Bodo's News

Read through my personal pick of news around people, our industry, important events and interesting product releases. Or click on a filter and pick your area of interest!

 

LED Driver Offers Single Solution for Automotive Applications
  • Product Release
  • 2020-07-28

Taiwan Semiconductor announces the introduction of the TS19501 single channel, dimmable LED driver targeting high-brightness automotive applications. Due to the device’s highly integrated design, this single IC is well suited for virtually every automotive LED application: high and low beam headlights; daytime running lights; turn indicators; position indicator lights; fog lights; ATV and four-wheel drive high-brightness lamps. The IC is also offered in a version ideal for a wide range of non-automotive DC-input LED lighting applications. “The lighting market including automotive lighting is moving toward replacing halogen and incandescent lighting with high efficiency LEDs,” reported Sam Wang, Vice President, TSC Products. “The need for highly integrated LED drivers which save assembly time and cost and afford designers maximum design flexibility is critical as electrification of transportation continues.” The TS19501, while not the first driver to address this growing market, does provide designers with more flexibility, lower pin count and typically lower external parts count than competing devices.

ExpoElectronica New Dates
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Learn more:
expoelectronica.ru
  • Event News
  • 2020-07-24

The Covid-19 pandemic has impacted virtually all industries and spheres of life, in Russia and globally. The Decree of the Governor of the Moscow Region dated 12 March 2020 introduced a ban on holding mass events in the Moscow Region, and this ban was then repeatedly extended. Subsequently, despite formal lifting of the aforementioned ban, confirmation by the organizer of compliance with the Standard for the functioning of organizations carrying out activities for the organization of conferences (congresses) and exhibitions in order to prevent the spread of the new coronavirus infection (COVID-19) was made a condition precedent for resumption of exhibition organizing activity, and this Standard was not issued for a long time. This uncertainty led to us being unable to carry out all the necessary preparation activities in respect of the exhibition ExpoElectronica, which are lengthy and involve multi-stage process. Considering the above, and in the best interests of the industry, it has been decided that the exhibition ExpoElectronica will take place on the following new dates: 13–15 April 2021. For more information please address the exhibition team and follow the news on our website.

Silicon Carbide Transistors Improve Efficiency in Home Storage Systems
  • Industry News
  • 2020-07-23

A major challenge of PV home storage is that the batteries are charged within a few hours in intense sunlight and then discharged at very low power, or partial load, over a long time period during the night. Because of this, battery inverters in home storage systems should have high conversion efficiency over the largest power range possible. In the HyBaG project, which started in 2017, the Fraunhofer Institute for Solar Energy Systems ISE in collaboration with Kaco New Energy and STS - Spezial-Transformatoren Stockach has developed a low-loss hybrid inverter which functions efficiently even at partial load. A central component of Fraunhofer ISE’s work in the project was to develop compact and modular battery controllers. This could be achieved by using novel gallium nitride (GaN) and silicon carbide (SiC) power components. These modern transister bridge circuits are the core of modern battery chargers and enable increasingly faster switching with lower losses. In the project, various approaches to optimize the partial load efficiency were examined by simulation. Prototypes were then constructed using the best resulting concepts. Both the hardware as well as the control software for the power electronics were optimized. Different circuitry topologies were investigated and their partial load efficiencies were evaluated at low power levels.

Positive Outlook for SPS 2020
  • Event News
  • 2020-07-23

The Bavarian Government has approved the protection and hygiene concept for exhibitions in Bavaria signaling the go-ahead for the SPS 2020 in Nuremberg from 24 - 26 November 2020. In addition to numerous national exhibitors, many international exhibitors have also confirmed their attendance and are looking forward to the exhibition season with eager anticipation. The exhibition area and confirmed number of exhibitors to date are only slightly down on the same period last year despite the corona pandemic. This underlines the exhibition’s importance for the industry. “The importance of exhibitions to the economy is akin to that of automation for industry – one of the most important drivers. SPS is a fixed date on the calendars of automation companies and we are all very much looking forward to meeting up in Nuremberg in person at the end of the year,” sums up Sylke Schulz-Metzner, Vice President SPS of Mesago Messe Frankfurt. For the event organizer Mesago, the well-being of all attendees of SPS 2020 is paramount. Together with NürnbergMesse, it has therefore developed a concept covering all the necessary organizational, hygiene, and medical aspects. The entire exhibition has been organized to accommodate observance of the minimum social distancing requirement of 1.5 m at all times. In addition, a mandatory face covering requirement has been introduced for anyone inside the building plus amendments to the catering concept and the provision of sufficient space in the hall entrances and waiting areas. There will be no ticket sales on site, visitors must register in advance via the ticket shop.

Joining Forces
  • Industry News
  • 2020-07-23

Foxy Power GmbH, a Berlin based company focused on strategy, business development, and sales for innovative and disruptive technologies in power electronics, and Electronic Minds LTD have signed a cooperation agreement. “With our product value maximization concept we can also provide manufacturers valuable market information and customer feedback”, says Christopher Rocneanu, CEO and Founder of Foxy Power, “ now with the support of Electronic Minds we can additionally offer in-depth application support and technical insights into all stages of the product life cycle”. “Foxy Powers focus on disruptive technologies in power electronics fits very well with our proven experience in providing high performance solutions in eMobility and energy applications utilizing wide bandgap semiconductors and real time digital control” adds Dr. Iain Mosely, CEO and Founder, ” this new partnership will provide a complete solution for new market players and startups.” Interested customers can sent requests to sales@foxypower.com or call +4915121063411.

Optimized EMC Conditions in Electrical Drive Systems
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Learn more:
fuss-emv.de
  • Product Release
  • 2020-07-23

Frequency converters allow the dynamic operation of electric drives, but at the same time their functional principle inherently results in high-frequency interferences. Line filters are usually installed to keep high frequency, grid-bound interferences out of the power grid in accordance with EMC standards. However, if one follows the interference paths more closely, it becomes clear that the source are the power semiconductors inside the converter and that those interferences affect the output lines as well. While sine wave filters reduce line to line interferences at the inverter output, a different type of interference can bypass a normal sine wave filter. These interferences, which have the same phase in all lines, are known as common mode noise. This assessment led to equip a sine filter with an additional component to suppress common mode noise: the common mode filter. Common mode interferences show up in distorted line-to-earth voltages at the output of the frequency converter. The utilization of a common mode filter eliminates the interferences and returns the signal to its original sinusoidal waveform. Sine filters equipped with a common mode filter are also known as all-pole sine filter. The only requirement for the utilization of FUSS EMV all-pole sine filter is a minimum switching frequency of at least 6 kHz. For applications running at lower switching frequencies, custom built all-pole filters can be designed to meet specific requirements.

Calibrated EFT/Burst Magnetic Field Sources
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Learn more:
langer-emv.de
  • Product Release
  • 2020-07-22

Investigations of the immunity of integrated circuits (ICs) and printed circuit boards are important for testing components and assemblies during development. With the magnetic field sources of the H4-IC and H5-IC sets, Langer EMV-Technik offers specialized tools for small-scale injection of burst pulses into ICs, line structures and assemblies. The EFT/Burst magnetic field sources are characterized by a high achievable field strength of up to 200 mT. This means that circuits can also be subjected to a relevant field even through their housing. The reactions of the circuit enable its analysis with regard to interference immunity and signal safety. The safety of a circuit can be assessed during different functional stages of the circuit (e.g. during booting or switching operations). The frequency response of EFT/burst magnetic field sources is optimized for the transmission of standard pulses of a burst generator (according to IEC 61000-4-4). The BS 06DU-s field source of the H5-IC set reaches a maximum flux density of approx. 150 mT at its peak. Due to the design of the field source, the field lines are repelled by the field source tip and therefore achieve a high efficiency even at a greater distance.

Bringing Disruptive Power Electronics to the Road Track and the Skies
  • Industry News
  • 2020-07-21

GaN Systems and BrightLoop Converters announced their strategic partnership to develop the latest AC/DC and DC/DC Converter products for electric motorsport and aerospace applications. Leveraging GaN Systems’ 650V GaN transistors, BrightLoop produces a range of converters that are smaller, lighter, and more efficient than currently available in the market. GaN is a key component for applications in industries requiring high power performance and reliability. BrightLoop’s most recent family of DCDC converters, including the 1.9 kW, 4.8 kW, and 9.6 kW DCDC converters designed for hybrid and electric racing, incorporates GaN Systems transistors and are around half the size and weight of the company’s first generation DCDC converter developed without GaN. BrightLoop continues to make advancements using GaN to produce lighter and more compact converters. BrightLoop’s DCDC converters are now used in many of the Formula E teams and the winning team from 2019. The converter’s function is to power all the low-voltage electronics including pumps, lighting, and radio. Most recently, the World Sporting Consulting (WSC) Group, the premier motorsport event and racing promotion organization overseeing Touring Car Racing (TCR) and ETCR (Electric Touring Car Racing) brands, announced BrightLoop as the sole supplier of DCDC converters for ETCR cars. ETCR is the world’s first electric touring car championship, which will begin this summer 2020.

SiC Power Modules to Support Solar PV Inverters
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Learn more:
onsemi.com
  • Product Release
  • 2020-07-20

ON Semiconductor has introduced a full SiC power module for solar inverter applications, which has been selected by Delta, to support its M70A three-phase PV string inverter portfolio. The NXH40B120MNQ family of full SiC power modules integrate a 1200 V, 40mO SiC MOSFET and 1200 V, 40 A SiC boost diode with dual boost stage. The use of SiC technology delivers the low reverse recovery and fast switching characteristics needed to achieve the high levels of power efficiency required in applications such as solar inverters. As part of ON Semiconductor's growing portfolio of Power Integrated Modules (PIMs) based on wide bandgap (WBG) technology, the NXH40B120MNQ offers a high level of integration with pin assignment optimized for inverter design. By using SiC components, the power module delivers low conduction and switching losses, enabling the use of higher switching frequencies, which contributes to higher inversion efficiency. The modules are designed for ease of use, with solderless press-fit connections and customer-defined thermal interface options, depending on customer preferences. The NXH40B120MNQ full SiC power module is available in 2-channel and 3-channel variants, and is complemented by the NXH80B120MNQ0, a 2-channel module that integrates a 1200 V, 80mO SiC MOSFET with 1200 V, 20 A SiC diode.

Design and Build a Current-Mode Controller in One Hour
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Learn more:
gotowebinar.com
  • Industry News
  • 2020-07-20

Join us for a webinar on Friday Jul 31, 2020 at 10:00 AM PDT. Dr. Ridley will show how to quickly and efficiently design the controller for a current-mode power system. This involves measuring the power stage, observing the switch current, adding a compensation ramp and characterizing the new power stage. The outer loop compensation is then selected, inserted into the control board, and the loop is measured. All design and measurements will be done on a live working power stage.

Webinar: What's new in PLECS version 4.4?
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Learn more:
gotowebinar.com
  • Industry News
  • 2020-07-19

In this webinar, a Plexim engineer will demonstrate user interface updates, added components, and more new capabilities included in PLECS Version 4.4. Some of the features shown now allow PLECS users to:- Define separate tasks for generating code to embedded and real-time targets- Display a legend in Scopes and XY-Plots- From File, PID controllers, Fourier, RMS, THD, and new power module blocks- Use non-floating-point signal data types in normal simulations- Plot custom figures in PLECS Standalone, including control system analyses

Passives Distributor of the Year Award
  • Industry News
  • 2020-07-17

TTI, Inc. has been awarded the 2019 Full Service Passives Distributor of the Year award from Vishay Intertechnology. The 2019 award announcement marks the third consecutive year that TTI has been recognized by Vishay with the Passives Distributor of the Year Award. “I am pleased to present TTI with the Distributor of the Year Passives Products award which recognizes a deep understanding of our markets and technologies. TTI ensures that Vishay’s broad portfolio is always fully available for our customers, and I congratulate the TTI teams throughout the Americas on this outstanding performance,” said Dave Valletta, Executive Vice President of Sales at Vishay Intertechnology. Jeff Ray, Vice President Product Management and Supplier Marketing, responded to the award win, “Receiving this milestone achievement for the third time is a great honor for our committed passives team who have proven once again to be all-in by providing excellent service and product support to the Vishay product line.” 

Representative for the Midwest
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Learn more:
sanan-ic.com
  • Industry News
  • 2020-07-17

Sanan Integrated Circuit (Sanan IC) has signed manufacturers’ representative firm JF Kilfoil to oversee the company’s portfolio of power electronics and optical foundry services for the Michigan, Ohio, Kentucky, Indiana, Pennsylvania and West Virginia territories. Founded in 1953, JF Kilfoil has successfully positioned itself as the Midwest’s most reliable source for semiconductors, electromechanical components, connectors and printed circuit boards from market leading suppliers. The firm boasts a customer base spanning automotive, white goods, contract manufacturing, and test and measurement. JF Kilfoil will oversee Sanan IC’s GaN and SiC wide bandgap power electronics for automotive and home appliance markets, as well as its optical chip technologies for automotive LiDAR. For inquiries, contact Tim Kilfoil at tmkilfoil@jfkilfoil.com.

Flyback Switcher IC for Automotive BEV and PHEV Applications
  • Product Release
  • 2020-07-16

Power Integrations announced the production release of the InnoSwitch™3-AQ, an AEC-Q100-qualified flyback switcher with integrated 750 V MOSFET and secondary-side sensing. The newly qualified device family targets automotive EV applications, such as traction inverter, OBC (on-board charger), EMS (energy management DC/DC bus converters) and BMS (battery management systems). The InnoSwitch3-AQ uses Power Integrations’ high-speed FluxLink™ coupling to achieve ±3% accuracy for combined line and load regulation while eliminating both dedicated isolated transformer sense-windings and optocouplers. FluxLink technology maintains output voltage regulation even under the transient stress test, which is particularly challenging for PSR-based implementations. The integrated 750 V MOSFET meets stringent automotive de-rating requirements, and an on-chip synchronous rectifier controller delivers above 90% efficiency at the nominal 400 VDC input voltage. Optimized InnoSwitch3-AQ designs achieve less than 10 mW no-load energy usage across the input voltage range. The InnoSwitch3-AQ family ICs are packaged in a surface-mount InSOP with 11 mm primary to secondary creepage, which exceeds the stringent requirements for high altitude (> 5000 m) isolation. The RDR-840Q reference design kit incorporating the newly released IC demonstrates start-up, shutdown and efficient operation from 30 VDC to 550 VDC input, as well as fast transient response and a variety of safety and protection features.

Combining Wireless Power and Data Transmission
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Learn more:
we-online.com/news
  • Product Release
  • 2020-07-16

Würth Elektronik has extended its " Wireless Power 200 W Extended Medium Power Solution" developer kit to include an innovative function: Although it was already possible to transfer data from the receiver device to the charging station, bidirectional data transfer can now be combined with the charging process. During wireless power transmission, the device and charging station exchange data through amplitude and frequency modulation. Würth Elektronik provides the software for this newly developed wireless solution, including a checksum control - free of charge. A display board can also be ordered as an optional hardware extension of the developer kit. Würth Elektronik currently offers the widest range of wireless power coils on the market - compliant both with the Qi standard and beyond. "Fast connection without cables and the advantage of being able to build devices encapsulated and without plug connections. This is extremely interesting for developers in the industrial or medical technology sector – as it is too for the manufacturers of smartphones, lawn mower robots or electric scooters,” explains Cem Som, Division Manager Wireless Power Transfer at Würth Elektronik. "With our developer kit we now offer options beyond the charging process and use inductive energy transfer as a communication channel.”

EM World’s Innovation Award
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Learn more:
indium.com/news
  • Industry News
  • 2020-07-16

Indium Corporation earned Electronics Manufacturing (EM) World's Innovation Award for its low-temperature alloy technology, Durafuse™ LT. The award was presented on Friday, July 3, in Shanghai, China, during Productronica China. The EM Innovation Award program recognizes and celebrates excellence in the electronics industry, encouraging companies to achieve the highest standards and push the industry forward. Durafuse™ LT is a novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications that need to reflow below 210°C. Where traditional low-temperature solders can produce brittle solder joints that are susceptible to drop shock failures, Durafuse™ LT provides improved drop shock resilience, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.

Power Supply Features Baseplate Cooling and Medical Certification
  • Product Release
  • 2020-07-16

RECOM introduces a highly compact 4”x 2” 230W innovative baseplate-cooled power supply for 2 x MOPP medical, household, industrial and ITE applications. The compact 4”x 2” RACM230-G series power supplies from RECOM support up to 160W continuous output power and 230W for several seconds for loads with peak demands, without fan cooling. With forced air, depending on model, line input and ambient temperature, 230W is available continuously. Outputs available are 12V, 24V, 36V, 48V and 54V nominal with conversion efficiency up to 92% and an operating temperature range of -40 to +80°C. International safety certifications include 2 x MOPP (250VAC) medical, household, industrial and audio/video/ITE for operation up to 5000m altitude with universal 80 - 264VAC input, enabling worldwide-compliant operation. Standby power consumption is less than 500mW. Additional features as standard include a smart fan output. For flexibility, the RACM230 series is available as an open-frame design or in an enclosed metal housing. For higher output power, up to 550W, the new RACM550-G series is also available with similar or enhanced specifications with even higher power products in the pipeline. Samples and OEM pricing are available from all authorized distributors or directly from RECOM.

Single Port and Eight Port ICMs
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Learn more:
belfuse.com/news
  • Product Release
  • 2020-07-16

Bel Magnetic Solutions announces a single port and eight-port 2.5GBASE-T MagJack ICM. These ICMs offer a cost-effective solution for upgrading end-product performance to multi-rate, NBASE-T Ethernet standards. These reliable, cost-competitive ICMs are compatible with all new multi-rate Ethernet PHYs and are suitable for next-generation 5G cellular equipment, low density, 2.5GBASE-T Ethernet switches, high bandwidth 2.5GBASE-T network interface cards, NBASE-T compliant products and industrial controls equipment. Bel Magnetic Solutions’ 2.5GBASE-T ICMs are backward compatible to slower speeds and use industry-standard footprints and pinouts. The 2.5GBASE-T solution doubles product speed and bandwidth at nearly the same cost as 1GBASE-T solutions.

CEO Transition Announced
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Learn more:
vincotech.com/news
  • People
  • 2020-07-16

Vincotech announced that its Board of Directors has appointed Eckart Seitter, Senior Vice President of Sales and Marketing, as Vincotech's Chief Executive Officer (CEO) and Chairman of the Board effective October 1, 2020. Eckart Seitter will succeed Vincotech's CEO and Chairman of the Board Joachim Fietz, who will retire from the company and board after 12 successful years as CEO. This smooth CEO transition demonstrates the long-term continuity of the company as a reliable and trusted partner for its global customers, counting on Eckart Seitter's tremendous business and leadership skills, his strategic insight and his customer-focused mentality. Eckart Seitter has been with the company for more than 20 years. He became Managing Director Sales and Marketing in 2013, and thus has made a strong contribution to Vincotech's development and success. "Joachim Fietz set exceptionally high standards of achievement during his leadership for more than a decade, and I am very much looking forward to this new challenge to follow him, and to working together with the management team," said Eckart Seitter. "Together, we want to set the course for our further global growth. Our goal is to continue the development of Vincotech, a strong brand within Mitsubishi Electric Corporation, and to sustainably fulfil our primary obligation to serve customer needs quickly and flexibly".

Dennis Earley Appointed as President
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Learn more:
premiermag.com
  • People
  • 2020-07-15

Premier Magnetics is pleased to announce the promotion of Dennis Earley to the position of the company’s president. Dennis Earley, who has served as Premier Magnetics’ vice president and general manager since September of 2017, takes over responsibility for corporate strategy and global operations, starting August 1, 2020. This seamless leadership transition is the result of a thoughtfully planned succession. Dennis succeeds Jim Earley who founded the company and has served as president since its inception in 1991. Jim will continue to serve the company in a senior advisory capacity as chief operating officer. “Dennis has played an integral role in the evolution and development of our business,” said current Premier Magnetics President Jim Earley who announced the appointment. “He has a deep understanding of the electronics industry and has demonstrated exceptional leadership as our vice president and, before that, as sales manager. We will benefit from his experience and forward-looking vision as we continue on our path of profitable growth.”

DC-DC Converter Demonstration Board
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Learn more:
epc-co.com/News
  • Product Release
  • 2020-07-15

EPC announces the availability of the EPC9143, a 300 W DC-DC voltage regulator in 16th brick size. The EPC9143 power module integrates Microchip’s dsPIC33CK digital signal controller (DSC) with the latest generation EPC2053 eGaN FETs from EPC to achieve 96% efficiency in a 48 V input to 12 V output conversion at 25 A. The switching frequency of 500 kHz enables the 300 W in the very small 16th brick format which is just 33 mm x 22.9 mm (1.3 x 0.9 in). Additional phases can be added to this scalable 2-phase design to further increase power. The flexibility of the Microchip digital controllers allows the input voltage to be adjusted from 8 V – 72 V and the output voltage from 3.3 V – 25 V. Brick DC-DC converters are widely used in data center, telecommunication and automotive applications, converting a nominal 48 V to a nominal 12 V distribution bus among other output voltages. The main trend has been towards higher power density given the form factor is fixed. A main application is high density 48V to 12V point-of-load (POL) converters, where a regulated 12V output voltage is required, like those used for commodity PCIe cards and storage. eGaN® FETs and integrated circuits provide the fast switching, small size and low cost that can meet the stringent power density requirements of these leading-edge applications with low component count and solution cost.

Upcoming ECPE Tutorials & Online Tutorials
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Learn more:
ecpe.org/events
  • Event News
  • 2020-07-14

• ECPE Online Tutorial 'Passives in Power Electronics: Magnetic Component Design and Simulation'
24 - 25 September 2020, Digital Event via Webex

• ECPE Tutorial 'Introduction to Power Electronics'
29 - 30 September 2020, Hamburg, Germany

• ECPE Online Tutorial 'Power Electronics Packaging'
1 - 2 October 2020, Digital Event via Webex

• ECPE Tutorial 'Testing Automotive Power Modules according to the ECPE Guideline AQG 324'
7 - 8 October 2020, Nuremberg, Germany

• ECPE Tutorial 'Use and Assessment of Power Device Models in Power Electronic Simulation'
22 October 2020, Nuremberg, Germany

• ECPE Online Tutorial 'Power Circuits for Clean Switching and Low Losses'
18 - 19 November 2020, Digital Event via Webex

• ECPE Tutorial 'High-Precision Power Electronics'
1 - 2 December 2020, Eindhoven, Netherlands

Line of Power Inductors
  • Product Release
  • 2020-07-14

Monolithic Power Systems announced the worldwide release of a line of highly efficient power inductors. Offered in a wide range of sizes, molded and semi-shielded, these inductors have been designed and matched for optimal performance with MPS ICs, and when paired together, provide an easy, complete power solution. MPS customers can be certain that these new inductors meet all necessary specifications and have been tested and characterized with specific MPS power regulators for optimal results. Furthermore, the unique mix of ferrite and binding powder helps deliver top performance, cost, and efficiency. “Today’s highly developed power ICs require superior power inductors. For this reason, we decided to introduce inductors to our product portfolio to work optimally with MPS power regulators to achieve the best performance in terms of PCB space and thermal efficiency for our customers,” says Maurice Sciammas, Senior VP of Sales & Marketing. With proven expertise in the power conversion market, MPS ICs and their new line of Power Inductors can now be used in countless power supplies and filtering applications.

Strengthening Analog Semiconductor Leadership
  • Industry News
  • 2020-07-13

Analog Devices and Maxim Integrated announced that they have entered into a definitive agreement under which ADI will acquire Maxim in an all stock transaction that values the combined enterprise at over $68 billion. The transaction, which was unanimously approved by the Boards of Directors of both companies, will strengthen ADI as an analog semiconductor leader with increased breadth and scale across multiple attractive end markets. “Today’s exciting announcement with Maxim is the next step in ADI’s vision to bridge the physical and digital worlds. ADI and Maxim share a passion for solving our customers’ most complex problems, and with the increased breadth and depth of our combined technology and talent, we will be able to develop more complete, cutting-edge solutions,” said Vincent Roche, President and CEO of ADI. “Maxim is a respected signal processing and power management franchise with a proven technology portfolio and impressive history of empowering design innovation. Together, we are well-positioned to deliver the next wave of semiconductor growth, while engineering a healthier, safer and more sustainable future for all.” “For over three decades, we have based Maxim on one simple premise – to continually innovate and develop high-performance semiconductor products that empower our customers to invent. I am excited for this next chapter as we continue to push the boundaries of what’s possible, together with ADI. Both companies have strong engineering and technology know-how and innovative cultures. Working together, we will create a stronger leader, delivering outstanding benefits to our customers, employees and shareholders,” said Tunç Doluca, President and CEO of Maxim Integrated. Upon closing, two Maxim directors will join ADI’s Board of Directors, including Maxim President and CEO, Tunç Doluca.

Railway Approved DC/DC Converters
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Learn more:
tracopower.com
  • Product Release
  • 2020-07-11

The TEP 40UIR & TEP 60UIR are two series of high performance railway DC/DC converters with ultra wide 12:1 input voltage range featuring a compact ¼ brick (2.3”x1.45”x0.5”) metal package. The ultra wide input allows the converter to act as an all-in-one solution if different voltage ranges have to be covered in the same application, resolving the issue of having multiple different converters installed. An internal circuit implemented in these modules helps to extend the hold-up time with ease as it eliminates the need of expensive high voltage capacitors to cover the full input range. With only a 25V capacitor (independent of the input voltage) the whole input range can be covered effectively reducing cost, size an inrush current. All models are approved for railway applications according to EN 50155, EN 61373, EN 45545-2 and offer standard features such as high efficiency up to 91%, an operating temperature range of -40° to +85°C and an I/O-isolation voltage of 3’000 VAC. An adjustable under voltage lockout function, remote on/off and adjustable outputs round out the features and ensure that these converter modules fit in any application setup.

Virtual EPE'20 ECCE Europe-Conference
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Learn more:
epe2020.com
  • Event News
  • 2020-07-10

The virtual 22nd European Conference on Power Electronics and Applications will take place from the 7th to the 11th of September 2020. Meeting several challenges, the organizing team is working very hard to offer you a one of the kind experience. They carefully chose the Whova platform to support the event, offering enhanced discussion and networking capabilities. Zoom channels will ensure large audience discussion stability and smaller meetings will be possible using the channels of your choice. The EPE ECCE Europe conference is the largest in its field, attracting experts from numerous different countries every year to join in the discussions. With the objective to exchange and meet fellow professionals and academics, the EPE ECCE Europe conference brings together researchers, engineers, etc. working at the forefront of power electronics technologies. For this type of event, where the future role of power electronics in this ecological revolution will be explored, the EPE ECCE Europe conference is one of the privileged places. There will be the opportunity to discuss a vast number of subjects during EPE '20 ECCE Europe, not only during the virtual lecture and dialogue sessions of the conference, but also at the virtual exhibition, industrial forums and tutorials.

Fuses & Switchgear for Solar Systems with PV String Inverters 
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Learn more:
mersen.com
  • Product Release
  • 2020-07-10

Decades of experience on the NH Fuse-links and on the NH Fuse switch disconnectors through the Multivert® and Multibloc® ranges enable MERSEN to offer a complete solution to their customers, which meets the specific application requirements and delivers high quality products, high level of service and expertise. Mersen NH 800V AC fuses have been designed specifically for photovoltaic systems with 1500V DC / 800V AC inverters. Thanks to a specific silver fuse element design in comparison to conventional line protection gG class operating fuses, these 800V AC fuses can interrupt any surge, from the lowest fusing up to 90kAmps at a tested voltage of 880V, in a standard NH type size. With a gR operating class described both in IEC 60269 standard and UL 248-13, Mersen can provide a fuse offer that is globally accepted, whatever the area of destination is Europe, Asia, South or North America. Mersen is now the only manufacturer to offer a complete package of NH Fuses & FSDs designed specifically to answer the requirements of protection and distribution of electric networks in the combiner boxes on the AC side of the new string inverters with rated operational voltage of 800 V AC. This offer includes NH fuse-links, and NH Fuse switch disconnectors, in horizontal version (Multibloc®) and in vertical version (Multivert®).

Solutions on Resistor-Based Current Sensing
  • Industry News
  • 2020-07-09

Mouser Electronics is pleased to offer customers a resource site dedicated to Current Sensing Solutions from Microchip Technology and Vishay Intertechnology. Current sensing is a key requirement for the development of smart motor controls and high-efficiency power supplies. The site features a range of controllers, resistors, and amplifiers from Microchip and Vishay, offering a single resource for designers seeking reliable resistor-based current-sensing solutions. The Microchip and Vishay Current Sensing Solutions reference site on the Mouser website offers links to a comprehensive selection of products from Microchip and Vishay, including product descriptions and ordering information. The site also includes a link to an informative white paper on using current-sense resistors to measure current for closed-loop power control. The white paper, titled "Basics and Trade-offs of Resistor-Based Current Sensing," examines high-side versus low-side sensing, with information on associated amplifier electronics, and provides information on determining the resistor value, selecting the right type of resistor, and physical connection factors. The new Current Sensing Solutions site provides a selection of eight products designed to provide a reliable current sense solution for motor control applications. Current sense resistors often provide the most appealing solution when compared with Hall-effect devices and current sensing coils, and the combination of current sense resistors and amplifiers meets the demanding requirements of rugged industrial applications.

Scott Adams President of eMobility Segment
  • People
  • 2020-07-09

Power management company Eaton announced that Scott Adams has been named president, eMobility. In this role, he will be based in Southfield, Michigan, and report directly to João Faria, president, Vehicle Group, Eaton. Adams is responsible for leading all aspects of the business to achieve Eaton’s objectives for top-line revenue growth and profitability. “Scott’s contributions to the success of our eMobility business since its inception, along with his deep understanding of vehicle markets and customers make him an excellent choice for this role,” said Faria. “His proven track record of leading organizations to achieving growth will be an asset as we work to expand our eMobility portfolio and strengthen our global capabilities.” Adams joined Eaton in 1994 as a project engineering manager in Cleveland, Ohio, and has held numerous positions of increasing scope over his 26-year career with the company. Most recently, he was senior vice president, Product Strategy, Sales and Marketing, eMobility, where he was responsible for developing and executing Eaton’s electrification growth strategy. Prior to his roles within eMobility, Adams served as senior vice president, Global Product Development, Marketing and Planning, Vehicle Group, Eaton. He has also held roles as director of sales for North American Automotive, business unit manager for the Vehicle Group’s Light Duty Transmission and Off-Highway businesses and led the former Truck Group’s Vehicle Solutions business unit.

Developing SiC-based Automotive Inverters Together
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rohm.com/news
  • Industry News
  • 2020-07-08

ROHM and Leadrive Technology held an opening ceremony of their joint laboratory on SiC technology in the China (Shanghai) Pilot Free Trade Zone (Lingang New Area). Since 2017, ROHM and LEADRIVE have been collaborating and carrying out detailed technical exchanges on automotive applications utilizing SiC power devices. Establishing a joint research lab centered on vehicle power modules and inverters utilizing ROHM's SiC MOSFET bare chips and isolated gate drivers will give both companies the opportunity to further accelerate the development of innovative power solutions.  "As a pioneer and leading supplier of SiC power devices, ROHM has a proven track record for providing high quality power solutions that combine industry-leading device technology with driver ICs, and we are committed to promote the use of SiC for xEV applications," adds Dr. Kazuhide Ino, Member of the Board, Senior Corporate Officer, CSO and Senior Director of Power Device Business at ROHM Co., Ltd. "Understanding customer needs and market trends is extremely important when developing SiC power device technology. LEADRIVE plays an important role in the applied research of SiC as a manufacturer of automotive power modules and inverters. Through this joint research lab, we can strengthen our partnership and contribute to the technical innovation of automotive power solutions centered on SiC," Dr. Ino concludes.

3-20W AC/DC Converter Series
  • Product Release
  • 2020-07-06

Due to the development of IoT (Internet of Things) and the 'smart home' concept, the requirement of household appliances on the safety and dimensions is more important than ever. MORNSUN ultra-compact AC/DC converter LD-R2 series, for example, 1 x 1x 0.7 inches of LD03/LD05 series, are the ideal power supply for applications with space limitation. With the universal input voltage of 85-305VAC, an operation temperature range of -40~85? and efficiency of 87%, LD-R2 series can be used for applications in commercial and industrial. The 2-Y-capacitors design, EMI class B without external components requirement and No-load power consumption as low as 0.1W make them the perfect match for the household appliance. The LD05-23BxxR2 series is provided with the IEC / EN / UL62368 and the IEC / EN60335 and the IEC / EN61558 safety standard for domestic applications. These compact modules are very suitable for use in smart meters, kitchen equipment, climate control such as sustainable heating and cooling and other IoT applications in a domestic environment. It can be widely used in many fields such as industrial control systems, smart homes, smart buildings, smart agriculture, household appliances, etc.

PCB-embedded GaN-on-Si Half Bridge Circuits
  • Product Release
  • 2020-07-06

Researchers at the Fraunhofer-Institute for Applied Solid State Physics IAF have integrated their monolithically integrated GaN power ICs using PCB embedding technology as a half bridge circuit, including gate and DC link capacitors. The result is an extremely compact and efficient highly integrated voltage converter of the 600 volts class in a user-friendly package. The integrated functionality in the chip and all critical passive components on the package allow it to be used in a modular fashion, thus reducing the effort required for the development of future power electronic systems. Energy-efficient power electronics for energy conversion and transmission are becoming increasingly important, as future-oriented and sustainable energy concepts, such as electric mobility or power supply via renewable energies, depend on them. For this purpose, the Fraunhofer Institute for Applied Solid State Physics IAF has developed a user-friendly, highly integrated GaN voltage converter in a compact package that is extremely resource-efficient and can be used in a modular fashion. The result is an extremely compact and efficient voltage converter suited for all 600 volts applications. It allows a reliable and modular system design, thus facilitating design and production processes.

105°C Rated, 800V Solid State Relay
  • Product Release
  • 2020-07-06

Littelfuse announced the PLA172P OptoMOS Relay, an 800 V normally-open single-pole 6-pin solid-state relay (SSR). It is the first solid-state relay in the Littelfuse product portfolio that comes with guaranteed electrical parameters at 105 °C ambient operating temperature. The PLA172P is an extension to our OptoMOS solid-state relay product line, offering our highest voltage rating (800V) in a surface mount SSR Flatpack package," said Steve Andrezyk, Global Product Manager at Littelfuse. "It also has our highest temperature range in a solid-state relay, extending our operational temperature range from 85 ºC up to 105 ºC, enabling hardware engineers to precisely design their circuits at very challenging temperatures." Isolation current monitor circuits for higher voltage systems >400 V require high blocking voltage, low off-state leakage current relays with high input-to-output isolation rating to prevent potential lethal current conduction to the system chassis. The PLA172P relay's 800 V load voltage rating with 100 mA load current capability provides additional design margin compared to the more common 600 V rated SSRs, particularly on noisy AC power line applications and high voltage battery applications. The 105 C specifications including the low 5 µA maximum off-state leakage current rating in conjunction with the low on-resistance, making it the ideal choice for high precision isolation current monitor applications.

High Power Devices for Inverter Traction Modules
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danfoss.com/news
  • Industry News
  • 2020-07-06

ON Semiconductor and Danfoss announced that ON Semiconductor will supply Danfoss Silicon Power with high power IGBTs and diodes for inverter traction modules in the electric vehicle market. "Chip independency is an important and fundamental element of the Danfoss go-to market strategy. By selecting IGBT chips from ON Semiconductor we are accommodating the high growth expectations from our automotive customers", said Claus A. Petersen, senior vice president and general manager, Danfoss Silicon Power. "Our main objective is to develop world-class power modules, fitted exactly for the application in question. We are happy to have a long-term and robust relationship with ON Semiconductor." "With investment in power technologies and manufacturing capacity globally, ON Semiconductor reiterates our firm commitment to be the top supplier of automotive high power devices," said Asif Jakwani, senior vice president of the Advance Power Division at ON Semiconductor. "Utilizing our semiconductor portfolio with Danfoss' extensive experience in power module design and manufacturing, we expect our penetration in the vehicle electrification market to accelerate, benefitting both companies." ON Semiconductor will fabricate the high power components in manufacturing locations in East Fishkill, New York and Bucheon, South-Korea. Danfoss will fabricate their power modules in Flensburg, Germany and Utica, New York.

Expertise to Powering Stairlifts
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denchigroup.com
  • Industry News
  • 2020-07-02

Always looking to provide the market highly-optimised energy storage solutions, Denchi Group has secured a large-scale contract with DC motor system manufacturer Lemac. Based in Scotland, Lemac produces the motor systems incorporated into a leading brand of stairlifts. DC systems (rather than AC ones), are used in these stairlifts because they are inherently safer. Also power delivery is better regulated, resulting in a smoother ride for the user. In addition, operation can still continue even if a power outage occurs on the mains supply. To complement the lightweight and streamlined motor systems Lemac provides for these stairlifts, compact high-density batteries are mandated. The company had previously used an offshore source for its battery units. However, there were some significant issues in terms of quality. Denchi was able to offer a much more compelling alternative, manufactured in the UK for only a marginal increase in cost. "Often we see companies that went offshore to source energy storage solutions for their products coming to us when they suffer with technical and logistical problems, or experience a lack of responsiveness," states Nick Simmons, Denchi's Sales Director. "Thanks to ultra-reliable operation and exceptional longevity, our solutions present customers with a far lower total cost of ownership, and that's what really matters. Furthermore, supply continuity and first class engineering support are completely assured."

Jörg Doblaski Takes on the Role of Chief Technology Officer
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xfab.com/news
  • People
  • 2020-07-02

X-FAB Silicon Foundries has announced the appointment of Jörg Doblaski as its Chief Technology Officer (CTO). He fills the role of former CTO Dr. Jens Kosch, who is becoming an X-FAB Fellow and will serve as an adviser to the company's CEO Rudi De Winter. Doblaski joined X-FAB in 2004 and since then has held various positions in engineering and management. Prior to becoming CTO, he was Director of Design Support, and helped to build up the company's extensive portfolio of highly advanced IP. He was also responsible for driving development of X-FAB's feature-rich design kits, which significantly accelerate time-to-market and assure first-time-right implementation. Doblaski has a degree in Electrical Engineering & Information Technology from the Ilmenau University of Technology in Germany. "It is a great honour for me to take on this important role, especially at such a challenging time," Doblaski commented. "In my new post I will continue to advance our technology offering with unique features and best-in-class customer support, delivering innovative products for our customers and enabling long-term mutual success."

Switcher ICs Certified for Automotive Use
  • Product Release
  • 2020-07-01

Power Integrations announced an AEC-Q100-qualified version of its LinkSwitch-TN2 switcher IC for buck or non-isolated flyback applications. Featuring an integrated 750 V MOSFET, the automotive-qualified LinkSwitch-TN2 IC provides simple and reliable power for EV sub-systems connected to the high-voltage bus, including HVAC, climate control, battery management, battery heater, DC-DC converter and on-board charger systems. The surface-mount device requires no heatsink, needs few external components and occupies a very small PCB footprint. The 7 W (flyback) / 360 mA (buck) LinkSwitch-TN2 has a wide input voltage range of 60 VDC to 550 VDC, efficiently supporting the 400 VDC bus commonly seen in electric vehicle applications. The power supply IC provides accurate regulation of better than +/-5% across line voltage, load, temperature and component tolerances. Comments Power Integrations' product marketing manager Edward Ong: "Our automotive switcher ICs reduce size while increasing the reliability and robustness of automotive sub-systems. By supplying auxiliary systems directly from the high-voltage bus with a LinkSwitch-TN2 power supply, automotive engineers can reduce the requirement for the conventional 12 V distributed rail, saving assembly and material cost."

High-Speed Op Amp That Eliminates Oscillation
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rohm.com/news
  • Product Release
  • 2020-07-01

ROHM announced a high-speed ground sense CMOS op amp, BD77501G, optimized for industrial and consumer equipment requiring high-speed sensing, such as anomaly detection systems used in measurement and control equipment along with sensors that work with very small signals. ROHM developed the EMARMOUR series of op amps and comparators that have been well-received in the automotive and industrial markets due to its superior noise immunity that allows users to reduce design resources to address noise issues. This time, ROHM has expanded the lineup by adding a high-speed type ideal for anomaly detection that prevents oscillation over the entire load capacitance range. The BD77501G is an op amp that not only supports high-speed amplification (high slew rate: 10V/us) required in anomaly detection and other systems, but also completely eliminates oscillation caused by load capacitance (i.e. wiring). Unlike conventional high-speed op amps that can become unstable due to load-capacitance-induced oscillation, ROHM's product ensures stable operation with no unwanted oscillation. In addition, whereas the output voltage for conventional products can fluctuate by ±200mV or more across the entire noise frequency band, the BD77501G provides unprecedented EMI Immunity (noise immunity) that limits variation to less than ±20mV (1/10th). This enables high-speed signal amplification without being affected by load capacitance or external noise when installed in the latter stages of sensor applications, improving reliability and reducing design time.

Martin Rausch Appointed as Chief Technology Officer
  • People
  • 2020-07-01

RECOM Power is pleased to announce that Martin Rausch has been appointed to the newly created position of Chief Technology Officer (CTO). Rausch joins RECOM after six years serving as a Managing Director at TGW Mechanics where he managed the development and supply chain locations in Austria, China and the US. Within his professional career, Rausch has completed an MBA, a PhD in electrical engineering, and has held managerial positions at both Siemens and General Electric making him expertly qualified to manage the global development of RECOM's manufacturing sites in Austria, Italy, China Mainland and Taiwan area. As CTO, he will be responsible for overseeing every aspect of product development including research and development, production, quality management, certification, and purchasing, as well as customer support and satisfaction. Martin Rausch (CTO): "We need two things to achieve this goal and go full force with the energy we have at our disposal throughout the RECOM group: Professional organization with people that can take personal responsibility and think in a team, and efficient global processes serving our independent units. This will involve striking a balance between utilizing existing resources to the full and exploring and developing new markets."

Compact Panel Mounted Voltage Measurement
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lem.com
  • Product Release
  • 2020-07-01

LEM introduces the DVC 1000 series of voltage sensors for insulated nominal voltage measurements in rail traction and industrial applications. The DVC 1000 series offers panel mounted voltage measurement in a compact package, measuring only 29 x 51 x 89 mm, giving a total volume of only 131.6 cm3. Designed to measure a nominal voltage of 1000 VRMS, the DVC 1000 series uses an isolating amplifier, providing very high levels of isolation with a safety insulation voltage of 4.2 kV. The use of an isolating amplifier offers significant space savings over other sensors of similar capacity, which use bulky galvanic insulation. As well as being highly robust, the DVC 1000 series also offers high levels of accuracy and temperature stability. An optional DIN rail mounting adaptor makes it easy to integrate into users' own applications. LEM developed the DVC 1000 to be fully compliant with the International Railway Industry Standards (IRIS). Engineers in the railway industry working with both rolling stock and sub-stations can use these versatile new sensors to measure DC links, the output voltages of inverters, the input voltage of 4 quadrant converters, or the battery voltage of Light Rail Vehicles. The features of the DVC 1000 voltage sensors also make them ideal for a broad range of small-to-medium voltage measurements in industrial markets such as DC power supply monitoring, EV chargers and battery storage applications.

Combining Power Grids Business with Digital Technology
  • Industry News
  • 2020-07-01

Hitachi announced that it has completed the procedures for its 80.1% investment in the company operating power grids business that had been carved out from ABB, pursuant to the acquisition agreement signed on December 17, 2018. The new company, Hitachi ABB Power Grids Ltd ("Hitachi ABB Power Grids") was launched and began operation on July 1st, 2020. Under the leadership of Claudio Facchin as CEO and Toshikazu Nishino, Executive Vice President of Hitachi, as Chairman, Hitachi ABB Power Grids will expand Hitachi's energy solutions business globally as a core part of the company's Social Innovation Business. By combining power grids business with Hitachi's digital technologies such as Lumada, Hitachi and Hitachi ABB Power Grids will provide energy solutions spanning the Energy (utilities), Mobility, Smart Life (cities), Industry, and IT sectors. With roots in Hitachi and ABB, the new business will build on more than one century of expertise in pioneering engineering technologies, enabling customers to increase efficiency and maintaining resilience. It will unlock new business models and contribute social, environmental and economic values for a sustainable society. Claudio Facchin, CEO, Hitachi ABB Power Grids, said, "Both Hitachi and ABB Power Grids have a rich legacy in technology and innovation that goes back over a century. Combining world-class power solutions with Hitachi's leading open digital platforms presents us with new market opportunities and enables us to deliver greater customer value across the world."

Silicon Carbide Power Module
  • Product Release
  • 2020-06-30

At its virtual PCIM booth Infineon presented the EasyPACK module with CoolSiC automotive MOSFET technology, a 1200 V half-bridge module with an 8 m?/150 A current rating. The module is based on Infineon's silicon carbide trench MOSFET structure. Compared to planar structures, the trench structure enables a higher cell density, resulting in the best-in-class figure of merit. As a result, trench MOSFETs can be operated at lower gate-oxide field strengths for higher reliability. First-generation CoolSiC automotive MOSFET technology is optimized for use in traction inverters, with a focus on achieving the lowest possible conduction losses, especially under partial load conditions. Combined with the low switching losses of silicon carbide MOSFETs, this enables losses in inverter operation to be reduced by around 60 percent compared to silicon IGBTs. In addition to optimizing performance, Infineon attaches great importance to reliability. The chip manufacturer develops and tests CoolSiC automotive MOSFETs with the aim of achieving high short-circuit, cosmic ray, and gate-oxide robustness, which is key for designing efficient and reliable high-voltage applications in electric cars. The new CoolSiC automotive MOSFET power module is fully qualified to the AQG324 standard.

Communication Without Mask
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we-online.com/news
  • Industry News
  • 2020-06-30

As Würth Elektronik is not able to present new products to customers and interested parties in personal contact at trade fairs due to the Covid-19 pandemic, the manufacturer of electronic and electromechanical components has now set up a virtual exhibition stand (www.we-online.de/virtual). Instead of visiting a trade fair, visitors will find an attractive online presentation of product innovations and the possibility to have a direct conversation in the chat. The Würth Elektronik team offers a creative answer to the current situation with its virtual trade fair stand. Interested developers and manufacturers can use this platform to stay in close, personal contact with the manufacturer. Products are visualized with their technical data and can be discussed with Würth Elektronik specialists in the chat. Component samples and developer support can be requested directly from the virtual booth. Also available: Tools for precise product selection such as the measurement database application REDEXPERT as well as order forms, catalogues and specialist books. As lectures are held at exhibition stands, webinars can be found at the virtual exhibition stand. The current focus topic here is Single Pair Ethernet. Würth Elektronik offers solutions and standard-compliant reference designs that make this copper-saving cabling, which originates from the automotive sector, usable for industrial applications - for example for connecting sensors or as a replacement for other bus systems.

Film Capacitors Operating up to 200°C
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exxelia.com/news
  • Product Release
  • 2020-06-30

Exxelia launches its 253P & 560P product series providing unmatched performances at high temperature. The PTFE 253P series is the most stable 200°C Film capacitor on the market with its unparalleled stability of <2,5% with capacitance from 0.22µF to 1µF under 250VDC to 800VDC. It offers the lowest loss characteristic (T?) of all film technologies less than 0,1% at extreme temperatures (200°C) with excellent life performance in operations. The series offers great resistance to vibrations, shocks and to over voltage making it ideal for Oil & Gas applications as well as Defense and Civil Aviation.

Multilayer Ceramic Capacitor with a Capacitance Value of 1.0µF
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murata.com
  • Product Release
  • 2020-06-30

Murata has developed a multilayer ceramic capacitor with a capacitance value of 1.0µF in the 01005 inch size (0.4×0.2mm), which is increasingly used in a wide range of mobile electronic devices including smartphones. Mass production of the GRM022R60G105M with a rated voltage of 4Vdc has already started and mass production of GRM022R60J105M with a rated voltage of 6.3Vdc is scheduled to begin in 2021. The spread of 5G smartphones and the increasing functionality and miniaturization of wearable devices is stoking the demand for further miniaturization and higher density of electronic circuitry. Among the applications, multilayer ceramic capacitors are essential components of many kinds of electronic devices and are widely used in such devices as smartphones and wearable devices. Given that approximately 900 to 1,100 multilayer ceramic capacitors are installed in a single high-end smartphone, a considerable need exists for capacitors combining smaller size with larger capacity. Since multilayer ceramic capacitors with a capacitance of 1.0µF are widely used in various devices, expanding the adoption of these new products will contribute to the further miniaturization of electronic devices. Thanks to Murata's proprietary thin layer technology for ceramic elements and thin-sheet formation technology, these products have achieved approximately a 35% reduction in footprint and a 50% reduction in volume ratio compared to our existing product with the same capacitance value (015008 inch size). In addition, their capacity has increased by about 2.1 times compared to our conventional product of the same size (01005 inch size).

Single Chip PMU / PMIC ICs
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n-redc.co.jp
  • Product Release
  • 2020-06-29

Ricoh Electronic Devices in Japan has launched two PMU ICs for industrial and consumer purposes. These ICs are a single chip solution and provides four high-efficiency step-down DC/DC converters, seven low-dropout regulators, four GPIOs, an interrupt controller (INTC) and an I2C-Bus interface. The output voltages and the power-on/off sequence settings can be tailored in a profile and saved in a built-in One-Time Programmable (OTP) memory. The RN5T5610 is an industrial version suitable for continuous operation under wide operating temperature conditions whilst the RN5T5612 is designed for consumer applications. The PMUs include custom programmable features by OTP for initial output voltage setting and start-up/shut-down sequencing. A 2-wire I2C bus interface bus, operating at 400kHz or 3.4MHz, provides additional control by register settings such as turning individual output voltages on or off as well as adjusting the DC/DC converter and LDO output voltage levels by a Dynamic Voltage Scaling (DVS) feature. Step-rate for adjusting voltages is 50mV for OTP and 12.5mV for register settings. The PMU ICs distinguishes On, Off and Sleep operating modes, the current consumption varies from Typical 13µA in Off-mode to maximum 440µA in On-mode depending on which outputs are enabled.

Buck-boost Battery Chargers
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news.ti.com
  • Product Release
  • 2020-06-29

Texas Instruments introduced buck-boost battery charger integrated circuits, which integrate power-path management for maximum power density and universal and fast charging at up to 97% efficiency. The BQ25790 and BQ25792 support efficient charging and 10 times lower quiescent current through USB Type-C and USB Power Delivery (PD) ports in small personal electronics, portable medical devices and building automation applications. The BQ25790 and BQ25792 offer the flexibility to charge batteries with one to four cells in a series and up to 5 A of charging current across the full input-voltage range (3.6 V to 24 V) for USB Type-C and USB PD applications. The chargers' integrated dual-input selector supports multiple power sources, including wireless, USB, barrel jack and solar charging, while delivering fast charging – 97% efficiency at 30 W. They deliver 155 mW/mm2 (100 W/in2) of power – up to two times more than competitive devices. Helping engineers reduce solution size and bill of materials (BOM), the new buck-boost chargers are the industry's first to fully integrate the following components: switching metal-oxide semiconductor field-effect transistors (MOSFETs), a battery FET, current-sensing circuits and a dual-input selector. The reduction in component count is particularly valuable for applications such as smart speakers, which are shrinking in size and cost as market adoption increases.

Focus on Larger Battery Formats
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varta-ag.com/news
  • Industry News
  • 2020-06-29

VARTA is driving the further development of its technology with the help of IPCEI funding ("Important Project of Common European Interest"): In addition to the development of the latest generation of small-format lithium-ion cells with even higher energy densities, the funding program will focus on the transfer of the innovative VARTA technology to larger formats. In the future, these battery cells could be used in VARTA energy storage devices, robots, as well as in mobility applications. These new battery formats are to be optimized on a pilot line and transferred to mass production. VARTA is also continuing to invest in research and development activities for battery cells in special formats, which are increasingly in demand for IOT applications, for example. The Federal Ministry of Economics (BMWi) and the states of Bavaria and Baden-Württemberg are supporting the battery industry in Germany and Europe within the framework of an IPCEI. The federal and state governments are providing VARTA AG with funding of up to 300 million euros for the project until the end of 2024. The VARTA Group continues to invest in the expansion of its lithium-ion mass production and will create around 1000 new jobs in Ellwangen and Nördlingen by the end of next year. VARTA is thus strengthening the battery industry, particularly in Baden-Württemberg and Bavaria, and emphasizes its importance as an employer in the region.

Technical Presentations and Panels
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epc-co.com/Events
  • Event News
  • 2020-06-26

The EPC team will be delivering three technical presentations and participating in two panel discussions on gallium nitride (GaN) technology and applications at the upcoming PCIM Europe 2020 Digital Days, July 7 – 8. In addition, the company will participate in the event's virtual exhibit, showing its latest eGaN FETs and ICs in customers' end products that are rapidly adopting eGaN technology. In the virtual exhibit, EPC experts will be available to discuss eGaN devices in several applications including: high performance 48 V DC-DC power conversion for advanced computing and automotive applications; high power nanosecond pulsed laser drivers for lidar used in autonomous vehicles; and precision motor drives for robotics and drones.

100V Half-Bridge MOSFET Drivers for Industrial Applications
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renesas.com/news
  • Product Release
  • 2020-06-25

Renesas introduced the HIP2211 and HIP2210, a pair of 100V half-bridge MOSFET drivers. The HIP2211 is a pin-compatible upgrade to Renesas' ISL2111 bridge driver, while the HIP2210 offers a tri-level PWM input to simplify power supply and motor drive design. The devices are ideal for 48V telecom power supplies, Class-D audio amplifiers, solar inverters, and UPS inverters. They are also rugged enough to power the demanding 48V motor drives found in Li-ion battery-powered household and outdoor products, water pumps, and cooling fans. The HIP221x drivers are designed to work reliably under difficult operating conditions, with the high-speed, high-voltage HS pin tolerating up to -10V continuously and slewing as quickly as 50V/ns. Comprehensive under-voltage protection works in tandem with the HIP2210's programmable anti-shoot-through protection to ensure the driven MOSFETs are not damaged due to power supply or other external fault conditions. Renesas' HIP221x drivers feature strong 3A source, 4A sink drivers with very fast 15ns typical propagation delay and 2ns typical delay matching, making them the optimal solution for high-frequency switching applications. Both the HIP2210 and HIP2211 are designed to complement Renesas microcontrollers in advanced DC/DC and brushless motor drive systems.

International Electron Devices Meeting to be Held Virtually
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ieee-iedm.org
  • Event News
  • 2020-06-24

The organizers of the upcoming 66th annual IEEE International Electron Devices Meeting (IEDM) have decided to hold the conference virtually this year given the ongoing uncertainties posed by the prevailing COVID-19 pandemic. The virtual 2020 IEDM is scheduled for December 12–16, 2020, and both live and recorded sessions will be used to showcase and discuss the world's best original work in all areas of microelectronics research and development. "The IEDM Executive Committee has decided that in the interest of prioritizing the health and safety of the scientific community, a virtual approach is the best option for this year," said Dina Triyoso, IEDM 2020 Publicity Chair and Technologist at TEL Technology Center, America, LLC.

DC Fast Charging Infrastructure is Critical for Adoption of EVs
  • Industry News
  • 2020-06-24

Although the adoption of electric vehicles (EVs) has continued to grow over recent years, some key technology initiatives still are necessary to spur widespread acceptance across a broader range of end-users. One critical element in the development of ubiquitous fast-charging stations that can recharge EVs rapidly so that the consumers' experience is short and easy – much like the way they currently fill a conventional vehicle with fuel. Whereas some industry experts view Level 1 and Level 2 as little more than "glorified wall sockets" most see DC Fast Charging as a true game-changer. DC Fast Charging's significantly faster charge times offer the much-needed technology leap to put longer distance EV driving on a par with conventional fossil fuel fill-ups at traditional gas stations. Consumers will no longer face the prospect of having to wait for hours while their EV is recharged. The target is to have recharging times close to what consumers currently experience for petrol refueling (approx. 5 minutes). The Combined Charging System (CCS) standard uses combo connectors to allow both AC charging and fast DC charging options within the same station. First pioneered in the European Union in 2014, CCS technology has been adopted by SAE and is also gaining wide acceptance in the U.S. CSS is supported by many automotive manufacturers including, BMW, Daimler, FCA, Ford, Jaguar, General Motors, Groupe PSA, Honda, Hyundai, Kia, Mazda, MG, Polestar, Renault, Tesla, and Volkswagen Group. Virtually all industry players agree that widespread deployment of DC Fast Charging will be an important inflection point for spurring the ultimate transition from fossil fuel vehicles to ubiquitous adoption of EVs by end consumers and commercial transportation companies.

Market Monitor: Key Segments for the Power Semiconductor Industry
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yole.fr
  • Industry News
  • 2020-06-24

There has been a remarkable shift of interest in SiC for automotive applications and in GaN for mainstream consumer applications. "These applications will respectively drive the SiC and GaN power device market in the coming years," explains Ezgi Dogmus, Technology & Market Analyst at Yole Développement. And she adds: "In H1-2020, the global COVID-19 outbreak has caused a significant slowdown of various end markets, especially the automotive and consumer segments, and thus has impacted the related power SiC and GaN market revenues." Since the first commercialization of SiC diodes, the power SiC device market has been driven by power supply applications. Nevertheless, automotive is becoming the killer application, following SiC's notable adoption for Tesla's main inverters in 2018. Since then, different Tier 1-component makers, such as ZF and Bosch, and carmaker OEMs like BYD and Renault have recently made announcements on their adoption of SiC technology in some of their products. In the prospering SiC power market, the automotive segment is undoubtedly the foremost driver, and as such will hold more than 50% of total device market share in 2025. In the power GaN landscape, the market research & strategy consulting company Yole confirms a remarkable entry of several players into the high-volume consumer market, notably Power Integrations and Navitas. "For sure, the GaN power market is evolving rapidly," comments Ahmed Ben Slimane from Yole. Many phone OEMs including Oppo, Vivo, Realme, and Meizu opted for GaN based inbox fast chargers, released with their flagships in the beginning of 2020. Samsung, Huawei, and Xiaomi chose GaN for accessory chargers. This represents a first milestone for power GaN devices in a high-volume consumer market.

Discretes in Miniature, Leadless Rugged DFN Packages
  • Product Release
  • 2020-06-23

Nexperia announced the industry's widest portfolio of automotive-qualified discretes in space-saving, thermally-efficient, AOI-compatible DFN (Discrete Flat No leads) packages. The AEC-Q101 range of devices available cuts across all Nexperia's product groups and includes switching, Schottky, Zener and protection diodes, bipolar junction transistors (BJTs), N- and P-channel MOSFETs, resistor-equipped transistors and LED drivers. Automotive qualified discrete leadless packages offered by Nexperia range from the very small form factor DFN1006BD-2 (1 x 0.6 x 0.5 mm) up to DFN2020D-3 (2 x 2 x 0.65 mm), including the recently-released DFN1110D-3 and DFN1412D-3 styles. DFN devices can measure as small as 0.6 mm2 offering a PCB space-saving of up to 90 % when compared to current SOT23 devices. The excellent thermal performance (Rth(j-sp)) allows an equal or better Ptot on the smaller DFN footprint. At the same time these packages stay cooler and improve overall system reliability. The Nexperia DFN package technology supports a Tj capability of up to 175°C. Because automated optical inspection (AOI) is vital for some applications – especially automotive - Nexperia pioneered the development of side-wettable flanks (SWF) for the DFN package in 2010 and devices with SWF are now a proven, accepted solution.

High-Performance Integrated Voltage Regulators (IVRs)
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Learn more:
empowersemi.com
  • Product Release
  • 2020-06-23

Empower Semiconductor announced the EP70xx, a family of power management ICs that will provide significant energy savings in data centers with the single biggest point-of-load power performance disruption in over a decade. With its product platform, the EP70xx, Empower has achieved the total integration of a triple output DC/DC power supply with no external components into a single tiny 5mm x 5mm package, attaining up to 10x higher current density, 3x tighter accuracy during transients, and 1000x faster dynamic voltage scaling than leading competitors. "Customers are excited about the game-changing nature of our technology and the impact it is having on their systems and digital ICs", said Tim Phillips, Chief Executive Officer and Founder of Empower Semiconductor. "The combination of density, speed and efficiency is allowing designers to utilize our products in groundbreaking ways, enabling breakthrough levels of system performance." Empower Semi's patented digitally configurable hardware platform has simplified the adoption of DC/DC converters for designers. With a single footprint, no external components, extensive programmability, a wide range of current and output configurations, power designers can proliferate the EP70xx across nearly all designs and platforms.

Ceramic Capacitors for Automotive Power Trains
  • Product Release
  • 2020-06-23

TAIYO YUDEN announced the commercialization of multilayer ceramic capacitors with an increased maximum operating temperature of 150°C. This product lineup is compatible with AEC-Q200, a reliability test qualification standard for automotive passive components. Available are various types of elemental technologies nurtured to improve the temperature characteristics of X7R (operating temperature range: -55 to 125°C) in the onventional products to X8L (-55 to 150°C). These products are available in a wide assortment of dimensions, from the 1005 size (1.0 × 0.5 mm) to the 3225 size (3.2 × 2.5 mm). The products will be used for decoupling or anti-noise parts in automotive power trains such as engines and transmissions. Production of the multilayer ceramic capacitors commenced at the company's Tamamura Plant (Tamamura-machi, Sawa-gun, Gunma Prefecture, Japan), KOREA KYONG NAM TAIYO YUDEN CO., LTD. (Sacheon-si, Gyeongsangnam-do, Korea) started in May 2020.

Advanced High-Efficiency Power Solutions
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newsroom.st.com
  • Industry News
  • 2020-06-18

STMicroelectronics has launched a web-based ecosystem to help designers build digital-power solutions using STM32 microcontrollers (MCUs). The STM32 D-Power website consolidates developer resources that include the all-in-one STM32 digital-power Discovery Kits, embedded software components, software tools created by ST Authorized Partner Biricha Digital, and dedicated power-supply boards that demonstrate various designs and power ratings. Documentation, videos, and guides cater to beginners up to expert power-supply designers, and a four-day hands-on workshop created by Biricha shows how to build digital power supplies using STM32 MCUs. The ecosystem is scaled to support three levels of STM32 microcontrollers that combine the benefits of industry-standard Arm Cortex-M cores with integrated features optimized for digital-power applications. The entry-level STM32F334, advanced STM32G474, and high-performance STM32H7 series MCUs each contain a flexible high-resolution timer to generate highly accurate pulse-width modulated (PWM) signals for stable control of switched-mode power circuits.

On the Way to Full Car Autonomy
  • Industry News
  • 2020-06-18

The automotive is evolving quickly – new technologies are constantly adding to safety and comfort of the car. This development is strongly user-driven, as the results of a current study conducted by Asahi Kasei Europe and SKOPOS shows. The ongoing CASE (Connected – Autonomous – Shared – Electric) megatrends are currently disrupting the automotive industry. In October 2019, Asahi Kasei Europe conducted a representative survey together with Cologne-based market research institute SKOPOS, interviewing a total of 1,200 car users in Germany, France, Italy and the United Kingdom regarding their preferences relative to mobility and especially to the future automotive interior. The results of the survey show that the customer's decision process when deciding for a new car is growing in complexity. While traditional metrics such as fuel consumption, running costs or driving performance are still key decision factors, the interior including features like acoustic systems and overall advanced driver assistance systems (ADAS) are quickly gaining in importance. "The rising number of ADAS on the street is an essential milestone on the path towards fully autonomous vehicles. Two decades ago, the key problem had been to familiarize drivers with features like adaptive cruise control (ACC) or forward alert. Today the end user is aware of the benefits of such systems. The challenge now is to offer these systems for an affordable price. Radar MMIC (monolithic microwave integrated circuit) chips from Asahi Kasei Microdevices leveraging CMOS (complementary metal oxide semiconductor) technology to support this process of making active safety feature available down to smaller car segments", explains Heiko Rother.

Photovoltaic Array Simulators
  • Product Release
  • 2020-06-18

Keysight Technologies has launched a family of photovoltaic (PV) array simulators that are the first to deliver 2000 V and 20 kW of power in a 3U format, enabling engineers to maximize solar power conversion. To keep solar power at grid parity with competing methods of power generation, performance and power conversion efficiency are critical. Small increments in power production can impact profitability of solar power generation. Engineers need to ensure that their solar inverters can convert maximum power from the connected solar array. However, developing and verifying the performance of inverter maximum power point tracking (MPPT) algorithms and circuits is complex, while testing is difficult, expensive and time consuming. Multiple MPPT inverters provide flexibility for large commercial arrays but create a test challenge as current solutions test one MPPT channel at a time. The Keysight PV8900 Series along with the DG9000A advanced photovoltaic inverter test software goes beyond existing standards, testing up to 12 MPPT channels simultaneously. Keysight's next generation PV8900 series of PV array simulators offer the following features and customer benefits: The highest power density with 20 kW in 3U high that can be paralleled to 200 kW to test string inverters at full power capacity while reducing rack space.

SiC MOSFETs Featuring Low ON Resistance
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rohm.com/news
  • Product Release
  • 2020-06-17

ROHM announces the 4th Generation 1200V SiC MOSFETs optimized for automotive powertrain systems, including the main drive inverter, as well as power supplies for industrial equipment. For power semiconductors there is often a trade-off relationship between lower ON resistance and short-circuit withstand time, which is required to strike a balance for achieving lower power losses in SiC MOSFETs. ROHM was able to successfully improve this trade-off relationship and reduce ON resistance per unit area by 40% over conventional products without sacrificing short-circuit withstand time by further improving an original double trench structure. In addition, significantly reducing the parasitic capacitance (which is a problem during switching) makes it possible to achieve 50% lower switching loss over our previous generation of SiC MOSFETs. As a result, ROHM's 4th Generation SiC MOSFETs are capable of delivering low ON resistance with high-speed switching performance, contributing to greater miniaturization and lower power consumption in a variety of applications, including automotive traction inverters and switching power supplies. Bare chip samples have been made available from June 2020, with discrete packages to be offered in the future.

Capacities for Electro-mobility Chips
  • Industry News
  • 2020-06-17

In view of the long-term growing market demand for power semiconductors for electric cars, Danfoss A/S and Infineon Technologies AG have signed a multi-year volume agreement. Infineon will supply chipsets of IGBTs and diodes to the Danfoss Silicon Power business unit. The chips are mainly used in power modules for inverters that control the motors in electric vehicles. "The market for electro-mobility is picking up noticeably, and the supply industry is getting ready for this," says Claus Petersen, Senior Vice President and General Manager at Danfoss Silicon Power. "For us as a manufacturer of power modules for electric drivetrains, a long-term secure supply of semiconductors is extremely important. With this agreement we can accommodate the high growth expectations of our customers," Petersen concludes. "With electro-mobility, the semiconductor content per car will increase to almost double that of conventional cars. Power semiconductors represent by far the largest part of this additional content," says Peter Schiefer, President of the Automotive Division at Infineon. "The expansion of our manufacturing capacities, for example in Villach, Austria, enables us to establish a long-term cooperation with customers like Danfoss. A reliable and resilient supply chain is crucial for the rapid success of the mobility revolution." Infineon produces the IGBTs and diodes for Danfoss at its plants in Dresden, Germany, and Villach, Austria. Danfoss manufactures its power modules in Flensburg, Germany, and Utica, New York, USA.

Thinpack Aluminum Electrolytic Capacitors
  • Product Release
  • 2020-06-16

First introduced in 2018, Cornell Dubilier Electronics has made significant design tweaks to their THA and THAS Series Thinpack capacitors. The product updates raise the rated life to 5,000 hours, a 66% increase over the first-generation devices. The key strength of the series is still high-energy-density. The 85 °C THA Series Thinpack capacitors are only 8.2mm thick, and 9mm for the 105 ºC THAS Series. While of similar height to V-chip electrolytics, tantalums, and board-mounted axials, THA and THAS offer much higher bulk-storage capability. For example, a single THA/THAS capacitor can replace an entire board full of SMT, axial or radial aluminum electrolytic or solid tantalum capacitance arrays. The upgrade to a 5,000-hour rating expands the potential range of applications to the longer life commercial and MIL/Aero devices. All THA/THAS capacitors sold after January 1, 2020, will meet the new performance specifications. Pricing is unchanged. THA/THAS Series capacitors are thinner and more cost-effective than most alternative technologies. Unlike traditional cylindrical electrolytics, THA/THAS capacitors have sealed, laser-welded aluminum cases to eliminate the need for space-wasting end seal gaskets.

Fixed-frequency Synchronous Buck Regulators
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aosmd.com/news
  • Product Release
  • 2020-06-16

Alpha and Omega Semiconductor introduced AOZ676xDI series of high switching frequency and simple-to-use synchronous buck regulators. AOZ6762DI and AOZ6763DI are capable of delivering 2A and 3A, respectively, and up to 15W output power. The devices offer a low on-resistance power stage and are packaged in a 3mm x 3mm DFN 8-lead package with an exposed thermal pad, allowing cooler power conversion for a variety of consumer and networking equipment such as wireless AP/routers, set-top boxes, cable modems, audio equipment, and LCD TVs. The power stage comprised of two power MOSFETs optimized for efficient synchronous switching to minimize both switching and conduction losses. The devices can achieve > 90% efficiency at full load operation. When operating in low output current conditions, the devices run in a proprietary pulse energy mode (PEM) to achieve high efficiency by reducing switching loss. Under this mode, the regulators can still maintain up to 86% efficiency at 10mA load operation. This feature enables system designers to achieve the low standby power required to meet the "One Watt Initiative."

Gate-All-Around Nanosheet Fabrication Process
  • Industry News
  • 2020-06-15

CEA-Leti has demonstrated fabrication of a new gate-all-around (GAA) nanosheet device as an alternative to FinFET technology targeting high-performance (HPC) applications such as smartphones, laptops, and mobile systems with data collection and processing involving low-power and high-speed operation. Institute researchers fabricated GAA nanosheet transistors with seven levels of stacked silicon channels, more than twice as many as state-of-the-art today, with widths ranging from 15nm to 85nm. The results were summarized in the paper, "7-Levels-Stacked Nanosheet GAA Transistors for High Performance Computing", presented virtually during the 2020 Symposia on VLSI Technology & Circuits. CEA-Leti scientist Sylvain Barraud, one of the authors of the paper, said the seven levels of stacked nanosheet GAA transistors fabricated using a replacement metal gate process, inner spacer and self-aligned contacts show excellent gate controllability with extremely high current drivability (3mA/µm at VDD=1V), and a three-x improvement in drain current over the usual two levels stacked nanosheet GAA transistors. "By increasing the number of stacked-channels, we increase the effective width of the device for a given layout footprint," he explained. "Increasing the effective width induces higher drive current. This is why the DC performance of our devices is better than leading-edge devices."

Call for Technical Session Papers
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Learn more:
apec-conf.org
  • Event News
  • 2020-06-15

APEC 2021 continues the long-standing tradition of addressing issues of immediate and long-term interest to the practicing power electronic engineer. Outstanding technical content is provided at one of the lowest registration costs of any IEEE conference. The Technical Program includes peer-reviewed papers that cover all areas of technical interest for the practicing power electronics professional. The rigorous review process highlights the most innovative technical solutions and provides the highest quality possible and includes papers of broad appeal presented during the lecture sessions and those with a more specialized focus that make up the dialogue sessions. Prospecitve authors are asked to submit a digest explaining the problem that will be addressed by the paper, the major results, and how this is different from the closest existing literature. Papers presented at APEC must be original material and not have been previously presented or published. The principal criteria in selecting digests will be the usefulness of the work to the practicing power electronic professional. Reviewers value evidence of completed experimental work. Authors should obtain any necessary company and governmental clearance prior to submission of digests. If a digest is accepted, authors must submit a final manuscript before the deadline, or the manuscript cannot be published in the Proceedings or presented at the conference. Both the technical paper and its APEC presentation file will be distributed as protected Adobe PDF files (text and graphics copy protected). Submission of your digest serves as your implicit agreement and consent to electronic distribution of your presentation.

Expanding Power Device Business
  • Industry News
  • 2020-06-11

Mitsubishi Electric Corporation announced that it will acquire buildings and land from Sharp Fukuyama Semiconductor Co. The acquired properties will serve as a new site where Mitsubishi Electric's Power Device Works will process wafers for the manufacture of power semiconductors. New production facilities scheduled to start up in November of next year will enable Mitsubishi Electric to expand its power device business. The demand for power semiconductors needed to control electric power with efficiency is rapidly rising in parallel with efforts to conserve energy and protect the global environment through carbon-reduction measures, including the ongoing electrification of automobiles worldwide. To meet this growing demand, Mitsubishi Electric conducted a search for potential new manufacturing sites. As a result, the company has reached an agreement with Sharp Corporation to acquire buildings and land from Sharp Fukuyama Semiconductor.

Simulation and Design of Microgrids and More
  • Product Release
  • 2020-06-11

Powersim is pleased to announce the release of DSIM, a dedicated tool for the simulation of power electronics. Simulation speeds of 100x to 1000x have been documented versus existing offline simulation software packages. One application for DSIM will be the simulation of microgrids and megawatt-level power converter systems. A microgrid can be broadly defined as multiple power converters and generators working together in a system. These systems can consist of one or multiple power converters and generators or larger more complex systems with hundreds of components. Before DSIM, the simulation of individual power converters, such as PV grid interface inverters, was easily performed in a few seconds or minutes. Having multiple power converters would dramatically increase the simulation time from a few seconds to hours or days. This dramatic increase in simulation time requires the abstraction of complexity and simplification of models. Whenever a simplified model is used, there is a loss of fidelity in the results. DSIM allows more accurate models to be used and in most cases still simulates faster than the simplified models with the traditional simulation tools. The results from DSIM simulations have been verified against hardware prototypes and have been published in peer-reviewed papers and journals. Initial testers of DSIM have also verified its results with hardware and other offline simulation software.

Isolated High-Power Shunt Modules
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riedon.com/blog
  • Product Release
  • 2020-06-10

Riedon is set to redefine the current measurement landscape with the introduction of its SSA Smart Shunt series. These next-generation current sensing modules combine the attributes of conventional passive shunt resistors with those normally associated with considerably more expensive and bulky closed-loop Hall Effect current sensors. Each featuring a built-in precision amplifier, they offer reinforced electrical isolation (up to 1500VDC), alongside industry-leading levels of stability and accuracy. SSA Smart Shunt units exhibit ±0.1% sensing accuracy and ±0.1% linearity over their entire current range, with far less susceptibility to temperature drift. The need for routine calibration can therefore be negated. They also have a rapid response time of less than 1.5µs. With an amplified analog output and integrated protection, these current sensors can be placed on either the high or low side of a circuit, thereby enabling easy integration. Their temperature range spans between -40°C and 125°C. Riedon plans to offer a digital output as well, through I2C, RS232, Modbus and CAN interfaces (thus suiting both industrial and automotive installations).

Expert to Present at ICEPT
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indium.com/news
  • People
  • 2020-06-10

Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, will share his industry expertise during the 21st International Conference on Electronic Packaging Technology (ICEPT), Aug. 12-15 in Guangzhou, China. The demand for faster, more powerful devices in the electronics industry makes thermal management a high priority as the need for improved high-performance materials continues to grow. While common thermal interface material (TIM) solutions like thermal grease, thermal gel, solder preforms, and liquid solder all have their own benefits, they can also be subject to common reliability issues like outgassing, voiding, and pump-out. In "Versatile TIM Solution with Chain Network Solder Composite", Dr. Lee examines the development of a novel TIM solution with a high-melting Cu chain network that prevents these defects.

650 V Gallium Nitride (GaN) Technology
  • Product Release
  • 2020-06-10

Nexperia has announced a range of GaN FET devices featuring next-gen high-voltage GaN HEMT H2 technology in both TO-247 and the company's proprietary CCPAK surface mount packaging. Devices achieve superior switching FOMs and on-state performance with improved stability and simplify application designs thanks to their cascode configuration which eliminates the need for complicated drivers and controls. The GaN technology employs through-epi vias, reducing defects and shrinking die size by around 24%. RDS(on) is also reduced to just 41 mΩ (max., 35 mΩ typ. at 25°C) with the initial release in traditional TO-247, with high threshold voltage and low diode forward voltage. The reduction will further increase, to 39 mΩ (max., 33 mΩ typ. At 25°C) with CCPAK surface-mount versions. Because the parts are configured as cascode devices, they are also simple to drive using standard Si MOSFET drivers. Both versions meet the demands of AEC-Q101 for automotive applications. Dilder Chowdhury, Nexperia's GaN Strategic Marketing Director commented: : "Customers need a highly-efficient, cost-effective solution for high power conversion at 650 V and around the 30-40 mΩ RDS(on), where applications include on-board chargers, DC/DC converters and traction inverters in electric vehicles, and industrial power supplies in the 1.5-5 kW range for titanium-grade rack mounted telecoms, 5G and datacenters."

Array Family for Superior Circuit Protection
  • Industry News
  • 2020-06-09

Microchip Technology announced its newly-expanded portfolio of Transient Voltage Suppressor (TVS) vertical arrays – the MDA3KP Transient Voltage Suppressor (TVS), a 3kW diode family of more than 25 products with different screening levels, polarities and qualification standards. Microchip's MDA3KP TVS diode array family – the only available technology offering a comprehensive voltage range tested to a high reliability standard and qualified based on the MIL-PRF-19500 JANTX level equivalence standard – provides an integrated multi-diode solution. These voltage-clamping devices provide fast-reacting Avalanche Breakdown Diode (ABD) features that divert excess current around sensitive components to protect them from electrical overstress. "Digital controls, logic and diagnostic system circuit blocks require highly reliable, secure current and power protection to ensure operations in extreme environments," said Leon Gross, vice president of Microchip's Discrete Product Group business unit. "This diode family also addresses the challenges system designers face with a more efficient vertical construction and requirement for less board space than other devices."

Ac-Dc Power Supplies for Medical & Dental Applications
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cui.com/news
  • Product Release
  • 2020-06-09

CUI announced the addition of four high-density ac-dc power supply series to its medical product family. The VMS-450B, VMS-450B-CF, VMS-450B-CFS, and VMS-450B-CNF offer 450 W of continuous power from compact chassis mount packages. These ac-dc supplies have been designed for space-constrained medical and dental applications where reliability and regulatory compliance are major concerns. The VMS-450B, VMS-450B-CF, VMS-450B-CFS, and VMS-450B-CNF comply with the medical 60601-1 edition 3.1 safety standards for 2 x MOPP applications and 4th edition EMC requirements. These internal medical power supplies additionally offer 5 Vdc AUX output, power factor correction, and over temperature, over voltage, over current, and short circuit protections. With an industry standard 3" x 5" footprint and an open frame package, the VMS-450B is ideal for applications with less space and heat management outside of the unit. The VMS-450B-CF, VMS-450B-CFS, and VMS-450B-CNF come in a metal case with various fan configurations for ultimate flexibility.

Distributor and Sales Rep Firm of the Year
  • Industry News
  • 2020-06-09

Power management company Eaton announced TTI as Distributor of the Year in its annual Electronics Distribution Industry Awards for their excellence as a top performing partner and for providing exceptional service and revenue growth. Kruvand Associates is awarded Sales Rep Firm of the Year. The electronics industry faced a very challenging 2019 but TTI and Kruvand's commitment to driving revenue growth, service and field engagement have earned them Eaton's top honor in the electronics industry. TTI is receiving this honor as Distributor of the Year for the seventh consecutive year. "We are honored to recognize TTI and Kruvand for their hard work and commitment to servicing the electronic component industry," said John Janis, VP and general manager, Electronics Division at Eaton. "At Eaton, we partner with companies that share our values. TTI has been a key channel partner and Kruvand an integral sales firm helping drive profitable sales growth as we provide innovative solutions for a growing customer base."

Head of External Communications
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infineon.com/press
  • People
  • 2020-06-08

Susanne Kochs is taking over as Head of External Communications at Infineon Technologies. She succeeds Bernd Hops, who took over as Corporate Vice President Communications and Public Affairs & Associations at the start of this year with global responsibility for internal, external and political communications. Susanne Kochs will report to him in her new position. The psychology graduate was previously a member of the Executive Board of Ketchum Germany and at the same time managed the company's Munich agency. Susanne Kochs has more than 20 years' experience in corporate and strategic brand communications. In her career she has worked for well-known B2C and B2B companies from many different branches of industry and advised them primarily in integrated campaign development. In addition to Ketchum, she has also held positions at the international communications agencies Edelman and Emanate.

Silicon Catalyst Ecosystem
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newsroom.st.com
  • Industry News
  • 2020-06-08

Silicon Catalyst and STMicroelectronics jointly announce that ST has joined Silicon Catalyst as both a Strategic and In-Kind Partner. As a Strategic Partner, the collaboration provides STMicroelectronics with early access to review and help select the early-stage silicon start-ups seeking to participate in the Silicon Catalyst Incubator. The initial focus of the In-Kind collaboration will be MEMS sensors and actuators. "Innovation through silicon is driving advancements in technology. Hardware development is challenging, which is why Silicon Catalyst plays a key role in enabling silicon start-ups to develop their technology and fueling the new cycle of semiconductor innovation," said Kirk Ouellette, Vice President Strategic Marketing and Strategy Development, STMicroelectronics. "ST has a strong collaborative R&D and industrialization culture, which makes a perfect fit with Silicon Catalyst. As both a Strategic and In-Kind Partner, ST looks forward to providing guidance and resources for start-up partners as well as gaining access to cutting-edge silicon innovation."  Silicon Catalyst has created a unique ecosystem to provide critical support to semiconductor hardware start-ups, including tools and services from a comprehensive network of In-Kind Partners (IKPs) to dramatically reduce the cost of chip development. In its fifth year of operation, Silicon Catalyst has reviewed over 300 early-stage companies and has now admitted a total of 31 start-ups into the incubator.

U.K. Operation Changes Name
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zeroamp.eu
  • Industry News
  • 2020-06-08

Microchip Technology Inc. has changed the name of its ultra-low-power computing and memory operation in Caldicot, Wales, from Microsemi Semiconductor Ltd. to Microchip Technology Caldicot Ltd. The organization is the lead partner in the ZeroAMP Project, an industry-driven initiative funded by the Horizon2020 EU Research and Innovation Program that is focused on developing ultra-low power computing and memory solutions using nanomechanical switches that survive extreme environments. The ZeroAMP Project's goal is to develop nanoelectromechanical relay-based field-programmable gate arrays (FPGAs) with integrated non-volatile memory that can work at temperatures up to 300°C with zero current leakage and standby power. Microchip is one of several companies and other organizations collaborating on technology that will build on the past work of consortium partners and incorporate novel materials, switch designs, circuit techniques and advanced 3D stacking. The Project is targeting electronic solutions that unlock the full power of the IoT, aid cryogenic Quantum computing, wirelessly log temperatures deep in industrial processes and advance technologies such as electric vehicles that reduce dependency on fossil fuels.

Webinar: Voltage-Mode or Current-Mode Control?
  • Industry News
  • 2020-06-08

There is a never-ending discussion about the relative merits of voltage-mode and current-mode control. Issues of output impedance, loop gains, load and line response can paint a very confusing picture if you read everything in the literature. The recent acceleration of switching frequencies to the MHz range has reignited the debate. In the real world of designing converters, the answer is very straightforward, and we will reveal that in this webinar.

Cooperation on Silicon Carbide Power Solutions
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rohm.com/news
  • Industry News
  • 2020-06-04

The powertrain business area of Continental Vitesco Technologies and ROHM Semiconductor have recently signed a development partnership, beginning in June 2020. Vitesco Technologies will use SiC components to further increase the efficiency of its power electronics for electric vehicles (EV). Through their higher efficiency SiC semiconductors make better use of the electric energy stored in a vehicle battery. Thus, an EV has a longer range, or the battery cost can be reduced without impacting the range. "We are looking forward to the future cooperation with Vitesco Technologies", says Dr. Kazuhide Ino, Corporate Officer, Director of Power Device business unit at ROHM Co.,Ltd. "We are the leading company in SiC power semiconductors and have achieved a significant technological lead in this field along with the provision of power solutions combined with gate driver ICs. Together with Vitesco Technologies we want to further improve the energy efficiency of the electronic system in EVs to use the full potential of the SiC technology for a sustainable mobility."

Intersolar Award 2020
  • Event News
  • 2020-06-04

High-performance solar modules, innovative cell technologies and powerful inverters are among the pioneering products that have made it to the final round of the Intersolar AWARD 2020. The renowned prize honors pioneering technologies for the solar industry. The winners and their innovations will be presented to the market and an audience of international experts on a virtual stage on June 30, 2020. Despite the cancellation of Intersolar Europe 2020 and the postponement of Intersolar South America 2020 due to COVID-19, entrepreneurs will still receive the solar industry's flagship award, the Intersolar AWARD, for their pioneering solar technologies. This year, the award ceremony will be held online on June 30 – along with the ceremonies for the ees and The smarter E AWARD. The winners set trends and motivate the industry to shape the energy future with groundbreaking innovations.

Robust Connection for Power
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we-online.com/news
  • Product Release
  • 2020-06-04

WR-FAST Fast Connection is the name of a series of THT-configurable male connectors for accommodating single wires with blade receptacles - for example in household appliances. The connectors are available in various blade designs, orientations and dimensions and are intended for current flows up to 16 A and working voltages up to 300 V. Straight or angled contacts in various numbers are available - for the common 6.3 mm blade receptacles but also for the 2.8 mm version. For the latter, the 2863-type WR-FAST connectors are used: the forked blades can accommodate both types of blade receptacles. WR-FAST is designed for operating temperatures from -30 to +120°C. The connectors have passed glow wire testing according to IEC 60335-1 and meet flammability class UL94 V-0. They also have cULus approval. The WR-FAST connector series is now available from stock without a minimum order quantity. Würth Elektronik also offers a Design Kit Interface with free refill service for this product group.

Automotive Electronics Assembly and Packaging Webinar
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indium.com/news
  • Event News
  • 2020-06-04

Indium Corporation's Andy Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will host an automotive electronics webinar as part of Indium Corporation's InSIDER Series on Webex at 8 a.m. and 2:30 p.m. EST on Tuesday, July 28. Over the last decade, the evolution of the automobile has been faster than ever before, and the 2020s promise even more rapid progress. The foreseen changes include the nature of car ownership, how the car is powered, increased safety, and driver automation. Each of these changes is only possible with advances in electronics hardware and systems, electronics assembly, and semiconductor packaging. In "What's Driving: Automotive Electronics Assembly and Packaging", Dr. Mackie will discuss the impact of these changes on electronics assembly and packaging, and the impact of mission profiles on component and system level reliability. A live Q&A session will immediately follow his presentation. Indium Corporation's InSIDER Series is a free program designed to deliver expert technical content, share industry knowledge, and promote professional growth using a virtual platform.

DC/DC Converter with 5kVAC Reinforced Isolation
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tracopower.com
  • Product Release
  • 2020-06-03

TRACO Power's 1 Watt, TRV 1M series of High Isolation DC/DC Converter in a compact SIP-9 package provide 5kVAC I/O isolation with reinforced insulation for both medical and industrial applications. The series consists of 28 models offering a choice of 4.5-5 / 9.6-14.4 / 12-18 / 19.2-28.8 Vin ranges and single / dual outputs from 3.3V – 15V. With continuous short circuit protection and low leakage current of less than 2 µA, these converters are especially suited to protect any connected interfaces or applied parts to patients. Featuring semi-regulated outputs, -40 to +85°C operating temperature without derating and certifications according to IEC/EN/ES 60601-1 3rd ed. for 2xMOPP and IEC/EN/UL 62368-1, this series is suitable for many different applications where high isolation and reinforced insulation with short circuit protection is critical. Products are in stock and available through distributors around the globe with manufacturing lead times of 12-14 weeks.

Open Frame AC/DC Power Supplies
  • Product Release
  • 2020-06-03

RECOM announces the launch of its RACM60-K series of 60W AC/DC power supplies. RECOM is adding the RACM60-K series to its range of open-frame AC/DC power supplies. The low-profile 2" x 3" design features 90% efficiency across its load range, enabling full-power operation from -40°C to +55°C without forced cooling, and up to +85°C with derating or forced air. Input range is universal 80-264VAC and outputs available are 5V, 12V, 15V, 24V, 36V and 48V. The parts are suitable for a wide range of applications with EN 62368-1, IEC 61558-1/-2-16 and IEC/EN 60335-1 certifications for ITE/audio-visual, industrial and household use respectively up to 5000m operating altitude. Medical safety and EMC certifications meet ANSI/AAMI/IEC/CSA 60601-1 for 2x MOPP with an isolation of4kVAC/1 minute suitable for B and BF applications up to 4000m operating altitude. Class B EMC standards are also met in installation class II or class I PELV with grounded output. The RACM60-K series features full protection against short-circuits, output over-voltage, over-current and over-temperature and has line and neutral fusing for medical applications. No-load input current is only 100mW typical at 230VAC. Various mounting options are available: Molex connectors for wired installation, wave-solder pins for direct PCB mount with built-in stand-offs and a 2" x 4" footprint for legacy design compatibility. A cover is available for the 2" x 4" option.

IWIPP Call for Papers
  • Event News
  • 2020-06-03

IWIPP 2021 will be held April 28-30th, 2021, on the campus of Aalborg University, in Aalborg, Denmark. IWIPP is a growing and successful power technology workshop with excellent speakers and networking opportunities. The contents of IWIPP 2021 will include a set of keynote addresses from leading experts, a broad range of technical sessions, as well as a complement of technical tutorial sessions, all of which are included in the registration fee.  The International Workshop on Integrated Power Packaging (IWIPP) brings together industry, academic and government researchers in the field of power electronics components, electrical insulating materials, and packaging technologies to facilitate and promote the development and commercialization of high-density and high-efficiency power converters. Invited presentations and contributed papers will range from core materials technology and components to power converters. Presenters will address important challenges and present solutions to increase reliability and manufacturability while targeting improved performance and reduced system cost. 

Sri Lankan Manufacturing Facility
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Learn more:
etalgroup.com
  • Industry News
  • 2020-06-03

ETAL Group announced the relocation and expansion of its Sri Lankan manufacturing facility, thanks to the increased demand and growth that the company has experienced. The new site in Piliyandala commenced operations in the first quarter of 2020, following transfer of production from its Rathmalana facility. The purpose designed and fully air-conditioned factory provides room for further expansion, with no disruption to customer service, and offers them a valuable alternative source for volume production of magnetic components outside of China. As with all ETAL Group manufacturing facilities, following the relocation, ETAL Group Pvt Ltd remains fully certified to ISO 9001, 14001 and 45001. Commenting, Scott Robinson, General Manager of ETAL Group Pvt Ltd who has managed ETAL's operations in Sri Lanka for over 20 years said, "Our exciting new facility provides us with the infrastructure to produce higher volumes and the space to add to our existing capabilities going forward. Its opening is a just reward for our dedicated team of employees, many of whom have been with us since the conception of the company. Currently we employ 250 workers in Sri Lanka and have the additional space required to more than double this, meeting growing demand for our consistently high-quality products."

High-Density Packaging Technology
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Learn more:
newsroom.kemet.com
  • Product Release
  • 2020-06-02

KEMET Corporation continues to strengthen its power conversion solutions by extending its popular KC-LINK range using KONNEKT high-density packaging technology to meet the growing demand for fast-switching wide bandgap (WBG) semiconductors, EV/HEV, LLC resonant converters, and wireless charging applications. This technology combines KC-LINK's robust and proprietary C0G Base Metal Electrode (BME) dielectric system with KONNEKT's innovative Transient Liquid Phase Sintering (TLPS) material to create a surface mount multi-chip solution well-suited for both high-density packaging and high-efficiency applications, producing up to four times the capacitance compared to a single multi-layer ceramic capacitor. High mechanical robustness allows KC-LINK capacitors with KONNEKT to be mounted without the use of lead frames. This design provides extremely low effective series inductance (ESL), increasing the operating frequency range and allowing for further miniaturization. Available in commercial grade with tin termination finish, this series is Pb-Free, RoHS and REACH compliant. Capacitors utilizing KONNEKT technology have the unique ability to be mounted in a low-loss orientation to increase their power handling capability further. Combining KEMET's revolutionary Class 1 C0G dielectric system with KONNEKT technology offers a low-loss, low-inductance package capable of handling extremely high ripple currents with no change in capacitance versus DC voltage and negligible change in capacitance versus temperature. Designed for an operating temperature range up to 150°C, the capacitor can be mounted close to fast switching semiconductors in high power density applications, which require minimal cooling.

Program and Registration Online
  • Event News
  • 2020-06-02

This year, the "PCIM Europe digital days" will be taking place as a virtual event from 7 – 8 July 2020. As ever, the event will cover innovations and developments in the field of power electronics. Participants can learn more about the latest trends in power electronics with the high-caliber lecture program online. For participants, a total of more than 250 video-on-demand presentations and interactive live discussions will be available free of charge. They can also inform themselves about product innovations from more than 50 participating companies. Over two days, the online conference program features numerous outstanding short presentations from international experts from industry and academia and deals with key development trends in power electronics. Taking part in the "PCIM Europe digital days" 2020 is free of charge for users; companies can participate in the event in the form of a digital exhibitor profile, through sponsoring or by providing a presentation on-demand. More than 50 companies have already confirmed their participation in the "PCIM Europe digital days", including industry leaders such as Infineon, Rohm Semiconductor, Mitsubishi Electric, Varta and Wolfspeed.

Expanding eCommerce Footprint
  • Industry News
  • 2020-06-02

Monolithic Power Systems announced that the company is entering into a distribution agreement with Farnell Electronics. This partnership will give customers access to MPS's extensive portfolio of high-performance, highly integrated power solutions in industrial applications, telecom infrastructures, cloud computing, automotive, and consumer applications. MPS's patented technologies integrate the maximum number of components into a single package, providing an entire power system in one device and accelerating customers' time to market. Farnell Electronics has a comprehensive product portfolio that is supported by an international supply chain with six distribution centers across the world and local transaction websites in 43 countries. This distribution agreement will allow MPS to leverage Farnell's experience and global presence to provide extensive power product offerings to customers of all sizes. "We are excited to partner with Farnell Electronics," says Maurice Sciammas, Senior VP of Sales & Marketing. "I am confident that with Farnell's two million plus customer contacts, and their excellent engineering community, they will expand MPS's growth in EMEA and APAC." Lee Turner, Global Head of Semiconductors and SBC for Farnell says, "MPS is a true innovator in the semiconductor market, and this new agreement allows us to deliver the highest quality power solutions to customers in industrial, telecom, cloud, automotive, and consumer applications whilst further bolstering Farnell's global power portfolio."

Global Franchise Agreement
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richardsonrfpd.com
  • Industry News
  • 2020-06-01

Richardson RFPD announced that it has entered into a global franchise agreement with AVX Corporation. AVX's newest division, AVX RF Solutions, manages and works to expand the already extensive portfolio of leading-edge microwave and RF components. AVX RF Solutions encompasses AVX's RF products along with RF products from two additional AVX brands-American Technical Ceramics and Ethertronics. The global agreement between Richardson RFPD and AVX covers the products managed by the AVX RF Solutions division, as well as AVX's power film capacitors and SuperCapacitors. The primary product lines covered by the new agreement include antennas, capacitors, couplers, crossovers, filters and inductors. "We are excited about the technology and solutions that AVX represents," said Rafael R. Salmi, Ph.D., Richardson RFPD's president. "These products are an excellent fit for our customers, and we look forward to building on our long-time success working with American Technical Ceramics." "We believe that our history of developing highly engineered products is a good match for Richardson RFPD's longtime dedication to building teams of specialized engineers," said Alex Schenkel, senior vice president, global sales. "We look forward to mutual successes extending across the automotive, consumer, telecommunications, military, and aerospace market segments."

Isolated Power Transceivers
  • Product Release
  • 2020-06-01

Analog Devices, Inc. introduced the ADM2867E series of reinforced iCoupler isolated RS485 + integrated isolated dc-to-dc converters. These parts provide low radiated emissions and enable solutions that meet EMC compliance with fewer board spins and budget overruns. The transceivers' simplified PCB layout and small SOIC form factor pack more functionality into space constrained applications than the previous generation as well as current products offered by competitors. This isolated RS485 + integrated isolated power transceiver series includes smart features that reduce end system install and debug time allowing for easy correction of installation-based connection errors. With the trusted safety of iCoupler digital isolation and IEC 61000-4-2 ESD, signal integrity is maintained in the harshest of environments.

MOSFET for High Voltage Auxiliary Power Supplies
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infineon.com/press
  • Product Release
  • 2020-05-29

Infineon Technologies complements its CoolSiC MOSFET offering with yet another voltage class. Having added 650 V to the portfolio earlier this year, the company is now launching the 1700 V class with its proprietary trench semiconductor technology. Maximizing the strong physical characteristics of silicon carbide (SiC), this ensures that the new 1700 V surface-mounted devices (SMD) offer superior reliability, as well as low switching and conduction losses. The CoolSiC MOSFETs 1700 V are targeting auxiliary power supplies in three-phase conversion systems such as motor drives, renewables, charging infrastructure and HVDC systems. Such low-power applications usually operate below 100 W. In these cases, designers very often prefer a single-ended flyback topology. With the new CoolSiC MOSFETs 1700 V in SMD package, this topology is now even enabled for DC-link connected auxiliary circuits up to 1000 V DC input voltage. High efficiency and high reliability auxiliary converters using a single-ended flyback converter can now be implemented in three-phase power conversion systems. This leads to smallest footprints and a reduced bill-of-materials. "Trench technology of a CoolSiC MOSFET balancing performance and reliability in operation is now available for 1700 V", said Dr. Peter Friedrichs, Senior Director SiC at the Industrial Power Control Division of Infineon. "It combines the best of SiC properties: low losses with small footprint, in a high voltage SMD package. This helps our customers to significantly reduce the complexity in their auxiliary power supplies".

Non-Isolated, Buck-Boost DC-DC Converters
  • Product Release
  • 2020-05-28

TDK Corporation announces the introduction of the i7C series of 8A 300W rated non-isolated DC-DC converters, packaged with the industry standard 1/16th pinout. The output voltage of these step-up and step-down converters can be adjusted from 9.6 to 48V and accept a wide range input voltage of 9 to 53V. The converters seamlessly transition from buck to boost mode operation without disruption in performance. The i7C 8A series can be used to derive additional high-power outputs from a 12V, 24V, 36V or 48V DC power supply, at a much lower cost than isolated DC-DC converters. With efficiencies of up to 97%, these compact products are ideally suited for use in medical, communications, industrial, test and measurement, broadcast and portable battery powered equipment. During light load conditions, the i7C's control circuitry significantly reduces power consumption. At zero load, the input current draw is typically just 5mA, which can be reduced to around 0.25mA when the remote on-off is used to put the converter into standby. This extends the time battery powered equipment can remain functional, during periods of non-peak operation. Three mechanical configurations are available, measuring just 36.8mm wide and 34mm in length.

EMV 2021: Call for Workshops
  • Event News
  • 2020-05-28

Experts from industry and science will have the opportunity to submit topics for the practice-oriented workshops at the EMV 2021. This allows their industry-specific knowledge to be passed onto a qualified expert audience. The workshop program will be compiled in September by a twenty-member committee, headed by Professor Dr.-Ing. Marco Leone from the Otto-von-Guericke University Magdeburg. Speakers are able to benefit from valuable contacts in the workshops and trade fair, at which exhibitors from all over the world will present their latest products, innovations and services on electromagnetic compatibility. "The EMV 2021 in Stuttgart offers experts in this field a unique opportunity to present theoretical and practical knowledge in a target-oriented manner and to establish new contacts", commented Prof. Dr.-Ing. Marco Leone.

300W Non-isolated, Buck-boost DC-DC Converters
  • Product Release
  • 2020-05-28

TDK Corporation announces the introduction of the i7C series of 8A 300W rated non-isolated DC-DC converters, packaged with the industry standard 1/16th pinout. The output voltage of these step-up and step-down converters can be adjusted from 9.6 to 48V and accept a wide range input voltage of 9 to 53V. The converters seamlessly transition from buck to boost mode operation without disruption in performance. The i7C 8A series can be used to derive additional high-power outputs from a 12V, 24V, 36V or 48V DC power supply, at a much lower cost than isolated DC-DC converters. With efficiencies of up to 97%, these compact products are ideally suited for use in medical, communications, industrial, test and measurement, broadcast and portable battery powered equipment. During light load conditions, the i7C's control circuitry significantly reduces power consumption. At zero load, the input current draw is typically just 5mA, which can be reduced to around 0.25mA when the remote on-off is used to put the converter into standby. This extends the time battery powered equipment can remain functional, during periods of non-peak operation. Three mechanical configurations are available, measuring just 36.8mm wide and 34mm in length. The 12.2mm high open frame model is most suitable for applications requiring a very low profile. A baseplate version for conduction cooling to a cold plate is 13mm high, or models with an integral heatsink for convection or forced air cooling are 24.9mm high.

Know-how and Expertise in Linz
  • Industry News
  • 2020-05-28

DICE (Danube Integrated Circuit Engineering) is now operating under the name Infineon Technologies Linz. As a second major development in May, the company also moved into its new research building despite the current Covid-19 challenges. After Infineon Austria had acquired all shares in the associated company, DICE GmbH & Co KG in Linz last year, the next forward-looking step was taken by renaming the company Infineon Technologies Linz GmbH & Co KG. The new name creates an ever-stronger link between the know-how and expertise of the Linz-based team and the power of the Infineon brand, and increases visibility at regional, national and international level. "The Development Center in Linz has become the global center of competence in high-frequency technologies within the Infineon Group and is of strategic importance for us", says Sabine Herlitschka, CEO Infineon Austria. "It is here that the key technologies for mobile radio applications and driver assistance systems for autonomous driving are developed. Increasing digitization through the Internet of Things and 5G technology applications will lead to a further increase in the demand for the excellent high-frequency innovations from Linz." The relocation to the new company building in Donaufeldstrasse 5 in Linz will be finalized by the end of May. The property developer completed the four-storey building with a floor space of 9,630 sqm on schedule after a 12-month construction period with every pandemic health precaution in place.

Fixed-resolution and FlexRes Oscilloscope
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picotech.com
  • Product Release
  • 2020-05-27

The PicoScope 6000E Series compact 4+16 channel MSOs deliver cost-effective test and debugging solution for engineers, developers and scientists. Pico Technology has expanded its PicoScope 6000E Series oscilloscopes with the launch of three 4-channel models, each of which can be configured with 16 optional digital channels. With bandwidths of 300 or 500 MHz, 8-bit or 8/10/12-bit Flexible Resolution and up to 4 GS deep capture memory, these products enhance the existing PicoScope 6000E portfolio, adding to the 8-channel models that were introduced earlier in the year. The expansion of the PicoScope 6000E Series is an exciting development as it addresses mainstream test engineering requirements that are faced by engineers developing next-generation embedded systems.

Chief Executive Officer
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media.nxp.com
  • People
  • 2020-05-27

NXP Semiconductors announced that at its Annual General Meeting of Shareholders ("AGM"), shareholders overwhelmingly approved the appointment of Kurt Sievers as an executive director and the company's Chief Executive Officer, effective immediately. In this capacity Mr. Sievers will also remain President of NXP, a role he has held since 2018. As previously announced, Richard "Rick" Clemmer, who previously led the company for 11 years, will remain a strategic advisor to NXP. "I am truly humbled and honored to have been granted the opportunity to lead this fine company – a company that I am proud to have been with since our founding in 2006," said Kurt Sievers. "While we face unprecedented times, I remain confident in our winning strategy to develop and profitably grow market leading and highly differentiated businesses, and continue to foster a culture of innovation and collaboration. I look forward to continuing to work alongside the very best and brightest team and I am committed to ensure the safety and well-being of each and every one of our employees as we weather the pandemic. I could not be prouder of how we have adapted and stayed focused in these times, and I am confident that we will emerge from this stronger, leading NXP into its promising future."

200kW, 250kW and 300kW Inverter Reference Designs
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richardsonrfpd.com
  • Product Release
  • 2020-05-26

Richardson RFPD, Inc. announced the in-stock availability and full design support capabilities for three inverter reference designs from Wolfspeed, a Cree Company. The 200 kW CRD200DA12E-XM3, 250 kW CRD250DA12E-XM3 and 300 kW CRD300DA12E-XM3 three-phase inverters enable more than twice the power density of comparable silicon-based designs, with greater than 98% efficiency. Switching frequency is set by the user, up to 80 kHz. The CRD200DA12E-XM3, CRD250DA12E-XM3 and CRD300DA12E-XM3 use the CAB400M12XM3, CAB425M12XM3 and CAB450M12XM3 modules, respectively, as well as the CGD12HBXMP gate driver. These reference designs demonstrate the best-in-class system-level power density and efficiency obtained by using Wolfspeed's new XM3 power module platform. The XM3 power module platform is optimized for SiC MOSFETs in a high-density, low-inductance footprint, which reduces system-level losses and simplifies the overall system design. Applications include high-power density new product development, high-frequency converters, vehicle traction inverters, active front ends, uninterruptible power supplies, industrial motor drives, energy storage, grid-tied distributed generation (solar and wind), and smart-grid and flexible AC transmission systems. To find more information or to purchase these products online, visit the XM3 Module Platform webpage.

Partnership Agreement Signed
  • Industry News
  • 2020-05-25

Foxy Power, Berlin, Germany-based Strategy, Business Development, and Sales company with its unique Product Value Maximization approach is proud to announce its partnership with IQ evolution. IQ evolution is an Aachen, Germany based manufacturer of 3D-printed liquid cooled heatsinks; enabling thinner, ultra-light weight, high performant cooling in applications such as EV’s, Aviation and others where limited size and volume, highest power density, highest efficiency, and low weight are key. “IQ Evolution nickel based cooler are already established in the high power Laser market”, says Dr. Ebert, CEO and Founder of IQ Evolution“ and signing Foxy Power as our strategic partner for Business development and Sales will enable us to expand into various power electronic applications.” “The stainless steel heatsinks enable a cooling performance greater than 150W/cm² and in collaboration with RWTH Aachen a 20kW converter was demonstrated achieving a world record of 100kW/l or 33kW/kg”, adds Christopher Rocneanu, CEO and founder of Foxy Power GmbH. IQ evolution technology starts where conventional liquid cooling technology resigns.

VLSI Technology & Circuits Celebrates its 40th Year with a Virtual Conference  
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vlsisymposium.org
  • Event News
  • 2020-05-22

The 2020 Symposia on VLSI Technology & Circuits will celebrate its 40th year the premier international conference on VLSI semiconductor technology and the applications they enable. Held for the first time as a virtual conference due to concerns over the global COVID-19 pandemic, the Symposia is organized around the theme “The Next 40 Years of VLSI for Ubiquitous Intelligence,” and will be held on a fully-overlapping schedule online from June 15th – 18th, 2020. A single registration fee includes both events. The Symposia program provides a unique perspective on the microelectronics industry by integrating the technology ecosystem of converging industry trends – machine learning, IoT, artificial intelligence, wearable/implantable biomedical applications, big data, cloud / edge computing, virtual reality (VR) / augmented reality (AR), robotics, and autonomous vehicles – with the advanced circuit design and application platforms that will realize the future promise of “ubiquitous intelligence.” The weeklong virtual conference will feature of technical presentations, plenary sessions, panel discussions, joint focus sessions, and Short Courses presented in an online format.


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LED Driver Offers Single Solution for Automotive Applications Taiwan Semiconductor announces the introduction of...8805Product ReleaseLED Driver Offers Single Solution for Automotive Applications Taiwan Semiconductor announces the introduction of the TS19501 single channel, dimmable LED driver targeting high-brightness automotive applications. Due to the device’s highly integrated design, this single IC is well suited for virtually every automotive LED application: high and low beam headlights; daytime running lights; turn indicators; position indicator lights; fog lights; ATV and four-wheel drive high-brightness lamps. The IC is also offered in a version ideal for a wide range of non-automotive DC-input LED lighting applications. “The lighting market including automotive lighting is moving toward replacing halogen and incandescent lighting with high efficiency LEDs,” reported Sam Wang, Vice President, TSC Products. “The need for highly integrated LED drivers which save assembly time and cost and afford designers maximum design flexibility is critical as electrification of transportation continues.” The TS19501, while not the first driver to address this growing market, does provide designers with more flexibility, lower pin count and typically lower external parts count than competing devices. 28.07.2020 14:14:00Jul\images\news_2020-08-01_20.jpghttps://www.taiwansemi.com/en/products/details/TS19501CB10Htaiwansemi.com/products
ExpoElectronica New DatesThe Covid-19 pandemic has impacted virtually all i...8801Event NewsExpoElectronica New DatesThe Covid-19 pandemic has impacted virtually all industries and spheres of life, in Russia and globally. The Decree of the Governor of the Moscow Region dated 12 March 2020 introduced a ban on holding mass events in the Moscow Region, and this ban was then repeatedly extended. Subsequently, despite formal lifting of the aforementioned ban, confirmation by the organizer of compliance with the Standard for the functioning of organizations carrying out activities for the organization of conferences (congresses) and exhibitions in order to prevent the spread of the new coronavirus infection (COVID-19) was made a condition precedent for resumption of exhibition organizing activity, and this Standard was not issued for a long time. This uncertainty led to us being unable to carry out all the necessary preparation activities in respect of the exhibition ExpoElectronica, which are lengthy and involve multi-stage process. Considering the above, and in the best interests of the industry, it has been decided that the exhibition ExpoElectronica will take place on the following new dates: 13–15 April 2021. For more information please address the exhibition team and follow the news on our website.24.07.2020 19:00:00Jul\images\news_expoelectronica.pnghttp://www.expoelectronica.ru/Articles/datesnewexpoelectronica.ru
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Optimized EMC Conditions in Electrical Drive SystemsFrequency converters allow the dynamic operation o...8802Product ReleaseOptimized EMC Conditions in Electrical Drive SystemsFrequency converters allow the dynamic operation of electric drives, but at the same time their functional principle inherently results in high-frequency interferences. Line filters are usually installed to keep high frequency, grid-bound interferences out of the power grid in accordance with EMC standards. However, if one follows the interference paths more closely, it becomes clear that the source are the power semiconductors inside the converter and that those interferences affect the output lines as well. While sine wave filters reduce line to line interferences at the inverter output, a different type of interference can bypass a normal sine wave filter. These interferences, which have the same phase in all lines, are known as common mode noise. This assessment led to equip a sine filter with an additional component to suppress common mode noise: the common mode filter. Common mode interferences show up in distorted line-to-earth voltages at the output of the frequency converter. The utilization of a common mode filter eliminates the interferences and returns the signal to its original sinusoidal waveform. Sine filters equipped with a common mode filter are also known as all-pole sine filter. The only requirement for the utilization of FUSS EMV all-pole sine filter is a minimum switching frequency of at least 6 kHz. For applications running at lower switching frequencies, custom built all-pole filters can be designed to meet specific requirements. 23.07.2020 06:30:00Jul\images\news_2020-08-01_17.jpghttp://www.fuss-emv.de/fuss-emv.de
Calibrated EFT/Burst Magnetic Field Sources Investigations of the immunity of integrated circu...8809Product ReleaseCalibrated EFT/Burst Magnetic Field Sources Investigations of the immunity of integrated circuits (ICs) and printed circuit boards are important for testing components and assemblies during development. With the magnetic field sources of the H4-IC and H5-IC sets, Langer EMV-Technik offers specialized tools for small-scale injection of burst pulses into ICs, line structures and assemblies. The EFT/Burst magnetic field sources are characterized by a high achievable field strength of up to 200 mT. This means that circuits can also be subjected to a relevant field even through their housing. The reactions of the circuit enable its analysis with regard to interference immunity and signal safety. The safety of a circuit can be assessed during different functional stages of the circuit (e.g. during booting or switching operations). The frequency response of EFT/burst magnetic field sources is optimized for the transmission of standard pulses of a burst generator (according to IEC 61000-4-4). The BS 06DU-s field source of the H5-IC set reaches a maximum flux density of approx. 150 mT at its peak. Due to the design of the field source, the field lines are repelled by the field source tip and therefore achieve a high efficiency even at a greater distance.22.07.2020 15:30:00Jul\images\news_2020-08-01_24.jpghttps://www.langer-emv.de/en/index/langer-emv.de
Bringing Disruptive Power Electronics to the Road Track and the SkiesGaN Systems and BrightLoop Converters announced th...8797Industry NewsBringing Disruptive Power Electronics to the Road Track and the SkiesGaN Systems and BrightLoop Converters announced their strategic partnership to develop the latest AC/DC and DC/DC Converter products for electric motorsport and aerospace applications. Leveraging GaN Systems’ 650V GaN transistors, BrightLoop produces a range of converters that are smaller, lighter, and more efficient than currently available in the market. GaN is a key component for applications in industries requiring high power performance and reliability. BrightLoop’s most recent family of DCDC converters, including the 1.9 kW, 4.8 kW, and 9.6 kW DCDC converters designed for hybrid and electric racing, incorporates GaN Systems transistors and are around half the size and weight of the company’s first generation DCDC converter developed without GaN. BrightLoop continues to make advancements using GaN to produce lighter and more compact converters. BrightLoop’s DCDC converters are now used in many of the Formula E teams and the winning team from 2019. The converter’s function is to power all the low-voltage electronics including pumps, lighting, and radio. Most recently, the World Sporting Consulting (WSC) Group, the premier motorsport event and racing promotion organization overseeing Touring Car Racing (TCR) and ETCR (Electric Touring Car Racing) brands, announced BrightLoop as the sole supplier of DCDC converters for ETCR cars. ETCR is the world’s first electric touring car championship, which will begin this summer 2020.21.07.2020 16:00:00Jul\images\news_2020-08-01_12.pnghttps://gan-systems.reportablenews.com/pr/brightloop-converters-and-gan-systems-collaborate-to-bring-disruptive-power-electronics-to-the-road-track-and-the-skiesgan-systems.reportablenews.com
SiC Power Modules to Support Solar PV InvertersON Semiconductor has introduced a full SiC power m...8810Product ReleaseSiC Power Modules to Support Solar PV InvertersON Semiconductor has introduced a full SiC power module for solar inverter applications, which has been selected by Delta, to support its M70A three-phase PV string inverter portfolio. The NXH40B120MNQ family of full SiC power modules integrate a 1200 V, 40mO SiC MOSFET and 1200 V, 40 A SiC boost diode with dual boost stage. The use of SiC technology delivers the low reverse recovery and fast switching characteristics needed to achieve the high levels of power efficiency required in applications such as solar inverters. As part of ON Semiconductor's growing portfolio of Power Integrated Modules (PIMs) based on wide bandgap (WBG) technology, the NXH40B120MNQ offers a high level of integration with pin assignment optimized for inverter design. By using SiC components, the power module delivers low conduction and switching losses, enabling the use of higher switching frequencies, which contributes to higher inversion efficiency. The modules are designed for ease of use, with solderless press-fit connections and customer-defined thermal interface options, depending on customer preferences. The NXH40B120MNQ full SiC power module is available in 2-channel and 3-channel variants, and is complemented by the NXH80B120MNQ0, a 2-channel module that integrates a 1200 V, 80mO SiC MOSFET with 1200 V, 20 A SiC diode.20.07.2020 11:11:00Jul\images\news_2020-08-01_25.jpghttps://www.onsemi.com/PowerSolutions/newsItem.do?article=4575onsemi.com
Design and Build a Current-Mode Controller in One HourJoin us for a webinar on Friday Jul 31, 2020 at 10...8787Industry NewsDesign and Build a Current-Mode Controller in One HourJoin us for a webinar on Friday Jul 31, 2020 at 10:00 AM PDT. Dr. Ridley will show how to quickly and efficiently design the controller for a current-mode power system. This involves measuring the power stage, observing the switch current, adding a compensation ramp and characterizing the new power stage. The outer loop compensation is then selected, inserted into the control board, and the loop is measured. All design and measurements will be done on a live working power stage.20.07.2020 06:00:00Jul\images\news_2020-08-01_2.pnghttps://register.gotowebinar.com/register/385306666028558605gotowebinar.com
Webinar: What's new in PLECS version 4.4?In this webinar, a Plexim engineer will demonstrat...8786Industry NewsWebinar: What's new in PLECS version 4.4?In this webinar, a Plexim engineer will demonstrate user interface updates, added components, and more new capabilities included in PLECS Version 4.4. Some of the features shown now allow PLECS users to:- Define separate tasks for generating code to embedded and real-time targets- Display a legend in Scopes and XY-Plots- From File, PID controllers, Fourier, RMS, THD, and new power module blocks- Use non-floating-point signal data types in normal simulations- Plot custom figures in PLECS Standalone, including control system analyses19.07.2020 06:00:00Jul\images\news_2020-08-01_1.jpeghttps://register.gotowebinar.com/rt/1776773814905652239gotowebinar.com
Passives Distributor of the Year AwardTTI, Inc. has been awarded the 2019 Full Service P...8794Industry NewsPassives Distributor of the Year AwardTTI, Inc. has been awarded the 2019 Full Service Passives Distributor of the Year award from Vishay Intertechnology. The 2019 award announcement marks the third consecutive year that TTI has been recognized by Vishay with the Passives Distributor of the Year Award. “I am pleased to present TTI with the Distributor of the Year Passives Products award which recognizes a deep understanding of our markets and technologies. TTI ensures that Vishay’s broad portfolio is always fully available for our customers, and I congratulate the TTI teams throughout the Americas on this outstanding performance,” said Dave Valletta, Executive Vice President of Sales at Vishay Intertechnology. Jeff Ray, Vice President Product Management and Supplier Marketing, responded to the award win, “Receiving this milestone achievement for the third time is a great honor for our committed passives team who have proven once again to be all-in by providing excellent service and product support to the Vishay product line.” 17.07.2020 13:00:00Jul\images\news_2020-08-01_9.jpghttps://www.ttiinc.com/content/ttiinc/en/about/press-releases/2020/july/pr-07082020-tti-vishay-passives.htmlttiinc.com/press-releases
Representative for the MidwestSanan Integrated Circuit (Sanan IC) has signed man...8790Industry NewsRepresentative for the MidwestSanan Integrated Circuit (Sanan IC) has signed manufacturers’ representative firm JF Kilfoil to oversee the company’s portfolio of power electronics and optical foundry services for the Michigan, Ohio, Kentucky, Indiana, Pennsylvania and West Virginia territories. Founded in 1953, JF Kilfoil has successfully positioned itself as the Midwest’s most reliable source for semiconductors, electromechanical components, connectors and printed circuit boards from market leading suppliers. The firm boasts a customer base spanning automotive, white goods, contract manufacturing, and test and measurement. JF Kilfoil will oversee Sanan IC’s GaN and SiC wide bandgap power electronics for automotive and home appliance markets, as well as its optical chip technologies for automotive LiDAR. For inquiries, contact Tim Kilfoil at tmkilfoil@jfkilfoil.com. 17.07.2020 09:00:00Jul\images\news_2020-08-01_5.jpghttp://www.sanan-ic.comsanan-ic.com
Flyback Switcher IC for Automotive BEV and PHEV ApplicationsPower Integrations announced the production releas...8813Product ReleaseFlyback Switcher IC for Automotive BEV and PHEV ApplicationsPower Integrations announced the production release of the InnoSwitch™3-AQ, an AEC-Q100-qualified flyback switcher with integrated 750 V MOSFET and secondary-side sensing. The newly qualified device family targets automotive EV applications, such as traction inverter, OBC (on-board charger), EMS (energy management DC/DC bus converters) and BMS (battery management systems). The InnoSwitch3-AQ uses Power Integrations’ high-speed FluxLink™ coupling to achieve ±3% accuracy for combined line and load regulation while eliminating both dedicated isolated transformer sense-windings and optocouplers. FluxLink technology maintains output voltage regulation even under the transient stress test, which is particularly challenging for PSR-based implementations. The integrated 750 V MOSFET meets stringent automotive de-rating requirements, and an on-chip synchronous rectifier controller delivers above 90% efficiency at the nominal 400 VDC input voltage. Optimized InnoSwitch3-AQ designs achieve less than 10 mW no-load energy usage across the input voltage range. The InnoSwitch3-AQ family ICs are packaged in a surface-mount InSOP with 11 mm primary to secondary creepage, which exceeds the stringent requirements for high altitude (> 5000 m) isolation. The RDR-840Q reference design kit incorporating the newly released IC demonstrates start-up, shutdown and efficient operation from 30 VDC to 550 VDC input, as well as fast transient response and a variety of safety and protection features.16.07.2020 18:30:00Jul\images\news_2020-08-01_28.jpghttps://investors.power.com/investors/press-releases/press-release-details/2020/Power-Integrations-Releases-Highly-Integrated-InnoSwitch3-Flyback-Switcher-IC-for-Automotive-BEV-and-PHEV-Applications/default.aspxpower.com/press-releases
Combining Wireless Power and Data TransmissionWürth Elektronik has extended its " Wireless Power...8803Product ReleaseCombining Wireless Power and Data TransmissionWürth Elektronik has extended its " Wireless Power 200 W Extended Medium Power Solution" developer kit to include an innovative function: Although it was already possible to transfer data from the receiver device to the charging station, bidirectional data transfer can now be combined with the charging process. During wireless power transmission, the device and charging station exchange data through amplitude and frequency modulation. Würth Elektronik provides the software for this newly developed wireless solution, including a checksum control - free of charge. A display board can also be ordered as an optional hardware extension of the developer kit. Würth Elektronik currently offers the widest range of wireless power coils on the market - compliant both with the Qi standard and beyond. "Fast connection without cables and the advantage of being able to build devices encapsulated and without plug connections. This is extremely interesting for developers in the industrial or medical technology sector – as it is too for the manufacturers of smartphones, lawn mower robots or electric scooters,” explains Cem Som, Division Manager Wireless Power Transfer at Würth Elektronik. "With our developer kit we now offer options beyond the charging process and use inductive energy transfer as a communication channel.”16.07.2020 15:15:00Jul\images\news_2020-08-01_18.jpghttps://www.we-online.com/web/en/wuerth_elektronik/news_weg/News_Detail_WE_Gruppe_113145.phpwe-online.com/news
EM World’s Innovation AwardIndium Corporation earned Electronics Manufacturin...8796Industry NewsEM World’s Innovation AwardIndium Corporation earned Electronics Manufacturing (EM) World's Innovation Award for its low-temperature alloy technology, Durafuse™ LT. The award was presented on Friday, July 3, in Shanghai, China, during Productronica China. The EM Innovation Award program recognizes and celebrates excellence in the electronics industry, encouraging companies to achieve the highest standards and push the industry forward. Durafuse™ LT is a novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications that need to reflow below 210°C. Where traditional low-temperature solders can produce brittle solder joints that are susceptible to drop shock failures, Durafuse™ LT provides improved drop shock resilience, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup. 16.07.2020 15:00:00Jul\images\news_2020-08-01_11.jpghttps://www.indium.com/corporate/communications/news/indium-corporation-receives-em-worlds-innovation-award/indium.com/news
Power Supply Features Baseplate Cooling and Medical Certification RECOM introduces a highly compact 4”x 2” 230W inno...8807Product ReleasePower Supply Features Baseplate Cooling and Medical Certification RECOM introduces a highly compact 4”x 2” 230W innovative baseplate-cooled power supply for 2 x MOPP medical, household, industrial and ITE applications. The compact 4”x 2” RACM230-G series power supplies from RECOM support up to 160W continuous output power and 230W for several seconds for loads with peak demands, without fan cooling. With forced air, depending on model, line input and ambient temperature, 230W is available continuously. Outputs available are 12V, 24V, 36V, 48V and 54V nominal with conversion efficiency up to 92% and an operating temperature range of -40 to +80°C. International safety certifications include 2 x MOPP (250VAC) medical, household, industrial and audio/video/ITE for operation up to 5000m altitude with universal 80 - 264VAC input, enabling worldwide-compliant operation. Standby power consumption is less than 500mW. Additional features as standard include a smart fan output. For flexibility, the RACM230 series is available as an open-frame design or in an enclosed metal housing. For higher output power, up to 550W, the new RACM550-G series is also available with similar or enhanced specifications with even higher power products in the pipeline. Samples and OEM pricing are available from all authorized distributors or directly from RECOM.16.07.2020 14:30:00Jul\images\news_2020-08-01_22.jpghttps://recom-power.com/en/company/newsroom/news/rec-n-230w-4x-2-power-supply-features-baseplate-cooling-and-medical-certification-with-enclosure-options-77.html?3recom-power.com/news
Single Port and Eight Port ICMs Bel Magnetic Solutions announces a single port and...8806Product ReleaseSingle Port and Eight Port ICMs Bel Magnetic Solutions announces a single port and eight-port 2.5GBASE-T MagJack ICM. These ICMs offer a cost-effective solution for upgrading end-product performance to multi-rate, NBASE-T Ethernet standards. These reliable, cost-competitive ICMs are compatible with all new multi-rate Ethernet PHYs and are suitable for next-generation 5G cellular equipment, low density, 2.5GBASE-T Ethernet switches, high bandwidth 2.5GBASE-T network interface cards, NBASE-T compliant products and industrial controls equipment. Bel Magnetic Solutions’ 2.5GBASE-T ICMs are backward compatible to slower speeds and use industry-standard footprints and pinouts. The 2.5GBASE-T solution doubles product speed and bandwidth at nearly the same cost as 1GBASE-T solutions.16.07.2020 10:30:00Jul\images\news_2020-08-01_21.pnghttps://belfuse.com/news-detail/bel-magnetic-solutions-single-port-and-eight-port-2-5gbase-t-magjack-icms-now-available-in-distributionbelfuse.com/news
CEO Transition AnnouncedVincotech announced that its Board of Directors ha...8789PeopleCEO Transition AnnouncedVincotech announced that its Board of Directors has appointed Eckart Seitter, Senior Vice President of Sales and Marketing, as Vincotech's Chief Executive Officer (CEO) and Chairman of the Board effective October 1, 2020. Eckart Seitter will succeed Vincotech's CEO and Chairman of the Board Joachim Fietz, who will retire from the company and board after 12 successful years as CEO. This smooth CEO transition demonstrates the long-term continuity of the company as a reliable and trusted partner for its global customers, counting on Eckart Seitter's tremendous business and leadership skills, his strategic insight and his customer-focused mentality. Eckart Seitter has been with the company for more than 20 years. He became Managing Director Sales and Marketing in 2013, and thus has made a strong contribution to Vincotech's development and success. "Joachim Fietz set exceptionally high standards of achievement during his leadership for more than a decade, and I am very much looking forward to this new challenge to follow him, and to working together with the management team," said Eckart Seitter. "Together, we want to set the course for our further global growth. Our goal is to continue the development of Vincotech, a strong brand within Mitsubishi Electric Corporation, and to sustainably fulfil our primary obligation to serve customer needs quickly and flexibly".16.07.2020 08:00:00Jul\images\news_2020-08-01_4.jpghttps://www.vincotech.com/news/company-news/article/vincotech-announces-ceo-transition.htmlvincotech.com/news
Dennis Earley Appointed as President Premier Magnetics is pleased to announce the promo...8793PeopleDennis Earley Appointed as President Premier Magnetics is pleased to announce the promotion of Dennis Earley to the position of the company’s president. Dennis Earley, who has served as Premier Magnetics’ vice president and general manager since September of 2017, takes over responsibility for corporate strategy and global operations, starting August 1, 2020. This seamless leadership transition is the result of a thoughtfully planned succession. Dennis succeeds Jim Earley who founded the company and has served as president since its inception in 1991. Jim will continue to serve the company in a senior advisory capacity as chief operating officer. “Dennis has played an integral role in the evolution and development of our business,” said current Premier Magnetics President Jim Earley who announced the appointment. “He has a deep understanding of the electronics industry and has demonstrated exceptional leadership as our vice president and, before that, as sales manager. We will benefit from his experience and forward-looking vision as we continue on our path of profitable growth.”15.07.2020 12:00:00Jul\images\news_2020-08-01_8.jpghttp://www.premiermag.compremiermag.com
DC-DC Converter Demonstration Board EPC announces the availability of the EPC9143, a 3...8812Product ReleaseDC-DC Converter Demonstration Board EPC announces the availability of the EPC9143, a 300 W DC-DC voltage regulator in 16th brick size. The EPC9143 power module integrates Microchip’s dsPIC33CK digital signal controller (DSC) with the latest generation EPC2053 eGaN FETs from EPC to achieve 96% efficiency in a 48 V input to 12 V output conversion at 25 A. The switching frequency of 500 kHz enables the 300 W in the very small 16th brick format which is just 33 mm x 22.9 mm (1.3 x 0.9 in). Additional phases can be added to this scalable 2-phase design to further increase power. The flexibility of the Microchip digital controllers allows the input voltage to be adjusted from 8 V – 72 V and the output voltage from 3.3 V – 25 V. Brick DC-DC converters are widely used in data center, telecommunication and automotive applications, converting a nominal 48 V to a nominal 12 V distribution bus among other output voltages. The main trend has been towards higher power density given the form factor is fixed. A main application is high density 48V to 12V point-of-load (POL) converters, where a regulated 12V output voltage is required, like those used for commodity PCIe cards and storage. eGaN® FETs and integrated circuits provide the fast switching, small size and low cost that can meet the stringent power density requirements of these leading-edge applications with low component count and solution cost.15.07.2020 07:30:00Jul\images\news_2020-08-01_27.jpghttps://epc-co.com/epc/EventsandNews/News/ArtMID/1627/ArticleID/2936/EPC-and-Microchip-Develop-300-W-16th-Brick-48-V-%e2%80%93-12-V-DC-DC-Converter-Demonstration-Board-for-High-Density-Computing-and-Data-Centers.aspxepc-co.com/News
Upcoming ECPE Tutorials & Online Tutorials• ECPE Online Tutorial 'Passives in Power Electron...8799Event NewsUpcoming ECPE Tutorials & Online Tutorials• ECPE Online Tutorial 'Passives in Power Electronics: Magnetic Component Design and Simulation'<br> 24 - 25 September 2020, Digital Event via Webex<br><br>• ECPE Tutorial 'Introduction to Power Electronics'<br> 29 - 30 September 2020, Hamburg, Germany<br><br>• ECPE Online Tutorial 'Power Electronics Packaging'<br> 1 - 2 October 2020, Digital Event via Webex<br><br>• ECPE Tutorial 'Testing Automotive Power Modules according to the ECPE Guideline AQG 324'<br> 7 - 8 October 2020, Nuremberg, Germany<br><br>• ECPE Tutorial 'Use and Assessment of Power Device Models in Power Electronic Simulation'<br> 22 October 2020, Nuremberg, Germany<br><br>• ECPE Online Tutorial 'Power Circuits for Clean Switching and Low Losses'<br> 18 - 19 November 2020, Digital Event via Webex<br><br>• ECPE Tutorial 'High-Precision Power Electronics'<br> 1 - 2 December 2020, Eindhoven, Netherlands14.07.2020 17:00:00Jul\images\news_ecpe.pnghttps://www.ecpe.org/events/workshops-tutorials/all/ecpe.org/events
Line of Power InductorsMonolithic Power Systems announced the worldwide r...8808Product ReleaseLine of Power InductorsMonolithic Power Systems announced the worldwide release of a line of highly efficient power inductors. Offered in a wide range of sizes, molded and semi-shielded, these inductors have been designed and matched for optimal performance with MPS ICs, and when paired together, provide an easy, complete power solution. MPS customers can be certain that these new inductors meet all necessary specifications and have been tested and characterized with specific MPS power regulators for optimal results. Furthermore, the unique mix of ferrite and binding powder helps deliver top performance, cost, and efficiency. “Today’s highly developed power ICs require superior power inductors. For this reason, we decided to introduce inductors to our product portfolio to work optimally with MPS power regulators to achieve the best performance in terms of PCB space and thermal efficiency for our customers,” says Maurice Sciammas, Senior VP of Sales & Marketing. With proven expertise in the power conversion market, MPS ICs and their new line of Power Inductors can now be used in countless power supplies and filtering applications. 14.07.2020 08:30:00Jul\images\news_2020-08-01_23.pnghttps://www.monolithicpower.com/products/inductor.htmlmonolithicpower.com/products
Strengthening Analog Semiconductor LeadershipAnalog Devices and Maxim Integrated announced that...8791Industry NewsStrengthening Analog Semiconductor LeadershipAnalog Devices and Maxim Integrated announced that they have entered into a definitive agreement under which ADI will acquire Maxim in an all stock transaction that values the combined enterprise at over $68 billion. The transaction, which was unanimously approved by the Boards of Directors of both companies, will strengthen ADI as an analog semiconductor leader with increased breadth and scale across multiple attractive end markets. “Today’s exciting announcement with Maxim is the next step in ADI’s vision to bridge the physical and digital worlds. ADI and Maxim share a passion for solving our customers’ most complex problems, and with the increased breadth and depth of our combined technology and talent, we will be able to develop more complete, cutting-edge solutions,” said Vincent Roche, President and CEO of ADI. “Maxim is a respected signal processing and power management franchise with a proven technology portfolio and impressive history of empowering design innovation. Together, we are well-positioned to deliver the next wave of semiconductor growth, while engineering a healthier, safer and more sustainable future for all.” “For over three decades, we have based Maxim on one simple premise – to continually innovate and develop high-performance semiconductor products that empower our customers to invent. I am excited for this next chapter as we continue to push the boundaries of what’s possible, together with ADI. Both companies have strong engineering and technology know-how and innovative cultures. Working together, we will create a stronger leader, delivering outstanding benefits to our customers, employees and shareholders,” said Tunç Doluca, President and CEO of Maxim Integrated. Upon closing, two Maxim directors will join ADI’s Board of Directors, including Maxim President and CEO, Tunç Doluca.13.07.2020 10:00:00Jul\images\news_analog.pnghttps://www.analog.com/en/about-adi/news-room/press-releases/2020/7-13-2020-analog-devices-announces-combination-with-maxim-integrated.htmlanalog.com/news-room
Railway Approved DC/DC Converters The TEP 40UIR & TEP 60UIR are two series of high p...8811Product ReleaseRailway Approved DC/DC Converters The TEP 40UIR & TEP 60UIR are two series of high performance railway DC/DC converters with ultra wide 12:1 input voltage range featuring a compact ¼ brick (2.3”x1.45”x0.5”) metal package. The ultra wide input allows the converter to act as an all-in-one solution if different voltage ranges have to be covered in the same application, resolving the issue of having multiple different converters installed. An internal circuit implemented in these modules helps to extend the hold-up time with ease as it eliminates the need of expensive high voltage capacitors to cover the full input range. With only a 25V capacitor (independent of the input voltage) the whole input range can be covered effectively reducing cost, size an inrush current. All models are approved for railway applications according to EN 50155, EN 61373, EN 45545-2 and offer standard features such as high efficiency up to 91%, an operating temperature range of -40° to +85°C and an I/O-isolation voltage of 3’000 VAC. An adjustable under voltage lockout function, remote on/off and adjustable outputs round out the features and ensure that these converter modules fit in any application setup.11.07.2020 11:30:00Jul\images\news_2020-08-01_26.jpghttps://www.tracopower.com/de/tep-4060uir-series-40-and-60-watt-railway-dcdc-converterstracopower.com
Virtual EPE'20 ECCE Europe-ConferenceThe virtual 22nd European Conference on Power Elec...8771Event NewsVirtual EPE'20 ECCE Europe-ConferenceThe virtual 22nd European Conference on Power Electronics and Applications will take place from the 7th to the 11th of September 2020. Meeting several challenges, the organizing team is working very hard to offer you a one of the kind experience. They carefully chose the Whova platform to support the event, offering enhanced discussion and networking capabilities. Zoom channels will ensure large audience discussion stability and smaller meetings will be possible using the channels of your choice. The EPE ECCE Europe conference is the largest in its field, attracting experts from numerous different countries every year to join in the discussions. With the objective to exchange and meet fellow professionals and academics, the EPE ECCE Europe conference brings together researchers, engineers, etc. working at the forefront of power electronics technologies. For this type of event, where the future role of power electronics in this ecological revolution will be explored, the EPE ECCE Europe conference is one of the privileged places. There will be the opportunity to discuss a vast number of subjects during EPE '20 ECCE Europe, not only during the virtual lecture and dialogue sessions of the conference, but also at the virtual exhibition, industrial forums and tutorials.10.07.2020 19:00:00Jul\images\news_epe.pnghttp://www.epe2020.com/epe2020.com
Fuses & Switchgear for Solar Systems with PV String Inverters Decades of experience on the NH Fuse-links and on ...8804Product ReleaseFuses & Switchgear for Solar Systems with PV String Inverters Decades of experience on the NH Fuse-links and on the NH Fuse switch disconnectors through the Multivert® and Multibloc® ranges enable MERSEN to offer a complete solution to their customers, which meets the specific application requirements and delivers high quality products, high level of service and expertise. Mersen NH 800V AC fuses have been designed specifically for photovoltaic systems with 1500V DC / 800V AC inverters. Thanks to a specific silver fuse element design in comparison to conventional line protection gG class operating fuses, these 800V AC fuses can interrupt any surge, from the lowest fusing up to 90kAmps at a tested voltage of 880V, in a standard NH type size. With a gR operating class described both in IEC 60269 standard and UL 248-13, Mersen can provide a fuse offer that is globally accepted, whatever the area of destination is Europe, Asia, South or North America. Mersen is now the only manufacturer to offer a complete package of NH Fuses & FSDs designed specifically to answer the requirements of protection and distribution of electric networks in the combiner boxes on the AC side of the new string inverters with rated operational voltage of 800 V AC. This offer includes NH fuse-links, and NH Fuse switch disconnectors, in horizontal version (Multibloc®) and in vertical version (Multivert®). 10.07.2020 09:30:00Jul\images\news_2020-08-01_19.jpghttps://www.mersen.commersen.com
Solutions on Resistor-Based Current Sensing Mouser Electronics is pleased to offer customers a...8798Industry NewsSolutions on Resistor-Based Current Sensing Mouser Electronics is pleased to offer customers a resource site dedicated to Current Sensing Solutions from Microchip Technology and Vishay Intertechnology. Current sensing is a key requirement for the development of smart motor controls and high-efficiency power supplies. The site features a range of controllers, resistors, and amplifiers from Microchip and Vishay, offering a single resource for designers seeking reliable resistor-based current-sensing solutions. The Microchip and Vishay Current Sensing Solutions reference site on the Mouser website offers links to a comprehensive selection of products from Microchip and Vishay, including product descriptions and ordering information. The site also includes a link to an informative white paper on using current-sense resistors to measure current for closed-loop power control. The white paper, titled "Basics and Trade-offs of Resistor-Based Current Sensing," examines high-side versus low-side sensing, with information on associated amplifier electronics, and provides information on determining the resistor value, selecting the right type of resistor, and physical connection factors. The new Current Sensing Solutions site provides a selection of eight products designed to provide a reliable current sense solution for motor control applications. Current sense resistors often provide the most appealing solution when compared with Hall-effect devices and current sensing coils, and the combination of current sense resistors and amplifiers meets the demanding requirements of rugged industrial applications.09.07.2020 17:00:00Jul\images\news_2020-08-01_13.jpghttps://eu.mouser.com/publicrelations_microchip_vishay_currentsense_2020final/eu.mouser.com/publicrelations
Scott Adams President of eMobility SegmentPower management company Eaton announced that Scot...8795PeopleScott Adams President of eMobility SegmentPower management company Eaton announced that Scott Adams has been named president, eMobility. In this role, he will be based in Southfield, Michigan, and report directly to João Faria, president, Vehicle Group, Eaton. Adams is responsible for leading all aspects of the business to achieve Eaton’s objectives for top-line revenue growth and profitability. “Scott’s contributions to the success of our eMobility business since its inception, along with his deep understanding of vehicle markets and customers make him an excellent choice for this role,” said Faria. “His proven track record of leading organizations to achieving growth will be an asset as we work to expand our eMobility portfolio and strengthen our global capabilities.” Adams joined Eaton in 1994 as a project engineering manager in Cleveland, Ohio, and has held numerous positions of increasing scope over his 26-year career with the company. Most recently, he was senior vice president, Product Strategy, Sales and Marketing, eMobility, where he was responsible for developing and executing Eaton’s electrification growth strategy. Prior to his roles within eMobility, Adams served as senior vice president, Global Product Development, Marketing and Planning, Vehicle Group, Eaton. He has also held roles as director of sales for North American Automotive, business unit manager for the Vehicle Group’s Light Duty Transmission and Off-Highway businesses and led the former Truck Group’s Vehicle Solutions business unit.09.07.2020 14:00:00Jul\images\news_2020-08-01_10.jpghttps://www.eaton.com/us/en-us/company/news-insights/news-releases/2020/adams-president-emobility-segment.htmleaton.com/news-releases
Developing SiC-based Automotive Inverters TogetherROHM and Leadrive Technology held an opening cerem...8768Industry NewsDeveloping SiC-based Automotive Inverters TogetherROHM and Leadrive Technology held an opening ceremony of their joint laboratory on SiC technology in the China (Shanghai) Pilot Free Trade Zone (Lingang New Area). Since 2017, ROHM and LEADRIVE have been collaborating and carrying out detailed technical exchanges on automotive applications utilizing SiC power devices. Establishing a joint research lab centered on vehicle power modules and inverters utilizing ROHM's SiC MOSFET bare chips and isolated gate drivers will give both companies the opportunity to further accelerate the development of innovative power solutions.  "As a pioneer and leading supplier of SiC power devices, ROHM has a proven track record for providing high quality power solutions that combine industry-leading device technology with driver ICs, and we are committed to promote the use of SiC for xEV applications," adds Dr. Kazuhide Ino, Member of the Board, Senior Corporate Officer, CSO and Senior Director of Power Device Business at ROHM Co., Ltd. "Understanding customer needs and market trends is extremely important when developing SiC power device technology. LEADRIVE plays an important role in the applied research of SiC as a manufacturer of automotive power modules and inverters. Through this joint research lab, we can strengthen our partnership and contribute to the technical innovation of automotive power solutions centered on SiC," Dr. Ino concludes.08.07.2020 16:00:00Jul\images\news_2020-07-15_11.jpghttps://www.rohm.com/news-detail?news-title=rohm-and-leadrive-establish-a-joint-lab&defaultGroupId=falserohm.com/news
3-20W AC/DC Converter SeriesDue to the development of IoT (Internet of Things)...8785Product Release3-20W AC/DC Converter SeriesDue to the development of IoT (Internet of Things) and the 'smart home' concept, the requirement of household appliances on the safety and dimensions is more important than ever. MORNSUN ultra-compact AC/DC converter LD-R2 series, for example, 1 x 1x 0.7 inches of LD03/LD05 series, are the ideal power supply for applications with space limitation. With the universal input voltage of 85-305VAC, an operation temperature range of -40~85? and efficiency of 87%, LD-R2 series can be used for applications in commercial and industrial. The 2-Y-capacitors design, EMI class B without external components requirement and No-load power consumption as low as 0.1W make them the perfect match for the household appliance. The LD05-23BxxR2 series is provided with the IEC / EN / UL62368 and the IEC / EN60335 and the IEC / EN61558 safety standard for domestic applications. These compact modules are very suitable for use in smart meters, kitchen equipment, climate control such as sustainable heating and cooling and other IoT applications in a domestic environment. It can be widely used in many fields such as industrial control systems, smart homes, smart buildings, smart agriculture, household appliances, etc.06.07.2020 19:30:00Jul\images\news_2020-07-15_28.pnghttps://www.mornsun-power.com/html/news-detail/product-news/274.htmlmornsun-power.com/news
PCB-embedded GaN-on-Si Half Bridge CircuitsResearchers at the Fraunhofer-Institute for Applie...8777Product ReleasePCB-embedded GaN-on-Si Half Bridge CircuitsResearchers at the Fraunhofer-Institute for Applied Solid State Physics IAF have integrated their monolithically integrated GaN power ICs using PCB embedding technology as a half bridge circuit, including gate and DC link capacitors. The result is an extremely compact and efficient highly integrated voltage converter of the 600 volts class in a user-friendly package. The integrated functionality in the chip and all critical passive components on the package allow it to be used in a modular fashion, thus reducing the effort required for the development of future power electronic systems. Energy-efficient power electronics for energy conversion and transmission are becoming increasingly important, as future-oriented and sustainable energy concepts, such as electric mobility or power supply via renewable energies, depend on them. For this purpose, the Fraunhofer Institute for Applied Solid State Physics IAF has developed a user-friendly, highly integrated GaN voltage converter in a compact package that is extremely resource-efficient and can be used in a modular fashion. The result is an extremely compact and efficient voltage converter suited for all 600 volts applications. It allows a reliable and modular system design, thus facilitating design and production processes.06.07.2020 11:30:00Jul\images\news_2020-07-15_20.jpghttps://www.iaf.fraunhofer.de/en/media-library/press-releases/PCIM.htmliaf.fraunhofer.de/press-releases
105°C Rated, 800V Solid State RelayLittelfuse announced the PLA172P OptoMOS Relay, an...8774Product Release105°C Rated, 800V Solid State RelayLittelfuse announced the PLA172P OptoMOS Relay, an 800 V normally-open single-pole 6-pin solid-state relay (SSR). It is the first solid-state relay in the Littelfuse product portfolio that comes with guaranteed electrical parameters at 105 °C ambient operating temperature. The PLA172P is an extension to our OptoMOS solid-state relay product line, offering our highest voltage rating (800V) in a surface mount SSR Flatpack package," said Steve Andrezyk, Global Product Manager at Littelfuse. "It also has our highest temperature range in a solid-state relay, extending our operational temperature range from 85 ºC up to 105 ºC, enabling hardware engineers to precisely design their circuits at very challenging temperatures." Isolation current monitor circuits for higher voltage systems >400 V require high blocking voltage, low off-state leakage current relays with high input-to-output isolation rating to prevent potential lethal current conduction to the system chassis. The PLA172P relay's 800 V load voltage rating with 100 mA load current capability provides additional design margin compared to the more common 600 V rated SSRs, particularly on noisy AC power line applications and high voltage battery applications. The 105 C specifications including the low 5 µA maximum off-state leakage current rating in conjunction with the low on-resistance, making it the ideal choice for high precision isolation current monitor applications.06.07.2020 08:30:00Jul\images\news_2020-07-15_17.jpghttps://www.littelfuse.com/about-us/news/news-releases/2020/06.30-800v-solid-state-relay.aspxlittelfuse.com/news
High Power Devices for Inverter Traction ModulesON Semiconductor and Danfoss announced that ON Sem...8758Industry NewsHigh Power Devices for Inverter Traction ModulesON Semiconductor and Danfoss announced that ON Semiconductor will supply Danfoss Silicon Power with high power IGBTs and diodes for inverter traction modules in the electric vehicle market. "Chip independency is an important and fundamental element of the Danfoss go-to market strategy. By selecting IGBT chips from ON Semiconductor we are accommodating the high growth expectations from our automotive customers", said Claus A. Petersen, senior vice president and general manager, Danfoss Silicon Power. "Our main objective is to develop world-class power modules, fitted exactly for the application in question. We are happy to have a long-term and robust relationship with ON Semiconductor." "With investment in power technologies and manufacturing capacity globally, ON Semiconductor reiterates our firm commitment to be the top supplier of automotive high power devices," said Asif Jakwani, senior vice president of the Advance Power Division at ON Semiconductor. "Utilizing our semiconductor portfolio with Danfoss' extensive experience in power module design and manufacturing, we expect our penetration in the vehicle electrification market to accelerate, benefitting both companies." ON Semiconductor will fabricate the high power components in manufacturing locations in East Fishkill, New York and Bucheon, South-Korea. Danfoss will fabricate their power modules in Flensburg, Germany and Utica, New York.06.07.2020 06:00:00Jul\images\news_2020-07-15_1.jpghttps://www.danfoss.com/en/about-danfoss/news/cf/on-semiconductor-to-provide-danfoss-with-high-power-devices-for-inverter-traction-modules/danfoss.com/news
Expertise to Powering StairliftsAlways looking to provide the market highly-optimi...8769Industry NewsExpertise to Powering StairliftsAlways looking to provide the market highly-optimised energy storage solutions, Denchi Group has secured a large-scale contract with DC motor system manufacturer Lemac. Based in Scotland, Lemac produces the motor systems incorporated into a leading brand of stairlifts. DC systems (rather than AC ones), are used in these stairlifts because they are inherently safer. Also power delivery is better regulated, resulting in a smoother ride for the user. In addition, operation can still continue even if a power outage occurs on the mains supply. To complement the lightweight and streamlined motor systems Lemac provides for these stairlifts, compact high-density batteries are mandated. The company had previously used an offshore source for its battery units. However, there were some significant issues in terms of quality. Denchi was able to offer a much more compelling alternative, manufactured in the UK for only a marginal increase in cost. "Often we see companies that went offshore to source energy storage solutions for their products coming to us when they suffer with technical and logistical problems, or experience a lack of responsiveness," states Nick Simmons, Denchi's Sales Director. "Thanks to ultra-reliable operation and exceptional longevity, our solutions present customers with a far lower total cost of ownership, and that's what really matters. Furthermore, supply continuity and first class engineering support are completely assured."02.07.2020 17:00:00Jul\images\news_2020-07-15_12.pnghttps://www.denchigroup.comdenchigroup.com
Jörg Doblaski Takes on the Role of Chief Technology OfficerX-FAB Silicon Foundries has announced the appointm...8760PeopleJörg Doblaski Takes on the Role of Chief Technology OfficerX-FAB Silicon Foundries has announced the appointment of Jörg Doblaski as its Chief Technology Officer (CTO). He fills the role of former CTO Dr. Jens Kosch, who is becoming an X-FAB Fellow and will serve as an adviser to the company's CEO Rudi De Winter. Doblaski joined X-FAB in 2004 and since then has held various positions in engineering and management. Prior to becoming CTO, he was Director of Design Support, and helped to build up the company's extensive portfolio of highly advanced IP. He was also responsible for driving development of X-FAB's feature-rich design kits, which significantly accelerate time-to-market and assure first-time-right implementation. Doblaski has a degree in Electrical Engineering & Information Technology from the Ilmenau University of Technology in Germany. "It is a great honour for me to take on this important role, especially at such a challenging time," Doblaski commented. "In my new post I will continue to advance our technology offering with unique features and best-in-class customer support, delivering innovative products for our customers and enabling long-term mutual success."02.07.2020 08:00:00Jul\images\news_2020-07-15_3.jpghttps://www.xfab.com/about-x-fab/news/newsdetail/article/joerg-doblaski-takes-on-the-role-of-x-fab-cto/?tx_ttnews%5BbackPid%5D=98&cHash=47038fad31df04f62475a80e8f40a267xfab.com/news
Switcher ICs Certified for Automotive UsePower Integrations announced an AEC-Q100-qualified...8783Product ReleaseSwitcher ICs Certified for Automotive UsePower Integrations announced an AEC-Q100-qualified version of its LinkSwitch-TN2 switcher IC for buck or non-isolated flyback applications. Featuring an integrated 750 V MOSFET, the automotive-qualified LinkSwitch-TN2 IC provides simple and reliable power for EV sub-systems connected to the high-voltage bus, including HVAC, climate control, battery management, battery heater, DC-DC converter and on-board charger systems. The surface-mount device requires no heatsink, needs few external components and occupies a very small PCB footprint. The 7 W (flyback) / 360 mA (buck) LinkSwitch-TN2 has a wide input voltage range of 60 VDC to 550 VDC, efficiently supporting the 400 VDC bus commonly seen in electric vehicle applications. The power supply IC provides accurate regulation of better than +/-5% across line voltage, load, temperature and component tolerances. Comments Power Integrations' product marketing manager Edward Ong: "Our automotive switcher ICs reduce size while increasing the reliability and robustness of automotive sub-systems. By supplying auxiliary systems directly from the high-voltage bus with a LinkSwitch-TN2 power supply, automotive engineers can reduce the requirement for the conventional 12 V distributed rail, saving assembly and material cost."01.07.2020 17:30:00Jul\images\news_2020-07-15_26.jpghttps://investors.power.com/investors/press-releases/press-release-details/2020/LinkSwitch-TN2-High-Voltage-Switcher-ICs-from-Power-Integrations-Now-Certified-for-Automotive-Use/default.aspxpower.com/press-releases
High-Speed Op Amp That Eliminates OscillationROHM announced a high-speed ground sense CMOS op a...8780Product ReleaseHigh-Speed Op Amp That Eliminates OscillationROHM announced a high-speed ground sense CMOS op amp, BD77501G, optimized for industrial and consumer equipment requiring high-speed sensing, such as anomaly detection systems used in measurement and control equipment along with sensors that work with very small signals. ROHM developed the EMARMOUR series of op amps and comparators that have been well-received in the automotive and industrial markets due to its superior noise immunity that allows users to reduce design resources to address noise issues. This time, ROHM has expanded the lineup by adding a high-speed type ideal for anomaly detection that prevents oscillation over the entire load capacitance range. The BD77501G is an op amp that not only supports high-speed amplification (high slew rate: 10V/us) required in anomaly detection and other systems, but also completely eliminates oscillation caused by load capacitance (i.e. wiring). Unlike conventional high-speed op amps that can become unstable due to load-capacitance-induced oscillation, ROHM's product ensures stable operation with no unwanted oscillation. In addition, whereas the output voltage for conventional products can fluctuate by ±200mV or more across the entire noise frequency band, the BD77501G provides unprecedented EMI Immunity (noise immunity) that limits variation to less than ±20mV (1/10th). This enables high-speed signal amplification without being affected by load capacitance or external noise when installed in the latter stages of sensor applications, improving reliability and reducing design time.01.07.2020 14:30:00Jul\images\news_2020-07-15_23.jpghttps://www.rohm.com/news-detail?news-title=high-speed-op-amp&defaultGroupId=falserohm.com/news
Martin Rausch Appointed as Chief Technology OfficerRECOM Power is pleased to announce that Martin Rau...8763PeopleMartin Rausch Appointed as Chief Technology OfficerRECOM Power is pleased to announce that Martin Rausch has been appointed to the newly created position of Chief Technology Officer (CTO). Rausch joins RECOM after six years serving as a Managing Director at TGW Mechanics where he managed the development and supply chain locations in Austria, China and the US. Within his professional career, Rausch has completed an MBA, a PhD in electrical engineering, and has held managerial positions at both Siemens and General Electric making him expertly qualified to manage the global development of RECOM's manufacturing sites in Austria, Italy, China Mainland and Taiwan area. As CTO, he will be responsible for overseeing every aspect of product development including research and development, production, quality management, certification, and purchasing, as well as customer support and satisfaction. Martin Rausch (CTO): "We need two things to achieve this goal and go full force with the energy we have at our disposal throughout the RECOM group: Professional organization with people that can take personal responsibility and think in a team, and efficient global processes serving our independent units. This will involve striking a balance between utilizing existing resources to the full and exploring and developing new markets."01.07.2020 11:00:00Jul\images\news_2020-07-15_6.jpghttps://recom-power.com/en/company/newsroom/news/rec-n-recom-power-hires-martin-rausch-as-chief-technology-officer-121.html?3recom-power.com/news
Compact Panel Mounted Voltage MeasurementLEM introduces the DVC 1000 series of voltage sens...8773Product ReleaseCompact Panel Mounted Voltage MeasurementLEM introduces the DVC 1000 series of voltage sensors for insulated nominal voltage measurements in rail traction and industrial applications. The DVC 1000 series offers panel mounted voltage measurement in a compact package, measuring only 29 x 51 x 89 mm, giving a total volume of only 131.6 cm3. Designed to measure a nominal voltage of 1000 VRMS, the DVC 1000 series uses an isolating amplifier, providing very high levels of isolation with a safety insulation voltage of 4.2 kV. The use of an isolating amplifier offers significant space savings over other sensors of similar capacity, which use bulky galvanic insulation. As well as being highly robust, the DVC 1000 series also offers high levels of accuracy and temperature stability. An optional DIN rail mounting adaptor makes it easy to integrate into users' own applications. LEM developed the DVC 1000 to be fully compliant with the International Railway Industry Standards (IRIS). Engineers in the railway industry working with both rolling stock and sub-stations can use these versatile new sensors to measure DC links, the output voltages of inverters, the input voltage of 4 quadrant converters, or the battery voltage of Light Rail Vehicles. The features of the DVC 1000 voltage sensors also make them ideal for a broad range of small-to-medium voltage measurements in industrial markets such as DC power supply monitoring, EV chargers and battery storage applications.01.07.2020 07:30:00Jul\images\news_2020-07-15_16.jpghttps://www.lem.com/en/file/9546/download/lem.com
Combining Power Grids Business with Digital TechnologyHitachi announced that it has completed the proced...8759Industry NewsCombining Power Grids Business with Digital TechnologyHitachi announced that it has completed the procedures for its 80.1% investment in the company operating power grids business that had been carved out from ABB, pursuant to the acquisition agreement signed on December 17, 2018. The new company, Hitachi ABB Power Grids Ltd ("Hitachi ABB Power Grids") was launched and began operation on July 1st, 2020. Under the leadership of Claudio Facchin as CEO and Toshikazu Nishino, Executive Vice President of Hitachi, as Chairman, Hitachi ABB Power Grids will expand Hitachi's energy solutions business globally as a core part of the company's Social Innovation Business. By combining power grids business with Hitachi's digital technologies such as Lumada, Hitachi and Hitachi ABB Power Grids will provide energy solutions spanning the Energy (utilities), Mobility, Smart Life (cities), Industry, and IT sectors. With roots in Hitachi and ABB, the new business will build on more than one century of expertise in pioneering engineering technologies, enabling customers to increase efficiency and maintaining resilience. It will unlock new business models and contribute social, environmental and economic values for a sustainable society. Claudio Facchin, CEO, Hitachi ABB Power Grids, said, "Both Hitachi and ABB Power Grids have a rich legacy in technology and innovation that goes back over a century. Combining world-class power solutions with Hitachi's leading open digital platforms presents us with new market opportunities and enables us to deliver greater customer value across the world."01.07.2020 07:00:00Jul\images\news_hitachi_abb.pnghttp://www.hitachi.com/New/cnews/month/2020/07/f_200701.pdfhitachi.com/news.pdf
Silicon Carbide Power ModuleAt its virtual PCIM booth Infineon presented the E...8784Product ReleaseSilicon Carbide Power ModuleAt its virtual PCIM booth Infineon presented the EasyPACK module with CoolSiC automotive MOSFET technology, a 1200 V half-bridge module with an 8 m?/150 A current rating. The module is based on Infineon's silicon carbide trench MOSFET structure. Compared to planar structures, the trench structure enables a higher cell density, resulting in the best-in-class figure of merit. As a result, trench MOSFETs can be operated at lower gate-oxide field strengths for higher reliability. First-generation CoolSiC automotive MOSFET technology is optimized for use in traction inverters, with a focus on achieving the lowest possible conduction losses, especially under partial load conditions. Combined with the low switching losses of silicon carbide MOSFETs, this enables losses in inverter operation to be reduced by around 60 percent compared to silicon IGBTs. In addition to optimizing performance, Infineon attaches great importance to reliability. The chip manufacturer develops and tests CoolSiC automotive MOSFETs with the aim of achieving high short-circuit, cosmic ray, and gate-oxide robustness, which is key for designing efficient and reliable high-voltage applications in electric cars. The new CoolSiC automotive MOSFET power module is fully qualified to the AQG324 standard.30.06.2020 18:30:00Jun\images\news_2020-07-15_27.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2020/INFATV202006-077.htmlinfineon.com/market-news
Communication Without MaskAs Würth Elektronik is not able to present new pro...8770Industry NewsCommunication Without MaskAs Würth Elektronik is not able to present new products to customers and interested parties in personal contact at trade fairs due to the Covid-19 pandemic, the manufacturer of electronic and electromechanical components has now set up a virtual exhibition stand (www.we-online.de/virtual). Instead of visiting a trade fair, visitors will find an attractive online presentation of product innovations and the possibility to have a direct conversation in the chat. The Würth Elektronik team offers a creative answer to the current situation with its virtual trade fair stand. Interested developers and manufacturers can use this platform to stay in close, personal contact with the manufacturer. Products are visualized with their technical data and can be discussed with Würth Elektronik specialists in the chat. Component samples and developer support can be requested directly from the virtual booth. Also available: Tools for precise product selection such as the measurement database application REDEXPERT as well as order forms, catalogues and specialist books. As lectures are held at exhibition stands, webinars can be found at the virtual exhibition stand. The current focus topic here is Single Pair Ethernet. Würth Elektronik offers solutions and standard-compliant reference designs that make this copper-saving cabling, which originates from the automotive sector, usable for industrial applications - for example for connecting sensors or as a replacement for other bus systems.30.06.2020 18:00:00Jun\images\news_2020-07-15_13.jpghttps://www.we-online.com/web/en/wuerth_elektronik/news_weg/News_Detail_WE_Gruppe_113122.phpwe-online.com/news
Film Capacitors Operating up to 200°CExxelia launches its 253P & 560P product series pr...8782Product ReleaseFilm Capacitors Operating up to 200°CExxelia launches its 253P & 560P product series providing unmatched performances at high temperature. The PTFE 253P series is the most stable 200°C Film capacitor on the market with its unparalleled stability of <2,5% with capacitance from 0.22µF to 1µF under 250VDC to 800VDC. It offers the lowest loss characteristic (T?) of all film technologies less than 0,1% at extreme temperatures (200°C) with excellent life performance in operations. The series offers great resistance to vibrations, shocks and to over voltage making it ideal for Oil & Gas applications as well as Defense and Civil Aviation.30.06.2020 16:30:00Jun\images\news_2020-07-15_25.jpghttps://exxelia.com/en/group/newsexxelia.com/news
Multilayer Ceramic Capacitor with a Capacitance Value of 1.0µFMurata has developed a multilayer ceramic capacito...8781Product ReleaseMultilayer Ceramic Capacitor with a Capacitance Value of 1.0µFMurata has developed a multilayer ceramic capacitor with a capacitance value of 1.0µF in the 01005 inch size (0.4×0.2mm), which is increasingly used in a wide range of mobile electronic devices including smartphones. Mass production of the GRM022R60G105M with a rated voltage of 4Vdc has already started and mass production of GRM022R60J105M with a rated voltage of 6.3Vdc is scheduled to begin in 2021. The spread of 5G smartphones and the increasing functionality and miniaturization of wearable devices is stoking the demand for further miniaturization and higher density of electronic circuitry. Among the applications, multilayer ceramic capacitors are essential components of many kinds of electronic devices and are widely used in such devices as smartphones and wearable devices. Given that approximately 900 to 1,100 multilayer ceramic capacitors are installed in a single high-end smartphone, a considerable need exists for capacitors combining smaller size with larger capacity. Since multilayer ceramic capacitors with a capacitance of 1.0µF are widely used in various devices, expanding the adoption of these new products will contribute to the further miniaturization of electronic devices. Thanks to Murata's proprietary thin layer technology for ceramic elements and thin-sheet formation technology, these products have achieved approximately a 35% reduction in footprint and a 50% reduction in volume ratio compared to our existing product with the same capacitance value (015008 inch size). In addition, their capacity has increased by about 2.1 times compared to our conventional product of the same size (01005 inch size).30.06.2020 15:30:00Jun\images\news_2020-07-15_24.jpghttps://www.murata.com/en-eu/products/info/capacitor/mlcc/2020/0630murata.com
Single Chip PMU / PMIC ICsRicoh Electronic Devices in Japan has launched two...8779Product ReleaseSingle Chip PMU / PMIC ICsRicoh Electronic Devices in Japan has launched two PMU ICs for industrial and consumer purposes. These ICs are a single chip solution and provides four high-efficiency step-down DC/DC converters, seven low-dropout regulators, four GPIOs, an interrupt controller (INTC) and an I2C-Bus interface. The output voltages and the power-on/off sequence settings can be tailored in a profile and saved in a built-in One-Time Programmable (OTP) memory. The RN5T5610 is an industrial version suitable for continuous operation under wide operating temperature conditions whilst the RN5T5612 is designed for consumer applications. The PMUs include custom programmable features by OTP for initial output voltage setting and start-up/shut-down sequencing. A 2-wire I2C bus interface bus, operating at 400kHz or 3.4MHz, provides additional control by register settings such as turning individual output voltages on or off as well as adjusting the DC/DC converter and LDO output voltage levels by a Dynamic Voltage Scaling (DVS) feature. Step-rate for adjusting voltages is 50mV for OTP and 12.5mV for register settings. The PMU ICs distinguishes On, Off and Sleep operating modes, the current consumption varies from Typical 13µA in Off-mode to maximum 440µA in On-mode depending on which outputs are enabled.29.06.2020 13:30:00Jun\images\news_2020-07-15_22.jpghttps://www.n-redc.co.jp/en/about/info/n-redc.co.jp
Buck-boost Battery ChargersTexas Instruments introduced buck-boost battery ch...8778Product ReleaseBuck-boost Battery ChargersTexas Instruments introduced buck-boost battery charger integrated circuits, which integrate power-path management for maximum power density and universal and fast charging at up to 97% efficiency. The BQ25790 and BQ25792 support efficient charging and 10 times lower quiescent current through USB Type-C and USB Power Delivery (PD) ports in small personal electronics, portable medical devices and building automation applications. The BQ25790 and BQ25792 offer the flexibility to charge batteries with one to four cells in a series and up to 5 A of charging current across the full input-voltage range (3.6 V to 24 V) for USB Type-C and USB PD applications. The chargers' integrated dual-input selector supports multiple power sources, including wireless, USB, barrel jack and solar charging, while delivering fast charging – 97% efficiency at 30 W. They deliver 155 mW/mm2 (100 W/in2) of power – up to two times more than competitive devices. Helping engineers reduce solution size and bill of materials (BOM), the new buck-boost chargers are the industry's first to fully integrate the following components: switching metal-oxide semiconductor field-effect transistors (MOSFETs), a battery FET, current-sensing circuits and a dual-input selector. The reduction in component count is particularly valuable for applications such as smart speakers, which are shrinking in size and cost as market adoption increases.29.06.2020 12:30:00Jun\images\news_2020-07-15_21.jpghttps://news.ti.com/new-buck-boost-battery-chargers-deliver-50-greater-power-density-and-three-times-faster-charging-for-usb-type-c-usb-pd-and-wireless-dual-input-chargingnews.ti.com
Focus on Larger Battery FormatsVARTA is driving the further development of its te...8761Industry NewsFocus on Larger Battery FormatsVARTA is driving the further development of its technology with the help of IPCEI funding ("Important Project of Common European Interest"): In addition to the development of the latest generation of small-format lithium-ion cells with even higher energy densities, the funding program will focus on the transfer of the innovative VARTA technology to larger formats. In the future, these battery cells could be used in VARTA energy storage devices, robots, as well as in mobility applications. These new battery formats are to be optimized on a pilot line and transferred to mass production. VARTA is also continuing to invest in research and development activities for battery cells in special formats, which are increasingly in demand for IOT applications, for example. The Federal Ministry of Economics (BMWi) and the states of Bavaria and Baden-Württemberg are supporting the battery industry in Germany and Europe within the framework of an IPCEI. The federal and state governments are providing VARTA AG with funding of up to 300 million euros for the project until the end of 2024. The VARTA Group continues to invest in the expansion of its lithium-ion mass production and will create around 1000 new jobs in Ellwangen and Nördlingen by the end of next year. VARTA is thus strengthening the battery industry, particularly in Baden-Württemberg and Bavaria, and emphasizes its importance as an employer in the region.29.06.2020 09:00:00Jun\images\news_2020-07-15_4.jpghttps://www.varta-ag.com/en/newsmedia/news/varta-group-receives-ipcei-funding-for-the-further-development-of-its-innovative-lithium-ion-technology-focus-on-larger-battery-formatsvarta-ag.com/news
Technical Presentations and PanelsThe EPC team will be delivering three technical pr...8741Event NewsTechnical Presentations and PanelsThe EPC team will be delivering three technical presentations and participating in two panel discussions on gallium nitride (GaN) technology and applications at the upcoming PCIM Europe 2020 Digital Days, July 7 – 8. In addition, the company will participate in the event's virtual exhibit, showing its latest eGaN FETs and ICs in customers' end products that are rapidly adopting eGaN technology. In the virtual exhibit, EPC experts will be available to discuss eGaN devices in several applications including: high performance 48 V DC-DC power conversion for advanced computing and automotive applications; high power nanosecond pulsed laser drivers for lidar used in autonomous vehicles; and precision motor drives for robotics and drones.26.06.2020 07:00:00Jun\images\news_2020-07-01_2.jpghttps://epc-co.com/epc/EventsandNews/Events/PCIM2020.aspx?utm_source=BusinessWire&utm_medium=PR&utm_campaign=PCIM2020&utm_content=PCIM%202020%20Landing%20Pageepc-co.com/Events
100V Half-Bridge MOSFET Drivers for Industrial ApplicationsRenesas introduced the HIP2211 and HIP2210, a pair...8775Product Release100V Half-Bridge MOSFET Drivers for Industrial ApplicationsRenesas introduced the HIP2211 and HIP2210, a pair of 100V half-bridge MOSFET drivers. The HIP2211 is a pin-compatible upgrade to Renesas' ISL2111 bridge driver, while the HIP2210 offers a tri-level PWM input to simplify power supply and motor drive design. The devices are ideal for 48V telecom power supplies, Class-D audio amplifiers, solar inverters, and UPS inverters. They are also rugged enough to power the demanding 48V motor drives found in Li-ion battery-powered household and outdoor products, water pumps, and cooling fans. The HIP221x drivers are designed to work reliably under difficult operating conditions, with the high-speed, high-voltage HS pin tolerating up to -10V continuously and slewing as quickly as 50V/ns. Comprehensive under-voltage protection works in tandem with the HIP2210's programmable anti-shoot-through protection to ensure the driven MOSFETs are not damaged due to power supply or other external fault conditions. Renesas' HIP221x drivers feature strong 3A source, 4A sink drivers with very fast 15ns typical propagation delay and 2ns typical delay matching, making them the optimal solution for high-frequency switching applications. Both the HIP2210 and HIP2211 are designed to complement Renesas microcontrollers in advanced DC/DC and brushless motor drive systems.25.06.2020 09:30:00Jun\images\news_2020-07-15_18.jpghttps://www.renesas.com/eu/en/about/press-center/news/2020/news20200625.htmlrenesas.com/news
International Electron Devices Meeting to be Held VirtuallyThe organizers of the upcoming 66th annual IEEE In...8767Event NewsInternational Electron Devices Meeting to be Held VirtuallyThe organizers of the upcoming 66th annual IEEE International Electron Devices Meeting (IEDM) have decided to hold the conference virtually this year given the ongoing uncertainties posed by the prevailing COVID-19 pandemic. The virtual 2020 IEDM is scheduled for December 12–16, 2020, and both live and recorded sessions will be used to showcase and discuss the world's best original work in all areas of microelectronics research and development. "The IEDM Executive Committee has decided that in the interest of prioritizing the health and safety of the scientific community, a virtual approach is the best option for this year," said Dina Triyoso, IEDM 2020 Publicity Chair and Technologist at TEL Technology Center, America, LLC.24.06.2020 15:00:00Jun\images\news_iedm.pnghttps://ieee-iedm.org/ieee-iedm.org
DC Fast Charging Infrastructure is Critical for Adoption of EVsAlthough the adoption of electric vehicles (EVs) h...8766Industry NewsDC Fast Charging Infrastructure is Critical for Adoption of EVsAlthough the adoption of electric vehicles (EVs) has continued to grow over recent years, some key technology initiatives still are necessary to spur widespread acceptance across a broader range of end-users. One critical element in the development of ubiquitous fast-charging stations that can recharge EVs rapidly so that the consumers' experience is short and easy – much like the way they currently fill a conventional vehicle with fuel. Whereas some industry experts view Level 1 and Level 2 as little more than "glorified wall sockets" most see DC Fast Charging as a true game-changer. DC Fast Charging's significantly faster charge times offer the much-needed technology leap to put longer distance EV driving on a par with conventional fossil fuel fill-ups at traditional gas stations. Consumers will no longer face the prospect of having to wait for hours while their EV is recharged. The target is to have recharging times close to what consumers currently experience for petrol refueling (approx. 5 minutes). The Combined Charging System (CCS) standard uses combo connectors to allow both AC charging and fast DC charging options within the same station. First pioneered in the European Union in 2014, CCS technology has been adopted by SAE and is also gaining wide acceptance in the U.S. CSS is supported by many automotive manufacturers including, BMW, Daimler, FCA, Ford, Jaguar, General Motors, Groupe PSA, Honda, Hyundai, Kia, Mazda, MG, Polestar, Renault, Tesla, and Volkswagen Group. Virtually all industry players agree that widespread deployment of DC Fast Charging will be an important inflection point for spurring the ultimate transition from fossil fuel vehicles to ubiquitous adoption of EVs by end consumers and commercial transportation companies.24.06.2020 14:00:00Jun\images\news_2020-07-15_9.jpghttps://interplex.com/trends/automotive/deployment-of-a-robust-dc-fast-charging-infrastructure-is-critical-for-the-widespread-adoption-of-electric-vehicles/?utm_source=trends&utm_medium=email&utm_campaign=trend-DCFastCharging-EV&utm_content=trendsarticlebinterplex.com/trends
Market Monitor: Key Segments for the Power Semiconductor IndustryThere has been a remarkable shift of interest in S...8765Industry NewsMarket Monitor: Key Segments for the Power Semiconductor IndustryThere has been a remarkable shift of interest in SiC for automotive applications and in GaN for mainstream consumer applications. "These applications will respectively drive the SiC and GaN power device market in the coming years," explains Ezgi Dogmus, Technology & Market Analyst at Yole Développement. And she adds: "In H1-2020, the global COVID-19 outbreak has caused a significant slowdown of various end markets, especially the automotive and consumer segments, and thus has impacted the related power SiC and GaN market revenues." Since the first commercialization of SiC diodes, the power SiC device market has been driven by power supply applications. Nevertheless, automotive is becoming the killer application, following SiC's notable adoption for Tesla's main inverters in 2018. Since then, different Tier 1-component makers, such as ZF and Bosch, and carmaker OEMs like BYD and Renault have recently made announcements on their adoption of SiC technology in some of their products. In the prospering SiC power market, the automotive segment is undoubtedly the foremost driver, and as such will hold more than 50% of total device market share in 2025. In the power GaN landscape, the market research & strategy consulting company Yole confirms a remarkable entry of several players into the high-volume consumer market, notably Power Integrations and Navitas. "For sure, the GaN power market is evolving rapidly," comments Ahmed Ben Slimane from Yole. Many phone OEMs including Oppo, Vivo, Realme, and Meizu opted for GaN based inbox fast chargers, released with their flagships in the beginning of 2020. Samsung, Huawei, and Xiaomi chose GaN for accessory chargers. This represents a first milestone for power GaN devices in a high-volume consumer market.24.06.2020 13:00:00Jun\images\news_2020-07-15_8.jpghttp://www.yole.fr/Compound_Semiconductor_Monitor_Q2.aspxyole.fr
Discretes in Miniature, Leadless Rugged DFN PackagesNexperia announced the industry's widest portfolio...8755Product ReleaseDiscretes in Miniature, Leadless Rugged DFN PackagesNexperia announced the industry's widest portfolio of automotive-qualified discretes in space-saving, thermally-efficient, AOI-compatible DFN (Discrete Flat No leads) packages. The AEC-Q101 range of devices available cuts across all Nexperia's product groups and includes switching, Schottky, Zener and protection diodes, bipolar junction transistors (BJTs), N- and P-channel MOSFETs, resistor-equipped transistors and LED drivers. Automotive qualified discrete leadless packages offered by Nexperia range from the very small form factor DFN1006BD-2 (1 x 0.6 x 0.5 mm) up to DFN2020D-3 (2 x 2 x 0.65 mm), including the recently-released DFN1110D-3 and DFN1412D-3 styles. DFN devices can measure as small as 0.6 mm2 offering a PCB space-saving of up to 90 % when compared to current SOT23 devices. The excellent thermal performance (Rth(j-sp)) allows an equal or better Ptot on the smaller DFN footprint. At the same time these packages stay cooler and improve overall system reliability. The Nexperia DFN package technology supports a Tj capability of up to 175°C. Because automated optical inspection (AOI) is vital for some applications – especially automotive - Nexperia pioneered the development of side-wettable flanks (SWF) for the DFN package in 2010 and devices with SWF are now a proven, accepted solution.23.06.2020 15:30:00Jun\images\news_2020-07-01_16.jpghttps://www.nexperia.com/about/news-events/press-releases/nexperia-delivers-widest-range-of-aec-q101-discretes-in-miniature-leadless-rugged-dfn-packages.htmlnexperia.com/press-releases
High-Performance Integrated Voltage Regulators (IVRs)Empower Semiconductor announced the EP70xx, a fami...8754Product ReleaseHigh-Performance Integrated Voltage Regulators (IVRs)Empower Semiconductor announced the EP70xx, a family of power management ICs that will provide significant energy savings in data centers with the single biggest point-of-load power performance disruption in over a decade. With its product platform, the EP70xx, Empower has achieved the total integration of a triple output DC/DC power supply with no external components into a single tiny 5mm x 5mm package, attaining up to 10x higher current density, 3x tighter accuracy during transients, and 1000x faster dynamic voltage scaling than leading competitors. "Customers are excited about the game-changing nature of our technology and the impact it is having on their systems and digital ICs", said Tim Phillips, Chief Executive Officer and Founder of Empower Semiconductor. "The combination of density, speed and efficiency is allowing designers to utilize our products in groundbreaking ways, enabling breakthrough levels of system performance." Empower Semi's patented digitally configurable hardware platform has simplified the adoption of DC/DC converters for designers. With a single footprint, no external components, extensive programmability, a wide range of current and output configurations, power designers can proliferate the EP70xx across nearly all designs and platforms.23.06.2020 14:30:00Jun\images\news_2020-07-01_15.jpghttps://www.empowersemi.com/empower-smashes-density-and-speed-benchmarks-with-family-of-high-performance-integrated-voltage-regulators-ivrs/empowersemi.com
Ceramic Capacitors for Automotive Power TrainsTAIYO YUDEN announced the commercialization of mul...8776Product ReleaseCeramic Capacitors for Automotive Power TrainsTAIYO YUDEN announced the commercialization of multilayer ceramic capacitors with an increased maximum operating temperature of 150°C. This product lineup is compatible with AEC-Q200, a reliability test qualification standard for automotive passive components. Available are various types of elemental technologies nurtured to improve the temperature characteristics of X7R (operating temperature range: -55 to 125°C) in the onventional products to X8L (-55 to 150°C). These products are available in a wide assortment of dimensions, from the 1005 size (1.0 × 0.5 mm) to the 3225 size (3.2 × 2.5 mm). The products will be used for decoupling or anti-noise parts in automotive power trains such as engines and transmissions. Production of the multilayer ceramic capacitors commenced at the company's Tamamura Plant (Tamamura-machi, Sawa-gun, Gunma Prefecture, Japan), KOREA KYONG NAM TAIYO YUDEN CO., LTD. (Sacheon-si, Gyeongsangnam-do, Korea) started in May 2020.23.06.2020 10:30:00Jun\images\news_2020-07-15_19.jpghttps://www.pressebox.de/pressemitteilung/taiyo-yuden-europe-gmbh/TAIYO-YUDEN-Commercializes-Multilayer-Ceramic-Capacitors-with-aMaximum-Operating-Temperature-of-150C/boxid/1011728pressebox.de/taiyo-yuden
Advanced High-Efficiency Power SolutionsSTMicroelectronics has launched a web-based ecosys...8747Industry NewsAdvanced High-Efficiency Power SolutionsSTMicroelectronics has launched a web-based ecosystem to help designers build digital-power solutions using STM32 microcontrollers (MCUs). The STM32 D-Power website consolidates developer resources that include the all-in-one STM32 digital-power Discovery Kits, embedded software components, software tools created by ST Authorized Partner Biricha Digital, and dedicated power-supply boards that demonstrate various designs and power ratings. Documentation, videos, and guides cater to beginners up to expert power-supply designers, and a four-day hands-on workshop created by Biricha shows how to build digital power supplies using STM32 MCUs. The ecosystem is scaled to support three levels of STM32 microcontrollers that combine the benefits of industry-standard Arm Cortex-M cores with integrated features optimized for digital-power applications. The entry-level STM32F334, advanced STM32G474, and high-performance STM32H7 series MCUs each contain a flexible high-resolution timer to generate highly accurate pulse-width modulated (PWM) signals for stable control of switched-mode power circuits.18.06.2020 13:00:00Jun\images\news_2020-07-01_8.pnghttps://newsroom.st.com/media-center/press-item.html/t4263.htmlnewsroom.st.com
On the Way to Full Car AutonomyThe automotive is evolving quickly – new technolog...8764Industry NewsOn the Way to Full Car AutonomyThe automotive is evolving quickly – new technologies are constantly adding to safety and comfort of the car. This development is strongly user-driven, as the results of a current study conducted by Asahi Kasei Europe and SKOPOS shows. The ongoing CASE (Connected – Autonomous – Shared – Electric) megatrends are currently disrupting the automotive industry. In October 2019, Asahi Kasei Europe conducted a representative survey together with Cologne-based market research institute SKOPOS, interviewing a total of 1,200 car users in Germany, France, Italy and the United Kingdom regarding their preferences relative to mobility and especially to the future automotive interior. The results of the survey show that the customer's decision process when deciding for a new car is growing in complexity. While traditional metrics such as fuel consumption, running costs or driving performance are still key decision factors, the interior including features like acoustic systems and overall advanced driver assistance systems (ADAS) are quickly gaining in importance. "The rising number of ADAS on the street is an essential milestone on the path towards fully autonomous vehicles. Two decades ago, the key problem had been to familiarize drivers with features like adaptive cruise control (ACC) or forward alert. Today the end user is aware of the benefits of such systems. The challenge now is to offer these systems for an affordable price. Radar MMIC (monolithic microwave integrated circuit) chips from Asahi Kasei Microdevices leveraging CMOS (complementary metal oxide semiconductor) technology to support this process of making active safety feature available down to smaller car segments", explains Heiko Rother.18.06.2020 12:00:00Jun\images\news_2020-07-15_7.jpghttps://www.asahi-kasei.eu/en/News/On%20the%20way%20to%20full%20car%20autonomy%20%E2%80%93%20New%20study%20by%20Asahi%20Kasei%20Europe%20shows%20growing%20needs%20for%20driver%20assistance%20systems%20and%20improved%20acoustics_n276asahi-kasei.eu/news
Photovoltaic Array SimulatorsKeysight Technologies has launched a family of pho...8751Product ReleasePhotovoltaic Array SimulatorsKeysight Technologies has launched a family of photovoltaic (PV) array simulators that are the first to deliver 2000 V and 20 kW of power in a 3U format, enabling engineers to maximize solar power conversion. To keep solar power at grid parity with competing methods of power generation, performance and power conversion efficiency are critical. Small increments in power production can impact profitability of solar power generation. Engineers need to ensure that their solar inverters can convert maximum power from the connected solar array. However, developing and verifying the performance of inverter maximum power point tracking (MPPT) algorithms and circuits is complex, while testing is difficult, expensive and time consuming. Multiple MPPT inverters provide flexibility for large commercial arrays but create a test challenge as current solutions test one MPPT channel at a time. The Keysight PV8900 Series along with the DG9000A advanced photovoltaic inverter test software goes beyond existing standards, testing up to 12 MPPT channels simultaneously. Keysight's next generation PV8900 series of PV array simulators offer the following features and customer benefits: The highest power density with 20 kW in 3U high that can be paralleled to 200 kW to test string inverters at full power capacity while reducing rack space.18.06.2020 11:30:00Jun\images\news_2020-07-01_12.jpghttps://www.keysight.com/gb/en/about/newsroom/news-releases/2020/keysight-first-to-launch-photovoltaic-array-simulators-that-deli.htmlkeysight.com/newsroom
SiC MOSFETs Featuring Low ON ResistanceROHM announces the 4th Generation 1200V SiC MOSFET...8756Product ReleaseSiC MOSFETs Featuring Low ON ResistanceROHM announces the 4th Generation 1200V SiC MOSFETs optimized for automotive powertrain systems, including the main drive inverter, as well as power supplies for industrial equipment. For power semiconductors there is often a trade-off relationship between lower ON resistance and short-circuit withstand time, which is required to strike a balance for achieving lower power losses in SiC MOSFETs. ROHM was able to successfully improve this trade-off relationship and reduce ON resistance per unit area by 40% over conventional products without sacrificing short-circuit withstand time by further improving an original double trench structure. In addition, significantly reducing the parasitic capacitance (which is a problem during switching) makes it possible to achieve 50% lower switching loss over our previous generation of SiC MOSFETs. As a result, ROHM's 4th Generation SiC MOSFETs are capable of delivering low ON resistance with high-speed switching performance, contributing to greater miniaturization and lower power consumption in a variety of applications, including automotive traction inverters and switching power supplies. Bare chip samples have been made available from June 2020, with discrete packages to be offered in the future.17.06.2020 09:30:00Jun\images\news_2020-07-01_17.jpghttps://www.rohm.com/news-detail?news-title=new-4th-gen-sic-mosfets&defaultGroupId=falserohm.com/news
Capacities for Electro-mobility ChipsIn view of the long-term growing market demand for...8743Industry NewsCapacities for Electro-mobility ChipsIn view of the long-term growing market demand for power semiconductors for electric cars, Danfoss A/S and Infineon Technologies AG have signed a multi-year volume agreement. Infineon will supply chipsets of IGBTs and diodes to the Danfoss Silicon Power business unit. The chips are mainly used in power modules for inverters that control the motors in electric vehicles. "The market for electro-mobility is picking up noticeably, and the supply industry is getting ready for this," says Claus Petersen, Senior Vice President and General Manager at Danfoss Silicon Power. "For us as a manufacturer of power modules for electric drivetrains, a long-term secure supply of semiconductors is extremely important. With this agreement we can accommodate the high growth expectations of our customers," Petersen concludes. "With electro-mobility, the semiconductor content per car will increase to almost double that of conventional cars. Power semiconductors represent by far the largest part of this additional content," says Peter Schiefer, President of the Automotive Division at Infineon. "The expansion of our manufacturing capacities, for example in Villach, Austria, enables us to establish a long-term cooperation with customers like Danfoss. A reliable and resilient supply chain is crucial for the rapid success of the mobility revolution." Infineon produces the IGBTs and diodes for Danfoss at its plants in Dresden, Germany, and Villach, Austria. Danfoss manufactures its power modules in Flensburg, Germany, and Utica, New York, USA.17.06.2020 09:00:00Jun\images\news_2020-07-01_4.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2020/INFATV202006-067.htmlinfineon.com/market-news
Thinpack Aluminum Electrolytic CapacitorsFirst introduced in 2018, Cornell Dubilier Electro...8750Product ReleaseThinpack Aluminum Electrolytic CapacitorsFirst introduced in 2018, Cornell Dubilier Electronics has made significant design tweaks to their THA and THAS Series Thinpack capacitors. The product updates raise the rated life to 5,000 hours, a 66% increase over the first-generation devices. The key strength of the series is still high-energy-density. The 85 °C THA Series Thinpack capacitors are only 8.2mm thick, and 9mm for the 105 ºC THAS Series. While of similar height to V-chip electrolytics, tantalums, and board-mounted axials, THA and THAS offer much higher bulk-storage capability. For example, a single THA/THAS capacitor can replace an entire board full of SMT, axial or radial aluminum electrolytic or solid tantalum capacitance arrays. The upgrade to a 5,000-hour rating expands the potential range of applications to the longer life commercial and MIL/Aero devices. All THA/THAS capacitors sold after January 1, 2020, will meet the new performance specifications. Pricing is unchanged. THA/THAS Series capacitors are thinner and more cost-effective than most alternative technologies. Unlike traditional cylindrical electrolytics, THA/THAS capacitors have sealed, laser-welded aluminum cases to eliminate the need for space-wasting end seal gaskets.16.06.2020 10:30:00Jun\images\news_2020-07-01_11.jpghttps://www.cde.com/new-product/tha-thascde.com/new-product
Fixed-frequency Synchronous Buck RegulatorsAlpha and Omega Semiconductor introduced AOZ676xDI...8749Product ReleaseFixed-frequency Synchronous Buck RegulatorsAlpha and Omega Semiconductor introduced AOZ676xDI series of high switching frequency and simple-to-use synchronous buck regulators. AOZ6762DI and AOZ6763DI are capable of delivering 2A and 3A, respectively, and up to 15W output power. The devices offer a low on-resistance power stage and are packaged in a 3mm x 3mm DFN 8-lead package with an exposed thermal pad, allowing cooler power conversion for a variety of consumer and networking equipment such as wireless AP/routers, set-top boxes, cable modems, audio equipment, and LCD TVs. The power stage comprised of two power MOSFETs optimized for efficient synchronous switching to minimize both switching and conduction losses. The devices can achieve > 90% efficiency at full load operation. When operating in low output current conditions, the devices run in a proprietary pulse energy mode (PEM) to achieve high efficiency by reducing switching loss. Under this mode, the regulators can still maintain up to 86% efficiency at 10mA load operation. This feature enables system designers to achieve the low standby power required to meet the "One Watt Initiative."16.06.2020 08:30:00Jun\images\news_2020-07-01_10.jpghttp://www.aosmd.com/res/news/news-article-1592325940326/AOZ676xDI_Series%20PR.pdfaosmd.com/news
Gate-All-Around Nanosheet Fabrication ProcessCEA-Leti has demonstrated fabrication of a new gat...8746Industry NewsGate-All-Around Nanosheet Fabrication ProcessCEA-Leti has demonstrated fabrication of a new gate-all-around (GAA) nanosheet device as an alternative to FinFET technology targeting high-performance (HPC) applications such as smartphones, laptops, and mobile systems with data collection and processing involving low-power and high-speed operation. Institute researchers fabricated GAA nanosheet transistors with seven levels of stacked silicon channels, more than twice as many as state-of-the-art today, with widths ranging from 15nm to 85nm. The results were summarized in the paper, "7-Levels-Stacked Nanosheet GAA Transistors for High Performance Computing", presented virtually during the 2020 Symposia on VLSI Technology & Circuits. CEA-Leti scientist Sylvain Barraud, one of the authors of the paper, said the seven levels of stacked nanosheet GAA transistors fabricated using a replacement metal gate process, inner spacer and self-aligned contacts show excellent gate controllability with extremely high current drivability (3mA/µm at VDD=1V), and a three-x improvement in drain current over the usual two levels stacked nanosheet GAA transistors. "By increasing the number of stacked-channels, we increase the effective width of the device for a given layout footprint," he explained. "Increasing the effective width induces higher drive current. This is why the DC performance of our devices is better than leading-edge devices."15.06.2020 12:00:00Jun\images\news_2020-07-01_7.jpghttp://www.leti-cea.com/cea-tech/leti/english/Pages/What's-On/Press%20release/CEA-Leti-Demonstrates-Breakthrough-Architecture-for-HPC-Devices-Using-Gate-All-Around-Nanosheet-Fabrication-Process.aspxleti-cea.com/What's-On
Call for Technical Session PapersAPEC 2021 continues the long-standing tradition of...8740Event NewsCall for Technical Session PapersAPEC 2021 continues the long-standing tradition of addressing issues of immediate and long-term interest to the practicing power electronic engineer. Outstanding technical content is provided at one of the lowest registration costs of any IEEE conference. The Technical Program includes peer-reviewed papers that cover all areas of technical interest for the practicing power electronics professional. The rigorous review process highlights the most innovative technical solutions and provides the highest quality possible and includes papers of broad appeal presented during the lecture sessions and those with a more specialized focus that make up the dialogue sessions. Prospecitve authors are asked to submit a digest explaining the problem that will be addressed by the paper, the major results, and how this is different from the closest existing literature. Papers presented at APEC must be original material and not have been previously presented or published. The principal criteria in selecting digests will be the usefulness of the work to the practicing power electronic professional. Reviewers value evidence of completed experimental work. Authors should obtain any necessary company and governmental clearance prior to submission of digests. If a digest is accepted, authors must submit a final manuscript before the deadline, or the manuscript cannot be published in the Proceedings or presented at the conference. Both the technical paper and its APEC presentation file will be distributed as protected Adobe PDF files (text and graphics copy protected). Submission of your digest serves as your implicit agreement and consent to electronic distribution of your presentation.15.06.2020 06:00:00Jun\images\news_2020-07-01_1.jpghttps://www.apec-conf.org/conference/sessions/technical/apec-conf.org
Expanding Power Device BusinessMitsubishi Electric Corporation announced that it ...8742Industry NewsExpanding Power Device BusinessMitsubishi Electric Corporation announced that it will acquire buildings and land from Sharp Fukuyama Semiconductor Co. The acquired properties will serve as a new site where Mitsubishi Electric's Power Device Works will process wafers for the manufacture of power semiconductors. New production facilities scheduled to start up in November of next year will enable Mitsubishi Electric to expand its power device business. The demand for power semiconductors needed to control electric power with efficiency is rapidly rising in parallel with efforts to conserve energy and protect the global environment through carbon-reduction measures, including the ongoing electrification of automobiles worldwide. To meet this growing demand, Mitsubishi Electric conducted a search for potential new manufacturing sites. As a result, the company has reached an agreement with Sharp Corporation to acquire buildings and land from Sharp Fukuyama Semiconductor.11.06.2020 08:00:00Jun\images\news_mitsubishi.pnghttps://www.mitsubishielectric.com/news/2020/0611.htmlmitsubishielectric.com/news
Simulation and Design of Microgrids and MorePowersim is pleased to announce the release of DSI...8772Product ReleaseSimulation and Design of Microgrids and MorePowersim is pleased to announce the release of DSIM, a dedicated tool for the simulation of power electronics. Simulation speeds of 100x to 1000x have been documented versus existing offline simulation software packages. One application for DSIM will be the simulation of microgrids and megawatt-level power converter systems. A microgrid can be broadly defined as multiple power converters and generators working together in a system. These systems can consist of one or multiple power converters and generators or larger more complex systems with hundreds of components. Before DSIM, the simulation of individual power converters, such as PV grid interface inverters, was easily performed in a few seconds or minutes. Having multiple power converters would dramatically increase the simulation time from a few seconds to hours or days. This dramatic increase in simulation time requires the abstraction of complexity and simplification of models. Whenever a simplified model is used, there is a loss of fidelity in the results. DSIM allows more accurate models to be used and in most cases still simulates faster than the simplified models with the traditional simulation tools. The results from DSIM simulations have been verified against hardware prototypes and have been published in peer-reviewed papers and journals. Initial testers of DSIM have also verified its results with hardware and other offline simulation software.11.06.2020 06:30:00Jun\images\news_2020-07-15_15.pnghttps://powersimtech.com/news-events/dsim-release/powersimtech.com/news
Isolated High-Power Shunt ModulesRiedon is set to redefine the current measurement ...8753Product ReleaseIsolated High-Power Shunt ModulesRiedon is set to redefine the current measurement landscape with the introduction of its SSA Smart Shunt series. These next-generation current sensing modules combine the attributes of conventional passive shunt resistors with those normally associated with considerably more expensive and bulky closed-loop Hall Effect current sensors. Each featuring a built-in precision amplifier, they offer reinforced electrical isolation (up to 1500VDC), alongside industry-leading levels of stability and accuracy. SSA Smart Shunt units exhibit ±0.1% sensing accuracy and ±0.1% linearity over their entire current range, with far less susceptibility to temperature drift. The need for routine calibration can therefore be negated. They also have a rapid response time of less than 1.5µs. With an amplified analog output and integrated protection, these current sensors can be placed on either the high or low side of a circuit, thereby enabling easy integration. Their temperature range spans between -40°C and 125°C. Riedon plans to offer a digital output as well, through I2C, RS232, Modbus and CAN interfaces (thus suiting both industrial and automotive installations).10.06.2020 13:30:00Jun\images\news_2020-07-01_14.jpghttps://riedon.com/blog/riedon-introduces-industrys-first-reinforced-isolated-high-power-shunt-modules-take-hall-sensors/riedon.com/blog
Expert to Present at ICEPTIndium Corporation's Dr. Ning-Cheng Lee, Vice Pres...8745PeopleExpert to Present at ICEPTIndium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, will share his industry expertise during the 21st International Conference on Electronic Packaging Technology (ICEPT), Aug. 12-15 in Guangzhou, China. The demand for faster, more powerful devices in the electronics industry makes thermal management a high priority as the need for improved high-performance materials continues to grow. While common thermal interface material (TIM) solutions like thermal grease, thermal gel, solder preforms, and liquid solder all have their own benefits, they can also be subject to common reliability issues like outgassing, voiding, and pump-out. In "Versatile TIM Solution with Chain Network Solder Composite", Dr. Lee examines the development of a novel TIM solution with a high-melting Cu chain network that prevents these defects.10.06.2020 11:00:00Jun\images\news_2020-07-01_6.jpghttps://www.indium.com/corporate/communications/news/indium-corporation-expert-to-present-at-icept/indium.com/news
650 V Gallium Nitride (GaN) TechnologyNexperia has announced a range of GaN FET devices ...8734Product Release650 V Gallium Nitride (GaN) TechnologyNexperia has announced a range of GaN FET devices featuring next-gen high-voltage GaN HEMT H2 technology in both TO-247 and the company's proprietary CCPAK surface mount packaging. Devices achieve superior switching FOMs and on-state performance with improved stability and simplify application designs thanks to their cascode configuration which eliminates the need for complicated drivers and controls. The GaN technology employs through-epi vias, reducing defects and shrinking die size by around 24%. RDS(on) is also reduced to just 41 m&#8486; (max., 35 m&#8486; typ. at 25&deg;C) with the initial release in traditional TO-247, with high threshold voltage and low diode forward voltage. The reduction will further increase, to 39 m&#8486; (max., 33 m&#8486; typ. At 25&deg;C) with CCPAK surface-mount versions. Because the parts are configured as cascode devices, they are also simple to drive using standard Si MOSFET drivers. Both versions meet the demands of AEC-Q101 for automotive applications. Dilder Chowdhury, Nexperia's GaN Strategic Marketing Director commented: : "Customers need a highly-efficient, cost-effective solution for high power conversion at 650 V and around the 30-40 m&#8486; RDS(on), where applications include on-board chargers, DC/DC converters and traction inverters in electric vehicles, and industrial power supplies in the 1.5-5 kW range for titanium-grade rack mounted telecoms, 5G and datacenters."10.06.2020 09:30:00Jun\images\news_2020-06-15_19.jpghttps://www.nexperia.com/about/news-events/press-releases/nexperia-announces-next-generation-650v-gallium-nitride-gan-technology.htmlnexperia.com/press-releases
Array Family for Superior Circuit ProtectionMicrochip Technology announced its newly-expanded ...8748Industry NewsArray Family for Superior Circuit ProtectionMicrochip Technology announced its newly-expanded portfolio of Transient Voltage Suppressor (TVS) vertical arrays – the MDA3KP Transient Voltage Suppressor (TVS), a 3kW diode family of more than 25 products with different screening levels, polarities and qualification standards. Microchip's MDA3KP TVS diode array family – the only available technology offering a comprehensive voltage range tested to a high reliability standard and qualified based on the MIL-PRF-19500 JANTX level equivalence standard – provides an integrated multi-diode solution. These voltage-clamping devices provide fast-reacting Avalanche Breakdown Diode (ABD) features that divert excess current around sensitive components to protect them from electrical overstress. "Digital controls, logic and diagnostic system circuit blocks require highly reliable, secure current and power protection to ensure operations in extreme environments," said Leon Gross, vice president of Microchip's Discrete Product Group business unit. "This diode family also addresses the challenges system designers face with a more efficient vertical construction and requirement for less board space than other devices."09.06.2020 14:00:00Jun\images\news_2020-07-01_9.jpghttps://www.microchip.com/en/pressreleasepage/microchip-introduces-3-kw-transient-voltage-suppressor-diode-array-family-for-superior-circuit-protection-in-harsh-environmentsmicrochip.com/pressreleasepage
Ac-Dc Power Supplies for Medical & Dental ApplicationsCUI announced the addition of four high-density ac...8752Product ReleaseAc-Dc Power Supplies for Medical & Dental ApplicationsCUI announced the addition of four high-density ac-dc power supply series to its medical product family. The VMS-450B, VMS-450B-CF, VMS-450B-CFS, and VMS-450B-CNF offer 450 W of continuous power from compact chassis mount packages. These ac-dc supplies have been designed for space-constrained medical and dental applications where reliability and regulatory compliance are major concerns. The VMS-450B, VMS-450B-CF, VMS-450B-CFS, and VMS-450B-CNF comply with the medical 60601-1 edition 3.1 safety standards for 2 x MOPP applications and 4th edition EMC requirements. These internal medical power supplies additionally offer 5 Vdc AUX output, power factor correction, and over temperature, over voltage, over current, and short circuit protections. With an industry standard 3" x 5" footprint and an open frame package, the VMS-450B is ideal for applications with less space and heat management outside of the unit. The VMS-450B-CF, VMS-450B-CFS, and VMS-450B-CNF come in a metal case with various fan configurations for ultimate flexibility.09.06.2020 12:30:00Jun\images\news_2020-07-01_13.jpghttps://www.cui.com/news/press-releases/introducing-high-density-internal-ac-dc-power-supplies-for-medical-and-dental-applicationscui.com/news
Distributor and Sales Rep Firm of the YearPower management company Eaton announced TTI as Di...8744Industry NewsDistributor and Sales Rep Firm of the YearPower management company Eaton announced TTI as Distributor of the Year in its annual Electronics Distribution Industry Awards for their excellence as a top performing partner and for providing exceptional service and revenue growth. Kruvand Associates is awarded Sales Rep Firm of the Year. The electronics industry faced a very challenging 2019 but TTI and Kruvand's commitment to driving revenue growth, service and field engagement have earned them Eaton's top honor in the electronics industry. TTI is receiving this honor as Distributor of the Year for the seventh consecutive year. "We are honored to recognize TTI and Kruvand for their hard work and commitment to servicing the electronic component industry," said John Janis, VP and general manager, Electronics Division at Eaton. "At Eaton, we partner with companies that share our values. TTI has been a key channel partner and Kruvand an integral sales firm helping drive profitable sales growth as we provide innovative solutions for a growing customer base."09.06.2020 10:00:00Jun\images\news_2020-07-01_5.jpghttps://www.eaton.com/us/en-us/company/news-insights/news-releases/2020/eaton-honors-tti-and-kruvand.htmleaton.com/news-releases
Head of External CommunicationsSusanne Kochs is taking over as Head of External C...8718PeopleHead of External CommunicationsSusanne Kochs is taking over as Head of External Communications at Infineon Technologies. She succeeds Bernd Hops, who took over as Corporate Vice President Communications and Public Affairs & Associations at the start of this year with global responsibility for internal, external and political communications. Susanne Kochs will report to him in her new position. The psychology graduate was previously a member of the Executive Board of Ketchum Germany and at the same time managed the company's Munich agency. Susanne Kochs has more than 20 years' experience in corporate and strategic brand communications. In her career she has worked for well-known B2C and B2B companies from many different branches of industry and advised them primarily in integrated campaign development. In addition to Ketchum, she has also held positions at the international communications agencies Edelman and Emanate.08.06.2020 20:00:00Jun\images\news_2020-06-15_3.jpghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2020/INFXX202006-056.htmlinfineon.com/press
Silicon Catalyst EcosystemSilicon Catalyst and STMicroelectronics jointly an...8717Industry NewsSilicon Catalyst EcosystemSilicon Catalyst and STMicroelectronics jointly announce that ST has joined Silicon Catalyst as both a Strategic and In-Kind Partner. As a Strategic Partner, the collaboration provides STMicroelectronics with early access to review and help select the early-stage silicon start-ups seeking to participate in the Silicon Catalyst Incubator. The initial focus of the In-Kind collaboration will be MEMS sensors and actuators. "Innovation through silicon is driving advancements in technology. Hardware development is challenging, which is why Silicon Catalyst plays a key role in enabling silicon start-ups to develop their technology and fueling the new cycle of semiconductor innovation," said Kirk Ouellette, Vice President Strategic Marketing and Strategy Development, STMicroelectronics. "ST has a strong collaborative R&D and industrialization culture, which makes a perfect fit with Silicon Catalyst. As both a Strategic and In-Kind Partner, ST looks forward to providing guidance and resources for start-up partners as well as gaining access to cutting-edge silicon innovation."  Silicon Catalyst has created a unique ecosystem to provide critical support to semiconductor hardware start-ups, including tools and services from a comprehensive network of In-Kind Partners (IKPs) to dramatically reduce the cost of chip development. In its fifth year of operation, Silicon Catalyst has reviewed over 300 early-stage companies and has now admitted a total of 31 start-ups into the incubator.08.06.2020 19:00:00Jun\images\news_st.pnghttps://newsroom.st.com/media-center/press-item.html/t4268.htmlnewsroom.st.com
U.K. Operation Changes NameMicrochip Technology Inc. has changed the name of ...8727Industry NewsU.K. Operation Changes NameMicrochip Technology Inc. has changed the name of its ultra-low-power computing and memory operation in Caldicot, Wales, from Microsemi Semiconductor Ltd. to Microchip Technology Caldicot Ltd. The organization is the lead partner in the ZeroAMP Project, an industry-driven initiative funded by the Horizon2020 EU Research and Innovation Program that is focused on developing ultra-low power computing and memory solutions using nanomechanical switches that survive extreme environments. The ZeroAMP Project's goal is to develop nanoelectromechanical relay-based field-programmable gate arrays (FPGAs) with integrated non-volatile memory that can work at temperatures up to 300°C with zero current leakage and standby power. Microchip is one of several companies and other organizations collaborating on technology that will build on the past work of consortium partners and incorporate novel materials, switch designs, circuit techniques and advanced 3D stacking. The Project is targeting electronic solutions that unlock the full power of the IoT, aid cryogenic Quantum computing, wirelessly log temperatures deep in industrial processes and advance technologies such as electric vehicles that reduce dependency on fossil fuels.08.06.2020 13:00:00Jun\images\news_zeroamp.pnghttps://www.zeroamp.eu/zeroamp.eu
Webinar: Voltage-Mode or Current-Mode Control?There is a never-ending discussion about the relat...8716Industry NewsWebinar: Voltage-Mode or Current-Mode Control?There is a never-ending discussion about the relative merits of voltage-mode and current-mode control. Issues of output impedance, loop gains, load and line response can paint a very confusing picture if you read everything in the literature. The recent acceleration of switching frequencies to the MHz range has reignited the debate. In the real world of designing converters, the answer is very straightforward, and we will reveal that in this webinar.08.06.2020 06:00:00Jun\images\news_2020-06-15_1.pnghttps://register.gotowebinar.com/register/2593398692601543951ridleyengineering.com
Cooperation on Silicon Carbide Power SolutionsThe powertrain business area of Continental Vitesc...8719Industry NewsCooperation on Silicon Carbide Power SolutionsThe powertrain business area of Continental Vitesco Technologies and ROHM Semiconductor have recently signed a development partnership, beginning in June 2020. Vitesco Technologies will use SiC components to further increase the efficiency of its power electronics for electric vehicles (EV). Through their higher efficiency SiC semiconductors make better use of the electric energy stored in a vehicle battery. Thus, an EV has a longer range, or the battery cost can be reduced without impacting the range. "We are looking forward to the future cooperation with Vitesco Technologies", says Dr. Kazuhide Ino, Corporate Officer, Director of Power Device business unit at ROHM Co.,Ltd. "We are the leading company in SiC power semiconductors and have achieved a significant technological lead in this field along with the provision of power solutions combined with gate driver ICs. Together with Vitesco Technologies we want to further improve the energy efficiency of the electronic system in EVs to use the full potential of the SiC technology for a sustainable mobility."04.06.2020 21:00:00Jun\images\news_2020-06-15_4.jpghttps://www.rohm.com/news-detail?news-title=vitesco-and-rohm-cooperate-on-sic-power-solutions&defaultGroupId=falserohm.com/news
Intersolar Award 2020High-performance solar modules, innovative cell te...8729Event NewsIntersolar Award 2020High-performance solar modules, innovative cell technologies and powerful inverters are among the pioneering products that have made it to the final round of the Intersolar AWARD 2020. The renowned prize honors pioneering technologies for the solar industry. The winners and their innovations will be presented to the market and an audience of international experts on a virtual stage on June 30, 2020. Despite the cancellation of Intersolar Europe 2020 and the postponement of Intersolar South America 2020 due to COVID-19, entrepreneurs will still receive the solar industry's flagship award, the Intersolar AWARD, for their pioneering solar technologies. This year, the award ceremony will be held online on June 30 – along with the ceremonies for the ees and The smarter E AWARD. The winners set trends and motivate the industry to shape the energy future with groundbreaking innovations.04.06.2020 17:00:00Jun\images\news_2020-06-15_14.jpghttps://www.thesmartere-award.com/en/the-smarter-e-award/the-smarter-e-awardthesmartere-award.com
Robust Connection for PowerWR-FAST Fast Connection is the name of a series of...8736Product ReleaseRobust Connection for PowerWR-FAST Fast Connection is the name of a series of THT-configurable male connectors for accommodating single wires with blade receptacles - for example in household appliances. The connectors are available in various blade designs, orientations and dimensions and are intended for current flows up to 16 A and working voltages up to 300 V. Straight or angled contacts in various numbers are available - for the common 6.3 mm blade receptacles but also for the 2.8 mm version. For the latter, the 2863-type WR-FAST connectors are used: the forked blades can accommodate both types of blade receptacles. WR-FAST is designed for operating temperatures from -30 to +120°C. The connectors have passed glow wire testing according to IEC 60335-1 and meet flammability class UL94 V-0. They also have cULus approval. The WR-FAST connector series is now available from stock without a minimum order quantity. Würth Elektronik also offers a Design Kit Interface with free refill service for this product group.04.06.2020 15:30:00Jun\images\news_2020-06-15_21.jpghttps://www.we-online.com/web/en/wuerth_elektronik/news_weg/News_Detail_WE_Gruppe_113043.phpwe-online.com/news
Automotive Electronics Assembly and Packaging WebinarIndium Corporation's Andy Mackie, PhD, MSc, Senior...8723Event NewsAutomotive Electronics Assembly and Packaging WebinarIndium Corporation's Andy Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will host an automotive electronics webinar as part of Indium Corporation's InSIDER Series on Webex at 8 a.m. and 2:30 p.m. EST on Tuesday, July 28. Over the last decade, the evolution of the automobile has been faster than ever before, and the 2020s promise even more rapid progress. The foreseen changes include the nature of car ownership, how the car is powered, increased safety, and driver automation. Each of these changes is only possible with advances in electronics hardware and systems, electronics assembly, and semiconductor packaging. In "What's Driving: Automotive Electronics Assembly and Packaging", Dr. Mackie will discuss the impact of these changes on electronics assembly and packaging, and the impact of mission profiles on component and system level reliability. A live Q&A session will immediately follow his presentation. Indium Corporation's InSIDER Series is a free program designed to deliver expert technical content, share industry knowledge, and promote professional growth using a virtual platform.04.06.2020 15:00:00Jun\images\news_2020-06-15_8.jpghttps://www.indium.com/corporate/communications/news/indium-corporation-announces-automotive-electronics-assembly-and-packaging-webinar/indium.com/news
DC/DC Converter with 5kVAC Reinforced IsolationTRACO Power's 1 Watt, TRV 1M series of High Isolat...8737Product ReleaseDC/DC Converter with 5kVAC Reinforced IsolationTRACO Power's 1 Watt, TRV 1M series of High Isolation DC/DC Converter in a compact SIP-9 package provide 5kVAC I/O isolation with reinforced insulation for both medical and industrial applications. The series consists of 28 models offering a choice of 4.5-5 / 9.6-14.4 / 12-18 / 19.2-28.8 Vin ranges and single / dual outputs from 3.3V – 15V. With continuous short circuit protection and low leakage current of less than 2 µA, these converters are especially suited to protect any connected interfaces or applied parts to patients. Featuring semi-regulated outputs, -40 to +85°C operating temperature without derating and certifications according to IEC/EN/ES 60601-1 3rd ed. for 2xMOPP and IEC/EN/UL 62368-1, this series is suitable for many different applications where high isolation and reinforced insulation with short circuit protection is critical. Products are in stock and available through distributors around the globe with manufacturing lead times of 12-14 weeks.03.06.2020 16:30:00Jun\images\news_2020-06-15_22.jpghttps://www.tracopower.com/de/trv-1m-series-1-watt-dcdc-converter-medical-and-industrial-applicationstracopower.com
Open Frame AC/DC Power SuppliesRECOM announces the launch of its RACM60-K series ...8735Product ReleaseOpen Frame AC/DC Power SuppliesRECOM announces the launch of its RACM60-K series of 60W AC/DC power supplies. RECOM is adding the RACM60-K series to its range of open-frame AC/DC power supplies. The low-profile 2" x 3" design features 90% efficiency across its load range, enabling full-power operation from -40°C to +55°C without forced cooling, and up to +85°C with derating or forced air. Input range is universal 80-264VAC and outputs available are 5V, 12V, 15V, 24V, 36V and 48V. The parts are suitable for a wide range of applications with EN 62368-1, IEC 61558-1/-2-16 and IEC/EN 60335-1 certifications for ITE/audio-visual, industrial and household use respectively up to 5000m operating altitude. Medical safety and EMC certifications meet ANSI/AAMI/IEC/CSA 60601-1 for 2x MOPP with an isolation of4kVAC/1 minute suitable for B and BF applications up to 4000m operating altitude. Class B EMC standards are also met in installation class II or class I PELV with grounded output. The RACM60-K series features full protection against short-circuits, output over-voltage, over-current and over-temperature and has line and neutral fusing for medical applications. No-load input current is only 100mW typical at 230VAC. Various mounting options are available: Molex connectors for wired installation, wave-solder pins for direct PCB mount with built-in stand-offs and a 2" x 4" footprint for legacy design compatibility. A cover is available for the 2" x 4" option.03.06.2020 14:30:00Jun\images\news_2020-06-15_20.jpghttps://recom-power.com/en/company/newsroom/news/rec-n-open-frame-ac!sdcs-feature-high-efficiency-118.html?5recom-power.com/newsroom
IWIPP Call for PapersIWIPP 2021 will be held April 28-30th, 2021, on th...8728Event NewsIWIPP Call for PapersIWIPP 2021 will be held April 28-30th, 2021, on the campus of Aalborg University, in Aalborg, Denmark. IWIPP is a growing and successful power technology workshop with excellent speakers and networking opportunities. The contents of IWIPP 2021 will include a set of keynote addresses from leading experts, a broad range of technical sessions, as well as a complement of technical tutorial sessions, all of which are included in the registration fee.  The International Workshop on Integrated Power Packaging (IWIPP) brings together industry, academic and government researchers in the field of power electronics components, electrical insulating materials, and packaging technologies to facilitate and promote the development and commercialization of high-density and high-efficiency power converters. Invited presentations and contributed papers will range from core materials technology and components to power converters. Presenters will address important challenges and present solutions to increase reliability and manufacturability while targeting improved performance and reduced system cost. 03.06.2020 10:00:00Jun\images\news_iwipp.pnghttp://iwipp.org/conference/call-for-papers/iwipp.org/call-for-papers
Sri Lankan Manufacturing FacilityETAL Group announced the relocation and expansion ...8726Industry NewsSri Lankan Manufacturing FacilityETAL Group announced the relocation and expansion of its Sri Lankan manufacturing facility, thanks to the increased demand and growth that the company has experienced. The new site in Piliyandala commenced operations in the first quarter of 2020, following transfer of production from its Rathmalana facility. The purpose designed and fully air-conditioned factory provides room for further expansion, with no disruption to customer service, and offers them a valuable alternative source for volume production of magnetic components outside of China. As with all ETAL Group manufacturing facilities, following the relocation, ETAL Group Pvt Ltd remains fully certified to ISO 9001, 14001 and 45001. Commenting, Scott Robinson, General Manager of ETAL Group Pvt Ltd who has managed ETAL's operations in Sri Lanka for over 20 years said, "Our exciting new facility provides us with the infrastructure to produce higher volumes and the space to add to our existing capabilities going forward. Its opening is a just reward for our dedicated team of employees, many of whom have been with us since the conception of the company. Currently we employ 250 workers in Sri Lanka and have the additional space required to more than double this, meeting growing demand for our consistently high-quality products."03.06.2020 09:00:00Jun\images\news_2020-06-15_11.jpghttps://www.etalgroup.com/sri-lankan-expansion-for-etal/etalgroup.com
High-Density Packaging TechnologyKEMET Corporation continues to strengthen its powe...8738Product ReleaseHigh-Density Packaging TechnologyKEMET Corporation continues to strengthen its power conversion solutions by extending its popular KC-LINK range using KONNEKT high-density packaging technology to meet the growing demand for fast-switching wide bandgap (WBG) semiconductors, EV/HEV, LLC resonant converters, and wireless charging applications. This technology combines KC-LINK's robust and proprietary C0G Base Metal Electrode (BME) dielectric system with KONNEKT's innovative Transient Liquid Phase Sintering (TLPS) material to create a surface mount multi-chip solution well-suited for both high-density packaging and high-efficiency applications, producing up to four times the capacitance compared to a single multi-layer ceramic capacitor. High mechanical robustness allows KC-LINK capacitors with KONNEKT to be mounted without the use of lead frames. This design provides extremely low effective series inductance (ESL), increasing the operating frequency range and allowing for further miniaturization. Available in commercial grade with tin termination finish, this series is Pb-Free, RoHS and REACH compliant. Capacitors utilizing KONNEKT technology have the unique ability to be mounted in a low-loss orientation to increase their power handling capability further. Combining KEMET's revolutionary Class 1 C0G dielectric system with KONNEKT technology offers a low-loss, low-inductance package capable of handling extremely high ripple currents with no change in capacitance versus DC voltage and negligible change in capacitance versus temperature. Designed for an operating temperature range up to 150°C, the capacitor can be mounted close to fast switching semiconductors in high power density applications, which require minimal cooling.02.06.2020 17:30:00Jun\images\news_2020-06-15_23.jpghttp://newsroom.kemet.com/news-releases/news-release-details/kemet-extends-kc-linktm-range-using-konnekttm-high-densitynewsroom.kemet.com
Program and Registration OnlineThis year, the "PCIM Europe digital days" will be ...8722Event NewsProgram and Registration OnlineThis year, the "PCIM Europe digital days" will be taking place as a virtual event from 7 – 8 July 2020. As ever, the event will cover innovations and developments in the field of power electronics. Participants can learn more about the latest trends in power electronics with the high-caliber lecture program online. For participants, a total of more than 250 video-on-demand presentations and interactive live discussions will be available free of charge. They can also inform themselves about product innovations from more than 50 participating companies. Over two days, the online conference program features numerous outstanding short presentations from international experts from industry and academia and deals with key development trends in power electronics. Taking part in the "PCIM Europe digital days" 2020 is free of charge for users; companies can participate in the event in the form of a digital exhibitor profile, through sponsoring or by providing a presentation on-demand. More than 50 companies have already confirmed their participation in the "PCIM Europe digital days", including industry leaders such as Infineon, Rohm Semiconductor, Mitsubishi Electric, Varta and Wolfspeed.02.06.2020 16:00:00Jun\images\news_pcimeurope-digitaldays.jpghttps://pcim.mesago.com/nuernberg/en/press/press-releases/pcim-press-releases/program-registration-online.htmlpcim.mesago.com/press
Expanding eCommerce FootprintMonolithic Power Systems announced that the compan...8724Industry NewsExpanding eCommerce FootprintMonolithic Power Systems announced that the company is entering into a distribution agreement with Farnell Electronics. This partnership will give customers access to MPS's extensive portfolio of high-performance, highly integrated power solutions in industrial applications, telecom infrastructures, cloud computing, automotive, and consumer applications. MPS's patented technologies integrate the maximum number of components into a single package, providing an entire power system in one device and accelerating customers' time to market. Farnell Electronics has a comprehensive product portfolio that is supported by an international supply chain with six distribution centers across the world and local transaction websites in 43 countries. This distribution agreement will allow MPS to leverage Farnell's experience and global presence to provide extensive power product offerings to customers of all sizes. "We are excited to partner with Farnell Electronics," says Maurice Sciammas, Senior VP of Sales & Marketing. "I am confident that with Farnell's two million plus customer contacts, and their excellent engineering community, they will expand MPS's growth in EMEA and APAC." Lee Turner, Global Head of Semiconductors and SBC for Farnell says, "MPS is a true innovator in the semiconductor market, and this new agreement allows us to deliver the highest quality power solutions to customers in industrial, telecom, cloud, automotive, and consumer applications whilst further bolstering Farnell's global power portfolio."02.06.2020 14:00:00Jun\images\news_monolithicpower.pnghttps://www.monolithicpower.com/en/about-mps/investor-relations/press-releases.html?pressrelease=377monolithicpower.com/press-releases
Global Franchise AgreementRichardson RFPD announced that it has entered into...8721Industry NewsGlobal Franchise AgreementRichardson RFPD announced that it has entered into a global franchise agreement with AVX Corporation. AVX's newest division, AVX RF Solutions, manages and works to expand the already extensive portfolio of leading-edge microwave and RF components. AVX RF Solutions encompasses AVX's RF products along with RF products from two additional AVX brands-American Technical Ceramics and Ethertronics. The global agreement between Richardson RFPD and AVX covers the products managed by the AVX RF Solutions division, as well as AVX's power film capacitors and SuperCapacitors. The primary product lines covered by the new agreement include antennas, capacitors, couplers, crossovers, filters and inductors. "We are excited about the technology and solutions that AVX represents," said Rafael R. Salmi, Ph.D., Richardson RFPD's president. "These products are an excellent fit for our customers, and we look forward to building on our long-time success working with American Technical Ceramics." "We believe that our history of developing highly engineered products is a good match for Richardson RFPD's longtime dedication to building teams of specialized engineers," said Alex Schenkel, senior vice president, global sales. "We look forward to mutual successes extending across the automotive, consumer, telecommunications, military, and aerospace market segments."01.06.2020 18:00:00Jun\images\news_richardsonrfpd.jpghttps://www.richardsonrfpd.com/docs/rfpd/Richardson_RFPD_Announces_Agreement_with_AVX_RF_Solutions_FINAL.pdfrichardsonrfpd.com
Isolated Power TransceiversAnalog Devices, Inc. introduced the ADM2867E serie...8732Product ReleaseIsolated Power TransceiversAnalog Devices, Inc. introduced the ADM2867E series of reinforced iCoupler isolated RS485 + integrated isolated dc-to-dc converters. These parts provide low radiated emissions and enable solutions that meet EMC compliance with fewer board spins and budget overruns. The transceivers' simplified PCB layout and small SOIC form factor pack more functionality into space constrained applications than the previous generation as well as current products offered by competitors. This isolated RS485 + integrated isolated power transceiver series includes smart features that reduce end system install and debug time allowing for easy correction of installation-based connection errors. With the trusted safety of iCoupler digital isolation and IEC 61000-4-2 ESD, signal integrity is maintained in the harshest of environments.01.06.2020 12:30:00Jun\images\news_2020-06-15_17.jpghttps://www.analog.com/en/products/adm2867E.htmlanalog.com/products
MOSFET for High Voltage Auxiliary Power SuppliesInfineon Technologies complements its CoolSiC MOSF...8731Product ReleaseMOSFET for High Voltage Auxiliary Power SuppliesInfineon Technologies complements its CoolSiC MOSFET offering with yet another voltage class. Having added 650 V to the portfolio earlier this year, the company is now launching the 1700 V class with its proprietary trench semiconductor technology. Maximizing the strong physical characteristics of silicon carbide (SiC), this ensures that the new 1700 V surface-mounted devices (SMD) offer superior reliability, as well as low switching and conduction losses. The CoolSiC MOSFETs 1700 V are targeting auxiliary power supplies in three-phase conversion systems such as motor drives, renewables, charging infrastructure and HVDC systems. Such low-power applications usually operate below 100 W. In these cases, designers very often prefer a single-ended flyback topology. With the new CoolSiC MOSFETs 1700 V in SMD package, this topology is now even enabled for DC-link connected auxiliary circuits up to 1000 V DC input voltage. High efficiency and high reliability auxiliary converters using a single-ended flyback converter can now be implemented in three-phase power conversion systems. This leads to smallest footprints and a reduced bill-of-materials. "Trench technology of a CoolSiC MOSFET balancing performance and reliability in operation is now available for 1700 V", said Dr. Peter Friedrichs, Senior Director SiC at the Industrial Power Control Division of Infineon. "It combines the best of SiC properties: low losses with small footprint, in a high voltage SMD package. This helps our customers to significantly reduce the complexity in their auxiliary power supplies".29.05.2020 11:30:00May\images\news_2020-06-15_16.pnghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2020/INFIPC202005-062.htmlinfineon.com/press
Non-Isolated, Buck-Boost DC-DC ConvertersTDK Corporation announces the introduction of the ...8757Product ReleaseNon-Isolated, Buck-Boost DC-DC ConvertersTDK Corporation announces the introduction of the i7C series of 8A 300W rated non-isolated DC-DC converters, packaged with the industry standard 1/16th pinout. The output voltage of these step-up and step-down converters can be adjusted from 9.6 to 48V and accept a wide range input voltage of 9 to 53V. The converters seamlessly transition from buck to boost mode operation without disruption in performance. The i7C 8A series can be used to derive additional high-power outputs from a 12V, 24V, 36V or 48V DC power supply, at a much lower cost than isolated DC-DC converters. With efficiencies of up to 97%, these compact products are ideally suited for use in medical, communications, industrial, test and measurement, broadcast and portable battery powered equipment. During light load conditions, the i7C's control circuitry significantly reduces power consumption. At zero load, the input current draw is typically just 5mA, which can be reduced to around 0.25mA when the remote on-off is used to put the converter into standby. This extends the time battery powered equipment can remain functional, during periods of non-peak operation. Three mechanical configurations are available, measuring just 36.8mm wide and 34mm in length.28.05.2020 17:30:00May\images\news_2020-07-01_18.jpghttps://www.emea.lambda.tdk.com/uk/news/article.aspx?cid=16172lambda.tdk.com/news
EMV 2021: Call for WorkshopsExperts from industry and science will have the op...8720Event NewsEMV 2021: Call for WorkshopsExperts from industry and science will have the opportunity to submit topics for the practice-oriented workshops at the EMV 2021. This allows their industry-specific knowledge to be passed onto a qualified expert audience. The workshop program will be compiled in September by a twenty-member committee, headed by Professor Dr.-Ing. Marco Leone from the Otto-von-Guericke University Magdeburg. Speakers are able to benefit from valuable contacts in the workshops and trade fair, at which exhibitors from all over the world will present their latest products, innovations and services on electromagnetic compatibility. "The EMV 2021 in Stuttgart offers experts in this field a unique opportunity to present theoretical and practical knowledge in a target-oriented manner and to establish new contacts", commented Prof. Dr.-Ing. Marco Leone.28.05.2020 11:00:00May\images\news_2020-06-15_5.jpghttps://emv.mesago.com/stuttgart/en/press/press-releases/emv-press-releases/call-for-workshops.htmlemv.mesago.com/press
300W Non-isolated, Buck-boost DC-DC ConvertersTDK Corporation announces the introduction of the ...8730Product Release300W Non-isolated, Buck-boost DC-DC ConvertersTDK Corporation announces the introduction of the i7C series of 8A 300W rated non-isolated DC-DC converters, packaged with the industry standard 1/16th pinout. The output voltage of these step-up and step-down converters can be adjusted from 9.6 to 48V and accept a wide range input voltage of 9 to 53V. The converters seamlessly transition from buck to boost mode operation without disruption in performance. The i7C 8A series can be used to derive additional high-power outputs from a 12V, 24V, 36V or 48V DC power supply, at a much lower cost than isolated DC-DC converters. With efficiencies of up to 97%, these compact products are ideally suited for use in medical, communications, industrial, test and measurement, broadcast and portable battery powered equipment. During light load conditions, the i7C's control circuitry significantly reduces power consumption. At zero load, the input current draw is typically just 5mA, which can be reduced to around 0.25mA when the remote on-off is used to put the converter into standby. This extends the time battery powered equipment can remain functional, during periods of non-peak operation. Three mechanical configurations are available, measuring just 36.8mm wide and 34mm in length. The 12.2mm high open frame model is most suitable for applications requiring a very low profile. A baseplate version for conduction cooling to a cold plate is 13mm high, or models with an integral heatsink for convection or forced air cooling are 24.9mm high.28.05.2020 10:30:00May\images\news_2020-06-15_15.jpghttps://www.emea.lambda.tdk.com/uk/news/article.aspx?cid=16172emea.lambda.tdk.com/news
Know-how and Expertise in LinzDICE (Danube Integrated Circuit Engineering) is no...8762Industry NewsKnow-how and Expertise in LinzDICE (Danube Integrated Circuit Engineering) is now operating under the name Infineon Technologies Linz. As a second major development in May, the company also moved into its new research building despite the current Covid-19 challenges. After Infineon Austria had acquired all shares in the associated company, DICE GmbH & Co KG in Linz last year, the next forward-looking step was taken by renaming the company Infineon Technologies Linz GmbH & Co KG. The new name creates an ever-stronger link between the know-how and expertise of the Linz-based team and the power of the Infineon brand, and increases visibility at regional, national and international level. "The Development Center in Linz has become the global center of competence in high-frequency technologies within the Infineon Group and is of strategic importance for us", says Sabine Herlitschka, CEO Infineon Austria. "It is here that the key technologies for mobile radio applications and driver assistance systems for autonomous driving are developed. Increasing digitization through the Internet of Things and 5G technology applications will lead to a further increase in the demand for the excellent high-frequency innovations from Linz." The relocation to the new company building in Donaufeldstrasse 5 in Linz will be finalized by the end of May. The property developer completed the four-storey building with a floor space of 9,630 sqm on schedule after a 12-month construction period with every pandemic health precaution in place.28.05.2020 10:00:00May\images\news_2020-07-15_5.jpghttps://www.infineon.com/cms/austria/en/press/GJ1920/dice-infineon.htmlinfineon.com/austria/press
Fixed-resolution and FlexRes OscilloscopeThe PicoScope 6000E Series compact 4+16 channel MS...8733Product ReleaseFixed-resolution and FlexRes OscilloscopeThe PicoScope 6000E Series compact 4+16 channel MSOs deliver cost-effective test and debugging solution for engineers, developers and scientists. Pico Technology has expanded its PicoScope 6000E Series oscilloscopes with the launch of three 4-channel models, each of which can be configured with 16 optional digital channels. With bandwidths of 300 or 500 MHz, 8-bit or 8/10/12-bit Flexible Resolution and up to 4 GS deep capture memory, these products enhance the existing PicoScope 6000E portfolio, adding to the 8-channel models that were introduced earlier in the year. The expansion of the PicoScope 6000E Series is an exciting development as it addresses mainstream test engineering requirements that are faced by engineers developing next-generation embedded systems.27.05.2020 13:30:00May\images\news_2020-06-15_18.jpghttps://www.picotech.com/oscilloscope/6000/picoscope-6000-overviewpicotech.com
Chief Executive OfficerNXP Semiconductors announced that at its Annual Ge...8725PeopleChief Executive OfficerNXP Semiconductors announced that at its Annual General Meeting of Shareholders ("AGM"), shareholders overwhelmingly approved the appointment of Kurt Sievers as an executive director and the company's Chief Executive Officer, effective immediately. In this capacity Mr. Sievers will also remain President of NXP, a role he has held since 2018. As previously announced, Richard "Rick" Clemmer, who previously led the company for 11 years, will remain a strategic advisor to NXP. "I am truly humbled and honored to have been granted the opportunity to lead this fine company – a company that I am proud to have been with since our founding in 2006," said Kurt Sievers. "While we face unprecedented times, I remain confident in our winning strategy to develop and profitably grow market leading and highly differentiated businesses, and continue to foster a culture of innovation and collaboration. I look forward to continuing to work alongside the very best and brightest team and I am committed to ensure the safety and well-being of each and every one of our employees as we weather the pandemic. I could not be prouder of how we have adapted and stayed focused in these times, and I am confident that we will emerge from this stronger, leading NXP into its promising future."27.05.2020 12:00:00May\images\news_2020-06-15_10.jpghttps://media.nxp.com/news-releases/news-release-details/nxp-semiconductors-shareholders-elect-kurt-sievers-chiefmedia.nxp.com
200kW, 250kW and 300kW Inverter Reference DesignsRichardson RFPD, Inc. announced the in-stock avail...8739Product Release200kW, 250kW and 300kW Inverter Reference DesignsRichardson RFPD, Inc. announced the in-stock availability and full design support capabilities for three inverter reference designs from Wolfspeed, a Cree Company. The 200 kW CRD200DA12E-XM3, 250 kW CRD250DA12E-XM3 and 300 kW CRD300DA12E-XM3 three-phase inverters enable more than twice the power density of comparable silicon-based designs, with greater than 98% efficiency. Switching frequency is set by the user, up to 80 kHz. The CRD200DA12E-XM3, CRD250DA12E-XM3 and CRD300DA12E-XM3 use the CAB400M12XM3, CAB425M12XM3 and CAB450M12XM3 modules, respectively, as well as the CGD12HBXMP gate driver. These reference designs demonstrate the best-in-class system-level power density and efficiency obtained by using Wolfspeed's new XM3 power module platform. The XM3 power module platform is optimized for SiC MOSFETs in a high-density, low-inductance footprint, which reduces system-level losses and simplifies the overall system design. Applications include high-power density new product development, high-frequency converters, vehicle traction inverters, active front ends, uninterruptible power supplies, industrial motor drives, energy storage, grid-tied distributed generation (solar and wind), and smart-grid and flexible AC transmission systems. To find more information or to purchase these products online, visit the XM3 Module Platform webpage.26.05.2020 18:30:00May\images\news_richardsonrfpd.jpghttps://www.richardsonrfpd.com/docs/rfpd/Richardson_RFPD_Announces_Availability_Inverter_Reference_Designs_from_Wolfspeed.pdfrichardsonrfpd.com
Partnership Agreement SignedFoxy Power, Berlin, Germany-based Strategy, Busine...8695Industry NewsPartnership Agreement SignedFoxy Power, Berlin, Germany-based Strategy, Business Development, and Sales company with its unique Product Value Maximization approach is proud to announce its partnership with IQ evolution. IQ evolution is an Aachen, Germany based manufacturer of 3D-printed liquid cooled heatsinks; enabling thinner, ultra-light weight, high performant cooling in applications such as EV’s, Aviation and others where limited size and volume, highest power density, highest efficiency, and low weight are key. “IQ Evolution nickel based cooler are already established in the high power Laser market”, says Dr. Ebert, CEO and Founder of IQ Evolution“ and signing Foxy Power as our strategic partner for Business development and Sales will enable us to expand into various power electronic applications.” “The stainless steel heatsinks enable a cooling performance greater than 150W/cm² and in collaboration with RWTH Aachen a 20kW converter was demonstrated achieving a world record of 100kW/l or 33kW/kg”, adds Christopher Rocneanu, CEO and founder of Foxy Power GmbH. IQ evolution technology starts where conventional liquid cooling technology resigns.25.05.2020 08:00:00May\images\news_2020-06-01_3.jpgmailto:sales@foxypower.comsales@foxypower.com
VLSI Technology & Circuits Celebrates its 40th Year with a Virtual Conference  The 2020 Symposia on VLSI Technology & Circuits wi...8699Event NewsVLSI Technology & Circuits Celebrates its 40th Year with a Virtual Conference  The 2020 Symposia on VLSI Technology & Circuits will celebrate its 40th year the premier international conference on VLSI semiconductor technology and the applications they enable. Held for the first time as a virtual conference due to concerns over the global COVID-19 pandemic, the Symposia is organized around the theme “The Next 40 Years of VLSI for Ubiquitous Intelligence,” and will be held on a fully-overlapping schedule online from June 15th – 18th, 2020. A single registration fee includes both events. The Symposia program provides a unique perspective on the microelectronics industry by integrating the technology ecosystem of converging industry trends – machine learning, IoT, artificial intelligence, wearable/implantable biomedical applications, big data, cloud / edge computing, virtual reality (VR) / augmented reality (AR), robotics, and autonomous vehicles – with the advanced circuit design and application platforms that will realize the future promise of “ubiquitous intelligence.” The weeklong virtual conference will feature of technical presentations, plenary sessions, panel discussions, joint focus sessions, and Short Courses presented in an online format. 22.05.2020 12:00:00May\images\news_2020-06-01_7.jpghttps://vlsisymposium.org/vlsisymposium.org