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| 1200 V SiC Schottky Barrier Diodes | Toshiba expanded its silicon carbide diode portfol... | 12123 | Product Release | 1200 V SiC Schottky Barrier Diodes | Toshiba expanded its silicon carbide diode portfolio with ten 1200 V Schottky barrier diodes (SBDs). The TRSxxx120Hx series, comprising five products housed in TO-247-2L packages and five in TO-247 packages, helps designers improve the efficiency of industrial equipment, including photovoltaic (PV) inverters, electric vehicle (EV) charging stations, and switching power supplies. By implementing an enhanced junction barrier Schottky (JBS) structure, the TRSxxx120Hx series allows a forward voltage (V<sub>F</sub>) of 1.27 V (typ). The merged PiN-Schottky incorporated into a JBS structure reduces diode losses under high current conditions. The TRS40N120H of the new series accepts a forward DC current (I<sub>F(DC)</sub>) of 40 A (max) and a maximum non-repetitive peak forward surge current (I<sub>FSM</sub>) of 270 A, with the maximum case temperature (T<sub>C</sub>) of all devices being +175 °C. Combined with the lower capacitive charge and leakage current, the products help improve system efficiency and simplify thermal design. For instance, at a reverse voltage (V<sub>R</sub>) of 1200 V, the TRS20H120H diode housed in the TO-247-2L package provides a total capacitive charge (Q<sub>C</sub>) of 109 nC and reverse current (I<sub>R</sub>) of 2 µA. | 25.09.2024 09:30:00 | Sep | news_2024-10-01_14.jpg | \images\news_2024-10-01_14.jpg | https://toshiba.semicon-storage.com/ap-en/semiconductor/product/diodes/sic-schottky-barrier-diodes/articles/3rd-generation-sic-schottky-barrier-diode.html | toshiba.semicon-storage.com |
| Meeting future Energy Demands | TTI IP&E – Europe is supplying Mean Well power com... | 12117 | Industry News | Meeting future Energy Demands | TTI IP&E – Europe is supplying Mean Well power components, including the very latest DHP-1UT-B(HV) mounting rack power shelf, to support electronics engineers designing and building the next generation of renewable and hydrogen energy systems. "EU Environmental regulations require 45% of Europe's energy generation to come from renewable sources by 2030," says Markus Lorenz, Director Industry Marketing, Industrial, TTI Europe. "To achieve this, green energy generated from wind turbines and solar panels must be stored efficiently. Hydrogen is also expected to play a major part in the transition towards a more sustainable future as using hydrogen power is the most efficient way to transport and store energy with higher density and over a longer time frame without losses." The Mean Well DHP-1UT-B(HV) mounting rack power shelf for standard 19" cabinets enables a reliable power supply in a modular design and is ideal for applications including electrolysis, distributed power architecture and EV charging stations. | 24.09.2024 13:00:00 | Sep | news_2024-10-01_8.jpg | \images\news_2024-10-01_8.jpg | https://www.ttieurope.com/content/ttieurope/en/about-tti/news-center/corporate-news/press-releases/2024/september/pr-09242024-tti-europe-stock-means-power-shelf-will-support-future-energy-demands.html | ttieurope.com |
| 4th Generation of SiC MOSFETs for up to 1200 V | STMicroelectronics has introduced its fourth gener... | 12124 | Product Release | 4th Generation of SiC MOSFETs for up to 1200 V | STMicroelectronics has introduced its fourth generation STPOWER silicon carbide MOSFET technology. While serving the needs of both the automotive and industrial markets, the technology is particularly optimized for traction inverters. These SiC MOSFET devices, which will be made available in 750 V and 1200 V classes, are said to "improve energy efficiency and performance of both 400 V and 800 V EV bus traction inverters, bringing the advantages of SiC to mid-size and compact EVs". The new generation SiC technology is also suitable for a variety of high-power industrial applications, including solar inverters, energy storage solutions and datacenters, significantly improving energy efficiency for these growing applications. Qualification of the 750 V class of the fourth generation SiC technology platform is already completed, and ST expects to complete qualification of the 1200 V class in the first quarter of 2025. Commercial availability of devices with nominal voltage ratings of 750 V and 1200 V will follow, allowing designers to address applications operating from standard AC-line voltages up to high-voltage EV batteries and chargers. The average die size of Generation 4 devices is 12-15% smaller than that of Generation 3, considering an R<sub>DS(on)</sub> at 25 °C. | 24.09.2024 10:30:00 | Sep | news_2024-10-01_15.jpg | \images\news_2024-10-01_15.jpg | https://www.st.com/en/power-transistors/stpower-sic-mosfets.html | st.com |
| Module Provider supports local Sports Team | Vincotech has extended its fruitful cooperation wi... | 12112 | Industry News | Module Provider supports local Sports Team | Vincotech has extended its fruitful cooperation with TSV Haching München into the upcoming season. The company has been a main sponsor and an active supporter of the club for two years now. Vincotech's backing for the local volleyball team echoes the company's philosophy. Committed to nurturing its ties to the community and championing the spirit of partnership at work and at play, Vincotech company sees its values reflected in this sport and in the aspirations of TSV Haching München's team of young international athletes. | 24.09.2024 08:00:00 | Sep | news_2024-10-01_3.jpg | \images\news_2024-10-01_3.jpg | https://www.vincotech.com/news/company-news/article/vincotech-sponsors-tsv-haching-for-the-third-year-running.html | vincotech.com |
| Research: Isolating Piezoelectric DC/DC Converters Without Transformers | Building on its earlier breakthroughs introducing ... | 12111 | Industry News | Research: Isolating Piezoelectric DC/DC Converters Without Transformers | Building on its earlier breakthroughs introducing a new way of converting electrical power using piezoelectric resonators and developing a dual-bridge piezoelectric resonator converter, the technology research institute CEA-Leti has paved the way to isolating piezoelectric converters without transformers. The topology of dual-bridge isolated piezoelectric resonator converter (DB-IPRC) provides isolation using two independent piezoelectric resonators. The improved version of the DC/DC converter significantly improves efficiency, while maintaining the converter isolation principle. The results were reported in a paper, noting that "for a 200 V to 120 V conversion, the converter shows an efficiency of 96.2% with the inductive assisting circuit, 94.3% with the piezoelectric one and 87.4% without any assisting circuit. The (piezoelectric resonator) assisting circuit offers a gain in efficiency over a smaller operating range than the inductance, but leads to a flatter converter." According to CEA-Leti the use of piezoelectric resonators instead of inductors in power conversion "will lead to a dramatic reduction in the size of power converters." The research facility claims that the "results make it possible to extend this type of compact conversion to isolated converters." So this type of converter is said to be now compatible with a much wider range of applications, such as TVs, phones, tablets and electrical tools. The technology research institute says that in power conversion, piezoelectrics operate at high frequencies, greater than 100 kHz, "with no limits in terms of input power" enabling it to reach power levels of several hundred watts. The range of applications is therefore expected to be very broad, with most converters having a rated power of less than 100 W. | 24.09.2024 07:00:00 | Sep | news_2024-10-01_2.jpg | \images\news_2024-10-01_2.jpg | https://www.cea.fr/english | cea.fr |
| Medical Power Supplies meet CF Requirements | Advanced Energy has developed the NCF150 series of... | 12127 | Product Release | Medical Power Supplies meet CF Requirements | Advanced Energy has developed the NCF150 series of high-isolation, low-leakage current AC/DC power supplies that enable medical equipment designers to meet the cardiac floating (CF) requirements of the IEC 60601-1 medical safety standard using off-the-shelf products. Type CF is the most stringent medical electrical safety classification and is essential for medical products that may come in direct contact with the heart, including dialysis machines, cardiac-related systems and platforms for electrosurgery. The SL NCF150 series delivers a maximum output power of up to 150 W and offers voltages of 12 V, 15 V, 19 V, 24 V and 48 V. An optional 5 V standby and 12 V fan output are also available. All units in the SL NCF150 series have a patient leakage current below 10 µA, feature EMI Class B, 2 MOPP isolation and 5 kV defibrillator pulse withstand capabilities. SL NCF150 power supplies accept a universal input of 85 to 264 V<sub>AC</sub>, operate with a full-load efficiency greater than 90% and feature protection against overvoltage, overload, overtemperature and short-circuit conditions as standard. This is the first release of the CF rated family and will be followed by higher power models launching soon. | 23.09.2024 13:30:00 | Sep | news_2024-10-01_18.jpg | \images\news_2024-10-01_18.jpg | https://www.advancedenergy.com/en-us/products/ac-dc-power-supply-units/open-frame-low-power-psus/cf-rated-products/ncf150/ | advancedenergy.com |
| Research: Lithium-Metal Battery with Solid Electrolyte achieves 1070 Wh/L | As the coordinator of the H2020 SOLiDIFY consortiu... | 12116 | Industry News | Research: Lithium-Metal Battery with Solid Electrolyte achieves 1070 Wh/L | As the coordinator of the H2020 SOLiDIFY consortium, imec, together with 13 European partners, announces the development of a high-performance lithium-metal solid-state battery. The prototype battery pouch cell, manufactured by imec in the battery assembly lab at EnergyVille, Belgium, features a unique "liquid-to-solid" processed solid electrolyte, jointly developed by imec and the partners. It boasts an energy density of 1070 Wh/L, compared to 800 Wh/L for state-of-the art lithium-ion batteries. The manufacturing process, which is said to be cost less than €150 per kWh while being adaptable to existing lithium-ion battery production lines, paves the way for commercially viable solid lithium batteries for electromobility. The high energy density was achieved by combining a high-capacity composite cathode, separated from a thin lithium metal anode by a thin solid electrolyte separator (50 µm), which resulted in a compact battery cell stack. In addition, the consortium overcame mechanical strength and cathode impregnation challenges to increase the cell's charge rate to 3 hours and lifetime to 100 cycles. Compared to liquid electrolytes, the thermally stable solid cell had a reduced flammability, improving safety. The application of nanometer-thin protective coatings enabled the use of cobalt-lean NMC cathodes, reducing environmental impact while providing higher capacity. Next steps include further upscaling of this high-performance battery technology. | 19.09.2024 12:00:00 | Sep | news_2024-10-01_7.jpg | \images\news_2024-10-01_7.jpg | https://solidify-h2020.eu/ | solidify-h2020.eu |
| N-Channel MOSFETs for 40 – 100 V | ROHM has released N-channel MOSFETs – RF9x120BKFRA... | 12125 | Product Release | N-Channel MOSFETs for 40 – 100 V | ROHM has released N-channel MOSFETs – RF9x120BKFRA / RQ3xxx0BxFRA / RD3x0xxBKHRB – featuring ON-resistances that are suited for several automotive applications, including motors for doors and seat positioning, as well as LED headlights. Offered in voltage ratings of 40 V, 60 V, and 100 V, the new products incorporate a split-gate structure to achieve low ON-resistance. All models are qualified under the AEC-Q101 automotive reliability standard. Design engineers can select from among three package types, depending on the application. For space-constrained sets like ADAS, the compact DFN2020Y7LSAA (2.0 mm × 2.0 mm) and HSMT8AG (3.3 mm × 3.3 mm) packages fit well. For automotive power applications, the widely used TO-252 (DPAK) package (6.6 mm × 10.0 mm) is also available. In addition, ROHM has further enhanced mounting reliability by utilizing wettable flank technology for the DFN2020Y7LSAA package and gull-wing leads for the TO-252 package. P-channel products are also scheduled for future release. | 19.09.2024 11:30:00 | Sep | news_2024-10-01_16.jpg | \images\news_2024-10-01_16.jpg | https://www.rohm.com/news-detail?news-title=2024-09-19_news_mosfet&defaultGroupId=false | rohm.com |
| Design and Service Center in the Greater Boston Area | Advanced Energy has opened a design and service ce... | 12114 | Industry News | Design and Service Center in the Greater Boston Area | Advanced Energy has opened a design and service center in Wilmington, MA. The facility will focus on the development of advanced power technologies for semiconductor, industrial and medical applications. Combining laboratory and office space, the center will be the workspace for up to 50 employees. It supports AE's rapid growth strategy by enabling the launch of leading technology platforms, reducing time-to-market for new products, and ensuring smooth transitions to high-volume manufacturing. The design and service center features labs as well as office space with a gym and cafeteria. It is located near top schools like MIT and Northeastern. | 19.09.2024 10:00:00 | Sep | news_2024-10-01_5.jpg | \images\news_2024-10-01_5.jpg | https://ir.advancedenergy.com/news/advanced-energy-opens-design-and-service-center-in-the-greater-boston-area/bfab5c16-eaad-45be-998e-7e947578dda9/ | advancedenergy.com |
| US Funding for WBG Power Projects | The White House and U.S. Department of Defense ann... | 12110 | Industry News | US Funding for WBG Power Projects | The White House and U.S. Department of Defense announced the first year of funding, totaling $19 million, for four additional projects for the Commercial Leap Ahead for Wide Bandgap Semiconductors (CLAWS) Microelectronics Commons Hub, headed by North Carolina State University. The first of the four selected projects is "High Permittivity Dielectrics to Increase the Performance of III-Nitride Transistors" and led by NC State. It will increase the efficiency and radiation hardness of advanced transistors used in avionics and satellite applications. Partners include MACOM, EPC Space, Lockheed Martin, University of Florida, NASA and Sandia National Laboratories. The second project is named "Transition Readiness for NITride Rf Overmatch (T/R NITRO)" and led by MACOM. It will deliver advance prototypes of high frequency transistors and circuits for use in electronic warfare, radars, and 5G/6G telecommunications. The partners include NC State, Adroit Materials and the Naval Research Laboratory. The third project is about "Advanced High Voltage Silicon Carbide Switches". Led by GE Aerospace it will push the development of 6.5 to 10 kV planar field-effect transistors (FETs) into a low-volume production environment and develop 6.5 to 10 kV Superjunction (SJ) devices. The partners include Coherent, NC State, Stony Brook University, University at Albany, Naval Research Laboratory, DEVCOM and N.C. A&T State University. The fourth project covers "Advanced Power Switches Using UWBG Gallium Oxide". Led by Kyma Technologies it will advance the state-of-the-art in gallium oxide high voltage switching devices by producing power diodes and power transistors capable of blocking up to 10 kV, and make available the epilayers, devices, and composite substrates to the DoD and community at large through the CLAWS hub. The partners include NC State, University of California at Santa Barbara, Modern Microsystems, the Air Force Research Laboratory, Naval Research Laboratory and GE Aerospace. | 19.09.2024 06:00:00 | Sep | news_2024-10-01_1.jpg | \images\news_2024-10-01_1.jpg | https://news.ncsu.edu/2024/09/claws-hub-to-lead-leap-ahead-projects/ | ncsu.edu |
| Strategic Alliance regarding Semiconductor Ecosystem in India | Tata Group and Analog Devices announced a strategi... | 12119 | Industry News | Strategic Alliance regarding Semiconductor Ecosystem in India | Tata Group and Analog Devices announced a strategic alliance to explore potential cooperative manufacturing opportunities. Tata Electronics, Tata Motors, and Tejas Networks signed a Memorandum of Understanding (MoU) with ADI to enhance strategic and business cooperation, explore opportunities for semiconductor manufacturing in India, and use ADI's products in Tata applications like electric vehicles and network infrastructure. The companies also agree to have strategic roadmap alignment discussions. As previously announced, Tata Electronics is investing in its own facilities by building India's first fab in Dholera, Gujarat with a total investment of $11 billion. In addition, Tata Electronics will be investing another $3 billion in a greenfield facility in Jagiroad, Assam for the assembly and testing of semiconductor chips. Tata Electronics and ADI intend to explore opportunities to manufacture ADI's products in Tata Electronics' fab in Gujarat and OSAT in Assam. Tata Motors and ADI intend to explore opportunities for engagement in electronics hardware components for energy storage solutions and power electronics in both commercial and passenger vehicle businesses. Tejas Networks and ADI intend to explore opportunities for engagement in electronics hardware components for network infrastructure. | 18.09.2024 15:00:00 | Sep | news_2024-10-01_10.jpg | \images\news_2024-10-01_10.jpg | https://www.analog.com/en/newsroom/press-releases/2024/9-18-2024-tata-adi-announce-strategic-alliance-explore-joint-opportunities.html | analog.com |
| Office in the heart of Southeast Asia | In August Würth Elektronik eiSos opened its first ... | 12113 | Industry News | Office in the heart of Southeast Asia | In August Würth Elektronik eiSos opened its first Thai branch office - in the Rama 9 business center in Bangkok. The company says that this gives the up-and-coming Asian business a secure base and new impetus for growth. Würth Elektronik eiSos points out that the location in the heart of the vibrant business district has excellent public transport connections. Würth Elektronik's corporate history in Thailand began back in 2006 - with the support of the Würth Elektronik eiSos team in Singapore. The first Field Sales Engineer was then hired in September 2010. The Thailand business developed extremely positively. Under the leadership of Regional Sales Manager Chantwut Zukzwang, General Manager Sebastian Tan and thirteen employees are now driving Würth Elektronik's Thailand business forward. The new location can already rely on a stable sales base that also includes major EMS customers. | 18.09.2024 09:00:00 | Sep | news_2024-10-01_4.jpg | \images\news_2024-10-01_4.jpg | https://www.we-online.com/en/news-center/press?instance_ID=5506&d=thailand-opening | we-online.com |
| Silicon Valley Design and Innovation Centre | XP Power has opened the Silicon Valley Innovation ... | 12118 | Industry News | Silicon Valley Design and Innovation Centre | XP Power has opened the Silicon Valley Innovation Centre (SVIC) as its new North America Headquarters in San Jose, CA. This 85,000-square-foot facility integrates research and technology development, design engineering, pilot manufacturing, warehousing logistics, and service/support under one roof. The Innovation Centre facilitates rapid development cycles, allowing the company to deliver solutions efficiently - supported by a multi-disciplined Engineering Team with design and industry experience across semiconductor, healthcare, military, and industrial sectors. The facility includes a Reliability Lab with multiple Highly Accelerated Life Test (HALT), Highly Accelerated Stress Screen (HASS) and Environmental Chambers. An etch Plasma Chamber focuses on system validation for semiconductor fabrication equipment, and a 3-meter Anechoic EMC Chamber complements existing EMC compliance test stations to accelerate time-to-market. A dedicated Test Development Team is in place to design custom test equipment for specialized power conversion applications. The SVIC also incorporates eco-friendly features such as electric vehicle charging stations, automated LED lighting and HVAC systems, dishwashers to discourage single-use dishes, and the elimination of all Single-Use Plastics (SUP). | 17.09.2024 14:00:00 | Sep | news_2024-10-01_9.jpg | \images\news_2024-10-01_9.jpg | https://www.xppower.com/resources/press-releases/xp-power-unveils-silicon-valley-design-and-innovation-center | xppower.com |
| Micro DC/DC Stepup Converter operate from 0.9 V | Torex Semiconductor has launched its XCL109/XCL110... | 12129 | Product Release | Micro DC/DC Stepup Converter operate from 0.9 V | Torex Semiconductor has launched its XCL109/XCL110 series of inductor built-in step-up DC/DC converters. The XCL109/XCL110 series incorporates both the IC and coil into a package measuring 2.0 x 2.5 x h1.04 mm<sup>3</sup>. It is a step-up DC/DC converter that requires small input and output capacitors as peripheral components. The converter can start operation with an input voltage as low as 0.9 V, making it suitable for devices powered by a single alkaline or nickel-metal hydride battery. The output voltage is adjustable in 0.1 V increments within the range of 1.8 V to 5.5 V, and it operates at ambient temperatures of up to 105 °C. This product is available in three types to suit various applications: The "load disconnect type" cuts off the connection between input and output during standby, minimizing battery consumption, while the "bypass type" maintains the connection between input and output during MCU sleep mode, supplying the battery voltage directly. It boosts the voltage to 3.3 V or other levels only during active mode, thereby reducing power consumption during sleep and contributing to overall low power consumption of the device. The "output OR type" is ideal for output OR connections in configurations with multiple power lines or backup systems. The XCL109/XCL110 series are designed for industrial equipment, IoT, mobile devices, wearables, healthcare, and any other devices that demand compact size, low power consumption, and high functionality/performance while prioritizing battery life. The device is integrated into a CL-2025-02 package, which is pin-compatible with other inductor built-in step-up DC/DC products. | 12.09.2024 15:30:00 | Sep | news_2024-10-01_20.jpg | \images\news_2024-10-01_20.jpg | https://www.torexsemi.com/news/product/20240912_4499 | torexsemi.com |
| 2024 ASCM Award of Excellence | Infineon has received the "ASCM Award of Excellenc... | 12115 | Industry News | 2024 ASCM Award of Excellence | Infineon has received the "ASCM Award of Excellence – Corporate Transformation" from the Association for Supply Chain Management (ASCM). The award recognizes an organizational transformation that improves business by assessing the supply chain using ASCM's global standards, products, services and resources. Infineon was honored for a supply chain initiative that implemented the Supply Chain Operations Reference (SCOR) model of ASCM. By focusing on customer-centricity, the semiconductor company "significantly improved customer satisfaction, optimized capacity use and realized substantial cost savings". Infineon transformed its supply chain to become more robust, agile, and resilient. The primary goals of this transformation were to enhance forecasting accuracy, implement agile response mechanisms like daily automated execution of the physical flexibility enabled by a superior master data system, adopt cost-efficient procurement practices, and build resilient partnerships. The ASCM is the global pacesetter of organizational transformation, talent development and supply chain innovation. As the largest association for supply chain, ASCM members and worldwide alliances fuel innovation and inspire accountability for resilient, dynamic and sustainable operations. | 12.09.2024 11:00:00 | Sep | news_2024-10-01_6.jpg | \images\news_2024-10-01_6.jpg | https://www.infineon.com/cms/en/about-infineon/press/market-news/2024/INFXX202409-140.html | infineon.com |
| World's first 300 mm Power Gallium Nitride (GaN) Technology | Infineon Technologies has succeeded in developing ... | 12090 | Industry News | World's first 300 mm Power Gallium Nitride (GaN) Technology | Infineon Technologies has succeeded in developing the world's first 300 mm power gallium nitride (GaN) wafer technology, accomplished in an existing and scalable high-volume manufacturing environment - a "breakthrough" which is said to "help substantially drive the market for GaN-based power semiconductors". Chip production on 300 mm wafers offers 2.3 times more chips per wafer than on 200 mm wafers. "The technological breakthrough will be an industry game-changer and enable us to unlock the full potential of gallium nitride", Jochen Hanebeck, CEO of Infineon Technologies, says. "Infineon is mastering all three relevant materials: silicon, silicon carbide and gallium nitride. Nearly one year after the acquisition of GaN Systems, we are demonstrating again that we are determined to be a leader in the fast-growing GaN market." Infineon has succeeded in manufacturing 300 mm GaN wafers on an integrated pilot line in existing 300 mm silicon production in its power fab in Villach/Austria. The company intends to "further scale GaN capacity aligned with market needs". Infineon claims that "300 mm GaN manufacturing will put Infineon in a position to shape the growing GaN market which is estimated to reach several billion US-Dollars by the end of the decade" and that "fully scaled 300 mm GaN production will contribute to GaN cost parity with silicon on R <sub>DS(on)</sub> level, which means cost parity for comparable Si and GaN products. The semiconductor manufacturer will present the first 300 mm GaN wafers to the public at the electronica trade show in November 2024 in Munich. | 11.09.2024 06:00:00 | Sep | news_2024-09-15_1.jpg | \images\news_2024-09-15_1.jpg | https://www.infineon.com/cms/en/about-infineon/press/press-releases/2024/INFXX202409-142.html | infineon.com |
| Transformers for Power Line Communication | Communication between charging stations and electr... | 12128 | Product Release | Transformers for Power Line Communication | Communication between charging stations and electric vehicles via an interface compliant with EN ISO 15118 is a fundamental requirement for the public charging infrastructure. Würth Elektronik now offers the WE-PLC product series of SMT transformers for Power Line Communication (PLC). These PLC transformers are well-suited for galvanic isolation of the PLC system from the power supply. They are designed for data signals between 500 kHz and 30 MHz isolating the low-voltage range from the high-voltage range. The WE-PLC product series offers a high test voltage of 4500 V<sub>RMS</sub> for transformers of this package size (13.6 x 9.9 mm<sup>2</sup> footprint) with a maximum leakage inductance of 0.2 µH. The WE-PLC transformers are available with turns ratios of 1:1:1 and 1:4:3 for EV charging and AC interfaces for grid communication. The operating voltage is up to 250 V<sub>AC</sub>. | 10.09.2024 14:30:00 | Sep | news_2024-10-01_19.jpg | \images\news_2024-10-01_19.jpg | https://www.we-online.com/en/components/products/WE-PLC | we-online.com |
| Industrial 3 kW programmable Power Supplies | TDK Corporation has introduced the 3000 W TDK-Lamb... | 12126 | Product Release | Industrial 3 kW programmable Power Supplies | TDK Corporation has introduced the 3000 W TDK-Lambda brand HWS3000 programmable AC/DC power supplies in a 270 x 150 x 61 mm<sup>3</sup> case. The nominal output voltages (24 V, 48 V, 60 V or 130 V) and output currents are fully programmable (CV/CC) from zero up to their maximum rating. The HWS3000 series is available with an 85 – 265 V<sub>AC</sub> single-phase or three-phase 170 – 265 V<sub>AC</sub> input. Output programming can be achieved using a serial RS485 interface (MODBus protocol) or analog 1 – 5 V or 4 – 20 mA signals. The speed fan is variable with typically 45 dB audible noise at <70% load, and a 25 °C ambient temperature. The power supplies can be used in a wide range of applications, including test and measurement, semiconductor fabrication, RF amplifiers, laser machining, printing, and industrial equipment. The HWS3000G can deliver 1500 W with a low-line single-phase input voltage (85 to 132 V<sub>AC</sub>) and 3000 W at high-line (170 to 265 V<sub>AC</sub>). The HWS3000GT provides 3000 W from a three-phase input voltage of 170 - 265 V<sub>AC</sub>. Four nominal output voltages, 24 V, 48 V, 60 V and 130 V, can be programmed to provide 0 - 28.8 V, 0 - 52.8 V, 0 – 66 V, and 0 – 156 V. Up to three units can be connected in series, or ten units in parallel. The output voltage slew rate can be digitally programmed and monitored, along with information regarding cumulative operating time, fault log, and product identification information. Digital programming can be performed without turning the power supply on. | 10.09.2024 12:30:00 | Sep | news_2024-10-01_17.jpg | \images\news_2024-10-01_17.jpg | https://product.tdk.com/en/power/hws-g/ | tdk.com |
| Automotive-qualified Small Signal MOSFETs in tiny Packages | Nexperia released single and dual small-signal MOS... | 12122 | Product Release | Automotive-qualified Small Signal MOSFETs in tiny Packages | Nexperia released single and dual small-signal MOSFETs in miniature DFN packages. The automotive-qualified devices are available in DFN1110D-3 and DFN1412-6 respectively. Particularly the DFN1110D-3 (1.1 mm x 1 mm) package has seen increasingly wide adoption and is quickly becoming the 'de-facto' industry standard package for small-signal MOSFETs and bipolar transistors intended for use in automotive applications. DFN1110D-3 and DFN1412-6 are leadless packages that offer superior thermal performance, with almost 50% lower thermal resistance from junction to ambient (R<sub>thj-s</sub>), from a tiny footprint (up to 80% smaller). This makes them a highly attractive alternative to established high-volume leaded enclosures such as SOT23, SOT323, SOT363, or SOT666, thereby addressing the automotive industry's relentless demand for miniaturized components. The DFN1110-D-3 also features side-wettable flanks to support lower-cost automated optical inspection (AOI) of solder joints. | 10.09.2024 08:30:00 | Sep | news_2024-10-01_13.jpg | \images\news_2024-10-01_13.jpg | https://www.nexperia.com/products/mosfets/ | nexperia.com |
| 30 V Power MOSFETs for Mass Market Applications | Infineon has expanded its StrongIRFET™ 2 pow... | 12121 | Product Release | 30 V Power MOSFETs for Mass Market Applications | Infineon has expanded its StrongIRFET™ 2 power MOSFET portfolio to 30 V solutions. Optimized for high robustness and ease-of-use, the power MOSFETs were specifically designed to meet the requirements of a wide range of mass market applications. Amongst these applications are industrial switched-mode power supplies (SMPS), motor drives, battery-powered applications, battery management systems, and uninterruptible power supplies (UPS). The 30 V technology offers up to a 40 percent R <sub>DS(on)</sub> improvement and up to a 60 percent reduction in Q <sub>G</sub> compared to the previous generation of StrongIRFET devices. The StrongIRFET 2 power MOSFETs in 30 V are available now in a TO-220 package. By the end of 2024, the portfolio will be available in a wider range of industry-standard packages and pin-out options, including to DPAK, D<sup>2</sup>PAK, PQFN and SuperSO8. | 10.09.2024 07:30:00 | Sep | news_2024-10-01_12.jpg | \images\news_2024-10-01_12.jpg | https://www.infineon.com/strongirfet2_30v/ | infineon.com |
| 2" x 4" 250 W Medical and Industrial Power Supply Series | TDK announces additional output voltage models to ... | 12105 | Product Release | 2" x 4" 250 W Medical and Industrial Power Supply Series | TDK announces additional output voltage models to the 250 W rated TDK-Lambda brand CUS250M series of power supplies in the industry standard 2" x 4" footprint. The full range now covers 12 V, 15 V, 18 V, 24 V, 28 V, 36 V and 48 V and is certified to the IEC 62368-1 and IEC 60601-1 safety standards for industrial and medical applications. This includes both Class I and Class II (no earth ground required) installations. The CUS250M has mechanical configurations that enable convection and/or conduction cooling through the product's baseplate to provide silent cooling. Applications include medical, home healthcare, dental, test, measurement, broadcast, professional audio and industrial equipment. The output can be adjusted to accommodate non-standard voltages, either by the factory or using the on-board potentiometer. The CUS250M operates across an 85 to 264 V<sub>AC</sub> input and has a earth leakage current of less than 150 μA - including all tolerances. The touch current is <10 μA (Class I) and <70 μA (Class II). In ambient temperatures of -20 °C to +45 °C the CUS250M can deliver up to 250 W conduction cooled without external air. With appropriate derating, operation at up to +80 °C is also possible. The efficiency is up to 94%, and the average efficiency, measured at 25, 50, 75 and 100% loads, is greater than 91%, while offload power consumption is less than 0.5 W when the output is inhibited. | 09.09.2024 11:30:00 | Sep | news_2024-09-15_16.jpg | \images\news_2024-09-15_16.jpg | https://product.tdk.com/system/files/dam/doc/product/power/switching-power/ac-dc-converter/catalog/cus250m_e.pdf | lambda.tdk.com |
| 40 V MOSFETs in PDFN 33 Packages | Magnachip Semiconductor released four 40V MXT MV M... | 12103 | Product Release | 40 V MOSFETs in PDFN 33 Packages | Magnachip Semiconductor released four 40V MXT MV MOSFETs designed in Power Dual Flat No-Lead (PDFN) 33 packages for automotive applications. This package reduces the area by more than 60% and the weight by approximately 75% as compared to 40 V MOSFET products packaged in PDFN56. Among these products, three models - AMDV040N029LVRH, AMDV040N036LVRH, and AMDV040N042LVRH - are distinguished by their gate threshold voltage of 1.8 V. The gate threshold voltage determines the point at which the MOSFET switches from an off-state to an on-state. A lower threshold voltage reduces the energy required to operate the MOSFET, thereby decreasing the overall power consumption of the system. For example, the AMDV040N029LVRH provides a typical/maximum R<sub>DS(on)</sub> of 3.8 mΩ/5.0 mΩ at V<sub>GS</sub> = 4.5 V and of 2.5 mΩ / 2.9 mΩ at V<sub>GS</sub> = 10 V. The typical gate charge Q<sub>g</sub> at V<sub>GS</sub> = 10 V is specified with 30 nC. | 09.09.2024 09:30:00 | Sep | news_2024-09-15_14.jpg | \images\news_2024-09-15_14.jpg | https://www.magnachip.com/automotive-solutions/ | magnachip.com |
| 2300V Baseplate-less SiC Power Modules | Wolfspeed unveiled a silicon carbide module design... | 12120 | Product Release | 2300V Baseplate-less SiC Power Modules | Wolfspeed unveiled a silicon carbide module designed to transform the renewable energy, energy storage, and high-capacity fast-charging sectors through improved efficiency, durability, reliability, and scalability. The 2300V baseplate-less silicon carbide power modules for 1500V DC Bus applications were developed and launched utilizing Wolfspeed's 200 mm silicon carbide wafers. Furthermore, Wolfspeed also announced that it is partnering with EPC Power, who will use the Wolfspeed® modules in utility-grade solar and energy storage systems, which offer a scalable high-power conversion system and high-performance controls and system redundancy. Wolfspeed's 2300V modules will improve system efficiency, while reducing the number of passive components. They are said to "offer 15% greater voltage headroom compared to similar silicon carbide modules, improved dynamic performance with consistent temperature stability, and a substantial reduction in EMI filter size". Wolfspeed's technology achieves a 77% reduction in switching losses over IGBTs and a 2-3x reduction in switching losses for silicon carbide devices intended for 1500V applications. These 2300V modules will enable the industry to adopt the two-level topology, resulting in simplified system design and reduced driver count compared to IGBT-based three-level configurations. The benefits of 2300V modules support a building block approach to scale power tenfold, from kilowatts to megawatts. | 09.09.2024 06:30:00 | Sep | news_2024-10-01_11.jpg | \images\news_2024-10-01_11.jpg | https://www.wolfspeed.com/company/news-events/news/wolfspeed-unveils-cutting-edge-silicon-carbide-module-solution-to-boost-clean-energy-capacity/ | wolfspeed.com |
| Executive Vice President for German Electronics Specialist | With effect from 1 August 2024 Thomas Garz has bee... | 12092 | People | Executive Vice President for German Electronics Specialist | With effect from 1 August 2024 Thomas Garz has been appointed Executive Vice President for the Würth Elektronik eiSos Group. The 37-year-old has been with the Würth Group since 2006. Most recently, he was Senior Vice President of the Würth Line Craft, the core business of the Würth Group, for Scandinavia and additionally responsible for International Systems of the Würth Line. The organizational structure of the Würth Elektronik eiSos Group will remain unchanged as a result of this appointment. Before taking up his position as the Senior Vice President of the Würth Line Craft for Scandinavia, Thomas Garz held various positions, including sales and shop manager, assistant to the management and auditor for Würth. | 06.09.2024 07:00:00 | Sep | news_2024-09-15_3.jpg | \images\news_2024-09-15_3.jpg | https://www.we-online.com/en/news-center/press?instance_ID=5506&d=thomas-garz | we-online.com |
| Long-Term Supply Agreement for SiC Power Devices signed | ROHM and United Automotive Electronic Systems (UAE... | 12095 | Industry News | Long-Term Supply Agreement for SiC Power Devices signed | ROHM and United Automotive Electronic Systems (UAES), a Tier 1 automotive supplier in China, have recently entered into a long-term supply agreement for SiC power devices. Already since 2015, ROHM and UAES have been collaborating and carrying out detailed technical exchanges on automotive applications utilizing SiC power devices. This partnership deepened in 2020 with the establishment of the SiC Joint Research Institute at the UAES headquarters in Shanghai, China. And in 2021 ROHM's advanced SiC power devices and peripheral components were highly evaluated by UAES, resulting in ROHM being selected as a preferred supplier. The close long-standing technical partnership has led to the production and adoption of numerous automotive products equipped with ROHM SiCs, such as onboard chargers and inverters for electric vehicles. This long-term supply agreement is said to ensure UAES sufficient access to SiC power devices to meet the growing demand for SiC-based inverter modules. Going forward, both companies will deepen their collaboration, contributing to technological innovation in the automotive sector by accelerating the development of SiC power solutions for EVs. | 05.09.2024 08:30:00 | Sep | news_2024-09-15_6.jpg | \images\news_2024-09-15_6.jpg | https://www.rohm.com/news-detail?news-title=2024-09-05_news&defaultGroupId=false | rohm.com |
| Acquisition of Austrian Power Supply Company | RECOM has enhanced its portfolio of products and c... | 12094 | Industry News | Acquisition of Austrian Power Supply Company | RECOM has enhanced its portfolio of products and capabilities by acquiring Leco. Like RECOM Leco is based in Austria, and according to RECOM Leco "is one of only a few companies that specialize in design and manufacture of full custom, high-end power solutions". By integrating LECO's engineering expertise and high-end power conversion products into its portfolio, RECOM enhances its market position and delivers more, comprehensive, high-end power supply solutions to its global customer base. "We are proud to have established this partnership with LECO. This provides us with an opportunity to expand our engineering capabilities and product portfolio for our customers, especially in industrial, automation & supply chain end-markets, as well as leveraging our global footprint for the sale of LECO high-end products.", Karsten Bier, CEO and Shareholder, RECOM. | 05.09.2024 08:00:00 | Sep | news_2024-09-15_5.jpg | \images\news_2024-09-15_5.jpg | https://recom-power.com/en/company/newsroom/rec-n-recom-expands-expertise-in-high-end-power-product-design-and-manufacture-with-the-acquisition-of-leco-385.html?7 | recom-power.com |
| Gen-3 Fast SiC to now qualified according to AEC Q101 | Navitas Semiconductor announced several third-gene... | 12109 | Product Release | Gen-3 Fast SiC to now qualified according to AEC Q101 | Navitas Semiconductor announced several third-generation automotive-qualified SiC MOSFETs in D2PAK-7L (TO-263-7) and TOLL (TO-Leadless) surface-mount (SMT) packages. Navitas' proprietary 'trench-assisted planar' technology is claimed to provide "world-leading performance over temperature" and to deliver high-speed, cool-running operation for electric vehicle (EV) charging, traction, and DC-DC conversion. With case temperatures up to 25°C lower than conventional devices, Gen-3 Fast SiC is said to offer an operating life up to 3x longer than alternative SiC products, for high-stress EV environments. Gen-3 Fast MOSFETs are optimized for fast switching speeds at high efficiencies, and support increased power density in EV applications such as AC compressors, cabin heaters, DC-DC converters, and on-board chargers (OBCs). Navitas' EV Design Center has demonstrated already OBC system solutions up to 22 kW with 3.5 kW/l power density, and over 95.5% efficiency. Both 650 and 1,200 V ranges are now AEC Q101-qualified in the traditional SMT D2PAK-7L (TO-263-7) package. For 400 V EVs, the 650 V-rated, surface-mount TOLL package offers a 9% reduction in junction-to-case thermal resistance (R<sub>TH,J-C</sub>), 30% smaller PCB footprint, 50% lower height, and 60% smaller size than the D2PAK-7L. This enables very high-power density solutions, while minimal package inductance of only 2 nH enables fast-switching performance and adequate dynamic package losses. 400 V-rated EV battery architectures are served by the 650 V Gen-3 Fast MOSFETs featuring R<sub>DS(ON)</sub> ratings from 20 to 55 mΩ. The 1,200 V ranges from 18 to 135 mΩ and is optimized for 800 V systems. | 04.09.2024 15:30:00 | Sep | news_2024-09-15_20.jpg | \images\news_2024-09-15_20.jpg | https://navitassemi.com/sic-power-fets-and-diodes/ | navitassemi.com |
| Dual 5 A Low-Side MOSFET Gate Drivers for High-Frequency Applications | Littlefuse launched the IX4341 and IX4342 dual 5 A... | 12102 | Product Release | Dual 5 A Low-Side MOSFET Gate Drivers for High-Frequency Applications | Littlefuse launched the IX4341 and IX4342 dual 5 A low-side MOSFET gate drivers, which complete the existing IX434x driver series by adding the remaining two logic input versions. The IX434x series now consists of dual non-inverting, dual inverting, and non-inverting and inverting input versions. The IX4341 and IX4342 drivers' propagation delay times of 16 ns and rise and fall times of 7 ns make them suited for high-frequency applications. Additionally, for higher current requirements, electronics designers can parallel the two channels of the IX4340 and IX4341 devices to form a single 10 A driver. Another feature of the IX434x drivers is their compatibility with TTL and CMOS logic inputs, enabling direct interfacing with most controllers. Furthermore, each output has an independent ENABLE function and under-voltage lockout circuitry (UVLO). In case of eventual insufficient supply voltage, the gate driver output is asserted low, turning the external power device off. The devices find applications in various markets, including general industrial and electrical equipment, appliances, building solutions, data centers, energy storage, and renewable energy – whenever MOSFETs in industrial applications such as switch-mode power supplies, DC-DC converters, motor controllers and power converters need to be driven. In terms of packaging a standard 8-pin SOIC, thermally enhanced 8-pin SOIC, and 3×3 mm<sup>2</sup> MSOP packages are available. | 04.09.2024 08:30:00 | Sep | news_2024-09-15_13.jpg | \images\news_2024-09-15_13.jpg | https://www.littelfuse.com/products/integrated-circuits/gate-driver-ics/igbt-and-mosfet-driver-ics/low-side-gate-driver-ics.aspx | littelfuse.com |
| Evaluation Board for 240 W PD 3.1 Charger with Efficiency >95 % | Eggtronic has unveiled an evaluation board (EVB) t... | 12101 | Product Release | Evaluation Board for 240 W PD 3.1 Charger with Efficiency >95 % | Eggtronic has unveiled an evaluation board (EVB) that allows engineers to speed the development and significantly reduce the size and cost of 240 W power delivery (PD) 3.1 applications while supporting ultra-fast charging through high efficiency. The SmartEgg 240W PD 3.1 EVB has a peak efficiency above 95% and operates at over 90% efficiency from light load to full load. A single stage that combines zero voltage switching (ZVS) power factor correction (PFC) and quasi-forward isolated regulation significantly reduces bill of materials (BOM) and size of key components (including storage capacitors and magnetics) compared to traditional PFC+LLC and PFC+Asymmetric Half-Bridge (AHB) architectures. The result is a platform that delivers light-load energy savings of up to 50%, achieves a power density of 1.34W/cm3 (21.9W/in<sup>3</sup>) to support extremely compact charger designs and, most importantly, reduces BOM cost. Based on Eggtronic's SmartEgg AC/DC architecture, the EVB incorporates proprietary mixed-signal, low-power EPIC (Eggtronic Power Integrated Controller) 2.0 IC controllers and features built-in protection against overpower, overvoltage, overtemperature, short circuits and brownouts. EPIC, which is based on a 32-bit RISC-V core and a set of high-performance digital and analog peripherals, incorporates an internal structure that supports multiple independent control loops of both standard and proprietary power conversion architectures. Supplied as a dual-port module, the SmartEgg 240W PD 3.1 EVB can be directly modified for any number of charging ports thanks to the flexibility of the EPIC 2.0 controller, which supports many slave buck converters, each acting as a standalone port. | 04.09.2024 07:30:00 | Sep | news_2024-09-15_12.jpg | \images\news_2024-09-15_12.jpg | https://www.eggtronic.com/products-services/integrated-circuits/epic2acsxx/ | eggtronic.com |
| electronica 2024: The electronics Trade Show turns 60 | electronica celebrated its premiere in 1964 as the... | 12093 | Event News | electronica 2024: The electronics Trade Show turns 60 | electronica celebrated its premiere in 1964 as the first trade fair in Germany devoted solely to electronic components. In the meantime, it has been accompanying innovations in the international electronics industry for six decades, providing a market overview of its latest products, technologies and solutions every two years. In 2024, this trade fair for electronics will celebrate its 60th anniversary from November 12 to 15, occupying all 18 exhibition halls for the first time ever (together with SEMICON Europe in two halls). The focus will be on the future vision of an all electric society. Already at the first edition in Munich in October 1964 a total of 407 companies from 16 countries exhibited on an area of 4,100 square meters, and around 14,000 trade visitors came to visit on the eight days of the fair. Already now the trade show organizer states that the 2024 edition of electronica "will be the biggest electronica of all time". | 04.09.2024 07:30:00 | Sep | news_2024-09-15_4.jpg | \images\news_2024-09-15_4.jpg | https://electronica.de/en/trade-fair/journalists/press-releases/detail/the-electronics-industry-turns-60.html?utm_campaign=ELE_2024_P_PMI_08_EN_MAN%20-%20Batch&utm_medium=mail_mmg&utm_source=eloqua&utm_content=ELE_2024_P_PMI_08_EN_MAN&utm_marketing_tactic=service | electronica.de |
| PCIM Asia 2024 grew significantly | PCIM Asia 2024, an international platform for comm... | 12091 | Event News | PCIM Asia 2024 grew significantly | PCIM Asia 2024, an international platform for communication and exchange in power electronics, intelligent motion, renewable energy and energy management, successfully concluded late August at the Shenzhen World Exhibition and Convention Center in China. Setting new records across nearly all metrics, the 2024 edition was the largest and most comprehensive iteration of the event to date. Floor space grew by 8,000 m2 (+67 %) to a total of 20,000 m<sup>2</sup>. The number of visitors (from 41 countries) increased 20 % over the 2023 edition to a total of 18,346, while the number of exhibitors (from 13 countries and regions) increased 28 % over the 2023 edition to a total of 232. To promote further dialogue and collaboration, the exhibition presented a series of industry forums, exhibitor forums and round-table discussions, covering topics ranging from wide-bandgap semiconductors and e-mobility to eVTOL development. At these sessions, representatives from several companies and researchers shared insights on development trends, new market applications and cutting-edge research. Alongside the exhibition, the PCIM Asia Conference 2024 once again featured technical advancements and applications in power electronics. 981 conference visitors listened to 3 keynote speeches, 12 oral sessions and 6 poster sessions as well as to 104 presentations. PCIM Asia is jointly organised by Guangzhou Guangya Messe Frankfurt Co Ltd and Mesago Messe Frankfurt GmbH. The next edition will take place from 14 – 16 August 2025 at the Shanghai New International Expo Centre (SNIEC) in Shanghai, China. | 04.09.2024 06:30:00 | Sep | news_2024-09-15_2.jpg | \images\news_2024-09-15_2.jpg | https://pcimasia-expo.cn.messefrankfurt.com/shenzhen/en/press/press-releases/2024/PCIM24_FR.html | pcimasia-expo.cn |
| Power Factor Correction Chokes für up to 1000 VDC | ITG Electronics now offers a range of power factor... | 12108 | Product Release | Power Factor Correction Chokes für up to 1000 V<sub>DC</sub> | ITG Electronics now offers a range of power factor correction chokes (PFCs) for particularly high-voltage applications. Capable of accommodating up to 1,000 V<sub>DC</sub> and 1,500 W, the company's PFC333232DH Series includes CCM PFC boost converters with switching frequencies from 100-200 kHz. The series also can be adopted as a straightforward boosted inductor. The solutions are viable for inductance ranges from 82-1600 μH at a maximum length/width/height of 33 mm x 32 mm x 31.6 mm. Compared with traditional toroidal-shaped PFC chokes, the PFC333232DH Series features a flat wire and square core construction to save space and increase power density. The solutions are up to 50% smaller compared with toroidal-shaped PFC chokes with similar power ratings, and their flat wire technology can reduce DC resistance by as much as 40%, leading to substantially lower copper losses. The PFC chokes are applicable for AC/DC conversion in industrial, equipment and automotive applications. The high-current output chokes can handle up to 41.9 A with approximately 50% roll off. | 03.09.2024 14:30:00 | Sep | news_2024-09-15_19.jpg | \images\news_2024-09-15_19.jpg | https://itg-electronics.com/en/series/920 | itg-electronics.com |
| Medically approved 4:1 input DC/DC Converters | XP Power has introduced the JMR03/10/20 series of ... | 12104 | Product Release | Medically approved 4:1 input DC/DC Converters | XP Power has introduced the JMR03/10/20 series of 3 W, 10 W, and 20 W medically approved DC/DC converters that offer a 4:1 input ratio. These devices provide 2 x MOPP (Means of Patient Protection) with 2 μA leakage current, ensuring integration into both BF (Body Floating) and CF (Cardiac Floating) rated healthcare applications. Their no-load input idle current is specified down to 4 mA, depending on the model. These fully encapsulated products are suited for use in applications like medical imaging, patient monitoring, patient treatment, dentistry, and respiratory care equipment. Models within the JMR03 (3.5 W), JMR10 (10 W), and JMR20 (20 W) series are available with output voltages of 5 V, 12 V, 15 V ±12 V or ±15 V; the JMR10/20 series offer an additional ±5 V output. The dual-output models can also provide a single 10 V, 24 V or 30 V output. The single output models can also be adjusted by -10% to +10% of the output voltage for non-standard requirements. All output power and voltage combinations can operate from either a 24 V (9.0 - 36.0 V) or 48 V (18.0 - 75.0 V) input, with the JMR03/10 series additionally operating from a 12 V (4.5 – 18 V) input. The operating temperature range for the JMR03/10/20 series is from -40 °C to +100 °C. All models are protected against short circuit and overload conditions, feature a remote on/off function, and have an input-to-output isolation voltage of 5 kV<sub>AC</sub>. Safety certification includes UL/CSA/IEC/EN 60601-1 and UL62368-1 with CE and UKCA markings for the low voltage and RoHS Directives. | 03.09.2024 10:30:00 | Sep | news_2024-09-15_15.jpg | \images\news_2024-09-15_15.jpg | https://www.xppower.com/product/JMR10-Series | xppower.com |
| Current Sensors achieve ASIL C(D) Compliance | Melexis reaches ASIL C safety compliance with its ... | 12098 | Industry News | Current Sensors achieve ASIL C(D) Compliance | Melexis reaches ASIL C safety compliance with its smart IVT (current, voltage, temperature) sensing platform. The Hall-effect MLX91230 and Shunt interface MLX91231 simplify the achievement of ISO 26262 ASIL C(D) architecture for critical vehicle functions such as battery management systems (BMS), smart pyrofuses, and high-voltage charging systems. Both devices integrate a wide range of smart functionality, including the microcontroller unit (MCU) with on-board flash memory that supports custom software deployment and extensive compensation of system imperfections. The diagnosable OCD allows for direct input to the Pyro-Fuse driver, enabling the simple deployment of smart pyrofuses with fewer components. Furthermore, the ASIL C safety level applies to the current sensing function and OCD, as well as the additional temperature and voltage measurement channels. The selectable LIN or UART output enables integration with 12V battery applications and power distribution modules, as well as direct communication with BMS or UART-over-CAN. | 29.08.2024 10:00:00 | Aug | news_2024-09-15_9.jpg | \images\news_2024-09-15_9.jpg | https://www.melexis.com/en/news/2024/29aug2024-melexis-achieves-asil-c-with-its-ivt-current-sensors | melexis.com |
| 240 V/1 kA Bidirectional Power TVS Diode in a Surface Mount Package | Bourns has introduced "the industry's first 240 V/... | 12100 | Product Release | 240 V/1 kA Bidirectional Power TVS Diode in a Surface Mount Package | Bourns has introduced "the industry's first 240 V/1 kA Bidirectional Power TVS (PTVS) Diode that offers the highest power density available in a surface mount package". The PTVS1-240C-M PTVS Diode offers 1 kA surge handling capability under 8/20 µs test conditions and is thus suited for a broad variety of systems that employ high-voltage DC bus architectures. These systems commonly experience high current switching transients and dynamic load behaviors where snubbing is needed, or protection of bus-powered subsystems is required. The PTVS1-240C-M PTVS Diode is a low-leakage device consuming 10 μA in standby while delivering a maximum breakdown voltage of 295 V, repetitive standoff voltage of 240 V and precise clamping voltage of 340 V. Under 10/350 μs conditions, this device is rated for 200 A peak current, and its voltage breakdown sensitivity over temperature shows a linearity of 0.1 %/°C. The company reports that the "surface mount package offers a significant reduced PCB footprint and lower inductance design advantages compared to traditional through-hole mounted Power TVS Diodes". Applications that can benefit from the features and capabilities of the Model PTVS1-240C-M include industrial power systems, motor controllers and inverters, solar inverters, battery energy storage systems, and factory automation. The device is UL497B certified and meets IEC 61000-4-5 standard specifications. It is also RoHS compliant and halogen free. | 29.08.2024 06:30:00 | Aug | news_2024-09-15_11.jpg | \images\news_2024-09-15_11.jpg | https://www.bourns.com/docs/product-datasheets/PTVS1-240C-M.pdf | bourns.com |
| European GaN Company establishes Asian Subsidiary | Wise-integration, a French company active in digit... | 12099 | Industry News | European GaN Company establishes Asian Subsidiary | Wise-integration, a French company active in digital control of gallium nitride ICs for power supplies, announced the launch of its subsidiary Wise-integration Ltd., based in Hong Kong to help Chinese customers achieve their power/performance/cost goals and accelerate its growing business in China. In addition to serving as the company's financial hub for regional transactions and boosting its presence generally in the Asian market, the subsidiary will enable the company to take advantage of business opportunities in China, a large and receptive market for its GaN-based power electronics solutions with digital control. In the past two years, Wise-integration announced partnerships with companies in South Korea and Taiwan to help bring its technologies to those markets. The company's product markets include consumer electronics and industrial applications like robotics, as well as data centers and electric vehicles. All of its solutions address the increasing demands for miniaturization, electrification and efficient power management. Led by James Ho, as China business development director, Wise-integration Ltd. is based in HKSTP (the Hong Kong Science and Technology Park). | 28.08.2024 10:30:00 | Aug | news_2024-09-15_10.jpg | \images\news_2024-09-15_10.jpg | https://wise-integration.com/wise-integration-creates-subsidiary-to-manage-asian-business-development-and-spur-growth-in-china/ | wise-integration.com |
| Intelligent Power Device for BLDC Motor Drives | Toshiba Electronics has launched a small intellige... | 12107 | Product Release | Intelligent Power Device for BLDC Motor Drives | Toshiba Electronics has launched a small intelligent power device (IPD) for space-constrained brushless DC (BLDC) motor drive applications such as air conditioners, air purifiers, and pumps. The IPD, TPD4165K, has an increased maximum output current of 3 A, compared to the 2 A rating of Toshiba's existing products like TPD4163K, or TPD4164K. The device is suitable for sine-wave drive. As power supply voltage may fluctuate significantly in some regions where the IP could be used, the absolute maximum voltage rating (V<sub>BB</sub>) has been increased to 600 V to enhance long-term reliability. This represents a 20% increase over Toshiba's previous products. TPD4165K is housed in a through-hole HDIP30 package with dimensions of 32.8 mm x 13.5 mm x 3.525 mm. This has a 21% smaller footprint than the DIP26 package used for many of Toshiba's previous products. It supports either three-shunt or single-shunt resistor circuit for current sensing. Safety features like over-current, under-voltage and thermal shutdown are already implented. Additionally, an external signal can be applied to the SD pin to control the behavior of the output stage. The DIAG output pin provides the status of the safety conditions. Designers can freely access a reference design for a sensorless BLDC motor drive circuit based upon the new TPD4165K and Toshiba's TMPM374FWUG microcontroller with vector control engine capability. The reference design data can be downloaded from Toshiba's website. | 27.08.2024 13:30:00 | Aug | news_2024-09-15_18.jpg | \images\news_2024-09-15_18.jpg | https://toshiba.semicon-storage.com/eu/semiconductor/product/intelligent-power-ics/detail.TPD4165K.html | toshiba.semicon-storage.com |
| Absorber Patch Attenuates like a Shielding Cabinet | Würth Elektronik has launched its hybrid WE-EMIP E... | 12106 | Product Release | Absorber Patch Attenuates like a Shielding Cabinet | Würth Elektronik has launched its hybrid WE-EMIP EMI absorber sheet, a convenient solution for preventing electromagnetic interference. The integrated adhesive layer makes the patch easy to stick on. It offers an attenuation of more than 40 dB over a wide frequency range. Both isolated and non-isolated versions are available. The non-isolated version allows the option of earthing. The hybrid absorber sheet consisting of EMI absorber material and aluminum layer is now available in the following sizes: as a sheet 105 mm × 74 mm, 297 mm × 210 mm or as a roll 15 m × 50 mm. The patch offers up to 12 times higher attenuation than previously available absorber sheets and helps achieve attenuation values otherwise attainable only with shielding cabinets. | 27.08.2024 12:30:00 | Aug | news_2024-09-15_17.jpg | \images\news_2024-09-15_17.jpg | https://www.we-online.com/en/components/products/WE-EMIP_EMI_PATCH | we-online.com |
| Joining the Global Battery Alliance | Siemens Digital Industries Software announced toda... | 12096 | Industry News | Joining the Global Battery Alliance | Siemens Digital Industries Software announced today it has joined the Global Battery Alliance (GBA), a collaboration platform that brings together international organizations, NGOs, industry actors, academics and multiple governments to align collectively in a pre-competitive approach, to drive systemic change along the entire battery manufacturing value chain. The vision of the GBA is to achieve three fundamental outcomes, which Siemens endorses and actively contributes to: establish a circular battery value chain, establish a low carbon economy in the value chain, and safeguard human rights and economic development. Through dedication to these principles, Siemens aims to bring about sustainable practices within the battery industry that not only minimize environmental impact but also create new job opportunities and generate additional economic value for communities worldwide. By joining GBA, Siemens is aligning with major stakeholders across the entire battery supply chain, spanning from material developers to cell suppliers, OEMs, and government bodies to strive towards a greener and more ethical future. | 27.08.2024 09:00:00 | Aug | news_2024-09-15_7.jpg | \images\news_2024-09-15_7.jpg | https://xcelerator.siemens.com/global/en/industries/battery-manufacturing/battery-passport.html | xcelerator.siemens.com |
| Investment in additional R&D Capabilities in Europe and Asia | To satisfy the growing global demand for current a... | 12075 | Industry News | Investment in additional R&D Capabilities in Europe and Asia | To satisfy the growing global demand for current and voltage sensing driven by the push towards decarbonization and greater electrification, LEM has opened new research and development facilities in Munich and Shanghai. The two sites are said to enable LEM to build greater intelligence into its sensors and to have development bases closer to key customers, while also promoting deeper collaboration on projects and the efficient sharing of vital product design information. While the China site will be kitted out with the very latest laboratory equipment, the site in Germany will focus on ASIC design and semiconductor technology that will help accelerate LEM’s innovation in integrated current sensors (ICSs). This latest investment in additional R&D facilities in Europe and Asia follows on from LEM’s recent inauguration of a factory in Malaysia. LEM’s investment in the state of Penang was an acknowledgment of the region’s expertise in ASIC technology and its specialization in semiconductor design and production. There are already 10 employees in place at Munich and this number will increase in line with LEM’s growth plans for the site. At the 1400 m² Shanghai facility, there are currently 30 staff with the capacity to more than double that number in the future, many of whom will be involved in R&D. | 23.08.2024 11:00:00 | Aug | news_2024-09-01_6.jpg | \images\news_2024-09-01_6.jpg | https://www.lem.com/en | lem.com |
| Ideal Diodes in small TSSPs | Nexperia has introduced two ideal power diode ICs.... | 12086 | Product Release | Ideal Diodes in small TSSPs | Nexperia has introduced two ideal power diode ICs. The NID5100 is suitable for standard industrial and consumer applications while the NID5100-Q100 has been qualified for use in automotive applications. Ideal diodes are MOSFET-based devices that offer much lower forward voltage drop than traditional diodes and make a good replacement option to standard diodes in systems where power efficiency is paramount. The NID5100 and NID5100-Q100 ideal diodes are available in small TSSP6/SOT363-2 leaded plastic packages measuring 2.1 mm x 1.25 mm x 0.95 mm. Applications that can benefit from their electrical performance include smart meters, fire/security sensors, battery powered wearables, and automotive telematics units. The NID5100 is a PMOS based ideal diode where the gate voltage of an internal MOSFET regulates the anode-to-cathode voltage to be eight to ten times lower than the forward voltage drop of similarly rated Schottky diodes. Besides the low forward drop, the MOSFET-based ideal diode also helps to reduce reverse DC leakage current by up to 100 times compared to a typical Schottky diode. The NID5100 supports "OR-ing" multiple power supplies while retaining reverse polarity protection and provides ultra-fast response time for smooth power transfer. Its forward regulation voltage is 31 mV with forward currents up to 1.5 A. | 22.08.2024 12:30:00 | Aug | news_2024-09-01_17.jpg | \images\news_2024-09-01_17.jpg | https://assets.nexperia.com/documents/data-sheet/NID5100.pdf | nexperia.com |
| MOSFETs in SMD Package for High Performance Applications | Alpha and Omega Semiconductor has announced Power ... | 12089 | Product Release | MOSFETs in SMD Package for High Performance Applications | Alpha and Omega Semiconductor has announced Power MOSFETs in LFPAK 5x6 packages for voltages of 40 V (AOLF66412, AOLF66413 and AOLF66417), 60 V (AOLF66610), and 100 V (AOLF66910). The devices are designed to withstand harsh environments while maintaining MOSFET performance in applications such as industrial, server power, telecommunications, and solar, where high reliability is required. The LFPAK packaging enables higher board-level reliability due to key packaging features such as gull-wing leads, which offer a ruggedized solution for board-level environmental stresses. The gull-wing leads also enable optical inspection during PCB manufacturing. Another feature enhancement is the LFPAK's larger copper clip, which improves electrical and thermal performance. Advantages of the large clip include improved current handling capabilities, reduced on-resistance, and better heat dispersion compared to wire bonding. A large clip also has low parasitic inductance, enabling lower spike voltage in switching applications. The devices operate with gate-source voltages of ±20 V at maximum junction temperatures of 175 °C. The drain current @ 25 °C and the maximum R<sub>DS(on)</sub> both depend on the model ranging from 187 to 294 A or, respectively, 1.5 to 4.7 mΩ at a gate-source voltage of 10 V. | 21.08.2024 15:30:00 | Aug | news_2024-09-01_20.jpg | \images\news_2024-09-01_20.jpg | https://www.aosmd.com/sites/default/files/2024-08/AOS_LFPAK_PR_1.pdf | aosmd.com |
| Industrial AC/DC Power Supplies in 2" x 3" Packages | Traco Power released its TXO family of 45, 60 & 12... | 12088 | Product Release | Industrial AC/DC Power Supplies in 2" x 3" Packages | Traco Power released its TXO family of 45, 60 & 120 W compact AC/DC Power supplies. These are the first 3 power levels of a TXO family of power supplies that will eventually go to 500 W. The TXO line specifically focuses on providing cost-efficient industrial power supplies. Efficiencies of up to 92 % allow for a compact design, and these models are designed to meet the ErP directive (< 0.3 W no load power consumption). Features include an internal EN55032 class B filter, as well as EMC characteristics dedicated for applications in industrial/automation and test & measurement fields. Basic features include a 2" x 3" open-frame construction, a universal input range of 85 – 264 VAC, 3000 VAC reinforced I/O isolation, an internal EN55032 class B filter, short circuit and overvoltage protection, IEC/EN/UL 62368-1 safety approvals and EN 61000-3-2 compliance. The TXO 45/60 series operates at full load convection cooled in the range of -20 °C to +50 °C, while the TXO 120 series operates as follows: 100 W convection / 120 W forced air -20 °C to +50 °C. | 20.08.2024 14:30:00 | Aug | news_2024-09-01_19.jpg | \images\news_2024-09-01_19.jpg | https://www.tracopower.com/de/txo | tracopower.com |
| Online EV-Charging Resource Hub | Arrow Electronics has developed and launched a res... | 12077 | Industry News | Online EV-Charging Resource Hub | Arrow Electronics has developed and launched a resource for EV charging for the automotive industry. Expanding its library of content, Arrow helps engineers developing the next generation of electric vehicle chargers and the corresponding software ecosystem that supports them. The hub offers design and technical support across the three electric vehicle charger categories: on-board charger, AC chargers and DC (or fast) chargers. Among the resources now available, Arrow has introduced a free eBook that delves into the latest developments in EV charging, such as costs, adapters, and the economic advantages of electric vehicles. There are also webinars available on-demand, including "Trends and Technologies for Next-Gen EV Charging Solutions". | 19.08.2024 13:00:00 | Aug | news_2024-09-01_8.jpg | \images\news_2024-09-01_8.jpg | https://www.arrow.com/en/ev-charging-solutions | arrow.com |
| eBook about Connectivity Needs and Technologies for Connected Homes | Mouser Electronics has released an eBook in collab... | 12076 | Industry News | eBook about Connectivity Needs and Technologies for Connected Homes | Mouser Electronics has released an eBook in collaboration with Qorvo, offering a detailed look at the connectivity requirements for smart homes and the different technologies used to support them. In Next-Gen Connectivity for Smart Living, experts from Mouser and Qorvo offer a deep dive into the technologies that underpin connectivity for smart homes, including Wi-Fi 7, ultra-wideband, and IoT standards like Zigbee, Thread, and Bluetooth Low Energy. The eBook features six different articles, each of which includes detailed infographics and links to relevant design tips from Qorvo including links to a dozen recommended Qorvo products. | 19.08.2024 12:00:00 | Aug | news_2024-09-01_7.jpg | \images\news_2024-09-01_7.jpg | https://resources.mouser.com/manufacturer-ebooks/qorvo-next-gen-connectivity-for-smart-living | mouser.com |
| Funding of up to $1.6 Billion in CHIPS and Science Act | Texas Instruments (TI) and the U.S. Department of ... | 12074 | Industry News | Funding of up to $1.6 Billion in CHIPS and Science Act | Texas Instruments (TI) and the U.S. Department of Commerce have signed a non-binding Preliminary Memorandum of Terms for up to $1.6 billion in proposed direct funding under the CHIPS and Science Act to support three 300 mm wafer fabs already under construction in Texas and Utah. In addition, TI expects to receive an estimated $6 billion to $8 billion from the U.S. Department of Treasury's Investment Tax Credit for qualified U.S. manufacturing investments. The proposed direct funding, coupled with the investment tax credit, would help TI provide a geopolitically dependable supply of essential analog and embedded processing semiconductors. The proposed direct funding under the CHIPS Act would support TI's investment of more than $18 billion through 2029, which is part of the company's broader investment in manufacturing. This proposed direct funding will support three new wafer fabs, two in Sherman, Texas, (SM1 and SM2) and one in Lehi, Utah (LFAB2), specifically to construct and build the SM1 cleanroom and complete pilot line for first production, to construct and build the LFAB2 cleanroom for first production and to construct the SM2 shell. They will produce semiconductors in 28 nm to 130 nm technology nodes. | 16.08.2024 10:00:00 | Aug | news_2024-09-01_5.jpg | \images\news_2024-09-01_5.jpg | https://news.ti.com/2024-08-16-Texas-Instruments-signs-preliminary-agreement-to-receive-up-to-1-6-billion-in-CHIPS-and-Science-Act-proposed-funding-for-semiconductor-manufacturing-in-Texas-and-Utah | ti.com |
| Call for Papers for the 75th ECTC | The IEEE Electronic Components and Technology Conf... | 12071 | Event News | Call for Papers for the 75th ECTC | The IEEE Electronic Components and Technology Conference (ECTC), a major technical conference and product exhibition for the world's semiconductor packaging industry, has announced a Call for Papers for ECTC 2025, the conference's 75th anniversary. The 75th annual ECTC will take place May 27-30, 2025 at the Gaylord Texan Resort & Convention Center in Dallas. More than 2,000 scientists, engineers and business people from more than 20 countries are expected to attend. Abstract submission has already been opened and the deadline for submissions is October 7, 2024. The ECTC 2025 technical program will address new developments, trends and applications for a broad range of topics, including components, materials, assembly, reliability, modeling, interconnect design and technology, device and system packaging, heterogeneous integration, wafer level packaging, photonics and optoelectronics, IoT, 5G, quantum computing and systems, 2.5D and 3D integration technology, and other emerging technologies in electronics packaging. | 16.08.2024 07:00:00 | Aug | news_2024-09-01_2.jpg | \images\news_2024-09-01_2.jpg | https://www.ectc.net/abstracts/75thCallforPapers-Web.pdf | ectc.net |
| High-Performance Power Module Family | SemiQ has added an S7 package to its QSiC™ f... | 12087 | Product Release | High-Performance Power Module Family | SemiQ has added an S7 package to its QSiC™ family of 1200 V, half-bridge MOSFET and Schottky diode SiC power modules. The parts enhance design flexibility for power engineers by providing compact, high-efficiency, high-performance options for new designs while supporting drop-in-replacement in legacy systems that require more efficient operation. This latest announcement sees the availability of a 529A MOSFET module (GCMX003A120S7B1: RdsOn 3.0 mΩ, B1 package), a 348A MOSFET module (GCMX005A120S7B1: R<sub>dsOn</sub> 4,9 mΩ, B1 package), and two low-noise SiC Schottky diode half-bridge modules (GHXS300A120S7D5 for 300 A and GHXS400A120S7D5 for 400 A) in an S7 package with industry-standard 62.0 mm footprints and a height of 17.0 mm. The package addresses the size, weight and power requirements of demanding applications ranging from induction heaters, welding equipment and uninterruptible power supplies (UPS) to photovoltaic and wind inverters, energy storage systems, high-voltage DC-DC converters and battery charging systems for electric vehicles (EVs). To guarantee a stable gate threshold voltage and premium gate oxide quality for each module, SemiQ conducts gate burn-in testing at the wafer level and performs various stress. All parts have undergone testing surpassing 1400 V. | 14.08.2024 13:30:00 | Aug | news_2024-09-01_18.jpg | \images\news_2024-09-01_18.jpg | https://semiq.com/module-packages | semiq.com |
| New Semiconductor Material: AlYN promises more Energy-Efficiency | Researchers at Fraunhofer IAF (Fraunhofer Institut... | 12073 | Industry News | New Semiconductor Material: AlYN promises more Energy-Efficiency | Researchers at Fraunhofer IAF (Fraunhofer Institute for Applied Solid State Physics) have reported that they "made a breakthrough in the field of semiconductor materials": With Aluminum Yttrium Nitride (AlYN), they have succeeded in fabricating and characterizing a new and promising semiconductor material using the MOCVD process. Due to its excellent material properties and its adaptability to gallium nitride (GaN), AlYN is said to have "enormous potential for use in energy-efficient high-frequency and high-performance electronics for information and communications technology". AlYN shows outstanding material properties, however, the growth of the material has been a major challenge. Until now, AlYN could only be deposited by magnetron sputtering. Researchers at Fraunhofer IAF have now succeeded in fabricating the new material using metal-organic chemical vapor deposition (MOCVD) technology, thus enabling the development of new, diverse applications. The institute thinks that "with its promising material properties, AlYN could become a key material for future technological innovations". Recent research had already demonstrated the material properties of AlYN, such as ferroelectricity. In developing the new compound semiconductor, the researchers at Fraunhofer IAF focused primarily on its adaptability to gallium nitride (GaN) – especially in terms of the lattice structure. | 14.08.2024 09:00:00 | Aug | news_2024-09-01_4.jpg | \images\news_2024-09-01_4.jpg | https://www.iaf.fraunhofer.de/en/media-library/press-releases/new-semiconductor-material-AlYN.html | iaf.fraunhofer.de |
| AC Surge Protective Devices | Bourns' Model 1270 and 1280 Series Din-Rail AC Sur... | 12080 | Product Release | AC Surge Protective Devices | Bourns' Model 1270 and 1280 Series Din-Rail AC Surge Protective Devices (SPDs) are IEC/EN 61643-11 compliant Class I + Class II / T1+T2 SPDs, and Model 1280 features an Advanced Thermal Disconnector (TD+) for enhanced protection that eliminates the need for upstream overcurrent protection. Both model series also feature a window fault indicator and remote alarm to help monitor the operating status of the surge protector. In addition, Bourns announced its Model 1430 and 1440 Series Din-Rail DC Surge Protective Devices (SPDs). The two series are IEC/EN 61643-31 compliant Class I + Class II / T1+T2 SPDs. Designed to protect DC power systems, the 14 new models offer protection voltage ranging from 48 VDC up to 1500 VDC and feature high energy MOV technology. In addition, the Model 1440 Series features an Advanced Thermal Disconnector (TD+) as well. Both model series have a replaceable modular design, and also include a window fault indicator and remote alarm, providing enhanced surge protector operating status monitoring. | 14.08.2024 06:30:00 | Aug | news_2024-09-01_11.jpg | \images\news_2024-09-01_11.jpg | http://www.bourns.com/products/surge-protective-devices/dc-power-surge-protective-devices | bourns.com |
| Power Factor Correction Chokes für up to 3,300 W | ITG Electronics has expanded its portfolio of powe... | 12083 | Product Release | Power Factor Correction Chokes für up to 3,300 W | ITG Electronics has expanded its portfolio of power factor correction chokes (PFCs) with a set of solutions designed for high switching frequencies. Capable of handling up to 3,300 W the company's PFC433835B Series include CCM PFC boost converters with switching frequencies from 100 – 200 kHz. An extension of ITG Electronics' Cubic Design set of power factor correction chokes, PFC433835B Series solutions are suitable for Inductance ranges from 90 – 285 µH and have footprints up to 43 mm x 35 mm and maximum heights of 38 mm. Compared with traditional toroidal-shaped PFC chokes, the PFC433835B Series features a flat wire and square core construction to save space and increase power density. The solutions are said to be up to 50% smaller compared with toroidal-shaped PFC chokes with similar power ratings, and their flat wire technology can reduce DC resistance by as much as 40%, leading to substantially lower copper losses. | 13.08.2024 09:30:00 | Aug | news_2024-09-01_14.jpg | \images\news_2024-09-01_14.jpg | https://itg-electronics.com/en/series/914 | itg-electronics.com |
| DC/DC Buck Converter deliver up to 20 A | TDK Corporation expanded its TDK-Lambda i7A series... | 12082 | Product Release | DC/DC Buck Converter deliver up to 20 A | TDK Corporation expanded its TDK-Lambda i7A series of non-isolated buck (step-down) DC/DC converters with the industry-standard 1/16th brick pinout. 20 A output models with a 500 W maximum rating are now available, offering a trimmable 3.3 – 32 V output capability and operation from 28 V up to 60 V input. An adjustable over-current limit is also available as an option, reducing stress on the converter or load when exposed to excessive overcurrent conditions and facilitating fine-tuning based on actual system requirements. The 20A i7A models can be used to derive additional high-power outputs at higher efficiency than isolated DC-DC converters. These products are suited for use in mobile robotics, drones, medical, industrial, test and measurement, communications, computing, and portable battery-powered equipment. Efficiencies of up to 96% minimize internal losses and allow the 20 A i7A models to operate in ambient temperatures of -40 °C up to +125 °C, even with low airflow conditions. The i7A's design provides low output ripple and excellent response to dynamic loads. All models have safety certification to the IEC/UL/CSA/EN 62368-1 standards, with CE and UKCA marking to the Low Voltage and RoHS Directives. | 13.08.2024 08:30:00 | Aug | news_2024-09-01_13.jpg | \images\news_2024-09-01_13.jpg | https://product.tdk.com/system/files/dam/doc/product/power/switching-power/dc-dc-converter/catalog/i7a_e.pdf | tdk.com |
| Intelligent Power Module for Industrial Motors up to 4 kW | Infineon Technologies expands its 7th generation T... | 12081 | Product Release | Intelligent Power Module for Industrial Motors up to 4 kW | Infineon Technologies expands its 7th generation TRENCHSTOP™ IGBT7 product family with the CIPOS™ Maxi Intelligent Power Module (IPM) series for low-power motor drives. The IM12BxxxC1 series is based on the TRENCHSTOP IGBT7 1200 V and rapid diode EmCon 7 technology. Thanks to the latest micro-pattern trench design, it offers exceptional control and performance. This results in significant loss reduction, increased efficiency, and higher power density. The portfolio includes three new products in variants ranging from 10 A to 20 A for power ratings of up to 4.0 kW: IM12B10CC1, IM12B15CC1 and IM12B20EC1. The IM12BxxxC1 series is packaged in a DIP 36x23D housing. It integrates various power and control components. This makes it "the smallest package for 1200 V IPMs with the highest power density and best performance in its class", the company says. The IM12BxxxC1 series is particularly suitable for low-power drives in applications such as motors, pumps, fans, heat pumps and outdoor fans for heating, ventilation, and air conditioning. The IPM series offers an isolated dual-in-line molded housing also meets the EMI and overload protection requirements of demanding designs. In addition to the protection features, the IPM is equipped with an independent UL-certified temperature thermistor. | 12.08.2024 07:30:00 | Aug | news_2024-09-01_12.jpg | \images\news_2024-09-01_12.jpg | https://www.infineon.com/cms/en/about-infineon/press/market-news/2024/INFGIP202408-135.html | infineon.com |
| Connect with the Advanced Battery and Electric & Hybrid Vehicle Technology Community | Join North America's largest advanced battery even... | 12079 | Event News | Connect with the Advanced Battery and Electric & Hybrid Vehicle Technology Community | Join North America's largest advanced battery event, The Battery Show and Electric & Hybrid Vehicle Technology Expo, October 7-10, 2024, at Huntington Place, Detroit. Discover the latest technologies and solutions from over 1,150 exhibitors including industry heavy hitters such as Dow, Parker, Hongfa America, Henkel, Honeywell, Siemens, Ampherr, Sabic, Trumpf and more across multiple sectors including automotive stationary, medical, aerospace, commercial, and industrial applications. Experience live product showcases and visit Pavilions on the show floor, including the new Lead and Recycling Pavilions, for industry-specific innovations. Enhance your knowledge with free educational sessions at the Battery Tech Theatre and Open Tech Forum. For a deeper dive, upgrade to our five-track conference covering advanced battery design, manufacturing, market forecasts, and regulatory trends. Network with over 19,000 professionals in the advanced battery and H/EV community through various expo events. Don't miss the ''Welcome to Detroit: An Electrifying Evening in the Motor City" where we celebrate the new home of The Battery Show and Electric & Hybrid Vehicle Technology Expo in Downtown Detroit. We can't wait to see you there! Register now to secure your FREE expo pass or enjoy a $100 discount on conference passes with code BOD. | 10.08.2024 15:00:00 | Aug | news_2024-09-01_10.jpg | \images\news_2024-09-01_10.jpg | https://register.thebatteryshow.com/37t67i | thebatteryshow.com |
| Automotive DC/DC Converters with "highest Power Density" | Vitesco Technologies created a new generation of D... | 12078 | Industry News | Automotive DC/DC Converters with "highest Power Density" | Vitesco Technologies created a new generation of DC/DC converters that are claimed to “set new standards in power density (efficiency of over 96 percent) and sustainability for power grids, power supplies, and OBC (On-Board Chargers)”. For this design Vitesco has selected the CoolGaN™ Transistors 650 V from Infineon. With GaN Transistors, Vitesco Technlogies was able to design its Gen5+ GaN Air DC/DC converters with passive cooling, which reduces the system's overall cost. The GaN devices also allow for simplified converter design and mechanical integration. As a result, the DC/DC converters can be flexibly positioned in the vehicle, reducing the workload for manufacturers. The use of GaN also allows the power of the converters to be scaled up to 3.6 kW and the power density to be increased to over 4.2 kW/l. The Gen5+ GaN Air DC/DC converters offer an efficiency of over 96 percent and improved thermal behavior compared to the Gen5 Liquid-Cooled converters. They provide a two-phase output of 248 A at 14.5 V continuous. The phases can be combined to achieve the maximum output power. Still, it is also possible to switch off one phase under partial load conditions and interleave the switching frequency between the two phases. | 09.08.2024 14:00:00 | Aug | news_2024-09-01_9.jpg | \images\news_2024-09-01_9.jpg | https://www.infineon.com/cms/en/about-infineon/press/market-news/2024/INFPSS202408-134.html | infineon.com |
| Partnering on new Capacitor-based Energy Storage Systems (CESS) | Flex and Musashi Energy Solutions announced an ext... | 12097 | Industry News | Partnering on new Capacitor-based Energy Storage Systems (CESS) | Flex and Musashi Energy Solutions announced an extensive collaboration to supply Flex-designed and manufactured Capacitor-based Energy Storage Systems (CESS) featuring Musashi's Hybrid SuperCapacitor (HSC) technology. These systems are designed to integrate with server rack power systems to address significant challenges with utility power in artificial intelligence (AI) data centers. First to market with Musashi's HSC technology, Flex has collaborated with Musashi to develop strategic technology and product development roadmaps for current and future products that enable hyperscale operators to mitigate utility power fluctuations in data centers deploying AI workloads. Flex's CESS solutions are designed to balance peak power and protect the grid from intense power surges and line disturbances during AI training and inference activities taking place in data center environments. Musashi's HSCs are designed to provide high-reliability energy storage in many applications. The technology is said to reduce equipment size, weight and total cost of ownership. The new solution is announced to offer "a significantly longer lifespan than current battery energy storage systems, with ability to provide multi-million charge/discharge cycles – essential for high-performance capacity and dependability needed in the data center". Furthermore, it provides a wide operating temperature and inherent safety as the cells are able to operate in temperature ranges from -30 to over +70 °C, plus UL 810A certification and completion of UL 9540A testing for thermal runaway at the cell level. | 08.08.2024 09:30:00 | Aug | news_2024-09-15_8.jpg | \images\news_2024-09-15_8.jpg | https://musashienergysolutions.com/flex-and-musashi-partner/ | musashienergysolutions.com |
| Personnel Change in Executive Board | Peter Riedel has decided to resign from his positi... | 12072 | People | Personnel Change in Executive Board | Peter Riedel has decided to resign from his position as President and COO of Rohde & Schwarz for personal reasons, and he has already left the company, however, he will remain associated with Rohde & Schwarz in an advisory role. After the departure of Peter Riedel, the Executive Board of the Munich technology company now consists of Christian Leicher as President and Chief Executive Officer and CTO Andreas Pauly. For the time being, Andreas Pauly will assume the tasks of Chief Operating Officer on an interim basis. Peter Riedel had been on the Executive Board as Chief Operating Officer since 2014. | 08.08.2024 08:00:00 | Aug | news_2024-09-01_3.jpg | \images\news_2024-09-01_3.jpg | https://www.rohde-schwarz.com/uk/about/news-press/all-news/personnel-change-to-the-rohde-schwarz-executive-board-press-release-detailpage_229356-1512599.html?change_c=true | rohde-schwarz.com |
| SiC Power Semiconductor Fab in Malaysia | As global decarbonization efforts drive demand for... | 12070 | Industry News | SiC Power Semiconductor Fab in Malaysia | As global decarbonization efforts drive demand for power semiconductors, Infineon Technologies has officially opened the first phase of a new fab in Malaysia that will become the world's largest and most competitive 200-millimeter silicon carbide (SiC) power semiconductor fab. Malaysian Prime Minister YAB Dato' Seri Anwar Ibrahim and Chief Minister of the state of Kedah YAB Dato' Seri Haji Muhammad Sanusi Haji Mohd Nor joined Infineon CEO Jochen Hanebeck, to symbolically launch production. The highly efficient 200-millimeter SiC power fab will strengthen Infineon's role as the global leader in power semiconductors. The first phase of the fab, with an investment volume of two billion euros, will focus on the production of silicon carbide power semiconductors and will include gallium nitride (GaN) epitaxy. SiC semiconductors have revolutionized high-power applications because they switch electricity even more efficiently and enable even smaller designs. SiC semiconductors increase efficiency in electric vehicles, fast charging stations and trains as well as renewable energy systems and AI data centers. 900 high-value jobs will be created already in the first phase. The second phase, with an investment of up to five billion euros, will create the world's largest and most efficient 200-millimeter SiC power fab. Overall, up to 4.000 jobs will be created with the project. | 08.08.2024 06:00:00 | Aug | news_2024-09-01_1.jpg | \images\news_2024-09-01_1.jpg | https://www.infineon.com/cms/en/about-infineon/press/press-releases/2024/INFXX202408-133.html | infineon.com |
| Electric Vehicle Charger Reference Designs | To accelerate the time to market of an EV charger,... | 12085 | Product Release | Electric Vehicle Charger Reference Designs | To accelerate the time to market of an EV charger, Microchip Technology now offers three flexible and scalable EV Charger Reference Designs including a Single-Phase AC Residential, a Three-Phase AC Commercial (up to 22 kW) with Open Charge Point Protocol (OCPP) and System-on-Chip (SoC) and a Three-Phase AC Commercial with OCPP and Display. Most of the active components for the EV charger reference designs are available from Microchip, including the microcontroller (MCU), analog front-end, memory, connectivity and power conversion. This significantly streamlines the integration process, enabling manufacturers to speed time to market for new charging solutions. These reference designs offer complete hardware design files and source code with software stacks that are tested and compliant to communication protocols, including OCPP. OCPP offers manufacturers a standard protocol to communicate between the charge point or charging station and a central system. This protocol is designed to enable interoperability of the charging applications regardless of the network or vendor. The EV Reference Designs are supported by MPLAB X Integrated Development Environment (IDE) to help designers minimize development time, as well as MPLAB Harmony v3 and MPLAB Code Configurator. | 07.08.2024 11:30:00 | Aug | news_2024-09-01_16.jpg | \images\news_2024-09-01_16.jpg | https://www.microchip.com/en-us/solutions/automotive-and-transportation/charging-station/ev-offboard-ac-charger-reference-designs | microchip.com |
| Series of Wire-Wound Ferrites extended | Würth Elektronik now offers its WE-RFI inductors i... | 12084 | Product Release | Series of Wire-Wound Ferrites extended | Würth Elektronik now offers its WE-RFI inductors in sizes 0402 and 0603, which can be used as inductors for RF applications or as ferrites for interference suppression. Here the manufacturer responds to increasing miniaturization and complements the existing sizes 0805 and 1008. The components are suitable as low-pass filters (for filtering high-frequency noise), data line filters, supply voltage decoupling, low-frequency radio applications, and RFID. As wire-wound ferrites, the WE-RFI inductors attain higher impedances than normal ferrites, even at high frequencies, and over a wider bandwidth. Unlike multilayer ferrites, they show no DC bias behavior. As RF inductors, they offer high inductance values from 20 nH up to 47 µH. They are characterized by low RDC and consequently a high rated current of up to 1.91 A at ΔT = 40 K. A design kit is available for this component group, which Würth Elektronik will always replenish free of charge, so developers always have inductances of different values to hand. | 07.08.2024 10:30:00 | Aug | news_2024-09-01_15.jpg | \images\news_2024-09-01_15.jpg | https://www.we-online.com/en/news-center/press?instance_ID=5506&d=we-rfi | we-online.com |
| High-Power Semiconductor Company: President Change | Dominic Dorfner will take over as president Semikr... | 12056 | People | High-Power Semiconductor Company: President Change | Dominic Dorfner will take over as president Semikron Danfoss, when Claus A. Petersen retires on August 31, after 40 years in the Danfoss Group. He has been leading Danfoss Silicon Power and Semikron Danfoss for the last 26 years. Dominic Dorfner has been named new president of the company and will start working in his new position on September 1, 2024. He joined Semikron Danfoss in 2021 as head of the industry business in Danfoss Silicon Power, and for the past 13 months he has been leading the automotive division in Semikron Danfoss. Though now retiring as company president, Claus A. Petersen is not completely leaving Semikron Danfoss, as he has joined the board of directors. | 07.08.2024 07:00:00 | Aug | news_2024-08-15_2.jpg | \images\news_2024-08-15_2.jpg | https://www.semikron-danfoss.com/about-semikron-danfoss/news-press/detail/claus-a-petersen-retiring-from-semikron-danfoss-and-has-joined-the-board-of-directors-dominic-dorfner-named-new-president.html | semikron-danfoss.com |
| President of Energy Business | Effective from the beginning of August 2024, Per E... | 12059 | People | President of Energy Business | Effective from the beginning of August 2024, Per Erik Holsten is the president of ABB Energy Industries. He moves into the role from the position of hub manager for Northern Europe at ABB Energy Industries. Per Erik succeeds Brandon Spencer, who has become president of the ABB Motion business area. Per Erik offers vast experience within the energy sector, from traditional sources through to key energy transition industries including hydrogen, offshore wind and Power-to-X. Per Erik Holsten holds an MBA of International Business from the University of East London, UK. He also studied Engineering at Sør-Trøndelag University College (HiST), Norway. He is based in Oslo, Norway. | 05.08.2024 10:00:00 | Aug | news_2024-08-15_5.jpg | \images\news_2024-08-15_5.jpg | https://new.abb.com/process-automation/energy-industries | abb.com |
| SiC MOSFETs for High-Voltage Drives in EVs | With three half-bridge modules in SiC MOSFET techn... | 12062 | Product Release | SiC MOSFETs for High-Voltage Drives in EVs | With three half-bridge modules in SiC MOSFET technology, the manufacturer StarPower is expanding its range of power semiconductors for use in the drivetrain of electric vehicles. The devices, dubbed MD19HFC120N6HT, MD22HFC120N6HY and MD29HFC120N6HT, are characterized by a blocking voltage (V<sub>DSS</sub>) of 1200 V. This means that the products can be used in environments with an 800 V on-board power supply. The individual models of the MOSFET family differ in their on-resistance (R<sub>DS(ON)</sub>), which covers the range between 1.8 mΩ and a maximum of 2.82 mΩ depending on the type. All models in this product family can be connected in parallel to increase the current. These MOSFETS are supplied in a 2-in-1 housing, which is optimized for low parasitic inductance in order to suppress unwanted oscillation tendencies. Heat loss is dissipated via a solid copper base plate with PINFIN structures for optimum cooling. The ceramic material silicon nitride (S<sub>3</sub>N<sub>4</sub>) is used as the carrier substrate, employing the sophisticated AMB (Active Metal Brazing) process. | 05.08.2024 08:30:00 | Aug | news_2024-08-15_8.jpg | \images\news_2024-08-15_8.jpg | https://www.starpowereurope.com/en/products | starpowereurope.com |
| 32-bit-DSCs with more Peripherals for Power Applications | Microchip has launched its dsPIC33A Core family of... | 12060 | Product Release | 32-bit-DSCs with more Peripherals for Power Applications | Microchip has launched its dsPIC33A Core family of Digital Signal Controllers (DSCs) which well-suited for motor control, power supply, charging and sensing systems. Built around a 32-bit CPU architecture with a 200 MHz operating speed, the DSC family's core includes a Double-Precision Floating-Point Unit (DP FPU) and DSP instructions for numerically intensive tasks in many closed-loop control algorithms. The architecture enables real-time control coupled with a comprehensive development tool ecosystem to streamline and accelerate the design process. The DSCs provide additional math and data processing, higher code efficiency, faster context switching and reduced latency than former members of the family. This allows for a faster response time to transient and safety-critical events. New and upgraded peripherals - such as high-resolution PWMs specifically engineered for motor control and digital power conversion - are designed to support progressive technology development in various markets including automotive, industrial, consumer, E-Mobility, data center and sustainable solutions segments. The dsPIC33A family features integrated analog peripherals, including 12-bit ADCs capable of conversion rates up to 40 Msps, comparators and operational amplifiers. These analog peripherals, in conjunction with Core Independent Peripherals (CIPs), allow for sophisticated sensing and high-performance control. In addition, the CIPs enable interaction among the peripherals without the need for CPU involvement. | 30.07.2024 06:30:00 | Jul | news_2024-08-15_6.jpg | \images\news_2024-08-15_6.jpg | https://www.microchip.com/en-us/about/news-releases/products/microchip-technology-introduces-a-new-core-in-the-dspic | microchip.com |
| High-Current Inductor for Automotive Applications | Würth Elektronik offers WE-LHCA (Low Profile High ... | 12069 | Product Release | High-Current Inductor for Automotive Applications | Würth Elektronik offers WE-LHCA (Low Profile High Current Automotive Inductor) – a particularly flat and temperature-tough inductor in four sizes with different inductance values. The power inductors are designed for an extended temperature range of -55 to +155 °C and are constructed to avoid thermal degradation. The AEC-Q200-certified inductor is suitable for applications such as high-current power supplies, start-stop systems, power distribution modules, on-board chargers, infotainment or HVAC systems. The members of this inductor family are available in the following sizes: 7030 (L = 0.47 - 22 µH), 1040 (L = 1 - 68 µH), 1365 (L = 1 - 47 µH) and 1770 (L = 4.7 - 82 µH). These components feature a low-profile shielded construction with a distributed air gap in iron alloy powder. | 25.07.2024 15:30:00 | Jul | news_2024-08-15_15.jpg | \images\news_2024-08-15_15.jpg | https://www.we-online.com/en/news-center/press?instance_ID=5506&d=we-lhca | we-online.com |
| Aluminum Polymer rectangular Capacitors for 48 V | KEMET's aluminum polymer rectangular capacitors of... | 12068 | Product Release | Aluminum Polymer rectangular Capacitors for 48 V | KEMET's aluminum polymer rectangular capacitors of the APL90 series are now available from Rutronik. The capacitors are AEC-Q200 qualified and are particularly suitable for meeting the requirements of 48 V vehicle applications and platforms. The APL90 series currently offers a capacitance of 1,100 µF, a rated voltage of 63 VDC, as well as 20 g vibration resistance and ripple current capability up to 26 A. An important area of application for the APL90 series is the automotive sector, e. g. as a DC link in 48 V inverters for mild hybrid electric vehicles (MHEVs). These capacitors are suited for use in data centers, e. g. as input capacitors in power supply units for 48 V systems. Suitable for use at operating temperatures from -55 °C to +125 °C, the component is shaped for efficient arrangement in modules and can be positioned both horizontally and vertically. Its lifetime is specified with 2,000 hours at +125 °C (with V<sub>R</sub> and I<sub>R</sub> applied). | 25.07.2024 14:30:00 | Jul | news_2024-08-15_14.jpg | \images\news_2024-08-15_14.jpg | https://www.rutronik.com/article/for-48-v-applications-rutronik-introduces-the-new-aluminum-polymer-rectangular-capacitors-of-the-apl90-series-from-kemet | rutronik.com |
| Thermal Pads Protect EV Battery Packs | The Chomerics Division of Parker Hannifin has intr... | 12066 | Product Release | Thermal Pads Protect EV Battery Packs | The Chomerics Division of Parker Hannifin has introduced its THERM-A-GAP™ PAD 30 thermally conductive gap filler pads for EV battery packs that fits seamlessly into robotic assembly processes. THERM-A-GAP PAD 30 thermally conductive gap filler pads for EV battery pack applications are claimed to “provide exceptional performance and conformability”. During assembly, vision sensors can see THERM-A-GAP pads which enables effective quality control and fast production. The pads release directly from their liner for pick-and-place robots, making them well-suited for high-volume applications, and come in specially designed packaging to ensure safe shipment. The pads provide a soft (34 Shore 00) solution with 3.2 W/m-K of thermal conductivity and are claimed to offer low outgassing, ensuring an effective thermal interface between heat sinks and electronic devices where there are uneven surfaces, air gaps and rough surface textures. The supporting electrical properties of this RoHS-compliant thermal gap filler pad include: 5.9 kV<sub>AC</sub>/mm dielectric strength (ASTM D149 test method), 10<sup>13</sup> Ωcm volume resistivity (ASTM D257), 7.7 dielectric constant at 1,000 kHz (ASTM D150) and 0.001 dissipation factor at 1,000 kHz (Chomerics CHO-TM-TP13). | 25.07.2024 12:30:00 | Jul | news_2024-08-15_12.jpg | \images\news_2024-08-15_12.jpg | https://www.parker.com/us/en/divisions/chomerics-division/industries/automotive/error-proofing-tim-application-for-ev-battery-packs.html? | parker.com |
| High Current Three Phase EMC Filter | The chassis mounting three phase EMC filter series... | 12064 | Product Release | High Current Three Phase EMC Filter | The chassis mounting three phase EMC filter series MF423-3-3D-BB from EMIS is designed for higher current rating applications such as photovoltaic (PV) and power drive systems to meet relevant EMC Standards. Installed on the mains input side of equipment the filters improve conducted immunity and reliability. The devices are fitted with busbar termination. Other applications include inverters and converters, industrial three-phase systems and power supplies, large UPS, wind turbines, factory and building automation. Standard features include an operating voltage of 440/520 V<sub>AC</sub>, a current rating of 300 A to 1000 A at 40°C, 50/60 Hz operating frequency within the operating temperature range between -25 °C and +85°C. The climatic category is 25/85/21. | 25.07.2024 10:30:00 | Jul | news_2024-08-15_10.jpg | \images\news_2024-08-15_10.jpg | https://emisglobal.com/products/emi-filters/three-phase/three-stage/mf-423-3-3d-bb/ | emisglobal.com |
| High-Current eFuse with integrated Auto-Reset | Nexperia announced the NPS3102A and NPS3102B elect... | 12063 | Product Release | High-Current eFuse with integrated Auto-Reset | Nexperia announced the NPS3102A and NPS3102B electronic fuses (eFuses). These low-ohmic (17 mΩ), high current (13.5 A), resettable electronic fuses help to protect downstream loads from exposure to excessive voltages while also protecting power supplies from load faults and large inrush currents. They have been designed for use in various 12 V hot-swap applications including enterprise communication and storage equipment found in data centers such as drives, servers, ethernet switches and routers as well as to protect mobile communications infrastructure and industrial automation equipment like PLCs. The eFuses operate in the input voltage range up to 21 V. They are equipped with an integrated low-resistance pass MOSFET which minimizes voltage drop and power loss. The current clamp limit can be adjusted in the 2–13.5 A range using a resistor at the ILIM pin, which can also be used to measure load current in real time. Both devices include a built-in overvoltage clamp limiting the output voltage during an input overvoltage condition, with a 2 µs short-circuit protection response time. The pass-FET in the NPS3102A must be manually reset after a fault event whereas the NPS3102B integrates an auto-retry block, which safely attempts to re-enable the pass-FET without the need for user intervention. | 25.07.2024 09:30:00 | Jul | news_2024-08-15_9.jpg | \images\news_2024-08-15_9.jpg | https://www.nexperia.com/about/news-events/press-releases/nexperia-adds-new-high-current-efuse-with-superior-current-limiting-accuracy-to-its-power-device-portfolio | nexperia.com |
| 4.5 kW Power Supply for AI GPU Racks | Navitas Semiconductor released its 4.5 kW AI data ... | 12048 | Product Release | 4.5 kW Power Supply for AI GPU Racks | Navitas Semiconductor released its 4.5 kW AI data center power supply reference design, with GaNSafe™ and Gen-3 'Fast' (G3F) SiC power components. The design is claimed to "enable the world's highest power density with 137 W/in³ and over 97% efficiency". Next-generation AI GPUs like NVIDIA's Blackwell B100 and B200 each demand over 1 kW of power for high-power computation, 3x higher than traditional CPUs. These new demands are driving power-per-rack specifications from 30 - 40 kW up to 100 kW. The latest 4.5 kW CRPS185 design demonstrates how GaNSafe power ICs and GeneSiC™ Gen-3 'Fast' (G3F) MOSFETs enables highest power density and efficiency solution. At the heart of the design is an interleaved CCM totem-pole PFC using SiC with full-bridge LLC topology with GaN, where the fundamental strengths of each semiconductor technology are exploited for the highest frequency, coolest operation, optimized reliability and robustness, and highest power density and efficiency. The 650 V G3F SiC MOSFETs feature 'trench-assisted planar' technology which delivers "world-leading performance over temperature for the highest system efficiency and reliability in real-world applications". With a 3.2 kW power supply on the market Navitas plans to introduce an 8.5 kW design in September. | 25.07.2024 09:30:00 | Jul | news_2024-08-01_13.jpg | \images\news_2024-08-01_13.jpg | https://navitassemi.com/navitas-overcomes-ai-challenges-with-worlds-highest-power-density-data-center-design/ | navitassemi.com |
| Second Generation of 1200V SiC MOSFET for High Performance Applications | Power Master Semiconductor has released the 2nd ge... | 12061 | Product Release | Second Generation of 1200V SiC MOSFET for High Performance Applications | Power Master Semiconductor has released the 2nd generation of the 1200V <i>e</i> SiC MOSFET, which is intended for applications such as DC EV charging stations, solar inverters, energy storage systems, motor drives and industrial power supplies. The 1200 V devices are claimed to “offer e. g. higher power density, efficiency and less cooling effort due to its much lower power losses”. FOM characteristics such as gate charge (Q<sub>G</sub>), stored energy in output capacitance (EOSS), reverse recovery charger (Q<sub>RR</sub>) and output charge (Q<sub>OSS</sub>) are improved by up to 30 % compared to previous generation. All devices are 100 % tested in terms of avalanche capability. Due to its lower miller capacitance (Q<sub>GD</sub>) it achieved 44 % lower switching losses than the previous generation. | 25.07.2024 07:30:00 | Jul | news_2024-08-15_7.jpg | \images\news_2024-08-15_7.jpg | https://www.powermastersemi.com/product/product04.html | powermastersemi.com |
| Supply Chain for Power Devices based on AlN established | In order to make the ultra-wide band gap (UWBG) te... | 12043 | Industry News | Supply Chain for Power Devices based on AlN established | In order to make the ultra-wide band gap (UWBG) technology AlN accessible to industry in the medium term, the related existing activities in Germany have been combined in a strategic cluster. The aim is to establish a German value chain for AlN-based technology and to build up an international leadership position in this increasingly economically important field. The Ferdinand-Braun-Institut (FBH), the Fraunhofer Institute for Integrated Systems and Device Technology IISB and the company III/V-Reclaim PT GmbH drive this initiative together. They cover the entire value chain, starting with the growth of AlN crystals using the Physical Vapor Transport (PVT) process, to wafering and polishing of epi-ready AlN-wafers, and the epitaxy of the functional device layers, up to the fabrication of transistors for power electronics and millimeter-wave applications. For the first time, the consortium has now successfully demonstrated the practical implementation of a value chain for AlN devices in Germany and Europe. The first transistor generations produced with these wafers already show promising electrical properties, such as a breakdown voltage of up to 2200 V and a power density superior to SiC as well as GaN-based power-switching devices. Compared to established silicon devices, AlN/GaN HEMTs, as they have now been successfully produced on AlN wafers, offer up to three thousand times less conduction losses than with silicon and are around ten times more efficient than SiC transistors. | 24.07.2024 13:00:00 | Jul | news_2024-08-01_8.jpg | \images\news_2024-08-01_8.jpg | https://www.iisb.fraunhofer.de/en/press_media/press_releases/pressearchiv/archiv_2024/AlN-value-chain.html | iisb.fraunhofer.de |
| SEMICON Southeast Asia 2025 to be Held in Singapore | SEMICON Southeast Asia will return to its roots in... | 12058 | Event News | SEMICON Southeast Asia 2025 to be Held in Singapore | SEMICON Southeast Asia will return to its roots in Singapore in 2025 to commemorate its 30th anniversary. With more than 18,000 delegates expected to attend from the region and around the world, SEMICON Southeast Asia has become a key platform for industry leaders, innovators, and decision-makers to connect, collaborate, and drive innovation. This special edition of the event will take place at Sands Expo & Convention Centre from 20 – 22 May 2025. Themed "Stronger Together", SEMICON Southeast Asia 2025 will feature insights into the latest industry developments, trends and innovations, and critical areas including sustainability, artificial intelligence (AI), chiplet technology, and workforce development. Since 2015, SEMICON Southeast Asia has been hosted in Malaysia, contributing significantly to the growth and advancement of the semiconductor industry in the region. | 24.07.2024 09:00:00 | Jul | news_2024-08-15_4.jpg | \images\news_2024-08-15_4.jpg | https://www.semiconsea.org/ | semiconsea.org |
| Varistor Series Offers Surge Current Protection up to 6,000 A | KOA Speer Electronics introduces the NV73S series ... | 12052 | Product Release | Varistor Series Offers Surge Current Protection up to 6,000 A | KOA Speer Electronics introduces the NV73S series multilayer type metal oxide varistor that handles a surge current of up to 6,000 A, which is five times higher than existing products. The multilayer construction can absorb a large surge. The two-way symmetries can absorb positive and negative surges. The NV73S replaces the NV732E (1210) through 2L (2220) due to its improved surge protection. Maximum peak current and sizes for the new NV73S are 400 to 800 A (1210), 500 to 1,200 A (1812), and 1,500 to 6,000 A (2220) with a working voltage range of 6 to 95 V (AC) and 9 to 127 V (DC). The varistor voltage range for the NV73S series is 12 to 150 V. The NV73S series metal oxide varistor offers protection from ESD and EMI. It also provides surge protection for motors, relays, and solenoid valves. It meets EU-RoHS requirements. | 23.07.2024 13:30:00 | Jul | news_2024-08-01_17.jpg | \images\news_2024-08-01_17.jpg | https://www.koaspeer.com/news/1970/110/KOA_Speers_New_Varistor_Series_Offers_Surge_Current_Protection_Up_to_6000A_NV73S_Series/ | koaspeer.com |
| Supply Agreement: SiC MOSFETs for EVs | onsemi has signed a multi-year deal with Volkswage... | 12036 | Industry News | Supply Agreement: SiC MOSFETs for EVs | onsemi has signed a multi-year deal with Volkswagen Group to be the primary supplier of a complete power box solution as part of its next-generation traction inverter for its Scalable Systems Platform (SSP). The solution features silicon carbide-based technologies in an integrated module that can scale across all power levels – from high power to low power traction inverters to be compatible for all vehicle categories. Based on the EliteSiC M3e MOSFETs, onsemi's power box solution is said to be able to handle more power in a smaller package which significantly reduces energy losses. The inclusion of three integrated half-bridge modules mounted on a cooling channel will further improve system efficiency by ensuring heat is effectively managed from the semiconductor to the coolant encasement. This leads to better performance, improved heat control, and increased efficiency, allowing EVs to drive further on a single charge. | 22.07.2024 06:00:00 | Jul | news_2024-08-01_1.jpg | \images\news_2024-08-01_1.jpg | https://investor.onsemi.com/news-releases/news-release-details/onsemi-selected-power-volkswagen-groups-next-generation-electric | onsemi.com |
| SiC Modules for Power Grid Batteries | Infineon Technologies announced that its CoolSiC&t... | 12057 | Industry News | SiC Modules for Power Grid Batteries | Infineon Technologies announced that its CoolSiC™ 2000 V modules have been selected by Daihen Corporation for their unit-type power conditioners for grid storage batteries. The unit-type power conditioner for grid storage batteries launched by Daihen earlier this year is the first product in the industry to achieve connection to storage batteries at a high DC link voltage of 1500 V. The higher voltage enables the product to be used with large-capacity storage battery facilities, which has resulted in a 40 percent reduction in the footprint of grid storage batteries compared to the conventional product. The higher power density is achieved by using Infineon's 62 mm CoolSiC MOSFET 2000 V module FF3MR20KM1H. In addition to the characteristics of SiC that enable high voltage, better thermal dissipation and high power density, Infineon's SiC products feature M1H trench technology that increases the gate drive voltage range and provides high robustness and reliability against gate voltage spikes. | 19.07.2024 08:00:00 | Jul | news_2024-08-15_3.jpg | \images\news_2024-08-15_3.jpg | https://www.infineon.com/cms/en/about-infineon/press/market-news/2024/INFGIP202407-026.html | infineon.com |
| 150 V N-Channel Power U-MOS X-H MOSFETs | Toshiba Electronics Europe adds two 150 V N-channe... | 12065 | Product Release | 150 V N-Channel Power U-MOS X-H MOSFETs | Toshiba Electronics Europe adds two 150 V N-channel power MOSFET products based upon their U-MOS X-H Trench process. The TPH1100CQ5 and TPH1400CQ5 devices are designed specifically for use in high-performance switching power supplies, such as those used in data centers and communication base stations as well as other industrial applications. With a maximum drain-source voltage (V<sub>DSS</sub>) rating of 150 V and drain current (I<sub>D</sub>) handling of 49 A (TPH1100CQ5) and 32A (TPH1400CQ5), the devices feature a maximum drain-source on-resistance (R<sub>DS(ON)</sub>) of 11 mΩ and 14 mΩ, respectively. The reverse recovery charge (Qrr) of TPH1400CQ5 is 27 nC (typ.), and the typical reverse recovery time (trr) is 36 ns. Used in synchronous rectification applications, the TPH1400CQ5 reduces the power loss of switching power supplies and helps improve efficiency. When used in a circuit that operates in reverse recovery mode, the new products reduce spike voltages generated during switching, helping to improve EMI characteristics. The devices are housed in a surface-mount SOP Advance(N) package measuring 4.9 mm x 6.1 mm x 1.0 mm. A G0 SPICE model for rapid verification of the circuit function as well as highly accurate G2 SPICE models, for accurate reproduction of transient characteristics are also available. | 18.07.2024 11:30:00 | Jul | news_2024-08-15_11.jpg | \images\news_2024-08-15_11.jpg | https://toshiba.semicon-storage.com/eu/company/news/2024/07/mosfet-20240718-1.html | toshiba.semicon-storage.com |
| Memorandum of Understanding to stimulate sustainable Action across the Supply Chain | Infineon Technologies has signed a Memorandum of U... | 12038 | Industry News | Memorandum of Understanding to stimulate sustainable Action across the Supply Chain | Infineon Technologies has signed a Memorandum of Understanding with Amkor Technology, a provider of semiconductor packaging and test services, with a joint commitment to stimulate decarbonization and sustainability strategies across the supply chain. Expanding their partnership towards sustainability is the next step in the sustainability journey of both companies. Infineon and Amkor intend to fully leverage their classical Outsourced Semiconductor Assembly and Test (OSAT) business relationship in order to effectively tackle emissions along their supply chain. In April, both companies announced to operate a dedicated packaging and test center at Amkor's manufacturing site in Porto, Portugal. As part of the cooperation for climate protection, Infineon and Amkor will actively engage with common suppliers to help them develop and implement effective decarbonization strategies. This will involve workshops, meetings, and the sharing of best practices and learnings related to decarbonization. The aim is to identify areas for improvement and support suppliers in setting science-based emissions reduction targets in line with the Science Based Targets initiative. Both companies are committed to providing ongoing guidance, fostering exchange, and tracking progress to drive continuous improvement across the common supply chain. | 18.07.2024 08:00:00 | Jul | news_2024-08-01_3.jpg | \images\news_2024-08-01_3.jpg | https://www.infineon.com/cms/en/about-infineon/press/press-releases/2024/INFXX202407-025.html | infineon.com |
| PCIM Europe 2025: Call for Papers | Starting now, experts from the realms of business ... | 12044 | Event News | PCIM Europe 2025: Call for Papers | Starting now, experts from the realms of business and academia can submit their abstracts on a wide range of topics in power electronics for a chance to speak at the PCIM Conference 2025. This call for papers will be open until 15 October 2024. The PCIM Conference gives authors of first-time publications the opportunity to present their work to an international audience of more than 900 representatives from the business and scientific sides of power electronics. All those accepted will have their articles published in the PCIM Conference proceedings and databases like IEEE Xplore, IET Inspec Direct, Knovel, and Scopus. In addition, presenters at the PCIM Conference will benefit from the immediate feedback they receive from both the industry and the academic world – and they will be able to make a number of contacts in the power electronics community in the process. The PCIM Conference offers a several options to present: From 20-minute talks on the conference stages via poster presentations offering direct interaction directly with other attendees up to half-day seminars. This year's best submissions will be recognized in five categories by the Best Paper Award, the Young Engineer Award, and the Young Researcher Award. | 17.07.2024 14:00:00 | Jul | news_2024-08-01_9.jpg | \images\news_2024-08-01_9.jpg | https://pcim.mesago.com/nuernberg/en/press/press-releases/pcim-press-releases/callforpapers25.html | pcim.com |
| Testing Procedure for Determining Dielectric Strength | Würth Elektronik has developed a testing procedure... | 12040 | Industry News | Testing Procedure for Determining Dielectric Strength | Würth Elektronik has developed a testing procedure for determining the maximum operating voltage of molded inductors. The manufacturer of electronic and electromechanical components introduces developers to the electrical property of dielectric strength and what happens if it is exceeded in an application note. The molded inductors from the Power Magnetics product portfolio (e. g., WE-MAPI, WE-XHMI, WE-LHMI) are now successively supplemented with the value of the maximum operating voltage V<sub>op</sub> as a new parameter in the specifications. Based on the testing procedure, Würth Elektronik defines the maximum operating voltage V<sub>op</sub> in its data sheets. This represents the voltage at which an inductor can be operated continuously in the application without impairing performance, risking damage or overheating the inductor. The operating voltage is therefore a limit value for the input voltage, up to which the inductor can be used reliably in an application without irreversible damage. The test concept examines the behavior of inductors up to their voltage limits under realistic conditions in a DC/DC full-bridge converter (voltage transients of up to 60 V/ns and frequencies of up to 2 MHz). The approximate voltage limit is firstly evaluated using a short-term test. The operating voltage is then defined on this basis and verified in a long-term test. | 17.07.2024 10:00:00 | Jul | news_2024-08-01_5.jpg | \images\news_2024-08-01_5.jpg | https://www.we-online.com/en/news-center/press/press-releases?d=voltage-specification | we-online.com |
| Magnetic Packaging Technology for Power Modules: Cutting Size in half | Texas Instruments (TI) introduced six power module... | 12051 | Product Release | Magnetic Packaging Technology for Power Modules: Cutting Size in half | Texas Instruments (TI) introduced six power modules designed to improve power density, enhance efficiency and reduce EMI. These power modules leverage TI's proprietary MagPack™ integrated magnetic packaging technology, "shrinking their size by up to 23% compared to competing modules", enabling designers of industrial, enterprise and communications applications to achieve previously impossible performance levels. In fact, three of the six devices, the TPSM82866A, TPSM82866C and TPSM82816, are claimed to be "the industry's smallest 6 A power modules, supplying a power density of nearly 1A per 1 mm<sup>2</sup> of area". The magnetic packaging technology includes an integrated power inductor with proprietary, newly engineered material. As a result, engineers can now reduce temperature and radiated emissions while reducing both board space and system power losses. This is especially important in applications such as data centers, where electricity is the biggest cost factor, with some analysts predicting a 100% increase in demand for power by the end of the decade. | 16.07.2024 12:30:00 | Jul | news_2024-08-01_16.jpg | \images\news_2024-08-01_16.jpg | https://news.ti.com/2024-07-16-TI-pioneers-new-magnetic-packaging-technology-for-power-modules,-cutting-power-solution-size-in-half | ti.com |
| 3-Phase Brushless Gate Driver with Power Module and Sleep Mode | Microchip has launched the MPC8027, a 3-phase brus... | 12045 | Product Release | 3-Phase Brushless Gate Driver with Power Module and Sleep Mode | Microchip has launched the MPC8027, a 3-phase brushless gate driver module with a typical sleep-mode current of 5 µA. MCP8027 integrates three half-bridge drivers to drive external NMOS/NMOS transistor pairs configured to drive a 3-phase BLDC motor, a comparator, a voltage regulator to provide bias to a companion microcontroller, power monitoring comparators, an overtemperature sensor, two level translators and three operational amplifiers for motor current monitoring. The MCP8027 buck converter is capable of delivering 750 mW of power - may be disabled if not used - for powering a companion microcontroller. The onboard 5 V and 12 V LDO regulators are capable of delivering 30 mA of current. The MCP8027 operation is specified over a temperature range of -40°C to +150°C. Package options include the 40-lead 5x5 QFN and 48-lead 7x7 TQFP. For 100 ms the transient voltage tolerance is 48 V. Thermal warning and shutdown are also integrated. | 15.07.2024 06:30:00 | Jul | news_2024-08-01_10.jpg | \images\news_2024-08-01_10.jpg | https://www.microchip.com/en-us/product/MCP8027 | microchip.com |
| Hyperfast Recovery Rectifiers in D²PAK | Nexperia released 650 V ultra- and hyperfast recov... | 12053 | Product Release | Hyperfast Recovery Rectifiers in D²PAK | Nexperia released 650 V ultra- and hyperfast recovery rectifiers in D²PAK Real-2-Pin (R2P) packaging for use in various automotive, industrial and consumer applications including charging adapters, photovoltaic, inverters, servers and switched mode power supplies. Combining planar die technology with a state-of-the-art junction termination (JTE) design, these rectifiers offer high power density, fast switching times with soft recovery and excellent reliability. They are encapsulated in a D<sup>2</sup>PAK Real-2-Pin Package (SOT8018), which offers the same package outline as the standard D<sup>2</sup>PAK package but has only two pins instead of three (the middle cathode pin has been removed). This increases the pin-to-pin distance from 1.25 mm to over 4 mm, which allows to meet the creepage and clearance requirements stated in the IEC 60664 standard. | 10.07.2024 14:30:00 | Jul | news_2024-08-01_18.jpg | \images\news_2024-08-01_18.jpg | https://www.nexperia.com/about/news-events/press-releases/Nexperia-s-650-V-ultra--and-hyperfast-recovery-rectifiers-in-D2PAK-Real-2-Pin-packaging-offer-high-efficiency-and-reliability | nexperia.com |
| Opening of Wafer Testing Site in Malaysia | Melexis has opened its largest wafer testing site ... | 12042 | Industry News | Opening of Wafer Testing Site in Malaysia | Melexis has opened its largest wafer testing site worldwide in Kuching, Sarawak, Malaysia. This expansion also increases Melexis' presence in the Asia-Pacific region. The expansion in Malaysia is said to allow the company to fulfil the growing global demand for semiconductors, which is expected to double in the next decade. It hosts 90 semiconductor wafer test equipments used to test ICs. Melexis will use the site for edge sensors and edge drivers aimed at current and future applications in the mobility, sustainability, robotics, and health areas. Placing the facility in Kuching - Sarawak - Malaysia, member of the Association of Southeast Asian Nations (ASEAN), between Eastern and Western markets and next to X-FAB's wafer foundry, one of Melexis' key suppliers, is a strategic move to streamline logistics and help reducing the company's ecological footprint. The 4-storey building, designed by, both award-winning, Belgian architect Sebastian Mortelmans and Sarawakian architects DNA, covers a ground surface of 4,500 square metres, making it the largest Melexis wafer testing site worldwide. The modern design referencing local longhouse architecture, incorporates energy-saving systems including a solar installation that can generate 30.000 kWh per month. The facility is designed with future expansions in mind. | 10.07.2024 12:00:00 | Jul | news_2024-08-01_7.jpg | \images\news_2024-08-01_7.jpg | https://www.melexis.com/en/news/2024/10jul2024-melexis-opens-its-largest-wafer-testing-site-worldwide-in-malaysia | melexis.com |
| Analog-Digital Fusion Control Power Supply Solution | Rohm has established LogiCoA™, a power suppl... | 12050 | Product Release | Analog-Digital Fusion Control Power Supply Solution | Rohm has established LogiCoA™, a power supply solution for small to medium power industrial and consumer equipment (30 W to 1 kW class). It provides the same functionality as fully digital control power supplies at low power consumption and cost equivalent to analog power types. The LogiCoA power solution leverages the strengths of both analog and digital technologies. Low power LogiCoA MCUs are utilized to facilitate control of a variety of power supply topologies. The LogiCoA brand embodies a design philosophy of fusing digital elements to maximize the performance of analog circuits. Rohm claims that its LogiCoA power solution is "the industry's first analog-digital fusion control power supply that combines a digital control block" centered around the LogiCoA MCU with analog circuitry comprised of silicon MOSFETs and other power devices. The evaluation reference design REF66009 allows users to experience the LogiCoA power supply solution in a non-isolated buck converter circuit. Various tools necessary for evaluation are also offered, including circuit diagrams, PCB layouts, parts lists, sample software, and support documents, while actual device evaluation is possible using the optional EVK-001 evaluation board. | 10.07.2024 11:30:00 | Jul | news_2024-08-01_15.jpg | \images\news_2024-08-01_15.jpg | https://www.rohm.com/news-detail?news-title=2024-07-10_news_logicoa&defaultGroupId=false | rohm.com |
| Several Changes in Management | After more than 25 years at Schurter, the current ... | 12037 | People | Several Changes in Management | After more than 25 years at Schurter, the current Managing Director (MD), Rolf Hausheer, will retire at the end of 2024. He handed over the position of MD of Schurter AG to Steffen Lindner on 1 July 2024. Steffen Lindner is already acting as the General Manager & Vice President EMEA. Rolf Hausheer's career at Schurter began in April 1999 as the Head of Procurement. As of 2009, he was appointed to the management team, taking responsibility for Supply Chain Management, including Sourcing, Customer Service, and Warehouse. Since February 2024, Rolf Hausheer has been leading Schurter AG as MD ad interim. Despite the additional responsibility as MD, he retained leadership of Supply Chain Management and supported the strategic direction of the company as Co-Program Management Officer. Furthermore, as of July 2024, Steffen Lindner has assumed the role of MD of Schurter AG. He already manages the Schurter group company in Germany and oversees all company activities in EMEA, including Product Management, Engineering, Sales, and Production. Simultaneously, responsibility for Supply Chain Management has been handed over to Oswald Fiegl, the acting COO. Rolf Hausheer is now focusing on organizational projects within the company's strategy. | 10.07.2024 07:00:00 | Jul | news_2024-08-01_2.jpg | \images\news_2024-08-01_2.jpg | https://www.schurter.com/en/news/handover-at-schurter-ag | schurter.com |
| Faster Development Processes for DC Charging Stations | The charging controller developer Vector Informati... | 12024 | Industry News | Faster Development Processes for DC Charging Stations | The charging controller developer Vector Informatik and AST International are now offering a joint solution for the development of DC charging stations. The compatibility of the communication protocols of the Vector charging controller vSECC and the AST DC meter is ensured, which enables charging station manufacturers to offer a convenient plug-and-play solution. This shortens development times and enables complete integration. Vector's vSECC controllers control the charging communication between electric vehicles, charging station components and backend systems and support common charging standards such as CCS, NACS, CHAdeMO and MCS. The AST DC Meters provide continuous precise measurements for fast charging stations, megawatt charging systems and DC wallboxes. They are certified according to German, European and North American calibration law requirements. | 09.07.2024 14:00:00 | Jul | news_2024-07-15_9.jpg | \images\news_2024-07-15_9.jpg | https://www.ast-international.com/en.news.faster-development-processes-for-dc-charging-stations-thanks-to-partnership-between-vector-informatik-and-ast-international.html | ast-international.com |
| Scalable Industry 4.0-ready Zero-Downtime Industrial Power Supply Series | The CPS-i series from CAMTEC Power Supplies is bas... | 12067 | Product Release | Scalable Industry 4.0-ready Zero-Downtime Industrial Power Supply Series | The CPS-i series from CAMTEC Power Supplies is based on a specific steering and control architecture. It is designed for testing automation and high-end industrial lab power supply users. It supports production process planners as well as energy and water infrastructure or UPS-system engineers. It offers free scalability from 2000 W up to 105 kW power output, accompanied by flexible up- and downscaling and service by the customer himself. The CPS-I series connects up to 35 power supply units to form a large (DC grid) network by configuring master-slave-master to slave systems. With its modular design it is possible to scale this system to the required power. If the power supply units are decoupled from each other, the result will be independent systems, which can then be used stand-alone or in new arrangements, provided one inexpensive power supply unit is added to each new block. Configuration and maintenance are achieved via web browser. Defect LAN interfaces can be replaced by the system operator himself, as the interfaces recognize the power supply unit on their own and calibrate themselves. Defect devices, therefore, don't have to go back to the service unit, but can be repaired on-site. | 09.07.2024 13:30:00 | Jul | news_2024-08-15_13.jpg | \images\news_2024-08-15_13.jpg | https://www.camtec-powersupplies.com/ | camtec-powersupplies.com |
| Battery Protector Series to Prevent Li-ion Battery Pack Damage | Littelfuse announced the extension of its ITV2718 ... | 12049 | Product Release | Battery Protector Series to Prevent Li-ion Battery Pack Damage | Littelfuse announced the extension of its ITV2718 surface-mountable Li-ion battery protector series. These fuses safeguard Li-ion battery packs against overcurrent and overcharging (overvoltage) conditions - even when fast charging. The latest addition, the ITV2718, provides a five-amp, three-terminal fuse in a 2.7 mm x 1.8 mm footprint. The design utilizes an embedded fuse and heater element combination to respond quickly, interrupting the battery pack's charging or discharging circuit before overcharging or overheating conditions occur. The ITV2718 Battery Protector is suited for a wide range of consumer electronics applications, including game consoles, E-call, portable routers and modems, smartphones, notebooks and tablets. It meets industry safety requirements via UL and TÜV certifications for faster compliance approval while being halogen-free and RoHS compliant environmentally friendly components. | 09.07.2024 10:30:00 | Jul | news_2024-08-01_14.jpg | \images\news_2024-08-01_14.jpg | https://www.littelfuse.com/about-us/news/news-releases/2024/littelfuse-adds-itv2718-5-amp-rated-battery-protector-series-to-prevent-li-ion-battery-pack-damage.aspx | littelfuse.com |
| Optocoupler Series expanded with Opto-TRIACs | Würth Elektronik now offers a solution for phase c... | 12054 | Product Release | Optocoupler Series expanded with Opto-TRIACs | Würth Elektronik now offers a solution for phase control of AC loads, the WL-OCTR optocouplers, a safe alternative to mechanical relays. The TRIAC optocouplers are particularly suitable for use in lamp dimming functions and AC motor drivers in household appliances. They can also be used as drivers for high-current TRIACs. These optocouplers are available with and without a zero-cross function to shift the TRIAC switch-on point. The portfolio includes both THT and SMT designs in DIP4, DIP6 and SOP4 packages and offers trigger currents of 5, 10 or 15 mA. A CTI (Comparative Tracking Index) value (describing leakage current stability) of over 500 and insulation voltages of 3750 or 5000 V for the THT and SMT designs makes the optocouplers well-suited for circuit protection. Like all optocouplers from Würth Elektronik, the newest addition to the optocoupler portfolio is certified to all necessary standards: UL1577, EN IEC 60747-5-5 VDE 0884-5, CQC GB 4941.1-2022. | 04.07.2024 15:30:00 | Jul | news_2024-08-01_19.jpg | \images\news_2024-08-01_19.jpg | https://www.we-online.com/en/news-center/press/press-releases?d=optocoupler-series-with-Opto-TRIACs | we-online.com |
| New Building for more SiC Wafer Production Space | In an important step towards strengthening the sem... | 12018 | Industry News | New Building for more SiC Wafer Production Space | In an important step towards strengthening the semiconductor industry and promoting sustainable technologies, SiCrystal will create additional production space in the north-east of Nuremberg, directly opposite the existing site. The new building will offer an additional 6,000 square meters of production space and will be equipped with state-of-the-art technology to further optimize the production of silicon carbide wafers. The close proximity to the existing plant will ensure close integration of the production processes. SiCrystal's total production capacity, including the existing building, will be approximately three times higher in 2027 than in 2024. "This groundbreaking ceremony marks an important milestone for SiCrystal and underlines our commitment to the metropolitan region. In this way, we can continue to supply innovative products of the highest quality for our customers in the future and make a positive contribution to global sustainability. ", said Dr. Erwin Schmitt, COO of SiCrystal. "With the additional production capacities, we will strengthen our market position and make an important contribution to technological development in the semiconductor industry." | 04.07.2024 08:00:00 | Jul | news_2024-07-15_3.jpg | \images\news_2024-07-15_3.jpg | https://www.sicrystal.de/index.php/de/news | sicrystal.de |
| Experts for WBG-Testing Acquired | After receiving approval from the British and Ital... | 12020 | Industry News | Experts for WBG-Testing Acquired | After receiving approval from the British and Italian governments, Microtest Group announces the acquisition of ipTEST. ipTEST specializes in testing silicon carbide and gallium nitride semiconductors, with locations in Guildford (UK) and Ipoh (Malaysia) and reported €22 million in revenue in 2023. This transaction marks the fourth acquisition for the Group in just over a year - following the 2023 acquisitions of the Dutch company Test Inspire, the German company RoodMicrotec and the Italian company GEDEC. This move is part of the growth and international development strategy launched in 2022 with the support of Xenon Private Equity, aiming to make Microtest the European reference point for chip design (ASIC), test systems and in the testing of microchips on package and silicon wafers. From an industrial perspective, integrating ipTEST will bring significant expertise in innovative device development, such as the new DS5, which won the prestigious King's Award for Enterprise in 2023 and 2024 for silicon carbide and gallium nitride semiconductor testing. These frontier semiconductors are crucial for managing electric vehicle batteries and inverters, with expected growth of over 30% annually in the next five years due to the ongoing energy transition. This acquisition will enable Microtest to serve power microchip manufacturers making substantial investments to meet new sector demands, including the main IDM’s in the industry ST Microelectronics, Infineon and Wolfspeed. | 03.07.2024 10:00:00 | Jul | news_2024-07-15_5.jpg | \images\news_2024-07-15_5.jpg | https://www.microtest.net/microtest-group-acquires-iptest/ | microtest.net |
| Technology Acquisition Expands Power Management Solutions | GlobalFoundries announced that it has acquired Tag... | 12017 | Industry News | Technology Acquisition Expands Power Management Solutions | GlobalFoundries announced that it has acquired Tagore Technology’s proprietary and production proven Power Gallium Nitride (GaN) IP portfolio, a high-power density solution designed to push the boundaries of efficiency and performance in a wide range of power applications in automotive, internet of things (IoT) and artificial intelligence (AI) datacenter. As the digital world continues to evolve with technologies like Generative AI, GaN stands out as a pivotal solution for sustainable and efficient power management particularly in datacenters. The announcement reinforces GF’s commitment to large-scale manufacturing of GaN technology that offers a suite of benefits to help datacenters meet the increasing power demands while maintaining or improving power efficiency, reducing costs and managing heat generation. The acquisition expands GF’s power IP portfolio and broadens access to GaN IP that will enable GF customers to quickly bring differentiated products to market. As a part of the acquisition, a team of experienced engineers from Tagore, dedicated to the development of GaN technology, will be joining GF. “We are committed to being the foundation of our customers’ power applications today and for decades to come,” said Niels Anderskouv, chief business officer at GF. “With this acquisition, GF takes another step toward accelerating the availability of GaN and empowering our customers to build the next generation of power management solutions that will reshape the future of mobility, connectivity and intelligence.” | 01.07.2024 07:00:00 | Jul | news_2024-07-15_2.jpg | \images\news_2024-07-15_2.jpg | https://gf.com/gf-press-release/globalfoundries-acquires-tagore-technologys-gan-technology-to-accelerate-disruptive-powermanagement-solutions/ | gf.com |
| Open for Proposals for Power Event | APEC now accepts Professional Education Seminar Pr... | 12041 | Event News | Open for Proposals for Power Event | APEC now accepts Professional Education Seminar Proposals for APEC 2025, which will take place March 16-20, 2025 at the Georgia World Congress Center in Atlanta, GA (USA). APEC continues the tradition of focusing on the practical aspects of the power electronics profession; the Professional Education Seminars at APEC 2025 will address the need for in-depth discussions of important and complex power electronics topics. Each seminar combines practical application with theory designed to further educate the working professional in power electronics or related fields. Topics are to address the practical issues of the specification, design, manufacture and marketing of power electronic components, products, and systems. Proposals focusing on, but not limited to, any of the following areas of power electronics are welcome. All the relevant details can be found the APEC website, including submission requirements and additional details. | 28.06.2024 11:00:00 | Jun | news_2024-08-01_6.jpg | \images\news_2024-08-01_6.jpg | https://apec-conf.org/speakers/seminar-speaker-info/ | apec-conf.org |
| Attracting more People to Careers in the Semiconductor Industry | The CHIPS of Europe (Creating Higher-Education Ind... | 12039 | Industry News | Attracting more People to Careers in the Semiconductor Industry | The CHIPS of Europe (Creating Higher-Education Industry Programmes for the Semiconductor Industry of Europe) project is addressing the shortage of workforce in the EU semiconductor industry. In the next four years industry and academia will work together to increase the attractiveness of semiconductor-related study programs and careers. The need for more skilled workers in the EU semiconductor industry has increased due to the new investments via the EU Chips Act. If no action is taken, the EU semiconductor industry will face a shortage of 350,000 workers by 2030. CHIPS of Europe intends to increase the attractiveness of semiconductor-related study programmes and careers. It brings together large companies and small and medium-sized enterprises, such as Infineon, Imec, X-Fab, Cadence, Nextnano, and universities. The project includes partners from fascinating application fields such as medical and space which touch on the hearts and minds of future workforce. Involving 14 full and 7 associated partners from 10 countries spread across Europe, the project employs targeted measures in order to leave a sustainable impact on the European semiconductor ecosystem. The CHIPS of Europe project is co-funded by the European Union (Digital Europe – Reinforcing skills in semiconductors) semiconductor ecosystem. There will also be summer schools at fabs and virtual labs. | 28.06.2024 09:00:00 | Jun | news_2024-08-01_4.jpg | \images\news_2024-08-01_4.jpg | https://www.ecpe.org/research/chips-of-europe/chips-of-europe/ | ecpe.org |
| Charity Benefit from PCIM Booth for Education in Ecuador | Vincotech staged a charity benefit at the PCIM Eur... | 11986 | Industry News | Charity Benefit from PCIM Booth for Education in Ecuador | Vincotech staged a charity benefit at the PCIM Europe trade fair to raise funds for the NGO Plan International Germany. Visitors rose to this virtual reality (VR) challenge. Vincotech and its partners rewarded their efforts by donating €15,000 to a project to support young Ecuadorians. Vincotech has a history of hosting charity events at PCIM Europe. Ranging from wall climbing to Sudoku, these activities have been a big hit with fairgoers. This year’s event – a VR flight over mountainous terrain – was yet another audience magnet. Hundreds of PCIM Europe visitors (including a Bodo’s Power System editor) took up the challenge, with Vincotech matching all pledges to raise €15,000 for a Plan International Germany project in Ecuador. The money goes to support youngsters, especially girls, in ten communities each in the Cotopaxi and Santa Elena regions. It funds projects to convey entrepreneurial, digital, and soft skills that will help them get off to a better start in professional life, as well as health services for mothers and children. This project, which involves 2,000 individuals directly and indirectly benefits nearly 6,000 community members, is a certainly a winning proposition young Ecuadorians in the region. Plan International is an independent organization, with no religious, political or governmental affiliations, standing up for children’s rights worldwide and striving to be open, accountable and honest in what the NGO does. | 27.06.2024 16:00:00 | Jun | news_2024-07-01_10.jpg | \images\news_2024-07-01_10.jpg | https://www.vincotech.com/news/company-news/article/vincotechs-pcim-booth-raises-eur15000-for-project.html | vincotech.com |
| Connecting Engineers to the Future of EV/HEV Technology | Mouser Electronics explores the latest development... | 12023 | Industry News | Connecting Engineers to the Future of EV/HEV Technology | Mouser Electronics explores the latest developments, advancements and challenges in electric and hybrid vehicle technology through its EV/HEV resource hub. Staying ahead in this rapidly evolving industry is crucial for engineers and innovators. With advancing technologies like bi-directional charging and vehicle autonomy entering the market, it's more important than ever to stay up to speed. Mouser's EV/HEV resource hub offers a wealth of engaging content, including eBooks, blogs, articles, products, and more, all designed to keep engineers at the forefront of these technological advancements. Electric infrastructure is advancing with the use of emerging technologies, such as liquid-cooled HPC connectors, while still maintaining the latest industry standards and lowering maintenance costs. This development empowers the future of eMobility, as discussed in Mouser's interactive content series <i>“Electrifying the Future of eMobility”</i>, exploring how current renewable energy sources and evolving technologies like hydrogen electrolysis are driving toward a net-zero future. The EV/HEV technology content hub offers engineers access to resources from Mouser's technical team and leading manufacturers. In a recent eBook with TE Connectivity, <i>“EV and Connected Transportation”</i>, industry experts explain the tandem movement of e-mobility and connected travel via new standards and the use of the V2X ecosystem to make more efficient, accurate, and safer roads for vehicles. | 27.06.2024 13:00:00 | Jun | news_2024-07-15_8.jpg | \images\news_2024-07-15_8.jpg | https://eu.mouser.com/newsroom/publicrelations-application-resource-ev-hev-2024final/ | mouser.com |
| Power Factor Correction: Chokes with High-Current Offerings | ITG Electronics has expanded its portfolio of powe... | 12046 | Product Release | Power Factor Correction: Chokes with High-Current Offerings | ITG Electronics has expanded its portfolio of power factor correction chokes (PFCs) with a set of solutions designed for comparatively high-wattage applications. The company's PFC383637B Series solutions can handle up to 3,300 W and include CCM PFC boost converters with switching frequencies from 60 to 200 kHz. An extension of ITG Electronics' Cubic Design set of power factor correction chokes, PFC383637B Series solutions are suitable for Inductance ranges from 180 – 360 µH at footprints up to 37.5 mm x 36.5 mm with maximum heights of 36 mm. Compared with traditional toroidal-shaped PFC chokes, the PFC383637B Series features a flat wire and square core construction to save space and increase power density. The solutions are up to 50% smaller compared to toroidal-shaped PFC chokes with similar power ratings, and their flat wire technology can reduce DC resistance by as much as 40%, leading to substantially lower copper losses. The PFC383637B Series of PFC chokes is applicable for AC to DC conversion in industrial, equipment and automotive applications. Notably, the high-current output chokes can handle up to 32.4 A with approximately 50% roll off. | 27.06.2024 07:30:00 | Jun | news_2024-08-01_11.jpg | \images\news_2024-08-01_11.jpg | https://www.itg-electronics.com/en/category/4 | itg-electronics.com |
| electronica 2024: Answers to the major Challenges facing the Automotive Industry | From connected mobility to autonomous driving or s... | 12019 | Event News | electronica 2024: Answers to the major Challenges facing the Automotive Industry | From connected mobility to autonomous driving or sustainability – the automotive industry is facing major challenges on its path to digitalization and electrification. The most important companies in the electronics industry will network with the automotive industry and shape the future at the international platform electronica 2024 from November 12 to 15, 2024 in Munich. Despite the discontinuation of subsidies and the lack of infrastructure in some areas, the future belongs to electric drives, and electrification is progressing around the world in all vehicle classes. The software, battery and electronics industries play key roles here. When it comes to batteries, future technologies such as solid-state batteries with a higher energy density will set new standards in terms of charging time, range, fire safety and cost efficiency. In addition, electronica 2024 will focus primarily on the electronic components, technologies and solutions required for the mobility transition. Silicon carbide (SiC) and gallium nitride (GaN) semiconductors with a wide bandgap, for example, are being used more and more in electric drives due to their high efficiency level and energy efficiency, and they are becoming even more powerful. There is a further increase in the switching frequency in inverters, which boosts driving comfort and energy efficiency. | 26.06.2024 09:00:00 | Jun | news_2024-07-15_4.jpg | \images\news_2024-07-15_4.jpg | https://electronica.de/en/trade-fair/journalists/press-releases/detail/answers-to-the-major-challenges-facing-the-automotive-industry.html | electronica.de |
| Call for Industry Session Proposals and for Plenary Session Topics and Speakers | APEC 2025, to be held next year in Atlanta, Georgi... | 12016 | Event News | Call for Industry Session Proposals and for Plenary Session Topics and Speakers | APEC 2025, to be held next year in Atlanta, Georgia, March 16-20, announces the call for submission of proposals for the conference’s popular Industry Session series. The Industry Session component of the conference is intended to encourage content from industry practitioners. Industry Session (IS) speakers are invited to make a presentation only, avoiding the formality of writing the papers for IEEE Xplore publication. IS tracks run in parallel with APEC Technical Sessions and the presentations are included for download by paid APEC attendees. The deadline for submission of proposals is August 23rd. Industry Session proposals may be submitted for an individual speaker presentation or for an overall session proposal. The total time allowed for each presentation is 25 minutes, including 5 minutes for Q and A. To submit a proposal for an Industry Session at APEC, presenters should prepare a 2-3-page proposal that provides a summary of the presentation content and a description of the target audience. Also, a short professional biography of the speaker should be included. If proposing for a full session, a proposal for each of the individual presentations must be submitted. Presentations should have strong technical content and commercial references should be limited and only in support of the core content. | 26.06.2024 06:00:00 | Jun | news_2024-06-01_2.jpg | \images\news_2024-06-01_2.jpg | https://apec-conf.org/speakers/is-presenter-info/ | apec-conf.org |