Bodo's News

Read through my personal pick of news around people, our industry, important events and interesting product releases. Or click on a filter and pick your area of interest!

 

APEC 2021 Moves to Virtual Event Format
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Learn more:
apec-conf.org
  • Event News
  • 2021-04-01

Continued global travel restrictions, unknown guidance on large gatherings, as well as social distancing protocols make it impossible to move forward with an in-person event at this time. APEC 2021 will be presented on the virtual event platform Social27 and will take place Monday, June 14 - Thursday, June 17 with on demand access starting the week of June 7. APEC is partnering with Social27, a virtual event platform, to ensure that the conference provides the same quality content that APEC conference attendees are accustomed to. Closer to the conference, APEC will host a training webinar that will walk you through the virtual meeting platform. Attendees will be granted access to the virtual event platform and all on-demand sessions during the week of June 7, 2021. On-demand recordings will include: technical session lectures and dialogues (poster sessions), industry sessions, and professional education seminars. This will also provide attendees with time to build their attendee profiles, and get acquainted with the site.

Laser Driver IC Family for Augmented Reality
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Learn more:
epc-co.com/News
  • Product Release
  • 2021-03-23

EPC announces the introduction of a laser driver that integrates a 40 V, 10 A FET with a gate driver and low-voltage differential signaling (LVDS) logic level input in a single chip for time-of-flight lidar systems used in robotics, drones, augmented reality, and gaming applications. The EPC21603 is a laser driver that is controlled using LVDS logic and is capable of very high frequencies exceeding 100 MHz and super short pulses (< 2 ns) to modulate laser driving currents up to 10 A. The EPC21603 is a single-chip driver plus eGaN FET using EPC's proprietary GaN IC technology in a chip-scale BGA form factor that measures only 1.5 mm x 1.0 mm. The LVDS logic control allows the eToF laser driver IC to be controlled from an FPGA for applications where noise immunity is critical, such as augmented reality. "The EPC21603 joins the recently announced EPC21601 as the initial products in our new family of GaN ICs that dramatically improve the performance while reducing size and cost for time-of-flight lidar systems," said Alex Lidow, CEO, and co-founder of EPC. "This new family of GaN integrated circuits will continue to expand to higher currents, higher voltages, as well as furthering integration of additional control and logic features on a single chip."

Hall-effect Current Sensor Without a Core or U-Shaped Magnetic Shield
  • Product Release
  • 2021-03-23

Allegro MicroSystems announced a coreless Hall-effect current sensor for demanding automotive and industrial systems, offering higher accuracy and sensitivity, additional fault detection capabilities, and user programmability. Allegro's ACS37610 sensor joins the ACS37612 as a family of truly coreless Hall sensing solutions designed to measure currents from 100 A to greater than 4000 A flowing through a busbar or PCB trace with a typical 1 percent accuracy – with no need for an external concentrator or U-shaped magnetic shield. These solutions enable system designers to achieve enhanced efficiency and higher power density while reducing system complexity, BOM, cost, footprint, and weight. "As a leading innovator in current sensing solutions for more than 20 years, Allegro was first to market with coreless differential Hall-effect current sensing technology, and our new ACS37610 IC enables our customers to accurately measure hundreds or thousands of amps in a very economical and simple way," said Shaun Milano, Director of Current Sensors at Allegro. "Our differential Hall-based sensors provide excellent immunity to stray magnetic fields without the need of a shield, required by competing solutions, that slows down response and adds non-linearity error into the system." The ACS37610 is an optimal choice for electric vehicle high-voltage traction motor inverters, 48V / 12V auxiliary inverters, heterogeneous redundant battery monitoring, overcurrent detection, smart fuses, power distribution units (PDUs), and power supplies. The sensor's 250 kHz bandwidth, dedicated overcurrent and overtemperature fault pin, and a slew of built-in diagnostics make it ideal for safety-critical applications.

AC-DC Active Bridge Rectifier Solutions
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Learn more:
aosmd.com/news
  • Product Release
  • 2021-03-23

Alpha and Omega Semiconductor announced a family of active AC-DC bridge rectifiers. Aptly trademarked AlphaZBL for "zero bridge loss," this family of products virtually eliminates the bridge rectifier losses in AC-DC power supplies and adaptors. Typical end applications include high power 100W and above adaptors used for high-end laptops and televisions as well as power supplies for Desktops, Game consoles, Servers, and Telecom. The first two members of the family include a controller, AOZ7200, in a SOT-23 package and an integrated product AOZ7270, which integrates a 600V, 190mOhm MOSFET in a DFN 5x7 package. The AOZ7200 offers maximum flexibility to trade off performance and cost by pairing it with AOS's benchmark super junction family of MOSFETs. The AOZ7270 takes advantage of AOS's capabilities in novel IC design, benchmark MOSFET technology, and innovative packaging to reduce component count and design time. Both products are self-powered from the AC line and do not require external circuitry. The proprietary self-biasing scheme sips minimal power from the AC line making it very efficient in light load or standby mode of operation. In a typical 100W application, the AOZ7270DI delivers efficiency improvements of 0.89% at 115VAC and 0.44% at 230VAC over a diode bridge. Both products exceed lightning surge requirements that are a critical requirement in AC-DC applications.

Dr. Tobias Geyer Honored with Innovation Award
  • Industry News
  • 2021-03-23

This year the jury has decided to give the SEMIKRON Innovation Award to Dr. Tobias Geyer from ABB Medium-Voltage Drives, Switzerland to acknowledge his pioneering work in the field of Model Predictive Control awarding his innovation regarding ´Model Predictive Pulse Pattern Control´. Optimized pulse patterns (OPPs) minimize the current distortions per switching frequency during steady-state operation, but achieving high dynamic performance is generally considered impossible. Model predictive pulse pattern control (MP3C) solves this problem by formulating and solving a model predictive control problem. The stator flux vector is controlled along its optimal trajectory by modifying the switching instants of the OPP's switching transitions. MP3C combines the benefits of hysteresis control methods, such as direct torque control, with the optimal steady-state performance of OPPs, by resolving the antagonism between the two. MP3C has been successfully demonstrated and proven in an ABB medium-voltage drive. The control innovation increases the drive's power by up to 50% at high fundamental frequencies.
This year's SEMIKRON Young Engineer Award is given to Dr. Jakub Kucka (now EPFL École Polytechnique Fédérale de Lausanne) for his work on ´Quasi-Two-Level PWM Operation for Modular Multilevel Converters´ he has conducted at the Institute for Drive Systems and Power Electronics of Leibniz University Hannover, Germany. The novel quasi-two-level PWM operation mode revolutionizes the way how the modular multilevel converters are operated in low-frequency medium-voltage drive applications. Thanks to the quasi-two-level PWM operation, the amount of installed modules' capacitance in the modular multilevel converters can be reduced by more than one order of magnitude.

Search Engine of Electronic Components
  • Product Release
  • 2021-03-23

SnapEDA and DipTrace are announcing a collaboration that introduces support for DipTrace on the SnapEDA website, and integrates SnapEDA's massive computer-aided design (CAD) database directly into DipTrace's latest PCB design software. With billions of electronic components to choose from, engineers are faced with multiple challenges during the component selection stage. First, engineers need to filter an overwhelming number of electronic components to select one with the best form, fit and function for their design. And once they've made their selection, they need to source or create digital models for that electronic component, in order to integrate it. The SnapEDA search capability now available within DipTrace 4.1.2 solves both of these challenges to help engineers select and integrate electronic components in a snap. Finding components is as simple as searching the part needed, such as '25 MHz crystal', and once an engineer selects a part, it comes ready-to-use with its schematic symbol, PCB footprint and 3D model for instant design-in. "DipTrace has consistently been one of the most requested formats over the last year. We are thrilled to be able to introduce DipTrace support to the SnapEDA community, and collaborate to provide a native SnapEDA experience within the latest version of DipTrace," said Natasha Baker, CEO & Founder of SnapEDA.

AC-DC Converter ICs for Appliances, Sensors and Metering Applications
  • Product Release
  • 2021-03-23

Power Integrations announced a member of its acclaimed LinkSwitch-TN2 AC-DC converter family. The LNK3207 ICs facilitate higher-power offline buck converter designs for appliances and industrial applications by increasing the available output current from 360 mA to 575 mA, while also reducing BOM count. Power Integrations' LinkSwitch-TN2 ICs increase output current from 360 mA to 575 mA & target mass-market appliances such as washers, dryers, coffee makers and more. Design engineers can easily upgrade existing designs while reducing BOM count. Silvestro Fimiani, product marketing manager at Power Integrations said: "These LinkSwitch-TN2 ICs are pin-to-pin compatible with previous generations, making it simple for customers to upgrade to higher-power designs. A high-current buck converter can be created using a minimal number of easily available components while saving at least one diode over previous solutions." The LNK3207 AC-DC converter ICs increase the available current by 60% while also delivering greater than 80% efficiency and no-load consumption of less than 30 mW. Each monolithic LinkSwitch-TN2 IC incorporates a 725 V power MOSFET, oscillator, on/off control for high efficiency at light load, a high-voltage switched current source for self-biasing, frequency jittering, fast (cycle-by-cycle) current limit, hysteretic thermal shutdown, and output and input overvoltage protection circuitry. The LinkSwitch-TN2 ICs target mass-market appliances such as washers, dryers and coffee makers, which benefit from their design simplicity. They are also suitable for sensor-based devices that require low power such as home security cameras and smart thermostats, as well as metering and IoT installations. Devices are available in three packages, PDIP-8C, SMD-8C and SO-8C, for design flexibility. The SMD-8C package is ideal for high-temperature ambient 85/105 °C applications.

85/85 THB-rated AC Filter Capacitors for Harsh Environments
  • Product Release
  • 2021-03-22

Designed for harsh environments, Cornell Dubilier's ALH series of AC-rated filter capacitors offer 50% greater life than competitive 85/85 THB-rated film capacitors. The Temperature, Humidity at Bias (THB) test exposes parts to the harsh conditions of 85 °C at 85% relative humidity with rated voltage applied. CDE's testing has been validated for 1,500 hours, while competitors validate their series for 1,000 hours under the same conditions. This demanding test simulates the extremely harsh operating conditions encountered in many commercial and industrial inverter applications that can cause conventional film capacitors to fail early due to heat and moisture penetration. The ALH Series is optimized for AC harmonic filtering on the input and output sides of inverter circuits. Capacitance ranges from 0.22 to 50 µF at 160-450 Vac, 50/60Hz with high rms current ratings for handling higher ordered harmonics. The series offers self-healing, metalized polypropylene-film construction in a robust board-mount package that also meets the rigors of automotive AEC Q200 testing. The solvent-resistant, box-style plastic case and resin-seal are both UL/cUL 94V-0 recognized for construction designs, with tin-plated copper RoHS compliant terminations. Their superior construction makes these capacitors ideally suited for solar, wind, UPS, EV, and other inverter applications that may be subjected to wide-ranging environmental conditions.

Synchronous DC-DC Inverting Converters for Industrial Automation and Signal Conditioning
  • Product Release
  • 2021-03-22

As Maxim Integrated's first 60V inverting DC-DC converters with integrated level shifters, the MAX17577 and MAX17578 save up to 72 percent of board space by reducing component count by half while using 35 percent less energy than the closest competitive solutions. Both ICs reduce size, heat, and cost, while simplifying the design of negative output voltage rails needed for analog signals within intelligent IoT devices found in factory automation, building automation and communications systems. As network edge devices expand with Artificial Intelligence capabilities, designers must reduce the solution size and heat generation. They seek solutions that are more efficient, creating less heat and use less board space, saving time and cost. The MAX17577 and MAX17578 integrate level shifting circuitry to reduce component cost and count by as much as 50 percent while reducing component area to 60 mm2, a 72 percent advantage in board space over competitive solutions. These synchronous inverting converters protect against input voltage transients with the industry's widest input voltage range from 4.5V to 60V, thus increasing system robustness in harsh environments. The MAX17577 and MAX17578 generate less heat by dissipating 35 percent less power than competitive solutions, improve system reliability and provide developers with up to six percentage points more efficiency.

Sustainable Operation of Trains
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Learn more:
infineon.com/press
  • Industry News
  • 2021-03-18

Siemens Mobility and Infineon Technologies have jointly developed auxiliary converters to improve the efficiency of on-board power systems using power semiconductors based on silicon carbide (SiC). Siemens uses the converter for various train platforms. As a result, the platforms are maintenance-friendly, reliable, economical and, above all, power efficient. "With SiC, we achieve higher switching speed as well as efficiency to reduce the size of transformers, capacitors, cooling elements and the housing unit. The advantages of this semiconductor material are evident and are now being leveraged in rail-bound vehicles," said Dr. Peter Wawer, President of Infineon's Industrial Power Control Division. In addition to providing the AC voltage (e.g., 3 AC 400 V 50 Hz) required for the vehicle power system, auxiliary converters also deliver the required battery voltage (e.g., 110 V DC). To achieve this, they convert the DC voltage provided at the converter input. They ensure that train passengers can charge laptops and smartphones; the air conditioning and ventilation systems are running; and the on-board restaurant can offer hot and cold drinks and food. Without them, connectivity, information or entertainment services on trains would not be available. As part of the system, SiC reduces the overall costs in the on-board electrical system and the energy consumption of the auxiliary converter. It also enables more compact and lighter converter designs, along with a modular and service-friendly design to ensure lower maintenance costs.

Isolated Gate Driver Safely Controls Silicon-Carbide MOSFETs
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Learn more:
newsroom.st.com
  • Product Release
  • 2021-03-18

Joining STMicroelectronics' STGAP family of isolated gate drivers, the STGAP2SiCS is optimized for safe control of silicon carbide (SiC) MOSFETs and operates from a high-voltage rail up to 1200V. Capable of producing a gate-driving voltage up to 26V, the STGAP2SiCS has a raised Under-Voltage Lockout (UVLO) threshold of 15.5V to meet the turn-on requirements of SiC MOSFETs. If the driving voltage is too low, which can be caused by low supply voltage, the UVLO ensures the MOSFET is turned off to prevent excessive dissipation. The driver features dual input pins that let designers determine the gate-drive signal polarity. With 6kV of galvanic isolation between the input section and the gate-driving output, the STGAP2SiCS helps ensure safety in consumer and industrial applications. Its 4A output-sink/source capability is suited to mid- and high-power convertors, power supplies, and inverters in equipment such as high-end home appliances, industrial drives, fans, induction heaters, welders, and UPSes. Two different output configurations are available. One has separate output pins that allow independent optimization of turn-on and turn-off times using a dedicated gate resistor. The second is featured for high-frequency hard switching, with a single output pin and active Miller clamp that limits oscillation of the SiC MOSFET gate-source voltage to prevent unwanted turn-on and enhance reliability. The input circuitry is compatible with CMOS/TTL logic down to 3.3V, which allows easy interfacing with a wide variety of control ICs.

Webinar on Power Electronics Design
  • Event News
  • 2021-03-18

Saber solutions will host a webinar on “Power Electronics Design with SaberEXP and SaberRD” on April 13th. With increased focus on electrification and rapid growth of the power electronics market, design teams need a robust and efficient simulation and modeling solution to predict hardware failures during early design phases. Simulation helps to reduce iterations of hardware prototypes and time-to-market that results in reduced development costs. Depending on the application, the simulation and modeling requirements vary a lot between different stages of product development, but there is no single simulation environment that satisfies all simulation and modeling requirements. Synopsys provides you a comprehensive solution to address this challenge with SaberEXP and SaberRD. Instructor: Andre Jennert, Sr. Staff Applications Engineer
EU Session / US Session

Low-Temp Solder Webinar
  • Event News
  • 2021-03-18

Indium Corporation's Claire Hotvedt, CSMPTE, Product Development Specialist, will host a Webex webinar focused on its innovative low-temperature solder offering as part of Indium Corporation's ongoing webinar series April 6 at 8 p.m. Eastern (5 p.m. Pacific/April 7 at 8 a.m. Singapore). Low-temperature soldering is not a "one alloy fits all" solution. Depending on the application, the actual temperature required for low-temperature soldering can vary widely. In "Low-Temperature Solder Innovation - Durafuse LT and the Low- to Mid-Temperature Space", Hotvedt will examine Durafuse's ability to bring mid-temperature drop shock properties into the upper edge of the low-temperature space, as well as low-temperature solder's specific process limitations and lifetime requirements. Indium Corporation's InSIDER Series is a free program designed to deliver expert technical content, share industry knowledge, and promote professional growth using a virtual platform. Current and future webinars can be found at www.indium.com/webinar. Hotvedt is responsible for facilitating the transition of new solder paste products from developmental stages into fully launched and marketable solutions. She also oversees product characterization and creation of marketing material to assist the sales team. Prior to joining Indium Corporation in 2018, Hotvedt held two engineering positions-one at Orthogonal, Inc. and one at Bristol-Myers Squibb. She was also an Indium Corporation Summer Intern in 2014. To register for Hotvedt's webinar, visit www.indium.com/webinar. The webinar link will be shared with registrants the day of the event. Registrants must use a company email account in order to avoid Indium Corporation's spam filters. This is a first come, first served event.

120 mO, 650 V SiC MOSFETs
  • Product Release
  • 2021-03-17

Richardson RFPD announced the availability and full design support capabilities for three 120 mO, 650 V SiC MOSFETs from Wolfspeed, a Cree Company. Wolfspeed's 650 V SiC MOSFET portfolio is based on the latest third-generation C3M SiC MOSFET technology, offering the widest range of on-resistances, the industry's lowest on-state resistances in a discrete package, as well as low switching losses-enabling high efficiency and power density. The 120 mO, 650 V SiC MOSFETs are available in both through-hole (TO-247-3, TO-247-4) and surface mount (TO-263-7) packages.

Galvanic Isolation Technology for SiC, GaN and MOSFET Gate Drivers
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Learn more:
towersemi.com
  • Product Release
  • 2021-03-17

Tower Semiconductor announced a galvanic capacitor technology integrated with its 0.18um power management and mixed signal platforms, enabling up to 12kV isolated gate driver and digital isolator ICs, which enhance safety and power efficiency for applications in the automotive, green power and industrial markets, addressing an estimated $1B market. The technology offers a cost and size advantage thanks to the integration of the galvanic isolator, saving the need for an additional device. Lead customers are prototyping initial products addressing applications such as battery chargers, power supplies and motor drivers for electric and hybrid vehicles, green power (solar inverters and wind turbines power converters) and industrial markets. "We are very excited to announce this innovative technology as we partner with lead customers to bring new products to market, supporting the anticipated high-growth in electrical vehicles and other applications for isolated power," said Mr. Shimon Greenberg, Tower's Vice President and General Manager of Mixed-Signal and Power Management Division, Analog BU. "The new technology augments our widely deployed 0.18um power technology, supporting applications from 5V to 200V".

Comprehensive Partnership for Gallium Nitride
  • Industry News
  • 2021-03-16

Nexperia has announced a comprehensive partnership covering gallium nitride (GaN) power semiconductor devices with United Automotive Electronic Systems Co., Ltd. (UAES). The program will focus on power systems for EVs, with the aim to jointly develop automotive applications using GaN technology. UAES has already started using Nexperia GaN FETs in R&D and collaborative projects including vehicle-mounted chargers and high-voltage DC-to-DC converters for electric cars. Nexperia's GaN technology has extremely good figures of merit (RDS(on) x QGD) and reverse recovery charge (Qrr) metrics that support high switching frequencies and efficient power conversion. Nexperia produces GaN based on mature and reliable mass production techniques, largely in its own global production facilities, to manufacture products according to automotive AEC-Q101 standards. UAES provides car manufacturers with advanced and comprehensive automotive powertrain and body control system solutions. It specializes in the development, production, and sales of gasoline engine management systems, transmission control systems, vehicle body electronics, and hybrid and electric drive control systems. Its five technology centers in China have world-class laboratories for entire vehicles, engines, automatic transmissions, and electric drive performance development. The advanced equipment effectively provides high-quality engineering services including system development, component development, and calibration for various Chinese car manufacturers.

AEC-Q200 Compliant High Current Shielded Power Inductor Series
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Learn more:
bourns.com/news
  • Product Release
  • 2021-03-16

Bourns introduced three AEC-Q200 compliant high current shielded power inductor series. Helping to meet the high current density, high temperature and reliability requirements for power management and EMI filtering in a variety of consumer, industrial and telecom electronics applications, Bourns Model SRP1580CA, SRP1510CA and SRP1513CA inductors offer high current capacity, compact size, high operating frequency and a high operating temperature range. The three AEC-Q200 compliant inductor series are manufactured with flat wire and Bourns' uniquely formulated metal alloy powder core using a molded construction manufacturing process. This process enables a superior magnetically shielded construction that offers low DC resistance, high heating / saturation current, low buzz noise and excellent temperature stability for low magnetic field radiation. In addition, all of the models are built with flat enameled coated wire with self-lead terminal for ultra-low DC resistance. Plus, the high current shielded inductors have an operating temperature range of -55 to +155 °C, and are designed with the same 16.5 x 15.5 mm interchangeable footprint. The Bourns Model SRP1580CA, SRP1510CA and SRP1513CA series are available now and are RoHS compliant* and halogen free.

25 Years of Success in India
  • Industry News
  • 2021-03-16

It was the beginning of the 1990s: Hans-Rudolf Schurter took over as Chairman of the Board of Directors from his father Rolf. At the same time, Asia was the emerging continent. China was awakening and beginning to reform. The martial term Tiger Countries was on everyone's lips. SCHURTER, at that time almost exclusively present in Western Europe and the USA, decided to venture east as well in order not to miss this opportunity. But the focus was not on Hong Kong or Singapore. Many Western companies were drawn to China, others to India. The most populous countries on earth promised enormous potential. The choice between the giants China and India was decided in favour of the latter. Hans-Rudolf Schurter assumed that the Indian mentality would be easier to integrate because of the English legal system and language. However, the first contacts between locals and members of the SCHURTER Group took place on the other side of the planet - in the USA. Bruno Schurter, then managing director of SCHURTER Inc. in Santa Rosa, California, maintained business relations with Asgari Lokhandwala. After his studies, Asgari worked for a company that manufactured power supply units for personal computers. For this purpose, he bought connectors and fuses from SCHURTER Inc. This was the beginning of the association between the Lokhandwala family and SCHURTER.

Mike Morton Announced Chief Executive Officer
  • People
  • 2021-03-15

TTI announced the appointment of Mike Morton to the position of Chief Executive Officer, effective immediately. Morton has served the company for 40+ years in various leadership positions, most recently providing exceptional leadership as chief operating officer. Through his years with TTI, Morton has played a vital role in building the company to its current level of success. His knowledge of the company and vast experience is expected to serve him well as he takes on this new key position. The announcement follows the passing of TTI's founder, Paul Andrews. Andrews' leadership and guidance propelled the Fort Worth based company to become the fifth largest electronics distributor in North America.

Funding to Scale Up Ultracapacitors Production
  • Industry News
  • 2021-03-11

Skeleton Technologies unveiled its plans to develop first-of-its-kind production technology for manufacturing its ultracapacitors, following the official support announced by German authorities in January. To execute these plans, the company will receive an additional €51 million ($60 million) from Germany's Federal Ministry for Economic Affairs and Energy and the Free State of Saxony. This project will include the development of a fully-automated ultracapacitor production line in its Großröhrsdorf factory – a first in the industry. The economies of scale provided by this new technology, combined with the use of Skeleton's patented "curved graphene" material, will dramatically drive the production costs down, boosting the competitiveness of ultracapacitors as the key enabling technology for the future of transportation and electrification. Taavi Madiberk, CEO and co-founder of Skeleton Technologies, explains: "We are continuously investing in R&D – whether it is improving the performance of our products or the process in which we make those products. The next stage of our production will see an implementation of fully automated Industry 4.0 manufacturing techniques – a first-of-its-kind in the ultracapacitor industry. Coupled with our curved graphene material, we are able to dramatically decrease the cost of ultracapacitors. The ultracapacitor industry is in the same situation as lithium-ion batteries were in 1999, but our advancements in core technology and production capabilities will be able to show a cost reduction faster than for any other energy storage technology. We have a clear road map to lower it by almost 90% after completion of our 5 years project."

Leakage Current Sensor for Electric Vehicle Charging Stations
  • Product Release
  • 2021-03-10

LEM launches the CDSR, a leakage current sensor based on its open-loop Fluxgate Technology. The CDSR is innovative, extremely compact and safe, allowing manufacturers to optimize the electronic design of their charger products. Since 2016, IEC standards and more specifically IEC 62955 / IEC 62752, require the detection of a Direct Leakage current at 6 mA DC to avoid the home Residual Current Device (RCD) Type A being ineffective. This effect, called "the blinding effect", appears when an EV develops an insulation fault. EV architecture integrates a battery pack, powered by Direct Current (DC), which can generate a leakage current that can deactivate a home RCD. To protect the RCD and avoid the need to install an RCD type B in the electrical panel of home EV owners, EV chargers include a device to detect the DC leakage current. This detection is the role of the CDSR. The CDSR has been developed to meet market demand for a residential and commercial charging station, offering a version for single-phase architecture and another for three-phase topology. With a maximum current per phase of 32A rms, the CDSR can be integrated into AC chargers from 3.7 kW to 22kW. Following the trend towards digital electronics, the CDSR provides not only an analog communication output but also a Serial Peripheral Interface (SPI), enabling simple interfacing of hardware. The CDSR operates from a +3.3VDC supply and has a typical current consumption of just 50 mA when measuring 150 mA as a maximum primary residual current.

Contactless Power Transmission in the Kilowatt Range
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Learn more:
tum.de/news
  • Industry News
  • 2021-03-10

A team led by Technical University of Munich (TUM) physicists Christoph Utschick and Prof. Rudolf Gross has succeeded in making a coil with superconducting wires capable of transmitting power in the range of more than five kilowatts contactless and with only small losses. The wide field of conceivable applications include autonomous industrial robots, medical equipment, vehicles and even aircraft. Contactless power transmission has already established itself as a key technology when it comes to charging small devices such as mobile telephones and electric toothbrushes. Users would also like to see contactless charging made available for larger electric machines such as industrial robots, medical equipment and electric vehicles. Such devices could be placed on a charging station whenever they are not in use. This would make it possible to effectively utilize even short idle times to recharge their batteries. However, the currently available transmission systems for high performance recharging in the kilowatt range and above are large and heavy, since they are based on copper coils. Working in a research partnership with the companies Würth Elektronik eiSos and superconductor coating specialist Theva Dünnschichttechnik, a team of physicists led by Christoph Utschick and Rudolf Gross have succeeded in creating a coil with superconducting wires capable of contactless power transmission in the order of more than five kilowatts (kW) and without significant loss. 

European Silicon Design Center in Munich
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Learn more:
apple.com/newsroom
  • Industry News
  • 2021-03-10

Apple will make Munich its European Silicon Design Center, adding hundreds of employees and a new facility focused on connectivity and wireless technologies. Munich is already Apple's largest engineering hub in Europe, with close to 1,500 engineers from 40 countries working in a variety of areas including power management design, application processors, and wireless technologies. The expansion in Munich, together with additional investment in R&D, will exceed 1 billion euros in the next three years alone. "I couldn't be more excited for everything our Munich engineering teams will discover - from exploring the new frontiers of 5G technology, to a new generation of technologies that bring power, speed, and connectivity to the world," said Tim Cook, Apple's CEO. "Munich has been a home to Apple for four decades, and we're grateful to this community and to Germany for being a part of our journey." This expansion is the latest step in Apple's longstanding effort to build a world-class team of engineers in Munich and across Germany. In 2019, the company added silicon engineering sites in Nabern, Kirchheim unter Teck. Today, about half of Apple's global power management design team is located in Germany, and Apple also has teams in Munich working on application processor SoCs, and analog and mixed signal solutions for iPhone.

Sufficient State-of-the-art Telecom Infrastructure is Crucial
  • Product Release
  • 2021-03-08

Infineon Technologies has provided CoolGaN to deliver efficiency and reliability to telecom power supply systems. Infineon's GaN devices are qualified according to JEDEC standards, offering lifetimes beyond 15 years, and are a perfect fit for industrial telecom and server SMPS. The CoolGaN 600 V e-mode HEMT in the DFN8x8 package is a key component in Delta's DPR 3000E EnergE rectifiers enabling an industry-leading energy efficiency of 98 percent. With that, Delta's rectifiers can heavily support the nascent 5G telecom networks of the world's leading telecom carriers across the globe. "Delta's Telecom Power Solutions have built an unparalleled track record in the global market, especially by enabling lower energy consumption and CO 2 emissions in 4G and the next-generation 5G telecommunications," said Eton Lee, General Manager of Delta's Communication & Information Solutions Business Unit. "We have achieved that success by collaborating with tier-one brands to develop our solutions. Moreover, Infineon's CoolGaN chips deliver excellent performance to Delta's 3000E rectifiers, which boast industry-leading efficiency up to 98 percent and an outstanding power density of 56.8 W/in³. It provides high performance while consuming little energy." "At Infineon, we work closely with our customers to help them achieve ever-growing requirements towards energy efficiency and also power density," said Stefan Obersriebnig, Product Line Head High Voltage Conversion of Infineon's Power & Sensor System Division. "With our complete portfolio of wide bandgap solutions, i.e. CoolGaN and CoolSiC, we are paving the way towards a new era in the power industry."

Conference on Silicon Carbide and Related Materials
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Learn more:
ecscrm-2020.com
  • Event News
  • 2021-03-08

The 13th European Conference on Silicon Carbide and Related Materials (ECSCRM 2020·2021) will be held at the Vinci International Convention Centre (Palais des congrès), from October, Sunday 24th to Thursday 28th 2021, proudly hosted by the University of Tours. ECSCRM is a biannual scientific event that explores, presents and discusses the new achievements in the field of wide-bandgap semiconductors focusing on silicon carbide (SiC) and other wide bandgap semiconductors. The topics covered in the ECSCRM include fundamentals (theoretical and experimental), bulk and epitaxial growth, new materials grown on SiC, material characterization, surfaces and interfaces, device fabrication processes, devices and device physics, packaging, applications, reliability and power related materials. Deadline for abstract submission is May 20th, 2021.

SiC MOSFET Modules Enable Downsizing of Industrial Implementations
  • Product Release
  • 2021-03-08

Toshiba Electronics Europe has leveraged its technological expertise in wide bandgap (WBG) semiconductor processes to introduce a compact but effective MOSFET module. The MG800FXF2YMS3 incorporates 3300V-rated dual-channel silicon carbide (SiC) MOSFET devices that are capable of supporting 800A currents. Key applications for these high power density modules include industrial drives and motor control equipment, the power inverters for renewable energy generation sites, plus the converters/inverters needed for electric rail infrastructure. Pivotal to the strong performance parameters of the new SiC MOSFET modules from Toshiba is the company's proprietary packaging technology. The intelligent flexible package low voltage (iXPLV) housings employed in these modules rely on an advanced silver sintered internal bonding technology to enable elevated degrees of operational efficiency. Channel temperatures reaching as high as 175°C can be supported, while isolation up to 6000VRMS is assured. Turn-on and turn-off switching losses are kept to 250mJ and 240mJ respectively, with stray inductance figures of just 12nH typically being expected. For more information, please visit: https://toshiba.semicon-storage.com/ap-en/semiconductor/product/mosfets/sic-mosfet-modules/detail.MG800FXF2YMS3.html

Charging Infrastructure Business Electrifies Europe
  • Event News
  • 2021-03-04

The public charging infrastructure in Europe continues to grow rapidly - by 35 percent in 2020 compared to the previous year. Among the top 5 countries, the Netherlands leads the way with more than 66,600 public charging points. France overtakes Germany with more than 46,000 charging points installed (2020: around 44,700), followed by the UK. This is according to data from the European Alternative Fuels Observatory (EAFO). Private wallboxes are also more in demand than ever, so that funding in Germany has been increased for the second time in a very short period. The leading charging infrastructure companies will present themselves at Power2Drive Europe taking place from July 21 to 23, 2021 at Messe München as part of The smarter E Europe. For widespread acceptance of e-mobility, users need not only a wide range of affordable electric vehicles, but also a reliable charging infrastructure that covers the entire country. This is essential for the purchase decision and thus for the ramp-up of electromobility. Public subsidies and a smart tax policy are driving electromobility and the expansion of the charging infrastructure in Europe. In the Netherlands, for example, not only are sales of e-cars booming - more than 66,600 public charging stations have already been installed, that is more than anywhere else in Europe. Three battery electric vehicles (BEVs) share one charging point here, according to EAFO statistics. 

High-voltage, Single-phase BLDC Motor Controller Solution
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avnet.com/connect
  • Product Release
  • 2021-03-04

EBV Elektronik demonstrates the design simplicity with the Power Integrations BridgeSwitch devices with the introduction of the EBV BridgeSwitch MB high-voltage, single-phase brushless DC (BLDC) motor control demonstrator and evaluation board. The fully-featured stand-alone solution can be powered directly from the mains AC. It requires no additional external components besides the BLDC motor, enabling engineers to quickly develop a highly costefficient and reliable design. At the heart of the EBV BridgeSwitch MB solution is an integrated half-bridge device from Power Integrations. The BridgeSwitch device offers a rich set of features that simplify the development and production of high-voltage inverter-driven BLDC or IM applications. It supports inverter output power up to 400W with no heat sink and can achieve up to 99.2% efficiency while providing current, voltage and temperature protection circuitry. The EBV BridgeSwitch demonstrator PCB's modular design has a break-away format, which enables each submodule to be physically separated and protected from the high-voltage components and the motor. An isolated programming/debugging interface reduces the risk of equipment damage and electric shock during development - even while the demonstrator is plugged directly into the mains, and where an isolating transformer is not available. The high voltage module includes an input rectifier that can accept DC or up to 220AC voltage and a switched output with two BRD1160C BridgeSwitch devices. This module also has an NTC header for remote thermal sensing and optional external current sensing circuitry.

Design Center in India Opened
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psemi.com/newsroom
  • Industry News
  • 2021-03-04

pSemi announces the opening of a design center in Chennai, India to support the company's growing demand for semiconductor products enabling 5G and Internet-of-Things (IoT) applications. This India office will accelerate the scalability of a strong engineering team and the development of new design innovations for cellular radio frequency (RF) front-end modules, sensor systems-on-a-chip and power management integrated circuits (ICs). Featuring labs and office space, the design center is located at Level 9, Olympia Teknos Park, No. 28 SIDCO Industrial Estate, Guindy, Chennai, 600032. "India is emerging as the largest mobile phone manufacturing hub in the world. With our new India design center, we want to attract top talent and further expand our engagements with customers, partners and the smartphone ecosystem," says Sumit Tomar, CEO at pSemi. "We have opened our first pSemi India design center in Chennai, but we will soon expand into other cities. We plan to scale up rapidly; our hiring plan is limited only by the availability of talent." The establishment of the design center comes on the heels of pSemi's recent product portfolio growth in 5G, wireless connectivity, power management and sensors along with increased IC content in smartphones and mobile applications. Furthermore, the pSemi India design center will serve as a close liaison between pSemi and Murata, strengthening the companies' long-term success and operational growth with higher levels of integration and functionality in IC and package design. pSemi is actively hiring.

Parts for the MethaneSAT Satellite Program
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alsic.com
  • Industry News
  • 2021-03-03

CPS Technologies announces the completion and shipment of several parts to be used in the high-performance spectrometer-based methane sensing system of the MethaneSAT satellite program. MethaneSAT is designed to locate and measure methane from human sources worldwide with much higher sensitivity and spatial resolution and with a far wider field of view than is available with current satellite technology. Grant Bennett, President and CEO, stated "CPS is pleased and honored to be participating in this historic program. The MethaneSAT program could have a major impact on significantly reducing the unnecessary release of Methane into the atmosphere. We are also pleased that participation in this program has allowed us to work with Ball Aerospace, the primary flight system integrator and instrument provider for the MethaneSAT program." AlSiC is a metal-matrix composite consisting of the metal aluminum and the ceramic silicon carbide. In power modules and power supplies, as well as many other electronic applications, AlSiC enables higher reliability and higher performance as a result of its material properties, particularly thermal expansion, thermal conductivity and stiffness-to-weight ratio. AlSiC is very light weight, which is an important consideration in space-based and airborne applications. In addition to the MethaneSAT system, CPS AlSiC components are also found on the Mars 2020 Perseverance Rover, International Space Station and in the most recent generation of GPS satellites (GPS III) for the U.S. Space Force. CPS believes AlSiC components will increasingly be used in space-based and airborne applications because of the compelling performance advantages AlSiC provides.

Current Transformers Meet IEC Standards
  • Product Release
  • 2021-03-03

SIGA (Electronics) Ltd announced that its current transformer (CT) products conform to IEC regulations from design, through manufacturing to final test. Standards including IEC 61869 are addressed by specific conformance testing for current transformers, carried out in SIGA's dedicated COVID-19-secure UK workspaces by specially trained operators. The company offers current transformers to meet all customer's requirements for metering and protection purposes. These are busbar mounted and used in many different applications. For example, SIGA's CTs are the basis of Parasense units used in supermarket refrigeration – a huge opportunity in the USA and elsewhere. SIGA already supplies CTs into switchgear contractors for the rapidly growing data centre distribution industry. Other customers include providers of switchgear to aerospace, automotive, power generation, MOD applications and rail transport. SIGA manufactures circular or rectangular type CTs, full block or split core, using a UL recognised semi rigid cast resin compound or an IP rated plastic box finish. Other finishes are available. The broad portfolio offers ring type current transformers suitable for primary currents from 50A-10000A along with rectangular current transformers with primary currents from 60A to 6300A having 1A or 5A secondary. These meet the following accuracy classes from 0.2 for metering purposes and class PX for protection. Fitted in applications with rated system volts 0.72/3kV, they can be built to meet a 3kV insulation level for up to 1 minute.

AEC-Q200 Compliant High Power Current Sense Resistor Series
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bourns.com/news
  • Product Release
  • 2021-03-02

Bourns announced the addition of nine models to its existing AEC-Q200 compliant Model CSM2F High Power Current Sense Resistor Series. Bourns designed the series as efficient, reliable, cost-effective and accurate measurement solutions for battery management system (BMS), industrial control and other high current applications. Current sense resistors are growing in popularity due to their high measurement accuracy and relatively low cost compared to other technologies. These resistors detect and convert current to an easily measured voltage, which is proportional to the current through the device. The Model CSM2F Series is available in four different footprint sizes: 6918, 8518, 7036 and a new 8536 metric size, and includes two new terminal surface treatments. With this announcement, Bourns is introducing two new styles of surface finishing – fully-plated and bare copper. The new "fully-plated" models go through a tin-plating process after material stamping to create a protective layer that provides enhanced performance, long-term stability and lower resistance drift after load life test benefits. The "bare-copper" version is constructed without tin-plating for enhanced TCR performance, and the copper terminals are covered with a protective layer to help extend resistor lifespan. The expanded Bourns Model CSM2F series features resistance values from as low as 25 microohms up to 200 microohms, with permanent power ratings of up to 50 watts, continuous current up to 1414 amps and high pulse power handling capabilities. The series is manufactured using electron beam (E-Beam) welded resistive copper alloy where the metal alloy current sensing element provides thermal EMF as low as 0.25 µV/K and a low TCR of 50 PPM/°C in the 20 °C to 60 °C temperature range. The Bourns Model CSM2F Series is available now and is RoHS compliant.

SiC MOSFETs for Electric Vehicle Applications
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aosmd.com/news
  • Product Release
  • 2021-03-02

Alpha and Omega Semiconductor announced the release of the AEC-Q101 qualified 1200V silicon carbide (SiC) aSiC MOSFETs in optimized TO-247- 4L package. Ideal for the high efficiency and reliability requirements of electric vehicle (EV) on-board chargers, motor drive inverters, and off-board charging stations, these 1200V SiC MOSFETs provide lowest on-resistance available for an automotive qualified TO-247-4L with a standard gate drive of 15V. As the EV market accelerates into millions of units per year, vehicle manufacturers are increasingly implementing 800V electrical systems to reduce the system's size and weight while increasing range and enabling significantly faster charging speeds. AOS's 1200V automotive grade aSiC MOSFETs are specifically designed for these demanding applications by providing superior switching performance and efficiency over standard silicon devices. The AOM033V120X2Q is a 1200V / 33m? SiC MOSFET based on our second generation aSiC MOSFET platform packaged in an optimized TO-247-4L. Unlike the standard 3 lead package, using an additional sense lead reduces the package inductance effects and enables the device to operate at a higher switching frequency with up to 75% reduction in switching losses compared to standard packaging. The recommended gate driving voltage of only 15V allows for the widest compatibility of gate drivers for ease of adoption in a variety of system designs. In addition, aSiC MOSFETs have a very low increase in on-resistance up to the rated 175°C to minimize power losses and further increase efficiency.

Manufacturing Efficiency on Electric Fuse Market
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mersen.com/news
  • Industry News
  • 2021-03-02

Mersen has announced that it has repurchased the stake held by the Hager Group in Fusetech, thereby acquiring full control of the company based in Kaposvar, Hungary. This operation enables Mersen to strengthen its manufacturing efficiency on Europe's electric fuse market, and to integrate a high-performance site for the manufacture of some of its future product ranges in accordance with European standards (IEC). The transaction is valued at approximately €4 million, excluding any future earn-out payments. Fusetech has been a 50:50 joint venture between Mersen and Hager since 2007. Its plant produces cost-competitive industrial fuses for the European market. The company currently employs around 300 people on a site of 6,000 sq.m. In 2020, Fusetech generated non-Mersen-related sales of approximately €7 million. Luc Themelin, Chief Executive Officer of Mersen, said: "I am delighted to see Mersen take this next important step in its plan to build and optimize its fuse product lines in Europe. Fusetech is an excellent industrial base for fuse production developed with our partner Hager Group, which the Group will use to ramp up its presence on the European market. The Fusetech teams already know Mersen and I look forward to welcoming them into the Group." 

Optimizing Jetting Process of Sintering Pastes
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heraeus.com/press
  • Industry News
  • 2021-02-25

The three technology companies Heraeus, perfecdos and Infotech automation have jointly developed a solution that offers their customers ideally matched components and materials for jetting sintering pastes. The collaboration led to the production-ready development of the jetting processes – saving time and enabling flexibility. Due to increasing production diversity and increasingly shorter product cycles, manufacturers often must adapt packaging technology in the production process. Flexible and time-saving processes are a competitive advantage and facilitate the creation of prototypes. In addition, complex components place high demands on the manufacturing process, which manufacturers can no longer reproduce with the traditional stencil printing process. The mAgic DA295A sinter paste developed by Heraeus is a paste optimized for pressure-less, low-temperature sintering. It offers higher thermal conductivity than the conductive adhesives and solder pastes currently used in the market. The paste has been optimized for power applications with high operating temperatures and high current densities. The PDos X1 micro-dispensing valve from perfecdos achieves extremely high performance thanks to the innovative and patented actuator system (drive system). Based on this, another generation of nozzles could be developed enabling the jetting of the sintering paste. The high application speed of the PDos X1 was used to achieve shorter cycle times. The non-contact dispensing also eliminates the need to move the valve in the Z-axis and minimizes the risk of collision with the leadframe. Another advantage is the consistency of the amount of sinter paste applied.

GaN Integrated Circuit for Time-of-Flight (ToF) Lidar Applications
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epc-co.com/News
  • Product Release
  • 2021-02-23

EPC announces the introduction of a laser driver that integrates a 40 V, 10 A FET with integrated gate driver and 3.3 logic level input in a single chip for time-of-flight lidar systems used in robotics, surveillance systems, drones, autonomous cars, and vacuum cleaners. The EPC21601 is a laser driver that is controlled using 3.3 V logic and is capable of very high frequencies exceeding 100 MHz and super short pulses < 2 ns to modulate laser driving currents up to 10 A. Turn-on and turn-off times are 410 ps and 320 ps respectively. The EPC21601 is a single-chip driver plus eGaN FET using EPC's proprietary GaN IC technology in a chip-scale BGA form factor that measures only 1.5 mm x 1.0 mm. With this small form factor and the integration of several functions, the overall solution that is 36% smaller on the printed circuit board (PCB) compared to an equivalent multi-chip discrete implementation. The EPC21601 is the first offering in what will be a wide-range family of integrated laser drive ICs available in chip-scale package (CSP).  Integrated devices in a single chip are easier to design, easier to layout, easier to assemble, save space on the PCB, increase efficiency, and reduce cost. This family of products will enable faster adoption and increased ubiquity of ToF solutions across a wider array of end-user applications.

Charging Station Controller for All DC Charging Functions
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vector.com/news
  • Product Release
  • 2021-02-23

Intelligent charging stations made easy to develop: The vSECC charging station controller from Vector is a charge control unit for the DC fast charging market, which performs all communication and control functions in the charging station. This futureproof solution enables developers and manufacturers of smart DC charging stations to control and monitor the charging process with just one device. The controller handles both the communication with the vehicle and back end as well as the management of the power electronics. The vSECC (Supply Equipment Communication Controller) charging station controller is a Vector series-produced charge control unit that handles the entire charging communication to electric vehicles. With vSECC, developers get one single device that takes over the communication of the charging station with the vehicle and the back end and also the control of the power electronics via CAN or Ethernet. Until now, several devices were necessary for this purpose. The main functions of a DC charging station are to communicate with the vehicle during charging, to monitor the continuous vehicle connection and to control the power electronics depending on vehicle requirements. All these functions are performed by the Vector controller. It thus offers enormous potential for faster expansion of the charging infrastructure by reducing development times.

MOSFET Line-up with AEC-Q101-Qualified Half-bridge Package
  • Product Release
  • 2021-02-23

Nexperia announced a series of half-bridge (high side & low side) automotive MOSFETs constructed in the space-saving LFPAK56D package format. The half-bridge configuration of two MOSFETS is a standard building block for many automotive applications including motor drives and DC/DC converters. The package provides a half-bridge solution in one device, occupying 30% lower PCB area compared to dual MOSFETs for 3-phase motor control topologies due to the removal of PCB tracks, whilst permitting simple automated optical inspection (AOI) during production. The LFPAK56D half-bridge utilises existing high volume LFPAK56D assembly processes with proven automotive reliability. The package format uses flexible leads to improve overall reliability, and an internal copper clip connection between the MOSFETs simplifies PCB designs and brings a plug and play style solution with exceptional current handling capability of 98 A. Typically, in a half-bridge arrangement, the PCB connection between the source of the high side MOSFET and the drain of the low side MOSFET can create a significant amount of parasitic inductance. However, with its internal clip connection, the LFPAK56D half-bridge package achieves 60 % less inductance. The LFPAK56D half-bridge MOSFETs launched are the BUK7V4R2-40H and the BUK9V13-40H. Both utilise the highly robust Trench 9 automotive silicon process technology, are rated at 40 V and are verified at twice the automotive AEC-Q101 specification in key tests. RDS(on) of the devices measures 4.2 mOhm (BUK7V4R2) and 13 mOhm (BUK9V13).

Unlock the Performance with Advanced Drive Solution
  • Product Release
  • 2021-02-23

Mitsubishi Electric's MELSERVO MR-J5 series of TSN-compatible servo drives meet today's exacting requirements for precision, dynamics and multi-axis synchronisation in food and beverage, life sciences and printing/converting production applications. They also integrate a full suite of safety functions as standard, and embed predictive maintenance functions, giving users the tools they need to increase machine productivity and availability. End users and machine builders can drive up the performance of their lines and systems thanks to a frequency response of 3.5kHz and a communication cycle time of 31.25µs. Further, with the associated MELSERVO J5 motion module, users can synchronise up to 256 axes. This increased performance does not come at the cost of more complex setup. No tuning experience is required, with a quick-tuning function generating all of the gain values automatically within approximately 0.3 seconds. The machine is then ready to run as soon as the servo is enabled, assuring smooth running with significantly reduced commissioning time and effort. A key enabler for improved performance across multi-axis servo systems is the integration of CC-Link IE TSN (time sensitive network) technology with 1Gbps transmission speeds, assuring synchronisation across all connected devices – including safety devices, which can be connected on the same network as standard control products such as inverters, HMI and I/O. Other network protocols such as EtherCAT are also offered as standard. Predictive maintenance functions have also been embedded, helping to reduce unplanned machine downtime and drive-up asset availability, so saving both time and money.

Up to 200 Engineering Jobs to Be Created
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microchip.com
  • Industry News
  • 2021-02-23

Microchip Technology is investing $20M to create a development centre based in Cork, Ireland. The facility will open during Q1 CY21 and create 60 new jobs over the next three years and approximately 200 jobs within the next seven years. The creation of this centre will reinforce Microchip's existing presence in Ireland and boost the pool of engineering talent across key skills. Located close to the city centre, this new facility will incorporate an engineering lab to support state-of-the-art innovation and extend Microchip's regional customer support. The project is supported by the Irish Government through IDA Ireland. Initially, the development centre will focus on mixed-signal integrated circuit design, applications and software development for high-speed networking, timing and synchronization products, high voltage power management devices and solutions, high reliability integrated power systems and Field Programmable Gate Arrays (FPGA). Close partnerships with Irish universities will enable the Microchip development centre to offer internships and collaborate on key next-generation initiatives. The partnership between the development centre and leading Universities in Ireland will enhance the knowledge base and skill levels of engineers in the semiconductor development space in Ireland. The development centre will also participate in Microchip's New College Graduate (NCG) programme, which operates worldwide, and in the Government of Ireland's Skillnet programme which promotes the development of future skills.

Integrated Grade 0 BLDC Motor Driver Shrinks 48-V Systems
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news.ti.com
  • Product Release
  • 2021-02-22

Texas Instruments introduced an integrated Grade 0 brushless DC (BLDC) motor driver for 48-V high-power motor control systems, such as traction inverters and starter generators in mild hybrid electric vehicles (MHEVs). The DRV3255-Q1 can help designers shrink their motor system size by as much as 30%, while providing the industry’s highest gate-drive current for increased protection and output power. Meeting the most stringent safety requirements, the new motor driver was designed according to TI’s TÜV SÜD-certified functional safety development process, helping enable up to Automotive Safety Integrity Level (ASIL) D. To help decrease greenhouse gas emissions globally, automobile manufacturers are increasing the production of MHEVs, which use 48-V motor-drive systems to help reduce emissions from a vehicle’s internal combustion engine. The TI Functional Safety-Compliant DRV3255-Q1 allows manufacturers to design a motor-drive system to help enable MHEV systems up to ASIL D, supplying as much as 30 kW of motor power which can improve the response time of a 48-V motor-drive system in heavy vehicles. "A 48-V system is a step-change that original equipment manufacturers [OEMs] can implement to meet goals around reducing emissions, while also adding power for advanced driver-assistance system features and managing power-hungry loads such as the heating, ventilation and air conditioning system," said Asif Anwar, director of the powertrain, body, chassis and safety service at Strategy Analytics. "Combining leading-edge performance characteristics with functional safety and Grade 0 translates to real-world, system-level operational benefits that will help OEMs achieve these goals."

ICs and Automotive Audio Bus Power for All Electric SUV
  • Industry News
  • 2021-02-22

Analog Devices and Volvo Cars announced that Volvo Cars' first pure electric SUV-the Volvo XC40 Recharge-will feature ADI's integrated circuits (ICs) that support the battery management system (BMS) and Automotive Audio Bus (A2B). By saving vehicle weight and maximizing range, these advanced technologies deliver an attractive total cost of ownership for electric vehicles while also supporting a sustainable future. The Volvo XC40 P8 Recharge was a 2021 semi-finalist in the North American Car, Truck and Utility Vehicle of the Year Awards (NACTOY) utility vehicle category. The NACTOY Awards honor excellence in innovation, design, safety, handling, driver satisfaction and value. The awards are intended to recognize the most outstanding new vehicles of the year. "The BMS performance is critical to the electric XC40 Recharge delivering on its promise of a silent-but-powerful, carbon emission-free, safe driving experience," said Lutz Stiegler, Solution Manager Electric Propulsion at Volvo Car Corporation. "An extraordinarily high level of thought and research went into every single aspect and component in our first pure electric SUV to ensure more miles per charge, longer vehicle life and peace of mind, while lowering the cost of ownership." ADI's ICs provide industry leading accuracy over the life of the vehicle that significantly increases miles per charge and are scalable across the vehicle fleet from hybrid vehicles to full electric vehicles. The ICs meet the highest global security standards, and scale across multiple battery chemistries, including the zero-cobalt chemistries such as lithium iron phosphate (LFP) that support social and environmental sustainability.

Power Entry Module Now with Side Flange Mounting
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schurter.com/News
  • Product Release
  • 2021-02-19

SCHURTER’s proven power entry module, series DD11, provides a high level of functional integration in the most minimal of package dimensions. The power entry module is ideally suited for equipment with low profile panels. Consisting of an IEC appliance inlet (C14), which is compatible with cord retention, 1- or 2-pole fuseholder, and power ON/OFF switch, the DD11 is now available with side mounting flanges in addition to the existing model with top and bottom flanges. The new model is designed to minimize height when vertically mounted. The compact design of the DD11 makes the series ideal for use in devices with limited space, and where high electrical and mechanical loads are present at the same time. Especially suited for medical applications, the series is designed to comply with IEC 60601-2. The fusedrawer is offered as 1 or 2-pole and accepts 5 x 20mm fuses. An extra-safe feature prevents users from removing the fusedrawer while the power cord is plugged into the equipment. The cord retention feature protects against inadvertent disconnection. Other application areas include IT and telecom, office and household equipment, as well as automation systems. The DD11 is rated for current levels up to 10 A at 250 VAC according to IEC and UL / CSA and is ENEC and cURus approved. The series complements a compact unit for snap in and PCB mounting. Versions with EMC filters are also available. SCHURTER Power Entry Modules with fuseholders meet the enhanced requirements of glow wire tests according to IEC 60695-2-11 or -12 and – 13.

Customers Support in Spain & Portugal
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danisense.com/news
  • Industry News
  • 2021-02-18

Danisense has announced that MeasureIT of Spain will now be the company’s official distributor in the region. Based in Girona, Spain, and with a second office in Palmela, Portugal, MeasureIT is well-established within the test and measurement sector, targeting markets such as research laboratories and power electronics companies working in the e-mobility, electric motor and aerospace sectors. Comments Loic Moreau, VP marketing at Danisense: “MeasureIT’s experience and contacts within the Spanish and Portuguese markets mean that they will be able to support our products technically and commercially. We see strong interest in our products in this important region, and MeasureIT with its focus on the instrumentation and data acquisition markets is a perfect partner for us.” Adds Enrico Bello, Business Development Director at MeasureIT: “We are impressed by the technical innovation that Danisense brings to its current sense transducers. We are sure that the accuracy, repeatability and quality of products such as the DS ultra-stable, high precision (ppm class) current transducers for non-intrusive, isolated DC and AC current measurement up to 1100A, or the DM1200, a high-accuracy current transducer capable of measuring signals up to 1200Arms and 1500A DC, will be of great interest to customers in Spain and Portugal.”

APEC 2021 Plenary Speakers
  • Event News
  • 2021-02-17

Mark your calendars for June 9-12, 2021 when power electronics professionals from around the world gather for APEC 2021, the premier event for networking, learning, and strategic business development. The APEC Plenary Sessions continue a long-standing tradition of addressing issues of immediate and long-term interest to the practicing power electronics professional. This year's lineup includes seven distinguished invited professionals who will share their thoughts on six topics, ranging from automotive and wide bandgap technologies to energy storage and the future of power passives. Registration for APEC 2021 opens soon.

Partnership for Power Module Solution
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silabs.com
  • Industry News
  • 2021-02-17

Silicon Labs introduced the Si823Hx Gate Driver Board, an all-in-one isolation solution perfectly suited for the recently launched Wolfspeed WolfPACK™ power module. Featuring the Si823Hx isolated gate driver and Si88xx digital isolator with integrated dc-dc converter, the board delivers excellent performance in a compact and cost-effective design, optimized for a wide range of modules. “Power electronics engineers face many challenges when designing high-power systems, from space constraints to safety requirements,” said Brian Mirkin, vice president and general manager of Power Products at Silicon Labs. “The Silicon Labs Si823Hx gate driver board is an efficient, high-performance solution designed to simplify the development of systems using power modules.” A complete suite of design resources, developed in partnership with Wolfspeed, are available to jump-start your Wolfspeed WolfPACK™ evaluation and development including a reference design, evaluation test fixture, and system test report.

650V Silicon Carbide MOSFETs
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onsemi.com/news
  • Product Release
  • 2021-02-17

ON Semiconductor has announced a range of silicon carbide (SiC) MOSFET devices for demanding applications where power density, efficiency and reliability are key considerations. By replacing existing silicon switching technologies with the SiC devices, designers will achieve significantly better performance in applications such as electric vehicles (EV) on-board chargers (OBC) , solar inverters , server power supply units (PSU) , telecoms and uninterruptible power supplies (UPS). ON Semiconductor’s automotive AECQ101 and industrial grade qualified 650 volt (V) SiC MOSFETs are based upon a wide bandgap material that provides superior switching performance and improved thermals when compared to silicon. This results in improved efficiency at the system level, enhanced power density, reduced electromagnetic interference (EMI) and reduced system size and weight. The generation of SiC MOSFETs employ a novel active cell design combined with advanced thin wafer technology enabling best in class figure of merit Rsp (Rdson*area) for 650 V breakdown voltage. The NVBG015N065SC1 , NTBG015N065SC1, NVH4L015N065SC1 and NTH4L015N065SC1 have the lowest Rdson (12 mOhm) in the market in D2PAK7L and To247 packages. This technology is also optimized around energy loss figure of merits, optimizing performance in automotive and industrial applications. An internal gate resistor (Rg) allows more flexibility to designers eliminating the need to slow down devices artificially with external gate resistors. Higher surge, avalanche capability and short circuit robustness all contribute to enhanced ruggedness that delivers higher reliability and longer device lifetimes.

PCIM Europe 2021 to be Held Exclusively in Digital Form
  • Event News
  • 2021-02-17

At the beginning of February, the decision was made to postpone the PCIM Europe to late summer following talks with exhibitors and partners. In light of the ongoing pandemic and challenging situation, numerous industry players have been hesitant to commit to an on-site event. For this reason, Mesago Messe Frankfurt GmbH has decided to hold a digital event only. With the “PCIM Europe digital days”, an online format will be offered to the power electronics community enabling networking and knowledge transfer from 3 – 7 May 2021. Over five days, suppliers and users in the industry can receive information on key developments and connect in a variety of ways. In addition to extensive exhibitor profiles, the conference program will consist of outstanding presentations as a mix of live and video-on-demand presentations, followed by discussions with the speakers. The world’s leading exhibition and conference for power electronics and its applications will take place regularly again in Nuremberg in May 2022.

Current Monitoring in High-Temperature Automotive Applications
  • Product Release
  • 2021-02-16

Microchip Technology introduced its high-side current sense amplifiers. AEC-Q100 qualified, the MCP6C02 amplifier is offered in both a Grade 1 6-pin SOT-23 package and a Grade 0 8-pin 3x3 VDFN package. Delivering a maximum offset error of only 12 µV, the VDFN package offers the lowest offset voltage for any Grade 0 high-side current sense amplifier. Specified over a temperature range of -40°C to +150°C, its offset error allows the use of smaller value shunt resistors while also maintaining a high measurement resolution. This enables a more accurate and energy efficient current measurement solution for those applications exposed to extreme temperatures, like the motor within a vehicle’s water pump. In addition, the VDFN package is processed with wettable flank plating, allowing for visual inspection of the solder joints and removing the need for x-ray scanning as required for traditional DFN packages. Microchip’s MCP6C02 and MCP6C04 devices also feature an on-chip electromagnetic interference (EMI) filter and a zero-drift architecture. The EMI filter helps provide added protection against high-frequency electrical interference, such as wireless hotspots and radio frequencies, while the self-correcting architecture brings increased accuracy to current measurement. Together these features enable developers to create higher performance solutions in a wide variety of applications, such as creating a current controlled feedback loop for a power supply or motor, monitoring and charging batteries, or monitoring current levels for safety reasons.

4 kW Power Supply for OCP, CORD and Datacenters
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belfuse.com/news
  • Product Release
  • 2021-02-16

Bel Power Solutions announced the TET4000-48-069RAH, a 4000 W power supply designed to provide the highest efficiency (Titanium) power conversion for datacenters being built to Open Compute Project (OCP), Open Data Center Committee (ODCC) or Central Office Re-architected as a Datacenter (CORD) standards. The TET4000-48-069RAH is the highest power 48 VDC model in Bel Power’s power supply portfolio and one of very few 4000 W 48 VDC server power supplies available as standard product. The adoption of 48V for datacenter power distribution is accelerating within the datacenter ecosystem as it can improve Power Usage Effectiveness (PUE), lower Total Cost of Ownership (TCO) and boost computing density and rack utilization. The TET4000-48-069RAH is designed to provide peak efficiency over 97.5 percent, classified as Titanium level, the highest efficiency classification for power supplies. These new 48V datacenters and central offices are equipped with high performance servers and super computers running scalable and distributed computing of large volumes of data. Housed in a compact form factor (69 x 40.5 x 530 mm), Bel Power’s TET4000-48-69RAH 48 VDC is programmable from 42 to 58 VDC, with power-factor correction (PFC). The unit also allows for a DC input voltage range of 240-380 VDC, delivers power density of 44 W/in3, and incorporates soft-switching resonant techniques in conjunction with synchronous rectification, providing increased system reliability and very high efficiency.

100V GaN Gate Driver Evaluation Kit
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mindcet.com/news
  • Product Release
  • 2021-02-15

MinDCet announces the introduction of the next generation GaN-based Half-Bridge Evaluation kit (MDC901-EVKHB), based on the MinDCet MDC901 GaN gate driver and two GaN Systems GS61008P (E-mode GaN HEMTs). This solution is developed to allow power electronics designers to easily design-in GaN for 48V market applications, including step-down converters, boost converters, and class D audio applications. The space technology-based MDC901 is a non-isolated 200V GaN gate driver with unprecedented gate drive strength exceeding 9 A, true floating programmable regulators, integrated charge pump, bootstrap diodes and extensive diagnostics. It is ideally suited for high-performance and high-reliability applications, where application diagnostics and GaN lifetime are key. The MDC901-EVKHB evaluation kit features a 100V input step-down converter providing up to 30A of output current. The complete and compact power stage consists of the MDC901 in combination with two GS61008P E-mode GaN HEMTs. The evaluation board allows control of all MDC901 control IO’s (internal/external dead-time control, programmable dead-time and programmable gate voltage), as well as verification of all diagnostic outputs (undervoltage detection, gate drive monitoring and temperature sensing). The evaluation kit contains all hardware to reliably connect the board to an external power source, as well as the required fan, heat sink, wiring and connectors to guarantee measurements under safe conditions. The evaluation kit is supported by GaN Systems and available for purchase through MinDCet.

SiC MOSFETs Offered in Low-inductance Discrete Packages
  • Product Release
  • 2021-02-12

GeneSiC Semiconductor's next-generation 1200V G3RSiC MOSFETs with RDS(ON) levels ranging from 20 mO to 350 mO deliver unprecedented levels of performance, robustness and quality. System benefits include higher efficiency, faster switching frequency, increased power density, reduced ringing (EMI) and compact system size. These G3R SiC MOSFETs, offered in optimized low-inductance discrete packages (SMD and through hole), are highly optimized for power system designs requiring elevated efficiency levels and ultra-fast switching speeds. These devices have substantially better performance levels as compared to competing products. An assured quality supported by fast turn-around high volume manufacturing further enhances their value proposition. "After years of development work towards achieving the lowest on-state resistance and enhanced short circuit performance, we are excited to release the industry's best performing 1200V SiC MOSFETs with over 15+ discrete and bare chip products. If the next-generation power electronics systems are to meet the challenging efficiency, power density and quality goals in applications like automotive, industrial, renewable energy, transportation, IT and telecom, then they require significantly improved device performance and reliability as compared to presently available SiC MOSFETs" said Dr. Ranbir Singh, President at GeneSiC Semiconductor.

25kW-Peak FB Transformer
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paytongroup.com
  • Product Release
  • 2021-02-11

Payton introduces an unique high power design with 4 separate center tap secondaries each handling over 100Apeak. The total output peak power is 25kW at 200kHz and 400V input voltage. Four separate outputs each delivering 60V at 35Arms and close to 100Arms-peak. The topology is full bridge with -55°C to 150°C operation. Power dissipation is 90Watts at over 99.0% efficiency. The size is L:160mm, W:90mm, H:50mm.

Energy-Meter Evaluation Board Combines Low-Cost Sensors and Robust Galvanic Isolation
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newsroom.st.com
  • Product Release
  • 2021-02-10

The EVALSTPM-3PHISO evaluation board from STMicroelectronics combines the high-accuracy STPMS2 metering front-end IC and the advanced STISO621 digital isolator, with customizable turn-key firmware running on an STM32 microcontroller to compute metrology and power-quality data. The sensing circuitry and PCB layout are optimized to ensure robustness against EMI and a strong signal-to-noise ratio, for high-accuracy measurement and post-processing computation. The STPMS2, a two-channel 24-bit second-order sigma-delta modulator, measures voltage and current for each phase through an on-board voltage divider and a shunt current sensor. It then oversamples the signal using a synchronized 4MHz clock distributed by the microcontroller and multiplexes voltage and current sigma-delta bitstreams on a single output pin. Three STPMS2 are used in the 3-phase system to collect voltage and current data from each phase. The provided firmware leverages digital filters for sigma-delta modulators (DFSDMs) integrated in the chosen STM32 microcontroller to convert the six bitstreams into 24-bit voltage and current values and computes all metrology data in real-time every 200µs. The firmware also implements a virtual com port that provides access to internal parameters for reading metrology data, modifying the internal configuration, and calibrating the board. The STISO621 dual-channel digital isolator is the first in a new series of ICs that leverage ST’s 6kV thick-oxide galvanic-isolation technology to transfer data between isolated domains in a variety of industrial applications.

Chosen by Growing Semiconductor Company
  • Industry News
  • 2021-02-10

yieldHUB is a provider of data analysis and yield management solutions to the semiconductor industry. They work with innovative fabless and IDM companies worldwide, helping to successfully characterize and release new products into production and in-depth monitoring thereafter. Speaking about this, Karim Hamed, Senior Manager of Product Engineering, Empower Semiconductor said “We chose yieldHUB as it’s very powerful! It’s fast, secure and we can access it anywhere in the world. It’s exactly what we need for data analysis and yield management. 2021 is set to be a very busy year for us, and yieldHUB is the ideal data analysis partner for the journey”. yieldHUB’s suite of products are ideal for fabless startups in the New Product Introduction (NPI) phase and then leading into production. The characterization module speeds up a key part of NPI. The production capability helps increase yield, improve quality and enhance reliability. The system is scalable and cost-effective. The NPI and production phases are all supported in the same platform. John O’Donnell, Founder and CEO, yieldHUB said “Empower’s range of products are groundbreaking for the semiconductor industry. We’re looking forward to supporting them as they design new products and ramp up production.” Empower Semiconductor developed a breakthrough on-chip power management architecture that will redefine the cost, size and energy efficiency of voltage regulators for everything from low-power mobile applications to higher-powered storage and server systems.

Power Supply Engineering "Made in Black Forest“
  • Industry News
  • 2021-02-10

CAMTEC celebrates 25 years of precision and heavy-duty power supply technology made in Germany. For a quarter of a century, the "CAMTEC" brand is synonym for high-precision power supplies and laboratory power supplies now. The CAMTEC Power Supplies GmbH, based in the Black Forest in the Southwest of Germany, offers those up to the KW range, as well as other particularly robust power supply components and battery chargers. Whether tunnels, railroad signaling systems, power plants or refineries: the power supply components of Camtec Power Supplies GmbH from the Black Forest, are chosen worldwide, wherever the requirements are exorbitantly high. The power range of the long-term power-specialist company, goes from 10 Watt Din-Rail devices, to I- and U- programmable power supplies with up to 3 KW peak power. Arbitrarily scalable power modules for heavy-duty power requirements in even many times higher KW ranges, inrush current limiters, DIN rail DC charging rectifiers and completely wearless solid-state relays complete the portfolio. AC and DC input voltage ranges and variable frequencies between 47 and 63 Hz allow the 1 to 3-phase devices to be used worldwide. All CAMTEC devices are developed and manufactured by 20 experienced employees exclusively in Pfinztal near Karlsruhe. In order to be able to meet the high type and technical variant diversity in predominantly only three-digit lot sizes, a highly efficient and highly variable automated production was built up there. Sales are handled by 77 distribution partners in a total of 67 countries worldwide.

SENSOR+TEST 2021 to Take Place Digitally
  • Event News
  • 2021-02-10

Real, virtual, and hybrid – that is the motto under which the SENSOR+TEST 2021 will be held from 4 to 6 May 2021. Participants from all over the globe are invited to the innovation dialog. Due to the continuing and critical health-risk situation with the Covid-19 pandemic and further uncertainties in regard to permitting major events, the organizer and the exhibitiors' committee jointly with the AMA executive board have decided to carry out the trade fair completely as a digital event. The SENSOR+TEST 2021 thus enables exhibitors and visitors to communicate and exchange ideas on the latest developments and technical advances in sensor, measuring, and testing technology via modern information channels. Just as in 2020, the worldwide most important industrial fair for sensor and measuring technology will again be held this year digitally. Since in recent months the information exchange over various online channels has functioned very well and was also well accepted, the SENSOR+TEST from 4 to 6 May 2021 will have significantly expanded digital options. This will turn it into a digital event with great benefit for visitors and exhibitors.

Fuel Cell Manufacturing Research Center to Go Up
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zsw-bw.de/newsroom
  • Industry News
  • 2021-02-10

High hopes abound for fuel cells – particularly in the transportation sector – but these energy converters have yet to be mass-produced. The Centre for Solar Energy and Hydrogen Research Baden-Württemberg (ZSW) at Ulm aims to change that. It has taken a decisive step toward mass manufacturing with a groundbreaking ceremony held on February 10, 2021, for HyFaB – A Research Fab for Hydrogen and Fuel Cells. The ZSW is going to establish an open industry platform to look into automated production and quality assurance processes, factory acceptance testing and the commissioning of fuel-cell stacks at this facility. This factory will also serve to qualify skilled workers and learn more about industrial applications. HyFaB is open to partners. The automotive industry, fuel-cell vendors, and mechanical and plant engineering companies are very welcome. The only facility of its kind in Germany, it is to be up and running by early 2022. Fuel-cell electric vehicles (FCEVs) powered by green hydrogen are among the most ecofriendly and climate-sparing means of transportation, particularly for long-haul trips and short refueling stops. Costs will have to come down and production capacities go up for this technology to become a mainstream mass-market proposition.

P-channel MOSFETs Deliver Low ON Resistance
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rohm.com/news
  • Product Release
  • 2021-02-10

ROHM releases a 24-model lineup of 24V input, -40V/-60V withstand voltage P-channel MOSFETs available in both single (RQxxxxxAT/RDxxxxxAT/RSxxxxxAT/RFxxxxxAT) and dual configurations (UTxxx5/QHxxx5/SHxxx5) – ideal for industrial and consumer applications such as factory automation, robotics, and air conditioning systems. In recent years, as demand for higher efficiency and power density drives adoption of higher input voltages in industrial and consumer applications, MOSFETs are expected to provide not only low ON resistance, but high withstand voltages as well. Two types of MOSFETs exist: N-channel and P-channel. Although N-channel types generally feature higher efficiency, when used in the high side a gate voltage higher than the input voltage is needed, complicating circuit configuration. On the other hand, P-channel MOSFETs can be driven with a gate voltage lower than the input voltage, simplifying circuit configuration considerably while reducing design load. Against this backdrop, ROHM developed low ON resistance -40V/-60V P-channel MOSFETs compatible with 24V input utilizing advanced 5th gen refined process. Based on ROHM's market-proven P-channel MOSFET structure, these new products leverage refined process technology to achieve the lowest ON resistance per unit area in their class. This translates to 62% lower ON resistance vs conventional products for -40V new products and 52% for the -60V new products. At the same time, quality is improved by optimizing the device structure and adopting a new design that mitigates electric field concentration. As a result, both high reliability and low ON resistance (which are typically in a trade-off relationship) are achieved. These solutions contribute to stable long-term operation in industrial equipment demanding exceptional quality.

Reference Design Enables Engineers to Simulate and Optimize SMPS Designs
  • Product Release
  • 2021-02-10

Keysight Technologies and Transphorm have announced the availability of a power supply reference design that enables engineers to identify and correct design errors before building hardware, thereby lowering product costs and speeding time to market. Switched-mode power supplies provide greater efficiency, increased power density and lower overall system costs when using GaN devices. However, GaN can produce voltage spikes that result in detrimental radiated electromagnetic interference. As a result, optimized layout design and placement of components before building hardware is critical when using GaN. The power supply reference design, available with Keysight's PathWave Advanced Design System, is a virtual prototype based on Transphorm's 4 kW high efficiency single-phase AC-DC conversion evaluation board. It consists of the component and board models needed for engineers to visualize and optimize the time and frequency domains' behavior of voltages, currents and electromagnetic fields. "The need for switch-mode power supplies is driving rapid adoption of wide bandgap semiconductors," said Tom Lillig, general manager of Keysight's PathWave Software Solutions division. "The new reference design of Transphorm's high voltage GaN solution will speed time to market of this technology, which is changing how the world powers electronic products." "Transphorm looks for partnerships that help our customers close skill gaps, increase design simplicity and reduce time to market," said Philip Zuk, vice president of Worldwide Technical Marketing and North American Sales, Transphorm. "With proper modeling, analysis of any design type prior to physical prototyping is a useful resource. Teaming with Keysight enables us to bring our 4 kW AC-DC power conversion board into a virtual design environment that will be advantageous to product designers."

Full Production Ramp of Flyback PWM Controllers
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powerdensity.com
  • Industry News
  • 2021-02-09

Silanna Semiconductor announced the full production release of the expanded portfolio of Active Clamp Flyback Controllers (ACF). First announced in April 2020, Silanna Semiconductor has achieved full production release of the SZ1110, a 33W Integrated Active Clamp Flyback Controller, delivering on the customer expectations and market penetration by dominating the ACF market. The SZ1110 devices are Active Clamp Flyback PWM Controllers that are rated for up to 33W output power and integrate an adaptive digital PWM controller and the following Ultra High-Voltage (UHV) components: An Active Clamp FET, Active Clamp Gate Driver and a Startup Regulator. This unprecedented level of integration facilitates designing efficient, high-power-density adapters with low BoM cost to satisfy power-hungry mobile phones, tablets, notebooks and video game consoles. The SZ1110 (33W) alongside the SZ1130 (65W) which was announced in full production last year has seen exceptional customer demand and continues to grow. The technical sales team has been working directly with customers’ designs demonstrating the ACF controllers, delivering over 94% efficiency from an all-silicon design, while achieving 30W/in3 power density at 65W using SZ1130 and 21.5 W/in3 power density at 30W using SZ1110, for universal input AC/DC power adapters. “In last September we announced the full production of the SZ1130 and after an incredible customer and industry response we focused on adding full production availability of the SZ1110,” said Mark Drucker, CEO of Silanna Semiconductor.

Strategy to Address Growing Demand for Power Semiconductors
  • Industry News
  • 2021-02-09

Nexperia has confirmed that it will be making significant additional global investments in manufacturing capacity and research and development during 2021. The investments are in line with a growth strategy that last year saw Wingtech Technology, Nexperia’s parent company, commit RMB12 billion ($1.85 billion) to building a 300mm (12-inch) power semiconductor wafer fab in Lingang, Shanghai. This factory, which will go live in 2022, will have an estimated annual output of 400,000 wafers. Nexperia’s plans for this year include improving production efficiency and implementing 200mm technologies at its European wafer fabs in Hamburg in Germany and Manchester in the UK. In Hamburg there will also be additional investment in technology for wide bandgap semiconductor manufacturing. New product development will be supported with a commitment to an increased R&D investment to approximately 9% of total sales. Nexperia recently opened global R&D centers in Penang in Malaysia and Shanghai in China and expanded the existing R&D sites in Hong Kong, Hamburg and Manchester. The company will also enhance test and assembly capabilities at Nexperia factories in Guangdong in China, Seremban in Malaysia and Cabuyao in the Philippines, including the implementation of advanced automation and system-in-package (SIP) capabilities. “Increased vehicle electrification, 5G communications, Industry 4.0 and the mainstream adoption of GaN-based designs will all drive increased demand for power semiconductors in 2021 and beyond,” says Achim Kempe, Nexperia’s Chief Operating Officer. “The additional global investment will ensure that we continue to provide the technology and manufacturing capacity needed to deliver products in volumes that support future demand.”

Drone Project for Medical Care
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Learn more:
we-online.de/news
  • Industry News
  • 2021-02-08

As a manufacturer of electronic and electromechanical components, Würth Elektronik actively promotes sustainable innovations, start-ups and young developers. In addition to providing components free of charge, the assistance includes, in particular, support from experienced electronics and design experts as well as the transfer of technical know-how. A current example is the support of the humanitarian project Yonah by the Würth Elektronik branch in Singapore. The start-up has developed a robust cargo drone for medicine deliveries to impassable areas. A hospital in the difficult-to-access highlands of Papua New Guinea and the fight against a rampant measles epidemic there were the impetus for the Yonah founders to develop an innovative cargo drone for transporting medicines. The portable, particularly robust and low-maintenance robotic aircraft has a long range and can take off and land vertically. An indispensable component in the electronics-hostile environment are particularly robust and vibration-insensitive connectors, which were provided to the developers by Würth Elektronik. The first operational drone from the Yonah development is a hybrid aircraft that combines the flexibility of a multi-rotor helicopter with the endurance performance of a fixed-wing aircraft. "The team at Wurth Electronics Singapore Pte.Ltd loves this wonderful project. It is a meaningful and peaceful use of unmanned aerial technology where electronics helps save lives," says a delighted Ching Man Lau, HR Manager at Würth Elektronik eiSos, who is coordinating the project with the University of Singapore and Team Yonah.

PCIM Asia Conference: Call for Papers now Open
  • Event News
  • 2021-02-08

Industry experts and academics are invited to submit their papers on the latest solutions and trends in the power electronics field for the PCIM Asia Conference 2021. Held alongside the PCIM Asia exhibition, the conference is a leading platform for knowledge sharing for the power electronics, intelligent motion technology, renewable energy and energy management sectors. Interested parties are encouraged to submit their abstracts by 15 March. The exhibition and conference will both run from 9 – 11 September 2021. Held at the Shenzhen World Exhibition & Convention Center for the first time, PCIM Asia will once again gather industry professionals to showcase the latest trends and developments in the power electronics sector, covering a range of power electronics solutions and associated semiconductors, power devices, bus bars, capacitors and more. Recognised as a reputable platform, the exhibition and conference promote industry exchange and development in a professional, international and forward-thinking environment. The PCIM Asia Conference has long been renowned as a crucial and leading conference for the industry. Annually, experts in the power electronics field gather to share their insights on the latest market advancements and technologies. With an audience of around 500 industry peers, the conference is a rewarding and unrivalled platform in China for professionals to showcase their newest findings. As in previous years, all accepted papers will feature in the official PCIM Asia Conference proceedings, as well as the widely recognised libraries of IEEE Xplore, IET Inspec Direct and Scopus. All submitted abstracts will be reviewed by the PCIM Asia 2021 Advisory Board and Technical Committee.

Hybrid LIC Supercapacitors
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cde.com/news
  • Product Release
  • 2021-02-08

Cornell Dubilier Electronics introduces two series of Hybrid LIC Supercapacitors in response to the growing need for ultra-high capacitance values at higher operating voltages. The VMF and VPF Series operate at 3.8 WVDC with capacitance values up to 220 Farads. The higher voltage results in increased energy density. With nearly eight times the energy density and a fraction of the leakage current of similar volume 2.7V supercapacitors, designers can use smaller or fewer components to achieve the desired amount of energy storage. In addition, VMF and VPF have an advantage in applications with long standby and run times. Both series can deliver quick bursts of energy that may be used to maintain voltage when power is interrupted, or they may be used to extend battery life by reducing peak repetitive current demands on the battery. Due to their high energy storage capacity, some applications can use these components in place of costly batteries. Unlike batteries, hybrid supercapacitors do not degrade with each charge/discharge cycle. They are also inherently safer than batteries, with no risk of thermal runaway. For applications requiring higher voltage or capacitance, CDE can design custom series-parallel banks of components, packaged into modules with the desired lead configuration. Standard components within the series are offered in a radial board-mount package. Sizes range from 8mm to 16mm in diameter with lengths from 16mm to 25mm. Life cycles are rated up to 500,000 charge/discharge cycles. Operating temperature ranges from -25 °C to 85 °C. Both series are fully RoHS compliant and UL recognized.

Shortages Drive Increased Demand for Capacitor Technology
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empowersemi.com
  • Industry News
  • 2021-02-08

Empower Semiconductor announced it is increasing production of its E-CAP silicon capacitor technology. E-CAP is a vastly superior performing capacitor, far exceeding the semiconductor industry’s previously leading Multi-Layer Ceramic Capacitors (MLCC), which is amidst another significant supply chain shortage. Empower Semiconductor has made the significant advancement for capacitors as E-CAP enables new possibilities for today’s applications due to the size reduction, performance increase, and improved reliability. MLCC’s are also prone to material shortages and pricing volatility as witnessed most recently. The E-CAP silicon capacitor product platform can alleviate supply shortages with the added performance and reliability benefits. “Since we launched E-CAP in late 2020 there has been unprecedented demand for our technology by industry leaders in mobile and data center products. More recently we have received increased demand due to the supply shortage of MLCC products” said Steve Shultis, Senior Vice President WW Sales and Marketing at Empower Semiconductor. “We knew our performance was winning and the added benefit of our supply chain has created a tremendous surge in demand for E-CAP.” E-CAP can be an ideal replacement of MLCC products as a power supply bypass capacitor in low voltage DC/DC voltage regulators and in-package for SoC’s and Processors. Empower Semiconductor’s silicon capacitor technology features superior stability with no DC or AC bias de-rating, no temperature de-rating, and no significant effects of aging.

Flat Pack Aluminum Electrolytic Capacitors
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Learn more:
exxelia.com/news
  • Product Release
  • 2021-02-08

In the small world of Flat Packs, the Cubisic SLP is a real “game changer”! Providing twice as much capacitance as any other available flat packs on the market in the exact same volume, this series also offers more than twice the lifetime. Engineers tackling complex designing requirements and looking for an easily integrable product will save space and gain reliability thanks to the use of improved materials. Because the CUBISIC SLP can resist 50G vibrations and withstand 92,000 feet altitude, it is perfectly suitable for cockpits, actuation and power generation functions of commercial and military aircrafts, as well as radars and laser systems.

Joining Forces to Advance Global Leadership in Embedded Solutions
  • Industry News
  • 2021-02-08

Renesas Electronics and Dialog Semiconductor announced they have reached an agreement on the terms of a recommended all-cash acquisition by Renesas of the entire issued and to be issued share capital of Dialog (the “Acquisition”) for EUR 67.50 per share, representing a total equity value of approximately EUR 4.9 billion (approximately 615.7 billion yen). Dialog is an innovative provider of highly-integrated and power-efficient mixed-signal ICs for a broad array of customers within IoT, consumer electronics and high-growth segments of automotive and industrial end-markets. Centered around its low-power and mixed-signal expertise, Dialog brings a wide range of product offerings including battery and power management, power conversion, configurable mixed-signal (CMIC), LED drivers, custom mixed-signal ICs (ASICs), and automotive power management ICs (PMICs), wireless charging technology, and more. Dialog also offers broad and differentiated BLE, WiFi and audio system-on-chips (SoCs) that deliver advanced connectivity for a wide range of applications; from smart home/building automation, wearables, to connected medical. All these systems complement and expand Renesas’ leadership portfolio in delivering comprehensive solutions to improve performance and efficiency in high-computing electronic systems. “The transaction we announced today represents our next important step in catapulting Renesas’ growth plan to achieve substantial strategic and financial benefits, following our previous acquisitions,” said Hidetoshi Shibata, President and CEO of Renesas. “Dialog has a strong culture of innovation along with excellent customer relationships and serves fast growing areas including IoT, industrial and automotive. By bringing Dialog’s talented team and expertise into Renesas, together, we will accelerate innovation for customers and create sustainable value for our shareholders.”

650 V Hybrid IGBT Discrete Family
  • Product Release
  • 2021-02-05

Infineon Technologies has launched a 650 V CoolSiC™ Hybrid IGBT portfolio in a discrete package with 650 V blocking voltage. The CoolSiC hybrid product family combines key benefits of the 650 V TRENCHSTOP™ 5 IGBT technology and the unipolar structure of co-packed Schottky barrier CoolSiC diodes. The devices are especially suited for DC-DC power converters and power factor correction (PFC). These can typically be found in applications like battery charging infrastructure, energy storage solutions, photovoltaic inverters, uninterruptable power supplies (UPS), as well as server and telecom switched-mode-power supplies (SMPS). Due to a freewheeling SiC Schottky barrier diode co-packed with an IGBT, the CoolSiC Hybrid IGBTs perform with significantly reduced switching losses at almost unchanged dv/dt and di/dt values. They offer up to 60 percent reduction of E on and 30 percent reduction of E off compared to a standard silicon diode solution. Alternatively, the switching frequency can be increased at least by 40 percent with unchanged output power requirements. A higher switching frequency will allow reducing passive components size and thus lower bill-of-material cost. The Hybrid IGBTs can be used as a drop-in replacement for TRENCHSTOP 5 IGBTs allowing an efficiency improvement of 0.1 percent for each 10 kHz switching frequency without redesign efforts. The product family creates a bridge between pure silicon solutions and high performing SiC MOSFET designs. Even more, in comparison to pure silicon designs, Hybrid IGBTs can improve electromagnetic compatibility and system reliability.

Transformers for DC/DC Converters
  • Product Release
  • 2021-02-04

TDK Corporation presents the EPCOS E10 EM series, a range of insulated SMT transformers that are suitable for various DC/DC converter topologies and gate driver circuits in e-mobility and industrial electronics. There are four models in the series, with basic winding insulation of a working voltage of 500 VRMS and reinforced insulation of 300 VRMS. The turns ratio is between 1:0.76 and 4:1, depending on the model. Measuring just 11.7 x 13.15 x 11.35 mm3, they are extremely compact. The compact design meets clearance and creepage requirements in accordance with the IEC 60664-1 standard (Np/Ns: min. 5.5 mm clearance, min. 6 mm creepage), due to the internal construction of the transformers. Outstanding reproducibility and reliability are ensured thanks to highly automated production with an AOI final inspection. The component in the EPCOS transformer series B78307A*A003 is qualified in accordance with AEC-Q200 Rev. D.

LIVE Master Class on Frequency Response Measurement Techniques
  • Event News
  • 2021-02-04

On March 10, 2021 at 10am PDT, Dr. Ray Ridley will host a FREE 2-hour masterclass on frequency response measurements for power systems. The LIVE format allows participants to learn from the safety of their own work or home environment. Designed for power supply design engineers at all levels of experience, this two-hour course will combine both theory and live measurements on power supplies made during the presentation. Dr. Ridley will also demonstrate how to verify measurements with simulation and modeling. “Once you learn these techniques, your development process will become far more efficient,” commented Dr. Ridley. “It’s incredibly important to understand how to validate and ruggedize a system for manufacturing.”

Power Supplies Address EV and Hydrogen Production Applications
  • Product Release
  • 2021-02-03

TDK Corporation announces the introduction of 50V, 400V and 500V output models to the TDK-Lambda GENESYS+™ series of programmable DC power supplies. With output power levels of 5kW, 10kW and 15kW in 1U, 2U and 3U high 19” rack-mount packages, the G50, G400, G500, GSP50, GSP400 and GSP500 models are fully compatible with the current series. The additional models are targeted at testing electric vehicle (EV) powertrains and other automotive sub-systems, and proton exchange membrane (PEM) electrolysers for hydrogen production. These optimised output voltages enable the power supplies to deliver more current without needing to parallel two or more units. All models seamlessly transition between constant voltage and constant current modes and also have constant power operation. For higher power systems, multiple power supplies can be connected in parallel with a patented advanced master/slave system that provides dynamic load response and ripple and noise characteristics comparable with that of a single power supply. The GENESYS+™ products can be ordered with three phase input ranges of 170-264Vac, 342-460Vac or 342-528Vac. The 5kW GENESYS+™ units weigh less than 7.5kg for easy movement or installation. Where user access is not required or needs to be restricted, a blank front panel option (with no metering or control functions) is available. Snap-on dust filters can also be added to limit airborne contamination.

SiC MOSFETs Solve Design Challenges for Solar Energy Company
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Learn more:
rohm.com/news
  • Industry News
  • 2021-02-03

ROHM Semiconductor announced that Midnite Solar, based in Arlington, WA, utilizes ROHM’s silicon carbide MOSFETs to drive efficiency and reduce system cost. Four products new to the US market – the Hawkes’s Bay 600VDC to 48VDC 6000W MPPT solar charge controller, powerful Barcelona dual MPPT charge controller, MNB17 advanced battery-based charger/inverter, and 120/240V Rosie inverter/charger – all benefit from the high performance and proven reliability of ROHM’s SiC technology. “SiC power devices offer vastly improved energy efficiency over the silicon parts they replace, and the cost premium has come down significantly, enabling a wider range of applications to benefit from these devices for better system performance and value. We are very happy to support Midnite Solar’s latest power conversion product design with our SiC MOSFET technology, and we are truly excited to see the advanced power devices and system solutions making a positive difference for our valued customers,” says Ming Su, Ph.D., Technical Marketing Manager at ROHM Semiconductor. “Silicon carbide solves a key challenge,” explains Robin Gudgel, Midnite Solar’s principal owner and engineering manager. “Regular silicon MOSFETs have a very slow body diode,” he details. “Therefore, trying to make an inverter work as a charger where it must run bidirectionally is very difficult. We were looking at an IGBT pair in combination with another diode, but silicon carbide is such a good solution, and ROHM’s devices did not require any significant design changes, so it was an obvious choice.”

Strategic Partnership for Driving Printed Electronics Solutions
  • Industry News
  • 2021-02-03

Henkel Adhesive Technologies and Quad Industries have announced the expansion of their strategic partnership to offer capacities and support for technological value creation and prototyping with printed electronics solutions across multiple industries. The companies started their collaboration in 2019 and since then successfully worked on different projects such as the development of the innovative COVID-19 smart health patch introduced by Byteflies that was launched in 2020. With the advancement of the partnership Quad Industries has become a strategic partner in Henkel´s ecosystem for design creation, prototyping and manufacturing of printed electronics via flatbed screen printing. With more than 35 years of experience in printed electronics across multiple industrial markets Henkel Adhesive Technologies offers a broad material expertise, market know-how and partner network to support the commercialization process for smart product solutions. The business unit is a leading provider of a broad portfolio of conductive inks and coatings that enable flexible, cost-efficient and high-performing applications. “At Henkel we believe in a differentiated partnership approach across the entire value chain,” explains Stijn Gillissen, Head of Printed Electronics at Henkel. “Our network enables us to provide customers not only with products and knowledge, but also connecting them with circuit designers, printing manufacturers or external IoT specialists. Together we can leverage the potential of digital transformations by utilizing the benefits of printed electronics.”  

Improving the Reliability of Electronic Components
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infineon.com/press
  • Industry News
  • 2021-02-02

The Europe-wide research initiative Intelligent Reliability 4.0 (iRel40) aims to improve the reliability of electronic systems and microelectronic components. Coordinated by Infineon Technologies, 75 science and industry partners from 13 countries are pooling their forces to achieve this goal. “Enhancing electronics performance through miniaturization and integrating more and more functions is progressing steadily. Performance and complexity are increasing, as the costs per function go down,” says Dr. Reinhard Ploss, CEO of Infineon Technologies AG. “Powerful electronics form the basis for forward-looking technologies such as electro-mobility, autonomous driving, renewable energies and energy-efficient connected solutions. However, they will only be successful if users can depend on reliable functionality, quality and lifetime. Reliability is a key differentiating factor in international competition.” iRel40 adopts a holistic approach to optimizing the reliability of microelectronic systems along the entire value chain – from the wafer to the chip and the packaging and finally to the system and hence the actual application. The aim is to significantly reduce failure rates and thus improve product quality and lifetime. This approach also contributes to more sustainable management of our natural resources. Experts from science and industry in Europe are working together to achieve this. They are relying on the latest insights and methods in material research and failure analysis, including modeling and simulation, as well as artificial intelligence. The project is divided into eight work packages that deal with aspects such as requirements, theoretical principles, materials, test methods, and pilot applications. Infineon will, in particular, contribute its expertise and skills in chip and packaging technology.

Switch Provides True Reverse Current Blocking for Type-C PD
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aosmd.com/news.pdf
  • Product Release
  • 2021-02-02

Alpha and Omega Semiconductor announced a Type-C Power Delivery (PD) high voltage source protection switch capable up to 28V absolute maximum voltage. The AOZ1374 is a smart protection switch in a small thermally enhanced 3mm x 3mm DFN package. AOS’s prowess in high-performance ICs combined with AOS’s high SOA MOSFETs using advanced co-packaging techniques. AOZ1374 supports a slew of protection features, including true reverse blocking in a small solution footprint with an industry-leading on-resistance of 36mOhm. While USB ports in consumer and computing equipment can receive up to 100W of power, power typically comes from an AC-DC adaptor supporting Type-C PD. The host device itself typically provides (sources) 5V @ 3A or up to 15W. This is the most common implementation in notebook applications and also in the majority of desktops. However, Type-C PD ports are gaining popularity in more devices such as smart monitors and power banks, and for such applications, a high voltage sourcing switch is required to deliver up to 100W power. Type C high voltage sourcing switches are also increasingly common in graphics cards or game consoles to power highend virtual reality gaming goggles. Similarly, a personal computer can connect to a monitor using one single Type-C cable providing both power and data. AOZ1374 uses a design IP developed for the AOZ1375DI high voltage bi-directional source/sink Type C protection switch with added integration features to eliminate the eternal current limiting resistor. The device features 28V absolute maximum voltage with the current limit capability, and startup safe operating area (SOA) management would be the ideal protection switch for the applications mentioned above.

Postponement of The smarter E Europe 2021
  • Event News
  • 2021-02-01

The smarter E Europe with its four exhibitions Intersolar Europe, ees Europe, Power2Drive Europe and EM-Power Europe will be moved back by six weeks to the second half of 2021. The innovation hub for the new energy world will now take place from July 21–23, 2021, at Messe München. The smarter E Europe is Europe’s largest platform for the energy industry and the most important meeting point for the new energy world. In close coordination with exhibitors and partners, the event’s organizers Solar Promotion GmbH and Freiburg Wirtschaft Touristik und Messe GmbH & Co. KG have decided to postpone the events by six weeks to July 21–23, 2021. The decision was made in close coordination with the registered exhibitors and Messe München. “We asked our exhibitors and partners how they felt about a possible postponement, and we would like to thank them for the overwhelming response and constructive discussions,” says Markus Elsässer, CEO of Solar Promotion GmbH. “The results revealed that a clear majority of the exhibitors were in favor of postponing the event to July 21–23, 2021. Six weeks can make a big difference in the current situation.” The event will now fall in the second half of 2021. The organizer’s decision is based on a number of potential advantages. They expect that by then, more progress will have been made in terms of vaccinations, that travel restrictions will be lifted further, including by companies, and that the summer will have contributed to further stem the pandemic.

Partnership Enhances Ability to Service RF and Low-Loss PCB customers
  • Industry News
  • 2021-02-01

Rogers Corporation’s Advanced Connectivity Solutions (ACS) business unit announced the introduction of a new distribution channel with the addition of CCI Eurolam (CCI) to their sales and service team in the EMEA. ACS provides global customers with market-leading high performance and high reliability RF material solutions. CCI comes with over 50 years of sales and service experience in PCB processing and materials distribution. Rogers ACS’ continued expansion in the EMEA, combined with CCI’s extensive experience and distribution network, will provide the highest level of support to customers. Rogers and CCI, working closely as a team, will provide both sales and onsite service/support to PCB manufacturing customers throughout the EMEA. Dirk Lefelon, ACS Sales Manager Europe, noted, “I am pleased CCI and Rogers were able to form this relationship that focuses on enhancing our ability to service our customers in EMEA through improved service and local support.”

Acquisition of Magnetic Component Manufactorer
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bourns.com/news
  • Industry News
  • 2021-02-01

Bourns announced that its newly-formed subsidiary has acquired all shares and interests of the various entities comprising the Kaschke Group with its headquarters in Göttingen, Germany. Kaschke was founded by Kurt Kaschke in 1955 and became known for its high competence in the development and production of application specific magnetic products. The Kaschke mission to use their ferrite core knowledge base for the development of solutions tailored to specific customer requirements matches Bourns' culture of innovative design. "As one of the few companies that has the capability to design and build ferrite core materials as well as manufacture complex inductive components, Kaschke will bring to Bourns the experience and creativity needed to solve customers' complex application challenges," said Gordon Bourns, Chairman and CEO of Bourns. "We are excited to welcome Kaschke to the Bourns organization to combine our capabilities and build stronger customer relationships." Al Yost, President and Chief Operating Officer at Bourns, said "This acquisition is an important element in Bourns' strategy to strengthen our inductive technology capability and broaden our portfolio of innovative magnetic products." "The combination of Kaschke and Bourns will enable the development of a full portfolio of products that will help our customers meet the challenging EMI filtering requirements of the next generation power supplies in the automotive, industrial and new energy markets," said Silke Baumgartner, President of Kaschke Components. "I'm delighted to form an alliance with Bourns, a company with a history and core values that are fully aligned with Kaschke's."

High Voltage Differential Probe
  • Product Release
  • 2021-02-01

The Teledyne LeCroy HVD3220 is ideal for measuring GaN- and SiC-based power conversion system outputs, line outputs, in-circuit device switching outputs, and voltages across other components. The 400 MHz bandwidth is more closely aligned with user needs for in-circuit GaN and SiC system testing than other HVD Series probes. Additionally, some users will also find the HVD3220 useful for gate-drive signal measurements, or for measurements on 60 V common-mode power conversion systems.

Series of Digital Eighth-Brick DC/DC Converters
  • Product Release
  • 2021-01-28

Flex Power Modules announces the launch of the BMR492 – a series of digital eighth-brick intermediate bus converters capable of delivering between 600 to 800W of continuous power along with a peak power of up to 1100 W for short periods <1s. This so-called ‘burst mode’ operation is commonly required for CPUs (such as Intel’s Ice Lake processor for example) for datacom and data center applications. The BMR4920302/861 converter, the first of three variants of the BMR492 family to be introduced, delivers a 12V output. Rated to a maximum 600W output over an input voltage range of between 40-60V, the DC/DC step-down solution is ideal for nominal 48 or 54 V input voltage systems commonly found in data center server applications. The through-hole mounted device is fully regulated and includes an input to output isolation voltage of 1500Vdc. This BMR492 variant delivers an extremely efficient operation evidenced by a peak efficiency of 96.7% at 48 Vin at half load. The output voltage is pre-programmed at 12 V as standard, but this can be adjusted across a wide range of 8 to 13.2 V via the incorporated PMBus interface. This feature is also useful to optimize system level efficiencies through dynamic bus voltage adjustment according to the supplied load.

Compact Oscilloscopes with up to 2GHz Bandwidth
  • Product Release
  • 2021-01-27

RIGOL Technologies EU introduces four high-end oscilloscopes which are possible to cascade different number of modules to increase channel counts. The DS8000-R series is a medium and high-end mixed signal digital oscilloscope with a compact size designed on the basic of the ASIC chip (RIGOL self-owns its intellectual property right) and UltraVisionII technical platform developed by RIGOL. It is compact and thin in design. It supports system integration of multiple devices. Its cascaded rack mount and remote system operation can meet the system requirements for industrial automation test system and high channel research application. With a sample rate of 10 GSa/s DS8000-R series oscilloscope has analog bandwidth from 350 MHz, 1 GHz and 2 GHz, supporting multiple-device synchronous triggering, available to be extended to 512 channels. The standard memory size is 500 Mpts for all channels. It provides an excellent solution for users to meet their high-speed requirement for the system integration test and synchronization requirement for multiple-channel data acquisition.

Data Center Professionals are Considering Power System Upgrades
  • Industry News
  • 2021-01-27

The events of 2020 rapidly accelerated a global, cross-industry digital transformation, underscoring the mission criticality of data centers as the backbone of the world’s virtual economy. In fact, the data center market is expected to grow by nearly 14% in 2021. ABB Power Conversion issued a data report, “Data Overload: Powering Data Centers in the New Normal,” that explores the unprecedented demand on data centers in 2020 as well as long-term impacts that will shape data center operations for years to come. Not surprisingly, 96% of data center professionals surveyed reported that demand on their data center increased in 2020, which could indicate why 53% of those surveyed are likely to consider power system upgrades to meet increased demand in the future. “The impact of COVID-19 fundamentally accelerated the concept of mission critical. Overnight, businesses became even more reliant on the cloud to enable operations, processes and remote collaboration. This immediate transition would not have been possible without data centers backed by efficient and reliable power systems,” said Jeff Schnitzer, president, ABB Power Conversion. “Power is the ultimate enabler. Not only for rapidly scaling data center operations to meet exponential demand, but for energizing the ongoing digital transformation that’s the beating heart of technology and smart societies of the future. And data center power architectures are core components of this.”

External Power Supplies with Interchangeable Plugs for International Compatibility
  • Product Release
  • 2021-01-27

Jasper Electronics has expanded its line of medical grade power supplies with 27 model series of external power adapters. The adapters are compliant with International Electromechanical Commission (IEC) standards for the safety and effectiveness of medical electrical equipment, including: IEC60601-3rd Edition, UL/cUL, TUV, and FCC certification. Several of the wall-mounted model series have interchangeable AC plugs for international compatibility, and all units have custom connector and cable options. “With this significant expansion of our IEC60601-certified external medical power supply product lines, we’ve provided our customers in the medical electronics industry with a wide range of high efficiency, reliable power options,” said Robert Nishimoto, president, Jasper Electronics. “With a selection that includes external fanless designs, a wide range of input and output power ratings, interchangeable AC plugs, and both standard and custom cable and connector options, customers will be able to select optimum specifications, performance, and price for their medical applications.” Jasper Electronics’ comprehensive range of medical-grade external power supplies includes both wall-mounted and desktop configurations with output power ratings from 4.5W to 310W. All models carry safety agency certifications (UL/cUL, TUV, CE, FCC, and IEC60601 -3rd Edition), and many feature multiple sets of interchangeable AC plugs for worldwide compliance. The HEMG Series devices feature universal input harmonic power factor correction (PFC) with high efficiency.

Stefan Schaffhauser Takes Over as CEO
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tracopower.com
  • People
  • 2021-01-27

In keeping with a long-term succession plan, the previous CEO, Markus Dalla Monta, will retire as of July 2021, following a 35-year career at Traco Power. Stefan Schaffhauser will assume the CEO position with the beginning of the business year on April 1, 2021. As of this date, he will lead the Traco Power Group together with the CFO, Adrian Berger. As before, Rolf Caspar – company owner and Chairman of the Board – will continue to concentrate his efforts on strategic issues in the firm, in conjunction with the board of director members, Jennifer Caspar and Ueli Wampfler. During the past three years, Stefan Schaffhauser managed the international business team at Traco Power as their managing director, effectively contributing to a positive corporate development. Prior to his career at Traco Power, Schaffhauser was employed at various industrial enterprises in management positions and as a business consultant. Stefan Schaffhauser obtained a Master’s degree in Engineering and Management at the ETH (Confederated Technical University of Switzerland) in Zurich. “It is a great honor for me to assume the management of this outstanding company,” says Stefan Schaffhauser. “Traco Power is situated extremely well financially, and we can build on innovative products, a strong brand, and an excellent company culture. I look forward to further advancing Traco Power together with my management team and our staff members.”

Compact Inverter for Direct Connection to Medium-Voltage Grid
  • Industry News
  • 2021-01-25

As the energy transition progresses, the expansion of the electricity grids is becoming increasingly important. More and more renewable generation plants as well as electrical storage systems are being connected to the grid. This gives power electronics a decisive role, because it is essential to connect these systems to the grid. However, in addition to the mere feed-in or feed-back of electrical energy, power electronics must also perform other grid-supporting tasks. In the "SiC-MSBat" project, researchers at the Fraunhofer Institute for Solar Energy Systems ISE, together with partners, have now developed and successfully commissioned a highly compact inverter for direct feeding into the medium-voltage grid. Currently, inverters mostly feed into the low-voltage grid. They are then coupled to the medium-voltage grid via large 50 Hz transformers. The use of new types of silicon carbide (SiC) transistors with very high blocking voltages now also makes it possible to connect the inverters directly to the medium-voltage grid. Thanks to the high control dynamics of SiC inverters, they can take on grid-stabilizing tasks and, for example, act as active power filters to compensate for harmonics in the medium-voltage grid. Furthermore, SiC inverters can achieve much higher power densities than conventional inverters. This results in a compact design, which is a particular advantage when plants are to be built in inner-city areas or existing old plants are to be retrofitted. In addition to the mere system costs, construction and infrastructure costs also play a very important role, especially in urban areas.

24 V Dual-Channel Low Side Driver
  • Product Release
  • 2021-01-25

Infineon Technologies broadens its EiceDRIVER portfolio with the 24 V dual-channel low side gate driver with an integrated thermal pad. It can be operated with high switching frequencies as well as highest peak output currents and offers an enable function. The gate driver is suitable for applications with higher switching frequencies such as power factor correction and synchronous rectification, as well as a transformer driver or a buffer driver for parallel MOSFET applications or high-current IGBT modules such as EasyPACK and EconoPACK. The EiceDRIVER 2ED24427N01F provides a symmetrical output stage with 10 A source and sink drive capability with integrated under-voltage lockout (UVLO) protection and logic level enable control. The gate driver is available in a DSO-8 package with a thermally efficient and exposed power pad. With 55 ns propagation delays and 450 m? (max) source and sink ON resistance per channel, the driver enables high switching frequencies with reduced switching losses of the power transistors. The integrated thermal pad offers very low thermal resistance to enable reliable operation at lower temperatures under high current conditions or at higher switching frequencies. 2ED24427N01F is rated for industrial temperature grade operation.

Agreement to Create a Centre of Excellence for Direct Current
  • Industry News
  • 2021-01-22

On Friday the 22nd of January, Xavier Piechaczyk, Chairman of the board of directors at RTE (Réseau de Transport d'Electricité) and Hubert de la Grandière, CEO of the Institute for Energy Transition (ITE) SuperGrid Institute, signed a partnership agreement to develop a centre of excellence for direct current and power electronics. This partnership makes it possible to develop new collaborations in order to meet the challenges involved in energy transition by bringing together R&D skills and cutting-edge technologies. Xavier Piechaczyk, Chairman of RTE's board of directors and Hubert de la Grandière, CEO of SuperGrid Institute, signed this partnership agreement with a view to creating a French centre of excellence for direct current, with its base in the Greater Lyon area. The aim is to share the R&D skills, high-voltage technological facilities and simulation resources of the two organisations; SuperGrid Institute, a research and technological innovation centre working on the energy transmission systems of the future, based in Villeurbanne (69), and the RTE Transfo Campus, a training and innovation centre in the field of electricity transmission, located in Jonage (69) in the Greater Lyon area. Among the targeted joint actions, RTE and SuperGrid Institute intend to work together on R&D projects for the development of a direct current meshed grid, notably in response to the increase in power generated by offshore wind farms. "This centre of excellence in the Greater Lyon area, the only one of its kind in Europe, is a major asset for sharing our expertise, test facilities and simulation platforms and offers us an optimal vantage point from which to prepare and train the European energy ecosystem for the future," said Hubert de la Grandière, CEO of SuperGrid Institute.

10:1 Ratio DC-DC Converters in Half- and Quarter-Brick Footprint
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murata.com
  • Product Release
  • 2021-01-21

Murata announces two ultra-wide 10:1 ratio DC-DC converters, the 250W IRH-W80 half-brick and the 150W IRQ-W80 quarter-brick from Murata Power Solutions. Both high power density modules feature efficiency levels above 91% with a 16 – 160 Vdc input voltage range. The 250W IRH-W80 and 150W IRQ-W80 modules are designed for embedded applications in the railway and industrial sectors. They comply with the requirements of EN50155, coming with qualification reports for shock, vibration, extreme temperatures and humidity. Typical applications include powering equipment on board trains, such as infotainment, communications and lighting, and from a wide range of battery voltages, that require a reliable DC source. The modules also can be used in other industrial applications that operate from batteries in harsh environments. The 250W IRH-W80 and 150W IRQ-W80 have a baseplate operating ambient temperature range of -40°C to 100°C. Single 12 V, 24 V, and 54 V output models are available with galvanic isolation between the input and output in excess of 4 kVdc. Features include remote enable on/off, a wide output voltage adjustment range of ±10%, remote sense, hold up function, pulse out feature, positive or negative enable and over current protection adjustment. The adjustable undervoltage lockout protection feature prevents deep discharge of supplying batteries. The modules also feature self-protection to external short circuits, over current protection, and over temperature protection with self-resetting ability.

4-Channel Window Voltage Detector IC
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Learn more:
n-redc.co.jp/info
  • Product Release
  • 2021-01-21

Ricoh Electronics Devices has launched the R3500 series, a 4-channel high-voltage window voltage detector suitable for use in products required to meet functional safety standards. Today’s automotive and industrial equipment must meet increasing needs for functional safety and is required to have high-accuracy monitoring functions on supply voltages for MCUs and SoCs. Additionally, voltage monitoring functions must cover more power supplies than ever. To meet the needs above, the R3500 series has four voltage detectors in a single chip. Each detector can monitor not only under-voltage but also over-voltage of a targeted power supply, which contributes to high detection coverage. The detection voltage values are settable in 0.01 V step and will help construct a high-accuracy voltage monitoring circuit optimized for your system. Also, voltage monitoring systems combining the R3500 series with the R3152 series or the R3154 series, our conventional 1-channel voltage detector ICs, can cover a wider range of applications. A typical voltage detector has possibility of failing to operate properly when the voltage it monitors fluctuates largely, because it uses the monitored voltage stepped down to 3.3 V or 5 V as its source voltage. To ensure stable voltage monitoring even under large voltage fluctuations, the R3500 series has a high operating voltage range up to 42 V and separates its voltage monitoring pins from the power supply pin. For higher security, the R3500 series has a fault-diagnostic function which checks if the IC itself can operate properly, as the product is designed to enhance safety of systems. This function will help reduce latent faults.

Reliability Report Shows Field Experience of GaN-Devices
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epc-co.com/News
  • Industry News
  • 2021-01-21

EPC announces its 'Phase-12 Reliability Report', documenting the strategy used to achieve a remarkable field reliability record. eGaN devices have been in volume production for more than eleven years and have demonstrated very high reliability in over 226 billion hours of operation, most of which are in vehicles, LTE base stations, and satellites, to name just a few applications with rigorous operating conditions. This report presents the results of testing eGaN devices to the point of failure, which provides the information to identify intrinsic failure mechanisms of the devices. By identifying these intrinsic failure mechanisms, deep knowledge of the behavior of a device over time, temperature, electrical or mechanical stress can be developed and used to create physics-based models that accurately project the safe operating life of a product over a more general set of operating conditions.  According to Dr. Alex Lidow, CEO and co-founder of EPC, "The release of EPC's 12th reliability report represents the cumulative experience of millions of devices and five generations of technology. These reliability tests have been undertaken to continue our understanding of the behavior of GaN devices over a wide range of stress conditions." Dr. Lidow continues, "Standard power semiconductor qualification testing is inadequate since it only reports parts that pass a very specific test condition. By employing our test-to-fail methodology we have consistently produced more robust, higher performance, and lower cost products for power conversion applications and have amassed a reliability track record beyond what is achievable with traditional silicon MOSFET technology."

Wafer Handling Tool EFEM
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mechatronic.at
  • Product Release
  • 2021-01-20

mechatronic systemtechnik announces the availability of the mWL.cs mechatronic calotte loader. A fully automated stand-alone system for transferring wafers between cassettes and calottes, the mWL.cs provides integrated device manufacturers (IDMs) an opportunity to increase yield and improve process traceability at a high throughput. Evaporation process tools often utilize spherical carriers and rings to meet uniformity and defectivity targets. However, the design of these tools has made it challenging to introduce automated wafer handling in this step of the manufacturing process. IDMs invariably default to manual wafer loading, which has resulted in yield degradation and an increased risk for misprocessing. "Automating the wafer loading and unloading system for evaporation type metal deposition is a step that bears much potential," shared Stefan Detterbeck, Sales Director. "By eliminating human error from the equation, our system enables manufacturers to achieve higher yield and reduce damage to wafers. Enhanced process traceability also supports quality improvement measures to meet the conformity requirements of critical customer industries." A specialist in fully automated handling systems for non-standard substrates and handling requirements, mechatronic recognizes and addresses the semiconductor industry's need for the handling of ultra-sensitive substrates used in modern new wafer fabrication technologies. The company's deep expertise and proprietary technologies provide manufacturers with safe, reliable systems that handle non-standard substrates with ease and confidence.

High-Temperature Capacitors Operate up to 125°C
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eurocomp.de/celem
  • Product Release
  • 2021-01-20

Even if water cooling is not possible or the cooling water temperature can only up to 45°C, the HTC high-temperature capacitors from Celem (sales: Eurocomp) are used safely and reliably. Various designs are offered in the HTC series, which are available for 550V or 1000V, depending on the capacitance. Depending on the design, the capacitance values range from 0.1 µF to 0.4 µF. The picture shows the designs CSM, C-Cap mini, CMPP and CSP with the different connection options. On request, these capacitors can be manufactured with UL-certified resin. Celem uses a high-quality high-temperature film for its HTC series which makes the series ideal for e.g. wireless power transmission in automotive applications, for example, as part of inductive wireless charging for EVs.

Flux-Cored Wire for Robotic and Laser Soldering
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indium.com/news
  • Product Release
  • 2021-01-19

Indium Corporation announces that it is now offering CW-232, a uniquely formulated flux-cored wire that combines superior wetting speed and spread with extremely low-spatter performance. Indium Corporation’s CW-232 is a highly activated rosin flux-cored wire developed to meet the demanding requirements of robotic and laser soldering applications by delivering additional wetting power in order to achieve higher throughput. CW-232 also works exceptionally well in hand soldering applications. Due to its “no-spatter” technology, CW-232 eliminates flux spattering that can burn operators’ hands, impair the vision system of the robotic soldering machines, or make finished products less aesthetically appealing.

Appointment of CEO and COO
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pwrx.com
  • People
  • 2021-01-18

Powerex is pleased to announce the appointments of Joseph Wolf as President and Chief Executive Officer and Ronald Yurko as Chief Operating Officer, in connection with the retirement of John Hall from the company. Joseph has been with Powerex since 2008, most recently serving the role of Vice President and CFO. Ronald has been at Powerex since 2007, most recently in the role of Vice President of Value-Added Products. Powerex is a joint venture between General Electric and Mitsubishi Electric with corporate headquarters and manufacturing located in Youngwood, Pennsylvania. The company was founded in 1986 and can trace its origins back to Westinghouse Electric, which established the facility at the current location in 1956. The 90,000 square feet of manufacturing space includes silicon wafer processing, diffusion, assembly, test,and high reliability screening. Powerex also features a semi-automated manufacturing power module line in a Class 10,000 cleanroom. Powerex is a leading domestic manufacturer of high-power semiconductor solutions. Its broad product line includes SiC MOSFETs (SiliconCarbide Metal-Oxide-Semiconductor Field-Effect Transistor), IGBTs (Insulated Gate Bipolar Transistors), HVIGBTs, rectifiers, thyristors, custom power modules and assemblies. These highly reliable electronic component solutions are designed for the Defense, Aviation, Traction, Mining, Medical, and Renewable Energy markets.

Expanding Production Capacity of SiC Power Devices
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rohm.com/news
  • Industry News
  • 2021-01-18

ROHM has recently held an opening ceremony announcing the completion of a new building at ROHM Apollo's Chikugo plant to enhance the production capacity of SiC power devices. The building is a state-of-the-art environmentally friendly factory that introduces a number of energy-saving technologies to its production facilities, with 100% of its electricity coming from renewable energy sources. ROHM continues to lead the industry in technological development, such as by introducing the industry's first full SiC power modules and SiC trench MOSFETs. At the same time, boasting an integrated production system, ROHM is working to improve production efficiency by increasing wafer diameter and utilizing the latest equipment while also reducing the environmental impact of manufacturing. In addition to this new building, SiCrystal GmbH, a ROHM Group company that manufactures SiC wafers, is scheduled to start operating with 100% renewable energy from the next fiscal year, reducing CO2 emissions from purchased power at the plant to zero. As a result, all major production processes for SiC wafers will use environmentally friendly renewable energy. In response to the urgent need to address global energy issues, the ROHM Group will continue to improve SiC power device performance – expected to be key to achieving energy saving in electric vehicles and industrial equipment – contributing to reducing environmental impact by promoting the use of eco-friendly equipment and renewable energy in the production process.

Configurable AC/DC Power Supply with 24 Isolated Outputs
  • Product Release
  • 2021-01-14

Components Bureau is pleased to offer Advanced Energy's Excelsys CoolX3000 series. The small sized configurable power supply offers an incredible 3000W in a small package of 300 x 131 x 120mm, addressing the requirement for smaller power supplies offering the same power but in a smaller footprint. The CoolX3000 series offers an impressive 24 outputs; all outputs are isolated (1850 VAC) and the power supply has PMBus digital communications for monitoring and control capability.  Features include plug and play power along with series and parallel outputs for higher voltage and currents. The 3000 series offer up to 91% efficiency with variable fan speed control.  It has level 4 input surge protection with a MTBF of 150,000 hours and comes with 5-year warranty. With an Input voltage range of 180 to 264 VAC (300VAC for 5secs), output voltage of 1 to 696V and ripple and noise 1% of nominal. Operating temperature range  -25 to +60°C with an interface of 8-way connector, voltage control via potentiometer. This intelligent modular power supply is suitable for Medical, Industrial and Harsh Industrial applications.

Validity of Patent Relating to a Separator for Lithium Ion Secondary Batteries
  • Industry News
  • 2021-01-14

The Korean Intellectual Property Trial and Appeal Board issued a decision to dismiss a patent invalidation petition and confirmed the validity of Asahi Kasei's Korean patent (Patent No. 10-0977345) relating to a separator for lithium-ion secondary batteries. Asahi Kasei filed a patent infringement lawsuit with the Seoul Central District Court against W-SCOPE Corporation (Head Office: Shinagawa-ku Tokyo) and its subsidiary, W-SCOPE KOREA CO., LTD. (hereinafter "W-SCOPE Corporation, etc."), which manufacture and sell separators for lithium ion secondary battery, as joint defendants. The lawsuit claims infringement of Asahi Kasei's patent. It seeks an injunction restraining W-SCOPE Corporation, etc., from manufacturing and selling their polyolefin microporous membrane products (including separator products for lithium ion secondary battery with product names such as "SB12D," "SB16D," "single-layer W-scope," etc.) in Korea, and compensation for damages. After Asahi Kasei filed the lawsuit, one of the defendants, W-SCOPE KOREA CO., LTD., filed a patent invalidation petition with the Korean IPTAB seeking the invalidation of Asahi Kasei's patent on March 11, 2020. After sufficiently examining the arguments of both parties, the Korean IPTAB issued a decision to dismiss the invalidation petition and confirmed the validation of Asahi Kasei's patent. Asahi Kasei will pay close attention to issues concerning intellectual property rights, and if deemed necessary, take specific measures proactively against any infringement.

Module Family for High-Density Computing and Datacenters
  • Product Release
  • 2021-01-14

Monolithic Power Systems announced the launch of a new family of 48V to 6V digital DC/DC power modules for 48V Datacenter Solutions, utilizing eGaN transistors from Efficient Power Conversion (EPC) Corporation. These power modules target applications for high-density computing and datacenters, artificial intelligence, machine learning, and multi-user gaming. The MPC1100-54-0000 is the first in the new product family that will include modules in an LLC topology that utilize eGaN FETs to achieve an overall efficiency above 97% in a footprint of only 27mmx18mmx6mm for 48V to 6V conversion. A key advantage of 48V to 6V front-end conversion includes the enabling of a high-frequency secondary stage that is small enough to be placed much closer to the xPU/ASIC/GPU to reduce the power distribution loss by 4X compared to the commonly used STC topology for 48V to 12V conversion. For high-density server applications, record power density and efficiency can be achieved with simple, low-cost topologies such as an LLC DC/DC converter. eGaN FETs are well-suited for LLC converters due to their combined low gate charge with 5V gate operation that yields very low gate power consumption, ultra-low on resistance, and low output capacitance charge.

Certified Components for Automotive Electronics
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  • Industry News
  • 2021-01-14

Würth Elektronik has published a catalog of AEC-Q200 certified components for automotive electronics. Product highlights include ferrites, inductors and particularly robust electromechanical components. Design kits from many product groups are available for developers-as sample sets with free refill service. With WE-TEMA, Würth Elektronik offers an innovative series of ferrites for cable assembly, some variants of which use new, innovative materials like nanocrystalline and manganese-zinc. The range of high-frequency inductors is now complemented with the WE-MCI product family. With their inductance ranging from 1 nH up to 470 nH, the multilayer ceramic inductors cover a wide variety of application areas. The WE-MAIA SMT series of storage chokes has been extended with package sizes 1610, 5020, 5030, 4020HT. Würth Elektronik presents its new WE-SCFA contact fingers, certified for the special requirements in automotive applications and with WE-SMSA SMT spacer bolts. Besides detailed product information in several chapters, the new automotive catalog also provides extensive background and design knowledge as well as a series of practical application examples. The Würth Elektronik Automotive Components Catalog is now available in English at http://www.we-online.de/aspcatalogue21.


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APEC 2021 Moves to Virtual Event FormatContinued global travel restrictions, unknown guid...9178Event NewsAPEC 2021 Moves to Virtual Event FormatContinued global travel restrictions, unknown guidance on large gatherings, as well as social distancing protocols make it impossible to move forward with an in-person event at this time. APEC 2021 will be presented on the virtual event platform Social27 and will take place Monday, June 14 - Thursday, June 17 with on demand access starting the week of June 7. APEC is partnering with Social27, a virtual event platform, to ensure that the conference provides the same quality content that APEC conference attendees are accustomed to. Closer to the conference, APEC will host a training webinar that will walk you through the virtual meeting platform. Attendees will be granted access to the virtual event platform and all on-demand sessions during the week of June 7, 2021. On-demand recordings will include: technical session lectures and dialogues (poster sessions), industry sessions, and professional education seminars. This will also provide attendees with time to build their attendee profiles, and get acquainted with the site.01.04.2021 06:00:00Apr\images\news_apec1.jpghttp://apec-conf.org/conference/registration/faqs-1/apec-conf.org
Laser Driver IC Family for Augmented RealityEPC announces the introduction of a laser driver t...9177Product ReleaseLaser Driver IC Family for Augmented RealityEPC announces the introduction of a laser driver that integrates a 40 V, 10 A FET with a gate driver and low-voltage differential signaling (LVDS) logic level input in a single chip for time-of-flight lidar systems used in robotics, drones, augmented reality, and gaming applications. The EPC21603 is a laser driver that is controlled using LVDS logic and is capable of very high frequencies exceeding 100 MHz and super short pulses (< 2 ns) to modulate laser driving currents up to 10 A. The EPC21603 is a single-chip driver plus eGaN FET using EPC's proprietary GaN IC technology in a chip-scale BGA form factor that measures only 1.5 mm x 1.0 mm. The LVDS logic control allows the eToF laser driver IC to be controlled from an FPGA for applications where noise immunity is critical, such as augmented reality. "The EPC21603 joins the recently announced EPC21601 as the initial products in our new family of GaN ICs that dramatically improve the performance while reducing size and cost for time-of-flight lidar systems," said Alex Lidow, CEO, and co-founder of EPC. "This new family of GaN integrated circuits will continue to expand to higher currents, higher voltages, as well as furthering integration of additional control and logic features on a single chip."23.03.2021 17:30:00Mar\images\news_2021-04-01_22.pnghttps://epc-co.com/epc/EventsandNews/News/ArtMID/1627/ArticleID/2982/Efficient-Power-Conversion-EPC-Expands-eToF-Laser-Driver-IC-Family-of-Products-with-Device-Optimized-for-Augmented-Reality.aspxepc-co.com/News
Hall-effect Current Sensor Without a Core or U-Shaped Magnetic ShieldAllegro MicroSystems announced a coreless Hall-eff...9175Product ReleaseHall-effect Current Sensor Without a Core or U-Shaped Magnetic ShieldAllegro MicroSystems announced a coreless Hall-effect current sensor for demanding automotive and industrial systems, offering higher accuracy and sensitivity, additional fault detection capabilities, and user programmability. Allegro's ACS37610 sensor joins the ACS37612 as a family of truly coreless Hall sensing solutions designed to measure currents from 100 A to greater than 4000 A flowing through a busbar or PCB trace with a typical 1 percent accuracy – with no need for an external concentrator or U-shaped magnetic shield. These solutions enable system designers to achieve enhanced efficiency and higher power density while reducing system complexity, BOM, cost, footprint, and weight. "As a leading innovator in current sensing solutions for more than 20 years, Allegro was first to market with coreless differential Hall-effect current sensing technology, and our new ACS37610 IC enables our customers to accurately measure hundreds or thousands of amps in a very economical and simple way," said Shaun Milano, Director of Current Sensors at Allegro. "Our differential Hall-based sensors provide excellent immunity to stray magnetic fields without the need of a shield, required by competing solutions, that slows down response and adds non-linearity error into the system." The ACS37610 is an optimal choice for electric vehicle high-voltage traction motor inverters, 48V / 12V auxiliary inverters, heterogeneous redundant battery monitoring, overcurrent detection, smart fuses, power distribution units (PDUs), and power supplies. The sensor's 250 kHz bandwidth, dedicated overcurrent and overtemperature fault pin, and a slew of built-in diagnostics make it ideal for safety-critical applications.23.03.2021 15:30:00Mar\images\news_2021-04-01_21.jpghttps://www.allegromicro.com/en/about-allegro/news-room/2021/acs37610-prallegromicro.com/news-room
AC-DC Active Bridge Rectifier SolutionsAlpha and Omega Semiconductor announced a family o...9173Product ReleaseAC-DC Active Bridge Rectifier SolutionsAlpha and Omega Semiconductor announced a family of active AC-DC bridge rectifiers. Aptly trademarked AlphaZBL for "zero bridge loss," this family of products virtually eliminates the bridge rectifier losses in AC-DC power supplies and adaptors. Typical end applications include high power 100W and above adaptors used for high-end laptops and televisions as well as power supplies for Desktops, Game consoles, Servers, and Telecom. The first two members of the family include a controller, AOZ7200, in a SOT-23 package and an integrated product AOZ7270, which integrates a 600V, 190mOhm MOSFET in a DFN 5x7 package. The AOZ7200 offers maximum flexibility to trade off performance and cost by pairing it with AOS's benchmark super junction family of MOSFETs. The AOZ7270 takes advantage of AOS's capabilities in novel IC design, benchmark MOSFET technology, and innovative packaging to reduce component count and design time. Both products are self-powered from the AC line and do not require external circuitry. The proprietary self-biasing scheme sips minimal power from the AC line making it very efficient in light load or standby mode of operation. In a typical 100W application, the AOZ7270DI delivers efficiency improvements of 0.89% at 115VAC and 0.44% at 230VAC over a diode bridge. Both products exceed lightning surge requirements that are a critical requirement in AC-DC applications.23.03.2021 13:30:00Mar\images\news_2021-04-01_19.jpghttp://www.aosmd.com/res/news/news-article-1616514437424/ZBL_Zero%20Bridge%20Loss_PR.pdfaosmd.com/news
Dr. Tobias Geyer Honored with Innovation AwardThis year the jury has decided to give the SEMIKRO...9162Industry NewsDr. Tobias Geyer Honored with Innovation AwardThis year the jury has decided to give the SEMIKRON Innovation Award to Dr. Tobias Geyer from ABB Medium-Voltage Drives, Switzerland to acknowledge his pioneering work in the field of Model Predictive Control awarding his innovation regarding ´Model Predictive Pulse Pattern Control´. Optimized pulse patterns (OPPs) minimize the current distortions per switching frequency during steady-state operation, but achieving high dynamic performance is generally considered impossible. Model predictive pulse pattern control (MP3C) solves this problem by formulating and solving a model predictive control problem. The stator flux vector is controlled along its optimal trajectory by modifying the switching instants of the OPP's switching transitions. MP3C combines the benefits of hysteresis control methods, such as direct torque control, with the optimal steady-state performance of OPPs, by resolving the antagonism between the two. MP3C has been successfully demonstrated and proven in an ABB medium-voltage drive. The control innovation increases the drive's power by up to 50% at high fundamental frequencies.<br>This year's SEMIKRON Young Engineer Award is given to Dr. Jakub Kucka (now EPFL École Polytechnique Fédérale de Lausanne) for his work on ´Quasi-Two-Level PWM Operation for Modular Multilevel Converters´ he has conducted at the Institute for Drive Systems and Power Electronics of Leibniz University Hannover, Germany. The novel quasi-two-level PWM operation mode revolutionizes the way how the modular multilevel converters are operated in low-frequency medium-voltage drive applications. Thanks to the quasi-two-level PWM operation, the amount of installed modules' capacitance in the modular multilevel converters can be reduced by more than one order of magnitude.23.03.2021 13:00:00Mar\images\news_2021-04-01_8.jpghttps://www.semikron.com/about-semikron/news-press/detail/semikron-foundation-and-ecpe-honour-dr-tobias-geyer-with-the-innovation-award-2021-while-this-years-young-engineer-award-goes-to-dr-jakub-kucka.htmlsemikron.com/news-press
Search Engine of Electronic ComponentsSnapEDA and DipTrace are announcing a collaboratio...9166Product ReleaseSearch Engine of Electronic ComponentsSnapEDA and DipTrace are announcing a collaboration that introduces support for DipTrace on the SnapEDA website, and integrates SnapEDA's massive computer-aided design (CAD) database directly into DipTrace's latest PCB design software. With billions of electronic components to choose from, engineers are faced with multiple challenges during the component selection stage. First, engineers need to filter an overwhelming number of electronic components to select one with the best form, fit and function for their design. And once they've made their selection, they need to source or create digital models for that electronic component, in order to integrate it. The SnapEDA search capability now available within DipTrace 4.1.2 solves both of these challenges to help engineers select and integrate electronic components in a snap. Finding components is as simple as searching the part needed, such as '25 MHz crystal', and once an engineer selects a part, it comes ready-to-use with its schematic symbol, PCB footprint and 3D model for instant design-in. "DipTrace has consistently been one of the most requested formats over the last year. We are thrilled to be able to introduce DipTrace support to the SnapEDA community, and collaborate to provide a native SnapEDA experience within the latest version of DipTrace," said Natasha Baker, CEO & Founder of SnapEDA.23.03.2021 07:30:00Mar\images\news_2021-04-01_12.pnghttps://www.snapeda.com/diptrace/snapeda.com/diptrace
AC-DC Converter ICs for Appliances, Sensors and Metering ApplicationsPower Integrations announced a member of its accla...9165Product ReleaseAC-DC Converter ICs for Appliances, Sensors and Metering ApplicationsPower Integrations announced a member of its acclaimed LinkSwitch-TN2 AC-DC converter family. The LNK3207 ICs facilitate higher-power offline buck converter designs for appliances and industrial applications by increasing the available output current from 360 mA to 575 mA, while also reducing BOM count. Power Integrations' LinkSwitch-TN2 ICs increase output current from 360 mA to 575 mA & target mass-market appliances such as washers, dryers, coffee makers and more. Design engineers can easily upgrade existing designs while reducing BOM count. Silvestro Fimiani, product marketing manager at Power Integrations said: "These LinkSwitch-TN2 ICs are pin-to-pin compatible with previous generations, making it simple for customers to upgrade to higher-power designs. A high-current buck converter can be created using a minimal number of easily available components while saving at least one diode over previous solutions." The LNK3207 AC-DC converter ICs increase the available current by 60% while also delivering greater than 80% efficiency and no-load consumption of less than 30 mW. Each monolithic LinkSwitch-TN2 IC incorporates a 725 V power MOSFET, oscillator, on/off control for high efficiency at light load, a high-voltage switched current source for self-biasing, frequency jittering, fast (cycle-by-cycle) current limit, hysteretic thermal shutdown, and output and input overvoltage protection circuitry. The LinkSwitch-TN2 ICs target mass-market appliances such as washers, dryers and coffee makers, which benefit from their design simplicity. They are also suitable for sensor-based devices that require low power such as home security cameras and smart thermostats, as well as metering and IoT installations. Devices are available in three packages, PDIP-8C, SMD-8C and SO-8C, for design flexibility. The SMD-8C package is ideal for high-temperature ambient 85/105 °C applications.23.03.2021 06:30:00Mar\images\news_2021-04-01_11.jpghttps://investors.power.com/investors/press-releases/press-release-details/2021/Uprated-LinkSwitch-AC-DC-Converter-ICs-From-Power-Integrations-Increase-Available-Current-by-60/default.aspxpower.com/press-releases
85/85 THB-rated AC Filter Capacitors for Harsh EnvironmentsDesigned for harsh environments, Cornell Dubilier'...9172Product Release85/85 THB-rated AC Filter Capacitors for Harsh EnvironmentsDesigned for harsh environments, Cornell Dubilier's ALH series of AC-rated filter capacitors offer 50% greater life than competitive 85/85 THB-rated film capacitors. The Temperature, Humidity at Bias (THB) test exposes parts to the harsh conditions of 85 °C at 85% relative humidity with rated voltage applied. CDE's testing has been validated for 1,500 hours, while competitors validate their series for 1,000 hours under the same conditions. This demanding test simulates the extremely harsh operating conditions encountered in many commercial and industrial inverter applications that can cause conventional film capacitors to fail early due to heat and moisture penetration. The ALH Series is optimized for AC harmonic filtering on the input and output sides of inverter circuits. Capacitance ranges from 0.22 to 50 µF at 160-450 Vac, 50/60Hz with high rms current ratings for handling higher ordered harmonics. The series offers self-healing, metalized polypropylene-film construction in a robust board-mount package that also meets the rigors of automotive AEC Q200 testing. The solvent-resistant, box-style plastic case and resin-seal are both UL/cUL 94V-0 recognized for construction designs, with tin-plated copper RoHS compliant terminations. Their superior construction makes these capacitors ideally suited for solar, wind, UPS, EV, and other inverter applications that may be subjected to wide-ranging environmental conditions.22.03.2021 12:30:00Mar\images\news_2021-04-01_18.jpghttps://www.cde.com/new-product/alhcde.com/new-product
Synchronous DC-DC Inverting Converters for Industrial Automation and Signal ConditioningAs Maxim Integrated's first 60V inverting DC-DC co...9167Product ReleaseSynchronous DC-DC Inverting Converters for Industrial Automation and Signal ConditioningAs Maxim Integrated's first 60V inverting DC-DC converters with integrated level shifters, the MAX17577 and MAX17578 save up to 72 percent of board space by reducing component count by half while using 35 percent less energy than the closest competitive solutions. Both ICs reduce size, heat, and cost, while simplifying the design of negative output voltage rails needed for analog signals within intelligent IoT devices found in factory automation, building automation and communications systems. As network edge devices expand with Artificial Intelligence capabilities, designers must reduce the solution size and heat generation. They seek solutions that are more efficient, creating less heat and use less board space, saving time and cost. The MAX17577 and MAX17578 integrate level shifting circuitry to reduce component cost and count by as much as 50 percent while reducing component area to 60 mm2, a 72 percent advantage in board space over competitive solutions. These synchronous inverting converters protect against input voltage transients with the industry's widest input voltage range from 4.5V to 60V, thus increasing system robustness in harsh environments. The MAX17577 and MAX17578 generate less heat by dissipating 35 percent less power than competitive solutions, improve system reliability and provide developers with up to six percentage points more efficiency.22.03.2021 08:30:00Mar\images\news_2021-04-01_13.jpghttps://www.maximintegrated.com/en/aboutus/newsroom.html/pr_111477370maximintegrated.com/newsroom
Sustainable Operation of TrainsSiemens Mobility and Infineon Technologies have jo...9161Industry NewsSustainable Operation of TrainsSiemens Mobility and Infineon Technologies have jointly developed auxiliary converters to improve the efficiency of on-board power systems using power semiconductors based on silicon carbide (SiC). Siemens uses the converter for various train platforms. As a result, the platforms are maintenance-friendly, reliable, economical and, above all, power efficient. "With SiC, we achieve higher switching speed as well as efficiency to reduce the size of transformers, capacitors, cooling elements and the housing unit. The advantages of this semiconductor material are evident and are now being leveraged in rail-bound vehicles," said Dr. Peter Wawer, President of Infineon's Industrial Power Control Division. In addition to providing the AC voltage (e.g., 3 AC 400 V 50 Hz) required for the vehicle power system, auxiliary converters also deliver the required battery voltage (e.g., 110 V DC). To achieve this, they convert the DC voltage provided at the converter input. They ensure that train passengers can charge laptops and smartphones; the air conditioning and ventilation systems are running; and the on-board restaurant can offer hot and cold drinks and food. Without them, connectivity, information or entertainment services on trains would not be available. As part of the system, SiC reduces the overall costs in the on-board electrical system and the energy consumption of the auxiliary converter. It also enables more compact and lighter converter designs, along with a modular and service-friendly design to ensure lower maintenance costs.18.03.2021 12:00:00Mar\images\news_2021-04-01_7.pnghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2021/INFIPC202103-051.htmlinfineon.com/press
Isolated Gate Driver Safely Controls Silicon-Carbide MOSFETsJoining STMicroelectronics' STGAP family of isolat...9169Product ReleaseIsolated Gate Driver Safely Controls Silicon-Carbide MOSFETsJoining STMicroelectronics' STGAP family of isolated gate drivers, the STGAP2SiCS is optimized for safe control of silicon carbide (SiC) MOSFETs and operates from a high-voltage rail up to 1200V. Capable of producing a gate-driving voltage up to 26V, the STGAP2SiCS has a raised Under-Voltage Lockout (UVLO) threshold of 15.5V to meet the turn-on requirements of SiC MOSFETs. If the driving voltage is too low, which can be caused by low supply voltage, the UVLO ensures the MOSFET is turned off to prevent excessive dissipation. The driver features dual input pins that let designers determine the gate-drive signal polarity. With 6kV of galvanic isolation between the input section and the gate-driving output, the STGAP2SiCS helps ensure safety in consumer and industrial applications. Its 4A output-sink/source capability is suited to mid- and high-power convertors, power supplies, and inverters in equipment such as high-end home appliances, industrial drives, fans, induction heaters, welders, and UPSes. Two different output configurations are available. One has separate output pins that allow independent optimization of turn-on and turn-off times using a dedicated gate resistor. The second is featured for high-frequency hard switching, with a single output pin and active Miller clamp that limits oscillation of the SiC MOSFET gate-source voltage to prevent unwanted turn-on and enhance reliability. The input circuitry is compatible with CMOS/TTL logic down to 3.3V, which allows easy interfacing with a wide variety of control ICs.18.03.2021 10:30:00Mar\images\news_2021-04-01_15.jpghttps://newsroom.st.com/media-center/press-item.html/n4344.htmlnewsroom.st.com
Webinar on Power Electronics Design Saber solutions will host a webinar on “Power Elec...9157Event NewsWebinar on Power Electronics Design Saber solutions will host a webinar on “Power Electronics Design with SaberEXP and SaberRD” on April 13th. With increased focus on electrification and rapid growth of the power electronics market, design teams need a robust and efficient simulation and modeling solution to predict hardware failures during early design phases. Simulation helps to reduce iterations of hardware prototypes and time-to-market that results in reduced development costs. Depending on the application, the simulation and modeling requirements vary a lot between different stages of product development, but there is no single simulation environment that satisfies all simulation and modeling requirements. Synopsys provides you a comprehensive solution to address this challenge with SaberEXP and SaberRD. Instructor: Andre Jennert, Sr. Staff Applications Engineer<br /><a href="https://register.gotowebinar.com/register/7624358187680465423">EU Session</a> / <a href="https://register.gotowebinar.com/register/7201363970016616720">US Session</a>18.03.2021 08:00:00Mar\images\news_2021-04-01_3.pnghttps://saber-solutions.comsaber-solutions.com
Low-Temp Solder WebinarIndium Corporation's Claire Hotvedt, CSMPTE, Produ...9155Event NewsLow-Temp Solder WebinarIndium Corporation's Claire Hotvedt, CSMPTE, Product Development Specialist, will host a Webex webinar focused on its innovative low-temperature solder offering as part of Indium Corporation's ongoing webinar series April 6 at 8 p.m. Eastern (5 p.m. Pacific/April 7 at 8 a.m. Singapore). Low-temperature soldering is not a "one alloy fits all" solution. Depending on the application, the actual temperature required for low-temperature soldering can vary widely. In "Low-Temperature Solder Innovation - Durafuse LT and the Low- to Mid-Temperature Space", Hotvedt will examine Durafuse's ability to bring mid-temperature drop shock properties into the upper edge of the low-temperature space, as well as low-temperature solder's specific process limitations and lifetime requirements. Indium Corporation's InSIDER Series is a free program designed to deliver expert technical content, share industry knowledge, and promote professional growth using a virtual platform. Current and future webinars can be found at www.indium.com/webinar. Hotvedt is responsible for facilitating the transition of new solder paste products from developmental stages into fully launched and marketable solutions. She also oversees product characterization and creation of marketing material to assist the sales team. Prior to joining Indium Corporation in 2018, Hotvedt held two engineering positions-one at Orthogonal, Inc. and one at Bristol-Myers Squibb. She was also an Indium Corporation Summer Intern in 2014. To register for Hotvedt's webinar, visit www.indium.com/webinar. The webinar link will be shared with registrants the day of the event. Registrants must use a company email account in order to avoid Indium Corporation's spam filters. This is a first come, first served event.18.03.2021 06:00:00Mar\images\news_2021-04-01_1.jpghttps://www.indium.com/corporate/media-center/webinars/indium.com/webinars
120 mO, 650 V SiC MOSFETsRichardson RFPD announced the availability and ful...9171Product Release120 mO, 650 V SiC MOSFETsRichardson RFPD announced the availability and full design support capabilities for three 120 mO, 650 V SiC MOSFETs from Wolfspeed, a Cree Company. Wolfspeed's 650 V SiC MOSFET portfolio is based on the latest third-generation C3M SiC MOSFET technology, offering the widest range of on-resistances, the industry's lowest on-state resistances in a discrete package, as well as low switching losses-enabling high efficiency and power density. The 120 mO, 650 V SiC MOSFETs are available in both through-hole (TO-247-3, TO-247-4) and surface mount (TO-263-7) packages.17.03.2021 11:30:00Mar\images\news_2021-04-01_17.jpghttps://www.richardsonrfpd.com/docs/rfpd/Announcing_Wolfspeed_New_Additions_to_Lineup_of_650V_MOSFETs.pdfrichardsonrfpd.com/Announcing.pdf
Galvanic Isolation Technology for SiC, GaN and MOSFET Gate DriversTower Semiconductor announced a galvanic capacitor...9168Product ReleaseGalvanic Isolation Technology for SiC, GaN and MOSFET Gate DriversTower Semiconductor announced a galvanic capacitor technology integrated with its 0.18um power management and mixed signal platforms, enabling up to 12kV isolated gate driver and digital isolator ICs, which enhance safety and power efficiency for applications in the automotive, green power and industrial markets, addressing an estimated $1B market. The technology offers a cost and size advantage thanks to the integration of the galvanic isolator, saving the need for an additional device. Lead customers are prototyping initial products addressing applications such as battery chargers, power supplies and motor drivers for electric and hybrid vehicles, green power (solar inverters and wind turbines power converters) and industrial markets. "We are very excited to announce this innovative technology as we partner with lead customers to bring new products to market, supporting the anticipated high-growth in electrical vehicles and other applications for isolated power," said Mr. Shimon Greenberg, Tower's Vice President and General Manager of Mixed-Signal and Power Management Division, Analog BU. "The new technology augments our widely deployed 0.18um power technology, supporting applications from 5V to 200V".17.03.2021 09:30:00Mar\images\news_2021-04-01_14.jpghttps://towersemi.com/2021/03/17/03172021/towersemi.com
Comprehensive Partnership for Gallium NitrideNexperia has announced a comprehensive partnership...9164Industry NewsComprehensive Partnership for Gallium NitrideNexperia has announced a comprehensive partnership covering gallium nitride (GaN) power semiconductor devices with United Automotive Electronic Systems Co., Ltd. (UAES). The program will focus on power systems for EVs, with the aim to jointly develop automotive applications using GaN technology. UAES has already started using Nexperia GaN FETs in R&D and collaborative projects including vehicle-mounted chargers and high-voltage DC-to-DC converters for electric cars. Nexperia's GaN technology has extremely good figures of merit (RDS(on) x QGD) and reverse recovery charge (Qrr) metrics that support high switching frequencies and efficient power conversion. Nexperia produces GaN based on mature and reliable mass production techniques, largely in its own global production facilities, to manufacture products according to automotive AEC-Q101 standards. UAES provides car manufacturers with advanced and comprehensive automotive powertrain and body control system solutions. It specializes in the development, production, and sales of gasoline engine management systems, transmission control systems, vehicle body electronics, and hybrid and electric drive control systems. Its five technology centers in China have world-class laboratories for entire vehicles, engines, automatic transmissions, and electric drive performance development. The advanced equipment effectively provides high-quality engineering services including system development, component development, and calibration for various Chinese car manufacturers.16.03.2021 15:00:00Mar\images\news_2021-04-01_10.pnghttps://www.nexperia.com/about/news-events/press-releases/nexperia-and-united-automotive-electronic-systems-co.--ltd.-agree-comprehensive-partnership-for-gallium-nitride.htmlnexperia.com/press-releases
AEC-Q200 Compliant High Current Shielded Power Inductor SeriesBourns introduced three AEC-Q200 compliant high cu...9174Product ReleaseAEC-Q200 Compliant High Current Shielded Power Inductor SeriesBourns introduced three AEC-Q200 compliant high current shielded power inductor series. Helping to meet the high current density, high temperature and reliability requirements for power management and EMI filtering in a variety of consumer, industrial and telecom electronics applications, Bourns Model SRP1580CA, SRP1510CA and SRP1513CA inductors offer high current capacity, compact size, high operating frequency and a high operating temperature range. The three AEC-Q200 compliant inductor series are manufactured with flat wire and Bourns' uniquely formulated metal alloy powder core using a molded construction manufacturing process. This process enables a superior magnetically shielded construction that offers low DC resistance, high heating / saturation current, low buzz noise and excellent temperature stability for low magnetic field radiation. In addition, all of the models are built with flat enameled coated wire with self-lead terminal for ultra-low DC resistance. Plus, the high current shielded inductors have an operating temperature range of -55 to +155 °C, and are designed with the same 16.5 x 15.5 mm interchangeable footprint. The Bourns Model SRP1580CA, SRP1510CA and SRP1513CA series are available now and are RoHS compliant* and halogen free.16.03.2021 14:30:00Mar\images\news_2021-04-01_20.jpghttps://www.bourns.com/news/press-releases/pr/2021/03/16/bourns-introduces-new-aec-q200-compliant-high-current-shielded-power-inductor-seriesbourns.com/news
25 Years of Success in IndiaIt was the beginning of the 1990s: Hans-Rudolf Sch...9163Industry News25 Years of Success in IndiaIt was the beginning of the 1990s: Hans-Rudolf Schurter took over as Chairman of the Board of Directors from his father Rolf. At the same time, Asia was the emerging continent. China was awakening and beginning to reform. The martial term Tiger Countries was on everyone's lips. SCHURTER, at that time almost exclusively present in Western Europe and the USA, decided to venture east as well in order not to miss this opportunity. But the focus was not on Hong Kong or Singapore. Many Western companies were drawn to China, others to India. The most populous countries on earth promised enormous potential. The choice between the giants China and India was decided in favour of the latter. Hans-Rudolf Schurter assumed that the Indian mentality would be easier to integrate because of the English legal system and language. However, the first contacts between locals and members of the SCHURTER Group took place on the other side of the planet - in the USA. Bruno Schurter, then managing director of SCHURTER Inc. in Santa Rosa, California, maintained business relations with Asgari Lokhandwala. After his studies, Asgari worked for a company that manufactured power supply units for personal computers. For this purpose, he bought connectors and fuses from SCHURTER Inc. This was the beginning of the association between the Lokhandwala family and SCHURTER.16.03.2021 14:00:00Mar\images\news_2021-04-01_9.jpghttps://live.schurter.com/content/download/4972167/75913503/version/2/file/SCHURTER_SuccessStory_25_years_SEI_en.pdflive.schurter.com/download.pdf
Mike Morton Announced Chief Executive OfficerTTI announced the appointment of Mike Morton to th...9158PeopleMike Morton Announced Chief Executive OfficerTTI announced the appointment of Mike Morton to the position of Chief Executive Officer, effective immediately. Morton has served the company for 40+ years in various leadership positions, most recently providing exceptional leadership as chief operating officer. Through his years with TTI, Morton has played a vital role in building the company to its current level of success. His knowledge of the company and vast experience is expected to serve him well as he takes on this new key position. The announcement follows the passing of TTI's founder, Paul Andrews. Andrews' leadership and guidance propelled the Fort Worth based company to become the fifth largest electronics distributor in North America.15.03.2021 09:00:00Mar\images\news_2021-04-01_4.jpghttps://www.ttieurope.com/content/ttieurope/en/about-tti/news-center/corporate-news/press-releases/2021/march/pr-03052021-tti-mike-morton-appointed-ceo.htmlttieurope.com/news-center
Funding to Scale Up Ultracapacitors ProductionSkeleton Technologies unveiled its plans to develo...9160Industry NewsFunding to Scale Up Ultracapacitors ProductionSkeleton Technologies unveiled its plans to develop first-of-its-kind production technology for manufacturing its ultracapacitors, following the official support announced by German authorities in January. To execute these plans, the company will receive an additional €51 million ($60 million) from Germany's Federal Ministry for Economic Affairs and Energy and the Free State of Saxony. This project will include the development of a fully-automated ultracapacitor production line in its Großröhrsdorf factory – a first in the industry. The economies of scale provided by this new technology, combined with the use of Skeleton's patented "curved graphene" material, will dramatically drive the production costs down, boosting the competitiveness of ultracapacitors as the key enabling technology for the future of transportation and electrification. Taavi Madiberk, CEO and co-founder of Skeleton Technologies, explains: "We are continuously investing in R&D – whether it is improving the performance of our products or the process in which we make those products. The next stage of our production will see an implementation of fully automated Industry 4.0 manufacturing techniques – a first-of-its-kind in the ultracapacitor industry. Coupled with our curved graphene material, we are able to dramatically decrease the cost of ultracapacitors. The ultracapacitor industry is in the same situation as lithium-ion batteries were in 1999, but our advancements in core technology and production capabilities will be able to show a cost reduction faster than for any other energy storage technology. We have a clear road map to lower it by almost 90% after completion of our 5 years project."11.03.2021 11:00:00Mar\images\news_2021-04-01_6.jpghttps://www.skeletontech.com/news/germany-backs-skeletons-development-of-advanced-ultracapacitor-production-technologyskeletontech.com/news
Leakage Current Sensor for Electric Vehicle Charging StationsLEM launches the CDSR, a leakage current sensor ba...9170Product ReleaseLeakage Current Sensor for Electric Vehicle Charging StationsLEM launches the CDSR, a leakage current sensor based on its open-loop Fluxgate Technology. The CDSR is innovative, extremely compact and safe, allowing manufacturers to optimize the electronic design of their charger products. Since 2016, IEC standards and more specifically IEC 62955 / IEC 62752, require the detection of a Direct Leakage current at 6 mA DC to avoid the home Residual Current Device (RCD) Type A being ineffective. This effect, called "the blinding effect", appears when an EV develops an insulation fault. EV architecture integrates a battery pack, powered by Direct Current (DC), which can generate a leakage current that can deactivate a home RCD. To protect the RCD and avoid the need to install an RCD type B in the electrical panel of home EV owners, EV chargers include a device to detect the DC leakage current. This detection is the role of the CDSR. The CDSR has been developed to meet market demand for a residential and commercial charging station, offering a version for single-phase architecture and another for three-phase topology. With a maximum current per phase of 32A rms, the CDSR can be integrated into AC chargers from 3.7 kW to 22kW. Following the trend towards digital electronics, the CDSR provides not only an analog communication output but also a Serial Peripheral Interface (SPI), enabling simple interfacing of hardware. The CDSR operates from a +3.3VDC supply and has a typical current consumption of just 50 mA when measuring 150 mA as a maximum primary residual current.10.03.2021 11:40:00Mar\images\news_2021-04-01_16.jpghttps://www.lem.com/en/cdsr-serieslem.com/cdsr-series
Contactless Power Transmission in the Kilowatt RangeA team led by Technical University of Munich (TUM)...9159Industry NewsContactless Power Transmission in the Kilowatt RangeA team led by Technical University of Munich (TUM) physicists Christoph Utschick and Prof. Rudolf Gross has succeeded in making a coil with superconducting wires capable of transmitting power in the range of more than five kilowatts contactless and with only small losses. The wide field of conceivable applications include autonomous industrial robots, medical equipment, vehicles and even aircraft. Contactless power transmission has already established itself as a key technology when it comes to charging small devices such as mobile telephones and electric toothbrushes. Users would also like to see contactless charging made available for larger electric machines such as industrial robots, medical equipment and electric vehicles. Such devices could be placed on a charging station whenever they are not in use. This would make it possible to effectively utilize even short idle times to recharge their batteries. However, the currently available transmission systems for high performance recharging in the kilowatt range and above are large and heavy, since they are based on copper coils. Working in a research partnership with the companies Würth Elektronik eiSos and superconductor coating specialist Theva Dünnschichttechnik, a team of physicists led by Christoph Utschick and Rudolf Gross have succeeded in creating a coil with superconducting wires capable of contactless power transmission in the order of more than five kilowatts (kW) and without significant loss. 10.03.2021 10:00:00Mar\images\news_2021-04-01_5.jpghttps://www.tum.de/nc/en/about-tum/news/press-releases/details/36486/tum.de/news
European Silicon Design Center in MunichApple will make Munich its European Silicon Design...9156Industry NewsEuropean Silicon Design Center in MunichApple will make Munich its European Silicon Design Center, adding hundreds of employees and a new facility focused on connectivity and wireless technologies. Munich is already Apple's largest engineering hub in Europe, with close to 1,500 engineers from 40 countries working in a variety of areas including power management design, application processors, and wireless technologies. The expansion in Munich, together with additional investment in R&D, will exceed 1 billion euros in the next three years alone. "I couldn't be more excited for everything our Munich engineering teams will discover - from exploring the new frontiers of 5G technology, to a new generation of technologies that bring power, speed, and connectivity to the world," said Tim Cook, Apple's CEO. "Munich has been a home to Apple for four decades, and we're grateful to this community and to Germany for being a part of our journey." This expansion is the latest step in Apple's longstanding effort to build a world-class team of engineers in Munich and across Germany. In 2019, the company added silicon engineering sites in Nabern, Kirchheim unter Teck. Today, about half of Apple's global power management design team is located in Germany, and Apple also has teams in Munich working on application processor SoCs, and analog and mixed signal solutions for iPhone.10.03.2021 07:00:00Mar\images\news_2021-04-01_2.jpghttps://www.apple.com/uk/newsroom/2021/03/apple-to-invest-over-1-billion-euros-in-germany-with-new-munich-campus/apple.com/newsroom
Sufficient State-of-the-art Telecom Infrastructure is CrucialInfineon Technologies has provided CoolGaN to deli...9148Product ReleaseSufficient State-of-the-art Telecom Infrastructure is CrucialInfineon Technologies has provided CoolGaN to deliver efficiency and reliability to telecom power supply systems. Infineon's GaN devices are qualified according to JEDEC standards, offering lifetimes beyond 15 years, and are a perfect fit for industrial telecom and server SMPS. The CoolGaN 600 V e-mode HEMT in the DFN8x8 package is a key component in Delta's DPR 3000E EnergE rectifiers enabling an industry-leading energy efficiency of 98 percent. With that, Delta's rectifiers can heavily support the nascent 5G telecom networks of the world's leading telecom carriers across the globe. "Delta's Telecom Power Solutions have built an unparalleled track record in the global market, especially by enabling lower energy consumption and CO 2 emissions in 4G and the next-generation 5G telecommunications," said Eton Lee, General Manager of Delta's Communication & Information Solutions Business Unit. "We have achieved that success by collaborating with tier-one brands to develop our solutions. Moreover, Infineon's CoolGaN chips deliver excellent performance to Delta's 3000E rectifiers, which boast industry-leading efficiency up to 98 percent and an outstanding power density of 56.8 W/in³. It provides high performance while consuming little energy." "At Infineon, we work closely with our customers to help them achieve ever-growing requirements towards energy efficiency and also power density," said Stefan Obersriebnig, Product Line Head High Voltage Conversion of Infineon's Power & Sensor System Division. "With our complete portfolio of wide bandgap solutions, i.e. CoolGaN and CoolSiC, we are paving the way towards a new era in the power industry."08.03.2021 11:30:00Mar\images\news_2021-03-15_16.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2021/INFPSS202103-047.htmlinfineon.com/market-news
Conference on Silicon Carbide and Related MaterialsThe 13th European Conference on Silicon Carbide an...9135Event NewsConference on Silicon Carbide and Related MaterialsThe 13th European Conference on Silicon Carbide and Related Materials (ECSCRM 2020·2021) will be held at the Vinci International Convention Centre (Palais des congrès), from October, Sunday 24th to Thursday 28th 2021, proudly hosted by the University of Tours. ECSCRM is a biannual scientific event that explores, presents and discusses the new achievements in the field of wide-bandgap semiconductors focusing on silicon carbide (SiC) and other wide bandgap semiconductors. The topics covered in the ECSCRM include fundamentals (theoretical and experimental), bulk and epitaxial growth, new materials grown on SiC, material characterization, surfaces and interfaces, device fabrication processes, devices and device physics, packaging, applications, reliability and power related materials. Deadline for abstract submission is May 20th, 2021.08.03.2021 08:00:00Mar\images\news_2021-03-15_3.jpghttps://www.ecscrm-2020.com/ecscrm-2020.com
SiC MOSFET Modules Enable Downsizing of Industrial ImplementationsToshiba Electronics Europe has leveraged its techn...9143Product ReleaseSiC MOSFET Modules Enable Downsizing of Industrial ImplementationsToshiba Electronics Europe has leveraged its technological expertise in wide bandgap (WBG) semiconductor processes to introduce a compact but effective MOSFET module. The MG800FXF2YMS3 incorporates 3300V-rated dual-channel silicon carbide (SiC) MOSFET devices that are capable of supporting 800A currents. Key applications for these high power density modules include industrial drives and motor control equipment, the power inverters for renewable energy generation sites, plus the converters/inverters needed for electric rail infrastructure. Pivotal to the strong performance parameters of the new SiC MOSFET modules from Toshiba is the company's proprietary packaging technology. The intelligent flexible package low voltage (iXPLV) housings employed in these modules rely on an advanced silver sintered internal bonding technology to enable elevated degrees of operational efficiency. Channel temperatures reaching as high as 175°C can be supported, while isolation up to 6000VRMS is assured. Turn-on and turn-off switching losses are kept to 250mJ and 240mJ respectively, with stray inductance figures of just 12nH typically being expected. For more information, please visit: https://toshiba.semicon-storage.com/ap-en/semiconductor/product/mosfets/sic-mosfet-modules/detail.MG800FXF2YMS3.html08.03.2021 06:30:00Mar\images\news_2021-03-15_11.jpghttps://toshiba.semicon-storage.com/ap-en/company/news/news-topics/2021/02/mosfet-20210225-1.htmltoshiba.semicon-storage.com/news
Charging Infrastructure Business Electrifies EuropeThe public charging infrastructure in Europe conti...9142Event NewsCharging Infrastructure Business Electrifies EuropeThe public charging infrastructure in Europe continues to grow rapidly - by 35 percent in 2020 compared to the previous year. Among the top 5 countries, the Netherlands leads the way with more than 66,600 public charging points. France overtakes Germany with more than 46,000 charging points installed (2020: around 44,700), followed by the UK. This is according to data from the European Alternative Fuels Observatory (EAFO). Private wallboxes are also more in demand than ever, so that funding in Germany has been increased for the second time in a very short period. The leading charging infrastructure companies will present themselves at Power2Drive Europe taking place from July 21 to 23, 2021 at Messe München as part of The smarter E Europe. For widespread acceptance of e-mobility, users need not only a wide range of affordable electric vehicles, but also a reliable charging infrastructure that covers the entire country. This is essential for the purchase decision and thus for the ramp-up of electromobility. Public subsidies and a smart tax policy are driving electromobility and the expansion of the charging infrastructure in Europe. In the Netherlands, for example, not only are sales of e-cars booming - more than 66,600 public charging stations have already been installed, that is more than anywhere else in Europe. Three battery electric vehicles (BEVs) share one charging point here, according to EAFO statistics. 04.03.2021 15:00:00Mar\images\news_2021-03-15_10.jpghttps://www.powertodrive.de/news/charging-infrastructure-business-electrifies-europe?lang=enpowertodrive.de/news
High-voltage, Single-phase BLDC Motor Controller SolutionEBV Elektronik demonstrates the design simplicity ...9150Product ReleaseHigh-voltage, Single-phase BLDC Motor Controller SolutionEBV Elektronik demonstrates the design simplicity with the Power Integrations BridgeSwitch devices with the introduction of the EBV BridgeSwitch MB high-voltage, single-phase brushless DC (BLDC) motor control demonstrator and evaluation board. The fully-featured stand-alone solution can be powered directly from the mains AC. It requires no additional external components besides the BLDC motor, enabling engineers to quickly develop a highly costefficient and reliable design. At the heart of the EBV BridgeSwitch MB solution is an integrated half-bridge device from Power Integrations. The BridgeSwitch device offers a rich set of features that simplify the development and production of high-voltage inverter-driven BLDC or IM applications. It supports inverter output power up to 400W with no heat sink and can achieve up to 99.2% efficiency while providing current, voltage and temperature protection circuitry. The EBV BridgeSwitch demonstrator PCB's modular design has a break-away format, which enables each submodule to be physically separated and protected from the high-voltage components and the motor. An isolated programming/debugging interface reduces the risk of equipment damage and electric shock during development - even while the demonstrator is plugged directly into the mains, and where an isolating transformer is not available. The high voltage module includes an input rectifier that can accept DC or up to 220AC voltage and a switched output with two BRD1160C BridgeSwitch devices. This module also has an NTC header for remote thermal sensing and optional external current sensing circuitry.04.03.2021 13:30:00Mar\images\news_2021-03-15_18.pnghttps://www.avnet.com/wps/wcm/connect/onesite/a6cdce39-befe-4d97-916d-959b9b9a9723/02-21+EBVBridgeSwitch_Final.pdf?MOD=AJPERES&CVID=nv-0naw&CVID=nv-0naw&CVID=nv-0naw&CVID=nv-0nawavnet.com/connect
Design Center in India OpenedpSemi announces the opening of a design center in ...9133Industry NewsDesign Center in India OpenedpSemi announces the opening of a design center in Chennai, India to support the company's growing demand for semiconductor products enabling 5G and Internet-of-Things (IoT) applications. This India office will accelerate the scalability of a strong engineering team and the development of new design innovations for cellular radio frequency (RF) front-end modules, sensor systems-on-a-chip and power management integrated circuits (ICs). Featuring labs and office space, the design center is located at Level 9, Olympia Teknos Park, No. 28 SIDCO Industrial Estate, Guindy, Chennai, 600032. "India is emerging as the largest mobile phone manufacturing hub in the world. With our new India design center, we want to attract top talent and further expand our engagements with customers, partners and the smartphone ecosystem," says Sumit Tomar, CEO at pSemi. "We have opened our first pSemi India design center in Chennai, but we will soon expand into other cities. We plan to scale up rapidly; our hiring plan is limited only by the availability of talent." The establishment of the design center comes on the heels of pSemi's recent product portfolio growth in 5G, wireless connectivity, power management and sensors along with increased IC content in smartphones and mobile applications. Furthermore, the pSemi India design center will serve as a close liaison between pSemi and Murata, strengthening the companies' long-term success and operational growth with higher levels of integration and functionality in IC and package design. pSemi is actively hiring.04.03.2021 06:00:00Mar\images\news_2021-03-15_1.jpghttps://www.psemi.com/newsroom/press-releases/296982-psemi-opens-new-design-center-in-indiapsemi.com/newsroom
Parts for the MethaneSAT Satellite ProgramCPS Technologies announces the completion and ship...9141Industry NewsParts for the MethaneSAT Satellite ProgramCPS Technologies announces the completion and shipment of several parts to be used in the high-performance spectrometer-based methane sensing system of the MethaneSAT satellite program. MethaneSAT is designed to locate and measure methane from human sources worldwide with much higher sensitivity and spatial resolution and with a far wider field of view than is available with current satellite technology. Grant Bennett, President and CEO, stated "CPS is pleased and honored to be participating in this historic program. The MethaneSAT program could have a major impact on significantly reducing the unnecessary release of Methane into the atmosphere. We are also pleased that participation in this program has allowed us to work with Ball Aerospace, the primary flight system integrator and instrument provider for the MethaneSAT program." AlSiC is a metal-matrix composite consisting of the metal aluminum and the ceramic silicon carbide. In power modules and power supplies, as well as many other electronic applications, AlSiC enables higher reliability and higher performance as a result of its material properties, particularly thermal expansion, thermal conductivity and stiffness-to-weight ratio. AlSiC is very light weight, which is an important consideration in space-based and airborne applications. In addition to the MethaneSAT system, CPS AlSiC components are also found on the Mars 2020 Perseverance Rover, International Space Station and in the most recent generation of GPS satellites (GPS III) for the U.S. Space Force. CPS believes AlSiC components will increasingly be used in space-based and airborne applications because of the compelling performance advantages AlSiC provides.03.03.2021 14:00:00Mar\images\news_2021-03-15_9.jpghttps://www.alsic.com/alsic.com
Current Transformers Meet IEC StandardsSIGA (Electronics) Ltd announced that its current ...9149Product ReleaseCurrent Transformers Meet IEC StandardsSIGA (Electronics) Ltd announced that its current transformer (CT) products conform to IEC regulations from design, through manufacturing to final test. Standards including IEC 61869 are addressed by specific conformance testing for current transformers, carried out in SIGA's dedicated COVID-19-secure UK workspaces by specially trained operators. The company offers current transformers to meet all customer's requirements for metering and protection purposes. These are busbar mounted and used in many different applications. For example, SIGA's CTs are the basis of Parasense units used in supermarket refrigeration – a huge opportunity in the USA and elsewhere. SIGA already supplies CTs into switchgear contractors for the rapidly growing data centre distribution industry. Other customers include providers of switchgear to aerospace, automotive, power generation, MOD applications and rail transport. SIGA manufactures circular or rectangular type CTs, full block or split core, using a UL recognised semi rigid cast resin compound or an IP rated plastic box finish. Other finishes are available. The broad portfolio offers ring type current transformers suitable for primary currents from 50A-10000A along with rectangular current transformers with primary currents from 60A to 6300A having 1A or 5A secondary. These meet the following accuracy classes from 0.2 for metering purposes and class PX for protection. Fitted in applications with rated system volts 0.72/3kV, they can be built to meet a 3kV insulation level for up to 1 minute.03.03.2021 12:30:00Mar\images\news_2021-03-15_17.jpghttps://sigatransformers.co.uk/sigatransformers.co.uk
AEC-Q200 Compliant High Power Current Sense Resistor SeriesBourns announced the addition of nine models to it...9151Product ReleaseAEC-Q200 Compliant High Power Current Sense Resistor SeriesBourns announced the addition of nine models to its existing AEC-Q200 compliant Model CSM2F High Power Current Sense Resistor Series. Bourns designed the series as efficient, reliable, cost-effective and accurate measurement solutions for battery management system (BMS), industrial control and other high current applications. Current sense resistors are growing in popularity due to their high measurement accuracy and relatively low cost compared to other technologies. These resistors detect and convert current to an easily measured voltage, which is proportional to the current through the device. The Model CSM2F Series is available in four different footprint sizes: 6918, 8518, 7036 and a new 8536 metric size, and includes two new terminal surface treatments. With this announcement, Bourns is introducing two new styles of surface finishing – fully-plated and bare copper. The new "fully-plated" models go through a tin-plating process after material stamping to create a protective layer that provides enhanced performance, long-term stability and lower resistance drift after load life test benefits. The "bare-copper" version is constructed without tin-plating for enhanced TCR performance, and the copper terminals are covered with a protective layer to help extend resistor lifespan. The expanded Bourns Model CSM2F series features resistance values from as low as 25 microohms up to 200 microohms, with permanent power ratings of up to 50 watts, continuous current up to 1414 amps and high pulse power handling capabilities. The series is manufactured using electron beam (E-Beam) welded resistive copper alloy where the metal alloy current sensing element provides thermal EMF as low as 0.25 µV/K and a low TCR of 50 PPM/°C in the 20 °C to 60 °C temperature range. The Bourns Model CSM2F Series is available now and is RoHS compliant.02.03.2021 14:30:00Mar\images\news_2021-03-15_19.jpghttps://www.bourns.com/news/press-releases/pr/2021/03/02/bourns-announces-new-aec-q200-compliant-high-power-current-sense-resistor-seriesbourns.com/news
SiC MOSFETs for Electric Vehicle ApplicationsAlpha and Omega Semiconductor announced the releas...9147Product ReleaseSiC MOSFETs for Electric Vehicle ApplicationsAlpha and Omega Semiconductor announced the release of the AEC-Q101 qualified 1200V silicon carbide (SiC) aSiC MOSFETs in optimized TO-247- 4L package. Ideal for the high efficiency and reliability requirements of electric vehicle (EV) on-board chargers, motor drive inverters, and off-board charging stations, these 1200V SiC MOSFETs provide lowest on-resistance available for an automotive qualified TO-247-4L with a standard gate drive of 15V. As the EV market accelerates into millions of units per year, vehicle manufacturers are increasingly implementing 800V electrical systems to reduce the system's size and weight while increasing range and enabling significantly faster charging speeds. AOS's 1200V automotive grade aSiC MOSFETs are specifically designed for these demanding applications by providing superior switching performance and efficiency over standard silicon devices. The AOM033V120X2Q is a 1200V / 33m? SiC MOSFET based on our second generation aSiC MOSFET platform packaged in an optimized TO-247-4L. Unlike the standard 3 lead package, using an additional sense lead reduces the package inductance effects and enables the device to operate at a higher switching frequency with up to 75% reduction in switching losses compared to standard packaging. The recommended gate driving voltage of only 15V allows for the widest compatibility of gate drivers for ease of adoption in a variety of system designs. In addition, aSiC MOSFETs have a very low increase in on-resistance up to the rated 175°C to minimize power losses and further increase efficiency.02.03.2021 10:30:00Mar\images\news_2021-03-15_15.jpghttp://www.aosmd.com/res/news/news-article-1614702602920/AOM033V120X2Q_PR.pdfaosmd.com/news
Manufacturing Efficiency on Electric Fuse MarketMersen has announced that it has repurchased the s...9136Industry NewsManufacturing Efficiency on Electric Fuse MarketMersen has announced that it has repurchased the stake held by the Hager Group in Fusetech, thereby acquiring full control of the company based in Kaposvar, Hungary. This operation enables Mersen to strengthen its manufacturing efficiency on Europe's electric fuse market, and to integrate a high-performance site for the manufacture of some of its future product ranges in accordance with European standards (IEC). The transaction is valued at approximately €4 million, excluding any future earn-out payments. Fusetech has been a 50:50 joint venture between Mersen and Hager since 2007. Its plant produces cost-competitive industrial fuses for the European market. The company currently employs around 300 people on a site of 6,000 sq.m. In 2020, Fusetech generated non-Mersen-related sales of approximately €7 million. Luc Themelin, Chief Executive Officer of Mersen, said: "I am delighted to see Mersen take this next important step in its plan to build and optimize its fuse product lines in Europe. Fusetech is an excellent industrial base for fuse production developed with our partner Hager Group, which the Group will use to ramp up its presence on the European market. The Fusetech teams already know Mersen and I look forward to welcoming them into the Group." 02.03.2021 09:00:00Mar\images\news_2021-03-15_4.jpghttps://www.mersen.com/news/mersen-acquires-remainder-fusetechs-capitalmersen.com/news
Optimizing Jetting Process of Sintering PastesThe three technology companies Heraeus, perfecdos ...9139Industry NewsOptimizing Jetting Process of Sintering PastesThe three technology companies Heraeus, perfecdos and Infotech automation have jointly developed a solution that offers their customers ideally matched components and materials for jetting sintering pastes. The collaboration led to the production-ready development of the jetting processes – saving time and enabling flexibility. Due to increasing production diversity and increasingly shorter product cycles, manufacturers often must adapt packaging technology in the production process. Flexible and time-saving processes are a competitive advantage and facilitate the creation of prototypes. In addition, complex components place high demands on the manufacturing process, which manufacturers can no longer reproduce with the traditional stencil printing process. The mAgic DA295A sinter paste developed by Heraeus is a paste optimized for pressure-less, low-temperature sintering. It offers higher thermal conductivity than the conductive adhesives and solder pastes currently used in the market. The paste has been optimized for power applications with high operating temperatures and high current densities. The PDos X1 micro-dispensing valve from perfecdos achieves extremely high performance thanks to the innovative and patented actuator system (drive system). Based on this, another generation of nozzles could be developed enabling the jetting of the sintering paste. The high application speed of the PDos X1 was used to achieve shorter cycle times. The non-contact dispensing also eliminates the need to move the valve in the Z-axis and minimizes the risk of collision with the leadframe. Another advantage is the consistency of the amount of sinter paste applied.25.02.2021 12:00:00Feb\images\news_2021-03-15_7.jpghttps://www.heraeus.com/en/het/company_het/press_and_news_het/2021_het/03_jetting.htmlheraeus.com/press
GaN Integrated Circuit for Time-of-Flight (ToF) Lidar ApplicationsEPC announces the introduction of a laser driver t...9154Product ReleaseGaN Integrated Circuit for Time-of-Flight (ToF) Lidar ApplicationsEPC announces the introduction of a laser driver that integrates a 40 V, 10 A FET with integrated gate driver and 3.3 logic level input in a single chip for time-of-flight lidar systems used in robotics, surveillance systems, drones, autonomous cars, and vacuum cleaners. The EPC21601 is a laser driver that is controlled using 3.3 V logic and is capable of very high frequencies exceeding 100 MHz and super short pulses < 2 ns to modulate laser driving currents up to 10 A. Turn-on and turn-off times are 410 ps and 320 ps respectively. The EPC21601 is a single-chip driver plus eGaN FET using EPC's proprietary GaN IC technology in a chip-scale BGA form factor that measures only 1.5 mm x 1.0 mm. With this small form factor and the integration of several functions, the overall solution that is 36% smaller on the printed circuit board (PCB) compared to an equivalent multi-chip discrete implementation. The EPC21601 is the first offering in what will be a wide-range family of integrated laser drive ICs available in chip-scale package (CSP).  Integrated devices in a single chip are easier to design, easier to layout, easier to assemble, save space on the PCB, increase efficiency, and reduce cost. This family of products will enable faster adoption and increased ubiquity of ToF solutions across a wider array of end-user applications.23.02.2021 17:30:00Feb\images\news_2021-03-15_22.jpghttps://epc-co.com/epc/EventsandNews/News/ArtMID/1627/ArticleID/2975/Efficient-Power-Conversion-EPC-Revolutionizes-Lidar-System-Design-with-Release-of-eToF-Laser-Driver-IC-Family-of-Products.aspxepc-co.com/News
Charging Station Controller for All DC Charging FunctionsIntelligent charging stations made easy to develop...9153Product ReleaseCharging Station Controller for All DC Charging FunctionsIntelligent charging stations made easy to develop: The vSECC charging station controller from Vector is a charge control unit for the DC fast charging market, which performs all communication and control functions in the charging station. This futureproof solution enables developers and manufacturers of smart DC charging stations to control and monitor the charging process with just one device. The controller handles both the communication with the vehicle and back end as well as the management of the power electronics. The vSECC (Supply Equipment Communication Controller) charging station controller is a Vector series-produced charge control unit that handles the entire charging communication to electric vehicles. With vSECC, developers get one single device that takes over the communication of the charging station with the vehicle and the back end and also the control of the power electronics via CAN or Ethernet. Until now, several devices were necessary for this purpose. The main functions of a DC charging station are to communicate with the vehicle during charging, to monitor the continuous vehicle connection and to control the power electronics depending on vehicle requirements. All these functions are performed by the Vector controller. It thus offers enormous potential for faster expansion of the charging infrastructure by reducing development times.23.02.2021 16:30:00Feb\images\news_2021-03-15_21.jpghttps://www.vector.com/int/en/news/news/vsecc-charging-station-controller-covers-all-dc-charging-functions/vector.com/news
MOSFET Line-up with AEC-Q101-Qualified Half-bridge PackageNexperia announced a series of half-bridge (high s...9152Product ReleaseMOSFET Line-up with AEC-Q101-Qualified Half-bridge PackageNexperia announced a series of half-bridge (high side & low side) automotive MOSFETs constructed in the space-saving LFPAK56D package format. The half-bridge configuration of two MOSFETS is a standard building block for many automotive applications including motor drives and DC/DC converters. The package provides a half-bridge solution in one device, occupying 30% lower PCB area compared to dual MOSFETs for 3-phase motor control topologies due to the removal of PCB tracks, whilst permitting simple automated optical inspection (AOI) during production. The LFPAK56D half-bridge utilises existing high volume LFPAK56D assembly processes with proven automotive reliability. The package format uses flexible leads to improve overall reliability, and an internal copper clip connection between the MOSFETs simplifies PCB designs and brings a plug and play style solution with exceptional current handling capability of 98 A. Typically, in a half-bridge arrangement, the PCB connection between the source of the high side MOSFET and the drain of the low side MOSFET can create a significant amount of parasitic inductance. However, with its internal clip connection, the LFPAK56D half-bridge package achieves 60 % less inductance. The LFPAK56D half-bridge MOSFETs launched are the BUK7V4R2-40H and the BUK9V13-40H. Both utilise the highly robust Trench 9 automotive silicon process technology, are rated at 40 V and are verified at twice the automotive AEC-Q101 specification in key tests. RDS(on) of the devices measures 4.2 mOhm (BUK7V4R2) and 13 mOhm (BUK9V13).23.02.2021 15:30:00Feb\images\news_2021-03-15_20.jpghttps://www.nexperia.com/about/news-events/press-releases/nexperia-extends-lfpak56d-mosfet-line-up-with-aec-q101-qualified-half-bridge-package.htmlnexperia.com/press-releases
Unlock the Performance with Advanced Drive SolutionMitsubishi Electric's MELSERVO MR-J5 series of TSN...9145Product ReleaseUnlock the Performance with Advanced Drive SolutionMitsubishi Electric's MELSERVO MR-J5 series of TSN-compatible servo drives meet today's exacting requirements for precision, dynamics and multi-axis synchronisation in food and beverage, life sciences and printing/converting production applications. They also integrate a full suite of safety functions as standard, and embed predictive maintenance functions, giving users the tools they need to increase machine productivity and availability. End users and machine builders can drive up the performance of their lines and systems thanks to a frequency response of 3.5kHz and a communication cycle time of 31.25µs. Further, with the associated MELSERVO J5 motion module, users can synchronise up to 256 axes. This increased performance does not come at the cost of more complex setup. No tuning experience is required, with a quick-tuning function generating all of the gain values automatically within approximately 0.3 seconds. The machine is then ready to run as soon as the servo is enabled, assuring smooth running with significantly reduced commissioning time and effort. A key enabler for improved performance across multi-axis servo systems is the integration of CC-Link IE TSN (time sensitive network) technology with 1Gbps transmission speeds, assuring synchronisation across all connected devices – including safety devices, which can be connected on the same network as standard control products such as inverters, HMI and I/O. Other network protocols such as EtherCAT are also offered as standard. Predictive maintenance functions have also been embedded, helping to reduce unplanned machine downtime and drive-up asset availability, so saving both time and money.23.02.2021 08:30:00Feb\images\news_2021-03-15_13.jpghttps://eu3a.mitsubishielectric.com/fa/en/news/file/3892/Mitsubishi_MR-J5_Product_Launch_ENGLISH_DMA859.pdfmitsubishielectric.com/news
Up to 200 Engineering Jobs to Be CreatedMicrochip Technology is investing $20M to create a...9134Industry NewsUp to 200 Engineering Jobs to Be CreatedMicrochip Technology is investing $20M to create a development centre based in Cork, Ireland. The facility will open during Q1 CY21 and create 60 new jobs over the next three years and approximately 200 jobs within the next seven years. The creation of this centre will reinforce Microchip's existing presence in Ireland and boost the pool of engineering talent across key skills. Located close to the city centre, this new facility will incorporate an engineering lab to support state-of-the-art innovation and extend Microchip's regional customer support. The project is supported by the Irish Government through IDA Ireland. Initially, the development centre will focus on mixed-signal integrated circuit design, applications and software development for high-speed networking, timing and synchronization products, high voltage power management devices and solutions, high reliability integrated power systems and Field Programmable Gate Arrays (FPGA). Close partnerships with Irish universities will enable the Microchip development centre to offer internships and collaborate on key next-generation initiatives. The partnership between the development centre and leading Universities in Ireland will enhance the knowledge base and skill levels of engineers in the semiconductor development space in Ireland. The development centre will also participate in Microchip's New College Graduate (NCG) programme, which operates worldwide, and in the Government of Ireland's Skillnet programme which promotes the development of future skills.23.02.2021 07:00:00Feb\images\news_2021-03-15_2.jpghttps://www.microchip.com/en-us/about/corporate-overviewmicrochip.com
Integrated Grade 0 BLDC Motor Driver Shrinks 48-V Systems Texas Instruments introduced an integrated Grade 0...9128Product ReleaseIntegrated Grade 0 BLDC Motor Driver Shrinks 48-V Systems Texas Instruments introduced an integrated Grade 0 brushless DC (BLDC) motor driver for 48-V high-power motor control systems, such as traction inverters and starter generators in mild hybrid electric vehicles (MHEVs). The DRV3255-Q1 can help designers shrink their motor system size by as much as 30%, while providing the industry’s highest gate-drive current for increased protection and output power. Meeting the most stringent safety requirements, the new motor driver was designed according to TI’s TÜV SÜD-certified functional safety development process, helping enable up to Automotive Safety Integrity Level (ASIL) D. To help decrease greenhouse gas emissions globally, automobile manufacturers are increasing the production of MHEVs, which use 48-V motor-drive systems to help reduce emissions from a vehicle’s internal combustion engine. The TI Functional Safety-Compliant DRV3255-Q1 allows manufacturers to design a motor-drive system to help enable MHEV systems up to ASIL D, supplying as much as 30 kW of motor power which can improve the response time of a 48-V motor-drive system in heavy vehicles. "A 48-V system is a step-change that original equipment manufacturers [OEMs] can implement to meet goals around reducing emissions, while also adding power for advanced driver-assistance system features and managing power-hungry loads such as the heating, ventilation and air conditioning system," said Asif Anwar, director of the powertrain, body, chassis and safety service at Strategy Analytics. "Combining leading-edge performance characteristics with functional safety and Grade 0 translates to real-world, system-level operational benefits that will help OEMs achieve these goals."22.02.2021 11:30:00Feb\images\news_2021-03-01_17.pnghttps://news.ti.com/integrated-grade-0-bldc-motor-driver-shrinks-48-v-motor-drive-systems-as-much-as-30-in-mild-hybrid-electric-vehiclesnews.ti.com
ICs and Automotive Audio Bus Power for All Electric SUVAnalog Devices and Volvo Cars announced that Volvo...9137Industry NewsICs and Automotive Audio Bus Power for All Electric SUVAnalog Devices and Volvo Cars announced that Volvo Cars' first pure electric SUV-the Volvo XC40 Recharge-will feature ADI's integrated circuits (ICs) that support the battery management system (BMS) and Automotive Audio Bus (A2B). By saving vehicle weight and maximizing range, these advanced technologies deliver an attractive total cost of ownership for electric vehicles while also supporting a sustainable future. The Volvo XC40 P8 Recharge was a 2021 semi-finalist in the North American Car, Truck and Utility Vehicle of the Year Awards (NACTOY) utility vehicle category. The NACTOY Awards honor excellence in innovation, design, safety, handling, driver satisfaction and value. The awards are intended to recognize the most outstanding new vehicles of the year. "The BMS performance is critical to the electric XC40 Recharge delivering on its promise of a silent-but-powerful, carbon emission-free, safe driving experience," said Lutz Stiegler, Solution Manager Electric Propulsion at Volvo Car Corporation. "An extraordinarily high level of thought and research went into every single aspect and component in our first pure electric SUV to ensure more miles per charge, longer vehicle life and peace of mind, while lowering the cost of ownership." ADI's ICs provide industry leading accuracy over the life of the vehicle that significantly increases miles per charge and are scalable across the vehicle fleet from hybrid vehicles to full electric vehicles. The ICs meet the highest global security standards, and scale across multiple battery chemistries, including the zero-cobalt chemistries such as lithium iron phosphate (LFP) that support social and environmental sustainability.22.02.2021 10:00:00Feb\images\news_2021-03-15_5.jpghttps://www.analog.com/en/about-adi/news-room/press-releases/2021/2-22-2021-adi-battery-management-system-ics-automotive-audio-bus-power-volvo-electric-xc40-suv.htmlanalog.com/news-room
Power Entry Module Now with Side Flange Mounting SCHURTER’s proven power entry module, series DD11,...9132Product ReleasePower Entry Module Now with Side Flange Mounting SCHURTER’s proven power entry module, series DD11, provides a high level of functional integration in the most minimal of package dimensions. The power entry module is ideally suited for equipment with low profile panels. Consisting of an IEC appliance inlet (C14), which is compatible with cord retention, 1- or 2-pole fuseholder, and power ON/OFF switch, the DD11 is now available with side mounting flanges in addition to the existing model with top and bottom flanges. The new model is designed to minimize height when vertically mounted. The compact design of the DD11 makes the series ideal for use in devices with limited space, and where high electrical and mechanical loads are present at the same time. Especially suited for medical applications, the series is designed to comply with IEC 60601-2. The fusedrawer is offered as 1 or 2-pole and accepts 5 x 20mm fuses. An extra-safe feature prevents users from removing the fusedrawer while the power cord is plugged into the equipment. The cord retention feature protects against inadvertent disconnection. Other application areas include IT and telecom, office and household equipment, as well as automation systems. The DD11 is rated for current levels up to 10 A at 250 VAC according to IEC and UL / CSA and is ENEC and cURus approved. The series complements a compact unit for snap in and PCB mounting. Versions with EMC filters are also available. SCHURTER Power Entry Modules with fuseholders meet the enhanced requirements of glow wire tests according to IEC 60695-2-11 or -12 and – 13. 19.02.2021 15:30:00Feb\images\news_2021-03-01_21.jpghttps://www.schurter.com/en/Info-Center/News/Timeline/Power-Entry-Module-with-extended-mounting-optionsschurter.com/News
Customers Support in Spain & PortugalDanisense has announced that MeasureIT of Spain wi...9121Industry NewsCustomers Support in Spain & PortugalDanisense has announced that MeasureIT of Spain will now be the company’s official distributor in the region. Based in Girona, Spain, and with a second office in Palmela, Portugal, MeasureIT is well-established within the test and measurement sector, targeting markets such as research laboratories and power electronics companies working in the e-mobility, electric motor and aerospace sectors. Comments Loic Moreau, VP marketing at Danisense: “MeasureIT’s experience and contacts within the Spanish and Portuguese markets mean that they will be able to support our products technically and commercially. We see strong interest in our products in this important region, and MeasureIT with its focus on the instrumentation and data acquisition markets is a perfect partner for us.” Adds Enrico Bello, Business Development Director at MeasureIT: “We are impressed by the technical innovation that Danisense brings to its current sense transducers. We are sure that the accuracy, repeatability and quality of products such as the DS ultra-stable, high precision (ppm class) current transducers for non-intrusive, isolated DC and AC current measurement up to 1100A, or the DM1200, a high-accuracy current transducer capable of measuring signals up to 1200Arms and 1500A DC, will be of great interest to customers in Spain and Portugal.”18.02.2021 15:00:00Feb\images\news_2021-03-01_10.gifhttps://www.danisense.com/about-us/newsdanisense.com/news
APEC 2021 Plenary SpeakersMark your calendars for June 9-12, 2021 when power...9138Event NewsAPEC 2021 Plenary SpeakersMark your calendars for June 9-12, 2021 when power electronics professionals from around the world gather for APEC 2021, the premier event for networking, learning, and strategic business development. The APEC Plenary Sessions continue a long-standing tradition of addressing issues of immediate and long-term interest to the practicing power electronics professional. This year's lineup includes seven distinguished invited professionals who will share their thoughts on six topics, ranging from automotive and wide bandgap technologies to energy storage and the future of power passives. Registration for APEC 2021 opens soon.17.02.2021 11:00:00Feb\images\news_2021-03-15_6.jpghttp://apec-conf.org/conference/sessions/plenary/apec-conf.org/plenary
Partnership for Power Module SolutionSilicon Labs introduced the Si823Hx Gate Driver Bo...9114Industry NewsPartnership for Power Module SolutionSilicon Labs introduced the Si823Hx Gate Driver Board, an all-in-one isolation solution perfectly suited for the recently launched Wolfspeed WolfPACK™ power module. Featuring the Si823Hx isolated gate driver and Si88xx digital isolator with integrated dc-dc converter, the board delivers excellent performance in a compact and cost-effective design, optimized for a wide range of modules. “Power electronics engineers face many challenges when designing high-power systems, from space constraints to safety requirements,” said Brian Mirkin, vice president and general manager of Power Products at Silicon Labs. “The Silicon Labs Si823Hx gate driver board is an efficient, high-performance solution designed to simplify the development of systems using power modules.” A complete suite of design resources, developed in partnership with Wolfspeed, are available to jump-start your Wolfspeed WolfPACK™ evaluation and development including a reference design, evaluation test fixture, and system test report. 17.02.2021 08:00:00Feb\images\news_2021-03-01_3.pnghttps://www.silabs.com/isolation/wolfspeed-partner-designs#wolfpack-gdbsilabs.com
650V Silicon Carbide MOSFETsON Semiconductor has announced a range of silicon ...9124Product Release650V Silicon Carbide MOSFETsON Semiconductor has announced a range of silicon carbide (SiC) MOSFET devices for demanding applications where power density, efficiency and reliability are key considerations. By replacing existing silicon switching technologies with the SiC devices, designers will achieve significantly better performance in applications such as electric vehicles (EV) on-board chargers (OBC) , solar inverters , server power supply units (PSU) , telecoms and uninterruptible power supplies (UPS). ON Semiconductor’s automotive AECQ101 and industrial grade qualified 650 volt (V) SiC MOSFETs are based upon a wide bandgap material that provides superior switching performance and improved thermals when compared to silicon. This results in improved efficiency at the system level, enhanced power density, reduced electromagnetic interference (EMI) and reduced system size and weight. The generation of SiC MOSFETs employ a novel active cell design combined with advanced thin wafer technology enabling best in class figure of merit Rsp (Rdson*area) for 650 V breakdown voltage. The NVBG015N065SC1 , NTBG015N065SC1, NVH4L015N065SC1 and NTH4L015N065SC1 have the lowest Rdson (12 mOhm) in the market in D2PAK7L and To247 packages. This technology is also optimized around energy loss figure of merits, optimizing performance in automotive and industrial applications. An internal gate resistor (Rg) allows more flexibility to designers eliminating the need to slow down devices artificially with external gate resistors. Higher surge, avalanche capability and short circuit robustness all contribute to enhanced ruggedness that delivers higher reliability and longer device lifetimes.17.02.2021 07:30:00Feb\images\news_2021-03-01_13.jpghttps://www.onsemi.com/PowerSolutions/newsItem.do?article=1000868onsemi.com/news
PCIM Europe 2021 to be Held Exclusively in Digital FormAt the beginning of February, the decision was mad...9112Event NewsPCIM Europe 2021 to be Held Exclusively in Digital FormAt the beginning of February, the decision was made to postpone the PCIM Europe to late summer following talks with exhibitors and partners. In light of the ongoing pandemic and challenging situation, numerous industry players have been hesitant to commit to an on-site event. For this reason, Mesago Messe Frankfurt GmbH has decided to hold a digital event only. With the “PCIM Europe digital days”, an online format will be offered to the power electronics community enabling networking and knowledge transfer from 3 – 7 May 2021. Over five days, suppliers and users in the industry can receive information on key developments and connect in a variety of ways. In addition to extensive exhibitor profiles, the conference program will consist of outstanding presentations as a mix of live and video-on-demand presentations, followed by discussions with the speakers. The world’s leading exhibition and conference for power electronics and its applications will take place regularly again in Nuremberg in May 2022.17.02.2021 06:00:00Feb\images\news_2021-03-01_1.jpghttps://pcim.mesago.com/nuernberg/en/press/press-releases/pcim-press-releases/pcim2021-digital-days.htmlpcim.mesago.com/press
Current Monitoring in High-Temperature Automotive ApplicationsMicrochip Technology introduced its high-side curr...9130Product ReleaseCurrent Monitoring in High-Temperature Automotive ApplicationsMicrochip Technology introduced its high-side current sense amplifiers. AEC-Q100 qualified, the MCP6C02 amplifier is offered in both a Grade 1 6-pin SOT-23 package and a Grade 0 8-pin 3x3 VDFN package. Delivering a maximum offset error of only 12 µV, the VDFN package offers the lowest offset voltage for any Grade 0 high-side current sense amplifier. Specified over a temperature range of -40°C to +150°C, its offset error allows the use of smaller value shunt resistors while also maintaining a high measurement resolution. This enables a more accurate and energy efficient current measurement solution for those applications exposed to extreme temperatures, like the motor within a vehicle’s water pump. In addition, the VDFN package is processed with wettable flank plating, allowing for visual inspection of the solder joints and removing the need for x-ray scanning as required for traditional DFN packages. Microchip’s MCP6C02 and MCP6C04 devices also feature an on-chip electromagnetic interference (EMI) filter and a zero-drift architecture. The EMI filter helps provide added protection against high-frequency electrical interference, such as wireless hotspots and radio frequencies, while the self-correcting architecture brings increased accuracy to current measurement. Together these features enable developers to create higher performance solutions in a wide variety of applications, such as creating a current controlled feedback loop for a power supply or motor, monitoring and charging batteries, or monitoring current levels for safety reasons.16.02.2021 13:30:00Feb\images\news_2021-03-01_19.jpghttps://www.microchip.com/en-us/about/news-releases/products/microchip-delivers-accuracy-and-energy-efficiency-of-current-monmicrochip.com/news-releases
4 kW Power Supply for OCP, CORD and DatacentersBel Power Solutions announced the TET4000-48-069RA...9129Product Release4 kW Power Supply for OCP, CORD and DatacentersBel Power Solutions announced the TET4000-48-069RAH, a 4000 W power supply designed to provide the highest efficiency (Titanium) power conversion for datacenters being built to Open Compute Project (OCP), Open Data Center Committee (ODCC) or Central Office Re-architected as a Datacenter (CORD) standards. The TET4000-48-069RAH is the highest power 48 VDC model in Bel Power’s power supply portfolio and one of very few 4000 W 48 VDC server power supplies available as standard product. The adoption of 48V for datacenter power distribution is accelerating within the datacenter ecosystem as it can improve Power Usage Effectiveness (PUE), lower Total Cost of Ownership (TCO) and boost computing density and rack utilization. The TET4000-48-069RAH is designed to provide peak efficiency over 97.5 percent, classified as Titanium level, the highest efficiency classification for power supplies. These new 48V datacenters and central offices are equipped with high performance servers and super computers running scalable and distributed computing of large volumes of data. Housed in a compact form factor (69 x 40.5 x 530 mm), Bel Power’s TET4000-48-69RAH 48 VDC is programmable from 42 to 58 VDC, with power-factor correction (PFC). The unit also allows for a DC input voltage range of 240-380 VDC, delivers power density of 44 W/in3, and incorporates soft-switching resonant techniques in conjunction with synchronous rectification, providing increased system reliability and very high efficiency. 16.02.2021 12:30:00Feb\images\news_2021-03-01_18.pnghttps://belfuse.com/news-detail/bel-power-solutions-announces-tet4000-48-069rah-titanium-efficiency-4-kw-power-supply-for-ocp-cord-and-datacentersbelfuse.com/news
100V GaN Gate Driver Evaluation KitMinDCet announces the introduction of the next gen...9123Product Release100V GaN Gate Driver Evaluation KitMinDCet announces the introduction of the next generation GaN-based Half-Bridge Evaluation kit (MDC901-EVKHB), based on the MinDCet MDC901 GaN gate driver and two GaN Systems GS61008P (E-mode GaN HEMTs). This solution is developed to allow power electronics designers to easily design-in GaN for 48V market applications, including step-down converters, boost converters, and class D audio applications. The space technology-based MDC901 is a non-isolated 200V GaN gate driver with unprecedented gate drive strength exceeding 9 A, true floating programmable regulators, integrated charge pump, bootstrap diodes and extensive diagnostics. It is ideally suited for high-performance and high-reliability applications, where application diagnostics and GaN lifetime are key. The MDC901-EVKHB evaluation kit features a 100V input step-down converter providing up to 30A of output current. The complete and compact power stage consists of the MDC901 in combination with two GS61008P E-mode GaN HEMTs. The evaluation board allows control of all MDC901 control IO’s (internal/external dead-time control, programmable dead-time and programmable gate voltage), as well as verification of all diagnostic outputs (undervoltage detection, gate drive monitoring and temperature sensing). The evaluation kit contains all hardware to reliably connect the board to an external power source, as well as the required fan, heat sink, wiring and connectors to guarantee measurements under safe conditions. The evaluation kit is supported by GaN Systems and available for purchase through MinDCet.15.02.2021 06:30:00Feb\images\news_2021-03-01_12.jpghttps://www.mindcet.com/news/mdc901-evkhb-new-high-end-100v-gan-gate-driver-evaluation-kitmindcet.com/news
SiC MOSFETs Offered in Low-inductance Discrete PackagesGeneSiC Semiconductor's next-generation 1200V G3RS...9144Product ReleaseSiC MOSFETs Offered in Low-inductance Discrete PackagesGeneSiC Semiconductor's next-generation 1200V G3RSiC MOSFETs with RDS(ON) levels ranging from 20 mO to 350 mO deliver unprecedented levels of performance, robustness and quality. System benefits include higher efficiency, faster switching frequency, increased power density, reduced ringing (EMI) and compact system size. These G3R SiC MOSFETs, offered in optimized low-inductance discrete packages (SMD and through hole), are highly optimized for power system designs requiring elevated efficiency levels and ultra-fast switching speeds. These devices have substantially better performance levels as compared to competing products. An assured quality supported by fast turn-around high volume manufacturing further enhances their value proposition. "After years of development work towards achieving the lowest on-state resistance and enhanced short circuit performance, we are excited to release the industry's best performing 1200V SiC MOSFETs with over 15+ discrete and bare chip products. If the next-generation power electronics systems are to meet the challenging efficiency, power density and quality goals in applications like automotive, industrial, renewable energy, transportation, IT and telecom, then they require significantly improved device performance and reliability as compared to presently available SiC MOSFETs" said Dr. Ranbir Singh, President at GeneSiC Semiconductor.12.02.2021 07:30:00Feb\images\news_2021-03-15_12.pnghttps://www.genesicsemi.com/press-release-1200v-sic-mosfet/genesicsemi.com/press-release
25kW-Peak FB TransformerPayton introduces an unique high power design with...9126Product Release25kW-Peak FB TransformerPayton introduces an unique high power design with 4 separate center tap secondaries each handling over 100Apeak. The total output peak power is 25kW at 200kHz and 400V input voltage. Four separate outputs each delivering 60V at 35Arms and close to 100Arms-peak. The topology is full bridge with -55°C to 150°C operation. Power dissipation is 90Watts at over 99.0% efficiency. The size is L:160mm, W:90mm, H:50mm.11.02.2021 09:30:00Feb\images\news_2021-03-01_15.pnghttps://www.paytongroup.com/paytongroup.com
Energy-Meter Evaluation Board Combines Low-Cost Sensors and Robust Galvanic IsolationThe EVALSTPM-3PHISO evaluation board from STMicroe...9131Product ReleaseEnergy-Meter Evaluation Board Combines Low-Cost Sensors and Robust Galvanic IsolationThe EVALSTPM-3PHISO evaluation board from STMicroelectronics combines the high-accuracy STPMS2 metering front-end IC and the advanced STISO621 digital isolator, with customizable turn-key firmware running on an STM32 microcontroller to compute metrology and power-quality data. The sensing circuitry and PCB layout are optimized to ensure robustness against EMI and a strong signal-to-noise ratio, for high-accuracy measurement and post-processing computation. The STPMS2, a two-channel 24-bit second-order sigma-delta modulator, measures voltage and current for each phase through an on-board voltage divider and a shunt current sensor. It then oversamples the signal using a synchronized 4MHz clock distributed by the microcontroller and multiplexes voltage and current sigma-delta bitstreams on a single output pin. Three STPMS2 are used in the 3-phase system to collect voltage and current data from each phase. The provided firmware leverages digital filters for sigma-delta modulators (DFSDMs) integrated in the chosen STM32 microcontroller to convert the six bitstreams into 24-bit voltage and current values and computes all metrology data in real-time every 200µs. The firmware also implements a virtual com port that provides access to internal parameters for reading metrology data, modifying the internal configuration, and calibrating the board. The STISO621 dual-channel digital isolator is the first in a new series of ICs that leverage ST’s 6kV thick-oxide galvanic-isolation technology to transfer data between isolated domains in a variety of industrial applications. 10.02.2021 14:30:00Feb\images\news_2021-03-01_20.jpghttps://newsroom.st.com/media-center/press-item.html/n4333.htmlnewsroom.st.com
Chosen by Growing Semiconductor CompanyyieldHUB is a provider of data analysis and yield ...9120Industry NewsChosen by Growing Semiconductor CompanyyieldHUB is a provider of data analysis and yield management solutions to the semiconductor industry. They work with innovative fabless and IDM companies worldwide, helping to successfully characterize and release new products into production and in-depth monitoring thereafter. Speaking about this, Karim Hamed, Senior Manager of Product Engineering, Empower Semiconductor said “We chose yieldHUB as it’s very powerful! It’s fast, secure and we can access it anywhere in the world. It’s exactly what we need for data analysis and yield management. 2021 is set to be a very busy year for us, and yieldHUB is the ideal data analysis partner for the journey”. yieldHUB’s suite of products are ideal for fabless startups in the New Product Introduction (NPI) phase and then leading into production. The characterization module speeds up a key part of NPI. The production capability helps increase yield, improve quality and enhance reliability. The system is scalable and cost-effective. The NPI and production phases are all supported in the same platform. John O’Donnell, Founder and CEO, yieldHUB said “Empower’s range of products are groundbreaking for the semiconductor industry. We’re looking forward to supporting them as they design new products and ramp up production.” Empower Semiconductor developed a breakthrough on-chip power management architecture that will redefine the cost, size and energy efficiency of voltage regulators for everything from low-power mobile applications to higher-powered storage and server systems.10.02.2021 14:00:00Feb\images\news_2021-03-01_9.jpghttps://www.yieldhub.com/latest/yieldhub-chosen-by-leading-semiconductor-company/yieldhub.com/latest
Power Supply Engineering "Made in Black Forest“CAMTEC celebrates 25 years of precision and heavy-...9119Industry NewsPower Supply Engineering "Made in Black Forest“CAMTEC celebrates 25 years of precision and heavy-duty power supply technology made in Germany. For a quarter of a century, the "CAMTEC" brand is synonym for high-precision power supplies and laboratory power supplies now. The CAMTEC Power Supplies GmbH, based in the Black Forest in the Southwest of Germany, offers those up to the KW range, as well as other particularly robust power supply components and battery chargers. Whether tunnels, railroad signaling systems, power plants or refineries: the power supply components of Camtec Power Supplies GmbH from the Black Forest, are chosen worldwide, wherever the requirements are exorbitantly high. The power range of the long-term power-specialist company, goes from 10 Watt Din-Rail devices, to I- and U- programmable power supplies with up to 3 KW peak power. Arbitrarily scalable power modules for heavy-duty power requirements in even many times higher KW ranges, inrush current limiters, DIN rail DC charging rectifiers and completely wearless solid-state relays complete the portfolio. AC and DC input voltage ranges and variable frequencies between 47 and 63 Hz allow the 1 to 3-phase devices to be used worldwide. All CAMTEC devices are developed and manufactured by 20 experienced employees exclusively in Pfinztal near Karlsruhe. In order to be able to meet the high type and technical variant diversity in predominantly only three-digit lot sizes, a highly efficient and highly variable automated production was built up there. Sales are handled by 77 distribution partners in a total of 67 countries worldwide. 10.02.2021 13:00:00Feb\images\news_2021-03-01_8.jpghttps://www.camtec-powersupplies.com/camtec-powersupplies.com
SENSOR+TEST 2021 to Take Place DigitallyReal, virtual, and hybrid – that is the motto unde...9140Event NewsSENSOR+TEST 2021 to Take Place DigitallyReal, virtual, and hybrid – that is the motto under which the SENSOR+TEST 2021 will be held from 4 to 6 May 2021. Participants from all over the globe are invited to the innovation dialog. Due to the continuing and critical health-risk situation with the Covid-19 pandemic and further uncertainties in regard to permitting major events, the organizer and the exhibitiors' committee jointly with the AMA executive board have decided to carry out the trade fair completely as a digital event. The SENSOR+TEST 2021 thus enables exhibitors and visitors to communicate and exchange ideas on the latest developments and technical advances in sensor, measuring, and testing technology via modern information channels. Just as in 2020, the worldwide most important industrial fair for sensor and measuring technology will again be held this year digitally. Since in recent months the information exchange over various online channels has functioned very well and was also well accepted, the SENSOR+TEST from 4 to 6 May 2021 will have significantly expanded digital options. This will turn it into a digital event with great benefit for visitors and exhibitors.10.02.2021 13:00:00Feb\images\news_2021-03-15_8.jpghttps://www.sensor-test.de/press/welcome-to-the-sensor-test-press-center/press-releases/sensor-test-2021-to-take-place-digitallysensor-test.de/press
Fuel Cell Manufacturing Research Center to Go Up High hopes abound for fuel cells – particularly in...9118Industry NewsFuel Cell Manufacturing Research Center to Go Up High hopes abound for fuel cells – particularly in the transportation sector – but these energy converters have yet to be mass-produced. The Centre for Solar Energy and Hydrogen Research Baden-Württemberg (ZSW) at Ulm aims to change that. It has taken a decisive step toward mass manufacturing with a groundbreaking ceremony held on February 10, 2021, for HyFaB – A Research Fab for Hydrogen and Fuel Cells. The ZSW is going to establish an open industry platform to look into automated production and quality assurance processes, factory acceptance testing and the commissioning of fuel-cell stacks at this facility. This factory will also serve to qualify skilled workers and learn more about industrial applications. HyFaB is open to partners. The automotive industry, fuel-cell vendors, and mechanical and plant engineering companies are very welcome. The only facility of its kind in Germany, it is to be up and running by early 2022. Fuel-cell electric vehicles (FCEVs) powered by green hydrogen are among the most ecofriendly and climate-sparing means of transportation, particularly for long-haul trips and short refueling stops. Costs will have to come down and production capacities go up for this technology to become a mainstream mass-market proposition.10.02.2021 12:00:00Feb\images\news_2021-03-01_7.jpghttps://www.zsw-bw.de/en/newsroom/news/news-detail/news/detail/News/fuel-cell-manufacturing-research-center-to-go-up-in-ulm.htmlzsw-bw.de/newsroom
P-channel MOSFETs Deliver Low ON ResistanceROHM releases a 24-model lineup of 24V input, -40V...9146Product ReleaseP-channel MOSFETs Deliver Low ON ResistanceROHM releases a 24-model lineup of 24V input, -40V/-60V withstand voltage P-channel MOSFETs available in both single (RQxxxxxAT/RDxxxxxAT/RSxxxxxAT/RFxxxxxAT) and dual configurations (UTxxx5/QHxxx5/SHxxx5) – ideal for industrial and consumer applications such as factory automation, robotics, and air conditioning systems. In recent years, as demand for higher efficiency and power density drives adoption of higher input voltages in industrial and consumer applications, MOSFETs are expected to provide not only low ON resistance, but high withstand voltages as well. Two types of MOSFETs exist: N-channel and P-channel. Although N-channel types generally feature higher efficiency, when used in the high side a gate voltage higher than the input voltage is needed, complicating circuit configuration. On the other hand, P-channel MOSFETs can be driven with a gate voltage lower than the input voltage, simplifying circuit configuration considerably while reducing design load. Against this backdrop, ROHM developed low ON resistance -40V/-60V P-channel MOSFETs compatible with 24V input utilizing advanced 5th gen refined process. Based on ROHM's market-proven P-channel MOSFET structure, these new products leverage refined process technology to achieve the lowest ON resistance per unit area in their class. This translates to 62% lower ON resistance vs conventional products for -40V new products and 52% for the -60V new products. At the same time, quality is improved by optimizing the device structure and adopting a new design that mitigates electric field concentration. As a result, both high reliability and low ON resistance (which are typically in a trade-off relationship) are achieved. These solutions contribute to stable long-term operation in industrial equipment demanding exceptional quality.10.02.2021 09:30:00Feb\images\news_2021-03-15_14.jpghttps://www.rohm.com/news-detail?news-title=5th-gen-p-channel-mosfets&defaultGroupId=falserohm.com/news
Reference Design Enables Engineers to Simulate and Optimize SMPS Designs Keysight Technologies and Transphorm have announce...9125Product ReleaseReference Design Enables Engineers to Simulate and Optimize SMPS Designs Keysight Technologies and Transphorm have announced the availability of a power supply reference design that enables engineers to identify and correct design errors before building hardware, thereby lowering product costs and speeding time to market. Switched-mode power supplies provide greater efficiency, increased power density and lower overall system costs when using GaN devices. However, GaN can produce voltage spikes that result in detrimental radiated electromagnetic interference. As a result, optimized layout design and placement of components before building hardware is critical when using GaN. The power supply reference design, available with Keysight's PathWave Advanced Design System, is a virtual prototype based on Transphorm's 4 kW high efficiency single-phase AC-DC conversion evaluation board. It consists of the component and board models needed for engineers to visualize and optimize the time and frequency domains' behavior of voltages, currents and electromagnetic fields. "The need for switch-mode power supplies is driving rapid adoption of wide bandgap semiconductors," said Tom Lillig, general manager of Keysight's PathWave Software Solutions division. "The new reference design of Transphorm's high voltage GaN solution will speed time to market of this technology, which is changing how the world powers electronic products." "Transphorm looks for partnerships that help our customers close skill gaps, increase design simplicity and reduce time to market," said Philip Zuk, vice president of Worldwide Technical Marketing and North American Sales, Transphorm. "With proper modeling, analysis of any design type prior to physical prototyping is a useful resource. Teaming with Keysight enables us to bring our 4 kW AC-DC power conversion board into a virtual design environment that will be advantageous to product designers."10.02.2021 08:30:00Feb\images\news_2021-03-01_14.pnghttps://www.keysight.com/zz/en/about/newsroom/news-releases/2021/0210-nr21013-keysight-and-transphorm-create-power-supply-referen.htmlkeysight.com/newsroom
Full Production Ramp of Flyback PWM Controllers Silanna Semiconductor announced the full productio...9115Industry NewsFull Production Ramp of Flyback PWM Controllers Silanna Semiconductor announced the full production release of the expanded portfolio of Active Clamp Flyback Controllers (ACF). First announced in April 2020, Silanna Semiconductor has achieved full production release of the SZ1110, a 33W Integrated Active Clamp Flyback Controller, delivering on the customer expectations and market penetration by dominating the ACF market. The SZ1110 devices are Active Clamp Flyback PWM Controllers that are rated for up to 33W output power and integrate an adaptive digital PWM controller and the following Ultra High-Voltage (UHV) components: An Active Clamp FET, Active Clamp Gate Driver and a Startup Regulator. This unprecedented level of integration facilitates designing efficient, high-power-density adapters with low BoM cost to satisfy power-hungry mobile phones, tablets, notebooks and video game consoles. The SZ1110 (33W) alongside the SZ1130 (65W) which was announced in full production last year has seen exceptional customer demand and continues to grow. The technical sales team has been working directly with customers’ designs demonstrating the ACF controllers, delivering over 94% efficiency from an all-silicon design, while achieving 30W/in3 power density at 65W using SZ1130 and 21.5 W/in3 power density at 30W using SZ1110, for universal input AC/DC power adapters. “In last September we announced the full production of the SZ1130 and after an incredible customer and industry response we focused on adding full production availability of the SZ1110,” said Mark Drucker, CEO of Silanna Semiconductor. 09.02.2021 09:00:00Feb\images\news_2021-03-01_4.jpghttps://powerdensity.com/2021/02/09/silanna-semiconductor-expands-leading-position-in-integrated-active-clamp-flyback-controller-market-with-sz1110-full-production-announcement/powerdensity.com
Strategy to Address Growing Demand for Power SemiconductorsNexperia has confirmed that it will be making sign...9113Industry NewsStrategy to Address Growing Demand for Power SemiconductorsNexperia has confirmed that it will be making significant additional global investments in manufacturing capacity and research and development during 2021. The investments are in line with a growth strategy that last year saw Wingtech Technology, Nexperia’s parent company, commit RMB12 billion ($1.85 billion) to building a 300mm (12-inch) power semiconductor wafer fab in Lingang, Shanghai. This factory, which will go live in 2022, will have an estimated annual output of 400,000 wafers. Nexperia’s plans for this year include improving production efficiency and implementing 200mm technologies at its European wafer fabs in Hamburg in Germany and Manchester in the UK. In Hamburg there will also be additional investment in technology for wide bandgap semiconductor manufacturing. New product development will be supported with a commitment to an increased R&D investment to approximately 9% of total sales. Nexperia recently opened global R&D centers in Penang in Malaysia and Shanghai in China and expanded the existing R&D sites in Hong Kong, Hamburg and Manchester. The company will also enhance test and assembly capabilities at Nexperia factories in Guangdong in China, Seremban in Malaysia and Cabuyao in the Philippines, including the implementation of advanced automation and system-in-package (SIP) capabilities. “Increased vehicle electrification, 5G communications, Industry 4.0 and the mainstream adoption of GaN-based designs will all drive increased demand for power semiconductors in 2021 and beyond,” says Achim Kempe, Nexperia’s Chief Operating Officer. “The additional global investment will ensure that we continue to provide the technology and manufacturing capacity needed to deliver products in volumes that support future demand.”09.02.2021 07:00:00Feb\images\news_2021-03-01_2.jpghttps://www.nexperia.com/about/news-events/press-releases/nexperia-announces-plans-to-grow-global-production-and-increase-rd-spend.htmlnexperia.com/press-releases
Drone Project for Medical CareAs a manufacturer of electronic and electromechani...9122Industry NewsDrone Project for Medical CareAs a manufacturer of electronic and electromechanical components, Würth Elektronik actively promotes sustainable innovations, start-ups and young developers. In addition to providing components free of charge, the assistance includes, in particular, support from experienced electronics and design experts as well as the transfer of technical know-how. A current example is the support of the humanitarian project Yonah by the Würth Elektronik branch in Singapore. The start-up has developed a robust cargo drone for medicine deliveries to impassable areas. A hospital in the difficult-to-access highlands of Papua New Guinea and the fight against a rampant measles epidemic there were the impetus for the Yonah founders to develop an innovative cargo drone for transporting medicines. The portable, particularly robust and low-maintenance robotic aircraft has a long range and can take off and land vertically. An indispensable component in the electronics-hostile environment are particularly robust and vibration-insensitive connectors, which were provided to the developers by Würth Elektronik. The first operational drone from the Yonah development is a hybrid aircraft that combines the flexibility of a multi-rotor helicopter with the endurance performance of a fixed-wing aircraft. "The team at Wurth Electronics Singapore Pte.Ltd loves this wonderful project. It is a meaningful and peaceful use of unmanned aerial technology where electronics helps save lives," says a delighted Ching Man Lau, HR Manager at Würth Elektronik eiSos, who is coordinating the project with the University of Singapore and Team Yonah. 08.02.2021 16:00:00Feb\images\news_2021-03-01_11.jpghttps://www.we-online.de/web/en/wuerth_elektronik/news_weg/News_Detail_WE_Gruppe_117439.phpwe-online.de/news
PCIM Asia Conference: Call for Papers now OpenIndustry experts and academics are invited to subm...9093Event NewsPCIM Asia Conference: Call for Papers now OpenIndustry experts and academics are invited to submit their papers on the latest solutions and trends in the power electronics field for the PCIM Asia Conference 2021. Held alongside the PCIM Asia exhibition, the conference is a leading platform for knowledge sharing for the power electronics, intelligent motion technology, renewable energy and energy management sectors. Interested parties are encouraged to submit their abstracts by 15 March. The exhibition and conference will both run from 9 – 11 September 2021. Held at the Shenzhen World Exhibition & Convention Center for the first time, PCIM Asia will once again gather industry professionals to showcase the latest trends and developments in the power electronics sector, covering a range of power electronics solutions and associated semiconductors, power devices, bus bars, capacitors and more. Recognised as a reputable platform, the exhibition and conference promote industry exchange and development in a professional, international and forward-thinking environment. The PCIM Asia Conference has long been renowned as a crucial and leading conference for the industry. Annually, experts in the power electronics field gather to share their insights on the latest market advancements and technologies. With an audience of around 500 industry peers, the conference is a rewarding and unrivalled platform in China for professionals to showcase their newest findings. As in previous years, all accepted papers will feature in the official PCIM Asia Conference proceedings, as well as the widely recognised libraries of IEEE Xplore, IET Inspec Direct and Scopus. All submitted abstracts will be reviewed by the PCIM Asia 2021 Advisory Board and Technical Committee.08.02.2021 14:00:00Feb\images\news_2021-02-15_9.jpghttps://pcimasia-expo.cn.messefrankfurt.com/shanghai/en/press/press-releases/2021/PCIM21_PR2.htmlpcimasia-expo.cn/press
Hybrid LIC Supercapacitors Cornell Dubilier Electronics introduces two series...9104Product ReleaseHybrid LIC Supercapacitors Cornell Dubilier Electronics introduces two series of Hybrid LIC Supercapacitors in response to the growing need for ultra-high capacitance values at higher operating voltages. The VMF and VPF Series operate at 3.8 WVDC with capacitance values up to 220 Farads. The higher voltage results in increased energy density. With nearly eight times the energy density and a fraction of the leakage current of similar volume 2.7V supercapacitors, designers can use smaller or fewer components to achieve the desired amount of energy storage. In addition, VMF and VPF have an advantage in applications with long standby and run times. Both series can deliver quick bursts of energy that may be used to maintain voltage when power is interrupted, or they may be used to extend battery life by reducing peak repetitive current demands on the battery. Due to their high energy storage capacity, some applications can use these components in place of costly batteries. Unlike batteries, hybrid supercapacitors do not degrade with each charge/discharge cycle. They are also inherently safer than batteries, with no risk of thermal runaway. For applications requiring higher voltage or capacitance, CDE can design custom series-parallel banks of components, packaged into modules with the desired lead configuration. Standard components within the series are offered in a radial board-mount package. Sizes range from 8mm to 16mm in diameter with lengths from 16mm to 25mm. Life cycles are rated up to 500,000 charge/discharge cycles. Operating temperature ranges from -25 °C to 85 °C. Both series are fully RoHS compliant and UL recognized.08.02.2021 12:30:00Feb\images\news_2021-02-15_20.jpghttps://www.cde.com/news/2021/2/vmf-vpf-supercapacitorscde.com/news
Shortages Drive Increased Demand for Capacitor TechnologyEmpower Semiconductor announced it is increasing p...9117Industry NewsShortages Drive Increased Demand for Capacitor TechnologyEmpower Semiconductor announced it is increasing production of its E-CAP silicon capacitor technology. E-CAP is a vastly superior performing capacitor, far exceeding the semiconductor industry’s previously leading Multi-Layer Ceramic Capacitors (MLCC), which is amidst another significant supply chain shortage. Empower Semiconductor has made the significant advancement for capacitors as E-CAP enables new possibilities for today’s applications due to the size reduction, performance increase, and improved reliability. MLCC’s are also prone to material shortages and pricing volatility as witnessed most recently. The E-CAP silicon capacitor product platform can alleviate supply shortages with the added performance and reliability benefits. “Since we launched E-CAP in late 2020 there has been unprecedented demand for our technology by industry leaders in mobile and data center products. More recently we have received increased demand due to the supply shortage of MLCC products” said Steve Shultis, Senior Vice President WW Sales and Marketing at Empower Semiconductor. “We knew our performance was winning and the added benefit of our supply chain has created a tremendous surge in demand for E-CAP.” E-CAP can be an ideal replacement of MLCC products as a power supply bypass capacitor in low voltage DC/DC voltage regulators and in-package for SoC’s and Processors. Empower Semiconductor’s silicon capacitor technology features superior stability with no DC or AC bias de-rating, no temperature de-rating, and no significant effects of aging. 08.02.2021 11:00:00Feb\images\news_2021-03-01_6.jpghttps://www.empowersemi.com/mlcc-world-wide-shortages-drive-increased-demand-for-empower-semiconductor-e-cap-capacitor-technology-the-highest-performance-smallest-size-and-most-configurable-capacitor-technology-platf/empowersemi.com
Flat Pack Aluminum Electrolytic CapacitorsIn the small world of Flat Packs, the Cubisic SLP ...9100Product ReleaseFlat Pack Aluminum Electrolytic CapacitorsIn the small world of Flat Packs, the Cubisic SLP is a real “game changer”! Providing twice as much capacitance as any other available flat packs on the market in the exact same volume, this series also offers more than twice the lifetime. Engineers tackling complex designing requirements and looking for an easily integrable product will save space and gain reliability thanks to the use of improved materials. Because the CUBISIC SLP can resist 50G vibrations and withstand 92,000 feet altitude, it is perfectly suitable for cockpits, actuation and power generation functions of commercial and military aircrafts, as well as radars and laser systems.08.02.2021 08:30:00Feb\images\news_2021-02-15_16.jpghttps://exxelia.com/en/group/news/detail/165/exxelia-unveils-new-flat-pack-electrolytic-capacitorsexxelia.com/news
Joining Forces to Advance Global Leadership in Embedded SolutionsRenesas Electronics and Dialog Semiconductor annou...9087Industry NewsJoining Forces to Advance Global Leadership in Embedded SolutionsRenesas Electronics and Dialog Semiconductor announced they have reached an agreement on the terms of a recommended all-cash acquisition by Renesas of the entire issued and to be issued share capital of Dialog (the “Acquisition”) for EUR 67.50 per share, representing a total equity value of approximately EUR 4.9 billion (approximately 615.7 billion yen). Dialog is an innovative provider of highly-integrated and power-efficient mixed-signal ICs for a broad array of customers within IoT, consumer electronics and high-growth segments of automotive and industrial end-markets. Centered around its low-power and mixed-signal expertise, Dialog brings a wide range of product offerings including battery and power management, power conversion, configurable mixed-signal (CMIC), LED drivers, custom mixed-signal ICs (ASICs), and automotive power management ICs (PMICs), wireless charging technology, and more. Dialog also offers broad and differentiated BLE, WiFi and audio system-on-chips (SoCs) that deliver advanced connectivity for a wide range of applications; from smart home/building automation, wearables, to connected medical. All these systems complement and expand Renesas’ leadership portfolio in delivering comprehensive solutions to improve performance and efficiency in high-computing electronic systems. “The transaction we announced today represents our next important step in catapulting Renesas’ growth plan to achieve substantial strategic and financial benefits, following our previous acquisitions,” said Hidetoshi Shibata, President and CEO of Renesas. “Dialog has a strong culture of innovation along with excellent customer relationships and serves fast growing areas including IoT, industrial and automotive. By bringing Dialog’s talented team and expertise into Renesas, together, we will accelerate innovation for customers and create sustainable value for our shareholders.”08.02.2021 08:00:00Feb\images\news_2021-02-15_3.jpghttps://www.renesas.com/eu/en/about/press-room/renesas-and-dialog-semiconductor-join-forces-advance-global-leadership-embedded-solutionsrenesas.com/press-room
650 V Hybrid IGBT Discrete Family Infineon Technologies has launched a 650 V CoolSiC...9105Product Release650 V Hybrid IGBT Discrete Family Infineon Technologies has launched a 650 V CoolSiC™ Hybrid IGBT portfolio in a discrete package with 650 V blocking voltage. The CoolSiC hybrid product family combines key benefits of the 650 V TRENCHSTOP™ 5 IGBT technology and the unipolar structure of co-packed Schottky barrier CoolSiC diodes. The devices are especially suited for DC-DC power converters and power factor correction (PFC). These can typically be found in applications like battery charging infrastructure, energy storage solutions, photovoltaic inverters, uninterruptable power supplies (UPS), as well as server and telecom switched-mode-power supplies (SMPS). Due to a freewheeling SiC Schottky barrier diode co-packed with an IGBT, the CoolSiC Hybrid IGBTs perform with significantly reduced switching losses at almost unchanged dv/dt and di/dt values. They offer up to 60 percent reduction of E on and 30 percent reduction of E off compared to a standard silicon diode solution. Alternatively, the switching frequency can be increased at least by 40 percent with unchanged output power requirements. A higher switching frequency will allow reducing passive components size and thus lower bill-of-material cost. The Hybrid IGBTs can be used as a drop-in replacement for TRENCHSTOP 5 IGBTs allowing an efficiency improvement of 0.1 percent for each 10 kHz switching frequency without redesign efforts. The product family creates a bridge between pure silicon solutions and high performing SiC MOSFET designs. Even more, in comparison to pure silicon designs, Hybrid IGBTs can improve electromagnetic compatibility and system reliability. 05.02.2021 13:30:00Feb\images\news_2021-02-15_21.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2021/INFIPC202102-034.htmlinfineon.com/market-news
Transformers for DC/DC ConvertersTDK Corporation presents the EPCOS E10 EM series, ...9108Product ReleaseTransformers for DC/DC ConvertersTDK Corporation presents the EPCOS E10 EM series, a range of insulated SMT transformers that are suitable for various DC/DC converter topologies and gate driver circuits in e-mobility and industrial electronics. There are four models in the series, with basic winding insulation of a working voltage of 500 VRMS and reinforced insulation of 300 VRMS. The turns ratio is between 1:0.76 and 4:1, depending on the model. Measuring just 11.7 x 13.15 x 11.35 mm3, they are extremely compact. The compact design meets clearance and creepage requirements in accordance with the IEC 60664-1 standard (Np/Ns: min. 5.5 mm clearance, min. 6 mm creepage), due to the internal construction of the transformers. Outstanding reproducibility and reliability are ensured thanks to highly automated production with an AOI final inspection. The component in the EPCOS transformer series B78307A*A003 is qualified in accordance with AEC-Q200 Rev. D.04.02.2021 16:30:00Feb\images\news_2021-02-15_24.jpghttps://www.tdk-electronics.tdk.com/en/373388/company/press-center/press-releases/press-releases/transformers-tdk-offers-compact-transformers-for-dc-dc-converters/2937528tdk-electronics.tdk.com/press-center
LIVE Master Class on Frequency Response Measurement TechniquesOn March 10, 2021 at 10am PDT, Dr. Ray Ridley will...9092Event NewsLIVE Master Class on Frequency Response Measurement TechniquesOn March 10, 2021 at 10am PDT, Dr. Ray Ridley will host a FREE 2-hour masterclass on frequency response measurements for power systems. The LIVE format allows participants to learn from the safety of their own work or home environment. Designed for power supply design engineers at all levels of experience, this two-hour course will combine both theory and live measurements on power supplies made during the presentation. Dr. Ridley will also demonstrate how to verify measurements with simulation and modeling. “Once you learn these techniques, your development process will become far more efficient,” commented Dr. Ridley. “It’s incredibly important to understand how to validate and ruggedize a system for manufacturing.”04.02.2021 13:00:00Feb\images\news_2021-02-15_8.pnghttps://attendee.gotowebinar.com/register/2561471079323407888gotowebinar.com/register
Power Supplies Address EV and Hydrogen Production ApplicationsTDK Corporation announces the introduction of 50V,...9111Product ReleasePower Supplies Address EV and Hydrogen Production ApplicationsTDK Corporation announces the introduction of 50V, 400V and 500V output models to the TDK-Lambda GENESYS+™ series of programmable DC power supplies. With output power levels of 5kW, 10kW and 15kW in 1U, 2U and 3U high 19” rack-mount packages, the G50, G400, G500, GSP50, GSP400 and GSP500 models are fully compatible with the current series. The additional models are targeted at testing electric vehicle (EV) powertrains and other automotive sub-systems, and proton exchange membrane (PEM) electrolysers for hydrogen production. These optimised output voltages enable the power supplies to deliver more current without needing to parallel two or more units. All models seamlessly transition between constant voltage and constant current modes and also have constant power operation. For higher power systems, multiple power supplies can be connected in parallel with a patented advanced master/slave system that provides dynamic load response and ripple and noise characteristics comparable with that of a single power supply. The GENESYS+™ products can be ordered with three phase input ranges of 170-264Vac, 342-460Vac or 342-528Vac. The 5kW GENESYS+™ units weigh less than 7.5kg for easy movement or installation. Where user access is not required or needs to be restricted, a blank front panel option (with no metering or control functions) is available. Snap-on dust filters can also be added to limit airborne contamination.03.02.2021 19:30:00Feb\images\news_2021-02-15_27.jpghttps://www.emea.lambda.tdk.com/de-en/news/article.aspx?cid=16692emea.lambda.tdk.com/news
SiC MOSFETs Solve Design Challenges for Solar Energy CompanyROHM Semiconductor announced that Midnite Solar, b...9096Industry NewsSiC MOSFETs Solve Design Challenges for Solar Energy CompanyROHM Semiconductor announced that Midnite Solar, based in Arlington, WA, utilizes ROHM’s silicon carbide MOSFETs to drive efficiency and reduce system cost. Four products new to the US market – the Hawkes’s Bay 600VDC to 48VDC 6000W MPPT solar charge controller, powerful Barcelona dual MPPT charge controller, MNB17 advanced battery-based charger/inverter, and 120/240V Rosie inverter/charger – all benefit from the high performance and proven reliability of ROHM’s SiC technology. “SiC power devices offer vastly improved energy efficiency over the silicon parts they replace, and the cost premium has come down significantly, enabling a wider range of applications to benefit from these devices for better system performance and value. We are very happy to support Midnite Solar’s latest power conversion product design with our SiC MOSFET technology, and we are truly excited to see the advanced power devices and system solutions making a positive difference for our valued customers,” says Ming Su, Ph.D., Technical Marketing Manager at ROHM Semiconductor. “Silicon carbide solves a key challenge,” explains Robin Gudgel, Midnite Solar’s principal owner and engineering manager. “Regular silicon MOSFETs have a very slow body diode,” he details. “Therefore, trying to make an inverter work as a charger where it must run bidirectionally is very difficult. We were looking at an IGBT pair in combination with another diode, but silicon carbide is such a good solution, and ROHM’s devices did not require any significant design changes, so it was an obvious choice.”03.02.2021 17:00:00Feb\images\news_2021-02-15_12.jpghttps://www.rohm.com/news-detail?news-title=sic-mosfets-solve-design-challenges-for-midnite-solar&defaultGroupId=falserohm.com/news
Strategic Partnership for Driving Printed Electronics SolutionsHenkel Adhesive Technologies and Quad Industries h...9095Industry NewsStrategic Partnership for Driving Printed Electronics SolutionsHenkel Adhesive Technologies and Quad Industries have announced the expansion of their strategic partnership to offer capacities and support for technological value creation and prototyping with printed electronics solutions across multiple industries. The companies started their collaboration in 2019 and since then successfully worked on different projects such as the development of the innovative COVID-19 smart health patch introduced by Byteflies that was launched in 2020. With the advancement of the partnership Quad Industries has become a strategic partner in Henkel´s ecosystem for design creation, prototyping and manufacturing of printed electronics via flatbed screen printing. With more than 35 years of experience in printed electronics across multiple industrial markets Henkel Adhesive Technologies offers a broad material expertise, market know-how and partner network to support the commercialization process for smart product solutions. The business unit is a leading provider of a broad portfolio of conductive inks and coatings that enable flexible, cost-efficient and high-performing applications. “At Henkel we believe in a differentiated partnership approach across the entire value chain,” explains Stijn Gillissen, Head of Printed Electronics at Henkel. “Our network enables us to provide customers not only with products and knowledge, but also connecting them with circuit designers, printing manufacturers or external IoT specialists. Together we can leverage the potential of digital transformations by utilizing the benefits of printed electronics.”  03.02.2021 16:00:00Feb\images\news_2021-02-15_11.jpghttps://www.henkel.com/press-and-media/press-releases-and-kits/2021-02-03-henkel-expands-strategic-partnership-with-quad-industries-for-driving-printed-electronics-solutions-1147318?wt_mc=pressmailshenkel.com/press-and-media
Improving the Reliability of Electronic ComponentsThe Europe-wide research initiative Intelligent Re...9089Industry NewsImproving the Reliability of Electronic ComponentsThe Europe-wide research initiative Intelligent Reliability 4.0 (iRel40) aims to improve the reliability of electronic systems and microelectronic components. Coordinated by Infineon Technologies, 75 science and industry partners from 13 countries are pooling their forces to achieve this goal. “Enhancing electronics performance through miniaturization and integrating more and more functions is progressing steadily. Performance and complexity are increasing, as the costs per function go down,” says Dr. Reinhard Ploss, CEO of Infineon Technologies AG. “Powerful electronics form the basis for forward-looking technologies such as electro-mobility, autonomous driving, renewable energies and energy-efficient connected solutions. However, they will only be successful if users can depend on reliable functionality, quality and lifetime. Reliability is a key differentiating factor in international competition.” iRel40 adopts a holistic approach to optimizing the reliability of microelectronic systems along the entire value chain – from the wafer to the chip and the packaging and finally to the system and hence the actual application. The aim is to significantly reduce failure rates and thus improve product quality and lifetime. This approach also contributes to more sustainable management of our natural resources. Experts from science and industry in Europe are working together to achieve this. They are relying on the latest insights and methods in material research and failure analysis, including modeling and simulation, as well as artificial intelligence. The project is divided into eight work packages that deal with aspects such as requirements, theoretical principles, materials, test methods, and pilot applications. Infineon will, in particular, contribute its expertise and skills in chip and packaging technology.02.02.2021 10:00:00Feb\images\news_2021-02-15_5.jpghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2021/INFXX202102-033.htmlinfineon.com/press
Switch Provides True Reverse Current Blocking for Type-C PDAlpha and Omega Semiconductor announced a Type-C P...9098Product ReleaseSwitch Provides True Reverse Current Blocking for Type-C PDAlpha and Omega Semiconductor announced a Type-C Power Delivery (PD) high voltage source protection switch capable up to 28V absolute maximum voltage. The AOZ1374 is a smart protection switch in a small thermally enhanced 3mm x 3mm DFN package. AOS’s prowess in high-performance ICs combined with AOS’s high SOA MOSFETs using advanced co-packaging techniques. AOZ1374 supports a slew of protection features, including true reverse blocking in a small solution footprint with an industry-leading on-resistance of 36mOhm. While USB ports in consumer and computing equipment can receive up to 100W of power, power typically comes from an AC-DC adaptor supporting Type-C PD. The host device itself typically provides (sources) 5V @ 3A or up to 15W. This is the most common implementation in notebook applications and also in the majority of desktops. However, Type-C PD ports are gaining popularity in more devices such as smart monitors and power banks, and for such applications, a high voltage sourcing switch is required to deliver up to 100W power. Type C high voltage sourcing switches are also increasingly common in graphics cards or game consoles to power highend virtual reality gaming goggles. Similarly, a personal computer can connect to a monitor using one single Type-C cable providing both power and data. AOZ1374 uses a design IP developed for the AOZ1375DI high voltage bi-directional source/sink Type C protection switch with added integration features to eliminate the eternal current limiting resistor. The device features 28V absolute maximum voltage with the current limit capability, and startup safe operating area (SOA) management would be the ideal protection switch for the applications mentioned above. 02.02.2021 06:30:00Feb\images\news_2021-02-15_14.jpghttp://www.aosmd.com/res/news/news-article-1612287339229/AOZ1374DI_PR.pdfaosmd.com/news.pdf
Postponement of The smarter E Europe 2021The smarter E Europe with its four exhibitions Int...9097Event NewsPostponement of The smarter E Europe 2021The smarter E Europe with its four exhibitions Intersolar Europe, ees Europe, Power2Drive Europe and EM-Power Europe will be moved back by six weeks to the second half of 2021. The innovation hub for the new energy world will now take place from July 21–23, 2021, at Messe München. The smarter E Europe is Europe’s largest platform for the energy industry and the most important meeting point for the new energy world. In close coordination with exhibitors and partners, the event’s organizers Solar Promotion GmbH and Freiburg Wirtschaft Touristik und Messe GmbH & Co. KG have decided to postpone the events by six weeks to July 21–23, 2021. The decision was made in close coordination with the registered exhibitors and Messe München. “We asked our exhibitors and partners how they felt about a possible postponement, and we would like to thank them for the overwhelming response and constructive discussions,” says Markus Elsässer, CEO of Solar Promotion GmbH. “The results revealed that a clear majority of the exhibitors were in favor of postponing the event to July 21–23, 2021. Six weeks can make a big difference in the current situation.” The event will now fall in the second half of 2021. The organizer’s decision is based on a number of potential advantages. They expect that by then, more progress will have been made in terms of vaccinations, that travel restrictions will be lifted further, including by companies, and that the summer will have contributed to further stem the pandemic.01.02.2021 18:00:00Feb\images\news_2021-02-15_13.jpghttps://www.thesmartere.de/news/postponement-of-the-smarter-e-europe-2021?ref=m5f5b217f76a8001b5153a033-s5fc4d6810046ed031f529995-t1612861913-ca81fec12thesmartere.de/news
Partnership Enhances Ability to Service RF and Low-Loss PCB customersRogers Corporation’s Advanced Connectivity Solutio...9102Industry NewsPartnership Enhances Ability to Service RF and Low-Loss PCB customersRogers Corporation’s Advanced Connectivity Solutions (ACS) business unit announced the introduction of a new distribution channel with the addition of CCI Eurolam (CCI) to their sales and service team in the EMEA. ACS provides global customers with market-leading high performance and high reliability RF material solutions. CCI comes with over 50 years of sales and service experience in PCB processing and materials distribution. Rogers ACS’ continued expansion in the EMEA, combined with CCI’s extensive experience and distribution network, will provide the highest level of support to customers. Rogers and CCI, working closely as a team, will provide both sales and onsite service/support to PCB manufacturing customers throughout the EMEA. Dirk Lefelon, ACS Sales Manager Europe, noted, “I am pleased CCI and Rogers were able to form this relationship that focuses on enhancing our ability to service our customers in EMEA through improved service and local support.” 01.02.2021 10:30:00Feb\images\news_2021-02-15_18.jpghttps://rogerscorp.com/power-electronics-solutionsrogerscorp.com/power-electronics-solutions
Acquisition of Magnetic Component ManufactorerBourns announced that its newly-formed subsidiary ...9088Industry NewsAcquisition of Magnetic Component ManufactorerBourns announced that its newly-formed subsidiary has acquired all shares and interests of the various entities comprising the Kaschke Group with its headquarters in Göttingen, Germany. Kaschke was founded by Kurt Kaschke in 1955 and became known for its high competence in the development and production of application specific magnetic products. The Kaschke mission to use their ferrite core knowledge base for the development of solutions tailored to specific customer requirements matches Bourns' culture of innovative design. "As one of the few companies that has the capability to design and build ferrite core materials as well as manufacture complex inductive components, Kaschke will bring to Bourns the experience and creativity needed to solve customers' complex application challenges," said Gordon Bourns, Chairman and CEO of Bourns. "We are excited to welcome Kaschke to the Bourns organization to combine our capabilities and build stronger customer relationships." Al Yost, President and Chief Operating Officer at Bourns, said "This acquisition is an important element in Bourns' strategy to strengthen our inductive technology capability and broaden our portfolio of innovative magnetic products." "The combination of Kaschke and Bourns will enable the development of a full portfolio of products that will help our customers meet the challenging EMI filtering requirements of the next generation power supplies in the automotive, industrial and new energy markets," said Silke Baumgartner, President of Kaschke Components. "I'm delighted to form an alliance with Bourns, a company with a history and core values that are fully aligned with Kaschke's."01.02.2021 09:00:00Feb\images\news_2021-02-15_4.jpghttps://www.bourns.com/news/press-releases/pr/2021/02/03/bourns-acquires-kaschke-componentsbourns.com/news
High Voltage Differential ProbeThe Teledyne LeCroy HVD3220 is ideal for measuring...9099Product ReleaseHigh Voltage Differential ProbeThe Teledyne LeCroy HVD3220 is ideal for measuring GaN- and SiC-based power conversion system outputs, line outputs, in-circuit device switching outputs, and voltages across other components. The 400 MHz bandwidth is more closely aligned with user needs for in-circuit GaN and SiC system testing than other HVD Series probes. Additionally, some users will also find the HVD3220 useful for gate-drive signal measurements, or for measurements on 60 V common-mode power conversion systems. 01.02.2021 07:30:00Feb\images\news_2021-02-15_15.jpghttps://teledynelecroy.com/probes/high-voltage-differential-probes/hvd3220teledynelecroy.com/probes
Series of Digital Eighth-Brick DC/DC ConvertersFlex Power Modules announces the launch of the BMR...9107Product ReleaseSeries of Digital Eighth-Brick DC/DC ConvertersFlex Power Modules announces the launch of the BMR492 – a series of digital eighth-brick intermediate bus converters capable of delivering between 600 to 800W of continuous power along with a peak power of up to 1100 W for short periods <1s. This so-called ‘burst mode’ operation is commonly required for CPUs (such as Intel’s Ice Lake processor for example) for datacom and data center applications. The BMR4920302/861 converter, the first of three variants of the BMR492 family to be introduced, delivers a 12V output. Rated to a maximum 600W output over an input voltage range of between 40-60V, the DC/DC step-down solution is ideal for nominal 48 or 54 V input voltage systems commonly found in data center server applications. The through-hole mounted device is fully regulated and includes an input to output isolation voltage of 1500Vdc. This BMR492 variant delivers an extremely efficient operation evidenced by a peak efficiency of 96.7% at 48 Vin at half load. The output voltage is pre-programmed at 12 V as standard, but this can be adjusted across a wide range of 8 to 13.2 V via the incorporated PMBus interface. This feature is also useful to optimize system level efficiencies through dynamic bus voltage adjustment according to the supplied load.28.01.2021 15:30:00Jan\images\news_2021-02-15_23.jpghttps://flexpowermodules.com/bmr492-series-of-digital-eighth-brick-dc-dc-converters-deliver-up-to-1100-w-power-capabilityflexpowermodules.com
Compact Oscilloscopes with up to 2GHz BandwidthRIGOL Technologies EU introduces four high-end osc...9109Product ReleaseCompact Oscilloscopes with up to 2GHz BandwidthRIGOL Technologies EU introduces four high-end oscilloscopes which are possible to cascade different number of modules to increase channel counts. The DS8000-R series is a medium and high-end mixed signal digital oscilloscope with a compact size designed on the basic of the ASIC chip (RIGOL self-owns its intellectual property right) and UltraVisionII technical platform developed by RIGOL. It is compact and thin in design. It supports system integration of multiple devices. Its cascaded rack mount and remote system operation can meet the system requirements for industrial automation test system and high channel research application. With a sample rate of 10 GSa/s DS8000-R series oscilloscope has analog bandwidth from 350 MHz, 1 GHz and 2 GHz, supporting multiple-device synchronous triggering, available to be extended to 512 channels. The standard memory size is 500 Mpts for all channels. It provides an excellent solution for users to meet their high-speed requirement for the system integration test and synchronization requirement for multiple-channel data acquisition.27.01.2021 17:30:00Jan\images\news_2021-02-15_25.jpghttps://www.rigol.eu/products/oscillosopes/DS8000-R.htmlrigol.eu/oscillosopes
Data Center Professionals are Considering Power System Upgrades The events of 2020 rapidly accelerated a global, c...9094Industry NewsData Center Professionals are Considering Power System Upgrades The events of 2020 rapidly accelerated a global, cross-industry digital transformation, underscoring the mission criticality of data centers as the backbone of the world’s virtual economy. In fact, the data center market is expected to grow by nearly 14% in 2021. ABB Power Conversion issued a data report, “Data Overload: Powering Data Centers in the New Normal,” that explores the unprecedented demand on data centers in 2020 as well as long-term impacts that will shape data center operations for years to come. Not surprisingly, 96% of data center professionals surveyed reported that demand on their data center increased in 2020, which could indicate why 53% of those surveyed are likely to consider power system upgrades to meet increased demand in the future. “The impact of COVID-19 fundamentally accelerated the concept of mission critical. Overnight, businesses became even more reliant on the cloud to enable operations, processes and remote collaboration. This immediate transition would not have been possible without data centers backed by efficient and reliable power systems,” said Jeff Schnitzer, president, ABB Power Conversion. “Power is the ultimate enabler. Not only for rapidly scaling data center operations to meet exponential demand, but for energizing the ongoing digital transformation that’s the beating heart of technology and smart societies of the future. And data center power architectures are core components of this.”27.01.2021 15:00:00Jan\images\news_2021-02-15_10.jpghttps://electrification.us.abb.com/news/powering-new-normal-abb-survey-finds-53-data-center-professionals-are-considering-power-system?utm_source=media&utm_medium=release&utm_campaign=datareportelectrification.us.abb.com/news
External Power Supplies with Interchangeable Plugs for International CompatibilityJasper Electronics has expanded its line of medica...9103Product ReleaseExternal Power Supplies with Interchangeable Plugs for International CompatibilityJasper Electronics has expanded its line of medical grade power supplies with 27 model series of external power adapters. The adapters are compliant with International Electromechanical Commission (IEC) standards for the safety and effectiveness of medical electrical equipment, including: IEC60601-3rd Edition, UL/cUL, TUV, and FCC certification. Several of the wall-mounted model series have interchangeable AC plugs for international compatibility, and all units have custom connector and cable options. “With this significant expansion of our IEC60601-certified external medical power supply product lines, we’ve provided our customers in the medical electronics industry with a wide range of high efficiency, reliable power options,” said Robert Nishimoto, president, Jasper Electronics. “With a selection that includes external fanless designs, a wide range of input and output power ratings, interchangeable AC plugs, and both standard and custom cable and connector options, customers will be able to select optimum specifications, performance, and price for their medical applications.” Jasper Electronics’ comprehensive range of medical-grade external power supplies includes both wall-mounted and desktop configurations with output power ratings from 4.5W to 310W. All models carry safety agency certifications (UL/cUL, TUV, CE, FCC, and IEC60601 -3rd Edition), and many feature multiple sets of interchangeable AC plugs for worldwide compliance. The HEMG Series devices feature universal input harmonic power factor correction (PFC) with high efficiency.27.01.2021 11:30:00Jan\images\news_2021-02-15_19.jpghttp://www.jasperelectronics.com/products/medical-external/jasperelectronics.com/medical-external
Stefan Schaffhauser Takes Over as CEO In keeping with a long-term succession plan, the p...9086PeopleStefan Schaffhauser Takes Over as CEO In keeping with a long-term succession plan, the previous CEO, Markus Dalla Monta, will retire as of July 2021, following a 35-year career at Traco Power. Stefan Schaffhauser will assume the CEO position with the beginning of the business year on April 1, 2021. As of this date, he will lead the Traco Power Group together with the CFO, Adrian Berger. As before, Rolf Caspar – company owner and Chairman of the Board – will continue to concentrate his efforts on strategic issues in the firm, in conjunction with the board of director members, Jennifer Caspar and Ueli Wampfler. During the past three years, Stefan Schaffhauser managed the international business team at Traco Power as their managing director, effectively contributing to a positive corporate development. Prior to his career at Traco Power, Schaffhauser was employed at various industrial enterprises in management positions and as a business consultant. Stefan Schaffhauser obtained a Master’s degree in Engineering and Management at the ETH (Confederated Technical University of Switzerland) in Zurich. “It is a great honor for me to assume the management of this outstanding company,” says Stefan Schaffhauser. “Traco Power is situated extremely well financially, and we can build on innovative products, a strong brand, and an excellent company culture. I look forward to further advancing Traco Power together with my management team and our staff members.”27.01.2021 07:00:00Jan\images\news_2021-02-15_2.jpghttps://www.tracopower.com/de/stefan-schaffhauser-takes-over-new-ceo-traco-power-grouptracopower.com
Compact Inverter for Direct Connection to Medium-Voltage GridAs the energy transition progresses, the expansion...9071Industry NewsCompact Inverter for Direct Connection to Medium-Voltage GridAs the energy transition progresses, the expansion of the electricity grids is becoming increasingly important. More and more renewable generation plants as well as electrical storage systems are being connected to the grid. This gives power electronics a decisive role, because it is essential to connect these systems to the grid. However, in addition to the mere feed-in or feed-back of electrical energy, power electronics must also perform other grid-supporting tasks. In the "SiC-MSBat" project, researchers at the Fraunhofer Institute for Solar Energy Systems ISE, together with partners, have now developed and successfully commissioned a highly compact inverter for direct feeding into the medium-voltage grid. Currently, inverters mostly feed into the low-voltage grid. They are then coupled to the medium-voltage grid via large 50 Hz transformers. The use of new types of silicon carbide (SiC) transistors with very high blocking voltages now also makes it possible to connect the inverters directly to the medium-voltage grid. Thanks to the high control dynamics of SiC inverters, they can take on grid-stabilizing tasks and, for example, act as active power filters to compensate for harmonics in the medium-voltage grid. Furthermore, SiC inverters can achieve much higher power densities than conventional inverters. This results in a compact design, which is a particular advantage when plants are to be built in inner-city areas or existing old plants are to be retrofitted. In addition to the mere system costs, construction and infrastructure costs also play a very important role, especially in urban areas.25.01.2021 15:00:00Jan\images\news_2021-02-01_10.jpghttps://www.ise.fraunhofer.de/en/press-media/press-releases/2021/fraunhofer-ise-develops-highly-compact-inverter-for-direct-connection-to-medium-voltage-grid.html?utm_source=mailing&utm_campaign=2021-pi-01-enise.fraunhofer.de/press-releases
24 V Dual-Channel Low Side DriverInfineon Technologies broadens its EiceDRIVER port...9077Product Release24 V Dual-Channel Low Side DriverInfineon Technologies broadens its EiceDRIVER portfolio with the 24 V dual-channel low side gate driver with an integrated thermal pad. It can be operated with high switching frequencies as well as highest peak output currents and offers an enable function. The gate driver is suitable for applications with higher switching frequencies such as power factor correction and synchronous rectification, as well as a transformer driver or a buffer driver for parallel MOSFET applications or high-current IGBT modules such as EasyPACK and EconoPACK. The EiceDRIVER 2ED24427N01F provides a symmetrical output stage with 10 A source and sink drive capability with integrated under-voltage lockout (UVLO) protection and logic level enable control. The gate driver is available in a DSO-8 package with a thermally efficient and exposed power pad. With 55 ns propagation delays and 450 m? (max) source and sink ON resistance per channel, the driver enables high switching frequencies with reduced switching losses of the power transistors. The integrated thermal pad offers very low thermal resistance to enable reliable operation at lower temperatures under high current conditions or at higher switching frequencies. 2ED24427N01F is rated for industrial temperature grade operation.25.01.2021 11:30:00Jan\images\news_2021-02-01_16.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2021/INFIPC202101-030.htmlinfineon.com/market-news
Agreement to Create a Centre of Excellence for Direct CurrentOn Friday the 22nd of January, Xavier Piechaczyk, ...9066Industry NewsAgreement to Create a Centre of Excellence for Direct CurrentOn Friday the 22nd of January, Xavier Piechaczyk, Chairman of the board of directors at RTE (Réseau de Transport d'Electricité) and Hubert de la Grandière, CEO of the Institute for Energy Transition (ITE) SuperGrid Institute, signed a partnership agreement to develop a centre of excellence for direct current and power electronics. This partnership makes it possible to develop new collaborations in order to meet the challenges involved in energy transition by bringing together R&D skills and cutting-edge technologies. Xavier Piechaczyk, Chairman of RTE's board of directors and Hubert de la Grandière, CEO of SuperGrid Institute, signed this partnership agreement with a view to creating a French centre of excellence for direct current, with its base in the Greater Lyon area. The aim is to share the R&D skills, high-voltage technological facilities and simulation resources of the two organisations; SuperGrid Institute, a research and technological innovation centre working on the energy transmission systems of the future, based in Villeurbanne (69), and the RTE Transfo Campus, a training and innovation centre in the field of electricity transmission, located in Jonage (69) in the Greater Lyon area. Among the targeted joint actions, RTE and SuperGrid Institute intend to work together on R&D projects for the development of a direct current meshed grid, notably in response to the increase in power generated by offshore wind farms. "This centre of excellence in the Greater Lyon area, the only one of its kind in Europe, is a major asset for sharing our expertise, test facilities and simulation platforms and offers us an optimal vantage point from which to prepare and train the European energy ecosystem for the future," said Hubert de la Grandière, CEO of SuperGrid Institute.22.01.2021 10:00:00Jan\images\news_2021-02-01_5.jpghttps://www.supergrid-institute.com/en/2021/01/22/rte-supergrid-institute-partnership-agreement-centre-excellence-direct-current/supergrid-institute.com
10:1 Ratio DC-DC Converters in Half- and Quarter-Brick FootprintMurata announces two ultra-wide 10:1 ratio DC-DC c...9080Product Release10:1 Ratio DC-DC Converters in Half- and Quarter-Brick FootprintMurata announces two ultra-wide 10:1 ratio DC-DC converters, the 250W IRH-W80 half-brick and the 150W IRQ-W80 quarter-brick from Murata Power Solutions. Both high power density modules feature efficiency levels above 91% with a 16 – 160 Vdc input voltage range. The 250W IRH-W80 and 150W IRQ-W80 modules are designed for embedded applications in the railway and industrial sectors. They comply with the requirements of EN50155, coming with qualification reports for shock, vibration, extreme temperatures and humidity. Typical applications include powering equipment on board trains, such as infotainment, communications and lighting, and from a wide range of battery voltages, that require a reliable DC source. The modules also can be used in other industrial applications that operate from batteries in harsh environments. The 250W IRH-W80 and 150W IRQ-W80 have a baseplate operating ambient temperature range of -40°C to 100°C. Single 12 V, 24 V, and 54 V output models are available with galvanic isolation between the input and output in excess of 4 kVdc. Features include remote enable on/off, a wide output voltage adjustment range of ±10%, remote sense, hold up function, pulse out feature, positive or negative enable and over current protection adjustment. The adjustable undervoltage lockout protection feature prevents deep discharge of supplying batteries. The modules also feature self-protection to external short circuits, over current protection, and over temperature protection with self-resetting ability.21.01.2021 14:30:00Jan\images\news_2021-02-01_19.jpghttps://www.murata.commurata.com
4-Channel Window Voltage Detector IC Ricoh Electronics Devices has launched the R3500 s...9127Product Release4-Channel Window Voltage Detector IC Ricoh Electronics Devices has launched the R3500 series, a 4-channel high-voltage window voltage detector suitable for use in products required to meet functional safety standards. Today’s automotive and industrial equipment must meet increasing needs for functional safety and is required to have high-accuracy monitoring functions on supply voltages for MCUs and SoCs. Additionally, voltage monitoring functions must cover more power supplies than ever. To meet the needs above, the R3500 series has four voltage detectors in a single chip. Each detector can monitor not only under-voltage but also over-voltage of a targeted power supply, which contributes to high detection coverage. The detection voltage values are settable in 0.01 V step and will help construct a high-accuracy voltage monitoring circuit optimized for your system. Also, voltage monitoring systems combining the R3500 series with the R3152 series or the R3154 series, our conventional 1-channel voltage detector ICs, can cover a wider range of applications. A typical voltage detector has possibility of failing to operate properly when the voltage it monitors fluctuates largely, because it uses the monitored voltage stepped down to 3.3 V or 5 V as its source voltage. To ensure stable voltage monitoring even under large voltage fluctuations, the R3500 series has a high operating voltage range up to 42 V and separates its voltage monitoring pins from the power supply pin. For higher security, the R3500 series has a fault-diagnostic function which checks if the IC itself can operate properly, as the product is designed to enhance safety of systems. This function will help reduce latent faults.21.01.2021 10:30:00Jan\images\news_2021-03-01_16.pnghttps://www.n-redc.co.jp/en/about/info/20210121.htmln-redc.co.jp/info
Reliability Report Shows Field Experience of GaN-DevicesEPC announces its 'Phase-12 Reliability Report', d...9065Industry NewsReliability Report Shows Field Experience of GaN-DevicesEPC announces its 'Phase-12 Reliability Report', documenting the strategy used to achieve a remarkable field reliability record. eGaN devices have been in volume production for more than eleven years and have demonstrated very high reliability in over 226 billion hours of operation, most of which are in vehicles, LTE base stations, and satellites, to name just a few applications with rigorous operating conditions. This report presents the results of testing eGaN devices to the point of failure, which provides the information to identify intrinsic failure mechanisms of the devices. By identifying these intrinsic failure mechanisms, deep knowledge of the behavior of a device over time, temperature, electrical or mechanical stress can be developed and used to create physics-based models that accurately project the safe operating life of a product over a more general set of operating conditions.  According to Dr. Alex Lidow, CEO and co-founder of EPC, "The release of EPC's 12th reliability report represents the cumulative experience of millions of devices and five generations of technology. These reliability tests have been undertaken to continue our understanding of the behavior of GaN devices over a wide range of stress conditions." Dr. Lidow continues, "Standard power semiconductor qualification testing is inadequate since it only reports parts that pass a very specific test condition. By employing our test-to-fail methodology we have consistently produced more robust, higher performance, and lower cost products for power conversion applications and have amassed a reliability track record beyond what is achievable with traditional silicon MOSFET technology."21.01.2021 09:00:00Jan\images\news_2021-02-01_4.jpghttps://epc-co.com/epc/EventsandNews/News/ArtMID/1627/ArticleID/2967/EPC-Releases-Physics-Based-Models-That-Project-eGaN-Device-Lifetime-in-New-Reliability-Report.aspxepc-co.com/News
Wafer Handling Tool EFEMmechatronic systemtechnik announces the availabili...9075Product ReleaseWafer Handling Tool EFEMmechatronic systemtechnik announces the availability of the mWL.cs mechatronic calotte loader. A fully automated stand-alone system for transferring wafers between cassettes and calottes, the mWL.cs provides integrated device manufacturers (IDMs) an opportunity to increase yield and improve process traceability at a high throughput. Evaporation process tools often utilize spherical carriers and rings to meet uniformity and defectivity targets. However, the design of these tools has made it challenging to introduce automated wafer handling in this step of the manufacturing process. IDMs invariably default to manual wafer loading, which has resulted in yield degradation and an increased risk for misprocessing. "Automating the wafer loading and unloading system for evaporation type metal deposition is a step that bears much potential," shared Stefan Detterbeck, Sales Director. "By eliminating human error from the equation, our system enables manufacturers to achieve higher yield and reduce damage to wafers. Enhanced process traceability also supports quality improvement measures to meet the conformity requirements of critical customer industries." A specialist in fully automated handling systems for non-standard substrates and handling requirements, mechatronic recognizes and addresses the semiconductor industry's need for the handling of ultra-sensitive substrates used in modern new wafer fabrication technologies. The company's deep expertise and proprietary technologies provide manufacturers with safe, reliable systems that handle non-standard substrates with ease and confidence.20.01.2021 09:30:00Jan\images\news_2021-02-01_14.pnghttps://www.mechatronic.at/mechatronic.at
High-Temperature Capacitors Operate up to 125°CEven if water cooling is not possible or the cooli...9072Product ReleaseHigh-Temperature Capacitors Operate up to 125°CEven if water cooling is not possible or the cooling water temperature can only up to 45°C, the HTC high-temperature capacitors from Celem (sales: Eurocomp) are used safely and reliably. Various designs are offered in the HTC series, which are available for 550V or 1000V, depending on the capacitance. Depending on the design, the capacitance values range from 0.1 µF to 0.4 µF. The picture shows the designs CSM, C-Cap mini, CMPP and CSP with the different connection options. On request, these capacitors can be manufactured with UL-certified resin. Celem uses a high-quality high-temperature film for its HTC series which makes the series ideal for e.g. wireless power transmission in automotive applications, for example, as part of inductive wireless charging for EVs.20.01.2021 06:30:00Jan\images\news_2021-02-01_11.jpghttps://eurocomp.de/products/celem-power-capacitors/eurocomp.de/celem
Flux-Cored Wire for Robotic and Laser SolderingIndium Corporation announces that it is now offeri...9106Product ReleaseFlux-Cored Wire for Robotic and Laser SolderingIndium Corporation announces that it is now offering CW-232, a uniquely formulated flux-cored wire that combines superior wetting speed and spread with extremely low-spatter performance. Indium Corporation’s CW-232 is a highly activated rosin flux-cored wire developed to meet the demanding requirements of robotic and laser soldering applications by delivering additional wetting power in order to achieve higher throughput. CW-232 also works exceptionally well in hand soldering applications. Due to its “no-spatter” technology, CW-232 eliminates flux spattering that can burn operators’ hands, impair the vision system of the robotic soldering machines, or make finished products less aesthetically appealing.19.01.2021 14:30:00Jan\images\news_2021-02-15_22.jpghttps://www.indium.com/corporate/media-center/news/indium-corporation-introduces-new-fast-wetting-low-spatter-flux-cored-wire-for-robotic-and-laser-soldering/indium.com/news
Appointment of CEO and COOPowerex is pleased to announce the appointments of...9063PeopleAppointment of CEO and COOPowerex is pleased to announce the appointments of Joseph Wolf as President and Chief Executive Officer and Ronald Yurko as Chief Operating Officer, in connection with the retirement of John Hall from the company. Joseph has been with Powerex since 2008, most recently serving the role of Vice President and CFO. Ronald has been at Powerex since 2007, most recently in the role of Vice President of Value-Added Products. Powerex is a joint venture between General Electric and Mitsubishi Electric with corporate headquarters and manufacturing located in Youngwood, Pennsylvania. The company was founded in 1986 and can trace its origins back to Westinghouse Electric, which established the facility at the current location in 1956. The 90,000 square feet of manufacturing space includes silicon wafer processing, diffusion, assembly, test,and high reliability screening. Powerex also features a semi-automated manufacturing power module line in a Class 10,000 cleanroom. Powerex is a leading domestic manufacturer of high-power semiconductor solutions. Its broad product line includes SiC MOSFETs (SiliconCarbide Metal-Oxide-Semiconductor Field-Effect Transistor), IGBTs (Insulated Gate Bipolar Transistors), HVIGBTs, rectifiers, thyristors, custom power modules and assemblies. These highly reliable electronic component solutions are designed for the Defense, Aviation, Traction, Mining, Medical, and Renewable Energy markets.18.01.2021 07:00:00Jan\images\news_2021-02-01_2.pnghttps://www.pwrx.com/LibrarySearch.aspx#8326pwrx.com
Expanding Production Capacity of SiC Power DevicesROHM has recently held an opening ceremony announc...9062Industry NewsExpanding Production Capacity of SiC Power DevicesROHM has recently held an opening ceremony announcing the completion of a new building at ROHM Apollo's Chikugo plant to enhance the production capacity of SiC power devices. The building is a state-of-the-art environmentally friendly factory that introduces a number of energy-saving technologies to its production facilities, with 100% of its electricity coming from renewable energy sources. ROHM continues to lead the industry in technological development, such as by introducing the industry's first full SiC power modules and SiC trench MOSFETs. At the same time, boasting an integrated production system, ROHM is working to improve production efficiency by increasing wafer diameter and utilizing the latest equipment while also reducing the environmental impact of manufacturing. In addition to this new building, SiCrystal GmbH, a ROHM Group company that manufactures SiC wafers, is scheduled to start operating with 100% renewable energy from the next fiscal year, reducing CO2 emissions from purchased power at the plant to zero. As a result, all major production processes for SiC wafers will use environmentally friendly renewable energy. In response to the urgent need to address global energy issues, the ROHM Group will continue to improve SiC power device performance – expected to be key to achieving energy saving in electric vehicles and industrial equipment – contributing to reducing environmental impact by promoting the use of eco-friendly equipment and renewable energy in the production process.18.01.2021 06:00:00Jan\images\news_2021-02-01_1.jpghttps://www.rohm.com/news-detail?news-title=rohm-apollo-chikugo-plant&defaultGroupId=falserohm.com/news
Configurable AC/DC Power Supply with 24 Isolated OutputsComponents Bureau is pleased to offer Advanced Ene...9082Product ReleaseConfigurable AC/DC Power Supply with 24 Isolated OutputsComponents Bureau is pleased to offer Advanced Energy's Excelsys CoolX3000 series. The small sized configurable power supply offers an incredible 3000W in a small package of 300 x 131 x 120mm, addressing the requirement for smaller power supplies offering the same power but in a smaller footprint. The CoolX3000 series offers an impressive 24 outputs; all outputs are isolated (1850 VAC) and the power supply has PMBus digital communications for monitoring and control capability.  Features include plug and play power along with series and parallel outputs for higher voltage and currents. The 3000 series offer up to 91% efficiency with variable fan speed control.  It has level 4 input surge protection with a MTBF of 150,000 hours and comes with 5-year warranty. With an Input voltage range of 180 to 264 VAC (300VAC for 5secs), output voltage of 1 to 696V and ripple and noise 1% of nominal. Operating temperature range  -25 to +60°C with an interface of 8-way connector, voltage control via potentiometer. This intelligent modular power supply is suitable for Medical, Industrial and Harsh Industrial applications.14.01.2021 16:30:00Jan\images\news_2021-02-01_21.jpghttps://www.componentsbureau.com/latest-news/new-products/3000w-configurable-acdc-power-supply-offering-intelligent-digital-power-with-24-isolated-outputscomponentsbureau.com/latest-news
Validity of Patent Relating to a Separator for Lithium Ion Secondary BatteriesThe Korean Intellectual Property Trial and Appeal ...9069Industry NewsValidity of Patent Relating to a Separator for Lithium Ion Secondary BatteriesThe Korean Intellectual Property Trial and Appeal Board issued a decision to dismiss a patent invalidation petition and confirmed the validity of Asahi Kasei's Korean patent (Patent No. 10-0977345) relating to a separator for lithium-ion secondary batteries. Asahi Kasei filed a patent infringement lawsuit with the Seoul Central District Court against W-SCOPE Corporation (Head Office: Shinagawa-ku Tokyo) and its subsidiary, W-SCOPE KOREA CO., LTD. (hereinafter "W-SCOPE Corporation, etc."), which manufacture and sell separators for lithium ion secondary battery, as joint defendants. The lawsuit claims infringement of Asahi Kasei's patent. It seeks an injunction restraining W-SCOPE Corporation, etc., from manufacturing and selling their polyolefin microporous membrane products (including separator products for lithium ion secondary battery with product names such as "SB12D," "SB16D," "single-layer W-scope," etc.) in Korea, and compensation for damages. After Asahi Kasei filed the lawsuit, one of the defendants, W-SCOPE KOREA CO., LTD., filed a patent invalidation petition with the Korean IPTAB seeking the invalidation of Asahi Kasei's patent on March 11, 2020. After sufficiently examining the arguments of both parties, the Korean IPTAB issued a decision to dismiss the invalidation petition and confirmed the validation of Asahi Kasei's patent. Asahi Kasei will pay close attention to issues concerning intellectual property rights, and if deemed necessary, take specific measures proactively against any infringement.14.01.2021 13:00:00Jan\images\news_2021-02-01_8.jpghttps://www.asahi-kasei.com/news/2020/e200511_1.htmlasahi-kasei.com/news
Module Family for High-Density Computing and DatacentersMonolithic Power Systems announced the launch of a...9057Product ReleaseModule Family for High-Density Computing and DatacentersMonolithic Power Systems announced the launch of a new family of 48V to 6V digital DC/DC power modules for 48V Datacenter Solutions, utilizing eGaN transistors from Efficient Power Conversion (EPC) Corporation. These power modules target applications for high-density computing and datacenters, artificial intelligence, machine learning, and multi-user gaming. The MPC1100-54-0000 is the first in the new product family that will include modules in an LLC topology that utilize eGaN FETs to achieve an overall efficiency above 97% in a footprint of only 27mmx18mmx6mm for 48V to 6V conversion. A key advantage of 48V to 6V front-end conversion includes the enabling of a high-frequency secondary stage that is small enough to be placed much closer to the xPU/ASIC/GPU to reduce the power distribution loss by 4X compared to the commonly used STC topology for 48V to 12V conversion. For high-density server applications, record power density and efficiency can be achieved with simple, low-cost topologies such as an LLC DC/DC converter. eGaN FETs are well-suited for LLC converters due to their combined low gate charge with 5V gate operation that yields very low gate power consumption, ultra-low on resistance, and low output capacitance charge.14.01.2021 12:30:00Jan\images\news_2021-01-15_17.jpghttps://www.monolithicpower.com/en/mpc1100-54.htmlmonolithicpower.com
Certified Components for Automotive ElectronicsWürth Elektronik has published a catalog of AEC-Q2...9068Industry NewsCertified Components for Automotive ElectronicsWürth Elektronik has published a catalog of AEC-Q200 certified components for automotive electronics. Product highlights include ferrites, inductors and particularly robust electromechanical components. Design kits from many product groups are available for developers-as sample sets with free refill service. With WE-TEMA, Würth Elektronik offers an innovative series of ferrites for cable assembly, some variants of which use new, innovative materials like nanocrystalline and manganese-zinc. The range of high-frequency inductors is now complemented with the WE-MCI product family. With their inductance ranging from 1 nH up to 470 nH, the multilayer ceramic inductors cover a wide variety of application areas. The WE-MAIA SMT series of storage chokes has been extended with package sizes 1610, 5020, 5030, 4020HT. Würth Elektronik presents its new WE-SCFA contact fingers, certified for the special requirements in automotive applications and with WE-SMSA SMT spacer bolts. Besides detailed product information in several chapters, the new automotive catalog also provides extensive background and design knowledge as well as a series of practical application examples. The Würth Elektronik Automotive Components Catalog is now available in English at http://www.we-online.de/aspcatalogue21.14.01.2021 12:00:00Jan\images\news_2021-02-01_7.jpghttps://www.we-online.com/web/en/wuerth_elektronik/news_weg/News_Detail_WE_Gruppe_116862.phpwe-online.com/news