| More News | Teaser | NewsID | NewsSection | Title | Text | Announced | AnnouncedMMM | Picture | PicturePath | WebLink | WebLinkText |
| Bodo's WBG Event in Munich | Only a few days to go, until Bodo will return to t... | 11663 | Event News | Bodo's WBG Event in Munich | Only a few days to go, until Bodo will return to the Hilton Munich Airport on December 12 and 13. The program contains over 40 presentations on SiC and GaN, and will be accompanied by a table top exhibition and the opportunity to network with top experts form the industry. Get your ticket here: <a href="https://www.bodoswbg.com/register.aspx"> bodoswbg.com/register </a> | 28.11.2023 06:00:00 | Nov | news_2023-12-01_1.jpg | \images\news_2023-12-01_1.jpg | https://www.bodoswbg.com/register.aspx | bodoswbg.com |
| Full-Tunnel Wave Soldering System | The POWERFLOW ULTRA is the latest innovation in Er... | 11679 | Product Release | Full-Tunnel Wave Soldering System | The POWERFLOW ULTRA is the latest innovation in Ersa GmbH´s wave soldering product portfolio. The full-tunnel wave soldering machine meets current and future flexibility and throughput requirements in every respect. The machine is available with frame and finger conveyor, the working widths range from 330 to 610 mm in the XXL version. The POWERFLOW ULTRA XXL can also be used to solder 5G server boards, for example. The heart of the POWERFLOW ULTRA is the soldering module with process control and flexibility. Its drive achieves speeds of up to 5 mm/s. The distance between the soldering nozzle and the PCB is defined via the ERSASOFT 5 operating software. This allows assemblies to be soldered at a precise distance. The nozzle distance and solder wave height can also be adjusted as required within an assembly. For this purpose, the PCB is divided program-controlled into sectors, which are stored with parameters. This means that each sector can be soldered with individual configurations, ensuring highly flexible processes. In addition, the contact time of the solder wave with the assembly can be stored in the soldering program. This offers maximum process control when moving the assembly in and out of the solder wave. In combination with the nozzle spacing, an optimum solder flow is achieved, resulting in perfect solder joints – especially for assemblies that are equipped, in addition to power electronics, with a high proportion of digital components. | 27.11.2023 12:30:00 | Nov | news_2023-12-01_17.jpg | \images\news_2023-12-01_17.jpg | https://www.kurtzersa.com/news/item/news/ersa-powerflow-ultra-future-may-come | kurtzersa.com |
| Online Engineering Resource for Battery-Management Systems | Arrow Electronics is building an online resource f... | 11669 | Industry News | Online Engineering Resource for Battery-Management Systems | Arrow Electronics is building an online resource for designers of battery-management systems (BMS), giving access to support services and downloadable design papers jointly written with experts at companies within Arrow's ecosystem. Established to help customers ensure their BMS projects meet critical requirements, such as functional safety, efficiency, battery lifetime, and charging time, the repository is managed by Arrow battery specialists. Technical support services available from Arrow, including from its company einfochips that specialises in supporting complex engineering projects, cover the complete development lifecycle, including hardware and firmware design, prototyping, functional safety, testing and regulatory certification.<br>"Battery management is central to the electrification of everything, the defining megatrend of our time as we switch to renewable energy to preserve the world's resources and climate," said Ulrich Lentz, technology field applications engineer – BMS, Arrow Electronics. "Customers developing BMS, either commercially or for their own end products, can rely on our curated resources to get the knowledge and support they need."<br>Performance-conscious battery-powered systems typically need a BMS to monitor operating conditions, maintain correct cell voltages, optimise charging, and anticipate cell failures to allow safe isolation from others in the array. A BMS is essential in equipment such as e-mobility from e-bikes to EVs, cordless power tools and renewable energy storage systems from utility-class to small consumer units. | 27.11.2023 12:00:00 | Nov | news_2023-12-01_7.jpg | \images\news_2023-12-01_7.jpg | https://www.arrow.com/en/emea-vertical-electrification-of-everything | arrow.com |
| Current Sensor for Three Phase Automotive Traction Inverter Power Modules | LEM has launched the HAH3DR S07/SP42, a compact cu... | 11673 | Product Release | Current Sensor for Three Phase Automotive Traction Inverter Power Modules | LEM has launched the HAH3DR S07/SP42, a compact current sensor designed for 800V three-phase power modules. Developers of automotive traction inverters are increasingly using three-phase power modules such as the popular and widely proven Hybridpack Drive from Infineon. These modules are now adopting the more efficient SiC MOSFET technology, allowing vehicles to use 800V battery systems that offer faster charging and longer driving range. The HAH3DR S07/SP42 three-phase sensor has been designed to fit these 800V power modules. Fully calibrated over temperature and stable over the unit's lifetime, they enable a quick time to market with little R&D effort. This makes them ideal for companies developing small passenger vehicle platforms, trucks and buses while restrained by limited R&D resources. The current sensor offers a wide selection of current measuring ranges from 700A to 1200A, and compared to existing units in the HAH3DR family, the package isolation characteristics have been upgraded to cope with the challenge of 800V power modules. As well as the sensor, LEM also offers a large choice of packages and current measuring range options. The HAH3DR S07/SP42 features an enlarged aperture that can accommodate busbars up to 1.5mm thick, making it compatible with newest generation of power modules. It is also compatible with power modules from various other suppliers, such as the Acepak Drive from ST Microelectronics, the SSDC from ON Semi, and others such as Starpower and CRRC. | 27.11.2023 06:30:00 | Nov | news_2023-12-01_11.jpg | \images\news_2023-12-01_11.jpg | https://www.lem.com/en | lem.com |
| PwrSoC 2023 – 145 Global Experts Discuss Power Integration | The eighth edition of the biennial International W... | 11665 | Event News | PwrSoC 2023 – 145 Global Experts Discuss Power Integration | The eighth edition of the biennial International Workshop on Power Supply on Chip (PwrSoC) took place at Leibniz University Hannover, Germany, from September 27 through 29, 2023. It was the 15th anniversary of PwrSoC. 145 global experts came together to discuss the miniaturization and integration of power conversion and management solutions - on-chip, in-package, and module level. The Power Sources Manufacturers Association (PSMA) is a co-sponsor of PwrSoC together with the IEEE Power Electronics Society (IEEE PELS). General Chair Bernhard Wicht, professor at Leibniz University Hannover, Germany and Technical Program Chair Bruno Allard, professor at Ampere lab, Université de Lyon, INSA Lyon, France, organized and presided over a well-received Workshop. The workshop started with a plenary talk by Dr. Soh Yun Siah, Vice President of Technology Development of GlobalFoundries. Dr. Soh Yun Siah's excellent presentation highlighted the technological needs for the growing Heavy Computing and AI Markets. The audience was challenged to improve power delivery by taking a serious look at GaN+BCD (Bipolar CMOS DMOS) for power solutions that will increase density by up to a factor of 3, allow Heterogeneous Integration of GaN devices and a performance path to the future. | 24.11.2023 08:00:00 | Nov | news_2023-12-01_3.jpg | \images\news_2023-12-01_3.jpg | http://pwrsocevents.com/ | pwrsocevents.com |
| Subsidiary in New Zealand Opened | On the 24th October 2023, Wurth Electronics New Ze... | 11664 | Industry News | Subsidiary in New Zealand Opened | On the 24th October 2023, Wurth Electronics New Zealand, the 37th subsidiary of Würth Elektronik, officially celebrated with an opening ceremony. Ruth Poon, Managing Director Wurth Electronics New Zealand explains that Tasi Samu, Sales Area Manager has already been successfully serving and supporting customers in New Zealand since 2016. Wurth Electronics New Zealand Ltd has expanded the team headcount and will continue to build a powerful team across New Zealand. "We are deeply grateful to our customers, because their loyalty and trust have brought us to the point where we can establish our own subsidiary," says Ruth. "The expansion strengthens us in fulfilling Würth Elektronik's claim: 'more than you expect.' We don't just want to sell components; we want our service to help our customers use them to make products that are as good and sustainable as possible." The clientele in New Zealand demonstrates their presence in World-Class electronics research and development across various markets and industries from high-tech startups to globally well-known brands. Wurth Electronics New Zealand is capable of servicing the market no matter the size of the client or intricacy of their supply chain from concept to manufacturing. | 23.11.2023 07:00:00 | Nov | news_2023-12-01_2.jpg | \images\news_2023-12-01_2.jpg | https://www.we-online.com/en/news-center/press?d=newzealand | we-online.com |
| 4000 W Configurable Power Supply | Advanced Energy Industries has announced a configu... | 11675 | Product Release | 4000 W Configurable Power Supply | Advanced Energy Industries has announced a configurable power supply that delivers application-specific power conversion in a small form factor with up to four times higher power density than conventional solutions. The first member of Advanced Energy's NeoPower (NP) family of AC-DC configurable industrial and medical power supplies, the NP08, combines eight output power slots for rapid and flexible configuration with a power density of 18 W/in<sup>3</sup>. Rated at up to 4,000 W, the NP08 also has integrated and flexible communication capabilities with optional dongles that support all common digital communication protocols without the need for design changes or modifications. Designed for ease of configuration in both series and parallel implementations, the NP08 can be programmed as a voltage or a current source and operates with low noise performance. NP08 is qualified to all applicable standards including the medical BF (body floating) safety rating and the SEMI F47 standard relating to immunity from voltage sag. AC inputs are 90 to 264 VAC. Advanced Energy's ConnectedPower portfolio of interface options allows the NP08 to support RS-485 (MODBUS RTU), PMBUS, and CANBUS (CANOPEN) protocols. This comprehensive connectivity also makes the NP08 ideal for IoT applications requiring cloud-based monitoring and control. | 21.11.2023 08:30:00 | Nov | news_2023-12-01_13.jpg | \images\news_2023-12-01_13.jpg | https://ir.advancedenergy.com/news/advanced-energy-unveils-up-to-4000-w-configurable-power-supply-with-4x-the-power-density/09faca8b-8d1c-4aed-828b-22376d933a42/ | advancedenergy.com |
| Tobias Hüppe Appointed COO to Drive Manufacturing Growth | Skeleton Technologies has announced the addition o... | 11667 | People | Tobias Hüppe Appointed COO to Drive Manufacturing Growth | Skeleton Technologies has announced the addition of former Northvolt Senior Director of Manufacturing Tobias Hüppe. With his experience in the battery industry, he will be steering Skeleton's manufacturing expansion as Chief Operations Officer (COO). Tobias Hüppe comes to Skeleton Technologies with a rich background in scaling battery manufacturing and establishing gigafactories, notably as a core team member and leading manufacturing executive at Northvolt. His career also spans significant roles in the automotive industry with Faurecia, Webasto, and Edscha. Starting as a Lean Manufacturing Coordinator, he advanced through various positions including Production Control & Logistics Manager, culminating in a role as Plant Manager.<br>"I am very excited to join the Skeleton Technologies' team to accelerate domestic production of energy storage that is also innovative, has unique selling points on a global level and reduces Europe's dependencies on critical raw materials sourced from elsewhere," said Hüppe. "Skeleton's progress in their patented raw material, high-performing cells and industry-specific modules is impressive. I look forward to leveraging my experience to advance the manufacturing of these groundbreaking technologies." | 20.11.2023 10:00:00 | Nov | news_2023-12-01_5.jpg | \images\news_2023-12-01_5.jpg | https://www.skeletontech.com/ | skeletontech.com |
| 62mm Package Helps Engineers to Achieve Higher Efficiency and Power Density | Infineon Technologies announced the expansion of i... | 11676 | Product Release | 62mm Package Helps Engineers to Achieve Higher Efficiency and Power Density | Infineon Technologies announced the expansion of its CoolSiC 1200 V and 2000 V MOSFET module families with an industry-standard package. The proven 62mm device is designed in half-bridge topology and is based on the recently introduced and advanced M1H silicon carbide (SiC) MOSFET technology. The package enables the use of SiC for mid-power applications from 250 kW – where silicon reaches the limits of power density with IGBT technology. Compared to a 62mm IGBT module, the list of applications now additionally includes solar, server, energy storage, EV charger, traction, commercial induction cooking and power conversion systems. The M1H technology enables a wider gate voltage window, ensuring high robustness to driver and layout-induced voltage spikes at the gate without any restrictions even at high switching frequencies. In addition to that, very low switching and transmission losses minimize cooling requirements. Combined with a high reverse voltage, these devices meet another requirement of modern system design. By using Infineon's CoolSiC chip technology, converter designs can be made more efficient, the nominal power per inverter can be increased and system costs can be reduced. With baseplate and screw connections, the package features a very rugged mechanical design optimized for highest system availability, minimum service costs and downtime losses. Rreliability is achieved through high thermal cycling capability and a continuous operating temperature (T <sub>vjop</sub>) of 150°C. The symmetrical internal package design provides identical switching conditions for the upper and lower switches. Optionally, the thermal performance of the module can be further enhanced with pre-applied thermal interface material (TIM). | 20.11.2023 09:30:00 | Nov | news_2023-12-01_14.jpg | \images\news_2023-12-01_14.jpg | https://www.infineon.com/cms/en/about-infineon/press/market-news/2023/INFGIP202311-024.html | infineon.com |
| Common-Drain MOSFET Offers Bi-Directional Power within USB Applications | Toshiba Electronics Europe has launched their firs... | 11681 | Product Release | Common-Drain MOSFET Offers Bi-Directional Power within USB Applications | Toshiba Electronics Europe has launched their first 30V N-channel common-drain MOSFET. The SSM10N961L device offers low-loss operation and is specifically intended for use within devices with USB interfaces. Additionally, it may be used for protecting battery packs within mobile applications. With the ubiquity of USB interfaces, many components and devices have been developed to support USB standards. The USB Power Delivery (USB PD) standard supports higher power levels from 15W (5V / 3A) to a maximum of 240W (48V / 5A) and allows swapping of the power supply and receiving side. This requires devices with USB charging to support bi-directional power and this is the use case that the SSM10N961L N-channel common drain MOSFET has been designed for. Until now, Toshiba's N-channel common-drain MOSFETs have been 12V products primarily intended for the protection of lithium-ion (Li-ion) battery packs within smartphones. The 30V product can be used for applications requiring voltages higher than 12V such as load switching for power lines of USB charging devices and the protection of Li-ion battery packs for battery powered appliances. The SSM10N961L combines two N-channels in a common drain configuration which is the feature that allows for bi-directional operation. The source-source breakdown voltage (V<sub>(BR)SSS</sub>) is 30V for use in higher voltage applications such as those found in laptops and tablets. To reduce losses in all applications, the source-source on-resistance (R<sub>SS(ON)</sub>) is typically 9.9mΩ. | 16.11.2023 14:30:00 | Nov | news_2023-12-01_19.jpg | \images\news_2023-12-01_19.jpg | https://toshiba.semicon-storage.com/eu/company/news/2023/11/mosfet-20231116-1.html | toshiba.semicon-storage.com |
| e-Commerce Platform Provides a seamless shopping Experience | ROHM has taken a step towards enhancing customer e... | 11672 | Industry News | e-Commerce Platform Provides a seamless shopping Experience | ROHM has taken a step towards enhancing customer experience by launching an e-commerce platform that allows customers to easily purchase products directly on its website. This latest development comes in response to the evolving landscape in the semiconductor industry of offering direct-to-consumer purchasing. It is now possible to buy products on ROHM's site without the need to navigate to a third-party. Simply click on the Buy button in the parametric search results or enter the part number manually to add products to the cart and complete the purchasing process (*ROHM Americas site only at this time). What's more, registering on MyROHM provides the added benefit of facilitating checkout by eliminating the need to re-enter personal information for every transaction while enabling easy access to past orders. In short, this e-commerce platform is designed to not only deliver an enhanced user experience, but also allow ROHM to better understand end customer needs and propose optimized solutions.<br>Jay Barrus, President, ROHM Semiconductor U.S.A.: "We are pleased to announce the integration of e-commerce functionality to our website. This not only streamlines the procurement process, but also underscores our focus on innovation and convenience. The new e-commerce features allow access to our extensive catalog of semiconductor products, and registered users can place orders, track shipments, and quickly re-order parts. ROHM has always been at the forefront of technological innovation, and this addition is a testament to our commitment to continuously improve our products and services." | 15.11.2023 15:00:00 | Nov | news_2023-12-01_10.jpg | \images\news_2023-12-01_10.jpg | https://www.rohm.com/news-detail?news-title=2023-11-15_news&defaultGroupId=false | rohm.com |
| Honored with Two Global Technology Awards at Productronica | Indium Corporation was honored with two GLOBAL Tec... | 11671 | Industry News | Honored with Two Global Technology Awards at Productronica | Indium Corporation was honored with two GLOBAL Technology Awards during an awards ceremony on November 14 at Productronica in Munich, Germany. The company was honored in both the Flux and Adhesives/Underfills Encapsulants categories for NC-809, a halogen-free, ultra-low residue flip-chip flux, and InTACK, a drop-in, robust tacking agent for power module assembly, respectively. Presented by Global SMT & Packaging, the Global Technology Awards recognize the best new innovations in the printed circuit assembly and packaging industries introduced in the past 12 months. | 15.11.2023 14:00:00 | Nov | news_2023-12-01_9.jpg | \images\news_2023-12-01_9.jpg | https://www.indium.com/corporate/media-center/news/indium-corporation-honored-with-two-global-technology-awards-at-productronica/ | indium.com |
| Teaming Up to Increase GaN Power System Performance for High Power Applications | Transphorm and Allegro MicroSystems announced a co... | 11670 | Industry News | Teaming Up to Increase GaN Power System Performance for High Power Applications | Transphorm and Allegro MicroSystems announced a collaboration including Transphorm's SuperGaN FETs and Allegro's AHV85110 Isolated Gate Driver to enable the expansion of GaN power system design for high power applications. Transphorm's SuperGaN FETs are designed to work in various topologies and are available in several different packages to support a wide power range while also satisfying diverse end application requirements. SuperGaN FETs are used in multiple commercial products, including higher power systems where they are proven to notably increase reliability, power density, and efficiency. Allegro's self-powered, single-channel isolated gate driver IC is optimized for driving GaN FETs in multiple applications and circuits. The AHV85110 is proven to enhance driver efficiency by as much as 50% compared to competitive gate drivers. This unique solution greatly simplifies the system design, reduces noise by 10x and common mode capacitance by 15 times compared to other solutions in the market. Those interested in testing the collaborative solution can do so via Allegro's APEK85110KNH-06-T evaluation board. The board incorporates both the AHV85110 designed to work in various applications along with Transphorm's recently announced TOLL packageavailable in three devices with on-resistances of 35, 50, and 72 milliohms. | 15.11.2023 13:00:00 | Nov | news_2023-12-01_8.jpg | \images\news_2023-12-01_8.jpg | https://www.transphormusa.com/en/news/transphorm_allegro_collaboration/ | transphormusa.com |
| 12V Output 2040W 3-Phase Industrial Power Supply | TDK Corporation announces the addition of the TDK-... | 11680 | Product Release | 12V Output 2040W 3-Phase Industrial Power Supply | TDK Corporation announces the addition of the TDK-Lambda brand TPS4000-12 power supply, further extending the existing 3kW to 4kW rated TPS series. Delivering up to 2040W output power (12V at 170A) in a 2U high package, the TPS4000 series operates from a wide range Delta or Wye 350 - 528Vac three phase input. These industrial power supplies are ideal for use in many applications including test and measurement equipment, semiconductor fabrication, additive manufacturing, printers, lasers and RF power amplifiers. The high voltage, three-phase input avoids the requirement for costly step-down transformers and assists phase load current balancing. The TPS4000 series is fully featured with isolated AC Fail, DC Good and dropped phase signals, remote on/off, remote sense, and a 12V 0.3A standby supply. A PMBus<sup>TM</sup> communications interface allows remote monitoring of the output voltage, output current, internal temperature, status signals and fan speed. In addition, the output voltage, over current limit and the remote on/off can be programmed by the PMBus. The output voltage can also be adjusted from 9.6 to 14.1V and the current limit point by 70-105% using front panel potentiometers or an analog 0-5Vdc voltage. Up to eight units can be connected in parallel for higher power and internal ORing FETs allow redundant operation. | 14.11.2023 13:30:00 | Nov | news_2023-12-01_18.jpg | \images\news_2023-12-01_18.jpg | https://www.emea.lambda.tdk.com/uk/news/article/19761 | lambda.tdk.com |
| Ultra-Low Loss Shielded Power Inductors | Coilcraft's XGL1712 molded power inductors offer l... | 11677 | Product Release | Ultra-Low Loss Shielded Power Inductors | Coilcraft's XGL1712 molded power inductors offer lowest DC and AC losses for a wide range of DC-DC converters. Additional performance benefits include a wider range of inductance values and improved I<sub>rms</sub> current ratings.<br>· Wide inductance range up to 82 µH<br>· High current handling with soft saturation characteristics<br>· AEC-Q200 (–40°C to +125°C) with a 165°C max part temperature | 14.11.2023 10:30:00 | Nov | news_2023-12-01_15.jpg | \images\news_2023-12-01_15.jpg | https://www.coilcraft.com/en-us/products/power/shielded-inductors/molded-inductor/xgl/xgl1712/ | coilcraft.com |
| Li-Ion Battery Protection ICs with Overcurrent Detection | Nisshinbo Micro Devices has launched the NB7142 an... | 11678 | Product Release | Li-Ion Battery Protection ICs with Overcurrent Detection | Nisshinbo Micro Devices has launched the NB7142 and NB7143 series Li-Ion battery protection ICs, intended for applications requiring high-precision overcurrent and short-circuit detection, such as portable gadgets, smartphones, game consoles and handheld devices. The NB7142 and NB7143 are exceptional protection ICs designed for one-cell Li-ion/polymer batteries. They are equipped with standard features such as overcharge/over-discharge voltage and charge/discharge overcurrent detection, which makes the application highly reliable. With a wide overcurrent detection range, the protection IC can handle any challenging overcurrent event with ease. The low standby current provides extended operating time even with small capacity batteries. The FET-sense current detection guarantees high accuracy in over-current and short-circuit detection, making it an indispensable tool for any battery-powered device. The NB7142 and NB7143 series are available in small DFN1212-6-GK and DFN1814-6-GN packages and therefore convenient to use on small circuit boards or can be integrated into a laminated battery pack. | 11.11.2023 11:11:00 | Nov | news_2023-12-01_16.jpg | \images\news_2023-12-01_16.jpg | https://www.nisshinbo-microdevices.co.jp/en/products/lithium-ion-battery-protection/ | nisshinbo-microdevices.co.jp |
| Acquiring Newport Wafer Fab Intended to Accelerate SiC Production Plans | Vishay Intertechnology and Nexperia announced that... | 11666 | Industry News | Acquiring Newport Wafer Fab Intended to Accelerate SiC Production Plans | Vishay Intertechnology and Nexperia announced that they have entered into an agreement that Vishay will acquire Nexperia's wafer fabrication facility and operations located in Newport, South Wales, U.K. for approximately $177 million in cash. ATREG, the Seattle-based premier global firm for initiating, brokering, and executing the exchange of semiconductor manufacturing assets, served as Nexperia's transaction advisors. Newport Wafer Fab, located on 28 acres, is an automotive certified, 200mm semiconductor wafer fab that supplies primarily automotive markets. It is the largest semiconductor manufacturing site in the UK.<br>"Under new leadership in early 2023, Vishay set an ambitious goal of investing approximately $1.2 billion in capacity over a three-year period in order to position the company to seize the opportunities created by the megatrends of e-mobility and sustainability needed for a Net Zero economy. While this transaction is supplemental to our capex investment strategy, adding Newport Wafer Fab to our manufacturing footprint will be instrumental to achieving our goal of expanding capacity for our customers and to accelerating our SiC strategy," said Joel Smejkal, President and CEO of Vishay. "By agreeing to acquire Newport Wafer Fab, our goal is to safeguard the positions of the highly skilled and dedicated employees and to invest the necessary capital to set up production for our SiC Trench MOSFETs and diodes. With its solid balance sheet and ample liquidity, Vishay will immediately bring stability and its reliable cash flow generation to ensure the facility becomes a fully operational and profitable fab" added Mr. Smejkal. | 08.11.2023 09:00:00 | Nov | news_2023-12-01_4.jpg | \images\news_2023-12-01_4.jpg | https://ir.vishay.com/news/news-details/2023/Vishay-Intertechnology-to-Acquire-Nexperias-Newport-Wafer-Fab-for-177-million/default.aspx | vishay.com |
| Ultra-High-Speed Gate Driver IC | ROHM has developed a gate driver IC - the BD2311NV... | 11674 | Product Release | Ultra-High-Speed Gate Driver IC | ROHM has developed a gate driver IC - the BD2311NVX-LB. It is optimized for GaN devices and achieves gate drive speeds on the order of nanoseconds (ns) - ideal for high-speed GaN switching. This was facilitated through a deep understanding of GaN technology and the continuing pursuit of gate driver performance. The result: fast switching with a minimum gate input pulse width of 1.25ns that contributes to smaller, more energy efficient, higher performance applications. In recent years, improving power conversion efficiency while reducing the size of power supply units in server systems have become important factors as the number of IoT devices continues to grow. This requires further advancements in the power device sector. At the same time, LiDAR, which is used not only for autonomous driving but also for monitoring industrial equipment and social infrastructure, demands high-speed pulsed laser light to further increase recognition accuracy. As these applications require the use of high-speed switching devices, in conjunction with the release of GaN devices, ROHM developed an ultra-high-speed gate driver IC that maximizes GaN performance. Going forward, ROHM continues to release smaller WLCSP products to support greater miniaturization. | 08.11.2023 07:30:00 | Nov | news_2023-12-01_12.jpg | \images\news_2023-12-01_12.jpg | https://www.rohm.com/news-detail?news-title=2023-11-08_news_gate-driver&defaultGroupId=false | rohm.com |
| Expanding Production Capacity for SiC Power Devices | ROHM has completed the acquisition of the assets o... | 11648 | Industry News | Expanding Production Capacity for SiC Power Devices | ROHM has completed the acquisition of the assets of Solar Frontier's former Kunitomi Plant located in Japan, on November 7, 2023, based on its basic agreement signed with Solar Frontier. The Plant will be operated by LAPIS Semiconductor, a subsidiary of the ROHM Group, as its Miyazaki Plant No.2. It will become the Group's main production site for SiC power devices and is aiming to start operation during 2024. The ROHM Group will continue to strengthen its production capacity in accordance with its Medium-Term Management Plan while keeping abreast of market conditions, and will also thoroughly enhance its BCM system to ensure a stable supply of products to customers. | 07.11.2023 13:00:00 | Nov | news_2023-11-15_8.jpg | \images\news_2023-11-15_8.jpg | https://www.rohm.com/news-detail?news-title=2023-11-07_news&defaultGroupId=false | rohm.com |
| ECCE Europe 2024: Call for Papers | Commencing in2024, IEEE PELS is embarking on a col... | 11668 | Event News | ECCE Europe 2024: Call for Papers | Commencing in2024, IEEE PELS is embarking on a collaboration with the European Center for Power Electronics (ECPE) for the PELS flagship conference in Europe: IEEE ECCE Europe 2024. The conference will take place at the Darmstadtium Conference Center in Darmstadt, Germany. The conference language is English in all presentations, discussions, and materials.<br>Important Dates:<br>February 26th, 2024: Submission of provisional full paper<br>April 22nd, 2024: Notification of acceptance<br>June 10th, 2024: Submission of final full paper | 06.11.2023 11:00:00 | Nov | news_2023-12-01_6.jpg | \images\news_2023-12-01_6.jpg | http://www.ecce-europe.org/ | ecce-europe.org |
| High-Speed Transient Load Steppers for VRM and PDN Validation | Picotest has released a series of very high-speed ... | 11682 | Product Release | High-Speed Transient Load Steppers for VRM and PDN Validation | Picotest has released a series of very high-speed transient load current steppers for power integrity, thermal design power (TDP), IC package evaluation, and power systems testing. This is a welcomed and essential development for demanding low-voltage, high-current applications including data centers, AI, graphics, EV, and servers. Voltage Regulation Module ('VRM') and power distribution network ('PDN') validation, including start-up and dynamic transient performance, stability, and noise require very fast load current transitions, high peak and average power, and suitable form factors for the test equipment interface. Picotest's line of load steppers utilize custom GaN technology and innovative power delivery formats and cooling to meet the requirements of these demanding power systems. Power levels up to 2000 Amps, 2000W average power (125W-125A/in2), up to 100% duty cycle, load current step rates that are sub-ns (<500ps), with DC – 50Mhz repetition rates. These edge rates and average power levels exceed current capabilities by orders of magnitude. The product line includes three levels based on load current and delivery form factor: less than 10A, 10A-50A, and up to 2000A. Both open and closed-loop control options are offered. The under 10A solution comes in a hand-held browser style probe format that fits into tight places. The open-loop current step is a single pre-defined current step. The 10A-50A solution is a water-cooled browser-style probe format with 6 user pre-defined current steps (6-bit logic level control). | 03.11.2023 15:30:00 | Nov | news_2023-12-01_20.jpg | \images\news_2023-12-01_20.jpg | https://www.picotest.com//picotest-news/picotest-releases-line-of-high-speed-transient-load-steppers-for-vrm-and-pdn-validation/ | picotest.com |
| Silicon Capacitor Series for Smartphones and other Compact Devices | ROHM has developed silicon capacitors - the BTD1RV... | 11661 | Product Release | Silicon Capacitor Series for Smartphones and other Compact Devices | ROHM has developed silicon capacitors - the BTD1RVFL series. The devices are being adopted in smartphones and wearable devices. Silicon semiconductor processing technology cultivated over many years has enabled higher performance in a smaller size. Silicon capacitors using thin-film semiconductor technology can provide higher capacitance in a thinner form factor than existing multilayer ceramic capacitors (MLCCs). At the same time, stable temperature characteristics, along with excellent reliability, are accelerating their adoption in a variety of applications. ROHM's silicon capacitors manufactured using proprietary RASMID miniaturization technology allow processing in 1µm increments that eliminates chipping during external formation and improves dimensional tolerances within ±10µm. This small variation in product size enables mounting with a narrower distance between adjacent components. At the same time, the backside electrode used for bonding to the substrate has been expanded to the periphery of the package to improve mounting strength. The first series in the lineup, the BTD1RVFL series (BTD1RVFL102 / BTD1RVFL471) consists of the 01005-size (0.1inch × 0.05inch) / 0402-size (0.4mm × 0.2mm) mass-produced surface mount silicon capacitors. The mounting area is reduced by approximately 55% over general 0201-size (0.2inch × 0.1inch) / 0603-size (0.6mm × 0.3mm) products to just 0.08mm2, contributing to greater application miniaturization. Moreover, a built-in TVS protection element ensures high ESD resistance that minimizes the number of person-hours required for surge countermeasures and other circuit design elements. | 02.11.2023 15:30:00 | Nov | news_2023-11-15_21.jpg | \images\news_2023-11-15_21.jpg | https://www.rohm.com/news-detail?news-title=2023-11-02_news_capacitor&defaultGroupId=false | rohm.com |
| 13th International Electric Drives Production Conference and Exhibition | The full program of the 13th E|DPC is now release... | 11649 | Event News | 13th International Electric Drives Production Conference and Exhibition | The full program of the 13th E|DPC is now released and available for download. Over 50 representatives from science and industry will speak about the latest trends in Electric Drives Production. The E|DPC will take place in Regensburg and online on November 29 and 30, 2023. Keynote speakers will be Dr. Benno Pichlmaier, Director Global Research & Advanced Engineering at AGCO Corp., and Zach Leveston, President & Managing Principal at xEL Mobility. | 02.11.2023 14:00:00 | Nov | news_2023-11-15_9.jpg | \images\news_2023-11-15_9.jpg | https://www.edpc.eu/ | edpc.eu |
| Breaking Ground on 300-mm Semiconductor Wafer Fabrication | Texas Instruments broke ground on its 300-mm semic... | 11643 | Industry News | Breaking Ground on 300-mm Semiconductor Wafer Fabrication | Texas Instruments broke ground on its 300-mm semiconductor wafer fabrication plant in Lehi, Utah. Joined by Utah Governor Spencer Cox, state and local elected officials, as well as community leaders, TI President and Chief Executive Officer Haviv Ilan celebrated the first steps toward construction of the new fab, LFAB2, which will connect to the company's existing 300-mm wafer fab in Lehi. Once completed, TI's two Utah fabs will manufacture tens of millions of analog and embedded processing chips every day at full production. "Today we take an important step in our company's journey to expand our manufacturing footprint in Utah. This new fab is part of our long-term, 300-mm manufacturing roadmap to build the capacity our customers will need for decades to come," said Ilan. "At TI, our passion is to create a better world by making electronics more affordable through semiconductors. We are proud to be a growing member of the Utah community, and to manufacture analog and embedded processing semiconductors that are vital for nearly every type of electronic system today." In February, TI announced its $11 billion investment in Utah, marking the largest economic investment in state history. LFAB2 will create approximately 800 additional TI jobs as well as thousands of indirect jobs, with first production available as early as 2026. | 02.11.2023 08:00:00 | Nov | news_2023-11-15_3.jpg | \images\news_2023-11-15_3.jpg | https://news.ti.com/texas-instruments-breaks-ground-on-new-300-mm-semiconductor-wafer-fabrication-plant-in-utah | ti.com |
| Inductor for Emerging Technologies | The tighter tolerance of the 1210 surface mount in... | 11662 | Product Release | Inductor for Emerging Technologies | The tighter tolerance of the 1210 surface mount inductor opens up fresh possibilities in emerging technologies allowing for the development of more efficient and compact electronic systems. The 1210's consistent performance also allows for tighter control over circuit behavior. That makes it to go-to inductor for high speed rail, transportation, signal and control systems, power distribution, and propulsion systems - where safe and reliable operation is the first priority. As a standard catalog part, it can be used in many applications throughout commercial, industrial, and military markets. Custom variants are available. Contact our engineering department to learn how custom variants can benefit your applications. Our expert engineering staff is always available to help develop application specific solutions for your design. We also offer fast turn-around prototype design. Market Applications are industries where tighter tolerance inductors are necessary, including aerospace and defense, medical, telecommunications, industrial automation, railway and transportation, energy and power electronics. Also Aerospace and Defense applications that use tighter tolerance to maintain signal integrity, reduce electromagnetic interference, and ensure reliable operation under extreme conditions. Ideal for A&D applications like radar systems, communications equipment, and navigation systems. And Energy and Power Electronics. Efficient voltage regulation, energy conversion, and power distribution are enhanced by the use of our tighter tolerance 1210 inductor. | 01.11.2023 16:30:00 | Nov | news_2023-11-15_22.jpg | \images\news_2023-11-15_22.jpg | https://www.delevan.com/en/products/power-inductors | delevan.com |
| Eight-Channel MXO 5 Oscilloscope | Rohde & Schwarz presents its R&S MXO 5 oscilloscop... | 11657 | Product Release | Eight-Channel MXO 5 Oscilloscope | Rohde & Schwarz presents its R&S MXO 5 oscilloscopes, available with four or eight channels. It is building on the MXO-EP processing ASIC technology developed by Rohde & Schwarz and introduced with the R&S MXO 4. The R&S MXO 5 is an eight-channel oscilloscope with 4.5 million acquisitions per second and 18 million waveforms per second across multiple channels. Engineers can capture intricate signal details and infrequent events with exceptional precision. The R&S MXO 5 has digital triggering on all eight channels to surpass its competitors in the accurate isolation of small signal anomalies. The capability of 45 000 FFTs per second provides engineers with unparalleled spectrum signal viewing, particularly for EMI and harmonic testing. By capturing up to 99% of real-time signal activity with the fast acquisition capture rate, the R&S MXO 5 speeds up signal analysis while detecting rare and random events missed by most other oscilloscopes. The features let engineers debug designs more efficiently across multiple applications – from power conversion to automotive analysis – making power and signal integrity measurements as well as logic and bus protocol debugging a breeze. | 31.10.2023 11:30:00 | Oct | news_2023-11-15_17.jpg | \images\news_2023-11-15_17.jpg | https://www.rohde-schwarz.com/about/news-press/all-news/evolved-for-more-challenges-rohde-schwarz-adds-eight-channel-r-s-mxo-5-to-next-generation-oscilloscopes-press-release-detailpage_229356-1424833.html | rohde-schwarz.com |
| X-Ray Topography Based Defect Characterization for SiC Wafers | A cross-organizational team from Rigaku SE and Fra... | 11646 | Industry News | X-Ray Topography Based Defect Characterization for SiC Wafers | A cross-organizational team from Rigaku SE and Fraunhofer IISB has established a semiconductor material characterization method in their jointly operated Center of Expertise for X-ray Topography in Erlangen, Germany. They succeeded not only in developing an industry-ready X-ray topography system, but also in employing defect detection and quantification algorithms, achieving a worldwide unique material characterization method for silicon carbide (SiC) wafers. SiC is an excellent semiconductor for application areas like electric mobility and transportation, sustainable energy supply, industrial infrastructure up to sensors and quantum technologies even under harsh operating conditions. As representatives for the whole research team, Dr. Kranert and Dr. Reimann from Fraunhofer IISB and Dr. Hippler, Managing Director Rigaku Europe SE, have won the Georg Waeber Innovation Award 2023 from the Förderkreis für die Mikroelektronik e.V. (Microelectronics Promotion Society). In 2021, Rigaku SE and Fraunhofer IISB have founded the Center of Expertise for X-ray Topography, a joint lab that is located at the IISB's headquarters in Erlangen, Germany. Here, the cross-organizational team has now developed a new metrology that is non-destructive, robust, reliable, high-throughput and therefore capable of swiftly detecting all relevant crystallographic defects in SiC substrates. This innovation realized the holistic approach of setting up the measurement device, i.e., the X-ray topography (XRT) tool as well as formulating appropriate measurement and analysis routines that specifically meet the industry's demands for speed, reliability, and accuracy. The development process was supported by rigorous scientific validation of the results, a crucial factor for the acceptance of a new approach in the industry. | 31.10.2023 11:00:00 | Oct | news_2023-11-15_6.jpg | \images\news_2023-11-15_6.jpg | https://www.iisb.fraunhofer.de/en/press_media/press_releases/pressearchiv/archiv_2023/georg-waeber-innovation-award-2023.html | iisb.fraunhofer.de |
| SMD Inrush Current Limiter | TDK Corporation has developed the J404, a surface-... | 11656 | Product Release | SMD Inrush Current Limiter | TDK Corporation has developed the J404, a surface-mountable inrush current limiter (ICL) based on PTC (positive temperature coefficient) technology. Designed for DC voltages of up to 500 V and AC voltages of up to 350 V, the device automatically and intrinsically limits excessive currents in applications such as DC links and charging devices in electromobility. Due to the very compact dimensions of 13.5 x 10 x 11 mm (L x W x H), users can save up to 70% space and weight on the PCB with this surface-mount design. The components can also be processed quickly in automated production lines. As a result, the component is ideally suited for numerous industrial and automotive applications. The reference temperature at which the device becomes highly resistive is +170 °C, with a heat capacity of 1 J/K and a thermal time constant of 100 s. At room temperature, the electrical resistance is 500 Ω, with a minimum value of 150 Ω. The J404 can switch off a defect (short circuit) up to 100 times, and up to 100,000 cycles when charging and discharging capacitors. Large capacitors in DC link circuits, found in e-mobility inverters or variable-speed drives in industrial applications, act temporarily like a short circuit at the moment they are switched on. This high energy must not damage other components in the system; the same applies in the event of a defect. A PTC thermistor provides such protection by heating itself due to the high current and becoming highly resistive in a very short time, thereby reducing the current to a safe level. | 31.10.2023 10:30:00 | Oct | news_2023-11-15_16.jpg | \images\news_2023-11-15_16.jpg | https://www.tdk-electronics.tdk.com/en/373388/company/press-center/press-releases/press-releases/tdk-presents-world-s-first-smd-inrush-current-limiter/3188678 | tdk-electronics.tdk.com |
| Shrink Motor Drives for eBikes, Robots, and Drones with 100 V GaN FETs | EPC announces the availability of the EPC9194, a 3... | 11654 | Product Release | Shrink Motor Drives for eBikes, Robots, and Drones with 100 V GaN FETs | EPC announces the availability of the EPC9194, a 3-phase BLDC motor drive inverter reference design. It operates from an input supply voltage range of 14 V to 60 V and delivers up to 60 A<sub>pk</sub> (40 A<sub>RMS</sub>) output current. This voltage range and power level makes the solution ideal for a variety of 3-Phase BLDC motor drives including eBikes, eScooters, drones, robots, DC servo motors. The EPC9194 demonstration board features six (6) EPC2302 100V eGaN FETs in a 3 mm x 5 mm QFN package. The board's size is only 130 mm x 100 mm (including the connector). The EPC2302 eGaN FET offers an incredibly small R<sub>DS(on)</sub>, of just 1.8 mOhm, combined with very small Q<sub>G</sub>, Q<sub>GD</sub>, and Q<sub>OSS</sub> parameters for reduced conduction and switching losses. The package is a thermally enhanced Q<sub>FN</sub> with exposed top for enhanced heat dissipation to the heatsink, and wettable flanks for easy inspections. The estimated total power loss with six EPC2302's at 20 A<sub>RMS</sub> and with 100 kHz PWM frequency is half that of a Si MOSFET solution with the same R<sub>DS(on)</sub> operating at 16 kHz PWM frequency. The 100 kHz PWM frequency enables a quasi-pure sinusoidal current, reducing vibration and distortion in the motor and resulting in about 7% higher motor system efficiency. Additionally, 100 kHz PWM frequency allows for the reduction of the input filter and the elimination or reduction of electrolytic capacitors. | 31.10.2023 08:30:00 | Oct | news_2023-11-15_14.jpg | \images\news_2023-11-15_14.jpg | https://epc-co.com/epc/about-epc/events-and-news/news/artmid/1627/articleid/3148/shrink-motor-drives-for-ebikes-robots-and-drones-with-100-v-gallium-nitride-gan-fets-from-epc | epc-co.com |
| High-Current Motor-Drive Series | STMicroelectronics has announced a high-current mo... | 11659 | Product Release | High-Current Motor-Drive Series | STMicroelectronics has announced a high-current motor-drive series with the introduction of the first two STSPIN9 devices, targeting high-end industrial and home and professional appliances. The 4.5A STSPIN948 and 5.0A STSPIN958 integrate PWM control logic and a 58V power stage with system protection and two operational amplifiers for current sensing. Suitable for driving brushed DC motors and bipolar stepper motors, both ICs allow flexibility and scalability while streamlining the bill of materials.<br>The STSPIN948 contains two full bridges that can be configured to work in different modalities giving developers flexibility to drive multiple and differently-rated motors in several configurations. With a choice of current control based on PWM with fixed off-time or a programmable threshold, the STSPIN948 can be used in five different modes. This 4.5A IC is packaged as a 7mm x 7mm VQFPN48.<br>The STSPIN958 contains a single full bridge that can be configured to drive two unidirectional motors, one bidirectional brushed DC motor, or one higher-current unidirectional motor by parallelizing the outputs. With the same choices of fixed off-time and programmable current control, as well as dual half-bridge, single full-bridge, and half-bridge parallel connections, this IC supports seven different driving methods. The 5.0A STSPIN958 is housed in a 5mm x 5mm VFQFPN32 package. | 30.10.2023 13:30:00 | Oct | news_2023-11-15_19.jpg | \images\news_2023-11-15_19.jpg | https://newsroom.st.com/media-center/press-item.html/n4577.html | st.com |
| PCIM Asia 2024 Exhibitor Applications and Call for Conference Abstracts | With PCIM Asia now regularly moving every year bet... | 11644 | Event News | PCIM Asia 2024 Exhibitor Applications and Call for Conference Abstracts | With PCIM Asia now regularly moving every year between Shanghai and Shenzhen, 2024 will see the exhibition once again taking place at the Shenzhen World Exhibition and Convention Center, expanding to 20,000 sqm and expecting to host over 200 exhibitors. The PCIM Asia Conference has announced the submission deadline for abstracts to be 4 March 2024. Held from 28 – 30 August 2024 at the Shenzhen World Exhibition and Convention Center, PCIM Asia and the PCIM Asia Conference promise to continue providing a comprehensive platform helping the drive the development of power electronics and related industries in the region. Application fields include industrial electronics, automotive electronics, smart home and consumer electronics, renewable energy management, ultra high-power applications and more. The event will once feature a wide range of interactive seminars, workshops, and networking opportunities, with industry experts on hand to share their expertise and knowledge, making this a must-attend event for professionals in the field. Prof Leo Lorenz, Chairman of the PCIM Advisory Board commented on the growing significance of the exhibition and conference: "PCIM Asia 2023 was very well received, with participants from all over the world convening to discuss the promising future power electronics. Many have commented that they see PCIM Asia as an increasingly prominent gathering point both in the region and worldwide. Together with PCIM Europe in Nuremberg, the two events constitute the most important platform for the industry as a whole." | 30.10.2023 09:00:00 | Oct | news_2023-11-15_4.jpg | \images\news_2023-11-15_4.jpg | https://pcimasia-expo.cn.messefrankfurt.com/shenzhen/en/press/press-releases/2023/PCIM24_PR1.html | pcimasia-expo.cn. |
| 1250-Volt GaN Switcher IC | Power Integrations released the world's highest-vo... | 11653 | Product Release | 1250-Volt GaN Switcher IC | Power Integrations released the world's highest-voltage, single-switch gallium-nitride (GaN) power supply IC, featuring a 1250-volt PowiGaN switch. InnoSwitch3-EP 1250 V ICs are the member of Power Integrations' InnoSwitch family of off-line CV/CC QR flyback switcher ICs, which feature synchronous rectification, FluxLink safety-isolated feedback and an array of switch options: 725 V silicon, 1700 V silicon carbide, and PowiGaN in 750 V, 900 V and now 1250 V varieties. The switching losses for Power Integrations' proprietary 1250 V PowiGaN technology are less than a third of that seen in equivalent silicon devices at the same voltage. This results in power conversion efficiency as high as 93 percent – enabling highly compact flyback power supplies that can deliver up to 85 W without a heatsink. Designers using the InnoSwitch3-EP 1250 V ICs can confidently specify an operating peak voltage of 1000 V, which allows for industry-standard 80 percent de-rating from the 1250 V absolute maximum. This provides significant headroom for industrial applications and is particularly valuable in challenging power grid environments where robustness is an essential defense against grid instability, surge and other power perturbations. | 30.10.2023 07:30:00 | Oct | news_2023-11-15_13.jpg | \images\news_2023-11-15_13.jpg | https://investors.power.com/news/news-details/2023/Power-Integrations-Releases-Ground-Breaking-1250-Volt-GaN-Switcher-IC/default.aspx | power.com |
| PLECS Conference 2024 | The PLECS Conference is coming back on March 12th ... | 11625 | Event News | PLECS Conference 2024 | The PLECS Conference is coming back on March 12th & 13th 2024, with insights into simulating thermal behavior of power semiconductors. The speakers are various users of PLECS from industry, research, and academia. In the exhibition, engineers of semiconductor manufacturers will be ready for discussion. The two-day event will also provide plenty of networking opportunities with all participants. The conference language will be English. As this is an on-site only event, there will be no virtual replacement. The Plexim staff is excited to welcome you in Zurich! | 26.10.2023 14:00:00 | Oct | news_2023-11-01_10.jpg | \images\news_2023-11-01_10.jpg | https://plexim.com/events/seminars/2215 | plexim.com |
| DC Contactors for Power Distribution, Energy Storage and Battery Systems | TTI is now stocking the IHV series of high-voltage... | 11658 | Product Release | DC Contactors for Power Distribution, Energy Storage and Battery Systems | TTI is now stocking the IHV series of high-voltage DC contactors from TE Connectivity. Developed for use in high-voltage control and protection systems, EV charging stations, energy storage systems, and large-scale photovoltaic/energy storage systems, the IHV series is hermetically sealed and, therefore, intrinsically safe in these harsh/explosive environments. With a current rating of 350A and switching voltage of up to 1,800VDC, the IHV350 contactors meet the safety robustness needs of the increasingly higher voltage applications now being developed. "Building the next generation of energy-efficient infrastructure for battery energy storage system (BESS) solutions will require innovations that increase system voltages to improve power density and provide overall system efficiency while reducing installation costs," explains Markus Lorenz, Director Industry Marketing – Industrial Europe, TTI. "We are seeing system voltages shifting from 1,000VDC to 1,500VDC, which require reliable current switching capabilities meeting engineering and architecture requirements. TE's IHV series high-voltage DC contactors fulfil this role perfectly." These compact high-voltage DC contactors are lightweight, making them easy to handle, and have flexible mounting directions. An optional auxiliary contact is available to monitor the power/main contact. All products within the IHV series are RoHS and ELV compliant to the EU Directives and come with UL, CE and CCC certifications. | 26.10.2023 12:30:00 | Oct | news_2023-11-15_18.jpg | \images\news_2023-11-15_18.jpg | https://www.ttieurope.com/content/ttieurope/en/about-tti/news-center/corporate-news/press-releases/2023/october/pr-10272023-tti-europe-stocks-te-connectivity-ihv-series-contactors.html | ttieurope.com |
| AC/DC Power Supplies up to 450W Conduction Cooled | TRACO POWER releases their TCI 500U series of powe... | 11655 | Product Release | AC/DC Power Supplies up to 450W Conduction Cooled | TRACO POWER releases their TCI 500U series of power supplies rated up to 450W @ 230 VAC and 400W @ 115VAC conduction-cooled operation and 500W with 30CFM airflow. This series was designed to support applications where forced air cooling is not desired or not available. Available in a compact 3.27 x 5.19 x 1.58" U-frame package, please see TCI 500 series with top-mounted fan if 500W is required. The TCI 500U series consists of 3 single output models with 12, 24, or 48 VDC outputs and are designed to maximize efficiency and thermal performance. Up to 92% efficiency allows 400W conduction-cooled operation from -20 to +45°C (see app note for operation up to +80°C) and 500W output with 30 CFM airflow. Active power factor correction, internal EN 55032 class B filter (radiated & conducted), 4250 VAC reinforced isolation, and over voltage (OVC III) compliance. Features include 5VDC standby & 12VDC auxiliary outputs, Power Good, Remote On/Off & Remote Sense for system interface make the TCI 500U ideal for instrumentation, industrial, ITE and IoT applications around the globe. | 26.10.2023 09:30:00 | Oct | news_2023-11-15_15.jpg | \images\news_2023-11-15_15.jpg | https://www.tracopower.com/de/tci-npi | tracopower.com |
| Transformer Series for SiC MOSFET Gate Drivers | Würth Elektronik presents additions to the WE-AGDT... | 11630 | Product Release | Transformer Series for SiC MOSFET Gate Drivers | Würth Elektronik presents additions to the WE-AGDT series, with interwinding capacitance lower than 1 picofarad, more topologies and higher output voltage options. All transformers use the same compact SMT EP7 package with 11.3 x 10.95 x 11.94mm dimensions. The WE-AGDT series is an Auxiliary Gate Drive Transformer series for up to 6 W isolated auxiliary supplies targeting gate drivers systems for SiC-MOSFETs and IGBTs. In these designs, the most crucial aspect is the transformer interwinding capacitance due to the high dV/dt, which is common in designs utilizing Wide-Bandgap Devices. The additions to this series feature interwinding capacitance is as low as 0.68 pF and output voltages as high as 30 V. Options now include LLC, Half-Bridge, or Flyback topologies and one or two outputs which can be used in either unipolar or bipolar applications. WE-AGDT complies with the IEC62368-1/IEC61558-2-16 safety standard and is AEC-Q200 qualified. The transformers are suitable for use in industrial drives, AC motor inverters, HEV/EV charging stations, solar inverters, uninterruptible power supply devices and active power factor correction. | 26.10.2023 07:30:00 | Oct | news_2023-11-01_15.jpg | \images\news_2023-11-01_15.jpg | https://www.we-online.com/en/news-center/press?d=agdt | we-online.com |
| Top-Side Cooled TOLT FET GaN Transistor | Transphorm introduced the SuperGaN TOLT FET. With... | 11652 | Product Release | Top-Side Cooled TOLT FET GaN Transistor | Transphorm introduced the SuperGaN TOLT FET. With an on-resistance of 72 milliohms, the TP65H070G4RS transistor is a top-side cooled surface mount GaN device in the JEDEC-standard (MO-332) TOLT package. The TOLT package offers flexibility of thermal management to customers where system requirements do not allow for the more conventional surface mount devices with bottom-side cooling. The thermal performance of the TOLT is similar to that of the widely used, thermally robust TO-247 through-hole packages and delivers the added benefit of highly efficient manufacturing processes enabled by SMD-based printed circuit board assembly (PCBA). The TP65H070G4RS leverages Transphorm's robust 650-volt normally-off d-mode GaN platform offering improved efficiency over silicon, silicon carbide, and other GaN offerings via lower gate charge, output capacitance, crossover loss, reverse recovery charge, and dynamic resistance. The SuperGaN platform advantages combined with the TOLT's better thermals and system assembly flexibility results in a high performance, high reliability GaN solution for customers seeking to bring to market power systems with higher power density and efficiency at an overall lower power system cost. "Surface mount devices such as the TOLL and the TOLT offer various benefits such as lower internal inductance as well as simpler board mounting during manufacturing. The TOLT adds to that more flexible overall thermal management with through-hole like thermal performance by using top-side cooling," said Philip Zuk, SVP Business Development and Marketing, Transphorm. | 26.10.2023 06:30:00 | Oct | news_2023-11-15_12.jpg | \images\news_2023-11-15_12.jpg | https://www.transphormusa.com/en/news/tolt_supergan_fet/ | transphormusa.com |
| Business Opportunities for High-Tech Industries | As part of the esteemed global Thermal Management ... | 11620 | Event News | Business Opportunities for High-Tech Industries | As part of the esteemed global Thermal Management Expo portfolio, Thermal Management Expo Europe is a unique, no-cost exhibition and conference that serves as a bridge, connecting senior engineers and key decision-makers with suppliers specializing in thermal systems and materials. Co-located with Foam Expo Europe and Adhesives and Bonding Expo Europe, this event is scheduled for December 5 - 7, 2023, at Messe Stuttgart (Hall 1), Germany. Thermal Management Expo Europe promises to showcase the latest systems, materials, and technologies aimed at addressing thermal management challenges across several high-tech industries. Some well-known brands, including Blueshift, Schlegel Electronic Materials Belgium BV, Linseis Thermal Analysis, and Infineon Technologies, will be showcasing their solutions. In addition to the exhibition, a free-to-attend conference will be held, featuring sessions led by technical experts from prominent companies like Isar Aerospace Technologies, Ducker Carlisle, Calyos, IDTechEx, and more. These sessions will provide insights into thermal management systems and design, covering topics such as Thermal Management in Electric Vehicles, supply chain collaboration, material innovation, thermal simulation and design, thermal management in electronics, sustainability, and the circular economy. Ipek Saltik, Exhibition Manager, emphasized, "Thermal Management assumes a critical role in every application. Given the industry's projected growth, we are thrilled to announce the expansion of our well-established event into both the US and European markets. Regardless of the location, the Thermal Management Expo & Conferences remains the premier gathering for professionals in the thermal engineering sector and supply chain." | 25.10.2023 10:00:00 | Oct | news_2023-11-01_5.jpg | \images\news_2023-11-01_5.jpg | https://www.thermalmanagementexpo-europe.com/?utm_source=bodos&utm_medium=pressrelease&utm_campaign=TEE23_Partners | thermalmanagementexpo-europe.com |
| Collaboration on Current Sensors for Electrification Applications | TDK Corporation and LEM International SA announce ... | 11641 | Industry News | Collaboration on Current Sensors for Electrification Applications | TDK Corporation and LEM International SA announce that they have entered into a development agreement of custom TMR dies for integrated current sensors. TDK will develop tunnel magnetoresistance (TMR) dies for LEM, who will incorporate these TMR dies into their integrated current sensors (ICS), a critical component used in rapidly expanding electrification applications like onboard chargers (OBCs) in EVs. This collaboration will further position TDK's TMR technology to succeed in the automotive and industrial markets, two sectors in which LEM brings deep expertise, especially in booming segments such as energy storage, motor drives, and solar inverters. TDK expects to bolster its market position on magnetic sensors by offering superior products that support existing and upcoming applications in market trends like energy transformation (EX) and digital transformation (DX). LEM selected TDK as a partner based on its technology performance – including accuracy and noise – as well as reliable supply, automotive quality, and process maturity. The current sensor market is fragmented and requires high volume and cost-effective products. For this promising market, TDK and LEM will produce a sensor that is faster, more accurate, and with lower noise than existing solutions. | 25.10.2023 06:00:00 | Oct | news_2023-11-15_1.jpg | \images\news_2023-11-15_1.jpg | https://www.tdk.com/en/news_center/press/20231025_01.html | tdk.com |
| Dual-Inline Silicon-Carbide Power Modules for Automotive Applications | STMicroelectronics has released the ACEPACK DMT-32... | 11638 | Product Release | Dual-Inline Silicon-Carbide Power Modules for Automotive Applications | STMicroelectronics has released the ACEPACK DMT-32 family of silicon carbide (SiC) power modules in a 32-pin, dual-inline, molded, through-hole package for automotive applications. Targeted at systems such as on-board chargers (OBC), DC/DC converters, fluid pumps and air conditioning, they deliver advantages including high power density, very compact design, and simplified assembly. The product family enhances flexibility for system designers by presenting a choice of four-pack, six-pack, and totem-pole configurations. The modules contain 1200V SiC power switches that leverage ST's second- and third-generation SiC MOSFET technology ensuring low RDS(on) values. The devices deliver efficient switching performance with minimal dependence on temperature to ensure high efficiency and reliability at converter system level. Leveraging ST's robust ACEPACK technology, the modules reduce overall system- and design-development costs while ensuring reliability. The package technology features an aluminum nitride (AlN) insulated substrate for thermal performance. There is also an integrated NTC sensor that provides temperature monitoring for thermal protection. | 24.10.2023 15:30:00 | Oct | news_2023-11-01_23.jpg | \images\news_2023-11-01_23.jpg | https://newsroom.st.com/media-center/press-item.html/n4580.html | st.com |
| Launch of the SPS CareerDrive Portal | The shortage of skilled workers has been a major i... | 11626 | Event News | Launch of the SPS CareerDrive Portal | The shortage of skilled workers has been a major issue for several years and has also impacted the automation industry. Due to the high demand for experts and motivated junior staff, Mesago Messe Frankfurt, the organizer of the trade fair SPS - Smart Production Solutions, has now launched the SPS CareerDrive jobs portal this fall to support companies in finding suitable experts. The SPS has always been an opportunity for talented individuals to get a personal feel for the career opportunities available and for companies to present themselves as potential employers. But the ever-present shortage of skilled workers worldwide has prompted a change in thinking. According to a study conducted at the beginning of the year by the Institute of the German Economy (IW Köln), Germany, for example, has a shortage of 88,600 skilled workers in energy and electrical professions. In mechanical and automotive engineering, the gap is estimated to be 56,600, while the shortfall in the IT sector is calculated to be 50,600 skilled workers. Consequently, employee recruitment and retention are at present among the most important HR management issues for many companies. With the SPS CareerDrive career portal, Mesago provides a platform and opportunity for companies and job seekers to offer and find employment in the automation industry, not only during the event, but throughout the entire year. | 24.10.2023 15:00:00 | Oct | news_2023-11-01_11.jpg | \images\news_2023-11-01_11.jpg | https://sps.mesago.com/nuernberg/en/press/press-releases/sps-press-releases/careerdrive.html | sps-exhibition.com |
| D-Shaped Cylindrical Reed Sensor for IoT Proximity Sensing Applications | Littelfuse announced the release of the 59001 Reed... | 11636 | Product Release | D-Shaped Cylindrical Reed Sensor for IoT Proximity Sensing Applications | Littelfuse announced the release of the 59001 Reed Sensor, a miniature D-shaped cylindrical reed sensor offering a combination of compact size, high performance, and customization options, making it an ideal choice for various industrial, appliances, and IoT proximity sensing applications. The key differentiator of the 59001 Reed Sensor lies in its compact size, measuring just 13.5 mm x 5.0 mm x 4.6 mm (0.591" x 0.197" x 0.181"). Its small form factor allows for space savings, making it ideal for applications where size constraints are a concern. Additionally, its D-shape provides a "poka-yoke" mechanism that simplifies installation, ensuring proper orientation of the sensor in the assembly. Its non-contact switching solution makes it particularly suitable for wet and harsh environments, ensuring reliable performance even in challenging conditions.<br>"We are excited to introduce the 59001 Reed Sensor to our customers," said Julius Venckus, Global Product Manager at Littelfuse. "By understanding the design challenges and constraints of various size-limited applications, we have developed a shape-oriented and smaller-size reed sensor that addresses these specific requirements. This new addition to our reed sensors further enables us to provide the most comprehensive portfolio of magnetic sensing solutions to meet our customers' needs." | 24.10.2023 13:30:00 | Oct | news_2023-11-01_21.jpg | \images\news_2023-11-01_21.jpg | https://www.littelfuse.com/about-us/news/news-releases/2023/littelfuse-d-shaped-cylindrical-reed-sensor-delivers-compact-design-flexibility-solution-for-iot-proximity-sensing-applications.aspx | littelfuse.com |
| Automotive MOSFETs Offer Improved On-Resistance and Reduced Size | Toshiba Electronics Europe has launched a pair of ... | 11632 | Product Release | Automotive MOSFETs Offer Improved On-Resistance and Reduced Size | Toshiba Electronics Europe has launched a pair of automotive grade 40V N-channel power MOSFETs based upon their latest U-MOS IX-H process. The devices use a S-TOGL<sup>TM</sup> (Small Transistor Outline Gull-wing Leads) package that offers a number of advantages in automotive applications. The XPJR6604PB and XPJ1R004PB have a V<sub>DSS</sub> rating of 40V and the XPJR6604PB is rated for a continuous drain current (I<sub>D</sub>) of 200A (XPJ1R004PB = 160A). Both devices are rated for pulsed current (I<sub>DP</sub>) at 3x this value, 600A and 480A respectively. The 200A rating is higher than that achieved by Toshiba's 6.5mm × 9.5mm DPAK+ package. The automotive MOSFETs use Toshiba's S-TOGL<sup>TM</sup> package that measures just 7.0mm × 8.44mm × 2.3mm. The products are post-less and feature a multi-pin structure for the source leads that significantly decreases package resistance. Combining the S-TOGL<sup>TM</sup> package with Toshiba's U-MOS IX-H process gives the XPJR6604PB an on-resistance (R<sub>DS(ON)</sub> Compared to this device, the mounting area has reduced by around 55% compared while retaining the channel-to-case thermal resistance characteristics (Z<sub>th(ch-c)</sub>) - XPJR6604PB = 0.4°C/W and XPJ1R004PB = 0.67°C/W. Suited to harsh temperature environments, the MOSFETs are AEC-Q101 qualified and capable of operating at channel temperatures (T<sub>ch</sub>) as high as 175ºC. | 24.10.2023 09:30:00 | Oct | news_2023-11-01_17.jpg | \images\news_2023-11-01_17.jpg | https://toshiba.semicon-storage.com/eu/company/news/2023/10/mosfet-20231024-1.html | toshiba.semicon-storage.com |
| Lead Role in Drafting 2023 IEC White Paper | Mitsubishi Electric Corporation announced that it ... | 11642 | Industry News | Lead Role in Drafting 2023 IEC White Paper | Mitsubishi Electric Corporation announced that it played the key role in leading the project to draft the 2023 International Electrotechnical Commission (IEC) White Paper entitled "Power Semiconductors for an Energy-Wise society," which the IEC released on October 17. This is the first time for a White Paper, published annually since 2010, to issue recommendations for developing and expanding international standards and certification systems for power semiconductors. Each year, the IEC White Paper focuses on electrical, electronic and electromechanical technologies requiring international standardization, and makes related recommendations to the IEC and other organizations. Power semiconductors, one of Mitsubishi Electric's core product lines, are expected to continue to advance technologically and be increasingly adopted as key devices that reduce power consumption and efficiently convert electrical energy, supporting the global drive toward carbon neutrality by 2050. New materials such as silicon carbide (SiC) are being used in advanced power semiconductors for applications such as renewable energy and electric vehicles (EVs), but the development of international standards and certification systems for such devices is lagging. A lack of such standards and certifications could lead to a proliferation of nonconforming products and impede cooperation among manufacturers, users and regulators, thereby hindering the healthy growth of the power semiconductor global market. In response, Mitsubishi Electric initiated a White Paper project within the IEC Market Strategy Board (MSB) in October 2022. Together with experts from around the world, the project team addressed issues related to power semiconductor technologies, markets, and regulations. The resulting White Paper summarizes the applications, sectors and technological trends of power semiconductors and highlights the need for the development, alignment, and expansion of respective international standards and certification systems. In particular, the White Paper focuses on the critical role that power semiconductor standards can play in helping to realize emission-free, carbon-neutral industries for a healthier and more prosperous world. | 24.10.2023 07:00:00 | Oct | news_2023-11-15_2.jpg | \images\news_2023-11-15_2.jpg | https://www.mitsubishielectric.com/news/2023/1024.html | mitsubishielectric.com |
| Becoming a GaN Power House | Infineon Technologies announced the closing of the... | 11616 | Industry News | Becoming a GaN Power House | Infineon Technologies announced the closing of the acquisition of GaN Systems. The Ottawa-based company brings with it a broad portfolio of gallium nitride (GaN)-based power conversion solutions and application know-how. All required regulatory clearances have been obtained and GaN Systems has become part of Infineon effective as of the closing. "GaN technology is paving the way for more energy-efficient and CO <sub>2</sub>-saving solutions that support decarbonization," said Jochen Hanebeck, CEO of Infineon. "The acquisition of GaN Systems significantly accelerates our GaN roadmap and further strengthens Infineon's leadership in power systems through mastery of all relevant power semiconductor technologies. We welcome our new colleagues from GaN Systems to Infineon." Infineon now has a total of 450 GaN experts and more than 350 GaN patent families, which expands the company's leading position in power semiconductors and considerably speeds up time-to-market. Both companies' complementary strengths in IP and application understanding as well as a well-filled customer project pipeline put Infineon in an excellent position to address various fast-growth applications. On 2 March 2023, Infineon and GaN Systems announced that the companies had signed a definitive agreement under which Infineon would acquire GaN Systems for US$830 million. The acquisition, an all-cash transaction, was funded from existing liquidity. | 24.10.2023 06:00:00 | Oct | news_2023-11-01_1.jpg | \images\news_2023-11-01_1.jpg | https://www.infineon.com/cms/en/about-infineon/press/press-releases/2023/INFXX202310-014.html | infineon.com |
| Laboratory for Quantum Electronics and Power AI | Infineon Technologies has opened a laboratory for ... | 11650 | Industry News | Laboratory for Quantum Electronics and Power AI | Infineon Technologies has opened a laboratory for the development of quantum electronics in Oberhaching near Munich. The objective is to develop and test microelectronic circuits for quantum computers which will be stable and small, will operate reliably and which can be produced on an industrial scale. Approximately twenty researchers will work at the lab. In addition to quantum computing, activities will also focus on the development of AI algorithms for the early detection of variances in power systems. "Infineon plans to reinvent the core element of the quantum computer. One of the central tasks of the new quantum laboratory will be to develop and test electronic systems for ion trap quantum computing with the objective of integrating these systems in the Quantum Processing Unit. This is a prerequisite for making quantum computing scalable and useable," says Richard Kuncic, Senior Vice President and General Manager Power Systems at Infineon Technologies. "Thanks to their computing power, quantum computers will revolutionize many applications. But before quantum computers will have to be industrialized, a process which we are driving ahead in our new laboratory." Accordingly, the company has installed an innovative cryostat, a kind of super-refrigerator which can cool down to temperatures as low as 4 Kelvin (-269 degrees Celsius). Qubits, the smallest units for calculations with quantum computers, are extremely sensitive and only adequately stable under extreme conditions, typically temperatures below -250 degrees Celsius and at the lowest possible pressures. And the electronic systems have to keep working perfectly in spite of these extreme conditions. In environments this cold, many materials change their properties, including their electric behavior. | 23.10.2023 15:00:00 | Oct | news_2023-11-15_10.jpg | \images\news_2023-11-15_10.jpg | https://www.infineon.com/cms/en/about-infineon/press/market-news/2023/INFXX202310-011.html | infineon.com |
| 240 Watt Conduction Cooled Power Supply with 2.5 x 4" Footprint | TRACO POWER releases their TCI 240 series of condu... | 11634 | Product Release | 240 Watt Conduction Cooled Power Supply with 2.5 x 4" Footprint | TRACO POWER releases their TCI 240 series of conduction-cooled 240 watt power supplies without the need for a fan when mounted on a metal chassis or baseplate. Available in a compact fully-enclosed 2.46 x 4.09 x 1.54" footprint achieving a power density of 15.48 W/in3, a new standard for conduction cooled power density in this wattage range, perfect for applications where fan cooling is not available or not desired. The TCI 240 series consists of 3 single output models with 12, 24, or 48 VDC outputs and are designed to maximize efficiency and thermal performance. Up to 94% efficiency allows full-load conduction-cooled operation from -30 to +50°C (see app note for operation up to +80°C). Active power factor correction, internal EN 55032 class B filter (radiated & conducted), 4250 VAC reinforced isolation, over voltage category (OVC III) compliance and high reliability of 250'000 hours (MIL-HDBK-217F, ground benign) make the TCI 240 ideal for instrumentation, industrial, ITE and IoT applications around the globe. | 23.10.2023 11:30:00 | Oct | news_2023-11-01_19.jpg | \images\news_2023-11-01_19.jpg | https://www.tracopower.com/de/tci-npi | tracopower.com |
| Acquisition of Electronic Test & Measurement Solutions Provider | Fortive Corporation announced that it has entered ... | 11618 | Industry News | Acquisition of Electronic Test & Measurement Solutions Provider | Fortive Corporation announced that it has entered into a definitive agreement to acquire EA Elektro-Automatik Holding for $1.45 billion in cash, net of $215 million of tax benefits from Bregal Unternehmerkapital. The acquisition is subject to customary closing conditions and regulatory approvals and is expected to close in early first quarter of 2024. James A. Lico, President and Chief Executive Officer of Fortive, said, "We are pleased to announce our agreement to acquire EA Elektro-Automatik to enhance our leading position in electronic test and measurement, helping to enable the global energy transition. This acquisition will further position Fortive in multi-decade, multi-industry, high growth markets, leveraging Tektronix's global franchise and the power of the Fortive Business System to create unparalleled value for customers and shareholders." Fortive expects to finance the acquisition with available cash and debt financing. The acquisition is expected to be accretive to adjusted gross and operating margins and neutral to modestly accretive to adjusted diluted net earnings per share in fiscal 2024. | 23.10.2023 08:00:00 | Oct | news_2023-11-01_3.jpg | \images\news_2023-11-01_3.jpg | https://investors.fortive.com/press-releases/press-release-details/2023/Fortive-to-AcquireEA-Elektro-Automatik-an-Industry-leading-Provider-of-Electronic-Test--Measurement-Solutions/default.aspx | fortive.com |
| Authorized Distributors Stocking Wide Selection | Mouser Electronics is an authorized global distrib... | 11627 | Industry News | Authorized Distributors Stocking Wide Selection | Mouser Electronics is an authorized global distributor of solutions from ROHM Semiconductor. With over 13,000 ROHM products in stock or available to order, Mouser offers a wide portfolio of ROHM solutions, adding new products every day. Since 1990, Mouser has offered an ever-broadening selection of solutions from ROHM, including semiconductors, integrated circuits and other electronic components. These components find a home in the dynamic and ever-growing wireless, consumer, automotive and industrial electronics markets. Mouser has also collaborated with ROHM Semiconductor to create eBooks as a resource for design engineers. In 'Light Up Your Industrial IoT Design', experts from ROHM and Mouser offer in-depth articles covering a range of topics, including efficient power consumption, Wi-SUN wireless communication modules, and industrial IoT LEDs. In 'Driving the Future of Automotive Solutions with ROHM', subject matter experts from Mouser and ROHM provide technical insights into applications surrounding vehicle electrification, such as power management, lighting and motor control. | 19.10.2023 16:00:00 | Oct | news_2023-11-01_12.jpg | \images\news_2023-11-01_12.jpg | https://eu.mouser.com/newsroom/publicrelations-rohm-authorized-distributor-2023final/ | mouser.com |
| IC Energizes Mission-Critical Functions with Maximum Efficiency | Power Integrations provided PowiGaN gallium-nitrid... | 11628 | Industry News | IC Energizes Mission-Critical Functions with Maximum Efficiency | Power Integrations provided PowiGaN gallium-nitride (GaN) technology, expert design support, and financial sponsorship for Team aCentauri in the 3,000 km Bridgestone World Solar Challenge. Power Integrations' Mr. Green followed Team aCentauri and the 37 other entrants across the Australian Outback as they pushed the boundaries of innovation in efficiency, aerodynamics, speed and range for solar-powered cars. "After studying Power Integrations' extensive list of reference designs, Team aCentauri asked us to help them design a power converter based on the 750-volt, InnoSwitch3-EP with PowiGaN technology," said Trevor Hiatt, director of marketing at Power Integrations. "With our IC and expert design support, the team not only boosted energy efficiency to 95.7 percent while the system operates at maximum power, but also improved efficiency by more than 50 percent while the system drives light loads – which is most of the time." The Bridgestone World Solar Challenge began in Darwin on October 22 and concluded in Adelaide on October 29. | 18.10.2023 17:00:00 | Oct | news_2023-11-01_13.jpg | \images\news_2023-11-01_13.jpg | https://investors.power.com/news/news-details/2023/Power-Integrations-IC-Energizes-Mission-Critical-Functions-with-Maximum-Efficiency-in-Team-aCentauri-Solar-Race-Car/default.aspx | power.com |
| Funding from the European IPCEI ME/CT for Semiconductor Technology Innovation | X-FAB Group is set to receive subsidies as part of... | 11645 | Industry News | Funding from the European IPCEI ME/CT for Semiconductor Technology Innovation | X-FAB Group is set to receive subsidies as part of the new Important Project of Common European Interest in Microelectronics and Communication Technologies (IPCEI ME/CT). The funding, totaling up to 80 million Euros, is to be granted by the participating governments of France and Germany over a period of five years. The scheme supports innovation in microelectronics and communication solutions, playing a vital role in advancing European goals of digitalization, sustainability, and technological sovereignty. The funding will span across three of X-FAB's sites, each focusing on distinct aspects of semiconductor technology. The Corbeil-Essonnes facility in France specializes in smart sensors and drivers, new architectures, photonics and RF technologies. The site recently started volume production for 110nm technology on 200mm wafers, utilizing state-of-the-art BCD-on-SOI technology which was developed as part of the previous IPCEI ME program. The Erfurt site in Germany researches and develops novel manufacturing platforms for smart integrated sensor systems, broadening X-FAB's technology offering in smart sensor systems, 3D integration and heterogeneous chiplet integration through micro-transfer printing, thus further progressing cutting-edge technologies for system integration and advanced packaging. At the Itzehoe site in Germany, X-FAB will focus on the development and implementation of new methods for processing glass wafers. X-FAB recognizes the strategic importance of the IPCEI ME/CT funding in its efforts to develop differentiating technological offerings for next-generation semiconductor components. The initiative aims to meet the evolving demands of future markets in the automotive, medical, and industrial sectors, addressing needs including increased connectivity, smart sensors, and power devices with improved energy efficiency. | 18.10.2023 10:00:00 | Oct | news_2023-11-15_5.jpg | \images\news_2023-11-15_5.jpg | https://www.xfab.com/news/details/article/x-fab-set-to-receive-funding-from-the-european-ipcei-me-ct-for-semiconductor-technology-innovation | xfab.com |
| Low ON Resistance 100V Dual MOSFETs | ROHM has developed dual MOSFETs that integrate two... | 11631 | Product Release | Low ON Resistance 100V Dual MOSFETs | ROHM has developed dual MOSFETs that integrate two 100V chips in a single package - ideal for fan motor drive applied in communication base stations and industrial equipment. Five-models have been added as part of the HP8KEx/HT8KEx (Nch+Nch) and HP8MEx (Nch+Pch) series. Both series achieve the low R<sub>DS(on)</sub> by adopting new backside heat dissipation packages with excellent heat dissipation characteristics. As a result, R<sub>DS(on)</sub> is reduced by up to 56% compared with standard dual MOSFETs (19.6mΩ for the HSOP8 and 57.0mΩ for the HSMT8 Nch+Nch), contributing to lower set power consumption. At the same time, combining two chips in a single package provides greater space savings by reducing area considerably. For example, replacing two single-chip TO-252 MOSFETs with one HSOP8 decreases footprint by 77%. Next, ROHM will continue to expand its dual MOSFET lineup to withstand voltages ideal for industrial equipment while also developing low-noise variants. This is expected to contribute to solving social issues such as environmental protection by saving space and reducing power consumption in various applications. | 18.10.2023 08:30:00 | Oct | news_2023-11-01_16.jpg | \images\news_2023-11-01_16.jpg | https://www.rohm.com/news-detail?news-title=2023-10-18_news_mosfet&defaultGroupId=false | rohm.com |
| Detroit Automotive Technology Center is the Destination for Automotive Clients | Microchip Technology announces the expansion of it... | 11617 | Industry News | Detroit Automotive Technology Center is the Destination for Automotive Clients | Microchip Technology announces the expansion of its Detroit Automotive Technology Center in Novi, Michigan. The 24,000-square-foot facility is the destination for automotive clients to explore new technologies and to meet with technical experts to get support for their end applications and designs. Microchip has been part of the Detroit community since 1999, when it first opened its doors as an application and sales office. With the recent completion of phase three of its expansion project, Microchip has more than doubled its lab space, including the addition of labs that focus on high-voltage and E-Mobility applications. This larger facility will also bring more technology-related jobs to the region. "Microchip's automotive business is a cornerstone of our company's legacy. We remain focused on developing total system solutions, and this expansion provides our customers with immediate access to state-of-the-art resources," said Rich Simoncic, executive vice president of Microchip. "In addition to the Detroit location, we have Automotive Technology Centers in Munich, Shanghai, Tokyo and Austin, Texas, to support our global customer base." Located in the heart of the automotive industry, and with top tier OEMs, suppliers and startups operating in the region, Novi is a key location for Microchip's Detroit Automotive Technology Center and easily accessible to help OEMs with their design challenges. | 18.10.2023 07:00:00 | Oct | news_2023-11-01_2.jpg | \images\news_2023-11-01_2.jpg | https://www.microchip.com/en-us/about/news-releases/corporate/microchips-detroit-automotive-technology-center-is-destination | microchip.com |
| SENSOR+TEST: Early Booking Discount Until October 31 | The next SENSOR+TEST will be held in Nuremberg fro... | 11651 | Event News | SENSOR+TEST: Early Booking Discount Until October 31 | The next SENSOR+TEST will be held in Nuremberg from June 11-13, 2024. Companies that book their stand space by October 31, 2023, will not only benefit from an attractive position but also from discounted conditions. „SENSOR+TEST is a fixed trade fair date for us. In particular, the strong acceptance among trade visitors as well as the high quality of the trade fair discussions, from which new customer relationships develop in many cases, are decisive for our participation," reports Jan Tippner, Sales Manager at Delphin Technology AG in Bergisch-Gladbach, on his many years of positive experiences. Like him, many exhibitors have already secured their place at the leading international trade fair for sensor, measurement and testing technology in Nuremberg for next year. This is also confirmed by Elena Schultz, Managing Director of AMA Service GmbH: "After the successful 2023 trade fair, demand has picked up significantly. The numerous added values that the fair offers for exhibitors and visitors also contribute to this." "Innovative Calibration" will be the focus in 2024 with a generous exhibition area as well as a Technology Forum with best practice lectures, top-class tutorials and special sessions. A perfect combination to enable visitors to obtain even more targeted information. They will also have this opportunity in the new "Technology & Application Guided Tours" on the topics of "AI in Sensor, Measurement and Automation Technology", "Mobile Testing", and "Sensor, Measuring and Testing Technology for the Hydrogen Industry", which will be supplemented by panel discussions and forum lectures. | 17.10.2023 16:00:00 | Oct | news_2023-11-15_11.jpg | \images\news_2023-11-15_11.jpg | https://www.sensor-test.de/en/press/press-center/press-releases/increasing-exhibitor-interest-due-to-many-added-values-early-booking-discount-only-until-october-31-2023 | sensor-test.de |
| Podcast Examines how to Harness and Store Wave Power | Vicor Corporation speaks with C-Power, a global le... | 11660 | Product Release | Podcast Examines how to Harness and Store Wave Power | Vicor Corporation speaks with C-Power, a global leader in ocean wave energy systems, about how they harness and store wave power. An idea that began as a graduate project at Oregon State University has matured into a renewable energy power solutions for offshore applications that support the fast growing New Blue Economy. In the latest episode, learn how C-Power's solutions meet the global demand to decarbonize energy production, by converting ocean waves into usable forms of energy, while also enabling data transmission to and from the Cloud. The electricity harnessed by C-Power's autonomous offshore power systems (AOPS) powers remote marine projects and is an integral part to the company's plans to unleash the next wave of zero-carbon energy for terrestrial electric grids and remote offshore mini-grids. The Vicor Powering Innovation podcast is available to download from all major podcast providers, including Spotify, Apple Music and Google Podcasts. Listeners can learn about today's toughest power challenges, new ideas in electrification, creative power architectures and real-life power design challenges. | 17.10.2023 14:30:00 | Oct | news_2023-11-15_20.jpg | \images\news_2023-11-15_20.jpg | https://www.vicorpower.com/press-room/c-power-podcast | vicorpower.com |
| Expanded Partnership Highlights Significant EV Growth Opportunity | Allegro MicroSystems announced that BMW Group has ... | 11624 | Industry News | Expanded Partnership Highlights Significant EV Growth Opportunity | Allegro MicroSystems announced that BMW Group has selected Allegro as the sole Current Sensor IC supplier for BMW Group's traction inverter systems used across the company's entire fleet of Battery Electric Vehicles. Allegro's Current Sensor integrated circuits ("ICs") deliver accuracy in the measurement of electrical current flowing through the vehicle motors. This accuracy enables precise motor control, leading to a superior driving experience and an extended driving range by minimizing power losses. The IC's built-in overcurrent detection and self-diagnostics enable BMW to meet the highest level of safety and reliability while reducing the number of components used in the traction inverter. "For more than two decades, Allegro has worked closely with leading automotive customers to develop innovative, high-performance Magnetic Sensors that help increase the power density and improve the efficiency of power electronic systems used in electric vehicles," said Michael Doogue, Allegro's Chief Technology Officer. "We appreciate our strong relationship with the BMW Group, whose innovative mindset, focus on high performance, and technical insights positively influence Allegro's technology and product roadmaps. Our expertise in Hall, TMR, coreless technologies and Automotive Safety Integrity Level (ASIL) rated sensors enables our customers to meet their design targets and accelerate their time to market." | 17.10.2023 13:00:00 | Oct | news_2023-11-01_9.jpg | \images\news_2023-11-01_9.jpg | https://www.allegromicro.com/en/about-allegro/news-room/2023/bmw-high-efficiency-traction-inverters-collaboration | allegromicro.com |
| 1200W Power Supplies for Defense and Harsh Environments | Powerbox has announced the release of its ruggediz... | 11635 | Product Release | 1200W Power Supplies for Defense and Harsh Environments | Powerbox has announced the release of its ruggedized 1200W AC/DC power supply for ground based defense applications and harsh industrial environments. In metal chassis format with a baseplate for conduction cooling, the OFD1200A series can be used with a baseplate operating temperature range of -40 up to +95 degrees C. For extremely demanding applications the OFD1200A features a conformal coating and is mechanically ruggedized according to the MIL-STD810H standard. The product is as electrically well ruggedized to withstand harsh transients and meet demanding EMC performance levels as required with most common defense and the more demanding industrial applications, according to the MIL-STD- 461 CE-102 and also meeting the MIL-STD-1399-300. The power supply operates with a wide universal input range from 85 to 305VAC with power factor correction (PFC). Covering a large range of applications, its output voltage and current can be adjusted from near zero to the maximum allowed for each model. Designed for high availability, short time-to-market and to meet commercial and military off-the-shelf (COTS/MOTS) business models, the OFD1200A is available in four output voltages of 12V, 28V, 48V and 65V and can be connected in parallel up to nine units delivering an impressive total power level of up to 9,720W. | 17.10.2023 12:30:00 | Oct | news_2023-11-01_20.jpg | \images\news_2023-11-01_20.jpg | https://www.prbx.com/2023/10/powerboxs-cots-mots-1200w-power-supplies-ideal-for-defense-and-harsh-environments/ | prbx.com |
| Registration is Open for APEC 2024 | Registration is now open for the 38th Annual Appli... | 11647 | Event News | Registration is Open for APEC 2024 | Registration is now open for the 38th Annual Applied Power Electronics Conference. The APEC 2024 conference and exposition, running February 25-29 at the Long Beach Convention Center, continues its long-standing tradition of addressing issues of immediate and long-term interest to the practicing power electronics engineer. Providing a truly exceptional professional experience, full registration at APEC is nevertheless offered at one of the lowest costs of any IEEE conference. Complete details for registering and hotel booking can be found on the APEC Registration page. APEC 2024 Conference registration includes access to technical content, such as peer-reviewed Technical Program paper presentations, Industry Sessions discussing the latest advances in commercial developments, as well as half-day Professional Education Seminars presented by industry experts on a range of topics geared to both, introductory to expert-level participants. In addition to the conference program, full registration includes admission to the sold-out APEC 2024 Exposition that brings together nearly 300 manufacturers. Special events – including the MicroMouse contest, the FIRST Robotics event and the always-popular Wednesday evening Social Event – round out a lively, interactive tradeshow environment. | 17.10.2023 12:00:00 | Oct | news_2023-11-15_7.jpg | \images\news_2023-11-15_7.jpg | https://apec-conf.org/news/registration-for-apec-2024-is-now-open | apec-conf.org |
| Expanding Executive Board | Andreas Pauly, previously Head of the Test & Measu... | 11622 | People | Expanding Executive Board | Andreas Pauly, previously Head of the Test & Measurement Division, joined the Rohde & Schwarz Executive Board as Chief Technology Officer (CTO) on October 1, 2023. Christina Gessner has taken over as Head of the Test & Measurement Division and is now a member of Rohde & Schwarz Corporate Management. Rohde & Schwarz is strategically positioned to address key future connectivity and security technologies and has a strong market position. The company has grown for several years in succession. The appointment of a third Executive Board member is now laying the foundation for the future development of the technology group.<br>With Andreas Pauly (53), Rohde & Schwarz has bolstered its top management team from within the company's own ranks. Pauly joined the Test & Measurement Division in 1996. In 2003, he qualified for his first management position and in 2015 was appointed Vice President Signal Generators, Audio Analyzers and Power Meters. Two years later, he took over as Executive Vice President of the Test & Measurement Division and kept it on track for continued success.<br>Christina Gessner (50) has succeeded Pauly in the Test & Measurement Division. In her most recent role, she served as Vice President Spectrum & Network Analyzers, EMC and Antenna Test Equipment. She joined Rohde & Schwarzas a technology manager in 2004. In 2011, she became Head of Product Management for Spectrum and Network Analyzers. In the following years, she held several leadership roles before being appointed Vice President of the entire business unit in 2018. | 17.10.2023 11:00:00 | Oct | news_2023-11-01_7.jpg | \images\news_2023-11-01_7.jpg | https://www.rohde-schwarz.com/about/news-press/all-news/rohde-schwarz-expands-executive-board-press-release-detailpage_229356-1420800.html?change_c=true | rohde-schwarz.com |
| Qi2 MPP Wireless Charging Transmitter Solution | In response to the consumer demand for improved wi... | 11633 | Product Release | Qi2 MPP Wireless Charging Transmitter Solution | In response to the consumer demand for improved wireless charging user experience, the Wireless Power Consortium announced the release of a new standard to redefine the inductive wireless power transfer: Qi2. Infineon Technologies addresses this demand by introducing its first Qi2 Magnetic Power Profile (MPP) charging transmitter solution, the reference design kit REF_WLC_TX15W_M1. The MPP in Qi2 offers magnet-based fixed positioning with an intuitive user experience. This new standard guarantees significant benefits in automotive and consumer applications, such as in-cabin wireless charging, smartphones and EarPods cases, portable speakers, and healthcare equipment through better efficiency and safety. The reference design kit is integrated and form factor optimized with a diameter of less than 43 mm, and a programmable wireless charging transmitter centered around an Infineon WLC1 controller. It demonstrates the capabilities of Infineon's Qi2-capable WLC1 which is already available on the market. The IC integrates a microcontroller (MCU) with Flash memory, a 4.5 V to 24 V DC input buck-boost controller, inverter gate drivers, and factory-trimmed current sensing. It features analog protection peripherals, USB PD, and LIN as well as serial interfaces enabling efficient and smart power delivery. The REF_WLC_TX15W_M1 is supported with code examples in ModusToolbox<sup>TM</sup> to help users take advantage of the IC's configuration capabilities. The 15 W Qi2 MPP solution board is backward compatible with a basic power profile (BPP) that allows receivers without MPP support to wirelessly charge at 5 W. In addition, a multipath ASK demodulator and adaptive foreign object detection (FOD) are provided, making the design a robust and secure wireless power solution. | 16.10.2023 10:30:00 | Oct | news_2023-11-01_18.jpg | \images\news_2023-11-01_18.jpg | https://www.infineon.com/cms/en/about-infineon/press/market-news/2023/INFPSS202310-003.html | infineon.com |
| Veteran of the GaN Industry Joins as Advisor | One of the pioneers of GaN technology, Geoff Hayne... | 11623 | People | Veteran of the GaN Industry Joins as Advisor | One of the pioneers of GaN technology, Geoff Haynes, who co-founded GaN Systems is joining QPT's team as an advisor. Geoff Haynes said: "I have been following the progress of QPT's technology with considerable interest. It solves the thermal and RF problems that GaN is now facing that currently form an insurmountable major barrier for the widespread use of GaN in high power, high voltage, hard switching applications. I visited the company's laboratory and was so impressed with its solutions that I am joining the company as an advisor to help them rapidly deploy this technology to the market. With it, GaN can now operate at the high frequencies needed to deliver significant power savings and open up applications worth billions as it provides a far superior performance and efficiency than Silicon Carbide." Rob Gwynne, Founder and CEO of QPT, added: "We are delighted that Geoff Haynes is coming onboard. He is a world authority on GaN and knows the challenges that it currently faces that limit its use. He immediately understood how our solutions and patents unlock the next phase in the evolution of GaN to become the enabling technology of choice for power electronics. Having him join and effectively putting his name behind QPT's qGaN solutions is an incredible endorsement not only for customers but also for our upcoming Series A funding round." | 11.10.2023 12:00:00 | Oct | news_2023-11-01_8.jpg | \images\news_2023-11-01_8.jpg | https://www.q-p-t.com/press-releases/gan-systems-co-founder-geoff-haynes-joins-qpt | q-p-t.com |
| Aiming to Grow Its SiC Power Device Business Through Vertical Collaboration | Mitsubishi Electric Corporation announced that it ... | 11619 | Industry News | Aiming to Grow Its SiC Power Device Business Through Vertical Collaboration | Mitsubishi Electric Corporation announced that it has agreed with Coherent Corp. to invest USD 500 million (approx. 75 billion yen) in a silicon carbide (SiC) business to be carved out from Coherent, aiming to expand its SiC power device business by strengthening vertical collaboration with Coherent, who has been a supplier of SiC substrates to Mitsubishi Electric. Mitsubishi Electric has been procuring high-quality 150mm SiC substrates from Coherent for the production of SiC power modules for many years. In addition to developing high-quality 200mm SiC substrates with Coherent, Mitsubishi Electric plans to invest approximately 100 billion yen to construct a new 200mm SiC wafer plant in Kumamoto Prefecture, Japan beginning in 2026. By further deepening its collaboration with Coherent through this investment, Mitsubishi Electric aims to stabilize its procurement of SiC substrates for SiC power modules, for which demand is forecasted to grow rapidly, and thereby expand its supply of reliable high-performance SiC power devices to meet rising global demand.<br>Dr. Masayoshi Takemi, Executive Officer, Group President, Semiconductor & Device of Mitsubishi Electric, said: "Demand for SiC power semiconductors is expected to grow exponentially as the global market for electric vehicles increases in line with the transition to a decarbonized world. To capitalize on this trend, we have decided to expand our SiC power semiconductor production capacity, including by constructing a 200mm wafer plant in the Shisui area of Kumamoto Prefecture. We are delighted to strengthen our partnership with Coherent by investing in this new SiC company, which will provide us with a stable supply of high-quality SiC substrates essential for our increased supply capacity." | 10.10.2023 09:00:00 | Oct | news_2023-11-01_4.jpg | \images\news_2023-11-01_4.jpg | https://www.mitsubishielectric.com/news/2023/1010.html | mitsubishielectric.com |
| Miniature MOSFET Relays Feature High Capacity | The SOP4 60V miniature package PhotoMOS MOSFET rel... | 11640 | Product Release | Miniature MOSFET Relays Feature High Capacity | The SOP4 60V miniature package PhotoMOS MOSFET relays from Panasonic Industry ensure quiet, fast and bounce-free switching. AQY212G3HS and AQY232G3HS relays benefit from high operating temperature levels of up to +105 degrees Celsius and +125 degrees Celsius respectively, allowing them to be used in higher temperature environments than before. They are ideally suited for a wide range of modern industrial equipment, testing, and measuring equipment as well as security and battery operating equipment. The compact SOP4 package of the relays achieves an input-output withstand voltage of 3,750 Vrms (conventional 1,500 Vrms) and enables miniaturization of highly insulated equipment. The AQY232G3HS components achieve high-capacity 2 A load control and AQY212G3HS relays feature 1.8 A load control. AQY232G3HS components achieve a maximum LED current of 1 mA (1/3 times that of the conventional models). This reduces LED current during use by up to 40% and contributes to lower power consumption for the target applications. In terms of operating time, the AQY232G3HS devices achieve an average of 0.8 ms, which is about 57% of the time of conventional models. The increased speed of the switching operation largely improves the tact time of equipment and systems. | 06.10.2023 17:30:00 | Oct | news_2023-11-01_25.jpg | \images\news_2023-11-01_25.jpg | https://industry.panasonic.eu/company/newsroom/new-miniature-mosfet-relays-feature-high-capacity-high-io-isolation-and-high-operating-temperature | industry.panasonic.eu |
| SP-Caps Feature Long Lifetime and Low ESR | Panasonic Industry released the TX, TZ, JZ and KZ ... | 11615 | Product Release | SP-Caps Feature Long Lifetime and Low ESR | Panasonic Industry released the TX, TZ, JZ and KZ series of SP-Caps and extended the KX series of SP-Caps. The chip-type capacitor series all benefit from a long lifetime plus a low ESR value. Damp heat performance is also very good with 85°C, 85%RH, 1000 hours. Thanks to their low profiles the SP-Caps can be designed-in close to heat sinks. Main target applications are 5G base stations, AI server and industrial equipment. Beyond the fact that with TX series Panasonic Industry has reached the edge of technology in terms of reliably withstanding up to 5500 hours at 135°C with a maximum capacitance of 470µF while offering ESR values as low as 3mΩ, the related TZ series is the ideal choice for customers that require more capacitance up to 560uF, coming with the same specs and in the same compact height of 2.2mm as TX series. In addition, for less harsh environments, Panasonic Industry offers JZ series with 3000 hours at 125°C and KZ series with 5500 hours at 125°C with capacitance ranging up to 560µF and a maximum height of only 2.3mm. Rated voltage is between 2V up to 6.3V. ESR values are between super-low 3mΩ and 15mΩ. | 05.10.2023 19:30:00 | Oct | news_2023-10-15_27.jpg | \images\news_2023-10-15_27.jpg | https://industry.panasonic.eu/company/newsroom/new-sp-caps-feature-longest-lifetime-and-lowest-esr-market | industry.panasonic.eu |
| From PSU Specification to PCB Layout in Minutes | Power Integrations and SnapMagic announced that PI... | 11600 | Industry News | From PSU Specification to PCB Layout in Minutes | Power Integrations and SnapMagic announced that PI Expert, Power Integrations' robust, online design tool, now features schematic and netlist export, made possible by SnapMagic's schematic export technology. Based on specifications input by the user, PI Expert automatically generates a complete power supply schematic utilizing Power Integrations' power-conversion ICs, including a custom magnetics design. Previously, the automated tool flow covered everything up to full circuit optimization, but required manual transcription into a CAD package to facilitate simulations and physical layout. The export capability ensures a fast and seamless transfer of the design, including symbols, footprints, 3D models and electrical netlist into one of four popular PCB CAD tools. Cadence OrCAD, Altium, Autodesk Eagle / Fusion360 and KiCad are currently supported. Trevor Hiatt, director of channel marketing at Power Integrations, said: "Eliminating the need to manually create or download symbols, draw a schematic and then port those files into a PCB layout tool will save time, reduce transcription errors and, importantly, assist with version control and traceability. The schematic is laid out in a consistent format and optimized for readability on the industry-standard 0.1 inch format." | 05.10.2023 17:00:00 | Oct | news_2023-10-15_12.jpg | \images\news_2023-10-15_12.jpg | https://investors.power.com/news/news-details/2023/Power-Integrations-and-SnapMagic-Collaborate-to-Advance-Power-Supply-Design-Automation/default.aspx | power.com |
| CPRS Power Supply for AI Processing | Advanced Energy has extended its range of ultra-hi... | 11609 | Product Release | CPRS Power Supply for AI Processing | Advanced Energy has extended its range of ultra-high-density front-end power supplies with a 3200 W unit in the common redundant power supply (CPRS) 1U form factor. The Artesyn CSU3200ET series addresses the high-performance, space-constrained power demands of next-generation computing applications including Artificial Intelligence (AI) and Machine Learning (ML). Accepting a universal input voltage range of 180 to 264 VAC and drawing maximum input current of 16 A, the CSU3200ET hot-pluggable power supplies feature active power factor correction (PFC) and very low total harmonic current distortion to comply with EN 61000-3-2 limits even at light loads. PMBus connectivity enables advanced monitoring and control features, while active current sharing facilitates the connection of multiple power supplies in parallel for applications requiring higher load current or redundancy. Where system loads do not require the full power of connected power supplies, a 'cold redundancy' capability optimizes efficiency. | 05.10.2023 13:30:00 | Oct | news_2023-10-15_21.jpg | \images\news_2023-10-15_21.jpg | https://ir.advancedenergy.com/news/advanced-energy-extends-ultra-high-density-80plus-titanium-efficiency-power-supplies-to-3200-w/689a1103-35b5-4b7b-b4d9-0739933e729c/ | advancedenergy.com |
| Recognized for Best Soldering Product of the Year | Indium Corporation was recently the proud recipien... | 11596 | Industry News | Recognized for Best Soldering Product of the Year | Indium Corporation was recently the proud recipient of Electronics Maker's Best of Industry Award 2023 for Best Soldering Product of the Year. The award was received for Indium Corporation's InFORMS reinforced solder preforms. The Best of Industry Awards recognize achievements in electronics design and technology. Recipients are selected based on demonstrated leadership, product innovation, excellence in their fields, and success in addressing a need or defining a new market. "Over the years, the EM Best of Industry Awards have become an industry standard for acknowledging contributions to the electronics industry," said Damian Santhanasamy, Senior Country Sales Manager. "We are proud to receive this honor for our InFORMS solder preforms in recognition of their ability to provide strength and consistent bondline thickness in power electronics packaging applications." By improving strength and maintaining bondline thickness, InFORMS maximize the thermal and mechanical reliability of the solder joint. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules. InFORMS can be manufactured in a wide variety of shapes, including rectangles and discs, as well as custom shapes to suit specific application requirements. InFORMS also come in the form of ribbon for automated assembly. | 05.10.2023 13:00:00 | Oct | news_2023-10-15_8.jpg | \images\news_2023-10-15_8.jpg | https://www.indium.com/corporate/media-center/news/indium-corporation-recognized-by-electronics-maker-for-best-soldering-product-of-the-year/ | indium.com |
| 9 kHz-67 GHz SP4T Switch | Richardson RFPD announced the availability and ful... | 11604 | Product Release | 9 kHz-67 GHz SP4T Switch | Richardson RFPD announced the availability and full design support capabilities for an RF switch and associated evaluation board from pSemi Corporation. The PE42545 is a HaRP technology-enhanced reflective SP4T RF switch die that supports a wide frequency range from 9 kHz to 67 GHz. It delivers low insertion loss, fast switching time and high isolation performance, making it ideal for test and measurement, 5G mmWave, microwave backhaul, radar, and satellite communication applications. No blocking capacitors are required if DC voltage is not present on the RF ports. The PE42545 is manufactured on pSemi's UltraCMOS process, a patented variation of silicon-on-insulator technology. | 05.10.2023 08:30:00 | Oct | news_2023-10-15_16.jpg | \images\news_2023-10-15_16.jpg | https://www.richardsonrfpd.com/press-room/richardson-rfpd-announces-availability-of-ultracmos-9-khz-67-ghz-sp4t-switch-from-psemi/ | richardsonrfpd.com |
| Supplying Terminal Devices via the EMC-compliant Network Connection | Würth Elektronik is proud to present its RD022 ref... | 11603 | Product Release | Supplying Terminal Devices via the EMC-compliant Network Connection | Würth Elektronik is proud to present its RD022 reference design "GB-PoE+ Ethernet USB adapter,". Devices networked via Ethernet usually depend on a separate power supply, however, if these terminal devices get by with low power consumption, then Power over Ethernet (PoE) is an alternative where data transmission and power supply are achieved via a network cable. Devices with low power consumption, like IP cameras, VoIP phones, WiFi routers, network switches, LED lighting or access systems, are suitable for power supply through the Ethernet line. Würth Elektronik's RD022 reference design, which can provide up to 25W of power, shows how this can work while still maintaining EMC compliance. The 'GB-PoE+ Ethernet USB adapter' is based on the reference design of a 1 Gbps Ethernet USB adapter without PoE functionality. The 'GB-PoE+ Ethernet USB Adapter provides three interfaces: a USB Type-C interface (USB 3.1), an RJ45 1 Gbps Ethernet interface with integrated PoE functionality, and a connection for a DC/DC converter with an adjustable output voltage of 6V to 18V and a maximum output power of 25W. The board makes it easier for customers to get started with PoE technology. The reference design familiarizes users with the technology, signals, interface structure, power-up and PoE detection of a Gigabit PoE interface. It provides the hardware design for Power Sourcing Equipment (PSE) and the Powered Device (PD) and explains the conception and construction of the adapter board: current flow, USB controller and interface, Ethernet interface as well as power supply (PoE). Special importance placed on the EMC-compliant design highlights its significance. | 05.10.2023 07:30:00 | Oct | news_2023-10-15_15.jpg | \images\news_2023-10-15_15.jpg | https://www.we-online.com/en/news-center/press?d=rd022 | we-online.com |
| DC/DC Converter Packs 60 W Into 2 x 1 Inch Package | The PKE3600A DC/DC converter provides up to 60 W f... | 11614 | Product Release | DC/DC Converter Packs 60 W Into 2 x 1 Inch Package | The PKE3600A DC/DC converter provides up to 60 W from an industry-standard 50.8 x 25.4 x 11.9mm (2 x 1 x 0.47 inch) through-pin package. The DC/DC series has a wide input range of 9-36 V<sub>dc</sub> covering applications using both 12V and 24V nominal inputs and provides a choice of fully regulated single outputs: 5 V, 12 V, 24 V, 48 V or 54 V. Efficiency is up to 91% and the parts will operate from -40°C to 100°C case temperature. Isolation for the PKE3600A series is 1600 V<sub>dc</sub> input to output and input/output to case, and the parts meet the safety requirements of IEC/EN 62368-1 for functional isolation. Full protection is included against over-temperature, input under-voltage and output over-current, over-voltage and short circuits. MTBF across the series is over 8M hours according to Telcordia SR-332 Issue 3, Method 1 at 25°C. EMC standards EN 55032, CISPR32 and FCC part 15J are met with good margin with an external filter network with suggested components listed in the data sheet. The parts also meet standard EN 45545-2 for railway fire safety. A remote-control input is featured along with an output voltage adjust function. | 04.10.2023 18:30:00 | Oct | news_2023-10-15_26.jpg | \images\news_2023-10-15_26.jpg | https://flexpowermodules.com/dc-dc-converter-packs-60-w-into-2-x-1-inch-package | flexpowermodules.com |
| UHP-SMD Fuse for High-Power Lithium-Ion Batteries | In the world of electronics, especially in the aut... | 11637 | Product Release | UHP-SMD Fuse for High-Power Lithium-Ion Batteries | In the world of electronics, especially in the automotive industry, the demand for high-performance solutions up to 48 volts DC is ever-growing. The SCHURTER UHP fuse is engineered to break the circuit at twice the rated current, all within a maximum of 15 seconds. It reduces worst-case power by over six times when compared to industry-standard fuses. Its design is nothing short of impressive, offering a remarkably high breaking capacity of up to 3000 Amps at the Safety Extra Low Voltage (SELV) level. This versatility extends its usability beyond the automotive sector, making it a trusted choice for data centers, telecom applications, and even heavy-duty power tools. For applications up to 50 volts, SCHURTER also provides the UHS fuse, featuring a slightly lower breaking capacity but still delivering reliable overcurrent protection. | 04.10.2023 14:30:00 | Oct | news_2023-11-01_22.jpg | \images\news_2023-11-01_22.jpg | https://www.schurter.com/en/news/schurter-uhp-smd-fuse-for-high-power-lithium-ion-batteries | schurter.com |
| Launch of Mobility Electrification Business | Blackstone, in partnership with its portfolio comp... | 11597 | Industry News | Launch of Mobility Electrification Business | Blackstone, in partnership with its portfolio company Interplex, has announced the strategic launch of ENNOVI, a mobility electrification solutions business that designs, develops and engineers interconnect solutions for battery, power and signal systems for the next generation of electric vehicles (EVs). The launch of ENNOVI marks the culmination of a strategic reorganization and transformation of Interplex's core business to better serve its customers. As a new standalone company, ENNOVI will focus primarily on the automotive electrification solutions and will be led by Stefan Rustler as CEO. ENNOVI is committed to serving EV brands and manufacturers and helping them reach an electric future faster, from anywhere in the world. The company designs and engineers battery, power platform and signal interconnect solutions for the next generation of electric vehicles. Interplex will continue to prioritize the datacom and industrial market with high-precision mechanical solutions and busbar technologies. Stefan Rustler, CEO of ENNOVI, said: "I am thrilled to introduce ENNOVI to the world. We are passionate about helping our customers electrify faster. This new chapter gives our mobility business a renewed focus on the automotive industry, allocating the best industry talents to ensure we deliver to the increasing demands of EV manufacturers. In launching ENNOVI, we are at the forefront of the latest technological advancements shaping the industry." | 04.10.2023 14:00:00 | Oct | news_2023-10-15_9.jpg | \images\news_2023-10-15_9.jpg | https://ennovi.com/news/interplex-announces-launch-of-ennovi-a-mobility-electrification-business/ | ennovi.com |
| Decades of Power Conversion Products with a New Name | The former ABB Power Conversion division which was... | 11621 | Industry News | Decades of Power Conversion Products with a New Name | The former ABB Power Conversion division which was recently acquired by AcBel Polytech unveiled a new identity, OmniOn Power (OmniOn), as part of an extensive rebranding initiative. To mark the occasion of its new name, OmniOn has released a 'State of the Power Conversion Industry report', which explores key insights from market research into the power conversion industry. Together, the report and rebrand mark a new chapter in the company's decades-long story. A combination of "omni," which means all things, and "on," which refers to the unobstructed flow of power, the OmniOn Power name reflects the company's commitment to providing leading technology, expertise, and partnership to help customers navigate their toughest power challenges and empower their businesses now and well into the future. "Our company has been a leader in the power conversion industry for decades," said Jeff Schnitzer, president, OmniOn Power. "Now, with our new owner and name, we're energized about our future and well-positioned to continue to deliver innovative solutions that meet evolving power needs across the most critical industry landscapes." The company now known as OmniOn Power has long been known in the power conversion industry, with roots in the telecommunications space as a part of Bell Labs and time spent as divisions within GE and ABB. Its power conversion products are continuously chosen by customers as reliable, effective, adaptive, scalable, and innovative, delivering value and return on investment. | 04.10.2023 11:00:00 | Oct | news_2023-11-01_6.jpg | \images\news_2023-11-01_6.jpg | https://www.omnionpower.com/about/news/press-releases/introducing-omnion-power-decades-of-industry-leading-power-conversion-product-with-a-new-name | omnionpower.com |
| Provider of Solutions for Electrical Layout Acquired | Solitron Devices is pleased to announce it has acq... | 11593 | Industry News | Provider of Solutions for Electrical Layout Acquired | Solitron Devices is pleased to announce it has acquired Micro Engineering Inc. located in Apopka, FL. Specializing in highly integrated, high reliability assemblies, Micro Engineering has over forty years of experience servicing medical, industrial, and aerospace applications. Focused on low to mid volume production, Micro Engineering offers services from conceptual design and prototyping to full turnkey manufacturing and functionally tested assemblies. Additional services include hand assembly, wire harnessing, specialized coatings and full box builds. Mark Matson, Solitron President & COO, said, "Micro Engineering is an exceptionally synergistic fit with Solitron, expanding and complimenting engineering and manufacturing capabilities. Solitron's expertise with chip and wire, silicon carbide and high-density multi-chip modules combined with Micro Engineering's PCBA, SMT and system level box build capability offers a strong suite of technology to customers. This new capability for increased functionality and power density will accelerate introductions into emerging markets particularly utilizing Silicon Carbide (SiC) and Gallium Nitride (GaN). The combination of Solitron and Micro Engineering will also broaden both companies' presence in medical, high end industrial and aerospace applications." Combined manufacturing capabilities now include 3D CAD modelling, 3D Printing, CAE machining, aluminum & gold wire bonding, void free soldering, fine pitch SMT for BGA's, rigid, flex and double-sided circuit card assemblies; right up through full box builds. Product qualification infrastructure includes thermal shock, vibration, mechanical shock, centrifuge, salt spray atmosphere, burn-in and more. | 04.10.2023 10:00:00 | Oct | news_2023-10-15_5.jpg | \images\news_2023-10-15_5.jpg | https://solitrondevices.com/solitron-devices-acquires-micro-engineering-inc/ | solitrondevices.com |
| Joint Collaboration on SiC Modules | Nexperia announced it has entered into partnership... | 11591 | Industry News | Joint Collaboration on SiC Modules | Nexperia announced it has entered into partnership with KYOCERA AVX Components (Salzburg) to jointly produce a 650 V, 20 A silicon carbide (SiC) rectifier module for high frequency power applications ranging from 3 kW to 11 kW power stack designs, aimed at application like industrial power supplies, EV charging stations, and on-board chargers. This release will represent a further deepening of the existing, long-lasting partnership between the two companies. Space-saving and weight reduction are the key requirements for manufacturers of the next generation power applications. The compact footprint of this SiC rectifier module will help to maximize power density, thereby reducing the amount of required board space and lowering the overall system cost. Thermal performance is optimized using a combination of top-side cooling (TSC) and an integrated negative temperature coefficient (NTC) sensor which monitors the device temperature and provides real time feedback for device or system level prognosis and diagnosis. This rectifier module has a low inductance package to enable high frequency operation and it has been qualified to operate with a junction temperature of up to 175 °C. Nexperia expects samples of the SiC rectifier modules to be available in the first quarter of 2024. | 04.10.2023 08:00:00 | Oct | news_2023-10-15_3.jpg | \images\news_2023-10-15_3.jpg | https://www.nexperia.com/about/news-events/press-releases/Nexperia-partners-with-KYOCERA-AVX-Salzburg-to-produce-a-650-V-silicon-carbide-rectifier-module-for-power-applications | nexperia.com |
| Compact Appliance Inlet Filter Series | For applications that require particularly high in... | 11613 | Product Release | Compact Appliance Inlet Filter Series | For applications that require particularly high interference immunity, SCHURTER is launching the filters of the 5124 series. With identical dimensions to the proven 5120 and 5123 series, both symmetrical and asymmetrical interference signals can be attenuated even better with the 5124 series. The 5124 series combines an IEC C14 appliance inlet with a high-performance mains filter. Thanks to a wide metal flange, the housing makes contact over a large area, which guarantees an optimal filter and shielding effect. The chokes with high-permeable toroidal cores of the 5124 series have an inductance that is many times higher than that of the standard 5120 series. This results in an attenuation of asymmetrical interference signals that is around 10 dB higher. Massively enlarged X-capacitors help against symmetrical interference. Despite significantly larger components, the dimensions of the 5124 predecessor's series have been retained. The 5124 series is available in standard or medical versions. It makes sense to use it where a particularly high attenuation is necessary and the filter effect of a 5120 or even 5123 series is no longer sufficient. Thanks to identical dimensions, the optimal series can be selected - depending on the interference level - without any design changes. The appliance filters are, of course, equipped with the well-proven V-Lock cord retention system. | 03.10.2023 17:30:00 | Oct | news_2023-10-15_25.jpg | \images\news_2023-10-15_25.jpg | https://www.schurter.com/en/news/the-new-compact-appliance-inlet-filter-series-5124 | schurter.com |
| Sponsoring 'Tech for Good' Category at 'everywoman in Technology Awards' 2024 | RS Group announced it is continuing its sponsorshi... | 11592 | Industry News | Sponsoring 'Tech for Good' Category at 'everywoman in Technology Awards' 2024 | RS Group announced it is continuing its sponsorship of the 'everywoman in Technology Awards', which is now in its 14th year and has celebrated more than 450 incredible women in technology from school students to C-level executives. The '2024 Bupa everywoman in Technology Awards' will bring the tech industry together to recognise and reward women for their outstanding performance and shine a spotlight on the most exceptional talent, from the UK and beyond, providing an opportunity for companies and individuals to put forward candidates for categories celebrating all stages of their career journey. Once again, RS will be sponsoring the 'Tech for Good' category award and continues to support this initiative as a part of its commitment to driving change and helping the industry toward a more sustainable and inclusive future through people and innovation. The winner of the 'Tech for Good' award will be presented to a woman who has been judged to be driving forward an initiative that uses technology to make a positive difference: this could be as part of a social enterprise for diversity and inclusion, or a focus on sustainability, or in any other area of impact. | 03.10.2023 09:00:00 | Oct | news_2023-10-15_4.jpg | \images\news_2023-10-15_4.jpg | https://www.everywoman.com/everywoman-in-technology-awards/nominations/ | everywoman.com |
| Patent for Ultracapacitor Generator Start Module | Richardson Electronics is pleased to announce the ... | 11599 | Industry News | Patent for Ultracapacitor Generator Start Module | Richardson Electronics is pleased to announce the issuance of U.S. Patent No. 11,764,002 (the "'002 Patent"). The '002 Patent is a result of Richardson's technology using ultracapacitors embedded in its ULTRAGEN3000 generator start module or GSM. The ULTRAGEN3000 is a compact GSM designed for installation in any orientation, allowing flexible module placement within any generator set housing. The Company's patented technology enables a true drop-in replacement for lead acid batteries in engine start applications without the need to rewire or procure additional components. Ultracapacitor-based energy storage solutions have significantly enhanced reliability. Ultracapacitors, unlike batteries, provide dependable and consistent energy even in extreme temperatures, providing better reliability for critical applications such as backup generator systems. This patent adds to the Company's patented energy storage solutions portfolio and enhances growth opportunities within the Green Energy Solutions business segment. "This patent is another important milestone toward our goal of strengthening our Company's intellectual property portfolio. Our engineering team continues to design and develop unique products that surpass our customers' expectations with cost-savings, reliability, and efficiency," stated Richardson's Greg Peloquin, Executive Vice-President Power and Microwave Technologies and Green Energy Solutions Groups. | 02.10.2023 16:00:00 | Oct | news_2023-10-15_11.jpg | \images\news_2023-10-15_11.jpg | https://www.rellpower.com/pressnews/richardson-electronics-ltd-receives-patent-for-its-ultracapacitor-generator-start-module-ultragen3000/ | rellpower.com |
| 800 V N-Channel Depletion Mode MOSFET | Littelfuse is pleased to announce the launch of CP... | 11611 | Product Release | 800 V N-Channel Depletion Mode MOSFET | Littelfuse is pleased to announce the launch of CPC3981Z, an 800 V, 100 mA, 45 Ohm, Small Power N-Channel Depletion Mode MOSFET. Compared to a standard SOT-223 package, this product's SOT-223-2L package features a removed middle pin. That increases the drain-gate pin spacing from 1.386 millimeters to more than 4 millimeters. The extended creepage distance is beneficial in higher voltage applications such as switch mode power supplies (SMPS) or power factor correction (PFC) startup circuits because designers can avoid the need for costly conformal coating or potting. The key differentiator of the CPC3981Z is its modified SOT-223-2L package which enables designers to meet the required extended creepage distance for higher voltage applications with a small discrete device. With its larger creepage distance, the CPC3981Z increases circuit robustness and enables cost savings. The 800 V blocking voltage rating of the CPC3981Z makes it the ideal choice for use in industrial, energy, telecommunications, and LED lighting applications. The increased distance between the depletion mode MOSFET pins simplifies the isolation management of wide input voltage power supplies and enables compact printed circuit board layouts. | 02.10.2023 15:30:00 | Oct | news_2023-10-15_23.jpg | \images\news_2023-10-15_23.jpg | https://www.littelfuse.com/about-us/news/news-releases/2023/littelfuse-announces-800-v-n-channel-depletion-mode-mosfet-in-modified-sot-223-2l-package.aspx | littelfuse.com |
| RNCA Thin Film Chip Resistors for Precision Applications | Many types of precision electronic devices across ... | 11610 | Product Release | RNCA Thin Film Chip Resistors for Precision Applications | Many types of precision electronic devices across a variety of market segments require higher reliability components. Automotive grade resistors offer increased reliability and improved performance without the high cost and limited availability of components procured to established reliability military specifications. Stackpole's RNCA series thin film automotive grade chip resistors are AEC-Q200 qualified and provide long-term reliability. This series is produced on dedicated manufacturing lines with strict material and process controls necessary for an automotive grade chip resistor. This provides the RNCA with exceptional test performance to all AEC-Q200 tests and improves the expected failure rate by an order of magnitude or more. In addition, the RNCA features an anti-sulfur performance, passing the industry standard ANSI/ EIA977 sulfur test with minimal resistance shift at 105 degree C. The RNCA is a solution for precision medical applications, precision automotive electronics, non-established reliability military and aerospace, as well as instrumentation and metering. | 02.10.2023 14:30:00 | Oct | news_2023-10-15_22.jpg | \images\news_2023-10-15_22.jpg | https://www.seielect.com/index.html | seielect.com |
| Dr. Rainer Kaesmaier Received "Dr. John Palmour Excellence Award" | Dr. Rainer Kaesmaier, General Manager Hitachi Ener... | 11595 | People | Dr. Rainer Kaesmaier Received "Dr. John Palmour Excellence Award" | Dr. Rainer Kaesmaier, General Manager Hitachi Energy Semiconductors, was awarded the "Dr. John Palmour Excellence Award" during the ISES - International Semiconductor Executive Summit EU Power - for his remarkable achievements in semiconductor industry during his career. The award is named after the legendary Dr. John Palmour, a pioneer in the semiconductor industry. Dr. Rainer Kaesmaier was recognized for demonstrating unwavering commitment and innovation throughout his career. His remarkable achievements have advanced the power semiconductor industry and shaped the technologies that powers the world today. The highly successful event - International Semiconductor Executive Summits Power Division – wouldn't exist today without the joint commitment of Dr. Kaesmaier and Dr. Palmour vision to support such an initiative. The award was presented by Dr. John Edmon, co-founder of Wolfspeed, and close friend of Dr. John Palmour. | 29.09.2023 12:00:00 | Sep | news_2023-10-15_7.jpg | \images\news_2023-10-15_7.jpg | https://www.hitachienergy.com/products-and-solutions/semiconductors/semiconductors-newsletter/hitachi-energy-pggi-semiconductors-general-manager-dr-rainer-kaesmaier-received-prestigious-dr-john-palmour-excellence-award-for-his-remarkable-achievements-in-semiconductor-industry-during-his-career | hitachienergy.com |
| First Generation GaN Technology Released for Production | BelGaN launches its 1st Generation 650V eGaN techn... | 11601 | Industry News | First Generation GaN Technology Released for Production | BelGaN launches its 1st Generation 650V eGaN technology into production. The Gen1 technology is expected to perform at par with other GaN foundries and IDMs, especially for high energy-efficient soft switch applications. This is a significant milestone achieved only one year after BelGaN completed the acquisition of the onsemi Fab. BelGaN is building the foundation for the "GaN ValleyTM", a growing ecosystem for GaN-based chips and power electronics with applications in Electrical Vehicle, Mobile, Industrial, Data Center and renewable energy markets in Europe and beyond. This is well aligned with the European ambition for greater chip autonomy (European Chips Act) and a carbon-neutral society (Green Deal). Only a few months after its inception by BelGaN, the GaN ValleyTM ecosystem already counts over 40 member companies and institutions along the value chain of the GaN industry in Europe. "Getting GaN into production is the first leap to realize our vision to build the GaN ValleyTM", said Rob Willems, General Manager & VP Operations, BelGaN "While others took several years to bring GaN process and technology to manufacturing, we are able to do it in record one year leveraging more than 200 man-years of GaN technology development expertise with over 30 years of high-volume automotive production experiences". | 28.09.2023 18:00:00 | Sep | news_2023-10-15_13.jpg | \images\news_2023-10-15_13.jpg | https://www.belgan.com/en/belgan-releases-its-first-generation-650v-egan-technology-for-production/ | belgan.com |
| Electronically-Marked Cable Assembly Controller with EPR | Infineon is introducing EZ-PD CMG2, a USB-C Electr... | 11612 | Product Release | Electronically-Marked Cable Assembly Controller with EPR | Infineon is introducing EZ-PD CMG2, a USB-C Electronically-Marked Cable Assembly (eMarker) controller with enhanced features. The controller is designed to deliver robust USB-C Power Delivery (PD) solutions for applications such as Extended Power Range (EPR) USB-C, USB4, and Thunderbolt passive cables. The EZ-PD CMG2 (Cable Marker Generation 2) is a dedicated eMarker controller designed for passive non-Thunderbolt and Thunderbolt Type-C cables and supports USB-PD 3.1 and Type-C 2.1 standards. EZ-PD CMG2-based USB-C eMarker cables can handle USB4 and TBT4 data rates and up to 240 W (48 V/5 A) of power. EZ-PD CMG2 provides integrated V <sub>BUS</sub>-to-CC short circuit protection up to 54 V and V <sub>BUS</sub>-to-V <sub>CONN</sub> short circuit protection up to 54 V. Additionally, it supports R <sub>A</sub> weakening to reduce power consumption and integrates an oscillator and IEC ESD (electrostatic discharge) protection, eliminating the need for external clock and external ESD, respectively. The controller comes with a configurable 47-byte storage space for vendor- and cable-specific configuration data and operates within a 2.7 to 5.5 V V <sub>CONN</sub> supply range. The integrated high-voltage protection of up to 54 V on CC, V <sub>CONN1</sub>, and V <sub>CONN2</sub> pins safeguards against accidental shorts to the high-voltage V <sub>BUS</sub> pin on the Type-C connector, providing enhanced user safety. Additionally, its industrial temperature range of -40°C to +85°C and system-level ESD protection on CC, V <sub>CONN1</sub>, and V <sub>CONN2</sub> pins ensure reliability and durability under challenging conditions. | 28.09.2023 16:30:00 | Sep | news_2023-10-15_24.jpg | \images\news_2023-10-15_24.jpg | https://www.infineon.com/cms/en/about-infineon/press/market-news/2023/INFPSS202309-154.html | infineon.com |
| Two High Accuracy Voltage Detectors | Nisshinbo Micro Devices has launched the NV3600, a... | 11639 | Product Release | Two High Accuracy Voltage Detectors | Nisshinbo Micro Devices has launched the NV3600, and NV3601 series voltage detectors intended for applications requiring a higher level of accuracy, power-saving features and fewer components on the board, such as factory automation equipment, ECU, BMS systems, portable equipment, and other automotive, industrial and consumer devices. When monitoring high voltages, it is crucial to consider the drawbacks of using traditional low-voltage detectors with an open drain output. These detectors require additional resistors to divide the monitored voltage and pull-up resistors at the output, which can lead to an increase in component count and leakage current concerns. However, the SENSE pin of the NV3600 and NV3601 series has a high withstand voltage and has no need for a voltage divider resistor. Furthermore, you have the option to choose between NMOS open-drain or CMOS output types. Both features effectively eliminate the leakage current issue and do not require additional external components.<br>If you need to monitor power supplies that experience large voltage fluctuations, such as those found in automotive batteries or in noisy environments, the NV3600 series is designed to meet your needs. This series allows you to set the detection voltage (V<sub>DET</sub>) and release voltage (V<sub>REL</sub>) individually. By selecting the appropriate hysteresis width based on your system requirements, you can avoid false detection and misinterpretation, even when the voltage fluctuation is significant. | 28.09.2023 16:30:00 | Sep | news_2023-11-01_24.jpg | \images\news_2023-11-01_24.jpg | https://www.nisshinbo-microdevices.co.jp/en/about/info/20230928.html | nisshinbo-microdevices.co.jp |
| Production Facility Dedicated to SiC Substrates | Soitec inaugurated its plant in Bernin, near Greno... | 11590 | Industry News | Production Facility Dedicated to SiC Substrates | Soitec inaugurated its plant in Bernin, near Grenoble, in the presence of Thierry Breton, European Commissioner for the Internal Market and Roland Lescure, French Minister Delegate for Industry. The plant will have a 2,500 m2 footprint and a final production capacity of 500,000 SmartSiC wafers per year. Through the application of SmartCut technology, each SiC substrate can be used 10 times. As a result, SmartSiC enables electric vehicles to achieve ranges above 500 km, compared with an average 350 km for vehicles using silicon IGBT alternatives – while also reducing CO2 emissions during wafer manufacturing by 70% compared to monocrystalline SiC substrates. The plant will lead to the creation of 400 direct jobs, while also reinforcing the attractiveness and dynamism of the "French Silicon Valley" ecosystem. Pierre Barnabé, Chief Executive Officer of Soitec, stated: "More than ever we are ready to establish our SmartSiC technology as a new standard in semiconductor materials for coming generations of electric cars. This plant will enable us to meet growing demand for silicon carbide and achieve a 30% market share by 2030, while helping to make electric mobility more efficient and affordable. Completed in record time, it is the embodiment of our industrial performance and our future-facing strategy, based on the expansion of our product and technology portfolio." | 28.09.2023 07:00:00 | Sep | news_2023-10-15_2.jpg | \images\news_2023-10-15_2.jpg | https://www.soitec.com/en/press-releases/soitec-opens-new-plant-positioning-smartsic-as-a-future-electric-vehicle-standard | soitec.com |
| SMD Power Inductor Targets Digital Audio Applications | Sumida Corporation has announced the launch of its... | 11602 | Product Release | SMD Power Inductor Targets Digital Audio Applications | Sumida Corporation has announced the launch of its CDRH80D50 SMD Power Inductor. Inductance values range from 10 to 100µH, permitting a diverse range of circuit applications. The Inductor is a ferrite drum core construction device with an air-gapped magnetic shield that reduces EMI, allowing higher circuit density. Its compact size of L×W×H: 8.5×8.5×5.5mm Max., and weight of just 1.32g make it a versatile component for digital audio amplifiers in communications, autosound, home theater, and commercial audio systems. Conservatively rated, Saturation Current specifications are based on the value of DC current when the inductance becomes 35% lower than the initial value. The device is RoHS certified and exceeds industry standards for quality and reliability. The CDRH80D50 SMD Power Inductor is available for immediate delivery and comes in carrier tape and reel packaging (13.0" diameter reel, with 1000pcs per reel). The Inductor can operate over a wide temperature range from -40? to +105?, making it suitable for use in most conditions. Additionally, it has a Moisture Sensitivity Level (MSL) of 1, (30 °C/85%RH at Level 1; 30 °C/60%RH at all other levels), ensuring compatibility with reflow-soldering processes. | 28.09.2023 06:30:00 | Sep | news_2023-10-15_14.jpg | \images\news_2023-10-15_14.jpg | https://www.sumida.com/news/index.php?categoryId=3&newsId=811 | sumida.com |
| Medical Grade DC-DC Converter with 2:1 Input Voltage | CUI announced the release of its PTP15 Series - a ... | 11608 | Product Release | Medical Grade DC-DC Converter with 2:1 Input Voltage | CUI announced the release of its PTP15 Series - a 15 W, 5 Pin DIP isolated dc-dc converter, specialized for medical instrumentation and home medical supplies. Offering 4000 Vac isolation or 5600 Vdc isolation with a 2:1 input voltage range, the series is compliant with the IEC/EN 60601-1 and EN 55011 Class A safety standards without external components. Housed in an industry standard 2" x 1", encapsulated, board mountable package, the converter can be used in temperature ranges from -40 up to +100°C and features output over current, short circuit and overvoltage protections. Though specialized for the medical field, the PTP15 series is also suitable for low-power consumer electronics and industrial equipment that requires high-isolation voltage. | 27.09.2023 12:30:00 | Sep | news_2023-10-15_20.jpg | \images\news_2023-10-15_20.jpg | https://www.cui.com/product/dc-dc-converters/isolated/ptp15-series | cui.com |
| Collaborating to Help Mutual Customers Optimize Designs | Siemens Digital Industries Software announced cert... | 11594 | Industry News | Collaborating to Help Mutual Customers Optimize Designs | Siemens Digital Industries Software announced certifications and collaborations with longtime partner TSMC, resulting in the successful qualification of multiple Siemens EDA product lines for the foundry's latest process technologies. "TSMC's collaboration with design ecosystem partners like Siemens helps our mutual customers remain at the forefront of technology innovation," said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. "This close partnership provides customers with proven design solutions that allow customers to more fully leverage the significant performance and power efficiency advantages of TSMC's advanced process technologies." Siemens' Calibre nmPlatform tool for integrated circuit (IC) verification sign-off is now fully certified for TSMC's N2 process, including Calibre nmDRC software, Calibre YieldEnhancer software, Calibre PERC software and Calibre nmLVS software – all of which are now in place for the earliest adopters of this advanced process technology offering from TSMC. TSMC and Siemens have also collaborated to certify Siemens' mPower analog software for transistor-level electromigration and IR drop (EM/IR) sign-off using TSMC's N4P process. This achievement allows mutual customers to apply mPower's unique EM/IR signoff solution to their analog or radio frequency (RF) designs. | 27.09.2023 11:00:00 | Sep | news_2023-10-15_6.jpg | \images\news_2023-10-15_6.jpg | https://newsroom.sw.siemens.com/en-US/tsmc-oip-2023/ | sw.siemens.com |
| Planar Schottky Rectifiers with Same Footprint as Standard DPAKs | Taiwan Semiconductor announces its ThinDPAK family... | 11605 | Product Release | Planar Schottky Rectifiers with Same Footprint as Standard DPAKs | Taiwan Semiconductor announces its ThinDPAK family of ultra-fast-recovery Schottky rectifiers. ThinDPAK devices have the same footprint as standard DPAKs – but come in a thinner (1.33mm) package and offer superior power density and thermal performance. Fully AEC-Q qualified with a maximum operating temperature (T<sub>j</sub>, max) of 175°C and typical reverse-recovery time of 25ns, ThinDPAKs assure reliability in automotive power electronics, high-frequency inverters, steering diodes in HV applications, DC/DC converters, as freewheeling diodes, reverse battery protection, lighting and many other applications. The planar Schottky topology of ThinDPAK devices provides a rectification efficiency that dissipates less heat than alternatives. For the heat that is dissipated, the ThinDPAK devices' thermal resistance (R<sub>jØA</sub>) is 21.9% lower. Moreover, the devices save both weight and headroom compared to standard DPAKs. "Our new ThinDPAKs are an excellent choice for optimizing new designs – and also for upgrading the performance of existing designs," said Sam Wang, vice president, TSC Products. "Although ThinDPAKs are thinner, their footprint is identical to standard DPAKs, allowing simple drop-in replacement and easy trial." The ThinDPAK series comprises a selection of 34 devices with reverse voltage (V<sub>VRRM</sub>) ratings from 45Vdc to 200Vdc with current ratings up to 150A. Devices are available in single and dual (common cathode) configurations. | 27.09.2023 09:30:00 | Sep | news_2023-10-15_17.jpg | \images\news_2023-10-15_17.jpg | https://www.taiwansemi.com/en/searchpn?q=ThinDPAK | taiwansemi.com |
| AEC-Q Qualified Planar Schottky Rectifiers | Taiwan Semiconductor announces its ThinDPAK family... | 11629 | Product Release | AEC-Q Qualified Planar Schottky Rectifiers | Taiwan Semiconductor announces its ThinDPAK family of ultra-fast-recovery Schottky rectifiers. ThinDPAK devices have the same footprint as standard DPAKs – but come in a thinner (1.33mm) package and offer superior power density and thermal performance. Fully AEC-Q qualified with a maximum operating temperature (T<sub>j</sub>, max) of 175°C and typical reverse-recovery time of 25ns, ThinDPAKs assure reliability in automotive power electronics, high-frequency inverters, steering diodes in HV applications, DC/DC converters, as freewheeling diodes, reverse battery protection, lighting and many other applications. The planar Schottky topology of ThinDPAK devices provides rectification efficiency that dissipates less heat than alternatives. For the heat that is dissipated, the ThinDPAK devices' thermal resistance (R<sub>jØA</sub>) is 21.9% lower. Moreover, the devices save both weight and headroom compared to standard DPAKs. "Our new ThinDPAKs are an excellent choice for optimizing new designs – and also for upgrading the performance of existing designs," said Sam Wang, vice president, TSC Products. "Although ThinDPAKs are thinner, their footprint is identical to standard DPAKs, allowing simple drop-in replacement and easy trial." The ThinDPAK series comprises a selection of 34 devices with reverse voltage (V<sub>VRRM</sub>) ratings from 45Vdc to 200Vdc with current ratings up to 150A. Devices are available in single and dual (common cathode) configurations. | 27.09.2023 06:30:00 | Sep | news_2023-11-01_14.jpg | \images\news_2023-11-01_14.jpg | https://www.taiwansemi.com/en/searchpn?q=ThinDPAK | taiwansemi.com |
| Y2 Class Interference Suppressor Capacitors | Cornell Dubilier introduces its MYH series of Y2, ... | 11607 | Product Release | Y2 Class Interference Suppressor Capacitors | Cornell Dubilier introduces its MYH series of Y2, EMI/RFI suppression capacitors designed for harsh environments. The MYH series is AEC-Q200 qualified, meets a 2,000-hour THB (Temperature, Humidity, Bias) life test, and has applications in motors, AMR (Automated Meter Readers), UPS, power supplies, charging systems, and appliances. These Y2, line-to-ground capacitors filter out electromagnetic noise and have multiple international safety agency approvals. The 2,000-hour THB test conducted at 85 °C, 85% relative humidity at rated voltage, subjected these components to twice the industry standard test hours required to meet IEC 60834, Class III-B for THB. The MYH capacitor series also passed the rigors of AEC-Q200 automotive testing. These tests include mechanical shock and vibration, thermal cycling, solvent resistance, and solderability which qualify the series for use in the most demanding industrial, automotive, and consumer applications. Capacitance values range from 0.001 to 1 µF in 29 standard values, at 300 Vac, 50/60Hz. Their operating temperature range is from -40° C to +110° C. The series possesses multiple agency approvals including UL, CSA, and VDE, for safety and performance in Y2, line-to-ground applications. | 25.09.2023 11:30:00 | Sep | news_2023-10-15_19.jpg | \images\news_2023-10-15_19.jpg | https://www.cde.com/new-product/myh/ | cde.com |
| Advancing the Circular Economy and Sustainability of the Electronics Industry | Infineon Technologies has taken over as head and c... | 11577 | Industry News | Advancing the Circular Economy and Sustainability of the Electronics Industry | Infineon Technologies has taken over as head and coordinator of the broad-scope European research project EECONE (European ECOsystem for greeN Electronics), intended to make electronics in Europe more sustainable. The objective is to investigate the corresponding technologies along the entire value chain, from design, manufacture and use all the way to recycling. EECONE is one of the Key Digital Technologies research projects supported by the European Union as a Joint Undertaking. 49 partners are participating in the project, which has a volume of approximately 35 million euros total costs. The project is being funded by the European Union and the national governments of the participating companies with around 20 million euros. "Electronics are fundamental to improving the sustainability of many applications. But this is not sufficient, electronics themselves have to become greener," says Constanze Hufenbecher, Infineon Management Board member and Chief Digital Transformation Officer. "Infineon is pleased to take on the lead role in the research project EECONE in order to advance the circular economy together with our partners along the value chain. The only way to achieve sustainability from design and use and all the way to recycling is by working together.” | 21.09.2023 15:00:00 | Sep | news_2023-10-01_10.jpg | \images\news_2023-10-01_10.jpg | https://www.infineon.com/cms/en/about-infineon/press/press-releases/2023/INFXX202309-152.html | infineon.com |
| Reinhard Ploss Appointed Advisory Board Chair | Battery company CustomCells continues to pursue it... | 11573 | People | Reinhard Ploss Appointed Advisory Board Chair | Battery company CustomCells continues to pursue its growth course: Dr. Reinhard Ploss, an experienced DAX executive and renowned supervisory board member, has been recruited for the advisory board. Ploss will also serve as the board chair and support CustomCells in expanding to international markets. With this appointment, CustomCells is strengthening its position as an innovation driver and underlining its ambition to become a global player in the premium battery segment. Ploss served as CEO and CTO of Infineon Technologies AG from 2012 to 2022. He had been a management board member at Infineon since 2007 and was responsible for operations. Ploss, who holds a degree in process engineering and a doctorate in engineering, started his professional career in 1986 in the semiconductor division of Siemens AG. In 2018, Ploss became a presidium member at acatech – the German Academy of Science and Engineering. In 2022, he became the president of acatech as well as an executive board member. Ploss is currently the supervisory board chair of Knorr-Bremse AG and a supervisory board member at Deutsche Telekom AG. “High-performance, reliable, and environmentally friendly energy storage solutions are essential for the electrification of our mobility. CustomCells has proven to be a technological pioneer in this area. That is why I am happy to contribute my experience to achieve these ambitious goals,” said Dr. Reinhard Ploss. | 21.09.2023 11:00:00 | Sep | news_2023-10-01_6.jpg | \images\news_2023-10-01_6.jpg | https://www.customcells.org/news/customcellsr-news/detail/reinhard-ploss-appointed-advisory-board-chair-of-customcells/ | customcells.org |
| Four Days of Invaluable Electronics Knowledge Online | On 16 to 19 October 2023, Würth Elektronik will ho... | 11569 | Event News | Four Days of Invaluable Electronics Knowledge Online | On 16 to 19 October 2023, Würth Elektronik will host its fifth Digital WE Days – a virtual conference that will bring in-depth, first-hand electronics expertise to the screen. Renowned Würth Elektronik specialists and partner companies will present high-caliber presentations on EMC, power management and electromechanics, wireless power, optoelectronics, and many other topics. In addition to the English language presentations, there will be the opportunity to pick up more detailed information in interactive Q&A sessions following each lecture. Registration for this free event is now open at www.we-online.com/digital-we-days. “Our philosophy ‘More than you expect!’ takes center stage at this event, because we are more than just a component supplier,” Alexander Gerfer, CTO of Würth Elektronik eiSos, explains. “We proactively support our customers in solving their problems while providing expertise on the product. So, it comes as no surprise that our ever-expanding community has firmly established this event in its calendar.” During Digital WE Days, Würth Elektronik offers customers and developers, and those interested, a unique opportunity to gain a comprehensive overview of the current state of the art, as well as the latest developments and perspectives in electronics. Partner presentations from onsemi, KDPOF, ST Microelectronics, Texas Instruments and Rohde & Schwarz will join Würth Elektronik’s technical experts in presenting. Each of the 30+ technical presentations will take approximately 30 minutes and will cover topics such as power supply, EMC, filter calculation, power module design, thermal management on printed circuit boards, and much more besides. After each presentation, participants will have the chance to engage directly and personally with the experts in a wide-ranging live Q&A session. | 21.09.2023 07:00:00 | Sep | news_2023-10-01_2.jpg | \images\news_2023-10-01_2.jpg | https://www.we-online.com/en/news-center/events/digital-we-days | we-online.com/digital-we-days |
| Power Electronics: Core Components of a Sustainable World | productronica will present all the relevant develo... | 11578 | Event News | Power Electronics: Core Components of a Sustainable World | productronica will present all the relevant developments along the innovation and value chain from power semiconductors from November 14 to 17, 2023. Conceptual sponsor of the most important event for the industry is VDMA Productronics. Power semiconductors are indispensable for the transformation into a climate-neutral and digital society. The industry, renewable energies, and automotive sectors, in particular, are driving a rising demand. The goals are always to reduce CO2 emissions, increase system efficiencies and advance digitalization. The analysts from the Yole Group expect the global power electronics market to grow from USD 20.9 billion (2022) to USD 33.3 billion by 2028 at a compound annual growth rate (CAGR) of 8.1 percent. They name governmental regulations, the expansion of renewable energies and the demand for energy-efficient solutions as the reasons for this trend. According to Spherical Insights, the industry segment holds the largest market share with over 24 percent, as power electronic devices and systems find widespread usage in motor drives, power supplies, robotics and process control. With regards to the continuous growth of industrial automation, the analysts also consider the industry segment to still be an essential driver of the power electronic market. The industrial sector in particular requires reliable and efficient power electronics in order to increase productivity, reduce energy consumption and optimize manufacturing processes. Every failure in the field can lead to enormous costs. Innovative test solutions from productronica exhibitors Rohde&Schwarz, Viscom, Löhnert, CRS Prüftechnik and SPEA address this issue. With SEMICON Europa, which is once again taking place alongside productronica, the world’s leading trade fair for development and manufacturing is expanding its offering in the semiconductor manufacturing industry. | 20.09.2023 16:00:00 | Sep | news_2023-10-01_11.jpg | \images\news_2023-10-01_11.jpg | https://productronica.com/en/trade-fair/press/press-releases/detail/core-components-of-a-sustainable-world.html | productronica.com |
| Cooperating to Expand Presence in Vehicle Charger Market | Infineon Technologies announced a collaboration wi... | 11587 | Industry News | Cooperating to Expand Presence in Vehicle Charger Market | Infineon Technologies announced a collaboration with Infypower, a Chinese market leader in new energy vehicle charging. Infineon will provide INFY with 1200 V CoolSiC™ MOSFET power semiconductor devices to improve the efficiency of electric vehicle charging stations. “The collaboration between Infineon and Infypower in the field of charging solutions for electric vehicles (EV) provides an excellent system-level technology solution for the local EV charging station industry,” said Dr. Peter Wawer, Division President of Infineon’s Green Industrial Power Division. “It will significantly improve charging efficiency, accelerate charging speed, and create a better user experience for owners of electric cars.” “With Infineon’s more than 20 years of continuous advancement in SiC product offering and the strength of integrated technology, Infypower can consolidate and maintain its technological outstanding position in the industry by adopting state-of-the-art product processes and design solutions“, said Qiu Tianquan, President of Infypower China. “We can also set a new standard for charging efficiency of DC chargers for new energy vehicles. As a result, customers can enjoy more convenience and unique value, promoting the healthy development of the EV charging industry.” | 20.09.2023 14:30:00 | Sep | news_2023-10-01_20.jpg | \images\news_2023-10-01_20.jpg | https://www.infineon.com/cms/en/about-infineon/press/market-news/2023/INFGIP202309-150.html | infineon.com |
| TVS Diode for USB4 and Thunderbolt 4 ESD Protection | Alpha and Omega Semiconductor announced the releas... | 11584 | Product Release | TVS Diode for USB4 and Thunderbolt 4 ESD Protection | Alpha and Omega Semiconductor announced the release of its AOZ8S207BLS-01 Ultra-Low Reverse Working Voltage (V<sub>RWM</sub>) transient voltage suppressor (TVS) diode. Designed to deliver low capacitance and fast response time, the AOZ8S207BLS-01 TVS diode offers high-speed data line protection based on AOS’ advanced Ultra-Low Breakdown Voltage (V<sub>BR</sub>) TVS platform and innovative packaging. These features, along with the TVS diode’s 0.15pf capacitance, make it ideal for USB4 and Thunderbolt 4 electrostatic discharge (ESD) protection. Low breakdown voltage is essential for ESD protection devices, especially when protecting ICs manufactured with the finest process. AOZ8S207BLS-01 features an especially low breakdown voltage, and it can provide a faster response time compared to conventional snap-back devices, enabling it to absorb ESD energy extremely quickly to avoid damage to the IC and surrounding components. In addition, the AOZ8S207BLS-01 is a single-channel device housed in a 0.6x0.3mm leadless Surface-Mounted Device (SMD) package, so it is particularly well-suited to meet the small footprint requirements of USB Type-C connectors. “As the leading developer and supplier of ESD protection solutions in high-speed interfaces such as USB, HDMI, and Thunderbolt, this new TVS platform builds on our state-of-the-art portfolio to give our customers a much better figure of merit (FOM) on clamping voltage times capacitance. In addition to low capacitance, having a lower clamping voltage and faster response during an ESD event is important to protect today’s more ESD-sensitive chipsets. This feature-rich TVS diode makes an excellent solution for high-speed data line protection,” said Charles Chen, Marketing Director at AOS. | 20.09.2023 11:30:00 | Sep | news_2023-10-01_17.jpg | \images\news_2023-10-01_17.jpg | https://aosmd.com/sites/default/files/2023-09/AOS_8S207BLS_PR.pdf | aosmd.com |
| Isolation Devices Extend the Lifetime of High-Voltage Applications | Texas Instruments introduced an opto-emulator port... | 11585 | Product Release | Isolation Devices Extend the Lifetime of High-Voltage Applications | Texas Instruments introduced an opto-emulator portfolio of signal isolation semiconductors, designed to improve signal integrity, consume less power, and extend the lifetime of high-voltage industrial and automotive applications. TI’s inaugural opto-emulators are pin-to-pin compatible with the industry’s most common optocouplers, enabling seamless integration into existing designs while leveraging the unique benefits of silicon dioxide (SiO<sub>2</sub>)-based isolation technology. Optocouplers, which integrate an LED to isolate the signal, have historically been a common choice among engineers. However, optocouplers typically require upfront overdesign to compensate for the inevitable aging effects of LEDs. TI’s opto-emulators eliminate the need for overdesign by using SiO<sub>2</sub> for the isolation barrier, removing the effects of LED aging altogether. With a high dielectric strength of 500 V<sub>RMS</sub>/µm, TI’s SiO<sub>2</sub> isolation barrier enables the portfolio of devices to protect end-product designs for more than 40 years. Opto-emulators also provide isolation protection as high as 3,750 V<sub>RMS</sub>, while reducing power consumption by as much as 80%. Additionally, the portfolio is able to withstand wide operating temperature ranges from –55°C to 125°C, while providing common-mode transient immunity up to 10 times higher than optocouplers. | 19.09.2023 12:30:00 | Sep | news_2023-10-01_18.jpg | \images\news_2023-10-01_18.jpg | https://news.ti.com/new-portfolio-isolation-devices-from-ti-extends-lifetime-high-voltage-applications-to-40-plus-years | ti.com |
| Shipments of GaN Chips Exceed 300 Million Pieces | Innoscience Technology has shipped more than 300 m... | 11574 | Industry News | Shipments of GaN Chips Exceed 300 Million Pieces | Innoscience Technology has shipped more than 300 million pieces of its InnoGan gallium nitride chips as of August 2023, helping customers achieve small size, high energy efficiency, and low loss product design. This is in response to phenomenal market demand across multiple sectors multiple applications in the consumer category - fast charging, mobile phones, LEDs - as well as automotive LIDAR, data centres, and renewable energy and energy storage systems, which has seen analysts such as TrendForce's in its 2023 GaN Power Semiconductor Market Analysis Report, state that “the global GaN power device market will grow from US$180 million in 2022 to US$1.33 billion in 2026, with compound growth rate of 65%”. Commented Dr Denis Marcon, Innoscience’s General Manager, Europe: “We are just at the start of the GaN story. The first applications were all in consumer, but GaN is undoubtedly the key to reducing costs and increasing efficiency in the industrial field as well. And according to automotive industry forecasts, GaN may enter automotive market already this year penetrating applications such as low-power OBC and DC-DC applications in 2025. With such rapid growth in market demand, the reliability of devices, price competitiveness and stable supply in large quantities are now the major concerns of users. Based on an advanced Innoscience’s 8-inch GaN-on-Si IDM manufacturing platform, Innoscience’s current production capacity has reached 15,000 wafers per month, providing tremendous advantages in scale, reliability and cost.” | 19.09.2023 12:00:00 | Sep | news_2023-10-01_7.jpg | \images\news_2023-10-01_7.jpg | https://www.innoscience.com/ | innoscience.com |
| Setting Target for Carbon Neutrality by 2035 | With its production of over 100 billion products p... | 11570 | Industry News | Setting Target for Carbon Neutrality by 2035 | With its production of over 100 billion products per year, Nexperia recognizes the responsibility it holds towards the environment. In May this year, Nexperia has issued its first Sustainability Report, taking stock of the company’s environmental footprint, social responsibility, growth ambitions and its significant role as an international industrial leader. Today, Nexperia proudly announces its target of achieving carbon neutrality, with full transparency and accountability. By 2035, Nexperia is dedicated to achieving carbon neutrality in both its direct operational emissions (scope 1) and the indirect emissions associated with energy procurement for operations (scope 2). This transformative commitment necessitates a transition to 100% renewable electricity from guaranteed origin sources, powering all company operations and factories worldwide. Nexperia’s comprehensive sustainability program goes beyond just reducing scope 1 and scope 2 emissions but is ultimately striving to eliminate scope 3 emissions in the future. These represent the indirect emissions produced along the company’s global value chain. | 18.09.2023 08:00:00 | Sep | news_2023-10-01_3.jpg | \images\news_2023-10-01_3.jpg | https://www.nexperia.com/about/news-events/press-releases/Nexperia-Sets-Target-for-Carbon-Neutrality-by-2035 | nexperia.com |