Bodo's News

Read through my personal pick of news around people, our industry, important events and interesting product releases. Or click on a filter and pick your area of interest!

 

Transition to 200mm Silicon Carbide Wafers
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Learn more:
st.com
  • Industry News
  • 2021-07-27

STMicroelectronics announced it has manufactured the first 200mm (8-inch) Silicon-Carbide (SiC) bulk wafers for prototyping next-generation power devices from its facility in Norrköping, Sweden. The transition to 200mm SiC wafers marks an important milestone in the capacity build-up for ST's customer programs in automotive and industrial sectors and will consolidate ST's lead in the disruptive semiconductor technology that allows for smaller, lighter, and more efficient power electronics with a lower total cost of ownership. Among the first in the world, ST's initial 200mm SiC wafers are also very high quality, with minimal yield-impacting and crystal-dislocation defects. The low defectivity has been achieved by building on the excellent know-how and expertise in SiC ingot growth technology developed by STMicroelectronics Silicon Carbide A.B. (formerly Norstel A.B., which ST acquired in 2019). In addition to meeting the quality challenge, the transition to 200mm SiC substrates requires a step forward in manufacturing equipment and the overall support ecosystem performance. ST, in collaboration with technology partners covering the entire supply chain, is developing its own 200mm SiC manufacturing equipment and processes. ST currently manufactures its leading-edge, high-volume STPOWER SiC products on two 150mm wafer lines in its fabs in Catania (Italy) and Ang Mo Kio (Singapore) and performs assembly and test at its back-end sites in Shenzhen (China) and Bouskoura (Morocco). This milestone comes as part of the Company's planned move to more advanced, cost-efficient 200mm SiC volume production. This transition is within the Company's ongoing plan to build a new SiC substrate plant and source over 40% of its SiC substrates internally by 2024.

Ocean Wave Energy Harvesting
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Learn more:
vicorpower.com
  • Industry News
  • 2021-07-27

The ability to harness ocean wave energy is a rapidly evolving field that marine engineers are refining to provide reliable, cost-effective maritime energy generation and storage while enabling new forms of offshore data and communication services. Columbia Power Technologies (C-Power) is helping to expand the marine economy by providing reliable, cost-effective energy generation and storage, data and communication services for offshore assets. C-Power Autonomous Offshore Power Systems (AOPS) capture mechanical wave energy and convert it into usable power for a wide range of oceanic applications such as offshore oil and gas exploration and production, offshore carbon sequestration, oceanographic research, aquaculture and homeland defense. With the development of AOPS, C-Power opened the door to un-imagined applications by supplying an autonomous, environmentally friendly, ocean-borne power source capable of doubling as a communications conduit. SeaRAY enhances power efficiency and data communication. The latest AOPS platform, known as the SeaRAY, is key to the near-term focus of C-Power to produce power systems that generate 10W to 1MW from ocean waves. To achieve its goals at the lower end of the power spectrum, C-Power created a SeaRAY AOPS design with a high power-to-weight ratio using power conversion technology from Vicor Corporation. The small design footprint enhances mobility and commercial viability, making SeaRAY easier to deliver and set up, saving tens of thousands of dollars in daily operating costs. "We really needed wide-range DC-DC, something that we could control and regulate as we're converting pulsed ocean wave power into a semi-stable DC bus," said Joe Prudell, a C-Power senior R&D electrical engineer. "This is extremely challenging. Being able to do that at various power levels using Vicor power modules really is an advantage."

Replace Silicon IGBTs with Silicon Carbide Power
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Learn more:
microchip.com
  • Product Release
  • 2021-07-27

Microchip Technology announced the expansion of its silicon carbide portfolio with a family of high-efficiency, high-reliability 1700V silicon carbide MOSFET die, discrete and power modules. Microchip's 1700V silicon carbide technology is an alternative to silicon IGBTs. The earlier technology required designers to compromise performance and use complicated topologies due to restrictions on switching frequency by lossy silicon IGBTs. In addition, the size and weight of power electronic systems are bloated by transformers, which can only be reduced in size by increasing switching frequency. Features include gate oxide stability where Microchip observed no shift in threshold voltage even after an extended 100,000 pulses in repetitive unclamped inductive switching (R-UIS) tests. R-UIS tests also showed excellent avalanche ruggedness and parametric stability and with gate oxide stability, demonstrated reliable operation over the life of the system. The degradation-free body diode can eliminate the need to use an external diode with the silicon carbide MOSFET. A short-circuit withstand capability comparable to IGBTs survives harmful electrical transients. A flatter RDS(on) curve over junction temperature from 0 to 175 degrees Celsius (C) enables the power system to operate at greater stability than other silicon carbide MOSFETs that exhibit more sensitivity to temperature.

PCIM Asia 2021 Floor Area to Grow by 50%
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Learn more:
pcimasia-expo.cn
  • Event News
  • 2021-07-26

The leading fair for power electronics in Asia will be bigger than ever, taking place at the Shenzhen World Exhibition & Convention Center from 9 – 11 September 2021, PCIM Asia 2021 will feature additional floor space for exhibitors, representing an increase of 50% from the previous year. The additional space will enable more exhibitors and visitors to attend the fair and increase the chances of successful business cooperation. This year's fair promises to be larger than the 2020 edition, with the additional floor space welcoming exhibitors both new and old, along with a variety of forums, conferences and events taking place, exploring the latest trends and innovations within power electronics, intelligent motion, renewable energy and energy management. PCIM Asia 2021 will thus provide a platform for the industry to trade and connect as the economy recovers in the post-Covid-19 era. PCIM Asia will once again be supported by some of the leading power electronics companies in the industry. Apart from the strong line up of returning exhibitors, the 2021 fair will see a host of new exhibitors attending and showcasing their latest innovative products and solutions. To further enhance the experience for the fair's visitors and exhibitors, PCIM Asia will once again feature a range of thematic zones which shine a light on key areas of the development of power electronics. These thematic zones include the E-mobility Pavilion, Energy Storage Pavilion, Poster Session Area (part of the Conference) and University Zone.

Power Solutions for Medical Applications
  • Product Release
  • 2021-07-23

Ultralife has been manufacturing critical power solutions for fixed and portable medical technology (MedTech) worldwide for several decades. It is from this experience that Ultralife, alongside the technical capabilities of its subsidiaries Accutronics and SouthWest Electronic Energy, that the company has developed its X5 medical cart power system and enhanced U1 smart MedTech batteries. The X5 medical cart power system is a unique development from Ultralife that allows medical cart integrators to directly power computers, monitors, printers, and other peripherals with energy supplied from one or two hot-swappable batteries. Named by Ultralife as the URB-X5, these 276Wh Lithium Iron Phosphate rechargeable smart batteries power an internal pure-sine-wave inverter to output 120VAC 60Hz (150W). URB-X5 batteries can be charged onboard the power system or removed, from specially designed cradles, for charging. The innovative connector system and wide grab-handle means that batteries can be inserted into the cradles in either direction, making the swap-out quick and easy. An internal bridging battery allows for uninterrupted operation while batteries are swapped. Two-bay smart chargers are available, that can be either wall or desk mounted, recharging the batteries in less than six hours. There are status indicators on the chargers, batteries and power system, conveying a variety of information such as state-of-charge. The design considerations do not end there, as the battery enclosure is constructed entirely of aluminium for light weight and high strength.

Cooperation for Ebike Drive Systems in the European Market
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Learn more:
bmz-group.com
  • Industry News
  • 2021-07-22

The BMZ Group and Panasonic Cycle Technology will join forces in the future in the European market. Panasonic Cycle Technology developed their first e-powered bike as early as 1979, launched current pedelec type of e-bike on the market in Japan in 1996 and has since been able to gain high market shares, especially in Japan, thanks to its high-performance e-bike components. Next to joint efforts for dedicated service and support, the cooperation will include the common equipping of OEMs with e-bike systems consisting of BMZ's battery solutions combined with Panasonic Cycle Technology's motor and display. Synergies can also be used effectively here, the BMZ Group can rely on an existing concept with international service points and partners. For many years, Panasonic Cycle Technology has been developing high-performance motors for different requirements, which are installed in well-known bicycle brands. From 60 Nm power, the GX Power to the GX Ultimate with 90 Nm, all power levels are covered - for city to mountain bikes. The appropriate range of compatible e-bike batteries from the BMZ Group, such as the recently introduced and most powerful integral e-bike battery of its time - BMZ V10 Intube with 725 Wh - were one more argument in favour of installing common systems in future.

For Battery Charging and Power Supply: Compact Single-Chip PMIC Solution
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Learn more:
rutronik24.com
  • Product Release
  • 2021-07-22

Efficient reliability when size matters: the Nordic nPM1100 is a dedicated power management IC (PMIC) with configurable dual-mode buck regula­tor and integrated battery charger. It is designed as a complementary component to Nordic's nRF52 and nRF53 series of system-on-chips (SoCs) to ensure reliable power supply and stable operation while maximising battery life through high efficiency and low quiescent currents. It can also be used as a generic PMIC device for any other suitable application. The extremely compact (2.075 x 2.075 mm) WLCSP package is ideal for applications in wearables, connected medical devices, smart home sensors and controls, remote controls and game controllers, and other size constrained applica­tions. The integrated battery charger is designed to charge lithium-ion and lithium-polymer batteries to a selectable termination voltage of 4.1 or 4.2 V and supports cell chemistries with a nominal voltage of 3.6 or 3.7 V respectively. The unit features thermal battery protection and automatic selection of three charging modes: automatic trickle charge, constant current and constant voltage. The maximum charging current is selectable via a resistor from 20 mA up to 400 mA. The charger also has a discharge current limiter and is JEITA compliant. The high-efficiency step-down regulator can deliver up to 150 mA of current at a selectable output voltage of 1.8, 2.1, 2.7 or 3.0 V. It features soft start and automatic transition between hysteresis and PWM modes. It also enables a forced PWM mode to ensure clean operation.

Formula E Team Readies for Indoor/Outdoor Race in London
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Learn more:
eu.mouser.com
  • Industry News
  • 2021-07-22

The Mouser Electronics-supported Formula E racing team will face a challenging road course through London's Royal Docks at the London E-Prix on July 24 and 25. DRAGON / PENSKE AUTOSPORT team drivers Joel Eriksson and Sérgio Sette Câmara will race around - and for the first time ever, inside - the ExCeL London exhibition center. The race also marks the return of Formula E all-electric street racing to the U.K. capital after a five-year absence. Mouser is partnering with the team throughout the 2020–21 ABB FIA Formula E Championship racing season, in collaboration with TTI, Inc. and valued suppliers Molex and AVX. This is the seventh-straight year that Mouser and Molex have sponsored Formula E racing. The Formula E series features cars that are powered solely by electricity and represent a vision for the future of the motor sports industry, serving as a framework for research and development around zero-emission motoring. The Gen2 cars offer a huge step forward in electric vehicle racing technology, with maximum power of 250 kW and speeds up to 280 km/h. Racing is all about speed and endurance, and racing sponsorships are an innovative way for Mouser to communicate its performance-driven business model and promote the newest technologies from its manufacturer partners.

Comprising GaN Power FET with Monolithically Integrated Driver
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Learn more:
tagoretech.com
  • Product Release
  • 2021-07-22

Tagore Technology announces the introduction of the TP44200NM 650V Gallium Nitride Power FET with integrated driver IC in a compact 22 pin, 5mm x 7mm QFN package. The device offers low RDS(ON) of 180mOhm and fast switching to deliver a highly efficient, low-cost power solution in a small footprint for a variety of applications requiring high power density including USB-PD charger, server and telecom AC-DC power supplies, power factor correction (PFC) converter. The TP44200NM Power IC has 650V E-mode GaN Power FET, driver, UVLO and high dv/dt immunity with and without supply - all monolithically integrated on GaN-on-Si substrate. The device has low propagation delay for high frequency application and slew rate control through external resistor.

Single-Stage Flyback Controllers with Constant Voltage Output
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Learn more:
infineon.com
  • Product Release
  • 2021-07-21

Cost-effective dimmable and intelligent LED systems are expected to increase the market share disproportionately in the coming years. Introducing the ICL8800, ICL8810 and ICL8820 single-stage flyback LED controllers for constant output voltages, Infineon Technologies addresses the need of LED driver manufacturers in this regard. The ICs meet the necessary performance requirements for LED lighting applications, such as LED drivers and luminaires up to 125 W, smart lighting, and emergency luminaire. Outside this market segment, adapters and chargers, flat TVs, all-in-one PCs and monitors up to 125 W profit from the ICL88xx family. All three variants offer benchmarking performance for power factor correction and total harmonic distortion at full-load and low-load conditions, thus enabling platform design and window drivers. They are optimized as secondary-side regulated (SSR) constant voltage (CV) output flyback controllers and are also well suited for primary-side regulation (PSR). To achieve optimum efficiency and low electromagnetic interference (EMI) without compromising light quality, they are featuring critical conduction mode (CCM) and quasi-resonant mode (QRM) with smart valley hopping. The ICL88xx family offers an external start-up circuit control signal for more flexibility and a cost-optimized bottom-up platform design for many applications. It has a comprehensive set of protection features, including a power limitation and secondary side over-voltage protection. In addition, the devices require a minimum number of external components, leading to outstanding cost-effectiveness compared to existing solutions. The gate driver current enables designs up to 125 W with state-of-the-art MOSFETs. The system performance and efficiency can be further optimized using Infineon's CoolMOS P7 power MOSFETs.

Fast Recovery Epitaxial Diodes
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Learn more:
taiwansemi.com
  • Product Release
  • 2021-07-20

Taiwan Semiconductor announces the availability of the PU1xMx / PU2xMx families of fast recovery epitaxial diodes. These high-reliability (AEC-Q101 qualified) FREDs offer optimized switching speed vs. reverse recovery time. Their soft reverse recovery results in lower noise switching while achieving low losses and increased efficiency. The Micro SMA package heat spreader contacts provide excellent heat transfer. "TSC's FRED devices offer an unparalleled combination of small footprint, fast switching speed, low parasitic capacitance and low leakage," said Vice President, TSC Products, Sam Wang. "In terms of price, performance and package, our FREDs set a new benchmark for the industry." Applications include automotive alternator charging regulators in 12-, 24 to 28- and 48-Volt systems; POE power, protection and blocking circuitry; general purpose switching power, snubber circuits, antiparallel diodes in high frequency switching circuits; freewheeling diode in converters, chargers and motor control circuits.

Joining PowerAmerica Institute
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Learn more:
heraeus.com
  • Industry News
  • 2021-07-20

Heraeus Electronics joins PowerAmerica Institute to advance the use of wide bandgap (WBG) semiconductors. The technological expertise of Heraeus Electronics and the industry connections of Power America Institute will accelerate the development of new materials and support the expansion of the Power Electronics industry. The collaboration will result in bringing next generation silicon carbide and gallium nitride power electronics to markets faster, reducing cost and risk factors associated with new generation technologies. An organization that brings together the semiconductor manufacturers and the companies that use semiconductor power electronics in their products, PowerAmerica Institute is well placed as an information hub. With the backing of the U.S. Department of Energy and the engagement of top researchers, knowledge and processes can be provided to educate the American workforce and provide more innovative product designs. "By working in collaboration with Heraeus Electronics, we can maximize device performance without the compromise of cost", says Executive Director Victor Veliadis from PowerAmerica Institute. Heraeus Electronics offers matched materials as well as latest equipment to support customer developments by assembling prototypes and test modules according to the highest standards. David Malanga, Director of Marketing and Sales for Heraeus Electronics in the Americas, adds: "With our deep understanding of the power electronics market and PowerAmerica Institute's connections, we can assist in driving future developments, employee education, and market direction for a stronger industry tomorrow."

DC Link Capacitors for Harsh Environments
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Learn more:
cde.com
  • Product Release
  • 2021-07-19

CDE's BLH series of DC-Link capacitors have been designed and tested to exceed the industry's most stringent requirements for high humidity, vibration testing, and thermal cycling. The Temperature, Humidity at Bias (THB) test exposes parts to the harsh conditions of 85 °C at 85% relative humidity with rated voltage applied. This demanding test simulates the harsh operating conditions encountered in many commercial and industrial inverter applications. Such conditions can cause non-THB rated capacitors to fail early from moisture penetration. While most capacitor makers validate their THB components for 1,000 hours under these conditions, CDE's BLH series has been validated for 1,500 hours. Utilizing the most advanced materials and processes, these board-mounted capacitors have been designed and tested to meet the rigors of automotive AEC-Q200 testing. Their solvent-resistant plastic case and epoxy encapsulation system are UL Recognized and meet IEC61071. Tin-plated copper RoHS-compliant terminations ensure excellent solderability. With their superior resistance to moisture and robust design, these capacitors are well suited for solar, wind, UPS, EV chargers, and other inverter applications that may be subjected to wide-ranging environmental conditions. The series is optimized for DC link applications in medium to high-power inverters. Capacitance ranges from 1.0 to 170 µF at 450-1,200 Vdc, with high rms ripple current ratings up to 36 Arms. When operated at a 70 °C hot-spot temperature with rated voltage applied, their life expectancy is 100,000 hours.

Introducing RF LDMOS Power Transistors
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Learn more:
st.com
  • Product Release
  • 2021-07-19

STMicroelectronics is adding a broad range of devices to the STPOWER family of LDMOS transistors, which comprises three different product series optimized for RF power amplifiers (PAs) in a variety of commercial and industrial applications. Featuring high efficiency and low thermal resistance and packaged to handle high RF power, STPOWER LDMOS devices combine a short conduction-channel length with a high breakdown voltage. These characteristics permit a cost-effective solution with low power consumption and high reliability. Expanding the range of applications that can be addressed, the STPOWER LDMOS IDCH and IDDE series are 28V/32V common-source N-channel enhancement-mode lateral field-effect RF power transistors. IDCH devices provide output power from 8W to 300W and are specifically designed for applications up to 4GHz, including 2.45GHz industrial, scientific, and medical (ISM), wireless infrastructure, satellite communications, and avionics and radar equipment. The LDMOS devices are suitable for all types of modulation formats. The IDDE series contains 10W-700W devices for broadband commercial, industrial, and scientific applications at frequencies up to 1.5GHz. The devices can withstand a load VSWR (voltage standing wave ratio) of 10:1, through all phases. They are suitable for all typical modulation formats, and for most classes of RF PA operation including Class A, Class AB, and Class C. Their high efficiency minimizes the energy needed to deliver the required output power, resulting in lower operating costs and reduced heat dissipation thereby simplifying thermal management and enabling more compact systems.

International Electric Drives Production Conference (E|DPC)
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Learn more:
edpc.eu
  • Event News
  • 2021-07-16

The conference is intended for researchers, product developers, production experts, purchasers and users of electric drives. To ensure a reliable planning for everyone, the E|DPC will again take place as a virtual event from December 7 to 9, 2021. The preliminary program of the conference is now available.

International Workshop on Integrated Power Packaging (IWIPP
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Learn more:
iwipp.org
  • Event News
  • 2021-07-16

The Power Sources Manufacturers Association (PSMA) and IEEE societies - Power Electronics PELS, Electronic Packaging EPS, and Dielectrics and Electrical Insultation DEIS - are sponsoring a free webinar series taking place over three days in the last week in August, 2021. The webinar series is a corridor event made possible by the financial support of the sponsors with the intention of bridging the gap from the 2019 IWIPP workshop to the 2022 IWIPP workshop. The IWIPP (IWIPP) corridor webinar series will consist of three (3) webinar sessions, each lasting two-and-a-half (2.5) hours. Each session will address a different set of applications and technology advances. The sessions will be on Monday, August 23rd; Wednesday, August 25th; and Friday, August 27th. Each session will begin at 7:00 a.m. CDT (2:00 p.m. CEST).  There will be three presentations per session. Each presentation will be approximately twenty-five minutes in length. There will be a panel-style question-and-answer session at the end of each webinar event. Each webinar session will remain open until the presenters answer all the questions submitted. Registration for the corridor webinar is now open Registration – IWIPP. The webinar series will be free of charge but the number of attendees that can register will be limited; therefore, we advise you to register early.

Mobile Fast Charging with Gallium Nitride (GaN) Power ICs
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Learn more:
navitassemi.com
  • Industry News
  • 2021-07-16

Navitas Semiconductor announced that Xiaomi has launched their third GaNFast charger, a 65W dual-output fast charger. The '65W 1A1C' has a USB-C output up to 65W to power laptops and fast-charge smartphones via USB-PD 3.0, QC and PPS fast-charging protocols, with an extra USB-A output up to 18W to conveniently – and simultaneously – charge another phone or accessory such as headphones. The GaN charger can power the Xiaomi Mi11 from 0% to 100% charge in only 45 minutes. Due to high-speed GaN power ICs, the charger achieves a small size of only 69 cc with folding AC-pins – a 30% reduction vs Xiaomi's previous silicon-based designs – and a world-leading featherweight 104 g for ultimate portability. "We believe that the success of any company comes from continuous technological innovation, corporate social responsibility and the achievement of sustainable development goals," said Mr. Xiang WANG, President and Partner of Xiaomi. "We look forward to a bright future for Navitas." "Xiaomi's openness to new materials and technologies, and its continued commitment to gallium nitride (GaN), demonstrates Xiaomi's recognition of the advantages of GaN devices over traditional silicon devices," said Gene SHERIDAN, CEO of Navitas Semiconductors. "It is a long and successful partnership, introducing a series of world-class chargers, and celebrating mass production milestones, as when we presented Xiaomi with a special award for their receiving the 10,000,000th GaNFast power IC back in November 2020."

Distributors in Europe Awarded
  • Industry News
  • 2021-07-15

TDK honored its best distribution partners in Europe by presenting them – for the eighth time – with the TDK European Distribution Award 2020. The gold award in the "High-Service Distributors" category went to Mouser Electronics. In the "International Volume Distributors" category, Rutronik Electronics was honored as in the previous year. The best local distributor is the Austrian company EPi Components. Only two other awards were given in the "Local Distributors" category this time: Silver went to Gateway Electronic Components in the UK and Bronze to AVIS KS in Slovakia. "In the past year, during lockdown periods of the pandemic and especially in the aftermath, we have seen that distributor inventory is a major factor for satisfaction of end-customers," says Dietmar Jaeger, Head of TDK's Global Distributor Division. "That's why we raised our requirements and couldn't give out as many awards this year as we would have liked." At the end of 2020, there were already signs of a recovery in global business, followed by a massive upswing and extremely high demand for TDK products in 2021, says Jaeger. Mouser Electronics, in particular, was able to meet the highly increased demand very well and thus best fulfilled the award criteria.

Heat Sinks for Power Modules
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Learn more:
ep.mersen.com
  • Product Release
  • 2021-07-13

High cooling capacity with minimal pressure drop are convincing features of the new IsoMAXX cold plates from Mersen. The cold plates meet the high demands of modern power electronics and have been specially developed for the latest SiC, GaN or IGBT power modules. Modern converters, transport systems, electric vehicles and alternative energy generators benefit from the increasingly efficient wide bandgap electronics, which are optimised for operation at higher switching frequencies and temperatures and feature a much more compact design. Conventional heat sinks cannot meet these high cooling requirements. That is why Mersen developed IsoMAXX – a revolutionary vacuum brazed cold plate with unique features: The average thermal resistance (Rth) is 6 °C/kW. And at ~600 mbar, the pressure drop is substantially lower than that of all previous models. IsoMAXX cold plates ensure an optimal temperature range for power electronics, in which all single chips and modules on the cold plate remain at the same temperature. IsoMAXX helps development engineers to design solutions with increased efficiency and a minimal footprint: No minimum clearance is required between modules, which allows versatile integration regardless of the number of modules needed for the particular application.

Bidirectional DC Power Supplies and Regenerative DC Loads
  • Product Release
  • 2021-07-08

In response to demand for growing hydrogen fuel cell development and test, EA Elektro-Automatik offers a series of powerful bidirectional DC power supplies and regenerative DC loads ideal for fuel cell stack testing. "In response to the demand for clean energy, the market for fuel cells is growing at a compound annual growth rate of 26.4% and is projected to reach $848 M by 2025. Uses for fuel cells include power generation for commercial vehicles such as buses and forklifts, backup power generation systems, and for military power sources. To ensure the design and manufacturing of quality fuel cells, EA Elektro-Automatik offers its EA-PSB 10000 2-quadrant power supplies and EA-ELR 10000 series electronic loads. Both the EA-PSB power supplies and the EA-ELR loads sink up to 30 kW and feed the energy back to the grid to enable testing of any size fuel cell stack," said Markus Schyboll, CEO of EA Elektro-Automatik (EA). Both the PSB power supplies and the ELR electronic loads have built-in function generators that include arbitrary waveform generation, which simplifies characterization, performance, and durability testing of fuel cells and the devices the fuel cells will power. Unlike other loads that need a separate AC instrument, the ELR load, with its built-in waveform generator, can perform the perturbation test to determine fuel cell resistance. In addition, both the PSB supplies and the ELR loads, with their built-in waveform generators, can subject the fuel cell-under-test to dynamic load variations for performance and durability testing.

APEC 2022 Call for Technical Program Paper
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Learn more:
apec-conf.org
  • Event News
  • 2021-07-08

APEC 2022, to be held in Houston, Texas, from March 20-24, 2022, continues the long-standing tradition of addressing issues of immediate and long-term interest to the practicing power electronics engineer. APEC is now accepting submissions for the first of its 2022 speaker deadlines, the Technical Program Papers. Interested authors wishing to present a Technical Program Paper must submit a digest for consideration by August 13, 2021. Instructions for submissions is available at: http://apec-conf.org/conference/sessions/technical/. To be considered as an author of a highly regarded Technical Program Paper, prospective authors are asked to submit a digest explaining the problem that will be addressed by the paper, its major results, and how it is different from the closest existing literature. Technical Program Papers presented at APEC must be original material and not have been previously presented or published. The principal criteria used by reviewers in selecting digests for the program will be the usefulness of the work to the practicing power electronics professional. They also value evidence of completed experimental work.

Li-ion Battery Materials for Use in VW and Ford EVs
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Learn more:
toyoinkgroup.com
  • Industry News
  • 2021-07-08

Toyocolor announced that it was tapped to supply the North American and European operations of SK Innovation, a South Korean lithium-ion (li-ion) battery manufacturer, with Toyocolor's Lioaccum series of conductive carbon nanotube (CNT) dispersions. Lioaccum dispersions are used as the conductive additive in li-ion cathodes to help expand li-ion battery capacity of electric vehicles (EVs), for increased driving distances and faster charging performance. They will help power SK Innovation's li-ion batteries installed in EVs manufactured by the Volkswagen Group and the Ford Motor Company. In recent years, the shift toward EVs is accelerating rapidly due to the global trend toward decarbonization, and many automakers have announced plans to sell only EVs by 2025 to mid-2030s. Li-ion batteries are the most common battery-type used in modern EVs due to their higher energy capacity. The incorporation of CNTs as the conductive additive is essential to increasing capacity but there have been a number of issues associated with CNT dispersion that have hindered its practical use. To resolve this issue, leveraging its unique dispersion technology, Toyocolor researchers in Japan successfully achieved high conductivity levels by replacing carbon black in the battery cathode with a small amount of Lioaccum CNT dispersions as the conductive additive. Reduced material usage not only gives battery manufacturers the additional cell space to insert active materials needed to boost battery capacity and performance, but it also considerably reduces manufacturing cost.

Power Disconnect Solution Enables Faster and Safer DC Fast Charging
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Learn more:
sensata.com
  • Product Release
  • 2021-07-07

Sensata Technologies announced its power disconnect solution has been chosen by several leading charging infrastructure OEMs to enable faster and safer DC fast charging. Sensata's solution combines contactors and GigaFuses from its Gigavac product brand to provide customers with a value-added contactor module, simplifying their installations while delivering safer and more effective system protection compared to traditional contactor and thermal fuse pairings. To compete with traditional internal combustion engines, EVs need faster charging times, so EV Charging Systems are quickly migrating from 400V to 1,000V and from 50kW to up to 350kW to shorten charging times to less than 20 minutes. While higher voltage and current levels reduce charging times, they increase the safety risks and design challenges for the systems. High voltage contactors provide safe circuit continuity while fuses are required in tandem for circuit-protection in the event of a hazardous short circuit event. The increases in voltage and current levels not only require contactors with higher breaking capabilities, but also make the contactor and fuse pairings more technically challenging. To address these challenges, DC fast charging infrastructure OEMs are seeking safer, higher performing and more comprehensive solutions that improve on the traditional contactor and thermal fuse pairing.

Photovoltaic-Output Photocoupler with Increased Open Voltage
  • Product Release
  • 2021-07-07

Toshiba Electronics Europe has launched a photovoltaic-output photocoupler ("photovoltaic coupler") housed in a thin SO6L package measuring just 3.84mm × 10mm × 2.1mm, suitable for driving the gates of high-voltage power MOSFETs used to develop a galvanically-isolated solid-state relay (SSR) function. SSRs are semiconductor relay devices that incorporate a photo-TRIAC, a photo-transistor or a photo-thyristor as the output device. They are generally suitable for applications that require ON/OFF control of large electrical currents such as industrial equipment (I/O relay output for PLCs, inrush current protection in PSUs, battery voltage monitoring in BMS, ground fault detection and more) as well as switching the power and signal lines in instrumentation applications. A photovoltaic coupler, such as the TLP3910, is a photorelay that contains the optical elements but not the MOSFET that performs the high-current switching functions. To easily configure an isolated SSR to handle high-voltage, large-current switching (which photorelays find challenging), designers generally combine a photovoltaic coupler with a MOSFET. Driving a high-voltage power MOSFET with a gate voltage of 10V or higher, currently requires connecting two of Toshiba's TLP3906 in series, due to the low open voltage that is around 7V. However, the TLP3910 has a minimum open voltage (VOC) of 14V, double that of the TLP3906 and, as a result, only a single device is required to drive the gate of a high-voltage power MOSFET. This reduces the part count, thereby improving reliability and saving PCB space and BOM cost.

Strengthens Position in Quantum Technology Market
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Learn more:
rohde-schwarz.com
  • Industry News
  • 2021-07-06

The Rohde & Schwarz technology group will now also be active in the field of quantum computing. The July 1, 2021 acquisition of Zurich Instruments will help Rohde & Schwarz further expand its Test & Measurement Division. The Swiss company Zurich Instruments AG will be run as a full subsidiary. In the coming decades, quantum technologies will significantly shape the high-tech industry. The potential for industry and research is enormous. It is a future trend involving billions in governmental subsidies and industrial investment. Rohde & Schwarz is already active in quantum sensing. Thanks to the acquisition, the company is now positioning its T&M solutions in quantum computing, one of the most promising future technologies in the world. Peter Riedel, President and COO of Rohde & Schwarz, explains: "We are looking forward to developing technological solutions for the future together with Zurich Instruments. We are also strengthening our position in the scientific realm. Rohde & Schwarz and Zurich Instruments already share a passion for advancing science and innovation." The test and measurement market for quantum computing holds enormous potential for both companies. Operating and maintaining a large-scale quantum computer requires numerous, specific T&M solutions. Thanks to their complementary products, Rohde & Schwarz and Zurich Instruments will provide complete solutions in the future.

Automotive Backlight Driver with Integrated Boost Converter
  • Product Release
  • 2021-07-06

Maxim Integrated introduces the four-channel, low-voltage MAX25512 automotive LED backlight driver with integrated boost converter. The single chip LED driver eliminates an external MOSFET and current sense resistor and integrates I2C communication to lower bill of material cost and reduce board space by 30 percent. The highly integrated LED driver includes four 120mA channels with the industry's highest efficiency at 2.2MHz operation. Today's automotive start-stop systems increase fuel economy, but they can challenge the power delivery system to maintain the same level of display brightness during re-start. For example, features like display illumination upon entry can be affected by cold crank situations, with the engine drawing down the car battery enough to cause the display to turn off and back on. Maxim Integrated's MAX25512 LED backlight driver operates down to 3V after startup without the addition of a pre-boost converter, protecting the display from these power disruptions. "Over the next five years, the number of displays in automobiles is expected to grow to accommodate new and existing vehicle functions with the size and resolution of these displays increasing as well," said Sang Oh, senior research analyst at Omdia. "Powering these displays consistently to maintain full, constant brightness while doing so as efficiently as possible, is critical to automakers today."

Obtaining 100% Ownership of Newport Wafer Fab
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Learn more:
nexperia.com
  • Industry News
  • 2021-07-05

Nexperia has completed the transaction to acquire Newport Wafer Fab (NWF), contributing to the company's growth ambitions and investments to boost global production capacity. With the acquisition, Nexperia obtains 100% ownership of the Welsh semiconductor production facility. Nexperia Newport will continue to have a strong position in the Welsh ecosystem and technology development and will secure the current jobs at the Newport site and others across the region. Nexperia is a customer of the foundry services offered by Newport Wafer Fab and became its second largest shareholder in 2019. The Newport site complements Nexperia's other European manufacturing operations in Manchester and Hamburg, which have also seen significant recent investments. Commented Achim Kempe, Nexperia's Chief Operations Officer: "We are very excited to include Newport as part of our global manufacturing footprint. Nexperia has ambitious growth plans and adding Newport supports the growing global demand for semiconductors. The Newport facility has a very skilled operational team and has a crucial role to play to ensure continuity of operations. We look forward to building a future together". The Newport semiconductor production site was first established in 1982 and was originally named INMOS. Current capacity is over 35,000 200 mm wafer starts per month covering a wide range of semiconductor technologies ranging from MOSFETs and Trench IGBTs using wafer thinning methods to CMOS, analogue and compound semiconductors. It will support Nexperia's strategic 10 bln USD growth ambition and enrich Nexperia's product lines in IGBT, Analog and compound semiconductors in parallel to the current 8" investments at the Manchester and Hamburg wafer fabs.  

Increased Technical Partnership in the UK
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Learn more:
tektronix.com
  • Industry News
  • 2021-07-02

Tektronix announces an increased technical partnership with Rapid Electronics, based in Colchester, UK. This increased partnership means customers in the UK will benefit from easier access to solutions for their test and measurement requirements and more technical assistance from both the Tektronix and Rapid Electronics sales and engineering teams. Rapid Electronics will be a technical and commercial point of contact for the Tektronix entry and mainstream portfolio, as well as the extensive Keithley portfolio, with a focus on expanding into busy engineering environments and continuing their exemplary work in the education sector. "Working closely with Rapid Electronics allows us to serve more customers and grow into more markets together, whilst at the same time positioning the Tektronix & Keithley brands strongly in the UK. Rapid's experience in both the education and industrial sectors will be a benefit to us both." says Maria Heriz, Vice President, Commercial Operations, EMEAI. "This extension to our already successful relationship will enable much closer cooperation with our colleagues at Rapid and allow both Tektronix and Rapid to further expand their reach in the UK, bringing class leading equipment to the wider engineering community. Rapid already has a trusted name in industry and in education with their status as a NUWPEC accredited supplier and this partnership will allow us both to grow" says Nick Tarling, Tektronix Distribution Account Manager, UK/IRL/BENELUX.

Andre Tauber to Become Head of Media Relations
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Learn more:
infineon.com
  • People
  • 2021-07-01

Andre Tauber (44) is taking over as Head of Corporate Media Relations at Infineon Technologies AG from 7 July 2021. He reports to Susanne Kochs, who heads the Corporate Communications department. Andre Tauber joins from the 'Stiftung Familienunternehmen' where he was Head of Communications. He has more than 15 years of experience in public relations and economic journalism. As business correspondent for the national daily newspaper "Die Welt", he reported from Munich and Brussels. For the "Financial Times Deutschland", he worked in the financial editorial department and as a foreign correspondent in Milan.

Changing Name and Corporate Brand
  • Industry News
  • 2021-07-01

Hitachi ABB Power Grids announced that it will be evolving to become Hitachi Energy from October 2021. The decision to change name has board and shareholder consent and coincides with the business' first-year anniversary since it started operations on 1 July, 2020. Hitachi Ltd. has an 80.1 percent stake in the joint venture and ABB Ltd. holds the balance. Hitachi ABB Power Grids places sustainability at the heart of its purpose: powering good for a sustainable energy future. The transition to the Hitachi Energy name reflects the rapidly evolving energy landscape and the opportunity to create economic, environmental and social value; and with Hitachi enabling the business to position its pioneering and digital technologies  to serve  existing and future customers, going beyond the grid – opening up a breadth of opportunities in areas like sustainable mobility, smart life, and data centers. By combining advanced digital solutions and services, such as Hitachi Lumada, with an energy platform that is built on unique domain expertise and experience, the business is serving customers and partners co-creating global solutions to solve the global challenge of an inclusive and equitable carbon-neutral future. Toshiaki Higashihara, Executive Chairman and CEO of Hitachi, said, "With climate change and increasing natural disasters, there is a need to solve three social issues worldwide: environment, resilience, and security and safety." He continued, "Hitachi ABB Power Grids provides a variety of solutions that solve these social issues, and by changing the company name to Hitachi Energy, we are further strengthening our commitment to the realization of a sustainable society." 

Acquiring 300-mm Semiconductor Factory
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Learn more:
ti.com
  • Industry News
  • 2021-06-30

Texas Instruments announced it signed an agreement to acquire Micron Technology's 300-mm semiconductor factory in Lehi, Utah, for $900 million. "This investment continues to strengthen our competitive advantage in manufacturing and technology and is part of our long-term capacity planning," said Rich Templeton, TI's chairman, president and CEO. The Lehi fab will be TI's fourth 300-mm fab, joining DMOS6, RFAB1 and soon-to-be-completed RFAB2 in TI's wafer fab manufacturing operations. In addition to its value as a 300-mm fab, the acquisition is a strategic move, as Lehi will start with 65-nm and 45-nm production for TI's analog and embedded processing products and be able to go beyond those nodes as required. "The Lehi fab is a great asset and a great team. We are excited about the engineering experience and technical skills the team brings in ramping and manufacturing advanced semiconductor processes," said Kyle Flessner, TI's senior vice president of technology and manufacturing. The companies plan to complete the sale by the end of 2021.

80V Withstand 5A Output Power Supply ICs
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Learn more:
rohm.com
  • Product Release
  • 2021-06-30

ROHM announces the buck DC/DC converter ICs with built-in MOSFET, BD9G500EFJ-LA and BD9F500QUZ, that support high voltages and currents in factory automation equipment such as PLCs/inverters, and 5G base stations that handle high power. The BD9G500EFJ-LA and BD9F500QUZ are non-isolated DC/DC converter ICs developed by utilizing proprietary analog design technology based on high voltage BiCDMOS power processes to provide the power supply functionality required by increasingly sophisticated industrial equipment. In addition to a best-in-class 80V withstand voltage for 48V power supply systems, the BD9G500EFJ-LA with built-in MOSFET delivers the largest output current in its class (5A), contributing to higher reliability and functionality in charging and 5G base stations that handle large power. At the same time, the BD9F500QUZ with built-in Nano Pulse Control technology achieving a high step-down ratio provides 39V withstand voltage and 5A output current in a compact, low-profile package (3.0×3.0×0.4mm). Moreover, the product features an over current protection as SEL1/SEL2 pins can be selected. These features are ideal for 24V power supply systems – enabling support for higher functionality and greater miniaturization in a wide range of advanced industrial equipment (i.e. factory automation).

Standard Logic Packages in 14, 16, 20 and 24 Pins
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Learn more:
nexperia.com
  • Product Release
  • 2021-06-30

Nexperia announced low profile 14,16, 20 and 24 pin packages for standard logic devices. For example, the 16 pin DHXQFN package is 45% smaller than the industry-standard DQFN16 leadless device. Not only has it a smaller footprint compared to competitors, but the package also offers a 25% saving in PCB area. Measuring just 2 mm x 2 mm (14 pin), 2 mm x 2.4 mm (16 pin), 2 mm x 3.2 mm (20 pin) and 2 mm x 4 mm (24 pin), the 0.4 mm pitch DHXQFN packages are only 0.45 mm high. The parts include: hex inverting Schmitt-triggers; 8-bit SIPO shift registers with output latches; 4-bit dual supply translating transceivers; octal buffer/line drivers; octal bus transceivers; and 8-bit dual supply translating transceivers. Ashish Jha, Nexperia's product manager comments: "Nexperia has a history of over 50 years developing standard logic parts, and we aspire to become the undisputed market leader during the next three years. These new packages are an example of the innovation we are bringing. Previously, incorporating large logic functions into a system with a small form factor was unthinkable. However, our new DHXQFN package enables complex functions such as 74HC595 shift registers to fit into space-sensitive applications like smartwatches, mobile devices and internet connected industrial devices."

Family in TO-247-3-HCC Housing Improves Isolation Voltage Rating
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Learn more:
infineon.com
  • Product Release
  • 2021-06-30

Infineon Technologies introduces the 650 V TRENCHSTOP 5 WR6 family in a discrete housing. The family comes in a TO-247-3-HCC package and offers a broad portfolio comprising 20 A, 30 A, 40 A, 50 A, 60 A and 70 A current ratings. The devices can easily be used for replacing previous technologies like Infineon's TRENCHSTOP 5 WR5 and HighSpeed 3 H3 as well as competitor technologies. The family is optimized for power factor correction (PFC) for residential and commercial air conditioning systems as well as welding applications. The TRENCHSTOP 5 WR6 switches provide very low conduction losses (30 A, 1,45 V at 25°C) as well as lowest switching losses (30 A, 1,55 mJ at 175°C). They feature a very low saturation voltage (V CE(sat)) of 1,45 V and a monolithically integrated diode with optimized forward voltage for the target applications. This results in best-in-class performance while enabling a low BOM cost. Additionally, the device leverages the performance advantage of the TRENCHSTOP 5 WR5 series, the predecessor to the TRENCHSTOP 5 WR6 series. The TO-247-3-HCC housing of the WR6 family increases the creepage and clearance distances thus improving the isolation voltage rating. With this, the product family enables more reliable system designs that are resistant against contamination and condensation which e.g. often occur at AC outdoor units. The TRENCHSTOP 5 WR6 reduces the total cost of ownership with less failure rate while it also enables higher switching frequency in application.

300% Peak Power AC-DC AEA Series
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Learn more:
coseleurope.eu
  • Product Release
  • 2021-06-29

COSEL announced the introduction of 600W free-air convection cooling power supplies, the AEA600F series. With demanding applications in mind, the AEA600F is able to deliver 300% peak power for a period of up to 1,000 milliseconds. Designed for applications requiring a high level of safety, the AEA600F is certified according to the EN62477-1 (OVC III) standard for industrial applications and is approved in accordance with ANSI/AAMI ES60601-1, and EN60601-1 3rd Edition for medical applications. The AEA600F is suitable for Body Floating (BF) applications and complies with 2MOPP (IN/OUT) and 1MOPP (OUT/FG) safety requirement. The layout is optimized for free-air convection making it ideal for use in equipment being operated in low noise environments. The AEA600F has an input to output isolation of 4,000VAC, input to ground (FG) of 2,000VAC and output to ground (FG) of 1,500VAC. Designed for international applications, the versatile AEA600F has an input voltage of 85 to 264VAC. Three output voltages are available: 24V, 36V and 48V with respective current ratings of 25A, 16.7A and 12.5A. Output voltage can be adjusted using a built-in potentiometer. For low harmonic current distortion, the AEA600F uses active Power Factor Corrector (PFC), and the switching stage uses an LLC resonant topology deploying the latest generation of power semiconductors, conferring to a typical efficiency of up to 95%.

Supercapacitor to Combine with Lithium Batteries
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Learn more:
hy-line-group.com
  • Product Release
  • 2021-06-28

Supercapacitors may be combined with batteries to add the advantages of high capacity and low internal resistance. Low leakage currents will extend battery life in this application. HY-LINE Power Components now offers a model optimized specifically for this use case. The capacity of a supercapacitor is usually not delivering energy for 10 years, but only for a few weeks without recharging. Lithium batteries, on the other hand, manage 10 years, but without a buffer capacitor they have problems with pulse loads, like in smoke detectors and sensors networked via radio technology. An elegant solution is to connect the supercapacitor and battery in parallel - for example as a hybrid supercapacitor that internally combines the technologies of supercapacitor and rechargeable lithium-ion battery. A popular alternative is to install two separate components: A high-capacity, non-rechargeable lithium battery and a supercapacitor. Since the maximum voltage of supercapacitors is 2.5 to 3.0 V per cell and lithium batteries deliver 3.6 V per cell, a series connection of supercapacitors is required. Their balancing network and supercapacitor self-discharge can reduce lithium battery life. In the PHVL supercapacitor, the lower operating voltage and good selection of supercapacitors for minimum leakage currents and identical capacitances made it possible to dispense with a balancing network. It offers an operating voltage of 3.9 V (peak voltage 5.0 V) and capacitances of 0.47 to 5.0 F at an operating temperature range of -40 to +65°C (-40 to +85°C with restrictions). At the same time, it shows only 10 to 20% of the leakage current of comparable models with up to 5.5 V working voltage; for a 5 F model, this is only 5 µA. This is the most uncompromising combination of the particularly long operating life of the lithium battery with the low internal resistance of the supercapacitor.

Small TVS Diodes with Low Capacitances and Clamping Voltages
  • Product Release
  • 2021-06-28

TDK Corporation has extended its range of TVS (transient voltage suppression) diodes characterized by their low capacitance values for bidirectional overvoltage protection to include the ULC series (Ultra Low Clamping & Capacitance). The SD01005SL-ULC101 (B74111U0033M060) type has a minimum capacitance of ~0.5 pF and the SD0201SL-ULC101 (B74121U0033M060) type of ~0.6 pF, both at 1 MHz. The TVS diodes are designed for a maximum operating voltage of 3.3 V. The ULC products offer an extremely low clamping voltage of ~3.8 V at a peak pulse current of 8 A or 16 A at ~5 V and a breakdown voltage of 6.3 V. Further features include very short response times and the extremely low leakage current of ~1 nA at 3.3 V. They are designed in accordance with IEC 61000-4-2 for an ESD contact discharge of up to 15 kV. Despite high-level performance of robust protective components, the diodes meet the highest requirements in terms of miniaturization. Their dimensions in the Wafer-Level Chip Scale Package (WL-CSP) are just 400 x 200 µm (WL-CSP01005) or 600 x 300 µm (WL-CSP0201) with a height of 100 µm in the 01005 size or 150 µm in the 0201 size. Despite their extremely small size, the components are designed for a high surge current load of up to 7 A according to IEC 61000-4-5 (8/20 µs). The diodes are well suited for the reliable ESD protection of high-speed interface ICs and data lines such as USB 3.1, USB 3.2, HDMI, FireWire and Thunderbolt due to their parasitic capacitances and clamping voltage.

PCIM Asia 2021 to Feature Over 50 Papers
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Learn more:
pcimasia-expo.cn.
  • Event News
  • 2021-06-28

Asia's leading fair in power electronics will be coming to Shenzhen's World Exhibition & Convention Center from 9 – 11 September 2021, with its renowned accompanying conference to feature guest speakers' talks on a variety of industry hot topics. PCIM Asia Conference 2021 has already confirmed 52 papers from experts in industry and academia to be used in oral & poster sessions, keynotes, tutorials and more during the event focusing on the latest insights and research within the sector. Held in Shenzhen for the first time on the fair's 20th anniversary, PCIM Asia Conference 2021 promises to once again provide a platform for industry professionals in power electronics, intelligent motion, renewable energy and energy management from around the world to connect and share ideas. For the first time, PCIM Europe conference sessions will be presented at the PCIM Asia Conference in Shenzhen, allowing attendees to acquire industry knowledge exclusively from Europe. The conference will also feature two presentation sessions in Chinese. More information on the aforementioned sessions will be provided on a later date. The 2021 PCIM Asia Conference will feature a strong line-up of speakers, sharing their expertise through 22 oral presentations and 30 poster sessions. Held concurrently with the conference is the PCIM Asia fair which gathers industry professionals to showcase the latest trends and developments in the power electronics sector, covering a range of power electronics solutions and associated semiconductors, power devices, bus bars, capacitors and more. Recognised as a reputable platform, the exhibition and conference promote industry exchange and development in a professional, international and forward-thinking environment.

Vertically Integrated Silicon Carbide Production Line
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Learn more:
linkedin.com/sanan
  • Industry News
  • 2021-06-24

On June 23, Hunan Sanan Semiconductor, located in Changsha High-tech Industrial Park, held its official inauguration to commence its production. Hunan Sanan Semiconductor has a total investment of 16B RMB constructed over a land area of about 667 thousand m2. Since its groundbreaking in July 2020, it has only taken less than a year to build this modern manufacturing facility for the entire silicon carbide compound semiconductor supply chain from crystal growth to power devices, packaging, and testing. A Mega Fab with a monthly output of 30,000 6-inch silicon carbide wafers is now complete and is ready for production.It is the first in China and third in the worldwide industry as a vertically integrated silicon carbide chain, providing customers with high-quality and on-time delivery, while sharing the advantages of large-scale production costs. The third-generation semiconductor materials have superior electrical properties and can meet the new requirements of power electronics technologies for high temperature, high power, high voltage, and high frequency operation. Through large-scale production and its own silicon carbide material patent portfolio, Hunan Sanan Semiconductor serves a broad range of end markets such as in communications, server power supplies, photovoltaic, electric vehicle (EV) main traction inverters, on-board chargers (OBC), charge piles, smart grids, rail transit and other fields, and is able to realize the widely adopted and popular wide bandgap semiconductor devices.

Honoured European Distributor of the Year Awards
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Learn more:
ttieurope.com
  • Industry News
  • 2021-06-24

TTI, Inc. has again been honoured by Molex with Distributor of the Year awards. This is the second consecutive year TTI has been named European Distributor of the Year. In addition, the regional TTI teams for Northern and Eastern Europe won the 2020 Distributor of the Year for their respective regions. Molex recognises its distributors each year with these awards, which are given for achieving outstanding sales results and growth in their respective regions, amongst other criteria. Geoff Breed, Vice President, Marketing at TTI Europe said: "We are honoured and very proud to receive the Molex 2020 European Distributor of the year Award and the regional awards for Central and Northern, won by the TTI Eastern European team, and TTI Nordic team. I would like to congratulate the entire TTI team for its hard work and thank the Molex team for its continued support during a very challenging year. We look forward to achieving our goals together in 2021 and beyond." Paul Keenan, Sales Director, Distribution Europe at Molex, added: "We appreciate the continued efforts from TTI and its regional teams and are once again pleased to recognise that through these awards. TTI made a significant contribution to our network in 2020 and demonstrated their commitment to our business in a challenging year. We are confident that we will be able to celebrate further successes with TTI in Europe in the future."

NH Fuse Switch Disconnectors
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Learn more:
ep-fr.mersen.com
  • Product Release
  • 2021-06-24

Mersen offers two versions of its NH fuse switch disconnector series in size 000. The Multibloc 000.RST9 is being launched as a bus bar version for mounting on 60 mm bus bar systems, while the Multibloc 000.ST9 is available in the mounting plate version with a width of only 53 mm. Multibloc 000 ideally meets the demand for small power distribution boards industrial and building applications, but also for industrial control applications such as drive, starter and motor protection. The generation of the Multibloc size 000 from Mersen offers numerous advantages compared to the previous generation. To meet the requirements of customers, the 125A NH fuse switch disconnectors are not only designed for higher electrical power than the previous model. The products have also become safer: In closed position they can be locked with a padlock or sealed with a lead seal, which substantially increases the safety of the installation. The fuse switch disconnectors will also be available with an optional fuse monitoring module, which makes it possible to notify an external system via a digital output of the module when a fuse blows out. This fuse monitoring feature also makes maintenance more efficient. Micro switches for detecting when the switch door is opened are available for all versions. With an amperage of 125A, a short-circuit rating of 80kA and a low power loss, the Multibloc 000 series from MERSEN is among the best in its class.

Precision Current Sense Resistor
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Learn more:
bourns.com
  • Product Release
  • 2021-06-23

Bourns announced the availability of smaller package sizes and feature options in its Model CFN Metal Foil Current Sense Resistor Series. Miniature 0402 and 0603 packages were introduced to the Model CFN series as well as a lower TCR option of ±50 ppm/°C in the 0603 and larger package sizes. Using Bourns' metal foil technology construction enables the current sense resistors to provide low TCR, low inductance, low noise, excellent reliability and very low resistance values. These attributes make the Model CFN series an optimal current sensing solution for power supply, stepper motor drive, and input amplifier applications. The smaller sizes are particularly well-suited to meet the space-constrained requirements of mobile device designs. Ever important in current sensing is having a suitably low TCR, which is determined by characteristics such as the materials used in the resistive element, power rating, and physical size of the component. Bourns has leveraged metal foil technology to achieve lower resistance values, ranging from 5 to 40 milliohms, and still provide power ratings of 0.25 to 1 W in components small enough for mobile applications. Combining the new ±50 ppm/°C option with the low resistance values helps minimize self-heating so the resistor remains reliable and stays within its 1-5 percent tolerance over time.

Point of Load Converters Target USB-PD Applications
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Learn more:
powerdensity.com
  • Product Release
  • 2021-06-23

Silanna Semiconductor has extended its CO2 Smart Power family of wide-voltage, high-frequency point of load converters with a 100W device targeting USB-PD applications designed to deliver industry-leading efficiency. Silanna Semiconductor focuses on power management challenges with devices that combine best-in-class power density and efficiency performance with unprecedented BoM savings. Operating at a switching speed of 667kHz, the SZDL3105B fully-integrated DC/DC converter (buck regulator) can supply up to 5 amps and 100 watts of output power. It accommodates industry-leading wide input and output ranges that support up to 27VDC input and is supplied in a tiny 4mm x 4mm QFN package. Tim Wilhelm, Director of Marketing, explained, "Higher switching frequency means a smaller, lower cost, higher performing output filter that has delighted the clients we have sampled. The SZDPL3105B device enables ground-breaking efficiencies in the smallest size and weight designs. Our support tools give customers the flexibility and confidence to quickly increase the performance efficiency. This ultimately increases power density with volumes approaching 12% of that required by low-frequency competitive solutions. The SZDL3105 significantly reduces BOM cost, design cycles and time to market." The SZDL3105B has features that optimize its performance in USB port power supply applications. Extremely low operating power dissipation enables the very low no-load power that is an important specification for regulatory certification. Internal and external feedback resistor divider flexibility supports custom design, while a momentary internal feedback path allows for clean and well-controlled start-up operation until external USB port controllers can bias themselves and smoothly take over control of the output voltage. 

Call for Papers for PCIM Europe Conference 2022
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Learn more:
pcim.mesago.com
  • Event News
  • 2021-06-23

Experts from industry and academia in the power electronics industry are invited to apply to be a speaker at the PCIM Europe Conference 2022 with a short abstract. The Call for Papers will be open until 15 October 2021. The event will be taking place once again on-site in Nuremberg from 10 – 12 May 2022. As a platforms for exchange in the power electronics community, the event serves as a stage for international speakers to provide their expertise to a qualified audience of around 800 participants. Whether on current developments, the latest research findings or current challenges, speakers are invited to shape the program and share their knowledge in a twenty-minute talk or in a poster presentation. The conference language is English. The PCIM Europe advisory board, led by Professor Dr. Leo Lorenz, ECPE, Germany, will select the papers and also choose the best submissions overall. In addition to the Best Paper and the Young Engineer Award, a further accolade will join the list of prizes: for the first time the main author of one outstanding contribution from academia and research institutions, who is not older than 30 years, will be honored with the Young Researcher Award. Each prize is worth 1,000 Euro. All the papers accepted will be published in the PCIM Europe conference proceedings, as well as in the scientific databases of IEEExplore, Scopus, Compendex and IET Inspec Direct.

Two Soldering Processes? Manual assembly?
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Learn more:
schurter.com
  • Product Release
  • 2021-06-22

Surface mounting technology (SMT) for electrical and electronic components is not as new as some people might think. SMT stands for Surface Mounted Technology. It was developed by IBM back in the 1960s and was first used in the computers of the Saturn and Apollo missions. The reasons given for this development at the time were the limited space conditions in the capsules and a reduction in circuit impedance to increase switching frequencies. The components belonging to this surface mounting are called SMD (Surface Mounted Device) and have a particularly small design. They are the result of the progressive miniaturisation of electronic components. Many products that everyone takes for granted today would be unthinkable without SMD components, for example: smartphones. In contrast to conventional wired components for through-hole assembly (THT = Through Hole Technology), SMD components are fixed directly on the copper-laminated surface of the board by means of a solder paste and then soldered in a reflow process (similar to an oven). Often, the board is assembled on both sides, which doubles the possible assembly density. SMT technology is state of the art. But not every component can be reduced in size at will. If, for example, the power supply unit is to be placed on the board at the same time, it is getting tight for the transformer. Larger components are still difficult to assemble as SMDs, sometimes because of their weight. Or let's adress the topic circuit protection: if a fuse blows in the event of a fault, it would be extremely useful if this fuse could be replaced as easily as possible. Out of this necessity, hybrid solutions emerge, offering compromising advantages.

AC Energy Calibration Service Launched
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Learn more:
tmi.yokogawa.com
  • Industry News
  • 2021-06-22

The launch of the service follows Yokogawa's accreditation (K164) to ISO17025, allowing the calibration of AC energy measuring devices at up to 40 MWh at a maximum time of 1000 hours. This is ideal for manufacturers of products, equipment, or appliances where the measurement of energy efficiency is critical to meet efficiency goals, for proving product specifications or meeting regulatory requirements such as energy labelling of consumer products. It is also vital for applications for usage-based billing of electrical energy between supplier and user, not only for houses and offices but also for other applications, for example charging of electrical vehicles. Other uses include renewable energy projects such as photovoltaic and wind installations and end tests and type rating where energy is involved. With the new service, Yokogawa's European Standards Laboratory, based at the company's European Headquarters in Amersfoort, Netherlands, now offers comprehensive energy and power calibration, customized to meet the needs of specific applications. Erik Kroon, Yokogawa's European Standards Laboratory Manager, says: "We are one of a few laboratories able to calibrate in the frequency range 40 Hz to 1 kHz. This makes us particularly attractive for engineers working on applications in Automotive, Aviation and Marine and who can now more easily source ISO17025 accredited energy measurements for 400 Hz systems. Using our precise and accurate energy and power calibration services ensures that their designs and instruments meet engineering and quality control requirements."

Coating Method Aerosol Deposition Available for Industrial Use
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Learn more:
heraeus.com
  • Product Release
  • 2021-06-22

Heraeus broadens the application range of the Aerosol Deposition coating method. So far, the technology, which was developed in Japan, has been used mainly in Asia for coating of components for plasma etch chambers. Although the coating method offers many advantages, other industries have hardly applied it until now. "However, feasibility studies by universities such as the University of Bayreuth have shown that Aerosol Deposition offers advantages also for other applications," Dr. Ilka Luck says, Head of Heraeus High Performance Coatings. She sees potential in sensor technology, power electronics, battery, and medical technology, among others. "We have worked intensively over the past two years on optimizing processes and machines for production on industrial scale. As a result, we are the only supplier that accompanies customers all the way from feasibility study to series production," Luck comments. The technology is particularly promising when conventional methods do not achieve the required quality, or the desired coating cannot yet be produced at all. Aerosol Deposition is a process for producing thin material layers. Material particles are accelerated to a speed of several hundred meters per second with the aid of a carrier gas. These then hit a surface, the so-called substrate, where they form a closed film. Aerosol Deposition has no fundamental limitations in terms of coating materials or substrates that can be used. "We already use both for coating, metals and ceramics. The only requirement for its use is that the material is available as a processable powder," Luck explains.

20A DIN-Rail Power Supply Features Integrated LED Display
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Learn more:
pulspower.com
  • Product Release
  • 2021-06-21

PULS Power announces the availability of their latest addition to the CP20 series of high efficiency and compact 24V, 20A 1-phase DIN-Rail power supplies. The CP20.248 extends PULS's portfolio by adding a power supply with an integrated display. The LED display means a reliable and inexpensive condition monitoring feature can be integrated into almost any system allowing users to benefit immediately from faster fault diagnosis and increased system availability. The display shows important status information about the power supply for commissioning and maintenance and can display real-time information and recorded data. The real-time data supplied by the CP20.248 includes the input and output voltage, output current, operating hours and temperature inside the device. The recorded data gives users insight into the number of transients on the input side as well as minimum and maximum voltage and temperature values and more. This information can help the system engineer optimise an entire application in terms of reliability and to identify the cause of faults or errors more efficiently. The display and data storage have an independent power source ensuring that all the information is still available, even if the power supply fails. For remote status monitoring two relay contacts for DC-OK and alarm signals are provided. Two additional inputs allow the power supply to be put into an energy-saving standby mode using the remote ON / OFF function and automatic load sharing in parallel operation for greater power output can be realised. Parallel operation ensures an optimised temperature balance between the connected power supplies, prolonging the service life of the devices.

Hybrid IGBTs with Built-In SiC Diode
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Learn more:
rohm.com
  • Product Release
  • 2021-06-19

ROHM developed Hybrid IGBTs with integrated 650V SiC Schottky barrier diode, the RGWxx65C series (RGW60TS65CHR, RGW80TS65CHR, RGW00TS65CHR). The devices are qualified under the AEC-Q101 automotive reliability standard. They are ideal for automotive and industrial applications that handle large power, such as photovoltaic power conditioners, onboard chargers, and DC/DC converters used in electric and electrified vehicles (xEV). The RGWxx65C series utilizes ROHM's low-loss SiC Schottky barrier diodes in the IGBT's feedback block as a freewheeling diode that has almost no recovery energy and thus minimal diode switching loss. Additionally, since the recovery current does not have to be handled by the IGBT in turn-on mode, the IGBT turn-on loss is reduced significantly. Both effects together result in up to 67% lower loss over conventional IGBTs and 24% lower loss compared with Super Junction MOSFETs (SJ MOSFETs) when used in vehicle chargers. This effect provides good cost performance while contributing to lower power consumption in industrial and automotive applications. A variety of design support materials are also available on ROHM's website, including SPICE models and application notes on drive circuit design necessary for integration and evaluation, supporting quick market introduction. ROHM is committed to continuing to contribute to minimizing environmental impact through system low power consumption and miniaturization by developing low-loss power devices that meet different needs and offering design tools as a solution.

ICs for Energy Harvesting from Solar & RF/Vibrational Sources
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Learn more:
e-peas.com
  • Product Release
  • 2021-06-17

Expanding its portfolio of advanced power management ICs (PMICs) for energy harvesting applications, e-peas announces the availability of two devices adding complementary features to previously released products. The AEM10330 and AEM30330 PMICs distinguish themselves from the competition via their buck-boost architecture. They are able to deal with far lower battery voltages than other solutions on the market. Also, the high-speed charging of super-capacitors that these ICs can supervise allows more energy to be made available to the load - resulting in greater flexibility when it comes to selecting the storage device. The AEM10330 is specifically intended for solar deployments, while the AEM30330 is targeted at RF/vibration-oriented deployments (including industrial, home automation, asset tracking and aftermarket automotive monitoring systems, as well as retail applications). One of the characteristics of both the AEM10330 and AEM30330 is the cold-start threshold at which they can begin to draw energy from the surrounding environment. This has been lowered to just 275mV/3µW, which presents a substantial improvement on the previous generation of e-peas PMICs - and is unmatched by any other solution currently available. The e-peas PMICs can deliver up to 60mA, so storage elements can be charged rapidly. By leveraging the fully configurable maximum power point tracking (MPPT) function, the AEM10330 and AEM30330 can continuously monitor and regulate the input with a fast refresh rate of 20ms supported. Consequently, the extraction efficiency of the system will be kept as high as possible, regardless of variations in the input from the source.

AC/DC Converter ICs with Built-In 1700V SiC MOSFET
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Learn more:
rohm.com
  • Product Release
  • 2021-06-17

ROHM announces the AC/DC converter ICs with a built-in 1700V SiC MOSFET, BM2SC12xFP2-LBZ in the TO 263-7L package, optimized for industrial applications focusing on auxiliary power supplies for street lamps, commercial air-conditioning systems, general-purpose inverters and for AC servos drives. An auxiliary power supply is an essential and vital part of industrial applications to deliver different levels of DC voltages for gate drivers and control units. By applying existing Si MOSFET devices, the designer cannot achieve higher efficiency and increased out power because of the higher losses of Si devices. The existing solutions require a heatsink and additional components which increase both the losses of the devices and also the size of the system by additional space. To design an auxiliary power supply with existing Si devices will also be expensive because of a larger Bill of Material (BOM). ROHM's BM2SC12xFP2-LBZ power ICs are the Quasi-resonant (QR) AC/DC converters with an integrated 1700V SiC MOSFET in a single compact surface mount package (TO263). These ICs are the right fit and best in class products for industrial auxiliary power supply solutions in terms of efficiency, shortening design time, simplifying the circuitry and reducing additional components by offering integrated solutions. These ICs also increase product reliability by minimizing the risk of component failure. When used in 400VAC 48W output auxiliary power supplies, besides enabling automatic board mounting that was not previously possible, the number of external parts can be significantly reduced compared with standard configurations – from 12 parts and heat sink to just one.

Investing $700 Million to Boost Production Capacity
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Learn more:
nexperia.com
  • Industry News
  • 2021-06-17

Nexperia has announced the latest stage of its global growth strategy, confirming a $700 million investment over the next 12-15 months at its European wafer fabs, assembly factories in Asia and global R&D sites. The investment will boost manufacturing capacity at all sites while supporting research and development into areas such as gallium nitride-based (GaN) wide bandgap semiconductors and power management ICs. It will also underpin recruitment activities, with Nexperia looking to attract new chip designers and engineers. "This is an exciting time in the global semiconductor market, which has mounted a resurgence since the challenges of the first half of last year," says Achim Kempe, Nexperia's Chief Operating Officer. "Nexperia reported robust product sales of $1.4B in 2020, with demand accelerating rapidly in Q3 and Q4. That momentum has been maintained so far this year, and we expect it to continue over the long term. The $700 million investment will ensure that we continue to provide the technology and manufacturing capacity needed to deliver products in volumes that support increasing demand." As a result, the capacity of the Hamburg fab in Germany – which currently produces more than 35,000 wafers (8-inch-equivalent) per month (70 billion semiconductors per year) – will further increase by 20 per cent from mid-2022. While in the UK, at Nexperia's dedicated TrenchMOS fabrication facility in Manchester, the capacity will rise by 10 per cent by mid-2022 from the current 24,000 wafers (8-inch-equivalent) per month.

Power over Ethernet Transformer Series
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Learn more:
we-online.com
  • Product Release
  • 2021-06-16

Würth Elektronik expands its MID-POE Power over Ethernet transformer series to include PoE++. These SMT transformers are suitable for Flyback or Active Clamp Forward power supplies that comply with the IEEE 802.3bt (four pair power over Ethernet, 4PPoE, also known as PoE++) standard. The ten new transformers can provide an output power of up to 95 W. Demand for more power in Power-over-Ethernet (PoE) devices has risen due to the advancements in smart and IoT (Internet of Things) applications. In response to this demand, Würth Elektronik expanded its MID-POE series for IEEE 802.3bt Type 3 (60 W) and Type 4 (90 W) devices. These transformers utilize the low-profile EFD20 and EFD25 packages and offer high power densities over a wide range of common PoE output voltages. The series is suitable for devices such as video conferencing systems, automation control systems, smart IP cameras and much more. Customer-specific versions are possible on request. All MID-POE transformers are available from stock without a minimum order quantity.

Compact Switcher Reduces Component Count
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Learn more:
power.com
  • Product Release
  • 2021-06-16

Power Integrations announced LinkSwitch-TNZ, a switching power supply IC that combines offline power conversion, lossless zero-cross detection and, optionally, X-capacitor discharge functions in a compact SO-8C package. The LinkSwitch-TNZ IC can be used for non-isolated buck and buck-boost power supplies up to 575 mA output current and provides up to 12 W output for universal-input isolated flyback designs. Adnaan Lokhandwala, product marketing manager at Power Integrations said: "The new LinkSwitch-TNZ ICs provide an accurate signal indicating that the sinusoidal AC line is at zero volts. This signal is used by smart home and building automation (HBA) products and appliances to control the switching of relays, IGBTs and TRIACs to minimize switching stress and system in-rush current. LinkSwitch-TNZ's detection of the zero-cross point consumes less than 5 mW, allowing systems to reduce standby power losses versus alternative approaches that require ten or more discrete components and burn 50 to 100 mW of continuous power." LinkSwitch-TNZ ICs provide light-load efficiencies, enabling more system features to be powered while meeting stringent standby regulations such as: the European Commission (EC) standard for home appliances (1275), which requires equipment to consume no more than 0.5 W in standby or in off mode; ENERGY STAR's version 1.1 for Smart Home Energy Management Systems (SHEMS), which limits standby consumption of smart lighting control devices to 0.5 W; and China's GB24849, which limits the off-mode power consumption in microwave ovens to 0.5 W.

GaN Low-Voltage Designs Enable Compact 3-Phase Motor Inverter IC
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Learn more:
iaf.fraunhofer.de
  • Industry News
  • 2021-06-16

In battery-powered applications, in the automotive sector and in IT infrastructures 48 V technology is on the rise. In this voltage class, gallium nitride (GaN) power transistors offer the best compromise between safety, compactness and efficiency. Now, scientists at Fraunhofer IAF have presented pioneering integration concepts with GaN-based integrated circuits (ICs) for low-voltage applications. Whether battery-powered applications such as e-bikes, robotics or drones, drive and board systems in mobility, or IT infrastructures-all these sectors rely on cost-effective, efficient and compact electronics. To meet this demand, Fraunhofer Institute for Applied Solid State Physics IAF is researching GaN-based circuits for power electronics applications, even at low voltages of up to 48 V. The 48 V class has recently been on the rise and finds application in a wide variety of industries. This is due to the more efficient power transmission it offers compared to lower supply voltages. A change to 48 V is thus a resource-saving alternative for applications that previously used even lower voltages. In contrast to high-voltage power electronics, 48 V offers an ideal compromise between efficiency and safety. There is no need for elaborate safety measures, which renders the voltage class suitable for everyday applications. Highly integrated gallium nitride (GaN) components and systems are the ideal solution for 48 V technology. Compared to silicon (Si), GaN has significantly better physical properties for power electronics. In addition, GaN technology allows entire circuit components to be integrated on a chip. Researchers at Fraunhofer IAF have developed various highly integrated GaN circuits and pioneering integration concepts for low-voltage applications.

Expanding Product Family with Latest 80 V and 200 V Offerings
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Learn more:
epc-co.com
  • Product Release
  • 2021-06-15

EPC advances the performance capability while lowering the cost for off-the-shelf gallium nitride transistors with the introduction of EPC2065 and EPC2054. The EPC2065 is an 80 V, 3.6 m?, 221 Apulsed eGaN FET in a 7.1 mm2 chip-scale package. The small size and superior efficiency reduce overall power system size and weight and make it ideal for 32V-48V BLDC motor drive applications for eMobility ebike and escooters, service, delivery, logistic robots, and drones. In these applications the driver is integrated with the motor and miniaturization is a key factor. The ability to operate with significantly shorter dead times results in less noise and less EMI. The device is capable of high frequency operation to achieve the highest density for high frequency DC-DC converters for computing and industrial applications and for synchronous rectification. The EPC2054 is a 200 V, 3.6 m?, eGaN FET in a tiny 1.69 mm2 chip-scale package. The device can deliver 32 A pulsed current is an extremely small size, with very fast on-off transition times and super small capacitance and inductances, that make it ideal for industrial Lidar/ToF applications. The low resistance, low switching losses, no reverse recovery charge, fast switching, high frequency capability, and the tiny footprint make the EPC2054 a cost effective and high-density solution for a wide range of applications including, but not limited to, high frequency DC-DC, synchronous rectification, wireless power, class-D audio, Automation, Solar and Optical.

Cooperation to Deliver Silicon Carbide Technologies
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Learn more:
avnet.com
  • Industry News
  • 2021-06-15

EBV Elektronik announced it is working closely with Infineon on the manufacturer's leading-edge silicon carbide (SiC) based CoolSiC technology, which delivers key benefits for engineers designing advanced power systems across a wide selection of market sectors and applications. Infineon and EBV will cooperate over the next year and beyond to accelerate the deployment of energy-efficient power devices with CoolSiC technologies. The CoolSiC portfolio ranges from SiC-based diodes and discrete MOSFETs to hybrid and full SiC modules. "The SiC market is expected to grow at a CAGR of 30 percent over the next 5 years. Infineon is dedicated to participating in this growth for SiC technology leveraging distribution channels that share the same ambition," said PY Ferrard, Corporate Vice President Distribution & EMS at Infineon. "And we anticipate that EBV can be a cornerstone of our strategy to realise our goals for our CoolSiC portfolio, which provides designers with the ability to realise ever-lower costs and higher efficiency in power conversion systems in fast-growing markets and applications." "It speaks volumes that Infineon, a world leader in silicon carbide and power technologies, has chosen EBV as its first distributor to run a dedicated programme on CoolSiC technology," said Thomas Staudinger, President at EBV Elektronik. "It is a clear demonstration of both our know-how and the global reach of Avnet in critically important power electronics applications." Learn more about EBV's and Infineon's joint CoolSiC initiative.

Sensors for the Electric Motors Industry
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Learn more:
rvmagnetics.com
  • Product Release
  • 2021-06-15

RVmagnetics as a technology company has issentially managed to overcome shortcomings of other sensor solutions in various industries (civil engineering, electric motors, energy, composites, etc.), and is favored by the clients, that used to have no way to gather physical data that they needed, with the accuracy they needed. RVmagnetics addresses these needs with a unique sensing technology. The MicroWire sensor is thin like a human hair, and it can provide measurements of temperature, pressure, tension, torsion, position, electric current and magnetic field. It is important to mention that the measurements can be gathered in contactless manner, in real-time. Producing these MicroWires at an industrial scale is also not an issue for RVmagnetics as the company can manufacture 100,000 MicroWire sensors in ten minutes. One of the industries the company is actively integrated in currently is the Electric Motors industry. RVmagnetics can custom develop a sensing system that provides real-time measurements of different parts of electric motors, thus creating a Predictive Maintenance and Structural Health Monitoring opportunities with extreme accuracy. Significant benefits of RVmagnetics sensing system are measures in the real-time, increased efficiency and effectiveness by maximizing the potential of physical limits, it helps decrease power consumption, measures temperature, position, RPM with one communication interface, it detects faults inside of the motor – and helps optimizing predictive maintenance.

Search Capability Helps Designing Electronics
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Learn more:
rs-online.com
  • Industry News
  • 2021-06-14

SnapEDA and DesignSpark are launching a collaboration to help engineers design faster, regardless of which PCB design tool they use. The collaboration will augment the DesignSpark website with the SnapEDA search engine, allowing engineers to discover and design-in millions of electronic components through free computer-aided design (CAD) models that are compatible with nearly all major PCB design tools. With over a billion electronic components in production, part selection and design-in are significant bottlenecks when designing electronics. In addition to the sheer volume of parts to choose from, engineers need to procure sophisticated digital models for each component in their designs. This prerequisite for complex design content is a burden on engineers that ampers innovation. The new SnapEDA search experience on the DesignSpark website makes it easy for engineers to search and design-in electronic components, allowing engineers to jump straight to design. Engineers can search for a keyword like 'bluetooth' or 'usb type c' to discover new components, or enter a specific part number. Once they've selected a product, they can download the CAD model instantly. "Since launching DesignSpark 11 years ago, RS Components has demonstrated its commitment to supporting the engineering community through tools and resources," said Natasha Baker, Founder and CEO of SnapEDA.

Transfer-Molded Modules Simplify Compact Motor Drive Design
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Learn more:
onsemi.com
  • Product Release
  • 2021-06-14

ON Semiconductor announces integrated, converter-inverter-power factor correction (PFC) modules for use in industrial motor drives, servo drives and HVAC where they are used to drive motors for applications including fans and pumps. The NXH50M65L4C2SG and NXH50M65L4C2ESG are transfer-molded power integrated modules (TMPIM) based upon standard aluminum oxide (AI2O3) substrate and enhanced low thermal resistance substrate respectively. Ideally suited to rugged industrial applications with high output power, the modules contain a converter-inverter-PFC circuit consisting of single-phase converter with four 75 A, 1600 V rectifiers. The 3-phase inverter uses six 50 A, 600 V IGBTs with inverse diodes and the dual-channel interleaved PFC comprises two 75 A, 650 V PFC IGBTs with inverse diodes and two 50 A, 650 V PFC diodes. An NTC thermistor is embedded to allow for monitoring of device temperature during operation. As the module is pre-assembled in an optimized layout and configuration, parasitic elements are very small when compared with discrete PCB-based designs, thereby allowing a wide PFC switching frequency range between 18 kHz and 65 kHz. The highly efficient NXH50M65L4C2SG and NXH50M65L4C2ESG are rated at 50 A permitting use in applications up to 8 kW, and are the latest devices in the ON Semiconductor TMPIM family. Other devices are available with current ratings of 20 A and 30 A. A silicon carbide (SiC) option is also available for further increased switching frequency and efficiency.

48V / 12V Bi-Directional DC-DC Converter
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Learn more:
delta-emea.com
  • Product Release
  • 2021-06-10

Delta recently unveiled its High Power Density Bi-Directional DC-DC Converter U50SU4P162 for data centers, super computers, and other high-tech systems. Emphasizing the requirement of high-efficiency, high-density data centers, the U50SU4P162 provides 48V / 12V bi-directional conversion, and features high power density of up to 3,000 W/inch3 with a small footprint (23*17.4*10 mm) and up to 98% conversion efficiency. The U50SU4P162 DC-DC Converter provides 48V / 12V bi-directional conversion, 800 W output power, and 1 MHz switching frequency. The ultra-high power density (up to 3,000 W/inch3) allows the U50SU4P162 to achieve 98% power conversion efficiency in a compact size of 23*17.4*10 mm. The ability of handling large load capacitance (up to 10,000 µF) and double-sided heat sink with low thermal resistance also help to ensure high-performance computing for high-density data centers. Another highlighted feature of the U50SU4P162 is the PMBus (power management bus) protocol. It allows the converter to transmit power data to system controllers for efficient monitoring and management. Delta is also outpacing others by offering customization services for power configuration and optional heat sinks to help customers build advanced systems. With advanced functions, high power density, small footprint, and customizability, the U50SU4P162 ensures the high efficiency of data centers, super computers, and other high-tech systems.

High Power Anti-Surge Pulse Power Resistors
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Learn more:
koaspeer.com
  • Product Release
  • 2021-06-10

KOA Speer Electronics is adding a high power 0402 size to their SG73P series of anti-surge, pulse precision thick film chip resistors. The SG73P1EW has a power rating of 0.25 watt with a TCR as low as ±100ppm/°C. This represents a 100% increase in power compared to the existing SG73P 0402 package. The SG73P1EW provides greater power and precision in a 0402 package size. The SG73P1EW resistors offer a range of resistance values from 1O to 10MO and an operating temperature range of -55°C ~ +155°C. The pulse power SG73P1EW resistors are available with resistance tolerances of ±0.5%, ±1%, ±2%, and ±5%. The new SG73P1EW resistors are AEC-Q200 qualified. The increased power capabilities of the SG73P1EW resistors enable engineers to downsize circuits and reduce the number of components required for their design. These anti-surge endured pulse power resistors provide high-precision control of high voltage circuits, making them an excellent choice for ECU use in automotive electronics, ADAS, industrial devices, and power supplies.

Miniature Buck Converter Delivers 4A
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Learn more:
recom-power.com
  • Product Release
  • 2021-06-10

RECOM has added a 4A option to its RPX series of miniature buck converters. The RPX-4.0 is rated to 3.8 to 36V input and programmable 1 to 7V output at 4A. With a compact 5mm x 5.5mm footprint and low 4.1mm height in a thermally-enhanced QFN package, the buck module pushes the limit on power density. The product features on-off control, a power good signal, and soft start, and is fully protected including under-voltage, short-circuit, over-current, and over-temperature. The RPX-4.0 efficiency is high, allowing full power operation up to 65°C and derated operation up to 90°C. Construction follows the RECOM '3D Power Packaging' technology for high power density, with flip-chip on leadframe construction, an integrated shielded inductor for low EMI, and intelligent control of switching frequency to maintain high efficiency even at light load. The RPX-4.0 needs just voltage setting resistors and input/output capacitors for a complete high-performance solution and is delivered with the RECOM 3-year warranty. An evaluation board, RPX-4.0-EVM-1, is also available, allowing customers to exercise all of the product features and optimize filtering to meet target system requirements. "We are excited to launch the latest in our RPX series of buck converters" commented Matthew Dauterive DC/DC product manager of RECOM, "Users will find it particularly suitable for industrial automation, test and measurement, portable devices, and high density or weight-sensitive applications".

Finalists Impressed with Smart and Modular Energy Storage Solutions 
  • Event News
  • 2021-06-10

Batteries and energy storage systems are key components of the future energy world. As the finalists of this year's ees AWARD demonstrated, there is plenty of optimization potential in transportation and installation in particular. The winners were crowned at an online ceremony as part of The smarter E Industry Days held in July 2021. An industry cannot move forward without innovation. That's why companies have been rewarded for their pioneering solutions and projects with the storage industry's innovation prize, the ees AWARD, since 2014. This year, the ees, Intersolar, and The smarter E AWARD was presented online on July 21, 2021 as part of The smarter E Industry Days. Innovation within companies reveals the industry trends – think environmentally friendly battery cells, smart transport and software solutions, and component modularization – and covers the entire supply chain for battery and energy storage technology. Energy storage systems and batteries have huge potential for optimization and savings in transportation and installation in particular. The modularization of heavy components for transportation and installation cuts down on the manpower required, while also saving on resources needed for repairs. With a shift to pre-assembly and smart transport and software solutions on board, installation is simplified and the amount of packaging needing to be disposed of at the installation site is reduced. Environmentally friendly battery cells are still very much on trend. Lithium-iron-phosphate cells or NMC cells with a lower proportion of cobalt are used in many storage systems. The future performance of a battery can now be predicted with a high degree of accuracy via cloud-based analyses of battery operating data.

EMV 2022 Call for Papers
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Learn more:
emv.mesago.com
  • Event News
  • 2021-06-10

In preparation for the next EMV event, experts in electromagnetic compatibility are invited to actively design the conference and workshop program. The event is to be held in Cologne from 15 to 17 March 2022. Representatives from academia and industry can now submit proposals for the EMV, Europe's most significant electromagnetic compatibility event. Abstract submissions are possible until 13 September 2021. Speakers can now hold conference presentations in English or, as before, in German. In addition, those interested can choose between two forms of participation in the conference, which differ mainly in terms of the time required and the citation eligibility:
1.      Speakers can submit an abstract as usual and later a full paper. The full paper will be published in the conference proceedings and in the repository with DOI number (Open Access) as a citable publication.
2.      In the Call for Papers, submissions without a full paper are now also accepted. These do not have to be a first publication.

Depending on the scope, thematic structure and target group, it is possible to submit an abstract for a 20-minute contribution at the conference, or to apply for an approximately three-hour, practice-oriented workshop.

Global Manufacturer and Supplier of Magnetic Components Acquired
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Learn more:
kamicgroup.com
  • Industry News
  • 2021-06-09

KAMIC Group AB has acquired all the shares in Talema Group LLC ("Talema"). The seller is an owner consortium consisting of the Park and Daily families. Talema is a manufacturer of magnetic components such as transformers, toroids, inductors and chokes with associated design work. The majority of components are developed specifically for bespoke customer applications but standard components are also offered. The company's customers are found across a broad spectrum of sectors where the most important include logistics and warehousing, freight and transport, audio, and renewable energy. Talema was founded in 1975 and has its registered office in the USA but operational management is based at the head office in Donegal in north-west Ireland. The company has its own production facilities in the Czech Republic and India. Sales are conducted through own sales offices in the USA, Germany, Czech, India and Ireland as well as a global network of agent and distributors. Talema has approximately 750 employees and annual sales of about EUR 12 million. "Talema is a highly respected global player with strong skills in the design, development and production of magnetic components. They have an experienced and powerful management and the company's customer base and geographic presence provide an ideal complement to our existing business in this area. Talema therefore is ideally placed to be a valuable addition to our corporate group," says Fredrik Celsing, President and CEO of KAMIC Group.

Launch of B0 Diode and Thyristor Modules
  • Product Release
  • 2021-06-09

The team of Proton-Electrotex is happy to announce the launch of serially produced single-component diode and thyristor modules B0. The design of B0 modules provides improved electrical and thermal parameters allowing to achieve IFAV / ITAV values up to 700 A. The VDRM / VRRM voltage range varies from 1000 to 6500V. At the same time, the modules have an industry standard housing with a baseplate width of 50 mm making it easier to use them in existing equipment. The modules are designed for use in energy converters, as well as other DC and AC circuits of various power electrical units. The main applications of the B0 modules are the electric drive control systems, rectifier bridges, AC controls, DC motor control, power supplies. Proton-Electrotex offers various options for customization of products, taking into account the individual requirements of each customer to parameters, connections and appearance of the semiconductors.

Series of Programmable DC Power Supplies
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Learn more:
magna-power.com
  • Product Release
  • 2021-06-08

Magna-Power expanded its SL Series programmable DC power supply product line with the introduction of 18 models at 10 kW rated output power, while maintaining the product line's 1U (1.75" high) rack-mount form factor. The SL Series continues to lead 1U rack-mount programmable DC power supply power density, enabling extremely power dense rack-mount integrations, with continuous full-power operating at ambient operating temperatures from -25°C to 50°C and zero clearance required on top and bottom. The 18 new SL Series models span rated voltages up to 1500 Vdc and rated currents up to 250 Adc, with three-phase AC input options including: 208 Vac, 240 Vac, 380/400 Vac, 415 Vac, 440 Vac, or 480 Vac. All SL Series models come standard with monitoring and control from a variety of sources, including: front panel, computer interface and an isolated analog-digital I/O connector for PLC integration. A Standard Commands for Programmable Instrumentation (SCPI) command set is supported for control from virtually any programming language, including Python. In addition, an IVI driver is included for the Visual Studio programming environment along with a dedicated National Instruments LabVIEW and LabWindows driver. Additional computer interface options include LXI TCP/IP Ethernet (+LXI), IEEE-488 GPIB (+GPIB), USB and RS-485. With the Ruggedized (+RUG) option, the SL Series meets MIL-STD-810G shock and vibration standards. Ultra-high stability and precision applications, such as for magnet steering, can be met by combining the SL Series with the DBx Module. Similarly, high-power battery charging or back-emf protection can be achieved in combination with the BDx Module.

MOSFET Qualified for Commercial and Military Satellites and Space Power Solutions
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Learn more:
microchip.com
  • Product Release
  • 2021-06-08

Microchip Technology announced the qualification of its M6 MRH25N12U3 radiation-hardened 250V, 0.21 Ohm Rds(on), metal–oxide–semiconductor field-effect transistor (MOSFET) for commercial aerospace and defense space applications. The MOSFET withstands the harsh environments of space, extends reliability of power circuitry and meets all requirements of MIL-PRF19500/746 with enhanced performance. Microchip completed testing for Defense Logistics Agency (DLA) review and qualification, for the device's sourcing in the U.S. military supply chain (expected JANSR2N7593U3 certification in June 2021). The M6 MRH25N12U3 MOSFET is designed for future satellite system designs as well as serving as an alternate source in existing systems. It can withstand total ionizing dose (TID) up to 100 krad and 300 krad and single event effects (SEE) with linear energy transfer (LET) up to 87 MeV/mg/cm2. It provides 100-percent wafer lot radiation hardness assurance in validation tests. "Microchip's entry into the radiation-hardened MOSFET market reflects our long-term commitment to support our customer base and provide aerospace and defense OEMs and integrators with high-performance solutions and continuous supply," said Leon Gross, vice president of Microchip's Discrete Product Group business unit. "In addition to our proven quality and reliability, the M6 MRH25N12U3 provides a value pricing option for developers and offers them full application support."

MOSFET Qualified for Commercial and Military Satellites
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Learn more:
microchip.com
  • Product Release
  • 2021-06-08

Microchip Technology announced the qualification of its M6 MRH25N12U3 radiation-hardened 250V, 0.21 Ohm Rds(on), metal–oxide–semiconductor field-effect transistor (MOSFET) for commercial aerospace and defense space applications. It provides the primary switching element in power conversion circuits including point-of-load converters, DC-DC converters, motor drives and controls and general-purpose switching. The MOSFET withstands the harsh environments of space, extends reliability of power circuitry and meets all requirements of MIL-PRF19500/746 with enhanced performance. Microchip completed testing for Defense Logistics Agency (DLA) review and qualification, for the device's sourcing in the U.S. military supply chain (expected JANSR2N7593U3 certification in June 2021). The M6 MRH25N12U3 MOSFET is designed for future satellite system designs as well as serving as an alternate source in existing systems. The device can withstand total ionizing dose (TID) up to 100 krad and 300 krad and single event effects (SEE) with linear energy transfer (LET) up to 87 MeV/mg/cm2. It provides 100-percent wafer lot radiation hardness assurance in validation tests. "Microchip's entry into the radiation-hardened MOSFET market reflects our long-term commitment to support our customer base and provide aerospace and defense OEMs and integrators with high-performance solutions and continuous supply," said Leon Gross, vice president of Microchip's Discrete Product Group business unit. "In addition to our proven quality and reliability, the M6 MRH25N12U3 provides a value pricing option for developers and offers them full application support."

Support Site for Designers: Ensuring Functional Safety in Vehicles
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Learn more:
rohm.com
  • Industry News
  • 2021-06-08

ROHM's website consolidates 1,000 products under the ComfySIL brand to support functional safety in automotive systems. Improving the searchability of products and various documents contributes to greater work efficiency for electronic circuit and system designers in the automotive field. In recent years, following the acceleration of technical innovation represented by ADAS (Advanced Driver Assistance System) in the automotive sector, it has become necessary to consider functional safety to help prevent accidents. At the same time, in response to the increasing importance to ensure vehicle safety by supporting safety requirements at the device level for onboard electrical systems, a 2nd edition of ISO 26262, the international standard for functional safety, was released in December 2018 that adds a chapter on semiconductor. ROHM quickly responded to these needs, and in March 2018 successfully acquired ISO 26262 development process certification from 3rd party certification body TÜV Rheinland. Since then, ROHM gradually expanded its portfolio to include documents required for functional safety design, and currently features a lineup of more than 1,000 compatible part numbers. This new special site consolidates functional safety compliant products under the brand name ComfySIL that will be used on the web and relevant documents to significantly improve product searchability. The ComfySIL brand targets not only vehicles, but also functional safety for other markets as well, and going forward we will expand our lineup products that support functional safety for the industrial equipment field as well.

Packages Improved Robustness and Thermal Performance
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Learn more:
infineon.com
  • Product Release
  • 2021-06-08

Applications such as e-scooters, e-forklifts and other light electric vehicles (LEVs), as well as power tools and battery management systems, demand high current rating, ruggedness and extended lifetime. Infineon Technologies addresses these requirements by offering more choices to power system designers to meet diverse design needs and achieve maximum performance in the smallest space. With the TO-Leadless (TOLL) package, Infineon now offers two OptiMOS power MOSFET packages in the TOLx family: TOLG (TO-Leaded with Gullwing leads) and TOLT (TO-Leaded Top-side cooling). Together, the TOLx family offers very low R DS(on) and a high-current rating over 300 A to increase system efficiency in high-power density designs.
The TOLG package combines the best features of TOLL and D 2PAK 7-pin packages, sharing the same 10 x 11 mm 2 footprint and electrical performances as TOLL with added flexibility comparable to D 2PAK 7-pin. The main advantages of TOLG are particularly apparent in designs with aluminum-insulated metal substrate (Al-IMS) boards.
The TOLT package is optimized for superior thermal performance. Constructed with its lead-frame flipped to position exposed metal on the top side, the package contains multiple gullwing leads on each side for high current carrying drain and source connections. With a flipped lead-frame, heat passes from the exposed metal top side, through the insulating material, directly to the heatsink.

New Role for Andreas Karch: Technologist Advanced Applications
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Learn more:
indium.co
  • People
  • 2021-06-08

Indium Corporation is proud to announce the new role of one of its foremost industry experts, Andreas Karch. Karch is currently technical manager for Germany, Austria, and Switzerland and will also have the title of technologist – advanced applications. Throughout his five years with Indium Corporation, Karch has demonstrated his expertise and willingness to engage in complex technical projects with high profile customers; share his expertise in German automotive electronics committees; and project partner with key co-suppliers. Through these activities, he has promoted the use of Indium Corporation's products and built its reputation in Europe. "Since joining the Indium Corporation family, Andreas has been a key member of our European team," said Brian Craig, managing director of Indium Corporation's European operations. "This addition to his title reflects the evolution of his responsibilities and his well-regarded ability to connect with customers, industry consortia, and thought leaders." Karch will continue to provide technical support, share process knowledge, and make recommendations on the use of Indium Corporation's products in key industries. Karch joined Indium Corporation in April 2016. He has more than 25 years of automotive industry experience in PCB assembly and power electronics. His professional successes include receiving an award for the top 10 innovative patents for an automotive LED assembly; being certified as an ECQA integrated design engineer; and earning his Six Sigma Yellow Belt. 

ESD Solutions with High-Trigger Voltage
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Learn more:
aosmd.com/pdf
  • Product Release
  • 2021-06-08

Alpha and Omega Semiconductor introduced the AOZ8S303BLS-24 and AOZ8S305BLS-24, a series of single-channel Transient Voltage Suppressor (TVS) for high-speed line protection using the best-in-class low capacitance TVS platform. The products are ideal for Electrostatic Discharge (ESD) protection of Type-C connectors in mobiles, laptops, televisions, and other electronic devices. USB Type-C with PD (Power Delivery) has become a standard power and data interface of notebook PCs and smartphones, and the voltage range is defined as variable from 5V to 20V. For fast charging such as USB Power Delivery and Quick Charger, traditional TVS diodes for USB protection with breakdown voltage lower than 20V risk getting shorted or damaged. Hence, the corresponding Type-C port will inactivate permanently. To solve this common market problem, AOS proposes two TVS, AOZ8S303BLS-24 and AOZ8S305BLS-24. Their high reverse working voltage covers the whole voltage range from a USB-PD port. In addition, the Ultra-Low-Clamping Voltage and Capacitance are optimized for ESD protection in high-speed lines, including but not limited to USB, Thunderbolt, HDMI, and PCI Express, by minimizing the capacitance effect. "Type-C connectors are widely applied in electronics devices. The new products housed in a standard WLCSP0.6x0.3-2 (0201) package, and its small form factor is ideal for high-speed differential signals in Type-C. Both AOZ8S303BLS-24 and AOZ8S305BLS-24 will not only contribute to reducing the ESD failure rate but also reducing the failure of Short-to-VBUS in our partners' and customers' electronic products," said Michael K. S. Ng, Sr. Marketing Manager of the TVS product line at AOS.

Wafer Fab of the Future in Dresden
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Learn more:
bosch.de
  • Industry News
  • 2021-06-07

In Dresden, Bosch is opening one of the world's most modern wafer fabs. Highly automated, fully connected machines and integrated processes, combined with methods of artificial intelligence (AI) will make the Dresden plant a smart factory and a trailblazer in Industry 4.0. In the virtual presence of Federal Chancellor Dr. Angela Merkel, the high-tech facility was officially inaugurated on June 7, 2021. "The new Bosch wafer fab will boost our capacity in microelectronics. Microelectronics is the basis for nearly every promising technology, for applications of artificial intelligence, for quantum computing, and for automated and connected driving – which is also a Bosch specialty," said Federal Chancellor Dr. Angela Merkel. "The new wafer fab is the single largest investment in the company's history. This cannot be stressed too much. Its size and additional production capacity alone are impressive. The very latest methods of data-driven continuous improvement in production make the Dresden plant a smart factory. To put it another way: in this plant, natural and artificial intelligence have joined forces with the internet of things to form a productive symbiosis." Production in Dresden will start as early as July – six months earlier than planned. From that time on, semiconductors made in the new plant will be installed in Bosch power tools. For automotive customers, chip production will start in September, and thus three months earlier than planned. The new factory will be an important part of the semiconductor manufacturing network. With it, Bosch is strengthening Germany's position as a technology and business location. On 72,000 square meters of floor space, 250 people are already working in the wafer fab in Saxony's state capital. The workforce is set to grow to roughly 700 once construction work has been completed.

International Electron Devices Meeting Announces Call for Papers
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Learn more:
ieee-iedm.org
  • Event News
  • 2021-06-04

Under the theme "Devices for a New Era of Electronics: From 2D Materials to 3D Architectures," the 67th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers. The 2021 IEDM is being planned as an in-person conference December 11–15, 2021 at the Hilton San Francisco Union Square hotel, with on-demand access after the event for those who are unable to travel due to COVID-19 restrictions. The paper submission deadline is Friday, July 23, 2021. Authors are asked to submit four-page camera-ready papers. Accepted papers will be published as-is in the proceedings. A few late-news papers also will be accepted, covering only the most recent and noteworthy developments. The late-news submission deadline is August 30, 2021. "IEDM is currently being planned as an in-person event in San Francisco in December with on-demand access to content available after the event, although meeting plans are subject to change to stay in compliance with COVID-19 guidelines," said Meng-Fan (Marvin) Chang, IEDM 2021 Publicity Chair and IEEE Fellow, Distinguished Professor of Electrical Engineering at National Tsing Hua University, and Director of Corporate Research at TSMC. "Should an in-person meeting not be feasible, IEDM will go fully virtual. Additional details will be made available later this year." "Our theme this year was chosen to emphasize the many changes sweeping across the electronics industry and the diverse technologies that are enabling them," said Srabanti Chowdhury, IEDM 2021 Publicity Vice Chair and Associate Professor of Electrical Engineering at Stanford University. "IEDM 2021 will continue its long tradition of having a rich technical program full of relevant, state-of-the-art results, and the conference will give attendees the opportunity to interact with colleagues from academia and industry around the world."

750V SiC MOSFETs Offer Performance and Reliability
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Learn more:
genesicsemi.com
  • Product Release
  • 2021-06-04

GeneSiC's next-generation 750V G3RSiC MOSFETs will deliver unprecedented levels of performance, robustness and quality. System benefits include low on-state drops at operating temperatures, faster switching speeds, increased power density, minimal ringing (low EMI) and compact system size. GeneSiC's G3R, offered in optimized low-inductance discrete packages (SMD and through hole), are optimized to operate with lowest power losses under all operating conditions and ultra-fast switching speeds. These devices have substantially better performance levels as compared to contemporary SiC MOSFETs. "High-efficiency energy usage has become a critical deliverable in next-generation power converters and SiC power devices continue to be the key components driving this revolution. After years of development work towards achieving the lowest on-state resistance and robust short circuit and avalanche performance, we are excited to release the industry's best performing 750V SiC MOSFETs. Our G3R enable power electronics designers to meet the challenging efficiency, power density and quality goals in applications like solar inverters, EV on-board chargers and server/telecom power supplies. An assured quality, supported by fast turn-around and automotive-qualified high volume manufacturing further enhances their value proposition. " said Dr. Ranbir Singh, President at GeneSiC Semiconductor.

Using GaN Transistors to Develop DC/DC Converters
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Learn more:
brightloop.fr
  • Industry News
  • 2021-06-03

With its VALUE DC-DC product line, BrightLoop Converters is aiming to democratize access to performance and offer a range of converters dedicated to off-highway and commercial vehicles. The French player in power electronics is teaming up with Efficient Power Conversion (EPC) to deliver the upcoming VALUE product line. BrightLoop Converters has gained experience from many years of development for motorsport applications and learned to make the most out of GaN technology to deliver highly reliable, extremely light and compact converters. The company released in 2020 a PERFORMANCE DC-DC product line offering great versatility to extreme vehicle applications and motorsports. After demonstrating that GaN technology can significantly improve performance, the French company now wants to prove that using this technology does not necessarily lead to higher costs. With the launch of the new VALUE product line later this year, the strategy is clear: make performance accessible to these markets, which are now also looking for lightweight, space-saving and high-performance converters in the most cost-effective way. Florent Liffran, CEO of BrightLoop Converters commented: "We are proud to bring our expertise along with EPC's top technology to the commercial and off-highway markets. Our focus has always been to push the limits of performance further and with this new VALUE product line, our goal is clearly to bring our know-how to markets which have historically worked with heavy and bulky power electronics, making it possible for them to have a taste of outstanding performance, versatility and power density while remaining in their price range."

Chokes for Medical Technology Applications
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Learn more:
smp.de
  • Product Release
  • 2021-06-02

SMP Sintermetalle Prometheus (SMP) offers chokes for medical technology applications. These inductive components are used in Magnetic Resonance Imaging (MRI) or Computed Tomography (CT), for example. Designed as filter or mains chokes they are not only compact, low-loss and energy efficient but also exceptionally quiet in operation – essential qualities for demanding medical technology applications. In MRI scanners, the components are installed in the "gradient amplifiers", which supply output voltages and currents and control the gradient coils that encode the resonance signals for subsequent image reconstruction. The filter and mains chokes are designed to ensure a clean sinusoidal waveform and low-loss feedback of the unused energy. Special magnetostriction-free materials, which SMP develops and produces according to individual customer specifications, ensure that components run very quietly. The powder composite materials feature low eddy current and magnetic reversal losses. The components are noted for their low loss balances and optimal EMC properties. They are also maintenance-free. The three-dimensional isotropy of the materials enables compact, lightweight structures, because the magnetic circuits are minimized. This also lowers the magnetic field strength, and the quantity of winding material used can be significantly reduced. The materials have a high saturation induction of up to 2 Tesla. The oscillation behaviour of the choke can be adjusted specifically by using certain materials or appropriate, magnetically coupled designs with multiple coils.

Regulated SIP8 DC/DC Converters
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Learn more:
recom-power.com
  • Product Release
  • 2021-06-02

RECOM has announced the launch of the RS3E family of DC/DC converters in an industry-standard SIP8 format and pin-out. The parts are rated at 3W with no derating to 70°C and feature 2:1 input ranges of 4.5-9V, 9-18V, 18-36V and 36-72V. Fully regulated outputs available are 3.3V, 5V, 9V, 12V, 15V and 24V. Isolation is 3kV (one minute) and the parts hold IEC/UL/CSA 62368-1 safety certification up to 5000m altitude while meeting EN 55032/FCC class B and EN 55035 EMI standards. The RS3E family features short circuit protection, high MTBF of 1.8M hours and a control input to place the converters in a low-power shutdown mode. Matthew Dauterive, RECOM DC/DC product manager comments: "We have set the bar high again with a great combination of low cost and high power density from a 3W DC/DC converter in a standard SIP8 package. It will find wide application in demanding environments such as industrial and e-mobility".

PCNS Registration is Now Open
  • Event News
  • 2021-06-02

3rd PCNS Passive Components Networking Symposium is now open for on-line registration. The third PCNS is organized as a hybrid event September 7-10, and it is possible to register either as live attendee or virtual attendee. Fee is equal, and early bird registration rate is valid till 16th July 2021. PCNS received 27 paper abstracts from 9 countries EU and USA (vs 19 papers at 2nd PCNS)! The papers' scope submitted by passive manufacturers, universities, material suppliers, space agencies and end users include capacitors, resistors, inductors and passive sensors in areas of aerospace, automotive or industrial. Topics are covering reliability, qualification, new materials & technologies and research. Pre-event includes workshops on reliability, life time and sustainability of passive components – open for free for all main conference symposium attendees. "We are looking forward to meet in September during this challenging year. Hopefully, we can finally meet live to enjoy multilevel exchange of experience and news within a passive industry. … meet old friend and new colleagues. Live streaming video will be available for those with travel restrictions." said Tomas Zednicek; EPCI and PCNS organising committee president.

High-Power Types of Photovoltaic MOSFET Drivers
  • Product Release
  • 2021-06-01

Modern industrial automation solutions, energy systems and professional equipment are often extremely specialized devices that require high safety and design flexibility for switching elements like semiconductor relays. A photovoltaic driver for galvanic separation in combination with a distinct MOSFET power switch leaves nothing to be desired. The APV models of Panasonic Industry's Photovoltaic MOSFET drivers can control MOSFETS in a new range by offering high-output voltage or high-output current. The drivers come in a miniaturized SSOP housing and provide a galvanic separation of 1,500V between the control circuit and the power output circuit. The high-power type APV3111GVY directly switches Power MOSFETs for high-load currents, thanks to a generated output voltage of 18V used for controlling the MOSFETs Gates, a feature that reduces the number of amplifier parts on the PCB. APV1111GVY comes into play in the context of high-speed switching with high-current requirements - and stands out with a remarkable output current of 45µA for fast MOSFET Gate charging. It is a straightforward driver principle, one that is ready for efficient and miniaturized next-gen high-power applications in a wide range of temperatures, including power supply devices, measuring equipment, energy storage systems and much more.

Low Power Boost DC/DC Converter for Energy Harvesting
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Learn more:
n-redc.co.jp
  • Product Release
  • 2021-06-01

Ricoh Electronic Devices in Japan has launched the R1810 Boost DC/DC Converter, a complete energy harvesting solution designed for powering low current consuming IoT devices by extracting energy from Photovoltaic cells. Target applications include wireless sensors, home and building automation, remote monitoring, presence detection, industrial equipment controls and more. Alternative power supplies replacing conventional batteries are nowadays immensely popular, autonomous operating wireless devices significantly reduce the cost and labour of regular maintenance to replace batteries. Such power supplies operate with photovoltaic cells that usually supply a voltage which is way below the desired operating voltage for the application, therefore a special circuit is required that collects, converts and stores energy in an external energy storage capacitor, followed by regulation of the output voltage to the required level. The R1810 is especially tailored for this purpose and starts up with only 9µW provided from a single cell photovoltaic element, the start-up voltage is only 0.5 V and once started, the operation continues even if the input voltage drops below 0.2 V. It has a high efficiency performance of 66% at 5 µA output current (VIN=0.5V, VSET=2.6V). The advanced R1810 has an internally fixed maximum power point voltage (VMP) and output voltage setting (VSET) to optimize the performance of the electrical circuit with respect to the selected energy harvester type. Once sufficient energy available on the input and increases above the VMP level, the boost DC/DC Converter will be enabled to transfer energy from input to the output.

Podcast Examines Power Management
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Learn more:
mouser.com
  • Industry News
  • 2021-06-01

Mouser released the second installment of the 2021 series of its 'Empowering Innovation Together' program and 'The Tech Between Us' podcast. The series' second episode, available on the Mouser website, Alexa, Apple Podcasts, Google Podcasts, iHeartRadio, Pandora and Spotify, explores power management and the potential behind wide bandgap technology. In this episode, Raymond Yin, Mouser's Director of Technical Content, is joined by Steven Shackell, ON Semiconductors' Product Line Manager for Silicon Carbide and Gallium Nitride, for a conversation about current wide bandgap devices. As they define what makes a semiconductor "wide bandgap," the pair shares more about the technology's applications, benefits and limitations for power management design.
"This latest installment of the EIT program presents engineers with what the future may hold for power management technology," says Glenn Smith, President and CEO of Mouser Electronics. "As demand for energy increases, wide bandgap offers significant opportunities for further improvement in power efficiency, positioning it as the future of semiconductors."

Low Pressure Molding Technology for Encapsulation of Electronics
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Learn more:
henkel.com
  • Product Release
  • 2021-06-01

Henkel's Low Pressure Molding technology for encapsulating electrical and electronic components in its Technomelt polyamide adhesive molding compounds is increasingly being adopted for medical, electronic components, power and industrial automation, HVAC and lighting applications. The technology offers numerous economic, process control, design and environmental advantages over alternative systems such as potting with reactive resin systems and high-pressure injection molding. Technomelt Low Pressure Molding (LPM) technology was invented some 30 years ago by Henkel (formerly called Macromelt Molding). The technology enables the quick encapsulation of delicate components by using specialized polyamides in combination with standard processing equipment and low-cost molds. Because the material is injected at a lower pressure compared to conventional injection molding processes, and non-abrasive materials are used, risk of damage to the electronics during the encapsulation process is far lower. The technology is particularly adept at encapsulating discrete areas in complicated assembly where wiring is attached to a printed circuit board (PCB), PCBAs and other rigid component. One reason for this is that Technomelt resins, which are all unfilled, are resistant to high stresses and at the same time very flexible.

Air-cooled Modular Power Supply
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Learn more:
lambda.tdk.com
  • Product Release
  • 2021-06-01

TDK Corporation announces the introduction of the TDK-Lambda brand TPF45000-385 non-isolated modular AC-DC power supply. Developed for use in distributed power architectures (DPA) and DC Microgrids, the 98% highly efficient TPF45000 provides a regulated 385Vdc output with a current of up to 117A. Low internal losses enables the use of cooling by fans, avoiding the complexity of water cooling. This industrial grade product is suitable for use in semiconductor test and burn in systems, LED based horticultural lighting and DC Microgrids. Comprising of up to ten 4.5kW modules, the series can deliver up to 45kW of output power in a less than 3U high package, and operates from a wide range Delta or Wye 360 - 528Vac three phase input. The unit can operate at full load in ambient temperatures from -10 to 50°C (-20°C start-up). The enclosure measures 450mm wide (excluding side rack mount flanges) 113mm high and has a depth of 533mm. The weight of the product is 30kg. The TPF45000 is fully featured with DC Good, dropped phase, over temperature and fault alarm signals, remote on/off and a 13 to 15V 0.5A auxiliary output. PMBus and USB communications interfaces allows remote monitoring of the input voltage, output voltage, output current, internal temperature, status signals and fan. In addition, the remote on/off can be programmed by the PMBus. The power supply has 2kVac primary to ground isolation, is certified to IEC/EN/UL/CSA 62368-1 and carries the CE mark for the Low Voltage, EMC and RoHS Directives.

Wireless Power Supply Technology Offers a Route to Wireless Charging in Higher Power Applications
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Learn more:
eggtronic.com/pdf
  • Product Release
  • 2021-06-01

Eggtronic has announced E2WATT, an AC power technology that will boost the power, efficiency, charging distance and data transmission capabilities of wireless charging applications. Offering efficiency comparable with the best conventional wired AC adapters, E2WATT provides the foundation for taking future mobile charging designs into new segments including laptops, AV equipment, and even home appliances and electric vehicles. Traditional Qi wireless power is limited by distance (usually 5 mm), and maximum power (usually up to 30 W). E2WATT technology reaches up eight times further (to 40 mm) and delivers up to 300 W - a real breakthrough for inductive standards. E2WATT wireless technology is powered directly from AC mains, without the need for an external power supply. The single-stage hybrid design minimizes losses compared with conventional double-stage wireless technologies to deliver significantly increased peak efficiencies of up to 95%. "We developed the entire E2WATT wireless platform, from the concept to proprietary architecture and firmware, in order to overcome the limitations of standard AC power adapters and Qi wireless chargers, multiplying the number of applications and the usability of products based on Qi technology," said Igor Spinella, CEO and founder of Eggtronic. "The industry-changing performance of E2WATT is enabled by the high-speed gallium nitride – or GaN – semiconductor technology used in GaNFast power ICs," added Stephen Oliver, VP Corporate Marketing at Navitas Semiconductor. "The Eggtronic team realized the limitations of legacy silicon chips and early discrete GaN with complex circuits and many discrete components. GaNFast power ICs are easy-to-use, 'digital-in, power-out' circuit building blocks which meant the expert team in Modena could focus on their proprietary, high-speed E2WATT topology and achieve a very fast time to market."

Module Market Leader announces Partnership with Berlin-based Business Development Specialist
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Learn more:
foxypower.com
  • Industry News
  • 2021-05-30

Power module market leader Vincotech has teamed up with Berlin-based Foxy Power, a business development company specializing in innovative power electronics. This newly forged alliance aims to maximize the value of Vincotech products, help customers optimize their products, and make the most of Foxy Power's strong industry network. Both companies bring their strengths to the table: Foxy Power excels at identifying unique value propositions for building strategic partnerships. Vincotech, known for its flexibility and reliability, designs and builds power modules for motion control, renewable energy, and power supply applications.

Technology for 150V GaN HEMT Devices
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Learn more:
rohm.com
  • Product Release
  • 2021-05-27

ROHM developed an 8V gate breakdown voltage (rated gate-source voltage) technology for 150V GaN HEMT devices – optimized for power supply circuits in industrial and communication equipment. Existing GaN devices with a withstand voltage of 200V or less typically have a rated gate-source voltage of 6V with respect to a gate drive voltage of 5V, resulting in an extremely narrow voltage margin of just 1V. Exceeding the rated voltage can cause reliability problems such as degradation and destruction, plus the gate drive voltage requires high accuracy control, which has been a major obstacle to the widespread application of GaN devices. In response, ROHM succeeded in raising the rated gate-source voltage from the typical 6V to 8V by adopting an original structure. This triples the voltage margin during device operation, so even if a voltage overshoot exceeding 6V occurs during switching, the device will not degrade, contributing to higher reliability of the power supply circuit. ROHM's GaN device utilizes a versatile package that delivers superior heat dissipation with a proven track record for reliability and mountability. This enables easy replacement of existing silicon devices and simplifies handling during the mounting process. Furthermore, using copper clip junction packaging technology reduces parasitic inductance by 55% over conventional packages, maximizing device performance when designing circuits for high frequency operation.

2W Bipolar Output SMT DC-DC Converters
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Learn more:
murata.com
  • Product Release
  • 2021-05-26

Murata has added to its range of advanced power solutions, with a series of surface mount DC-DC converters. Comprised of 9 different models, the lightweight units in the MGJ2 series each have a 2W power rating and are supplied in compact, low-profile form factor modules with 19.49mm × 14.99mm × 4.39mm dimensions. They are intended to accompany the IGBT and SiC-based MOSFET high-voltage gate drivers used in industrial, renewable energy and mobility applications. Available in input versions that accommodate the commonly-used 5V (in development), 12V and 15V voltage rails, they feature +15V/-5V, +15V/-9V and +20V/-5V bipolar outputs. The MGJ2 DC-DC converters exhibit an ultra-low isolation capacitance of just 3pF (typical). This helps them to mitigate the coupling of transients across the isolation barrier and prevent EMI issues from occurring due to circulating currents generated by high frequency signals. Their characterised partial discharge performance means that elevated levels of operation can be maintained despite the demanding nature of the high-voltage applications they will be used in. Likewise, the common-mode transient immunity (CMTI), which exceeds 200kV/µs, allows them to deal with high switching frequencies.

350kW Planar Transformer
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Learn more:
paytongroup.com
  • Product Release
  • 2021-05-26

A high power design using 2 power sections of 175kW each for a total of 350kW output power. The topology is a full bridge with -55°C to 150°C operation. Power dissipation is less than 1400Watts with over 99.0% efficiency. Input voltage range is 700 to 900Vdc with output at 625V and 560Arms. Different terminal configurations can be made for a wide range of input and output voltages. Operating frequency is 50kHz with less than 1uH of leakage inductance. Is designed to be placed on a cooling plate for maximum mechanical and thermal performance. Size is L:400mm, W:400mm, H:70mm.

Hardware-based Field-oriented Control and IO-Link Communication
  • Product Release
  • 2021-05-26

TRINAMIC Motion Control introduces an open-source, fully integrated reference design that simplifies the development of industrial robotic end-of-arm tooling (EoAT). The TMCM-1617-GRIP-REF reference design integrates hardware-based field-oriented control (FOC) and three communication ports to shrink the design size of electronic robotic grippers by three times, while reducing development time by half. The reference design features Maxim Integrated's industrial-grade MAX22000 high-precision configurable analog input/output and MAX14906 quad-channel digital input/output to adjust the multiple modes of the Trinamic TMCM-1617 single axis servo driver. Designed to fit within the standard form-factor used for EoAT grippers, the TMCM-1617-GRIP-REF reference design supports industrial EtherCAT, IO-Link or RS-485 communication, provides software-programmable analog and digital input/outputs, and can be configured using the Trinamic Motion Control Language Integrated Development Environment (TMCL-IDE). This combination of reference design and software platform provides a simple way for design engineers to rapidly deliver a complete EoAT solution. "There's a need for industrial automation engineers to rely on a toolkit that simplifies the development and commissioning of robotic EoAT solutions," explains Jeff DeAngelis, Vice President of Industrial Communications at Maxim. "The TMCM-1617-GRIP-REF reference design simplifies the tooling development process, allowing automation engineers to focus their time on developing advanced, real-time EoAT solutions that embody the true meaning of delivering intelligence at the edge."

International Engineering Competition
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Learn more:
rohde-schwarz.com
  • Industry News
  • 2021-05-26

This year, the entire competition was held online by Rohde & Schwarz. The competition is aimed at students of electrical engineering, particularly communications engineering, as well as IT, who can participate in trending high-tech topics with practical relevance to companies. The challenge this year was to create a smart software solution to optimize a signal analysis. Engineers who pay very close attention to signal data analysis are highly sought-after in the telecommunications industry. Errors are unacceptable, and inaccuracies are just as unwelcome. Highly reliable signal generators and analyzers are part of day-to-day work in the industry and involve a large number of parameters that can be configured manually. What would the situation for the engineering teams look like if a program code could configure the parameters automatically? This was the question tackled by the 86 students taking part in this year's Engineering Competition. During the competition, they received mobile radio signals to be analyzed using a code to develop in Phython. They were provided with the R&S VSE vector signal explorer software, a state-of-the-art solution giving them a wide variety of analysis tools to evaluate and troubleshoot digitally modulated signals. The students who wrote the best Python program for the automated identification of signal parameters qualified for a more advanced challenge in the finals. The code submitted was evaluated based on signals that were unknown to the student teams.

Power DC-Link Film Capacitor for Automotive and Green Energy Applications
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Learn more:
kemet.com
  • Product Release
  • 2021-05-26

KEMET announces its C4AK high temperature, power film DC-Link capacitor designed for continuous operation up to 1,000 hours at 135°C. The C4AK series joins the C4AU (harsh environment) and C4AQ-P (125°C) family of power DC-Link film capacitors. These series offer higher capacitance density, DC voltage, and DC ripple current capabilities with an extended operational lifetime at high temperatures in harsh environments. Ideal for use in automotive, green, and industrial applications, these metallized film capacitors are well suited for DC filtering and DC-Link in solar, fuel cells, inverters, storage energy systems, automotive (Bi) On-Board Charger, Wireless Power Transfer (WPT), DC/DC, heaters, and welding equipment. Due to its enhanced performance design, the KEMET DC-Link C4AK film capacitor provides a superior alternative for current capacitor solutions. Design features include a radial box style for PCB mounting, miniaturization, low profile, 2 – 4 leads, and fewer capacitors needed in parallel to meet the required peak and ripple current. The C4AK film capacitor surpasses the extreme conditions of the standard automotive (AEC-Q200) requirements for film technology in severe humidity/temperature conditions. Compared to competitor technologies, the C4AK series has greater performance with a lifetime of 4,000 hours at 125°C and 1000 hours at 135°C in harsh environmental conditions. The C4AK DC-Link film capacitor's extended life at high temperatures provides designers an ideal miniaturized, reduced component count solution over conventional film capacitors, particularly in Wide Band Gap high frequency, high current systems.

48 V to 12 V LLC Power Conversion Demonstration Board
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Learn more:
epc-co.com
  • Product Release
  • 2021-05-25

EPC announces the availability of the EPC9149, a 1 kW-capable 48 V input to 12 V output LLC converter that operates as a DC transformer with a conversion ratio of 4:1. This demonstration board features the 100V EPC2218 and 40 V EPC2024 GaN FETs. The board is the size of DOSA-standard ?th brick format, measuring only 58.4 mm by 22.9 mm. This is considerably smaller than alternative silicon-based solutions that are generally sized in the ¼th brick format, or twice as large, for 1 kW of output power. The total thickness of the converter without heatsink is only 10 mm. To make it simple for a power supply designer to easily replicate this design, all supporting materials for this board including schematic, bills of materials, and Gerber files are available on the EPC website. The high-power density, 1226 W/in3, is achieved thanks to EPC GaN FET technology. eGaN FETs enable high switching frequency, in this case 1 MHz, and they are very small, ? of the size of silicon MOSFETs with similar on resistance. The EPC9149 board features four 100 V rated EPC2218 eGaN FETs for the primary rectification, and eight 40 V rated EPC2024 eGaN FETs for the secondary synchronous rectification. The board also features a 4 mm x 4 mm Microchip dsPIC33CKMP102T-I/M6 for flexibility, configuration, communications, and programmability.

Tier 1 Semiconductor Automotive Supplier GaN Power Electronic Program
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Learn more:
oxinst.com
  • Industry News
  • 2021-05-25

Oxford Instruments Plasma Technology announced that a leading German semiconductor manufacturer to the automotive industry has selected its PlasmaPro100 Cobra system for the development of next generation GaN power electronic devices. The production-proven system allows for rapid change between wafer sizes up to 200 mm and the cost of ownership is one of the lowest in the market. The PlasmaPro100 Cobra system will be incorporated into the R&D section and will be used for development of GaN power devices. GaN power devices are gaining market share in fast charger applications and offer benefits in Electric Vehicle power management systems. We continue to see very encouraging signals in the form of increasingly proactive customer engagement and clear market preparation and positioning activities from significant industry players for the emerging Wide Band Gap power electronic market. "Our Atomic Scale Processing etch solution being selected by this world leading manufacturer for their GaN power electronics programme is an important strategic win for Oxford Instruments Plasma Technology" comments Klaas Wisniewski, Plasma Technology's Strategic Business Development Director, who also added: "The GaN based power electronic market is very dynamic with improvements to both performance and cost expected at each design iteration. This reiterates the importance of our strategy to focus on atomic scale processing solutions such as atomic layer deposition (ALD) and atomic layer etching (ALE). We are pleased that such a leading automotive semiconductor company recognizes the benefits our solutions deliver.

Samsung's First MOSFET-based Refrigerator Inverter Design
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Learn more:
infineon.com
  • Industry News
  • 2021-05-25

Infineon Technologies supplied Samsung Electronics with power devices to couple the highest energy efficiency with lowest audible noise. They have been integrated in Samsung's brand new one-door fridge and French Door Fridge inverterized refrigerator. Inverterization is an emerging DC to AC conversion trend in contemporary inverter designs. It helps the application run more quietly and smoothly while the average power consumption is reduced compared to a traditional on/off control. To meet Samsung's requirements towards improved efficiency and lower system cost together with a lower noise level, the Digi Touch Cool, Curd Maestro features multiple power solutions from Infineon – EiceDRIVER gate-driver IC, CoolSET Gen 5 for AC/DC conversion, and 600 V CoolMOS PFD7 for compressor drives. This is Samsung's first refrigerator design that uses discrete devices instead of power modules in the compressor. The 600 V CoolMOS PFD7 superjunction MOSFETs come with a best-in-class body diode allowing for improved soft-recovery index and the industry's fastest reverse recovery time (t rr), making them a perfect choice for home appliance motor drives. Compared to module-based designs, using MOSFETs enables lower energy consumption especially at light-load conditions and an efficiency increase as of 1.7 percent. In addition, this innovative approach allows for a heatsink-less design, a 10 percent reduction in system cost and a longer refrigerator lifetime.

One-step Ball Grid Array Ball-attach Flux
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Learn more:
indium.com
  • Product Release
  • 2021-05-25

Indium Corporation continues to expand its flux portfolio with WS-823-a proven, one-step ball grid array (BGA) ball-attach flux designed to eliminate the costly and warpage-inducing prefluxing step, especially on Cu-OSP substrate. While the standard ball-attach process requires two steps, especially on a Cu-OSP substrate, WS-823 is a halogen-free, water-wash flux designed for a single-step ball-attach process that eliminates the prefluxing step in order to create reliable ball-to-pad joints.
WS-823 provides:
-Tackiness suitable for holding solder spheres in place during reflow
-Excellent solderability on a wide range of surfaces, including AuNi and oxidized Cu-OSP
-Uniform pin transfer over extended periods, eliminating changes in joint quality over time and uneven deposit sizes, which can lead to "missing ball"
-A formula engineered for low-voiding, thereby increasing joint strength
-Good cleanability with room temperature DI water, avoiding the formation of white residue

Last Call for Scientific Papers
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Learn more:
edpc.eu
  • Event News
  • 2021-05-24

The Electric Drives Production Conference (E|DPC) 2021 represents an outstanding platform for the exchange of developers, researchers and users of electric drives. We would be very delighted if you present your latest technical expertise in front of professionals from science and industry. Ten days are left to submit your scientific abstract until May 31, 2021. To ensure a reliable planning for everyone, the E|DPC will take place as a virtual event from December 7 to 9, 2021. E|DPC 2021 offers the possibility to submit different types of contributions. The industrial contribution is an excellent platform to promote new technologies without having to prepare a full paper. Furthermore, scientific contributions are intended for scientists to present their latest research findings in front of peers and to influence industry representatives. All scientific fullpapers that pass the review process will be part of the proceedings of E|DPC. The papers will be indexed by Scopus and Google Scholar. Since the launch in 2011 we publish every year with IEEE and in 2021 this is intended as well. In contrast, the industrial contributions will be made available in the download area of the conference. It is necessary to upload an abstract for each kind of contribution. After accepting the abstracts uploaded, authors of scientific contributions will be asked to upload a full paper being reviewed by the international program committee before acceptance. Authors of industrial contributions will be requested to upload the slides of their presentation shortly before the conference.

SEMICON Southeast Asia Themed "Power Innovation - 5G and Beyond"
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Learn more:
semi.website
  • Event News
  • 2021-05-24

SEMICON Southeast Asia 2021 (23-27 August 2021, Hybrid Event) will gather industry visionaries and experts to highlight the latest developments, innovations, and trends in segments of electronics including Smart Manufacturing, Smart Mobility, Smart Data, AI and 5G as technology continues to reshape the way people work and live.


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Transition to 200mm Silicon Carbide WafersSTMicroelectronics announced it has manufactured t...9358Industry NewsTransition to 200mm Silicon Carbide WafersSTMicroelectronics announced it has manufactured the first 200mm (8-inch) Silicon-Carbide (SiC) bulk wafers for prototyping next-generation power devices from its facility in Norrköping, Sweden. The transition to 200mm SiC wafers marks an important milestone in the capacity build-up for ST's customer programs in automotive and industrial sectors and will consolidate ST's lead in the disruptive semiconductor technology that allows for smaller, lighter, and more efficient power electronics with a lower total cost of ownership. Among the first in the world, ST's initial 200mm SiC wafers are also very high quality, with minimal yield-impacting and crystal-dislocation defects. The low defectivity has been achieved by building on the excellent know-how and expertise in SiC ingot growth technology developed by STMicroelectronics Silicon Carbide A.B. (formerly Norstel A.B., which ST acquired in 2019). In addition to meeting the quality challenge, the transition to 200mm SiC substrates requires a step forward in manufacturing equipment and the overall support ecosystem performance. ST, in collaboration with technology partners covering the entire supply chain, is developing its own 200mm SiC manufacturing equipment and processes. ST currently manufactures its leading-edge, high-volume STPOWER SiC products on two 150mm wafer lines in its fabs in Catania (Italy) and Ang Mo Kio (Singapore) and performs assembly and test at its back-end sites in Shenzhen (China) and Bouskoura (Morocco). This milestone comes as part of the Company's planned move to more advanced, cost-efficient 200mm SiC volume production. This transition is within the Company's ongoing plan to build a new SiC substrate plant and source over 40% of its SiC substrates internally by 2024.27.07.2021 17:00:00Julnews_2021-08-01_12.png\images\news_2021-08-01_12.pnghttps://newsroom.st.com/media-center/press-item.html/t4380.htmlst.com
Ocean Wave Energy HarvestingThe ability to harness ocean wave energy is a rapi...9354Industry NewsOcean Wave Energy HarvestingThe ability to harness ocean wave energy is a rapidly evolving field that marine engineers are refining to provide reliable, cost-effective maritime energy generation and storage while enabling new forms of offshore data and communication services. Columbia Power Technologies (C-Power) is helping to expand the marine economy by providing reliable, cost-effective energy generation and storage, data and communication services for offshore assets. C-Power Autonomous Offshore Power Systems (AOPS) capture mechanical wave energy and convert it into usable power for a wide range of oceanic applications such as offshore oil and gas exploration and production, offshore carbon sequestration, oceanographic research, aquaculture and homeland defense. With the development of AOPS, C-Power opened the door to un-imagined applications by supplying an autonomous, environmentally friendly, ocean-borne power source capable of doubling as a communications conduit. SeaRAY enhances power efficiency and data communication. The latest AOPS platform, known as the SeaRAY, is key to the near-term focus of C-Power to produce power systems that generate 10W to 1MW from ocean waves. To achieve its goals at the lower end of the power spectrum, C-Power created a SeaRAY AOPS design with a high power-to-weight ratio using power conversion technology from Vicor Corporation. The small design footprint enhances mobility and commercial viability, making SeaRAY easier to deliver and set up, saving tens of thousands of dollars in daily operating costs. "We really needed wide-range DC-DC, something that we could control and regulate as we're converting pulsed ocean wave power into a semi-stable DC bus," said Joe Prudell, a C-Power senior R&D electrical engineer. "This is extremely challenging. Being able to do that at various power levels using Vicor power modules really is an advantage."27.07.2021 13:00:00Julnews_2021-08-01_8.png\images\news_2021-08-01_8.pnghttp://www.vicorpower.com/press-room/c-powervicorpower.com
Replace Silicon IGBTs with Silicon Carbide PowerMicrochip Technology announced the expansion of it...9359Product ReleaseReplace Silicon IGBTs with Silicon Carbide PowerMicrochip Technology announced the expansion of its silicon carbide portfolio with a family of high-efficiency, high-reliability 1700V silicon carbide MOSFET die, discrete and power modules. Microchip's 1700V silicon carbide technology is an alternative to silicon IGBTs. The earlier technology required designers to compromise performance and use complicated topologies due to restrictions on switching frequency by lossy silicon IGBTs. In addition, the size and weight of power electronic systems are bloated by transformers, which can only be reduced in size by increasing switching frequency. Features include gate oxide stability where Microchip observed no shift in threshold voltage even after an extended 100,000 pulses in repetitive unclamped inductive switching (R-UIS) tests. R-UIS tests also showed excellent avalanche ruggedness and parametric stability and with gate oxide stability, demonstrated reliable operation over the life of the system. The degradation-free body diode can eliminate the need to use an external diode with the silicon carbide MOSFET. A short-circuit withstand capability comparable to IGBTs survives harmful electrical transients. A flatter RDS(on) curve over junction temperature from 0 to 175 degrees Celsius (C) enables the power system to operate at greater stability than other silicon carbide MOSFETs that exhibit more sensitivity to temperature.27.07.2021 06:30:00Julnews_2021-08-01_13.jpg\images\news_2021-08-01_13.jpghttps://www.microchip.com/en-us/about/news-releases/products/replace-silicon-igbts-with-industry-s-most-rugged-silicon-carbidmicrochip.com
PCIM Asia 2021 Floor Area to Grow by 50%The leading fair for power electronics in Asia wil...9355Event NewsPCIM Asia 2021 Floor Area to Grow by 50%The leading fair for power electronics in Asia will be bigger than ever, taking place at the Shenzhen World Exhibition & Convention Center from 9 – 11 September 2021, PCIM Asia 2021 will feature additional floor space for exhibitors, representing an increase of 50% from the previous year. The additional space will enable more exhibitors and visitors to attend the fair and increase the chances of successful business cooperation. This year's fair promises to be larger than the 2020 edition, with the additional floor space welcoming exhibitors both new and old, along with a variety of forums, conferences and events taking place, exploring the latest trends and innovations within power electronics, intelligent motion, renewable energy and energy management. PCIM Asia 2021 will thus provide a platform for the industry to trade and connect as the economy recovers in the post-Covid-19 era. PCIM Asia will once again be supported by some of the leading power electronics companies in the industry. Apart from the strong line up of returning exhibitors, the 2021 fair will see a host of new exhibitors attending and showcasing their latest innovative products and solutions. To further enhance the experience for the fair's visitors and exhibitors, PCIM Asia will once again feature a range of thematic zones which shine a light on key areas of the development of power electronics. These thematic zones include the E-mobility Pavilion, Energy Storage Pavilion, Poster Session Area (part of the Conference) and University Zone.26.07.2021 14:00:00Julnews_2021-08-01_9.jpg\images\news_2021-08-01_9.jpghttps://pcimasia-expo.cn.messefrankfurt.com/shanghai/en/press/press-releases/2021/PCIM21_PR4.htmlpcimasia-expo.cn
Power Solutions for Medical ApplicationsUltralife has been manufacturing critical power so...9367Product ReleasePower Solutions for Medical ApplicationsUltralife has been manufacturing critical power solutions for fixed and portable medical technology (MedTech) worldwide for several decades. It is from this experience that Ultralife, alongside the technical capabilities of its subsidiaries Accutronics and SouthWest Electronic Energy, that the company has developed its X5 medical cart power system and enhanced U1 smart MedTech batteries. The X5 medical cart power system is a unique development from Ultralife that allows medical cart integrators to directly power computers, monitors, printers, and other peripherals with energy supplied from one or two hot-swappable batteries. Named by Ultralife as the URB-X5, these 276Wh Lithium Iron Phosphate rechargeable smart batteries power an internal pure-sine-wave inverter to output 120VAC 60Hz (150W). URB-X5 batteries can be charged onboard the power system or removed, from specially designed cradles, for charging. The innovative connector system and wide grab-handle means that batteries can be inserted into the cradles in either direction, making the swap-out quick and easy. An internal bridging battery allows for uninterrupted operation while batteries are swapped. Two-bay smart chargers are available, that can be either wall or desk mounted, recharging the batteries in less than six hours. There are status indicators on the chargers, batteries and power system, conveying a variety of information such as state-of-charge. The design considerations do not end there, as the battery enclosure is constructed entirely of aluminium for light weight and high strength.23.07.2021 14:30:00Julnews_2021-08-01_21.jpg\images\news_2021-08-01_21.jpghttps://www.ultralifecorporation.com/default.asp?LINKNAME=NEWS&News_ID=46ultralifecorporation.com
Cooperation for Ebike Drive Systems in the European MarketThe BMZ Group and Panasonic Cycle Technology will ...9357Industry NewsCooperation for Ebike Drive Systems in the European MarketThe BMZ Group and Panasonic Cycle Technology will join forces in the future in the European market. Panasonic Cycle Technology developed their first e-powered bike as early as 1979, launched current pedelec type of e-bike on the market in Japan in 1996 and has since been able to gain high market shares, especially in Japan, thanks to its high-performance e-bike components. Next to joint efforts for dedicated service and support, the cooperation will include the common equipping of OEMs with e-bike systems consisting of BMZ's battery solutions combined with Panasonic Cycle Technology's motor and display. Synergies can also be used effectively here, the BMZ Group can rely on an existing concept with international service points and partners. For many years, Panasonic Cycle Technology has been developing high-performance motors for different requirements, which are installed in well-known bicycle brands. From 60 Nm power, the GX Power to the GX Ultimate with 90 Nm, all power levels are covered - for city to mountain bikes. The appropriate range of compatible e-bike batteries from the BMZ Group, such as the recently introduced and most powerful integral e-bike battery of its time - BMZ V10 Intube with 725 Wh - were one more argument in favour of installing common systems in future.22.07.2021 16:00:00Julnews_2021-08-01_11.png\images\news_2021-08-01_11.pnghttps://www.bmz-group.com/index.php/en/news/press-enbmz-group.com
For Battery Charging and Power Supply: Compact Single-Chip PMIC SolutionEfficient reliability when size matters: the Nordi...9365Product ReleaseFor Battery Charging and Power Supply: Compact Single-Chip PMIC SolutionEfficient reliability when size matters: the Nordic nPM1100 is a dedicated power management IC (PMIC) with configurable dual-mode buck regula­tor and integrated battery charger. It is designed as a complementary component to Nordic's nRF52 and nRF53 series of system-on-chips (SoCs) to ensure reliable power supply and stable operation while maximising battery life through high efficiency and low quiescent currents. It can also be used as a generic PMIC device for any other suitable application. The extremely compact (2.075 x 2.075 mm) WLCSP package is ideal for applications in wearables, connected medical devices, smart home sensors and controls, remote controls and game controllers, and other size constrained applica­tions. The integrated battery charger is designed to charge lithium-ion and lithium-polymer batteries to a selectable termination voltage of 4.1 or 4.2 V and supports cell chemistries with a nominal voltage of 3.6 or 3.7 V respectively. The unit features thermal battery protection and automatic selection of three charging modes: automatic trickle charge, constant current and constant voltage. The maximum charging current is selectable via a resistor from 20 mA up to 400 mA. The charger also has a discharge current limiter and is JEITA compliant. The high-efficiency step-down regulator can deliver up to 150 mA of current at a selectable output voltage of 1.8, 2.1, 2.7 or 3.0 V. It features soft start and automatic transition between hysteresis and PWM modes. It also enables a forced PWM mode to ensure clean operation.22.07.2021 12:30:00Julnews_2021-08-01_19.jpg\images\news_2021-08-01_19.jpghttps://www.rutronik24.com/product/nordic/npm1100-ek/15987200.html?fbclid=IwAR2psO8sid0k5xt_PuhoawJ_rutronik24.com
Formula E Team Readies for Indoor/Outdoor Race in LondonThe Mouser Electronics-supported Formula E racing ...9353Industry NewsFormula E Team Readies for Indoor/Outdoor Race in LondonThe Mouser Electronics-supported Formula E racing team will face a challenging road course through London's Royal Docks at the London E-Prix on July 24 and 25. DRAGON / PENSKE AUTOSPORT team drivers Joel Eriksson and Sérgio Sette Câmara will race around - and for the first time ever, inside - the ExCeL London exhibition center. The race also marks the return of Formula E all-electric street racing to the U.K. capital after a five-year absence. Mouser is partnering with the team throughout the 2020–21 ABB FIA Formula E Championship racing season, in collaboration with TTI, Inc. and valued suppliers Molex and AVX. This is the seventh-straight year that Mouser and Molex have sponsored Formula E racing. The Formula E series features cars that are powered solely by electricity and represent a vision for the future of the motor sports industry, serving as a framework for research and development around zero-emission motoring. The Gen2 cars offer a huge step forward in electric vehicle racing technology, with maximum power of 250 kW and speeds up to 280 km/h. Racing is all about speed and endurance, and racing sponsorships are an innovative way for Mouser to communicate its performance-driven business model and promote the newest technologies from its manufacturer partners.22.07.2021 12:00:00Julnews_2021-08-01_7.jpg\images\news_2021-08-01_7.jpghttps://eu.mouser.com/newsroom/publicrelations-formulae-london-eprix-2021final/eu.mouser.com
Comprising GaN Power FET with Monolithically Integrated DriverTagore Technology announces the introduction of th...9362Product ReleaseComprising GaN Power FET with Monolithically Integrated DriverTagore Technology announces the introduction of the TP44200NM 650V Gallium Nitride Power FET with integrated driver IC in a compact 22 pin, 5mm x 7mm QFN package. The device offers low RDS(ON) of 180mOhm and fast switching to deliver a highly efficient, low-cost power solution in a small footprint for a variety of applications requiring high power density including USB-PD charger, server and telecom AC-DC power supplies, power factor correction (PFC) converter. The TP44200NM Power IC has 650V E-mode GaN Power FET, driver, UVLO and high dv/dt immunity with and without supply - all monolithically integrated on GaN-on-Si substrate. The device has low propagation delay for high frequency application and slew rate control through external resistor.22.07.2021 09:30:00Julnews_2021-08-01_16.jpg\images\news_2021-08-01_16.jpghttp://www.tagoretech.com/page.php?page-id=25tagoretech.com
Single-Stage Flyback Controllers with Constant Voltage OutputCost-effective dimmable and intelligent LED system...9366Product ReleaseSingle-Stage Flyback Controllers with Constant Voltage OutputCost-effective dimmable and intelligent LED systems are expected to increase the market share disproportionately in the coming years. Introducing the ICL8800, ICL8810 and ICL8820 single-stage flyback LED controllers for constant output voltages, Infineon Technologies addresses the need of LED driver manufacturers in this regard. The ICs meet the necessary performance requirements for LED lighting applications, such as LED drivers and luminaires up to 125 W, smart lighting, and emergency luminaire. Outside this market segment, adapters and chargers, flat TVs, all-in-one PCs and monitors up to 125 W profit from the ICL88xx family. All three variants offer benchmarking performance for power factor correction and total harmonic distortion at full-load and low-load conditions, thus enabling platform design and window drivers. They are optimized as secondary-side regulated (SSR) constant voltage (CV) output flyback controllers and are also well suited for primary-side regulation (PSR). To achieve optimum efficiency and low electromagnetic interference (EMI) without compromising light quality, they are featuring critical conduction mode (CCM) and quasi-resonant mode (QRM) with smart valley hopping. The ICL88xx family offers an external start-up circuit control signal for more flexibility and a cost-optimized bottom-up platform design for many applications. It has a comprehensive set of protection features, including a power limitation and secondary side over-voltage protection. In addition, the devices require a minimum number of external components, leading to outstanding cost-effectiveness compared to existing solutions. The gate driver current enables designs up to 125 W with state-of-the-art MOSFETs. The system performance and efficiency can be further optimized using Infineon's CoolMOS P7 power MOSFETs.21.07.2021 13:30:00Julnews_2021-08-01_20.jpg\images\news_2021-08-01_20.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2021/INFPSS202107-086.htmlinfineon.com
Fast Recovery Epitaxial DiodesTaiwan Semiconductor announces the availability of...9363Product ReleaseFast Recovery Epitaxial DiodesTaiwan Semiconductor announces the availability of the PU1xMx / PU2xMx families of fast recovery epitaxial diodes. These high-reliability (AEC-Q101 qualified) FREDs offer optimized switching speed vs. reverse recovery time. Their soft reverse recovery results in lower noise switching while achieving low losses and increased efficiency. The Micro SMA package heat spreader contacts provide excellent heat transfer. "TSC's FRED devices offer an unparalleled combination of small footprint, fast switching speed, low parasitic capacitance and low leakage," said Vice President, TSC Products, Sam Wang. "In terms of price, performance and package, our FREDs set a new benchmark for the industry." Applications include automotive alternator charging regulators in 12-, 24 to 28- and 48-Volt systems; POE power, protection and blocking circuitry; general purpose switching power, snubber circuits, antiparallel diodes in high frequency switching circuits; freewheeling diode in converters, chargers and motor control circuits.20.07.2021 10:30:00Julnews_2021-08-01_17.jpg\images\news_2021-08-01_17.jpghttps://www.taiwansemi.com/en/products/details/PU1BMHtaiwansemi.com
Joining PowerAmerica InstituteHeraeus Electronics joins PowerAmerica Institute t...9348Industry NewsJoining PowerAmerica InstituteHeraeus Electronics joins PowerAmerica Institute to advance the use of wide bandgap (WBG) semiconductors. The technological expertise of Heraeus Electronics and the industry connections of Power America Institute will accelerate the development of new materials and support the expansion of the Power Electronics industry. The collaboration will result in bringing next generation silicon carbide and gallium nitride power electronics to markets faster, reducing cost and risk factors associated with new generation technologies. An organization that brings together the semiconductor manufacturers and the companies that use semiconductor power electronics in their products, PowerAmerica Institute is well placed as an information hub. With the backing of the U.S. Department of Energy and the engagement of top researchers, knowledge and processes can be provided to educate the American workforce and provide more innovative product designs. "By working in collaboration with Heraeus Electronics, we can maximize device performance without the compromise of cost", says Executive Director Victor Veliadis from PowerAmerica Institute. Heraeus Electronics offers matched materials as well as latest equipment to support customer developments by assembling prototypes and test modules according to the highest standards. David Malanga, Director of Marketing and Sales for Heraeus Electronics in the Americas, adds: "With our deep understanding of the power electronics market and PowerAmerica Institute's connections, we can assist in driving future developments, employee education, and market direction for a stronger industry tomorrow."20.07.2021 07:00:00Julnews_2021-08-01_2.jpg\images\news_2021-08-01_2.jpghttps://www.heraeus.com/en/het/company_het/press_and_news_het/2021_het/07_heraeus_electronics_joins_poweramerica_institute.htmlheraeus.com
DC Link Capacitors for Harsh EnvironmentsCDE's BLH series of DC-Link capacitors have been d...9369Product ReleaseDC Link Capacitors for Harsh EnvironmentsCDE's BLH series of DC-Link capacitors have been designed and tested to exceed the industry's most stringent requirements for high humidity, vibration testing, and thermal cycling. The Temperature, Humidity at Bias (THB) test exposes parts to the harsh conditions of 85 °C at 85% relative humidity with rated voltage applied. This demanding test simulates the harsh operating conditions encountered in many commercial and industrial inverter applications. Such conditions can cause non-THB rated capacitors to fail early from moisture penetration. While most capacitor makers validate their THB components for 1,000 hours under these conditions, CDE's BLH series has been validated for 1,500 hours. Utilizing the most advanced materials and processes, these board-mounted capacitors have been designed and tested to meet the rigors of automotive AEC-Q200 testing. Their solvent-resistant plastic case and epoxy encapsulation system are UL Recognized and meet IEC61071. Tin-plated copper RoHS-compliant terminations ensure excellent solderability. With their superior resistance to moisture and robust design, these capacitors are well suited for solar, wind, UPS, EV chargers, and other inverter applications that may be subjected to wide-ranging environmental conditions. The series is optimized for DC link applications in medium to high-power inverters. Capacitance ranges from 1.0 to 170 µF at 450-1,200 Vdc, with high rms ripple current ratings up to 36 Arms. When operated at a 70 °C hot-spot temperature with rated voltage applied, their life expectancy is 100,000 hours.19.07.2021 16:30:00Julnews_2021-08-01_23.jpg\images\news_2021-08-01_23.jpghttps://www.cde.com/news/2021/7/type-blhcde.com
Introducing RF LDMOS Power TransistorsSTMicroelectronics is adding a broad range of devi...9361Product ReleaseIntroducing RF LDMOS Power TransistorsSTMicroelectronics is adding a broad range of devices to the STPOWER family of LDMOS transistors, which comprises three different product series optimized for RF power amplifiers (PAs) in a variety of commercial and industrial applications. Featuring high efficiency and low thermal resistance and packaged to handle high RF power, STPOWER LDMOS devices combine a short conduction-channel length with a high breakdown voltage. These characteristics permit a cost-effective solution with low power consumption and high reliability. Expanding the range of applications that can be addressed, the STPOWER LDMOS IDCH and IDDE series are 28V/32V common-source N-channel enhancement-mode lateral field-effect RF power transistors. IDCH devices provide output power from 8W to 300W and are specifically designed for applications up to 4GHz, including 2.45GHz industrial, scientific, and medical (ISM), wireless infrastructure, satellite communications, and avionics and radar equipment. The LDMOS devices are suitable for all types of modulation formats. The IDDE series contains 10W-700W devices for broadband commercial, industrial, and scientific applications at frequencies up to 1.5GHz. The devices can withstand a load VSWR (voltage standing wave ratio) of 10:1, through all phases. They are suitable for all typical modulation formats, and for most classes of RF PA operation including Class A, Class AB, and Class C. Their high efficiency minimizes the energy needed to deliver the required output power, resulting in lower operating costs and reduced heat dissipation thereby simplifying thermal management and enabling more compact systems.19.07.2021 08:30:00Julnews_2021-08-01_15.jpg\images\news_2021-08-01_15.jpghttps://newsroom.st.com/media-center/press-item.html/n4342.htmlst.com
International Electric Drives Production Conference (E|DPC)The conference is intended for researchers, produc...9356Event NewsInternational Electric Drives Production Conference (E|DPC)The conference is intended for researchers, product developers, production experts, purchasers and users of electric drives. To ensure a reliable planning for everyone, the E|DPC will again take place as a virtual event from December 7 to 9, 2021. The preliminary program of the conference is now available.16.07.2021 15:00:00Julnews_edpc.png\images\news_edpc.pnghttps://www.edpc.eu/discover/edpc.eu
International Workshop on Integrated Power Packaging (IWIPPThe Power Sources Manufacturers Association (PSMA)...9350Event NewsInternational Workshop on Integrated Power Packaging (IWIPPThe Power Sources Manufacturers Association (PSMA) and IEEE societies - Power Electronics PELS, Electronic Packaging EPS, and Dielectrics and Electrical Insultation DEIS - are sponsoring a free webinar series taking place over three days in the last week in August, 2021. The webinar series is a corridor event made possible by the financial support of the sponsors with the intention of bridging the gap from the 2019 IWIPP workshop to the 2022 IWIPP workshop. The IWIPP (IWIPP) corridor webinar series will consist of three (3) webinar sessions, each lasting two-and-a-half (2.5) hours. Each session will address a different set of applications and technology advances. The sessions will be on Monday, August 23rd; Wednesday, August 25th; and Friday, August 27th. Each session will begin at 7:00 a.m. CDT (2:00 p.m. CEST).  There will be three presentations per session. Each presentation will be approximately twenty-five minutes in length. There will be a panel-style question-and-answer session at the end of each webinar event. Each webinar session will remain open until the presenters answer all the questions submitted. Registration for the corridor webinar is now open Registration – IWIPP. The webinar series will be free of charge but the number of attendees that can register will be limited; therefore, we advise you to register early.16.07.2021 09:00:00Julnews_IWIPP.png\images\news_IWIPP.pnghttp://iwipp.org/conference/full-program/iwipp.org
Mobile Fast Charging with Gallium Nitride (GaN) Power ICsNavitas Semiconductor announced that Xiaomi has la...9347Industry NewsMobile Fast Charging with Gallium Nitride (GaN) Power ICsNavitas Semiconductor announced that Xiaomi has launched their third GaNFast charger, a 65W dual-output fast charger. The '65W 1A1C' has a USB-C output up to 65W to power laptops and fast-charge smartphones via USB-PD 3.0, QC and PPS fast-charging protocols, with an extra USB-A output up to 18W to conveniently – and simultaneously – charge another phone or accessory such as headphones. The GaN charger can power the Xiaomi Mi11 from 0% to 100% charge in only 45 minutes. Due to high-speed GaN power ICs, the charger achieves a small size of only 69 cc with folding AC-pins – a 30% reduction vs Xiaomi's previous silicon-based designs – and a world-leading featherweight 104 g for ultimate portability. "We believe that the success of any company comes from continuous technological innovation, corporate social responsibility and the achievement of sustainable development goals," said Mr. Xiang WANG, President and Partner of Xiaomi. "We look forward to a bright future for Navitas." "Xiaomi's openness to new materials and technologies, and its continued commitment to gallium nitride (GaN), demonstrates Xiaomi's recognition of the advantages of GaN devices over traditional silicon devices," said Gene SHERIDAN, CEO of Navitas Semiconductors. "It is a long and successful partnership, introducing a series of world-class chargers, and celebrating mass production milestones, as when we presented Xiaomi with a special award for their receiving the 10,000,000th GaNFast power IC back in November 2020."16.07.2021 06:00:00Julnews_2021-08-01_1.jpg\images\news_2021-08-01_1.jpghttps://www.navitassemi.com/navitas-and-xiaomi-team-up-for-the-third-time-with-world-class-small-size-and-featherweight-mobile-fast-charging/navitassemi.com
Distributors in Europe AwardedTDK honored its best distribution partners in Euro...9351Industry NewsDistributors in Europe AwardedTDK honored its best distribution partners in Europe by presenting them – for the eighth time – with the TDK European Distribution Award 2020. The gold award in the "High-Service Distributors" category went to Mouser Electronics. In the "International Volume Distributors" category, Rutronik Electronics was honored as in the previous year. The best local distributor is the Austrian company EPi Components. Only two other awards were given in the "Local Distributors" category this time: Silver went to Gateway Electronic Components in the UK and Bronze to AVIS KS in Slovakia. "In the past year, during lockdown periods of the pandemic and especially in the aftermath, we have seen that distributor inventory is a major factor for satisfaction of end-customers," says Dietmar Jaeger, Head of TDK's Global Distributor Division. "That's why we raised our requirements and couldn't give out as many awards this year as we would have liked." At the end of 2020, there were already signs of a recovery in global business, followed by a massive upswing and extremely high demand for TDK products in 2021, says Jaeger. Mouser Electronics, in particular, was able to meet the highly increased demand very well and thus best fulfilled the award criteria.15.07.2021 10:00:00Julnews_2021-08-01_5.jpg\images\news_2021-08-01_5.jpghttps://www.tdk-electronics.tdk.com/en/373388/company/press-center/press-releases/press-releases/awards-tdk-honors-best-distributors-in-europe-/2997324tdk-electronics.tdk.com
Heat Sinks for Power ModulesHigh cooling capacity with minimal pressure drop a...9368Product ReleaseHeat Sinks for Power ModulesHigh cooling capacity with minimal pressure drop are convincing features of the new IsoMAXX cold plates from Mersen. The cold plates meet the high demands of modern power electronics and have been specially developed for the latest SiC, GaN or IGBT power modules. Modern converters, transport systems, electric vehicles and alternative energy generators benefit from the increasingly efficient wide bandgap electronics, which are optimised for operation at higher switching frequencies and temperatures and feature a much more compact design. Conventional heat sinks cannot meet these high cooling requirements. That is why Mersen developed IsoMAXX – a revolutionary vacuum brazed cold plate with unique features: The average thermal resistance (Rth) is 6 °C/kW. And at ~600 mbar, the pressure drop is substantially lower than that of all previous models. IsoMAXX cold plates ensure an optimal temperature range for power electronics, in which all single chips and modules on the cold plate remain at the same temperature. IsoMAXX helps development engineers to design solutions with increased efficiency and a minimal footprint: No minimum clearance is required between modules, which allows versatile integration regardless of the number of modules needed for the particular application.13.07.2021 15:30:00Julnews_2021-08-01_22.jpg\images\news_2021-08-01_22.jpghttps://ep-de.mersen.com/en/news/isomaxxep.mersen.com
Bidirectional DC Power Supplies and Regenerative DC LoadsIn response to demand for growing hydrogen fuel ce...9338Product ReleaseBidirectional DC Power Supplies and Regenerative DC LoadsIn response to demand for growing hydrogen fuel cell development and test, EA Elektro-Automatik offers a series of powerful bidirectional DC power supplies and regenerative DC loads ideal for fuel cell stack testing. "In response to the demand for clean energy, the market for fuel cells is growing at a compound annual growth rate of 26.4% and is projected to reach $848 M by 2025. Uses for fuel cells include power generation for commercial vehicles such as buses and forklifts, backup power generation systems, and for military power sources. To ensure the design and manufacturing of quality fuel cells, EA Elektro-Automatik offers its EA-PSB 10000 2-quadrant power supplies and EA-ELR 10000 series electronic loads. Both the EA-PSB power supplies and the EA-ELR loads sink up to 30 kW and feed the energy back to the grid to enable testing of any size fuel cell stack," said Markus Schyboll, CEO of EA Elektro-Automatik (EA). Both the PSB power supplies and the ELR electronic loads have built-in function generators that include arbitrary waveform generation, which simplifies characterization, performance, and durability testing of fuel cells and the devices the fuel cells will power. Unlike other loads that need a separate AC instrument, the ELR load, with its built-in waveform generator, can perform the perturbation test to determine fuel cell resistance. In addition, both the PSB supplies and the ELR loads, with their built-in waveform generators, can subject the fuel cell-under-test to dynamic load variations for performance and durability testing.08.07.2021 12:30:00Julnews_2021-07-15_16.jpg\images\news_2021-07-15_16.jpghttps://elektroautomatik.com/en/latest-news/bidirectional-dc-power-supplies-and-regenerative-dc-loads-for-testing-fuel-cells/elektroautomatik.com
APEC 2022 Call for Technical Program PaperAPEC 2022, to be held in Houston, Texas, from Marc...9352Event NewsAPEC 2022 Call for Technical Program PaperAPEC 2022, to be held in Houston, Texas, from March 20-24, 2022, continues the long-standing tradition of addressing issues of immediate and long-term interest to the practicing power electronics engineer. APEC is now accepting submissions for the first of its 2022 speaker deadlines, the Technical Program Papers. Interested authors wishing to present a Technical Program Paper must submit a digest for consideration by August 13, 2021. Instructions for submissions is available at: http://apec-conf.org/conference/sessions/technical/. To be considered as an author of a highly regarded Technical Program Paper, prospective authors are asked to submit a digest explaining the problem that will be addressed by the paper, its major results, and how it is different from the closest existing literature. Technical Program Papers presented at APEC must be original material and not have been previously presented or published. The principal criteria used by reviewers in selecting digests for the program will be the usefulness of the work to the practicing power electronics professional. They also value evidence of completed experimental work.08.07.2021 11:00:00Julnews_apec2022.jpg\images\news_apec2022.jpghttp://apec-conf.org/news/apec-2022-technical-session-submissions-now-open/apec-conf.org
Li-ion Battery Materials for Use in VW and Ford EVsToyocolor announced that it was tapped to supply t...9349Industry NewsLi-ion Battery Materials for Use in VW and Ford EVsToyocolor announced that it was tapped to supply the North American and European operations of SK Innovation, a South Korean lithium-ion (li-ion) battery manufacturer, with Toyocolor's Lioaccum series of conductive carbon nanotube (CNT) dispersions. Lioaccum dispersions are used as the conductive additive in li-ion cathodes to help expand li-ion battery capacity of electric vehicles (EVs), for increased driving distances and faster charging performance. They will help power SK Innovation's li-ion batteries installed in EVs manufactured by the Volkswagen Group and the Ford Motor Company. In recent years, the shift toward EVs is accelerating rapidly due to the global trend toward decarbonization, and many automakers have announced plans to sell only EVs by 2025 to mid-2030s. Li-ion batteries are the most common battery-type used in modern EVs due to their higher energy capacity. The incorporation of CNTs as the conductive additive is essential to increasing capacity but there have been a number of issues associated with CNT dispersion that have hindered its practical use. To resolve this issue, leveraging its unique dispersion technology, Toyocolor researchers in Japan successfully achieved high conductivity levels by replacing carbon black in the battery cathode with a small amount of Lioaccum CNT dispersions as the conductive additive. Reduced material usage not only gives battery manufacturers the additional cell space to insert active materials needed to boost battery capacity and performance, but it also considerably reduces manufacturing cost.08.07.2021 08:00:00Julnews_2021-08-01_3.jpg\images\news_2021-08-01_3.jpghttps://schd.toyoinkgroup.com/en/news/2021/21070801.htmltoyoinkgroup.com
Power Disconnect Solution Enables Faster and Safer DC Fast ChargingSensata Technologies announced its power disconnec...9343Product ReleasePower Disconnect Solution Enables Faster and Safer DC Fast ChargingSensata Technologies announced its power disconnect solution has been chosen by several leading charging infrastructure OEMs to enable faster and safer DC fast charging. Sensata's solution combines contactors and GigaFuses from its Gigavac product brand to provide customers with a value-added contactor module, simplifying their installations while delivering safer and more effective system protection compared to traditional contactor and thermal fuse pairings. To compete with traditional internal combustion engines, EVs need faster charging times, so EV Charging Systems are quickly migrating from 400V to 1,000V and from 50kW to up to 350kW to shorten charging times to less than 20 minutes. While higher voltage and current levels reduce charging times, they increase the safety risks and design challenges for the systems. High voltage contactors provide safe circuit continuity while fuses are required in tandem for circuit-protection in the event of a hazardous short circuit event. The increases in voltage and current levels not only require contactors with higher breaking capabilities, but also make the contactor and fuse pairings more technically challenging. To address these challenges, DC fast charging infrastructure OEMs are seeking safer, higher performing and more comprehensive solutions that improve on the traditional contactor and thermal fuse pairing.07.07.2021 17:30:00Julnews_2021-07-15_21.jpg\images\news_2021-07-15_21.jpghttps://www.sensata.com/contact/newsroom/sensata-technologies-plug-and-play-power-disconnect-solution-enables-faster-and-safer-dc-fast-chargingsensata.com
Photovoltaic-Output Photocoupler with Increased Open VoltageToshiba Electronics Europe has launched a photovol...9334Product ReleasePhotovoltaic-Output Photocoupler with Increased Open VoltageToshiba Electronics Europe has launched a photovoltaic-output photocoupler ("photovoltaic coupler") housed in a thin SO6L package measuring just 3.84mm × 10mm × 2.1mm, suitable for driving the gates of high-voltage power MOSFETs used to develop a galvanically-isolated solid-state relay (SSR) function. SSRs are semiconductor relay devices that incorporate a photo-TRIAC, a photo-transistor or a photo-thyristor as the output device. They are generally suitable for applications that require ON/OFF control of large electrical currents such as industrial equipment (I/O relay output for PLCs, inrush current protection in PSUs, battery voltage monitoring in BMS, ground fault detection and more) as well as switching the power and signal lines in instrumentation applications. A photovoltaic coupler, such as the TLP3910, is a photorelay that contains the optical elements but not the MOSFET that performs the high-current switching functions. To easily configure an isolated SSR to handle high-voltage, large-current switching (which photorelays find challenging), designers generally combine a photovoltaic coupler with a MOSFET. Driving a high-voltage power MOSFET with a gate voltage of 10V or higher, currently requires connecting two of Toshiba's TLP3906 in series, due to the low open voltage that is around 7V. However, the TLP3910 has a minimum open voltage (VOC) of 14V, double that of the TLP3906 and, as a result, only a single device is required to drive the gate of a high-voltage power MOSFET. This reduces the part count, thereby improving reliability and saving PCB space and BOM cost.07.07.2021 08:30:00Julnews_2021-07-15_12.jpg\images\news_2021-07-15_12.jpghttps://toshiba.semicon-storage.com/eu/company/news/2021/07/opto-20210707-1.htmltoshiba.semicon-storage.com
Strengthens Position in Quantum Technology MarketThe Rohde & Schwarz technology group will now also...9329Industry NewsStrengthens Position in Quantum Technology MarketThe Rohde & Schwarz technology group will now also be active in the field of quantum computing. The July 1, 2021 acquisition of Zurich Instruments will help Rohde & Schwarz further expand its Test & Measurement Division. The Swiss company Zurich Instruments AG will be run as a full subsidiary. In the coming decades, quantum technologies will significantly shape the high-tech industry. The potential for industry and research is enormous. It is a future trend involving billions in governmental subsidies and industrial investment. Rohde & Schwarz is already active in quantum sensing. Thanks to the acquisition, the company is now positioning its T&M solutions in quantum computing, one of the most promising future technologies in the world. Peter Riedel, President and COO of Rohde & Schwarz, explains: "We are looking forward to developing technological solutions for the future together with Zurich Instruments. We are also strengthening our position in the scientific realm. Rohde & Schwarz and Zurich Instruments already share a passion for advancing science and innovation." The test and measurement market for quantum computing holds enormous potential for both companies. Operating and maintaining a large-scale quantum computer requires numerous, specific T&M solutions. Thanks to their complementary products, Rohde & Schwarz and Zurich Instruments will provide complete solutions in the future.06.07.2021 12:00:00Julnews_2021-07-15_7.jpg\images\news_2021-07-15_7.jpghttps://www.rohde-schwarz.com/ch-en/about/news-press/all-news/rohde-schwarz-strengthens-position-in-quantum-technology-market-by-acquiring-zurich-instruments-ag-press-release-detailpage_229356-1094656.html?change_c=truerohde-schwarz.com
Automotive Backlight Driver with Integrated Boost ConverterMaxim Integrated introduces the four-channel, low-...9337Product ReleaseAutomotive Backlight Driver with Integrated Boost ConverterMaxim Integrated introduces the four-channel, low-voltage MAX25512 automotive LED backlight driver with integrated boost converter. The single chip LED driver eliminates an external MOSFET and current sense resistor and integrates I2C communication to lower bill of material cost and reduce board space by 30 percent. The highly integrated LED driver includes four 120mA channels with the industry's highest efficiency at 2.2MHz operation. Today's automotive start-stop systems increase fuel economy, but they can challenge the power delivery system to maintain the same level of display brightness during re-start. For example, features like display illumination upon entry can be affected by cold crank situations, with the engine drawing down the car battery enough to cause the display to turn off and back on. Maxim Integrated's MAX25512 LED backlight driver operates down to 3V after startup without the addition of a pre-boost converter, protecting the display from these power disruptions. "Over the next five years, the number of displays in automobiles is expected to grow to accommodate new and existing vehicle functions with the size and resolution of these displays increasing as well," said Sang Oh, senior research analyst at Omdia. "Powering these displays consistently to maintain full, constant brightness while doing so as efficiently as possible, is critical to automakers today."06.07.2021 11:30:00Julnews_2021-07-15_15.jpg\images\news_2021-07-15_15.jpghttps://www.maximintegrated.com/en/aboutus/newsroom.html/pr_108359114#.YObDGtKtMKo.mailtomaximintegrated.com
Obtaining 100% Ownership of Newport Wafer FabNexperia has completed the transaction to acquire ...9326Industry NewsObtaining 100% Ownership of Newport Wafer FabNexperia has completed the transaction to acquire Newport Wafer Fab (NWF), contributing to the company's growth ambitions and investments to boost global production capacity. With the acquisition, Nexperia obtains 100% ownership of the Welsh semiconductor production facility. Nexperia Newport will continue to have a strong position in the Welsh ecosystem and technology development and will secure the current jobs at the Newport site and others across the region. Nexperia is a customer of the foundry services offered by Newport Wafer Fab and became its second largest shareholder in 2019. The Newport site complements Nexperia's other European manufacturing operations in Manchester and Hamburg, which have also seen significant recent investments. Commented Achim Kempe, Nexperia's Chief Operations Officer: "We are very excited to include Newport as part of our global manufacturing footprint. Nexperia has ambitious growth plans and adding Newport supports the growing global demand for semiconductors. The Newport facility has a very skilled operational team and has a crucial role to play to ensure continuity of operations. We look forward to building a future together". The Newport semiconductor production site was first established in 1982 and was originally named INMOS. Current capacity is over 35,000 200 mm wafer starts per month covering a wide range of semiconductor technologies ranging from MOSFETs and Trench IGBTs using wafer thinning methods to CMOS, analogue and compound semiconductors. It will support Nexperia's strategic 10 bln USD growth ambition and enrich Nexperia's product lines in IGBT, Analog and compound semiconductors in parallel to the current 8" investments at the Manchester and Hamburg wafer fabs.  05.07.2021 09:00:00Julnews_2021-07-15_4.jpg\images\news_2021-07-15_4.jpghttps://www.nexperia.com/about/news-events/press-releases/nexperia-obtains-100-ownership-of-newport-wafer-fab-to-further-boost-production-capacity.htmlnexperia.com
Increased Technical Partnership in the UKTektronix announces an increased technical partner...9328Industry NewsIncreased Technical Partnership in the UKTektronix announces an increased technical partnership with Rapid Electronics, based in Colchester, UK. This increased partnership means customers in the UK will benefit from easier access to solutions for their test and measurement requirements and more technical assistance from both the Tektronix and Rapid Electronics sales and engineering teams. Rapid Electronics will be a technical and commercial point of contact for the Tektronix entry and mainstream portfolio, as well as the extensive Keithley portfolio, with a focus on expanding into busy engineering environments and continuing their exemplary work in the education sector. "Working closely with Rapid Electronics allows us to serve more customers and grow into more markets together, whilst at the same time positioning the Tektronix & Keithley brands strongly in the UK. Rapid's experience in both the education and industrial sectors will be a benefit to us both." says Maria Heriz, Vice President, Commercial Operations, EMEAI. "This extension to our already successful relationship will enable much closer cooperation with our colleagues at Rapid and allow both Tektronix and Rapid to further expand their reach in the UK, bringing class leading equipment to the wider engineering community. Rapid already has a trusted name in industry and in education with their status as a NUWPEC accredited supplier and this partnership will allow us both to grow" says Nick Tarling, Tektronix Distribution Account Manager, UK/IRL/BENELUX.02.07.2021 11:00:00Julnews_2021-07-15_6.jpg\images\news_2021-07-15_6.jpghttps://news.tektronix.com/tektronix.com
Andre Tauber to Become Head of Media RelationsAndre Tauber (44) is taking over as Head of Corpor...9330PeopleAndre Tauber to Become Head of Media RelationsAndre Tauber (44) is taking over as Head of Corporate Media Relations at Infineon Technologies AG from 7 July 2021. He reports to Susanne Kochs, who heads the Corporate Communications department. Andre Tauber joins from the 'Stiftung Familienunternehmen' where he was Head of Communications. He has more than 15 years of experience in public relations and economic journalism. As business correspondent for the national daily newspaper "Die Welt", he reported from Munich and Brussels. For the "Financial Times Deutschland", he worked in the financial editorial department and as a foreign correspondent in Milan.01.07.2021 13:00:00Julnews_2021-07-15_8.jpg\images\news_2021-07-15_8.jpghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2021/INFXX202107-082.htmlinfineon.com
Changing Name and Corporate BrandHitachi ABB Power Grids announced that it will be ...9323Industry NewsChanging Name and Corporate BrandHitachi ABB Power Grids announced that it will be evolving to become Hitachi Energy from October 2021. The decision to change name has board and shareholder consent and coincides with the business' first-year anniversary since it started operations on 1 July, 2020. Hitachi Ltd. has an 80.1 percent stake in the joint venture and ABB Ltd. holds the balance. Hitachi ABB Power Grids places sustainability at the heart of its purpose: powering good for a sustainable energy future. The transition to the Hitachi Energy name reflects the rapidly evolving energy landscape and the opportunity to create economic, environmental and social value; and with Hitachi enabling the business to position its pioneering and digital technologies  to serve  existing and future customers, going beyond the grid – opening up a breadth of opportunities in areas like sustainable mobility, smart life, and data centers. By combining advanced digital solutions and services, such as Hitachi Lumada, with an energy platform that is built on unique domain expertise and experience, the business is serving customers and partners co-creating global solutions to solve the global challenge of an inclusive and equitable carbon-neutral future. Toshiaki Higashihara, Executive Chairman and CEO of Hitachi, said, "With climate change and increasing natural disasters, there is a need to solve three social issues worldwide: environment, resilience, and security and safety." He continued, "Hitachi ABB Power Grids provides a variety of solutions that solve these social issues, and by changing the company name to Hitachi Energy, we are further strengthening our commitment to the realization of a sustainable society." 01.07.2021 06:00:00Julnews_2021-07-15_1.jpg\images\news_2021-07-15_1.jpghttps://www.hitachiabb-powergrids.com/news/global-news/press-releases/hitachi-abb-power-grids-is-evolving-to-become-hitachi-energy-and-broadens-commitment-to-a-sustainable-energy-futurehitachiabb-powergrids.com
Acquiring 300-mm Semiconductor FactoryTexas Instruments announced it signed an agreement...9325Industry NewsAcquiring 300-mm Semiconductor FactoryTexas Instruments announced it signed an agreement to acquire Micron Technology's 300-mm semiconductor factory in Lehi, Utah, for $900 million. "This investment continues to strengthen our competitive advantage in manufacturing and technology and is part of our long-term capacity planning," said Rich Templeton, TI's chairman, president and CEO. The Lehi fab will be TI's fourth 300-mm fab, joining DMOS6, RFAB1 and soon-to-be-completed RFAB2 in TI's wafer fab manufacturing operations. In addition to its value as a 300-mm fab, the acquisition is a strategic move, as Lehi will start with 65-nm and 45-nm production for TI's analog and embedded processing products and be able to go beyond those nodes as required. "The Lehi fab is a great asset and a great team. We are excited about the engineering experience and technical skills the team brings in ramping and manufacturing advanced semiconductor processes," said Kyle Flessner, TI's senior vice president of technology and manufacturing. The companies plan to complete the sale by the end of 2021.30.06.2021 08:00:00Junnews_ti.jpg\images\news_ti.jpghttps://news.ti.com/ti-to-acquire-micron-300-mm-semiconductor-factory-extending-tis-cost-advantage-and-greater-control-supply-chainti.com
80V Withstand 5A Output Power Supply ICsROHM announces the buck DC/DC converter ICs with b...9333Product Release80V Withstand 5A Output Power Supply ICsROHM announces the buck DC/DC converter ICs with built-in MOSFET, BD9G500EFJ-LA and BD9F500QUZ, that support high voltages and currents in factory automation equipment such as PLCs/inverters, and 5G base stations that handle high power. The BD9G500EFJ-LA and BD9F500QUZ are non-isolated DC/DC converter ICs developed by utilizing proprietary analog design technology based on high voltage BiCDMOS power processes to provide the power supply functionality required by increasingly sophisticated industrial equipment. In addition to a best-in-class 80V withstand voltage for 48V power supply systems, the BD9G500EFJ-LA with built-in MOSFET delivers the largest output current in its class (5A), contributing to higher reliability and functionality in charging and 5G base stations that handle large power. At the same time, the BD9F500QUZ with built-in Nano Pulse Control technology achieving a high step-down ratio provides 39V withstand voltage and 5A output current in a compact, low-profile package (3.0×3.0×0.4mm). Moreover, the product features an over current protection as SEL1/SEL2 pins can be selected. These features are ideal for 24V power supply systems – enabling support for higher functionality and greater miniaturization in a wide range of advanced industrial equipment (i.e. factory automation).30.06.2021 07:30:00Junnews_2021-07-15_11.jpg\images\news_2021-07-15_11.jpghttps://www.rohm.com/news-detail?news-title=new-80v-withstand-5a-output-power-supply-ics&defaultGroupId=falserohm.com
Standard Logic Packages in 14, 16, 20 and 24 PinsNexperia announced low profile 14,16, 20 and 24 pi...9360Product ReleaseStandard Logic Packages in 14, 16, 20 and 24 PinsNexperia announced low profile 14,16, 20 and 24 pin packages for standard logic devices. For example, the 16 pin DHXQFN package is 45% smaller than the industry-standard DQFN16 leadless device. Not only has it a smaller footprint compared to competitors, but the package also offers a 25% saving in PCB area. Measuring just 2 mm x 2 mm (14 pin), 2 mm x 2.4 mm (16 pin), 2 mm x 3.2 mm (20 pin) and 2 mm x 4 mm (24 pin), the 0.4 mm pitch DHXQFN packages are only 0.45 mm high. The parts include: hex inverting Schmitt-triggers; 8-bit SIPO shift registers with output latches; 4-bit dual supply translating transceivers; octal buffer/line drivers; octal bus transceivers; and 8-bit dual supply translating transceivers. Ashish Jha, Nexperia's product manager comments: "Nexperia has a history of over 50 years developing standard logic parts, and we aspire to become the undisputed market leader during the next three years. These new packages are an example of the innovation we are bringing. Previously, incorporating large logic functions into a system with a small form factor was unthinkable. However, our new DHXQFN package enables complex functions such as 74HC595 shift registers to fit into space-sensitive applications like smartwatches, mobile devices and internet connected industrial devices."30.06.2021 07:30:00Junnews_2021-08-01_14.jpg\images\news_2021-08-01_14.jpghttps://www.nexperia.com/about/news-events/press-releases/World-s-smallest-and-thinnest-standard-logic-DHXQFN-packages-from-Nexperia-in-14--16--20-and-24-pins.htmlnexperia.com
Family in TO-247-3-HCC Housing Improves Isolation Voltage RatingInfineon Technologies introduces the 650 V TRENCHS...9332Product ReleaseFamily in TO-247-3-HCC Housing Improves Isolation Voltage RatingInfineon Technologies introduces the 650 V TRENCHSTOP 5 WR6 family in a discrete housing. The family comes in a TO-247-3-HCC package and offers a broad portfolio comprising 20 A, 30 A, 40 A, 50 A, 60 A and 70 A current ratings. The devices can easily be used for replacing previous technologies like Infineon's TRENCHSTOP 5 WR5 and HighSpeed 3 H3 as well as competitor technologies. The family is optimized for power factor correction (PFC) for residential and commercial air conditioning systems as well as welding applications. The TRENCHSTOP 5 WR6 switches provide very low conduction losses (30 A, 1,45 V at 25°C) as well as lowest switching losses (30 A, 1,55 mJ at 175°C). They feature a very low saturation voltage (V CE(sat)) of 1,45 V and a monolithically integrated diode with optimized forward voltage for the target applications. This results in best-in-class performance while enabling a low BOM cost. Additionally, the device leverages the performance advantage of the TRENCHSTOP 5 WR5 series, the predecessor to the TRENCHSTOP 5 WR6 series. The TO-247-3-HCC housing of the WR6 family increases the creepage and clearance distances thus improving the isolation voltage rating. With this, the product family enables more reliable system designs that are resistant against contamination and condensation which e.g. often occur at AC outdoor units. The TRENCHSTOP 5 WR6 reduces the total cost of ownership with less failure rate while it also enables higher switching frequency in application.30.06.2021 06:30:00Junnews_2021-07-15_10.jpg\images\news_2021-07-15_10.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2021/INFIPC202106-079.htmlinfineon.com
300% Peak Power AC-DC AEA SeriesCOSEL announced the introduction of 600W free-air ...9342Product Release300% Peak Power AC-DC AEA SeriesCOSEL announced the introduction of 600W free-air convection cooling power supplies, the AEA600F series. With demanding applications in mind, the AEA600F is able to deliver 300% peak power for a period of up to 1,000 milliseconds. Designed for applications requiring a high level of safety, the AEA600F is certified according to the EN62477-1 (OVC III) standard for industrial applications and is approved in accordance with ANSI/AAMI ES60601-1, and EN60601-1 3rd Edition for medical applications. The AEA600F is suitable for Body Floating (BF) applications and complies with 2MOPP (IN/OUT) and 1MOPP (OUT/FG) safety requirement. The layout is optimized for free-air convection making it ideal for use in equipment being operated in low noise environments. The AEA600F has an input to output isolation of 4,000VAC, input to ground (FG) of 2,000VAC and output to ground (FG) of 1,500VAC. Designed for international applications, the versatile AEA600F has an input voltage of 85 to 264VAC. Three output voltages are available: 24V, 36V and 48V with respective current ratings of 25A, 16.7A and 12.5A. Output voltage can be adjusted using a built-in potentiometer. For low harmonic current distortion, the AEA600F uses active Power Factor Corrector (PFC), and the switching stage uses an LLC resonant topology deploying the latest generation of power semiconductors, conferring to a typical efficiency of up to 95%.29.06.2021 16:30:00Junnews_2021-07-15_20.jpg\images\news_2021-07-15_20.jpghttps://www.coseleurope.eu/news-item-1409-cosel-releases-new-family-of-300-peak-power-ac-dc-aeacoseleurope.eu
Supercapacitor to Combine with Lithium BatteriesSupercapacitors may be combined with batteries to ...9340Product ReleaseSupercapacitor to Combine with Lithium BatteriesSupercapacitors may be combined with batteries to add the advantages of high capacity and low internal resistance. Low leakage currents will extend battery life in this application. HY-LINE Power Components now offers a model optimized specifically for this use case. The capacity of a supercapacitor is usually not delivering energy for 10 years, but only for a few weeks without recharging. Lithium batteries, on the other hand, manage 10 years, but without a buffer capacitor they have problems with pulse loads, like in smoke detectors and sensors networked via radio technology. An elegant solution is to connect the supercapacitor and battery in parallel - for example as a hybrid supercapacitor that internally combines the technologies of supercapacitor and rechargeable lithium-ion battery. A popular alternative is to install two separate components: A high-capacity, non-rechargeable lithium battery and a supercapacitor. Since the maximum voltage of supercapacitors is 2.5 to 3.0 V per cell and lithium batteries deliver 3.6 V per cell, a series connection of supercapacitors is required. Their balancing network and supercapacitor self-discharge can reduce lithium battery life. In the PHVL supercapacitor, the lower operating voltage and good selection of supercapacitors for minimum leakage currents and identical capacitances made it possible to dispense with a balancing network. It offers an operating voltage of 3.9 V (peak voltage 5.0 V) and capacitances of 0.47 to 5.0 F at an operating temperature range of -40 to +65°C (-40 to +85°C with restrictions). At the same time, it shows only 10 to 20% of the leakage current of comparable models with up to 5.5 V working voltage; for a 5 F model, this is only 5 µA. This is the most uncompromising combination of the particularly long operating life of the lithium battery with the low internal resistance of the supercapacitor.28.06.2021 14:30:00Junnews_2021-07-15_18.jpg\images\news_2021-07-15_18.jpghttps://www.hy-line-group.com/de-de/produkte/aktive-passive/superkondensatoren-zellen-/phvl-serie~p11309hy-line-group.com
Small TVS Diodes with Low Capacitances and Clamping VoltagesTDK Corporation has extended its range of TVS (tra...9339Product ReleaseSmall TVS Diodes with Low Capacitances and Clamping VoltagesTDK Corporation has extended its range of TVS (transient voltage suppression) diodes characterized by their low capacitance values for bidirectional overvoltage protection to include the ULC series (Ultra Low Clamping & Capacitance). The SD01005SL-ULC101 (B74111U0033M060) type has a minimum capacitance of ~0.5 pF and the SD0201SL-ULC101 (B74121U0033M060) type of ~0.6 pF, both at 1 MHz. The TVS diodes are designed for a maximum operating voltage of 3.3 V. The ULC products offer an extremely low clamping voltage of ~3.8 V at a peak pulse current of 8 A or 16 A at ~5 V and a breakdown voltage of 6.3 V. Further features include very short response times and the extremely low leakage current of ~1 nA at 3.3 V. They are designed in accordance with IEC 61000-4-2 for an ESD contact discharge of up to 15 kV. Despite high-level performance of robust protective components, the diodes meet the highest requirements in terms of miniaturization. Their dimensions in the Wafer-Level Chip Scale Package (WL-CSP) are just 400 x 200 µm (WL-CSP01005) or 600 x 300 µm (WL-CSP0201) with a height of 100 µm in the 01005 size or 150 µm in the 0201 size. Despite their extremely small size, the components are designed for a high surge current load of up to 7 A according to IEC 61000-4-5 (8/20 µs). The diodes are well suited for the reliable ESD protection of high-speed interface ICs and data lines such as USB 3.1, USB 3.2, HDMI, FireWire and Thunderbolt due to their parasitic capacitances and clamping voltage.28.06.2021 13:30:00Junnews_2021-07-15_17.jpg\images\news_2021-07-15_17.jpghttps://www.tdk-electronics.tdk.com/en/373388/company/press-center/press-releases/press-releases/overvoltage-protection-tdk-offers-extremely-small-tvs-diodes-with-extremely-low-capacitances-and-clamping-voltages/2991592tdk-electronics.tdk.com
PCIM Asia 2021 to Feature Over 50 PapersAsia's leading fair in power electronics will be c...9324Event NewsPCIM Asia 2021 to Feature Over 50 PapersAsia's leading fair in power electronics will be coming to Shenzhen's World Exhibition & Convention Center from 9 – 11 September 2021, with its renowned accompanying conference to feature guest speakers' talks on a variety of industry hot topics. PCIM Asia Conference 2021 has already confirmed 52 papers from experts in industry and academia to be used in oral & poster sessions, keynotes, tutorials and more during the event focusing on the latest insights and research within the sector. Held in Shenzhen for the first time on the fair's 20th anniversary, PCIM Asia Conference 2021 promises to once again provide a platform for industry professionals in power electronics, intelligent motion, renewable energy and energy management from around the world to connect and share ideas. For the first time, PCIM Europe conference sessions will be presented at the PCIM Asia Conference in Shenzhen, allowing attendees to acquire industry knowledge exclusively from Europe. The conference will also feature two presentation sessions in Chinese. More information on the aforementioned sessions will be provided on a later date. The 2021 PCIM Asia Conference will feature a strong line-up of speakers, sharing their expertise through 22 oral presentations and 30 poster sessions. Held concurrently with the conference is the PCIM Asia fair which gathers industry professionals to showcase the latest trends and developments in the power electronics sector, covering a range of power electronics solutions and associated semiconductors, power devices, bus bars, capacitors and more. Recognised as a reputable platform, the exhibition and conference promote industry exchange and development in a professional, international and forward-thinking environment.28.06.2021 07:00:00Junnews_2021-07-15_2.jpg\images\news_2021-07-15_2.jpghttps://pcimasia-expo.cn.messefrankfurt.com/shanghai/en/press/press-releases/2021/PCIM21_PR3.htmlpcimasia-expo.cn.
Vertically Integrated Silicon Carbide Production LineOn June 23, Hunan Sanan Semiconductor, located in ...9306Industry NewsVertically Integrated Silicon Carbide Production LineOn June 23, Hunan Sanan Semiconductor, located in Changsha High-tech Industrial Park, held its official inauguration to commence its production. Hunan Sanan Semiconductor has a total investment of 16B RMB constructed over a land area of about 667 thousand m2. Since its groundbreaking in July 2020, it has only taken less than a year to build this modern manufacturing facility for the entire silicon carbide compound semiconductor supply chain from crystal growth to power devices, packaging, and testing. A Mega Fab with a monthly output of 30,000 6-inch silicon carbide wafers is now complete and is ready for production.It is the first in China and third in the worldwide industry as a vertically integrated silicon carbide chain, providing customers with high-quality and on-time delivery, while sharing the advantages of large-scale production costs. The third-generation semiconductor materials have superior electrical properties and can meet the new requirements of power electronics technologies for high temperature, high power, high voltage, and high frequency operation. Through large-scale production and its own silicon carbide material patent portfolio, Hunan Sanan Semiconductor serves a broad range of end markets such as in communications, server power supplies, photovoltaic, electric vehicle (EV) main traction inverters, on-board chargers (OBC), charge piles, smart grids, rail transit and other fields, and is able to realize the widely adopted and popular wide bandgap semiconductor devices.24.06.2021 15:00:00Junnews_2021-07-01_10.jpg\images\news_2021-07-01_10.jpghttps://www.linkedin.com/pulse/hunan-sanan-inaugurates-chinas-first-vertically-integrated-silicon-/?trackingId=FSEX9gpYgCdhJX2xv1l7%2BA%3D%3Dlinkedin.com/sanan
Honoured European Distributor of the Year AwardsTTI, Inc. has again been honoured by Molex with Di...9331Industry NewsHonoured European Distributor of the Year AwardsTTI, Inc. has again been honoured by Molex with Distributor of the Year awards. This is the second consecutive year TTI has been named European Distributor of the Year. In addition, the regional TTI teams for Northern and Eastern Europe won the 2020 Distributor of the Year for their respective regions. Molex recognises its distributors each year with these awards, which are given for achieving outstanding sales results and growth in their respective regions, amongst other criteria. Geoff Breed, Vice President, Marketing at TTI Europe said: "We are honoured and very proud to receive the Molex 2020 European Distributor of the year Award and the regional awards for Central and Northern, won by the TTI Eastern European team, and TTI Nordic team. I would like to congratulate the entire TTI team for its hard work and thank the Molex team for its continued support during a very challenging year. We look forward to achieving our goals together in 2021 and beyond." Paul Keenan, Sales Director, Distribution Europe at Molex, added: "We appreciate the continued efforts from TTI and its regional teams and are once again pleased to recognise that through these awards. TTI made a significant contribution to our network in 2020 and demonstrated their commitment to our business in a challenging year. We are confident that we will be able to celebrate further successes with TTI in Europe in the future."24.06.2021 14:00:00Junnews_2021-07-15_9.jpg\images\news_2021-07-15_9.jpghttps://www.ttieurope.com/content/ttieurope/en/about-tti/news-center/corporate-news/press-releases/2021/june/pr-06-24-2021-tti-honoured-by-molex-award.htmlttieurope.com
NH Fuse Switch DisconnectorsMersen offers two versions of its NH fuse switch d...9336Product ReleaseNH Fuse Switch DisconnectorsMersen offers two versions of its NH fuse switch disconnector series in size 000. The Multibloc 000.RST9 is being launched as a bus bar version for mounting on 60 mm bus bar systems, while the Multibloc 000.ST9 is available in the mounting plate version with a width of only 53 mm. Multibloc 000 ideally meets the demand for small power distribution boards industrial and building applications, but also for industrial control applications such as drive, starter and motor protection. The generation of the Multibloc size 000 from Mersen offers numerous advantages compared to the previous generation. To meet the requirements of customers, the 125A NH fuse switch disconnectors are not only designed for higher electrical power than the previous model. The products have also become safer: In closed position they can be locked with a padlock or sealed with a lead seal, which substantially increases the safety of the installation. The fuse switch disconnectors will also be available with an optional fuse monitoring module, which makes it possible to notify an external system via a digital output of the module when a fuse blows out. This fuse monitoring feature also makes maintenance more efficient. Micro switches for detecting when the switch door is opened are available for all versions. With an amperage of 125A, a short-circuit rating of 80kA and a low power loss, the Multibloc 000 series from MERSEN is among the best in its class.24.06.2021 10:30:00Junnews_2021-07-15_14.jpg\images\news_2021-07-15_14.jpghttps://ep-fr.mersen.com/en/products/series/multiblocr-000rst9-size-000-125a-690vac-design-bus-bar-installation-triple-poleep-fr.mersen.com
Precision Current Sense ResistorBourns announced the availability of smaller packa...9319Product ReleasePrecision Current Sense ResistorBourns announced the availability of smaller package sizes and feature options in its Model CFN Metal Foil Current Sense Resistor Series. Miniature 0402 and 0603 packages were introduced to the Model CFN series as well as a lower TCR option of ±50 ppm/°C in the 0603 and larger package sizes. Using Bourns' metal foil technology construction enables the current sense resistors to provide low TCR, low inductance, low noise, excellent reliability and very low resistance values. These attributes make the Model CFN series an optimal current sensing solution for power supply, stepper motor drive, and input amplifier applications. The smaller sizes are particularly well-suited to meet the space-constrained requirements of mobile device designs. Ever important in current sensing is having a suitably low TCR, which is determined by characteristics such as the materials used in the resistive element, power rating, and physical size of the component. Bourns has leveraged metal foil technology to achieve lower resistance values, ranging from 5 to 40 milliohms, and still provide power ratings of 0.25 to 1 W in components small enough for mobile applications. Combining the new ±50 ppm/°C option with the low resistance values helps minimize self-heating so the resistor remains reliable and stays within its 1-5 percent tolerance over time.23.06.2021 17:30:00Junnews_2021-07-01_23.jpg\images\news_2021-07-01_23.jpghttps://bourns.com/news/press-releases/pr/2021/06/23/bourns-precision-current-sense-resistor-line-offers-new-smaller-package-sizes-that-match-mobile-device-requirementsbourns.com
Point of Load Converters Target USB-PD ApplicationsSilanna Semiconductor has extended its CO2 Smart P...9313Product ReleasePoint of Load Converters Target USB-PD ApplicationsSilanna Semiconductor has extended its CO2 Smart Power family of wide-voltage, high-frequency point of load converters with a 100W device targeting USB-PD applications designed to deliver industry-leading efficiency. Silanna Semiconductor focuses on power management challenges with devices that combine best-in-class power density and efficiency performance with unprecedented BoM savings. Operating at a switching speed of 667kHz, the SZDL3105B fully-integrated DC/DC converter (buck regulator) can supply up to 5 amps and 100 watts of output power. It accommodates industry-leading wide input and output ranges that support up to 27VDC input and is supplied in a tiny 4mm x 4mm QFN package. Tim Wilhelm, Director of Marketing, explained, "Higher switching frequency means a smaller, lower cost, higher performing output filter that has delighted the clients we have sampled. The SZDPL3105B device enables ground-breaking efficiencies in the smallest size and weight designs. Our support tools give customers the flexibility and confidence to quickly increase the performance efficiency. This ultimately increases power density with volumes approaching 12% of that required by low-frequency competitive solutions. The SZDL3105 significantly reduces BOM cost, design cycles and time to market." The SZDL3105B has features that optimize its performance in USB port power supply applications. Extremely low operating power dissipation enables the very low no-load power that is an important specification for regulatory certification. Internal and external feedback resistor divider flexibility supports custom design, while a momentary internal feedback path allows for clean and well-controlled start-up operation until external USB port controllers can bias themselves and smoothly take over control of the output voltage. 23.06.2021 11:30:00Junnews_2021-07-01_17.jpg\images\news_2021-07-01_17.jpghttps://powerdensity.com/2021/06/23/silanna-semiconductor-extends-power-of-highest-efficiency-highest-power-density-dc-dc-converter-family-to-100w/powerdensity.com
Call for Papers for PCIM Europe Conference 2022Experts from industry and academia in the power el...9301Event NewsCall for Papers for PCIM Europe Conference 2022Experts from industry and academia in the power electronics industry are invited to apply to be a speaker at the PCIM Europe Conference 2022 with a short abstract. The Call for Papers will be open until 15 October 2021. The event will be taking place once again on-site in Nuremberg from 10 – 12 May 2022. As a platforms for exchange in the power electronics community, the event serves as a stage for international speakers to provide their expertise to a qualified audience of around 800 participants. Whether on current developments, the latest research findings or current challenges, speakers are invited to shape the program and share their knowledge in a twenty-minute talk or in a poster presentation. The conference language is English. The PCIM Europe advisory board, led by Professor Dr. Leo Lorenz, ECPE, Germany, will select the papers and also choose the best submissions overall. In addition to the Best Paper and the Young Engineer Award, a further accolade will join the list of prizes: for the first time the main author of one outstanding contribution from academia and research institutions, who is not older than 30 years, will be honored with the Young Researcher Award. Each prize is worth 1,000 Euro. All the papers accepted will be published in the PCIM Europe conference proceedings, as well as in the scientific databases of IEEExplore, Scopus, Compendex and IET Inspec Direct.23.06.2021 10:00:00Junnews_2021-07-01_5.jpg\images\news_2021-07-01_5.jpghttps://pcim.mesago.com/nuernberg/en/press/press-releases/pcim-press-releases/pcim2022-call-for-papers.htmlpcim.mesago.com
Two Soldering Processes? Manual assembly?Surface mounting technology (SMT) for electrical a...9346Product ReleaseTwo Soldering Processes? Manual assembly?Surface mounting technology (SMT) for electrical and electronic components is not as new as some people might think. SMT stands for Surface Mounted Technology. It was developed by IBM back in the 1960s and was first used in the computers of the Saturn and Apollo missions. The reasons given for this development at the time were the limited space conditions in the capsules and a reduction in circuit impedance to increase switching frequencies. The components belonging to this surface mounting are called SMD (Surface Mounted Device) and have a particularly small design. They are the result of the progressive miniaturisation of electronic components. Many products that everyone takes for granted today would be unthinkable without SMD components, for example: smartphones. In contrast to conventional wired components for through-hole assembly (THT = Through Hole Technology), SMD components are fixed directly on the copper-laminated surface of the board by means of a solder paste and then soldered in a reflow process (similar to an oven). Often, the board is assembled on both sides, which doubles the possible assembly density. SMT technology is state of the art. But not every component can be reduced in size at will. If, for example, the power supply unit is to be placed on the board at the same time, it is getting tight for the transformer. Larger components are still difficult to assemble as SMDs, sometimes because of their weight. Or let's adress the topic circuit protection: if a fuse blows in the event of a fault, it would be extremely useful if this fuse could be replaced as easily as possible. Out of this necessity, hybrid solutions emerge, offering compromising advantages.22.06.2021 20:30:00Junnews_2021-07-15_24.jpg\images\news_2021-07-15_24.jpghttps://live.schurter.com/content/download/5186890/78887584/version/7/file/SCHURTER_WP_OGN_SMD_en.pdfschurter.com
AC Energy Calibration Service LaunchedThe launch of the service follows Yokogawa's accre...9303Industry NewsAC Energy Calibration Service LaunchedThe launch of the service follows Yokogawa's accreditation (K164) to ISO17025, allowing the calibration of AC energy measuring devices at up to 40 MWh at a maximum time of 1000 hours. This is ideal for manufacturers of products, equipment, or appliances where the measurement of energy efficiency is critical to meet efficiency goals, for proving product specifications or meeting regulatory requirements such as energy labelling of consumer products. It is also vital for applications for usage-based billing of electrical energy between supplier and user, not only for houses and offices but also for other applications, for example charging of electrical vehicles. Other uses include renewable energy projects such as photovoltaic and wind installations and end tests and type rating where energy is involved. With the new service, Yokogawa's European Standards Laboratory, based at the company's European Headquarters in Amersfoort, Netherlands, now offers comprehensive energy and power calibration, customized to meet the needs of specific applications. Erik Kroon, Yokogawa's European Standards Laboratory Manager, says: "We are one of a few laboratories able to calibrate in the frequency range 40 Hz to 1 kHz. This makes us particularly attractive for engineers working on applications in Automotive, Aviation and Marine and who can now more easily source ISO17025 accredited energy measurements for 400 Hz systems. Using our precise and accurate energy and power calibration services ensures that their designs and instruments meet engineering and quality control requirements."22.06.2021 12:00:00Junnews_2021-07-01_7.jpg\images\news_2021-07-01_7.jpghttps://tmi.yokogawa.com/eu/news/press-releases/2021/yokogawa-launches-new-ac-energy-calibration-service/tmi.yokogawa.com
Coating Method Aerosol Deposition Available for Industrial UseHeraeus broadens the application range of the Aero...9312Product ReleaseCoating Method Aerosol Deposition Available for Industrial UseHeraeus broadens the application range of the Aerosol Deposition coating method. So far, the technology, which was developed in Japan, has been used mainly in Asia for coating of components for plasma etch chambers. Although the coating method offers many advantages, other industries have hardly applied it until now. "However, feasibility studies by universities such as the University of Bayreuth have shown that Aerosol Deposition offers advantages also for other applications," Dr. Ilka Luck says, Head of Heraeus High Performance Coatings. She sees potential in sensor technology, power electronics, battery, and medical technology, among others. "We have worked intensively over the past two years on optimizing processes and machines for production on industrial scale. As a result, we are the only supplier that accompanies customers all the way from feasibility study to series production," Luck comments. The technology is particularly promising when conventional methods do not achieve the required quality, or the desired coating cannot yet be produced at all. Aerosol Deposition is a process for producing thin material layers. Material particles are accelerated to a speed of several hundred meters per second with the aid of a carrier gas. These then hit a surface, the so-called substrate, where they form a closed film. Aerosol Deposition has no fundamental limitations in terms of coating materials or substrates that can be used. "We already use both for coating, metals and ceramics. The only requirement for its use is that the material is available as a processable powder," Luck explains.22.06.2021 10:30:00Junnews_2021-07-01_16.jpg\images\news_2021-07-01_16.jpghttps://www.heraeus.com/en/group/press_group/corporate_news/2021_1/06_aerosoldeposition.htmlheraeus.com
20A DIN-Rail Power Supply Features Integrated LED DisplayPULS Power announces the availability of their lat...9316Product Release20A DIN-Rail Power Supply Features Integrated LED DisplayPULS Power announces the availability of their latest addition to the CP20 series of high efficiency and compact 24V, 20A 1-phase DIN-Rail power supplies. The CP20.248 extends PULS's portfolio by adding a power supply with an integrated display. The LED display means a reliable and inexpensive condition monitoring feature can be integrated into almost any system allowing users to benefit immediately from faster fault diagnosis and increased system availability. The display shows important status information about the power supply for commissioning and maintenance and can display real-time information and recorded data. The real-time data supplied by the CP20.248 includes the input and output voltage, output current, operating hours and temperature inside the device. The recorded data gives users insight into the number of transients on the input side as well as minimum and maximum voltage and temperature values and more. This information can help the system engineer optimise an entire application in terms of reliability and to identify the cause of faults or errors more efficiently. The display and data storage have an independent power source ensuring that all the information is still available, even if the power supply fails. For remote status monitoring two relay contacts for DC-OK and alarm signals are provided. Two additional inputs allow the power supply to be put into an energy-saving standby mode using the remote ON / OFF function and automatic load sharing in parallel operation for greater power output can be realised. Parallel operation ensures an optimised temperature balance between the connected power supplies, prolonging the service life of the devices.21.06.2021 14:30:00Junnews_2021-07-01_20.jpg\images\news_2021-07-01_20.jpghttps://products.pulspower.com/uk/cp20-248.htmlpulspower.com
Hybrid IGBTs with Built-In SiC DiodeROHM developed Hybrid IGBTs with integrated 650V S...9364Product ReleaseHybrid IGBTs with Built-In SiC DiodeROHM developed Hybrid IGBTs with integrated 650V SiC Schottky barrier diode, the RGWxx65C series (RGW60TS65CHR, RGW80TS65CHR, RGW00TS65CHR). The devices are qualified under the AEC-Q101 automotive reliability standard. They are ideal for automotive and industrial applications that handle large power, such as photovoltaic power conditioners, onboard chargers, and DC/DC converters used in electric and electrified vehicles (xEV). The RGWxx65C series utilizes ROHM's low-loss SiC Schottky barrier diodes in the IGBT's feedback block as a freewheeling diode that has almost no recovery energy and thus minimal diode switching loss. Additionally, since the recovery current does not have to be handled by the IGBT in turn-on mode, the IGBT turn-on loss is reduced significantly. Both effects together result in up to 67% lower loss over conventional IGBTs and 24% lower loss compared with Super Junction MOSFETs (SJ MOSFETs) when used in vehicle chargers. This effect provides good cost performance while contributing to lower power consumption in industrial and automotive applications. A variety of design support materials are also available on ROHM's website, including SPICE models and application notes on drive circuit design necessary for integration and evaluation, supporting quick market introduction. ROHM is committed to continuing to contribute to minimizing environmental impact through system low power consumption and miniaturization by developing low-loss power devices that meet different needs and offering design tools as a solution.19.06.2021 11:30:00Junnews_2021-08-01_18.jpg\images\news_2021-08-01_18.jpghttps://www.rohm.com/news-detail?news-title=hybrid-igbts-with-built-in-sic-diode&defaultGroupId=falserohm.com
ICs for Energy Harvesting from Solar & RF/Vibrational SourcesExpanding its portfolio of advanced power manageme...9320Product ReleaseICs for Energy Harvesting from Solar & RF/Vibrational SourcesExpanding its portfolio of advanced power management ICs (PMICs) for energy harvesting applications, e-peas announces the availability of two devices adding complementary features to previously released products. The AEM10330 and AEM30330 PMICs distinguish themselves from the competition via their buck-boost architecture. They are able to deal with far lower battery voltages than other solutions on the market. Also, the high-speed charging of super-capacitors that these ICs can supervise allows more energy to be made available to the load - resulting in greater flexibility when it comes to selecting the storage device. The AEM10330 is specifically intended for solar deployments, while the AEM30330 is targeted at RF/vibration-oriented deployments (including industrial, home automation, asset tracking and aftermarket automotive monitoring systems, as well as retail applications). One of the characteristics of both the AEM10330 and AEM30330 is the cold-start threshold at which they can begin to draw energy from the surrounding environment. This has been lowered to just 275mV/3µW, which presents a substantial improvement on the previous generation of e-peas PMICs - and is unmatched by any other solution currently available. The e-peas PMICs can deliver up to 60mA, so storage elements can be charged rapidly. By leveraging the fully configurable maximum power point tracking (MPPT) function, the AEM10330 and AEM30330 can continuously monitor and regulate the input with a fast refresh rate of 20ms supported. Consequently, the extraction efficiency of the system will be kept as high as possible, regardless of variations in the input from the source.17.06.2021 18:30:00Junnews_2021-07-01_24.png\images\news_2021-07-01_24.pnghttps://e-peas.com/news/new-generation-of-e-peas-aems-has-arrived/e-peas.com
AC/DC Converter ICs with Built-In 1700V SiC MOSFETROHM announces the AC/DC converter ICs with a buil...9311Product ReleaseAC/DC Converter ICs with Built-In 1700V SiC MOSFETROHM announces the AC/DC converter ICs with a built-in 1700V SiC MOSFET, BM2SC12xFP2-LBZ in the TO 263-7L package, optimized for industrial applications focusing on auxiliary power supplies for street lamps, commercial air-conditioning systems, general-purpose inverters and for AC servos drives. An auxiliary power supply is an essential and vital part of industrial applications to deliver different levels of DC voltages for gate drivers and control units. By applying existing Si MOSFET devices, the designer cannot achieve higher efficiency and increased out power because of the higher losses of Si devices. The existing solutions require a heatsink and additional components which increase both the losses of the devices and also the size of the system by additional space. To design an auxiliary power supply with existing Si devices will also be expensive because of a larger Bill of Material (BOM). ROHM's BM2SC12xFP2-LBZ power ICs are the Quasi-resonant (QR) AC/DC converters with an integrated 1700V SiC MOSFET in a single compact surface mount package (TO263). These ICs are the right fit and best in class products for industrial auxiliary power supply solutions in terms of efficiency, shortening design time, simplifying the circuitry and reducing additional components by offering integrated solutions. These ICs also increase product reliability by minimizing the risk of component failure. When used in 400VAC 48W output auxiliary power supplies, besides enabling automatic board mounting that was not previously possible, the number of external parts can be significantly reduced compared with standard configurations – from 12 parts and heat sink to just one.17.06.2021 09:30:00Junnews_2021-07-01_15.jpg\images\news_2021-07-01_15.jpghttps://www.rohm.com/news-detail?news-title=industry-first-ac-dc-converter-ics-of-surface-mount-package-w-built-in-1700v-sic-mosfte&defaultGroupId=falserohm.com
Investing $700 Million to Boost Production CapacityNexperia has announced the latest stage of its glo...9297Industry NewsInvesting $700 Million to Boost Production CapacityNexperia has announced the latest stage of its global growth strategy, confirming a $700 million investment over the next 12-15 months at its European wafer fabs, assembly factories in Asia and global R&D sites. The investment will boost manufacturing capacity at all sites while supporting research and development into areas such as gallium nitride-based (GaN) wide bandgap semiconductors and power management ICs. It will also underpin recruitment activities, with Nexperia looking to attract new chip designers and engineers. "This is an exciting time in the global semiconductor market, which has mounted a resurgence since the challenges of the first half of last year," says Achim Kempe, Nexperia's Chief Operating Officer. "Nexperia reported robust product sales of $1.4B in 2020, with demand accelerating rapidly in Q3 and Q4. That momentum has been maintained so far this year, and we expect it to continue over the long term. The $700 million investment will ensure that we continue to provide the technology and manufacturing capacity needed to deliver products in volumes that support increasing demand." As a result, the capacity of the Hamburg fab in Germany – which currently produces more than 35,000 wafers (8-inch-equivalent) per month (70 billion semiconductors per year) – will further increase by 20 per cent from mid-2022. While in the UK, at Nexperia's dedicated TrenchMOS fabrication facility in Manchester, the capacity will rise by 10 per cent by mid-2022 from the current 24,000 wafers (8-inch-equivalent) per month.17.06.2021 06:00:00Junnews_2021-07-01_1.jpg\images\news_2021-07-01_1.jpghttps://www.nexperia.com/aboutnexperia.com
Power over Ethernet Transformer SeriesWürth Elektronik expands its MID-POE Power over Et...9314Product ReleasePower over Ethernet Transformer SeriesWürth Elektronik expands its MID-POE Power over Ethernet transformer series to include PoE++. These SMT transformers are suitable for Flyback or Active Clamp Forward power supplies that comply with the IEEE 802.3bt (four pair power over Ethernet, 4PPoE, also known as PoE++) standard. The ten new transformers can provide an output power of up to 95 W. Demand for more power in Power-over-Ethernet (PoE) devices has risen due to the advancements in smart and IoT (Internet of Things) applications. In response to this demand, Würth Elektronik expanded its MID-POE series for IEEE 802.3bt Type 3 (60 W) and Type 4 (90 W) devices. These transformers utilize the low-profile EFD20 and EFD25 packages and offer high power densities over a wide range of common PoE output voltages. The series is suitable for devices such as video conferencing systems, automation control systems, smart IP cameras and much more. Customer-specific versions are possible on request. All MID-POE transformers are available from stock without a minimum order quantity.16.06.2021 12:30:00Junnews_2021-07-01_18.jpg\images\news_2021-07-01_18.jpghttps://www.we-online.com/web/en/wuerth_elektronik/news_weg/News_Detail_WE_Gruppe_124030.phpwe-online.com
Compact Switcher Reduces Component CountPower Integrations announced LinkSwitch-TNZ, a swi...9309Product ReleaseCompact Switcher Reduces Component CountPower Integrations announced LinkSwitch-TNZ, a switching power supply IC that combines offline power conversion, lossless zero-cross detection and, optionally, X-capacitor discharge functions in a compact SO-8C package. The LinkSwitch-TNZ IC can be used for non-isolated buck and buck-boost power supplies up to 575 mA output current and provides up to 12 W output for universal-input isolated flyback designs. Adnaan Lokhandwala, product marketing manager at Power Integrations said: "The new LinkSwitch-TNZ ICs provide an accurate signal indicating that the sinusoidal AC line is at zero volts. This signal is used by smart home and building automation (HBA) products and appliances to control the switching of relays, IGBTs and TRIACs to minimize switching stress and system in-rush current. LinkSwitch-TNZ's detection of the zero-cross point consumes less than 5 mW, allowing systems to reduce standby power losses versus alternative approaches that require ten or more discrete components and burn 50 to 100 mW of continuous power." LinkSwitch-TNZ ICs provide light-load efficiencies, enabling more system features to be powered while meeting stringent standby regulations such as: the European Commission (EC) standard for home appliances (1275), which requires equipment to consume no more than 0.5 W in standby or in off mode; ENERGY STAR's version 1.1 for Smart Home Energy Management Systems (SHEMS), which limits standby consumption of smart lighting control devices to 0.5 W; and China's GB24849, which limits the off-mode power consumption in microwave ovens to 0.5 W.16.06.2021 07:30:00Junnews_2021-07-01_13.jpg\images\news_2021-07-01_13.jpghttps://investors.power.com/news/news-details/2021/Power-Integrations-Incorporates-Lossless-Zero-Cross-Detection-and-X-Capacitor-Discharge-into-New-LinkSwitch-TNZ-Offline-Switcher-ICs/default.aspxpower.com
GaN Low-Voltage Designs Enable Compact 3-Phase Motor Inverter ICIn battery-powered applications, in the automotive...9298Industry NewsGaN Low-Voltage Designs Enable Compact 3-Phase Motor Inverter ICIn battery-powered applications, in the automotive sector and in IT infrastructures 48 V technology is on the rise. In this voltage class, gallium nitride (GaN) power transistors offer the best compromise between safety, compactness and efficiency. Now, scientists at Fraunhofer IAF have presented pioneering integration concepts with GaN-based integrated circuits (ICs) for low-voltage applications. Whether battery-powered applications such as e-bikes, robotics or drones, drive and board systems in mobility, or IT infrastructures-all these sectors rely on cost-effective, efficient and compact electronics. To meet this demand, Fraunhofer Institute for Applied Solid State Physics IAF is researching GaN-based circuits for power electronics applications, even at low voltages of up to 48 V. The 48 V class has recently been on the rise and finds application in a wide variety of industries. This is due to the more efficient power transmission it offers compared to lower supply voltages. A change to 48 V is thus a resource-saving alternative for applications that previously used even lower voltages. In contrast to high-voltage power electronics, 48 V offers an ideal compromise between efficiency and safety. There is no need for elaborate safety measures, which renders the voltage class suitable for everyday applications. Highly integrated gallium nitride (GaN) components and systems are the ideal solution for 48 V technology. Compared to silicon (Si), GaN has significantly better physical properties for power electronics. In addition, GaN technology allows entire circuit components to be integrated on a chip. Researchers at Fraunhofer IAF have developed various highly integrated GaN circuits and pioneering integration concepts for low-voltage applications.16.06.2021 07:00:00Junnews_2021-07-01_2.jpg\images\news_2021-07-01_2.jpghttps://www.iaf.fraunhofer.de/en/media-library/press-releases/gan-low-voltage-ics.htmliaf.fraunhofer.de
Expanding Product Family with Latest 80 V and 200 V OfferingsEPC advances the performance capability while lowe...9321Product ReleaseExpanding Product Family with Latest 80 V and 200 V OfferingsEPC advances the performance capability while lowering the cost for off-the-shelf gallium nitride transistors with the introduction of EPC2065 and EPC2054. The EPC2065 is an 80 V, 3.6 m?, 221 Apulsed eGaN FET in a 7.1 mm2 chip-scale package. The small size and superior efficiency reduce overall power system size and weight and make it ideal for 32V-48V BLDC motor drive applications for eMobility ebike and escooters, service, delivery, logistic robots, and drones. In these applications the driver is integrated with the motor and miniaturization is a key factor. The ability to operate with significantly shorter dead times results in less noise and less EMI. The device is capable of high frequency operation to achieve the highest density for high frequency DC-DC converters for computing and industrial applications and for synchronous rectification. The EPC2054 is a 200 V, 3.6 m?, eGaN FET in a tiny 1.69 mm2 chip-scale package. The device can deliver 32 A pulsed current is an extremely small size, with very fast on-off transition times and super small capacitance and inductances, that make it ideal for industrial Lidar/ToF applications. The low resistance, low switching losses, no reverse recovery charge, fast switching, high frequency capability, and the tiny footprint make the EPC2054 a cost effective and high-density solution for a wide range of applications including, but not limited to, high frequency DC-DC, synchronous rectification, wireless power, class-D audio, Automation, Solar and Optical.15.06.2021 19:30:00Junnews_2021-07-01_25.jpg\images\news_2021-07-01_25.jpghttps://epc-co.com/epc/EventsandNews/News/ArtMID/1627/ArticleID/2995/EPC-Expands-High-Performance-eGaN-FET-Product-Family-with-Latest-80-V-and-200-V-Offerings.aspxepc-co.com
Cooperation to Deliver Silicon Carbide TechnologiesEBV Elektronik announced it is working closely wit...9299Industry NewsCooperation to Deliver Silicon Carbide TechnologiesEBV Elektronik announced it is working closely with Infineon on the manufacturer's leading-edge silicon carbide (SiC) based CoolSiC technology, which delivers key benefits for engineers designing advanced power systems across a wide selection of market sectors and applications. Infineon and EBV will cooperate over the next year and beyond to accelerate the deployment of energy-efficient power devices with CoolSiC technologies. The CoolSiC portfolio ranges from SiC-based diodes and discrete MOSFETs to hybrid and full SiC modules. "The SiC market is expected to grow at a CAGR of 30 percent over the next 5 years. Infineon is dedicated to participating in this growth for SiC technology leveraging distribution channels that share the same ambition," said PY Ferrard, Corporate Vice President Distribution & EMS at Infineon. "And we anticipate that EBV can be a cornerstone of our strategy to realise our goals for our CoolSiC portfolio, which provides designers with the ability to realise ever-lower costs and higher efficiency in power conversion systems in fast-growing markets and applications." "It speaks volumes that Infineon, a world leader in silicon carbide and power technologies, has chosen EBV as its first distributor to run a dedicated programme on CoolSiC technology," said Thomas Staudinger, President at EBV Elektronik. "It is a clear demonstration of both our know-how and the global reach of Avnet in critically important power electronics applications." Learn more about EBV's and Infineon's joint CoolSiC initiative.15.06.2021 08:00:00Junnews_2021-07-01_3.jpg\images\news_2021-07-01_3.jpghttps://www.avnet.com/wps/portal/ebv/products/product-highlights/infineon-coolsic/avnet.com
Sensors for the Electric Motors IndustryRVmagnetics as a technology company has issentiall...9308Product ReleaseSensors for the Electric Motors IndustryRVmagnetics as a technology company has issentially managed to overcome shortcomings of other sensor solutions in various industries (civil engineering, electric motors, energy, composites, etc.), and is favored by the clients, that used to have no way to gather physical data that they needed, with the accuracy they needed. RVmagnetics addresses these needs with a unique sensing technology. The MicroWire sensor is thin like a human hair, and it can provide measurements of temperature, pressure, tension, torsion, position, electric current and magnetic field. It is important to mention that the measurements can be gathered in contactless manner, in real-time. Producing these MicroWires at an industrial scale is also not an issue for RVmagnetics as the company can manufacture 100,000 MicroWire sensors in ten minutes. One of the industries the company is actively integrated in currently is the Electric Motors industry. RVmagnetics can custom develop a sensing system that provides real-time measurements of different parts of electric motors, thus creating a Predictive Maintenance and Structural Health Monitoring opportunities with extreme accuracy. Significant benefits of RVmagnetics sensing system are measures in the real-time, increased efficiency and effectiveness by maximizing the potential of physical limits, it helps decrease power consumption, measures temperature, position, RPM with one communication interface, it detects faults inside of the motor – and helps optimizing predictive maintenance.15.06.2021 06:30:00Junnews_2021-07-01_12.png\images\news_2021-07-01_12.pnghttp://www.rvmagnetics.com/rvmagnetics.com
Search Capability Helps Designing ElectronicsSnapEDA and DesignSpark are launching a collabora...9307Industry NewsSearch Capability Helps Designing ElectronicsSnapEDA and DesignSpark are launching a collaboration to help engineers design faster, regardless of which PCB design tool they use. The collaboration will augment the DesignSpark website with the SnapEDA search engine, allowing engineers to discover and design-in millions of electronic components through free computer-aided design (CAD) models that are compatible with nearly all major PCB design tools. With over a billion electronic components in production, part selection and design-in are significant bottlenecks when designing electronics. In addition to the sheer volume of parts to choose from, engineers need to procure sophisticated digital models for each component in their designs. This prerequisite for complex design content is a burden on engineers that ampers innovation. The new SnapEDA search experience on the DesignSpark website makes it easy for engineers to search and design-in electronic components, allowing engineers to jump straight to design. Engineers can search for a keyword like 'bluetooth' or 'usb type c' to discover new components, or enter a specific part number. Once they've selected a product, they can download the CAD model instantly. "Since launching DesignSpark 11 years ago, RS Components has demonstrated its commitment to supporting the engineering community through tools and resources," said Natasha Baker, Founder and CEO of SnapEDA.14.06.2021 16:00:00Junnews_2021-07-01_11.png\images\news_2021-07-01_11.pnghttps://www.rs-online.com/designspark/snapeda-parts-finderrs-online.com
Transfer-Molded Modules Simplify Compact Motor Drive DesignON Semiconductor announces integrated, converter-i...9341Product ReleaseTransfer-Molded Modules Simplify Compact Motor Drive DesignON Semiconductor announces integrated, converter-inverter-power factor correction (PFC) modules for use in industrial motor drives, servo drives and HVAC where they are used to drive motors for applications including fans and pumps. The NXH50M65L4C2SG and NXH50M65L4C2ESG are transfer-molded power integrated modules (TMPIM) based upon standard aluminum oxide (AI2O3) substrate and enhanced low thermal resistance substrate respectively. Ideally suited to rugged industrial applications with high output power, the modules contain a converter-inverter-PFC circuit consisting of single-phase converter with four 75 A, 1600 V rectifiers. The 3-phase inverter uses six 50 A, 600 V IGBTs with inverse diodes and the dual-channel interleaved PFC comprises two 75 A, 650 V PFC IGBTs with inverse diodes and two 50 A, 650 V PFC diodes. An NTC thermistor is embedded to allow for monitoring of device temperature during operation. As the module is pre-assembled in an optimized layout and configuration, parasitic elements are very small when compared with discrete PCB-based designs, thereby allowing a wide PFC switching frequency range between 18 kHz and 65 kHz. The highly efficient NXH50M65L4C2SG and NXH50M65L4C2ESG are rated at 50 A permitting use in applications up to 8 kW, and are the latest devices in the ON Semiconductor TMPIM family. Other devices are available with current ratings of 20 A and 30 A. A silicon carbide (SiC) option is also available for further increased switching frequency and efficiency.14.06.2021 15:30:00Junnews_2021-07-15_19.jpg\images\news_2021-07-15_19.jpghttps://www.onsemi.com/PowerSolutions/newsItem.do?article=1000919onsemi.com
48V / 12V Bi-Directional DC-DC ConverterDelta recently unveiled its High Power Density Bi-...9295Product Release48V / 12V Bi-Directional DC-DC ConverterDelta recently unveiled its High Power Density Bi-Directional DC-DC Converter U50SU4P162 for data centers, super computers, and other high-tech systems. Emphasizing the requirement of high-efficiency, high-density data centers, the U50SU4P162 provides 48V / 12V bi-directional conversion, and features high power density of up to 3,000 W/inch3 with a small footprint (23*17.4*10 mm) and up to 98% conversion efficiency. The U50SU4P162 DC-DC Converter provides 48V / 12V bi-directional conversion, 800 W output power, and 1 MHz switching frequency. The ultra-high power density (up to 3,000 W/inch3) allows the U50SU4P162 to achieve 98% power conversion efficiency in a compact size of 23*17.4*10 mm. The ability of handling large load capacitance (up to 10,000 µF) and double-sided heat sink with low thermal resistance also help to ensure high-performance computing for high-density data centers. Another highlighted feature of the U50SU4P162 is the PMBus (power management bus) protocol. It allows the converter to transmit power data to system controllers for efficient monitoring and management. Delta is also outpacing others by offering customization services for power configuration and optional heat sinks to help customers build advanced systems. With advanced functions, high power density, small footprint, and customizability, the U50SU4P162 ensures the high efficiency of data centers, super computers, and other high-tech systems.10.06.2021 20:30:00Junnews_2021-06-15_25.jpg\images\news_2021-06-15_25.jpghttps://www.delta-emea.com/news/pressDetail_preview.aspx?secID=3&pID=1&tid=0&typeID=2&itemID=14273&hl=en-GBdelta-emea.com
High Power Anti-Surge Pulse Power ResistorsKOA Speer Electronics is adding a high power 0402 ...9344Product ReleaseHigh Power Anti-Surge Pulse Power ResistorsKOA Speer Electronics is adding a high power 0402 size to their SG73P series of anti-surge, pulse precision thick film chip resistors. The SG73P1EW has a power rating of 0.25 watt with a TCR as low as ±100ppm/°C. This represents a 100% increase in power compared to the existing SG73P 0402 package. The SG73P1EW provides greater power and precision in a 0402 package size. The SG73P1EW resistors offer a range of resistance values from 1O to 10MO and an operating temperature range of -55°C ~ +155°C. The pulse power SG73P1EW resistors are available with resistance tolerances of ±0.5%, ±1%, ±2%, and ±5%. The new SG73P1EW resistors are AEC-Q200 qualified. The increased power capabilities of the SG73P1EW resistors enable engineers to downsize circuits and reduce the number of components required for their design. These anti-surge endured pulse power resistors provide high-precision control of high voltage circuits, making them an excellent choice for ECU use in automotive electronics, ADAS, industrial devices, and power supplies.10.06.2021 18:30:00Junnews_2021-07-15_22.jpg\images\news_2021-07-15_22.jpghttps://www.koaspeer.com/news/2021/107/KOA_Speer_Introduces_New_High_Power_0402_Anti-Surge_Pulse_Power_Resistors/koaspeer.com
Miniature Buck Converter Delivers 4ARECOM has added a 4A option to its RPX series of m...9318Product ReleaseMiniature Buck Converter Delivers 4ARECOM has added a 4A option to its RPX series of miniature buck converters. The RPX-4.0 is rated to 3.8 to 36V input and programmable 1 to 7V output at 4A. With a compact 5mm x 5.5mm footprint and low 4.1mm height in a thermally-enhanced QFN package, the buck module pushes the limit on power density. The product features on-off control, a power good signal, and soft start, and is fully protected including under-voltage, short-circuit, over-current, and over-temperature. The RPX-4.0 efficiency is high, allowing full power operation up to 65°C and derated operation up to 90°C. Construction follows the RECOM '3D Power Packaging' technology for high power density, with flip-chip on leadframe construction, an integrated shielded inductor for low EMI, and intelligent control of switching frequency to maintain high efficiency even at light load. The RPX-4.0 needs just voltage setting resistors and input/output capacitors for a complete high-performance solution and is delivered with the RECOM 3-year warranty. An evaluation board, RPX-4.0-EVM-1, is also available, allowing customers to exercise all of the product features and optimize filtering to meet target system requirements. "We are excited to launch the latest in our RPX series of buck converters" commented Matthew Dauterive DC/DC product manager of RECOM, "Users will find it particularly suitable for industrial automation, test and measurement, portable devices, and high density or weight-sensitive applications".10.06.2021 16:30:00Junnews_2021-07-01_22.jpg\images\news_2021-07-01_22.jpghttps://recom-power.com/en/company/newsroom/news/rec-n-miniature-buck-converter-delivers-4a-161.html?3recom-power.com
Finalists Impressed with Smart and Modular Energy Storage Solutions Batteries and energy storage systems are key compo...9304Event NewsFinalists Impressed with Smart and Modular Energy Storage Solutions Batteries and energy storage systems are key components of the future energy world. As the finalists of this year's ees AWARD demonstrated, there is plenty of optimization potential in transportation and installation in particular. The winners were crowned at an online ceremony as part of The smarter E Industry Days held in July 2021. An industry cannot move forward without innovation. That's why companies have been rewarded for their pioneering solutions and projects with the storage industry's innovation prize, the ees AWARD, since 2014. This year, the ees, Intersolar, and The smarter E AWARD was presented online on July 21, 2021 as part of The smarter E Industry Days. Innovation within companies reveals the industry trends – think environmentally friendly battery cells, smart transport and software solutions, and component modularization – and covers the entire supply chain for battery and energy storage technology. Energy storage systems and batteries have huge potential for optimization and savings in transportation and installation in particular. The modularization of heavy components for transportation and installation cuts down on the manpower required, while also saving on resources needed for repairs. With a shift to pre-assembly and smart transport and software solutions on board, installation is simplified and the amount of packaging needing to be disposed of at the installation site is reduced. Environmentally friendly battery cells are still very much on trend. Lithium-iron-phosphate cells or NMC cells with a lower proportion of cobalt are used in many storage systems. The future performance of a battery can now be predicted with a high degree of accuracy via cloud-based analyses of battery operating data.10.06.2021 13:00:00Junnews_2021-07-01_8.jpg\images\news_2021-07-01_8.jpghttps://www.thesmartere-award.com/en/home/press-releases/press-release-details?tx_news_pi1%5Bnews%5D=4309&cHash=741644693298364b4aaaa99b21219758thesmartere-award.com
EMV 2022 Call for PapersIn preparation for the next EMV event, experts in ...9327Event NewsEMV 2022 Call for PapersIn preparation for the next EMV event, experts in electromagnetic compatibility are invited to actively design the conference and workshop program. The event is to be held in Cologne from 15 to 17 March 2022. Representatives from academia and industry can now submit proposals for the EMV, Europe's most significant electromagnetic compatibility event. Abstract submissions are possible until 13 September 2021. Speakers can now hold conference presentations in English or, as before, in German. In addition, those interested can choose between two forms of participation in the conference, which differ mainly in terms of the time required and the citation eligibility:<br>1.      Speakers can submit an abstract as usual and later a full paper. The full paper will be published in the conference proceedings and in the repository with DOI number (Open Access) as a citable publication.<br>2.      In the Call for Papers, submissions without a full paper are now also accepted. These do not have to be a first publication. <br><br>Depending on the scope, thematic structure and target group, it is possible to submit an abstract for a 20-minute contribution at the conference, or to apply for an approximately three-hour, practice-oriented workshop.10.06.2021 10:00:00Junnews_2021-07-15_5.jpg\images\news_2021-07-15_5.jpghttps://emv.mesago.com/stuttgart/en/press/press-releases/emv-press-releases/emv2022-call-for-papers.htmlemv.mesago.com
Global Manufacturer and Supplier of Magnetic Components AcquiredKAMIC Group AB has acquired all the shares in Tale...9300Industry NewsGlobal Manufacturer and Supplier of Magnetic Components AcquiredKAMIC Group AB has acquired all the shares in Talema Group LLC ("Talema"). The seller is an owner consortium consisting of the Park and Daily families. Talema is a manufacturer of magnetic components such as transformers, toroids, inductors and chokes with associated design work. The majority of components are developed specifically for bespoke customer applications but standard components are also offered. The company's customers are found across a broad spectrum of sectors where the most important include logistics and warehousing, freight and transport, audio, and renewable energy. Talema was founded in 1975 and has its registered office in the USA but operational management is based at the head office in Donegal in north-west Ireland. The company has its own production facilities in the Czech Republic and India. Sales are conducted through own sales offices in the USA, Germany, Czech, India and Ireland as well as a global network of agent and distributors. Talema has approximately 750 employees and annual sales of about EUR 12 million. "Talema is a highly respected global player with strong skills in the design, development and production of magnetic components. They have an experienced and powerful management and the company's customer base and geographic presence provide an ideal complement to our existing business in this area. Talema therefore is ideally placed to be a valuable addition to our corporate group," says Fredrik Celsing, President and CEO of KAMIC Group.09.06.2021 09:00:00Junnews_kamic-group.jpg\images\news_kamic-group.jpghttps://www.kamicgroup.com/en/acquisition-talema-group-global-supplier-magnetic-componentskamicgroup.com
Launch of B0 Diode and Thyristor ModulesThe team of Proton-Electrotex is happy to announce...9310Product ReleaseLaunch of B0 Diode and Thyristor ModulesThe team of Proton-Electrotex is happy to announce the launch of serially produced single-component diode and thyristor modules B0. The design of B0 modules provides improved electrical and thermal parameters allowing to achieve IFAV / ITAV values up to 700 A. The VDRM / VRRM voltage range varies from 1000 to 6500V. At the same time, the modules have an industry standard housing with a baseplate width of 50 mm making it easier to use them in existing equipment. The modules are designed for use in energy converters, as well as other DC and AC circuits of various power electrical units. The main applications of the B0 modules are the electric drive control systems, rectifier bridges, AC controls, DC motor control, power supplies. Proton-Electrotex offers various options for customization of products, taking into account the individual requirements of each customer to parameters, connections and appearance of the semiconductors.09.06.2021 08:30:00Junnews_2021-07-01_14.jpg\images\news_2021-07-01_14.jpghttps://en.proton-electrotex.com/news/new-module-b0proton-electrotex.com
Series of Programmable DC Power SuppliesMagna-Power expanded its SL Series programmable DC...9322Product ReleaseSeries of Programmable DC Power SuppliesMagna-Power expanded its SL Series programmable DC power supply product line with the introduction of 18 models at 10 kW rated output power, while maintaining the product line's 1U (1.75" high) rack-mount form factor. The SL Series continues to lead 1U rack-mount programmable DC power supply power density, enabling extremely power dense rack-mount integrations, with continuous full-power operating at ambient operating temperatures from -25°C to 50°C and zero clearance required on top and bottom. The 18 new SL Series models span rated voltages up to 1500 Vdc and rated currents up to 250 Adc, with three-phase AC input options including: 208 Vac, 240 Vac, 380/400 Vac, 415 Vac, 440 Vac, or 480 Vac. All SL Series models come standard with monitoring and control from a variety of sources, including: front panel, computer interface and an isolated analog-digital I/O connector for PLC integration. A Standard Commands for Programmable Instrumentation (SCPI) command set is supported for control from virtually any programming language, including Python. In addition, an IVI driver is included for the Visual Studio programming environment along with a dedicated National Instruments LabVIEW and LabWindows driver. Additional computer interface options include LXI TCP/IP Ethernet (+LXI), IEEE-488 GPIB (+GPIB), USB and RS-485. With the Ruggedized (+RUG) option, the SL Series meets MIL-STD-810G shock and vibration standards. Ultra-high stability and precision applications, such as for magnet steering, can be met by combining the SL Series with the DBx Module. Similarly, high-power battery charging or back-emf protection can be achieved in combination with the BDx Module.08.06.2021 20:30:00Junnews_2021-07-01_26.jpg\images\news_2021-07-01_26.jpghttps://magna-power.com/company/news/2021-06-08-programmable-dc-power-supplies-to-10-kw-in-1umagna-power.com
MOSFET Qualified for Commercial and Military Satellites and Space Power SolutionsMicrochip Technology announced the qualification o...9292Product ReleaseMOSFET Qualified for Commercial and Military Satellites and Space Power SolutionsMicrochip Technology announced the qualification of its M6 MRH25N12U3 radiation-hardened 250V, 0.21 Ohm Rds(on), metal–oxide–semiconductor field-effect transistor (MOSFET) for commercial aerospace and defense space applications. The MOSFET withstands the harsh environments of space, extends reliability of power circuitry and meets all requirements of MIL-PRF19500/746 with enhanced performance. Microchip completed testing for Defense Logistics Agency (DLA) review and qualification, for the device's sourcing in the U.S. military supply chain (expected JANSR2N7593U3 certification in June 2021). The M6 MRH25N12U3 MOSFET is designed for future satellite system designs as well as serving as an alternate source in existing systems. It can withstand total ionizing dose (TID) up to 100 krad and 300 krad and single event effects (SEE) with linear energy transfer (LET) up to 87 MeV/mg/cm2. It provides 100-percent wafer lot radiation hardness assurance in validation tests. "Microchip's entry into the radiation-hardened MOSFET market reflects our long-term commitment to support our customer base and provide aerospace and defense OEMs and integrators with high-performance solutions and continuous supply," said Leon Gross, vice president of Microchip's Discrete Product Group business unit. "In addition to our proven quality and reliability, the M6 MRH25N12U3 provides a value pricing option for developers and offers them full application support."08.06.2021 17:30:00Junnews_2021-06-15_22.jpg\images\news_2021-06-15_22.jpghttps://www.microchip.com/en-us/about/news-releases/products/radiation-hardened-mosfet-qualified-for-commercial-and-military-microchip.com
MOSFET Qualified for Commercial and Military SatellitesMicrochip Technology announced the qualification o...9317Product ReleaseMOSFET Qualified for Commercial and Military SatellitesMicrochip Technology announced the qualification of its M6 MRH25N12U3 radiation-hardened 250V, 0.21 Ohm Rds(on), metal–oxide–semiconductor field-effect transistor (MOSFET) for commercial aerospace and defense space applications. It provides the primary switching element in power conversion circuits including point-of-load converters, DC-DC converters, motor drives and controls and general-purpose switching. The MOSFET withstands the harsh environments of space, extends reliability of power circuitry and meets all requirements of MIL-PRF19500/746 with enhanced performance. Microchip completed testing for Defense Logistics Agency (DLA) review and qualification, for the device's sourcing in the U.S. military supply chain (expected JANSR2N7593U3 certification in June 2021). The M6 MRH25N12U3 MOSFET is designed for future satellite system designs as well as serving as an alternate source in existing systems. The device can withstand total ionizing dose (TID) up to 100 krad and 300 krad and single event effects (SEE) with linear energy transfer (LET) up to 87 MeV/mg/cm2. It provides 100-percent wafer lot radiation hardness assurance in validation tests. "Microchip's entry into the radiation-hardened MOSFET market reflects our long-term commitment to support our customer base and provide aerospace and defense OEMs and integrators with high-performance solutions and continuous supply," said Leon Gross, vice president of Microchip's Discrete Product Group business unit. "In addition to our proven quality and reliability, the M6 MRH25N12U3 provides a value pricing option for developers and offers them full application support."08.06.2021 15:30:00Junnews_2021-07-01_21.jpg\images\news_2021-07-01_21.jpghttps://www.microchip.com/en-us/about/news-releases/products/radiation-hardened-mosfet-qualified-for-commercial-and-military-microchip.com
Support Site for Designers: Ensuring Functional Safety in VehiclesROHM's website consolidates 1,000 products under t...9305Industry NewsSupport Site for Designers: Ensuring Functional Safety in VehiclesROHM's website consolidates 1,000 products under the ComfySIL brand to support functional safety in automotive systems. Improving the searchability of products and various documents contributes to greater work efficiency for electronic circuit and system designers in the automotive field. In recent years, following the acceleration of technical innovation represented by ADAS (Advanced Driver Assistance System) in the automotive sector, it has become necessary to consider functional safety to help prevent accidents. At the same time, in response to the increasing importance to ensure vehicle safety by supporting safety requirements at the device level for onboard electrical systems, a 2nd edition of ISO 26262, the international standard for functional safety, was released in December 2018 that adds a chapter on semiconductor. ROHM quickly responded to these needs, and in March 2018 successfully acquired ISO 26262 development process certification from 3rd party certification body TÜV Rheinland. Since then, ROHM gradually expanded its portfolio to include documents required for functional safety design, and currently features a lineup of more than 1,000 compatible part numbers. This new special site consolidates functional safety compliant products under the brand name ComfySIL that will be used on the web and relevant documents to significantly improve product searchability. The ComfySIL brand targets not only vehicles, but also functional safety for other markets as well, and going forward we will expand our lineup products that support functional safety for the industrial equipment field as well.08.06.2021 14:00:00Junnews_2021-07-01_9.jpg\images\news_2021-07-01_9.jpghttps://www.rohm.com/news-detail?news-title=ensuring-functional-safety-in-vehicles&defaultGroupId=falserohm.com
Packages Improved Robustness and Thermal PerformanceApplications such as e-scooters, e-forklifts and o...9288Product ReleasePackages Improved Robustness and Thermal PerformanceApplications such as e-scooters, e-forklifts and other light electric vehicles (LEVs), as well as power tools and battery management systems, demand high current rating, ruggedness and extended lifetime. Infineon Technologies addresses these requirements by offering more choices to power system designers to meet diverse design needs and achieve maximum performance in the smallest space. With the TO-Leadless (TOLL) package, Infineon now offers two OptiMOS power MOSFET packages in the TOLx family: TOLG (TO-Leaded with Gullwing leads) and TOLT (TO-Leaded Top-side cooling). Together, the TOLx family offers very low R DS(on) and a high-current rating over 300 A to increase system efficiency in high-power density designs. <br>The TOLG package combines the best features of TOLL and D 2PAK 7-pin packages, sharing the same 10 x 11 mm 2 footprint and electrical performances as TOLL with added flexibility comparable to D 2PAK 7-pin. The main advantages of TOLG are particularly apparent in designs with aluminum-insulated metal substrate (Al-IMS) boards. <br>The TOLT package is optimized for superior thermal performance. Constructed with its lead-frame flipped to position exposed metal on the top side, the package contains multiple gullwing leads on each side for high current carrying drain and source connections. With a flipped lead-frame, heat passes from the exposed metal top side, through the insulating material, directly to the heatsink.08.06.2021 13:30:00Junnews_2021-06-15_18.jpg\images\news_2021-06-15_18.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2021/INFPSS202106-076.htmlinfineon.com
New Role for Andreas Karch: Technologist Advanced ApplicationsIndium Corporation is proud to announce the new ro...9302PeopleNew Role for Andreas Karch: Technologist Advanced ApplicationsIndium Corporation is proud to announce the new role of one of its foremost industry experts, Andreas Karch. Karch is currently technical manager for Germany, Austria, and Switzerland and will also have the title of technologist – advanced applications. Throughout his five years with Indium Corporation, Karch has demonstrated his expertise and willingness to engage in complex technical projects with high profile customers; share his expertise in German automotive electronics committees; and project partner with key co-suppliers. Through these activities, he has promoted the use of Indium Corporation's products and built its reputation in Europe. "Since joining the Indium Corporation family, Andreas has been a key member of our European team," said Brian Craig, managing director of Indium Corporation's European operations. "This addition to his title reflects the evolution of his responsibilities and his well-regarded ability to connect with customers, industry consortia, and thought leaders." Karch will continue to provide technical support, share process knowledge, and make recommendations on the use of Indium Corporation's products in key industries. Karch joined Indium Corporation in April 2016. He has more than 25 years of automotive industry experience in PCB assembly and power electronics. His professional successes include receiving an award for the top 10 innovative patents for an automotive LED assembly; being certified as an ECQA integrated design engineer; and earning his Six Sigma Yellow Belt. 08.06.2021 11:00:00Junnews_2021-07-01_6.jpg\images\news_2021-07-01_6.jpghttps://www.indium.com/corporate/media-center/news/indium-corporation-announces-new-role-for-karch/indium.co
ESD Solutions with High-Trigger VoltageAlpha and Omega Semiconductor introduced the AOZ8S...9335Product ReleaseESD Solutions with High-Trigger VoltageAlpha and Omega Semiconductor introduced the AOZ8S303BLS-24 and AOZ8S305BLS-24, a series of single-channel Transient Voltage Suppressor (TVS) for high-speed line protection using the best-in-class low capacitance TVS platform. The products are ideal for Electrostatic Discharge (ESD) protection of Type-C connectors in mobiles, laptops, televisions, and other electronic devices. USB Type-C with PD (Power Delivery) has become a standard power and data interface of notebook PCs and smartphones, and the voltage range is defined as variable from 5V to 20V. For fast charging such as USB Power Delivery and Quick Charger, traditional TVS diodes for USB protection with breakdown voltage lower than 20V risk getting shorted or damaged. Hence, the corresponding Type-C port will inactivate permanently. To solve this common market problem, AOS proposes two TVS, AOZ8S303BLS-24 and AOZ8S305BLS-24. Their high reverse working voltage covers the whole voltage range from a USB-PD port. In addition, the Ultra-Low-Clamping Voltage and Capacitance are optimized for ESD protection in high-speed lines, including but not limited to USB, Thunderbolt, HDMI, and PCI Express, by minimizing the capacitance effect. "Type-C connectors are widely applied in electronics devices. The new products housed in a standard WLCSP0.6x0.3-2 (0201) package, and its small form factor is ideal for high-speed differential signals in Type-C. Both AOZ8S303BLS-24 and AOZ8S305BLS-24 will not only contribute to reducing the ESD failure rate but also reducing the failure of Short-to-VBUS in our partners' and customers' electronic products," said Michael K. S. Ng, Sr. Marketing Manager of the TVS product line at AOS.08.06.2021 09:30:00Junnews_2021-07-15_13.jpg\images\news_2021-07-15_13.jpghttp://www.aosmd.com/res/news/news-article-1623165272932/AOZ8S303-305BLS-24%20PR.pdfaosmd.com/pdf
Wafer Fab of the Future in DresdenIn Dresden, Bosch is opening one of the world's mo...9275Industry NewsWafer Fab of the Future in DresdenIn Dresden, Bosch is opening one of the world's most modern wafer fabs. Highly automated, fully connected machines and integrated processes, combined with methods of artificial intelligence (AI) will make the Dresden plant a smart factory and a trailblazer in Industry 4.0. In the virtual presence of Federal Chancellor Dr. Angela Merkel, the high-tech facility was officially inaugurated on June 7, 2021. "The new Bosch wafer fab will boost our capacity in microelectronics. Microelectronics is the basis for nearly every promising technology, for applications of artificial intelligence, for quantum computing, and for automated and connected driving – which is also a Bosch specialty," said Federal Chancellor Dr. Angela Merkel. "The new wafer fab is the single largest investment in the company's history. This cannot be stressed too much. Its size and additional production capacity alone are impressive. The very latest methods of data-driven continuous improvement in production make the Dresden plant a smart factory. To put it another way: in this plant, natural and artificial intelligence have joined forces with the internet of things to form a productive symbiosis." Production in Dresden will start as early as July – six months earlier than planned. From that time on, semiconductors made in the new plant will be installed in Bosch power tools. For automotive customers, chip production will start in September, and thus three months earlier than planned. The new factory will be an important part of the semiconductor manufacturing network. With it, Bosch is strengthening Germany's position as a technology and business location. On 72,000 square meters of floor space, 250 people are already working in the wafer fab in Saxony's state capital. The workforce is set to grow to roughly 700 once construction work has been completed.07.06.2021 08:00:00Junnews_2021-06-15_3.jpg\images\news_2021-06-15_3.jpghttps://www.bosch-presse.de/pressportal/de/en/bosch-opens-wafer-fab-of-the-future-in-dresden-230080.htmlbosch.de
International Electron Devices Meeting Announces Call for PapersUnder the theme "Devices for a New Era of Electron...9280Event NewsInternational Electron Devices Meeting Announces Call for PapersUnder the theme "Devices for a New Era of Electronics: From 2D Materials to 3D Architectures," the 67th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers. The 2021 IEDM is being planned as an in-person conference December 11–15, 2021 at the Hilton San Francisco Union Square hotel, with on-demand access after the event for those who are unable to travel due to COVID-19 restrictions. The paper submission deadline is Friday, July 23, 2021. Authors are asked to submit four-page camera-ready papers. Accepted papers will be published as-is in the proceedings. A few late-news papers also will be accepted, covering only the most recent and noteworthy developments. The late-news submission deadline is August 30, 2021. "IEDM is currently being planned as an in-person event in San Francisco in December with on-demand access to content available after the event, although meeting plans are subject to change to stay in compliance with COVID-19 guidelines," said Meng-Fan (Marvin) Chang, IEDM 2021 Publicity Chair and IEEE Fellow, Distinguished Professor of Electrical Engineering at National Tsing Hua University, and Director of Corporate Research at TSMC. "Should an in-person meeting not be feasible, IEDM will go fully virtual. Additional details will be made available later this year." "Our theme this year was chosen to emphasize the many changes sweeping across the electronics industry and the diverse technologies that are enabling them," said Srabanti Chowdhury, IEDM 2021 Publicity Vice Chair and Associate Professor of Electrical Engineering at Stanford University. "IEDM 2021 will continue its long tradition of having a rich technical program full of relevant, state-of-the-art results, and the conference will give attendees the opportunity to interact with colleagues from academia and industry around the world."04.06.2021 14:00:00Junnews_2021-06-15_10.jpg\images\news_2021-06-15_10.jpghttps://www.ieee-iedm.org/call-for-papers-overviewieee-iedm.org
750V SiC MOSFETs Offer Performance and ReliabilityGeneSiC's next-generation 750V G3RSiC MOSFETs will...9281Product Release750V SiC MOSFETs Offer Performance and ReliabilityGeneSiC's next-generation 750V G3RSiC MOSFETs will deliver unprecedented levels of performance, robustness and quality. System benefits include low on-state drops at operating temperatures, faster switching speeds, increased power density, minimal ringing (low EMI) and compact system size. GeneSiC's G3R, offered in optimized low-inductance discrete packages (SMD and through hole), are optimized to operate with lowest power losses under all operating conditions and ultra-fast switching speeds. These devices have substantially better performance levels as compared to contemporary SiC MOSFETs. "High-efficiency energy usage has become a critical deliverable in next-generation power converters and SiC power devices continue to be the key components driving this revolution. After years of development work towards achieving the lowest on-state resistance and robust short circuit and avalanche performance, we are excited to release the industry's best performing 750V SiC MOSFETs. Our G3R enable power electronics designers to meet the challenging efficiency, power density and quality goals in applications like solar inverters, EV on-board chargers and server/telecom power supplies. An assured quality, supported by fast turn-around and automotive-qualified high volume manufacturing further enhances their value proposition. " said Dr. Ranbir Singh, President at GeneSiC Semiconductor.04.06.2021 06:30:00Junnews_2021-06-15_11.png\images\news_2021-06-15_11.pnghttps://www.genesicsemi.com/press-release-G3R-750V-sic-mosfet/genesicsemi.com
Using GaN Transistors to Develop DC/DC ConvertersWith its VALUE DC-DC product line, BrightLoop Conv...9279Industry NewsUsing GaN Transistors to Develop DC/DC ConvertersWith its VALUE DC-DC product line, BrightLoop Converters is aiming to democratize access to performance and offer a range of converters dedicated to off-highway and commercial vehicles. The French player in power electronics is teaming up with Efficient Power Conversion (EPC) to deliver the upcoming VALUE product line. BrightLoop Converters has gained experience from many years of development for motorsport applications and learned to make the most out of GaN technology to deliver highly reliable, extremely light and compact converters. The company released in 2020 a PERFORMANCE DC-DC product line offering great versatility to extreme vehicle applications and motorsports. After demonstrating that GaN technology can significantly improve performance, the French company now wants to prove that using this technology does not necessarily lead to higher costs. With the launch of the new VALUE product line later this year, the strategy is clear: make performance accessible to these markets, which are now also looking for lightweight, space-saving and high-performance converters in the most cost-effective way. Florent Liffran, CEO of BrightLoop Converters commented: "We are proud to bring our expertise along with EPC's top technology to the commercial and off-highway markets. Our focus has always been to push the limits of performance further and with this new VALUE product line, our goal is clearly to bring our know-how to markets which have historically worked with heavy and bulky power electronics, making it possible for them to have a taste of outstanding performance, versatility and power density while remaining in their price range."03.06.2021 13:00:00Junnews_2021-06-15_8.png\images\news_2021-06-15_8.pnghttps://www.brightloop.fr/en/dcdcbrightloop.fr
Chokes for Medical Technology ApplicationsSMP Sintermetalle Prometheus (SMP) offers chokes f...9286Product ReleaseChokes for Medical Technology ApplicationsSMP Sintermetalle Prometheus (SMP) offers chokes for medical technology applications. These inductive components are used in Magnetic Resonance Imaging (MRI) or Computed Tomography (CT), for example. Designed as filter or mains chokes they are not only compact, low-loss and energy efficient but also exceptionally quiet in operation – essential qualities for demanding medical technology applications. In MRI scanners, the components are installed in the "gradient amplifiers", which supply output voltages and currents and control the gradient coils that encode the resonance signals for subsequent image reconstruction. The filter and mains chokes are designed to ensure a clean sinusoidal waveform and low-loss feedback of the unused energy. Special magnetostriction-free materials, which SMP develops and produces according to individual customer specifications, ensure that components run very quietly. The powder composite materials feature low eddy current and magnetic reversal losses. The components are noted for their low loss balances and optimal EMC properties. They are also maintenance-free. The three-dimensional isotropy of the materials enables compact, lightweight structures, because the magnetic circuits are minimized. This also lowers the magnetic field strength, and the quantity of winding material used can be significantly reduced. The materials have a high saturation induction of up to 2 Tesla. The oscillation behaviour of the choke can be adjusted specifically by using certain materials or appropriate, magnetically coupled designs with multiple coils.02.06.2021 11:30:00Junnews_2021-06-15_16.jpg\images\news_2021-06-15_16.jpghttp://www.smp.de/en/homesmp.de
Regulated SIP8 DC/DC ConvertersRECOM has announced the launch of the RS3E family ...9283Product ReleaseRegulated SIP8 DC/DC ConvertersRECOM has announced the launch of the RS3E family of DC/DC converters in an industry-standard SIP8 format and pin-out. The parts are rated at 3W with no derating to 70°C and feature 2:1 input ranges of 4.5-9V, 9-18V, 18-36V and 36-72V. Fully regulated outputs available are 3.3V, 5V, 9V, 12V, 15V and 24V. Isolation is 3kV (one minute) and the parts hold IEC/UL/CSA 62368-1 safety certification up to 5000m altitude while meeting EN 55032/FCC class B and EN 55035 EMI standards. The RS3E family features short circuit protection, high MTBF of 1.8M hours and a control input to place the converters in a low-power shutdown mode. Matthew Dauterive, RECOM DC/DC product manager comments: "We have set the bar high again with a great combination of low cost and high power density from a 3W DC/DC converter in a standard SIP8 package. It will find wide application in demanding environments such as industrial and e-mobility".02.06.2021 08:30:00Junnews_2021-06-15_13.jpg\images\news_2021-06-15_13.jpghttps://recom-power.com/en/rec-n-cost-efficient,-regulated-sip8-dc!sdc-converters-are-fully-featured-160.html?0recom-power.com
PCNS Registration is Now Open3rd PCNS Passive Components Networking Symposium i...9274Event NewsPCNS Registration is Now Open3rd PCNS Passive Components Networking Symposium is now open for on-line registration. The third PCNS is organized as a hybrid event September 7-10, and it is possible to register either as live attendee or virtual attendee. Fee is equal, and early bird registration rate is valid till 16th July 2021. PCNS received 27 paper abstracts from 9 countries EU and USA (vs 19 papers at 2nd PCNS)! The papers' scope submitted by passive manufacturers, universities, material suppliers, space agencies and end users include capacitors, resistors, inductors and passive sensors in areas of aerospace, automotive or industrial. Topics are covering reliability, qualification, new materials & technologies and research. Pre-event includes workshops on reliability, life time and sustainability of passive components – open for free for all main conference symposium attendees. "We are looking forward to meet in September during this challenging year. Hopefully, we can finally meet live to enjoy multilevel exchange of experience and news within a passive industry. … meet old friend and new colleagues. Live streaming video will be available for those with travel restrictions." said Tomas Zednicek; EPCI and PCNS organising committee president.02.06.2021 07:00:00Junnews_2021-06-15_2.png\images\news_2021-06-15_2.pnghttps://passive-components.eu/3rd-pcns-preliminary-program-released/passive-components.eu
High-Power Types of Photovoltaic MOSFET DriversModern industrial automation solutions, energy sys...9345Product ReleaseHigh-Power Types of Photovoltaic MOSFET DriversModern industrial automation solutions, energy systems and professional equipment are often extremely specialized devices that require high safety and design flexibility for switching elements like semiconductor relays. A photovoltaic driver for galvanic separation in combination with a distinct MOSFET power switch leaves nothing to be desired. The APV models of Panasonic Industry's Photovoltaic MOSFET drivers can control MOSFETS in a new range by offering high-output voltage or high-output current. The drivers come in a miniaturized SSOP housing and provide a galvanic separation of 1,500V between the control circuit and the power output circuit. The high-power type APV3111GVY directly switches Power MOSFETs for high-load currents, thanks to a generated output voltage of 18V used for controlling the MOSFETs Gates, a feature that reduces the number of amplifier parts on the PCB. APV1111GVY comes into play in the context of high-speed switching with high-current requirements - and stands out with a remarkable output current of 45µA for fast MOSFET Gate charging. It is a straightforward driver principle, one that is ready for efficient and miniaturized next-gen high-power applications in a wide range of temperatures, including power supply devices, measuring equipment, energy storage systems and much more.01.06.2021 19:30:00Junnews_2021-07-15_23.png\images\news_2021-07-15_23.pnghttps://industry.panasonic.eu/panasonic-industry-news/force-you-choose-high-power-types-photovoltaic-mosfet-driversindustry.panasonic.eu
Low Power Boost DC/DC Converter for Energy HarvestingRicoh Electronic Devices in Japan has launched the...9315Product ReleaseLow Power Boost DC/DC Converter for Energy HarvestingRicoh Electronic Devices in Japan has launched the R1810 Boost DC/DC Converter, a complete energy harvesting solution designed for powering low current consuming IoT devices by extracting energy from Photovoltaic cells. Target applications include wireless sensors, home and building automation, remote monitoring, presence detection, industrial equipment controls and more. Alternative power supplies replacing conventional batteries are nowadays immensely popular, autonomous operating wireless devices significantly reduce the cost and labour of regular maintenance to replace batteries. Such power supplies operate with photovoltaic cells that usually supply a voltage which is way below the desired operating voltage for the application, therefore a special circuit is required that collects, converts and stores energy in an external energy storage capacitor, followed by regulation of the output voltage to the required level. The R1810 is especially tailored for this purpose and starts up with only 9µW provided from a single cell photovoltaic element, the start-up voltage is only 0.5 V and once started, the operation continues even if the input voltage drops below 0.2 V. It has a high efficiency performance of 66% at 5 µA output current (VIN=0.5V, VSET=2.6V). The advanced R1810 has an internally fixed maximum power point voltage (VMP) and output voltage setting (VSET) to optimize the performance of the electrical circuit with respect to the selected energy harvester type. Once sufficient energy available on the input and increases above the VMP level, the boost DC/DC Converter will be enabled to transfer energy from input to the output.01.06.2021 13:30:00Junnews_2021-07-01_19.jpg\images\news_2021-07-01_19.jpghttps://www.n-redc.co.jp/en/products/dc-dc-switching-regulator/spec/?product=r1810n-redc.co.jp
Podcast Examines Power ManagementMouser released the second installment of the 2021...9296Industry NewsPodcast Examines Power ManagementMouser released the second installment of the 2021 series of its 'Empowering Innovation Together' program and 'The Tech Between Us' podcast. The series' second episode, available on the Mouser website, Alexa, Apple Podcasts, Google Podcasts, iHeartRadio, Pandora and Spotify, explores power management and the potential behind wide bandgap technology. In this episode, Raymond Yin, Mouser's Director of Technical Content, is joined by Steven Shackell, ON Semiconductors' Product Line Manager for Silicon Carbide and Gallium Nitride, for a conversation about current wide bandgap devices. As they define what makes a semiconductor "wide bandgap," the pair shares more about the technology's applications, benefits and limitations for power management design.<br>"This latest installment of the EIT program presents engineers with what the future may hold for power management technology," says Glenn Smith, President and CEO of Mouser Electronics. "As demand for energy increases, wide bandgap offers significant opportunities for further improvement in power efficiency, positioning it as the future of semiconductors."01.06.2021 12:00:00Junnews_2021-06-15_7.jpg\images\news_2021-06-15_7.jpghttps://www.mouser.com/empowering-innovation/power-managementmouser.com
Low Pressure Molding Technology for Encapsulation of ElectronicsHenkel's Low Pressure Molding technology for encap...9285Product ReleaseLow Pressure Molding Technology for Encapsulation of ElectronicsHenkel's Low Pressure Molding technology for encapsulating electrical and electronic components in its Technomelt polyamide adhesive molding compounds is increasingly being adopted for medical, electronic components, power and industrial automation, HVAC and lighting applications. The technology offers numerous economic, process control, design and environmental advantages over alternative systems such as potting with reactive resin systems and high-pressure injection molding. Technomelt Low Pressure Molding (LPM) technology was invented some 30 years ago by Henkel (formerly called Macromelt Molding). The technology enables the quick encapsulation of delicate components by using specialized polyamides in combination with standard processing equipment and low-cost molds. Because the material is injected at a lower pressure compared to conventional injection molding processes, and non-abrasive materials are used, risk of damage to the electronics during the encapsulation process is far lower. The technology is particularly adept at encapsulating discrete areas in complicated assembly where wiring is attached to a printed circuit board (PCB), PCBAs and other rigid component. One reason for this is that Technomelt resins, which are all unfilled, are resistant to high stresses and at the same time very flexible.01.06.2021 10:30:00Junnews_2021-06-15_15.png\images\news_2021-06-15_15.pnghttps://www.henkel.com/press-and-media/press-releases-and-kits/2021-06-01-henkels-technomelt-low-pressure-molding-technology-meets-latest-demands-for-encapsulation-of-electronics-and-medical-components-1222444henkel.com
Air-cooled Modular Power SupplyTDK Corporation announces the introduction of the ...9284Product ReleaseAir-cooled Modular Power SupplyTDK Corporation announces the introduction of the TDK-Lambda brand TPF45000-385 non-isolated modular AC-DC power supply. Developed for use in distributed power architectures (DPA) and DC Microgrids, the 98% highly efficient TPF45000 provides a regulated 385Vdc output with a current of up to 117A. Low internal losses enables the use of cooling by fans, avoiding the complexity of water cooling. This industrial grade product is suitable for use in semiconductor test and burn in systems, LED based horticultural lighting and DC Microgrids. Comprising of up to ten 4.5kW modules, the series can deliver up to 45kW of output power in a less than 3U high package, and operates from a wide range Delta or Wye 360 - 528Vac three phase input. The unit can operate at full load in ambient temperatures from -10 to 50°C (-20°C start-up). The enclosure measures 450mm wide (excluding side rack mount flanges) 113mm high and has a depth of 533mm. The weight of the product is 30kg. The TPF45000 is fully featured with DC Good, dropped phase, over temperature and fault alarm signals, remote on/off and a 13 to 15V 0.5A auxiliary output. PMBus and USB communications interfaces allows remote monitoring of the input voltage, output voltage, output current, internal temperature, status signals and fan. In addition, the remote on/off can be programmed by the PMBus. The power supply has 2kVac primary to ground isolation, is certified to IEC/EN/UL/CSA 62368-1 and carries the CE mark for the Low Voltage, EMC and RoHS Directives.01.06.2021 09:30:00Junnews_2021-06-15_14.jpg\images\news_2021-06-15_14.jpghttps://www.us.lambda.tdk.com/news/press-releases/2021000079.htmllambda.tdk.com
Wireless Power Supply Technology Offers a Route to Wireless Charging in Higher Power ApplicationsEggtronic has announced E2WATT, an AC power techno...9282Product ReleaseWireless Power Supply Technology Offers a Route to Wireless Charging in Higher Power ApplicationsEggtronic has announced E2WATT, an AC power technology that will boost the power, efficiency, charging distance and data transmission capabilities of wireless charging applications. Offering efficiency comparable with the best conventional wired AC adapters, E2WATT provides the foundation for taking future mobile charging designs into new segments including laptops, AV equipment, and even home appliances and electric vehicles. Traditional Qi wireless power is limited by distance (usually 5 mm), and maximum power (usually up to 30 W). E2WATT technology reaches up eight times further (to 40 mm) and delivers up to 300 W - a real breakthrough for inductive standards. E2WATT wireless technology is powered directly from AC mains, without the need for an external power supply. The single-stage hybrid design minimizes losses compared with conventional double-stage wireless technologies to deliver significantly increased peak efficiencies of up to 95%. "We developed the entire E2WATT wireless platform, from the concept to proprietary architecture and firmware, in order to overcome the limitations of standard AC power adapters and Qi wireless chargers, multiplying the number of applications and the usability of products based on Qi technology," said Igor Spinella, CEO and founder of Eggtronic. "The industry-changing performance of E2WATT is enabled by the high-speed gallium nitride – or GaN – semiconductor technology used in GaNFast power ICs," added Stephen Oliver, VP Corporate Marketing at Navitas Semiconductor. "The Eggtronic team realized the limitations of legacy silicon chips and early discrete GaN with complex circuits and many discrete components. GaNFast power ICs are easy-to-use, 'digital-in, power-out' circuit building blocks which meant the expert team in Modena could focus on their proprietary, high-speed E2WATT topology and achieve a very fast time to market."01.06.2021 07:30:00Junnews_2021-06-15_12.jpg\images\news_2021-06-15_12.jpghttps://www.eggtronic.com/assets/pdf/Eggtronic-E2Watt.pdfeggtronic.com/pdf
Module Market Leader announces Partnership with Berlin-based Business Development SpecialistPower module market leader Vincotech has teamed up...9273Industry NewsModule Market Leader announces Partnership with Berlin-based Business Development SpecialistPower module market leader Vincotech has teamed up with Berlin-based Foxy Power, a business development company specializing in innovative power electronics. This newly forged alliance aims to maximize the value of Vincotech products, help customers optimize their products, and make the most of Foxy Power's strong industry network. Both companies bring their strengths to the table: Foxy Power excels at identifying unique value propositions for building strategic partnerships. Vincotech, known for its flexibility and reliability, designs and builds power modules for motion control, renewable energy, and power supply applications.30.05.2021 06:00:00Maynews_2021-06-15_1.png\images\news_2021-06-15_1.pnghttps://foxypower.com/foxypower.com
Technology for 150V GaN HEMT DevicesROHM developed an 8V gate breakdown voltage (rated...9289Product ReleaseTechnology for 150V GaN HEMT DevicesROHM developed an 8V gate breakdown voltage (rated gate-source voltage) technology for 150V GaN HEMT devices – optimized for power supply circuits in industrial and communication equipment. Existing GaN devices with a withstand voltage of 200V or less typically have a rated gate-source voltage of 6V with respect to a gate drive voltage of 5V, resulting in an extremely narrow voltage margin of just 1V. Exceeding the rated voltage can cause reliability problems such as degradation and destruction, plus the gate drive voltage requires high accuracy control, which has been a major obstacle to the widespread application of GaN devices. In response, ROHM succeeded in raising the rated gate-source voltage from the typical 6V to 8V by adopting an original structure. This triples the voltage margin during device operation, so even if a voltage overshoot exceeding 6V occurs during switching, the device will not degrade, contributing to higher reliability of the power supply circuit. ROHM's GaN device utilizes a versatile package that delivers superior heat dissipation with a proven track record for reliability and mountability. This enables easy replacement of existing silicon devices and simplifies handling during the mounting process. Furthermore, using copper clip junction packaging technology reduces parasitic inductance by 55% over conventional packages, maximizing device performance when designing circuits for high frequency operation.27.05.2021 14:30:00Maynews_2021-06-15_19.jpg\images\news_2021-06-15_19.jpghttps://www.rohm.com/news-detail?news-title=150v-gan-hemt&defaultGroupId=falserohm.com
2W Bipolar Output SMT DC-DC ConvertersMurata has added to its range of advanced power so...9293Product Release2W Bipolar Output SMT DC-DC ConvertersMurata has added to its range of advanced power solutions, with a series of surface mount DC-DC converters. Comprised of 9 different models, the lightweight units in the MGJ2 series each have a 2W power rating and are supplied in compact, low-profile form factor modules with 19.49mm × 14.99mm × 4.39mm dimensions. They are intended to accompany the IGBT and SiC-based MOSFET high-voltage gate drivers used in industrial, renewable energy and mobility applications. Available in input versions that accommodate the commonly-used 5V (in development), 12V and 15V voltage rails, they feature +15V/-5V, +15V/-9V and +20V/-5V bipolar outputs. The MGJ2 DC-DC converters exhibit an ultra-low isolation capacitance of just 3pF (typical). This helps them to mitigate the coupling of transients across the isolation barrier and prevent EMI issues from occurring due to circulating currents generated by high frequency signals. Their characterised partial discharge performance means that elevated levels of operation can be maintained despite the demanding nature of the high-voltage applications they will be used in. Likewise, the common-mode transient immunity (CMTI), which exceeds 200kV/µs, allows them to deal with high switching frequencies.26.05.2021 18:30:00Maynews_2021-06-15_23.jpg\images\news_2021-06-15_23.jpghttps://www.murata.com/en-eu/news/power/dcdc/2021/0526murata.com
350kW Planar TransformerA high power design using 2 power sections of 175k...9290Product Release350kW Planar TransformerA high power design using 2 power sections of 175kW each for a total of 350kW output power. The topology is a full bridge with -55°C to 150°C operation. Power dissipation is less than 1400Watts with over 99.0% efficiency. Input voltage range is 700 to 900Vdc with output at 625V and 560Arms. Different terminal configurations can be made for a wide range of input and output voltages. Operating frequency is 50kHz with less than 1uH of leakage inductance. Is designed to be placed on a cooling plate for maximum mechanical and thermal performance. Size is L:400mm, W:400mm, H:70mm.26.05.2021 15:30:00Maynews_2021-06-15_20.jpg\images\news_2021-06-15_20.jpghttps://www.paytongroup.com/planar-transformerspaytongroup.com
Hardware-based Field-oriented Control and IO-Link CommunicationTRINAMIC Motion Control introduces an open-source,...9267Product ReleaseHardware-based Field-oriented Control and IO-Link CommunicationTRINAMIC Motion Control introduces an open-source, fully integrated reference design that simplifies the development of industrial robotic end-of-arm tooling (EoAT). The TMCM-1617-GRIP-REF reference design integrates hardware-based field-oriented control (FOC) and three communication ports to shrink the design size of electronic robotic grippers by three times, while reducing development time by half. The reference design features Maxim Integrated's industrial-grade MAX22000 high-precision configurable analog input/output and MAX14906 quad-channel digital input/output to adjust the multiple modes of the Trinamic TMCM-1617 single axis servo driver. Designed to fit within the standard form-factor used for EoAT grippers, the TMCM-1617-GRIP-REF reference design supports industrial EtherCAT, IO-Link or RS-485 communication, provides software-programmable analog and digital input/outputs, and can be configured using the Trinamic Motion Control Language Integrated Development Environment (TMCL-IDE). This combination of reference design and software platform provides a simple way for design engineers to rapidly deliver a complete EoAT solution. "There's a need for industrial automation engineers to rely on a toolkit that simplifies the development and commissioning of robotic EoAT solutions," explains Jeff DeAngelis, Vice President of Industrial Communications at Maxim. "The TMCM-1617-GRIP-REF reference design simplifies the tooling development process, allowing automation engineers to focus their time on developing advanced, real-time EoAT solutions that embody the true meaning of delivering intelligence at the edge."26.05.2021 12:30:00Maynews_2021-06-01_17.jpg\images\news_2021-06-01_17.jpghttps://www.maximintegrated.com/en/aboutus/newsroom.html/pr_1411789034maximintegrated.com
International Engineering CompetitionThis year, the entire competition was held online ...9278Industry NewsInternational Engineering CompetitionThis year, the entire competition was held online by Rohde & Schwarz. The competition is aimed at students of electrical engineering, particularly communications engineering, as well as IT, who can participate in trending high-tech topics with practical relevance to companies. The challenge this year was to create a smart software solution to optimize a signal analysis. Engineers who pay very close attention to signal data analysis are highly sought-after in the telecommunications industry. Errors are unacceptable, and inaccuracies are just as unwelcome. Highly reliable signal generators and analyzers are part of day-to-day work in the industry and involve a large number of parameters that can be configured manually. What would the situation for the engineering teams look like if a program code could configure the parameters automatically? This was the question tackled by the 86 students taking part in this year's Engineering Competition. During the competition, they received mobile radio signals to be analyzed using a code to develop in Phython. They were provided with the R&S VSE vector signal explorer software, a state-of-the-art solution giving them a wide variety of analysis tools to evaluate and troubleshoot digitally modulated signals. The students who wrote the best Python program for the automated identification of signal parameters qualified for a more advanced challenge in the finals. The code submitted was evaluated based on signals that were unknown to the student teams.26.05.2021 11:00:00Maynews_2021-06-15_6.png\images\news_2021-06-15_6.pnghttps://www.rohde-schwarz.com/uk/about/news-press/all-news/signal-analysis-stronger-than-ever-university-competition-is-about-to-enter-its-17th-round-press-release-detailpage_229356-1079112.htmlrohde-schwarz.com
Power DC-Link Film Capacitor for Automotive and Green Energy ApplicationsKEMET announces its C4AK high temperature, power f...9264Product ReleasePower DC-Link Film Capacitor for Automotive and Green Energy ApplicationsKEMET announces its C4AK high temperature, power film DC-Link capacitor designed for continuous operation up to 1,000 hours at 135°C. The C4AK series joins the C4AU (harsh environment) and C4AQ-P (125°C) family of power DC-Link film capacitors. These series offer higher capacitance density, DC voltage, and DC ripple current capabilities with an extended operational lifetime at high temperatures in harsh environments. Ideal for use in automotive, green, and industrial applications, these metallized film capacitors are well suited for DC filtering and DC-Link in solar, fuel cells, inverters, storage energy systems, automotive (Bi) On-Board Charger, Wireless Power Transfer (WPT), DC/DC, heaters, and welding equipment. Due to its enhanced performance design, the KEMET DC-Link C4AK film capacitor provides a superior alternative for current capacitor solutions. Design features include a radial box style for PCB mounting, miniaturization, low profile, 2 – 4 leads, and fewer capacitors needed in parallel to meet the required peak and ripple current. The C4AK film capacitor surpasses the extreme conditions of the standard automotive (AEC-Q200) requirements for film technology in severe humidity/temperature conditions. Compared to competitor technologies, the C4AK series has greater performance with a lifetime of 4,000 hours at 125°C and 1000 hours at 135°C in harsh environmental conditions. The C4AK DC-Link film capacitor's extended life at high temperatures provides designers an ideal miniaturized, reduced component count solution over conventional film capacitors, particularly in Wide Band Gap high frequency, high current systems.26.05.2021 09:30:00Maynews_2021-06-01_14.jpg\images\news_2021-06-01_14.jpghttps://www.kemet.com/en/us/new-products.htmlkemet.com
48 V to 12 V LLC Power Conversion Demonstration BoardEPC announces the availability of the EPC9149, a 1...9272Product Release48 V to 12 V LLC Power Conversion Demonstration BoardEPC announces the availability of the EPC9149, a 1 kW-capable 48 V input to 12 V output LLC converter that operates as a DC transformer with a conversion ratio of 4:1. This demonstration board features the 100V EPC2218 and 40 V EPC2024 GaN FETs. The board is the size of DOSA-standard ?th brick format, measuring only 58.4 mm by 22.9 mm. This is considerably smaller than alternative silicon-based solutions that are generally sized in the ¼th brick format, or twice as large, for 1 kW of output power. The total thickness of the converter without heatsink is only 10 mm. To make it simple for a power supply designer to easily replicate this design, all supporting materials for this board including schematic, bills of materials, and Gerber files are available on the EPC website. The high-power density, 1226 W/in3, is achieved thanks to EPC GaN FET technology. eGaN FETs enable high switching frequency, in this case 1 MHz, and they are very small, ? of the size of silicon MOSFETs with similar on resistance. The EPC9149 board features four 100 V rated EPC2218 eGaN FETs for the primary rectification, and eight 40 V rated EPC2024 eGaN FETs for the secondary synchronous rectification. The board also features a 4 mm x 4 mm Microchip dsPIC33CKMP102T-I/M6 for flexibility, configuration, communications, and programmability.25.05.2021 17:30:00Maynews_2021-06-01_22.jpg\images\news_2021-06-01_22.jpghttps://epc-co.com/epc/EventsandNews/News/ArtMID/1627/ArticleID/2991/EPC%e2%80%99s-1-kW-48-V-to-12-V-LLC-Power-Conversion-Demonstration-Board-Delivers-Best-in-Class-Power-Density-of-1226-Win3-.aspxepc-co.com
Tier 1 Semiconductor Automotive Supplier GaN Power Electronic ProgramOxford Instruments Plasma Technology announced tha...9254Industry NewsTier 1 Semiconductor Automotive Supplier GaN Power Electronic ProgramOxford Instruments Plasma Technology announced that a leading German semiconductor manufacturer to the automotive industry has selected its PlasmaPro100 Cobra system for the development of next generation GaN power electronic devices. The production-proven system allows for rapid change between wafer sizes up to 200 mm and the cost of ownership is one of the lowest in the market. The PlasmaPro100 Cobra system will be incorporated into the R&D section and will be used for development of GaN power devices. GaN power devices are gaining market share in fast charger applications and offer benefits in Electric Vehicle power management systems. We continue to see very encouraging signals in the form of increasingly proactive customer engagement and clear market preparation and positioning activities from significant industry players for the emerging Wide Band Gap power electronic market. "Our Atomic Scale Processing etch solution being selected by this world leading manufacturer for their GaN power electronics programme is an important strategic win for Oxford Instruments Plasma Technology" comments Klaas Wisniewski, Plasma Technology's Strategic Business Development Director, who also added: "The GaN based power electronic market is very dynamic with improvements to both performance and cost expected at each design iteration. This reiterates the importance of our strategy to focus on atomic scale processing solutions such as atomic layer deposition (ALD) and atomic layer etching (ALE). We are pleased that such a leading automotive semiconductor company recognizes the benefits our solutions deliver.25.05.2021 09:00:00Maynews_2021-06-01_4.jpg\images\news_2021-06-01_4.jpghttps://www.oxinst.com/news/tier-1-semiconductor-automotiveoxinst.com
Samsung's First MOSFET-based Refrigerator Inverter DesignInfineon Technologies supplied Samsung Electronics...9253Industry NewsSamsung's First MOSFET-based Refrigerator Inverter DesignInfineon Technologies supplied Samsung Electronics with power devices to couple the highest energy efficiency with lowest audible noise. They have been integrated in Samsung's brand new one-door fridge and French Door Fridge inverterized refrigerator. Inverterization is an emerging DC to AC conversion trend in contemporary inverter designs. It helps the application run more quietly and smoothly while the average power consumption is reduced compared to a traditional on/off control. To meet Samsung's requirements towards improved efficiency and lower system cost together with a lower noise level, the Digi Touch Cool, Curd Maestro features multiple power solutions from Infineon – EiceDRIVER gate-driver IC, CoolSET Gen 5 for AC/DC conversion, and 600 V CoolMOS PFD7 for compressor drives. This is Samsung's first refrigerator design that uses discrete devices instead of power modules in the compressor. The 600 V CoolMOS PFD7 superjunction MOSFETs come with a best-in-class body diode allowing for improved soft-recovery index and the industry's fastest reverse recovery time (t rr), making them a perfect choice for home appliance motor drives. Compared to module-based designs, using MOSFETs enables lower energy consumption especially at light-load conditions and an efficiency increase as of 1.7 percent. In addition, this innovative approach allows for a heatsink-less design, a 10 percent reduction in system cost and a longer refrigerator lifetime.25.05.2021 08:00:00Maynews_2021-06-01_3.jpg\images\news_2021-06-01_3.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2021/INFPSS202105-072.htmlinfineon.com
One-step Ball Grid Array Ball-attach FluxIndium Corporation continues to expand its flux po...9262Product ReleaseOne-step Ball Grid Array Ball-attach FluxIndium Corporation continues to expand its flux portfolio with WS-823-a proven, one-step ball grid array (BGA) ball-attach flux designed to eliminate the costly and warpage-inducing prefluxing step, especially on Cu-OSP substrate. While the standard ball-attach process requires two steps, especially on a Cu-OSP substrate, WS-823 is a halogen-free, water-wash flux designed for a single-step ball-attach process that eliminates the prefluxing step in order to create reliable ball-to-pad joints. <br>WS-823 provides:<br>-Tackiness suitable for holding solder spheres in place during reflow<br>-Excellent solderability on a wide range of surfaces, including AuNi and oxidized Cu-OSP<br>-Uniform pin transfer over extended periods, eliminating changes in joint quality over time and uneven deposit sizes, which can lead to "missing ball" <br>-A formula engineered for low-voiding, thereby increasing joint strength <br>-Good cleanability with room temperature DI water, avoiding the formation of white residue<br>25.05.2021 07:30:00Maynews_2021-06-01_12.jpg\images\news_2021-06-01_12.jpghttps://www.indium.com/corporate/media-center/news/indium-corporation-introduces-new-ball-attach-flux/indium.com
Last Call for Scientific PapersThe Electric Drives Production Conference (E|DPC) ...9259Event NewsLast Call for Scientific PapersThe Electric Drives Production Conference (E|DPC) 2021 represents an outstanding platform for the exchange of developers, researchers and users of electric drives. We would be very delighted if you present your latest technical expertise in front of professionals from science and industry. Ten days are left to submit your scientific abstract until May 31, 2021. To ensure a reliable planning for everyone, the E|DPC will take place as a virtual event from December 7 to 9, 2021. E|DPC 2021 offers the possibility to submit different types of contributions. The industrial contribution is an excellent platform to promote new technologies without having to prepare a full paper. Furthermore, scientific contributions are intended for scientists to present their latest research findings in front of peers and to influence industry representatives. All scientific fullpapers that pass the review process will be part of the proceedings of E|DPC. The papers will be indexed by Scopus and Google Scholar. Since the launch in 2011 we publish every year with IEEE and in 2021 this is intended as well. In contrast, the industrial contributions will be made available in the download area of the conference. It is necessary to upload an abstract for each kind of contribution. After accepting the abstracts uploaded, authors of scientific contributions will be asked to upload a full paper being reviewed by the international program committee before acceptance. Authors of industrial contributions will be requested to upload the slides of their presentation shortly before the conference.24.05.2021 14:00:00Maynews_2021-06-01_9.jpg\images\news_2021-06-01_9.jpghttps://www.edpc.eu/wp-content/uploads/2021/03/e5d949f29f9cec53c7bcd456ed9e8624.pdfedpc.eu
SEMICON Southeast Asia Themed "Power Innovation - 5G and Beyond"SEMICON Southeast Asia 2021 (23-27 August 2021, Hy...9256Event NewsSEMICON Southeast Asia Themed "Power Innovation - 5G and Beyond"SEMICON Southeast Asia 2021 (23-27 August 2021, Hybrid Event) will gather industry visionaries and experts to highlight the latest developments, innovations, and trends in segments of electronics including Smart Manufacturing, Smart Mobility, Smart Data, AI and 5G as technology continues to reshape the way people work and live.24.05.2021 11:00:00Maynews_semicon_sea.png\images\news_semicon_sea.pnghttps://semi.website/05bpseanewssemi.website