Bodo's News

Read through my personal pick of news around people, our industry, important events and interesting product releases. Or click on a filter and pick your area of interest!

 

48V / 12V Bi-Directional DC-DC Converter
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Learn more:
delta-emea.com
  • Product Release
  • 2021-06-10

Delta recently unveiled its High Power Density Bi-Directional DC-DC Converter U50SU4P162 for data centers, super computers, and other high-tech systems. Emphasizing the requirement of high-efficiency, high-density data centers, the U50SU4P162 provides 48V / 12V bi-directional conversion, and features high power density of up to 3,000 W/inch3 with a small footprint (23*17.4*10 mm) and up to 98% conversion efficiency. The U50SU4P162 DC-DC Converter provides 48V / 12V bi-directional conversion, 800 W output power, and 1 MHz switching frequency. The ultra-high power density (up to 3,000 W/inch3) allows the U50SU4P162 to achieve 98% power conversion efficiency in a compact size of 23*17.4*10 mm. The ability of handling large load capacitance (up to 10,000 µF) and double-sided heat sink with low thermal resistance also help to ensure high-performance computing for high-density data centers. Another highlighted feature of the U50SU4P162 is the PMBus (power management bus) protocol. It allows the converter to transmit power data to system controllers for efficient monitoring and management. Delta is also outpacing others by offering customization services for power configuration and optional heat sinks to help customers build advanced systems. With advanced functions, high power density, small footprint, and customizability, the U50SU4P162 ensures the high efficiency of data centers, super computers, and other high-tech systems.

MOSFET Qualified for Commercial and Military Satellites and Space Power Solutions
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Learn more:
microchip.com
  • Product Release
  • 2021-06-08

Microchip Technology announced the qualification of its M6 MRH25N12U3 radiation-hardened 250V, 0.21 Ohm Rds(on), metal–oxide–semiconductor field-effect transistor (MOSFET) for commercial aerospace and defense space applications. The MOSFET withstands the harsh environments of space, extends reliability of power circuitry and meets all requirements of MIL-PRF19500/746 with enhanced performance. Microchip completed testing for Defense Logistics Agency (DLA) review and qualification, for the device's sourcing in the U.S. military supply chain (expected JANSR2N7593U3 certification in June 2021). The M6 MRH25N12U3 MOSFET is designed for future satellite system designs as well as serving as an alternate source in existing systems. It can withstand total ionizing dose (TID) up to 100 krad and 300 krad and single event effects (SEE) with linear energy transfer (LET) up to 87 MeV/mg/cm2. It provides 100-percent wafer lot radiation hardness assurance in validation tests. "Microchip's entry into the radiation-hardened MOSFET market reflects our long-term commitment to support our customer base and provide aerospace and defense OEMs and integrators with high-performance solutions and continuous supply," said Leon Gross, vice president of Microchip's Discrete Product Group business unit. "In addition to our proven quality and reliability, the M6 MRH25N12U3 provides a value pricing option for developers and offers them full application support."

Packages Improved Robustness and Thermal Performance
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Learn more:
infineon.com
  • Product Release
  • 2021-06-08

Applications such as e-scooters, e-forklifts and other light electric vehicles (LEVs), as well as power tools and battery management systems, demand high current rating, ruggedness and extended lifetime. Infineon Technologies addresses these requirements by offering more choices to power system designers to meet diverse design needs and achieve maximum performance in the smallest space. With the TO-Leadless (TOLL) package, Infineon now offers two OptiMOS power MOSFET packages in the TOLx family: TOLG (TO-Leaded with Gullwing leads) and TOLT (TO-Leaded Top-side cooling). Together, the TOLx family offers very low R DS(on) and a high-current rating over 300 A to increase system efficiency in high-power density designs.
The TOLG package combines the best features of TOLL and D 2PAK 7-pin packages, sharing the same 10 x 11 mm 2 footprint and electrical performances as TOLL with added flexibility comparable to D 2PAK 7-pin. The main advantages of TOLG are particularly apparent in designs with aluminum-insulated metal substrate (Al-IMS) boards.
The TOLT package is optimized for superior thermal performance. Constructed with its lead-frame flipped to position exposed metal on the top side, the package contains multiple gullwing leads on each side for high current carrying drain and source connections. With a flipped lead-frame, heat passes from the exposed metal top side, through the insulating material, directly to the heatsink.

Wafer Fab of the Future in Dresden
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Learn more:
bosch.de
  • Industry News
  • 2021-06-07

In Dresden, Bosch is opening one of the world's most modern wafer fabs. Highly automated, fully connected machines and integrated processes, combined with methods of artificial intelligence (AI) will make the Dresden plant a smart factory and a trailblazer in Industry 4.0. In the virtual presence of Federal Chancellor Dr. Angela Merkel, the high-tech facility was officially inaugurated on June 7, 2021. "The new Bosch wafer fab will boost our capacity in microelectronics. Microelectronics is the basis for nearly every promising technology, for applications of artificial intelligence, for quantum computing, and for automated and connected driving – which is also a Bosch specialty," said Federal Chancellor Dr. Angela Merkel. "The new wafer fab is the single largest investment in the company's history. This cannot be stressed too much. Its size and additional production capacity alone are impressive. The very latest methods of data-driven continuous improvement in production make the Dresden plant a smart factory. To put it another way: in this plant, natural and artificial intelligence have joined forces with the internet of things to form a productive symbiosis." Production in Dresden will start as early as July – six months earlier than planned. From that time on, semiconductors made in the new plant will be installed in Bosch power tools. For automotive customers, chip production will start in September, and thus three months earlier than planned. The new factory will be an important part of the semiconductor manufacturing network. With it, Bosch is strengthening Germany's position as a technology and business location. On 72,000 square meters of floor space, 250 people are already working in the wafer fab in Saxony's state capital. The workforce is set to grow to roughly 700 once construction work has been completed.

International Electron Devices Meeting Announces Call for Papers
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Learn more:
ieee-iedm.org
  • Event News
  • 2021-06-04

Under the theme "Devices for a New Era of Electronics: From 2D Materials to 3D Architectures," the 67th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers. The 2021 IEDM is being planned as an in-person conference December 11–15, 2021 at the Hilton San Francisco Union Square hotel, with on-demand access after the event for those who are unable to travel due to COVID-19 restrictions. The paper submission deadline is Friday, July 23, 2021. Authors are asked to submit four-page camera-ready papers. Accepted papers will be published as-is in the proceedings. A few late-news papers also will be accepted, covering only the most recent and noteworthy developments. The late-news submission deadline is August 30, 2021. "IEDM is currently being planned as an in-person event in San Francisco in December with on-demand access to content available after the event, although meeting plans are subject to change to stay in compliance with COVID-19 guidelines," said Meng-Fan (Marvin) Chang, IEDM 2021 Publicity Chair and IEEE Fellow, Distinguished Professor of Electrical Engineering at National Tsing Hua University, and Director of Corporate Research at TSMC. "Should an in-person meeting not be feasible, IEDM will go fully virtual. Additional details will be made available later this year." "Our theme this year was chosen to emphasize the many changes sweeping across the electronics industry and the diverse technologies that are enabling them," said Srabanti Chowdhury, IEDM 2021 Publicity Vice Chair and Associate Professor of Electrical Engineering at Stanford University. "IEDM 2021 will continue its long tradition of having a rich technical program full of relevant, state-of-the-art results, and the conference will give attendees the opportunity to interact with colleagues from academia and industry around the world."

750V SiC MOSFETs Offer Performance and Reliability
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Learn more:
genesicsemi.com
  • Product Release
  • 2021-06-04

GeneSiC's next-generation 750V G3RSiC MOSFETs will deliver unprecedented levels of performance, robustness and quality. System benefits include low on-state drops at operating temperatures, faster switching speeds, increased power density, minimal ringing (low EMI) and compact system size. GeneSiC's G3R, offered in optimized low-inductance discrete packages (SMD and through hole), are optimized to operate with lowest power losses under all operating conditions and ultra-fast switching speeds. These devices have substantially better performance levels as compared to contemporary SiC MOSFETs. "High-efficiency energy usage has become a critical deliverable in next-generation power converters and SiC power devices continue to be the key components driving this revolution. After years of development work towards achieving the lowest on-state resistance and robust short circuit and avalanche performance, we are excited to release the industry's best performing 750V SiC MOSFETs. Our G3R enable power electronics designers to meet the challenging efficiency, power density and quality goals in applications like solar inverters, EV on-board chargers and server/telecom power supplies. An assured quality, supported by fast turn-around and automotive-qualified high volume manufacturing further enhances their value proposition. " said Dr. Ranbir Singh, President at GeneSiC Semiconductor.

Using GaN Transistors to Develop DC/DC Converters
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Learn more:
brightloop.fr
  • Industry News
  • 2021-06-03

With its VALUE DC-DC product line, BrightLoop Converters is aiming to democratize access to performance and offer a range of converters dedicated to off-highway and commercial vehicles. The French player in power electronics is teaming up with Efficient Power Conversion (EPC) to deliver the upcoming VALUE product line. BrightLoop Converters has gained experience from many years of development for motorsport applications and learned to make the most out of GaN technology to deliver highly reliable, extremely light and compact converters. The company released in 2020 a PERFORMANCE DC-DC product line offering great versatility to extreme vehicle applications and motorsports. After demonstrating that GaN technology can significantly improve performance, the French company now wants to prove that using this technology does not necessarily lead to higher costs. With the launch of the new VALUE product line later this year, the strategy is clear: make performance accessible to these markets, which are now also looking for lightweight, space-saving and high-performance converters in the most cost-effective way. Florent Liffran, CEO of BrightLoop Converters commented: "We are proud to bring our expertise along with EPC's top technology to the commercial and off-highway markets. Our focus has always been to push the limits of performance further and with this new VALUE product line, our goal is clearly to bring our know-how to markets which have historically worked with heavy and bulky power electronics, making it possible for them to have a taste of outstanding performance, versatility and power density while remaining in their price range."

Chokes for Medical Technology Applications
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Learn more:
smp.de
  • Product Release
  • 2021-06-02

SMP Sintermetalle Prometheus (SMP) offers chokes for medical technology applications. These inductive components are used in Magnetic Resonance Imaging (MRI) or Computed Tomography (CT), for example. Designed as filter or mains chokes they are not only compact, low-loss and energy efficient but also exceptionally quiet in operation – essential qualities for demanding medical technology applications. In MRI scanners, the components are installed in the "gradient amplifiers", which supply output voltages and currents and control the gradient coils that encode the resonance signals for subsequent image reconstruction. The filter and mains chokes are designed to ensure a clean sinusoidal waveform and low-loss feedback of the unused energy. Special magnetostriction-free materials, which SMP develops and produces according to individual customer specifications, ensure that components run very quietly. The powder composite materials feature low eddy current and magnetic reversal losses. The components are noted for their low loss balances and optimal EMC properties. They are also maintenance-free. The three-dimensional isotropy of the materials enables compact, lightweight structures, because the magnetic circuits are minimized. This also lowers the magnetic field strength, and the quantity of winding material used can be significantly reduced. The materials have a high saturation induction of up to 2 Tesla. The oscillation behaviour of the choke can be adjusted specifically by using certain materials or appropriate, magnetically coupled designs with multiple coils.

Regulated SIP8 DC/DC Converters
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Learn more:
recom-power.com
  • Product Release
  • 2021-06-02

RECOM has announced the launch of the RS3E family of DC/DC converters in an industry-standard SIP8 format and pin-out. The parts are rated at 3W with no derating to 70°C and feature 2:1 input ranges of 4.5-9V, 9-18V, 18-36V and 36-72V. Fully regulated outputs available are 3.3V, 5V, 9V, 12V, 15V and 24V. Isolation is 3kV (one minute) and the parts hold IEC/UL/CSA 62368-1 safety certification up to 5000m altitude while meeting EN 55032/FCC class B and EN 55035 EMI standards. The RS3E family features short circuit protection, high MTBF of 1.8M hours and a control input to place the converters in a low-power shutdown mode. Matthew Dauterive, RECOM DC/DC product manager comments: "We have set the bar high again with a great combination of low cost and high power density from a 3W DC/DC converter in a standard SIP8 package. It will find wide application in demanding environments such as industrial and e-mobility".

PCNS Registration is Now Open
  • Event News
  • 2021-06-02

3rd PCNS Passive Components Networking Symposium is now open for on-line registration. The third PCNS is organized as a hybrid event September 7-10, and it is possible to register either as live attendee or virtual attendee. Fee is equal, and early bird registration rate is valid till 16th July 2021. PCNS received 27 paper abstracts from 9 countries EU and USA (vs 19 papers at 2nd PCNS)! The papers' scope submitted by passive manufacturers, universities, material suppliers, space agencies and end users include capacitors, resistors, inductors and passive sensors in areas of aerospace, automotive or industrial. Topics are covering reliability, qualification, new materials & technologies and research. Pre-event includes workshops on reliability, life time and sustainability of passive components – open for free for all main conference symposium attendees. "We are looking forward to meet in September during this challenging year. Hopefully, we can finally meet live to enjoy multilevel exchange of experience and news within a passive industry. … meet old friend and new colleagues. Live streaming video will be available for those with travel restrictions." said Tomas Zednicek; EPCI and PCNS organising committee president.

Low Pressure Molding Technology for Encapsulation of Electronics
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Learn more:
henkel.com
  • Product Release
  • 2021-06-01

Henkel's Low Pressure Molding technology for encapsulating electrical and electronic components in its Technomelt polyamide adhesive molding compounds is increasingly being adopted for medical, electronic components, power and industrial automation, HVAC and lighting applications. The technology offers numerous economic, process control, design and environmental advantages over alternative systems such as potting with reactive resin systems and high-pressure injection molding. Technomelt Low Pressure Molding (LPM) technology was invented some 30 years ago by Henkel (formerly called Macromelt Molding). The technology enables the quick encapsulation of delicate components by using specialized polyamides in combination with standard processing equipment and low-cost molds. Because the material is injected at a lower pressure compared to conventional injection molding processes, and non-abrasive materials are used, risk of damage to the electronics during the encapsulation process is far lower. The technology is particularly adept at encapsulating discrete areas in complicated assembly where wiring is attached to a printed circuit board (PCB), PCBAs and other rigid component. One reason for this is that Technomelt resins, which are all unfilled, are resistant to high stresses and at the same time very flexible.

Air-cooled Modular Power Supply
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Learn more:
lambda.tdk.com
  • Product Release
  • 2021-06-01

TDK Corporation announces the introduction of the TDK-Lambda brand TPF45000-385 non-isolated modular AC-DC power supply. Developed for use in distributed power architectures (DPA) and DC Microgrids, the 98% highly efficient TPF45000 provides a regulated 385Vdc output with a current of up to 117A. Low internal losses enables the use of cooling by fans, avoiding the complexity of water cooling. This industrial grade product is suitable for use in semiconductor test and burn in systems, LED based horticultural lighting and DC Microgrids. Comprising of up to ten 4.5kW modules, the series can deliver up to 45kW of output power in a less than 3U high package, and operates from a wide range Delta or Wye 360 - 528Vac three phase input. The unit can operate at full load in ambient temperatures from -10 to 50°C (-20°C start-up). The enclosure measures 450mm wide (excluding side rack mount flanges) 113mm high and has a depth of 533mm. The weight of the product is 30kg. The TPF45000 is fully featured with DC Good, dropped phase, over temperature and fault alarm signals, remote on/off and a 13 to 15V 0.5A auxiliary output. PMBus and USB communications interfaces allows remote monitoring of the input voltage, output voltage, output current, internal temperature, status signals and fan. In addition, the remote on/off can be programmed by the PMBus. The power supply has 2kVac primary to ground isolation, is certified to IEC/EN/UL/CSA 62368-1 and carries the CE mark for the Low Voltage, EMC and RoHS Directives.

Wireless Power Supply Technology Offers a Route to Wireless Charging in Higher Power Applications
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Learn more:
eggtronic.com/pdf
  • Product Release
  • 2021-06-01

Eggtronic has announced E2WATT, an AC power technology that will boost the power, efficiency, charging distance and data transmission capabilities of wireless charging applications. Offering efficiency comparable with the best conventional wired AC adapters, E2WATT provides the foundation for taking future mobile charging designs into new segments including laptops, AV equipment, and even home appliances and electric vehicles. Traditional Qi wireless power is limited by distance (usually 5 mm), and maximum power (usually up to 30 W). E2WATT technology reaches up eight times further (to 40 mm) and delivers up to 300 W - a real breakthrough for inductive standards. E2WATT wireless technology is powered directly from AC mains, without the need for an external power supply. The single-stage hybrid design minimizes losses compared with conventional double-stage wireless technologies to deliver significantly increased peak efficiencies of up to 95%. "We developed the entire E2WATT wireless platform, from the concept to proprietary architecture and firmware, in order to overcome the limitations of standard AC power adapters and Qi wireless chargers, multiplying the number of applications and the usability of products based on Qi technology," said Igor Spinella, CEO and founder of Eggtronic. "The industry-changing performance of E2WATT is enabled by the high-speed gallium nitride – or GaN – semiconductor technology used in GaNFast power ICs," added Stephen Oliver, VP Corporate Marketing at Navitas Semiconductor. "The Eggtronic team realized the limitations of legacy silicon chips and early discrete GaN with complex circuits and many discrete components. GaNFast power ICs are easy-to-use, 'digital-in, power-out' circuit building blocks which meant the expert team in Modena could focus on their proprietary, high-speed E2WATT topology and achieve a very fast time to market."

Module Market Leader announces Partnership with Berlin-based Business Development Specialist
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Learn more:
foxypower.com
  • Industry News
  • 2021-05-30

Power module market leader Vincotech has teamed up with Berlin-based Foxy Power, a business development company specializing in innovative power electronics. This newly forged alliance aims to maximize the value of Vincotech products, help customers optimize their products, and make the most of Foxy Power's strong industry network. Both companies bring their strengths to the table: Foxy Power excels at identifying unique value propositions for building strategic partnerships. Vincotech, known for its flexibility and reliability, designs and builds power modules for motion control, renewable energy, and power supply applications.

Technology for 150V GaN HEMT Devices
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Learn more:
rohm.com
  • Product Release
  • 2021-05-27

ROHM developed an 8V gate breakdown voltage (rated gate-source voltage) technology for 150V GaN HEMT devices – optimized for power supply circuits in industrial and communication equipment. Existing GaN devices with a withstand voltage of 200V or less typically have a rated gate-source voltage of 6V with respect to a gate drive voltage of 5V, resulting in an extremely narrow voltage margin of just 1V. Exceeding the rated voltage can cause reliability problems such as degradation and destruction, plus the gate drive voltage requires high accuracy control, which has been a major obstacle to the widespread application of GaN devices. In response, ROHM succeeded in raising the rated gate-source voltage from the typical 6V to 8V by adopting an original structure. This triples the voltage margin during device operation, so even if a voltage overshoot exceeding 6V occurs during switching, the device will not degrade, contributing to higher reliability of the power supply circuit. ROHM's GaN device utilizes a versatile package that delivers superior heat dissipation with a proven track record for reliability and mountability. This enables easy replacement of existing silicon devices and simplifies handling during the mounting process. Furthermore, using copper clip junction packaging technology reduces parasitic inductance by 55% over conventional packages, maximizing device performance when designing circuits for high frequency operation.

2W Bipolar Output SMT DC-DC Converters
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Learn more:
murata.com
  • Product Release
  • 2021-05-26

Murata has added to its range of advanced power solutions, with a series of surface mount DC-DC converters. Comprised of 9 different models, the lightweight units in the MGJ2 series each have a 2W power rating and are supplied in compact, low-profile form factor modules with 19.49mm × 14.99mm × 4.39mm dimensions. They are intended to accompany the IGBT and SiC-based MOSFET high-voltage gate drivers used in industrial, renewable energy and mobility applications. Available in input versions that accommodate the commonly-used 5V (in development), 12V and 15V voltage rails, they feature +15V/-5V, +15V/-9V and +20V/-5V bipolar outputs. The MGJ2 DC-DC converters exhibit an ultra-low isolation capacitance of just 3pF (typical). This helps them to mitigate the coupling of transients across the isolation barrier and prevent EMI issues from occurring due to circulating currents generated by high frequency signals. Their characterised partial discharge performance means that elevated levels of operation can be maintained despite the demanding nature of the high-voltage applications they will be used in. Likewise, the common-mode transient immunity (CMTI), which exceeds 200kV/µs, allows them to deal with high switching frequencies.

350kW Planar Transformer
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Learn more:
paytongroup.com
  • Product Release
  • 2021-05-26

A high power design using 2 power sections of 175kW each for a total of 350kW output power. The topology is a full bridge with -55°C to 150°C operation. Power dissipation is less than 1400Watts with over 99.0% efficiency. Input voltage range is 700 to 900Vdc with output at 625V and 560Arms. Different terminal configurations can be made for a wide range of input and output voltages. Operating frequency is 50kHz with less than 1uH of leakage inductance. Is designed to be placed on a cooling plate for maximum mechanical and thermal performance. Size is L:400mm, W:400mm, H:70mm.

Hardware-based Field-oriented Control and IO-Link Communication
  • Product Release
  • 2021-05-26

TRINAMIC Motion Control introduces an open-source, fully integrated reference design that simplifies the development of industrial robotic end-of-arm tooling (EoAT). The TMCM-1617-GRIP-REF reference design integrates hardware-based field-oriented control (FOC) and three communication ports to shrink the design size of electronic robotic grippers by three times, while reducing development time by half. The reference design features Maxim Integrated's industrial-grade MAX22000 high-precision configurable analog input/output and MAX14906 quad-channel digital input/output to adjust the multiple modes of the Trinamic TMCM-1617 single axis servo driver. Designed to fit within the standard form-factor used for EoAT grippers, the TMCM-1617-GRIP-REF reference design supports industrial EtherCAT, IO-Link or RS-485 communication, provides software-programmable analog and digital input/outputs, and can be configured using the Trinamic Motion Control Language Integrated Development Environment (TMCL-IDE). This combination of reference design and software platform provides a simple way for design engineers to rapidly deliver a complete EoAT solution. "There's a need for industrial automation engineers to rely on a toolkit that simplifies the development and commissioning of robotic EoAT solutions," explains Jeff DeAngelis, Vice President of Industrial Communications at Maxim. "The TMCM-1617-GRIP-REF reference design simplifies the tooling development process, allowing automation engineers to focus their time on developing advanced, real-time EoAT solutions that embody the true meaning of delivering intelligence at the edge."

International Engineering Competition
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Learn more:
rohde-schwarz.com
  • Industry News
  • 2021-05-26

This year, the entire competition was held online by Rohde & Schwarz. The competition is aimed at students of electrical engineering, particularly communications engineering, as well as IT, who can participate in trending high-tech topics with practical relevance to companies. The challenge this year was to create a smart software solution to optimize a signal analysis. Engineers who pay very close attention to signal data analysis are highly sought-after in the telecommunications industry. Errors are unacceptable, and inaccuracies are just as unwelcome. Highly reliable signal generators and analyzers are part of day-to-day work in the industry and involve a large number of parameters that can be configured manually. What would the situation for the engineering teams look like if a program code could configure the parameters automatically? This was the question tackled by the 86 students taking part in this year's Engineering Competition. During the competition, they received mobile radio signals to be analyzed using a code to develop in Phython. They were provided with the R&S VSE vector signal explorer software, a state-of-the-art solution giving them a wide variety of analysis tools to evaluate and troubleshoot digitally modulated signals. The students who wrote the best Python program for the automated identification of signal parameters qualified for a more advanced challenge in the finals. The code submitted was evaluated based on signals that were unknown to the student teams.

Power DC-Link Film Capacitor for Automotive and Green Energy Applications
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Learn more:
kemet.com
  • Product Release
  • 2021-05-26

KEMET announces its C4AK high temperature, power film DC-Link capacitor designed for continuous operation up to 1,000 hours at 135°C. The C4AK series joins the C4AU (harsh environment) and C4AQ-P (125°C) family of power DC-Link film capacitors. These series offer higher capacitance density, DC voltage, and DC ripple current capabilities with an extended operational lifetime at high temperatures in harsh environments. Ideal for use in automotive, green, and industrial applications, these metallized film capacitors are well suited for DC filtering and DC-Link in solar, fuel cells, inverters, storage energy systems, automotive (Bi) On-Board Charger, Wireless Power Transfer (WPT), DC/DC, heaters, and welding equipment. Due to its enhanced performance design, the KEMET DC-Link C4AK film capacitor provides a superior alternative for current capacitor solutions. Design features include a radial box style for PCB mounting, miniaturization, low profile, 2 – 4 leads, and fewer capacitors needed in parallel to meet the required peak and ripple current. The C4AK film capacitor surpasses the extreme conditions of the standard automotive (AEC-Q200) requirements for film technology in severe humidity/temperature conditions. Compared to competitor technologies, the C4AK series has greater performance with a lifetime of 4,000 hours at 125°C and 1000 hours at 135°C in harsh environmental conditions. The C4AK DC-Link film capacitor's extended life at high temperatures provides designers an ideal miniaturized, reduced component count solution over conventional film capacitors, particularly in Wide Band Gap high frequency, high current systems.

48 V to 12 V LLC Power Conversion Demonstration Board
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Learn more:
epc-co.com
  • Product Release
  • 2021-05-25

EPC announces the availability of the EPC9149, a 1 kW-capable 48 V input to 12 V output LLC converter that operates as a DC transformer with a conversion ratio of 4:1. This demonstration board features the 100V EPC2218 and 40 V EPC2024 GaN FETs. The board is the size of DOSA-standard ?th brick format, measuring only 58.4 mm by 22.9 mm. This is considerably smaller than alternative silicon-based solutions that are generally sized in the ¼th brick format, or twice as large, for 1 kW of output power. The total thickness of the converter without heatsink is only 10 mm. To make it simple for a power supply designer to easily replicate this design, all supporting materials for this board including schematic, bills of materials, and Gerber files are available on the EPC website. The high-power density, 1226 W/in3, is achieved thanks to EPC GaN FET technology. eGaN FETs enable high switching frequency, in this case 1 MHz, and they are very small, ? of the size of silicon MOSFETs with similar on resistance. The EPC9149 board features four 100 V rated EPC2218 eGaN FETs for the primary rectification, and eight 40 V rated EPC2024 eGaN FETs for the secondary synchronous rectification. The board also features a 4 mm x 4 mm Microchip dsPIC33CKMP102T-I/M6 for flexibility, configuration, communications, and programmability.

Tier 1 Semiconductor Automotive Supplier GaN Power Electronic Program
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Learn more:
oxinst.com
  • Industry News
  • 2021-05-25

Oxford Instruments Plasma Technology announced that a leading German semiconductor manufacturer to the automotive industry has selected its PlasmaPro100 Cobra system for the development of next generation GaN power electronic devices. The production-proven system allows for rapid change between wafer sizes up to 200 mm and the cost of ownership is one of the lowest in the market. The PlasmaPro100 Cobra system will be incorporated into the R&D section and will be used for development of GaN power devices. GaN power devices are gaining market share in fast charger applications and offer benefits in Electric Vehicle power management systems. We continue to see very encouraging signals in the form of increasingly proactive customer engagement and clear market preparation and positioning activities from significant industry players for the emerging Wide Band Gap power electronic market. "Our Atomic Scale Processing etch solution being selected by this world leading manufacturer for their GaN power electronics programme is an important strategic win for Oxford Instruments Plasma Technology" comments Klaas Wisniewski, Plasma Technology's Strategic Business Development Director, who also added: "The GaN based power electronic market is very dynamic with improvements to both performance and cost expected at each design iteration. This reiterates the importance of our strategy to focus on atomic scale processing solutions such as atomic layer deposition (ALD) and atomic layer etching (ALE). We are pleased that such a leading automotive semiconductor company recognizes the benefits our solutions deliver.

Samsung's First MOSFET-based Refrigerator Inverter Design
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Learn more:
infineon.com
  • Industry News
  • 2021-05-25

Infineon Technologies supplied Samsung Electronics with power devices to couple the highest energy efficiency with lowest audible noise. They have been integrated in Samsung's brand new one-door fridge and French Door Fridge inverterized refrigerator. Inverterization is an emerging DC to AC conversion trend in contemporary inverter designs. It helps the application run more quietly and smoothly while the average power consumption is reduced compared to a traditional on/off control. To meet Samsung's requirements towards improved efficiency and lower system cost together with a lower noise level, the Digi Touch Cool, Curd Maestro features multiple power solutions from Infineon – EiceDRIVER gate-driver IC, CoolSET Gen 5 for AC/DC conversion, and 600 V CoolMOS PFD7 for compressor drives. This is Samsung's first refrigerator design that uses discrete devices instead of power modules in the compressor. The 600 V CoolMOS PFD7 superjunction MOSFETs come with a best-in-class body diode allowing for improved soft-recovery index and the industry's fastest reverse recovery time (t rr), making them a perfect choice for home appliance motor drives. Compared to module-based designs, using MOSFETs enables lower energy consumption especially at light-load conditions and an efficiency increase as of 1.7 percent. In addition, this innovative approach allows for a heatsink-less design, a 10 percent reduction in system cost and a longer refrigerator lifetime.

One-step Ball Grid Array Ball-attach Flux
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Learn more:
indium.com
  • Product Release
  • 2021-05-25

Indium Corporation continues to expand its flux portfolio with WS-823-a proven, one-step ball grid array (BGA) ball-attach flux designed to eliminate the costly and warpage-inducing prefluxing step, especially on Cu-OSP substrate. While the standard ball-attach process requires two steps, especially on a Cu-OSP substrate, WS-823 is a halogen-free, water-wash flux designed for a single-step ball-attach process that eliminates the prefluxing step in order to create reliable ball-to-pad joints.
WS-823 provides:
-Tackiness suitable for holding solder spheres in place during reflow
-Excellent solderability on a wide range of surfaces, including AuNi and oxidized Cu-OSP
-Uniform pin transfer over extended periods, eliminating changes in joint quality over time and uneven deposit sizes, which can lead to "missing ball"
-A formula engineered for low-voiding, thereby increasing joint strength
-Good cleanability with room temperature DI water, avoiding the formation of white residue

Last Call for Scientific Papers
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Learn more:
edpc.eu
  • Event News
  • 2021-05-24

The Electric Drives Production Conference (E|DPC) 2021 represents an outstanding platform for the exchange of developers, researchers and users of electric drives. We would be very delighted if you present your latest technical expertise in front of professionals from science and industry. Ten days are left to submit your scientific abstract until May 31, 2021. To ensure a reliable planning for everyone, the E|DPC will take place as a virtual event from December 7 to 9, 2021. E|DPC 2021 offers the possibility to submit different types of contributions. The industrial contribution is an excellent platform to promote new technologies without having to prepare a full paper. Furthermore, scientific contributions are intended for scientists to present their latest research findings in front of peers and to influence industry representatives. All scientific fullpapers that pass the review process will be part of the proceedings of E|DPC. The papers will be indexed by Scopus and Google Scholar. Since the launch in 2011 we publish every year with IEEE and in 2021 this is intended as well. In contrast, the industrial contributions will be made available in the download area of the conference. It is necessary to upload an abstract for each kind of contribution. After accepting the abstracts uploaded, authors of scientific contributions will be asked to upload a full paper being reviewed by the international program committee before acceptance. Authors of industrial contributions will be requested to upload the slides of their presentation shortly before the conference.

SEMICON Southeast Asia Themed "Power Innovation - 5G and Beyond"
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Learn more:
semi.website
  • Event News
  • 2021-05-24

SEMICON Southeast Asia 2021 (23-27 August 2021, Hybrid Event) will gather industry visionaries and experts to highlight the latest developments, innovations, and trends in segments of electronics including Smart Manufacturing, Smart Mobility, Smart Data, AI and 5G as technology continues to reshape the way people work and live.

Anker Selects GaN Technology for Charger Series
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Learn more:
power.com
  • Industry News
  • 2021-05-24

Power Integrations announced the InnoSwitch4-CZ family of high frequency, zero voltage switching (ZVS) flyback switcher ICs. InnoSwitch4-CZ devices incorporate a robust 750 V primary switch using Power Integrations' PowiGaN technology and a novel high frequency active clamp flyback controller to facilitate a new class of ultra-compact chargers suitable for phones, tablets, and laptops. Balu Balakrishnan, CEO of Power Integrations said: "The introduction of the InnoSwitch4-CZ family of ICs marks a significant milestone for GaN technology. PowiGaN switches, in conjunction with our active clamp solution – ClampZero, enable a highly efficient design and an extremely compact form-factor. We're pleased to have worked closely with the Anker team to bring this new class of mobile charger to market." Steven Yang, CEO at Anker added: "We are excited to work with Power Integrations as their exclusive launch partners for their InnoSwitch4 chipsets. The InnoSwitch4-CZ was a natural choice for Anker's new Nano II series of USB-C chargers. Its outstanding levels of integration and efficiency are key to the Nano II series' extremely compact design." Targeting high efficiency compact USB PD adapters, high-density flyback designs up to 110 W and high-efficiency CV/CC power supplies, InnoSwitch4-CZ ICs provide variable output voltage and constant current profiles. Devices are fully protected featuring auto-restart or latching fault response for output over-voltage and under-voltage protection, multiple output under-voltage fault thresholds and latching or hysteretic primary over-temperature protection.

Environmental Vision 2050
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Learn more:
rohm.com
  • Industry News
  • 2021-05-21

ROHM's 'Environmental Vision 2050' contributes to achieving a sustainable society by 2050. In addition to pursuing zero carbon and zero emissions (zero CO2 emissions) based on the three themes of 'climate change', 'resource recycling', and 'coexistence with nature', ROHM will promote business activities in harmony with the natural cycle to protect biodiversity. ROHM's corporate objective is: 'Quality is our top priority at all times'. Since our company's foundation, we have been actively contributing to society and the progress of our culture through a consistent supply, under all circumstances, of high quality products in large volumes to the global market. The role of semiconductors – ROHM's main products – is becoming increasingly important to achieving a decarbonized society. In particular, improving the efficiency of motors and power supplies, which are said to account for the most of the world's electricity consumption, has become our major mission. Against this backdrop, our management vision for 2020 is: 'Focus on power and analog products to solve social challenges by delivering greater energy savings and miniaturization in customer products.' In order to further contribute to society, we will clarify the direction we should take while raising awareness among all group employees.

Magnetic Sensor Family with Analog and Digital Output Format
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Learn more:
micronas.tdk.com
  • Product Release
  • 2021-05-20

TDK Corporation has upgraded its Micronas 3D HAL direct-angle Hall-effect sensor family, HAL 37xy (HAL 37xy, HAR 37xy and HAC 37xy)*, for automotive and industrial applications regarding functional safety aspects. All members of HAL 37xy are now defined as SEooC (Safety Element out of Context) ASIL B-ready, according to ISO 26262. HAL 37xy rotary position detection features are used in applications such as accelerator pedals, electronic throttle controls, rotary shifters (with push-function) and rear-axis steering systems. Furthermore, the sensors detect linear position in applications like clutch or brake pedals, transmission systems, cylinders and valve position sensing.** Relevant documentation, like safety manuals and FMEDA summary reports are available on request. HAL 37xy family's production is already ongoing; samples are available at any time. TDK enabled vertical Hall plates to integrate into the standard CMOS process through its 3D HAL technology. The process made it easier to evaluate relative strength of the horizontal and vertical magnetic field components, which is key for excellent angular performance. In comparison, conventional planar Hall technology is only sensitive to the magnetic field orthogonal to the chip surface. TDK offers three different direct-angle sensor variants with the HAL 37xy sensors: the proven HAL 37xy sensor family, a version with redundancy function via two integrated Hall sensor dies (HAR 37xy), and a version with integrated capacitors (HAC 37xy).

Ultra-Broadband Capacitors for Reliable, Repeatable Performance
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Learn more:
avx.com
  • Product Release
  • 2021-05-20

AVX Corporation has released UBC 550 Series ultra-broadband capacitors designed to deliver reliable, repeatable performance from 16KHz to 70+GHz in ultra-broadband microwave and millimeter-wave RF applications with stringent operating requirements. The UBC 550Z, 550U, and 550L Series ultra-broadband capacitors have a rugged and compact single-piece, surface-mount, multilayer ceramic construction made of the highest quality, RoHS-compliant materials and exhibit ultra-low insertion loss, excellent return loss, flat frequency response, and high unit-to-unit repeatability. These characteristics make the series ideally suited for use in DC blocking, coupling, bypassing, and feedback applications within optoelectronics, high-speed data networks, transimpedance amplifiers, broadband test equipment, synchronous optical networks (SONET), transmit and receive optical subassemblies (TOSA and ROSA), and other ultra-broadband microwave and millimeter-wave RF applications. The capacitors have an orientation-insensitive 0201 form factor measuring 0.58mm X 0.3mm (±0.03mm) and support operating frequencies spanning 160KHz with -3dB roll-off to 70+GHz at 25°C with no bias applied and with typical insertion loss of <0.4dB. They are rated for a minimum of 10nF capacitance, 6.3VDC operation from -55°C to +125°C, and 10VDC operation from -55°C to +85°C. They also exhibit a ±22% temperature coefficient of capacitance (TCC) to +125°C, a ±15% TCC to +85°C, and 108O or 107O minimum insulation resistance at +25°C or +125°C and working voltage DC (WVDC).

SiC FETs in Industry Standard Surface Mount Package
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Learn more:
unitedsic.com
  • Product Release
  • 2021-05-20

UnitedSiC continues to expand its FET portfolio with the introduction of six 650V and 1200V options, all housed in the industry standard D2PAK-7L surface mount package. Available in 30, 40, 80 and 150mO versions, these latest SiC FETs represent another step forward in accelerating migration to SiC across applications such as server and telecom power supplies, industrial battery chargers and power supplies, EV on-board chargers and DC-DC converters. The D2PAK-7L SiC FETs support significantly heightened switching speeds, with a Kelvin source connection improving gate drive return performance, as well as offering industry-leading thermal capabilities. Through the utilization of Ag Sintering, die attachments can be done on conventional PCBs as well as complex insulated metal substrate (IMS) arrangements. In addition, they exhibit excellent creepage and clearance figures of 6.7mm and 6.1mm respectively – meaning the highest degrees of operational safety can be assured even at elevated voltages. "Through the fast switching capabilities of these latest FETs, alongside the superior thermal performance resulting from Ag sintering, we continue to bring performance, reliability, size and layout benefits to the power designer," states Anup Bhalla, VP Engineering at UnitedSiC. The D2PAK-7L devices are fully supported by UnitedSiC's FET-Jet Calculator. Utilizing this free online resource, engineers can assess the different operational parameters needed for their application, carry out detailed performance comparisons and then identify which is the best SiC solution for their design requirements quickly and with confidence.

Perfect Magnetically Shielded Room
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Learn more:
vacuumschmelze.com
  • Product Release
  • 2021-05-19

Researchers at the Paul Scherrer Institute (PSI), located in the Swiss canton of Aargovia, are on the trail of the electric dipole moment of the neutron. For their measurements, VACUUMSCHMELZE GmbH & Co. KG (VAC) recently installed a walk-in shielding room at PSI. This room has the smallest magnetic field and the best shielding against electromagnetic fields in the world. The scientific experiment partly addresses fundamental physics questions: the physicists want to find a neutron electric dipole moment (nEDM). The search for the nEDM is very difficult, since it must be unimaginably small (smaller than 1.8 x 10-26 e-cm, according to current knowledge). Nevertheless, the effort is worthwhile: the nEDM can provide the answer to the question why there is almost no antimatter in the visible universe. VAC is not only characterized by the extraordinary know-how in the development and construction of the shielding booths, the used high permeable alloys are completely manufactured in-house. MUMETALL is characterized to possess the highest permeability of all crystalline materials thus is ideally suited to magnetic shielding. The MSR (Magnetically Shielded Room) for PSI is a seven-shell cabin with external dimensions of 5 x 5 x 4.8 m. A total of 80 feedthroughs with diameters ranging from 55 - 220 mm were placed. The inner booth has a usable space of approx. 2.9 x 2.9 x 2.9 m and has three doors, the largest of which measures 2.6 x 2.6 m. All doors have a mass in the ton range, and a total of about 25 t of the highly permeable MUMETALL material was used.

Common Mode Chokes
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Learn more:
we-online.com
  • Product Release
  • 2021-05-19

Würth Elektronik is expanding its portfolio of common mode chokes with two models. The THT-mountable WE-FCLP for common-mode and differential-mode suppression, and the SMT data line and low-voltage common mode choke WE-CMDC. Both are available from stock without a minimum order quantity. The WE-FCLP has a compact design with a maximum height of 14.5 mm, yet achieves an inductance up to 100 mH. It can suppress common-mode interference up to 85 dB and, thanks to its high leakage inductance, it can be used not only for common-mode suppression but also for differential-mode suppression. WE-FCLP is suitable for applications like mains-powered LED drivers, electronic ballasts, switch mode power supplies and mains filters. WE-CMDC is an AEC-Q200 Grade 1 qualified data line common mode choke. Measuring 11 × 12 × 6 mm, it is also very compact. The choke has a current-carrying capacity up to 8 A and is available with high impedances of 700, 1000 and 1500 ohms. In addition to data and signal lines, applications include low-voltage DC power supplies and DC/DC converters.

ECPE SiC & GaN User Forum
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Learn more:
ecpe.org
  • Event News
  • 2021-05-19

Since more than 14 years the biannual ECPE Wide Bandgap User Forum has explained the background and given advise and support to design-in SiC and GaN devices in power electronic systems. Major progress has been achieved in this period, with today a multitude of SiC diodes and transistors and as well GaN transistors being available and used in series products. For those, special aspects gain importance, such as robustness or qualification when exposed to demanding mission profiles. On the other hand still more basic research and development work is dedicated to special devices made by SiC, GaN and other wide bandgap materials including their potential applications. These actual topics will be addressed during the upcoming 9th ECPE Wide Bandgap User Forum: 30/06/2021 - 01/07/2021
It will start with an overview, introducing the following more detailed presentations. Those will initially refer to exemplary volume applications with SiC and GaN devices. Special attention is dedicated to the design and qualification process including suitable layout methods, measures to achieve the required electromagnetic compatibility and also the aspect of qualification or reliability testing respectively. Circuit theory constitutes the link between system and device; in this respect, drivers are of particular interest. Finally, the related WBG devices themselves will be considered, including an insight and outlook on integration particularly of GaN and on other promising materials. International renowned experts are being invited to give an overview and to in depth explain their research and development work in technical presentations. Besides, the ECPE Wide Bandgap User Forum offers a platform for all participants to share experience and ideas.

Registration Deadline: 23 June 2021

Solution for High-Performance GPUs, Server, 5G, and AI
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Learn more:
aosmd.com/pdf
  • Product Release
  • 2021-05-18

Alpha and Omega Semiconductor announced a series of Smart Power Stages (SPS) targeting multiphase VR regulators powering high-performance GPU and CPU in desktop Add-In Graphics Cards (AICs), gaming laptops, servers, data storage, artificial intelligence, and networking equipment. The AOZ527xQI series uses AOS's latest generation of a flexible smart driver IC and Gen Alpha MOSFET technology to provide benchmark performance in an industry-standard 5mm x 6mm QFN package. The series comprises three DC current levels for multiphase voltage regulator optimization. An SPS provides current monitoring (IMON) and temperature monitoring (TMON) information. The IMON function is used to replace traditional DCR sensing schemes with improved accuracy and eliminates the external components needed for DCR sensing and tuning. The TMON pin doubles as a fault pin, reporting the power stage temperature by outputting an analog voltage of 8mV/°C. The TMON pin is an open-drain output that pulls high in the event of a fault. The AOZ527xQI uses a highly flexible and configurable driver IC to make this SPS compatible with many multiphase controllers in the market. It includes protection features such as Over-Current Protection (OCP), OverTemperature Protection (OTP), High-Side FET Source Detect (HSD), and Pre-Over-Voltage Protection (PreOVP).

65W USB-C PD GaN Adapter Reference Design
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Learn more:
transphormusa.com
  • Product Release
  • 2021-05-17

Transphorm and Silanna Semiconductor announced a GaN power adapter reference design. The solution is an open frame, 65W USB-C Power Delivery (PD) charger that combines Transphorm's SuperGaN Gen IV platform with Silanna Semiconductor's proprietary Active Clamp Flyback (ACF) PWM controller. Together, the technologies yield an unprecedented peak efficiency of 94.5 percent with an uncased power density of 30W/in3. Silanna Semiconductor and Transphorm's universal GaN adapter design is ideal for powering laptops, tablets, smartphones and other IoT devices. The SuperGaN FET is Transphorm's TP65H300G4LSG, a 650 V 240 mO device in an industry standard PQFN88 package. It leverages the SuperGaN Gen IV platform, which uses advanced epi and patented design technologies to improve performance. The robust GaN FET also offers the high reliability synonymous with Transphorm devices, including the industry's best gate robustness. And, unlike e-mode devices, protective external circuitry such as additional bias rails or level shifters are not needed-an advantage that produces higher efficiency. Collectively, these and other features further increase the adapter system's overall power density and reduce BoM costs. Silanna Semiconductor's SZ1130 is the world's first fully-integrated ACF PWM controller that integrates an adaptive digital PWM controller, an Active Clamp FET, an Active Clamp Gate Driver, and a UHV Startup regulator. As an ACF solution, it delivers higher performance than competing quasi-resonant (QR) controllers and offers the simplest design in the smallest PCB area among all ACF controllers in the market.

Sensor Meets Requirements of Automotive Applications
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Learn more:
allegromicro.com
  • Product Release
  • 2021-05-17

Allegro MicroSystems announced the release of the A31315 sensor, member of the 3DMAG family of rotary and linear magnetic position sensor ICs for automotive and industrial applications. 3DMAG sensors combine Allegro's proven planar and vertical Hall-effect technologies to measure magnetic field components along three axes (X, Y, Z), enabling true 3D sensing capabilities with a wide magnetic dynamic range without saturation. The sensors' flexible 3D Hall front end and configurable signal processing architecture enable highly accurate, absolute linear position and rotary position measurements up to 360° while easing system integration challenges by providing greater freedom in sensor placement. Existing Allegro 3DMAG devices, such as the ALS31300 and ALS31313 sensors, also support 3D magnetometer applications in which all three magnetic components (BX, BY, BZ) are required to track complex magnetic movements. The A31315 sensor is available as a single die in a compact SOIC-8 package, and as a fully redundant stacked dual die in a TSSOP-14 package for applications requiring redundancy or higher levels of measurement. Unlike traditional side-by-side dual die configurations, Allegro's stacked die construction closely aligns the sensing elements of both die, ensuring the measurement of nearly identical magnetic fields. This innovative design enables the dual-die A31315 sensor to offer superior channel matching performance and tighter channel comparison thresholds common in fully redundant safety systems. 

Wide-bandgap Power Converters with Inverter Development Modules
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Learn more:
imperix.com
  • Product Release
  • 2021-05-14

Imperix is glad to announce the implementation of the RedLink product range from Firecomms. Imperix has grown a multi-disciplinary product portfolio on inverter modules and high-performance controllers. Such modularity brings many challenges at managing the galvanic isolation throughout the setup while complying with the various sources of EMI-induced perturbations. Firecomms' long-term cooperation with Imperix fostered the implementation of the high-speed version Redlink transceivers within Imperix's Silicon-carbide power modules range. The high-speed, low Pulse Width Distortion (PWD), robust EMI performance, and low propagation delay skew of the 50 MBd RedLink transceivers provide simple, reliable, and galvanically isolated transmission of switching and fault signals while maintaining the time resolution provided by the Imperix B-Box RCP power electronics controller. Thanks to the simplicity and modularity provided by Imperix products supported by Firecomms technologies, the development of Silicon-carbide power inverters and drives is within reach of every electrical engineer. "We're glad to see that our industry-proven optical communication technologies thanks to Imperix products, can accommodate and accelerate the R&D of modern converters", says Michael O'Gorman, Head of Product Development at Firecomms. Simon Delalay, Managing Director at Imperix adds, "Thanks to Firecomms products, our customers are definitely able to develop wide-bandgap inverters as they would play with LEGO blocks".

Reference Design Demonstrates Heatsink-Free 250W Resonant Converter
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Learn more:
st.com
  • Product Release
  • 2021-05-13

STMicroelectronics has released the first reference design for its MasterGaN power packages, demonstrating how the highly integrated devices increase power density, boost energy efficiency, simplify design, and accelerate time to market. The EVLMG1-250WLLC reference design is a 250W resonant converter with a 100mm x 60mm board outline and 35mm maximum component height. It features the MasterGaN1, which contains one half-bridge STDRIVE gate driver optimally connected to two 650V normally-off GaN transistors with matched timing parameters, 150mO on-resistance (Rds(on)), and 10A maximum current rating. The logic inputs are compatible with signals from 3.3V to 15V. MasterGaN1 is suitable for high-efficiency soft-switching topologies including resonant converters, active clamp flyback or forward converters and bridgeless totem-pole PFC (power-factor correction) in AC/DC power supplies, DC/DC converters, and DC/AC inverters up to 400W. The primary side runs heatsink-free, leveraging the high efficiency of the GaN power transistors. In addition, GaN's superior switching performance allows a higher operating frequency than ordinary silicon MOSFETs, permitting smaller magnetic components and capacitors for greater power density and reduced bill of materials. Designed for a nominal 400V supply, the EVLMG1-250WLLC provides a 24V/10A output and achieves maximum efficiency above 94%. Benefiting from MasterGaN's integrated safety features, the converter output is protected against short circuit and overcurrent. There is also brown-out protection and an input-voltage monitor that permits sequencing within an array of DC/DC converters and prevents a motor from starting under low-voltage conditions.

Marie Hayden Appointed to Chief Engineer
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Learn more:
smartwires.com
  • People
  • 2021-05-13

Smart Wires has announced the promotion of Marie Hayden to the role of Chief Engineer where she will lead the design, development and support of Smart Wires products and solutions. "For the past several years, Marie has been a key part of our success in Europe and Australia, and we are excited about the impact she will have leading our engineering team. We identified a clear need for this new role as we position the company to scale and serve a rapidly growing customer base. Marie's proven leadership capabilities, engineering expertise and knowledge of our customers' needs make her the perfect choice for this role and she will be a valued addition to the leadership team at Smart Wires," said Peter Wells, CEO of Smart Wires. Describing her new responsibilities Marie said, "Smart Wires has developed highly innovative technology that is transforming how power grids around the world are planned and operated. In leading the engineering team, my goals include enabling our team to continue to develop safe, high-quality products, fostering an environment in which technical innovation can thrive and delivering world-leading solutions that support our customers' near-term and enduring needs. In this role, I also hope to inspire more women to choose engineering as a career and to embrace leadership roles in this industry." Marie joined the company in 2018 as Vice President, Business Development, and was promoted to General Manager, Europe, in 2020. During this time, Marie significantly grew Smart Wires' customer base in Europe and Australia – collaborating with transmission and distribution companies to help them solve problems and evolve their grids with flexible, high-impact solutions.

Demonstration Board Powered by Gallium Nitride
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Learn more:
epc-co.com
  • Product Release
  • 2021-05-11

EPC announces the availability of the EPC9137, a 1.5 kW, two-phase 48 V – 12 V bidirectional converter that operates with 97 % efficiency in a very small footprint. The design of this demonstration board is scalable; that is, two converters can be paralleled to achieve 3 kW or three converters can be paralleled to achieve 4.5 kW. The board features four EPC2206 100 V eGaN FETs and is controlled by a module that includes the Microchip dsPIC33CK256MP503 16-bit digital controller. By 2025, one of every 10 vehicles sold worldwide is projected to be a 48 V mild hybrid. 48 V systems boost fuel efficiency, deliver four times the power without increasing engine size, and reduce carbon-dioxide emissions without increasing system costs. These systems will require a 48V – 12V bidirectional converter, with power ranging from 1.5 kW to 6 kW. The design priorities for these systems are size, cost, and high reliability. EPC eGaN FETs can operate with 97% efficiency at 250 kHz switching frequency, enabling 800 W/phase compared to silicon-based solutions, which are limited to 600 W/phase due to the limitation on the inductor current at 100 kHz maximum switching frequency. By using GaN FETs, it is possible to reduce the number of phases from five to four for a 3.5 KW converter while increasing efficiency.  The efficiency of a four-phase GaN converter operating at 250 kHz is 1.5% higher than a five-phase silicon MOSFET-based converter operating at 100 kHz.

Clamp Meters with Non-contact Voltage Measurement
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Learn more:
fluke.com
  • Product Release
  • 2021-05-11

Fluke has announced the launch of a family of clamp meters that make electrical measurements much safer for servicing and maintenance technicians. The Fluke 377 and 378 are non-contact voltage True-rms AC/DC clamp meters that allow technicians to make rapid electrical tests without the danger of coming into contact with hazardous live parts. The Fluke 377 and 378 use FieldSense technology to sense voltage and current through the clamp jaw, with only a connection to earth needed for reference. With no direct connection with live components, the risk of electric shock and arc flash is minimized. The clamp meters measure up to 1000 A True-rms AC/DC and up to 2500 A (AC) with the 'iFlex' current probe. Designed for ease of use, only three steps are needed to measure in three phase systems, with each voltage and current shown simultaneously on the dual display. Both meters are available in FC (Fluke Connect1:03 PM) versions with Bluetooth interface. The 377 FC and 378 FC versions also show phase rotation, which can be displayed on a smart phone and saved to the cloud via Fluke Connect software, eliminating the need for handwritten notes. Fluke Connect allows maintenance technicians and service staff to document values and share them with their team. The data gathered can be used as a basis for designing a preventive maintenance program. The 378 FC includes a power quality (PQ) indicator that senses PQ issues, relating to current, voltage or power factor. This allows users to rapidly check if issues relate to the power supply or the connected electrical equipment.

Partner of European Hyperloop Week
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Learn more:
we-online.com
  • Industry News
  • 2021-05-11

Würth Elektronik will support the first European Hyperloop Week as an exclusive partner. From July 19 to 25, 2021, a conference filled with round table discussions, keynotes, and the presentation of vehicles called "pods" will take place in Valencia. The highlight of the event will be the pod competition. Representatives from the manufacturer of electronic and electromechanical components will also present. Leading up to the main event, a major contribution is already occurring Würth Elektronik is sponsoring three Hyperloop teams, supplying components and carrying out the thermal and EMC testing in joint laboratories, which are available at the University of Valencia as part of the long-standing research cooperation with Fundación Catédra. Unveiled by Elon Musk in 2014, the progress of the Hyperloop mobility concept with capsules in evacuated tubes, has been presented mainly at the SpaceX site in Los Angeles County in California, USA. For the first time, Hyperloop Week is coming to Europe. The four Hyperloop teams, HYPED from the University of Edinburgh, Swissloop ETH Zurich, Hyperloop UPV Valencia, and Delft Hyperloop, will host the event. The latter of the three have been supported by Würth Elektronik with components and technical support for years.

Square Leaded DC-Link Capacitor Series
  • Product Release
  • 2021-05-10

Rated for operation at up to 105°C ambient, UL 810 listed, compact size dc-link capacitor series CBB 138 DS from Jianghai covers the voltage range from 450 ~ 1200V while the capacitance comprises values from 1 ~ 120µF. The advanced, self-healing polypropylene dielectric in conjunction with the in-house heavy edge metallization result in superior ripple current capability while being compact in size. The 2- and 4-pin PCB-mount types in a UL 94 V-0 recognized, square plastic encapsulation yield low serial inductance and best volumetric efficiency. This makes the capacitors an ideal choice for demanding industrial applications, e.g. frequency converters and power supplies. The design of the IEC 61071 compliant series can be adapted to provide customized solutions

Quality Award for Austrian Power Supply Manufacturer
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Learn more:
recom-power.com
  • Industry News
  • 2021-05-07

The Austrian design-in distributor presents power supply manufacturer RECOM with the CODICO Quality Award. In addition to delivery reliability and logistics services, CODICO particularly emphasises the manufacturer's ability to innovate. Cooperation with high-performance suppliers makes a significant contribution to the long-term success of the company. It is a basic prerequisite for CODICO's Design In concept. Every year, the distribution company evaluates its strategic suppliers worldwide according to uniform, comparable criteria: Delivery reliability, service orientation, innovativeness, cooperation, flexibility and sustainability are central elements of this assessment. Among other things, services such as sample shipments and service and quality criteria in sales support as well as reaction speed and commitment are also taken into account. RECOM, the power supply specialist also based in Austria, is pleased to accept the A-Supplier award this year. "RECOM is an important partner for us who invests a lot of commitment in the further development of complex power supply solutions and who seeks cooperation in the design of product roadmaps," says Sven Krumpel, CEO of CODICO, underlining the award. CODICO values the cooperation with dynamic and innovative suppliers. RECOM is an essential key partner for CODICO in accessing certain areas in medical technology but also in the miniaturisation of PCB modules.

Leader in GaN Power ICs to Go Public at an Enterprise Value of $1.04 Billion
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Learn more:
navitassemi.com
  • Industry News
  • 2021-05-07

Navitas Semiconductor announced that it has entered into a definitive agreement to combine with Live Oak Acquisition Corp. II ("Live Oak II"), a publicly-traded special-purpose acquisition company. The transaction, which values the combined entity at a pro forma equity value of $1.4 billion, will result in Navitas becoming a publicly-traded company on a national exchange under a new ticker symbol. Gallium nitride (GaN) is a next-generation semiconductor technology that runs up to 20x faster than legacy silicon, and enables up to 3x more power and 3x faster charging in half the size and weight. Navitas GaNFast power ICs integrate GaN power and drive plus protection and control to deliver simple, small, fast and efficient performance. Driven by increasing demand for connectivity, electrification away from fossil fuels, and efficient sustainable energy sources, Navitas predicts GaN ICs can address markets estimated to grow to over $13 billion in 2026. Markets include mobile, consumer, enterprise (data center, 5G), renewables (solar, energy storage) and EV / eMobility. Gene Sheridan, co-founder and CEO of Navitas commented: "Navitas was formed with the vision to revolutionize the world of power electronics while addressing significant sustainability challenges for our planet. Not only has Navitas' world-class team invented and patented revolutionary new technology, but we have also overcome all the key hurdles associated with successfully bringing it to market. We are proud to enter the public capital markets with strong operating momentum and investor partners who share our enthusiasm for our long-term mission."

Increasing Supply Security for Silicon Carbide
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Learn more:
infineon.com
  • Industry News
  • 2021-05-06

Infineon Technologies has concluded a supply contract with the Japanese wafer manufacturer Showa Denko K.K. for an extensive range of silicon carbide material (SiC) including epitaxy. The German semiconductor manufacturer has thus secured more base material for the growing demand for SiC-based products. SiC enables highly efficient and robust power semiconductors that are used in particular in the fields of photovoltaic, industrial power supply, and charging infrastructure for electric vehicles. "Our broad and fast growing portfolio demonstrates Infineon's leading role in supporting and shaping the market for SiC-based semiconductors which is expected to grow 30 to 40 percent annually over the next five years", says Peter Wawer, President of the Industrial Power Control Division at Infineon.* "The expansion of our supplier base with Showa Denko for wafers in this growth market marks an important step in our multisourcing strategy. It will support us to reliably meet the growing demand mid to longterm. Furthermore, we plan to collaborate with Showa Denko on the strategic development of the material to improve the quality while cutting costs at the same time." "We are proud to be able to provide Infineon with Best-in-Class SiC material and our cutting-edge epitaxy technology" says Jiro Ishikawa, Senior Managing Corporate Officer from Showa Denko K.K.. "Our aim is to continuously improve our SiC material and develop the next technology. We value Infineon as an excellent partner in this regard." The contract between Infineon and Showa Denko K.K. has a two-year term with an extension option. Infineon has the industry's largest portfolio of SiC semiconductors for industrial applications.

Software for Control and Tuning of ICs in BLDC Motor Drives
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Learn more:
power.com
  • Product Release
  • 2021-05-06

Power Integrations released its Motor-Expert software, an embedded "C" code application, library and control GUI that enables designers using the company's BridgeSwitch brushless DC (BLDC) motor driver ICs to precisely control and tune single-phase motors. BLDC motors are widely used in modern, high-efficiency appliances such as compressors, fans and water pumps in domestic appliances, and for ceiling fans and room air conditioning systems. The Motor-Expert software features accurate speed and current control loop functions. The modularity and flexibility of the API-based software architecture enables new use cases and functions to be added and allows users to port the software to their favorite microcontroller or combine with other code in a system CPU. The software meets static (MISRA) and dynamic performance profiling covering latency, jitter and execution time. It requires only 14 kB code memory and 5 kB SRAM, suiting it to microcontrollers with small memory capabilities. The BridgeSwitch motor drive IC can pair with 3 V and 5 V MCUs and removes the need for an external shunt resistor. The BridgeSwitch integrated half-bridge IC family dramatically simplifies the development and production of high-voltage, inverter-driven single- or multi-phase PM and BLDC motor drives. The superior efficiency and distributed thermal footprint architecture of BridgeSwitch motor drives eliminates the need for a heatsink, reducing system cost and weight. Built-in hardware motor overcurrent protection enhances safety and reliability, and simplifies IEC 60335-01 and IEC 60730-01 certification, significantly reducing time-to-market.

Acquisition of H. K. Wentworth Group
  • Industry News
  • 2021-05-05

MacDermid Alpha announced that it has acquired H.K. Wentworth Group, owner of the Electrolube & AF brands. "We are very excited to announce this acquisition. H. K. Wentworth Group has a long history of providing innovative and high-quality materials used in the electronics industry," said Joe D'Ambrisi, Executive Vice President and Head of Electronics of MacDermid Alpha Electronics Solutions. We believe that H. K. Wentworth Group's product lines, customer relationships, and resources will reinforce our position as a leading supplier to the industries we serve, and will allow us to more efficiently deliver a wider range of complementary, enabling solutions to our customers. With this acquisition, MacDermid Alpha will continue to be well-situated to capitalize on the many emerging trends in the electronics industry. We view this important acquisition as an excellent step to position the business for continued growth as we work with customers to solve their assembly challenges." This acquisition is aligned with MacDermid Alpha's strategic goals and priorities, namely, to drive growth through the delivery of innovative, value added solutions and services into the global electronics industry. H. K. Wentworth Group's leading products and development initiatives will amplify the already strong programs in the MacDermid Alpha pipeline and will enable continued focus on high growth segments, such as automotive, medical, consumer electronics and 5G communications.

UK Facility Achieves AS9100D Certification
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Learn more:
ttelectronics.com
  • Industry News
  • 2021-05-05

TT Electronics announced that its Eastleigh UK facility has achieved AS9100D certification for the manufacture of systems for the aerospace industry. This certification marks TT's ongoing commitment to provide innovative, safety-critical solutions to the global aerospace supply chain. AS9100, standardised by the globally recognised International Aerospace Quality Group (IAQG), is considered the highest international standard for quality assurance across the aviation, space, and defence industries, and has been widely adopted to promote quality, safety, and continuous product and process improvement. Upgrading the Eastleigh facility to meet AS9100D, the most current version of the standard, was the result of a lengthy audit process in which TT demonstrated a high level of excellence in all areas of the company's quality management system. The Eastleigh location is the twelfth TT location worldwide to meet the rigorous requirements of AS9100 certification, strengthening the company's position as a leading aerospace manufacturing partner – dedicated to providing custom technology solutions. "This certification is an important step in our aerospace growth strategy. Our facility in Eastleigh, which is also SC21 accredited, specialises in the design and manufacture of aircraft interior solutions for commercial aircraft," said TT Electronics EVP, Charlie Peppiatt. "TT has supported technology innovations in this sector for decades, including lightweight, space-saving, and power-efficient cabin signage and mood lighting. While we have always been focused on providing our customers with quality products and services, achieving the AS9100D certification is a well-earned achievement that confirms our steadfast emphasis on quality management."

AEC-Q101 Approved Trench Schottky Rectifiers
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Learn more:
nexperia.com
  • Product Release
  • 2021-05-04

Nexperia extended its portfolio of Trench Schottky rectifiers with devices rated at up to 100 V and 20 A. The parts feature excellent switching behavior and leading thermal performance. They are available in Nexperia's Clip Bond FlatPower (CFP) packages which have a much smaller footprint than SMA/SMB/SMC components. Trench technology results in low leakage and also greatly reduces the charge, Qrr, stored in the device. Therefore, Trench Schottky rectifiers deliver very fast switching, cutting both the switching losses of the rectifier and the losses that are induced in the MOSFET in the same commutation cell – a configuration that is commonly used in asynchronous switch-mode power converters. Nexperia's PMEGxxxTx devices additionally provide a wide safe operating area (SOA), delivering an extra safety margin and reducing the risk of thermal runaway compared to parts currently available. Jan Fischer, Nexperia's product manager comments: "Nexperia's Trench Schottky rectifiers combine low forward voltage and very low Qrr to enable best efficiency at high switching speeds as needed in switch-mode power converters. Automotive applications including LED lighting, in particular, will benefit from the wide SOA of our parts." Nexperia is investing in its portfolio of Trench Schottky rectifiers, now offering 32 devices from 40 V to 100 V and up to 15 A in volume production. A further 17 parts, including the 20 A types, are sampling.

Photovoltaic Fuses Provide Rugged Circuit Protection
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Learn more:
littelfuse.com
  • Product Release
  • 2021-05-04

Littelfuse announced the 400PV Fuse series, a 2410 size, surface mount design (SMD) circuit protection component that offers low resistance for photovoltaic (PV) applications. The 400PV is specifically designed to address the latest trend in solar roofing by enabling PV shingles that integrate both the shingles with the PV cells while incorporating protection that meets the UL 248-19 standard for PV applications. This new development helps eliminate mounting separate solar panels over the existing roofing, allowing the use of the new integrated PV shingles to serve in a dual function – as the protective roofing material while collecting electricity to power the building. "The 400PV Fuse series innovation enables the next generation of smart home designs to utilize photovoltaic roof shingles to power up everything in a house that requires power," said Boris Golubovic, Vice President, Marketing and Strategy at Littelfuse. "The protection provided by these PV fuses help ensure the operational longevity, maintenance convenience, and safety of solar home and building applications."

Dr. Michael MacMillan Appointed as Vice President, Sales and Marketing
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Learn more:
epiluvac.com
  • People
  • 2021-05-04

Epiluvac AB announced that Dr. Michael MacMillan has joined the company as Vice President of Sales and Marketing. Dr. MacMillan will be responsible for Epiluvac's global sales and marketing, and will be based at the company's new office in Orange County, CA, USA. Bo Hammarlund, Board Director, Business Development says - "This is an important milestone for Epiluvac. We see a growing demand for the next generation CVD equipment, not only for Silicon Carbide (SiC) but also for Gallium Nitride (GaN). Mike's expertise in SiC epitaxy, together with his long experience from both research and manufacturing companies, will certainly bring exciting benefits to our products and also our customers." Dr. MacMillan was recently Chief Epitaxial Scientist at SemiQ (formerly Global Power Technologies Group), Lake Forest, CA, and his career spans from early SiC research at Linköping University, Sweden in the 1990's to many years as leader and SiC scientist in major US companies like Northrop Grumman and Dow Corning. Dr MacMillan holds a PhD in Physics from University of Pittsburgh. "This is a great opportunity and privilege to be part of this highly skilled team with their new, exciting CVD platform for wide bandgap semiconductors," says Dr. MacMillan.

SUPERFET MOSFETs and SiC Diodes Introduced at PCIM Europe 2021  
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Learn more:
onsemi.com
  • Product Release
  • 2021-05-04

ON Semiconductor introduced Super-junction (SJ) MOSFETs and SiC. The 650 V SUPERFET III FAST SJ MOSFETs deliver better switching performance than other SJ MOSFETs on the market, with improved efficiency and higher system reliability. These features are in high demand in fast-growing markets, including 5G, electric vehicle (EV) charging stations, telecoms and server sectors. ON Semiconductor also introduced automotive AECQ101 and industrial grade qualified next generation 1200 V SiC diodes, ideal for high power applications such as EV charging stations and solar inverters, UPS, electric vehicles (EV) on-board chargers (OBC), and EV DC-DC Converters. SiC diodes offer significant advantages over silicon solutions, including higher reliability, lower EMI and simpler cooling requirements. The design improves on the first generation SiC diodes thanks to a smaller die size and lower capacitance. The NVDSH20120C, NDSH20120C, NVDSH50120C, and NDSH50120C deliver a lower forward voltage drop and a 4x increase in rated current, with a higher rate of change (di/dt) of 3500 A/µs. The smaller die size also returns a 20 % lower thermal resistance in an F2 package.

Expanded Lineup of Shunt Resistors
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Learn more:
rohm.com
  • Product Release
  • 2021-05-04

ROHM developed the GMR320 series of shunt resistors featuring a rated power of 10W. GMR320 series is the largest rated power product in ROHM high-power low-ohmic GMR series lineup designed for high power applications in the automotive, industrial equipment, and home appliances. Recent years have seen an increasing of requirement in the automotive and industrial fields for lower power consumption in higher power applications. This in turn requires shunt resistors that support high power and high accuracy current detection to achieve high efficiency operation in a variety of applications. ROHM's GMR and PSR series shunt resistors provide highly accurate current detection even at high power, making them ideal for high power applications in the automotive, industrial and consumer sectors. The GMR320 series is offered in a resistance value range from 5mO to 100mO and a rated power of 10W, making them ideal for automotive engine ECUs and headlamps as well as motors and power supplies for industrial equipment and home appliances. Unique structure and optimized materials allow the GMR320 series to reduce surface temperature rise by 23% over standard products, ensuring high ruggedness against overcurrent loads even though it has the smallest size among 10W class resistors in the market . In addition, a high performance metal alloy for the resistive material provides low Temperature Coefficient of Resistance (TCR), that makes it reliable and highly accurate current detection possible even in the low resistance values.

Advanced Battery Energy Storage Systems
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Learn more:
leclanche.com
  • Product Release
  • 2021-05-04

Leclanché SA is introducing a concept in battery energy storage systems featuring plug and play simplicity, scalability, modularity, a reduced carbon footprint and environmental impact. Introducing LeBlockTM, a series of interchangeable five-foot wide blocks which interlock to allow for shipping as a standard 20-foot ISO container and serve as the heavy-duty enclosure for the installed system. The blocks are manufactured in two varieties:
BatteryBlock – Shipped with pre-installed liquid-cooled battery racks up to 745 kWh (as of today). Each battery block is equipped with a fire protection system.
CombiBlock – Connects the battery blocks and is equipped with appropriate protection devices. Furthermore, it contains a centralized liquid cooling unit dedicated to the temperature management of the connected battery blocks.

Blocks can be easily moved from a boat to a truck for simplified transportation and installation on a slab/pad by crane. No packaging or container waste removal is required. Since the blocks are shipped with the batteries in-place and wiring/connectors pre-installed, there is no site-specific cabling required.
Blocks offers the possibility for use in a storage as a service approach, where the blocks are transported and relocated depending on the real need, such as for EV charging stations that need higher power than the existing grid connection.

Small TVS Diodes for Effective ESD Protection
  • Product Release
  • 2021-04-29

TDK Corporation has released tiny high-power TVS diodes for ESD protection, extending its portfolio of components for bidirectional overvoltage protection of I/O interfaces. The space requirement of the so-called chip scale package (CSP) is just 400 x 200 µm2 (CSP01005) or 600 x 300 µm2 (CSP0201), while the package height of just 100 µm is also very low. The TVS diode types are designed for an operating voltage of 5 V and a response voltage of 6.8 V. The clamping voltages of the components are 7.2 V at a peak pulse current of 8 A or 8 V at a peak pulse current of 16 A. The TVS diodes differ in their parasitic capacitances: Type SD0201SL-GP101 (ordering code B74121G0050M060) has a capacitance of 12 pF, while the SD01005SL-GP101 type (B74111G0050M060) has a capacitance value of just 5 pF. Other features include the short response time and low leakage current of just 2 nA at 3.3 V. The protective components are designed in accordance with IEC 61000-4-2 for an ESD contact discharge of up to 24 kV, exceeding standard requirements. They can withstand a high surge current load of up to 8 A according to IEC 61000-4-5 (8/20 µs), despite their low size. The TVS diodes are suitable for various IoT, smart home, and Industry 4.0 applications. Due to their minimal dimensions, the new protective components are ideal for wearables, smartphones, notebooks, tablets, smartwatches or even hearing aids.

Digital PoL Regulator in Sompact SIP
  • Product Release
  • 2021-04-29

BMR474 is a non-isolated digital Point of Load (PoL) regulator. The module comes in a vertically mounted SIP (Single Inline Package) design, which saves valuable board space, while being able to deliver up to 80 A output current, with a maximum power output of 198 W. Designed for telecom and datacom applications, the BMR474 offers an excellent price to performance ratio, and offer efficiency levels as high as 95.1% at 12 Vin, 3.3 Vout, full load. The input voltage range is 6 V to 15 V, and the output voltage can be adjusted from 0.6 V to 3.3 V. For output voltages up to 1.8 V, the BMR474 can deliver up to 80 A output current, while for output voltages over 1.8 V the maximum output current is 60 A. Ripple and noise is 5 mV at 12 Vin, 1 Vout, full load. The SIP module includes power connections optimized for high current minimizing the resistive losses between the power module and the load. While the high efficiency and optimized thermal design provide minimum power derating, an optional heatsink can be added for even more demanding applications. The BMR474 is easy to set up via its PMBus digital interface, which provides extensive monitoring, configuration and control capabilities, and is also supported by Flex Power Modules' Power Designer software, which makes design and debug simpler. By using the software's simulation functions, it's straightforward to optimize the configuration parameters, which means designers can achieve a stable control loop with a fast load transient response.

Dr. Alain Charles Joins as Non-executive Board Member
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Learn more:
camgandevices.com
  • People
  • 2021-04-29

Cambridge GaN Devices Ltd. (CGD), the fabless semiconductor company spun out of Cambridge University, has announced the appointment of industry veteran Dr. Alain Charles as a non-executive board member. Dr Charles has more than 30 years in the semiconductor industry and has joined to accelerate CGD's mission to shape a sustainable future for power electronics. CGD is developing a range of GaN transistors that are customised for key applications in market segments such as consumer and industrial Switch Mode Power Supply (SMPS), lighting, data centres and automotive HEV/EV. Its proprietary ICeGaN technology will allow it to replace silicon in those key applications, while enabling more compact power systems and better use of energy resources. The appointment will see Dr. Charles offer CGD an independent view on the GaN ecosystem while serving as a strategic advisor on energy related initiatives, influencing and steering the board direction. He will also support CGD through strategic introductions to influential R&D institutions, partners, industry bodies and policy makers. These connections will help support CGD's efforts towards delivering green electronics and reshaping the industry towards more sustainable practices. He joins with the semiconductor industry on the cusp of major change. GaN powered devices are significantly higher performing than state-of-the-art silicon-based devices, enabling reductions in the size and weight of power converters, whilst producing energy efficiencies higher than 99%.

GaN for 1200V Applications
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Learn more:
imec-int.com
  • Industry News
  • 2021-04-29

Imec and AIXTRON have demonstrated epitaxial growth of gallium-nitride (GaN) buffer layers qualified for 1200V applications on 200mm QST substrates, with a hard breakdown exceeding 1800V. The manufacturability of 1200V-qualified buffer layers opens doors to highest voltage GaN-based power applications such as electric cars, previously only feasible with silicon-carbide (SiC)-based technology. The result comes after the successful qualification of AIXTRON's G5+ C fully automated metal-organic chemical vapor deposition (MOCVD) reactor at imec, Belgium, for integrating the optimized material epi-stack. Wide-bandgap materials gallium-nitride (GaN) and silicon-carbide (SiC) have proved their value as next-generation semiconductors for power-demanding applications where silicon (Si) falls short. SiC-based technology is the most mature, but it is also more expensive. Over the years tremendous progress has been made with GaN-based technology grown on for example 200mm Si wafers. At imec, qualified enhancement mode high-electron-mobility transistors (HEMTs) and Schottky diode power devices have been demonstrated for 100V, 200V and 650V operating voltage ranges, paving the way for high-volume manufacturing applications. However, achieving operating voltages higher than 650V has been challenged by the difficulty of growing thick-enough GaN buffer layers on 200mm wafers. Therefore, SiC so far remains the semiconductor of choice for 650-1200V applications – including for example electric cars and renewable energy.

The 2021 VLSI Symposia
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Learn more:
vlsisymposium.org
  • Event News
  • 2021-04-27

The 2021 Symposia on VLSI Technology & Circuits have announced their technical program, which highlights the theme "VLSI Systems for Lifestyle Transformation." Due to continuing concerns over the global COVID-19 pandemic, the Symposia will be held on a worldwide accessible schedule from June 13th – 19th with a fully virtual format. Despite the difficulties of COVID-19, VLSI development continues to advance at a fast rate. The latest in innovative and life-enhancing circuits and technologies will be presented at VLSI Symposia 2021. The Symposia program provides a unique perspective on the microelectronics industry by integrating the technology ecosystem of converging industry trends – machine learning, IoT, artificial intelligence, wearable/implantable biomedical applications, big data, cloud / edge computing, virtual reality (VR) / augmented reality (AR), robotics, and autonomous vehicles – with the advanced circuit design and application platforms that will realize the future promise of "ubiquitous intelligence."

Developing a 300 MWp Solar Project in Spain
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Learn more:
tartessospower.com
  • Industry News
  • 2021-04-27

Spanish project developer Tartessos concludes a service agreement with RP Global as the two renewable energy companies set out to develop a 300 MWp PV project together in the Castilla-León region in Spain. "RP Global is a recognised international player with over 35 years of experience in the market and a well-established team of development experts. This makes RP Global a great fit for us", says Dr. Rainer Kistner, Managing Partner of Tartessos Power Development. The land for the 300 MWp project has already been secured and  rigorous environmental impact assessments have raised no red flags. "Tartessos's experience and strong track record of project delivery convinced us that they are an ideal company for us to partner with to develop this significant project.", explains Jorge Rodriguez, RP Global's CFO and Country Manager for Spain, adding: "Identifying the right long-term local partner to develop our projects is becoming more and more important for us, as we aim to develop a 2GW pipeline of wind and solar PV in Spain by 2024." The development of further joint projects in the region are being discussed. The companies are also exploring the possibility of converting the planned 300 MWp solar park into a wind-solar hybrid project.

APEC Industry Session Explores Rapid Growth Markets
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Learn more:
apec-conf.org
  • Event News
  • 2021-04-27

The Power Sources Manufacturers Association (PSMA) Marketing Committee is sponsoring an Industry Session at APEC 2021 addressing the trends within fast growing market sectors. The presentations and audio recordings will be available to APEC registrants ON DEMAND beginning on Wednesday, June 9, 2021. There will also be a live Q&A session during the week of June 14 where you will have the opportunity to interact with live speakers and follow up on any questions you have from the on-demand sessions. The Market Trends Industry Session (IS02) will feature eight presentations by industry leaders focusing on important aspects of a number of dynamic and rapidly growing market sectors. Ada Cheng and Marijana Vukicevic, Co-Chairs of the Market Trends Industry Session, commented "We are excited that the PSMA Marketing Committee is organizing this year's Market Trends Industry Session. This cohesive session features knowledgeable and respected representatives from industry who will focus on issues that impact the future growth of key industry market segments." Ada and Marijana encourage everyone to register for APEC and attend this valuable industry session and to consider participating in the other PSMA-sponsored Industry Sessions during the week.

The smarter E Europe Restart 2021 in October
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Learn more:
thesmartere.de
  • Event News
  • 2021-04-27

Due to the pandemic, The smarter E Europe and its four concurrent energy exhibitions Intersolar Europe, ees Europe, Power2Drive Europe and EM-Power Europe will no longer take place from July 21–23, 2021. Instead, The smarter E Europe Restart 2021 will be staged at Messe München from October 6–8. The smarter E Industry Days, including the award ceremony for The smarter E AWARD, Intersolar AWARD and ees AWARD 2021, will be held online from July 21–23, 2021 when the in-person event should have taken place. Due to the pandemic, the organizers of The smarter E Europe – Solar Promotion GmbH and Freiburg Wirtschaft Touristik und Messe GmbH & Co. KG (FWTM) – have decided that the event can no longer take place in July 2021. Despite the current developments surrounding vaccinations and rapid testing in Europe and the progress expected by the end of the second quarter as well as the professional and comprehensive health and safety plan prepared by the organizers, there are no indications from policymakers at present that the event can feasibly go ahead. "We came to this decision in close coordination with the industry's international associations. We knew that everyone involved – from exhibitors, visitors and conference attendees to speakers, sponsors and ourselves as organizers – was in the process of making their final arrangements and that, in the interests of planning, we couldn't delay making a decision," explains Markus Elsässer, CEO of Solar Promotion GmbH.

Line of Regenerative Power Supplies and Electronic Loads
  • Product Release
  • 2021-04-27

In response to demand driven by the rapidly expanding electrical vehicle market, EA Elektro-Automatik has developed a range of products for the entire spectrum of battery recycling – from battery testing/recharge to second life to final recycling. E-mobility is booming. But with increasing operating time, the lithium-ion batteries used become less effective and need to be replaced in the vehicle. The old batteries then begin a second life or are finally recycled and completely discharged. EA offers a wide ranging product line for initial battery production, recharging, second life test and final recycling. Its bidirectional power supply EA-PSB 10000 and regenerative electronic load EA-ELR 10000 provide safe and sustainable preparation of discarded batteries – with 96% regeneration efficiency. If the storage capacity of the lithium-ion battery systems is no longer sufficient for use in e-vehicles, residual capacities may well be available for second-life use as energy storage for solar power or wind energy. With the EA-PSB 10000 bidirectional power supply, the batteries are tested for their remaining capacity by charging them to almost 100% and then discharging them again. At 30kW in a 4U package, the EA-PSB 10000 bidirectional power supply offers the highest power density on the market. Up to 1.92 MW is possible in a rack system, which means that mass testing is also possible without any problems. In addition, EA-PSB 10000 can seamlessly switch between operation as source and sink, which offers additional time savings.

Integrated Brand for Electronic Components Business
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Learn more:
avx.com
  • Industry News
  • 2021-04-27

Kyocera Corporation and AVX Corporation announced that the companies have established a new integrated brand "KYOCERA AVX" to be used for the Kyocera group's electronic components business starting in October, 2021 (or later) following the integration of Kyocera's "Corporate Electronic Components Group" and "AVX" into a new segment, "Electronic Components Business" as of April 1, 2021. The new brand structure will accelerate and strengthen the growth of Kyocera's electronic components business worldwide. In addition, sales organizations in the U.S. and Europe will unify starting in October 2021 (or later), and sales in Japan, China and other Asian nations will follow beginning in April 2022 (or later). This consolidation will enhance the global sales capabilities, and maximize synergy by combining the companies' resources of manufacture and development for further expansion of its global business. AVX, a wholly-owned subsidiary of Kyocera, is a leading global supplier of a wide range of products, including electronic components, connectors, and sensors. AVX has been working proactively on expanding its product lineup, business domains, and market shares through R&D and M&A. In its key markets, Kyocera expects demand for electronic components to accelerate due to the widespread use of IoT, 5G and Advanced Driver Assistance System, and rapid technological innovation and business opportunities are brought about by the progression of the so-called "the 4th Industrial Revolution."

Ultra-fast Charging in European and North American Urban Centres
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Learn more:
jolt.energy
  • Industry News
  • 2021-04-27

JOLT and AECOM are pleased to announce an agreement to deploy ultra-fast charging in major European and North American urban centers. Under the agreement, JOLT will manufacture the charging stations and operate the network; while AECOM will develop and execute an international rollout plan, including program management, site development, equipment deployment, commissioning and field services. JOLT envisions deploying up to 15,000 chargers in 250 urban centers through 2025, split equally between Europe and North America.  The deployment will focus on JOLT's Merlin ultra-fast flexible charger, which can be deployed in virtually any environment. Merlin is designed and developed in Germany specifically for city charging situations, where the existing electricity grid makes the provision of DC fast-charging extremely challenging. "As we set-off on this adventure, we're thrilled to have AECOM bring its enormous level of technical expertise and experience to our mission, with an impressive record of delivering complex international projects on time," says Maurice Neligan, CEO of JOLT. The companies will collaborate to define a roadmap for the deployments, taking into account e-mobility penetration in the various urban markets, as well as the availability of sites, local commercial and municipal support.

SiC Intelligent Power Modules Platform Expanded
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Learn more:
cissoid.com
  • Product Release
  • 2021-04-27

CISSOID is adding to its growing platform of 3-Phase Silicon Carbide (SiC) MOSFET Intelligent Power Module (IPM) products by introducing liquid-cooled modules for E-mobility tailored for lower switching losses or for higher power. The company is also introducing a module based on a lightweight AlSiC flat baseplate that meets the demand for natural convection or forced cooling in aerospace and in dedicated industrial applications. These products integrate a 3-Phase SiC MOSFET module with a powerful gate driver. Two liquid-cooled power modules based on a pin fin baseplate are rated for 1200V blocking voltages and for 340A to 550A Maximum Continuous Currents. The On Resistance ranges from 2.53mOhms to 4.19mOhms depending on current rating. The total switching energies are as low as 7.48mJ (Eon) and 7.39mJ (Eoff) at 600V/300A. The co-design of the power module and the gate driver enables optimizing the IPMs for lowest switching energies by carefully tuning dV/dt and controlling voltage overshoots inherent to fast switching. The new air cooled module is designed for applications where liquid cooling is not an option, like aerospace electromechanical actuators and power converters, for example. This module is rated for a blocking voltage of 1200V and a Maximum Continuous Current of 340A. The On resistance is equal to 3.25mOms. Turn-on and turn-off switching energies are respectively 8.42mJ and 7.05mJ at 600V and 300A. The power module is cooled down through an AlSiC flat baseplate.

Funding for Transformational Energy Technology
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Learn more:
nomispower.com
  • Industry News
  • 2021-04-26

NoMIS Power Group announced that it was awarded 498,000 in funding from the U.S. Department of Energy's Advanced Research Projects Agency-Energy (ARPA-E). The funding will be used to develop silicon carbide (SiC) –based power modules for power electronic applications that will deliver a step-change in efficiency and reliability to support the global energy transition. "We are very excited to have ARPA-E support for NoMIS Power Group's transformative, enabling technology for the electrified economy and the global effort to tackle climate change," said co-founder Adam Morgan. NoMIS Power Group is a high-tech start-up company spun out of SUNY Polytechnic Institute (SUNY Poly) in Albany, NY, working to accelerate the clean tech revolution through the application of novel semiconductor devices and power packaging materials for the global power electronics market. Founded by SUNY Poly postdoc Adam Morgan, SUNY Poly Professors Dr. Woongje Sung and Dr. Shadi Shahedipour-Sandvik, as well as Ohio State University Professor Dr. Anant Agarwal, NoMIS Power Group brings together unique US-based expertise across the power semiconductor, power packaging, and power electronics fields. Notably, NoMIS Power Group's world-leading expertise in the application of SiC has made the company a go-to resource for R&D and manufacturing leaders seeking to leverage the transformative potential of this novel material. NoMIS Power Group received this competitive award from ARPA-E's Topics Informing New Program Area's Supporting Entrepreneurial Energy Discoveries (SEED). SEED seeks to support entrepreneurial energy discoveries, by identifying and supporting disruptive concepts in energy-related technologies within small businesses and collaborations with universities and national labs.

Expanded Supercapacitor Offerings
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Learn more:
cde.com
  • Product Release
  • 2021-04-26

Cornell Dubilier has announced that additional capacitance values and cell sizes have been added to its already extensive supercapacitor platforms, the DGH 2.7 volt and DSF 3.0-volt series. The expansion comes on the heels of the recent addition of cutting-edge LiC hybrid types which offer higher operating voltages and greater energy densities. Supercapacitors (aka EDLCs or ultracapacitors) are rapidly becoming essential components for power circuit designers. They are used to supplement rechargeable batteries or as replacements for batteries in a very diverse range of applications. These components add powerful options for engineers. According to Brendan Andrews, Business Unit Manager, "Our technology is used in a wide variety of applications such as battery backup in smart meters, handheld scanners, printers, electronic valve actuators, green energy systems, and even automated material handling. The latest expansion significantly contributes to the most comprehensive product offering in the industry and further opens up additional application opportunities."  Andrews added that "Supercapacitor technology has witnessed significant price reductions over the past several years, generating mass market appeal." The company's product line now ranges from board-mountable coin cell types to radial form factors and larger snap-in types. CDE can also combine components to create higher voltage custom modules with active or passive balancing.  Most devices offer an operating temperature range of -40 °C to 85 °C and are all UL recognized.

Inductors Optimised for In-vehicle PoC Systems
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Learn more:
murata.com
  • Product Release
  • 2021-04-22

Murata continues to support ongoing engineering progression within the automotive sector with the introduction of the LQW21FT_0H series. These are inductors with broadband impedance for in-vehicle power-over-coax (PoC) circuit of SerDes-based interfacing. The LQW21FT_0H series is compliant to AEC-Q200 and delivers a combination of both broadband impedance and high-current performance. Thanks to state of the art technologies for both ceramic material and coil structure, Murata can supply these components in a space-saving size format that other manufacturers simply cannot match. They are housed in a compact 0805 inch case size, with 2mm × 1.2mm × 1.6mm dimensions. Murata's LQW21FT_0H series inductors are extremely well suited to PoC use cases. As well as their elevated broadband impedance levels, they exhibit superior saturation properties. Inductance values from 0.47 µH to 2 µH can be specified, with respective current ratings of 1 A and 0.45 A. The heightened operating temperatures that these inductors can support makes them attractive for automotive implementation (reaching up to 125°C). "To accelerate the transition towards safe, autonomous driving, the number of built-in cameras featured in vehicle models continues to increase," said Tomohiro Yao, EMI Division, General Manager of Marketing & Promotion Department, at Murata. "The popularity of PoC for in-vehicle applications is, as a result, steadily rising and enables significant reductions in cabling weight by transmitting imaging data and electrical power over one coaxial cable. Keeping the power and data signals separate from one another is of course vital to PoC implementations, and LQW21FT_0H's broad frequency characteristics help to reduce the number of inductors needed for this purpose."

High-current Inductor for POL Regulators
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Learn more:
we-online.com
  • Product Release
  • 2021-04-22

With improvements in its internal design, the latest model of WE-HCF-SMT high-current inductors from Würth Elektronik sets new standards in its class. WE-HCF in the 2010 design offers significantly better characteristics than previously available inductors in this size: inductance values up to 2 µH and saturation currents up to 25% higher than comparable products in the market. The magnetically shielded flat wire coil with MnZn core impresses with a low resistance of 0.84 mO and low core losses. The recommended 3-pin contacting ensures mechanical stability of the WE-HCF, which is designed for an operating temperature of -40 to +125 °C. Potential applications include POL regulators for FPGA, ASIC and GPU, high-efficiency DC/DC converters, high-current switching power supplies, forward converters, half-bridge and full-bridge converters, as well as battery chargers and solar inverters. WE-HCF 2010 is available immediately from stock with no minimum order quantity. Würth Elektronik will provide free samples to developers upon request.

Linear Accuracy in the Basic Power Supply Class
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Learn more:
rohde-schwarz.com
  • Product Release
  • 2021-04-22

Rohde & Schwarz continues to expand its range of basic power supplies with the R&S NGA100 series. The R&S NGA100 is available in four models, providing a choice of single and dual outputs with up to 35 V/6 A per output, or 100 V/2 A per output. Single output models supply up to 40 W, dual output models up to 80 W power. The dual model outputs can be combined to provide up to 200 V or 12 A. Rohde & Schwarz has implemented a linear design throughout the output circuits of the R&S NGA100 which significantly improves performance compared to the switched-mode circuits frequently found in basic power supplies. The resulting higher accuracy means engineers can be confident of supplying exactly the right power level without any need for an additional multimeter. The standard level of readback resolution, 1 mV/100 µA, is enhanced for currents under 200 mA to a resolution of 1 µA, ideal to test low current levels typical for IoT applications in standby and sleep mode. The R&S NGA100 also has the necessary dynamic range for power and current spikes when switched to active mode.

Reference Boards for Rotary Fridge Compressor Drives
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Learn more:
infineon.com
  • Product Release
  • 2021-04-21

Infineon Technologies introduces two reference boards designed for rotary refrigerator compressors supporting Infineon's motto "From product thinking to system understanding." Both boards are turnkey solutions for low power compressors that can be easily copied by customers to build final mass-production application boards. Since the design of the reference boards is system tested developers can drastically reduce their own system development time. The REF_Fridge_D11T_MOS is a ready-to-use three-phase inverter including the iMOTION Smart Driver IMD111T-6F040 and the 600 V CoolMOS PFD7 superjunction MOSFET IPN60R1K0PFD7S. The board provides an easy-to-use power stage based on the iMOTION smart driver that combines ready-to-use FOC motor control algorithms with 600 V phase gate driver in LQFP-40 package. It also includes the discrete CoolMOS superjunction MOSFET with lowest Q rr, ESD protection and a compact SOT-223 surface mounted device (SMD) package. The board can be easily interfaced through iMOTION Link and enables best light-load efficiency as well as a compact design. The reference design REF_Fridge_C101T_IM231 is ideal for customers aiming for a higher level of integration and a reduced footprint. The board combines a digital motor control IC (iMOTION) IMC101T-T038 with a three-phase CIPOS Micro intelligent power module based on an 6 A, 600 V IGBT. This combination provides a fully-featured compact inverter solution for low power motor drive applications. Furthermore, it enables BOM count and PCB size reduction and improves reliability.

Joining for Electronics Market Growth
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Learn more:
indium.com
  • Industry News
  • 2021-04-20

Indium Corporation announced today that Solder Chemistry is now part of the Indium Corporation family. The joining of these two companies further expands Indium Corporation's reach in the European electronics market and creates an extended platform for Solder Chemistry's distinctive product offerings and technology. Each company will continue to offer products and solutions via its established sales and service networks. "Solder Chemistry and Indium Corporation operate with the same customer goals and benefits in mind," said Brian Craig, Managing Director of Indium Corporation's European Operations. "Both companies share a commitment to keeping our factories running efficiently through the supply of advanced materials, superior technical support, and excellent customer service." "Solder Chemistry and Indium Corporation are both committed to working side-by-side to secure our future success," said Robert Sudnik, Managing Director, Solder Chemistry. "I am eager to work directly alongside Indium Corporation in bringing this new relationship to life and taking advantage of the resources this brings to our customers and the broader electronics industry." Indium Corporation has been active in the European market for over 30 years, including facilities in Milton Keynes, UK. Indium Corporation was among one of the first soldering materials suppliers to earn the IATF-16949:2016 management system certificates at five of its manufacturing facilities that produce products for automotive applications. 

Agreement for Software Development Services
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Learn more:
avnet.com
  • Industry News
  • 2021-04-20

Northforge Innovations announced that it has signed an agreement with Avnet and EBV Elektronik, an Avnet Company, to promote Northforge to Broadcom customers in North America and EMEA. Both distributors will help Northforge expand its North America and EMEA base of Broadcom customers that may require software development services for Broadcom's StrataDNX, StrataXGS, BroadPTP, BroadSync, and Broadcom PLP products. Northforge is the only Broadcom Authorized Development Collaborator (ADC) for the StrataDNX line of switch system-on-a-chip (SoC) devices. "Given our close collaboration with Broadcom and direct training from their engineering experts, our expertise and service level commitment are unparalleled. Our rapid response to issues and help with reducing design cycles plays a key role in the software development of our customers' new products," said Brenda Pastorek, President and Chief Operating Officer of Northforge Innovations. "With this agreement, we can reach more Broadcom customers who require our experience and the expertise that we have developed over the years of giving customers the high level of attention that they deserve." "By partnering with Northforge, Avnet expands our service offering to provide top-level software expertise to our Broadcom customers," said Karen Worley, Director of Supplier Business Development at Avnet. "We're proud to partner with Northforge to deliver increased value to our customers' by supporting their Broadcom software development needs."

Strong Digital Partnership
  • Industry News
  • 2021-04-20

Mitsubishi Electric Corporation and long-term e-F@ctory solution partner Eplan are strengthening their digital solution's collaboration further as Mitsubishi Electric joins Eplan's partner network; an initiative to further facilitate the structured implementation of digital manufacturing. The Eplan Partner Network (EPN) is a framework for participants to jointly develop and market interfaces between Eplan's advanced planning software and, amongst others, field level devices and parts such as PLCs and their related simulators. The EPN partnership is based on common, binding goals, for enhancing and supporting such interfaces. This commitment both increases customer benefits and enhances quality. The integrated automation solution provided by Mitsubishi Electric and Eplan connects Electric P8 to Mitsubishi Electric's MELSOFT iQ Works, an integrated engineering software for programming and managing factory automation devices. Based on the open data format AutomationML, data such as symbolic addresses, I/O lists and process variables can be exchanged bi-directionally between both software tools. This optimizes the implementation of engineering and automation processes and paves the way towards Industry 4.0. The dataset created in Eplan forms the basis for the PLC hardware (rack) assembly and software programming in MELSOFT iQ Works. Users can exchange, later edit, and synchronize project data in any direction at all stages of the project. The data is shared throughout the whole product development process as a single source of truth to ensure its consistency. In addition, the Eplan Data Portal provides additional and necessary component data. Taken together, the integration accelerates component configuration and design planning significantly.

Power Entry Module with Circuit Breaker
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Learn more:
schurter.com
  • Product Release
  • 2021-04-19

SCHURTER's DG11 series power entry module has received CCC approval in addition to ENEC and cURus approvals, paving its entry into the China market. The compact unit, which integrates a 2-pole circuit breaker, is rated up to 10 A at 250 V. It is a power entry module with optional IP67 rated versions. The IP67 version of the DG11 is achieved with a flange gasket secured to the front panel with gasketed screws. The cover over the circuit breaker is factory mounted. The IP40 versions feature snap-in mounting for 1 to 3 mm panels; Screw mount variations with top or side flanges are screwed to the front or rear panel. The DG11 incorporates SCHURTER's TA35 circuit breaker for equipment, available with current ratings from 0.5 A to 15 A. It functions as a 2-pole switch only, or with 1- or 2-pole overcurrent protection. The rocker switch is recessed to prevent inadvertent actuation. It is available illuminated or non-illuminated in a variety of colors and markings. Power entry modules with resettable circuit protection provide an alternative to those that accept fuses with power dissipation limitations. The higher current ratings are also well suited for industrial appliances, especially motor drive appliances for protection against high inrush currents and high transient loads. The sealed version is ideal for use in appliances exposed to water or dust, such as medical and laboratory ultrasonic cleaners, overhead stirrers and shaking water baths.

Fuse Switch Disconnector for a Networked Future
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Learn more:
mersen.com
  • Product Release
  • 2021-04-19

Mersen presents a vertical NH fuse switch disconnector as an addition to the Multivert series. The Multivert i-Xtensio offers even more user convenience and adaptability while retaining all functions of existing fuse switch disconnectors from Mersen. It is designed for an increased installation depth of 150mm, features a user-friendly mounting solution for current transformers on the back and is available in two sizes – size 2, 400A and size 3, 630A. The product is suitable for power distribution in cable distribution cabinets, transformer substations and feeder pillars in commercial and industrial systems. The Multivert i-Xtensio was designed to meet Mersen's exceptionally high safety standards: Current transformer covers on the sides achieve IP20 protection against electric shock to ensure maximum safety during installation and servicing. Cables can be connected via bolts, insert nuts or V-terminals. Safe switching under load in accordance with IEC 60947-3 is ensured. With the Multivert i-Xtensio, Mersen now has 2 available designs on the market of NH Fuse Switch Disconnectors: space-saving standard compact design and i-Xtensio design, which is compatible with all installations systems and enables the easy integration of current transformers. The NH fuse switch disconnector is ideal for future IoT solutions, since it is fully compatible to Smart Modbus monitoring modules developed by Mersen, one of the world's leading manufacturers of innovative technical solutions.

DC-DC Converter for Compact IT Equipment
  • Product Release
  • 2021-04-19

ABB's MicroDLynx IITM DC-DC converters help meet the power needs of demanding, data-hungry applications, providing highly accurate voltage regulation in a compact, 232-mm2 footprint – with a power density of 167 A/in2. "When you look at the sheer computing power required in today's data-intensive applications – from cloud computing, artificial intelligence (AI) and 5G, to the Industrial Internet of Things (IIoT) and high-speed networking – every square millimeter of board space that can be utilized for processing power is precious," said Vesa Jokitulppo, senior product manager at ABB Power Conversion. The power modules provide the precision power required for equipment including high-speed switches and routers, AI processors, application-specific integrated circuits (ASICs), high-current field programmable gate array (FPGA) processors, and ARM-based processors – and it does so in a small footprint that frees up valuable space for additional computing capacity and functionality. In addition to the MicroDLynx II DC-DC converters, ABB has announced a new version of its proven Digital Power Insight software tool. The Digital Power Insight software integrates with ABB's digital products – including AC-DC and DC-DC power supplies, digital bus converters, and point-of-load/voltage regulator modules – enabling communication between the power supplies and customer end-use equipment via a PMBus interface. This allows customers to easily select the right product for their application need and to test different options, digitally.

Virtual 'Capacitors in Power Electronics' Workshop
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Learn more:
psma.com
  • Event News
  • 2021-04-16

The Power Sources Manufacturers Association (PSMA) and the IEEE Power Electronics Society (IEEE PELS) are jointly sponsoring a 2 day virtual workshop titled, "Design Techniques for the 21st Century – Behind the Scenes, Make Sure You Choose & Use the Correct Capacitor." The workshop will be conducted virtually June 29 & 30. The 2021 Capacitor Workshop is the fourth in the series of workshops scheduled in conjunction with APEC and is being recognized as the leading event for discussing the emerging technologies and applications for capacitors required for next generation power electronics and control systems. Each year the workshop has generated a growing interest and we are using the valuable feedback from past attendees to guide us in planning this year's sessions. Since two-thirds of the passive components used in next generation power and control products are capacitors, we continue our efforts to educate and inform the industry about the latest news and developments of the Capacitor Industry. The 2021 Capacitor Workshop will highlight the evolving capacitor technologies and focus on the characteristics and considerations in the use of capacitors in rapidly evolving market applications.

Wind Industry & Green Hydrogen Forum
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Learn more:
husumwind.com
  • Event News
  • 2021-04-16

The special topic of this year's HUSUM Wind from 14-17 September 2021 will be wind hydrogen, the currently most important trend topic in the wind economy and industry. A dynamically growing hydrogen economy is developing in Europe and the UK; wind energy, and especially offshore wind, is the central driver for this. The offshore sector as well as industry and politics in Germany and across Europe have recognised the potential of the production of climate-friendly hydrogen and green fuels. Matthias Zelinger, Managing Director of VDMA Power Systems and Head of the Competence Center Climate and Energy at VDMA, comments: "Climate-neutral industry needs wind energy. While today it is highly interesting for forerunners to conclude direct contracts for the supply of climate-neutral electricity, in perspective it must be a location factor to provide it in sufficient quantities." For this reason, a separate exhibition area of about 1,000 spare meters in Hall 1 is dedicated to the topic of offshore and green hydrogen. Here, domestic and foreign exhibitors from European core markets will present innovative technologies and products for the booming market. Marketing of the OFFSHORE WIND & GREEN HYDROGEN special area started in March, and 400 sqm have already been booked.

Inverter Platform for Batteries Powered Vehicles
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Learn more:
semikron.com
  • Industry News
  • 2021-04-15

SEMIKRON and Silicon Mobility, a solution provider of digital control for electrified powertrain, announced the availability of a 24V to 96V inverter platform for automotive battery powered vehicles and industrial off-road vehicles. The Inverter platform delivers from 10KW to 50KW and combines the SEMIKRON SKAI 3 LV inverter and Silicon Mobility OLEA inverter and electric motor control solution. SEMIKRON provides SKAI 3 LV, the power and assembly with an advanced integrated MOSFET module with connected DC-link, gate-driver, protection functions, and sensors. It comes with a complete performance power solution for 3-phase motor-drive and a ready-made power section which reduces time to market. All of this is proposed within a custom-made cover to offer an ultra-compact MOSFET inverter. The 3rd generation of the SKAI LV industrial MOSFET inverters constitutes the 7th generation of inverter technology manufactured by SEMIKRON, with more than 1.5 Million MOSFET inverters in the field. The 3rd generation is a platform concept that offers standard design versions or can be customized to meet user's needs. The converter connects easily to a custom control board for quick and easy designing, while leaving the control to the customer. "With Silicon Mobility, a technology leader in ultra-fast control schemes, a perfect match is formed for high quality, high-performance solutions for low-voltage vehicle applications," declared Karl-Heinz Gaubatz, CEO of SEMIKRON. "With this platform, we give low-voltage vehicle manufacturers access to technologies and solutions far above todays state of the art implementations, providing them the extra edge for their designs."

Digital Isolator Uses Thick-Oxide Galvanic Isolation Technology
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Learn more:
newsroom.st.com
  • Product Release
  • 2021-04-14

STMicroelectronics has begun volume production of the STISO621 dual-channel digital isolator, launching a series of high-performance ICs for industrial applications and general optocoupler replacement. The STISO621 transfers data between two isolated domains at up to 100Mbit/s, with pulse distortion below 3ns, leveraging ST's 6kV thick-oxide galvanic-isolation technology. With two independent unidirectional channels, the device performs as a UART interface handling data in both directions. Schmitt-trigger inputs to each channel ensure high noise immunity. The supply voltages to the two mutually galvanically isolated sides of the STISO621 are independent of each other. Each has a wide voltage range, allowing level translation between 3.3V and 5.5V circuitry. Typical common-mode transient immunity (CMTI) of 65kV/µs protects the low-voltage side against high switching transients in harsh environments. The STISO621 is suited to a wide range of industrial and consumer applications in power supplies, motor drives, meters, inverters, battery monitors, appliances, fieldbus isolators, size-critical multichannel isolation adapters, and general isolation throughout industrial-automation systems. The design is tested in accordance with VDE0884-10 and UL 1577, the specifications typically applied to isolation devices for high-voltage applications.

DC-DC Step-down Converters in a 1/16th Brick Footprint
  • Product Release
  • 2021-04-14

TDK Corporation announces the introduction of the 750W rated TDK-Lambda i7A series of non-isolated buck DC-DC converters, packaged in the industry-standard 1/16th brick footprint. The output voltage of these 24V nominal input step-down converters can be adjusted from 3.3V to 18V with a maximum current of 45A.

Power Supply with Medical Certification
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Learn more:
mascot.no
  • Product Release
  • 2021-04-14

Mascot has further extended its Blueline portfolio of power supplies with the addition of the switch mode 3920 external PSU. The 3920 is medically certified in accordance with EN 60601-1 edition 3.1 (safety) and EN 60601-1-2 edition 4 (EMC) and has been designed to meet global power conversion requirements. Working with universal AC line voltages from 90V to 264V, the high-efficiency 3920 offers continuous output power up to 180W. Possible applications include medical computer systems, healthcare, laboratory and medical devices such as incubators, blood analysers, DNA equipment, ultrasound systems, diagnostics units and medication dispensers, and other applications such as communications systems and security devices. The 3920 range combines high quality and performance, with competitive pricing and compliance with the latest eco-design specifications (CoC Tier 2, DoE level VI, CEC, MEPS) adopted in the EU and North America. CE-marked and bearing global UL Certification, the range delivers a complete turnkey solution to product designers. It comes in four standard versions delivering fixed outputs of 12, 24, 36 and 48V. Other versions and customised units with special plugs and cords can be supplied on request. All units are fitted with short-circuit protection as standard.

Speeding Adoption of Wireless Charging for Smartphones
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Learn more:
renesas.com
  • Industry News
  • 2021-04-14

Renesas Electronics has expanded its ongoing work with Qualcomm Technologies to include 30W wireless charging capabilities for mid-range smartphones powered by the latest Qualcomm Snapdragon 780G 5G Mobile Platform. This is the second high-power wireless charging smartphone reference design collaboration for the two companies. The first solution, designed for flagship devices, is sampling commercially now. This latest phase is a significant step that extends the global leaders' collaboration to bring highly integrated, advanced wireless power features as a standard feature in 5G smartphones from flagship to mainstream devices. Qualcomm Technologies' 5G mobile reference designs provide turnkey solutions that are intended to facilitate smartphone OEMs to quickly and cost effectively implement fast wireless charging on flagship and mid-range smartphones, with Multi-Time Programmability (MTP) and OTA updates to simplify software development and Qi certification process. The Renesas solution offers the highest integration with over 85% end-to-end system efficiency to help expand the reach of wireless power technology to an even broader set of customers and simplify the process of adding wireless charging. "We are excited to grow our collaboration with Qualcomm Technologies as part of our journey to developing leading-edge wireless charging solutions and opening up reliable wireless power access for mass adoption," said Amit Bavisi, Vice President and general manager of Renesas Wireless Power Group, Mobility Infrastructure and IoT Power Business Division.

Power Device Testing Solution Selected to Accelerate Development of Semiconductors
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Learn more:
keysight.com
  • Industry News
  • 2021-04-13

Keysight Technologies announced that Semipower Electronic Technology has selected Keysight's power device testing solutions, to accelerate and promote the development of next-generation semiconductors.  Semipower's power device testing application center, a comprehensive testing center for power device testing capabilities, has been recognized by the China National Accreditation Service for Conformity Assessment (CNAS) and International Laboratory Accreditation Cooperation (ILAC). Offering third-party testing qualification, the center is critical to promoting the development of the third-generation semiconductor industry. Leveraging Keysight's power device testing solution, the center offers a test platform for third-generation semiconductor devices to ensure performance and reliably speed market introduction. "We are pleased to work with Semipower to accelerate and promote the development of next-generation semiconductors," said Thomas Goetzl, vice president and general manager of Keysight's Automotive and Energy solutions. "Keysight is committed to innovation in the field of power semiconductor test and for we work closely with key partners to provide powerful test tools in conjunction with advances of industry critical technology waves." Semipower chose Keysight's PD1500A dynamic power device analyzer / double pulse tester to deliver repeatable, reliable measurements of wide bandgap semiconductors. The off-the-shelf measurement solution enables faster time-to-market by providing quick and reliable results, while ensuring a safe test environment.

Uniting Activities at Düsseldorf Harbour
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Learn more:
asahi-kasei.eu
  • Industry News
  • 2021-04-13

On 16th November 2020 Asahi Kasei Europe started office operation at its new location at Düsseldorf Harbour, Germany. In March 2021, the Asahi Kasei Europe R&D Center relocated from Dormagen to the new location. By uniting European sales, marketing and R&D activities, the Japanese technology company further enhances its business approach towards the European automotive industry. Asahi Kasei is starting a new chapter of its business expansion on the European market: On 16th November 2020, Asahi Kasei Europe GmbH and its sister company Asahi Kasei Microdevices Europe GmbH started office operation at the new "C-View Offices" at Düsseldorf Harbour, Germany. After the cornerstone laying on 7th October 2019, the construction work went smoothly and was finished on schedule. The Asahi Kasei Europe R&D Center – originally located at CHEMPARK Dormagen near Düsseldorf – relocated to the new location in March 2021. Hideki Tsutsumi, Managing Director at Asahi Kasei Europe: "This relocation marks the next important milestone of Asahi Kasei's expansion on the European market. Europe is at the forefront of an evolution in the automotive industry that is said to happen once in a century. In addition, it is the forerunner in environmental topics. Uniting sales, marketing, R&D and technical service activities at one single location will enable us to quickly address the changing demands by customers and to enhance joint projects with local partners.

Automated Microchip Testing
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Learn more:
esmo-group.com
  • Product Release
  • 2021-04-12

esmo group has rolled out upgrades and additional features for the talos 2021 system. First launched in 2019, the talos engineering handler is a reliable and easy-to-use handling system for semiconductor test applications, and is esmo's solution to the industry's need to cost-effectively test increasingly compact and complex devices within a shorter period of time. At the core of the talos engineer handler is its state-of-the-art active thermal control system (ATC), which allows manufacturers to carry out multiple test temperature cycles and achieve the highest temperature accuracy. "Our talos engineering handler provides semiconductor companies with the most stringent quality control and assurance, ensuring products are tested to specification," shared Josef Weinberger, Business Unit Manager (semicon). "A highly flexible and cost-effective test system, the talos platform helps manufacturers achieve faster time-to-yield with higher overall equipment efficiency. Furthermore, its remote control and monitoring feature also allows customers to remotely manage and conduct device handling." The talos system supports the testing of devices with any site pitch dimension, which allows semiconductor companies to use already existing production load boards and sockets seamlessly. Its tray or tube loading and unloading feature also makes it possible for manufacturers to run the talos system in a mixed media operation. As such, loading trays, tubes, and tapes can be combined with their unloading counterparts, and devices can even be sorted from one media to another, such as from tube to tray.

Solutions for the Thermal Management in Power Electronics
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Learn more:
coolmag.net
  • Product Release
  • 2021-04-11

CoolMag is a thermally conductive composite PDMS based elastomeric compound of encapsulant twocomponent system, designed for Power Electronics in Automotive, especially in Electrified Vehicles with multiple functionalities:
• Heat Transfer, reduction of hot spots and minimising average temperature of systems.
• Electric Isolation

CoolMag is designed to provide thermal conductivity, electrical safety, hazard protection, mechanical and fire protection for electronic encapsulating applications.
• Flame and fire protection (Retardant and Extinction)
• Mechanical protection

CWIEME Berlin 2021 Cancelled
  • Event News
  • 2021-04-09

CWIEME Berlin, currently scheduled for 22-24 June of this year, will have to be cancelled. Large scale events in Germany are still prohibited by the federal and local governments and these restrictions are unlikely to be removed in time for the event to take place, with the result that cancellation is now unavoidable. We considered moving the event to later in the year. However, this was not considered realistic for a number of reasons, particularly given recent reports of COVID-19 cases rising in several countries with the result that travel restrictions are likely to remain in place for some months to come.  Due to our next CWIEME Berlin event already planned for May 2022, we have decided, following consultation with you – our community – that a full year cancellation is the best decision for all concerned. Our number one goal is to ensure a successful event for our global community, with the expected volume and quality of exhibitors and visitors to promote business and enable innovations across the supply chain. We invite you and all those involved in the coil winding, transformer, electric motor, generator and e-mobility supply chain throughout Europe and the world to join us in Berlin, 10-12 May 2022.

Upgrade for Precision Power Analyzer
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Learn more:
tmi.yokogawa.com
  • Product Release
  • 2021-04-08

Yokogawa has launched a Current Sensor Element and upgraded the firmware for its WT5000 Precision Power Analyzer. The enhancements are designed to help companies improve performance when developing or evaluating electronic devices such as Electric Vehicle (EV) related equipment or systems for solar and wind power installations. The Current Sensor Element runs off the internal DC power supply of the WT5000, making external power supplies unnecessary. This makes set up for measurements easier as the only things required are the current sensor and a connecting cable. Three sensor connection cable lengths are available - 3 m, 5 m and 10 m. This helps take account of varying test bench layouts, where the power analyzer may not be located right next to the device under test. The three different cable lengths allow users to select the one most suitable for their set up while keeping the leads as short as possible. "The WT5000, which is the flagship model of our power analyzer WT series, is now more convenient and capable for companies measuring power consumption and efficiency as part of their development cycle," explains Terry Marrinan, VP Global Marketing. "With the upgraded firmware, engineers can capture waveforms in more detail, allowing them to optimize their designs."

POL Switching Regulators in Open Frame Design
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Learn more:
tracopower.com
  • Product Release
  • 2021-04-08

The TSR 1.5E is a 1.5 Ampere step-down switching regulator series and a drop-in replacement for inefficient LM78xx linear regulators. This series comes in a compact SIP-3 open frame package and complements our existing POL portfolio with a series focusing strongly on a cost efficient design while maintaining our quality standards. There are 3 output voltages available: 3.3, 5.0 and 12VDC. The effective design allows full load operation up to +85°C ambient temperature without the need of any heat sink or forced cooling. The TSR 1.5E switching regulators provide other significant features over linear regulators, i.e. better output accuracy, lower standby current and no requirement of external capacitors. The series offers a broad application range in many environments and is especially suited for high volume projects where the series will help to reduce production cost by delivering not only a highly cost efficient but also reliable solution.

MOSFETs for Static Switching Applications
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Learn more:
infineon.com
  • Product Release
  • 2021-04-08

Infineon is enhancing the 600 V CoolMOS S7 family with two optimized devices for static switching applications: the industrial-grade CoolMOS S7 10 m? and the automotive-grade CoolMOS S7A. The CoolMOS S7 10 m? has a unique low on-resistance (R DS(on)) for 600 V superjunction MOSFETs, making it ideal for applications where minimal conduction losses are critical, such as off-the-shelf solid-state relays (SSR). In contrast, the automotive-grade CoolMOS S7A addresses system performance requirements set by solid-state circuit breakers (SSCB) and diode paralleling/replacement for high power/performance designs in automotive applications, such as the High Voltage (HV) eFUSE, HV eDisconnect battery disconnect switch, as well as on-board chargers. The product family has been developed by optimizing the renowned CoolMOS 7 technology platform. To achieve this, the device has been enhanced for static switching and high current applications. As a result, the new devices can offer the best price-performance ratio at the highest quality standards, placing even greater emphasis on conduction performance, energy efficiency, power density, and improved thermal resistance. The CoolMOS S7 10 m? and CoolMOS S7A chips come with the lowest R DS(on) in the market and best-in-class R DS(on) x A x cost. Additionally, they have been integrated into an innovative top-side cooled (TSC) QDPAK SMD package, which offers excellent thermal behavior, making it a smaller alternative to THD devices such as TO-247. Moreover, with moving from THD to a surface-mounted device with QDPAK, a 94 percent reduction of height can be achieved, enabling higher power density solutions.

Solutions for the Production of Compound Semiconductor Devices
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Learn more:
oxinst.com
  • Industry News
  • 2021-04-07

Oxford Instruments Plasma Technology and LayTec announce an exclusive collaboration agreement to enable the next generation requirements of advanced semiconductor devices in the high-volume manufacturing (HVM) environment. The partnership aims to develop and integrate LayTec's accuracy and control with Oxford Instruments' renowned wafer processing expertise. Together, they will combine plasma process solutions with proven in-situ metrology to achieve next generation device performance and enable a repeatable HVM process to shorten customers' yield ramp. LayTec will develop the in-situ metrology while Oxford Instruments will integrate LayTec's control with its advanced wafer processing solutions to deliver an enhanced solution to the customer. Driven by market demands for efficient power conversion, the IoT and datacomms compound semiconductor devices based on materials such as GaAs/InP, SiC or GaN, are becoming increasingly used due to their superior performance. However, challenges remain to move the technology from small prototypes to wafer scale, HVM. While device dimensions are relatively large, the often-complex layer structure means that acute accuracy of processing within these layers is required to realise the required process stability and yield to drive down the cost per wafer and accelerate adoption into the target application.

Wolfram Harnack Appointed President
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rohm.com
  • People
  • 2021-04-07

As of April 1st, 2021, ROHM Semiconductor Europe appoints Wolfram Harnack as the company's new President. The former President, Toshimitsu Suzuki, will lead the European Sales Division as General Manager from April 1st from the company's headquarters in Japan. Wolfram Harnack joined ROHM Semiconductor Europe GmbH as Managing Director in October 2020. Toshimitsu Suzuki, the new General Manager of the European Sales Division, justifies the choice of Wolfram Harnack with his long and rich experience and his comprehensive market knowledge: "With Wolfram Harnack, a strong leader will become the new President of ROHM's European Headquarters. He can build on a solid foundation when it comes to strategy, business development as well as sales and marketing against an international background."
"I am honored to lead a company for which I have already worked with passion and to whose further successes I will now contribute significantly," said Wolfram Harnack on the occasion of his appointment as new President. "ROHM Semiconductor offers a wide range of technologies and is a quality and innovation leader especially in the field of Silicon Carbide and Analog Power devices. The competent team helps customers to achieve their development goals by excellent application support and by providing the necessary insights. In this sense, my key aim is to further extend our customer service and accelerate growth in the automotive and industrial segments, especially in the power and analog area."

James F. Schmidt Appointed CFO
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vicorpower.com
  • People
  • 2021-04-06

Vicor Corporation announced the appointment of James F. Schmidt as Chief Financial Officer, effective June 1, 2021. Mr. Schmidt will join the Vicor Board of Directors and serve as the company's Treasurer and Secretary. He joins Vicor from Analog Devices after a 35-year career which started in a wafer fab and included leadership positions in Finance, Engineering, Operations and Sales. Mr. Schmidt has a BS in Chemical Engineering from the University of Cincinnati and an MBA from the University of North Carolina at Greensboro. Vicor CEO Patrizio Vinciarelli commented, "We are pleased to have Jim join our team ahead of further expansions in our operational footprint. Jim's eclectic background and experience make him uniquely qualified to help us achieve operational excellence, as well as gross margin and profitability levels that more fully reflect the value of our enabling power system technology".

Getting Ready for PCIM Digital 2021
  • Industry News
  • 2021-04-05

Last year's PCIM Digital Days 2020 received fairly good feedback, and taking into account the current restrictions due to COVID-19 the online format of the event looks like a good decision from the organizers. This type of event provides an opportunity for a company representatives to exchange knowledge, to tell about new launches and the current situation in the business of power semiconductor devices. Last year, the two-day exhibition brought together more than 3,000 suppliers and consumers. The participants of the event were able to expand their professional knowledge, establish new contacts and hold negotiations. 74 companies participated as exhibitors at PCIM Digital Days. During PCIM Digital Days 2020, representatives of Proton-Electrotex presented its power unit BITR-150-0 52-1-V-U2, drivers for thyristors and IGBTs and a number of other new products. In 2021, participants of PCIM Digital will see the announcement of a completely new device by Proton-Electrotex, as well as and the company's existing product line. PCIM visitors will be able to communicate, hold meetings and discuss current issues with representatives of the company's engineering staff, customer technical support, sales and marketing departments. Besides, the organizers have prepared 76 conferences and 15 seminars on the most demanded and popular topics in the field of power electronics.

Buffer Modules for 12V, 15V and 24V Power Supplies
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Learn more:
us.lambda.tdk.com
  • Product Release
  • 2021-04-01

TDK Corporation announces the introduction of the TDK-Lambda brand ZBM20 12V, 15V and 24V 20A rated open-frame buffer modules. The ZBM20 series provides an extended 380ms hold-up time to power supplies preventing data loss during brief power interruptions or allowing equipment to safely shutdown. Applications include industrial automation, robotics, test, communication and semiconductor fabrication equipment. Energy is stored in electrolytic capacitors, replacing the need for batteries and their associated maintenance and servicing. A remote on/off function can be activated to avoid an unsafe discharge of stored energy. The charge and discharge status can be monitored locally or remotely via a DC OK relay, an LED indicator and photo-coupled signals. If a longer hold-up time is desired, modules can be connected in parallel. The 24V model has a switch that can be used to select either fixed or variable voltage buffer levels. In fixed mode, it will provide power when the input voltage drops to 22.4V, in variable mode when the input decreases by 1V. Measuring 175 x 85 x 57mm (L x W x H), the units will operate without derating in ambient temperatures of -25°C to +70°C. The five-year warranty ZBM20 has protection against both input overvoltage and overcurrent conditions, has inrush current reduction and internal fusing. Safety certification includes IEC/UL/CSA/EN 62368-1 with CE marking to the Low Voltage, EMC and RoHS Directives.


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48V / 12V Bi-Directional DC-DC ConverterDelta recently unveiled its High Power Density Bi-...9295Product Release48V / 12V Bi-Directional DC-DC ConverterDelta recently unveiled its High Power Density Bi-Directional DC-DC Converter U50SU4P162 for data centers, super computers, and other high-tech systems. Emphasizing the requirement of high-efficiency, high-density data centers, the U50SU4P162 provides 48V / 12V bi-directional conversion, and features high power density of up to 3,000 W/inch3 with a small footprint (23*17.4*10 mm) and up to 98% conversion efficiency. The U50SU4P162 DC-DC Converter provides 48V / 12V bi-directional conversion, 800 W output power, and 1 MHz switching frequency. The ultra-high power density (up to 3,000 W/inch3) allows the U50SU4P162 to achieve 98% power conversion efficiency in a compact size of 23*17.4*10 mm. The ability of handling large load capacitance (up to 10,000 µF) and double-sided heat sink with low thermal resistance also help to ensure high-performance computing for high-density data centers. Another highlighted feature of the U50SU4P162 is the PMBus (power management bus) protocol. It allows the converter to transmit power data to system controllers for efficient monitoring and management. Delta is also outpacing others by offering customization services for power configuration and optional heat sinks to help customers build advanced systems. With advanced functions, high power density, small footprint, and customizability, the U50SU4P162 ensures the high efficiency of data centers, super computers, and other high-tech systems.10.06.2021 20:30:00Junnews_2021-06-15_25.jpg\images\news_2021-06-15_25.jpghttps://www.delta-emea.com/news/pressDetail_preview.aspx?secID=3&pID=1&tid=0&typeID=2&itemID=14273&hl=en-GBdelta-emea.com
MOSFET Qualified for Commercial and Military Satellites and Space Power SolutionsMicrochip Technology announced the qualification o...9292Product ReleaseMOSFET Qualified for Commercial and Military Satellites and Space Power SolutionsMicrochip Technology announced the qualification of its M6 MRH25N12U3 radiation-hardened 250V, 0.21 Ohm Rds(on), metal–oxide–semiconductor field-effect transistor (MOSFET) for commercial aerospace and defense space applications. The MOSFET withstands the harsh environments of space, extends reliability of power circuitry and meets all requirements of MIL-PRF19500/746 with enhanced performance. Microchip completed testing for Defense Logistics Agency (DLA) review and qualification, for the device's sourcing in the U.S. military supply chain (expected JANSR2N7593U3 certification in June 2021). The M6 MRH25N12U3 MOSFET is designed for future satellite system designs as well as serving as an alternate source in existing systems. It can withstand total ionizing dose (TID) up to 100 krad and 300 krad and single event effects (SEE) with linear energy transfer (LET) up to 87 MeV/mg/cm2. It provides 100-percent wafer lot radiation hardness assurance in validation tests. "Microchip's entry into the radiation-hardened MOSFET market reflects our long-term commitment to support our customer base and provide aerospace and defense OEMs and integrators with high-performance solutions and continuous supply," said Leon Gross, vice president of Microchip's Discrete Product Group business unit. "In addition to our proven quality and reliability, the M6 MRH25N12U3 provides a value pricing option for developers and offers them full application support."08.06.2021 17:30:00Junnews_2021-06-15_22.jpg\images\news_2021-06-15_22.jpghttps://www.microchip.com/en-us/about/news-releases/products/radiation-hardened-mosfet-qualified-for-commercial-and-military-microchip.com
Packages Improved Robustness and Thermal PerformanceApplications such as e-scooters, e-forklifts and o...9288Product ReleasePackages Improved Robustness and Thermal PerformanceApplications such as e-scooters, e-forklifts and other light electric vehicles (LEVs), as well as power tools and battery management systems, demand high current rating, ruggedness and extended lifetime. Infineon Technologies addresses these requirements by offering more choices to power system designers to meet diverse design needs and achieve maximum performance in the smallest space. With the TO-Leadless (TOLL) package, Infineon now offers two OptiMOS power MOSFET packages in the TOLx family: TOLG (TO-Leaded with Gullwing leads) and TOLT (TO-Leaded Top-side cooling). Together, the TOLx family offers very low R DS(on) and a high-current rating over 300 A to increase system efficiency in high-power density designs. <br>The TOLG package combines the best features of TOLL and D 2PAK 7-pin packages, sharing the same 10 x 11 mm 2 footprint and electrical performances as TOLL with added flexibility comparable to D 2PAK 7-pin. The main advantages of TOLG are particularly apparent in designs with aluminum-insulated metal substrate (Al-IMS) boards. <br>The TOLT package is optimized for superior thermal performance. Constructed with its lead-frame flipped to position exposed metal on the top side, the package contains multiple gullwing leads on each side for high current carrying drain and source connections. With a flipped lead-frame, heat passes from the exposed metal top side, through the insulating material, directly to the heatsink.08.06.2021 13:30:00Junnews_2021-06-15_18.jpg\images\news_2021-06-15_18.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2021/INFPSS202106-076.htmlinfineon.com
Wafer Fab of the Future in DresdenIn Dresden, Bosch is opening one of the world's mo...9275Industry NewsWafer Fab of the Future in DresdenIn Dresden, Bosch is opening one of the world's most modern wafer fabs. Highly automated, fully connected machines and integrated processes, combined with methods of artificial intelligence (AI) will make the Dresden plant a smart factory and a trailblazer in Industry 4.0. In the virtual presence of Federal Chancellor Dr. Angela Merkel, the high-tech facility was officially inaugurated on June 7, 2021. "The new Bosch wafer fab will boost our capacity in microelectronics. Microelectronics is the basis for nearly every promising technology, for applications of artificial intelligence, for quantum computing, and for automated and connected driving – which is also a Bosch specialty," said Federal Chancellor Dr. Angela Merkel. "The new wafer fab is the single largest investment in the company's history. This cannot be stressed too much. Its size and additional production capacity alone are impressive. The very latest methods of data-driven continuous improvement in production make the Dresden plant a smart factory. To put it another way: in this plant, natural and artificial intelligence have joined forces with the internet of things to form a productive symbiosis." Production in Dresden will start as early as July – six months earlier than planned. From that time on, semiconductors made in the new plant will be installed in Bosch power tools. For automotive customers, chip production will start in September, and thus three months earlier than planned. The new factory will be an important part of the semiconductor manufacturing network. With it, Bosch is strengthening Germany's position as a technology and business location. On 72,000 square meters of floor space, 250 people are already working in the wafer fab in Saxony's state capital. The workforce is set to grow to roughly 700 once construction work has been completed.07.06.2021 08:00:00Junnews_2021-06-15_3.jpg\images\news_2021-06-15_3.jpghttps://www.bosch-presse.de/pressportal/de/en/bosch-opens-wafer-fab-of-the-future-in-dresden-230080.htmlbosch.de
International Electron Devices Meeting Announces Call for PapersUnder the theme "Devices for a New Era of Electron...9280Event NewsInternational Electron Devices Meeting Announces Call for PapersUnder the theme "Devices for a New Era of Electronics: From 2D Materials to 3D Architectures," the 67th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers. The 2021 IEDM is being planned as an in-person conference December 11–15, 2021 at the Hilton San Francisco Union Square hotel, with on-demand access after the event for those who are unable to travel due to COVID-19 restrictions. The paper submission deadline is Friday, July 23, 2021. Authors are asked to submit four-page camera-ready papers. Accepted papers will be published as-is in the proceedings. A few late-news papers also will be accepted, covering only the most recent and noteworthy developments. The late-news submission deadline is August 30, 2021. "IEDM is currently being planned as an in-person event in San Francisco in December with on-demand access to content available after the event, although meeting plans are subject to change to stay in compliance with COVID-19 guidelines," said Meng-Fan (Marvin) Chang, IEDM 2021 Publicity Chair and IEEE Fellow, Distinguished Professor of Electrical Engineering at National Tsing Hua University, and Director of Corporate Research at TSMC. "Should an in-person meeting not be feasible, IEDM will go fully virtual. Additional details will be made available later this year." "Our theme this year was chosen to emphasize the many changes sweeping across the electronics industry and the diverse technologies that are enabling them," said Srabanti Chowdhury, IEDM 2021 Publicity Vice Chair and Associate Professor of Electrical Engineering at Stanford University. "IEDM 2021 will continue its long tradition of having a rich technical program full of relevant, state-of-the-art results, and the conference will give attendees the opportunity to interact with colleagues from academia and industry around the world."04.06.2021 14:00:00Junnews_2021-06-15_10.jpg\images\news_2021-06-15_10.jpghttps://www.ieee-iedm.org/call-for-papers-overviewieee-iedm.org
750V SiC MOSFETs Offer Performance and ReliabilityGeneSiC's next-generation 750V G3RSiC MOSFETs will...9281Product Release750V SiC MOSFETs Offer Performance and ReliabilityGeneSiC's next-generation 750V G3RSiC MOSFETs will deliver unprecedented levels of performance, robustness and quality. System benefits include low on-state drops at operating temperatures, faster switching speeds, increased power density, minimal ringing (low EMI) and compact system size. GeneSiC's G3R, offered in optimized low-inductance discrete packages (SMD and through hole), are optimized to operate with lowest power losses under all operating conditions and ultra-fast switching speeds. These devices have substantially better performance levels as compared to contemporary SiC MOSFETs. "High-efficiency energy usage has become a critical deliverable in next-generation power converters and SiC power devices continue to be the key components driving this revolution. After years of development work towards achieving the lowest on-state resistance and robust short circuit and avalanche performance, we are excited to release the industry's best performing 750V SiC MOSFETs. Our G3R enable power electronics designers to meet the challenging efficiency, power density and quality goals in applications like solar inverters, EV on-board chargers and server/telecom power supplies. An assured quality, supported by fast turn-around and automotive-qualified high volume manufacturing further enhances their value proposition. " said Dr. Ranbir Singh, President at GeneSiC Semiconductor.04.06.2021 06:30:00Junnews_2021-06-15_11.png\images\news_2021-06-15_11.pnghttps://www.genesicsemi.com/press-release-G3R-750V-sic-mosfet/genesicsemi.com
Using GaN Transistors to Develop DC/DC ConvertersWith its VALUE DC-DC product line, BrightLoop Conv...9279Industry NewsUsing GaN Transistors to Develop DC/DC ConvertersWith its VALUE DC-DC product line, BrightLoop Converters is aiming to democratize access to performance and offer a range of converters dedicated to off-highway and commercial vehicles. The French player in power electronics is teaming up with Efficient Power Conversion (EPC) to deliver the upcoming VALUE product line. BrightLoop Converters has gained experience from many years of development for motorsport applications and learned to make the most out of GaN technology to deliver highly reliable, extremely light and compact converters. The company released in 2020 a PERFORMANCE DC-DC product line offering great versatility to extreme vehicle applications and motorsports. After demonstrating that GaN technology can significantly improve performance, the French company now wants to prove that using this technology does not necessarily lead to higher costs. With the launch of the new VALUE product line later this year, the strategy is clear: make performance accessible to these markets, which are now also looking for lightweight, space-saving and high-performance converters in the most cost-effective way. Florent Liffran, CEO of BrightLoop Converters commented: "We are proud to bring our expertise along with EPC's top technology to the commercial and off-highway markets. Our focus has always been to push the limits of performance further and with this new VALUE product line, our goal is clearly to bring our know-how to markets which have historically worked with heavy and bulky power electronics, making it possible for them to have a taste of outstanding performance, versatility and power density while remaining in their price range."03.06.2021 13:00:00Junnews_2021-06-15_8.png\images\news_2021-06-15_8.pnghttps://www.brightloop.fr/en/dcdcbrightloop.fr
Chokes for Medical Technology ApplicationsSMP Sintermetalle Prometheus (SMP) offers chokes f...9286Product ReleaseChokes for Medical Technology ApplicationsSMP Sintermetalle Prometheus (SMP) offers chokes for medical technology applications. These inductive components are used in Magnetic Resonance Imaging (MRI) or Computed Tomography (CT), for example. Designed as filter or mains chokes they are not only compact, low-loss and energy efficient but also exceptionally quiet in operation – essential qualities for demanding medical technology applications. In MRI scanners, the components are installed in the "gradient amplifiers", which supply output voltages and currents and control the gradient coils that encode the resonance signals for subsequent image reconstruction. The filter and mains chokes are designed to ensure a clean sinusoidal waveform and low-loss feedback of the unused energy. Special magnetostriction-free materials, which SMP develops and produces according to individual customer specifications, ensure that components run very quietly. The powder composite materials feature low eddy current and magnetic reversal losses. The components are noted for their low loss balances and optimal EMC properties. They are also maintenance-free. The three-dimensional isotropy of the materials enables compact, lightweight structures, because the magnetic circuits are minimized. This also lowers the magnetic field strength, and the quantity of winding material used can be significantly reduced. The materials have a high saturation induction of up to 2 Tesla. The oscillation behaviour of the choke can be adjusted specifically by using certain materials or appropriate, magnetically coupled designs with multiple coils.02.06.2021 11:30:00Junnews_2021-06-15_16.jpg\images\news_2021-06-15_16.jpghttp://www.smp.de/en/homesmp.de
Regulated SIP8 DC/DC ConvertersRECOM has announced the launch of the RS3E family ...9283Product ReleaseRegulated SIP8 DC/DC ConvertersRECOM has announced the launch of the RS3E family of DC/DC converters in an industry-standard SIP8 format and pin-out. The parts are rated at 3W with no derating to 70°C and feature 2:1 input ranges of 4.5-9V, 9-18V, 18-36V and 36-72V. Fully regulated outputs available are 3.3V, 5V, 9V, 12V, 15V and 24V. Isolation is 3kV (one minute) and the parts hold IEC/UL/CSA 62368-1 safety certification up to 5000m altitude while meeting EN 55032/FCC class B and EN 55035 EMI standards. The RS3E family features short circuit protection, high MTBF of 1.8M hours and a control input to place the converters in a low-power shutdown mode. Matthew Dauterive, RECOM DC/DC product manager comments: "We have set the bar high again with a great combination of low cost and high power density from a 3W DC/DC converter in a standard SIP8 package. It will find wide application in demanding environments such as industrial and e-mobility".02.06.2021 08:30:00Junnews_2021-06-15_13.jpg\images\news_2021-06-15_13.jpghttps://recom-power.com/en/rec-n-cost-efficient,-regulated-sip8-dc!sdc-converters-are-fully-featured-160.html?0recom-power.com
PCNS Registration is Now Open3rd PCNS Passive Components Networking Symposium i...9274Event NewsPCNS Registration is Now Open3rd PCNS Passive Components Networking Symposium is now open for on-line registration. The third PCNS is organized as a hybrid event September 7-10, and it is possible to register either as live attendee or virtual attendee. Fee is equal, and early bird registration rate is valid till 16th July 2021. PCNS received 27 paper abstracts from 9 countries EU and USA (vs 19 papers at 2nd PCNS)! The papers' scope submitted by passive manufacturers, universities, material suppliers, space agencies and end users include capacitors, resistors, inductors and passive sensors in areas of aerospace, automotive or industrial. Topics are covering reliability, qualification, new materials & technologies and research. Pre-event includes workshops on reliability, life time and sustainability of passive components – open for free for all main conference symposium attendees. "We are looking forward to meet in September during this challenging year. Hopefully, we can finally meet live to enjoy multilevel exchange of experience and news within a passive industry. … meet old friend and new colleagues. Live streaming video will be available for those with travel restrictions." said Tomas Zednicek; EPCI and PCNS organising committee president.02.06.2021 07:00:00Junnews_2021-06-15_2.png\images\news_2021-06-15_2.pnghttps://passive-components.eu/3rd-pcns-preliminary-program-released/passive-components.eu
Low Pressure Molding Technology for Encapsulation of ElectronicsHenkel's Low Pressure Molding technology for encap...9285Product ReleaseLow Pressure Molding Technology for Encapsulation of ElectronicsHenkel's Low Pressure Molding technology for encapsulating electrical and electronic components in its Technomelt polyamide adhesive molding compounds is increasingly being adopted for medical, electronic components, power and industrial automation, HVAC and lighting applications. The technology offers numerous economic, process control, design and environmental advantages over alternative systems such as potting with reactive resin systems and high-pressure injection molding. Technomelt Low Pressure Molding (LPM) technology was invented some 30 years ago by Henkel (formerly called Macromelt Molding). The technology enables the quick encapsulation of delicate components by using specialized polyamides in combination with standard processing equipment and low-cost molds. Because the material is injected at a lower pressure compared to conventional injection molding processes, and non-abrasive materials are used, risk of damage to the electronics during the encapsulation process is far lower. The technology is particularly adept at encapsulating discrete areas in complicated assembly where wiring is attached to a printed circuit board (PCB), PCBAs and other rigid component. One reason for this is that Technomelt resins, which are all unfilled, are resistant to high stresses and at the same time very flexible.01.06.2021 10:30:00Junnews_2021-06-15_15.png\images\news_2021-06-15_15.pnghttps://www.henkel.com/press-and-media/press-releases-and-kits/2021-06-01-henkels-technomelt-low-pressure-molding-technology-meets-latest-demands-for-encapsulation-of-electronics-and-medical-components-1222444henkel.com
Air-cooled Modular Power SupplyTDK Corporation announces the introduction of the ...9284Product ReleaseAir-cooled Modular Power SupplyTDK Corporation announces the introduction of the TDK-Lambda brand TPF45000-385 non-isolated modular AC-DC power supply. Developed for use in distributed power architectures (DPA) and DC Microgrids, the 98% highly efficient TPF45000 provides a regulated 385Vdc output with a current of up to 117A. Low internal losses enables the use of cooling by fans, avoiding the complexity of water cooling. This industrial grade product is suitable for use in semiconductor test and burn in systems, LED based horticultural lighting and DC Microgrids. Comprising of up to ten 4.5kW modules, the series can deliver up to 45kW of output power in a less than 3U high package, and operates from a wide range Delta or Wye 360 - 528Vac three phase input. The unit can operate at full load in ambient temperatures from -10 to 50°C (-20°C start-up). The enclosure measures 450mm wide (excluding side rack mount flanges) 113mm high and has a depth of 533mm. The weight of the product is 30kg. The TPF45000 is fully featured with DC Good, dropped phase, over temperature and fault alarm signals, remote on/off and a 13 to 15V 0.5A auxiliary output. PMBus and USB communications interfaces allows remote monitoring of the input voltage, output voltage, output current, internal temperature, status signals and fan. In addition, the remote on/off can be programmed by the PMBus. The power supply has 2kVac primary to ground isolation, is certified to IEC/EN/UL/CSA 62368-1 and carries the CE mark for the Low Voltage, EMC and RoHS Directives.01.06.2021 09:30:00Junnews_2021-06-15_14.jpg\images\news_2021-06-15_14.jpghttps://www.us.lambda.tdk.com/news/press-releases/2021000079.htmllambda.tdk.com
Wireless Power Supply Technology Offers a Route to Wireless Charging in Higher Power ApplicationsEggtronic has announced E2WATT, an AC power techno...9282Product ReleaseWireless Power Supply Technology Offers a Route to Wireless Charging in Higher Power ApplicationsEggtronic has announced E2WATT, an AC power technology that will boost the power, efficiency, charging distance and data transmission capabilities of wireless charging applications. Offering efficiency comparable with the best conventional wired AC adapters, E2WATT provides the foundation for taking future mobile charging designs into new segments including laptops, AV equipment, and even home appliances and electric vehicles. Traditional Qi wireless power is limited by distance (usually 5 mm), and maximum power (usually up to 30 W). E2WATT technology reaches up eight times further (to 40 mm) and delivers up to 300 W - a real breakthrough for inductive standards. E2WATT wireless technology is powered directly from AC mains, without the need for an external power supply. The single-stage hybrid design minimizes losses compared with conventional double-stage wireless technologies to deliver significantly increased peak efficiencies of up to 95%. "We developed the entire E2WATT wireless platform, from the concept to proprietary architecture and firmware, in order to overcome the limitations of standard AC power adapters and Qi wireless chargers, multiplying the number of applications and the usability of products based on Qi technology," said Igor Spinella, CEO and founder of Eggtronic. "The industry-changing performance of E2WATT is enabled by the high-speed gallium nitride – or GaN – semiconductor technology used in GaNFast power ICs," added Stephen Oliver, VP Corporate Marketing at Navitas Semiconductor. "The Eggtronic team realized the limitations of legacy silicon chips and early discrete GaN with complex circuits and many discrete components. GaNFast power ICs are easy-to-use, 'digital-in, power-out' circuit building blocks which meant the expert team in Modena could focus on their proprietary, high-speed E2WATT topology and achieve a very fast time to market."01.06.2021 07:30:00Junnews_2021-06-15_12.jpg\images\news_2021-06-15_12.jpghttps://www.eggtronic.com/assets/pdf/Eggtronic-E2Watt.pdfeggtronic.com/pdf
Module Market Leader announces Partnership with Berlin-based Business Development SpecialistPower module market leader Vincotech has teamed up...9273Industry NewsModule Market Leader announces Partnership with Berlin-based Business Development SpecialistPower module market leader Vincotech has teamed up with Berlin-based Foxy Power, a business development company specializing in innovative power electronics. This newly forged alliance aims to maximize the value of Vincotech products, help customers optimize their products, and make the most of Foxy Power's strong industry network. Both companies bring their strengths to the table: Foxy Power excels at identifying unique value propositions for building strategic partnerships. Vincotech, known for its flexibility and reliability, designs and builds power modules for motion control, renewable energy, and power supply applications.30.05.2021 06:00:00Maynews_2021-06-15_1.png\images\news_2021-06-15_1.pnghttps://foxypower.com/foxypower.com
Technology for 150V GaN HEMT DevicesROHM developed an 8V gate breakdown voltage (rated...9289Product ReleaseTechnology for 150V GaN HEMT DevicesROHM developed an 8V gate breakdown voltage (rated gate-source voltage) technology for 150V GaN HEMT devices – optimized for power supply circuits in industrial and communication equipment. Existing GaN devices with a withstand voltage of 200V or less typically have a rated gate-source voltage of 6V with respect to a gate drive voltage of 5V, resulting in an extremely narrow voltage margin of just 1V. Exceeding the rated voltage can cause reliability problems such as degradation and destruction, plus the gate drive voltage requires high accuracy control, which has been a major obstacle to the widespread application of GaN devices. In response, ROHM succeeded in raising the rated gate-source voltage from the typical 6V to 8V by adopting an original structure. This triples the voltage margin during device operation, so even if a voltage overshoot exceeding 6V occurs during switching, the device will not degrade, contributing to higher reliability of the power supply circuit. ROHM's GaN device utilizes a versatile package that delivers superior heat dissipation with a proven track record for reliability and mountability. This enables easy replacement of existing silicon devices and simplifies handling during the mounting process. Furthermore, using copper clip junction packaging technology reduces parasitic inductance by 55% over conventional packages, maximizing device performance when designing circuits for high frequency operation.27.05.2021 14:30:00Maynews_2021-06-15_19.jpg\images\news_2021-06-15_19.jpghttps://www.rohm.com/news-detail?news-title=150v-gan-hemt&defaultGroupId=falserohm.com
2W Bipolar Output SMT DC-DC ConvertersMurata has added to its range of advanced power so...9293Product Release2W Bipolar Output SMT DC-DC ConvertersMurata has added to its range of advanced power solutions, with a series of surface mount DC-DC converters. Comprised of 9 different models, the lightweight units in the MGJ2 series each have a 2W power rating and are supplied in compact, low-profile form factor modules with 19.49mm × 14.99mm × 4.39mm dimensions. They are intended to accompany the IGBT and SiC-based MOSFET high-voltage gate drivers used in industrial, renewable energy and mobility applications. Available in input versions that accommodate the commonly-used 5V (in development), 12V and 15V voltage rails, they feature +15V/-5V, +15V/-9V and +20V/-5V bipolar outputs. The MGJ2 DC-DC converters exhibit an ultra-low isolation capacitance of just 3pF (typical). This helps them to mitigate the coupling of transients across the isolation barrier and prevent EMI issues from occurring due to circulating currents generated by high frequency signals. Their characterised partial discharge performance means that elevated levels of operation can be maintained despite the demanding nature of the high-voltage applications they will be used in. Likewise, the common-mode transient immunity (CMTI), which exceeds 200kV/µs, allows them to deal with high switching frequencies.26.05.2021 18:30:00Maynews_2021-06-15_23.jpg\images\news_2021-06-15_23.jpghttps://www.murata.com/en-eu/news/power/dcdc/2021/0526murata.com
350kW Planar TransformerA high power design using 2 power sections of 175k...9290Product Release350kW Planar TransformerA high power design using 2 power sections of 175kW each for a total of 350kW output power. The topology is a full bridge with -55°C to 150°C operation. Power dissipation is less than 1400Watts with over 99.0% efficiency. Input voltage range is 700 to 900Vdc with output at 625V and 560Arms. Different terminal configurations can be made for a wide range of input and output voltages. Operating frequency is 50kHz with less than 1uH of leakage inductance. Is designed to be placed on a cooling plate for maximum mechanical and thermal performance. Size is L:400mm, W:400mm, H:70mm.26.05.2021 15:30:00Maynews_2021-06-15_20.jpg\images\news_2021-06-15_20.jpghttps://www.paytongroup.com/planar-transformerspaytongroup.com
Hardware-based Field-oriented Control and IO-Link CommunicationTRINAMIC Motion Control introduces an open-source,...9267Product ReleaseHardware-based Field-oriented Control and IO-Link CommunicationTRINAMIC Motion Control introduces an open-source, fully integrated reference design that simplifies the development of industrial robotic end-of-arm tooling (EoAT). The TMCM-1617-GRIP-REF reference design integrates hardware-based field-oriented control (FOC) and three communication ports to shrink the design size of electronic robotic grippers by three times, while reducing development time by half. The reference design features Maxim Integrated's industrial-grade MAX22000 high-precision configurable analog input/output and MAX14906 quad-channel digital input/output to adjust the multiple modes of the Trinamic TMCM-1617 single axis servo driver. Designed to fit within the standard form-factor used for EoAT grippers, the TMCM-1617-GRIP-REF reference design supports industrial EtherCAT, IO-Link or RS-485 communication, provides software-programmable analog and digital input/outputs, and can be configured using the Trinamic Motion Control Language Integrated Development Environment (TMCL-IDE). This combination of reference design and software platform provides a simple way for design engineers to rapidly deliver a complete EoAT solution. "There's a need for industrial automation engineers to rely on a toolkit that simplifies the development and commissioning of robotic EoAT solutions," explains Jeff DeAngelis, Vice President of Industrial Communications at Maxim. "The TMCM-1617-GRIP-REF reference design simplifies the tooling development process, allowing automation engineers to focus their time on developing advanced, real-time EoAT solutions that embody the true meaning of delivering intelligence at the edge."26.05.2021 12:30:00Maynews_2021-06-01_17.jpg\images\news_2021-06-01_17.jpghttps://www.maximintegrated.com/en/aboutus/newsroom.html/pr_1411789034maximintegrated.com
International Engineering CompetitionThis year, the entire competition was held online ...9278Industry NewsInternational Engineering CompetitionThis year, the entire competition was held online by Rohde & Schwarz. The competition is aimed at students of electrical engineering, particularly communications engineering, as well as IT, who can participate in trending high-tech topics with practical relevance to companies. The challenge this year was to create a smart software solution to optimize a signal analysis. Engineers who pay very close attention to signal data analysis are highly sought-after in the telecommunications industry. Errors are unacceptable, and inaccuracies are just as unwelcome. Highly reliable signal generators and analyzers are part of day-to-day work in the industry and involve a large number of parameters that can be configured manually. What would the situation for the engineering teams look like if a program code could configure the parameters automatically? This was the question tackled by the 86 students taking part in this year's Engineering Competition. During the competition, they received mobile radio signals to be analyzed using a code to develop in Phython. They were provided with the R&S VSE vector signal explorer software, a state-of-the-art solution giving them a wide variety of analysis tools to evaluate and troubleshoot digitally modulated signals. The students who wrote the best Python program for the automated identification of signal parameters qualified for a more advanced challenge in the finals. The code submitted was evaluated based on signals that were unknown to the student teams.26.05.2021 11:00:00Maynews_2021-06-15_6.png\images\news_2021-06-15_6.pnghttps://www.rohde-schwarz.com/uk/about/news-press/all-news/signal-analysis-stronger-than-ever-university-competition-is-about-to-enter-its-17th-round-press-release-detailpage_229356-1079112.htmlrohde-schwarz.com
Power DC-Link Film Capacitor for Automotive and Green Energy ApplicationsKEMET announces its C4AK high temperature, power f...9264Product ReleasePower DC-Link Film Capacitor for Automotive and Green Energy ApplicationsKEMET announces its C4AK high temperature, power film DC-Link capacitor designed for continuous operation up to 1,000 hours at 135°C. The C4AK series joins the C4AU (harsh environment) and C4AQ-P (125°C) family of power DC-Link film capacitors. These series offer higher capacitance density, DC voltage, and DC ripple current capabilities with an extended operational lifetime at high temperatures in harsh environments. Ideal for use in automotive, green, and industrial applications, these metallized film capacitors are well suited for DC filtering and DC-Link in solar, fuel cells, inverters, storage energy systems, automotive (Bi) On-Board Charger, Wireless Power Transfer (WPT), DC/DC, heaters, and welding equipment. Due to its enhanced performance design, the KEMET DC-Link C4AK film capacitor provides a superior alternative for current capacitor solutions. Design features include a radial box style for PCB mounting, miniaturization, low profile, 2 – 4 leads, and fewer capacitors needed in parallel to meet the required peak and ripple current. The C4AK film capacitor surpasses the extreme conditions of the standard automotive (AEC-Q200) requirements for film technology in severe humidity/temperature conditions. Compared to competitor technologies, the C4AK series has greater performance with a lifetime of 4,000 hours at 125°C and 1000 hours at 135°C in harsh environmental conditions. The C4AK DC-Link film capacitor's extended life at high temperatures provides designers an ideal miniaturized, reduced component count solution over conventional film capacitors, particularly in Wide Band Gap high frequency, high current systems.26.05.2021 09:30:00Maynews_2021-06-01_14.jpg\images\news_2021-06-01_14.jpghttps://www.kemet.com/en/us/new-products.htmlkemet.com
48 V to 12 V LLC Power Conversion Demonstration BoardEPC announces the availability of the EPC9149, a 1...9272Product Release48 V to 12 V LLC Power Conversion Demonstration BoardEPC announces the availability of the EPC9149, a 1 kW-capable 48 V input to 12 V output LLC converter that operates as a DC transformer with a conversion ratio of 4:1. This demonstration board features the 100V EPC2218 and 40 V EPC2024 GaN FETs. The board is the size of DOSA-standard ?th brick format, measuring only 58.4 mm by 22.9 mm. This is considerably smaller than alternative silicon-based solutions that are generally sized in the ¼th brick format, or twice as large, for 1 kW of output power. The total thickness of the converter without heatsink is only 10 mm. To make it simple for a power supply designer to easily replicate this design, all supporting materials for this board including schematic, bills of materials, and Gerber files are available on the EPC website. The high-power density, 1226 W/in3, is achieved thanks to EPC GaN FET technology. eGaN FETs enable high switching frequency, in this case 1 MHz, and they are very small, ? of the size of silicon MOSFETs with similar on resistance. The EPC9149 board features four 100 V rated EPC2218 eGaN FETs for the primary rectification, and eight 40 V rated EPC2024 eGaN FETs for the secondary synchronous rectification. The board also features a 4 mm x 4 mm Microchip dsPIC33CKMP102T-I/M6 for flexibility, configuration, communications, and programmability.25.05.2021 17:30:00Maynews_2021-06-01_22.jpg\images\news_2021-06-01_22.jpghttps://epc-co.com/epc/EventsandNews/News/ArtMID/1627/ArticleID/2991/EPC%e2%80%99s-1-kW-48-V-to-12-V-LLC-Power-Conversion-Demonstration-Board-Delivers-Best-in-Class-Power-Density-of-1226-Win3-.aspxepc-co.com
Tier 1 Semiconductor Automotive Supplier GaN Power Electronic ProgramOxford Instruments Plasma Technology announced tha...9254Industry NewsTier 1 Semiconductor Automotive Supplier GaN Power Electronic ProgramOxford Instruments Plasma Technology announced that a leading German semiconductor manufacturer to the automotive industry has selected its PlasmaPro100 Cobra system for the development of next generation GaN power electronic devices. The production-proven system allows for rapid change between wafer sizes up to 200 mm and the cost of ownership is one of the lowest in the market. The PlasmaPro100 Cobra system will be incorporated into the R&D section and will be used for development of GaN power devices. GaN power devices are gaining market share in fast charger applications and offer benefits in Electric Vehicle power management systems. We continue to see very encouraging signals in the form of increasingly proactive customer engagement and clear market preparation and positioning activities from significant industry players for the emerging Wide Band Gap power electronic market. "Our Atomic Scale Processing etch solution being selected by this world leading manufacturer for their GaN power electronics programme is an important strategic win for Oxford Instruments Plasma Technology" comments Klaas Wisniewski, Plasma Technology's Strategic Business Development Director, who also added: "The GaN based power electronic market is very dynamic with improvements to both performance and cost expected at each design iteration. This reiterates the importance of our strategy to focus on atomic scale processing solutions such as atomic layer deposition (ALD) and atomic layer etching (ALE). We are pleased that such a leading automotive semiconductor company recognizes the benefits our solutions deliver.25.05.2021 09:00:00Maynews_2021-06-01_4.jpg\images\news_2021-06-01_4.jpghttps://www.oxinst.com/news/tier-1-semiconductor-automotiveoxinst.com
Samsung's First MOSFET-based Refrigerator Inverter DesignInfineon Technologies supplied Samsung Electronics...9253Industry NewsSamsung's First MOSFET-based Refrigerator Inverter DesignInfineon Technologies supplied Samsung Electronics with power devices to couple the highest energy efficiency with lowest audible noise. They have been integrated in Samsung's brand new one-door fridge and French Door Fridge inverterized refrigerator. Inverterization is an emerging DC to AC conversion trend in contemporary inverter designs. It helps the application run more quietly and smoothly while the average power consumption is reduced compared to a traditional on/off control. To meet Samsung's requirements towards improved efficiency and lower system cost together with a lower noise level, the Digi Touch Cool, Curd Maestro features multiple power solutions from Infineon – EiceDRIVER gate-driver IC, CoolSET Gen 5 for AC/DC conversion, and 600 V CoolMOS PFD7 for compressor drives. This is Samsung's first refrigerator design that uses discrete devices instead of power modules in the compressor. The 600 V CoolMOS PFD7 superjunction MOSFETs come with a best-in-class body diode allowing for improved soft-recovery index and the industry's fastest reverse recovery time (t rr), making them a perfect choice for home appliance motor drives. Compared to module-based designs, using MOSFETs enables lower energy consumption especially at light-load conditions and an efficiency increase as of 1.7 percent. In addition, this innovative approach allows for a heatsink-less design, a 10 percent reduction in system cost and a longer refrigerator lifetime.25.05.2021 08:00:00Maynews_2021-06-01_3.jpg\images\news_2021-06-01_3.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2021/INFPSS202105-072.htmlinfineon.com
One-step Ball Grid Array Ball-attach FluxIndium Corporation continues to expand its flux po...9262Product ReleaseOne-step Ball Grid Array Ball-attach FluxIndium Corporation continues to expand its flux portfolio with WS-823-a proven, one-step ball grid array (BGA) ball-attach flux designed to eliminate the costly and warpage-inducing prefluxing step, especially on Cu-OSP substrate. While the standard ball-attach process requires two steps, especially on a Cu-OSP substrate, WS-823 is a halogen-free, water-wash flux designed for a single-step ball-attach process that eliminates the prefluxing step in order to create reliable ball-to-pad joints. <br>WS-823 provides:<br>-Tackiness suitable for holding solder spheres in place during reflow<br>-Excellent solderability on a wide range of surfaces, including AuNi and oxidized Cu-OSP<br>-Uniform pin transfer over extended periods, eliminating changes in joint quality over time and uneven deposit sizes, which can lead to "missing ball" <br>-A formula engineered for low-voiding, thereby increasing joint strength <br>-Good cleanability with room temperature DI water, avoiding the formation of white residue<br>25.05.2021 07:30:00Maynews_2021-06-01_12.jpg\images\news_2021-06-01_12.jpghttps://www.indium.com/corporate/media-center/news/indium-corporation-introduces-new-ball-attach-flux/indium.com
Last Call for Scientific PapersThe Electric Drives Production Conference (E|DPC) ...9259Event NewsLast Call for Scientific PapersThe Electric Drives Production Conference (E|DPC) 2021 represents an outstanding platform for the exchange of developers, researchers and users of electric drives. We would be very delighted if you present your latest technical expertise in front of professionals from science and industry. Ten days are left to submit your scientific abstract until May 31, 2021. To ensure a reliable planning for everyone, the E|DPC will take place as a virtual event from December 7 to 9, 2021. E|DPC 2021 offers the possibility to submit different types of contributions. The industrial contribution is an excellent platform to promote new technologies without having to prepare a full paper. Furthermore, scientific contributions are intended for scientists to present their latest research findings in front of peers and to influence industry representatives. All scientific fullpapers that pass the review process will be part of the proceedings of E|DPC. The papers will be indexed by Scopus and Google Scholar. Since the launch in 2011 we publish every year with IEEE and in 2021 this is intended as well. In contrast, the industrial contributions will be made available in the download area of the conference. It is necessary to upload an abstract for each kind of contribution. After accepting the abstracts uploaded, authors of scientific contributions will be asked to upload a full paper being reviewed by the international program committee before acceptance. Authors of industrial contributions will be requested to upload the slides of their presentation shortly before the conference.24.05.2021 14:00:00Maynews_2021-06-01_9.jpg\images\news_2021-06-01_9.jpghttps://www.edpc.eu/wp-content/uploads/2021/03/e5d949f29f9cec53c7bcd456ed9e8624.pdfedpc.eu
SEMICON Southeast Asia Themed "Power Innovation - 5G and Beyond"SEMICON Southeast Asia 2021 (23-27 August 2021, Hy...9256Event NewsSEMICON Southeast Asia Themed "Power Innovation - 5G and Beyond"SEMICON Southeast Asia 2021 (23-27 August 2021, Hybrid Event) will gather industry visionaries and experts to highlight the latest developments, innovations, and trends in segments of electronics including Smart Manufacturing, Smart Mobility, Smart Data, AI and 5G as technology continues to reshape the way people work and live.24.05.2021 11:00:00Maynews_semicon_sea.png\images\news_semicon_sea.pnghttps://semi.website/05bpseanewssemi.website
Anker Selects GaN Technology for Charger SeriesPower Integrations announced the InnoSwitch4-CZ fa...9251Industry NewsAnker Selects GaN Technology for Charger SeriesPower Integrations announced the InnoSwitch4-CZ family of high frequency, zero voltage switching (ZVS) flyback switcher ICs. InnoSwitch4-CZ devices incorporate a robust 750 V primary switch using Power Integrations' PowiGaN technology and a novel high frequency active clamp flyback controller to facilitate a new class of ultra-compact chargers suitable for phones, tablets, and laptops. Balu Balakrishnan, CEO of Power Integrations said: "The introduction of the InnoSwitch4-CZ family of ICs marks a significant milestone for GaN technology. PowiGaN switches, in conjunction with our active clamp solution – ClampZero, enable a highly efficient design and an extremely compact form-factor. We're pleased to have worked closely with the Anker team to bring this new class of mobile charger to market." Steven Yang, CEO at Anker added: "We are excited to work with Power Integrations as their exclusive launch partners for their InnoSwitch4 chipsets. The InnoSwitch4-CZ was a natural choice for Anker's new Nano II series of USB-C chargers. Its outstanding levels of integration and efficiency are key to the Nano II series' extremely compact design." Targeting high efficiency compact USB PD adapters, high-density flyback designs up to 110 W and high-efficiency CV/CC power supplies, InnoSwitch4-CZ ICs provide variable output voltage and constant current profiles. Devices are fully protected featuring auto-restart or latching fault response for output over-voltage and under-voltage protection, multiple output under-voltage fault thresholds and latching or hysteretic primary over-temperature protection.24.05.2021 06:00:00Maynews_2021-06-01_1.png\images\news_2021-06-01_1.pnghttps://investors.power.com/news/news-details/2021/Power-Integrations-Introduces-InnoSwitch4-CZ-Flyback-Switcher-ICs-for-a-New-Class-of-Mobile-Charging-Devices/default.aspxpower.com
Environmental Vision 2050ROHM's 'Environmental Vision 2050' contributes to ...9252Industry NewsEnvironmental Vision 2050ROHM's 'Environmental Vision 2050' contributes to achieving a sustainable society by 2050. In addition to pursuing zero carbon and zero emissions (zero CO2 emissions) based on the three themes of 'climate change', 'resource recycling', and 'coexistence with nature', ROHM will promote business activities in harmony with the natural cycle to protect biodiversity. ROHM's corporate objective is: 'Quality is our top priority at all times'. Since our company's foundation, we have been actively contributing to society and the progress of our culture through a consistent supply, under all circumstances, of high quality products in large volumes to the global market. The role of semiconductors – ROHM's main products – is becoming increasingly important to achieving a decarbonized society. In particular, improving the efficiency of motors and power supplies, which are said to account for the most of the world's electricity consumption, has become our major mission. Against this backdrop, our management vision for 2020 is: 'Focus on power and analog products to solve social challenges by delivering greater energy savings and miniaturization in customer products.' In order to further contribute to society, we will clarify the direction we should take while raising awareness among all group employees.21.05.2021 07:00:00Maynews_2021-06-01_2.jpg\images\news_2021-06-01_2.jpghttps://www.rohm.com/news-detail?news-title=environmental-vision-2050&defaultGroupId=falserohm.com
Magnetic Sensor Family with Analog and Digital Output FormatTDK Corporation has upgraded its Micronas 3D HAL d...9269Product ReleaseMagnetic Sensor Family with Analog and Digital Output FormatTDK Corporation has upgraded its Micronas 3D HAL direct-angle Hall-effect sensor family, HAL 37xy (HAL 37xy, HAR 37xy and HAC 37xy)*, for automotive and industrial applications regarding functional safety aspects. All members of HAL 37xy are now defined as SEooC (Safety Element out of Context) ASIL B-ready, according to ISO 26262. HAL 37xy rotary position detection features are used in applications such as accelerator pedals, electronic throttle controls, rotary shifters (with push-function) and rear-axis steering systems. Furthermore, the sensors detect linear position in applications like clutch or brake pedals, transmission systems, cylinders and valve position sensing.** Relevant documentation, like safety manuals and FMEDA summary reports are available on request. HAL 37xy family's production is already ongoing; samples are available at any time. TDK enabled vertical Hall plates to integrate into the standard CMOS process through its 3D HAL technology. The process made it easier to evaluate relative strength of the horizontal and vertical magnetic field components, which is key for excellent angular performance. In comparison, conventional planar Hall technology is only sensitive to the magnetic field orthogonal to the chip surface. TDK offers three different direct-angle sensor variants with the HAL 37xy sensors: the proven HAL 37xy sensor family, a version with redundancy function via two integrated Hall sensor dies (HAR 37xy), and a version with integrated capacitors (HAC 37xy).20.05.2021 14:30:00Maynews_2021-06-01_19.jpg\images\news_2021-06-01_19.jpghttps://www.micronas.tdk.com/en/news-events/trade-news/tdk-announces-asil-b-upgrade-its-3d%C2%A0hal%C2%AE-direct-angle-sensor-family-hal%C2%A037xymicronas.tdk.com
Ultra-Broadband Capacitors for Reliable, Repeatable PerformanceAVX Corporation has released UBC 550 Series ultra-...9287Product ReleaseUltra-Broadband Capacitors for Reliable, Repeatable PerformanceAVX Corporation has released UBC 550 Series ultra-broadband capacitors designed to deliver reliable, repeatable performance from 16KHz to 70+GHz in ultra-broadband microwave and millimeter-wave RF applications with stringent operating requirements. The UBC 550Z, 550U, and 550L Series ultra-broadband capacitors have a rugged and compact single-piece, surface-mount, multilayer ceramic construction made of the highest quality, RoHS-compliant materials and exhibit ultra-low insertion loss, excellent return loss, flat frequency response, and high unit-to-unit repeatability. These characteristics make the series ideally suited for use in DC blocking, coupling, bypassing, and feedback applications within optoelectronics, high-speed data networks, transimpedance amplifiers, broadband test equipment, synchronous optical networks (SONET), transmit and receive optical subassemblies (TOSA and ROSA), and other ultra-broadband microwave and millimeter-wave RF applications. The capacitors have an orientation-insensitive 0201 form factor measuring 0.58mm X 0.3mm (±0.03mm) and support operating frequencies spanning 160KHz with -3dB roll-off to 70+GHz at 25°C with no bias applied and with typical insertion loss of <0.4dB. They are rated for a minimum of 10nF capacitance, 6.3VDC operation from -55°C to +125°C, and 10VDC operation from -55°C to +85°C. They also exhibit a ±22% temperature coefficient of capacitance (TCC) to +125°C, a ±15% TCC to +85°C, and 108O or 107O minimum insulation resistance at +25°C or +125°C and working voltage DC (WVDC).20.05.2021 12:30:00Maynews_2021-06-15_17.jpg\images\news_2021-06-15_17.jpghttps://www.avx.com/news/ubc-550-series-ultra-broadband-capacitors/avx.com
SiC FETs in Industry Standard Surface Mount PackageUnitedSiC continues to expand its FET portfolio wi...9263Product ReleaseSiC FETs in Industry Standard Surface Mount PackageUnitedSiC continues to expand its FET portfolio with the introduction of six 650V and 1200V options, all housed in the industry standard D2PAK-7L surface mount package. Available in 30, 40, 80 and 150mO versions, these latest SiC FETs represent another step forward in accelerating migration to SiC across applications such as server and telecom power supplies, industrial battery chargers and power supplies, EV on-board chargers and DC-DC converters. The D2PAK-7L SiC FETs support significantly heightened switching speeds, with a Kelvin source connection improving gate drive return performance, as well as offering industry-leading thermal capabilities. Through the utilization of Ag Sintering, die attachments can be done on conventional PCBs as well as complex insulated metal substrate (IMS) arrangements. In addition, they exhibit excellent creepage and clearance figures of 6.7mm and 6.1mm respectively – meaning the highest degrees of operational safety can be assured even at elevated voltages. "Through the fast switching capabilities of these latest FETs, alongside the superior thermal performance resulting from Ag sintering, we continue to bring performance, reliability, size and layout benefits to the power designer," states Anup Bhalla, VP Engineering at UnitedSiC. The D2PAK-7L devices are fully supported by UnitedSiC's FET-Jet Calculator. Utilizing this free online resource, engineers can assess the different operational parameters needed for their application, carry out detailed performance comparisons and then identify which is the best SiC solution for their design requirements quickly and with confidence.20.05.2021 08:30:00Maynews_2021-06-01_13.png\images\news_2021-06-01_13.pnghttps://unitedsic.com/news/unitedsic-announces-six-new-d2pak-7l-sic-fets/unitedsic.com
Perfect Magnetically Shielded RoomResearchers at the Paul Scherrer Institute (PSI), ...9294Product ReleasePerfect Magnetically Shielded RoomResearchers at the Paul Scherrer Institute (PSI), located in the Swiss canton of Aargovia, are on the trail of the electric dipole moment of the neutron. For their measurements, VACUUMSCHMELZE GmbH & Co. KG (VAC) recently installed a walk-in shielding room at PSI. This room has the smallest magnetic field and the best shielding against electromagnetic fields in the world. The scientific experiment partly addresses fundamental physics questions: the physicists want to find a neutron electric dipole moment (nEDM). The search for the nEDM is very difficult, since it must be unimaginably small (smaller than 1.8 x 10-26 e-cm, according to current knowledge). Nevertheless, the effort is worthwhile: the nEDM can provide the answer to the question why there is almost no antimatter in the visible universe. VAC is not only characterized by the extraordinary know-how in the development and construction of the shielding booths, the used high permeable alloys are completely manufactured in-house. MUMETALL is characterized to possess the highest permeability of all crystalline materials thus is ideally suited to magnetic shielding. The MSR (Magnetically Shielded Room) for PSI is a seven-shell cabin with external dimensions of 5 x 5 x 4.8 m. A total of 80 feedthroughs with diameters ranging from 55 - 220 mm were placed. The inner booth has a usable space of approx. 2.9 x 2.9 x 2.9 m and has three doors, the largest of which measures 2.6 x 2.6 m. All doors have a mass in the ton range, and a total of about 25 t of the highly permeable MUMETALL material was used.19.05.2021 19:30:00Maynews_2021-06-15_24.jpg\images\news_2021-06-15_24.jpghttps://www.vacuumschmelze.com/shared/quickNav/Newsroomvacuumschmelze.com
Common Mode ChokesWürth Elektronik is expanding its portfolio of com...9271Product ReleaseCommon Mode ChokesWürth Elektronik is expanding its portfolio of common mode chokes with two models. The THT-mountable WE-FCLP for common-mode and differential-mode suppression, and the SMT data line and low-voltage common mode choke WE-CMDC. Both are available from stock without a minimum order quantity. The WE-FCLP has a compact design with a maximum height of 14.5 mm, yet achieves an inductance up to 100 mH. It can suppress common-mode interference up to 85 dB and, thanks to its high leakage inductance, it can be used not only for common-mode suppression but also for differential-mode suppression. WE-FCLP is suitable for applications like mains-powered LED drivers, electronic ballasts, switch mode power supplies and mains filters. WE-CMDC is an AEC-Q200 Grade 1 qualified data line common mode choke. Measuring 11 × 12 × 6 mm, it is also very compact. The choke has a current-carrying capacity up to 8 A and is available with high impedances of 700, 1000 and 1500 ohms. In addition to data and signal lines, applications include low-voltage DC power supplies and DC/DC converters.19.05.2021 16:30:00Maynews_2021-06-01_21.jpg\images\news_2021-06-01_21.jpghttps://www.we-online.com/web/en/wuerth_elektronik/news_weg/News_Detail_WE_Gruppe_122686.phpwe-online.com
ECPE SiC & GaN User ForumSince more than 14 years the biannual ECPE Wide Ba...9276Event NewsECPE SiC & GaN User ForumSince more than 14 years the biannual ECPE Wide Bandgap User Forum has explained the background and given advise and support to design-in SiC and GaN devices in power electronic systems. Major progress has been achieved in this period, with today a multitude of SiC diodes and transistors and as well GaN transistors being available and used in series products. For those, special aspects gain importance, such as robustness or qualification when exposed to demanding mission profiles. On the other hand still more basic research and development work is dedicated to special devices made by SiC, GaN and other wide bandgap materials including their potential applications. These actual topics will be addressed during the upcoming 9th ECPE Wide Bandgap User Forum: 30/06/2021 - 01/07/2021<br>It will start with an overview, introducing the following more detailed presentations. Those will initially refer to exemplary volume applications with SiC and GaN devices. Special attention is dedicated to the design and qualification process including suitable layout methods, measures to achieve the required electromagnetic compatibility and also the aspect of qualification or reliability testing respectively. Circuit theory constitutes the link between system and device; in this respect, drivers are of particular interest. Finally, the related WBG devices themselves will be considered, including an insight and outlook on integration particularly of GaN and on other promising materials. International renowned experts are being invited to give an overview and to in depth explain their research and development work in technical presentations. Besides, the ECPE Wide Bandgap User Forum offers a platform for all participants to share experience and ideas.<br><br>Registration Deadline: 23 June 202119.05.2021 09:00:00Maynews_ecpe.png\images\news_ecpe.pnghttps://www.ecpe.org/events/workshops-tutorials/all/details/evt/mdl/ed/0/277/rid/bid/ldid/eyJtZWRpYUZpbHRlciI6eyJtZWRpYUxpc3RVcmkiOiJ8fHx8fHx8In0sImV2ZW50RmlsdGVyIjp7ImV2ZW50TGlzdFVyaSI6IjF8bHVmZWRpdG1lZGlhbGlicmFyeXxNZWRpYUxpYnJhcnl8TWVkaWFMaWJyYXJ5fGV2ZW50TGlzdHwyODd8MjAzN3wiLCJlbnRlcmVkUGVyaW9kQ3VycmVudCI6dHJ1ZX0sInJvYWRtYXBGaWx0ZXIiOnsicm9hZG1hcExpc3RVcmkiOiJ8fHx8fHx8In0sImJyb2NodXJlRmlsdGVyIjp7ImJyb2NodXJlTGlzdFVyaSI6Inx8fHx8fHwifSwibGVnYWxEb2N1bWVudEZpbHRlciI6eyJsZWdhbERvY3VtZW50TGlzdFVyaSI6Inx8fHx8fHwifX0%3D/ecpe.org
Solution for High-Performance GPUs, Server, 5G, and AIAlpha and Omega Semiconductor announced a series o...9291Product ReleaseSolution for High-Performance GPUs, Server, 5G, and AIAlpha and Omega Semiconductor announced a series of Smart Power Stages (SPS) targeting multiphase VR regulators powering high-performance GPU and CPU in desktop Add-In Graphics Cards (AICs), gaming laptops, servers, data storage, artificial intelligence, and networking equipment. The AOZ527xQI series uses AOS's latest generation of a flexible smart driver IC and Gen Alpha MOSFET technology to provide benchmark performance in an industry-standard 5mm x 6mm QFN package. The series comprises three DC current levels for multiphase voltage regulator optimization. An SPS provides current monitoring (IMON) and temperature monitoring (TMON) information. The IMON function is used to replace traditional DCR sensing schemes with improved accuracy and eliminates the external components needed for DCR sensing and tuning. The TMON pin doubles as a fault pin, reporting the power stage temperature by outputting an analog voltage of 8mV/°C. The TMON pin is an open-drain output that pulls high in the event of a fault. The AOZ527xQI uses a highly flexible and configurable driver IC to make this SPS compatible with many multiphase controllers in the market. It includes protection features such as Over-Current Protection (OCP), OverTemperature Protection (OTP), High-Side FET Source Detect (HSD), and Pre-Over-Voltage Protection (PreOVP).18.05.2021 16:30:00Maynews_2021-06-15_21.jpg\images\news_2021-06-15_21.jpghttp://www.aosmd.com/res/news/news-article-1621353233420/AOZ527xQI_SPS_PR.pdfaosmd.com/pdf
65W USB-C PD GaN Adapter Reference DesignTransphorm and Silanna Semiconductor announced a G...9270Product Release65W USB-C PD GaN Adapter Reference DesignTransphorm and Silanna Semiconductor announced a GaN power adapter reference design. The solution is an open frame, 65W USB-C Power Delivery (PD) charger that combines Transphorm's SuperGaN Gen IV platform with Silanna Semiconductor's proprietary Active Clamp Flyback (ACF) PWM controller. Together, the technologies yield an unprecedented peak efficiency of 94.5 percent with an uncased power density of 30W/in3. Silanna Semiconductor and Transphorm's universal GaN adapter design is ideal for powering laptops, tablets, smartphones and other IoT devices. The SuperGaN FET is Transphorm's TP65H300G4LSG, a 650 V 240 mO device in an industry standard PQFN88 package. It leverages the SuperGaN Gen IV platform, which uses advanced epi and patented design technologies to improve performance. The robust GaN FET also offers the high reliability synonymous with Transphorm devices, including the industry's best gate robustness. And, unlike e-mode devices, protective external circuitry such as additional bias rails or level shifters are not needed-an advantage that produces higher efficiency. Collectively, these and other features further increase the adapter system's overall power density and reduce BoM costs. Silanna Semiconductor's SZ1130 is the world's first fully-integrated ACF PWM controller that integrates an adaptive digital PWM controller, an Active Clamp FET, an Active Clamp Gate Driver, and a UHV Startup regulator. As an ACF solution, it delivers higher performance than competing quasi-resonant (QR) controllers and offers the simplest design in the smallest PCB area among all ACF controllers in the market.17.05.2021 15:30:00Maynews_2021-06-01_20.jpg\images\news_2021-06-01_20.jpghttps://www.transphormusa.com/en/news/65w-usbc-pd-gan-adapter-rd/transphormusa.com
Sensor Meets Requirements of Automotive ApplicationsAllegro MicroSystems announced the release of the ...9265Product ReleaseSensor Meets Requirements of Automotive ApplicationsAllegro MicroSystems announced the release of the A31315 sensor, member of the 3DMAG family of rotary and linear magnetic position sensor ICs for automotive and industrial applications. 3DMAG sensors combine Allegro's proven planar and vertical Hall-effect technologies to measure magnetic field components along three axes (X, Y, Z), enabling true 3D sensing capabilities with a wide magnetic dynamic range without saturation. The sensors' flexible 3D Hall front end and configurable signal processing architecture enable highly accurate, absolute linear position and rotary position measurements up to 360° while easing system integration challenges by providing greater freedom in sensor placement. Existing Allegro 3DMAG devices, such as the ALS31300 and ALS31313 sensors, also support 3D magnetometer applications in which all three magnetic components (BX, BY, BZ) are required to track complex magnetic movements. The A31315 sensor is available as a single die in a compact SOIC-8 package, and as a fully redundant stacked dual die in a TSSOP-14 package for applications requiring redundancy or higher levels of measurement. Unlike traditional side-by-side dual die configurations, Allegro's stacked die construction closely aligns the sensing elements of both die, ensuring the measurement of nearly identical magnetic fields. This innovative design enables the dual-die A31315 sensor to offer superior channel matching performance and tighter channel comparison thresholds common in fully redundant safety systems. 17.05.2021 10:30:00Maynews_2021-06-01_15.jpg\images\news_2021-06-01_15.jpghttps://www.allegromicro.com/en/about-allegro/news-room/2021/3dmag-prallegromicro.com
Wide-bandgap Power Converters with Inverter Development ModulesImperix is glad to announce the implementation of ...9266Product ReleaseWide-bandgap Power Converters with Inverter Development ModulesImperix is glad to announce the implementation of the RedLink product range from Firecomms. Imperix has grown a multi-disciplinary product portfolio on inverter modules and high-performance controllers. Such modularity brings many challenges at managing the galvanic isolation throughout the setup while complying with the various sources of EMI-induced perturbations. Firecomms' long-term cooperation with Imperix fostered the implementation of the high-speed version Redlink transceivers within Imperix's Silicon-carbide power modules range. The high-speed, low Pulse Width Distortion (PWD), robust EMI performance, and low propagation delay skew of the 50 MBd RedLink transceivers provide simple, reliable, and galvanically isolated transmission of switching and fault signals while maintaining the time resolution provided by the Imperix B-Box RCP power electronics controller. Thanks to the simplicity and modularity provided by Imperix products supported by Firecomms technologies, the development of Silicon-carbide power inverters and drives is within reach of every electrical engineer. "We're glad to see that our industry-proven optical communication technologies thanks to Imperix products, can accommodate and accelerate the R&D of modern converters", says Michael O'Gorman, Head of Product Development at Firecomms. Simon Delalay, Managing Director at Imperix adds, "Thanks to Firecomms products, our customers are definitely able to develop wide-bandgap inverters as they would play with LEGO blocks".14.05.2021 11:30:00Maynews_2021-06-01_16.png\images\news_2021-06-01_16.pnghttps://imperix.com/imperix-news/wide-bandgap-power-converters-with-easy-to-use-inverter-development-modules/imperix.com
Reference Design Demonstrates Heatsink-Free 250W Resonant ConverterSTMicroelectronics has released the first referenc...9268Product ReleaseReference Design Demonstrates Heatsink-Free 250W Resonant ConverterSTMicroelectronics has released the first reference design for its MasterGaN power packages, demonstrating how the highly integrated devices increase power density, boost energy efficiency, simplify design, and accelerate time to market. The EVLMG1-250WLLC reference design is a 250W resonant converter with a 100mm x 60mm board outline and 35mm maximum component height. It features the MasterGaN1, which contains one half-bridge STDRIVE gate driver optimally connected to two 650V normally-off GaN transistors with matched timing parameters, 150mO on-resistance (Rds(on)), and 10A maximum current rating. The logic inputs are compatible with signals from 3.3V to 15V. MasterGaN1 is suitable for high-efficiency soft-switching topologies including resonant converters, active clamp flyback or forward converters and bridgeless totem-pole PFC (power-factor correction) in AC/DC power supplies, DC/DC converters, and DC/AC inverters up to 400W. The primary side runs heatsink-free, leveraging the high efficiency of the GaN power transistors. In addition, GaN's superior switching performance allows a higher operating frequency than ordinary silicon MOSFETs, permitting smaller magnetic components and capacitors for greater power density and reduced bill of materials. Designed for a nominal 400V supply, the EVLMG1-250WLLC provides a 24V/10A output and achieves maximum efficiency above 94%. Benefiting from MasterGaN's integrated safety features, the converter output is protected against short circuit and overcurrent. There is also brown-out protection and an input-voltage monitor that permits sequencing within an array of DC/DC converters and prevents a motor from starting under low-voltage conditions.13.05.2021 13:30:00Maynews_2021-06-01_18.jpg\images\news_2021-06-01_18.jpghttps://newsroom.st.com/media-center/press-item.html/n4345.htmlst.com
Marie Hayden Appointed to Chief EngineerSmart Wires has announced the promotion of Marie H...9257PeopleMarie Hayden Appointed to Chief EngineerSmart Wires has announced the promotion of Marie Hayden to the role of Chief Engineer where she will lead the design, development and support of Smart Wires products and solutions. "For the past several years, Marie has been a key part of our success in Europe and Australia, and we are excited about the impact she will have leading our engineering team. We identified a clear need for this new role as we position the company to scale and serve a rapidly growing customer base. Marie's proven leadership capabilities, engineering expertise and knowledge of our customers' needs make her the perfect choice for this role and she will be a valued addition to the leadership team at Smart Wires," said Peter Wells, CEO of Smart Wires. Describing her new responsibilities Marie said, "Smart Wires has developed highly innovative technology that is transforming how power grids around the world are planned and operated. In leading the engineering team, my goals include enabling our team to continue to develop safe, high-quality products, fostering an environment in which technical innovation can thrive and delivering world-leading solutions that support our customers' near-term and enduring needs. In this role, I also hope to inspire more women to choose engineering as a career and to embrace leadership roles in this industry." Marie joined the company in 2018 as Vice President, Business Development, and was promoted to General Manager, Europe, in 2020. During this time, Marie significantly grew Smart Wires' customer base in Europe and Australia – collaborating with transmission and distribution companies to help them solve problems and evolve their grids with flexible, high-impact solutions.13.05.2021 12:00:00Maynews_2021-06-01_7.jpg\images\news_2021-06-01_7.jpghttps://www.smartwires.com/2021/05/13/marie-hayden-appointed-to-new-chief-engineer-position-at-smart-wires/smartwires.com
Demonstration Board Powered by Gallium NitrideEPC announces the availability of the EPC9137, a 1...9248Product ReleaseDemonstration Board Powered by Gallium NitrideEPC announces the availability of the EPC9137, a 1.5 kW, two-phase 48 V – 12 V bidirectional converter that operates with 97 % efficiency in a very small footprint. The design of this demonstration board is scalable; that is, two converters can be paralleled to achieve 3 kW or three converters can be paralleled to achieve 4.5 kW. The board features four EPC2206 100 V eGaN FETs and is controlled by a module that includes the Microchip dsPIC33CK256MP503 16-bit digital controller. By 2025, one of every 10 vehicles sold worldwide is projected to be a 48 V mild hybrid. 48 V systems boost fuel efficiency, deliver four times the power without increasing engine size, and reduce carbon-dioxide emissions without increasing system costs. These systems will require a 48V – 12V bidirectional converter, with power ranging from 1.5 kW to 6 kW. The design priorities for these systems are size, cost, and high reliability. EPC eGaN FETs can operate with 97% efficiency at 250 kHz switching frequency, enabling 800 W/phase compared to silicon-based solutions, which are limited to 600 W/phase due to the limitation on the inductor current at 100 kHz maximum switching frequency. By using GaN FETs, it is possible to reduce the number of phases from five to four for a 3.5 KW converter while increasing efficiency.  The efficiency of a four-phase GaN converter operating at 250 kHz is 1.5% higher than a five-phase silicon MOSFET-based converter operating at 100 kHz.11.05.2021 17:30:00Maynews_2021-05-15_24.jpg\images\news_2021-05-15_24.jpghttps://epc-co.com/epc/EventsandNews/News/ArtMID/1627/ArticleID/2990/EPC-Launches-Scalable-15-kW-48-V12-V-DC-DC-Demonstration-Board-Powered-by-Gallium-Nitride-GaN-FETs-for-More-Efficient-Smaller-Faster-Bidirectional-Converters.aspxepc-co.com
Clamp Meters with Non-contact Voltage MeasurementFluke has announced the launch of a family of clam...9243Product ReleaseClamp Meters with Non-contact Voltage MeasurementFluke has announced the launch of a family of clamp meters that make electrical measurements much safer for servicing and maintenance technicians. The Fluke 377 and 378 are non-contact voltage True-rms AC/DC clamp meters that allow technicians to make rapid electrical tests without the danger of coming into contact with hazardous live parts. The Fluke 377 and 378 use FieldSense technology to sense voltage and current through the clamp jaw, with only a connection to earth needed for reference. With no direct connection with live components, the risk of electric shock and arc flash is minimized. The clamp meters measure up to 1000 A True-rms AC/DC and up to 2500 A (AC) with the 'iFlex' current probe. Designed for ease of use, only three steps are needed to measure in three phase systems, with each voltage and current shown simultaneously on the dual display. Both meters are available in FC (Fluke Connect1:03 PM) versions with Bluetooth interface. The 377 FC and 378 FC versions also show phase rotation, which can be displayed on a smart phone and saved to the cloud via Fluke Connect software, eliminating the need for handwritten notes. Fluke Connect allows maintenance technicians and service staff to document values and share them with their team. The data gathered can be used as a basis for designing a preventive maintenance program. The 378 FC includes a power quality (PQ) indicator that senses PQ issues, relating to current, voltage or power factor. This allows users to rapidly check if issues relate to the power supply or the connected electrical equipment.11.05.2021 12:30:00Maynews_2021-05-15_19.jpg\images\news_2021-05-15_19.jpghttps://www.fluke.com/en-gb/products/electrical-testing/clamp-metersfluke.com
Partner of European Hyperloop WeekWürth Elektronik will support the first European H...9255Industry NewsPartner of European Hyperloop WeekWürth Elektronik will support the first European Hyperloop Week as an exclusive partner. From July 19 to 25, 2021, a conference filled with round table discussions, keynotes, and the presentation of vehicles called "pods" will take place in Valencia. The highlight of the event will be the pod competition. Representatives from the manufacturer of electronic and electromechanical components will also present. Leading up to the main event, a major contribution is already occurring Würth Elektronik is sponsoring three Hyperloop teams, supplying components and carrying out the thermal and EMC testing in joint laboratories, which are available at the University of Valencia as part of the long-standing research cooperation with Fundación Catédra. Unveiled by Elon Musk in 2014, the progress of the Hyperloop mobility concept with capsules in evacuated tubes, has been presented mainly at the SpaceX site in Los Angeles County in California, USA. For the first time, Hyperloop Week is coming to Europe. The four Hyperloop teams, HYPED from the University of Edinburgh, Swissloop ETH Zurich, Hyperloop UPV Valencia, and Delft Hyperloop, will host the event. The latter of the three have been supported by Würth Elektronik with components and technical support for years.11.05.2021 10:00:00Maynews_2021-06-01_5.jpg\images\news_2021-06-01_5.jpghttps://www.we-online.com/web/en/wuerth_elektronik/news_weg/News_Detail_WE_Gruppe_122366.phpwe-online.com
Square Leaded DC-Link Capacitor SeriesRated for operation at up to 105°C ambient, UL 810...9244Product ReleaseSquare Leaded DC-Link Capacitor SeriesRated for operation at up to 105°C ambient, UL 810 listed, compact size dc-link capacitor series CBB 138 DS from Jianghai covers the voltage range from 450 ~ 1200V while the capacitance comprises values from 1 ~ 120µF. The advanced, self-healing polypropylene dielectric in conjunction with the in-house heavy edge metallization result in superior ripple current capability while being compact in size. The 2- and 4-pin PCB-mount types in a UL 94 V-0 recognized, square plastic encapsulation yield low serial inductance and best volumetric efficiency. This makes the capacitors an ideal choice for demanding industrial applications, e.g. frequency converters and power supplies. The design of the IEC 61071 compliant series can be adapted to provide customized solutions10.05.2021 13:30:00Maynews_2021-05-15_20.jpg\images\news_2021-05-15_20.jpghttps://jianghai-europe.com/products/film-capacitorsjianghai-europe.com
Quality Award for Austrian Power Supply ManufacturerThe Austrian design-in distributor presents power ...9258Industry NewsQuality Award for Austrian Power Supply ManufacturerThe Austrian design-in distributor presents power supply manufacturer RECOM with the CODICO Quality Award. In addition to delivery reliability and logistics services, CODICO particularly emphasises the manufacturer's ability to innovate. Cooperation with high-performance suppliers makes a significant contribution to the long-term success of the company. It is a basic prerequisite for CODICO's Design In concept. Every year, the distribution company evaluates its strategic suppliers worldwide according to uniform, comparable criteria: Delivery reliability, service orientation, innovativeness, cooperation, flexibility and sustainability are central elements of this assessment. Among other things, services such as sample shipments and service and quality criteria in sales support as well as reaction speed and commitment are also taken into account. RECOM, the power supply specialist also based in Austria, is pleased to accept the A-Supplier award this year. "RECOM is an important partner for us who invests a lot of commitment in the further development of complex power supply solutions and who seeks cooperation in the design of product roadmaps," says Sven Krumpel, CEO of CODICO, underlining the award. CODICO values the cooperation with dynamic and innovative suppliers. RECOM is an essential key partner for CODICO in accessing certain areas in medical technology but also in the miniaturisation of PCB modules.07.05.2021 13:00:00Maynews_2021-06-01_8.jpg\images\news_2021-06-01_8.jpghttps://recom-power.com/en/rec-n-codico-honours-recom-with-quality-award-155.html?2recom-power.com
Leader in GaN Power ICs to Go Public at an Enterprise Value of $1.04 BillionNavitas Semiconductor announced that it has entere...9226Industry NewsLeader in GaN Power ICs to Go Public at an Enterprise Value of $1.04 BillionNavitas Semiconductor announced that it has entered into a definitive agreement to combine with Live Oak Acquisition Corp. II ("Live Oak II"), a publicly-traded special-purpose acquisition company. The transaction, which values the combined entity at a pro forma equity value of $1.4 billion, will result in Navitas becoming a publicly-traded company on a national exchange under a new ticker symbol. Gallium nitride (GaN) is a next-generation semiconductor technology that runs up to 20x faster than legacy silicon, and enables up to 3x more power and 3x faster charging in half the size and weight. Navitas GaNFast power ICs integrate GaN power and drive plus protection and control to deliver simple, small, fast and efficient performance. Driven by increasing demand for connectivity, electrification away from fossil fuels, and efficient sustainable energy sources, Navitas predicts GaN ICs can address markets estimated to grow to over $13 billion in 2026. Markets include mobile, consumer, enterprise (data center, 5G), renewables (solar, energy storage) and EV / eMobility. Gene Sheridan, co-founder and CEO of Navitas commented: "Navitas was formed with the vision to revolutionize the world of power electronics while addressing significant sustainability challenges for our planet. Not only has Navitas' world-class team invented and patented revolutionary new technology, but we have also overcome all the key hurdles associated with successfully bringing it to market. We are proud to enter the public capital markets with strong operating momentum and investor partners who share our enthusiasm for our long-term mission."07.05.2021 07:00:00Maynews_2021-05-15_2.jpg\images\news_2021-05-15_2.jpghttps://www.navitassemi.com/navitas-semiconductor-the-industry-leader-in-gallium-nitride-gan-power-ics-to-go-public-at-an-enterprise-value-of-1-04-billion-via-live-oak-ii-spac-business-combination/navitassemi.com
Increasing Supply Security for Silicon CarbideInfineon Technologies has concluded a supply contr...9229Industry NewsIncreasing Supply Security for Silicon CarbideInfineon Technologies has concluded a supply contract with the Japanese wafer manufacturer Showa Denko K.K. for an extensive range of silicon carbide material (SiC) including epitaxy. The German semiconductor manufacturer has thus secured more base material for the growing demand for SiC-based products. SiC enables highly efficient and robust power semiconductors that are used in particular in the fields of photovoltaic, industrial power supply, and charging infrastructure for electric vehicles. "Our broad and fast growing portfolio demonstrates Infineon's leading role in supporting and shaping the market for SiC-based semiconductors which is expected to grow 30 to 40 percent annually over the next five years", says Peter Wawer, President of the Industrial Power Control Division at Infineon.* "The expansion of our supplier base with Showa Denko for wafers in this growth market marks an important step in our multisourcing strategy. It will support us to reliably meet the growing demand mid to longterm. Furthermore, we plan to collaborate with Showa Denko on the strategic development of the material to improve the quality while cutting costs at the same time." "We are proud to be able to provide Infineon with Best-in-Class SiC material and our cutting-edge epitaxy technology" says Jiro Ishikawa, Senior Managing Corporate Officer from Showa Denko K.K.. "Our aim is to continuously improve our SiC material and develop the next technology. We value Infineon as an excellent partner in this regard." The contract between Infineon and Showa Denko K.K. has a two-year term with an extension option. Infineon has the industry's largest portfolio of SiC semiconductors for industrial applications.06.05.2021 10:00:00Maynews_2021-05-15_5.jpg\images\news_2021-05-15_5.jpghttps://www.infineon.com/cms/en/about-infineon/press/press-releases/2021/INFXX202105-068.htmlinfineon.com
Software for Control and Tuning of ICs in BLDC Motor DrivesPower Integrations released its Motor-Expert softw...9237Product ReleaseSoftware for Control and Tuning of ICs in BLDC Motor DrivesPower Integrations released its Motor-Expert software, an embedded "C" code application, library and control GUI that enables designers using the company's BridgeSwitch brushless DC (BLDC) motor driver ICs to precisely control and tune single-phase motors. BLDC motors are widely used in modern, high-efficiency appliances such as compressors, fans and water pumps in domestic appliances, and for ceiling fans and room air conditioning systems. The Motor-Expert software features accurate speed and current control loop functions. The modularity and flexibility of the API-based software architecture enables new use cases and functions to be added and allows users to port the software to their favorite microcontroller or combine with other code in a system CPU. The software meets static (MISRA) and dynamic performance profiling covering latency, jitter and execution time. It requires only 14 kB code memory and 5 kB SRAM, suiting it to microcontrollers with small memory capabilities. The BridgeSwitch motor drive IC can pair with 3 V and 5 V MCUs and removes the need for an external shunt resistor. The BridgeSwitch integrated half-bridge IC family dramatically simplifies the development and production of high-voltage, inverter-driven single- or multi-phase PM and BLDC motor drives. The superior efficiency and distributed thermal footprint architecture of BridgeSwitch motor drives eliminates the need for a heatsink, reducing system cost and weight. Built-in hardware motor overcurrent protection enhances safety and reliability, and simplifies IEC 60335-01 and IEC 60730-01 certification, significantly reducing time-to-market.06.05.2021 06:30:00Maynews_2021-05-15_13.jpg\images\news_2021-05-15_13.jpghttps://investors.power.com/news/news-details/2021/Power-Integrations-Introduces-Software-for-Precise-Control-and-Tuning-of-BridgeSwitch-ICs-in-Single-Phase-BLDC-Motor-Drives/default.aspxpower.com
Acquisition of H. K. Wentworth GroupMacDermid Alpha announced that it has acquired H.K...9235Industry NewsAcquisition of H. K. Wentworth GroupMacDermid Alpha announced that it has acquired H.K. Wentworth Group, owner of the Electrolube & AF brands. "We are very excited to announce this acquisition. H. K. Wentworth Group has a long history of providing innovative and high-quality materials used in the electronics industry," said Joe D'Ambrisi, Executive Vice President and Head of Electronics of MacDermid Alpha Electronics Solutions. We believe that H. K. Wentworth Group's product lines, customer relationships, and resources will reinforce our position as a leading supplier to the industries we serve, and will allow us to more efficiently deliver a wider range of complementary, enabling solutions to our customers. With this acquisition, MacDermid Alpha will continue to be well-situated to capitalize on the many emerging trends in the electronics industry. We view this important acquisition as an excellent step to position the business for continued growth as we work with customers to solve their assembly challenges." This acquisition is aligned with MacDermid Alpha's strategic goals and priorities, namely, to drive growth through the delivery of innovative, value added solutions and services into the global electronics industry. H. K. Wentworth Group's leading products and development initiatives will amplify the already strong programs in the MacDermid Alpha pipeline and will enable continued focus on high growth segments, such as automotive, medical, consumer electronics and 5G communications.05.05.2021 16:00:00Maynews_2021-05-15_11.jpg\images\news_2021-05-15_11.jpghttps://electronics.macdermidenthone.com/news-and-events/macdermid-alpha-electronics-solutions-announces-acquisition-h-k-wentworth-groupmacdermidenthone.com
UK Facility Achieves AS9100D CertificationTT Electronics announced that its Eastleigh UK fac...9232Industry NewsUK Facility Achieves AS9100D CertificationTT Electronics announced that its Eastleigh UK facility has achieved AS9100D certification for the manufacture of systems for the aerospace industry. This certification marks TT's ongoing commitment to provide innovative, safety-critical solutions to the global aerospace supply chain. AS9100, standardised by the globally recognised International Aerospace Quality Group (IAQG), is considered the highest international standard for quality assurance across the aviation, space, and defence industries, and has been widely adopted to promote quality, safety, and continuous product and process improvement. Upgrading the Eastleigh facility to meet AS9100D, the most current version of the standard, was the result of a lengthy audit process in which TT demonstrated a high level of excellence in all areas of the company's quality management system. The Eastleigh location is the twelfth TT location worldwide to meet the rigorous requirements of AS9100 certification, strengthening the company's position as a leading aerospace manufacturing partner – dedicated to providing custom technology solutions. "This certification is an important step in our aerospace growth strategy. Our facility in Eastleigh, which is also SC21 accredited, specialises in the design and manufacture of aircraft interior solutions for commercial aircraft," said TT Electronics EVP, Charlie Peppiatt. "TT has supported technology innovations in this sector for decades, including lightweight, space-saving, and power-efficient cabin signage and mood lighting. While we have always been focused on providing our customers with quality products and services, achieving the AS9100D certification is a well-earned achievement that confirms our steadfast emphasis on quality management."05.05.2021 13:00:00Maynews_2021-05-15_8.jpg\images\news_2021-05-15_8.jpghttps://www.ttelectronics.com/news-events/news/tt-eastleigh-facility-achieves-as9100d/ttelectronics.com
AEC-Q101 Approved Trench Schottky RectifiersNexperia extended its portfolio of Trench Schottky...9247Product ReleaseAEC-Q101 Approved Trench Schottky RectifiersNexperia extended its portfolio of Trench Schottky rectifiers with devices rated at up to 100 V and 20 A. The parts feature excellent switching behavior and leading thermal performance. They are available in Nexperia's Clip Bond FlatPower (CFP) packages which have a much smaller footprint than SMA/SMB/SMC components. Trench technology results in low leakage and also greatly reduces the charge, Qrr, stored in the device. Therefore, Trench Schottky rectifiers deliver very fast switching, cutting both the switching losses of the rectifier and the losses that are induced in the MOSFET in the same commutation cell – a configuration that is commonly used in asynchronous switch-mode power converters. Nexperia's PMEGxxxTx devices additionally provide a wide safe operating area (SOA), delivering an extra safety margin and reducing the risk of thermal runaway compared to parts currently available. Jan Fischer, Nexperia's product manager comments: "Nexperia's Trench Schottky rectifiers combine low forward voltage and very low Qrr to enable best efficiency at high switching speeds as needed in switch-mode power converters. Automotive applications including LED lighting, in particular, will benefit from the wide SOA of our parts." Nexperia is investing in its portfolio of Trench Schottky rectifiers, now offering 32 devices from 40 V to 100 V and up to 15 A in volume production. A further 17 parts, including the 20 A types, are sampling.04.05.2021 16:30:00Maynews_2021-05-15_23.jpg\images\news_2021-05-15_23.jpghttps://www.nexperia.com/about/news-events/press-releases/New-Trench-Schottky-rectifiers-from-Nexperia-increase-efficiency-for-fast-switching-applications.htmlnexperia.com
Photovoltaic Fuses Provide Rugged Circuit ProtectionLittelfuse announced the 400PV Fuse series, a 2410...9246Product ReleasePhotovoltaic Fuses Provide Rugged Circuit ProtectionLittelfuse announced the 400PV Fuse series, a 2410 size, surface mount design (SMD) circuit protection component that offers low resistance for photovoltaic (PV) applications. The 400PV is specifically designed to address the latest trend in solar roofing by enabling PV shingles that integrate both the shingles with the PV cells while incorporating protection that meets the UL 248-19 standard for PV applications. This new development helps eliminate mounting separate solar panels over the existing roofing, allowing the use of the new integrated PV shingles to serve in a dual function – as the protective roofing material while collecting electricity to power the building. "The 400PV Fuse series innovation enables the next generation of smart home designs to utilize photovoltaic roof shingles to power up everything in a house that requires power," said Boris Golubovic, Vice President, Marketing and Strategy at Littelfuse. "The protection provided by these PV fuses help ensure the operational longevity, maintenance convenience, and safety of solar home and building applications."04.05.2021 15:30:00Maynews_2021-05-15_22.jpg\images\news_2021-05-15_22.jpghttps://www.littelfuse.com/about-us/news/news-releases/2021/0504-littelfuse-400pv-photovoltaic-fuses.aspxlittelfuse.com
Dr. Michael MacMillan Appointed as Vice President, Sales and MarketingEpiluvac AB announced that Dr. Michael MacMillan h...9230PeopleDr. Michael MacMillan Appointed as Vice President, Sales and MarketingEpiluvac AB announced that Dr. Michael MacMillan has joined the company as Vice President of Sales and Marketing. Dr. MacMillan will be responsible for Epiluvac's global sales and marketing, and will be based at the company's new office in Orange County, CA, USA. Bo Hammarlund, Board Director, Business Development says - "This is an important milestone for Epiluvac. We see a growing demand for the next generation CVD equipment, not only for Silicon Carbide (SiC) but also for Gallium Nitride (GaN). Mike's expertise in SiC epitaxy, together with his long experience from both research and manufacturing companies, will certainly bring exciting benefits to our products and also our customers." Dr. MacMillan was recently Chief Epitaxial Scientist at SemiQ (formerly Global Power Technologies Group), Lake Forest, CA, and his career spans from early SiC research at Linköping University, Sweden in the 1990's to many years as leader and SiC scientist in major US companies like Northrop Grumman and Dow Corning. Dr MacMillan holds a PhD in Physics from University of Pittsburgh. "This is a great opportunity and privilege to be part of this highly skilled team with their new, exciting CVD platform for wide bandgap semiconductors," says Dr. MacMillan.04.05.2021 11:00:00Maynews_2021-05-15_6.jpg\images\news_2021-05-15_6.jpghttps://epiluvac.com/epiluvac-appoints-dr-michael-macmillan-as-vice-president-sales-and-marketing/epiluvac.com
SUPERFET MOSFETs and SiC Diodes Introduced at PCIM Europe 2021  ON Semiconductor introduced Super-junction (SJ) MO...9241Product ReleaseSUPERFET MOSFETs and SiC Diodes Introduced at PCIM Europe 2021  ON Semiconductor introduced Super-junction (SJ) MOSFETs and SiC. The 650 V SUPERFET III FAST SJ MOSFETs deliver better switching performance than other SJ MOSFETs on the market, with improved efficiency and higher system reliability. These features are in high demand in fast-growing markets, including 5G, electric vehicle (EV) charging stations, telecoms and server sectors. ON Semiconductor also introduced automotive AECQ101 and industrial grade qualified next generation 1200 V SiC diodes, ideal for high power applications such as EV charging stations and solar inverters, UPS, electric vehicles (EV) on-board chargers (OBC), and EV DC-DC Converters. SiC diodes offer significant advantages over silicon solutions, including higher reliability, lower EMI and simpler cooling requirements. The design improves on the first generation SiC diodes thanks to a smaller die size and lower capacitance. The NVDSH20120C, NDSH20120C, NVDSH50120C, and NDSH50120C deliver a lower forward voltage drop and a 4x increase in rated current, with a higher rate of change (di/dt) of 3500 A/µs. The smaller die size also returns a 20 % lower thermal resistance in an F2 package.04.05.2021 10:30:00Maynews_2021-05-15_17.jpg\images\news_2021-05-15_17.jpghttps://www.onsemi.com/PowerSolutions/newsItem.do?article=1000897onsemi.com
Expanded Lineup of Shunt ResistorsROHM developed the GMR320 series of shunt resistor...9239Product ReleaseExpanded Lineup of Shunt ResistorsROHM developed the GMR320 series of shunt resistors featuring a rated power of 10W. GMR320 series is the largest rated power product in ROHM high-power low-ohmic GMR series lineup designed for high power applications in the automotive, industrial equipment, and home appliances. Recent years have seen an increasing of requirement in the automotive and industrial fields for lower power consumption in higher power applications. This in turn requires shunt resistors that support high power and high accuracy current detection to achieve high efficiency operation in a variety of applications. ROHM's GMR and PSR series shunt resistors provide highly accurate current detection even at high power, making them ideal for high power applications in the automotive, industrial and consumer sectors. The GMR320 series is offered in a resistance value range from 5mO to 100mO and a rated power of 10W, making them ideal for automotive engine ECUs and headlamps as well as motors and power supplies for industrial equipment and home appliances. Unique structure and optimized materials allow the GMR320 series to reduce surface temperature rise by 23% over standard products, ensuring high ruggedness against overcurrent loads even though it has the smallest size among 10W class resistors in the market . In addition, a high performance metal alloy for the resistive material provides low Temperature Coefficient of Resistance (TCR), that makes it reliable and highly accurate current detection possible even in the low resistance values.04.05.2021 08:30:00Maynews_2021-05-15_15.jpg\images\news_2021-05-15_15.jpghttps://www.rohm.com/news-detail?news-title=expanded-lineup-of-shunt-resistors-contributes-to-miniaturization-in-high-power-applications&defaultGroupId=falserohm.com
Advanced Battery Energy Storage SystemsLeclanché SA is introducing a concept in battery e...9261Product ReleaseAdvanced Battery Energy Storage SystemsLeclanché SA is introducing a concept in battery energy storage systems featuring plug and play simplicity, scalability, modularity, a reduced carbon footprint and environmental impact. Introducing LeBlockTM, a series of interchangeable five-foot wide blocks which interlock to allow for shipping as a standard 20-foot ISO container and serve as the heavy-duty enclosure for the installed system. The blocks are manufactured in two varieties:<br>BatteryBlock – Shipped with pre-installed liquid-cooled battery racks up to 745 kWh (as of today). Each battery block is equipped with a fire protection system.<br>CombiBlock – Connects the battery blocks and is equipped with appropriate protection devices. Furthermore, it contains a centralized liquid cooling unit dedicated to the temperature management of the connected battery blocks.<br><br>Blocks can be easily moved from a boat to a truck for simplified transportation and installation on a slab/pad by crane. No packaging or container waste removal is required. Since the blocks are shipped with the batteries in-place and wiring/connectors pre-installed, there is no site-specific cabling required.<br>Blocks offers the possibility for use in a storage as a service approach, where the blocks are transported and relocated depending on the real need, such as for EV charging stations that need higher power than the existing grid connection.<br>04.05.2021 06:30:00Maynews_2021-06-01_11.jpg\images\news_2021-06-01_11.jpghttps://www.leclanche.com/new-leblock-from-leclanche-brings-the-simplicity-of-childrens-building-blocks-to-the-serious-business-of-advanced-battery-energy-storage-systems/leclanche.com
Small TVS Diodes for Effective ESD ProtectionTDK Corporation has released tiny high-power TVS d...9250Product ReleaseSmall TVS Diodes for Effective ESD ProtectionTDK Corporation has released tiny high-power TVS diodes for ESD protection, extending its portfolio of components for bidirectional overvoltage protection of I/O interfaces. The space requirement of the so-called chip scale package (CSP) is just 400 x 200 µm2 (CSP01005) or 600 x 300 µm2 (CSP0201), while the package height of just 100 µm is also very low. The TVS diode types are designed for an operating voltage of 5 V and a response voltage of 6.8 V. The clamping voltages of the components are 7.2 V at a peak pulse current of 8 A or 8 V at a peak pulse current of 16 A. The TVS diodes differ in their parasitic capacitances: Type SD0201SL-GP101 (ordering code B74121G0050M060) has a capacitance of 12 pF, while the SD01005SL-GP101 type (B74111G0050M060) has a capacitance value of just 5 pF. Other features include the short response time and low leakage current of just 2 nA at 3.3 V. The protective components are designed in accordance with IEC 61000-4-2 for an ESD contact discharge of up to 24 kV, exceeding standard requirements. They can withstand a high surge current load of up to 8 A according to IEC 61000-4-5 (8/20 µs), despite their low size. The TVS diodes are suitable for various IoT, smart home, and Industry 4.0 applications. Due to their minimal dimensions, the new protective components are ideal for wearables, smartphones, notebooks, tablets, smartwatches or even hearing aids.29.04.2021 19:30:00Aprnews_2021-05-15_26.jpg\images\news_2021-05-15_26.jpghttps://www.tdk-electronics.tdk.com/en/373388/company/press-center/press-releases/press-releases/overvoltage-protection-tdk-offers-extremely-small-tvs-diodes-for-highly-effective-esd-protection/2973802tdk-electronics.tdk.com
Digital PoL Regulator in Sompact SIPBMR474 is a non-isolated digital Point of Load (Po...9245Product ReleaseDigital PoL Regulator in Sompact SIPBMR474 is a non-isolated digital Point of Load (PoL) regulator. The module comes in a vertically mounted SIP (Single Inline Package) design, which saves valuable board space, while being able to deliver up to 80 A output current, with a maximum power output of 198 W. Designed for telecom and datacom applications, the BMR474 offers an excellent price to performance ratio, and offer efficiency levels as high as 95.1% at 12 Vin, 3.3 Vout, full load. The input voltage range is 6 V to 15 V, and the output voltage can be adjusted from 0.6 V to 3.3 V. For output voltages up to 1.8 V, the BMR474 can deliver up to 80 A output current, while for output voltages over 1.8 V the maximum output current is 60 A. Ripple and noise is 5 mV at 12 Vin, 1 Vout, full load. The SIP module includes power connections optimized for high current minimizing the resistive losses between the power module and the load. While the high efficiency and optimized thermal design provide minimum power derating, an optional heatsink can be added for even more demanding applications. The BMR474 is easy to set up via its PMBus digital interface, which provides extensive monitoring, configuration and control capabilities, and is also supported by Flex Power Modules' Power Designer software, which makes design and debug simpler. By using the software's simulation functions, it's straightforward to optimize the configuration parameters, which means designers can achieve a stable control loop with a fast load transient response.29.04.2021 14:30:00Aprnews_2021-05-15_21.jpg\images\news_2021-05-15_21.jpghttps://flexpowermodules.com/flex-power-modules-announces-80-a-digital-pol-regulator-in-compact-sipflexpowermodules.com
Dr. Alain Charles Joins as Non-executive Board MemberCambridge GaN Devices Ltd. (CGD), the fabless semi...9231PeopleDr. Alain Charles Joins as Non-executive Board MemberCambridge GaN Devices Ltd. (CGD), the fabless semiconductor company spun out of Cambridge University, has announced the appointment of industry veteran Dr. Alain Charles as a non-executive board member. Dr Charles has more than 30 years in the semiconductor industry and has joined to accelerate CGD's mission to shape a sustainable future for power electronics. CGD is developing a range of GaN transistors that are customised for key applications in market segments such as consumer and industrial Switch Mode Power Supply (SMPS), lighting, data centres and automotive HEV/EV. Its proprietary ICeGaN technology will allow it to replace silicon in those key applications, while enabling more compact power systems and better use of energy resources. The appointment will see Dr. Charles offer CGD an independent view on the GaN ecosystem while serving as a strategic advisor on energy related initiatives, influencing and steering the board direction. He will also support CGD through strategic introductions to influential R&D institutions, partners, industry bodies and policy makers. These connections will help support CGD's efforts towards delivering green electronics and reshaping the industry towards more sustainable practices. He joins with the semiconductor industry on the cusp of major change. GaN powered devices are significantly higher performing than state-of-the-art silicon-based devices, enabling reductions in the size and weight of power converters, whilst producing energy efficiencies higher than 99%.29.04.2021 12:00:00Aprnews_2021-05-15_7.jpg\images\news_2021-05-15_7.jpghttps://camgandevices.com/news21/camgandevices.com
GaN for 1200V ApplicationsImec and AIXTRON have demonstrated epitaxial growt...9225Industry NewsGaN for 1200V ApplicationsImec and AIXTRON have demonstrated epitaxial growth of gallium-nitride (GaN) buffer layers qualified for 1200V applications on 200mm QST substrates, with a hard breakdown exceeding 1800V. The manufacturability of 1200V-qualified buffer layers opens doors to highest voltage GaN-based power applications such as electric cars, previously only feasible with silicon-carbide (SiC)-based technology. The result comes after the successful qualification of AIXTRON's G5+ C fully automated metal-organic chemical vapor deposition (MOCVD) reactor at imec, Belgium, for integrating the optimized material epi-stack. Wide-bandgap materials gallium-nitride (GaN) and silicon-carbide (SiC) have proved their value as next-generation semiconductors for power-demanding applications where silicon (Si) falls short. SiC-based technology is the most mature, but it is also more expensive. Over the years tremendous progress has been made with GaN-based technology grown on for example 200mm Si wafers. At imec, qualified enhancement mode high-electron-mobility transistors (HEMTs) and Schottky diode power devices have been demonstrated for 100V, 200V and 650V operating voltage ranges, paving the way for high-volume manufacturing applications. However, achieving operating voltages higher than 650V has been challenged by the difficulty of growing thick-enough GaN buffer layers on 200mm wafers. Therefore, SiC so far remains the semiconductor of choice for 650-1200V applications – including for example electric cars and renewable energy.29.04.2021 06:00:00Aprnews_2021-05-15_1.jpg\images\news_2021-05-15_1.jpghttps://www.imec-int.com/en/press/imec-and-aixtron-demonstrate-200-mm-gan-epitaxy-aix-g5-c-1200v-applications-breakdown-excessimec-int.com
The 2021 VLSI SymposiaThe 2021 Symposia on VLSI Technology & Circuits ha...9236Event NewsThe 2021 VLSI SymposiaThe 2021 Symposia on VLSI Technology & Circuits have announced their technical program, which highlights the theme "VLSI Systems for Lifestyle Transformation." Due to continuing concerns over the global COVID-19 pandemic, the Symposia will be held on a worldwide accessible schedule from June 13th – 19th with a fully virtual format. Despite the difficulties of COVID-19, VLSI development continues to advance at a fast rate. The latest in innovative and life-enhancing circuits and technologies will be presented at VLSI Symposia 2021. The Symposia program provides a unique perspective on the microelectronics industry by integrating the technology ecosystem of converging industry trends – machine learning, IoT, artificial intelligence, wearable/implantable biomedical applications, big data, cloud / edge computing, virtual reality (VR) / augmented reality (AR), robotics, and autonomous vehicles – with the advanced circuit design and application platforms that will realize the future promise of "ubiquitous intelligence."27.04.2021 17:00:00Aprnews_2021-05-15_12.jpg\images\news_2021-05-15_12.jpghttp://www.vlsisymposium.org/vlsisymposium.org
Developing a 300 MWp Solar Project in SpainSpanish project developer Tartessos concludes a se...9214Industry NewsDeveloping a 300 MWp Solar Project in SpainSpanish project developer Tartessos concludes a service agreement with RP Global as the two renewable energy companies set out to develop a 300 MWp PV project together in the Castilla-León region in Spain. "RP Global is a recognised international player with over 35 years of experience in the market and a well-established team of development experts. This makes RP Global a great fit for us", says Dr. Rainer Kistner, Managing Partner of Tartessos Power Development. The land for the 300 MWp project has already been secured and  rigorous environmental impact assessments have raised no red flags. "Tartessos's experience and strong track record of project delivery convinced us that they are an ideal company for us to partner with to develop this significant project.", explains Jorge Rodriguez, RP Global's CFO and Country Manager for Spain, adding: "Identifying the right long-term local partner to develop our projects is becoming more and more important for us, as we aim to develop a 2GW pipeline of wind and solar PV in Spain by 2024." The development of further joint projects in the region are being discussed. The companies are also exploring the possibility of converting the planned 300 MWp solar park into a wind-solar hybrid project.27.04.2021 15:00:00Aprnews_2021-05-01_10.png\images\news_2021-05-01_10.pnghttp://www.tartessospower.com/tartessospower.com
APEC Industry Session Explores Rapid Growth MarketsThe Power Sources Manufacturers Association (PSMA)...9234Event NewsAPEC Industry Session Explores Rapid Growth MarketsThe Power Sources Manufacturers Association (PSMA) Marketing Committee is sponsoring an Industry Session at APEC 2021 addressing the trends within fast growing market sectors. The presentations and audio recordings will be available to APEC registrants ON DEMAND beginning on Wednesday, June 9, 2021. There will also be a live Q&A session during the week of June 14 where you will have the opportunity to interact with live speakers and follow up on any questions you have from the on-demand sessions. The Market Trends Industry Session (IS02) will feature eight presentations by industry leaders focusing on important aspects of a number of dynamic and rapidly growing market sectors. Ada Cheng and Marijana Vukicevic, Co-Chairs of the Market Trends Industry Session, commented "We are excited that the PSMA Marketing Committee is organizing this year's Market Trends Industry Session. This cohesive session features knowledgeable and respected representatives from industry who will focus on issues that impact the future growth of key industry market segments." Ada and Marijana encourage everyone to register for APEC and attend this valuable industry session and to consider participating in the other PSMA-sponsored Industry Sessions during the week.27.04.2021 15:00:00Aprnews_apec3.jpg\images\news_apec3.jpghttp://apec-conf.org/conference/sessions/industry/apec-conf.org
The smarter E Europe Restart 2021 in OctoberDue to the pandemic, The smarter E Europe and its ...9233Event NewsThe smarter E Europe Restart 2021 in OctoberDue to the pandemic, The smarter E Europe and its four concurrent energy exhibitions Intersolar Europe, ees Europe, Power2Drive Europe and EM-Power Europe will no longer take place from July 21–23, 2021. Instead, The smarter E Europe Restart 2021 will be staged at Messe München from October 6–8. The smarter E Industry Days, including the award ceremony for The smarter E AWARD, Intersolar AWARD and ees AWARD 2021, will be held online from July 21–23, 2021 when the in-person event should have taken place. Due to the pandemic, the organizers of The smarter E Europe – Solar Promotion GmbH and Freiburg Wirtschaft Touristik und Messe GmbH & Co. KG (FWTM) – have decided that the event can no longer take place in July 2021. Despite the current developments surrounding vaccinations and rapid testing in Europe and the progress expected by the end of the second quarter as well as the professional and comprehensive health and safety plan prepared by the organizers, there are no indications from policymakers at present that the event can feasibly go ahead. "We came to this decision in close coordination with the industry's international associations. We knew that everyone involved – from exhibitors, visitors and conference attendees to speakers, sponsors and ourselves as organizers – was in the process of making their final arrangements and that, in the interests of planning, we couldn't delay making a decision," explains Markus Elsässer, CEO of Solar Promotion GmbH.27.04.2021 14:00:00Aprnews_2021-05-15_9.jpeg\images\news_2021-05-15_9.jpeghttps://www.thesmartere.de/news/the-smarter-e-europe-restart-2021-in-october?ref=m5f5b217f76a8001b5153a033-s5fc4d6810046ed031f529995-t1620826612-c2035cc45thesmartere.de
Line of Regenerative Power Supplies and Electronic LoadsIn response to demand driven by the rapidly expand...9240Product ReleaseLine of Regenerative Power Supplies and Electronic LoadsIn response to demand driven by the rapidly expanding electrical vehicle market, EA Elektro-Automatik has developed a range of products for the entire spectrum of battery recycling – from battery testing/recharge to second life to final recycling. E-mobility is booming. But with increasing operating time, the lithium-ion batteries used become less effective and need to be replaced in the vehicle. The old batteries then begin a second life or are finally recycled and completely discharged. EA offers a wide ranging product line for initial battery production, recharging, second life test and final recycling. Its bidirectional power supply EA-PSB 10000 and regenerative electronic load EA-ELR 10000 provide safe and sustainable preparation of discarded batteries – with 96% regeneration efficiency. If the storage capacity of the lithium-ion battery systems is no longer sufficient for use in e-vehicles, residual capacities may well be available for second-life use as energy storage for solar power or wind energy. With the EA-PSB 10000 bidirectional power supply, the batteries are tested for their remaining capacity by charging them to almost 100% and then discharging them again. At 30kW in a 4U package, the EA-PSB 10000 bidirectional power supply offers the highest power density on the market. Up to 1.92 MW is possible in a rack system, which means that mass testing is also possible without any problems. In addition, EA-PSB 10000 can seamlessly switch between operation as source and sink, which offers additional time savings.27.04.2021 09:30:00Aprnews_2021-05-15_16.jpg\images\news_2021-05-15_16.jpghttps://elektroautomatik.com/en/latest-news/e-mobility-sustainable-battery-recycling-with-ea-elektro-automatik/elektroautomatik.com
Integrated Brand for Electronic Components BusinessKyocera Corporation and AVX Corporation announced ...9228Industry NewsIntegrated Brand for Electronic Components BusinessKyocera Corporation and AVX Corporation announced that the companies have established a new integrated brand "KYOCERA AVX" to be used for the Kyocera group's electronic components business starting in October, 2021 (or later) following the integration of Kyocera's "Corporate Electronic Components Group" and "AVX" into a new segment, "Electronic Components Business" as of April 1, 2021. The new brand structure will accelerate and strengthen the growth of Kyocera's electronic components business worldwide. In addition, sales organizations in the U.S. and Europe will unify starting in October 2021 (or later), and sales in Japan, China and other Asian nations will follow beginning in April 2022 (or later). This consolidation will enhance the global sales capabilities, and maximize synergy by combining the companies' resources of manufacture and development for further expansion of its global business. AVX, a wholly-owned subsidiary of Kyocera, is a leading global supplier of a wide range of products, including electronic components, connectors, and sensors. AVX has been working proactively on expanding its product lineup, business domains, and market shares through R&D and M&A. In its key markets, Kyocera expects demand for electronic components to accelerate due to the widespread use of IoT, 5G and Advanced Driver Assistance System, and rapid technological innovation and business opportunities are brought about by the progression of the so-called "the 4th Industrial Revolution."27.04.2021 09:00:00Aprnews_2021-05-15_4.png\images\news_2021-05-15_4.pnghttps://www.avx.com/news/kyocera-avx-to-establish-new-brand/avx.com
Ultra-fast Charging in European and North American Urban CentresJOLT and AECOM are pleased to announce an agreemen...9227Industry NewsUltra-fast Charging in European and North American Urban CentresJOLT and AECOM are pleased to announce an agreement to deploy ultra-fast charging in major European and North American urban centers. Under the agreement, JOLT will manufacture the charging stations and operate the network; while AECOM will develop and execute an international rollout plan, including program management, site development, equipment deployment, commissioning and field services. JOLT envisions deploying up to 15,000 chargers in 250 urban centers through 2025, split equally between Europe and North America.  The deployment will focus on JOLT's Merlin ultra-fast flexible charger, which can be deployed in virtually any environment. Merlin is designed and developed in Germany specifically for city charging situations, where the existing electricity grid makes the provision of DC fast-charging extremely challenging. "As we set-off on this adventure, we're thrilled to have AECOM bring its enormous level of technical expertise and experience to our mission, with an impressive record of delivering complex international projects on time," says Maurice Neligan, CEO of JOLT. The companies will collaborate to define a roadmap for the deployments, taking into account e-mobility penetration in the various urban markets, as well as the availability of sites, local commercial and municipal support.27.04.2021 08:00:00Aprnews_2021-05-15_3.jpg\images\news_2021-05-15_3.jpghttps://jolt.energy/jolt-and-aecom-to-deploy-ultra-fast-charging-in-major-european-and-north-american-urban-centres/jolt.energy
SiC Intelligent Power Modules Platform ExpandedCISSOID is adding to its growing platform of 3-Pha...9238Product ReleaseSiC Intelligent Power Modules Platform ExpandedCISSOID is adding to its growing platform of 3-Phase Silicon Carbide (SiC) MOSFET Intelligent Power Module (IPM) products by introducing liquid-cooled modules for E-mobility tailored for lower switching losses or for higher power. The company is also introducing a module based on a lightweight AlSiC flat baseplate that meets the demand for natural convection or forced cooling in aerospace and in dedicated industrial applications. These products integrate a 3-Phase SiC MOSFET module with a powerful gate driver. Two liquid-cooled power modules based on a pin fin baseplate are rated for 1200V blocking voltages and for 340A to 550A Maximum Continuous Currents. The On Resistance ranges from 2.53mOhms to 4.19mOhms depending on current rating. The total switching energies are as low as 7.48mJ (Eon) and 7.39mJ (Eoff) at 600V/300A. The co-design of the power module and the gate driver enables optimizing the IPMs for lowest switching energies by carefully tuning dV/dt and controlling voltage overshoots inherent to fast switching. The new air cooled module is designed for applications where liquid cooling is not an option, like aerospace electromechanical actuators and power converters, for example. This module is rated for a blocking voltage of 1200V and a Maximum Continuous Current of 340A. The On resistance is equal to 3.25mOms. Turn-on and turn-off switching energies are respectively 8.42mJ and 7.05mJ at 600V and 300A. The power module is cooled down through an AlSiC flat baseplate.27.04.2021 07:30:00Aprnews_2021-05-15_14.jpg\images\news_2021-05-15_14.jpghttps://www.cissoid.com/news/cissoid-expands-its-sic-intelligent-power-modules-platform.htmlcissoid.com
Funding for Transformational Energy TechnologyNoMIS Power Group announced that it was awarded 49...9260Industry NewsFunding for Transformational Energy TechnologyNoMIS Power Group announced that it was awarded 498,000 in funding from the U.S. Department of Energy's Advanced Research Projects Agency-Energy (ARPA-E). The funding will be used to develop silicon carbide (SiC) –based power modules for power electronic applications that will deliver a step-change in efficiency and reliability to support the global energy transition. "We are very excited to have ARPA-E support for NoMIS Power Group's transformative, enabling technology for the electrified economy and the global effort to tackle climate change," said co-founder Adam Morgan. NoMIS Power Group is a high-tech start-up company spun out of SUNY Polytechnic Institute (SUNY Poly) in Albany, NY, working to accelerate the clean tech revolution through the application of novel semiconductor devices and power packaging materials for the global power electronics market. Founded by SUNY Poly postdoc Adam Morgan, SUNY Poly Professors Dr. Woongje Sung and Dr. Shadi Shahedipour-Sandvik, as well as Ohio State University Professor Dr. Anant Agarwal, NoMIS Power Group brings together unique US-based expertise across the power semiconductor, power packaging, and power electronics fields. Notably, NoMIS Power Group's world-leading expertise in the application of SiC has made the company a go-to resource for R&D and manufacturing leaders seeking to leverage the transformative potential of this novel material. NoMIS Power Group received this competitive award from ARPA-E's Topics Informing New Program Area's Supporting Entrepreneurial Energy Discoveries (SEED). SEED seeks to support entrepreneurial energy discoveries, by identifying and supporting disruptive concepts in energy-related technologies within small businesses and collaborations with universities and national labs.26.04.2021 15:00:00Aprnews_2021-06-01_10.jpg\images\news_2021-06-01_10.jpghttps://www.nomispower.com/newsnomispower.com
Expanded Supercapacitor OfferingsCornell Dubilier has announced that additional cap...9219Product ReleaseExpanded Supercapacitor OfferingsCornell Dubilier has announced that additional capacitance values and cell sizes have been added to its already extensive supercapacitor platforms, the DGH 2.7 volt and DSF 3.0-volt series. The expansion comes on the heels of the recent addition of cutting-edge LiC hybrid types which offer higher operating voltages and greater energy densities. Supercapacitors (aka EDLCs or ultracapacitors) are rapidly becoming essential components for power circuit designers. They are used to supplement rechargeable batteries or as replacements for batteries in a very diverse range of applications. These components add powerful options for engineers. According to Brendan Andrews, Business Unit Manager, "Our technology is used in a wide variety of applications such as battery backup in smart meters, handheld scanners, printers, electronic valve actuators, green energy systems, and even automated material handling. The latest expansion significantly contributes to the most comprehensive product offering in the industry and further opens up additional application opportunities."  Andrews added that "Supercapacitor technology has witnessed significant price reductions over the past several years, generating mass market appeal." The company's product line now ranges from board-mountable coin cell types to radial form factors and larger snap-in types. CDE can also combine components to create higher voltage custom modules with active or passive balancing.  Most devices offer an operating temperature range of -40 °C to 85 °C and are all UL recognized.26.04.2021 10:30:00Aprnews_2021-05-01_15.jpg\images\news_2021-05-01_15.jpghttps://www.cde.com/news/2021/4/expanded-supercapacitor-offeringscde.com
Inductors Optimised for In-vehicle PoC SystemsMurata continues to support ongoing engineering pr...9249Product ReleaseInductors Optimised for In-vehicle PoC SystemsMurata continues to support ongoing engineering progression within the automotive sector with the introduction of the LQW21FT_0H series. These are inductors with broadband impedance for in-vehicle power-over-coax (PoC) circuit of SerDes-based interfacing. The LQW21FT_0H series is compliant to AEC-Q200 and delivers a combination of both broadband impedance and high-current performance. Thanks to state of the art technologies for both ceramic material and coil structure, Murata can supply these components in a space-saving size format that other manufacturers simply cannot match. They are housed in a compact 0805 inch case size, with 2mm × 1.2mm × 1.6mm dimensions. Murata's LQW21FT_0H series inductors are extremely well suited to PoC use cases. As well as their elevated broadband impedance levels, they exhibit superior saturation properties. Inductance values from 0.47 µH to 2 µH can be specified, with respective current ratings of 1 A and 0.45 A. The heightened operating temperatures that these inductors can support makes them attractive for automotive implementation (reaching up to 125°C). "To accelerate the transition towards safe, autonomous driving, the number of built-in cameras featured in vehicle models continues to increase," said Tomohiro Yao, EMI Division, General Manager of Marketing & Promotion Department, at Murata. "The popularity of PoC for in-vehicle applications is, as a result, steadily rising and enables significant reductions in cabling weight by transmitting imaging data and electrical power over one coaxial cable. Keeping the power and data signals separate from one another is of course vital to PoC implementations, and LQW21FT_0H's broad frequency characteristics help to reduce the number of inductors needed for this purpose."22.04.2021 18:30:00Aprnews_2021-05-15_25.jpg\images\news_2021-05-15_25.jpghttps://www.murata.com/en-eu/news/inductor/power/2021/0422murata.com
High-current Inductor for POL RegulatorsWith improvements in its internal design, the late...9220Product ReleaseHigh-current Inductor for POL RegulatorsWith improvements in its internal design, the latest model of WE-HCF-SMT high-current inductors from Würth Elektronik sets new standards in its class. WE-HCF in the 2010 design offers significantly better characteristics than previously available inductors in this size: inductance values up to 2 µH and saturation currents up to 25% higher than comparable products in the market. The magnetically shielded flat wire coil with MnZn core impresses with a low resistance of 0.84 mO and low core losses. The recommended 3-pin contacting ensures mechanical stability of the WE-HCF, which is designed for an operating temperature of -40 to +125 °C. Potential applications include POL regulators for FPGA, ASIC and GPU, high-efficiency DC/DC converters, high-current switching power supplies, forward converters, half-bridge and full-bridge converters, as well as battery chargers and solar inverters. WE-HCF 2010 is available immediately from stock with no minimum order quantity. Würth Elektronik will provide free samples to developers upon request.22.04.2021 11:30:00Aprnews_2021-05-01_16.jpg\images\news_2021-05-01_16.jpghttps://www.we-online.com/web/en/wuerth_elektronik/news_weg/News_Detail_WE_Gruppe_121598.phpwe-online.com
Linear Accuracy in the Basic Power Supply ClassRohde & Schwarz continues to expand its range of b...9217Product ReleaseLinear Accuracy in the Basic Power Supply ClassRohde & Schwarz continues to expand its range of basic power supplies with the R&S NGA100 series. The R&S NGA100 is available in four models, providing a choice of single and dual outputs with up to 35 V/6 A per output, or 100 V/2 A per output. Single output models supply up to 40 W, dual output models up to 80 W power. The dual model outputs can be combined to provide up to 200 V or 12 A. Rohde & Schwarz has implemented a linear design throughout the output circuits of the R&S NGA100 which significantly improves performance compared to the switched-mode circuits frequently found in basic power supplies. The resulting higher accuracy means engineers can be confident of supplying exactly the right power level without any need for an additional multimeter. The standard level of readback resolution, 1 mV/100 µA, is enhanced for currents under 200 mA to a resolution of 1 µA, ideal to test low current levels typical for IoT applications in standby and sleep mode. The R&S NGA100 also has the necessary dynamic range for power and current spikes when switched to active mode.22.04.2021 08:30:00Aprnews_2021-05-01_13.jpg\images\news_2021-05-01_13.jpghttps://www.rohde-schwarz.com/uk/about/news-press/all-news/new-r-s-nga100-brings-linear-accuracy-to-the-basic-power-supply-class-press-release-detailpage_229356-1064000.htmlrohde-schwarz.com
Reference Boards for Rotary Fridge Compressor DrivesInfineon Technologies introduces two reference boa...9223Product ReleaseReference Boards for Rotary Fridge Compressor DrivesInfineon Technologies introduces two reference boards designed for rotary refrigerator compressors supporting Infineon's motto "From product thinking to system understanding." Both boards are turnkey solutions for low power compressors that can be easily copied by customers to build final mass-production application boards. Since the design of the reference boards is system tested developers can drastically reduce their own system development time. The REF_Fridge_D11T_MOS is a ready-to-use three-phase inverter including the iMOTION Smart Driver IMD111T-6F040 and the 600 V CoolMOS PFD7 superjunction MOSFET IPN60R1K0PFD7S. The board provides an easy-to-use power stage based on the iMOTION smart driver that combines ready-to-use FOC motor control algorithms with 600 V phase gate driver in LQFP-40 package. It also includes the discrete CoolMOS superjunction MOSFET with lowest Q rr, ESD protection and a compact SOT-223 surface mounted device (SMD) package. The board can be easily interfaced through iMOTION Link and enables best light-load efficiency as well as a compact design. The reference design REF_Fridge_C101T_IM231 is ideal for customers aiming for a higher level of integration and a reduced footprint. The board combines a digital motor control IC (iMOTION) IMC101T-T038 with a three-phase CIPOS Micro intelligent power module based on an 6 A, 600 V IGBT. This combination provides a fully-featured compact inverter solution for low power motor drive applications. Furthermore, it enables BOM count and PCB size reduction and improves reliability.21.04.2021 15:30:00Aprnews_2021-05-01_20.jpg\images\news_2021-05-01_20.jpghttps://www.infineon.com/cms/en/about-infineon/press/market-news/2021/INFIPC202104-059.htmlinfineon.com
Joining for Electronics Market GrowthIndium Corporation announced today that Solder Che...9211Industry NewsJoining for Electronics Market GrowthIndium Corporation announced today that Solder Chemistry is now part of the Indium Corporation family. The joining of these two companies further expands Indium Corporation's reach in the European electronics market and creates an extended platform for Solder Chemistry's distinctive product offerings and technology. Each company will continue to offer products and solutions via its established sales and service networks. "Solder Chemistry and Indium Corporation operate with the same customer goals and benefits in mind," said Brian Craig, Managing Director of Indium Corporation's European Operations. "Both companies share a commitment to keeping our factories running efficiently through the supply of advanced materials, superior technical support, and excellent customer service." "Solder Chemistry and Indium Corporation are both committed to working side-by-side to secure our future success," said Robert Sudnik, Managing Director, Solder Chemistry. "I am eager to work directly alongside Indium Corporation in bringing this new relationship to life and taking advantage of the resources this brings to our customers and the broader electronics industry." Indium Corporation has been active in the European market for over 30 years, including facilities in Milton Keynes, UK. Indium Corporation was among one of the first soldering materials suppliers to earn the IATF-16949:2016 management system certificates at five of its manufacturing facilities that produce products for automotive applications. 20.04.2021 12:00:00Aprnews_2021-05-01_7.jpg\images\news_2021-05-01_7.jpghttps://www.indium.com/corporate/media-center/news/indium-corporation-and-solder-chemistry-align-for-electronics-market-growth/indium.com
Agreement for Software Development ServicesNorthforge Innovations announced that it has signe...9209Industry NewsAgreement for Software Development ServicesNorthforge Innovations announced that it has signed an agreement with Avnet and EBV Elektronik, an Avnet Company, to promote Northforge to Broadcom customers in North America and EMEA. Both distributors will help Northforge expand its North America and EMEA base of Broadcom customers that may require software development services for Broadcom's StrataDNX, StrataXGS, BroadPTP, BroadSync, and Broadcom PLP products. Northforge is the only Broadcom Authorized Development Collaborator (ADC) for the StrataDNX line of switch system-on-a-chip (SoC) devices. "Given our close collaboration with Broadcom and direct training from their engineering experts, our expertise and service level commitment are unparalleled. Our rapid response to issues and help with reducing design cycles plays a key role in the software development of our customers' new products," said Brenda Pastorek, President and Chief Operating Officer of Northforge Innovations. "With this agreement, we can reach more Broadcom customers who require our experience and the expertise that we have developed over the years of giving customers the high level of attention that they deserve." "By partnering with Northforge, Avnet expands our service offering to provide top-level software expertise to our Broadcom customers," said Karen Worley, Director of Supplier Business Development at Avnet. "We're proud to partner with Northforge to deliver increased value to our customers' by supporting their Broadcom software development needs."20.04.2021 10:00:00Aprnews_ebv.jpg\images\news_ebv.jpghttps://www.avnet.com/wps/wcm/connect/onesite/784af5b3-0826-4a65-95d4-f376afd6237c/Northforge+Press+Release+Avnet_EBV+Announcement.pdf?MOD=AJPERES&CVID=nzU.dv0&CVID=nzU.dv0avnet.com
Strong Digital PartnershipMitsubishi Electric Corporation and long-term e-F@...9205Industry NewsStrong Digital PartnershipMitsubishi Electric Corporation and long-term e-F@ctory solution partner Eplan are strengthening their digital solution's collaboration further as Mitsubishi Electric joins Eplan's partner network; an initiative to further facilitate the structured implementation of digital manufacturing. The Eplan Partner Network (EPN) is a framework for participants to jointly develop and market interfaces between Eplan's advanced planning software and, amongst others, field level devices and parts such as PLCs and their related simulators. The EPN partnership is based on common, binding goals, for enhancing and supporting such interfaces. This commitment both increases customer benefits and enhances quality. The integrated automation solution provided by Mitsubishi Electric and Eplan connects Electric P8 to Mitsubishi Electric's MELSOFT iQ Works, an integrated engineering software for programming and managing factory automation devices. Based on the open data format AutomationML, data such as symbolic addresses, I/O lists and process variables can be exchanged bi-directionally between both software tools. This optimizes the implementation of engineering and automation processes and paves the way towards Industry 4.0. The dataset created in Eplan forms the basis for the PLC hardware (rack) assembly and software programming in MELSOFT iQ Works. Users can exchange, later edit, and synchronize project data in any direction at all stages of the project. The data is shared throughout the whole product development process as a single source of truth to ensure its consistency. In addition, the Eplan Data Portal provides additional and necessary component data. Taken together, the integration accelerates component configuration and design planning significantly.20.04.2021 06:00:00Aprnews_2021-05-01_1.jpg\images\news_2021-05-01_1.jpghttp://www.mitsubishielectric.commitsubishielectric.com
Power Entry Module with Circuit BreakerSCHURTER's DG11 series power entry module has rece...9221Product ReleasePower Entry Module with Circuit BreakerSCHURTER's DG11 series power entry module has received CCC approval in addition to ENEC and cURus approvals, paving its entry into the China market. The compact unit, which integrates a 2-pole circuit breaker, is rated up to 10 A at 250 V. It is a power entry module with optional IP67 rated versions. The IP67 version of the DG11 is achieved with a flange gasket secured to the front panel with gasketed screws. The cover over the circuit breaker is factory mounted. The IP40 versions feature snap-in mounting for 1 to 3 mm panels; Screw mount variations with top or side flanges are screwed to the front or rear panel. The DG11 incorporates SCHURTER's TA35 circuit breaker for equipment, available with current ratings from 0.5 A to 15 A. It functions as a 2-pole switch only, or with 1- or 2-pole overcurrent protection. The rocker switch is recessed to prevent inadvertent actuation. It is available illuminated or non-illuminated in a variety of colors and markings. Power entry modules with resettable circuit protection provide an alternative to those that accept fuses with power dissipation limitations. The higher current ratings are also well suited for industrial appliances, especially motor drive appliances for protection against high inrush currents and high transient loads. The sealed version is ideal for use in appliances exposed to water or dust, such as medical and laboratory ultrasonic cleaners, overhead stirrers and shaking water baths.19.04.2021 12:30:00Aprnews_2021-05-01_17.jpg\images\news_2021-05-01_17.jpghttps://www.schurter.com/en/Homeschurter.com
Fuse Switch Disconnector for a Networked FutureMersen presents a vertical NH fuse switch disconne...9242Product ReleaseFuse Switch Disconnector for a Networked FutureMersen presents a vertical NH fuse switch disconnector as an addition to the Multivert series. The Multivert i-Xtensio offers even more user convenience and adaptability while retaining all functions of existing fuse switch disconnectors from Mersen. It is designed for an increased installation depth of 150mm, features a user-friendly mounting solution for current transformers on the back and is available in two sizes – size 2, 400A and size 3, 630A. The product is suitable for power distribution in cable distribution cabinets, transformer substations and feeder pillars in commercial and industrial systems. The Multivert i-Xtensio was designed to meet Mersen's exceptionally high safety standards: Current transformer covers on the sides achieve IP20 protection against electric shock to ensure maximum safety during installation and servicing. Cables can be connected via bolts, insert nuts or V-terminals. Safe switching under load in accordance with IEC 60947-3 is ensured. With the Multivert i-Xtensio, Mersen now has 2 available designs on the market of NH Fuse Switch Disconnectors: space-saving standard compact design and i-Xtensio design, which is compatible with all installations systems and enables the easy integration of current transformers. The NH fuse switch disconnector is ideal for future IoT solutions, since it is fully compatible to Smart Modbus monitoring modules developed by Mersen, one of the world's leading manufacturers of innovative technical solutions.19.04.2021 11:30:00Aprnews_2021-05-15_18.jpg\images\news_2021-05-15_18.jpghttps://ep-de.mersen.com/en/products/engineering/nh-fuse-switch-disconnectors-i-xtensiomersen.com
DC-DC Converter for Compact IT EquipmentABB's MicroDLynx IITM DC-DC converters help meet t...9216Product ReleaseDC-DC Converter for Compact IT EquipmentABB's MicroDLynx IITM DC-DC converters help meet the power needs of demanding, data-hungry applications, providing highly accurate voltage regulation in a compact, 232-mm2 footprint – with a power density of 167 A/in2. "When you look at the sheer computing power required in today's data-intensive applications – from cloud computing, artificial intelligence (AI) and 5G, to the Industrial Internet of Things (IIoT) and high-speed networking – every square millimeter of board space that can be utilized for processing power is precious," said Vesa Jokitulppo, senior product manager at ABB Power Conversion. The power modules provide the precision power required for equipment including high-speed switches and routers, AI processors, application-specific integrated circuits (ASICs), high-current field programmable gate array (FPGA) processors, and ARM-based processors – and it does so in a small footprint that frees up valuable space for additional computing capacity and functionality. In addition to the MicroDLynx II DC-DC converters, ABB has announced a new version of its proven Digital Power Insight software tool. The Digital Power Insight software integrates with ABB's digital products – including AC-DC and DC-DC power supplies, digital bus converters, and point-of-load/voltage regulator modules – enabling communication between the power supplies and customer end-use equipment via a PMBus interface. This allows customers to easily select the right product for their application need and to test different options, digitally.19.04.2021 07:30:00Aprnews_2021-05-01_12.jpg\images\news_2021-05-01_12.jpghttps://electrification.us.abb.com/news/abb-delivers-high-current-and-power-density-compact-it-equipment-microdlynx-iielectrification.us.abb.com
Virtual 'Capacitors in Power Electronics' WorkshopThe Power Sources Manufacturers Association (PSMA)...9213Event NewsVirtual 'Capacitors in Power Electronics' WorkshopThe Power Sources Manufacturers Association (PSMA) and the IEEE Power Electronics Society (IEEE PELS) are jointly sponsoring a 2 day virtual workshop titled, "Design Techniques for the 21st Century – Behind the Scenes, Make Sure You Choose & Use the Correct Capacitor." The workshop will be conducted virtually June 29 & 30. The 2021 Capacitor Workshop is the fourth in the series of workshops scheduled in conjunction with APEC and is being recognized as the leading event for discussing the emerging technologies and applications for capacitors required for next generation power electronics and control systems. Each year the workshop has generated a growing interest and we are using the valuable feedback from past attendees to guide us in planning this year's sessions. Since two-thirds of the passive components used in next generation power and control products are capacitors, we continue our efforts to educate and inform the industry about the latest news and developments of the Capacitor Industry. The 2021 Capacitor Workshop will highlight the evolving capacitor technologies and focus on the characteristics and considerations in the use of capacitors in rapidly evolving market applications.16.04.2021 14:00:00Aprnews_2021-05-01_9.jpg\images\news_2021-05-01_9.jpghttp://www.psma.com/technical-forums/capacitor/workshoppsma.com
Wind Industry & Green Hydrogen ForumThe special topic of this year's HUSUM Wind from 1...9212Event NewsWind Industry & Green Hydrogen ForumThe special topic of this year's HUSUM Wind from 14-17 September 2021 will be wind hydrogen, the currently most important trend topic in the wind economy and industry. A dynamically growing hydrogen economy is developing in Europe and the UK; wind energy, and especially offshore wind, is the central driver for this. The offshore sector as well as industry and politics in Germany and across Europe have recognised the potential of the production of climate-friendly hydrogen and green fuels. Matthias Zelinger, Managing Director of VDMA Power Systems and Head of the Competence Center Climate and Energy at VDMA, comments: "Climate-neutral industry needs wind energy. While today it is highly interesting for forerunners to conclude direct contracts for the supply of climate-neutral electricity, in perspective it must be a location factor to provide it in sufficient quantities." For this reason, a separate exhibition area of about 1,000 spare meters in Hall 1 is dedicated to the topic of offshore and green hydrogen. Here, domestic and foreign exhibitors from European core markets will present innovative technologies and products for the booming market. Marketing of the OFFSHORE WIND & GREEN HYDROGEN special area started in March, and 400 sqm have already been booked.16.04.2021 13:00:00Aprnews_2021-05-01_8.jpg\images\news_2021-05-01_8.jpghttps://husumwind.com/en/nicht-kategorisiert-en/wind-hydrogen-special-topic-of-husum-wind-2021/husumwind.com
Inverter Platform for Batteries Powered VehiclesSEMIKRON and Silicon Mobility, a solution provider...9206Industry NewsInverter Platform for Batteries Powered VehiclesSEMIKRON and Silicon Mobility, a solution provider of digital control for electrified powertrain, announced the availability of a 24V to 96V inverter platform for automotive battery powered vehicles and industrial off-road vehicles. The Inverter platform delivers from 10KW to 50KW and combines the SEMIKRON SKAI 3 LV inverter and Silicon Mobility OLEA inverter and electric motor control solution. SEMIKRON provides SKAI 3 LV, the power and assembly with an advanced integrated MOSFET module with connected DC-link, gate-driver, protection functions, and sensors. It comes with a complete performance power solution for 3-phase motor-drive and a ready-made power section which reduces time to market. All of this is proposed within a custom-made cover to offer an ultra-compact MOSFET inverter. The 3rd generation of the SKAI LV industrial MOSFET inverters constitutes the 7th generation of inverter technology manufactured by SEMIKRON, with more than 1.5 Million MOSFET inverters in the field. The 3rd generation is a platform concept that offers standard design versions or can be customized to meet user's needs. The converter connects easily to a custom control board for quick and easy designing, while leaving the control to the customer. "With Silicon Mobility, a technology leader in ultra-fast control schemes, a perfect match is formed for high quality, high-performance solutions for low-voltage vehicle applications," declared Karl-Heinz Gaubatz, CEO of SEMIKRON. "With this platform, we give low-voltage vehicle manufacturers access to technologies and solutions far above todays state of the art implementations, providing them the extra edge for their designs."15.04.2021 07:00:00Aprnews_2021-05-01_2.jpg\images\news_2021-05-01_2.jpghttps://www.semikron.com/about-semikron/news-press/detail/semikron-and-silicon-mobility-announce-collaboration-into-a-24v-to-96v-inverter-platform-for-batteries-powered-vehicles-up-to-50kw.htmlsemikron.com
Digital Isolator Uses Thick-Oxide Galvanic Isolation TechnologySTMicroelectronics has begun volume production of ...9222Product ReleaseDigital Isolator Uses Thick-Oxide Galvanic Isolation TechnologySTMicroelectronics has begun volume production of the STISO621 dual-channel digital isolator, launching a series of high-performance ICs for industrial applications and general optocoupler replacement. The STISO621 transfers data between two isolated domains at up to 100Mbit/s, with pulse distortion below 3ns, leveraging ST's 6kV thick-oxide galvanic-isolation technology. With two independent unidirectional channels, the device performs as a UART interface handling data in both directions. Schmitt-trigger inputs to each channel ensure high noise immunity. The supply voltages to the two mutually galvanically isolated sides of the STISO621 are independent of each other. Each has a wide voltage range, allowing level translation between 3.3V and 5.5V circuitry. Typical common-mode transient immunity (CMTI) of 65kV/µs protects the low-voltage side against high switching transients in harsh environments. The STISO621 is suited to a wide range of industrial and consumer applications in power supplies, motor drives, meters, inverters, battery monitors, appliances, fieldbus isolators, size-critical multichannel isolation adapters, and general isolation throughout industrial-automation systems. The design is tested in accordance with VDE0884-10 and UL 1577, the specifications typically applied to isolation devices for high-voltage applications.14.04.2021 14:30:00Aprnews_2021-05-01_19.jpg\images\news_2021-05-01_19.jpghttps://newsroom.st.com/media-center/press-item.html/n4351.htmlnewsroom.st.com
DC-DC Step-down Converters in a 1/16th Brick FootprintTDK Corporation announces the introduction of the ...9224Product ReleaseDC-DC Step-down Converters in a 1/16th Brick FootprintTDK Corporation announces the introduction of the 750W rated TDK-Lambda i7A series of non-isolated buck DC-DC converters, packaged in the industry-standard 1/16th brick footprint. The output voltage of these 24V nominal input step-down converters can be adjusted from 3.3V to 18V with a maximum current of 45A.14.04.2021 13:30:00Aprnews_2021-05-01_18.jpg\images\news_2021-05-01_18.jpghttps://www.emea.lambda.tdk.com/uk/news/article/16851emea.lambda.tdk.com
Power Supply with Medical CertificationMascot has further extended its Blueline portfolio...9218Product ReleasePower Supply with Medical CertificationMascot has further extended its Blueline portfolio of power supplies with the addition of the switch mode 3920 external PSU. The 3920 is medically certified in accordance with EN 60601-1 edition 3.1 (safety) and EN 60601-1-2 edition 4 (EMC) and has been designed to meet global power conversion requirements. Working with universal AC line voltages from 90V to 264V, the high-efficiency 3920 offers continuous output power up to 180W. Possible applications include medical computer systems, healthcare, laboratory and medical devices such as incubators, blood analysers, DNA equipment, ultrasound systems, diagnostics units and medication dispensers, and other applications such as communications systems and security devices. The 3920 range combines high quality and performance, with competitive pricing and compliance with the latest eco-design specifications (CoC Tier 2, DoE level VI, CEC, MEPS) adopted in the EU and North America. CE-marked and bearing global UL Certification, the range delivers a complete turnkey solution to product designers. It comes in four standard versions delivering fixed outputs of 12, 24, 36 and 48V. Other versions and customised units with special plugs and cords can be supplied on request. All units are fitted with short-circuit protection as standard.14.04.2021 09:30:00Aprnews_2021-05-01_14.jpg\images\news_2021-05-01_14.jpghttps://www.mascot.no/home/mascot.no
Speeding Adoption of Wireless Charging for SmartphonesRenesas Electronics has expanded its ongoing work ...9207Industry NewsSpeeding Adoption of Wireless Charging for SmartphonesRenesas Electronics has expanded its ongoing work with Qualcomm Technologies to include 30W wireless charging capabilities for mid-range smartphones powered by the latest Qualcomm Snapdragon 780G 5G Mobile Platform. This is the second high-power wireless charging smartphone reference design collaboration for the two companies. The first solution, designed for flagship devices, is sampling commercially now. This latest phase is a significant step that extends the global leaders' collaboration to bring highly integrated, advanced wireless power features as a standard feature in 5G smartphones from flagship to mainstream devices. Qualcomm Technologies' 5G mobile reference designs provide turnkey solutions that are intended to facilitate smartphone OEMs to quickly and cost effectively implement fast wireless charging on flagship and mid-range smartphones, with Multi-Time Programmability (MTP) and OTA updates to simplify software development and Qi certification process. The Renesas solution offers the highest integration with over 85% end-to-end system efficiency to help expand the reach of wireless power technology to an even broader set of customers and simplify the process of adding wireless charging. "We are excited to grow our collaboration with Qualcomm Technologies as part of our journey to developing leading-edge wireless charging solutions and opening up reliable wireless power access for mass adoption," said Amit Bavisi, Vice President and general manager of Renesas Wireless Power Group, Mobility Infrastructure and IoT Power Business Division.14.04.2021 08:00:00Aprnews_2021-05-01_3.jpg\images\news_2021-05-01_3.jpghttps://www.renesas.com/eu/en/about/press-room/renesas-collaborates-qualcomm-technologies-speed-mainstream-adoption-wireless-charging-smartphonesrenesas.com
Power Device Testing Solution Selected to Accelerate Development of SemiconductorsKeysight Technologies announced that Semipower Ele...9210Industry NewsPower Device Testing Solution Selected to Accelerate Development of SemiconductorsKeysight Technologies announced that Semipower Electronic Technology has selected Keysight's power device testing solutions, to accelerate and promote the development of next-generation semiconductors.  Semipower's power device testing application center, a comprehensive testing center for power device testing capabilities, has been recognized by the China National Accreditation Service for Conformity Assessment (CNAS) and International Laboratory Accreditation Cooperation (ILAC). Offering third-party testing qualification, the center is critical to promoting the development of the third-generation semiconductor industry. Leveraging Keysight's power device testing solution, the center offers a test platform for third-generation semiconductor devices to ensure performance and reliably speed market introduction. "We are pleased to work with Semipower to accelerate and promote the development of next-generation semiconductors," said Thomas Goetzl, vice president and general manager of Keysight's Automotive and Energy solutions. "Keysight is committed to innovation in the field of power semiconductor test and for we work closely with key partners to provide powerful test tools in conjunction with advances of industry critical technology waves." Semipower chose Keysight's PD1500A dynamic power device analyzer / double pulse tester to deliver repeatable, reliable measurements of wide bandgap semiconductors. The off-the-shelf measurement solution enables faster time-to-market by providing quick and reliable results, while ensuring a safe test environment.13.04.2021 11:00:00Aprnews_2021-05-01_6.jpg\images\news_2021-05-01_6.jpghttps://www.keysight.com/de/de/about/newsroom/news-releases/2021/0413-nr21044-keysight-s-power-device-testing-solution-selected-b.htmlkeysight.com
Uniting Activities at Düsseldorf HarbourOn 16th November 2020 Asahi Kasei Europe started o...9208Industry NewsUniting Activities at Düsseldorf HarbourOn 16th November 2020 Asahi Kasei Europe started office operation at its new location at Düsseldorf Harbour, Germany. In March 2021, the Asahi Kasei Europe R&D Center relocated from Dormagen to the new location. By uniting European sales, marketing and R&D activities, the Japanese technology company further enhances its business approach towards the European automotive industry. Asahi Kasei is starting a new chapter of its business expansion on the European market: On 16th November 2020, Asahi Kasei Europe GmbH and its sister company Asahi Kasei Microdevices Europe GmbH started office operation at the new "C-View Offices" at Düsseldorf Harbour, Germany. After the cornerstone laying on 7th October 2019, the construction work went smoothly and was finished on schedule. The Asahi Kasei Europe R&D Center – originally located at CHEMPARK Dormagen near Düsseldorf – relocated to the new location in March 2021. Hideki Tsutsumi, Managing Director at Asahi Kasei Europe: "This relocation marks the next important milestone of Asahi Kasei's expansion on the European market. Europe is at the forefront of an evolution in the automotive industry that is said to happen once in a century. In addition, it is the forerunner in environmental topics. Uniting sales, marketing, R&D and technical service activities at one single location will enable us to quickly address the changing demands by customers and to enhance joint projects with local partners.13.04.2021 09:00:00Aprnews_2021-05-01_4.jpg\images\news_2021-05-01_4.jpghttps://asahi-kasei.eu/akeu-relocation/asahi-kasei.eu
Automated Microchip Testingesmo group has rolled out upgrades and additional ...9215Product ReleaseAutomated Microchip Testingesmo group has rolled out upgrades and additional features for the talos 2021 system. First launched in 2019, the talos engineering handler is a reliable and easy-to-use handling system for semiconductor test applications, and is esmo's solution to the industry's need to cost-effectively test increasingly compact and complex devices within a shorter period of time. At the core of the talos engineer handler is its state-of-the-art active thermal control system (ATC), which allows manufacturers to carry out multiple test temperature cycles and achieve the highest temperature accuracy. "Our talos engineering handler provides semiconductor companies with the most stringent quality control and assurance, ensuring products are tested to specification," shared Josef Weinberger, Business Unit Manager (semicon). "A highly flexible and cost-effective test system, the talos platform helps manufacturers achieve faster time-to-yield with higher overall equipment efficiency. Furthermore, its remote control and monitoring feature also allows customers to remotely manage and conduct device handling." The talos system supports the testing of devices with any site pitch dimension, which allows semiconductor companies to use already existing production load boards and sockets seamlessly. Its tray or tube loading and unloading feature also makes it possible for manufacturers to run the talos system in a mixed media operation. As such, loading trays, tubes, and tapes can be combined with their unloading counterparts, and devices can even be sorted from one media to another, such as from tube to tray.12.04.2021 06:30:00Aprnews_2021-05-01_11.jpg\images\news_2021-05-01_11.jpghttps://esmo-group.com/en/news/news-esmo-group/news/press-release-talos/esmo-group.com
Solutions for the Thermal Management in Power ElectronicsCoolMag is a thermally conductive composite PDMS b...9199Product ReleaseSolutions for the Thermal Management in Power ElectronicsCoolMag is a thermally conductive composite PDMS based elastomeric compound of encapsulant twocomponent system, designed for Power Electronics in Automotive, especially in Electrified Vehicles with multiple functionalities:<br>• Heat Transfer, reduction of hot spots and minimising average temperature of systems.<br>• Electric Isolation<br><br>CoolMag is designed to provide thermal conductivity, electrical safety, hazard protection, mechanical and fire protection for electronic encapsulating applications.<br>• Flame and fire protection (Retardant and Extinction)<br>• Mechanical protection<br>11.04.2021 18:43:00Aprnews_2021-04-15_22.jpg\images\news_2021-04-15_22.jpghttps://coolmag.net/product/coolmag-28/coolmag.net
CWIEME Berlin 2021 CancelledCWIEME Berlin, currently scheduled for 22-24 June ...9184Event NewsCWIEME Berlin 2021 CancelledCWIEME Berlin, currently scheduled for 22-24 June of this year, will have to be cancelled. Large scale events in Germany are still prohibited by the federal and local governments and these restrictions are unlikely to be removed in time for the event to take place, with the result that cancellation is now unavoidable. We considered moving the event to later in the year. However, this was not considered realistic for a number of reasons, particularly given recent reports of COVID-19 cases rising in several countries with the result that travel restrictions are likely to remain in place for some months to come.  Due to our next CWIEME Berlin event already planned for May 2022, we have decided, following consultation with you – our community – that a full year cancellation is the best decision for all concerned. Our number one goal is to ensure a successful event for our global community, with the expected volume and quality of exhibitors and visitors to promote business and enable innovations across the supply chain. We invite you and all those involved in the coil winding, transformer, electric motor, generator and e-mobility supply chain throughout Europe and the world to join us in Berlin, 10-12 May 2022.09.04.2021 12:00:00Aprnews_2021-04-15_7.jpg\images\news_2021-04-15_7.jpghttps://berlin.coilwindingexpo.com/Page/cwieme-berlin-2021-cancelledberlin.coilwindingexpo.com
Upgrade for Precision Power AnalyzerYokogawa has launched a Current Sensor Element and...9198Product ReleaseUpgrade for Precision Power AnalyzerYokogawa has launched a Current Sensor Element and upgraded the firmware for its WT5000 Precision Power Analyzer. The enhancements are designed to help companies improve performance when developing or evaluating electronic devices such as Electric Vehicle (EV) related equipment or systems for solar and wind power installations. The Current Sensor Element runs off the internal DC power supply of the WT5000, making external power supplies unnecessary. This makes set up for measurements easier as the only things required are the current sensor and a connecting cable. Three sensor connection cable lengths are available - 3 m, 5 m and 10 m. This helps take account of varying test bench layouts, where the power analyzer may not be located right next to the device under test. The three different cable lengths allow users to select the one most suitable for their set up while keeping the leads as short as possible. "The WT5000, which is the flagship model of our power analyzer WT series, is now more convenient and capable for companies measuring power consumption and efficiency as part of their development cycle," explains Terry Marrinan, VP Global Marketing. "With the upgraded firmware, engineers can capture waveforms in more detail, allowing them to optimize their designs."08.04.2021 15:03:00Aprnews_2021-04-15_21.jpg\images\news_2021-04-15_21.jpghttps://tmi.yokogawa.com/eu/news/press-releases/2021/yokogawa-test-measurement-releases-high-accuracy-current-sensor-element-for-use-with-the-wt5000/tmi.yokogawa.com
POL Switching Regulators in Open Frame DesignThe TSR 1.5E is a 1.5 Ampere step-down switching r...9194Product ReleasePOL Switching Regulators in Open Frame DesignThe TSR 1.5E is a 1.5 Ampere step-down switching regulator series and a drop-in replacement for inefficient LM78xx linear regulators. This series comes in a compact SIP-3 open frame package and complements our existing POL portfolio with a series focusing strongly on a cost efficient design while maintaining our quality standards. There are 3 output voltages available: 3.3, 5.0 and 12VDC. The effective design allows full load operation up to +85°C ambient temperature without the need of any heat sink or forced cooling. The TSR 1.5E switching regulators provide other significant features over linear regulators, i.e. better output accuracy, lower standby current and no requirement of external capacitors. The series offers a broad application range in many environments and is especially suited for high volume projects where the series will help to reduce production cost by delivering not only a highly cost efficient but also reliable solution.08.04.2021 11:30:00Aprnews_2021-04-15_17.jpg\images\news_2021-04-15_17.jpghttps://www.tracopower.com/de/tsr-1-5e-series-1-5-amp-pol-switching-regulatorstracopower.com
MOSFETs for Static Switching ApplicationsInfineon is enhancing the 600 V CoolMOS S7 family ...9190Product ReleaseMOSFETs for Static Switching ApplicationsInfineon is enhancing the 600 V CoolMOS S7 family with two optimized devices for static switching applications: the industrial-grade CoolMOS S7 10 m? and the automotive-grade CoolMOS S7A. The CoolMOS S7 10 m? has a unique low on-resistance (R DS(on)) for 600 V superjunction MOSFETs, making it ideal for applications where minimal conduction losses are critical, such as off-the-shelf solid-state relays (SSR). In contrast, the automotive-grade CoolMOS S7A addresses system performance requirements set by solid-state circuit breakers (SSCB) and diode paralleling/replacement for high power/performance designs in automotive applications, such as the High Voltage (HV) eFUSE, HV eDisconnect battery disconnect switch, as well as on-board chargers. The product family has been developed by optimizing the renowned CoolMOS 7 technology platform. To achieve this, the device has been enhanced for static switching and high current applications. As a result, the new devices can offer the best price-performance ratio at the highest quality standards, placing even greater emphasis on conduction performance, energy efficiency, power density, and improved thermal resistance. The CoolMOS S7 10 m? and CoolMOS S7A chips come with the lowest R DS(on) in the market and best-in-class R DS(on) x A x cost. Additionally, they have been integrated into an innovative top-side cooled (TSC) QDPAK SMD package, which offers excellent thermal behavior, making it a smaller alternative to THD devices such as TO-247. Moreover, with moving from THD to a surface-mounted device with QDPAK, a 94 percent reduction of height can be achieved, enabling higher power density solutions.08.04.2021 07:30:00Aprnews_2021-04-15_13.jpg\images\news_2021-04-15_13.jpghttps://www.infineon.com/export/sites/default/media/press/Image/press_photo/2021/600_V_CoolMOS_S7.jpginfineon.com
Solutions for the Production of Compound Semiconductor DevicesOxford Instruments Plasma Technology and LayTec an...9182Industry NewsSolutions for the Production of Compound Semiconductor DevicesOxford Instruments Plasma Technology and LayTec announce an exclusive collaboration agreement to enable the next generation requirements of advanced semiconductor devices in the high-volume manufacturing (HVM) environment. The partnership aims to develop and integrate LayTec's accuracy and control with Oxford Instruments' renowned wafer processing expertise. Together, they will combine plasma process solutions with proven in-situ metrology to achieve next generation device performance and enable a repeatable HVM process to shorten customers' yield ramp. LayTec will develop the in-situ metrology while Oxford Instruments will integrate LayTec's control with its advanced wafer processing solutions to deliver an enhanced solution to the customer. Driven by market demands for efficient power conversion, the IoT and datacomms compound semiconductor devices based on materials such as GaAs/InP, SiC or GaN, are becoming increasingly used due to their superior performance. However, challenges remain to move the technology from small prototypes to wafer scale, HVM. While device dimensions are relatively large, the often-complex layer structure means that acute accuracy of processing within these layers is required to realise the required process stability and yield to drive down the cost per wafer and accelerate adoption into the target application.07.04.2021 10:00:00Aprnews_2021-04-15_5.jpg\images\news_2021-04-15_5.jpghttps://www.oxinst.com/news/oxford-instruments-join-forces-with-laytec/?sbms=plasma-technologyoxinst.com
Wolfram Harnack Appointed PresidentAs of April 1st, 2021, ROHM Semiconductor Europe a...9180PeopleWolfram Harnack Appointed PresidentAs of April 1st, 2021, ROHM Semiconductor Europe appoints Wolfram Harnack as the company's new President. The former President, Toshimitsu Suzuki, will lead the European Sales Division as General Manager from April 1st from the company's headquarters in Japan. Wolfram Harnack joined ROHM Semiconductor Europe GmbH as Managing Director in October 2020. Toshimitsu Suzuki, the new General Manager of the European Sales Division, justifies the choice of Wolfram Harnack with his long and rich experience and his comprehensive market knowledge: "With Wolfram Harnack, a strong leader will become the new President of ROHM's European Headquarters. He can build on a solid foundation when it comes to strategy, business development as well as sales and marketing against an international background." <br>"I am honored to lead a company for which I have already worked with passion and to whose further successes I will now contribute significantly," said Wolfram Harnack on the occasion of his appointment as new President. "ROHM Semiconductor offers a wide range of technologies and is a quality and innovation leader especially in the field of Silicon Carbide and Analog Power devices. The competent team helps customers to achieve their development goals by excellent application support and by providing the necessary insights. In this sense, my key aim is to further extend our customer service and accelerate growth in the automotive and industrial segments, especially in the power and analog area."07.04.2021 08:00:00Aprnews_2021-04-15_3.jpg\images\news_2021-04-15_3.jpghttps://www.rohm.com/news-detail?news-title=rohm-semiconductor-europe-appoints-wolfram-harnack-as-new-president&defaultGroupId=falserohm.com
James F. Schmidt Appointed CFOVicor Corporation announced the appointment of Jam...9186PeopleJames F. Schmidt Appointed CFOVicor Corporation announced the appointment of James F. Schmidt as Chief Financial Officer, effective June 1, 2021. Mr. Schmidt will join the Vicor Board of Directors and serve as the company's Treasurer and Secretary. He joins Vicor from Analog Devices after a 35-year career which started in a wafer fab and included leadership positions in Finance, Engineering, Operations and Sales. Mr. Schmidt has a BS in Chemical Engineering from the University of Cincinnati and an MBA from the University of North Carolina at Greensboro. Vicor CEO Patrizio Vinciarelli commented, "We are pleased to have Jim join our team ahead of further expansions in our operational footprint. Jim's eclectic background and experience make him uniquely qualified to help us achieve operational excellence, as well as gross margin and profitability levels that more fully reflect the value of our enabling power system technology".06.04.2021 14:00:00Aprnews_2021-04-15_9.jpg\images\news_2021-04-15_9.jpghttp://www.vicorpower.com/press-room/cfo-jim-schmidtvicorpower.com
Getting Ready for PCIM Digital 2021Last year's PCIM Digital Days 2020 received fairly...9204Industry NewsGetting Ready for PCIM Digital 2021Last year's PCIM Digital Days 2020 received fairly good feedback, and taking into account the current restrictions due to COVID-19 the online format of the event looks like a good decision from the organizers. This type of event provides an opportunity for a company representatives to exchange knowledge, to tell about new launches and the current situation in the business of power semiconductor devices. Last year, the two-day exhibition brought together more than 3,000 suppliers and consumers. The participants of the event were able to expand their professional knowledge, establish new contacts and hold negotiations. 74 companies participated as exhibitors at PCIM Digital Days. During PCIM Digital Days 2020, representatives of Proton-Electrotex presented its power unit BITR-150-0 52-1-V-U2, drivers for thyristors and IGBTs and a number of other new products. In 2021, participants of PCIM Digital will see the announcement of a completely new device by Proton-Electrotex, as well as and the company's existing product line. PCIM visitors will be able to communicate, hold meetings and discuss current issues with representatives of the company's engineering staff, customer technical support, sales and marketing departments. Besides, the organizers have prepared 76 conferences and 15 seminars on the most demanded and popular topics in the field of power electronics.05.04.2021 16:16:00Aprnews_2021-04-15_23.jpg\images\news_2021-04-15_23.jpghttps://en.proton-electrotex.com/news/pcim-digital-2021proton-electrotex.com
Buffer Modules for 12V, 15V and 24V Power SuppliesTDK Corporation announces the introduction of the ...9196Product ReleaseBuffer Modules for 12V, 15V and 24V Power SuppliesTDK Corporation announces the introduction of the TDK-Lambda brand ZBM20 12V, 15V and 24V 20A rated open-frame buffer modules. The ZBM20 series provides an extended 380ms hold-up time to power supplies preventing data loss during brief power interruptions or allowing equipment to safely shutdown. Applications include industrial automation, robotics, test, communication and semiconductor fabrication equipment. Energy is stored in electrolytic capacitors, replacing the need for batteries and their associated maintenance and servicing. A remote on/off function can be activated to avoid an unsafe discharge of stored energy. The charge and discharge status can be monitored locally or remotely via a DC OK relay, an LED indicator and photo-coupled signals. If a longer hold-up time is desired, modules can be connected in parallel. The 24V model has a switch that can be used to select either fixed or variable voltage buffer levels. In fixed mode, it will provide power when the input voltage drops to 22.4V, in variable mode when the input decreases by 1V. Measuring 175 x 85 x 57mm (L x W x H), the units will operate without derating in ambient temperatures of -25°C to +70°C. The five-year warranty ZBM20 has protection against both input overvoltage and overcurrent conditions, has inrush current reduction and internal fusing. Safety certification includes IEC/UL/CSA/EN 62368-1 with CE marking to the Low Voltage, EMC and RoHS Directives.01.04.2021 13:30:00Aprnews_2021-04-15_19.jpg\images\news_2021-04-15_19.jpghttps://www.us.lambda.tdk.com/news/press-releases/2021000075.htmlus.lambda.tdk.com