| More News | Teaser | NewsID | NewsSection | Title | Text | Announced | AnnouncedMMM | Picture | PicturePath | WebLink | WebLinkText |
| SiC SBDs for Data Center PSUs | ROHM has announced that Murata Power Solutions is ... | 11256 | Product Release | SiC SBDs for Data Center PSUs | ROHM has announced that Murata Power Solutions is using its silicon carbide (SiC) Schottky Barrier Diodes (SBD) to increase performance and reduce the size of Power Supply Units (PSUs) for data center applications. ROHM’s SiC SBDs, SCS308AH feature high surge resistance and short recovery time, enabling high-speed switching. Murata’s D1U front end AC-DC power supply series include many active units such as the D1U54P-W-2000-12-HB3C and D1U54P-W-1200-12-HC4PC, highly-efficient power-factor-corrected front-end power supplies that provide 12V main and 12V/3.3V standby output. Multiple units can share current and operate in parallel. The power supplies support hot-plugging and are protected from fault conditions such as over-temperature, over-current and over-voltage. What’s more, the low profile 1U package make them ideal for delivering reliable, efficient power to servers, workstations, storage systems and other 12V distributed power systems while minimizing the number of required power modules. Jay Barrus, President, ROHM Semiconductor U.S.A.: “We are excited to help Murata Power Solutions, a Murata Manufacturing Group company that leads the industry in the field of industrial equipment including power supply systems. We are the leading company in SiC power semiconductors and have achieved a significant technological lead in this field along with the provision of power solutions combined with gate driver ICs. Together with Murata Power Solutions, we want to further improve the energy efficiency of power supply systems by using the full potential of SiC technology for industrial and data infrastructure.” | 07.03.2023 09:30:00 | Mar | news_2023-03-15_14.jpg | \images\news_2023-03-15_14.jpg | https://www.rohm.com/news-detail?news-title=2023-03-07_news_murata&defaultGroupId=false | rohm.com |
| DC/DC Converters for Data-Hungry Applications | Helping to enable the next generation of high-perf... | 11254 | Product Release | DC/DC Converters for Data-Hungry Applications | Helping to enable the next generation of high-performance, computing-intensive technologies, ABB Power Conversion introduced its DLynx IIITM point-of-load (POL) modules, the third generation of its proven digital DLynx family. The high-current modules enable board design flexibility by implementing a master-satellite concept to help meet the needs of today’s networking, data center, and industrial equipment, including the latest application-specific integrated circuits (ASICs) and field-programmable gate arrays (FPGAs). The DLynx III product family includes 40-, 80-, 120-, and 160-amp (A) master DC/DC converters as well as 40A and 160A satellite modules. The master DC/DC converters can be used as standalone POL modules or can be used in tandem with satellites modules. When used together, the master and satellite modules can be deployed in higher-powered single-output configurations to meet growing board-level power requirements and power density demands or in dual-output configurations to power components with differing output voltage requirements. “As networking and data center equipment continues to evolve to meet the need for higher computing capacities and more data throughput at faster speeds, the components powering this advanced equipment must also evolve,” said Vito Savino, data center and wireline segment leader for ABB Power Conversion. “When looking to pack more computing prowess onto printed circuit boards with fixed board footprints, every millimeter of available space becomes premium real estate.” | 07.03.2023 07:30:00 | Mar | news_2023-03-15_12.jpg | \images\news_2023-03-15_12.jpg | https://www.abbpowerconversion.com/about/news/press-releases/abbs-dlynx-iii-dc-dc-converters-provide-flexible-power-dense-solutions-for-data-hungry-applications | abbpowerconversion.com |
| Single-Chip Intelligent Battery Management Solutions for 20-Cell Systems | Qorvo announced it has expanded its power manageme... | 11253 | Product Release | Single-Chip Intelligent Battery Management Solutions for 20-Cell Systems | Qorvo announced it has expanded its power management portfolio to include the PAC22140 and PAC25140 Power Application Controller® (PAC) devices. The two PACs are the single-chip solutions to offer support for battery packs with up to 20 cells in series (20s). These products leverage an intelligent motor control foundation to enable intelligent battery management solutions (BMS) for a wide range of industrial, e-mobility and battery backup applications. The highly integrated PAC22140 and PAC25140 save designers more than 50% of PCB space and lower total BOM cost by 30%, while reducing time to market leveraging Qorvo's hardware and firmware ecosystem. The devices integrate all essential analog and power management peripherals with a 32-bit Arm® Cortex® M0 or M4F microcontroller and include cell balancing, monitoring and protection for 10s-20s battery packs. The PAC22140 and PAC25140 provide access to multiple analog and digital peripherals required to manage today’s high-cell-count battery packs. These include a programmable-gain differential amplifier, multiple 16-bit Sigma-Delta ADCs for current and voltage sensing, and a 10-bit SAR ADC. A single-supply 145V-buck DC/DC controller generates a 5V system rail to power the device, while an integrated charge pump supports the charge and discharge FET drivers. "The need for higher cell count solutions is increasing as end users demand longer battery life, faster charging time and lighter overall weight from new battery-powered applications,” said Brian McCarthy, senior manager for Qorvo’s PAC product line. “The highly integrated PAC22140 and PAC25140 provide designers complete solutions for these high-power, high-performance systems.” | 07.03.2023 06:30:00 | Mar | news_2023-03-15_11.jpg | \images\news_2023-03-15_11.jpg | https://www.qorvo.com/newsroom/news/2023/qorvo-introduces-industrys-first-single-chip-intelligent-battery-mgmt-solutions-20-cell-systems | qorvo.com |
| 800V Electric Vehicles Charge into the Mainstream using SiC Power Electronics | The demand for electric vehicle (EV) power electro... | 11251 | Industry News | 800V Electric Vehicles Charge into the Mainstream using SiC Power Electronics | The demand for electric vehicle (EV) power electronics will increase dramatically in the next ten years, primarily driven by rapid growth in the BEV car market, where IDTechEx predicts a 15% CAGR globally over the next decade. Currently, the weighted-average battery capacity of BEV cars is increasing in all regions, piling pressure on battery supply chains, and creating uncertainty. The result is that drive cycle efficiency must come to the forefront of powertrain design, meaning the time has come for high voltage wide bandgap (WBG) power electronics. The IDTechEx report "Power Electronics for Electric Vehicles 2023-2033" provides a deep-dive into EV power electronics with technology insights into the evolving semiconductor and package materials, including Si, SiC and GaN semiconductors, die-attach materials, wire bonding, thermal management, and more. IDTechEx presents granular forecasts detailing unit sales, GW and US$ demand for inverters, onboard chargers (OBC) and DC-DC converters segmented by voltage (600V, 1200V) and semiconductor type (Si, SiC, GaN). While Si IGBTs have dominated the medium-to-high power device range for 20 years, including in EV power electronics, they are giving way to a new generation of WBG materials: SiC and GaN. This will fundamentally impact the design of new power devices, including the package materials, as high voltage and high power-density modules operating at higher temperatures becomes the trend. | 06.03.2023 13:00:00 | Mar | news_2023-03-15_9.jpg | \images\news_2023-03-15_9.jpg | https://www.idtechex.com/en/research-report/power-electronics-for-electric-vehicles-2023-2033/923 | idtechex.com |
| PLECS Real-Time Embedded Workshop | In the workshop from April 25th to 26th in Zurich,... | 11247 | Event News | PLECS Real-Time Embedded Workshop | In the workshop from April 25th to 26th in Zurich, you will learn modeling techniques for real-time simulations using PLECS with microcontrollers and the PLECS RT Box. You will work hands-on with hardware-in-the-loop (HIL) and rapid control prototyping (RCP) application examples. You will see that step size can be reduced to microseconds, even for large-scale models. In addition to the technical aspects, the workshop offers an opportunity to connect with the developers of PLECS. The required software, microcontrollers, and PLECS RT Box hardware will be provided for the workshop. | 06.03.2023 11:55:00 | Mar | news_2023-03-15_5.jpg | \images\news_2023-03-15_5.jpg | https://plexim.com/events/seminars/2171 | plexim.com |
| In-Vehicle Network ESD Protection Portfolio for 24 V Board Net Systems | Nexperia introduced an AEC-Q101 qualified portfoli... | 11261 | Product Release | In-Vehicle Network ESD Protection Portfolio for 24 V Board Net Systems | Nexperia introduced an AEC-Q101 qualified portfolio with six ESD protection devices (PESD2CANFD36XX-Q), designed to protect bus lines in automotive in-vehicle networks (IVN) such as LIN, CAN, CAN-FD, FlexRay and SENT from damage caused by electrostatic discharge (ESD) and other transients. As data rates increase and vehicles feature more electrification, the need for ESD protection is becoming ever more critical. Providing the right protection for automotive modules is a continuous challenge for design engineers. In contrast to the battery voltage found in cars and smaller vehicles, 24 V board nets are typically used in trucks and commercial vehicles. ESD protection devices with operating voltages typically above 32 V are required to safeguard sensitive signal lines in 24 V board nets. Addressing these requirements, Nexperia has designed this portfolio to have a maximum reverse standoff voltage of 36 V and up to 22 kV ESD protection. This performance is combined with a low clamping voltage of V<sub>CL</sub>= 48 V at I<sub>PP</sub> = 1 A to provide the best-in-class system-level robustness for IVN. Keeping the specifications of in-vehicle networks and the ease of design in mind, Nexperia is offering this portfolio in SOT23 and SOT323 packages with three different ultra-low capacitance classes of 4.3 pF, 6 pF and 10 pF, which help ensure a smooth communication between interfaces without impacting signal integrity. This combination maximizes flexibility in PCB design and offers several performance options for design engineers. | 03.03.2023 14:30:00 | Mar | news_2023-03-15_19.jpg | \images\news_2023-03-15_19.jpg | https://www.nexperia.com/about/news-events/press-releases/Nexperia-introduces-in-vehicle-network-ESD-protection-portfolio-for-24-V-Board-net-systems.html | nexperia.com |
| Electronics Manufacturer Acquired | BMZ Group is pleased to announce the acquisition o... | 11249 | Industry News | Electronics Manufacturer Acquired | BMZ Group is pleased to announce the acquisition of VISATRONIC GmbH in the form of a strategic investment. The manufacturer of electronic flat modules, located in Mainhausen, Germany, has been a supplier to BMZ Group for many years. Effective March 1st, 2023, BMZ Holding GmbH has taken over the Mainhausen-based company VISATRONIC. The manufacturer of complete electronic flat modules (electronic manufacturing services - EMS) produces individually on behalf of customers and has already been a valued supplier of the globally operating battery manufacturer for years. The takeover of the economically very well positioned company, which can look back on a steady, organic growth since its foundation and was able to record 2022 as the best year in its company history, offers immense synergies for both sides. Both sides make a point of maintaining the economic independence of VISATRONIC GmbH. BMZ will integrate its supplier into the group in order to increase the security of supply. VISATRONIC, for its part, will benefit in return from a gigantic network expansion, particularly on the global stage, especially with regards to opportunities in purchasing, sales and expansion of production capacities. The management, which has been in the hands of the Gebauer brothers since 2000, will remain contractually secured for at least three more fiscal years. Beyond that, no fundamental changes are planned for existing customers and employees. | 03.03.2023 11:00:00 | Mar | news_2023-03-15_7.jpg | \images\news_2023-03-15_7.jpg | https://www.bmz-group.com/index.php/en/news/press-en | bmz-group.com |
| Planar Transformer Series Engineered for High Frequency, Smaller Space DC-DC Conversion Designs | Bourns introduced its Model PLN0xx-ED21 Series Pla... | 11257 | Product Release | Planar Transformer Series Engineered for High Frequency, Smaller Space DC-DC Conversion Designs | Bourns introduced its Model PLN0xx-ED21 Series Planar Transformers with the advanced features needed to meet today's high frequency, smaller space power conversion application requirements. These forward converter transformers are designed to deliver high volumetric power density, low loss and efficiency in a compact, low-height profile design. Bourns® Model PLN0xx-ED21 Series Planar Transformers also are designed for greater reliability due to their enhanced thermal conduction and heat dissipation properties. The advent of planar-style transformer components increases design flexibility and offers efficiency and power density advantages over conventional wirewound transformer designs due to reduced AC resistance losses. Providing from 48 watts up to 70 watts of output power in applications with input voltages ranging from 33 to 57 VDC and a switching frequency of 250 kHz, Model PLN0xx-ED21 Series planar transformers have low leakage inductance from 0.29µH to 0.60 µH and a volt-second time of 81.6 (V-µsec). The series offers 33 V to 57 V input voltage, 5 V to 12 V output voltage at 4 to 14 A output with various turns ratios. These features and their compact design make Bourns® Model PLN0xx-ED21 Series planar transformers ideal power conversion solutions for high density industrial power systems, low profile Switched-Mode Power Supplies (SMPS), LED lighting applications, Battery Management Systems (BMS), PoE applications, and many other forward transformer applications. These planar transformers from Bourns use standard PWB material for the transformer windings, soldered to an SMT header to create a simple-to-use, surface mount component that helps ease assembly. | 02.03.2023 10:30:00 | Mar | news_2023-03-15_15.jpg | \images\news_2023-03-15_15.jpg | https://www.bourns.com/news/press-releases/pr/2023/03/02/bourns-introduces-high-efficiency-planar-transformer-series-engineered-for-high-frequency-smaller-space-dc-dc-conversion-designs | bourns.com |
| Building HQ and GaN-on-SiC Epiwafer Production Facility | SweGaN is to build a headquarters including a high... | 11246 | Industry News | Building HQ and GaN-on-SiC Epiwafer Production Facility | SweGaN is to build a headquarters including a high-capacity semiconductor production facility in Linköping. The facility will be built at the Innovative Materials Arena (IMA), a cluster for innovative materials located in Linköping in Östergötland – a region renowned for its progressive materials industries. Completion of the project is planned for the end of second-quarter 2023 with deployment of the company’s manufacturing processes to produce GaN-on-SiC engineered epiwafers in high volume to achieve economies of scale. The facility has been designed to accommodate production capacity up to 40,000 100mm/150mm epiwafers per year. This significant scaling initiative is backed by a Series A financing round announced in September 2022, and is closely aligned with the accelerated global demands for GaN-on-SiC epiwafers used in 5G base-stations, defense radars, low-orbit satellite communications, and power switches for electric vehicles (EVs). “A new order is being established for semiconductor supply chains, and we are striving to be a go-to strategic partner for our customers in this new era,” says CEO Jr-Tai Chen. “Harnessing the challenges and opportunities associated with the new era of semiconductor manufacturing, SweGaN’s vision has become clearer than ever – to build a sustainable, smart and green manufacturing for the materials that can enhance connectivity, security, and mobility of the future.” | 02.03.2023 09:00:00 | Mar | news_2023-03-15_4.jpg | \images\news_2023-03-15_4.jpg | https://swegan.se/2811/ | swegan.se |
| AC-DC Active Bridge Rectifier Solution | Alpha and Omega Semiconductor introduced an extens... | 11255 | Product Release | AC-DC Active Bridge Rectifier Solution | Alpha and Omega Semiconductor introduced an extension to its active bridge driver, AlphaZBL™ family. Available in an SOP-8L package, the AOZ7203AV is a self-powered dual driver IC for driving external high-voltage MOSFETs to replace two low-side diodes of bridge rectifier. The device is suitable for use in adapters for high-end laptops and televisions, as well as power supplies for Desktops, Game Consoles, and Servers. The AOZ7203AV features a high withstand voltage, a self-powered Vcc supply from the AC line, ultra-low operation current, and X-capacitor discharge (CB safety certified). A break-before-make circuit avoids the overlap of two gate driving while driving the low-side high voltage MOSFETs in an active bridge rectifier circuit. With an input voltage of up to 600V, the AOZ7203AV has a wide operating (-40°C to +125°C) ambient temperature range and driving low RDSON HV MOSFETs to gain more efficiency improvement of AC power supply. These features make the AOZ7203AV an optimal solution for efficient replacement of lossy diodes in the bridge rectifier circuit of an AC-DC power supply. | 02.03.2023 08:30:00 | Mar | news_2023-03-15_13.jpg | \images\news_2023-03-15_13.jpg | https://aosmd.com/sites/default/files/2023-03/AOS_7203AV_PR_2.pdf | aosmd.com |
| Acquisition of Canadian Gallium Nitride Pioneer | Infineon Technologies and GaN Systems announced th... | 11243 | Industry News | Acquisition of Canadian Gallium Nitride Pioneer | Infineon Technologies and GaN Systems announced that the companies have signed a definitive agreement under which Infineon will acquire GaN Systems for US$830 million. “GaN technology is paving the way for more energy-efficient and CO 2-saving solutions that support decarbonization. Adoption in applications like mobile charging, data center power supplies, residential solar inverters, and onboard chargers for electric vehicles is at the tipping point, leading to a dynamic market growth,” said Jochen Hanebeck, CEO of Infineon. “The planned acquisition of GaN Systems will significantly accelerate our GaN roadmap, based on unmatched R&D resources, application understanding and customer project pipeline. Following our strategy, the combination will further strengthen Infineon’s leadership in Power Systems through mastery of all relevant power technologies, be it on silicon, silicon carbide or gallium nitride.” Jim Witham, CEO of GaN Systems, said: “The GaN Systems team is excited about teaming up with Infineon to create highly differentiating customer offerings, based on bringing together complementary strengths. With our joint expertise in providing superior solutions, we will optimally leverage the potential of GaN. Combining GaN Systems’ foundry corridors with Infineon’s in-house manufacturing capacity enables maximum growth capability to serve the accelerating adoption of GaN in a wide range of our target markets. I am very proud of what GaN Systems has accomplished so far and cannot wait to help write the next chapter together with Infineon. As an integrated device manufacturer with a broad technology capability, Infineon enables us to unleash our full potential.” | 02.03.2023 06:00:00 | Mar | news_2023-03-15_1.png | \images\news_2023-03-15_1.png | https://www.infineon.com/cms/en/about-infineon/press/press-releases/2023/INFXX202303-073.html | infineon.com |
| Integrated GaN System-in-Package for USB-C PD Adapters and Other Low Power Applications | Transphorm and Weltrend Semiconductor announced th... | 11259 | Product Release | Integrated GaN System-in-Package for USB-C PD Adapters and Other Low Power Applications | Transphorm and Weltrend Semiconductor announced the release of their first GaN System-in-Package (SiP). The WT7162RHUG24A is an integrated circuit designed for use in 45 to 100 watt USB-C PD power adapters charging smartphones, tablets, laptops, and other smart devices. It offers peak power efficiency of greater than 93%. “The WT7162RHUG24A is the industry’s first publicly announced SiP using Transphorm GaN. It enables manufacturers to develop a less expensive system solution given fewer components are required and a smaller PCB can be used among other advantages. It also reduces system development time. Effectively, we’re removing design barriers for adapter manufacturers,” said Tony Lin, President, Weltrend. “Notably, this product also allows Weltrend to move into a new market. It is the first-ever SiP for our PWM controllers, validating our commitment to supporting high volume growth sectors. And, with the integration of the GaN FET, we’ve raised the level of performance output. A win for Weltrend, Transphorm, and our mutual customers.” “The adapter fast charger market is a fast growing segment for GaN adoption today. We are gaining market share and continue to innovate, most recently with this GaN SiP, which allows for even easier use of our GaN devices,” said Primit Parikh, President and COO, Transphorm. “We’re excited to integrate our industry leading SuperGaN platform with Weltrend’s innovative adapter power controller technology. Weltrend has delivered a leading power conversion platform which creates a simple-to-use solution for adapter/fast charger customers that both companies can use to accelerate wins in this market.” | 01.03.2023 12:30:00 | Mar | news_2023-03-15_17.png | \images\news_2023-03-15_17.png | http://www.weltrend.com/en-global/news/detail/762/30 | weltrend.com |
| Silicon Carbide Power Modules Selected for 800V Inverter | British engineering and technology pioneer McLaren... | 11244 | Industry News | Silicon Carbide Power Modules Selected for 800V Inverter | British engineering and technology pioneer McLaren Applied has selected STMicroelectronics as a key supplier of silicon carbide (SiC) power modules for its IPG5 800V inverter. Electric vehicle (EV) powertrain technology increasingly relies on a reliable supply of quality SiC semiconductors such as MOSFETs, especially in 800V architectures. In choosing ST’s SiC, McLaren Applied aims to secure a solid and regular power electronics supply chain for McLaren Applied as it ramps up production and commercialisation of its IPG5 inverter for OEMs and Tier 1 partners. In the last six months, McLaren Applied has finalised powertrain agreements with American hybrid sports car marque Czinger and in-wheel motor specialists Elaphe for the supply of its IPG5 inverter, with a host of other mid- and high-volume EV models expected to be announced in the near future. At just 3.79L in size and weighing 5.5kg, IPG5 can extend an EV’s range by over 7%. Derived from decades of innovation in top tier automotive and motorsports applications, McLaren Applied’s IPG5 is highly controllable, offering variable switching frequencies and unparalleled motor response. The variability in switching frequency up to 32kHz enables engineers to use a faster, more efficient, and lightweight drivetrain. McLaren Applied’s IPG5 leverages the ST ACEPACK™ DRIVE power module based on third generation 1200V SiC MOSFET technology. | 01.03.2023 07:00:00 | Mar | news_2023-03-15_2.jpg | \images\news_2023-03-15_2.jpg | https://www.mclarenapplied.com/news/mclaren-applied-selects-stmicroelectronics-to-supply-silicon-carbide-power-modules | mclarenapplied.com |
| High Power Density 700W Power Supplies for Medical and Industrial Applications | COSEL announced the introduction of its open-frame... | 11260 | Product Release | High Power Density 700W Power Supplies for Medical and Industrial Applications | COSEL announced the introduction of its open-frame high power density, 700W, 3x5 inch power supply optimized for efficient cooling for use in demanding medical and industrial applications. Based on the robust platform with optimized thermal conduction, the GHA700F delivers 700W within a 3”x5” industry footprint. With a power density of 31.1W per cubic inch it’s one of the highest power density power supplies in its category for powering medical and industrial applications. The GHA700F is designed in accordance with safety standard IEC 60601-1, making it suitable for Body Floating medical applications but its high isolation and creepage distance make it eminently suitable for demanding industrial applications, complying with EN61558-2-16 (OVC III) and simplifying design to conform to EN60335. To power a large range of systems-bus-voltages the GHA700F is available in four output voltages, 24, 30, 48 and 56VDC and has a universal input voltage of 85 to 264VAC. Using the latest power switching topology and components, the GHA700F boasts an excellent efficiency figure of up to 96%. With the growing number of medical applications operating in low noise environments, equipment manufacturers are optimizing equipments to operate with limited airflow. To meet such requirements, power supplies must be design-optimized to combine conduction and convection cooling, offering systems designers the possibility to best optimize the placement of the power supply, without compromising performance. | 28.02.2023 13:30:00 | Feb | news_2023-03-15_18.jpg | \images\news_2023-03-15_18.jpg | https://www.coseleurope.eu/Products/AC-DC/GHA | coseleurope.eu |
| DC-DC Step-Up Converter for Efficient Energy Harvesting Applications | Asahi Kasei Microdevices (AKM) has launched a DC-D... | 11258 | Product Release | DC-DC Step-Up Converter for Efficient Energy Harvesting Applications | Asahi Kasei Microdevices (AKM) has launched a DC-DC step-up converter with ultra-low power consumption that is able to boost low voltages, offering solutions for remote and battery-free operation as well as low-maintenance applications in the fields of asset monitoring and IoT. The AP4473 is a DC-DC step-up converter featuring the capability of boosting an input voltage of as low as 15 millivolts (mV) while maintaining an ultra-low power consumption of only 26 nanoamperes (nA). This single-chip solution allows electricity generation from a minimal thermal energy source, such as body heat, while enabling overcharge prevention and power supply control with minimal energy consumption. In addition to the boost circuit, the device incorporates a PMOS switch and two hysteresis comparators. The switch disconnects the energy storage devices, such as capacitors, from the system, while its comparators automatically start and stop supplying power to the system. This makes it possible to configure a power supply unit in an energy harvesting system with a minimal number of passive elements, contributing to size and cost reductions for the overall system. The AP4473 is suitable for applications in beacons for asset tracking and asset monitoring, environmental monitoring and IoT sensor nodes, as well as smartcards or IoT devices. | 28.02.2023 11:30:00 | Feb | news_2023-03-15_16.jpg | \images\news_2023-03-15_16.jpg | https://www.akm.com/eu/en/about-us/news/2023/20230131-ap4473/ | akm.com |
| Strengthening Sustainable Battery Industry ‘Made in Germany’ | Setting a sustainable course for the future of the... | 11248 | Industry News | Strengthening Sustainable Battery Industry ‘Made in Germany’ | Setting a sustainable course for the future of the German battery industry: The Customcells company is investing tens of millions in the expansion of its Itzehoe site in Schleswig-Holstein, Germany. The production team on site will be tripled. With more research and innovation as well as joint process development, the specialists for application-specific premium battery cells are boosting Germany’s path to becoming an international market leader for green high-performance technology,enabling the mobility revolution thanks to holistic electrification on the road, on water and in the air. “With the expansion in Itzehoe and the investments we are making here, we are also making a commitment: We believe in Germany as a location for a successful battery industry. We are literally energizing ‘Made in Germany’ – sustainable, innovative, high-performance, high-tech," Dr. Dirk Abendroth, CEO of the Customcells Group, said while laying the groundwork for the company’s expansion at its site in Itzehoe. The experts for premium battery cells are investing tens of millions for the buildings on site alone. During this time, the total number of employees will double. German and European politicians have recently expressed concerns that the US government’s Inflation Reduction Act (IRA) could have consequences for the development of the battery industry in Germany. | 28.02.2023 10:00:00 | Feb | news_2023-03-15_6.jpg | \images\news_2023-03-15_6.jpg | https://www.customcells.org/news/customcellsr-news/detail/investing-in-location-customcells-strengthens-sustainable-battery-industry-made-in-germany-1/ | customcells.org |
| Virtual Fab Underpins Strategies to Reduce the Carbon Footprint | imec presents a quantitative assessment of the env... | 11245 | Industry News | Virtual Fab Underpins Strategies to Reduce the Carbon Footprint | imec presents a quantitative assessment of the environmental impact of patterning in advanced IC manufacturing. A virtual fab has been developed in the imec.netzero modeling platform. The resulting analysis enables imec and its partners to assess current manufacturing choices, identify areas of focus, and project the future. In imec’s physical fab, environmentally friendly process solutions are explored for the high impact areas, which include the reduction of fluorinated etch gases, maximizing EUV scanner throughput, and reducing hydrogen and water consumption. CO2 emissions associated with IC manufacturing are expected to quadruple in the next decade, due to both the increasing complexity of advanced technologies and the projected growth of the total volume of wafers produced. To counter this scenario, leading semiconductor players have committed to becoming carbon neutral or net-zero by 2030-2050. In that context, imec launched its Sustainable Semiconductor Technologies and System (SSTS) program, gathering the supply chain to jointly target net-zero emissions for chip manufacturing. One of the goals of SSTS is to offer the industry a unique bottom-up approach that provides actionable data with a high granularity enabling impact assessment during process and flow development. | 28.02.2023 08:00:00 | Feb | news_2023-03-15_3.jpg | \images\news_2023-03-15_3.jpg | https://www.imec-int.com/en/press/imecs-virtual-fab-underpins-strategies-reduce-carbon-footprint-lithography-and-etch-process | imec-int.com |
| Common Mode Choke Inductor | Vanguard Electronics, under the iNRCORE Family of ... | 11264 | Product Release | Common Mode Choke Inductor | Vanguard Electronics, under the iNRCORE Family of Brands, is pleased to announce its XTCMN5 Series Common Mode Choke Inductors, the latest addition to Vanguard’s growing High Temperature product line. The XTCMN5 Series Common Mode Choke Inductors have been designed to operate in extreme environments and work in frequency ranges from 100KHz to 600KHZ+ making them ideal parts for GaN based power supplies as well as traditional switching supplies. These parts feature a compact low profile making it ideal for automatic placement as well as demands of high shock and vibration. Different electrical values and termination finishes are available. “Many of our high end industrial, military, and aerospace markets need high power densities in a smaller package” says Jason Finley, President of Vanguard Electronics. “Vanguard is continuing to meet these needs with this latest common mode choke inductor series. Compared to the competition, the Vanguard XTCMN series provides better performance in a smaller package size. More sizes and ratings will be following this first series.” XTCMN5 Series Common Mode Choke Inductor’s operate over an impressive temperature range of -55° to 200 Celsius. This series has an inductance range of 110uH to 4.9mH and is able to handle 0.55A to 4.9A in a self-shielding nanocrystalline toroidal core. The inductor’s overload current is one-and-a-half times its rated current. The inductors are designed to serve military, high end industrial, extreme temperatures, and aerospace markets as well as anywhere noise suppression is needed. | 27.02.2023 17:30:00 | Feb | news_2023-03-15_22.jpg | \images\news_2023-03-15_22.jpg | https://inrcore.com/product/power/ | inrcore.com |
| High Reliability Alloy for Automotive Applications | Heraeus Electronics is pleased to announce the rel... | 11262 | Product Release | High Reliability Alloy for Automotive Applications | Heraeus Electronics is pleased to announce the release of its Microbond® SMT660 Innolot® 2.0 no-clean printing T4 solder paste. The solder paste provides a competitive TCO offering. Based on Heraeus Electronics’ proven experience, Innolot 2.0 allows a wide process window, enabling soldering in air with a low defect rate. Additionally, it is designed to offer an optimized formulation for lower costs. With its approach through Microbond® SMT660 Innolot® 2.0 for highly reliable and cost-effective solder alloys for automotive applications, Heraeus Electronics introduces the ability to maintain a competitive Total-Cost-of-Ownership, while fulfilling emerging requirements. The next generation of Innolot® alloy offers reduced cost while maintaining the well-known features of higher creep resistance, resulting in longer product life cycles at higher operating temperatures. The Microbond® SMT660 Innolot® 2.0 solder paste performs in the air without additional N2 during reflow, while keeping defect rates low, reducing your TCO. The flux Microbond® SMT660 uses an acrylic based synthetic resin eliminating potential batch-to-batch variations when using natural raw materials. Due to its low impurities and the flux design, a high SIR performance is achieved. As a result, SMT 660 reduces the risk for electrochemical migration. The combination of the flux with Innolot® or Innolot® 2.0 alloy delivers a solder paste with superior reliability – especially in miniaturized systems in the automotive industry. | 27.02.2023 15:30:00 | Feb | news_2023-03-15_20.png | \images\news_2023-03-15_20.png | https://www.heraeus.com/en/het/products_and_solutions_het/solder_materials/innolot/innolot_page.html | heraeus.com |
| APEC Industry Session Explores Dynamic Markets | The PowerSources Manufacturers Association (PSMA) ... | 11252 | Event News | APEC Industry Session Explores Dynamic Markets | The PowerSources Manufacturers Association (PSMA) Marketing Committee is organizing an Industry Session at APEC 2023 addressing the industry trends within fast growing market sectors impacting the power electronics industry. The session is targeted primarily towards professionals in marketing, sales, and business development. However, power electronics design and application engineers, professors and students will also benefit from learning about the context for their designs and how to prepare for the future. The session will take place on Wednesday afternoon, March 22nd, 2023, from 1:30 - 4:45 p.m. in Room W202BC at the Orange County Convention Center in Orlando, FL. Ada Cheng and Dinesh Kithany, Co-Chairs of the Industry Trends Industry Session, commented “We are excited that the PSMA Marketing Committee is again organizing this year’s Industry Trends Driving Power Electronics Industry Session. This cohesive session features knowledgeable and respected representatives from industry who will focus on issues that impact the future growth of key industry market segments.” Ada and Dinesh encourage everyone to register for APEC and attend this valuable industry session and to consider participating in the other PSMA-sponsored Industry Sessions during the week. | 23.02.2023 14:00:00 | Feb | news_2023-03-15_10.jpg | \images\news_2023-03-15_10.jpg | https://www.apec-conf.org/conference/sessions/industry/ | apec-conf.org |
| LCC Design Tool Enables Highly Efficient LED Driver Design | Infineon Technologies introduces the LCC design to... | 11236 | Product Release | LCC Design Tool Enables Highly Efficient LED Driver Design | Infineon Technologies introduces the LCC design tool, aiming to make a highly efficient yet complex design topology such as PFC plus LLC accessible to a broad LED driver manufacturer community at no additional cost. PFC plus LCC topology is 5 to 6 percent more efficient than other commonly used two-stage topologies. However, the design of LED drivers with this topology is highly time-consuming. Infineon's LCC tool, which is a novelty in the market, makes the design work much faster and easier. "Our LCC design tool offers a streamlined solution for designers to deploy highly efficient and reliable PFC plus LLC solutions in reduced time and effort, bypassing a time-consuming iterative design approach," said Hakan Yilmazer, Head of Application Management Lighting at Infineon Technologies. "Assuming that 300 million LED drivers with an average power of 60 W were converted from less efficient topologies to PFC plus LCC topology, the energy produced by one large coal power plant with a capacity of 1000 MW could be saved per year. This is now possible with the support of Infineon's LCC tool as well as the broad portfolio of suitable controllers and power switches." | 23.02.2023 09:30:00 | Feb | news_2023-03-01_13.jpg | \images\news_2023-03-01_13.jpg | https://www.infineon.com/cms/en/about-infineon/press/market-news/2023/INFPSS202302-066.html | infineon.com |
| Global Distribution Agreement Announced | Vicor announced its distribution agreement with Av... | 11229 | Industry News | Global Distribution Agreement Announced | Vicor announced its distribution agreement with Avnet, which expands access to Vicor's power modules through Avnet's design and supply chain, enabling global customers to achieve innovation with higher system performance and greater scalability. "This is a great opportunity for Vicor to partner with a global leader aligned with Vicor's target markets," said David Krakauer, VP Industrial Business Unit and Corporate Marketing. "Working with Avnet will better position Vicor to bring our highly differentiated modular power solutions to customers who wish to unleash the power of their own innovations." "In today's markets, businesses need to innovate to stay ahead of the competition," said Peggy Carrieres, Global Vice President Supplier Development for Avnet. "This agreement comes at a time when many of our customers are looking for opportunities to separate themselves from the pack. They are struggling to fit more power in increasingly smaller spaces, and they are searching for power-dense and highly efficient solutions. Vicor power modules will deliver a quality solution for our customers." The global franchise agreement is effective immediately. Customers in the EMEA region (Europe, Middle East & Africa) will have access to the Vicor product portfolio via Avnet's European business unit, Avnet Abacus, an interconnect, passive, electro-mechanical and power distributors. | 22.02.2023 11:00:00 | Feb | news_2023-03-01_6.jpg | \images\news_2023-03-01_6.jpg | https://www.vicorpower.com/press-room/avnet | vicorpower.com |
| Reference Designs Reduce Energy Waste in Power Supplies and Battery Chargers | Pulsiv OSMIUM microcontrollers and AC to DC front-... | 11263 | Product Release | Reference Designs Reduce Energy Waste in Power Supplies and Battery Chargers | Pulsiv OSMIUM microcontrollers and AC to DC front-end circuit configurations are already available and now to accelerate R&D, the first in a series of reference designs has been officially launched to the market. The reference designs offer 75W (85W peak) & 100W (150W peak) output power with universal mains input and 48V output. The Pulsiv OSMIUM microcontroller and supporting components have been combined with a quasi-resonant flyback DC-DC converter to deliver an end-to-end flat efficiency of 90% (91.5% peak) from just 10W, comfortably exceeding the US DoE Level VI and EU CoC Tier 2 requirements. These reference designs can be further optimised using GaN and SiC technology where performance or size are more important than cost. Pulsiv OSMIUM ensures that critical components operate at low temperatures to extend expected lifetime and ensure long-term reliability even under convection cooling. Inrush current has been completely eliminated, removing the need for additional current limiting components. Manufacturers of industrial power supplies and LED lighting solutions can benefit further by simplifying designs and improving system installations. Explains CEO Darrel Kingham: “Tackling the global energy crisis and delivering ambitious sustainability targets will require the electronics industry to embrace technology innovation and challenge conventional thinking. Pulsiv OSMIUM reference designs offer a cost effective method to reduce the amount of energy consumed in AC to DC power supplies and battery chargers under all operating conditions. By delivering consistently high efficiency without compromising system cost, sustainable product design will become the default choice.” | 21.02.2023 16:30:00 | Feb | news_2023-03-15_21.jpg | \images\news_2023-03-15_21.jpg | https://pulsiv.co.uk/news/reference-designs/ | pulsiv.co.uk |
| Expanded AC-DC Converter Offering | Bel Power Solutions announced its AC-DC converter ... | 11237 | Product Release | Expanded AC-DC Converter Offering | Bel Power Solutions announced its AC-DC converter series designed for industrial control equipment, machinery, and harsh environment applications. The series features cost-effective, energy efficient power supplies with standard DIN-rail mounting. LEC480 series has excellent EMC performance and is compliant with international IEC/EN/UL 62368, and UL 61010 safety standards. The products offer a high level of stability and immunity to noise for industrial control equipment, machinery, and other industrial applications in a variety of harsh environments. The AC-DC converters are available with output voltages of 12 V, 24 V, or 48 V (adjustable) with up to 480 watts of output power and an input voltage range of 85 - 264 VAC (universal) or 120 - 370 VDC. With efficiency up to 94%, the series has an operating ambient temperature range -30°C to +70°C. | 21.02.2023 10:30:00 | Feb | news_2023-03-01_14.jpg | \images\news_2023-03-01_14.jpg | https://www.belfuse.com/news-detail/bel-power-solutions-expands-ac-dc-converter-offering | belfuse.com |
| Current Sensor for High-Power EV Traction Inverters | Distance and speed of charging are vital in the co... | 11234 | Product Release | Current Sensor for High-Power EV Traction Inverters | Distance and speed of charging are vital in the competitive EV sector and, like all vehicle components, high-power integrated traction inverters – which convert DC into AC and capture energy for the vehicle – need to combine superior performance with being as small and light as possible. Measuring just 29mm x 21mm x 12mm and weighing 27g, LEM's new HSTDR current sensor is significantly more compact than a traditional C-core sensor, making it much easier to be integrated into space-limited inverter boxes. The sensor enables traction inverters to operate at maximum efficiency by combining high accuracy with affordability and the ability to operate in demanding environments (the sensor has an operating range of -40°C to +125°C and is robust enough to cope with vibrations up to 10G). Using open loop Hall effect technology and an innovative magnetic core design, the HSTDR offers excellent immunity against external field and cross talk as well as consistent behaviour over frequency with little part-to-part phase shift dispersion, ensuring more accurate torque control. What makes the sensor unique is not only that it is 42% smaller than its predecessor (LEM's HSNDR) but also weighs 50% less and offers 50% greater measuring range, as well as best-in-class accuracy and a global error over temperature and lifetime below 3.5%. Giving EV manufacturers the choice of having different current measuring ranges in the same housing – from ±300 A up to ±1500 A – the sensor ensures galvanic separation between the primary circuit (high power) and the secondary circuit (electronic circuit), which is also suitable for 800V battery systems. | 21.02.2023 07:30:00 | Feb | news_2023-03-01_11.jpg | \images\news_2023-03-01_11.jpg | https://www.lem.com/en/hstdr | lem.com |
| Pierre-Francois Allaire Appointed Executive General Manager | Jean Bélanger, CEO and CTO, and Lise Laforce, Exec... | 11225 | People | Pierre-Francois Allaire Appointed Executive General Manager | Jean Bélanger, CEO and CTO, and Lise Laforce, Executive Vice President of OPAL-RT TECHNOLOGIES, are pleased to announce Pierre-François Allaire as the newly appointed Executive General Manager, effective March 15, 2023. As EGM, Pierre-François will lead all departments and take ownership of daily operations at the company. Jean Bélanger will continue as President and CTO to ensure technology remains the backbone of OPAL-RT's global strategy. Pierre-Francois holds a bachelor's degree in electrical engineering and an MBA. He has more than 19 years of experience within OPAL-RT, including 18 years leading sales and marketing, operations, and support. His 360° vision and in-depth understanding of the business, OPAL-RT's products, and the market have enabled him to play a decisive role in the company's growth and performance, both locally and internationally. "I have been working at OPAL-RT for the past 20 years and I fell in love with HIL simulation right from the get-go. Today, at 43 years old, I've taken a moment to appreciate what an honor it's been to work and learn at OPAL-RT and make it my home and my family" said Pierre-François Allaire, Sales and Marketing Vice President of OPAL-RT TECHNOLOGIES. "What Jean Bélanger and Lise Laforce have built is truly incredible and I am proud to be part of a company that stimulates innovation and promotes Quebec engineering worldwide. I will bring all my energy to this new position and am fully committed to carrying out OPAL-RT's mission and vision." | 21.02.2023 07:00:00 | Feb | news_2023-03-01_2.jpg | \images\news_2023-03-01_2.jpg | https://www.opal-rt.com/news/notice-of-appointment-pierre-francois-allaire-executive-general-manager/ | opal-rt.com |
| Sales Partnership Expands International Sales Channels | New sales opportunities for Isabellenhütte: Digi-K... | 11231 | Industry News | Sales Partnership Expands International Sales Channels | New sales opportunities for Isabellenhütte: Digi-Key Electronics is a global electronic distributor and since October 2022 has offered customers the complete Isabellenhütte range of precision measurement solutions plus precision and power resistors. This collaboration with global reach is between the Isabellenhütte USA subsidiary and Digi-Key Electronics. This distributor offers the entire catalog of standard products from Isabellenhütte, including components for battery management systems, power grids, vehicle electrification, drones and unmanned aircraft, space applications, industrial plants, household appliances and medical equipment. Isabellenhütte's measurement solutions are in demand wherever there is a need for compliance and precise monitoring of strict power limits in innovative designs. "Signing a partnership with one of the world's largest distributors of dispatch-ready electronic components is a huge step forwards for our company", says Uwe Keller, Managing Director of Isabellenhütte USA. "Our customers will benefit from Digi-Key's established supply chains. This will allow us to significantly expand our market presence and offer customers greater reliability and improved service." The distributor sees Isabellenhütte's products as an asset in the Digi-Key marketplace. Thanks to extensive experience in metallurgy, Isabellenhütte is able to develop high-quality products with excellent vertical integration, helping customers produce cutting-edge technology. | 20.02.2023 13:00:00 | Feb | news_2023-03-01_8.jpg | \images\news_2023-03-01_8.jpg | https://www.isabellenhuette.de/en/ | isabellenhuette.de |
| Jonas Mühlethaler Appointed CTO | Frenetic introduces Dr. Jonas Mühlethaler, from Sw... | 11227 | People | Jonas Mühlethaler Appointed CTO | Frenetic introduces Dr. Jonas Mühlethaler, from Switzerland as CTO of Magnetics. He was the founder of Gecko Magnetics with a group of colleagues of ETH at Zurich and author of publications about Winding Losses for Magnetics. Frenetic started collaborating with Jonas as an external advisor a few months ago. During this time, he has led the development of a Frenetic Model of AC losses, which provides a much faster and more accurate response than FEM simulation of the winding losses. He will now support Frenetic in their development as reference for Magnetics design. | 20.02.2023 09:00:00 | Feb | news_2023-03-01_4.jpg | \images\news_2023-03-01_4.jpg | https://frenetic.ai/ | frenetic.ai |
| Expanding Silicon Carbide and Silicon Capacity in Colorado | Microchip Technology announces plans to invest $88... | 11228 | Industry News | Expanding Silicon Carbide and Silicon Capacity in Colorado | Microchip Technology announces plans to invest $880M to expand its silicon carbide (SiC) and silicon (Si) production capacity at its Colorado Springs, Colo. manufacturing facility over the next several years. One significant phase of the expansion is to develop and upgrade its 50-acre, 580,000-square-foot Colorado Springs campus for increased SiC manufacturing for use in automotive/E-Mobility, grid infrastructure, green energy, and aerospace and defense applications. The Colorado Springs campus currently employs more than 850 people and produces products from 6-inch wafers. The manufacturing technology that Microchip is installing will run on 8-inch wafers, which will significantly increase the number of chips produced at this location. The additional 400 jobs anticipated at the facility will range from production specialists to technical roles in equipment procurement and management, process control and test engineering. "With over two-decades of investment in silicon carbide, Microchip's portfolio is designed to provide our customers with innovative power solutions," said Rich Simoncic, senior vice president of Microchip's Analog businesses. "This campus is an integral part of producing our SiC technology to assure our customers with supply certainty as they transition to SiC solutions." | 17.02.2023 10:00:00 | Feb | news_2023-03-01_5.jpg | \images\news_2023-03-01_5.jpg | https://www.microchip.com/en-us/about/news-releases/corporate/microchip-plans-to-invest-880-million-to-expand-its-silicon | microchip.com |
| High Power Linear Rack & Benchtop Power Supplies | Acopian launched their high power linear Infinity ... | 11240 | Product Release | High Power Linear Rack & Benchtop Power Supplies | Acopian launched their high power linear Infinity Rack and Benchtop power supplies rated up to 1200W. DC single/nominal output voltages range from 3.3VDC to 150VDC and up to 150A (1200W). All voltages are available in 2U, 3U and 4U high configurations. These linear power supplies are highly configurable. Standard features include, but are not limited to remote sensing, open sense protection, isolated output, internal EMI filtering, no minimum load requirements, short circuit and overload protection with enhanced surge capabilities, front panel AC input power switch with indicator, overtemp protection on heat sinks and thermostatically controlled fans. Optional features include selecting your desired AC input voltage, Voltage Output Adjust and Current Limit Adjustments, Inhibit or Enable, Voltage and Current Monitoring, Latching Overcurrent control, Ethernet/USB/RS232/RS485 Digital Interfaces, Output blocking protection diode, High Frequency pulsed load filtering, Series Operation Diode capability, Alarm with Relay Contacts Options, Front Panel Mounted LED Output Indicator, Temperature monitor, handles, chassis slides, Digital Voltage and Current Meters and more. Linear operation minimizes output noise so these power supplies are ideal for use in test equipment, analog systems, controls, medical, aviation and R&D applications. | 16.02.2023 13:30:00 | Feb | news_2023-03-01_17.jpg | \images\news_2023-03-01_17.jpg | https://www.acopian.com/single-l-infinity-rack-bench-m.html | acopian.com |
| ESD Protection Devices for a full spectrum of I/O Devices | Taiwan Semiconductor introduces the TESD Series of... | 11239 | Product Release | ESD Protection Devices for a full spectrum of I/O Devices | Taiwan Semiconductor introduces the TESD Series of ultra-low-capacitance ESD protection devices. The Series comprises a wide selection of SMD components, providing single and multiple, unidirectional and bidirectional versions, for I/O ports (USB 2.0, USB 3.0, HDMI), audio systems, power ports and a variety of other ESD protection applications. The low capacitance topology of the TESD Series provides protection at high frequency data rates while maintaining signal integrity. In I/O port applications, TESD Series devices meet regulatory requirements including repetitive application of IEC61000-4-2 (ESD) ±15kV (air), ±10kV (contact) and IEC61000-4-5 (Lightning): 5.5A (8/20µs). These devices also meet 30 KV contact/air requirements for power port applications. In addition, the Series meets all global environmental requirements. The devices' ultra-low capacitance is essential for ±3.3V or other nominal operating voltage applications operating at high data rates. The ESD protection devices ideally have little to no effect on normal operation while retaining the ability to survive repeated application of ESD discharges. "By using these high-performance protection devices, the ESD is absorbed and safely clamped– dissipated through the TVS diodes – preventing expensive damage and increasing the reliability and survivability of the end equipment," said Sam Wang, Vice President, TSC Products. "This is achieved while also providing margin on protection and signal integrity." | 16.02.2023 12:30:00 | Feb | news_2023-03-01_16.jpg | \images\news_2023-03-01_16.jpg | https://www.taiwansemi.com/en/product_search/esd-protection-ic | taiwansemi.com |
| Load Switches with Slew Rate Control | The GLF112x and GLF122x Series of 1A-rated load sw... | 11238 | Product Release | Load Switches with Slew Rate Control | The GLF112x and GLF122x Series of 1A-rated load switches feature an operating temperature range (40ºC to +85ºC), integrated slew rate control, low RON (52mO), ultra-low IQ (1nA) and ISD (10nA) at 5.5V VIN. Built on GLF's proprietary load switch technology, they boast package reducing board space and allowing engineers and architects to have fewer design constraints. Target applications include wearables, IoT, medical devices (e.g., hearing aids), true wireless stereo (TWS), mobile phones, contactless payment systems, Bluetooth low energy (BLE) and other low power sub-systems. GLF122x load switches also provide True Reverse Current Blocking (TRCB), designed to cut off current flow if the VOUT pin voltage exceeds VIN. "GLF112x/GLF122x expands GLF load switch product family by offering the smallest size in the industry," said Eileen Sun, President and CEO at GLF Integrated Power. "The low IQ and ISD of the GLF112x and GLF122x Families help designers to reduce parasitic leakage current, improve system efficiency and increase battery lifetime, improving the overall user experience." | 16.02.2023 11:30:00 | Feb | news_2023-03-01_15.jpg | \images\news_2023-03-01_15.jpg | https://glfipower.com/news/glf112x-glf122x-load-switch-industry-s-best-size-to-ron-ratio | glfipower.com |
| 300mm Smart Power Fab in Dresden | Infineon Technologies AG is starting construction ... | 11224 | Industry News | 300mm Smart Power Fab in Dresden | Infineon Technologies AG is starting construction of its plant for analog/mixed-signal technologies and power semiconductors. After extensive analysis, the Infineon Management Board and supervisory bodies gave the green light for the Dresden site. The German Federal Ministry for Economic Affairs and Climate Action (BMWK) has approved an early project launch, meaning that construction can already begin before completion of the inspection of legal subsidy aspects by the European Commission. Subject to the European Commission's state aid decision and the national grant procedure, the project is to be funded in accordance with the objectives of the European Chips Act. Infineon is seeking public funding of around one billion euros. The company plans to invest a total of approximately five billion euros in the plant, which is set to begin production in 2026. This constitutes the largest single investment in the company's history. "We're picking up the pace by expanding our production capacities in order to leverage the growth opportunities which the megatrends decarbonization and digitalization are offering us," says Infineon CEO Jochen Hanebeck. "We see structurally growing demand for semiconductors, for example for use in renewable energies, data centers and electro-mobility. By building the 300mm Smart Power Fab in Dresden we are establishing the prerequisites necessary to successfully meet the rising demand for semiconductor solutions." The plant will be closely linked with the Infineon Villach site as "One Virtual Fab". This manufacturing complex for power electronics based on highly efficient 300-millimeter technology will increase efficiency levels and give Infineon additional flexibility in order to supply its customers faster. | 16.02.2023 06:00:00 | Feb | news_2023-03-01_1.jpg | \images\news_2023-03-01_1.jpg | https://www.infineon.com/cms/en/about-infineon/press/press-releases/2023/INFXX202302-058.html | infineon.com |
| Prismatic Supercapacitor for Space-Constrained IoT and Batteryless Devices | CAP-XX has launched its DMV750 2.2mm prismatic 3V ... | 11242 | Product Release | Prismatic Supercapacitor for Space-Constrained IoT and Batteryless Devices | CAP-XX has launched its DMV750 2.2mm prismatic 3V supercapacitor to provide high performance for IoT, medical and other space-constrained and mission-critical electronic devices. This multi-purpose 3V prismatic supercap can support the industry's common 3V coin cell battery to extend its life and functionality, replace a bulky 3V cylindrical supercap to save design space, or replace batteries altogether when micro energy harvesting can extract enough solar, vibration, RF or other environmental energy to charge the ultra-efficient supercapacitor in sustainable batteryless devices. Packing 23% more energy than a 2.7-volt supercap in the same size package, the 3V, DMV750 supercap provides high peak pulse power to enable either batteryless or more battery-efficient applications. It measures 21 millimetres x 14 millimetres x 2.2 millimetres, and operates from -20°C to +85°C. "It is estimated that over 5 billion 3V coin cell batteries and 12 billion IoT devices are sold annually," explained Anthony Kongats, CEO at CAP-XX. "While not all devices will require a supercapacitor, a large number would benefit from using our powerful DMV750 supercapacitor to store and release the energy needed for peak power functions like data transmission." Kongats continued, "Our DMV750 ultra-thin prismatic 3V supercap provides design engineers with multiple options to overcome power delivery challenges in space-constrained, mission-critical and sustainable electronic devices." | 15.02.2023 15:30:00 | Feb | news_2023-03-01_19.jpg | \images\news_2023-03-01_19.jpg | https://www.cap-xx.com/cap-xx-launches-ultra-thin-3v-750mf-prismatic-supercapacitor-for-space-constrained-iot-and-batteryless-devices/ | cap-xx.com |
| Building Next Wafer Fab in Lehi, Utha | Texas Instruments announced plans to build its nex... | 11226 | Industry News | Building Next Wafer Fab in Lehi, Utha | Texas Instruments announced plans to build its next 300-millimeter semiconductor wafer fabrication plant (or fab) in Lehi, Utah. The fab will be located next to the company's existing 300-mm semiconductor wafer fab in Lehi, LFAB. Once completed, TI's two Lehi fabs will operate as a single fab. "This new fab is part of our long-term, 300-mm manufacturing roadmap to build the capacity our customers will need for decades to come," said Haviv Ilan, TI executive vice president and chief operating officer, and incoming president and chief executive officer. "Our decision to build a second fab in Lehi underscores our commitment to Utah and is a testament to the talented team there who will lay the groundwork for another important chapter in TI's future. With the anticipated growth of semiconductors in electronics, particularly in industrial and automotive, and the passage of the CHIPS and Science Act, there is no better time to further invest in our internal manufacturing capacity." The landmark $11 billion investment marks the largest economic investment in Utah history. The Lehi expansion will create approximately 800 additional TI jobs as well as thousands of indirect jobs. TI looks forward to strengthening its partnership with the Alpine School District and will invest $9 million to improve student opportunities and outcomes. | 15.02.2023 08:00:00 | Feb | news_2023-03-01_3.jpg | \images\news_2023-03-01_3.jpg | https://news.ti.com/texas-instruments-selects-lehi-utah-for-its-next-300-millimeter-semiconductor-wafer-fab | ti.com |
| Gallium Nitride Based 3-Phase Traction Inverter | VisIC Technologies successfully tested its 2.2m... | 11233 | Product Release | Gallium Nitride Based 3-Phase Traction Inverter | VisIC Technologies successfully tested its 2.2mΩ 650V half-bridge power module, consisting of 4 parallel 8mΩ Power FET, in a 3-phase configuration on a dyno-test-bench using a PMSM motor at a major automotive OEM. Thanks to this, VisIC Technologies has proven that their D<sup>3</sup>GaN (Direct Drive D-Mode Gallium-Nitride) semiconductor technology is well-suited even for the most challenging high-power automotive applications. Concerns about parallelization and oscillations caused by fast-switching transients have been addressed. The inverter phase current reached 350Arms (500A peak) at 400V, although test system set-up limitations prevented higher currents, which the 2.2mO Power Module is capable of. Worldwide Harmonized Light Vehicles Test Procedure (WLTP) driving cycle testing was executed and achieved comparable efficiency with commercial Silicon Carbide-based modules, despite using early non-optimized module prototypes. This means that D<sup>3</sup>GaN will deliver its promise of the highest efficiency, improving car costs through lighter, smaller power systems and a smaller battery size, without compromising the car's driving range. In addition, the D<<sup>3</sup>GaN technology, based on GaN-on-Silicon semiconductor process, is delivering better than Silicon Carbide (SiC) performance at the more competitive Silicon cost level. "With this great accomplishment, acknowledged by a leading automotive OEM, VisIC Technologies has provided overwhelming evidence for higher-efficiency at lower-cost future EV traction inverters, for the automotive world," said Dr. Tamara Baksht, CEO & Co-founder of VisIC technologies. "The automotive market demands high-power, high-voltage, high-reliability GaN, and our D<sup>3</sup>GaN die and module solutions are the answer." VisIC Technologies 3-phase prototype inverter system will be available for testing across additional customer sites towards the end of the 2nd quarter of 2023. | 15.02.2023 06:30:00 | Feb | news_2023-03-01_10.jpg | \images\news_2023-03-01_10.jpg | https://visic-tech.com/visic-technologies-paves-the-way-to-high-power-gan-traction-inverters-successfully-operating-a-bev-motor/ | visic-tech.com |
| AC-DC Power Supply Thermal Management Patent | TDK Corporation is pleased to announce that TDK-La... | 11232 | Industry News | AC-DC Power Supply Thermal Management Patent | TDK Corporation is pleased to announce that TDK-Lambda UK's Power Supply Apparatus patent application has been approved for grant by the UK Intellectual Property Office. The thermal strategy covered by the patent leads to power supplies that are flexible in their cooling requirements, keep audible noise to a minimum, and are easy for customers to integrate into their systems. "Thermal management is one of the main technical challenges to overcome in the design of any system," explains Martin Coates, Engineering Director, TDK-Lambda UK. "Very often, there are hot spots within systems that require a disproportionately high airflow over them to keep component temperatures within acceptable limits. This, in turn, often leads to excessive audible noise from fan cooling, and/or limitations in the system's thermal performance." There are two established techniques for overcoming the thermal management challenge. One method is to increase unit dimensions to allow for better airflow. Driving up efficiency is another technique, thereby minimising internal heat dissipation. Increasing unit size is often unacceptable, as units are seen as uncompetitive and excessively large, making them difficult to integrate into systems. Also, as power supply efficiencies increase, the law of diminishing returns applies, and incremental improvements become excessively expensive. Above all, both techniques come with an increased bill-of-material cost. The new thermal management strategy used in manufacturing the CUS400M series of AC-DC power supplies, covered by the patent, overcomes these issues by utilising existing system metalwork for cooling. Through careful PCB design and the use of thermally conductive plastics, the heat generated by the electronic components is spread and transferred into the system chassis. This means that good thermal performance can be achieved with substantially lower airflow, resulting in reduced audible noise from the slower fan. | 14.02.2023 14:00:00 | Feb | news_2023-03-01_9.jpg | \images\news_2023-03-01_9.jpg | https://www.emea.lambda.tdk.com/il/news/article/18912 | lambda.tdk.com |
| Test and Measurement Equipment from Oscilloscopes to Bench Power Supplies and Multimeters | RS Group has announced it has significantly expand... | 11250 | Industry News | Test and Measurement Equipment from Oscilloscopes to Bench Power Supplies and Multimeters | RS Group has announced it has significantly expanded the availability of its range of products from Keysight Technologies. Keysight offers a broad range of electronic test and measurement equipment for industrial applications. These include benchtop power measurement and supply, bench multimeters and accessories, oscilloscopes, signal generators and electronic loads, as well as handheld electrical test equipment. RS has been a long-term distribution partner of Keysight and during the past 18 months, RS has continued to grow its range of Keysight products by more than 600 new products and devices, now available across the EMEA area. RS and Keysight also work closely together across several areas of customer engagement including direct client contact and marketing communications programmes. A key product offering is Keysight's ‘Smart Bench Essentials’, which is a package of benchtop test equipment that includes a digital multimeter, power supply, function generator and oscilloscope, plus application software that quickly enables engineers to connect in unprecedented ways. Another key product is the InfiniiVision range of oscilloscopes that deliver leading-edge performance to enable the capture of rare anomalies and glitches with industry-leading waveform update rates or quickly isolate signal events using the range’s Zone Touch triggering capability. | 13.02.2023 12:00:00 | Feb | news_2023-03-15_8.png | \images\news_2023-03-15_8.png | https://uk.rs-online.com/web/b/keysight-technologies/ | rs-online.com |
| eBook Explores the Future in Automotive Design | Mouser Electronics announces an eBook in collabora... | 11230 | Industry News | eBook Explores the Future in Automotive Design | Mouser Electronics announces an eBook in collaboration with Qorvo, highlighting the technology innovations reshaping automotive design. In The Future of Automotive, subject matter experts from Qorvo and Mouser offer rich, practical analyses of technologies including on-board chargers (OBC) for electric vehicles. The automotive industry is currently experiencing a broad range of technological innovations. As automotive manufacturers invest in electric vehicle design, the way in which we power our vehicles is changing. At the same time, new technologies and components are enabling the design of the connected vehicle. These advanced automobiles contain more safety features than their predecessors, while also supporting a variety of new entertainment and information possibilities for those traveling as passengers. The Future of Automotive, the eBook from Mouser and Qorvo, offers a detailed collection of articles exploring the products and solutions underpinning these innovations. The eBook highlights product information for six specific Qorvo solutions, connecting automotive designers to the components that will enable the next generation of automobile designs. | 13.02.2023 12:00:00 | Feb | news_2023-03-01_7.jpg | \images\news_2023-03-01_7.jpg | https://eu.mouser.com/news/qorvo-automotive-design/qorvo-future-automotive-ebook.html | mouser.com |
| Dual-Channel Optocoupler Phototransistor | Würth Elektronik has expanded its WL-OCPT optocoup... | 11241 | Product Release | Dual-Channel Optocoupler Phototransistor | Würth Elektronik has expanded its WL-OCPT optocoupler product family with the DIP-8 design. Two-channel optocoupler phototransistors with eight pins are now available. This design contains two circuits inside a single component constructed from two input LEDs and two output phototransistors, therefore two separate circuits can be controlled with a single component. WL-OCPT features a stable current transfer ratio (CTR) over the entire operating temperature range (-55 to +110°C). The DIN-EN-60747-5-5-certified components have an insulation voltage of 5000 V, a collector-emitter voltage of 80 V, and a maximum forward current of 60 mA. The Würth Elektronik optocouplers are suitable for optical and space-saving galvanic isolation in power supplies, chargers, computers, microprocessors, instruments, machines, ammeters or smart meters. Binning of the dual-channel WL-OCPT is in a CTR range of 130-400%, tested at an input current of 5 mA and a collector-emitter voltage of 5 V. Depending on the land pattern on the PCB, the DIP-8 optocoupler packages are available in standard, M, S and SL leadframe variants. The lead frames are made of copper thus guaranteeing the best solderability. Like all other WL-OCPT series optocouplers, the DIP-8 variants are now available from stock without a minimum order quantity. Developers receive free samples on request. | 09.02.2023 14:30:00 | Feb | news_2023-03-01_18.jpg | \images\news_2023-03-01_18.jpg | https://www.we-online.com/en/news-center/press?d=wl-ocpt-en | we-online.com |
| Compact Intelligent (Smart) Low Side Switches | ROHM released a generation of 1 channel and 2 chan... | 11221 | Product Release | Compact Intelligent (Smart) Low Side Switches | ROHM released a generation of 1 channel and 2 channel 40 V Intelligent (Smart) Low Side Switches : the BV1LExxxEFJ-C and BM2LExxxFJ-C series. The two product families are ideally designed for automotive and industrial applications. They are AEC-Q100 qualified and are suitable for systems such as car body control, engine and transmission control units, LED lighting modules or industrial PLC (programmable logic controllers). The BV1LExxxEFJ-C and BM2LExxxFJ-C family of products are Intelligent Low Side Devices that integrated all of the above and can switch currents for any type of resistive, capacitive or inductive loads. When switching off an inductive load, the power MOSFET inside the smart switch needs to dissipate all the magnetic energy stored previously in the inductor's magnetic field. During this time the device protects itself by actively clamping the voltage to a safe level. The power dissipated, generates heat that is distributed on the integrated power MOSFET's surface. ROHM's products combine heat suppression with low ON resistance (difficult to achieve in a compact size), by optimally controlling the number of current-carrying channels using proprietary TDACC circuit and device technology. TDACC offers increased integration capability, allowing ROHM to report 2 channel 40mO (ON resistance) product in the compact SOP-J8 package. A wide range of ON-resistance values (40/80/160/250mO) in both 1 channel and 2 channel configurations are offered to meet diverse customer needs. Furthermore, the contact discharge tolerance of all the products in the family is higher than that of other standard products. This adds to a safer operation inside various electronic equipment types. | 07.02.2023 15:30:00 | Feb | news_2023-02-15_26.jpg | \images\news_2023-02-15_26.jpg | https://www.rohm.com/news-detail?news-title=2023-02-07_news_ipd&defaultGroupId=false | rohm.com |
| Power Analyzer Help to Build Higher Efficiency Motor Drives | German automation and motion control specialist KE... | 11203 | Industry News | Power Analyzer Help to Build Higher Efficiency Motor Drives | German automation and motion control specialist KEB Automation is using Yokogawa's WT5000 Precision Power analyzer to develop the latest generation of frequency converters for variable speed drives, ensuring they meet the latest EU energy efficiency regulations. David Kater, development engineer at KEB, says: "Fast-switching semiconductors generate common-mode voltages at high frequencies, inducing parasitic common-mode currents even in small capacitances. We only want to see the differential mode in the measurement, which is why common-mode rejection is extremely important." KEB uses power analyzers at several stages of a product's lifecycle, including in the development of the design, for final validation of the design's performance and also to prove the characteristics of production units. Developing frequency converters for drives requires analyzers that can maintain accurate measurements of power parameters. The measurement equipment must offer high common-mode noise rejection, as the output voltages of the inverters display high dV/dt, producing spectral components at very high frequencies. Following a rigorous comparison with other products, KEB found that the analyzer that most suited its needs was the Yokogawa WT5000. Analysis of its performance showed KEB engineers that the currents due to common mode noise were at an extremely low level, outperforming KEB's previous analyzer, which was also a Yokogawa product. In its tests of the WT5000, KEB found no significant crosstalk from channels affected by common-mode noise to other channels, even when operating at the system's full measurement bandwidth of 5 MHz for current and 10 MHz for voltage. | 07.02.2023 11:00:00 | Feb | news_2023-02-15_7.jpg | \images\news_2023-02-15_7.jpg | https://www.yokogawa.com/ | yokogawa.com |
| 8-Channel High- and Low-Side Switches for Driving Loads in Industrial Applications | Toshiba Electronics Europe has launched two intell... | 11212 | Product Release | 8-Channel High- and Low-Side Switches for Driving Loads in Industrial Applications | Toshiba Electronics Europe has launched two intelligent power products to control the driving of resistive and inductive loads including motors, solenoids, and lamps in applications such as programmable logic controllers within industrial equipment. The power switch products both comprise 8 channels and are a high-side (TPD2015FN) and low-side (TPD2017FN) switches. Both devices benefit from Toshiba's latest analog device process (BiCD) that combines bipolar, CMOS, and DMOS technologies. Both of the products are housed in the small 0.65mm pitch SSOP30 package that measures just 9.7 ×7.6 ×1.2mm. This offers a reduction of around 29% in mounting area and 20% in height over the SSOP24 package (13.0 × 8.0 ×1.5mm) that is used for current products such as the TPD2005F and TPD2007F, thereby reducing the size of designs. With regard to the electrical performance, the on-resistance (RDS(ON)opr) from -40°C to +110°C with a junction temperature (Tj) as high as +150°C, ensuring their suitability for challenging industrial environments. In addition, both products have built-in over current protection circuits and over temperature protection circuits, thereby ensuring the reliability of equipment they are used in. | 07.02.2023 07:30:00 | Feb | news_2023-02-15_17.jpg | \images\news_2023-02-15_17.jpg | https://toshiba.semicon-storage.com/eu/company/news/2023/02/intelligent-power-ics-20230207-1.html | toshiba.semicon-storage.com |
| Integrated Flyback Controller Boosts LED Lighting Performance | STMicroelectronics' HVLED101 90-400V flyback contr... | 11211 | Product Release | Integrated Flyback Controller Boosts LED Lighting Performance | STMicroelectronics' HVLED101 90-400V flyback controller for LED-lighting applications up to 180W enhances performance and simplifies design through extensive feature integration, patented control techniques, and support for primary-sensing regulation. Joining ST's HVLED family of high-power-factor controllers, the HVLED101 contains 800V startup circuitry that cuts the LED turn-on time to less than 250ms. High-voltage input-sensing circuitry and a maximum power control (MPC) engine are also integrated to ensure consistent power output as the line voltage fluctuates. This lets designers choose smaller and lower-cost external passive components to handle worst-case line conditions. Primary-sensing regulation without isolated feedback further reduces the bill of materials and enhances reliability. Among the patented innovations, ST's input-current shaping algorithm lowers total harmonic distortion (THD) and maximizes the power factor. Also, the HVLED101 is the first high-power factor flyback controller to implement ST's valley-locking technique to minimize audible noise, improve regulation, and reduce distortion. At steady state in quasi-resonant operation, valley locking fixes the number of valleys skipped until a significant change in output power or input voltage is detected. Together, current shaping and valley locking enhance the power factor and THD even at low and medium loads. Flyback converters controlled with the HVLED101 can achieve 5% THD at full load and 10% at 1/3 load to meet leading ecodesign codes. | 06.02.2023 06:30:00 | Feb | news_2023-02-15_16.jpg | \images\news_2023-02-15_16.jpg | https://newsroom.st.com/media-center/press-item.html/n4515.html | st.com |
| High Current Inductor for Automotive Applications | Würth Elektronik introduces another AEC-Q200 certi... | 11220 | Product Release | High Current Inductor for Automotive Applications | Würth Elektronik introduces another AEC-Q200 certified SMD inductor: WE-XHMA features a high current capability of up to 50.6 A saturation current and the ability to handle high current transient peaks. Its design with flat wire coil and a composite core material ensures low copper losses and stable behavior under temperature fluctuations. WE-XHMA is particularly suitable for use in DC/DC converters for high current supply and field programmable gate arrays (FPGA), as well as filter applications. It is particularly useful when used in switching power supplies: In contrast to conventional core materials, the compact coil shows hardly any temperature-dependent fluctuations in terms of inductance and saturation current. The higher energy density and the compact design due to the use of flat wire also make WE-XHMA interesting for switched-mode power supplies. Flat wire also has the advantage that a larger cross-sectional area can be achieved with the same space requirement, thereby reducing resistance. Furthermore, it shows a lower skin effect at higher frequencies and the heat dissipation towards the circuit board is, because of the flat thermally conducting surface, also better than round wire. The compact molded magnetically shielded coils are AEC-Q200 certified and have an operating temperature range of -40°C to +125°C. WE-XHMA is available from stock in SMT styles 6030, 6060, 8080, 1090, 1510 and with saturation currents from 9.3 to 50.6 A. Free samples for developers are provided. | 02.02.2023 14:30:00 | Feb | news_2023-02-15_25.jpg | \images\news_2023-02-15_25.jpg | https://www.we-online.com/en/news-center/press?d=we-xhma-en | we-online.com |
| Space Level SMD Inductor | Ideal for space and aerospace applications, the S0... | 11217 | Product Release | Space Level SMD Inductor | Ideal for space and aerospace applications, the S0603 inductor offers temperature stability, High Q and Ultra High SRF values, Low Outgassing Properties and an Operating Temperature Range of -55 to +125 C degrees (higher operating temperatures available) - all in a small rugged package. The company's environmental testing lab conducts load life, thermal shock, powdered burn-in, short time overload, real time x-ray, and extreme tempera- ture testing to guarantee the S0603's reliability in challenging environments. It's manufactured in a cleanroom and rigorously tested to MIL-STD-981 for the high performance criteria demanded in space flight. | 01.02.2023 12:30:00 | Feb | news_2023-02-15_22.jpg | \images\news_2023-02-15_22.jpg | https://www.delevan.com/en/newsroom/2022/12/s0603-a-small-high-reliability-space-level-smd-inductor | delevan.com |
| Provider of Charging Solutions for EVs Expands Porsche's Investment Portfolio | Porsche has invested a double-digit million euro a... | 11202 | Industry News | Provider of Charging Solutions for EVs Expands Porsche's Investment Portfolio | Porsche has invested a double-digit million euro amount in ABB E-mobility, Baden, Switzerland, in a private placement. Lutz Meschke, member of the board of management responsible for investment management at Porsche SE: "With the fast growth that we are seeing in electromobility, the need for the expansion of the corresponding charging infrastructure is increasing. We expect that the demand for chargers will continue to increase rapidly in the years to come. As a leading provider of charging solutions for electric vehicles, ABB E-mobility will participate significantly in this market growth." ABB entered the e-mobility market in 2010, and today has sold more than one million electric vehicle chargers across more than 85 markets. With over 50,000 DC fast chargers sold, the company has the largest installed base of fast chargers in the market. In addition to electric vehicles chargers, ABB E-mobility's product portfolio also comprises services in the area of life-cycle management as well as software solutions for the planning and operation of electric vehicle fleets. The total volume of the private placement that has now been completed amounts to approximately 525 million Swiss francs. The proceeds will be used to further accelerate the rapid organic growth of the company as well as for acquisitions. | 01.02.2023 10:00:00 | Feb | news_2023-02-15_6.jpg | \images\news_2023-02-15_6.jpg | https://www.porsche-se.com/en/news/press-releases/details/news/detail/News/porsche-se-beteiligt-sich-an-abb-e-mobility | porsche-se.com |
| Silicon Carbide Device Manufacturing Facility in Saarland, Germany | Wolfspeed announced plans to build a 200mm wafer f... | 11198 | Industry News | Silicon Carbide Device Manufacturing Facility in Saarland, Germany | Wolfspeed announced plans to build a 200mm wafer fabrication facility in Saarland, Germany. The company's first fab in Europe will be its most advanced, creating a development and production facility in the European Union to support growing demand for a wide variety of automotive, industrial and energy applications. The European fab announcement is an important part of the company's broader $6.5 billion capacity expansion effort, which includes opening of the company's 200mm Mohawk Valley device fab in April 2022, and the construction of The John Palmour Manufacturing Center for Silicon Carbide, a 445-acre (180 hectare) Silicon Carbide materials facility in North Carolina, which will expand the company's existing materials capacity by more than 10x. "This new fab represents a big step forward for both Wolfspeed and our regional customers, as we enhance the ecosystem for semiconductor production and innovation," said Gregg Lowe, President and CEO of Wolfspeed. "Silicon Carbide devices offer greater energy efficiency and are essential in the global shift toward sustainable electrification. This new facility will be crucial to supporting our expansion in a capacity constrained industry that is growing very rapidly, especially across the EV marketplace. It was important for us to have a facility located in the heart of Europe, near many of our customers and partners, to foster collaboration on the next generation of Silicon Carbide technologies." The announcement was made at an event on the 35-acre (14-hectare) site of the planned fab, a former coal-fired power plant in Saarland, Germany. | 01.02.2023 06:40:00 | Feb | news_2023-02-15_3.png | \images\news_2023-02-15_3.png | https://www.wolfspeed.com/company/news-events/news/wolfspeed-announces-plan-to-construct-worlds-largest-most-advanced-silicon-carbide-device-manufacturing-facility-in-saarland-germany/ | wolfspeed.com |
| Current Transducer for Automotive (EV) Test Benches & Battery Testing | Danisense announced the release of its latest curr... | 11215 | Product Release | Current Transducer for Automotive (EV) Test Benches & Battery Testing | Danisense announced the release of its latest current transducer mainly aimed at automotive (EV) test benches and battery testing & evaluation systems. Featuring a very large aperture of 41.2mm, the DN1000ID current transducer enables power cables with large power connectors to be easily fitted to EV test benches allowing for quick changeovers. The large aperture is an important advantage as test bench operators often face the issue that the power connectors fitted to the power cables are bigger than the diameter of the cable, making it difficult to fit them in the aperture of the current transducer and often requiring additional work to solve this issue. Comments Loic Moreau at Danisense: "Our new DN1000ID device now offers the best compromise between the 1000A nominal current and aperture size by keeping the best measuring performances in accuracy and phase shift." Like all Danisense products the DN1000ID current transducers benefit from the high stability closed loop fluxgate technology. Further technical details include a linearity of 1 ppm, 5 ppm offset and a compact aluminium housing. Additional target applications for the product are power measurement and power analysis, MPS for particle accelerators, gradient amplifiers for MRI devices, precision drives as well as current calibration purposes. | 31.01.2023 10:30:00 | Jan | news_2023-02-15_20.jpg | \images\news_2023-02-15_20.jpg | https://danisense.com/news/danisense-wide-bandwidth-current-transducer/ | danisense.com |
| 200 V, 10 mΩ GaN FET Joins Family of Footprint Compatible QFN Packaged Devices | EPC introduces the 200 V, 10 mΩ EPC2307 in a... | 11235 | Product Release | 200 V, 10 mΩ GaN FET Joins Family of Footprint Compatible QFN Packaged Devices | EPC introduces the 200 V, 10 mΩ EPC2307 in a thermally enhanced QFN in a tiny 3 mm x 5 mm footprint. The EPC2307 is footprint compatible with the previously released 100 V, 1.8 m? EPC2302, the 100 V 3.8 m? EPC2306, the 150 V, 3 m? EPC2305, the 150 V, 6 m? EPC2308, and the 200 V, 5 m? EPC2304 allowing designers to trade off RDS(on) vs. price to optimize solutions for efficiency or cost by dropping in a different part number in the same PCB footprint. The devices feature a thermally enhanced QFN package with exposed top. The extremely small thermal resistance improves heat dissipation through a heatsink or heat spreader for excellent thermal behavior, while wettable flanks simplify assembly, and footprint compatibility offers design flexibility to specs change for fast time to market. This family of devices bring several benefits to motor drive designs including very short deadtimes for high motor + inverter system efficiency, lower current ripple for reduced magnetic loss, lower torque ripple for improved precision, and lower filtering for lower cost. For DC-DC conversion applications, these devices offer up to five times higher power density, excellent heat dissipation, and lower system costs in both hard switching and soft switching designs. Additionally, ringing and overshoot are both significantly reduced for better EMI. | 31.01.2023 08:30:00 | Jan | news_2023-03-01_12.jpg | \images\news_2023-03-01_12.jpg | https://epc-co.com/epc/events-and-news/news/artmid/1627/articleid/3104/200-v-10-m%e2%84%a6-gan-fet-joins-family-of-footprint-compatible-qfn-packaged-devices-for-high-efficiency-and-design-flexibility | epc-co.com |
| AEC-Q200 Compliant High Power Thick Film Chip Resistor Line | Bourns expanded its line of high power thick film ... | 11216 | Product Release | AEC-Q200 Compliant High Power Thick Film Chip Resistor Line | Bourns expanded its line of high power thick film resistors with four AEC-Q200 compliant product series. The Bourns Model CRM-Q, CRS-Q, CMP-Q and CHP-Q Series are automotive grade and feature high rated power and pulse load surge capability. Manufactured using a thick film element printed onto a ceramic substrate enhances the four new resistor series' reliability. The features offered in Bourns' AEC-Q200 compliant resistors make them well-suited for current limiters and snubber circuits, as well as balancing and bleeder resistors in automotive, consumer electronics, industrial automation, power supplies, LED lighting and communication base station applications. Bourns Model CRM-Q Series high power resistors and Model CRS-Q Series surge withstand resistors are available in three sizes from 1206 (3116 Metric) to 2512 (6432 Metric) with rated power from 0.5 to 2 watts. The Model CMP-Q Series pulse power resistors are available in five sizes from 0603 (1608 Metric) to 2512 (6432 Metric) with rated power from 0.25 to 1.5 watts. The Model CHP-Q Series ultra-high power resistors are available in five sizes from 0603 (1608 Metric) to 1206 (3116 Metric) with rated power from 0.33 to 0.75 watts. | 30.01.2023 11:30:00 | Jan | news_2023-02-15_21.jpg | \images\news_2023-02-15_21.jpg | https://www.bourns.com/news/press-releases/pr/2023/01/30/bourns-expands-high-power-thick-film-chip-resistor-line-with-four-new-aec-q200-compliant-series | bourns.com |
| PCIM Asia Conference 2023 Call for Papers now Open | As part of PCIM Asia, held from 29 – 31 August 202... | 11200 | Event News | PCIM Asia Conference 2023 Call for Papers now Open | As part of PCIM Asia, held from 29 – 31 August 2023 at the Shanghai International Expo Center, the conference is inviting interested individuals to submit abstracts to be incorporated into the conference proceedings and published in scientific databases. The call for papers closes on 15 March 2023. The submissions will be reviewed by the PCIM Asia Advisory Board, and upon their acceptance will be considered for a 20-minute talk or poster session. Successful submissions will also be included in the PCIM Asia conference proceedings, as well as in the Ei Comendex, IEEExplore, IET Inspec-Direct and Scopus scientific databases. As always, there will be three awards honouring the most outstanding achievements and contributions of researchers, with all winners receiving an attractive prize. Awards include "The Best Paper Award" for the best overall submission, "The Young Engineer Award", which recognises an engineer under the age of 35 for an outstanding paper and "The University Scientist Award" for universities best promoting the development of the power electronics industry. | 30.01.2023 08:00:00 | Jan | news_2023-02-15_15.jpg | \images\news_2023-02-15_15.jpg | https://pcimasia-expo.cn.messefrankfurt.com/shanghai/en/press/press-releases/2023/PCIM23_PR1.html | pcimasia-expo.cn |
| Accelerating Solar Adoption with Silicon Carbide MOSFETs | Navitas and KATEK GROUP announce that KATEK's cool... | 11199 | Industry News | Accelerating Solar Adoption with Silicon Carbide MOSFETs | Navitas and KATEK GROUP announce that KATEK's coolcept fleX family of Steca solar inverters have adopted GeneSiC power semiconductors for improved efficiency, size, weight and cost, with significant market size expansion. GeneSiC 'trench-assisted planar-gate' SiC MOSFET technology delivers high-temperature, high-speed performance, resulting in up to 25°C lower case temperature, and up to 3x longer life than alternative SiC products. With the highest-published 100%-tested avalanche capability, 30% longer short-circuit withstand time, and stable threshold voltage for easy paralleling, GeneSiC MOEFTs are ideal for high-power, fast-time-to-market applications. Steca – A KATEK Brand – develops and produces power electronics for grid inverters and energy storage as well as control technology for photovoltaic systems and fuel cell systems. The Steca coolcept fleX model solar inverter converts DC power from a string of solar panels into 4.6 kW AC power for use in the home, returning to the grid, or being stored locally for later use – to smooth demand and/or support power during an outage. Each 4.6 kW Steca coolcept flex inverter uses 16x SiC MOSFETs. These devices are used in a two-level converter, with bi-directional boost converters and an H4-topology for AC voltage output. Increased switching frequency shrinks the size and weight of 'passive' components, which optimizes the KATEK unit in size and weight compared to legacy silicon-based inverters. | 27.01.2023 07:10:00 | Jan | news_2023-02-15_4.jpg | \images\news_2023-02-15_4.jpg | https://navitassemi.com/navitas-and-katek-accelerate-solar-adoption-with-higher-efficiency-and-lower-costs/ | navitassemi.com |
| Powerful Softstarters Prevent Damage and Save Energy | CG Drives & Automation presents a range of Emotron... | 11222 | Product Release | Powerful Softstarters Prevent Damage and Save Energy | CG Drives & Automation presents a range of Emotron TSA softstarters from 5,5 to 1000kW (16-960A and 200-690V). The range includes the frame sizes TSA 5 and 6 for the highest powers (470-960A). Designed to ensure operational security and energy efficiency they boast many built-in functions for safety and reliability such as thermal motor protection, intelligent load monitoring, thermistor input and bypass contactor as standard. Soft torque starts and smart stops are accompanied by a robust and compact design. The TSA softstarter is a cost-efficient motor controller for applications where variable speed is not required. 3-phase torque control gives a higher starting torque and lower starting current levels. Soft torque start and stops and strong vector braking for high inertia loads makes it ideal for many applications such as pumps, saws, conveyors, mixers and centrifuges. 3-phase torque control gives a higher starting torque and lower starting current levels. Soft torque start and stops and strong vector braking for high inertia loads makes it ideal for many applications such as pumps, saws, conveyors, mixers and centrifuges. With more than 99.6% starter efficiency from the bypass contactor and full softstarter programmability at your fingertips, the TSA gives every opportunity to save energy. Product Manager Pär Ölund explains: "A real-time clock allows you to customize functionality and set up a schedule according to your own requirements. The plug-and-play solution and the intuitive user interface means that many of our clients complete the installation and programming entirely on their own." The size 5 and 6 have ability to handle heavy loads at the start, commonly required by e.g. conveyor belts and crushers. Torque boost is used to overcome initial torque peaks. The starting capacity is 300% for 30 seconds. | 25.01.2023 16:30:00 | Jan | news_2023-02-15_27.jpg | \images\news_2023-02-15_27.jpg | https://www.emotron.com/about-us/news-and-media/emotron-news-2021/vfd-and-softstarter-product-release/ | emotron.com |
| Non-Silicone, Dispensable Thermal Gels | The Chomerics Division of Parker Hannifin has unve... | 11218 | Product Release | Non-Silicone, Dispensable Thermal Gels | The Chomerics Division of Parker Hannifin has unveiled THERM-A-GAP GEL 40NS, the next iteration in its line of silicone-free, thermally conductive gels. This one-component, low-outgassing material features a special formulation to meet the stringent requirements of silicone-sensitive applications such as optical equipment, camera modules, high-performance sensors and data storage devices. Offering heat-transfer performance of 4.0 W/m-K thermal conductivity, users of THERM-A-GAP GEL 40NS will discover a thermally reliability material in an ultra-low compression force package: it deforms easily under assembly pressure, minimising stress on components, solder joints and leads. The fully cured and dispensable product requires no mixing and maintains the traditional advantages of Parker Chomerics' line of thermal gels, providing seamless integration into high-volume, automated assembly applications, as well as rework and field repair situations. THERM-A-GAP GEL 40NS reliably conforms to rough surface irregularities, displaces air gaps and takes up manufacturing tolerances on heat-generating components. The product provides very low thermal impedance at bond lines as thin as 0.15 mm (0.006"). Requiring no secondary curing, THERM-A-GAP GEL 40NS is the ideal solution for applications that must reduce the risks associated with silicone oil migration or contamination, or for devices manufactured in silicone-free facilities. | 25.01.2023 12:30:00 | Jan | news_2023-02-15_23.jpg | \images\news_2023-02-15_23.jpg | https://www.parker.com/portal/site/PARKER/menuitem.7322a3ce19c3a730b5170b9d237ad1ca/?vgnextoid=784242f0a7a6e210VgnVCM10000048021dacRCRD&vgnextfmt=EN&vgnextitem=f1041fcf038e5810VgnVCM100000e6651dacRCRD&newsroom=Y&vgnextcat=News%20Release%20Details | parker.com |
| International Exhibition for Charging Infrastructure and E-Mobility Expands Exhibition Space | E-mobility and charging infrastructure are more in... | 11206 | Event News | International Exhibition for Charging Infrastructure and E-Mobility Expands Exhibition Space | E-mobility and charging infrastructure are more in demand than ever before! The industry is turning its attention to Power2Drive Europe in Munich, June 14 -16. Despite the recent expansion of the exhibition for charging infrastructure and e-mobility, the exhibition space is almost fully booked. In the exhibition halls and at the Outdoor Area with two test drives, the focus will be on charging systems, electric vehicles and mobility services as well as innovative solutions for mobility using green technologies will be presented across the exhibition halls and the outdoor area. There are just a few places left at the joint booths of the German Federal Association for eMobility (BEM), the European Association for Electromobility (AVERE) and in the start-up area. At the June event, there will be more test and demonstration spaces outdoors. Last year, trade visitors had quickly booked all the spots on the eCar Test Drive, where Skoda launched the ENYAQ as an exhibition premiere in Germany, among other attractions. This year, there will be additional options for test driving last-mile electric vehicles and light commercial vehicle for daily use, such as nippy transporters or cargo bikes in the outdoor area. | 24.01.2023 14:00:00 | Jan | news_2023-02-15_10.jpg | \images\news_2023-02-15_10.jpg | https://www.powertodrive.de/news/international-exhibition-for-charging-infrastructure-and-e-mobility-expands-exhibition-space?ref=m5f5b626f210d284e23598737-s5fc4d6810046ed031f529995-t1675934876-c4ef437b5 | powertodrive.de |
| AC-DC Power Factor Correction Module in a Full Brick Package | TDK announces the introduction of the TDK-Lambda b... | 11219 | Product Release | AC-DC Power Factor Correction Module in a Full Brick Package | TDK announces the introduction of the TDK-Lambda brand PF1500B-360 full brick power module, capable of providing up to 1512W. The power supply has a 0.98 power factor and delivers a regulated 360Vdc non-isolated voltage from an AC input. The PF1500B-360 can be used to drive isolated high voltage input DC-DC modules in a distributed power architecture configuration, or loads requiring a high voltage DC input. Applications include semiconductor fabrication, LED lighting and custom power supply solutions using power modules. With an input of 170 to 265Vac, the PF1500B-360 provides 1512W and 1008W when operated from 85 to 265Vac. The 96.5% efficiency ensures reliable operation with baseplate temperatures of up to +100°C and in ambient temperatures of -40 to +85°C. The module has the industry standard full brick package size, measuring 116.8mm in length, 61mm wide and 12.7mm high for low profile applications. As standard, the PF1500B-360 provides a 10 - 16V 10mA auxiliary voltage, remote on/off and an inverter good signal. An enable function is available to activate isolated DC-DC converters when the output voltage is greater than 360Vdc to synchronise output rise times. Parallel connection with current sharing of up to three modules is possible for additional output power. Input and output to baseplate isolation is 2,500Vac. The PF1500B-360 is certified to the IEC/EN/CSA/UL 62368-1 standards and is CE / UKCA marked to the Low Voltage, EMC and RoHS EU Directives and UK regulations. With external circuitry, the PF1500B-360 will meet radiated and conducted emissions and comply with the IEC 61000-4 immunity standards. | 24.01.2023 13:30:00 | Jan | news_2023-02-15_24.jpg | \images\news_2023-02-15_24.jpg | https://www.emea.lambda.tdk.com/uk/news/article/19224 | emea.lambda.tdk.com |
| 105 ºC Prismatic Aluminum Electrolytic Capacitor Series | Cornell Dubilier has released a series of Flatpack... | 11191 | Product Release | 105 ºC Prismatic Aluminum Electrolytic Capacitor Series | Cornell Dubilier has released a series of Flatpack, low-profile aluminum electrolytic capacitors, tested and rated for 10,000 hours at 105 °C. Type MLPS offers high capacitance density in a flat configuration, with voltage ratings up to 450 Vdc and a temperature range from -55 °C to 105 °C. Their rugged construction provides extraordinary life and reliability for the most robust, commercial, and military-grade power supplies. LPS capacitors are available in 4 sizes. All cases have a thickness (height profile above the board) of 0.6 inches and a width of 1.8 inches. Case lengths are available from 1.5 to 3.0 inches, with capacitance values ranging from 120 to 51,000 µF and voltage ratings spanning 7.5 Vdc to 450 Vdc. The larger case sizes are typically rated for several amps (RMS). Ripple current ratings can be significantly enhanced by adding one or more heat sinks to their flat sides. Unlike conventional electrolytics that have a rolled cover, MLPS covers are laser-welded, providing near-hermetic seals that resist electrolyte dry-out. They can be put into service at high altitudes of up to 80,000 feet and have excellent capacitance retention at low temperatures. Various lead types and mounting options are available. | 23.01.2023 14:30:00 | Jan | news_2023-02-01_22.jpg | \images\news_2023-02-01_22.jpg | https://www.cde.com/news/2023/1/mlps/ | cde.com |
| Companies First Silicon Carbide Schottky Barrier Diodes (SBD) Launched | Diodes announced the release of its first Silicon ... | 11214 | Product Release | Companies First Silicon Carbide Schottky Barrier Diodes (SBD) Launched | Diodes announced the release of its first Silicon Carbide (SiC) Schottky barrier diodes (SBD). The portfolio includes the DIODES DSCxxA065 series with eleven products rated at 650V (4A, 6A, 8A, and 10A) and the DIODES DSCxx120 series with eight products rated at 1200V (2A, 5A, and 10A). These wide-bandgap SBDs bring the benefits of significantly improved efficiency and high-temperature reliability, while also responding to market demands for reduced system running costs and low maintenance. The devices are suitable for AC-DC, DC-DC, and DC-AC switching converters, photovoltaic inverters, uninterruptable power supplies, and industrial motor drive applications. These devices can also be used in a variety of other circuits, such as boost converters for power factor correction. Three package options include surface mount TO252-2 (Type WX), through-hole TO220AC (Type WX), and ITO220AC (Type WX-NC). | 23.01.2023 09:30:00 | Jan | news_2023-02-15_19.jpg | \images\news_2023-02-15_19.jpg | https://www.diodes.com/about/news/press-releases/diodes-incorporated-releases-its-first-silicon-carbide-schottky-barrier-diodes-sbd/ | diodes.com |
| GaN FET for Automotive-Grade Lidar, 48 V – 12 V DC-DC Conversion, and Low Inductance Motor Drives | Efficient Power Conversion expands the selection o... | 11183 | Product Release | GaN FET for Automotive-Grade Lidar, 48 V – 12 V DC-DC Conversion, and Low Inductance Motor Drives | Efficient Power Conversion expands the selection of automotive, off-the-shelf gallium nitride transistors with the introduction of the 80 V, 11 mΩ EPC2252 that delivers 75 A pulsed current in a 1.5 mm x 1.5 mm footprint. The EPC2252 offers power system designers smaller and more efficient devices than silicon MOSFETs for automotive-grade lidar found in autonomous driving and other ADAS applications, 48 V – 12 V DC-DC conversion, and low inductance motor drives. Lower switching losses, lower conduction losses, zero reverse recovery losses, and lower drive power enable high frequency designs at high efficiency. Combined with a tiny footprint, these factors enable state-of-the-art power density. The fast-switching speed of GaN, with sub-nanosecond transitions and the capability to generate high-current pulses in less than 3 ns, results in longer range and higher resolution in lidar for autonomous driving, parking, and collision avoidance. "The EPC2252 makes an ideal switch for automotive lidar, low inductance motors, and 48 V DC-DC conversions," according to Alex Lidow, EPC's co-founder and CEO. "EPC is committed to the automotive market with a growing family of devices that enable highly efficient, low-cost vehicle electrification and autonomous driving." | 23.01.2023 07:30:00 | Jan | news_2023-02-01_14.png | \images\news_2023-02-01_14.png | https://epc-co.com/epc/events-and-news/news/artmid/1627/articleid/3102/design-higher-resolution-lidar-systems-with-new-automotive-qualified-gan-fet-for-advanced-autonomy-from-epc | epc-co.com |
| Pre-APEC Power Magnetics at High-Frequency Workshop | The PSMA Magnetics Committee and IEEE PELS are joi... | 11180 | Event News | Pre-APEC Power Magnetics at High-Frequency Workshop | The PSMA Magnetics Committee and IEEE PELS are jointly sponsoring the eighth high-frequency magnetics workshop, "Power Magnetics @ High Frequency," on Saturday, March 18, 2023, which is the day before and at the same venue as APEC 2023 in Orlando, FL. This day-long event will continue the focus on identifying the latest improvements in magnetic materials, coil (winding) design, construction and fabrication, evaluation and characterization techniques and modelling and simulation tools to satisfy the technical expectations and requirements of higher application frequencies. The target audiences for this workshop include anyone working to achieve higher power densities, low profile aspect ratio, higher efficiencies and improved thermal performance. The theme of the 2023 Power Magnetics @ High Frequency Workshop will be magnetic component design across applications ranging from milliwatts to megawatts. The workshop will address applications areas such as IoT, servers, integrated voltage regulators (IVR), transportation electrification, wireless charging for mobile and electric vehicles and solid-state transformers. The workshop will also include presentations and demonstrations to address specific technical issues relative to high voltage and high current design such as corona, insulation, encapsulation, etc., that were identified in the 2022 workshop survey. | 19.01.2023 17:00:00 | Jan | news_2023-02-01_11.jpg | \images\news_2023-02-01_11.jpg | https://www.psma.com/2023_Power_Magnetics_at_High_Frequency_Agenda | psma.com |
| SPS Expands to the USA | With an annual sales volume of more than 50 billio... | 11178 | Event News | SPS Expands to the USA | With an annual sales volume of more than 50 billion euros, industrial automation is one of the most important economic sectors in Germany. The world's central trade fair platform for the industry is the SPS - Smart Production Solutions, organized by Mesago Messe Frankfurt. In view of its international success, the organizer will now also gain a foothold in the US market with this trade event. The SPS brand will be premiering in the region as the "Automation Sector powered by SPS" as part of IMTS 2024, before a stand-alone trade show is held in Atlanta in 2025. As a supplement to the trade show in Nuremberg and its associated events in Italy and China, the formats will further accelerate and facilitate the exchange of knowledge in the field of industrial automation between the economic regions of the USA and Europe. This is particularly relevant against the backdrop of the current challenges in the areas of supply chains, logistics, staff shortages and cost pressure, as this is also accompanied by an increased need for automation. Since industrial automation had become increasingly important for the leading American trade fair for manufacturing technology, IMTS, in recent years, this subject will now be spotlighted in the "Automation Sector powered by SPS - Smart Production Solutions" as part of the event from 9 -14 September 2024 in Chicago. With its expertise, Mesago Messe Frankfurt is supporting the organizer AMT (Association For Manufacturing Technology) in the realization of this special showcase, which is intended to illustrate smart and digital automation solutions for industrial manufacturing. | 19.01.2023 15:00:00 | Jan | news_2023-02-01_9.jpg | \images\news_2023-02-01_9.jpg | https://sps.mesago.com/nuernberg/en/press/press-releases/sps-press-releases/sps_expands_to_the_usa.html | sps.mesago.com |
| EPE'23 ECCE Europe: 4 – 8 September 2023, Aalborg, Denmark | The European Power Electronics and Drives Associat... | 11174 | Event News | EPE'23 ECCE Europe: 4 – 8 September 2023, Aalborg, Denmark | The European Power Electronics and Drives Association, EPE-Association in short, in collaboration with its co-sponsor IEEE-PELS, is proud to announce that EPE'23 ECCE Europe will take place in the AKKC – the Aalborg Congress and Culture Center from 4 to 8 September 2023. In addition to the regular topics for paper submission, EPE'23 ECCE Europe at Aalborg will highlight the following Focus Topics, not only in dedicated lecture and dialogue sessions, but also in keynotes, the exhibition, panel discussions, tutorials and technical visits. Paper submissions in line with these Focus Topics are highly encouraged. Energy Islands: 1. Renewable Energy systems and Power-to-X 2. Energy Islands; Energy Storage: 3. Energy-storage technologies 4. Electric Vehicles; Digital world in Energy: 5. Cyber Security in Power Electronics 6. Reliability and Artificial Intelligence in Power Electronics. The (only) Provisional Full Paper deadline is 2 March 2023 | 19.01.2023 11:00:00 | Jan | news_2023-02-01_5.png | \images\news_2023-02-01_5.png | https://epe2023.com/ | epe2023.com |
| Haviv Ilan to Become Next President and CEO | Texas Instruments announced that Haviv Ilan will b... | 11201 | People | Haviv Ilan to Become Next President and CEO | Texas Instruments announced that Haviv Ilan will become the next president and chief executive officer (CEO) of Texas Instruments, effective April 1. A 24-year veteran of TI, Haviv succeeds the current president and CEO, Rich Templeton, who will remain chairman of the board. The transition is a well-planned succession that follows Haviv's promotion to senior vice president in 2014, executive vice president and chief operating officer in 2020, and election to the board of directors in 2021. Haviv has served in a variety of senior management roles at TI, including leading businesses in both analog and embedded processing. He joined TI in 1999 through the acquisition of Butterfly, a wireless start-up company in Israel. Haviv earned bachelor's and master's degrees in electrical engineering from Tel Aviv University. He also earned a Master of Business Administration from the Joint International Executive MBA Program at Northwestern University's Kellogg School of Management and Tel Aviv University's Leon Recanati Graduate School of Business Administration. "I am honored to lead TI during this amazing time for our company and our industry," said Haviv. "The combination of our broad portfolio of products, strong foundation of manufacturing and technology, reach of market channels and diverse and long-lived positions all put TI in a unique class of companies. Our ambitions and values will continue to be integral to how we build TI stronger and when we are successful, our employees, customers, communities and shareholders all benefit." | 19.01.2023 09:00:00 | Jan | news_2023-02-15_5.jpg | \images\news_2023-02-15_5.jpg | https://news.ti.com/blog/2023/01/19/haviv-ilan-to-become-next-president-and-ceo-texas-instruments | ti.com |
| All-in-One Hybrid Power Drive Module Solution Designed for Electric Aviation Applications | Microchip Technology announces a comprehensive hyb... | 11184 | Product Release | All-in-One Hybrid Power Drive Module Solution Designed for Electric Aviation Applications | Microchip Technology announces a comprehensive hybrid power drive module, the first variant introduced in a product line of power devices that will be available in 12 different variants with either silicon carbide (SiC) MOSFETs or insulated-gate bipolar transistors (IGBTs). These hybrid power drive modules are highly integrated power semiconductor devices that reduce the number of components and simplify the overall system design. The configurable power devices include a three-bridge topology that are available in SiC or Si semiconductor technologies. Offering a compact design and low weight and profile, these high-reliability power devices help reduce the size and weight of MEAs. Other key capabilities of these hybrid power drive modules include numerous auxiliary power devices that facilitate an inrush current limit function. Optional add-on capabilities include soft start, solenoid interface drive, regenerative brake switch and thermal sensors for external monitoring circuitry usage. The power modules also facilitate high-switching frequency power generation, which enables smaller and more efficient systems. The standard voltage of the power modules ranges from 650V to 1200V, with the option to customize up to 1700V on request. The device is designed for low inductances for high-power density with power and signal connectors that are solderable directly on the user's printed circuit board. | 19.01.2023 08:30:00 | Jan | news_2023-02-01_15.jpg | \images\news_2023-02-01_15.jpg | https://www.microchip.com/en-us/about/news-releases/products/new-all-in-one-hybrid-power-drive-module-solution-from-microchip | microchip.com |
| Agreement on Acquisition of Silicon Control IC Company | Navitas Semiconductor announced an agreement to ac... | 11171 | Industry News | Agreement on Acquisition of Silicon Control IC Company | Navitas Semiconductor announced an agreement to acquire the remaining minority interest in its silicon control IC joint venture from Halo Microelectronics for a purchase price of $20 million in Navitas stock. In 2021, Navitas and Halo created a joint venture to develop application-specific silicon controllers that are optimized to work in combination with Navitas GaN ICs to set new standards for efficiency, density, cost and integration for a wide range of applications. The first family of products have been developed and released to production which address AC-DC power supply applications across mobile, consumer, home appliance and auxiliary power supplies in enterprise, renewables, EV and other related markets. The silicon controller and GaN ICs combine either as a 'chip-set' or are co-packaged, to target 20 W to 500 W applications and have already been adopted by dozens of customers set to introduce their next-generation products later this year. As Navitas was already the majority shareholder, financial results from the joint venture have already been reflected in Navitas' historical financial statements and guidance. The transaction is expected to close in February. The addressable market potential for this additional silicon controller capability is estimated at over $1B per year by 2026. "This is another strategic acquisition for Navitas as we integrate critical silicon controller capabilities with our leading-edge GaN and SiC technologies," said Navitas CEO and co-founder Gene Sheridan. "Silicon controllers are needed in all power systems and largely define the architecture of those systems. By combining silicon controllers with GaN and SiC, Navitas is uniquely positioned to influence customer architecture decisions to maximize the system benefits and Navitas' value when using GaN or SiC in next-generation power electronics." | 19.01.2023 08:00:00 | Jan | news_2023-02-01_2.png | \images\news_2023-02-01_2.png | https://navitassemi.com/navitas-to-acquire-silicon-control-ic-company/ | navitassemi.com |
| Boost for Phase Noise Analysis and VCO Measurements Portfolio | Rohde & Schwarz introduces improved performance fo... | 11208 | Industry News | Boost for Phase Noise Analysis and VCO Measurements Portfolio | Rohde & Schwarz introduces improved performance for phase noise analysis and voltage-controlled oscillator (VCO) measurements. Both the R&S FSWP phase noise analyzer and VCO tester plus signal and spectrum analyzer in one instrument, and the R&S FSPN dedicated phase noise analyzer and VCO tester, are now upgraded. Simultaneous hardware and software upgrades improve the performance even further, reducing noise levels and measurement times, and increasing accuracy. Both analyzers include test sequence recording functions (SCPI recorder), unique for this class of instrument. The hardware basis common to both phase noise analyzers includes upgraded DC sources with reduced noise levels, further enhancing sensitivity. Users will appreciate the improved capacitive screen featuring higher color intensity and better antiglare properties, making the display brighter and clearer in all working conditions. In addition, multi-touch features like zoom are supported by the updated user interface. For very low noise oscillators with the inherent noise largely thermal at wider offsets, any potential cross-spectral collapse is now suppressed. In particular for production use, higher measurement speed for VCO measurements will help reduce the cost of test. With the newly introduced SCPI command recorder Rohde & Schwarz implements for the first time a function with phase noise measurement equipment to record sequences of manual settings. Using the command recorder, engineers can create easily repeatable test sequences, including the necessary synchronization to operate correctly. | 18.01.2023 16:00:00 | Jan | news_2023-02-15_12.jpg | \images\news_2023-02-15_12.jpg | https://www.rohde-schwarz.com/about/news-press/all-news/rohde-schwarz-announces-major-boost-for-phase-noise-analysis-and-vco-measurements-portfolio-press-release-detailpage_229356-1316928.html | rohde-schwarz.com |
| Gate Driver IC Integrates Power Management Unit, Current Sense Amplifier, and Overcurrent Protection | To further expand its family for automotive and in... | 11187 | Product Release | Gate Driver IC Integrates Power Management Unit, Current Sense Amplifier, and Overcurrent Protection | To further expand its family for automotive and industrial motor control applications, Infineon introduces the MOTIX 3-phase gate driver IC 6ED2742S01Q. The 160 V silicon-on-insulator (SOI) gate driver features an integrated power management unit (PMU) and is available in a QFN-32 package with a thermally efficient exposed power pad. This makes the easy-to-integrate device ideal for battery-powered industrial BLDC motor control drives including cordless power tools, robotics, drones, and light electric vehicles (LEVs). The 6ED2742S01Q has integrated bootstrap diodes that power three external high-side bootstrap capacitors. Through a trickle charge pump, they support 100 percent duty cycle operation. Protection features include under-voltage lock-out, overcurrent protection with configurable threshold, fault communication, and automatic fault recovery. The output drivers integrate a high-pulse current buffer stage designed for minimal driver cross-conduction. In addition, a current sense amplifier (CSA) with selectable gain between the low-side supply voltage (V SS) and the low-side power ground return (COM) is integrated. The MOTIX gate driver provides a 1 A source and 2 A sink current with independent under-voltage lock-out (UVLO) for both high-side and low-side gate drives. The device offers a propagation delay of 100 ns and a minimum dead time of 100 ns with built-in delay matching. As a result, the driver enables high switching frequencies with reduced level shift losses. | 18.01.2023 11:30:00 | Jan | news_2023-02-01_18.jpg | \images\news_2023-02-01_18.jpg | https://www.infineon.com/cms/en/about-infineon/press/market-news/2023/INFIPC202301-052.html | infineon.com |
| Air Core Inductors Feature Miniature Size and Low Inductance | Richardson RFPD announced today the availability a... | 11185 | Product Release | Air Core Inductors Feature Miniature Size and Low Inductance | Richardson RFPD announced today the availability and full design support capabilities for AL Series and AS Series of air core RF inductors from KYOCERA AVX. Part of KYOCERA AVX's wound air core inductor family, these devices feature SRF, high Q, high current, miniature size and low inductance. They are ideal for RF circuits, broadband I/O filtering, frequency selection and impedance matching. The AS Series features a square cross section that provides better performance and offers manufacturing advantages over toroidal coils. | 18.01.2023 09:30:00 | Jan | news_2023-02-01_16.jpg | \images\news_2023-02-01_16.jpg | https://www.richardsonrfpd.com/press-room/richardson-rfpd-introduces-kyocera-avx-al-series-and-as-series-air-core-inductors/ | richardsonrfpd.com |
| Non-Coupling Dual Inductors | ITG Electronics has introduced an updated version ... | 11182 | Product Release | Non-Coupling Dual Inductors | ITG Electronics has introduced an updated version of its non-coupling dual inductors. The enhanced component is part of the company's L101353A Series of ferrite-based flat wire inductors, whose members range from 1.0-10.0uH. ITG Electronics' non-coupling dual inductor is designed for power conversion applications with current ratings from 14-170Amp at 25C and 20% inductance drop. The component has a low DC resistance (DCR) of 1.06mOhm, and IRMS up to 50Amp. The box-style surface mount device (SMD) inductors provide lower core loss and high current output – ideal for settings involving high density and limited board space. The non-coupling dual inductors are designed for 48-volt direct power conversion, offering high performance and premium efficiency in demanding data center environments. At a maximum height of 24mm, the component offers a low profile; it is also not particularly wide or deep, with a footprint of just 24.5 x 26mm. | 18.01.2023 06:30:00 | Jan | news_2023-02-01_13.jpg | \images\news_2023-02-01_13.jpg | https://itg-electronics.com/series/869 | itg-electronics.com |
| Laser Driver IC for Lidar Systems | EPC announces the introduction of the EPC21701, a ... | 11223 | Product Release | Laser Driver IC for Lidar Systems | EPC announces the introduction of the EPC21701, a laser driver that monolithically integrates an 80 V, 40 A FET with gate driver and 3.3 logic level input into a single chip for time-of-flight lidar systems used in robotics, surveillance systems, and vacuum cleaners. It is tailored to lidar systems for gesture recognition, time of flight (ToF) measurement, robotic vision, or industrial safety. The EPC21701 laser driver uses 5 V supply voltage and is controlled using 3.3 V logic. It is capable of very high frequencies greater than 50 MHz and super short pulses down to 2 ns to modulate laser driving currents up to 15 A. Voltage switching time is less than 1 ns and delay time from input to output is less than 3.6 ns. The EPC21701 is a single-chip driver plus GaN FET using EPC's proprietary GaN IC technology in a chip-scale BGA form factor that measures only 1.7 mm x 1.0 mm x 0.68 mm. The wafer level packaging is small, low inductance, and lays out very well with the laser system. With this small form factor and the integration of several functions, the overall solution is 36% smaller on the printed circuit board (PCB) compared to an equivalent multi-chip discrete implementation. The 80 V EPC21701 complements the ToF driver IC family in chip-scale package (CSP) that also includes the 40 V, 15 A EPC21601 and the 40 V, 10 A EPC21603 options. | 17.01.2023 17:30:00 | Jan | news_2023-02-15_28.jpg | \images\news_2023-02-15_28.jpg | https://epc-co.com/epc/events-and-news/news/artmid/1627/articleid/3101/design-higher-density-and-lower-cost-lidar-systems-with-new-80-v-15-a-gan-etof%e2%84%a2-laser-driver-ic | epc-co.com |
| Ecosystem of Partners Fosters the Adoption of Class D Audio Amplifier Technology | Long-lasting music playback performance that comes... | 11207 | Industry News | Ecosystem of Partners Fosters the Adoption of Class D Audio Amplifier Technology | Long-lasting music playback performance that comes in compact, cost-effective, and power-efficient designs, is indispensable, especially for battery-powered applications. Infineon recently introduced its latest generation of MERUS multilevel Class D audio amplifiers. Several ecosystem partners of Infineon are now ready to support interested customers with their design-in efforts. Partnering with the experts, the company aims to boost the adoption of the new and innovative technology. Infineon's Class D audio amplifiers enable high-fidelity sound playback with a unique Class D modulation of up to 5 different output voltage levels. "The ability to drive 2 x 37 W at full power, while supporting inductor-less, low EMI outputs and an idle power level at one-tenth of competitive products, offers OEM's and ODM's unique benefits," said Dafydd Roche, Director Marketing of Class-D Audio at Infineon. "These benefits include smaller form factor products and lower system costs by removing big, bulky inductors and shielding and by lowering battery capacity for the same playback hours. Our ecosystem partners complement the system solutions we can offer. With their decades of audio expertise, they are a unique addition to design-in and product support of our MERUS amplifier generations, enabling customers a faster time-to-market." | 17.01.2023 15:00:00 | Jan | news_2023-02-15_11.jpg | \images\news_2023-02-15_11.jpg | https://www.infineon.com/cms/en/about-infineon/press/market-news/2023/INFPSS202301-051.html | infineon.com |
| Distribution Award for Growth in EMEA Region | Avnet Abacus has won a distribution award for high... | 11205 | Industry News | Distribution Award for Growth in EMEA Region | Avnet Abacus has won a distribution award for highest growth across Bourns' distribution network in the EMEA region. At a recent event, Bourns presented a series of awards to recognize its top-performing distribution partners that have contributed to its sales and business growth over the past 18 months in the EMEA region. Across a different range of criteria, Avnet Abacus won the award for the 'Highest Percentage Network Share Growth'. Adam Chidley, Senior Marketing Manager, was awarded MVP for his long-term relationship and commitment to Bourns, built over many years of hard work and dedication to driving an excellent team of Supplier Development Managers. Serving a broad range of markets including automotive, industrial, consumer, communications and non-critical life support medical, Bourns is a leading maker of position and speed sensors, circuit protection solutions, magnetic components, microelectronic modules, panel controls and resistive products. "Bourns has been a long-term supplier and partner of Avnet Abacus and brings a world-renown surety for innovative and high-quality passive components," said Hagen Goetze, Senior Director Marketing at Avnet Abacus. "This award is a recognition of our efforts across these challenging times in the market over the past couple of years, Avnet has worked hard to cement its position as one of the leading distribution sales arms for Bourns on a global and European basis." | 17.01.2023 13:00:00 | Jan | news_2023-02-15_9.jpg | \images\news_2023-02-15_9.jpg | https://www.avnet.com/wps/wcm/connect/onesite/a4ca29f4-7014-4388-9c17-fe580c2dafff/Avnet-Abacus-garners-distribution-award-from-Bourns-EN-Document.pdf?MOD=AJPERES&CVID=on55lY9 | avnet.com |
| Solution Enables Accurate Billing for Electric Vehicle Charging | A major step forward in supporting the deployment ... | 11173 | Industry News | Solution Enables Accurate Billing for Electric Vehicle Charging | A major step forward in supporting the deployment of fast electric vehicle (EV) chargers in North America, the bi-directional DCBM will enable makers of electric vehicle charging stations (EVCSs) to accelerate their certification for DC metering requirements following Certified Test and Evaluation Professional/National Type Evaluation Program (CTEP/NTEP) certification. The DCBM will simplify the process of the manufacturers having to qualify their own charging stations for UL listed certification and, for extra peace of mind, will undergo a fresh audit every quarter. Capable of monitoring current, voltage, temperature and energy, the meter has been designed with data security, e-mobility, digitization and flexibility in mind and is a UL recognized component for the United States and Canada. The DCBM 400/600 complies with the standards UL 61010 and UL 810 with its certification in the FTRZ category for EV applications. To achieve this certification, the meter had to pass reinforced insulation tests, temperature testing of all its components and sub-assemblies, testing for protection against electric chock, durability of markings tests, equipment temperature limit tests and resistance to heat/fire risk tests. Says Claude Champion, General Manager at LEM USA Inc.: "The US and Canadian markets for EVs are continually expanding but this growth could be held back by insufficient access to rapid DC charging stations. LEM understands exactly what the sector needs and has worked closely with EVCS manufacturers and installers when developing solutions like the DCBM 400/600. We are ready to help make a zero-carbon future possible for North America." | 17.01.2023 10:00:00 | Jan | news_2023-02-01_4.jpg | \images\news_2023-02-01_4.jpg | https://www.lem.com/en/ev-chargers | lem.com |
| Radiation-Tolerant Power Management Device Targeting Low-Earth Orbit Space Applications | Building on its existing radiation-tolerant portfo... | 11213 | Product Release | Radiation-Tolerant Power Management Device Targeting Low-Earth Orbit Space Applications | Building on its existing radiation-tolerant portfolio, Microchip Technology announces the introduction of its first commercial-off-the-shelf (COTS) rad-tolerant power device with the MIC69303RT 3A Low-Dropout (LDO) Voltage Regulator. The high-current, low-voltage MIC69303RT is a power management solution targeting LEO and other space applications. The device is available for prototype sampling in both plastic and hermetic ceramic to support the requirements of the mission. The MIC69303RT is based on proven COTS devices, making it easier to conduct preliminary evaluation and early development. Operating from a single low-voltage supply of 1.65 to 5.5 volts, the device can supply output voltages as low as 0.5V at high currents, offering high-precision and ultra-low dropout voltages of 500 mV under extreme conditions. The MIC69303RT is a companion power source solution for Microchip's radiation-tolerant space-qualified microcontrollers such as the SAM71Q21RT and PolarFire FPGAs including the RTPF500TLS. "The MIC69303RT is Microchip's first rad-tolerant power management device with a hermetic ceramic package, latch-up immunity and 50 Krad total dose robustness," said Bob Vampola, vice president of Microchip's aerospace and defense business unit. "Microchip has over 60 years of space flight heritage in a comprehensive portfolio that allows customers to choose products designed to work together and accelerate their design processes." | 17.01.2023 08:30:00 | Jan | news_2023-02-15_18.jpg | \images\news_2023-02-15_18.jpg | https://www.microchip.com/en-us/about/news-releases/products/microchip-launches-radiation-tolerant-power-management-device | microchip.com |
| Insulation Test System up to 30kV | EMC Partner is offering an impulse insulation test... | 11186 | Product Release | Insulation Test System up to 30kV | EMC Partner is offering an impulse insulation tester 1.2/50 µs from 500V to 30kV with integrated breakdown detection directly on generator or remote on the test object. Colour touch panel control with data collection and reporting are included. Optional impedances up to 5kΩ. The INS-1250 family of impulse insulation testers is designed for material insulation, components and electrical equipment safety in both development and production environments. The device features high accuracy internal or external measurement systems, programmable to detect breakdown with pass/fail criteria based on voltage and current impulse integral. Personnel safety is ensured through an emergency stop, warning lamp and test cabinet, disabling high voltage circuits when activated. | 15.01.2023 10:30:00 | Jan | news_2023-02-01_17.jpg | \images\news_2023-02-01_17.jpg | https://www.emc-partner.com/ins-series | emc-partner.com |
| Battery Experts Forum Announces Date and Location | The Battery Experts Forum will take place in 2023 ... | 11181 | Event News | Battery Experts Forum Announces Date and Location | The Battery Experts Forum will take place in 2023 from 07th – 09th November at the Wissenschafts- und Kongresszentrum Darmstadt (also known as Darmstadtium). As part of the networking event, the Who's Who of the international battery industry will meet for the 18th time this year. True to its motto "Charge up your knowledge", the event will focus on an exchange at the highest scientific level within the framework of the associated three-day conference. Anticipation of inspiring impulses, in the form of keynotes, tutorials and specialist presentations, will be aroused by topics such as recycling, current trends/world market, e-mobility, storage technologies and charging. In addition, various companies along the entire value chain of a battery - from cell manufacturers to OEMs - will present themselves on the modern and attractive exhibition area of the congress center and showcase materials, components, product innovations, test procedures, recycling processes and designs. As a must-have event for the industry, the Battery Experts Forum offers a combination of insider news with the highest scientific standards in the conference, latest trends in the exhibition and the chance to meet the experts of the industry up close, not only in the presentations but also during the networking events. | 13.01.2023 18:00:00 | Jan | news_2023-02-01_12.jpg | \images\news_2023-02-01_12.jpg | https://www.battery-experts-forum.com/index.php/en/ | battery-experts-forum.com |
| Transient Overvoltage Test on a 525kV DC Cable System | Nexans and SuperGrid Institute have recently perfo... | 11209 | Industry News | Transient Overvoltage Test on a 525kV DC Cable System | Nexans and SuperGrid Institute have recently performed a successful transient overvoltage test (TOV) on a 525kV DC cable system in accordance with new High Voltage Direct Current (HVDC) recommendations. The DC cable system, produced and installed by Nexans, successfully passed several sequences of damped oscillating voltage tests at both 350 Hz and 6 kHz using SuperGrid Institute's High Voltage testing facility. This is a milestone for the development of a resilient interconnected European grid and the integration of renewable energy. To reach its ambitious target, Europe needs to connect a substantial amount of renewables to the grid (450 GW of offshore wind by 2050). HVDC cables will play a major role in the infrastructure necessary for renewable energy integration. Multi-terminal topologies, mixed cable overhead line systems, and hybrid AC & DC grids will progressively reinforce the single point-to-point HVDC links currently being built, increasing the reliability requirements for HVDC cable systems. HVDC cable systems might be subject to system-specific transient overvoltage (TOV) during disrupting events such as a fault in a converter station or a failure to ground the cable itself. Over the past several years, work has been undertaken to list and classify the most common TOV waveforms into a new CIGRE recommendation. The main European high-voltage laboratories have designed suitable test setups to adapt to clients' requirements and perform a wide range of TOV tests. Nexans and SuperGrid Institute have recently performed their first TOV test on a 525kV DC cable system, consisting of two external terminations, two joints, and an extruded DC cable. The DC cable system produced and installed by Nexans successfully passed several sequences of zero-crossing damped over voltage tests at both 350 Hz and 6 kHz. | 12.01.2023 17:00:00 | Jan | news_2023-02-15_13.jpg | \images\news_2023-02-15_13.jpg | https://www.supergrid-institute.com/2023/01/12/nexans-supergrid-institute-first-transient-overvoltage-test-525kv-dc-cable-system/ | supergrid-institute.com |
| Powerful Filter Simulation with SPICE | Today, a successful circuit design is almost alway... | 11189 | Product Release | Powerful Filter Simulation with SPICE | Today, a successful circuit design is almost always preceded by a simulation. However, a simulation is only as good as the data available. SCHURTER offers sophisticated simulation models for several of its single- and three-phase common-mode chokes. With these advanced simulation models, it is possible to precisely determine the effect the choke has in solving noise problems in an electrical circuit. With detailed SPICE simulation models, SCHURTER offers reliable support for the safe and cost-efficient development of electronic circuits using current compensated or linear chokes. The respective damping curves, SPICE models, and mechanical CAD models are available. Circuital simulation is a key element for electronics design and is supported by various computer-based tools. A proven, fast processing tool for this is SPICE (Simulation Program with Integrated Circuit Emphasis), which was first presented in 1973 at the University of California, Berkeley. This program has been further developed over the last decades, and it is now a widely used program that calculates algorithmic approximated solutions for analog, digital and mixed electrical circuits. | 12.01.2023 12:30:00 | Jan | news_2023-02-01_20.jpg | \images\news_2023-02-01_20.jpg | https://www.schurter.com/en/products-and-solutions/components/emc-products/common-mode-chokes/spice-library | schurter.com |
| Multi-Year Agreement for Delivery of Silicon Carbide Materials | Infineon is extending its cooperation with silicon... | 11175 | Industry News | Multi-Year Agreement for Delivery of Silicon Carbide Materials | Infineon is extending its cooperation with silicon carbide (SiC) suppliers. The German-based semiconductor manufacturer has signed a multi-year-supply and cooperation agreement with Resonac Corporation (formerly Showa Denko K.K.), complementing and expanding the announcement of 2021. The set of contracts will deepen the long-term partnership on SiC material. According to the agreement, Resonac will supply Infineon with SiC materials for the production of SiC semiconductors, covering a double-digit share of the forecasted demand for the next decade. While the initial phase focuses on 6" SiC material supply, Resonac will also support Infineon's transition to 8" wafer-diameter during the later years of the agreement. As part of the cooperation, Infineon will provide Resonac with intellectual property relating to SiC material technologies. The Infineon - Resonac partnership contributes to supply chain stability and will support the rapid growth of the emerging semiconductor material SiC. "The business opportunities in the area of renewable energy generation and storage, electromobility and infrastructure are enormous for the years to come. Infineon is doubling down on its investments into SiC technology and product portfolio, to proliferate the most comprehensive product offering to its customers. We are very happy that our partnership with Resonac will strongly support our market-leading position," said Peter Wawer, President of Infineon's Industrial Power Control division. | 12.01.2023 12:00:00 | Jan | news_2023-02-01_6.jpg | \images\news_2023-02-01_6.jpg | https://www.infineon.com/cms/en/about-infineon/press/press-releases/2023/INFXX202301-050.html | infineon.com |
| Aly Mashaly Appointed Director Application and Technical Solution Center in Europe | As of January 1st, Aly Mashaly has succeeded Günte... | 11170 | People | Aly Mashaly Appointed Director Application and Technical Solution Center in Europe | As of January 1st, Aly Mashaly has succeeded Günter Richard as Director of ROHM's European Application and Technical Solution Center (ATSC). Günter Richard has retired after 32 years working for ROHM. Before having joined ROHM in 2015, Aly Mashaly has gained more than 20 years of experience in the electronics industry. He is an expert in power electronics, especially in the field of automotive applications. Also, he has worked as a development engineer and project manager in the fields of e-mobility and aerospace applications for several years. Mashaly is also a regular speaker at various conferences, including PCIM, ECPE, EPE and CS International. He holds degrees from the Ain Shams University Cairo and Leibniz University Hanover where he has studied electrical engineering. For his new role at ROHM, he has set himself ambitious goals: "With our highly skilled team, technical services and high quality products we strive for excellence to be a competent partner to our customers. On top, we want to be a supplier and partner for innovative solutions to help our society to overcome some pressing challenges of our time," states Mashaly. "I would also like to express my gratitude to my predecessor Günter Richard who has established the Application and Technical Solution Center back in 2019 and who has made the transition very easy to me," adds Mashaly. Aly Mashaly is now directly reporting to Wolfram Harnack, President of ROHM Semiconductor Europe: "Based on his huge amount of proven technical experience as well as his demonstrated leadership skills and commitment towards ROHM, I'm convinced that Mr. Mashaly will bring the ATSC and the technical customer service involved to the next level," concludes Wolfram Harnack. | 12.01.2023 07:00:00 | Jan | news_2023-02-01_1.jpg | \images\news_2023-02-01_1.jpg | https://www.rohm.com/news-detail?news-title=rohm-appoints-aly-mashaly-as-new-director-application-and-technical-solution-center-in-europe&defaultGroupId=false | rohm.com |
| Chae Lee Appointed Chief Executive Officer | Tagore Technology announced the appointment of Cha... | 11176 | People | Chae Lee Appointed Chief Executive Officer | Tagore Technology announced the appointment of Chae Lee as Chief Executive Officer. Chae Lee brings more than 35 years of experience to Tagore Technology. Prior to joining Tagore, Mr. Lee was President and CEO of Insyte Systems. Before that, Mr. Lee was Senior Vice President and General Manager of NXP's Secure Interface and Power Solutions Business Unit where he grew the business unit's revenue to $1B. Prior to NXP, Mr. Lee spent 16 years at Maxim Integrated Products where he developed multiple new product lines at Maxim and as Senior Vice President and General Manager of the Mobility Group, grew its revenue from $350M to $1B. Mr. Lee graduated from the University of Missouri-Rolla with a Bachelor of Science degree in Electrical Engineering. "I am pleased to welcome Chae to Tagore," said Oleg Khaykin, Tagore Technology's Chairman. "Chae is an accomplished technology leader with an impressive track record." Mr. Khaykin added, "The Board feels Chae is an excellent choice to leverage our recent progress and lead the company to achieve our aggressive growth strategy and expanded profitability." CEO and co-founder of Tagore Technology, Amitava Das added: "As co-founders of Tagore, Manish Shah and I are delighted to welcome Chae to the Tagore family as we take the company to the next level in its growth trajectory." | 11.01.2023 13:00:00 | Jan | news_2023-02-01_7.jpg | \images\news_2023-02-01_7.jpg | https://tagoretech.com/page.php?page-id=25 | tagoretech.com |
| Autonomous Technology in Commercial Trucking Fleets | Many industry analysts believe long haul commercia... | 11210 | Industry News | Autonomous Technology in Commercial Trucking Fleets | Many industry analysts believe long haul commercial trucking is likely to be the first major use case of autonomous vehicle technology as highway driving is a less complicated problem to solve compared to the many nuances of negotiating secondary roads and city streets. Additionally, from an economic standpoint, the trucking industry can benefit more from vehicle autonomy. The cost of an autonomous driving system is more easily amortized in a truck that operates for between one million and two million miles. Plus, the average human-driven truck is only used for 7.5 hours a day, due to hours of service limitations. An autonomous truck can double or even triple truck utilization, only stopping to refuel, receive, and pick up new loads. Against that backdrop Kodiak Robotics was launched in 2018 with a focus of developing autonomous technology for the long-haul environment that can be integrated into carriers' fleets. Kodiak's autonomous solution, the kodiakDriver, includes a modular hardware system, known as SensorPods, that integrate the majority of sensors needed to "see" its environment using the truck's traditional mirror-mount points. The pods' modular design allows them to be swapped on and off within minutes, which maximizes fleet uptime without the need for specially-trained technicians to install the devices and recalibrate the sensor network. Kodiak integrates autonomous technology into commercial trucking fleets powered by Vicor modules. | 10.01.2023 18:00:00 | Jan | news_2023-02-15_14.jpg | \images\news_2023-02-15_14.jpg | https://www.vicorpower.com/press-room/kodiak-robotics-autonomous-long-haul-transportation | vicorpower.com |
| 70W and 160W External AC-DC Power Adapters | TDK announces the addition of the TDK-Lambda brand... | 11190 | Product Release | 70W and 160W External AC-DC Power Adapters | TDK announces the addition of the TDK-Lambda brand DTM70 and DTM160 series to the DTM family of compact medical and industrial AC-DC power adapters that are available in various power classes from 36W to 300W. Both series are available in Class I versions with a protective earth terminal on the input and Class II versions with double insulation protection. The adapters are housed in a robust plastic case with dimensions of only 120 x 52 x 31mm (DTM70) and 150 x 70 x 38mm (DTM160). The DTM70 is available with 12V, 15V, 18V, 24V, 36V and 48V output voltages and the DTM160 with 12V, 24V, 36V and 48V. The DTM70 and DTM160 series are suitable for 2MOPP medical applications and general industrial use. Both adapter series are certified to the IEC/EN/UL 60601-1 medical safety standard for clinical applications. In addition, IEC 60601-1-11 certification is available for all Class II versions, allowing these adapters to be used in home healthcare applications. For all versions, EMC is tested according to IEC 60601-1-2 Ed 4, which simplifies use with medical equipment. For industrial and ICT (Information and Communication Technology) applications, all models are tested according to IEC/BS/EN 62368-1 and are certified for installation altitudes up to 5000m. One special feature is the standard locking DIN output connector, which prevents unintentional disconnection of the output voltage of the adapter. Other connector versions and cable assemblies are available on request. | 10.01.2023 13:30:00 | Jan | news_2023-02-01_21.png | \images\news_2023-02-01_21.png | https://www.emea.lambda.tdk.com/uk/news/article/19181 | lambda.tdk.com |
| Elif Balkas Appointed Chief Technology Officer | Wolfspeed announced the promotion of Elif Balkas t... | 11204 | People | Elif Balkas Appointed Chief Technology Officer | Wolfspeed announced the promotion of Elif Balkas to Chief Technology Officer, succeeding the late Dr. John Palmour, a co-founder of Wolfspeed. In her role as Vice President of Research and Development in Wolfspeed's Materials organization, Balkas shaped the company's technical strategy on wide bandgap materials and drove its development execution to maintain Wolfspeed's position as a leader in Silicon Carbide for Power and RF device applications. She has overseen multiple significant technology milestones during her tenure at the company, including the development of 150mm and 200mm boule growth systems and processes, the dramatic reduction in crystal defect levels that saw higher device yields, and advancements in wafer processing. "I'm excited to continue building upon the legacy that John created and unlock new innovations and applications for Silicon Carbide," said Balkas. "It's an exciting time of growth at Wolfspeed and I look forward to the new challenge of finding greater efficiencies as we continue to expand the reach of our technology." Balkas brings more than 20 years of experience in the technology industry. Prior to Wolfspeed, she served in a variety of leadership positions in R&D and operations, focusing on developing Silicon Carbide crystal growth and GaN technologies that are scalable for manufacturing purposes and that enable more efficient and powerful electronic systems. She received her Ph.D. in Materials Science from North Carolina State University and is a co-founder of the Wolfspeed Women's Initiative, an employee resource group focused on encouraging, developing and supporting women who lead the way in innovation. | 10.01.2023 12:00:00 | Jan | news_2023-02-15_8.jpg | \images\news_2023-02-15_8.jpg | https://www.wolfspeed.com/company/news-events/news/wolfspeed-appoints-elif-balkas-as-new-chief-technology-officer/ | wolfspeed.com |
| SiC MOSFETs to be Used in Inverters for Electric Vehicles | ROHM has recently announced the adoption of its 4t... | 11165 | Industry News | SiC MOSFETs to be Used in Inverters for Electric Vehicles | ROHM has recently announced the adoption of its 4th Generation SiC MOSFETs and gate driver ICs in electric vehicle inverters from Hitachi Astemo a Japanese automotive parts manufacturer. Especially for EVs, the inverter, which plays a central role in the drive system, needs to be made more efficient to extend the cruising range and reduce the size of the onboard battery, increasing the expectations for SiC power devices. ROHM's latest 4th Generation SiC MOSFETs deliver improved short-circuit withstand time along with the low ON-resistance, making it possible to extend the cruising range of electric vehicles by reducing power consumption 6% vs IGBTs (as calculated by the international standard WLTC fuel efficiency test) when installed in the main inverter. At the same time, Hitachi Astemo, which has been developing advanced technologies for vehicle motors and inverters for a number of years, already enjoys a considerable track record in the increasingly popular EV market. However, this marks the first time SiC devices will be adopted for the main inverter circuit to further improve performance. The inverters are slated to be supplied to automakers from 2025, starting in Japan then expanding overseas. Going forward, as a leading supplier of SiC power devices, ROHM will continue to strengthen its lineup and provide power solutions that contribute to technical innovation in vehicles by combining peripheral device technologies such as control ICs designed to maximize performance. | 10.01.2023 10:30:00 | Jan | news_2023-01-15_14.jpg | \images\news_2023-01-15_14.jpg | https://www.rohm.com/news-detail?news-title=2023-01-10_news_astemo&defaultGroupId=false | rohm.com |
| Christopher Bohn Named President | Tektronix has promoted Christopher Bohn to Preside... | 11172 | People | Christopher Bohn Named President | Tektronix has promoted Christopher Bohn to President of the global test and measurement company. Bohn most recently served as the Vice President Global Sales & Operations, where he was responsible for delivering global revenue growth and working cross-functionally to drive integration and customer focus between all revenue related functions. Bohn brings to the role a breadth of commercial, strategic, and continuous improvement experience and expertise that he gained over 15 years in global roles of increasing responsibility across Fortive's two largest operating companies, Fluke and Tektronix. "I'm extremely excited to continue the growth momentum at Tektronix by bringing outstanding solutions and services to our customers that help them accelerate technology advancements in the world," says Bohn. "For over 75 years, Tektronix has been at the forefront of helping customers bring new technologies to market and I'm happy to lead an organization with such a rich tradition of technology leadership." "As an engineer, veteran, and business leader, I'm drawn not only to technological innovation, but also to the culture and processes that have supported successful companies," says Bohn. "That culture - and the business processes that enable growth in both revenue and innovation - are what truly set an organization apart. I'm proud that Tektronix continues to invest in the best people, products, performance, and quality for our customers." | 10.01.2023 09:00:00 | Jan | news_2023-02-01_3.jpg | \images\news_2023-02-01_3.jpg | https://www.tek.com/en/news/tektronix-names-christopher-bohn-president_jan_10_2023 | tek.com |
| Acquisition of British Manufacturer of Wound Magnetic Components | KAMIC Group has acquired, through its subsidiary E... | 11179 | Industry News | Acquisition of British Manufacturer of Wound Magnetic Components | KAMIC Group has acquired, through its subsidiary ETAL (UK), all the shares in Avon Magnetics Ltd. The sellers are John and Lynn Anderson. Avon Magnetics is a British manufacturer of wound magnetic components such as transformers, inductors and coils, with associated designs. Most components are developed specifically for customer-unique applications. Operations are based in Christchurch, Dorset on the English south coast, where the company has its own production facility. Avon Magnetics' history goes back to the 1960s but the company has operated under its present name since 1992. Over the years the company has built up expertise and is certified according to AS9100 revision D and ISO9001:2015, which is reflected in the company's strong position as a supplier to industries such as aerospace, defence and medical technology. Avon Magnetics has some 50 employees and annual sales of approximately GBP 2.5 million. Following the acquisition, Avon Magnetics is part of KAMIC Group's Magnetics business area led by Dan Phelan. "Avon Magnetics is a highly reputed player with strong skills in the design, development and production of wound magnetic components for use in customer-unique and safety critical applications. Avon Magnetics will therefore be a valuable addition to our current operations in the Magnetics business area," says Fredrik Celsing, President and CEO of KAMIC Group. | 09.01.2023 16:00:00 | Jan | news_2023-02-01_10.jpg | \images\news_2023-02-01_10.jpg | https://kamicgroup.com/index.php/en/2023/01/09/acquisition-of-avon-magnetics/ | kamicgroup.com |
| Automotive-Grade Devices Run Cooler in Surface-Mount SMIT Package | STMicroelectronics has introduced five power-semic... | 11169 | Product Release | Automotive-Grade Devices Run Cooler in Surface-Mount SMIT Package | STMicroelectronics has introduced five power-semiconductor bridges in popular configurations, housed in ST's ACEPACK SMIT package that eases assembly and enhances power density over conventional TO-style packages. Engineers can choose from two STPOWER 650V MOSFET half bridges, a 600V ultrafast diode bridge, a 1200V half-controlled full-wave rectifier, and a 1200V thyristor-controlled bridge leg. All devices meet automotive-industry requirements and are suitable for electric vehicle on-board chargers (OBC) and DC/DC converters, as well as industrial power conversion. ST's ACEPACK SMIT surface mounted package delivers the easy handling of an insulated package with the thermal efficiency of an exposed drain. It allows direct-bonded copper (DBC) die attachment for efficient top-side cooling. The 4.6 cm2 exposed metal topside of the ACEPACK SMIT permits easy attachment of a planar heatsink. This creates a space-saving low profile that maximizes thermal dissipation for greater reliability at high power. The module and heatsink can be placed using automated inline equipment, which saves manual processes and boosts productivity. While minimizing the stack height and enhancing power density, the topside cooling design and 32.7mm x 22.5mm package footprint allow 6.6mm lead-to-lead creepage distance. The tab-to-lead insulation is 4500Vrms. The package also has low parasitic inductance and capacitance. The SH68N65DM6AG and SH32N65DM6AG 650V-MDmesh DM6 MOSFET half bridges now available in ACEPACK SMIT are AQG-324 qualified. Their Rds(on) (max) of 41m? in the SH68N65DM6AG and 97m? in the SH32N65DM6AG ensures high electrical efficiency and low thermal dissipation. They can be used in DC/DC converters for both OBC and high voltage to low voltage section. Their multi-role flexibility helps streamline inventory and simplify procurement. | 09.01.2023 14:30:00 | Jan | news_2023-01-15_18.jpg | \images\news_2023-01-15_18.jpg | https://newsroom.st.com/media-center/press-item.html/n4508.html | st.com |
| Vertical GaN Sample Shipments to Customers Commencing in Q1 2023 | Odyssey Semiconductor announces product sample fab... | 11177 | Industry News | Vertical GaN Sample Shipments to Customers Commencing in Q1 2023 | Odyssey Semiconductor announces product sample fabrication is complete with shipments to customers commencing in Q1 2023. "Our backlog of customers has been eagerly waiting for these vertical GaN product samples. I'm proud to report that fabrication was completed as planned in Q4 2022 and now the samples are being prepared for shipment to customers later this quarter," said Mark Davidson, Odyssey's Chief Executive Officer. "We will work closely with these initial customers to gain valuable feedback on their product features. We expect to secure product development agreements with customers by the end of Q2 2023." Odyssey's approach to vertical GaN will offer even greater commercial advantages over silicon than silicon carbide or lateral GaN. Vertical GaN offers a 10x advantage over silicon carbide (SiC) at performance and cost levels unattainable by the competing technologies. The market the Company is pursuing is large and fast growing. The 650 volt segment is the larger market today, expected to grow at a 20% compound annual growth rate. The 1200 volt product market segment is expected to grow faster at 63% CAGR and will become the larger market in the second half of this decade. Together, the 650 and 1200 volt power device market is expected to exceed $5 billion in 2027, a 40% combined CAGR according to Yole Group, a French market research firm. | 09.01.2023 14:00:00 | Jan | news_2023-02-01_8.png | \images\news_2023-02-01_8.png | https://www.odysseysemi.com/news-media/press-releases/detail/43/odyssey-semiconductor-announces-vertical-gan-sample | odysseysemi.com |
| Power Adapter Reference Design with TO-220 GaN FETs | Transphorm announced availability of its 240W Powe... | 11188 | Product Release | Power Adapter Reference Design with TO-220 GaN FETs | Transphorm announced availability of its 240W Power Adapter Reference Design. The TDAIO-TPH-ON-240W-RD deploys a CCM Boost PFC + Half-Bridge LLC topology to deliver a peak power efficiency of over 96 percent with a power density up to 30 W/in3. Transphorm's design uses three SuperGaN FETs (TP65H150G4PS) each with an on-resistance of 150 milliohms. The GaN FET comes as a 3-lead TO-220, a well-known and long-trusted transistor package that offers superior thermals at lowline for higher current power systems running PFC configurations. The reference design is intended to simplify and quicken power system development for applications such as high-power density AC-to-DC power supplies, fast chargers, IoT devices, laptops, medical power supplies, and power tools. The TDAIO-TPH-ON-240W-RD is a 240W 24V 10A AC-to-DC power adapter reference design. It pairs the TP65H150G4PS GaN FETs with onsemi's off-the-shelf NCP1654 CCM PFC controller and NCP1399 LLC controller. The design uses a 25 millimeter heatsink that produces a power density of over 24 W/in3. The power density can increase by approximately 25 percent to 30 W/in3 depending on the heatsink design. This high power density and efficiency range is primarily due to the FET's packaging as Transphorm offers the only high voltage GaN devices in a TO-220 today. Power adapters, along with all universal AC-to-DC power supplies, require high current at lowline (i.e., 90 Vac) which can require paralleling two PQFN packages (as typically seen with e-mode GaN) to achieve the desired power output. This method reduces a power supply's power density while requiring 2x part count. Transphorm's TO-220 packages mitigate this, thus providing unparalleled power density at a lower cost - a result not currently possible with e-mode GaN. | 05.01.2023 12:30:00 | Jan | news_2023-02-01_19.jpg | \images\news_2023-02-01_19.jpg | https://www.transphormusa.com/en/news/240w_power_adapter_refdesign/ | transphormusa.com |
| Medical and Industrial Power Conversion Platforms | Advanced Energy Industries introduced two ranges o... | 11167 | Product Release | Medical and Industrial Power Conversion Platforms | Advanced Energy Industries introduced two ranges of AC-DC power supplies for critical medical and industrial equipment. The SL Power NGB800 800 W and NGB1200 1200 W families are optimized to address the performance, power, size, reliability and compliance requirements of medical and industrial applications. The power supplies combine compact form factors and typical efficiencies above 90%. With full medical and industrial safety and EMC approvals, they comply with IEC 60601-1-2 4th edition covering medical equipment and applications operating in heavy industrial areas. "Medical and industrial OEMs want to reduce the size, improve the performance and extend the operating life of their equipment while minimizing time-to-market," said Conor Duffy, vice president of marketing, medical power products at Advanced Energy. "With their high efficiencies, small form factors, compliance with all relevant standards and long operating lives, the NGB family of power supplies enable equipment designers to address these challenging requirements. Deep engineering and integration support from Advanced Energy's technical teams further speed development cycles." Designed to meet the lifetime reliability requirements of equipment ranging from medical imaging and patient monitoring to industrial automation, the NGB families offer an MTBF in excess of 500,000 hours and come with a three-year warranty. Long-term reliability is further supported by the specification of high-quality electrolytic capacitors with operating lives over seven years. These power supplies can accommodate a wide 85 – 264 VAC input range and offer output voltages from 12 Vdc to 48 Vdc. Power supplies in the NGB800 family are convection cooled, while the NGB1200 units feature an integrated, low-noise fan. | 05.01.2023 12:30:00 | Jan | news_2023-01-15_16.jpg | \images\news_2023-01-15_16.jpg | https://ir.advancedenergy.com/news/advanced-energy-launches-medical-and-industrial-power-conversion-platforms-with-leading-power-density/da163d3b-4eb2-48ef-9538-e7e9c188615e/ | advancedenergy.com |
| SiC Technology Enhances Performance of DC Optimizers | onsemi and Ampt LLC announced their collaboration ... | 11157 | Industry News | SiC Technology Enhances Performance of DC Optimizers | onsemi and Ampt LLC announced their collaboration to meet the high demand for DC string optimizers. Ampt uses onsemi's N-Channel SiC MOSFET, part of the EliteSiC family of silicon carbide (SiC) technologies, in its DC string optimizers for critical power switching applications. Ampt string optimizers are used in large-scale PV power plants, enabling lower-cost and higher performing solar and DC-coupled energy storage systems that are collocated within the solar power plant. The string optimizers deliver power from the PV array at a high and fixed voltage for system voltages ranging from 600 to 1500 VDC, reducing the overall current requirements and cost of the power plant. Ampt optimizers enable higher round-trip – charging and discharging – efficiency in the energy storage system and solar power plant by leveraging onsemi's latest SiC MOSEFT technology with lowest ON resistance and switching loses. "Incorporating onsemi's EliteSiC technology into our DC optimizers helps utility scale solar developers and owners improve their project economics," said Levent Gun, CEO of Ampt. "Clearly, the product performance was a critical decision point for us, but onsemi's technical support during the design phase and their ongoing supply assurance to support Ampt's rapid scaling are the hallmarks of a strong partner." | 05.01.2023 11:00:00 | Jan | news_2023-01-15_6.png | \images\news_2023-01-15_6.png | https://www.onsemi.com/company/news-media/press-announcements/en/onsemi-and-ampt-collaboration-increases-efficiency-for-utility-solar-providers | onsemi.com |
| Full Brick Power Factor Correction AC-DC Module | TDK Corporation announces the introduction of the ... | 11164 | Product Release | Full Brick Power Factor Correction AC-DC Module | TDK Corporation announces the introduction of the TDK-Lambda brand PF1500B-360 full brick power module. Rated at 1512W with an input of 170 to 265V or 1008W from 85 to 265V, the module delivers a non-isolated, regulated 360Vdc output with a 0.98 power factor. The PF1500B-360 is ideally suitable for high voltage power systems using isolated DC-DC converters in a distributed power architecture configuration, or for loads requiring a high voltage source. Other applications include LED lighting, semiconductor fabrication and custom power supplies using power module-based solutions. The PF1500B-360 is packaged in the industry standard full brick footprint, measuring 116.8mm in length, 61mm wide and 12.7mm high (4.6 x 2.4 x 0.5 inches) enabling low profile designs. The module can operate reliably with baseplate temperatures of 100°C and in ambient temperatures of -40 to 85°C due to efficiencies of up to 96.5%. Standard features include a 10 - 16V 10mA auxiliary voltage, remote on/off, inverter good and a signal indicating the output voltage is more than 350V to enable isolated DC-DC converters to begin operating. Up to three modules may be connected in parallel with current sharing to provide additional power. The input and output to ground isolation is 2,500Vac. Safety certification is to the IEC/EN/CSA/UL 62368-1 standard and has CE / UKCA marks to the Low Voltage and RoHS Directives. With external circuitry the PF1500B-360 will meet radiated and conducted emissions and comply with the IEC 61000-4 immunity standards. | 05.01.2023 09:30:00 | Jan | news_2023-01-15_13.jpg | \images\news_2023-01-15_13.jpg | https://www.us.lambda.tdk.com/news/press-releases/20230105.html | lambda.tdk.com |
| Formula E Team Kicks Off Season 9 in Mexico City | Mouser Electronics cheers on the DS PENSKE Formula... | 11155 | Industry News | Formula E Team Kicks Off Season 9 in Mexico City | Mouser Electronics cheers on the DS PENSKE Formula E team as they kick off Season 9 at the Autodromo Hermanos Rodriguez track in Mexico City on January 14, 2023. With a race-ready surface and long corners, Mexico City is one of the fastest tracks on the calendar, featuring a mix of long and fast straights and a technical infield section through Foro Sol stadium. Mouser is partnering with the DS PENSKE team throughout the 2022–23 ABB FIA Formula E World Championship racing season in collaboration with TTI, Inc. and valued manufacturers Molex and KYOCERA AVX. The DS PENSKE team will be racing the new third-generation Formula E DS E-TENSE FE23, which combines high-performance, efficiency, and stability. The Gen3 cars feature a top speed of 280 kph, are 60 kg lighter than the Gen2 cars, and offer double the regen capacity - meaning more than 40% of the energy used in-race is via regeneration under braking. The team benefits from two past Formula E Champions driving its cars, the reigning World Champion Stoffel Vandoorne and the two-time Formula E Champion, Jean-Éric Vergne. | 04.01.2023 09:00:00 | Jan | news_2023-01-15_4.png | \images\news_2023-01-15_4.png | https://eu.mouser.com/newsroom/publicrelations-formula-e-mexico-city-2023final/ | mouser.com |
| Battery Cell and Pack Monitors | Texas Instruments introduced automotive battery ce... | 11163 | Product Release | Battery Cell and Pack Monitors | Texas Instruments introduced automotive battery cell and pack monitors, maximizing electric vehicle (EV) drive time and enabling safer operation. As EVs grow in popularity, advanced battery management systems (BMS) are helping overcome critical barriers to widespread adoption. With a focus on solving complex system design challenges, TI provides a comprehensive portfolio of BMS devices, enabling automakers to create a safer, more reliable driving experience and accelerate EV adoption. The BQ79731-Q1 battery cell monitor and BQ79718-Q1 battery pack monitor provide an accuracy and precision in measuring battery voltage, current and temperature to effectively determine the true range of a vehicle and increase the overall life and safety of the battery pack. "Automakers aim to get the most range possible out of their EVs, and accurate state-of-charge estimations are vital to achieve this," said Sam Wong, general manager for BMS at TI. "Our new devices bring substantially higher precision to voltage and current measurement, giving automakers confidence to accurately measure an EV's true range." | 04.01.2023 08:30:00 | Jan | news_2023-01-15_12.jpg | \images\news_2023-01-15_12.jpg | https://news.ti.com/ti-enables-automakers-to-take-full-advantage-ev-range-with-industrys-most-accurate-battery-cell-and-pack-monitors | ti.com |
| Part of Energy Industries Division to be Acquired | TÜV Rheinland signs an agreement to acquire ABB's ... | 11154 | Industry News | Part of Energy Industries Division to be Acquired | TÜV Rheinland signs an agreement to acquire ABB's UK technical engineering consultancy, part of ABB's Energy Industries division. TÜV Rheinland will integrate this part into its Industrial Services & Cybersecurity business in the UK. The transaction is expected to close in Q2 2023. ABB's UK technical engineering consultancy including a network of subcontractors and associates has around 160 people operating from two main sites in the northeast and the northwest of England. A specialist team of technical experts helps global energy customers improve process safety, equipment and asset integrity as well as technical design for new and existing industrial plants. The combined business will create a scalable, broad-based technical engineering provider delivering a full-service offer to the high hazard industries, supporting customers in the energy transition and energy security. "We look forward to creating growth, stability and opportunity at a time where we are seeing increased demand for sustainability, decarbonization and business continuity," said Gareth Book, Managing Director TÜV Rheinland UK. "ABB's UK technical engineering consultancy will complement the existing risk, safety and integrity management services provided by TÜV Rheinland. Our aim is to build upon the long-standing customer relationships and trust that ABB and TÜV Rheinland have established in the UK over the last two decades." | 04.01.2023 08:00:00 | Jan | news_2023-01-15_3.jpg | \images\news_2023-01-15_3.jpg | https://www.tuv.com/press/en/press-releases/acquisition-abb.html | tuv.com |
| Space Level SMD Inductor | Ideal for space and aerospace applications, the S0... | 11162 | Product Release | Space Level SMD Inductor | Ideal for space and aerospace applications, the S0603 inductor offers excellent temperature stability, High Q and Ultra High SRF values, Low Outgassing Properties and an Operating Temperature Range of -55 to +125 C degrees (higher operating temperatures available) - all in a super small rugged package. Our environmental testing lab conducts load life, thermal shock, powdered burn-in, short time overload, real time x-ray, and extreme temperature testing to guarantee the S0603's reliability in challenging environments. It's manufactured in our cleanroom and rigorously tested to MIL-STD-981 for the high performance criteria demanded in space flight. | 04.01.2023 07:30:00 | Jan | news_2023-01-15_11.jpg | \images\news_2023-01-15_11.jpg | https://delevan.com/web/index2.html | delevan.com |
| Silicon Carbide Devices Power Future Electric Vehicle Platforms | Wolfspeed announced the company will be supplying ... | 11152 | Industry News | Silicon Carbide Devices Power Future Electric Vehicle Platforms | Wolfspeed announced the company will be supplying Silicon Carbide devices to power future Mercedes-Benz Electric Vehicle (EV) platforms, enabling greater efficiency in the powertrain. Wolfspeed's semiconductors will be incorporated into next generation powertrain systems for several Mercedes-Benz vehicle lines. "Coming from a long-term technical collaboration history between our companies, we have now chosen Wolfspeed as one of our key partners for future Silicon Carbide devices, thus securing preferred long-term supply, technology and quality of this decisive semiconductor component for our electrification offensive," said Dr. Gunnar Güthenke, Head of Procurement and Supplier Quality for Mercedes-Benz. By leveraging Wolfspeed's expertise and Silicon Carbide devices to improve vehicle range and power, Mercedes-Benz plans to have some of the most efficient EVs on the road. "We are pleased to be supporting Mercedes-Benz, an organization with a long, successful history of providing world-class performance and luxury vehicles, as they introduce next-generation EVs to the market with highly efficient power systems," said Gregg Lowe, CEO of Wolfspeed. "We are continuing to invest in our manufacturing capacity to support a steepening demand curve for Silicon Carbide devices that will not only improve EV performance and drive greater consumer adoption, but also support the sustainability efforts of global automotive leaders like Mercedes-Benz." | 04.01.2023 06:00:00 | Jan | news_2023-01-15_1.jpg | \images\news_2023-01-15_1.jpg | https://www.wolfspeed.com/company/news-events/news/wolfspeed-silicon-carbide-devices-power-future-mercedes-benz-electric-vehicle-platforms/ | wolfspeed.com |
| MOSFET for Light Electric Vehicles | Magnachip Semiconductor Corporation ("Magnachip") ... | 11145 | Product Release | MOSFET for Light Electric Vehicles | Magnachip Semiconductor Corporation ("Magnachip") announced that the company has launched its eighth-generation 150V MXT Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) optimized for Light Electric Vehicle (LEV) motor controllers and battery management systems (BMSs). This MOSFET (MDT15N054PTRH) features Magnachip's eighth-generation trench MOSFET technology to lower RDS(on) by 28%, as compared to the previous generation. Based on the enhanced design of the core cell and termination, a high figure of merit can be achieved and an increase in the total gate charge can be avoided. MDT15N054PTRH is available in a surface mount device TO-Leadless (TOLL) package to reduce product size and improve heat dissipation. The energy efficiency is also significantly enhanced by fast switching, while enabling high power density. In addition, a guaranteed operating junction temperature from -55°C up to 175°C and a high level of avalanche ruggedness help the new MXT MOSFET to exceed the performance requirements of LEV motor controllers and BMSs. "Beginning in 2008 we have released more than 40 MOSFET products for motor controllers and battery management systems and, since 2017, most of them have been made for LEV applications," said YJ Kim, CEO of Magnachip. "As a provider of high-performance MOSFETs, Magnachip will continue to deliver innovative solutions that meet the sophisticated requirements of the market." | 30.12.2022 08:30:00 | Dec | news_2023-01-01_12.jpg | \images\news_2023-01-01_12.jpg | https://www.magnachip.com/magnachip-introduces-8th-gen-150v-mxt-mosfet-for-light-electric-vehicles/ | magnachip.com |