures the fastest motorbike on Earth, but also prides itself on delivering the smoothest, vibration-free ride for the purist who just loves the riding experience. "The bike gives you a feeling of limitless torque with no vibration, no noise and no heat – there is almost a magical feeling to it." - Richard Hatfield, founder and CEO of Lightning Motorcycles. Hatfield sits down with David Krakauer, VP of Corporate Marketing at Vicor, to share his story and how Lightning is able to engineer a superior motorcycle by nearly every measure. Hatfield said, "The biggest challenges we face are packaging, weight and thermodynamics when competing with internal combustion engine (ICE) bikes." Sophisticated engineering has enabled Lightning to keep the weight of their EVs at about 200lbs, the same as competing ICE bikes. Lightning has set the land speed record at Bonneville Salt Flats in Utah and won the Pike Peaks challenge (14,115ft elevation) in Denver, but Hatfield is prouder of the bike's unparalleled riding experience.

Exhibition spreading from Coil-Winding to e-Mobility
  • Event News
  • 2024-03-25

Taking place from May 14-16 2024, this CWIEME Berlin exhibition will see leading professionals come together to discuss and showcase innovative products from the coil winding, transformer, generator, electric motor manufacturing and e-mobility sectors. For 2024, the event has secured many industry professionals to participate in sessions and talks that will discuss latest innovations, technologies and key issues in the electrical engineering industry. Confirmed speakers include representatives from The International Copper Association, Syensqo, S&P Global Mobility, Siemens Energy, Thyssenkrupp Steel Europe, Hitachi Energy, SGB-SMIT GmbH, STILRIDE, Mckinsey Center for Future Mobility and Ford Europe. The central stage will cover a host of topics such as innovation in transformers oils, driving sustainability in the manufacturing and energy sectors with a deep dive into eco-friendly practices in the steel industry, and a panel discussion on what the future holds for rare earth materials. The e-mobility stage will host talks including a keynote speech on decarbonisation in the automotive sector, a session on the importance of reliability for electric vehicle (EV) infrastructure, a panel discussion on the emerging trends, a talk on innovations and advancements in new motor technologies, and a session on how the automotive industry can remain competitive in the age of electrification.

Successful Funding of GaN Technology Company
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Learn more:
q-p-t.com
  • Industry News
  • 2024-03-25

Cambridge/UK-based QPT, a company which is active in developing highly efficient GaN-based electric motor controls, has announced that its Crowdcube funding round has just passed the one million pound milestone. Rupert Baines, QPT's new CEO, said, "QPT has a … combination of an amazing technology that can cut the power consumption of electric motors by 10% thereby providing a way to actively help reduce climate change and a management team of veterans of the GaN industry." QPT's qGaN technology is a solution for the issues of overheating and RF interference that currently limit the speeds that GaN can be driven at. "Now GaN transistors can be run at much higher speeds than any other rival technology – 20 times faster than SiC for example", Rupert Baines adds. "Our solution is smaller with a significantly lower system cost and saves more energy than rivals according to our studies. I am really excited to be heading a company with a real roadmap to make the world a better place."

Polyimide Coated Magnet Wires for >800 V
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Learn more:
bieglo.com
  • Product Release
  • 2024-03-21

Electrical breakdown of high-temperature insulation materials can be prevented by using thermoplastic Polyimide, TPI. This polymer can be extrusion-coated as other polymers, but AURUM®, TPI reduces electrical and magnetic losses. With 245 °C AURUM claims to have the highest Tg of any commercially available Thermoplastic, and its insulation performance especially at temperatures above 150 °C is stated to beat any other know insulation. AURUM reduces electrical and magnetic losses with a comparative tracking index (CTI) of > 600 volts. Thermoplastic Polyimide (TPI) produced by Mitsui Chemicals of Japan, and sold by BEIGLO GmbH is known for its thermal stability, high-temperature resistance, and electrical insulation properties. TPI coated magnet wires are a suitable choice for high-voltage applications (800 V and above).

Automotive N-Channel MOSFETs for 48 V Applications
  • Product Release
  • 2024-03-21

Toshiba has launched two automotive N-channel power MOSFET devices to meet the growing demand for 48 V batteries and systems within automotive applications including inverters, semiconductor relays, load switches, motor drives and more. The 80V XPQR8308QB and 100V XPQ1R00AQB are based upon Toshiba's U-MOS X-H process. This gives low levels of on-resistance with the XPQR8308QB measuring less than 0,83 mΩ while the XPQ1R00AQB does not exceed 1,03 mΩ. The devices are rated for ID values of 350 A (XPQR8308QB) and 300 A (XPQ1R00AQB) continuously with pulsed values (IDP) of 1050 A and 900 A respectively. Supporting these values, the L-TOGL™ package adopts a thick copper clip-based leadframe structure that thermally and electrically connects the MOSFET die to the package leads. This reduces the package resistance by approximately 70% and channel-to-case thermal impedance by 50% compared with the TO-220SM(W) package. Together, the process and clip reduce losses and heat generation while creating a very thermally efficient solution. Furthermore, the L-TOGL package uses compliant gull-wing leads which reduce mounting stress and improve the reliability of solder joints. Both devices are AEC-Q101 qualified for automotive applications. Toshiba offers to ship devices grouped to within 0.4V based upon their gate threshold voltage.

Reference Design for Qi2 Wireless Charging Implementation
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Learn more:
microchip.com
  • Product Release
  • 2024-03-21

As major charger manufacturers, including those in the automotive industry, are working to implement Qi® v2.0 (Qi2) standards, Microchip Technology has released a Qi 2.0 dual-pad wireless power transmitter reference design. Powered by a single dsPIC33 Digital Signal Controller (DSC), the Qi2 reference design offers efficient control for optimized performance. A key feature of the new Qi2 standard, recently released by the Wireless Power Consortium (WPC), is the introduction of a Magnetic Power Profile (MPP) with support for magnetic alignment between the transmitter and the receiver. The DSC's flexible software architecture enables the support of a combination of MPP and Extended Power Profile (EPP) of Qi 2.0 with one controller. Utilizing the Qi2 reference design helps minimize customer risk in certifying their final product, which is required to pass through the Qi certification process. As it integrates several of Microchip's automotive-qualified parts, the dual-pad charger also meets automotive standards for reliability and safety and supports Autosar. An integrated CryptoAuthentication™ IC provides security to meet the stringent authentication requirement of Qi standards. The reference design is hardware reconfigurable and capable of supporting most transmitter topologies.

DC/DC Converter for 500 W with High Reliability
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Learn more:
gaia-converter.com
  • Product Release
  • 2024-03-21

The MGDS-500 Series from Gaia feature a full range of high density, wide input range DC/DC power modules designed for aerospace, military and high-end industrial applications. With 500 W output power, the MGDM-500 Series is particularly suitable for ultra compact power supply design. Standard models are available with wide input voltage ranges of 9-36VDC and 16-80VDC, and provide output voltages of 12, 15, 24, 28, and 48 VDC. Over the entire 500 W output power range the MGDM-500, which is integrated into a half-brick package, operates with an efficiency of up to 91%. Its Galvanic isolation is 1500 VDC, while the switching frequency is 300 kHz. Trim adjustment is possible from 90% to 110%, and the external synchronization range is specified 270 to 330 kHz. The synchronization function allows more than one converter to operate with an external source frequency. All modules incorporate LC network filters to minimize reflected input current ripple and output voltage ripple. The modules have totally independent functions including input under voltage lock-out, output overvoltage protection, output current limitation protection, and temperature protection. Additionally, a soft-start function allows current limitation and eliminates inrush current during start-up.


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Strategic Current Sensor Chip SupplierEV manufacturer NIO selected Melexis' current sens...11946Industry NewsStrategic Current Sensor Chip SupplierEV manufacturer NIO selected Melexis' current sensor chips for their traction inverter systems. Melexis' chips will power all of NIO's battery electric vehicles (BEVs). Through this collaboration, NIO will use from Melexis' current sensor technology, enhancing the efficiency and reliability of their traction inverter systems. Additionally, Melexis provides local support with dedicated engineers to ensure seamless integration and optimization. Dieter Verstreken, VP of China Strategy at Melexis, commented, "We are delighted to collaborate with NIO, a company known for its innovation and leadership. Our current sensor ICs, coupled with the expertise of our dedicated local engineers, will provide NIO with the support they need to achieve success in the electric vehicle market. We look forward to collaborating with NIO on future projects to advance electric vehicle technology."06.06.2024 14:00:00Junnews_2024-06-15_9.jpg\images\news_2024-06-15_9.jpghttps://www.melexis.com/en/news/2024/06jun2024-nio-selects-melexis-as-a-strategic-current-sensor-chip-suppliermelexis.com
Renewal of Cooperation Agreement for Packaging TechnologyVincotech has renewed its cooperation agreement wi...11945Industry NewsRenewal of Cooperation Agreement for Packaging TechnologyVincotech has renewed its cooperation agreement with Semikron Danfoss. The two enterprise's alliance, which dates back to 2003, has been extended to further strengthen MiniSKiiP&reg; package technology. Multiple source options for the package to further mitigate the supply chain risk, and standards-compliant design are just a few of the benefits of this renewed cooperation agreement. Featuring service-friendly spring contacts, MiniSKiiP's unique hardware is in mass production for use in motor drives, servo drives, and power supplies. Vincotech and Semikron Danfoss are now set to take MiniSKiiP's reliability and standardization to the next level. Customers can look forward this tech bringing even greater robustness, versatility, and compatibility for their power electronics solutions.06.06.2024 13:00:00Junnews_2024-06-15_8.jpg\images\news_2024-06-15_8.jpghttps://www.vincotech.com/news/product-news/article/vincotech-and-semikron-danfoss-renew-cooperation-agreement-for-miniskiipr-packaging-technology.htmlvincotech.com
Online Custom Magnetics Design House launches global Production ServiceFrenetic Electronics announced Frenetic Factory, a...11944Industry NewsOnline Custom Magnetics Design House launches global Production ServiceFrenetic Electronics announced Frenetic Factory, a worldwide magnetics production facility with plants in the USA, Mexico, Europe, India, and China. Frenetic Factory can deliver samples quickly with no MOQs. It currently has a production capacity of 8.75M units annually, that can be scaled to even higher volumes fast. Frenetic launched its magnetics design service in 2021. Using an online process and Core Optimizer tool to make the core selection process faster and more efficient, users input their electrical and environmental specifications, and receive an optimized transformer design in minutes by using Frenetic's custom algorithms. The company's web-based platform allows users to compare millions of different magnetics possibilities within seconds. BOMs, 3D models and engineering drawings are automatically generated. Now, users can take that design and have samples and full production quantities made at Frenetic Factory. Frenetic Factory comprises facilities around the world that are both owned by Frenetic Magnetics or a qualified third party. This is the same operational model as much of the rest of the electronic components industry. And Frenetic Factory is fully responsible for the technical support and quality of the components it supplies, no matter which facility they were produced in. Manufacturing quality and product standards adhered to include MIL-STD-461E, MIL-STD-981, ESCC 3201 and Qualified Parts, and AEC-Q200.06.06.2024 12:00:00Junnews_2024-06-15_7.jpg\images\news_2024-06-15_7.jpghttps://frenetic.ai/frenetic.ai
CoolGaN™ bidirectional Switch and CoolGaN Smart SenseInfineon Technologies announced two CoolGaN&trade;...11949Product ReleaseCoolGaN&trade; bidirectional Switch and CoolGaN Smart SenseInfineon Technologies announced two CoolGaN&trade; product technologies, CoolGaN bidirectional switch (BDS) and CoolGaN Smart Sense. CoolGaN BDS is said to provide "exceptional soft- and hard-switching behavior", with bidirectional switches available at 40 V, 650 V and 850 V. Target applications of this family include mobile device USB ports, battery management systems, inverters, and rectifiers. The CoolGaN Smart Sense products feature lossless current sensing, simplifying design and further reducing power losses, as well as transistor switch functions integrated into one package. They are ideal for usage in consumer USB-C chargers and adapters. The CoolGaN BDS high voltage feature a true normally-off monolithic bi-directional switch with four modes of operation. Based on the gate injection transistor (GIT) technology, the devices have two separate gates with substrate terminal and independent isolated control. The devices are suited for back-to-back switches in single-phase H4 PFC and HERIC inverters and three-phase Vienna rectifiers as well as for single-stage AC power conversion in AC/DC or DC/AC topologies. The CoolGaN BDS 40 V is a normally-off, monolithic bi-directional switch based on Infineon's in-house Schottky Gate GaN technology. It can block voltages in both directions, and through a single-gate and common-source design, it is optimized to replace back-to-back MOSFETs used as disconnect switches in battery-powered consumer products.05.06.2024 08:30:00Junnews_2024-06-15_12.jpg\images\news_2024-06-15_12.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2024/INFPSS202406-111.htmlinfineon.com
Collaboration on SiC-Based Traction Inverters for Electric Vehicle PowertrainsNXP Semiconductors announced a collaboration with ...11939Industry NewsCollaboration on SiC-Based Traction Inverters for Electric Vehicle PowertrainsNXP Semiconductors announced a collaboration with automotive tier-1 ZF Friedrichshafen on SiC-based traction inverter solutions for electric vehicles. Using NXP's GD316x high-voltage (HV) isolated gate drivers, the solutions are designed to accelerate the adoption of 800-V and SiC power devices. Safe, efficient and higher performance traction inverters enabled by the GD316x product family can be designed to extend EV range and reduce the number of charging stops while lowering system level costs for OEMs. As traction inverters now migrate to SiC-based designs, the SiC power devices need to be paired with HV isolated gate drivers to harness the advantages such as higher switching frequency, lower conduction losses, better thermal characteristics and higher robustness at high voltages, compared to previous generation silicon-based IGBT and MOSFET power switches. The GD316x family of functionally safe, isolated, high voltage gate drivers incorporates a number of programmable control, diagnostic, monitoring, and protection features, enhanced to drive the latest SiC power modules for automotive traction inverter applications. Its high level of integration allows a smaller footprint and simplifies the system design. The capabilities reduce Electromagnetic Compatibility (EMC) noise while also reducing switching energy losses for better efficiency.04.06.2024 07:00:00Junnews_2024-06-15_2.jpg\images\news_2024-06-15_2.jpghttps://www.nxp.com/company/about-nxp/nxp-and-zf-collaborate-on-sic-based-traction-inverters-to-boost-electric-vehicle-powertrains:NW-NXP-AND-ZF-COLLABORATE-ON-SIC-BASEDnxp.com
The first fully integrated SiC Facility in ItalySTMicroelectronics intends to build a high-volume ...11938Industry NewsThe first fully integrated SiC Facility in ItalySTMicroelectronics intends to build a high-volume 200mm silicon carbide manufacturing facility for power devices and modules, as well as test and packaging, to be built in Catania, Italy. Combined with the SiC substrate manufacturing facility being readied on the same site, these facilities will form ST's Silicon Carbide Campus. The Silicon Carbide Campus will serve as the center of ST's global SiC ecosystem, integrating all steps in the production flow, including SiC substrate development, epitaxial growth processes, 200mm front-end wafer fabrication and module back-end assembly, as well as process R&D, product design, advanced R&D labs for dies, power systems and modules, and full packaging capabilities. This will achieve a first of a kind in Europe for the mass production of 200 mm SiC wafers with each step of the process – substrate, epitaxy & front-end, and back-end – using 200 mm technologies for enhanced yields and performances. The facility is targeted to start production in 2026 and to ramp to full capacity by 2033, with up to 15,000 wafers per week at full build-out. The total investment is expected to be around five billion euros, with a support of around two billion euros provided by the State of Italy within the framework of the EU Chips Act.31.05.2024 06:00:00Maynews_2024-06-15_1.jpg\images\news_2024-06-15_1.jpghttps://newsroom.st.com/media-center/press-item.html/c3262.htmlst.com
LDO for ultra-miniature ApplicationsToshiba Electronics has released of a series of lo...11953Product ReleaseLDO for ultra-miniature ApplicationsToshiba Electronics has released of a series of low-dropout (LDO) voltage regulators in their ultra-miniature DFN4D package type. Specifically aimed at miniature applications powered by small-scale batteries, the family of devices reduces power consumption, thereby elongating the usable lifetime. With demand for battery powered IoT equipment/modules, communications modules, wearable devices, and other miniature equipment increasing, the LDO regulators of the TCR3LM series offer a line-up of over thirty devices spanning the voltage range 0.8 V DC to 5.0 V DC with an input voltage in the range 1.4 V DC to 5.5 V DC. Each device is capable of delivering up to 300 mA of output current. The TCR3LM offers a typical dropout voltage of 137mV. As the output voltage can be achieved with a lower input voltage, battery drain is reduced. Additionally, the load transient response has been improved, enhancing the output stability when the load fluctuates. The solution is housed in a DFN4D package measuring 1.0 mm × 1.0 mm × 0.37 mm. Furthermore, as small ceramic capacitors can be used on the input and output, the overall solution size is further reduced.30.05.2024 12:30:00Maynews_2024-06-15_16.jpg\images\news_2024-06-15_16.jpghttps://toshiba.semicon-storage.com/eu/company/news/2024/05/power-management-ics-20240530-1.htmltoshiba.semicon-storage.com
Building Permit for final Construction Phase of Smart Power Fab in DresdenInfineon Technologies is on schedule with the cons...11942Industry NewsBuilding Permit for final Construction Phase of Smart Power Fab in DresdenInfineon Technologies is on schedule with the construction of the Smart Power Fab in Dresden and is initiating the final construction phase. During a visit, the Prime Minister of the Free State of Saxony, Michael Kretschmer, officially handed over the last outstanding building permit for the new fab issued by the State Directorate of Saxony. The excavation of the building pit has now been completed. The shell and building construction are currently progressing on the concrete foundation, which is up to two meters thick. Infineon officially broke ground for the new plant in Dresden in May 2023. Manufacturing is scheduled to start in 2026. With a total investment of five billion euros, the company is making a significant contribution to the European Commission goal to increase the EU's share of global semiconductor production to 20 percent by 2030. Infineon is aiming for public funding of around one billion euros. On average, construction workers have removed around 8,000 tons of soil every day since the start of work. A total of 450,000 cubic meters of excavated soil has been produced, which corresponds to the volume of 180 Olympic swimming pools.30.05.2024 10:00:00Maynews_2024-06-15_5.jpg\images\news_2024-06-15_5.jpghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2024/INFXX202405-109.htmlinfineon.com
MoU for GaN SemiconductorsThe fabless semiconductor company Cambridge GaN De...11940Industry NewsMoU for GaN SemiconductorsThe fabless semiconductor company Cambridge GaN Devices (CGD) has signed a Memorandum of Understanding (MoU) with Industrial Technology Research Institute (ITRI) of Taiwan to solidify a partnership in developing high performance GaN solutions for USB-PD adaptors. The MoU also covers the sharing of domestic and international market information, joint visits to potential customers and promotion. CGD's IC-enhanced GaN – ICeGaN – is a novel platform that improves ease-of-use, facilitates smart temperature control and enhances gate reliability. The first commercialized product in the market to adopt GaN devices has been USB-PD adaptors, and it is this market that the first designs from the partnership will address. Specifically, the agreement covers the development of power solutions in the 140-240 W range with power densities exceeding 30 W/in3 for e-mobility, power tools, notebook and cell phone applications.30.05.2024 08:00:00Maynews_2024-06-15_3.jpg\images\news_2024-06-15_3.jpghttps://www.camgandevices.com/en/p/cambridge-gan-devices-signs-mou-with-itri-covering-gan-based-power-supply-development/camgandevices.com
Gain Pre-Driver for 5G mMIMOQorvo announced "the industry's highest gain pre-d...11952Product ReleaseGain Pre-Driver for 5G mMIMOQorvo announced "the industry's highest gain pre-driver providing 39 dB gain at 3.5 GHz and achieving a peak power of +29 dBm". This MIMO (mMIMO) pre-driver dubbed QPA9822 is a wideband, high gain, high linearity driver amplifier, engineered specifically for 32-node mMIMO systems. It is designed to enable wideband 5G New Radio (NR) instantaneous signal bandwidths of up to 530 MHz, making it ideally suited for the N77 band critical for 5G deployment and other mMIMO applications.29.05.2024 11:30:00Maynews_2024-06-15_15.jpg\images\news_2024-06-15_15.jpghttps://www.qorvo.com/newsroom/news/2024/qorvo-unveils-industrys-highest-gain-pre-driver-for-5g-mmimoqorvo.com
Evaluation Modules with Integrated Buck ConvertersEvaluation of Recom's range of integrated buck reg...11950Product ReleaseEvaluation Modules with Integrated Buck ConvertersEvaluation of Recom's range of integrated buck regulators is now made easier with the new EVMs. Suiting models in the Recom RPL, RPH, and RPZ range with current ratings from 0.5 A to 20 A, the evaluation modules provide a way to characterize the converter performance in a realistic environment, both thermally and electrically. Filters are included to demonstrate compliance with EMI 'Class B' levels and all functions available in each converter can be exercised, e. g. output voltage selection and trim, remote sensing, on/off control, switching frequency selection, soft start, input under-voltage lock-out, and Power Good signaling. As the EVMs are designed to provide typical application heatsinking, the buck converters can be operated and evaluated at full load, and behavior is investigated under overload and overtemperature conditions. Alternate component positions are also included to allow experimentation to tailor EMC performance to the application and budget. The RPL, RPH, and RPZ products are a range of cost-effective integrated buck converters in QFN and LGA packages featuring advanced thermal and electrical design. The modules all have integrated inductors and feature a miniature footprint and profile down to 1.6 mm.29.05.2024 09:30:00Maynews_2024-06-15_13.jpg\images\news_2024-06-15_13.jpghttps://recom-power.com/en/company/newsroom/rec-n-evaluation-modules-now-available-for-rpl,-rph-and-rpz-switching-regulators-367.html?4recom-power.com
Rugged 500 W AC/DC Power Supplies utilizing Conduction Cooling for harsh EnvironmentsP-DUKE has launched its XTBF500 AC/DC power supply...11948Product ReleaseRugged 500 W AC/DC Power Supplies utilizing Conduction Cooling for harsh EnvironmentsP-DUKE has launched its XTBF500 AC/DC power supply series, available in open frame or enclosed form. The XTBF500 integrates the TBF500 full brick 500 W AC/DC power supply and its peripheral circuits, such as EMC filters, start-up current limiters, large capacity capacitors, and aluminum substrates, to achieve the concept of "easy to use." The XTBF500 series features a universal input voltage range of 85-264 V<sub>AC</sub>. The output voltage is 12, 15, 24, 28, 48, and 54 V<sub>DC</sub>, adjustable within a range of +10%/-10% via potentiometer. It also features slope current sharing to provide over 500 W of power by paralleling multiple modules, as well as complete protection functions, including overcurrent protection (hiccup mode), short circuit protection (auto-recovery), and output overvoltage protection (latch). XTBF500 has integrated all peripheral devices together to combine the advantages of a full brick module and a complete AC/DC power supply, in compliance with EMC standard EN/IEC 50032 Class B (CE Class B, RE Class A), start-up inrush current limiter function, and OVC III (overvoltage category). By conducting cooling on the system chassis, it can operate at full load up to 40 degrees to cope with harsh applications and demanding environments. The XTBF500 is designed for challenging operating conditions and is suited for various applications such as 5G communication, ESS, defense, robotics, and factory automation.29.05.2024 07:30:00Maynews_2024-06-15_11.jpg\images\news_2024-06-15_11.jpghttps://www.pduke.com/news_detail28_157.htmpduke.com
Coreless High Current SensorsCapable of measuring high DC currents from 2 kA up...11947Product ReleaseCoreless High Current SensorsCapable of measuring high DC currents from 2 kA up to 42 kA without surge current limitations, the Open Loop Coreless Integral (OLCI) sensors from LEM feature a large aperture for accurate measuring of high currents on large busbars, with up to 1 MHz bandwidth for high frequency applications. They are also significantly lighter (80%) and more cost effective than open loop or closed loop current transducers operating within the same current measuring range. Two versions of the OLCI high current sensors are available from LEM – the FRS model supporting primary busbar apertures of 104 mm x 22 mm and the FL for apertures up to 300 mm x 100 mm. Because it is a split transducer, the FL can be opened and attached directly anywhere on the busbar without the need to open the busbar, making it easy to install and maintain. With no magnetic core, no secondary copper winding, an integrated Rogowski coil and an array of Hall elements, the FRS sensor slashes raw material costs and reduces power losses. Equally suited to trackside and onboard traction applications in the railway industry as they are for high power wind turbines and hydrogen electrolysers, the sensors can also be used on industrial low-voltage and medium-voltage variable frequency drives, in induction welding applications, and for DC grid monitoring.29.05.2024 06:30:00Maynews_2024-06-15_10.jpg\images\news_2024-06-15_10.jpghttps://www.lem.com/en/frs-fllem.com
Expanded Range of Power InductorsIn addition to Würth Elektronik's five existing pa...11954Product ReleaseExpanded Range of Power InductorsIn addition to Würth Elektronik's five existing package sizes of WE-XHMI SMT power inductors there are now eight more packages. These compact yet very efficient inductors feature a current capacity up to 56 A saturation current and the ability to handle high transient current spikes. This makes them particularly suitable for use as DC/DC converters in power supplies, point-of-load converters and high-current filters, as well as in industrial computers, mainboards and graphics cards. The molded flat wire inductor, previously only available in the Power Magnetics product family, now also comes in 4020, 4030, 4040, 5020, 5030, 5050, 7030 and 7070 package sizes. The series is also available in smaller packages, and the 70xx sizes close a gap in the existing portfolio. The AEC-Q200-qualified WE-XHMI series inductors can be used at operating temperatures from -40 °C to +125 °C and cover an inductance range from 0.15 to 33 µH with currents up to 56 A.28.05.2024 13:30:00Maynews_2024-06-15_17.jpg\images\news_2024-06-15_17.jpghttps://www.we-online.com/en/news-center/press/press-releases?d=we-xhmiwe-online.com
IEDM: Call for PapersUnder the theme "Shaping Tomorrow's Semiconductor ...11941Event NewsIEDM: Call for PapersUnder the theme "Shaping Tomorrow's Semiconductor Technology," the 70<sup>th</sup> annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development. The 2024 IEEE IEDM will take place December 7-11, 2024 at the Hilton San Francisco Union Square hotel, with on-demand access to recorded presentations after the event. The paper submission deadline is Thursday, July 11, 2024. Authors are asked to submit four-page papers electronically in IEEE Xplore-compatible PDF format. Accepted papers will be published as-is in the proceedings. A few late-news papers also will be accepted, covering only the most recent, most noteworthy developments. The late-news submission deadline is August 19, 2024. The IEEE IEDM is the premier forum for technological breakthroughs in semiconductor and related device technology, manufacturing, design, physics, and modeling. Each year, the world's leading technologists gather to participate in a technical program of more than 220 presentations, panels, focus sessions, tutorials, Short Courses, supplier exhibits, IEEE/EDS award presentations, and other events highlighting the industry's best work. In the power sector IEDM will put special emphasis e. g. on "Emerging Power Electronic Devices and Integration for a Sustainable Society", "Novel materials and innovative applications for next-generation devices" and "Advanced packaging, and package-device level interactions".28.05.2024 09:00:00Maynews_2024-06-15_4.jpg\images\news_2024-06-15_4.jpghttps://www.ieee-iedm.org/call-for-papers-overviewieee-iedm.org
Roadmap for Power Supply Units in AI Data CentersThe influence of artificial intelligence (AI) is d...11928Industry NewsRoadmap for Power Supply Units in AI Data CentersThe influence of artificial intelligence (AI) is driving up the energy demand of data centers across the globe. This growing demand underscores the need for efficient and reliable energy supply for servers. Infineon Technologies opens a new chapter in the energy supply domain for AI systems and unveils a roadmap of energy efficient power supply units (PSU) specifically designed to address the current and future energy need of AI data centers. By introducing unprecedented PSU performance classes, Infineon enables cloud data center and AI server operators to reduce their energy consumption for system cooling. The innovative PSUs reduce power consumption and CO <sub>2</sub> emissions, resulting in lower lifetime operating costs. The powerful PSUs are not only used in future data centers but can also replace existing power supply units in servers and increase efficiency. In addition to the current PSUs with an output of 3 kW and 3.3 kW available today, the new 8 kW and 12 kW PSUs will contribute to further increasing energy efficiency in future AI data centers.24.05.2024 13:00:00Maynews_2024-06-01_8.jpg\images\news_2024-06-01_8.jpghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2024/INFPSS202405-105.htmlinfineon.com
Half-Bridge MOSFET for DC-DC ApplicationsAlpha and Omega Semiconductor introduced its AONG3...11936Product ReleaseHalf-Bridge MOSFET for DC-DC ApplicationsAlpha and Omega Semiconductor introduced its AONG36322 XSPairFET designed for space-constrained DC-DC applications. The device features two 30V MOSFETs in a half-bridge configuration where the high-side and the low-side MOSFETs are in an asymmetric DFN3.5x5 XSPairFET package. This design allows the AONG36322 to replace an existing DFN5x6 asymmetric half-bridge MOSFET with an approximate 60 percent space-saving solution, thereby reducing the PCB footprint to further streamline the DC-DC architecture, resulting in a more efficient design. These benefits make the AONG36322 ideal for a new generation of smaller DC-DC buck converters in more compact applications such as point-of-load (POL) computing, USB hubs, and power banks. The AONG36322 is an extension to the AOS XSPairFET lineup, designed with the latest bottom-source packaging technology. Its integrated high-side and low-side MOSFETs feature 4.5 mOhms and 1.3 mOhms maximum on-resistance, respectively, where the low-side MOSFET source is connected directly to the exposed pad on the PCB to enhance thermal dissipation. A definite advantage of the state-of-the-art AONG36322 package design is that it delivers lower parasitic inductance, significantly reducing switch node ringing.23.05.2024 13:30:00Maynews_2024-06-01_16.jpg\images\news_2024-06-01_16.jpghttps://www.aosmd.com/sites/default/files/2024-05/AOS_36322_XSPairFET_PR.pdfaosmd.com
Preferred Partner of Semiconductor ManufacturerWürth Elektronik is now a preferred partner at Ren...11937Industry NewsPreferred Partner of Semiconductor ManufacturerWürth Elektronik is now a preferred partner at Renesas. By partnering with Renesas as a preferred partner, Würth Elektronik gains access to a host of resources and support to further enhance its capabilities in delivering innovative solutions, as well as joint solution options shown at tradeshows, webinars, seminars, and blog articles. This partnership also signifies Würth Elektronik's dedication to reducing development risks and accelerating time-to-market for customers by leveraging Renesas' extensive portfolio of products and solutions. Renesas preferred partners are elite system solution providers renowned for their expertise in deploying Renesas products to deliver highly optimized solutions. These partners undergo rigorous training and boast extensive experience, ensuring they can effectively leverage Renesas technologies to meet diverse customer needs. Renesas' preferred partners play a crucial role in bringing value-added solutions to customers, whether in the early stages of prototyping, sample and technical support, or advancing towards productization based on proof of concepts (PoCs) from Renesas or its partners. This collaboration ensures that customers benefit from optimized solutions that meet the relevant standards of quality and performance.23.05.2024 10:00:00Maynews_2024-06-01_5.jpg\images\news_2024-06-01_5.jpghttps://www.we-online.com/enwe-online.com
Opening of Manufacturing Plant in MexicoLittelfuse held a ribbon-cutting ceremony to celeb...11925Industry NewsOpening of Manufacturing Plant in MexicoLittelfuse held a ribbon-cutting ceremony to celebrate the opening of a new manufacturing plant in Piedras Negras, Coahuila, Mexico. The newly opened and operational 10,000-square-metre facility, which doubles the current local Littelfuse manufacturing capacity while maintaining room for additional expansion, is located close to three other company operations in the city. The facility's innovative automation systems ensure precision and efficiency, allowing for a high degree of customization to meet specific client needs. The purpose-built facility utilizes water treatment processes resulting in zero water consumption. The smart air compressors, high-efficiency HVAC, safety relays, and use of LED lighting throughout the facility deliver energy effectively and efficiently. The manufacturing operations team of 1,000 employees is being staffed from a combination of current talent from nearby Littelfuse locations and new hires. The facility is fully accessible, convenient to public transportation and daycare, and will bring increased opportunities for career development and community outreach and support.23.05.2024 09:00:00Maynews_2024-06-01_4.jpg\images\news_2024-06-01_4.jpghttps://www.littelfuse.com/about-us/news/news-releases/2024/littelfuse-announces-grand-opening-of-manufacturing-plant-in-piedras-negras.aspxlittelfuse.com
Tradeshow emphasizes Smart Energy SolutionsAs electronics is a key factor in the energy trans...11924Event NewsTradeshow emphasizes Smart Energy SolutionsAs electronics is a key factor in the energy transition and development of smart energy solutions, smart energy will be a key topic at electronica 2024, which will take place from November 12 to 15 in Munich, Germany. According to a report by MarketsandMarkets, the global market for smart energy is expected to grow from 170 billion US dollars in 2022 to 283 billion US dollars by 2027, which is equivalent to a compound annual growth rate (CAGR) of 10.6%. The main driver of this growth is the increasing demand for intelligent power grids, known as smart grids. At electronica 2024, which is all about the all-electric society, the topic of smart energy will play a correspondingly important role, whether at the trade fair stands or in the conference and forum program. The Power Electronics Forum in Hall A5, for example, will look at the entire spectrum of power electronics. Here, experts will discuss current trends and developments that are of crucial importance for the energy transition and for implementing the all-electric society. Hall A4 will be all about innovations in transformers, power supplies, power supply units and batteries. In Halls B4, B5, C3, C4 and C5, numerous exhibitors will be presenting their latest products and solutions relating to semiconductors, while embedded systems can be found in Hall B4.23.05.2024 08:00:00Maynews_2024-06-01_3.jpg\images\news_2024-06-01_3.jpghttps://electronica.de/en/trade-fair/journalists/press-releases/detail/electronica-2024-showcases-smart-energy-solutions-for-the-future.htmlelectronica.de
AC/DC Power Supplies for AGV/AMR Battery Charging StationsTTI – Europe is supporting the design and developm...11935Product ReleaseAC/DC Power Supplies for AGV/AMR Battery Charging StationsTTI – Europe is supporting the design and development of charging stations for industrial and service mobile robots with Advanced Energy's Artesyn&trade; LCM series of single-output AC-DC power supplies. These robust and reliable units are tailored for fast and efficient charging of Automated Guided Vehicles (AGV) and Autonomous Mobile Robots (AMR) batteries in charging stations. Within the LCM series there are five variants, ranging from 300 Watts to 3000 Watts. They offer a typical full-load efficiency of up to 93%, thereby reducing operating costs and improving thermal performance. Many models within this series do not require derating at low-line. The single output front-end units accept operating inputs between 90Vac and 264Vac for global use, and a wider 85Vac to 264Vac input range for the LCM300 & LCM600 series. The LCM series is available with output voltages of 12V, 15V, 24V, 36V and 48V – the LCM1500 series is offered with an additional 28V output, with 18V and 72V for the LCM3000 series. All outputs are adjustable to a percentage of their nominal value, which means that any output voltage between 9.6 and 57.6V is available to accommodate non-standard system voltages. In addition, the ability to share current allows multiple power supplies to be connected in parallel for higher power applications.22.05.2024 12:30:00Maynews_2024-06-01_15.jpg\images\news_2024-06-01_15.jpghttps://www.ttieurope.com/content/ttieurope/en/about-tti/news-center/corporate-news/press-releases/2024/may/pr-05232024-advanced-energy-lcm-series-ac-dc-power-supplies.htmlttieurope.com
Cooperation to offer SmartSiCX-FAB and Soitec will begin work to offer Soitec's...11927Industry NewsCooperation to offer SmartSiCX-FAB and Soitec will begin work to offer Soitec's SmartSiC&trade; wafers for the production of silicon carbide power devices at X-FAB's plant in Lubbock, Texas. This collaboration follows the successful completion of the assessment phase, during which silicon carbide (SiC) power devices were manufactured at X-FAB Texas on 150mm SmartSiC wafers. Soitec will offer X-FAB's customers easy access to the SmartSiC substrate through a joint supply chain consignment model. SmartSiC is a proprietary Soitec technology based on the company's SmartCut&trade; process, in which a thin layer of a high-quality monocrystalline (mono-SiC) 'donor' wafer is split off and bonded to a low resistivity polycrystalline (poly-SiC) 'handle' wafer. The resulting substrate offers improved device performance and manufacturing yields. The process allows multiple re-uses of a single donor wafer, significantly reducing cost and related CO<sub>2</sub> emissions.22.05.2024 12:00:00Maynews_2024-06-01_7.jpg\images\news_2024-06-01_7.jpghttps://www.xfab.com/news/details/article/x-fab-and-soitec-team-up-to-offer-smartsictm-at-lubbock-plant-usaxfab.com
Demonstration Board kickstarts dual-motor Designs for Industrial and Consumer ProductsSTMicroelectronics' EVSPIN32G4-DUAL demonstration ...11934Product ReleaseDemonstration Board kickstarts dual-motor Designs for Industrial and Consumer ProductsSTMicroelectronics' EVSPIN32G4-DUAL demonstration board controls two motors from a single STSPIN32G4 integrated driver, accelerating product development and simplifying the PCB design and bill of materials. The demonstration board leverages an advanced three-phase gate driver integrated in the STSPIN32G4 and an additional STDRIVE101 gate driver to control two three-phase inverters delivering up to 10A with a maximum supply voltage of 74V. Both gate drivers have their own bootstrap circuitry and safety features including drain-source voltage monitoring, cross-conduction prevention, several thermal protection mechanisms, and under-voltage lockout (UVLO). EVSPIN32G4-DUAL also leverages the STSPIN32G4's built-in power-management circuitry, permitting a compact design with a low BOM that is easy to procure and permits rapid assembly in production. The power management includes a programmable buck converter for gate drivers VCC supply, a low-dropout linear regulator, and a special regulator with low quiescent current to supply the MCU during standby.22.05.2024 11:30:00Maynews_2024-06-01_14.jpg\images\news_2024-06-01_14.jpghttps://newsroom.st.com/media-center/press-item.html/n4629.htmlst.com
GaN System-in-Package Targeting Rapid Consumer Device ChargingWise-integration and Leadtrend Technology Corporat...11931Product ReleaseGaN System-in-Package Targeting Rapid Consumer Device ChargingWise-integration and Leadtrend Technology Corporation announced the release of a GaN system-in-package (SiP) supporting consumer electronics applications. Their collaboration's targeted application is a 65-watt USB PD adapter for high-speed charging of smartphones, laptops and other devices. The LD966LGQALVE High Voltage Multi-Mode PWM Controller of Flyback with GaN integrated includes Leadtrend's silicon die flyback controller and Wise-integration's 650V e-mode gallium-nitride (GaN) transistor die in a SiP. The SiP has passed 1,000 hours of operating life tests (OLT). The LD966L is green-mode PWMIC built-in with brown-in/out functions of a QFN8X8 package. It minimizes the component count, circuit space, and reduces overall material cost for the power applications. It features HV start, green-mode power-saving operation, soft-start functions to minimize power loss and enhance system performance. The LD966LGQALVE Evaluation Board features an overall peak efficiency of 93.02% and a power density of 22.7 W/in<sup>3</sup>.  22.05.2024 08:30:00Maynews_2024-06-01_11.jpg\images\news_2024-06-01_11.jpghttps://wise-integration.com/wise-integration-leadtrend-technology-introduce-gan-system-in-package-targeting-rapid-consumer-device-charging/wise-integration.com
Support for 300mm Smart Power ProcessIn a joint development project spanning around one...11926Industry NewsSupport for 300mm Smart Power ProcessIn a joint development project spanning around one year, important progress was made in the production of "Smart power technologies". Fraunhofer IPMS provided significant support to the semiconductor manufacturer Infineon by supplying selected process modules within the entire CMOS process value chain on 300 mm wafers. The collaboration played a key role in the process development for the factory expansion at Infineon Dresden. Over 2000 wafers were successfully processed as part of this collaboration. The wafers were exchanged several times between Fraunhofer IPMS and Infineon Dresden to ensure optimal use of resources and optimum integration into the production lines. The teams are now well attuned to each other. The cooperation was always focused on achieving results, and the colleagues at Infineon were very accommodating towards Fraunhofer's ideas. With the construction of the new Smart Power Fab, Infineon is making one of the largest single investments in its history. The aim of the semiconductor manufacturer is to increase the speed at which it expands its semiconductor production capacities and to further strengthen Europe as a chip manufacturing location. This is an important contribution to meeting the growing global demand for semiconductors - for example for applications to generate renewable energy, for use in data centers and for electromobility.21.05.2024 11:00:00Maynews_2024-06-01_6.jpg\images\news_2024-06-01_6.jpghttps://www.ipms.fraunhofer.de/en/press-media/press/2024/300-mm-process-development-of-smart-power-technologies.htmlipms.fraunhofer.de
1200 V SiC MOSFETs in SMD PackagingNexperia announced that it is now offering its 120...11933Product Release1200 V SiC MOSFETs in SMD PackagingNexperia announced that it is now offering its 1200 V silicon carbide (SiC) MOSFETs in D&sup2;PAK-7 surface mount device (SMD) packaging, with a choice of 30, 40, 60, and 80 m&#8486; R<sub>DSon</sub> values. This announcement follows on from Nexperia's late-2023 release of two discrete SiC MOSFETs in 3 and 4-pin TO-247 packaging and is the latest offering in a series which will see its SiC MOSFET portfolio swiftly expand to include devices with R<sub>DSon</sub> values of 17, 30, 40, 60 and 80 m&#8486; in flexible package options. With the release of the NSF0xx120D7A0, Nexperia is addressing the growing market demand for high performance SiC switches in SMD packages like D<sup>2</sup>PAK-7, which is becoming increasingly popular in various industrial applications including electric vehicle (EV) charging (charge pile, offboard charging), uninterruptible power supplies (UPS) and inverters for solar and energy storage systems (ESS). It is also further testimony to Nexperia's successful strategic partnership with Mitsubishi Electric Corporation (MELCO), which has seen the two companies join forces to push the energy efficiency and electrical performance of SiC wide bandgap semiconductors to the next level, while additionally future-proofing production capacity for this technology in response to ever growing market demand.21.05.2024 10:30:00Maynews_2024-06-01_13.jpg\images\news_2024-06-01_13.jpghttps://www.nexperia.com/about/news-events/press-releases/Nexperia-s-premier-SiC-MOSFETs-now-come-in-the-increasingly-popular-D2PAK-7nexperia.com
Single-Board Plug-and-Play Gate DriversPower Integrations launched the SCALE-iFlex&trade;...11930Product ReleaseSingle-Board Plug-and-Play Gate DriversPower Integrations launched the SCALE-iFlex&trade; XLT family of dual-channel plug-and-play gate drivers for operation of single LV100 (Mitsubishi), XHP&trade; 2 (Infineon), HPnC (Fuji) and equivalent semiconductor modules up to 2300 V blocking voltage for wind, energy storage and solar renewable energy installations. This single-board driver enables active thermal management of inverter modules for improved system utilization and reduces the bill-of-material count for increased reliability. This compact SCALE-iFlex XLT gate drivers fit inside the outline of the module, allowing the drivers to be mounted on the module, which gives converter system designers a high degree of mechanical design freedom. SCALE-iFlex XLT dual-channel gate drivers feature Negative Temperature Coefficient (NTC) data reporting – an isolated temperature measurement of the power module – which allows accurate thermal management of converter systems. This enables system designers to optimize thermal design and obtain a 25 to 30 percent converter power increase from the same hardware. The isolated NTC readout also reduces hardware complexity, eliminating multiple cables, connectors and additional isolation barrier crossing circuits. The gate drivers employ Power Integrations' SCALE-2 chip set which minimizes component count, enhancing reliability. The gate driver board also protects the power switches in the event of a short-circuit.21.05.2024 07:30:00Maynews_2024-06-01_10.jpg\images\news_2024-06-01_10.jpghttps://investors.power.com/news/news-details/2024/Power-Integrations-Launches-Single-Board-Plug-and-Play-Gate-Drivers-for-1.2-kV-to-2.3-kV-New-Dual-IGBT-Modules/default.aspxpower.com
Line of Radiation Tolerant Analog ComponentsApex Microtechnology is announces the launch of it...11929Product ReleaseLine of Radiation Tolerant Analog ComponentsApex Microtechnology is announces the launch of its radiation tolerant (RT) product portfolio. After extensive market evaluation and radiation test campaigns, Apex brings a range of military-grade RT devices to serve the space market and applications in radiation environments. The Apex rad tolerant portfolio will initially feature two operational amplifiers, PA07R and PA08R. Engineers designing with analog components for space applications will find these devices to be in-line with SWaP requirements, as well as feature little to no lead times.<br>The PA08R is a high voltage power operational amplifier designed for output voltage swings up to ±145V with a dual supply, or a 290V single supply. This power amplifier delivers high accuracy via a cascode input circuit configuration. All internal biasing is referenced to a zener diode fed by a FET constant current source. Target applications for this POA include electrostatic transducers, deflection circuits and programmable power supplies. The PA08R is a hybrid product design housed in an electrically isolated, hermetically sealed 8-pin TO-3 metal package. For continuous operation under load, a heatsink of proper rating is recommended.<br>The PA07 is a high voltage, high output current operational amplifier designed to drive resistive, inductive, and capacitive loads. For optimum linearity, especially at low levels, the output stage is biased for class A/B operation using a thermistor compensated base-emitter voltage multiplier circuit. A thermal shutoff circuit protects against overheating and minimizes heatsink requirements for abnormal operating conditions. The safe operating area (SOA) can be observed for all operating conditions by selection of user programmable current limiting resistors. The amplifier is internally compensated for all gain settings. For continuous operation under load, a heatsink of proper rating is recommended.21.05.2024 06:30:00Maynews_2024-06-01_9.jpg\images\news_2024-06-01_9.jpghttps://www.apexanalog.com/press/product_news_radiation-tolerant.htmlapexanalog.com
Call for PapersAPEC 2025 will take place March 16-20, 2025 at the...11923Event NewsCall for PapersAPEC 2025 will take place March 16-20, 2025 at the Georgia World Congress Center in Atlanta, GA, and the Technical Session digest submissions will be opening in a few weeks for APEC 2025. The organizer assures that APEC 2025 will continue the long-standing tradition of addressing issues of immediate and long-term interest to the practicing power electronics engineering community. Outstanding technical content is promised to be provided at one of the lowest registration costs of any IEEE conference. To be considered as a Technical Session paper for APEC 2025, it is advised that the applicant's digest/paper should address the following: The challenge to be addressed by the paper as well as the major results and how this differs from the most relevant existing literature. Papers presented at APEC must be original material and not have been previously presented or published. The principal criteria in selecting digests will be the usefulness of the work to the practicing power electronic professional. Reviewers value evidence of completed experimental work. Authors should obtain any necessary company and governmental clearance prior to submission of digests.20.05.2024 07:00:00Maynews_2024-06-01_2.jpg\images\news_2024-06-01_2.jpghttps://x9h8yf9ab.cc.rs6.net/tn.jsp?f=001t4WCUY613RLU2gD1X_r6R-RW1DJ4GzpP9TClknaAFviLd7ZIuuwysIAlj_xj8O3uovW26xX0x7e4Wmr0AidrbsCYpOAJhiLt5S95cfZnQosmBHRuNU2tSMbI_R_oS7qv8wDqcz6Asr9ZOAkthHU9oITsWvG0E0qhhYPojznNWvUtYaO5kags7wplgZaUCCRG9PNoS_NQ_tfYq2u6kl4spm50QLIf7WQwqKC-vFq-j9B6e4z3MfkXRw==&c=6N1YA1MUwc4H1LRtGKPLalsAW5wUuJD1F4p1xQOQY8WHYCHrNXzZWg==&ch=k2pTc4uSGAY5frLwBTJc8veEbbRfvZdCN8fm2Uw8w5aZSGJNUQv7bg==apec-conf.org
New strategic PartnershipFinepower and Sanan Semiconductor signed a coopera...11922Industry NewsNew strategic PartnershipFinepower and Sanan Semiconductor signed a cooperation contract in May 2024. "We are very pleased that we gained with Finepower a trustworthy partner with an extremely high level of technical understanding," said Michael Sleven, Vice President of Sanan Europe GmbH. "We have one of the biggest vertical inline factories for SiC in the world, covering substrate materials, epitaxial growth, chip manufacturing, packaging, testing and other sections. Also, our GaN products are made on our own SiC substrates. So, we have every process step in our own hands." In China Sanan has been very active for quite a while, and now the company is expanding to Europe. Further details can be found in the VIP interview published in Bodo's Power Systems in April 2024. Sanan combines full-flow manufacturing services for long crystal, substrate, epitaxial, chip, sealing and testing. Sanan is able to control all steps of the production including quality and delivery. The scale of production capacity and technological level are competitive and will strongly guarantee the supply and meet the market demands. "Sanan's portfolio of SiC MOSFETs/diodes, SiC substrates, automotive grade SiC module foundry fits perfectly to our strategy." stated Reiko Winkler, General Manager of Finepower, during the contract signing event. Finepower is an international operating engineering and distribution company with focus on modern power electronic applications.17.05.2024 06:00:00Maynews_2024-06-01_1.jpg\images\news_2024-06-01_1.jpghttps://www.finepower.com/en/finepower.com
New Director Strategic Market Development EMEASchurter welcomed Natalie Bird to its team. Natali...11943PeopleNew Director Strategic Market Development EMEASchurter welcomed Natalie Bird to its team. Natalie Bird took up the newly created position of Director Strategic Market Development EMEA. She will play a pivotal role in advancing the market strategies across the region. With nearly two decades of experience at TE Connectivity, where she held various key roles including Key Account and Global Account Management, Natalie Bird's responsibilities will include implementing sales and product strategies to maximize revenue growth, account penetration and enhance customer satisfaction. Most recently, Natalie Bird took positions within Aptiv and Schaltbau.15.05.2024 11:00:00Maynews_2024-06-15_6.jpg\images\news_2024-06-15_6.jpghttps://www.schurter.com/en/news/new-director-of-strategic-market-development-emeaschurter.com
Series of Ultra-Low Bias Current / High-Efficiency Zener DiodesTaiwan Semiconductor announces its series of Zener...11932Product ReleaseSeries of Ultra-Low Bias Current / High-Efficiency Zener DiodesTaiwan Semiconductor announces its series of Zener diodes with a selection of devices providing regulated voltages from 1.8VDC to 39VDC, all with ultra-low bias current (I<sub>ZT</sub>) of 50µA and maximum power dissipation (P<sub>D</sub>) of 500mW. These devices are ideal for applications where exceptionally low bias current is needed (to extend battery life), essential (for energy harvesting), or desirable (in lighting and IIoT) – while still providing uncompromised Zener regulation. The 39 individual Zener diodes in the series with part numbers ranging from MMSZ4668 to MMSZ41716 are all packaged in an industry-standard, low-profile, SOD-123 surface-mount package. With their low I<sub>ZT</sub>, these devices are a straightforward upgrade to existing designs (without the need for PCB modifications), as well as for new designs.15.05.2024 09:30:00Maynews_2024-06-01_12.jpg\images\news_2024-06-01_12.jpghttps://www.taiwansemi.com/en/500mw-low-izt-1-8v-39v-surface-mount-zeners/taiwansemi.com
Monolithic Automotive asynchronous Buck ConvertersSTMicroelectronics has introduced automotive-quali...11955Product ReleaseMonolithic Automotive asynchronous Buck ConvertersSTMicroelectronics has introduced automotive-qualified step-down synchronous DC/DC converters that save space and ease integration in applications including body electronics, audio systems, and inverter gate drivers. The A6983 converter series comprises of six non-isolated step-down converters in low-consumption and low-noise configurations and the A6983I isolated buck converter. With compensation circuitry on-chip, these monolithic devices need only a few external components including filtering, feedback, and a transformer with the A6983I. The non-isolated A6983 converters can supply up to 3 A load current and achieve 88% typical efficiency at full load. The low-consumption variants (A6983C) are optimized for light-load operation, with high efficiency and low output ripple. The low-noise A6983N variants operate with constant switching frequency and minimize output ripple across the load range for optimum performance in applications such as audio-system power supplies. Both types offer a choice of 3.3 V, 5.0 V, and adjustable output voltage from 0.85 V to V<sub>IN</sub>. The A6983I is a 10 W iso-buck converter with primary-side regulation that eliminates the need for an optocoupler. Suited for use as an isolated gate driver for IGBTs or silicon-carbide (SiC) MOSFETs in traction inverters and on-board chargers (OBCs), this converter allows accurate adjustment of the primary output voltage. The transformer turns ratio determines the secondary voltage. All isolated and non-isolated variants have a low quiescent operating current of 25 µA and a power-saving shutdown mode that draws less than 2 µA.14.05.2024 14:30:00Maynews_2024-06-15_18.jpg\images\news_2024-06-15_18.jpghttps://newsroom.st.com/media-center/press-item.html/n4628.htmlst.com
LQ Relay for high inrush Currents and PiP Reflow ProcessingPanasonic Industry's LQ Series of electromechanica...11951Product ReleaseLQ Relay for high inrush Currents and PiP Reflow ProcessingPanasonic Industry's LQ Series of electromechanical Power Relays are designed for a vast field of applications. With a profile of 10 mm (W) x 20 mm (L) x 16 mm (H) these relays offer flexibility in mounting orientations. So far, the LQ Series shows a high switching capacity of up to 10 A and is available in six nominal coil voltages ranging from 5 V to 24 V, featuring 1 Form A or 1 Form C contact arrangements. The sealed construction provides enhanced environmental protection, along with a high surge withstand voltage and dielectric strength, making them well-suited for high voltage applications in ambient temperature usage, up to 85 °C and 105 °C. The ALQ6 is designed to meet the escalating demand for high inrush current capability in automated systems, particularly in motor and LED lighting control applications by handling an inrush current of up to 40 A for 100 µs, making it an suitable for capacitive loads. Now the LQ series is available in a reflow-processable variant.14.05.2024 10:30:00Maynews_2024-06-15_14.jpg\images\news_2024-06-15_14.jpghttps://industry.panasonic.eu/company/newsroom/multitalented-lq-relay-now-ready-high-inrush-currents-and-pip-reflow-processingindustry.panasonic.eu
R&D Manager returns to the TeamDanisense welcomes back Petar Ljushev as R&D Manag...11905PeopleR&D Manager returns to the TeamDanisense welcomes back Petar Ljushev as R&D Manager. Petar Ljushev had already worked for Danisense for nearly four years previously between 2019 and 2022. He holds a PhD in the field of power electronics from the Technical University of Denmark (DTU), and has many years experience in industrial companies designing power electronics, large power resistors and resistor systems for demanding applications. In his new role at Danisense, he will be focusing on developing and launching new innovative current sense transducer products based on the company's successful and proven closed loop Flux Gate technology.08.05.2024 07:00:00Maynews_2024-05-15_2.jpg\images\news_2024-05-15_2.jpghttps://danisense.com/danisense.com
Low-side Gate Driver for SiC MOSFETs and High-power IGBTsLittelfuse has launched the IX4352NE low-side SiC ...11921Product ReleaseLow-side Gate Driver for SiC MOSFETs and High-power IGBTsLittelfuse has launched the IX4352NE low-side SiC MOSFET and IGBT gate driver, which is specifically designed to drive SiC MOSFETs and high-power IGBTs in industrial applications. The key differentiator of the IX4352NE lies in its separate 9 A source and sink outputs, which enable tailored turn-on and turn-off timing while minimizing switching losses. An internal negative charge regulator also provides a user-selectable negative gate drive bias for improved dV/dt immunity and faster turn-off. The devices also offer an internal negative charge pump regulator, which eliminates the need for an external auxiliary power supply or DC/DC converter. This feature is particularly valuable for turning off SiC MOSFETs, saving valuable space typically required for external logic level translator circuitry. The logic input's compatibility with standard TTL or CMOS logic levels further enhances space-saving capabilities. The IX4352NE, which operates in the voltage range (VDD - VSS) of up to 35 V, is suited for driving SiC MOSFETs in various industrial applications such as on-board and off-board chargers, PFCs, DC/DC converters, motor controllers, and industrial power inverters. Built-in protection features such as desaturation detection (DESAT) with soft shutdown sink driver, Under Voltage Lockout (UVLO), and thermal shutdown (TSD) ensure the protection of the power device and the gate driver. The integrated open-drain FAULT output signals a fault condition to the MCU, enhancing safety and reliability.07.05.2024 16:30:00Maynews_2024-05-15_18.jpg\images\news_2024-05-15_18.jpghttps://www.littelfuse.com/about-us/news/news-releases/2024/littelfuse-unveils-ix4352ne-low-side-gate-driver-for-sic-mosfets-and-high-power-igbts.aspxlittelfuse.com
Radiation-tolerant DC/DC Power Converters for new Space ApplicationsTo meet the increased demand for standard space gr...11917Product ReleaseRadiation-tolerant DC/DC Power Converters for new Space ApplicationsTo meet the increased demand for standard space grade solutions that are reliable, cost effective and configurable, Microchip has developed a family of Radiation-Tolerant (RT) LE50-28 isolated DC/DC 50 W power converters available in nine variants with single- and triple-outputs ranging from 3.3 V to 28 V. The off-the-shelf LE50-28 family of power converters are designed to meet MIL-STD-461. The power converters have a companion EMI filter and allow for choosing one or three outputs based on the voltage range needed for the end application. This series provides flexibility to parallel up to four power converters to reach 200 W. The family of LE50-28 devices are designed for applications in new space and LEO environments where components must withstand harsh conditions, and they are available in a variety of electrical connection and mounting options. The LE50 series is manufactured with conventional surface mount and thru-hole components on a printed wiring board. This distinction in the manufacturing process can reduce time to market and risks associated with supply chain disruptions. The LE50-28 family offers space-grade radiation tolerance with 50 Krad Total Ionizing Dose (TID) and Single Event Effects (SEE) latch-up immunity of 37 MeV·cm2/mg linear energy transfer.07.05.2024 12:30:00Maynews_2024-05-15_14.jpg\images\news_2024-05-15_14.jpghttps://www.microchip.com/en-us/about/news-releases/products/radiation-tolerant-dc-dc-50-watt-power-convertersmicrochip.com
Acquisition of Vertical GaN DeveloperPower Integrations announced an agreement to acqui...11906Industry NewsAcquisition of Vertical GaN DeveloperPower Integrations announced an agreement to acquire the assets of Odyssey Semiconductor Technologies, a developer of vertical gallium-nitride (GaN) transistor technology. The transaction is expected to close in July 2024, after which all key Odyssey employees are expected to join Power Integrations' technology organization. The acquisition supports the company's ongoing development roadmap for its proprietary PowiGaN technology, which is featured in many of the company's product families including InnoSwitch ICs, HiperPFS-5 power-factor-correction ICs and the recently launched InnoMux-2 family of single-stage, multiple-output ICs. The company introduced 900- and 1250-V versions of PowiGaN technology and products in 2023. Commented Dr. Radu Barsan, Power Integrations' vice president of technology: "We are executing on an ambitious roadmap that includes driving toward cost parity with silicon MOSFETs and expanding the voltage and power capabilities of PowiGaN. Our goal is to commercialize a cost-effective high-current and high-voltage GaN technology to support higher-power applications currently served by silicon carbide (SiC), at a much lower cost and higher performance enabled by the fundamental material advantages of GaN over SiC. The experience of the Odyssey team in high-current vertical GaN will augment and accelerate these efforts."07.05.2024 08:00:00Maynews_2024-05-15_3.jpg\images\news_2024-05-15_3.jpghttps://investors.power.com/news/news-details/2024/Power-Integrations-to-Acquire-the-Assets-of-Odyssey-Semiconductor/default.aspxpower.com
SiC and more for Chinese EV ManufacturerInfineon Technologies will provide silicon carbide...11908Industry NewsSiC and more for Chinese EV ManufacturerInfineon Technologies will provide silicon carbide (SiC) power modules HybridPACK&trade; Drive G2 CoolSiC&trade; and bare die products to Xiaomi EV for its recently announced SU7 until 2027. Infineon's CoolSiC-based power modules allow for higher operating temperatures, "resulting in best-in-class performance, driving dynamics and lifetime". Traction inverters based on the technology can, for example, further increase electric vehicle range. The HybridPACK Drive is Infineon's market-leading power module family for electric vehicles, with almost 8.5 million units sold since 2017. Infineon provides two HybridPACK Drive G2 CoolSiC 1200 V modules for the Xiaomi SU7 Max. In addition, Infineon supplies Xiaomi EV with a broad range of products per car, including, for example, EiceDRIVER gate drivers and more than ten microcontrollers in various applications. The two companies also agreed to further cooperate on SiC automotive applications.06.05.2024 10:00:00Maynews_2024-05-15_5.jpg\images\news_2024-05-15_5.jpghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2024/INFXX202405-101.htmlinfineon.com
High-Capacity Regenerative Electronic LoadThe PXZ series of efficient, reliable, high-capaci...11912Product ReleaseHigh-Capacity Regenerative Electronic LoadThe PXZ series of efficient, reliable, high-capacity regenerative electronic loads from Kikusui has a rated power of 20 kW in 3U. In addition to the constant-current, constant-resistance, constant-voltage, and constant-power operating modes, this series has an I-V characteristic function that allows the user to set arbitrary I-V characteristics for each CC and CV operating mode. The series is also equipped with various functions, such as sequence, pre-charge, synchronous operation, pulse, sine, and VMCB functions. LAN, USB, and RS232C communication functions are included as standard, allowing direct integration into various evaluation systems. The PXZ series is scalable, and its capacity can be increased up to 200 kW when operating in parallel (up to 10 units).06.05.2024 06:30:00Maynews_2024-05-15_9.jpg\images\news_2024-05-15_9.jpghttps://kikusuiamerica.com/products-index/electronic-load/pxz/kikusuiamerica.com
Semiconductor Processing to Packaging Center to be built in New York State UniversitySemikron Danfoss now collaborates with SUNY Polyte...11907Industry NewsSemiconductor Processing to Packaging Center to be built in New York State UniversitySemikron Danfoss now collaborates with SUNY Polytechnic Institute and other industry partners to build a Semiconductor Processing to Packaging Center that will focus on research, education and training. The facility will be established at the Semikron Danfoss office in Utica, located in the Quad C building on the SUNY Poly campus and will train 100-150 students per year in semiconductor processing, packaging and testing capabilities. The center will be funded in part with the $4 million Empire State Development grant as well as a larger economic development package announced last fall. In addition to supplying space for two classrooms and a 5,000 square-foot clean room, Danfoss will provide multiple pieces of equipment used in the semiconductor manufacturing process. The Center will allow for both silicon device processing as well as SiC, GaN, AlN and their alloys, and Ga2O3 device processing for power electronics, optoelectronics and clean energy applications as well as their unique packaging needs. It is anticipated that the students will be both traditional and non-traditional students, seeking either degrees or certificates. The goal of the Center is to increase graduates across advanced manufacturing disciplines by 10 percent in the next four years. The Center's curriculum will offer several workforce development training and upskilling pathways for industry partners and their employees as well as those seeking to gain entrance into the workforce.02.05.2024 09:00:00Maynews_2024-05-15_4.jpg\images\news_2024-05-15_4.jpghttps://www.danfoss.com/en-us/about-danfoss/news/dps/semikron-danfoss-partners-with-suny-poly-to-establish-semiconductor-processing-to-packaging-research-education-training-center/danfoss.com
Solid-State High-Voltage Auxiliary E-Fuse Reference DesignMouser is now stocking the MSDR-EFUSE high-voltage...11920Product ReleaseSolid-State High-Voltage Auxiliary E-Fuse Reference DesignMouser is now stocking the MSDR-EFUSE high-voltage auxiliary E-Fuse reference design from Microchip Technology. Leveraging Microchip's proven 700 V and 1200 V Silicon Carbide mSiC&trade; products and other company technologies, this high-voltage auxiliary E-fuse solid-state relay demonstrator board offers designers a total system solution (TSS) to diagnose the status of current, temperature and bias supply measurements of automotive and industrial power management applications all in one reference design to avoid sourcing individual parts. The MSDR-EFUSE reference design incorporates an active circuit protection device with an integrated SiC FET and 8-bit MCU. This high-voltage, solid-state relay reference design features over-current protection (programmable in software), a configurable current-limit profile, up to a 30 A continuous output load current, and two modes of short-current detection – edge-triggered and ride-through edge-triggered. Even though the demonstrator board is equipped with only AEC-qualified components designed for automotive and electric vehicle battery-based applications (400 V or 800 V), the board also implements a time-current characteristic (TCC) curve based on thermal characterization that helps migrate to non-automotive applications such as DC solid-state circuit breakers. The MSDR-EFUSE features a 10 µs short-circuit withstand time, up to a 20 kHz switching frequency and a LIN communication interface for configurability and diagnostics. Target applications include (H)EVs, DC smart grids and industrial charging stations.30.04.2024 15:30:00Aprnews_2024-05-15_17.jpg\images\news_2024-05-15_17.jpghttps://eu.mouser.com/newsroom/publicrelations-microchip-efuse-refdesign-2024final/mouser.com
Interactive Content Series Focused on EV ElectrificationMouser Electronics has set up an interactive conte...11911Industry NewsInteractive Content Series Focused on EV ElectrificationMouser Electronics has set up an interactive content series in collaboration with Littelfuse: Electrifying the Future of eMobility features articles and infographics exploring the challenges of creating different charging solutions for a wide range of use cases. Electrification of small passenger vehicles, scooters, and commercial EVs can vary greatly. Off-road electrified vehicles used in agriculture or construction, such as tractors and bulldozers, also need more robust charging and storage capabilities than passenger vehicles. Circuit protection, battery management, and improving efficiency in electrical systems are discussed, as are the rising expectations for the occupant experience, such as advanced infotainment systems, driver assist, and vehicle autonomy. The content series also showcases many key products from Littelfuse that play important roles in addressing the design challenges of vehicle electrification. For example, Littelfuse's SiC-MOSFETs are key in managing power more efficiently within the vehicle's electrical system, offering various advantages over traditional silicon-based components. The higher efficiency of SiC-MOSFETs results in less power lost through heat. This reduces the need for extensive cooling systems, making them more suitable for the demanding environments of commercial EVs.25.04.2024 13:00:00Aprnews_2024-05-15_8.jpg\images\news_2024-05-15_8.jpghttps://eu.mouser.com/littelfuse-electrifying-emobility-ebook/mouser.com
Lithium-Ion Battery Separator Plant in CanadaAsahi Kasei announced it will construct an integra...11909Industry NewsLithium-Ion Battery Separator Plant in CanadaAsahi Kasei announced it will construct an integrated plant in Ontario, Canada for the base film manufacturing and coating of HiporeTM wet-process lithium-ion battery (LIB) separator. In relation to this plant, Asahi Kasei has concluded a basic agreement with Honda Motor, and the two parties are currently studying joint investment. Also, with regard to the Canadian plant, it has been agreed that Asahi Kasei Battery Separator Corp., which is scheduled to be established in October 2024, will receive funding from the Development Bank of Japan (DBJ) through the issuance of preferred shares. Furthermore, receipt of financial support from the federal government of Canada and the provincial government of Ontario regarding this investment is expected. The total investment will be slightly higher than 1 billion Euros. Starting 2027 the plant is expected to produce approximately 700 million square meters of coated films.25.04.2024 11:00:00Aprnews_2024-05-15_6.jpg\images\news_2024-05-15_6.jpghttps://asahi-kasei.eu/lithium-ion-battery-separator-plant/asahi-kasei.eu
Integrated GaN System-in-PackagesTransphorm and Weltrend Semiconductor announced av...11913Product ReleaseIntegrated GaN System-in-PackagesTransphorm and Weltrend Semiconductor announced availability of two GaN System-in-Packages (SiPs). When combined with Weltrend's GaN SiP announced last year, the devices establish the first SiP product family based on Transphorm's SuperGaN&reg; platform. The SiPs - WT7162RHUG24B and WT7162RHUG24C - integrate Weltrend's high frequency multi-mode (QR/Valley Switching) Flyback PWM controller with Transphorm's 150 m&#8486; and 480 m&#8486; SuperGaN FETs respectively. Like their 240 m&#8486; predecessor (WT7162RHUG24A), the devices pair with USB PD or programmable power adapter controllers to provide a total adapter solution. Other features include the UHV valley tracking charge mode, adaptive OCP compensation, and adaptive green mode control that allow engineers to design power supplies faster and with fewer components. Some key advantages of Transphorm's normally-off d-mode SuperGaN platform include its robustness (+/- 20 V gate margin with a 4 V noise immunity) and reliability (< 0.05 FIT) with the ability to increase power density by 50% over silicon. Weltrend's SiP designs complements this to create a near plug-and-play solution that speeds design while reducing form factor size.24.04.2024 07:30:00Aprnews_2024-05-15_10.jpg\images\news_2024-05-15_10.jpghttp://www.weltrend.com/en-global/news/detail/837/30weltrend.com
Spectrum Analyzer Software for Analysis of up to eight simultaneous SignalsTektronix released version 5.4 of its SignalVu Spe...11918Product ReleaseSpectrum Analyzer Software for Analysis of up to eight simultaneous SignalsTektronix released version 5.4 of its SignalVu Spectrum Analyzer Software for multi-channel modulation analysis of up to eight signals in parallel. Engineers can use this software to turn their existing oscilloscope into a comprehensive wireless system tester, instead of investing in a dedicated tester such as a vector signal analyzer. It is particularly valuable for applications requiring time-domain analysis with RF measurements. The package runs on Tektronix 5 Series MSO, 6 Series MSO or DPO70000 oscilloscopes. It addresses the complex needs of multi-signal, multi-standard, or multi-Device Under Test (DUT) scenarios, proving itself as an indispensable tool for modern RF and wireless research and development. Additionally, the introduction of shared-acquisition multi-signal support enables the simultaneous analysis of signals that are frequency-separated yet input through the same scope channel.23.04.2024 13:30:00Aprnews_2024-05-15_15.jpg\images\news_2024-05-15_15.jpghttps://www.tek.com/en/news/tektronix-unveils-signalvu-spectrum-analyzer-software-version-uktek.com
Strategic Partnership to drive Zero-Emission Bus Transport in EuropeDaimler Buses and BMZ have entered into a strategi...11892Industry NewsStrategic Partnership to drive Zero-Emission Bus Transport in EuropeDaimler Buses and BMZ have entered into a strategic partnership for the development and supply of the next generation of e-bus batteries. Together with Daimler Buses, BMZ will further develop the existing battery technology specifically for the requirements of electrically powered buses. The new battery generation NMC4 – succeeding the current NMC3 technology – will combine high energy density, resulting in a longer range for e-buses, with an ultra-long cycle life. Customers of Daimler Buses will be able to use NMC4 batteries from the middle of the decade. Daimler Buses is pursuing an e-roadmap across all segments: Electrically powered city buses have already been in series production since 2018; intercity e-buses are to follow as of the middle of the decade and electrified coaches by 2030. With this, Daimler Buses aims to offer locally CO2-neutral models based on batteries or hydrogen in every segment by 2030.23.04.2024 13:00:00Aprnews_2024-05-01_8a.jpg\images\news_2024-05-01_8a.jpghttps://bmz-group.com/images/PDF-Downloads/press-release/202240422_FINAL_Press_news_Daimler_Buses_BMZEN.pdfbmz-group.com
Energy-Saving DC/DC Converter ICs in TSOT23 PackageROHM has developed four compact DC/DC step-down co...11899Product ReleaseEnergy-Saving DC/DC Converter ICs in TSOT23 PackageROHM has developed four compact DC/DC step-down converter ICs suitable for consumer and industrial applications, including refrigerators, washing machines, PLCs, and inverters. ROHM is expanding the lineup which includes the BD9E203FP4-Z, a 2A buck converter with switching frequency of 350kHz. The company has developed products that achieve higher efficiency in an even smaller package than existing SOP-J8 (JEDEC standard: SOIC8 equivalent) products. These converter ICs deliver an output current of 1 A to 3 A in the compact TSOT23 package (2.8 mm × 2.9 mm). This reduces component area by up to 72% compared to the general SOP-J8 package (4.9 mm × 6.0 mm), contributing to the miniaturization of power supply blocks. On top, adopting a flip chip on lead frame TSOT23 package design enables high-efficiency operation by eliminating bond wire resistance. The BD9E105FP4-Z, BD9E202FP4-Z, and BD9E304FP4-LBZ also utilize a COT control mode during light load operation. As a result, efficiency during light load operation is improved over standard products, making them well-suited for applications requiring low standby power consumption. In addition to the ICs, evaluation boards together with various support tools are available that enable immediate evaluation during application design.23.04.2024 10:30:00Aprnews_2024-05-01_15a.jpg\images\news_2024-05-01_15a.jpghttps://www.rohm.com/news-detail?news-title=2024-04-23_news_dcdc&defaultGroupId=falserohm.com
High-Temperature Inductors are resistant to Thermal AgingWürth Elektronik supplements its molded power indu...11897Product ReleaseHigh-Temperature Inductors are resistant to Thermal AgingWürth Elektronik supplements its molded power inductors series with the high-temperature versions WE-MAPI and WE-LHMI. The inductors can be used continuously at high rated currents in a temperature range from -55 °C to +150 °C. The compact components have been tested for thermal aging for over 1000 hours at 200 ºC and are qualified to AEC-Q200. High temperatures in inductors with an iron alloy magnetic core result in thermal aging phenomena. Core losses rise sharply and efficiency drops. Aging can lead to increased self-heating in the component, which in turn exacerbates thermal aging. By expanding its inductor series, Würth Elektronik offers power inductors that are not only unaffected by thermal aging but also do not suffer any performance loss. The SMT power inductors boast low losses, high efficiency, lightweight design, and a low package profile. Their high-current-carrying capacity and capability of handling high transient current peaks can be utilized in applications such as DC/DC converters for high currents in power supplies or for field programmable gate arrays (FPGA), point of load (POL) converters or CPU/RAM power supplies.23.04.2024 08:30:00Aprnews_2024-05-01_13a.jpg\images\news_2024-05-01_13a.jpghttps://www.we-online.com/en/news-center/press?d=thermal-agingwe-online.com
Measurement Facility in Bengaluru/IndiaRohde & Schwarz has inaugurated a facility center ...11891Industry NewsMeasurement Facility in Bengaluru/IndiaRohde & Schwarz has inaugurated a facility center in Bengaluru's Manyata Tech Park, housing R&D, system integration as well as calibration and repair services. For Rohde & Schwarz, India is not merely a growth market but a vital component of its global strategy. The R&D team in Bengaluru is involved in developing next generation. The facility houses an ISO 9001 and ISO17025 (NABL) accredited calibration and repair service center, offering precision services to meet the rigorous quality standards of the industry. Furthermore, the facility will also encompass sales, applications, systems integration and a dedicated demo display area showcasing various test and measurement equipment and test solutions.22.04.2024 12:00:00Aprnews_2024-05-01_7a.jpg\images\news_2024-05-01_7a.jpghttps://www.rohde-schwarz.com/uk/about/news-press/all-news/rohde-schwarz-expands-footprint-in-india-by-opening-new-state-of-the-art-facility-in-bengaluru-press-release-detailpage_229356-1490561.htmlrohde-schwarz.com
Silicon Carbide Wafer Supply AgreementROHM and STMicroelectronics announced the expansio...11887Industry NewsSilicon Carbide Wafer Supply AgreementROHM and STMicroelectronics announced the expansion of the existing multi-year, long-term 150 mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, which is a ROHM group company. The multi-year agreement governs the supply of larger volumes of SiC substrate wafers manufactured in Nuremberg, Germany, for a minimum expected value of $230 million. Geoff West, EVP and Chief Procurement Officer, STMicroelectronics, commented "This expanded agreement with SiCrystal will bring additional volumes of 150mm SiC substrate wafers to support our devices manufacturing capacity ramp-up for automotive and industrial customers worldwide. It helps strengthen our supply chain resilience for future growth, with a balanced mix of in-house and commercial supply across regions". "SiCrystal is a group company of ROHM, a leading company of SiC, and has been manufacturing SiC substrate wafers for many years. We are very pleased to extend this supply agreement with our longstanding customer ST. We will continue to support our partner to expand SiC business by ramping up 150mm SiC substrate wafer quantities continuously and by always providing reliable quality". said Dr. Robert Eckstein, President and CEO of SiCrystal, a ROHM group company.22.04.2024 08:00:00Aprnews_2024-05-01_3a.jpg\images\news_2024-05-01_3a.jpghttps://www.rohm.com/news-detail?news-title=2024-04-22_news&defaultGroupId=falserohm.com
Power Factor Correction ChokesITG Electronics has introduced a line of power fac...11903Product ReleasePower Factor Correction ChokesITG Electronics has introduced a line of power factor correction (PFC) chokes whose slim design enables engineers to incorporate them into tight spaces. The company's PFC282820B and PFC282822B series of PFC chokes are suitable for 500 - 1000 W continuous conduction mode PFC boost converter applications. ITG Electronics also offers a wider design (27.5 x 28.5 mm3) compatible with power systems up to 2,000 W. These devices are part of ITG Electronics' broader Cubic Design PFC Choke series. Compared with traditional, toroidal-shaped PFC chokes, the new series extension incorporates a flat wire and square core to save space and increase power density. ITG Electronics' range of PFC chokes are appropriate for AC to DC power conversion in industrial equipment and automative components manufacturing environments.21.04.2024 14:30:00Aprnews_2024-05-01_19a.jpg\images\news_2024-05-01_19a.jpghttps://itg-electronics.com/en/series/909itg-electronics.com
Integration of Power Supply Company completedWith the official change of name, the legal step h...11893Industry NewsIntegration of Power Supply Company completedWith the official change of name, the legal step has been completed: Emtron electronic GmbH is now called FORTEC Power GmbH. Emtron electronic GmbH has already been part of FORTEC Elektronik AG since 1998. In July 2023, a change to a "branded house" was initiated within the FORTEC Group, i.e. holistic corporate brands were designed for the FORTEC group subsidiaries in order to offer the comprehensive product range of Display Technology, Embedded and Power Supplies under one brand and to appear as "FORTEC One" in communication with the market.19.04.2024 14:00:00Aprnews_2024-05-01_9a.jpg\images\news_2024-05-01_9a.jpghttps://emtron.de/Blog/emtron-ist-jetzt-fortec-poweremtron.de
Innauguration of Plant in MalaysiaLEM chose to make such a substantial investment in...11886Industry NewsInnauguration of Plant in MalaysiaLEM chose to make such a substantial investment in the state of Penang/Malaysia by opening a new plant in this region. From employing around 70 people in April 2024, LEM expects to increase the headcount to more than 200 people by March 2025 and eventually more than 500, with sales from the factory expected to reach over € 200 millions. With plans in place already for an extension on the additional 5,000 m<sup>2</sup> of land, the new 11,800 m<sup>2</sup> factory features a state-of-the-art logistic system including automatic guided vehicles (AGVs) on the shopfloor which transport components from the warehouse to the high-tech production lines. LEM Malaysia is also the pilot for the roll-out of the company's ERP system and will produce a substantial part of its energy through solar panels.19.04.2024 07:00:00Aprnews_2024-05-01_2a.jpg\images\news_2024-05-01_2a.jpghttps://www.lem.com/en/lem-inaugurates-new-hightech-plant-malaysia#:~:text=New%20Factory%20in%20Penang%20Fuels%20Growth%20and%20Sustainability&text=From%20employing%20around%2070%20people,to%20reach%20over%20%E2%82%AC200m.lem.com
Call for Papers for Power Electronics Conference in 2025After the EPE editions Grenoble 1987, Toulouse 200...11910Event NewsCall for Papers for Power Electronics Conference in 2025After the EPE editions Grenoble 1987, Toulouse 2003, Lille 2013 and Lyon 2020, the 26th edition of the European Conference on Power Electronics and Applications will take place in Paris, France. The Power Electronics community will gather in Paris, from March 31st to April 4th, 2025, to exchange views on research progress and technological developments. Several tutorials as well as some technical visits will be planned and organized. In addition, the 40 years of EPE conferences will be celebrated. Now the organizer has started the call for papers for "the largest conference in its field, attracting experts from numerous countries to join in the discussions". With the objective to exchange and meet fellow professionals and academics, the EPE conference brings together researchers, engineers, etc. working at the forefront of power electronics technologies. The main topics will be electromobility, smart grids and renewable energy, energy storage systems, digitalization ("the powerful fusion of ai and IoT for sustainability"), sustainable and affordable power electronics as well as energy transition and societal change.18.04.2024 12:00:00Aprnews_2024-05-15_7.jpg\images\news_2024-05-15_7.jpghttps://epe2025-paris.com/epe2025-paris.com
GaN IC enables solar-powered Irrigation PumpNavitas has announced, that Virtual Forest one of ...11890Industry NewsGaN IC enables solar-powered Irrigation PumpNavitas has announced, that Virtual Forest one of India's leading electronics design companies specializing in motor control and human interface technologies for consumer appliances, fluid movement and mobility, has adopted its GaNFast power integrated circuits (IC) technology for a zero-emission, powerful 3 hp (2,250 W) solar-powered irrigation pump. This pump is remotely accessed via quad-band IoT with low power consumption. It can raise 200 l of water per minute to a height of about 30 m, enough to water 3 acres of farmland, and help to produce 10 tonnes of wheat. Further, the IoT enabled solar pump ensures optimal water usage through intelligent analytics, therefore minimizing ground water utilization. Currently, the majority of pumps in this area is powered by polluting and noisy diesel generators or expensive, lossy long-distance electrical cables. The Virtual Forest solar pump with maximum power point tracking (MPPT) operates in conjunction with solar panel and energy storage to provide robust, energy-independent and pollution-free performance at the point of use. In this application two GaN power FETs with GaN drivers, level-shifters, protection features and high-efficiency loss-less current sensing NV6269 half-bridge ICs are used.18.04.2024 11:00:00Aprnews_2024-05-01_6a.jpg\images\news_2024-05-01_6a.jpghttps://navitassemi.com/navitas-virtual-forest-join-hands-to-advance-net-zero-in-agriculture/navitassemi.com
Fully integrated 48 W Power Supply Board mount ModuleThe PSDG-48 series is a fully integrated COTS mult...11902Product ReleaseFully integrated 48 W Power Supply Board mount ModuleThe PSDG-48 series is a fully integrated COTS multi-output 48 W isolated power supply board mount module from Gaia Converter. Dedicated to 24 & 28 VDC military and High Reliability applications, MIL-STD-461, MIL-STD-704, MIL-STD-1275, ABD100 and DO160 power supply requirements are all built into this module. It is equipped with an integrated EMI filter, reverse polarity protection, hold-up function (50 ms transparency timing managed with external capacitor), high & low input voltage transients and inrush current limit and short circuit and over-voltage protected outputs. The module operates from -40 °C to +105 °C (full load case operating temperature range) and is suitable for all rugged applications complying with MIL-STD-202 & 810 for altitude, humidity, temperature shocks & cycles, mechanical vibrations and shocks. The power supplys of the PSDG series use a fixed high frequency switching topology. It is fully encapsulated with thermally conductive resin for optimal power dissipation in harsh environments. The complete power supply efficiency up to 87%. It is integrated in a black anodized machined aluminium case measuring 91 x 54 x 9 mm<sup>3</sup>.17.04.2024 13:30:00Aprnews_2024-05-01_18a.jpg\images\news_2024-05-01_18a.jpghttps://www.gaia-converter.com/new-flhg-60-m-n-copy/gaia-converter.com
Automotive linear RegulatorsSTMicroelectronics' LDH40 and LDQ40 voltage regula...11916Product ReleaseAutomotive linear RegulatorsSTMicroelectronics' LDH40 and LDQ40 voltage regulators for automotive and industrial applications start-up from a 3.3V input and operate with up to 40 V applied. The LDH40 delivers up to 200 mA and is available in one version only, having adjustable output voltage from 1.2 V to 22 V. The 250 mA LDQ40 is available with a 1.2 V – 12 V adjustable output and a choice of 1.8 V, 2.5 V, 3.3 V, and 5.0 V fixed output voltages. The quiescent current of 2 µA at zero load and 300nA logic-controlled shutdown mode help preserve battery energy in always-on standby systems. The devices are stabilized with a small ceramic capacitor on the output. The automotive devices are AEC-Q100 qualified and packaged as 2 mm x 2 mm DFN6L devices with wettable flanks that ease PCB design and facilitate automated optical inspection. Their wide input-voltage range allows connection to a vehicle 12 V bus, that can reach up to 40 V transient, to power infotainment systems, instrument clusters, and ADAS. All the LDOs have system protection and management features including internal current limiting, thermal protection, soft-start, and output active discharge. There is an enable pin for shutdown control and a power-good pin for diagnostic monitoring. The LDQ40 devices also have short-circuit protection.17.04.2024 11:30:00Aprnews_2024-05-15_13.jpg\images\news_2024-05-15_13.jpghttps://newsroom.st.com/media-center/press-item.html/n4625.htmlst.com
European and Korean Semiconductor Manufacturer cooperate on GaN and SiC SweGaN, a European semiconductor manufacturer that...11888Industry NewsEuropean and Korean Semiconductor Manufacturer cooperate on GaN and SiC SweGaN, a European semiconductor manufacturer that develops and produces engineered high-performance Gallium Nitride on Silicon Carbide (GaN-on-SiC) epitaxial wafers, announces it has entered strategic partnership with South Korea based RFHIC Corporation. RFHIC is active in designing and manufacturing GaN RF & microwave semiconductors for communications and defense applications. The agreement encompasses an undisclosed equity investment from RFHIC.  The two companies will focus on joint R&D and product development moving forward. Over the last decade, SweGaN has been developing and producing high-performance GaN-on-SiC epitaxial solutions for RF and power devices that can be used in various applications such 5G telecommunications infrastructure, defense radars, satellite communications, on-board chargers, and data centers. This strategic investment by RFHIC shows the recognition of SweGaN's QuanFINE&reg; epitaxial solutions as a differentiator among GaN-on-SiC materials available on the market. In partnership with RFHIC, SweGaN gains additional resources to expedite market penetration and to achieve its business goals. RFHIC Corporation cites the partnership with SweGaN and investment strategy target strengthening RFHIC's gallium nitride semiconductor supply chain and further fortifying its competitiveness of RF and microwave products within the compound semiconductor arena. In the joint collaboration, SweGaN and RFHIC plan to address the increasing demand for GaN semiconductors and initiate new product developments for a variety of markets.15.04.2024 09:00:00Aprnews_2024-05-01_4a.jpg\images\news_2024-05-01_4a.jpghttps://swegan.se/3087/swegan.se
Expanded Power PortfolioTektronix has acquired EA Elektro-Automatik (EA), ...11895Industry NewsExpanded Power PortfolioTektronix has acquired EA Elektro-Automatik (EA), a principal supplier of high-power electronic test solutions for energy storage, mobility, hydrogen, and renewable energy applications. The introduction of EA to the Tektronix team provides the company with expanded solutions, leveraging Tektronix's oscilloscopes and isolated probes, EA's power supplies and electronic loads, and Keithley's source meters and instrumentation. Combined, the Tektronix portfolio offers a set of capabilities for energy storage and power electronics design needs, from ultra-low to ultra-high power. With the addition of EA, Tektronix is well equipped to serve engineers who are electrifying our world. With emphasis on creating solutions for power electronics in the semiconductor, aerospace, and automotive industries, the Tektronix and EA product portfolio addresses issues in energy storage, mobility, and hydrogen fuel.12.04.2024 16:00:00Aprnews_2024-05-01_11a.jpg\images\news_2024-05-01_11a.jpghttps://www.tek.com/en/blog/ea-elektro-automatik-greatly-expands-tektronixs-high-power-test-and-measurement-coveragetek.com
300 mm Wafer Fab dedicated for Power SemiconductorsRenesas has started operations at its Kofu Factory...11894Industry News300 mm Wafer Fab dedicated for Power SemiconductorsRenesas has started operations at its Kofu Factory, located in Kai City, Yamanashi Prefecture, Japan. Renesas aims to boost its production capacity of power semiconductors in anticipation of the growing demand in electric vehicles (EVs). The Kofu Factory previously operated both 150 mm and 200 mm wafer fabrication lines until October 2014. Renesas made the decision to re-open the factory as a 300 mm wafer fab to support the growing demand for power semiconductors. The factory will start mass production of IGBTs and other products in 2025, doubling Renesas' current production capacity for power semiconductors.12.04.2024 15:00:00Aprnews_2024-05-01_10a.jpg\images\news_2024-05-01_10a.jpghttps://www.renesas.com/us/en/about/press-room/renesas-commences-operations-kofu-factory-dedicated-300-mm-wafer-fab-power-semiconductorsrenesas.com
Two-Stage EMI FiltersEMIS now offers the MF410 series of single phase t...11919Product ReleaseTwo-Stage EMI FiltersEMIS now offers the MF410 series of single phase two stage EMI filters which are especially designed for applications with low impedance loads creating pulsed, continuous or intermittent interference noise and where high levels of mains borne interference may be present. The MF410 series provides high attenuation for both line-to-ground and line-to-line emissions and are available with power ratings from 1 A to 100 A. They are available in a number of termination options including Faston and screw connectors. Typical applications include industrial equipment and factory automation, servo drives and motor controllers, appliances, electronic data processing equipment, power supplies as well as medical equipment. The maximum continuous operating voltage is 250 V<sub>AC</sub> @ 50/60 Hz and DC while the operating frequency spans from DC – 400 Hz. The temperature range is specified -25 °C to +85 °C.11.04.2024 14:30:00Aprnews_2024-05-15_16.jpg\images\news_2024-05-15_16.jpghttps://emisglobal.com/products/emi-filters/single-phase/dual-stage/mf-410/emisglobal.com
Tiny Encapsulated Buck Regulators Supply up to 20 A with up to 94% EfficiencyRECOM now offers a range of four encapsulated buck...11898Product ReleaseTiny Encapsulated Buck Regulators Supply up to 20 A with up to 94% EfficiencyRECOM now offers a range of four encapsulated buck regulators in ultra-compact, thermally enhanced LGA and QFN packages with output current ratings of 1, 3, 10, and 20 A for cost-sensible markets. The first product, the RPL-1.0, comes in a 3 mm x 3 mm LGA footprint with a "height" of 2 mm and operates over an input range of 3 to 22 V with an adjustable output of 0.6 to 12 V. 1 A output will still be available when the ambient temperature exceeds 80 °C, depending on input/output voltage combinations with operation temperatures up to 125 °C ambient possible, however, with derating. Efficiency is up to 95%. RPH-3.0 is integrated in a 47-pad QFN package measuring 10 mm x 12 mm x 4 mm height, and provides 3 A at the output over an input range of 4.5 to 55 V. Its adjustable output range spreads from 1 to 15 V. Efficiency is up to 91%, and full output current can be delivered even at temperatures beyond 80 °C, for example at 12 Vin and 3.3 V<sub>out</sub>. The third device, RPL-10, is rated at 10 A output and offers several additional features. Integrated in an LGA-M package (7 mm x 7 mm x 4.4 mm) the regulator operates with input voltages between 4 and 16 V while the programmable output voltage can be in the range of 0.6 to 5.5 V. Finally, the RPL-20 is claimed to take the "power density to a new level" with its 20 A rating from a programmable output of 0.6 to 5.5 V. Its input range spans from 4 to 16 V, and the maximum efficiency is 94%.11.04.2024 09:30:00Aprnews_2024-05-01_14a.jpg\images\news_2024-05-01_14a.jpghttps://recom-power.com/en/rec-n-new-rpl-and-rph-buck-converters-provide-up-to-20a-315.html?3recom-power.com
USB Type-C Protection Switch for increased Efficiency and SafetyAlpha and Omega Semiconductor (AOS) has released t...11896Product ReleaseUSB Type-C Protection Switch for increased Efficiency and SafetyAlpha and Omega Semiconductor (AOS) has released the AOZ1377DI Type-C Protection Switch which is designed to enhance USB Type-C efficiency and safety. These protection Type-C switches have a current-limiting switch targeting applications that require comprehensive protections. AOZ1377DI supports up to 7 A with an input voltage of up to 20 V, making it usable for both sink and source applications. The AOZ1377DI offers features that significantly reduce voltage drop and power loss compared to back-to-back p-channel devices typically used in such applications. The device supports an input operating voltage range of 3.4 V to 23 V, with both V<sub>IN</sub> and V<sub>OUT</sub> terminals rated at a maximum of 28 V, and is capable of up to 7 A. These devices are suited for high-power applications requiring multi-port Type-C PD 3.0 current source supporting up to 100 W like in high-performance laptops, personal computers, monitors, docking stations, and other Type-C port applications. The AOZ1377DI has a True Reverse Current Blocking (TRCB) protection, which prevents undesired reverse current from V<sub>OUT</sub> to V<sub>IN</sub>. It also features an internal current-limiting and short-circuit current limit that protects the source device from large load current. The current limit threshold can be set externally with a resistor. Furthermore, the integrated back-to-back MOSFET is said to deliver "the industry's lowest ON resistance and highest SOA to safely handle high currents and a wide range of output capacitances on V<sub>OUT</sub>".11.04.2024 07:30:00Aprnews_2024-05-01_12a.jpg\images\news_2024-05-01_12a.jpghttps://aosmd.com/sites/default/files/2024-04/AOS_1377DI-01_02_PR.pdfaosmd.com
Taiwanese Company opens Office in JapanThe Taiwanese MOSFET manufacturer PANJIT has offic...11885Industry NewsTaiwanese Company opens Office in JapanThe Taiwanese MOSFET manufacturer PANJIT has officially opened its Japan branch in Tokyo. This is a significant milestone and it shows PANJIT's dedication to global expansion and its commitment to serving the Japanese market. The Japan branch will serve as a key hub in Asia, enhancing service efficiency and improving communication with Japanese clients. This initiative aims to provide tailored solutions and localized support. At the opening ceremony, Jason Fang, President of the PANJIT Group, highlighted the significance of the Japan office: "The establishment of our Japan branch is central to our global ambitions and our dedication to the Japanese market. We are committed to delivering prompt, tailored service to ensure our Japanese customers feel highly valued and supported."11.04.2024 06:00:00Aprnews_2024-05-01_1a.jpg\images\news_2024-05-01_1a.jpghttps://www.panjit.com.tw/en/News/PANJIT_Japan_Grand_Openingpanjit.com.tw
Wide Bandgap Applications Workshop in SwedenWBG Power Center and RISE, in collaboration with Y...11853Event NewsWide Bandgap Applications Workshop in SwedenWBG Power Center and RISE, in collaboration with Yole Group are pleased to announce the international workshop in applications of wide bandgap (WBG) power electronics, SCAPE 2024. The event will cover the latest results and innovations in power electronics applications of wide bandgap materials, such as silicon carbide and gallium nitride. SCAPE 2024 (previously known as ISiCPEAW and IWBGPEAW) is a three-day event, consisting of two workshop days, May 14 - 15, preceded by one tutorial day, May 13. The program is defined by WBG experts and reflects the status of WBG from an industry point of view. Specialists from all over the world will present their views on status, ongoing development and the opportunities of applications in the power electronics area. They will also present the latest products and solutions and will be available for detailed technical discussions.10.04.2024 19:00:00Aprnews_2024-04-15_14.jpg\images\news_2024-04-15_14.jpghttps://www.scape2024.se/scape2024.se
1 W Isolated and Regulated DC/DC is just 1.18 mm tallRecom has introduced fully integrated RxxC1TF isol...11864Product Release1 W Isolated and Regulated DC/DC is just 1.18 mm tallRecom has introduced fully integrated RxxC1TF isolated DC/DC converters, which offer tightly regulated and selectable outputs at 3.3 V or 5 V in a 12-pad LGA surface mount package, just 5 x 4 x 1.18 mm<sup>3</sup>. The product is rated for 200 mA output up to 80 °C ambient, with derating to 125 °C, with an input range of 3 to 5.5 V<sub>DC</sub>. Despite the tiny size of the part, an isolation rating of 3 kV<sub>AC</sub> is achieved for 1 s along with full line and load regulation, on/off control, selectable outputs, and full protection against input under-voltage, over-temperature, and output overload and short circuits. Isolation capacitance is specified at 5 pF typical. Applications for the RxxC1TF include COM port and sensor isolation in industrial and building automation, datacomms, and IoT.09.04.2024 16:30:00Aprnews_2024-04-15_25.jpg\images\news_2024-04-15_25.jpghttps://recom-power.com/en/company/newsroom/rec-n-new-standard-set-for-a-1w-isolated-and-regulated-dc!sdc-313.html?3recom-power.com
Power MOSFETs with high-speed Body DiodeToshiba has launched a range of 650 V N-channel po...11901Product ReleasePower MOSFETs with high-speed Body DiodeToshiba has launched a range of 650 V N-channel power MOSFETs. The TK042N65Z5 and TK095N65Z5 in TO-247 package are the first high-speed diode (HSD) type products in the latest generation DTMOS VI series. This generation has a super junction structure suitable for switching power supplies in demanding applications including data centres and power conditioners for photovoltaic (PV) generators. The two power MOSFETs use intrinsic high-speed diodes to improve the reverse recovery characteristics to enhance bridge and inverter circuit applications. Compared to the standard DTMOS VI products, the TK042N65Z5 and TK095N65Z5 achieve a 65% reduction in reverse recovery time (t<sub>rr</sub>) with values of 160 ns and 115 ns, respectively. Compared with Toshiba standard MOSFETs, the products reduce the reverse recovery charge (Q<sub>rr</sub>) by 88% and drain cut-off current at high temperatures by up to 90% (TK042N65Z5). Additionally, the key figure of merit (FoM) of "drain-source On-resistance × gate-drain charge" (R<sub>DS(ON)</sub> * Q<sub>gd</sub>) has been reduced by approximately 72% compared with Toshiba's existing TK62N60W5. These features reduce power losses of equipment, which helps efficiency. For example, in a 1.5 kW LLC circuit the TK042N65Z5 shows around 0.4% improvement in power supply efficiency over the previous TK62N60W5. TK042N65Z5 and TK095N65Z5 have R<sub>DS(ON)</sub> values of 42 m&#8486; and 95 m&#8486;, respectively. They are capable of delivering drain currents (I<sub>D</sub>) up to 55 A and 29 A. Both devices are housed in a TO-247 package. Furthermore a reference design is available.09.04.2024 12:30:00Aprnews_2024-05-01_17a.jpg\images\news_2024-05-01_17a.jpghttps://toshiba.semicon-storage.com/eu/company/news/2024/04/mosfet-20240409-1.htmltoshiba.semicon-storage.com
GaN FETs for High-Performance Class-D Audio AmplifiersEPC has launched the EPC9192 reference design for ...11900Product ReleaseGaN FETs for High-Performance Class-D Audio AmplifiersEPC has launched the EPC9192 reference design for efficient Class-D audio amplifiers. The EPC9192 showcases the capabilities of EPC's 200 V, EPC2307, eGaN FETs in a ground-referenced, split dual supply Single-Ended (SE) design, delivering 700 W per channel into a 4 &#8486; load. The EPC9192 features a modular design that allows for scalability and expandability. The motherboard hosts two PWM modulators and two half bridge power stage daughterboards, implementing a two-channel amplifier with 12 V housekeeping supplies and protections. Users are able to customize the PWM modulator and power stage, facilitating the evaluation and comparison of different devices and modulation techniques. The EPC9192 provides a dual split supply input, unregulated, ±42 V to ±85 V for power stage while its analog inputs may be balanced (XLR) or unbalanced (RCA). It is configurable for two independent SE channels or single channel BTL mode. Undervoltage, Overvoltage, Overcurrent, and Overtemperature protections are included in the device. Its switching frequency is beyond 600 kHz while the noise floor is 40 µV, and the frequency response in the range of 5 Hz - 20 kHz is +/- 0.5 dB, regardless of load.09.04.2024 11:30:00Aprnews_2024-05-01_16a.jpg\images\news_2024-05-01_16a.jpghttps://epc-co.com/epc/about-epc/events-and-news/news/artmid/1627/articleid/3168/design-high-performance-class-d-audio-amplifiers-with-gan-fetsepc-co.com
Power MOSFETs with high-speed Body DiodeToshiba has launched a range of 650 V N-channel po...11859Product ReleasePower MOSFETs with high-speed Body DiodeToshiba has launched a range of 650 V N-channel power MOSFETs. The TK042N65Z5 and TK095N65Z5 are the first high-speed diode (HSD) type products in the latest generation DTMOS VI series – with a super junction structure suitable for switching power supplies in applications including data centres and power conditioners for photovoltaic generators. The MOSFETs use intrinsic high-speed diodes to improve the reverse recovery characteristics to enhance bridge and inverter circuit applications. Compared to the standard DTMOS VI products, the TK042N65Z5 and TK095N65Z5 achieve a 65% reduction in reverse recovery time (t<sub>rr</sub>) with values of 160 ns and 115 ns, respectively. Compared with Toshiba's standard MOSFETs, the devices reduce the reverse recovery charge (Q<sub>rr</sub>) by 88% and drain cut-off current at high temperatures by up to 90% (TK042N65Z5). Additionally, the key figure of merit (FoM) of R<sub>DS(ON)</sub> * Q<sub>gd</sub> has been reduced by approximately 72% compared with Toshiba's existing TK62N60W5. For example, in a 1.5 kW LLC circuit the TK042N65Z5 shows around 0.4% improvement in power supply efficiency over the previous TK62N60W5. TK042N65Z5 and TK095N65Z5 have R<sub>DS(ON)</sub> values of 42 m&#8486; and 95 m&#8486;, respectively, delivering drain currents up to 55 A and 29 A. Both devices are housed in a TO-247 package.09.04.2024 11:30:00Aprnews_2024-04-15_20.jpg\images\news_2024-04-15_20.jpghttps://toshiba.semicon-storage.com/eu/company/news/2024/04/mosfet-20240409-1.htmltoshiba.semicon-storage.com
Replacement for Reed Switches and Hall Effect SensorsTaiwan Semiconductor has introduced a fully integr...11915Product ReleaseReplacement for Reed Switches and Hall Effect SensorsTaiwan Semiconductor has introduced a fully integrated Anisotropic Magneto Resistance (AMR) sensor that replaces reed switches and hall effect sensors in industrial applications. The TSHA2101 is an integrated system-on-chip (SIP) requiring little to no added circuitry. Its omni-polar design automatically detects a horizontal magnetic field of either polarity. When positioned to detect a magnet located on a linear or rotational element, the TSHA2101 acts as a non-contact switch with low power consumption, high sensitivity and high reliability. As a replacement for traditional mechanical reed switches, the TSHA2101 boasts faster response time, superior durability and resistance to wear and degradation over time. Compared to conventional hall effect devices, the AMR sensors' wider magnetic field detection allows designers to use smaller and thinner magnets in their applications. Designed for industrial applications, the TSHA2101 AMR device can be operated with supply voltage range from 2.7 to 30 V<sub>DC</sub>, in an operating temperature environment ranging from -40 °C to +105 °C. It also features -30 V reverse voltage protection and output overcurrent protection.09.04.2024 10:30:00Aprnews_2024-05-15_12.jpg\images\news_2024-05-15_12.jpghttps://www.taiwansemi.com/en/integrated-amr-for-cylinder-position-detection/taiwansemi.com
Position in Automotive Semiconductor Market improvedInfineon Technologies continued to expand its mark...11889Industry NewsPosition in Automotive Semiconductor Market improvedInfineon Technologies continued to expand its market position in automotive semiconductors in 2023. According to the latest research by TechInsights, the global automotive semiconductor market grew by 16.5 percent in 2023, reaching a new record size of US$ 69.2 billion. Infineon's overall market share increased by one percentage point, from nearly 13 percent in 2022 to about 14 percent in 2023, solidifying the company's position as a global leader in the automotive semiconductor market. Infineon's semiconductors are used in automotive key applications like driver assist and safety systems, powertrain and battery management, comfort, infotainment and security. According to TechInsights, Infineon has increased its market share in all regions and remained market leader in South Korea and China. In addition, the semiconductor manufacturer has made significant gains in the Japanese automotive semiconductor market. Infineon has strengthened its strong European presence as the second-largest player, as well as its top three position in North America. A major driver of Infineon's performance was strong automotive microcontroller (MCU) sales. For the first time, Infineon has reached the world's number one position in this market.09.04.2024 10:00:00Aprnews_2024-05-01_5a.jpg\images\news_2024-05-01_5a.jpghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2024/INFATV202404-091.htmlinfineon.com
250 W Medical and Industrial Power Supply SeriesTDK announces additional output voltage models to ...11857Product Release250 W Medical and Industrial Power Supply SeriesTDK announces additional output voltage models to the 250 W rated TDK-Lambda brand CUS250M series of power supplies in the industry standard 2 inches x 4 inches footprint. The full range now covers 12 V, 15 V, 18 V, 24 V, 28 V, 36 V and 48V and is certified to the IEC 62368-1 and IEC 60601-1 safety standards for industrial and medical applications. This includes both Class I and Class II (no earth ground required) installations. The CUS250M has mechanical configurations that enable convection and/or conduction cooling through the product's baseplate to provide silent cooling. Applications include medical, home healthcare, dental, test, measurement, broadcast, professional audio and industrial equipment. The output can be adjusted to accommodate non-standard voltages, either by the factory or using the on-board potentiometer. The CUS250M operates across an 85 to 264 V<sub>AC</sub> input and has a earth leakage current of less than 150 µA – including all tolerances. The touch current is <10 µA (Class I) and <70 µA (Class II). In ambient temperatures of -20 °C to +45 °C the CUS250M can deliver up to 250 W conduction cooled without external air. With appropriate derating, operation at up to +80°C is also possible.09.04.2024 09:30:00Aprnews_2024-04-15_18.jpg\images\news_2024-04-15_18.jpghttps://www.emea.lambda.tdk.com/uk/news/article/19923lambda.tdk.com
Expansion of Partnership with FoundryMicrochip announced it has expanded its partnershi...11848Industry NewsExpansion of Partnership with FoundryMicrochip announced it has expanded its partnership with the semiconductor foundry TSMC to enable a specialized 40 nm manufacturing capacity at Japan Advanced Semiconductor Manufacturing (JASM), TSMC's majority-owned manufacturing subsidiary in Kumamoto Prefecture, Japan. This partnership is part of Microchip's ongoing strategy to build resiliency in its supply chain. Other initiatives include investing in additional technology to boost internal manufacturing capabilities and capacity, as well as establishing more geographical diversity and redundancy with wafer fab, foundry, assembly, test and OSAT partners. The TSMC partnership and JASM capacity adds more assurance to the manufacturing landscape, helping reduce Microchip's potential of disrupted supply by offsetting external factors such as frequently changing business conditions and natural disasters.08.04.2024 14:00:00Aprnews_2024-04-15_9.jpg\images\news_2024-04-15_9.jpghttps://www.microchip.com/en-us/about/news-releases/corporate/microchip-technology-expands-partnership-with-tsmc-to-strengthenmicrochip.com
Maximum Isolation for Battery Management SystemsWürth Elektronik expands its WE-BMS transformer se...11914Product ReleaseMaximum Isolation for Battery Management SystemsWürth Elektronik expands its WE-BMS transformer series for battery management systems with versions for an operating voltage of 1500 V<sub>DC</sub>. The component design features enhanced isolation in line with IEC 62368-1 with triple-insulated wire (primary and secondary side), as well as galvanic isolation and a test voltage of 6400 V<sub>DC</sub>. All this makes the new models in the series well-suited for use in large stationary energy storage systems from solar and wind farms, in intermediate storage systems in high-power charging stations to balance out peak loads, or for uninterruptible power supplies used in critical infrastructures. Battery management systems ensure safe operation of battery packs and provide information on battery and charge status. The downstream BMS controllers are connected in series, as are the battery cells. As voltage differences and electromagnetic interference can arise between the components connected in series, a BMS transformer helps isolate the components from each other and suppress interference. The latest members of Würth Elektronik's BMS transformer series guarantee this, even in systems with a high operating voltage of up to 1500 V<sub>DC</sub>. The longevity of the enhanced isolation of the modules as defined in IEC 62368-1 was tested using the partial discharge test in accordance with IEC 60664-1.08.04.2024 09:30:00Aprnews_2024-05-15_11.jpg\images\news_2024-05-15_11.jpghttps://www.we-online.com/en/news-center/press?d=signal-transformers-we-bmswe-online.com
Family of Power AnalyzersA family of Rohde & Schwarz power analyzers is now...11855Product ReleaseFamily of Power AnalyzersA family of Rohde & Schwarz power analyzers is now available in three models to meet the requirements for measuring voltage, current, power and total harmonic distortion on both DC and AC sources. The R&S NPA101 power meter provides all basic measurements, the R&S NPA501 power analyzer adds enhanced measurement functions and graphical analysis, and the R&S NPA701 compliance tester includes evaluation functions in line with IEC 62301 and EN 50564 for power consumption and EN 61000-3-2 for EMC harmonic emission testing. All models of the R&S NPA family of power analyzers meet the requirements of these stages for power measurements at levels from 50 µW to 12 kW, at potential differences from 1 mV to 600 V and currents from 1 mA to 20 A. The R&S NPA501 and R&S NPA701 include interfaces for external probes or shunts to further extend the range. All three models feature a sampling rate of 500 ksample/s. The 16-bit resolution A/D convertor provides an accuracy of ± 0.05 % for both current and voltage readings. The three instruments of the R&S NPA family include the same 23 standard measurements of power, current, voltage, harmonic distortion and energy.04.04.2024 07:30:00Aprnews_2024-04-15_16.jpg\images\news_2024-04-15_16.jpghttps://www.rohde-schwarz.com/uk/about/news-press/all-news/rohde-schwarz-introduces-new-r-s-npa-family-of-compact-power-analyzers-for-all-power-measurement-requirements-press-release-detailpage_229356-1484872.html?change_c=truerohde-schwarz.com
Opening of Manufacturing and After-Sales Support Facility in ThailandRecom has recently established its new manufacturi...11852Industry NewsOpening of Manufacturing and After-Sales Support Facility in ThailandRecom has recently established its new manufacturing and after-sales support setup in Bangkok, Thailand. The initiative aims to enhance service quality for the global market and the local customer base, as well as to minimize supply chain risks for international clients. Claimed to set new standards in manufacturing, quality control, and after-sales services, the facility is said to represent "a significant advancement in Recom's operational capabilities". It also houses a logistics center designed to ensure efficient, on-time deliveries to both regional hubs and customers worldwide. Central to the new setup is a commitment to sustainability. Optimizing the supply chain, manufacturing processes, and transportation methods, the facility significantly reduces energy consumption. These efforts mark a major step in Recom's journey towards complete sustainability and achieving zero emissions across the full value chain. In 2024, the focus is on reaching a significant milestone: Recom Thailand is set to ship over 1 million pieces of a wide range of low- and high-power products, from 1 W to 2 kW, catering to the global market.03.04.2024 18:00:00Aprnews_2024-04-15_13.jpg\images\news_2024-04-15_13.jpghttps://recom-power.com/en/rec-n-recom-expands-global-reach-with-state-of-the-art-facility-in-bangkok,-thailand-314.html?2recom-power.com
Rad Hard GaN Gate Driver ICEPC Space announces the launch of EPC7009L16SH, a ...11854Product ReleaseRad Hard GaN Gate Driver ICEPC Space announces the launch of EPC7009L16SH, a Radiation Hardened Gallium Nitride gate driver integrated circuit. Built on EPC's proprietary eGaN IC technology, the company claims that the device "delivers the best solution for power management where size, efficiency and simple design are critical". The EPC7009L16SH integrates input logic interface, undervoltage lockout (UVLO) protection, a 10 V-to-5.25 V linear regulator and driver circuit within a hermetically sealed 16-pin SMT package to create a driver that can switch at rates of up to 3.0 MHz. The total ionizing dose is guaranteed to 1000 kRad, and the SEE immunity for LET at 84 MeV/mg/cm<sup>2</sup> with the IC's primary supply voltage at 100% of its maximum operating value. Moreover, EPC7009L16SH can drive at least four EPC Space discrete GaN devices. The component is part of a family of space-level Rad Hard ICs that EPC and EPC Space will be launching starting this year. EPC7009L16SH applications include high speed DC-DC conversion, motor drivers, power switches/actuators, and satellite electrical systems.03.04.2024 06:30:00Aprnews_2024-04-15_15.jpg\images\news_2024-04-15_15.jpghttps://epc.space/2024/04/epc-space-launches-rad-hard-gan-gate-driver-ic/epc.space
General Manager & Vice President EMEA appointedSHURTER welcomes Steffen Lindner to its leadership...11850PeopleGeneral Manager & Vice President EMEA appointedSHURTER welcomes Steffen Lindner to its leadership team. As of April 1, 2024, he has taken over the newly created position of General Manager & Vice President EMEA. In this role, Steffen Lindner will be responsible for all company activities in EMEA, including product management, engineering, sales, and production. After completing his education as a radio and television technician and earning a graduate degree in electrical engineering / communications engineering, Steffen Lindner began his career in sales at Phoenix Contact. After two decades at Phoenix Contact, Steffen Lindner took over sales for Europe, Middle East and Africa at TE Connectivity Industrial. He adapted the sales organization to the changing market conditions and customer needs and introduced a potential-oriented market approach. By strategically focusing on key customers in specific application areas and working in partnership with distributors, Steffen Lindner was able to achieve above-average growth with the new organization. During his almost seven years at TE Connectivity Industrial, he was involved in several company acquisitions and their integration processes.02.04.2024 16:00:00Aprnews_2024-04-15_11.jpg\images\news_2024-04-15_11.jpghttps://www.schurter.com/en/news/schurter-strengthens-its-leadership-teamschurter.com
Power Seminar in German LanguageTargeting Hardware-/Software design engineers, pro...11847Event NewsPower Seminar in German LanguageTargeting Hardware-/Software design engineers, product development, business development and key accounts Mankel Engineering is organizing a hands-on-oriented user symposium about motors and inverters of xEVs. The seminar, which will take place at the end of June 2024 in northwestern Germany, can only be attended with physical presence, and the conference language is German. After an introduction about electrical motors the main focus will be on the components of a power inverter.02.04.2024 13:00:00Aprnews_2024-04-15_8.jpg\images\news_2024-04-15_8.jpghttps://www.mankel-engineering.de/SeminareWorkshops/Seminare/mankel-engineering.de
CEO of Swiss Company now in chargeAs announced in October 2023, Volker Cwielong took...11846PeopleCEO of Swiss Company now in chargeAs announced in October 2023, Volker Cwielong took over as CEO of Datwyler on 1 April 2024. Dirk Lambrecht, who had held the position since 2017, stepped down at the end of March 2024 and was elected to the Board of Directors at the Annual General Meeting. Volker Cwielong has been a member of the management team of the globally present Eberspächer Group since 2017. As Co-CEO of the Purem by Eberspächer division, he was responsible for net sales of some EUR 2 billion and for more than 7'000 employees at over 40 locations on three continents. He led the sales, production, technology and innovation units and had full responsibility for the division's results. Before, Volker Cwielong held various global management positions for international industrial groups and automotive suppliers. Volker Cwielong is a mechanical engineer and holds an MBA.02.04.2024 12:00:00Aprnews_2024-04-15_7.jpg\images\news_2024-04-15_7.jpghttps://datwyler.com/media/news/new-ceo-volker-cwielongdatwyler.com
Managing Director of Power CompanyTDK Corporation announces the appointment of Chris...11844PeopleManaging Director of Power CompanyTDK Corporation announces the appointment of Christopher Haas as Managing Director at TDK-Lambda Germany from 1st April 2024. Christopher has been a member of the Board of Directors since 2012 and will retain his previous duties heading the Quality & Compliance organisation within the EMEA region in his new role. With over 20 years of experience working in the electronics industry, Christopher brings a comprehensive portfolio of technical knowledge, as well as an enterprising skill set, holding an Executive Master's in International Business. Christopher succeeds Gustav Erl, who will retire on 30th June 2024, after 38 years of seniority. In his new role, Christopher intends to lead the organisation with a vision of sustainable and future-oriented growth, building on the company's foundation and values.02.04.2024 10:00:00Aprnews_2024-04-15_5.jpg\images\news_2024-04-15_5.jpghttps://www.emea.lambda.tdk.com/de-en/news/article/19922emea.lambda.tdk.com
Power Conversion Solutions for 48V Zonal Architectures at WCX 2024As the automotive industry moves toward 48V zonal ...11840Event NewsPower Conversion Solutions for 48V Zonal Architectures at WCX 2024As the automotive industry moves toward 48V zonal architectures, power system design engineers are looking for new high voltage power conversion solutions that have leading power density, weight and scalability attributes. Vicor will be presenting five papers at World Congress Experience 2024 (WCX&trade;) in Detroit on April 16 – 18, detailing its innovative approach to 800V and 48V power conversion using new high-density, scalable power modules with proprietary topologies and innovative packaging.02.04.2024 06:00:00Aprnews_2024-04-15_1.jpg\images\news_2024-04-15_1.jpghttps://www.vicorpower.com/resource-library/events/wcx-2024vicorpower.com
Semiconductor Manufacturer fully merges its SubsidiaryROHM announces an absorption-type merger of its fu...11849Industry NewsSemiconductor Manufacturer fully merges its SubsidiaryROHM announces an absorption-type merger of its fully owned subsidiary LAPIS Technology on April 1, 2024. The merger is intended to integrate the technologies of ROHM and LAPIS Technology. The newly-organized company will work as one to develop products that meet the needs of its customers. ROHM explicitly reassured that the business relationship with its customers as well as the existing products of LAPIS Technology will be continued by ROHM. "Amid dramatic changes in the business environment in the semiconductor industry, it is necessary to build a robust group-wide management structure in order to improve competitiveness", ROHM reports. "LAPIS Technology is a wholly owned subsidiary responsible for the planning and development of IC products. By enhancing the integration density of the technologies that both companies excel in, we will not only cultivate existing products, but also strengthen our development capability for high-value-added products with digital control added to power and analog products."01.04.2024 15:00:00Aprnews_2024-04-15_10.jpg\images\news_2024-04-15_10.jpghttps://www.rohm.com/lapis-techrohm.com
Global Distribution Agreement with Power Solutions CompanyMouser Electronics announced a global distribution...11851Industry NewsGlobal Distribution Agreement with Power Solutions CompanyMouser Electronics announced a global distribution agreement with Vox Power, a manufacturer of AC/DC power supplies and DC/DC converters. As part of this agreement, Mouser Electronics will distribute Vox Power's configurable, and rugged fanless conduction-cooled power supplies. These products have been specifically designed for the medical, industrial, and technology markets, providing high-density solutions that fit into compact spaces for demanding applications that conventional products cannot meet. The NEVO+600 modular configurable power supply, available from Mouser, is said to be the smallest in its class and "the ultimate solution for demanding applications where size, power density and weight matter".27.03.2024 17:00:00Marnews_2024-04-15_12.jpg\images\news_2024-04-15_12.jpghttps://eu.mouser.com/manufacturer/vox-power/mouser.com
Substrates for Organic Field Effect Transistors (OFETs)How efficient are new materials? Does changing the...11828Industry NewsSubstrates for Organic Field Effect Transistors (OFETs)How efficient are new materials? Does changing the properties lead to better conductivity? The Fraunhofer Institute for Photonic Microsystems IPMS develops and manufactures silicon substrates for this purpose. This enables the fundamental electrical characterization of materials such as a novel graphene emulsion. Customized designs enable the optimal measurement of semiconductors and conductors. Organic semiconductors are key components in organic electronics and photovoltaics. They are used to make flexible electronic devices and printed solar cells. Typical for this class of materials are low temperature processes as well as large area deposition and patterning using various coating and printing techniques. The active semiconductor materials significantly determine the performance of the entire system. Therefore, an easy to handle and reliable electronic characterization of conductivity, carrier mobility, contact resistance and on/off current ratio of these semiconductors is an essential requirement for material and process developers. Fraunhofer IPMS develops and manufactures silicon substrates with single transistor structures in bottom-gate architecture, which are used for the fabrication of organic field-effect transistors (OFETs) or for the characterization of electrical material parameters of conductive materials, e.g. for organic photovoltaics. Substrates for organic field-effect transistors (OFET) for the development of high-tech materials.27.03.2024 14:00:00Marnews_2024-04-01_9.jpg\images\news_2024-04-01_9.jpghttps://www.ipms.fraunhofer.de/en/press-media/press/2024/material-characterization-of-printed-electronics.htmlipms.fraunhofer.de
Ultrafast Soft Recovery Diode Modules deliver High ReliabilityVishay Intertechnology introduced two FRED Pt 500 ...11861Product ReleaseUltrafast Soft Recovery Diode Modules deliver High ReliabilityVishay Intertechnology introduced two FRED Pt 500 A ultrafast soft recovery diode modules in a TO-244 Gen III package. Offering higher reliability than previous-generation solutions, the Vishay Semiconductors VS-VSUD505CW60 and VS-VSUD510CW60 are designed to reduce losses and EMI / RFI in high frequency power conditioning systems. The rugged TO-244 package of the diode modules withstands 46 000 IOL cycles at given conditions, offering an up to 5x improved life expectancy over previous-generation devices. In addition, the industry-standard package is footprint-compatible with competing solutions in the TO-244 to provide a drop-in replacement for existing designs. The VS-VSUD505CW60 and VS-VSUD510CW60 are suited for high frequency welding, high current converters and ballast water management systems (BWMS) in railway equipment, cranes, and ships, UPS and other applications where switching losses comprise a significant portion of the total losses. In these applications, the softness of their recovery eliminates the need for a snubber. Offered in a common cathode configuration, the diode modules provide forward voltage drop down to 0.82 V, thermal resistance - junction to case - of 0.16 °C/W, and an operating temperature range up to +175 °C.27.03.2024 13:30:00Marnews_2024-04-15_22.jpg\images\news_2024-04-15_22.jpghttps://www.vishay.com/en/company/press/releases/2024/VS-VSUD510CW60/vishay.com
Series of Narrow Body Power BeadsITG Electronics has launched a line of narrow body...11856Product ReleaseSeries of Narrow Body Power BeadsITG Electronics has launched a line of narrow body power beads for high-density applications where component space is at a premium. With a footprint of 5 x 9 mm and a height of 9.5 mm, the company's SLA36385A Series are well-suited for data centers, primary mother boards for servers and storage devices, and other scenarios requiring components to offer high current with low footprint. Featuring more than a dozen items, ITG Electronics SLA36385A Series features inductance values ranging from 35 – 470 nH; the 35 nH component can handle more than 200 A of current, with approximately 20% roll off. Each item in the series offers a DC resistance rate of 0.125 mOhm for high-current functionality. The SLA36385A Series is immersion cooling ready. The SLA36385A Series constitutes ferrite-based SMD inductors. The components feature operating frequencies up to 5.0 MHz, and a temperature range of -55 °C to + 130 °C. Each item in the series is both RoHS & HF compliant. To meet varying current sensing requirements, options for 5% tight tolerance control on DC resistance are also available.27.03.2024 08:30:00Marnews_2024-04-15_17.jpg\images\news_2024-04-15_17.jpghttps://itg-electronics.com/en/series/709itg-electronics.com
CEO of Soft-Switching Company joins Executive Board of Engineering SchoolPre-Switch has announced that its CEO Bruce Renoua...11841PeopleCEO of Soft-Switching Company joins Executive Board of Engineering SchoolPre-Switch has announced that its CEO Bruce Renouard has accepted an invitation to join the executive board of the Bobby B. Lyle School of Engineering at Southern Methodist University (SMU) in Dallas, Texas/USA. Board members provide advice and counsel on a wide range of subjects, and are also advocates for the facility and involved in fundraising activities. Renouard joined SMU's engineering Co-op program where he worked at Rockwell Collins to gain real world engineering experience prior to graduating from SMU's School of Engineering (Lyle) in 1983 with a BSEE degree. Currently, Pre-Switch, the company he founded in 2015, is bringing its patented, AI-powered soft-switching technology to the automotive and other high voltage markets, resulting in significant improvements in system level efficiency.27.03.2024 07:00:00Marnews_2024-04-15_2.jpg\images\news_2024-04-15_2.jpghttps://pre-switch.com/pre-switch.com
Thermal Management Expo Europe Unveils Business Opportunities for High-Tech IndustriesThermal Management Expo North America is a unique,...11839Event NewsThermal Management Expo Europe Unveils Business Opportunities for High-Tech IndustriesThermal Management Expo North America is a unique, free-to-attend exhibition and conference that connects senior engineers and key decision-makers with suppliers specializing in thermal systems and materials. No other event provides the opportunity for professionals working across sectors like Automotive, Aerospace & Defense, Electronics, Energy, Telecoms/5G, and Medical to delve into the latest thermal innovations and solutions. Attendees can tap into the advantages of cross-sector networking and in-person engagements with the latest thermal materials, components, and technologies available in the market. Co-located with Ceramics Expo, this event is scheduled for April 29 – May 1, 2024 at Suburban Collection Showplace, Novi, Michigan, USA. Thermal Management Expo promises to showcase the latest systems, materials, and technologies to address thermal management challenges across several high-tech industries. Global market leading suppliers and manufacturers including Alloy Enterprises, Burger Group, Henkel, Huber, Linseis, Parker Hannifin, TCLAD, Thermtest and Stirweld, will be showcasing their innovative solutions. In addition to the exhibition, the free-to-attend conference will feature sessions led by technical experts from prominent companies like Intergalatic, Heraeus, Blueshift, Diabatix, Neural Concept, ZF Group and more. These sessions will provide insights into thermal management systems and design, covering topics such as supply chain optimization, EV thermal management, data center cooling, thermal design and AI, thermal simulation, microelectronics and semiconductors.26.03.2024 16:30:00Marnews_2024-04-01_20.jpg\images\news_2024-04-01_20.jpghttps://register.visitcloud.com/survey/1zvv3hrcg7n3t?utm_source=engineering_update&utm_medium=socials&utm_campaign=tme24_visprom_partnersthermalmanagementexpo.com
100 V Trench Schottky Rectifier DiodesSTMicroelectronics has introduced 100 V trench Sch...11862Product Release100 V Trench Schottky Rectifier DiodesSTMicroelectronics has introduced 100 V trench Schottky rectifier diodes increasing efficiency in power converters operated at high switching frequencies. ST's trench Schottky diodes are claimed to "significantly reduce the rectifier losses, with superior forward-voltage and reverse-recovery characteristics that enable increased power density with high efficiency." The forward voltage is said to be "50-100 mV better than in comparable planar diodes", depending on current and temperature conditions. Changing to these devices might increase the efficiency by 0.5%. There are 28 variants in the family, with eight current ratings from 1 A to 15 A, multiple surface-mount packages, in industrial and automotive grades. The industrial-grade parts target applications such as miniature switched-mode power supplies and auxiliary power supplies for telecom, server, and smart-metering equipment. In automotive, typical uses include space-constrained applications such as LED lighting, reverse-polarity protection, and low-voltage DC/DC converters. The parts are AEC-Q101 qualified, manufactured in PPAP-capable facilities, and specified from -40 °C to 175 °C. The diodes are 100% avalanche tested in production.26.03.2024 14:30:00Marnews_2024-04-15_23.jpg\images\news_2024-04-15_23.jpghttps://newsroom.st.com/media-center/press-item.html/n4617.htmlst.com
Buck-Boost MOSFET for Higher Power USB PD 3.1 EPR ApplicationsAlpha and Omega Semiconductor announced its AONZ66...11858Product ReleaseBuck-Boost MOSFET for Higher Power USB PD 3.1 EPR ApplicationsAlpha and Omega Semiconductor announced its AONZ66412 XSPairFET MOSFET designed for Buck-Boost converters in USB PD 3.1 Extended Power Range (EPR) applications. The USB PD 3.1 EPR increases the USB-C maximum power up to 240 W. AONZ66412 is defined to support the most commonly addressed power range of up to 140 W at 28 V, with two 40 V N-Channel MOSFETs in a half-bridge configuration in a symmetric XSPairFET 5 mm x 6 mm package. The AONZ66412 can replace two single DFN5x6 MOSFETs. The AONZ66412 is suited for buck-boost converters in Type-C USB 3.1 EPR applications, including notebook, USB hub, and power bank designs. The AONZ66412 is an extension to the AOS XSPairFET lineup. The improved package parasitics make 1 MHz operation achievable, allowing inductor size and height to be reduced. AONZ66412 has been tested to achieve 97% efficiency @1 MHz in typical USB PD 3.1 EPR conditions of 28 V input, 17.6 V output, and 8 A load conditions.26.03.2024 10:30:00Marnews_2024-04-15_19.jpg\images\news_2024-04-15_19.jpghttps://aosmd.com/sites/default/files/2024-03/AONZ66412_PR.pdfaosmd.com
Digital WE Days: Expert Knowledge OnlineThe transfer of expertise is a fundamental element...11820Event NewsDigital WE Days: Expert Knowledge OnlineThe transfer of expertise is a fundamental element of Würth Elektronik's service concept. This includes in-depth expert presentations in digital format. As part of Digital WE Days, experts from Würth Elektronik and its partner companies will be presenting on important topics like intelligent power and control systems, EMC, electromechanics, wireless power, optoelectronics, and PCBs. "Last year, more than 4,300 participants took advantage of our online service offerings," says Alexander Gerfer, CTO at Würth Elektronik eiSos. "This shows that we are in touch with the times with our Digital WE Days. We are continuing this successful concept this year." From April 22 to 25, 2024, experts from Würth Elektronik, Rohde & Schwarz, onsemi, Infineon, Texas Instruments, Cambridge GaN Devices, Silent Solutions, as well as Wired & Wireless Technologies, will provide for a varied and high-caliber presentation program. A 30-minute presentation is followed by an interactive Q&A session lasting around a quarter of an hour, which further deepens the knowledge imparted in the expert presentation. "We know the current market and technology trends as well as our customers," Gerfer continues. "On this basis, we've once again put together an interesting and contemporary presentation program this year – from practitioners for practitioners." Digital WE Days 2024 is a free service from Würth Elektronik. All presentations can be booked individually. Registration for the virtual conference is now open. 26.03.2024 06:00:00Marnews_2024-04-01_1.jpg\images\news_2024-04-01_1.jpghttps://www.we-online.com/en/news-center/press?d=digital-we-days-2024we-online.com
Land Speed Records with pure Electric MotorcycleThe latest episode of the Vicor Powering Innovatio...11904Industry NewsLand Speed Records with pure Electric MotorcycleThe latest episode of the Vicor Powering Innovation podcast explores electrification with Lightning Motorcycles, a company that produces the fastest electric motorcycle on the planet. Lightning Motorcycles (Lightning) not only manufactures the fastest motorbike on Earth, but also prides itself on delivering the smoothest, vibration-free ride for the purist who just loves the riding experience. "The bike gives you a feeling of limitless torque with no vibration, no noise and no heat – there is almost a magical feeling to it." - Richard Hatfield, founder and CEO of Lightning Motorcycles. Hatfield sits down with David Krakauer, VP of Corporate Marketing at Vicor, to share his story and how Lightning is able to engineer a superior motorcycle by nearly every measure. Hatfield said, "The biggest challenges we face are packaging, weight and thermodynamics when competing with internal combustion engine (ICE) bikes." Sophisticated engineering has enabled Lightning to keep the weight of their EVs at about 200lbs, the same as competing ICE bikes. Lightning has set the land speed record at Bonneville Salt Flats in Utah and won the Pike Peaks challenge (14,115ft elevation) in Denver, but Hatfield is prouder of the bike's unparalleled riding experience.26.03.2024 06:00:00Marnews_2024-05-15_1.jpg\images\news_2024-05-15_1.jpghttps://www.vicorpower.com/resource-library/podcasts/lightning-motorcyle-podcastvicorpower.com
Exhibition spreading from Coil-Winding to e-MobilityTaking place from May 14-16 2024, this CWIEME Berl...11827Event NewsExhibition spreading from Coil-Winding to e-MobilityTaking place from May 14-16 2024, this CWIEME Berlin exhibition will see leading professionals come together to discuss and showcase innovative products from the coil winding, transformer, generator, electric motor manufacturing and e-mobility sectors. For 2024, the event has secured many industry professionals to participate in sessions and talks that will discuss latest innovations, technologies and key issues in the electrical engineering industry. Confirmed speakers include representatives from The International Copper Association, Syensqo, S&P Global Mobility, Siemens Energy, Thyssenkrupp Steel Europe, Hitachi Energy, SGB-SMIT GmbH, STILRIDE, Mckinsey Center for Future Mobility and Ford Europe. The central stage will cover a host of topics such as innovation in transformers oils, driving sustainability in the manufacturing and energy sectors with a deep dive into eco-friendly practices in the steel industry, and a panel discussion on what the future holds for rare earth materials. The e-mobility stage will host talks including a keynote speech on decarbonisation in the automotive sector, a session on the importance of reliability for electric vehicle (EV) infrastructure, a panel discussion on the emerging trends, a talk on innovations and advancements in new motor technologies, and a session on how the automotive industry can remain competitive in the age of electrification.25.03.2024 13:00:00Marnews_2024-04-01_8.jpg\images\news_2024-04-01_8.jpghttps://berlin.cwiemeevents.com/homeberlin.cwiemeevents.com
Successful Funding of GaN Technology CompanyCambridge/UK-based QPT, a company which is active ...11825Industry NewsSuccessful Funding of GaN Technology CompanyCambridge/UK-based QPT, a company which is active in developing highly efficient GaN-based electric motor controls, has announced that its Crowdcube funding round has just passed the one million pound milestone. Rupert Baines, QPT's new CEO, said, "QPT has a … combination of an amazing technology that can cut the power consumption of electric motors by 10% thereby providing a way to actively help reduce climate change and a management team of veterans of the GaN industry." QPT's qGaN technology is a solution for the issues of overheating and RF interference that currently limit the speeds that GaN can be driven at. "Now GaN transistors can be run at much higher speeds than any other rival technology – 20 times faster than SiC for example", Rupert Baines adds. "Our solution is smaller with a significantly lower system cost and saves more energy than rivals according to our studies. I am really excited to be heading a company with a real roadmap to make the world a better place."25.03.2024 11:00:00Marnews_2024-04-01_6.jpg\images\news_2024-04-01_6.jpghttps://www.q-p-t.com/q-p-t.com
Polyimide Coated Magnet Wires for >800 VElectrical breakdown of high-temperature insulatio...11836Product ReleasePolyimide Coated Magnet Wires for >800 VElectrical breakdown of high-temperature insulation materials can be prevented by using thermoplastic Polyimide, TPI. This polymer can be extrusion-coated as other polymers, but AURUM&reg;, TPI reduces electrical and magnetic losses. With 245 °C AURUM claims to have the highest T<sub>g</sub> of any commercially available Thermoplastic, and its insulation performance especially at temperatures above 150 °C is stated to beat any other know insulation. AURUM reduces electrical and magnetic losses with a comparative tracking index (CTI) of > 600 volts. Thermoplastic Polyimide (TPI) produced by Mitsui Chemicals of Japan, and sold by BEIGLO GmbH is known for its thermal stability, high-temperature resistance, and electrical insulation properties. TPI coated magnet wires are a suitable choice for high-voltage applications (800 V and above).21.03.2024 13:30:00Marnews_2024-04-01_17.jpg\images\news_2024-04-01_17.jpghttps://www.bieglo.com/applications-of-thermoplastic-polyimide-aurum/bieglo.com
Automotive N-Channel MOSFETs for 48 V ApplicationsToshiba has launched two automotive N-channel powe...11835Product ReleaseAutomotive N-Channel MOSFETs for 48 V ApplicationsToshiba has launched two automotive N-channel power MOSFET devices to meet the growing demand for 48 V batteries and systems within automotive applications including inverters, semiconductor relays, load switches, motor drives and more. The 80V XPQR8308QB and 100V XPQ1R00AQB are based upon Toshiba's U-MOS X-H process. This gives low levels of on-resistance with the XPQR8308QB measuring less than 0,83 m&#8486; while the XPQ1R00AQB does not exceed 1,03 m&#8486;. The devices are rated for I<sub>D</sub> values of 350 A (XPQR8308QB) and 300 A (XPQ1R00AQB) continuously with pulsed values (I<sub>DP</sub>) of 1050 A and 900 A respectively. Supporting these values, the L-TOGL&trade; package adopts a thick copper clip-based leadframe structure that thermally and electrically connects the MOSFET die to the package leads. This reduces the package resistance by approximately 70% and channel-to-case thermal impedance by 50% compared with the TO-220SM(W) package. Together, the process and clip reduce losses and heat generation while creating a very thermally efficient solution. Furthermore, the L-TOGL package uses compliant gull-wing leads which reduce mounting stress and improve the reliability of solder joints. Both devices are AEC-Q101 qualified for automotive applications. Toshiba offers to ship devices grouped to within 0.4V based upon their gate threshold voltage.21.03.2024 12:30:00Marnews_2024-04-01_16.jpg\images\news_2024-04-01_16.jpghttps://toshiba.semicon-storage.com/eu/company/news/2024/03/mosfet-20240321-1.htmltoshiba.semicon-storage.com
Reference Design for Qi2 Wireless Charging ImplementationAs major charger manufacturers, including those in...11834Product ReleaseReference Design for Qi2 Wireless Charging ImplementationAs major charger manufacturers, including those in the automotive industry, are working to implement Qi&reg; v2.0 (Qi2) standards, Microchip Technology has released a Qi 2.0 dual-pad wireless power transmitter reference design. Powered by a single dsPIC33 Digital Signal Controller (DSC), the Qi2 reference design offers efficient control for optimized performance. A key feature of the new Qi2 standard, recently released by the Wireless Power Consortium (WPC), is the introduction of a Magnetic Power Profile (MPP) with support for magnetic alignment between the transmitter and the receiver. The DSC's flexible software architecture enables the support of a combination of MPP and Extended Power Profile (EPP) of Qi 2.0 with one controller. Utilizing the Qi2 reference design helps minimize customer risk in certifying their final product, which is required to pass through the Qi certification process. As it integrates several of Microchip's automotive-qualified parts, the dual-pad charger also meets automotive standards for reliability and safety and supports Autosar. An integrated CryptoAuthentication&trade; IC provides security to meet the stringent authentication requirement of Qi standards. The reference design is hardware reconfigurable and capable of supporting most transmitter topologies.21.03.2024 11:30:00Marnews_2024-04-01_15.jpg\images\news_2024-04-01_15.jpghttps://www.microchip.com/en-us/about/news-releases/products/microchip-technology-releases-qi-v2-0-standards-compliant-dspic-basedmicrochip.com
DC/DC Converter for 500 W with High ReliabilityThe MGDS-500 Series from Gaia feature a full range...11832Product ReleaseDC/DC Converter for 500 W with High ReliabilityThe MGDS-500 Series from Gaia feature a full range of high density, wide input range DC/DC power modules designed for aerospace, military and high-end industrial applications. With 500 W output power, the MGDM-500 Series is particularly suitable for ultra compact power supply design. Standard models are available with wide input voltage ranges of 9-36V<sub>DC</sub> and 16-80V<sub>DC</sub>, and provide output voltages of 12, 15, 24, 28, and 48 V<sub>DC</sub>. Over the entire 500 W output power range the MGDM-500, which is integrated into a half-brick package, operates with an efficiency of up to 91%. Its Galvanic isolation is 1500 V<sub>DC</sub>, while the switching frequency is 300 kHz. Trim adjustment is possible from 90% to 110%, and the external synchronization range is specified 270 to 330 kHz. The synchronization function allows more than one converter to operate with an external source frequency. All modules incorporate LC network filters to minimize reflected input current ripple and output voltage ripple. The modules have totally independent functions including input under voltage lock-out, output overvoltage protection, output current limitation protection, and temperature protection. Additionally, a soft-start function allows current limitation and eliminates inrush current during start-up.21.03.2024 09:30:00Marnews_2024-04-01_13.jpg\images\news_2024-04-01_13.jpghttps://www.gaia-converter.com/products/mgdm-500/gaia-converter.com